MAX202E–MAX213E - Maxim - Farnell Element 14 - Revenir à l'accueil
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Analog-Devices-ADC-S..> 09-Sep-2014 08:21 2.4M
Analog-Devices-ADMC2..> 09-Sep-2014 08:21 2.4M
Analog-Devices-ADMC4..> 09-Sep-2014 08:23 2.3M
Analog-Devices-AN300..> 08-Sep-2014 17:42 2.0M
Analog-Devices-ANF32..> 09-Sep-2014 08:18 2.6M
Analog-Devices-Basic..> 08-Sep-2014 17:49 1.9M
Analog-Devices-Compl..> 08-Sep-2014 17:38 2.0M
Analog-Devices-Convo..> 09-Sep-2014 08:26 2.1M
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Analog-Devices-Digit..> 08-Sep-2014 18:02 2.1M
Analog-Devices-Digit..> 08-Sep-2014 18:03 2.0M
Analog-Devices-Gloss..> 08-Sep-2014 17:36 2.0M
Analog-Devices-Intro..> 08-Sep-2014 17:39 1.9M
Analog-Devices-The-C..> 08-Sep-2014 17:41 1.9M
Analog-Devices-Visua..> 09-Sep-2014 08:18 2.5M
Analog-Devices-Wi-Fi..> 09-Sep-2014 08:23 2.3M
Electronique-Basic-o..> 08-Sep-2014 17:43 1.8M
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Farnell-50A-High-Pow..> 20-Mar-2014 17:31 2.9M
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Farnell-197.31-KB-Te..> 04-Jul-2014 10:42 3.3M
Farnell-270-Series-O..> 08-Jul-2014 18:49 2.3M
Farnell-760G-French-..> 07-Jul-2014 19:45 1.2M
Farnell-851-Series-P..> 08-Jul-2014 18:47 3.0M
Farnell-900-Series-B..> 08-Jul-2014 18:50 2.3M
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Farnell-1907-2006-PD..> 26-Mar-2014 17:56 2.7M
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Farnell-5910-PDF.htm 25-Mar-2014 08:15 3.0M
Farnell-6517b-Electr..> 29-Mar-2014 11:12 3.3M
Farnell-43031-0002-M..> 18-Jul-2014 17:03 2.5M
Farnell-A-4-Hardener..> 07-Jul-2014 19:44 1.4M
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Farnell-AD524-PDF.htm 20-Mar-2014 17:33 2.8M
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Farnell-ALF1210-PDF.htm 06-Jul-2014 10:06 4.0M
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Farnell-BA-Series-Oh..> 08-Jul-2014 18:50 2.3M
Farnell-BAV99-Fairch..> 06-Jul-2014 10:03 896K
Farnell-BC846DS-NXP-..> 13-Jun-2014 18:42 1.6M
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Farnell-BD6xxx-PDF.htm 22-Jul-2014 12:33 1.6M
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Farnell-BT151-650R-N..> 13-Jun-2014 18:40 1.7M
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Farnell-BYV29F-600-N..> 13-Jun-2014 18:42 1.6M
Farnell-BYV79E-serie..> 10-Mar-2014 16:19 1.6M
Farnell-BZX384-serie..> 23-Jun-2014 10:29 2.1M
Farnell-Battery-GBA-..> 14-Jun-2014 18:13 2.0M
Farnell-Both-the-Del..> 06-Jul-2014 10:01 948K
Farnell-C.A-6150-C.A..> 14-Jun-2014 18:24 2.5M
Farnell-C.A 8332B-C...> 01-Apr-2014 07:40 3.4M
Farnell-CC-Debugger-..> 07-Jul-2014 19:44 1.5M
Farnell-CC2530ZDK-Us..> 08-Jul-2014 18:55 2.1M
Farnell-CC2531-USB-H..> 07-Jul-2014 19:43 1.8M
Farnell-CC2560-Bluet..> 29-Mar-2014 11:14 2.8M
Farnell-CD4536B-Type..> 14-Jun-2014 18:13 2.0M
Farnell-CIRRUS-LOGIC..> 10-Mar-2014 17:20 2.1M
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Farnell-CS5532-34-BS..> 01-Apr-2014 07:39 3.5M
Farnell-Cannon-ZD-PD..> 11-Mar-2014 08:13 2.8M
Farnell-Ceramic-tran..> 14-Jun-2014 18:19 3.4M
Farnell-Circuit-Impr..> 25-Jul-2014 12:22 3.1M
Farnell-Circuit-Note..> 26-Mar-2014 18:00 2.8M
Farnell-Circuit-Note..> 26-Mar-2014 18:00 2.8M
Farnell-Cles-electro..> 21-Mar-2014 08:13 3.9M
Farnell-Clipper-Seri..> 08-Jul-2014 18:48 2.8M
Farnell-Compensating..> 09-Sep-2014 08:16 2.6M
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Farnell-Current-Tran..> 26-Mar-2014 17:59 2.7M
Farnell-DAC8143-Data..> 18-Jul-2014 16:59 1.5M
Farnell-DC-DC-Conver..> 15-Jul-2014 16:48 781K
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Farnell-DP83846A-DsP..> 18-Jul-2014 16:55 1.5M
Farnell-DS3231-DS-PD..> 18-Jul-2014 16:57 2.5M
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Farnell-Documentatio..> 14-Jun-2014 18:26 2.5M
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Farnell-Dremel-Exper..> 22-Jul-2014 12:34 1.6M
Farnell-Dual-MOSFET-..> 28-Jul-2014 17:41 2.8M
Farnell-ECO-Series-T..> 20-Mar-2014 08:14 2.5M
Farnell-EE-SPX303N-4..> 15-Jul-2014 17:06 969K
Farnell-ELMA-PDF.htm 29-Mar-2014 11:13 3.3M
Farnell-EMC1182-PDF.htm 25-Mar-2014 08:17 3.0M
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Farnell-EPCOS-Sample..> 11-Mar-2014 07:53 2.2M
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Farnell-HC49-4H-Crys..> 14-Jun-2014 18:20 3.3M
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19-0175; Rev 7; 1/15 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers EVALUATION KIT AVAILABLE General Description The MAX202E-MAX213E, MAX232E, and MAX241E are a family of RS-232 and V.28 transceivers with high ±15kV ESD HBM protection and integrated charge pump circuitry for single +5V supply operation. The various combinations of features are outlined in the Selector Guide. The drivers and receivers for all ten devices meet all EIA/TIA- 232E and CCITT V.28 specifications at data rates up to 120kbps when loaded. The MAX211E/MAX213E/MAX241E are available in 28- pin SO and SSOP packages. The MAX202E/MAX232E come in 16-pin TSSOP, narrow SO, wide SO, and DIP packages. The MAX203E comes in a 20-pin DIP/SO package, and needs no external charge-pump capacitors. The MAX205E comes in a 24-pin wide DIP package, and also eliminates external charge-pump capacitors. Applications • Battery-Powered Equipment • Hand-Held Equipment • Portable Diagnostics Equipment Benefits and Features • Saves Board Space • Integrated High ±15kV HBM ESD Protection • Integrated Charge Pump Circuitry Eliminates the Need for a Bipolar ±12V Supply Enables Single Supply Operation From +5V Supply • Integrated 0.1µF Capacitors (MAX203E, MAX205E) • 24 pin SSOP Package Saves up to 40% Versus SO Package • Saves Power for Reduced Power Requirements • 1µA Shutdown Mode • 15µA Shutdown Mode for MAX213E Pin Configurations and Typical Operating Circuits appear at end of data sheet. Yes PART NO. OF RS-232 DRIVERS NO. OF RS-232 RECEIVERS RECEIVERS ACTIVE IN SHUTDOWN NO. OF EXTERNAL CAPACITORS (µF) LOW-POWER SHUTDOWN TTL TRISTATE MAX202E 2 2 0 4 (0.1) No No MAX203E 2 2 0 None No No MAX205E 5 5 0 None Yes Yes MAX206E 4 3 0 4 (0.1) Yes Yes MAX207E 5 3 0 4 (0.1) No No MAX208E 4 4 0 4 (0.1) No No MAX211E 4 5 0 4 (0.1) Yes Yes MAX213E 4 5 2 4 (0.1) Yes Yes MAX232E 2 2 0 4 (1) No No MAX241E 4 5 0 4 (1) Yes AutoShutdown and UCSP are trademarks of Maxim Integrated Products, Inc. Ordering Information MAX202ECSE 0°C to +70°C 16 Narrow SO MAX202ECPE 0°C to +70°C PART TEMP RANGE PIN-PACKAGE 16 Plastic DIP Ordering Information continued at end of data sheet. www.maximintegrated.com Maxim Integrated | 2 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Absolute Maximum Ratings VCC..........................................................................-0.3V to +6V V+................................................................(VCC - 0.3V) to +14V V- ............................................................................-14V to +0.3V Input Voltages T_IN ............................................................-0.3V to (V+ + 0.3V) R_IN ...................................................................................±30V Output Voltages T_OUT.................................................(V- - 0.3V) to (V+ + 0.3V) R_OUT......................................................-0.3V to (VCC + 0.3V) Short-Circuit Duration, T_OUT....................................Continuous Continuous Power Dissipation (TA = +70°C) 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C) .....696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C) ......762mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C) ...........755mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...889mW 20-Pin SO (derate 10.00mW/°C above +70°C).............800mW 24-Pin Narrow Plastic DIP (derate 13.33mW/°C above +70°C) ...............................1.07W 24-Pin Wide Plastic DIP (derate 14.29mW/°C above +70°C)................................1.14W 24-Pin SO (derate 11.76mW/°C above +70°C).............941mW 24-Pin SSOP (derate 8.00mW/°C above +70°C) ..........640mW 28-Pin SO (derate 12.50mW/°C above +70°C)....................1W 28-Pin SSOP (derate 9.52mW/°C above +70°C) ..........762mW Operating Temperature Ranges MAX2_ _EC_ _ .....................................................0°C to +70°C MAX2_ _EE_ _...................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +165°C Lead Temperature (soldering, 10s) .................................+300°C Electrical Characteristics (VCC = +5V ±10% for MAX202E/206E/208E/211E/213E/232E/241E; VCC = +5V ±5% for MAX203E/205E/207E; C1–C4 = 0.1µF for MAX202E/206E/207E/208E/211E/213E; C1–C4 = 1µF for MAX232E/241E; TA = TMIN to TMAX; unless otherwise noted. Typical values are at TA = +25°C.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Output-Voltage High VOH R_OUT; IOUT = -1.0mA 3.5 VCC - 0.4 V EN = VCC, EN = 0V, 0V ≤ ROUT ≤ VCC, MAX205E–208E/211E/213E/241E outputs disabled Output Leakage Current ±0.05 ±10 µA R_OUT; IOUT = 3.2mA (MAX202E/203E/232E) or IOUT = 1.6mA (MAX205E/208E/211E/213E/241E) Output-Voltage Low VOL 0.4 V T_IN; EN, SHDN (MAX213E) or EN, SHDN (MAX205E–208E/211E/241E) Input Threshold Low VIL 0.8 V 8 15 Input Pullup Current T_IN = 0V (MAX205E–208E/211E/213E/241E) 15 200 µA PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS VCC Supply Current ICC mA 11 20 No load, TA = +25°C 14 20 5 10 MAX211E/213E MAX232E MAX241E 7 15 MAX205E–208E EN, SHDN (MAX213E) or EN, SHDN (MAX205E–208E/211E/241E) 2.4 T_IN V 2.0 Input Threshold High VIH MAX205E/206E 1 10 MAX211E/241E 1 10 Input Leakage Current T_IN = 0V to VCC (MAX202E/203E/232E) ±10 µA MAX202E/203E MAX213E 15 50 DC CHARACTERISTICS LOGIC Shutdown Supply Current TA = +25°C, Figure 1 µA www.maximintegrated.com Maxim Integrated | 3 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Electrical Characteristics (continued) (VCC = +5V ±10% for MAX202E/206E/208E/211E/213E/232E/241E; VCC = +5V ±5% for MAX203E/205E/207E; C1–C4 = 0.1µF for MAX202E/206E/207E/208E/211E/213E; C1–C4 = 1µF for MAX232E/241E; TA = TMIN to TMAX; unless otherwise noted. Typical values are at TA = +25°C.) Note 1: MAX211EE_ _ and MAX213EE_ _ tested with VCC = +5V ±5%. MAX205E/206E/211E/213E/241E normal operation, Figure 2 MAX205E/206E/211E/213E/241E normal operation, Figure 2 CL = 150pF RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF, one transmitter switching All drivers loaded with 3kΩ to ground (Note 1) TA = +25°C, VCC = 5V VCC = 5V, no hysteresis in shutdown TA = +25°C, VCC = 5V TA = +25°C, VCC = 5V VCC = V+ = V- = 0V, VOUT = ±2V CONDITIONS Receiver Output Disable Time 200 ns Receiver Output Enable Time 600 ns µs 4 40 tPLHR, tPHLR Receiver Propagation Delay 0.5 10 Maximum Data Rate 120 kbps Output Short-Circuit Current ±10 ±60 mA Output Resistance 300 Ω Input Voltage Range -30 30 V Output Voltage Swing ±5 ±9 V Input Resistance 357 kΩ Input Hysteresis 0.2 0.5 1.0 V Input Threshold Low V 1.7 2.4 V 1.5 2.4 Input Threshold High PARAMETER SYMBOL MIN TYP MAX UNITS All parts, normal operation All parts, normal operation MAX213E (R4, R5), SHDN = 0V, EN = VCC RL = 3kΩ, CL = 2500pF, all transmitters loaded 2 µs tPLHT, tPHLT Transmitter Propagation Delay TA = +25°C, VCC = 5V, RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF, measured from -3V to +3V or +3V to -3V, Figure 3 Transition-Region Slew Rate 3 6 30 V/µs Human Body Model ±15 IEC1000-4-2, Air-Gap Discharge kV ±15 ESD-Protection Voltage IEC1000-4-2, Contact Discharge ±8 All parts, normal operation MAX213E (R4, R5), SHDN = 0V, EN = VCC 0.8 1.2 ESD PERFORMANCE: TRANSMITTER OUTPUTS, RECEIVER INPUTS TIMING CHARACTERISTICS EIA/TIA-232E TRANSMITTER OUTPUTS EIA/TIA-232E RECEIVER INPUTS MAX213E, SHDN = 0V, EN = VCC 0.6 1.5 Note 1: MAX211EE_ _ tested with VCC = +5V ±5%. www.maximintegrated.com Maxim Integrated | 4 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Typical Operating Characteristics 5.0 0 MAX232E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX202E-TOC1 LOAD CAPACITANCE (pF) VOH, -VOL (V) 5.5 6.0 6.5 7.0 7.5 8.0 1000 2000 3000 4000 5000 VCC = 5.5V ALL TRANSMITTERS LOADED DATA RATE = 120kbps RL = 3kΩ VCC = 4.5V VCC = 5.0V 5.0 0 MAX202E/MAX203E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX202E-TOC2 LOAD CAPACITANCE (pF) VOH, -VOL (V) 5.5 6.0 6.5 7.0 7.5 8.0 1000 2000 3000 4000 5000 VCC = 5.5V VCC = 4.5V VCC = 5.0V ALL TRANSMITTERS LOADED DATA RATE = 120kbps RL = 3kΩ 5.0 0 MAX241E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX202E-TOC3 LOAD CAPACITANCE (pF) VOH, -VOL (V) 5.5 6.0 6.5 7.0 7.5 8.0 1000 2000 3000 4000 5000 VCC = 4.5V VCC = 5.5V VCC = 5.0V ALL TRANSMITTERS LOADED DATA RATE = 120kbps RL = 3kΩ 5.0 0 MAX211E/MAX213E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX202E-TOC4 LOAD CAPACITANCE (pF) VOH, -VOL (V) 5.5 6.0 6.5 7.0 7.5 8.0 1000 2000 3000 4000 5000 VCC = 4.5V VCC = 5.5V VCC = 5.0V ALL TRANSMITTERS LOADED DATA RATE = 120kbps RL = 3kΩ 0 0 MAX211E/MAX213E/MAX241E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE MAX202E-TOC5 LOAD CAPACITANCE (pF) SLEW RATE ( V/μs) 5 10 15 20 25 30 1000 2000 3000 4000 5000 +SLEW RATE -SLEW RATE ALL TRANSMITTERS LOADED DATA RATE = 120kbps RL = 3kΩ www.maximintegrated.com Maxim Integrated | 5 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Typical Operating Characteristics (continued) 2 0 MAX202E/MAX203E/MAX232E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE MAX202E-TOC6 LOAD CAPACITANCE (pF) SLEW RATE ( V/μs) 4 6 8 10 12 14 1000 2000 3000 4000 5000 +SLEW RATE -SLEW RATE ALL TRANSMITTERS LOADED DATA RATE = 120kbps RL = 3kΩ 5.0 7.5 -7.5 0 3000 MAX205E–MAX208E TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE -5.0 2.5 MAX202E TOC-07 LOAD CAPACITANCE (pF) OUTPUT VOLTAGE (V) 1000 2000 4000 5000 0 -2.5 VCC = +4.5V, RL = 3kΩ 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/8 DATA RATE 240kbps 240kbps 120kbps 120kbps 20kbps 20kbps 45 50 20 0 3000 MAX205E–MAX208E SUPPLY CURRENT vs. LOAD CAPACITANCE 25 40 MAX202E TOC-09 LOAD CAPACITANCE (pF) SUPPLY CURRENT (mA) 1000 2000 4000 5000 35 30 VCC = +4.5V, RL = 3kΩ 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/8 DATA RATE 240kbps 120kbps 20kbps 10 12 0 0 3000 MAX205E–MAX208E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE 2 8 MAX202E TOC-08 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 1000 2000 4000 5000 6 4 20 18 16 14 VCC = +4.5V, RL = 3kΩ 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/8 DATA RATE FALL RISE 2.5 5.0 -10.0 0 180 MAX205E–MAX208E OUTPUT VOLTAGE vs. DATA RATE -7.5 0 MAX202E TOC-10 DATA RATE (kbps) OUTPUT VOLTAGE (V) 30 90 210 60 120 240 150 -2.5 -5.0 10.0 7.5 VCC = +4.5V, RL = 3kΩ 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/8 DATA RATE V+ V- VOUT+ VOUT- www.maximintegrated.com Maxim Integrated | 6 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers MAX203E MAX205E Pin Descriptions MAX202E/MAX232E 15 10, 11 9, 12 8, 13 19 Ground 13, 14 RS-232 Driver Inputs 7, 14 6 4, 5 12, 15 RS-232 Receiver Outputs 10, 17 RS-232 Receiver Inputs 9, 18 RS-232 Driver Outputs 8 -2VCC Voltage Generated by the Charge Pump 2 1, 3 5, 7 Terminals for Negative Charge-Pump Capacitor 3 +2VCC Voltage Generated by the Charge Pump +4.5V to +5.5V Supply-Voltage Input 2, 4 Terminals for Positive Charge-Pump Capacitor 16 20 GND T_IN R_OUT R_IN T_OUT V- C2+, C2- V+ C1+, C1- VCC __ 1, 6, 11, 16 N.C. No Connection—Not Internally Connected NAME FUNCTION PIN DIP/SO/TSSOP LCC 11, 15 12, 15 C2+ Connect pins together. NAME 14 8 V+ +2VCC Voltage Generated by the Charge Pump SO C1- T_IN R_OUT R_IN T_OUT GND VCC C1+ C2- V- 13 FUNCTION 14 1, 2 RS-232 Driver Inputs Make no connection to this pin. 3, 20 RS-232 Receiver Outputs 4, 19 RS-232 Receiver Inputs 1, 2 3, 20 5, 18 RS-232 Transmitter Outputs 6, 9 Ground 7 +4.5V to +5.5V Supply-Voltage Input 13 Make no connection to this pin. 4,19 5,18 6, 9 11, 16 Connect pins together. 10, 17 -2VCC Voltage Generated by the Charge Pump. Connect pins together. 7 8 10, 16 12, 17 DIP PIN NAME FUNCTION T_OUT RS-232 Driver Outputs R_IN RS-232 Receiver Inputs R_OUT TTL/CMOS Receiver Outputs. All receivers are inactive in shutdown. PIN 1–4, 19 5, 10, 13, 18, 24 T_IN TTL/CMOS Driver Inputs. Internal pullups to VCC. GND Ground VCC +4.75V to +5.25V Supply Voltage EN Receiver Enable—Active Low 6, 9, 14, 17, 23 7, 8, 15, 16, 22 11 12 20 21 SHDN Shutdown Control—Active High www.maximintegrated.com Maxim Integrated | 7 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers MAX208E Pin Descriptions (continued) MAX206E MAX207E V+ NAME FUNCTION +2VCC Generated by the Charge Pump T_OUT RS-232 Driver Outputs 11 R_IN RS-232 Receiver Inputs R_OUT TTL/CMOS Receiver Outputs. All receivers are inactive in shutdown. PIN 1, 2, 3, 24 4, 16, 23 T_IN TTL/CMOS Driver Inputs. Internal pullups to VCC. GND Ground VCC +4.5V to +5.5V Supply Voltage C1+, C1- Terminals for Positive Charge-Pump Capacitor 5, 17, 22 6, 7, 18, 19 8 9 10, 12 20 EN Receiver Enable—Active Low C2+, C2- Terminals for Negative Charge-Pump Capacitor V- -2VCC Generated by the Charge Pump 13, 14 15 21 SHDN Shutdown Control—Active High V+ NAME FUNCTION +2VCC Generated by the Charge Pump T_OUT RS-232 Driver Outputs 11 R_IN RS-232 Receiver Inputs R_OUT TTL/CMOS Receiver Outputs. All receivers are inactive in shutdown. PIN 1, 2, 3, 20, 24 4, 16, 23 T_IN TTL/CMOS Driver Inputs. Internal pullups to VCC. GND Ground C2+, C2- VCC +4.75V to +5.25V Supply Voltage Terminals for Negative Charge-Pump Capacitor C1+, C1- Terminals for Positive Charge-Pump Capacitor 5, 17, 22 6, 7, 18, 19, 21 8 V- -2VCC Generated by the Charge Pump 13, 14 15 9 10, 12 V+ NAME FUNCTION +2VCC Generated by the Charge Pump T_OUT RS-232 Driver Outputs 11 R_IN RS-232 Receiver Inputs R_OUT TTL/CMOS Receiver Outputs. All receivers are inactive in shutdown. PIN 1, 2, 20, 24 3, 7, 16, 23 T_IN TTL/CMOS Driver Inputs. Internal pullups to VCC. GND Ground C2+, C2- VCC +4.5V to +5.5V Supply Voltage Terminals for Negative Charge-Pump Capacitor C1+, C1- Terminals for Positive Charge-Pump Capacitor 4, 6, 17, 22 5, 18, 19, 21 8 V- -2VCC Generated by the Charge Pump 13, 14 15 9 10, 12 www.maximintegrated.com Maxim Integrated | 8 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers V+ GND MAX206E MAX211E MAX213E MAX241E 0.1μF* VCC 0.1μF* R1 TO R5 T1 TO T5 0.1μF* C1+ C1- C2+ C2- VCC +5.5V T_OUT R_OUT 400kΩ 5kΩ ISHDN 0V OR +5.5V DRIVE 0.1μF* 0.1μF* 3kΩ +5.5V R_IN T_IN CAPACITORS MAY BE POLARIZED OR UNPOLARIZED ( ) ARE FOR MAX213E * 1μF FOR MAX241E EN (EN) +5.5V (0V) SHDN (SHDN) V- +5.5V Figure 1. Shutdown-Current Test Circuit (MAX206E, MAX211E/MAX213E/MAX241E) +3.5V EN INPUT OUTPUT ENABLE TIME +2.5V RECEIVER OUTPUT CL = 150pF RECEIVER OUTPUTS OUTPUT DISABLE TIME V VOH - 0.1V OH VOL VOL + 0.1V RL = 1kΩ NOTE: POLARITY OF EN IS REVERSED FOR THE MAX213E +0.8V 0V +3V +3V EN INPUT 0V Figure 2. Receiver Output Enable and Disable Timing (MAX205E/MAX206E/MAX211E/MAX213E/MAX241E) 17 NAME FUNCTION V- T_OUT RS-232 Driver Outputs -2VCC Voltage Generated by the Charge Pump R_IN RS-232 Receiver Inputs 24 R_OUT TTL/CMOS Receiver Outputs. For the MAX213E, receivers R4 and R5 are active in shutdown mode when EN = 1. For the MAX211E and MAX241E, all receivers are inactive in shutdown. PIN 1, 2, 3, 28 4, 9, 18, 23, 27 EN T_IN TTL/CMOS Driver Inputs. Only the MAX211E, MAX213E, and MAX241E have internal pullups to VCC. Receiver Enable—Active High (MAX213E) GND Ground 25 VCC +4.5V to +5.5V Supply Voltage SHDN C1+, C1- Terminals for Positive Charge-Pump Capacitor 5, 8, 19, 22, 26 6, 7, 20, 21 10 Shutdown Control—Active Low (MAX213E) V+ +2VCC Voltage Generated by the Charge Pump C2+, C2- Terminals for Negative Charge-Pump Capacitor 11 12, 14 13 15, 16 EN Receiver Enable—Active Low (MAX211E, MAX241E) SHDN Shutdown Control—Active High (MAX211E, MAX241E) Pin Descriptions (continued) MAX211E/MAX213E/MAX241E www.maximintegrated.com Maxim Integrated | 9 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers V+ MAX2_ _E 0.1μF* VCC 0.1μF* T_ R_ 0.1μF* C1+ C1- C2+ C2- VCC T_OUT R_OUT EN (EN) SHDN (SHDN) 400kΩ 5kΩ 0.1μF* 0.1μF* 3kΩ +5V R_IN T_IN MINIMUM SLEW-RATE TEST CIRCUIT 0V (+5V) 0V (+5V) 2500pF V- V+ 0.1μF* VCC 0.1μF* R_ T_ 0.1μF* C1+ C1- C2+ C2- VCC T_OUT R_OUT EN (EN) SHDN (SHDN) 400kΩ 5kΩ 0.1μF* 0.1μF* 7kΩ +5V R_IN T_IN MAXIMUM SLEW-RATE TEST CIRCUIT 0V (+5V) 0V (+5V) 50pF V- ( ) ARE FOR MAX213E * 1μF FOR MAX232E/MAX241E MAX2_ _E TRANSMITTER INPUT PULL-UP RESISTORS, ENABLE, AND SHUTDOWN ARE NOT PROVIDED ON THE MAX202E, MAX203E, AND MAX232E. ENABLE AND SHUTDOWN ARE NOT PROVIDED ON THE MAX207E AND MAX208E. Figure 3. Transition Slew-Rate Circuit Detailed Description The MAX202E–MAX213E, MAX232E/MAX241E consist of three sections: charge-pump voltage converters, drivers (transmitters), and receivers. These E versions provide extra protection against ESD. They survive ±15kV discharges to the RS-232 inputs and outputs, tested using the Human Body Model. When tested according to IEC1000-4-2, they survive ±8kV contactdischarges and ±15kV air-gap discharges. The rugged E versions are intended for use in harsh environments or applications where the RS-232 connection is frequently changed (such as notebook computers). The standard (non-“E”) MAX202, MAX203, MAX205– MAX208, MAX211, MAX213, MAX232, and MAX241 are recommended for applications where cost is critical. +5V to ±10V Dual Charge-Pump Voltage Converter The +5V to ±10V conversion is performed by dual charge-pump voltage converters (Figure 4). The first charge-pump converter uses capacitor C1 to double the +5V into +10V, storing the +10V on the output filter capacitor, C3. The second uses C2 to invert the +10V into -10V, storing the -10V on the V- output filter capacitor, C4. In shutdown mode, V+ is internally connected to VCC by a 1kΩ pull-down resistor, and V- is internally connected to ground by a 1kΩ pull up resistor. RS-232 Drivers With VCC = 5V, the typical driver output voltage swing is ±8V when loaded with a nominal 5kΩ RS-232 receiver. The output swing is guaranteed to meet EIA/TIA- 232E and V.28 specifications that call for ±5V minimum output levels under worst-case conditions. These include a 3kΩ load, minimum VCC, and maximum operating temperature. The open-circuit output voltage swings from (V+ - 0.6V) to V-. Input thresholds are CMOS/TTL compatible. The unused drivers’ inputs on the MAX205E–MAX208E, MAX211E, MAX213E, and MAX241E can be left unconnected because 400kΩ pull up resistors to VCC are included on-chip. Since all drivers invert, the pull up resistors force the unused drivers’ outputs low. The MAX202E, MAX203E, and MAX232E do not have pull up resistors on the transmitter inputs. www.maximintegrated.com Maxim Integrated | 10 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers When in low-power shutdown mode, the MAX205E/ MAX206E/MAX211E/MAX213E/MAX241E driver outputs are turned off and draw only leakage currents—even if they are back-driven with voltages between 0V and 12V. Below -0.5V in shutdown, the transmitter output is diode-clamped to ground with a 1kΩ series impedance. RS-232 Receivers The receivers convert the RS-232 signals to CMOS-logic output levels. The guaranteed 0.8V and 2.4V receiver input thresholds are significantly tighter than the ±3V thresholds required by the EIA/TIA-232E specification. This allows the receiver inputs to respond to TTL/CMOSlogic levels, as well as RS-232 levels. The guaranteed 0.8V input low threshold ensures that receivers shorted to ground have a logic 1 output. The 5kΩ input resistance to ground ensures that a receiver with its input left open will also have a logic 1 output. Receiver inputs have approximately 0.5V hysteresis. This provides clean output transitions, even with slow rise/fall-time signals with moderate amounts of noise and ringing. In shutdown, the MAX213E’s R4 and R5 receivers have no hysteresis. Shutdown and Enable Control (MAX205E/MAX206E/MAX211E/ MAX213E/MAX241E) In shutdown mode, the charge pumps are turned off, V+ is pulled down to VCC, V- is pulled to ground, and the transmitter outputs are disabled. This reduces supply current typically to 1µA (15µA for the MAX213E). The time required to exit shutdown is under 1ms, as shown in Figure 5. Receivers All MAX213E receivers, except R4 and R5, are put into a high-impedance state in shutdown mode (see Tables 1a and 1b). The MAX213E’s R4 and R5 receivers still function in shutdown mode. These two awake-in-shutdown receivers can monitor external activity while maintaining minimal power consumption. The enable control is used to put the receiver outputs into a high-impedance state, to allow wire-OR connection of two EIA/TIA-232E ports (or ports of different types) at the UART. It has no effect on the RS-232 drivers or the charge pumps. Note: The enable control pin is active low for the MAX211E/MAX241E (EN), but is active high for the MAX213E (EN). The shutdown control pin is active high C1- IL- RLV+ S1 V - fCLK S2 S5 S6 C1 C3 C2 IL + RL + S3 S4 S7 S8 C4 C1+ GND GND VCC VCC C2- C2+ PART fCLK (kHz) MAX202E MAX211E/213E MAX232E MAX203E 230 MAX205E–208E 200 200 140 MAX241E 30 230 Figure 4. Charge-Pump Diagram www.maximintegrated.com Maxim Integrated | 11 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers V+ V- 200μs/div 3V 0V 10V 5V 0V -5V -10V SHDN MAX211E Figure 5. MAX211E V+ and V- when Exiting Shutdown (0.1µF capacitors) X = Don't care. *Active = active with reduced performance SHDN EN OPERATION STATUS Tx Rx 0 0 Normal Operation All Active All Active 0 1 Normal Operation All Active All High-Z 1 X Shutdown All High-Z All High-Z Table 1a. MAX205E/MAX206E/MAX211E/ MAX241E Control Pin Configurations Table 1b. MAX213E Control Pin Configurations for the MAX205E/MAX206E/MAX211E/MAX241E (SHDN), but is active low for the MAX213E (SHDN). The MAX213E’s receiver propagation delay is typically 0.5µs in normal operation. In shutdown mode, propagation delay increases to 4µs for both rising and falling transitions. The MAX213E’s receiver inputs have approximately 0.5V hysteresis, except in shutdown, when receivers R4 and R5 have no hysteresis. When entering shutdown with receivers active, R4 and R5 are not valid until 80µs after SHDN is driven low. When coming out of shutdown, all receiver outputs are invalid until the charge pumps reach nominal voltage levels (less than 2ms when using 0.1µF capacitors). ±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs have extra protection against static electricity. Maxim’s engineers developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup. ESD protection can be tested in various ways; the transmitter outputs and receiver inputs of this product family are characterized for protection to the following limits: 1) ±15kV using the Human Body Model 2) ±8kV using the contact-discharge method specified in IEC1000-4-2 3) ±15kV using IEC1000-4-2’s air-gap method. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test set-up, test methodology, and test results. Human Body Model Figure 6a shows the Human Body Model, and Figure 6b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interSHDN EN OPERATION STATUS Tx 1–4 0 0 Shutdown All High-Z 0 1 Shutdown All High-Z 1 0 Normal Operation 1 1 Normal Operation All Active All Active Active 1–3 4, 5 High-Z Active High-Z High-Z High-Z Active* High-Z Rx www.maximintegrated.com Maxim Integrated | 12 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers est, which is then discharged into the test device through a 1.5kΩ resistor. IEC1000-4-2 The IEC1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAX202E/MAX203E–MAX213E, MAX232E/MAX241E help you design equipment that meets level 4 (the highest level) of IEC1000-4-2, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IEC1000-4-2 is higher peak current in IEC1000-4-2, because series resistance is lower in the IEC1000-4-2 model. Hence, the ESD withstand voltage measured to IEC1000-4-2 is generally lower than that measured using the Human Body Model. Figure 7b shows the current waveform for the 8kV IEC1000-4-2 level-four ESD contact-discharge test. The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protection during manufacturing, not just RS-232 inputs and CHARGE-CURRENTLIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 150pF RC 50MΩ to 100MΩ RD 330Ω HIGHVOLTAGE DC SOURCE DEVICE UNDER TEST Figure 7a. IEC1000-4-2 ESD Test Model tr = 0.7ns to 1ns 30ns 60ns t 100% 90% 10% IPEAK I Figure 7b. IEC1000-4-2 ESD Generator Current Waveform CHARGE-CURRENTLIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 100pF RC 1MΩ RD 1500Ω HIGHVOLTAGE DC SOURCE DEVICE UNDER TEST Figure 6a. Human Body ESD Test Model IP 100% 90% 36.8% tRL TIME tDL CURRENT WAVEFORM PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) Ir 10% 0 0 AMPERES Figure 6b. Human Body Model Current Waveform www.maximintegrated.com Maxim Integrated | 13 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports. Applications Information Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation. The MAX202E, MAX206–MAX208E, MAX211E, and MAX213E require 0.1µF capacitors, and the MAX232E and MAX241E require 1µF capacitors, although in all cases capacitors up to 10µF can be used without harm. Ceramic, aluminum-electrolytic, or tantalum capacitors are suggested for the 1µF capacitors, and ceramic dielectrics are suggested for the 0.1µF capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2x) nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V-. Use larger capacitors (up to 10µF) to reduce the output impedance at V+ and V-. This can be useful when “stealing” power from V+ or from V-. The MAX203E and MAX205E have internal charge-pump capacitors. Bypass VCC to ground with at least 0.1µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1–C4). V+ and V- as Power Supplies A small amount of power can be drawn from V+ and V-, although this will reduce both driver output swing and noise margins. Increasing the value of the charge-pump capacitors (up to 10µF) helps maintain performance when power is drawn from V+ or V-. Driving Multiple Receivers Each transmitter is designed to drive a single receiver. Transmitters can be paralleled to drive multiple receivers. Driver Outputs when Exiting Shutdown The driver outputs display no ringing or undesirable transients as they come out of shutdown. High Data Rates These transceivers maintain the RS-232 ±5.0V minimum driver output voltages at data rates of over 120kbps. For data rates above 120kbps, refer to the Transmitter Output Voltage vs. Load Capacitance graphs in the Typical Operating Characteristics. Communication at these high rates is easier if the capacitive loads on the transmitters are small; i.e., short cables are best. Table 2. Summary of EIA/TIA-232E, V.28 Specifications PARAMETER CONDITIONS EIA/TIA-232E, V.28 SPECIFICATIONS 0 Level 3kΩ to 7kΩ load +5V to +15V Data Rate 3kΩ ≤ RL ≤ 7kΩ, CL ≤ 2500pF Up to 20kbps +3V to +15V Instantaneous Slew Rate, Max 3kΩ ≤ RL ≤ 7kΩ, CL ≤ 2500pF 30V/µs Driver Output Short-Circuit Current, Max 100mA Transition Rate on Driver Output V.28 1ms or 3% of the period Driver Output Resistance -2V < VOUT < +2V 300Ω EIA/TIA-232E 4% of the period Driver Output Level, Max No load ±25V Driver Output Voltage 3kΩ to 7kΩ load -5V to -15V 0 Level 1 Level 1 Level Receiver Input Level ±25V Receiver Input Voltage -3V to -15V www.maximintegrated.com Maxim Integrated | 14 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) TOP VIEW 1 4 5 TTL/CMOS INPUTS TTL/CMOS OUTPUTS 11 10 12 9 3 GND C1- C2+ 5kΩ 5kΩ C2- T1IN T2IN R2OUT R1OUT VCC +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 16 2 6 14 7 13 8 0.1μF 0.1μF* 16V 0.1μF* 6.3V 0.1μF* 16V 0.1μF* 6.3V C1+ RS-232 OUTPUTS RS-232 INPUTS -10V +10V V+ +5V INPUT V- T1OUT R1IN R2IN T2OUT T1 15 T2 R1 R2 PIN NUMBERS ON TYPICAL OPERATING CIRCUIT REFER TO DIP/SO/TSSOP PACKAGE, NOT LCC. * 1.0μF CAPACITORS, MAX232E ONLY. 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 VCC GND T1OUT C2+ R1IN C1- V+ C1+ MAX202E MAX232E R1OUT T1IN T2IN R2IN R2OUT T2OUT V- C2- DIP/SO/TSSOP Table 3. DB9 Cable Connections Commonly Used for EIA/TIA-232E and V.24 Asynchronous Interfaces PIN CONNECTION 2 Receive Data (RD) Data from DCE 3 Transmit Data (TD) Data from DTE 4 Data Terminal Ready Handshake from DTE 5 Signal Ground Reference point for signals 6 Data Set Ready (DSR) Handshake from DCE 7 Request to Send (RTS) Handshake from DTE 8 Clear to Send (CTS) Handshake from DCE 9 Ring Indicator Handshake from DCE 1 Received Line Signal Detector (sometimes called Carrier Detect, DCD) Handshake from DCE www.maximintegrated.com Maxim Integrated | 15 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 R2OUT R2IN T2OUT R1IN VR1OUT T1IN T2IN C2- C2+ V+ (C1-) C1+ (V+) C1- (C1+) VCC GND T1OUT 12 11 9 10 V- (C2+) C2- (V-) C2+ (C2-) GND DIP/SO MAX203E TOP VIEW TTL/CMOS INPUTS TTL/CMOS OUTPUTS 2 1 3 20 GND GND 400kΩ 5kΩ 5kΩ T1IN T2IN R2OUT R1OUT VCC 7 5 18 4 19 0.1μF RS-232 OUTPUTS RS-232 INPUTS +5V 400kΩ +5V +5V INPUT T1OUT R1IN R2IN T2OUT T1 6 9 T2 R1 R2 V- V- C1- C1+ 8(13) 13(14) 12(10) 17 14(8) DO NOT MAKE CONNECTION TO THESE PINS INTERNAL -10V POWER SUPPLY INTERNAL +10V POWER SUPPLY V+ C2- C2- C2+ C2+ 11 15 16 10 (11) PIN NUMBERS IN () ARE FOR SO PACKAGE. (12) www.maximintegrated.com Maxim Integrated | 16 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) T4OUT T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN GND VCC DIP TOP VIEW MAX205E 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 R3IN R3OUT T5IN SHDN EN T5OUT R4IN R4OUT T4IN T3IN R5OUT R5IN VCC TTL/CMOS INPUTS GND SHDN +5V INPUT +5V T2OUT 400kΩ T2IN T2 4 +5V T3OUT 400kΩ T3IN T3 2 +5V T4OUT 400kΩ T4IN T4 1 +5V T5OUT 400kΩ T5IN T5 19 5kΩ R1 R1OUT R1IN 5kΩ R2 R2OUT R2IN 5kΩ R3 R3OUT R3IN 8 7 15 16 22 9 6 23 10 5 24 5kΩ 17 18 R4OUT R4IN 5kΩ R5 14 13 R5OUT R5IN 20 EN 21 11 12 TTL/CMOS OUTPUTS +5V T1OUT 400kΩ T1IN T1 3 RS-232 OUTPUTS RS-232 INPUTS R4 0.1μF www.maximintegrated.com Maxim Integrated | 17 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC C1+ V+ C1- DIP/SO/SSOP TOP VIEW MAX206E 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 T4OUT R2IN R2OUT SHDN EN T4IN T3IN R3OUT R3IN V- C2- C2+ VCC TTL/CMOS INPUTS GND SHDN +5V INPUT +5V T1OUT 400kΩ T1IN T1 2 +5V T2OUT 400kΩ T2IN T2 3 +5V T3OUT 400kΩ T3IN T3 1 +5V T4OUT 400kΩ T4IN T4 24 5kΩ R1 R1OUT R1IN 5kΩ R2 R2OUT R2IN 5kΩ R3 R3OUT R3IN 7 6 18 19 5 22 17 4 23 16 20 EN 21 8 9 TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS 0.1μF V+ 0.1μF 6.3V 0.1μF 16V C1+ C1- 0.1μF 6.3V 0.1μF 16V V- 10 12 13 14 C2+ C2- 11 15 +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER www.maximintegrated.com Maxim Integrated | 18 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC C1+ V+ C1- DIP/SO/SSOP TOP VIEW MAX207E 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 T4OUT R2IN R2OUT T5IN T5OUT T4IN T3IN R3OUT R3IN V- C2- C2+ VCC TTL/CMOS INPUTS GND +5V INPUT +5V T2OUT 400kΩ T2IN T2 +5V T1OUT 400kΩ T1IN T1 3 +5V T3OUT 400kΩ T3IN T3 1 +5V T4OUT 400kΩ T4IN T4 24 +5V T5OUT 400kΩ T5IN T5 20 5kΩ R1 R1OUT R1IN 5kΩ R2 R2OUT R2IN 5kΩ R3 R3OUT R3IN 7 6 18 19 21 5 22 17 4 23 16 8 9 TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS 0.1μF V+ 0.1μF 6.3V 0.1μF 16V C1+ C1- 0.1μF 6.3V 0.1μF 16V V- 10 12 13 14 C2+ C2- 11 15 +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 2 www.maximintegrated.com Maxim Integrated | 19 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) T2OUT T1OUT R2IN R2OUT T1IN R1OUT R1IN GND VCC C1+ V+ C1- DIP/SO/SSOP TOP VIEW MAX208E 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 T3OUT R3IN R3OUT T4IN T4OUT T3IN T2IN R4OUT R4IN V- C2- C2+ VCC TTL/CMOS INPUTS GND +5V INPUT +5V T1OUT 400kΩ T1IN T1 2 +5V T2OUT 400kΩ T2IN T2 1 +5V T3OUT 400kΩ T3IN T3 24 +5V T4OUT 400kΩ T4IN T4 20 5kΩ R1 R1OUT R1IN 5kΩ R2 R2OUT R2IN 5kΩ 5kΩ R3 R3OUT R3IN 5 18 19 21 6 4 22 7 3 23 8 9 TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS R4 17 16 R4OUT R4IN 0.1μF V+ 0.1μF 6.3V 0.1μF 16V C1+ C1- 0.1μF 6.3V 0.1μF 16V V- 10 12 13 14 C2+ C2- 11 15 +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER Ω www.maximintegrated.com Maxim Integrated | 20 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Pin Configurations and Typical Operating Circuits (continued) T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN GND VCC C1+ V+ C1- SO/SSOP TOP VIEW MAX211E MAX213E MAX241E 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 T4OUT R3IN R3OUT SHDN (SHDN) EN (EN) R4IN R4OUT T4IN T3IN R5OUT R5IN V- C2- C2+ V+ 0.1μF* 6.3V VCC 0.1μF 0.1μF* 16V C1+ C1- 0.1μF* 6.3V 0.1μF* 16V TTL/CMOS INPUTS GND SHDN (SHDN) V- 12 14 15 16 +5V INPUT C2+ C2- 13 17 +5V T1OUT 400kΩ T1IN T1 2 +5V T2OUT 400kΩ T2IN T2 3 +5V T3OUT 400kΩ T3IN T3 1 +5V T4OUT 400kΩ T4IN T4 28 5kΩ R1 R1OUT R1IN 5kΩ R2 R2OUT R2IN 5kΩ R3 R3OUT R3IN 7 6 20 21 8 5 26 9 4 27 5kΩ 22 23 R4OUT R4IN 5kΩ R5 19 18 R5OUT R5IN 24 EN (EN) 25 10 +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 11 ( ) ARE FOR MAX213E ONLY * 1.0μF CAPACITORS, MAX241E ONLY TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS R4 www.maximintegrated.com Maxim Integrated | 21 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers Ordering Information (continued) *Dice are specified at TA = +25°C. MAX241EEAI -40°C to +85°C 28 SSOP 28 SO PART TEMP RANGE PIN-PACKAGE MAX213ECWI 0°C to +70°C MAX213ECAI 0°C to +70°C 28 SSOP MAX241EEWI -40°C to +85°C 28 SO MAX232ECWE 0°C to +70°C 16 Wide SO MAX232EC/D 0°C to +70°C Dice* MAX232EESE -40°C to +85°C 16 Narrow SO MAX241ECAI 0°C to +70°C 28 SSOP MAX241ECWI 0°C to +70°C 28 SO MAX232EEWE -40°C to +85°C 16 Wide SO MAX232EEPE -40°C to +85°C 16 Plastic DIP MAX213EEAI -40°C to +85°C 28 SSOP MAX232ECSE 0°C to +70°C 16 Narrow SO MAX232ECPE 0°C to +70°C 16 Plastic DIP MAX213EEWI -40°C to +85°C 28 SO MAX202ECWE 0°C to +70°C 16 Wide SO MAX202EEPE -40°C to +85°C 16 Plastic DIP MAX202EESE -40°C to +85°C 16 Narrow SO MAX202EEWE -40°C to +85°C 16 Wide SO MAX202EC/D 0°C to +70°C Dice* MAX203EEPP -40°C to +85°C 20 Plastic DIP MAX205ECPG 0°C to +70°C 24 Wide Plastic DIP MAX205EEPG -40°C to +85°C 24 Wide Plastic DIP MAX206ECNG 0°C to +70°C 24 Narrow Plastic DIP MAX203EEWP -40°C to +85°C 20 SO MAX203ECWP 0°C to +70°C 20 SO MAX203ECPP 0°C to +70°C 20 Plastic DIP MAX206ECWG 0°C to +70°C 24 SO PART TEMP RANGE PIN-PACKAGE MAX206ECAG 0°C to +70°C 24 SSOP MAX206EENG -40°C to +85°C 24 Narrow Plastic DIP MAX206EEWG -40°C to +85°C 24 SO MAX206EEAG -40°C to +85°C 24 SSOP MAX207ECNG 0°C to +70°C 24 Narrow Plastic DIP MAX207ECWG 0°C to +70°C 24 SO MAX207ECAG 0°C to +70°C 24 SSOP MAX207EENG -40°C to +85°C 24 Narrow Plastic DIP MAX207EEWG -40°C to +85°C 24 SO MAX207EEAG -40°C to +85°C 24 SSOP MAX208ECNG 0°C to +70°C 24 Narrow Plastic DIP MAX211ECWI 0°C to +70°C 28 SO MAX211ECAI 0°C to +70°C 28 SSOP MAX208EEAG -40°C to +85°C 24 SSOP MAX208EEWG -40°C to +85°C 24 SO MAX208ECWG 0°C to +70°C 24 SO MAX208ECAG 0°C to +70°C 24 SSOP MAX208EENG -40°C to +85°C 24 Narrow Plastic DIP MAX211EEWI -40°C to +85°C 28 SO MAX211EEAI -40°C to +85°C 28 SSOP MAX202ECUE 0°C to +70°C 16 TSSOP MAX202EEUE -40°C to +85°C 16 TSSOP www.maximintegrated.com Maxim Integrated | 22 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers PDIPN.EPS PROPRIETARY INFORMATION 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the www.maximintegrated.com Maxim Integrated | 23 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers SSOP.EPS PACKAGE OUTLINE, SSOP, 5.3 MM 1 1 21-0056 C APPROVAL DOCUMENT CONTROL NO. REV. PROPRIETARY INFORMATION TITLE: NOTES: 1. D&E DO NOT INCLUDE MOLD FLASH. 2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006"). 3. CONTROLLING DIMENSION: MILLIMETERS. 4. MEETS JEDEC MO150. 5. LEADS TO BE COPLANAR WITHIN 0.10 MM. H 7.90 L 0∞ 0.301 0.025 8∞ 0.311 0.037 0∞ 7.65 0.63 8∞ 0.95 MAX 5.38 MILLIMETERS B C D E e A1 DIM A SEE VARIATIONS 0.0256 BSC 0.010 0.004 0.205 0.002 0.015 0.008 0.212 0.008 INCHES MIN MAX 0.078 0.65 BSC 0.25 0.09 5.20 0.05 0.38 0.20 0.21 MIN 1.73 1.99 MILLIMETERS 6.07 6.07 10.07 8.07 7.07 INCHES D D D D D 0.239 0.239 0.397 0.317 0.278 MIN 0.249 0.249 0.407 0.328 0.289 MAX MIN 6.33 6.33 10.33 8.33 7.33 14L 16L 28L 24L 20L MAX N A D e A1 L C E H N 2 1 B 0.068 Package Information (continued) For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the www.maximintegrated.com Maxim Integrated | 24 MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers SOICW.EPS PACKAGE OUTLINE, .300" SOIC 1 1 21-0042 B APPROVAL DOCUMENT CONTROL NO. REV. PROPRIETARY INFORMATION TITLE: TOP VIEW FRONT VIEW MAX 0.012 0.104 0.019 0.299 0.013 INCHES 0.291 0.009 E C DIM 0.014 0.004 B A1 MIN A 0.093 0.23 7.40 7.60 0.32 MILLIMETERS 0.10 0.35 2.35 MIN 0.49 0.30 MAX 2.65 L 0.016 0.050 0.40 1.27 D 0.496 0.512 D DIM MIN D INCHES MAX 12.60 13.00 MILLIMETERS MIN MAX 20 AC 0.447 0.463 AB 11.35 18 11.75 0.398 0.413 AA 10.10 16 10.50 N MS013 SIDE VIEW H 0.419 0.394 10.00 10.65 e 0.050 1.27 D 0.614 0.598 15.20 24 15.60 AD D 0.713 0.697 17.70 28 18.10 AE E H N D A1 e B A 0∞-8∞ C L 1 VARIATIONS: Package Information (continued) For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2015 Maxim Integrated Products, Inc. | 25 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. MAX202E–MAX213E, MAX232E/MAX241E ±15kV ESD-Protected, 5V RS-232 Transceivers TSSOP4.40mm.EPS Package Information (continued) For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the AVAILABLE EVALUATION KIT AVAILABLE Functional Diagrams Pin Configurations appear at end of data sheet. Functional Diagrams continued at end of data sheet. UCSP is a trademark of Maxim Integrated Products, Inc. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters _______________General Description The MAX756/MAX757 are CMOS step-up DC-DC switching regulators for small, low input voltage or battery-powered systems. The MAX756 accepts a positive input voltage down to 0.7V and converts it to a higher pinselectable output voltage of 3.3V or 5V. The MAX757 is an adjustable version that accepts an input voltage down to 0.7V and generates a higher adjustable output voltage in the range from 2.7V to 5.5V. Typical full-load efficiencies for the MAX756/MAX757 are greater than 87%. The MAX756/MAX757 provide three improvements over previous devices. Physical size is reduced—the high switching frequencies (up to 0.5MHz) made possible by MOSFET power transistors allow for tiny (<5mm diameter) surface-mount magnetics. Efficiency is improved to 87% (10% better than with low-voltage regulators fabricated in bipolar technology). Supply current is reduced to 60µA by CMOS construction and a unique constant-off-time pulse-frequency modulation control scheme. ________________________Applications 3.3V to 5V Step-Up Conversion Palmtop Computers Portable Data-Collection Equipment Personal Data Communicators/Computers Medical Instrumentation 2-Cell & 3-Cell Battery-Operated Equipment Glucose Meters ____________________________Features ♦ Operates Down to 0.7V Input Supply Voltage ♦ 87% Efficiency at 200mA ♦ 60µA Quiescent Current ♦ 20µA Shutdown Mode with Active Reference and LBI Detector ♦ 500kHz Maximum Switching Frequency ♦ ±1.5% Reference Tolerance Over Temperature ♦ Low-Battery Detector (LBI/LBO) ♦ 8-Pin DIP and SO Packages ______________Ordering Information * Dice are tested at TA = +25°C only. 1 2 3 4 8 7 6 5 LX GND OUT LBO LBI REF 3/5 SHDN MAX756 DIP/SO TOP VIEW 1 2 3 4 8 7 6 5 LX GND OUT LBO LBI REF FB SHDN MAX757 DIP/SO _________________Pin Configurations MAX756 SHDN 1 3/5 2 REF 3 LBI 5 LX 7 150μF GND OUT 6 INPUT 2V to VOUT 1N5817 OUTPUT 5V at 200mA or 3.3V at 300mA 100μF LBO 4 8 0.1μF 22μH LOW-BATTERY DETECTOR OUTPUT __________Typical Operating Circuit PART TEMP. RANGE PIN-PACKAGE MAX756CPA 0°C to +70°C 8 Plastic DIP MAX756CSA 0°C to +70°C 8 SO MAX756C/D 0°C to +70°C Dice* MAX756EPA -40°C to +85°C 8 Plastic DIP MAX756ESA -40°C to +85°C 8 SO MAX757CPA 0°C to +70°C 8 Plastic DIP MAX757CSA 0°C to +70°C 8 SO MAX757C/D 0°C to +70°C Dice* MAX757EPA -40°C to +85°C 8 Plastic DIP MAX757ESA -40°C to +85°C 8 SO 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters 19-0113; Rev. 2; 1/95 _______________General Description The MAX756/MAX757 are CMOS step-up DC-DC switching regulators for small, low input voltage or battery-powered systems. The MAX756 accepts a positive input voltage down to 0.7V and converts it to a higher pinselectable output voltage of 3.3V or 5V. The MAX757 is an adjustable version that accepts an input voltage down to 0.7V and generates a higher adjustable output voltage in the range from 2.7V to 5.5V. Typical full-load efficiencies for the MAX756/MAX757 are greater than 87%. The MAX756/MAX757 provide three improvements over previous devices. Physical size is reduced—the high switching frequencies (up to 0.5MHz) made possible by MOSFET power transistors allow for tiny (<5mm diameter) surface-mount magnetics. Efficiency is improved to 87% (10% better than with low-voltage regulators fabricated in bipolar technology). Supply current is reduced to 60µA by CMOS construction and a unique constant-off-time pulse-frequency modulation control scheme. ________________________Applications 3.3V to 5V Step-Up Conversion Palmtop Computers Portable Data-Collection Equipment Personal Data Communicators/Computers Medical Instrumentation 2-Cell & 3-Cell Battery-Operated Equipment Glucose Meters ____________________________Features ♦ Operates Down to 0.7V Input Supply Voltage ♦ 87% Efficiency at 200mA ♦ 60µA Quiescent Current ♦ 20µA Shutdown Mode with Active Reference and LBI Detector ♦ 500kHz Maximum Switching Frequency ♦ ±1.5% Reference Tolerance Over Temperature ♦ Low-Battery Detector (LBI/LBO) ♦ 8-Pin DIP and SO Packages ______________Ordering Information * Dice are tested at TA = +25°C only. MAX756/MAX757 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters Supply Voltage (OUT to GND) ....................................-0.3V, +7V Switch Voltage (LX to GND) ........................................-0.3V, +7V Auxiliary Pin Voltages (SHDN, LBI, LBO, REF, 3/5, FB to GND) ........................................-0.3V, (VOUT + 0.3V) Reference Current (IREF) ....................................................2.5mA Continuous Power Dissipation (TA = +70°C) Plastic DIP (derate 9.09mW/°C above +70°C) .............727mW SO (derate 5.88mW/°C above +70°C)..........................471mW Operating Temperature Ranges: MAX75_C_ _ ........................................................0°C to +70°C MAX75_E_ _......................................................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range............................... -65°to +160°C Lead Temperature (soldering, 10sec) ........................... +300°C ELECTRICAL CHARACTERISTICS (Circuits of Figure 1 and Typical Operating Circuit, VIN = 2.5V, ILOAD = 0mA, TA = TMIN to TMAX, unless otherwise noted.) Stresses beyond those listed under “Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS Note 1: Supply current from the 3.3V output is measured with an ammeter between the 3.3V output and OUT pin. This current correlates directly with actual battery supply current, but is reduced in value according to the step-up ratio and efficiency. Note 2: Minimum value is production tested. Maximum value is guaranteed by design and is not production tested. LBO Output Leakage Current SHDN, 3/5, FB, LBI Input Current Output Voltage Range MAX757, ILOAD = 0mA (Note 2) 2.7 5.5 V FB Voltage MAX757 1.22 1.25 1.28 V ±100 nA LBI = 1.25V, FB = 1.25V, SHDN = 0V or 3V, 3/5 = 0V or 3V SHDN, 3/5 Input Voltage High 1.6 V SHDN, 3/5 Input Voltage Low 0.4 V Shutdown Quiescent Current (Note 1) Battery Quiescent Current Measured at VIN in Figure 1 LBI Input Threshold With falling edge 1.22 1.25 1.28 V LBI Input Hysteresis 25 mV LBO Output Voltage Low ISINK = 2mA 0.4 V LBO = 5V 1 µA 20 40 µA SHDN = 0V, LBI = 1.25V, 3/5 = 3V, VOUT = 3.47V, FB = 1.3V (MAX757 only) µA Quiescent Supply Current in 3.3V Mode (Note 1) MAX757, VOUT = 5V, 0mA < ILOAD < 200mA MAX756, 3/5 = 0V, 0mA < ILOAD < 200mA MAX756, 3/5 = 3V, 0mA < ILOAD < 300mA Reference-Voltage Regulation 3/5 = 3V, -20µA < REF load < 250µA, CREF = 0.22µF 0.8 2.0 % No REF load, CREF = 0.1µF 1.23 1.25 1.27 V 60 ILOAD = 0mA, 3/5 = 3V, LBI = 1.25V, VOUT = 3.47V, FB = 1.3V (MAX757 only) µA V Output set for 3.3V 60 Minimum Start-Up Supply Voltage ILOAD = 10mA 1.1 1.8 4.8 5.0 5.2 2V < VIN < 3V Reference Voltage 3.17 3.30 3.43 V 4.8 5.0 5.2 Output Voltage PARAMETER CONDITIONS MIN TYP MAX UNITS ILOAD = 20mA 0.7 V Minimum Operating Supply Voltage (once started) MAX756/MAX757 2 Maxim Integrated 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters MINIMUM START-UP INPUT VOLTAGE vs. LOAD CURRENT MAX756-7 LOAD CURRENT (mA) START-UP INPUT VOLTAGE (V) 1 10 100 1000 1.8 1.6 1.4 1.2 1.0 0.8 3.3V MODE 40 0.1 10 1000 EFFICIENCY vs. LOAD CURRENT 3.3V OUTPUT MODE MAX756-1 LOAD CURRENT (mA) EFFICIENCY (%) 60 80 90 50 70 1 100 VIN = 2.0V VIN = 1.2V 40 0.1 10 1000 EFFICIENCY vs. LOAD CURRENT 5V OUTPUT MODE MAX756-2 LOAD CURRENT (mA) EFFICIENCY (%) 60 80 90 50 70 1 100 VIN = 3.3V VIN = 2.5V VIN = 1.25V 800 0 0 2 MAXIMUM OUTPUT CURRENT vs. INPUT VOLTAGE 200 600 MAX756-3 INPUT VOLTAGE (V) MAXIMUM OUTPUT CURRENT (mA) 4 400 100 300 500 700 1 3 5 3.3V MODE 5V MODE 1M 10 10μ 10m 1 SWITCHING FREQUENCY vs. LOAD CURRENT 100 MAX756-4 LOAD CURRENT (A) SWITCHING FREQUENCY (Hz) 1k 10k 100k 100μ 1m 100m 5V MODE 3.3V MODE VIN = 2.5V 0 2 QUIESCENT CURRENT vs. INPUT VOLTAGE MAX756-5 INPUT VOLTAGE (V) QUIESCENT CURRENT (μA) 4 100 200 300 400 500 1 3 5 VOUT = 3.3V VOUT = 5V CURRENT MEASURED AT VIN 50 0 1 2 5 SHUTDOWN QUIESCENT CURRENT vs. INPUT VOLTAGE 20 MAX756-6 INPUT VOLTAGE (V) SHUTDOWN QUIESCENT CURRENT (μA) 4 40 10 30 3 CURRENT MEASURED AT VIN 10 0 0 REFERENCE VOLTAGE LOAD REGULATION 2 8 MAX756-8 LOAD CURRENT (μA) VREF LOAD REGULATION (mV) 6 4 50 100 150 200 250 VOUT = 3.3V __________________________________________Typical Operating Characteristics (Circuit of Figure 1, TA = +25°C, unless otherwise noted.) MAX756/MAX757 Maxim Integrated 3 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters ______________________________________________________________Pin Description NAME FUNCTION 1 SHDN 2 3/5 Selects the main output voltage setting; 5V when low, 3.3V when high. – FB 3 REF 4 LBO 5 LBI 6 OUT 7 GND Power Ground. Must be low impedance; solder directly to ground plane. 8 LX 1A, 0.5Ω N-Channel Power MOSFET Drain 1 – 2 3 4 5 6 7 8 PIN MAX756 MAX757 Shutdown Input disables SMPS when low, but the voltage reference and low-battery comparator remain active. Feedback Input for adjustable output operation. Connect to an external voltage divider between OUT and GND. 1.25V Reference Voltage Output. Bypass with 0.22µF to GND (0.1µF if there is no external reference load). Maximum load capability is 250µA source, 20µA sink. Low-Battery Output. An open-drain N-channel MOSFET sinks current when the voltage at LBI drops below +1.25V. Low-Battery Input. When the voltage on LBI drops below +1.25V, LBO sinks current. Connect to VIN if not used. Connect OUT to the regulator output. It provides bootstrapped power to both devices, and also senses the output voltage for the MAX756. OUTPUT VOLTAGE 50mV/div VIN = 2.5V HORIZONTAL = 50μs/div 5V Mode LOAD-TRANSIENT RESPONSE OUTPUT CURRENT 0mA to 200mA _____________________________Typical Operating Characteristics (continued) (Circuit of Figure 1, TA = +25°C, unless otherwise noted.) VSHDN 2V/div VIN = 2.5V HORIZONTAL = 5ms/div 5V Mode START-UP DELAY VOUT 2V/div 3V 0V 5V 0V MAX756/MAX757 4 Maxim Integrated 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters _______________Detailed Description Operating Principle The MAX756/MAX757 combine a switch-mode regulator with an N-channel MOSFET, precision voltage reference, and power-fail detector in a single monolithic device. The MOSFET is a “sense-FET” type for best efficiency, and has a very low gate threshold voltage to ensure start-up under low-battery voltage conditions (1.1V typ). Pulse-Frequency Modulation Control Scheme A unique minimum off time, current-limited, pulse-frequency modulation (PFM) control scheme is a key feature of the MAX756/MAX757. This PFM scheme combines the advantages of pulse-width modulation (PWM) (high output power and efficiency) with those of a traditional PFM pulse-skipper (ultra-low quiescent currents). There is no oscillator; at heavy loads, switching is accomplished through a constant peak-current limit in the switch, which allows the inductor current to self-oscillate between this peak limit and some lesser value. At light loads, switching frequency is governed by a pair of one-shots, which set a minimum off-time (1µs) and a maximum on-time (4µs). The switching frequency depends on the load and the input voltage, and can range as high as 500kHz. The peak switch current of the internal MOSFET power switch is fixed at 1A ±0.2A. The switch's on resistance is typically 0.5Ω, resulting in a switch voltage drop (VSW) of about 500mV under high output loads. The value of VSW decreases with light current loads. Conventional PWM converters generate constant-frequency switching noise, whereas this architecture produces variable-frequency switching noise. However, the noise does not exceed the switch current limit times the filter-capacitor equivalent series resistance (ESR), unlike conventional pulse-skippers. Voltage Reference The precision voltage reference is suitable for driving external loads such as an analog-to-digital converter. It has guaranteed 250µA source-current and 20µA sink-current capability. The reference is kept alive even in shutdown mode. If the reference drives an external load, bypass it with 0.22µF to GND. If the reference is unloaded, bypass it with at least 0.1µF. Control-Logic Inputs The control inputs (3/5, SHDN) are high-impedance MOS gates protected against ESD damage by normally reverse-biased clamp diodes. If these inputs are driven from signal sources that exceed the main supply voltage, the diode current should be limited by a series resistor (1MΩ suggested). The logic input threshold level is the same (approximately 1V) in both 3.3V and 5V modes. Do not leave the control inputs floating. __________________Design Procedure Output Voltage Selection The MAX756 output voltage can be selected to 3.3V or 5V under logic control, or it can be left in one mode or the other by tying 3/5 to GND or OUT. Efficiency varies depending upon the battery and the load, and is typically better than 80% over a 2mA to 200mA load range. The device is internally bootstrapped, with power derived from the output voltage (via OUT). When the output is set at 5V instead of 3.3V, the higher internal supply voltage results in lower switch-transistor on resistance and slightly greater output power. Bootstrapping allows the battery voltage to sag to less than 1V once the system is started. Therefore, the battery voltage range is from VOUT + VD to less than 1V (where VD is the forward drop of the Schottky rectifier). If the battery voltage exceeds the programmed output voltage, the output will follow the battery voltage. In many systems this is acceptable; however, the output voltage must not be forced above 7V. The output voltage of the MAX757 is set by two resistors, R1 and R2 (Figure 1), which form a voltage divider between the output and the FB pin. The output voltage is set by the equation: VOUT = (VREF) [(R2 + R1) / R2] where VREF = 1.25V. To simplify resistor selection: R1 = (R2) [(VOUT / VREF) - 1] Since the input bias current at FB has a maximum value of 100nA, large values (10kΩ to 200kΩ) can be used for R1 and R2 with no significant loss of accuracy. For 1% error, the current through R1 should be at least 100 times FB’s bias current. Low-Battery Detection The MAX756/MAX757 contain on-chip circuitry for lowbattery detection. If the voltage at LBI falls below the regulator’s internal reference voltage (1.25V), LBO (an opendrain output) sinks current to GND. The low-battery monitor's threshold is set by two resistors, R3 and R4 (Figure 1), which forms a voltage divider between the input voltage and the LBI pin. The threshold voltage is set by R3 and R4 using the following equation: R3 = [(VIN / VREF) - 1] (R4) MAX756/MAX757 Maxim Integrated 5 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters where VIN is the desired threshold of the low-battery detector, R3 and R4 are the input divider resistors at LBI, and VREF is the internal 1.25V reference. Since the LBI current is less than 100nA, large resistor values (typically 10kΩ to 200kΩ) can be used for R3 and R4 to minimize loading of the input supply. When the voltage at LBI is below the internal threshold, LBO sinks current to GND. A pull-up resistor of 10kΩ or more connected from LBO to VOUT can be used when driving CMOS circuits. Any pull-up resistor connected to LBO should not be returned to a voltage source greater than VOUT. When LBI is above the threshold, the LBO output is off. The low-battery comparator and reference voltage remain active when the MAX756/MAX757 is in shutdown mode. If the low-battery comparator is not used, connect LBI to VIN and leave LBO open. Inductor Selection The inductors should have a saturation (incremental) current rating equal to or greater than the peak switchcurrent limit, which is 1.2A worst-case. However, it’s generally acceptable to bias the inductor into saturation by 20%, although this will reduce the efficiency. The 22µH inductor shown in the typical applications circuit is sufficient for most MAX756/MAX757 application circuits. Higher input voltages increase the energy transferred with each cycle, due to the reduced input/output differential. Minimize excess ripple due to increased energy transfer by reducing the inductor value (10µH suggested). The inductor’s DC resistance significantly affects efficiency. For highest efficiency, limit L1’s DC resistance to 0.03Ω or less. See Table 1 for a list of suggested inductor suppliers. Table 1. Component Suppliers AVX USA: (207) 282-5111, FAX (207) 283-1941 (800) 282-9975 CoilCraft USA: (708) 639-6400, FAX (708) 639-1969 Coiltronics USA: (407) 241-7876, FAX (407) 241-9339 Collmer Semiconductor USA: (214) 233-1589 Motorola USA: (602) 244-3576, FAX (602) 244-4015 Nichicon USA: (708) 843-7500, FAX (708) 843-2798 Japan: +81-7-5231-8461, FAX (+81-) 7-5256-4158 Nihon USA: (805) 867-2555, FAX (805) 867-2556 Japan: +81-3-3494-7411, FAX (+81-) 3-3494-7414 Sanyo OS-CON USA: (619) 661-6835 Japan: +81-720-70-1005, FAX (+81-720-) 70-1174 Sprague USA: (603) 224-1961, FAX (603) 224-1430 Sumida USA: (708) 956-0666 Japan: +81-3-3607-5111, FAX (+81-3-) 3607-5428 United Chemi-Con USA: (708) 696-2000, FAX (708) 640-6311 Capacitor Selection A 100µF, 10V surface-mount (SMT) tantalum capacitor typically provides 50mV output ripple when stepping up from 2V to 5V at 200mA. Smaller capacitors, down to 10µF, are acceptable for light loads or in applications that can tolerate higher output ripple. MAX757 REF 3 LX 7 C1 150μF GND OUT 6 VIN D1 1N5817 VOUT LBO 4 8 C3 0.1μF L1 22μH LBI 5 C2 100μF SHDN 1 FB 2 R1 R2 R3 R4 Figure 1. Standard Application Circuit PRODUCTION METHOD INDUCTORS CAPACITORS Surface-Mount AVX TPS series Sprague 595D series Miniature Through-Hole Sumida RCH654-220 Low-Cost Through-Hole Sumida CD54-220 (22µH) CoilCraft DT3316-223 Coiltronics CTX20-1 Sanyo OS-CON OS-CON series low-ESR organic semiconductor CoilCraft PCH-27-223 Nichicon PL series low-ESR electrolyic United Chemi-Con LXF series MAX756/MAX757 6 Maxim Integrated 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters N N MAX756 GND VOUT VIN Q TRIG ONE-SHOT MINIMUM OFF-TIME ONE-SHOT Q F/F S R MAXIMUM ON-TIME ONE-SHOT TRIG Q ONE-SHOT LX OUT REFERENCE REF LBI LBO 3/5 SHDN Figure 2. MAX756 Block Diagram The ESR of both bypass and filter capacitors affects efficiency. Best performance is obtained by using specialized low-ESR capacitors, or connecting two or more filter capacitors in parallel. The smallest low-ESR SMT tantalum capacitors currently available are Sprague 595D series, which are about half the size of competing products. Sanyo OS-CON organic semiconductor through-hole capacitors also exhibit very low ESR, and are especially useful for operation at cold temperatures. Table 1 lists suggested capacitor suppliers. Rectifier Diode For optimum performance, a switching Schottky diode, such as the 1N5817, is recommended. 1N5817 equivalent diodes are also available in surface-mount packages from Collmer Semiconductor in Dallas, TX, phone (214) 233-1589. The part numbers are SE014 or SE024. For low output power applications, a pn junction switching diode, such as the 1N4148, will also work well, although efficiency will suffer due to the greater forward voltage drop of the pn junction diode. MAX756/MAX757 Maxim Integrated 7 3.3V/5V/Adjustable-Output Step-Up DC-DC Converters 3.3V/5V/Adjustable-Output, GND GND LBI OUT 3/5 (MAX756) FB (MAX757) REF SHDN LX LBO 0.122" (3.10mm) 0.080" (2.03mm) ___________________Chip Topography ________________________________________________________Package Information L DIM A A1 B C D E e H h L α MIN 0.053 0.004 0.014 0.007 0.189 0.150 0.228 0.010 0.016 0° MAX 0.069 0.010 0.019 0.010 0.197 0.157 0.244 0.020 0.050 8° MIN 1.35 0.10 0.35 0.19 4.80 3.80 5.80 0.25 0.40 0° MAX 1.75 0.25 0.49 0.25 5.00 4.00 6.20 0.50 1.27 8° INCHES MILLIMETERS α 8-PIN PLASTIC SMALL-OUTLINE PACKAGE E H D e A A1 C h x 45˚ 0.127mm 0.004in. B 0.050 BSC 1.27 BSC 21-325A PC Layout and Grounding The MAX756/MAX757 high peak currents and high-frequency operation make PC layout important for minimizing ground bounce and noise. The distance between the MAX756/MAX757’s GND pin and the ground leads of C1 and C2 in Figure 1 must be kept to less than 0.2" (5mm). All connections to the FB and LX pins should also be kept as short as possible. To obtain maximum output power and efficiency and minimum output ripple voltage, use a ground plane and solder the MAX756/MAX757 GND (pin 7) directly to the ground plane. TRANSISTOR COUNT: 758 SUBSTRATE CONNECTED TO OUT MAX756/MAX757 8 Maxim Integrated 3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters MAX756/MAX757 Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 9 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. © Maxim Integrated The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc. General Description MAX200-MAX209, MAX211, and MAX213 are a family of RS-232 and V.28 transceivers with integrated charge pump circuitry for single +5V supply operation. The drivers maintain the ±5V EIA/TIA-232E output signal levels at data rates in excess of 120kbps when loaded in accordance with the EIA/TIA-232E specification. The MAX211 and MAX213 are available in a 28-pin, wide small-outline (SO) package and a 28-pin shrink smalloutline (SSOP) package, which occupies only 40% of the area of the SO. The MAX207 is available in a 24-pin SO package and a 24-pin SSOP. The MAX203 and MAX205 use no external components and are recommended for applications with limited circuit board space. Benefits and Features ● Saves Board Space • Integrated Charge Pump Circuitry Eliminates the Need for a Bipolar ±12V Supply Enables Single Supply Operation From Either +5V or 9V to +12V • Integrated 0.1μF Capacitors (MAX203, MAX205) • 24 pin SSOP Package Saves Up to 40% Versus SO Package ● Saves Power for Longer Battery Operation • 5μW Shutdown Mode (MAX200, MAX205, MAX206, MAX211) • 75μW Ring Indicator Monitoring with Two Active Receivers (MAX213) Applications ● Battery-Powered Equipment ● Handheld Equipment ● Portable Diagnostics Equipment Selector Guide continued at end of data sheet. 19-0065; Rev 8; 1/15 PART POWER-SUPPLY VOLTAGE (V) NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN NUMBER OF EXTERNAL CAPACITORS (0.1μF) LOW-POWER SHUTDOWN/TTL THREE-STATE MAX200 +5 5 0 0 4 Yes/No MAX201 +5 and +9.0 to +13.2 2 2 0 2 No/No MAX202 +5 2 2 0 4 No/No MAX203 +5 2 2 0 None No/No MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors +5V INPUT +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER GND C1+ C1- C2+ C2- 0.1µF 7 9 8 0.1µF +6.3V 0.1µF +16V 0.1µF +16V 0.1µF +6.3V V+ V- 10 11 12 18 N.C. SHDN TTL/CMOS INPUTS RS-232 OUTPUTS 17 6 13 MAX200 T1OUT +5V T1IN 400kΩ 5 2 T1 T2OUT +5V 400kΩ 4 T2IN 3 T2 T3OUT +5V 400kΩ 14 T3IN 1 T3 T4OUT +5V 400kΩ 15 T4IN 20 T4 T5OUT +5V 400kΩ 19 T5IN 16 T5 VCC Selector Guide Typical Operating Circuit VCC..........................................................................-0.3V to +6V V+..............................................................(VCC - 0.3V) to +14V V- ...........................................................................+0.3V to -14V Input Voltages TIN ........................................................-0.3V to (VCC + 0.3V) RIN...................................................................................±30V Output Voltages TOUT................................................(V+ + 0.3V) to (V- - 0.3V) ROUT ....................................................-0.3V to (VCC + 0.3V) Short-Circuit Duration TOUT......................................................................Continuous Continuous Power Dissipation (TA = +70°C) 14-Pin Plastic DIP (derate 10.00mW/°C above +70°C)...800mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)...842mW 16-Pin SO (derate 8.70mW/°C above +70°C).............696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C) ...762mW 16-Pin CERDIP (derate 10.00mW/°C above +70°C).....800mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C) ...889mW 20-Pin Wide SO (derate 10.00mW/°C above +70°C) ..800mW 20-Pin CERDIP (derate 11.11mW/°C above +70°C)...889mW 24-Pin Narrow Plastic DIP (derate 13.33mW/°C above +70°C).......................1067mW 24-Pin Wide Plastic DIP (derate 9.09mW/°C above +70°C) ...........................727mW 24-Pin Wide SO (derate 11.76mW/°C above +70°C)..941mW 24-Pin SSOP (derate 8.00mW/°C above +70°C)........640mW 24-Pin CERDIP (derate 12.50mW/°C above +70°C) ...1000mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) ..1000mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)........762mW Operating Temperature Ranges MAX2_ _C_ _ .....................................................0°C to +70°C MAX2_ _E_ _ ................................................. -40°C to +85°C MAX2_ _ M_ _.............................................. -55°C to +125°C Storage Temperature Range............................ -65°C to +160°C Lead Temperature (soldering, 10s) (Note 1)...................+300°C (MAX202/MAX204/MAX206/MAX208/MAX211/MAX213: VCC = +5V ±10%; MAX200/MAX203/MAX205/MAX207: VCC = +5V ±5%, C1–C4 = 0.1µF; MAX201/MAX209: VCC = +5V ±10%, V+ = +9.0V to +13.2V, TA = TMIN to TMAX, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX UNITS Output-Voltage Swing All transmitter outputs loaded with 3kΩ to ground ±5 ±8 V VCC Power-Supply Current No load, TA = +25°C MAX202, MAX203 8 15 mA MAX200, MAX204–MAX208, MAX211, MAX213 11 20 MAX201, MAX209 0.4 1 V+ Power-Supply Current No load MAX201 5 10 mA MAX209 7 15 Shutdown Supply Current Figure 1, TA = +25°C MAX200, MAX205, MAX206, MAX211 1 10 µA MAX213 15 50 Input Logic Threshold Low TIN, EN, SHDN, EN, SHDN 0.8 V Input Logic Threshold High TIN 2.0 V EN, SHDN, EN, SHDN 2.4 Logic Pullup Current TIN = 0V 15 200 µA RS-232 Input-Voltage Operating Range -30 +30 V MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 2 Note 1: Maximum reflow temperature for the MAX203 and MAX205 is +225°C. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Electrical Characteristics (MAX202/MAX204/MAX206/MAX208/MAX211/MAX213: VCC = +5V ±10%; MAX200/MAX203/MAX205/MAX207: VCC = +5V ±5%, C1–C4 = 0.1µF; MAX201/MAX209: VCC = +5V ±10%, V+ = +9.0V to +13.2V, TA = TMIN to TMAX, unless otherwise noted.) PARAMETER CONDITIONS MIN TYP MAX UNITS Receiver Input Threshold Low VCC = +5V, TA = +25°C Active mode 0.8 1.2 V Shutdown mode, MAX213, R4, R5 0.6 1.5 Receiver Input Threshold High VCC = +5V, TA = +25°C Active mode 1.7 2.4 V Shutdown mode, MAX213, R4, R5 1.5 2.4 RS-232 Input Hysteresis VCC = +5V, no hysteresis in shutdown 0.2 0.5 1.0 V RS-232 Input Resistance VCC = +5V, TA = +25°C 3 5 7 kΩ TTL/CMOS Output-Voltage Low IOUT = 3.2mA MAX201, MAX202, MAX203 0.4 V IOUT = 1.6mA All others TTL/CMOS Output-Voltage High IOUT = 1.0mA 3.5 V TTL/CMOS Output Leakage Current EN = VCC, EN = 0V, 0 ≤ ROUT ≤ VCC 0.05 ±10 µA Output Enable Time Figure 2 MAX205, MAX206, MAX209, MAX211, MAX213 600 ns Output Disable Time Figure 2 MAX205, MAX206, MAX209, MAX211, MAX213 200 ns Receiver Propagation Delay SHDN = 0V, R4, R5 MAX213 4 40 SHDN = VCC 0.5 10 µs MAX200–MAX211 0.5 10 Transmitter Output Resistance VCC = V+ = V- = 0V, VOUT = ±2V 300 Ω Transition Region Slew Rate CL = 50pF to 2500pF, RL = 3kΩ to 7kΩ, VCC = 5V, TA = +25°C measured from +3V to -3V or -3V to +3V MAX200, MAX202–MAX211, MAX213 3 5.5 30 V/µs MAX201 4 30 RS-232 Output ShortCircuit Current ±10 ±60 mA Maximum Data Rate RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF, one transmitter 120 kbps MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 3 Electrical Characteristics (continued) MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 4 MAX200/204/205/206/207/208/211/213 TRANSMITTER SKEW RATE vs. LOAD CAPACITANCE MAX200-MAX213 toc02 LOAD CAPACITANCE (pF) Tx SLEW RATE (V/µs) 1000 2000 3000 4000 4 6 8 10 12 14 16 18 20 22 2 0 5000 -SLEW RATE +SLEW RATE VCC = +5V ALL Tx OUTPUTS LOADED 3kΩIICL TA = +25°C LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 MAX209 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX200-MAX213 toc03 Tx OUTPUT VOLTAGE (IVI) 8.6 8.8 9.0 9.2 9.4 9.6 9.8 10.0 8.4 VCC = +5V ALL Tx OUTPUTS LOADED 3kΩIICL TA = +25°C V+ = 12V 20kbps 60kbps 116kbps MAX201 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX200-MAX213 toc04 LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 Tx OUTPUT VOLTAGE (IVI) 7.5 8.0 8.5 9.0 9.5 10.0 7.0 VCC = +5V ALL Tx OUTPUTS LOADED 3kΩIICL TA = +25°C V+ = 12V 20kbps 60kbps 112kbps Tx SLEW RATE (V/µs) 5 10 15 20 25 0 LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 MAX201/MAX209 TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE MAX200-MAX213 toc05 -SLEW RATE +SLEW RATE MAX209 MAX201 VCC = +5V ALL Tx OUTPUTS LOADED 3kΩIICL TA = +25°C V+ = 12V MAX202/203 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX200-MAX213 toc06 LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 Tx OUTPUT VOLTAGE (V) -5.0 -2.5 0 2.5 5.0 7.5 -7.0 20kbps 120kbps 120kbps VCC = +4.5V, TA = +25°C BOTH Tx OUTPUTS, LOADED 3kΩIICL ONE TRANSMITTER AT FULL DATA RATE ONE TRANSMITTER AT 1/8 DATA RATE 20kbps 240kbps 240kbps MAX200/204/205/206/207/208/211/213 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX200-MAX213 toc01 LOAD CAPACITANCE (pF) Tx OUTPUT VOLTAGE (IVI) 1000 2000 3000 4000 5.2 5.4 5.6 5.8 6.0 6.2 6.4 6.6 6.8 7.0 5.0 0 5000 20kbps 116kbps 60kbps VCC = +5V ALL Tx OUTPUTS LOADED 3kΩIICL TA = +25°C Tx SLEW RATE (V/µs) 2 4 6 8 10 12 14 0 MAX202/203 TRANSMITTER SLEW RATE vs. LOAD CAPACITANCE MAX200-MAX213 toc07 LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 VCC = +4.5V, TA = +25°C BOTH Tx OUTPUTS, LOADED 3kΩIICL ONE TRANSMITTER AT FULL DATA RATE ONE TRANSMITTER AT 1/8 DATA RATE -SLEW RATE +SLEW RATE 240kbps 20kbps 120kbps 240kbps 20kbps 120kbps SUPPLY CURRENT (mA) 15 20 25 30 35 10 MAX202/203 SUPPLY CURRENT vs. LOAD CAPACITANCE MAX200-MAX213 toc08 LOAD CAPACITANCE (pF) 0 1000 2000 3000 4000 5000 VCC = +4.5V, TA = +25°C, BOTH Tx OUTPUTS, LOADED 3kΩIICL ONE TRANSMITTER AT FULL DATA RATE ONE TRANSMITTER AT 1/8 DATA RATE 240kbps 20kbps 120kbps Typical Operating Characteristics Detailed Description The MAX200–MAX209/MAX211/MAX213 consist of three sections: charge-pump voltage converters, drivers (transmitters), and receivers. Each section is described in detail. +5V to ±10V Dual Charge-Pump Voltage Converter The +5V to ±10V conversion is performed by two chargepump voltage converters (Figure 4). The first uses capacitor C1 to double +5V to +10V, storing +10V on the V+ output filter capacitor, C3. The second chargepump voltage converter uses capacitor C2 to invert +10V to -10V, storing -10V on the V- output filter capacitor, C4. The MAX201 and MAX209 include only the V+ to Vcharge pump, and are intended for applications that have a VCC = +5V supply and a V+ supply in the +9V to +13.2V range. In shutdown mode, V+ is internally connected to VCC by a 1kΩ pulldown resistor and V- is internally connected to ground by a 1kΩ pullup resistor. RS-232 Drivers When VCC = +5V, the typical driver output-voltage swing is ±8V when loaded with a nominal 5kΩ RS-232 receiver. The output swing is guaranteed to meet the EIA/TIA-232E and V.28 specifications, which call for ±5V minimum output levels under worst-case conditions. These include a minimum 3kΩ load, VCC = +4.5V, and the maximum operating temperature. The open-circuit output-voltage swing ranges from (V+ - 0.6V) to V-. Input thresholds are both CMOS and TTL compatible. The inputs of unused drivers can be left unconnected since 400kΩ pullup resistors to VCC are included onchip. Since all drivers invert, the pullup resistors force the outputs of unused drivers low. The input pullup resistors typically source 15μA; therefore, the driver inputs should be driven high or open circuited to minimize power-supply current in shutdown mode. When in low-power shutdown mode, the driver outputs are turned off and their leakage current is less than 1mA, even if the transmitter output is backdriven between 0V and (VCC + 6V). Below -0.5V, the transmitter output is diode clamped to ground with a 1kΩ series impedance. The transmitter output is also zener clamped to approximately (VCC + 6V), with a 1kΩ series impedance. Figure 1. Shutdown Current Test Circuit Figure 2. Receiver Output Enable and Disable Timing MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 5 ISHDN +5.5V +5.5V +5.5V (0) +5.5V 0V OR +5.5V DRIVE 0.1µF 0.1µF 0.1µF 0.1µF C1+ C1- C2+ C2- 400kΩ 3kΩ 5kΩ GND VCC V+ V- TIN +5.5V T1 T0 T5 R1 T0 R5 TOUT RIN 0.1µF SHDN ROUT (SHDN) EN (EN) MAX200 MAX205 MAX206 MAX211 MAX213 NOTE 1: ( ) ARE FOR MAX213. NOTE 2: CAPACITORS CAN BE POLARIZED OR UNPOLARIZED. +3.5V RECEIVER OUTPUT CL = 150pF +0.8V VOH - 0.1V + 2.5V VOH VOL RL = 1kΩ VOL + 0.1V OUTPUT ENABLE TIME RECEIVER OUTPUTS +3V EN 0V INPUT OUTPUT ENABLE TIME +3V 0V EN INPUT NOTE: POLARITY OF EN IS REVERSED FOR THE MAX213. RS-232 Receivers The receivers convert RS-232 signals to CMOS logic output levels. Receiver outputs are inverting, maintaining compatibility with driver outputs. The guaranteed receiver input thresholds of +0.8V and +2.4V are significantly tighter than the ±3.0V threshold required by the EIA/TIA- 232E specification. This allows receiver inputs to respond to TTL/CMOS logic levels and improves noise margin for RS-232 levels. The MAX200–MAX209/MAX211/MAX213 guaranteed +0.8V threshold (+0.6V in shutdown for the MAX213) ensures that receivers shorted to ground have a logic 1 output. Also, the 5kΩ input resistance to ground ensures that a receiver with its input left open also has a logic 1 output. Receiver inputs have approximately +0.5V hysteresis. This provides clean output transitions, even with slow rise and fall time input signals with moderate amounts of noise and ringing. In shutdown, the MAX213 receivers R4 and R5 have no hysteresis. Figure 3. Transition Slew-Rate Test Circuit Figure 4. Dual Charge-Pump Diagram MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 6 +5V 0V (+5V) 0V (+5V) 0.1µF 0.1µF 0.1µF C1+ C1- C2+ C2- 400kΩ 3kΩ 2500pF 5kΩ VCC V+ V- TIN +5V T1 T0 T5 R1 T0 R5 TOUT RIN 0.1µF ROUT SHDN (SHDN) EN (EN) MAX200-MAX209 MAX211 MAX213 +5V 0V (+5V) MAXIMUM SLEW-RATE TEST CIRCUIT MINIMUM SLEW-RATE TEST CIRCUIT NOTE: ( ) ARE FOR MAX213. 0V (+5V) 0.1µF 0.1µF 0.1µF C1+ C1- C2+ C2- 400kΩ 7kΩ 50pF 5kΩ VCC V+ V- TIN +5V T1 T0 T5 R1 T0 R5 TOUT RIN 0.1µF ROUT SHDN (SHDN) EN (EN) MAX200-MAX209 MAX211 MAX213 0.1µF 0.1µF V+ V+ S1 C1+ S2 S5 C2+ S6 IL+ C3 C2 C4 GND RLVS7 S8 VCC GND IL- RL+ C2- C1 VCC 200kHz S3 S4 C1- GND Shutdown and Enable Control In shutdown mode, the MAX200/MAX205/MAX206/ MAX211/MAX213 charge pumps are turned off, V+ is pulled down to VCC, V- is pulled to ground, and the transmitter outputs are disabled. This reduces supply current typically to 1μA (15μA for the MAX213). The time required to exit shutdown is 1ms, as shown in Figure 5. All receivers except R4 and R5 on the MAX213 are put into a high-impedance state in shutdown mode. The MAX213’s R4 and R5 receivers still function in shutdown mode. These two receivers are useful for monitoring external activity while maintaining minimal power consumption. The enable control is used to put the receiver outputs into a high-impedance state, so that the receivers can be connected directly to a three-state bus. It has no effect on the RS-232 drivers or on the charge pumps. MAX213 Receiver Operation in Shutdown During normal operation, the MAX213’s receiver propagation delay is typically 1µs. When entering shutdown with receivers active, R4 and R5 are not valid until 80µs after SHDN is driven low. In shutdown mode, propagation delays increase to 4µs for a high-to-low or a low-to-high transition. When exiting shutdown, all receiver outputs are invalid until the charge pumps reach nominal values (< 2ms when using 0.1µF capacitors). Table 1a. MAX200 Control Pin Configurations *Active = active with reduced performance. Table 1b. MAX205/MAX206/MAX211 Control Pin Configurations Table 1c. MAX213 Control Pin Configurations Figure 5. Transmitter Outputs When Exiting Shutdown SHDN OPERATION STATUS TRANSMITTERS T1–T5 0 Normal Operation All Active 1 Shutdown All High-Z SHDN EN OPERATION STATUS TRANSMITTERS T1–T5 RECEIVERS R1–R5 0 0 Normal Operation All Active All Active 0 1 Normal Operation All Active All High-Z 1 0 Shutdown All High-Z All High-Z SHDN EN OPERATION STATUS TRANSMITTERS T1–T4 RECEIVERS R1, R2, R3 R4, R5 0 0 Shutdown All High-Z High-Z High-Z 0 1 Shutdown All High-Z High-Z Active* 1 0 Normal Operation All Active High-Z High-Z 1 1 Normal Operation All Active Active Active MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 7 TWO TRANSMITTER OUTPUTS: ONE HIGH, ONE LOW SHDN* THREE TRANSMITTERS LOADED WITH 3kΩ||2500pF. *SHUTDOWN POLARITY REVERSED FOR MAX213. SHUTDOWN TRANSMITTERS ON Applications Information Capacitor Selection The type of capacitor used is not critical for proper operation. Ceramic capacitors are suggested. To ensure proper RS-232 signal levels over temperature when using 0.1µF capacitors, make sure the capacitance value does not degrade excessively as the temperature varies. If in doubt, use capacitors with a larger nominal value. Also observe the capacitors’ ESR value over temperature, since it influences the amount of ripple on V+ and V-. To reduce the output impedance at V+ and V-, use larger capacitors (up to 10µF). If polarized capacitors are used, obey the polarities shown in Figure 1 and the pin configurations. Driving Multiple Receivers Each transmitter is designed to drive a single receiver. Transmitters can be paralleled to drive multiple receivers. Driver Outputs When Exiting Shutdown Figure 5 shows two driver outputs exiting shutdown. As they become active, the two driver outputs go to opposite RS-232 levels (one driver input is high, the other is low). Each driver is loaded with 3kΩ in parallel with 2500pF. The driver outputs display no ringing or undesirable transients as they come out of shutdown. Power-Supply Decoupling In applications that are sensitive to power-supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitors. V+ and V- as Power Supplies A small amount of power can be drawn from V+ and V-, although this reduces noise margins. Power Supplies for MAX201/MAX209 If at power-up the V+ supply rises after the VCC supply, place a diode (e.g., 1N914) in series with the V+ supply. Table 2. Summary of EIA/TIA-232E, V.28 Specifications Table 3. DB9 Cable Connections Commonly Used for EIA/TIA-232E and V.24 Asynchronous Interfaces PARAMETER CONDITION EIA/TIA-232E, V.28 SPECIFICATION Driver Output Voltage: 0 Level 3kΩ to 7kΩ load +5.0V to +15V Driver Output Voltage: 1 Level 3kΩ to 7kΩ load -5.0V to -15V Output Level, Maximum No load ±25V Data Rate 3kΩ ≤ RL ≤ 7kΩ, CL ≤ 2500pF Up to 20kbps Receiver Input Voltage: 0 Level — +3.0V to +15V Receiver Input Voltage: 1 Level — -3.0V to -15V Input Level, Maximum — ±25V Instantaneous Slew Rate, Maximum 3kΩ ≤ RL ≤ 7kΩ, CL ≤ 2500pF 30V/µs Driver Output Short-Circuit Current, Maximum — 100mA Transition Rate on Driver Output V.28 1ms or 3% of the period EIA/TIA-232E 4% of the period Driver Output Resistance -2V < VOUT < +2V 300Ω PIN NAME CONNECTION 1 Received Line Signal Detector, sometimes called Carrier Detect (DCD) Handshake from DCE 2 Receive Data (RD) Data from DCE 3 Transmit Data (TD) Data from DTE 4 Data Terminal Ready Handshake from DTE 5 Signal Ground Reference point for signals 6 Data Set Ready (DSR) Handshake from DCE 7 Request to Send (RTS) Handshake from DTE 8 Clear to Send (CTS) Handshake from DCE 9 Ring Indicator Handshake from DCE MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 8 MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 9 DIP/SO 20 19 18 17 16 15 14 1 2 3 4 5 6 7 T4OUT +5V INPUT +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER GND C1+ C1- C2+ C2- 0.1µF 7 9 8 0.1µF +6.3V 0.1µF +16V 0.1µF +16V 0.1µF +6.3V V+ V- 10 11 12 18 N.C. SHDN TTL/CMOS INPUTS RS-232 OUTPUTS 17 6 13 T5IN N.C. T2IN SHND T2OUT T1OUT T3OUT MAX200 MAX200 T5OUT T4IN VCC T3IN GND C1+ 8 13 VV+ 9 12 C2- C1- 10 11 C2+ T1IN T1OUT +5V T1IN 400kΩ 5 2 T1 T2OUT +5V 400kΩ 4 T2IN 3 T2 T3OUT +5V 400kΩ 14 T3IN 1 T3 T4OUT +5V 400kΩ 15 T4IN 20 T4 T5OUT +5V 400kΩ 19 T5IN 16 T5 VCC TOP VIEW MAX200 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 10 +5V INPUT +9V TO +12V +12V TO -12V VOLTAGE CONVERTER GND C+ C- 13 (15) 14 (16) 1 0.1µF +16V C2 0.1µF +16V V+ V- T1OUT R2IN T2OUT 2 +5V +5V 5kΩ 5kΩ T1IN 400kΩ 400kΩ T2IN R2OUT (10) 8 7 6 (11) 9 R1OUT TTL/CMOS INPUTS TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS 12 (14) 5 R1IN 10 (12) 4 11 (13) 3 T1 T2 R1 R2 14 13 12 11 10 9 8 1 2 3 4 5 6 7 V+ VCC GND T2OUT T1OUT V- C- C+ MAX201 MAX201 R1IN R1OUT T2IN T1IN R2OUT R2IN DIP 16 15 14 13 12 11 9 1 2 3 4 5 6 8 V+ VCC GND T2OUT T1OUT V- C- C+ MAX201 R1IN R1OUT N.C. N.C. R2OUT T2IN 7 10 T1IN R2IN SO VCC TOP VIEW 0.1µF NOTE: PIN NUMBERS IN ( ) ARE FOR SO PACKAGE MAX201 Pin Configurations/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 11 TOP VIEW +5V INPUT +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER GND C1+ C1- 0.1µF 0.1µF +6.3V 16 2 1 0.1µF +6.3V 0.1µF +16V +10V -10V V+ V- T1OUT R2IN T2OUT 3 +5V +5V 5kΩ 5kΩ T1IN 400kΩ 400kΩ T2IN R2OUT 11 10 9 12 R1OUT TTL/CMOS INPUTS TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS 15 8 R1IN 13 7 14 6 C2+ C2- 4 0.1µF +16V 5 T1 T2 R1 R2 16 15 14 13 12 11 9 1 2 3 4 5 6 8 VCC GND T1OUT C2+ R1IN C1- V+ C1+ MAX202 R1OUT T1IN R2IN R2OUT V- T2OUT 7 10 T2IN C2- DIP/SO/WIDE SO VCC MAX202 MAX202 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 12 TOP VIEW +5V INPUT GND GND T1OUT R2IN T2OUT +5V +5V 5kΩ 5kΩ T1IN 400kΩ 400kΩ T2IN R2OUT C1+ C2+ C2+ C2- C2- 6 9 7 C1- V- V- V+ 2 1 20 DO NOT MAKE 8 (13) CONNECTION TO THESE PINS INTERNAL -10V POWER SUPPLY INTERNAL +10V POWER SUPPLY 13 (14) 12 (10) 14 (8) 17 3 R1OUT TTL/CMOS INPUTS TTL/CMOS OUTPUTS RS-232 OUTPUTS RS-232 INPUTS 19 11 (12) 15 16 10 (11) R1IN 4 18 5 T1 T2 R1 R2 VCC DIP 20 19 18 17 16 15 14 1 2 3 4 5 6 7 R2OUT R2IN T2OUT R1 V- IN R1OUT T1IN T2IN MAX203 MAX203 C2- C2+ VCC V+ GND C1+ 8 13 C1- GND 9 12 VC2- 10 11 C2+ T1OUT SO 20 19 18 17 16 15 14 1 2 3 4 5 6 7 R2OUT R2IN T2OUT R1 V- IN R1OUT T1IN T2IN MAX203 C2- C2+ VCC C1- GND V+ 8 13 C1+ GND 9 12 C2+ V- 10 11 C2- T1OUT 0.1µF NOTE: PIN NUMBERS IN ( ) ARE FOR SO PACKAGE. MAX203 Pin Configurations/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 13 +5V INPUT +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER GND C1+ C1- C2+ C2- 6 8 7 0.1µF +6.3V 0.1µF +16V 0.1µF +16V 0.1µF +6.3V V+ V- T1OUT T3OUT T4OUT T2OUT 9 10 +5V +5V +5V +5V T1IN 400kΩ 400kΩ 400kΩ 400kΩ T2IN T3IN T4IN 11 4 3 13 14 TTL/CMOS INPUTS RS-232 OUTPUTS 5 15 16 2 1 12 0.1µF T1 T2 T3 T4 VCC TOP VIEW 16 15 14 13 12 11 9 1 2 3 4 5 6 8 T3OUT T4OUT T4IN T1IN T3IN T2IN T2OUT T1OUT V- C2- V+ C1- VCC C1+ 7 10 C2+ GND DIP/SO MAX204 MAX204 MAX204 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 14 +5V INPUT GND 12 T1OUT T3OUT T4OUT T2OUT +5V +5V +5V +5V T1IN 400kΩ 400kΩ 400kΩ 400kΩ T2IN T3IN T4IN T5IN 8 7 15 16 TTL/CMOS INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS RS-232 INPUTS 11 1 2 4 3 T1 T2 T3 T4 T5OUT +5V 400kΩ R1OUT R1IN R2IN R3IN R4IN R5IN SHDN R2OUT R3OUT R4OUT R5OUT EN 22 9 6 23 17 14 20 21 10 5 24 18 13 19 T5 R1 R2 R3 R4 R5 VCC TOP VIEW 24 23 22 21 20 19 17 1 2 3 4 5 6 8 R3IN R3OUT T5IN T2OUT SHDN T1OUT T3OUT T4OUT EN T5OUT T1IN R4OUT R2OUT T2IN 7 18 R4IN R1IN 10 15 T3IN R1OUT 9 16 T4IN VCC 12 13 R5IN GND 11 14 R5OUT R2IN DIP 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ MAX205 MAX205 0.1µF MAX205 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 15 +5V INPUT +5V T1IN T1OUT 2 400kΩ +5V T2IN T2OUT 3 400kΩ +5V T3IN T3OUT 1 400kΩ +5V T4IN T4OUT 24 400kΩ 8 19 18 6 7 14 13 12 10 V- V+ C2+ C2- C1- C1+ 11 9 15 0.1µF +16V 0.1µF +6.3V 0.1µF 0.1µF +16V RS-232 INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS GND T4 T3 T1 T2 0.1µF +6.3V VCC +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER TTL/CMOS INPUTS 24 23 22 21 20 19 18 1 2 3 4 5 6 7 T4OUT R2IN R2OUT R1IN SHDN R1OUT T2OUT T1OUT T3OUT TOP VIEW MAX206 MAX206 EN T4IN T3IN VCC GND 8 17 R3OUT 9 16 R3IN C1+ 10 15 VV+ 11 14 C2- C1- 12 13 C2+ T2IN T1IN DIP/SO 5kΩ R1OUT R1IN 4 R1 5 5kΩ R2OUT R2IN 23 R2 22 5kΩ R3OUT R3IN SHDN 16 21 R3 17 20 EN MAX206 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 16 +5V T1IN T1OUT 2 400kΩ +5V T2IN T2OUT 3 400kΩ +5V T3IN T3OUT 1 400kΩ +5V T4IN T4OUT 24 400kΩ +5V T5IN T5OUT 20 8 400kΩ 19 18 6 7 14 13 12 10 C2- V- V+ C1- C1+ C2+ 11 9 15 0.1µF +16V 0.1µF +6.3V 0.1µF 0.1µF +16V RS-232 INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS GND T5 T4 T3 T1 T2 0.1µF +6.3V +5V INPUT VCC +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 21 TTL/CMOS INPUTS 24 23 22 21 20 19 18 1 2 3 4 5 6 7 T4OUT R2IN R2OUT R1IN T5IN R1OUT T2OUT T1OUT T3OUT TOP VIEW MAX207 MAX207 T5OUT T4IN T3IN VCC GND 8 17 R3OUT 9 16 R3IN C1+ 10 15 VV+ 11 14 C2- C1- 12 13 C2+ T2IN T1IN DIP/SO/SSOP 5kΩ R1OUT R1IN 4 R1 5 5kΩ R2OUT R2IN 23 R2 22 5kΩ R3OUT R3IN 16 R3 17 MAX207 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 17 +5V T1IN T1OUT 2 400kΩ +5V T2IN T2OUT 1 400kΩ +5V T3IN T3OUT 24 400kΩ 8 C2- C2+ C1- C1+ V+ V- 11 9 15 0.1µF +16V 0.1µF +6.3V 0.1µF 0.1µF +16V RS-232 INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS GND T3 +5V T4IN T4OUT 20 400kΩ T4 T1 T2 0.1µF +6.3V +5V INPUT VCC +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER TTL/CMOS INPUTS 24 23 22 21 20 19 18 1 2 3 4 5 6 7 T3OUT R3IN R3OUT R2OUT T4IN T1IN R2IN T1OUT T2OUT TOP VIEW MAX208 MAX208 T4OUT T3IN T2IN VCC GND 8 17 R4OUT 9 16 R4IN C1+ 10 15 VV+ 11 14 C2- C1- 12 13 C2+ R1OUT R1IN DIP/SO 5kΩ R2OUT R2IN 3 R2 5kΩ R1OUT R1IN 7 R1 5kΩ R3OUT R3IN 23 R3 5kΩ R4OUT R4IN 16 R4 19 18 5 14 13 12 10 21 6 4 22 17 MAX208 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 18 0.1µF +5V INPUT +5V T1IN T1OUT 19 400kΩ +5V T2IN T2OUT 20 400kΩ +5V T3IN T3OUT 13 400kΩ 3 16 23 24 7 6 C- C+ 4 5 8 0.1µF +16V 0.1µF +16V RS-232 INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS GND T3 T1 T2 9V - 13.2V INPUT VCC V+ +10V TO +10V VOLTAGE INVERTER TTL/CMOS INPUTS 24 23 22 21 20 19 18 1 2 3 4 5 6 7 T1IN T2IN R2OUT VCC R2IN V+ GND R1IN R1OUT TOP VIEW MAX209 MAX209 T2OUT T1OUT R3IN R5IN V- 8 17 R3OUT 9 16 T3IN R5OUT 10 15 N.C. R4OUT 11 14 EN R4IN 12 13 T3OUT C+ C- DIP/SO 5kΩ R2OUT R2IN 21 R2 22 1 5kΩ R1OUT R1IN 2 R1 5kΩ R3OUT R3IN 18 R3 17 5kΩ R4OUT R4IN N.C. 12 15 R4 11 5kΩ R5OUT R5IN 9 R5 10 14 EN MAX209 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 19 GND T1OUT T3OUT T4OUT T2OUT +5V +5V +5V +5V T1IN T2IN T3IN T4IN 7 6 20 21 TTL/CMOS INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS RS-232 INPUTS 10 28 1 3 2 T1 T2 T3 T4 R1OUT R1IN R2IN R3IN R4IN R5IN SHDN R2OUT R3OUT R4OUT R5OUT EN 8 5 26 22 19 24 25 9 4 27 23 18 R1 R2 R3 R4 R5 TOP VIEW 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ 28 27 26 25 24 23 21 1 2 3 4 5 6 8 T4OUT R3IN R3OUT R2IN SHDN T2OUT T1OUT T3OUT R4IN R1OUT T4IN T2IN T1IN 7 22 R4OUT GND 10 19 R5OUT R1IN 9 20 T3IN C1+ 12 17 VVCC 11 18 R5IN C1- 14 15 C2+ V+ 13 16 C2- R2OUT SO/SSOP +5V INPUT +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER C1+ C1- C2+ C2- 11 13 12 0.1µF +6.3V 0.1µF +16V 0.1µF +16V 0.1µF +6.3V V+ V- 14 15 16 17 VCC EN 400kΩ 400kΩ 400kΩ 400kΩ 0.1µF MAX211 MAX211 MAX211 Pin Configuration/Typical Operating Circuit MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 20 TOP VIEW 28 27 26 25 24 23 21 1 2 3 4 5 6 8 T4OUT R3IN R3OUT R2IN SHDN T2OUT T1OUT T3OUT MAX213 R4IN* R1OUT T4IN T2IN T1 7 22 R4OUT* IN GND 10 19 R5OUT* R1IN 9 20 T3IN C1+ 12 17 VVCC 11 18 R5IN* C1- 14 15 C2+ V+ 13 16 C2- R2OUT SO/SSOP EN GND T1OUT T3OUT T4OUT T2OUT +5V +5V +5V +5V T1IN T2IN T3IN T4IN 7 6 20 21 TTL/CMOS INPUTS RS-232 OUTPUTS TTL/CMOS OUTPUTS RS-232 INPUTS 10 28 1 3 2 T1 T2 T3 T4 R1OUT R1IN R2IN R3IN R4IN* R5IN* SHDN R2OUT R3OUT R4OUT* R5OUT* EN 8 5 26 22 19 24 25 9 4 27 23 18 R1 R2 R3 R4 R5 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ +5V INPUT +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER C1+ C1- C2+ C2- 11 13 12 0.1µF +6.3V 0.1µF +16V 0.1µF +16V 0.1µF +6.3V V+ V- 14 15 16 17 VCC 400kΩ 400kΩ 400kΩ 400kΩ 0.1µF MAX213 *ACTIVE IN SHUTDOWN MAX213 Pin Configuration/Typical Operating Circuit *Contact factory for dice specifications. PART TEMP RANGE PIN-PACKAGE MAX200CPP 0°C to +70°C 20 Plastic DIP MAX200CWP 0°C to +70°C 20 Wide SO MAX200EPP -40°C to +85°C 20 Plastic DIP MAX200EWP -40°C to +85°C 20 Wide SO MAX201CPD 0°C to +70°C 14 Plastic DIP MAX201CWE 0°C to +70°C 16 Wide SO MAX201C/D 0°C to +70°C Dice* MAX201EPD -40°C to +85°C 14 Plastic DIP MAX201EWE -40°C to +85°C 16 Wide SO MAX202CPE 0°C to +70°C 16 Plastic DIP MAX202CSE 0°C to +70°C 16 Narrow SO MAX202CWE 0°C to +70°C 16 Wide SO MAX202C/D 0°C to +70°C Dice* MAX202EPE -40°C to +85°C 16 Plastic DIP MAX202ESE -40°C to +85°C 16 Narrow SO MAX202EWE -40°C to +85°C 16 Wide SO MAX203CPP 0°C to +70°C 20 Plastic DIP MAX203CWP 0°C to +70°C 20 Wide SO MAX203EPP -40°C to +85°C 20 Plastic DIP MAX203EWP -40°C to +85°C 20 Wide SO MAX204CPE 0°C to +70°C 16 Plastic DIP MAX204CWE 0°C to +70°C 16 Wide SO MAX204C/D 0°C to +70°C Dice* MAX204EPE -40°C to +85°C 16 Plastic DIP MAX204EWE -40°C to +85°C 16 Wide SO MAX205CPG 0°C to +70°C 24 Wide Plastic DIP MAX205EPG -40°C to +85°C 24 Wide Plastic DIP MAX206CNG 0°C to +70°C 24 Narrow Plastic DIP MAX206CWG 0°C to +70°C 24 Wide SO MAX206CAG 0°C to +70°C 24 SSOP MAX206ENG -40°C to +85°C 24 Narrow Plastic DIP PART TEMP RANGE PIN-PACKAGE MAX206EWG -40°C to +85°C 24 Wide SO MAX206EAG -40°C to +85°C 24 SSOP MAX207CNG 0°C to +70°C 24 Narrow Plastic DIP MAX207CWG 0°C to +70°C 24 Wide SO MAX207CAG 0°C to +70°C 24 SSOP MAX207ENG -40°C to +85°C 24 Narrow Plastic DIP MAX207EWG -40°C to +85°C 24 Wide SO MAX207EAG -40°C to +85°C 24 SSOP MAX208CNG 0°C to +70°C 24 Narrow Plastic DIP MAX208CWG 0°C to +70°C 24 Wide SO MAX208CAG 0°C to +70°C 24 SSOP MAX208C/D 0°C to +70°C Dice* MAX208ENG -40°C to +85°C 24 Narrow Plastic DIP MAX208EWG -40°C to +85°C 24 Wide SO MAX208EAG -40°C to +85°C 24 SSOP MAX209CNG 0°C to +70°C 24 Narrow Plastic DIP MAX209CWG 0°C to +70°C 24 Wide SO MAX209C/D 0°C to +70°C Dice* MAX209ENG -40°C to +85°C 24 Narrow Plastic DIP MAX209EWG -40°C to +85°C 24 Wide SO MAX211CWI 0°C to +70°C 28 Wide SO MAX211CAI 0°C to +70°C 28 SSOP MAX211C/D 0°C to +70°C Dice* MAX211EWI -40°C to +85°C 28 Wide SO MAX211EAI -40°C to +85°C 28 SSOP MAX213CWI 0°C to +70°C 28 Wide SO MAX213CAI 0°C to +70°C 28 SSOP MAX213C/D 0°C to +70°C Dice* MAX213EWI -40°C to +85°C 28 Wide SO MAX213EAI -40°C to +85°C 28 SSOP MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 21 Ordering Information PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 14 CDIP J14-3 21-0045 16 CDIP J16-3 21-0045 20 CDIP J20-2 21-0045 24 CDIP R24-4 21-0045 14 PDIP P14-3 21-0043 16 PDIP P16-1 21-0043 20 PDIP P20-3 21-0043 24 PDIP N24-2 21-0043 24 PDIP N24-3 21-0043 24 PDIP P24-1 21-0044 24 PDIP P24M-1 21-0044 16 SO S16-3 21-0041 16 SO W16-3 21-0042 16 SO W16-1 21-0042 20 SO W20M-1 21-0042 20 SO W20-3 21-0042 24 SO W24-2 21-0042 28 SO W28-1 21-0042 28 SO W28-2 21-0042 24 SSOP A24-3 21-0056 24 SSOP A24-2 21-0056 28 SSOP A28-1 21-0056 16 TSSOP U16-1 21-0066 PART POWER-SUPPLY VOLTAGE (V) NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS NUMBER OF RECEIVERS ACTIVE IN SHUTDOWN NUMBER OF EXTERNAL CAPACITORS (0.1μF) LOW-POWER SHUTDOWN/TTL THREE-STATE MAX204 +5 4 0 0 4 No/No MAX205 +5 5 5 0 None Yes/Yes MAX206 +5 4 3 0 4 Yes/Yes MAX207 +5 5 3 0 4 No/No MAX208 +5 4 4 0 4 No/No MAX209 +5 and +9.0 to +13.2 3 5 0 2 No/Yes MAX211 +5 4 5 0 4 Yes/Yes MAX213 +5 4 5 2 4 Yes/Yes MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors www.maximintegrated.com Maxim Integrated │ 22 Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Selector Guide (continued) REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 6 10/03 Changed the Features section and section information to the Next-Generation Device Features section. 1 7 12/05 Added Note 1 to the Absolute Maximum Ratings section. 2 8 1/15 Updated page 1 content 1 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. MAX200–MAX209/ MAX211/MAX213 +5V, RS-232 Transceivers with 0.1μF External Capacitors © 2015 Maxim Integrated Products, Inc. │ 23 Revision History For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. General Description The MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 are low-power transceivers for RS-485 and RS- 422 communication. Each part contains one driver and one receiver. The MAX483, MAX487, MAX488, and MAX489 feature reduced slew-rate drivers that minimize EMI and reduce reflections caused by improperly terminated cables, thus allowing error-free data transmission up to 250kbps. The driver slew rates of the MAX481, MAX485, MAX490, MAX491, and MAX1487 are not limited, allowing them to transmit up to 2.5Mbps. These transceivers draw between 120µA and 500µA of supply current when unloaded or fully loaded with disabled drivers. Additionally, the MAX481, MAX483, and MAX487 have a low-current shutdown mode in which they consume only 0.1µA. All parts operate from a single 5V supply. Drivers are short-circuit current limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-impedance state. The receiver input has a fail-safe feature that guarantees a logic-high output if the input is open circuit. The MAX487 and MAX1487 feature quarter-unit-load receiver input impedance, allowing up to 128 MAX487/ MAX1487 transceivers on the bus. Full-duplex communications are obtained using the MAX488–MAX491, while the MAX481, MAX483, MAX485, MAX487, and MAX1487 are designed for half-duplex applications. ________________________Applications Low-Power RS-485 Transceivers Low-Power RS-422 Transceivers Level Translators Transceivers for EMI-Sensitive Applications Industrial-Control Local Area Networks __Next Generation Device Features ♦ For Fault-Tolerant Applications MAX3430: ±80V Fault-Protected, Fail-Safe, 1/4 Unit Load, +3.3V, RS-485 Transceiver MAX3440E–MAX3444E: ±15kV ESD-Protected, ±60V Fault-Protected, 10Mbps, Fail-Safe, RS-485/J1708 Transceivers ♦ For Space-Constrained Applications MAX3460–MAX3464: +5V, Fail-Safe, 20Mbps, Profibus RS-485/RS-422 Transceivers MAX3362: +3.3V, High-Speed, RS-485/RS-422 Transceiver in a SOT23 Package MAX3280E–MAX3284E: ±15kV ESD-Protected, 52Mbps, +3V to +5.5V, SOT23, RS-485/RS-422, True Fail-Safe Receivers MAX3293/MAX3294/MAX3295: 20Mbps, +3.3V, SOT23, RS-485/RS-422 Transmitters ♦ For Multiple Transceiver Applications MAX3030E–MAX3033E: ±15kV ESD-Protected, +3.3V, Quad RS-422 Transmitters ♦ For Fail-Safe Applications MAX3080–MAX3089: Fail-Safe, High-Speed (10Mbps), Slew-Rate-Limited RS-485/RS-422 Transceivers ♦ For Low-Voltage Applications MAX3483E/MAX3485E/MAX3486E/MAX3488E/ MAX3490E/MAX3491E: +3.3V Powered, ±15kV ESD-Protected, 12Mbps, Slew-Rate-Limited, True RS-485/RS-422 Transceivers MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. ______________________________________________________________Selection Table 19-0122; Rev 10; 9/14 PART NUMBER HALF/FULL DUPLEX DATA RATE (Mbps) SLEW-RATE LIMITED LOWPOWER SHUTDOWN RECEIVER/ DRIVER ENABLE QUIESCENT CURRENT (μA) NUMBER OF RECEIVERS ON BUS PIN COUNT MAX481 Half 2.5 No Yes Yes 300 32 8 MAX483 Half 0.25 Yes Yes Yes 120 32 8 MAX485 Half 2.5 No No Yes 300 32 8 MAX487 Half 0.25 Yes Yes Yes 120 128 8 MAX488 Full 0.25 Yes No No 120 32 8 MAX489 Full 0.25 Yes No Yes 120 32 14 MAX490 Full 2.5 No No No 300 32 8 MAX491 Full 2.5 No No Yes 300 32 14 MAX1487 Half 2.5 No No Yes 230 128 8 Ordering Information appears at end of data sheet. Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 2 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 ABSOLUTE MAXIMUM RATINGS Supply Voltage (VCC).............................................................12V Control Input Voltage (RE, DE)...................-0.5V to (VCC + 0.5V) Driver Input Voltage (DI).............................-0.5V to (VCC + 0.5V) Driver Output Voltage (A, B)...................................-8V to +12.5V Receiver Input Voltage (A, B).................................-8V to +12.5V Receiver Output Voltage (RO)....................-0.5V to (VCC + 0.5V) Continuous Power Dissipation (TA = +70°C) 8-Pin Plastic DIP (derate 9.09mW/°C above +70°C) ....727mW 14-Pin Plastic DIP (derate 10.00mW/°C above +70°C) ..800mW 8-Pin SO (derate 5.88mW/°C above +70°C).................471mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW 8-Pin µMAX (derate 4.1mW/°C above +70°C) ..............830mW 8-Pin CERDIP (derate 8.00mW/°C above +70°C).........640mW 14-Pin CERDIP (derate 9.09mW/°C above +70°C).......727mW Operating Temperature Ranges MAX4_ _C_ _/MAX1487C_ A ...............................0°C to +70°C MAX4_ _E_ _/MAX1487E_ A.............................-40°C to +85°C MAX4_ _M_/MAX1487MJA .............................-55°C to +125°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10sec) .............................+300°C DC ELECTRICAL CHARACTERISTICS (VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. V VIN = -7V VIN = 12V VIN = -7V VIN = 12V Input Current (A, B) IIN2 VTH -7V ≤ VCM ≤ 12V, MAX487/MAX1487 48 kΩ Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V, all devices except MAX487/MAX1487 R = 27Ω (RS-485), Figure 4 0.4V ≤ VO ≤ 2.4V R = 50Ω (RS-422) IO = 4mA, VID = -200mV IO = -4mA, VID = 200mV VCM = 0V -7V ≤ VCM ≤ 12V DE, DI, RE DE, DI, RE MAX487/MAX1487, DE = 0V, VCC = 0V or 5.25V DE, DI, RE R = 27Ω or 50Ω, Figure 4 R = 27Ω or 50Ω, Figure 4 R = 27Ω or 50Ω, Figure 4 DE = 0V; VCC = 0V or 5.25V, all devices except MAX487/MAX1487 CONDITIONS 12 kΩ IOZR ±1 µA Three-State (high impedance) Output Current at Receiver V Receiver Output Low Voltage VOL 0.4 Receiver Output High Voltage VOH 3.5 Receiver Input Hysteresis ΔVTH 70 mV -0.2 0.2 V Receiver Differential Threshold Voltage -0.2 mA 0.25 mA -0.8 1.0 1.5 5 VOD2 Differential Driver Output (with load) V 2 Differential Driver Output (no load) VOD1 5 V Input Current IIN1 ±2 µA Input Low Voltage VIL 0.8 V Input High Voltage VIH 2.0 V ΔVOD 0.2 V Change in Magnitude of Driver Common-Mode Output Voltage for Complementary Output States ΔVOD 0.2 V Change in Magnitude of Driver Differential Output Voltage for Complementary Output States VOC 3 V Driver Common-Mode Output Voltage PARAMETER SYMBOL MIN TYP MAX UNITS Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 3 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487 (VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2) DC ELECTRICAL CHARACTERISTICS (continued) (VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2) Receiver Short-Circuit Current IOSR 0V ≤ VO ≤ VCC 7 95 mA IOSD2 -7V ≤ VO ≤12V (Note 4) 35 250 mA Driver Short-Circuit Current, VO = Low IOSD1 -7V ≤ VO ≤12V (Note 4) 35 250 mA Driver Short-Circuit Current, VO = High MAX1487, RE = 0V or VCC 250 400 350 650 ns tPHL 10 30 60 Driver Rise or Fall Time Figures 6 and 8, RDIFF = 54Ω, CL1 = CL2 = 100pF ns MAX490M, MAX491M MAX490C/E, MAX491C/E 20 90 150 MAX481, MAX485, MAX1487 MAX490M, MAX491M MAX490C/E, MAX491C/E MAX481, MAX485, MAX1487 Figures 6 and 8, RDIFF = 54Ω, CL1 = CL2 = 100pF MAX481 (Note 5) Figures 5 and 11, CRL = 15pF, S2 closed Figures 5 and 11, CRL = 15pF, S1 closed Figures 5 and 11, CRL = 15pF, S2 closed Figures 5 and 11, CRL = 15pF, S1 closed Figures 6 and 10, RDIFF = 54Ω, CL1 = CL2 = 100pF Figures 6 and 8, RDIFF = 54Ω, CL1 = CL2 = 100pF Figures 6 and 10, RDIFF = 54Ω, CL1 = CL2 = 100pF CONDITIONS ns tSKEW 5 10 Time to Shutdown tSHDN 50 200 600 ns Maximum Data Rate fMAX 2.5 Mbps Receiver Disable Time from High tHZ 20 50 ns ns tPLH 10 30 60 Receiver Disable Time from Low tLZ 20 50 tZH 20 50 ns Driver Input to Output Receiver Enable to Output High Receiver Enable to Output Low tZL 20 50 ns 20 90 200 ns ns 13 tHZ 40 70 tSKD Driver Disable Time from High | tPLH - tPHL | Differential Receiver Skew Driver Disable Time from Low tLZ 40 70 ns ns Driver Enable to Output Low tZL 40 70 3 15 40 ns 5 15 25 ns 3 15 40 tR, tF 20 90 200 Driver Output Skew to Output Receiver Input to Output tPLH, tPHL Driver Enable to Output High tZH 40 70 PARAMETER SYMBOL MIN TYP MAX UNITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 230 400 300 500 MAX481/MAX485, RE = 0V or VCC 500 900 MAX490/MAX491, DE, DI, RE = 0V or VCC 300 500 MAX488/MAX489, DE, DI, RE = 0V or VCC 120 250 DE = VCC DE = 0V 300 500 DE = VCC DE = 0V Supply Current in Shutdown ISHDN MAX481/483/487, DE = 0V, RE = VCC 0.1 10 µA 120 250 ICC No-Load Supply Current (Note 3) DE = 5V DE = 0V MAX483 MAX487 MAX483/MAX487, RE = 0V or VCC Figures 7 and 9, CL = 100pF, S2 closed Figures 7 and 9, CL = 100pF, S1 closed Figures 7 and 9, CL = 15pF, S1 closed Figures 7 and 9, CL = 15pF, S2 closed µA Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 4 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 SWITCHING CHARACTERISTICS—MAX483, MAX487/MAX488/MAX489 (VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2) SWITCHING CHARACTERISTICS—MAX481/MAX485, MAX490/MAX491, MAX1487 (continued) (VCC = 5V ±5%, TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2) 300 1000 Figures 7 and 9, CL = 100pF, S2 closed Figures 7 and 9, CL = 100pF, S1 closed Figures 5 and 11, CL = 15pF, S2 closed, A - B = 2V CONDITIONS tZH(SHDN) 40 100 ns Driver Enable from Shutdown to Output High (MAX481) ns Figures 5 and 11, CL = 15pF, S1 closed, B - A = 2V tZL(SHDN) Receiver Enable from Shutdown to Output Low (MAX481) tZL(SHDN) 40 100 ns Driver Enable from Shutdown to Output Low (MAX481) tZH(SHDN) 300 1000 ns Receiver Enable from Shutdown to Output High (MAX481) PARAMETER SYMBOL MIN TYP MAX UNITS tPLH tSKEW Figures 6 and 8, RDIFF = 54Ω, CL1 = CL2 = 100pF tPHL Figures 6 and 8, RDIFF = 54Ω, CL1 = CL2 = 100pF Driver Input to Output Driver Output Skew to Output 100 800 ns ns 2000 ns MAX483/MAX487, Figures 7 and 9, CL = 100pF, S2 closed tZH(SHDN) Driver Enable from Shutdown to Output High 250 2000 2500 ns MAX483/MAX487, Figures 5 and 11, CL = 15pF, S1 closed tZL(SHDN) Receiver Enable from Shutdown to Output Low 2500 ns MAX483/MAX487, Figures 5 and 11, CL = 15pF, S2 closed tZH(SHDN) Receiver Enable from Shutdown to Output High 2000 ns MAX483/MAX487, Figures 7 and 9, CL = 100pF, S1 closed tZL(SHDN) Driver Enable from Shutdown to Output Low Time to Shutdown tSHDN MAX483/MAX487 (Note 5) 50 200 600 ns tPHL tPLH, tPHL < 50% of data period Figures 5 and 11, CRL = 15pF, S2 closed Figures 5 and 11, CRL = 15pF, S1 closed Figures 5 and 11, CRL = 15pF, S2 closed Figures 5 and 11, CRL = 15pF, S1 closed Figures 7 and 9, CL = 15pF, S2 closed Figures 6 and 10, RDIFF = 54Ω, CL1 = CL2 = 100pF Figures 7 and 9, CL = 15pF, S1 closed Figures 7 and 9, CL = 100pF, S1 closed Figures 7 and 9, CL = 100pF, S2 closed CONDITIONS fMAX 250 kbps 250 800 2000 Maximum Data Rate Receiver Disable Time from High tHZ 20 50 ns ns 250 800 2000 Receiver Disable Time from Low tLZ 20 50 Receiver Enable to Output High tZH 20 50 ns Receiver Enable to Output Low tZL 20 50 ns ns ns 100 tHZ 300 3000 tSKD Driver Disable Time from High I tPLH - tPHL I Differential Receiver Skew Figures 6 and 10, RDIFF = 54Ω, CL1 = CL2 = 100pF Driver Disable Time from Low tLZ 300 3000 ns Driver Enable to Output Low tZL 250 2000 ns ns Figures 6 and 8, RDIFF = 54Ω, CL1 = CL2 = 100pF tR, tF 250 2000 ns 250 2000 Driver Rise or Fall Time ns tPLH Receiver Input to Output Driver Enable to Output High tZH 250 2000 PARAMETER SYMBOL MIN TYP MAX UNITS MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487 30 0 0 2.5 OUTPUT CURRENT vs. RECEIVER OUTPUT LOW VOLTAGE 5 25 MAX481-01 OUTPUT LOW VOLTAGE (V) OUTPUT CURRENT (mA) 1.5 15 10 0.5 1.0 2.0 20 35 40 45 0.9 0.1 -50 -25 25 75 RECEIVER OUTPUT LOW VOLTAGE vs. TEMPERATURE 0.3 0.7 TEMPERATURE (°C) OUTPUT LOW VOLTAGE (V) 0 50 0.5 0.8 0.2 0.6 0.4 0 100 125 IRO = 8mA MAX481-04 -20 -4 1.5 2.0 3.0 5.0 OUTPUT CURRENT vs. RECEIVER OUTPUT HIGH VOLTAGE -8 -16 MAX481-02 OUTPUT HIGH VOLTAGE (V) OUTPUT CURRENT (mA) 2.5 4.0 -12 -18 -6 -14 -10 -2 0 3.5 4.5 4.8 3.2 -50 -25 25 75 RECEIVER OUTPUT HIGH VOLTAGE vs. TEMPERATURE 3.6 4.4 TEMPERATURE (°C) OUTPUT HIGH VOLTAGE (V) 0 50 4.0 4.6 3.4 4.2 3.8 3.0 100 125 IRO = 8mA MAX481-03 90 0 0 1.0 3.0 4.5 DRIVER OUTPUT CURRENT vs. DIFFERENTIAL OUTPUT VOLTAGE 10 70 MAX481-05 DIFFERENTIAL OUTPUT VOLTAGE (V) OUTPUT CURRENT (mA) 2.0 4.0 50 30 80 60 40 20 0.5 1.5 2.5 3.5 2.3 1.5 -50 -25 25 125 DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs. TEMPERATURE 1.7 2.1 MAX481-06 TEMPERATURE (°C) DIFFERENTIAL OUTPUT VOLTAGE (V) 0 75 1.9 2.2 1.6 2.0 1.8 50 100 2.4 R = 54Ω __________________________________________Typical Operating Characteristics (VCC = 5V, TA = +25°C, unless otherwise noted.) Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 5 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 NOTES FOR ELECTRICAL/SWITCHING CHARACTERISTICS Note 1: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. Note 2: All typical specifications are given for VCC = 5V and TA = +25°C. Note 3: Supply current specification is valid for loaded transmitters when DE = 0V. Note 4: Applies to peak current. See Typical Operating Characteristics. Note 5: The MAX481/MAX483/MAX487 are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 50ns, the parts are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered shutdown. See Low-Power Shutdown Mode (MAX481/MAX483/MAX487) section. MAX481/MAX483/MAX485/MAX487–MAX491/MAX1487 ____________________________Typical Operating Characteristics (continued) (VCC = 5V, TA = +25°C, unless otherwise noted.) 120 0 0 8 OUTPUT CURRENT vs. DRIVER OUTPUT LOW VOLTAGE 20 100 MAX481-07 OUTPUT LOW VOLTAGE (V) OUTPUT CURRENT (mA) 6 60 40 2 4 80 10 12 140 -120 0 -7 -5 -1 5 OUTPUT CURRENT vs. DRIVER OUTPUT HIGH VOLTAGE -20 -80 MAX481-08 OUTPUT HIGH VOLTAGE (V) OUTPUT CURRENT (mA) -3 1 -60 -6 -4 -2 0 2 4 3 -100 -40 100 -60 -20 40 100 120 -40 MAX1487 SUPPLY CURRENT vs. TEMPERATURE 300 MAX481-13 TEMPERATURE (°C) SUPPLY CURRENT (μA) 20 60 80 500 200 600 400 0 0 140 MAX1487; DE = VCC, RE = X MAX1487; DE = 0V, RE = X 100 -50 -25 50 100 MAX481/MAX485/MAX490/MAX491 SUPPLY CURRENT vs. TEMPERATURE 300 MAX481-11 TEMPERATURE (°C) SUPPLY CURRENT (μA) 25 75 500 200 600 400 0 0 125 MAX481/MAX485; DE = VCC, RE = X MAX481; DE = 0, RE = VCC MAX485; DE = 0, RE = X, MAX481; DE = RE = 0 MAX490/MAX491; DE = RE = X 100 -50 -25 50 100 MAX483/MAX487–MAX489 SUPPLY CURRENT vs. TEMPERATURE 300 MAX481-12 TEMPERATURE (°C) SUPPLY CURRENT (μA) 25 75 500 200 600 400 0 0 125 MAX483; DE = VCC, RE = X MAX487; DE = VCC, RE = X MAX483/MAX487; DE = 0, RE = VCC MAX483/MAX487; DE = RE = 0, MAX488/MAX489; DE = RE = X Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 6 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 7 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 ______________________________________________________________Pin Description MAX481 MAX483 MAX485 MAX487 MAX1487 TOP VIEW NOTE: PIN LABELS Y AND Z ON TIMING, TEST, AND WAVEFORM DIAGRAMS REFER TO PINS A AND B WHEN DE IS HIGH. TYPICAL OPERATING CIRCUIT SHOWN WITH DIP/SO PACKAGE. 1 2 3 4 8 5 VCC DI GND DE RE RO R D Rt Rt 7 6 D R DE RE DI RO A B 1 2 3 4 8 7 6 5 VCC B A DI GND DE RE RO DIP/SO R D 1 2 3 4 8 7 6 5 VCC A GND RE DE B RO μMAX B A DI MAX481 MAX483 MAX485 MAX487 MAX1487 Figure 1. MAX481/MAX483/MAX485/MAX487/MAX1487 Pin Configuration and Typical Operating Circuit µMAX — — 5 6 7 8 — 2 — 1 3 — µMAX 4 5 6 7 — — 8 — 1 — 2 — DIP/SO DIP/SO 2 3 Receiver Output Enable. RO is enabled when RE is low; RO is high impedance when RE is high. 3 4 Driver Output Enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low. If the driver outputs are enabled, the parts function as line drivers. While they are high impedance, they function as line receivers if RE is low. DIP/SO — 4 5 Driver Input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. 5 6, 7 Ground — 9 Noninverting Driver Output — 10 Inverting Driver Output — 3 4 6 — Noninverting Receiver Input and Noninverting Driver Output — 12 Noninverting Receiver Input 5 6 — 8 RE DE DI GND Y Z A A 7 — — B Inverting Receiver Input and Inverting Driver Output — 7 11 B Inverting Receiver Input 8 1 14 VCC Positive Supply: 4.75V ≤ VCC ≤ 5.25V — — 1, 8, 13 N.C. No Connect—not internally connected NAME FUNCTION 1 3 4 2 Receiver Output: If A > B by 200mV, RO will be high; If A < B by 200mV, RO will be low. 2 RO PIN NAME FUNCTION MAX481/MAX483/ MAX485/MAX487/ MAX1487 MAX488/ MAX490 MAX489/ MAX491 Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 8 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 __________Applications Information The MAX481/MAX483/MAX485/MAX487–MAX491 and MAX1487 are low-power transceivers for RS-485 and RS- 422 communications. The MAX481, MAX485, MAX490, MAX491, and MAX1487 can transmit and receive at data rates up to 2.5Mbps, while the MAX483, MAX487, MAX488, and MAX489 are specified for data rates up to 250kbps. The MAX488–MAX491 are full-duplex transceivers while the MAX481, MAX483, MAX485, MAX487, and MAX1487 are half-duplex. In addition, Driver Enable (DE) and Receiver Enable (RE) pins are included on the MAX481, MAX483, MAX485, MAX487, MAX489, MAX491, and MAX1487. When disabled, the driver and receiver outputs are high impedance. MAX487/MAX1487: 128 Transceivers on the Bus The 48kΩ, 1/ 4-unit-load receiver input impedance of the MAX487 and MAX1487 allows up to 128 transceivers on a bus, compared to the 1-unit load (12kΩ input impedance) of standard RS-485 drivers (32 transceivers maximum). Any combination of MAX487/ MAX1487 and other RS-485 transceivers with a total of 32 unit loads or less can be put on the bus. The MAX481/MAX483/MAX485 and MAX488–MAX491 have standard 12kΩ Receiver Input impedance. MAX488 MAX490 TOP VIEW 1 2 3 4 RO DI GND 8 7 6 5 A B Z Y VCC DIP/SO R D Rt Rt VCC 5 6 7 8 RO DI GND 4 GND DI RO 3 2 A B Y Z VCC D R R D 1 VCC 3 RO 4 A 2 1 6 5 7 8 GND DI Y B Z μMAX MAX488 MAX490 NOTE: TYPICAL OPERATING CIRCUIT SHOWN WITH DIP/SO PACKAGE. MAX489 MAX491 DIP/SO TOP VIEW Rt Rt DE VCC RE GND VCC RE GND DE RO DI 9 10 12 11 B A Z Y 5 RO NC DI 2 1, 8, 13 3 6, 7 4 14 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VCC N.C. N.C. A B Z Y N.C. RO RE DE DI GND GND R D D R D R Figure 2. MAX488/MAX490 Pin Configuration and Typical Operating Circuit Figure 3. MAX489/MAX491 Pin Configuration and Typical Operating Circuit Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 9 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 MAX483/MAX487/MAX488/MAX489: Reduced EMI and Reflections The MAX483 and MAX487–MAX489 are slew-rate limited, minimizing EMI and reducing reflections caused by improperly terminated cables. Figure 12 shows the driver output waveform and its Fourier analysis of a 150kHz signal transmitted by a MAX481, MAX485, MAX490, MAX491, or MAX1487. High-frequency harmonics with large amplitudes are evident. Figure 13 shows the same information displayed for a MAX483, MAX487, MAX488, or MAX489 transmitting under the same conditions. Figure 13’s high-frequency harmonics have much lower amplitudes, and the potential for EMI is significantly reduced. R R Y Z VOD VOC RECEIVER OUTPUT TEST POINT 1kΩ 1kΩ S1 S2 VCC CRL 15pF DI DE 3V Y Z CL1 CL2 A B RO RE RDIFF VID OUTPUT UNDER TEST 500Ω S1 S2 VCC CL _________________________________________________________________Test Circuits Figure 4. Driver DC Test Load Figure 5. Receiver Timing Test Load Figure 6. Driver/Receiver Timing Test Circuit Figure 7. Driver Timing Test Load Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 10 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 _______________________________________________________Switching Waveforms DI 3V 0V Z Y VO 0V -VO VO 1.5V tPLH 1/2 VO 10% tR 90% 90% tPHL 1.5V 1/2 VO 10% tF VDIFF = V (Y) - V (Z) VDIFF tSKEW = | tPLH - tPHL | OUTPUT NORMALLY LOW OUTPUT NORMALLY HIGH 3V 0V Y, Z VOL Y, Z 0V 1.5V 1.5V VOL + 0.5V 2.3V VOH - 0.5V 2.3V tZL(SHDN), tZL tLZ tZH(SHDN), tZH tHZ DE VOH VOL VID -VID 1.5V 0V 1.5V OUTPUT INPUT 0V RO A-B tPHL tPLH OUTPUT NORMALLY LOW OUTPUT NORMALLY HIGH 3V 0V VCC RO RO 0V 1.5V 1.5V VOL + 0.5V 1.5V VOH - 0.5V 1.5V tZL(SHDN), tZL tLZ tZH(SHDN), tZH tHZ RE _________________Function Tables (MAX481/MAX483/MAX485/MAX487/MAX1487) Figure 8. Driver Propagation Delays Figure 9. Driver Enable and Disable Times (except MAX488 and MAX490) Figure 10. Receiver Propagation Delays Figure 11. Receiver Enable and Disable Times (except MAX488 and MAX490) Table 1. Transmitting Table 2. Receiving INPUTS OUTPUT RE DE A-B RO 0 0 0 1 0 0 0 0 > +0.2V < -0.2V Inputs open X 1 0 1 High-Z* INPUTS OUTPUTS RE DE DI Z Y X X 0 1 1 1 0 0 1 0 X X 0 1 High-Z High-Z* 1 0 High-Z High-Z* X = Don’t care High-Z = High impedance *Shutdown mode for MAX481/MAX483/MAX487 X = Don’t care High-Z = High impedance *Shutdown mode for MAX481/MAX483/MAX487 Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 11 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Low-Power Shutdown Mode (MAX481/MAX483/MAX487) A low-power shutdown mode is initiated by bringing both RE high and DE low. The devices will not shut down unless both the driver and receiver are disabled. In shutdown, the devices typically draw only 0.1µA of supply current. RE and DE may be driven simultaneously; the parts are guaranteed not to enter shutdown if RE is high and DE is low for less than 50ns. If the inputs are in this state for at least 600ns, the parts are guaranteed to enter shutdown. For the MAX481, MAX483, and MAX487, the tZH and tZL enable times assume the part was not in the lowpower shutdown state (the MAX485/MAX488–MAX491 and MAX1487 can not be shut down). The tZH(SHDN) and tZL(SHDN) enable times assume the parts were shut down (see Electrical Characteristics). It takes the drivers and receivers longer to become enabled from the low-power shutdown state (tZH(SHDN), tZL(SHDN)) than from the operating mode (tZH, tZL). (The parts are in operating mode if the – R —E – , DE inputs equal a logical 0,1 or 1,1 or 0, 0.) Driver Output Protection Excessive output current and power dissipation caused by faults or by bus contention are prevented by two mechanisms. A foldback current limit on the output stage provides immediate protection against short circuits over the whole common-mode voltage range (see Typical Operating Characteristics). In addition, a thermal shutdown circuit forces the driver outputs into a high-impedance state if the die temperature rises excessively. Propagation Delay Many digital encoding schemes depend on the difference between the driver and receiver propagation delay times. Typical propagation delays are shown in Figures 15–18 using Figure 14’s test circuit. The difference in receiver delay times, | tPLH - tPHL |, is typically under 13ns for the MAX481, MAX485, MAX490, MAX491, and MAX1487 and is typically less than 100ns for the MAX483 and MAX487–MAX489. The driver skew times are typically 5ns (10ns max) for the MAX481, MAX485, MAX490, MAX491, and MAX1487, and are typically 100ns (800ns max) for the MAX483 and MAX487–MAX489. 10dB/div 0Hz 5MHz 500kHz/div 10dB/div 0Hz 5MHz 500kHz/div Figure 12. Driver Output Waveform and FFT Plot of MAX481/ MAX485/MAX490/MAX491/MAX1487 Transmitting a 150kHz Signal Figure 13. Driver Output Waveform and FFT Plot of MAX483/ MAX487–MAX489 Transmitting a 150kHz Signal Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 12 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 TTL IN tR, tF < 6ns D R 100pF B 100pF A RECEIVER OUT R = 54Ω Z Y 500mV/div 20ns/div A B RO 2V/div VCC = 5V TA = +25°C 500mV/div 20ns/div A B RO 2V/div VCC = 5V TA = +25°C 500mV/div 400ns/div A B RO 2V/div VCC = 5V TA = +25°C 500mV/div 400ns/div A B RO 2V/div VCC = 5V TA = +25°C Figure 14. Receiver Propagation Delay Test Circuit Figure 15. MAX481/MAX485/MAX490/MAX491/MAX1487 Receiver tPHL Figure 16. MAX481/MAX485/MAX490/MAX491/MAX1487 Receiver tPLH Figure 17. MAX483, MAX487–MAX489 Receiver tPHL Figure 18. MAX483, MAX487–MAX489 Receiver tPLH Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 13 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Line Length vs. Data Rate The RS-485/RS-422 standard covers line lengths up to 4000 feet. For line lengths greater than 4000 feet, see Figure 23. Figures 19 and 20 show the system differential voltage for the parts driving 4000 feet of 26AWG twisted-pair wire at 110kHz into 120Ω loads. Typical Applications The MAX481, MAX483, MAX485, MAX487–MAX491, and MAX1487 transceivers are designed for bidirectional data communications on multipoint bus transmission lines. Figures 21 and 22 show typical network applications circuits. These parts can also be used as line repeaters, with cable lengths longer than 4000 feet, as shown in Figure 23. To minimize reflections, the line should be terminated at both ends in its characteristic impedance, and stub lengths off the main line should be kept as short as possible. The slew-rate-limited MAX483 and MAX487–MAX489 are more tolerant of imperfect termination. DI VY-VZ RO 5V 0V 1V 0V -1V 5V 0V 2μs/div DI VY-VZ RO 5V 0V 1V 0V -1V 5V 0V 2μs/div DI RO DE RE A B RE RE RE RO RO RO DI DI DI DE DE DE D D D R R R B B B A A A 120Ω 120Ω D R MAX481 MAX483 MAX485 MAX487 MAX1487 Figure 19. MAX481/MAX485/MAX490/MAX491/MAX1487 System Differential Voltage at 110kHz Driving 4000ft of Cable Figure 20. MAX483, MAX487–MAX489 System Differential Voltage at 110kHz Driving 4000ft of Cable Figure 21. MAX481/MAX483/MAX485/MAX487/MAX1487 Typical Half-Duplex RS-485 Network Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 14 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Figure 22. MAX488–MAX491 Full-Duplex RS-485 Network 120Ω 120Ω R D RO RE DE DI A B Y 120Ω 120Ω DI DI DI RO RO RO DE DE DE RE RE RE Z Z Z Z Y Y Y A A A B B B D D D R R R MAX488–MAX491 NOTE: RE AND DE ON MAX489/MAX491 ONLY. Figure 23. Line Repeater for MAX488–MAX491 120Ω 120Ω DATA IN DATA OUT R D RO RE DE DI A B Z Y MAX488–MAX491 NOTE: RE AND DE ON MAX489/MAX491 ONLY. Isolated RS-485 For isolated RS-485 applications, see the MAX253 and MAX1480 data sheets. Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers Maxim Integrated 15 MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 _______________Ordering Information *Contact factory for dice specifications. MAX489MJD -55°C to +125°C 14 CERDIP MAX489ESD -40°C to +85°C 14 SO MAX489EPD -40°C to +85°C 14 Plastic DIP MAX489C/D 0°C to +70°C Dice* MAX489CSD 0°C to +70°C 14 SO MAX489CPD 0°C to +70°C 14 Plastic DIP MAX488MJA -55°C to +125°C 8 CERDIP MAX488ESA -40°C to +85°C 8 SO MAX488EPA -40°C to +85°C 8 Plastic DIP MAX488C/D 0°C to +70°C Dice* MAX488CSA 0°C to +70°C 8 SO MAX488CPA 0°C to +70°C 8 Plastic DIP MAX487MJA -55°C to +125°C 8 CERDIP MAX487ESA -40°C to +85°C 8 SO MAX487EPA -40°C to +85°C 8 Plastic DIP MAX487C/D 0°C to +70°C Dice* MAX487CSA 0°C to +70°C 8 SO MAX487CPA 0°C to +70°C 8 Plastic DIP MAX485MJA -55°C to +125°C 8 CERDIP MAX485ESA -40°C to +85°C 8 SO MAX485EPA -40°C to +85°C 8 Plastic DIP MAX485C/D 0°C to +70°C Dice* MAX485CSA 0°C to +70°C 8 SO MAX485CPA 0°C to +70°C 8 Plastic DIP MAX483MJA -55°C to +125°C 8 CERDIP MAX483ESA -40°C to +85°C 8 SO MAX483EPA -40°C to +85°C 8 Plastic DIP MAX481MJA -55°C to +125°C 8 CERDIP MAX481CPA 0°C to +70°C 8 Plastic DIP PART TEMP RANGE PIN-PACKAGE MAX491MJD -55°C to +125°C 14 CERDIP MAX491ESD -40°C to +85°C 14 SO MAX491EPD -40°C to +85°C 14 Plastic DIP MAX491C/D 0°C to +70°C Dice* MAX491CSD 0°C to +70°C 14 SO MAX491CPD 0°C to +70°C 14 Plastic DIP MAX490MJA -55°C to +125°C 8 CERDIP MAX490ESA -40°C to +85°C 8 SO MAX490EPA -40°C to +85°C 8 Plastic DIP MAX490C/D 0°C to +70°C Dice* MAX490CPA 0°C to +70°C 8 Plastic DIP PART TEMP RANGE PIN-PACKAGE MAX481ESA -40°C to +85°C 8 SO MAX485CUA 0°C to +70°C 8 µMAX MAX487CUA 0°C to +70°C 8 µMAX MAX488CUA 0°C to +70°C 8 µMAX MAX490CSA 0°C to +70°C 8 SO MAX490CUA 0°C to +70°C 8 µMAX __Ordering Information (continued) MAX1487MJA -55°C to +125°C 8 CERDIP MAX1487ESA -40°C to +85°C 8 SO MAX1487EPA -40°C to +85°C 8 Plastic DIP MAX1487C/D 0°C to +70°C Dice* MAX1487CSA 0°C to +70°C 8 SO MAX1487CPA 0°C to +70°C 8 Plastic DIP MAX1487CUA 0°C to +70°C 8 µMAX MAX483CUA 0°C to +70°C 8 µMAX MAX483C/D 0°C to +70°C Dice* MAX483CSA 0°C to +70°C 8 SO MAX483CPA 0°C to +70°C 8 Plastic DIP MAX481EPA -40°C to +85°C 8 Plastic DIP MAX481C/D 0°C to +70°C Dice* MAX481CUA 0°C to +70°C 8 µMAX MAX481CSA 0°C to +70°C 8 SO MAX491MSD/PR-T -55°C to +125°C 14 CERDIP MAX491MSD/PR -55°C to +125°C 14 CERDIP Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers 16 Maxim Integrated MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Package Information For the latest package outline information and land patterns, go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 8 PDIP P8-1 21-0043 — 8 SO S8-2 21-0041 90-0096 8 MAX U8-1 21-0036 90-0092 8 CERDIP J8-2 21-0045 — 14 PDIP P14-3 21-0043 — 14 SO S14-1 21-0041 90-0112 14 CERDIP J14-3 21-0045 — Low-Power, Slew-Rate-Limited RS-485/RS-422 Transceivers MAX481/MAX483/MAX485/ MAX487–MAX491/MAX1487 Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 17 © 2014 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 0 1/93 Initial release. — 9 9/09 Changed column name in Selection Table to “Number of Receivers on Bus.” 1 10 9/14 Added MAX491MSD/PR and MAX491MSD/PR-T to data sheet. Updated Absolute Maximum Ratings. 2, 15 MAX3222/MAX3232/ MAX3237/MAX3241* 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors EVALUATION KIT AVAILABLE For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. 19-0273; Rev 7; 1/07 ________________General Description The MAX3222/MAX3232/MAX3237/MAX3241 transceivers have a proprietary low-dropout transmitter output stage enabling true RS-232 performance from a 3.0V to 5.5V supply with a dual charge pump. The devices require only four small 0.1µF external chargepump capacitors. The MAX3222, MAX3232, and MAX3241 are guaranteed to run at data rates of 120kbps while maintaining RS-232 output levels. The MAX3237 is guaranteed to run at data rates of 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232 output levels. The MAX3222/MAX3232 have 2 receivers and 2 drivers. The MAX3222 features a 1µA shutdown mode that reduces power consumption and extends battery life in portable systems. Its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1µA supply current. The MAX3222 and MAX3232 are pin, package, and functionally compatible with the industry-standard MAX242 and MAX232, respectively. The MAX3241 is a complete serial port (3 drivers/ 5 receivers) designed for notebook and subnotebook computers. The MAX3237 (5 drivers/3 receivers) is ideal for fast modem applications. Both these devices feature a shutdown mode in which all receivers can remain active while using only 1µA supply current. Receivers R1 (MAX3237/MAX3241) and R2 (MAX3241) have extra outputs in addition to their standard outputs. These extra outputs are always active, allowing external devices such as a modem to be monitored without forward biasing the protection diodes in circuitry that may have VCC completely removed. The MAX3222, MAX3232, and MAX3241 are available in space-saving TSSOP and SSOP packages. ________________________Applications Notebook, Subnotebook, and Palmtop Computers High-Speed Modems Battery-Powered Equipment Hand-Held Equipment Peripherals Printers __Next Generation Device Features ♦ For Smaller Packaging: MAX3228E/MAX3229E: +2.5V to +5.5V RS-232 Transceivers in UCSP™ ♦ For Integrated ESD Protection: MAX3222E/MAX3232E/MAX3237E/MAX3241E*/ MAX3246E: ±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V, Up to 1Mbps, True RS-232 Transceivers ♦ For Low-Voltage or Data Cable Applications: MAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic Pins 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 SHDN VCC GND C1- T1OUT V+ C1+ EN TOP VIEW R1IN R1OUT T1IN T2OUT T2IN V- C2- C2+ R2IN 9 10 R2OUT DIP/SO MAX3222 + _________________Pin Configurations _______________Ordering Information MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc. *Covered by U.S. Patent numbers 4,636,930; 4,679,134; 4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending. Typical Operating Circuits appear at end of data sheet. Pin Configurations continued at end of data sheet. Ordering Information continued at end of data sheet. +Denotes lead-free package. PART TEMP RANGE PIN-PACKAGE PKG CODE MAX3222CUP+ 0°C to +70°C 20 TSSOP U20+2 MAX3222CAP+ 0°C to +70°C 20 SSOP A20+1 MAX3222CWN+ 0°C to +70°C 18 SO W18+1 MAX3222CPN+ 0°C to +70°C 18 Plastic Dip P18+5 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 2 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 VCC = 5.0V ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VCC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: V+ and V- can have a maximum magnitude of 7V, but their absolute difference cannot exceed 13V. VCC...........................................................................-0.3V to +6V V+ (Note 1)...............................................................-0.3V to +7V V- (Note 1) ................................................................+0.3V to -7V V+ + V- (Note 1)...................................................................+13V Input Voltages T_IN, SHDN, EN ...................................................-0.3V to +6V MBAUD...................................................-0.3V to (VCC + 0.3V) R_IN .................................................................................±25V Output Voltages T_OUT...........................................................................±13.2V R_OUT....................................................-0.3V to (VCC + 0.3V) Short-Circuit Duration T_OUT ....................................................................Continuous Continuous Power Dissipation (TA = +70°C) 16-Pin TSSOP (derate 6.7mW/°C above +70°C).............533mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C) ....696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)........762mW 16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)...842mW 18-Pin SO (derate 9.52mW/°C above +70°C)..............762mW 18-Pin Plastic DIP (derate 11.11mW/°C above +70°C) ..889mW 20-Pin SSOP (derate 7.00mW/°C above +70°C) .........559mW 20-Pin TSSOP (derate 8.0mW/°C above +70°C).............640mW 28-Pin TSSOP (derate 8.7mW/°C above +70°C).............696mW 28-Pin SSOP (derate 9.52mW/°C above +70°C) .........762mW 28-Pin SO (derate 12.50mW/°C above +70°C).....................1W Operating Temperature Ranges MAX32_ _C_ _.....................................................0°C to +70°C MAX32_ _E_ _ .................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C IOUT = -1.0mA IOUT = 1.6mA Receivers disabled T_IN, EN, SHDN, MBAUD T_IN, EN, SHDN, MBAUD CONDITIONS V 0.8 1.5 Input Threshold Low 0.6 1.2 Input Voltage Range -25 25 V 0.5 2.0 VCC Power-Supply Current Output Voltage High VCC - 0.6 VCC - 0.1 V Output Voltage Low 0.4 V Output Leakage Current ±0.05 ±10 µA Input Leakage Current ±0.01 ±1.0 µA 0.8 V Input Logic Threshold Low (Note 3) PARAMETER MIN TYP MAX UNITS TA = +25°C TA = +25°C V 1.8 2.4 Input Threshold High 1.5 2.4 VCC = 3.3V VCC = 5.0V 2.0 V 2.4 Input Logic Threshold High (Note 3) No load, VCC = 3.3V or 5.0V, TA = +25°C mA 0.3 1.0 MAX3222/MAX3232/ MAX3241 MAX3237 Shutdown Supply Current SHDN = GND, TA = +25°C 1.0 10 µA VCC = 3.3V VCC = 5.0V VCC = 3.3V VCC = 5.0V DC CHARACTERISTICS LOGIC INPUTS AND RECEIVER OUTPUTS RECEIVER INPUTS 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 3 MAX3222/MAX3232/MAX3237/MAX3241 TIMING CHARACTERISTICS—MAX3222/MAX3232/MAX3241 (VCC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) ELECTRICAL CHARACTERISTICS (continued) (VCC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with 3kΩ to GND, T1OUT and T2OUT loaded with 2.5mA each CONDITIONS Transmitter Output Voltage ±5.0 V Input Hysteresis 0.3 V PARAMETER MIN TYP MAX UNITS Output Voltage Swing All transmitter outputs loaded with 3kΩ to ground ±5.0 ±5.4 V Output Short-Circuit Current ±35 ±60 mA Output Resistance VCC = V+ = V- = 0V, VOUT = ±2V 300 10M Ω VOUT = ±12V, VCC = 0V or 3V to 5.5V, transmitters disabled Output Leakage Current ±25 µA tPHL RL = 3kΩ, CL = 1000pF, one transmitter switching tPLH | tPHL - tPLH | | tPHL - tPLH | Normal operation Normal operation CONDITIONS 0.3 µs 0.3 Receiver Propagation Delay Maximum Data Rate 120 235 kbps Receiver Skew 300 ns Transmitter Skew 300 ns Receiver Output Disable Time 200 ns Receiver Output Enable Time 200 ns PARAMETER MIN TYP MAX UNITS VCC = 3.3V, RL = 3kΩ to 7kΩ, 6 30 +3V to -3V or -3V to +3V, TA = +25°C, one transmitter switching V/µs 4 30 Transition-Region Slew Rate R_IN to R_OUT, CL = 150pF CL = 150pF to 1000pF CL = 150pF to 2500pF Input Resistance TA = +25°C 357 kΩ MOUSE DRIVEABILITY (MAX3241) TRANSMITTER OUTPUTS 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 4 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 __________________________________________Typical Operating Characteristics (VCC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ, TA = +25°C, unless otherwise noted.) RL = 3kΩ, CL = 1000pF, one transmitter switching, MBAUD = GND Normal operation CONDITIONS Receiver Output Disable Time Normal operation 200 ns | tPHL - tPLH |, MBAUD = GND 100 ns 0.15 250 µs 0.15 Receiver Propagation Delay Receiver Output Enable Time 200 ns PARAMETER MIN TYP MAX UNITS TIMING CHARACTERISTICS—MAX3237 (VCC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) VCC = 3.0V to 4.5V, RL = 3kΩ, CL = 250pF, one transmitter switching, MBAUD = VCC 1000 VCC = 4.5V to 5.5V, RL = 3kΩ, CL = 1000pF, one transmitter switching, MBAUD = VCC kbps 1000 Maximum Data Rate R_IN to R_OUT, CL = 150pF | tPHL - tPLH |, MBAUD = VCC 25 ns Transmitter Skew Receiver Skew | tPHL - tPLH | 50 ns 6 30 V/µs 4 30 tPHL tPLH CL = 150pF to 2500pF, MBAUD = GND CL = 150pF to 1000pF MBAUD = GND VCC = 3.3V, RL = 3Ω to 7kΩ, +3V to -3V or -3V to +3V, TA = +25°C Transition-Region Slew Rate MBAUD = VCC 24 150 Note 2: MAX3222/MAX3232/MAX3241: C1–C4 = 0.1µF tested at 3.3V ±10%; C1 = 0.047µF, C2–C4 = 0.33µF tested at 5.0V ±10%. MAX3237: C1–C4 = 0.1µF tested at 3.3V ±5%; C1–C4 = 0.22µF tested at 3.3V ±10%; C1 = 0.047µF, C2–C4 = 0.33µF tested at 5.0V ±10%. Note 3: Transmitter input hysteresis is typically 250mV. -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 0 MAX3222/MAX3232 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX3222-01 LOAD CAPACITANCE (pF) TRANSMITTER OUTPUT VOLTAGE (V) 1000 4000 5000 2000 3000 VOUT+ VOUT- 0 2 4 6 8 10 12 14 16 18 20 22 150 MAX3222/MAX3232 SLEW RATE vs. LOAD CAPACITANCE MAX3222-02 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 1000 4000 5000 2000 3000 FOR DATA RATES UP TO 235kbps +SLEW -SLEW 0 5 10 15 20 25 30 35 40 0 MAX3222/MAX3232 SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA MAX3222-03 LOAD CAPACITANCE (pF) SUPPLY CURRENT (mA) 1000 4000 5000 2000 3000 235kbps 120kbps 20kbps 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 5 MAX3222/MAX3232/MAX3237/MAX3241 -7.5 -5.0 -2.5 0 2.5 5.0 7.5 0 MAX3241 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX3222-04 LOAD CAPACITANCE (pF) TRANSMITTER OUTPUT VOLTAGE (V) 1000 4000 5000 2000 3000 VOUT+ 1 TRANSMITTER AT 235kbps 2 TRANSMITTERS AT 30kbps VOUT- ALL OUTPUTS LOADED WITH 3kΩ +CL 0.1μF CHARGE-PUMP CAPACITORS FOR ALL DATA RATES UP TO 235kbps 4 6 8 10 12 14 16 18 20 22 24 0 MAX3241 SLEW RATE vs. LOAD CAPACITANCE MAX3222-05 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 1000 4000 5000 2000 3000 +SLEW -SLEW 0 5 10 15 20 25 30 35 45 40 0 MAX3241 SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA MAX3222-06 LOAD CAPACITANCE (pF) SUPPLY CURRENT (mA) 1000 4000 5000 2000 3000 235kbps 120kbps 20kbps -7.5 -5.0 -2.5 0 2.5 5.0 7.5 0 MAX3237 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND) MAX3222-07 LOAD CAPACITANCE (pF) TRANSMITTER OUTPUT VOLTAGE (V) 1000 4000 5000 2000 3000 1 TRANSMITTER AT 240kbps 4 TRANSMITTERS AT 15kbps 3kΩ + CL LOADS VCC = 3.3V 0 10 20 30 50 40 60 70 0 MAX3237 SLEW RATE vs. LOAD CAPACITANCE (MBAUD = VCC) MAX3222-10 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 500 1000 1500 2000 -SLEW, 1Mbps +SLEW, 1Mbps 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/16 DATA RATE 3kΩ + CL LOAD EACH OUTPUT VCC = 3.3V -SLEW, 2Mbps +SLEW, 2Mbps -7.5 -5.0 -2.5 0 2.5 5.0 7.5 0 MAX3237 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = VCC) MAX3222-08 LOAD CAPACITANCE (pF) TRANSMITTER OUTPUT VOLTAGE (V) 500 1000 1500 2000 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/16 DATA RATE 3kΩ + CL LOAD, EACH OUTPUT VCC = 3.3V 2Mbps 1.5Mbps 1Mbps 2Mbps 1Mbps 1.5Mbps 0 10 20 30 40 50 60 0 MAX3237 SUPPLY CURRENT vs. LOAD CAPACITANCE (MBAUD = GND) MAX3222-11 LOAD CAPACITANCE (pF) SUPPLY CURRENT (mA) 1000 4000 5000 2000 3000 240kbps 120kbps 20kbps 1 TRANSMITTER AT FULL DATA RATE 4 TRANSMITTERS AT 1/16 DATA RATE 3kΩ + CL LOADS VCC = 3.3V 0 2 4 6 8 10 12 0 MAX3237 SLEW RATE vs. LOAD CAPACITANCE (MBAUD = GND) MAX3222-09 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 1000 4000 5000 2000 3000 +SLEW -SLEW 1 TRANSMITTER AT 240kbps 4 TRANSMITTERS AT 15kbps 3kΩ + CL LOADS VCC = 3.3V 0 10 30 20 40 50 60 70 0 MAX3237 SKEW vs. LOAD CAPACITANCE (tPLH - tPHL) MAX3222-12 LOAD CAPACITANCE (pF) 500 2000 2500 1000 1500 MAX MIN AVERAGE; 10 PARTS SKEW (ns)1 TRANSMITTER AT 512kbps 4 TRANSMITTERS AT 32kbps 3kΩ + CL LOADS VCC = 3.3V MBAUD = VCC _____________________________Typical Operating Characteristics (continued) (VCC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ, TA = +25°C, unless otherwise noted.) 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 6 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 — FUNCTION — MAX3222 Noninverting Complementary Receiver Outputs. Always active. DIP/SO SSOP — 11, 14 1 1 Receiver Enable. Active low. 2 2 Positive Terminal of Voltage-Doubler Charge-Pump Capacitor 6 6 Negative Terminal of Inverting Charge-Pump Capacitor 5 5 Positive Terminal of Inverting Charge-Pump Capacitor 4 4 Negative Terminal of Voltage-Doubler Charge-Pump Capacitor 3 3 +5.5V Generated by the Charge Pump 11, 12 12, 13 TTL/CMOS Transmitter Inputs 10, 13 10, 15 TTL/CMOS Receiver Outputs 9, 14 9, 16 RS-232 Receiver Inputs 8, 15 8, 17 RS-232 Transmitter Outputs 7 7 -5.5V Generated by the Charge Pump 18 20 Shutdown Control. Active low. 17 19 +3.0V to +5.5V Supply Voltage 16 18 Ground No Connection MAX3232 MAX3237 — 16 — 13 1 28 5 3 4 1 3 25 2 27 10, 11 17, 19, 22, 23, 24 9, 12 18, 20, 21 8, 13 8, 9, 11 7, 14 5, 6, 7, 10, 12 6 4 — 14 16 26 15 2 — — NAME EN C1+ C2- C2+ C1- V+ T_IN R_OUT R_IN T_OUT V- SHDN VCC GND R_OUTB N.C. MAX3241 20, 21 23 28 2 1 24 27 12, 13, 14 15–19 4–8 9, 10, 11 3 22 26 25 — PIN — — MegaBaud Control Input. Connect to GND for normal operation; connect to VCC for 1Mbps transmission rates. — 15 — MBAUD ______________________________________________________________Pin Description 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 7 MAX3222/MAX3232/MAX3237/MAX3241 _______________Detailed Description Dual Charge-Pump Voltage Converter The MAX3222/MAX3232/MAX3237/MAX3241’s internal power supply consists of a regulated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump), regardless of the input voltage (VCC) over the 3.0V to 5.5V range. The charge pumps operate in a discontinuous mode; if the output voltages are less than 5.5V, the charge pumps are enabled, and if the output voltages exceed 5.5V, the charge pumps are disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies. RS-232 Transmitters The transmitters are inverting level translators that convert CMOS-logic levels to 5.0V EIA/TIA-232 levels. The MAX3222/MAX3232/MAX3241 transmitters guarantee a 120kbps data rate with worst-case loads of 3kΩ in parallel with 1000pF, providing compatibility with PC-toPC communication software (such as LapLink™). Typically, these three devices can operate at data rates of 235kbps. Transmitters can be paralleled to drive multiple receivers or mice. The MAX3222/MAX3237/MAX3241’s output stage is turned off (high impedance) when the device is in shutdown mode. When the power is off, the MAX3222/ MAX3232/MAX3237/MAX3241 permit the outputs to be driven up to ±12V. The transmitter inputs do not have pullup resistors. Connect unused inputs to GND or VCC. MAX3237 MegaBaud Operation In normal operating mode (MBAUD = GND), the MAX3237 transmitters guarantee a 250kbps data rate with worst-case loads of 3kΩ in parallel with 1000pF. This provides compatibility with PC-to-PC communication software, such as LapLink. For higher speed serial communications, the MAX3237 features MegaBaud operation. In MegaBaud operating mode (MBAUD = VCC), the MAX3237 transmitters guarantee a 1Mbps data rate with worst-case loads of 3kΩ in parallel with 250pF for 3.0V < VCC < 4.5V. For 5V ±10% operation, the MAX3237 transmitters guarantee a 1Mbps data rate into worst-case loads of 3kΩ in parallel with 1000pF. MAX3222 MAX3232 MAX3237 MAX3241 5kΩ R_ OUT R_ IN EN* C2- C2+ C1- C1+ V- V+ VCC C4 C1 C3 C2 0.1μF VCC SHDN* T_ IN T_ OUT GND VCC 0V 7kΩ 150pF MAX3222 MAX3232 MAX3237 MAX3241 5kΩ R_ OUT R_ IN EN* C2- C2+ C1- C1+ V- V+ VCC C4 C1 C3 C2 0.1μF VCC SHDN* T_ IN T_ OUT GND VCC 0V 3kΩ 2500pF MINIMUM SLEW-RATE TEST CIRCUIT MAXIMUM SLEW-RATE TEST CIRCUIT *MAX3222/MAX3237/MAX3241 ONLY Figure 1. Slew-Rate Test Circuits LapLink is a trademark of Traveling Software, Inc. 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 8 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 RS-232 Receivers The receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222/MAX3237/MAX3241 receivers have inverting three-state outputs. In shutdown, the receivers can be active or inactive (Table 1). The complementary outputs on the MAX3237 (R1OUTB) and the MAX3241 (R1OUTB, R2OUTB) are always active, regardless of the state of EN or SHDN. This allows for Ring Indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where VCC is set to 0V in shutdown to accommodate peripherals, such as UARTs (Figure 2). MAX3222/MAX3237/MAX3241 Shutdown Mode Supply current falls to less than 1µA in shutdown mode (SHDN = low). When shut down, the device’s charge pumps are turned off, V+ is pulled down to VCC, V- is pulled to ground, and the transmitter outputs are disabled (high impedance). The time required to exit shutdown is typically 100µs, as shown in Figure 3. Connect SHDN to VCC if the shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB. MAX3222/MAX3237/MAX3241 Enable Control The inverting receiver outputs (R_OUT) are put into a high-impedance state when EN is high. The complementary outputs R1OUTB and R2OUTB are always active, regardless of the state of EN and SHDN (Table 1). EN has no effect on T_OUT. __________Applications Information Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capacitors for 3.3V operation. For other supply voltages, refer to Table 2 for required capacitor values. Do not use values lower than those listed in Table 2. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1 without also increasing the values of C2, C3, and C4, to maintain the proper ratios (C1 to the other capacitors). When using the minimum required capacitor values, make sure the capacitor value does not degrade excessively with temperature. If in doubt, use capacitors with a higher nominal value. The capacitor’s equivalent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V-. MAX3237 MAX3241 T1OUT R1OUTB Tx UART VCC T1IN LOGIC TRANSITION DETECTOR R1OUT R1IN EN = VCC SHDN = GND VCC TO μP Rx PREVIOUS RS-232 Tx UART PROTECTION DIODE PROTECTION DIODE SHDN = GND VCC VCC GND Rx 5kΩ a) OLDER RS-232: POWERED-DOWN UART DRAWS CURRENT FROM ACTIVE RECEIVER OUTPUT IN SHUTDOWN. b) NEW MAX3237/MAX3241: EN SHUTS DOWN RECEIVER OUTPUTS (EXCEPT FOR B OUTPUTS), SO NO CURRENT FLOWS TO UART IN SHUTDOWN. B OUTPUTS INDICATE RECEIVER ACTIVITY DURING SHUTDOWN WITH EN HIGH. GND 5kΩ Figure 2. Detection of RS-232 Activity when the UART and Interface are Shut Down; Comparison of MAX3237/MAX3241 (b) with Previous Transceivers (a). 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 9 MAX3222/MAX3232/MAX3237/MAX3241 Power-Supply Decoupling In most circumstances, a 0.1µF bypass capacitor is adequate. In applications that are sensitive to powersupply noise, decouple VCC to ground with a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible. Operation Down to 2.7V Transmitter outputs will meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V. Transmitter Outputs when Exiting Shutdown Figure 3 shows two transmitter outputs when exiting shutdown mode. As they become active, the two transmitter outputs are shown going to opposite RS-232 levels (one transmitter input is high, the other is low). Each transmitter is loaded with 3kΩ in parallel with 2500pF. The transmitter outputs display no ringing or undesirable transients as they come out of shutdown. Note that the transmitters are enabled only when the magnitude of V- exceeds approximately 3V. Mouse Driveability The MAX3241 has been specifically designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manufacturers such as Microsoft and Logitech. The MAX3241 successfully drove all serial mice tested and met their respective current and voltage requirements. Figure 4a shows the transmitter output voltages under increasing load current at 3.0V. Figure 4b shows a typical mouse connection using the MAX3241. Table 1. MAX3222/MAX3237/MAX3241 Shutdown and Enable Control Truth Table Table 2. Required Minimum Capacitor Values 5V/div VCC = 3.3V C1–C4 = 0.1μF 2V/div T2 50μs/div T1 Figure 3. Transmitter Outputs when Exiting Shutdown or Powering Up VCC (V) C1 (µF) 4.5 to 5.5 0.047 3.0 to 5.5 0.1 C2, C3, C4 (µF) MAX3222/MAX3232/MAX3241 0.33 0.47 1 Active 0 1 1 Active SHDN 0 1 High-Z 0 0 High-Z EN T_OUT High-Z Active High-Z Active R_OUT R_OUTB (MAX3237/ MAX3241) Active Active Active Active 3.0 to 3.6 0.22 3.15 to 3.6 0.1 MAX3237 0.22 0.1 4.5 to 5.5 0.047 3.0 to 5.5 0.22 0.33 1.0 3.0 to 3.6 0.1 0.1 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 10 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 MAX3241 23 EN 15 R5OUT 16 R4OUT 17 R3OUT 18 R2OUT 19 R1OUT 20 R2OUTB 21 R1OUTB 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ R5IN 8 R4IN 7 6 R2IN 5 R1IN 4 SHDN 22 GND 25 12 T3IN 13 T2IN 14 T1IN C2- 2 C2+ 1 C1- 24 C1+ 28 T3OUT 11 +V COMPUTER SERIAL PORT MOUSE +V -V GND Tx T2OUT 10 T1OUT 9 V- 3 V+ 27 VCC VCC C4 C1 C3 C2 0.1μF VCC = 3V to 5.5V 26 R3IN Figure 4b. Mouse Driver Test Circuit -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 01234567 MAX3222-04 LOAD CURRENT PER TRANSMITTER (mA) TRANSMITTER OUTPUT VOLTAGE (V) VOUT+ VCC = 3.0V VOUTVOUT+ VCC VOUTT1 T2 T3 Figure 4a. MAX3241 Transmitter Output Voltage vs. Load Current per Transmitter 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 11 MAX3222/MAX3232/MAX3237/MAX3241 High Data Rates The MAX3222/MAX3232/MAX3241 maintain the RS-232 ±5.0V minimum transmitter output voltage even at high data rates. Figure 5 shows a transmitter loopback test circuit. Figure 6 shows a loopback test result at 120kbps, and Figure 7 shows the same test at 235kbps. For Figure 6, all transmitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 7, a single transmitter was driven at 235kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 1000pF. The MAX3237 maintains the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps. Figure 8 shows a loopback test result at 1Mbps with MBAUD = VCC. For Figure 8, all transmitters were loaded with an RS-232 receiver in parallel with 250pF. MAX3222 MAX3232 MAX3237 MAX3241 5kΩ R_ OUT R_ IN EN* C2- C2+ C1- C1+ V- V+ VCC C4 C3 C1 C2 0.1μF VCC SHDN* T_ IN T_ OUT GND VCC 0V 1000pF *MAX3222/MAX3237/MAX3241 ONLY T1IN R1OUT VCC = 3.3V T1OUT 5V/div 5V/div 5V/div 5μs/div Figure 5. Loopback Test Circuit Figure 6. MAX3241 Loopback Test Result at 120kbps T1IN R1OUT VCC = 3.3V T1OUT 5V/div 5V/div 2μs/div 5V/div Figure 7. MAX3241 Loopback Test Result at 235kbps +5V 0V +5V 0V -5V +5V 0V T_IN T_OUT = R_IN 5kΩ + 250pF R_OUT 150pF 200ns/div VCC = 3.3V Figure 8. MAX3237 Loopback Test Result at 1000kbps (MBAUD = VCC) 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 12 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 __________________________________________________Typical Operating Circuits MAX3222 10 R2OUT 1 13 R1OUT R2IN 9 18 GND 16 RS-232 OUTPUTS TTL/CMOS INPUTS 11 T2IN 12 T1IN C2- 6 C2+ 5 C1- 4 C1+ 2 R1IN 14 T2OUT 8 T1OUT 15 V- 7 V+ 3 VCC 17 C1 0.1μF C2 0.1μF 0.1μF +3.3V RS-232 INPUTS TTL/CMOS OUTPUTS EN SHDN C3* 0.1μF C4 0.1μF PIN NUMBERS REFER TO DIP/SO PACKAGES. * C3 CAN BE RETURNED TO EITHER VCC OR GROUND. MAX3232 9 R2OUT 12 R1OUT R2IN 8 GND 15 RS-232 OUTPUTS TTL/CMOS INPUTS 10 T2IN 11 T1IN C2- 5 C2+ 4 C1- 3 C1+ 1 R1IN 13 T2OUT 7 T1OUT 14 V- 6 V+ 2 VCC C4 0.1μF 16 0.1μF 0.1μF 0.1μF +3.3V RS-232 INPUTS TTL/CMOS OUTPUTS C3* 0.1μF * C3 CAN BE RETURNED TO EITHER VCC OR GROUND. SEE TABLE 2 FOR CAPACITOR SELECTION 5kΩ 5kΩ 5kΩ 5kΩ Interconnection with 3V and 5V Logic The MAX3222/MAX3232/MAX3237/MAX3241 can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 3 for more information on possible combinations of interconnections. Table 3. Logic-Family Compatibility with Various Supply Voltages Compatible with ACT and HCT CMOS, and with TTL. Incompatible with AC, HC, and CD4000 CMOS. 5 3.3 SYSTEM POWERSUPPLY VOLTAGE (V) Compatible with all TTL and CMOS-logic families. 5 5 Compatible with all CMOS families. 3.3 3.3 COMPATIBILITY MAX32_ _ VCC SUPPLY VOLTAGE (V) 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 13 MAX3222/MAX3232/MAX3237/MAX3241 _____________________________________Typical Operating Circuits (continued) MAX3241 23 EN 15 R5OUT 16 R4OUT 17 R3OUT 18 R2OUT 19 R1OUT 20 R2OUTB 21 R1OUTB TTL/CMOS OUTPUTS 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ R5IN 8 * C3 CAN BE RETURNED TO EITHER VCC OR GROUND. R4IN 7 R3IN 6 R2IN 5 R1IN 4 RS-232 INPUTS SHDN 22 GND 25 RS-232 OUTPUTS TTL/CMOS INPUTS 12 T3IN 13 T2IN T1IN 14 C2- 2 C2+ 1 C1- 24 C1+ 28 T3OUT 11 T2OUT 10 T1OUT 9 V- 3 V+ 27 VCC C4 0.1μF C3* 0.1μF 0.1μF 0.1μF 0.1μF +3.3V 26 MAX3237 13 EN 18 R3OUT 20 R2OUT 21 R1OUT 16 R1OUTB LOGIC OUTPUTS 5kΩ 5kΩ 5kΩ * C3 CAN BE RETURNED TO EITHER VCC OR GROUND. R3IN 11 R2IN 9 R1IN 8 RS-232 INPUTS GND 2 RS-232 OUTPUTS LOGIC INPUTS 22 T3IN 23 T2IN T1IN 24 C2- 3 C2+ 1 C1- 25 C1+ 28 T3OUT 7 T2OUT 6 T1OUT 5 T1 T2 T3 R1 R2 R3 V- 4 V+ 27 VCC 0.1μF 0.1μF 0.1μF 0.1μF 0.1μF 26 MBAUD 15 17 T5IN 19 T4IN T5OUT 12 T4OUT 10 SHDN 14 T4 T5 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 14 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 _____________________________________________Pin Configurations (continued) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 VCC GND T1OUT C2+ R1IN C1- V+ C1+ MAX3232 R1OUT T1IN T2IN R2IN R2OUT T2OUT V- C2- DIP/SO/TSSOP + TOP VIEW 20 19 18 17 16 15 14 13 1 2 3 8 12 10 11 4 5 6 7 SHDN VCC GND C1- T1OUT V+ C1+ EN R1IN R1OUT T1IN T2IN T2OUT V- C2- C2+ R2IN 9 R2OUT SSOP/TSSOP + N.C. N.C. MAX3222 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 C1+ V+ VCC C1- T1IN T2IN MBAUD T3IN R1OUT R2OUT T4IN R3OUT T5IN R1OUTB SHDN EN T5OUT R3IN T4OUT R2IN R1IN T3OUT T2OUT T1OUT V- C2- GND C2+ SSOP MAX3237 + 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 C1+ V+ VCC GND C1- EN R5OUT SHDN R1OUTB R2OUTB R1OUT R2OUT R3OUT R4OUT T1IN T2IN T3IN T3OUT T2OUT T1OUT R5IN R4IN R3IN R2IN R1IN V- C2- C2+ SO/SSOP/TSSOP MAX3241 + 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors Maxim Integrated 15 MAX3222/MAX3232/MAX3237/MAX3241 ______3V-Powered EIA/TIA-232 and EIA/TIA-562 Transceivers from Maxim Ordering Information (continued) *Dice are tested at TA = +25°C, DC parameters only. +Denotes lead-free package. 0.1µF capacitors, 1 complementary receiver, MegaBaud operation MAX3237 3.0 to 5.5 5/3 3 250/1000 232 0.1µF capacitors, AutoShutdown, complementary receiver, drives mice MAX3243 3.0 to 5.5 3/5 1 120 232 MAX3232 3.0 to 5.5 2/2 N/A 120 232 0.1µF capacitors MAX3223 3.0 to 5.5 2/2 2 120 232 0.1µF capacitors, AutoShutdown MAX3222 3.0 to 5.5 2/2 2 120 232 0.1µF capacitors 232 562 232 562 232 EIA/ TIA-232 OR 562 2.7 to 3.6 AutoShutdown, complementary receiver, drives mice, transient detection MAX3212 3/5 5 235 MAX563 3.0 to 3.6 2/2 2 230 0.1µF capacitors Operates directly from batteries without a voltage regulator MAX218 1.8 to 4.25 2/2 2 120 No. OF RECEIVERS ACTIVE IN SHUTDOWN POWERSUPPLY VOLTAGE (V) MAX562 2.7 to 5.25 3/5 5 230 Wide supply range MAX212 3.0 to 3.6 3/5 5 120 Drives mice FEATURES GUARANTEED DATA RATE (kbps) No. OF TRANSMITTERS/ RECEIVERS PART 0.1µF capacitors, 2 complementary receivers, drives mice MAX3241 3.0 to 5.5 3/5 5 120 232 PART TEMP RANGE PIN-PACKAGE PKG CODE MAX3222EUP+ -40°C to +85°C 20 TSSOP U20+2 MAX3222EAP+ -40°C to +85°C 20 SSOP A20+1 MAX3222EWN+ -40°C to +85°C 18 SO W18+1 MAX3222EPN+ -40°C to +85°C 18 Plastic Dip P18+5 MAX3222C/D 0°C to +70°C Dice* — MAX3232CUE+ 0°C to +70°C 16 TSSOP U16+1 MAX3232CSE+ 0°C to +70°C 16 Narrow SO S16+1 MAX3232CWE+ 0°C to +70°C 16 Wide SO W16+1 MAX3232CPE+ 0°C to +70°C 16 Plastic DIP P16+1 MAX3232EUE+ -40°C to +85°C 16 TSSOP U16+1 MAX3232ESE+ -40°C to +85°C 16 Narrow SO S16+5 PART TEMP RANGE PIN-PACKAGE PKG CODE MAX3232EWE+ -40°C to +85°C 16 Wide SO W16+1 MAX3232EPE+ -40°C to +85°C 16 Plastic DIP P16+1 MAX3237CAI+ 0°C to +70°C 16 SSOP A28+2 MAX3237EAI+ 0°C to +70°C 28 SSOP A28+1 MAX3241CUI+ 0°C to +70°C 28 TSSOP U28+2 MAX3241CAI+ 0°C to +70°C 28 SSOP A28+1 MAX3241CWI+ 0°C to +70°C 28 SO W28+6 MAX3241EUI+ -40°C to +85°C 28 TSSOP U28+2 MAX3241EAI+ -40°C to +85°C 28 SSOP A28+1 MAX3241EWI+ -40°C to +85°C 28 SO W28+6 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors 16 Maxim Integrated MAX3222/MAX3232/MAX3237/MAX3241 ___________________Chip Topography ___________________Chip Information T2IN T1IN 0.127" (3.225mm) 0.087" (2.209mm) T2OUT R2IN R2OUT R1OUT R1IN T1OUT V+ C1+ VCC SHDN EN C1- C2+ C2- V- GND MAX3222 TRANSISTOR COUNT: 339 SUBSTRATE CONNECTED TO GND MAX3222 339 MAX3232 339 MAX3237 1212 MAX3241 894 PART TRANSISTOR COUNT Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 17 © 2007 Maxim Integrated Products, Inc. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. 3.0V to 5.5V, Low-Power, up to 1Mbps, True RS-232 Transceivers Using Four 0.1µF External Capacitors MAX3222/MAX3232/MAX3237/MAX3241 TSSOP4.40mm.EPS Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Revision History Pages changed at Rev 7: 1, 15, 16, 17 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown General Description The MAX3221/MAX3223/MAX3243 achieve 1µA supply current with Maxim’s revolutionary AutoShutdown™ feature. When the MAX3221/MAX3223/MAX3243 do not sense a valid signal level on their receiver inputs, the on-board power supply and drivers shut down. This occurs if the RS-232 cable is disconnected or if the transmitters of the connected peripheral are turned off. The system turns on again when a valid level is applied to any RS-232 receiver input. The MAX3221/MAX3223/MAX3243 require only 0.1µF capacitors in 3.3V operation, and can operate from input voltages ranging from +3.0V to +5.5V. A proprietary, high-efficiency, dual charge-pump power supply and a low-dropout transmitter combine to deliver true RS-232 performance from a single +3.0V to +5.5V supply. The MAX3221 is a 1-driver/1-receiver 16-pin SSOP version of the 20-pin 2-driver/2-receiver MAX3223. The MAX3243 is a 3-driver/5-receiver with a complementary always-active receiver for external monitoring in a variety of 28 pin packages. Please see order information table for package offerings. Applications • Battery-Powered Equipment • Hand-Held Equipment • Peripherals • Portable Diagnostics Equipment Benefits and Features • Integrated Charge Pump Circuitry Simplifies Power Requirements • Eliminates the Need for a ±12 Supply • Operation From a Single +3.3V or +5V Supply • 1µA Supply Current in Shutdown Mode Saves Power • AutoShutdown Feature is Enabled After No Activity on Receiver Inputs for 30µs • Software Control Option for Shutdown 19-0306; Rev 9; 1/15 PART MAX3221CAE MAX3221EUE† -40°C to +85°C 0°C to +70°C TEMP RANGE PIN-PACKAGE 16 SSOP 16 TSSOP †Future product—contact factory for availability. AutoShutdown and UCSP are trademarks of Maxim Integrated Products, Inc. Pin Configurations appear at end of data sheet. Typical Operating Circuits appear at end of data sheet. MAX3223EPP -40°C to +85°C 20 Plastic DIP MAX3223EAP -40°C to +85°C 20 SSOP MAX3243CWI 0°C to +70°C 28 Wide SO MAX3243CAI 0°C to +70°C 28 SSOP MAX3243EWI -40°C to +85°C 28 Wide SO MAX3243EAI -40°C to +85°C 28 SSOP MAX3223CPP MAX3223CAP 0°C to +70°C 0°C to +70°C 20 Plastic DIP 20 SSOP Ordering Information Selector Guide MAX3221 MAX3223 MAX3243 1 2 3 1 2 3.0 to 5.5 3.0 to 5.5 5 3.0 to 5.5 Yes Yes Yes PART Tx Rx VCC RANGE (V) AutoShutdown MAX3221CUE† 0°C to +70°C 16 TSSOP MAX3221EAE -40°C to +85°C 16 SSOP MAX3223CUP 0°C to +70°C 20 TSSOP MAX3223EUP -40°C to +85°C 20 TSSOP MAX3243CUI 0°C to +70°C 28 TSSOP MAX3243EUI -40°C to +85°C 28 TSSOP www.maximintegrated.com Maxim Integrated | 2 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown Absolute Maximum Ratings Electrical Characteristics (VCC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VCC...........................................................................-0.3V to +6V V+ (Note 1)...............................................................-0.3V to +7V V- (Note 1) ...............................................................+0.3V to -7V V+ + |V-| (Note 1).................................................................+13V Input Voltages T_IN, FORCEOFF, FORCEON, EN (MAX3223) ......-0.3V to +6V R_IN ...................................................................................±25V Output Voltages T_OUT.............................................................................±13.2V R_OUT, INVALID ......................................-0.3V to (VCC + 0.3V) Short-Circuit Duration T_OUT ......................................................................Continuous Continuous Power Dissipation (TA = +70°C) 16-Pin SSOP (derate 7.14mW/°C above +70°C) ...........571mW 16-Pin TSSOP (derate 6.70mW/°C above +70°C) .........533mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW 20-Pin SSOP (derate 8.00mW/°C above +70°C) ...........640mW 20-Pin TSSOP DIP (derate 7.00mW/°C above +70°C).....559mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C) ............1W 28-Pin SSOP (derate 9.52mW/°C above +70°C) ...........762mW 28-Pin TSSOP (derate 8.70mW/°C above +70°C) .........696mW Operating Temperature Ranges MAX32_ _C_ _.......................................................0°C to +70°C MAX32_ _E_ _....................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V. IOUT = 1.6mA Receivers disabled T_IN, EN, FORCEON, FORCEOFF T_IN, EN, FORCEON, FORCEOFF T_IN, FORCEON, FORCEOFF, EN (MAX3223) IOUT = -1.0mA CONDITIONS Output Voltage High VCC - 0.6 VCC - 0.1 V Output Voltage Low 0.4 V Output Leakage Current ±0.05 ±10 µA Input Leakage Current ±0.01 ±1.0 µA V 2.4 Input Logic Threshold High 1.0 10 µA Input Logic Threshold Low 0.8 V PARAMETER MIN TYP MAX UNITS VCC = 3.3V VCC = 5.0V 2.0 Supply Current, AutoShutdown Supply Current, Shutdown 1.0 10 µA Supply Current, AutoShutdown Disabled VCC = 3.3V or 5.0V, TA = +25°C 0.3 1.0 mA 2.7 Receiver Positive or Negative Threshold to INVALID High (tINVH) Figure 5 1 µs Receiver Threshold to Transmitters Enabled (tWU) Figure 5 250 µs Receiver Positive or Negative Threshold to INVALID Low (tINVL) Figure 5 30 µs Receiver Input Thresholds to Transmitters Enabled Figure 5 V -2.7 INVALID Output Voltage Low IOUT = 1.6mA 0.4 V Receiver Input Thresholds to Transmitters Disabled 1µA supply current, Figure 5 -0.3 0.3 V Positive threshold Negative threshold INVALID Output Voltage High IOUT = -1.0mA VCC - 0.6 V DC CHARACTERISTICS LOGIC INPUTS AND RECEIVER OUTPUTS AUTOSHUTDOWN (FORCEON = GND, FORCEOFF = VCC) All R_IN open, FORCEON = GND, FORCEOFF = VCC FORCEOFF = GND FORCEON = FORCEOFF = VCC, no load MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown www.maximintegrated.com Maxim Integrated | 3 Electrical Characteristics (continued) (VCC = +3.0V to +5.5V, C1–C4 = 0.1µF (Note 2), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) Note 2: C1–C4 = 0.1µF, tested at 3.3V ±10%. C1 = 0.047µF, C2–C4 = 0.33µF, tested at 5.0V ±10%. 200 Normal operation 200 Receiver Output Enable Time Normal operation ns tPLH Receiver input to receiver output, CL = 150pF 4 8.0 30 Transition-Region Slew Rate V/µs VCC = 3.3V, RL = 3kΩ to 7kΩ, TA = +25°C, measured from +3V to -3V or -3V to +3V Transmitter Skew 200 ⏐ tPHL - tPLH ⏐ ns PARAMETER MIN TYP MAX UNITS ±25 Output Short-Circuit Current ±35 ±60 mA Output Resistance 300 10M Ω Output Leakage Current µA Input Threshold Low 0.6 1.2 V Output Voltage Swing ±5.0 ±5.4 V Maximum Data Rate 120 235 kbps Receiver Propagation Delay 0.3 µs CONDITIONS VCC = V+ = V- = 0V, transmitter output = ±2V VOUT = ±12V, VCC = 0V or 3.0V to 5.5V, transmitters disabled RL = 3kΩ, CL = 1000pF, one transmitter switching All transmitter outputs loaded with 3kΩ to ground Receiver Output Disable Time ns tPHL 0.3 Input Voltage Range -25 25 V Input Hysteresis 0.3 V Input Threshold High V Input Resistance TA = +25°C 35 7 kΩ 0.8 1.5 1.8 2.4 1.5 2.4 TA = +25°C TA = +25°C VCC = 3.3V VCC = 3.3V VCC = 5.0V VCC = 5.0V CL = 200pF to 2500pF CL = 200pF to 1000pF 6 30 Transmitter Output Voltage ±5 V T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with 3kΩ to GND, T1OUT and T2OUT loaded with 2.5mA each MAX3221/MAX3223 MAX3243 200 1000 Receiver Skew 100 ⏐ tPHL - tPLH ⏐ ns MAX3221/MAX3223 MAX3243 100 500 RECEIVER INPUTS TIMING CHARACTERISTICS TRANSMITTER OUTPUTS MOUSE DRIVEABILITY (MAX3243) www.maximintegrated.com Maxim Integrated | 4 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown Typical Operating Characteristics (VCC = +3.3V, 235kbps data rate, 0.1µF capacitors, all transmitters loaded with 3kΩ, TA = +25°C, unless otherwise noted.) -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 0 MAX3221/MAX3223 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX3221/3223-01 LOAD CAPACITANCE (pF) TRANSMITTER OUTPUT VOLTAGE (V) 1000 4000 5000 2000 3000 VOUT+ VOUT- 0 2 4 6 8 10 12 14 16 18 20 22 150 500 MAX3221/MAX3223 SLEW RATE vs. LOAD CAPACITANCE MAX3221/3223-02 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 1000 4000 5000 2000 3000 FOR DATA RATES UP TO 235kbps +SLEW -SLEW 5 10 15 20 25 30 35 40 0 5 10 15 20 25 30 35 0 MAX3221/MAX3223 SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATAMAX3221/3223-03 LOAD CAPACITANCE (pF) 3 3 SU CU ( ) MAX3221 SUPPLY CURRENT (mA) 1000 4000 5000 2000 3000 235kbps 120kbps 20kbps -7.5 -5.0 -2.5 0 2.5 5.0 7.5 0 MAX3243 TRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE MAX3221/3223-04 LOAD CAPACITANCE (pF) TRANSMITTER OUTPUT VOLTAGE (V) 1000 4000 5000 2000 3000 VOUT+ 1 TRANSMITTER AT 235kbps 2 TRANSMITTERS AT 30kbps VOUT- ALL OUTPUTS LOADED WITH 3kΩ +CL 0.1μF CHARGE-PUMP CAPACITORS FOR ALL DATA RATES UP TO 235kbps 4 6 8 10 12 14 16 18 20 22 24 0 MAX3243 SLEW RATE vs. LOAD CAPACITANCE MAX3221/3223-05 LOAD CAPACITANCE (pF) SLEW RATE (V/μs) 1000 4000 5000 2000 3000 +SLEW -SLEW 0 5 10 15 20 25 30 35 45 40 0 MAX3243 SUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA MAX3221/3223-06 LOAD CAPACITANCE (pF) SUPPLY CURRENT (mA) 1000 4000 5000 2000 3000 235kbps 120kbps 20kbps www.maximintegrated.com Maxim Integrated | 5 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown Pin Description R2OUTB Noninverting Receiver Output—active in shutdown Output of the valid signal detector. Indicates if a valid RS-232 level is present on receiver inputs logic “1”. INVALID Drive low to shut down transmitters and on-board power supply. This overrides all automatic circuitry and FORCEON (Table 1). FORCEOFF Drive high to override automatic circuitry keeping transmitters on (FORCEOFF must be high) (Table 1). FORCEON C1- Negative terminal of the voltage doubler charge-pump capacitor R_IN RS-232 Receiver Inputs T_OUT RS-232 Transmitter Outputs T_IN TTL/CMOS Transmitter Inputs R_OUT TTL/CMOS Receiver Outputs V- -5.5V generated by the charge pump C2- Negative terminal of inverting charge-pump capacitor C2+ Positive terminal of inverting charge-pump capacitor Receiver Enable Control. Drive low for normal operation. Drive high to force the receiver outputs into a high-Z state. EN FUNCTION GND Ground VCC +3.0V to +5.5V Supply Voltage LapLink is a trademark of Traveling Software. Detailed Description Dual Charge-Pump Voltage Converter The MAX3221/MAX3223/MAX3243’s internal power supply consists of a regulated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump), regardless of the input voltage (VCC) over the +3.0V to +5.5V range. The charge pumps operate in a discontinuous mode: if the output voltages are less than 5.5V, the charge pumps are enabled; if the output voltages exceed 5.5V, the charge pumps are disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies. RS-232 Transmitters The transmitters are inverting level translators that convert CMOS-logic levels to 5.0V EIA/TIA-232 levels. They guarantee a 120kbps data rate with worst-case loads of 3kΩ in parallel with 1000pF, providing compatibility with PC-to-PC communication software (such as Laplink™). Typically, the MAX3221/MAX3223/MAX3243 can operate at data rates of 235kbps. Transmitters can be paralleled to drive multiple receivers or mice (MAX3243). Figure 1 shows a complete system connection. When FORCEOFF is driven to ground, or the AutoShutdown circuitry senses invalid voltage levels at all receiver inputs, the transmitters are disabled and the outputs are forced into a high-impedance state. — 10 16 12 4 8 13 11 9 7 6 5 1 14 15 NAME MAX3221 3 V+ +5.5V generated by the charge pump 2 C1+ Positive terminal of the voltage doubler charge-pump capacitor — 11 20 14 4 9, 16 8, 17 12, 13 10, 15 7 6 5 1 18 19 20 21 22 23 24 4–8 9, 10, 11 12, 13, 14 15–19 3 2 1 — 25 26 MAX3223 3 MAX3243 27 2 28 PIN www.maximintegrated.com Maxim Integrated | 6 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown RS-232 Receivers The MAX3221/MAX3223/MAX3243’s receivers convert RS-232 signals to CMOS-logic output levels. All receivers have one inverting three-state output. In shutdown (FORCEOFF = low) or in AutoShutdown, the MAX3221/MAX3223’s receivers are active (Table 1). Driving EN high places the receiver(s) in a high-impedance state. The MAX3243’s receivers are high impedance when the part is shut down. The MAX3243 has an always-active complementary output (R2OUTB). R2OUTB is an extra output that monitors receiver activity while the other receivers are high impedance. This allows Ring Indicator to be monitored without forward biasing other devices connected to the receiver outputs. This is ideal for systems where VCC is set to 0V in shutdown to accommodate peripherals, such as UARTs (Figure 2). MAX3243 I/O CHIP WITH UART CPU RS-232 POWER MANAGEMENT UNIT OR KEYBOARD CONTROLLER FORCEOFF FORCEON INVALID MAX3243 T1OUT R2OUTB Tx UART 5kΩ VCC T1IN THREE-STATED LOGIC TRANSITION DETECTOR R2IN PROTECTION DIODE R2OUT FORCEOFF = GND VCC TO μP Rx PREVIOUS RS-232 Tx UART SHDN = GND VCC VCC GND Rx 5kΩ (a) OLDER RS-232: POWERED-DOWN UART DRAWS CURRENT FROM ACTIVE RECEIVER OUTPUT IN SHUTDOWN. (b) NEW MAX3243: IN SHUTDOWN, R2OUTB IS USED TO MONITOR EXTERNAL DEVICES AND R2OUT IS THREE STATED, ELIMINATING A CURRENT PATH THROUGH THE UART'S PROTECTION DIODE. GND PROTECTION DIODE I I Figure 1. Interface Under Control of PMU Figure 2. The MAX3243 detects RS-232 activity when the UART and interface are shut down. MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown www.maximintegrated.com Maxim Integrated | 7 AutoShutdown A 1µA supply current is achieved with Maxim’s new AutoShutdown feature, which operates when FORCEON is low and FORCEOFF is high. When the MAX3221/MAX3223/MAX3243 sense no valid signal levels on all receiver inputs for 30µs, the on-board power supply and drivers are shut off, reducing supply current to 1µA. This occurs if the RS-232 cable is disconnected or the connected peripheral transmitters are turned off. The system turns on again when a valid level is applied to any RS-232 receiver input. As a result, the system saves power without changes to the existing BIOS or operating system. When using AutoShutdown, the INVALID output is high when the device is on and low when the device is shut down. Because INVALID indicates the receiver inputs’ condition, it can be used in any mode (Figure 3). Table 2 and Figure 3c summarize the MAX3221/ MAX3223/MAX3243 operating modes. FORCEON and FORCEOFF override the automatic circuitry and force the transceiver into its normal operating state or into its low-power standby state. When neither control is asserted, the IC selects between these states automatically based on receiver input levels. Figures 3a, 3b, and 5a depict valid and invalid RS-232 receiver levels. A mouse or other system with AutoShutdown may need time to wake up. Figure 4 shows a circuit that forces the transmitters on for 100ms, allowing enough time for the other system to realize that the MAX3221/MAX3223/ Table 1a. MAX3221/MAX3223 FORCEOFF and Enable Control Truth Table Table 1b. MAX3243 FORCEOFF Control Truth Table 1 1 Active* 1 0 Active* FORCEOFF 0 1 High-Z 0 0 High-Z EN T_OUT High-Z Active High-Z Active R_OUT +0.3V -0.3V INVALID TO MAX32_ _ POWER SUPPLY AND TRANSMITTERS R_IN * TRANSMITTERS ARE DISABLED, REDUCING SUPPLY CURRENT TO 1μA IF ALL RECEIVER INPUTS ARE BETWEEN +0.3V AND -0.3V FOR AT LEAST 30μs. 30µs COUNTER R 1 Active* 0 High-Z FORCEOFF T_OUT Active* High-Z R_OUT Active Active R2OUTB Figure 3a. MAX32_ _ Entering 1µA Supply Mode via AutoShutdown *Note: If the part is in AutoShutdown mode (FORCEOFF = VCC, FORCEON = GND), it is shut down if no valid RS-232 levels are present on all receiver inputs. FORCEON MASTER SHDN LINE 0.1μF 1MΩ FORCEOFF MAX3221 MAX3223 MAX3243 POWER MANAGEMENT UNIT Figure 4. AutoShutdown with Initial Turn-On to Wake Up a Mouse or Another System +2.7V -2.7V INVALID TO MAX32_ _ POWER SUPPLY R_IN * TRANSMITTERS ARE ENABLED IF: ANY RECEIVER INPUT IS GREATER THAN +2.7V OR LESS THAN -2.7V. ANY RECEIVER INPUT HAS BEEN BETWEEN +0.3V AND -0.3V FOR LESS THAN 30μs. 30µs COUNTER R Figure 3b. MAX32_ _ with Transmitters Enabled Using AutoShutdown FORCEOFF POWER DOWN INVALID FORCEON INVALID IS AN INTERNALLY GENERATED SIGNAL THAT IS USED BY THE AUTOSHUTDOWN LOGIC AND APPEARS AS AN OUTPUT OF THE DEVICE. POWER DOWN IS ONLY AN INTERNAL SIGNAL. IT CONTROLS THE OPERATIONAL STATUS OF THE TRANSMITTERS AND THE POWER SUPPLIES. Figure 3c. AutoShutdown Logic www.maximintegrated.com Maxim Integrated | 8 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown MAX3243 is awake. If the other system outputs valid RS-232 signals within that time, the RS-232 ports on both systems remain enabled. When shut down, the device’s charge pumps are turned off, V+ decays to VCC, V- decays to ground, and the transmitter outputs are disabled (high impedance). The time required to exit shutdown is typically 100µs (Figure 5b). Software-Controlled Shutdown If direct software control is desired, INVALID can be used to indicate DTR or Ring Indicator signal. Tie FORCEOFF and FORCEON together to bypass AutoShutdown so the line acts like a SHDN input. Applications Information Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation; either polarized or nonpolarized capacitors may be used. The charge pump requires 0.1µF capacitors for 3.3V operation. For other supply voltages, refer to Table 3 for required capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1 without also increasing the values of C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). When using the minimum required capacitor values, make sure the capacitor value does not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor’s equivalent series resistance (ESR) usually rises at low temperatures and influences the amount of ripple on V+ and V-. Table 2. AutoShutdown Logic RS-232 SIGNAL PRESENT AT RECEIVER INPUT FORCEOFF INPUT FORCEON INPUT INVALID OUTPUT TRANSCEIVER STATUS Yes H X H Normal Operation No H H L Normal Operation (Forced On) No H L L Shutdown (AutoShutdown) Yes L X H Shutdown (Forced Off) No L X L Shutdown (Forced Off) V- VCC 0 V+ 0 VCC tINVL tWU INVALID REGION RECEIVER INPUT VOLTAGE (V) INVALID OUTPUT (V) tINVH TRANSMITTERS ENABLED, INVALID HIGH RECEIVER INPUT LEVELS AUTOSHUTDOWN, TRANSMITTERS DISABLED, 1μA SUPPLY CURRENT, INVALID LOW TRANSMITTERS ENABLED, INVALID HIGH -2.7V -0.3V +2.7V +0.3V 0V INDETERMINATE INDETERMINATE (b) (a) Figure 5. AutoShutdown Trip Levels MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown www.maximintegrated.com Maxim Integrated | 9 Power-Supply Decoupling In most circumstances a 0.1µF bypass capacitor is adequate. In applications that are sensitive to powersupply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible. Transmitter Outputs when Exiting Shutdown Figure 6 shows two transmitter outputs when exiting shutdown mode. As they become active, the two transmitter outputs are shown going to opposite RS-232 levels. Each transmitter is loaded with 3kΩ in parallel with 2500pF. The transmitter outputs display no ringing or undesirable transients as they come out of shutdown. Note that the transmitters are enabled only when the magnitude of V- exceeds approximately 3V. Figure 7a shows the MAX3243’s transmitter output voltage vs. current per transmitter. Figure 7b is a mouse driver test circuit. Mouse Driveability (MAX3243) The MAX3243 has been specifically designed to power serial mice while operating from low-voltage power supplies. It has been tested with samples of ten major mouse models from six manufacturers including the leading three: Logitech (5 models), Mouse Systems, and Microsoft. The MAX3243 successfully drove all serial mice and met their respective current and voltage requirements. Figure 7a shows the transmitter outputs under increasing load current. The MAX3243’s switching regulator ensures the transmitters will supply at least ±5V during worst-case conditions. The AutoShutdown feature does not work with a mouse, so FORCEOFF and FORCEON should be connected to VCC. High Data Rates The MAX3221/MAX3223/MAX3243 maintain the RS-232 ±5.0V minimum transmitter output voltage even at high data rates. Figure 8 shows a transmitter loopback test circuit. Figure 9 shows a loopback test result at 120kbps, and Figure 10 shows the same test at 235kbps. For Figure 9, all three transmitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 10, a single transmitter was driven at 235kbps, but all three transmitters were loaded with an RS-232 receiver in parallel with 1000pF. Interconnection with 3V and 5V Logic The MAX3221/MAX3223/MAX3243 can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 4 for more information on possible combinations of interconnections. -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 01234567 MAX322 LOAD CURRENT PER TRANSMITTER (mA) TRANSMITTER OUTPUT VOLTAGE (V) VOUT+ VCC = 3.0V VOUTVOUT+ VCC VOUTT1 T2 T3 Figure 7a. MAX3243 Transmitter Output Voltage vs. Load Current per Transmitter 5V/div VCC = +3.3V C1–C4 = 0.1μF 2V/div T2 50μs/div T1 Figure 6. Transmitter Outputs when Exiting Shutdown or Powering Up www.maximintegrated.com Maxim Integrated | 10 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown +V COMPUTER SERIAL PORT +V -V GND Tx SERIAL MOUSE MAX3243 FORCEOFF 23 15 R5OUT 16 R4OUT 17 R3OUT 18 R2OUT 19 R1OUT 20 R2OUTB LOGIC OUTPUTS 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ R5IN 8 R4IN 7 R3IN 6 R2IN 5 R1IN 4 RS-232 INPUTS GND 25 LOGIC INPUTS 12 T3IN 13 T2IN T1IN 14 C2- 2 C2+ 1 C1- 24 C1+ 28 T3OUT 11 T2OUT 10 T1OUT 9 V- 3 V+ 27 VCC VCC C4 0.1μF C3 0.1μF 0.1μF 26 C1 0.1μF C2 0.1μF FORCEON INVALID 22 21 TO POWER MANAGEMENT UNIT +3.3V Figure 7b. Mouse Driver Test Circuit MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown www.maximintegrated.com Maxim Integrated | 11 Figure 10. Loopback Test Result at 235kbps T1IN R1OUT VCC = +3.3V, 235kbps C1–C4 = 0.1μF T1OUT 5V/div 5V/div 2μs/div 5V/div MAX3221 MAX3223 MAX3243 5kΩ R_ OUT R_ IN EN (MAX3221/3) C2- C2+ C1- C1+ V- V+ VCC C4 C3 C1 C2 0.1μF VCC FORCEOFF T_ IN T_ OUT GND VCC 0V 1000pF Figure 8. Loopback Test Circuit Figure 9. Loopback Test Result at 120kbps T1IN R1OUT VCC = +3.3V, 120kbps C1–C4 = 0.1μF T1OUT 5V/div 5V/div 5V/div 5μs/div Table 4. Logic Family Compatibility with Various Supply Voltages Table 3. Required Capacitor Values VCC SUPPLY VOLTAGE (V) COMPATIBILITY 3.3 3.3 Compatible with all CMOS families. 5 5 Compatible with all TTL and CMOS-logic families. SYSTEM POWERSUPPLY VOLTAGE (V) 5 3.3 Compatible with ACT and HCT CMOS, and with TTL. Incompatible with AC, HC, or CD4000 CMOS. VCC (V) C1 (µF) C2, C3, C4 (µF) 3.0 to 3.6 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.1 0.47 www.maximintegrated.com Maxim Integrated | 12 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown Typical Operating Circuits MAX3221 FORCEON EN 12 1 9 R1OUT FORCEOFF 16 INVALID 10 GND 14 11 T1IN C2- 6 C2+ 5 C1- 4 C1+ 2 R1IN 8 T1OUT 13 V- 7 V+ 3 VCC VCC C4 0.1μF C3 0.1μF 0.1μF 15 C1 0.1μF C2 0.1μF C5 +3.3V TO POWER MANAGEMENT UNIT 5kΩ MAX3223 FORCEON EN 14 1 10 R2OUT 15 R1OUT FORCEOFF 20 INVALID 11 R2IN 9 GND 18 RS-232 OUTPUTS TTL/CMOS INPUTS 12 T2IN 13 T1IN C2- 6 C2+ 5 C1- 4 C1+ 2 R1IN 16 T2OUT 8 T1OUT 17 V- 7 V+ 3 VCC VCC C4 0.1μF C3 0.1μF 0.1μF 19 C1 0.1μF C2 0.1μF C5 +3.3V RS-232 INPUTS TO POWER MANAGEMENT UNIT TTL/CMOS OUTPUTS 5kΩ 5kΩ MAX3243 FORCEOFF 23 15 R5OUT 16 R4OUT 17 R3OUT 18 R2OUT 19 R1OUT 20 R2OUTB LOGIC OUTPUTS 5kΩ 5kΩ 5kΩ 5kΩ 5kΩ R5IN 8 R4IN 7 R3IN 6 R2IN 5 R1IN 4 RS-232 INPUTS GND 25 RS-232 OUTPUTS LOGIC INPUTS 12 T3IN 13 T2IN T1IN 14 C2- 2 C2+ 1 C1- 24 C1+ 28 T3OUT 11 T2OUT 10 T1OUT 9 V- 3 V+ 27 VCC VCC C4 0.1μF C3 0.1μF 0.1μF 26 C1 0.1μF C2 0.1μF FORCEON INVALID 22 21 TO POWER MANAGEMENT UNIT +3.3V MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown www.maximintegrated.com Maxim Integrated | 13 3V-Powered EIA/TIA-232 and EIA/TIA-562 Transceivers from Maxim MAX3222 3.0 to 5.5 2/2 2 120 232 0.1µF capacitors, MAX242 pinout MAX3223 3.0 to 5.5 2/2 2 120 232 0.1µF capacitors, AutoShutdown 0.1µF capacitors, AutoShutdown complementary receiver, drives mice MAX3243 3.0 to 5.5 3/5 1 120 232 MAX3232 3.0 to 5.5 2/2 N/A 120 232 0.1µF capacitors, MAX232 pinout MAX3221 3.0 to 5.5 1/1 1 120 232 0.1µF capacitors, 16-pin SSOP 232 562 232 562 232 EIA/TIA- 232 OR 562 2.7 to 3.6 AutoShutdown, complementary receiver, drives mice, transient detection MAX3212 3/5 5 235 MAX563 3.0 to 3.6 2/2 2 120 0.1µF capacitors Operates directly from batteries without a voltage regulator MAX218 1.8 to 4.25 2/2 2 120 No. OF RECEIVERS ACTIVE IN SHUTDOWN POWERSUPPLY VOLTAGE (V) MAX562 2.7 to 5.25 3/5 5 230 230kbps guaranteed data rate MAX212 3.0 to 3.6 3/5 5 120 Drives mice FEATURES GUARANTEED DATA RATE (kbps) No. OF TRANSMITTERS/ RECEIVERS PART 0.1µF capacitors, 2 complementary receivers, drives mice MAX3241 3.0 to 5.5 3/5 5 120 232 www.maximintegrated.com Maxim Integrated | 14 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown Pin Configurations 20 19 18 17 16 15 14 13 1 2 3 4 5 6 7 8 FORCEOFF VCC GND C1- T1OUT V+ C1+ EN R1IN R1OUT FORCEON T2OUT T1IN V- C2- C2+ 12 11 9 10 T2IN R2OUT INVALID R2IN DIP/SSOP/TSSOP MAX3223 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 C1+ V+ VCC GND C1- FORCEON FORCEOFF INVALID R2OUTB R1OUT R2OUT R3OUT R4OUT R5OUT C2+ C2- V- R1IN R2IN R3IN R4IN R5IN T1OUT T2OUT T3OUT T3IN T2IN T1IN SO/SSOP/TSSOP MAX3243 TOP VIEW 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 EN C1+ V+ C1- C2+ C2- V- R1IN FORCEOFF VCC GND T1OUT FORCEON T1IN INVALID R1OUT MAX3221 SSOP/TSSOP MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown www.maximintegrated.com Maxim Integrated | 15 SSOP.EPS PACKAGE OUTLINE, SSOP, 5.3 MM 1 1 21-0056 C APPROVAL DOCUMENT CONTROL NO. REV. PROPRIETARY INFORMATION TITLE: NOTES: 1. D&E DO NOT INCLUDE MOLD FLASH. 2. MOLD FLASH OR PROTRUSIONS NOT TO EXCEED .15 MM (.006"). 3. CONTROLLING DIMENSION: MILLIMETERS. 4. MEETS JEDEC MO150. 5. LEADS TO BE COPLANAR WITHIN 0.10 MM. H 7.90 L 0∞ 0.301 0.025 8∞ 0.311 0.037 0∞ 7.65 0.63 8∞ 0.95 MAX 5.38 MILLIMETERS B C D E e A1 DIM A SEE VARIATIONS 0.0256 BSC 0.010 0.004 0.205 0.002 0.015 0.008 0.212 0.008 INCHES MIN MAX 0.078 0.65 BSC 0.25 0.09 5.20 0.05 0.38 0.20 0.21 MIN 1.73 1.99 MILLIMETERS 6.07 6.07 10.07 8.07 7.07 INCHES D D D D D 0.239 0.239 0.397 0.317 0.278 MIN 0.249 0.249 0.407 0.328 0.289 MAX MIN 6.33 6.33 10.33 8.33 7.33 14L 16L 28L 24L 20L MAX N A D e A1 L C E H N 2 1 B 0.068 TSSOP4.40mm.EPS Package Information For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. www.maximintegrated.com Maxim Integrated | 16 MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown SOICW.EPS PACKAGE OUTLINE, .300" SOIC 1 1 21-0042 B APPROVAL DOCUMENT CONTROL NO. REV. PROPRIETARY INFORMATION TITLE: TOP VIEW FRONT VIEW MAX 0.012 0.104 0.019 0.299 0.013 INCHES 0.291 0.009 E C DIM 0.014 0.004 B A1 MIN A 0.093 0.23 7.40 7.60 0.32 MILLIMETERS 0.10 0.35 2.35 MIN 0.49 0.30 MAX 2.65 L 0.016 0.050 0.40 1.27 D 0.496 0.512 D DIM MIN D INCHES MAX 12.60 13.00 MILLIMETERS MIN MAX 20 AC 0.447 0.463 AB 11.35 18 11.75 0.398 0.413 AA 10.10 16 10.50 N MS013 SIDE VIEW H 0.419 0.394 10.00 10.65 e 0.050 1.27 D 0.614 0.598 15.20 24 15.60 AD D 0.713 0.697 17.70 28 18.10 AE E H N D A1 e B A 0∞-8∞ C L 1 VARIATIONS: PDIPN.EPS Package Information (continued) For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2015 Maxim Integrated Products, Inc. | 17 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com. MAX3221/MAX3223/MAX3243 +3V to +5.5V RS-232 Transceivers with AutoShutdown Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 9 1/15 Updated General Description and Benefits and Features sections 1 1 of 8 FEATURES Converts CMOS RAMs into Nonvolatile Memories Unconditionally Write Protects when VCC is Out-of-Tolerance Automatically Switches to Battery when Power-Fail Occurs Space-Saving 8-Pin PDIP or 16-Pin SO Packages Consumes <100nA of Battery Current Tests Battery Condition on Power up Provides for Redundant Batteries Optional 5% or 10% Power-Fail Detection Low Forward Voltage Drop on the VCC Switch Optional Industrial (N) Temperature Range of -40°C to +85°C PIN ASSIGNMENT PIN DESCRIPTION VCCO - RAM Supply VBAT1 - + Battery 1 TOL - Power Supply Tolerance GND - Ground CE - Chip Enable Input CEO - Chip Enable Output VBAT2 - + Battery 2 VCCI - + Supply NC - No Connect DESCRIPTION The DS1210 Nonvolatile Controller Chip is a CMOS circuit which solves the application problem of converting CMOS RAM into nonvolatile memory. Incoming power is monitored for an out-of-tolerance condition. When such a condition is detected, chip enable is inhibited to accomplish write protection and the battery is switched on to supply the RAM with uninterrupted power. Special circuitry uses a lowleakage CMOS process which affords precise voltage detection at extremely low battery consumption. The 8-pin DIP package keeps PC board real estate requirements to a minimum. By combining the DS1210 Nonvolatile Controller Chip with a CMOS memory and batteries, nonvolatile RAM operation can be achieved. DS1210 Nonvolatile Controller Chip VCCO VBAT1 TOL GND 1 2 3 4 VCCI VBAT2 CEO CE 8 7 6 5 DS1210 8-pin PDIP (300 mils) NC VCCO NC VBAT1 NC TOL NC GND NC VCCI NC VBAT2 NC CEO NC CE 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 DS1210S 16-pin SO (300 mils) 19-6294; Rev 6/12 DS1210 2 of 8 OPERATION The DS1210 nonvolatile controller performs five circuit functions required to battery back up a RAM. First, a switch is provided to direct power from the battery or the incoming supply (VCCI) depending on which is greater. This switch has a voltage drop of less than 0.3V. The second function which the nonvolatile controller provides is power-fail detection. The DS1210 constantly monitors the incoming supply. When the supply goes out of tolerance, a precision comparator detects power-fail and inhibits chip enable ( CEO ). The third function of write protection is accomplished by holding the CEO output signal to within 0.2 volts of the VCCI or battery supply. If CE input is low at the time power-fail detection occurs, the CEO output is kept in its present state until CE is returned high. The delay of write protection until the current memory cycle is completed prevents the corruption of data. Power-fail detection occurs in the range of 4.75 volts to 4.5 volts with the tolerance (TOL) pin grounded. If TOL in connected to VCCO, then powerfail detection occurs in the range of 4.5 volts to 4.25 volts. During nominal supply conditions CEO will follow CE with a maximum propagation delay of 20ns. The fourth function the DS1210 performs is a battery status warning so that potential data loss is avoided. Each time that the circuit is powered up the battery voltage is checked with a precision comparator. If the battery voltage is less than 2.0 volts, the second memory cycle is inhibited. Battery status can, therefore, be determined by performing a read cycle after power-up to any location in memory, verifying that memory location content. A subsequent write cycle can then be executed to the same memory location altering the data. If the next read cycle fails to verify the written data, then the batteries are less than 2.0V and data is in danger of being corrupted. The fifth function of the nonvolatile controller provides for battery redundancy. In many applications, data integrity is paramount. In these applications it is often desirable to use two batteries to ensure reliability. The DS1210 controller provides an internal isolation switch which allows the connection of two batteries. During battery backup operation the battery with the highest voltage is selected for use. If one battery should fail, the other will take over the load. The switch to a redundant battery is transparent to circuit operation and to the user. A battery status warning will occur when the battery in use falls below 2.0 volts. A grounded VBAT2 pin will not activate a battery-fail warning. In applications where battery redundancy is not required, a single battery should be connected to the BAT1 pin, and the BAT2 battery pin must be grounded. The nonvolatile controller contains circuitry to turn off the battery backup. This is to maintain the battery(s) at its highest capacity until the equipment is powered up and valid data is written to the SRAM. While in the freshness seal mode the CEO and VCCO will be forced to VOL. When the batteries are first attached to one or both of the VBAT pins, VCCO will not provide battery back-up until VCCI exceeds VCCTP, as set by the TOL pin, and then falls below VBAT. Figure 1 shows a typical application incorporating the DS1210 in a microprocessor-based system. Section A shows the connections necessary to write protect the RAM when VCC is less than 4.75 volts and to back up the supply with batteries. Section B shows the use of the DS1210 to halt the processor when VCC is less than 4.75 volts and to delay its restart on power-up to prevent spurious writes. DS1210 3 of 8 SECTION A - BATTERY BACKUP Figure 1 BATTERY BACKUP CURRENT DRAIN EXAMPLE CONSUMPTION DS1210 IBAT 100 nA RAM ICC02 10 µA Total Drain 10.1 µA SECTION B - PROCESSOR RESET DS1210 4 of 8 ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground -0.3V to +7.0V Operating Temperature Range 0°C to +70°C, -40°C to +85°C for N parts Storage Temperature Range -55°C to +125°C Soldering Temperature (reflow, SO) +260°C Lead Temperature (soldering, 10s) +300°C This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) PDIP Junction-to-Ambient Thermal Resistance (θJA).…………………...…………………………...….110°C/W Junction-to-Case Thermal Resistance (θJC)…………………………………………………………40°C/W SO Junction-to-Ambient Thermal Resistance (θJA).…………………………………………………….70°C/W Junction-to-Case Thermal Resistance (θJC)…………………………………………………………23°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board for the SO. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. RECOMMENDED OPERATING CONDITIONS (Note 10) PARAMETER SYMBOL 4BMIN TYP MAX UNITS 0BNOTES TOL = GND Supply Voltage VCCI 4.75 5.0 5.5 V 2 TOL = VCCO Supply Voltage VCCI 4.5 5.0 5.5 V 2 Logic 1 Input VIH 2.2 VCC+0.3 V 2 Logic 0 Input VIL -0.3 +0.8 V 2 Battery Input VBAT1, VBAT2 2.0 4.0 V 2, 3 DC ELECTRICAL CHARACTERISTICS (Note 10; VCCI = 4.75 to 5.5V, TOL = GND) (VCCI = 4.5 to 5.5V, TOL = VCCO) PARAMETER SYMBOL MIN TYP MAX UNITS 1BNOTES Supply Current ICCI 5 mA 4 Supply Voltage VCCO VCC-0.2 V 2 Supply Current ICCO1 80 mA 5 Input Leakage IIL -1.0 +1.0 µA Output Leakage ILO -1.0 +1.0 µA CEO Output @ 2.4V IOH -1.0 mA 6 CEO Output @ 0.4V IOL 4.0 mA 6 VCC Trip Point (TOL=GND) VCCTP 4.50 4.62 4.74 V 2 VCC Trip Point (TOL=VCCO) VCCTP 4.25 4.37 4.49 V 2 CEO Output VOHL VBAT-0.2 V 8 VBAT1 or VBAT2 Battery Current IBAT 100 nA 3, 4 Battery Backup Current @ VCCO = VBAT – 0.3V ICCO2 50 µA 7, 8 DS1210 5 of 8 CAPACITANCE (TA = +25°C) PARAMETER SYMBOL MIN TYP MAX UNITS 2BNOTES Input Capacitance CIN 5 pF Output Capacitance COUT 7 pF AC ELECTRICAL CHARACTERISTICS (Note 10; VCCI = 4.75V to 5.5V, TOL = GND) (VCCI = 4.5V to 5.5V, TOL = VCCO) PARAMETER SYMBOL MIN TYP MAX UNITS 3BNOTES CE Propagation Delay tPD 5 10 20 ns 6 CE High to Power-Fail tPF 0 ns AC ELECTRICAL CHARACTERISTICS (Note 10; VCCI = 4.75V, TOL = GND) (VCCI < 4.5, TOL = VCCO) Recovery at Power Up tREC 2 80 125 ms VCC Slew Rate Power-Down tF 300 µs VCC Slew Rate Power-Down tFB 10 µs VCC Slew Rate Power-Up tR 0 µs CE Pulse Width tCE 1.5 µs 9 NOTES: 2. All voltages are referenced to ground. 3. Only one battery input is required. Unused battery inputs must be grounded. 4. Measured with VCCO and CEO open. 5. ICC01 is the maximum average load which the DS1210 can supply to the memories. 6. Measured with a load as shown in Figure 2. 7. ICC02 is the maximum average load current which the DS1210 can supply to the memories in the battery backup mode. 8. tCE max must be met to ensure data integrity on power loss. 9. CEO can only sustain leakage current in the battery backup mode. 10. All AC and DC electrical characteristics are valid for the full temperature range. For commercial products, this range is 0 to +70°C. For industrial products (N), this range is -40°C to +85°C. 11. DS1210 is recognized by Underwriters Laboratories (UL) under file E99151. DS1210 6 of 8 TIMING DIAGRAM: POWER-UP TIMING DIAGRAM: POWER-DOWN OUTPUT LOAD Figure 2 DS1210 7 of 8 ORDERING INFORMATION PART TEMP RANGE PINPACKAGE DS1210+ 0°C to +70°C 8 PDIP DS1210N+ -40°C to +85°C 8 PDIP DS1210S+ 0°C to +70°C 16 SO DS1210SN+ -40°C to +85°C 16 SO +Denotes a lead(Pb)-free/RoHS-compliant package. PACKAGE INFORMATION For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO. 8 PDIP P8+4 21-0043 16 SO W16+2 21-0042 90-0107 DS1210 8 of 8 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, Inc. 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000 © 2012 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc. REVISION HISTORY REVISION DATE DESCRIPTION PAGES CHANGED 6/12 Added lead temperature and soldering temperature information to the Absolute Maximum Ratings section; changed “Pin 3” to “TOL” in multiple places; added the Package Thermal Characteristics section; added the Ordering Information and Package Information sections 1, 2, 4, 5, 8 1. General description The HEF4052B is a dual 4-channel analog multiplexer/demultiplexer with common channel select logic. Each multiplexer/demultiplexer has four independent inputs/outputs (nY0 to nY3) and a common input/output (nZ). The common channel select logic includes two select inputs (S1 and S2) and an active LOW enable input (E). Both multiplexers/demultiplexers contain four bidirectional analog switches, each with one side connected to an independent input/output (nY0 to nY3) and the other side connected to a common input/output (nZ). With E LOW, one of the four switches is selected (low-impedance ON-state) by S1 and S2. With E HIGH, all switches are in the high-impedance OFF-state, independent of S1 and S2. If break before make is needed, then it is necessary to use the enable input. VDD and VSS are the supply voltage connections for the digital control inputs (S1 and S2, and E). The VDD to VSS range is 3 V to 15 V. The analog inputs/outputs (nY0 to nY3, and nZ) can swing between VDD as a positive limit and VEE as a negative limit. VDD VEE may not exceed 15 V. Unused inputs must be connected to VDD, VSS, or another input. For operation as a digital multiplexer/demultiplexer, VEE is connected to VSS (typically ground). VEE and VSS are the supply voltage connections for the switches. 2. Features and benefits Fully static operation 5 V, 10 V, and 15 V parametric ratings Standardized symmetrical output characteristics Specified from 40 C to +85 C and 40 C to +125 C Complies with JEDEC standard JESD 13-B 3. Applications Analog multiplexing and demultiplexing Digital multiplexing and demultiplexing Signal gating HEF4052B Dual 4-channel analog multiplexer/demultiplexer Rev. 9 — 11 September 2014 Product data sheet HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 2 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 4. Ordering information 5. Functional diagram Table 1. Ordering information All types operate from 40 C to +125 C. Type number Package Name Description Version HEF4052BP DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4 HEF4052BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 HEF4052BTT TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 Fig 1. Functional diagram mnb042 1 - OF - 4 DECODER LOGIC LEVEL CONVERSION 8 7 VSS VEE VDD 12 13 16 3 14 15 11 10 9 6 S1 S2 E 1 5 2 1Y0 1Z 2Z 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 4 HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 3 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer Fig 2. Schematic diagram (one switch) 001aak604 nYn nZ VEE VDD VDD Fig 3. Logic symbol Fig 4. IEC logic symbol 001aak605 4 2 5 1 11 15 14 12 13 3 6 9 1Z S1 S2 E 2Z 2Y3 2Y2 2Y1 2Y0 1Y3 1Y2 1Y1 1Y0 10 mnb041 11 15 14 12 4 2 5 9 1 10 0 6 G4 MDX 0 3 4 × 1 3 2 1 0 13 3 HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 4 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer Fig 5. Logic diagram 001aak634 LEVEL CONVERTER LEVEL CONVERTER LEVEL CONVERTER S1 S2 E 1Y0 1Y1 1Y2 1Y3 2Y0 2Y1 2Y2 2Y3 2Z 1Z HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 5 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 6. Pinning information 6.1 Pinning 6.2 Pin description Fig 6. Pin configuration SOT38-4 and SOT109-1 Fig 7. Pin configuration SOT338-1 and SOT403-1 001aag215 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 HEF4052B 2Y0 VDD 2Y2 1Y2 2Z 1Y1 2Y3 1Z 2Y1 1Y0 E 1Y3 VEE S1 VSS S2 HEF4052B 2Y0 VDD 2Y2 1Y2 2Z 1Y1 2Y3 1Z 2Y1 1Y0 E 1Y3 VEE S1 VSS S2 001aak606 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 Table 2. Pin description Symbol Pin Description E 6 enable input (active LOW) VEE 7 supply voltage VSS 8 ground supply voltage S1, S2 10, 9 select input 1Y0, 1Y1, 1Y2, 1Y3, 2Y0, 2Y1, 2Y2, 2Y3 12, 14, 15, 11, 1, 5, 2, 4 independent input or output 1Z, 2Z 13, 3 common output or input VDD 16 supply voltage HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 6 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 7. Functional description 7.1 Function table [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care. 8. Limiting values [1] To avoid drawing VDD current out of terminal Z, when switch current flows into terminals Y, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal Z, no VDD current will flow out of terminals Y, and in this case there is no limit for the voltage drop across the switch, but the voltages at Y and Z may not exceed VDD or VEE. [2] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C. For SO16 package: Ptot derates linearly with 8 mW/K above 70 C. For SSOP16 package: Ptot derates linearly with 5.5 mW/K above 60 C. Table 3. Function table[1] Input Channel on E S2 S1 L L L nY0 to nZ L L H nY1 to nZ L H L nY2 to nZ L H H nY3 to nZ H X X switches off Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground). Symbol Parameter Conditions Min Max Unit VDD supply voltage 0.5 +18 V VEE supply voltage referenced to VDD [1] 18 +0.5 V IIK input clamping current pins Sn and E; VI < 0.5 V or VI > VDD + 0.5 V - 10 mA VI input voltage 0.5 VDD + 0.5 V II/O input/output current - 10 mA IDD supply current - 50 mA Tstg storage temperature 65 +150 C Tamb ambient temperature 40 +125 C Ptot total power dissipation Tamb = 40 C to +125 C [2] DIP16 package - 750 mW SO16 package - 500 mW TSSOP16 package - 500 mW P power dissipation per output - 100 mW HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 7 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 9. Recommended operating conditions 10. Static characteristics Table 5. Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD supply voltage see Figure 8 3 - 15 V VI input voltage 0 - VDD V Tamb ambient temperature in free air 40 - +125 C t/V input transition rise and fall rate VDD = 5 V - - 3.75 s/V VDD = 10 V - - 0.5 s/V VDD = 15 V - - 0.08 s/V Fig 8. Operating area as a function of the supply voltages VDD − VEE (V) 0 15 5 10 001aac285 10 5 15 VDD − VSS (V) 0 operating area Table 6. Static characteristics VSS = VEE = 0 V; VI = VSS or VDD unless otherwise specified. Symbol Parameter Conditions VDD Tamb = 40 C Tamb = 25 C Tamb = 85 C Tamb = 125 C Unit Min Max Min Max Min Max Min Max VIH HIGH-level input voltage IO < 1 A 5 V 3.5 - 3.5 - 3.5 - 3.5 - V 10 V 7.0 - 7.0 - 7.0 - 7.0 - V 15 V 11.0 - 11.0 - 11.0 - 11.0 - V VIL LOW-level input voltage IO < 1 A 5 V - 1.5 - 1.5 - 1.5 - 1.5 V 10 V - 3.0 - 3.0 - 3.0 - 3.0 V 15 V - 4.0 - 4.0 - 4.0 - 4.0 V II input leakage current 15 V - 0.1 - 0.1 - 1.0 - 1.0 A HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 8 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 10.1 Test circuits IS(OFF) OFF-state leakage current Z port; all channels OFF; see Figure 9 15 V - - - 1000 - - - - nA Y port; per channel; see Figure 10 15 V - - - 200 - - - - nA IDD supply current IO = 0 A 5 V - 5 - 5 - 150 - 150 A 10 V - 10 - 10 - 300 - 300 A 15 V - 20 - 20 - 600 - 600 A CI input capacitance Sn, E inputs - - - - 7.5 - - - - pF Table 6. Static characteristics …continued VSS = VEE = 0 V; VI = VSS or VDD unless otherwise specified. Symbol Parameter Conditions VDD Tamb = 40 C Tamb = 25 C Tamb = 85 C Tamb = 125 C Unit Min Max Min Max Min Max Min Max Fig 9. Test circuit for measuring OFF-state leakage current Z port IS 001aak635 VDD VI VSS = VEE S1 and S2 E nZ VDD or VSS VDD nYn VO Fig 10. Test circuit for measuring OFF-state leakage current nYn port IS 001aak636 VSS VO switch VSS = VEE S1 and S2 E nZ nY0 VDD or VSS VDD nYn 1 2 VI HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 9 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 10.2 On resistance 10.2.1 On resistance waveform and test circuit Table 7. ON resistance Tamb = 25 C; ISW = 200 A; VSS = VEE = 0 V. Symbol Parameter Conditions VDD VEE Typ Max Unit RON(peak) ON resistance (peak) VI = 0 V to VDD VEE; see Figure 11 and Figure 12 5 V 350 2500 10 V 80 245 15 V 60 175 RON(rail) ON resistance (rail) VI = 0 V; see Figure 11 and Figure 12 5 V 115 340 10 V 50 160 15 V 40 115 VI = VDD VEE; see Figure 11 and Figure 12 5 V 120 365 10 V 65 200 15 V 50 155 RON ON resistance mismatch between channels VI = 0 V to VDD VEE; see Figure 11 5 V 25 - 10 V 10 - 15 V 5 - RON = VSW / ISW. Fig 11. Test circuit for measuring RON V 001aak637 VSS VI VSW ISW VSS = VEE S1 and S2 E nZ VDD or VSS VDD nYn HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 10 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 11. Dynamic characteristics Fig 12. Typical RON as a function of input voltage 9, 9 DDH 521 ȍ 9'' 9 9 9 Table 8. Dynamic characteristics Tamb = 25 C; VSS = VEE = 0 V; for test circuit see Figure 16. Symbol Parameter Conditions VDD Typ Max Unit tPHL HIGH to LOW propagation delay nYn, nZ to nZ, nYn; see Figure 13 5 V 10 20 ns 10 V 5 10 ns 15 V 5 10 ns Sn to nYn, nZ; see Figure 14 5 V 150 305 ns 10 V 65 135 ns 15 V 50 100 ns tPLH LOW to HIGH propagation delay Yn, nZ to nZ, nYn; see Figure 13 5 V 10 20 ns 10 V 5 10 ns 15 V 5 10 ns Sn to nYn, nZ; see Figure 14 5 V 150 300 ns 10 V 75 150 ns 15 V 50 100 ns tPHZ HIGH to OFF-state propagation delay E to nYn, nZ; see Figure 15 5 V 95 190 ns 10 V 90 180 ns 15 V 85 180 ns tPZH OFF-state to HIGH propagation delay E to nYn, nZ; see Figure 15 5 V 130 260 ns 10 V 55 115 ns 15 V 45 85 ns tPLZ LOW to OFF-state propagation delay E to nYn, nZ; see Figure 15 5 V 100 205 ns 10 V 90 180 ns 15 V 90 180 ns HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 11 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 11.1 Waveforms and test circuit tPZL OFF-state to LOW propagation delay E to nYn, nZ; see Figure 15 5 V 120 240 ns 10 V 50 100 ns 15 V 35 75 ns Table 8. Dynamic characteristics …continued Tamb = 25 C; VSS = VEE = 0 V; for test circuit see Figure 16. Symbol Parameter Conditions VDD Typ Max Unit Measurement points are given in Table 9. Measurement points are given in Table 9. Fig 13. nYn, nZ to nZ, nYn propagation delays Fig 14. Sn to nYn, nZ propagation delays 001aac290 nYn or nZ input nZ or nYn output tPLH tPHL VDD VEE VM VM VO VEE 001aac291 switch ON tPLH tPHL switch OFF VDD VSS VO VEE nYn or nZ output Sn input switch OFF 10 % 90 % VM Measurement points are given in Table 9. Fig 15. Enable and disable times 001aac292 tPLZ tPHZ switch ON switch OFF switch ON nYn or nZ output LOW-to-OFF OFF-to-LOW nYn or nZ output HIGH-to-OFF OFF-to-HIGH E input VO VO VEE VEE VDD VSS VM tPZL tPZH 90 % 90 % 10 % 10 % Table 9. Measurement points Supply voltage Input Output VDD VM VM 5 V to 15 V 0.5VDD 0.5VDD HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 12 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer [1] For nYn to nZ propagation delays use VEE. For Sn to nYn or nZ propagation delays use VDD. Test data is given in Table 10. Definitions: DUT = Device Under Test. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including test jig and probe. RL = Load resistance. Fig 16. Test circuit for measuring switching times 001aaj903 VI VO RT CL RL S1 DUT PULSE GENERATOR tW VM VI VDD VI VDD VSS VEE open 0 V negative pulse VI 0 V positive pulse 10 % 90 % 90 % 10 % VM VM VM tW tf tf tr tr Table 10. Test data Input Load S1 position nYn, nZ Sn and E tr, tf VM CL RL tPHL[1] tPLH tPZH, tPHZ tPZL, tPLZ other VDD or VEE VDD or VSS 20 ns 0.5VDD 50 pF 10 k VDD or VEE VEE VEE VDD VEE HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 13 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer 11.2 Additional dynamic parameters [1] fi is biased at 0.5 VDD; VI = 0.5VDD (p-p). 11.2.1 Test circuits Table 11. Additional dynamic characteristics VSS = VEE = 0 V; Tamb = 25 C. Symbol Parameter Conditions VDD Typ Max Unit THD total harmonic distortion see Figure 17; RL = 10 k; CL = 15 pF; channel ON; VI = 0.5VDD (p-p); fi = 1 kHz 5 V [1] 0.25 - % 10 V [1] 0.04 - % 15 V [1] 0.04 - % f(3dB) 3 dB frequency response see Figure 18; RL = 1 k; CL = 5 pF; channel ON; VI = 0.5VDD (p-p) 5 V [1] 13 - MHz 10 V [1] 40 - MHz 15 V [1] 70 - MHz iso isolation (OFF-state) see Figure 19; fi = 1 MHz; RL = 1 k; CL = 5 pF; channel OFF; VI = 0.5VDD (p-p) 10 V [1] 50 - dB Vct crosstalk voltage digital inputs to switch; see Figure 20; RL = 10 k; CL = 15 pF; E or Sn = VDD (square-wave) 10 V 50 - mV Xtalk crosstalk between switches; see Figure 21; fi = 1 MHz; RL = 1 k; VI = 0.5VDD (p-p) 10 V [1] 50 - dB Table 12. Dynamic power dissipation PD PD can be calculated from the formulas shown; VEE = VSS = 0 V; tr = tf 20 ns; Tamb = 25 C. Symbol Parameter VDD Typical formula for PD (W) where: PD dynamic power dissipation 5V PD = 1300 fi + (fo CL) VDD2 fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VDD = supply voltage in V; (CL fo) = sum of the outputs. 10 V PD = 6100 fi + (fo CL) VDD2 15 V PD = 15600 fi + (fo CL) VDD2 Fig 17. Test circuit for measuring total harmonic distortion Fig 18. Test circuit for measuring frequency response D 001aak638 VSS fi RL CL VSS = VEE S1 and S2 E nZ VDD or VSS VDD nYn dB 001aak639 VSS fi RL CL VSS = VEE S1 and S2 E nZ VDD or VSS VDD nYn HEF4052B All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9 — 11 September 2014 14 of 22 NXP Semiconductors HEF4052B Dual 4-channel analog multiplexer/demultiplexer Fig 19. Test circuit for measuring isolation (OFF-state) dB 001aak657 VSS fi RL CL switch VSS = VEE S1 and S2 E nZ nY0 VDD or VSS VDD nYn 1 2 a. Test circuit b. Input and output pulse definitions Fig 20. Test circuit for measuring crosstalk voltage between digital inputs and switch DDN 9''RU966 9'' VZLWFK 966 9(( 6DQG6 ( Q= Q< 9'' Q
VCC + 0.5 V [1] - 20 mA IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V [1] - 20 mA IO output current 0.5 V < VO < VCC + 0.5 V - 25 mA ICC supply current - 50 mA IGND ground current 50 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation Tamb = 40 C to +125 C DIP20 package [2] - 750 mW SO20, SSOP20, TSSOP20 and DHVQFN20 package [3] - 500 mW 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 6 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger 8. Recommended operating conditions 9. Static characteristics Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions 74HC273 74HCT273 Unit Min Typ Max Min Typ Max VCC supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V VI input voltage 0 - VCC 0 -VCC V VO output voltage 0 - VCC 0 -VCC V Tamb ambient temperature 40 - +125 40 - +125 C t/V input transition rise and fall rate VCC = 2.0 V - - 625 - - - ns/V VCC = 4.5 V - 1.67 139 - 1.67 139 ns/V VCC = 6.0 V - - 83 - - - ns/V Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC273 VIH HIGH-level input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V VIL LOW-level input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V IO = 4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V IO = 5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 20 A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 6.0 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 8.0 - 80 - 160 A 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 7 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger 10. Dynamic characteristics CI input capacitance - 3.5 - - - - - pF 74HCT273 VIH HIGH-level input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V VIL LOW-level input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V VOH HIGH-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA 3.98 4.32 - 3.84 - 3.7 - V VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 5.2 mA; VCC = 5.5 V - 0.15 0.26 - 0.33 - 0.4 V II input leakage current VI = VCC or GND; VCC = 5.5 V - - 0.1 - 1 - 1 A ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 8.0 - 80 - 160 A ICC additional supply current per input pin; VI = VCC 2.1 V; other inputs at VCC or GND; VCC = 4.5 V to 5.5 V MR input - 100 360 - 450 - 490 A CP input - 175 630 - 787.5 - 857.5 A Dn input - 15 54 - 67.5 - 73.5 A CI input capacitance - 3.5 - - - - - pF Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max Table 7. Dynamic characteristics GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10 Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC273 tpd propagation delay CP to Qn; see Figure 7 [1] VCC = 2.0 V - 41 150 - 185 - 225 ns VCC = 4.5 V - 15 30 - 37 - 45 ns VCC = 5.0 V; CL = 15 pF - 15 - - - - - ns VCC = 6.0 V - 13 26 - 31 - 38 ns 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 8 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger tPHL HIGH to LOW propagation delay MR to Qn; see Figure 8 VCC = 2.0 V - 44 150 - 185 - 225 ns VCC = 4.5 V - 16 30 - 37 - 45 ns VCC = 5.0 V; CL = 15 pF - 15 - - - - - ns VCC = 6.0 V - 14 26 - 31 - 38 ns tt transition time Qn output; see Figure 7 [2] VCC = 2.0 V - 19 75 - 95 - 110 ns VCC = 4.5 V - 7 15 - 19 - 22 ns VCC = 6.0 V - 6 13 - 15 - 19 ns tW pulse width CP input HIGH or LOW; see Figure 7 VCC = 2.0 V 80 14 - 100 - 120 - ns VCC = 4.5 V 16 5 - 20 - 24 - ns VCC = 6.0 V 14 4 - 17 - 20 - ns MR input LOW; see Figure 8 VCC = 2.0 V 60 17 - 75 - 90 - ns VCC = 4.5 V 12 6 - 15 - 18 - ns VCC = 6.0 V 10 5 - 13 - 15 - ns trec recovery time MR to CP; see Figure 8 VCC = 2.0 V 50 6 - 65 - 75 - ns VCC = 4.5 V 10 2 - 13 - 15 - ns VCC = 6.0 V 9 2 - 11 - 13 - ns tsu set-up time Dn to CP; see Figure 9 VCC = 2.0 V 60 11 - 75 - 90 - ns VCC = 4.5 V 12 4 - 15 - 18 - ns VCC = 6.0 V 10 3 - 13 - 15 - ns th hold time Dn to CP; see Figure 9 VCC = 2.0 V 3 6 - 3 - 3 - ns VCC = 4.5 V 3 2 - 3 - 3 - ns VCC = 6.0 V 3 2 - 3 - 3 - ns fmax maximum frequency CP input; see Figure 7 VCC = 2.0 V 6 20.6 - 4.8 - 4 - MHz VCC = 4.5 V 30 103 - 24 - 20 - MHz VCC = 5.0 V; CL = 15 pF - 66 - - - - - MHz VCC = 6.0 V 35 122 - 28 - 24 - MHz CPD power dissipation capacitance per package; VI = GND to VCC [3] - 20 - - - - - pF Table 7. Dynamic characteristics …continued GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10 Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 9 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger [1] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL VCC2 fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V. 74HCT273 tpd propagation delay CP to Qn; see Figure 7 [1] VCC = 4.5 V - 16 30 - 38 - 45 ns VCC = 5.0 V; CL = 15 pF - 15 - - - - - ns tPHL HIGH to LOW propagation delay MR to Qn; see Figure 8 VCC = 4.5 V - 23 34 - 43 - 51 ns VCC = 5.0 V; CL = 15 pF - 20 - - - - - ns tt transition time Qn output; see Figure 7 [2] VCC = 4.5 V - 7 15 - 19 - 22 ns tW pulse width CP input; see Figure 7 VCC = 4.5 V 16 9 - 20 - 24 - ns MR input LOW; see Figure 8 VCC = 4.5 V 16 8 - 20 - 24 - ns trec recovery time MR to CP; see Figure 8 VCC = 4.5 V 10 2 - 13 - 15 - ns tsu set-up time Dn to CP; see Figure 9 VCC = 4.5 V 12 5 - 15 - 18 - ns th hold time Dn to CP; see Figure 9 VCC = 4.5 V 3 4 - 3 - 3 - ns fmax maximum frequency CP input; see Figure 7 VCC = 4.5 V 30 56 - 24 - 20 - MHz VCC = 5.0 V; CL = 15 pF - 36 - - - - - MHz CPD power dissipation capacitance per package; VI = GND to VCC 1.5 V [3] - 23 - - - - - pF Table 7. Dynamic characteristics …continued GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10 Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 10 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger 11. Waveforms Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 7. Propagation delay clock input (CP) to output (Qn), clock (CP) pulse width, output transition time and the maximum clock pulse frequency 001aae062 CP input Qn output tPHL tPLH tW tW VM 10% 90% VOH VI GND VOL VM VM 1/fmax tTHL tTLH Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load. Fig 8. Propagation delay master reset (MR) to output (Qn), pulse width master reset (MR) and recovery time master reset (MR) to clock (CP) mna464 MR input CP input Qn output tPHL tW trec VM VI GND VI VOL GND VM VM VOH 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 11 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Measurement points are given in Table 8. The shaded areas indicate when the input is permitted to change for predictable output performance. VOL and VOH are typical voltage output levels that occur with the output load. Fig 9. Data set-up and hold times data input (Dn) mna767 GND GND th tsu th tsu VM VM VM VI VOH VOL VI Qn output CP input Dn input Table 8. Measurement points Type Input Output VI VM VM 74HC273 VCC 0.5VCC 0.5VCC 74HCT273 3 V 1.3 V 1.3 V 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 12 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Test data is given in Table 9. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch Fig 10. Test circuit for measuring switching times VM VM tW tW 10 % 90 % 0 V VI VI negative pulse positive pulse 0 V VM VM 90 % 10 % tf tr tr tf 001aad983 DUT VCC VCC VI VO RT RL S1 CL open G Table 9. Test data Type Input Load S1 position VI tr, tf CL RL tPHL, tPLH 74HC273 VCC 6 ns 15 pF, 50 pF 1 k open 74HCT273 3 V 6 ns 15 pF, 50 pF 1 k open 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 13 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger 12. Package outline Fig 11. Package outline SOT146-1 (DIP20) UNIT A max. 1 2 b1 cD E e L MH OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT146-1 99-12-27 03-02-13 A min. A max. b Z max. e1 ME w 1.73 1.30 0.53 0.38 0.36 0.23 26.92 26.54 6.40 6.22 3.60 3.05 2.54 7.62 0.254 8.25 7.80 10.0 8.3 4.2 0.51 3.2 2 0.068 0.051 0.021 0.015 0.014 0.009 1.060 1.045 0.25 0.24 0.14 0.12 0.1 0.3 0.01 0.32 0.31 0.39 0.33 0.17 0.02 0.13 0.078 MS-001 SC-603 MH c (e ) 1 ME A L seating plane A1 w M b1 e D A2 Z 20 1 11 10 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. (1) (1) (1) DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 14 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Fig 12. Package outline SOT163-1 (SO20) UNIT A max. A1 A2 A3 bp c D(1) E(1) (1) e HE L Lp Q ywv Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT163-1 10 20 w M bp detail X Z e 11 1 D y 0.25 075E04 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale X θ A A1 A2 HE Lp Q E c L v M A (A ) 3 A SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 99-12-27 03-02-19 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 15 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Fig 13. Package outline SOT339-1 (SSOP20) UNIT A1 A2 A3 bp c D(1) E(1) e HE L Lp Q (1) Zywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 0.9 0.7 0.9 0.5 8 0 o 1.25 0.2 0.1 0.13 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 SOT339-1 MO-150 99-12-27 03-02-19 X w M θ A A1 A2 bp D HE Lp Q detail X E Z e c L v M A (A ) 3 A 1 10 20 11 y 0.25 pin 1 index 0 2.5 5 mm scale SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 A max. 2 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 16 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Fig 14. Package outline SOT360-1 (TSSOP20) UNIT A1 A2 A3 bp c D (1) E (2) (1) e HE L Lp Q Z ywv θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o 1 0.2 0.13 0.1 o DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M bp D Z e 0.25 1 10 20 11 pin 1 index θ A A1 A2 Lp Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 17 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Fig 15. Package outline SOT764-1 (DHVQFN20) terminal 1 index area 1 0.5 UNIT A1 b Eh e y 0.2 c OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 4.6 4.4 Dh 3.15 2.85 y1 2.6 2.4 1.15 0.85 e1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT764-1 MO-241 - - - - - - 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT764-1 DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm A(1) max. A A1 c detail X y y e 1 C L Eh Dh e e1 b 2 9 19 12 11 1 10 20 X D E C B A terminal 1 index area AC C v M B w M E(1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D(1) 02-10-17 03-01-27 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 18 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger 13. Abbreviations 14. Revision history Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT273 v.4 20130610 Product data sheet - 74HC_HCT273 v.3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74HC_HCT273 v.3 20060124 Product data sheet - 74HC_HCT273_CNV v.2 74HC_HCT273_CNV v.2 19970827 Product specification - - 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 19 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger 15. Legal information 15.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. 74HC_HCT273 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 4 — 10 June 2013 20 of 21 NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors 74HC273; 74HCT273 Octal D-type flip-flop with reset; positive-edge trigger © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 June 2013 Document identifier: 74HC_HCT273 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Recommended operating conditions. . . . . . . . 6 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18 14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16 Contact information. . . . . . . . . . . . . . . . . . . . . 20 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. 1.2 Features and benefits 1.3 Applications High-speed switching General-purpose switching 1.4 Quick reference data [1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. BAV756S; BAW56 series High-speed switching diodes Rev. 6 — 18 March 2015 Product data sheet Table 1. Product overview Type number Package Package configuration Configuration NXP JEITA JEDEC BAV756S SOT363 SC-88 - very small quadruple common anode/common cathode BAW56 SOT23 - TO-236AB small dual common anode BAW56M SOT883 SC-101 - leadless ultra small dual common anode BAW56S SOT363 SC-88 - very small quadruple common anode/common anode BAW56T SOT416 SC-75 - ultra small dual common anode BAW56W SOT323 SC-70 - very small dual common anode High switching speed: trr 4 ns Low capacitance: Cd 2 pF Low leakage current Reverse voltage: VR 90 V Small SMD plastic packages AEC-Q101 qualified Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Per diode IR reverse current VR = 80 V - - 0.5 A VR reverse voltage - - 90 V trr reverse recovery time [1] - - 4 ns BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 2 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 2. Pinning information Table 3. Pinning Pin Description Simplified outline Symbol BAV756S 1 anode (diode 1) 2 cathode (diode 2) 3 common anode (diode 2 and diode 3) 4 cathode (diode 3) 5 anode (diode 4) 6 common cathode (diode 1 and diode 4) BAW56; BAW56T; BAW56W 1 cathode (diode 1) 2 cathode (diode 2) 3 common anode BAW56M 1 cathode (diode 1) 2 cathode (diode 2) 3 common anode BAW56S 1 cathode (diode 1) 2 cathode (diode 2) 3 common anode (diode 3 and diode 4) 4 cathode (diode 3) 5 cathode (diode 4) 6 common anode (diode 1 and diode 2) 1 3 2 56 4 006aab103 1 3 6 2 5 4 006aaa144 1 2 3 006aab099 1 2 3 3 1 2 Transparent top view 006aab099 1 2 3 1 3 2 56 4 006aab102 1 3 6 2 5 4 BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 3 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 3. Ordering information 4. Marking [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 4. Ordering information Type number Package Name Description Version BAV756S SC-88 plastic surface-mounted package; 6 leads SOT363 BAW56 - plastic surface-mounted package; 3 leads SOT23 BAW56M SC-101 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm SOT883 BAW56S SC-88 plastic surface-mounted package; 6 leads SOT363 BAW56T SC-75 plastic surface-mounted package; 3 leads SOT416 BAW56W SC-70 plastic surface-mounted package; 3 leads SOT323 Table 5. Marking codes Type number Marking code[1] BAV756S A7* BAW56 A1* BAW56M S5 BAW56S A1* BAW56T A1 BAW56W A1* Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VRRM repetitive peak reverse voltage - 90 V VR reverse voltage - 90 V IF forward current BAV756S Ts = 60 C - 250 mA BAW56 Tamb 25 C - 215 mA BAW56M Tamb 25 C - 150 mA BAW56S Ts = 60 C - 250 mA BAW56T Ts = 90 C - 150 mA BAW56W Tamb 25 C - 150 mA BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 4 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes [1] Tj = 25 C prior to surge. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Reflow soldering is the only recommended soldering method. [4] Single diode loaded. 6. Thermal characteristics IFRM repetitive peak forward current - 500 mA IFSM non-repetitive peak forward current square wave [1] tp = 1 s - 4 A tp = 1 ms - 1 A tp = 1 s - 0.5 A Ptot total power dissipation [2] BAV756S Ts = 60 C - 350 mW BAW56 Tamb 25 C - 250 mW BAW56M Tamb 25 C [3] - 250 mW BAW56S Ts = 60 C - 350 mW BAW56T Ts = 90 C [4] - 170 mW BAW56W Tamb 25 C - 200 mW Per device IF forward current BAV756S Ts = 60 C - 100 mA BAW56 Tamb 25 C - 125 mA BAW56M Tamb 25 C - 75 mA BAW56S Ts = 60 C - 100 mA BAW56T Ts = 90 C - 75 mA BAW56W Tamb 25 C - 130 mA Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Per diode Rth(j-a) thermal resistance from junction to ambient in free air [1] BAW56 - - 500 K/W BAW56M [2] - - 500 K/W BAW56W - - 625 K/W BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 5 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics [1] Pulse test: tp 300 s; 0.02. [2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA. [3] When switched from IF = 10 mA; tr = 20 ns. Rth(j-sp) thermal resistance from junction to solder point BAV756S - - 255 K/W BAW56 - - 360 K/W BAW56S - - 255 K/W BAW56T - - 350 K/W BAW56W - - 300 K/W Table 7. Thermal characteristics …continued Symbol Parameter Conditions Min Typ Max Unit Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per diode VF forward voltage [1] IF = 1 mA - - 715 mV IF = 10 mA - - 855 mV IF = 50 mA - - 1 V IF = 150 mA - - 1.25 V IR reverse current VR = 25 V - - 30 nA VR = 80 V - - 0.5 A VR = 25 V; Tj = 150 C - - 30 A VR = 80 V; Tj = 150 C - - 150 A Cd diode capacitance VR = 0 V; f = 1 MHz - - 2 pF trr reverse recovery time [2] - - 4 ns VFR forward recovery voltage [3] - - 1.75 V BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 6 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes (1) Tamb = 150 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = 40 C Based on square wave currents. Tj = 25 C; prior to surge Fig 1. Forward current as a function of forward voltage; typical values Fig 2. Non-repetitive peak forward current as a function of pulse duration; maximum values (1) Tamb = 150 C (2) Tamb = 85 C (3) Tamb = 25 C (4) Tamb = 40 C f = 1 MHz; Tamb = 25 C Fig 3. Reverse current as a function of reverse voltage; typical values Fig 4. Diode capacitance as a function of reverse voltage; typical values 006aab109 VF (V) 0.2 1.4 0.6 1.0 1 10 102 103 IF (mA) 10−1 (1) (2) (3) (4) mbg704 10 1 102 IFSM (A) 10−1 tp (μs) 1 104 103 10 102 006aab110 10−2 10−4 10−3 10 1 10−1 102 IR (μA) 10−5 VR (V) 0 100 20 40 60 80 (1) (2) (3) (4) 0 25 VR (V) 2.5 0 0.5 mbh191 1.0 1.5 2.0 5 Cd (pF) 10 15 20 BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 7 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. (1) IR = 1 mA Input signal: reverse pulse rise time tr = 0.6 ns; reverse voltage pulse duration tp = 100 ns; duty cycle = 0.05 Oscilloscope: rise time tr = 0.35 ns Fig 5. Reverse recovery time test circuit and waveforms Input signal: forward pulse rise time tr = 20 ns; forward current pulse duration tp 100 ns; duty cycle 0.005 Fig 6. Forward recovery voltage test circuit and waveforms trr (1) + IF t output signal tr tp t 10 % 90 % VR input signal V = VR + IF × RS RS = 50 Ω IF D.U.T. Ri = 50 Ω SAMPLING OSCILLOSCOPE mga881 tr t tp 10 % 90 % I input signal RS = 50 Ω I Ri = 50 Ω OSCILLOSCOPE 1 kΩ 450 Ω D.U.T. mga882 VFR t output signal V BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 8 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 9. Package outline Fig 7. Package outline BAW56 (SOT23/TO-236AB) Fig 8. Package outline BAW56M (SOT883/SC-101) Fig 9. Package outline BAV756S and BAW56S (SOT363/SC-88) Fig 10. Package outline BAW56T (SOT416/SC-75) Fig 11. Package outline BAW56W (SOT323/SC-70) Dimensions in mm 04-11-04 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 1 2 3 Dimensions in mm 03-04-03 0.62 0.55 0.55 0.47 0.50 0.46 0.65 0.20 0.12 3 2 1 0.30 0.22 0.30 0.22 1.02 0.95 0.35 0.25 0.10 0.3 0.2 pin 1 index 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 1 3 2 6 5 4 Dimensions in mm 14-10-03 Dimensions in mm 04-11-04 0.95 0.60 1.8 1.4 1.75 1.45 0.9 0.7 0.25 0.10 1 0.30 0.15 1 2 3 0.45 0.15 Dimensions in mm 04-11-04 0.45 0.15 1.1 0.8 2.2 1.8 2.2 2.0 1.35 1.15 1.3 0.4 0.3 0.25 0.10 1 2 3 BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 9 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 10. Packing information [1] For further information and the availability of packing methods, see Section 14. [2] T1: normal taping [3] T2: reverse taping 11. Soldering Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 BAV756S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 BAW56 SOT23 4 mm pitch, 8 mm tape and reel -215 -235 BAW56M SOT883 2 mm pitch, 8 mm tape and reel - -315 BAW56S SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 -135 4 mm pitch, 8 mm tape and reel; T2 [3] -125 -165 BAW56T SOT416 4 mm pitch, 8 mm tape and reel -115 -135 BAW56W SOT323 4 mm pitch, 8 mm tape and reel -115 -135 Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB) solder lands solder resist occupied area solder paste sot023_fr 0.5 (3×) 0.6 (3×) 0.6 (3×) 0.7 (3×) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 10 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB) Reflow soldering is the only recommended soldering method. Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101) solder lands solder resist occupied area preferred transport direction during soldering sot023_fw 2.8 4.5 1.4 4.6 1.4 (2×) 1.2 (2×) 2.2 2.6 Dimensions in mm solder lands solder resist occupied area solder paste sot883_fr 1.3 0.3 0.6 0.7 0.4 0.9 0.3 (2×) 0.4 (2×) 0.25 (2×) 0.7 R0.05 (12×) Dimensions in mm BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 11 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88) Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88) solder lands solder resist occupied area solder paste sot363_fr 2.65 2.35 0.4 (2×) 0.6 (2×) 0.5 (4×) 0.5 (4×) 0.6 (4×) 0.6 (4×) 1.5 1.8 Dimensions in mm sot363_fw solder lands solder resist occupied area preferred transport direction during soldering 5.3 1.3 1.3 1.5 0.3 1.5 4.5 2.45 2.5 Dimensions in mm BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 12 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes Fig 17. Reflow soldering footprint BAW56T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAW56W (SOT323/SC-70) Fig 19. Wave soldering footprint BAW56W (SOT323/SC-70) solder resist occupied area Dimensions in mm solder lands solder paste msa438 2.0 0.6 (3x) 0.7 1.5 1 2 3 1.1 2.2 0.5 (3x) 0.85 0.6 1.9 msa429 0.852.35 0.55 (3×) 0.75 1.325 2.40 2.65 1.30 3 2 1 0.60 (3×) 0.50 (3×) 1.90 solder lands solder resist occupied area solder paste Dimensions in mm msa419 4.00 4.60 2.103.65 1.15 2.70 3 2 1 0.90 (2×) preferred transport direction during soldering solder lands solder resist occupied area Dimensions in mm BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 13 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes BAV756S_BAW56_SER v.6 20150318 Product data sheet - BAV756S_BAW56_SER_ 5 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. BAV756S_BAW56_SER_5 20071126 Product data sheet - BAV756S_2 BAW56_4 BAW56S_2 BAW56T_2 BAW56W_4 BAV756S_2 19971021 Product specification - BAV756S_1 BAW56_4 20030325 Product specification - BAW56_3 BAW56S_2 19971021 Product specification - BAW56S_1 BAW56T_2 19971219 Product specification - - BAW56W_4 19990511 Product specification - BAW56W_3 BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 14 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. BAV756S_BAW56_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 6 — 18 March 2015 15 of 16 NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors BAV756S; BAW56 series High-speed switching diodes © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 March 2015 Document identifier: BAV756S_BAW56_SER Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information . . . . . . . . . . . . . . . . . . . . . 9 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Contact information. . . . . . . . . . . . . . . . . . . . . 15 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PWP RHB NT 1FEATURES APPLICATIONS DESCRIPTION Delay x0 12−Bit Grayscale PWM Control DC Register GS Register DC EEPROM Constant Current Driver LED Open Detection Temperature Error Flag (TEF) Max. OUTn Current Delay x1 12−Bit Grayscale PWM Control DC Register GS Register DC EEPROM Constant Current Driver LED Open Detection Delay x15 6−Bit Dot 12−Bit Grayscale PWM Control DC Register GS Register DC EEPROM Constant Current Driver LED Open Detection OUT0 OUT1 OUT15 SOUT SCLK SIN IREF XERR XLAT GSCLK BLANK DCPRG DCPRG DCPRG VPRG VPRG VPRG VCC GND VPRG Input Shift Register Input Shift Register VPRG 0 11 12 23 180 191 90 95 6 11 5 VPRG 0 0 95 96 191 LED Open Detection (LOD) 5 90 95 6 11 DCPRG 0 192 96 1 0 1 0 0 1 1 0 GS Counter CNT CNT CNT CNT 96 96 Status Information: LOD, TED, DC DATA 192 0 191 1 0 0 1 VREF =1.24 V Correction 6−Bit Dot Correction 6−Bit Dot Correction 1 0 Blank TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 www.ti.com 16 CHANNEL LED DRIVER WITH DOT CORRECTION AND GRAYSCALE PWM CONTROL 2• 16 Channels • Monocolor, Multicolor, Full-Color LED Displays • 12 bit (4096 Steps) Grayscale PWM Control • LED Signboards • Dot Correction • Display Backlighting • General, High-Current LED Drive – 6 bit (64 Steps) – Storable in Integrated EEPROM • Drive Capability (Constant-Current Sink) The TLC5940 is a 16-channel, constant-current sink – 0 mA to 60 mA (VCC < 3.6 V) LED driver. Each channel has an individually – 0 mA to 120 mA (VCC > 3.6 V) adjustable 4096-step grayscale PWM brightness • LED Power Supply Voltage up control and a 64-step, constant-current sink (dot to 17 V correction). The dot correction adjusts the brightness • VCC = 3 V to 5.5 V variations between LED channels and other LED • Serial Data Interface drivers. The dot correction data is stored in an • Controlled In-Rush Current integrated EEPROM. Both grayscale control and dot correction are accessible via a serial interface. A • 30MHz Data Transfer Rate single external resistor sets the maximum current • CMOS Level I/O value of all 16 channels. • Error Information The TLC5940 features two error information circuits. – LOD: LED Open Detection The LED open detection (LOD) indicates a broken or – TEF: Thermal Error Flag disconnected LED at an output terminal. The thermal error flag (TEF) indicates an overtemperature condition. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2004–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS. TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA PACKAGE(1) PART NUMBER 28-pin HTSSOP PowerPAD™ TLC5940PWP –40°C to 85°C 32-pin 5mm x 5mm QFN TLC5940RHB 28-pin PDIP TLC5940NT (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. over operating free-air temperature range (unless otherwise noted) (1) UNIT VI Input voltage range(2) VCC –0.3V to 6V IO Output current (dc) 130mA VI Input voltage range V(BLANK), V(DCPRG), V(SCLK), V(XLAT), V(SIN), V(GSCLK), V(IREF) –0.3V to VCC +0.3V V(SOUT), V(XERR) –0.3V to VCC +0.3V VO Output voltage range V(OUT0) to V(OUT15) –0.3V to 18V EEPROM program range V(VPRG) –0.3V to 24V EEPROM write cycles 50 HBM (JEDEC JESD22-A114, Human Body Model) 2kV ESD rating CBM (JEDEC JESD22-C101, Charged Device Model) 500V Tstg Storage temperature range –55°C to 150°C TA Operating ambient temperature range –40°C to 85°C HTSSOP (PWP) (4) 31.58°C/W Package thermal impedance(3) QFN (RHB) 35.9°C/W PDIP (NP) 48°C/W (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) The package thermal impedance is calculated in accordance with JESD 51-7. (4) With PowerPAD soldered on PCB with 2 oz. (56,7 grams) trace of copper. See SLMA002 for further information. 2 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com RECOMMENDED OPERATING CONDITIONS DISSIPATION RATINGS TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 MIN NOM MAX UNIT DC CHARACTERISTICS VCC Supply Voltage 3 5.5 V VO Voltage applied to output (OUT0–OUT15) 17 V VIH High-level input voltage 0.8 VCC VCC V VIL Low-level input voltage GND 0.2 VCC V IOH High-level output current VCC = 5V at SOUT –1 mA IOL Low-level output current VCC = 5V at SOUT, XERR 1 mA OUT0 to OUT15, VCC < 3.6V 60 mA IOLC Constant output current OUT0 to OUT15, VCC > 3.6V 120 mA V(VPRG) EEPROM program voltage 20 22 23 V TA Operating free-air temperature range -40 85 °C AC CHARACTERISTICS VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted) f (SCLK) Data shift clock frequency SCLK 30 MHz f (GSCLK) Grayscale clock frequency GSCLK 30 MHz twh0/twl0 SCLK pulse duration SCLK = H/L (see Figure 11) 16 ns twh1/twl1 GSCLK pulse duration GSCLK = H/L (see Figure 11) 16 ns twh2 XLAT pulse duration XLAT = H (see Figure 11) 20 ns twh3 BLANK pulse duration BLANK = H (see Figure 11) 20 ns t su0 SIN to SCLK ↑ (1) (see Figure 11) 5 ns t su1 SCLK ↓ to XLAT ↑ (see Figure 11) 10 ns t su2 VPRG ↑ ↓ to SCLK ↑ (see Figure 11) 10 ns t su3 Setup time VPRG ↑ ↓XLAT ↑ (see Figure 11) 10 ns t su4 BLANK ↓ to GSCLK ↑ (see Figure 11) 10 ns t su5 XLAT ↑ to GSCLK ↑ (see Figure 11) 30 ns t su6 VPRG ↑ to DCPRG ↑ (see Figure 16) 1 ms th0 SCLK ↑ to SIN (see Figure 11) 3 ns th1 XLAT ↓ to SCLK ↑ (see Figure 11) 10 ns th2 SCLK ↑ to VPRG ↑ ↓ (see Figure 11) 10 ns Hold Time th3 XLAT ↓ to VPRG ↑ ↓ (see Figure 11) 10 ns th4 GSCLK ↑ to BLANK ↑ (see Figure 11) 10 ns th5 DCPRG ↓ to VPRG ↓ (see Figure 11) 1 ms tprog Programming time for EEPROM (see Figure 16) 20 ms (1) ↑ and ↓ indicates a rising edge, and a falling edge respectively. POWER RATING DERATING FACTOR POWER RATING POWER RATING PACKAGE TA < 25°C ABOVE TA = 25°C TA = 70°C TA = 85°C 28-pin HTSSOP with 3958mW 31.67mW/C 2533mW 2058mW PowerPAD™(1) soldered 28-pin HTSSOP with PowerPAD™ 2026mW 16.21mW/°C 1296mW 1053mW unsoldered 32-pin QFN(1) 3482mW 27.86mW/°C 2228mW 1811mW 28-pin PDIP 2456mW 19.65mW/°C 1572mW 1277mW (1) The PowerPAD is soldered to the PCB with a 2 oz. (56,7 grams) copper trace. See SLMA002 for further information. Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TLC5940 www.ti.com ELECTRICAL CHARACTERISTICS TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage IOH = -1mA, SOUT VCC –0.5 V VOL Low-level output voltage IOL = 1mA, SOUT 0.5 V VI = VCC or GND; BLANK, DCPRG, GSCLK, SCLK, SIN, –1 1 XLAT µA I VI = GND; VPRG –1 1 I Input current VI = VCC; VPRG 50 VI = 22V; VPRG; DCPRG = VCC 4 10 mA No data transfer, all output OFF, 0.9 6 VO = 1V, R(IREF) = 10kΩ No data transfer, all output OFF, 5.2 12 VO = 1V, R(IREF) = 1.3kΩ ICC Supply current mA Data transfer 30MHz, all output ON, 16 25 VO = 1V, R(IREF) = 1.3kΩ Data transfer 30MHz, all output ON, 30 60 VO = 1V, R(IREF) = 640Ω Constant sink current (see IO(LC) All output ON, VO = 1V, R(IREF) = 640Ω 54 61 69 mA Figure 2) All output OFF, VO = 15V, R(IREF) = 640Ω, I lkg Leakage output current 0.1 µA OUT0 to OUT15 All output ON, VO = 1V, R(IREF) = 640Ω, 1 ±4 OUT0 to OUT15, –20°C to 85°C All output ON, VO = 1V, R(IREF) = 640Ω, 1 8 OUT0 to OUT15(1) Constant sink current error ΔIO(LC0) % (see Figure 2) All output ON, VO = 1V, R(IREF) = 320Ω, 1 6 OUT0 to OUT15, –20°C to 85°C All output ON, VO = 1V, R(IREF) = 320Ω, ±1 ±8 VCC = 4.5V to 5.5V, OUT0 to OUT15(1) Constant sink current error Device to device, Averaged current from OUT0 to –2 ΔIO(LC1) 4 % (see Figure 2) OUT15, R(IREF) = 1920Ω (20mA) (2) +0.4 Constant sink current error Device to device, Averaged current from OUT0 to –2.7 ΔIO(LC2) ±4 % (see Figure 2) OUT15, R(IREF) = 480Ω (80mA) (2) +2 All output ON, VO = 1V, R(IREF) = 640Ω 1 ±4 %/V OUT0 to OUT15, VCC = 3V to 5.5V(3) ΔIO(LC3) Line regulation (see Figure 2) All output ON, VO = 1V, R(IREF) = 320Ω , ±1 ±6 %/V OUT0 to OUT15, VCC = 3V to 5.5V(3) All output ON, VO = 1V to 3V, R(IREF) = 640Ω, ±2 ±6 %/V OUT0 to OUT15(4) ΔIO(LC4) Load regulation (see Figure 2) All output ON, VO = 1V to 3V, R(IREF) = 320Ω, 2 8 %/V OUT0 to OUT15(4) T(TEF) Thermal error flag threshold Junction temperature(5) 150 170 C V(LED) LED open detection threshold 0.3 0.4 V Reference voltage V(IREF) R(IREF) = 640Ω 1.20 1.24 1.28 V output (1) The deviation of each output from the average of OUT0-15 constant current. It is calculated by Equation 1 in Table 1. (2) The deviation of average of OUT1-15 constant current from the ideal constant-current value. It is calculated by Equation 2 in Table 1. The ideal current is calculated by Equation 3 in Table 1. (3) The line regulation is calculated by Equation 4 in Table 1. (4) The load regulation is calculated by Equation 5 in Table 1. (5) Not tested. Specified by design 4 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com 100 I I I (%) OUTavg _ 0 15 OUTn OUTavg _ 0 15 ´ - D = - - (1) 100 I I I (%) OUT(IDEAL) OUTavg OUT(IDEAL) ´ - D = (2) ÷ ÷ ø ö ç ç è æ = ´ IREF OUT(IDEAL) R .1 24V I 31 5. (3) 5.2 100 I( at V 0.3 V) I( at V 5.5 V) I( at V 0.3 V) (% / V) OUTn CC OUTn CC OUTn CC ´ = = - = D = (4) 0.2 100 I( at V 0.1 V) I( at V 0.3 V) I( at V 0.1 V) (%/ V) OUTn OUTn OUTn OUTn OUTn OUTn ´ = = - = D = (5) SWITCHING CHARACTERISTICS TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Table 1. Test Parameter Equations VCC = 3V to 5.5V, TA = -40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT t r0 SOUT 16 Rise time ns t r1 OUTn, VCC = 5V, TA = 60°C, DCn = 3Fh 10 30 t f0 SOUT 16 Fall time ns t f1 OUTn, VCC = 5V, TA = 60°C, DCn = 3Fh 10 30 tpd0 SCLK to SOUT (see Figure 11) 30 ns tpd1 BLANK to OUT0 60 ns tpd2 OUTn to XERR (see Figure 11 ) 1000 ns Propagation delay time tpd3 GSCLK to OUT0 (see Figure 11 ) 60 ns tpd4 XLAT to IOUT (dot correction) (see Figure 11 ) 60 ns tpd5 DCPRG to OUT0 (see Figure 11) 30 ns td Output delay time OUTn to OUT(n+1) (see Figure 11 ) 20 30 ns ton-err Output on-time error touton– Tgsclk (see Figure 11), GSn = 01h, GSCLK = 11 MHz 10 –50 –90 ns Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): TLC5940 www.ti.com DEVICE INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 GND BLANK XLAT SCLK SIN VPRG OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 VCC IREF DCPRG GSCLK SOUT XERR OUT15 OUT14 OUT13 OUT12 OUT11 OUT10 OUT9 OUT8 PWP PACKAGE (TOP VIEW) Thermal PAD THERMAL PAD GSCLK 24 SOUT 23 XERR 22 OUT15 21 OUT14 20 OUT13 19 OUT12 18 OUT11 17 16 OUT10 15 OUT9 14 OUT8 13 NC 12 NC 11 OUT7 10 OUT6 9 OUT5 OUT4 8 OUT3 7 OUT2 6 OUT1 5 OUT0 4 VPRG 3 SIN 2 SCLK 1 DCPRG 25 IREF 26 VCC 27 NC 28 NC 29 GND 30 BLANK 31 XLAT 32 RHB PACKAGE (TOP VIEW) NC − No internal connection 1 2 3 4 5 6 7 8 9 10 11 12 13 14 18 17 16 15 22 21 20 19 26 25 24 23 28 27 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 OUT9 OUT10 OUT11 OUT12 OUT13 OUT14 GND VCC IREF DCPRG GSCLK SOUT XERR OUT15 SCLK XLAT BLANK OUT0 VPRG SIN NT PACKAGE (TOP VIEW) TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 6 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 TERMINAL FUNCTION TERMINAL NO. I/O DESCRIPTION NAME DIP PWP RHB Blank all outputs. When BLANK = H, all OUTn outputs are forced OFF. GS counter is also BLANK 23 2 31 I reset. When BLANK = L, OUTn are controlled by grayscale PWM control. Switch DC data input. When DCPRG = L, DC is connected to EEPROM. When DCPRG = H, DCPRG 19 26 25 I DC is connected to the DC register. DCPRG also controls EEPROM writing, when VPRG = V(PRG). EEPROM data = 3Fh (default) GND 22 1 30 G Ground GSCLK 18 25 24 I Reference clock for grayscale PWM control IREF 20 27 26 I Reference current terminal 12, 13, NC – – No connection 28, 29 OUT0 28 7 4 O Constant current output OUT1 1 8 5 O Constant current output OUT2 2 9 6 O Constant current output OUT3 3 10 7 O Constant current output OUT4 4 11 8 O Constant current output OUT5 5 12 9 O Constant current output OUT6 6 13 10 O Constant current output OUT7 7 14 11 O Constant current output OUT8 8 15 14 O Constant current output OUT9 9 16 15 O Constant current output OUT10 10 17 16 O Constant current output OUT11 11 18 17 O Constant current output OUT12 12 19 18 O Constant current output OUT13 13 20 19 O Constant current output OUT14 14 21 20 O Constant current output OUT15 15 22 21 O Constant current output SCLK 25 4 1 I Serial data shift clock SIN 26 5 2 I Serial data input SOUT 17 24 23 O Serial data output VCC 21 28 27 I Power supply voltage Multifunction input pin. When VPRG = GND, the device is in GS mode. When VPRG = VCC, the VPRG 27 6 3 I device is in DC mode. When VPRG = V(VPRG), DC register data can programmed into DC EEPROM with DCPRG=HIGH. EEPROM data = 3Fh (default) XERR 16 23 22 O Error output. XERR is an open-drain terminal. XERR goes L when LOD or TEF is detected. Level triggered latch signal. When XLAT = high, the TLC5940 writes data from the input shift XLAT 24 3 32 I register to either GS register (VPRG = low) or DC register (VPRG = high). When XLAT = low, the data in GS or DC register is held constant. Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TLC5940 www.ti.com PARAMETER MEASUREMENT INFORMATION PIN EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS VCC INPUT GND 400 W INPUT EQUIVALENT CIRCUIT (BLANK, XLAT, SCLK, SIN, GSCLK, DCPRG) 23 W 23 SOUT GND OUTPUT EQUIVALENT CIRCUIT (SOUT) _ + Amp 400 W 100 W VCC INPUT GND INPUT EQUIVALENT CIRCUIT (IREF) XERR GND OUTPUT EQUIVALENT CIRCUIT (XERR) 23 W INPUT INPUT GND GND INPUT EQUIVALENT CIRCUIT (VCC) INPUT EQUIVALENT CIRCUIT (VPRG) OUT GND OUTPUT EQUIVALENT CIRCUIT (OUT) VCC W V(IREF) TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Resistor values are equivalent resistances, and they are not tested. Figure 1. Input and Output Equivalent Circuits 8 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com SOUT OUTn t , t , t r0 f0 pd0 t , t , t , t , t , t , t , t r1 f1 pd1 pd2 pd3 pd4 pd5 d VO = 4V Testpoint C = 15pF L Testpoint R = 51 L W C = 15pF L V = 1V O OUTn V = 1V to 3V O OUTn IREF R (IREG) 470kΩ Testpoint V(IREF) VCC XERR tpd3 I , I , I , I , I O(LC) O(LC0) O(LC1) O(LC2) O(LC3) D D D D DIO(LC4) = 640W TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 PARAMETER MEASUREMENT INFORMATION (continued) Figure 2. Parameter Measurement Circuits Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Link(s): TLC5940 www.ti.com TYPICAL CHARACTERISTICS 100 1 k 10 k IO − Output Current − mA 0 20 60 100 Reference Resistor, R - (IREF) W 40 80 120 7.68 kΩ 1.92 kΩ 0.96 kΩ 0.64 kΩ 0.38 kΩ 0.32 kΩ 0.48 kΩ 0 1 k 3 k 4 k 2 k TA − Free-Air Temperature − C o -20 0 20 100 Power Dissipation Rate - mW -40 40 60 80 TLC5940PWP PowerPAD Soldered TLC5940PWP PowerPAD Unsoldered TLC5940RHB TLC5940NT 0 20 40 60 80 100 120 140 0 0.5 1 1.5 2 2.5 3 V - Output Voltage - V O I - Output Current - mA O T = 25 C, V = 5 V A CC ° I = 120 mA O I = 100 mA O I = 80 mA O I = 60 mA O I = 40 mA O I = 20 mA O I = 5 mA O 55 56 57 58 59 60 61 62 63 64 65 0 0.5 1 1.5 2 2.5 3 V - Output Voltage - V O I - Output Current - mA O I = 60 mA, V = 5 V O CC T = 85 C A ° T = -40 C A ° T = 25 C A ° TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 REFERENCE RESISTOR POWER DISSIPATION RATE vs vs OUTPUT CURRENT FREE-AIR TEMPERATURE Figure 3. Figure 4. OUTPUT CURRENT OUTPUT CURRENT vs vs OUTPUT VOLTAGE OUTPUT VOLTAGE Figure 5. Figure 6. 10 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com -8 -6 -4 -2 0 2 4 6 8 0 20 40 60 80 I - Output Current - mA O Δ I - Constant Output Current - % OLC T = 25 C, V = 5 V A CC ° -8 -6 -4 -2 0 2 4 6 8 -40 -20 0 20 40 60 80 100 T - Ambient Temperature - C A ° Δ I - Constant Output Current - % OLC V = 3.3 V CC V = 5 V CC I = 60 mA O 0 20 40 60 80 100 120 140 0 10 20 30 40 50 60 70 Dot Correction Data - dec I - Output Current - mA O I = 5 mA O I = 60 mA O I = 80 mA O I = 120 mA O I = 30 mA O T = 25 C, V = 5 V A CC ° 0 10 20 30 40 50 60 70 0 10 20 30 40 50 60 70 Dot Correction Data - dec I - Output Current - mA O T = -40 C A ° T = 25 C A ° T = 85 C A ° I = 60 mA, V = 5 V O CC TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (continued) CONSTANT OUTPUT CURRENT, ΔIOLC CONSTANT OUTPUT CURRENT, ΔIOLC vs vs AMBIENT TEMPERATURE OUTPUT CURRENT Figure 7. Figure 8. OUTPUT CURRENT OUTPUT CURRENT vs vs DOT CORRECTION LINEARITY (ABS VALUE) DOT CORRECTION LINEARITY (ABS VALUE) Figure 9. Figure 10. Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): TLC5940 www.ti.com PRINCIPLES OF OPERATION SERIAL INTERFACE VPRG XLAT SIN SCLK SOUT BLANK GSCLK OUT0 (current) OUT1 (current) OUT15 (current) XERR 1 96 DC MSB DC LSB DC MSB 1 192 193 1 192 193 1 1 4096 t t su4 h4 twh3 1 GS1 MSB GS1 LSB GS1 MSB GS2 MSB GS2 LSB GS2 MSB SID2 MSB SID2 MSB-1 SID1 MSB SID1 MSB-1 SID1 LSB GS3 MSB - - - twh2 t su2 t su1 twh0 twl0 t su0 th0 tpd0 tpd1 t + t pd1 d t + 15 x t pd1 d tpd3 td 15 x td tpd2 t + t pd3 d tpd3 tpd4 twl1 twh1 DC Data Input Mode GS Data Input Mode 1st GS Data Input Cycle 2nd GS Data Input Cycle 1st GS Data Output Cycle 2nd GS Data Output Cycle t su3 th3 th2 th1 t su5 Tgsclk touton SIN(a) SIN SOUT SOUT(b) TLC5940 (a) GSCLK, BLANK, SIN SOUT TLC5940 (b) SCLK, XLAT, VPRG DCPRG, TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 The TLC5940 has a flexible serial interface, which can be connected to microcontrollers or digital signal processors in various ways. Only 3 pins are needed to input data into the device. The rising edge of SCLK signal shifts the data from the SIN pin to the internal register. After all data is clocked in, a high-level pulse of XLAT signal latches the serial data to the internal registers. The internal registers are level-triggered latches of XLAT signal. All data are clocked in with the MSB first. The length of serial data is 96 bit or 192 bit, depending on the programming mode. Grayscale data and dot correction data can be entered during a grayscale cycle. Although new grayscale data can be clocked in during a grayscale cycle, the XLAT signal should only latch the grayscale data at the end of the grayscale cycle. Latching in new grayscale data immediately overwrites the existing grayscale data. Figure 11 shows the timing chart. More than two TLC5940s can be connected in series by connecting an SOUT pin from one device to the SIN pin of the next device. An example of cascading two TLC5940s is shown in Figure 12 and the timing chart is shown in Figure 13. The SOUT pin can also be connected to the controller to receive status information from TLC5940 as shown in Figure 22. Figure 11. Serial Data Input Timing Chart Figure 12. Cascading Two TLC5940 Devices 12 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com VPRG XLAT SIN(a) SCLK SOUT(b) BLANK GSCLK OUT0 (current) OUT1 (current) OUT15 (current) XERR 1 192X2 DCb MSB DCa LSB DCb MSB 1 384 385 1 384 385 1 1 4096 1 GSb1 MSB GSa1 LSB GSb1 MSB GSb2 MSB GSa2 LSB GSb2 MSB SIDb2 MSB SIDb2 MSB-1 SIDb1 MSB SIDb1 MSB-1 SIDa1 LSB GSb3 MSB - - - 192 96X2 ERROR INFORMATION OUTPUT TEF: THERMAL ERROR FLAG TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Figure 13. Timing Chart for Two Cascaded TLC5940 Devices The open-drain output XERR is used to report both of the TLC5940 error flags, TEF and LOD. During normal operating conditions, the internal transistor connected to the XERR pin is turned off. The voltage on XERR is pulled up to VCC through an external pullup resistor. If TEF or LOD is detected, the internal transistor is turned on, and XERR is pulled to GND. Since XERR is an open-drain output, multiple ICs can be OR'ed together and pulled up to VCC with a single pullup resistor. This reduces the number of signals needed to report a system error (see Figure 22). To differentiate LOD and TEF signal from XERR pin, LOD can be masked out with BLANK = HIGH. Table 2. XERR Truth Table ERROR CONDITION ERROR INFORMATION SIGNALS TEMPERATURE OUTn VOLTAGE TEF LOD BLANK XERR TJ < T(TEF) Don't Care L X H H TJ > T(TEF) Don't Care H X L OUTn > V(LED) L L H TJ < T(TEF) OUTn < V(LED) L H L L OUTn > V(LED) H L L TJ > T(TEF) OUTn < V(LED) H H L The TLC5940 provides a temperature error flag (TEF) circuit to indicate an overtemperature condition of the IC. If the junction temperature exceeds the threshold temperature (160C typical), TEF becomes H and XERR pin goes to low level. When the junction temperature becomes lower than the threshold temperature, TEF becomes L and XERR pin becomes high impedance. TEF status can also be read out from the TLC5940 status register. Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Link(s): TLC5940 www.ti.com LOD: LED OPEN DETECTION DELAY BETWEEN OUTPUTS OUTPUT ENABLE SETTING MAXIMUM CHANNEL CURRENT Imax V (IREF) R(IREF) 31.5 (6) TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 The TLC5940 has an LED-open detector that detects broken or disconnected LEDs. The LED open detector pulls the XERR pin to GND when an open LED is detected. XERR and the corresponding error bit in the Status Information Data is only active under the following open-LED conditions. 1. OUTn is on and the time tpd2 (1 µs typical) has passed. 2. The voltage of OUTn is < 0.3V (typical) The LOD status of each output can be also read out from the SOUT pin. See STATUS INFORMATION OUTPUT section for details. The LOD error bits are latched into the Status Information Data when XLAT returns to a low after a high. Therefore, the XLAT pin must be pulsed high then low while XERR is active in order to latch the LOD error into the Status Information Data for subsequent reading via the serial shift register. The TLC5940 has graduated delay circuits between outputs. These circuits can be found in the constant current driver block of the device (see the functional block diagram). The fixed-delay time is 20ns (typical), OUT0 has no delay, OUT1 has 20ns delay, and OUT2 has 40ns delay, etc. The maximum delay is 300ns from OUT0 to OUT15. The delay works during switch on and switch off of each output channel. These delays prevent large inrush currents which reduces the bypass capacitors when the outputs turn on. All OUTn channels of the TLC5940 can be switched off with one signal. When BLANK is set high, all OUTn channels are disabled, regardless of logic operations of the device. The grayscale counter is also reset. When BLANK is set low, all OUTn channels work under normal conditions. If BLANK goes low and then back high again in less than 300ns, all outputs programmed to turn on still turn on for either the programmed number of grayscale clocks, or the length of time that the BLANK signal was low, which ever is lower. For example, if all outputs are programmed to turn on for 1ms, but the BLANK signal is only low for 200ns, all outputs still turn on for 200ns, even though some outputs are turning on after the BLANK signal has already gone high. Table 3. BLANK Signal Truth Table BLANK OUT0 - OUT15 LOW Normal condition HIGH Disabled The maximum output current per channel is programmed by a single resistor, R(IREF), which is placed between IREF pin and GND pin. The voltage on IREF is set by an internal band gap V(IREF) with a typical value of 1.24V. The maximum channel current is equivalent to the current flowing through R(IREF) multiplied by a factor of 31.5. The maximum output current per channel can be calculated by Equation 6: where: V(IREF) = 1.24 V R(IREF) = User-selected external resistor. Imax must be set between 5 mA and 120 mA. The output current may be unstable if Imax is set lower than 5 mA. Output currents lower than 5 mA can be achieved by setting Imax to 5 mA or higher and then using dot correction. Figure 3 shows the maximum output current IO versus R(IREF). R(IREF) is the value of the resistor between IREF terminal to GND, and IO is the constant output current of OUT0 to OUT15. A variable power supply may be connected to the IREF pin through a resistor to change the maximum output current per channel. The maximum output current per channel is 31.5 times the current flowing out of the IREF pin. 14 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com POWER DISSIPATION CALCULATION P = V x I + D CC CC V x I OUT MAX x DCn 63 x dPWM x N ( ) ( ) (7) OPERATING MODES SETTING DOT CORRECTION IOUTn Imax DCn 63 (8) TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 The device power dissipation must be below the power dissipation rating of the device package to ensure correct operation. Equation 7 calculates the power dissipation of device: where: VCC: device supply voltage ICC: device supply current VOUT: TLC5940 OUTn voltage when driving LED current IMAX: LED current adjusted by R(IREF) Resistor DCn: maximum dot correction value for OUTn N: number of OUTn driving LED at the same time dPWM: duty cycle defined by BLANK pin or GS PWM value The TLC5940 has operating modes depending on the signals DCPRG and VPRG. Table 4 shows the available operating modes. The TPS5940 GS operating mode (see Figure 11) and shift register values are not defined after power up. One solution to solve this is to set dot correction data after TLS5940 power-up and switch back to GS PWM mode. The other solution is to overflow the input shift register with 193 bits of dummy data and latch it while TLS540 is in GS PWM mode. The values in the input shift register, DC register and GS register are unknown just after power on. The DC and GS register values should be properly stored through the serial interface before starting the operation. Table 4. TLC5940 Operating Modes Truth Table SIGNAL INPUT SHIFT REGISTER MODE DC VALUE DCPRG VPRG L EEPROM GND 192 bit Grayscale PWM Mode H DC Register L EEPROM VCC 96 bit Dot Correction Data Input Mode H DC Register L EEPROM H V(VPRG) X EEPROM Programming Mode Write dc register value to EEPROM. (Default data: 3Fh) The TLC5940 has the capability to fine adjust the output current of each channel OUT0 to OUT15 independently. This is also called dot correction. This feature is used to adjust the brightness deviations of LEDs connected to the output channels OUT0 to OUT15. Each of the 16 channels can be programmed with a 6-bit word. The channel output can be adjusted in 64 steps from 0% to 100% of the maximum output current Imax. Dot correction for all channels must be entered at the same time. Equation 8 determines the output current for each output n: where: Imax = the maximum programmable output current for each output. DCn = the programmed dot correction value for output n (DCn = 0 to 63). n = 0 to 15 Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Link(s): TLC5940 www.ti.com DC 0.0 0 DC 1.0 6 DC 15.0 90 DC 15.5 95 DC 0.5 5 DC 14.5 89 MSB LSB DC OUT15 DC OUT14 − DC OUT2 DC OUT0 tsu1 DC n MSB DC n MSB−1 DC n MSB−2 DC n LSB+1 DC n LSB DC n MSB DC n+1 MSB DC n+1 MSB−1 DC n MSB−1 DC n MSB−2 DC n−1 LSB DC n−1 LSB+1 DC n−1 MSB DC n−1 MSB−1 DC n−1 MSB−2 SCLK 1 2 3 95 96 1 2 SOUT SIN VPRG XLAT DC Mode Data Input Cycle n DC Mode Data Input Cycle n+1 VCC twh0 twl0 DC n−1 LSB twh2 th1 TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Figure 14 shows the dot correction data packet format which consists of 6 bits x 16 channel, total 96 bits. The format is Big-Endian format. This means that the MSB is transmitted first, followed by the MSB-1, etc. The DC 15.5 in Figure 14 stands for the 5th most significant bit for output 15. Figure 14. Dot Correction Data Packet Format When VPRG is set to VCC, the TLC5940 enters the dot correction data input mode. The length of input shift register becomes 96 bits. After all serial data are shifted in, the TLC5940 writes the data in the input shift register to DC register when XLAT is high, and holds the data in the DC register when XLAT is low. The DC register is a level triggered latch of XLAT signal. Since XLAT is a level-triggered signal, SCLK and SIN must not be changed while XLAT is high. After XLAT goes low, data in the DC register is latched and does not change. BLANK signal does not need to be high to latch in new data. XLAT has setup time (tsu1) and hold time (th1) to SCLK as shown in Figure 15. Figure 15. Dot Correction Data Input Timing Chart The TLC5940 also has an EEPROM to store dot correction data. To store data from the dot correction register to EEPROM, DCPRG is set to high after applying VPRG to the VPRG pin. Figure 16 shows the EEPROM programming timings. The EEPROM has a default value of all 1s. 16 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com VPRG DCPRG XLAT SIN SCLK SOUT 1 96 DC MSB - DC MSB DC LSB VCC V(PRG) t su6 tprog th5 DCPRG OUT0 (Current) tpd5 tpd5 OUT15 (Current) SETTING GRAYSCALE Brightness in % GSn 4095 100 (9) GS 0.0 0 GS 1.0 12 GS 15.0 180 GS 15.11 191 GS 0.11 11 GS 14.11 179 MSB LSB GS OUT15 GS OUT14 − GS OUT2 GS OUT0 TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Figure 16. EEPROM Programming Timing Chart Figure 17. DCPRG and OUTn Timing Diagram The TLC5940 can adjust the brightness of each channel OUTn using a PWM control scheme. The use of 12 bits per channel results in 4096 different brightness steps, respective 0% to 100% brightness. Equation 9 determines the brightness level for each output n: where: GSn = the programmed grayscale value for output n (GSn = 0 to 4095) n = 0 to 15 Grayscale data for all OUTn Figure 18 shows the grayscale data packet format which consists of 12 bits x 16 channels, totaling 192 bits. The format is Big-Endian format. This means that the MSB is transmitted first, followed by the MSB-1, etc. Figure 18. Grayscale Data Packet Format When VPRG is set to GND, the TLC5940 enters the grayscale data input mode. The device switches the input shift register to 192-bit width. After all data is clocked in, a rising edge of the XLAT signal latches the data into Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Link(s): TLC5940 www.ti.com STATUS INFORMATION OUTPUT LOD 15 X DC 15.5 DC 0.0 X X 0 23 LOD Data DC Values Reserved MSB LSB 24 119 120 TEF LOD 0 TEF 16 X 15 191 TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 the grayscale register (see Figure 11). New grayscale data immediately becomes valid at the rising edge of the XLAT signal; therefore, new grayscale data should be latched at the end of a grayscale cycle when BLANK is high.The first GS data input cycle after dot correction requires an additional SCLK pulse after the XLAT signal to complete the grayscale update cycle. All GS data in the input shift register is replaced with status information data (SID) after updated the grayscale register. The TLC5940 does have a status information register, which can be accessed in grayscale mode (VPRG=GND). After the XLAT signal latches the data into the GS register the input shift register data will be replaced with status information data (SID) of the device (see Figure 18). LOD, TEF, and dot correction EEPROM data (DCPRG=LOW) or dot correction register data (DCPRG=HIGH) can be read out at SOUT pin. The status information data packet is 192 bits wide. Bits 0-15 contain the LOD status of each channel. Bit 16 contains the TEF status. If DCPRG is low, bits 24-119 contain the data of the dot-correction EEPROM. If DCPRG is high, bits 24-119 contain the data of the dot-correction register.The remaining bits are reserved. The complete status information data packet is shown in Figure 19. SOUT outputs the MSB of the SID at the same time the SID are stored in the SID register, as shown Figure 20. The next SCLK pulse, which will be the clock for receiving the SMB of the next grayscale data, transmits MSB-1 of SID. If output voltage is < 0.3 V (typical) when the output sink current turns on, LOD status flage becomes active. The LOD status flag is an internal signal that pulls XERR pin down to low when the LOD status flag becomes active. The delay time, tpd2 (1 µs maximum), is from the time of turning on the output sink current to the time LOD status flage becomes valid. The timing for each channel's LOD status to become valid is shifted by the 30-ns (maximum) channel-to-channel turn-on time. After the first GSCLK goes high, OUT0 LOD status is valid; tpd3 + tpd2 = 60 ns + 1 µs. OUT1 LOD status is valid; tpd3 + td + tpd2 = 60 ns + 30 ns + 1 µs = 1.09 µs. OUT2 LOD status is valid; tpd3 + 2*td + tpd2 = 1.12 µs, and so on. It takes 1.51 µs maximum (tpd3 + 15*td + tpd2) from the first GSCLK rising edge until all LOD become valid; tsuLOD must be > 1.51 µs (see Figure 20) to ensure that all LOD data are valid. Figure 19. Status Information Data Packet Format 18 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com VPRG XLAT SIN SCLK SOUT BLANK GSCLK OUT0 (current) OUT1 (current) OUT15 (current) XERR 1 192 193 1 192 1 4096 GS1 MSB GS1 LSB GS1 MSB GS2 MSB GS2 LSB GS2 MSB SID1 MSB SID1 MSB-1 SID1 LSB - - t + 15 x t + t pd3 d pd2 tpd3 td 15 x td tpd2 GS Data Input Mode 1st GS Data Input Cycle 2nd GS Data Input Cycle (1st GS Data Output Cycle) t suLOD > tpd4 + 15 x td + tpd3 GRAYSCALE PWM OPERATION TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Figure 20. Readout Status Information Data (SID) Timing Chart The grayscale PWM cycle starts with the falling edge of BLANK. The first GSCLK pulse after BLANK goes low increases the grayscale counter by one and switches on all OUTn with grayscale value not zero. Each following rising edge of GSCLK increases the grayscale counter by one. The TLC5940 compares the grayscale value of each output OUTn with the grayscale counter value. All OUTn with grayscale values equal to the counter values are switched off. A BLANK=H signal after 4096 GSCLK pulses resets the grayscale counter to zero and completes the grayscale PWM cycle (see Figure 21). When the counter reaches a count of FFFh, the counter stops counting and all outputs turn off. Pulling BLANK high before the counter reaches FFFh immediately resets the counter to zero. Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Link(s): TLC5940 www.ti.com GSCLK BLANK GS PWM Cycle n 1 2 3 1 GS PWM Cycle n+1 OUT0 OUT1 OUT15 XERR n x t d tpd1 tpd1 + td tpd1 + 15 x td tpd2 tpd3 twh1 twl1 twl1 tpd3 4096 th4 twh3 tpd3+ n x td tsu4 (Current) (Current) (Current) SERIAL DATA TRANSFER RATE f (GSCLK) 4096 f (update) f (SCLK) 193 f (update) n (10) TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Figure 21. Grayscale PWM Cycle Timing Chart Figure 22 shows a cascading connection of n TLC5940 devices connected to a controller, building a basic module of an LED display system. The maximum number of cascading TLC5940 devices depends on the application system and is in the range of 40 devices. Equation 10 calculates the minimum frequency needed: where: f (GSCLK): minimum frequency needed for GSCLK f (SCLK): minimum frequency needed for SCLK and SIN f (update): update rate of whole cascading system n: number cascaded of TLC5940 device 20 Submit Documentation Feedback Copyright © 2004–2007, Texas Instruments Incorporated Product Folder Link(s): TLC5940 www.ti.com APPLICATION EXAMPLE TLC5940 SIN SOUT OUT0 OUT15 SCLK GSCLK XLAT VPRG BLANK IREF XERR DCPRG TLC5940 SIN SOUT OUT0 OUT15 SCLK GSCLK XLAT VPRG BLANK IREF XERR DCPRG IC 0 IC n 7 SIN SCLK GSCLK XLAT BLANK XERR DCPRG Controller SOUT VPRG_D VPRG_OE W_EEPROM 100 k 50 k 50 k 50 k 50 k 50 k 50 k VPRG 100 nF VCC V(LED) V(LED) V(LED) V(LED) 100 nF V(22V) V(22V) VCC VCC TLC5940 SLVS515C–DECEMBER 2004–REVISED OCTOBER 2007 Figure 22. Cascading Devices Copyright © 2004–2007, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): TLC5940 PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TLC5940NT ACTIVE PDIP NT 28 13 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 TLC5940NT TLC5940NTG4 ACTIVE PDIP NT 28 13 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 TLC5940NT TLC5940PWP ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940 TLC5940PWPG4 ACTIVE HTSSOP PWP 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940 TLC5940PWPR ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940 TLC5940PWPRG4 ACTIVE HTSSOP PWP 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC5940 TLC5940RHBR ACTIVE VQFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC 5940 TLC5940RHBRG4 ACTIVE VQFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 TLC 5940 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2013 Addendum-Page 2 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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OTHER QUALIFIED VERSIONS OF TLC5940 : • Enhanced Product: TLC5940-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TLC5940RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.5 8.0 12.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLC5940RHBR VQFN RHB 32 3000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 27-Jul-2013 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated LC Filter Left LC Filter Right 4.5 V-26 V PSU Tuner AM/FM CD/ MP3 Aux in Left Right Audio Processor And control TPA3116D2 AM/FM Avoidance Control FAULTZ SDZ MUTE Capable of synchronizing to other devices Sync GAIN control and Master /Slave setting GAIN/SLV AM2,1,0 Power Limit PLIMIT PBTL Detect Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 TPA3116D2 15-W, 30-W, 50-W Filter-Free Class-D Stereo Amplifier Family With AM Avoidance 1 Features 3 Description The TPA31xxD2 series are stereo efficient, digital 1• Supports Multiple Output Configurations amplifier power stage for driving speakers up to 100 – 2 × 50 W Into a 4-Ω BTL Load at 21 V W / 2 Ω in mono. The high efficiency of the (TPA3116D2) TPA3130D2 allows it to do 2 × 15 W without external – 2 × 30 W Into a 8-Ω BTL Load at 24 V heat sink on a single layer PCB. The TPA3118D2 can (TPA3118D2) even run 2 × 30 W / 8 Ω without heat sink on a dual layer PCB. If even higher power is needed the – 2 × 15 W Into a 8-Ω BTL Load at 15 V TPA3116D2 does 2 × 50 W / 4 Ω with a small heat- (TPA3130D2) sink attached to its top side PowerPAD. All three • Wide Voltage Range: 4.5 V to 26 V devices share the same footprint enabling a single • Efficient Class-D Operation PCB to be used across different power levels. – >90% Power Efficiency Combined With Low The TPA31xxD2 advanced oscillator/PLL circuit Idle Loss Greatly Reduces Heat Sink Size employs a multiple switching frequency option to – Advanced Modulation Schemes avoid AM interferences; this is achieved together with an option of either master or slave option, making it • Multiple Switching Frequencies possible to synchronize multiple devices. – AM Avoidance The TPA31xxD2 devices are fully protected against – Master and Slave Synchronization faults with short-circuit protection and thermal – Up to 1.2-MHz Switching Frequency protection as well as overvoltage, undervoltage, and • Feedback Power-Stage Architecture With High DC protection. Faults are reported back to the PSRR Reduces PSU Requirements processor to prevent devices from being damaged during overload conditions. • Programmable Power Limit • Differential and Single-Ended Inputs Device Information(1) • Stereo and Mono Mode With Single-Filter Mono PART NUMBER PACKAGE BODY SIZE (NOM) Configuration DAD (32) TPA3116D2 11.00 mm × 6.20 mm DAP (32) • Single Power Supply Reduces Component Count TPA3118D2 • Integrated Self-Protection Circuits Including DAP (32) 11.00 mm × 6.20 mm TPA3130D2 Overvoltage, Undervoltage, Overtemperature, DC- (1) For all available packages, see the orderable addendum at Detect, and Short Circuit With Error Reporting the end of the datasheet. • Thermally Enhanced Packages – DAD Simplified Application Circuit (32-Pin HTSSOP Pad Up) – DAP (32-Pin HTSSOP Pad Down) • –40°C to 85°C Ambient Temperature Range 2 Applications • Mini-Micro Component, Speaker Bar, Docks • After-Market Automotive • CRT TV • Consumer Audio Applications 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Table of Contents 1 Features.................................................................. 1 7.3 Feature Description................................................. 13 2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 24 3 Description ............................................................. 1 8 Applications and Implementation ...................... 25 8.1 Application Information............................................ 25 4 Revision History..................................................... 2 8.2 Typical Application .................................................. 25 5 Pin Configuration and Functions......................... 3 9 Power Supply Recommendations...................... 28 6 Specifications......................................................... 5 10 Layout................................................................... 28 6.1 Absolute Maximum Ratings ...................................... 5 10.1 Layout Guidelines ................................................. 28 6.2 ESD Ratings ............................................................ 5 10.2 Layout Example .................................................... 29 6.3 Recommended Operating Conditions....................... 5 10.3 Heat Sink Used on the EVM ................................. 31 6.4 Thermal Information.................................................. 6 6.5 DC Electrical Characteristics .................................... 6 11 Device and Documentation Support ................. 32 6.6 AC Electrical Characteristics..................................... 6 11.1 Related Links ........................................................ 32 6.7 Typical Characteristics .............................................. 8 11.2 Trademarks ........................................................... 32 11.3 Electrostatic Discharge Caution............................ 32 7 Detailed Description ............................................ 13 11.4 Glossary ................................................................ 32 7.1 Overview ................................................................. 13 7.2 Functional Block Diagram ....................................... 13 12 Mechanical, Packaging, and Orderable Information ........................................................... 32 4 Revision History Changes from Revision C (April 2012) to Revision D Page • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision B (May 2012) to Revision C Page • Changed Notes 2 and 3 of the Thermal Information Table.................................................................................................... 6 • Changed the Gain (BTL) Test Condition values for R1 and R2............................................................................................. 6 • Changed the Gain (SLV) Test Condition values for R1 and R2............................................................................................. 6 • Changed the SYSTEM BLOCK DIAGRAM .......................................................................................................................... 13 2 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 32 31 30 29 19 13 14 15 16 17 18 20 1 2 3 4 5 6 7 8 9 10 11 12 21 22 23 24 28 27 26 25 FAULTZ SDZ SYNC AM0 AM1 MUTE LINN LINP PLIMIT RINN GVDD RINP AVCC OUTPR PVCC BSPL GND OUTPL PVCC OUTNL BSNL PVCC OUTNR BSNR MODSEL BSPR GND GND PVCC GND GAIN/SLV AM2 Thermal PAD 32 31 30 29 19 13 14 15 16 17 18 20 1 2 3 4 5 6 7 8 9 10 11 12 21 22 23 24 28 27 26 25 FAULTZ SDZ SYNC AM0 AM1 MUTE LINN LINP PLIMIT RINN GVDD RINP AVCC OUTPR PVCC BSPL GND OUTPL PVCC OUTNL BSNL PVCC OUTNR BSNR MODSEL BSPR GND GND PVCC GND GAIN/SLV AM2 Thermal PAD TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 5 Pin Configuration and Functions DAD Package 32-Pin HTSSOP With PowerPAD Up TPA3116D2 Only, Top View DAP Package 32-Pin HTSSOP With PowerPAD Down Top View Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Pin Functions PIN TYPE(1) DESCRIPTION NO. NAME 1 MODSEL I Mode selection logic input (LOW = BD mode, HIGH = 1 SPW mode). TTL logic levels with compliance to AVCC. 2 SDZ I Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels with compliance to AVCC. 3 FAULTZ DO General fault reporting including Over-temp, DC Detect. Open drain. FAULTZ = High, normal operation FAULTZ = Low, fault condition 4 RINP I Positive audio input for right channel. Biased at 3 V. 5 RINN I Negative audio input for right channel. Biased at 3 V. 6 PLIMIT I Power limit level adjust. Connect a resistor divider from GVDD to GND to set power limit. Connect directly to GVDD for no power limit. 7 GVDD PO Internally generated gate voltage supply. Not to be used as a supply or connected to any component other than a 1 µF X7R ceramic decoupling capacitor and the PLIMIT and GAIN/SLV resistor dividers. 8 GAIN/SLV I Selects Gain and selects between Master and Slave mode depending on pin voltage divider. 9 GND G Ground 10 LINP I Positive audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode. 11 LINN I Negative audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode. 12 MUTE I Mute signal for fast disable/enable of outputs (HIGH = outputs Hi-Z, LOW = outputs enabled). TTL logic levels with compliance to AVCC. 13 AM2 I AM Avoidance Frequency Selection 14 AM1 I AM Avoidance Frequency Selection 15 AM0 I AM Avoidance Frequency Selection 16 SYNC DIO Clock input/output for synchronizing multiple class-D devices. Direction determined by GAIN/SLV terminal. 17 AVCC P Analog Supply 18 PVCC P Power supply 19 PVCC P Power supply 20 BSNL BST Boot strap for negative left channel output, connect to 220 nF X5R, or better ceramic cap to OUTPL 21 OUTNL PO Negative left channel output 22 GND G Ground 23 OUTPL PO Positive left channel output 24 BSPL BST Boot strap for positive left channel output, connect to 220 nF X5R, or better ceramic cap to OUTNL 25 GND G Ground 26 BSNR BST Boot strap for negative right channel output, connect to 220 nF X5R, or better ceramic cap to OUTNR 27 OUTNR PO Negative right channel output 28 GND G Ground 29 OUTPR PO Positive right channel output 30 BSPR BST Boot strap for positive right channel output, connect to 220 nF X5R or better ceramic cap to OUTPR 31 PVCC P Power supply 32 PVCC P Power supply 33 PowerPAD G Connect to GND for best system performance. If not connected to GND, leave floating. (1) TYPE: DO = Digital Output, I = Analog Input, G = General Ground, PO = Power Output, BST = Boot Strap. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage, VCC PVCC, AVCC –0.3 30 V INPL, INNL, INPR, INNR –0.3 6.3 V Input voltage, VI PLIMIT, GAIN / SLV, SYNC –0.3 GVDD+0.3 V AM0, AM1, AM2, MUTE, SDZ, MODSEL –0.3 PVCC+0.3 V Slew rate, maximum(2) AM0, AM1, AM2, MUTE, SDZ, MODSEL 10 V/ms Operating free-air temperature, TA –40 85 °C Operating junction temperature , TJ –40 150 °C Storage temperature, Tstg –40 125 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) 100 kΩ series resistor is needed if maximum slew rate is exceeded. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- ±500 V C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. . 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VCC Supply voltage PVCC, AVCC 4.5 26 V High-level input VIH AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL 2 V voltage Low-level input VIL AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL 0.8 V voltage Low-level output VOL FAULTZ, RPULL-UP = 100 kΩ, PVCC = 26 V 0.8 V voltage High-level input IIH AM0, AM1, AM2, MUTE, SDZ, MODSEL (VI = 2 V, VCC = 18 V) 50 µA current TPA3116D2, TPA3118D2 3.2 4 RL(BTL) Output filter: L = 10 µH, C = 680 nF Minimum load TPA3130D2 5.6 8 Ω Impedance TPA3116D2, TPA3118D2 1.6 RL(PBTL) Output filter: L = 10 µH, C = 1 µF TPA3130D2 3.2 4 Output-filter Lo Minimum output filter inductance under short-circuit condition 1 µH Inductance Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com 6.4 Thermal Information TPA3130D2 TPA3118D2 TPA3116D2 THERMAL METRIC(1) DAP(2) DAP(3) DAD(4) UNIT 32 PINS 32 PINS 32 PINS RθJA Junction-to-ambient thermal resistance 36 22 14 ψJT Junction-to-top characterization parameter 0.4 0.3 1.2 °C/W ψJB Junction-to-board characterization parameter 5.9 4.7 5.7 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) For the PCB layout please see the TPA3130D2EVM user guide. (3) For the PCB layout please see the TPA3118D2EVM user guide. (4) The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high. 6.5 DC Electrical Characteristics TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Class-D output offset voltage (measured | VOS | VI = 0 V, Gain = 36 dB 1.5 15 mV differentially) SDZ = 2 V, No load or filter, PVCC = 12 V 20 35 ICC Quiescent supply current mA SDZ = 2 V, No load or filter, PVCC = 24 V 32 50 Quiescent supply current in shutdown SDZ = 0.8 V, No load or filter, PVCC = 12 V <50 ICC(SD) µA mode SDZ = 0.8 V, No load or filter, PVCC = 24 V 50 400 Drain-source on-state resistance, rDS(on) PVCC = 21 V, Iout = 500 mA, TJ = 25°C 120 mΩ measured pin to pin R1 = 5.6 kΩ, R2 = Open 19 20 21 dB R1 = 20 kΩ, R2 = 100 kΩ 25 26 27 G Gain (BTL) R1 = 39 kΩ, R2 = 100 kΩ 31 32 33 dB R1 = 47 kΩ, R2 = 75 kΩ 35 36 37 R1 = 51 kΩ, R2 = 51 kΩ 19 20 21 dB R1 = 75 kΩ, R2 = 47 kΩ 25 26 27 G Gain (SLV) R1 = 100 kΩ, R2 = 39 kΩ 31 32 33 dB R1 = 100 kΩ, R2 = 16 kΩ 35 36 37 ton Turn-on time SDZ = 2 V 10 ms tOFF Turn-off time SDZ = 0.8 V 2 µs GVDD Gate drive supply IGVDD < 200 µA 6.4 6.9 7.4 V Output voltage maximum under PLIMIT VO V(PLIMIT) = 2 V; VI = 1 Vrms 6.75 7.90 8.75 V control 6.6 AC Electrical Characteristics TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 200 mVPP ripple at 1 kHz, Gain = 20 dB, Inputs AC- KSVR Power supply ripple rejection –70 dB coupled to GND THD+N = 10%, f = 1 kHz, PVCC = 14.4 V 25 PO Continuous output power W THD+N = 10%, f = 1 kHz, PVCC = 21 V 50 THD+N Total harmonic distortion + noise VCC = 21 V, f = 1 kHz, PO = 25 W (half-power) 0.1% 65 µV Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB –80 dBV Crosstalk VO = 1 Vrms, Gain = 20 dB, f = 1 kHz –100 dB Maximum output at THD+N < 1%, f = 1 kHz, Gain = 20 dB, SNR Signal-to-noise ratio 102 dB A-weighted 6 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 AC Electrical Characteristics (continued) TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT AM2=0, AM1=0, AM0=0 376 400 424 AM2=0, AM1=0, AM0=1 470 500 530 AM2=0, AM1=1, AM0=0 564 600 636 AM2=0, AM1=1, AM0=1 940 1000 1060 fOSC Oscillator frequency kHz AM2=1, AM1=0, AM0=0 1128 1200 1278 AM2=1, AM1=0, AM0=1 AM2=1, AM1=1, AM0=0 Reserved AM2=1, AM1=1, AM0=1 Thermal trip point 150+ °C Thermal hysteresis 15 °C TPA3130D2 4.5 Over current trip point A TPA3118D2, TPA3116D2 7.5 Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 0.001 0.01 0.1 1 10 20 100 1k 10k 20k Frequency (Hz) THD+N (%) PO = 1W PO = 5W PO = 10W Gain = 26dB PVCC = 24V TA = 25°C RL = 8Ω G006 0.001 0.01 0.1 1 10 0.01 0.1 1 10 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 6V TA = 25°C RL = 4Ω G008 0.001 0.01 0.1 1 10 20 100 1k 10k 20k Frequency (Hz) THD+N (%) PO = 1W PO = 5W PO = 10W Gain = 26dB PVCC = 24V TA = 25°C RL = 4Ω G004 0.001 0.01 0.1 1 10 20 100 1k 10k 20k Frequency (Hz) THD+N (%) PO = 1W PO = 2.5W PO = 5W Gain = 26dB PVCC = 12V TA = 25°C RL = 8Ω G005 0.001 0.01 0.1 1 10 20 100 1k 10k 20k Frequency (Hz) THD+N (%) PO = 0.5W PO = 1W PO = 2.5W Gain = 26dB PVCC = 6V TA = 25°C RL = 4Ω G002 0.001 0.01 0.1 1 10 20 100 1k 10k 20k Frequency (Hz) THD+N (%) PO = 1W PO = 2.5W PO = 5W Gain = 26dB PVCC = 12V TA = 25°C RL = 4Ω G003 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com 6.7 Typical Characteristics fs = 400 kHz, BD Mode (unless otherwise noted) Figure 1. Total Harmonic Distortion + Noise (BTL) vs Figure 2. Total Harmonic Distortion + Noise (BTL) vs Frequency Frequency Figure 3. Total Harmonic Distortion + Noise (BTL) vs Figure 4. Total Harmonic Distortion + Noise (BTL) vs Frequency Frequency Figure 5. Total Harmonic Distortion + Noise (BTL) vs Figure 6. Total Harmonic Distortion + Noise (BTL) vs Output Frequency Power 8 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 0 10 20 30 40 50 0 1 2 3 4 PLIMIT Voltage (V) Output Power (W) Gain = 26dB TA = 25°C PVCC = 24V RL = 4Ω G013 20 100 1k 10k 100k −50 −40 −30 −20 −10 0 10 20 30 −500 −400 −300 −200 −100 0 100 200 300 Frequency (Hz) Gain (dB) Phase (°) Gain Phase Gain = 26dB PVCC = 12V TA = 25°C RL = 4Ω G014 0.001 0.01 0.1 1 10 0.01 0.1 1 10 50 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 12V TA = 25°C RL = 8Ω G011 0.001 0.01 0.1 1 10 0.01 0.1 1 10 50 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 24V TA = 25°C RL = 8Ω G012 0.001 0.01 0.1 1 10 0.01 0.1 1 10 40 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 12V TA = 25°C RL = 4Ω G009 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 24V TA = 25°C RL = 4Ω G010 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Typical Characteristics (continued) fs = 400 kHz, BD Mode (unless otherwise noted) Figure 7. Total Harmonic Distortion + Noise (BTL) vs Output Figure 8. Total Harmonic Distortion + Noise (BTL) vs Output Power Power Figure 9. Total Harmonic Distortion + Noise (BTL) vs Output Figure 10. Total Harmonic Distortion + Noise (BTL) vs Power Output Power Figure 11. Output Power (BTL) vs Plimit Voltage Figure 12. Gain/Phase (BTL) vs Frequency Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 −140 −130 −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 20 100 1k 10k 20k Frequency (Hz) Crosstalk (dB) Right to Left Left to Right Gain = 26dB PVCC = 24V TA = 25°C RL = 8Ω G021 −140 −130 −120 −110 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 20 100 1k 10k 20k Frequency (Hz) Crosstalk (dB) Right to Left Left to Right Gain = 26dB PVCC = 12V TA = 25°C RL = 4Ω G022 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 45 50 Output Power (W) Power Efficiency (%) PVCC = 6V PVCC =12V PVCC = 24V Gain = 26dB TA = 25°C RL = 8Ω G017 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 45 50 Output Power (W) Power Efficiency (%) PVCC = 6V PVCC = 12V PVCC = 24V Gain = 26dB TA = 25°C RL = 4Ω G018 0 5 10 15 20 25 30 35 40 45 50 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage (V) Maximum Output Power (W) THD+N = 1% THD+N = 10% Gain = 26dB TA = 25°C RL = 8Ω G015 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage (V) Maximum Output Power (W) THD+N = 1% THD+N = 10% Gain = 26dB TA = 25°C RL = 4Ω G016 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Typical Characteristics (continued) fs = 400 kHz, BD Mode (unless otherwise noted) Figure 13. Maximum Output Power (BTL) vs Supply Voltage Figure 14. Maximum Output Power (BTL) vs Supply Voltage Figure 15. Power Efficiency (BTL) vs Output Power Figure 16. Power Efficiency (BTL) vs Output Power Figure 17. Crosstalk vs Frequency Figure 18. Crosstalk vs Frequency 10 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100 Output Power (W) Power Efficiency (%) PVCC = 6V PVCC = 12V PVCC =24V Gain = 26dB TA = 25°C RL = 2Ω G028 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 20 100 1k 10k 20k Frequency (Hz) kSVR (dB) Gain = 26dB PVCC = 12VDC + 200mVP-P TA = 25°C RL = 2Ω G030 0.001 0.01 0.1 1 10 0.01 0.1 1 10 40 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 12V TA = 25°C RL = 2Ω G025 0 20 40 60 80 100 120 140 160 180 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage (V) Maximum Output Power (W) THD+N = 1% THD+N = 10% Gain = 26dB TA = 25°C RL = 2Ω G027 −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 20 100 1k 10k 20k Frequency (Hz) kSVR (dB) Left Channel Right Channel Gain = 26dB PVCC = 12VDC + 200mVP-P TA = 25°C RL = 8Ω G023 0.001 0.01 0.1 1 10 20 100 1k 10k 20k Frequency (Hz) THD+N (%) PO = 1W PO = 5W PO = 10W Gain = 26dB PVCC = 12V TA = 25°C RL = 2Ω G024 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Typical Characteristics (continued) fs = 400 kHz, BD Mode (unless otherwise noted) Figure 19. Supply Ripple Rejection Ratio (BTL) vs Figure 20. Total Harmonic Distortion + Noise (PBTL) vs Frequency Frequency Figure 21. Total Harmonic Distortion + Noise (PBTL) vs Figure 22. Maximum Output Power (PBTL) vs Supply Output Power Voltage Figure 23. Power Efficiency (PBTL) vs Output Power Figure 24. Supply Ripple Rejection Ratio (PBTL) vs Frequency Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 200 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 24V TA = 25°C RL = 3Ω G032 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 4 6 8 10 12 14 16 18 20 22 24 26 Supply Voltage (V) Maximum Output Power (W) THD+N = 1% THD+N = 10% Gain = 26dB TA = 25°C RL = 3Ω G034 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Typical Characteristics (continued) fs = 400 kHz, BD Mode (unless otherwise noted) Figure 25. Total Harmonic Distortion + Noise (PBTL) vs Figure 26. Maximum Output Power (PBTL) vs Supply Output Power Voltage 12 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 + – + – + – + + SDZ MUTE TTL Buffer Gain Control GAIN OUTPR_FB RINP RINN Gain Control OUTPNR_FB FAULTZ SYNC GAIN/SLV AM<2:0> PLIMIT AVCC GVDD LDO Regulator LINP LINN GND Input Sense PBTL Select OUTPL_FB Gain Control OUTNL_FB AVDD GVDD PLIMIT Reference Ramp Generator Biases and References Startup Protection Logic SC Detect DC Detect Thermal Detect UVLO/OVLO PVCC GVDD PVCC Gate Drive OUTNL_ FB PVCC GVDD PVCC Gate Drive PWM Logic Modulation and PBTL Select OUTPL_FB GND OUTPL BSPL GND OUTNL BSNL GND BSNR OUTPR GND OUTNR OUTNR_ FB BSPR OUTPR_FB PVCC GVDD PVCC Gate Drive PVCC GVDD PVCC Gate Drive PWM Logic Modulation and PBTL Select PLIMIT PLIMIT + – + – + – + – + – + – – – Thermal Pad + – PVCC PVCC TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 7 Detailed Description 7.1 Overview The TPA31xxD2 device is a highly efficient Class D audio amplifier with integrated 120m Ohms MOSFET that allows output currents up to 7.5 A. The high efficiency allows the amplifier to provide an excellent audio performance without the need for a bulky heat sink. The device can be configured for either master or slave operation by using the SYNC pin. This helps to prevent audible beats noise. 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Gain Setting and Master and Slave The gain of the TPA31xxD2 family is set by the voltage divider connected to the GAIN/SLV control pin. Master or Slave mode is also controlled by the same pin. An internal ADC is used to detect the 8 input states. The first four stages sets the GAIN in Master mode in gains of 20, 26, 32, 36 dB respectively, while the next four stages sets the GAIN in Slave mode in gains of 20, 26, 32, 36 dB respectively. The gain setting is latched during power-up and cannot be changed while device is powered. Table 1 lists the recommended resistor values and the state and gain: Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 i i 1 f 2 Z C p ƒ = 5 6 7 8 9 10 INNR PLIMIT GVDD GAIN/SLV GND 2 1 C5 1 Fµ 2 1 2 1 R1 51 k R2 51 k TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Table 1. Gain and Master/Slave MASTER / SLAVE GAIN R1 (to GND)(1) R2 (to GVDD)(1) INPUT IMPEDANCE MODE Master 20 dB 5.6 kΩ OPEN 60 kΩ Master 26 dB 20 kΩ 100 kΩ 30 kΩ Master 32 dB 39 kΩ 100 kΩ 15 kΩ Master 36 dB 47 kΩ 75 kΩ 9 kΩ Slave 20 dB 51 kΩ 51 kΩ 60 kΩ Slave 26 dB 75 kΩ 47 kΩ 30 kΩ Slave 32 dB 100 kΩ 39 kΩ 15 kΩ Slave 36 dB 100 kΩ 16 kΩ 9 kΩ (1) Resistor tolerance should be 5% or better. Figure 27. Gain, Master/Slave In Master mode, SYNC terminal is an output, in Slave mode, SYNC terminal is an input for a clock input. TTL logic levels with compliance to GVDD. 7.3.2 Input Impedance The TPA31xxD2 family input stage is a fully differential input stage and the input impedance changes with the gain setting from 9 kΩ at 36 dB gain to 60 kΩ at 20 dB gain. Table 1 lists the values from min to max gain. The tolerance of the input resistor value is ±20% so the minimum value will be higher than 7.2 kΩ. The inputs need to be AC-coupled to minimize the output dc-offset and ensure correct ramping of the output voltages during powerON and power-OFF. The input ac-coupling capacitor together with the input impedance forms a high-pass filter with the following cut-off frequency: (1) If a flat bass response is required down to 20 Hz the recommended cut-off frequency is a tenth of that, 2 Hz. Table 2 lists the recommended ac-couplings capacitors for each gain step. If a -3 dB is accepted at 20 Hz 10 times lower capacitors can used – for example, a 1 µF can be used. Table 2. Recommended Input AC-Coupling Capacitors GAIN INPUT IMPEDANCE INPUT CAPACITANCE HIGH-PASS FILTER 20 dB 60 kΩ 1.5 µF 1.8 Hz 26 dB 30 kΩ 3.3 µF 1.6 Hz 32 dB 15 kΩ 5.6 µF 2.3 Hz 36 dB 9 kΩ 10 µF 1.8 Hz 14 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 Input Signal Ci IN Zi Zf TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Figure 28. Input Impedance The input capacitors used should be a type with low leakage, like quality electrolytic, tantalum or ceramic. If a polarized type is used the positive connection should face the input pins which are biased to 3 Vdc. 7.3.3 Startup and Shutdown Operation The TPA31xxD2 family employs a shutdown mode of operation designed to reduce supply current (Icc) to the absolute minimum level during periods of nonuse for power conservation. The SDZ input terminal should be held high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling SDZ low will put the outputs to mute and the amplifier to enter a low-current state. It is not recommended to leave SDZ unconnected, because amplifier operation would be unpredictable. For the best power-off pop performance, place the amplifier in the shutdown mode prior to removing the power supply. The gain setting is selected at the end of the start-up cycle. At the end of the start-up cycle, the gain is selected and cannot be changed until the next power-up. 7.3.4 PLIMIT Operation The TPA31xxD2 family has a built-in voltage limiter that can be used to limit the output voltage level below the supply rail, the amplifier simply operates as if it was powered by a lower supply voltage, and thereby limits the output power. Add a resistor divider from GVDD to ground to set the voltage at the PLIMIT pin. An external reference may also be used if tighter tolerance is required. Add a 1 µF capacitor from pin PLIMIT to ground to ensure stability. It is recommended to connect PLIMIT to GVDD when using 1SPW-modulation mode. Figure 29. Power Limit Example The PLIMIT circuit sets a limit on the output peak-to-peak voltage. The limiting is done by limiting the duty cycle to a fixed maximum value. This limit can be thought of as a "virtual" voltage rail which is lower than the supply connected to PVCC. This "virtual" rail is approximately 4 times the voltage at the PLIMIT pin. This output voltage can be used to calculate the maximum output power for a given maximum input voltage and speaker impedance. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 2 L P L S OUT L R V R + 2 R P = for unclipped power 2 R æ ö æ ö ç ÷ ç ÷´ ´ è ø è ø ´ TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com where • POUT (10%THD) = 1.25 × POUT (unclipped) • RL is the load resistance. • RS is the total series resistance including RDS(on), and output filter resistance. • VP is the peak amplitude • VP = 4 × PLIMIT voltage if PLIMIT < 4 × VP (2) Table 3. Power Limit Example PVCC (V) PLIMIT VOLTAGE (V)(1) R to GND R to GVDD OUTPUT VOLTAGE (Vrms) 24 V GVDD Short Open 17.9 24 V 3.3 45 kΩ 51 kΩ 12.67 24 V 2.25 24 kΩ 51 kΩ 9 12 V GVDD Short Open 10.33 12 V 2.25 24 kΩ 51 kΩ 9 12 V 1.5 18 kΩ 68 kΩ 6.3 (1) PLIMIT measurements taken with EVM gain set to 26dB and input voltage set to 1Vrms. 7.3.5 GVDD Supply The GVDD Supply is used to power the gates of the output full bridge transistors. It can also be used to supply the PLIMIT and GAIN/SLV voltage dividers. Decouple GVDD with a X5R ceramic 1 µF capacitor to GND. The GVDD supply is not intended to be used for external supply. It is recommended to limit the current consumption by using resistor voltage dividers for GAIN/SLV and PLIMIT of 100 kΩ or more. 7.3.6 BSPx AND BSNx Capacitors The full H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the high side of each output to turn on correctly. A 220 nF ceramic capacitor of quality X5R or better, rated for at least 16 V, must be connected from each output to its corresponding bootstrap input. (See the application circuit diagram in Figure 37.) The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the highside MOSFETs turned on. 7.3.7 Differential Inputs The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To use the TPA31xxD2 family with a differential source, connect the positive lead of the audio source to the RINP or LINP input and the negative lead from the audio source to the RINN or LINN input. To use the TPA31xxD2 family with a single-ended source, ac ground the negative input through a capacitor equal in value to the input capacitor on positive and apply the audio source to either input. In a single-ended input application, the unused input should be ac grounded at the audio source instead of at the device input for best noise performance. For good transient performance, the impedance seen at each of the two differential inputs should be the same. The impedance seen at the inputs should be limited to an RC time constant of 1 ms or less if possible. This is to allow the input dc blocking capacitors to become completely charged during the 10 ms power-up time. If the input capacitors are not allowed to completely charge, there will be some additional sensitivity to component matching which can result in pop if the input components are not well matched. 7.3.8 Device Protection System The TPA31xxD2 family contains a complete set of protection circuits carefully designed to make system design efficient as well as to protect the device against any kind of permanent failures due to short circuits, overload, over temperature, and under-voltage. The FAULTZ pin will signal if an error is detected according to Table 4: 16 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Table 4. Fault Reporting TRIGGERING CONDITION LATCHED/SELF- FAULT FAULTZ ACTION (typical value) CLEARING Over Current Output short or short to PVCC or GND Low Output high impedance Latched Over Temperature Tj > 150°C Low Output high impedance Latched Too High DC Offset DC output voltage Low Output high impedance Latched Under Voltage on PVCC < 4.5V – Output high impedance Self-clearing PVCC Over Voltage on PVCC > 27V – Output high impedance Self-clearing PVCC 7.3.9 DC Detect Protection The TPA31xxD2 family has circuitry which will protect the speakers from DC current which might occur due to defective capacitors on the input or shorts on the printed circuit board at the inputs. A DC detect fault will be reported on the FAULT pin as a low state. The DC Detect fault will also cause the amplifier to shutdown by changing the state of the outputs to Hi-Z. If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the DC Detect protection latch. A DC Detect Fault is issued when the output differential duty-cycle of either channel exceeds 60% for more than 420 msec at the same polarity. Table x below shows some examples of the typical DC Detect Protection threshold for several values of the supply voltage. This feature protects the speaker from large DC currents or AC currents less than 2Hz. To avoid nuisance faults due to the DC detect circuit, hold the SD pin low at powerup until the signals at the inputs are stable. Also, take care to match the impedance seen at the positive and negative inputs to avoid nuisance DC detect faults. Table 5 lists the minimum output offset voltages required to trigger the DC detect. The outputs must remain at or above the voltage listed in the table for more than 420 ms to trigger the DC detect. Table 5. DC Detect Threshold PVCC (V) VOS - OUTPUT OFFSET VOLTAGE (V) 4.5 0.96 6 1.3 12 2.6 18 3.9 7.3.10 Short-Circuit Protection and Automatic Recovery Feature The TPA31xxD2 family has protection from over current conditions caused by a short circuit on the output stage. The short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched to a high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling the SDZ pin through the low state. If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the shortcircuit protection latch. In systems where a possibility of a permanent short from the output to PVDD or to a high voltage battery like a car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a highZ restart, like shown in the figure below: Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 > 1.4sec mP TPA3116D2 SDZ MUTE FAULTZ SDZ MUTE FAULTZ TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Figure 30. MUTE Driven by Inverted FAULTZ Figure 31. Timing Requirement for SDZ 7.3.11 Thermal Protection Thermal protection on the TPA31xxD2 family prevents damage to the device when the internal die temperature exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a latched fault. Thermal protection faults are reported on the FAULTZ terminal as a low state. If automatic recovery from the thermal protection latch is desired, connect the FAULTZ pin directly to the SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal protection latch. 7.3.12 Device Modulation Scheme The TPA31xxD2 family has the option of running in either BD modulation or 1SPW modulation; this is set by the MODSEL pin. 7.3.12.1 MODSEL = GND: BD-Modulation This is a modulation scheme that allows operation without the classic LC reconstruction filter when the amp is driving an inductive load with short speaker wires. Each output is switching from 0 volts to the supply voltage. The OUTPx and OUTNx are in phase with each other with no input so that there is little or no current in the speaker. The duty cycle of OUTPx is greater than 50% and OUTNx is less than 50% for positive output voltages. The duty cycle of OUTPx is less than 50% and OUTNx is greater than 50% for negative output voltages. The voltage across the load sits at 0V throughout most of the switching period, reducing the switching current, which reduces any I 2R losses in the load. 18 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 OUTP OUTN OUTP-OUTN Speaker Current OUTP OUTN OUTP-OUTN Speaker Current OUTP OUTN OUTP-OUTN Speaker Current 0V 0V PVCC No Output Positive Output Negative Output 0A 0A 0V -PVCC TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Figure 32. BD Mode Modulation 7.3.12.2 MODSEL = HIGH: 1SPW-modulation The 1SPW mode alters the normal modulation scheme in order to achieve higher efficiency with a slight penalty in THD degradation and more attention required in the output filter selection. In 1SPW mode the outputs operate at ~15% modulation during idle conditions. When an audio signal is applied one output will decrease and one will increase. The decreasing output signal will quickly rail to GND at which point all the audio modulation takes place through the rising output. The result is that only one output is switching during a majority of the audio cycle. Efficiency is improved in this mode due to the reduction of switching losses. The THD penalty in 1SPW mode is minimized by the high performance feedback loop. The resulting audio signal at each half output has a discontinuity each time the output rails to GND. This can cause ringing in the audio reconstruction filter unless care is taken in the selection of the filter components and type of filter used. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 OUTP OUTN OUTP-OUTN Speaker Current OUTP OUTN OUTP-OUTN Speaker Current OUTP OUTN OUTP-OUTN Speaker Current 0 V 0 V PVCC No Output Positive Output Negative Output 0A 0 A 0 V -PVCC TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Figure 33. 1SPW Mode Modulation 20 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme The main reason that the traditional class-D amplifier-based on AD modulation needs an output filter is that the switching waveform results in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 × VCC, and the time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive, whereas an LC filter is almost purely reactive. The TPA3116D2 modulation scheme has little loss in the load without a filter because the pulses are short and the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most applications the filter is not needed. An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow through the filter instead of the load. The filter has less resistance but higher impedance at the switching frequency than the speaker, which results in less power dissipation, therefore increasing efficiency. 7.3.14 Ferrite Bead Filter Considerations Using the Advanced Emissions Suppression Technology in the TPA3116D2 amplifier it is possible to design a high efficiency class-D audio amplifier while minimizing interference to surrounding circuits. It is also possible to accomplish this with only a low-cost ferrite bead filter. In this case it is necessary to carefully select the ferrite bead used in the filter. One important aspect of the ferrite bead selection is the type of material used in the ferrite bead. Not all ferrite material is alike, so it is important to select a material that is effective in the 10 to 100 MHz range which is key to the operation of the class-D amplifier. Many of the specifications regulating consumer electronics have emissions limits as low as 30 MHz. It is important to use the ferrite bead filter to block radiation in the 30 MHz and above range from appearing on the speaker wires and the power supply lines which are good antennas for these signals. The impedance of the ferrite bead can be used along with a small capacitor with a value in the range of 1000 pF to reduce the frequency spectrum of the signal to an acceptable level. For best performance, the resonant frequency of the ferrite bead/ capacitor filter should be less than 10 MHz. Also, it is important that the ferrite bead is large enough to maintain its impedance at the peak currents expected for the amplifier. Some ferrite bead manufacturers specify the bead impedance at a variety of current levels. In this case it is possible to make sure the ferrite bead maintains an adequate amount of impedance at the peak current the amplifier will see. If these specifications are not available, it is also possible to estimate the bead current handling capability by measuring the resonant frequency of the filter output at low power and at maximum power. A change of resonant frequency of less than fifty percent under this condition is desirable. Examples of ferrite beads which have been tested and work well with the TPA3130D2 can be seen in the TPA3130D2EVM user guide SLOU341. A high quality ceramic capacitor is also needed for the ferrite bead filter. A low ESR capacitor with good temperature and voltage characteristics will work best. Additional EMC improvements may be obtained by adding snubber networks from each of the class-D outputs to ground. Suggested values for a simple RC series snubber network would be 18 Ω in series with a 330 pF capacitor although design of the snubber network is specific to every application and must be designed taking into account the parasitic reactance of the printed circuit board as well as the audio amp. Take care to evaluate the stress on the component in the snubber network especially if the amp is running at high PVCC. Also, make sure the layout of the snubber network is tight and returns directly to the GND pins on the IC. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Figure 34. TPA311xD2 Radiated Emissions 7.3.15 When to Use an Output Filter for EMI Suppression The TPA3116D2 has been tested with a simple ferrite bead filter for a variety of applications including long speaker wires up to 125 cm and high power. The TPA3116D2 EVM passes FCC class-B specifications under these conditions using twisted speaker wires. The size and type of ferrite bead can be selected to meet application requirements. Also, the filter capacitor can be increased if necessary with some impact on efficiency. There may be a few circuit instances where it is necessary to add a complete LC reconstruction filter. These circumstances might occur if there are nearby circuits which are sensitive to noise. In these cases a classic second order Butterworth filter similar to those shown in the figures below can be used. Some systems have little power supply decoupling from the AC line but are also subject to line conducted interference (LCI) regulations. These include systems powered by "wall warts" and "power bricks." In these cases, LC reconstruction filters can be the lowest cost means to pass LCI tests. Common mode chokes using low frequency ferrite material can also be effective at preventing line conducted interference. 22 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 OUTP OUTN 10 µH L1 10 µH L2 C2 C3 0.68 µF 0.68 µF OUTP OUTN Ferrite Chip Bead 1 nF 1 nF Ferrite Chip Bead 4 - 8 W W 4 - 8 W W TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Figure 35. TPA31xxD2 Output Filters 7.3.16 AM Avoidance EMI Reduction To reduce interference in the AM radio band, the TPA3116D2 has the ability to change the switching frequency via AM<2:0> pins. The recommended frequencies are listed in Table 6. The fundamental frequency and its second harmonic straddle the AM radio band listed. This eliminates the tones that can be present due to the switching frequency being demodulated by the AM radio. Table 6. AM Frequencies US EUROPEAN SWITCHING FREQUENCY (kHz) AM2 AM1 AM0 AM FREQUENCY (kHz) AM FREQUENCY (kHz) 522-540 540-917 540-914 500 0 0 1 0 1 0 917-1125 914-1122 600 (or 400) 0 0 0 1125-1375 1122-1373 500 0 0 1 0 1 0 1375-1547 1373-1548 600 (or 400) 0 0 0 0 1 0 1547-1700 1548-1701 600 (or 500) 0 0 1 Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2 4.5 V–26 V PSU LC Filter OUTPR OUTNR OUTPL OUTNL Right Left PBTL Detect TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com 7.4 Device Functional Modes 7.4.1 Mono Mode (PBTL) The TPA31xxD2 family can be connected in MONO mode enabling up to 100W output power. This is done by: • Connect INPL and INNL directly to Ground (without capacitors) this sets the device in Mono mode during power up. • Connect OUTPR and OUTNR together for the positive speaker terminal and OUTNL and OUTPL together for the negative pin. • Analog input signal is applied to INPR and INNR. Figure 36. Mono Mode 24 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 8 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information This section describes a 2.1 Master and Slave application. The Master is configured as stereo outputs and the Slave is configured as mono PBTL output. 8.2 Typical Application A 2.1 solution, U1 TPA3116D2 in Master mode 400 kHz, BTL, gain if 20 dB, power limit not implemented. U2 in Slave, PBTL mode gain of 20dB. Inputs are connected for differential inputs. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 Power Pad U1 TPA3116D2 MODSEL 1 SDZ 2 FAULTZ 3 INPR 4 INNR 5 PLIMIT 6 GVDD 7 GAIN/SLV 8 GND 9 INPL 10 INNL 11 MUTE 12 AM2 13 AM1 14 AM0 15 SYNC 16 PVCC 32 PVCC 31 BSPR 30 OUTPR 29 GND 28 OUTNR 27 BSNR 26 GND 25 BSPL 24 OUTPL 23 GND 22 OUTNL 21 BSNL 20 PVCC 19 PVCC 18 AVCC 17 PVCC DECOUPLING C17 220nF 1 2 PVCC DECOUPLING GND C16 220nF 1 2 C13 1uF 2 1 C58 100nF 1 2 C29 680nF 2 1 L7 10uH 1 2 R10 3.3R 1 2 L8 10uH 1 2 C28 680nF 2 1 L9 10uH 1 2 C57 10nF 2 1 R12 20k 1 2 L10 10uH 1 2 C38 10nF 2 1 R14 100k 1 2 C25 220uF 1 2 C26 680nF 2 1 R18 3.3R 1 2 C40 10nF 2 1 R17 3.3R 1 2 GND C41 1nF 2 1 C32 1nF 2 1 C11 1uF 2 1 C22 220uF 1 2 GND C21 100nF 2 1 C20 1nF 2 1 C31 1nF 2 1 R15 3.3R 1 2 C33 1nF 2 1 R16 3.3R 1 2 GND C19 220nF 1 2 C30 1nF 2 1 C27 680nF 2 1 C34 10nF 2 1 C37 10nF 2 1 IN_P_LEFT IN_N_RIGHT IN_N_LEFT IN_P_RIGHT GND PVCC GND GND GND GND GND GND GND GND OUT_ N_LEFT OUT_P_LEFT - + OUT_N_RIGHT OUT_P_RIGHT + PVCC - C14 1uF 2 1 R11 100k 1 2 MUTE_LR OUTPUT LC FILTER R13 100k 1 2 C15 1uF 2 1 EMI C-RC SNUBBER C24 100nF 2 1 GND PVCC C18 220nF 1 2 GND /SD_LR PVCC C23 1nF 2 1 GND C12 1uF 2 1 R73 10k 1 2 C42 220nF 1 2 L15 10uH 1 2 L16 10uH 1 2 R21 75k 1 2 R22 100k 1 2 C50 220uF 1 2 C51 1uF 2 1 GND C35 1uF 2 1 GND C47 220uF 1 2 C46 100nF 2 1 C45 1nF 2 1 C54 1nF 2 1 R23 3.3R 1 2 GND R24 3.3R 1 2 C44 220nF 1 2 C53 1nF 2 1 C52 1uF 2 1 C55 10nF 2 1 C56 10nF 2 1 IN_P_SUB IN_N_SUB GND SYNC GND GND GND - + OUT_P_SUB OUT_N_SUB PVCC MUTE_SUB R20 47k 1 2 OUTPUT LC FILTER R19 100k 1 2 C39 1uF 2 1 C49 100nF 2 1 EMI C-RC SNUBBER PVCC C43 220nF 1 2 PVCC /SD_SUB C48 1nF 2 1 GND C36 1uF 2 1 GND Power Pad U2 TPA3116D2 MODSEL 1 SDZ 2 FAULTZ 3 INPR 4 INNR 5 PLIMIT 6 GVDD 7 GAIN/SLV 8 GND 9 INPL 10 INNL 11 MUTE 12 AM2 13 AM1 14 AM0 15 SYNC 16 PVCC 32 PVCC 31 BSPR 30 OUTPR 29 GND 28 OUTNR 27 BSNR 26 GND 25 BSPL 24 OUTPL 23 GND 22 OUTNL 21 BSNL 20 PVCC 19 PVCC 18 AVCC 17 PVCC DECOUPLING C43 220nF 1 2 PVCC DECOUPLING GND 4R 4R 2R TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Typical Application (continued) Figure 37. Schematic 8.2.1 Design Requriements DESIGN PARAMETERS EXAMPLE VALUE Input voltage range PVCC 4.5 V to 26 V PWM output frequencies 400 kHz, 500 kHz, 600 kHz, 1 MHz or 1.2 MHz Maximum output power 50 W 26 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 8.2.2 Detailed Design Procedure The TPA31xxD2 family is a very flexible and easy to use Class D amplifier; therefore the design process is straightforward. Before beginning the design, gather the following information regarding the audio system. • PVCC rail planned for the design • Speaker or load impedance • Maximum output power requirement • Desired PWM frequency 8.2.2.1 Select the PWM Frequency Set the PWM frequency by using AM0, AM1 and AM2 pins. 8.2.2.2 Select the Amplifier Gain and Master/Slave Mode In order to select the amplifier gain setting, the designer must determine the maximum power target and the speaker impedance. Once these parameters have been determined, calculate the required output voltage swing which delivers the maximum output power. Choose the lowest analog gain setting that corresponds to produce an output voltage swing greater than the required output swing for maximum power. The analog gain and master/slave mode can be set by selecting the voltage divider resistors (R1 and R2) on the Gain/SLV pin. 8.2.2.3 Select Input Capacitance Select the bulk capacitors at the PVCC inputs for proper voltage margin and adequate capacitance to support the power requirements. In practice, with a well-designed power supply, two 100-μF, 50-V capacitors should be sufficient. One capacitor should be placed near the PVCC inputs at each side of the device. PVCC capacitors should be a low ESR type because they are being used in a high-speed switching application. 8.2.2.4 Select Decoupling Capacitors Good quality decoupling capacitors need to be added at each of the PVCC inputs to provide good reliability, good audio performance, and to meet regulatory requirements. X5R or better ratings should be used in this application. Consider temperature, ripple current, and voltage overshoots when selecting decoupling capacitors. Also, these decoupling capacitors should be located near the PVCC and GND connections to the device in order to minimize series inductances. 8.2.2.5 Select Bootstrap Capacitors Each of the outputs require bootstrap capacitors to provide gate drive for the high-side output FETs. For this design, use 0.22-μF, 25-V capacitors of X5R quality or better. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 0.001 0.01 0.1 1 10 0.01 0.1 1 10 40 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 12V TA = 25°C RL = 4Ω G009 0.001 0.01 0.1 1 10 0.01 0.1 1 10 100 Output Power (W) THD+N (%) f = 20Hz f = 1kHz f = 6kHz Gain = 26dB PVCC = 24V TA = 25°C RL = 4Ω G010 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com 8.2.3 Application Curves Figure 38. Total Harmonic Distortion + Noise (BTL) vs Figure 39. Total Harmonic Distortion + Noise (BTL) vs Output Power Output Power 9 Power Supply Recommendations The power supply requirements for the TPA3116D2 consist of one higher-voltage supply to power the output stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2 to generate the voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators which have been integrated are sized only to provide the current necessary to power the internal circuitry. The external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply. Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the device. The high voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power stage (PVCC). The AVCC supply feeds internal LDO including GVDD. This LDO output are connected to external pins for filtering purposes, but should not be connected to external circuits. GVDD LDO output have been sized to provide current necessary for internal functions but not for external loading. 10 Layout 10.1 Layout Guidelines The TPA3116D2 can be used with a small, inexpensive ferrite bead output filter for most applications. However, since the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed circuit board. The following suggestions will help to meet EMC requirements. • Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should be placed near the TPA3116D2 on the PVCC supplies. Local, high-frequency bypass capacitors should be placed as close to the PVCC pins as possible. These caps can be connected to the IC GND pad directly for an excellent ground connection. Consider adding a small, good quality low ESR ceramic capacitor between 220 pF and 1 nF and a larger mid-frequency cap of value between 100 nF and 1 µF also of good quality to the PVCC connections at each end of the chip. • Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna. • Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2. • Output filter — The ferrite EMI filter (see Figure 35) should be placed as close to the output terminals as possible for the best EMI performance. The LC filter should be placed close to the outputs. The capacitors used in both the ferrite and LC filters should be grounded. 28 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 Layout Guidelines (continued) For an example layout, see the TPA3116D2 Evaluation Module (TPA3116D2EVM) User Guide (SLOU336). Both the EVM user manual and the thermal pad application reports, SLMA002 and SLMA004, are available on the TI Web site at http://www.ti.com. 10.2 Layout Example Figure 40. Layout Example Top Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com Layout Example (continued) Figure 41. Layout Example Bottom 30 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 MACHINE THESE 3 EDGES AFTER 0.00 ANODIZATION –0.60 +.000 –.024 SINK HEIGHT 25.00 .984 1.00 [.118] 3.00 [.118] 0 [.000] 10.00 [.394] 19.50 [.768] 30.50 [1.201] 40.00 [1.575] 50.00±0.38 [1.969±.015] SINK LENGTH 3.00 [.118] 6.35 [.250] 13.90±0.38 [.547±.015] BASE WIDTH 6.95 [.274] 5.00 [.197] 40.00 [1.575] 2X 4-40 6.5 x TPA3116D2, TPA3118D2, TPA3130D2 www.ti.com SLOS708D –APRIL 2012–REVISED JANUARY 2015 10.3 Heat Sink Used on the EVM The heat sink (part number ATS-TI 10 OP-521-C1-R1) used on the EVM is an 14x25x50 mm extruded aluminum heat sink with three fins (see drawing below). For additional information on the heat sink, go to www.qats.com. Figure 42. EVM Heatsink This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having airflow will lower the requirement for the heat sink size and smaller types can be used. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 31 Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708D –APRIL 2012–REVISED JANUARY 2015 www.ti.com 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 7. Related Links TECHNICAL TOOLS & SUPPORT & PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY TPA3116D2 Click here Click here Click here Click here Click here TPA3118D2 Click here Click here Click here Click here Click here TPA3130D2 Click here Click here Click here Click here Click here 11.2 Trademarks All trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 32 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TPA3116D2DAD ACTIVE HTSSOP DAD 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA 3116 D2 TPA3116D2DADR ACTIVE HTSSOP DAD 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA 3116 D2 TPA3118D2DAP ACTIVE HTSSOP DAP 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3118 TPA3118D2DAPR ACTIVE HTSSOP DAP 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3118 TPA3130D2DAP ACTIVE HTSSOP DAP 32 46 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3130 TPA3130D2DAPR ACTIVE HTSSOP DAP 32 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 TPA3130 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2014 Addendum-Page 2 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TPA3116D2DADR HTSSOP DAD 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1 TPA3118D2DAPR HTSSOP DAP 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1 TPA3130D2DAPR HTSSOP DAP 32 2000 330.0 24.4 8.6 11.5 1.6 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2014 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA3116D2DADR HTSSOP DAD 32 2000 367.0 367.0 45.0 TPA3118D2DAPR HTSSOP DAP 32 2000 367.0 367.0 45.0 TPA3130D2DAPR HTSSOP DAP 32 2000 367.0 367.0 45.0 PACKAGE MATERIALS INFORMATION www.ti.com 25-Sep-2014 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 15-V Digital or ±7.5-V Peak-to-Peak Switching 125-Ω Typical On-State Resistance for 15-V Operation Switch On-State Resistance Matched to Within 5 Ω Over 15-V Signal-Input Range On-State Resistance Flat Over Full Peak-to-Peak Signal Range High On/Off Output-Voltage Ratio: 80 dB Typical at fis = 10 kHz, RL = 1 kΩ High Degree of Linearity: <0.5% Distortion Typical at fis = 1 kHz, Vis = 5 V p-p, VDD − VSS ≥ 10 V, RL = 10 kΩ Extremely Low Off-State Switch Leakage, Resulting in Very Low Offset Current and High Effective Off-State Resistance: 10 pA Typical at VDD − VSS = 10 V, TA = 25°C Extremely High Control Input Impedance (Control Circuit Isolated From Signal Circuit): 1012 Ω Typical Low Crosstalk Between Switches: −50 dB Typical at fis = 8 MHz, RL = 1 kΩ Matched Control-Input to Signal-Output Capacitance: Reduces Output Signal Transients Frequency Response, Switch On = 40 MHz Typical 100% Tested for Quiescent Current at 20 V 5-V, 10-V, and 15-V Parametric Ratings Meets All Requirements of JEDEC Tentative Standard No. 13-B, Standard Specifications for Description of “B” Series CMOS Devices Applications: − Analog Signal Switching/Multiplexing: Signal Gating, Modulator, Squelch Control, Demodulator, Chopper, Commutating Switch − Digital Signal Switching/Multiplexing − Transmission-Gate Logic Implementation − Analog-to-Digital and Digital-to-Analog Conversion − Digital Control of Frequency, Impedance, Phase, and Analog-Signal Gain description/ordering information The CD4066B is a quad bilateral switch intended for the transmission or multiplexing of analog or digital signals. It is pin-for-pin compatible with the CD4016B, but exhibits a much lower on-state resistance. In addition, the on-state resistance is relatively constant over the full signal-input range. The CD4066B consists of four bilateral switches, each with independent controls. Both the p and the n devices in a given switch are biased on or off simultaneously by the control signal. As shown in Figure 1, the well of the n-channel device on each switch is tied to either the input (when the switch is on) or to VSS (when the switch is off). This configuration eliminates the variation of the switch-transistor threshold voltage with input signal and, thus, keeps the on-state resistance low over the full operating-signal range. The advantages over single-channel switches include peak input-signal voltage swings equal to the full supply voltage and more constant on-state impedance over the input-signal range. However, for sample-and-hold applications, the CD4016B is recommended. !" #!$% & "' Copyright 2003, Texas Instruments Incorporated &! #" #" (" " ") !" & & * +' &! # " , &" " " %+ %!&" " , %% # " " ' Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 14 13 12 11 10 9 8 SIG A IN/OUT SIG A OUT/IN SIG B OUT/IN SIG B IN/OUT CONTROL B CONTROL C VSS VDD CONTROL A CONTROL D SIG D IN/OUT SIG D OUT/IN SIG C OUT/IN SIG C IN/OUT E, F, M, NS, OR PW PACKAGE (TOP VIEW) SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 description/ordering information (continued) ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING CDIP − F Tube of 25 CD4066BF3A CD4066BF3A PDIP − E Tube of 25 CD4066BE CD4066BE Tube of 50 CD4066BM −55°C to 125°C SOIC − M Reel of 2500 CD4066BM96 CD4066BM −55°C to 125°C SOIC − M Reel of 250 CD4066BMT CD4066BM SOP − NS Reel of 2000 CD4066BNSR CD4066B TSSOP − PW Tube of 90 CD4066BPW CM066B Reel of 2000 CD4066BPWR † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. † All control inputs are protected by the CMOS protection network. NOTES: A. All p substrates are connected to VDD. B. Normal operation control-line biasing: switch on (logic 1), VC = VDD; switch off (logic 0), VC = VSS C. Signal-level range: VSS ≤ Vis ≤ VDD Control VC† VDD VSS VSS n n p Out Vos Control Switch In 92CS-29113 p n Vis Figure 1. Schematic Diagram of One-of-Four Identical Switches and Associated Control Circuitry SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† DC supply-voltage range, VDD (voltages referenced to VSS terminal) −0.5 V to 20 V . . . . . . . . . . . . . . . . . . . . Input voltage range, Vis (all inputs) −0.5 V to V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DD + 0.5 V DC input current, IIN (any one input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA Package thermal impedance, θJA (see Note 1): E package 80 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W M package 86 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W NS package 76 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W PW package 113 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C/W Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max 265 . . . . . . . . . . . . . . . . . . . . . . . °C Storage temperature range, Tstg −65 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . °C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN MAX UNIT VDD Supply voltage 3 18 V TA Operating free-air temperature −55 125 °C SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics LIMITS AT INDICATED TEMPERATURES PARAMETER TEST CONDITIONS VIN VDD −55°C −40°C 85°C 125°C PARAMETER TEST CONDITIONS 25°C UNIT VIN (V) VDD (V) −55°C −40°C 85°C 125°C TYP MAX UNIT 0, 5 5 0.25 0.25 7.5 7.5 0.01 0.25 IDD Quiescent device 0, 10 10 0.5 0.5 15 15 0.01 0.5 IDD A Quiescent device current 0, 15 15 1 1 30 30 0.01 1 µA current 0, 20 20 5 5 150 150 0.02 5 Signal Inputs (Vis) and Outputs (Vos) VC = VDD, RL = 10 kΩ returned 5 800 850 1200 1300 470 1050 ron On-state resistance (max) RL = 10 kΩ returned to , VDD VSS 2 on 10 310 330 500 550 180 400 Ω (max) to , Vis = VSS to VDD 2 15 200 210 300 320 125 240 On-state resistance 5 15 ∆ron On-state resistance difference between any two switches RL = 10 kΩ, VC = VDD ∆ron difference between 10 10 Ω any two switches RL = 10 kΩ, VC = VDD 15 5 Ω THD Total harmonic distortion VC = VDD = 5 V, VSS = −5 V, Vis(p-p) = 5 V (sine wave centered on 0 V), RL = 10 kΩ, fis = 1-kHz sine wave 0.4 % −3-dB cutoff frequency (switch on) VC = VDD = 5 V, VSS = −5 V, Vis(p-p) = 5 V (sine wave centered on 0 V), RL = 1 kΩ 40 MHz −50-dB feedthrough frequency (switch off) VC = VSS = −5 V, Vis(p-p) = 5 V (sine wave centered on 0 V), RL = 1 kΩ 1 MHz Iis Input/output leakage current (switch off) (max) VC = 0 V, Vis = 18 V, Vos = 0 V; and VC = 0 V, Vis = 0 V, Vos = 18 V 18 ±0.1 ±0.1 ±1 ±1 ±10−5 ±0.1 µA −50-dB crosstalk frequency VC(A) = VDD = 5 V, VC(B) = VSS = −5 V, Vis(A) = 5 Vp-p, 50-Ω source, RL = 1 kΩ 8 MHz Propagation delay RL = 200 kΩ, VC = VDD, VSS = GND, CL = 50 pF, 5 20 40 tpd Propagation delay (signal input to signal output) VSS = GND, CL = 50 pF, Vis = 10 V (square wave centered on 5 V), pd (signal input to 10 10 20 ns signal output) is (square wave centered on 5 V), tr, tf = 20 ns 15 7 15 Cis Input capacitance VDD = 5 V, VC = VSS = −5 V 8 pF Cos Output capacitance VDD = 5 V, VC = VSS = −5 V 8 pF Cios Feedthrough VDD = 5 V, VC = VSS = −5 V 0.5 pF SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 electrical characteristics (continued) LIMITS AT INDICATED TEMPERATURES CHARACTERISTIC TEST CONDITIONS VDD −55°C −40°C 85°C 125°C CHARACTERISTIC TEST CONDITIONS 25°C UNIT VDD (V) −55°C −40°C 85°C 125°C TYP MAX UNIT Control (VC) Control input, |Iis| < 10 µA, 5 1 1 1 1 1 VILC Control input, low voltage (max) |Iis| < 10 µA, Vis = VSS, VOS = VDD, and V = V , V = V VILC 10 2 2 2 2 2 V low voltage (max) Vis = VSS, VOS = VDD, and Vis = VDD, VOS = VSS 15 2 2 2 2 2 V Control input, 5 3.5 (MIN) VIHC high voltage VIHC See Figure 6 10 7 (MIN) V high voltage See Figure 6 15 11 (MIN) V IIN Input current (max) Vis ≤ VDD, VDD − VSS = 18 V, VCC ≤ VDD − VSS 18 ±0.1 ±0.1 ±1 ±1 ±10−5 ±0.1 µA Crosstalk (control input to signal output) VC = 10 V (square wave), tr, tf = 20 ns, RL = 10 kΩ 10 50 mV Turn-on and turn-off VIN = VDD, tr, tf = 20 ns, 5 35 70 Turn-on and turn-off propagation delay VIN = VDD, tr, tf = 20 ns, CL = 50 pF, RL = 1 kΩ 10 20 40 ns propagation delay CL = 50 pF, RL = 1 kΩ 15 15 30 ns Vis = VDD, VSS = GND, RL = 1 kΩ to GND, CL = 50 pF, 5 6 Maximum control input repetition rate RL = 1 kΩ to GND, CL = 50 pF, VC = 10 V (square wave centered on 5 V), tr, tf = 20 ns, 10 9 MHz repetition rate C centered on 5 V), tr, tf = 20 ns, Vos = 1/2 Vos at 1 kHz 15 9.5 CI Input capacitance 5 7.5 pF switching characteristics VDD SWITCH INPUT SWITCH VDD OUTPUT, Vos (V) Vis (V) Iis (mA) OUTPUT, Vos (V) (V) Vis (V) −55°C −40°C 25°C 85°C 125°C MIN MAX 5 0 0.64 0.61 0.51 0.42 0.36 0.4 5 5 −0.64 −0.61 −0.51 −0.42 −0.36 4.6 10 0 1.6 1.5 1.3 1.1 0.9 0.5 10 10 −1.6 −1.5 −1.3 −1.1 −0.9 9.5 15 0 4.2 4 3.4 2.8 2.4 1.5 15 15 −4.2 −4 −3.4 −2.8 −2.4 13.5 SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS Vis − Input Signal Voltage − V 600 500 400 300 200 100 0 −4 −3 −2 −1 0 1 2 3 4 TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 92CS-27326RI Figure 2 TA = 125°C +25°C −55°C Supply Voltage (VDD − VSS) = 5 V − Channel On-State Resistance − on Ω r Figure 3 TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 300 250 200 150 100 50 0 −10 −7.5 −5 −2.5 0 2.5 5 7.5 10 Supply Voltage (VDD − VSS) = 10 V TA = 125°C Vis − Input Signal Voltage − V +25°C −55°C 92CS-27327RI − Channel On-State Resistance − on Ω r Vis − Input Signal Voltage − V TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) Figure 4 300 250 200 150 100 50 0 −10 −7.5 −5 −2.5 0 2.5 5 7.5 10 Supply Voltage (VDD − VSS) = 15 V TA = 125°C +25°C −55°C 92CS-27329RI − Channel On-State Resistance − on Ω r Vis − Input Signal Voltage − V Figure 5 TYPICAL ON-STATE RESISTANCE vs INPUT SIGNAL VOLTAGE (ALL TYPES) 600 500 400 300 200 100 0 −10 −7.5 −5 −2.5 0 2.5 5 7.5 10 Supply Voltage (VDD − VSS) = 5 V TA = 125°C 10 V −15 V 92CS-27330RI − Channel On-State Resistance − on Ω r SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TYPICAL CHARACTERISTICS CD4066B 1 of 4 Switches Iis Vis Vos 92CS-30966 |Vis − Vos| |Iis| ron = Figure 6. Determination of ron as a Test Condition for Control-Input High-Voltage (VIHC) Specification X-Y Plotter 1-kΩ Range TG On Keithley 160 Digital Multimeter H. P. Moseley 7030A X VSS VDD 10 kΩ 92CS-22716 Y Figure 7. Channel On-State Resistance Measurement Circuit Figure 8 TYPICAL ON CHARACTERISTICS FOR 1 OF 4 CHANNELS 3 2 1 0 −1 −2 −3 −3 −2 −1 0 1 2 3 4 VI − Input Voltage − V 92CS-30919 Output Voltage − V V − VC = VDD VDD Vis Vos RL VSS All unused terminals are connected to VSS CD4066B 1 of 4 Switches O Figure 9 10 102 103 10 101 102 103 104 f − Switching Frequency − kHz POWER DISSIPATION PER PACKAGE vs SWITCHING FREQUENCY TA = 25°C Power Dissipation Per Package − W D µ 6 4 2 6 4 2 6 4 2 6 4 2 2 46 2 46 92C-30920 5 V 10 V VSS VDD 5 6 13 12 7 CD4066B P − 14 Supply Voltage (VDD) = 15 V SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS V VDD = 5 V C = −5 V VSS = −5 V Cios Cis Cos CD4066B 1 of 4 Switches Measured on Boonton capacitance bridge, model 75a (1 MHz); test-fixture capacitance nulled out. 92CS-30921 Figure 10. Typical On Characteristics for One of Four Channels VDD VC = VSS Vos VSS CD4066B 1 of 4 Switches Vis = VDD I 92CS-30922 Figure 11. Off-Switch Input or Output Leakage All unused terminals are connected to VSS. VDD VC = VDD Vos VSS CD4066B 1 of 4 Switches Vis Figure 12. Propagation Delay Time Signal Input (Vis) to Signal Output (Vos) 92CS-30923 200 kΩ 50 pF VDD tr = tf = 20 ns All unused terminals are connected to VSS. VC VDD Vos VSS CD4066B 1 of 4 Switches Vis Figure 13. Crosstalk-Control Input to Signal Output +10 V tr = tf = 20 ns 92CS-30924 1 kΩ 10 kΩ All unused terminals are connected to VSS. SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TYPICAL CHARACTERISTICS VDD VC = VDD Vos VSS CD4066B 1 of 4 Switches VDD 92CS-30925 1 kΩ 50 pF VDD NOTES: A. All unused terminals are connected to VSS. B. Delay is measured at Vos level of +10% from ground (turn-on) or on-state output level (turn-off). tr = tf = 20 ns Figure 14. Propagation Delay, tPLH, tPHL Control-Signal Output VDD = 10 V VC VSS CD4066B 1 of 4 Switches Vis = 10 V 92CS-30925 50 pF 1 kΩ tr = tf = 20 ns VC Vos 90% 10% All unused terminals are connected to VSS. VOS VOS at 1 kHz 2 VOS VOS at 1 kHz 2 Repetition Rate 50% tr tf 10 V 0 V Figure 15. Maximum Allowable Control-Input Repetition Rate SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYPICAL CHARACTERISTICS Inputs VSS Measure inputs sequentially to both VDD and VSS. Connect all unused inputs to either VDD or VSS. Measure control inputs only. I VSS VDD 92CS-27555 Figure 16. Input Leakage-Current Test Circuit VDD Channel 1 Channel 2 Channel 3 Channel 4 Channel 1 Channel 2 Channel 3 Channel 4 1/4 CD4066B CD4066B CD4066B CD4018B CD4018B 1/4 CD4066B CD4001B LPF LPF LPF LPF 1 10 2 3 7 9 12 5 4 14 15 13 1 2 3 5 2 4 1 2 5 6 8 9 12 13 3 4 10 1 8 4 11 11 12 6 5 13 9 10 2 3 10 2 3 7 9 12 14 15 1 5 4 7 9 6 10 13 12 9 8 6 5 2 1 11 10 4 3 12 6 5 11 11 12 5 4 3 8 11 4 1 2 3 9 10 PE J1 J2 J3 J4 J5 Q1 Q2 1/3 CD4049B CD4001B Signal Inputs Clock Reset Package Count 2 - CD4001B 1 - CD4049B 3 - CD4066B 2 - CD4018B 1/3 CD4049B 1/6 CD4049B 10 k Signal Outputs PE J1 J2 J3 J4 J5 Q1 Q2 External Reset Clock Chan 1 Chan 2 Chan 3 Chan 4 VDD 30% (VDD − VSS) Clock Maximum Allowable Signal Level VSS 92CM-30928 Ω 10 kΩ 10 kΩ 10 kΩ 10 kΩ Figure 17. Four-Channel PAM Multiplex System Diagram SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TYPICAL CHARACTERISTICS SWA SWB SWC SWD 92CS-30927 Analog Inputs (±5 V) VDD = 5 V VDD = 5 V 5 V −5 V 5 V CD4066B Analog Outputs (±5 V) VSS = −5 V CD4054B VSS = 0 V VEE = −5 V IN 0 Digital Control Inputs 0 Figure 18. Bidirectional Signal Transmission Via Digital Control Logic SCHS051D − NOVEMBER 1998 − REVISED SEPTEMBER 2003 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION In applications that employ separate power sources to drive VDD and the signal inputs, the VDD current capability should exceed VDD/RL (RL = effective external load of the four CD4066B bilateral switches). This provision avoids any permanent current flow or clamp action on the VDD supply when power is applied or removed from the CD4066B. In certain applications, the external load-resistor current can include both VDD and signal-line components. To avoid drawing VDD current when switch current flows into terminals 1, 4, 8, or 11, the voltage drop across the bidirectional switch must not exceed 0.8 V (calculated from ron values shown). No VDD current will flow through RL if the switch current flows into terminals 2, 3, 9, or 10. PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples CD4066BE ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU | CU SN N / A for Pkg Type -55 to 125 CD4066BE CD4066BEE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4066BE CD4066BF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4066BF CD4066BF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 CD4066BF3A CD4066BF3AS2283 OBSOLETE CDIP J 14 TBD Call TI Call TI CD4066BF3AS2534 OBSOLETE CDIP J 14 TBD Call TI Call TI CD4066BM ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BM96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BM96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BM96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BMG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BMT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066BM CD4066BNSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4066B CD4066BPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B CD4066BPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B CD4066BPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 125 CM066B CD4066BPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM066B PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2015 Addendum-Page 2 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples JM38510/05852BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05852BCA M38510/05852BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 05852BCA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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PACKAGE OPTION ADDENDUM www.ti.com 29-Mar-2015 Addendum-Page 3 OTHER QUALIFIED VERSIONS OF CD4066B, CD4066B-MIL : • Catalog: CD4066B • Automotive: CD4066B-Q1, CD4066B-Q1 • Military: CD4066B-MIL NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Military - QML certified for Military and Defense Applications TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant CD4066BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BM96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BM96 SOIC D 14 2500 330.0 16.8 6.5 9.5 2.3 8.0 16.0 Q1 CD4066BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BM96G4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BMT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 CD4066BNSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 CD4066BPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 7-Apr-2014 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4066BM96 SOIC D 14 2500 333.2 345.9 28.6 CD4066BM96 SOIC D 14 2500 367.0 367.0 38.0 CD4066BM96 SOIC D 14 2500 364.0 364.0 27.0 CD4066BM96G4 SOIC D 14 2500 367.0 367.0 38.0 CD4066BM96G4 SOIC D 14 2500 333.2 345.9 28.6 CD4066BMT SOIC D 14 250 367.0 367.0 38.0 CD4066BNSR SO NS 14 2000 367.0 367.0 38.0 CD4066BPWR TSSOP PW 14 2000 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 7-Apr-2014 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 20-W STEREO DIGITAL AUDIO POWER AMPLIFIER WITH EQ AND DRC Check for Samples: TAS5707 TAS5707A 1FEATURES 23• Audio Input/Output Night-Mode Listening – 20-W Into an 8-Ω Load From an 18-V Supply – Autobank Switching: Preload Coefficients – Wide PVDD Range, From 8 V to 26 V for Different Sample Rates. No Need to Write New Coefficients to the Part When – Efficient Class-D Operation Eliminates Sample Rate Changes. Need for Heatsinks – Autodetect: Automatically Detects – Requires Only 3.3 V and PVDD Sample-Rate Changes. No Need for – One Serial Audio Input (Two Audio External Microprocessor Intervention Channels) – Supports 8-kHz to 48-kHz Sample Rate APPLICATIONS (LJ/RJ/I2S) • Television • Audio/PWM Processing • iPod™ Dock – Independent Channel Volume Controls With • Sound Bar 24 dB to Mute – Soft Mute (50% Duty Cycle) DESCRIPTION – Programmable Dynamic Range Control The TAS5707 is a 20-W, efficient, digital-audio power – 14 Programmable Biquads for Speaker EQ amplifier for driving stereo bridge-tied speakers. One and Other Audio Processing Features serial data input allows processing of up to two discrete audio channels and seamless integration to – Programmable Coefficients for DRC Filters most digital audio processors and MPEG decoders. – DC Blocking Filters The device accepts a wide range of input data and • General Features data rates. A fully programmable data path routes these channels to the internal speaker drivers. – Serial Control Interface Operational Without MCLK The TAS5707 is a slave-only device receiving all clocks from external sources. The TAS5707 operates – Factory-Trimmed Internal Oscillator for with a PWM carrier between a 384-kHz switching rate Automatic Rate Detection and 352-KHz switching rate, depending on the input – Surface Mount, 48-PIN, 7-mm × 7-mm sample rate. Oversampling combined with a HTQFP Package fourth-order noise shaper provides a flat noise floor – Thermal and Short-Circuit Protection and excellent dynamic range from 20 Hz to 20 kHz.. • Benefits The TAS5707A is identical in function to the HTQFP packaged TAS5707, but has a unique I 2 – EQ: Speaker Equalization Improves Audio C device Performance address. The address of the TAS5707 is 0x36. The address of the TAS5707A is 0x3A. – DRC: Dynamic Range Compression. Can Be Used As Power Limiter. Enables Speaker Protection, Easy Listening, 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2iPod is a trademark of Apple Inc. 3All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2008–2009, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. SDIN LRCLK SCLK MCLK RESET PDN SDA PLL_FLTM PLL_FLTP AVDD/DVDD PVDD OUT_A OUT_C OUT_B OUT_D BST_A BST_C BST_B BST_D 3.3 V 8 V–26 V SCL Digital Audio Source I C Control 2 Control Inputs LC LC Left Right B0264-11 Loop Filter(1) TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. SIMPLIFIED APPLICATION DIAGRAM (1)See user's guide for loop-filter details. 2 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A SDIN MCLK SCLK LRCLK Serial Audio Port 7 BQ L R V O L U M E DRC Protection Logic Click and Pop Control 7 BQ SDA SCL 4 Order th Noise Shaper and PWM S R C mDAP Sample Rate Autodetect and PLL Serial Control Microcontroller Based System Control Terminal Control OUT_A OUT_B 2 HB ´ FET Out OUT_C OUT_D 2 HB ´ FET Out B0262-02 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 FUNCTIONAL VIEW Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): TAS5707 TAS5707A Temp. Sense VALID FAULT AGND OC_ADJ Power On Reset Undervoltage Protection GND PWM_D OUT_D PGND_CD PVDD_D BST_D Gate Drive PWM Rcv Overcurrent Protection 4 Protection and I/O Logic PWM_C OUT_C PGND_CD PVDD_C BST_C Timing Gate Drive Ctrl PWM Rcv GVDD_CD PWM_B OUT_B PGND_AB PVDD_B BST_B Timing Gate Drive Ctrl PWM Rcv PWM_A OUT_A PGND_AB PVDD_A BST_A Timing Gate Drive Ctrl PWM Rcv GVDD_AB Ctrl Pulldown Resistor Pulldown Resistor Pulldown Resistor Pulldown Resistor 4 GVDD_CD Regulator GVDD_AB Regulator Timing I sense B0034-05 PWM Controller FAULT TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Figure 1. Power Stage Functional Block Diagram 4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A Vol1 R L 7 BQ EQ ´ ´ ealpha ealpha ´ ´ 7 BQ EQ Input Muxing Vol2 B0341-01 1 Energy MAXMUX Attack Decay DRC1 DRC ON/OFF 50[D7] 30–36 29–2F 3A 3A 3B–3C 46[D0] To PWM Hex numbers refer to I2C subaddresses [Di] = bit "i" of subaddress SSTIMER OC_ADJ PLL_FLTP VR_ANA NC AVSS PLL_FLTM BST_A GVDD_OUT PVDD_A OUT_A RESET PVDD_A STEST PDN VR_DIG OSC_RES DVSSO DVDD FAULT MCLK SCLK SDIN LRCLK AVDD SDA SCL DVSS GND VREG PVDD_B BST_B PVDD_C OUT_C PVDD_D BST_D PGND_AB OUT_B PGND_CD OUT_D AGND PGND_AB PVDD_B PGND_CD PVDD_D BST_C PVDD_C GVDD_OUT P0075-01 PHP Package (Top View) TAS5707 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 DAP Process Structure 48-TERMINAL, HTQFP PACKAGE (TOP VIEW) Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com PIN FUNCTIONS PIN TYPE 5-V TERMINATION (1) DESCRIPTION TOLERANT (2) NAME NO. AGND 30 P Analog ground for power stage AVDD 13 P 3.3-V analog power supply AVSS 9 P Analog 3.3-V supply ground BST_A 4 P High-side bootstrap supply for half-bridge A BST_B 43 P High-side bootstrap supply for half-bridge B BST_C 42 P High-side bootstrap supply for half-bridge C BST_D 33 P High-side bootstrap supply for half-bridge D DVDD 27 P 3.3-V digital power supply DVSSO 17 P Oscillator ground DVSS 28 P Digital ground FAULT 14 DO Backend error indicator. Asserted LOW for over temperature, over current, over voltage, and under voltage error conditions. De-asserted upon recovery from error condition. GND 29 P Analog ground for power stage GVDD_OUT 5, 32 P Gate drive internal regulator output LRCLK 20 DI 5-V Pulldown Input serial audio data left/right clock (sample rate clock) MCLK 15 DI 5-V Pulldown Master clock input NC 8 – No connection OC_ADJ 7 AO Analog overcurrent programming. Requires resistor to ground. OSC_RES 16 AO Oscillator trim resistor. Connect an 18.2-kΩ 1% resistor to DVSSO. OUT_A 1 O Output, half-bridge A OUT_B 46 O Output, half-bridge B OUT_C 39 O Output, half-bridge C OUT_D 36 O Output, half-bridge D PDN 19 DI 5-V Pullup Power down, active-low. PDN prepares the device for loss of power supplies by shutting down the noise shaper and initiating PWM stop sequence. PGND_AB 47, 48 P Power ground for half-bridges A and B PGND_CD 37, 38 P Power ground for half-bridges C and D PLL_FLTM 10 AO PLL negative loop filter terminal PLL_FLTP 11 AO PLL positive loop filter terminal PVDD_A 2, 3 P Power supply input for half-bridge output A PVDD_B 44, 45 P Power supply input for half-bridge output B PVDD_C 40, 41 P Power supply input for half-bridge output C PVDD_D 34, 35 P Power supply input for half-bridge output D RESET 25 DI 5-V Pullup Reset, active-low. A system reset is generated by applying a logic low to this pin. RESET is an asynchronous control signal that restores the DAP to its default conditions, and places the PWM in the hard mute state (tristated). SCL 24 DI 5-V I 2C serial control clock input SCLK 21 DI 5-V Pulldown Serial audio data clock (shift clock). SCLK is the serial audio port input data bit clock. SDA 23 DIO 5-V I 2C serial control data interface input/output SDIN 22 DI 5-V Pulldown Serial audio data input. SDIN supports three discrete (stereo) data formats. (1) TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output (2) All pullups are weak pullups and all pulldowns are weak pulldowns. The pullups and pulldowns are included to assure proper input logic levels if the pins are left unconnected (pullups → logic 1 input; pulldowns → logic 0 input). 6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 PIN FUNCTIONS (continued) PIN TYPE 5-V TERMINATION (1) DESCRIPTION TOLERANT (2) NAME NO. SSTIMER 6 AI Controls ramp time of OUT_X to minimize pop. Leave this pin floating for BD mode. Requires capacitor of 2.2 nF to GND in AD mode. The capacitor determines the ramp time. STEST 26 DI Factory test pin. Connect directly to DVSS. VR_ANA 12 P Internally regulated 1.8-V analog supply voltage. This pin must not be used to power external devices. VR_DIG 18 P Internally regulated 1.8-V digital supply voltage. This pin must not be used to power external devices. VREG 31 P Digital regulator output. Not to be used for powering external circuitry. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT DVDD, AVDD –0.3 to 3.6 V Supply voltage PVDD_X –0.3 to 30 V OC_ADJ –0.3 to 4.2 V 3.3-V digital input –0.5 to DVDD + 0.5 V Input voltage 5-V tolerant(2) digital input (except MCLK) –0.5 to DVDD + 2.5(3) V 5-V tolerant MCLK input –0.5 to AVDD + 2.5(3) V OUT_x to PGND_X 32(4) V BST_x to PGND_X 43(4) V Input clamp current, IIK ±20 mA Output clamp current, IOK ±20 mA Operating free-air temperature 0 to 85 °C Operating junction temperature range 0 to 150 °C Storage temperature range, Tstg –40 to 125 °C (1) Stresses beyond those listed under absolute ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operation conditions are not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability. (2) 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL. (3) Maximum pin voltage should not exceed 6.0Vele (4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions. DISSIPATION RATINGS(1) DERATING FACTOR TA ≤ 25°C TA = 45°C TA = 70°C PACKAGE ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING 7-mm × 7-mm HTQFP 40 mW/°C 5 W 4.2 W 3.2 W (1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SLMA002 for more information about using the HTQFP thermal pad RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Digital/analog supply voltage DVDD, AVDD 3 3.3 3.6 V Half-bridge supply voltage PVDD_X 8 26 V VIH High-level input voltage 5-V tolerant 2 V VIL Low-level input voltage 5-V tolerant 0.8 V TA Operating ambient temperature range 0 85 °C Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com RECOMMENDED OPERATING CONDITIONS (continued) MIN NOM MAX UNIT TJ (1) Operating junction temperature range 0 125 °C RL (BTL) Load impedance Output filter: L = 15 μH, C = 680 nF. 6 8 Ω Minimum output inductance under 10 LO (BTL) Output-filter inductance μH short-circuit condition (1) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device. PWM OPERATION AT RECOMMENDED OPERATING CONDITIONS PARAMETER TEST CONDITIONS VALUE UNIT 11.025/22.05/44.1-kHz data rate ±2% 352.8 kHz Output sample rate 48/24/12/8/16/32-kHz data rate ±2% 384 8 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 PLL INPUT PARAMETERS AND EXTERNAL FILTER COMPONENTS PARAMETER TEST CONDITIONS MIN TYP MAX UNIT fMCLKI MCLK Frequency 2.8224 24.576 MHz MCLK duty cycle 40% 50% 60% tr / Rise/fall time for MCLK 5 ns tf(MCLK) LRCLK allowable drift before LRCLK reset 4 MCLKs External PLL filter capacitor C1 SMD 0603 Y5V 47 nF External PLL filter capacitor C2 SMD 0603 Y5V 4.7 nF External PLL filter resistor R SMD 0603, metal film 470 Ω ELECTRICAL CHARACTERISTICS DC Characteristics TA = 25°, PVCC_X = 18V, DVDD = AVDD = 3.3V, RL= 8Ω, BTL AD Mode, FS = 48KHz (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage FAULTZ and SDA IOH = –4 mA 2.4 V DVDD = AVDD = 3 V VOL Low-level output voltage FAULTZ and SDA IOL = 4 mA 0.5 V DVDD = AVDD = 3 V VI < VIL ; DVDD = AVDD 75 IIL Low-level input current μA = 3.6V VI > VIH ; DVDD = 75 IIH High-level input current μA AVDD = 3.6V Normal Mode 48 83 3.3 V supply voltage (DVDD, IDD 3.3 V supply current Reset (RESET = low, 24 32 mA AVDD) PDN = high) Normal Mode 30 55 IPVDD Half-bridge supply current No load (PVDD_X) Reset (RESET = low, 5 13 mA PDN = high) Drain-to-source resistance, LS TJ = 25°C, includes metallization resistance 180 rDS(on) (1) Drain-to-source resistance, mΩ TJ = 25°C, includes metallization resistance 180 HS I/O Protection Vuvp Undervoltage protection limit PVDD falling 7.2 V Vuvp,hyst Undervoltage protection limit PVDD rising 7.6 V OTE(2) Overtemperature error 150 °C Extra temperature drop OTEHYST (2) 30 °C required to recover from error OTW Overtemperature warning 125 °C Temperature drop required to OTWHYST 25 °C recover from warning OLPC Overload protection counter fPWM = 384 kHz 0.63 ms IOC Overcurrent limit protection Resistor—programmable, max. current, ROCP = 22 kΩ 4.5 A IOCT Overcurrent response time 150 ns OC programming resistor Resistor tolerance = 5% for typical value; the minimum ROCP 20 22 kΩ range resistance should not be less than 20 kΩ. Internal pulldown resistor at Connected when drivers are tristated to provide bootstrap RPD 3 kΩ the output of each half-bridge capacitor charge. (1) This does not include bond-wire or pin resistance. (2) Specified by design Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com AC Characteristics (BTL) PVDD_X = 18 V, BTL AD mode, FS = 48 KHz, RL = 8 Ω, ROCP = 22 KΩ, CBST = 33 nF, audio frequency = 1 kHz, AES17 filter, fPWM = 384 kHz, TA = 25°C (unless otherwise noted). All performance is in accordance with recommended operating conditions, unless otherwise specified. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PVDD = 18 V,10% THD, 1-kHz input signal 20.6 PVDD = 18 V, 7% THD, 1-kHz input signal 19.5 PVDD = 12 V, 10% THD, 1-kHz input 9.4 P signal O Power output per channel W PVDD = 12 V, 7% THD, 1-kHz input signal 8.9 PVDD = 8 V, 10% THD, 1-kHz input signal 4.1 PVDD = 8 V, 7% THD, 1-kHz input signal 3.8 PVDD= 18 V; PO = 1 W 0.06% THD+N Total harmonic distortion + noise PVDD= 12 V; PO = 1 W 0.13% PVDD= 8 V; PO = 1 W 0.2% Vn Output integrated noise (rms) A-weighted 56 μV PO = 0.25 W, f = 1kHz (BD Mode) –82 dB Crosstalk PO = 0.25 W, f = 1kHz (AD Mode) -69 dB A-weighted, f = 1 kHz, maximum power at SNR Signal-to-noise ratio (1) 106 dB THD < 1% (1) SNR is calculated relative to 0-dBFS input level. 10 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A th1 t su1 t (edge) t su2 th2 SCLK (Input) LRCLK (Input) SDIN T0026-04 t r t f TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 SERIAL AUDIO PORTS SLAVE MODE over recommended operating conditions (unless otherwise noted) TEST PARAMETER MIN TYP MAX UNIT CONDITIONS fSCLKIN Frequency, SCLK 32 × fS, 48 × fS, 64 × fS CL = 30 pF 1.024 12.288 MHz tsu1 Setup time, LRCLK to SCLK rising edge 10 ns th1 Hold time, LRCLK from SCLK rising edge 10 ns tsu2 Setup time, SDIN to SCLK rising edge 10 ns th2 Hold time, SDIN from SCLK rising edge 10 ns LRCLK frequency 8 48 48 kHz SCLK duty cycle 40% 50% 60% LRCLK duty cycle 40% 50% 60% SCLK SCLK rising edges between LRCLK rising edges 32 64 edges t(edge) SCLK LRCLK clock edge with respect to the falling edge of SCLK –1/4 1/4 period tr / ns Rise/fall time for SCLK/LRCLK 8 tf(SCLK/LRCLK) Figure 2. Slave Mode Serial Data Interface Timing Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): TAS5707 TAS5707A SCL SDA tw(H) tw(L) t r t f t su1 th1 T0027-01 SCL SDA th2 t (buf) t su2 t su3 Start Condition Stop Condition T0028-01 TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com I 2C SERIAL CONTROL PORT OPERATION Timing characteristics for I 2C Interface signals over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT fSCL Frequency, SCL No wait states 400 kHz tw(H) Pulse duration, SCL high 0.6 μs tw(L) Pulse duration, SCL low 1.3 μs tr Rise time, SCL and SDA 300 ns tf Fall time, SCL and SDA 300 ns tsu1 Setup time, SDA to SCL 100 ns th1 Hold time, SCL to SDA 0 ns t(buf) Bus free time between stop and start condition 1.3 μs tsu2 Setup time, SCL to start condition 0.6 μs th2 Hold time, start condition to SCL 0.6 μs tsu3 Setup time, SCL to stop condition 0.6 μs CL Load capacitance for each bus line 400 pF Figure 3. SCL and SDA Timing Figure 4. Start and Stop Conditions Timing 12 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A tw(RESET) RESET td(I2C_ready) System Initialization. Enable via I C. 2 T0421-01 I C Active 2 I C Active 2 f − Frequency − Hz 20 PVDD = 18 V RL = 8 Ω 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 20k G001 P = 1 W P = 5 W 0.001 0.01 10 0.1 1 f − Frequency − Hz 20 PVDD = 12 V RL = 8 Ω 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 20k G002 P = 2.5 W 0.001 0.01 10 0.1 1 P = 0.5 W TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 RESET TIMING (RESET) Control signal parameters over recommended operating conditions (unless otherwise noted). Please refer to Recommended Use Model section on usage of all terminals. PARAMETER MIN TYP MAX UNIT tw(RESET) Pulse duration, RESET active 100 us td(I2C_ready) Time to enable I 2C 13.5 ms NOTE: On power up, it is recommended that the TAS5707 RESET be held LOW for at least 100 μs after DVDD has reached 3.0 V NOTE: If the RESET is asserted LOW while PDN is LOW, then the RESET must continue to be held LOW for at least 100 μs after PDN is deasserted (HIGH). Figure 5. Reset Timing TYPICAL CHARACTERISTICS, BTL CONFIGURATION TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs FREQUENCY FREQUENCY Figure 6. Figure 7. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Link(s): TAS5707 TAS5707A f − Frequency − Hz 20 PVDD = 8 V RL = 8 Ω 100 1k 10k THD+N − Total Harmonic Distortion + Noise − % 20k G003 P = 0.5 W P = 1 W 0.001 0.01 10 0.1 1 P = 2.5 W PO − Output Power − W 0.01 PVDD = 18 V RL = 8 Ω 0.1 1 10 THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 10 40 0.1 G004 1 f = 20 Hz f = 1 kHz f = 10 kHz PO − Output Power − W 0.01 PVDD = 12 V RL = 8 Ω 0.1 1 10 THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 10 40 0.1 G005 1 f = 20 Hz f = 1 kHz f = 10 kHz PO − Output Power − W 0.01 PVDD = 8 V RL = 8 Ω 0.1 1 10 THD+N − Total Harmonic Distortion + Noise − % 0.001 0.01 10 40 0.1 G006 1 f = 20 Hz f = 1 kHz f = 10 kHz TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs FREQUENCY OUTPUT POWER Figure 8. Figure 9. TOTAL HARMONIC DISTORTION + NOISE TOTAL HARMONIC DISTORTION + NOISE vs vs OUTPUT POWER OUTPUT POWER Figure 10. Figure 11. 14 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A PVDD − Supply Voltage − V 2 4 6 8 10 12 14 16 18 20 8 9 10 11 12 13 14 15 16 17 18 PO − Output Power − W G010 RL = 8 Ω THD+N = 1% THD+N = 10% PO − Output Power (Per Channel) − W 0 10 20 30 40 50 60 70 80 90 100 0 4 8 12 16 20 24 28 32 36 40 Efficiency − % G012 PVDD = 12 V PVDD = 18 V RL = 8 Ω PVDD = 8 V −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 f − Frequency − Hz Crosstalk − dB G013 20 100 1k 10k 20k Left to Right Right to Left PO = 0.25 W PVDD = 18 V RL = 8 Ω −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 f − Frequency − Hz Crosstalk − dB G014 20 100 1k 10k 20k Left to Right Right to Left PO = 0.25 W PVDD = 12 V RL = 8 Ω TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) OUTPUT POWER EFFICIENCY vs vs SUPPLY VOLTAGE OUTPUT POWER Figure 12. Figure 13. CROSSTALK CROSSTALK vs vs FREQUENCY FREQUENCY Figure 14. Figure 15. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Link(s): TAS5707 TAS5707A −100 −90 −80 −70 −60 −50 −40 −30 −20 −10 0 f − Frequency − Hz Crosstalk − dB G015 20 100 1k 10k 20k Left to Right Right to Left PO = 0.25 W PVDD = 8 V RL = 8 Ω TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued) CROSSTALK vs FREQUENCY Figure 16. 16 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 DETAILED DESCRIPTION POWER SUPPLY To facilitate system design, the TAS5707 needs only a 3.3-V supply in addition to the (typical) 18-V power-stage supply. An internal voltage regulator provides suitable voltage levels for the gate drive circuitry. Additionally, all circuitry requiring a floating voltage supply, e.g., the high-side gate drive, is accommodated by built-in bootstrap circuitry requiring only a few external capacitors. In order to provide good electrical and acoustical characteristics, the PWM signal path for the output stage is designed as identical, independent half-bridges. For this reason, each half-bridge has separate bootstrap pins (BST_X), and power-stage supply pins (PVDD_X). The gate drive voltages (GVDD_AB and GVDD_CD) are derived from the PVDD voltage. Special attention should be paid to placing all decoupling capacitors as close to their associated pins as possible. In general, inductance between the power-supply pins and decoupling capacitors must be avoided. For a properly functioning bootstrap circuit, a small ceramic capacitor must be connected from each bootstrap pin (BST_X) to the power-stage output pin (OUT_X). When the power-stage output is low, the bootstrap capacitor is charged through an internal diode connected between the gate-drive regulator output pin (GVDD_X) and the bootstrap pin. When the power-stage output is high, the bootstrap capacitor potential is shifted above the output potential and thus provides a suitable voltage supply for the high-side gate driver. In an application with PWM switching frequencies in the range from 352 kHz to 384 kHz, it is recommended to use 33-nF ceramic capacitors, size 0603 or 0805, for the bootstrap supply. These 33-nF capacitors ensure sufficient energy storage, even during minimal PWM duty cycles, to keep the high-side power stage FET (LDMOS) fully turned on during the remaining part of the PWM cycle. Special attention should be paid to the power-stage power supply; this includes component selection, PCB placement, and routing. As indicated, each half-bridge has independent power-stage supply pins (PVDD_X). For optimal electrical performance, EMI compliance, and system reliability, it is important that each PVDD_X pin is decoupled with a 100-nF ceramic capacitor placed as close as possible to each supply pin. The TAS5707 is fully protected against erroneous power-stage turnon due to parasitic gate charging. ERROR REPORTING Any fault resulting in device shutdown is signaled by the FAULT pin going low (see Table 1). A sticky version of this pin is available on D1 of register 0X02. Table 1. FAULT Output States FAULT DESCRIPTION 0 Overcurrent (OC) or undervoltage (UVP) error or overtemperature error (OTE) or over voltage ERROR 1 No faults (normal operation) DEVICE PROTECTION SYSTEM Overcurrent (OC) Protection With Current Limiting The device has independent, fast-reacting current detectors on all high-side and low-side power-stage FETs. The detector outputs are closely monitored by two protection systems. The first protection system controls the power stage in order to prevent the output current further increasing, i.e., it performs a cycle-by-cycle current-limiting function, rather than prematurely shutting down during combinations of high-level music transients and extreme speaker load impedance drops. If the high-current condition situation persists, i.e., the power stage is being overloaded, a second protection system triggers a latching shutdown, resulting in the power stage being set in the high-impedance (Hi-Z) state. The device returns to normal operation once the fault condition (i.e., a short circuit on the output) is removed. Current limiting and overcurrent protection are not independent for half-bridges. That is, if the bridge-tied load between half-bridges A and B causes an overcurrent fault, half-bridges A, B, C, and D are shut down. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 17 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Overtemperature Protection The TAS5707 has a two-level temperature-protection system that asserts an active-high warning signal (OTW) when the device junction temperature exceeds 125°C (nominal) and, if the device junction temperature exceeds 150°C (nominal), the device is put into thermal shutdown, resulting in all half-bridge outputs being set in the high-impedance (Hi-Z) state and FAULT being asserted low. The TAS5707 recovers from shutdown automatically once the temperature drops approximately 30°C. The overtemperature warning (OTW) is disabled once the temperature drops approximately 25°C. Undervoltage Protection (UVP) and Power-On Reset (POR) The UVP and POR circuits of the TAS5707 fully protect the device in any power-up/down and brownout situation. While powering up, the POR circuit resets the overload circuit (OLP) and ensures that all circuits are fully operational when the PVDD and AVDD supply voltages reach 7.6 V and 2.7 V, respectively. Although PVDD and AVDD are independently monitored, a supply voltage drop below the UVP threshold on AVDD or either PVDD pin results in all half-bridge outputs immediately being set in the high-impedance (Hi-Z) state and FAULT being asserted low. SSTIMER FUNCTIONALITY The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when exiting all-channel shutdown. The capacitor on the SSTIMER pin is slowly charged through an internal current source, and the charge time determines the rate at which the output transitions from a near zero duty cycle to the desired duty cycle. This allows for a smooth transition that minimizes audible pops and clicks. When the part is shutdown the drivers are tristated and transition slowly down through a 3K resistor, similarly minimizing pops and clicks. The shutdown transition time is independent of SSTIMER pin capacitance. Larger capacitors will increase the start-up time, while capacitors smaller than 2.2 nF will decrease the start-up time. The SSTIMER pin should be left floating for BD modulation. CLOCK, AUTO DETECTION, AND PLL The TAS5707 is a slave device. It accepts MCLK, SCLK, and LRCLK. The digital audio processor (DAP) supports all the sample rates and MCLK rates that are defined in the clock control register . The TAS5707 checks to verify that SCLK is a specific value of 32 fS, 48 fS, or 64 fS. The DAP only supports a 1 × fS LRCLK. The timing relationship of these clocks to SDIN is shown in subsequent sections. The clock section uses MCLK or the internal oscillator clock (when MCLK is unstable, out of range, or absent) to produce the internal clock (DCLK) running at 512 time the PWM switching frequency. The DAP can autodetect and set the internal clock control logic to the appropriate settings for all supported clock rates as defined in the clock control register. TAS5707 has robust clock error handling that uses the bulit-in trimmed oscillator clock to quickly detect changes/errors. Once the system detects a clock change/error, it will mute the audio (through a single step mute) and then force PLL to limp using the internal oscillator as a reference clock. Once the clocks are stable, the system will auto detect the new rate and revert to normal operation. During this process, the default volume will be restored in a single step (also called hard unmute). The ramp process can be programmed to ramp back slowly (also called soft unmute) as defined in volume register (0X0E). SERIAL DATA INTERFACE Serial data is input on SDIN. The PWM outputs are derived from SDIN. The TAS5707 DAP accepts serial data in 16-, 20-, or 24-bit left-justified, right-justified, and I 2S serial data formats. PWM Section The TAS5707 DAP device uses noise-shaping and sophisticated non-linear correction algorithms to achieve high power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper to increase dynamic range and SNR in the audio band. The PWM section accepts 24-bit PCM data from the DAP and outputs two BTL PWM audio output channels. 18 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 32 Clks LRCLK (Note Reversed Phase) Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 32 Clks Right Channel 2-Channel I S (Philips Format) Stereo Input 2 T0034-01 9 8 5 4 1 0 0 5 4 1 0 23 22 1 19 18 15 14 MSB LSB 9 8 5 4 1 0 0 5 4 1 0 SCLK TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 The PWM section has individual channel dc blocking filters that can be enabled and disabled. The filter cutoff frequency is less than 1 Hz. Individual channel de-emphasis filters for 44.1- and 48-kHz are included and can be enabled and disabled. Finally, the PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%. For detailed description of using audio processing features like DRC and EQ, please refer to User's Guide and TAS570X GDE software development tool documentation. Also refer to GDE software development tool for device data path. I 2C COMPATIBLE SERIAL CONTROL INTERFACE The TAS5707 DAP has an I 2C serial control slave interface to receive commands from a system controller. The serial control interface supports both normal-speed (100-kHz) and high-speed (400-kHz) operations without wait states. As an added feature, this interface operates even if MCLK is absent. The serial control interface supports both single-byte and multi-byte read and write operations for status registers and the general control registers associated with the PWM. SERIAL INTERFACE CONTROL AND TIMING I 2S Timing I 2S timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is low for the left channel and high for the right channel. A bit clock running at 32, 48, or 64 × fS is used to clock in the data. There is a delay of one bit clock from the time the LRCLK signal changes state to the first bit of data on the data lines. The data is written MSB first and is valid on the rising edge of bit clock. The DAP masks unused trailing data bit positions. NOTE: All data presented in 2s-complement form with MSB first. Figure 17. I 2S 64-fS Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 24 Clks LRCLK Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 24 Clks Right Channel 2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size) 2 T0092-01 17 16 9 8 5 4 3 2 1 0 0 13 12 5 4 9 8 1 0 23 22 SCLK 1 19 18 15 14 MSB LSB 17 16 9 8 5 4 3 2 13 12 5 4 1 0 9 8 1 0 SCLK 16 Clks LRCLK Left Channel 16-Bit Mode 15 14 1 15 14 1 MSB LSB 16 Clks Right Channel 2-Channel I S (Philips Format) Stereo Input 2 T0266-01 13 12 11 10 9 8 5 4 3 2 0 13 12 11 10 9 8 5 4 3 2 SCLK MSB LSB TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com NOTE: All data presented in 2s-complement form with MSB first. Figure 18. I 2S 48-fS Format NOTE: All data presented in 2s-complement form with MSB first. Figure 19. I 2S 32-fS Format 20 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 32 Clks LRCLK Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 32 Clks Right Channel 2-Channel Left-Justified Stereo Input T0034-02 9 8 5 4 5 4 1 1 0 0 0 23 22 1 19 18 15 14 MSB LSB 9 8 5 4 5 4 1 1 0 0 0 SCLK TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Left-Justified Left-justified (LJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data lines at the same time LRCLK toggles. The data is written MSB first and is valid on the rising edge of the bit clock. The DAP masks unused trailing data bit positions. NOTE: All data presented in 2s-complement form with MSB first. Figure 20. Left-Justified 64-fS Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 24 Clks LRCLK Left Channel 24-Bit Mode 1 19 18 20-Bit Mode 16-Bit Mode 15 14 MSB LSB 24 Clks Right Channel 2-Channel Left-Justified Stereo Input (24-Bit Transfer Word Size) T0092-02 17 16 9 8 5 4 13 12 5 4 1 9 8 1 0 0 0 21 17 13 23 22 SCLK 1 19 18 15 14 MSB LSB 17 16 9 8 5 4 13 12 5 4 1 9 8 1 0 0 0 21 17 13 SCLK 16 Clks LRCLK Left Channel 16-Bit Mode 15 14 1 15 14 1 MSB LSB 16 Clks Right Channel 2-Channel Left-Justified Stereo Input T0266-02 13 12 11 10 9 8 5 4 3 2 0 13 12 11 10 9 8 5 4 3 2 0 SCLK MSB LSB TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com NOTE: All data presented in 2s-complement form with MSB first. Figure 21. Left-Justified 48-fS Format NOTE: All data presented in 2s-complement form with MSB first. Figure 22. Left-Justified 32-fS Format 22 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 32 Clks LRCLK Left Channel 24-Bit Mode 1 20-Bit Mode 16-Bit Mode 15 14 MSB LSB SCLK 32 Clks Right Channel 2-Channel Right-Justified (Sony Format) Stereo Input T0034-03 19 18 19 18 1 1 0 0 0 15 14 15 14 23 22 1 15 14 MSB LSB 19 18 19 18 1 1 0 0 0 15 14 15 14 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Right-Justified Right-justified (RJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32, 48, or 64 × fS is used to clock in the data. The first bit of data appears on the data 8 bit-clock periods (for 24-bit data) after LRCLK toggles. In RJ mode the LSB of data is always clocked by the last bit clock before LRCLK transitions. The data is written MSB first and is valid on the rising edge of bit clock. The DAP masks unused leading data bit positions. Figure 23. Right Justified 64-fS Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 23 Product Folder Link(s): TAS5707 TAS5707A 23 22 SCLK 24 Clks LRCLK Left Channel 24-Bit Mode 1 20-Bit Mode 16-Bit Mode 15 14 MSB LSB SCLK 24 Clks Right Channel MSB 2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size) T0092-03 19 18 5 19 18 5 1 5 1 0 0 0 2 2 2 6 6 6 15 14 15 14 23 22 1 15 14 19 18 5 19 18 5 1 5 1 0 0 0 2 2 2 6 6 6 15 14 15 14 LSB TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Figure 24. Right Justified 48-fS Format Figure 25. Right Justified 32-fS Format 24 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 7-Bit Slave Address R/ W A 8-Bit Register Address (N) 8-Bit Register Data For Address (N) Start Stop SDA SCL 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 A 8-Bit Register Data For Address (N) A A T0035-01 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 I 2C SERIAL CONTROL INTERFACE The TAS5707 DAP has a bidirectional I 2C interface that compatible with the I 2C (Inter IC) bus protocol and supports both 100-kHz and 400-kHz data transfer rates for single and multiple byte write and read operations. This is a slave only device that does not support a multimaster bus environment or wait state insertion. The control interface is used to program the registers of the device and to read device status. The DAP supports the standard-mode I 2C bus operation (100 kHz maximum) and the fast I 2C bus operation (400 kHz maximum). The DAP performs all I 2C operations without I 2C wait cycles. General I 2C Operation The I 2C bus employs two signals; SDA (data) and SCL (clock), to communicate between integrated circuits in a system. Data is transferred on the bus serially one bit at a time. The address and data can be transferred in byte (8-bit) format, with the most significant bit (MSB) transferred first. In addition, each byte transferred on the bus is acknowledged by the receiving device with an acknowledge bit. Each transfer operation begins with the master device driving a start condition on the bus and ends with the master device driving a stop condition on the bus. The bus uses transitions on the data pin (SDA) while the clock is high to indicate a start and stop conditions. A high-to-low transition on SDA indicates a start and a low-to-high transition indicates a stop. Normal data bit transitions must occur within the low time of the clock period. These conditions are shown in Figure 26. The master generates the 7-bit slave address and the read/write (R/W) bit to open communication with another device and then waits for an acknowledge condition. The TAS5707 holds SDA low during the acknowledge clock period to indicate an acknowledgment. When this occurs, the master transmits the next byte of the sequence. Each device is addressed by a unique 7-bit slave address plus R/W bit (1 byte). All compatible devices share the same signals via a bidirectional bus using a wired-AND connection. An external pullup resistor must be used for the SDA and SCL signals to set the high level for the bus. Figure 26. Typical I 2C Sequence There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is shown in Figure 26. The 7-bit address for TAS5707 is 0011 011 (0x36). The 7-bit address for the TAS5707A is 0011 101 (0x3A). The TAS5707 address can be changed from 0x36 to 0x38 by writing 0x38 to device slave address register 0xF9. The TAS5707A address can be changed from 0x3A to 0x3C by writing 0x3C to device slave address register 0xF9. Single- and Multiple-Byte Transfers The serial control interface supports both single-byte and multiple-byte read/write operations for subaddresses 0x00 to 0x1F. However, for the subaddresses 0x20 to 0xFF, the serial control interface supports only multiple-byte read/write operations (in multiples of 4 bytes). During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does not contain 32 bits, the unused bits are read as logic 0. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 25 Product Folder Link(s): TAS5707 TAS5707A A6 A5 A4 A3 A2 A1 A0 R/W ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK Start Condition Stop Condition Acknowledge Acknowledge Acknowledge I C Device Address and 2 Read/Write Bit Subaddress Data Byte T0036-01 D7 D0 ACK Stop Condition Acknowledge I C Device Address and 2 Read/Write Bit Subaddress Last Data Byte A6 A5 A1 A0 R/W ACK A7 A5 A1 A0 ACK D7 ACK Start Condition Acknowledge Acknowledge Acknowledge First Data Byte A6 A4 A3 Other Data Bytes ACK Acknowledge D0 D7 D0 T0036-02 TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes that are required for each specific subaddress. For example, if a write command is received for a biquad subaddress, the DAP expects to receive five 32-bit words. If fewer than five 32-bit data words have been received when a stop command (or another start command) is received, the data received is discarded. Supplying a subaddress for each subaddress transaction is referred to as random I 2C addressing. The TAS5707 also supports sequential I 2C addressing. For write transactions, if a subaddress is issued followed by data for that subaddress and the 15 subaddresses that follow, a sequential I 2C write transaction has taken place, and the data for all 16 subaddresses is successfully received by the TAS5707. For I 2C sequential write transactions, the subaddress then serves as the start address, and the amount of data subsequently transmitted, before a stop or start is transmitted, determines how many subaddresses are written. As was true for random addressing, sequential addressing requires that a complete set of data be transmitted. If only a partial set of data is written to the last subaddress, the data for the last subaddress is discarded. However, all other data written is accepted; only the incomplete data is discarded. Single-Byte Write As shown in Figure 27, a single-byte data write transfer begins with the master device transmitting a start condition followed by the I 2C device address and the read/write bit. The read/write bit determines the direction of the data transfer. For a write data transfer, the read/write bit will be a 0. After receiving the correct I 2C device address and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the address byte or bytes corresponding to the TAS5707 internal memory address being accessed. After receiving the address byte, the TAS5707 again responds with an acknowledge bit. Next, the master device transmits the data byte to be written to the memory address being accessed. After receiving the data byte, the TAS5707 again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data write transfer. Figure 27. Single-Byte Write Transfer Multiple-Byte Write A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes are transmitted by the master device to the DAP as shown in Figure 28. After receiving each data byte, the TAS5707 responds with an acknowledge bit. Figure 28. Multiple-Byte Write Transfer 26 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A A6 A5 A0 R/W ACK A7 A6 A5 A4 A0 ACK A6 A5 A0 ACK Start Condition Stop Condition Acknowledge Acknowledge Acknowledge I C Device Address and 2 Read/Write Bit Subaddress Data Byte D7 D6 D1 D0 ACK I C Device Address and Read/Write Bit 2 Not Acknowledge A1 A1 R/W Repeat Start Condition T0036-03 A6 A0 ACK Acknowledge I C Device Address and Read/Write Bit 2 A6 A0 R/W ACK A0 ACK R/W D7 D0 ACK Start Condition Stop Condition Acknowledge Acknowledge Acknowledge Last Data Byte ACK First Data Byte Repeat Start Condition Not Acknowledge I C Device Address and Read/Write Bit 2 Subaddress Other Data Bytes A7 A6 A5 D7 D0 ACK Acknowledge D7 D0 T0036-04 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Single-Byte Read As shown in Figure 29, a single-byte data read transfer begins with the master device transmitting a start condition followed by the I 2C device address and the read/write bit. For the data read transfer, both a write followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5707 address and the read/write bit, TAS5707 responds with an acknowledge bit. In addition, after sending the internal memory address byte or bytes, the master device transmits another start condition followed by the TAS5707 address and the read/write bit again. This time the read/write bit becomes a 1, indicating a read transfer. After receiving the address and the read/write bit, the TAS5707 again responds with an acknowledge bit. Next, the TAS5707 transmits the data byte from the memory address being read. After receiving the data byte, the master device transmits a not acknowledge followed by a stop condition to complete the single byte data read transfer. Figure 29. Single-Byte Read Transfer Multiple-Byte Read A multiple-byte data read transfer is identical to a single-byte data read transfer except that multiple data bytes are transmitted by the TAS5707 to the master device as shown in Figure 30. Except for the last data byte, the master device responds with an acknowledge bit after receiving each data byte. Figure 30. Multiple Byte Read Transfer Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 27 Product Folder Link(s): TAS5707 TAS5707A Output Level (dB) Input Level (dB) T O K M0091-02 1:1 Transfer Function Implemented Transfer Function S Z –1 Alpha Filter Structure w a B0265-01 Energy Filter a w, T, K, O a w a , a d d / , a w DRC 0x3A 0x40, 0x41, 0x42 0x3B / 0x3C Compression Control Attack and Decay Filters Audio Input DRC Coefficient NOTE: w a = 1 – TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Dynamic Range Control (DRC) The DRC scheme has a single threshold, offset, and slope (all programmable). There is one ganged DRC for the left/right channels. The DRC input/output diagram is shown in Figure 31. Professional-quality dynamic range compression automatically adjusts volume to flatten volume level. • One DRC for left/right • The DRC has adjustable threshold, offset, and compression levels • Programmable energy, attack, and decay time constants • Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging, and decay times can be set slow enough to avoid pumping. Figure 31. Dynamic Range Control Figure 32. DRC Structure 28 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A 2 Bit –23 S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx 2 Bit –5 2 Bit –1 2 Bit 0 Sign Bit 2 Bit 1 M0125-01 TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 BANK SWITCHING The TAS5707 uses an approach called bank switching together with automatic sample-rate detection. All processing features that must be changed for different sample rates are stored internally in three banks. The user can program which sample rates map to each bank. By default, bank 1 is used in 32kHz mode, bank 2 is used in 44.1/48 kHz mode, and bank 3 is used for all other rates. Combined with the clock-rate autodetection feature, bank switching allows the TAS5707 to detect automatically a change in the input sample rate and switch to the appropriate bank without any MCU intervention. An external controller configures bankable locations (0x29-0x36 and 0x3A-0x3C) for all three banks during the initialization sequence. If auto bank switching is enabled (register 0x50, bits 2:0) , then the TAS5707 automatically swaps the coefficients for subsequent sample rate changes, avoiding the need for any external controller intervention for a sample rate change. By default, bits 2:0 have the value 000; indicating that bank switching is disabled. In that state, updates to bankable locations take immediate effect. A write to register 0x50 with bits 2:0 being 001, 010, or 011 brings the system into the coefficient-bank-update state update bank1, update bank2, or update bank3, respectively. Any subsequent write to bankable locations updates the coefficient banks stored outside the DAP. After updating all the three banks, the system controller should issue a write to register 0x50 with bits 2:0 being 100; this changes the system state to automatic bank switching mode. In automatic bank switching mode, the TAS5707 automatically swaps banks based on the sample rate. Command sequences for updating DAP coefficients can be summarized as follows: 1. Bank switching disabled (default): DAP coefficient writes take immediate effect and are not influenced by subsequent sample rate changes. OR Bank switching enabled: (a) Update bank-1 mode: Write "001" to bits 2:0 of reg 0x50. Load the 32 kHz coefficients. (b) Update bank-2 mode: Write "010" to bits 2:0 of reg 0x50. Load the 48 kHz coefficients. (c) Update bank-3 mode: Write "011" to bits 2:0 of reg 0x50. Load the other coefficients. (d) Enable automatic bank switching by writing "100" to bits 2:0 of reg 0x50. 26-Bit 3.23 Number Format All mixer gain coefficients are 26-bit coefficients using a 3.23 number format. Numbers formatted as 3.23 numbers means that there are 3 bits to the left of the decimal point and 23 bits to the right of the decimal point. This is shown in Figure 33 . Figure 33. 3.23 Format Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 29 Product Folder Link(s): TAS5707 TAS5707A (1 or 0) 2 + ´ 1 (1 or 0) 2 + (1 or 0) 2 + ....... (1 or 0) 2 + ....... (1 or 0) 2 ´ ´ ´ ´ 0 –1 –4 –23 2 Bit 1 2 Bit 0 2 Bit –1 2 Bit –4 2 Bit –23 M0126-01 u Coefficient Digit 8 u u u u u S x Coefficient Digit 7 x. x x x Coefficient Digit 6 x x x x Coefficient Digit 5 x x x x Coefficient Digit 4 x x x x Coefficient Digit 3 x x x x Coefficient Digit 2 x x x x Coefficient Digit 1 Fraction Digit 5 Fraction Digit 4 Fraction Digit 3 Fraction Digit 2 Fraction Integer Digit 1 Digit 1 Sign Bit Fraction Digit 6 u = unused or don’t care bits Digit = hexadecimal digit M0127-01 0 TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 33. If the most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct number. If the most significant bit is a logic 1, then the number is a negative number. In this case every bit must be inverted, a 1 added to the result, and then the weighting shown in Figure 34 applied to obtain the magnitude of the negative number. Figure 34. Conversion Weighting Factors—3.23 Format to Floating Point Gain coefficients, entered via the I 2C bus, must be entered as 32-bit binary numbers. The format of the 32-bit number (4-byte or 8-digit hexadecimal number) is shown in Figure 35 Figure 35. Alignment of 3.23 Coefficient in 32-Bit I 2C Word Table 2. Sample Calculation for 3.23 Format db Linear Decimal Hex (3.23 Format) 0 1 8388608 00800000 5 1.7782794 14917288 00E39EA8 –5 0.5623413 4717260 0047FACC X L = 10(X/20) D = 8388608 × L H = dec2hex (D, 8) Table 3. Sample Calculation for 9.17 Format db Linear Decimal Hex (9.17 Format) 0 1 131072 20000 5 1.77 231997 38A3D –5 0.56 73400 11EB8 X L = 10(X/20) D = 131072 × L H = dec2hex (D, 8) 30 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A Initialization 50 ms 50 ms 2 sm 2 sm 2 sm 2 sm AVDD/DVDD PDN PVDD RESET T0419-01 3 V 3 V 0 ns 0 ns 0 ns 10 sm 100 sμ 13.5 ms 100 sm 6 V 6 V 8 V 8 V 2I S MCLK LRCLK SCLK SDIN 2I C SCL SDA Trim Volume and Mute Commands Clock Changes/Errors OK Stable and Valid Clocks Stable and Valid Clocks Exit SD Enter SD DAP Config Other Config 1 ms + 1.3 tstart(2) 1 ms + 1.3 tstart(2) tPLL(1) tPLL(1) 1 ms + 1.3 tstop(2) 0 ns Normal Operation Shutdown Powerdown (1) t has to be greater than 240 ms + 1.3 t . This constraint only applies to the first trim command following AVDD/DVDD power-up. It does not apply to trim commands following subsequent resets. (2) t /t = PWM start/stop time as defined in register 0X1A PLL start start stop TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Recommended Use Model Figure 36. Recommended Command Sequence Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 31 Product Folder Link(s): TAS5707 TAS5707A 2 sm 2 sm 2 sm AVDD/DVDD PDN PVDD RESET T0420-01 3 V 8 V 6 V I S2 I C2 2 ms 0 ns 0 ns 0 ns 0 ns TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Figure 37. Power Loss Sequence Recommended Command Sequences The DAP has two groups of commands. One set is for configuration and is intended for use only during initialization. The other set has built-in click and pop protection and may be used during normal operation while audio is streaming. The following supported command sequences illustrate how to initialize, operate, and shutdown the device. Initialization Sequence Use the following sequence to power-up and initialize the device: 1. Hold all digital inputs low and ramp up AVDD/DVDD to at least 3V. 2. Initialize digital inputs and PVDD supply as follows: • Drive RESETZ=0, PDNZ=1, and other digital inputs to their desired state while ensuring that all are never more than 2.5V above AVDD/DVDD. Provide stable and valid I2S clocks (MCLK, LRCLK, and SCLK). Wait at least 100us, drive RESETZ=1, and wait at least another 13.5ms. • Ramp up PVDD to at least 8V while ensuring that it remains below 6V for at least 100us after AVDD/DVDD reaches 3V. Then wait at least another 10us. 3. Trim oscillator (write 0x00 to register 0x1B) and wait at least 50ms. 4. Configure the DAP via I 2C (see Users's Guide for typical values): Biquads (0x29-36) DRC parameters (0x3A-3C, 0x40-42, and 0x46) Bank select (0x50) 5. Configure remaining registers 6. Exit shutdown (sequence defined below). 32 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Normal Operation The following are the only events supported during normal operation: (a) Writes to master/channel volume registers (b) Writes to soft mute register (c) Enter and exit shutdown (sequence defined below) (d) Clock errors and rate changes Note: Events (c) and (d) are not supported for 240ms+1.3*Tstart after trim following AVDD/DVDD powerup ramp (where Tstart is specified by register 0x1A). Shutdown Sequence Enter: 1. Ensure I2S clocks have been stable and valid for at least 50ms. 2. Write 0x40 to register 0x05. 3. Wait at least 1ms+1.3*Tstop (where Tstop is specified by register 0x1A). 4. Once in shutdown, stable clocks are not required while device remains idle. 5. If desired, reconfigure by ensuring that clocks have been stable and valid for at least 50ms before returning to step 4 of initialization sequence. Exit: 1. Ensure I2S clocks have been stable and valid for at least 50ms. 2. Write 0x00 to register 0x05 (exit shutdown command may not be serviced for as much as 240ms after trim following AVDD/DVDD powerup ramp). 3. Wait at least 1ms+1.3*Tstart (where Tstart is specified by register 0x1A). 4. Proceed with normal operation. Powerdown Sequence Use the following sequence to powerdown the device and its supplies: 1. If time permits, enter shutdown (sequence defined above); else, in case of sudden power loss, assert PDNZ=0 and wait at least 2ms. 2. Assert RESETZ=0. 3. Drive digital inputs low and ramp down PVDD supply as follows: • Drive all digital inputs low after RESETZ has been low for at least 2us. • Ramp down PVDD while ensuring that it remains above 8V until RESETZ has been low for at least 2us. 4. Ramp down AVDD/DVDD while ensuring that it remains above 3V until PVDD is below 6V and that it is never more than 2.5V below the digital inputs. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 33 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Table 4. Serial Control Interface Register Summary NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE A u indicates unused bits. 0x00 Clock control register 1 Description shown in subsequent section 0x6C 0x01 Device ID register 1 Description shown in subsequent section 0x70 0x02 Error status register 1 Description shown in subsequent section 0x00 0x03 System control register 1 1 Description shown in subsequent section 0xA0 0x04 Serial data interface 1 Description shown in subsequent section 0x05 register 0x05 System control register 2 1 Description shown in subsequent section 0x40 0x06 Soft mute register 1 Description shown in subsequent section 0x00 0x07 Master volume 1 Description shown in subsequent section 0xFF (mute) 0x08 Channel 1 vol 1 Description shown in subsequent section 0x30 (0 dB) 0x09 Channel 2 vol 1 Description shown in subsequent section 0x30 (0 dB) 0x0A Fine master volume 1 Description shown in subsequent section 0x00 (0 dB) 0x0B–0X0D 1 Reserved(1) 0x0E Volume configuration 1 Description shown in subsequent section 0x91 register 0x0F 1 Reserved(1) 0x10 Modulation limit register 1 Description shown in subsequent section 0x02 0x11 IC delay channel 1 1 Description shown in subsequent section 0xAC 0x12 IC delay channel 2 1 Description shown in subsequent section 0x54 0x13 IC delay channel 3 1 Description shown in subsequent section 0xAC 0x14 IC delay channel 4 1 Description shown in subsequent section 0x54 0x15–0x19 1 Reserved(1) 0x1A Start/stop period register 1 Description shown in subsequent section 0x0F 0x1B Oscillator trim register 1 Description shown in subsequent section 0x82 0x1C BKND_ERR register 1 Description shown in subsequent section 0x02 0x1D–0x1F 1 Reserved(1) 0x20 Input MUX register 4 Description shown in subsequent section 0x0001 7772 0x21-0X24 4 Reserved(1) 0x25 PWM MUX register 4 Description shown in subsequent section 0x0102 1345 0x26–0x28 4 Reserved(1) 0x29 ch1_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2A ch1_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2B ch1_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 (1) Reserved registers should not be accessed. 34 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Table 4. Serial Control Interface Register Summary (continued) NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE 0x2C ch1_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2D ch1_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2E ch1_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x2F ch1_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x30 ch2_bq[0] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x31 ch2_bq[1] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x32 ch2_bq[2] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x33 ch2_bq[3] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x34 ch2_bq[4] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 35 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Table 4. Serial Control Interface Register Summary (continued) NO. OF INITIALIZATION SUBADDRESS REGISTER NAME CONTENTS BYTES VALUE 0x35 ch2_bq[5] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x36 ch2_bq[6] 20 u[31:26], b0[25:0] 0x0080 0000 u[31:26], b1[25:0] 0x0000 0000 u[31:26], b2[25:0] 0x0000 0000 u[31:26], a1[25:0] 0x0000 0000 u[31:26], a2[25:0] 0x0000 0000 0x37–0x39 Reserved(2) DRC ae(3) u[31:26], ae[25:0] 0x0080 0000 0x3A 8 DRC (1 – ae) u[31:26], (1 – ae)[25:0] 0x0000 0000 DRC aa u[31:26], aa[25:0] 0x0080 0000 0x3B 8 DRC (1 – aa) u[31:26], (1 – aa)[25:0] 0x0000 0000 DRC ad u[31:26], ad[25:0] 0x0080 0000 0x3C 8 DRC (1 – ad) u[31:26], (1 – ad)[25:0] 0x0000 0000 0x3D–0x3F Reserved(2) 0x40 DRC-T 4 T[31:0] (9.23 format) 0xFDA2 1490 0x41 DRC-K 4 u[31:26], K[25:0] 0x0384 2109 0x42 DRC-O 4 u[31:26], O[25:0] 0x0008 4210 0x43–0x45 Reserved(2) 0x46 DRC control 4 Description shown in subsequent section 0x0000 0000 0x47–0x4F Reserved(2) 0x50 Bank switch control 4 Description shown in subsequent section 0x0F70 8000 0x51–0xC9 Reserved(2) 0xCA 8 Reserved(2) 0xCB–0xF8 Reserved(2) Update device address 4 New Dev Id[7:1], ZERO[0] (New Dev Id = 0x38), 0x00000036 0xF9 register (7:1) defines the new device address 0xFA-0xFF Reserved(2) (2) Reserved registers should not be accessed. (3) "ae" stands for µ of energy filter, "aa" stands for µ of attack filter and "ad" stands for µ of decay filter and 1- µ = ω. All DAP coefficients are 3.23 format unless specified otherwise. 36 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 CLOCK CONTROL REGISTER (0x00) The clocks and data rates are automatically determined by the TAS5707. The clock control register contains the auto-detected clock status. Bits D7–D5 reflect the sample rate. Bits D4–D2 reflect the MCLK frequency. The device accepts a 64-fS or 32-fS SCLK rate for all MCLK rates, but accepts a 48-fS SCLK rate for MCLK rates of 192 fS and 384 fS only. Table 5. Clock Control Register (0x00) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 – – – – – fS = 32-kHz sample rate 0 0 1 – – – – – Reserved(1) 0 1 0 – – – – – Reserved(1) 0 1 1 – – – – – fS = 44.1/48-kHz sample rate (2) 1 0 0 – – – – – fs = 16-kHz sample rate 1 0 1 – – – – – fs = 22.05/24 -kHz sample rate 1 1 0 – – – – – fs = 8-kHz sample rate 1 1 1 – – – – – fs = 11.025/12 -kHz sample rate – – – 0 0 0 – – MCLK frequency = 64 × fS (3) – – – 0 0 1 – – MCLK frequency = 128 × fS (3) – – – 0 1 0 – – MCLK frequency = 192 × fS (4) – – – 0 1 1 – – MCLK frequency = 256 × fS (2) (5) – – – 1 0 0 – – MCLK frequency = 384 × fS – – – 1 0 1 – – MCLK frequency = 512 × fS – – – 1 1 0 – – Reserved(1) – – – 1 1 1 – – Reserved(1) – – – – – – 0 – Reserved(1) – – – – – – – 0 Reserved(1) (1) Reserved registers should not be accessed. (2) Default values are in bold. (3) Only available for 44.1 kHz and 48 kHz rates. (4) Rate only available for 32/44.1/48 KHz sample rates (5) Not available at 8 kHz DEVICE ID REGISTER (0x01) The device ID register contains the ID code for the firmware revision. Table 6. General Status Register (0x01) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION X – – – – – – – Reserved – 1 1 1 0 0 0 0 Identification code Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 37 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com ERROR STATUS REGISTER (0x02) The error bits are sticky and are not cleared by the hardware. This means that the software must clear the register (write zeroes) and then read them to determine if they are persistent errors. Error Definitions: • MCLK Error : MCLK frequency is changing. The number of MCLKs per LRCLK is changing. • SCLK Error: The number of SCLKs per LRCLK is changing. • LRCLK Error: LRCLK frequency is changing. • Frame Slip: LRCLK phase is drifting with respect to internal frame sync. Table 7. Error Status Register (0x02) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 1 - – – – – – – MCLK error – 1 – – – – – – PLL autolock error – – 1 – – – – – SCLK error – – – 1 – – – – LRCLK error – – – – 1 – – – Frame slip – – – – – – 1 – Overcurrent, overtemperature, overvoltage or undervoltage error – – – – – – – 1 Overtemperature warning (sets around 125°) 0 0 0 0 0 0 0 0 No errors (1) (1) Default values are in bold. SYSTEM CONTROL REGISTER 1 (0x03) The system control register 1 has several functions: Bit D7: If 0, the dc-blocking filter for each channel is disabled. If 1, the dc-blocking filter (–3 dB cutoff <1 Hz) for each channel is enabled (default). Bit D5: If 0, use soft unmute on recovery from clock error. This is a slow recovery. Unmute takes same time as volume ramp defined in reg 0X0E. If 1, use hard unmute on recovery from clock error (default). This is a fast recovery, a single step volume ramp Bits D1–D0: Select de-emphasis Table 8. System Control Register 1 (0x03) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 – – – – – – – PWM high-pass (dc blocking) disabled 1 – – – – – – – PWM high-pass (dc blocking) enabled (1) – 0 – – – – – – Reserved (1) – – 0 – – – – – Soft unmute on recovery from clock error – – 1 – – – – – Hard unmute on recovery from clock error (1) – – – 0 – – – – Reserved (1) – – – – 0 – – – Reserved (1) – – – – – 0 – – Reserved(1) – – – – – – 0 0 No de-emphasis (1) – – – – – – 0 1 De-emphasis for fS = 32 kHz – – – – – – 1 0 Reserved – – – – – – 1 1 De-emphasis for fS = 48 kHz (1) Default values are in bold. 38 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 SERIAL DATA INTERFACE REGISTER (0x04) As shown in Table 9, the TAS5707 supports 9 serial data modes. The default is 24-bit, I 2S mode, Table 9. Serial Data Interface Control Register (0x04) Format RECEIVE SERIAL DATA WORD D7–D4 D3 D2 D1 D0 INTERFACE FORMAT LENGTH Right-justified 16 0000 0 0 0 0 Right-justified 20 0000 0 0 0 1 Right-justified 24 0000 0 0 1 0 I 2S 16 000 0 0 1 1 I 2S 20 0000 0 1 0 0 I 2S (1) 24 0000 0 1 0 1 Left-justified 16 0000 0 1 1 0 Left-justified 20 0000 0 1 1 1 Left-justified 24 0000 1 0 0 0 Reserved 0000 1 0 0 1 Reserved 0000 1 0 1 0 Reserved 0000 1 0 1 1 Reserved 0000 1 1 0 0 Reserved 0000 1 1 0 1 Reserved 0000 1 1 1 0 Reserved 0000 1 1 1 1 (1) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 39 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com SYSTEM CONTROL REGISTER 2 (0x05) When bit D6 is set low, the system exits all channel shutdown and starts playing audio; otherwise, the outputs are shut down(hard mute). Table 10. System Control Register 2 (0x05) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 – – – – – – – Reserved (1) – 1 – – – – – – Enter all channel shut down (hard mute).(1) – 0 – – – – – – Exit all-channel shutdown (normal operation) – – 0 0 0 0 0 0 Reserved (1) (1) Default values are in bold. SOFT MUTE REGISTER (0x06) Writing a 1 to any of the following bits sets the output of the respective channel to 50% duty cycle (soft mute). Table 11. Soft Mute Register (0x06) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION – – – – – – – 1 Soft mute channel 1 – – – – – – – 0 Soft unmute channel 1 – – – – – – 1 – Soft mute channel 2 – – – – – – 0 – Soft unmute channel 2 0 0 0 0 0 0 – – Reserved 40 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 VOLUME REGISTERS (0x07, 0x08, 0x09) Step size is 0.5 dB. Master volume – 0x07 (default is mute) Channel-1 volume – 0x08 (default is 0 dB) Channel-2 volume – 0x09 (default is 0 dB) Table 12. Volume Registers (0x07, 0x08, 0x09) D D D D D D D D FUNCTION 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 0 24 dB 0 0 1 1 0 0 0 0 0 dB (default for individual channel volume) (1) 1 1 0 0 1 1 0 1 –78.5 dB 1 1 0 0 1 1 1 0 –79.0 dB 1 1 0 0 1 1 1 1 Values between 0xCF and 0xFE are Reserved 1 1 1 1 1 1 1 1 MUTE (default for master volume) (1) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 41 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com MASTER FINE VOLUME REGISTER (0x0A) This register can be used to provide precision tuning of master volume. Table 13. Master Fine Volume Register (0x0A) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION – – – – – – 0 0 0 dB (1) – – – – – – 0 1 0.125 dB – – – – – – 1 0 0.25 dB – – – – – – 1 1 0.375 dB 1 – – – – – – – Write enable bit 0 – – – – – – – Ignore Write to register 0X0A (1) Default values are in bold. VOLUME CONFIGURATION REGISTER (0x0E) Bits Volume slew rate (Used to control volume change and MUTE ramp rates). These bits control the D2–D0: number of steps in a volume ramp.Volume steps occur at a rate that depends on the sample rate of the I2S data as follows Sample Rate (KHz) Approximate Ramp Rate 8/16/32 125 us/step 11.025/22.05/44.1 90.7 us/step 12/24/48 83.3 us/step Table 14. Volume Control Register (0x0E) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 1 0 0 1 0 – – – Reserved (1) – – – – – 0 0 0 Volume slew 512 steps (43 ms volume ramp time at 48kHz) – – – – – 0 0 1 Volume slew 1024 steps (85 ms volume ramp time at 48kHz) (1) – – – – – 0 1 0 Volume slew 2048 steps (171 ms volume ramp time at 48kHz) – – – – – 0 1 1 Volume slew 256 steps (21ms volume ramp time at 48kHz) – – – – – 1 X X Reserved (1) Default values are in bold. 42 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 MODULATION LIMIT REGISTER (0x10) The modulation limit is the maximum duty cycle of the PWM output waveform. Table 15. Modulation Limit Register (0x10) D7 D6 D5 D4 D3 D2 D1 D0 MODULATION LIMIT – – – – – 0 0 0 99.2% – – – – – 0 0 1 98.4% – – – – – 0 1 0 97.7% – – – – – 0 1 1 96.9% – – – – – 1 0 0 96.1% – – – – – 1 0 1 95.3% – – – – – 1 1 0 94.5% – – – – – 1 1 1 93.8% 0 0 0 0 0 – – – RESERVED INTERCHANNEL DELAY REGISTERS (0x11, 0x12, 0x13, and 0x14) Internal PWM channels 1, 2, 1, and 2 are mapped into registers 0x11, 0x12, 0x13, and 0x14. Table 16. Channel Interchannel Delay Register Format BITS DEFINITION D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 0 0 0 – – Minimum absolute delay, 0 DCLK cycles 0 1 1 1 1 1 – – Maximum positive delay, 31 × 4 DCLK cycles 1 0 0 0 0 0 – – Maximum negative delay, –32 × 4 DCLK cycles 0 0 RESERVED SUBADDRESS D7 D6 D5 D4 D3 D2 D1 D0 Delay = (value) × 4 DCLKs 0x11 1 0 1 0 1 1 – – Default value for channel 1 (1) 0x12 0 1 0 1 0 1 – – Default value for channel 2 (1) 0x13 1 0 1 0 1 1 – – Default value for channel 1 (1) 0x14 0 1 0 1 0 1 – – Default value for channel 2 (1) (1) Default values are in bold. ICD settings have high impact on audio performance (e.g., dynamic range, THD, crosstalk etc.) Therefore, appropriate ICD settings must be used. By default, the device has ICD settings for AD mode. If used in BD mode, then update these registers before coming out of all-channel shutdown. REGISTER AD MODE BD MODE 0x11 0xAC 0xB8 0x12 0x54 0x60 0x13 0xAC 0xA0 0x14 0x54 0x48 Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 43 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com START/STOP PERIOD REGISTER (0x1A) This register is used to control the soft-start and soft-stop period following an enter/exit all channel shut down command or change in the PDN state. This helps reduce pops and clicks at start-up and shutdown.The times are only approximate and vary depending on device activity level and I2S clock stability. Table 17. Start/Stop Period Register (0x1A) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 – – – – – Reserved – – – 0 0 – – – No 50% duty cycle start/stop period – – – 0 1 0 0 0 16.5-ms 50% duty cycle start/stop period – – – 0 1 0 0 1 23.9-ms 50% duty cycle start/stop period – – – 0 1 0 1 0 31.4-ms 50% duty cycle start/stop period – – – 0 1 0 1 1 40.4-ms 50% duty cycle start/stop period – – – 0 1 1 0 0 53.9-ms 50% duty cycle start/stop period – – – 0 1 1 0 1 70.3-ms 50% duty cycle start/stop period – – – 0 1 1 1 0 94.2-ms 50% duty cycle start/stop period – – – 0 1 1 1 1 125.7-ms 50% duty cycle start/stop period(1) – – – 1 0 0 0 0 164.6-ms 50% duty cycle start/stop period – – – 1 0 0 0 1 239.4-ms 50% duty cycle start/stop period – – – 1 0 0 1 0 314.2-ms 50% duty cycle start/stop period – – – 1 0 0 1 1 403.9-ms 50% duty cycle start/stop period – – – 1 0 1 0 0 538.6-ms 50% duty cycle start/stop period – – – 1 0 1 0 1 703.1-ms 50% duty cycle start/stop period – – – 1 0 1 1 0 942.5-ms 50% duty cycle start/stop period – – – 1 0 1 1 1 1256.6-ms 50% duty cycle start/stop period – – – 1 1 0 0 0 1728.1-ms 50% duty cycle start/stop period – – – 1 1 0 0 1 2513.6-ms 50% duty cycle start/stop period – – – 1 1 0 1 0 3299.1-ms 50% duty cycle start/stop period – – – 1 1 0 1 1 4241.7-ms 50% duty cycle start/stop period – – – 1 1 1 0 0 5655.6-ms 50% duty cycle start/stop period – – – 1 1 1 0 1 7383.7-ms 50% duty cycle start/stop period – – – 1 1 1 1 0 9897.3-ms 50% duty cycle start/stop period – – – 1 1 1 1 1 13,196.4-ms 50% duty cycle start/stop period (1) Default values are in bold. 44 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 OSCILLATOR TRIM REGISTER (0x1B) The TAS5707 PWM processor contains an internal oscillator to support autodetect of I2S clock rates. This reduces system cost because an external reference is not required. Currently, TI recommends a reference resistor value of 18.2 kΩ (1%). This should be connected between OSC_RES and DVSSO. Writing 0X00 to reg 0X1B enables the trim that was programmed at the factory. Note that trim must always be run following reset of the device. Table 18. Oscillator Trim Register (0x1B) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 1 – – – – – – – Reserved (1) – 0 – – – – – – Oscillator trim not done (read-only) (1) – 1 – – – – – – Oscillator trim done (read only) – – 0 0 0 0 – – Reserved (1) – – – – – – 0 – Select factory trim (Write a 0 to select factory trim; default is 1.) – – – – – – 1 – Factory trim disabled (1) – – – – – – – 0 Reserved (1) (1) Default values are in bold. BKND_ERR REGISTER (0x1C) When a back-end error signal is received from the internal power stage, the power stage is reset stopping all PWM activity. Subsequently, the modulator waits approximately for the time listed in Table 19 before attempting to re-start the power stage. Table 19. BKND_ERR Register (0x1C)(1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 0 0 0 0 0 0 X Reserved – – – – 0 0 1 0 Set back-end reset period to 299 ms (2) – – – – 0 0 1 1 Set back-end reset period to 449 ms – – – – 0 1 0 0 Set back-end reset period to 598 ms – – – – 0 1 0 1 Set back-end reset period to 748 ms – – – – 0 1 1 0 Set back-end reset period to 898 ms – – – – 0 1 1 1 Set back-end reset period to 1047 ms – – – – 1 0 0 0 Set back-end reset period to 1197 ms – – – – 1 0 0 1 Set back-end reset period to 1346 ms – – – – 1 0 1 X Set back-end reset period to 1496 ms – – – – 1 1 X X Set back-end reset period to 1496 ms (1) This register can be written only with a "non-Reserved" value. Also this register can be written once after the reset. (2) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 45 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com INPUT MULTIPLEXER REGISTER (0x20) This register controls the modulation scheme (AD or BD mode) as well as the routing of I2S audio to the internal channels. Table 20. Input Multiplexer Register (0x20) D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 – – – – – – – Channel-1 AD mode 1 – – – – – – – Channel-1 BD mode – 0 0 0 – – – – SDIN-L to channel 1 (1) – 0 0 1 – – – – SDIN-R to channel 1 – 0 1 0 – – – – Reserved – 0 1 1 – – – – Reserved – 1 0 0 – – – – Reserved – 1 0 1 – – – – Reserved – 1 1 0 – – – – Ground (0) to channel 1 – 1 1 1 – – – – Reserved – – – – 0 – – – Channel 2 AD mode – – – – 1 – – – Channel 2 BD mode – – – – – 0 0 0 SDIN-L to channel 2 – – – – – 0 0 1 SDIN-R to channel 2 (1) – – – – – 0 1 0 Reserved – – – – – 0 1 1 Reserved – – – – – 1 0 0 Reserved – – – – – 1 0 1 Reserved – – – – – 1 1 0 Ground (0) to channel 2 – – – – – 1 1 1 Reserved D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 1 1 1 0 1 1 1 Reserved (1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 1 1 1 0 0 1 0 Reserved (1) (1) Default values are in bold. PWM OUTPUT MUX REGISTER (0x25) This DAP output mux selects which internal PWM channel is output to the external pins. Any channel can be output to any external output pin. Bits D21–D20: Selects which PWM channel is output to OUT_A Bits D17–D16: Selects which PWM channel is output to OUT_B Bits D13–D12: Selects which PWM channel is output to OUT_C Bits D09–D08: Selects which PWM channel is output to OUT_D Note that channels are enclosed so that channel 1 = 0x00, channel 2 = 0x01, channet 1 = 0x02, and channel 2 = 0x03. 46 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Table 21. PWM Output Mux Register (0x25) D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 0 0 0 0 0 0 1 Reserved(1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 0 – – – – – – Reserved(1) – – 0 0 – – – – Multiplex channel 1 to OUT_A (1) – – 0 1 – – – – Multiplex channel 2 to OUT_A – – 1 0 – – – – Multiplex channel 1 to OUT_A – – 1 1 – – – – Multiplex channel 2 to OUT_A – – – – 0 0 – – Reserved (1) – – – – – – 0 0 Multiplex channel 1 to OUT_B – – – – – – 0 1 Multiplex channel 2 to OUT_B – – – – – – 1 0 Multiplex channel 1 to OUT_B (1) – – – – – – 1 1 Multiplex channel 2 to OUT_B D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 0 – – – – – – Reserved (1) – – 0 0 – – – – Multiplex channel 1 to OUT_C – – 0 1 – – – – Multiplex channel 2 to OUT_C(1) – – 1 0 – – – – Multiplex channel 1 to OUT_C – – 1 1 – – – – Multiplex channel 2 to OUT_C – – – – 0 0 – – Reserved (1) – – – – – – 0 0 Multiplex channel 1 to OUT_D – – – – – – 0 1 Multiplex channel 2 to OUT_D – – – – – – 1 0 Multiplex channel 1 to OUT_D – – – – – – 1 1 Multiplex channel 2 to OUT_D (1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 1 0 0 0 1 0 1 RESERVED (1) Default values are in bold. DRC CONTROL (0x46) Each DRC can be enabled independently using the DRC control register. The DRCs are disabled by default. Table 22. DRC Control Register (0x46) D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 0 0 0 0 0 0 0 Reserved (1) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION – – – – – – – 0 DRC turned OFF (1) – – – – – – – 1 DRC turned ON 0 0 0 0 0 0 0 – Reserved (1) (1) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 47 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com BANK SWITCH AND EQ CONTROL (0x50) Table 23. Bank Switching Command D31 D30 D29 D28 D27 D26 D25 D24 FUNCTION 0 – – – – – – – 32 kHz, does not use bank 3 (1) 1 – – – – – – – 32 kHz, uses bank 3 – 0 – – – – – – Reserved(1) – – 0 – – – – – Reserved(1) – – – 0 – – – – 44.1/48 kHz, does not use bank 3 (1) – – – 1 – – – – 44.1/48 kHz, uses bank 3 – – – – 0 – – – 16 kHz, does not use bank 3 – – – – 1 – – – 16 kHz, uses bank 3 (1) – – – – – 0 – – 22.025/24 kHz, does not use bank 3 – – – – – 1 – – 22.025/24 kHz, uses bank 3 (1) – – – – – – 0 – 8 kHz, does not use bank 3 – – – – – – 1 – 8 kHz, uses bank 3 (1) – – – – – – – 0 11.025 kHz/12, does not use bank 3 – – – – – – – 1 11.025/12 kHz, uses bank 3 (1) D23 D22 D21 D20 D19 D18 D17 D16 FUNCTION 0 – – – – – – – 32 kHz, does not use bank 2 (1) 1 – – – – – – – 32 kHz, uses bank 2 – 1 – – – – – – Reserved (1) – – 1 – – – – – Reserved (1) – – – 0 – – – – 44.1/48 kHz, does not use bank 2 – – – 1 – – – – 44.1/48 kHz, uses bank 2 (1) – – – – 0 – – – 16 kHz, does not use bank 2 (1) – – – – 1 – – – 16 kHz, uses bank 2 – – – – – 0 – – 22.025/24 kHz, does not use bank 2 (1) – – – – – 1 – – 22.025/24 kHz, uses bank 2 – – – – – – 0 – 8 kHz, does not use bank 2 (1) – – – – – – 1 – 8 kHz, uses bank 2 – – – – – – – 0 11.025/12 kHz, does not use bank 2 (1) – – – – – – – 1 11.025/12 kHz, uses bank 2 D15 D14 D13 D12 D11 D10 D9 D8 FUNCTION 0 – – – – – – – 32 kHz, does not use bank 1 1 – – – – – – – 32 kHz, uses bank 1 (1) – 0 – – – – – – Reserved(1) – – 0 – – – – – Reserved(1) – – – 0 – – – – 44.1/48 kHz, does not use bank 1 (1) – – – 1 – – – – 44.1/48 kHz, uses bank 1 – – – – 0 – – – 16 kHz, does not use bank 1 (1) – – – – 1 – – – 16 kHz, uses bank 1 – – – – – 0 – – 22.025/24 kHz, does not use bank 1 (1) – – – – – 1 – – 22.025/24 kHz, uses bank 1 – – – – – – 0 – 8 kHz, does not use bank 1 (1) – – – – – – 1 – 8 kHz, uses bank 1 – – – – – – – 0 11.025/12 kHz, does not use bank 1 (1) – – – – – – – 1 11.025/12 kHz, uses bank 1 (1) Default values are in bold. 48 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A www.ti.com SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 Table 23. Bank Switching Command (continued) D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION 0 EQ ON 1 – – – – – – – EQ OFF (bypass BQ 0-6 of channels 1 and 2) – 0 – – – – – – Reserved (2) – – 0 – – – – – Ignore bank-mapping in bits D31–D8.Use default mapping. (2) 1 Use bank-mapping in bits D31–D8. – – – 0 – – – – L and R can be written independently. (2) L and R are ganged for EQ biquads; a write to Left channel BQ is – – – 1 – – – – also written to Right channel BQ. (0X29-2F is ganged to 0X30-0X36). – – – – 0 – – – Reserved (2) – – – – – 0 0 0 No bank switching. All updates to DAP (2) – – – – – 0 0 1 Configure bank 1 (32 kHz by default) – – – – – 0 1 0 Configure bank 2 (44.1/48 kHz by default) – – – – – 0 1 1 Configure bank 3 (other sample rates by default) – – – – – 1 0 0 Automatic bank selection – – – – – 1 0 1 Reserved – – – – – 1 1 X Reserved (2) Default values are in bold. Copyright © 2008–2009, Texas Instruments Incorporated Submit Documentation Feedback 49 Product Folder Link(s): TAS5707 TAS5707A TAS5707, TAS5707A SLOS556B –NOVEMBER 2008–REVISED NOVEMBER 2009 www.ti.com Changes from Revision A (November 2008) to Revision B Page • Added TAS5707A device to data sheet ................................................................................................................................ 1 • Changed PVDD maximum voltage to 26 V in Features ....................................................................................................... 1 • Added Applications section ................................................................................................................................................... 1 • Inserted paragraph on TAS5707A into Description section .................................................................................................. 1 • Changed PVDD maximum voltage to 26 V in simplified application diagram ...................................................................... 2 • Changed PVDD maximum voltage to 26 V in recommended operating conditions ............................................................. 7 • Added AVDD to output voltage test conditions ..................................................................................................................... 9 • Added rows to Electrical Characteristics fro OTW and OTW ............................................................................................... 9 • Changed OLPC typical value to 0.63 ms. ............................................................................................................................. 9 • Replaced text of Overtemperature Protection section ........................................................................................................ 18 • Added address information for the TAS5707A ................................................................................................................... 25 • Revised Sample Calculation for 3.23 Format table ............................................................................................................ 30 • Added 0xCA row to Register Summary table ..................................................................................................................... 36 • Revised 0xF9 row of Register Summary table ................................................................................................................... 36 • Corrected temperature from 145°C to 125°C ..................................................................................................................... 38 • Changed de-emphasis settings in register 0x03 table ........................................................................................................ 38 • Added text to Modulationi Limit Register section ................................................................................................................ 43 • Added text to the DRC Control section ............................................................................................................................... 47 50 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TAS5707 TAS5707A PACKAGE OPTION ADDENDUM www.ti.com 9-Sep-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples TAS5707APHP ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707A TAS5707APHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707A TAS5707PHP ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707 TAS5707PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR 0 to 85 TAS5707 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant TAS5707APHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 TAS5707APHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 TAS5707PHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2014 Pack Materials-Page 1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TAS5707APHPR HTQFP PHP 48 1000 367.0 367.0 38.0 TAS5707APHPR HTQFP PHP 48 1000 336.6 336.6 31.8 TAS5707PHPR HTQFP PHP 48 1000 336.6 336.6 31.8 PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2014 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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B2 1 www.fairchildsemi.com FDS6679AZ P-Channel PowerTrench® MOSFET -30V, -13A, 9mΩ General Description This P-Channel MOSFET is producted using Fairchild Semiconductor’s advanced PowerTrench process that has been especially tailored to minimize the on-state resistance. This device is well suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs. Features Max rDS(on) = 9.3mΩ at VGS = -10V, ID = -13A Max rDS(on) = 14.8mΩ at VGS = -4.5V, ID = -11A Extended VGS range (-25V) for battery applications HBM ESD protection level of 6kV typical (note 3) High performance trench technology for extremely low rDS(on) High power and current handing capability RoHS Compliant S D S S SO-8 D D D G 1 7 5 2 8 4 6 3 MOSFET Maximum Ratings TA = 25°C unless otherwise noted Thermal Characteristics Package Marking and Ordering Information Symbol Parameter Ratings Units VDS Drain to Source Voltage -30 V VGS Gate to Source Voltage ±25 V ID Drain Current -Continuous (Note 1a) -13 A -Pulsed -65 PD Power Dissipation for Single Operation (Note 1a) 2.5 (Note 1b) 1.2 W (Note 1c) 1.0 TJ, TSTG Operating and Storage Temperature -55 to +150 °C RθJA Thermal Resistance , Junction to Ambient (Note 1a) 50 °C/W RθJC Thermal Resistance , Junction to Case (Note 1) 25 °C/W Device Marking Device Reel Size Tape Width Quantity FDS6679AZ FDS6679AZ 13’’ 12mm 2500 units FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com FDS6679AZ Rev. B2 Electrical Characteristics T J = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source Breakdown Voltage I D = -250 µA, VGS = 0V -30 V ∆ BVDSS ∆ T J Breakdown Voltage Temperature Coefficient I D = -250 µA, referenced to 25 ° C -20 mV/°C IDSS Zero Gate Voltage Drain Current VDS = -24V, VGS=0V -1 µ A IGSS Gate to Source Leakage Current VGS = ±25V, VDS=0V ±10 µ A On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, I D = -250 µ A -1 -1.9 -3 V ∆ VGS(th) ∆ T J Gate to Source Threshold Voltage Temperature Coefficient I D = -250 µA, referenced to 25°C 6.5 mV/°C rDS(on) Drain to Source On Resistance VGS = -10V, I D = -13A 7.7 9.3 m Ω VGS = -4.5V, I D = -11A 11.8 14.8 VGS = -10V, I D = -13A, T J = 125 ° C 10.7 13.4 gFS Forward Transconductance VDS = -5V, I D = -13A 55 S (Note 2) Dynamic Characteristics Ciss Input Capacitance VDS = -15V, VGS = 0V, f = 1MHz 2890 3845 pF Coss Output Capacitance 500 665 pF Crss Reverse Transfer Capacitance 495 745 pF Switching Characteristics (Note 2) td(on) Turn-On Delay Time VDD = -15V, I D = -1A VGS = -10V, RGS = 6 Ω 13 24 ns t r Rise Time 15 27 ns td(off) Turn-Off Delay Time 210 336 ns tf Fall Time 92 148 ns Qg Total Gate Charge VDS = -15V, VGS = -10V, ID = -13A 68 96 nC Qg Total Gate Charge VDS = -15V, VGS = -5V, ID = -13A 38 54 nC Qgs Gate to Source Gate Charge 10 nC Qgd Gate to Drain Charge 17 nC Drain-Source Diode Characteristic VSD Source to Drain Diode Forward Voltage VGS = 0V, I S = -2.1A -0.7 -1.2 V trr Reverse Recovery Time I F = -13A, di/dt = 100A/ µ s 40 ns Qrr Reverse Recovery Charge I F = -13A, di/dt = 100A/ µ s -31 nC Notes: 1: R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while R θCA is determined by the user’s board design. Scale 1 : 1 on letter size paper 2: Pulse Test:Pulse Width <300 µs, Duty Cycle <2.0% 3: The diode connected between the gate and source serves only as protection against ESD. No gate overvoltage rating is implied. a) 50 °C/W when mounted on a 1 in 2 pad of 2 oz copper b)105 °C/W when mounted on a .04 in 2 pad of 2 oz copper minimun pad c) 125 °C/W when mounted on a FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com FDS6679AZ Rev. B2 Typical Characteristics T J = 25°C unless otherwise noted Figure 1. On Region Characteristics 01234 0 10 20 30 40 50 60 70 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX VGS = -5V VGS = -4V VGS = -3V VGS = -3.5V VGS = -4.5V VGS = -10V -ID, DRAIN CURRENT (A) -VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 2. Normalized 0 10 20 30 40 50 60 70 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX NORMALIZED DRAIN TO SOURCE ON-RESISTANCE -I D, DRAIN CURRENT(A) VGS = -10V VGS = -5V VGS = -4.5V VGS = -4V VGS = -3.5V On-Resistance vs Drain Current and Gate Voltage Figure 3. -80 -40 0 40 80 120 160 0.6 0.8 1.0 1.2 1.4 1.6 I D = -13A VGS = -10V NORMALIZED DRAIN TO SOURCE ON-RESISTANCE T J, JUNCTION TEMPERATURE ( o C ) Normalized On Resistance vs Junction Temperature Figure 4. 3.0 4.5 6.0 7.5 9.0 0 10 20 30 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX TJ = 150oC TJ = 25oC ID = -13A rDS(on), DRAIN TO SOURCE ON-RESISTANCE (mΩ) -VGS, GATE TO SOURCE VOLTAGE (V) 10 On-Resistance vs Gate to Source Voltage Figure 5. Transfer Characteristics 2.0 2.5 3.0 3.5 4.0 4.5 0 10 20 30 40 50 60 70 PULSE DURATION = 80 µ s DUTY CYCLE = 0.5%MAX T J = -55 o C T J = 25 o C TJ = 150 o C -ID, DRAIN CURRENT (A) -VGS, GATE TO SOURCE VOLTAGE (V) Figure 6. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1E-3 0.01 0.11 10 100 T J = -55 o C T J = 25 o C TJ = 150 o C VGS = 0V -IS, REVERSE DRAIN CURRENT (A) -VSD, BODY DIODE FORWARD VOLTAGE (V) Source to Drain Diode Forward Voltage vs Source Current FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com FDS6679AZ Rev. B2 Figure 7. 0 15 30 45 60 75 02468 10 VDD = -20V VDD = -10V -VGS, GATE TO SOURCE VOLTAGE(V) Q g, GATE CHARGE(nC) VDD = -15V Gate Charge Characteristics Figure 8. 0.1 1 10 100 1000 10000 f = 1MHz VGS = 0V CAPACITANCE (pF) -VDS, DRAIN TO SOURCE VOLTAGE (V) Crss Coss Ciss 30 Capacitance vs Drain to Source Voltage Figure 9. I g vs VGS 0 5 10 15 20 25 30 35 1E-4 1E-3 0.01 0.11 10 100 1000 TJ = 150 o CT J = 25 o C -Ig(uA) -VGS(V) Figure 10. 10-2 10-1 10 0 10 1 10 2 1 10 TJ = 25 o C TJ = 125 o C -IAS, AVALANCHE CURRENT(A) 20 t AV, TIME IN AVALANCHE(ms) Unclamped Inductive Switching Capability Figure 11. 25 50 75 100 125 150 02468 10 12 14 16 VGS = -10V VGS = -4.5V -ID, DRAIN CURRENT (A) TA, AMBIENT TEMPERATURE ( o C ) Maximum Continuous Drain Current vs Ambient Temperature Figure 12. Forward Bias Safe Operating Area 0.01 0.1 1 10 100 0.01 0.11 10 100 100 us 1 s 10 s DC 100 ms 10 ms 1 ms ID, DRAIN CURRENT (A) VDS, DRAIN to SOURCE VOLTAGE (V) THIS AREA IS LIMITED BY rDS(on) SINGLE PULSE TJ = MAX RATED RθJA = 125 o C/W TA = 25 o C 200 Typical Characteristics T J = 25°C unless otherwise noted FDS6679AZ P-Channel PowerTrench® MOSFET ©2009 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com FDS6679AZ Rev. B2 Figure 13. 10-4 10-3 10-2 10-1 1 10 10 2 10 3 0.51 10 10 2 10 3 10 4 SINGLE PULSE RθJA = 125 o C/W TA = 25 o C VGS = -10 V P(PK), PEAK TRANSIENT POWER (W) t, PULSE WIDTH (sec) Single Pulse Maximum Power Dissipation Figure 14. 10-4 10-3 10-2 10-1 1 10 10 2 10 3 10-4 10-3 10-2 10-11 SINGLE PULSE RθJA = 125 o C/W DUTY CYCLE-DESCENDING ORDER NORMALIZED THERMAL IMPEDANCE, ZθJA t, RECTANGULAR PULSE DURATION (sec) D = 0.5 0.2 0.1 0.05 0.02 0.01 2 PDM t 1 t 2 NOTES: DUTY FACTOR: D = t 1/t 2 PEAK T J = PDM x Z θJA x R θJA + TA Junction-to-Ambient Transient Thermal Response Curve Typical Characteristics T J = 25°C unless otherwise noted 6 www.fairchildsemi.com FDS6679AZ P-Channel PowerTrench ® MOSFET ©2009 Fairchild Semiconductor Corporation FDS6679AZ Rev. B2 Rev. I39 TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EfficentMax™ EZSWITCH™ * ™ Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter® * FPS™ F-PFS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™ e-Series™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® PDP SPM™ Power-SPM™ PowerTrench® PowerXS™ Programmable Active Droop™ QFET® QS™ Quiet Series™ RapidConfigure™ ™ Saving our world, 1mW /W /kW at a time™ SmartMax™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ ® The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™* µSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™ tm ® tm tm Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. 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Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC32 － Plastic Film Capacitors Metallized Polyester Film Capacitor Type:ECQE(F) Non-inductive construction using metallized Polyester film with flame retardant epoxy resin coating ■Features •Self-healing property •Excellent electrical characteristics •Flame retardant epoxy resin coating •RoHS directive compliant ■Recommended Applications •General purpose usage ❈Please contact us when applications are CD , ignitor etc. ■Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E C Q E Product code Dielectric & construction Rated volt. Capacitance F Cap. Tol. Suffix Suffix 1 2 4 6 100 VDC 250 VDC 400 VDC 630 VDC 10 12 1A 2A 1000 VDC 1250 VDC 125 VAC 250 VAC J K ±5 % ±10 % E C Q E Product code Dielectric & construction Rated volt. Capacitance R F Suffix Cap. Tol. Suffix ■Specifications ●Explanation of Part Number for Odd Size Taping Category temp. range (Including temperature-rise on unit surface) Rated voltage Capacitance range Capacitance tolerance Dissipation factor (tan ) Withstand voltage Insulation resistance (IR) 100 VDC, 250 VDC,400 VDC, 630 VDC, 1000 VDC, 1250 VDC, 125 VAC, 250 VAC –40 ˚C to +105 ˚C –40 ˚C to +105 ˚C 100 VDC, 250 VDC, 400 VDC, 630 VDC, 1000 VDC, 1250 VDC, (Derating of rated voltage by 1.25 %/˚C at more than 85 ˚C) 125 VAC, 250 VAC 0.0010 µF to 10 µF (E12) ±5 %(J), ±10 %(K) tan <=1.0 % (20 ˚C, 1 kHz) •Rated volt. 100 V to 630 VDC Between terminals : Rated volt.(VDC)✕150 % 60 s •Rated volt. 1000 VDC, 1250 VDC Between terminals : Rated volt. (VDC)✕175 % 2 s to 5 s or 1000 VAC 60 s Between terminals to enclosure : 1500 VAC 60 s •Rated volt. 125 VAC, 250 VAC Between terminals : Rated volt.(VAC)✕230 % 60 s Between terminals to enclosure : 1500 VAC 60 s 100 V to 630 VDC: C <= 0.33 µF : IR>=9000 MΩ (20 ˚C, 100 VDC, 60 s) C > 0.33 µF : IR>=3000 MΩ . µF 1000 VDC, 1250 VDC: IR>=10000 MΩ (20 ˚C, 100 VDC, 60 s) IR>=2000 MΩ (20 ˚C, 500 VDC, 60 s) 125 VAC, 250 VAC: C <= 0.47 µF : IR>=2000 MΩ (20 ˚C, 500 VDC, 60 s) C > 0.47 µF : IR>=3000 MΩ . µF (20 ˚C, 100 VDC, 60 s) ❈ In case of applying voltage in alternating current (50 Hz or 60 Hz sine wave) to a capacitor with DC rated voltage, please refer to the page of “Permissible voltage (R.M.S) in alternating current corresponding to DC rated voltage”. ❈ Voltage to be applied to ECQE1A (F) & ECQE2A (F) is only sine wave (50 Hz or 60 Hz). Suffix Blank B Z 3 6 Lead Form Straight Crimped lead Cut lead Crimped taping (Ammo) Crimped taping (Ammo) p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 32 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC33 － Plastic Film Capacitors ■Dimensions in mm (not to scale) Cut lead ■Packaging Specifications for Bulk Package Packing quantity:100 pcs./bag ■Taping Specifications for Automatic Insertion ●Taping style ❈Refer to the page of taping specifications. 100 VDC 250 VDC 400 VDC 630 VDC 1000 VDC 1250 VDC 125 VAC 250 VAC ECQE (F) AD AS AB BCD E 0.56 to 0.68 ○ Ammo ( ) F3 0.82 to 1.0 ○ Ammo ( ) F3 1.2 to 3.3 ○ Ammo ( ) F3 1.2 to 3.3 ○ Ammo R( ) F 0.010 to 0.27 ○ Ammo ( ) F3 0.33 ○ Ammo ( ) F3 0.39 to 1.5 ○ Ammo ( ) F3 0.010 to 0.33 ○ Ammo R( ) F 0.39 to 1.5 ○ Ammo R( ) F 0.010 to 0.10 ○ Ammo ( ) F3 0.12 to 0.47 ○ Ammo ( ) F3 0.010 to 0.10 ○ Ammo R( ) F 0.12 to 0.47 ○ Ammo R( ) F 0.0010 to 0.033 ○ Ammo ( ) F3 0.039 to 0.047 ○ Ammo ( ) F3 0.056 to 0.22 ○ Ammo ( ) F3 0.0010 to 0.047 ○ Ammo R( ) F 0.056 to 0.22 ○ Ammo R( ) F 0.010 to 0.10 ○ Ammo R( ) F 0.0010 to 0.022 ○ Ammo R( ) F 0.010 to 0.068 ○ Ammo ( ) F6 0.010 to 0.068 ○ Ammo R( ) F 0.010 to 0.033 ○ Ammo ( ) F6 0.010 to 0.047 ○ Ammo R( ) F 0.056 to 0.22 ○ Ammo R( ) F ●Packaging Specifications Cap. range (µF) Taping style Type Rated volt. Packing suffix Style AD AB B C D E Lead Spacing 5.0 mm 5.0 mm 5.0 mm 5.0 mm 7.5 mm 7.5 mm ❈See the column “Rating, Dimensions & Quantity Box” for packing quantity. ●Lead Spacing Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 33 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC34 － Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 250 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K) Style D: 0.010 µF to 0.33 µF Style B: 0.39 µF to 10.0 µF Suffix for lead crimped or taped type Cap. tol. code ▲ ▲ Suffix for lead crimped or taped type Cap. tol. code ▲ ▲ ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 100 VDC, Capacitance tolerance : ± 5 %(J), ±10 %(K) 0.56 12.0 5.5 10.9 15.9 10.0 10.0 1.0 0.60 0.68 12.0 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.82 12.0 6.0 13.5 18.5 10.0 10.0 1.0 0.60 1.0 12.0 6.7 14.0 19.0 10.0 10.0 1.0 0.60 1.2 18.5 5.5 12.8 17.8 15.0 10.0 1.0 0.60 1.5 18.5 6.0 13.4 18.4 15.0 10.0 1.0 0.80 1.8 18.5 6.5 14.4 19.4 15.0 10.0 1.0 0.80 2.2 18.5 7.0 15.0 20.0 15.0 10.0 1.0 0.80 2.7 18.5 8.0 15.8 20.8 15.0 10.0 1.0 0.80 3.3 18.5 8.5 16.5 21.5 15.0 10.0 1.0 0.80 3.9 26.0 7.0 16.4 21.4 22.5 15.0 1.0 0.80 4.7 26.0 7.5 17.0 22.0 22.5 15.0 1.0 0.80 5.6 26.0 8.3 17.5 22.5 22.5 15.0 1.0 0.80 6.8 26.0 9.0 18.5 23.5 22.5 15.0 1.0 0.80 8.2 26.0 10.0 20.0 25.0 22.5 15.0 1.5 0.80 10.0 26.0 11.5 21.0 26.0 22.5 15.0 1.5 0.80 Part No. Cap. (µF) Min. order Q'ty Taping 500 － － － － Dimensions (mm) L max. T max. Standard 5 mm Odd size 5 mm Odd size 7.5 mm ø d ECQE1564□F( ) ECQE1684□F( ) ECQE1824□F( ) ECQE1105□F( ) ECQE1125□F( ) ECQE1155□F( ) ECQE1185□F( ) ECQE1225□F( ) ECQE1275□F( ) ECQE1335□F( ) ECQE1395□F( ) ECQE1475□F( ) ECQE1565□F( ) ECQE1685□F( ) ECQE1825□F( ) ECQE1106□F( ) 500 1,000 400 400 500 600 － H max. Straight Crimped lead Straight F Crimped lead S Straight G max. Bulk 500 style D: 0.056 µF to 1.0 µF style B: 1.2 µF to 10.0 µF Part No. Cap. (µF) Dimensions (mm) L max. T max. ø d ECQE2103□F( ) 0.010 10.3 4.3 7.4 12.4 7.5 7.5 1.0 0.60 ECQE2123□F( ) 0.012 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2153□F( ) 0.015 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2183□F( ) 0.018 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2223□F( ) 0.022 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2273□F( ) 0.027 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2333□F( ) 0.033 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2393□F( ) 0.039 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2473□F( ) 0.047 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2563□F( ) 0.056 10.3 4.8 7.9 12.9 7.5 7.5 1.0 0.60 ECQE2683□F( ) 0.068 10.3 4.5 7.5 12.5 7.5 7.5 1.0 0.60 ECQE2823□F( ) 0.082 10.3 4.9 8.0 13.0 7.5 7.5 1.0 0.60 ECQE2104□F( ) 0.10 10.3 5.8 8.4 13.4 7.5 7.5 1.0 0.60 ECQE2124□F( ) 0.12 10.3 6.0 9.0 14.0 7.5 7.5 1.0 0.60 ECQE2154□F( ) 0.15 10.3 6.0 10.8 15.8 7.5 7.5 1.0 0.60 ECQE2184□F( ) 0.18 12.0 5.0 10.3 15.3 10.0 10.0 1.0 0.60 ECQE2224□F( ) 0.22 12.0 5.5 10.5 15.5 10.0 10.0 1.0 0.60 ECQE2274□F( ) 0.27 12.0 6.0 11.5 16.5 10.0 10.0 1.0 0.60 ECQE2334□F( ) 0.33 12.0 6.5 12.0 17.0 10.0 10.0 1.0 0.60 ECQE2394□F( ) 0.39 18.5 4.9 12.0 17.0 15.0 10.0 1.0 0.60 ECQE2474□F( ) 0.47 18.5 5.3 12.5 17.5 15.0 10.0 1.0 0.60 ECQE2564□F( ) 0.56 18.5 5.5 13.0 18.0 15.0 10.0 1.0 0.60 ECQE2684□F( ) 0.68 18.5 6.0 13.5 18.5 15.0 10.0 1.0 0.80 ECQE2824□F( ) 0.82 18.5 6.5 14.5 19.5 15.0 10.0 1.0 0.80 ECQE2105□F( ) 1.0 18.5 7.4 15.0 20.0 15.0 10.0 1.0 0.80 ECQE2125□F( ) 1.2 18.5 8.0 15.9 20.9 15.0 10.0 1.0 0.80 ECQE2155□F( ) 1.5 18.5 9.0 16.8 21.8 15.0 10.0 1.0 0.80 ECQE2185□F( ) 1.8 26.0 7.5 15.5 20.5 22.5 15.0 1.0 0.80 ECQE2225□F( ) 2.2 26.0 8.5 16.3 21.3 22.5 15.0 1.0 0.80 ECQE2275□F( ) 2.7 26.0 9.4 17.0 22.0 22.5 15.0 1.0 0.80 ECQE2335□F( ) 3.3 26.0 10.3 18.0 23.0 22.5 15.0 1.5 0.80 ECQE2395□F( ) 3.9 26.0 11.0 20.5 25.5 22.5 15.0 1.5 0.80 ECQE2475□F( ) 4.7 26.0 12.0 21.5 26.5 22.5 15.0 1.5 0.80 ECQE2565□F( ) 5.6 31.0 11.8 21.0 26.0 27.5 22.5 1.5 0.80 ECQE2685□F( ) 6.8 31.0 13.0 22.4 27.4 27.5 22.5 1.5 0.80 ECQE2825□F( ) 8.2 31.0 14.3 23.5 28.5 27.5 22.5 1.5 0.80 ECQE2106□F( )10.0 31.0 15.9 25.8 30.8 27.5 22.5 1.5 0.80 1000 － － 1000 500 500 1000 400 500 400 300 － － H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 34 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC35 － Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 400 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K) style D:0.010 µF to 0.10 µF style B:0.12 µF to 2.2 µF Suffix for lead crimped or taped type Cap. tol. code ▲ ▲ Part No. 0.010 10.3 4.3 7.4 12.4 7.5 7.5 1.0 0.60 0.012 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.015 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.018 10.3 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.022 10.3 4.8 7.9 12.9 7.5 7.5 1.0 0.60 0.027 10.3 5.5 8.0 13.0 7.5 7.5 1.0 0.60 0.033 10.3 6.0 9.0 14.0 7.5 7.5 1.0 0.60 0.039 12.0 4.9 8.0 13.0 10.0 10.0 1.0 0.60 0.047 12.0 5.0 8.3 13.3 10.0 10.0 1.0 0.60 0.056 12.0 5.0 10.0 15.0 10.0 10.0 1.0 0.60 0.068 12.0 5.4 10.5 15.5 10.0 10.0 1.0 0.60 0.082 12.0 5.8 11.0 16.0 10.0 10.0 1.0 0.60 0.10 12.0 6.3 12.0 17.0 10.0 10.0 1.0 0.60 0.12 18.5 5.0 10.0 15.0 15.0 10.0 1.0 0.60 0.15 18.5 5.0 12.4 17.4 15.0 10.0 1.0 0.60 0.18 18.5 5.4 12.5 17.5 15.0 10.0 1.0 0.60 0.22 18.5 5.9 13.0 18.0 15.0 10.0 1.0 0.60 0.27 18.5 6.5 14.3 19.3 15.0 10.0 1.0 0.80 0.33 18.5 7.0 14.9 19.9 15.0 10.0 1.0 0.80 0.39 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80 0.47 18.5 7.8 17.0 22.0 15.0 10.0 1.0 0.80 0.56 26.0 6.5 16.0 21.0 22.5 15.0 1.0 0.80 0.68 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80 0.82 26.0 7.9 17.3 22.3 22.5 15.0 1.0 0.80 1.0 26.0 8.5 18.0 23.0 22.5 15.0 1.0 0.80 1.2 26.0 9.5 18.9 23.9 22.5 15.0 1.0 0.80 1.5 31.0 9.5 19.0 24.0 27.5 22.5 1.0 0.80 1.8 31.0 11.0 20.5 25.5 27.5 22.5 1.5 0.80 2.2 31.0 11.0 22.0 27.0 27.5 22.5 1.5 0.80 ECQE4103□F( ) ECQE4123□F( ) ECQE4153□F( ) ECQE4183□F( ) ECQE4223□F( ) ECQE4273□F( ) ECQE4333□F( ) ECQE4393□F( ) ECQE4473□F( ) ECQE4563□F( ) ECQE4683□F( ) ECQE4823□F( ) ECQE4104□F( ) ECQE4124□F( ) ECQE4154□F( ) ECQE4184□F( ) ECQE4224□F( ) ECQE4274□F( ) ECQE4334□F( ) ECQE4394□F( ) ECQE4474□F( ) ECQE4564□F( ) ECQE4684□F( ) ECQE4824□F( ) ECQE4105□F( ) ECQE4125□F( ) ECQE4155□F( ) ECQE4185□F( ) ECQE4225□F( ) Cap. (µF) 1000 500 － － 500 500 400 － － 1000 Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 35 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC36 － Plastic Film Capacitors ●Rated voltage : 630 VDC, Capacitance tolerance : ±5 %(J), ±10 %(K) Suffix for lead crimped or taped type. Cap. tol. code ▲ ▲ style D:0.010 µF to 0.047 µF style B:0.0010 µF to 0.0082 µF, 0.056 µF to 2.2 µF Part No. 0.0010 10.0 4.5 9.5 14.5 7.5 5.0 1.0 0.60 0.0012 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0015 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0018 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0022 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0027 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0033 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0039 10.0 4.5 10.0 15.0 7.5 5.0 1.0 0.60 0.0047 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60 0.0056 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60 0.0068 12.0 4.9 10.0 15.0 10.0 7.5 1.0 0.60 0.0082 12.0 4.5 10.0 15.0 10.0 7.5 1.0 0.60 0.010 12.0 4.5 7.5 12.5 10.0 10.0 1.0 0.60 0.012 12.0 4.5 7.8 12.8 10.0 10.0 1.0 0.60 0.015 12.0 5.0 8.2 13.2 10.0 10.0 1.0 0.60 0.018 12.0 4.9 10.0 15.0 10.0 10.0 1.0 0.60 0.022 12.0 5.3 10.5 15.5 10.0 10.0 1.0 0.60 0.027 12.0 5.5 10.9 15.9 10.0 10.0 1.0 0.60 0.033 12.0 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.039 12.0 6.0 13.4 18.4 10.0 10.0 1.0 0.60 0.047 12.0 6.5 13.5 18.5 10.0 10.0 1.0 0.60 0.056 18.5 5.4 10.5 15.5 15.0 10.0 1.0 0.60 0.068 18.5 5.8 11.0 16.0 15.0 10.0 1.0 0.60 0.082 18.5 6.5 12.0 17.0 15.0 10.0 1.0 0.60 0.10 18.5 6.3 14.0 19.0 15.0 10.0 1.0 0.60 0.12 18.5 6.3 14.5 19.5 15.0 10.0 1.0 0.80 0.15 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80 0.18 18.5 8.0 16.0 21.0 15.0 10.0 1.0 0.80 0.22 18.5 9.0 16.5 21.5 15.0 10.0 1.0 0.80 0.27 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80 0.33 26.0 7.8 17.0 22.0 22.5 15.0 1.0 0.80 0.39 26.0 8.5 17.9 22.9 22.5 15.0 1.0 0.80 0.47 26.0 9.3 18.5 23.5 22.5 15.0 1.0 0.80 0.56 26.0 10.0 20.0 25.0 22.5 15.0 1.5 0.80 0.68 26.0 11.5 21.0 26.0 22.5 15.0 1.5 0.80 0.82 31.0 11.3 20.5 25.5 27.5 22.5 1.5 0.80 1.0 31.0 12.5 21.9 26.9 27.5 22.5 1.5 0.80 1.2 31.0 13.5 23.0 28.0 27.5 22.5 1.5 0.80 1.5 31.0 15.3 24.7 29.7 27.5 22.5 1.5 0.80 1.8 31.0 16.8 27.0 32.0 27.5 22.5 1.5 0.80 2.2 31.0 19.5 29.0 34.0 27.5 22.5 1.5 0.80 ECQE6102□F( ) ECQE6122□F( ) ECQE6152□F( ) ECQE6182□F( ) ECQE6222□F( ) ECQE6272□F( ) ECQE6332□F( ) ECQE6392□F( ) ECQE6472□F( ) ECQE6562□F( ) ECQE6682□F( ) ECQE6822□F( ) ECQE6103□F( ) ECQE6123□F( ) ECQE6153□F( ) ECQE6183□F( ) ECQE6223□F( ) ECQE6273□F( ) ECQE6333□F( ) ECQE6393□F( ) ECQE6473□F( ) ECQE6563□F( ) ECQE6683□F( ) ECQE6823□F( ) ECQE6104□F( ) ECQE6124□F( ) ECQE6154□F( ) ECQE6184□F( ) ECQE6224□F( ) ECQE6274□F( ) ECQE6334□F( ) ECQE6394□F( ) ECQE6474□F( ) ECQE6564□F( ) ECQE6684□F( ) ECQE6824□F( ) ECQE6105□F( ) ECQE6125□F( ) ECQE6155□F( ) ECQE6185□F( ) ECQE6225□F( ) Cap. (µF) 1000 － 1000 500 400 300 1000 500 400 － － 500 － Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 36 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC37 － Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 1000 VDC, Note) 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) Note) This type has two rated voltage, one is DC rated voltage another is AC rated voltage.. DC rated voltage is 1000 V, AC rated voltage is 125 V. Making for rated voltage is「1000 V, 125 V 」 When capacitors use in secondary side of power source, and in case of applying voltage in altering current (50 Hz or 60 Hz sine wave) to a capacitor, please refer to the page of ''Permissible voltage (R.M.S) in altering current corresponding to DC rated voltage''. When capacitors use in primary side of power source, the rated voltage is shown 125 VAC. Voltage to be applied to capacitors in only sine wave (50 Hz or 60 Hz). AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. And not complying with clause 2 of ''Electrical Appliance and Material Safety Law'', in this case please use ECQUL type or ECQUG type Part No. 0.010 15.5 6.0 11.0 16.0 12.5 12.5 1.0 0.60 0.012 15.5 6.0 12.0 17.0 12.5 12.5 1.0 0.60 0.015 15.5 7.0 12.5 17.5 12.5 12.5 1.0 0.60 0.018 15.5 7.5 13.0 20.0 12.5 12.5 1.0 0.80 0.022 15.5 7.5 15.5 22.5 12.5 12.5 1.0 0.80 0.027 21.0 6.0 13.0 18.0 17.5 12.5 1.0 0.80 0.033 21.0 6.5 14.0 19.0 17.5 12.5 1.0 0.80 0.039 21.0 7.0 14.5 19.5 17.5 12.5 1.0 0.80 0.047 21.0 7.5 15.5 20.5 17.5 12.5 1.0 0.80 0.056 21.0 7.5 17.0 22.0 17.5 12.5 1.0 0.80 0.068 21.0 8.5 18.0 23.0 17.5 12.5 1.0 0.80 0.082 21.0 9.0 18.5 23.5 17.5 12.5 1.0 0.80 0.10 21.0 10.0 20.0 25.0 17.5 12.5 1.0 0.80 0.12 26.0 9.0 18.5 23.5 22.5 17.5 1.0 0.80 0.15 26.0 10.0 20.0 25.0 22.5 17.5 1.5 0.80 0.18 26.0 10.5 22.0 27.0 22.5 17.5 1.5 0.80 0.22 26.0 12.0 23.0 28.0 22.5 17.5 1.5 0.80 ECQE10103□F( ) ECQE10123□F( ) ECQE10153□F( ) ECQE10183□F( ) ECQE10223□F( ) ECQE10273□F( ) ECQE10333□F( ) ECQE10393□F( ) ECQE10473□F( ) ECQE10563□F( ) ECQE10683□F( ) ECQE10823□F( ) ECQE10104□F( ) ECQE10124□F( ) ECQE10154□F( ) ECQE10184□F( ) ECQE10224□F( ) Cap. (µF) Min. order Q'ty 500 400 500 400 300 － Dimensions (mm) L max. T max. ø d 7.5 mm H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Bulk Taping Style D: 0.010 µF to 0.022 µF Style B: 0.027 µF to 0.22 µF Suffix for lead crimped or taped type. Cap. tol. code ▲ ▲ Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 37 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC38 － Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 1250 VDC, Note) 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) Note) This type has two rated voltage, one is DC rated voltage another is AC rated voltage.. DC rated voltage is 1250 V, AC rated voltage is 125 V. Making for rated voltage is「1250 V, 125 V 」 When capacitors use in secondary side of power source, and in case of applying voltage in altering current (50 Hz or 60 Hz sine wave) to a capacitor, please refer to the page of ''Permissible voltage (R.M.S) in altering current corresponding to DC rated voltage''. When capacitors use in primary side of power source, the rated voltage is shown 125 VAC. Voltage to be applied to capacitors in only sine wave (50 Hz or 60 Hz). AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. And not complying with clause 2 of ''Electrical Appliance and Material Safety Law'', in this case please use ECQUL type or ECQUG type Style D: 0.0010 µF to 0.0068 µF Style B: 0.0082 µF to 0.22 µF Part No. 0.0010 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0012 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0015 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0018 15.5 6.0 11.0 16.0 12.5 10.0 1.0 0.60 0.0022 15.5 6.0 11.5 16.5 12.5 10.0 1.0 0.60 0.0027 15.5 6.5 12.0 17.0 12.5 10.0 1.0 0.60 0.0033 15.5 6.0 11.5 16.5 12.5 10.0 1.0 0.60 0.0039 15.5 6.5 12.0 17.0 12.5 10.0 1.0 0.60 0.0047 15.5 7.0 12.5 17.5 12.5 10.0 1.0 0.60 0.0056 15.5 7.5 13.0 18.0 12.5 10.0 1.0 0.60 0.0068 15.5 7.5 15.0 20.0 12.5 10.0 1.0 0.60 0.0082 21.0 5.0 12.0 17.0 17.5 12.5 1.0 0.60 0.010 21.0 5.0 12.5 17.5 17.5 12.5 1.0 0.60 0.012 21.0 5.5 13.0 18.0 17.5 12.5 1.0 0.60 0.015 21.0 6.0 13.5 18.5 17.5 12.5 1.0 0.60 0.018 21.0 6.5 14.5 19.5 17.5 12.5 1.0 0.80 0.022 21.0 7.0 15.0 20.0 17.5 12.5 1.0 0.80 0.027 26.0 6.0 15.5 20.5 22.5 17.5 1.0 0.80 0.033 26.0 6.5 16.0 21.0 22.5 17.5 1.0 0.80 0.039 26.0 7.0 16.5 21.5 22.5 17.5 1.0 0.80 0.047 26.0 8.0 17.0 22.0 22.5 17.5 1.0 0.80 0.056 31.0 7.5 17.0 22.0 27.5 22.5 1.0 0.80 0.068 31.0 8.0 17.5 22.5 27.5 22.5 1.0 0.80 0.082 31.0 9.0 18.5 23.5 27.5 22.5 1.0 0.80 0.10 31.0 10.0 19.5 24.5 27.5 22.5 1.0 0.80 0.12 31.0 11.5 20.5 25.5 27.5 22.5 1.5 0.80 0.15 31.0 12.0 23.0 28.0 27.5 22.5 1.5 0.80 0.18 31.0 13.0 24.5 29.5 27.5 22.5 1.5 0.80 0.22 31.0 14.5 26.5 31.5 27.5 22.5 1.5 0.80 ECQE12102□F( ) ECQE12122□F( ) ECQE12152□F( ) ECQE12182□F( ) ECQE12222□F( ) ECQE12272□F( ) ECQE12332□F( ) ECQE12392□F( ) ECQE12472□F( ) ECQE12562□F( ) ECQE12682□F( ) ECQE12822□F( ) ECQE12103□F( ) ECQE12123□F( ) ECQE12153□F( ) ECQE12183□F( ) ECQE12223□F( ) ECQE12273□F( ) ECQE12333□F( ) ECQE12393□F( ) ECQE12473□F( ) ECQE12563□F( ) ECQE12683□F( ) ECQE12823□F( ) ECQE12104□F( ) ECQE12124□F( ) ECQE12154□F( ) ECQE12184□F( ) ECQE12224□F( ) Cap. (µF) Min. order Q'ty 500 400 500 Dimensions (mm) L max. T max. ø d 7.5 mm H max. Straight Crimped lead Straight F Crimped lead S Straight G max. Bulk Taping 500 Suffix for lead crimped or taped type. Cap. tol. code ▲ ▲ p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 38 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC39 － Plastic Film Capacitors ■Rating, Dimensions & Quantity/Ammo Box ●Rated voltage : 125 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) ●Noise suppression Capacitors (Across-the-line) style D:0.010 µF to 0.068 µF Suffix for lead crimped or taped type. Cap. tol. code MF( ) Table 1 Notice for AC rated AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. As for clause 2 of ''Electrical Appliance and Material Safety Law'', please use ECQUL type or ECQUG type. When using these capacitors as a across-the-line capacitor, it shall be required to follow either item 1. or item 2. condition. 1. Capacitor shall be connected in parallel with varistor (Specified varistor voltage in table 1.) 2. Voltage applied for capacitor shall not exceed other than specified in table 1, when using these capacitors. Cap. Rated Voltage 125 VAC Varistor voltage 250 V Pulse voltage 250 V0–P Part No. 0.010 10.5 4.5 7.5 12.5 7.5 7.5 1.0 0.60 0.012 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.015 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.018 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.022 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.027 10.5 4.4 7.5 12.5 7.5 7.5 1.0 0.60 0.033 10.5 4.5 7.8 12.8 7.5 7.5 1.0 0.60 0.039 10.5 4.5 7.8 12.8 7.5 7.5 1.0 0.60 0.047 10.5 5.5 8.0 13.0 7.5 7.5 1.0 0.60 0.056 10.5 5.9 8.5 13.5 7.5 7.5 1.0 0.60 0.068 10.5 6.3 9.4 14.4 7.5 7.5 1.0 0.60 ECQE1A103□F( ) ECQE1A123□F( ) ECQE1A153□F( ) ECQE1A183□F( ) ECQE1A223□F( ) ECQE1A273□F( ) ECQE1A333□F( ) ECQE1A393□F( ) ECQE1A473□F( ) ECQE1A563□F( ) ECQE1A683□F( ) Cap. (µF) 1000 － 1000 500 Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 5 mm Odd size 7.5 mm Bulk Metallized Film p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 39 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. － FC40 － Plastic Film Capacitors ●Rated voltage : 250 VAC, Capacitance tolerance : ±5 %(J), ±10 %(K) Noise suppression Capacitors (Across-the-line) Style D:0.010 µF to 0.047 µF Style B:0.056 µF to 0.47 µF Table 1 ❈Please consult us about Crimed lead type of 0.56 µF to 2.2 µF. Notice for AC rated AC rated capacitors complying with clause 1 of ''Electrical Appliance and Material Safety Law''. As for clause 2 of ''Electrical Appliance and Material Safety Law'', please use ECQUL type or ECQUG type. When using these capacitors as a across-the-line capacitor, it shall be required to follow either item 1. or item 2. condition. 1. Capacitor shall be connected in parallel with varistor (Specified varistor voltage in table 1.) 2. Voltage applied for capacitor shall not exceed other than specified in table 1, when using these capacitors. Cap. Rated Voltage 250 VAC Varistor voltage 470 V Pulse voltage 630 V0–P Suffix for lead crimped or taped type. Cap. tol. code MF( ) Part No. 0.010 12.5 5.5 10.8 15.8 10.0 10.0 1.0 0.60 0.012 12.5 6.0 11.5 16.5 10.0 10.0 1.0 0.60 0.015 12.5 6.3 9.9 14.9 10.0 10.0 1.0 0.60 0.018 12.5 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.022 12.5 6.0 11.5 16.5 10.0 10.0 1.0 0.60 0.027 12.5 5.5 10.9 15.9 10.0 10.0 1.0 0.60 0.033 12.5 6.0 11.9 16.9 10.0 10.0 1.0 0.60 0.039 12.5 6.0 13.4 18.4 10.0 10.0 1.0 0.60 0.047 12.5 6.5 14.4 19.4 10.0 10.0 1.0 0.60 0.056 18.5 5.4 10.5 15.5 15.0 10.0 1.0 0.60 0.068 18.5 5.8 11.0 16.0 15.0 10.0 1.0 0.60 0.082 18.5 6.3 12.0 17.0 15.0 10.0 1.0 0.60 0.10 18.5 6.3 14.0 19.0 15.0 10.0 1.0 0.60 0.12 18.5 6.8 14.5 19.5 15.0 10.0 1.0 0.80 0.15 18.5 7.5 15.4 20.4 15.0 10.0 1.0 0.80 0.18 18.5 8.0 16.0 21.0 15.0 10.0 1.0 0.80 0.22 18.5 9.0 16.9 21.9 15.0 10.0 1.0 0.80 0.27 26.0 7.0 16.5 21.5 22.5 15.0 1.0 0.80 0.33 26.0 7.8 17.0 22.0 22.5 15.0 1.0 0.80 0.39 26.0 8.5 17.9 22.9 22.5 15.0 1.0 0.80 0.47 26.0 9.3 18.5 23.5 22.5 15.0 1.0 0.80 0.56 26.0 10.0 20.0 ─ 22.5 ─ 1.0 0.80 0.68 26.0 11.5 21.0 ─ 22.5 ─ 1.0 0.80 0.82 26.0 13.0 22.5 ─ 22.5 ─ 1.0 0.80 1.0 31.0 12.5 21.9 ─ 27.5 ─ 1.5 0.80 1.2 31.0 13.5 23.0 ─ 27.5 ─ 1.5 0.80 1.5 31.0 15.3 24.7 ─ 27.5 ─ 1.5 0.80 1.8 31.0 16.8 27.0 ─ 27.5 ─ 1.5 0.80 2.2 31.0 19.5 29.0 ─ 27.5 ─ 1.5 0.80 ECQE2A103□F( ) ECQE2A123□F( ) ECQE2A153□F( ) ECQE2A183□F( ) ECQE2A223□F( ) ECQE2A273□F( ) ECQE2A333□F( ) ECQE2A393□F( ) ECQE2A473□F( ) ECQE2A563□F( ) ECQE2A683□F( ) ECQE2A823□F( ) ECQE2A104□F( ) ECQE2A124□F( ) ECQE2A154□F( ) ECQE2A184□F( ) ECQE2A224□F( ) ECQE2A274□F( ) ECQE2A334□F( ) ECQE2A394□F( ) ECQE2A474□F( ) ECQE2A564P( )( ) ECQE2A684P( )( ) ECQE2A824P( )( ) ECQE2A105P( )( ) ECQE2A125P( )( ) ECQE2A155P( )( ) ECQE2A185P( )( ) ECQE2A225P( )( ) Cap. (µF) 500 1000 500 400 300 － － Dimensions (mm) L max. T max. φd H max. Straight Crimped lead Straight F Crimped lead S Straight G max. 500 Min. order Q'ty Taping Standard 5 mm Odd size 7.5 mm Bulk p Œ ¯ ¶ ‚ /P33-52 12.11.14 19:29 y [ W 40 Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 100VDC Series (Metallized Polyester Film) Erectrical Characteristicsat 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 10uF 4.7uF 1.0uF 10uF 4.7uF 1.0uF 10uF 4.7uF 1.0uF 10uF 4.7uF 1.0uF 1.0uF 4.7uF 10uF 1.0uF 4.7uF 10uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.56 564 12.32 0.68 684 15.0 0.82 824 18.0 1.00 105 22.0 1.20 125 13.2 1.50 155 17.1 1.80 185 19.8 2.20 225 24.2 2.70 275 29.7 3.30 335 36.3 3.90 395 23.4 4.70 475 28.2 5.60 565 33.6 6.80 685 40.8 8.20 825 49.2 10.00 106 60.0 Pulse Handling Capability (dV/dt) (Max 10000cycles) Voltage Derating by Temperature Permissible Current Permissible Voltage 6 22 100VDC 11 0 20 40 60 80 100 120 -60 -40 -20 0 20 40 60 80 100 120 0.1 1 10 100 10 100 1000 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 100VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) 1.0uF 2.2uF 4.7uF 10uF 1.0uF 2.2uF 4.7uF 10uF From 0.56uF to 10uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 250VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 10uF 1.0uF 0.1uF 10uF 1.0uF 0.1uF 10uF 1.0uF 0.01uF 10uF 1.0uF 0.1uF 0.1uF 1.0uF 10uF 0.1uF 1.0uF 10uF 0.01uF 0.01uF 0.1uF 0.01uF 0.01uF 0.01uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.010 103 0.48 0.015 153 0.72 0.022 223 1.06 0.033 333 1.58 0.047 473 2.26 0.068 683 3.26 0.100 104 4.80 0.150 154 7.20 0.220 224 7.26 0.330 334 10.89 0.470 474 8.46 0.680 684 12.24 1.000 105 18.00 1.500 155 27.00 2.200 225 22.00 3.300 335 33.00 4.700 475 47.00 6.800 685 54.40 10.000 106 80.00 250VDC Pulse Handling Capability (dV/dt) Voltage Derating by Temperature (Max 10000cycles) 48 8 10 18 33 Permissible Current Permissible Voltage 0 50 100 150 200 250 300 -60 -40 -20 0 20 40 60 80 100 120 1 10 100 10 100 1000 0 1 2 3 4 5 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 250VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) 1.0uF 2.2uF 4.7uF 10uF From 0.01uF to 10uF 0.47uF 0.22uF 0.10uF 0.047u 0.022u 0.01uF 0.01uF 0.022uF 0.047uF 0.10uF 0.22uF 0.47uF 1.0uF 2.2uF 4.7uF 10uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 400VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 2.2uF 1.0uF 0.1uF 2.2uF 1.0uF 0.1uF 2.2uF 1.0uF 0.1uF 0.01uF 0.01uF 0.01uF 0.01uF 0.1uF 1.0uF 2.2uF 0.01uF 0.1uF 1.0uF 2.2uF 2.2uF 1.0uF 0.1uF 0.01uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.010 103 1.31 0.015 153 1.97 0.022 223 2.88 0.033 333 4.32 0.047 473 3.67 0.068 683 5.30 0.100 104 7.80 0.150 154 5.55 0.220 224 8.14 0.330 334 12.21 0.470 474 17.39 0.680 684 14.96 1.000 105 22.00 1.200 155 27.00 2.200 225 39.60 Permissible Voltage Voltage Derating by Temperature 131 Permissible Current Pulse Handling Capability (dV/dt) (Max 10000cycles) 400VDC 78 37 22 18 0 100 200 300 400 500 -60 -40 -20 0 20 40 60 80 100 120 0 0.5 1 1.5 2 2.5 3 10 100 1000 1 10 100 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 400VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) From 0.01uF to 2.2uF 2.2uF 1.0uF 0.47uF 0.22uF 0.1uF 0.047uF 0.022uF 0.01uF 0.01uF 0.022uF 0.047uF 0.1uF 0.22uF 0.47uF 1.0uF 2.2uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 630VDC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 2.2uF 1.0uF 0.1uF 2.2uF 1.0uF 0.1uF 1.0uF 0.1uF 0.01uF 0.01uF 0.01uF 0.01uF 0.1uF 1.0uF 2.2uF 0.01uF 0.1uF 1.0uF 2.2uF 2.2uF 1.0uF 0.1uF 0.01uF 2.2uF Rating Voltage Capacitance Value(uF) Code dV/dt(V/us) Current(o-p) (A) 0.010 103 2.73 0.015 153 4.10 0.022 223 6.01 0.033 333 9.01 0.047 473 12.83 0.068 683 7.89 0.100 104 11.60 0.150 154 17.40 0.220 224 25.52 0.330 334 20.79 0.470 474 29.61 0.680 684 42.84 1.000 105 48.00 1.500 155 72.00 2.200 225 105.60 (Max 10000cycles) 273 Voltage Derating by Temperature 630VDC Permissible Current Permissible Voltage 116 63 48 Pulse Handling Capability (dV/dt) 0 100 200 300 400 500 600 700 800 -60 -40 -20 0 20 40 60 80 100 120 1 10 100 10 100 1000 0 1 2 3 4 5 10 100 1000 * Please consult Panasonic if your condition exceeds the above spec. ECQE(F) Type 630VDC Series (Metallized Polyester Film) Applicable Specifications Frequency (kHz) Permissible Current (Arms) Permissible Voltage (Vrms) (at sinewave) Frequency (kHz) Rated Voltage (VDC) Surface Temperature of Capacitor(Degree C) From 0.01uF to 2.2uF 2.2uF 1.0uF 0.47uF 0.22uF 0.1uF 0.047uF 0.022uF 0.01uF 0.01uF 0.022uF 0.047uF 0.1uF 0.22uF 0.47uF 1.0uF 2.2uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 125VAC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.01uF 0.47uF 0.1uF 0.047uF 0.047uF 0.1uF 0.47uF 0.047uF 0.1uF 0.47uF 0.01uF 0.01uF 0.047uF 0.01uF 0.01uF 0.01uF Temperature Characteristics Frequency Characteristics 0.01 0.1 1 10 100 1000 10000 1 10 100 1000 10000 100000 0 2 4 6 8 10 1 10 100 1000 10000 -10 -5 0 5 10 1 10 100 1000 10000 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11 1.E+12 1.E+13 -60 -40 -20 0 20 40 60 80 100 0 2 4 6 8 10 -60 -40 -20 0 20 40 60 80 100 -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 ECQE(F) Type 250VAC Series (Metallized Polyester Film) Erectrical Characteristics at 1kHz Temperature (Degree C) Capacitance change (%) Dissipation factor (%) Temperature (Degree C) at 1kHz at DC100V Temperature (Degree C) Insuration resistance (ohm) Capacitance change (%) Frequency (kHz) Frequency (kHz) Dissipation factor (%) Frequency (kHz) Impedance (ohm) 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.047uF 0.47uF 0.1uF 0.01uF 0.47uF 0.1uF 0.047uF 0.047uF 0.1uF 0.47uF 0.047uF 0.1uF 0.47uF 0.01uF 0.01uF 0.047uF 0.01uF 0.01uF 0.01uF Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-82 – 010 Sleeve L 14 min. 3 min. = = L 16 : L±1.5 L 20 : L±2.0 Pressure relief 06.3 + – 08 0D±0.5 F±0.5 0D±0.5 fd±0.05 ■ Country of origin Malaysia Radial Lead Type Series: FR Type: A ■ Specifi cations Category Temp. Range –40 °C to +105 °C Rated W.V. Range 6.3 V.DC to 100 V.DC Nominal Cap. Range 4.7 μF to 8200 μF Capacitance Tolerance ±20 % (120 Hz/+20 °C) DC Leakage Cur rent I < 0.01 CV (μA) After 2 minutes tan d W.V. 6.3 10 16 25 35 50 63 100 (120 Hz/+20 °C) tan d 0.22 0.19 0.16 0.14 0.12 0.10 0.09 0.08 Add 0.02 per 1000 μF for products of 1000 μF or more. Endurance After following life test with DC voltage and +105 °C±2 °C ripple current value applied. (The sum of DC and ripple peak voltage shall not exceed the rated working voltage) when the capacitors are restored to 20 °C, the capacitors shall meet the limits specifi ed below. Duration 05×11/ 06.3×11.2 : 5000 hours 08×11.5/ 010×12.5 : 6000 hours (✽ Only EEUFR1V331U (010×12.5) 5000 hours) 08×15/ 010×16 : 8000 hours, 08×20 : 9000 hours 010×20 to 010×25/ 012.5×20 to 012.5×35/ 016×20 to 016×25 : 10000 hours Capacitance change ±25 % of initial measured value (6.3 V to 10 V : ±30 %) tan d < 200 % of initial specifi ed value DC leakage current < initial specifi ed value Shelf Life After storage for 1000 hours at +105 °C±2 °C with no voltage applied and then being stabilized at +20 °C, capacitors shall meet the limits specifi ed in Endurance. (With voltage treatment) ■ Di men sions in mm (not to scale) W.V.(V.DC) Cap (μF) Frequency (Hz) 60 120 1 k 10 k 100 k 6.3 to 100 4.7 to 33 0.45 0.55 0.75 0.90 1.00 47 to 330 0.60 0.70 0.85 0.95 1.00 390 to 1000 0.65 0.75 0.90 0.98 1.00 1200 to 8200 0.75 0.80 0.95 1.00 1.00 ■ Frequency correction factor for ripple current Body Dia. 0D 5 6.3 8 10 12.5 16 Body Length L — — — — 12.5 to 25 30 to 35 — Lead Dia. 0d 0.5 0.5 0.6 0.6 0.6 0.8 0.8 Lead space F 2.0 2.5 3.5 5.0 5.0 7.5 ■ Features ● Low ESR (Same as FM Series) ● Endurance : 5000 h to 10000 h at +105 °C ● RoHS directive compliant ■ Attention Not applicable for automotive (Unit : mm) 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-83 – ■ Case size/Impedance/Ripple current W.V.(V.DC) 6.3 V to 35 V 50 V Case size (0D×L) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) +20 °C –10 °C +105 °C +20 °C –10 °C +105 °C 5 × 11 0.300 1.000 280 0.340 1.130 250 6.3 × 11.2 0.130 0.430 455 0.140 0.460 405 8 × 11.5 0.056 0.168 950 0.061 0.183 870 8 × 15 0.041 0.123 1240 0.045 0.135 1140 8 × 20 0.030 0.090 1560 0.033 0.099 1430 10 × 12.5 0.043 0.114 1290 0.042 0.126 1170 10 × 16 0.028 0.078 1790 0.030 0.090 1650 10 × 20 0.020 0.057 2180 0.023 0.069 1890 10 × 25 0.018 0.054 2470 0.022 0.066 2150 12.5 × 20 0.018 0.045 2600 0.022 0.055 2260 12.5 × 25 0.015 0.038 3190 0.018 0.045 2660 12.5 × 30 0.013 0.033 3630 0.016 0.040 3160 12.5 × 35 0.012 0.030 3750 0.014 0.035 3270 16 × 20 0.017 0.043 3300 0.019 0.048 2870 16 × 25 0.014 0.035 3820 0.016 0.040 3320 W.V.(V.DC) 63 V Case size (0D×L) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) +20 °C –10 °C +105 °C 5 × 11 0.510 2.040 175 6.3 × 11.2 0.210 0.840 284 8 × 11.5 0.092 0.368 566 8 × 15 0.068 0.272 741 8 × 20 0.050 0.200 930 10 × 12.5 0.063 0.252 761 10 × 16 0.045 0.180 1073 10 × 20 0.035 0.140 1229 10 × 25 0.033 0.132 1500 12.5 × 20 0.033 0.125 1582 12.5 × 25 0.027 0.092 1995 12.5 × 30 0.024 0.082 2528 12.5 × 35 0.021 0.071 2780 16 × 20 0.029 0.093 2153 16 × 25 0.024 0.074 2988 W.V.(V.DC) 100 V Case size (0D×L) Imped ance (Ω/100 kHz) Ripple Current (mA r.m.s./100 kHz) +20 °C –10 °C +105 °C 10 × 20 0.084 0.336 1500 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-84 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 6.3 150 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR0J151( ) 200 2000 220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J221( ) 200 2000 330 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J331( ) 200 2000 470 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR0J471( ) 200 2000 820 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR0J821( ) 200 1000 1000 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR0J102( ) 200 1000 1200 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR0J122L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR0J122( ) 200 500 1500 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR0J152L( ) 200 1000 1800 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR0J182( ) 200 500 2200 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR0J222( ) 200 500 2700 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR0J272L( ) 200 500 3300 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR0J332L( ) 200 500 3900 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR0J392( ) 200 500 4700 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR0J472( ) 200 500 5600 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR0J562L 100 6800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR0J682L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR0J682S( ) 100 250 8200 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR0J822( ) 100 250 10 100 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1A101( ) 200 2000 150 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1A151( ) 200 2000 220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1A221( ) 200 2000 270 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1A271( ) 200 2000 470 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1A471( ) 200 1000 680 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1A681( ) 200 1000 820 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1A821( ) 200 500 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1A102( ) 200 500 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1A102L( ) 200 1000 1500 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1A152L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1A152( ) 200 500 1800 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1A182( ) 200 500 2200 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1A222L( ) 200 500 3300 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1A332( ) 200 500 3900 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1A392( ) 200 500 4700 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1A472L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1A472S( ) 100 250 5600 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1A562L 100 6800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1A682L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1A682( ) 100 250 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-85 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 16 68 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1C680( ) 200 2000 100 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1C101( ) 200 2000 120 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1C121( ) 200 2000 220 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1C221( ) 200 2000 470 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1C471( ) 200 1000 680 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1C681L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1C681( ) 200 500 1000 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1C102L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1C102( ) 200 500 1500 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1C152( ) 200 500 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1C152L( ) 200 500 1800 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1C182L( ) 200 500 2200 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1C222( ) 200 500 2700 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1C272( ) 200 500 3300 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1C332L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1C332S( ) 100 250 3900 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1C392L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1C392S( ) 100 250 4700 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1C472L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1C472( ) 100 250 5600 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1C562( ) 100 250 25 47 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1E470( ) 200 2000 68 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1E680( ) 200 2000 100 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1E101( ) 200 2000 150 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1E151( ) 200 2000 220 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1E221( ) 200 1000 330 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1E331( ) 200 1000 390 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1E391L( ) 200 1000 470 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1E471Y( ) 200 1000 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E471L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1E471( ) 200 500 560 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E561L( ) 200 1000 680 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1E681L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1E681( ) 200 500 820 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1E821( ) 200 500 1000 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1E102( ) 200 500 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1E102L( ) 200 500 1200 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1E122L( ) 200 500 1500 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1E152( ) 200 500 1800 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1E182( ) 200 500 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E182S( ) 100 250 2200 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1E222L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E222S( ) 100 250 2700 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1E272L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1E272S( ) 100 250 3300 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1E332( ) 100 250 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FR – EEE-86 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 35 33 5 11 280 0.300 5000 0.5 2.0 5.0 2.5 EEUFR1V330( ) 200 2000 68 6.3 11.2 455 0.130 5000 0.5 2.5 5.0 2.5 EEUFR1V680( ) 200 2000 100 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V101( ) 200 1000 180 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V181( ) 200 1000 220 8 11.5 950 0.056 6000 0.6 3.5 5.0 EEUFR1V221( ) 200 1000 270 8 15 1240 0.041 8000 0.6 3.5 5.0 EEUFR1V271L( ) 200 1000 10 12.5 1290 0.043 6000 0.6 5.0 5.0 EEUFR1V271( ) 200 500 330 10 12.5 1330 0.043 5000 0.6 5.0 5.0 EEUFR1V331U( ) 200 500 390 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1V391L( ) 200 1000 470 8 20 1560 0.030 9000 0.6 3.5 5.0 EEUFR1V471L( ) 200 1000 10 16 1790 0.028 8000 0.6 5.0 5.0 EEUFR1V471( ) 200 500 560 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1V561( ) 200 500 680 10 20 2180 0.020 10000 0.6 5.0 5.0 EEUFR1V681( ) 200 500 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1V681L( ) 200 500 820 10 25 2470 0.018 10000 0.6 5.0 5.0 EEUFR1V821L( ) 200 500 1000 12.5 20 2600 0.018 10000 0.6 5.0 5.0 EEUFR1V102( ) 200 500 1200 12.5 25 3190 0.015 10000 0.6 5.0 5.0 EEUFR1V122( ) 200 500 1500 12.5 30 3630 0.013 10000 0.8 5.0 EEUFR1V152L 100 16 20 3300 0.017 10000 0.8 7.5 7.5 EEUFR1V152S( ) 100 250 1800 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1V182L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1V182( ) 100 250 2200 12.5 35 3750 0.012 10000 0.8 5.0 EEUFR1V222L 100 16 25 3820 0.014 10000 0.8 7.5 7.5 EEUFR1V222( ) 100 250 50 4.7 5 11 185 0.620 5000 0.5 2.0 5.0 2.5 EEUFR1H4R7( ) 200 2000 10 5 11 250 0.340 5000 0.5 2.0 5.0 2.5 EEUFR1H100( ) 200 2000 22 5 11 250 0.340 5000 0.5 2.0 5.0 2.5 EEUFR1H220( ) 200 2000 47 6.3 11.2 405 0.140 5000 0.5 2.5 5.0 EEUFR1H470( ) 200 2000 56 6.3 11.2 405 0.140 5000 0.5 2.5 5.0 2.5 EEUFR1H560( ) 200 2000 100 8 11.5 870 0.061 6000 0.6 3.5 5.0 EEUFR1H101( ) 200 1000 120 8 15 1140 0.045 8000 0.6 3.5 5.0 EEUFR1H121L( ) 200 1000 150 10 12.5 1170 0.042 6000 0.6 5.0 5.0 EEUFR1H151( ) 200 500 180 8 20 1430 0.033 9000 0.6 3.5 5.0 EEUFR1H181L( ) 200 1000 220 10 16 1650 0.030 8000 0.6 5.0 5.0 EEUFR1H221( ) 200 500 270 10 20 1890 0.023 10000 0.6 5.0 5.0 EEUFR1H271( ) 200 500 330 10 25 2150 0.022 10000 0.6 5.0 5.0 EEUFR1H331L( ) 200 500 470 12.5 20 2260 0.022 10000 0.6 5.0 5.0 EEUFR1H471( ) 200 500 560 12.5 25 2660 0.018 10000 0.6 5.0 5.0 EEUFR1H561( ) 200 500 680 12.5 30 3160 0.016 10000 0.8 5.0 EEUFR1H681L 100 820 12.5 35 3270 0.014 10000 0.8 5.0 EEUFR1H821L 100 16 20 2870 0.019 10000 0.8 7.5 7.5 EEUFR1H821S( ) 100 250 1000 16 25 3320 0.016 10000 0.8 7.5 7.5 EEUFR1H102( ) 100 250 63 18 5 11 175 0.510 5000 0.5 2.0 5.0 2.5 EEUFR1J180( ) 200 2000 47 6.3 11.2 284 0.210 5000 0.5 2.5 5.0 2.5 EEUFR1J470( ) 200 2000 82 8 11.5 566 0.092 6000 0.6 3.5 5.0 EEUFR1J820( ) 200 1000 100 8 15 741 0.068 8000 0.6 3.5 5.0 EEUFR1J101L( ) 200 1000 10 12.5 761 0.063 6000 0.6 5.0 5.0 EEUFR1J101( ) 200 500 120 8 20 930 0.050 9000 0.6 3.5 5.0 EEUFR1J121L( ) 200 1000 10 16 1073 0.045 8000 0.6 5.0 5.0 EEUFR1J121( ) 200 500 150 8 20 930 0.050 9000 0.6 3.5 5.0 EEUFR1J151L( ) 200 1000 10 16 1073 0.045 8000 0.6 5.0 5.0 EEUFR1J151( ) 200 500 180 10 20 1229 0.035 10000 0.6 5.0 5.0 EEUFR1J181( ) 200 500 220 10 25 1500 0.033 10000 0.6 5.0 5.0 EEUFR1J221L( ) 200 500 270 10 20 1229 0.035 10000 0.6 5.0 5.0 EEUFR1J271U( ) 200 500 10 25 1500 0.033 10000 0.6 5.0 5.0 EEUFR1J271L( ) 200 500 12.5 20 1582 0.033 10000 0.6 5.0 5.0 EEUFR1J271( ) 200 500 330 12.5 20 1582 0.033 10000 0.6 5.0 5.0 EEUFR1J331( ) 200 500 390 12.5 25 1995 0.027 10000 0.6 5.0 5.0 EEUFR1J391( ) 200 500 470 12.5 25 1995 0.027 10000 0.6 5.0 5.0 EEUFR1J471( ) 200 500 560 12.5 30 2528 0.024 10000 0.8 5.0 EEUFR1J561L 100 16 20 2153 0.029 10000 0.8 7.5 7.5 EEUFR1J561S( ) 100 250 680 12.5 35 2780 0.021 10000 0.8 5.0 EEUFR1J681L 100 820 16 25 2988 0.024 10000 0.8 7.5 7.5 EEUFR1J821( ) 100 250 100 100 10 20 1500 0.084 10000 0.6 5.0 5.0 EEUFR2A101( ) 200 500 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. 06 Nov. 2014 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ M – EEE-111 – 010 Sleeve L 14 min. 3 min. = 06.3 =L 16 : L±1.0 L 20 : L±2.0 Pressure relief + – 08 0D+0.5 F±0.5 0D+0.5 fd±0.05 ■ Features ● Endurance : 85 °C 2000 h ● Smaller than series SU ● RoHS directive compliant Radial Lead Type Series: M Type: A ■ Specifi cations Category Temp. Range –40 °C to + 85 °C –25 °C to +85 °C Rated W.V. Range 6.3 V.DC to 100 V.DC 160 V.DC to 450 V.DC Nominal Cap. Range 2.2 μF to 22000 μF 1 μF to 470 μF Capacitance Tolerance ±20 % (120 Hz/+20 °C) DC Leakage Cur rent I < 0.01 CV or 3 (μA) After 2 minutes (Whichever is greater) I < 0.06 CV +10 (μA) After 2 minutes tan d Please see the attached standard products list Endurance After applying rated working voltage for 2000 hours at +85°C±2 °C, when the capacitors are restored to 20 °C, capacitors shall meet the following limits. Capacitance change ±20 % of initial measured value tan d <150 % of initial specifi ed value DC leakage current > NXP Semiconductors LPC2468 Single-chip 16-bit/32-bit micro 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8 7 Functional description . . . . . . . . . . . . . . . . . . 24 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 24 7.2 On-chip flash programming memory . . . . . . . 25 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 25 7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 27 7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 28 7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 28 7.7 External memory controller. . . . . . . . . . . . . . . 28 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.8 General purpose DMA controller . . . . . . . . . . 29 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.9 Fast general purpose parallel I/O . . . . . . . . . . 30 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.11 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.11.1 USB device controller . . . . . . . . . . . . . . . . . . . 32 7.11.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.11.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 32 7.11.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.11.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 33 7.11.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.12 CAN controller and acceptance filters . . . . . . 33 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.13 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.14 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.15 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 7.16 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 35 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.17 SSP serial I/O controller . . . . . . . . . . . . . . . . . 35 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.18 SD/MMC card interface . . . . . . . . . . . . . . . . . 35 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.19 I2C-bus serial I/O controller . . . . . . . . . . . . . . 36 7.19.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.20 I2S-bus serial I/O controllers . . . . . . . . . . . . . 36 7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.21 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.22 Pulse width modulator . . . . . . . . . . . . . . . . . . 38 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 7.23 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 39 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 7.24 RTC and battery RAM . . . . . . . . . . . . . . . . . . 39 7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 7.25 Clocking and power control . . . . . . . . . . . . . . 40 7.25.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 40 7.25.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 40 7.25.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 40 7.25.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 41 7.25.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.25.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 41 7.25.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 42 7.25.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 43 7.25.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 43 7.26 System control . . . . . . . . . . . . . . . . . . . . . . . . 44 7.26.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 7.26.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 44 7.26.3 Code security (Code Read Protection - CRP) 44 7.26.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 7.26.5 External interrupt inputs . . . . . . . . . . . . . . . . . 45 7.26.6 Memory mapping control . . . . . . . . . . . . . . . . 45 7.27 Emulation and debugging . . . . . . . . . . . . . . . 45 7.27.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 45 7.27.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 46 7.27.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 46 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 47 9 Thermal characteristics . . . . . . . . . . . . . . . . . 48 10 Static characteristics . . . . . . . . . . . . . . . . . . . 49 10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 52 10.2 Deep power-down mode . . . . . . . . . . . . . . . . 53 10.3 Electrical pin characteristics. . . . . . . . . . . . . . 55 11 Dynamic characteristics. . . . . . . . . . . . . . . . . 56 11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 57 11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 57 11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 58 NXP Semiconductors LPC2468 Single-chip 16-bit/32-bit micro © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 11 January 2013 Document identifier: LPC2468 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11.5 Static external memory interface . . . . . . . . . . 59 11.6 Dynamic external memory interface . . . . . . . . 61 11.7 Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 12 ADC electrical characteristics . . . . . . . . . . . . 65 13 DAC electrical characteristics . . . . . . . . . . . . 68 14 Application information. . . . . . . . . . . . . . . . . . 69 14.1 Suggested USB interface solutions . . . . . . . . 69 14.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 14.3 RTC 32 kHz oscillator component selection. . 75 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines. . . . . . . . . . . . . . . . . . . . . . . 76 14.5 Standard I/O pin configuration . . . . . . . . . . . . 76 14.6 Reset pin configuration. . . . . . . . . . . . . . . . . . 77 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 78 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 80 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 81 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 82 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 82 18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 83 19 Contact information. . . . . . . . . . . . . . . . . . . . . 83 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 1. General description The LPC2141/42/44/46/48 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combine the microcontroller with embedded high-speed flash memory ranging from 32 kB to 512 kB. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. Due to their tiny size and low power consumption, LPC2141/42/44/46/48 are ideal for applications where miniaturization is a key requirement, such as access control and point-of-sale. Serial communications interfaces ranging from a USB 2.0 Full-speed device, multiple UARTs, SPI, SSP to I2C-bus and on-chip SRAM of 8 kB up to 40 kB, make these devices very well suited for communication gateways and protocol converters, soft modems, voice recognition and low end imaging, providing both large buffer size and high processing power. Various 32-bit timers, single or dual 10-bit ADC(s), 10-bit DAC, PWM channels and 45 fast GPIO lines with up to nine edge or level sensitive external interrupt pins make these microcontrollers suitable for industrial control and medical systems. 2. Features and benefits 2.1 Key features 16-bit/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package. 8 kB to 40 kB of on-chip static RAM and 32 kB to 512 kB of on-chip flash memory. 128-bit wide interface/accelerator enables high-speed 60 MHz operation. In-System Programming/In-Application Programming (ISP/IAP) via on-chip boot loader software. Single flash sector or full chip erase in 400 ms and programming of 256 B in 1 ms. EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the on-chip RealMonitor software and high-speed tracing of instruction execution. USB 2.0 Full-speed compliant device controller with 2 kB of endpoint RAM. In addition, the LPC2146/48 provides 8 kB of on-chip RAM accessible to USB by DMA. One or two (LPC2141/42 vs. LPC2144/46/48) 10-bit ADCs provide a total of 6/14 analog inputs, with conversion times as low as 2.44 s per channel. Single 10-bit DAC provides variable analog output (LPC2142/44/46/48 only). Two 32-bit timers/external event counters (with four capture and four compare channels each), PWM unit (six outputs) and watchdog. Low power Real-Time Clock (RTC) with independent power and 32 kHz clock input. LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC Rev. 5 — 12 August 2011 Product data sheet LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 2 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers Multiple serial interfaces including two UARTs (16C550), two Fast I2C-bus (400 kbit/s), SPI and SSP with buffering and variable data length capabilities. Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses. Up to 45 of 5 V tolerant fast general purpose I/O pins in a tiny LQFP64 package. Up to 21 external interrupt pins available. 60 MHz maximum CPU clock available from programmable on-chip PLL with settling time of 100 s. On-chip integrated oscillator operates with an external crystal from 1 MHz to 25 MHz. Power saving modes include Idle and Power-down. Individual enable/disable of peripheral functions as well as peripheral clock scaling for additional power optimization. Processor wake-up from Power-down mode via external interrupt or BOD. Single power supply chip with POR and BOD circuits: CPU operating voltage range of 3.0 V to 3.6 V (3.3 V 10 %) with 5 V tolerant I/O pads. 3. Ordering information 3.1 Ordering options [1] While the USB DMA is the primary user of the additional 8 kB RAM, this RAM is also accessible at any time by the CPU as a general purpose RAM for data and code storage. Table 1. Ordering information Type number Package Name Description Version LPC2141FBD64 LQFP64 plastic low profile quad flat package; 64 leads; body 10 10 1.4 mm SOT314-2 LPC2142FBD64 LPC2144FBD64 LPC2146FBD64 LPC2148FBD64 Table 2. Ordering options Type number Flash memory RAM Endpoint USB RAM ADC (channels overall) DAC Temperature range LPC2141FBD64 32 kB 8 kB 2 kB 1 (6 channels) - 40 C to +85 C LPC2142FBD64 64 kB 16 kB 2 kB 1 (6 channels) 1 40 C to +85 C LPC2144FBD64 128 kB 16 kB 2 kB 2 (14 channels) 1 40 C to +85 C LPC2146FBD64 256 kB 32 kB + 8 kB shared with USB DMA[1] 2 kB 2 (14 channels) 1 40 C to +85 C LPC2148FBD64 512 kB 32 kB + 8 kB shared with USB DMA[1] 2 kB 2 (14 channels) 1 40 C to +85 C LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 3 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 4. Block diagram (1) Pins shared with GPIO. (2) LPC2144/46/48 only. (3) USB DMA controller with 8 kB of RAM accessible as general purpose RAM and/or DMA is available in LPC2146/48 only. (4) LPC2142/44/46/48 only. Fig 1. Block diagram 002aab560 system clock TRST(1) TMS(1) TCK(1) TDI(1) TDO(1) XTAL2 XTAL1 AMBA AHB (Advanced High-performance Bus) INTERNAL FLASH CONTROLLER AHB BRIDGE EMULATION TRACE MODULE TEST/DEBUG INTERFACE AHB AHB TO APB DECODER BRIDGE APB DIVIDER VECTORED INTERRUPT CONTROLLER SYSTEM FUNCTIONS PLL0 USB clock PLL1 SYSTEM CONTROL 32 kB/64 kB/128 kB/ 256 kB/512 kB FLASH ARM7TDMI-S LPC2141/42/44/46/48 INTERNAL SRAM CONTROLLER 8 kB/16 kB/ 32 kB SRAM ARM7 local bus SCL0, SCL1 SDA0, SDA1 4 × CAP0 4 × CAP1 8 × MAT0 8 × MAT1 I 2C-BUS SERIAL INTERFACES 0 AND 1 CAPTURE/COMPARE (W/EXTERNAL CLOCK) TIMER 0/TIMER 1 EINT3 to EINT0 EXTERNAL INTERRUPTS D+ D− UP_LED CONNECT VBUS USB 2.0 FULL-SPEED DEVICE CONTROLLER WITH DMA(3) SCK0, SCK1 MOSI0, MOSI1 MISO0, MISO1 AD0[7:6] and AD0[4:1] AD1[7:0](2) SSEL0, SSEL1 SPI AND SSP SERIAL INTERFACES A/D CONVERTERS 0 AND 1(2) TXD0, TXD1 RXD0, RXD1 DSR1(2),CTS1(2), RTS1(2), DTR1(2) DCD1(2),RI1(2) AOUT(4) D/A CONVERTER UART0/UART1 P0[31:28] and P0[25:0] P1[31:16] RTXC2 RTXC1 VBAT REAL-TIME CLOCK GENERAL PURPOSE I/O PWM6 to PWM0 WATCHDOG TIMER PWM0 P0[31:28] and P0[25:0] P1[31:16] FAST GENERAL PURPOSE I/O 8 kB RAM SHARED WITH USB DMA(3) RST LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 4 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 5. Pinning information 5.1 Pinning Fig 2. LPC2141 pinning LPC2141 P0.21/PWM5/CAP1.3 P1.20/TRACESYNC P0.22/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2 RTCX1 P0.16/EINT0/MAT0.2/CAP0.2 P1.19/TRACEPKT3 P0.15/EINT2 RTCX2 P1.21/PIPESTAT0 VSS VDD VDDA VSS P1.18/TRACEPKT2 P0.14/EINT1/SDA1 P0.25/AD0.4 P1.22/PIPESTAT1 D+ P0.13/MAT1.1 D− P0.12/MAT1.0 P1.17/TRACEPKT1 P0.11/CAP1.1/SCL1 P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2 P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/CAP1.0 P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3 P1.16/TRACEPKT0 P0.8/TXD1/PWM4 P0.31/UP_LED/CONNECT P1.27/TDO VSS VREF P0.0/TXD0/PWM1 XTAL1 P1.31/TRST XTAL2 P0.1/RXD0/PWM3/EINT0 P1.28/TDI P0.2/SCL0/CAP0.0 VSSA VDD P0.23/VBUS P1.26/RTCK RESET VSS P1.29/TCK P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3 P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2 P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3 P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS P0.6/MOSI0/CAP0.2 VDD P0.7/SSEL0/PWM2/EINT2 VSS P1.24/TRACECLK VBAT 002aab733 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 5 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers Fig 3. LPC2142 pinning LPC2142 P0.21/PWM5/CAP1.3 P1.20/TRACESYNC P0.22/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2 RTCX1 P0.16/EINT0/MAT0.2/CAP0.2 P1.19/TRACEPKT3 P0.15/EINT2 RTCX2 P1.21/PIPESTAT0 VSS VDD VDDA VSS P1.18/TRACEPKT2 P0.14/EINT1/SDA1 P0.25/AD0.4/AOUT P1.22/PIPESTAT1 D+ P0.13/MAT1.1 D− P0.12/MAT1.0 P1.17/TRACEPKT1 P0.11/CAP1.1/SCL1 P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2 P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/CAP1.0 P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3 P1.16/TRACEPKT0 P0.8/TXD1/PWM4 P0.31/UP_LED/CONNECT P1.27/TDO VSS VREF P0.0/TXD0/PWM1 XTAL1 P1.31/TRST XTAL2 P0.1/RXD0/PWM3/EINT0 P1.28/TDI P0.2/SCL0/CAP0.0 VSSA VDD P0.23/VBUS P1.26/RTCK RESET VSS P1.29/TCK P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3 P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2 P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3 P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS P0.6/MOSI0/CAP0.2 VDD P0.7/SSEL0/PWM2/EINT2 VSS P1.24/TRACECLK VBAT 002aab734 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 6 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers Fig 4. LPC2144/46/48 pinning LPC2144/2146/2148 P0.21/PWM5/AD1.6/CAP1.3 P1.20/TRACESYNC P0.22/AD1.7/CAP0.0/MAT0.0 P0.17/CAP1.2/SCK1/MAT1.2 RTCX1 P0.16/EINT0/MAT0.2/CAP0.2 P1.19/TRACEPKT3 P0.15/RI1/EINT2/AD1.5 RTCX2 P1.21/PIPESTAT0 VSS VDD VDDA VSS P1.18/TRACEPKT2 P0.14/DCD1/EINT1/SDA1 P0.25/AD0.4/AOUT P1.22/PIPESTAT1 D+ P0.13/DTR1/MAT1.1/AD1.4 D− P0.12/DSR1/MAT1.0/AD1.3 P1.17/TRACEPKT1 P0.11/CTS1/CAP1.1/SCL1 P0.28/AD0.1/CAP0.2/MAT0.2 P1.23/PIPESTAT2 P0.29/AD0.2/CAP0.3/MAT0.3 P0.10/RTS1/CAP1.0/AD1.2 P0.30/AD0.3/EINT3/CAP0.0 P0.9/RXD1/PWM6/EINT3 P1.16/TRACEPKT0 P0.8/TXD1/PWM4/AD1.1 P0.31/UP_LED/CONNECT P1.27/TDO VSS VREF P0.0/TXD0/PWM1 XTAL1 P1.31/TRST XTAL2 P0.1/RXD0/PWM3/EINT0 P1.28/TDI P0.2/SCL0/CAP0.0 VSSA VDD P0.23/VBUS P1.26/RTCK RESET VSS P1.29/TCK P0.3/SDA0/MAT0.0/EINT1 P0.20/MAT1.3/SSEL1/EINT3 P0.4/SCK0/CAP0.1/AD0.6 P0.19/MAT1.2/MOSI1/CAP1.2 P1.25/EXTIN0 P0.18/CAP1.3/MISO1/MAT1.3 P0.5/MISO0/MAT0.1/AD0.7 P1.30/TMS P0.6/MOSI0/CAP0.2/AD1.0 VDD P0.7/SSEL0/PWM2/EINT2 VSS P1.24/TRACECLK VBAT 002aab735 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 7 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 5.2 Pin description Table 3. Pin description Symbol Pin Type Description P0.0 to P0.31 I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. Total of 31 pins of the Port 0 can be used as a general purpose bidirectional digital I/Os while P0.31 is output only pin. The operation of port 0 pins depends upon the pin function selected via the pin connect block. Pins P0.24, P0.26 and P0.27 are not available. P0.0/TXD0/ PWM1 19[1] I/O P0.0 — General purpose input/output digital pin (GPIO). O TXD0 — Transmitter output for UART0. O PWM1 — Pulse Width Modulator output 1. P0.1/RXD0/ PWM3/EINT0 21[2] I/O P0.1 — General purpose input/output digital pin (GPIO). I RXD0 — Receiver input for UART0. O PWM3 — Pulse Width Modulator output 3. I EINT0 — External interrupt 0 input. P0.2/SCL0/ CAP0.0 22[3] I/O P0.2 — General purpose input/output digital pin (GPIO). I/O SCL0 — I 2C0 clock input/output. Open-drain output (for I2C-bus compliance). I CAP0.0 — Capture input for Timer 0, channel 0. P0.3/SDA0/ MAT0.0/EINT1 26[3] I/O P0.3 — General purpose input/output digital pin (GPIO). I/O SDA0 — I 2C0 data input/output. Open-drain output (for I2C-bus compliance). O MAT0.0 — Match output for Timer 0, channel 0. I EINT1 — External interrupt 1 input. P0.4/SCK0/ CAP0.1/AD0.6 27[4] I/O P0.4 — General purpose input/output digital pin (GPIO). I/O SCK0 — Serial clock for SPI0. SPI clock output from master or input to slave. I CAP0.1 — Capture input for Timer 0, channel 1. I AD0.6 — ADC 0, input 6. P0.5/MISO0/ MAT0.1/AD0.7 29[4] I/O P0.5 — General purpose input/output digital pin (GPIO). I/O MISO0 — Master In Slave Out for SPI0. Data input to SPI master or data output from SPI slave. O MAT0.1 — Match output for Timer 0, channel 1. I AD0.7 — ADC 0, input 7. P0.6/MOSI0/ CAP0.2/AD1.0 30[4] I/O P0.6 — General purpose input/output digital pin (GPIO). I/O MOSI0 — Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave. I CAP0.2 — Capture input for Timer 0, channel 2. I AD1.0 — ADC 1, input 0. Available in LPC2144/46/48 only. P0.7/SSEL0/ PWM2/EINT2 31[2] I/O P0.7 — General purpose input/output digital pin (GPIO). I SSEL0 — Slave Select for SPI0. Selects the SPI interface as a slave. O PWM2 — Pulse Width Modulator output 2. I EINT2 — External interrupt 2 input. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 8 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P0.8/TXD1/ PWM4/AD1.1 33[4] I/O P0.8 — General purpose input/output digital pin (GPIO). O TXD1 — Transmitter output for UART1. O PWM4 — Pulse Width Modulator output 4. I AD1.1 — ADC 1, input 1. Available in LPC2144/46/48 only. P0.9/RXD1/ PWM6/EINT3 34[2] I/O P0.9 — General purpose input/output digital pin (GPIO). I RXD1 — Receiver input for UART1. O PWM6 — Pulse Width Modulator output 6. I EINT3 — External interrupt 3 input. P0.10/RTS1/ CAP1.0/AD1.2 35[4] I/O P0.10 — General purpose input/output digital pin (GPIO). O RTS1 — Request to Send output for UART1. LPC2144/46/48 only. I CAP1.0 — Capture input for Timer 1, channel 0. I AD1.2 — ADC 1, input 2. Available in LPC2144/46/48 only. P0.11/CTS1/ CAP1.1/SCL1 37[3] I/O P0.11 — General purpose input/output digital pin (GPIO). I CTS1 — Clear to Send input for UART1. Available in LPC2144/46/48 only. I CAP1.1 — Capture input for Timer 1, channel 1. I/O SCL1 — I 2C1 clock input/output. Open-drain output (for I2C-bus compliance) P0.12/DSR1/ MAT1.0/AD1.3 38[4] I/O P0.12 — General purpose input/output digital pin (GPIO). I DSR1 — Data Set Ready input for UART1. Available in LPC2144/46/48 only. O MAT1.0 — Match output for Timer 1, channel 0. I AD1.3 — ADC 1 input 3. Available in LPC2144/46/48 only. P0.13/DTR1/ MAT1.1/AD1.4 39[4] I/O P0.13 — General purpose input/output digital pin (GPIO). O DTR1 — Data Terminal Ready output for UART1. LPC2144/46/48 only. O MAT1.1 — Match output for Timer 1, channel 1. I AD1.4 — ADC 1 input 4. Available in LPC2144/46/48 only. P0.14/DCD1/ EINT1/SDA1 41[3] I/O P0.14 — General purpose input/output digital pin (GPIO). I DCD1 — Data Carrier Detect input for UART1. LPC2144/46/48 only. I EINT1 — External interrupt 1 input. I/O SDA1 — I 2C1 data input/output. Open-drain output (for I2C-bus compliance). Note: LOW on this pin while RESET is LOW forces on-chip boot loader to take over control of the part after reset. P0.15/RI1/ EINT2/AD1.5 45[4] I/O P0.15 — General purpose input/output digital pin (GPIO). I RI1 — Ring Indicator input for UART1. Available in LPC2144/46/48 only. I EINT2 — External interrupt 2 input. I AD1.5 — ADC 1, input 5. Available in LPC2144/46/48 only. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 9 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P0.16/EINT0/ MAT0.2/CAP0.2 46[2] I/O P0.16 — General purpose input/output digital pin (GPIO). I EINT0 — External interrupt 0 input. O MAT0.2 — Match output for Timer 0, channel 2. I CAP0.2 — Capture input for Timer 0, channel 2. P0.17/CAP1.2/ SCK1/MAT1.2 47[1] I/O P0.17 — General purpose input/output digital pin (GPIO). I CAP1.2 — Capture input for Timer 1, channel 2. I/O SCK1 — Serial Clock for SSP. Clock output from master or input to slave. O MAT1.2 — Match output for Timer 1, channel 2. P0.18/CAP1.3/ MISO1/MAT1.3 53[1] I/O P0.18 — General purpose input/output digital pin (GPIO). I CAP1.3 — Capture input for Timer 1, channel 3. I/O MISO1 — Master In Slave Out for SSP. Data input to SPI master or data output from SSP slave. O MAT1.3 — Match output for Timer 1, channel 3. P0.19/MAT1.2/ MOSI1/CAP1.2 54[1] I/O P0.19 — General purpose input/output digital pin (GPIO). O MAT1.2 — Match output for Timer 1, channel 2. I/O MOSI1 — Master Out Slave In for SSP. Data output from SSP master or data input to SSP slave. I CAP1.2 — Capture input for Timer 1, channel 2. P0.20/MAT1.3/ SSEL1/EINT3 55[2] I/O P0.20 — General purpose input/output digital pin (GPIO). O MAT1.3 — Match output for Timer 1, channel 3. I SSEL1 — Slave Select for SSP. Selects the SSP interface as a slave. I EINT3 — External interrupt 3 input. P0.21/PWM5/ AD1.6/CAP1.3 1[4] I/O P0.21 — General purpose input/output digital pin (GPIO). O PWM5 — Pulse Width Modulator output 5. I AD1.6 — ADC 1, input 6. Available in LPC2144/46/48 only. I CAP1.3 — Capture input for Timer 1, channel 3. P0.22/AD1.7/ CAP0.0/MAT0.0 2[4] I/O P0.22 — General purpose input/output digital pin (GPIO). I AD1.7 — ADC 1, input 7. Available in LPC2144/46/48 only. I CAP0.0 — Capture input for Timer 0, channel 0. O MAT0.0 — Match output for Timer 0, channel 0. P0.23/VBUS 58[1] I/O P0.23 — General purpose input/output digital pin (GPIO). I VBUS — Indicates the presence of USB bus power. Note: This signal must be HIGH for USB reset to occur. P0.25/AD0.4/ AOUT 9[5] I/O P0.25 — General purpose input/output digital pin (GPIO). I AD0.4 — ADC 0, input 4. O AOUT — DAC output. Available in LPC2142/44/46/48 only. P0.28/AD0.1/ CAP0.2/MAT0.2 13[4] I/O P0.28 — General purpose input/output digital pin (GPIO). I AD0.1 — ADC 0, input 1. I CAP0.2 — Capture input for Timer 0, channel 2. O MAT0.2 — Match output for Timer 0, channel 2. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 10 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P0.29/AD0.2/ CAP0.3/MAT0.3 14[4] I/O P0.29 — General purpose input/output digital pin (GPIO). I AD0.2 — ADC 0, input 2. I CAP0.3 — Capture input for Timer 0, channel 3. O MAT0.3 — Match output for Timer 0, channel 3. P0.30/AD0.3/ EINT3/CAP0.0 15[4] I/O P0.30 — General purpose input/output digital pin (GPIO). I AD0.3 — ADC 0, input 3. I EINT3 — External interrupt 3 input. I CAP0.0 — Capture input for Timer 0, channel 0. P0.31/UP_LED/ CONNECT 17[6] O P0.31 — General purpose output only digital pin (GPO). O UP_LED — USB GoodLink LED indicator. It is LOW when device is configured (non-control endpoints enabled). It is HIGH when the device is not configured or during global suspend. O CONNECT — Signal used to switch an external 1.5 k resistor under the software control. Used with the SoftConnect USB feature. Important: This is an digital output only pin. This pin MUST NOT be externally pulled LOW when RESET pin is LOW or the JTAG port will be disabled. P1.0 to P1.31 I/O Port 1: Port 1 is a 32-bit bidirectional I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. Pins 0 through 15 of port 1 are not available. P1.16/ TRACEPKT0 16[6] I/O P1.16 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT0 — Trace Packet, bit 0. P1.17/ TRACEPKT1 12[6] I/O P1.17 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT1 — Trace Packet, bit 1. P1.18/ TRACEPKT2 8[6] I/O P1.18 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT2 — Trace Packet, bit 2. P1.19/ TRACEPKT3 4[6] I/O P1.19 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACEPKT3 — Trace Packet, bit 3. P1.20/ TRACESYNC 48[6] I/O P1.20 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACESYNC — Trace Synchronization. Note: LOW on this pin while RESET is LOW enables pins P1.25:16 to operate as Trace port after reset. P1.21/ PIPESTAT0 44[6] I/O P1.21 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O PIPESTAT0 — Pipeline Status, bit 0. P1.22/ PIPESTAT1 40[6] I/O P1.22 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O PIPESTAT1 — Pipeline Status, bit 1. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 11 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers P1.23/ PIPESTAT2 36[6] I/O P1.23 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O PIPESTAT2 — Pipeline Status, bit 2. P1.24/ TRACECLK 32[6] I/O P1.24 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. O TRACECLK — Trace Clock. P1.25/EXTIN0 28[6] I/O P1.25 — General purpose input/output digital pin (GPIO). Standard I/O port with internal pull-up. I EXTIN0 — External Trigger Input. P1.26/RTCK 24[6] I/O P1.26 — General purpose input/output digital pin (GPIO). I/O RTCK — Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bidirectional pin with internal pull-up. Note: LOW on RTCK while RESET is LOW enables pins P1[31:26] to operate as Debug port after reset. P1.27/TDO 64[6] I/O P1.27 — General purpose input/output digital pin (GPIO). O TDO — Test Data out for JTAG interface. P1.28/TDI 60[6] I/O P1.28 — General purpose input/output digital pin (GPIO). I TDI — Test Data in for JTAG interface. P1.29/TCK 56[6] I/O P1.29 — General purpose input/output digital pin (GPIO). I TCK — Test Clock for JTAG interface. This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to operate. P1.30/TMS 52[6] I/O P1.30 — General purpose input/output digital pin (GPIO). I TMS — Test Mode Select for JTAG interface. P1.31/TRST 20[6] I/O P1.31 — General purpose input/output digital pin (GPIO). I TRST — Test Reset for JTAG interface. D+ 10[7] I/O USB bidirectional D+ line. D 11[7] I/O USB bidirectional D line. RESET 57[8] I External reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. XTAL1 62[9] I Input to the oscillator circuit and internal clock generator circuits. XTAL2 61[9] O Output from the oscillator amplifier. RTCX1 3[9][10] I Input to the RTC oscillator circuit. RTCX2 5[9][10] O Output from the RTC oscillator circuit. VSS 6, 18, 25, 42, 50 I Ground: 0 V reference. VSSA 59 I Analog ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. VDD 23, 43, 51 I 3.3 V power supply: This is the power supply voltage for the core and I/O ports. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 12 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers [1] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. [2] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. [3] Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output functionality. [4] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital section of the pad is disabled. [5] 5 V tolerant pad (no built-in pull-up resistor) providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog output function. When configured as the DAC output, digital section of the pad is disabled. [6] 5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. The pull-up resistor’s value typically ranges from 60 k to 300 k. [7] Pad is designed in accordance with the Universal Serial Bus (USB) specification, revision 2.0 (Full-speed and Low-speed mode only). [8] 5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only. [9] Pad provides special analog functionality. [10] When unused, the RTCX1 pin can be grounded or left floating. For lowest power leave it floating. The other RTC pin, RTCX2, should be left floating. VDDA 7 I Analog 3.3 V power supply: This should be nominally the same voltage as VDD but should be isolated to minimize noise and error. This voltage is only used to power the on-chip ADC(s) and DAC. VREF 63 I ADC reference voltage: This should be nominally less than or equal to the VDD voltage but should be isolated to minimize noise and error. Level on this pin is used as a reference for ADC(s) and DAC. VBAT 49 I RTC power supply voltage: 3.3 V on this pin supplies the power to the RTC. Table 3. Pin description …continued Symbol Pin Type Description LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 13 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6. Functional description 6.1 Architectural overview The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers (CISC). This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as Thumb, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets: • The standard 32-bit ARM set. • A 16-bit Thumb set. The Thumb set’s 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM’s performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because Thumb code operates on the same 32-bit register set as ARM code. Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the performance of an equivalent ARM processor connected to a 16-bit memory system. The particular flash implementation in the LPC2141/42/44/46/48 allows for full speed execution also in ARM mode. It is recommended to program performance critical and short code sections (such as interrupt service routines and DSP algorithms) in ARM mode. The impact on the overall code size will be minimal but the speed can be increased by 30 % over Thumb mode. 6.2 On-chip flash program memory The LPC2141/42/44/46/48 incorporate a 32 kB, 64 kB, 128 kB, 256 kB and 512 kB flash memory system respectively. This memory may be used for both code and data storage. Programming of the flash memory may be accomplished in several ways. It may be programmed In System via the serial port. The application program may also erase and/or program the flash while the application is running, allowing a great degree of flexibility for data storage field firmware upgrades, etc. Due to the architectural solution chosen for an on-chip boot loader, flash memory available for user’s code on LPC2141/42/44/46/48 is 32 kB, 64 kB, 128 kB, 256 kB and 500 kB respectively. The LPC2141/42/44/46/48 flash memory provides a minimum of 100000 erase/write cycles and 20 years of data-retention. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 14 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.3 On-chip static RAM On-chip static RAM may be used for code and/or data storage. The SRAM may be accessed as 8-bit, 16-bit, and 32-bit. The LPC2141, LPC2142/44 and LPC2146/48 provide 8 kB, 16 kB and 32 kB of static RAM respectively. In case of LPC2146/48 only, an 8 kB SRAM block intended to be utilized mainly by the USB can also be used as a general purpose RAM for data storage and code storage and execution. 6.4 Memory map The LPC2141/42/44/46/48 memory map incorporates several distinct regions, as shown in Figure 5. In addition, the CPU interrupt vectors may be remapped to allow them to reside in either flash memory (the default) or on-chip static RAM. This is described in Section 6.19 “System control”. Fig 5. LPC2141/42/44/46/48 memory map AHB PERIPHERALS VPB PERIPHERALS RESERVED ADDRESS SPACE BOOT BLOCK (12 kB REMAPPED FROM ON-CHIP FLASH MEMORY RESERVED ADDRESS SPACE 0xFFFF FFFF 0xF000 0000 0xE000 0000 0xC000 0000 0x8000 0000 0x7FFF FFFF 0x7FD0 2000 TOTAL OF 512 kB ON-CHIP NON-VOLATILE MEMORY (LPC2148) 0x0004 0000 0x0007 FFFF TOTAL OF 256 kB ON-CHIP NON-VOLATILE MEMORY (LPC2146) 0x0002 0000 0x0003 FFFF TOTAL OF 128 kB ON-CHIP NON-VOLATILE MEMORY (LPC2144) 0x0001 0000 0x0001 FFFF TOTAL OF 64 kB ON-CHIP NON-VOLATILE MEMORY (LPC2142) 0x0000 8000 0x0000 FFFF TOTAL OF 32 kB ON-CHIP NON-VOLATILE MEMORY (LPC2141) 0x0000 0000 0x0000 7FFF RESERVED ADDRESS SPACE 0x0008 0000 0x3FFF FFFF 8 kB ON-CHIP STATIC RAM (LPC2141) 0x4000 0000 0x4000 1FFF 16 kB ON-CHIP STATIC RAM (LPC2142/2144) 0x4000 2000 0x4000 3FFF 32 kB ON-CHIP STATIC RAM (LPC2146/2148) 0x4000 4000 0x4000 7FFF RESERVED ADDRESS SPACE 0x4000 8000 0x7FCF FFFF 8 kB ON-CHIP USB DMA RAM (LPC2146/2148) 0x7FD0 0000 0x7FD0 1FFF 0x7FFF D000 0x7FFF CFFF 4.0 GB 3.75 GB 3.5 GB 3.0 GB 2.0 GB 1.0 GB 0.0 GB 002aab558 LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 15 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.5 Interrupt controller The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as Fast Interrupt reQuest (FIQ), vectored Interrupt ReQuest (IRQ), and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted. FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine does not need to branch into the interrupt service routine but can run from the interrupt vector location. If more than one request is assigned to the FIQ class, the FIQ service routine will read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest. Non-vectored IRQs have the lowest priority. The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored IRQs. The default routine can read another VIC register to see what IRQs are active. 6.5.1 Interrupt sources Each peripheral device has one interrupt line connected to the Vectored Interrupt Controller, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source. 6.6 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. The Pin Control Module with its pin select registers defines the functionality of the microcontroller in a given hardware environment. After reset all pins of Port 0 and Port 1 are configured as input with the following exceptions: If debug is enabled, the JTAG pins will assume their JTAG functionality; if trace is enabled, the Trace pins will assume their trace functionality. The pins associated with the I2C0 and I2C1 interface are open drain. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 16 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.7 Fast general purpose parallel I/O (GPIO) Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins. LPC2141/42/44/46/48 introduce accelerated GPIO functions over prior LPC2000 devices: • GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte addressable. • Entire port value can be written in one instruction. 6.7.1 Features • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • Direction control of individual bits. • Separate control of output set and clear. • All I/O default to inputs after reset. 6.8 10-bit ADC The LPC2141/42 contain one and the LPC2144/46/48 contain two analog to digital converters. These converters are single 10-bit successive approximation analog to digital converters. While ADC0 has six channels, ADC1 has eight channels. Therefore, total number of available ADC inputs for LPC2141/42 is 6 and for LPC2144/46/48 is 14. 6.8.1 Features • 10 bit successive approximation analog to digital converter. • Measurement range of 0 V to VREF (2.5 V VREF VDDA). • Each converter capable of performing more than 400000 10-bit samples per second. • Every analog input has a dedicated result register to reduce interrupt overhead. • Burst conversion mode for single or multiple inputs. • Optional conversion on transition on input pin or timer match signal. • Global Start command for both converters (LPC2142/44/46/48 only). 6.9 10-bit DAC The DAC enables the LPC2141/42/44/46/48 to generate a variable analog output. The maximum DAC output voltage is the VREF voltage. 6.9.1 Features • 10-bit DAC. • Buffered output. • Power-down mode available. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 17 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers • Selectable speed versus power. 6.10 USB 2.0 device controller The USB is a 4-wire serial bus that supports communication between a host and a number (127 max) of peripherals. The host controller allocates the USB bandwidth to attached devices through a token based protocol. The bus supports hot plugging, unplugging, and dynamic configuration of the devices. All transactions are initiated by the host controller. The LPC2141/42/44/46/48 is equipped with a USB device controller that enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory and DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate end point buffer memory. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. A DMA controller (available in LPC2146/48 only) can transfer data between an endpoint buffer and the USB RAM. 6.10.1 Features • Fully compliant with USB 2.0 Full-speed specification. • Supports 32 physical (16 logical) endpoints. • Supports control, bulk, interrupt and isochronous endpoints. • Scalable realization of endpoints at run time. • Endpoint maximum packet size selection (up to USB maximum specification) by software at run time. • RAM message buffer size based on endpoint realization and maximum packet size. • Supports SoftConnect and GoodLink LED indicator. These two functions are sharing one pin. • Supports bus-powered capability with low suspend current. • Supports DMA transfer on all non-control endpoints (LPC2146/48 only). • One duplex DMA channel serves all endpoints (LPC2146/48 only). • Allows dynamic switching between CPU controlled and DMA modes (only in LPC2146/48). • Double buffer implementation for bulk and isochronous endpoints. 6.11 UARTs The LPC2141/42/44/46/48 each contain two UARTs. In addition to standard transmit and receive data lines, the LPC2144/46/48 UART1 also provides a full modem control handshake interface. Compared to previous LPC2000 microcontrollers, UARTs in LPC2141/42/44/46/48 introduce a fractional baud rate generator for both UARTs, enabling these microcontrollers to achieve standard baud rates such as 115200 with any crystal frequency above 2 MHz. In addition, auto-CTS/RTS flow-control functions are fully implemented in hardware (UART1 in LPC2144/46/48 only). LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 18 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.11.1 Features • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Transmission FIFO control enables implementation of software (XON/XOFF) flow control on both UARTs. • LPC2144/46/48 UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). 6.12 I2C-bus serial I/O controller The LPC2141/42/44/46/48 each contain two I2C-bus controllers. The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line (SCL), and a Serial DAta line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver or a transmitter with the capability to both receive and send information (such as memory)). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus, it can be controlled by more than one bus master connected to it. The I2C-bus implemented in LPC2141/42/44/46/48 supports bit rates up to 400 kbit/s (Fast I2C-bus). 6.12.1 Features • Compliant with standard I2C-bus interface. • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. 6.13 SPI serial I/O controller The LPC2141/42/44/46/48 each contain one SPI controller. The SPI is a full duplex serial interface, designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 19 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.13.1 Features • Compliant with SPI specification. • Synchronous, Serial, Full Duplex, Communication. • Combined SPI master and slave. • Maximum data bit rate of one eighth of the input clock rate. 6.14 SSP serial I/O controller The LPC2141/42/44/46/48 each contain one Serial Synchronous Port controller (SSP). The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. However, only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full duplex transfers, with data frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. Often only one of these data flows carries meaningful data. 6.14.1 Features • Compatible with Motorola’s SPI, TI’s 4-wire SSI and National Semiconductor’s Microwire buses. • Synchronous serial communication. • Master or slave operation. • 8-frame FIFOs for both transmit and receive. • Four bits to 16 bits per frame. 6.15 General purpose timers/external event counters The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an externally supplied clock and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. Multiple pins can be selected to perform a single capture or match function, providing an application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them. The LPC2141/42/44/46/48 can count external events on one of the capture inputs if the minimum external pulse is equal or longer than a period of the PCLK. In this configuration, unused capture lines can be selected as regular timer capture inputs, or used as external interrupts. 6.15.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • External event counter or timer operation. • Four 32-bit capture channels per timer/counter that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 20 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Four external outputs per timer/counter corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. 6.16 Watchdog timer The purpose of the watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the watchdog will generate a system reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined amount of time. 6.16.1 Features • Internally resets chip if not periodically reloaded. • Debug mode. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 32-bit timer with internal pre-scaler. • Selectable time period from (Tcy(PCLK) 256 4) to (Tcy(PCLK) 232 4) in multiples of Tcy(PCLK) 4. 6.17 Real-time clock The RTC is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode). 6.17.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra-low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year. • Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the external crystal/oscillator input at XTAL1. Programmable reference clock divider allows fine adjustment of the RTC. • Dedicated power supply pin can be connected to a battery or the main 3.3 V. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 21 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.18 Pulse width modulator The PWM is based on the standard timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2141/42/44/46/48. The timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is also based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions. Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 6.18.1 Features • Seven match registers allow up to six single edge controlled or three double edge controlled PWM outputs, or a mix of both types. • The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 22 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard timer if the PWM mode is not enabled. • A 32-bit Timer/Counter with a programmable 32-bit Prescaler. 6.19 System control 6.19.1 Crystal oscillator On-chip integrated oscillator operates with external crystal in range of 1 MHz to 25 MHz. The oscillator output frequency is called fosc and the ARM processor clock frequency is referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same value unless the PLL is running and connected. Refer to Section 6.19.2 “PLL” for additional information. 6.19.2 PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. The PLL settling time is 100 s. 6.19.3 Reset and wake-up timer Reset has two sources on the LPC2141/42/44/46/48: the RESET pin and watchdog reset. The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip flash controller has completed its initialization. When the internal reset is removed, the processor begins executing at address 0, which is the reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values. The Wake-up Timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power on, all types of reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 23 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 6.19.4 Brownout detector The LPC2141/42/44/46/48 include 2-stage monitoring of the voltage on the VDD pins. If this voltage falls below 2.9 V, the BOD asserts an interrupt signal to the VIC. This signal can be enabled for interrupt; if not, software can monitor the signal by reading dedicated register. The second stage of low voltage detection asserts reset to inactivate the LPC2141/42/44/46/48 when the voltage on the VDD pins falls below 2.6 V. This reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the POR circuitry maintains the overall reset. Both the 2.9 V and 2.6 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.9 V detection to reliably interrupt, or a regularly-executed event loop to sense the condition. 6.19.5 Code security This feature of the LPC2141/42/44/46/48 allow an application to control whether it can be debugged or protected from observation. If after reset on-chip boot loader detects a valid checksum in flash and reads 0x8765 4321 from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be protected from observation. Once debugging is disabled, it can be enabled only by performing a full chip erase using the ISP. 6.19.6 External interrupt inputs The LPC2141/42/44/46/48 include up to nine edge or level sensitive External Interrupt Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake-up the processor from Power-down mode. Additionally capture input pins can also be used as external interrupts without the option to wake the device up from Power-down mode. 6.19.7 Memory mapping control The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip flash memory, or to the on-chip static RAM. This allows code running in different memory spaces to have control of the interrupts. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 24 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 6.19.8 Power control The LPC2141/42/44/46/48 supports two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses. In Power-down mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero. Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip RTC will enable the microcontroller to have the RTC active during Power-down mode. Power-down current is increased with RTC active. However, it is significantly lower than in Idle mode. A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings during active and Idle mode. 6.19.9 APB bus The APB divider determines the relationship between the processor clock (CCLK) and the clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first is to provide peripherals with the desired PCLK via APB bus so that they can operate at the speed chosen for the ARM processor. In order to achieve this, the APB bus may be slowed down to 12 to 14 of the processor clock rate. Because the APB bus must work properly at power-up (and its timing cannot be altered if it does not work since the APB divider control registers reside on the APB bus), the default condition at reset is for the APB bus to run at 14 of the processor clock rate. The second purpose of the APB divider is to allow power savings when an application does not require any peripherals to run at the full processor rate. Because the APB divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode. 6.20 Emulation and debugging The LPC2141/42/44/46/48 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself. 6.20.1 EmbeddedICE Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the remote debug protocol commands to the JTAG data needed to access the ARM core. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 25 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers The ARM core has a Debug Communication Channel (DCC) function built-in. The DCC allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The DCC is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The DCC allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The DCC data and control registers are mapped in to addresses in the EmbeddedICE logic. This clock must be slower than 16 of the CPU clock (CCLK) for the JTAG interface to operate. 6.20.2 Embedded trace Since the LPC2141/42/44/46/48 have significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The Embedded Trace Macrocell (ETM) provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction. 6.20.3 RealMonitor RealMonitor is a configurable software module, developed by ARM Inc., which enables real-time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC, which is present in the EmbeddedICE logic. The LPC2141/42/44/46/48 contain a specific configuration of RealMonitor software programmed into the on-chip flash memory. LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 26 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 7. Limiting values [1] The following applies to the Limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] Not to exceed 4.6 V. [4] The peak current is limited to 25 times the corresponding maximum current. [5] Dependent on package type. [6] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) 0.5 +3.6 V VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V Vi(VREF) input voltage on pin VREF 0.5 +4.6 V VIA analog input voltage on ADC related pins 0.5 +5.1 V VI input voltage 5 V tolerant I/O pins; only valid when the VDD supply voltage is present [2] 0.5 +6.0 V other I/O pins [2][3] 0.5 VDD + 0.5 V IDD supply current per supply pin [4] - 100 mA ISS ground current per ground pin [4] - 100 mA Isink sink current for I2C-bus; DC; T = 85 C - 20 mA Tstg storage temperature [5] 65 +150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W Vesd electrostatic discharge voltage human body model [6] all pins 4000 +4000 V LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 27 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers 8. Static characteristics Table 5. Static characteristics Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit VDD supply voltage [2] 3.0 3.3 3.6 V VDDA analog supply voltage 3.3 V pad 3.0 3.3 3.6 V Vi(VBAT) input voltage on pin VBAT [3] 2.0 3.3 3.6 V Vi(VREF) input voltage on pin VREF 2.5 3.3 VDDA V Standard port pins, RESET, P1.26/RTCK IIL LOW-level input current VI = 0 V; no pull-up - - 3 A IIH HIGH-level input current VI = VDD; no pull-down - - 3 A IOZ OFF-state output current VO = 0 V; VO = VDD; no pull-up/down --3 A Ilatch I/O latch-up current (0.5VDD) < VI < (1.5VDD); Tj < 125 C - - 100 mA VI input voltage pin configured to provide a digital function [4][5][6] [7] 0- 5.5 V VO output voltage output active 0 - VDD V VIH HIGH-level input voltage 2.0 - - V VIL LOW-level input voltage - - 0.8 V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage IOH = 4 mA [8] VDD 0.4 - - V VOL LOW-level output voltage IOL = 4 mA [8] --0.4 V IOH HIGH-level output current VOH = VDD 0.4 V [8] 4 - - mA IOL LOW-level output current VOL = 0.4 V [8] 4- - mA IOHS HIGH-level short-circuit output current VOH =0V [9] - - 45 mA IOLS LOW-level short-circuit output current VOL = VDDA [9] --50 mA Ipd pull-down current VI =5V [10] 10 50 150 A Ipu pull-up current VI =0V [11] 15 50 85 A VDD < VI <5V [10] 000 A LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 28 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers IDD(act) active mode supply current VDD = 3.3 V; Tamb = 25 C; code while(1){} executed from flash, no active peripherals CCLK = 10 MHz - 15 50 mA CCLK = 60 MHz - 40 70 mA VDD = 3.3 V; Tamb = 25 C; code executed from flash; USB enabled and active; all other peripherals disabled CCLK = 12 MHz - 27 70 mA CCLK = 60 MHz - 57 90 mA IDD(pd) Power-down mode supply current VDD = 3.3 V; Tamb = 25 C - 40 100 A VDD = 3.3 V; Tamb = 85 C -250 500 A IBATpd Power-down mode battery supply current RTC clock = 32 kHz (from RTCXn pins); Tamb = 25 C VDD = 3.0 V; Vi(VBAT) = 2.5 V [12] - 15 30 A VDD = 3.0 V; Vi(VBAT) = 3.0 V - 20 40 A IBATact active mode battery supply current CCLK = 60 MHz; PCLK = 15 MHz; PCLK enabled to RTCK; RTC clock = 32 kHz (from RTCXn pins); Tamb = 25 C VDD = 3.0 V; Vi(VBAT) = 3.0 V [12] - 78 - A IBATact(opt) optimized active mode battery supply current PCLK disabled to RTCK in the PCONP register; RTC clock = 32 kHz (from RTCXn pins); Tamb = 25 C; Vi(VBAT) = 3.3 V CCLK = 25 MHz [12][13] - 23 - A CCLK = 60 MHz - 30 - A I 2C-bus pins VIH HIGH-level input voltage 0.7VDD --V VIL LOW-level input voltage - - 0.3VDD V Vhys hysteresis voltage - 0.05VDD - V VOL LOW-level output voltage IOLS = 3 mA [8] --0.4 V ILI input leakage current VI = VDD [14] - 24 A VI = 5 V - 10 22 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 1.8 1.95 V Table 5. Static characteristics …continued Tamb = 40 C to +85 C for commercial applications, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC2141_42_44_46_48 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 12 August 2011 29 of 45 NXP Semiconductors LPC2141/42/44/46/48 Single-chip 16-bit/32-bit microcontrollers [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Core and external rail. [3] The RTC typically fails when Vi(VBAT) drops below 1.6 V. [4] Including voltage on outputs in 3-state mode. [5] VDD supply voltages must be present. [6] 3-state outputs go into 3-state mode when VDD is grounded. [7] Please also see the errata note mentioned in errata sheet. [8] Accounts for 100 mV voltage drop in all supply lines. [9] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [10] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. [11] Applies to P1.16 to P1.31. [12] On pin VBAT. [13] Optimized for low battery consumption. [14] To VSS. [15] Includes external resistors of 33 ± 1 % on D+ and D. Vo(XTAL2) output voltage on pin XTAL2 0.5 1.8 1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 1.8 1.95 V Vo(RTCX2) output voltage on pin RTCX2 0.5 1.8 1.95 V USB pins IOZ OFF-state output current 0V 85 C [12] 15 50 100 A VDD(3V3) < VI <5V [11] 00 0 A I 2C-bus pins (P0[27] and P0[28]) VIH HIGH-level input voltage 0.7VDD(3V3) - -V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage - 0.05VDD(3V3) - V VOL LOW-level output voltage IOLS = 3 mA [9] -- 0.4 V ILI input leakage current VI = VDD(3V3) [13] -2 4 A VI = 5 V - 10 22 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 1.8 1.95 V Vo(XTAL2) output voltage on pin XTAL2 0.5 1.8 1.95 V Vi(RTCX1) input voltage on pin RTCX1 0.5 1.8 1.95 V Vo(RTCX2) output voltage on pin RTCX2 0.5 1.8 1.95 V Table 8. Static characteristics …continued Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 43 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] The RTC typically fails when Vi(VBAT) drops below 1.6 V. [3] VDD(DCDC)(3V3) = 3.3 V; VDD(3V3) = 3.3 V; Vi(VBAT) = 3.3 V; Tamb = 25 C. [4] On pin VBAT. [5] Including voltage on outputs in 3-state mode. [6] VDD(3V3) supply voltages must be present. [7] 3-state outputs go into 3-state mode when VDD(3V3) is grounded. [8] Please also see the errata note in errata sheet. [9] Accounts for 100 mV voltage drop in all supply lines. [10] Allowed as long as the current limit does not exceed the maximum current allowed by the device. [11] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V. [12] LPC2364HBD only. [13] To VSS. [14] Includes external resistors of 33 1 % on D+ and D. USB pins (LPC2364/66/68 only) IOZ OFF-state output current 0V 85 C [3] 1 -60 MHz IRC; 40 C to +85 C 3.96 4 4.04 MHz IRC; > 85 C [3] 3.98 4.02 4.06 MHz External clock fosc oscillator frequency 1 - 25 MHz Tcy(clk) clock cycle time 40 - 1000 ns tCHCX clock HIGH time Tcy(clk) 0.4 - - ns tCLCX clock LOW time Tcy(clk) 0.4 - - ns tCLCH clock rise time - - 5 ns tCHCL clock fall time - - 5 ns I 2C-bus pins (P0[27] and P0[28]) tf(o) output fall time VIH to VIL 20 + 0.1 Cb [4] - - ns SSP interface tsu(SPI_MISO) SPI_MISO set-up time Tamb = 25 C; measured in SPI Master mode; see Figure 15 - 11- ns Fig 13. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV) tCHCL tCLCX tCHCX Tcy(clk) tCLCH 002aaa907 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 49 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 11.1 Internal oscillators [1] Parameters are valid over operating temperature range unless otherwise specified. [2] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. 11.2 I/O pins [1] Applies to standard I/O pins and RESET pin. 11.3 USB interface [1] Characterized but not implemented as production test. Guaranteed by design. Table 10. Dynamic characteristic: internal oscillators Tamb = 40 C to +85 C; 3.0 V VDD(3V3) 3.6 V.[1] Symbol Parameter Conditions Min Typ[2] Max Unit fosc(RC) internal RC oscillator frequency - 3.96 4.02 4.04 MHz fi(RTC) RTC input frequency - - 32.768 - kHz Table 11. Dynamic characteristic: I/O pins[1] Tamb = 40 C to +85 C; VDD(3V3) over specified ranges. Symbol Parameter Conditions Min Typ Max Unit tr rise time pin configured as output 3.0 - 5.0 ns tf fall time pin configured as output 2.5 - 5.0 ns Table 12. Dynamic characteristics of USB pins (full-speed) (LPC2364/66/68 only) CL = 50 pF; Rpu = 1.5 k on D+ to VDD(3V3), unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr / tf - -109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 14 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 14 2 - +5 ns tJR1 receiver jitter to next transition 18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns tEOPR1 EOP width at receiver must reject as EOP; see Figure 14 [1] 40 - - ns tEOPR2 EOP width at receiver must accept as EOP; see Figure 14 [1] 82 - - ns LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 50 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 11.4 Flash memory [1] Number of program/erase cycles. [2] Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash in blocks of 256 bytes. Table 13. Dynamic characteristics of flash Tamb = 40 C to +85 C for standard devices, 40 C to +125 C for LPC2364HBD only, unless otherwise specified; VDD(3V3) = 3.0 V to 3.6 V; all voltages are measured with respect to ground. Symbol Parameter Conditions Min Typ Max Unit Nendu endurance [1] 10000 100000 - cycles tret retention time powered; 100 cycles 10 - - years unpowered; 100 cycles 20 - - years ter erase time sector or multiple consecutive sectors 95 100 105 ms tprog programming time [2] 0.95 1 1.05 ms LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 51 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 11.5 Timing Fig 14. Differential data-to-EOP transition skew and EOP width 002aab561 TPERIOD differential data lines crossover point source EOP width: tFEOPT receiver EOP width: tEOPR1, tEOPR2 crossover point extended differential data to SE0/EOP skew n × TPERIOD + tFDEOP Fig 15. MISO line set-up time in SSP Master mode tsu(SPI_MISO) SCK shifting edges MOSI MISO 002aad326 sampling edges LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 52 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 12. ADC electrical characteristics [1] Conditions: VSSA = 0 V, VDDA = 3.3 V. [2] The ADC is monotonic, there are no missing codes. [3] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 16. [4] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 16. [5] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 16. [6] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 16. [7] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 16. [8] See Figure 17. Table 14. ADC characteristics VDDA = 2.5 V to 3.6 V; Tamb = 40 C to +85 C, unless otherwise specified; ADC frequency 4.5 MHz. Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA V Cia analog input capacitance - - 1 pF ED differential linearity error [1][2][3] - - 1 LSB EL(adj) integral non-linearity [1][4] - - 2 LSB EO offset error [1][5] - - 3 LSB EG gain error [1][6] - - 0.5 % ET absolute error [1][7] - - 4 LSB Rvsi voltage source interface resistance [8] --40 k LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 53 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 16. ADC characteristics 1023 1022 1021 1020 1019 (2) (1) 123456 7 1018 1019 1020 1021 1022 1023 1024 7 6 5 4 3 2 1 0 1018 (5) (4) (3) 1 LSB (ideal) code out offset error EO gain error EG offset error EO VIA (LSBideal) 002aae604 Vi(VREF) − VSSA 1024 1 LSB = LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 54 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Fig 17. Suggested ADC interface - LPC2364/65/66/67/68 AD0[y] pin LPC23XX AD0[y]SAMPLE AD0[y] 20 kΩ 3 pF 5 pF Rvsi VSS VEXT 002aac610 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 55 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 13. DAC electrical characteristics 14. Application information 14.1 Suggested USB interface solutions (LPC2364/66/68 only) Table 15. DAC electrical characteristics VDDA = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ED differential linearity error - 1 - LSB EL(adj) integral non-linearity - 1.5 - LSB EO offset error - 0.6 - % EG gain error - 0.6 - % CL load capacitance - 200 - pF RL load resistance 1 - - k Fig 18. LPC2364/66/68 USB interface on a self-powered device LPC23XX USB-B connector USB_D+ USB_CONNECT SoftConnect switch USB_D− VBUS VSS VDD(3V3) R1 1.5 kΩ RS = 33 Ω 002aac578 RS = 33 Ω USB_UP_LED LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 56 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.2 Crystal oscillator XTAL input and component selection The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a clock in slave mode, it is recommended that the input be coupled through a capacitor with Ci = 100 pF. To limit the input voltage to the specified range, choose an additional capacitor to ground Cg which attenuates the input voltage by a factor Ci / (Ci + Cg). In slave mode, a minimum of 200 mV (RMS) is needed. In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF (Figure 20), with an amplitude between 200 mV (RMS) and 1000 mV (RMS). This corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V. The XTAL2 pin in this configuration can be left unconnected. External components and models used in oscillation mode are shown in Figure 21 and in Table 16 and Table 17. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation (the fundamental frequency is represented by L, CL and RS). Capacitance CP in Figure 21 represents the parallel package capacitance and should not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal manufacturer. Fig 19. LPC2364/66/68 USB interface on a bus-powered device LPC23XX VDD(3V3) R1 1.5 kΩ R2 USB_UP_LED 002aac579 USB-B connector USB_D+ USB_D− VBUS VSS RS = 33 Ω RS = 33 Ω Fig 20. Slave mode operation of the on-chip oscillator LPC2xxx XTAL1 Ci 100 pF Cg 002aae718 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 57 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Fig 21. Oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 16. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): low frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1/CX2 1 MHz to 5 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 300 39 pF, 39 pF 30 pF < 300 57 pF, 57 pF 5 MHz to 10 MHz 10 pF < 300 18 pF, 18 pF 20 pF < 200 39 pF, 39 pF 30 pF < 100 57 pF, 57 pF 10 MHz to 15 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 60 39 pF, 39 pF 15 MHz to 20 MHz 10 pF < 80 18 pF, 18 pF Table 17. Recommended values for CX1/CX2 in oscillation mode (crystal and external components parameters): high frequency mode Fundamental oscillation frequency FOSC Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1, CX2 15 MHz to 20 MHz 10 pF < 180 18 pF, 18 pF 20 pF < 100 39 pF, 39 pF 20 MHz to 25 MHz 10 pF < 160 18 pF, 18 pF 20 pF < 80 39 pF, 39 pF 002aag469 LPC2xxx XTAL1 XTAL2 CX1 CX2 XTAL = CL CP RS L LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 58 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.3 RTC 32 kHz oscillator component selection The RTC external oscillator circuit is shown in Figure 22. Since the feedback resistance is integrated on chip, only a crystal, the capacitances CX1 and CX2 need to be connected externally to the microcontroller. Table 18 gives the crystal parameters that should be used. CL is the typical load capacitance of the crystal and is usually specified by the crystal manufacturer. The actual CL influences oscillation frequency. When using a crystal that is manufactured for a different load capacitance, the circuit will oscillate at a slightly different frequency (depending on the quality of the crystal) compared to the specified one. Therefore for an accurate time reference it is advised to use the load capacitors as specified in Table 18 that belong to a specific CL. The value of external capacitances CX1 and CX2 specified in this table are calculated from the internal parasitic capacitances and the CL. Parasitics from PCB and package are not taken into account. 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines The crystal should be connected on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. The external components must also be connected to the ground plain. Loops must be made as small as possible in order to keep the noise coupled in via the PCB as small as possible. Also parasitics should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller accordingly to the increase in parasitics of the PCB layout. Fig 22. RTC oscillator modes and models: oscillation mode of operation and external crystal model used for CX1/CX2 evaluation Table 18. Recommended values for the RTC external 32 kHz oscillator CX1/CX2 components Crystal load capacitance CL Maximum crystal series resistance RS External load capacitors CX1/CX2 11 pF < 100 k 18 pF, 18 pF 13 pF < 100 k 22 pF, 22 pF 15 pF < 100 k 27 pF, 27 pF 002aaf495 LPC2xxx RTCX1 RTCX2 CX1 CX2 32 kHz XTAL = CL CP RS L LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 59 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.5 Standard I/O pin configuration Figure 23 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Analog input (for ADC input channels) The default configuration for standard I/O pins is input with pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. Fig 23. Standard I/O pin configuration with analog input PIN VDD ESD VSS ESD VDD weak pull-up weak pull-down output enable output pull-up enable pull-down enable data input analog input select analog input 002aaf496 pin configured as digital output driver pin configured as digital input pin configured as analog input LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 60 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 14.6 Reset pin configuration Fig 24. Reset pin configuration VSS reset 002aaf274 VDD VDD VDD Rpu ESD ESD 20 ns RC GLITCH FILTER PIN LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 61 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 15. Package outline Fig 25. Package outline SOT407-1 (LQFP100) UNIT A max. A1 A2 A3 bp c E(1) e HE L Lp ywv Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 1.6 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 14.1 13.9 0.5 16.25 15.75 1.15 0.85 7 0 o 1 0.2 0.08 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT407-1 136E20 MS-026 00-02-01 03-02-20 D(1) (1)(1) 14.1 13.9 HD 16.25 15.75 Z E 1.15 0.85 D bp e θ E A1 A Lp detail X L (A ) 3 B 25 c DH bp EH A2 v M B D ZD A ZE e v M A X 1 100 76 75 51 50 26 y pin 1 index w M w M 0 5 10 mm scale LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm SOT407-1 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 62 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Fig 26. Package outline SOT926-1 (TFBGA100) OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT926-1 - - - - - - - - - SOT926-1 05-12-09 05-12-22 UNIT A max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 A1 DIMENSIONS (mm are the original dimensions) TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm A2 b D E e2 7.2 e 0.8 e1 7.2 v 0.15 w 0.05 y 0.08 y1 0.1 0 2.5 5 mm scale b e2 e1 e e 1/2 e 1/2 e ∅ v M AC B ∅ w M C ball A1 index area A B C D E F H K G J 13579 2 4 6 8 10 ball A1 index area B A E D C y1 C y X detail X A A1 A2 LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 63 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 16. Abbreviations Table 19. Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus AMBA Advanced Microcontroller Bus Architecture APB Advanced Peripheral Bus BOD BrownOut Detection CAN Controller Area Network DAC Digital-to-Analog Converter DCC Debug Communication Channel DMA Direct Memory Access DSP Digital Signal Processing EOP End Of Packet ETM Embedded Trace Macrocell GPIO General Purpose Input/Output IrDA Infrared Data Association JTAG Joint Test Action Group MII Media Independent Interface MIIM Media Independent Interface Management PHY Physical Layer PLL Phase-Locked Loop PWM Pulse Width Modulator RMII Reduced Media Independent Interface SE0 Single Ended Zero SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port TTL Transistor-Transistor Logic UART Universal Asynchronous Receiver/Transmitter USB Universal Serial Bus LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 64 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 17. Revision history Table 20. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC2364_65_66_67_68 v.7.1 20131016 Product data sheet - LPC2364_65_66_67_68 v.7 Modifications: • Table 4 “Pin description”, Table note 6: Changed glitch filter spec from 5 ns to 10 ns. • Table 9 “Dynamic characteristics”: Changed min clock cycle time from 42 to 40. LPC2364_65_66_67_68 v.7 20111020 Product data sheet - LPC2364_65_66_67_68 v.6 Modifications: • Table 13 “Dynamic characteristics of flash”: Added characteristics for ter and tprog. • Table 4 “Pin description”: Updated description for USB_UP_LED. • Table 4 “Pin description”: Added Table note 12 “If the RTC is not used, these pins can be left floating.” for RTCX1 and RTCX2 pins. • Table 4 “Pin description”: Added Table note 8 “This pin has a built-in pull-up resistor.” for DBGEN, TMS, TDI, TRST, and RTCK pins. • Table 4 “Pin description”: Added Table note 7 “This pin has no built-in pull-up and no built-in pull-down resistor.” for TCK and TDO pins. • Table 5 “Limiting values”: Added “non-operating” to conditions column of Tstg. • Table 5 “Limiting values”: Updated Table note 5 “The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details.”. • Table 5 “Limiting values”: Updated storage temperature min/max to 65/+150. • Added Table 7 “Thermal resistance value (C/W): ±15 %”. • Added Table 10 “Dynamic characteristic: internal oscillators”. • Added Table 11 “Dynamic characteristic: I/O pins[1]”. • Table 8 “Static characteristics”: Changed Vhys typ value from 0.5VDD(3V3) to 0.05VDD(3V3). • Table 13 “Dynamic characteristics of flash”: Updated table. • Added Section 9 “Thermal characteristics”. • Added Section 10.3 “Electrical pin characteristics”. • Added Section 14.2 “Crystal oscillator XTAL input and component selection”. • Added Section 14.3 “RTC 32 kHz oscillator component selection”. • Added Section 14.4 “XTAL and RTCX Printed Circuit Board (PCB) layout guidelines”. • Added Section 14.5 “Standard I/O pin configuration”. • Added Section 14.6 “Reset pin configuration”. LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 65 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers LPC2364_65_66_67_68 v.6 20100201 Product data sheet - LPC2364_65_66_67_68 v.5 Modifications: • Table 5 “Limiting values”: Changed VESD min/max to 2500/+2500. • Table 6: Updated min, typical and max values for oscillator pins. • Table 6: Updated conditions and typical values for IDD(DCDC)pd(3V3), IBATact; IDD(DCDC)dpd(3V3) and IBAT added. • Table 9 “Dynamic characteristics of flash”: Changed flash endurance spec from 100000 to 10000 minimum cycles. • Added Table 11 “DAC electrical characteristics”. • Section 7.2 “On-chip flash programming memory”: Removed text regarding flash endurance minimum specs. • Added Section 7.24.4.4 “Deep power-down mode”. • Section 7.25.2 “Brownout detection”: Changed VDD(3V3) to VDD(DCDC)(3V3). • Added Section 9.2 “Deep power-down mode”. • Added Section 13.2 “XTAL1 input”. • Added Section 13.3 “XTAL and RTC Printed-Circuit Board (PCB) layout guidelines”. • Added table note for XTAL1 and XTAL2 pins in Table 3. LPC2364_65_66_67_68 v.5 20090409 Product data sheet - LPC2364_65_66_67_68 v.4 Modifications: • Added part LPC2364HBD100. • Section 7.2: Added sentence clarifying SRAM speeds for LPC2364HBD. • Table 5: Updated Vesd min/max. • Table 6: Updated ZDRV Table note [14]. • Table 6: Vhys, moved 0.4 from typ to min column. • Table 6: Ipu, added specs for >85 C. • Table 6: Removed Rpu. • Table 7: CCLK and IRC, added specs for >85 C. • Added Table 9. • Updated Figure 14. • Updated Figure 11. LPC2364_65_66_67_68 v.4 20080417 Product data sheet - LPC2364_66_68 v.3 LPC2364_66_68 v.3 20071220 Product data sheet - LPC2364_66_68 v.2 LPC2364_66_68 v.2 20071001 Preliminary data sheet - LPC2364_66_68 v.1 LPC2364_66_68 v.1 20070103 Preliminary data sheet - - Table 20. Revision history …continued Document ID Release date Data sheet status Change notice Supersedes LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 66 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 18. Legal information 18.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 67 of 69 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I 2C-bus — logo is a trademark of NXP B.V. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com LPC2364_65_66_67_68 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved. Product data sheet Rev. 7.1 — 16 October 2013 68 of 69 continued >> NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10 7 Functional description . . . . . . . . . . . . . . . . . . 18 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 18 7.2 On-chip flash programming memory . . . . . . . 19 7.3 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 19 7.4 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.5 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 20 7.5.1 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 21 7.6 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 21 7.7 General purpose DMA controller . . . . . . . . . . 21 7.7.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.8 Fast general purpose parallel I/O . . . . . . . . . . 22 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.9 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.10 USB interface (LPC2364/66/68 only) . . . . . . . 24 7.10.1 USB device controller . . . . . . . . . . . . . . . . . . . 24 7.10.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.11 CAN controller and acceptance filters (LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 25 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.12 10-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.13 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.14 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.15 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 26 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.16 SSP serial I/O controller . . . . . . . . . . . . . . . . . 27 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.17 SD/MMC card interface (LPC2367/68 only) . . 27 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.18 I2C-bus serial I/O controllers. . . . . . . . . . . . . . 27 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.19 I2S-bus serial I/O controllers. . . . . . . . . . . . . . 28 7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.20 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 29 7.20.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.21 Pulse width modulator . . . . . . . . . . . . . . . . . . 29 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.22 Watchdog timer . . . . . . . . . . . . . . . . . . . . . . . 30 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 7.23 RTC and battery RAM . . . . . . . . . . . . . . . . . . 31 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 7.24 Clocking and power control . . . . . . . . . . . . . . 31 7.24.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 31 7.24.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 32 7.24.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.2 PLL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 32 7.24.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.24.4.1 Idle mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.24.4.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 33 7.24.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 34 7.24.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 34 7.24.4.5 Power domains . . . . . . . . . . . . . . . . . . . . . . . 34 7.25 System control . . . . . . . . . . . . . . . . . . . . . . . . 35 7.25.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 7.25.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 35 7.25.3 Code security (Code Read Protection - CRP) . . . . . . . . . . . 36 7.25.4 AHB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 7.25.5 External interrupt inputs . . . . . . . . . . . . . . . . . 36 7.25.6 Memory mapping control . . . . . . . . . . . . . . . . 37 7.26 Emulation and debugging . . . . . . . . . . . . . . . 37 7.26.1 EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . . 37 7.26.2 Embedded trace. . . . . . . . . . . . . . . . . . . . . . . 37 7.26.3 RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . . 38 8 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 39 9 Thermal characteristics . . . . . . . . . . . . . . . . . 40 10 Static characteristics . . . . . . . . . . . . . . . . . . . 41 10.1 Power-down mode . . . . . . . . . . . . . . . . . . . . . 44 10.2 Deep power-down mode . . . . . . . . . . . . . . . . 45 10.3 Electrical pin characteristics. . . . . . . . . . . . . . 47 11 Dynamic characteristics. . . . . . . . . . . . . . . . . 48 11.1 Internal oscillators . . . . . . . . . . . . . . . . . . . . . 49 11.2 I/O pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 11.3 USB interface. . . . . . . . . . . . . . . . . . . . . . . . . 49 11.4 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . 50 11.5 Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 12 ADC electrical characteristics . . . . . . . . . . . . 52 13 DAC electrical characteristics . . . . . . . . . . . . 55 14 Application information . . . . . . . . . . . . . . . . . 55 NXP Semiconductors LPC2364/65/66/67/68 Single-chip 16-bit/32-bit microcontrollers © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 October 2013 Document identifier: LPC2364_65_66_67_68 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 14.1 Suggested USB interface solutions (LPC2364/66/68 only). . . . . . . . . . . . . . . . . . . 55 14.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 14.3 RTC 32 kHz oscillator component selection. . 58 14.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . 58 14.5 Standard I/O pin configuration . . . . . . . . . . . . 59 14.6 Reset pin configuration. . . . . . . . . . . . . . . . . . 60 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 61 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 63 17 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 64 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 66 18.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 66 18.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 18.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 18.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 67 19 Contact information. . . . . . . . . . . . . . . . . . . . . 67 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 ©2002 Fairchild Semiconductor Corporation www.fairchildsemi.com Rev. 1.0.1 Features • 5V ±1% Reference • Oscillator Sync Terminal • Internal Soft Start • Deadtime Control • Under Voltage Lockout Description The KA3525A is a monolithic integrated circuit that includes all of the control circuits necessary for a pulse width modulating regulator. There are a voltage reference, an error amplifier, a pulse width modulator, an oscillator, an under voltage lockout, a soft start circuit, and the output driver in the chip. 16-DIP 1 Internal Block Diagram 16 15 12 1 2 9 8 10 5 7 3 6 4 14 11 13 U.V.L.O. BAND GAP REF 5V LATCH S R F/F Q Q 5K VC OUTPUT A OUTPUT B OSCILLATOR DISCHARGE 5K ERR AMP PWM COMP _ + _ + CT VREF VCC GND EA(-) EA(+) EAOUT C (SOFT START) SHUT DOWN SYNC RT OSC OUTPUT KA3525A SMPS Controller KA3525A 2 Absolute Maximum Ratings Electrical Characteristics (VCC = 20V, TA = 0 to +70°C, unless otherwise specified) Parameter Symbol Value Unit Supply Voltage VCC 40 V Collector Supply Voltage VC 40 V Output Current, Sink or Source IO 500 mA Reference Output Current IREF 50 mA Oscillator Charging Current ICHG(OSC) 5 mA Power Dissipation (TA = 25°C) PD 1000 m/W Operating Temperature TOPR 0 ~ +70 °C Storage Temperature TSTG -65 ~ +150 °C Lead Temperature (Soldering, 10sec) TLEAD +300 °C Parameter Symbol Conditions Min. Typ. Max. Unit REFERENCE SECTION Reference Output Voltage VREF TJ = 25°C 5.0 5.1 5.2 V Line Regulation ∆VREF VCC = 8 to 35V - 9 20 mV Load Regulation ∆VREF IREF = 0 to 20mA - 20 50 mV Short Circuit Output Current ISC VREF = 0, TJ = 25°C - 80 100 mA Total Output Variation (Note1) ∆VREF Line, Load and Temperature 4.95 - 5.25 V Temperature Stability (Note1) STT - - 20 50 mV Long Term Stability (Note1) ST TJ = 125°C ,1KHRS - 20 50 mV OSCILLATOR SECTION Initial Accuracy (Note1, 2) ACCUR TJ = 25°C - ±3 ±6 % Frequency Change With Voltage ∆f/∆VCC VCC = 8 to 35V (Note1, 2) - ±0.8 ±2 % Maximum Frequency f(MAX) RT = 2kΩ, CT = 470pF 400 430 - kHz Minimum Frequency f(MIN) RT = 200kΩ, CT = 0.1uF - 60 120 Hz Clock Amplitude (Note1, 2) V(CLK) - 34- V Clock Width (Note1, 2) tW(CLK) TJ = 25°C 0.3 0.6 1 µs Sync Threshold VTH(SYNC) - 1.2 2 2.8 V Sync Input Current II(SYNC) Sync = 3.5V - 1.3 2.5 mA KA3525A 3 Electrical Characteristics (Continued) (VCC = 20V, TA = 0 to +70°C, unless otherwise specified) Note : 1. These parameters. although guaranteed over the recommended operating conditions, are not 100% tested in production 2. Tested at fOSC=40kHz (RT =3.6K, CT =0.01uF, RI = 0Ω) Parameter Symbol Conditions Min. Typ. Max. Unit ERROR AMPLIFIER SECTION (VCM = 5.1V) Input Offset Voltage VIO - - 1.5 10 mV Input Bias Current IBIAS - - 1 10 µA Input Offset Current IIO - - 0.1 1 µA Open Loop Voltage Gain GVO RL ≥ 10MΩ 60 80 - dB Common Mode Rejection Ratio CMRR VCM = 1.5 to 5.2V 60 90 - dB Power Supply Rejection Ratio PSRR VCC = 8 to 3.5V 50 60 - dB PWM COMPARATOR SECTION Minimum Duty Cycle D(MIN) - - - 0% Maximum Duty Cycle D(MAX) - 45 49 - % Input Threshold Voltage (Note2) VTH1 Zero Duty Cycle 0.7 0.9 - V Input Threshold Voltage (Note2) VTH2 Max Duty Cycle - 3.2 3.6 V SOFT-START SECTION Soft Start Current ISOFT VSD = 0V, VSS = 0V 25 51 80 µA Soft Start Low Level Voltage VSL VSD = 25V - 0.3 0.7 V Shutdown Threshold Voltage VTH(SD) - 0.9 1.3 1.7 V Shutdown Input Current IN(SD) VSD = 2.5V - 0.3 1 mA OUTPUT SECTION Low Output Voltage I VOL I ISINK = 20mA - 0.1 0.4 V Low Output Voltage II VOL II ISINK = 100mA - 0.05 2 V High Output Voltage I VCH I ISOURCE = 20mA 18 19 - V High Output Voltage II VCH II ISOURCE = 100mA 17 18 - V Under Voltage Lockout VUV V8 and V9 = High 6 7 8 V Collector Leakage Current ILKG VCC = 35V - 80 200 µA Rise Time (Note1) tR CL = 1uF, TJ = 25°C - 80 600 ns Fall Time (Note1) tF CL = 1uF, TJ = 25°C - 70 300 ns STANDBY CURRENT Supply Current ICC VCC = 35V - 12 20 mA KA3525A 4 Test Circuit 16 15 12 1 2 9 8 10 5 7 13 11 14 3 6 BAND GAP REF 5V U.V.L.O. A B 0.1 Vcc 0.1 3k RWM ADJ 10k 1.5K 10K 0.01 5.0uF 5.0k 5.0k 5.0k 100 F/F ERR AMP ERR AMP OSCILLATOR LATCH S S R SOFT START + SHUTDOWN VREF CT RAMP 0.009 0.1 + 3.6k 0.001 DEAD TIME OUT B 10k 10k OUT A VC CLOCK _ + + _ RT KA3525A 5 Mechanical Dimensions Package #1 #8 #9 #16 6.40 ±0.20 7.62 0.300 2.54 0.100 0.252 ±0.008 0~15° 0.25 +0.10 –0.05 0.010 +0.004 –0.002 3.30 ±0.30 0.130 ±0.012 3.25 ±0.20 0.128 ±0.008 19.40 ±0.20 0.764 ±0.008 19.80 0.780 MAX 5.08 0.200 0.38 0.014 MAX MIN 0.81 0.032 ( ) 0.46 ±0.10 0.018 ±0.004 0.059 ±0.004 1.50 ±0.10 16-DIP KA3525A 10/2/02 0.0m 001 Stock#DSxxxxxxxx 2002 Fairchild Semiconductor Corporation LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. Ordering Information Product Number Package Operating Temperature KA3525A 16-DIP 0 ~ +70°C ©2006 Fairchild Semiconductor Corporation www.fairchildsemi.com FPS Rev.1.0.6 TM is a trademark of Fairchild Semiconductor Corporation. Features • Internal Avalanche Rugged Sense FET • Advanced Burst-Mode operation consumes under 1 W at 240VAC & 0.5W load • Precision Fixed Operating Frequency (66kHz) • Internal Start-up Circuit • Improved Pulse by Pulse Current Limiting • Over Voltage Protection (OVP) • Over Load Protection (OLP) • Internal Thermal Shutdown Function (TSD) • Auto-Restart Mode • Under Voltage Lock Out (UVLO) with hysteresis • Low Operating Current (2.5mA) • Built-in Soft Start Application • SMPS for LCD monitor and STB • Adaptor Description The FSDM0565RB is an integrated Pulse Width Modulator (PWM) and Sense FET specifically designed for high performance offline Switch Mode Power Supplies (SMPS) with minimal external components. This device is an integrated high voltage power switching regulator which combine an avalanche rugged Sense FET with a current mode PWM control block. The PWM controller includes integrated fixed frequency oscillator, under voltage lockout, leading edge blanking (LEB), optimized gate driver, internal soft start, temperature compensated precise current sources for a loop compensation and self protection circuitry. Compared with discrete MOSFET and PWM controller solution, it can reduce total cost, component count, size and weight simultaneously increasing efficiency, productivity, and system reliability. This device is a basic platform well suited for cost effective designs of flyback converters. Table 1. Maximum Output Power Notes: 1. Typical continuous power in a non-ventilated enclosed adapter measured at 50°C ambient. 2. Maximum practical continuous power in an open frame design at 50°C ambient. 3. 230 VAC or 100/115 VAC with doubler. Typical Circuit Figure 1. Typical Flyback Application OUTPUT POWER TABLE PRODUCT 230VAC ±15%(3) 85-265VAC Adapter(1) Open Frame(2) Adapter(1) Open Frame(2) FSDM0565RB 60W 70W 50W 60W FSDM0565RBI 60W 70W 50W 60W FSDM07652RB 70W 80W 60W 70W Drain Source Vstr Vfb Vcc PWM AC IN DC OUT FSDM0565RB Green Mode Fairchild Power Switch (FPSTM) FSDM0565RB 2 Internal Block Diagram Figure 2. Functional Block Diagram of FSDM0565RB 8V/12V 3 1 2 4 5 Vref Internal Bias S Q Q R OSC Vcc Vref Idelay IFB VSD TSD Vovp Vcc VCL S Q Q R R 2.5R Vcc good Vcc Drain N.C FB GND Gate driver 6 Vstr Istart Vcc good 0.5/0.7V LEB PWM Soft start + - FSDM0565RB 3 Pin Definitions Pin Configuration Figure 3. Pin Configuration (Top View) Pin Number Pin Name Pin Function Description 1 Drain This pin is the high voltage power Sense FET drain. It is designed to drive the transformer directly. 2 GND This pin is the control ground and the Sense FET source. 3 Vcc This pin is the positive supply voltage input. During start up, the power is supplied by an internal high voltage current source that is connected to the Vstr pin. When Vcc reaches 12V, the internal high voltage current source is disabled and the power is supplied from the auxiliary transformer winding. 4 Vfb This pin is internally connected to the inverting input of the PWM comparator. The collector of an opto-coupler is typically tied to this pin. For stable operation, a capacitor should be placed between this pin and GND. If the voltage of this pin reaches 6.0V, the over load protection is activated resulting in shutdown of the FPSTM. 5 N.C - 6 Vstr This pin is connected directly to the high voltage DC link. At startup, the internal high voltage current source supplies internal bias and charges the external capacitor that is connected to the Vcc pin. Once Vcc reaches 12V, the internal current source is disabled. 6.Vstr 5.N.C. 4.Vfb 3.Vcc 2.GND 1.Drain TO-220F-6L 6.Vstr 5.N.C. 4.Vfb 3.Vcc 2.GND 1.Drain I2-PAK-6L FSDM0565RB 4 Absolute Maximum Ratings (Ta=25°C, unless otherwise specified) Notes: 1. Repetitive rating: Pulse width limited by maximum junction temperature 2. L=14mH, starting Tj=25°C 3. L=13uH, starting Tj=25°C Thermal Impedance Notes: 1. Free standing with no heat-sink under natural convection. 2. Infinite cooling condition - Refer to the SEMI G30-88. Parameter Symbol Value Unit Drain-source voltage VDSS 650 V Vstr Max Voltage VSTR 650 V Pulsed Drain current (Tc=25°C)(1) IDM 11 ADC Continuous Drain Current(Tc=25°C) ID 2.8 A Continuous Drain Current(Tc=100°C) 1.7 A Single pulsed avalanche energy (2) EAS 190 mJ Single pulsed avalanche current (3) IAS - A Supply voltage VCC 20 V Input voltage range VFB -0.3 to VCC V Total power dissipation(Tc=25°C) PD(Watt H/S) 45 (TO-220-6L) W 75 (I2-PAK-6L) Operating junction temperature Tj Internally limited °C Operating ambient temperature TA -25 to +85 °C Storage temperature range TSTG -55 to +150 °C ESD Capability, HBM Model (All pins excepts for Vstr and Vfb) - 2.0 (GND-Vstr/Vfb=1.5kV) kV ESD Capability, Machine Model (All pins excepts for Vstr and Vfb) - 300 (GND-Vstr/Vfb=225V) V Parameter Symbol Package Value Unit Junction-to-Ambient Thermal θJA(1) TO-220F-6L 49.90 °C/W I2-PAK-6L 30 Junction-to-Case Thermal θJC(2) TO-220F-6L 2.78 °C/W I2-PAK-6L 1.67 FSDM0565RB 5 Electrical Characteristics (Ta = 25°C unless otherwise specified) Parameter Symbol Condition Min. Typ. Max. Unit Sense FET SECTION Drain source breakdown voltage BVDSS VGS = 0V, ID = 250μA 650 - - V Zero gate voltage drain current IDSS VDS = 650V, VGS = 0V - - 500 μA VDS= 520V VGS = 0V, TC = 125°C - - 500 μA Static drain source on resistance (1) RDS(ON) VGS = 10V, ID = 2.5A - 1.76 2.2 Ω Output capacitance COSS VGS = 0V, VDS = 25V, f = 1MHz - 78 - pF Turn on delay time TD(ON) VDD= 325V, ID= 5A (MOSFET switching time is essentially independent of operating temperature) - 22 - ns Rise time TR - 52 - Turn off delay time TD(OFF) - 95 - Fall time TF - 50 - CONTROL SECTION Initial frequency FOSC VFB = 3V 60 66 72 kHz Voltage stability FSTABLE 13V ≤ Vcc ≤ 18V 0 1 3 % Temperature stability (2) ΔFOSC -25°C ≤ Ta ≤ 85°C 0 ±5 ±10 % Maximum duty cycle DMAX - 77 82 87 % Minimum duty cycle DMIN - - - 0% Start threshold voltage VSTART VFB=GND 11 12 13 V Stop threshold voltage VSTOP VFB=GND 7 8 9 V Feedback source current IFB VFB=GND 0.7 0.9 1.1 mA Soft-start time TS Vfb=3 - 10 15 ms Leading Edge Blanking time TLEB - - 250 - ns BURST MODE SECTION Burst Mode Voltages (2) VBURH Vcc=14V - 0.7 - V VBURL Vcc=14V - 0.5 - V PROTECTION SECTION Peak current limit (4) IOVER VFB=5V, VCC=14V 2.0 2.25 2.5 A Over voltage protection VOVP - 18 19 20 V Thermal shutdown temperature (2) TSD 130 145 160 °C Shutdown feedback voltage VSD VFB ≥ 5.5V 5.5 6.0 6.5 V Shutdown delay current IDELAY VFB=5V 2.8 3.5 4.2 μA FSDM0565RB 6 Notes: 1. Pulse test : Pulse width ≤ 300μS, duty ≤ 2% 2. These parameters, although guaranteed at the design, are not tested in mass production. 3. These parameters, although guaranteed, are tested in EDS(wafer test) process. 4. These parameters indicate the inductor current. 5. This parameter is the current flowing into the control IC. TOTAL DEVICE SECTION Operating supply current (5) IOP VFB=GND, VCC=14V IOP(MIN) VFB=GND, VCC=10V - 2.5 5 mA IOP(MAX) VFB=GND, VCC=18V FSDM0565RB 7 Comparison Between FS6M07652RTC and FSDM0565RB Function FS6M07652RTC FSDM0565RB FSDM0565RB Advantages Soft-Start Adjustable soft-start time using an external capacitor Internal soft-start with typically 10ms (fixed) • Gradually increasing current limit during soft-start further reduces peak current and voltage component stresses • Eliminates external components used for soft-start in most applications • Reduces or eliminates output overshoot Burst Mode Operation • Built into controller • Output voltage drops to around half • Built into controller • Output voltage fixed • Improve light load efficiency • Reduces no-load consumption FSDM0565RB 8 Typical Performance Characteristics (These Characteristic Graphs are Normalized at Ta= 25°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Operating Frequency (Fosc) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Start Thershold Voltage (Vstart) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Stop Threshold Voltage (Vstop) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Maximum Duty Cycle (Dmax) Operating Current vs. Temp Start Threshold Voltage vs. Temp Stop Threshold Voltage vs. Temp Operating Freqency vs. Temp Maximum Duty vs. Temp Feedback Source Current vs. Temp 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Operating Current (Iop) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) FB Source Current (Ifb) FSDM0565RB 9 Typical Performance Characteristics (Continued) (These Characteristic Graphs are Normalized at Ta= 25°C) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Shutdown Delay Current (Idelay) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Over Voltage Protection (Vovp) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -50 -25 0 25 50 75 100 125 Junction Temperature(℃) Peak Current Limit(Self protection) (Iover) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) FB Burst Mode Enable Voltage (Vfbe) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) FB Burst Mode Disable Voltage (Vfbd) ShutDown Feedback Voltage vs. Temp ShutDown Delay Current vs. Temp Over Voltage Protection vs. Temp Burst Mode Enable Voltage vs. Temp Burst Mode Disable Voltage vs. Temp Current Limit vs. Temp 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -25 0 25 50 75 100 125 150 Junction Temperature(℃) Shutdown FB Voltage (Vsd) FSDM0565RB 10 Typical Performance Characteristics (Continued) (These Characteristic Graphs are Normalized at Ta= 25°C) Soft Start Time vs. Temp 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -50 -25 0 25 50 75 100 125 Junction Temperature(℃) Soft Start Time (Normalized to 25℃) FSDM0565RB 11 Functional Description 1. Startup : In previous generations of Fairchild Power Switches (FPSTM) the Vcc pin had an external start-up resistor to the DC input voltage line. In this generation the startup resistor is replaced by an internal high voltage current source. At startup, an internal high voltage current source supplies the internal bias and charges the external capacitor (Cvcc) that is connected to the Vcc pin as illustrated in Figure 4. When Vcc reaches 12V, the FSDM0565RB begins switching and the internal high voltage current source is disabled. Then, the FSDM0565RB continues its normal switching operation and the power is supplied from the auxiliary transformer winding unless Vcc goes below the stop voltage of 8V. Figure 4. Internal startup circuit 2. Feedback Control : FSDM0565RB employs current mode control, as shown in Figure 5. An opto-coupler (such as the H11A817A) and shunt regulator (such as the KA431) are typically used to implement the feedback network. Comparing the feedback voltage with the voltage across the Rsense resistor plus an offset voltage makes it possible to control the switching duty cycle. When the reference pin voltage of the KA431 exceeds the internal reference voltage of 2.5V, the H11A817A LED current increases, thus pulling down the feedback voltage and reducing the duty cycle. This event typically happens when the input voltage is increased or the output load is decreased. 2.1 Pulse-by-pulse current limit: Because current mode control is employed, the peak current through the Sense FET is limited by the inverting input of PWM comparator (Vfb*) as shown in Figure 5. Assuming that the 0.9mA current source flows only through the internal resistor (2.5R +R= 2.8 kΩ), the cathode voltage of diode D2 is about 2.5V. Since D1 is blocked when the feedback voltage (Vfb) exceeds 2.5V, the maximum voltage of the cathode of D2 is clamped at this voltage, thus clamping Vfb*. Therefore, the peak value of the current through the Sense FET is limited. 2.2 Leading edge blanking (LEB) : At the instant the internal Sense FET is turned on, there usually exists a high current spike through the Sense FET, caused by primary-side capacitance and secondary-side rectifier reverse recovery. Excessive voltage across the Rsense resistor would lead to incorrect feedback operation in the current mode PWM control. To counter this effect, the FSDM0565RB employs a leading edge blanking (LEB) circuit. This circuit inhibits the PWM comparator for a short time (TLEB) after the Sense FET is turned on. Figure 5. Pulse width modulation (PWM) circuit 3. Protection Circuit : The FSDM0565RB has several self protective functions such as over load protection (OLP), over voltage protection (OVP) and thermal shutdown (TSD). Because these protection circuits are fully integrated into the IC without external components, the reliability can be improved without increasing cost. Once the fault condition occurs, switching is terminated and the Sense FET remains off. This causes Vcc to fall. When Vcc reaches the UVLO stop voltage, 8V, the protection is reset and the internal high voltage current source charges the Vcc capacitor via the Vstr pin. When Vcc reaches the UVLO start voltage,12V, the FSDM0565RB resumes its normal operation. In this manner, the auto-restart can alternately enable and disable the switching of the power Sense FET until the fault condition is eliminated (see Figure 6). 8V/12V 3 Vref Internal Bias Vcc 6 Vstr Istart Vcc good VDC CVcc 4 OSC Vcc Vref Idelay IFB VSD R 2.5R Gate driver OLP D1 D2 + Vfb* - Vfb KA431 CB Vo H11A817A Rsense SenseFET FSDM0565RB 12 Figure 6. Auto restart operation 3.1 Over Load Protection (OLP) : Overload is defined as the load current exceeding a pre-set level due to an unexpected event. In this situation, the protection circuit should be activated in order to protect the SMPS. However, even when the SMPS is in the normal operation, the over load protection circuit can be activated during the load transition. In order to avoid this undesired operation, the over load protection circuit is designed to be activated after a specified time to determine whether it is a transient situation or an overload situation. Because of the pulse-by-pulse current limit capability, the maximum peak current through the Sense FET is limited, and therefore the maximum input power is restricted with a given input voltage. If the output consumes beyond this maximum power, the output voltage (Vo) decreases below the set voltage. This reduces the current through the opto-coupler LED, which also reduces the opto-coupler transistor current, thus increasing the feedback voltage (Vfb). If Vfb exceeds 2.5V, D1 is blocked and the 3.5uA current source starts to charge CB slowly up to Vcc. In this condition, Vfb continues increasing until it reaches 6V, when the switching operation is terminated as shown in Figure 7. The delay time for shutdown is the time required to charge CB from 2.5V to 6.0V with 3.5uA. In general, a 10 ~ 50 ms delay time is typical for most applications. Figure 7. Over load protection 3.2 Over voltage Protection (OVP) : If the secondary side feedback circuit were to malfunction or a solder defect caused an open in the feedback path, the current through the opto-coupler transistor becomes almost zero. Then, Vfb climbs up in a similar manner to the over load situation, forcing the preset maximum current to be supplied to the SMPS until the over load protection is activated. Because more energy than required is provided to the output, the output voltage may exceed the rated voltage before the over load protection is activated, resulting in the breakdown of the devices in the secondary side. In order to prevent this situation, an over voltage protection (OVP) circuit is employed. In general, Vcc is proportional to the output voltage and the FSDM0565RB uses Vcc instead of directly monitoring the output voltage. If VCC exceeds 19V, an OVP circuit is activated resulting in the termination of the switching operation. In order to avoid undesired activation of OVP during normal operation, Vcc should be designed to be below 19V. 3.3 Thermal Shutdown (TSD) : The Sense FET and the control IC are built in one package. This makes it easy for the control IC to detect the heat generation from the Sense FET. When the temperature exceeds approximately 150°C, the thermal shutdown is activated. 4. Soft Start : The FSDM0565RB has an internal soft start circuit that increases PWM comparator inverting input voltage together with the Sense FET current slowly after it starts up. The typical soft start time is 10msec, The pulse width to the power switching device is progressively increased to establish the correct working conditions for transformers, inductors, and capacitors. The voltage on the output capacitors is progressively increased with the intention of smoothly establishing the required output voltage. It also helps to prevent transformer saturation and reduce the stress on the secondary diode during startup. Fault situation 8V 12V Vcc Vds t Fault occurs Fault removed Normal operation Normal operation Power on VFB t 2.5V 6.0V Over load protection T12= Cfb*(6.0-2.5)/I delay T1 T2 FSDM0565RB 13 5. Burst operation : In order to minimize power dissipation in standby mode, the FSDM0565RB enters burst mode operation. As the load decreases, the feedback voltage decreases. As shown in Figure 8, the device automatically enters burst mode when the feedback voltage drops below VBURL(500mV). At this point switching stops and the output voltages start to drop at a rate dependent on standby current load. This causes the feedback voltage to rise. Once it passes VBURH(700mV) switching resumes. The feedback voltage then falls and the process repeats. Burst mode operation alternately enables and disables switching of the power Sense FET thereby reducing switching loss in Standby mode. Figure 8. Waveforms of burst operation VFB Vds 0.5V 0.7V Ids Vo Voset time Switching disabled T1 T2 T3 Switching disabled T4 FSDM0565RB 14 Typical application circuit Features • High efficiency (>81% at 85Vac input) • Low zero load power consumption (<300mW at 240Vac input) • Low standby mode power consumption (<800mW at 240Vac input and 0.3W load) • Low component count • Enhanced system reliability through various protection functions • Internal soft-start (10ms) Key Design Notes • Resistors R102 and R105 are employed to prevent start-up at low input voltage. After startup, there is no power loss in these resistors since the startup pin is internally disconnected after startup. • The delay time for over load protection is designed to be about 50ms with C106 of 47nF. If a faster triggering of OLP is required, C106 can be reduced to 10nF. • Zener diode ZD102 is used for a safety test such as UL. When the drain pin and feedback pin are shorted, the zener diode fails and remains short, which causes the fuse (F1) blown and prevents explosion of the opto-coupler (IC301). This zener diode also increases the immunity against line surge. 1. Schematic Application Output power Input voltage Output voltage (Max current) LCD Monitor 40W Universal input (85-265Vac) 5V (2.0A) 12V (2.5A) 3 4 C102 220nF 275VAC LF101 23mH C101 220nF 275VAC RT1 5D-9 F1 FUSE 250V 2A C103 100uF 400V R102 30kΩ R105 40kΩ R103 56kΩ 2W C104 2.2nF 1kV D101 UF 4007 C106 47nF 50V C105 22uF 50V D102 TVR10G R104 5Ω 1 2 3 4 5 T1 EER3016 BD101 2KBP06M3N257 1 2 R101 560kΩ 1W IC1 FSDM0565RB Vstr NC Vfb Vcc Drain GND 1 2 3 4 5 6 ZD101 22V 8 10 D202 MBRF10100 C201 1000uF 25V C202 1000uF 25V L201 12V, 2.5A 6 7 D201 MBRF1045 C203 1000uF 10V C204 1000uF 10V L202 5V, 2A R201 1kΩ R202 1.2kΩ R204 5.6kΩ R203 12kΩ C205 47nF R205 5.6kΩ C301 4.7nF IC301 H11A817A IC201 KA431 ZD102 10V FSDM0565RB 15 2. Transformer Schematic Diagram 3.Winding Specification 4.Electrical Characteristics 5. Core & Bobbin Core : EER 3016 Bobbin : EER3016 Ae(mm2) : 96 No Pin (s→f) Wire Turns Winding Method Na 4 → 5 0.2φ × 1 8 Center Winding Insulation: Polyester Tape t = 0.050mm, 2Layers Np/2 2 → 1 0.4φ × 1 18 Solenoid Winding Insulation: Polyester Tape t = 0.050mm, 2Layers N12V 10 → 8 0.3φ × 3 7 Center Winding Insulation: Polyester Tape t = 0.050mm, 2Layers N5V 7 → 6 0.3φ × 3 3 Center Winding Insulation: Polyester Tape t = 0.050mm, 2Layers Np/2 3 → 2 0.4φ × 1 18 Solenoid Winding Outer Insulation: Polyester Tape t = 0.050mm, 2Layers Pin Specification Remarks Inductance 1 - 3 520uH ± 10% 100kHz, 1V Leakage Inductance 1 - 3 10uH Max 2nd all short EER3016 Np /2 N12V Na 1 2 3 4 5 6 7 8 9 10 Np /2 N5V FSDM0565RB 16 6.Demo Circuit Part List Part Value Note Part Value Note Fuse C301 4.7nF Polyester Film Cap. F101 2A/250V NTC Inductor RT101 5D-9 L201 5uH Wire 1.2mm Resistor L202 5uH Wire 1.2mm R101 560K 1W R102 30K 1/4W R103 56K 2W R104 5 1/4W Diode R105 40K 1/4W D101 UF4007 R201 1K 1/4W D102 TVR10G R202 1.2K 1/4W D201 MBRF1045 R203 12K 1/4W D202 MBRF10100 R204 5.6K 1/4W ZD101 Zener Diode 22V R205 5.6K 1/4W ZD102 Zener Diode 10V Bridge Diode BD101 2KBP06M 3N257 Bridge Diode Capacitor C101 220nF/275VAC Box Capacitor Line Filter C102 220nF/275VAC Box Capacitor LF101 23mH Wire 0.4mm C103 100uF/400V Electrolytic Capacitor IC C104 2.2nF/1kV Ceramic Capacitor IC101 FSDM0565RB FPSTM(5A,650V) C105 22uF/50V Electrolytic Capacitor IC201 KA431(TL431) Voltage reference C106 47nF/50V Ceramic Capacitor IC301 H11A817A Opto-coupler C201 1000uF/25V Electrolytic Capacitor C202 1000uF/25V Electrolytic Capacitor C203 1000uF/10V Electrolytic Capacitor C204 1000uF/10V Electrolytic Capacitor C205 47nF/50V Ceramic Capacitor FSDM0565RB 17 7. Layout Figure 9. Layout Considerations for FSDM0565RB Figure 10. Layout Considerations for FSDM0565RB FSDM0565RB 18 Package Dimensions TO-220F-6L(Forming) FSDM0565RB 19 Package Dimensions (Continued) I2-PAK-6L(Forming) FSDM0565RB 1/9/06 0.0m 001 © 2006 Fairchild Semiconductor Corporation LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. Ordering Information WDTU : Forming Type Product Number Package Marking Code BVdss Rds(on)Max. FSDM0565RBWDTU TO-220F-6L(Forming) DM0565R 650V 2.2 Ω FSDM0565RBIWDTU I2-PAK-6L (Forming) DM0565R 650V 2.2 Ω Data Sheet: JN5148-001 IEEE802.15.4 Wireless Microcontroller © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 1 Overview Features: Transceiver • 2.4GHz IEEE802.15.4 compliant • Time of Flight ranging engine • 128-bit AES security processor • MAC accelerator with packet formatting, CRCs, address check, auto-acks, timers • 500 & 667kbps data rate modes • Integrated sleep oscillator for low power • On chip power regulation for 2.0V to 3.6V battery operation • Deep sleep current 100nA • Sleep current with active sleep timer 1.25µA • <$0.50 external component cost • Rx current 17.5mA • Tx current 15.0mA • Receiver sensitivity -95dBm • Transmit power 2.5dBm Features: Microcontroller • Low power 32-bit RISC CPU, 4 to 32MHz clock speed • Variable instruction width for high coding efficiency • Multi-stage instruction pipeline • 128kB ROM and 128kB RAM for bootloaded program code & data • JTAG debug interface • 4-input 12-bit ADC, 2 12-bit DACs, 2 comparators • 3 application timer/counters, • 2 UARTs • SPI port with 5 selects • 2-wire serial interface • 4-wire digital audio interface • Watchdog timer • Low power pulse counters • Up to 21 DIO Industrial temp (-40°C to +85°C) 8x8mm 56-lead Punched QFN Lead-free and RoHS compliant The JN5148-001 is an ultra low power, high performance wireless microcontroller targeted at JenNet and ZigBee PRO networking applications. The device features an enhanced 32-bit RISC processor offering high coding efficiency through variable width instructions, a multistage instruction pipeline and low power operation with programmable clock speeds. It also includes a 2.4GHz IEEE802.15.4 compliant transceiver, 128kB of ROM, 128kB of RAM, and a rich mix of analogue and digital peripherals. The large memory footprint allows the device to run both a network stack (e.g. ZigBee PRO) and an embedded application or in a coprocessor mode. The operating current is below 18mA, allowing operation direct from a coin cell. Enhanced peripherals include low power pulse counters running in sleep mode designed for pulse counting in AMR applications and a unique Time of Flight ranging engine, allowing accurate location services to be implemented on wireless sensor networks. It also includes a 4-wire I2 S audio interface, to interface directly to mainstream audio CODECs, as well as conventional MCU peripherals. Block Diagram 32-bit RISC CPU Timers UAR Ts 12-bit ADC, Comparators 12-bit DACs, Temp Sensor 2-Wire Serial RAM SPI 128kB 128-bit AES Encryption Accelerator 2.4GHz Radio ROM 128kB Power Management XTAL O-QPSK Modem IEEE802.15.4 MAC Accelerator 32-byte OTP eFuse 4-Wire Audio Sleep Counters Time of Flight Engine Watchdog Timer Benefits • Single chip integrates transceiver and microcontroller for wireless sensor networks • Large memory footprint to run ZigBee PRO or JenNet together with an application • Very low current solution for long battery life • Highly featured 32-bit RISC CPU for high performance and low power • System BOM is low in component count and cost • Extensive user peripherals Applications • Robust and secure low power wireless applications • ZigBee PRO and JenNet networks • Smart metering (e.g. AMR) • Home and commercial building automation • Location Aware services – e.g. Asset Tracking • Industrial systems • Telemetry • Remote Control • Toys and gaming peripherals2 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Contents 1 Introduction 6 1.1 Wireless Transceiver 6 1.2 RISC CPU and Memory 6 1.3 Peripherals 7 1.4 Block Diagram 8 2 Pin Configurations 9 2.1 Pin Assignment 10 2.2 Pin Descriptions 12 2.2.1 Power Supplies 12 2.2.2 Reset 12 2.2.3 32MHz Oscillator 12 2.2.4 Radio 12 2.2.5 Analogue Peripherals 13 2.2.6 Digital Input/Output 13 3 CPU 15 4 Memory Organisation 16 4.1 ROM 16 4.2 RAM 17 4.3 OTP eFuse Memory 17 4.4 External Memory 17 4.4.1 External Memory Encryption 18 4.5 Peripherals 18 4.6 Unused Memory Addresses 18 5 System Clocks 19 5.1 16MHz System Clock 19 5.1.1 32MHz Oscillator 19 5.1.2 24MHz RC Oscillator 19 5.2 32kHz System Clock 20 5.2.1 32kHz RC Oscillator 20 5.2.2 32kHz Crystal Oscillator 20 5.2.3 32kHz External Clock 20 6 Reset 21 6.1 Internal Power-on Reset 21 6.2 External Reset 22 6.3 Software Reset 22 6.4 Brown-out Detect 23 6.5 Watchdog Timer 23 7 Interrupt System 24 7.1 System Calls 24 7.2 Processor Exceptions 24 7.2.1 Bus Error 24 7.2.2 Alignment 24 7.2.3 Illegal Instruction 24 7.2.4 Stack Overflow 24 7.3 Hardware Interrupts 25© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 3 8 Wireless Transceiver 26 8.1 Radio 26 8.1.1 Radio External Components 27 8.1.2 Antenna Diversity 27 8.2 Modem 29 8.3 Baseband Processor 30 8.3.1 Transmit 30 8.3.2 Reception 30 8.3.3 Auto Acknowledge 31 8.3.4 Beacon Generation 31 8.3.5 Security 31 8.4 Security Coprocessor 31 8.5 Location Awareness 31 8.6 Higher Data Rates 32 9 Digital Input/Output 33 10 Serial Peripheral Interface 35 11 Timers 38 11.1 Peripheral Timer/Counters 38 11.1.1 Pulse Width Modulation Mode 39 11.1.2 Capture Mode 39 11.1.3 Counter/Timer Mode 40 11.1.4 Delta-Sigma Mode 40 11.1.5 Example Timer / Counter Application 41 11.2 Tick Timer 41 11.3 Wakeup Timers 42 11.3.1 RC Oscillator Calibration 43 12 Pulse Counters 44 13 Serial Communications 45 13.1 Interrupts 46 13.2 UART Application 46 14 JTAG Debug Interface 47 15 Two-Wire Serial Interface 48 15.1 Connecting Devices 48 15.2 Clock Stretching 49 15.3 Master Two-wire Serial Interface 49 15.4 Slave Two-wire Serial Interface 50 16 Four-Wire Digital Audio Interface 51 17 Random Number Generator 53 18 Sample FIFO 54 19 Intelligent Peripheral Interface 55 19.1 Data Transfer Format 55 19.2 JN5148 (Slave) Initiated Data Transfer 56 19.3 Remote (Master) Processor Initiated Data Transfer 564 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 20 Analogue Peripherals 58 20.1 Analogue to Digital Converter 59 20.1.1 Operation 59 20.1.2 Supply Monitor 60 20.1.3 Temperature Sensor 60 20.2 Digital to Analogue Converter 60 20.2.1 Operation 60 20.3 Comparators 61 21 Power Management and Sleep Modes 62 21.1 Operating Modes 62 21.1.1 Power Domains 62 21.2 Active Processing Mode 62 21.2.1 CPU Doze 62 21.3 Sleep Mode 62 21.3.1 Wakeup Timer Event 63 21.3.2 DIO Event 63 21.3.3 Comparator Event 63 21.3.4 Pulse Counter 63 21.4 Deep Sleep Mode 63 22 Electrical Characteristics 64 22.1 Maximum Ratings 64 22.2 DC Electrical Characteristics 64 22.2.1 Operating Conditions 64 22.2.2 DC Current Consumption 65 22.2.3 I/O Characteristics 66 22.3 AC Characteristics 66 22.3.1 Reset and Voltage Brown-Out 66 22.3.2 SPI MasterTiming 68 22.3.3 Intelligent Peripheral (SPI Slave) Timing 68 22.3.4 Two-wire Serial Interface 69 22.3.5 Four-Wire Digital Audio Interface 70 22.3.6 Wakeup and Boot Load Timings 70 22.3.7 Bandgap Reference 71 22.3.8 Analogue to Digital Converters 71 22.3.9 Digital to Analogue Converters 72 22.3.10 Comparators 73 22.3.11 32kHz RC Oscillator 73 22.3.12 32kHz Crystal Oscillator 74 22.3.13 32MHz Crystal Oscillator 74 22.3.14 24MHz RC Oscillator 75 22.3.15 Temperature Sensor 75 22.3.16 Radio Transceiver 76© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 5 Appendix A Mechanical and Ordering Information 81 A.1 56-pin QFN Package Drawing 81 A.2 PCB Decal 82 A.3 Ordering Information 83 A.4 Device Package Marking 84 A.5 Tape and Reel Information 85 A.5.1 Tape Orientation and Dimensions 85 A.5.2 Reel Information: 180mm Reel 86 A.5.3 Reel Information: 330mm Reel 87 A.5.4 Dry Pack Requirement for Moisture Sensitive Material 87 Appendix B Development Support 88 B.1 Crystal Oscillators 88 B.1.1 Crystal Equivalent Circuit 88 B.1.2 Crystal Load Capacitance 88 B.1.3 Crystal ESR and Required Transconductance 89 B.2 32MHz Oscillator 90 B.3 32kHz Oscillator 92 B.4 JN5148 Module Reference Designs 94 B.4.1 Schematic Diagram 94 B.4.2 PCB Design and Reflow Profile 96 Related Documents 97 RoHS Compliance 97 Status Information 97 Disclaimers 98 Trademarks 98 Version Control 99 Contact Details 1006 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 1 Introduction The JN5148-001 is an IEEE802.15.4 wireless microcontroller that provides a fully integrated solution for applications using the IEEE802.15.4 standard in the 2.4 - 2.5GHz ISM frequency band [1], including JenNet and ZigBee PRO. It includes all of the functionality required to meet the IEEE802.15.4, JenNet and ZigBee PRO specifications and has additional processor capability to run a wide range of applications including, but not limited to Smart Energy, Automatic Meter Reading, Remote Control, Home and Building Automation, Toys and Gaming. Applications that transfer data wirelessly tend to be more complex than wired ones. Wireless protocols make stringent demands on frequencies, data formats, timing of data transfers, security and other issues. Application development must consider the requirements of the wireless network in addition to the product functionality and user interfaces. To minimise this complexity, NXP provides a series of software libraries and interfaces that control the transceiver and peripherals of the JN5148. These libraries and interfaces remove the need for the developer to understand wireless protocols and greatly simplifies the programming complexities of power modes, interrupts and hardware functionality. In view of the above, the register details of the JN5148 are not provided in the datasheet. The device includes a Wireless Transceiver, RISC CPU, on chip memory and an extensive range of peripherals. Hereafter, the JN5148-001 will be referred to as JN5148. 1.1 Wireless Transceiver The Wireless Transceiver comprises a 2.45GHz radio, a modem, a baseband controller and a security coprocessor. In addition, the radio also provides an output to control transmit-receive switching of external devices such as power amplifiers allowing applications that require increased transmit power to be realised very easily. Appendix B.4, describes a complete reference design including Printed Circuit Board (PCB) design and Bill Of Materials (BOM). The security coprocessor provides hardware-based 128-bit AES-CCM* modes as specified by the IEEE802.15.4 2006 standard. Specifically this includes encryption and authentication covered by the MIC –32/ -64/ -128, ENC and ENC-MIC –32/ -64/ -128 modes of operation. The transceiver elements (radio, modem and baseband) work together to provide IEEE802.15.4 Medium Access Control (MAC) under the control of a protocol stack. Applications incorporating IEEE802.15.4 functionality can be rapidly developed by combining user-developed application software with a protocol stack library. 1.2 RISC CPU and Memory A 32-bit RISC CPU allows software to be run on chip, its processing power being shared between the IEEE802.15.4 MAC protocol, other higher layer protocols and the user application. The JN5148 has a unified memory architecture, code memory, data memory, peripheral devices and I/O ports are organised within the same linear address space. The device contains 128kbytes of ROM, 128kbytes of RAM and a 32-byte One Time Programmable (OTP) eFuse memory. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 7 1.3 Peripherals The following peripherals are available on chip: • Master SPI port with five select outputs • Two UARTs with support for hardware or software flow control • Three programmable Timer/Counters – all three support Pulse Width Modulation (PWM) capability, two have capture/compare facility • Two programmable Sleep Timers and a Tick Timer • Two-wire serial interface (compatible with SMbus and I2 C) supporting master and slave operation • Four-wire digital audio interface (compatible with I²S) • Slave SPI port for Intelligent peripheral mode (shared with digital I/O) • Twenty-one digital I/O lines (multiplexed with peripherals such as timers and UARTs) • Four channel, 12-bit, Analogue to Digital converter • Two 12-bit Digital to Analogue converters • Two programmable analogue comparators • Internal temperature sensor and battery monitor • Time Of Flight ranging engine • Two low power pulse counters • Random number generator • Watchdog Timer and Voltage Brown-out • Sample FIFO for digital audio interface or ADC/DAC • JTAG hardware debug port User applications access the peripherals using the Integrated Peripherals API. This allows applications to use a tested and easily understood view of the peripherals allowing rapid system development. 8 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 1.4 Block Diagram 32-bit RISC CPU Reset SPI Master MUX UART0 UART1 Wakeup Timer1 Wakeup Timer0 Security Coprocessor DIO6/TXD0/JTAG_TDO DIO7/RXD0/JTAG_TDI DIO4/CTS0/JTAG_TCK DIO5/RTS0/JTAG_TMS DIO19/TXD1/JTAG_TDO DIO17/CTS1/IP_SEL/DAI_SCK/ JTAG_TCK DIO18/RTS1/IP_INT/DAI_SDOUT/ JTAG_TMS Digital Baseband Radio Programmable Interrupt Controller Timer0 2-wire Interf ace Timer1 SPICLK DIO10/TIM0OUT/32KXTALOUT SPIMOSI SPIMISO SPISEL0 DIO0/SPISEL1 DIO3/SPISEL4/RFTX DIO2/SPISEL3/RFRX DIO1/SPISEL2/PC0 DIO9/TIM0CAP/32KXTALIN/32KIN DIO8/TIM0CK_GT/PC1 DIO13/TIM1OUT/ADE/DAI_SDIN DIO11/TIM1CK_GT/TIM2OUT DIO12/TIM1CAP/ADO/DAI_WS DIO14/SIF_CLK/IP_CLK DIO15/SIF_D/IP_DO DIO16/RXD1/IP_DI/JTAG_TDI From Peripherals RESETN Wireless Transceiv er 32MHz Clock Generator XTAL_IN XTAL_OUT RF_IN VCOTUNE Tick Timer Voltage Regulators 1.8V VDD1 VDD2 Intelligent Peripheral IBAIS VB_XX Clock Divider Multiplier Timer2 SPISEL1 SPISEL2 SPISEL3 SPISEL4 TXD0 RXD0 RTS0 CTS0 TXD1 RXD1 RTS1 CTS1 TIM0CK_GT TIM0CAP TIM0OUT TIM1CK_GT TIM1CAP TIM1OUT TIM2OUT SIF_D SIF_CLK IP_DO IP_DI IP_INT IP_CLK IP_SEL 4-wire Digital Audio Interf ace I2S_OUT I2S_DIN I2S_CLK I2S_SYNC Pulse Counters PC0 PC1 JTAG Debug JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO RAM 128kB ROM 128kB OTP eFuse 32kHz RC Osc 32kHz Clock Select 32KIN 32kHz Clock Gen 32KXTALIN 32KXTALOUT Antenna Div ersity ADO ADE Time Of Flight Sample FIFO DIO20/RXD1/JTAG_TDI 24MHz RC Osc Comparator2 COMP2P COMP2M COMP1P/ Comparator1 EXT_PA_C COMP1M/ EXT_PA_B DAC1 DAC2 DAC1 DAC2 ADC M U ADC4 X ADC1 ADC2 ADC3 Temperature Sensor Supply Monitor CPU and 16MHz System Clock Watchdog Timer Brown-out Detect Figure 1: JN5148 Block Diagram DIO 16/IP_DI© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 9 2 Pin Configurations DIO16/RXD 1/IP_DI/JTAG_TDI DIO17/CTS1/IP_SEL/DAI_SC K/JTAG_TCK VSS3 DIO18/RTS1/IP_INT/DAI_SDOUT/JTAG_TMS DIO19/TXD1/JTAG_TDO VSS2 VSSS XTAL_OUT XTAL_IN VB_SYNTH VCOTUNE VB_VCO VDD1 IBIAS VREF VB_RF2 RF_IN VB_RF COMP1M COMP1P ADC1 ADC2 ADC3 ADC4 COMP2M COMP2P VB_A NC DAC1 DAC2 DIO20/RXD 1/JTAG_TDI VSS1 SPICLK SPIMISO VB_RAM SPIMOSI SPISEL0 DIO0/SPISEL1 RESETN VB_DIG DIO1/SPISEL2/PC0 DIO2/SPISEL3/RFRX DIO15/SIF_D/IP_DO DIO14/SIF_C LK/IP_CLK DIO13/T IM1OUT/ADE/DAI_SDIN DIO12/T IM1CAP/ADO/DAI_WS DIO11/T IM1CK_GT /TIM2OUT DIO10/T IM0OUT/32KXT ALOUT DIO9/TIM0CAP/32KXT ALIN/32KIN VDD2 DIO8/TIM0CK_GT/PC 1 DIO7/RXD0/JT AG_TDI DIO6/TXD0/JTAG_TDO DIO5/RTS0/JTAG_TMS DIO4/CTS0/JTAG_TCK DIO3/SPISEL4/RFTX VSSA (Paddl e) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 56 55 54 53 52 51 50 49 48 47 46 45 44 43 Figure 2: 56-pin QFN Configuration (top view) Note: Please refer to Appendix B.4 JN5148 Module Reference Design for important applications information regarding the connection of the PADDLE to the PCB. DIO 16/IP_DI10 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 2.1 Pin Assignment Pin No Power supplies Signal Type Description 10, 12, 16, 18, 27, 35, 40 VB_SYNTH, VB_VCO, VB_RF2, VB_RF, VB_A, VB_RAM, VB_DIG 1.8V Regulated supply voltage 13, 49 VDD1, VDD2 3.3V Supplies: VDD1 for analogue, VDD2 for digital 32, 6, 3, 7, Paddle VSS1, VSS2, VSS3, VSSS, VSSA 0V Grounds (see appendix A.2 for paddle details) 28 NC No connect General 39 RESETN CMOS Reset input 8, 9 XTAL_OUT, XTAL_IN 1.8V System crystal oscillator Radio 11 VCOTUNE 1.8V VCO tuning RC network 14 IBIAS 1.8V Bias current control 17 RF_IN 1.8V RF antenna Analogue Peripheral I/O 21, 22, 23, 24 ADC1, ADC2, ADC3, ADC4 3.3V ADC inputs 15 VREF 1.8V Analogue peripheral reference voltage 29, 30 DAC1, DAC2 3.3V DAC outputs 19, 20 COMP1M/EXT_PA_B, COMP1P/EXT_PA_C 3.3V Comparator 1 inputs and external PA control 25, 26 COMP2M, COMP2P 3.3V Comparator 2 inputs Digital Peripheral I/O Primary Alternate Functions 33 SPICLK CMOS SPI Clock Output 36 SPIMOSI CMOS SPI Master Out Slave In Output 34 SPIMISO CMOS SPI Master In Slave Out Input 37 SPISEL0 CMOS SPI Slave Select Output 0 38 DIO0 SPISEL1 CMOS DIO0 or SPI Slave Select Output 1 41 DIO1 SPISEL2 PC0 CMOS DIO1, SPI Slave Select Output 2 or Pulse Counter0 Input 42 DIO2 SPISEL3 RFRX CMOS DIO2, SPI Slave Select Output 3 or Radio Receive Control Output 43 DIO3 SPISEL4 RFTX CMOS DIO3, SPI Slave Select Output 4 or Radio Transmit Control Output 44 DIO4 CTS0 JTAG_TCK CMOS DIO4, UART 0 Clear To Send Input or JTAG CLK 45 DIO5 RTS0 JTAG_TMS CMOS DIO5, UART 0 Request To Send Output or JTAG Mode Select 46 DIO6 TXD0 JTAG_TDO CMOS DIO6, UART 0 Transmit Data Output or JTAG Data Output 47 DIO7 RXD0 JTAG_TDI CMOS DIO7, UART 0 Receive Data Input or JTAG Data Input 48 DIO8 TIM0CK_GT PC1 CMOS DIO8, Timer0 Clock/Gate Input or Pulse Counter1 Input 50 DIO9 TIM0CAP 32KXTALIN 32KIN CMOS DIO9, Timer0 Capture Input, 32K External Crystal Input or 32K Clock Input© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 11 Pin No Digital Peripheral I/O Signal Type Description Primary Alternate Functions 51 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output or 32K External Crystal Output 52 DIO11 TIM1CK_GT TIM2OUT CMOS DIO11, Timer1 Clock/Gate Input or Timer2 PWM Output 53 DIO12 TIM1CAP ADO DAI_WS CMOS DIO12, Timer1 Capture Input, Antenna Diversity or Digital Audio Word Select 54 DIO13 TIM1OUT ADE DAI_SDIN CMOS DIO13, Timer1 PWM Output, Antenna Diversity or Digital Audio Data Input 55 DIO14 SIF_CLK IP_CLK CMOS DIO14, Serial Interface Clock or Intelligent Peripheral Clock Input 56 DIO15 SIF_D IP_DO CMOS DIO15, Serial Interface Data or Intelligent Peripheral Data Out 1 DIO16 IP_DI CMOS DIO16 or Intelligent Peripheral Data In 2 DIO17 CTS1 IP_SEL DAI_SCK JTAG_TCK CMOS DIO17, UART 1 Clear To Send Input, Intelligent Peripheral Device Select Input or Digital Audio Clock or JTAG CLK 4 DIO18 RTS1 IP_INT DAI_SDOUT JTAG_TMS CMOS DIO18, UART 1 Request To Send Output, Intelligent Peripheral Interrupt Output or Digital Audio Data Output or JTAG Mode Select 5 DIO19 TXD1 JTAG_TDO CMOS DIO19 or UART 1 Transmit Data Output or JTAG Data Out 31 DIO 20 RXD1 JTAG_TDI CMOS DIO 20, UART 1 Receive Data Input or JTAG data In The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN5148 failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application.12 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 2.2 Pin Descriptions 2.2.1 Power Supplies The device is powered from the VDD1 and VDD2 pins, each being decoupled with a 100nF ceramic capacitor. VDD1 is the power supply to the analogue circuitry; it should be decoupled to ground. VDD2 is the power supply for the digital circuitry; and should also be decoupled to ground. A 10uF tantalum capacitor is required. Decoupling pins for the internal 1.8V regulators are provided which require a 100nF capacitor located as close to the device as practical. VB_RF, VB_A and VB_SYNTH should be decoupled with an additional 47pF capacitor, while VB_RAM and VB_DIG require only 100nF. VB_RF and VB_RF2 should be connected together as close to the device as practical, and only require one 100nF capacitor and one 47pF capacitor. The pin VB_VCO requires a 10nF capacitor in parallel with a 47pF capacitor. Refer to B.4.1 for schematic diagram. VSSA, VSSS, VSS1, VSS2, VSS3 are the ground pins. Users are strongly discouraged from connecting their own circuits to the 1.8v regulated supply pins, as the regulators have been optimised to supply only enough current for the internal circuits. 2.2.2 Reset RESETN is a bi-directional active low reset pin that is connected to a 40kΩ internal pull-up resistor. It may be pulled low by an external circuit, or can be driven low by the JN5148 if an internal reset is generated. Typically, it will be used to provide a system reset signal. Refer to section 6.2, External Reset, for more details. 2.2.3 32MHz Oscillator A crystal is connected between XTALIN and XTALOUT to form the reference oscillator, which drives the system clock. A capacitor to analogue ground is required on each of these pins. Refer to section 5.1 16MHz System Clock for more details. The 32MHz reference frequency is divided down to 16MHz and this is used as the system clock throughout the device. 2.2.4 Radio The radio is a single ended design, requiring a capacitor and just two inductors to match to 50Ω microstrip line to the RF_IN pin. An external resistor (43kΩ) is required between IBIAS and analogue ground to set various bias currents and references within the radio.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 13 2.2.5 Analogue Peripherals Several of the analogue peripherals require a reference voltage to use as part of their operations. They can use either an internal reference voltage or an external reference connected to VREF. This voltage is referenced to analogue ground and the performance of the analogue peripherals is dependant on the quality of this reference. There are four ADC inputs, two pairs of comparator inputs and two DAC outputs. The analogue I/O pins on the JN5148 can have signals applied up to 0.3v higher than VDD1. A schematic view of the analogue I/O cell is shown in Figure 3: Analogue I/O Cell In reset and deep sleep, the analogue peripherals are all off and the DAC outputs are in a high impedance state. In sleep, the ADC and DACs are off, with the DAC outputs in high impedance state. The comparators may optionally be used as a wakeup source. Unused ADC and comparator inputs should be left unconnected. VDD1 Analogue I/O Pin VSSA Analogue Peripheral Figure 3: Analogue I/O Cell 2.2.6 Digital Input/Output Digital I/O pins on the JN5148 can have signals applied up to 2V higher than VDD2 (with the exception of pins DIO9 and DIO10 that are 3V tolerant) and are therefore TTL-compatible with VDD2 > 3V. For other DC properties of these pins see section 22.2.3 I/O Characteristics. When used in their primary function all Digital Input/Output pins are bi-directional and are connected to weak internal pull up resistors (40kΩ nominal) that can be disabled. When used in their secondary function (selected when the appropriate peripheral block is enabled through software library calls) then their direction is fixed by the function. The pull up resistor is enabled or disabled independently of the function and direction; the default state from reset is enabled. A schematic view of the digital I/O cell is in Figure 4: DIO Pin Equivalent Schematic.14 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 I O IE VDD2 VSS Pu RPU RPROT OE DIO[x] Pin Figure 4: DIO Pin Equivalent Schematic In reset, the digital peripherals are all off and the DIO pins are set as high-impedance inputs. During sleep and deep sleep, the DIO pins retain both their input/output state and output level that was set as sleep commences. If the DIO pins were enabled as inputs and the interrupts were enabled then these pins may be used to wake up the JN5148 from sleep.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 15 3 CPU The CPU of the JN5148 is a 32-bit load and store RISC processor. It has been architected for three key requirements: • Low power consumption for battery powered applications • High performance to implement a wireless protocol at the same time as complex applications • Efficient coding of high-level languages such as C provided with the NXP Software Developer’s Kit It features a linear 32-bit logical address space with unified memory architecture, accessing both code and data in the same address space. Registers for peripheral units, such as the timers, UARTs and the baseband processor are also mapped into this space. The CPU has access to a block of 15 32-bit General-Purpose (GP) registers together with a small number of special purpose registers which are used to store processor state and control interrupt handling. The contents of any GP register can be loaded from or stored to memory, while arithmetic and logical operations, shift and rotate operations, and signed and unsigned comparisons can be performed either between two registers and stored in a third, or between registers and a constant carried in the instruction. Operations between general or special-purpose registers execute in one cycle while those that access memory require a further cycle to allow the memory to respond. The instruction set manipulates 8, 16 and 32-bit data; this means that programs can use objects of these sizes very efficiently. Manipulation of 32-bit quantities is particularly useful for protocols and high-end applications allowing algorithms to be implemented in fewer instructions than on smaller word-size processors, and to execute in fewer clock cycles. In addition, the CPU supports hardware Multiply that can be used to efficiently implement algorithms needed by Digital Signal Processing applications. The instruction set is designed for the efficient implementation of high-level languages such as C. Access to fields in complex data structures is very efficient due to the provision of several addressing modes, together with the ability to be able to use any of the GP registers to contain the address of objects. Subroutine parameter passing is also made more efficient by using GP registers rather than pushing objects onto the stack. The recommended programming method for the JN5148 is by using C, which is supported by a software developer kit comprising a C compiler, linker and debugger. The CPU architecture also contains features that make the processor suitable for embedded, real-time applications. In some applications, it may be necessary to use a real-time operating system to allow multiple tasks to run on the processor. To provide protection for device-wide resources being altered by one task and affecting another, the processor can run in either supervisor or user mode, the former allowing access to all processor registers, while the latter only allows the GP registers to be manipulated. Supervisor mode is entered on reset or interrupt; tasks starting up would normally run in user mode in a RTOS environment. Embedded applications require efficient handling of external hardware events. When using JenOS, prioritised interrupts are supported, with 15 priority levels, and can be configured as required by the application. To improve power consumption a number of power-saving modes are implemented in the JN5148, described more fully in section 21 - Power Management and Sleep Modes. One of these modes is the CPU doze mode; under software control, the processor can be shut down and on an interrupt it will wake up to service the request. Additionally, it is possible under software control, to set the speed of the CPU to 4, 8, 16 or 32MHz. This feature can be used to trade-off processing power against current consumption.16 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 4 Memory Organisation This section describes the different memories found within the JN5148. The device contains ROM, RAM, OTP eFuse memory, the wireless transceiver and peripherals all within the same linear address space. 0x00000000 0x00020000 RAM (128kB) 0xF0000000 0xFFFFFFFF Unpopulated ROM (128kB) 0xF0020000 RAM Echo 0x04000000 Peripherals 0x02000000 Figure 5: JN5148 Memory Map 4.1 ROM The ROM is 128k bytes in size, and can be accessed by the processor in a single CPU clock cycle. The ROM contents include bootloader to allow external Flash memory contents to be bootloaded into RAM at runtime, a default interrupt vector table, an interrupt manager, IEEE802.15.4 MAC and APIs for interfacing on-chip peripherals. The operation of the boot loader is described in detail in Application Note [7]. The interrupt manager routes interrupt calls to the application’s soft interrupt vector table contained within RAM. Section 7 contains further information regarding the handling of interrupts. ROM contents are shown in Figure 6. Interrupt Vectors Interrupt Manager Boot Loader IEEE802.15.4 Stack 0x00000000 0x00020000 APIs Spare Figure 6: Typical ROM contents© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 17 4.2 RAM The JN5148 contains 128kBytes of high speed RAM. It can be used for both code and data storage and is accessed by the CPU in a single clock cycle. At reset, a boot loader controls the loading of segments of code and data from an external memory connected to the SPI port, into RAM. Software can control the power supply to the RAM allowing the contents to be maintained during a sleep period when other parts of the device are un-powered. Typical RAM contents are shown in Figure 7. MAC Data Interrupt Vector Table Application CPU Stack (Grows Down) 0x04000000 0x04020000 MAC Address Figure 7: Typical RAM Contents 4.3 OTP eFuse Memory The JN5148 contains a total of 32bytes of eFuse memory; this is a One Time Programmable (OTP) memory that can be used to support on chip 64-bit MAC ID and a 128-bit AES security key. A limited number of bits are available for customer use for storage of configuration information; configuration of these is made through use of software APIs. For further information on how to program and use the eFuse memory, please contact technical support via the online tech-support system. Alternatively, NXP can provide an eFuse programming service for customers that wish to use the eFuse but do not wish to undertake this for themselves. For further details of this service, please contact your local NXP sales office. 4.4 External Memory An external memory with an SPI interface may be used to provide storage for program code and data for the device when external power is removed. The memory is connected to the SPI interface using select line SPISEL0; this select line is dedicated to the external memory interface and is not available for use with other external devices. See Figure 8 for connection details. JN5148 Serial Memory SPISEL0 SPIMISO SPIMOSI SPICLK SS SDO SDI CLK Figure 8: Connecting External Serial Memory18 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 At reset, the contents of this memory are copied into RAM by the software boot loader. The Flash memory devices that are supported as standard through the JN5148 bootloader are given in Table 1. NXP recommends that where possible one of these devices should be selected. Manufacturer Device Number SST (Silicon Storage Technology) 25VF010A (1Mbit device) Numonyx M25P10-A (1Mbit device), M25P40 (4Mbit device) Table 1: Supported Flash Memories Applications wishing to use an alternate Flash memory device should refer to application note [2] JN-AN-1038 Programming Flash devices not supported by the JN51xx ROM-based bootloader. This application note provides guidance on developing an interface to an alternate device. 4.4.1 External Memory Encryption The contents of the external serial memory may be encrypted. The AES security processor combined with a user programmable 128-bit encryption key is used to encrypt the contents of the external memory. The encryption key is stored in eFuse. When bootloading program code from external serial memory, the JN5148 automatically accesses the encryption key to execute the decryption process. User program code does not need to handle any of the decryption process; it is transparent. With encryption enabled, the time taken to boot code from external flash is increased. 4.5 Peripherals All peripherals have their registers mapped into the memory space. Access to these registers requires 3 clock cycles. Applications have access to the peripherals through the software libraries that present a high-level view of the peripheral’s functions through a series of dedicated software routines. These routines provide both a tested method for using the peripherals and allow bug-free application code to be developed more rapidly. For details, see the JN51xx Integrated Peripherals API User Guide (JN-UG-3066)[5]. 4.6 Unused Memory Addresses Any attempt to access an unpopulated memory area will result in a bus error exception (interrupt) being generated.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 19 5 System Clocks Two system clocks are used to provide timing references into the on-chip subsystems of the JN5148. A 16MHz clock, generated by a crystal-controlled 32MHz oscillator, is used by the transceiver, processor, memory and digital and analogue peripherals. A 32kHz clock is used by the sleep timer and during the startup phase of the chip. 5.1 16MHz System Clock The 16MHz system clock is used by the digital and analogue peripherals and the transceiver. A scaled version (4,8,16 or 32MHz) of this clock is also used by the processor and memories. For most operations it is necessary to source this clock from the 32MHz oscillator. Crystal oscillators are generally slow to start. Hence to provide a faster start-up following a sleep cycle a fast RC oscillator is provided that can be used as the source for the 16MHz system clock. The oscillator starts very quickly and is typically 24MHz causing the system clock to run at 12MHz. Using a clock of this speed scales down the speed of the processor and any peripherals in use. For the SPI interface this causes no functional issues as the generated SPI clock is slightly slower and is used to clock the external SPI slave. Use of the radio is not possible when using the 24MHz RC oscillator. Additionally, timers and UARTs should not be used as the exact frequency will not be known. The JN5148 device can be configured to wake up from sleep using the fast RC oscillator and automatically switch over to use the 32MHz xtal as the clock source, when it has started up. This could allow application code to be downloaded from the flash before the xtal is ready, typically improving start-up time by 550usec. Alternatively, the switch over can be controlled by software, or the system could always use the 32MHz oscillator as the clock source. 5.1.1 32MHz Oscillator The JN5148 contains the necessary on chip components to build a 32MHz reference oscillator with the addition of an external crystal resonator and two tuning capacitors. The schematic of these components are shown in Figure 9. The two capacitors, C1 and C2, should typically be 15pF and use a COG dielectric. Due to the small size of these capacitors, it is important to keep the traces to the external components as short as possible. The on chip transconductance amplifier is compensated for temperature variation, and is self-biasing by means of the internal resistor R1. The electrical specification of the oscillator can be found in section 22.3.13. Please refer to Appendix B for development support with the crystal oscillator circuit. XTALOUT C1 C2 R1 XTALIN JN5148 Figure 9: 32MHz Crystal Oscillator Connections 5.1.2 24MHz RC Oscillator An on-chip 24MHz RC oscillator is provided. No external components are required for this oscillator. The electrical specification of the oscillator can be found in section 22.3.14.20 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 5.2 32kHz System Clock The 32kHz system clock is used for timing the length of a sleep period (see section 21 Power Management and Sleep Modes) and also to generate the system clock used internally during reset. The clock can be selected from one of three sources through the application software: • 32kHz RC Oscillator • 32kHz Crystal Oscillator • 32kHz External Clock Upon a chip reset or power-up the JN5148 defaults to using the internal 32kHz RC Oscillator. If another clock source is selected then it will remain in use for all 32kHz timing until a chip reset is performed. 5.2.1 32kHz RC Oscillator The internal 32kHz RC oscillator requires no external components. The internal timing components of the oscillator have a wide tolerance due to manufacturing process variation and so the oscillator runs nominally at 32kHz ±30%. To make this useful as a timing source for accurate wakeup from sleep, a frequency calibration factor derived from the more accurate 16MHz clock may be applied. The calibration factor is derived through software, details can be found in section 11.3.1. For detailed electrical specifications, see section 22.3.11. 5.2.2 32kHz Crystal Oscillator In order to obtain more accurate sleep periods, the JN5148 contains the necessary on-chip components to build a 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be connected between 32KXTALIN and 32KXTALOUT (DIO9 and DIO10), with two equal capacitors to ground, one on each pin. Due to the small size of the capacitors, it is important to keep the traces to the external components as short as possible. The electrical specification of the oscillator can be found in section 22.3.12. The oscillator cell is flexible and can operate with a range of commonly available 32.768kHz crystals with load capacitances from 6 to 12.5pF. However, the maximum ESR of the crystal and the supply current are both functions of the actual crystal used, see appendix B.1 for more details. 32KXTALIN 32KXTALOUT JN5148 Figure 10: 32kHz crystal oscillator connections 5.2.3 32kHz External Clock An externally supplied 32kHz reference clock on the 32KIN input (DIO9) may be provided to the JN5148. This would allow the 32kHz system clock to be sourced from a very stable external oscillator module, allowing more accurate sleep cycle timings compared to the internal RC oscillator. (See section 22.2.3 I/O Characteristics, DIO9 is a 3V tolerant input)© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 21 6 Reset A system reset initialises the device to a pre-defined state and forces the CPU to start program execution from the reset vector. The reset process that the JN5148 goes through is as follows. When power is applied, the 32kHz RC oscillator starts up and stabilises, which takes approximately 100µsec. At this point, the 32MHz crystal oscillator is enabled and power is applied to the processor and peripheral logic. The logic blocks are held in reset until the 32MHz crystal oscillator stabilises, typically this takes 0.75ms. Then the internal reset is removed from the CPU and peripheral logic and the CPU starts to run code beginning at the reset vector, consisting of initialisation code and the resident boot loader. [7] Section 22.3.1 provides detailed electrical data and timing. The JN5148 has five sources of reset: • Internal Power-on Reset • External Reset • Software Reset • Watchdog timer • Brown-out detect Note: When the device exits a reset condition, device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, then the device must be held in reset until the operating conditions are met. (See section 22.3) 6.1 Internal Power-on Reset For the majority of applications the internal power-on reset is capable of generating the required reset signal. When power is applied to the device, the power-on reset circuit monitors the rise of the VDD supply. When the VDD reaches the specified threshold, the reset signal is generated and can be observed as a rising edge on the RESETN pin. This signal is held internally until the power supply and oscillator stabilisation time has elapsed, when the internal reset signal is then removed and the CPU is allowed to run. RESETN Pin Internal RESET VDD Figure 11: Internal Power-on Reset When the supply drops below the power on reset ‘falling’ threshold, it will re-trigger the reset. Use of the external reset circuit show in Figure 12 is suggested. 22 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 RESETN C1 R1 JN5148 VDD 18k 470nF Figure 12: External Reset Generation The external resistor and capacitor provide a simple reset operation when connected to the RESETN pin. 6.2 External Reset An external reset is generated by a low level on the RESETN pin. Reset pulses longer than the minimum pulse width will generate a reset during active or sleep modes. Shorter pulses are not guaranteed to generate a reset. The JN5148 is held in reset while the RESETN pin is low. When the applied signal reaches the Reset Threshold Voltage (VRST) on its positive edge, the internal reset process starts. Multiple devices may connect to the RESETN pin in an open-collector mode. The JN5148 has an internal pull-up resistor connect to the RESETN pin. The pin is an input for an external reset, an output during the power-on reset and may optionally be an output during a software reset. No devices should drive the RESETN pin high. Internal Reset RESETN pin Reset Figure 13: External Reset 6.3 Software Reset A system reset can be triggered at any time through software control, causing a full chip reset and invalidating the RAM contents. For example this can be executed within a user’s application upon detection of a system failure. When performing the reset, the RESETN pin is driven low for 1µsec; depending on the external components this may or may not be visible on the pin. In addition, the RESETN line can be driven low by the JN5148 to provide a reset to other devices in the system (e.g. external sensors) without resetting itself. When the RESETN line is not driven it will pull back high through either the internal pull-up resistor or any external circuitry. It is essential to ensure that the RESETN line pulls back high within 100µsec after the JN5148 stops driving the line; otherwise a system reset will occur. Due to this, careful consideration should be taken of any capacitance on this line. For instance, the RC values recommended in section 6.1 may need to be replaced with a suitable reset IC© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 23 6.4 Brown-out Detect An internal brown-out detect module is used to monitor the supply voltage to the JN5148; this can be used whilst the device is awake or is in CPU doze mode. Dips in the supply voltage below a variable threshold can be detected and can be used to cause the JN5148 to perform a chip reset. Equally, dips in the supply voltage can be detected and used to cause an interrupt to the processor, when the voltage either drops below the threshold or rises above it. The brown-out detect is enabled by default from power-up and can extend the reset during power-up. This will keep the CPU in reset until the voltage exceeds the brown-out threshold voltage. The threshold voltage is configurable to 2.0V, 2.3V, 2.7V and 3.0V and is controllable by software. From power-up the threshold is set by eFuse settings and the default chip configuration is for the 2.3V threshold. It is recommended that the threshold is set so that, as a minimum, the chip is held in reset until the voltage reaches the level required by the external memory device on the SPI interface. 6.5 Watchdog Timer A watchdog timer is provided to guard against software lockups. It operates by counting cycles of the 32kHz system clock. A pre-scaler is provided to allow the expiry period to be set between typically 8ms and 16.4 seconds. Failure to restart the watchdog timer within the pre-configured timer period will cause a chip reset to be performed. A status bit is set if the watchdog was triggered so that the software can differentiate watchdog initiated resets from other resets, and can perform any required recovery once it restarts. If the source of the 32kHz system clock is the 32kHz RC oscillator then the watchdog expiry periods are subject to the variation in period of the RC oscillator. After power up, reset, start from deep sleep or start from sleep, the watchdog is always enabled with the largest timeout period and will commence counting as if it had just been restarted. Under software control the watchdog can be disabled. If it is enabled, the user must regularly restart the watchdog timer to stop it from expiring and causing a reset. The watchdog runs continuously, even during doze, however the watchdog does not operate during sleep or deep sleep, or when the hardware debugger has taken control of the CPU. It will recommence automatically if enabled once the debugger un-stalls the CPU. 24 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 7 Interrupt System The interrupt system on the JN5148 is a hardware-vectored interrupt system. The JN5148 provides several interrupt sources, some associated with CPU operations (CPU exceptions) and others which are used by hardware in the device. When an interrupt occurs, the CPU stops executing the current program and loads its program counter with a fixed hardware address specific to that interrupt. The interrupt handler or interrupt service routine is stored at this location and is run on the next CPU cycle. Execution of interrupt service routines is always performed in supervisor mode. Interrupt sources and their vector locations are listed in Table 2 below: Interrupt Source Vector Location Interrupt Definition Bus error 0x08 Typically cause by an attempt to access an invalid address or a disabled peripheral Tick timer 0x0e Tick timer interrupt asserted Alignment error 0x14 Load/store address to non-naturally-aligned location Illegal instruction 0x1a Attempt to execute an unrecognised instruction Hardware interrupt 0x20 interrupt asserted System call 0x26 System call initiated by b.sys instruction Trap 0x2c caused by the b.trap instruction or the debug unit Reset 0x38 Caused by software or hardware reset. Stack Overflow 0x3e Stack overflow Table 2: Interrupt Vectors 7.1 System Calls The b.trap and b.sys instructions allow processor exceptions to be generated by software. A system call exception will be generated when the b.sys instruction is executed. This exception can, for example, be used to enable a task to switch the processor into supervisor mode when a real time operating system is in use. (See section 3 for further details.) The b.trap instruction is commonly used for trapping errors and for debugging. 7.2 Processor Exceptions 7.2.1 Bus Error A bus error exception is generated when software attempts to access a memory address that does not exist, or is not populated with memory or peripheral registers or when writing to ROM. 7.2.2 Alignment Alignment exceptions are generated when software attempts to access objects that are not aligned to natural word boundaries. 16-bit objects must be stored on even byte boundaries, while 32-bit objects must be stored on quad byte boundaries. For instance, attempting to read a 16-bit object from address 0xFFF1 will trigger an alignment exception as will a read of a 32-bit object from 0xFFF1, 0xFFF2 or 0xFFF3. Examples of legal 32-bit object addresses are 0xFFF0, 0xFFF4, 0xFFF8 etc. 7.2.3 Illegal Instruction If the CPU reads an unrecognised instruction from memory as part of its instruction fetch, it will cause an illegal instruction exception. 7.2.4 Stack Overflow When enabled, a stack overflow exception occurs if the stack pointer reaches a programmable location.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 25 7.3 Hardware Interrupts Hardware interrupts generated from the transceiver, analogue or digital peripherals and DIO pins are individually masked using the Programmable Interrupt Controller (PIC). Management of interrupts is provided in the peripherals library [5]. For details of the interrupts generated from each peripheral see the respective section in this datasheet. Interrupts can be used to wake the JN5148 from sleep. The peripherals, baseband controller, security coprocessor and PIC are powered down during sleep but the DIO interrupts and optionally the pulse counters, wake-up timers and analogue comparator interrupts remain powered to bring the JN5148 out of sleep. Prioritised external interrupt handling (i.e., interrupts from hardware peripherals) is provided to enable an application to control an events priority to provide for deterministic program execution. The priority Interrupt controller provides 15 levels of prioritised interrupts. The priority level of all interrupts can be set, with value 0 being used to indicate that the source can never produce an external interrupt, 1 for the lowest priority source(s) and 15 for the highest priority source(s). Note that multiple interrupt sources can be assigned the same priority level if desired. If while processing an interrupt, a new event occurs at the same or lower priority level, a new external interrupt will not be triggered. However, if a new higher priority event occurs, the external interrupt will again be asserted, interrupting the current interrupt service routine. Once the interrupt service routine is complete, lower priority events can be serviced. 26 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 8 Wireless Transceiver The wireless transceiver comprises a 2.45GHz radio, modem, a baseband processor, a security coprocessor and PHY controller. These blocks, with protocol software provided as a library, implement an IEEE802.15.4 standardsbased wireless transceiver that transmits and receives data over the air in the unlicensed 2.4GHz band. 8.1 Radio Figure 14 shows the single ended radio architecture. LNA synth PA ADC Reference & Bias Switch Radio Calibration Lim1 Lim2 Lim3 Lim4 sigma delta D-Type Figure 14: Radio Architecture The radio comprises a low-IF receive path and a direct modulation transmit path, which converge at the TX/RX switch. The switch connects to the external single ended matching network, which consists of two inductors and a capacitor, this arrangement creates a 50Ω port and removes the need for a balun. A 50Ω single ended antenna can be connected directly to this port. The 32MHz crystal oscillator feeds a divider, which provides the frequency synthesiser with a reference frequency. The synthesiser contains programmable feedback dividers, phase detector, charge pump and internal Voltage Controlled Oscillator (VCO). The VCO has no external components, and includes calibration circuitry to compensate for differences in internal component values due to process and temperature variations. The VCO is controlled by a Phase Locked Loop (PLL) that has an internal loop filter. A programmable charge pump is also used to tune the loop characteristic. The receiver chain starts with the low noise amplifier / mixer combination whose outputs are passed to a lowpass filter, which provides the channel definition. The signal is then passed to a series of amplifier blocks forming a limiting strip. The signal is converted to a digital signal before being passed to the Modem. The gain control for the RX path is derived in the automatic gain control (AGC) block within the Modem, which samples the signal level at various points down the RX chain. To improve the performance and reduce current consumption, automatic calibration is applied to various blocks in the RX path. In the transmit direction, the digital stream from the Modem is passed to a digital sigma-delta modulator which controls the feedback dividers in the synthesiser, (dual point modulation). The VCO frequency now tracks the applied modulation. The 2.4 GHz signal from the VCO is then passed to the RF Power Amplifier (PA), whose power control can be selected from one of three settings. The output of the PA drives the antenna via the RX/TX switch© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 27 8.1.1 Radio External Components In order to realise the full performance of the radio it is essential that the reference PCB layout and BOM are carefully followed. See Appendix B.4. The radio is powered from a number of internal 1.8V regulators fed from the analogue supply VDD1, in order to provide good noise isolation between the digital logic of the JN5148 and the analogue blocks. These regulators are also controlled by the baseband controller and protocol software to minimise power consumption. Decoupling for internal regulators is required as described in section 2.2.1, Power Supplies For single ended antennas or connectors, a balun is not required, however a matching network is needed. The RF matching network requires three external components and the IBIAS pin requires one external component as shown in schematic in B.4.1. These components are critical and should be placed close to the JN5148 pins and analogue ground as defined in Table 8: JN5148 Printed Antenna Reference Module Components and PCB Layout Constraints. Specifically, the output of the network comprising L2, C1 and L1 is designed to present an accurate match to a 50 ohm resistive network as well as provide a DC path to the final output stage or antenna. Users wishing to match to other active devices such as amplifiers should design their networks to match to 50 ohms at the output of L1 R1 43K IBIAS C20 100nF L2 2.7nH VB_RF VREF VB_RF2 RF_IN C12 47pF C3 100nF VB_RF1 C1 47pF L1 5.6nH To Coaxial Socket or Integrated Antenna VB_RF Figure 15 External Radio Components 8.1.2 Antenna Diversity Support is provided for antenna diversity. Antenna diversity is a technique that maximises the performance of an antenna system. It allows the radio to switch between two antennas that have very low correlation between their received signals. Typically, this is achieved by spacing two antennas around 0.25 wavelengths apart or by using two orthogonal polarisations. So, if a packet is transmitted and no acknowledgement is received, the radio system can switch to the other antenna for the retry, with a different probability of success. The JN5148 provides an output (ADO) on DIO12 that is asserted on odd numbered retries and optionally its complement (ADE) on DIO13, that can be used to control an antenna switch; this enables antenna diversity to be implemented easily (see Figure 16 and Figure 17).28 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Antenna A Antenna B A B COM SEL SELB ADO (DIO[12]) ADE (DIO[13]) Device RF Port RF Switch: Single-Pole, Double-Throw (SPDT) Figure 16 Simple Antenna Diversity Implementation using External RF Switch ADO (DIO[12]) TX Active RX Active ADE (DIO[13]) 1st TX-RX Cycle 2nd TX-RX Cycle (1st Retry) Figure 17 Antenna Diversity ADO Signal for TX with Acknowledgement If two DIO pins cannot be spared, DIO13 can be configured to be a normal DIO pin, and the inverse of ADO generated with an inverter on the PCB. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 29 8.2 Modem The modem performs all the necessary modulation and spreading functions required for digital transmission and reception of data at 250kbps in the 2450MHz radio frequency band in compliance with the IEEE802.15.4 standard. It also provides a high data rate modes at 500 and 667kbps. AGC Demodulation Symbol Detection (Despreading) Modulation Spreading TX RX TX Data Interface RX Data Interface VCO Sigma-Delta Modulator IF Signal Gain Figure 18 Modem Architecture Features provided to support network channel selection algorithms include Energy Detection (ED), Link Quality Indication (LQI) and fully programmable Clear Channel Assessment (CCA). The Modem provides a digital Receive Signal Strength Indication (RSSI) that facilitates the implementation of the IEEE 802.15.4 ED function and LQI function. The ED and LQI are both related to receiver power in the same way, as shown in Fig19. LQI is associated with a received packet, whereas ED is an indication of signal power on air at a particular moment. The CCA capability of the Modem supports all modes of operation defined in the IEEE 802.15.4 standard, namely Energy above ED threshold, Carrier Sense and Carrier Sense and/or energy above ED threshold. Figure 19 Energy Detect Value vs Receive Power Level30 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 8.3 Baseband Processor The baseband processor provides all time-critical functions of the IEEE802.15.4 MAC layer. Dedicated hardware guarantees air interface timing is precise. The MAC layer hardware/software partitioning, enables software to implement the sequencing of events required by the protocol and to schedule timed events with millisecond resolution, and the hardware to implement specific events with microsecond timing resolution. The protocol software layer performs the higher-layer aspects of the protocol, sending management and data messages between endpoint and coordinator nodes, using the services provided by the baseband processor. Append Checksum Verify Checksum CSMA CCA Backoff Control Deserialiser Serialiser Tx/Rx Frame Buffer Tx Bitstream Rx Bitstream Protocol Timing Engine Supervisor Radio Status Control Processor Bus Protocol Timers Security Coprocessor Decrypt Port Encrypt Port AES Codec Figure 20: Baseband Processor 8.3.1 Transmit A transmission is performed by software writing the data to be transferred into the Tx/Rx Frame Buffer, together with parameters such as the destination address and the number of retries allowed, and programming one of the protocol timers to indicate the time at which the frame is to be sent. This time will be determined by the software tracking the higher-layer aspects of the protocol such as superframe timing and slot boundaries. Once the packet is prepared and protocol timer set, the supervisor block controls the transmission. When the scheduled time arrives, the supervisor controls the sequencing of the radio and modem to perform the type of transmission required. It can perform all the algorithms required by IEEE802.15.4 such as CSMA/CA, GTS without processor intervention including retries and random backoffs. When the transmission begins, the header of the frame is constructed from the parameters programmed by the software and sent with the frame data through the serialiser to the Modem. At the same time, the radio is prepared for transmission. During the passage of the bitstream to the modem, it passes through a CRC checksum generator that calculates the checksum on-the-fly, and appends it to the end of the frame. If using slotted access, it is possible for a transmission to overrun the time in its allocated slot; the Baseband Processor handles this situation autonomously and notifies the protocol software via interrupt, rather than requiring it to handle the overrun explicitly. 8.3.2 Reception During reception, the radio is set to receive on a particular channel. On receipt of data from the modem, the frame is directed into the Tx/Rx Frame Buffer where both header and frame data can be read by the protocol software. An interrupt may be provided on receipt of the frame header. As the frame data is being received from the modem it is passed through a checksum generator; at the end of the reception the checksum result is compared with the checksum at the end of the message to ensure that the data has been received correctly. An interrupt may be © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 31 provided to indicate successful packet reception. During reception, the modem determines the Link Quality, which is made available at the end of the reception as part of the requirements of IEEE802.15.4. 8.3.3 Auto Acknowledge Part of the protocol allows for transmitted frames to be acknowledged by the destination sending an acknowledge packet within a very short window after the transmitted frame has been received. The JN5148 baseband processor can automatically construct and send the acknowledgement packet without processor intervention and hence avoid the protocol software being involved in time-critical processing within the acknowledge sequence. The JN5148 baseband processor can also request an acknowledge for packets being transmitted and handle the reception of acknowledged packets without processor intervention. 8.3.4 Beacon Generation In beaconing networks, the baseband processor can automatically generate and send beacon frames; the repetition rate of the beacons is programmed by the CPU, and the baseband then constructs the beacon contents from data delivered by the CPU. The baseband processor schedules the beacons and transmits them without CPU intervention. 8.3.5 Security The transmission and reception of secured frames using the Advanced Encryption Standard (AES) algorithm is handled by the security coprocessor and the stack software. The application software must provide the appropriate encrypt/decrypt keys for the transmission or reception. On transmission, the key can be programmed at the same time as the rest of the frame data and setup information. 8.4 Security Coprocessor The security coprocessor is available to the application software to perform encryption/decryption operations. A hardware implementation of the encryption engine significantly speeds up the processing of the encrypted packets over a pure software implementation. The AES library for the JN5148 provides operations that utilise the encryption engine in the device and allow the contents of memory buffers to be transformed. Information such as the type of security operation to be performed and the encrypt/decrypt key to be used must also be provided. Processor Interface AES Block Encrpytion Controller AES Encoder Key Generation Figure 21: Security Coprocessor Architecture 8.5 Location Awareness The JN5148 provides the ability for an application to obtain the Time Of Flight (TOF) between two network nodes. The TOF information is an alternative metric to that of the existing Energy Detect value (RSSI) that has been typically used for calculating the relative inter-nodal separation, for subsequent use in a location awareness system. For short ranges RSSI will typically give a better accuracy than TOF, however for distances above 5 to 10 meters TOF will offer significant improvements in accuracy compared to RSSI. In general, the RSSI error scales with distance, such that if the distance doubles then the error doubles.32 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 8.6 Higher Data Rates To support the demands of applications that require high data throughputs such as in audio or data streaming applications, the JN5148 supports higher data rate modes that offer 500kbps or 667kbps on air transmission rates. The switching between standard and higher data rates is controlled via software, When operating in a higher data rate mode standard IEEE802.15.4 features, such as clear channel assessment, can still be used. This allows the JN5148 in a higher data rate mode to co-exist in an IEEE802.15.4 based network (adhering to the correct bit rates and frame timing etc.) whilst at the same time providing the benefit of the higher data rate where required. When operating in a higher data rate mode, the receive sensitivity will be degraded by at least 3dB.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 33 9 Digital Input/Output There are 21 Digital I/O (DIO) pins, which can be configured as either an input or an output, and each has a selectable internal pull-up resistor. Most DIO pins are multiplexed with alternate peripheral features of the device, see section 2.1. Once a peripheral is enabled it takes precedence over the device pins. Refer to the individual module sections for a full description of the alternate peripherals functions. Following a reset (and whilst the reset input is held low), all peripherals are off and the DIO pins are configured as inputs with the internals pull-ups turned on. When a peripheral is not enabled, the DIO pins associated with it can be used as digital inputs or outputs. Each pin can be controlled individually by setting the direction and then reading or writing to the pin. The individual pull-up resistors, RPU, can also be enabled or disabled as needed and the setting is held through sleep cycles. The pull-ups are generally configured once after reset depending on the external components and functionality. For instance, outputs should generally have the pull-ups disabled. An input that is always driven should also have the pull-up disabled. When configured as an input each pin can be used to generate an interrupt upon a change of state (selectable transition either from low to high or high to low); the interrupt can be enabled or disabled. When the device is sleeping, these interrupts become events that can be used to wake the device up. Equally the status of the interrupt may be read. See section 21 Power Management and Sleep Modes for further details on sleep and wakeup. The state of all DIO pins can be read, irrespective of whether the DIO is configured as an input or an output. Throughout a sleep cycle the direction of the DIO, and the state of the outputs, is held. This is based on the resultant of the GPIO Data/ Direction registers and the effect of any enabled peripherals at the point of entering sleep. Following a wake-up these directions and output values are maintained under control of the GPIO data / direction registers. Any peripherals enabled before the sleep cycle are not automatically re-enabled, this must be done through software after the wake-up. For example, if DIO0 is configured to be SPISEL1 then it becomes an output. The output value is controlled by the SPI functional block. If the device then enters a sleep cycle, the DIO will remain an output and hold the value being output when entering sleep. After wake-up the DIO will still be an output with the same value but controlled from the GPIO Data/Direction registers. It can be altered with the software functions that adjust the DIO, or the application may re-configure it to be SPISEL1. Unused DIO pins are recommended to be set as inputs with the pull-up enabled. Two DIO pins can optionally be used to provide control signals for RF circuitry (eg switches and PA) in high power range extenders. DIO3 / RFTX is asserted when the radio is in the transmit state and similarly, DIO2 / RFRX is asserted when the radio is in the receiver state.34 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 4-wire Digital Audio Interface Antenna Diversity JTAG Debug Pulse Counters Intelligent Peripheral MUX 2-wire Interface Timer2 Timer1 Timer0 UART1 UART0 SPI Master SPISEL1 SPISEL2 SPISEL3 SPISEL4 TXD0 RXD0 RTS0 CTS0 TXD1 RXD1 RTS1 CTS1 TIM0CK_GT TIM0OUT TIM0CAP TIM1CK_GT TIM1OUT TIM1CAP TIM2OUT SIF_D SIF_CLK IP_DO IP_DI IP_INT IP_CLK IP_SEL PC0 PC1 JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO ADO ADE I2S_OUT I2S_DIN I2S_CLK I2S_SYNC SPICLK SPIMOSI SPIMISO SPISEL0 DIO0/SPISEL1 DIO1/SPISEL2/PC0 DIO2/SPISEL3/RFRX DIO3/SPISEL4/RFTX DIO4/CTS0/JTAG_TCK DIO5/RTS0/JTAG_TMS DIO6/TXD0/JTAG_TDO DIO7/RXD0/JTAG_TDI DIO8/TIM0CK_GT/PC1 DIO9/TIM0CAP/32KXTALIN/32KIN DIO10/TIM0OUT/32KXTALOUT DIO11/TIM1CK_GT/TIM2OUT DIO12/TIM1CAP/ADO/DAI_WS DIO13/TIM1OUT/ADE/DAI_SDN DIO14/SIF_CLK/IP_CLK DIO15/SIF_D/IP_DO DIO16/IP_DI DIO17/CTS1/IP_SEL/DAI_SCK/ JTAG_TCK DIO18/RTS1/IP_INT/DAI_SDOUT/ JTAG_TMS DIO19/TXD1/JTAG_TDO DIO20/RXD1/JTAG_TDI Figure 22 DIO Block Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 35 10 Serial Peripheral Interface The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the JN5148 and peripheral devices. The JN5148 operates as a master on the SPI bus and all other devices connected to the SPI are expected to be slave devices under the control of the JN5148 CPU. The SPI includes the following features: • Full-duplex, three-wire synchronous data transfer • Programmable bit rates (up to 16Mbit/s) • Programmable transaction size up to 32-bits • Standard SPI modes 0,1,2 and 3 • Manual or Automatic slave select generation (up to 5 slaves) • Maskable transaction complete interrupt • LSB First or MSB First Data Transfer • Supports delayed read edges Clock Divider SPI Bus Cycle Controller Data Buffer DIV Clock Edge Select Data CHAR_LEN LSB SPIMISO SPIMOSI SPICLK Select Latch SPISEL [4..0] 16 MHz Figure 23: SPI Block Diagram The SPI bus employs a simple shift register data transfer scheme. Data is clocked out of and into the active devices in a first-in, first-out fashion allowing SPI devices to transmit and receive data simultaneously. There are three dedicated pins SPICLK, SPIMOSI, SPIMISO that are shared across all devices on the bus. MasterOut-Slave-In or Master-In-Slave-Out data transfer is relative to the clock signal SPICLK generated by the JN5148. The JN5148 provides five slave selects, SPISEL0 to SPISEL4 to allow five SPI peripherals on the bus. SPISEL0 is a dedicated pin; this is generally connected to a serial Flash/ EEPROM memory holding application code that is downloaded to internal RAM via software from reset. SPISEL1 to 4, are alternate functions of pins DIO0 to 3 respectively. The interface can transfer from 1 to 32-bits without software intervention and can keep the slave select lines asserted between transfers when required, to enable longer transfers to be performed. When the device reset is active, the three outputs SPISEL, SPICLK and SPI_MOSI are tri-stated and SPI_MISO is set to be an input. The pull-up resistors associated with all four pins will be active at this time. 36 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 SI C SO SS Slave 0 Flash/ EEPROM Memory JN5148 37 38 41 42 43 36 33 34 SI C SO SS Slave 1 User Defined SI C SO SS Slave 2 User Defined SI C SO SS Slave 3 User Defined SI C SO SS Slave 4 User Defined SPIMISO SPIMOSI SPICLK SPISEL4 SPISEL2 SPISEL3 SPISEL1 SPISEL0 Figure 24: Typical JN5148 SPI Peripheral Connection The data transfer rate on the SPI bus is determined by the SPICLK signal. The JN5148 supports transfers at selectable data rates from 16MHz to 125kHz selected by a clock divider. Both SPICLK clock phase and polarity are configurable. The clock phase determines which edge of SPICLK is used by the JN5148 to present new data on the SPIMOSI line; the opposite edge will be used to read data from the SPIMISO line. The interface should be configured appropriately for the SPI slave being accessed. SPICLK Mode Description Polarity (CPOL) Phase (CPHA) 0 0 0 SPICLK is low when idle – the first edge is positive. Valid data is output on SPIMOSI before the first clock and changes every negative edge. SPIMISO is sampled every positive edge. 0 1 1 SPICLK is low when idle – the first edge is positive. Valid data is output on SPIMOSI every positive edge. SPIMISO is sampled every negative edge. 1 0 2 SPICLK is high when idle – the first edge is negative. Valid data is output on SPIMOSI before the first clock edge and is changed every positive edge. SPIMISO is sampled every negative edge. 1 1 3 SPICLK is high when idle – the first edge is negative. Valid data is output on SPIMOSI every negative edge. SPIMISO is sampled every positive edge. Table 3 SPI Configurations If more than one SPISEL line is to be used in a system they must be used in numerical order starting from SPISEL0. For instance if 3 SPI select lines are to be used, they must be SPISEL0, 1 and 2. A SPISEL line can be automatically deasserted between transactions if required, or it may stay asserted over a number of transactions. For devices such as memories where a large amount of data can be received by the master by continually providing SPICLK transitions, the ability for the select line to stay asserted is an advantage since it keeps the slave enabled over the whole of the transfer. A transaction commences with the SPI bus being set to the correct configuration, and then the slave device is selected. Upon commencement of transmission (1 to 32 bits) data is placed in the FIFO data buffer and clocked out, at the same time generating the corresponding SPICLK transitions. Since the transfer is full-duplex, the same number of data bits is being received from the slave as it transmits. The data that is received during this transmission can be read (1 to 32 bits). If the master simply needs to provide a number of SPICLK transitions to allow data to be © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 37 sent from a slave, it should perform transmit using dummy data. An interrupt can be generated when the transaction has completed or alternatively the interface can be polled. If a slave device wishes to signal the JN5148 indicating that it has data to provide, it may be connected to one of the DIO pins that can be enabled as an interrupt. Figure 25 shows a complex SPI transfer, reading data from a FLASH device, that can be achieved using the SPI master interface. The slave select line must stay low for many separate SPI accesses, and therefore manual slave select mode must be used. The required slave select can then be asserted (active low) at the start of the transfer. A sequence 8 and 32 bit transfers can be used to issue the command and address to the FLASH device and then to read data back. Finally, the slave select can be deselected to end the transaction. 0 1 2 3 4 5 6 7 Instruction (0x03) 23 22 21 3 2 1 0 8 9 10 28 29 30 31 24-bit Address MSB Instruction Transaction 7 6 5 4 3 2 1 0 MSB 0 1 2 3 4 5 7 8N-1 3 2 1 0 LSB Read Data Bytes Transaction(s) 1-N SPISEL SPICLK SPIMOSI SPIMISO SPISEL SPICLK SPIMOSI SPIMISO 8 9 10 7 6 5 MSB Byte 1 Byte 2 Byte N value unused by peripherals 6 Figure 25: Example SPI Waveforms – Reading from FLASH device using Mode 038 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 11 Timers 11.1 Peripheral Timer/Counters Three general-purpose timer/counter units are available that can be independently configured to operate in one of five possible modes. Timer 0 and 1 support all 5 modes of operation and Timer 2 supports PWM and Delta-Sigma modes only. The timers have the following: • 5-bit prescaler, divides system clock by 2 prescale value as the clock to the timer (prescaler range is 0 to 16) • Clocked from internal system clock (16MHz) • 16-bit counter, 16-bit Rise and Fall (period) registers • Timer: can generate interrupts off Rise and Fall counts. Can be gated by external signal • Counter: counts number of transitions on external event signal. Can use low-high, high-low or both transitions • PWM/Single pulse: outputs repeating Pulse Width Modulation signal or a single pulse. Can set period and mark-space ratio • Capture: measures times between transitions of an applied signal • Delta-Sigma: Return-To-Zero (RTZ) and Non-Return-to-Zero (NRZ) modes • Timer usage of external IO can be controlled on a pin by pin basis Interrupt Generator Rise Fall Delta-Sigma Counter Reset Generator = Prescaler INT Int Enable SYSCLK S/w Reset System Reset Single Shot = S R OE Gate Gate Edge Select Reset PWM/DeltaSigma Capture Generator Capture Enable PWM/∆−Σ PWM/∆−Σ TIMxCK_GT TIMxOUT TIMxCAP Figure 26: Timer Unit Block Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 39 The clock source for the timer unit is fed from the 16MHz system clock. This clock passes to a 5-bit prescaler where a value of 0 leaves the clock unmodified and other values divide it by 2 prescale value. For example, a prescale value of 2 applied to the 16MHz system clock source results in a timer clock of 4MHz. The counter is optionally gated by a signal on the clock/gate input (TIMxCK_GT). If the gate function is selected, then the counter is frozen when the clock/gate input is high. An interrupt can be generated whenever the counter is equal to the value in either of the High or Low registers. The internal Output Enable (OE) signal enables or disables the timer output. The Timer 0 signals CK_GT, CAP and OUT are alternate functions of pins DIO8, 9 and 10 respectively and Timer 1 signals CK_GT, CAP and OUT are alternate functions of pins DIO11, 12, and 13 respectively. Timer 2 OUT is an alternate function of DIO11 If operating in timer mode it is not necessary to use any of the DIO pins, allowing the standard DIO functionality to be available to the application. Note, timer 0 may only be used as an internal timer or in counter mode (counting events) if an external 32kHz crystal is used. If timer 2 is used in PWM or Delta-Sigma mode then timer 1 does not have access to its clock/gate pin. Therefore, it can not operate in counter mode (counting events) or use the gate function. 11.1.1 Pulse Width Modulation Mode Pulse Width Modulation (PWM) mode allows the user to specify an overall cycle time and pulse length within the cycle. The pulse can be generated either as a single shot or as a train of pulses with a repetition rate determined by the cycle time. In this mode, the cycle time and low periods of the PWM output signal can be set by the values of two independent 16-bit registers (Fall and Rise). The counter increments and its output is compared to the 16-bit Rise and Fall registers. When the counter is equal to the Rise register, the PWM output is set to high; when the counter reaches the Fall value, the output returns to low. In continuous mode, when the counter reaches the Fall value, it will reset and the cycle repeats. The PWM waveform is available on TIMxOUT when the output driver is enabled. Rise Fall Figure 27: PWM Output Timings 11.1.2 Capture Mode The capture mode can be used to measure the time between transitions of a signal applied to the capture input (TIMxCAP). When the capture is started, on the next low-to-high transition of the captured signal, the count value is stored in the Rise register, and on the following high-to-low transition, the counter value is stored in the Fall register. The pulse width is the difference in counts in the two registers multiplied by the period of the prescaled clock. Upon reading the capture registers the counter is stopped. The values in the High and Low registers will be updated whenever there is a corresponding transition on the capture input, and the value stored will be relative to when the mode was started. Therefore, if multiple pulses are seen on TIMxCAP before the counter is stopped only the last pulse width will be stored.40 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 CLK CAPT x 9 3 x 14 t RISE t RISE t FALL t FALL Rise Fall 9 5 3 4 7 Capture Mode Enabled Figure 28: Capture Mode 11.1.3 Counter/Timer Mode The counter/timer can be used to generate interrupts, based on the timers or event counting, for software to use. As a timer the clock source is from the system clock, prescaled if required. The timer period is programmed into the Fall register and the Fall register match interrupt enabled. The timer is started as either a single-shot or a repeating timer, and generates an interrupt when the counter reaches the Fall register value. When used to count external events on TIMxCK_GT the clock source is selected from the input pin and the number of events programmed into the Fall register. The Fall register match interrupt is enabled and the counter started, usually in single shot mode. An interrupt is generated when the programmed number of transitions is seen on the input pin. The transitions counted can configured to be rising, falling or both rising and falling edges. Edges on the event signal must be at least 100nsec apart, i.e. pulses must be wider than 100nsec. 11.1.4 Delta-Sigma Mode A separate delta-sigma mode is available, allowing a low speed delta-sigma DAC to be implemented with up to 16-bit resolution. This requires that a resistor-capacitor network is placed between the output DIO pin and digital ground. A stream of pulses with digital voltage levels is generated which is integrated by the RC network to give an analogue voltage. A conversion time is defined in terms of a number of clock cycles. The width of the pulses generated is the period of a clock cycle. The number of pulses output in the cycle, together with the integrator RC values, will determine the resulting analogue voltage. For example, generating approximately half the number of pulses that make up a complete conversion period will produce a voltage on the RC output of VDD1/2, provided the RC time constant is chosen correctly. During a conversion, the pulses will be pseudo-randomly dispersed throughout the cycle in order to produce a steady voltage on the output of the RC network. The output signal is asserted for the number of clock periods defined in the High register, with the total period being 216 cycles. For the same value in the High register, the pattern of pulses on subsequent cycles is different, due to the pseudo-random distribution. The delta-sigma convertor output can operate in a Return-To-Zero (RTZ) or a Non-Return-to-Zero (NRZ) mode. The NRZ mode will allow several pulses to be output next to each other. The RTZ mode ensures that each pulse is separated from the next by at least one period. This improves linearity if the rise and fall times of the output are different to one another. Essentially, the output signal is low on every other output clock period, and the conversion cycle time is twice the NRZ cycle time ie 217 clocks. The integrated output will only reach half VDD2 in RTZ mode, since even at full scale only half the cycle contains pulses. Figure 29 and Figure 30 illustrate the difference between RTZ and NRZ for the same programmed number of pulses.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 41 1 2 3 1 2 N Conversion cycle 1 217 N Conversion cycle 2 3 Figure 29: Return To Zero Mode in Operation 1 2 3 1 2 N Conversion cycle 1 N 3 216 Conversion cycle 2 Figure 30: Non-Return to Zero Mode 11.1.5 Example Timer / Counter Application Figure 31 shows an application of the JN5148 timers to provide closed loop speed control. Timer 0 is configured in PWM mode to provide a variable mark-space ratio switching waveform to the gate of the NFET. This in turn controls the power in the DC motor. Timer 1 is configured to count the rising edge events on the clk/gate pin over a constant period. This converts the tacho pulse stream output into a count proportional to the motor speed. This value is then used by the application software executing the control algorithm. If required for other functionality, then the unused IO associated with the timers could be used as general purpose DIO. JN5148 Timer 0 Timer 1 CLK/GATE CLK/GATE CAPTURE CAPTURE PWM PWM M Tacho 48 50 52 53 54 1N4007 +12V IRF521 51 1 pulse/rev Figure 31: Closed Loop PWM Speed Control Using JN5148 Timers 11.2 Tick Timer The JN5148 contains a hardware timer that can be used for generating timing interrupts to software. It may be used to implement regular events such as ticks for software timers or an operating system, as a high-precision timing reference or can be used to implement system monitor timeouts as used in a watchdog timer. Features include: • 32-bit counter42 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 • 28-bit match value • Maskable timer interrupt • Single-shot, Restartable or Continuous modes of operation Match Value Counter = Mode Control & & SysClk Run Match Int Enable Tick Timer Interrupt Reset Mode Figure 32: Tick Timer The Tick Timer is clocked from a continuous 16MHz clock, which is fed to a 32-bit wide resettable up-counter, gated by a signal from the mode control block. A match register allows comparison between the counter and a programmed value. The match value, measured in 16MHz clock cycles is programmed through software, in the range 0 to 0x0FFFFFFF. The output of the comparison can be used to generate an interrupt if the interrupt is enabled and used in controlling the counter in the different modes. Upon configuring the timer mode, the counter is also reset. If the mode is programmed as single shot, the counter begins to count from zero until the match value is reached. The match signal will be generated which will cause an interrupt if enabled, and the counter will stop counting. The counter is restarted by reprogramming the mode. If the mode is programmed as restartable, the operation of the counter is the same as for the single shot mode, except that when the match value is reached the counter is reset and begins counting from zero. An interrupt will be generated when the match value is reached if it is enabled. Continuous mode operation is similar to restartable, except that when the match value is reached, the counter is not reset but continues to count. An interrupt will be generated when the match value is reached if enabled. 11.3 Wakeup Timers Two 32-bit wakeup timers are available in the JN5148 driven from the 32kHz internal clock. They may run during sleep periods when the majority of the rest of the device is powered down, to time sleep periods or other long period timings that may be required by the application. The wakeup timers do not run during deep sleep and may optionally be disabled in sleep mode through software control. When a wakeup timer expires it typically generates an interrupt, if the device is asleep then the interrupt may be used as an event to end the sleep period. See Section 21 for further details on how they are used during sleep periods. Features include: • 35-bit down-counter • Optionally runs during sleep periods • Clocked by 32kHz system clock; either 32kHz RC oscillator, 32kHz XTAL oscillator or 32kHz clock input© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 43 A wakeup timer consists of a 35-bit down counter clocked from the selected 32 kHz clock. An interrupt or wakeup event can be generated when the counter reaches zero. On reaching zero the counter will continue to count down until stopped, which allows the latency in responding to the interrupt to be measured. If an interrupt or wakeup event is required, the timer interrupt should be enabled before loading the count value for the period. Once the count value is loaded and counter started, the counter begins to count down; the counter can be stopped at any time through software control. The counter will remain at the value it contained when the timer was stopped and no interrupt will be generated. The status of the timers can be read to indicate if the timers are running and/or have expired; this is useful when the timer interrupts are masked. This operation will reset any expired status flags. 11.3.1 RC Oscillator Calibration The RC oscillator that can be used to time sleep periods is designed to require very little power to operate and be self-contained, requiring no external timing components and hence is lower cost. As a consequence of using on-chip resistors and capacitors, the inherent absolute accuracy and temperature coefficient is lower than that of a crystal oscillator, but once calibrated the accuracy approaches that of a crystal oscillator. Sleep time periods should be as close to the desired time as possible in order to allow the device to wake up in time for important events, for example beacon transmissions in the IEEE802.15.4 protocol. If the sleep time is accurate, the device can be programmed to wake up very close to the calculated time of the event and so keep current consumption to a minimum. If the sleep time is less accurate, it will be necessary to wake up earlier in order to be certain the event will be captured. If the device wakes earlier, it will be awake for longer and so reduce battery life. In order to allow sleep time periods to be as close to the desired length as possible, the true frequency of the RC oscillator needs to be determined to better than the initial 30% accuracy. The calibration factor can then be used to calculate the true number of nominal 32kHz periods needed to make up a particular sleep time. A calibration reference counter, clocked from the 16MHz system clock, is provided to allow comparisons to be made between the 32kHz RC clock and the 16MHz system clock when the JN5148 is awake. Wakeup timer0 counts for a set number of 32kHz clock periods during which time the reference counter runs. When the wakeup timer reaches zero the reference counter is stopped, allowing software to read the number of 16MHz clock ticks generated during the time represented by the number of 32kHz ticks programmed in the wakeup timer. The true period of the 32kHz clock can thus be determined and used when programming a wakeup timer to achieve a better accuracy and hence more accurate sleep periods For a RC oscillator running at exactly 32,000Hz the value returned by the calibration procedure should be 10000, for a calibration period of twenty 32,000Hz clock periods. If the oscillator is running faster than 32,000Hz the count will be less than 10000, if running slower the value will be higher. For a calibration count of 9000, indicating that the RC oscillator period is running at approximately 35kHz, to time for a period of 2 seconds the timer should be loaded with 71,111 ((10000/9000) x (32000 x 2)) rather than 64000.44 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 12 Pulse Counters Two 16-bit counters are provided that can increment during all modes of operation (including sleep), based on pulses received on 2 dedicated DIO inputs; DIO1 and DIO8. The pulses can be de-bounced using the 32kHz clock to guard against false counting on slow or noisy edges. Increments occur from a configurable rising or falling edge on the respective DIO input. Each counter has an associated 16-bit reference that is loaded by the user. An interrupt (and wakeup event if asleep) may be generated when a counter reaches its pre-configured reference value. The two counters may optionally be cascaded together to provide a single 32-bit counter, linked to DIO1. The counters do not saturate at 65535, but naturally roll-over to 0. Additionally, the pulse counting continues when the reference value is reached without software interaction so that pulses are not missed even if there is a long delay before an interrupt is serviced or during the wakeup process. The system can work with signals up to 100kHz, with no debounce, or from 5.3kHz to 1.7kHz with debounce. When using debounce the 32kHz clock must be active, so for minimum sleep currents the debounce mode should not be used.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 45 13 Serial Communications The JN5148 has two independent Universal Asynchronous Receiver/Transmitter (UART) serial communication interfaces. These provide similar operating features to the industry standard 16550A device operating in FIFO mode. Each interface performs serial-to-parallel conversion on incoming serial data and parallel-to-serial conversion on outgoing data from the CPU to external devices. In both directions, a 16-byte deep FIFO buffer allows the CPU to read and write multiple characters on each transaction. This means that the CPU is freed from handling data on a character-by-character basis, with the associated high processor overhead. The UARTs have the following features: • Emulates behaviour of industry standard NS16450 and NS16550A UARTs • 16 byte transmit and receive FIFO buffers reduce interrupts to CPU, with direct access to fill levels of each • Adds / deletes standard start, stop and parity communication bits to or from the serial data • Independently controlled transmit, receive, status and data sent interrupts • Optional modem flow control signals CTS and RTS • Fully programmable data formats: baud rate, start, stop and parity settings • False start bit detection, parity, framing and FIFO overrun error detect and break indication • Internal diagnostic capabilities: loop-back controls for communications link fault isolation • Flow control by software or automatically by hardware Processor Bus Divisor Latch Registers Line Status Register Line Control Register FIFO Control Register Receiver FIFO Transmitter FIFO Baud Generator Logic Transmitter Shift Register Receiver Shift Register Transmitter Logic Receiver Logic RXD TXD Modem Control Register Modem Status Register Modem Signals Logic RTS CTS Interrupt ID Register Interrupt Enable Register Interrupt Logic Internal Interrupt Figure 33: UART Block Diagram The serial interface contains programmable fields that can be used to set number of data bits (5, 6,7 or 8), even, odd, set-at-1, set-at-0 or no-parity detection and generation of single or multiple stop bit, (for 5 bit data, multiple is 1.5 stop bits; for 6, 7 or 8 data bits, multiple is 2 bits). The baud rate is programmable up to 1Mbps, standard baud rates such as 4800, 9600, 19.2k, 38.4k etc. can be configured. For applications requiring hardware flow control, two control signals are provided: Clear-To-Send (CTS) and RequestTo-Send (RTS). CTS is an indication sent by an external device to the UART that it is ready to receive data. RTS is an indication sent by the UART to the external device that it is ready to receive data. RTS is controlled from software, while the value of CTS can be read. Monitoring and control of CTS and RTS is a software activity, normally performed as part of interrupt processing. The signals do not control parts of the UART hardware, but simply indicate to software the state of the UART external interface. Alternatively, the Automatic Flow Control mode can be set 46 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 where the hardware controls the value of the generated RTS (negated if the receive FIFO fill level is greater than a programmable threshold of 8, 11, 13 or 15 bytes), and only transmits data when the incoming CTS is asserted. Software can read characters, one byte at a time, from the Receive FIFO and can also write to the Transmit FIFO, one byte at a time. The Transmit and Receive FIFOs can be cleared and reset independently of each other. The status of the transmitter can be checked to see if it is empty, and if there is a character being transmitted. The status of the receiver can also be checked, indicating if conditions such as parity error, framing error or break indication have occurred. It also shows if an overrun error occurred (receive buffer full and another character arrives) and if there is data held in the receive FIFO. UART 0 signals CTS, RTS, TXD and RXD are alternate functions of pins DIO4, 5, 6 and 7 respectively and UART 1 signals CTS, RTS, TXD and RXD are alternate functions of pins DIO17, 18, 19 and 20 respectively. If CTS and RTS are not required on the devices external pins, then they may be disabled, this allows the DIOx function to be used for other purposes. Note: With the automatic flow control threshold set to 15, the hardware flow control within the UART block negates RTS when the receive FIFO is about to become full. In some instances it has been observed that remote devices that are transmitting data do not respond quickly enough to the de-asserted CTS and continue to transmit data. In these instances the data will be lost in a receive FIFO overflow. 13.1 Interrupts Interrupt generation can be controlled for the UART block, and is divided into four categories: • Received Data Available: Is set when data in the Rx FIFO queue reaches a particular level (the trigger level can be configured as 1, 4, 8 or 14) or if no character has been received for 4 character times. • Transmit FIFO Empty: set when the last character from the Tx FIFO is read and starts to be transmitted. • Receiver Line Status: set when one of the following occur (1) Parity Error - the character at the head of the receive FIFO has been received with a parity error, (2) Overrun Error - the Rx FIFO is full and another character has been received at the Receiver shift register, (3) Framing Error - the character at the head of the receive FIFO does not have a valid stop bit and (4) Break Interrupt – occurs when the RxD line has been held low for an entire character. • Modem Status: Generated when the CTS (Clear To Send) input control line changes. 13.2 UART Application The following example shows the UART connected to a 9-pin connector compatible with a PC. As the JN5148 device pins do not provide the RS232 line voltage, a level shifter is used. JN5148 RTS CTS TXD UART0 RXD RS232 Lev el Shif ter 1 2 3 4 5 6 7 8 9 CD RD TD DTR SG DSR RTS CTS RI PC COM Port 1 5 Pin Signal 6 9 46 47 45 44 Figure 34: JN5148 Serial Communication Link© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 47 14 JTAG Debug Interface The JN5148 includes an IEEE1149.1 compliant JTAG port for the sole purpose of software code debug with NXP's Software Developer’s Kit. The JTAG interface is disabled by default and is enabled under software control. Therefore, debugging is only possible if enabled by the application. Once enabled, the application executes as normal until the external debugger controller initiates debug activity. The Debugger supports breakpoints and watchpoints based on four comparisons between any of program counter, load/store effective address and load/store data. There is the ability to chain the comparisons together. There is also the ability, under debugger control to perform the following commands: go, stop, reset, step over/into/out/next, run to cursor and breakpoints. In addition, under control of the debugger, it is possible to: • Read and write registers on the wishbone bus • Read ROM and RAM, and write to RAM • Read and write CPU internal registers The Debugger interface is accessed, depending upon the configuration, through the pins used for UART0 or UART1. This is enabled under software control and is dealt with in JN-AN-1118 JN5148 Application Debugging [4]. The following table details which DIO are used for the JTAG interface depending upon the configuration. Signal DIO Assignment UART0 pins UART1 pins clock (TCK) 4 17 control (TMS) 5 18 data out (TDO) 6 19 data in (TDI) 7 20 Table 4 Hardware Debugger IO If doze mode is active when debugging is started, the processor will be woken and then respond to debugger commands. It is not possible to wake the device from sleep using the debug interface and debugging is not available while the device is sleeping. When using the debug interface, program execution is halted, and control of the CPU is handed to the debugger. The watchdog, tick timer and the three timers described in section 11 are stalled while the debugger is in control of the CPU. When control is handed from the CPU to the debugger or back a small number of CPU clock cycles are taken flushing or reloading the CPU pipeline. Because of this, when a program is halted by the debugger and then restarted again, a small number of tick timer cycles will elapse. It is possible to prevent all hardware debugging by blowing the relevant Efuse bit. The JTAG interface does not support boundary scan testing. It is recommended that the JN5148 is not connected as part of the board scan chain.48 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 15 Two-Wire Serial Interface The JN5148 includes industry standard two-wire synchronous Serial Interface operates as a Master (MSIF) or Slave (SSIF) that provides a simple and efficient method of data exchange between devices. The system uses a serial data line (SIF_D) and a serial clock line (SIF_CLK) to perform bi-directional data transfers and includes the following features: Common to both master and slave: • Compatible with both I2 C and SMbus peripherals • Support for 7 and 10-bit addressing modes • Optional pulse suppression on signal inputs Master only: • Multi-master operation • Software programmable clock frequency • Clock stretching and wait state generation • Software programmable acknowledge bit • Interrupt or bit-polling driven byte-by-byte data-transfers • Bus busy detection Slave only: • Programmable slave address • Simple byte level transfer protocol • Write data flow control with optional clock stretching or acknowledge mechanism • Read data preloaded or provided as required 15.1 Connecting Devices The clock and data lines, SIF_D and SIF_CLK, are alternate functions of DIO15 and DIO14 respectively. The serial interface function of these pins is selected when the interface is enabled. They are both bi-directional lines, connected internally to the positive supply voltage via weak (45kΩ) programmable pull-up resistors. However, it is recommended that external 4.7kΩ pull-ups be used for reliable operation at high bus speeds, as shown in Figure 35. When the bus is free, both lines are HIGH. The output stages of devices connected to the bus must have an opendrain or open-collector in order to perform the wired-AND function. The number of devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. SIF_CLK SIF_D VDD D1_OUT D1_IN CLK1_IN CLK1_OUT D2_IN CLK2_IN CLK2_OUT DEVICE 1 DEVICE 2 RP RP Pullup Resistors D2_OUT JN5148 SIF DIO14 DIO15 Figure 35: Connection Details© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 49 15.2 Clock Stretching Slave devices can use clock stretching to slow down the transfer bit rate. After the master has driven SIF_CLK low, the slave can drive SIF_CLK low for the required period and then release it. If the slave’s SIF_CLK low period is greater than the master’s low period the resulting SIF_CLK bus signal low period is stretched thus inserting wait states. SIF_CLK SIF_CLK SIF_CLK Master SIF_CLK Slave SIF_CLK Wired-AND SIF_CLK Clock held low by Slave Figure 36: Clock Stretching 15.3 Master Two-wire Serial Interface When operating as a master device, it provides the clock signal and a prescale register determines the clock rate, allowing operation up to 400kbit/s. Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for indicating when start, stop, read, write and acknowledge control should be generated. Write data written into a transmit buffer will be written out across the two-wire interface when indicated, and read data received on the interface is made available in a receive buffer. Indication of when a particular transfer has completed may be indicated by means of an interrupt or by polling a status bit. The first byte of data transferred by the device after a start bit is the slave address. The JN5148 supports both 7-bit and 10-bit slave addresses by generating either one or two address transfers. Only the slave with a matching address will respond by returning an acknowledge bit. The master interface provides a true multi-master bus including collision detection and arbitration that prevents data corruption. If two or more masters simultaneously try to control the bus, a clock synchronization procedure determines the bus clock. Because of the wired-AND connection of the interface, a high-to-low transition on the bus affects all connected devices. This means a high-to-low transition on the SIF_CLK line causes all concerned devices to count off their low period. Once the clock input of a device has gone low, it will hold the SIF_CLK line in that state until the clock high state is reached when it releases the SIF_CLK line. Due to the wired-AND connection, the SIF_CLK line will therefore be held low by the device with the longest low period, and held high by the device with the shortest high period. SIF_CLK1 SIF_CLK2 SIF_CLK Master1 SIF_CLK Master2 SIF_CLK Wired-AND SIF_CLK Start counting low period Start counting high period Wait State Figure 37: Multi-Master Clock Synchronisation After each transfer has completed, the status of the device must be checked to ensure that the data has been acknowledged correctly, and that there has been no loss of arbitration. (N.B. Loss of arbitration may occur at any point during the transfer, including data cycles). An interrupt will be generated when arbitration has been lost.50 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 15.4 Slave Two-wire Serial Interface When operating as a slave device, the interface does not provide a clock signal, although it may drive the clock signal low if it is required to apply clock stretching. Only transfers whose address matches the value programmed into the interface’s address register are accepted. The interface allows both 7 and 10 bit addresses to be programmed, but only responds with an acknowledge to a single address. Addresses defined as “reserved” will not be responded to, and should not be programmed into the address register. A list of reserved addresses is shown in Table 5. Address Name Behaviour 0000 000 General Call/Start Byte Ignored 0000 001 CBUS address Ignored 0000 010 Reserved Ignored 0000 011 Reserved Ignored 0000 1XX Hs-mode master code Ignored 1111 1XX Reserved Ignored 1111 0XX 10-bit address Only responded to if 10 bit address set in address register Table 5 : List of two-wire serial interface reserved addresses Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for taking write data from a receive buffer and providing read data to a transmit buffer when indicated. A series of interrupt status bits are provided to control the flow of data. For writes, in to the slave interface, it is important that data is taken from the receive buffer by the processor before the next byte of data arrives. To enable this, the interface may be configured to work in two possible backoff modes: • Not Acknowledge mode – where the interface returns a Not Acknowledge (NACK) to the master if more data is received before the previous data has been taken. This will lead to the termination of the current data transfer. • Clock Stretching mode – where the interface holds the clock line low until the previous data has been taken. This will occur after transfer of the next data but before issuing an acknowledge For reads, from the slave interface, the data may be preloaded into the transmit buffer when it is empty (i.e. at the start of day, or when the last data has been read), or fetched each time a read transfer is requested. When using data preload, read data in the buffer must be replenished following a data write, as the transmit and received data is contained in a shared buffer. The interface will hold the bus using clock stretching when the transmit buffer is empty. Interrupts may be triggered when: • Data Buffer read data is required – a byte of data to be read should be provided to avoid the interface from clock stretching • Data Buffer read data has been taken – this indicates when the next data may be preloaded into the data buffer • Data Buffer write data is available – a byte of data should be taken from the data buffer to avoid data backoff as defined above • The last data in a transfer has completed – i.e. the end of a burst of data, when a Stop or Restart is seen • A protocol error has been spotted on the interface© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 51 16 Four-Wire Digital Audio Interface The JN5148 includes a four-wire digital audio interface that can be used for interfacing to audio CODECs. The following features are supported: • Compatible with the industry standard I²S interface • Option to support I²S, left justified and right justified modes • Optional support for connection to mono sample FIFO with data transferred on the left or right channel • Master only • Transmit on falling edge and receive on rising edge • Up to 8MHz maximum clock range • Maximum system size of 32-bits, allowing up to 16-bits per channel (left or right channels) • Option for pad bit insertion, allowing length of transfer per channel to be anything from 16 to 32 bits • Data Transfer size range of 1 to 16-bits per channel • Option to invert WS (normally 0 for left, but allow 1 for left instead) • Continuous clock output option to support CODECs which use it as a clock source • Separate input and output data lines • Option to invert idle state of WS (to indicate left or right) The Word Select (WS), Data In (SDIN), Clock (SCK) and Data Out (SDOUT) lines are alternate functions of DIO lines 12,13,17 and 18 respectively. Data transfer is always bidirectional. Data placed in the Data Buffer before a transfer command is issued will be transmitted on SDOUT whilst the data received on SDIN will be placed in the Data Buffer at the end of the transfer. Indication that a transfer has completed is by means of an interrupt or by polling a status bit. Left channel data is always sent first, with MSB first on each channel. The interface will always transfer both left and right channel data. For mono data transfer, the user should pad out the unused channel with 0’s, and ignore any data returned on the unused channel. The length of a data transfer is derived as follows: • When padding is disabled – Data Transfer Length = 2 x Data Transfer Size • When padding is enabled – Data Transfer Length = 2 x (16 + Extra Pad Length) Timing of the 3 main modes is shown in Figure 38, Figure 39 and Figure 40. The Data Buffer shows how the data is stored and how it will be transferred onto the interface. SD Max Size indicates how the maximum transfer size (16 with no additional padding) will transfer, whilst SD 3-bits indicates how 3 bits of data will be aligned when padding is enabled. Received data in the Data Buffer will always be padded out with 0’s if the Data Transfer Size is less than 16- bits, and any bits received beyond 16-bits when extra padding is used, will be discarded. In the examples, the polarity of WS is shown with Left channel = 0, and the idle state is Right Channel. 52 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Data Buffer Right R2 R1 R0 Left L2 L1 L0 SCK WS SD Max Size SD 3-bits MSB LSB MSB LSB Left Right L2 L1 L0 0 R2 R1 R0 MSB-1 MSB-2 MSB-1 MSB-2 0 0 0 Figure 38: I²S Mode Data Buffer Right R2 R1 R0 Left L2 L1 L0 SCK WS SD Max Size SD 3-bits MSB LSB MSB LSB Left Right L2 L1 L0 0 R2 R1 R0 MSB-1 MSB-2 MSB-1 MSB-2 0 0 0 Figure 39: Left Justified Mode Data Buffer Right R2 R1 R0 Left L2 L1 L0 SCK WS SD Max Size SD 3-bits MSB LSB MSB LSB Left Right 0 L2 L1 L0 R2 R1 R0 MSB-1 MSB-1 0 0 0 Figure 40: Right Justified Mode© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 53 17 Random Number Generator A random number generator is provided which creates a 16-bit random number each time it is invoked. Consecutive calls can be made to build up any length of random number required. Each call takes approximately 0.25msec to complete. Alternatively, continuous generation mode can be used where a new number is generated approximately every 0.25msec. In either mode of operation an interrupt can be generated to indicate when the number is available, or a status bit can be polled. The random bits are generated by sampling the state of the 32MHz clock every 32kHz system clock edge. As these clocks are asynchronous to each other, each sampled bit is unpredictable and hence random.54 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 18 Sample FIFO A 10 deep FIFO is provided to buffer data between the CPU and either the four-wire digital audio interface or the DAC/ ADC. It supports single channel input and output data, up to 16 bits wide. When used it can reduce the rate at which the processor has to generate/process data, and this may allow more efficient operation. Interrupts can be generated based on fill levels and also FIFO empty and full conditions. Normal configuration of the digital audio interface or the DAC/ ADC is still required when accessing the data via the FIFO. When used with the DAC / ADC functions a timing signal is generated by the DAC/ ADC functions to control the transfer of data to and from the FIFO and the analogue peripherals. The transfers will occur at the sample rate configured within the DAC / ADC functions. When the FIFO is linked to the four-wire digital audio interface, timer 2 must be used to generate an internal timing signal to control the flow of data across the interface. The timer does not require any external pins to be enabled. The timer should be set up to produce a PWM output with a rising edge generated every time a digital audio transfer is required. The transfer rate is typically configured to be the audio sample rate, e.g. 8kHz. If the transfer rate is too fast or slow data will be transferred correctly between the FIFO and the digital audio block.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 55 19 Intelligent Peripheral Interface The Intelligent Peripheral (IP) Interface is provided for systems that are more complex, where there is a processor that requires a wireless peripheral. As an example, the JN5148 may provide a complete JenNet or ZigBee PRO wireless network interface to a phone, computer, PDA, set-top box or games console. No resources are required from the main processor compared to a transceiver as the complete wireless protocol may be run on the internal JN5148 CPU. The wireless peripheral may be controlled via one of the UARTs but the IP interface is intended to provide a high-speed, low-processor-overhead interface. The intelligent peripheral interface is a SPI slave interface and uses pins shared with other DIO signals. The interface is designed to allow message passing and data transfer. Data received and transmitted on the IP interface is copied directly to and from a dedicated area of memory without intervention from the CPU. This memory area, the intelligent peripheral memory block, contains 64 32-bit word receive and transmit buffers. JN5148 Intelligent Peripheral Interface SPI MASTER System Processor (e.g. in cellphone, computer) CPU IP_DO SPIMISO IP_INT SPIINT IP_DI SPIMOSI IP_SEL SPISEL IP_CLK SPICLK Figure 41: Intelligent Peripheral Connection The interface functions as a SPI slave. It is possible to select the clock edge of IP_CLK on which data on the IP_DIN line of the interface is sampled, and the state of data output IP_DOUT is changed. The order of transmission is MSB first. The IP_DO data output is tri-stated when the device is inactive, i.e. the device is not selected via IP_SEL. An interrupt output line IP_INT is available so that the JN5148 can indicate to an external master that it has data to transfer. The interface can be clocked at up to 8MHz The IP interface signals IP_CLK, IP_DO, IP_DI, IP_SEL, IP_INT are alternate functions of pins DIO14 to 18 respectively. 19.1 Data Transfer Format Transfers are started by the remote processor asserting the IP_SEL line and terminated by the remote processor deasserting IP_SEL. Data transfers are bi-directional and traffic in both directions has a format of status byte, data length byte (of the number of 32-bit words to transfer) and data packet (from the receive and transmit buffers), as shown in Figure 42 The first byte transferred into the JN5148 is a status byte with the format shown in Table 6. This is followed by a padding byte that should be set to zero. The first byte output by the JN5148 is a padding byte, that should be ignored, followed by a status byte with the format shown in Table 6 Bit Field Description 7:2 RSVD Reserved, set to 0 1 TXQ 1: Data queued for transmission 0 RXRDY 1: Buffer ready to receive data Table 6: IP Status Byte Format56 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 If data is queued for transmission and the recipient has indicated that they are ready for it (RXRDY in incoming status byte was 1), the next byte to be transmitted is the data length in words (N). If either the JN5148 or the remote processor has no data to transfer, then the data length should be set to zero. The transaction can be terminated by the master after the status and padding bytes have been sent if it is not possible to send data in either direction. This may be because neither party has data to send or because the receiver does not have a buffer available. If the data length is non-zero, the data in the JN5148 transmit memory buffer is sent, beginning at the start of the buffer. At the same time that data bytes are being sent from the transmit buffer, the JN5148 receive buffer is being filled with incoming data, beginning from the start of the buffer. The remote processor, acting as the master, must determine the larger of its incoming or outgoing data transfers and deassert IP_SEL when all of the transmit and receive data has been transferred. The data is transferred into or out of the buffers starting from the lowest address in the buffer, and each word is assembled with the MSB first on the serial data lines. Following a transaction, IP_SEL must be high (deasserted) for at least 400nsec before a further transaction can begin. IP_SEL IP_CLK IP_DI Status (8-bit) N words of data IP_DO data length or 0s (8-bit) padding (8-bit) Status (8-bit) data length or 0s (8-bit) N words of data padding (8-bit) Figure 42: Intelligent Peripheral Data Transfer Waveforms The N words of data transferred on the interface are also formatted. The first three bytes, of the first word, must be zero. These are followed by a one byte length field that must be one less than the data length shown in the data length field in Figure 42, i.e. N-1. Following this are the (N-1) words of data. The application running on the JN5148 has high level software functions for sending and receiving data on this interface. The function of generating and interpreting the individual bytes on the interface is handled by hardware within the device. The remote processor must generate, and interpret, the signals in the interface. For instance, this may be done with a configurable SPI master interface. 19.2 JN5148 (Slave) Initiated Data Transfer To send data, the data is written into either buffer 0 or 1 of the intelligent peripheral memory area. Then the buffer number is written together with the data length. If the call is successful, the interrupt line IP_INT will signal to the remote processor that there is a message ready to be sent from the JN5148. When a remote processor starts a transfer to the JN5148 by deasserting IP_SEL, then IP_INT is deasserted. If the transfer is unsuccessful and the data is not output then IP_INT is reasserted after the transfer to indicate that data is still waiting to be sent. The interface can be configured to generate an internal interrupt whenever a transaction completes (for example IP_SEL becomes inactive after a transfer starts). It is also possible to mask the interrupt. The end of the transmission can be signalled by an interrupt, or the interface can be polled. To receive data the interface must be firstly initialised and when this is done, the bit RXRDY sent in the status byte from the IP block will show that data can be received by the JN5148. Successful data arrival can be indicated by an interrupt, or the interface can be polled. IP_INT is asserted if the JN5148 is configured to be able to receive, and the remote processor has previously attempted to send data but the RXRDY indicated that it could not be sent. To send and receive at the same time, the transmit and receive buffers must be set to be different. 19.3 Remote (Master) Processor Initiated Data Transfer The remote processor (master) must initiate a transfer to send data to the JN5148 (slave) by asserting the slave select pin, IP_SEL, and generating its status byte on IP_DI with TXRDY set. After receiving the status byte from the JN5148, the master should check that the JN5148 has a buffer ready by reading the RXRDY bit of the received status byte. If the RXRDY bit is 0 indicating that the JN5148 cannot accept data, it must terminate the transfer by deasserting IP_SEL unless it is receiving data from the JN5148. If the RXRDY bit is 1, indicating that the JN5148 can accept data, then the master should generate a further 8 clocks on IP_CLK in order to transfer its own message length on IP_DI. The master must continue clocking the interface until sufficient clocks have been generated to send © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 57 all the data specified in the length field to the JN5148. The master must then deassert IP_SEL to show the transfer is complete. The master may initiate a transfer to read data from the JN5148 by asserting the slave select pin, IP_SEL, and generating its status byte on IP_DI with RXRDY set. After receiving the status byte from the JN5148, it should check that the JN5148 has a buffer ready by reading the TXRDY bit of the received status byte. If the TXRDY bit is 0, indicating that the JN5148 does not have data to send, it must terminate the transfer by deasserting IP_SEL unless it is transmitting data to the JN5148. If the TXRDY bit is 1, indicating that the JN5148 can send data, then the master must generate a further 8 clocks on IP_CLK in order to receive the message length on IP_DO. The master must continue clocking the interface until sufficient clocks have been generated to receive all the data specified in the length field from the JN5148. The master should then deassert IP_SEL to show the transfer is complete. Data can be sent in both directions at once and the master must ensure both transfers have completed before deasserting IP_SEL.58 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 20 Analogue Peripherals The JN5148 contains a number of analogue peripherals allowing the direct connection of a wide range of external sensors, switches and actuators. ADC DAC1 DAC2 VREF Chip Boundary Internal Reference Processor Bus Supply Voltage (VDD1) Vref select Temp Sensor Comparator 2 Comparator 1 COMP2M COMP1M COMP1P COMP2P DAC1 DAC2 ADC1 ADC2 ADC3 ADC4 Vref Figure 43: Analogue Peripherals In order to provide good isolation from digital noise, the analogue peripherals are powered by a separate regulator, supplied from the analogue supply VDD1 and referenced to analogue ground VSSA. A common reference Vref for the ADC and DAC can be selected between an internal bandgap reference or an external voltage reference supplied to the VREF pin. Gain settings for the ADC and DAC are independent of each other. The ADC and DAC are clocked from a common clock source derived from the 16MHz clock© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 59 20.1 Analogue to Digital Converter The 12-bit analogue to digital converter (ADC) uses a successive approximation design to perform high accuracy conversions as typically required in wireless sensor network applications. It has six multiplexed single-ended input channels: four available externally, one connected to an internal temperature sensor, and one connected to an internal supply monitoring circuit. 20.1.1 Operation The input range of the ADC can be set between 0V to either the reference voltage or twice the reference voltage. The reference can be either taken from the internal voltage reference or from the external voltage applied to the VREF pin. For example, an external reference of 1.2V supplied to VREF may be used to set the ADC range between 0V and 2.4V. VREF Gain Setting Maximum Input Range Supply Voltage Range (VDD) 1.2V 1.6V 1.2V 1.6V 0 0 1 1 1.2V 1.6V 2.4V 3.2V 2.2V - 3.6V 2.2V - 3.6V 2.6V - 3.6V 3.4V - 3.6V Table 7 ADC/DAC Maximum Input Range The input clock to the ADC is 16MHz and can be divided down to 2MHz, 1MHz, 500kHz and 250kHz. During an ADC conversion the selected input channel is sampled for a fixed period and then held. This sampling period is defined as a number of ADC clock periods and can be programmed to 2, 4, 6 or 8. The conversion rate is ((3 x Sample period) + 14) clock periods. For example for 500kHz conversion with sample period of 2 will be (3 x 2) + 14 = 20 clock periods, 40usecs or 25kHz. . The ADC can be operated in either a single conversion mode or alternatively a new conversion can be started as soon as the previous one has completed, to give continuous conversions. If the source resistance of the input voltage is 1kΩ or less, then the default sampling time of 2 clocks should be used. The input to the ADC can be modelled as a resistor of 5kΩ(typ) and 10kΩ (max) to represent the on-resistance of the switches and the sampling capacitor 8pF. The sampling time required can then be calculated, by adding the sensor source resistance to the switch resistance, multiplying by the capacitance giving a time constant. Assuming normal exponential RC charging, the number of time constants required to give an acceptable error can be calculated, 7 time constants gives an error of 0.1%, so for 12-bit accuracy 10 time constants should be the target. For a source with zero resistance, 10 time constants is 800 nsecs, hence the smallest sampling window of 2 clock periods can be used. ADC pin 5 K 8 pF Sample Switch ADC front end Figure 44 ADC Input Equivalent Circuit The ADC sampling period, input range and mode (single shot or continuous) are controlled through software. When the ADC conversion is complete, an interrupt is generated. Alternatively the conversion status can be polled. When operating in continuous mode, it is recommended that the interrupt is used to signal the end of a conversion, since conversion times may range from 10 to 152 µsecs. Polling over this period would be wasteful of processor bandwidth. To facilitate averaging of the ADC values, which is a common practice in microcontrollers, a dedicated accumulator has been added, the user can define the accumulation to occur over 2,4,8 or 16 samples. The end of conversion 60 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 interrupt can be modified to occur at the end of the chosen accumulation period, alternatively polling can still be used. Software can then be used to apply the appropriate rounding and shifting to generate the average value, as well as setting up the accumulation function. For detailed electrical specifications, see section 22.3.8. 20.1.2 Supply Monitor The internal supply monitor allows the voltage on the analogue supply pin VDD1 to be measured. This is achieved with a potential divider that reduces the voltage by a factor of 0.666, allowing it to fall inside the input range of the ADC when set with an input range twice the internal voltage reference. The resistor chain that performs the voltage reduction is disabled until the measurement is made to avoid a continuous drain on the supply. 20.1.3 Temperature Sensor The on chip temperature sensor can be used either to provide an absolute measure of the device temperature or to detect changes in the ambient temperature. In common with most on chip temperature sensors, it is not trimmed and so the absolute accuracy variation is large; the user may wish to calibrate the sensor prior to use. The sensor forces a constant current through a forward biased diode to provide a voltage output proportional to the chip die temperature which can then be measured using the ADC. The measured voltage has a linear relationship to temperature as described in section 22.3.15. Because this sensor is on chip, any measurements taken must account for the thermal time constants. For example, if the device just came out of sleep mode the user application should wait until the temperature has stabilised before taking a measurement. 20.2 Digital to Analogue Converter The Digital to Analogue Converter (DAC) provides two output channels and is capable of producing voltages of 0 to Vref or 0 to 2Vref where Vref is selected between the internal reference and the VREF pin, with a resolution of 12-bits and a minimum conversion time of 10µsecs (2MHz clock). 20.2.1 Operation The output range of each DAC can be set independently to swing between 0V to either the reference voltage or twice the reference voltage. The reference voltage is selected from the internal reference or the VREF pin. For example, an external reference of 0.8V supplied to VREF may be used to set DAC1 maximum output of 0.8V and DAC2 maximum output of 1.6V. The DAC output amplifier is capable of driving a capacitive load up to that specified in section 22.3.9 Programmable clock periods allow a trade-off between conversion speed and resolution. The full 12-bit resolution is achieved with the 250kHz clock rate. See section 22.3.9 electrical characteristics, for more details. The conversion period of the DACs are given by the same formula as the ADC conversion time and so can vary between 10 and 152uS. The DAC values may be updated at the same time as the ADC is active. The clock divider ratio, interrupt enable and reference voltage select are all controlled through software, options common to both the ADC and DAC. The DAC output range and initial value can be set and the subsequent updates provided by updating only the DAC value. Polling is available to determine if a DAC channel is busy performing a conversion. The DAC can be disabled which will power down the DAC cell. Simultaneous conversions with DAC1 and DAC2 are possible. To use both DACs at the same time it is only necessary to enable them and supply the digital values via the software. The DACs should not be used in single shot mode, but continuous conversion mode only, in order to maintain a steady output voltage. © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 61 20.3 Comparators The JN5148 contains two analogue comparators COMP1 and COMP2 that are designed to have true rail-to-rail inputs and operate over the full voltage range of the analogue supply VDD1. The hysteresis level (common to both comparators) can be set to a nominal value of 0mV, 10mV, 20mV or 40mV. In addition, the source of the negative input signal for each comparator (COMP1M and COMP2M) can be set to the internal voltage reference, the output of DAC1 or DAC2 (COMP1 or COMP2 respectively) or the appropriate external pin. The comparator outputs are routed to internal registers and can be polled, or can be used to generate interrupts. The comparators can be disabled to reduce power consumption. The comparators have a low power mode where the response time of the comparator is slower than normal and is specified in section 22.3.10. This mode may be used during non-sleep operation however it is particularly useful in sleep mode to wake up the JN5148 from sleep where low current consumption is important. The wakeup action and the configuration for which edge of the comparator output will be active are controlled through software. In sleep mode the negative input signal source, must be configured to be driven from the external pins.62 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 21 Power Management and Sleep Modes 21.1 Operating Modes Three operating modes are provided in the JN5148 that enable the system power consumption to be controlled carefully to maximise battery life. • Active Processing Mode • Sleep Mode • Deep Sleep Mode The variation in power consumption of the three modes is a result of having a series of power domains within the chip that may be controllably powered on or off. 21.1.1 Power Domains The JN5148 has the following power domains: • VDD Supply Domain: supplies the wake-up timers and controller, DIO blocks, Comparators, 32kHz RC and crystal oscillators. This domain is driven from the external supply (battery) and is always powered. The wake-up timers and controller, and the 32kHz RC and crystal oscillators may be powered on or off in sleep mode through software control. • Digital Logic Domain: supplies the digital peripherals, CPU, ROM, Baseband controller, Modem and Encryption processor. It is powered off during sleep mode. • Analogue Domain: supplies the ADC, DACs and the temperature sensor. It is powered off during sleep mode and may be powered on or off in active processing mode through software control. • RAM Domain: supplies the RAM during sleep mode to retain the memory contents. It may be powered on or off for sleep mode through software control. • Radio Domain: supplies the radio interface. It is powered during transmit and receive and controlled by the baseband processor. It is powered off during sleep mode. The current consumption figures for the different modes of operation of the device is given in section 22.2.2. 21.2 Active Processing Mode Active processing mode in the JN5148 is where all of the application processing takes place. By default, the CPU will execute at the selected clock speed executing application firmware. All of the peripherals are available to the application, as are options to actively enable or disable them to control power consumption; see specific peripheral sections for details. Whilst in Active processing mode there is the option to doze the CPU but keep the rest of the chip active; this is particularly useful for radio transmit and receive operations, where the CPU operation is not required therefore saving power. 21.2.1 CPU Doze Whilst in doze mode, CPU operation is stopped but the chip remains powered and the digital peripherals continue to run. Doze mode is entered through software and is terminated by any interrupt request. Once the interrupt service routine has been executed, normal program execution resumes. Doze mode uses more power than sleep and deep sleep modes but requires less time to restart and can therefore be used as a low power alternative to an idle loop. Whilst in CPU doze the current associated with the CPU is not consumed, therefore the basic device current is reduced as shown in the figures in section 22.2.2.1. 21.3 Sleep Mode The JN5148 enters sleep mode through software control. In this mode most of the internal chip functions are shutdown to save power, however the state of DIO pins are retained, including the output values and pull-up enables, © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 63 and this therefore preserves any interface to the outside world. The DAC outputs are placed into a high impedance state. When entering into sleep mode, there is an option to retain the RAM contents throughout the sleep period. If the wakeup timers are not to be used for a wakeup event and the application does not require them to run continually, then power can be saved by switching off the 32kHz oscillator if selected as the system clock through software control. The oscillator will be restarted when a wakeup event occurs. Whilst in sleep mode one of four possible events can cause a wakeup to occur: transitions on DIO inputs, expiry of wakeup timers, pulse counters maturing or comparator events. If any of these events occur, and the relevant interrupt is enabled, then an interrupt is generated that will cause a wakeup from sleep. It is possible for multiple wakeup sources to trigger an event at the same instant and only one of them will be accountable for the wakeup period. It is therefore necessary in software to remove all other pending wakeup events prior to requesting entry back into sleep mode; otherwise, the device will re-awaken immediately. When wakeup occurs, a similar sequence of events to the reset process described in section 6.1 happens, including the checking of the supply voltage by the Brown Out Detector 6.4. The 32MHz oscillator is started up, once stable the power to CPU system is enabled and the reset is removed. Software determines that this is a reset from sleep and so commences with the wakeup process. If RAM contents were held through sleep, wakeup is quicker as the application program does not have to be reloaded from Flash memory. See section 22.3.6 for wake-up timings. 21.3.1 Wakeup Timer Event The JN5148 contains two 35-bit wakeup timers that are counters clocked from the 32kHz oscillator, and can be programmed to generate a wake-up event. Following a wakeup event, the timers continue to run. These timers are described in section 11.3. Timer events can be generated from both of the two timers; one is intended for use by the 802.15.4 protocol, the other being available for use by the Application running on the CPU. These timers are available to run at any time, even during sleep mode. 21.3.2 DIO Event Any DIO pin when used as an input has the capability, by detecting a transition, to generate a wake-up event. Once this feature has been enabled the type of transition can be specified (rising or falling edge). Even when groups of DIO lines are configured as alternative functions such as the UARTs or Timers etc, any input line in the group can still be used to provide a wakeup event. This means that an external device communicating over the UART can wakeup a sleeping device by asserting its RTS signal pin (which is the CTS input of the JN5148). 21.3.3 Comparator Event The comparator can generate a wakeup interrupt when a change in the relative levels of the positive and negative inputs occurs. The ability to wakeup when continuously monitoring analogue signals is useful in ultra-low power applications. For example, the JN5148 can remain in sleep mode until the voltage drops below a threshold and then be woken up to deal with the alarm condition. 21.3.4 Pulse Counter The JN5148 contains two 16 bit pulse counters that can be programmed to generate a wake-up event. Following the wakeup event the counters will continue to operate and therefore no pulse will be missed during the wake-up process. These counters are described in section 12. To minimise sleep current it is possible to disable the 32K RC oscillator and still use the pulse counters to cause a wake-up event, provided debounce mode is not required. 21.4 Deep Sleep Mode Deep sleep mode gives the lowest power consumption. All switchable power domains are off and certain functions in the VDD supply power domain, including the 32kHz oscillator are stopped. This mode can be exited by a power down, a hardware reset on the RESETN pin, or a DIO event. The DIO event in this mode causes a chip reset to occur.64 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22 Electrical Characteristics 22.1 Maximum Ratings Exceeding these conditions may result in damage to the device. Parameter Min Max Device supply voltage VDD1, VDD2 -0.3V 3.6V Supply voltage at voltage regulator bypass pins VB_xxx -0.3V 1.98V Voltage on analogue pins XTALOUT, XTALIN, VCOTUNE, RF_IN. -0.3V VB_xxx + 0.3V Voltage on analogue pins VREF, ADC1-4, DAC1-2, COMP1M, COMP1P, COMP2M, COMP2P, IBIAS -0.3V VDD1 + 0.3V Voltage on 5v tolerant digital pins SPICLK, SPIMOSI, SPIMISO, SPISEL0, DIO0-8 & DIO11-20, RESETN -0.3V Lower of (VDD2 + 2V) and 5.5V Voltage on 3v tolerant digital pins DIO9, DIO10 -0.3V VDD2 + 0.3V Storage temperature -40ºC 150ºC Reflow soldering temperature according to IPC/JEDEC J-STD-020C 260ºC ESD rating 4 Human Body Model 1 2.0kV Charged Device Model 2 500V 1) Testing for Human Body Model discharge is performed as specified in JEDEC Standard JESD22-A114. 2) Testing for Charged Device Model discharge is performed as specified in JEDEC Standard JESD22-C101. 22.2 DC Electrical Characteristics 22.2.1 Operating Conditions Supply Min Max VDD1, VDD2 2.0V 3.6V Ambient temperature range -40ºC 85ºC© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 65 22.2.2 DC Current Consumption VDD = 2.0 to 3.6V, -40 to +85º C 22.2.2.1 Active Processing Mode: Min Typ Max Unit Notes CPU processing 32,16,8 or 4MHz 1600 + 280/MHz µA SPI, GPIOs enabled. When in CPU doze the current related to CPU speed is not consumed. Radio transmit 15.0 mA CPU in software doze – radio transmitting Radio receive 17.5 mA CPU in software doze – radio in receive mode The following current figures should be added to those above if the feature is being used ADC 655 µA Temperature sensor and battery measurements require ADC DAC 215 / 235 µA One / both Comparator 73 / 0.8 µA Normal / low-power UART 90 µA For each UART Timer 30 µA For each Timer 2-wire serial interface 70 µA 22.2.2.2 Sleep Mode Mode: Min Typ Max Unit Notes Sleep mode with I/O wakeup 0.12 µA Waiting on I/O event Sleep mode with I/O and RC Oscillator timer wakeup – measured at 25ºC 1.25 µA As above, but also waiting on timer event. If both wakeup timers are enabled then add another 0.05µA 32kHz crystal oscillator 1.5 µA As alternative sleep timer The following current figures should be added to those above if the feature is being used RAM retention– measured at 25ºC 2.2 µA For full 128kB retained Comparator (low-power mode) 0.8 µA Reduced response time 22.2.2.3 Deep Sleep Mode Mode: Min Typ Max Unit Notes Deep sleep mode– measured at 25ºC 100 nA Waiting on chip RESET or I/O event66 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22.2.3 I/O Characteristics VDD = 2.0 to 3.6V, -40 to +85º C Parameter Min Typ Max Unit Notes Internal DIO pullup resistors 22 24 31 35 34 40 56 63 53 63 92 104 kΩ VDD2 = 3.6V, 25C VDD2 = 3.0V, 25C VDD2 = 2.2V, 25C VDD2 = 2.0V, 25C Digital I/O High Input (except DIO9, DIO10) VDD2 x 0.7 Lower of (VDD2 + 2V) and 5.5V V 5V Tolerant I/O only Digital I/O High Input ( DIO9, DIO10) VDD2 x 0.7 VDD2 V Digital I/O low Input -0.3 VDD2 x 0.27 V Digital I/O input hysteresis 140 230 310 mV DIO High O/P (2.7-3.6V) VDD2 x 0.8 VDD2 V With 4mA load DIO Low O/P (2.7-3.6V) 0 0.4 V With 4mA load DIO High O/P (2.2-2.7V) VDD2 x 0.8 VDD2 V With 3mA load DIO Low O/P (2.2-2.7V) 0 0.4 V With 3mA load DIO High O/P (2.0-2.2V) VDD2 x 0.8 VDD2 V With 2.5mA load DIO Low O/P (2.0-2.2V) 0 0.4 V With 2.5mA load Current sink/source capability 4 3 2.5 mA VDD2 = 2.7V to 3.6V VDD2 = 2.2V to 2.7V VDD2 = 2.0V to 2.2V IIL - Input Leakage Current 50 nA Vcc = 3.6V, pin low IIH - Input Leakage Current 50 nA Vcc = 3.6V, pin high 22.3 AC Characteristics 22.3.1 Reset and Voltage Brown-Out RESETN Internal RESET VDD VPOT t STAB Figure 45: Internal Power-on Reset without showing Brown-Out© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 67 Internal RESET RESETN VRST t STAB t RST Figure 46: Externally Applied Reset VDD = 2.0 to 3.6V, -40 to +85º C Parameter Min Typ Max Unit Notes External Reset pulse width to initiate reset sequence (tRST) 1 µs Assumes internal pullup resistor value of 100K worst case and ~5pF external capacitance External Reset threshold voltage (VRST) VDD2 x 0.7 V Minimum voltage to avoid being reset Internal Power-on Reset threshold voltage (VPOT) 1.47 1.42 V Rising Falling Reset stabilisation time (tSTAB) 0.84 ms Note 1 Brown-out Threshold Voltage (VTH) 1.87 2.16 2.54 2.83 1.95 2.25 2.65 2.95 2.01 2.32 2.73 3.04 V Configurable threshold with 4 levels Brown-out Hysteresis (VHYS) 45 60 85 100 mV Corresponding to the 4 threshold levels 1 Time from release of reset to start of executing ROM code. Loading program from Flash occurs in addition to this. VTH + VHYS VTH DVDD Internal POR Internal BOReset VPOT Figure 47: Power on Reset followed by Brown-out Detect68 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22.3.2 SPI MasterTiming t t SSH SSS t CK t SI t HI MOSI (mode=1,3) SS MOSI (mode=0,2) MISO (mode=0,2) MISO (mode=1,3) t VO t VO CLK (mode=0,1) t SI t HI CLK (mode=2,3) Figure 48: SPI Timing (Master) Parameter Symbol Min Max Unit Clock period tCK 62.5 - ns Data setup time tSI 16.7 @ 3.3V 18.2 @ 2.7V 21.0 @ 2.0V - ns Data hold time tHI 0 ns Data invalid period tVO - 15 ns Select set-up period tSSS 60 - ns Select hold period tSSH 30 (SPICLK = 16MHz) 0 (SPICLK<16MHz, mode=0 or 2) 60 (SPICLK<16MHz, mode=1 or 3) - ns 22.3.3 Intelligent Peripheral (SPI Slave) Timing IP_SEL IP_CLK IP_DI IP_DO t si t hi t vo t sss t t ssh ck t lz t hz Figure 49: Intelligent Peripheral (SPI Slave) Timing© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 69 Parameter Symbol Min Max Unit Clock period tck 125.0 - ns Data setup time tsi 15 - ns Data hold time thi 15 ns Data invalid period tvo - 40 ns Select set-up period tsss 15 - ns Select hold period tssh 15 - ns Select asserted to output data driven tlz 20 ns Select negated to data output tri-stated thz 20 ns 22.3.4 Two-wire Serial Interface t BUF S Sr P S t LOW t HD;STA t F t R t HD;DAT t HIGH t SU;DAT t SU;STA t HD;STA t SU;STO t SP t R t F SIF_D SIF_CLK Figure 50: Two-wire Serial Interface Timing Parameter Symbol Standard Mode Fast Mode Unit Min Max Min Max SIF_CLK clock frequency fSCL 0 100 0 400 kHz Hold time (repeated) START condition. After this period, the first clock pulse is generated tHD:STA 4 - 0.6 - µs LOW period of the SIF_CLK clock tLOW 4.7 - 1.3 - µs HIGH period of the SIF_CLK clock tHIGH 4 - 0.6 - µs Set-up time for repeated START condition tSU:STA 4.7 - 0.6 - µs Data setup time SIF_D tSU:DAT 0.25 - 0.1 - µs Rise Time SIF_D and SIF_CLK tR - 1000 20+0.1Cb 300 ns Fall Time SIF_D and SIF_CLK tF - 300 20+0.1Cb 300 ns Set-up time for STOP condition tSU:STO 4 - 0.6 - µs Bus free time between a STOP and START condition tBUF 4.7 - 1.3 - µs Pulse width of spikes that will be suppressed by input filters (Note 1) tSP - 60 - 60 ns Capacitive load for each bus line Cb - 400 - 400 pF Noise margin at the LOW level for each connected device (including hysteresis) Vnl 0.1VDD - 0.1VDD - V Noise margin at the HIGH level for each connected device (including hysteresis) Vnh 0.2VDD - 0.2VDD - V Note 1: This figure indicates the pulse width that is guaranteed to be suppressed. Pulse with widths up to 125nsec may alos get suppressed.70 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22.3.5 Four-Wire Digital Audio Interface SCK WS/SDOUT SDIN t ck t dtr t sr t hr t hc t lc Parameter Symbol Maximum Frequency (8MHz) Generic Unit Min Max Min Max DAI_SCK clock period tck 125 - 125 - ns LOW period of the DAI_SCK clock tlc 43 - 0.35tck - ns HIGH period of the DAI_SCK clock thc 43 - 0.35tck - ns Transmit delay time tdtr - 50 - 0.4tck ns Receive set-up time tsr 25 - 0.2tck - ns Receive hold time thr 0 - 0 - ns 22.3.6 Wakeup and Boot Load Timings Parameter Min Typ Max Unit Notes Time for crystal to stabilise ready for Boot Load 0.84 ms Reached oscillator amplitude threshold Time for crystal to stabilise ready for radio activity 1.0 ms Wake up from Deep Sleep or from Sleep (memory not held) 0.84 + 0.5* program size in kBytes ms Assumes SPI clock to external Flash is 16MHz Wake up from Sleep (memory held) 0.84 ms Wake up from CPU Doze mode 0.2 µs Wake up from Sleep using 24MHz RC oscillator (memory held) 0.29 ms© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 71 22.3.7 Bandgap Reference VDD = 2.0 to 3.6V, -40 to +85ºC Parameter Min Typ Max Unit Notes Voltage 1.156 1.192 1.216 V DC power supply rejection 58 dB at 25ºC Temperature coefficient -35 +30 ppm/ºC 20 to 85ºC -40ºC to 20ºC Point of inflexion +25 ºC 22.3.8 Analogue to Digital Converters VDD = 3.0V, VREF = 1.2V, -40 to +85ºC Parameter Min Typ Max Unit Notes Resolution 12 bits 500kHz Clock Current consumption 655 µA Integral nonlinearity ± 5 LSB 0 to Vref range Differential nonlinearity -1 +2 LSB Guaranteed monotonic Offset error + 10 mV Gain error - 20 mV Internal clock 500 kHz 16MHz input clock, ÷32 No. internal clock periods to sample input 2, 4, 6 or 8 Programmable Conversion time 40 µs 500kHz Clock with sample period of 2 Input voltage range 0.04 Vref or 2*Vref V Switchable. Refer to 20.1.1 Vref (Internal) See Section 22.3.7 Bandgap Reference Vref (External) 1.15 1.2 1.6 V Allowable range into VREF pin Input capacitance 8 pF In series with 5K ohms72 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22.3.9 Digital to Analogue Converters VDD = 3.0V, VREF = 1.2V, -40 to +85ºC Parameter Min Typ Max Unit Notes Resolution 12 bits Current consumption 215 (single) 235 (both) µA Integral nonlinearity ± 2 LSB Differential nonlinearity -1 +1 LSB Guaranteed monotonic Offset error ± 10 mV Gain error ± 10 mV Internal clock 2MHz, 1MHz, 500kHz, 250kHz 16MHz input clock, programmable prescaler Output settling time to 0.5LSB 5 µs With 10k ohms & 20pF load Minimum Update time 10 µs 2MHz Clock with sample period of 2 Output voltage swing 0 Lower of Vdd-1.2 and Vref V Output voltage swing Gain =0 Output voltage swing 0 Lower of 2x(Vdd-1.2 ) and Vdd-0.2 and 2xVref V Output voltage swing Gain =1 Vref (Internal) See Section 22.3.7 Bandgap Reference VREF (External) 0.8 1.2 1.6 V Allowable range into VREF pin Resistive load 10 kΩ To ground Capacitive load 20 pF Digital input coding Binary© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 73 22.3.10 Comparators VDD = 2.0 to 3.6V -40 to +85ºC Parameter Min Typ Max Unit Notes Analogue response time (normal) 80 125 ns +/- 250mV overdrive 10pF load Total response time (normal) including delay to Interrupt controller 105 + 125 ns Digital delay can be up to a max. of two 16MHz clock periods Analogue response time (low power) 2.4 µs +/- 250mV overdrive No digital delay Hysteresis 4 12 28 10 20 40 16 26 50 mV Programmable in 3 steps and zero Vref (Internal) See Section 22.3.7 Bandgap Reference V Common Mode input range 0 Vdd V Current (normal mode) 54 73 102 µA Current (low power mode) 0.8 µA 22.3.11 32kHz RC Oscillator VDD = 2.0 to 3.6V, -40 to +85 ºC Parameter Min Typ Max Unit Notes Current consumption of cell and counter logic 1.45 1.25 1.05 µA 3.6V 3.0V 2.0V 32kHz clock native accuracy -30% 32kHz +30% Typical is at 3.0V 25°C Calibrated 32kHz accuracy ±250 ppm For a 1 second sleep period calibrating over 20 x 32kHz clock periods Variation with temperature -0.010 %/°C Variation with VDD2 -1.1 %/V74 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22.3.12 32kHz Crystal Oscillator VDD = 2.0 to 3.6V, -40 to +85ºC Parameter Min Typ Max Unit Notes Current consumption of cell and counter logic 1.5 µA This is sensitive to the ESR of the crystal,Vdd and total capacitance at each pin Start – up time 0.8 s Assuming xtal with ESR of less than 40kohms and CL= 9pF External caps = 15pF (Vdd/2mV pk-pk) see Appendix B Input capacitance 1.4 pF Bondpad and package Transconductance 17 uA/V External Capacitors (CL=9pF) 15 pF Total external capacitance needs to be 2*CL, allowing for stray capacitance from chip, package and PCB Amplitude at Xout Vdd-0.2 Vp-p 22.3.13 32MHz Crystal Oscillator VDD = 2.0 to 3.6V, -40 to +85ºC Parameter Min Typ Max Unit Notes Current consumption 300 375 450 µA Excluding bandgap ref. Start – up time 0.84 ms Assuming xtal with ESR of less than 40ohms and CL= 9pF External caps = 15pF see Appendix B Input capacitance 1.4 pF Bondpad and package Transconductance 3.65 4.30 5.16 mA/V DC voltages, XTALIN / XTALOUT 390/425 425/465 470/520 mV External Capacitors (CL=9pF) 15 pF Total external capacitance needs to be 2*CL, allowing for stray capacitance from chip, package and PCB Amplitude detect threshold 320 mVp-p Threshold detection accessible via API© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 75 22.3.14 24MHz RC Oscillator VDD = 2.0 to 3.6V, -40 to +85ºC Parameter Min Typ Max Unit Notes Current consumption of cell 160 µA Clock native accuracy -22% 24MHz +28% Calibrated centre frequency accuracy -7% 24MHz +7% Variation with temperature -0.015 %/°C Variation with VDD2 0.15 %/V Startup time 1 us 22.3.15 Temperature Sensor VDD = 2.0 to 3.6V, -40 to +85ºC Parameter Min Typ Max Unit Notes Operating Range -40 - 85 °C Sensor Gain -1.44 -1.55 -1.66 mV/°C Accuracy - - ±10 °C Non-linearity - - 2.5 °C Output Voltage 630 855 mV Includes absolute variation due to manufacturing & temp Typical Voltage 745 mV Typical at 3.0V 25°C Resolution 0.154 0.182 0.209 °C/LSB 0 to Vref ADC I/P Range76 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 22.3.16 Radio Transceiver This JN5148 meets all the requirements of the IEEE802.15.4 standard over 2.0 - 3.6V and offers the following improved RF characteristics. All RF characteristics are measured single ended. This part also meets the following regulatory body approvals, when used with NXP’s Module Reference Designs. Compliant with FCC part 15, rules, IC Canada, ETSI ETS 300-328 and Japan ARIB STD-T66 The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN5148 failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application. Parameter Min Typical Max Notes RF Port Characteristics Type Single Ended Impedance 1 50ohm 2.4-2.5GHz Frequency range 2.400 GHz 2.485GHz ESD levels (pin 17) TDB 1) With external matching inductors and assuming PCB layout as in Appendix B.4.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 77 Radio Parameters: 2.0-3.6V, +25ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -92 -95 dBm Nominal for 1% PER, as per 802.15.4 section 6.5.3.3 Maximum input signal +5 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 19/34 [27/49] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2 / +2 ch) [CW Interferer] 40/45 [54/54] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 48 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 52 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -61 <-70 -58 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 40 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power +0.5 +2.5 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -40 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 10 [2.0] 15 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, section 6.5.3.178 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Radio Parameters: 2.0-3.6V, -40ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -93.5 -96.5 dBm Nominal for 1% PER, as per 802.15.4 section 6.5.3.3 Maximum input signal +9 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 19/34 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2 / +2 ch) [CW Interferer] 40/45 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 47 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 49 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -60 <-70 -57 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 39 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power +0.75 +2.75 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -38 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 9 [2.0] 15 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, section 6.5.3.1© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 79 Radio Parameters: 2.0-3.6V, +85ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -90 -93 dBm Nominal for 1% PER, as per 802.15.4 section 6.5.3.3 Maximum input signal +3 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 19/34 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2 / +2 ch) [CW Interferer] 40/45 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 49 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 53 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -62 <-70 -59 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 41 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power -0.2 +1.8 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -42 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 10 [2.0] 15 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, section 6.5.3.180 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Note1: Blocker rejection is defined as the value, when 1% PER is seen with the wanted signal 3dB above sensitivity, as per 802.15.4 section 6.5.3.4 Note2: Channels 11,17,24 low/high values reversed. Note3: Up to an extra 2.5dB of attenuation is available if required.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 81 Appendix A Mechanical and Ordering Information A.1 56-pin QFN Package Drawing Figure 51: 56-pin QFN Package Drawings Controlling Dimension: mm Symbol millimetres Min. Nom. Max. A ------ ------ 0.9 A1 0.00 0.01 0.05 A2 ------ 0.65 0.7 A3 0.20 Ref. b 0.2 0.25 0.3 D 8.00 bsc D1 7.75 bsc D2 6.20 6.40 6.60 E 8.00 bsc E1 7.75 bsc E2 6.20 6.40 6.60 L 0.30 0.40 0.50 e 0.50 bsc υ1 0° ------ 12° R 0.09 ------ ------ Tolerances of Form and Position aaa 0.10 bbb 0.10 ccc 0.0582 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 A.2 PCB Decal The following PCB decal is recommended; all dimensions are in millimetres (mm). Figure 52: PCB Decal The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN5148 failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 83 A.3 Ordering Information The standard qualification for the JN5148 is Industrial temperature range: -40ºC to +85ºC, packaged in a 56-pin QFN package. Ordering Code Format: JN5148/XXX XXX: ROM Variant 001 Supports all available networking stacks Ordering Codes: Part Number Ordering Code Description JN5148-001 JN5148/001 JN5148 microcontroller The chip is available in three different reel quantities: • 500 on 180mm reel • 1000 on 180mm reel • 2500 on 330mm reel Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or Prototypes. Devices of this status are marked with an Rx suffix after the ROM identifier to identify the revision of silicon during these product phases - for example JN5148-001R1-T. The Standard Supply Multiple (SSM) for Engineering Samples or Prototypes is 50 units with a maximum of 250 units. If the quantity of Engineering Samples or Prototypes ordered is less than a reel quantity, then these will be shipped in tape form only, with no reel and will not be dry packaged in a moisture sensitive environment. The SSM for Production status devices is one reel, all reels are dry packaged in a moisture sensitive bag see A.5.3.84 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 A.4 Device Package Marking The diagram below shows the package markings for JN5148. The package on the left along with the legend information below it, shows the general format of package marking. The package on the right shows the specific markings for a JN5148-001 device, that came from assembly build number 1000135 and was manufactured week 12 of 2008. Jennic JNXXXX-SSS FFFFFFF YYWW Jennic JN5148-001 0812 1000135 Figure 53: Device Package Marking Legend: JN Jennic XXXX 4 digit part number SSS 3 digit software ROM identifier FFFFFFF 7 digit assembly build number YY 2 digit year number WW 2 digit week number Where this Data Sheet is denoted as “Advanced” or “Preliminary”, devices will be either Engineering Samples or Prototypes. Devices of this status have an Rx suffix after the software ROM identifier, for example JN5148-001R1.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 85 A.5 Tape and Reel Information A.5.1 Tape Orientation and Dimensions The general orientation of the 56QFN package in the tape is as shown in Figure 54. Figure 54: Tape and Reel Orientation Figure 55 shows the detailed dimensions of the tape used for 8x8mm 56QFN devices. ALL DIMENSIONS IN MILLIMETRES UNLESS OTHERWISE STATED Reference Dimensions (mm) Ao 8.30 ±0.10 Bo 8.30 ±0.10 Ko 1.10 ±0.10 F 7.50 ±0.10 P1 12.00 ±0.10 W 16.00 ±0.30 (I) Measured from centreline of sprocket hole to centreline of pocket (II) Cumulative tolerance of 10 sprocket holes is ±0.20mm (III) Measured from centreline of sprocket hole to centreline of pocket (IV) Other material available Figure 55: Tape Dimensions86 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 A.5.2 Reel Information: 180mm Reel Surface Resistivity Between 10e9 – 10e11 Ohms Square Material High Impact Polystyrene, environmentally friendly, recyclable All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres. 6 window design with one window on each side blanked to allow adequate labelling space. Figure 56: 180mm Reel Dimensions© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 87 A.5.3 Reel Information: 330mm Reel Surface Resistivity Between 10e9 – 10e11 Ohms Square Material High Impact Polystyrene with Antistatic Additive All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres. 3 window design to allow adequate labelling space. Figure 57: 330mm Reel Dimensions A.5.4 Dry Pack Requirement for Moisture Sensitive Material Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 56 lead QFN package is MSL2A/260° C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at 67.5 grams of activated clay and a humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB has a moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.88 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Appendix B Development Support B.1 Crystal Oscillators This section covers some of the general background to crystal oscillators, to help the user make informed decisions concerning the choice of crystal and the associated capacitors. B.1.1 Crystal Equivalent Circuit Cs Lm Rm Cm C1 C2 Where Cm is the motional capacitance Lm is the motional inductance. This together with Cm defines the oscillation frequency (series) Rm is the equivalent series resistance ( ESR ). CS is the shunt or package capacitance and this is a parasitic B.1.2 Crystal Load Capacitance The crystal load capacitance is the total capacitance seen at the crystal pins, from all sources. As the load capacitance (CL) affects the oscillation frequency by a process known as ‘pulling’, crystal manufacturers specify the frequency for a given load capacitance only. A typical pulling coefficient is 15ppm/pF, to put this into context the maximum frequency error in the IEEE802.15.4 specification is +/-40ppm for the transmitted signal. Therefore, it is important for resonance at 32MHz exactly, that the specified load capacitance is provided. The load capacitance can be calculated using: CL = 1 2 1 2 T T T T C C C C + × Total capacitance CT1 = C1 + C1P + C1in Where C1 is the capacitor component C1P is the PCB parasitic capacitance. With the recommended layout this is about 1.6pF C1in is the on-chip parasitic capacitance and is about 1.4pF typically. Similarly for CT 2 Hence for a 9pF load capacitance, and a tight layout the external capacitors should be 15pF© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 89 B.1.3 Crystal ESR and Required Transconductance The resistor in the crystal equivalent circuit represents the energy lost. To maintain oscillation, power must be supplied by the amplifier, but how much? Firstly, the Pi connected capacitors C1 and C2 with CS from the crystal, apply an impedance transformation to Rm, when viewed from the amplifier. This new value is given by: 2 ˆ + = L S L m m C C C R R The amplifier is a transconductance amplifier, which takes a voltage and produces an output current. The amplifier together with the capacitors C1 and C2, form a circuit, which provides a negative resistance, when viewed from the crystal. The value of which is given by: 2 1× 2 ×ω = T T m NEG C C g R Where gm is the transconductance ω is the frequency in rad/s Derivations of these formulas can be easily found in textbooks. In order to give quick and reliable oscillator start-up, a common rule of thumb is to set the amplifier negative resistance to be a minimum of 4 times the effective crystal resistance. This gives 2 T1× T 2 ×ω m C C g ≥ 2 4 + L S L m C C C R This can be used to give an equation for the required transconductance. 1 2 2 1 2 1 2 2 4 [ ( ) ] T T m S T T T T m C C R C C C C C g × × + + × ≥ ω Example: Using typical 32MHz crystal parameters of Rm =40Ω, CS =1pF and CT1 =CT 2 =18pF ( for a load capacitance of 9pF), the equation above gives the required transconductance ( gm ) as 2.59mA/V. The JN5148 has a typical value for transconductance of 4.3mA/V The example and equation illustrate the trade-off that exists between the load capacitance and crystal ESR. For example, a crystal with a higher load capacitance can be used, but the value of max. ESR that can be tolerated is reduced. Also note, that the circuit sensitivity to external capacitance [ C1 , C2 ] is a square law. Meeting the criteria for start-up is only one aspect of the way these parameters affect performance, they also affect the time taken during start-up to reach a given, (or full), amplitude. Unfortunately, there is no simple mathematical model for this, but the trend is the same. Therefore, both a larger load capacitance and larger crystal ESR will give a longer start-up time, which has the disadvantages of reduced battery life and increased latency. 90 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 B.2 32MHz Oscillator The JN5148 contains the necessary on-chip components to build a 32 MHz reference oscillator with the addition of an external crystal resonator, two tuning capacitors. The schematic of these components are shown in Figure 58. The two capacitors, C1 and C2, will typically be 15pF ±5% and use a COG dielectric. For a detailed specification of the crystal required and factors affecting C1 and C2 see Appendix B.1. As with all crystal oscillators the PCB layout is especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB noise being coupled into the oscillator. XTALOUT C1 C2 XTALIN R1 JN5148 Figure 58: Crystal oscillator connections The clock generated by this oscillator provides the reference for most of the JN5148 subsystems, including the transceiver, processor, memory and digital and analogue peripherals. 32MHz Crystal Requirements Parameter Min Typ Max Notes Crystal Frequency 32MHz Crystal Tolerance 40ppm Including temperature and ageing Crystal ESR Range (Rm) 10Ω 60Ω See below for more details Crystal Load Capacitance Range (CL) 6pF 9pF 12pF See below for more details Not all Combinations of Crystal Load Capacitance and ESR are Valid Recommended Crystal Load Capacitance 9pF and max ESR 40 Ω External Capacitors (C1 & C2) For recommended Crystal 15pF CL = 9pF, total external capacitance needs to be 2*CL. , allowing for stray capacitance from chip, package and PCB © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 91 As is stated above, not all combinations of crystal load capacitance and ESR are valid, and as explained in Appendix B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance. For this reason, we recommend that for a 9pF load capacitance crystals be specified with a maximum ESR of 40 ohms. For lower load capacitances the recommended maximum ESR rises, for example, CL=7pF the max ESR is 61 ohms. For the lower cost crystals in the large HC49 package, a load capacitance of 9 or 10pF is widely available and the max ESR of 30 ohms specified by many manufacturers is acceptable. Also available in this package style, are crystals with a load capacitance of 12pF, but in this case the max ESR required is 25 ohms or better. Below is measurement data showing the variation of the crystal oscillator amplifier transconductance with temperature and supply voltage, notice how small the variation is. Circuit techniques have been used to apply compensation, such that the user need only design for nominal conditions. 32MHz Crystal Oscillator 4.1 4.15 4.2 4.25 4.3 4.35 -40 -20 0 20 40 60 80 100 Temperature (C) Transconductance (mA/V) 32MHz Crystal Oscillator 4.28 4.29 4.3 4.31 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Supply Voltage (VDD) Transconductance (mA/V)92 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 B.3 32kHz Oscillator In order to obtain more accurate sleep periods, the JN5148 contains the necessary on-chip components to build an optional 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be connected between XTAL32K_IN and XTAL32K_OUT (DIO9 and DIO10), with two equal capacitors to ground, one on each pin. The schematic of these components are shown in Figure 59. The two capacitors, C1 and C2, will typically be in the range 10 to 22pF ±5% and use a COG dielectric. As with all crystal oscillators the PCB layout is especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB noise being coupled into the oscillator. XTAL32K_IN XTAL32K_OUT JN5148 Figure 59: 32kHz crystal oscillator connections The electrical specification of the oscillator can be found in 22.3.12. The oscillator cell is flexible and can operate with a range of commonly available 32kHz crystals with load capacitances from 6 to 12.5p, and ESR up to 80KΩ. It achieves this by using automatic gain control (AGC), which senses the signal swing. As explained in Appendix B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance. The use of an AGC function allows a wider range of crystal load capacitors and ESR’s to be accommodated than would otherwise be possible. However, this benefit does mean the supply current varies with the supply voltage (VDD), value of the total capacitance at each pin, and the crystal ESR. This is described in the table and graphs below. 32kHz Crystal Requirements Parameter Min Typ Max Notes Crystal Frequency 32kHz Supply Current 1.6uA Vdd=3v, temp=25 C, load cap =9pF, Rm=25K Supply Current Temp. Coeff. 0.1%/ C Vdd=3v Crystal ESR Range (Rm) 10KΩ 25KΩ 80KΩ See below for more details Crystal Load Capacitance Range (CL) 6pF 9pF 12.5pF See below for more details Not all Combinations of Crystal Load Capacitance and ESR are Valid © NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 93 Three examples of typical crystals are given, each with the value of external capacitors to use, plus the likely supply current and start-up time that can be expected. Also given is the maximum recommended ESR based on the start-up criteria given in Appendix B.1.3. The values of the external capacitors can be calculated using the equation in Appendix B.1.2 . Load Capacitance Ext Capacitors Current Start-up Time Max ESR 9pF 15pF 1.6uA 0.8Sec 70KΩ 6pF 9pF 1.4uA 0.6sec 80KΩ 12.5pF 22pF 2.4uA 1.1sec 35KΩ Below is measurement data showing the variation of the crystal oscillator supply current with voltage and with crystal ESR, for two load capacitances. 32KHz Crystal Oscillator Current 0.6 0.8 1 1.2 1.4 1.6 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Supply Voltage (VDD) Normalised Current (IDD) 32KHz Crystal Oscillator Current 0.6 0.8 1 1.2 1.4 1.6 10 20 30 40 50 60 70 80 Crystal ESR (K ohm) Normalised Current (IDD) 9pF 12.5pF94 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 B.4 JN5148 Module Reference Designs For customers wishing to integrate the JN5148 device directly into their system, NXP provide a range of Module Reference Designs, covering standard and high-power modules fitted with different Antennae To ensure the correct performance, it is strongly recommended that where possible the design details provided by the reference designs, are used in their exact form for all end designs, this includes component values, pad dimensions, track layouts etc. In order to minimise all risks, it is recommended that the entire layout of the appropriate reference module, if possible, be replicated in the end design. For full details, consult the Standard Module Reference Design JN-RD-6015 [6]. B.4.1 Schematic Diagram A schematic diagram of the JN5148 PCB antenna reference module is shown in Figure 60. Details of component values and PCB layout constraints can be found in Table 8. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 56 55 54 53 52 51 50 49 48 47 46 45 44 43 SPI Selects Analogue IO UART0/JTAG Timers Two Wire Serial Port RXD1 UART1/JTAG DIO16 CTS1 VSS3 RTS1 TXD1 VSS2 VSSS XTAL_OUT XTAL_IN VB_SYNTH VCOTUNE (NC) VB_VCOR1 43K IBIAS C16 100nF VDD1 C14 100nF VDD C13 10uF C24 47pF C18 47pF C2 10nF C15 100nF Y1 C11 15pF C10 15pF C20 100nF L2 2.7nH VB_RF VREF VB_RF2 RF_IN VB_RF C12 47pF C3 100nF VB_RF1 C1M C1P ADC1 ADC2 ADC3 ADC4 C2M C2P VB_A C9 47pF C8 100nF NC VDD VDD RXD1 SPIMOSI SPIMOSI SPICLK SPICLK C6 100nF C7 100nF SPISEL3 SPISEL2 VB_DIG RESETN SPISEL1 SPISEL0 VB_RAM SPIMISO VSS1 DAC2 DAC1 1 2 3 4 8 7 6 5 SS SD0 WP VSS SDI CLK HOLD VCC Serial Flash Memory RXD0 TXD0 RTS0 CTS0 SPISEL4 VDD SIF_D SIF_CLK TIM1OUT TIM1CAP TIM1CK_GT TIM0OUT TIM0CAP VDD2 TIM0CK_GT VSSA JN5148 C1 47pF L1 5.6nH To Coaxial Socket Or Integrated Antenna Figure 60: JN5148 Printed Antenna Reference Module Schematic Diagram© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 95 Component Designator Value/Type Function PCB Layout Constraints C13 10uF Power source decoupling C14 100nF Analogue Power decoupling Adjacent to U1 pin 13 C16 100nF Digital power decoupling Adjacent to U1 pin 49 C15 100nF VB Synth decoupling Less than 5mm from U1 pin 10 C18 47pF VB Synth decoupling Less than 5mm from U1 pin 10 C2 10nF VB VCO decoupling Less than 5mm from U1 pin 12 C24 47pF VB VCO decoupling Less than 5mm from U1 pin 12 C3 100nF VB RF decoupling Less than 5mm from U1 pin 16 and U1 pin 18 C12 47pF VB RF decoupling Less than 5mm from U1 pin 16 and U1 pin 18 C8 100nF VB A decoupling Less than 5mm from U1 pin 27 C9 47pF VB A decoupling Less than 5mm from U1 pin 27 C6 100nF VB RAM decoupling Less than 5mm from U1 pin 35 C7 100nF VB Dig decoupling Less than 5mm from U1 pin 40 R1 43k I Bias Resistor Less than 5mm from U1 pin 14 C20 100nF Vref decoupling Less than 5mm from U1 pin 15 U2 4Mbit Serial Flash Memory (Numonyx M25P40) Y1 32MHz Crystal (AEL X32M000000S025) (CL = 9pF, Max ESR 40R) C10 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 8 and Y1 pin 1 C11 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 9 and Y1 pin 3 R2 Not fitted C1 47pF AC Coupling Phycomp 2238-869-15479 Must be copied directly from the reference design. L1 5.6nH RF Matching Inductor MuRata LQP15MN5N6B02 L2 2.7nH Load Inductor MuRata LQP15MN2N7B02 Table 8: JN5148 Printed Antenna Reference Module Components and PCB Layout Constraints The paddle should be connected directly to ground. Any pads that requiring connection to ground should do so by connecting directly to the paddle.96 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 B.4.2 PCB Design and Reflow Profile PCB and land pattern designs are key to the reliability of any electronic circuit design. The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782 [3], commonly referred to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques, containing sections on design requirements, reliability and testability. NXP strongly recommends that this be referred to when designing the PCB. The suggested reflow profile is shown in Figure 61. The specific paste manufacturers guidelines on peak flow temperature, soak times, time above liquidus and ramp rates should also be referenced. Figure 61: Recommended Reflow Profile for Lead-free Solder Paste or PPF lead frame© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 97 Related Documents [1] IEEE Std 802.15.4-2003 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs). [2] JN-AN-1038 Programming Flash devices not supported by the JN51xx ROM-based bootloader [3] IPC-SM-782 Surface Mount Design and Land Pattern Standard [4] JN-AN-1118 JN5148 Application Debugging [5] JN-UG-3066 JN51xx Integrated Peripherals API User Guide [6] JN-RD-6015 Standard Module Reference Design [7] JN-AN-1003 Boot Loader Operation RoHS Compliance JN5148 devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the China RoHS (SJ/T11363 – 2006) requirements which came into force on 1st March 2007. Status Information The status of this Data Sheet is. Production NXP products progress according to the following format: Advance The Data Sheet shows the specification of a product in planning or in development. The functionality and electrical performance specifications are target values of the design and may be used as a guide to the final specification. Integrated circuits are identified with an Rx suffix, for example JN5148-001R1. NXP reserves the right to make changes to the product specification at anytime without notice. Preliminary The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified. The functionality of the product is final. The electrical performance specifications are target values and may used as a guide to the final specification. Integrated circuits are identified with an Rx suffix, for example JN5148-001R1. NXP reserves the right to make changes to the product specification at anytime without notice. Production This is the production Data Sheet for the product. All functional and electrical performance specifications, where included, including min and max values are derived from detailed product characterization. This Data Sheet supersedes all previous document versions. NXP reserves the right to make changes to the product specification at anytime.98 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). 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Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. AEC unqualified products — This product has not been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. 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Trademarks All trademarks are the property of their respective owners.© NXP Laboratories UK 2013 JN-DS-JN5148-001 1v9 99 Version Control Version Notes 1.0 12th December 2008 – First issue, released as Advance Information 1.1 15th May 2009 – Major revision 1.2 15th July – Released as Preliminary and revised Electrical Parameters section 1.3 20th January 2010 – Revision to sections 1.1, 2.2.1 & 8.1 – 8.4 and figs 1,2,22 & 47. Also, the bill of materials and reference design number have been updated. 1.4 2nd April 2010 – Released as Production with revised Electrical Parameters section 1.5 14th September 2010 – Logo updated and support for JenNet added 1.6 24th November 2010 – Ordering information changed 1.7 5th May 2011 – Tape and reel information updated 1.8 12th September 2012 – NXP branding applied 1.9 6th September 2013 – Modified description of interrupts within the CPU in Chapter 3100 JN-DS-JN5148-001 1v9 © NXP Laboratories UK 2013 Contact Details NXP Laboratories UK Ltd (Formerly Jennic Ltd) Furnival Street Sheffield S1 4QT United Kingdom Tel: +44 (0)114 281 2655 Fax: +44 (0) 114 281 2951 For the contact details of your local NXP office or distributor, refer to the NXP web site: www.nxp.com Data Sheet: JN516x IEEE802.15.4 Wireless Microcontroller © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 1 Overview Features: Radio • 2.4GHz IEEE802.15.4 compliant • 128-bit AES security processor • MAC accelerator with packet formatting, CRCs, address check, auto-acks, timers • Integrated ultra low power sleep oscillator – 0.6µA • 2.0V to 3.6V battery operation • Deep sleep current 0.12µA (Wake-up from IO) • <$0.15 external component cost • RX current 17mA , TX 15mA • Receiver sensitivity -95dBm • Transmit power 2.5dBm • Time of Flight engine for ranging • Antenna Diversity (Auto RX) Features: Microcontroller • 32-bit RISC CPU, 1 to 32MHz clock speed • Variable instruction width for high coding efficiency • Multi-stage instruction pipeline • JN5161: 64kB/8kB/4kB • JN5164: 160kB/32kB/4kB • JN5168: 256kB/32kB/4kB (Flash/RAM/EEPROM) • Data EEPROM with guaranteed 100k write operations. • RF4CE, JenNet-IP, ZigBee SE and ZigBee Light Link stacks • 2-wire I2C compatible serial interface. Can operate as either master or slave • 5xPWM (4x timer & 1 timer/counter) • 2 low power sleep counters • 2x UART • SPI Master & Slave port, 3 selects • Supply voltage monitor with 8 programmable thresholds • 4-input 10-bit ADC, comparator • Battery and temperature sensors • Watchdog & Brown Out Reset • Up to 20 Digital IO Pins (DIO) • Infra-red remote control transmitter Temp range (-40°C to +125°C) 6x6mm 40-lead Lead-free and RoHS compliant The JN516x series is a range of ultra low power, high performance wireless microcontrollers supporting JenNet-IP, ZigBee PRO or RF4CE networking stacks to facilitate the development of Home Automation, Smart Energy, Light Link and Remote control applications. They feature an enhanced 32- bit RISC processor with embedded Flash and EEPROM memory, offering high coding efficiency through variable width instructions, a multi-stage instruction pipeline and low power operation with programmable clock speeds. They also include a 2.4GHz IEEE802.15.4 compliant transceiver and a comprehensive mix of analogue and digital peripherals. Three memory configurations are available to suit different applications. The best in class operating current of 15mA, with a 0.6uA sleep timer mode, gives excellent battery life allowing operation direct from a coin cell. The peripherals support a wide range of applications. They include a 2-wire I 2 C, and SPI ports which can operate as either master or slave, a four channel ADC with battery and a temperature sensor. It can support a large switch matrix of up to 100 elements, or alternatively a 20 key capacitive touch pad. Block Diagram 32-bit RISC CPU 4xPWM + Timer 2xUART 10-bit ADC Battery and Temp Sensors 2-Wire Serial (Master/Slave) SPI Master & Slave RAM 128-bit AES Hardware 2.4GHz Including Diversity Flash Power Management XTAL O-QPSK Modem 4kB EEPROM 20 DIO Sleep Counter Watchdog Timer Voltage Brownout 8/32K 64/160/256K Radio 4-Channel IEEE 802.15.4 Baseband Processor Encryption Benefits • Single chip device to run stack and application • Very low current solution for long battery life – over 10 yrs • Supports multiple network stacks • Highly featured 32-bit RISC CPU for high performance and low power • System BOM is low in component count and cost • Flexible sensor interfacing options Applications • Robust and secure low power wireless applications • RF4CE Remote Controls • JenNet-IP networks • ZigBee SE networks • ZigBee Light Link networks • Lighting & Home automation • Toys and gaming peripherals • Smart Energy • Energy harvesting, for example self powered light switch2 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Contents Benefits 1 Applications 1 1 Introduction 6 1.1 Wireless Transceiver 6 1.2 RISC CPU and Memory 6 1.3 Peripherals 7 1.4 Block Diagram – JN516x 8 2 Pin Configurations 9 2.1 Pin Assignment 10 2.2 Pin Descriptions 12 2.2.1 Power Supplies 12 2.2.2 Reset 12 2.2.3 32MHz Oscillator 12 2.2.4 Radio 12 2.2.5 Analogue Peripherals 13 2.2.6 Digital Input/Output 13 3 CPU 15 4 Memory Organisation 16 4.1 FLASH 16 4.2 RAM 16 4.3 OTP Configuration Memory 16 4.4 EEPROM 17 4.5 External Memory 17 4.6 Peripherals 17 4.7 Unused Memory Addresses 17 5 System Clocks 18 5.1 High-Speed (32MHz) System Clock 18 5.1.1 32MHz Crystal Oscillator 18 5.1.2 High-Speed RC Oscillator 19 5.2 Low-speed (32kHz) System Clock 19 5.2.1 32kHz RC Oscillator 19 5.2.2 32kHz Crystal Oscillator 20 5.2.3 32kHz External Clock 20 6 Reset 21 6.1 Internal Power-On / Brown-out Reset (BOR) 21 6.2 External Reset 22 6.3 Software Reset 22 6.4 Supply Voltage Monitor (SVM) 22 6.5 Watchdog Timer 23 7 Interrupt System 24 7.1 System Calls 24 7.2 Processor Exceptions 24 7.2.1 Bus Error 24© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 3 7.2.2 Alignment 24 7.2.3 Illegal Instruction 24 7.2.4 Stack Overflow 24 7.3 Hardware Interrupts 25 8 Wireless Transceiver 26 8.1 Radio 26 8.1.1 Radio External Components 27 8.1.2 Antenna Diversity 27 8.2 Modem 29 8.3 Baseband Processor 30 8.3.1 Transmit 30 8.3.2 Reception 30 8.3.3 Auto Acknowledge 31 8.3.4 Beacon Generation 31 8.3.5 Security 31 8.4 Security Coprocessor 31 8.5 Time of Flight Engine 31 9 Digital Input/Output 32 10 Serial Peripheral Interface 34 10.1 Serial Peripheral Interface Master 34 10.2 Serial Peripheral Interface Slave 37 11 Timers 38 11.1 Peripheral Timer/Counters 38 11.1.1 Pulse Width Modulation Mode 39 11.1.2 Capture Mode 39 11.1.3 Counter/Timer Mode 40 11.1.4 Delta-Sigma Mode 40 11.1.5 Infra-Red Transmission Mode 41 11.1.6 Example Timer/Counter Application 41 11.2 Tick Timer 42 11.3 Wakeup Timers 42 11.3.1 32 KHZ RC Oscillator Calibration 43 12 Pulse Counters 44 13 Serial Communications 45 13.1 Interrupts 46 13.2 UART Application 46 14 JTAG Test Interface 48 15 Two-Wire Serial Interface (I2 C) 49 15.1 Connecting Devices 49 15.2 Clock Stretching 50 15.3 Master Two-wire Serial Interface 50 15.4 Slave Two-wire Serial Interface 52 16 Random Number Generator 534 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 17 Analogue Peripherals 54 17.1 Analogue to Digital Converter 54 17.1.1 Operation 55 17.1.2 Supply Monitor 56 17.1.3 Temperature Sensor 56 17.1.4 ADC Sample Buffer Mode 56 17.2 Comparator 56 18 Power Management and Sleep Modes 57 18.1 Operating Modes 57 18.1.1 Power Domains 57 18.2 Active Processing Mode 57 18.2.1 CPU Doze 57 18.3 Sleep Mode 57 18.3.1 Wakeup Timer Event 58 18.3.2 DIO Event 58 18.3.3 Comparator Event 58 18.3.4 Pulse Counter 58 18.4 Deep Sleep Mode 58 19 Electrical Characteristics 59 19.1 Maximum Ratings 59 19.2 DC Electrical Characteristics 59 19.2.1 Operating Conditions 59 19.2.2 DC Current Consumption 60 19.2.3 I/O Characteristics 61 19.3 AC Characteristics 61 19.3.1 Reset and Supply Voltage Monitor 61 19.3.2 SPI Master Timing 63 19.3.3 SPI Slave Timing 64 19.3.4 Two-wire Serial Interface 65 19.3.5 Wakeup Timings 65 19.3.6 Bandgap Reference 66 19.3.7 Analogue to Digital Converters 66 19.3.8 Comparator 67 19.3.9 32kHz RC Oscillator 67 19.3.10 32kHz Crystal Oscillator 68 19.3.11 32MHz Crystal Oscillator 68 19.3.12 High-Speed RC Oscillator 69 19.3.13 Temperature Sensor 69 19.3.14 Non-Volatile Memory 69 19.3.15 Radio Transceiver 70 Appendix A Mechanical and Ordering Information 76 A.1 SOT618-1 HVQFN40 40-pin QFN Package Drawing 76 A.2 Footprint Information 77 A.3 Ordering Information 78 A.4 Device Package Marking 79 A.5 Tape and Reel Information 80 A.5.1 Tape Orientation and Dimensions 80 A.5.2 Reel Information: 180mm Reel 81 A.5.3 Reel Information: 330mm Reel 82© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 5 A.5.4 Dry Pack Requirement for Moisture Sensitive Material 82 Appendix B Development Support 83 B.1 Crystal Oscillators 83 B.1.1 Crystal Equivalent Circuit 83 B.1.2 Crystal Load Capacitance 83 B.1.3 Crystal ESR and Required Transconductance 84 B.2 32MHz Oscillator 85 B.3 32kHz Oscillator 87 B.4 JN516x Module Reference Designs 89 B.4.1 Schematic Diagram 89 B.4.2 PCB Design and Reflow Profile 91 B.4.3 Moisture Sensitivity Level (MSL) 91 Related Documents 92 RoHS Compliance 92 Status Information 92 Disclaimers 93 Trademarks 93 Version Control 93 Contact Details 946 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 1 Introduction The JN516x is an IEEE802.15.4 wireless microcontroller that provides a fully integrated solution for applications using the IEEE802.15.4 standard in the 2.4 - 2.5GHz ISM frequency band [1], including Zigbee PRO, ZigBee Smart Energy, ZigBee LightLink, RF4CE and JenNet-IP. There are 3 versions in the range, differing only by memory configuration JN5161-001: 64kB Flash, 8kB RAM, 4 kB EEPROM, suitable for IEEE802.15.4 and RF4CE applications JN5164-001: 160kB Flash, 32kB RAM, 4 kB EEPROM suitable for Jennet-IP, IEEE802.15.4 and RF4CE applications JN5168-001: 256kB Flash, 32kB RAM, 4 kB EEPROM suitable for all applications Applications that transfer data wirelessly tend to be more complex than wired ones. Wireless protocols make stringent demands on frequencies, data formats, timing of data transfers, security and other issues. Application development must consider the requirements of the wireless network in addition to the product functionality and user interfaces. To minimise this complexity, NXP provides a series of software libraries and interfaces that control the transceiver and peripherals of the JN516x. These libraries and interfaces remove the need for the developer to understand wireless protocols and greatly simplifies the programming complexities of power modes, interrupts and hardware functionality. In view of the above, it is not necessary to provide the register details of the JN516x in the datasheet. The device includes a Wireless Transceiver, RISC CPU, on chip memory and an extensive range of peripherals. 1.1 Wireless Transceiver The Wireless Transceiver comprises a 2.45GHz radio, a modem, a baseband controller and a security coprocessor. In addition, the radio also provides an output to control transmit-receive switching of external devices such as power amplifiers allowing applications that require increased transmit power to be realised very easily. Appendix B.4, describes a complete reference design including Printed Circuit Board (PCB) design and Bill Of Materials (BOM). The security coprocessor provides hardware-based 128-bit AES-CCM* modes as specified by the IEEE802.15.4 2006 standard. Specifically this includes encryption and authentication covered by the MIC –32/-64/-128, ENC and ENC-MIC –32/-64/-128 modes of operation. The transceiver elements (radio, modem and baseband) work together to provide IEEE802.15.4 (2006) MAC and PHY functionality under the control of a protocol stack. Applications incorporating IEEE802.15.4 functionality can be developed rapidly by combining user-developed application software with a protocol stack library. 1.2 RISC CPU and Memory A 32-bit RISC CPU allows software to be run on-chip, its processing power being shared between the IEEE802.15.4 MAC protocol, other higher layer protocols and the user application. The JN516x has a unified memory architecture, code memory, data memory, peripheral devices and I/O ports are organised within the same linear address space. The device contains up to 256kbytes of Flash, up to 32kbytes of RAM and 4kbytes EEPROM . © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 7 1.3 Peripherals The following peripherals are available on chip: • Master SPI port with three select outputs • Slave SPI port • Two UART’s, one capable of hardware flow control (4-wire, includes RTS/CTS), and the other just 2-wire (RX/TX) • One programmable Timer/Counter which supports Pulse Width Modulation (PWM) and capture/compare, plus four PWM timers which support PWM and Timer modes only. • Two programmable Sleep Timers and a Tick Timer • Two-wire serial interface (compatible with SMbus and I2 C) supporting master and slave operation • Twenty digital I/O lines (multiplexed with peripherals such as timers, SPI and UARTs) • Two digital outputs (multiplexed with SPI port) • 10-bit, Analogue to Digital converter with up to four input channels. Autonomous multi-channel sampling • Programmable analogue comparator • Internal temperature sensor and battery monitor • Two low power pulse counters • Random number generator • Watchdog Timer and Supply Voltage Monitor • JTAG hardware debug port • Infra-red remote control transmitter, supported by one of the PWM timers • Transmit and receive antenna diversity with automatic receive switching based on received energy detection • Time of Flight engine for ranging User applications access the peripherals using the Integrated Peripherals API. This allows applications to use a tested and easily understood view of the peripherals allowing rapid system development. 8 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 1.4 Block Diagram – JN516x Wireless Transceiver 32-bit RISC CPU MUX Security Processor Digital Baseband Radio Programmable Interrupt Controller From Peripherals RF_IN VCOTUNE Tick Timer Voltage Regulators 1.8V VDD1 VDD2 IBIAS VB_XX EEPROM 4KB CPU and 16MHz System Clock 32MHz Xtal Clock Generator XTAL_IN XTAL_OUT Clock Source & Rate Select Highspeed RC Osc Watchdog Timer Supply Voltage Monitor Reset Wakeup Timer1 Wakeup Timer0 RESETN 32kHz Clock Select 32KIN Comparator1 COMP1P COMP1M ADC M U ADC4 X ADC1 VREF/ADC2 ADC3 Temperature Sensor Supply Monitor 32kHz RC Osc 32kHz Xtal Osc 32KXTALIN 32KXTALOUT SPI Slave DIO0 DIO1 DIO2 DIO3 DIO4 DIO5 DIO6 DIO7 DIO8 DIO9 DIO10 DIO11 DIO12 DIO13 DIO14 DIO15 DIO16 DIO17 DIO18 DIO19 DO0 DO1 TXD0 SPI Master UART0 UART1 RXD0 RTS0 CTS0 TxD1 RxD1 TIM0CK_GT TIM0OUT TIM0CAP PWM1 PWM2 PWM3 PWM4 SIF_D SIF_CLK PC0 PC1 JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO ADO ADE Timer0 PWMs 2-wire Interface Pulse Counters JTAG Debug Antenna Diversity SPICLK SPIMOSI SPIMISO SPISEL0 SPICLK SPIMOSI SPIMISO SPISEL0 SPISEL1 SPISEL2 FLASH 256/160/64KB RAM 32/32/8KB Figure 1: JN516x Block Diagram© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 9 2 Pin Configurations 1 40 39 38 37 36 35 34 33 32 31 VSSA 2 3 4 5 6 7 8 9 10 30 29 28 27 26 25 24 23 22 21 11 12 13 14 15 16 17 18 19 20 DIO16 DIO17 RESETN XTAL_OUT XTAL_IN VB_SYNTH VCOTUNE VB_VCO VDD1 IBIAS VREF/ADC2 VB_RF2 RF_IN VB_RF1 ADC1 DIO0 DIO1 DIO2 DIO3 DO0 VSS1 DO1 DIO18 DIO19 VB_RAM DIO4 DIO5 DIO6 DIO7 VDD2 DIO15 VSS2 DIO14 DIO13 DIO12 VB_DIG DIO11 DIO10 DIO9 DIO8 Figure 2: 40-pin QFN Configuration (top view) Note: Please refer to Appendix B.4 JN516x Module Reference Design for important applications information regarding the connection of the PADDLE to the PCB. 10 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 2.1 Pin Assignment Pin No Power supplies Signal Type Description 6, 8, 12, 14, 25, 35 VB_SYNTH, VB_VCO, VB_RF2, VB_RF1, VB_RAM, VB_DIG 1.8V Regulated supply voltage 9, 30 VDD1, VDD2 3.3V Supplies: VDD1 for analogue, VDD2 for digital 21, 39, Paddle VSS1, VSS2, VSSA 0V Grounds (see appendix A.2 for paddle details) General 3 RESETN CMOS Reset input 4,5 XTAL_OUT, XTAL_IN 1.8V System crystal oscillator Radio 7 VCOTUNE 1.8V VCO tuning RC network 10 IBIAS 1.8V Bias current control 13 RF_IN 1.8V RF antenna Analogue Peripheral I/O 15, 16, 17 ADC1, DIO0 (ADC3), DIO1 (ADC4) 3.3V ADC inputs 11 VREF/ADC2 1.8V Analogue peripheral reference voltage or ADC input 2 1, 2 DIO16 (COMP1P), DIO17 (COMP1M) 3.3V Comparator inputs Digital Peripheral I/O Primary Alternate Functions 16 DIO0 SPISEL1 ADC3 CMOS DIO0, SPI Master Select Output 1 or ADC input 3 17 DIO1 SPISEL2 ADC4 PC0 CMOS DIO1, SPI Master Select Output 2, ADC input 4 or Pulse Counter 0 Input 18 DIO2 RFRX TIM0CK_GT CMOS DIO2, Radio Receive Control Output or Timer0 Clock/Gate Input 19 DIO3 RFTX TIM0CAP CMOS DIO3, Radio Transmit Control Output or Timer0 Capture Input 26 DIO4 CTS0 JTAG_TCK TIM0OUT PC0 CMOS DIO4, UART 0 Clear To Send Input, JTAG CLK Input, Timer0 PWM Output, or Pulse Counter 0 input 27 DIO5 RTS0 JTAG_TMS PWM1 PC1 CMOS DIO5, UART 0 Request To Send Output, JTAG Mode Select Input, PWM1 Output or Pulse Counter 1 Input 28 DIO6 TXD0 JTAG_TDO PWM2 CMOS DIO6, UART 0 Transmit Data Output, JTAG Data Output or PWM2 Output 29 DIO7 RXD0 JTAG_TDI PWM3 CMOS DIO7, UART 0 Receive Data Input, JTAG Data Input or PWM 3 Output 31 DIO8 TIM0CK_GT PC1 PWM4 CMOS DIO8, Timer0 Clock/Gate Input, Pulse Counter1 Input or PWM 4 Output© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 11 32 DIO9 TIM0CAP 32KXTALIN RXD1 32KIN CMOS DIO9, Timer0 Capture Input, 32K External Crystal Input, UART 1 Receive Data Input or 32K external clock Input 33 DIO10 TIM0OUT 32KXTALOUT CMOS DIO10, Timer0 PWM Output or 32K External Crystal Output 34 DIO11 PWM1 TXD1 CMOS DIO11, PWM1 Output or UART 1 Transmit Data Output 36 DIO12 PWM2 CTS0 JTAG_TCK ADO SPISMO SI CMOS DIO12, PWM2 Output, UART 0 Clear To Send Input, JTAG CLK Input, Antenna Diversity Odd Output or SPI Slave Master Out Slave In Input 37 DIO13 PWM3 RTS0 JTAG_TMS ADE SPISMI SO CMOS DIO13, PWM3 Output, UART 0 Request To Send Output, JTAG Mode Select Input, Antenna Diversity Even output or SPI Slave Master In Slave Out Output 38 DIO14 SIF_CLK TXD0 TXD1 JTAG_TDO SPISEL 1 SPISSE L CMOS DIO14, Serial Interface Clock, UART 0 Transmit Data Output, UART 1 Transmit Data Output, JTAG Data Output, SPI Master Select Output 1 or SPI Slave Select Input 40 DIO15 SIF_D RXD0 RXD1 JTAG_TDI SPISEL 2 SPISCL K CMOS DIO15, Serial Interface Data, UART 0 Receive Data Input, UART 1 Receive Data Input, JTAG Data Input, SPI Master Select Output 2 or SPI Slave Clock Input 1 DIO16 COMP1P SIF_CLK SPISMOSI CMOS DIO16, Comparator Positive Input, Serial Interface clock or SPI Slave Master Out Slave In Input 2 DIO17 COMP1M SIF_D SPISMISO CMOS DIO17, Comparator Negative Input, Serial Interface Data or SPI Slave Master In Slave Out Output 23 DIO18 SPIMOSI CMOS SPI Master Out Slave In Output 24 DIO19 SPISEL0 CMOS SPI Master Select Output 0 20 DO0 SPICLK PWM2 CMOS SPI Master Clock Output or PWM2 Output 22 DO1 SPIMISO PWM3 CMOS SPI Master In Slave Out Input or PWM3 Output The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN516x failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application.12 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 2.2 Pin Descriptions 2.2.1 Power Supplies The device is powered from the VDD1 and VDD2 pins, each being decoupled with a 100nF ceramic capacitor. VDD1 is the power supply to the analogue circuitry; it should be decoupled to ground. VDD2 is the power supply for the digital circuitry; and should also be decoupled to ground. In addition, a common 10µF tantalum capacitor is required for low frequencies. Decoupling pins for the internal 1.8V regulators are provided which each require a100nF capacitor located as close to the device as practical. VB_SYNTH, VB_RAM and VB_DIG require only a 100nF capacitor. VB_RF and VB_RF2 should be connected together as close to the device as practical, and require one 100nF capacitor and one 47pF capacitor. The pin VB_VCO requires a 10nF capacitor. Refer to B.4.1 for schematic diagram. VSSA (paddle), VSS1, VSS2 are the ground pins. Users are strongly discouraged from connecting their own circuits to the 1.8v regulated supply pins, as the regulators have been optimised to supply only enough current for the internal circuits. 2.2.2 Reset RESETN is an active low reset input pin that is connected to a 500kΩ internal pull-up resistor. It may be pulled low by an external circuit. Refer to Section 6.2 for more details. 2.2.3 32MHz Oscillator A crystal is connected between XTAL_IN and XTAL_OUT to form the reference oscillator, which drives the system clock. A capacitor to analogue ground is required on each of these pins. Refer to Section 5.1 for more details. The 32MHz reference frequency is divided down to 16MHz and this is used as the system clock throughout the device. 2.2.4 Radio The radio is a single ended design, requiring a capacitor and just two inductors to match to 50Ω microstrip line to the RF_IN pin. An external resistor (43kΩ) is required between IBIAS and analogue ground (paddle) to set various bias currents and references within the radio.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 13 2.2.5 Analogue Peripherals The ADC requires a reference voltage to use as part of its operation. It can use either an internal reference voltage or an external reference connected to VREF. This voltage is referenced to analogue ground and the performance of the analogue peripherals is dependent on the quality of this reference. There are four ADC inputs and a pair of comparator inputs. ADC1 has a designated input pin but ADC2 uses the same pin as VREF, invalidating its use as an ADC pin when an external reference voltage is required. The remaining 2 ADC channels are shared with the digital I/Os DIO0 and DIO1 and connect to pins 16 and 17. When these two ADC channels are selected, the corresponding DIOs must be configured as Inputs with their pull-ups disabled. Similarly, the comparator shares pins 1 and 2 with DIO16 and DIO17, so when the comparator is selected these pins must be configured as Inputs with their pull-ups disabled. The analogue I/O pins on the JN516x can have signals applied up to 0.3v higher than VDD1. A schematic view of the analogue I/O cell is shown in Figure 3. Figure 4 demonstrates a special case, where a digital I/O pin doubles as an input to analogue devices. This applies to ADC3, ADC4, COMP1P and COMP1M. In reset, sleep and deep sleep, the analogue peripherals are all off. In sleep, the comparator may optionally be used as a wakeup source. Unused ADC and comparator inputs should not be left unconnected, for example connected to analogue ground. VDD1 Analogue I/O Pin VSSA Analogue Peripheral Figure 3: Analogue I/O Cell 2.2.6 Digital Input/Output For the DC properties of these pins see Section 19.2.3. When used in their primary function all Digital Input/Output pins are bi-directional and are connected to weak internal pull up resistors (50kΩ nominal) that can be disabled. When used in their secondary function (selected when the appropriate peripheral block is enabled through software library calls), their direction is fixed by the function. The pull up resistor is enabled or disabled independently of the function and direction; the default state from reset is enabled. A schematic view of the digital I/O cell is in Figure 4. The dotted lines through resistor RESD represent a path that exists only on DIO0, DIO1, DIO16 and DIO17 which are also inputs to the ADC (ADC3, ADC4) and Comparator (COMP1P, COMP1M) respectively. To use these DIO pins for their analogue functions, the DIO must be set as an Input with its pull-up resistor, RPU, disabled.14 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 O VDD2 Pu RPU OE DIO[x] Pin RESD ADC or COMP1 Input I IE RPROT VSS VSS Figure 4: DIO Pin Equivalent Schematic In reset, the digital peripherals are all off and the DIO pins are set as high-impedance inputs. During sleep and deep sleep, the DIO pins retain both their input/output state and output level that was set as sleep commences. If the DIO pins were enabled as inputs and the interrupts were enabled then these pins may be used to wake up the JN516x from sleep.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 15 3 CPU The CPU of the JN516x is a 32-bit load and store RISC processor. It has been architected for three key requirements: • Low power consumption for battery powered applications • High performance to implement a wireless protocol at the same time as complex applications • Efficient coding of high-level languages such as C provided with the Software Developers Kit It features a linear 32-bit logical address space with unified memory architecture, accessing both code and data in the same address space. Registers for peripheral units, such as the timers, UART and the baseband processor are also mapped into this space. The CPU has access to a block of 15 32-bit General-Purpose (GP) registers together with a small number of special purpose registers which are used to store processor state and control interrupt handling. The contents of any GP register can be loaded from or stored to memory, while arithmetic and logical operations, shift and rotate operations, and signed and unsigned comparisons can be performed either between two registers and stored in a third, or between registers and a constant carried in the instruction. Operations between general or special-purpose registers execute in one cycle while those that access memory require a further cycle to allow the memory to respond. The instruction set manipulates 8, 16 and 32-bit data; this means that programs can use objects of these sizes very efficiently. Manipulation of 32-bit quantities is particularly useful for protocols and high-end applications allowing algorithms to be implemented in fewer instructions than on smaller word-size processors, and to execute in fewer clock cycles. In addition, the CPU supports hardware Multiply that can be used to efficiently implement algorithms needed by Digital Signal Processing applications. The instruction set is designed for the efficient implementation of high-level languages such as C. Access to fields in complex data structures is very efficient due to the provision of several addressing modes, together with the ability to be able to use any of the GP registers to contain the address of objects. Subroutine parameter passing is also made more efficient by using GP registers rather than pushing objects onto the stack. The recommended programming method for the JN516x is by using C, which is supported by a software developer kit comprising a C compiler, linker and debugger. The CPU architecture also contains features that make the processor suitable for embedded, real-time applications. In some applications, it may be necessary to use a real-time operating system to allow multiple tasks to run on the processor. To provide protection for device-wide resources being altered by one task and affecting another, the processor can run in either supervisor or user mode, the former allowing access to all processor registers, while the latter only allows the GP registers to be manipulated. Supervisor mode is entered on reset or interrupt; tasks starting up would normally run in user mode in a RTOS environment. Embedded applications require efficient handling of external hardware events. Exception processing (including reset and interrupt handling) is enhanced by the inclusion of a number of special-purpose registers into which the PC and status register contents are copied as part of the operation of the exception hardware. This means that the essential registers for exception handling are stored in one cycle, rather than the slower method of pushing them onto the processor stack. The PC is also loaded with the vector address for the exception that occurred, allowing the handler to start executing in the next cycle. To improve power consumption a number of power-saving modes are implemented in the JN516x, described more fully in Section 18. One of these modes is the CPU doze mode; under software control, the processor can be shut down and on an interrupt it will wake up to service the request. Additionally, it is possible under software control, to set the speed of the CPU to 1, 2, 4, 8, 16 or 32MHz. This feature can be used to trade-off processing power against current consumption.16 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 4 Memory Organisation This section describes the different memories found within the JN516x. The device contains Flash, RAM, and EEPROM memory, the wireless transceiver and peripherals all within the same linear address space. 0xFFFFFFFF Unpopulated 0xF0008000 RAM 0x04000000 0x02000000 FLASH Boot Code 8K 0x000C0000 0x00000000 0x00080000 Flash & EEPROM Registers 0x01000000 Peripherals FLASH Applications Code (256KB) Figure 5: JN5168 Memory Map 4.1 FLASH The embedded Flash consists of 2 parts: an 8K region used for holding boot code, and a 256K region (JN5168) used for application code. The sector size of the application code is always 32K, for any size of Flash memory. The maximum number of write cycles or endurance is, 10k guaranteed and typically 100k, while the data retention is guaranteed for at least 10 years. The boot code region is pre-programmed by NXP on supplied parts, and contains code to handle reset, interrupts and other events (see section 7). It also contains a Flash Programming Interface to allow interaction with the PC-based Flash Programming Utility which allows user code compiled using the supplied SDK to be programmed into the Application space. For further information, refer to the Flash Programmer User Guide.[9]. The memory can be erased by a single or multiple sectors and written to in units of 256 bytes, known as pagewords. 4.2 RAM The JN516x devices contain up to 32Kbytes of high speed RAM, which can be accessed by the CPU in a single clock cycle. It is primarily used to hold the CPU Stack together with program variables and data. If necessary, the CPU can execute code contained within the RAM (although it would normally just execute code directly from the embedded Flash). Software can control the power supply to the RAM allowing the contents to be maintained during a sleep period when other parts of the device are un-powered, allowing a quicker resumption of processing once woken. 4.3 OTP Configuration Memory The JN516x devices contain a quantity of One Time Programmable (OTP) memory as part of the embedded Flash (Index Sector). This can be used to securely hold such things as a user 64-bit MAC address and a 128-bit AES security key. By default the 64-bit MAC address is pre-programmed by NXP on supplied parts; however customers © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 17 can use their own MAC address and override the default one. The user MAC address and other data can be written to the OTP memory using the Flash programmer [9]. Details on how to obtain and install MAC addresses can be found in the Flash Programmer User Guide. In addition 384bits are available, organised as three 128bit words, for customer use for storage of configuration or other information. 4.4 EEPROM The JN516x devices contain 4Kbytes of EEPROM. The maximum number of write cycles or endurance is, 100k guaranteed and 1M typically while the data retention is guaranteed for at least 20 years. (The Persistent Data Manager, includes a wear-levelling algorithm which can help to extend the endurance.) This non-volatile memory is primarily used to hold persistent data generated from such things as the Network Stack software component (e.g. network topology, routing tables). As the EEPROM holds its contents through sleep and reset events, this means more stable operation and faster recovery is possible after outages. Access to the EEPROM is via registers mapped into the Flash and EEPROM Registers region of the address map. The memory can be erased by a single or multiple pages of 64 bytes. It can be written to in single or multiple bytes up to 64 bytes. The customer may use part of the EEPROM to store its own data if desired by interfacing with the Persistent Data Manager. Optionally the PDM can also store data in an external memory. For further information, please read - JenOS User Guide [12]. 4.5 External Memory An optional external serial non-volatile memory (eg Flash or EEPROM) with a SPI interface may be used to provide additional storage for program code, such as a new code image or further data for the device when external power is removed. The memory can be connected to the SPI Master interface using select line SPISEL0 (see fig 6 for details) JN516x Serial Memory SPISEL0 SPIMISO SPIMOSI SPICLK SS SDO SDI CLK Figure 6: Connecting External Serial Memory The contents of the external serial memory may be encrypted. The AES security processor combined with a user programmable 128-bit encryption key is used to encrypt the contents of the external memory. The encryption key is stored in the flash memory index section. When bootloading program code from external serial memory, the JN516x automatically accesses the encryption key to execute the decryption process, user program code does not need to handle any of the decryption process; it is transparent. For more details, including the how the program code encrypts data for the external memory, see the application note Boot Loader Operation. [8] 4.6 Peripherals All peripherals have their registers mapped into the memory space. Access to these registers requires 3 peripheral clock cycles. Applications have access to the peripherals through the software libraries that present a high-level view of the peripheral’s functions through a series of dedicated software routines. These routines provide both a tested method for using the peripherals and allow bug-free application code to be developed more rapidly. For details, see Peripherals API User Guide [4]. 4.7 Unused Memory Addresses Any attempt to access an unpopulated memory area will result in a bus error exception (interrupt) being generated.18 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 5 System Clocks Two system clocks are used to drive the on-chip subsystems of the JN516x. The wake-up timers are driven from a low frequency clock (notionally 32kHz). All other subsystems (transceiver, processor, memory and digital and analogue peripherals) are driven by a high-speed clock (notionally 32MHz), or a divided-down version of it. The high-speed clock is either generated by the accurate crystal-controlled oscillator (32MHz) or the less accurate high-speed RC oscillator ( 27-32MHz calibrated). The low-speed clock is either generated by the accurate crystalcontrolled oscillator (32.768kHz), the less accurate RC oscillator (centered on 32kHz) or can be supplied externally 5.1 High-Speed (32MHz) System Clock The selected high-speed system clock is used directly by the radio subsystem, whereas a divided-by-two version is used by the remainder of the transceiver and the digital and analogue peripherals. The direct or divided down version of the clock is used to drive the processor and memories (32, 16, 8, 4, 2 or 1MHz). High Speed RC Oscillator 32MHz Crystal Oscillator Div by 1,2,4,8,16 or 32 Div by 2 PERIPHERAL SYSTEM CLOCK CPU CLOCK Figure 7 System and CPU Clocks Crystal oscillators are generally slow to start. Hence to provide a fast start-up following a sleep cycle or reset, the fast RC oscillator is always used as the initial source for the high-speed system clock. The oscillator starts very quickly and will run at 25-32MHz (uncalibrated) or 32MHz +/-5% (calibrated). Although this means that the system clock will be running at an undefined frequency (slightly slower or faster than nominal), this does not prevent the CPU and Memory subsystems operating normally, so the program code can execute. However, it is not possible to use the radio or UARTs, as even after calibration (initiated by the user software calling an API function) there is still a +/-5% tolerance in the clock rate over voltage and temperature. Other digital peripherals can be used (eg SPI Master/Slave), but care must be taken if using Timers due to the clock frequency inaccuracy. Further details of the High-Speed RC Oscillator can be found in section 19.3.11. On wake-up from sleep, the JN516x uses the Fast RC oscillator. It can then either: • Automatically switch over to use the 32MHz clock source when it has started up. • Continue to use the fast RC oscillator until software triggers the switch-over to the 32MHz clock source, for example when the radio is required. • Continue to use the RC oscillator until the device goes back into one of the sleep modes. The use of the fast RC Oscillator at wake-up means there is no need to wait for the 32MHz crystal oscillator to stabilise Consequently, the application code will start executing quickly using the clock from the high-speed RC oscillator. 5.1.1 32MHz Crystal Oscillator The JN516x contains the necessary on chip components to build a 32MHz reference oscillator with the addition of an external crystal resonator and two tuning capacitors. The schematic of these components are shown in Figure 8. The two capacitors, C1 and C2, should typically be 15pF and use a COG dielectric. Due to the small size of these capacitors, it is important to keep the traces to the external components as short as possible. The on chip transconductance amplifier is compensated for temperature variation, and is self-biasing by means of the internal resistor R1. This oscillator provides the frequency reference for the radio and therefore it is essential that the reference PCB layout and BOM are carefully followed. The electrical specification of the oscillator can be found in © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 19 Section 19.3.11. Please refer to Appendix B for development support with the crystal oscillator circuit. The oscillator includes a function which flags when the amplitude of oscillation has reached a satisfactory level for full operation, and this is checked before the source of the high-speed system clock is changed to the 32MHz crystal oscillator XTALOUT C1 C2 XTALIN R1 JN516x Figure 8: 32MHz Crystal Oscillator Connections For operation over the extended temperature range, 85 to 125 deg C, special care is required; this is because the temperature characteristics of crystal resonators are generally in excess of +/-40ppm frequency tolerance defined by the IEEE802.15.4 standard. The oscillator cell contains additional circuitry to compensate for the poor performance of the crystal resonators above 100 deg C. Full details, including the software API function, can be found in the application note JN516x Temperature-dependent Operating Guidelines [2] 5.1.2 High-Speed RC Oscillator An on-chip High-Speed RC oscillator is provided in addition to the 32MHz crystal oscillator for two purposes, to allow a fast start-up from reset or sleep and to provide a lower current alternative to the crystal oscillator for non-timing critical applications. By default the oscillator will run at 27MHz typically with a wide tolerance. It can be calibrated, using a software API function, which will result in a nominal frequency of 32MHz with a +/-1.6% tolerance at 3v and 25 deg C. However, it should be noted that over the full operating range of voltage and temperature this will increase to +/-5%. The calibration information is retained through speed cycles and when the oscillator is disabled, so typically the calibration function only needs to be called once. No external components are required for this oscillator. The electrical specification of the oscillator can be found in Section 19.3.12. 5.2 Low-speed (32kHz) System Clock The 32kHz system clock is used for timing the length of a sleep period (see Section 18). The clock can be selected from one of three sources through the application software: • 32kHz RC Oscillator • 32kHz Crystal Oscillator • 32kHz External Clock Upon a chip reset or power-up the JN516x defaults to using the internal 32kHz RC Oscillator. If another clock source is selected then it will remain in use for all 32kHz timing until a chip reset is performed. 5.2.1 32kHz RC Oscillator The internal 32kHz RC oscillator requires no external components. The internal timing components of the oscillator have a wide tolerance due to manufacturing process variation and so the oscillator runs nominally at 32kHz -10% /+40%. To make this useful as a timing source for accurate wakeup from sleep, a frequency calibration factor derived from the more accurate 16MHz clock may be applied. The calibration factor is derived through software, details can be found in Section 11.3.1. Software must check that the 32kHz RC oscillator is running before using it. The oscillator has a default current consumption of around 0.5uA, optionally this can be reduced to 0.375uA, however, the 20 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 calibrated accuracy and temperature coefficient will be worse as a consequence. For detailed electrical specifications, see Section 19.3.9. 5.2.2 32kHz Crystal Oscillator In order to obtain more accurate sleep periods, the JN516x contains the necessary on-chip components to build a 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be connected between 32KXTALIN and 32KXTALOUT (DIO9 and DIO10), with two equal capacitors to ground, one on each pin. Due to the small size of the capacitors, it is important to keep the traces to the external components as short as possible. The electrical specification of the oscillator can be found in Section 19.3.10. The oscillator cell is flexible and can operate with a range of commonly available 32.768kHz crystals with load capacitances from 6 to 12.5pF. However, the maximum ESR of the crystal and the supply current are both functions of the actual crystal used, see Appendix B.1 for more details. 32KXTALIN 32KXTALOUT JN516x Figure 9: 32kHz Crystal Oscillator Connections 5.2.3 32kHz External Clock An externally supplied 32kHz reference clock on the 32KXTALIN input (DIO9) may be provided to the JN516x. This would allow the 32kHz system clock to be sourced from a very stable external oscillator module, allowing more accurate sleep cycle timings compared to the internal RC oscillator. (See Section 19.2.3)© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 21 6 Reset A system reset initialises the device to a pre-defined state and forces the CPU to start program execution from the reset vector. The reset process that the JN516x goes through is as follows. When power is first applied or when the external reset is released, the High-Speed RC oscillator and 32MHz crystal oscillator are activated. After a short wait period (13µsec approx) while the High-Speed RC starts up, and so long as the supply voltage satisfies the default Supply Voltage Monitor (SVM) threshold (2.0V+0.045V hysteresis), the internal 1.8V regulators are turned on to power the processor and peripheral logic. The regulators are allowed to stabilise (about 15us) followed by a further wait (150usec approx) to allow the Flash and EEPROM bandgaps to stabilise and allow their initialisation, including reading the user SVM threshold from the Flash. This is applied to the SVM and, after a brief pause (approx 2.5usec), the SVM is checked again. If the supply is above the new SVM threshold, the CPU and peripheral logic is released from reset and the CPU starts to run code beginning at the reset vector. This runs the bootloader code contained within the flash, which looks for a valid application to run, first from the internal flash and then from any connected external serial memory over the SPI Master interface. Once found, required variables are initialised in RAM before the application is called at its AppColdStart entry point. More details on the bootloader can be found in the application note - Boot Loader Operation. [8] The JN516x has five sources of reset: • Internal Power-on / Brown-out Reset (BOR) • External Reset • Software Reset • Watchdog timer • Supply Voltage detect Note: When the device exits a reset condition, device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, then the device must be held in reset until the operating conditions are met. (See Section 19.3) 6.1 Internal Power-On / Brown-out Reset (BOR) For the majority of applications the internal power-on reset is capable of generating the required reset signal. When power is applied to the device, the power-on reset circuit monitors the rise of the VDD supply. When the VDD reaches the specified threshold, the reset signal is generated. This signal is held internally until the power supply and oscillator stabilisation time has elapsed, when the internal reset signal is then removed and the CPU is allowed to run. The BOR circuit has the ability to reject spikes on the VDD rail to avoid false triggering of the reset module. Typically for a negative going square pulse of duration 1uS, the voltage must fall to 1.2v before a reset is generated. Similarly for a triangular wave pulse of 10us width, the voltage must fall to 1.3v before causing a reset. The exact characteristics are complex and these are only examples. Internal RESET VDD Figure 10: Internal Power-on Reset When the supply drops below the power on reset ‘falling’ threshold, it will re-trigger the reset. If necessary, use of the external reset circuit show in Figure 11 is suggested. 22 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 RESETN C1 R1 JN516x VDD 18k 470nF Figure 11: External Reset Generation The external resistor and capacitor provide a simple reset operation when connected to the RESETN pin but are not neccessary. 6.2 External Reset An external reset is generated by a low level on the RESETN pin. Reset pulses longer than the minimum pulse width will generate a reset during active or sleep modes. Shorter pulses are not guaranteed to generate a reset. The JN516x is held in reset while the RESETN pin is low. When the applied signal reaches the Reset Threshold Voltage (VRST) on its positive edge, the internal reset process starts. The JN516x has an internal 500kΩ pull-up resistor connect to the RESETN pin. The pin is an input for an external reset only. By holding the RESETN pin low, the JN516x is held in reset, resulting in a typical current of 6uA. Internal Reset RESETN pin Reset Figure 12: External Reset 6.3 Software Reset A system reset can be triggered at any time through software control, causing a full chip reset and invalidating the RAM contents. For example this can be executed within a user’s application upon detection of a system failure. 6.4 Supply Voltage Monitor (SVM) An internal Supply Voltage Monitor (SVM) is used to monitor the supply voltage to the JN516x; this can be used whilst the device is awake or is in CPU doze mode. Dips in the supply voltage below a variable threshold can be detected and can be used to cause the JN516x to perform a chip reset. Equally, dips in the supply voltage can be © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 23 detected and used to cause an interrupt to the processor, when the voltage either drops below the threshold or rises above it. The supply voltage detect is enabled by default from power-up and can extend the reset during power-up. This will keep the CPU in reset until the voltage exceeds the SVM threshold voltage. The threshold voltage is configurable to 1.95V, 2.0V, 2.1V, 2.2V, 2.3V, 2.4V, 2.7V and 3.0V and is controllable by software. From power-up the threshold is set by a setting within the flash and the default chip configuration is for the 2.0V threshold. It is expected that the threshold is set to the minimum needed by the system.. 6.5 Watchdog Timer A watchdog timer is provided to guard against software lockups. It operates by counting cycles of the high-speed RC system clock. A pre-scaler is provided to allow the expiry period to be set between typically 8ms and 16.4 seconds (dependent on high-speed RC accuracy: +30%, -15%). Failure to restart the watchdog timer within the pre-configured timer period will cause a chip reset to be performed. A status bit is set if the watchdog was triggered so that the software can differentiate watchdog initiated resets from other resets, and can perform any required recovery once it restarts. Optionally, the watchdog can cause an exception rather than a reset, this preserves the state of the memory and is useful for debugging. After power up, reset, start from deep sleep or start from sleep, the watchdog is always enabled with the largest timeout period and will commence counting as if it had just been restarted. Under software control the watchdog can be disabled. If it is enabled, the user must regularly restart the watchdog timer to stop it from expiring and causing a reset. The watchdog runs continuously, even during doze, however the watchdog does not operate during sleep or deep sleep, or when the hardware debugger has taken control of the CPU. It will recommence automatically if enabled once the debugger un-stalls the CPU. 24 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 7 Interrupt System The interrupt system on the JN516x is a hardware-vectored interrupt system. The JN516x provides several interrupt sources, some associated with CPU operations (CPU exceptions) and others which are used by hardware in the device. When an interrupt occurs, the CPU stops executing the current program and loads its program counter with a fixed hardware address specific to that interrupt. The interrupt handler or interrupt service routine is stored at this location and is run on the next CPU cycle. Execution of interrupt service routines is always performed in supervisor mode. Interrupt sources and their vector locations are listed in Table 1 below: Interrupt Source Vector Location Interrupt Definition Bus error 0x08 Typically cause by an attempt to access an invalid address or a disabled peripheral Tick timer 0x0e Tick timer interrupt asserted Alignment error 0x14 Load/store address to non-naturally-aligned location Illegal instruction 0x1a Attempt to execute an unrecognised instruction Hardware interrupt 0x20 interrupt asserted System call 0x26 System call initiated by b.sys instruction Trap 0x2c caused by the b.trap instruction or the debug unit Reset 0x38 Caused by software or hardware reset. Stack Overflow 0x3e Stack overflow Table 1: Interrupt Vectors 7.1 System Calls The b.trap and b.sys instructions allow processor exceptions to be generated by software. A system call exception will be generated when the b.sys instruction is executed. This exception can, for example, be used to enable a task to switch the processor into supervisor mode when a real time operating system is in use. (See Section 3 for further details.) The b.trap instruction is commonly used for trapping errors and for debugging. 7.2 Processor Exceptions 7.2.1 Bus Error A bus error exception is generated when software attempts to access a memory address that does not exist, or is not populated with memory or peripheral registers. 7.2.2 Alignment Alignment exceptions are generated when software attempts to access objects that are not aligned to natural word boundaries. 16-bit objects must be stored on even byte boundaries, while 32-bit objects must be stored on quad byte boundaries. For instance, attempting to read a 16-bit object from address 0xFFF1 will trigger an alignment exception as will a read of a 32-bit object from 0xFFF1, 0xFFF2 or 0xFFF3. Examples of legal 32-bit object addresses are 0xFFF0, 0xFFF4, 0xFFF8 etc. 7.2.3 Illegal Instruction If the CPU reads an unrecognised instruction from memory as part of its instruction fetch, it will cause an illegal instruction exception. 7.2.4 Stack Overflow When enabled, a stack overflow exception occurs if the stack pointer reaches a programmable location.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 25 7.3 Hardware Interrupts Hardware interrupts generated from the transceiver, analogue or digital peripherals and DIO pins are individually masked using the Programmable Interrupt Controller (PIC). Management of interrupts is provided in the Peripherals API User Guide [4]. For details of the interrupts generated from each peripheral see the respective section in this datasheet. Interrupts can be used to wake the JN516x from sleep. The peripherals, baseband controller, security coprocessor and PIC are powered down during sleep but the DIO interrupts and optionally the pulse counters, wake-up timers and analogue comparator interrupts remain powered to bring the JN516x out of sleep. Prioritised external interrupt handling (i.e., interrupts from hardware peripherals) is provided to enable an application to control an events priority to provide for deterministic program execution. The priority Interrupt controller provides 15 levels of prioritised interrupts. The priority level of all interrupts can be set, with value 0 being used to indicate that the source can never produce an external interrupt, 1 for the lowest priority source(s) and 15 for the highest priority source(s). Note that multiple interrupt sources can be assigned the same priority level if desired. If while processing an interrupt, a new event occurs at the same or lower priority level, a new external interrupt will not be triggered. However, if a new higher priority event occurs, the external interrupt will again be asserted, interrupting the current interrupt service routine. Once the interrupt service routine is complete, lower priority events can be serviced. 26 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 8 Wireless Transceiver The wireless transceiver comprises a 2.45GHz radio, modem, a baseband processor, a security coprocessor and PHY controller. These blocks, with protocol software provided as a library, implement an IEEE802.15.4 standardsbased wireless transceiver that transmits and receives data over the air in the unlicensed 2.4GHz band. 8.1 Radio Figure 13 shows the single ended radio architecture. LNA synth PA ADC Reference & Bias Switch Radio Calibration Lim1 Lim2 Lim3 Lim4 sigma delta D-Type Figure 13: Radio Architecture The radio comprises a low-IF receive path and a direct modulation transmit path, which converge at the TX/RX switch. The switch connects to the external single ended matching network, which consists of two inductors and a capacitor, this arrangement creates a 50Ω port and removes the need for a balun. A 50Ω single ended antenna can be connected directly to this port. The 32MHz crystal oscillator feeds a divider, which provides the frequency synthesiser with a reference frequency. The synthesiser contains programmable feedback dividers, phase detector, charge pump and internal Voltage Controlled Oscillator (VCO). The VCO has no external components, and includes calibration circuitry to compensate for differences in internal component values due to process and temperature variations. The VCO is controlled by a Phase Locked Loop (PLL) that has an internal loop filter. A programmable charge pump is also used to tune the loop characteristic. The receiver chain starts with the low noise amplifier/mixer combination whose outputs are passed to a low pass filter, which provides the channel definition. The signal is then passed to a series of amplifier blocks forming a limiting strip. The signal is converted to a digital signal before being passed to the Modem. The gain control for the RX path is derived in the automatic gain control (AGC) block within the Modem, which samples the signal level at various points down the RX chain. To improve the performance and reduce current consumption, automatic calibration is applied to various blocks in the RX path. In the transmit direction, the digital stream from the Modem is passed to a digital sigma-delta modulator which controls the feedback dividers in the synthesiser, (dual point modulation). The VCO frequency now tracks the applied modulation. The 2.4 GHz signal from the VCO is then passed to the RF Power Amplifier (PA), whose power control can be selected from one of three settings. The output of the PA drives the antenna via the RX/TX switch© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 27 The JN516x radio when enabled is automatically calibrated for optimum performance. In operating environments with a significant variation in temperature (e.g. greater than 20 deg C) due to diurnal or ambient temperature variation, it is recommended to recalibrate the radio to maintain performance. Recalibration is only required on Routers and End Devices that never sleep. End Devices that sleep when idle are automatically recalibrated when they wake. An Application Note JN516x Temperature-dependent Operating Guidelines [2] describes this in detail and includes a software API function which can be used to test the temperature using the on-chip temperature sensor and trigger a recalibration if there has been a significant temperature change since the previous calibration. 8.1.1 Radio External Components In order to realise the full performance of the radio it is essential that the reference PCB layout and BOM are carefully followed. See Appendix B.4. The radio is powered from a number of internal 1.8V regulators fed from the analogue supply VDD1, in order to provide good noise isolation between the digital logic of the JN516x and the analogue blocks. These regulators are also controlled by the baseband controller and protocol software to minimise power consumption. Decoupling for internal regulators is required as described in Section 2.2.1. For single ended antennas or connectors, a balun is not required, however a matching network is needed. The RF matching network requires three external components and the IBIAS pin requires one external component as shown in schematic in B.4.1. These components are critical and should be placed close to the JN516x pins and analogue ground as defined in Table 12. Specifically, the output of the network comprising L2, C1 and L1 is designed to present an accurate match to a 50 ohm resistive network as well as provide a DC path to the final output stage or antenna. Users wishing to match to other active devices such as amplifiers should design their networks to match to 50 ohms at the output of L1 R1 43K IBIAS C20 100nF L2 3.9nH VB_RF VREF VB_RF2 RF_IN C3 100nF C12 47pF VB_RF1 C1 47pF L1 5.1nH To Coaxial Socket or Integrated Antenna VB_RF Figure 14: External Radio Components 8.1.2 Antenna Diversity Support is provided for antenna diversity. Antenna diversity is a technique that maximises the performance of an antenna system. It allows the radio to switch between two antennas that have very low correlation between their received signals. Typically, this is achieved by spacing two antennae around 0.25 wavelengths apart or by using two orthogonal polarisations. So, if a packet is transmitted and no acknowledgement is received, the radio system can switch to the other antenna for the retry, with a different probability of success.28 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Additionally antenna diversity can be enabled whilst in receive mode waiting for a packet. The JN516x measures the received energy in the relevant radio channel every 40μs and the measured energy level is compared with a pre-set energy threshold, which can be set by the application program. The JN516x device will automatically switch the antennae if the measurement is below this threshold, except if waiting for an acknowledgement from a previous transmission or if the process of receiving a packet, when it will wait until this has finished. Also, it will not switch if a preamble symbol having a signal quality above a minimum specified threshold has not been detected in the last 40μs Both modes can be used at once and use the same ADO and ADE outputs to control the switch. The JN516x provides an output (ADO) on DIO12 that is asserted on odd numbered retries and optionally its complement (ADE) on DIO13, that can be used to control an antenna switch; this enables antenna diversity to be implemented easily (see Figure 15 and Figure 16). Antenna A Antenna B A B COM SEL SELB ADO (DIO[12]) ADE (DIO[13]) Device RF Port RF Switch: Single-Pole, Double-Throw (SPDT) Figure 15: Simple Antenna Diversity Implementation using External RF Switch ADO (DIO[12]) TX Active RX Active ADE (DIO[13]) 1st TX-RX Cycle 2nd TX-RX Cycle (1st Retry) Figure 16: Antenna Diversity ADO Signal for TX with Acknowledgement If two DIO pins cannot be spared, DIO13 can be configured to be a normal DIO pin, and the inverse of ADO generated with an inverter on the PCB. © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 29 8.2 Modem The modem performs all the necessary modulation and spreading functions required for digital transmission and reception of data at 250kbps in the 2450MHz radio frequency band in compliance with the IEEE802.15.4 standard. AGC Demodulation Symbol Detection (Despreading) Modulation Spreading TX RX TX Data Interface RX Data Interface VCO Sigma-Delta Modulator IF Signal Gain Figure 17: Modem Architecture Features provided to support network channel selection algorithms include Energy Detection (ED), Link Quality Indication (LQI) and fully programmable Clear Channel Assessment (CCA). The Modem provides a digital Receive Signal Strength Indication (RSSI) that facilitates the implementation of the IEEE 802.15.4 ED function and LQI function. The ED and LQI are both related to receiver power in the same way, as shown in Figure 18. LQI is associated with a received packet, whereas ED is an indication of signal power on air at a particular moment. The CCA capability of the Modem supports all modes of operation defined in the IEEE 802.15.4 standard, namely Energy above ED threshold, Carrier Sense and Carrier Sense and/or energy above ED threshold. Figure 18: Energy Detect Value vs Receive Power Level30 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 8.3 Baseband Processor The baseband processor provides all time-critical functions of the IEEE802.15.4 MAC layer. Dedicated hardware guarantees air interface timing is precise. The MAC layer hardware/software partitioning, enables software to implement the sequencing of events required by the protocol and to schedule timed events with millisecond resolution, and the hardware to implement specific events with microsecond timing resolution. The protocol software layer performs the higher-layer aspects of the protocol, sending management and data messages between endpoint and coordinator nodes, using the services provided by the baseband processor. Supervisor Append Checksum Serialiser DMA Engine TX Stream Radio Protocol Timing Engine CSMA CCA Backoff Control Control RX Stream Verify Checksum Deserialiser Protocol Timers Security Coprocessor AES Codec Encrypt Port Decrypt Port Status Processor Bus Figure 19: Baseband Processor 8.3.1 Transmit A transmission is performed by software writing the data to be transferred into the Tx Frame Buffer in RAM, together with parameters such as the destination address and the number of retries allowed, and programming one of the protocol timers to indicate the time at which the frame is to be sent. This time will be determined by the software tracking the higher-layer aspects of the protocol such as superframe timing and slot boundaries. Once the packet is prepared and protocol timer set, the supervisor block controls the transmission. When the scheduled time arrives, the supervisor controls the sequencing of the radio and modem to perform the type of transmission required, fetching the packet data directly from RAM. It can perform all the algorithms required by IEEE802.15.4 such as CSMA/CA without processor intervention including retries and random backoffs. When the transmission begins, the header of the frame is constructed from the parameters programmed by the software and sent with the frame data through the serialiser to the Modem. At the same time, the radio is prepared for transmission. During the passage of the bitstream to the modem, it passes through a CRC checksum generator that calculates the checksum on-the-fly, and appends it to the end of the frame. 8.3.2 Reception During reception, the radio is set to receive on a particular channel. On receipt of data from the modem, the frame is directed into the Rx Frame Buffer in RAM where both header and frame data can be read by the protocol software. An interrupt may be provided on receipt of the frame header. As the frame data is being received from the modem it is passed through a checksum generator; at the end of the reception the checksum result is compared with the checksum at the end of the message to ensure that the data has been received correctly. An interrupt may be provided to indicate successful packet reception. During reception, the modem determines the Link Quality, which is made available at the end of the reception as part of the requirements of IEEE802.15.4.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 31 8.3.3 Auto Acknowledge Part of the protocol allows for transmitted frames to be acknowledged by the destination sending an acknowledge packet within a very short window after the transmitted frame has been received. The JN516x baseband processor can automatically construct and send the acknowledgement packet without processor intervention and hence avoid the protocol software being involved in time-critical processing within the acknowledge sequence. The JN516x baseband processor can also request an acknowledge for packets being transmitted and handle the reception of acknowledged packets without processor intervention. 8.3.4 Beacon Generation In beaconing networks, the baseband processor can automatically generate and send beacon frames; the repetition rate of the beacons is programmed by the CPU, and the baseband then constructs the beacon contents from data delivered by the CPU. The baseband processor schedules the beacons and transmits them without CPU intervention. 8.3.5 Security The transmission and reception of secured frames using the Advanced Encryption Standard (AES) algorithm is handled by the security coprocessor and the stack software. The application software must provide the appropriate encrypt/decrypt keys for the transmission or reception. On transmission, the key can be programmed at the same time as the rest of the frame data and setup information. 8.4 Security Coprocessor The security coprocessor is available to the application software to perform encryption/decryption operations. A hardware implementation of the encryption engine significantly speeds up the processing of the encrypted packets over a pure software implementation. The AES library for the JN516x provides operations that utilise the encryption engine in the device and allow the contents of memory buffers to be transformed. Information such as the type of security operation to be performed and the encrypt/decrypt key to be used must also be provided. Processor Interface AES Block Encryption Controller AES Encoder Key Generation Figure 20: Security Coprocessor Architecture 8.5 Time of Flight Engine The JN516x family includes unique hardware functions to enable measurement of the distance between two nodes using a “Time of Flight” (ToF) function. This function uses dedicated timers and interpolation of the timing of correlation peaks in the demodulator to measure the delays introduced by the time taken for the radio signals to travel between nodes. It is also possible to use the received signal strength (RSSI) to indicate the distance. Due to the characteristics of the transmitted signal and the baseband circuitry, ToF offers a significant improvement in accuracy for distance measurements above 10m compared with RSSI, while RSSI provides better ranging results below 10m. Hence, ToF is best suited to long range distance measurement. The raw timing results are made available through an API function, but the responsibility for converting these into location information lies with the user. For more information, see the Time-of-flight API User Guide [10]32 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 9 Digital Input/Output There are 20 Digital I/O (DIO) pins which when used as general-purpose pins can be configured as either an input or an output, with each having a selectable internal pull-up resistor. In addition, there are 2 Digital Output (DO) pins. Most DIO pins are shared with the digital and analogue peripherals of the device. When a peripheral is enabled, it takes control over the device pins allocated to it. However, note that most peripherals have 2 alternative pin allocations to alleviate clashes between uses, and many peripherals can disable the use of specific pins if not required. Refer to Section 2.1 and the individual peripheral descriptions for full details of the available pinout arrangements. Following a reset (and whilst the RESETN input is held low), all peripherals are forced off and the DIO pins are configured as inputs with the internal pull-ups turned on.When a peripheral is not enabled, the DIO pins associated with it can be used as digital inputs or outputs. Each pin can be controlled individually by setting the direction and then reading or writing to the pin. The individual pull-up resistors, RPU, can also be enabled or disabled as needed and the setting is held through sleep cycles. The pull-ups are generally configured once after reset depending on the external components and functionality. For instance, outputs should generally have the pull-ups disabled. An input that is always driven should also have the pull-up disabled. When configured as an input each pin can be used to generate an interrupt upon a change of state (selectable transition either from low to high or high to low); the interrupt can be enabled or disabled. When the device is sleeping, these interrupts become events that can be used to wake the device up. Equally the status of the interrupt may be read. See Section 18 for further details on sleep and wakeup. The state of all DIO pins can be read, irrespective of whether the DIO is configured as an input or an output. Throughout a sleep cycle the direction of the DIO, and the state of the outputs, is held. This is based on the resultant of the GPIO Data/Direction registers and the effect of any enabled peripherals at the point of entering sleep. Following a wake-up these directions and output values are maintained under control of the GPIO data/direction registers. Any peripherals enabled before the sleep cycle are not automatically re-enabled, this must be done through software after the wake-up. For example, if DIO0 is configured to be SPISEL1 then it becomes an output. The output value is controlled by the SPI functional block. If the device then enters a sleep cycle, the DIO will remain an output and hold the value being output when entering sleep. After wake-up the DIO will still be an output with the same value but controlled from the GPIO Data/Direction registers. It can be altered with the software functions that adjust the DIO, or the application may re-configure it to be SPISEL1. Unused DIO pins are recommended to be set as inputs with the pull-up enabled. Two DIO pins can optionally be used to provide control signals for RF circuitry (e.g. switches and PA) in high power range extenders. DIO3/RFTX is asserted when the radio is in the transmit state and similarly, DIO2/RFRX is asserted when the radio is in the receiver state.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 33 MUX SPI Slave DIO0/SPISEL1/ADC3 DIO1/SPISEL2/ADC4/PC0 DIO2/RFRX/TIM0CK_GT DIO3/RFTX/TIM0CAP DIO4/CTS0/TIM0OUT/PC0 DIO5/RTS0/PWM1/PC1 DIO6/TXD0/PWM2 DIO7/RXD0/PWM3 DIO8/TIM0CK_GT/PC1/PWM4 DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN DIO10/TIM0OUT/32KXTALOUT DIO11/PWM1/TXD1 DIO12/PWM2/CTS0/ADO/SPISMOSI DIO13/PWM3/RTS0/ADE/SPISMISO DIO14/SIF_CLK/TXD0/TXD1/SPISEL1/SPISSEL DIO15/SIF_D/RXD0/RXD1/SPISEL2/SPISCLK DIO16/COMP1P/SIF_CLK/SPISMOSI DIO17/COMP1M/SIF_D/SPISMISO DIO18/SPIMOSI DIO19/SPISEL0 DO0/SPICLK/PWM2 DO1/SPIMISO/PWM3 TXD0 SPI Master UART0 UART1 RXD0 RTS0 CTS0 TxD1 RxD1 TIM0CK_GT TIM0OUT TIM0CAP PWM1 PWM2 PWM3 PWM4 SIF_D SIF_CLK PC0 PC1 JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO ADO ADE Timer0 PWMs 2-wire Interface Pulse Counters JTAG Debug Antenna Diversity SPICLK SPIMOSI SPIMISO SPISEL0 SPICLK SPIMOSI SPIMISO SPISEL0 SPISEL1 SPISEL2 Figure 21 DIO Block Diagram34 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 10 Serial Peripheral Interface 10.1 Serial Peripheral Interface Master The Serial Peripheral Interface (SPI) allows high-speed synchronous data transfer between the JN516x and peripheral devices. The JN516x operates as a master on the SPI bus and all other devices connected to the SPI are expected to be slave devices under the control of the JN516x CPU. The SPI includes the following features: • Full-duplex, three-wire synchronous data transfer • Programmable bit rates (up to 16Mbit/s) • Programmable transaction size up to 32-bits • Standard SPI modes 0,1,2 and 3 • Manual or Automatic slave select generation (up to 3 slaves) • Maskable transaction complete interrupt • LSB First or MSB First Data Transfer • Supports delayed read edges Clock Divider SPI Bus Cycle Controller Data Buffer DIV Clock Edge Select Data CHAR_LEN LSB SPIMISO SPIMOSI SPICLK Select Latch SPISEL [2..0] 16 MHz Figure 22: SPI Master Block Diagram The SPI bus employs a simple shift register data transfer scheme. Data is clocked out of and into the active devices in a first-in, first-out fashion allowing SPI devices to transmit and receive data simultaneously. Master-Out-Slave-In or Master-In-Slave-Out data transfer is relative to the clock signal SPICLK generated by the JN516x. The JN516x provides three slave selects, SPISEL0 to SPISEL2 to allow three SPI peripherals on the bus. SPISEL0 is accessed on DI019. SPISEL1 is accessed, depending upon the configuration, on DIO0 or DIO14. SPISEL2 is accessed on DIO1 or DIO15. This is enabled under software control. The following table details which DIO are used for the SPISEL signals depending upon the configuration. Signal DIO Assignment Standard pins Alternative pins SPISEL1 DIO0 DIO14 SPISEL2 DIO1 DIO15 SPICLK DO0 SPIMISO DO1 SPIMOSI DIO18 SPISEL0 DIO19 Table 2: SPI Master IO© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 35 The interface can transfer from 1 to 32-bits without software intervention and can keep the slave select lines asserted between transfers when required, to enable longer transfers to be performed. When the device reset is active, all the SPI Master pins are configured as inputs with their pull-up resistors active. The pins stay in this state until the SPI Master block is enabled, or the pins are configured for some other use. SS Slave 0 Flash/ EEPROM Memory JN5142 SPISE L0 SPISE L1 SPIMOSI SPICLK SPIMISO SS Slave 1 User Defined SS Slave 2 User Defined SPISE L2 SI C SO SI C SO SI C SO JN516X Figure 23: Typical JN516x SPI Peripheral Connection The data transfer rate on the SPI bus is determined by the SPICLK signal. The JN516x supports transfers at selectable data rates from 16MHz to 125kHz selected by a clock divider. Both SPICLK clock phase and polarity are configurable. The clock phase determines which edge of SPICLK is used by the JN516x to present new data on the SPIMOSI line; the opposite edge will be used to read data from the SPIMISO line. The interface should be configured appropriately for the SPI slave being accessed. SPICLK Polarity Mode Description (CPOL) Phase (CPHA) 0 0 0 SPICLK is low when idle – the first edge is positive. Valid data is output on SPIMOSI before the first clock and changes every negative edge. SPIMISO is sampled every positive edge. 0 1 1 SPICLK is low when idle – the first edge is positive. Valid data is output on SPIMOSI every positive edge. SPIMISO is sampled every negative edge. 1 0 2 SPICLK is high when idle – the first edge is negative. Valid data is output on SPIMOSI before the first clock edge and is changed every positive edge. SPIMISO is sampled every negative edge. 1 1 3 SPICLK is high when idle – the first edge is negative. Valid data is output on SPIMOSI every negative edge. SPIMISO is sampled every positive edge. Table 3: SPI Configurations36 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 If more than one SPISEL line is to be used in a system they must be used in numerical order starting from SPISEL0. A SPISEL line can be automatically de-asserted between transactions if required, or it may stay asserted over a number of transactions. For devices such as memories where a large amount of data can be received by the master by continually providing SPICLK transitions, the ability for the select line to stay asserted is an advantage since it keeps the slave enabled over the whole of the transfer. A transaction commences with the SPI bus being set to the correct configuration, and then the slave device is selected. Upon commencement of transmission (1 to 32 bits) data is placed in the FIFO data buffer and clocked out, at the same time generating the corresponding SPICLK transitions. Since the transfer is full-duplex, the same number of data bits is being received from the slave as it transmits. The data that is received during this transmission can be read (1 to 32 bits). If the master simply needs to provide a number of SPICLK transitions to allow data to be sent from a slave, it should perform transmit using dummy data. An interrupt can be generated when the transaction has completed or alternatively the interface can be polled. If a slave device wishes to signal the JN516x indicating that it has data to provide, it may be connected to one of the DIO pins that can be enabled as an interrupt. Figure 24 shows a complex SPI transfer, reading data from a FLASH device that can be achieved using the SPI master interface. The slave select line must stay low for many separate SPI accesses, and therefore manual slave select mode must be used. The required slave select can then be asserted (active low) at the start of the transfer. A sequence 8 and 32 bit transfers can be used to issue the command and address to the FLASH device and then to read data back. Finally, the slave select can be deselected to end the transaction. 0 1 2 3 4 5 6 7 Instruction (0x03) 23 22 21 3 2 1 0 8 9 10 28 29 30 31 24-bit Address MSB Instruction Transaction 7 6 5 4 3 2 1 0 MSB 0 1 2 3 4 5 7 8N-1 3 2 1 0 LSB Read Data Bytes Transaction(s) 1-N SPISEL SPICLK SPIMOSI SPIMISO SPISEL SPICLK SPIMOSI SPIMISO 8 9 10 7 6 5 MSB Byte 1 Byte 2 Byte N value unused by peripherals 6 Figure 24: Example SPI Waveforms – Reading from FLASH Device using Mode 0© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 37 10.2 Serial Peripheral Interface Slave The Serial Peripheral Interface (SPI) Slave Interface allows high-speed synchronous data transfer between the JN516x and a peripheral device. The JN516x operates as a slave on the SPI bus and an external device connected to the SPI bus operates as the master. The pins are different from the SPI master interface and are shown in the following table. Signal DIO Assignment Standard pins Alternative pins SPISCLK DIO15 SPISMISO DIO13 DIO17 SPISMOSI DIO12 DIO16 SPISSEL DIO14 Table 4: SPI Slave IO The SPI bus employs a simple shift register data transfer scheme, with SPISSEL acting as the active low select control. Data is clocked out of and into the active devices in a first-in, first-out fashion allowing SPI devices to transmit and receive data simultaneously. Master-Out-Slave-In or Master-In-Slave-Out data transfer is relative to the clock signal SPISCLK generated by the external master. The SPI slave includes the following features: • Full-duplex synchronous data transfer • Slaves to external clock up to 8MHz • Supports 8 bit transfers (MSB or LSB first configurable), with SPISSEL deselected between each transfer • Internal FIFO up to 255 bytes for transmit and receive • Standard SPI mode 0, data is sampled on positive clock edge • Maskable interrupts for receive FIFO not empty, transmit FIFO empty, receive FIFO fill level above threshold, transmit FIFO fill level below threshold, transmit FIFO overflow, receive FIFO overflow, receive FIFO underflow, transmit FIFO underflow, receive timeout • Programmable receive timeout period allows an interrupt to be generated to prompt the receive FIFO to be read if no further data arrives within the timeout period38 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 11 Timers 11.1 Peripheral Timer/Counters A general-purpose timer/counter unit, Timer0, is available that can be configured to operate in one of five possible modes. This has: • Clocked from internal system clock (16MHz) • 5-bit prescaler, divides system clock by 2 prescale value as the clock to the timer (prescaler range is 0 to 16) • 16-bit counter, 16-bit Rise and Fall (period) registers • Timer: can generate interrupts off Rise and Fall counts. Can be gated by external signal • Counter: counts number of transitions on external event signal. Can use low-high, high-low or both transitions • PWM/Single pulse: outputs repeating Pulse Width Modulation signal or a single pulse. Can set period and mark-space ratio • Capture: measures times between transitions of an applied signal • Delta-Sigma: Return-To-Zero (RTZ) and Non-Return-to-Zero (NRZ) modes • Timer usage of external IO can be controlled on a pin by pin basis Four further timers are also available that support the same functionality but have no Counter or Capture mode. These are referred to as PWM timers. Additionally, is not possible to gate these four timers with an external signal. >= D Q Rise = < Fall Delta Sigma Interrupt Generator Counter Interrupt Enable Capture Generator Prescaler SYSCLK TIMxCK_GT TIMxCAP Interrupt PWM/∆Σ PWM/∆Σ PWM/∆Σ Reset Generator Edge Select EN EN TIMxOut Sw Reset System Reset Single Shot -1 Figure 25: Timer Unit Block Diagram© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 39 The clock source for the Timer0 unit is fed from the 16MHz system clock. This clock passes to a 5-bit prescaler where a value of 0 leaves the clock unmodified and other values divide it by 2 prescale value. For example, a prescale value of 2 applied to the 16MHz system clock source results in a timer clock of 4MHz. The counter is optionally gated by a signal on the clock/gate input (TIM0CK_GT). If the gate function is selected, then the counter is frozen when the clock/gate input is high. An interrupt can be generated whenever the counter is equal to the value in either of the High or Low registers. The following table details which DIO are used for timer0 and the PWM depending upon the configuration. Signal DIO Assignment Standard pins Alternative pins TIM0CK_GT DIO8 DIO2 TIM0CAP DIO9 DIO3 TIM0OUT DIO10 DIO4 PWM1 DIO11 DIO5 PWM2 DIO12 DIO6 PWM3 DIO13 DIO7 PWM4 DIO17 DIO8 Table 5: Timer and PWM IO The alternative pin locations can be configured separately for each counter/timer under software control, without affecting the operation or location of the others If operating in timer mode, it is not necessary to use any of the DIO pins, allowing the standard DIO functionality to be available to the application. 11.1.1 Pulse Width Modulation Mode Pulse Width Modulation (PWM) mode, as used by PWM timers 1,2 3 and 4 and optionally by Timer0, allows the user to specify an overall cycle time and pulse length within the cycle. The pulse can be generated either as a single shot or as a train of pulses with a repetition rate determined by the cycle time. In this mode, the cycle time and low periods of the PWM output signal can be set by the values of two independent 16-bit registers (Fall and Rise). The counter increments and its output is compared to the 16-bit Rise and Fall registers. When the counter is equal to the Rise register, the PWM output is set to high; when the counter reaches the Fall value, the output returns to low. In continuous mode, when the counter reaches the Fall value, it will reset and the cycle repeats. If either the cycle time or low periods are changed while in continuous mode, the new values are not used until a full cycle has completed. The PWM waveform is available on PWM1,2,3,4 or TIM0OUT when the output driver is enabled. Rise Fall Figure 26 PWM Output Timings 11.1.2 Capture Mode The capture mode can be used to measure the time between transitions of a signal applied to the capture input (TIM0CAP). When the capture is started, on the next low-to-high transition of the captured signal, the count value is stored in the Rise register, and on the following high-to-low transition, the counter value is stored in the Fall register. The pulse width is the difference in counts in the two registers multiplied by the period of the prescaled clock. Upon reading the capture registers the counter is stopped. The values in the High and Low registers will be updated whenever there is a corresponding transition on the capture input, and the value stored will be relative to when the mode was started. Therefore, if multiple pulses are seen on TIM0CAP before the counter is stopped only the last pulse width will be stored. 40 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 CLK CAPT x 9 3 x 14 t RISE t RISE t FALL t FALL Rise Fall 9 5 3 4 7 Capture Mode Enabled Figure 27: Capture Mode 11.1.3 Counter/Timer Mode The counter/timer can be used to generate interrupts, based on the timers or event counting, for software to use. As a timer the clock source is from the system clock, prescaled if required. The timer period is programmed into the fall register and the Fall register match interrupt enabled. The timer is started as either a single-shot or a repeating timer, and generates an interrupt when the counter reaches the Fall register value. When used to count external events on TIM0CK_GT the clock source is selected from the input pin and the number of events programmed into the Fall register. The Fall register match interrupt is enabled and the counter started, usually in single shot mode. An interrupt is generated when the programmed number of transitions is seen on the input pin. The transitions counted can configured to be rising, falling or both rising and falling edges. Edges on the event signal must be at least 100nsec apart, i.e. pulses must be wider than 100nsec. 11.1.4 Delta-Sigma Mode A separate delta-sigma mode is available, allowing a low speed delta-sigma DAC to be implemented with up to 16-bit resolution. This requires that a resistor-capacitor network is placed between the output DIO pin and digital ground. A stream of pulses with digital voltage levels is generated which is integrated by the RC network to give an analogue voltage. A conversion time is defined in terms of a number of clock cycles. The width of the pulses generated is the period of a clock cycle. The number of pulses output in the cycle, together with the integrator RC values, will determine the resulting analogue voltage. For example, generating approximately half the number of pulses that make up a complete conversion period will produce a voltage on the RC output of VDD1/2, provided the RC time constant is chosen correctly. During a conversion, the pulses will be pseudo-randomly dispersed throughout the cycle in order to produce a steady voltage on the output of the RC network. The output signal is asserted for the number of clock periods defined in the High register, with the total period being 216 cycles. For the same value in the High register, the pattern of pulses on subsequent cycles is different, due to the pseudo-random distribution. The delta-sigma converter output can operate in a Return-To-Zero (RTZ) or a Non-Return-to-Zero (NRZ) mode. The NRZ mode will allow several pulses to be output next to each other. The RTZ mode ensures that each pulse is separated from the next by at least one period. This improves linearity if the rise and fall times of the output are different to one another. Essentially, the output signal is low on every other output clock period, and the conversion cycle time is twice the NRZ cycle time i.e. 217 clocks. The integrated output will only reach half VDD2 in RTZ mode, since even at full scale only half the cycle contains pulses. Figure 28 and Figure 29 illustrate the difference between RTZ and NRZ for the same programmed number of pulses.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 41 1 2 3 1 2 N Conversion cycle 1 217 N Conversion cycle 2 3 Figure 28: Return To Zero Mode in Operation 1 2 3 1 2 N Conversion cycle 1 N 3 216 Conversion cycle 2 Figure 29: Non-Return to Zero Mode 11.1.5 Infra-Red Transmission Mode Infra-red transmission mode is a special feature of Timer 2 that is used to facilitate the generation of waveforms for infra-red remote control transmission. Remote control protocols, such as Philips RC-6, apply On-Off Key (OOK) modulation to a carrier signal using an encoded bit stream. The infra-red transmission mode supports a variety of remote control protocols that have different carrier frequency, carrier duty-cycle and data bit encoding requirements. In this mode, Timer 2 is configured to produce a carrier waveform that is OOK modulated by a programmable bit sequence of up to 4096 bits stored in RAM. The resultant waveform is output to the associated Timer 2 output pin. The JN516x Integrated Peripherals API User Guide [4] includes some examples. 11.1.6 Example Timer/Counter Application Figure 30 shows an application of the JN516x timers to provide closed loop speed control. PWM1 is configured in PWM mode to provide a variable mark-space ratio switching waveform to the gate of the NFET. This in turn controls the power in the DC motor. Timer 0 is configured to count the rising edge events on the clk/gate pin over a constant period. This converts the tacho pulse stream output into a count proportional to the motor speed. This value is then used by the application software executing the control algorithm. If required for other functionality, then the unused IO associated with the timers could be used as general purpose DIO. JN516x PWM1 Timer0 CLK/GATE CAPTURE PWM M Tacho 1N4007 +12V IRF521 1 pulse/rev Figure 30: Closed Loop PWM Speed Control Using JN516x Timers42 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 11.2 Tick Timer The JN516x contains a hardware timer that can be used for generating timing interrupts to software. It may be used to implement regular events such as ticks for software timers or an operating system, as a high-precision timing reference or can be used to implement system monitor timeouts as used in a watchdog timer. Features include: • 32-bit counter • 28-bit match value • Maskable timer interrupt • Single-shot, Restartable or Continuous modes of operation Match Value Counter = Mode Control & & SysClk Run Match Int Enable Tick Timer Interrupt Reset Mode Figure 31 Tick Timer The Tick Timer is clocked from a continuous 16MHz clock, which is fed to a 32-bit wide resettable up-counter, gated by a signal from the mode control block. A match register allows comparison between the counter and a programmed value. The match value, measured in 16MHz clock cycles is programmed through software, in the range 0 to 0x0FFFFFFF. The output of the comparison can be used to generate an interrupt if the interrupt is enabled and used in controlling the counter in the different modes. Upon configuring the timer mode, the counter is also reset. If the mode is programmed as single shot, the counter begins to count from zero until the match value is reached. The match signal will be generated which will cause an interrupt if enabled, and the counter will stop counting. The counter is restarted by reprogramming the mode. If the mode is programmed as restartable, the operation of the counter is the same as for the single shot mode, except that when the match value is reached the counter is reset and begins counting from zero. An interrupt will be generated when the match value is reached if it is enabled. Continuous mode operation is similar to restartable, except that when the match value is reached, the counter is not reset but continues to count. An interrupt will be generated when the match value is reached if enabled. 11.3 Wakeup Timers Two -41 bit wakeup timers are available in the JN516x driven from the 32kHz internal clock. They may run during sleep periods when the majority of the rest of the device is powered down, to time sleep periods or other long period timings that may be required by the application. The wakeup timers do not run during deep sleep and may optionally © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 43 be disabled in sleep mode through software control. When a wakeup timer expires it typically generates an interrupt, if the device is asleep then the interrupt may be used as an event to end the sleep period. See Section 18 for further details on how they are used during sleep periods. Features include: • 41-bit down-counter • Optionally runs during sleep periods • Clocked by 32kHz system clock; either 32kHz RC oscillator, 32kHz XTAL oscillator or 32kHz clock input A wakeup timer consists of a 41-bit down counter clocked from the selected 32 kHz clock. An interrupt or wakeup event can be generated when the counter reaches zero. On reaching zero the counter will continue to count down until stopped, which allows the latency in responding to the interrupt to be measured. If an interrupt or wakeup event is required, the timer interrupt should be enabled before loading the count value for the period. Once the count value is loaded and counter started, the counter begins to count down; the counter can be stopped at any time through software control. The counter will remain at the value it contained when the timer was stopped and no interrupt will be generated. The status of the timers can be read to indicate if the timers are running and/or have expired; this is useful when the timer interrupts are masked. This operation will reset any expired status flags. 11.3.1 32 KHZ RC Oscillator Calibration The 32 KHZ RC oscillator that can be used to time sleep periods is designed to require very little power to operate and be self-contained, requiring no external timing components and hence is lower cost. As a consequence of using on-chip resistors and capacitors, the inherent absolute accuracy and temperature coefficient is lower than that of a crystal oscillator, but once calibrated the accuracy approaches that of a crystal oscillator. Sleep time periods should be as close to the desired time as possible in order to allow the device to wake up in time for important events, for example beacon transmissions in the IEEE802.15.4 protocol. If the sleep time is accurate, the device can be programmed to wake up very close to the calculated time of the event and so keep current consumption to a minimum. If the sleep time is less accurate, it will be necessary to wake up earlier in order to be certain the event will be captured. If the device wakes earlier, it will be awake for longer and so reduce battery life. Please note, that oscillator has a default current consumption of around 0.5uA, optionally this can be reduced to 0.375uA, which can improve battery life, however, the calibrated accuracy and temperature coefficient will be worse as a consequence. For detailed electrical specifications, see Section 19.3.9. In order to allow sleep time periods to be as close to the desired length as possible, the true frequency of the RC oscillator needs to be determined to better than the initial 30% accuracy. The calibration factor can then be used to calculate the true number of nominal 32kHz periods needed to make up a particular sleep time. A calibration reference counter, clocked from the 16MHz system clock, is provided to allow comparisons to be made between the 32kHz RC clock and the 16MHz system clock when the JN516x is awake and running from the 32MHZ crystal. Wakeup timer0 counts for a set number of 32kHz clock periods during which time the reference counter runs. When the wakeup timer reaches zero the reference counter is stopped, allowing software to read the number of 16MHz clock ticks generated during the time represented by the number of 32kHz ticks programmed in the wakeup timer. The true period of the 32kHz clock can thus be determined and used when programming a wakeup timer to achieve a better accuracy and hence more accurate sleep periods For a RC oscillator running at exactly 32,000Hz the value returned by the calibration procedure should be 10000, for a calibration period of twenty 32,000Hz clock periods. If the oscillator is running faster than 32,000Hz the count will be less than 10000, if running slower the value will be higher. For a calibration count of 9000, indicating that the RC oscillator period is running at approximately 35kHz, to time for a period of 2 seconds the timer should be loaded with 71,111 ((10000/9000) x (32000 x 2)) rather than 64000.44 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 12 Pulse Counters Two 16-bit counters are provided that can increment during all modes of operation (including sleep). The first, PC0, increments from pulses received on DIO1 or DIO4. The other pulse counter, PC1 operates from DIO5 or DIO8 depending upon the configuration. This is enabled under software control. The pulses can be de-bounced using the 32kHz clock to guard against false counting on slow or noisy edges. Increments occur from a configurable rising or falling edge on the respective DIO input. Each counter has an associated 16-bit reference that is loaded by the user. An interrupt (and wakeup event if asleep) may be generated when a counter reaches its pre-configured reference value. The two counters may optionally be cascaded together to provide a single 32-bit counter, linked to any of the four DIO’s. The counters do not saturate at 65535, but naturally roll-over to 0. Additionally, the pulse counting continues when the reference value is reached without software interaction so that pulses are not missed even if there is a long delay before an interrupt is serviced or during the wakeup process. The system can work with signals up to 100kHz, with no debounce, or from 5.3kHz to 1.7kHz with debounce. When using debounce the 32kHz clock must be active, so for minimum sleep currents the debounce mode should not be used.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 45 13 Serial Communications The JN516x has two Universal Asynchronous Receiver/Transmitter (UART) serial communication interfaces. These provide similar operating features to the industry standard 16550A device operating in FIFO mode. The interfaces perform serial-to-parallel conversion on incoming serial data and parallel-to-serial conversion on outgoing data from the CPU to external devices. In both directions, a configurable FIFO buffer (with a default depth of 16-bytes) allows the CPU to read and write multiple characters on each transaction. This means that the CPU is freed from handling data on a character-by-character basis, with the associated high processor overhead. The UARTs have the following features: • Emulates behaviour of industry standard NS16450 and NS16550A UARTs • Configurable transmit and receive FIFO buffers (with default depths of 16-bytes for each), with direct access to fill levels of each. Adds/deletes standard start, stop and parity bits to or from the serial data • Independently controlled transmit, receive, status and data sent interrupts • Optional modem flow control signals CTS and RTS on UART0. • Fully programmable data formats: baud rate, start, stop and parity settings • False start bit detection, parity, framing and FIFO overrun error detect and break indication • Internal diagnostic capabilities: loop-back controls for communications link fault isolation • Flow control by software or automatically by hardware Processor Bus Divisor Latch Registers Line Status Register Line Control Register FIFO Control Register Receiver FIFO Transmitter FIFO Baud Generator Logic Transmitter Shift Register Receiver Shift Register Transmitter Logic Receiver Logic RXD TXD Modem Control Register Modem Status Register Modem Signals Logic RTS CTS Interrupt ID Register Interrupt Enable Register Interrupt Logic Internal Interrupt Figure 32: UART Block Diagram The serial interfaces contain programmable fields that can be used to set number of data bits (5, 6,7 or 8), even, odd, set-at-1, set-at-0 or no-parity detection and generation of single or multiple stop bit, (for 5 bit data, multiple is 1.5 stop bits; for 6, 7 or 8 data bits, multiple is 2 bits). The baud rate is programmable up to 1Mbps, standard baud rates such as 4800, 9600, 19.2k, 38.4k etc. can be configured. For applications requiring hardware flow control, UART0 provides two control signals: Clear-To-Send (CTS) and Request-To-Send (RTS). CTS is an indication sent by an external device to the UART that it is ready to receive data. RTS is an indication sent by the UART to the external device that it is ready to receive data. RTS is controlled from software, while the value of CTS can be read. Monitoring and control of CTS and RTS is a software activity, normally performed as part of interrupt processing. The signals do not control parts of the UART hardware, but simply indicate to software the state of the UART external interfaces. Alternatively, the Automatic Flow Control mode can be set 46 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 where the hardware controls the value of the generated RTS (negated if the receive FIFO fill level is greater than a programmable threshold of 8, 11, 13 or 15 bytes), and only transmits data when the incoming CTS is asserted. Software can read characters, one byte at a time, from the Receive FIFO and can also write to the Transmit FIFO, one byte at a time. The Transmit and Receive FIFOs can be cleared and reset independently of each other. The status of the Transmit FIFO can be checked to see if it is empty, and if there is a character being transmitted. The status of the Receive FIFO can also be checked, indicating if conditions such as parity error, framing error or break indication have occurred. It also shows if an overrun error occurred (receive buffer full and another character arrives) and if there is data held in the receive FIFO. UART0 and UART1 can both be configured to use standard or alternative DIO lines, as shown in Table 5. Additionally, UART0 can be configured to be used in 2-wire mode (where CTS0 and RTS0 are not configured), and UART1 can be configured in 1-wire mode (where RXD1 is not configured). These freed up DIO pins can then be used for other purposes. Signal DIO Assignment Standard pins Alternative pins CTS0 DIO4 DIO12 RTS0 DIO5 DIO13 TXD0 DIO6 DIO14 RXD0 DIO7 DIO15 TXD1 DIO14 DIO11 RXD1 DIO15 DIO9 Table 6: UART IO . Note: With the automatic flow control threshold set to 15, the hardware flow control within the UART’s block negates RTS when they receive FIFO that is about to become full. In some instances it has been observed that remote devices that are transmitting data do not respond quickly enough to the de-asserted CTS and continue to transmit data. In these instances the data will be lost in a receive FIFO overflow. 13.1 Interrupts Interrupt generation can be controlled for the UART’s block, and is divided into four categories: • Received Data Available: Is set when data in the Rx FIFO queue reaches a particular level (the trigger level can be configured as 1, 4, 8 or 14) or if no character has been received for 4 character times. • Transmit FIFO Empty: set when the last character from the Tx FIFO is read and starts to be transmitted. • Receiver Line Status: set when one of the following occur (1) Parity Error - the character at the head of the receive FIFO has been received with a parity error, (2) Overrun Error - the Rx FIFO is full and another character has been received at the Receiver shift register, (3) Framing Error - the character at the head of the receive FIFO does not have a valid stop bit and (4) Break Interrupt – occurs when the RxD line has been held low for an entire character. • Modem Status: Generated when the CTS (Clear To Send) input control line changes. 13.2 UART Application The following example shows the UART0 connected to a 9-pin connector compatible with a PC. As the JN516x device pins do not provide the RS232 line voltage, a level shifter is used.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 47 JN516x RTS CTS TXD RXD UART0 RS232 Level Shifter 1 2 3 4 5 6 7 8 9 CD RD TD DTR SG DSR RTS CTS RI PC COM Port 1 5 Pin Signal 6 9 Figure 33: JN516x Serial Communication Link48 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 14 JTAG Test Interface The JN516x includes an IEEE1149.1 compliant JTAG port for the purpose of manufacturing test. The software debugger is not supported with this product. The JTAG interface does not support boundary scan testing. It is recommended that the JN516x is not connected as part of the board scan chain.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 49 15 Two-Wire Serial Interface (I2 C) The JN516x includes industry standard I 2 C two-wire synchronous Serial Interface operates as a Master (MSIF) or Slave (SSIF) that provides a simple and efficient method of data exchange between devices. The system uses a serial data line (SIF_D) and a serial clock line (SIF_CLK) to perform bi-directional data transfers and includes the following features: Common to both master and slave: • Compatible with both I2 C and SMbus peripherals • Support for 7 and 10-bit addressing modes • Optional pulse suppression on signal inputs (60ns guaranteed, 125ns typical) Master only: • Multi-master operation • Software programmable clock frequency • Supports Slave clock stretching • Software programmable acknowledge bit • Interrupt or bit-polling driven byte-by-byte data-transfers • Bus busy detection Slave only: • Programmable slave address • Simple byte level transfer protocol • Write data flow control using acknowledge mechanism • Read data flow control using clock stretching • Read data preloaded or provided as required The Serial Interface is accessed, depending upon the configuration, DIO14 and DIO15 or DIO16 and DIO17. This is enabled under software control. The following table details which DIO are used for the Serial Interface depending upon the configuration. Signal DIO Assignment Standard pins Alternative pins SIF_CLK DIO14 DIO16 SIF_D DIO15 DIO17 Table 7: Two-Wire Serial Interface IO 15.1 Connecting Devices The clock and data lines, SIF_D and SIF_CLK, are alternate functions of DIO15 and DIO14 respectively. The serial interface function of these pins is selected when the interface is enabled. They are both bi-directional lines, connected internally to the positive supply voltage via weak (50kΩ) programmable pull-up resistors. However, it is recommended that external 4.7kΩ pull-ups be used for reliable operation at high bus speeds, as shown in Figure 34. When the bus is free, both lines are HIGH. The output stages of devices connected to the bus must have an opendrain or open-collector in order to perform the wired-AND function. The number of devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. As this is an optional interface with two alternate positions, the DIO cells have not been customised for I 2 C operation. In particular, note that there are ESD diodes to the nominal 3 volt supply (VDD2) from the SIF_CLK and SIF_D pins. Therefore, if the VDD supply is removed from the JN5168 and this then discharges to ground, a path would exist that could pull down the bus lines (see 2.2.6).50 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 SIF_CLK SIF_D VDD D1_OUT D1_I N CLK1_I N CLK1_OUT D2_I N CLK2_I N CLK2_OUT DEVICE 1 DEVICE 2 RP RP Pullup Resistors D2_OUT JN516x SI F DIO14 DIO15 Figure 34: Connection Details 15.2 Clock Stretching Slave devices can use clock stretching to slow down the read transfer bit rate. After the master has driven SIF_CLK low, the slave can drive SIF_CLK low for the required period and then release it. If the slave’s SIF_CLK low period is greater than the master’s low period the resulting SIF_CLK bus signal low period is stretched thus inserting wait states – see section 15.4 for further details. SIF_CLK SIF_CLK SIF_CLK Master SIF_CLK Slave SIF_CLK Wired-AND SIF_CLK Clock held low by Slave Figure 35: Clock Stretching 15.3 Master Two-wire Serial Interface When operating as a master device, it provides the clock signal and a prescale register determines the clock rate, allowing operation up to 400kbit/s. Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for indicating when start, stop, read, write and acknowledge control should be generated. Write data written into a transmit buffer will be written out across the two-wire interface when indicated, and read data received on the interface is made available in a receive buffer. Indication of when a particular transfer has completed may be indicated by means of an interrupt or by polling a status bit. The first byte of data transferred by the device after a start bit is the slave address. The JN516x supports both 7-bit and 10-bit slave addresses by generating either one or two address transfers. Only the slave with a matching address will respond by returning an acknowledge bit. The master interface provides a true multi-master bus including collision detection and arbitration that prevents data corruption. If two or more masters simultaneously try to control the bus, a clock synchronization procedure determines the bus clock. Because of the wired-AND connection of the interface, a high-to-low transition on the bus affects all connected devices. This means a high-to-low transition on the SIF_CLK line causes all concerned devices to count off their low period. Once the clock input of a device has gone low, it will hold the SIF_CLK line in that state until the clock high state is reached when it releases the SIF_CLK line. Due to the wired-AND connection, the SIF_CLK line will therefore be held low by the device with the longest low period, and held high by the device with the shortest high period.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 51 SIF_CLK1 SIF_CLK2 SIF_CLK Master1 SIF_CLK Master2 SIF_CLK Wired-AND SIF_CLK Start counting low period Start counting high period Wait State Figure 36: Multi-Master Clock Synchronisation After each transfer has completed, the status of the device must be checked to ensure that the data has been acknowledged correctly, and that there has been no loss of arbitration. (N.B. Loss of arbitration may occur at any point during the transfer, including data cycles). An interrupt will be generated when arbitration has been lost.52 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 15.4 Slave Two-wire Serial Interface When operating as a slave device, the interface does not provide a clock signal, although it may drive the clock signal low if it is required to apply clock stretching during read transfers. Only transfers whose address matches the value programmed into the interface’s address register are accepted. The interface allows both 7 and 10 bit addresses to be programmed, but only responds with an acknowledge to a single address. Addresses defined as “reserved” will not be responded to, and should not be programmed into the address register. A list of reserved addresses is shown in Table 8. Address Name Behaviour 0000 000 General Call/Start Byte Ignored 0000 001 CBUS address Ignored 0000 010 Reserved Ignored 0000 011 Reserved Ignored 0000 1XX Hs-mode master code Ignored 1111 1XX Reserved Ignored 1111 0XX 10-bit address Only responded to if 10 bit address set in address register Table 8 : List of two-wire serial interface reserved addresses Data transfer is controlled from the processor bus interface at a byte level, with the processor responsible for taking write data from a receive buffer and providing read data to a transmit buffer when indicated. A series of interrupt status bits are provided to control the flow of data. For writes, in to the slave interface, it is important that data is taken from the receive buffer by the processor before the next byte of data arrives. To enable this, the interface returns a Not Acknowledge (NACK) to the master if more data is received before the previous data has been taken. This will lead to the termination of the current data transfer. For reads, from the slave interface, the data may be preloaded into the transmit buffer when it is empty (i.e. at the start of day, or when the last data has been read), or fetched each time a read transfer is requested. When using data preload, read data in the buffer must be replenished following a data write, as the transmit and received data is contained in a shared buffer. The interface will hold the bus using clock stretching when the transmit buffer is empty. Interrupts may be triggered when: • Data Buffer read data is required – a byte of data to be read should be provided to avoid the interface from clock stretching • Data Buffer read data has been taken – this indicates when the next data may be preloaded into the data buffer • Data Buffer write data is available – a byte of data should be taken from the data buffer to avoid data backoff as defined above • The last data in a transfer has completed – i.e. the end of a burst of data, when a Stop or Restart is seen • A protocol error has been spotted on the interface© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 53 16 Random Number Generator A random number generator is provided which creates a 16-bit random number each time it is invoked. Consecutive calls can be made to build up any length of random number required. Each call takes approximately 0.25msec to complete. Alternatively, continuous generation mode can be used where a new number is generated approximately every 0.25msec. In either mode of operation an interrupt can be generated to indicate when the number is available, or a status bit can be polled. The random bits are generated by sampling the state of the 32MHz clock every 32kHz system clock edge. As these clocks are asynchronous to each other, each sampled bit is unpredictable and hence random.54 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 17 Analogue Peripherals The JN516x contains a number of analogue peripherals allowing the direct connection of a wide range of external sensors and switches. ADC Supply Voltage (VDD1) COMP1M (DIO17) Comparator 1 COMP1P (DIO16) ADC1 VREF/ADC2 ADC3 (DIO0) ADC4 (DIO1) Vref Internal Reference Vref Select Chip Boundary Temp Sensor Figure 37: Analogue Peripherals In order to provide good isolation from digital noise, the analogue peripherals and radio are powered by the radio regulator, which is supplied from the analogue supply VDD1 and referenced to analogue ground VSSA. A reference signal Vref for the ADC can be selected between an internal bandgap reference or an external voltage reference supplied to the VREF pin. ADC input 2 cannot be used if an external reference is required, as this uses the same pin as VREF. Note also that ADC3 and ADC4 use the same pins as DIO0 and DIO1 respectively. These pins can only be used for the ADC if they are not required for any of their alternative functions. Similarly, the comparator inputs are shared with DIO16 and DIO17. If used for their analogue functions, these DIOs must be put into a passive state by setting them to Inputs with their pull-ups disabled. The ADC is clocked from a common clock source derived from the 16MHz clock. 17.1 Analogue to Digital Converter The 10-bit analogue to digital converter (ADC) uses a successive approximation design to perform high accuracy conversions as typically required in wireless sensor network applications. It has six multiplexed single-ended input channels: four available externally, one connected to an internal temperature sensor, and one connected to an internal supply monitoring circuit.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 55 17.1.1 Operation The input range of the ADC can be set between 0V to either the reference voltage or twice the reference voltage. The reference can be either taken from the internal voltage reference or from the external voltage applied to the VREF pin. For example, an external reference of 1.2V supplied to VREF may be used to set the ADC range between 0V and 2.4V. VREF Gain Setting Maximum Input Range Supply Voltage Range (VDD) 1.2V 1.6V 1.2V 1.6V 0 0 1 1 1.2V 1.6V 2.4V 3.2V 2.2V - 3.6V 2.2V - 3.6V 2.6V - 3.6V 3.4V - 3.6V Table 9: ADC Maximum Input Range The input clock to the ADC is 16MHz and can be divided down to 2MHz, 1MHz, 500kHz and 250kHz. During an ADC conversion the selected input channel is sampled for a fixed period and then held. This sampling period is defined as a number of ADC clock periods and can be programmed to 2, 4, 6 or 8. The conversion rate is ((3 x Sample period) + 13) clock periods. For example for 500kHz conversion with sample period of 2 will be (3 x 2) + 13 = 19 clock periods, 38µsecs or 26.32kHz. The ADC can be operated in either a single conversion mode or alternatively a new conversion can be started as soon as the previous one has completed, to give continuous conversions. If the source resistance of the input voltage is 1kΩ or less, then the default sampling time of 2 clocks should be used. The input to the ADC can be modelled as a resistor of 5kΩ(typ) and 10kΩ (max) to represent the on-resistance of the switches and the sampling capacitor 8pF. The sampling time required can then be calculated, by adding the sensor source resistance to the switch resistance, multiplying by the capacitance giving a time constant. Assuming normal exponential RC charging, the number of time constants required to give an acceptable error can be calculated, 7 time constants gives an error of 0.091%, so for 10-bit accuracy 7 time constants should be the target. For a source with zero resistance, 7 time constants is 640 nsecs, hence the smallest sampling window of 2 clock periods can be used. ADC pin 5 K 8 pF Sample Switch ADC front end Figure 38: ADC Input Equivalent Circuit The ADC sampling period, input range and mode (single shot or continuous) are controlled through software. When the ADC conversion is complete, an interrupt is generated. Alternatively the conversion status can be polled. When operating in continuous mode, it is recommended that the interrupt is used to signal the end of a conversion, since conversion times may range from 9.5 to 148 µsecs. Polling over this period would be wasteful of processor bandwidth. To facilitate averaging of the ADC values, which is a common practice in microcontrollers, a dedicated accumulator has been added, the user can define the accumulation to occur over 2,4,8 or 16 samples. The end of conversion interrupt can be modified to occur at the end of the chosen accumulation period, alternatively polling can still be used. Software can then be used to apply the appropriate rounding and shifting to generate the average value, as well as setting up the accumulation function. For detailed electrical specifications, see Section 19.3.7.56 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 17.1.2 Supply Monitor The internal supply monitor allows the voltage on the analogue supply pin VDD1 to be measured. This is achieved with a potential divider that reduces the voltage by a factor of 0.666, allowing it to fall inside the input range of the ADC when set with an input range twice the internal voltage reference. The resistor chain that performs the voltage reduction is disabled until the measurement is made to avoid a continuous drain on the supply. 17.1.3 Temperature Sensor The on chip temperature sensor can be used either to provide an absolute measure of the device temperature or to detect changes in the ambient temperature. In common with most on chip temperature sensors, it is not trimmed and so the absolute accuracy variation is large; the user may wish to calibrate the sensor prior to use. The sensor forces a constant current through a forward biased diode to provide a voltage output proportional to the chip die temperature which can then be measured using the ADC. The measured voltage has a linear relationship to temperature as described in Section 19.3.13. Because this sensor is on chip, any measurements taken must account for the thermal time constants. For example, if the device just came out of sleep mode the user application should wait until the temperature has stabilised before taking a measurement. 17.1.4 ADC Sample Buffer Mode In this mode, the ADC operates in conjunction with a DMA (Direct Memory Access) engine as follows: • ADC sampling is triggered at a configurable rate using one of the on-chip Timers (Timer 0, 1, 2, 3 or 4) • ADC samples are automatically stored in a buffer located in RAM using a DMA mechanism • ADC inputs may be multiplexed between different analogue sources The 10-bit ADC data samples are transferred into the buffer in RAM as 16-bit words. The maximum number of 16-bit words that may allocated in RAM for ADC sample storage is 2047. The buffer may be configured to automatically wrap around to the start when full. Interrupts may be configured to indicate when the buffer is half-full, full and has overflowed. The CPU may perform other tasks while the data transfer and storage is being managed independently by the DMA engine - the CPU only needs to configure the ADC sample buffer mode and deal with the stored samples in the buffer when an interrupt occurs. ADC sample buffer mode allows up to six analogue inputs to be multiplexed in combination. These inputs comprise four external inputs (ADC1-4, corresponding to IO pins), an on-chip temperature sensor and an internal voltage monitor. Samples from all the selected inputs will be produced on each timer trigger and stored in consecutive RAM locations. 17.2 Comparator The JN516x contains one analogue comparator, COMP1, that is designed to have true rail-to-rail inputs and operate over the full voltage range of the analogue supply VDD1. The hysteresis level can be set to a nominal value of 0mV, 10mV, 20mV or 40mV. The source of the negative input signal for the comparator can be set to the internal voltage reference, the negative external pin (COMP1M, which uses the same pin as DIO17) or the positive external pin (COMP1P, on the same pin as DIO16). The source of the positive input signal can be COMP1P or COMP1M. DIO16 and DIO17 cannot be used if the external comparator inputs are needed. The comparator output is routed to an internal register and can be polled, or can be used to generate interrupts. The comparator can be disabled to reduce power consumption. DIO16 and DIO17 should be set to inputs with pull-ups disabled, when using the comparator. The comparator also has a low power mode where the response time of the comparator is slower than the normal mode, but the current required is greatly reduced. These figures are specified in Section 19.3.8. It is the only mode that may be used during sleep, where a transition of the comparator output will wake the device. The wakeup action and the configuration for which edge of the comparator output will be active are controlled through software. In sleep mode the negative input signal source must be configured to be driven from the external pins.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 57 18 Power Management and Sleep Modes 18.1 Operating Modes Three operating modes are provided in the JN516x that enable the system power consumption to be controlled carefully to maximise battery life. • Active Processing Mode • Sleep Mode • Deep Sleep Mode The variation in power consumption of the three modes is a result of having a series of power domains within the chip that may be controllably powered on or off. 18.1.1 Power Domains The JN516x has the following power domains: • VDD Supply Domain: supplies the wake-up timers and controller, DIO blocks, Comparator, SVM and BOR plus Fast RC, 32kHz RC and crystal oscillators. This domain is driven from the external supply (battery) and is always powered. The wake-up timers and controller, and the 32kHz RC and crystal oscillators may be powered on or off in sleep mode through software control. • Digital Logic Domain: supplies the digital peripherals, CPU, Flash, RAM when in Active Processing Mode, Baseband controller, Modem and Encryption processor. It is powered off during sleep mode. • RAM Domain: supplies the RAM when in Active Processing Mode. Also supplies the Ram during sleep mode to retain the memory contents. It may be powered on or off for sleep mode through software control. • Radio Domain: supplies the radio interface, ADCs and temperature sensor. It is powered during transmit and receive and when the analogue peripherals are enabled. It is controlled by the baseband processor and is powered off during sleep mode. The current consumption figures for the different modes of operation of the device is given in Section 19.2.2. 18.2 Active Processing Mode Active processing mode in the JN516x is where all of the application processing takes place. By default, the CPU will execute at the selected clock speed executing application firmware. All of the peripherals are available to the application, as are options to actively enable or disable them to control power consumption; see specific peripheral sections for details. Whilst in Active processing mode there is the option to doze the CPU but keep the rest of the chip active; this is particularly useful for radio transmit and receive operations, where the CPU operation is not required therefore saving power. 18.2.1 CPU Doze Whilst in doze mode, CPU operation is stopped but the chip remains powered and the digital peripherals continue to run. Doze mode is entered through software and is terminated by any interrupt request. Once the interrupt service routine has been executed, normal program execution resumes. Doze mode uses more power than sleep and deep sleep modes but requires less time to restart and can therefore be used as a low power alternative to an idle loop. Whilst in CPU doze the current associated with the CPU is not consumed, therefore the basic device current is reduced as shown in the figures in Section 19.2.2.1. 18.3 Sleep Mode The JN516x enters sleep mode through software control. In this mode most of the internal chip functions are shutdown to save power, however the state of DIO pins are retained, including the output values and pull-up enables, and this therefore preserves any interface to the outside world. 58 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 When entering into sleep mode, there is an option to retain the RAM contents throughout the sleep period. If the wakeup timers are not to be used for a wakeup event and the application does not require them to run continually, then power can be saved by switching off the 32kHz oscillator if selected as the 32kHz system clock through software control. The oscillator will be restarted when a wakeup event occurs. Whilst in sleep mode one of four possible events can cause a wakeup to occur: transitions on DIO inputs, expiry of wakeup timers, pulse counters maturing or comparator events. If any of these events occur, and the relevant interrupt is enabled, then an interrupt is generated that will cause a wakeup from sleep. It is possible for multiple wakeup sources to trigger an event at the same instant and only one of them will be accountable for the wakeup period. It is therefore necessary in software to remove all other pending wakeup events prior to requesting entry back into sleep mode; otherwise, the device will re-awaken immediately. When wakeup occurs, a similar sequence of events to the reset process described in Section 6.1 happens, including the checking of the supply voltage by the Supply Voltage Monitor 6.4. The High-Speed RC oscillator is started up, once stable the power to CPU system is enabled and the reset is removed. Software determines that this is a reset from sleep and so commences with the wakeup process. If RAM contents were held through sleep, wakeup is quicker as the software does not have to initialise RAM contents meaning the application can recommence more quickly. See Section 19.3.5 for wake-up timings. 18.3.1 Wakeup Timer Event The JN516x contains two 41-bit wakeup timers that are counters clocked from the 32kHz oscillator, and can be programmed to generate a wake-up event. Following a wakeup event, the timers continue to run. These timers are described in Section 11.3. Timer events can be generated from both of the two timers; one is intended for use by the 802.15.4 protocol, the other being available for use by the Application running on the CPU. These timers are available to run at any time, even during sleep mode. 18.3.2 DIO Event Any DIO pin when used as an input has the capability, by detecting a transition, to generate a wake-up event. Once this feature has been enabled the type of transition can be specified (rising or falling edge). Even when groups of DIO lines are configured as alternative functions such as the UARTs or Timers etc, any input line in the group can still be used to provide a wakeup event. This means that an external device communicating over the UART can wakeup a sleeping device by asserting its RTS signal pin (which is the CTS input of the JN516x). 18.3.3 Comparator Event The comparator can generate a wakeup interrupt when a change in the relative levels of the positive and negative inputs occurs. The ability to wakeup when continuously monitoring analogue signals is useful in ultra-low power applications. For example, the JN516x can remain in sleep mode until the voltage drops below a threshold and then be woken up to deal with the alarm condition and the comparator has a low current mode to facilitate this. 18.3.4 Pulse Counter The JN516x contains two 16 bit pulse counters that can be programmed to generate a wake-up event. Following the wakeup event the counters will continue to operate and therefore no pulse will be missed during the wake-up process. These counters are described in Section 12.To minimize sleep current it is possible to disable the 32K RC oscillator and still use the pulse counters to cause a wake-up event, provided debounce mode is not required. 18.4 Deep Sleep Mode Deep sleep mode gives the lowest power consumption. All switchable power domains are off and most functions in the VDD supply power domain are stopped, including the 32kHz RC oscillator. However, the Brown-Out Reset remains active as well as all the DIO cells. This mode can be exited by a hardware reset on the RESETN pin, or an enabled DIO or comparator wakeup event. In all cases, the wakeup sequence is equivalent to a power-up sequence, with no knowledge retained from the previous time the device was awake.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 59 19 Electrical Characteristics 19.1 Maximum Ratings Exceeding these conditions may result in damage to the device. Parameter Min Max Device supply voltage VDD1, VDD2 -0.3V 3.6V Supply voltage at voltage regulator bypass pins VB_xxx -0.3V 1.98V Voltage on analogue pins XTALOUT, XTALIN, VCOTUNE, RF_IN. -0.3V VB_xxx + 0.3V Voltage on analogue pins VREF, ADC1, IBIAS -0.3V VDD1 + 0.3V Voltage on any digital pin -0.3V VDD2 + 0.3V Storage temperature -40ºC 150ºC Reflow soldering temperature according to IPC/JEDEC J-STD-020C 260ºC ESD rating Human Body Model 1 2.0kV Charged Device Model 2 500V 1) Testing for Human Body Model discharge is performed as specified in JEDEC Standard JESD22-A114. 2) Testing for Charged Device Model discharge is performed as specified in JEDEC Standard JESD22-C101. 19.2 DC Electrical Characteristics 19.2.1 Operating Conditions Supply Min Max VDD1, VDD2 2.0V 3.6V Standard Ambient temperature range -40ºC 85ºC Extended Ambient temperature range -40ºC 125ºC In the following sections typical is defined as 25ºC and VDD1,2 = 3V Most parameter values cover the extended temperature range up to 125 ºC, where this is not the case, two values are given, the value in italics type face is for standard temperature range up to 85ºC and the value in bold is for the extended range.60 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 19.2.2 DC Current Consumption VDD = 2.0 to 3.6V, -40 to +125º C 19.2.2.1 Active Processing Mode: Min Typ Max Unit Notes CPU processing 32,16,8,4,2 or 1MHz 1700 + 205/MHz µA GPIOs enabled. When in CPU doze the current related to CPU speed is not consumed. Radio transmit 15.3 mA CPU in software doze – radio transmitting Radio receive 17.0 mA CPU in software doze – radio in receive mode The following current figures should be added to those above if the feature is being used ADC 550 µA Temperature sensor and battery measurements require ADC Comparator 73/0.8 µA Normal/low-power UART 60 µA For each UART Timer 21 µA For each Timer 2-wire serial interface (I2 C) 46 µA 19.2.2.2 Sleep Mode Mode: Min Typ Max Unit Notes Sleep mode with I/O wakeup 0.12 µA Waiting on I/O event Sleep mode with I/O and RC Oscillator timer wakeup – measured at 25ºC 0.64 µA As above, but also waiting on timer event. If both wakeup timers are enabled then add another 0.05µA 32kHz crystal oscillator 1.4 µA As alternative sleep timer The following current figures should be added to those above if the feature is being used RAM retention– measured at 25ºC 0.9 µA Comparator (low-power mode) 0.8 µA Reduced response time 19.2.2.3 Deep Sleep Mode Mode: Min Typ Max Unit Notes Deep sleep mode– measured at 25ºC 100 nA Waiting on chip RESET or I/O event© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 61 19.2.3 I/O Characteristics VDD = 2.0 to 3.6V, -40 to +125º C, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Internal DIO pullup resistors 40 50 60 kΩ Internal RESETN pullup resistor 267 325 455 605 410 500 700 930 615. 636 750, 775 1050, 1085 1395, 1441 kΩ VDD2 = 3.6V VDD2 = 3.0V VDD2 = 2.2V VDD2 = 2.0V Digital I/O High Input VDD2 x 0.7 VDD2 V Digital I/O low Input -0.3 VDD2 x 0.27 V Digital I/O input hysteresis 200 310 400 mV DIO High O/P (2.7-3.6V) VDD2 x 0.8 VDD2 V With 4mA load DIO Low O/P (2.7-3.6V) 0 0.4 V With 4mA load DIO High O/P (2.2-2.7V) VDD2 x 0.8 VDD2 V With 3mA load DIO Low O/P (2.2-2.7V) 0 0.4 V With 3mA load DIO High O/P (2.0-2.2V) VDD2 x 0.8 VDD2 V With 2.5mA load DIO Low O/P (2.0-2.2V) 0 0.4 V With 2.5mA load Current sink/source capability 4 3 2.5 mA VDD2 = 2.7V to 3.6V VDD2 = 2.2V to 2.7V VDD2 = 2.0V to 2.2V IIL - Input Leakage Current 20, 30 nA Vcc = 3.6V, pin low IIH - Input Leakage Current 20, 60 nA Vcc = 3.6V, pin high 19.3 AC Characteristics 19.3.1 Reset and Supply Voltage Monitor Internal RESET VDD VPOT t STAB Figure 39: Internal Power-on Reset without Showing Brown-Out62 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Internal RESET RESETN VRST t STAB t RST Figure 40: Externally Applied Reset VDD = 2.0 to 3.6V, -40 to +125º C Parameter Min Typ Max Unit Notes External Reset pulse width to initiate reset sequence (tRST) 1 µs Assumes internal pullup resistor value of 100K worst case and ~5pF external capacitance External Reset threshold voltage (VRST) VDD2 x 0.7 V Minimum voltage to avoid being reset Internal Power-on Reset threshold voltage (VPOT) Rise/fall time > 10mS 1.44 1.41 V Rising Falling Spike Rejection Square wave pulse 1us Triangular wave pulse 10us 1.2 1.3 V Depth of pulse to trigger reset Reset stabilisation time (tSTAB) 180 µs Note 1 Chip current when held in reset (IRESET) 6 uA Brown-Out Reset Current Consumption 80 nA Supply Voltage Monitor Threshold Voltage (VTH) 1.86 1.92 2.02 2.11 2.21 2.30 2.59 2.88 1.94 2.00 2.10 2.20 2.30 2.40 2.70 3.00 2.00 2.06 2.16 2.27 2.37 2.47 2.78 3.09 V Configurable threshold with 8 levels Supply Voltage Monitor Hysteresis (VHYS) 37 38 45 52 58 65 82 100 mV Corresponding to the 8 threshold levels 1 Time from release of reset to start of executing of bootloader code from internal flash. An extra 15us is incurred if the BOR circuit has been activated (e.g., if the supply voltage has been ramped up from 0V)".© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 63 VTH + VHYS VTH DVDD Internal BORest Internal SVM VPOT Figure 41 Brown-out Reset Followed By Supply Voltage Montior trigger 19.3.2 SPI Master Timing t t SSH SSS t CK t SI t HI MOSI (mode=1,3) SS MOSI (mode=0,2) MISO (mode=0,2) MISO (mode=1,3) t VO t VO CLK (mode=0,1) t SI t HI CLK (mode=2,3) Figure 42: SPI Master Timing Parameter Symbol Min Max Unit Clock period tCK 62.5 - ns Data setup time tSI 16.7 @ 3.3V 18.2 @ 2.7V 21.0 @ 2.0V - ns Data hold time tHI 0 ns Data invalid period tVO - 15 ns Select set-up period tSSS 60 - ns Select hold period tSSH 30 (SPICLK = 16MHz) 0 (SPICLK<16MHz, mode=0 or 2) 60 (SPICLK<16MHz, mode=1 or 3) - ns64 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 19.3.3 SPI Slave Timing Parameter Symbol Min Max Unit Clock period tCK 125 - ns Idle time tIDLE 125 - ns Data input setup time tSI 10 - ns Data input hold time tHI 10 - ns Data output invalid period from SPISCLK falling edge tCKVO - 30 ns Data output invalid period from SPISSEL falling edge tSELVO 30 ns Delay from SPISSEL falling edge to SPISCLK rising edge tSELA 30 - ns Delay from SPISCLK falling edge to SPISSEL rising edge tSELN 30 - ns … … SPISCLK SPISSEL SPISMOSI SPISMISO … … t tSELN IDLE tSI tHI tSELA tCK tSELVO tCKVO Figure 43: SPI Slave Timing© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 65 19.3.4 Two-wire Serial Interface t BUF S Sr P S t LOW t HD;STA t F t R t HD;DAT t HIGH t SU;DAT t SU;STA t HD;STA t SU;STO t SP t R t F SIF_D SIF_CLK Figure 44: Two-wire Serial Interface Timing Parameter Symbol Standard Mode Fast Mode Unit Min Max Min Max SIF_CLK clock frequency fSCL 0 100 0 400 kHz Hold time (repeated) START condition. After this period, the first clock pulse is generated tHD:STA 4 - 0.6 - µs LOW period of the SIF_CLK clock tLOW 4.7 - 1.3 - µs HIGH period of the SIF_CLK clock tHIGH 4 - 0.6 - µs Set-up time for repeated START condition tSU:STA 4.7 - 0.6 - µs Data setup time SIF_D tSU:DAT 0.25 - 0.1 - µs Rise Time SIF_D and SIF_CLK tR - 1000 20+0.1Cb 300 ns Fall Time SIF_D and SIF_CLK tF - 300 20+0.1Cb 300 ns Set-up time for STOP condition tSU:STO 4 - 0.6 - µs Bus free time between a STOP and START condition tBUF 4.7 - 1.3 - µs Pulse width of spikes that will be suppressed by input filters (Note 1) tSP - 60 - 60 ns Capacitive load for each bus line Cb - 400 - 400 pF Noise margin at the LOW level for each connected device (including hysteresis) Vnl 0.1VDD - 0.1VDD - V Noise margin at the HIGH level for each connected device (including hysteresis) Vnh 0.2VDD - 0.2VDD - V Note 1: This figure indicates the pulse width that is guaranteed to be suppressed. Pulse with widths up to 125nsec may also get suppressed. 19.3.5 Wakeup Timings Parameter Min Typ Max Unit Notes Time for crystal to stabilise ready to run CPU 0.74 ms Reached oscillator amplitude threshold. Default bias current Time for crystal to stabilise ready for radio activity 1.0 ms Wake up from Deep Sleep or from Sleep 170 µs Time to CPU release Start-up time from reset RESETN pin, BOR or SVM 180 µs Time to CPU release Wake up from CPU Doze mode 0.2 µs 66 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 19.3.6 Bandgap Reference VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Voltage 1.198 1.235 1.260 V DC power supply rejection 58 dB at 25ºC Temperature coefficient +40 +135 +65 +93 ppm/ºC 20 to 85ºC -40ºC to 20ºC 20 to 125 ºC -40ºC to 85ºC Point of inflexion +80 ºC 19.3.7 Analogue to Digital Converters VDD = 3.0V, VREF = 1.2V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Resolution 10 bits 500kHz Clock Current consumption 550 µA Integral nonlinearity ± 1.6, 1.8 LSB Differential nonlinearity -0.5 +0.5 LSB Guaranteed monotonic Offset error -10 -20 mV 0 to Vref range 0 to 2Vref range Gain error +10 +20 mV 0 to Vref range 0 to 2Vref range Internal clock 0.25,0.5 or 1.0 MHz 16MHz input clock, ÷16,32or 64 No. internal clock periods to sample input 2, 4, 6 or 8 Programmable Conversion time 9.5 148 µs Programmable Input voltage range 0.04 Vref or 2*Vref V Switchable. Refer to 17.1.1 Vref (Internal) See Section 19.3.6 Vref (External) 1.15 1.2 1.6 V Allowable range into VREF pin Input capacitance 8 pF In series with 5K ohms© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 67 19.3.8 Comparator VDD = 2.0 to 3.6V -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Analogue response time (normal) 90 125,130 ns +/- 250mV overdrive 10pF load Total response time (normal) including delay to Interrupt controller 125 + 125,130 ns Digital delay can be up to a max. of two 16MHz clock periods Analogue response time (low power) 2.2 2.8 µs +/- 250mV overdrive No digital delay Hysteresis 7 14 28 10 20 40 16, 17 28, 30 53, 57 mV Programmable in 3 steps and zero Vref (Internal) See Section 19.3.6 V Common Mode input range 0 Vdd V Current (normal mode) 56 73 96, 100 µA Current (low power mode) 0.8 1.0, 1.1 µA 19.3.9 32kHz RC Oscillator VDD = 2.0 to 3.6V, -40 to +125 ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Current consumption of cell and counter logic (default) 590 520 465 720, 800 660, 740 600, 650 nA 3.6V 3.0V 2.0V Current consumption of cell and counter logic (low power) 465 375 290 500,550 425,460 330,370 nA 3.6V 3.0V 2.0V 32kHz clock un-calibrated accuracy -10% 32kHz +40% Without temperature & voltage variation (note1) Calibrated 32kHz accuracy (default) Low power ±300 ±600 ppm For a 1 second sleep period calibrating over 20 x 32kHz clock periods Variation with temperature -0.010 -0.020 %/°C Default Low power Variation with VDD2 -3.0 %/V Note1: Measured at 3v and 25 deg C 68 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 19.3.10 32kHz Crystal Oscillator VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Current consumption of cell and counter logic 1.4 1.75, 2.0 µA This is sensitive to the ESR of the crystal, Vdd and total capacitance at each pin Start – up time 0.6 s Assuming xtal with ESR of less than 40kohms and CL= 9pF External caps = 15pF (Vdd/2mV pk-pk) see Appendix B Input capacitance 1.4 pF Bondpad and package Transconductance 18.5 µA/V External Capacitors (CL=9pF) 15 pF Total external capacitance needs to be 2*CL, allowing for stray capacitance from chip, package and PCB Amplitude at Xout Vdd-0.2 Vp-p 19.3.11 32MHz Crystal Oscillator VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Current consumption 300 375 450, 500 µA Excluding bandgap ref. Start – up time 0.74 ms Assuming xtal with ESR of less than 40ohms and CL= 9pF External caps = 15pF see Appendix B Input capacitance 1.4 pF Bondpad and package Transconductance 3.65, 3.55 4.30 5.16 mA/V DC voltages, XTALIN/XTALOUT 390/432 375/412 425/472 470/527 mV External Capacitors (CL=9pF) 15 pF Total external capacitance needs to be 2*CL, allowing for stray capacitance from chip, package and PCB Amplitude detect threshold 320 mVp-p Threshold detection accessible via API© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 69 19.3.12 High-Speed RC Oscillator VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Current consumption of cell 81 145 250, 275 µA Clock native accuracy -16% +18% Un-calibrated frequency 26.1 MHz Calibrated centre frequency accuracy -1.6% 32.1 +1.6% MHz Without temperature & voltage variation Calibrated centre frequency accuracy -4% 32.1 +5% MHz Including temperature & voltage variation Variation with temperature -0.024, -0.015 +0.009, +0.006 %/°C Variation with VDD2 -0.25 +0.25 +0.5, +0.6 %/V Startup time 2.4 us 19.3.13 Temperature Sensor VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Operating Range -40 - 125 °C Sensor Gain -1.56 -1.66 -1.76 mV/°C Accuracy - - ±7 °C Non-linearity - - 2.0, 3.0 °C Output Voltage 610, 540 840 mV Includes absolute variation due to manufacturing & temp Typical Voltage 730 mV Typical at 3.0V 25°C Resolution 0.666 0.706 0.751 °C/LSB 0 to Vref ADC I/P Range 19.3.14 Non-Volatile Memory VDD = 2.0 to 3.6V, -40 to +125ºC, italic +85 ºC Bold +125 ºC Parameter Min Typ Max Unit Notes Flash endurance 10K 100/50K Cycle Program/erase Flash erase time 100 ms One or more sectors Flash programming time 1.0 ms 256 bytes EEPROM endurance 100K 1M/500K °C Program/erase (see 4.4 ) EEPROM erase time 1.8 ms One 64 bytes page EEPROM programming time 1.1 ms Between 1 & 64 bytes Retention time powered unpowered 10 20 Years Flash & EEPROM70 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 19.3.15 Radio Transceiver This JN516x meets all the requirements of the IEEE802.15.4 standard over 2.0 - 3.6V and offers the following improved RF characteristics. All RF characteristics are measured single ended. This part also meets the following regulatory body approvals, when used with NXP’s Module Reference Designs. Compliant with FCC part 15, rules, IC Canada, ETSI ETS 300-328 and Japan ARIB STD-T66 The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN516x failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application. Parameter Min Typical Max Notes RF Port Characteristics Type Single Ended Impedance 1 50ohm 2.4-2.5GHz Frequency range 2.400 GHz 2.485GHz ESD levels (pin 17) 2KV (HBM) 500v (CDM) 1) With external matching inductors and assuming PCB layout as in Appendix B.4.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 71 Radio Parameters: 2.0-3.6V, +25ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -92 -95 dBm Nominal for 1% PER, as per 802.15.4 Section 6.5.3.3 Maximum input signal +10 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 19/34 [27/49] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2/+2 ch) [CW Interferer] 40/44 [54/54] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 48 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 52 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -65 <-70 -60 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 40 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power +0.5 +2.5 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -40 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 3.0 4.5 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, Section 6.5.3.172 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Radio Parameters: 2.0-3.6V, -40ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -93.0 -96.0 dBm Nominal for 1% PER, as per 802.15.4 Section 6.5.3.3 Maximum input signal +10 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 19/34 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2/+2 ch) [CW Interferer] 40/44 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 47 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 49 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -64 <-70 -60 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 39 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power 0 +2.00 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -40 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 3.0 4.5 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, Section 6.5.3.1© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 73 Radio Parameters: 2.0-3.6V, +85ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -90 -93 dBm Nominal for 1% PER, as per 802.15.4 Section 6.5.3.3 Maximum input signal +10 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 19/34 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2/+2 ch) [CW Interferer] 40/44 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 49 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 53 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -66 <-70 -61 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 41 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power 0 +2.0 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -40 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 3.0 4.5 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, Section 6.5.3.174 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Radio Parameters: 2.0-3.6V, +125ºC Parameter Min Typical Max Unit Notes Receiver Characteristics Receive sensitivity -89 -92 dBm Nominal for 1% PER, as per 802.15.4 Section 6.5.3.3 Maximum input signal +5 dBm For 1% PER, measured as sensitivity Adjacent channel rejection (-1/+1 ch) [CW Interferer] 20/34 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Alternate channel rejection (-2/+2 ch) [CW Interferer] 40/44 [TBC] dBc For 1% PER, with wanted signal 3dB, above sensitivity. (Note1,2) (modulated interferer) Other in band rejection 2.4 to 2.4835 GHz, excluding adj channels 49 dBc For 1% PER with wanted signal 3dB above sensitivity. (Note1) Out of band rejection 53 dBc For 1% PER with wanted signal 3dB above sensitivity. All frequencies except wanted/2 which is 8dB lower. (Note1) Spurious emissions (RX) -66 <-70 -61 dBm Measured conducted into 50ohms 30MHz to 1GHz 1GHz to 12GHz Intermodulation protection 41 dB For 1% PER at with wanted signal 3dB above sensitivity. Modulated Interferers at 2 & 4 channel separation (Note1) RSSI linearity -4 +4 dB -95 to -10dBm. Available through Hardware API Transmitter Characteristics Transmit power -0.5 +1.5 dBm Output power control range -35 dB In three 12dB steps (Note3) Spurious emissions (TX) -40 <-70 <-70 dBm Measured conducted into 50ohms 30MHz to 1GHz, 1GHz to12.5GHz, The following exceptions apply 1.8 to 1.9GHz & 5.15 to 5.3GHz EVM [Offset] 3.0 4.5 % At maximum output power Transmit Power Spectral Density -38 -20 dBc At greater than 3.5MHz offset, as per 802.15.4, Section 6.5.3.1© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 75 Note1: Blocker rejection is defined as the value, when 1% PER is seen with the wanted signal 3dB above sensitivity, as per 802.15.4 Section 6.5.3.4 Note2: Channels 11,17,24 low/high values reversed. Note3: Up to an extra 2.5dB of attenuation is available if required.76 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Appendix A Mechanical and Ordering Information A.1 SOT618-1 HVQFN40 40-pin QFN Package Drawing Figure 45: 40-pin QFN Package Drawings UNIT A max. A1 b c D Dh E Eh e e1 e2 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 6.1 5.9 4.75 4.45 6.1 5.9 4.75 4.45 0.5 4.5 4.5 0.5 0.3 0.1 0.05 0.05 0.1 Table 10: Package Dimensions Plastic or metal protrusions of 0.075 mm maximum per side are not included.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 77 A.2 Footprint Information Information for reflow soldering. All dimensions are given in the table underneath and are in millimeters Solder land Solder land plus solder paste A B C D E F G Figure 46: PCB Decal The PCB schematic and layout rules detailed in Appendix B.4 must be followed. Failure to do so will likely result in the JN516x failing to meet the performance specification detailed herein and worst case may result in device not functioning in the end application. A B C D E F G 0.5 0.45 0.3 0.25 1.53x1.53 4.1x4.1 1.0x0.25 Table 11: Footprint Dimensions78 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 A.3 Ordering Information The standard qualification for the JN516x is extended industrial temperature range: -40ºC to +125ºC, packaged in a 40-pin QFN package. The device is available in two different reel quantities • Tape mounted 4000 devices on a 330mm reel • Tape mounted 1000 devices on a 180mm reel Order Codes: Part Number Ordering Code Description JN5161-001 JN5161/001 JN5161 microcontroller JN5164-001 JN5164/001 JN5164 microcontroller JN5168-001 JN5168/001 JN5168 microcontroller The Standard Supply Multiple (SSM) for Engineering Samples or Prototypes is 50 units with a maximum of 250 units. If the quantity of Engineering Samples or Prototypes ordered is less than a reel quantity, then these will be shipped in tape form only, with no reel and will not be dry packaged in a moisture sensitive environment. The SSM for Production status devices is one reel, all reels are dry packaged in a moisture barrier bag see A.5.3.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 79 A.4 Device Package Marking The diagram below shows the package markings for JN516x. The package on the left along with the legend information below it, shows the general format of package marking. The package on the right shows the specific markings for a JN5168 device, that came from assembly build number 01 and was manufactured week 25 of 2011. J N 5168 A XXXXXX XXXXFF XXXYWWXX J N 5168 A RUL 280 0 0 Y U 0 1 qSD 125 -X NXP NXP Figure 47: Device Package Marking Legend: JN Family part code XXXX 4 digit part number FF 2 digit assembly build number Y 1 digit year number WW 2 digit week number Ordering Code Part Marking JN5161/001 JN5161A JN5164/001 JN5164A JN5168/001 JN5168A80 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 A.5 Tape and Reel Information A.5.1 Tape Orientation and Dimensions The general orientation of the 40QFN package in the tape is as shown in Figure 48. Figure 48: Tape and Reel Orientation Figure 49 shows the detailed dimensions of the tape used for 6x6mm 40QFN devices. Reference Dimensions (mm) Ao 6.30 ±0.10 Bo 6.30 ±0.10 Ko 1.10 ±0.10 F 7.500 ±0.10 P1 12.0 ±0.10 W 16.00 +0.30/-0.3 (I) Measured from centreline of sprocket hole to centreline of pocket (II) Cumulative tolerance of 10 sprocket holes is ±0.20mm (III) Measured from centreline of sprocket hole to centreline of pocket (IV) Other material available Figure 49: Tape Dimensions© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 81 A.5.2 Reel Information: 180mm Reel Surface Resistivity Between 1x1010 – 1x1012 Ohms Square Material High Impact Polystyrene, environmentally friendly, recyclable All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres. 6 window design with one window on each side blanked to allow adequate labelling space. Figure 50: Reel Dimensions82 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 A.5.3 Reel Information: 330mm Reel Surface Resistivity Between 10e9 – 10e11 Ohms Square Material High Impact Polystyrene with Antistatic Additive All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres. 3 window design to allow adequate labelling space. Figure 51: 330mm Reel Dimensions A.5.4 Dry Pack Requirement for Moisture Sensitive Material Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 40 lead QFN package is MSL2A/260° C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at 67.5 grams of activated clay and a humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB has a moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 83 Appendix B Development Support B.1 Crystal Oscillators This Section covers some of the general background to crystal oscillators, to help the user make informed decisions concerning the choice of crystal and the associated capacitors. B.1.1 Crystal Equivalent Circuit Cs Lm Rm Cm C1 C2 Where Cm is the motional capacitance Lm is the motional inductance. This together with Cm defines the oscillation frequency (series) Rm is the equivalent series resistance ( ESR ). CS is the shunt or package capacitance and this is a parasitic B.1.2 Crystal Load Capacitance The crystal load capacitance is the total capacitance seen at the crystal pins, from all sources. As the load capacitance (CL) affects the oscillation frequency by a process known as ‘pulling’, crystal manufacturers specify the frequency for a given load capacitance only. A typical pulling coefficient is 15ppm/pF, to put this into context the maximum frequency error in the IEEE802.15.4 specification is +/-40ppm for the transmitted signal. Therefore, it is important for resonance at 32MHz exactly, that the specified load capacitance is provided. The load capacitance can be calculated using: CL = 1 2 1 2 T T T T C C C C + × Total capacitance CT1 = C1 + C1P + C1in Where C1 is the capacitor component C1P is the PCB parasitic capacitance. With the recommended layout this is about 1.6pF C1in is the on-chip parasitic capacitance and is about 1.4pF typically. Similarly for CT 2 Hence for a 9pF load capacitance, and a tight layout the external capacitors should be 15pF84 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 B.1.3 Crystal ESR and Required Transconductance The resistor in the crystal equivalent circuit represents the energy lost. To maintain oscillation, power must be supplied by the amplifier, but how much? Firstly, the Pi connected capacitors C1 and C2 with CS from the crystal, apply an impedance transformation to Rm, when viewed from the amplifier. This new value is given by: 2 ˆ + = L S L m m C C C R R The amplifier is a transconductance amplifier, which takes a voltage and produces an output current. The amplifier together with the capacitors C1 and C2, form a circuit, which provides a negative resistance, when viewed from the crystal. The value of which is given by: 2 1× 2 ×ω = T T m NEG C C g R Where gm is the transconductance ω is the frequency in rad/s Derivations of these formulas can be easily found in textbooks. In order to give quick and reliable oscillator start-up, a common rule of thumb is to set the amplifier negative resistance to be a minimum of 4 times the effective crystal resistance. This gives 2 T1× T 2 ×ω m C C g ≥ 2 4 + L S L m C C C R This can be used to give an equation for the required transconductance. 1 2 2 1 2 1 2 2 4 [ ( ) ] T T m S T T T T m C C R C C C C C g × × + + × ≥ ω Example: Using typical 32MHz crystal parameters of Rm =40Ω, CS =1pF and CT1 =CT 2 =18pF ( for a load capacitance of 9pF), the equation above gives the required transconductance ( gm ) as 2.59mA/V. The JN516x has a typical value for transconductance of 4.4mA/V The example and equation illustrate the trade-off that exists between the load capacitance and crystal ESR. For example, a crystal with a higher load capacitance can be used, but the value of max. ESR that can be tolerated is reduced. Also note, that the circuit sensitivity to external capacitance [ C1 , C2 ] is a square law. Meeting the criteria for start-up is only one aspect of the way these parameters affect performance, they also affect the time taken during start-up to reach a given, (or full), amplitude. Unfortunately, there is no simple mathematical model for this, but the trend is the same. Therefore, both a larger load capacitance and larger crystal ESR will give a longer start-up time, which has the disadvantages of reduced battery life and increased latency. © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 85 B.2 32MHz Oscillator The JN516x contains the necessary on-chip components to build a 32 MHz reference oscillator with the addition of an external crystal resonator, two tuning capacitors. The schematic of these components are shown in Figure 52. The two capacitors, C1 and C2, will typically be 15pF ±5% and use a COG dielectric. For a detailed specification of the crystal required and factors affecting C1 and C2 see Appendix B.1. As with all crystal oscillators the PCB layout is especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB noise being coupled into the oscillator. XTALOUT C1 C2 XTALIN R1 JN516x Figure 52: Crystal Oscillator Connections The clock generated by this oscillator provides the reference for most of the JN516x subsystems, including the transceiver, processor, memory and digital and analogue peripherals. 32MHz Crystal Requirements Parameter Min Typ Max Notes Crystal Frequency 32MHz Crystal Tolerance 40ppm Including temperature and ageing Crystal ESR Range (Rm) 10Ω 60Ω See below for more details Crystal Load Capacitance Range (CL) 6pF 9pF 12pF See below for more details Not all Combinations of Crystal Load Capacitance and ESR are Valid Recommended Crystal Load Capacitance 9pF and max ESR 40 Ω External Capacitors (C1 & C2) For recommended Crystal 15pF CL = 9pF, total external capacitance needs to be 2*CL. , allowing for stray capacitance from chip, package and PCB 86 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 As is stated above, not all combinations of crystal load capacitance and ESR are valid, and as explained in Appendix B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance. For this reason, we recommend that for a 9pF load capacitance crystals be specified with a maximum ESR of 40 ohms. For lower load capacitances the recommended maximum ESR rises, for example, CL=7pF the max ESR is 61 ohms. For the lower cost crystals in the large HC49 package, a load capacitance of 9 or 10pF is widely available and the max ESR of 30 ohms specified by many manufacturers is acceptable. Also available in this package style, are crystals with a load capacitance of 12pF, but in this case the max ESR required is 25 ohms or better. Below is measurement data showing the variation of the crystal oscillator amplifier transconductance with temperature and supply voltage, notice how small the variation is. Circuit techniques have been used to apply compensation, such that the user need only design for nominal conditions. 4.15 4.20 4.25 4.30 4.35 -40 -20 0 20 40 60 80 100 120 Transconductance (mA/V) Temperature (C) 32MHz Crystal Oscillator 4.27 4.28 4.29 4.3 4.31 4.32 4.33 4.34 4.35 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Transconductance (mA/V) Supply Voltage (VDD) 32MHz Crystal Oscillator © NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 87 B.3 32kHz Oscillator In order to obtain more accurate sleep periods, the JN516x contains the necessary on-chip components to build an optional 32kHz oscillator with the addition of an external 32.768kHz crystal and two tuning capacitors. The crystal should be connected between XTAL32K_IN and XTAL32K_OUT (DIO9 and DIO10), with two equal capacitors to ground, one on each pin. The schematic of these components are shown in Figure 53. The two capacitors, C1 and C2, will typically be in the range 10 to 22pF ±5% and use a COG dielectric. As with all crystal oscillators the PCB layout is especially important, both to keep parasitic capacitors to a minimum and to reduce the possibility of PCB noise being coupled into the oscillator. 32KXTALIN 32KXTALOUT JN516x Figure 53: 32kHz Crystal Oscillator Connections The electrical specification of the oscillator can be found in 19.3.10. The oscillator cell is flexible and can operate with a range of commonly available 32kHz crystals with load capacitances from 6 to 12.5p, and ESR up to 80KΩ. It achieves this by using automatic gain control (AGC), which senses the signal swing. As explained in Appendix B.1.3 there is a trade-off that exists between the load capacitance and crystal ESR to achieve reliable performance. The use of an AGC function allows a wider range of crystal load capacitors and ESR’s to be accommodated than would otherwise be possible. However, this benefit does mean the supply current varies with the supply voltage (VDD), value of the total capacitance at each pin, and the crystal ESR. This is described in the table and graphs below. 32kHz Crystal Requirements Parameter Min Typ Max Notes Crystal Frequency 32kHz Supply Current 1.4µA Vdd=3v, temp=25 C, load cap =9pF, Rm=25K Supply Current Temp. Coeff. 0.1%/C Vdd=3v Crystal ESR Range (Rm) 10KΩ 25KΩ 80KΩ See below for more details Crystal Load Capacitance Range (CL) 6pF 9pF 12.5pF See below for more details Not all Combinations of Crystal Load Capacitance and ESR are Valid 88 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Three examples of typical crystals are given, each with the value of external capacitors to use, plus the likely supply current and start-up time that can be expected. Also given is the maximum recommended ESR based on the start-up criteria given in Appendix B.1.3. The values of the external capacitors can be calculated using the equation in Appendix B.1.2 . Load Capacitance Ext Capacitors Current Start-up Time Max ESR 9pF 15pF 1.4µA 0.5sec 70KΩ 6pF 9pF 1.1µA 0.4sec 80KΩ 12.5pF 22pF 2.2µA 1.0sec 35KΩ Below is measurement data showing the variation of the crystal oscillator supply current with voltage and with crystal ESR, for two load capacitances. 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 Current (uA) Supply Voltage (VDD) 32kHz Crystal Oscillator 0.6 0.8 1 1.2 1.4 1.6 10 20 30 40 50 60 70 80 Normalised Current (IDD) Crystal ESR (K ohm) 32KHz Crystal Oscillator Current 9pF 12.5pF© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 89 B.4 JN516x Module Reference Designs For customers wishing to integrate the JN516x device directly into their system, NXP provide a range of Module Reference Designs, covering standard, medium and high-power modules fitted with different Antennae To ensure the correct performance, it is strongly recommended that where possible the design details provided by the reference designs, are used in their exact form for all end designs, this includes component values, pad dimensions, track layouts etc. In order to minimise all risks, it is recommended that the entire layout of the appropriate reference module, if possible, be replicated in the end design. For full details, see [5]. Please contact technical support. B.4.1 Schematic Diagram A schematic diagram of the JN516x PCB antenna reference module is shown in figure 53. Details of component values and PCB layout constraints can be found in Table 12. 1 40 39 38 37 36 35 34 33 32 31 VSSA 2 3 4 5 6 7 8 9 10 30 29 28 27 26 25 24 23 22 21 11 12 13 14 15 16 17 18 19 20 COMP1P COMP1M RESETN XTAL_OUT XTAL_IN VB_SYNTH VCOTUNE (NC) VB_VCO VDD1 IBIAS VREF VB_RF2 RF_IN VB_RF ADC1 SPISEL1 SPISEL2 DIO2 DIO3 DO0 VSS1 DO1 DIO18 DIO19 VB_RAM CTS0 RTS0 TXD0 RXD0 VDD2 SIF_D VSS2 SIF_CLK DIO13 DIO12 VB_DIG DIO11 TIM0OUT TIM0CAP TIM0CK_GT C7: 100nF 2-wire Serial Port Timer0 C16: 100nF UART0/JTAG C6: 100nF SPI Select Analogue IO C1: 47pF C3: 100nF L1: 5.1nH L2: 3.9nH VB_RF R1: 43kΩ To coaxial socket or integrated antenna C20: 100nF C13: 10µF C14: 100nF VDD C2: 10nF C15: 100nF C10: 15pF C11: 15pF Y1 Analogue IO C4: 47pF Figure 54 JN516x PCB Antenna Module Reference Design 90 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Component Designator Value/Type Function PCB Layout Constraints C13 10µF Power source decoupling C14 100nF Analogue Power decoupling Adjacent to U1 pin 9 C16 100nF Digital power decoupling Adjacent to U1 pin 30 C15 100nF VB Synth decoupling Less than 5mm from U1 pin 6 C2 10nF VB VCO decoupling Less than 5mm from U1 pin 8 C3 100nF VB RF decoupling Less than 5mm from U1 pin 12 and U1 pin 14 C4 47pF VB RF decoupling Less than 5mm from U1 pin 12 and U1 pin 14 C6 100nF VB RAM decoupling Less than 5mm from U1 pin 25 C7 100nF VB Dig decoupling Less than 5mm from U1 pin 35 R1 43k Current Bias Resistor Less than 5mm from U1 pin 10 C20 100nF Vref decoupling (optional) Less than 5mm from U1 pin 11 Y1 32MHz Crystal (AEL X32M000000S039 or Epson Toyocom X1E000021016700) (CL = 9pF, Max ESR 40R) C10 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 4 and Y1 pin 1 C11 15pF +/-5% COG Crystal Load Capacitor Adjacent to pin 5 and Y1 pin 3 C1 47pF AC Coupling Phycomp 2238-869-15479 Must be copied directly from the reference design. L1 5.1nH RF Matching Inductor MuRata LQP15MN5N1B02 L2 3.9nH Load Inductor MuRata LQP15MN3N9B02 Table 12: JN516x Printed Antenna Reference Module Components and PCB Layout Constraints Note1: For extended temperature operation please contact technical support. The paddle should be connected directly to ground. Any pads that require connection to ground should do so by connecting directly to the paddle.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 91 B.4.2 PCB Design and Reflow Profile PCB and land pattern designs are key to the reliability of any electronic circuit design. The Institute for Interconnecting and Packaging Electronic Circuits (IPC) defines a number of standards for electronic devices. One of these is the "Surface Mount Design and Land Pattern Standard" IPC-SM-782 [3], commonly referred to as “IPC782". This specification defines the physical packaging characteristics and land patterns for a range of surface mounted devices. IPC782 is also a useful reference document for general surface mount design techniques, containing sections on design requirements, reliability and testability. NXP strongly recommends that this be referred to when designing the PCB. NXP also provide application note AN10366, “HVQFN application information” [6], which describes the reflow soldering process. The suggested reflow profile, from that application note, is shown in Figure 55. The specific paste manufacturers guidelines on peak flow temperature, soak times, time above liquids and ramp rates should also be referenced. Figure 55: Recommended Reflow Profile for Lead-free Solder Paste (SNAgCu) or PPF Lead Frame B.4.3 Moisture Sensitivity Level (MSL) If there is moisture trapped inside a package, and the package is exposed to a reflow temperature profile, the moisture may turn into steam, which expands rapidly. This may cause damage to the inside of the package (delamination), and it may result in a cracked semiconductor package body (the popcorn effect). A package’s MSL depends on the package characteristics and on the temperature it is exposed to during reflow soldering. This is explained in more detail in [7]. Depending on the damage after this test, an MSL of 1 (not sensitive to moisture) to 6 (very sensitive to moisture) is attached to the semiconductor package.92 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Related Documents [1] IEEE Std 802.15.4-2006 IEEE Standard for Information Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs). [2] JN-AN-1186 JN516x Temperature Dependent Operating Guidelines [3] IPC-SM-782 Surface Mount Design and Land Pattern Standard [4] JN-UG-3087 JN516x Integrated Peripherals API User Guide [5] JN-RD-6038 Module Reference Design [6] http://ics.nxp.com/support/documents/logic/pdf/an10366.pdf [7] http://www.nxp.com/documents/application_note/AN10365.pdf [8] JN-AN-1003 Boot Loader Operation [9] JN-UG-3007 Flash Programmer User Guide [10] JN-UG-3068 Time-of-flight API User Guide [11] JN-AN-1143 Time-of-flight [12] JN-UG-3075-JenOS User Guide RoHS Compliance JN516x devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS) and of the China RoHS (SJ/T11363 – 2006) requirements which came into force on 1st March 2007. Status Information The status of this Data Sheet is. Production NXP Low Power RF products progress according to the following format: Advance The Data Sheet shows the specification of a product in planning or in development. The functionality and electrical performance specifications are target values of the design and may be used as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime without notice. Preliminary The Data Sheet shows the specification of a product that is commercially available, but is not yet fully qualified. The functionality of the product is final. The electrical performance specifications are target values and may used as a guide to the final specification. NXP reserves the right to make changes to the product specification at anytime without notice. Production This is the production Data Sheet for the product. All functional and electrical performance specifications, where included, including min and max values are derived from detailed product characterization. This Data Sheet supersedes all previous document versions. NXP reserves the right to make changes to the product specification at anytime without notice.© NXP Laboratories UK 2013 JN-DS-JN516x v1.3 Production 93 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 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Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. AEC unqualified products — This product has not been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and should not be used in automotive applications, including but not limited to applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is for the customer’s own risk. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet All products are sold subject to NXP Semiconductors’ terms and conditions of sale, supplied at the time of order acknowledgment and published at http://www.nxp.com/profile/terms. Trademarks All trademarks are the property of their respective owners. “JenNet” and “JenNet-IP” are trademarks of NXP B.V.. Version Control Version Notes 1.0 07-01-13 First public version, released as Production 1.1 14-01-13 Minor corrections made 1.2 25-04-13 Additional features included and more information on non-volatile memory 1.3 12-06-13 Minor correction to front page and format of PCB decal diagram94 JN-DS-JN516x v1.3 Production © NXP Laboratories UK 2013 Contact Details NXP Laboratories UK Ltd Furnival Street Sheffield S1 4QT United Kingdom Tel: +44 (0)114 281 2655 Fax: +44 (0) 114 281 2951 For the contact details of your local NXP office or distributor, refer to the NXP web site: www.nxp.com 1. General description The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications requiring a high level of integration and low power dissipation. The ARM Cortex-M3 is a next generation core that offers better performance than the ARM7 at the same clock rate and other system enhancements such as modernized debug features and a higher level of support block integration. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and has a Harvard architecture with separate local instruction and data buses, as well as a third bus with slightly lower performance for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branches. The LPC178x/7x adds a specialized flash memory accelerator to accomplish optimal performance when executing code from flash. The LPC178x/7x operates at up to 120 MHz CPU frequency. The peripheral complement of the LPC178x/7x includes up to 512 kB of flash program memory, up to 96 kB of SRAM data memory, up to 4032 byte of EEPROM data memory, External Memory Controller (EMC), LCD (LPC178x only), Ethernet, USB Device/Host/OTG, a General Purpose DMA controller, five UARTs, three SSP controllers, three I2C-bus interfaces, a Quadrature Encoder Interface, four general purpose timers, two general purpose PWMs with six outputs each and one motor control PWM, an ultra-low power RTC with separate battery supply and event recorder, a windowed watchdog timer, a CRC calculation engine, up to 165 general purpose I/O pins, and more. The analog peripherals include one eight-channel 12-bit ADC and a 10-bit DAC. The pinout of LPC178x/7x is intended to allow pin function compatibility with the LPC24xx and LPC23xx. For additional documentation, see Section 18 “References”. 2. Features and benefits Functional replacement for the LPC23xx and LPC24xx family devices. System: ARM Cortex-M3 processor, running at frequencies of up to 120 MHz. A Memory Protection Unit (MPU) supporting eight regions is included. ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC). LPC178x/7x 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC Rev. 5 — 9 September 2014 Product data sheetLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 2 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller Multilayer AHB matrix interconnect provides a separate bus for each AHB master. AHB masters include the CPU, USB, Ethernet, and the General Purpose DMA controller. This interconnect provides communication with no arbitration delays unless two masters attempt to access the same slave at the same time. Split APB bus allows for higher throughput with fewer stalls between the CPU and DMA. A single level of write buffering allows the CPU to continue without waiting for completion of APB writes if the APB was not already busy. Cortex-M3 system tick timer, including an external clock input option. Standard JTAG test/debug interface as well as Serial Wire Debug and Serial WireTrace Port options. Embedded Trace Macrocell (ETM) module supports real-time trace. Boundary scan for simplified board testing. Non-maskable Interrupt (NMI) input. Memory: Up to 512 kB on-chip flash program memory with In-System Programming (ISP) and In-Application Programming (IAP) capabilities. The combination of an enhanced flash memory accelerator and location of the flash memory on the CPU local code/data bus provides high code performance from flash. Up to 96 kB on-chip SRAM includes: 64 kB of main SRAM on the CPU with local code/data bus for high-performance CPU access. Two 16 kB peripheral SRAM blocks with separate access paths for higher throughput. These SRAM blocks may be used for DMA memory as well as for general purpose instruction and data storage. Up to 4032 byte on-chip EEPROM. LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film Transistors (TFT) displays. Dedicated DMA controller. Selectable display resolution (up to 1024 768 pixels). Supports up to 24-bit true-color mode. External Memory Controller (EMC) provides support for asynchronous static memory devices such as RAM, ROM and flash, as well as dynamic memories such as single data rate SDRAM with an SDRAM clock of up to 80 MHz. Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer matrix that can be used with the SSP, I2S, UART, CRC engine, Analog-to-Digital and Digital-to-Analog converter peripherals, timer match signals, GPIO, and for memory-to-memory transfers. Serial interfaces: Ethernet MAC with MII/RMII interface and associated DMA controller. These functions reside on an independent AHB. USB 2.0 full-speed dual-port device/host/OTG controller with on-chip PHY and associated DMA controller. Five UARTs with fractional baud rate generation, internal FIFO, DMA support, and RS-485/EIA-485 support. One UART (UART1) has full modem control I/O, and one UART (USART4) supports IrDA, synchronous mode, and a smart card mode conforming to ISO7816-3. Three SSP controllers with FIFO and multi-protocol capabilities. The SSP controllers can be used with the GPDMA.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 3 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller Three enhanced I2C-bus interfaces, one with a true open-drain output supporting the full I2C-bus specification and Fast-mode Plus with data rates of 1 Mbit/s, two with standard port pins. Enhancements include multiple address recognition and monitor mode. I 2S-bus (Inter-IC Sound) interface for digital audio input or output. It can be used with the GPDMA. CAN controller with two channels. Digital peripherals: SD/MMC memory card interface. Up to 165 General Purpose I/O (GPIO) pins depending on the packaging with configurable pull-up/down resistors, open-drain mode, and repeater mode. All GPIOs are located on an AHB bus for fast access and support Cortex-M3 bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Any pin of ports 0 and 2 can be used to generate an interrupt. Two external interrupt inputs configurable as edge/level sensitive. All pins on port 0 and port 2 can be used as edge sensitive interrupt sources. Four general purpose timers/counters with a total of eight capture inputs and ten compare outputs. Each timer block has an external count input. Specific timer events can be selected to generate DMA requests. Quadrature encoder interface that can monitor one external quadrature encoder. Two standard PWM/timer blocks with external count input option. One motor control PWM with support for three-phase motor control. Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by a dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered backup registers, allowing system status to be stored when the rest of the chip is powered off. Battery power can be supplied from a standard 3 V lithium button cell. The RTC will continue working when the battery voltage drops to as low as 2.1 V. An RTC interrupt can wake up the CPU from any reduced power mode. Event Recorder that can capture the clock value when an event occurs on any of three inputs. The event identification and the time it occurred are stored in registers. The Event Recorder is located in the RTC power domain and can therefore operate as long as there is RTC power. Windowed Watchdog Timer (WWDT). Windowed operation, dedicated internal oscillator, watchdog warning interrupt, and safety features. CRC Engine block can calculate a CRC on supplied data using one of three standard polynomials. The CRC engine can be used in conjunction with the DMA controller to generate a CRC without CPU involvement in the data transfer. Analog peripherals: 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins, conversion rates up to 400 kHz, and multiple result registers. The 12-bit ADC can be used with the GPDMA controller. 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and GPDMA support. Power control: Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 4 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up from any priority interrupt that can occur while the clocks are stopped in Deep-sleep, Power-down, and Deep power-down modes. Processor wake-up from Power-down mode via any interrupt able to operate during Power-down mode (includes external interrupts, RTC interrupt, PORT0/2 pin interrupt, and NMI). Brownout detect with separate threshold for interrupt and forced reset. On-chip Power-On Reset (POR). Clock generation: Clock output function that can reflect the main oscillator clock, IRC clock, RTC clock, CPU clock, USB clock, or the watchdog timer clock. On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz. 12 MHz Internal RC oscillator (IRC) trimmed to 1% accuracy that can optionally be used as a system clock. An on-chip PLL allows CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. May be run from the main oscillator or the internal RC oscillator. A second, dedicated PLL may be used for USB interface in order to allow added flexibility for the Main PLL settings. Versatile pin function selection feature allows many possibilities for using on-chip peripheral functions. Unique device serial number for identification purposes. Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of 40 C to 85 C. Available as LQFP208, TFBGA208, TFBGA180, and LQFP144 package. 3. Applications Communications: Point-of-sale terminals, web servers, multi-protocol bridges Industrial/Medical: Automation controllers, application control, robotics control, HVAC, PLC, inverters, circuit breakers, medical scanning, security monitoring, motor drive, video intercom Consumer/Appliance: Audio, MP3 decoders, alarm systems, displays, printers, scanners, small appliances, fitness equipment Automotive: After-market, car alarms, GPS/fleet monitorsLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 5 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 4. Ordering information Table 1. Ordering information Type number Package Name Description Version LPC1788 LPC1788FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1788FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 ´ 15 ´ 0.7 mm SOT950-1 LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC1788FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1 LPC1787 LPC1787FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1786 LPC1786FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1785 LPC1785FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1778 LPC1778FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1778FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 ´ 15 ´ 0.7 mm SOT950-1 LPC1778FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC1778FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1 LPC1777 LPC1777FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1776 LPC1776FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1776FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 ´ 12 ´ 0.8 mm SOT570-3 LPC1774 LPC1774FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 28 1.4 mm SOT459-1 LPC1774FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 6 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller [1] Maximum data bus width of the External Memory Controller (EMC) depends on package size. Smaller widths may be used. [2] USART4 not available. Table 2. LPC178x/7x ordering options All parts include two CAN channels, three SSP interfaces, three I2C interfaces, one I2S interface, DAC, and an 8-channel 12-bit ADC. Type number Flash (kB) Main SRAM (kB) Peripheral SRAM (kB) Total SRAM (kB) EEPROM (byte) Ethernet USB UART EMC bus width (bit) [1] LCD QEI SD/ MMC LPC178x LPC1788FBD208 512 64 16 2 96 4032 Y H/O/D 5 32 Y Y Y LPC1788FET208 512 64 16 2 96 4032 Y H/O/D 5 32 Y Y Y LPC1788FET180 512 64 16 2 96 4032 Y H/O/D 5 16 Y Y Y LPC1788FBD144 512 64 16 2 96 4032 Y H/O/D 5 8 Y Y Y LPC1787FBD208 512 64 16 2 96 4032 N H/O/D 5 32 Y Y Y LPC1786FBD208 256 64 16 80 4032 Y H/O/D 5 32 Y Y Y LPC1785FBD208 256 64 16 80 4032 N H/O/D 5 32 Y N Y LPC177x LPC1778FBD208 512 64 16 2 96 4032 Y H/O/D 5 32 N Y Y LPC1778FET208 512 64 16 2 96 4032 Y H/O/D 5 32 N Y Y LPC1778FET180 512 64 16 2 96 4032 Y H/O/D 5 16 N Y Y LPC1778FBD144 512 64 16 2 96 4032 Y H/O/D 5 8 N Y Y LPC1777FBD208 512 64 16 2 96 4032 N H/O/D 5 32 N Y Y LPC1776FBD208 256 64 16 80 4032 Y H/O/D 5 32 N Y Y LPC1776FET180 256 64 16 80 4032 Y H/O/D 5 16 N Y Y LPC1774FBD208 128 32 8 40 2048 N D 5 32 N N N LPC1774FBD144 128 32 8 40 2048 N D 4[2] 8 N N NLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 7 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 5. Block diagram (1) Not available on all parts. See Table 2. Fig 1. Block diagram SRAM 96/80/40 kB ARM CORTEX-M3 TEST/DEBUG INTERFACE EMULATION TRACE MODULE FLASH ACCELERATOR FLASH 512/256/128/64 kB GPDMA CONTROLLER I-code bus D-code bus system bus AHB TO APB BRIDGE 0 HIGH-SPEED GPIO AHB TO APB BRIDGE 1 4032 B/ 2048 B EEPROM CLOCK GENERATION, POWER CONTROL, SYSTEM FUNCTIONS clocks and controls JTAG interface debug port SSP0/2 USART4(1) UART2/3 SYSTEM CONTROL SSP1 UART0/1 I 2C0/1 CAN 0/1 TIMER 0/1 WINDOWED WDT 12-bit ADC PWM0/1 PIN CONNECT GPIO INTERRUPT CONTROL RTC BACKUP REGISTERS EVENT RECORDER 32 kHz OSCILLATOR APB slave group 1 APB slave group 0 RTC POWER DOMAIN LPC178x/7x master ETHERNET(1) master USB DEVICE/ HOST(1)/OTG(1) master 002aaf528 slave slave CRC slave slave slave slave EMC ROM slave slave LCD(1) slave MULTILAYER AHB MATRIX I 2C2 TIMER2/3 DAC I 2S QUADRATURE ENCODER(1) MOTOR CONTROL PWM MPU SD/MMC(1) = connected to GPDMALPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 8 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 6. Pinning information 6.1 Pinning Fig 2. Pin configuration (LQFP208) Fig 3. Pin configuration (TFBGA208) LPC178x/7xFBD208 156 53 104 208 157 105 1 52 002aaf518 002aaf529 LPC178x/7x Transparent top view ball A1 index area U T R P N M K H L J G F E D C A B 2 4 6 8 10 12 13 14 15 17 16 1 3 5 7 9 11LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 9 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 6.2 Pin description I/O pins on the LPC178x/7x are 5 V tolerant and have input hysteresis unless otherwise indicated in the table below. Crystal pins, power pins, and reference voltage pins are not 5 V tolerant. In addition, when pins are selected to be ADC inputs, they are no longer 5 V tolerant and the input voltage must be limited to the voltage at the ADC positive reference pin (VREFP). All port pins Pn[m] are multiplexed, and the multiplexed functions appear in Table 3 in the order defined by the FUNC bits of the corresponding IOCON register up to the highest used function number. Each port pin can support up to eight multiplexed functions. IOCON register FUNC values which are reserved are noted as ‘R’ in the pin configuration table. Fig 4. Pin configuration (TFBGA180) Fig 5. Pin configuration (LQFP144) 002aaf519 LPC178x/7x 1 3 5 7 9 11 2 4 6 8 10 12 13 14 ball A1 index area P N M L K J G E H F D C B A Transparent top view LPC178x/7x 108 37 72 144 109 73 1 36 002aaf520LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 10 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller Table 3. Pin description Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] Description P0[0] to P0[31] I/O Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the pin connect block. P0[0] 94 U15 M10 66 [3] I; PU I/O P0[0] — General purpose digital input/output pin. I CAN_RD1 — CAN1 receiver input. O U3_TXD — Transmitter output for UART3. I/O I2C1_SDA — I 2C1 data input/output (this pin does not use a specialized I2C pad). O U0_TXD — Transmitter output for UART0. P0[1] 96 T14 N11 67 [3] I; PU I/O P0[1] — General purpose digital input/output pin. O CAN_TD1 — CAN1 transmitter output. I U3_RXD — Receiver input for UART3. I/O I2C1_SCL — I 2C1 clock input/output (this pin does not use a specialized I2C pad). I U0_RXD — Receiver input for UART0. P0[2] 202 C4 D5 141 [3] I; PU I/O P0[2] — General purpose digital input/output pin. O U0_TXD — Transmitter output for UART0. O U3_TXD — Transmitter output for UART3. P0[3] 204 D6 A3 142 [3] I; PU I/O P0[3] — General purpose digital input/output pin. I U0_RXD — Receiver input for UART0. I U3_RXD — Receiver input for UART3. P0[4] 168 B12 A11 116 [3] I; PU I/O P0[4] — General purpose digital input/output pin. I/O I2S_RX_SCK — I 2S Receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. I CAN_RD2 — CAN2 receiver input. I T2_CAP0 — Capture input for Timer 2, channel 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[0] — LCD data.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 11 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P0[5] 166 C12 B11 115 [3] I; PU I/O P0[5] — General purpose digital input/output pin. I/O I2S_RX_WS — I 2S Receive word select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. O CAN_TD2 — CAN2 transmitter output. I T2_CAP1 — Capture input for Timer 2, channel 1. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[1] — LCD data. P0[6] 164 D13 D11 113 [3] I; PU I/O P0[6] — General purpose digital input/output pin. I/O I2S_RX_SDA — I 2S Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. I/O SSP1_SSEL — Slave Select for SSP1. O T2_MAT0 — Match output for Timer 2, channel 0. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. - R — Function reserved. - R — Function reserved. O LCD_VD[8] — LCD data. P0[7] 162 C13 B12 112 [4] I; IA I/O P0[7] — General purpose digital input/output pin. I/O I2S_TX_SCK — I 2S transmit clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. I/O SSP1_SCK — Serial Clock for SSP1. O T2_MAT1 — Match output for Timer 2, channel 1. I RTC_EV0 — Event input 0 to Event Monitor/Recorder. - R — Function reserved. - R — Function reserved. O LCD_VD[9] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 12 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P0[8] 160 A15 C12 111 [4] I; IA I/O P0[8] — General purpose digital input/output pin. I/O I2S_TX_WS — I 2S Transmit word select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I/O SSP1_MISO — Master In Slave Out for SSP1. O T2_MAT2 — Match output for Timer 2, channel 2. I RTC_EV1 — Event input 1 to Event Monitor/Recorder. - R — Function reserved. - R — Function reserved. O LCD_VD[16] — LCD data. P0[9] 158 C14 A13 109 [4] I; IA I/O P0[9] — General purpose digital input/output pin. I/O I2S_TX_SDA — I 2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. I/O SSP1_MOSI — Master Out Slave In for SSP1. O T2_MAT3 — Match output for Timer 2, channel 3. I RTC_EV2 — Event input 2 to Event Monitor/Recorder. - R — Function reserved. - R — Function reserved. O LCD_VD[17] — LCD data. P0[10] 98 T15 L10 69 [3] I; PU I/O P0[10] — General purpose digital input/output pin. O U2_TXD — Transmitter output for UART2. I/O I2C2_SDA — I 2C2 data input/output (this pin does not use a specialized I2C pad). O T3_MAT0 — Match output for Timer 3, channel 0. P0[11] 100 R14 P12 70 [3] I; PU I/O P0[11] — General purpose digital input/output pin. I U2_RXD — Receiver input for UART2. I/O I2C2_SCL — I 2C2 clock input/output (this pin does not use a specialized I2C pad). O T3_MAT1 — Match output for Timer 3, channel 1. P0[12] 41 R1 J4 29 [5] I; PU I/O P0[12] — General purpose digital input/output pin. O USB_PPWR2 — Port Power enable signal for USB port 2. I/O SSP1_MISO — Master In Slave Out for SSP1. I ADC0_IN[6] — A/D converter 0, input 6. When configured as an ADC input, the digital function of the pin must be disabled. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 13 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P0[13] 45 R2 J5 32 [5] I; PU I/O P0[13] — General purpose digital input/output pin. O USB_UP_LED2 — USB port 2 GoodLink LED indicator. It is LOW when the device is configured (non-control endpoints enabled), or when the host is enabled and has detected a device on the bus. It is HIGH when the device is not configured, or when host is enabled and has not detected a device on the bus, or during global suspend. It transitions between LOW and HIGH (flashes) when the host is enabled and detects activity on the bus. I/O SSP1_MOSI — Master Out Slave In for SSP1. I ADC0_IN[7] — A/D converter 0, input 7. When configured as an ADC input, the digital function of the pin must be disabled. P0[14] 69 T7 M5 48 [3] I; PU I/O P0[14] — General purpose digital input/output pin. O USB_HSTEN2 — Host Enabled status for USB port 2. I/O SSP1_SSEL — Slave Select for SSP1. O USB_CONNECT2 — SoftConnect control for USB port 2. Signal used to switch an external 1.5 k resistor under software control. Used with the SoftConnect USB feature. P0[15] 128 J16 H13 89 [3] I; PU I/O P0[15] — General purpose digital input/output pin. O U1_TXD — Transmitter output for UART1. I/O SSP0_SCK — Serial clock for SSP0. P0[16] 130 J14 H14 90 [3] I; PU I/O P0[16] — General purpose digital input/output pin. I U1_RXD — Receiver input for UART1. I/O SSP0_SSEL — Slave Select for SSP0. P0[17] 126 K17 J12 87 [3] I; PU I/O P0[17] — General purpose digital input/output pin. I U1_CTS — Clear to Send input for UART1. I/O SSP0_MISO — Master In Slave Out for SSP0. P0[18] 124 K15 J13 86 [3] I; PU I/O P0[18] — General purpose digital input/output pin. I U1_DCD — Data Carrier Detect input for UART1. I/O SSP0_MOSI — Master Out Slave In for SSP0. P0[19] 122 L17 J10 85 [3] I; PU I/O P0[19] — General purpose digital input/output pin. I U1_DSR — Data Set Ready input for UART1. O SD_CLK — Clock output line for SD card interface. I/O I2C1_SDA — I 2C1 data input/output (this pin does not use a specialized I2C pad). Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 14 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P0[20] 120 M17 K14 83 [3] I; PU I/O P0[20] — General purpose digital input/output pin. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O SD_CMD — Command line for SD card interface. I/O I2C1_SCL — I 2C1 clock input/output (this pin does not use a specialized I2C pad). P0[21] 118 M16 K11 82 [3] I; PU I/O P0[21] — General purpose digital input/output pin. I U1_RI — Ring Indicator input for UART1. O SD_PWR — Power Supply Enable for external SD card power supply. O U4_OE — RS-485/EIA-485 output enable signal for UART4. I CAN_RD1 — CAN1 receiver input. I/O U4_SCLK — USART 4 clock input or output in synchronous mode. P0[22] 116 N17 L14 80 [6] I; PU I/O P0[22] — General purpose digital input/output pin. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. I/O SD_DAT[0] — Data line 0 for SD card interface. O U4_TXD — Transmitter output for USART4 (input/output in smart card mode). O CAN_TD1 — CAN1 transmitter output. P0[23] 18 H1 F5 13 [5] I; PU I/O P0[23] — General purpose digital input/output pin. I ADC0_IN[0] — A/D converter 0, input 0. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2S_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. I T3_CAP0 — Capture input for Timer 3, channel 0. P0[24] 16 G2 E1 11 [5] I; PU I/O P0[24] — General purpose digital input/output pin. I ADC0_IN[1] — A/D converter 0, input 1. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2S_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I T3_CAP1 — Capture input for Timer 3, channel 1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 15 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P0[25] 14 F1 E4 10 [5] I; PU I/O P0[25] — General purpose digital input/output pin. I ADC0_IN[2] — A/D converter 0, input 2. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2S_RX_SDA — Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. O U3_TXD — Transmitter output for UART3. P0[26] 12 E1 D1 8 [7] I; PU I/O P0[26] — General purpose digital input/output pin. I ADC0_IN[3] — A/D converter 0, input 3. When configured as an ADC input, the digital function of the pin must be disabled. O DAC_OUT — D/A converter output. When configured as the DAC output, the digital function of the pin must be disabled. I U3_RXD — Receiver input for UART3. P0[27] 50 T1 L3 35 [8] I I/O P0[27] — General purpose digital input/output pin. I/O I2C0_SDA — I 2C0 data input/output (this pin uses a specialized I2C pad). I/O USB_SDA1 — I2C serial data for communication with an external USB transceiver. P0[28] 48 R3 M1 34 [8] I I/O P0[28] — General purpose digital input/output pin. I/O I2C0_SCL — I 2C0 clock input/output (this pin uses a specialized I2C pad). I/O USB_SCL1 — I2C serial clock for communication with an external USB transceiver. P0[29] 61 U4 K5 42 [9] I I/O P0[29] — General purpose digital input/output pin. I/O USB_D+1 — USB port 1 bidirectional D+ line. I EINT0 — External interrupt 0 input. P0[30] 62 R6 N4 43 [9] I I/O P0[30] — General purpose digital input/output pin. I/O USB_D1 — USB port 1 bidirectional D line. I EINT1 — External interrupt 1 input. P0[31] 51 T2 N1 36 [9] I I/O P0[31] — General purpose digital input/output pin. I/O USB_D+2 — USB port 2 bidirectional D+ line. P1[0] to P1[31] I/O Port 1: Port 1 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block P1[0] 196 A3 B5 136 [3] I; PU I/O P1[0] — General purpose digital input/output pin. O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface). - R — Function reserved. I T3_CAP1 — Capture input for Timer 3, channel 1. I/O SSP2_SCK — Serial clock for SSP2. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 16 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P1[1] 194 B5 A5 135 [3] I; PU I/O P1[1] — General purpose digital input/output pin. O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface). - R — Function reserved. O T3_MAT3 — Match output for Timer 3, channel 3. I/O SSP2_MOSI — Master Out Slave In for SSP2. P1[2] 185 D9 B7 - [3] I; PU I/O P1[2] — General purpose digital input/output pin. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). O SD_CLK — Clock output line for SD card interface. O PWM0[1] — Pulse Width Modulator 0, output 1. P1[3] 177 A10 A9 - [3] I; PU I/O P1[3] — General purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O SD_CMD — Command line for SD card interface. O PWM0[2] — Pulse Width Modulator 0, output 2. P1[4] 192 A5 C6 133 [3] I; PU I/O P1[4] — General purpose digital input/output pin. O ENET_TX_EN — Ethernet transmit data enable (RMII/MII interface). - R — Function reserved. O T3_MAT2 — Match output for Timer 3, channel 2. I/O SSP2_MISO — Master In Slave Out for SSP2. P1[5] 156 A17 B13 - [3] I; PU I/O P1[5] — General purpose digital input/output pin. O ENET_TX_ER — Ethernet Transmit Error (MII interface). O SD_PWR — Power Supply Enable for external SD card power supply. O PWM0[3] — Pulse Width Modulator 0, output 3. P1[6] 171 B11 B10 - [3] I; PU I/O P1[6] — General purpose digital input/output pin. I ENET_TX_CLK — Ethernet Transmit Clock (MII interface). I/O SD_DAT[0] — Data line 0 for SD card interface. O PWM0[4] — Pulse Width Modulator 0, output 4. P1[7] 153 D14 C13 - [3] I; PU I/O P1[7] — General purpose digital input/output pin. I ENET_COL — Ethernet Collision detect (MII interface). I/O SD_DAT[1] — Data line 1 for SD card interface. O PWM0[5] — Pulse Width Modulator 0, output 5. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 17 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P1[8] 190 C7 B6 132 [3] I; PU I/O P1[8] — General purpose digital input/output pin. I ENET_CRS (ENET_CRS_DV) — Ethernet Carrier Sense (MII interface) or Ethernet Carrier Sense/Data Valid (RMII interface). - R — Function reserved. O T3_MAT1 — Match output for Timer 3, channel 1. I/O SSP2_SSEL — Slave Select for SSP2. P1[9] 188 A6 D7 131 [3] I; PU I/O P1[9] — General purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface). - R — Function reserved. O T3_MAT0 — Match output for Timer 3, channel 0. P1[10] 186 C8 A7 129 [3] I; PU I/O P1[10] — General purpose digital input/output pin. I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface). - R — Function reserved. I T3_CAP0 — Capture input for Timer 3, channel 0. P1[11] 163 A14 A12 - [3] I; PU I/O P1[11] — General purpose digital input/output pin. I ENET_RXD2 — Ethernet Receive Data 2 (MII interface). I/O SD_DAT[2] — Data line 2 for SD card interface. O PWM0[6] — Pulse Width Modulator 0, output 6. P1[12] 157 A16 A14 - [3] I; PU I/O P1[12] — General purpose digital input/output pin. I ENET_RXD3 — Ethernet Receive Data (MII interface). I/O SD_DAT[3] — Data line 3 for SD card interface. I PWM0_CAP0 — Capture input for PWM0, channel 0. P1[13] 147 D16 D14 - [3] I; PU I/O P1[13] — General purpose digital input/output pin. I ENET_RX_DV — Ethernet Receive Data Valid (MII interface). P1[14] 184 A7 D8 128 [3] I; PU I/O P1[14] — General purpose digital input/output pin. I ENET_RX_ER — Ethernet receive error (RMII/MII interface). - R — Function reserved. I T2_CAP0 — Capture input for Timer 2, channel 0. P1[15] 182 A8 A8 126 [3] I; PU I/O P1[15] — General purpose digital input/output pin. I ENET_RX_CLK (ENET_REF_CLK) — Ethernet Receive Clock (MII interface) or Ethernet Reference Clock (RMII interface). - R — Function reserved. I/O I2C2_SDA — I 2C2 data input/output (this pin does not use a specialized I2C pad). Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 18 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P1[16] 180 D10 B8 125 [3] I; PU I/O P1[16] — General purpose digital input/output pin. O ENET_MDC — Ethernet MIIM clock. O I2S_TX_MCLK — I2S transmit master clock. P1[17] 178 A9 C9 123 [3] I; PU I/O P1[17] — General purpose digital input/output pin. I/O ENET_MDIO — Ethernet MIIM data input and output. O I2S_RX_MCLK — I2S receive master clock. P1[18] 66 P7 L5 46 [3] I; PU I/O P1[18] — General purpose digital input/output pin. O USB_UP_LED1 — It is LOW when the device is configured (non-control endpoints enabled), or when the host is enabled and has detected a device on the bus. It is HIGH when the device is not configured, or when host is enabled and has not detected a device on the bus, or during global suspend. It transitions between LOW and HIGH (flashes) when the host is enabled and detects activity on the bus. O PWM1[1] — Pulse Width Modulator 1, channel 1 output. I T1_CAP0 — Capture input for Timer 1, channel 0. - R — Function reserved. I/O SSP1_MISO — Master In Slave Out for SSP1. P1[19] 68 U6 P5 47 [3] I; PU I/O P1[19] — General purpose digital input/output pin. O USB_TX_E1 — Transmit Enable signal for USB port 1 (OTG transceiver). O USB_PPWR1 — Port Power enable signal for USB port 1. I T1_CAP1 — Capture input for Timer 1, channel 1. O MC_0A — Motor control PWM channel 0, output A. I/O SSP1_SCK — Serial clock for SSP1. O U2_OE — RS-485/EIA-485 output enable signal for UART2. P1[20] 70 U7 K6 49 [3] I; PU I/O P1[20] — General purpose digital input/output pin. O USB_TX_DP1 — D+ transmit data for USB port 1 (OTG transceiver). O PWM1[2] — Pulse Width Modulator 1, channel 2 output. I QEI_PHA — Quadrature Encoder Interface PHA input. I MC_FB0 — Motor control PWM channel 0 feedback input. I/O SSP0_SCK — Serial clock for SSP0. O LCD_VD[6] — LCD data. O LCD_VD[10] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 19 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P1[21] 72 R8 N6 50 [3] I; PU I/O P1[21] — General purpose digital input/output pin. O USB_TX_DM1 — D transmit data for USB port 1 (OTG transceiver). O PWM1[3] — Pulse Width Modulator 1, channel 3 output. I/O SSP0_SSEL — Slave Select for SSP0. I MC_ABORT — Motor control PWM, active low fast abort. - R — Function reserved. O LCD_VD[7] — LCD data. O LCD_VD[11] — LCD data. P1[22] 74 U8 M6 51 [3] I; PU I/O P1[22] — General purpose digital input/output pin. I USB_RCV1 — Differential receive data for USB port 1 (OTG transceiver). I USB_PWRD1 — Power Status for USB port 1 (host power switch). O T1_MAT0 — Match output for Timer 1, channel 0. O MC_0B — Motor control PWM channel 0, output B. I/O SSP1_MOSI — Master Out Slave In for SSP1. O LCD_VD[8] — LCD data. O LCD_VD[12] — LCD data. P1[23] 76 P9 N7 53 [3] I; PU I/O P1[23] — General purpose digital input/output pin. I USB_RX_DP1 — D+ receive data for USB port 1 (OTG transceiver). O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I QEI_PHB — Quadrature Encoder Interface PHB input. I MC_FB1 — Motor control PWM channel 1 feedback input. I/O SSP0_MISO — Master In Slave Out for SSP0. O LCD_VD[9] — LCD data. O LCD_VD[13] — LCD data. P1[24] 78 T9 P7 54 [3] I; PU I/O P1[24] — General purpose digital input/output pin. I USB_RX_DM1 — D receive data for USB port 1 (OTG transceiver). O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I QEI_IDX — Quadrature Encoder Interface INDEX input. I MC_FB2 — Motor control PWM channel 2 feedback input. I/O SSP0_MOSI — Master Out Slave in for SSP0. O LCD_VD[10] — LCD data. O LCD_VD[14] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 20 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P1[25] 80 T10 L7 56 [3] I; PU I/O P1[25] — General purpose digital input/output pin. O USB_LS1 — Low Speed status for USB port 1 (OTG transceiver). O USB_HSTEN1 — Host Enabled status for USB port 1. O T1_MAT1 — Match output for Timer 1, channel 1. O MC_1A — Motor control PWM channel 1, output A. O CLKOUT — Selectable clock output. O LCD_VD[11] — LCD data. O LCD_VD[15] — LCD data. P1[26] 82 R10 P8 57 [3] I; PU I/O P1[26] — General purpose digital input/output pin. O USB_SSPND1 — USB port 1 Bus Suspend status (OTG transceiver). O PWM1[6] — Pulse Width Modulator 1, channel 6 output. I T0_CAP0 — Capture input for Timer 0, channel 0. O MC_1B — Motor control PWM channel 1, output B. I/O SSP1_SSEL — Slave Select for SSP1. O LCD_VD[12] — LCD data. O LCD_VD[20] — LCD data. P1[27] 88 T12 M9 61 [3] I; PU I/O P1[27] — General purpose digital input/output pin. I USB_INT1 — USB port 1 OTG transceiver interrupt (OTG transceiver). I USB_OVRCR1 — USB port 1 Over-Current status. I T0_CAP1 — Capture input for Timer 0, channel 1. O CLKOUT — Selectable clock output. - R — Function reserved. O LCD_VD[13] — LCD data. O LCD_VD[21] — LCD data. P1[28] 90 T13 P10 63 [3] I; PU I/O P1[28] — General purpose digital input/output pin. I/O USB_SCL1 — USB port 1 I2C serial clock (OTG transceiver). I PWM1_CAP0 — Capture input for PWM1, channel 0. O T0_MAT0 — Match output for Timer 0, channel 0. O MC_2A — Motor control PWM channel 2, output A. I/O SSP0_SSEL — Slave Select for SSP0. O LCD_VD[14] — LCD data. O LCD_VD[22] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 21 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P1[29] 92 U14 N10 64 [3] I; PU I/O P1[29] — General purpose digital input/output pin. I/O USB_SDA1 — USB port 1 I2C serial data (OTG transceiver). I PWM1_CAP1 — Capture input for PWM1, channel 1. O T0_MAT1 — Match output for Timer 0, channel 1. O MC_2B — Motor control PWM channel 2, output B. O U4_TXD — Transmitter output for USART4 (input/output in smart card mode). O LCD_VD[15] — LCD data. O LCD_VD[23] — LCD data. P1[30] 42 P2 K3 30 [5] I; PU I/O P1[30] — General purpose digital input/output pin. I USB_PWRD2 — Power Status for USB port 2. I USB_VBUS — Monitors the presence of USB bus power. This signal must be HIGH for USB reset to occur. I ADC0_IN[4] — A/D converter 0, input 4. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2C0_SDA — I 2C0 data input/output (this pin does not use a specialized I2C pad). O U3_OE — RS-485/EIA-485 output enable signal for UART3. P1[31] 40 P1 K2 28 [5] I; PU I/O P1[31] — General purpose digital input/output pin. I USB_OVRCR2 — Over-Current status for USB port 2. I/O SSP1_SCK — Serial Clock for SSP1. I ADC0_IN[5] — A/D converter 0, input 5. When configured as an ADC input, the digital function of the pin must be disabled. I/O I2C0_SCL — I 2C0 clock input/output (this pin does not use a specialized I2C pad). P2[0] to P2[31] I/O Port 2: Port 2 is a 32 bit I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the pin connect block. P2[0] 154 B17 D12 107 [3] I; PU I/O P2[0] — General purpose digital input/output pin. O PWM1[1] — Pulse Width Modulator 1, channel 1 output. O U1_TXD — Transmitter output for UART1. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_PWR — LCD panel power enable. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 22 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P2[1] 152 E14 C14 106 [3] I; PU I/O P2[1] — General purpose digital input/output pin. O PWM1[2] — Pulse Width Modulator 1, channel 2 output. I U1_RXD — Receiver input for UART1. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_LE — Line end signal. P2[2] 150 D15 E11 105 [3] I; PU I/O P2[2] — General purpose digital input/output pin. O PWM1[3] — Pulse Width Modulator 1, channel 3 output. I U1_CTS — Clear to Send input for UART1. O T2_MAT3 — Match output for Timer 2, channel 3. - R — Function reserved. O TRACEDATA[3] — Trace data, bit 3. - R — Function reserved. O LCD_DCLK — LCD panel clock. P2[3] 144 E16 E13 100 [3] I; PU I/O P2[3] — General purpose digital input/output pin. O PWM1[4] — Pulse Width Modulator 1, channel 4 output. I U1_DCD — Data Carrier Detect input for UART1. O T2_MAT2 — Match output for Timer 2, channel 2. - R — Function reserved. O TRACEDATA[2] — Trace data, bit 2. - R — Function reserved. O LCD_FP — Frame pulse (STN). Vertical synchronization pulse (TFT). P2[4] 142 D17 E14 99 [3] I; PU I/O P2[4] — General purpose digital input/output pin. O PWM1[5] — Pulse Width Modulator 1, channel 5 output. I U1_DSR — Data Set Ready input for UART1. O T2_MAT1 — Match output for Timer 2, channel 1. - R — Function reserved. O TRACEDATA[1] — Trace data, bit 1. - R — Function reserved. O LCD_ENAB_M — STN AC bias drive or TFT data enable output. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 23 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P2[5] 140 F16 F12 97 [3] I; PU I/O P2[5] — General purpose digital input/output pin. O PWM1[6] — Pulse Width Modulator 1, channel 6 output. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. O T2_MAT0 — Match output for Timer 2, channel 0. - R — Function reserved. O TRACEDATA[0] — Trace data, bit 0. - R — Function reserved. O LCD_LP — Line synchronization pulse (STN). Horizontal synchronization pulse (TFT). P2[6] 138 E17 F13 96 [3] I; PU I/O P2[6] — General purpose digital input/output pin. I PWM1_CAP0 — Capture input for PWM1, channel 0. I U1_RI — Ring Indicator input for UART1. I T2_CAP0 — Capture input for Timer 2, channel 0. O U2_OE — RS-485/EIA-485 output enable signal for UART2. O TRACECLK — Trace clock. O LCD_VD[0] — LCD data. O LCD_VD[4] — LCD data. P2[7] 136 G16 G11 95 [3] I; PU I/O P2[7] — General purpose digital input/output pin. I CAN_RD2 — CAN2 receiver input. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_VD[1] — LCD data. O LCD_VD[5] — LCD data. P2[8] 134 H15 G14 93 [3] I; PU I/O P2[8] — General purpose digital input/output pin. O CAN_TD2 — CAN2 transmitter output. O U2_TXD — Transmitter output for UART2. I U1_CTS — Clear to Send input for UART1. O ENET_MDC — Ethernet MIIM clock. - R — Function reserved. O LCD_VD[2] — LCD data. O LCD_VD[6] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 24 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P2[9] 132 H16 H11 92 [3] I; PU I/O P2[9] — General purpose digital input/output pin. O USB_CONNECT1 — USB1 SoftConnect control. Signal used to switch an external 1.5 k resistor under the software control. Used with the SoftConnect USB feature. I U2_RXD — Receiver input for UART2. I U4_RXD — Receiver input for USART4. I/O ENET_MDIO — Ethernet MIIM data input and output. - R — Function reserved. I LCD_VD[3] — LCD data. I LCD_VD[7] — LCD data. P2[10] 110 N15 M13 76 [10] I; PU I/O P2[10] — General purpose digital input/output pin. This pin includes a 10 ns input . A LOW on this pin while RESET is LOW forces the on-chip boot loader to take over control of the part after a reset and go into ISP mode. I EINT0 — External interrupt 0 input. I NMI — Non-maskable interrupt input. P2[11] 108 T17 M12 75 [10] I; PU I/O P2[11] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. I EINT1 — External interrupt 1 input. I/O SD_DAT[1] — Data line 1 for SD card interface. I/O I2S_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. - R — Function reserved. - R — Function reserved. - R — Function reserved. O LCD_CLKIN — LCD clock. P2[12] 106 N14 N14 73 [10] I; PU I/O P2[12] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. I EINT2 — External interrupt 2 input. I/O SD_DAT[2] — Data line 2 for SD card interface. I/O I2S_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. O LCD_VD[4] — LCD data. O LCD_VD[3] — LCD data. O LCD_VD[8] — LCD data. O LCD_VD[18] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 25 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P2[13] 102 T16 M11 71 [10] I; PU I/O P2[13] — General purpose digital input/output pin. This pin includes a 10 ns input glitch filter. I EINT3 — External interrupt 3 input. I/O SD_DAT[3] — Data line 3 for SD card interface. I/O I2S_TX_SDA — Transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. - R — Function reserved. O LCD_VD[5] — LCD data. O LCD_VD[9] — LCD data. O LCD_VD[19] — LCD data. P2[14] 91 R12 - - [3] I; PU I/O P2[14] — General purpose digital input/output pin. O EMC_CS2 — LOW active Chip Select 2 signal. I/O I2C1_SDA — I 2C1 data input/output (this pin does not use a specialized I2C pad). I T2_CAP0 — Capture input for Timer 2, channel 0. P2[15] 99 P13 - - [3] I; PU I/O P2[15] — General purpose digital input/output pin. O EMC_CS3 — LOW active Chip Select 3 signal. I/O I2C1_SCL — I 2C1 clock input/output (this pin does not use a specialized I2C pad). I T2_CAP1 — Capture input for Timer 2, channel 1. P2[16] 87 R11 P9 - [3] I; PU I/O P2[16] — General purpose digital input/output pin. O EMC_CAS — LOW active SDRAM Column Address Strobe. P2[17] 95 R13 P11 - [3] I; PU I/O P2[17] — General purpose digital input/output pin. O EMC_RAS — LOW active SDRAM Row Address Strobe. P2[18] 59 U3 P3 - [6] I; PU I/O P2[18] — General purpose digital input/output pin. O EMC_CLK[0] — SDRAM clock 0. P2[19] 67 R7 N5 - [6] I; PU I/O P2[19] — General purpose digital input/output pin. O EMC_CLK[1] — SDRAM clock 1. P2[20] 73 T8 P6 - [3] I; PU I/O P2[20] — General purpose digital input/output pin. O EMC_DYCS0 — SDRAM chip select 0. P2[21] 81 U11 N8 - [3] I; PU I/O P2[21] — General purpose digital input/output pin. O EMC_DYCS1 — SDRAM chip select 1. P2[22] 85 U12 - - [3] I; PU I/O P2[22] — General purpose digital input/output pin. O EMC_DYCS2 — SDRAM chip select 2. I/O SSP0_SCK — Serial clock for SSP0. I T3_CAP0 — Capture input for Timer 3, channel 0. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 26 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P2[23] 64 U5 - - [3] I; PU I/O P2[23] — General purpose digital input/output pin. O EMC_DYCS3 — SDRAM chip select 3. I/O SSP0_SSEL — Slave Select for SSP0. I T3_CAP1 — Capture input for Timer 3, channel 1. P2[24] 53 P5 P1 - [3] I; PU I/O P2[24] — General purpose digital input/output pin. O EMC_CKE0 — SDRAM clock enable 0. P2[25] 54 R4 P2 - [3] I; PU I/O P2[25] — General purpose digital input/output pin. O EMC_CKE1 — SDRAM clock enable 1. P2[26] 57 T4 - - [3] I; PU I/O P2[26] — General purpose digital input/output pin. O EMC_CKE2 — SDRAM clock enable 2. I/O SSP0_MISO — Master In Slave Out for SSP0. O T3_MAT0 — Match output for Timer 3, channel 0. P2[27] 47 P3 - - [3] I; PU I/O P2[27] — General purpose digital input/output pin. O EMC_CKE3 — SDRAM clock enable 3. I/O SSP0_MOSI — Master Out Slave In for SSP0. O T3_MAT1 — Match output for Timer 3, channel 1. P2[28] 49 P4 M2 - [3] I; PU I/O P2[28] — General purpose digital input/output pin. O EMC_DQM0 — Data mask 0 used with SDRAM and static devices. P2[29] 43 N3 L1 - [3] I; PU I/O P2[29] — General purpose digital input/output pin. O EMC_DQM1 — Data mask 1 used with SDRAM and static devices. P2[30] 31 L4 - - [3] I; PU I/O P2[30] — General purpose digital input/output pin. O EMC_DQM2 — Data mask 2 used with SDRAM and static devices. I/O I2C2_SDA — I 2C2 data input/output (this pin does not use a specialized I2C pad). O T3_MAT2 — Match output for Timer 3, channel 2. P2[31] 39 N2 - - [3] I; PU I/O P2[31] — General purpose digital input/output pin. O EMC_DQM3 — Data mask 3 used with SDRAM and static devices. I/O I2C2_SCL — I 2C2 clock input/output (this pin does not use a specialized I2C pad). O T3_MAT3 — Match output for Timer 3, channel 3. P3[0] to P3[31] I/O Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 3 pins depends upon the pin function selected via the pin connect block. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 27 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P3[0] 197 B4 D6 137 [3] I; PU I/O P3[0] — General purpose digital input/output pin. I/O EMC_D[0] — External memory data line 0. P3[1] 201 B3 E6 140 [3] I; PU I/O P3[1] — General purpose digital input/output pin. I/O EMC_D[1] — External memory data line 1. P3[2] 207 B1 A2 144 [3] I; PU I/O P3[2] — General purpose digital input/output pin. I/O EMC_D[2] — External memory data line 2. P3[3] 3 E4 G5 2 [3] I; PU I/O P3[3] — General purpose digital input/output pin. I/O EMC_D[3] — External memory data line 3. P3[4] 13 F2 D3 9 [3] I; PU I/O P3[4] — General purpose digital input/output pin. I/O EMC_D[4] — External memory data line 4. P3[5] 17 G1 E3 12 [3] I; PU I/O P3[5] — General purpose digital input/output pin. I/O EMC_D[5] — External memory data line 5. P3[6] 23 J1 F4 16 [3] I; PU I/O P3[6] — General purpose digital input/output pin. I/O EMC_D[6] — External memory data line 6. P3[7] 27 L1 G3 19 [3] I; PU I/O P3[7] — General purpose digital input/output pin. I/O EMC_D[7] — External memory data line 7. P3[8] 191 D8 A6 - [3] I; PU I/O P3[8] — General purpose digital input/output pin. I/O EMC_D[8] — External memory data line 8. P3[9] 199 C5 A4 - [3] I; PU I/O P3[9] — General purpose digital input/output pin. I/O EMC_D[9] — External memory data line 9. P3[10] 205 B2 B3 - [3] I; PU I/O P3[10] — General purpose digital input/output pin. I/O EMC_D[10] — External memory data line 10. P3[11] 208 D5 B2 - [3] I; PU I/O P3[11] — General purpose digital input/output pin. I/O EMC_D[11] — External memory data line 11. P3[12] 1 D4 A1 - [3] I; PU I/O P3[12] — General purpose digital input/output pin. I/O EMC_D[12] — External memory data line 12. P3[13] 7 C1 C1 - [3] I; PU I/O P3[13] — General purpose digital input/output pin. I/O EMC_D[13] — External memory data line 13. P3[14] 21 H2 F1 - [3] I; PU I/O P3[14] — General purpose digital input/output pin. I/O EMC_D[14] — External memory data line 14. P3[15] 28 M1 G4 - [3] I; PU I/O P3[15] — General purpose digital input/output pin. I/O EMC_D[15] — External memory data line 15. P3[16] 137 F17 - - [3] I; PU I/O P3[16] — General purpose digital input/output pin. I/O EMC_D[16] — External memory data line 16. O PWM0[1] — Pulse Width Modulator 0, output 1. O U1_TXD — Transmitter output for UART1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 28 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P3[17] 143 F15 - - [3] I; PU I/O P3[17] — General purpose digital input/output pin. I/O EMC_D[17] — External memory data line 17. O PWM0[2] — Pulse Width Modulator 0, output 2. I U1_RXD — Receiver input for UART1. P3[18] 151 C15 - - [3] I; PU I/O P3[18] — General purpose digital input/output pin. I/O EMC_D[18] — External memory data line 18. O PWM0[3] — Pulse Width Modulator 0, output 3. I U1_CTS — Clear to Send input for UART1. P3[19] 161 B14 - - [3] I; PU I/O P3[19] — General purpose digital input/output pin. I/O EMC_D[19] — External memory data line 19. O PWM0[4] — Pulse Width Modulator 0, output 4. I U1_DCD — Data Carrier Detect input for UART1. P3[20] 167 A13 - - [3] I; PU I/O P3[20] — General purpose digital input/output pin. I/O EMC_D[20] — External memory data line 20. O PWM0[5] — Pulse Width Modulator 0, output 5. I U1_DSR — Data Set Ready input for UART1. P3[21] 175 C10 - - [3] I; PU I/O P3[21] — General purpose digital input/output pin. I/O EMC_D[21] — External memory data line 21. O PWM0[6] — Pulse Width Modulator 0, output 6. O U1_DTR — Data Terminal Ready output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. P3[22] 195 C6 - - [3] I; PU I/O P3[22] — General purpose digital input/output pin. I/O EMC_D[22] — External memory data line 22. I PWM0_CAP0 — Capture input for PWM0, channel 0. I U1_RI — Ring Indicator input for UART1. P3[23] 65 T6 M4 45 [3] I; PU I/O P3[23] — General purpose digital input/output pin. I/O EMC_D[23] — External memory data line 23. I PWM1_CAP0 — Capture input for PWM1, channel 0. I T0_CAP0 — Capture input for Timer 0, channel 0. P3[24] 58 R5 N3 40 [3] I; PU I/O P3[24] — General purpose digital input/output pin. I/O EMC_D[24] — External memory data line 24. O PWM1[1] — Pulse Width Modulator 1, output 1. I T0_CAP1 — Capture input for Timer 0, channel 1. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 29 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P3[25] 56 U2 M3 39 [3] I; PU I/O P3[25] — General purpose digital input/output pin. I/O EMC_D[25] — External memory data line 25. O PWM1[2] — Pulse Width Modulator 1, output 2. O T0_MAT0 — Match output for Timer 0, channel 0. P3[26] 55 T3 K7 38 [3] I; PU I/O P3[26] — General purpose digital input/output pin. I/O EMC_D[26] — External memory data line 26. O PWM1[3] — Pulse Width Modulator 1, output 3. O T0_MAT1 — Match output for Timer 0, channel 1. I STCLK — System tick timer clock input. The maximum STCLK frequency is 1/4 of the ARM processor clock frequency CCLK. P3[27] 203 A1 - - [3] I; PU I/O P3[27] — General purpose digital input/output pin. I/O EMC_D[27] — External memory data line 27. O PWM1[4] — Pulse Width Modulator 1, output 4. I T1_CAP0 — Capture input for Timer 1, channel 0. P3[28] 5 D2 - - [3] I; PU I/O P3[28] — General purpose digital input/output pin. I/O EMC_D[28] — External memory data line 28. O PWM1[5] — Pulse Width Modulator 1, output 5. I T1_CAP1 — Capture input for Timer 1, channel 1. P3[29] 11 F3 - - [3] I; PU I/O P3[29] — General purpose digital input/output pin. I/O EMC_D[29] — External memory data line 29. O PWM1[6] — Pulse Width Modulator 1, output 6. O T1_MAT0 — Match output for Timer 1, channel 0. P3[30] 19 H3 - - [3] I; PU I/O P3[30] — General purpose digital input/output pin. I/O EMC_D[30] — External memory data line 30. O U1_RTS — Request to Send output for UART1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART1. O T1_MAT1 — Match output for Timer 1, channel 1. P3[31] 25 J3 - - [3] I; PU I/O P3[31] — General purpose digital input/output pin. I/O EMC_D[31] — External memory data line 31. - R — Function reserved. O T1_MAT2 — Match output for Timer 1, channel 2. P4[0] to P4[31] I/O Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The operation of port 4 pins depends upon the pin function selected via the pin connect block. P4[0] 75 U9 L6 52 [3] I; PU I/O P4[0] — General purpose digital input/output pin. I/O EMC_A[0] — External memory address line 0. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 30 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P4[1] 79 U10 M7 55 [3] I; PU I/O P4[1] — General purpose digital input/output pin. I/O EMC_A[1] — External memory address line 1. P4[2] 83 T11 M8 58 [3] I; PU I/O P4[2] — General purpose digital input/output pin. I/O EMC_A[2] — External memory address line 2. P4[3] 97 U16 K9 68 [3] I; PU I/O P4[3] — General purpose digital input/output pin. I/O EMC_A[3] — External memory address line 3. P4[4] 103 R15 P13 72 [3] I; PU I/O P4[4] — General purpose digital input/output pin. I/O EMC_A[4] — External memory address line 4. P4[5] 107 R16 H10 74 [3] I; PU I/O P4[5] — General purpose digital input/output pin. I/O EMC_A[5] — External memory address line 5. P4[6] 113 M14 K10 78 [3] I; PU I/O P4[6] — General purpose digital input/output pin. I/O EMC_A[6] — External memory address line 6. P4[7] 121 L16 K12 84 [3] I; PU I/O P4[7] — General purpose digital input/output pin. I/O EMC_A[7] — External memory address line 7. P4[8] 127 J17 J11 88 [3] I; PU I/O P4[8] — General purpose digital input/output pin. I/O EMC_A[8] — External memory address line 8. P4[9] 131 H17 H12 91 [3] I; PU I/O P4[9] — General purpose digital input/output pin. I/O EMC_A[9] — External memory address line 9. P4[10] 135 G17 G12 94 [3] I; PU I/O P4[10] — General purpose digital input/output pin. I/O EMC_A[10] — External memory address line 10. P4[11] 145 F14 F11 101 [3] I; PU I/O P4[11] — General purpose digital input/output pin. I/O EMC_A[11] — External memory address line 11. P4[12] 149 C16 F10 104 [3] I; PU I/O P4[12] — General purpose digital input/output pin. I/O EMC_A[12] — External memory address line 12. P4[13] 155 B16 B14 108 [3] I; PU I/O P4[13] — General purpose digital input/output pin. I/O EMC_A[13] — External memory address line 13. P4[14] 159 B15 E8 110 [3] I; PU I/O P4[14] — General purpose digital input/output pin. I/O EMC_A[14] — External memory address line 14. P4[15] 173 A11 C10 120 [3] I; PU I/O P4[15] — General purpose digital input/output pin. I/O EMC_A[15] — External memory address line 15. P4[16] 101 U17 N12 - [3] I; PU I/O P4[16] — General purpose digital input/output pin. I/O EMC_A[16] — External memory address line 16. P4[17] 104 P14 N13 - [3] I; PU I/O P4[17] — General purpose digital input/output pin. I/O EMC_A[17] — External memory address line 17. P4[18] 105 P15 P14 - [3] I; PU I/O P4[18] — General purpose digital input/output pin. I/O EMC_A[18] — External memory address line 18. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 31 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P4[19] 111 P16 M14 - [3] I; PU I/O P4[19] — General purpose digital input/output pin. I/O EMC_A[19] — External memory address line 19. P4[20] 109 R17 - - [3] I; PU I/O P4[20] — General purpose digital input/output pin. I/O EMC_A[20] — External memory address line 20. I/O I2C2_SDA — I 2C2 data input/output (this pin does not use a specialized I2C pad). I/O SSP1_SCK — Serial Clock for SSP1. P4[21] 115 M15 - - [3] I; PU I/O P4[21] — General purpose digital input/output pin. I/O EMC_A[21] — External memory address line 21. I/O I2C2_SCL — I 2C2 clock input/output (this pin does not use a specialized I2C pad). I/O SSP1_SSEL — Slave Select for SSP1. P4[22] 123 K14 - - [3] I; PU I/O P4[22] — General purpose digital input/output pin. I/O EMC_A[22] — External memory address line 22. O U2_TXD — Transmitter output for UART2. I/O SSP1_MISO — Master In Slave Out for SSP1. P4[23] 129 J15 - - [3] I; PU I/O P4[23] — General purpose digital input/output pin. I/O EMC_A[23] — External memory address line 23. I U2_RXD — Receiver input for UART2. I/O SSP1_MOSI — Master Out Slave In for SSP1. P4[24] 183 B8 C8 127 [3] I; PU I/O P4[24] — General purpose digital input/output pin. O EMC_OE — LOW active Output Enable signal. P4[25] 179 B9 D9 124 [3] I; PU I/O P4[25] — General purpose digital input/output pin. O EMC_WE — LOW active Write Enable signal. P4[26] 119 L15 K13 - [3] I; PU I/O P4[26] — General purpose digital input/output pin. O EMC_BLS0 — LOW active Byte Lane select signal 0. P4[27] 139 G15 F14 - [3] I; PU I/O P4[27] — General purpose digital input/output pin. O EMC_BLS1 — LOW active Byte Lane select signal 1. P4[28] 170 C11 D10 118 [3] I; PU I/O P4[28] — General purpose digital input/output pin. O EMC_BLS2 — LOW active Byte Lane select signal 2. O U3_TXD — Transmitter output for UART3. O T2_MAT0 — Match output for Timer 2, channel 0. - R — Function reserved. O LCD_VD[6] — LCD data. O LCD_VD[10] — LCD data. O LCD_VD[2] — LCD data. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 32 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P4[29] 176 B10 B9 122 [3] I; PU I/O P4[29] — General purpose digital input/output pin. O EMC_BLS3 — LOW active Byte Lane select signal 3. I U3_RXD — Receiver input for UART3. O T2_MAT1 — Match output for Timer 2, channel 1. I/O I2C2_SCL — I 2C2 clock input/output (this pin does not use a specialized I2C pad). O LCD_VD[7] — LCD data. O LCD_VD[11] — LCD data. O LCD_VD[3] — LCD data. P4[30] 187 B7 C7 130 [3] I; PU I/O P4[30] — General purpose digital input/output pin. O EMC_CS0 — LOW active Chip Select 0 signal. P4[31] 193 A4 E7 134 [3] I; PU I/O P4[31] — General purpose digital input/output pin. O EMC_CS1 — LOW active Chip Select 1 signal. P5[0] to P5[4] I/O Port 5: Port 5 is a 5-bit I/O port with individual direction controls for each bit. The operation of port 5 pins depends upon the pin function selected via the pin connect block. P5[0] 9 F4 E5 6 [3] I; PU I/O P5[0] — General purpose digital input/output pin. I/O EMC_A[24] — External memory address line 24. I/O SSP2_MOSI — Master Out Slave In for SSP2. O T2_MAT2 — Match output for Timer 2, channel 2. P5[1] 30 J4 H1 21 [3] I; PU I/O P5[1] — General purpose digital input/output pin. I/O EMC_A[25] — External memory address line 25. I/O SSP2_MISO — Master In Slave Out for SSP2. O T2_MAT3 — Match output for Timer 2, channel 3. P5[2] 117 L14 L12 81 [11] I I/O P5[2] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O T3_MAT2 — Match output for Timer 3, channel 2. - R — Function reserved. I/O I2C0_SDA — I 2C0 data input/output (this pin uses a specialized I 2C pad that supports I2C Fast Mode Plus). Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 33 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller P5[3] 141 G14 G10 98 [11] I I/O P5[3] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. I U4_RXD — Receiver input for USART4. I/O I2C0_SCL — I 2C0 clock input/output (this pin uses a specialized I2C pad that supports I2C Fast Mode Plus). P5[4] 206 C3 C4 143 [3] I; PU I/O P5[4] — General purpose digital input/output pin. O U0_OE — RS-485/EIA-485 output enable signal for UART0. - R — Function reserved. O T3_MAT3 — Match output for Timer 3, channel 3. O U4_TXD — Transmitter output for USART4 (input/output in smart card mode). JTAG_TDO (SWO) 2 D3 B1 1 [3] O O Test Data Out for JTAG interface. Also used as Serial wire trace output. JTAG_TDI 4 C2 C3 3 [3] I; PU I Test Data In for JTAG interface. JTAG_TMS (SWDIO) 6 E3 C2 4 [3] I; PU I Test Mode Select for JTAG interface. Also used as Serial wire debug data input/output. JTAG_TRST 8 D1 D4 5 [3] I; PU I Test Reset for JTAG interface. JTAG_TCK (SWDCLK) 10 E2 D2 7 [3] i I Test Clock for JTAG interface. This clock must be slower than 1/6 of the CPU clock (CCLK) for the JTAG interface to operate. Also used as serial wire clock. RESET 35 M2 J1 24 [12] I; PU I External reset input with 20 ns glitch filter. A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. This pin also serves as the debug select input. LOW level selects the JTAG boundary scan. HIGH level selects the ARM SWD debug mode. RSTOUT 29 K3 H2 20 [3] OH O Reset status output. A LOW output on this pin indicates that the device is in the reset state for any reason. This reflects the RESET input pin and all internal reset sources. RTC_ALARM 37 N1 H5 26 [13] OL O RTC controlled output. This pin has a low drive strength and is powered by VBAT. It is driven HIGH when an RTC alarm is generated. RTCX1 34 K2 J2 23 [14] [15] - I Input to the RTC 32 kHz ultra-low power oscillator circuit. RTCX2 36 L2 J3 25 [14] [15] - O Output from the RTC 32 kHz ultra-low power oscillator circuit. USB_D2 52 U1 N2 37 [9] - I/O USB port 2 bidirectional D line. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 34 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller VBAT 38 M3 K1 27 - I RTC power supply: 3.0 V on this pin supplies power to the RTC. VDD(REG)(3V3) 26, 86, 174 H4, P11, D11 G1, N9, E9 18, 60, 121 - S 3.3 V regulator supply voltage: This is the power supply for the on-chip voltage regulator that supplies internal logic. VDDA 20 G4 F2 14 - S Analog 3.3 V pad supply voltage: This can be connected to the same supply as VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to power the ADC and DAC. Note: This pin should be tied to 3.3 V if the ADC and DAC are not used. VDD(3V3) 15, 60, 71, 89, 112, 125, 146, 165, 181, 198 G3, P6, P8, U13, P17, K16, C17, B13, C9, D7 E2, L4, K8, L11, J14, E12, E10, C5 41, 62, 77, 102, 114, 138 - S 3.3 V supply voltage: This is the power supply voltage for I/O other than pins in the VBAT domain. VREFP 24 K1 G2 17 - S ADC positive reference voltage: This should be the same voltage as VDDA, but should be isolated to minimize noise and error. The voltage level on this pin is used as a reference for ADC and DAC. Note: This pin should be tied to 3.3 V if the ADC and DAC are not used. VSS 33, 63, 77, 93, 114, 133, 148, 169, 189, 200 L3, T5, R9, P12, N16, H14, E15, A12, B6, A2 H4, P4, L9, L13, G13, D13, C11, B4 44, 65, 79, 103, 117, 139 - G Ground: 0 V reference for digital IO pins. VSSREG 32, 84, 172 D12, K4, P10 H3, L8, A10 22, 59, 119 - G Ground: 0 V reference for internal logic. VSSA 22 J2 F3 15 - G Analog ground: 0 V power supply and reference for the ADC and DAC. This should be the same voltage as VSS, but should be isolated to minimize noise and error. XTAL1 44 M4 L2 31 [14] [16] - I Input to the oscillator circuit and internal clock generator circuits. XTAL2 46 N4 K4 33 [14] [16] - O Output from the oscillator amplifier. Table 3. Pin description …continued Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, DAC pins) and Table 7 (EMC pins). Symbol Pin LQFP208 Ball TFBGA208 Ball TFBGA180 Pin LQFP144 Reset state[1] Type[2] DescriptionLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 35 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller [1] PU = internal pull-up enabled (for VDD(REG)(3V3) = 3.3 V, pulled up to 3.3 V); IA = inactive, no pull-up/down enabled; F = floating; floating pins, if not used, should be tied to ground or power to minimize power consumption. [2] I = Input; O = Output; OL = Output driving LOW; G = Ground; S = Supply. [3] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL levels and hysteresis. [4] 5 V tolerant standard pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL levels and hysteresis. This pad can be powered by VBAT. [5] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present or configured for an analog function, do not exceed 3.6 V) providing digital I/O functions with TTL levels and hysteresis and analog input. When configured as a ADC input, digital section of the pad is disabled. [6] 5 V tolerant fast pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL levels and hysteresis. [7] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present or configured for an analog function, do not exceed 3.6 V) providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output, digital section of the pad is disabled. [8] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [9] Not 5 V tolerant. Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). [10] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis. [11] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 1 MHz specification. It requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain configuration applies to all functions on this pin. [12] 5 V tolerant pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis. [13] This pad can be powered from VBAT. [14] Pad provides special analog functionality. A 32 kHz crystal oscillator must be used with the RTC. An external clock (32 kHz) can’t be used to drive the RTCX1 pin. [15] If the RTC is not used, these pins can be left floating. [16] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding is preferred to reduce susceptibility to noise). XTAL2 should be left floating. Table 4. Pin allocation table TFBGA208 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball Symbol Row A 1 P3[27] 2 VSS 3 P1[0] 4 P4[31] 5 P1[4] 6 P1[9] 7 P1[14] 8 P1[15] 9 P1[17] 10 P1[3] 11 P4[15] 12 VSS 13 P3[20] 14 P1[11] 15 P0[8] 16 P1[12] 17 P1[5] - - - Row B 1 P3[2] 2 P3[10] 3 P3[1] 4 P3[0] 5 P1[1] 6 VSS 7 P4[30] 8 P4[24] 9 P4[25] 10 P4[29] 11 P1[6] 12 P0[4] 13 VDD(3V3) 14 P3[19] 15 P4[14] 16 P4[13] 17 P2[0] - - - Row CLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 36 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 1 P3[13] 2 JTAG_TDI 3 P5[4] 4 P0[2] 5 P3[9] 6 P3[22] 7 P1[8] 8 P1[10] 9 VDD(3V3) 10 P3[21] 11 P4[28] 12 P0[5] 13 P0[7] 14 P0[9] 15 P3[18] 16 P4[12] 17 VDD(3V3)- - - Row D 1 JTAG_TRST 2 P3[28] 3 JTAG_TDO (SWO) 4 P3[12] 5 P3[11] 6 P0[3] 7 VDD(3V3) 8 P3[8] 9 P1[2] 10 P1[16] 11 VDD(REG)(3V3) 12 VSSREG 13 P0[6] 14 P1[7] 15 P2[2] 16 P1[13] 17 P2[4] - - - Row E 1 P0[26] 2 JTAG_TCK (SWDCLK) 3 JTAG_TMS (SWDIO) 4 P3[3] 5 - 6- 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 P2[1] 15 VSS 16 P2[3] 17 P2[6] - - - Row F 1 P0[25] 2 P3[4] 3 P3[29] 4 P5[0] 5 - 6- 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 P4[11] 15 P3[17] 16 P2[5] 17 P3[16] - - - Row G 1 P3[5] 2 P0[24] 3 VDD(3V3) 4 VDDA 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 P5[3] 15 P4[27] 16 P2[7] 17 P4[10] - - - Row H 1 P0[23] 2 P3[14] 3 P3[30] 4 VDD(REG)(3V3) 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 VSS 15 P2[8] 16 P2[9] 17 P4[9] - - - Row J 1 P3[6] 2 VSSA 3 P3[31] 4 P5[1] 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - Table 4. Pin allocation table TFBGA208 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 37 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 13 14 P0[16] 15 P4[23] 16 P0[15] 17 P4[8] - - - Row K 1 VREFP 2 RTCX1 3 RSTOUT 4 VSSREG 13 - 14 P4[22] 15 P0[18] 16 VDD(3V3) 17 P0[17] - - - Row L 1 P3[7] 2 RTCX2 3 VSS 4 P2[30] 5 - 6- 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 P5[2] 15 P4[26] 16 P4[7] 17 P0[19] - - - Row M 1 P3[15] 2 RESET 3 VBAT 4 XTAL1 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 P4[6] 15 P4[21] 16 P0[21] 17 P0[20] - - - Row N 1 RTC_ALARM 2 P2[31] 3 P2[29] 4 XTAL2 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 P2[12 15 P2[10] 16 VSS 17 P0[22] - - - Row P 1 P1[31] 2 P1[30] 3 P2[27] 4 P2[28] 5 P2[24] 6 VDD(3V3) 7 P1[18] 8 VDD(3V3) 9 P1[23] 10 VSSREG 11 VDD(REG)(3V3) 12 VSS 13 P2[15] 14 P4[17] 15 P4[18] 16 P4[19] 17 VDD(3V3) --- Row R 1 P0[12] 2 P0[13] 3 P0[28] 4 P2[25] 5 P3[24] 6 P0[30] 7 P2[19] 8 P1[21] 9 VSS 10 P1[26] 11 P2[16] 12 P2[14] 13 P2[17] 14 P0[11] 15 P4[4] 16 P4[5] 17 P4[20] - - - Row T 1 P0[27] 2 P0[31] 3 P3[26] 4 P2[26] 5 VSS 6 P3[23] 7 P0[14] 8 P2[20] 9 P1[24] 10 P1[25] 11 P4[2] 12 P1[27] Table 4. Pin allocation table TFBGA208 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 38 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 13 P1[28] 14 P0[1] 15 P0[10] 16 P2[13] 17 P2[11] - - - Row U 1 USB_D-2 2 P3[25] 3 P2[18] 4 P0[29] 5 P2[23] 6 P1[19] 7 P1[20] 8 P1[22] 9 P4[0] 10 P4[1] 11 P2[21] 12 P2[22] 13 VDD(3V3) 14 P1[29] 15 P0[0] 16 P4[3] 17 P4[16] - - - Table 4. Pin allocation table TFBGA208 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball Symbol Table 5. Pin allocation table TFBGA180 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball Symbol Row A 5 P1[1] 6 P3[8] 7 P1[10] 8 P1[15] 9 P1[3] 10 VSSREG 11 P0[4] 12 P1[11] 13 P0[9] 14 P1[12] - - Row B 1 JTAG_TDO (SWO) 2 P3[11] 3 P3[10] 4 VSS 5 P1[0] 6 P1[8] 7 P1[2] 8 P1[16] 9 P4[29] 10 P1[6] 11 P0[5] 12 P0[7] 13 P1[5] 14 P4[13] - - Row C 1 P3[13] 2 JTAG_TMS (SWDIO) 3 JTAG_TDI 4 P5[4] 5 VDD(3V3) 6 P1[4] 7 P4[30] 8 P4[24] 9 P1[17] 10 P4[15] 11 VSS 12 P0[8] 13 P1[7] 14 P2[1] - - Row D 1 P0[26] 2 JTAG_TCK (SWDCLK) 3 P3[4] 4 JTAG_TRST 5 P0[2] 6 P3[0] 7 P1[9] 8 P1[14] 9 P4[25] 10 P4[28] 11 P0[6] 12 P2[0] 13 VSS 14 P1[13] - - Row E 1 P0[24] 2 VDD(3V3) 3 P3[5] 4 P0[25] 5 P5[0] 6 P3[1] 7 P4[31] 8 P4[14] 9 VDD(REG)(3V3) 10 VDD(3V3) 11 P2[2] 12 VDD(3V3) 13 P2[3] 14 P2[4] - - Row F 1 P3[14] 2 VDDA 3 VSSA 4 P3[6] 5 P0[23] 6 - 7 - 8 - 9 - 10 P4[12] 11 P4[11] 12 P2[5]LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 39 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 13 P2[6] 14 P4[27] - - Row G 1 VDD(REG)(3V3) 2 VREFP 3 P3[7] 4 P3[15] 5 P3[3] 6 - 7 - 8 - 9 - 10 P5[3] 11 P2[7] 12 P4[10] 13 VSS 14 P2[8] - - Row H 1 P5[1] 2 RSTOUT 3 VSSREG 4 VSS 5 RTC_ALARM 6 - 7 - 8 - 9 - 10 P4[5] 11 P2[9] 12 P4[9] 13 P0[15] 14 P0[16] - - Table 5. Pin allocation table TFBGA180 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 40 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7. Functional description 7.1 Architectural overview The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and the D-code bus. The I-code and D-code core buses are faster than the system bus and are used similarly to Tightly Coupled Memory (TCM) interfaces: one bus dedicated for instruction fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for simultaneous operations if concurrent operations target different devices. Row J 1 RESET 2 RTCX1 3 RTCX2 4 P0[12] 5 P0[13] 6 - 7 - 8 - 9 - 10 P0[19] 11 P4[8] 12 P0[17] 13 P0[18] 14 VDD(3V3) - - Row K 1 VBAT 2 P1[31] 3 P1[30] 4 XTAL2 5 P0[29] 6 P1[20] 7 P3[26] 8 VDD(3V3) 9 P4[3] 10 P4[6] 11 P0[21] 12 P4[7] 13 P4[26] 14 P0[20] - - Row L 1 P2[29] 2 XTAL1 3 P0[27] 4 VDD(3V3) 5 P1[18] 6 P4[0] 7 P1[25] 8 VSSREG 9 VSS 10 P0[10] 11 VDD(3V3) 12 P5[2] 13 VSS 14 P0[22] - - Row M 1 P0[28] 2 P2[28] 3 P3[25] 4 P3[23] 5 P0[14] 6 P1[22] 7 P4[1] 8 P4[2] 9 P1[27] 10 P0[0] 11 P2[13] 12 P2[11] 13 P2[10] 14 P4[19] - - Row N 1 P0[31] 2 USB_D-2 3 P3[24] 4 P0[30] 5 P2[19] 6 P1[21] 7 P1[23] 8 P2[21] 9 VDD(REG)(3V3) 10 P1[29] 11 P0[1] 12 P4[16] 13 P4[17] 14 P2[12] - - Row P 1 P2[24] 2 P2[25] 3 P2[18] 4 VSS 5 P1[19] 6 P2[20] 7 P1[24] 8 P1[26] 9 P2[16] 10 P1[28] 11 P2[17] 12 P0[11] 13 P4[4] 14 P4[18] - - Table 5. Pin allocation table TFBGA180 Not all functions are available on all parts. See Table 2 and Table 7 (EMC pins). Ball Symbol Ball Symbol Ball Symbol Ball SymbolLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 41 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller The LPC178x/7x use a multi-layer AHB matrix to connect the ARM Cortex-M3 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slaves ports of the matrix to be accessed simultaneously by different bus masters. 7.2 ARM Cortex-M3 processor The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high performance and very low power consumption. The ARM Cortex-M3 offers many new features, including a Thumb-2 instruction set, low interrupt latency, hardware division, hardware single-cycle multiply, interruptable/continuable multiple load and store instructions, automatic state save and restore for interrupts, tightly integrated interrupt controller with wake-up interrupt controller, and multiple core buses capable of simultaneous accesses. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical Reference Manual that can be found on official ARM website. 7.3 On-chip flash program memory The LPC178x/7x contain up to 512 kB of on-chip flash program memory. A new two-port flash accelerator maximizes performance for use with the two fast AHB-Lite buses. 7.4 EEPROM The LPC178x/7x contains up to 4032 byte of on-chip byte-erasable and byte-programmable EEPROM data memory. 7.5 On-chip SRAM The LPC178x/7x contain a total of up to 96 kB on-chip static RAM data memory. This includes the main 64 kB SRAM, accessible by the CPU and DMA controller on a higher-speed bus, and up to two additional 16 kB each SRAM blocks situated on a separate slave port on the AHB multilayer matrix. This architecture allows CPU and DMA accesses to be spread over three separate RAMs that can be accessed simultaneously. 7.6 Memory Protection Unit (MPU) The LPC178x/7x have a Memory Protection Unit (MPU) which can be used to improve the reliability of an embedded system by protecting critical data within the user application. The MPU allows separating processing tasks by disallowing access to each other's data, disabling access to memory regions, allowing memory regions to be defined as read-only and detecting unexpected memory accesses that could potentially break the system.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 42 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller The MPU separates the memory into distinct regions and implements protection by preventing disallowed accesses. The MPU supports up to eight regions each of which can be divided into eight subregions. Accesses to memory locations that are not defined in the MPU regions, or not permitted by the region setting, will cause the Memory Management Fault exception to take place. 7.7 Memory map The LPC178x/7x incorporate several distinct memory regions, shown in the following figures. Figure 6 shows the overall map of the entire address space from the user program viewpoint following reset. The interrupt vector area supports address remapping. The AHB peripheral area is 2 MB in size, and is divided to allow for up to 128 peripherals. The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals. Each peripheral of either type is allocated 16 kB of space. This allows simplifying the address decoding for each peripheral. Table 6. LPC178x/177x memory usage and details Address range General Use Address range details and description 0x0000 0000 to 0x1FFF FFFF On-chip non-volatile memory 0x0000 0000 - 0x0007 FFFF For devices with 512 kB of flash memory. 0x0000 0000 - 0x0003 FFFF For devices with 256 kB of flash memory. 0x0000 0000 - 0x0001 FFFF For devices with 128 kB of flash memory. 0x0000 0000 - 0x0000 FFFF For devices with 64 kB of flash memory. On-chip main SRAM 0x1000 0000 - 0x1000 FFFF For devices with 64 kB of main SRAM. 0x1000 0000 - 0x1000 7FFF For devices with 32 kB of main SRAM. 0x1000 0000 - 0x1000 3FFF For devices with 16 kB of main SRAM. Boot ROM 0x1FFF 0000 - 0x1FFF 1FFF 8 kB Boot ROM with flash services. 0x2000 0000 to 0x3FFF FFFF On-chip SRAM (typically used for peripheral data) 0x2000 0000 - 0x2000 1FFF Peripheral RAM - bank 0 (first 8 kB) 0x2000 2000 - 0x2000 3FFF Peripheral RAM - bank 0 (second 8 kB) 0x2000 4000 - 0x2000 7FFF Peripheral RAM - bank 1 (16 kB) AHB peripherals 0x2008 0000 - 0x200B FFFF See Figure 6 for details 0x4000 0000 to 0x7FFF FFFF APB Peripherals 0x4000 0000 - 0x4007 FFFF APB0 Peripherals, up to 32 peripheral blocks of 16 kB each. 0x4008 0000 - 0x400F FFFF APB1 Peripherals, up to 32 peripheral blocks of 16 kB each. 0x8000 0000 to 0xDFFF FFFF Off-chip Memory via the External Memory Controller Four static memory chip selects: 0x8000 0000 - 0x83FF FFFF Static memory chip select 0 (up to 64 MB) 0x9000 0000 - 0x93FF FFFF Static memory chip select 1 (up to 64 MB) 0x9800 0000 - 0x9BFF FFFF Static memory chip select 2 (up to 64 MB) 0x9C00 0000 - 0x9FFF FFFF Static memory chip select 3 (up to 64 MB) Four dynamic memory chip selects: 0xA000 0000 - 0xAFFF FFFF Dynamic memory chip select 0 (up to 256MB) 0xB000 0000 - 0xBFFF FFFF Dynamic memory chip select 1 (up to 256MB) 0xC000 0000 - 0xCFFF FFFF Dynamic memory chip select 2 (up to 256MB) 0xD000 0000 - 0xDFFF FFFF Dynamic memory chip select 3 (up to 256MB) 0xE000 0000 to 0xE00F FFFF Cortex-M3 Private Peripheral Bus 0xE000 0000 - 0xE00F FFFF Cortex-M3 related functions, includes the NVIC and System Tick Timer.xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 43 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller (1) Not available on all parts. See Table 2 and Table 6. Fig 6. LPC178x/7x memory map 0x4000 4000 0x4000 8000 0x4000 C000 0x4001 0000 0x4001 8000 0x4002 0000 0x4002 8000 0x4002 C000 0x4003 4000 0x4003 0000 0x4003 8000 0x4003 C000 0x4004 0000 0x4004 4000 0x4004 8000 0x4004 C000 0x4005 C000 0x4006 0000 0x4008 0000 0x4002 4000 0x4001 C000 0x4001 4000 0x4000 0000 APB1 peripherals 0x4008 0000 0x4008 8000 0x4008 C000 0x4009 0000 0x4009 4000 0x4009 8000 0x4009 C000 0x400A 0000 0x400A 4000 0x400A 8000 0x400A C000 0x400B 0000 0x400B 4000 0x400B 8000 0x400B C000 0x400C 0000 0x400F C000 0x4010 0000 SSP0 DAC timer 2 timer 3 UART2 UART3 USART4(1) I 2C2 1 - 0 reserved 2 3 4 5 6 7 8 9 10 SSP2 I 2S 11 12 reserved motor control PWM reserved 30 - 17 reserved 13 14 15 16 31 system control reserved reserved 64 kB main static RAM(1) EMC 4 x static chip select(1) EMC 4 x dynamic chip select(1) reserved private peripheral bus 0 GB 0x0000 0000 0.5 GB 4 GB 1 GB 0x1000 0000 0x1001 0000 0x1FFF 0000 0x2000 0000 0x2000 8000 0x2008 0000 0x2200 0000 0x200A 0000 0x2400 0000 0x2800 0000 0x4000 0000 0x4008 0000 0x4010 0000 0x4200 0000 0x4400 0000 0x8000 0000 0xA000 0000 0xE000 0000 0xE010 0000 0xFFFF FFFF reserved reserved reserved reserved reserved reserved APB0 peripherals 0xE004 0000 AHB peripherals APB1 peripherals peripheral SRAM bit-band alias addressing peripheral bit-band alias addressing 16 kB peripheral SRAM1(1) 0x2000 4000 16 kB peripheral SRAM0(1) LPC178x/7x 0x0008 0000 512 kB on-chip flash(1) QEI(1) SD/MMC(1) APB0 peripherals WWDT timer 0 timer 1 UART0 UART1 reserved reserved CAN AF RAM CAN common CAN1 CAN2 CAN AF registers PWM0 I 2C0 RTC/event recorder + backup registers GPIO interrupts pin connect SSP1 ADC 22 - 19 reserved I 2C1 31 - 24 reserved 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 23 PWM1 8 kB boot ROM 0x0000 0000 0x0000 0400 active interrupt vectors + 256 words I-code/D-code memory space 002aaf574 reserved 0x1FFF 2000 0x2900 0000 reserved reserved 0x2008 0000 0x2008 4000 0x2008 8000 0x2008 C000 0x200A 0000 0x2009 C000 AHB peripherals LCD(1) USB(1) Ethernet(1) 0 GPDMA controller 1 2 3 0x2009 0000 4 CRC engine 0x2009 4000 5 0x2009 8000 GPIO EMC registers 6 7LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 44 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.8 Nested Vectored Interrupt Controller (NVIC) The NVIC is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. 7.8.1 Features • Controls system exceptions and peripheral interrupts. • On the LPC178x/7x, the NVIC supports 40 vectored interrupts. • 32 programmable interrupt priority levels, with hardware priority level masking. • Relocatable vector table. • Non-Maskable Interrupt (NMI). • Software interrupt generation. 7.8.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags may also represent more than one interrupt source. Any pin on port 0 and port 2 regardless of the selected function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. 7.9 Pin connect block The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on-chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. Most pins can also be configured as open-drain outputs or to have a pull-up, pull-down, or no resistor enabled. 7.10 External memory controller Remark: Supported memory size and type and EMC bus width vary for different parts (see Table 2). The EMC pin configuration for each part is shown in Table 7.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 45 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller Table 7. External memory controller pin configuration Part Data bus pins Address bus pins Control pins SRAM SDRAM LPC1788FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1788FET208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1788FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[1:0], EMC_CS[1:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[1:0], EMC_CLK[1:0], EMC_CKE[1:0], EMC_DQM[1:0] LPC1788FBD144 EMC_D[7:0] EMC_A[15:0] EMC_BLS[3:2], EMC_CS[1:0], EMC_OE, EMC_WE not available LPC1787FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS_[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1786FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1785FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1778FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1778FET208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1778FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[1:0], EMC_CS[1:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[1:0], EMC_CLK[1:0], EMC_CKE[1:0], EMC_DQM[1:0] LPC1778FBD144 EMC_D[7:0] EMC_A[15:0] EMC_CS[1:0], EMC_OE, EMC_WE not available LPC1777FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1776FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1776FET180 EMC_D[15:0] EMC_A[19:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[1:0], EMC_CLK[1:0], EMC_CKE[1:0], EMC_DQM[1:0] LPC1774FBD208 EMC_D[31:0] EMC_A[25:0] EMC_BLS[3:0], EMC_CS[3:0], EMC_OE, EMC_WE EMC_RAS, EMC_CAS, EMC_DYCS[3:0], EMC_CLK[1:0], EMC_CKE[3:0], EMC_DQM[3:0] LPC1774FBD144 EMC_D[7:0] EMC_A[15:0] EMC_CS[1:0], EMC_OE, EMC_WE not availableLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 46 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller The LPC178x/7x EMC is an ARM PrimeCell MultiPort Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant peripheral. See Table 6 for EMC memory access. 7.10.1 Features • Dynamic memory interface support including single data rate SDRAM. • Asynchronous static memory device support including RAM, ROM, and flash, with or without asynchronous page mode. • Low transaction latency. • Read and write buffers to reduce latency and to improve performance. • 8/16/32 data and 16/20/26 address lines wide static memory support. • 16 bit and 32 bit wide chip select SDRAM memory support. • Static memory features include: – Asynchronous page mode read. – Programmable Wait States. – Bus turnaround delay. – Output enable and write enable delays. – Extended wait. • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control EMC_CKE and EMC_CLK outputs to SDRAMs. • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per device. • Separate reset domains allow the for auto-refresh through a chip reset if desired. Note: Synchronous static memory devices (synchronous burst mode) are not supported. 7.11 General purpose DMA controller The GPDMA is an AMBA AHB compliant peripheral allowing selected peripherals to have DMA support. The GPDMA enables peripheral-to-memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. The source and destination areas can each be either a memory region or a peripheral and can be accessed through the AHB master. The GPDMA controller allows data transfers between the various on-chip SRAM areas and supports the SD/MMC card interface, all SSPs, the I 2S, all UARTs, the A/D Converter, and the D/A Converter peripherals. DMA can also be triggered by selected timer match conditions. Memory-to-memory transfers and transfers to or from GPIO are supported. LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 47 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.11.1 Features • Eight DMA channels. Each channel can support an unidirectional transfer. • 16 DMA request lines. • Single DMA and burst DMA request signals. Each peripheral connected to the DMA Controller can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the DMA Controller. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers are supported. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. • AHB slave DMA programming interface. The DMA Controller is programmed by writing to the DMA control registers over the AHB slave interface. • One AHB bus master for transferring data. The interface transfers data when a DMA request goes active. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. • Internal four-word FIFO per channel. • Supports 8, 16, and 32-bit wide transactions. • Big-endian and little-endian support. The DMA Controller defaults to little-endian mode on reset. • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 7.12 CRC engine The Cyclic Redundancy Check (CRC) generator with programmable polynomial settings supports several CRC standards commonly used. To save system power and bus bandwidth, the CRC engine supports DMA transfers. 7.12.1 Features • Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32. – CRC-CCITT: x16 + x12 + x5 + 1 – CRC-16: x16 + x15 + x2 + 1 – CRC-32: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1 • Bit order reverse and 1’s complement programmable setting for input data and CRC sum. • Programmable seed number setting. • Supports CPU PIO or DMA back-to-back transfer.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 48 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller • Accept any size of data width per write: 8, 16 or 32-bit. – 8-bit write: 1-cycle operation. – 16-bit write: 2-cycle operation (8-bit x 2-cycle). – 32-bit write: 4-cycle operation (8-bit x 4-cycle). 7.13 LCD controller Remark: The LCD controller is available on parts LPC1788/87/86/85. The LCD controller provides all of the necessary control signals to interface directly to a variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024 768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the displayed data) while still supporting a large number of colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time needed to operate the display. 7.13.1 Features • AHB master interface to access frame buffer. • Setup and control via a separate AHB slave interface. • Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. • Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays. • Programmable display resolution including, but not limited to: 320 200, 320 240, 640 200, 640 240, 640 480, 800 600, and 1024 768. • Hardware cursor support for single-panel displays. • 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support. • 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. • 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. • 16 bpp true-color non-palettized, for color STN and TFT. • 24 bpp true-color non-palettized, for color TFT. • Programmable timing for different display panels. • 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM. • Frame, line, and pixel clock signals. • AC bias signal for STN, data enable signal for TFT panels. • Supports little and big-endian, and Windows CE data formats. • LCD panel clock may be generated from the peripheral clock, or from a clock input pin.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 49 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.14 Ethernet Remark: The Ethernet block is available on parts LPC1788/86 and LPC1778/76. The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC designed to provide optimized performance through the use of DMA hardware acceleration. Features include a generous suite of control registers, half or full duplex operation, flow control, control frames, hardware acceleration for transmit retry, receive packet filtering and wake-up on LAN activity. Automatic frame transmission and reception with scatter-gather DMA off-loads many operations from the CPU. The Ethernet block and the CPU share the ARM Cortex-M3 D-code and system bus through the AHB-multilayer matrix to access the various on-chip SRAM blocks for Ethernet data, control, and status information. The Ethernet block interfaces between an off-chip Ethernet PHY using the Media Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial bus. 7.14.1 Features • Ethernet standards support: – Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX, 100 Base-FX, and 100 Base-T4. – Fully compliant with IEEE standard 802.3. – Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back pressure. – Flexible transmit and receive frame options. – Virtual Local Area Network (VLAN) frame support – . • Memory management: – Independent transmit and receive buffers memory mapped to shared SRAM. – DMA managers with scatter/gather DMA and arrays of frame descriptors. – Memory traffic optimized by buffering and pre-fetching. • Enhanced Ethernet features: – Receive filtering. – Multicast and broadcast frame support for both transmit and receive. – Optional automatic Frame Check Sequence (FCS) insertion with Circular Redundancy Check (CRC) for transmit. – Selectable automatic transmit frame padding. – Over-length frame support for both transmit and receive allows any length frames. – Promiscuous receive mode. – Automatic collision back-off and frame retransmission. – Includes power management by clock switching. – Wake-on-LAN power management support allows system wake-up: using the receive filters or a magic frame detection filter.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 50 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller • Physical interface: – Attachment of external PHY chip through standard MII or RMII interface. – PHY register access is available via the MIIM interface. 7.15 USB interface Remark: The USB Device/Host/OTG controller is available on parts LPC1788/87/86/85 and LPC1778/77/76. The USB Device-only controller is available on parts LPC1774. The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a host and one or more (up to 127) peripherals. The host controller allocates the USB bandwidth to attached devices through a token-based protocol. The bus supports hot plugging and dynamic configuration of the devices. All transactions are initiated by the host controller. Details on typical USB interfacing solutions can be found in Section 14.1. 7.15.1 USB device controller The device controller enables 12 Mbit/s data exchange with a USB host controller. It consists of a register interface, serial interface engine, endpoint buffer memory, and a DMA controller. The serial interface engine decodes the USB data stream and writes data to the appropriate endpoint buffer. The status of a completed USB transfer or error condition is indicated via status registers. An interrupt is also generated if enabled. When enabled, the DMA controller transfers data between the endpoint buffer and the USB RAM. 7.15.1.1 Features • Fully compliant with USB 2.0 Specification (full speed). • Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM. • Supports Control, Bulk, Interrupt and Isochronous endpoints. • Scalable realization of endpoints at run time. • Endpoint Maximum packet size selection (up to USB maximum specification) by software at run time. • Supports SoftConnect and GoodLink features. • While USB is in the Suspend mode, the LPC178x/7x can enter one of the reduced power modes and wake up on USB activity. • Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints. • Allows dynamic switching between CPU-controlled and DMA modes. • Double buffer implementation for Bulk and Isochronous endpoints. 7.15.2 USB host controller The host controller enables full- and low-speed data exchange with USB devices attached to the bus. It consists of register interface, serial interface engine and DMA controller. The register interface complies with the Open Host Controller Interface (OHCI) specification. 7.15.2.1 Features • OHCI compliant.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 51 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller • Two downstream ports. • Supports per-port power switching. 7.15.3 USB OTG controller USB OTG is a supplement to the USB 2.0 Specification that augments the capability of existing mobile devices and USB peripherals by adding host functionality for connection to USB peripherals. The OTG Controller integrates the host controller, device controller, and a master-only I2C interface to implement OTG dual-role device functionality. The dedicated I2C interface controls an external OTG transceiver. 7.15.3.1 Features • Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision 1.0a. • Hardware support for Host Negotiation Protocol (HNP). • Includes a programmable timer required for HNP and Session Request Protocol (SRP). • Supports any OTG transceiver compliant with the OTG Transceiver Specification (CEA-2011), Rev. 1.0. 7.16 SD/MMC card interface Remark: The SD/MMC card interface is available on parts LPC1788/87/86/85 and parts LPC1778/77/76. The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD memory cards. The SD card interface conforms to the SD Multimedia Card Specification Version 2.11. 7.16.1 Features • The MCI provides all functions specific to the SD/MMC memory card. These include the clock generation unit, power management control, and command and data transfer. • Conforms to Multimedia Card Specification v2.11. • Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96. • Can be used as a multimedia card bus or a secure digital memory card bus host. The SD/MMC can be connected to several multimedia cards or a single secure digital memory card. • DMA supported through the GPDMA controller. 7.17 Fast general purpose parallel I/O Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. LPC178x/7x use accelerated GPIO functions:LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 52 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller • GPIO registers are accessed through the AHB multilayer bus so that the fastest possible I/O timing can be achieved. • Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. • All GPIO registers are byte and half-word addressable. • Entire port value can be written in one instruction. • Support for Cortex-M3 bit banding. • Support for use with the GPDMA controller. Additionally, any pin on Port 0 and Port 2 providing a digital function can be programmed to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is asynchronous, so it may operate when clocks are not present such as during Power-down mode. Each enabled interrupt can be used to wake up the chip from Power-down mode. 7.17.1 Features • Bit level set and clear registers allow a single instruction to set or clear any number of bits in one port. • Direction control of individual bits. • All I/O default to inputs after reset. • Pull-up/pull-down resistor configuration and open-drain configuration can be programmed through the pin connect block for each GPIO pin. 7.18 12-bit ADC The LPC178x/7x contain one ADC. It is a single 12-bit successive approximation ADC with eight channels and DMA support. 7.18.1 Features • 12-bit successive approximation ADC. • Input multiplexing among eight pins. • Power-down mode. • Measurement range VSS to VREFP. • 12-bit conversion rate: up to 400 kHz. • Individual channels can be selected for conversion. • Burst conversion mode for single or multiple inputs. • Optional conversion on transition of input pin or Timer Match signal. • Individual result registers for each ADC channel to reduce interrupt overhead. • DMA support. 7.19 10-bit DAC The LPC178x/7x contain one DAC. The DAC allows to generate a variable analog output. The maximum output value of the DAC is VREFP.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 53 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.19.1 Features • 10-bit DAC. • Resistor string architecture. • Buffered output. • Power-down mode. • Selectable output drive. • Dedicated conversion timer. • DMA support. 7.20 UARTs Remark: USART4 is not available on part LPC1774FBD144. The LPC178x/7x contain five UARTs. In addition to standard transmit and receive data lines, UART1 also provides a full modem control handshake interface and support for RS-485/9-bit mode allowing both software address detection and automatic address detection using 9-bit mode. The UARTs include a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.20.1 Features • Maximum UART data bit rate of 7.5 MBit/s. • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto-baud capability. • Fractional divider for baud rate control, auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • Support for RS-485/9-bit/EIA-485 mode and multiprocessor addressing. • All UARTs have DMA support for both transmit and receive. • UART1 equipped with standard modem interface signals. This module also provides full support for hardware flow control (auto-CTS/RTS). • USART4 includes an IrDA mode to support infrared communication. • USART4 supports synchronous mode and a smart card mode conforming to ISO7816-3. 7.21 SSP serial I/O controller The LPC178x/7x contain three SSP controllers. The SSP controller is capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 54 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.21.1 Features • Maximum SSP speed of 33 Mbit/s (master) or 10 Mbit/s (slave). • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses. • Synchronous serial communication. • Master or slave operation. • 8-frame FIFOs for both transmit and receive. • 4-bit to 16-bit frame. • DMA transfers supported by GPDMA. 7.22 I2C-bus serial I/O controllers The LPC178x/7x contain three I2C-bus controllers. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line (SCL) and a Serial Data Line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. 7.22.1 Features • All I2C-bus controllers can use standard GPIO pins with bit rates of up to 400 kbit/s (Fast I2C-bus). The I2C0-bus interface uses special open-drain pins with bit rates of up to 400 kbit/s. • The I2C-bus interface supports Fast-mode Plus with bit rates up to 1 Mbit/s for I2C0 using pins P5[2] and P5[3]. • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • Both I2C-bus controllers support multiple address recognition and a bus monitor mode.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 55 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.23 I2S-bus serial I/O controllers The LPC178x/7x contain one I2S-bus interface. The I2S-bus provides a standard communication interface for digital audio applications. The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S connection has one master, which is always the master, and one slave. The I2S interface on the LPC178x/7x provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.23.1 Features • The interface has separate input/output channels each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1, 48) kHz. • Configurable word select period in master mode (separately for I2S input and output). • Two 8 word FIFO data buffers are provided, one for transmit and one for receive. • Generates interrupt requests when buffer levels cross a programmable boundary. • Two DMA requests, controlled by programmable buffer levels. These are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S input and I2S output. 7.24 CAN controller and acceptance filters The LPC178x/7x contain one CAN controller with two channels. The Controller Area Network (CAN) is a serial communications protocol which efficiently supports distributed real-time control with a very high level of security. Its domain of application ranges from high-speed networks to low cost multiplex wiring. The CAN block is intended to support multiple CAN buses simultaneously, allowing the device to be used as a gateway, switch, or router between two of CAN buses in industrial or automotive applications. Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN Library block, but the 8-bit registers of those devices have been combined in 32-bit words to allow simultaneous access in the ARM environment. The main operational difference is that the recognition of received Identifiers, known in CAN terminology as Acceptance Filtering, has been removed from the CAN controllers and centralized in a global Acceptance Filter. 7.24.1 Features • Two CAN controllers and buses. • Data rates to 1 Mbit/s on each bus. • 32-bit register and RAM access. • Compatible with CAN specification 2.0B, ISO 11898-1.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 56 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller • Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN buses. • Acceptance Filter can provide FullCAN-style automatic reception for selected Standard Identifiers. • FullCAN messages can generate interrupts. 7.25 General purpose 32-bit timers/external event counters The LPC178x/7x include four 32-bit timer/counters. The timer/counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts, generate timed DMA requests, or perform other actions at specified timer values, based on four match registers. Each timer/counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.25.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • Counter or timer operation. • Two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. 7.26 Pulse Width Modulator (PWM) The LPC178x/7x contain two standard PWMs. The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC178x/7x. The Timer is designed to count cycles of the system derived clock and optionally switch pins, generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is in addition to these features, and is based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 57 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller Two match registers can be used to provide a single edge controlled PWM output. One match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the PWMMR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 7.26.1 Features • LPC178x/7x has two PWM blocks with Counter or Timer operation (may use the peripheral clock or one of the capture inputs as the clock source). • Seven match registers allow up to 6 single edge controlled or 3 double edge controlled PWM outputs, or a mix of both types. The match registers also allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Supports single edge controlled and/or double edge controlled PWM outputs. Single edge controlled PWM outputs all go high at the beginning of each cycle unless the output is a constant low. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses. • Pulse period and width can be any number of timer counts. This allows complete flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate. • Double edge controlled PWM outputs can be programmed to be either positive going or negative going pulses. • Match register updates are synchronized with pulse outputs to prevent generation of erroneous pulses. Software must ‘release’ new match values before they can become effective. • May be used as a standard 32-bit timer/counter with a programmable 32-bit prescaler if the PWM mode is not enabled. 7.27 Motor control PWM The LPC178x/7x contain one motor control PWM. The motor control PWM is a specialized PWM supporting 3-phase motors and other combinations. Feedback inputs are provided to automatically sense rotor position and use that information to ramp speed up or down. An abort input is also provided that causes the LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 58 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller PWM to immediately release all motor drive outputs. At the same time, the motor control PWM is highly configurable for other generalized timing, counting, capture, and compare applications. The maximum PWM speed is determined by the PWM resolution (n) and the operating frequency f: PWM speed = f/2n (see Table 8). 7.28 Quadrature Encoder Interface (QEI) Remark: The QEI is available on parts LPC1788/87/86 and LPC1778/77/76 A quadrature encoder, also known as a 2-channel incremental encoder, converts angular displacement into two pulse signals. By monitoring both the number of pulses and the relative phase of the two signals, the user can track the position, direction of rotation, and velocity. In addition, a third channel, or index signal, can be used to reset the position counter. The quadrature encoder interface decodes the digital pulses from a quadrature encoder wheel to integrate position over time and determine direction of rotation. In addition, the QEI can capture the velocity of the encoder wheel. 7.28.1 Features • Tracks encoder position. • Increments/decrements depending on direction. • Programmable for 2 or 4 position counting. • Velocity capture using built-in timer. • Velocity compare function with “less than” interrupt. • Uses 32-bit registers for position and velocity. • Three position compare registers with interrupts. • Index counter for revolution counting. • Index compare register with interrupts. • Can combine index and position interrupts to produce an interrupt for whole and partial revolution displacement. • Digital filter with programmable delays for encoder input signals. • Can accept decoded signal inputs (clk and direction). • Connected to APB. 7.29 ARM Cortex-M3 system tick timer The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate a dedicated SYSTICK exception at a 10 ms interval. In the LPC178x/7x, this timer can be clocked from the internal AHB clock or from a device pin. Table 8. PWM speed at operating frequency 120 MHz PWM resolution PWM speed 6 bit 1.875 MHz 8 bit 0.468 MHz 10 bit 0.117 MHzLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 59 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.30 Windowed WatchDog Timer (WWDT) The purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.30.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. • Optional warning interrupt can be generated at a programmable time prior to watchdog time-out. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect feed sequence causes reset or interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 24-bit timer with internal prescaler. • Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in multiples of Tcy(WDCLK) 4. • The Watchdog Clock (WDCLK) source is a dedicated watchdog oscillator, which is always running if the watchdog timer is enabled. 7.31 RTC and backup registers The RTC is a set of counters for measuring time when system power is on, and optionally when it is off. The RTC on the LPC178x/7x is designed to have very low power consumption. The RTC will typically run from the main chip power supply conserving battery power while the rest of the device is powered up. When operating from a battery, the RTC will continue working down to 2.1 V. Battery power can be provided from a standard 3 V lithium button cell. An ultra-low power 32 kHz oscillator provides a 1 Hz clock to the time counting portion of the RTC, moving most of the power consumption out of the time counting function. The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way that will provide less than 1 second per day error when operated at a constant voltage and temperature. The RTC contains a small set of backup registers (20 bytes) for holding data while the main part of the LPC178x/7x is powered off. The RTC includes an alarm function that can wake up the LPC178x/7x from all reduced power modes with a time resolution of 1 s. 7.31.1 Features • Measures the passage of time to maintain a calendar and clock. • Ultra low power design to support battery powered systems. • Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day of Year.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 60 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller • Dedicated power supply pin can be connected to a battery or to the main 3.3 V. • Periodic interrupts can be generated from increments of any field of the time registers. • Backup registers (20 bytes) powered by VBAT. • RTC power supply is isolated from the rest of the chip. 7.32 Event monitor/recorder The event monitor/recorder allows recording of tampering events in sealed product enclosures. Sensors report any attempt to open the enclosure, or to tamper with the device in any other way. The event monitor/recorder stores records of such events when the device is powered only by the backup battery. 7.32.1 Features • Supports three digital event inputs in the VBAT power domain. • An event is defined as a level change at the digital event inputs. • For each event channel, two timestamps mark the first and the last occurrence of an event. Each channel also has a dedicated counter tracking the total number of events. Timestamp values are taken from the RTC. • Runs in VBAT power domain, independent of system power supply. The event/recorder/monitor can therefore operate in Deep power-down mode. • Very low power consumption. • Interrupt available if system is running. • A qualified event can be used as a wake-up trigger. • State of event interrupts accessible by software through GPIO. 7.33 Clocking and power control 7.33.1 Crystal oscillators The LPC178x/7x include four independent oscillators. These are the main oscillator, the IRC oscillator, the watchdog oscillator, and the RTC oscillator. Following reset, the LPC178x/7x will operate from the Internal RC oscillator until switched by software. This allows systems to operate without any external crystal and the boot loader code to operate at a known frequency. See Figure 7 for an overview of the LPC178x/7x clock generation.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 61 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.33.1.1 Internal RC oscillator The IRC may be used as the clock that drives the PLL and subsequently the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire voltage and temperature range. Upon power-up or any chip reset, the LPC178x/7x use the IRC as the clock source. Software may later switch to one of the other available clock sources. 7.33.1.2 Main oscillator The main oscillator can be used as the clock source for the CPU, with or without using the PLL. The main oscillator also provides the clock source for the alternate PLL1. The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the main PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock frequency is referred to as CCLK elsewhere in this document. The frequencies of PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The clock frequency for each peripheral can be selected individually and is referred to as PCLK. Refer to Section 7.33.2 for additional information. Fig 7. LPC178x/7x clock generation block diagram MAIN PLL0 IRC oscillator main oscillator (osc_clk) CLKSRCSEL (system clock select) sysclk pll_clk CCLKSEL (CPU clock select) 002aaf531 pll_clk ALT PLL1 CPU CLOCK DIVIDER alt_pll_clk cclk PERIPHERAL CLOCK DIVIDER pclk EMC CLOCK DIVIDER emc_clk sysclk alt_pll_clk pll_clk USBCLKSEL (USB clock select) USB CLOCK DIVIDER usb_clk sysclk LPC178x/7xLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 62 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.33.1.3 RTC oscillator The RTC oscillator provides a 1 Hz clock to the RTC and a 32 kHz clock output that can be output on the CLKOUT pin in order to allow trimming the RTC oscillator without interference from a probe. 7.33.1.4 Watchdog oscillator The Watchdog Timer has a dedicated watchdog oscillator that provides a 500 kHz clock to the Watchdog Timer. The watchdog oscillator is always running if the Watchdog Timer is enabled. The Watchdog oscillator clock can be output on the CLKOUT pin in order to allow observe its frequency. In order to allow Watchdog Timer operation with minimum power consumption, which can be important in reduced power modes, the Watchdog oscillator frequency is not tightly controlled. The Watchdog oscillator frequency will vary over temperature and power supply within a particular part, and may vary by processing across different parts. This variation should be taken into account when determining Watchdog reload values. Within a particular part, temperature and power supply variations can produce up to a 17 % frequency variation. Frequency variation between devices under the same operating conditions can be up to 30 %. 7.33.2 Main PLL (PLL0) and Alternate PLL (PLL1) PLL0 (also called the Main PLL) and PLL1 (also called the Alternate PLL) are functionally identical but have somewhat different input possibilities and output connections. These possibilities are shown in Figure 7. The Main PLL can receive its input from either the IRC or the main oscillator and can potentially be used to provide the clocks to nearly everything on the device. The Alternate PLL receives its input only from the main oscillator and is intended to be used as an alternate source of clocking to the USB. The USB has timing needs that may not always be filled by the Main PLL. Both PLLs are disabled and powered off on reset. If the Alternate PLL is left disabled, the USB clock can be supplied by PLL0 if everything is set up to provide 48 MHz to the USB clock through that route. The source for each clock must be selected via the CLKSEL registers and can be further reduced by clock dividers as needed. PLL0 accepts an input clock frequency from either the IRC or the main oscillator. If only the Main PLL is used, then its output frequency must be an integer multiple of all other clocks needed in the system. PLL1 takes its input only from the main oscillator, requiring an external crystal in the range of 10 to 25 MHz. In each PLL, the Current Controlled Oscillator (CCO) operates in the range of 156 MHz to 320 MHz, so there are additional dividers to bring the output down to the desired frequencies. The minimum output divider value is 2, insuring that the output of the PLLs have a 50 % duty cycle. If the USB is used, the possibilities for the CPU clock and other clocks will be limited by the requirements that the frequency be precise and very low jitter, and that the PLL0 output must be a multiple of 48 MHz. Even multiples of 48 MHz that are within the operating range of the PLL are 192 MHz and 288 MHz. Also, only the main oscillator in conjunction with the PLL can meet the precision and jitter specifications for USB. It is due to these limitations that the Alternate PLL is provided.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 63 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller The alternate PLL accepts an input clock frequency from the main oscillator in the range of 10 MHz to 25 MHz only. When used as the USB clock, the input frequency is multiplied up to a multiple of 48 MHz (192 MHz or 288 MHz as described above). 7.33.3 Wake-up timer The LPC178x/7x begin operation at power-up and when awakened from Power-down mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation to resume quickly. If the main oscillator or the PLL is needed by the application, software will need to enable these features and wait for them to stabilize before they are used as a clock source. When the main oscillator is initially activated, the wake-up timer allows software to ensure that the main oscillator is fully functional before the processor uses it as a clock source and starts to execute instructions. This is important at power on, all types of reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the wake-up Timer. The wake-up timer monitors the crystal oscillator to check whether it is safe to begin code execution. When power is applied to the chip, or when some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient conditions. 7.33.4 Power control The LPC178x/7x support a variety of power control features. There are four special modes of processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and Deep power-down mode. The CPU clock rate may also be controlled as needed by changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider value. This allows a trade-off of power versus processing speed based on application requirements. In addition, the peripheral power control allows shutting down the clocks to individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all dynamic power use in any peripherals that are not required for the application. Each of the peripherals has its own clock divider which provides even better power control. The integrated PMU (Power Management Unit) automatically adjusts internal regulators to minimize power consumption during Sleep, Deep-sleep, Power-down, and Deep power-down modes. The LPC178x/7x also implement a separate power domain to allow turning off power to the bulk of the device while maintaining operation of the RTC and a small set of registers for storing data during any of the power-down modes. 7.33.4.1 Sleep mode When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep mode does not need any special sequence other than re-enabling the clock to the ARM core.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 64 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller In Sleep mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Sleep mode and may generate interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic power used by the processor itself, memory systems and related controllers, and internal buses. The DMA controller can continue to work in Sleep mode and has access to the peripheral RAMs and all peripheral registers. The flash memory and the main SRAM are not available in Sleep mode, they are disabled in order to save power. Wake-up from Sleep mode will occur whenever any enabled interrupt occurs. 7.33.4.2 Deep-sleep mode In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Deep-sleep mode and the logic levels of chip pins remain static. The output of the IRC is disabled but the IRC is not powered down to allow fast wake-up. The RTC oscillator is not stopped because the RTC interrupts may be used as the wake-up source. The PLL is automatically turned off and disconnected. The clock divider registers are automatically reset to zero. The Deep-sleep mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power consumption to a very low value. Power to the flash memory is left on in Deep-sleep mode, allowing a very quick wake-up. Wake-up from Deep-sleep mode can initiated by the NMI, External Interrupts EINT0 through EINT3, GPIO interrupts, the Ethernet Wake-on-LAN interrupt, Brownout Detect, an RTC Alarm interrupt, a USB input pin transition (USB activity interrupt), a CAN input pin transition, or a Watchdog Timer time-out, when the related interrupt is enabled. Wake-up will occur whenever any enabled interrupt occurs. On wake-up from Deep-sleep mode, the code execution and peripherals activities will resume after four cycles expire if the IRC was used before entering Deep-sleep mode. If the main external oscillator was used, the code execution will resume when 4096 cycles expire. PLL and clock dividers need to be reconfigured accordingly. 7.33.4.3 Power-down mode Power-down mode does everything that Deep-sleep mode does but also turns off the power to the IRC oscillator and the flash memory. This saves more power but requires waiting for resumption of flash operation before execution of code or data access in the flash memory can be accomplished. When the chip enters Power-down mode, the IRC, the main oscillator, and all clocks are stopped. The RTC remains running if it has been enabled and RTC interrupts may be used to wake up the CPU. The flash is forced into Power-down mode. The PLLs are automatically turned off and the clock selection multiplexers are set to use the system clock sysclk (the reset state). The clock divider control registers are automatically reset to zero. If the Watchdog timer is running, it will continue running in Power-down mode.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 65 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller On the wake-up of Power-down mode, if the IRC was used before entering Power-down mode, it will take IRC 60 s to start-up. After this, four IRC cycles will expire before the code execution can then be resumed if the code was running from SRAM. In the meantime, the flash wake-up timer then counts 12 MHz IRC clock cycles to make the 100 s flash start-up time. When it times out, access to the flash will be allowed. Users need to reconfigure the PLL and clock dividers accordingly. 7.33.4.4 Deep power-down mode In Deep power-down mode, power is shut off to the entire chip with the exception of the RTC module and the RESET pin. To optimize power conservation, the user has the additional option of turning off or retaining power to the 32 kHz oscillator. It is also possible to use external circuitry to turn off power to the on-chip regulator via the VDD(REG)(3V3) pins and/or the I/O power via the VDD(3V3) pins after entering Deep Power-down mode. Power must be restored before device operation can be restarted. The LPC178x/7x can wake up from Deep power-down mode via the RESET pin or an alarm match event of the RTC. 7.33.4.5 Wake-up Interrupt Controller (WIC) The WIC allows the CPU to automatically wake up from any enabled priority interrupt that can occur while the clocks are stopped in Deep-sleep, Power-down, and Deep power-down modes. The WIC works in connection with the Nested Vectored Interrupt Controller (NVIC). When the CPU enters Deep-sleep, Power-down, or Deep power-down mode, the NVIC sends a mask of the current interrupt situation to the WIC.This mask includes all of the interrupts that are both enabled and of sufficient priority to be serviced immediately. With this information, the WIC simply notices when one of the interrupts has occurred and then it wakes up the CPU. The WIC eliminates the need to periodically wake up the CPU and poll the interrupts resulting in additional power savings. 7.33.5 Peripheral power control A power control for peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings. 7.33.6 Power domains The LPC178x/7x provide two independent power domains that allow the bulk of the device to have power removed while maintaining operation of the RTC and the backup registers. On the LPC178x/7x, I/O pads are powered by VDD(3V3), while VDD(REG)(3V3) powers the on-chip voltage regulator which in turn provides power to the CPU and most of the peripherals. Depending on the LPC178x/7x application, a design can use two power options to manage power consumption.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 66 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller The first option assumes that power consumption is not a concern and the design ties the VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power supply for both pads, the CPU, and peripherals. While this solution is simple, it does not support powering down the I/O pad ring “on the fly” while keeping the CPU and peripherals alive. The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator powered independently from the I/O pad ring enables shutting down of the I/O pad power supply “on the fly” while the CPU and peripherals stay active. The VBAT pin supplies power only to the RTC domain. The RTC operates at very low power, which can be supplied by an external battery. The device core power (VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. There is no power drain from the RTC battery when VDD(REG)(3V3) is at nominal levels and VDD(REG)(3V3) > VBAT. Fig 8. Power distribution REAL-TIME CLOCK BACKUP REGISTERS REGULATOR 32 kHz OSCILLATOR POWER SELECTOR ULTRA-LOW POWER REGULATOR RTC POWER DOMAIN MAIN POWER DOMAIN 002aaf530 RTCX1 VBAT (typical 3.0 V) VDD(REG)(3V3) (typical 3.3 V) RTCX2 VDD(3V3) VSS to memories, peripherals, oscillators, PLLs to core to I/O pads ADC DAC ADC POWER DOMAIN VDDA VREFP VSSA LPC178x/7xLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 67 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.34 System control 7.34.1 Reset Reset has four sources on the LPC178x/7x: the RESET pin, the Watchdog reset, Power-On Reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains a usable level, starts the Wake-up timer (see description in Section 7.33.3), causing reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is initially the Reset vector mapped from the boot block. At that point, all of the processor and peripheral registers have been initialized to predetermined values. 7.34.2 Brownout detection The LPC178x/7x include 2-stage monitoring of the voltage on the VDD(REG)(3V3) pins. If this voltage falls below 2.2 V (typical), the BOD asserts an interrupt signal to the Vectored Interrupt Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading a dedicated status register. The second stage of low-voltage detection asserts a reset to inactivate the LPC178x/7x when the voltage on the VDD(REG)(3V3) pins falls below 1.85 V (typical). This reset prevents alteration of the flash as operation of the various elements of the chip would otherwise become unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at which point the power-on reset circuitry maintains the overall reset. Both the 2.2 V and 1.85 V thresholds include some hysteresis. In normal operation, this hysteresis allows the 2.2 V detection to reliably interrupt, or a regularly executed event loop to sense the condition. 7.34.3 Code security (Code Read Protection - CRP) This feature of the LPC178x/7x allows user to enable different levels of security in the system so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When needed, CRP is invoked by programming a specific pattern into a dedicated flash location. IAP commands are not affected by the CRP. There are three levels of the Code Read Protection. CRP1 disables access to chip via the JTAG and allows partial flash update (excluding flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is required and flash field updates are needed but all sectors can not be erased. CRP2 disables access to chip via the JTAG and only allows full flash erase and update using a reduced set of the ISP commands. Running an application with level CRP3 selected fully disables any access to chip via the JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too. It is up to the user’s application to provide (if needed) flash update mechanism using IAP calls or call reinvoke ISP command to enable flash update via UART0.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 68 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 7.34.4 APB interface The APB peripherals are split into two separate APB buses in order to distribute the bus bandwidth and thereby reducing stalls caused by contention between the CPU and the GPDMA controller. 7.34.5 AHB multilayer matrix The LPC178x/7x use an AHB multilayer matrix. This matrix connects the instruction (I-code) and data (D-code) CPU buses of the ARM Cortex-M3 to the flash memory, the main (64 kB) SRAM, and the Boot ROM. The GPDMA can also access all of these memories. Additionally, the matrix connects the CPU system bus and all of the DMA controllers to the various peripheral functions. 7.34.6 External interrupt inputs The LPC178x/7x include up to 30 edge sensitive interrupt inputs combined with one level sensitive external interrupt input as selectable pin function. The external interrupt input can optionally be used to wake up the processor from Power-down mode. 7.34.7 Memory mapping control The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table to alternate locations in the memory map. This is controlled via the Vector Table Offset Register contained in the NVIC. The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address space. The vector table must be located on a 128 word (512 byte) boundary because the NVIC on the LPC178x/7x is configured for 128 total interrupts. 7.35 Debug control Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and trace functions are supported in addition to a standard JTAG debug and parallel trace functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four watch points. CAUTION If level three Code Read Protection (CRP3) is selected, no future factory testing can be performed on the device.LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 69 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 8. Limiting values [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] Not to exceed 4.6 V. [4] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on the required shelf lifetime. Please refer to the JEDEC spec for further details. [5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 9. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(3V3) supply voltage (3.3 V) external rail 2.4 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.6 V VDDA analog 3.3 V pad supply voltage 0.5 +4.6 V Vi(VBAT) input voltage on pin VBAT for the RTC 0.5 +4.6 V Vi(VREFP) input voltage on pin VREFP 0.5 +4.6 V VIA analog input voltage on ADC related pins 0.5 +5.1 V VI input voltage 5 V tolerant digital I/O pins; VDD(3V3) 2.4V [2] 0.5 +5.5 V VDD(3V3) 0 V 0.5 +3.6 V other I/O pins [2][3] 0.5 VDD(3V3) + 0.5 V IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA Ilatch I/O latch-up current (0.5VDD(3V3)) < VI < (1.5VDD(3V3)); Tj < 125 C - 100 mA Tstg storage temperature non-operating [4] 65 +150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W VESD electrostatic discharge voltage human body model; all pins [5] - 4000 VLPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 70 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation Table 10. Thermal characteristics VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; Symbol Parameter Min Typ Max Unit Tj(max) maximum junction temperature - - 125 C Table 11. Thermal resistance (LQFP packages) Tamb = 40 C to +85 C unless otherwise specified. Symbol Conditions Thermal resistance in C/W ±15 % LQFP208 LQFP144 ja JEDEC (4.5 in 4 in) 0 m/s 27.4 31.5 1 m/s 25.7 28.1 2.5 m/s 24.4 26.2 Single-layer (4.5 in 3 in) 0 m/s 35.4 43.2 1 m/s 31.2 35.7 2.5 m/s 29.2 32.8 jc - 8.8 7.8 jb - 15.4 13.8 Table 12. Thermal resistance value (TFBGA packages) Tamb = 40 C to +85 C unless otherwise specified. Symbol Conditions Thermal resistance in C/W ±15 % TFBGA208 TFBGA180 ja JEDEC (4.5 in 4 in) 0 m/s 41 45.5 1 m/s 35 38.3 2.5 m/s 31 33.8 8-layer (4.5 in 3 in) 0 m/s 34.9 38 1 m/s 30.9 33.5 2.5 m/s 28 29.8 jc - 8.3 8.9 jb - 13.6 12 Tj Tamb PD Rth j a – += LPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 71 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 10. Static characteristics Table 13. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit Supply pins VDD(3V3) supply voltage (3.3 V) external rail [2] 2.4 3.3 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) 2.4 3.3 3.6 V VDDA analog 3.3 V pad supply voltage [3] 2.7 3.3 3.6 V Vi(VBAT) input voltage on pin VBAT [4] 2.1 3.0 3.6 V Vi(VREFP) input voltage on pin VREFP [3] 2.7 3.3 VDDA V IDD(REG)(3V3) regulator supply current (3.3 V) active mode; code while(1){} executed from flash; all peripherals disabled PCLK = CCLK/4 CCLK = 12 MHz; PLL disabled [5][6] - 7- mA CCLK = 120 MHz; PLL enabled [5][7] - 51- mA active mode; code while(1){} executed from flash; all peripherals enabled; PCLK = CCLK/4 CCLK = 12 MHz; PLL disabled [5][6] 14 CCLK = 120 MHz; PLL enabled [5][7] 100 mA Sleep mode [5][8] - 5- mA Deep-sleep mode [5][9] - 550 - A Power-down mode [5][9] - 280 - A IBAT battery supply current RTC running; part powered down; VDD(REG)(3V3) =0 V; Vi(VBAT) = 3.0 V; VDD(3V3) = 0 V. [10] - 1 - A part powered; VDD(REG)(3V3) = 3.3 V; Vi(VBAT) = 3.0 V [11] <10 nALPC178X_7X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 5 — 9 September 2014 72 of 122 NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller Standard port pins, RESET IIL LOW-level input current VI = 0 V; on-chip pull-up resistor disabled - 0.5 10 nA IIH HIGH-level input current VI = VDD(3V3); on-chip pull-down resistor disabled - 0.5 10 nA IOZ OFF-state output current VO = 0 V; VO = VDD(3V3); on-chip pull-up/down resistors disabled - 0.5 10 nA VI input voltage pin configured to provide a digital function [15][16] [17] 0- 5.0 V VO output voltage output active 0 - VDD(3V3) V VIH HIGH-level input voltage 0.7VDD(3V3) --V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage 0.4 - - V VOH HIGH-level output voltage IOH = 4 mA VDD(3V3) 0.4 --V VOL LOW-level output voltage IOL = 4 mA --0.4 V IOH HIGH-level output current VOH = VDD(3V3) 0.4 V 4 - - mA IOL LOW-level output current VOL = 0.4 V 4- - mA IOHS HIGH-level short-circuit output current VOH =0V [18] - - 45 mA IOLS LOW-level short-circuit output current VOL = VDD(3V3) [18] --50 mA Ipd pull-down current VI =5V 10 50 150 A Ipu pull-up current VI =0V 15 50 85 A VDD(3V3) < VI <5V 0 0 0 A I 2C-bus pins (P0[27] and P0[28]) VIH HIGH-level input voltage 0.7VDD(3V3) --V VIL LOW-level input voltage - - 0.3VDD(3V3) V Vhys hysteresis voltage - 0.05 VDD(3V3) - V VOL LOW-level output voltage IOLS = 3 mA --0.4 V ILI input leakage current VI = VDD(3V3) [19] - 24 A VI =5V - 10 22 A USB pins IOZ OFF-state output current 0V > NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 5 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 8 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 9 7 Functional description . . . . . . . . . . . . . . . . . . 40 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 40 7.2 ARM Cortex-M3 processor . . . . . . . . . . . . . . . 41 7.3 On-chip flash program memory . . . . . . . . . . . 41 7.4 EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 7.5 On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 41 7.6 Memory Protection Unit (MPU). . . . . . . . . . . . 41 7.7 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 42 7.8 Nested Vectored Interrupt Controller (NVIC) . 44 7.8.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 7.8.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 44 7.9 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 44 7.10 External memory controller. . . . . . . . . . . . . . . 44 7.10.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 7.11 General purpose DMA controller . . . . . . . . . . 46 7.11.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 7.12 CRC engine . . . . . . . . . . . . . . . . . . . . . . . . . . 47 7.12.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 7.13 LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 48 7.13.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 7.14 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 7.14.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 7.15 USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 50 7.15.1 USB device controller . . . . . . . . . . . . . . . . . . . 50 7.15.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 7.15.2 USB host controller. . . . . . . . . . . . . . . . . . . . . 50 7.15.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 7.15.3 USB OTG controller . . . . . . . . . . . . . . . . . . . . 51 7.15.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 7.16 SD/MMC card interface . . . . . . . . . . . . . . . . . 51 7.16.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 7.17 Fast general purpose parallel I/O . . . . . . . . . . 51 7.17.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 7.18 12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 7.18.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 7.19 10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 7.19.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 7.20 UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 7.20.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 7.21 SSP serial I/O controller. . . . . . . . . . . . . . . . . 53 7.21.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 7.22 I2C-bus serial I/O controllers . . . . . . . . . . . . . 54 7.22.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 7.23 I2S-bus serial I/O controllers . . . . . . . . . . . . . 55 7.23.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 7.24 CAN controller and acceptance filters . . . . . . 55 7.24.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 7.25 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . 56 7.25.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 7.26 Pulse Width Modulator (PWM). . . . . . . . . . . . 56 7.26.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 7.27 Motor control PWM . . . . . . . . . . . . . . . . . . . . 57 7.28 Quadrature Encoder Interface (QEI) . . . . . . . 58 7.28.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 7.29 ARM Cortex-M3 system tick timer . . . . . . . . . 58 7.30 Windowed WatchDog Timer (WWDT) . . . . . . 59 7.30.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.31 RTC and backup registers . . . . . . . . . . . . . . . 59 7.31.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.32 Event monitor/recorder . . . . . . . . . . . . . . . . . 60 7.32.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 7.33 Clocking and power control . . . . . . . . . . . . . . 60 7.33.1 Crystal oscillators. . . . . . . . . . . . . . . . . . . . . . 60 7.33.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . . 61 7.33.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . . 61 7.33.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 62 7.33.1.4 Watchdog oscillator . . . . . . . . . . . . . . . . . . . . 62 7.33.2 Main PLL (PLL0) and Alternate PLL (PLL1) . 62 7.33.3 Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . . 63 7.33.4 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.33.4.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.33.4.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . . 64 7.33.4.3 Power-down mode . . . . . . . . . . . . . . . . . . . . . 64 7.33.4.4 Deep power-down mode . . . . . . . . . . . . . . . . 65 7.33.4.5 Wake-up Interrupt Controller (WIC) . . . . . . . . 65 7.33.5 Peripheral power control . . . . . . . . . . . . . . . . 65 7.33.6 Power domains . . . . . . . . . . . . . . . . . . . . . . . 65 7.34 System control . . . . . . . . . . . . . . . . . . . . . . . . 67 7.34.1 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 7.34.2 Brownout detection . . . . . . . . . . . . . . . . . . . . 67 7.34.3 Code security (Code Read Protection - CRP) 67 7.34.4 APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.34.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . 68 7.34.6 External interrupt inputs . . . . . . . . . . . . . . . . . 68 7.34.7 Memory mapping control . . . . . . . . . . . . . . . . 68 7.35 Debug control. . . . . . . . . . . . . . . . . . . . . . . . . 68NXP Semiconductors LPC178x/7x 32-bit ARM Cortex-M3 microcontroller © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 September 2014 Document identifier: LPC178X_7X Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 69 9 Thermal characteristics . . . . . . . . . . . . . . . . . 70 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 71 10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 74 10.2 Peripheral power consumption . . . . . . . . . . . . 76 10.3 Electrical pin characteristics . . . . . . . . . . . . . . 78 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 80 11.1 Flash memory. . . . . . . . . . . . . . . . . . . . . . . . . 80 11.2 External memory interface . . . . . . . . . . . . . . . 81 11.3 External clock . . . . . . . . . . . . . . . . . . . . . . . . . 87 11.4 Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 87 11.5 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 11.6 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 88 11.7 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 11.8 I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . . 91 11.9 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 11.10 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 12 ADC electrical characteristics . . . . . . . . . . . . 94 13 DAC electrical characteristics . . . . . . . . . . . . 97 14 Application information. . . . . . . . . . . . . . . . . . 98 14.1 Suggested USB interface solutions . . . . . . . . 98 14.2 Crystal oscillator XTAL input and component selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 14.3 XTAL Printed-Circuit Board (PCB) layout guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 14.4 Standard I/O pin configuration . . . . . . . . . . . 104 14.5 Reset pin configuration. . . . . . . . . . . . . . . . . 105 14.6 Reset pin configuration for RTC operation . . 105 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . 107 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 17 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 114 18 References . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 19 Revision history. . . . . . . . . . . . . . . . . . . . . . . 116 20 Legal information. . . . . . . . . . . . . . . . . . . . . . 119 20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 119 20.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . 119 20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 119 20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 120 21 Contact information. . . . . . . . . . . . . . . . . . . . 120 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 1. General description The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embedded applications which include an ARM Cortex-M0 coprocessor, up to 264 kB of SRAM, advanced configurable peripherals such as the State Configurable Timer/PWM (SCTimer/PWM) and the Serial General-Purpose I/O (SGPIO) interface, two High-speed USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals. The LPC4350/30/20/10 operate at CPU frequencies of up to 204 MHz. The ARM Cortex-M4 is a next generation 32-bit core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point processor is integrated in the core. The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core which is code- and tool-compatible with the Cortex-M4 core. The Cortex-M0 coprocessor offers up to 204 MHz performance with a simple instruction set and reduced code size. See Section 17 “References” for additional documentation. 2. Features and benefits Cortex-M4 Processor core ARM Cortex-M4 processor, running at frequencies of up to 204 MHz. ARM Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions. ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC). Hardware floating-point unit. Non-maskable Interrupt (NMI) input. JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch points. Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support. System tick timer. Cortex-M0 Processor core ARM Cortex-M0 co-processor capable of off-loading the main ARM Cortex-M4 application processor. Running at frequencies of up to 204 MHz. JTAG and built-in NVIC. LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 flashless MCU; up to 264 kB SRAM; Ethernet; two HS USBs; advanced configurable peripherals Rev. 4.2 — 18 August 2014 Product data sheetLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 2 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller On-chip memory Up to 264 kB SRAM for code and data use. Multiple SRAM blocks with separate bus access. Two SRAM blocks can be powered down individually. 64 kB ROM containing boot code and on-chip software drivers. 64 bit + 256 bit general-purpose One-Time Programmable (OTP) memory. Clock generation unit Crystal oscillator with an operating range of 1 MHz to 25 MHz. 12 MHz Internal RC (IRC) oscillator trimmed to 1.5 % accuracy over temperature and voltage. Ultra-low power Real-Time Clock (RTC) crystal oscillator. Three PLLs allow CPU operation up to the maximum CPU rate without the need for a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the third PLL can be used as audio PLL. Clock output. Configurable digital peripherals Serial GPIO (SGPIO) interface. State Configurable Timer (SCTimer/PWM) subsystem on AHB. Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and outputs to event driven peripherals like the timers, SCT, and ADC0/1. Serial interfaces Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 52 MB per second. 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time stamping (IEEE 1588-2008 v2). One High-speed USB 2.0 Host/Device/OTG interface with DMA support and on-chip high-speed PHY (USB0). One High-speed USB 2.0 Host/Device interface with DMA support, on-chip full-speed PHY and ULPI interface to external high-speed PHY (USB1). USB interface electrical test software included in ROM USB stack. Four 550 UARTs with DMA support: one UART with full modem interface; one UART with IrDA interface; three USARTs support UART synchronous mode and a smart card interface conforming to ISO7816 specification. Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controller excludes operation of all other peripherals connected to the same bus bridge. See Figure 1 and Ref. 2. Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA support. One SPI controller. One Fast-mode Plus I2C-bus interface with monitor mode and with open-drain I/O pins conforming to the full I2C-bus specification. Supports data rates of up to 1 Mbit/s. One standard I2C-bus interface with monitor mode and with standard I/O pins. Two I2S interfaces, each with DMA support and with one input and one output.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 3 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Digital peripherals External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash, and SDRAM devices. LCD controller with DMA support and a programmable display resolution of up to 1024 H 768 V. Supports monochrome and color STN panels and TFT color panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel mapping. Secure Digital Input Output (SD/MMC) card interface. Eight-channel General-Purpose DMA controller can access all memories on the AHB and all DMA-capable AHB slaves. Up to 164 General-Purpose Input/Output (GPIO) pins with configurable pull-up/pull-down resistors. GPIO registers are located on the AHB for fast access. GPIO ports have DMA support. Up to eight GPIO pins can be selected from all GPIO pins as edge and level sensitive interrupt sources. Two GPIO group interrupt modules enable an interrupt based on a programmable pattern of input states of a group of GPIO pins. Four general-purpose timer/counters with capture and match capabilities. One motor control Pulse Width Modulator (PWM) for three-phase motor control. One Quadrature Encoder Interface (QEI). Repetitive Interrupt timer (RI timer). Windowed watchdog timer (WWDT). Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes of battery powered backup registers. Alarm timer; can be battery powered. Analog peripherals One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s. Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s. Up to eight input channels per ADC. Unique ID for each device. Power Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip internal voltage regulator for the core supply and the RTC power domain. RTC power domain can be powered separately by a 3 V battery supply. Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down. Processor wake-up from Sleep mode via wake-up interrupts from various peripherals. Wake-up from Deep-sleep, Power-down, and Deep power-down modes via external interrupts and interrupts generated by battery powered blocks in the RTC power domain. Brownout detect with four separate thresholds for interrupt and forced reset. Power-On Reset (POR). Available as LBGA256, TFBGA180, and TFBGA100 packages and as LQFP144 package.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 4 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 3. Applications Motor control Embedded audio applications Power management Industrial automation White goods e-metering RFID readersLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 5 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 4. Ordering information 4.1 Ordering options Table 1. Ordering information Type number Package Name Description Version LPC4350FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm SOT740-2 LPC4350FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3 LPC4330FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17 17 1 mm SOT740-2 LPC4330FET180 TFBGA180 Thin fine-pitch ball grid array package; 180 balls SOT570-3 LPC4330FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1 LPC4330FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1 LPC4320FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1 LPC4320FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1 LPC4310FET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9 9 0.7 mm SOT926-1 LPC4310FBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20 20 1.4 mm SOT486-1 Table 2. Ordering options Type number Total SRAM LCD Ethernet USB0 (Host, Device, OTG) USB1 (Host, Device)/ ULPI interface ADC channels PWM QEI GPIO Package LPC4350FET256 264 kB yes yes yes yes/yes 8 yes yes 164 LBGA256 LPC4350FET180 264 kB yes yes yes yes/yes 8 yes yes 118 TFBGA180 LPC4330FET256 264 kB no yes yes yes/yes 8 yes yes 164 LBGA256 LPC4330FET180 264 kB no yes yes yes/yes 8 yes yes 118 TFBGA180 LPC4330FET100 264 kB no yes yes yes/no 4 no no 49 TFBGA100 LPC4330FBD144 264 kB no yes yes yes/no 8 yes no 83 LQFP144 LPC4320FET100 200 kB no no yes no 4 no no 49 TFBGA100 LPC4320FBD144 200 kB no no yes no 8 yes no 83 LQFP144 LPC4310FET100 168 kB no no no no 4 no no 49 TFBGA100 LPC4310FBD144 168 kB no no no no 8 yes no 83 LQFP144LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 6 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 5. Block diagram (1) Not available on all parts (see Table 2). Fig 1. LPC4350/30/20/10 Block diagram ARM CORTEX-M4 TEST/DEBUG INTERFACE I-code bus D-code bus system bus DMA LCD(1) SD/ MMC ETHERNET(1) 10/100 MAC IEEE 1588 HIGH-SPEED USB0(1) HOST/ DEVICE/OTG HIGH-SPEED USB1(1) HOST/DEVICE EMC HIGH-SPEED PHY 32 kB AHB SRAM 16 +16 kB AHB SRAM SPIFI AES ENCRYPTION/ DECRYPTION(2) HS GPIO SPI SGPIO SCT 64 kB ROM I 2C0 I 2S0 I 2S1 C_CAN1 MOTOR CONTROL PWM(1) TIMER3 TIMER2 USART2 USART3 SSP1 RI TIMER QEI(1) GIMA BRIDGE 0 BRIDGE 1 BRIDGE 2 BRIDGE 3 BRIDGE BRIDGE AHB MULTILAYER MATRIX LPC4350/30/20/20/10 128 kB LOCAL SRAM 72 kB LOCAL SRAM 10-bit ADC0 10-bit ADC1 C_CAN0 I 2C1 10-bit DAC BRIDGE RGU CCU2 CGU CCU1 ALARM TIMER CONFIGURATION REGISTERS OTP MEMORY EVENT ROUTER POWER MODE CONTROL 12 MHz IRC RTC POWER DOMAIN BACKUP REGISTERS RTC RTC OSC 002aaf772 slaves slaves masters ARM CORTEX-M0 TEST/DEBUG INTERFACE = connected to GPDMA GPIO INTERRUPTS GPIO GROUP0 INTERRUPT GPIO GROUP1 INTERRUPT WWDT USART0 UART1 SSP0 TIMER0 TIMER1 SCULPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 7 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 6. Pinning information 6.1 Pinning 6.2 Pin description On the LPC4350/30/20/10, digital pins are grouped into 16 ports, named P0 to P9 and PA to PF, with up to 20 pins used per port. Each digital pin can support up to eight different digital functions, including General-Purpose I/O (GPIO), selectable through the System Configuration Unit (SCU) registers. The pin name is not indicative of the GPIO port assigned to it. Fig 2. Pin configuration LBGA256 package Fig 3. Pin configuration TFBGA180 package 002aaf813 LPC4350/30FET256 Transparent top view T R P N M L J G K H F E D C B A 2 4 6 8 10 12 13 14 15 16 1 3 5 7 9 11 ball A1 index area 002aag374 LPC4350/30FET180 Transparent top view N L P M K J H G F D B E C A 2 4 6 8 10 12 13 14 1 3 5 7 9 11 ball A1 index area Fig 4. Pin configuration TFBGA100 package Fig 5. Pin configuration LQFP144 package 002aag375 LPC4330/20/10FET100 Transparent top view J G K H F E D C B A 13579 2 4 6 8 10 ball A1 index area LPC4330/20/10FBD144 72 1 36 108 73 37 109 144 002aag377LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 8 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Not all functions listed in Table 3 are available on all packages. See Table 2 for availability of USB0, USB1, Ethernet, and LCD functions. The parts contain two 10-bit ADCs (ADC0 and ADC1). The input channels of ADC0 and ADC1 on dedicated pins and multiplexed pins are combined in such a way that all channel 0 inputs (named ADC0_0 and ADC1_0) are tied together and connected to both, channel 0 on ADC0 and channel 0 on ADC1, channel 1 inputs (named ADC0_1 and ADC1_1) are tied together and connected to channel 1 on ADC0 and ADC1, and so forth. There are eight ADC channels total for the two ADCs.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 9 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Table 3. Pin description LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type Description Multiplexed digital pins P0_0 L3 K3 G2 32 [2] N; PU I/O GPIO0[0] — General purpose digital input/output pin. I/O SSP1_MISO — Master In Slave Out for SSP1. I ENET_RXD1 — Ethernet receive data 1 (RMII/MII interface). I/O SGPIO0 — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I/O I2S1_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. P0_1 M2 K2 G1 34 [2] N; PU I/O GPIO0[1] — General purpose digital input/output pin. I/O SSP1_MOSI — Master Out Slave in for SSP1. I ENET_COL — Ethernet Collision detect (MII interface). I/O SGPIO1 — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. P1_0 P2 L1 H1 38 [2] N; PU I/O GPIO0[4] — General purpose digital input/output pin. I CTIN_3 — SCTimer/PWM input 3. Capture input 1 of timer 1. I/O EMC_A5 — External memory address line 5. - R — Function reserved. - R — Function reserved. I/O SSP0_SSEL — Slave Select for SSP0. I/O SGPIO7 — General purpose digital input/output pin. - R — Function reserved.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 10 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P1_1 R2 N1 K2 42 [2] N; PU I/O GPIO0[8] — General purpose digital input/output pin. Boot pin (see Table 5). O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer 1. I/O EMC_A6 — External memory address line 6. I/O SGPIO8 — General purpose digital input/output pin. - R — Function reserved. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. - R — Function reserved. P1_2 R3 N2 K1 43 [2] N; PU I/O GPIO0[9] — General purpose digital input/output pin. Boot pin (see Table 5). O CTOUT_6 — SCTimer/PWM output 6. Match output 2 of timer 1. I/O EMC_A7 — External memory address line 7. I/O SGPIO9 — General purpose digital input/output pin. - R — Function reserved. I/O SSP0_MOSI — Master Out Slave in for SSP0. - R — Function reserved. - R — Function reserved. P1_3 P5 M2 J1 44 [2] N; PU I/O GPIO0[10] — General purpose digital input/output pin. O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer 2. I/O SGPIO10 — General purpose digital input/output pin. O EMC_OE — LOW active Output Enable signal. O USB0_IND1 — USB0 port indicator LED control output 1. I/O SSP1_MISO — Master In Slave Out for SSP1. - R — Function reserved. O SD_RST — SD/MMC reset signal for MMC4.4 card. P1_4 T3 P2 J2 47 [2] N; PU I/O GPIO0[11] — General purpose digital input/output pin. O CTOUT_9 — SCTimer/PWM output 9. Match output 3 of timer 3. I/O SGPIO11 — General purpose digital input/output pin. O EMC_BLS0 — LOW active Byte Lane select signal 0. O USB0_IND0 — USB0 port indicator LED control output 0. I/O SSP1_MOSI — Master Out Slave in for SSP1. - R — Function reserved. O SD_VOLT1 — SD/MMC bus voltage select output 1. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 11 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P1_5 R5 N3 J4 48 [2] N; PU I/O GPIO1[8] — General purpose digital input/output pin. O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of timer 3. - R — Function reserved. O EMC_CS0 — LOW active Chip Select 0 signal. I USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). I/O SSP1_SSEL — Slave Select for SSP1. I/O SGPIO15 — General purpose digital input/output pin. O SD_POW — SD/MMC power monitor output. P1_6 T4 P3 K4 49 [2] N; PU I/O GPIO1[9] — General purpose digital input/output pin. I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2. - R — Function reserved. O EMC_WE — LOW active Write Enable signal. - R — Function reserved. - R — Function reserved. I/O SGPIO14 — General purpose digital input/output pin. I/O SD_CMD — SD/MMC command signal. P1_7 T5 N4 G4 50 [2] N; PU I/O GPIO1[0] — General purpose digital input/output pin. I U1_DSR — Data Set Ready input for UART1. O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of timer 3. I/O EMC_D0 — External memory data line 0. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 12 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P1_8 R7 M5 H5 51 [2] N; PU I/O GPIO1[1] — General purpose digital input/output pin. O U1_DTR — Data Terminal Ready output for UART1. O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of timer 3. I/O EMC_D1 — External memory data line 1. - R — Function reserved. - R — Function reserved. - R — Function reserved. O SD_VOLT0 — SD/MMC bus voltage select output 0. P1_9 T7 N5 J5 52 [2] N; PU I/O GPIO1[2] — General purpose digital input/output pin. O U1_RTS — Request to Send output for UART1. O CTOUT_11 — SCTimer/PWM output 11. Match output 3 of timer 2. I/O EMC_D2 — External memory data line 2. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SD_DAT0 — SD/MMC data bus line 0. P1_10 R8 N6 H6 53 [2] N; PU I/O GPIO1[3] — General purpose digital input/output pin. I U1_RI — Ring Indicator input for UART1. O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of timer 3. I/O EMC_D3 — External memory data line 3. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SD_DAT1 — SD/MMC data bus line 1. P1_11 T9 P8 J7 55 [2] N; PU I/O GPIO1[4] — General purpose digital input/output pin. I U1_CTS — Clear to Send input for UART1. O CTOUT_15 — SCTimer/PWM output 15. Match output 3 of timer 3. I/O EMC_D4 — External memory data line 4. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SD_DAT2 — SD/MMC data bus line 2. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 13 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P1_12 R9 P7 K7 56 [2] N; PU I/O GPIO1[5] — General purpose digital input/output pin. I U1_DCD — Data Carrier Detect input for UART1. - R — Function reserved. I/O EMC_D5 — External memory data line 5. I T0_CAP1 — Capture input 1 of timer 0. - R — Function reserved. I/O SGPIO8 — General purpose digital input/output pin. I/O SD_DAT3 — SD/MMC data bus line 3. P1_13 R10 L8 H8 60 [2] N; PU I/O GPIO1[6] — General purpose digital input/output pin. O U1_TXD — Transmitter output for UART1. - R — Function reserved. I/O EMC_D6 — External memory data line 6. I T0_CAP0 — Capture input 0 of timer 0. - R — Function reserved. I/O SGPIO9 — General purpose digital input/output pin. I SD_CD — SD/MMC card detect input. P1_14 R11 K7 J8 61 [2] N; PU I/O GPIO1[7] — General purpose digital input/output pin. I U1_RXD — Receiver input for UART1. - R — Function reserved. I/O EMC_D7 — External memory data line 7. O T0_MAT2 — Match output 2 of timer 0. - R — Function reserved. I/O SGPIO10 — General purpose digital input/output pin. - R — Function reserved. P1_15 T12 P11 K8 62 [2] N; PU I/O GPIO0[2] — General purpose digital input/output pin. O U2_TXD — Transmitter output for USART2. I/O SGPIO2 — General purpose digital input/output pin. I ENET_RXD0 — Ethernet receive data 0 (RMII/MII interface). O T0_MAT1 — Match output 1 of timer 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 14 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P1_16 M7 L5 H9 64 [2] N; PU I/O GPIO0[3] — General purpose digital input/output pin. I U2_RXD — Receiver input for USART2. I/O SGPIO3 — General purpose digital input/output pin. I ENET_CRS — Ethernet Carrier Sense (MII interface). O T0_MAT0 — Match output 0 of timer 0. - R — Function reserved. - R — Function reserved. I ENET_RX_DV — Ethernet Receive Data Valid (RMII/MII interface). P1_17 M8 L6 H10 66 [3] N; PU I/O GPIO0[12] — General purpose digital input/output pin. I/O U2_UCLK — Serial clock input/output for USART2 in synchronous mode. - R — Function reserved. I/O ENET_MDIO — Ethernet MIIM data input and output. I T0_CAP3 — Capture input 3 of timer 0. O CAN1_TD — CAN1 transmitter output. I/O SGPIO11 — General purpose digital input/output pin. - R — Function reserved. P1_18 N12 N10 J10 67 [2] N; PU I/O GPIO0[13] — General purpose digital input/output pin. I/O U2_DIR — RS-485/EIA-485 output enable/direction control for USART2. - R — Function reserved. O ENET_TXD0 — Ethernet transmit data 0 (RMII/MII interface). O T0_MAT3 — Match output 3 of timer 0. I CAN1_RD — CAN1 receiver input. I/O SGPIO12 — General purpose digital input/output pin. - R — Function reserved. P1_19 M11 N9 K9 68 [2] N; PU I ENET_TX_CLK (ENET_REF_CLK) — Ethernet Transmit Clock (MII interface) or Ethernet Reference Clock (RMII interface). I/O SSP1_SCK — Serial clock for SSP1. - R — Function reserved. - R — Function reserved. O CLKOUT — Clock output pin. - R — Function reserved. O I2S0_RX_MCLK — I2S receive master clock. I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 15 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P1_20 M10 J10 K10 70 [2] N; PU I/O GPIO0[15] — General purpose digital input/output pin. I/O SSP1_SSEL — Slave Select for SSP1. - R — Function reserved. O ENET_TXD1 — Ethernet transmit data 1 (RMII/MII interface). I T0_CAP2 — Capture input 2 of timer 0. - R — Function reserved. I/O SGPIO13 — General purpose digital input/output pin. - R — Function reserved. P2_0 T16 N14 G10 75 [2] N; PU I/O SGPIO4 — General purpose digital input/output pin. O U0_TXD — Transmitter output for USART0. I/O EMC_A13 — External memory address line 13. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. I/O GPIO5[0] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP0 — Capture input 0 of timer 3. O ENET_MDC — Ethernet MIIM clock. P2_1 N15 M13 G7 81 [2] N; PU I/O SGPIO5 — General purpose digital input/output pin. I U0_RXD — Receiver input for USART0. I/O EMC_A12 — External memory address line 12. I USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). I/O GPIO5[1] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP1 — Capture input 1 of timer 3. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 16 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P2_2 M15 L13 F5 84 [2] N; PU I/O SGPIO6 — General purpose digital input/output pin. I/O U0_UCLK — Serial clock input/output for USART0 in synchronous mode. I/O EMC_A11 — External memory address line 11. O USB0_IND1 — USB0 port indicator LED control output 1. I/O GPIO5[2] — General purpose digital input/output pin. I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3. I T3_CAP2 — Capture input 2 of timer 3. - R — Function reserved. P2_3 J12 G11 D8 87 [3] N; PU I/O SGPIO12 — General purpose digital input/output pin. I/O I2C1_SDA — I 2C1 data input/output (this pin does not use a specialized I2C pad). O U3_TXD — Transmitter output for USART3. I CTIN_1 — SCTimer/PWM input 1. Capture input 1 of timer 0. Capture input 1 of timer 2. I/O GPIO5[3] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT0 — Match output 0 of timer 3. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. P2_4 K11 L9 D9 88 [3] N; PU I/O SGPIO13 — General purpose digital input/output pin. I/O I2C1_SCL — I 2C1 clock input/output (this pin does not use a specialized I2C pad). I U3_RXD — Receiver input for USART3. I CTIN_0 — SCTimer/PWM input 0. Capture input 0 of timer 0, 1, 2, 3. I/O GPIO5[4] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT1 — Match output 1 of timer 3. I USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 17 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P2_5 K14 J12 D10 91 [3] N; PU I/O SGPIO14 — General purpose digital input/output pin. I CTIN_2 — SCTimer/PWM input 2. Capture input 2 of timer 0. I USB1_VBUS — Monitors the presence of USB1 bus power. Note: This signal must be HIGH for USB reset to occur. I ADCTRIG1 — ADC trigger input 1. I/O GPIO5[5] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT2 — Match output 2 of timer 3. O USB0_IND0 — USB0 port indicator LED control output 0. P2_6 K16 J14 G9 95 [2] N; PU I/O SGPIO7 — General purpose digital input/output pin. I/O U0_DIR — RS-485/EIA-485 output enable/direction control for USART0. I/O EMC_A10 — External memory address line 10. O USB0_IND0 — USB0 port indicator LED control output 0. I/O GPIO5[6] — General purpose digital input/output pin. I CTIN_7 — SCTimer/PWM input 7. I T3_CAP3 — Capture input 3 of timer 3. - R — Function reserved. P2_7 H14 G12 C10 96 [2] N; PU I/O GPIO0[7] — General purpose digital input/output pin. If this pin is pulled LOW at reset, the part enters ISP mode using USART0. O CTOUT_1 — SCTimer/PWM output 1. Match output 3 of timer 3. I/O U3_UCLK — Serial clock input/output for USART3 in synchronous mode. I/O EMC_A9 — External memory address line 9. - R — Function reserved. - R — Function reserved. O T3_MAT3 — Match output 3 of timer 3. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 18 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P2_8 J16 H14 C6 98 [2] N; PU I/O SGPIO15 — General purpose digital input/output pin. Boot pin (see Table 5). O CTOUT_0 — SCTimer/PWM output 0. Match output 0 of timer 0. I/O U3_DIR — RS-485/EIA-485 output enable/direction control for USART3. I/O EMC_A8 — External memory address line 8. I/O GPIO5[7] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. P2_9 H16 G14 B10 102 [2] N; PU I/O GPIO1[10] — General purpose digital input/output pin. Boot pin (see Table 5. O CTOUT_3 — SCTimer/PWM output 3. Match output 3 of timer 0. I/O U3_BAUD — Baud pin for USART3. I/O EMC_A0 — External memory address line 0. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. P2_10 G16 F14 E8 104 [2] N; PU I/O GPIO0[14] — General purpose digital input/output pin. O CTOUT_2 — SCTimer/PWM output 2. Match output 2 of timer 0. O U2_TXD — Transmitter output for USART2. I/O EMC_A1 — External memory address line 1. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. P2_11 F16 E13 A9 105 [2] N; PU I/O GPIO1[11] — General purpose digital input/output pin. O CTOUT_5 — SCTimer/PWM output 5. Match output 3 of timer 3. I U2_RXD — Receiver input for USART2. I/O EMC_A2 — External memory address line 2. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 19 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P2_12 E15 D13 B9 106 [2] N; PU I/O GPIO1[12] — General purpose digital input/output pin. O CTOUT_4 — SCTimer/PWM output 4. Match output 3 of timer 3. - R — Function reserved. I/O EMC_A3 — External memory address line 3. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O U2_UCLK — Serial clock input/output for USART2 in synchronous mode. P2_13 C16 E14 A10 108 [2] N; PU I/O GPIO1[13] — General purpose digital input/output pin. I CTIN_4 — SCTimer/PWM input 4. Capture input 2 of timer 1. - R — Function reserved. I/O EMC_A4 — External memory address line 4. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O U2_DIR — RS-485/EIA-485 output enable/direction control for USART2. P3_0 F13 D12 A8 112 [2] N; PU I/O I2S0_RX_SCK — I2S receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. O I2S0_RX_MCLK — I2S receive master clock. I/O I2S0_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. O I2S0_TX_MCLK — I2S transmit master clock. I/O SSP0_SCK — Serial clock for SSP0. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 20 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P3_1 G11 D10 F7 114 [2] N; PU I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I/O I2S0_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I CAN0_RD — CAN receiver input. O USB1_IND1 — USB1 Port indicator LED control output 1. I/O GPIO5[8] — General purpose digital input/output pin. - R — Function reserved. O LCD_VD15 — LCD data. - R — Function reserved. P3_2 F11 D9 G6 116 [2] OL; PU I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. I/O I2S0_RX_SDA — I2S Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. O CAN0_TD — CAN transmitter output. O USB1_IND0 — USB1 Port indicator LED control output 0. I/O GPIO5[9] — General purpose digital input/output pin. - R — Function reserved. O LCD_VD14 — LCD data. - R — Function reserved. P3_3 B14 B13 A7 118 [4] N; PU - R — Function reserved. I/O SPI_SCK — Serial clock for SPI. I/O SSP0_SCK — Serial clock for SSP0. O SPIFI_SCK — Serial clock for SPIFI. O CGU_OUT1 — CGU spare clock output 1. - R — Function reserved. O I2S0_TX_MCLK — I2S transmit master clock. I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 21 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P3_4 A15 C14 B8 119 [2] N; PU I/O GPIO1[14] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SPIFI_SIO3 — I/O lane 3 for SPIFI. O U1_TXD — Transmitter output for UART 1. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I/O I2S1_RX_SDA — I2S1 Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. O LCD_VD13 — LCD data. P3_5 C12 C11 B7 121 [2] N; PU I/O GPIO1[15] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SPIFI_SIO2 — I/O lane 2 for SPIFI. I U1_RXD — Receiver input for UART 1. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. I/O I2S1_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. O LCD_VD12 — LCD data. P3_6 B13 B12 C7 122 [2] N; PU I/O GPIO0[6] — General purpose digital input/output pin. I/O SPI_MISO — Master In Slave Out for SPI. I/O SSP0_SSEL — Slave Select for SSP0. I/O SPIFI_MISO — Input 1 in SPIFI quad mode; SPIFI output IO1. - R — Function reserved. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. - R — Function reserved. P3_7 C11 C10 D7 123 [2] N; PU - R — Function reserved. I/O SPI_MOSI — Master Out Slave In for SPI. I/O SSP0_MISO — Master In Slave Out for SSP0. I/O SPIFI_MOSI — Input I0 in SPIFI quad mode; SPIFI output IO0. I/O GPIO5[10] — General purpose digital input/output pin. I/O SSP0_MOSI — Master Out Slave in for SSP0. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 22 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P3_8 C10 C9 E7 124 [2] N; PU - R — Function reserved. I SPI_SSEL — Slave Select for SPI. Note that this pin in an input pin only. The SPI in master mode cannot drive the CS input on the slave. Any GPIO pin can be used for SPI chip select in master mode. I/O SSP0_MOSI — Master Out Slave in for SSP0. I/O SPIFI_CS — SPIFI serial flash chip select. I/O GPIO5[11] — General purpose digital input/output pin. I/O SSP0_SSEL — Slave Select for SSP0. - R — Function reserved. - R — Function reserved. P4_0 D5 D4 - 1 [2] N; PU I/O GPIO2[0] — General purpose digital input/output pin. O MCOA0 — Motor control PWM channel 0, output A. I NMI — External interrupt input to NMI. - R — Function reserved. - R — Function reserved. O LCD_VD13 — LCD data. I/O U3_UCLK — Serial clock input/output for USART3 in synchronous mode. - R — Function reserved. P4_1 A1 D3 - 3 [5] N; PU I/O GPIO2[1] — General purpose digital input/output pin. O CTOUT_1 — SCTimer/PWM output 1. Match output 3 of timer 3. O LCD_VD0 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD19 — LCD data. O U3_TXD — Transmitter output for USART3. I ENET_COL — Ethernet Collision detect (MII interface). AI ADC0_1 — ADC0 and ADC1, input channel 1. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 23 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P4_2 D3 A2 - 8 [2] N; PU I/O GPIO2[2] — General purpose digital input/output pin. O CTOUT_0 — SCTimer/PWM output 0. Match output 0 of timer 0. O LCD_VD3 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD12 — LCD data. I U3_RXD — Receiver input for USART3. I/O SGPIO8 — General purpose digital input/output pin. P4_3 C2 B2 - 7 [5] N; PU I/O GPIO2[3] — General purpose digital input/output pin. O CTOUT_3 — SCTimer/PWM output 3. Match output 3 of timer 0. O LCD_VD2 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD21 — LCD data. I/O U3_BAUD — Baud pin for USART3. I/O SGPIO9 — General purpose digital input/output pin. AI ADC0_0 — DAC output; ADC0 and ADC1, input channel 0. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. P4_4 B1 A1 - 9 [5] N; PU I/O GPIO2[4] — General purpose digital input/output pin. O CTOUT_2 — SCTimer/PWM output 2. Match output 2 of timer 0. O LCD_VD1 — LCD data. - R — Function reserved. - R — Function reserved. O LCD_VD20 — LCD data. I/O U3_DIR — RS-485/EIA-485 output enable/direction control for USART3. I/O SGPIO10 — General purpose digital input/output pin. O DAC — DAC output. Shared between 10-bit ADC0/1 and DAC.. Configure the pin as GPIO input and use the analog function select register in the SCU to select the DAC. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 24 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P4_5 D2 C2 - 10 [2] N; PU I/O GPIO2[5] — General purpose digital input/output pin. O CTOUT_5 — SCTimer/PWM output 5. Match output 3 of timer 3. O LCD_FP — Frame pulse (STN). Vertical synchronization pulse (TFT). - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SGPIO11 — General purpose digital input/output pin. P4_6 C1 B1 - 11 [2] N; PU I/O GPIO2[6] — General purpose digital input/output pin. O CTOUT_4 — SCTimer/PWM output 4. Match output 3 of timer 3. O LCD_ENAB/LCDM — STN AC bias drive or TFT data enable input. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SGPIO12 — General purpose digital input/output pin. P4_7 H4 F4 - 14 [2] O; PU O LCD_DCLK — LCD panel clock. I GP_CLKIN — General-purpose clock input to the CGU. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O I2S1_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. I/O I2S0_TX_SCK — Transmit Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I2S-bus specification. P4_8 E2 D2 - 15 [2] N; PU - R — Function reserved. I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2. O LCD_VD9 — LCD data. - R — Function reserved. I/O GPIO5[12] — General purpose digital input/output pin. O LCD_VD22 — LCD data. O CAN1_TD — CAN1 transmitter output. I/O SGPIO13 — General purpose digital input/output pin. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 25 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P4_9 L2 J2 - 33 [2] N; PU - R — Function reserved. I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3. O LCD_VD11 — LCD data. - R — Function reserved. I/O GPIO5[13] — General purpose digital input/output pin. O LCD_VD15 — LCD data. I CAN1_RD — CAN1 receiver input. I/O SGPIO14 — General purpose digital input/output pin. P4_10 M3 L3 - 35 [2] N; PU - R — Function reserved. I CTIN_2 — SCTimer/PWM input 2. Capture input 2 of timer 0. O LCD_VD10 — LCD data. - R — Function reserved. I/O GPIO5[14] — General purpose digital input/output pin. O LCD_VD14 — LCD data. - R — Function reserved. I/O SGPIO15 — General purpose digital input/output pin. P5_0 N3 L2 - 37 [2] N; PU I/O GPIO2[9] — General purpose digital input/output pin. O MCOB2 — Motor control PWM channel 2, output B. I/O EMC_D12 — External memory data line 12. - R — Function reserved. I U1_DSR — Data Set Ready input for UART 1. I T1_CAP0 — Capture input 0 of timer 1. - R — Function reserved. - R — Function reserved. P5_1 P3 M1 - 39 [2] N; PU I/O GPIO2[10] — General purpose digital input/output pin. I MCI2 — Motor control PWM channel 2, input. I/O EMC_D13 — External memory data line 13. - R — Function reserved. O U1_DTR — Data Terminal Ready output for UART 1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART 1. I T1_CAP1 — Capture input 1 of timer 1. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 26 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P5_2 R4 M3 - 46 [2] N; PU I/O GPIO2[11] — General purpose digital input/output pin. I MCI1 — Motor control PWM channel 1, input. I/O EMC_D14 — External memory data line 14. - R — Function reserved. O U1_RTS — Request to Send output for UART 1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART 1. I T1_CAP2 — Capture input 2 of timer 1. - R — Function reserved. - R — Function reserved. P5_3 T8 P6 - 54 [2] N; PU I/O GPIO2[12] — General purpose digital input/output pin. I MCI0 — Motor control PWM channel 0, input. I/O EMC_D15 — External memory data line 15. - R — Function reserved. I U1_RI — Ring Indicator input for UART 1. I T1_CAP3 — Capture input 3 of timer 1. - R — Function reserved. - R — Function reserved. P5_4 P9 N7 - 57 [2] N; PU I/O GPIO2[13] — General purpose digital input/output pin. O MCOB0 — Motor control PWM channel 0, output B. I/O EMC_D8 — External memory data line 8. - R — Function reserved. I U1_CTS — Clear to Send input for UART 1. O T1_MAT0 — Match output 0 of timer 1. - R — Function reserved. - R — Function reserved. P5_5 P10 N8 - 58 [2] N; PU I/O GPIO2[14] — General purpose digital input/output pin. O MCOA1 — Motor control PWM channel 1, output A. I/O EMC_D9 — External memory data line 9. - R — Function reserved. I U1_DCD — Data Carrier Detect input for UART 1. O T1_MAT1 — Match output 1 of timer 1. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 27 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P5_6 T13 M11 - 63 [2] N; PU I/O GPIO2[15] — General purpose digital input/output pin. O MCOB1 — Motor control PWM channel 1, output B. I/O EMC_D10 — External memory data line 10. - R — Function reserved. O U1_TXD — Transmitter output for UART 1. O T1_MAT2 — Match output 2 of timer 1. - R — Function reserved. - R — Function reserved. P5_7 R12 N11 - 65 [2] N; PU I/O GPIO2[7] — General purpose digital input/output pin. O MCOA2 — Motor control PWM channel 2, output A. I/O EMC_D11 — External memory data line 11. - R — Function reserved. I U1_RXD — Receiver input for UART 1. O T1_MAT3 — Match output 3 of timer 1. - R — Function reserved. - R — Function reserved. P6_0 M12 M10 H7 73 [2] N; PU - R — Function reserved. O I2S0_RX_MCLK — I2S receive master clock. - R — Function reserved. - R — Function reserved. I/O I2S0_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. - R — Function reserved. - R — Function reserved. - R — Function reserved. P6_1 R15 P14 G5 74 [2] N; PU I/O GPIO3[0] — General purpose digital input/output pin. O EMC_DYCS1 — SDRAM chip select 1. I/O U0_UCLK — Serial clock input/output for USART0 in synchronous mode. I/O I2S0_RX_WS — Receive Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. - R — Function reserved. I T2_CAP0 — Capture input 2 of timer 2. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 28 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P6_2 L13 K11 J9 78 [2] N; PU I/O GPIO3[1] — General purpose digital input/output pin. O EMC_CKEOUT1 — SDRAM clock enable 1. I/O U0_DIR — RS-485/EIA-485 output enable/direction control for USART0. I/O I2S0_RX_SDA — I2S Receive data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. - R — Function reserved. I T2_CAP1 — Capture input 1 of timer 2. - R — Function reserved. - R — Function reserved. P6_3 P15 N13 - 79 [2] N; PU I/O GPIO3[2] — General purpose digital input/output pin. O USB0_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that the VBUS signal must be driven (active HIGH). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. I/O SGPIO4 — General purpose digital input/output pin. O EMC_CS1 — LOW active Chip Select 1 signal. - R — Function reserved. I T2_CAP2 — Capture input 2 of timer 2. - R — Function reserved. - R — Function reserved. P6_4 R16 M14 F6 80 [2] N; PU I/O GPIO3[3] — General purpose digital input/output pin. I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3. O U0_TXD — Transmitter output for USART0. O EMC_CAS — LOW active SDRAM Column Address Strobe. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 29 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P6_5 P16 L14 F9 82 [2] N; PU I/O GPIO3[4] — General purpose digital input/output pin. O CTOUT_6 — SCTimer/PWM output 6. Match output 2 of timer 1. I U0_RXD — Receiver input for USART0. O EMC_RAS — LOW active SDRAM Row Address Strobe. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. P6_6 L14 K12 - 83 [2] N; PU I/O GPIO0[5] — General purpose digital input/output pin. O EMC_BLS1 — LOW active Byte Lane select signal 1. I/O SGPIO5 — General purpose digital input/output pin. I USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). - R — Function reserved. I T2_CAP3 — Capture input 3 of timer 2. - R — Function reserved. - R — Function reserved. P6_7 J13 H11 - 85 [2] N; PU - R — Function reserved. I/O EMC_A15 — External memory address line 15. I/O SGPIO6 — General purpose digital input/output pin. O USB0_IND1 — USB0 port indicator LED control output 1. I/O GPIO5[15] — General purpose digital input/output pin. O T2_MAT0 — Match output 0 of timer 2. - R — Function reserved. - R — Function reserved. P6_8 H13 F12 - 86 [2] N; PU - R — Function reserved. I/O EMC_A14 — External memory address line 14. I/O SGPIO7 — General purpose digital input/output pin. O USB0_IND0 — USB0 port indicator LED control output 0. I/O GPIO5[16] — General purpose digital input/output pin. O T2_MAT1 — Match output 1 of timer 2. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 30 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P6_9 J15 H13 F8 97 [2] N; PU I/O GPIO3[5] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O EMC_DYCS0 — SDRAM chip select 0. - R — Function reserved. O T2_MAT2 — Match output 2 of timer 2. - R — Function reserved. - R — Function reserved. P6_10 H15 G13 - 100 [2] N; PU I/O GPIO3[6] — General purpose digital input/output pin. O MCABORT — Motor control PWM, LOW-active fast abort. - R — Function reserved. O EMC_DQMOUT1 — Data mask 1 used with SDRAM and static devices. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. P6_11 H12 F11 C9 101 [2] N; PU I/O GPIO3[7] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O EMC_CKEOUT0 — SDRAM clock enable 0. - R — Function reserved. O T2_MAT3 — Match output 3 of timer 2. - R — Function reserved. - R — Function reserved. P6_12 G15 F13 - 103 [2] N; PU I/O GPIO2[8] — General purpose digital input/output pin. O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer 1. - R — Function reserved. O EMC_DQMOUT0 — Data mask 0 used with SDRAM and static devices. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 31 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P7_0 B16 B14 - 110 [2] N; PU I/O GPIO3[8] — General purpose digital input/output pin. O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of timer 3. - R — Function reserved. O LCD_LE — Line end signal. - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O SGPIO4 — General purpose digital input/output pin. P7_1 C14 C13 - 113 [2] N; PU I/O GPIO3[9] — General purpose digital input/output pin. O CTOUT_15 — SCTimer/PWM output 15. Match output 3 of timer 3. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. O LCD_VD19 — LCD data. O LCD_VD7 — LCD data. - R — Function reserved. O U2_TXD — Transmitter output for USART2. I/O SGPIO5 — General purpose digital input/output pin. P7_2 A16 A14 - 115 [2] N; PU I/O GPIO3[10] — General purpose digital input/output pin. I CTIN_4 — SCTimer/PWM input 4. Capture input 2 of timer 1. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. O LCD_VD18 — LCD data. O LCD_VD6 — LCD data. - R — Function reserved. I U2_RXD — Receiver input for USART2. I/O SGPIO6 — General purpose digital input/output pin. P7_3 C13 C12 - 117 [2] N; PU I/O GPIO3[11] — General purpose digital input/output pin. I CTIN_3 — SCTimer/PWM input 3. Capture input 1 of timer 1. - R — Function reserved. O LCD_VD17 — LCD data. O LCD_VD5 — LCD data. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 32 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P7_4 C8 C6 - 132 [5] N; PU I/O GPIO3[12] — General purpose digital input/output pin. O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of timer 3. - R — Function reserved. O LCD_VD16 — LCD data. O LCD_VD4 — LCD data. O TRACEDATA[0] — Trace data, bit 0. - R — Function reserved. - R — Function reserved. AI ADC0_4 — ADC0 and ADC1, input channel 4. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. P7_5 A7 A7 - 133 [5] N; PU I/O GPIO3[13] — General purpose digital input/output pin. O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of timer 3. - R — Function reserved. O LCD_VD8 — LCD data. O LCD_VD23 — LCD data. O TRACEDATA[1] — Trace data, bit 1. - R — Function reserved. - R — Function reserved. AI ADC0_3 — ADC0 and ADC1, input channel 3. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. P7_6 C7 F5 - 134 [2] N; PU I/O GPIO3[14] — General purpose digital input/output pin. O CTOUT_11 — SCTimer/PWM output 1. Match output 3 of timer 2. - R — Function reserved. O LCD_LP — Line synchronization pulse (STN). Horizontal synchronization pulse (TFT). - R — Function reserved. O TRACEDATA[2] — Trace data, bit 2. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 33 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P7_7 B6 D5 - 140 [5] N; PU I/O GPIO3[15] — General purpose digital input/output pin. O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer 2. - R — Function reserved. O LCD_PWR — LCD panel power enable. - R — Function reserved. O TRACEDATA[3] — Trace data, bit 3. O ENET_MDC — Ethernet MIIM clock. I/O SGPIO7 — General purpose digital input/output pin. AI ADC1_6 — ADC1 and ADC0, input channel 6. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. P8_0 E5 E4 - - [3] N; PU I/O GPIO4[0] — General purpose digital input/output pin. I USB0_PWR_FAULT — Port power fault signal indicating overcurrent condition; this signal monitors over-current on the USB bus (external circuitry required to detect over-current condition). - R — Function reserved. I MCI2 — Motor control PWM channel 2, input. I/O SGPIO8 — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O T0_MAT0 — Match output 0 of timer 0. P8_1 H5 G4 - - [3] N; PU I/O GPIO4[1] — General purpose digital input/output pin. O USB0_IND1 — USB0 port indicator LED control output 1. - R — Function reserved. I MCI1 — Motor control PWM channel 1, input. I/O SGPIO9 — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O T0_MAT1 — Match output 1 of timer 0. P8_2 K4 J4 - - [3] N; PU I/O GPIO4[2] — General purpose digital input/output pin. O USB0_IND0 — USB0 port indicator LED control output 0. - R — Function reserved. I MCI0 — Motor control PWM channel 0, input. I/O SGPIO10 — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O T0_MAT2 — Match output 2 of timer 0. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 34 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P8_3 J3 H3 - - [2] N; PU I/O GPIO4[3] — General purpose digital input/output pin. I/O USB1_ULPI_D2 — ULPI link bidirectional data line 2. - R — Function reserved. O LCD_VD12 — LCD data. O LCD_VD19 — LCD data. - R — Function reserved. - R — Function reserved. O T0_MAT3 — Match output 3 of timer 0. P8_4 J2 H2 - - [2] N; PU I/O GPIO4[4] — General purpose digital input/output pin. I/O USB1_ULPI_D1 — ULPI link bidirectional data line 1. - R — Function reserved. O LCD_VD7 — LCD data. O LCD_VD16 — LCD data. - R — Function reserved. - R — Function reserved. I T0_CAP0 — Capture input 0 of timer 0. P8_5 J1 H1 - - [2] N; PU I/O GPIO4[5] — General purpose digital input/output pin. I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0. - R — Function reserved. O LCD_VD6 — LCD data. O LCD_VD8 — LCD data. - R — Function reserved. - R — Function reserved. I T0_CAP1 — Capture input 1 of timer 0. P8_6 K3 J3 - - [2] N; PU I/O GPIO4[6] — General purpose digital input/output pin. I USB1_ULPI_NXT — ULPI link NXT signal. Data flow control signal from the PHY. - R — Function reserved. O LCD_VD5 — LCD data. O LCD_LP — Line synchronization pulse (STN). Horizontal synchronization pulse (TFT). - R — Function reserved. - R — Function reserved. I T0_CAP2 — Capture input 2 of timer 0. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 35 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P8_7 K1 J1 - - [2] N; PU I/O GPIO4[7] — General purpose digital input/output pin. O USB1_ULPI_STP — ULPI link STP signal. Asserted to end or interrupt transfers to the PHY. - R — Function reserved. O LCD_VD4 — LCD data. O LCD_PWR — LCD panel power enable. - R — Function reserved. - R — Function reserved. I T0_CAP3 — Capture input 3 of timer 0. P8_8 L1 K1 - - [2] N; PU - R — Function reserved. I USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz clock generated by the PHY. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CGU_OUT0 — CGU spare clock output 0. O I2S1_TX_MCLK — I2S1 transmit master clock. P9_0 T1 P1 - - [2] N; PU I/O GPIO4[12] — General purpose digital input/output pin. O MCABORT — Motor control PWM, LOW-active fast abort. - R — Function reserved. - R — Function reserved. - R — Function reserved. I ENET_CRS — Ethernet Carrier Sense (MII interface). I/O SGPIO0 — General purpose digital input/output pin. I/O SSP0_SSEL — Slave Select for SSP0. P9_1 N6 P4 - - [2] N; PU I/O GPIO4[13] — General purpose digital input/output pin. O MCOA2 — Motor control PWM channel 2, output A. - R — Function reserved. - R — Function reserved. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I ENET_RX_ER — Ethernet receive error (MII interface). I/O SGPIO1 — General purpose digital input/output pin. I/O SSP0_MISO — Master In Slave Out for SSP0. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 36 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P9_2 N8 M6 - - [2] N; PU I/O GPIO4[14] — General purpose digital input/output pin. O MCOB2 — Motor control PWM channel 2, output B. - R — Function reserved. - R — Function reserved. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. I ENET_RXD3 — Ethernet receive data 3 (MII interface). I/O SGPIO2 — General purpose digital input/output pin. I/O SSP0_MOSI — Master Out Slave in for SSP0. P9_3 M6 P5 - - [2] N; PU I/O GPIO4[15] — General purpose digital input/output pin. O MCOA0 — Motor control PWM channel 0, output A. O USB1_IND1 — USB1 Port indicator LED control output 1. - R — Function reserved. - R — Function reserved. I ENET_RXD2 — Ethernet receive data 2 (MII interface). I/O SGPIO9 — General purpose digital input/output pin. O U3_TXD — Transmitter output for USART3. P9_4 N10 M8 - - [2] N; PU - R — Function reserved. O MCOB0 — Motor control PWM channel 0, output B. O USB1_IND0 — USB1 Port indicator LED control output 0. - R — Function reserved. I/O GPIO5[17] — General purpose digital input/output pin. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). I/O SGPIO4 — General purpose digital input/output pin. I U3_RXD — Receiver input for USART3. P9_5 M9 L7 - 69 [2] N; PU - R — Function reserved. O MCOA1 — Motor control PWM channel 1, output A. O USB1_PPWR — VBUS drive signal (towards external charge pump or power management unit); indicates that VBUS must be driven (active high). Add a pull-down resistor to disable the power switch at reset. This signal has opposite polarity compared to the USB_PPWR used on other NXP LPC parts. - R — Function reserved. I/O GPIO5[18] — General purpose digital input/output pin. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O SGPIO3 — General purpose digital input/output pin. O U0_TXD — Transmitter output for USART0. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 37 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller P9_6 L11 M9 - 72 [2] N; PU I/O GPIO4[11] — General purpose digital input/output pin. O MCOB1 — Motor control PWM channel 1, output B. I USB1_PWR_FAULT — USB1 Port power fault signal indicating over-current condition; this signal monitors over-current on the USB1 bus (external circuitry required to detect over-current condition). - R — Function reserved. - R — Function reserved. I ENET_COL — Ethernet Collision detect (MII interface). I/O SGPIO8 — General purpose digital input/output pin. I U0_RXD — Receiver input for USART0. PA_0 L12 L10 - - [2] N; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O I2S1_RX_MCLK — I2S1 receive master clock. O CGU_OUT1 — CGU spare clock output 1. - R — Function reserved. PA_1 J14 H12 - - [3] N; PU I/O GPIO4[8] — General purpose digital input/output pin. I QEI_IDX — Quadrature Encoder Interface INDEX input. - R — Function reserved. O U2_TXD — Transmitter output for USART2. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. PA_2 K15 J13 - - [3] N; PU I/O GPIO4[9] — General purpose digital input/output pin. I QEI_PHB — Quadrature Encoder Interface PHB input. - R — Function reserved. I U2_RXD — Receiver input for USART2. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 38 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PA_3 H11 E10 - - [3] N; PU I/O GPIO4[10] — General purpose digital input/output pin. I QEI_PHA — Quadrature Encoder Interface PHA input. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. PA_4 G13 E12 - - [2] N; PU - R — Function reserved. O CTOUT_9 — SCTimer/PWM output 9. Match output 3 of timer 3. - R — Function reserved. I/O EMC_A23 — External memory address line 23. I/O GPIO5[19] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PB_0 B15 D14 - - [2] N; PU - R — Function reserved. O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of timer 3. O LCD_VD23 — LCD data. - R — Function reserved. I/O GPIO5[20] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PB_1 A14 A13 - - [2] N; PU - R — Function reserved. I USB1_ULPI_DIR — ULPI link DIR signal. Controls the ULP data line direction. O LCD_VD22 — LCD data. - R — Function reserved. I/O GPIO5[21] — General purpose digital input/output pin. O CTOUT_6 — SCTimer/PWM output 6. Match output 2 of timer 1. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 39 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PB_2 B12 B11 - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D7 — ULPI link bidirectional data line 7. O LCD_VD21 — LCD data. - R — Function reserved. I/O GPIO5[22] — General purpose digital input/output pin. O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer 1. - R — Function reserved. - R — Function reserved. PB_3 A13 A12 - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D6 — ULPI link bidirectional data line 6. O LCD_VD20 — LCD data. - R — Function reserved. I/O GPIO5[23] — General purpose digital input/output pin. O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer 2. - R — Function reserved. - R — Function reserved. PB_4 B11 B10 - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D5 — ULPI link bidirectional data line 5. O LCD_VD15 — LCD data. - R — Function reserved. I/O GPIO5[24] — General purpose digital input/output pin. I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2. - R — Function reserved. - R — Function reserved. PB_5 A12 A11 - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D4 — ULPI link bidirectional data line 4. O LCD_VD14 — LCD data. - R — Function reserved. I/O GPIO5[25] — General purpose digital input/output pin. I CTIN_7 — SCTimer/PWM input 7. O LCD_PWR — LCD panel power enable. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 40 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PB_6 A6 C5 - - [5] N; PU - R — Function reserved. I/O USB1_ULPI_D3 — ULPI link bidirectional data line 3. O LCD_VD13 — LCD data. - R — Function reserved. I/O GPIO5[26] — General purpose digital input/output pin. I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3. O LCD_VD19 — LCD data. - R — Function reserved. AI ADC0_6 — ADC0 and ADC1, input channel 6. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. PC_0 D4 - - - [5] N; PU - R — Function reserved. I USB1_ULPI_CLK — ULPI link CLK signal. 60 MHz clock generated by the PHY. - R — Function reserved. I/O ENET_RX_CLK — Ethernet Receive Clock (MII interface). O LCD_DCLK — LCD panel clock. - R — Function reserved. - R — Function reserved. I/O SD_CLK — SD/MMC card clock. AI ADC1_1 — ADC1 and ADC0, input channel 1. Configure the pin as input (USB_ULPI_CLK) and use the ADC function select register in the SCU to select the ADC. PC_1 E4 - - - [2] N; PU I/O USB1_ULPI_D7 — ULPI link bidirectional data line 7. - R — Function reserved. I U1_RI — Ring Indicator input for UART 1. O ENET_MDC — Ethernet MIIM clock. I/O GPIO6[0] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP0 — Capture input 0 of timer 3. O SD_VOLT0 — SD/MMC bus voltage select output 0. PC_2 F6 - - - [2] N; PU I/O USB1_ULPI_D6 — ULPI link bidirectional data line 6. - R — Function reserved. I U1_CTS — Clear to Send input for UART 1. O ENET_TXD2 — Ethernet transmit data 2 (MII interface). I/O GPIO6[1] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O SD_RST — SD/MMC reset signal for MMC4.4 card. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 41 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PC_3 F5 - - - [5] N; PU I/O USB1_ULPI_D5 — ULPI link bidirectional data line 5. - R — Function reserved. O U1_RTS — Request to Send output for UART 1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART 1. O ENET_TXD3 — Ethernet transmit data 3 (MII interface). I/O GPIO6[2] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. O SD_VOLT1 — SD/MMC bus voltage select output 1. AI ADC1_0 — DAC output; ADC1 and ADC0, input channel 0. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. PC_4 F4 - - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D4 — ULPI link bidirectional data line 4. - R — Function reserved. ENET_TX_EN — Ethernet transmit enable (RMII/MII interface). I/O GPIO6[3] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP1 — Capture input 1 of timer 3. I/O SD_DAT0 — SD/MMC data bus line 0. PC_5 G4 - - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D3 — ULPI link bidirectional data line 3. - R — Function reserved. O ENET_TX_ER — Ethernet Transmit Error (MII interface). I/O GPIO6[4] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP2 — Capture input 2 of timer 3. I/O SD_DAT1 — SD/MMC data bus line 1. PC_6 H6 - - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D2 — ULPI link bidirectional data line 2. - R — Function reserved. I ENET_RXD2 — Ethernet receive data 2 (MII interface). I/O GPIO6[5] — General purpose digital input/output pin. - R — Function reserved. I T3_CAP3 — Capture input 3 of timer 3. I/O SD_DAT2 — SD/MMC data bus line 2. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 42 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PC_7 G5 - - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D1 — ULPI link bidirectional data line 1. - R — Function reserved. I ENET_RXD3 — Ethernet receive data 3 (MII interface). I/O GPIO6[6] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT0 — Match output 0 of timer 3. I/O SD_DAT3 — SD/MMC data bus line 3. PC_8 N4 - - - [2] N; PU - R — Function reserved. I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0. - R — Function reserved. I ENET_RX_DV — Ethernet Receive Data Valid (RMII/MII interface). I/O GPIO6[7] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT1 — Match output 1 of timer 3. I SD_CD — SD/MMC card detect input. PC_9 K2 - - - [2] N; PU - R — Function reserved. I USB1_ULPI_NXT — ULPI link NXT signal. Data flow control signal from the PHY. - R — Function reserved. I ENET_RX_ER — Ethernet receive error (MII interface). I/O GPIO6[8] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT2 — Match output 2 of timer 3. O SD_POW — SD/MMC power monitor output. PC_10 M5 - - - [2] N; PU - R — Function reserved. O USB1_ULPI_STP — ULPI link STP signal. Asserted to end or interrupt transfers to the PHY. I U1_DSR — Data Set Ready input for UART 1. - R — Function reserved. I/O GPIO6[9] — General purpose digital input/output pin. - R — Function reserved. O T3_MAT3 — Match output 3 of timer 3. I/O SD_CMD — SD/MMC command signal. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 43 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PC_11 L5 - - - [2] N; PU - R — Function reserved. I USB1_ULPI_DIR — ULPI link DIR signal. Controls the ULPI data line direction. I U1_DCD — Data Carrier Detect input for UART 1. - R — Function reserved. I/O GPIO6[10] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SD_DAT4 — SD/MMC data bus line 4. PC_12 L6 - - - [2] N; PU - R — Function reserved. - R — Function reserved. O U1_DTR — Data Terminal Ready output for UART 1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART 1. - R — Function reserved. I/O GPIO6[11] — General purpose digital input/output pin. I/O SGPIO11 — General purpose digital input/output pin. I/O I2S0_TX_SDA — I2S transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. I/O SD_DAT5 — SD/MMC data bus line 5. PC_13 M1 - - - [2] N; PU - R — Function reserved. - R — Function reserved. O U1_TXD — Transmitter output for UART 1. - R — Function reserved. I/O GPIO6[12] — General purpose digital input/output pin. I/O SGPIO12 — General purpose digital input/output pin. I/O I2S0_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. I/O SD_DAT6 — SD/MMC data bus line 6. PC_14 N1 - - - [2] N; PU - R — Function reserved. - R — Function reserved. I U1_RXD — Receiver input for UART 1. - R — Function reserved. I/O GPIO6[13] — General purpose digital input/output pin. I/O SGPIO13 — General purpose digital input/output pin. O ENET_TX_ER — Ethernet Transmit Error (MII interface). I/O SD_DAT7 — SD/MMC data bus line 7. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 44 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PD_0 N2 - - - [2] N; PU - R — Function reserved. O CTOUT_15 — SCTimer/PWM output 15. Match output 3 of timer 3. O EMC_DQMOUT2 — Data mask 2 used with SDRAM and static devices. - R — Function reserved. I/O GPIO6[14] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO4 — General purpose digital input/output pin. PD_1 P1 - - - [2] N; PU - R — Function reserved. - R — Function reserved. O EMC_CKEOUT2 — SDRAM clock enable 2. - R — Function reserved. I/O GPIO6[15] — General purpose digital input/output pin. O SD_POW — SD/MMC power monitor output. - R — Function reserved. I/O SGPIO5 — General purpose digital input/output pin. PD_2 R1 - - - [2] N; PU - R — Function reserved. O CTOUT_7 — SCTimer/PWM output 7. Match output 3 of timer 1. I/O EMC_D16 — External memory data line 16. - R — Function reserved. I/O GPIO6[16] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO6 — General purpose digital input/output pin. PD_3 P4 - - - [2] N; PU - R — Function reserved. O CTOUT_6 — SCTimer/PWM output 7. Match output 2 of timer 1. I/O EMC_D17 — External memory data line 17. - R — Function reserved. I/O GPIO6[17] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO7 — General purpose digital input/output pin. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 45 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PD_4 T2 - - - [2] N; PU - R — Function reserved. O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer 2. I/O EMC_D18 — External memory data line 18. - R — Function reserved. I/O GPIO6[18] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO8 — General purpose digital input/output pin. PD_5 P6 - - - [2] N; PU - R — Function reserved. O CTOUT_9 — SCTimer/PWM output 9. Match output 3 of timer 3. I/O EMC_D19 — External memory data line 19. - R — Function reserved. I/O GPIO6[19] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO9 — General purpose digital input/output pin. PD_6 R6 - - - [2] N; PU - R — Function reserved. O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of timer 3. I/O EMC_D20 — External memory data line 20. - R — Function reserved. I/O GPIO6[20] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO10 — General purpose digital input/output pin. PD_7 T6 - - - [2] N; PU - R — Function reserved. I CTIN_5 — SCTimer/PWM input 5. Capture input 2 of timer 2. I/O EMC_D21 — External memory data line 21. - R — Function reserved. I/O GPIO6[21] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO11 — General purpose digital input/output pin. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 46 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PD_8 P8 - - - [2] N; PU - R — Function reserved. I CTIN_6 — SCTimer/PWM input 6. Capture input 1 of timer 3. I/O EMC_D22 — External memory data line 22. - R — Function reserved. I/O GPIO6[22] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO12 — General purpose digital input/output pin. PD_9 T11 - - - [2] N; PU - R — Function reserved. O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of timer 3. I/O EMC_D23 — External memory data line 23. - R — Function reserved. I/O GPIO6[23] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. I/O SGPIO13 — General purpose digital input/output pin. PD_10 P11 - - - [2] N; PU - R — Function reserved. I CTIN_1 — SCTimer/PWM input 1. Capture input 1 of timer 0. Capture input 1 of timer 2. O EMC_BLS3 — LOW active Byte Lane select signal 3. - R — Function reserved. I/O GPIO6[24] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PD_11 N9 M7 - - [2] N; PU - R — Function reserved. - R — Function reserved. O EMC_CS3 — LOW active Chip Select 3 signal. - R — Function reserved. I/O GPIO6[25] — General purpose digital input/output pin. I/O USB1_ULPI_D0 — ULPI link bidirectional data line 0. O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of timer 3. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 47 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PD_12 N11 P9 - - [2] N; PU - R — Function reserved. - R — Function reserved. O EMC_CS2 — LOW active Chip Select 2 signal. - R — Function reserved. I/O GPIO6[26] — General purpose digital input/output pin. - R — Function reserved. O CTOUT_10 — SCTimer/PWM output 10. Match output 3 of timer 3. - R — Function reserved. PD_13 T14 - - - [2] N; PU - R — Function reserved. I CTIN_0 — SCTimer/PWM input 0. Capture input 0 of timer 0, 1, 2, 3. O EMC_BLS2 — LOW active Byte Lane select signal 2. - R — Function reserved. I/O GPIO6[27] — General purpose digital input/output pin. - R — Function reserved. O CTOUT_13 — SCTimer/PWM output 13. Match output 3 of timer 3. - R — Function reserved. PD_14 R13 L11 - - [2] N; PU - R — Function reserved. - R — Function reserved. O EMC_DYCS2 — SDRAM chip select 2. - R — Function reserved. I/O GPIO6[28] — General purpose digital input/output pin. - R — Function reserved. O CTOUT_11 — SCTimer/PWM output 11. Match output 3 of timer 2. - R — Function reserved. PD_15 T15 P13 - - [2] N; PU - R — Function reserved. - R — Function reserved. I/O EMC_A17 — External memory address line 17. - R — Function reserved. I/O GPIO6[29] — General purpose digital input/output pin. I SD_WP — SD/MMC card write protect input. O CTOUT_8 — SCTimer/PWM output 8. Match output 0 of timer 2. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 48 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PD_16 R14 P12 - - [2] N; PU - R — Function reserved. - R — Function reserved. I/O EMC_A16 — External memory address line 16. - R — Function reserved. I/O GPIO6[30] — General purpose digital input/output pin. O SD_VOLT2 — SD/MMC bus voltage select output 2. O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of timer 3. - R — Function reserved. PE_0 P14 N12 - - [2] N; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O EMC_A18 — External memory address line 18. I/O GPIO7[0] — General purpose digital input/output pin. O CAN1_TD — CAN1 transmitter output. - R — Function reserved. - R — Function reserved. PE_1 N14 M12 - - [2] N; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. I/O EMC_A19 — External memory address line 19. I/O GPIO7[1] — General purpose digital input/output pin. I CAN1_RD — CAN1 receiver input. - R — Function reserved. - R — Function reserved. PE_2 M14 L12 - - [2] N; PU I ADCTRIG0 — ADC trigger input 0. I CAN0_RD — CAN receiver input. - R — Function reserved. I/O EMC_A20 — External memory address line 20. I/O GPIO7[2] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 49 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PE_3 K12 K10 - - [2] N; PU - R — Function reserved. O CAN0_TD — CAN transmitter output. I ADCTRIG1 — ADC trigger input 1. I/O EMC_A21 — External memory address line 21. I/O GPIO7[3] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_4 K13 J11 - - [2] N; PU - R — Function reserved. I NMI — External interrupt input to NMI. - R — Function reserved. I/O EMC_A22 — External memory address line 22. I/O GPIO7[4] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_5 N16 - - - [2] N; PU - R — Function reserved. O CTOUT_3 — SCTimer/PWM output 3. Match output 3 of timer 0. O U1_RTS — Request to Send output for UART 1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART 1. I/O EMC_D24 — External memory data line 24. I/O GPIO7[5] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_6 M16 - - - [2] N; PU - R — Function reserved. O CTOUT_2 — SCTimer/PWM output 2. Match output 2 of timer 0. I U1_RI — Ring Indicator input for UART 1. I/O EMC_D25 — External memory data line 25. I/O GPIO7[6] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 50 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PE_7 F15 - - - [2] N; PU - R — Function reserved. O CTOUT_5 — SCTimer/PWM output 5. Match output 3 of timer 3. I U1_CTS — Clear to Send input for UART1. I/O EMC_D26 — External memory data line 26. I/O GPIO7[7] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_8 F14 - - - [2] N; PU - R — Function reserved. O CTOUT_4 — SCTimer/PWM output 4. Match output 3 of timer 3. I U1_DSR — Data Set Ready input for UART 1. I/O EMC_D27 — External memory data line 27. I/O GPIO7[8] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_9 E16 - - - [2] N; PU - R — Function reserved. I CTIN_4 — SCTimer/PWM input 4. Capture input 2 of timer 1. I U1_DCD — Data Carrier Detect input for UART 1. I/O EMC_D28 — External memory data line 28. I/O GPIO7[9] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_10 E14 - - - [2] N; PU - R — Function reserved. I CTIN_3 — SCTimer/PWM input 3. Capture input 1 of timer 1. O U1_DTR — Data Terminal Ready output for UART 1. Can also be configured to be an RS-485/EIA-485 output enable signal for UART 1. I/O EMC_D29 — External memory data line 29. I/O GPIO7[10] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 51 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PE_11 D16 - - - [2] N; PU - R — Function reserved. O CTOUT_12 — SCTimer/PWM output 12. Match output 3 of timer 3. O U1_TXD — Transmitter output for UART 1. I/O EMC_D30 — External memory data line 30. I/O GPIO7[11] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_12 D15 - - - [2] N; PU - R — Function reserved. O CTOUT_11 — SCTimer/PWM output 11. Match output 3 of timer 2. I U1_RXD — Receiver input for UART 1. I/O EMC_D31 — External memory data line 31. I/O GPIO7[12] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_13 G14 - - - [2] N; PU - R — Function reserved. O CTOUT_14 — SCTimer/PWM output 14. Match output 2 of timer 3. I/O I2C1_SDA — I 2C1 data input/output (this pin does not use a specialized I2C pad). O EMC_DQMOUT3 — Data mask 3 used with SDRAM and static devices. I/O GPIO7[13] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PE_14 C15 - - - [2] N; PU - R — Function reserved. - R — Function reserved. - R — Function reserved. O EMC_DYCS3 — SDRAM chip select 3. I/O GPIO7[14] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 52 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PE_15 E13 - - - [2] N; PU - R — Function reserved. O CTOUT_0 — SCTimer/PWM output 0. Match output 0 of timer 0. I/O I2C1_SCL — I 2C1 clock input/output (this pin does not use a specialized I2C pad). O EMC_CKEOUT3 — SDRAM clock enable 3. I/O GPIO7[15] — General purpose digital input/output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. PF_0 D12 - - - [2] O; PU I/O SSP0_SCK — Serial clock for SSP0. I GP_CLKIN — General-purpose clock input to the CGU. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. - R — Function reserved. O I2S1_TX_MCLK — I2S1 transmit master clock. PF_1 E11 - - - [2] N; PU - R — Function reserved. - R — Function reserved. I/O SSP0_SSEL — Slave Select for SSP0. - R — Function reserved. I/O GPIO7[16] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO0 — General purpose digital input/output pin. - R — Function reserved. PF_2 D11 - - - [2] N; PU - R — Function reserved. O U3_TXD — Transmitter output for USART3. I/O SSP0_MISO — Master In Slave Out for SSP0. - R — Function reserved. I/O GPIO7[17] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO1 — General purpose digital input/output pin. - R — Function reserved. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 53 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PF_3 E10 - - - [2] N; PU - R — Function reserved. I U3_RXD — Receiver input for USART3. I/O SSP0_MOSI — Master Out Slave in for SSP0. - R — Function reserved. I/O GPIO7[18] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO2 — General purpose digital input/output pin. - R — Function reserved. PF_4 D10 D6 H4 120 [2] O; PU I/O SSP1_SCK — Serial clock for SSP1. I GP_CLKIN — General-purpose clock input to the CGU. O TRACECLK — Trace clock. - R — Function reserved. - R — Function reserved. - R — Function reserved. O I2S0_TX_MCLK — I2S transmit master clock. I/O I2S0_RX_SCK — I2S receive clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. PF_5 E9 - - - [5] N; PU - R — Function reserved. I/O U3_UCLK — Serial clock input/output for USART3 in synchronous mode. I/O SSP1_SSEL — Slave Select for SSP1. O TRACEDATA[0] — Trace data, bit 0. I/O GPIO7[19] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO4 — General purpose digital input/output pin. - R — Function reserved. AI ADC1_4 — ADC1 and ADC0, input channel 4. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 54 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PF_6 E7 - - - [5] N; PU - R — Function reserved. I/O U3_DIR — RS-485/EIA-485 output enable/direction control for USART3. I/O SSP1_MISO — Master In Slave Out for SSP1. O TRACEDATA[1] — Trace data, bit 1. I/O GPIO7[20] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO5 — General purpose digital input/output pin. I/O I2S1_TX_SDA — I2S1 transmit data. It is driven by the transmitter and read by the receiver. Corresponds to the signal SD in the I 2S-bus specification. AI ADC1_3 — ADC1 and ADC0, input channel 3. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. PF_7 B7 - - - [5] N; PU - R — Function reserved. I/O U3_BAUD — Baud pin for USART3. I/O SSP1_MOSI — Master Out Slave in for SSP1. O TRACEDATA[2] — Trace data, bit 2. I/O GPIO7[21] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO6 — General purpose digital input/output pin. I/O I2S1_TX_WS — Transmit Word Select. It is driven by the master and received by the slave. Corresponds to the signal WS in the I 2S-bus specification. AI/ O ADC1_7 — ADC1 and ADC0, input channel 7 or band gap output. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. PF_8 E6 - - - [5] N; PU - R — Function reserved. I/O U0_UCLK — Serial clock input/output for USART0 in synchronous mode. I CTIN_2 — SCTimer/PWM input 2. Capture input 2 of timer 0. O TRACEDATA[3] — Trace data, bit 3. I/O GPIO7[22] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO7 — General purpose digital input/output pin. - R — Function reserved. AI ADC0_2 — ADC0 and ADC1, input channel 2. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 55 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller PF_9 D6 - - - [5] N; PU - R — Function reserved. I/O U0_DIR — RS-485/EIA-485 output enable/direction control for USART0. O CTOUT_1 — SCTimer/PWM output 1. Match output 3 of timer 3. - R — Function reserved. I/O GPIO7[23] — General purpose digital input/output pin. - R — Function reserved. I/O SGPIO3 — General purpose digital input/output pin. - R — Function reserved. AI ADC1_2 — ADC1 and ADC0, input channel 2. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. PF_10 A3 - - - [5] N; PU - R — Function reserved. O U0_TXD — Transmitter output for USART0. - R — Function reserved. - R — Function reserved. I/O GPIO7[24] — General purpose digital input/output pin. - R — Function reserved. I SD_WP — SD/MMC card write protect input. - R — Function reserved. AI ADC0_5 — ADC0 and ADC1, input channel 5. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. PF_11 A2 - - - [5] N; PU - R — Function reserved. I U0_RXD — Receiver input for USART0. - R — Function reserved. - R — Function reserved. I/O GPIO7[25] — General purpose digital input/output pin. - R — Function reserved. O SD_VOLT2 — SD/MMC bus voltage select output 2. - R — Function reserved. AI ADC1_5 — ADC1 and ADC0, input channel 5. Configure the pin as GPIO input and use the ADC function select register in the SCU to select the ADC. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 56 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Clock pins CLK0 N5 M4 K3 45 [4] O; PU O EMC_CLK0 — SDRAM clock 0. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. I/O SD_CLK — SD/MMC card clock. O EMC_CLK01 — SDRAM clock 0 and clock 1 combined. I/O SSP1_SCK — Serial clock for SSP1. I ENET_TX_CLK (ENET_REF_CLK) — Ethernet Transmit Clock (MII interface) or Ethernet Reference Clock (RMII interface). CLK1 T10 - - - [4] O; PU O EMC_CLK1 — SDRAM clock 1. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CGU_OUT0 — CGU spare clock output 0. - R — Function reserved. O I2S1_TX_MCLK — I2S1 transmit master clock. CLK2 D14 P10 K6 99 [4] O; PU O EMC_CLK3 — SDRAM clock 3. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. I/O SD_CLK — SD/MMC card clock. O EMC_CLK23 — SDRAM clock 2 and clock 3 combined. O I2S0_TX_MCLK — I2S transmit master clock. I/O I2S1_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. CLK3 P12 - - - [4] O; PU O EMC_CLK2 — SDRAM clock 2. O CLKOUT — Clock output pin. - R — Function reserved. - R — Function reserved. - R — Function reserved. O CGU_OUT1 — CGU spare clock output 1. - R — Function reserved. I/O I2S1_RX_SCK — Receive Clock. It is driven by the master and received by the slave. Corresponds to the signal SCK in the I 2S-bus specification. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 57 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Debug pins DBGEN L4 K4 A6 28 [2] I; PU I JTAG interface control signal. Also used for boundary scan. To use the part in functional mode, connect this pin in one of the following ways: • Leave DBGEN open. The DBGEN pin is pulled up internally by a 50 kΩ resistor. • Tie DBGEN to VDDIO. • Pull DBGEN up to VDDIO with an external pull-up resistor. TCK/SWDCLK J5 G5 H2 27 [2] I; F I Test Clock for JTAG interface (default) or Serial Wire (SW) clock. TRST M4 L4 B4 29 [2] I; PU I Test Reset for JTAG interface. TMS/SWDIO K6 K5 C4 30 [2] I; PU I Test Mode Select for JTAG interface (default) or SW debug data input/output. TDO/SWO K5 J5 H3 31 [2] O O Test Data Out for JTAG interface (default) or SW trace output. TDI J4 H4 G3 26 [2] I; PU I Test Data In for JTAG interface. USB0 pins USB0_DP F2 E2 E1 18 [6] - I/O USB0 bidirectional D+ line. USB0_DM G2 F2 E2 20 [6] - I/O USB0 bidirectional D line. USB0_VBUS F1 E1 E3 21 [6] [7] - I/O VBUS pin (power on USB cable). This pin includes an internal pull-down resistor of 64 kΩ (typical) 16 kΩ. USB0_ID H2 G2 F1 22 [8] - I Indicates to the transceiver whether connected as an A-device (USB0_ID LOW) or B-device (USB0_ID HIGH). For OTG this pin has an internal pull-up resistor. USB0_RREF H1 G1 F3 24 [8] - 12.0 kΩ (accuracy 1 %) on-board resistor to ground for current reference. USB1 pins USB1_DP F12 D11 E9 89 [9] - I/O USB1 bidirectional D+ line. USB1_DM G12 E11 E10 90 [9] - I/O USB1 bidirectional D line. I 2C-bus pins I2C0_SCL L15 K13 D6 92 [10] I; F I/O I2C clock input/output. Open-drain output (for I2C-bus compliance). I2C0_SDA L16 K14 E6 93 [10] I; F I/O I2C data input/output. Open-drain output (for I2C-bus compliance). Reset and wake-up pins RESET D9 C7 B6 128 [11] I; IA I External reset input: A LOW-going pulse as short as 50 ns on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. This pin does not have an internal pull-up. WAKEUP0 A9 A9 A4 130 [11] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low-power modes. A pulse with a duration > 45 ns wakes up the part. This pin does not have an internal pull-up. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 58 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller WAKEUP1 A10 C8 - - [11] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low-power modes. A pulse with a duration > 45 ns wakes up the part. This pin does not have an internal pull-up. WAKEUP2 C9 E5 - - [11] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low-power modes. A pulse with a duration > 45 ns wakes up the part. This pin does not have an internal pull-up. WAKEUP3 D8 - - - [11] I; IA I External wake-up input; can raise an interrupt and can cause wake-up from any of the low-power modes. A pulse with a duration > 45 ns wakes up the part. This pin does not have an internal pull-up. ADC pins ADC0_0/ ADC1_0/DAC E3 B6 A2 6 [8] I; IA I ADC input channel 0. Shared between 10-bit ADC0/1 and DAC. ADC0_1/ ADC1_1 C3 C4 A1 2 [8] I; IA I ADC input channel 1. Shared between 10-bit ADC0/1. ADC0_2/ ADC1_2 A4 B3 B3 143 [8] I; IA I ADC input channel 2. Shared between 10-bit ADC0/1. ADC0_3/ ADC1_3 B5 B4 A3 139 [8] I; IA I ADC input channel 3. Shared between 10-bit ADC0/1. ADC0_4/ ADC1_4 C6 A5 - 138 [8] I; IA I ADC input channel 4. Shared between 10-bit ADC0/1. ADC0_5/ ADC1_5 B3 C3 - 144 [8] I; IA I ADC input channel 5. Shared between 10-bit ADC0/1. ADC0_6/ ADC1_6 A5 A4 - 142 [8] I; IA I ADC input channel 6. Shared between 10-bit ADC0/1. ADC0_7/ ADC1_7 C5 B5 - 136 [8] I; IA I ADC input channel 7. Shared between 10-bit ADC0/1. RTC RTC_ALARM A11 A10 C3 129 [11] O O RTC controlled output. This pin has an internal pull-up. The reset state of this pin is LOW after POR. For all other types of reset, the reset state depends on the state of the RTC alarm interrupt. RTCX1 A8 A8 A5 125 [8] - I Input to the RTC 32 kHz ultra-low power oscillator circuit. RTCX2 B8 B7 B5 126 [8] - O Output from the RTC 32 kHz ultra-low power oscillator circuit. Crystal oscillator pins XTAL1 D1 C1 B1 12 [8] - I Input to the oscillator circuit and internal clock generator circuits. XTAL2 E1 D1 C1 13 [8] - O Output from the oscillator amplifier. Power and ground pins USB0_VDDA 3V3_DRIVER F3 E3 D1 16 - - Separate analog 3.3 V power supply for driver. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 59 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller USB0 _VDDA3V3 G3 F3 D2 17 - - USB 3.3 V separate power supply voltage. USB0_VSSA _TERM H3 G3 D3 19 - - Dedicated analog ground for clean reference for termination resistors. USB0_VSSA _REF G1 F1 F2 23 - - Dedicated clean analog ground for generation of reference currents and voltages. VDDA B4 A6 B2 137 - - Analog power supply and ADC reference voltage. VBAT B10 B9 C5 127 - - RTC power supply: 3.3 V on this pin supplies power to the RTC. VDDREG F10, F9, L8, L7 D8, E8 E4, E5, F4 94, 131, 59, 25 - Main regulator power supply. Tie the VDDREG and VDDIO pins to a common power supply to ensure the same ramp-up time for both supply voltages. VPP E8 - - - [12] - - OTP programming voltage. VDDIO D7, E12, F7, F8, G10, H10, J6, J7, K7, L9, L10, N7, N13 H5, H10, K8, G10 F10, K5 5, 36, 41, 71, 77, 107, 111, 141 [12] - - I/O power supply. Tie the VDDREG and VDDIO pins to a common power supply to ensure the same ramp-up time for both supply voltages. VDD - - - - Power supply for main regulator, I/O, and OTP. VSS G9, H7, J10, J11, K8 F10, D7, E6, E7, E9, K6, K9 - - [13] [14] - - Ground. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 60 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller [1] N = neutral, input buffer disabled; no extra VDDIO current consumption if the input is driven midway between supplies; set the EZI bit in the SFS register to enable the input buffer; I = input; OL = output driving LOW; OH = output driving HIGH; AI/O = analog input/output; IA = inactive; PU = pull-up enabled (weak pull-up resistor pulls up pin to VDDIO; F = floating. Reset state reflects the pin state at reset without boot code operation. [2] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V); provides digital I/O functions with TTL levels and hysteresis; normal drive strength. [3] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V); provides digital I/O functions with TTL levels, and hysteresis; high drive strength. [4] 5 V tolerant pad with 15 ns glitch filter (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V); provides high-speed digital I/O functions with TTL levels and hysteresis. [5] 5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input or output (5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V). When configured as an ADC input or DAC output, the pin is not 5 V tolerant and the digital section of the pad must be disabled by setting the pin to an input function and disabling the pull-up resistor through the pin’s SFSP register. [6] 5 V tolerant transparent analog pad. [7] For maximum load CL = 6.5 μF and maximum pull-down resistance Rpd = 80 kΩ, the VBUS signal takes about 2 s to fall from VBUS = 5 V to VBUS = 0.2 V when it is no longer driven. [8] Transparent analog pad. Not 5 V tolerant. [9] Pad provides USB functions 5 V tolerant if VDDIO present; if VDDIO not present, do not exceed 3.6 V. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and Low-speed mode only). [10] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus Fast Mode Plus specification. This pad requires an external pull-up to provide output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. [11] 5 V tolerant pad with 20 ns glitch filter; provides digital I/O functions with open-drain output and hysteresis. [12] On the TFBGA100 package, VPP is internally connected to VDDIO. [13] On the LQFP144 package, VSSIO and VSS are connected to a common ground plane. [14] On the TFBGA100 package, VSS is internally connected to VSSIO. VSSIO C4, D13, G6, G7, G8, H8, H9, J8, J9, K9, K10, M13, P7, P13 - C8, D4, D5, G8, J3, J6 4, 40, 76, 109 [13] [14] - - Ground. VSSA B2 A3 C2 135 - - Analog ground. Not connected - B9 B8 - - - - n.c. Table 3. Pin description …continued LCD, Ethernet, USB0, and USB1 functions are not available on all parts. See Table 2. Symbol LBGA256 TFBGA180 TFBGA100 LQFP144 Reset state [1] Type DescriptionLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 61 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7. Functional description 7.1 Architectural overview The ARM Cortex-M4 includes three AHB-Lite buses: the system bus, the I-CODE bus, and the D-code bus. The I-CODE and D-code core buses allow for concurrent code and data accesses from different slave ports. The LPC4350/30/20/10 use a multi-layer AHB matrix to connect the ARM Cortex-M4 buses and other bus masters to peripherals in a flexible manner that optimizes performance by allowing peripherals that are on different slaves ports of the matrix to be accessed simultaneously by different bus masters. An ARM Cortex-M0 co-processor is included in the LPC4350/30/20/10, capable of off-loading the main ARM Cortex-M4 application processor. Most peripheral interrupts are connected to both processors. The processors communicate with each other via an interprocessor communication protocol. 7.2 ARM Cortex-M4 processor The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals, and includes an internal prefetch unit that supports speculative branching. The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A hardware floating-point processor is integrated in the core. The processor includes an NVIC with up to 53 interrupts. 7.3 ARM Cortex-M0 co-processor The ARM Cortex-M0 is a general purpose, 32-bit microprocessor, which offers high performance and very low-power consumption. The ARM Cortex-M0 co-processor uses a 3-stage pipeline von-Neumann architecture and a small but powerful instruction set providing high-end processing hardware. The co-processor incorporates an NVIC with 32 interrupts. 7.4 Interprocessor communication The ARM Cortex-M4 and ARM Cortex-M0 interprocessor communication is based on using shared SRAM as mailbox and one processor raising an interrupt on the other processor's NVIC, for example after it has delivered a new message in the mailbox. The receiving processor can reply by raising an interrupt on the sending processor's NVIC to acknowledge the message.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 62 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.5 AHB multilayer matrix 7.6 Nested Vectored Interrupt Controller (NVIC) The NVIC is an integral part of the Cortex-M4. The tight coupling to the CPU allows for low interrupt latency and efficient processing of late arriving interrupts. The ARM Cortex-M0 co-processor has its own NVIC with 32 vectored interrupts. Most peripheral interrupts are shared between the Cortex-M0 and Cortex-M4 NVICs. Fig 6. AHB multilayer matrix master and slave connections ARM CORTEX-M4 TEST/DEBUG INTERFACE ARM CORTEX-M0 TEST/DEBUG INTERFACE DMA ETHERNET USB0 USB1 LCD SD/ MMC EXTERNAL MEMORY CONTROLLER APB, RTC DOMAIN PERIPHERALS 16 kB + 16 kB AHB SRAM 64 kB ROM 128 kB LOCAL SRAM 72 kB LOCAL SRAM System bus I- code bus D- code bus masters slaves 0 1 AHB MULTILAYER MATRIX = master-slave connection 32 kB AHB SRAM SPIFI SGPIO AHB PERIPHERALS REGISTER INTERFACES 002aaf873 HIGH-SPEED PHYLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 63 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.6.1 Features • Controls system exceptions and peripheral interrupts. • The Cortex-M4 NVIC supports up to 53 vectored interrupts. • Eight programmable interrupt priority levels with hardware priority level masking. • Relocatable vector table. • Non-Maskable Interrupt (NMI). • Software interrupt generation. 7.6.2 Interrupt sources Each peripheral device has one interrupt line connected to the NVIC but may have several interrupt flags. Individual interrupt flags can represent more than one interrupt source. 7.7 System Tick timer (SysTick) The ARM Cortex-M4 includes a system tick timer (SysTick) that is intended to generate a dedicated SYSTICK exception at a 10 ms interval. Remark: The SysTick is not included in the ARM Cortex-M0 core. 7.8 Event router The event router combines various internal signals, interrupts, and the external interrupt pins (WAKEUP[3:0]) to create an interrupt in the NVIC, if enabled. In addition, the event router creates a wake-up signal to the ARM core and the CCU for waking up from Sleep, Deep-sleep, Power-down, and Deep power-down modes. Individual events can be configured as edge or level sensitive and can be enabled or disabled in the event router. The event router can be battery powered. The following events if enabled in the event router can create a wake-up signal from sleep, deep-sleep, power-down, and deep power-down modes and/or create an interrupt: • External pins WAKEUP0/1/2/3 and RESET • Alarm timer, RTC (32 kHz oscillator running) The following events if enabled in the event router can create a wake-up signal from sleep mode only and/or create an interrupt: • WWDT, BOD interrupts • C_CAN0/1 and QEI interrupts • Ethernet, USB0, USB1 signals • Selected outputs of combined timers (SCTimer/PWM and timer0/1/3) Remark: Any interrupt can wake up the ARM Cortex-M4 from sleep mode if enabled in the NVIC. 7.9 Global Input Multiplexer Array (GIMA) The GIMA routes signals to event-driven peripheral targets like the SCTimer/PWM, timers, event router, or the ADCs.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 64 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.9.1 Features • Single selection of a source. • Signal inversion. • Can capture a pulse if the input event source is faster than the target clock. • Synchronization of input event and target clock. • Single-cycle pulse generation for target. 7.10 On-chip static RAM The LPC4350/30/20/10 support up to 200 kB local SRAM and an additional 64 kB AHB SRAM with separate bus master access for higher throughput and individual power control for low-power operation. 7.11 In-System Programming (ISP) In-System Programming (ISP) means programming or reprogramming the on-chip SRAM memory, using the boot loader software and the USART0 serial port. ISP can be performed when the part resides in the end-user board. ISP loads data into on-chip SRAM and execute code from on-chip SRAM. 7.12 Boot ROM The internal ROM memory is used to store the boot code of the LPC4350/30/20/10. After a reset, the ARM processor will start its code execution from this memory. The boot ROM memory includes the following features: • The ROM memory size is 64 kB. • Supports booting from UART interfaces and external static memory such as NOR flash, quad SPI flash, and USB0 and USB1. • Includes API for OTP programming. • Includes a flexible USB device stack that supports Human Interface Device (HID), Mass Storage Class (MSC), and Device Firmware Upgrade (DFU) drivers. Several boot modes are available depending on the values of the OTP bits BOOT_SRC. If the OTP memory is not programmed or the BOOT_SRC bits are all zero, the boot mode is determined by the states of the boot pins P2_9, P2_8, P1_2, and P1_1. Table 4. Boot mode when OTP BOOT_SRC bits are programmed Boot mode BOOT_SRC bit 3 BOOT_SRC bit 2 BOOT_SRC bit 1 BOOT_SRC bit 0 Description Pin state 0 0 0 0 Boot source is defined by the reset state of P1_1, P1_2, P2_8, and P2_9 pins. See Table 5. USART0 0 0 0 1 Boot from device connected to USART0 using pins P2_0 and P2_1. SPIFI 0 0 1 0 Boot from Quad SPI flash connected to the SPIFI interface using pins P3_3 to P3_8. EMC 8-bit 0 0 1 1 Boot from external static memory (such as NOR flash) using CS0 and an 8-bit data bus.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 65 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller [1] The boot loader programs the appropriate pin function at reset to boot using either SSP0 or SPIFI. Remark: Pin functions for SPIFI and SSP0 boot are different. [1] The boot loader programs the appropriate pin function at reset to boot using either SSP0 or SPIFI. Remark: Pin functions for SPIFI and SSP0 boot are different. 7.13 Memory mapping The memory map shown in Figure 7 and Figure 8 is global to both the Cortex-M4 and the Cortex-M0 processors and all SRAM is shared between both processors. Each processor uses its own ARM private bus memory map for the NVIC and other system functions. EMC 16-bit 0 1 0 0 Boot from external static memory (such as NOR flash) using CS0 and a 16-bit data bus. EMC 32-bit 0 1 0 1 Boot from external static memory (such as NOR flash) using CS0 and a 32-bit data bus. USB00 1 1 0 Boot from USB0. USB10 1 1 1 Boot from USB1. SPI (SSP) 1 0 0 0 Boot from SPI flash connected to the SSP0 interface on P3_3 (function SSP0_SCK), P3_6 (function SSP0_SSEL), P3_7 (function SSP0_MISO), and P3_8 (function SSP0_MOSI)[1]. USART3 1 0 0 1 Boot from device connected to USART3 using pins P2_3 and P2_4. Table 4. Boot mode when OTP BOOT_SRC bits are programmed …continued Boot mode BOOT_SRC bit 3 BOOT_SRC bit 2 BOOT_SRC bit 1 BOOT_SRC bit 0 Description Table 5. Boot mode when OPT BOOT_SRC bits are zero Boot mode Pins Description P2_9 P2_8 P1_2 P1_1 USART0 LOW LOW LOW LOW Boot from device connected to USART0 using pins P2_0 and P2_1. SPIFI LOW LOW LOW HIGH Boot from Quad SPI flash connected to the SPIFI interface on P3_3 to P3_8[1]. EMC 8-bit LOW LOW HIGH LOW Boot from external static memory (such as NOR flash) using CS0 and an 8-bit data bus. EMC 16-bit LOW LOW HIGH HIGH Boot from external static memory (such as NOR flash) using CS0 and a 16-bit data bus. EMC 32-bit LOW HIGH LOW LOW Boot from external static memory (such as NOR flash) using CS0 and a 32-bit data bus. USB0 LOW HIGH LOW HIGH Boot from USB0 USB1 LOW HIGH HIGH LOW Boot from USB1. SPI (SSP) LOW HIGH HIGH HIGH Boot from SPI flash connected to the SSP0 interface on P3_3 (function SSP0_SCK), P3_6 (function SSP0_SSEL), P3_7 (function SSP0_MISO), and P3_8 (function SSP0_MOSI)[1]. USART3 HIGH LOW LOW LOW Boot from device connected to USART3 using pins P2_3 and P2_4.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 66 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 7. LPC4350/30/20/10 Memory mapping (overview) reserved peripheral bit band alias region reserved reserved high-speed GPIO reserved 0 GB 0x0000 0000 1 GB 4 GB 0x2001 0000 0x2200 0000 0x2400 0000 0x2800 0000 0x1000 0000 0x3000 0000 0x4000 0000 0x4001 2000 0x4004 0000 0x4005 0000 0x4010 0000 0x4400 0000 0x6000 0000 AHB peripherals APB peripherals #0 APB peripherals #1 reserved reserved reserved RTC domain peripherals 0x4006 0000 0x4008 0000 0x4009 0000 0x400A 0000 0x400B 0000 0x400C 0000 0x400D 0000 0x400E 0000 0x400F 0000 0x400F 1000 0x400F 2000 0x400F 4000 0x400F 8000 clocking/reset peripherals APB peripherals #2 APB peripherals #3 0x2000 8000 16 kB AHB SRAM (LPC4350/30) 16 kB AHB SRAM (LPC4350/30/20/10) 0x2000 C000 16 kB AHB SRAM (LPC4350/30) 16 kB AHB SRAM (LPC4350/30/20/10) SGPIO SPI 0x4010 1000 0x4010 2000 0x4200 0000 reserved local SRAM/ external static memory banks 0x2000 0000 0x2000 4000 128 MB dynamic external memory DYCS0 256 MB dynamic external memory DYCS1 256 MB dynamic external memory DYCS2 256 MB dynamic external memory DYCS3 0x7000 0000 0x8000 0000 0x8800 0000 0xE000 0000 256 MB shadow area LPC4350/30/20/10 0x1000 0000 0x1002 0000 0x1008 0000 0x1008 A000 0x1009 2000 0x1040 0000 0x1041 0000 0x1C00 0000 0x1D00 0000 reserved reserved 32 MB AHB SRAM bit banding reserved reserved reserved 0xE010 0000 0xFFFF FFFF reserved SPIFI data ARM private bus reserved 0x1001 8000 32 kB local SRAM (LPC4350/30/20) 96 kB local SRAM (LPC4350/30/20/10) 32 kB + 8 kB local SRAM (LPC4320/10) 64 kB + 8 kB local SRAM (LPC4350/30) reserved reserved reserved reserved 64 kB ROM 0x1400 0000 0x1800 0000 SPIFI data 0x1E00 0000 0x1F00 0000 0x2000 0000 16 MB static external memory CS3 16 MB static external memory CS2 16 MB static external memory CS1 16 MB static external memory CS0 002aaf774xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 67 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 8. LPC4350/30/20/10 Memory mapping (peripherals) reserved peripheral bit band alias region high-speed GPIO reserved reserved reserved reserved 0x4000 0000 0x0000 0000 0x4001 2000 0x4004 0000 0x4005 0000 0x4010 0000 0x4400 0000 0x6000 0000 0xFFFF FFFF AHB peripherals SRAM memories external memory banks APB0 peripherals APB1 peripherals reserved reserved reserved RTC domain peripherals 0x4006 0000 0x4008 0000 0x4009 0000 0x400A 0000 0x400B 0000 0x400C 0000 0x400D 0000 0x400E 0000 0x400F 0000 0x400F 1000 0x400F 2000 0x400F 4000 0x400F 8000 clocking/reset peripherals APB2 peripherals APB3 peripherals SGPIO SPI 0x4010 1000 0x4010 2000 0x4200 0000 reserved external memories and ARM private bus APB2 peripherals 0x400C 1000 0x400C 2000 0x400C 3000 0x400C 4000 0x400C 6000 0x400C 8000 0x400C 7000 0x400C 5000 0x400C 0000 RI timer USART2 USART3 timer2 timer3 SSP1 QEI APB1 peripherals 0x400A 1000 0x400A 2000 0x400A 3000 0x400A 4000 0x400A 5000 0x400B 0000 0x400A 0000 motor control PWM I2C0 I2S0 I2S1 C_CAN1 reserved AHB peripherals 0x4000 1000 0x4000 0000 SCT 0x4000 2000 0x4000 3000 0x4000 4000 0x4000 6000 0x4000 8000 0x4001 0000 0x4001 2000 0x4000 9000 0x4000 7000 0x4000 5000 DMA SD/MMC EMC USB1 LCD USB0 reserved SPIFI ethernet reserved 0x4008 1000 0x4008 0000 WWDT 0x4008 2000 0x4008 3000 0x4008 4000 0x4008 6000 0x4008 A000 0x4008 7000 0x4008 8000 0x4008 9000 0x4008 5000 UART1 w/ modem SSP0 timer0 timer1 SCU GPIO interrupts GPIO GROUP0 interrupt GPIO GROUP1 interrupt USART0 RTC domain peripherals 0x4004 1000 alarm timer 0x4004 0000 0x4004 2000 0x4004 3000 0x4004 4000 0x4004 6000 0x4004 7000 0x4004 5000 power mode control CREG event router OTP controller reserved reserved RTC backup registers clocking reset control peripherals 0x4005 1000 0x4005 0000 CGU 0x4005 2000 0x4005 3000 0x4005 4000 0x4006 0000 CCU2 RGU CCU1 LPC4350/30/20/10 002aaf775 reserved reserved APB3 peripherals 0x400E 1000 0x400E 2000 0x400E 3000 0x400E 4000 0x400F 0000 0x400E 5000 0x400E 0000 I2C1 DAC C_CAN0 ADC0 ADC1 reserved GIMA APB0 peripheralsLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 68 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.14 One-Time Programmable (OTP) memory The OTP provides 64 bit + 256 bit One-Time Programmable (OTP) memory for general-purpose use. 7.15 General-Purpose I/O (GPIO) The LPC4350/30/20/10 provide eight GPIO ports with up to 31 GPIO pins each. Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back as well as the current state of the port pins. All GPIO pins default to inputs with pull-up resistors enabled and input buffer disabled on reset. The input buffer must be turned on in the system control block SFS register before the GPIO input can be read. 7.15.1 Features • Accelerated GPIO functions: – GPIO registers are located on the AHB so that the fastest possible I/O timing can be achieved. – Mask registers allow treating sets of port bits as a group, leaving other bits unchanged. – All GPIO registers are byte and half-word addressable. – Entire port value can be written in one instruction. • Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port. • Direction control of individual bits. • Up to eight GPIO pins can be selected from all GPIO pins to create an edge- or level-sensitive GPIO interrupt request (GPIO interrupts). • Two GPIO group interrupts can be triggered by any pin or pins in each port (GPIO group0 and group1 interrupts). 7.16 Configurable digital peripherals 7.16.1 State Configurable Timer (SCTimer/PWM) subsystem The SCTimer/PWM allows a wide variety of timing, counting, output modulation, and input capture operations. The inputs and outputs of the SCTimer/PWM are shared with the capture and match inputs/outputs of the 32-bit general-purpose counter/timers. The SCTimer/PWM can be configured as two 16-bit counters or a unified 32-bit counter. In the two-counter case, in addition to the counter value the following operational elements are independent for each half: • State variable • Limit, halt, stop, and start conditions • Values of Match/Capture registers, plus reload or capture control valuesLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 69 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller In the two-counter case, the following operational elements are global to the SCTimer/PWM, but the last three can use match conditions from either counter: • Clock selection • Inputs • Events • Outputs • Interrupts 7.16.1.1 Features • Two 16-bit counters or one 32-bit counter. • Counters clocked by bus clock or selected input. • Counters can be configured as up-counters or up-down counters. • State variable allows sequencing across multiple counter cycles. • Event combines input or output condition and/or counter match in a specified state. • Events control outputs and interrupts. • Selected events can limit, halt, start, or stop a counter. • Supports: – up to 8 inputs – 16 outputs – 16 match/capture registers – 16 events – 32 states 7.16.2 Serial GPIO (SGPIO) The Serial GPIOs offer standard GPIO functionality enhanced with features to accelerate serial stream processing. 7.16.2.1 Features • Each SGPIO input/output slice can be used to perform a serial to parallel or parallel to serial data conversion. • 16 SGPIO input/output slices each with a 32-bit FIFO that can shift the input value from a pin or an output value to a pin with every cycle of a shift clock. • Each slice is double-buffered. • Interrupt is generated on a full FIFO, shift clock, or pattern match. • Slices can be concatenated to increase buffer size. • Each slice has a 32-bit pattern match filter.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 70 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.17 AHB peripherals 7.17.1 General-Purpose DMA (GPDMA) The DMA controller allows peripheral-to memory, memory-to-peripheral, peripheral-to-peripheral, and memory-to-memory transactions. Each DMA stream provides unidirectional serial DMA transfers for a single source and destination. For example, a bidirectional port requires one stream for transmit and one for receives. The source and destination areas can each be either a memory region or a peripheral for master 1, but only memory for master 0. 7.17.1.1 Features • Eight DMA channels. Each channel can support a unidirectional transfer. • 16 DMA request lines. • Single DMA and burst DMA request signals. Each peripheral connected to the DMA Controller can assert either a burst DMA request or a single DMA request. The DMA burst size is set by programming the DMA Controller. • Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-peripheral transfers are supported. • Scatter or gather DMA is supported through the use of linked lists. This means that the source and destination areas do not have to occupy contiguous areas of memory. • Hardware DMA channel priority. • AHB slave DMA programming interface. The DMA Controller is programmed by writing to the DMA control registers over the AHB slave interface. • Two AHB bus masters for transferring data. These interfaces transfer data when a DMA request goes active. Master 1 can access memories and peripherals, master 0 can access memories only. • 32-bit AHB master bus width. • Incrementing or non-incrementing addressing for source and destination. • Programmable DMA burst size. The DMA burst size can be programmed to more efficiently transfer data. • Internal four-word FIFO per channel. • Supports 8, 16, and 32-bit wide transactions. • Big-endian and little-endian support. The DMA Controller defaults to little-endian mode on reset. • An interrupt to the processor can be generated on a DMA completion or when a DMA error has occurred. • Raw interrupt status. The DMA error and DMA count raw interrupt status can be read prior to masking. 7.17.2 SPI Flash Interface (SPIFI) The SPI Flash Interface allows low-cost serial flash memories to be connected to the ARM Cortex-M4 processor with little performance penalty compared to parallel flash devices with higher pin count. LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 71 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller After a few commands configure the interface at startup, the entire flash content is accessible as normal memory using byte, halfword, and word accesses by the processor and/or DMA channels. Simple sequences of commands handle erasing and programming. Many serial flash devices use a half-duplex command-driven SPI protocol for device setup and initialization and then move to a half-duplex, command-driven 4-bit protocol for normal operation. Different serial flash vendors and devices accept or require different commands and command formats. SPIFI provides sufficient flexibility to be compatible with common flash devices and includes extensions to help insure compatibility with future devices. 7.17.2.1 Features • Interfaces to serial flash memory in the main memory map. • Supports classic and 4-bit bidirectional serial protocols. • Half-duplex protocol compatible with various vendors and devices. • Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to 52 MB per second. • Supports DMA access. 7.17.3 SD/MMC card interface The SD/MMC card interface supports the following modes to control: • Secure Digital memory (SD version 3.0) • Secure Digital I/O (SDIO version 2.0) • Consumer Electronics Advanced Transport Architecture (CE-ATA version 1.1) • MultiMedia Cards (MMC version 4.4) 7.17.4 External Memory Controller (EMC) The LPC4350/30/20/10 EMC is a Memory Controller peripheral offering support for asynchronous static memory devices such as RAM, ROM, and NOR flash. In addition, it can be used as an interface with off-chip memory-mapped devices and peripherals. 7.17.4.1 Features • Dynamic memory interface support including single data rate SDRAM. • Asynchronous static memory device support including RAM, ROM, and NOR flash, with or without asynchronous page mode. • Low transaction latency. • Read and write buffers to reduce latency and to improve performance. • 8/16/32 data and 24 address lines-wide static memory support. • 16 bit and 32 bit wide chip select SDRAM memory support. • Static memory features include: – Asynchronous page mode read – Programmable Wait States – Bus turnaround delayLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 72 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller – Output enable and write enable delays – Extended wait • Four chip selects for synchronous memory and four chip selects for static memory devices. • Power-saving modes dynamically control EMC_CKEOUT and EMC_CLK signals to SDRAMs. • Dynamic memory self-refresh mode controlled by software. • Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row address synchronous memory parts. Those are typically 512 MB, 256 MB, and 128 MB parts, with 4, 8, 16, or 32 data bits per device. • Separate reset domains allow auto-refresh through a chip reset if desired. • SDRAM clock can run at full or half the Cortex-M4 core frequency. Note: Synchronous static memory devices (synchronous burst mode) are not supported. 7.17.5 High-speed USB Host/Device/OTG interface (USB0) Remark: The USB0 controller is available on parts LPC4350/30/20. See Table 2. The USB OTG module allows the LPC4350/30/20/10 to connect directly to a USB Host such as a PC (in device mode) or to a USB Device in host mode. 7.17.5.1 Features • On-chip UTMI+ compliant high-speed transceiver (PHY). • Complies with Universal Serial Bus specification 2.0. • Complies with USB On-The-Go supplement. • Complies with Enhanced Host Controller Interface Specification. • Supports auto USB 2.0 mode discovery. • Supports all high-speed USB-compliant peripherals. • Supports all full-speed USB-compliant peripherals. • Supports software Host Negotiation Protocol (HNP) and Session Request Protocol (SRP) for OTG peripherals. • Supports interrupts. • This module has its own, integrated DMA engine. • USB interface electrical test software included in ROM USB stack. 7.17.6 High-speed USB Host/Device interface with ULPI (USB1) Remark: The USB1 controller is available on parts LPC4350/30. See Table 2. The USB1 interface can operate as a full-speed USB Host/Device interface or can connect to an external ULPI PHY for High-speed operation. 7.17.6.1 Features • Complies with Universal Serial Bus specification 2.0. • Complies with Enhanced Host Controller Interface Specification.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 73 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • Supports auto USB 2.0 mode discovery. • Supports all high-speed USB-compliant peripherals if connected to external ULPI PHY. • Supports all full-speed USB-compliant peripherals. • Supports interrupts. • This module has its own, integrated DMA engine. • USB interface electrical test software included in ROM USB stack. 7.17.7 LCD controller Remark: The LCD controller is available on LPC4350 only. See Table 2. The LCD controller provides all of the necessary control signals to interface directly to various color and monochrome LCD panels. Both STN (single and dual panel) and TFT panels can be operated. The display resolution is selectable and can be up to 1024 768 pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode. An on-chip 512 byte color palette allows reducing bus utilization (that is, memory size of the displayed data) while still supporting many colors. The LCD interface includes its own DMA controller to allow it to operate independently of the CPU and other system functions. A built-in FIFO acts as a buffer for display data, providing flexibility for system timing. Hardware cursor support can further reduce the amount of CPU time required to operate the display. 7.17.7.1 Features • AHB master interface to access frame buffer. • Setup and control via a separate AHB slave interface. • Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data. • Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays with 4-bit or 8-bit interfaces. • Supports single and dual-panel color STN displays. • Supports Thin Film Transistor (TFT) color displays. • Programmable display resolution including, but not limited to: 320 200, 320 240, 640 200, 640 240, 640 480, 800 600, and 1024 768. • Hardware cursor support for single-panel displays. • 15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support. • 1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN. • 1, 2, 4, or 8 bpp palettized color displays for color STN and TFT. • 16 bpp true-color non-palettized for color STN and TFT. • 24 bpp true-color non-palettized for color TFT. • Programmable timing for different display panels. • 256 entry, 16-bit palette RAM, arranged as a 128 32-bit RAM. • Frame, line, and pixel clock signals. • AC bias signal for STN, data enable signal for TFT panels. • Supports little and big-endian, and Windows CE data formats.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 74 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • LCD panel clock may be generated from the peripheral clock, or from a clock input pin. 7.17.8 Ethernet Remark: The Ethernet peripheral is available on parts LPC4350/30. See Table 2. 7.17.8.1 Features • 10/100 Mbit/s • DMA support • Power management remote wake-up frame and magic packet detection • Supports both full-duplex and half-duplex operation – Supports CSMA/CD Protocol for half-duplex operation. – Supports IEEE 802.3x flow control for full-duplex operation. – Optional forwarding of received pause control frames to the user application in full-duplex operation. – Back-pressure support for half-duplex operation. – Automatic transmission of zero-quanta pause frame on deassertion of flow control input in full-duplex operation. • Supports IEEE1588 time stamping and IEEE 1588 advanced time stamping (IEEE 1588-2008 v2). 7.18 Digital serial peripherals 7.18.1 UART1 The LPC4350/30/20/10 contain one UART with standard transmit and receive data lines. UART1 also provides a full modem control handshake interface and support for RS-485/9-bit mode allowing both software address detection and automatic address detection using 9-bit mode. UART1 includes a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.18.1.1 Features • Maximum UART data bit rate of 8 MBit/s. • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • Equipped with standard modem interface signals. This module also provides full support for hardware flow control. • Support for RS-485/9-bit/EIA-485 mode (UART1).LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 75 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • DMA support. 7.18.2 USART0/2/3 The LPC4350/30/20/10 contain three USARTs. In addition to standard transmit and receive data lines, the USARTs support a synchronous mode. The USARTs include a fractional baud rate generator. Standard baud rates such as 115200 Bd can be achieved with any crystal frequency above 2 MHz. 7.18.2.1 Features • Maximum UART data bit rate of 8 MBit/s. • 16 B Receive and Transmit FIFOs. • Register locations conform to 16C550 industry standard. • Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B. • Built-in fractional baud rate generator covering wide range of baud rates without a need for external crystals of particular values. • Auto baud capabilities and FIFO control mechanism that enables software flow control implementation. • Support for RS-485/9-bit/EIA-485 mode. • USART3 includes an IrDA mode to support infrared communication. • All USARTs have DMA support. • Support for synchronous mode at a data bit rate of up to 8 Mbit/s. • Smart card mode conforming to ISO7816 specification 7.18.3 SPI serial I/O controller The LPC4350/30/20/10 contain one SPI controller. SPI is a full-duplex serial interface designed to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave always sends 8 bits to 16 bits of data to the master. 7.18.3.1 Features • Maximum SPI data bit rate 25 Mbit/s. • Compliant with SPI specification • Synchronous, serial, full-duplex communication • Combined SPI master and slave • Maximum data bit rate of one eighth of the input clock rate • 8 bits to 16 bits per transfer 7.18.4 SSP serial I/O controller Remark: The LPC4350/30/20/10 contain two SSP controllers. The SSP controller can operate on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the bus. Only a single master and a single slave can communicate on the bus during a given data transfer. The SSP supports full-duplex LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 76 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller transfers, with frames of 4 bit to 16 bit of data flowing from the master to the slave and from the slave to the master. In practice, often only one of these data flows carries meaningful data. 7.18.4.1 Features • Maximum SSP speed in full-duplex mode of 25 Mbit/s; for transmit only 50 Mbit/s (master) and 17 Mbit/s (slave). • Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National Semiconductor Microwire buses • Synchronous serial communication • Master or slave operation • 8-frame FIFOs for both transmit and receive • 4-bit to 16-bit frame • DMA transfers supported by GPDMA 7.18.5 I2C-bus interface Remark: The LPC4350/30/20/10 contain two I2C-bus interfaces. The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock line (SCL) and a Serial Data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (for example an LCD driver) or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be controlled by more than one bus master connected to it. 7.18.5.1 Features • I 2C0 is a standard I2C-compliant bus interface with open-drain pins. I2C0 also supports Fast mode plus with bit rates up to 1 Mbit/s. • I 2C1 uses standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus). • Easy to configure as master, slave, or master/slave. • Programmable clocks allow versatile rate control. • Bidirectional data transfer between masters and slaves. • Multi-master bus (no central master). • Arbitration between simultaneously transmitting masters without corruption of serial data on the bus. • Serial clock synchronization allows devices with different bit rates to communicate via one serial bus. • Serial clock synchronization can be used as a handshake mechanism to suspend and resume serial transfer. • The I2C-bus can be used for test and diagnostic purposes. • All I2C-bus controllers support multiple address recognition and a bus monitor mode. 7.18.6 I2S interface Remark: The LPC4350/30/20/10 contain two I2S-bus interfaces.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 77 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller The I2S-bus provides a standard communication interface for digital audio applications. The I 2S-bus specification defines a 3-wire serial bus using one data line, one clock line, and one word select signal. The basic I2S-bus connection has one master, which is always the master, and one slave. The I2S-bus interface provides a separate transmit and receive channel, each of which can operate as either a master or a slave. 7.18.6.1 Features • The I2S interface has separate input/output channels, each of which can operate in master or slave mode. • Capable of handling 8-bit, 16-bit, and 32-bit word sizes. • Mono and stereo audio data supported. • The sampling frequency can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48, 96, 192) kHz. • Support for an audio master clock. • Configurable word select period in master mode (separately for I2S-bus input and output). • Two 8-word FIFO data buffers are provided, one for transmit and one for receive. • Generates interrupt requests when buffer levels cross a programmable boundary. • Two DMA requests controlled by programmable buffer levels. The DMA requests are connected to the GPDMA block. • Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus output. 7.18.7 C_CAN Remark: The LPC4350/30/20/10 contain two C_CAN controllers. Controller Area Network (CAN) is the definition of a high performance communication protocol for serial data communication. The C_CAN controller is designed to provide a full implementation of the CAN protocol according to the CAN Specification Version 2.0B. The C_CAN controller can create powerful local networks with low-cost multiplex wiring by supporting distributed real-time control with a high level of reliability. 7.18.7.1 Features • Conforms to protocol version 2.0 parts A and B. • Supports bit rate of up to 1 Mbit/s. • Supports 32 Message Objects. • Each Message Object has its own identifier mask. • Provides programmable FIFO mode (concatenation of Message Objects). • Provides maskable interrupts. • Supports Disabled Automatic Retransmission (DAR) mode for time-triggered CAN applications. • Provides programmable loop-back mode for self-test operation.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 78 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.19 Counter/timers and motor control 7.19.1 General purpose 32-bit timers/external event counters The LPC4350/30/20/10 include four 32-bit timer/counters. The timer/counter is designed to count cycles of the system derived clock or an externally-supplied clock. It can optionally generate interrupts, generate timed DMA requests, or perform other actions at specified timer values, based on four match registers. Each timer/counter also includes two capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. 7.19.1.1 Features • A 32-bit timer/counter with a programmable 32-bit prescaler. • Counter or timer operation. • Two 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event can also generate an interrupt. • Four 32-bit match registers that allow: – Continuous operation with optional interrupt generation on match. – Stop timer on match with optional interrupt generation. – Reset timer on match with optional interrupt generation. • Up to four external outputs corresponding to match registers, with the following capabilities: – Set LOW on match. – Set HIGH on match. – Toggle on match. – Do nothing on match. • Up to two match registers can be used to generate timed DMA requests. 7.19.2 Motor control PWM The motor control PWM is a specialized PWM supporting 3-phase motors and other combinations. Feedback inputs are provided to automatically sense rotor position and use that information to ramp speed up or down. An abort input causes the PWM to release all motor drive outputs immediately . At the same time, the motor control PWM is highly configurable for other generalized timing, counting, capture, and compare applications. 7.19.3 Quadrature Encoder Interface (QEI) A quadrature encoder, also known as a 2-channel incremental encoder, converts angular displacement into two pulse signals. By monitoring both the number of pulses and the relative phase of the two signals, the user code can track the position, direction of rotation, and velocity. In addition, a third channel, or index signal, can be used to reset the position counter. The quadrature encoder interface decodes the digital pulses from a quadrature encoder wheel to integrate position over time and determine direction of rotation. In addition, the QEI can capture the velocity of the encoder wheel. 7.19.3.1 Features • Tracks encoder position.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 79 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • Increments/decrements depending on direction. • Programmable for 2 or 4 position counting. • Velocity capture using built-in timer. • Velocity compare function with “less than” interrupt. • Uses 32-bit registers for position and velocity. • Three position-compare registers with interrupts. • Index counter for revolution counting. • Index compare register with interrupts. • Can combine index and position interrupts to produce an interrupt for whole and partial revolution displacement. • Digital filter with programmable delays for encoder input signals. • Can accept decoded signal inputs (clk and direction). 7.19.4 Repetitive Interrupt (RI) timer The repetitive interrupt timer provides a free-running 32-bit counter which is compared to a selectable value, generating an interrupt when a match occurs. Any bits of the timer/compare function can be masked such that they do not contribute to the match detection. The repetitive interrupt timer can be used to create an interrupt that repeats at predetermined intervals. 7.19.4.1 Features • 32-bit counter. Counter can be free-running or be reset by a generated interrupt. • 32-bit compare value. • 32-bit compare mask. An interrupt is generated when the counter value equals the compare value, after masking. This mechanism allows for combinations not possible with a simple compare. 7.19.5 Windowed WatchDog Timer (WWDT) The purpose of the watchdog is to reset the controller if software fails to periodically service it within a programmable time window. 7.19.5.1 Features • Internally resets chip if not periodically reloaded during the programmable time-out period. • Optional windowed operation requires reload to occur between a minimum and maximum time period, both programmable. • Optional warning interrupt can be generated at a programmable time prior to watchdog time-out. • Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be disabled. • Incorrect feed sequence causes reset or interrupt if enabled. • Flag to indicate watchdog reset. • Programmable 24-bit timer with internal prescaler.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 80 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • Selectable time period from (Tcy(WDCLK) 256 4) to (Tcy(WDCLK) 224 4) in multiples of Tcy(WDCLK) 4. • The Watchdog Clock (WDCLK) uses the IRC as the clock source. 7.20 Analog peripherals 7.20.1 Analog-to-Digital Converter (ADC0/1) 7.20.1.1 Features • 10-bit successive approximation analog to digital converter. • Input multiplexing among 8 pins. • Power-down mode. • Measurement range 0 to VDDA. • Sampling frequency up to 400 kSamples/s. • Burst conversion mode for single or multiple inputs. • Optional conversion on transition on ADCTRIG0 or ADCTRIG1 pins, combined timer outputs 8 or 15, or the PWM output MCOA2. • Individual result registers for each A/D channel to reduce interrupt overhead. • DMA support. 7.20.2 Digital-to-Analog Converter (DAC) 7.20.2.1 Features • 10-bit resolution • Monotonic by design (resistor string architecture) • Controllable conversion speed • Low-power consumption 7.21 Peripherals in the RTC power domain 7.21.1 RTC The Real-Time Clock (RTC) is a set of counters for measuring time when system power is on, and optionally when it is off. It uses little power when the CPU does not access its registers, especially in the reduced power modes. A separate 32 kHz oscillator clocks the RTC. The oscillator produces a 1 Hz internal time reference and is powered by its own power supply pin, VBAT. 7.21.1.1 Features • Measures the passage of time to maintain a calendar and clock. Provides seconds, minutes, hours, day of month, month, year, day of week, and day of year. • Ultra-low power design to support battery powered systems. Uses power from the CPU power supply when it is present. • Dedicated battery power supply pin. • RTC power supply is isolated from the rest of the chip.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 81 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • Calibration counter allows adjustment to better than 1 sec/day with 1 sec resolution. • Periodic interrupts can be generated from increments of any field of the time registers. • Alarm interrupt can be generated for a specific date/time. 7.21.2 Alarm timer The alarm timer is a 16-bit timer and counts down at 1 kHz from a preset value generating alarms in intervals of up to 1 min. The counter triggers a status bit when it reaches 0x00 and asserts an interrupt if enabled. The alarm timer is part of the RTC power domain and can be battery powered. 7.22 System control 7.22.1 Configuration registers (CREG) The following settings are controlled in the configuration register block: • BOD trip settings • Oscillator output • DMA-to-peripheral muxing • Ethernet mode • Memory mapping • Timer/USART inputs • Enabling the USB controllers In addition, the CREG block contains the part identification and part configuration information. 7.22.2 System Control Unit (SCU) The system control unit determines the function and electrical mode of the digital pins. By default function 0 is selected for all pins with pull-up enabled. For pins that support a digital and analog function, the ADC function select registers in the SCU enable the analog function. A separate set of analog I/Os for the ADCs and the DAC as well as most USB pins are located on separate pads and are not controlled through the SCU. In addition, the clock delay register for the SDRAM EMC_CLK pins and the registers that select the pin interrupts are located in the SCU. 7.22.3 Clock Generation Unit (CGU) The Clock Generator Unit (CGU) generates several base clocks. The base clocks can be unrelated in frequency and phase and can have different clock sources within the CGU. One CGU base clock is routed to the CLKOUT pins. The base clock that generates the CPU clock is referred to as CCLK. Multiple branch clocks are derived from each base clock. The branch clocks offer flexible control for power-management purposes. All branch clocks are outputs of one of two Clock Control Units (CCUs) and can be controlled independently. Branch clocks derived from the same base clock are synchronous in frequency and phase. LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 82 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.22.4 Internal RC oscillator (IRC) The IRC is used as the clock source for the WWDT and/or as the clock that drives the PLLs and the CPU. The nominal IRC frequency is 12 MHz. The IRC is trimmed to 1.5 % accuracy over the entire voltage and temperature range. Upon power-up or any chip reset, the LPC4350/30/20/10 use the IRC as the clock source. The boot loader then configures the PLL1 to provide a 96 MHz clock for the core and the PLL0USB or PLL0AUDIO as needed if an external boot source is selected. 7.22.5 PLL0USB (for USB0) PLL0 is a dedicated PLL for the USB0 High-speed controller. PLL0 accepts an input clock frequency from an external oscillator in the range of 14 kHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The CCO operates in the range of 4.3 MHz to 550 MHz. 7.22.6 PLL0AUDIO (for audio) The audio PLL PLL0AUDIO is a general-purpose PLL with a small step size. This PLL accepts an input clock frequency derived from an external oscillator or internal IRC. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). A sigma-delta converter modulates the PLL divider ratios to obtain the desired output frequency. The output frequency can be set as a multiple of the sampling frequency fs to 32fs, 64fs, 128 fs, 256 fs, 384 fs, 512 fs and the sampling frequency fs can range from 16 kHz to 192 kHz (16, 22.05, 32, 44.1, 48, 96,192) kHz. Many other frequencies are possible as well using the integrated fractional divider. 7.22.7 System PLL1 The PLL1 accepts an input clock frequency from an external oscillator in the range of 1 MHz to 25 MHz. The input frequency is multiplied up to a high frequency with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32. The CCO operates in the range of 156 MHz to 320 MHz. This range is possible through an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider can be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and bypassed following a chip reset. After reset, software can enable the PLL. The program must configure and activate the PLL, wait for the PLL to lock, and then connect to the PLL as a clock source. The PLL settling time is 100 s. 7.22.8 Reset Generation Unit (RGU) The RGU allows generation of independent reset signals for individual blocks and peripherals on the LPC4350/30/20/10. 7.22.9 Power control The LPC4350/30/20/10 feature several independent power domains to control power to the core and the peripherals (see Figure 9). The RTC and its associated peripherals (the alarm timer, the CREG block, the OTP controller, the back-up registers, and the event router) are located in the RTC power-domain. The main regulator or a battery supply can power the RTC. A power selector switch ensures that the RTC block is always powered on.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 83 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 7.22.10 Power Management Controller (PMC) The PMC controls the power to the cores, peripherals, and memories. The LPC4350/30/20/10 support the following power modes in order from highest to lowest power consumption: 1. Active mode 2. Sleep mode 3. Power-down modes: a. Deep-sleep mode b. Power-down mode c. Deep power-down mode Fig 9. Power domains REAL-TIME CLOCK BACKUP REGISTERS RESET/WAKE-UP CONTROL REGULATOR 32 kHz OSCILLATOR ALWAYS-ON/RTC POWER DOMAIN MAIN POWER DOMAIN RTCX1 VBAT VDDREG RTCX2 VDDIO VSS to memories, peripherals, oscillators, PLLs to cores to I/O pads ADC DAC OTP ADC POWER DOMAIN OTP POWER DOMAIN USB0 POWER DOMAIN VDDA VSSA VPP USB0 USB0_VDDA3V_DRIVER USB0_VDDA3V3 LPC43xx ULTRA LOW-POWER REGULATOR ALARM RESET WAKEUP0/1/2/3 to RTC domain peripherals 002aag378 to RTC I/O pads (Vps)LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 84 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Active mode and sleep mode apply to the state of the core. In a dual-core system, either core can be in active or sleep mode independently of the other core. If the core is in Active mode, it is fully operational and can access peripherals and memories as configured by software. If the core is in Sleep mode, it receives no clocks, but peripherals and memories remain running. Either core can enter sleep mode from active mode independently of the other core and while the other core remains in active mode or is in sleep mode. Power-down modes apply to the entire system. In the Power-down modes, both cores and all peripherals except for peripherals in the always-on power domain are shut down. Memories can remain powered for retaining memory contents as defined by the individual power-down mode. Either core in active mode can put the part into one of the three power down modes if the core is enabled to do so. If both cores are enabled for putting the system into power-down, then the system enters power-down only once both cores have received a WFI or WFE instruction. Wake-up from sleep mode is caused by an interrupt or event in the core’s NVIC. The interrupt is captured in the NVIC and an event is captured in the Event router. Both cores can wake up from sleep mode independently of each other. Wake-up from the Power-down modes, Deep-sleep, Power-down, and Deep power-down, is caused by an event on the WAKEUP pins or an event from the RTC or alarm timer. When waking up from Deep power-down mode, the part resets and attempts to boot. 7.23 Serial Wire Debug/JTAG Debug and trace functions are integrated into the ARM Cortex-M4. Serial wire debug and trace functions are supported in addition to a standard JTAG debug and parallel trace functions. The ARM Cortex-M4 is configured to support up to eight breakpoints and four watch points. Remark: Serial Wire Debug is supported for the ARM Cortex-M4 only, The ARM Cortex-M0 coprocessor supports JTAG debug. A standard ARM Cortex-compliant debugger can debug the ARM Cortex-M4 and the ARM Cortex-M0 cores separately or both cores simultaneously. Remark: In order to debug the ARM Cortex-M0, release the M0 reset by software in the RGU block.LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 85 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 10. Dual-core debug configuration 002aah448 TCK ARM Cortex-M0 ARM Cortex-M4 DBGEN = HIGH TMS TRST TDI TDO TDO TDO DBGEN RESET RESET = HIGH TCK TMS TRST TDI TCK TMS TRST TDI JTAG ID = 0x0BA0 1477 JTAG ID = 0x4BA0 0477 LPC43xxLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 86 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 8. Limiting values [1] The following applies to the limiting values: a) This product includes circuitry designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. [2] Including voltage on outputs in 3-state mode. [3] The peak current is limited to 25 times the corresponding maximum current. [4] Dependent on package type. [5] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD(REG)(3V3) regulator supply voltage (3.3 V) on pin VDDREG 0.5 3.6 V VDD(IO) input/output supply voltage on pin VDDIO 0.5 3.6 V VDDA(3V3) analog supply voltage (3.3 V) on pin VDDA 0.5 3.6 V VBAT battery supply voltage on pin VBAT 0.5 3.6 V Vprog(pf) polyfuse programming voltage on pin VPP 0.5 3.6 V VI input voltage only valid when VDD(IO) 2.2 V 5 V tolerant I/O pins [2] 0.5 5.5 V ADC/DAC pins and digital I/O pins configured for an analog function 0.5 VDDA(3V3) V USB0 pins USB0_DP; USB0_DM;USB0_VBUS 0.3 5.25 V USB0 pins USB0_ID; USB0_RREF 0.3 3.6 V USB1 pins USB1_DP and USB1_DM 0.3 5.25 V IDD supply current per supply pin [3] - 100 mA ISS ground current per ground pin [3] - 100 mA Ilatch I/O latch-up current (0.5VDD(IO)) < VI < (1.5VDD(IO)); Tj < 125 C - 100 mA Tstg storage temperature [4] 65 +150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption - 1.5 W VESD electrostatic discharge voltage human body model; all pins [5] 2000 +2000 VLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 87 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 9. Thermal characteristics The average chip junction temperature, Tj (C), can be calculated using the following equation: (1) • Tamb = ambient temperature (C), • Rth(j-a) = the package junction-to-ambient thermal resistance (C/W) • PD = sum of internal and I/O power dissipation The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of the I/O pins is often small and many times can be negligible. However it can be significant in some applications. Tj Tamb PD Rth j a – += Table 7. Thermal characteristics VDD = 2.2 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified; Symbol Parameter Conditions Min Typ Max Unit Tj(max) maximum junction temperature - - 125 C Table 8. Thermal resistance (LQFP packages) Symbol Parameter Conditions Thermal resistance in C/W ±15 % LQFP144 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in 4 in); still air 38 Single-layer (4.5 in 3 in); still air 50 Rth(j-c) thermal resistance from junction to case 11 Table 9. Thermal resistance value (BGA packages) Symbol Parameter Conditions Thermal resistance in C/W ±15 % LBGA256 TFBGA180 TFBGA100 Rth(j-a) thermal resistance from junction to ambient JEDEC (4.5 in 4 in); still air 29 38 46 8-layer (4.5 in 3 in); still air 24 30 37 Rth(j-c) thermal resistance from junction to case 14 11 11LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 88 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 10. Static characteristics Table 10. Static characteristics Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit Supply pins VDD(IO) input/output supply voltage 2.2 - 3.6 V VDD(REG)(3V3) regulator supply voltage (3.3 V) [2] 2.2 - 3.6 V VDDA(3V3) analog supply voltage (3.3 V) on pin VDDA 2.2 - 3.6 V on pins USB0_VDDA3V3_ DRIVER and USB0_VDDA3V3 3.0 3.3 3.6 V VBAT battery supply voltage [2] 2.2 - 3.6 V Vprog(pf) polyfuse programming voltage on pin VPP (for OTP) [3] 2.7 - 3.6 V Iprog(pf) polyfuse programming current on pin VPP; OTP programming time 1.6 ms - - 30 mA IDD(REG)(3V3) regulator supply current (3.3 V) Active mode; M0-core in reset; code while(1){} executed from RAM; all peripherals disabled; PLL1 enabled CCLK = 12 MHz [4] - 6.6- mA CCLK = 60 MHz [4] 25.3 - mA CCLK = 120 MHz [4] - 48.4- mA CCLK = 180 MHz [4] - 72.0- mA CCLK = 204 MHz [4] - 81.5- mA IDD(REG)(3V3) regulator supply current (3.3 V) after WFE/WFI instruction executed from RAM; all peripherals disabled; M0 core in reset sleep mode [4][5] - 5.0- mA deep-sleep mode [4] - 30 - A power-down mode [4] - 15 - A deep power-down mode [4][6] - 0.03 - A deep power-down mode; VBAT floating [4]-- 2 - A IBAT battery supply current active mode; VBAT = 3.2 V; VDD(REG)(3V3) = 3.6 V. [7] - 0 -nALPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 89 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller IBAT battery supply current VDD(REG)(3V3) = 3.3 V; VBAT = 3.6 V deep-sleep mode [8] - 2- A power-down mode [8] - 2- A deep power-down mode [8] - 2- A IDD(IO) I/O supply current deep sleep mode - - 1 - A power-down mode - - 1 - A deep power-down mode [9] - 0.05 - A IDDA Analog supply current on pin VDDA; deep sleep mode [11] - 0.4 - A power-down mode [11] - 0.4 - A deep power-down mode [11] - 0.007 - A RESET,RTC_ALARM, WAKEUPn pins VIH HIGH-level input voltage [10] 0.8 (Vps 0.35) - 5.5 V VIL LOW-level input voltage [10] 0 - 0.3 (Vps 0.1) V Vhys hysteresis voltage [10] 0.05 (Vps 0.35) --V Vo output voltage [10] - Vps - 0.2 - V Standard I/O pins - normal drive strength CI input capacitance - - 2 pF ILL LOW-level leakage current VI = 0 V; on-chip pull-up resistor disabled - 3 - nA ILH HIGH-level leakage current VI = VDD(IO); on-chip pull-down resistor disabled - 3 - nA VI = 5 V --20 nA IOZ OFF-state output current VO = 0 V to VDD(IO); on-chip pull-up/down resistors disabled; absolute value - 3- nA VI input voltage pin configured to provide a digital function; VDD(IO) 2.2 V 0 - 5.5 V VDD(IO) = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD(IO) V VIH HIGH-level input voltage 0.7 VDD(IO) - 5.5 V VIL LOW-level input voltage 0 - 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) --V Table 10. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 90 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller VOH HIGH-level output voltage IOH = 6 mA VDD(IO) 0.4 --V VOL LOW-level output voltage IOL = 6 mA --0.4 V IOH HIGH-level output current VOH = VDD(IO) 0.4 V 6 - - mA IOL LOW-level output current VOL = 0.4 V 6- - mA IOHS HIGH-level short-circuit output current drive HIGH; connected to ground [12] --86.5 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [12] --76.5 mA Ipd pull-down current VI = 5 V [14][15] [16] - 93 - A Ipu pull-up current VI =0V [14][15] [16] - 62 - A VDD(IO) < VI 5 V - 10 - A Rs series resistance on I/O pins with analog function; analog function enabled 200 I/O pins - high drive strength CI input capacitance - - 5.2 pF ILL LOW-level leakage current VI = 0 V; on-chip pull-up resistor disabled - 3 - nA ILH HIGH-level leakage current VI = VDD(IO); on-chip pull-down resistor disabled - 3 - nA VI = 5 V --20 nA IOZ OFF-state output current VO = 0 V to VDD(IO); on-chip pull-up/down resistors disabled; absolute value - 3 - nA VI input voltage pin configured to provide a digital function; VDD(IO) 2.2 V 0 - 5.5 V VDD(IO) = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD(IO) V VIH HIGH-level input voltage 0.7 VDD(IO) - 5.5 V VIL LOW-level input voltage 0 - 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) --V Ipd pull-down current VI = VDD(IO) [14][15] [16] - 62 - A Table 10. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 91 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Ipu pull-up current VI =0V [14][15] [16] - 62 - A VDD(IO) < VI 5 V - 10 - A I/O pins - high drive strength: standard drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 4 - - mA IOL LOW-level output current VOL = 0.4 V 4- - mA IOHS HIGH-level short-circuit output current drive HIGH; connected to ground [12] --32 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [12] --32 mA I/O pins - high drive strength: medium drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 8 - - mA IOL LOW-level output current VOL = 0.4 V 8- - mA IOHS HIGH-level short-circuit output current drive HIGH; connected to ground [12] --65 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [12] --63 mA I/O pins - high drive strength: high drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 14 - - mA IOL LOW-level output current VOL = 0.4 V 14- - mA IOHS HIGH-level short-circuit output current drive HIGH; connected to ground [12] --113 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [12] --110 mA I/O pins - high drive strength: ultra-high drive mode IOH HIGH-level output current VOH = VDD(IO) 0.4 V 20 - - mA IOL LOW-level output current VOL = 0.4 V 20- - mA IOHS HIGH-level short-circuit output current drive HIGH; connected to ground [12] --165 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [12] --156 mA I/O pins - high-speed CI input capacitance - - 2 pF ILL LOW-level leakage current VI = 0 V; on-chip pull-up resistor disabled - 3 - nA Table 10. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 92 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller ILH HIGH-level leakage current VI = VDD(IO); on-chip pull-down resistor disabled - 3 - nA VI = 5 V --20 nA IOZ OFF-state output current VO = 0 V to VDD(IO); on-chip pull-up/down resistors disabled; absolute value - 3 - nA VI input voltage pin configured to provide a digital function; VDD(IO) 2.2 V 0 - 5.5 V VDD(IO) = 0 V 0 - 3.6 V VO output voltage output active 0 - VDD(IO) V VIH HIGH-level input voltage 0.7 VDD(IO) - 5.5 V VIL LOW-level input voltage 0 - 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) --V VOH HIGH-level output voltage IOH = 8 mA VDD(IO) 0.4 --V VOL LOW-level output voltage IOL = 8 mA --0.4 V IOH HIGH-level output current VOH = VDD(IO) 0.4 V 8 - - mA IOL LOW-level output current VOL = 0.4 V 8- - mA IOHS HIGH-level short-circuit output current drive HIGH; connected to ground [12] --86 mA IOLS LOW-level short-circuit output current drive LOW; connected to VDD(IO) [12] --76 mA Ipd pull-down current VI = VDD(IO) [14][15] [16] - 62 - A Ipu pull-up current VI =0V [14][15] [16] - 62 - A VDD(IO) < VI 5V - 0 - A Open-drain I2C0-bus pins VIH HIGH-level input voltage 0.7 VDD(IO) --V VIL LOW-level input voltage 0 0.14 0.3 VDD(IO) V Vhys hysteresis voltage 0.1 VDD(IO) --V VOL LOW-level output voltage IOLS = 3 mA --0.4 V Table 10. Static characteristics …continued Tamb = 40 C to +85 C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max UnitLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 93 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller [1] Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages. [2] Dynamic characteristics for peripherals are provided for VDD(REG)(3V) 2.7 V. ILI input leakage current VI = VDD(IO) [13] - 4.5 - A VI = 5 V --10 A Oscillator pins Vi(XTAL1) input voltage on pin XTAL1 0.5 - 1.2 V Vo(XTAL2) output voltage on pin XTAL2 0.5 - 1.2 V Cio input/output capacitance [17] --0.8 pF USB0 pins[18] VI input voltage on pins USB0_DP; USB0_DM; USB0_VBUS VDD(IO) 2.2 V 0 - 5.25 V VDD(IO) = 0 V 0 - 3.6 V Rpd pull-down resistance on pin USB0_VBUS 48 64 80 k VIC common-mode input voltage high-speed mode 50 200 500 mV full-speed/low-speed mode 800 - 2500 mV chirp mode 50 - 600 mV Vi(dif) differential input voltage 100 400 1100 mV USB1 pins (USB1_DP/USB1_DM)[18] IOZ OFF-state output current 0V 0 EMC_DYCSn, EMC_RAS, EMC_CAS, EMC_WE, EMC_CKEOUTn, EMC_A[22:0], EMC_DQMOUTn th(Q) th(Q) - td th(D) tsu(D) th(D) tsu(D) EMC_D[31:0] write EMC_D[31:0] read; delay = 0 EMC_D[31:0] read; delay > 0 th(x) - td td(xV) - td td(QV) - td td(QV) th(x) td(xV) EMC_CLKn delay td; programmable CLKn_DELAYLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 123 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 11.15 USB interface [1] Characterized but not implemented as production test. Guaranteed by design. Table 28. Dynamic characteristics: USB0 and USB1 pins (full-speed) CL = 50 pF; Rpu = 1.5 k on D+ to VDD(IO); 3.0 V VDD(IO) 3.6 V. Symbol Parameter Conditions Min Typ Max Unit tr rise time 10 % to 90 % 8.5 - 13.8 ns tf fall time 10 % to 90 % 7.7 - 13.7 ns tFRFM differential rise and fall time matching tr / tf - -109 % VCRS output signal crossover voltage 1.3 - 2.0 V tFEOPT source SE0 interval of EOP see Figure 36 160 - 175 ns tFDEOP source jitter for differential transition to SE0 transition see Figure 36 2 - +5 ns tJR1 receiver jitter to next transition 18.5 - +18.5 ns tJR2 receiver jitter for paired transitions 10 % to 90 % 9 - +9 ns tEOPR1 EOP width at receiver must reject as EOP; see Figure 36 [1] 40 - - ns tEOPR2 EOP width at receiver must accept as EOP; see Figure 36 [1] 82 - - ns Fig 36. Differential data-to-EOP transition skew and EOP width 002aab561 TPERIOD differential data lines crossover point source EOP width: tFEOPT receiver EOP width: tEOPR1, tEOPR2 crossover point extended differential data to SE0/EOP skew n × TPERIOD + tFDEOPLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 124 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller [1] Characterized but not implemented as production test. [2] Total average power consumption. [3] The driver is active only 20 % of the time. 11.16 Ethernet Remark: The timing characteristics of the ENET_MDC and ENET_MDIO signals comply with the IEEE standard 802.3. Table 29. Static characteristics: USB0 PHY pins[1] Symbol Parameter Conditions Min Typ Max Unit High-speed mode Pcons power consumption [2] - 68 - mW IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER; total supply current [3] - 18 - mA during transmit - 31 - mA during receive - 14 - mA with driver tri-stated - 14 - mA IDDD digital supply current - 7 - mA Full-speed/low-speed mode Pcons power consumption [2] - 15 - mW IDDA(3V3) analog supply current (3.3 V) on pin USB0_VDDA3V3_DRIVER; total supply current - 3.5 - mA during transmit - 5 - mA during receive - 3 - mA with driver tri-stated - 3 - mA IDDD digital supply current - 3 - mA Suspend mode IDDA(3V3) analog supply current (3.3 V) - 24 - A with driver tri-stated - 24 - A with OTG functionality enabled - 3 - mA IDDD digital supply current - 30 - A VBUS detector outputs Vth threshold voltage for VBUS valid 4.4 - - V for session end 0.2 - 0.8 V for A valid 0.8 - 2 V for B valid 2 - 4 V Vhys hysteresis voltage for session end - 150 10 mV A valid - 200 10 mV B valid - 200 10 mVLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 125 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller [1] Output drivers can drive a load 25 pF accommodating over 12 inch of PCB trace and the input capacitance of the receiving device. [2] Timing values are given from the point at which the clock signal waveform crosses 1.4 V to the valid input or output level. Table 30. Dynamic characteristics: Ethernet Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. Values guaranteed by design. Symbol Parameter Conditions Min Max Unit RMII mode fclk clock frequency for ENET_RX_CLK [1] - 50 MHz clk clock duty cycle [1] 50 50 % tsu set-up time for ENET_TXDn, ENET_TX_EN, ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 4 - ns th hold time for ENET_TXDn, ENET_TX_EN, ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 2 - ns MII mode fclk clock frequency for ENET_TX_CLK [1] - 25 MHz clk clock duty cycle [1] 50 50 % tsu set-up time for ENET_TXDn, ENET_TX_EN, ENET_TX_ER [1][2] 4 - ns th hold time for ENET_TXDn, ENET_TX_EN, ENET_TX_ER [1][2] 2 - ns fclk clock frequency for ENET_RX_CLK [1] - 25 MHz clk clock duty cycle [1] 50 50 % tsu set-up time for ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 4 - ns th hold time for ENET_RXDn, ENET_RX_ER, ENET_RX_DV [1][2] 2 - ns Fig 37. Ethernet timing 002aag210 th tsu ENET_RX_CLK ENET_TX_CLK ENET_RXD[n] ENET_RX_DV ENET_RX_ER ENET_TXD[n] ENET_TX_EN ENET_TX_ERLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 126 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 11.17 SD/MMC 11.18 LCD Table 31. Dynamic characteristics: SD/MMC Tamb = 40 C to 85 C, 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V, CL = 20 pF. Simulated values. SAMPLE_DELAY = 0x8, DRV_DELAY = 0xF in the SDDELAY register (see the LPC43xx user manual UM10430). Symbol Parameter Conditions Min Max Unit fclk clock frequency on pin SD_CLK; data transfer mode 52 MHz tr rise time 0.5 2 ns tf fall time 0.5 2 ns tsu(D) data input set-up time on pins SD_DATn as inputs 6 - ns on pins SD_CMD as inputs 7 - ns th(D) data input hold time on pins SD_DATn as inputs -1 - ns on pins SD_CMD as inputs 1 ns td(QV) data output valid delay time on pins SD_DATn as outputs - 17 ns on pins SD_CMD as outputs - 18 ns th(Q) data output hold time on pins SD_DATn as outputs 4 - ns on pins SD_CMD as outputs 4 - ns Fig 38. SD/MMC timing 002aag204 SD_CLK SD_DATn (O) SD_DATn (I) td(QV) th(D) tsu(D) Tcy(clk) th(Q) SD_CMD (O) SD_CMD (I) Table 32. Dynamic characteristics: LCD Tamb = 40 C to +85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V; CL = 20 pF. Simulated values. Symbol Parameter Conditions Min Typ Max Unit fclk clock frequency on pin LCD_DCLK - 50 - MHz td(QV) data output valid delay time - 17 ns th(Q) data output hold time 8.5 - nsLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 127 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 11.19 SPIFI Table 33. Dynamic characteristics: SPIFI Tamb = 40 C to 85 C; 2.2 V VDD(REG)(3V3) 3.6 V; 2.7 V VDD(IO) 3.6 V. CL = 10 pF. Simulated values. Symbol Parameter Min Max Unit Tcy(clk) clock cycle time 9.6 - ns tDS data set-up time 3.4 - ns tDH data hold time 0 - ns tv(Q) data output valid time - 3.2 ns th(Q) data output hold time 0.2 - ns Fig 39. SPIFI timing (Mode 0) SPIFI_SCK SPIFI data out SPIFI data in Tcy(clk) tDS tDH tv(Q) DATA VALID DATA VALID th(Q) DATA VALID DATA VALID 002aah409LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 128 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 12. ADC/DAC electrical characteristics [1] The ADC is monotonic, there are no missing codes. [2] The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 40. [3] The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 40. [4] The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 40. [5] The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 40. [6] The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated ADC and the ideal transfer curve. See Figure 40. [7] Tamb = 25 C. [8] Input resistance Ri depends on the sampling frequency fs: Ri = 2 k + 1 / (fs Cia). Table 34. ADC characteristics VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VIA analog input voltage 0 - VDDA(3V3) V Cia analog input capacitance - - 2 pF ED differential linearity error 2.7 V VDDA(3V3) 3.6 V [1][2] - 0.8 - LSB 2.2 V VDDA(3V3) < 2.7 V - 1.0 - LSB EL(adj) integral non-linearity 2.7 V VDDA(3V3) 3.6 V [3] - 0.8 - LSB 2.2 V VDDA(3V3) < 2.7 V - 1.5 - LSB EO offset error 2.7 V VDDA(3V3) 3.6 V [4] - 0.15 - LSB 2.2 V VDDA(3V3) < 2.7 V - 0.15 - LSB EG gain error 2.7 V VDDA(3V3) 3.6 V [5] - 0.3 - % 2.2 V VDDA(3V3) < 2.7 V - 0.35 - % ET absolute error 2.7 V VDDA(3V3) 3.6 V [6] - 3 - LSB 2.2 V VDDA(3V3) < 2.7 V - 4 - LSB Rvsi voltage source interface resistance see Figure 41 - - 1/(7 fclk(ADC) Cia) k Ri input resistance [7][8] - - 1.2 M fclk(ADC) ADC clock frequency - - 4.5 MHz fs sampling frequency 10-bit resolution; 11 clock cycles - - 400 kSamples/s 2-bit resolution; 3 clock cycles 1.5 MSamples/sLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 129 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller (1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential linearity error (ED). (4) Integral non-linearity (EL(adj)). (5) Center of a step of the actual transfer curve. Fig 40. 10-bit ADC characteristics 002aaf959 1023 1022 1021 1020 1019 (2) (1) 123456 7 1018 1019 1020 1021 1022 1023 1024 7 6 5 4 3 2 1 0 1018 (5) (4) (3) 1 LSB (ideal) code out VDDA(3V3) − VSSA 1024 offset error EO gain error EG offset error EO VIA (LSBideal) 1 LSB =LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 130 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller [1] In the DAC CR register, bit BIAS = 0 (see the LPC43xx user manual). [2] Settling time is calculated within 1/2 LSB of the final value. Rs 1/((7 fclk(ADC) Cia) 2 k Fig 41. ADC interface to pins LPC43xx ADC0_n/ADC1_n Cia = 2 pF Rvsi Rs VSS VEXT 002aag704 ADC COMPARATOR 2 kΩ (analog pin) 2.2 kΩ (multiplexed pin) Table 35. DAC characteristics VDDA(3V3) over specified ranges; Tamb = 40 C to +85 C; unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit ED differential linearity error 2.7 V VDDA(3V3) 3.6 V [1] - 0.8 - LSB 2.2 V VDDA(3V3) < 2.7 V - 1.0 - LSB EL(adj) integral non-linearity code = 0 to 975 2.7 V VDDA(3V3) 3.6 V [1] - 1.0 - LSB 2.2 V VDDA(3V3) < 2.7 V - 1.5 - LSB EO offset error 2.7 V VDDA(3V3) 3.6 V [1] - 0.8 - LSB 2.2 V VDDA(3V3) < 2.7 V - 1.0 - LSB EG gain error 2.7 V VDDA(3V3) 3.6 V [1] - 0.3 - % 2.2 V VDDA(3V3) < 2.7 V - 1.0 - % CL load capacitance - - 200 pF RL load resistance 1 - - k ts settling time [2] 0.4 LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 131 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 13. Application information 13.1 LCD panel signal usage Table 36. LCD panel connections for STN single panel mode External pin 4-bit mono STN single panel 8-bit mono STN single panel Color STN single panel LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function LCD_VD[23:8] - - - - - - LCD_VD7 - - P8_4 UD[7] P8_4 UD[7] LCD_VD6 - - P8_5 UD[6] P8_5 UD[6] LCD_VD5 - - P8_6 UD[5] P8_6 UD[5] LCD_VD4 - - P8_7 UD[4] P8_7 UD[4] LCD_VD3 P4_2 UD[3] P4_2 UD[3] P4_2 UD[3] LCD_VD2 P4_3 UD[2] P4_3 UD[2] P4_3 UD[2] LCD_VD1 P4_4 UD[1] P4_4 UD[1] P4_4 UD[1] LCD_VD0 P4_1 UD[0] P4_1 UD[0] P4_1 UD[0] LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP LCD_ENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE LCD_PWR P7_7 CDPWR P7_7 LCDPWR P7_7 LCDPWR GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN Table 37. LCD panel connections for STN dual panel mode External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function LCD_VD[23:16] - - - - - - LCD_VD15 - - PB_4 LD[7] PB_4 LD[7] LCD_VD14 - - PB_5 LD[6] PB_5 LD[6] LCD_VD13 - - PB_6 LD[5] PB_6 LD[5] LCD_VD12 - - P8_3 LD[4] P8_3 LD[4] LCD_VD11 P4_9 LD[3] P4_9 LD[3] P4_9 LD[3] LCD_VD10 P4_10 LD[2] P4_10 LD[2] P4_10 LD[2] LCD_VD9 P4_8 LD[1] P4_8 LD[1] P4_8 LD[1] LCD_VD8 P7_5 LD[0] P7_5 LD[0] P7_5 LD[0] LCD_VD7 - - UD[7] P8_4 UD[7] LCD_VD6 - - P8_5 UD[6] P8_5 UD[6] LCD_VD5 - - P8_6 UD[5] P8_6 UD[5] LCD_VD4 - - P8_7 UD[4] P8_7 UD[4] LCD_VD3 P4_2 UD[3] P4_2 UD[3] P4_2 UD[3]LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 132 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller LCD_VD2 P4_3 UD[2] P4_3 UD[2] P4_3 UD[2] LCD_VD1 P4_4 UD[1] P4_4 UD[1] P4_4 UD[1] LCD_VD0 P4_1 UD[0] P4_1 UD[0] P4_1 UD[0] LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP LCD_ENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE LCD_PWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN Table 37. LCD panel connections for STN dual panel mode …continued External pin 4-bit mono STN dual panel 8-bit mono STN dual panel Color STN dual panel LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function Table 38. LCD panel connections for TFT panels External pin TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function LCD_VD23 PB_0 BLUE3 PB_0 BLUE4 PB_0 BLUE4 PB_0 BLUE7 LCD_VD22 PB_1 BLUE2 PB_1 BLUE3 PB_1 BLUE3 PB_1 BLUE6 LCD_VD21 PB_2 BLUE1 PB_2 BLUE2 PB_2 BLUE2 PB_2 BLUE5 LCD_VD20 PB_3 BLUE0 PB_3 BLUE1 PB_3 BLUE1 PB_3 BLUE4 LCD_VD19 - - P7_1 BLUE0 P7_1 BLUE0 P7_1 BLUE3 LCD_VD18 - - - - P7_2 intensity P7_2 BLUE2 LCD_VD17 - - - - - - P7_3 BLUE1 LCD_VD16 - - - - - - P7_4 BLUE0 LCD_VD15 PB_4 GREEN3 PB_4 GREEN5 PB_4 GREEN4 PB_4 GREEN7 LCD_VD14 PB_5 GREEN2 PB_5 GREEN4 PB_5 GREEN3 PB_5 GREEN6 LCD_VD13 PB_6 GREEN1 PB_6 GREEN3 PB_6 GREEN2 PB_6 GREEN5 LCD_VD12 P8_3 GREEN0 P8_3 GREEN2 P8_3 GREEN1 P8_3 GREEN4 LCD_VD11 - - P4_9 GREEN1 P4_9 GREEN0 P4_9 GREEN3 LCD_VD10 - - P4_10 GREEN0 P4_10 intensity P4_10 GREEN2 LCD_VD9 - - - - - - P4_8 GREEN1 LCD_VD8 - - - - - - P7_5 GREEN0 LCD_VD7 P8_4 RED3 P8_4 RED4 P8_4 RED4 P8_4 RED7 LCD_VD6 P8_5 RED2 P8_5 RED3 P8_5 RED3 P8_5 RED6 LCD_VD5 P8_6 RED1 P8_6 RED2 P8_6 RED2 P8_6 RED5 LCD_VD4 P8_7 RED0 P8_7 RED1 P8_7 RED1 P8_7 RED4 LCD_VD3 - - P4_2 RED0 P4_2 RED0 P4_2 RED3 LCD_VD2 - - - - P4_3 intensity P4_3 RED2 LCD_VD1 - - - - - - P4_4 RED1LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 133 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 13.2 Crystal oscillator The crystal oscillator is controlled by the XTAL_OSC_CTRL register in the CGU (see LPC43xx user manual). The crystal oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be boosted to a higher frequency, up to the maximum CPU operating frequency, by the PLL. The oscillator can operate in one of two modes: slave mode and oscillation mode. • In slave mode, couple the input clock signal with a capacitor of 100 pF (CC in Figure 42), with an amplitude of at least 200 mV (RMS). The XTAL2 pin in this configuration can be left unconnected. • External components and models used in oscillation mode are shown in Figure 43, and in Table 39 and Table 40. Since the feedback resistance is integrated on chip, only a crystal and the capacitances CX1 and CX2 need to be connected externally in case of fundamental mode oscillation L, CL and RS represent the fundamental frequency). The capacitance CP in Figure 43 represents the parallel package capacitance and must not be larger than 7 pF. Parameters FC, CL, RS and CP are supplied by the crystal manufacturer. LCD_VD0 - - - - - - P4_1 RED0 LCD_LP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP P7_6 LCDLP LCD_ENAB /LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM P4_6 LCDENAB/ LCDM LCD_FP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP P4_5 LCDFP LCD_DCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK P4_7 LCDDCLK LCD_LE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE P7_0 LCDLE LCD_PWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR P7_7 LCDPWR GP_CLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN PF_4 LCDCLKIN Table 38. LCD panel connections for TFT panels …continued External pin TFT 12 bit (4:4:4 mode) TFT 16 bit (5:6:5 mode) TFT 16 bit (1:5:5:5 mode) TFT 24 bit LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function LPC43xx pin used LCD function Table 39. Recommended values for CX1/X2 in oscillation mode (crystal and external components parameters) low frequency mode Fundamental oscillation frequency Maximum crystal series resistance RS External load capacitors CX1, CX2 2 MHz < 200 33 pF, 33 pF < 200 39 pF, 39 pF < 200 56 pF, 56 pF 4 MHz < 200 18 pF, 18 pF < 200 39 pF, 39 pF < 200 56 pF, 56 pF 8 MHz < 200 18 pF, 18 pF < 200 39 pF, 39 pFLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 134 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 12 MHz < 160 18 pF, 18 pF < 160 39 pF, 39 pF 16 MHz < 120 18 pF, 18 pF < 80 33 pF, 33 pF 20 MHz <100 18 pF, 18 pF < 80 33 pF, 33 pF Table 40. Recommended values for CX1/X2 in oscillation mode (crystal and external components parameters) high frequency mode Fundamental oscillation frequency Maximum crystal series resistance RS External load capacitors CX1, Cx2 15 MHz < 80 18 pF, 18 pF 20 MHz < 80 39 pF, 39 pF < 100 47 pF, 47 pF Fig 42. Slave mode operation of the on-chip oscillator Fig 43. Oscillator modes with external crystal model used for CX1/CX2 evaluation Table 39. Recommended values for CX1/X2 in oscillation mode (crystal and external components parameters) low frequency mode …continued Fundamental oscillation frequency Maximum crystal series resistance RS External load capacitors CX1, CX2 LPC43xx XTAL1 Ci 100 pF Cg 002aag379 002aag380 LPC43xx XTAL1 XTAL2 CX1 CX2 XTAL = CL CP RS LLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 135 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 13.3 RTC oscillator In the RTC oscillator circuit, only the crystal (XTAL) and the capacitances CRTCX1 and CRTCX2 need to be connected externally. Typical capacitance values for CRTCX1 and CRTCX2 are CRTCX1/2 = 20 (typical) 4 pF. An external clock can be connected to RTCX1 if RTCX2 is left open. The recommended amplitude of the clock signal is Vi(RMS) = 100 mV to 200 mV with a coupling capacitance of 5 pF to 10 pF. Vi(RMS) must be lower than 450 mV. See Figure 42 for a similar slave-mode set-up that uses the crystal oscillator. 13.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines Connect the crystal on the PCB as close as possible to the oscillator input and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of third overtone crystal usage have a common ground plane. Also connect the external components to the ground plain. To keep the noise coupled in via the PCB as small as possible, make loops and parasitics as small as possible. Choose smaller values of Cx1 and Cx2 if parasitics increase in the PCB layout. Ensure that no high-speed or high-drive signals are near the RTCX1/2 signals. 13.5 Standard I/O pin configuration Figure 45 shows the possible pin modes for standard I/O pins with analog input function: • Digital output driver enabled/disabled • Digital input: Pull-up enabled/disabled • Digital input: Pull-down enabled/disabled • Digital input: Repeater mode enabled/disabled • Digital input: Input buffer enabled/disabled • Analog input The default configuration for standard I/O pins is input buffer disabled and pull-up enabled. The weak MOS devices provide a drive capability equivalent to pull-up and pull-down resistors. Fig 44. RTC 32 kHz oscillator circuit 002aah148 LPC43xx RTCX1 RTCX2 CRTCX1 CRTCX2 XTALLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 136 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 13.6 Reset pin configuration 13.7 Suggested USB interface solutions The USB device can be connected to the USB as self-powered device (see Figure 47) or bus-powered device (see Figure 48). The glitch filter rejects pulses of typical 12 ns width. Fig 45. Standard I/O pin configuration with analog input slew rate bit EHS pull-up enable bit EPUN pull-down enable bit EPD glitch filter analog I/O ESD ESD PIN VDDIO VSSIO input buffer enable bit EZI filter select bit ZIF data input to core data output from core enable output driver 002aah028 Fig 46. Reset pin configuration VSS reset 002aag702 Vps Vps Vps Rpu ESD ESD 20 ns RC GLITCH FILTER PINLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 137 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller On the LPC4350/30/20/10, USBn_VBUS pins are 5 V tolerant only when VDDIO is applied and at operating voltage level. Therefore, if the USBn_VBUS function is connected to the USB connector and the device is self-powered, the USBn_VBUS pins must be protected for situations when VDDIO = 0 V. If VDDIO is always at operating level while VBUS = 5 V, the USBn_VBUS pin can be connected directly to the VBUS pin on the USB connector. For systems where VDDIO can be 0 V and VBUS is directly applied to the USBn_VBUS pins, precautions must be taken to reduce the voltage to below 3.6 V, which is the maximum allowable voltage on the USBn_VBUS pins in this case. One method is to use a voltage divider to connect the USBn_VBUS pins to VBUS on the USB connector. The voltage divider ratio should be such that the USB_VBUS pin will be greater than 0.7VDDIO to indicate a logic HIGH while below the 3.6 V allowable maximum voltage. For the following operating conditions VBUSmax = 5.25 V VDDIO = 3.6 V, the voltage divider should provide a reduction of 3.6 V/5.25 V or ~0.686 V. For bus-powered devices, a regulator powered by USB can provide 3.3 V to VDDIO whenever bus power is present and ensure that power to the USBn_VBUS pins is always present when the 5 V VBUS signal is applied. See Figure 48. Remark: Applying 5 V to the USBn_VBUS pins for a short time while the regulator ramps up might compromise the long-term reliability of the part but does not affect its function. Fig 47. USB interface on a self-powered device where USBn_VBUS = 5 V LPC43xx VDDIO USB-B connector USBn_VBUS VBUS USB R2 R3 aaa-013458LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 138 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Remark: If the VBUS function of the USB1 interface is not connected, configure the pin function for GPIO using the function control bits in the SYSCON block. Remark: In OTG mode, it is important to be able to detect the VBUS level and to charge and discharge VBUS. This requires adding active devices that disconnect the link when VDDIO is not present. Fig 48. USB interface on a bus-powered device Fig 49. USB interface for USB operating in OTG mode REGULATOR USBn_VBUS VBUS LPC43xx VDDIO USB-B connector USB aaa-013459 USBn_VBUS VBUS LPC43xx VDDIO USB-B connector USB aaa-013460 R1 R2 R3 T2 T1LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 139 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 14. Package outline Fig 50. Package outline LBGA256 package OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC MO-192 JEITA SOT740-2 - - - - - - SOT740-2 05-06-16 05-08-04 UNIT A max mm 1.55 0.45 0.35 1.1 0.9 0.55 0.45 17.2 16.8 17.2 16.8 A1 DIMENSIONS (mm are the original dimensions) LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm X A2 b D E e 1 e1 15 e2 15 v 0.25 w 0.1 y 0.12 y1 0.35 1/2 e 1/2 e A A2 A1 detail X D E B A ball A1 index area y1 C y C A B A B C D E F H K G J L M N P R T 2 4 6 8 10 12 14 16 1 3 5 7 9 11 13 15 ball A1 index area e e e1 b e2 C C ∅ v M ∅ w M 0 5 10 mm scaleLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 140 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 51. Package outline of the TFBGA180 package OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT570-3 SOT570-3 08-07-09 10-04-15 UNIT mm max nom min 1.20 1.06 0.95 0.40 0.35 0.30 0.50 0.45 0.40 12.1 12.0 11.9 12.1 12.0 11.9 0.8 10.4 0.15 0.12 A DIMENSIONS (mm are the original dimensions) TFBGA180: thin fine-pitch ball grid array package; 180 balls 0 5 10 mm scale A1 A2 0.80 0.71 0.65 b D E e e1 10.4 e2 v w 0.05 y y1 0.1 ball A1 index area D B A E C y1 C y X A B C D E F H K G L J M N P 2 4 6 8 10 12 14 1 3 5 7 9 11 13 b e2 e1 e e 1/2 e 1/2 e ∅ v M AC B ∅ w M C ball A1 index area detail X A A2 A1LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 141 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 52. Package outline of the TFBGA100 package OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT926-1 - - - - - - - - - SOT926-1 05-12-09 05-12-22 UNIT A max mm 1.2 0.4 0.3 0.8 0.65 0.5 0.4 9.1 8.9 9.1 8.9 A1 DIMENSIONS (mm are the original dimensions) TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm A2 b D E e2 7.2 e 0.8 e1 7.2 v 0.15 w 0.05 y 0.08 y1 0.1 0 2.5 5 mm scale b e2 e1 e e 1/2 e 1/2 e ∅ v M AC B ∅ w M C ball A1 index area A B C D E F H K G J 13579 2 4 6 8 10 ball A1 index area B A E D C y1 C y X detail X A A1 A2LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 142 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 53. Package outline for the LQFP144 package UNIT A1 A2 A3 bp c E(1) e HE L Lp ywv Z θ OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 0.5 22.15 21.85 1.4 1.1 7 0 o 1 0.080.2 0.08 o DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 SOT486-1 136E23 MS-026 00-03-14 03-02-20 D(1) (1)(1) 20.1 19.9 HD 22.15 21.85 Z E 1.4 1.1 D 0 5 10 mm scale e bp θ E A1 A Lp detail X L (A ) 3 B c bp EH A2 DH v M B D ZD A ZE e v M A X y w M w M A max. 1.6 LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm SOT486-1 108 109 pin 1 index 73 72 37 1 144 36LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 143 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 15. Soldering Fig 54. Reflow soldering of the LBGA256 package DIMENSIONS in mm P SL SP SR Hx Hy Hx Hy SOT740-2 solder land plus solder paste occupied area Footprint information for reflow soldering of LBGA256 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot740-2_fr 1.00 0.450 0.450 0.600 17.500 17.500LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 144 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 55. Reflow soldering of the TFBGA180 package DIMENSIONS in mm P SL SP SR Hx Hy Hx Hy SOT570-3 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA180 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot570-3_fr 0.80 0.400 0.400 0.550 12.575 12.575LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 145 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 56. Reflow soldering of the LQFP144 package SOT486-1 DIMENSIONS in mm occupied area Footprint information for reflow soldering of LQFP144 package Ax Bx Gx Hy Gy Hx AyBy P2 P1 D2 (8×) D1 (0.125) P1 P2 Ax Ay Bx By C D1 D2 Gx Gy Hx Hy sot486-1_fr solder land C Generic footprint pattern Refer to the package outline drawing for actual layout 0.500 0.560 0.280 23.300 23.300 20.300 20.300 1.500 0.400 20.500 20.500 23.550 23.550LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 146 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Fig 57. Reflow soldering of the TFBGA100 package DIMENSIONS in mm P SL SP SR Hx Hy Hx Hy SOT926-1 solder land plus solder paste occupied area Footprint information for reflow soldering of TFBGA100 package solder land solder paste deposit solder resist P P SL SP SR Generic footprint pattern Refer to the package outline drawing for actual layout detail X see detail X sot926-1_fr 0.80 0.330 0.400 0.480 9.400 9.400LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 147 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 16. Abbreviations Table 41. Abbreviations Acronym Description ADC Analog-to-Digital Converter AHB Advanced High-performance Bus APB Advanced Peripheral Bus API Application Programming Interface BOD BrownOut Detection CAN Controller Area Network CMAC Cipher-based Message Authentication Code CSMA/CD Carrier Sense Multiple Access with Collision Detection DAC Digital-to-Analog Converter DC-DC Direct Current-to-Direct Current DMA Direct Memory Access GPIO General-Purpose Input/Output IRC Internal RC IrDA Infrared Data Association JTAG Joint Test Action Group LCD Liquid Crystal Display LSB Least Significant Bit MAC Media Access Control MCU MicroController Unit MIIM Media Independent Interface Management n.c. not connected OHCI Open Host Controller Interface OTG On-The-Go PHY Physical Layer PLL Phase-Locked Loop PMC Power Mode Control PWM Pulse Width Modulator RIT Repetitive Interrupt Timer RMII Reduced Media Independent Interface SDRAM Synchronous Dynamic Random Access Memory SIMD Single Instruction Multiple Data SPI Serial Peripheral Interface SSI Serial Synchronous Interface SSP Synchronous Serial Port UART Universal Asynchronous Receiver/Transmitter ULPI UTMI+ Low Pin Interface USART Universal Synchronous Asynchronous Receiver/Transmitter USB Universal Serial Bus UTMI USB2.0 Transceiver Macrocell InterfaceLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 148 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 17. References [1] LPC43xx User manual UM10503: http://www.nxp.com/documents/user_manual/UM10503.pdf [2] LPC43X0 Errata sheet: http://www.nxp.com/documents/errata_sheet/ES_LPC43XX.pdfLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 149 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 18. Revision history Table 42. Revision history Document ID Release date Data sheet status Change notice Supersedes LPC4350_30_20_10 v.4.2 20140818 Product data sheet LPC4350_30_20_10 v.4.1 Modifications: • Parameter CI corrected for high-drive pins (changed from 2 pF to 5.2 pF). See Table 10. • Table 18 “Dynamic characteristic: I/O pins[1]” added. • IRC accuracy changed from 1 % to 1.5 % over the full temperature range. See Table 16 “Dynamic characteristic: IRC oscillator”. • Description of internal pull-up resistor configuration added for RESET, WAKEUPn, and ALARM pins.See Table 3. • Description of DEBUG pin updated. • Input range for PLL1 corrected: 1 MHz to 25 MHz. See Section 7.22.7 “System PLL1”. • Section 13.7 “Suggested USB interface solutions” added. • SSP master mode timing diagram updated with SSEL timing parameters. See Figure 30 “SSP master mode timing (SPI mode)”. • Parameters tlead, tlag, and td added in Table 22 “Dynamic characteristics: SSP pins in SPI mode”. • Reset state of the RTC alarm pin RTC_ALARM added. See Table 3. • SRAM location for parts LPC4320 corrected in Figure 7. • IEEE standard 802.3 compliance added to Section 11.16. Covers Ethernet dynamic characteristics of ENET_MDIO and ENET_MDC signals.\ • Signal polarity of EMC_CKEOUT and EMC_DQMOUT corrected. Both signals are active HIGH. • SPIFI output timing parameters in Table 33 corrected to apply to Mode 0: – tv(Q) changed to 3.2 ns. – th(Q) changed to 0.2 ns, • Parameter tCSLWEL with condition PB = 1 corrected: (WAITWEN + 1) Tcy(clk) added. See Table 25 “Dynamic characteristics: Static asynchronous external memory interface”. • Parameter tCSLBLSL with condition PB = 0 corrected: (WAITWEN + 1) Tcy(clk) added. See Table 25 “Dynamic characteristics: Static asynchronous external memory interface”. LPC4350_30_20_10 v.4.1 20131211 Product data sheet - LPC4350_30_20_10 v.4 Modifications: • Description of RESET pin updated in Table 3. • Layout of local SRAM at address 0x1008 0000 clarified in Figure 7 “LPC4350/30/20/10 Memory mapping (overview)”. • Maximum value for Vi(RMS) added in Section 13.3 “RTC oscillator”. • VO for RTC_ALARM pin added in Table 10. • RTC_ALARM and WAKEUPn pins added to Table 10. • Table note 9 added in Table 10. • Timing parameters in Table 31 “Dynamic characteristics: SD/MMC” corrected. • Band gap characteristics removed. • OTP memory size available for general purpose use corrected. • Part LPC4350FBD208 removed. LPC4350_30_20_10 v.4 20130326 Product data sheet - LPC4350_30_20_10 v.3.7LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 150 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller • Parameter ILH (High-level leakage current) for condition VI = 5 V changed to 20 nA (max). See Table 10. • Parameter VDDA(3V3) added for pins USB0_VDDA3V3_DRIVER and USB0_VDDA3V3 in Table 10. • SPI timing data added. See Table 22. • SGPIO timing data added. See Table 23. • SPI and SGPIO peripheral power consumption added in Table 11. • Data sheet status changed to Product data sheet. • Corrected max voltage on pins USB0_DP, USB0_DM, USB0_VBUS, USB1_DP, and USB1_DM in Table 6 and Table 10 to be consistent with USB specifications. LPC4350_30_20_10 v.3.7 20130131 Preliminary data sheet - LPC4350_30_20_10 v.3.6 Modifications: • SGPIO and SPI location corrected in Figure 1. • SGPIO-to-DMA connection corrected in Figure 7. • Power consumption in active mode corrected. See parameter IDD(REG)(3V3) in Table 10 and graphs Figure 12, Figure 13, and Figure 14. • Parameter name IDD(ADC) changed to IDDA in Table 10. • Figure 21 “Band gap voltage for different temperatures and process conditions” and Table 13 “Band gap characteristics” corrected. • Added note to limit data in Table 24 “Dynamic characteristics: Static asynchronous external memory interface” to single memory accesses. • Value of parameter IDD(REG)(3V3) in deep power-down increased to 0.03 μA in Table 10. • Value of parameter IDD(IO) in deep power-down increased to 0.05 μA in Table 10. LPC4350_30_20_10 v.3.6 20121119 Preliminary data sheet - LPC4350_30_20_10 v.3.5 Modifications: • Table 13 “Band gap characteristics” added. • Power consumption for M0 core added in Table 11 “Peripheral power consumption”. • Section 7.22.10 “Power Management Controller (PMC)” added. • Table 10, added Table note 2: “Dynamic characteristics for peripherals are provided for VDD(REG)(3V3) 2.7 V.” • Description of ADC pins on digital/analog input pins changed. Each input to the ADC is connected to ADC0 and ADC1. See Table 3. • Use of C_CAN peripheral restricted in Section 2. • ADC channels limited to a total of 8 channels shared between ADC0 and ADC1. • Minimum value for parameter VIL changed to 0 V in Table 10 “Static characteristics”. LPC4350_30_20_10 v.3.5 20121011 Preliminary data sheet - LPC4350_30_20_10 v.3.4 Table 42. Revision history …continued Document ID Release date Data sheet status Change notice SupersedesLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 151 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Modifications: • Temperature range for simulated timing characteristics corrected to Tamb = 40 C to +85 C in Section 11 “Dynamic characteristics”. • SPIFI timing added. See Section 11.15. • SPIFI maximum data rate changed to 52 MB per second. • Editorial updates. • Figure 25 and Figure 26 updated for full temperature range. • Section 7.23 “Serial Wire Debug/JTAG” updated. • The following changes were made on the TFBGA180 pinout in Table 3: – P1_13 moved from ball D6 to L8. – P7_5 moved from ball C7 to A7. – PF_4 moved from ball L8 to D6. – RESET moved from ball B7 to C7. – RTCX2 moved from ball A7 to B7. – Ball G10 changed from VSS to VDDIO. LPC4350_30_20_10 v.3.4 20120904 Preliminary data sheet - LPC4350_30_20_10 v.3.3 Modifications: • SSP0 boot pin functions corrected in Table 5 and Table 4. Pin P3_3 = SSP0_SCK, pin P3_6 = SSP0_SSEL, pin P3_7 = SSP0_MISO, pin P3_8 = SSP0_MOSI. • Minimum value for all supply voltages changed to -0.5 V in Table 6. LPC4350_30_20_10 v.3.3 20120821 Preliminary data sheet - LPC4350_30_20_10 v.3.2 Modifications: • Parameter twake updated in Table 13 for wake-up from deep power-down mode and reset. • Dynamic characteristics of the SD/MMC controller updated in Table 28. • Dynamic characteristics of the LCD controller updated in Table 29. • Dynamic characteristics of the SSP controller updated in Table 21. • Minimum value of VI for conditions “USB0 pins USB0_DP; USB0_DM; USB0_VBUS”,“USB0 pins USB0_ID; USB0_RREF”, and “USB1 pins USB1_DP and USB1_DM” changed to 0.3 V in Table 6. • Parameters IIL and IIH renamed to ILL and ILH in Table 10. • AES removed. AES is available on parts LPC43Sxx only. • Pin configuration diagrams corrected for LQFP packages (Figure 5 and Figure 6). • Figure 10 updated. • All power consumption data updated in Table 10 and Section 10.1 “Power consumption”. • BOD levels updated in Table 12. • SWD debug option removed for Cortex-M0 core. LPC4350_30_20_10 v.3.2 20120604 Preliminary data sheet - LPC4350_30_20_10 v.3.1 LPC4350_30_20_10 v.3.1 20120105 Objective data sheet - LPC4350_30_20_10 v.3 LPC4350_30_20_10 v.3 20111205 Objective data sheet - LPC4350_30_20_10 v.2.1 LPC4350_30_20_10 v.2.1 20110923 Objective data sheet - LPC4350_30_20_10 v.2 LPC4350_30_20_10 v.2 20110714 Objective data sheet - LPC4350_30_20_10 v.1 LPC4350_30_20_10 v.1 20101029 Objective data sheet - - Table 42. Revision history …continued Document ID Release date Data sheet status Change notice SupersedesLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 152 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 19. Legal information 19.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 19.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 19.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 153 of 155 NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 19.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. I 2C-bus — logo is a trademark of NXP Semiconductors N.V. 20. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.comLPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 4.2 — 18 August 2014 154 of 155 continued >> NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 5 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 5 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 7 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 Functional description . . . . . . . . . . . . . . . . . . 61 7.1 Architectural overview . . . . . . . . . . . . . . . . . . 61 7.2 ARM Cortex-M4 processor . . . . . . . . . . . . . . . 61 7.3 ARM Cortex-M0 co-processor . . . . . . . . . . . . 61 7.4 Interprocessor communication . . . . . . . . . . . . 61 7.5 AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 62 7.6 Nested Vectored Interrupt Controller (NVIC) . 62 7.6.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.6.2 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 63 7.7 System Tick timer (SysTick) . . . . . . . . . . . . . . 63 7.8 Event router . . . . . . . . . . . . . . . . . . . . . . . . . . 63 7.9 Global Input Multiplexer Array (GIMA) . . . . . . 63 7.9.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.10 On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 64 7.11 In-System Programming (ISP) . . . . . . . . . . . . 64 7.12 Boot ROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 7.13 Memory mapping . . . . . . . . . . . . . . . . . . . . . . 65 7.14 One-Time Programmable (OTP) memory . . . 68 7.15 General-Purpose I/O (GPIO) . . . . . . . . . . . . . 68 7.15.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.16 Configurable digital peripherals . . . . . . . . . . . 68 7.16.1 State Configurable Timer (SCTimer/PWM) subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 7.16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.16.2 Serial GPIO (SGPIO) . . . . . . . . . . . . . . . . . . . 69 7.16.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 7.17 AHB peripherals . . . . . . . . . . . . . . . . . . . . . . . 70 7.17.1 General-Purpose DMA (GPDMA). . . . . . . . . . 70 7.17.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 7.17.2 SPI Flash Interface (SPIFI). . . . . . . . . . . . . . . 70 7.17.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 7.17.3 SD/MMC card interface . . . . . . . . . . . . . . . . . 71 7.17.4 External Memory Controller (EMC). . . . . . . . . 71 7.17.4.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 7.17.5 High-speed USB Host/Device/OTG interface (USB0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.17.5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.17.6 High-speed USB Host/Device interface with ULPI (USB1) . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.17.6.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 7.17.7 LCD controller . . . . . . . . . . . . . . . . . . . . . . . . 73 7.17.7.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 7.17.8 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.17.8.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.18 Digital serial peripherals. . . . . . . . . . . . . . . . . 74 7.18.1 UART1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.18.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 7.18.2 USART0/2/3. . . . . . . . . . . . . . . . . . . . . . . . . . 75 7.18.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 7.18.3 SPI serial I/O controller . . . . . . . . . . . . . . . . . 75 7.18.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 7.18.4 SSP serial I/O controller. . . . . . . . . . . . . . . . . 75 7.18.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 7.18.5 I2C-bus interface . . . . . . . . . . . . . . . . . . . . . . 76 7.18.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 7.18.6 I2S interface . . . . . . . . . . . . . . . . . . . . . . . . . . 76 7.18.6.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.18.7 C_CAN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.18.7.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 7.19 Counter/timers and motor control . . . . . . . . . 78 7.19.1 General purpose 32-bit timers/external event counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.19.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.19.2 Motor control PWM . . . . . . . . . . . . . . . . . . . . 78 7.19.3 Quadrature Encoder Interface (QEI) . . . . . . . 78 7.19.3.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 7.19.4 Repetitive Interrupt (RI) timer. . . . . . . . . . . . . 79 7.19.4.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.19.5 Windowed WatchDog Timer (WWDT) . . . . . . 79 7.19.5.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 7.20 Analog peripherals . . . . . . . . . . . . . . . . . . . . . 80 7.20.1 Analog-to-Digital Converter (ADC0/1) . . . . . . 80 7.20.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.20.2 Digital-to-Analog Converter (DAC). . . . . . . . . 80 7.20.2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.21 Peripherals in the RTC power domain . . . . . . 80 7.21.1 RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.21.1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 7.21.2 Alarm timer. . . . . . . . . . . . . . . . . . . . . . . . . . . 81 7.22 System control . . . . . . . . . . . . . . . . . . . . . . . . 81 7.22.1 Configuration registers (CREG) . . . . . . . . . . . 81 7.22.2 System Control Unit (SCU) . . . . . . . . . . . . . . 81 7.22.3 Clock Generation Unit (CGU) . . . . . . . . . . . . 81 7.22.4 Internal RC oscillator (IRC) . . . . . . . . . . . . . . 82 7.22.5 PLL0USB (for USB0) . . . . . . . . . . . . . . . . . . . 82NXP Semiconductors LPC4350/30/20/10 32-bit ARM Cortex-M4/M0 microcontroller © NXP Semiconductors N.V. 2014. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 August 2014 Document identifier: LPC4350_30_20_10 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 7.22.6 PLL0AUDIO (for audio) . . . . . . . . . . . . . . . . . 82 7.22.7 System PLL1 . . . . . . . . . . . . . . . . . . . . . . . . . 82 7.22.8 Reset Generation Unit (RGU). . . . . . . . . . . . . 82 7.22.9 Power control . . . . . . . . . . . . . . . . . . . . . . . . . 82 7.22.10 Power Management Controller (PMC) . . . . . . 83 7.23 Serial Wire Debug/JTAG. . . . . . . . . . . . . . . . . 84 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 86 9 Thermal characteristics . . . . . . . . . . . . . . . . . 87 10 Static characteristics. . . . . . . . . . . . . . . . . . . . 88 10.1 Power consumption . . . . . . . . . . . . . . . . . . . . 95 10.2 Peripheral power consumption . . . . . . . . . . . . 99 10.3 BOD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 10.4 Electrical pin characteristics . . . . . . . . . . . . . 102 11 Dynamic characteristics . . . . . . . . . . . . . . . . 106 11.1 Wake-up times . . . . . . . . . . . . . . . . . . . . . . . 106 11.2 External clock for oscillator in slave mode . . 106 11.3 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 107 11.4 IRC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 107 11.5 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 107 11.6 I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 11.7 I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 11.8 I2S-bus interface. . . . . . . . . . . . . . . . . . . . . . 110 11.9 USART interface. . . . . . . . . . . . . . . . . . . . . . 111 11.10 SSP interface . . . . . . . . . . . . . . . . . . . . . . . . 112 11.11 SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . 114 11.12 SSP/SPI timing diagrams . . . . . . . . . . . . . . . 115 11.13 SGPIO timing . . . . . . . . . . . . . . . . . . . . . . . . 116 11.14 External memory interface . . . . . . . . . . . . . . 118 11.15 USB interface . . . . . . . . . . . . . . . . . . . . . . . 123 11.16 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 11.17 SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 11.18 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 11.19 SPIFI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 12 ADC/DAC electrical characteristics . . . . . . . 128 13 Application information. . . . . . . . . . . . . . . . . 131 13.1 LCD panel signal usage . . . . . . . . . . . . . . . . 131 13.2 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . 133 13.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . . 135 13.4 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines. . . . . . . . . . . . . . . . . . . . . . 135 13.5 Standard I/O pin configuration . . . . . . . . . . . 135 13.6 Reset pin configuration. . . . . . . . . . . . . . . . . 136 13.7 Suggested USB interface solutions . . . . . . . 136 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . 139 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143 16 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . 147 17 References . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 18 Revision history. . . . . . . . . . . . . . . . . . . . . . . 149 19 Legal information . . . . . . . . . . . . . . . . . . . . . 152 19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . 152 19.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . 152 19.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . 152 19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . 153 20 Contact information . . . . . . . . . . . . . . . . . . . 153 21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Your Electronic Engineering Resource Legal Disclaimer: The content of the pages of this website is for your general information and use only. It is subject to change without notice. From time to time, this website may also include links to other websites. These links are provided for your convenience to provide further information. They do not signify that we endorse the website(s). We have no responsibility for the content of the linked website(s). Your use of any information or materials on this website is entirely at your own risk, for which we shall not be liable. It shall be your own responsibility to ensure that any products, services or information available through this website meet your specific requirements. 7491181012: Off-line Transformer WE-UNIT Product Description: Würth Electronics, Inc. has a broad selection of power transformers for the latest reference designs from some of the leading IC manufacturers in the industry. The overall product offering contains more than 50 transformers built for chipsets from NXP Semiconductors, Linear Technology, ON Semiconductor, Power Integrations, STMicroelectronics, and National Semiconductor. Examples of these devices are a series of offline power transformers designed for NXP's dimmable LED drivers and a full series of flyback transformers for Linear Technology's isolated flyback converters. They are Designed for Tiny Switch ICs from Power Integration and NCP101x or 105x of ON Semiconductor Key Features: Nominal input voltage: 125V DC to 375V DC Output power 3W and 9W Operating temperature: -40°C to +125°C Clearance and creepage distance 6mm min. Switching frequency: 132kHz Isolation voltage 4kVAC Applications: Designed for Tiny Switch ICs from Power Integration and NCP101x or 105x of ON Semiconductor For SMPS with universal input from 85 VAC up to 265 VAC Ordering Information: Mfr Part # Farnell# Newark# Description 7491181012 Click Here Click Here Off-line transformer WE-UNIT 1. Introduction This data sheet describes the functionality of the CLRC632 Integrated Circuit (IC). It includes the functional and electrical specifications and from a system and hardware viewpoint gives detailed information on how to design-in the device. Remark: The CLRC632 supports all variants of the MIFARE Mini, MIFARE 1K, MIFARE 4K and MIFARE Ultralight RF identification protocols. To aid readability throughout this data sheet, the MIFARE Mini, MIFARE 1K, MIFARE 4K and MIFARE Ultralight products and protocols have the generic name MIFARE. 2. General description The CLRC632 is a highly integrated reader IC for contactless communication at 13.56 MHz. The CLRC632 reader IC provides: • outstanding modulation and demodulation for passive contactless communication • a wide range of methods and protocols • a small, fully integrated package • pin compatibility with the MFRC500, MFRC530, MFRC531 and SLRC400 All protocol layers of the ISO/IEC 14443 A and ISO/IEC 14443 B communication standards are supported provided: • additional components, such as the oscillator, power supply, coil etc. are correctly applied. • standardized protocols, such as ISO/IEC 14443-4 and/or ISO/IEC 14443 B anticollision are correctly implemented The CLRC632 supports contactless communication using MIFARE higher baud rates (see Section 9.12 on page 40). The receiver module provides a robust and efficient demodulation/decoding circuitry implementation for compatible transponder signals (see Section 9.10 on page 34). The digital module, manages the complete ISO/IEC 14443 standard framing and error detection (parity and CRC). In addition, it supports the fast MIFARE security algorithm for authenticating the MIFARE products (see Section 9.14 on page 42). All layers of the I-CODE1 and ISO/IEC 15693 protocols are supported by the CLRC632. The receiver module provides a robust and efficient demodulation/decoding circuitry implementation for I-CODE1 and ISO/IEC 15693 compatible transponder signals. The digital module handles I-CODE1 and ISO/IEC 15693 framing and error detection (CRC). CLRC632 Standard multi-protocol reader solution Rev. 3.7 — 27 February 2014 073937 Product data sheet COMPANY PUBLICCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 2 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution The internal transmitter module (Section 9.9 on page 31) can directly drive an antenna designed for a proximity operating distance up to 100 mm without any additional active circuitry. A parallel interface can be directly connected to any 8-bit microprocessor to ensure reader/terminal design flexibility. In addition, Serial Peripheral Interface (SPI) compatibility is supported (see Section 9.1.4 on page 9). 3. Features and benefits 3.1 General Highly integrated analog circuitry for demodulating and decoding card/label response Buffered output drivers enable antenna connection using the minimum of external components Proximity operating distance up to 100 mm Supports both ISO/IEC 14443 A and ISO/IEC 14443 B standards Supports MIFARE dual-interface card ICs and the MIFARE Mini, MIFARE 1K, MIFARE 4K protocols Contactless communication at MIFARE higher baud rates (up to 424 kBd) Supports both I-CODE1 and ISO/IEC 15693 protocols Crypto1 and secure non-volatile internal key memory Pin-compatible with the MFRC500, MFRC530, MFRC531 and the SLRC400 Parallel microprocessor interface with internal address latch and IRQ line SPI compatibility Flexible interrupt handling Automatic detection of parallel microprocessor interface type 64-byte send and receive FIFO buffer Hard reset with low power function Software controlled Power-down mode Programmable timer Unique serial number User programmable start-up configuration Bit-oriented and byte oriented framing Independent power supply pins for analog, digital and transmitter modules Internal oscillator buffer optimized for low phase jitter enables 13.56 MHz quartz connection Clock frequency filtering 3.3 V to 5 V operation for transmitter in short range and proximity applications 3.3 V or 5 V operation for the digital module 4. Applications Electronic payment systems Identification systems Access control systemsCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 3 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Subscriber services Banking systems Digital content systems 5. Quick reference data 6. Ordering information Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit Tamb ambient temperature 40 - +150 C Tstg storage temperature 40 - +150 C VDDD digital supply voltage 0.5 5 6 V VDDA analog supply voltage 0.5 5 6 V VDD(TVDD) TVDD supply voltage 0.5 5 6 V Vi input voltage (absolute value) on any digital pin to DVSS 0.5 - VDDD + 0.5 V on pin RX to AVSS 0.5 - VDDA + 0.5 V ILI input leakage current 1.0 - 1.0 mA IDD(TVDD) TVDD supply current continuous wave - - 150 mA Table 2. Ordering information Type number Package Name Description Version CLRC63201T/0FE SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 4 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 7. Block diagram Fig 1. CLRC632 block diagram 001aaj629 FIFO CONTROL 64-BYTE FIFO MASTER KEY BUFFER CRYPTO1 UNIT CONTROL REGISTER BANK NWR NRD NCS ALE A0 A1 A2 10 11 9 21 22 23 24 13 14 15 16 17 18 19 20 AD0 to AD7/D0 to D7 STATE MACHINE COMMAND REGISTER PROGRAMMABLE TIMER INTERRUPT CONTROL CRC16/CRC8 GENERATION AND CHECK PARALLEL/SERIAL CONVERTER BIT COUNTER PARITY GENERATION AND CHECK FRAME GENERATION AND CHECK SERIAL DATA SWITCH BIT DECODING BIT ENCODING 32 × 16-BYTE EEPROM EEPROM ACCESS CONTROL 32-BIT PSEUDO RANDOM GENERATOR AMPLITUDE RATING CLOCK GENERATION, FILTERING AND DISTRIBUTION OSCILLATOR LEVEL SHIFTERS CORRELATION AND REFERENCE BIT DECODING VOLTAGE Q-CHANNEL AMPLIFIER Q-CHANNEL DEMODULATOR I-CHANNEL ANALOG AMPLIFIER TEST MULTIPLEXER I-CHANNEL DEMODULATOR PARALLEL INTERFACE CONTROL (INCLUDING AUTOMATIC INTERFACE DETECTION AND SYNCHRONISATION) VOLTAGE MONITOR AND POWER ON DETECT DVDD RSTPD Q-CLOCK GENERATION TRANSMITTER CONTROL GND GND VMID AUX RX TVSS TX1 TX2 TVDD 30 27 29 8 5 7 6 V V POWER ON DETECT OSCIN AVDD AVSS OSCOUT IRQ MFIN MFOUT DVSS 25 31 1 26 28 32 2 3 4 12 RESET CONTROL POWER DOWN CONTROLCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 5 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 8. Pinning information 8.1 Pin description Fig 2. CLRC632 pin configuration CLRC632 OSCIN OSCOUT IRQ RSTPD MFIN VMID MFOUT RX TX1 AVSS TVDD AUX TX2 AVDD TVSS DVDD NCS A2/SCK NWR/R/NW/nWrite A1 NRD/NDS/nDStrb A0/nWait/MOSI DVSS ALE/AS/nAStrb/NSS AD0/D0 D7/AD7 AD1/D1 D6/AD6 AD2/D2 D5/AD5 AD3/D3 D4/AD4 001aaj630 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 18 17 20 19 22 21 24 23 26 25 32 31 30 29 28 27 Table 3. Pin description Pin Symbol Type[1] Description 1 OSCIN I oscillator/clock inputs: crystal oscillator input to the oscillator’s inverting amplifier externally generated clock input; fosc = 13.56 MHz 2 IRQ O interrupt request generates an output signaling an interrupt event 3 MFIN I ISO/IEC 14443 A MIFARE serial data interface input 4[2] MFOUT O interface outputs used as follows: MIFARE: generates serial data ISO/IEC 14443 A I-CODE: generates serial data based on I-CODE1 and ISO/IEC 15693 5 TX1 O transmitter 1 modulated carrier output; 13.56 MHz 6 TVDD P transmitter power supply for the TX1 and TX2 output stages 7 TX2 O transmitter 2 modulated carrier output; 13.56 MHz 8 TVSS G transmitter ground for the TX1 and TX2 output stages 9 NCS I not chip select input is used to select and activate the CLRC632’s microprocessor interface 10[3] NWR I not write input generates the strobe signal for writing data to the CLRC632 registers when applied to pins D0 to D7 R/NW I read not write input is used to switch between read or write cycles nWrite I not write input selects the read or write cycle to be performedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 6 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution [1] Pin types: I = Input, O = Output, I/O = Input/Output, P = Power and G = Ground. [2] The SLRC400 uses pin name SIGOUT for pin MFOUT. The CLRC632 functionality includes test functions for the SLRC400 using pin MFOUT. [3] These pins provide different functionality depending on the selected microprocessor interface type (see Section 9.1 on page 7 for detailed information). 11[3] NRD I not read input generates the strobe signal for reading data from the CLRC632 registers when applied to pins D0 to D7 NDS I not data strobe input generates the strobe signal for the read and write cycles nDStrb I not data strobe input generates the strobe signal for the read and write cycles 12 DVSS G digital ground 13 D0 O SPI master in, slave out output 13 to 20[3] D0 to D7 I/O 8-bit bidirectional data bus input/output on pins D0 to D7 AD0 to AD7 I/O 8-bit bidirectional address and data bus input/output on pins AD0 to AD7 21[3] ALE I address latch enable input for pins AD0 to AD5; HIGH latches the internal address AS I address strobe input for pins AD0 to AD5; HIGH latches the internal address nAStrb I not address strobe input for pins AD0 to AD5; LOW latches the internal address NSS I not slave select strobe input for SPI communication 22[3] A0 I address line 0 is the address register bit 0 input nWait O not wait output: LOW starts an access cycle HIGH ends an access cycle MOSI I SPI master out, slave in 23 A1 I address line 1 is the address register bit 1 input 24[3] A2 I address line 2 is the address register bit 2 input SCK I SPI serial clock input 25 DVDD P digital power supply 26 AVDD P analog power supply for pins OSCIN, OSCOUT, RX, VMID and AUX 27 AUX O auxiliary output is used to generate analog test signals. The output signal is selected using the TestAnaSelect register’s TestAnaOutSel[4:0] bits 28 AVSS G analog ground 29 RX I receiver input is used as the card response input. The carrier is load modulated at 13.56 MHz, drawn from the antenna circuit 30 VMID P internal reference voltage pin provides the internal reference voltage as a supply Remark: It must be connected to a 100 nF block capacitor connected between pin VMID and ground 31 RSTPD I reset and power-down input: HIGH: the internal current sinks are switched off, the oscillator is inhibited and the input pads are disconnected LOW (negative edge): start internal reset phase 32 OSCOUT O crystal oscillator output for the oscillator’s inverting amplifier Table 3. Pin description …continued Pin Symbol Type[1] DescriptionCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 7 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9. Functional description 9.1 Digital interface 9.1.1 Overview of supported microprocessor interfaces The CLRC632 supports direct interfacing to various 8-bit microprocessors. Alternatively, the CLRC632 can be connected to a PC’s Enhanced Parallel Port (EPP). Table 4 shows the parallel interface signals supported by the CLRC632. 9.1.2 Automatic microprocessor interface detection After a Power-On or Hard reset, the CLRC632 resets parallel microprocessor interface mode and detects the microprocessor interface type. The CLRC632 identifies the microprocessor interface using the logic levels on the control pins. This is performed using a combination of fixed pin connections and the dedicated Initialization routine (see Section 9.7.4 on page 30). Table 4. Supported microprocessor and EPP interface signals Bus control signals Bus Separated address and data bus Multiplexed address and data bus Separated read and write strobes control NRD, NWR, NCS NRD, NWR, NCS, ALE address A0, A1, A2 AD0, AD1, AD2, AD3, AD4, AD5 data D0 to D7 AD0 to AD7 Common read and write strobe control R/NW, NDS, NCS R/NW, NDS, NCS, AS address A0, A1, A2 AD0, AD1, AD2, AD3, AD4, AD5 data D0 to D7 AD0 to AD7 Common read and write strobe with handshake (EPP) control - nWrite, nDStrb, nAStrb, nWait address - AD0, AD1, AD2, AD3, AD4, AD5 data - AD0 to AD7CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 8 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.1.3 Connection to different microprocessor types The connection to various microprocessor types is shown in Table 5. 9.1.3.1 Separate read and write strobe Refer to Section 13.4.1 on page 102 for timing specification. Table 5. Connection scheme for detecting the parallel interface type CLRC632 pins Parallel interface type and signals Separated read/write strobe Common read/write strobe Dedicated address bus Multiplexed address bus Dedicated address bus Multiplexed address bus Multiplexed address bus with handshake ALE HIGH ALE HIGH AS nAStrb A2 A2 LOW A2 LOW HIGH A1 A1 HIGH A1 HIGH HIGH A0 A0 HIGH A0 LOW nWait NRD NRD NRD NDS NDS nDStrb NWR NWR NWR R/NW R/NW nWrite NCS NCS NCS NCS NCS LOW D7 to D0 D7 to D0 AD7 to AD0 D7 to D0 AD7 to AD0 AD7 to AD0 Fig 3. Connection to microprocessor: separate read and write strobes 001aak607 address bus (A3 to An) NCS A0 to A2 address bus (A0 to A2) D0 to D7 ALE data bus (D0 to D7) HIGH NRD Read strobe (NRD) NWR Write strobe (NWR) DEVICE ADDRESS DECODER non-multiplexed address NCS AD0 to AD7 ALE multiplexed address/data (AD0 to AD7) address latch enable (ALE) NRD Read strobe (NRD) NWR Write strobe (NWR) A2 LOW A1 HIGH A0 HIGH DEVICE ADDRESS DECODERCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 9 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.1.3.2 Common read and write strobe Refer to Section 13.4.2 on page 103 for timing specification. 9.1.3.3 Common read and write strobe: EPP with handshake Refer to Section 13.4.3 on page 104 for timing specification. Remark: In the EPP standard a chip select signal is not defined. To cover this situation, the status of the NCS pin can be used to inhibit the nDStrb signal. If this inhibitor is not used, it is mandatory that pin NCS is connected to pin DVSS. Remark: After each Power-On or Hard reset, the nWait signal on pin A0 is high-impedance. nWait is defined as the first negative edge applied to the nAStrb pin after the reset phase. The CLRC632 does not support Read Address Cycle. 9.1.4 Serial Peripheral Interface The CLRC632 provides compatibility with the 5-wire Serial Peripheral Interface (SPI) standard and acts as a slave during the SPI communication. The SPI clock signal SCK must be generated by the master. Data communication from the master to the slave uses the MOSI line. The MISO line sends data from the CLRC632 to the master. Fig 4. Connection to microprocessor: common read and write strobes 001aak608 address bus (A3 to An) NCS A0 to A2 address bus (A0 to A2) D0 to D7 ALE data bus (D0 to D7) HIGH NRD Data strobe (NDS) NWR Read/Write (R/NW) DEVICE ADDRESS DECODER non-multiplexed address NCS AD0 to AD7 ALE multiplexed address/data (AD0 to AD7) Address strobe (AS) NRD Data strobe (NDS) NWR Read/Write (R/NW) A2 LOW A1 HIGH A0 LOW DEVICE ADDRESS DECODER Fig 5. Connection to microprocessor: EPP common read/write strobes and handshake 001aak609 LOW NCS AD0 to AD7 ALE multiplexed address/data (AD0 to AD7) Address strobe (nAStrb) NRD Data strobe (nDStrb) NWR Read/Write (nWrite) A2 HIGH A1 HIGH A0 nWait DEVICECLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 10 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Figure 6 shows the microprocessor connection to the CLRC632 using SPI. Remark: The SPI implementation for CLRC632 conforms to the SPI standard and ensures that the CLRC632 can only be addressed as a slave. 9.1.4.1 SPI read data The structure shown in Table 7 must be used to read data using SPI. It is possible to read up to n-data bytes. The first byte sent defines both, the mode and the address. The address byte must meet the following criteria: • the Most Significant Bit (MSB) of the first byte sets the mode. To read data from the CLRC632 the MSB is set to logic 1 • bits [6:1] define the address • the Least Significant Bit (LSB) should be set to logic 0. As shown in Table 8, all the bits of the last byte sent are set to logic 0. Table 6. SPI compatibility CLRC632 pins SPI pins ALE NSS A2 SCK A1 LOW A0 MOSI NRD HIGH NWR HIGH NCS LOW D7 to D1 do not connect D0 MISO Fig 6. Connection to microprocessor: SPI 001aak610 LOW NCS D0 ALE A2 SCK A1 LOW MOSI NSS A0 MISO DEVICE Table 7. SPI read data Pin Byte 0 Byte 1 Byte 2 ... Byte n Byte n + 1 MOSI address 0 address 1 address 2 ... address n 00 MISO XX data 0 data 1 ... data n 1 data nCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 11 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution [1] All reserved bits must be set to logic 0. 9.1.4.2 SPI write data The structure shown in Table 9 must be used to write data using SPI. It is possible to write up to n-data bytes. The first byte sent defines both the mode and the address. The address byte must meet the following criteria: • the MSB of the first byte sets the mode. To write data to the CLRC632, the MSB is set to logic 0 • bits [6:1] define the address • the LSB should be set to logic 0. SPI write mode writes all data to the address defined in byte 0 enabling effective write cycles to the FIFO buffer. [1] All reserved bits must be set to logic 0. Remark: The data bus pins D7 to D0 must be disconnected. Refer to Section 13.4.4 on page 106 for the timing specification. Table 8. SPI read address Address (MOSI) Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) byte 0 1 address address address address address address reserved byte 1 to byte n reserved address address address address address address reserved byte n + 1 0 0 0 0 0 0 0 0 Table 9. SPI write data Byte 0 Byte 1 Byte 2 ... Byte n Byte n + 1 MOSI address data 0 data 1 ... data n 1 data n MISO XX XX XX ... XX XX Table 10. SPI write address Address line (MOSI) Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB) byte 0 0 address address address address address address reserved byte 1 to byte n+1 data data data data data data data dataCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 12 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.2 Memory organization of the EEPROM Table 11. EEPROM memory organization diagram Block Byte address Access Memory content Refer to Position Address 0 0 00h to 0Fh R product information field Section 9.2.1 on page 13 1 1 10h to 1Fh R/W StartUp register initialization file Section 9.2.2.1 on page 14 2 2 20h to 2Fh R/W 3 3 30h to 3Fh R/W register initialization file user data or second initialization Section 9.2.2.3 “Register initialization file (read/write)” on page 16 4 4 40h to 4Fh R/W 5 5 50h to 5Fh R/W 6 6 60h to 6Fh R/W 7 7 70h to 7Fh R/W 8 8 80h to 8Fh W keys for Crypto1 Section 9.2.3 on page 18 9 9 90h to 9Fh W 10 A A0h to AFh W 11 B B0h to BFh W 12 C C0h to CFh W 13 D D0h to DFh W 14 E E0h to EFh W 15 F F0h to FFh W 16 10 100h to 10Fh W 17 11 110h to 11Fh W 18 12 120h to 12Fh W 19 13 130h to 13Fh W 20 14 140h to 14Fh W 21 15 150h to 15Fh W 22 16 160h to 16Fh W 23 17 170h to 17Fh W 24 18 180h to 18Fh W 25 19 190h to 19Fh W 26 1A 1A0h to 1AFh W 27 1B 1B0h to 1BFh W 28 1C 1C0h to 1CFh W 29 1D 1D0h to 1DFh W 30 1E 1E0h to 1EFh W 31 1F 1F0h to 1FFh WCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 13 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.2.1 Product information field (read only) [1] Byte 4 contains the current version number. 9.2.2 Register initialization files (read/write) Register initialization from address 10h to address 2Fh is performed automatically during the initializing phase (see Section 9.7.3 on page 30) using the StartUp register initialization file. In addition, the CLRC632 registers can be initialized using values from the register initialization file when the LoadConfig command is executed (see Section 11.5.1 on page 95). Table 12. Product information field Byte Symbol Access Value Description 15 CRC R - the content of the product information field is secured using a CRC byte which is checked during start-up 14 RsMaxP R - maximum source resistance for the p-channel driver transistor on pins TX1 and TX2 The source resistance of the p-channel driver transistors of pin TX1 and TX2 can be adjusted using the value GsCfgCW[5:0] in the CwConductance register (see Section 9.9.3 on page 32). The mean value of the maximum adjustable source resistance for pins TX1 and TX2 is stored as an integer value in in this byte. Typical values for RsMaxP are between 60 to 140 . This value is denoted as maximum adjustable source resistance RS(ref)maxP and is measured by setting the CwConductance register’s GsCfgCW[5:0] bits to 01h. 13 to 12 Internal R - two bytes for internal trimming parameters 11 to 8 Product Serial Number R - a unique four byte serial number for the device 7 to 5 reserved R - 4 to 0 Product Type Identification R - the CLRC632 is a member of a new family of highly integrated reader ICs. Each member of the product family has a unique product type identification. The value of the product type identification is shown in Table 13. Table 13. Product type identification definition Definition Product type identification bytes Byte 0 1 2 3 4[1] Value 30h FFh FFh 0Fh XXhCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 14 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Remark: The following points apply to initialization: • the Page register (addressed using 10h, 18h, 20h, 28h) is skipped and not initialized. • make sure that all PreSetxx registers are not changed. • make sure that all register bits that are reserved are set to logic 0. 9.2.2.1 StartUp register initialization file (read/write) The EEPROM memory block address 1 and 2 contents are used to automatically set the register subaddresses 10h to 2Fh during the initialization phase. The default values stored in the EEPROM during production are shown in Section 9.2.2.2 “Factory default StartUp register initialization file”. The byte assignment is shown in Table 14. 9.2.2.2 Factory default StartUp register initialization file During the production tests, the StartUp register initialization file is initialized using the default values shown in Table 15. During each power-up and initialization phase, these values are written to the CLRC632’s registers. Table 14. Byte assignment for register initialization at start-up EEPROM byte address Register address Remark 10h (block 1, byte 0) 10h skipped 11h 11h copied … …… 2Fh (block 2, byte 15) 2Fh copiedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 15 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Remark: The CLRC632 default configuration supports the MIFARE and ISO/IEC 14443 A communication scheme. Memory addresses 3 to 7 may be used for user-specific initialization files such as I-CODE1, ISO/IEC 15693 or ISO/IEC 14443 B. Table 15. Shipment content of StartUp configuration file EEPROM byte address Register address Value Symbol Description 10h 10h 00h Page free for user 11h 11h 58h TxControl transmitter pins TX1 and TX2 are switched off, bridge driver configuration, modulator driven from internal digital circuitry 12h 12h 3Fh CwConductance source resistance of TX1 and TX2 is set to minimum 13h 13h 3Fh ModConductance defines the output conductance 14h 14h 19h CoderControl ISO/IEC 14443 A coding is set 15h 15h 13h ModWidth pulse width for Miller pulse coding is set to standard configuration 16h 16h 3Fh ModWidthSOF pulse width of Start Of Frame (SOF) 17h 17h 3Bh TypeFraming ISO/IEC 14443 A framing is set 18h 18h 00h Page free for user 19h 19h 73h RxControl1 ISO/IEC 14443 A is set and internal amplifier gain is maximum 1Ah 1Ah 08h DecoderControl bit-collisions always evaluate to HIGH in the data bit stream 1Bh 1Bh ADh BitPhase BitPhase[7:0] is set to standard configuration 1Ch 1Ch FFh RxThreshold MinLevel[3:0] and CollLevel[3:0] are set to maximum 1Dh 1Dh 1Eh BPSKDemControl ISO/IEC 14443 A is set 1Eh 1Eh 41h RxControl2 use Q-clock for the receiver, automatic receiver off is switched on, decoder is driven from internal analog circuitry 1Fh 1Fh 00h ClockQControl automatic Q-clock calibration is switched on 20h 20h 00h Page free for user 21h 21h 06h RxWait frame guard time is set to six bit-clocks 22h 22h 03h ChannelRedundancy channel redundancy is set using ISO/IEC 14443 A 23h 23h 63h CRCPresetLSB CRC preset value is set using ISO/IEC 14443 A 24h 24h 63h CRCPresetMSB CRC preset value is set using ISO/IEC 14443 A 25h 25h 00h TimeSlotPeriod defines the time for the I-CODE1 time slots 26h 26h 00h MFOUTSelect pin MFOUT is set LOW 27h 27h 00h PreSet27 - 28h 28h 00h Page free for user 29h 29h 08h FIFOLevel WaterLevel[5:0] FIFO buffer warning level is set to standard configuration 2Ah 2Ah 07h TimerClock TPreScaler[4:0] is set to standard configuration, timer unit restart function is switched off 2Bh 2Bh 06h TimerControl Timer is started at the end of transmission, stopped at the beginning of reception 2Ch 2Ch 0Ah TimerReload TReloadValue[7:0]: the timer unit preset value is set to standard configuration 2Dh 2Dh 02h IRQPinConfig pin IRQ is set to high-impedance 2Eh 2Eh 00h PreSet2E - 2Fh 2Fh 00h PreSet2F -CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 16 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.2.2.3 Register initialization file (read/write) The EEPROM memory content from block address 3 to 7 can initialize register sub addresses 10h to 2Fh when the LoadConfig command is executed (see Section 11.5.1 on page 95). This command requires the EEPROM starting byte address as a two byte argument for the initialization procedure. The byte assignment is shown in Table 16. The register initialization file is large enough to hold values for two initialization sets and up to one block (16-byte) of user data. The startup configuration could be adapted to the I-CODE1 StartUp configuration and stored in register block address 3 and 4, providing additional flexibility. Remark: The register initialization file can be read/written by users and these bytes can be used to store other user data. After each power-up, the default configuration enables the MIFARE and ISO/IEC 14443 A protocol. 9.2.2.4 Content of I-CODE1 and ISO/IEC 15693 StartUp register values Table 17 gives an overview of the StartUp values for I-CODE1 and ISO/IEC 15693 communication. Table 16. Byte assignment for register initialization at startup EEPROM byte address Register address Remark EEPROM starting byte address 10h skipped EEPROM + 1 starting byte address 11h copied … … EEPROM + 31 starting byte address 2Fh copiedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 17 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Table 17. Content of I-CODE1 startup configuration EEPROM byte address Register address Value Symbol Description 30h 10h 00h Page free for user 31h 11h 58h TxControl transmitter pins TX1 and TX2 switched off, bridge driver configuration, modulator driven from internal digital circuitry 32h 12h 3Fh CwConductance source resistance (RS) of TX1 and TX2 to minimum 33h 13h 05h ModGsCfgh source resistance (RS) of TX1 and TX2 at the time of modulation, to determine the modulation index 34h 14h 2Ch CoderControl selects the bit coding mode and the framing during transmission 35h 15h 3Fh ModWidth pulse width for code used (1 out of 256, NRZ or 1 out of 4) pulse coding is set to standard configuration 36h 16h 3Fh ModWidthSOF pulse width of SOF 37h 17h 00h TypeBFraming - 38h 18h 00h Page free for user 39h 19h 8Bh RxControl1 amplifier gain is maximum 3Ah 1Ah 00h DecoderControl bit-collisions always evaluate to HIGH in the data bit stream 3Bh 1Bh 54h BitPhase BitPhase[7:0] is set to standard configuration 3Ch 1Ch 68h RxThreshold: MinLevel[3:0] and CollLevel[3:0] are set to maximum 3Dh 1Dh 00h BPSKDemControl - 3Eh 1Eh 41h RxControl2 use Q-clock for the receiver, automatic receiver off is switched on, decoder is driven from internal analog circuitry 3Fh 1Fh 00h ClockQControl automatic Q-clock calibration is switched on 40h 20h 00h Page free for user 41h 21h 08h RxWait frame guard time is set to eight bit-clocks 42h 22h 0Ch ChannelRedundancy channel redundancy is set using I-CODE1 43h 23h FEh CRCPresetLSB CRC preset value is set using I-CODE1 44h 24h FFh CRCPresetMSB CRC preset value is set using I-CODE1 45h 25h 00h TimeSlot Period defines the time for the I-CODE1 time slots 46h 26h 00h MFOUTSelect pin MFOUT is set LOW 47h 27h 00h PreSet27 - 48h 28h 00h Page free for user 49h 29h 3Eh FIFOLevel WaterLevel[5:0] FIFO buffer warning level is set to standard configuration 4Ah 2Ah 0Bh TimerClock TPreScaler[4:0] is set to standard configuration, timer unit restart function is switched off 4Bh 2Bh 02h TimerControl Timer is started at the end of transmission, stopped at the beginning of reception 4Ch 2Ch 00h TimerReload the timer unit preset value is set to standard configuration 4Dh 2Dh 02h IRQPinConfig pin IRQ is set to high-impedance 4Eh 2Eh 00h PreSet2E - 4Fh 2Fh 00h PreSet2F -CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 18 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.2.3 Crypto1 keys (write only) MIFARE security requires specific cryptographic keys to encrypt data stream communication on the contactless interface. These keys are called Crypto1 keys. 9.2.3.1 Key format Keys stored in the EEPROM are written in a specific format. Each key byte must be split into lower four bits k0 to k3 (lower nibble) and the higher four bits k4 to k7 (higher nibble). Each nibble is stored twice in one byte and one of the two nibbles is bit-wise inverted. This format is a precondition for successful execution of the LoadKeyE2 (see Section 11.7.1 on page 97) and LoadKey commands (see Section 11.7.2 on page 97). Using this format, 12 bytes of EEPROM memory are needed to store a 6-byte key. This is shown in Figure 7. Example: The value for the key must be written to the EEPROM. • If the key was: A0h A1h A2h A3h A4h A5h then • 5Ah F0h 5Ah E1h 5Ah D2h 5Ah C3h 5Ah B4h 5Ah A5h would be written. Remark: It is possible to load data for other key formats into the EEPROM key storage location. However, it is not possible to validate card authentication with data which will cause the LoadKeyE2 command (see Section 11.7.1 on page 97) to fail. 9.2.3.2 Storage of keys in the EEPROM The CLRC632 reserves 384 bytes of memory in the EEPROM for the Crypto1 keys. No memory segmentation is used to mirror the 12-byte structure of key storage. Thus, every byte of the dedicated memory area can be the start of a key. Example: If the key loading cycle starts at the last byte address of an EEPROM block, (for example, key byte 0 is stored at 12Fh), the next bytes are stored in the next EEPROM block, for example, key byte 1 is stored at 130h, byte 2 at 131h up to byte 11 at 13Ah. Based on the 384 bytes of memory and a single key needing 12 bytes, then up to 32 different keys can be stored in the EEPROM. Remark: It is not possible to load a key exceeding the EEPROM byte location 1FFh. Fig 7. Key storage format 001aak640 Master key byte 0 (LSB) Master key bits EEPROM byte address Example k7 k6 k5 k4 k7 k6 k5 k4 n 5Ah k3 k2 k1 k0 k3 k2 k1 k0 n + 1 F0h 1 k7 k6 k5 k4 k7 k6 k5 k4 n + 2 5Ah k3 k2 k1 k0 k3 k2 k1 k0 n + 3 E1h 5 (MSB) k7 k6 k5 k4 k7 k6 k5 k4 n + 10 5Ah k3 k2 k1 k0 k3 k2 k1 k0 n + 11 A5hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 19 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.3 FIFO buffer An 8 64 bit FIFO buffer is used in the CLRC632 to act as a parallel-to-parallel converter. It buffers both the input and output data streams between the microprocessor and the internal circuitry of the CLRC632. This makes it possible to manage data streams up to 64 bytes long without needing to take timing constraints into account. 9.3.1 Accessing the FIFO buffer 9.3.1.1 Access rules The FIFO buffer input and output data bus is connected to the FIFOData register. Writing to this register stores one byte in the FIFO buffer and increments the FIFO buffer write pointer. Reading from this register shows the FIFO buffer contents stored at the FIFO buffer read pointer and increments the FIFO buffer read pointer. The distance between the write and read pointer can be obtained by reading the FIFOLength register. When the microprocessor starts a command, the CLRC632 can still access the FIFO buffer while the command is running. Only one FIFO buffer has been implemented which is used for input and output. Therefore, the microprocessor must ensure that there are no inadvertent FIFO buffer accesses. Table 18 gives an overview of FIFO buffer access during command processing. 9.3.2 Controlling the FIFO buffer In addition to writing to and reading from the FIFO buffer, the FIFO buffer pointers can be reset using the FlushFIFO bit. This changes the FIFOLength[6:0] value to zero, bit FIFOOvfl is cleared and the stored bytes are no longer accessible. This enables the FIFO buffer to be written with another 64 bytes of data. Table 18. FIFO buffer access Active command FIFO buffer Remark p Write p Read StartUp - - Idle - - Transmit yes - Receive - yes Transceive yes yes the microprocessor has to know the state of the command (transmitting or receiving) WriteE2 yes - ReadE2 yes yes the microprocessor has to prepare the arguments, afterwards only reading is allowed LoadKeyE2 yes - LoadKey yes - Authent1 yes - Authent2 - - LoadConfig yes - CalcCRC yes -CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 20 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.3.3 FIFO buffer status information The microprocessor can get the following FIFO buffer status data: • the number of bytes stored in the FIFO buffer: bits FIFOLength[6:0] • the FIFO buffer full warning: bit HiAlert • the FIFO buffer empty warning: bit LoAlert • the FIFO buffer overflow warning: bit FIFOOvfl. Remark: Setting the FlushFIFO bit clears the FIFOOvfl bit. The CLRC632 can generate an interrupt signal when: • bit LoAlertIRq is set to logic 1 and bit LoAlert = logic 1, pin IRQ is activated. • bit HiAlertIRq is set to logic 1 and bit HiAlert = logic 1, pin IRQ activated. The HiAlert flag bit is set to logic 1 only when the WaterLevel[5:0] bits or less can be stored in the FIFO buffer. The trigger is generated by Equation 1: (1) The LoAlert flag bit is set to logic 1 when the FIFOLevel register’s WaterLevel[5:0] bits or less are stored in the FIFO buffer. The trigger is generated by Equation 2: (2) 9.3.4 FIFO buffer registers and flags Table 18 shows the related FIFO buffer flags in alphabetic order. 9.4 Interrupt request system The CLRC632 indicates interrupt events by setting the PrimaryStatus register bit IRq (see Section 10.5.1.4 “PrimaryStatus register” on page 51) and activating pin IRQ. The signal on pin IRQ can be used to interrupt the microprocessor using its interrupt handling capabilities ensuring efficient microprocessor software. HiAlert 64 FIFOLength = – WaterLevel LoAlert FIFOLength WaterLevel = Table 19. Associated FIFO buffer registers and flags Flags Register name Bit Register address FIFOLength[6:0] FIFOLength 6 to 0 04h FIFOOvfl ErrorFlag 4 0Ah FlushFIFO Control 0 09h HiAlert PrimaryStatus 1 03h HiAlertIEn InterruptEn 1 06h HiAlertIRq InterruptRq 1 07h LoAlert PrimaryStatus 0 03h LoAlertIEn InterruptEn 0 06h LoAlertIRq InterruptRq 0 07h WaterLevel[5:0] FIFOLevel 5 to 0 29hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 21 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.4.1 Interrupt sources overview Table 20 shows the integrated interrupt flags, related source and setting condition. The interrupt TimerIRq flag bit indicates an interrupt set by the timer unit. Bit TimerIRq is set when the timer decrements from one down to zero (bit TAutoRestart disabled) or from one to the TReLoadValue[7:0] with bit TAutoRestart enabled. Bit TxIRq indicates interrupts from different sources and is set as follows: • the transmitter automatically sets the bit TxIRq interrupt when it is active and its state changes from sending data to transmitting the end of frame pattern • the CRC coprocessor sets the bit TxIRq after all data from the FIFO buffer has been processed indicated by bit CRCReady = logic 1 • when EEPROM programming is finished, the bit TxIRq is set and is indicated by bit E2Ready = logic 1 The RxIRq flag bit indicates an interrupt when the end of the received data is detected. The IdleIRq flag bit is set when a command finishes and the content of the Command register changes to Idle. When the FIFO buffer reaches the HIGH-level indicated by the WaterLevel[5:0] value (see Section 9.3.3 on page 20) and bit HiAlert = logic 1, then the HiAlertIRq flag bit is set to logic 1. When the FIFO buffer reaches the LOW-level indicated by the WaterLevel[5:0] value (see Section 9.3.3 on page 20) and bit LoAlert = logic 1, then LoAlertIRq flag bit is set to logic 1. 9.4.2 Interrupt request handling 9.4.2.1 Controlling interrupts and getting their status The CLRC632 informs the microprocessor about the interrupt request source by setting the relevant bit in the InterruptRq register. The relevance of each interrupt request bit as source for an interrupt can be masked by the InterruptEn register interrupt enable bits. Table 20. Interrupt sources Interrupt flag Interrupt source Trigger action TimerIRq timer unit timer counts from 1 to 0 TxIRq transmitter a data stream, transmitted to the card, ends CRC coprocessor all data from the FIFO buffer has been processed EEPROM all data from the FIFO buffer has been programmed RxIRq receiver a data stream, received from the card, ends IdleIRq Command register command execution finishes HiAlertIRq FIFO buffer FIFO buffer is full LoAlertIRq FIFO buffer FIFO buffer is empty Table 21. Interrupt control registers Register Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 InterruptEn SetIEn reserved TimerIEn TxIEn RxIEn IdleIEn HiAlertIEn LoAlertIEn InterruptRq SetIRq reserved TimerIRq TxIRq RxIRq IdleIRq HiAlertIRq LoAlertIRqCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 22 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution If any interrupt request flag is set to logic 1 (showing that an interrupt request is pending) and the corresponding interrupt enable flag is set, the PrimaryStatus register IRq flag bit is set to logic 1. Different interrupt sources can activate simultaneously because all interrupt request bits are OR’ed, coupled to the IRq flag and then forwarded to pin IRQ. 9.4.2.2 Accessing the interrupt registers The interrupt request bits are automatically set by the CLRC632’s internal state machines. In addition, the microprocessor can also set or clear the interrupt request bits as required. A special implementation of the InterruptRq and InterruptEn registers enables changing an individual bit status without influencing any other bits. If an interrupt register is set to logic 1, bit SetIxx and the specific bit must both be set to logic 1 at the same time. Vice versa, if a specific interrupt flag is cleared, zero must be written to the SetIxx and the interrupt register address must be set to logic 1 at the same time. If a content bit is not changed during the setting or clearing phase, zero must be written to the specific bit location. Example: Writing 3Fh to the InterruptRq register clears all bits. SetIRq is set to logic 0 while all other bits are set to logic 1. Writing 81h to the InterruptRq register sets LoAlertIRq to logic 1 and leaves all other bits unchanged. 9.4.3 Configuration of pin IRQ The logic level of the IRq flag bit is visible on pin IRQ. The signal on pin IRQ can also be controlled using the following IRQPinConfig register bits. • bit IRQInv: the signal on pin IRQ is equal to the logic level of bit IRq when this bit is set to logic 0. When set to logic 1, the signal on pin IRQ is inverted with respect to bit IRq. • bit IRQPushPull: when set to logic 1, pin IRQ has CMOS output characteristics. When it is set to logic 0, it is an open-drain output which requires an external resistor to achieve a HIGH-level at pin IRQ. Remark: During the reset phase (see Section 9.7.2 on page 29) bit IRQInv is set to logic 1 and bit IRQPushPull is set to logic 0. This results in a high-impedance on pin IRQ.CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 23 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.4.4 Register overview interrupt request system Table 22 shows the related interrupt request system flags in alphabetic order. 9.5 Timer unit The timer derives its clock from the 13.56 MHz on-board chip clock. The microprocessor can use this timer to manage timing-relevant tasks. The timer unit may be used in one of the following configurations: • Timeout counter • WatchDog counter • Stopwatch • Programmable one shot • Periodical trigger The timer unit can be used to measure the time interval between two events or to indicate that a specific timed event occurred. The timer is triggered by events but does not influence any event (e.g. a time-out during data receiving does not automatically influence the receiving process). Several timer related flags can be set and these flags can be used to generate an interrupt. Table 22. Associated Interrupt request system registers and flags Flags Register name Bit Register address HiAlertIEn InterruptEn 1 06h HiAlertIRq InterruptRq 1 07h IdleIEn InterruptEn 2 06h IdleIRq InterruptRq 2 07h IRq PrimaryStatus 3 03h IRQInv IRQPinConfig 1 07h IRQPushPull IRQPinConfig 0 07h LoAlertIEn InterruptEn 0 06h LoAlertIRq InterruptRq 0 07h RxIEn InterruptEn 3 06h RxIRq InterruptRq 3 07h SetIEn InterruptEn 7 06h SetIRq InterruptRq 7 07h TimerIEn InterruptEn 5 06h TimerIRq InterruptRq 5 07h TxIEn InterruptEn 4 06h TxIRq InterruptRq 4 07hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 24 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.5.1 Timer unit implementation 9.5.1.1 Timer unit block diagram Figure 8 shows the block diagram of the timer module. The timer unit is designed, so that events when combined with enabling flags start or stop the counter. For example, setting bit TStartTxBegin = logic 1 enables control of received data with the timer unit. In addition, the first received bit is indicated by the TxBegin event. This combination starts the counter at the defined TReloadValue[7:0]. The timer stops automatically when the counter value is equal to zero or if a defined stop event happens. 9.5.1.2 Controlling the timer unit The main part of the timer unit is a down-counter. As long as the down-counter value is not zero, it decrements its value with each timer clock cycle. If the TAutoRestart flag is enabled, the timer does not decrement down to zero. On reaching value 1, the timer reloads the next clock function with the TReloadValue[7:0]. Fig 8. Timer module block diagram 001aak611 TxEnd Event TAutoRestart TRunning TStartTxEnd TStartNow S RQ START COUNTER/ PARALLEL LOAD STOP COUNTER TPreScaler[4:0] TimerValue[7:0] Counter = 0 ? to interrupt logic: TimerIRq PARALLEL OUT PARALLEL IN TReloadValue[7:0] CLOCK DIVIDER COUNTER MODULE (x ≤ x − 1) TStopNow TxBegin Event TStartTxBegin TStopRxEnd RxEnd Event TStopRxBegin 13.56 MHz to parallel interface RxBegin Event QCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 25 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution The timer is started immediately by loading a value from the TimerReload register into the counter module. This is activated by one of the following events: • transmission of the first bit to the card (TxBegin event) with bit TStartTxBegin = logic 1 • transmission of the last bit to the card (TxEnd event) with bit TStartTxEnd = logic 1 • bit TStartNow is set to logic 1 by the microprocessor Remark: Every start event reloads the timer from the TimerReload register. Thus, the timer unit is re-triggered. The timer can be configured to stop on one of the following events: • receipt of the first valid bit from the card (RxBegin event) with bit TStopRxBegin = logic 1 • receipt of the last bit from the card (RxEnd event) with bit TStopRxEnd = logic 1 • the counter module has decremented down to zero and bit TAutoRestart = logic 0 • bit TStopNow is set to logic 1 by the microprocessor. Loading a new value, e.g. zero, into the TimerReload register or changing the timer unit while it is counting will not immediately influence the counter. In both cases, this is because this register only affects the counter content after a start event. If the counter is stopped when bit TStopNow is set, no TimerIRq is flagged. 9.5.1.3 Timer unit clock and period The timer unit clock is derived from the 13.56 MHz on-board chip clock using the programmable divider. Clock selection is made using the TimerClock register TPreScaler[4:0] bits based on Equation 3: (3) The values for the TPreScaler[4:0] bits are between 0 and 21 which results in a minimum periodic time (TTimerClock) of between 74 ns and 150 ms. The time period elapsed since the last start event is calculated using Equation 4: (4) This results in a minimum time period (tTimer) of between 74 ns and 40 s. 9.5.1.4 Timer unit status The SecondaryStatus register’s TRunning bit shows the timer’s status. Configured start events start the timer at the TReloadValue[7:0] and changes the status flag TRunning to logic 1. Conversely, configured stop events stop the timer and sets the TRunning status flag to logic 0. As long as status flag TRunning is set to logic 1, the TimerValue register changes on the next timer unit clock cycle. The TimerValue[7:0] bits can be read directly from the TimerValue register. fTimerClock 1 TTimerClock --------------------------- 2 TPreScaler 13.56 = = -------------------------- MHz tTimer TReLoadValue TimerValue – fTimerClock = ----------------------------------------------------------------------------- sCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 26 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.5.1.5 TimeSlotPeriod When sending I-CODE1 Quit frames, it is necessary to generate the exact chronological relationship to the start of the command frame. If at the end of command execution TimeSlotPeriod > 0, the TimeSlotPeriod starts. If the FIFO buffer contains data when the end of TimeSlotPeriod is reached, the data is sent. If the FIFO buffer is empty nothing happens. As long as the TimeSlotPeriod is > 0, the TimeSlotPeriod counter automatically starts on reaching the end. This forms the exact time relationship between the start and finish of the command frame used to generate and send I-CODE1 Quit frames. When the TimeSlotPeriod > 0, the next Frame starts with exactly the same interval TimeSlotPeriod/CoderRate delayed after each previous send frame. CoderRate defines the clock frequency of the encoder. If TimeSlotPeriod[7:0] = 0, the send function is not automatically triggered. The content of the TimeSlotPeriod register can be changed while it is running but the change is only effective after the next TimeSlotPeriod restart. Example: • CoderRate = 0 0.5 (~52.97 kHz) • The interval should be 8.458 ms for I-CODE1 standard mode Remark: The TimeSlotPeriodMSB bit is contained in the MFOUTSelect register. Remark: Set bit TxCRCEn to logic 0 before the Quit frame is sent. If TxCRCEn is not set to logic 0, the Quit frame is sent with a calculated CRC value. Use the CRC8 algorithm to calculate the Quit value. Fig 9. TimeSlotPeriod Table 23. TimeSlotPeriod I-CODE1 mode TimeSlotPeriod for TSP1 TimeSlotPeriod for TSP2 standard mode BFh 1BFh fast mode 5Fh 67h TimeSlotPeriod CoderRate Interval = = 52.97 kHz 8.458 ms – 1 447 1BFh = = 001aak612 COMMAND RESPONSE1 RESPONSE2 TSP1 TSP2 QUIT1 QUIT2CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 27 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.5.2 Using the timer unit functions 9.5.2.1 Time-out and WatchDog counters After starting the timer using TReloadValue[7:0], the timer unit decrements the TimerValue register beginning with a given start event. If a given stop event occurs, such as a bit being received from the card, the timer unit stops without generating an interrupt. If a stop event does not occur, such as the card not answering within the expected time, the timer unit decrements down to zero and generates a timer interrupt request. This signals to the microprocessor the expected event has not occurred within the given time (tTimer). 9.5.2.2 Stopwatch The time (tTimer) between a start and stop event is measured by the microprocessor using the timer unit. Setting the TReloadValue register triggers the timer which in turn, starts to decrement. If the defined stop event occurs, the timer stops. The time between start and stop is calculated by the microprocessor using Equation 5, when the timer does not decrement down to zero. (5) 9.5.2.3 Programmable one shot timer and periodic trigger Programmable one shot timer: The microprocessor starts the timer unit and waits for the timer interrupt. The interrupt occurs after the time specified by tTimer. Periodic trigger: If the microprocessor sets the TAutoRestart bit, it generates an interrupt request after every tTimer cycle. 9.5.3 Timer unit registers Table 24 shows the related flags of the timer unit in alphabetical order. t TReLoadvalue – TimerValue tTimer = Table 24. Associated timer unit registers and flags Flags Register name Bit Register address TAutoRestart TimerClock 5 2Ah TimerValue[7:0] TimerValue 7 to 0 0Ch TReloadValue[7:0] TimerReload 7 to 0 2Ch TPreScaler[4:0] TimerClock 4 to 0 2Ah TRunning SecondaryStatus 7 05h TStartNow Control 1 09h TStartTxBegin TimerControl 0 2Bh TStartTxEnd TimerControl 1 2Bh TStopNow Control 2 09h TStopRxBegin TimerControl 2 2Bh TStopRxEnd TimerControl 3 2BhCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 28 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.6 Power reduction modes 9.6.1 Hard power-down Hard power-down is enabled when pin RSTPD is HIGH. This turns off all internal current sinks including the oscillator. All digital input buffers are separated from the input pads and defined internally (except pin RSTPD itself). The output pins are frozen at a given value. The status of all pins during a hard power-down is shown in Table 25. 9.6.2 Soft power-down mode Soft power-down mode is entered immediately using the Control register bit PowerDown. All internal current sinks, including the oscillator buffer, are switched off. The digital input buffers are not separated from the input pads and keep their functionality. In addition, the digital output pins do not change their state. After resetting the Control register bit PowerDown, the bit indicating Soft power-down mode is only cleared after 512 clock cycles. Resetting it does not immediately clear it. The PowerDown bit is automatically cleared when the Soft power-down mode is exited. Remark: When the internal oscillator is used, time (tosc) is required for the oscillator to become stable. This is because the internal oscillator is supplied by VDDA and any clock cycles will not be detected by the internal logic until VDDA is stable. Table 25. Signal on pins during Hard power-down Symbol Pin Type Description OSCIN 1 I not separated from input, pulled to AVSS IRQ 2 O high-impedance MFIN 3 I separated from input MFOUT 4 O LOW TX1 5 O HIGH, if bit TX1RFEn = logic 1 LOW, if bit TX1RFEn = logic 0 TX2 7 O HIGH, only if bit TX2RFEn = logic 1 and bit TX2Inv = logic 0 otherwise LOW NCS 9 I separated from input NWR 10 I separated from input NRD 11 I separated from input D0 to D7 13 to 20 I/O separated from input ALE 21 I separated from input A0 22 I/O separated from input A1 23 I separated from input A2 24 I separated from input AUX 27 O high-impedance RX 29 I not changed VMID 30 A pulled to VDDA RSTPD 31 I not changed OSCOUT 32 O HIGHCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 29 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.6.3 Standby mode The Standby mode is immediately entered when the Control register StandBy bit is set. All internal current sinks, including the internal digital clock buffer are switched off. However, the oscillator buffer is not switched off. The digital input buffers are not separated by the input pads, keeping their functionality and the digital output pins do not change their state. In addition, the oscillator does not need time to wake-up. After resetting the Control register StandBy bit, it takes four clock cycles on pin OSCIN for Standby mode to exit. Resetting bit StandBy does not immediately clear it. It is automatically cleared when the Standby mode is exited. 9.6.4 Automatic receiver power-down It is a power saving feature to switch off the receiver circuit when it is not needed. Setting bit RxAutoPD = logic 1, automatically powers down the receiver when it is not in use. Setting bit RxAutoPD = logic 0, keeps the receiver continuously powered up. 9.7 StartUp phase The events executed during the StartUp phase are shown in Figure 10. 9.7.1 Hard power-down phase The hard power-down phase is active during the following cases: • a Power-On Reset (POR) caused by power-up on pins DVDD or AVDD activated when VDDD or VDDA is below the digital reset threshold. • a HIGH-level on pin RSTPD which is active while pin RSTPD is HIGH. The HIGH level period on pin RSTPD must be at least 100 s (tPD 100 s). Shorter phases will not necessarily result in the reset phase (treset). The rising or falling edge slew rate on pin RSTPD is not critical because pin RSTPD is a Schmitt trigger input. 9.7.2 Reset phase The reset phase automatically follows the Hard power-down. Once the oscillator is running stably, the reset phase takes 512 clock cycles. During the reset phase, some register bits are preset by hardware. The respective reset values are given in the description of each register (see Section 10.5 on page 50). Remark: When the internal oscillator is used, time (tosc) is required for the oscillator to become stable. This is because the internal oscillator is supplied by VDDA and any clock cycles will not be detected by the internal logic until VDDA is stable. Fig 10. The StartUp procedure 001aak613 StartUp phase states tRSTPD treset tinit Hard powerdown phase Reset phase Initialising phase readyCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 30 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.7.3 Initialization phase The initialization phase automatically follows the reset phase and takes 128 clock cycles. During the initializing phase the content of the EEPROM blocks 1 and 2 is copied into the register subaddresses 10h to 2Fh (see Section 9.2.2 on page 13). Remark: During the production test, the CLRC632 is initialized with default configuration values. This reduces the microprocessor’s configuration time to a minimum. 9.7.4 Initializing the parallel interface type A different initialization sequence is used for each microprocessor. This enables detection of the correct microprocessor interface type and synchronization of the microprocessor’s and the CLRC632’s start-up. See Section 9.1.3 on page 8 for detailed information on the different connections for each microprocessor interface type. During StartUp phase, the command value is set to 3Fh once the oscillator attains clock frequency stability at an amplitude of > 90 % of the nominal 13.56 MHz clock frequency. At the end of the initialization phase, the CLRC632 automatically switches to idle and the command value changes to 00h. To ensure correct detection of the microprocessor interface, the following sequence is executed: • the Command register is read until the 6-bit register value is 00h. On reading the 00h value, the internal initialization phase is complete and the CLRC632 is ready to be controlled • write 80h to the Page register to initialize the microprocessor interface • read the Command register. If it returns a value of 00h, the microprocessor interface was successfully initialized • write 00h to the Page registers to activate linear addressing mode. 9.8 Oscillator circuit The clock applied to the CLRC632 acts as a time basis for the synchronous system encoder and decoder. The stability of the clock frequency is an important factor for correct operation. To obtain highest performance, clock jitter must be as small as possible. This is best achieved by using the internal oscillator buffer with the recommended circuitry. Fig 11. Quartz clock connection 001aak614 13.56 MHz 15 pF 15 pF OSCOUT OSCIN DEVICECLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 31 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution If an external clock source is used, the clock signal must be applied to pin OSCIN. In this case, be very careful in optimizing clock duty cycle and clock jitter. Ensure the clock quality has been verified. It must meet the specifications described in Section 13.4.5 on page 106. Remark: We do not recommend using an external clock source. 9.9 Transmitter pins TX1 and TX2 The signal on pins TX1 and TX2 is the 13.56 MHz energy carrier modulated by an envelope signal. It can be used to drive an antenna directly, using minimal passive components for matching and filtering (see Section 15.1 on page 107). To enable this, the output circuitry is designed with a very low-impedance source resistance. The TxControl register is used to control the TX1 and TX2 signals. 9.9.1 Configuring pins TX1 and TX2 TX1 pin configurations are described in Table 26. TX2 pin configurations are described in Table 27. Table 26. Pin TX1 configurations TxControl register configuration Envelope TX1 signal TX1RFEn FORCE100ASK 0 X X LOW (GND) 1 0 0 13.56 MHz carrier frequency modulated 1 0 1 13.56 MHz carrier frequency 1 1 0 LOW 1 1 1 13.56 MHz energy carrierCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 32 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.9.2 Antenna operating distance versus power consumption Using different antenna matching circuits (by varying the supply voltage on the antenna driver supply pin TVDD), it is possible to find the trade-off between maximum effective operating distance and power consumption. Different antenna matching circuits are described in the Application note “MIFARE Design of MFRC500 Matching Circuit and Antennas”. 9.9.3 Antenna driver output source resistance The output source conductance of pins TX1 and TX2 can be adjusted between 1 and 100 using the CwConductance register GsCfgCW[5:0] bits. The output source conductance of pins TX1 and TX2 during the modulation phase can be adjusted between 1 and 100 using the ModConductance register GsCfgMod[5:0] bits. The values are relative to the reference resistance (RS(ref)) which is measured during the production test and stored in the CLRC632 EEPROM. It can be read from the product information field (see Section 9.2.1 on page 13). The electrical specification can be found in Section 13.3.3 on page 101. Table 27. Pin TX2 configurations TxControl register configuration Envelope TX2 signal TX2RFEn FORCE100ASK TX2CW TX2Inv 0 X X X X LOW 1 0 0 0 0 13.56 MHz carrier frequency modulated 1 0 0 0 1 13.56 MHz carrier frequency 1 0 0 1 0 13.56 MHz carrier frequency modulated, 180 phase-shift relative to TX1 1 0 0 1 1 13.56 MHz carrier frequency, 180 phase-shift relative to TX1 1 0 1 0 X 13.56 MHz carrier frequency 1 0 1 1 X 13.56 MHz carrier frequency, 180 phase-shift relative to TX1 1 1 0 0 0 LOW 1 1 0 0 1 13.56 MHz carrier frequency 1 1 0 1 0 HIGH 1 1 0 1 1 13.56 MHz carrier frequency, 180 phase-shift relative to TX1 1 1 1 0 X 13.56 MHz carrier frequency 1 1 1 1 X 13.56 MHz carrier frequency, 180 phase-shift relative to TX1CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 33 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.9.3.1 Source resistance table Table 28. TX1 and TX2 source resistance of n-channel driver transistor against GsCfgCW or GsCfgMod MANT = Mantissa; EXP= Exponent. GsCfgCW, GsCfgMod (decimal) EXPGsCfgCW, EXPGsCfgMod (decimal) MANTGsCfgCW, MANTGsCfgMod (decimal) RS(ref) () GsCfgCW, GsCfgMod (decimal) EXPGsCfgCW, EXPGsCfgMod (decimal) MANTGsCfgCW, MANTGsCfgMod (decimal) RS(ref) () 0 0 0 - 24 1 8 0.0652 16 1 0 - 25 1 9 0.0580 32 2 0 - 37 2 5 0.0541 48 3 0 - 26 1 10 0.0522 1 0 1 1.0000 27 1 11 0.0474 17 1 1 0.5217 51 3 3 0.0467 2 0 2 0.5000 38 2 6 0.0450 3 0 3 0.3333 28 1 12 0.0435 33 2 1 0.2703 29 1 13 0.0401 18 1 2 0.2609 39 2 7 0.0386 4 0 4 0.2500 30 1 14 0.0373 5 0 5 0.2000 52 3 4 0.0350 19 1 3 0.1739 31 1 15 0.0348 6 0 6 0.1667 40 2 8 0.0338 7 0 7 0.1429 41 2 9 0.0300 49 3 1 0.1402 53 3 5 0.0280 34 2 2 0.1351 42 2 10 0.0270 20 1 4 0.1304 43 2 11 0.0246 8 0 8 0.1250 54 3 6 0.0234 9 0 9 0.1111 44 2 12 0.0225 21 1 5 0.1043 45 2 13 0.0208 10 0 10 0.1000 55 3 7 0.0200 11 0 11 0.0909 46 2 14 0.0193 35 2 3 0.0901 47 2 15 0.0180 22 1 6 0.0870 56 3 8 0.0175 12 0 12 0.0833 57 3 9 0.0156 13 0 13 0.0769 58 3 10 0.0140 23 1 7 0.0745 59 3 11 0.0127 14 0 14 0.0714 60 3 12 0.0117 50 3 2 0.0701 61 3 13 0.0108 36 2 4 0.0676 62 3 14 0.0100 15 0 15 0.0667 63 3 15 0.0093CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 34 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.9.3.2 Calculating the relative source resistance The reference source resistance RS(ref) can be calculated using Equation 6. (6) The reference source resistance (RS(ref)) during the modulation phase can be calculated using ModConductance register’s GsCfgMod[5:0]. 9.9.3.3 Calculating the effective source resistance Wiring resistance (RS(wire)): Wiring and bonding add a constant offset to the driver resistance that is relevant when pins TX1 and TX2 are switched to low-impedance. The additional resistance for pin TX1 (RS(wire)TX1) can be set approximately as shown in Equation 7. (7) Effective resistance (RSx): The source resistances of the driver transistors (RsMaxP byte) read from the Product Information Field (see Section 9.2.1 on page 13) are measured during the production test with CwConductance register’s GsCfgCW[5:0] = 01h. To calculate the driver resistance for a specific value set in GsCfgMod[5:0], use Equation 8. (8) 9.9.4 Pulse width The envelope carries the data signal information that is transmitted to the card. It is an encoded data signal based on the Miller code. In addition, each pause of the Miller encoded signal is again encoded as a pulse of a fixed width. The width of the pulse is adjusted using the ModWidth register. The pulse width (tw) is calculated using Equation 9 where the frequency constant (fclk) = 13.56 MHz. (9) 9.10 Receiver circuitry The CLRC632 uses an integrated quadrature demodulation circuit enabling it to detect an ISO/IEC 14443 A or ISO/IEC 14443 B compliant subcarrier signal on pin RX. • ISO/IEC 14443 A subcarrier signal: defined as a Manchester coded ASK modulated signal • ISO/IEC 14443 B subcarrier signal: defined as an NRZ-L coded BPSK modulated ISO/IEC 14443 B subcarrier signal RS ref 1 MANTGsCfgCW 77 40 ----- EXPGsCfgCW = -------------------------------------------------------------------------------- RS wire TX1 500 m RSx RS ref maxP RS wire TX1 – RS rel RS wire TX1 = + tw 2ModWidth 1 + fc = -------------------------------------CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 35 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution The quadrature demodulator uses two different clocks (Q-clock and I-clock) with a phase-shift of 90 between them. Both resulting subcarrier signals are amplified, filtered and forwarded to the correlation circuitry. The correlation results are evaluated, digitized and then passed to the digital circuitry. Various adjustments can be made to obtain optimum performance for all processing units. 9.10.1 Receiver circuit block diagram Figure 12 shows the block diagram of the receiver circuit. The receiving process can be broken down in to several steps. Quadrature demodulation of the 13.56 MHz carrier signal is performed. To achieve the optimum performance, automatic Q-clock calibration is recommended (see Section 9.10.2.1 on page 35). The demodulated signal is amplified by an adjustable amplifier. A correlation circuit calculates the degree of similarity between the expected and the received signal. The BitPhase register enables correlation interval position alignment with the received signal’s bit grid. In the evaluation and digitizer circuitry, the valid bits are detected and the digital results are sent to the FIFO buffer. Several tuning steps are possible for this circuit. The signal can be observed on its way through the receiver as shown in Figure 12. One signal at a time can be routed to pin AUX using the TestAnaSelect register as described in Section 15.2.2 on page 112. 9.10.2 Receiver operation In general, the default settings programmed in the StartUp initialization file are suitable for use with the CLRC632 to MIFARE card data communication. However, in some environments specific user settings will achieve better performance. 9.10.2.1 Automatic Q-clock calibration The quadrature demodulation concept of the receiver generates a phase signal (I-clock) and a 90 phase-shifted quadrature signal (Q-clock). To achieve the optimum demodulator performance, the Q-clock and the I-clock must be phase-shifted by 90. After the reset phase, a calibration procedure is automatically performed. Fig 12. Receiver circuit block diagram 001aak615 ClkQDelay[4:0] ClkQCalib ClkQ180Deg BitPhase[7:0] CORRELATION CIRCUITRY EVALUATION AND DIGITIZER CIRCUITRY MinLevel[3:0] CollLevel[3:0] RxWait[7:0] RcvClkSell s_valid s_data s_coll s_clock Gain[1:0] to TestAnaOutSel clock I TO Q CONVERSION I-clock Q-clock 13.56 MHz DEMODULATOR RX VCorrDI VCorrNI VCorrDQ VCorrNQ VEvalR VEvalL VRxFollQ VRxFollI VRxAmpI VRxAmpQCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 36 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Automatic calibration can be set-up to execute at the end of each Transceive command if bit ClkQCalib = logic 0. Setting bit ClkQCalib = logic 1 disables all automatic calibrations except after the reset sequence. Automatic calibration can also be triggered by the software when bit ClkQCalib has a logic 0 to logic 1 transition. Remark: The duration of the automatic Q-clock calibration is 65 oscillator periods or approximately 4.8 s. The ClockQControl register’s ClkQDelay[4:0] value is proportional to the phase-shift between the Q-clock and the I-clock. The ClkQ180Deg status flag bit is set when the phase-shift between the Q-clock and the I-clock is greater than 180. Remark: • The StartUp configuration file enables automatic Q-clock calibration after a reset • If bit ClkQCalib = logic 1, automatic calibration is not performed. Leaving this bit set to logic 1 can be used to permanently disable automatic calibration. • It is possible to write data to the ClkQDelay[4:0] bits using the microprocessor. The aim could be to disable automatic calibration and set the delay using the software. Configuring the delay value using the software requires bit ClkQCalib to have been previously set to logic 1 and a time interval of at least 4.8 s has elapsed. Each delay value must be written with bit ClkQCalib set to logic 1. If bit ClkQCalib is logic 0, the configured delay value is overwritten by the next automatic calibration interval. 9.10.2.2 Amplifier The demodulated signal must be amplified by the variable amplifier to achieve the best performance. The gain of the amplifiers can be adjusted using the RxControl1 register Gain[1:0] bits; see Table 29. Fig 13. Automatic Q-clock calibration 001aak616 calibration impulse from reset sequence a rising edge initiates Q-clock calibration ClkQCalib bit calibration impulse from end of Transceive command Table 29. Gain factors for the internal amplifier See Table 86 “RxControl1 register bit descriptions” on page 64 for additional information. Register setting Gain factor [dB] (simulation results) 00 20 01 24 10 31 11 35CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 37 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.10.2.3 Correlation circuitry The correlation circuitry calculates the degree of matching between the received and an expected signal. The output is a measure of the amplitude of the expected signal in the received signal. This is done for both, the Q and I-channels. The correlator provides two outputs for each of the two input channels, resulting in a total of four output signals. The correlation circuitry needs the phase information for the incoming card signal for optimum performance. This information is defined for the microprocessor using the BitPhase register. This value defines the phase relationship between the transmitter and receiver clock in multiples of the BitPhase time (tBitPhase) = 1 / 13.56 MHz. 9.10.2.4 Evaluation and digitizer circuitry The correlation results are evaluated for each bit-half of the Manchester coded signal. The evaluation and digitizer circuit decides from the signal strengths of both bit-halves, if the current bit is valid • If the bit is valid, its value is identified • If the bit is not valid, it is checked to identify if it contains a bit-collision Select the following levels for optimal using RxThreshold register bits: • MinLevel[3:0]: defines the minimum signal strength of the stronger bit-halve’s signal which is considered valid. • CollLevel[3:0]: defines the minimum signal strength relative to the amplitude of the stronger half-bit that has to be exceeded by the weaker half-bit of the Manchester coded signal to generate a bit-collision. If the signal’s strength is below this value, logic 1 and logic 0 can be determined unequivocally. After data transmission, the card is not allowed to send its response before a preset time period which is called the frame guard time in the ISO/IEC 14443 standard. The length of this time period is set using the RxWait register’s RxWait[7:0] bits. The RxWait register defines when the receiver is switched on after data transmission to the card in multiples of one bit duration. If bit RcvClkSelI is set to logic 1, the I-clock is used to clock the correlator and evaluation circuits. If bit RcvClkSelI is set to logic 0, the Q-clock is used. Remark: It is recommended to use the Q-clock. 9.11 Serial signal switch The CLRC632 comprises two main blocks: • digital circuitry: comprising the state machines, encoder and decoder logic etc. • analog circuitry: comprising the modulator, antenna drivers, receiver and amplification circuitry The interface between these two blocks can be configured so that the interface signals are routed to pins MFIN and MFOUT. This makes it possible to connect the analog part of one CLRC632 to the digital part of another device. The serial signal switch can be used to measure MIFARE and ISO/IEC 14443 A as well as related I-CODE1 and ISO/IEC 15693 signals.CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 38 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Remark: Pin MFIN can only be accessed at 106 kBd based on ISO/IEC 14443 A. The Manchester signal and the Manchester signal with subcarrier can only be accessed on pin MFOUT at 106 kBd based on ISO/IEC 14443 A. 9.11.1 Serial signal switch block diagram Figure 14 shows the serial signal switches. Three different switches are implemented in the serial signal switch enabling the CLRC632 to be used in different configurations. The serial signal switch can also be used to check the transmitted and received data during the design-in phase or for test purposes. Section 15.2.1 on page 110 describes the analog test signals and measurements at the serial signal switch. Remark: The SLR400 uses pin name SIGOUT for pin MFOUT. The CLRC632 functionality includes the test modes for the SLRC400 using pin MFOUT. Section 9.11.2, Section 9.11.2.1 and Section 9.11.2.2 describe the relevant registers and settings used to configure and control the serial signal switch. 9.11.2 Serial signal switch registers The RxControl2 register DecoderSource[1:0] bits define the input signal for the internal Manchester decoder and are described in Table 30. Fig 14. Serial signal switch block diagram 3 MFIN MFOUT 001aak617 MODULATOR DRIVER (part of) analog circuitry SUBCARRIER DEMODULATOR TX1 TX2 RX CARRIER DEMODULATOR 2 MILLER CODER 1 OUT OF 256 NRZ OR 1 OUT OF 4 MANCHESTER DECODER SERIAL SIGNAL SWITCH (part of) serial data processing Decoder Source[1:0] 2 Modulator Source[1:0] SUBCARRIER DEMODULATOR serial data out 0 0 1 internal 2 Manchester with subcarrier 3 0 1 2 3 4 5 6 0 1 envelope MFIN 0 1 2 3 Manchester Manchester out serial data in 7 0 0 1 1 envelope transmit NRZ Manchester with subcarrier Manchester reserved reserved MFOUTSelect[2:0] digital test signal signal to MFOUTCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 39 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution The TxControl register ModulatorSource[1:0] bits define the signal used to modulate the transmitted 13.56 MHz energy carrier. The modulated signal drives pins TX1 and TX2. The MFOUTSelect register MFOUTSelect[2:0] bits select the output signal which is to be routed to pin MFOUT. To use the MFOUTSelect[2:0] bits, the TestDigiSelect register SignalToMFOUT bit must be logic 0. 9.11.2.1 Active antenna concept The CLRC632 analog and digital circuitry is accessed using pins MFIN and MFOUT. Table 33 lists the required settings. Table 30. DecoderSource[1:0] values See Table 96 on page 67 for additional information. Number DecoderSource [1:0] Input signal to decoder 0 00 constant 0 1 01 output of the analog part. This is the default configuration 2 10 direct connection to pin MFIN; expects an 847.5 kHz subcarrier signal modulated by a Manchester encoded signal 3 11 direct connection to pin MFIN; expects a Manchester encoded signal Table 31. ModulatorSource[1:0] values See Table 96 on page 67 for additional information. Number ModulatorSource [1:0] Input signal to modulator 0 00 constant 0 (energy carrier off on pins TX1 and TX2) 1 01 constant 1 (continuous energy carrier on pins TX1 and TX2) 2 10 modulation signal (envelope) from the internal encoder. This is the default configuration. 3 11 direct connection to MFIN; expects a Miller pulse coded signal Table 32. MFOUTSelect[2:0] values See Table 110 on page 70 for additional information. Number MFOUTSelect [2:0] Signal routed to pin MFOUT 0 000 constant LOW 1 001 constant HIGH 2 010 modulation signal (envelope) from the internal encoder 3 011 serial data stream to be transmitted; the same as for MFOUTSelect[2:0] = 001 but not encoded by the selected pulse encoder 4 100 output signal of the receiver circuit; card modulation signal regenerated and delayed 5 101 output signal of the subcarrier demodulator; Manchester coded card signal 6 110 reserved 7 111 reservedCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 40 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution [1] The number column refers to the value in the number column of Table 30, Table 31 and Table 32. Two CLRC632 devices configured as described in Table 33 can be connected to each other using pins MFOUT and MFIN. Remark: The active antenna concept can only be used at 106 kBd based on ISO/IEC 14443 A. 9.11.2.2 Driving both RF parts It is possible to connect both passive and active antennas to a single IC. The passive antenna pins TX1, TX2 and RX are connected using the appropriate filter and matching circuit. At the same time an active antenna is connected to pins MFOUT and MFIN. In this configuration, two RF parts can be driven, one after another, by one microprocessor. 9.12 MIFARE higher baud rates The MIFARE system is specified with a fixed baud rate of 106 kBd for communication on the RF interface. The current version of ISO/IEC 14443 A also defines 106 kBd for the initial phase of a communication between Proximity Integrated Circuit Cards (PICC) and Proximity Coupling Devices (PCD). To cover requirements of large data transmissions and to speed up terminal to card communication, the CLRC632 supports communication at MIFARE higher baud rates in combination with a microcontroller IC such as the MIFARE ProX. The MIFARE higher baud rates concept is described in the application note: MIFARE Implementation of Higher Baud rates Ref. 5. This application covers the integration of the MIFARE higher baud rates communication concept in current applications. Table 33. Register settings to enable use of the analog circuitry Register Number[1] Signal CLRC632 pin Analog circuitry settings ModulatorSource 3 Miller pulse encoded MFIN MFOUTSelect 4 Manchester encoded with subcarrier MFOUT DecoderSource X - - Digital circuitry settings ModulatorSource X - - MFOUTSelect 2 Miller pulse encoded MFOUT DecoderSource 2 Manchester encoded with subcarrier MFIN Table 34. MIFARE higher baud rates Communication direction Baud rates (kBd) CLRC632 based PCD microcontroller PICC supporting higher baud rates 106, 212, 424 Microcontroller PICC supporting higher baud rates CLRC632 based PCD 106, 212, 424CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 41 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.13 ISO/IEC 14443 B communication scheme The international standard ISO/IEC 14443 covers two communication schemes; ISO/IEC 14443 A and ISO/IEC 14443 B. The CLRC632 reader IC fully supports both ISO/IEC 14443 variants. Table 35 describes the registers and flags covered by the ISO/IEC 14443 B communication protocol. As reference documentation, the international standard ISO/IEC 14443 Identification cards - Contactless integrated circuit(s) cards - Proximity cards, part 1-4 (Ref. 4) can be used. Remark: NXP Semiconductors does not offer a basic function library to design-in the ISO/IEC 14443 B protocol. Table 35. ISO/IEC 14443 B registers and flags Flag Register Bit Register address CharSpacing[2:0] TypeBFraming 4 to 2 17h CoderRate[2:0] CoderControl 5 to 3 14h EOFWidth TypeBFraming 5 17h FilterAmpDet BPSKDemControl 4 1Dh Force100ASK TxControl 4 11h GsCfgCW[5:0] CwConductance 5 to 0 12h GsCfgMod[5:0] ModConductance 5 to 0 13h MinLevel[3:0] RxThreshold 7 to 4 1Ch NoTxEOF TypeBFraming 6 17h NoTxSOF TypeBFraming 7 17h NoRxEGT BPSKDemControl 6 1Dh NoRxEOF BPSKDemControl 5 1Dh NoRxSOF BPSKDemControl 7 1Dh RxCoding DecoderControl 0 1Ah RxFraming[1:0] DecoderControl 4 to 3 1Ah SOFWidth[1:0] TypeBFraming 1 to 0 17h SubCPulses[2:0] RxControl1 7 to 5 19h TauB[1:0] BPSKDemControl 1 to 0 1Dh TauD[1:0] BPSKDemControl 3 to 2 1Dh TxCoding[2:0] CoderControl 2 to 0 14hCLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 42 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.14 MIFARE authentication and Crypto1 The security algorithm used in the MIFARE products is called Crypto1. It is based on a proprietary stream cipher with a 48-bit key length. To access data on MIFARE cards, knowledge of the key format is needed. The correct key must be available in the CLRC632 to enable successful card authentication and access to the card’s data stored in the EEPROM. After a card is selected as defined in ISO/IEC 14443 A standard, the user can continue with the MIFARE protocol. It is mandatory that card authentication is performed. Crypto1 authentication is a 3-pass authentication which is automatically performed when the Authent1 and Authent2 commands are executed (see Section 11.7.3 on page 98 and Section 11.7.4 on page 98). During the card authentication procedure, the security algorithm is initialized. After a successful authentication, communication with the MIFARE card is encrypted. 9.14.1 Crypto1 key handling On execution of the authentication command, the CLRC632 reads the key from the key buffer. The key is always read from the key buffer and ensures Crypto1 authentication commands do not require addressing of a key. The user must ensure the correct key is prepared in the key buffer before triggering card authentication. The key buffer can be loaded from: • the EEPROM using the LoadKeyE2 command (see Section 11.7.1 on page 97) • the microprocessor’s FIFO buffer using the LoadKey command (see Section 11.7.2 on page 97). This is shown in Figure 15. Fig 15. Crypto1 key handling block diagram 001aak624 FIFO BUFFER from the microcontroller WriteE2 LoadKey EEPROM KEYS KEY BUFFER LoadKeyE2 during Authent1 CRYPTO1 MODULE serial data stream in serial data stream out (plain) (encrypted)CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 43 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 9.14.2 Authentication procedure The Crypto1 security algorithm enables authentication of MIFARE cards. To obtain valid authentication, the correct key has to be available in the key buffer of the CLRC632. This can be ensured as follows: 1. Load the internal key buffer by using the LoadKeyE2 (see Section 11.7.1 on page 97) or the LoadKey (see Section 11.7.2 on page 97) commands. 2. Start the Authent1 command (see Section 11.7.3 on page 98). When finished, check the error flags to obtain the command execution status. 3. Start the Authent2 command (see Section 11.7.4 on page 98). When finished, check the error flags and bit Crypto1On to obtain the command execution status. 10. CLRC632 registers 10.1 Register addressing modes Three methods can be used to operate the CLRC632: • initiating functions and controlling data by executing commands • configuring the functional operation using a set of configuration bits • monitoring the state of the CLRC632 by reading status flags The commands, configuration bits and flags are accessed using the microprocessor interface. The CLRC632 can internally address 64 registers using six address lines. 10.1.1 Page registers The CLRC632 register set is segmented into eight pages contain eight registers each. A Page register can always be addressed, irrespective of which page is currently selected. 10.1.2 Dedicated address bus When using the CLRC632 with the dedicated address bus, the microprocessor defines three address lines using address pins A0, A1 and A2. This enables addressing within a page. To switch between registers in different pages a paging mechanism needs to be used. Table 36 shows how the register address is assembled. 10.1.3 Multiplexed address bus The microprocessor may define all six address lines at once using the CLRC632 with a multiplexed address bus. In this case either the paging mechanism or linear addressing can be used. Table 37 shows how the register address is assembled. Table 36. Dedicated address bus: assembling the register address Register bit: UsePageSelect Register address 1 PageSelect2 PageSelect1 PageSelect0 A2 A1 A0CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 44 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 10.2 Register bit behavior Bits and flags for different registers behave differently, depending on their functions. In principle, bits with same behavior are grouped in common registers. Table 38 describes the function of the Access column in the register tables. Table 37. Multiplexed address bus: assembling the register address Multiplexed address bus type UsePage Select Register address Paging mode 1 PageSelect2 PageSelect1 PageSelect0 AD2 AD1 AD0 Linear addressing 0 AD5 AD4 AD3 AD2 AD1 AD0 Table 38. Behavior and designation of register bits Abbreviation Behavior Description R/W read and write These bits can be read and written by the microprocessor. Since they are only used for control, their content is not influenced by internal state machines. Example: TimerReload register may be read and written by the microprocessor. It will also be read by internal state machines but never changed by them. D dynamic These bits can be read and written by the microprocessor. Nevertheless, they may also be written automatically by internal state machines. Example: the Command register changes its value automatically after the execution of the command. R read only These registers hold flags which have a value determined by internal states only. Example: the ErrorFlag register cannot be written externally but shows internal states. W write only These registers are used for control only. They may be written by the microprocessor but cannot be read. Reading these registers returns an undefined value. Example: The TestAnaSelect register is used to determine the signal on pin AUX however, it is not possible to read its content.CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 45 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution 10.3 Register overview Table 39. CLRC632 register overview Sub address (Hex) Register name Function Refer to Page 0: Command and status 00h Page selects the page register Table 41 on page 50 01h Command starts and stops command execution Table 43 on page 50 02h FIFOData input and output of 64-byte FIFO buffer Table 45 on page 51 03h PrimaryStatus receiver and transmitter and FIFO buffer status flags Table 47 on page 51 04h FIFOLength number of bytes buffered in the FIFO buffer Table 49 on page 52 05h SecondaryStatus secondary status flags Table 51 on page 53 06h InterruptEn enable and disable interrupt request control bits Table 53 on page 53 07h InterruptRq interrupt request flags Table 55 on page 54 Page 1: Control and status 08h Page selects the page register Table 41 on page 50 09h Control control flags for timer unit, power saving etc Table 57 on page 55 0Ah ErrorFlag show the error status of the last command executed Table 59 on page 55 0Bh CollPos bit position of the first bit-collision detected on the RF interface Table 61 on page 56 0Ch TimerValue value of the timer Table 63 on page 57 0Dh CRCResultLSB LSB of the CRC coprocessor register Table 65 on page 57 0Eh CRCResultMSB MSB of the CRC coprocessor register Table 67 on page 57 0Fh BitFraming adjustments for bit oriented frames Table 69 on page 58 Page 2: Transmitter and coder control 10h Page selects the page register Table 41 on page 50 11h TxControl controls the operation of the antenna driver pins TX1 and TX2 Table 71 on page 59 12h CwConductance selects the conductance of the antenna driver pins TX1 and TX2 Table 73 on page 60 13h ModConductance defines the driver output conductance Table 75 on page 60 14h CoderControl sets the clock frequency and the encoding Table 77 on page 61 15h ModWidth selects the modulation pulse width Table 79 on page 62 16h ModWidthSOF selects the SOF pulse-width modulation (I-CODE1 fast mode) Table 81 on page 62 17h TypeBFraming defines the framing for ISO/IEC 14443 B communication Table 83 on page 63 Page 3: Receiver and decoder control 18 Page selects the page register Table 41 on page 50 19 RxControl1 controls receiver behavior Table 85 on page 64 1A DecoderControl controls decoder behavior Table 87 on page 65 1B BitPhase selects the bit-phase between transmitter and receiver clock Table 89 on page 65 1C RxThreshold selects thresholds for the bit decoder Table 91 on page 66 1D BPSKDemControl controls BPSK receiver behavior Table 93 on page 66 1Eh RxControl2 controls decoder and defines the receiver input source Table 95 on page 67 1Fh ClockQControl clock control for the 90 phase-shifted Q-channel clock Table 97 on page 67CLRC632 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 27 February 2014 073937 46 of 127 NXP Semiconductors CLRC632 Standard multi-protocol reader solution Page 4: RF Timing and channel redundancy 20h Page selects the page register Table 41 on page 50 21h RxWait selects the interval after transmission before the receiver starts Table 99 on page 68 22h ChannelRedundancy selects the method and mode used to check data integrity on the RF channel Table 101 on page 68 23h CRCPresetLSB preset LSB value for the CRC register Table 103 on page 69 24h CRCPresetMSB preset MSB value for the CRC register Table 105 on page 69 25h TimeSlotPeriod selects the time between automatically transmitted frames Table 107 on page 69 26h MFOUTSelect selects internal signal applied to pin MFOUT, includes the MSB of value TimeSlotPeriod; see Table 107 on page 69 Table 109 on page 70 27h PreSet27 these values are not changed Table 111 on page 70 Page 5: FIFO, timer and IRQ pin configuration 28h Page selects the page register Table 41 on page 50 29h FIFOLevel defines the FIFO buffer overflow and underflow warning levels Table 49 on page 52 2Ah TimerClock selects the timer clock divider Table 114 on page 71 2Bh TimerControl selects the timer start and stop conditions Table 116 on page 72 2Ch TimerReload defines the timer preset value Table 118 on page 72 2Dh IRQPinConfig configures pin IRQ output stage Table 120 on page 73 2Eh PreSet2E these values are not changed Table 122 on page 73 2Fh PreSet2F these values are not changed Table 123 on page 73 Page 6: reserved registers 30h Page selects the page register Table 41 on page 50 31h reserved reserved Table 124 on page 73 32h reserved reserved 33h reserved reserved 34h reserved reserved 35h reserved reserved 36h reserved reserved 37h reserved reserved Page 7: Test control 38h Page selects the page register Table 41 on page 50 39h reserved reserved Table 125 on page 74 3Ah TestAnaSelect selects analog test mode Table 126 on page 74 3Bh reserved reserved Table 128 on page 75 3Ch reserved reserved Table 129 on page 75 3Dh TestDigiSelect selects digital test mode Table 130 on page 75 3Eh reserved reserved Table 132 on page 76 3Fh reserved reserved 