iServer MicroServerTM for Serial-to-Ethernet Applications - Farnell Element 14 - Revenir à l'accueil
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Farnell-Datasheet-Fa..> 15-Jul-2014 17:05 1.0M
Farnell-MIDAS-un-tra..> 15-Jul-2014 17:05 1.0M
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Farnell-DC-DC-Conver..> 15-Jul-2014 16:48 781K
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Farnell-TMLM-Series-..> 15-Jul-2014 16:47 810K
Farnell-TEL-5-Series..> 15-Jul-2014 16:47 814K
Farnell-TXL-series-t..> 15-Jul-2014 16:47 829K
Farnell-TEP-150WI-Se..> 15-Jul-2014 16:47 837K
Farnell-AC-DC-Power-..> 15-Jul-2014 16:47 845K
Farnell-TIS-Instruct..> 15-Jul-2014 16:47 845K
Farnell-TOS-tracopow..> 15-Jul-2014 16:47 852K
Farnell-TCL-DC-traco..> 15-Jul-2014 16:46 858K
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Farnell-TMR-2-Series..> 15-Jul-2014 16:46 897K
Farnell-TMR-3-WI-Ser..> 15-Jul-2014 16:46 939K
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Farnell-ICM7228-Inte..> 07-Jul-2014 19:46 1.1M
Farnell-Data-Sheet-K..> 07-Jul-2014 19:46 1.2M
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Farnell-safety-data-..> 07-Jul-2014 19:44 1.4M
Farnell-A-4-Hardener..> 07-Jul-2014 19:44 1.4M
Farnell-CC-Debugger-..> 07-Jul-2014 19:44 1.5M
Farnell-MSP430-Hardw..> 07-Jul-2014 19:43 1.8M
Farnell-SmartRF06-Ev..> 07-Jul-2014 19:43 1.6M
Farnell-CC2531-USB-H..> 07-Jul-2014 19:43 1.8M
Farnell-Alimentation..> 07-Jul-2014 19:43 1.8M
Farnell-BK889B-PONT-..> 07-Jul-2014 19:42 1.8M
Farnell-User-Guide-M..> 07-Jul-2014 19:41 2.0M
Farnell-T672-3000-Se..> 07-Jul-2014 19:41 2.0M
Farnell-0050375063-D..> 18-Jul-2014 17:03 2.5M
Farnell-Mini-Fit-Jr-..> 18-Jul-2014 17:03 2.5M
Farnell-43031-0002-M..> 18-Jul-2014 17:03 2.5M
Farnell-0433751001-D..> 18-Jul-2014 17:02 2.5M
Farnell-Cube-3D-Prin..> 18-Jul-2014 17:02 2.5M
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Farnell-MTX-3250-MTX..> 18-Jul-2014 17:01 2.5M
Farnell-ATtiny26-L-A..> 18-Jul-2014 17:00 2.6M
Farnell-MCP3421-Micr..> 18-Jul-2014 17:00 1.2M
Farnell-LM19-Texas-I..> 18-Jul-2014 17:00 1.2M
Farnell-Data-Sheet-S..> 18-Jul-2014 17:00 1.2M
Farnell-LMH6518-Texa..> 18-Jul-2014 16:59 1.3M
Farnell-AD7719-Low-V..> 18-Jul-2014 16:59 1.4M
Farnell-DAC8143-Data..> 18-Jul-2014 16:59 1.5M
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Farnell-SICK-OPTIC-E..> 18-Jul-2014 16:58 1.5M
Farnell-LT3757-Linea..> 18-Jul-2014 16:58 1.6M
Farnell-LT1961-Linea..> 18-Jul-2014 16:58 1.6M
Farnell-PIC18F2420-2..> 18-Jul-2014 16:57 2.5M
Farnell-DS3231-DS-PD..> 18-Jul-2014 16:57 2.5M
Farnell-RDS-80-PDF.htm 18-Jul-2014 16:57 1.3M
Farnell-AD8300-Data-..> 18-Jul-2014 16:56 1.3M
Farnell-LT6233-Linea..> 18-Jul-2014 16:56 1.3M
Farnell-MAX1365-MAX1..> 18-Jul-2014 16:56 1.4M
Farnell-XPSAF5130-PD..> 18-Jul-2014 16:56 1.4M
Farnell-DP83846A-DsP..> 18-Jul-2014 16:55 1.5M
Farnell-Dremel-Exper..> 18-Jul-2014 16:55 1.6M
Farnell-MCOC1-Farnel..> 16-Jul-2014 09:04 1.0M
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Farnell-PN512-Full-N..> 16-Jul-2014 09:03 1.4M
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Farnell-LPC408x-7x 3..> 16-Jul-2014 09:03 1.6M
Farnell-PCF8574-PCF8..> 16-Jul-2014 09:03 1.7M
Farnell-LPC81xM-32-b..> 16-Jul-2014 09:02 2.0M
Farnell-LPC1769-68-6..> 16-Jul-2014 09:02 1.9M
Farnell-Download-dat..> 16-Jul-2014 09:02 2.2M
Farnell-LPC3220-30-4..> 16-Jul-2014 09:02 2.2M
Farnell-LPC11U3x-32-..> 16-Jul-2014 09:01 2.4M
Farnell-SL3ICS1002-1..> 16-Jul-2014 09:01 2.5M
Farnell-T672-3000-Se..> 08-Jul-2014 18:59 2.0M
Farnell-tesa®pack63..> 08-Jul-2014 18:56 2.0M
Farnell-Encodeur-USB..> 08-Jul-2014 18:56 2.0M
Farnell-CC2530ZDK-Us..> 08-Jul-2014 18:55 2.1M
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Farnell-Synchronous-..> 08-Jul-2014 18:54 2.1M
Farnell-Arithmetic-L..> 08-Jul-2014 18:54 2.1M
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Farnell-4-Bit-Magnit..> 08-Jul-2014 18:53 2.2M
Farnell-LM555-Timer-..> 08-Jul-2014 18:53 2.2M
Farnell-L293d-Texas-..> 08-Jul-2014 18:53 2.2M
Farnell-SN54HC244-SN..> 08-Jul-2014 18:52 2.3M
Farnell-MAX232-MAX23..> 08-Jul-2014 18:52 2.3M
Farnell-High-precisi..> 08-Jul-2014 18:51 2.3M
Farnell-SMU-Instrume..> 08-Jul-2014 18:51 2.3M
Farnell-900-Series-B..> 08-Jul-2014 18:50 2.3M
Farnell-BA-Series-Oh..> 08-Jul-2014 18:50 2.3M
Farnell-UTS-Series-S..> 08-Jul-2014 18:49 2.5M
Farnell-270-Series-O..> 08-Jul-2014 18:49 2.3M
Farnell-UTS-Series-S..> 08-Jul-2014 18:49 2.8M
Farnell-Tiva-C-Serie..> 08-Jul-2014 18:49 2.6M
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Farnell-Clipper-Seri..> 08-Jul-2014 18:48 2.8M
Farnell-SOURIAU-Cont..> 08-Jul-2014 18:47 3.0M
Farnell-851-Series-P..> 08-Jul-2014 18:47 3.0M
Farnell-SL59830-Inte..> 06-Jul-2014 10:07 1.0M
Farnell-ALF1210-PDF.htm 06-Jul-2014 10:06 4.0M
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Farnell-Low-Noise-24..> 06-Jul-2014 10:05 1.0M
Farnell-ESCON-Featur..> 06-Jul-2014 10:05 938K
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Farnell-1N4148WS-Fai..> 06-Jul-2014 10:04 1.9M
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Farnell-Datasheet-Fa..> 06-Jul-2014 10:04 861K
Farnell-ES1F-ES1J-fi..> 06-Jul-2014 10:04 867K
Farnell-QRE1113-Fair..> 06-Jul-2014 10:03 879K
Farnell-2N7002DW-Fai..> 06-Jul-2014 10:03 886K
Farnell-FDC2512-Fair..> 06-Jul-2014 10:03 886K
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Farnell-ev-relays-ae..> 06-Jul-2014 10:02 926K
Farnell-ESCON-Featur..> 06-Jul-2014 10:02 931K
Farnell-Amplifier-In..> 06-Jul-2014 10:02 940K
Farnell-Serial-File-..> 06-Jul-2014 10:02 941K
Farnell-Both-the-Del..> 06-Jul-2014 10:01 948K
Farnell-Videk-PDF.htm 06-Jul-2014 10:01 948K
Farnell-EPCOS-173438..> 04-Jul-2014 10:43 3.3M
Farnell-Sensorless-C..> 04-Jul-2014 10:42 3.3M
Farnell-197.31-KB-Te..> 04-Jul-2014 10:42 3.3M
Farnell-PIC12F609-61..> 04-Jul-2014 10:41 3.7M
Farnell-PADO-semi-au..> 04-Jul-2014 10:41 3.7M
Farnell-03-iec-runds..> 04-Jul-2014 10:40 3.7M
Farnell-ACC-Silicone..> 04-Jul-2014 10:40 3.7M
Farnell-Series-TDS10..> 04-Jul-2014 10:39 4.0M
Farnell-03-iec-runds..> 04-Jul-2014 10:40 3.7M
Farnell-0430300011-D..> 14-Jun-2014 18:13 2.0M
Farnell-06-6544-8-PD..> 26-Mar-2014 17:56 2.7M
Farnell-3M-Polyimide..> 21-Mar-2014 08:09 3.9M
Farnell-3M-VolitionT..> 25-Mar-2014 08:18 3.3M
Farnell-10BQ060-PDF.htm 14-Jun-2014 09:50 2.4M
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Farnell-12mm-Size-In..> 14-Jun-2014 09:50 2.4M
Farnell-24AA024-24LC..> 23-Jun-2014 10:26 3.1M
Farnell-50A-High-Pow..> 20-Mar-2014 17:31 2.9M
Farnell-197.31-KB-Te..> 04-Jul-2014 10:42 3.3M
Farnell-1907-2006-PD..> 26-Mar-2014 17:56 2.7M
Farnell-5910-PDF.htm 25-Mar-2014 08:15 3.0M
Farnell-6517b-Electr..> 29-Mar-2014 11:12 3.3M
Farnell-A-True-Syste..> 29-Mar-2014 11:13 3.3M
Farnell-ACC-Silicone..> 04-Jul-2014 10:40 3.7M
Farnell-AD524-PDF.htm 20-Mar-2014 17:33 2.8M
Farnell-ADL6507-PDF.htm 14-Jun-2014 18:19 3.4M
Farnell-ADSP-21362-A..> 20-Mar-2014 17:34 2.8M
Farnell-ALF1210-PDF.htm 04-Jul-2014 10:39 4.0M
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Farnell-ALF2412-24-V..> 01-Apr-2014 07:39 3.4M
Farnell-AN10361-Phil..> 23-Jun-2014 10:29 2.1M
Farnell-ARADUR-HY-13..> 26-Mar-2014 17:55 2.8M
Farnell-ARALDITE-201..> 21-Mar-2014 08:12 3.7M
Farnell-ARALDITE-CW-..> 26-Mar-2014 17:56 2.7M
Farnell-ATMEL-8-bit-..> 19-Mar-2014 18:04 2.1M
Farnell-ATMEL-8-bit-..> 11-Mar-2014 07:55 2.1M
Farnell-ATmega640-VA..> 14-Jun-2014 09:49 2.5M
Farnell-ATtiny20-PDF..> 25-Mar-2014 08:19 3.6M
Farnell-ATtiny26-L-A..> 13-Jun-2014 18:40 1.8M
Farnell-Alimentation..> 14-Jun-2014 18:24 2.5M
Farnell-Alimentation..> 01-Apr-2014 07:42 3.4M
Farnell-Amplificateu..> 29-Mar-2014 11:11 3.3M
Farnell-An-Improved-..> 14-Jun-2014 09:49 2.5M
Farnell-Atmel-ATmega..> 19-Mar-2014 18:03 2.2M
Farnell-Avvertenze-e..> 14-Jun-2014 18:20 3.3M
Farnell-BC846DS-NXP-..> 13-Jun-2014 18:42 1.6M
Farnell-BC847DS-NXP-..> 23-Jun-2014 10:24 3.3M
Farnell-BF545A-BF545..> 23-Jun-2014 10:28 2.1M
Farnell-BK2650A-BK26..> 29-Mar-2014 11:10 3.3M
Farnell-BT151-650R-N..> 13-Jun-2014 18:40 1.7M
Farnell-BTA204-800C-..> 13-Jun-2014 18:42 1.6M
Farnell-BUJD203AX-NX..> 13-Jun-2014 18:41 1.7M
Farnell-BYV29F-600-N..> 13-Jun-2014 18:42 1.6M
Farnell-BYV79E-serie..> 10-Mar-2014 16:19 1.6M
Farnell-BZX384-serie..> 23-Jun-2014 10:29 2.1M
Farnell-Battery-GBA-..> 14-Jun-2014 18:13 2.0M
Farnell-C.A-6150-C.A..> 14-Jun-2014 18:24 2.5M
Farnell-C.A 8332B-C...> 01-Apr-2014 07:40 3.4M
Farnell-CC2560-Bluet..> 29-Mar-2014 11:14 2.8M
Farnell-CD4536B-Type..> 14-Jun-2014 18:13 2.0M
Farnell-CIRRUS-LOGIC..> 10-Mar-2014 17:20 2.1M
Farnell-CS5532-34-BS..> 01-Apr-2014 07:39 3.5M
Farnell-Cannon-ZD-PD..> 11-Mar-2014 08:13 2.8M
Farnell-Ceramic-tran..> 14-Jun-2014 18:19 3.4M
Farnell-Circuit-Note..> 26-Mar-2014 18:00 2.8M
Farnell-Circuit-Note..> 26-Mar-2014 18:00 2.8M
Farnell-Cles-electro..> 21-Mar-2014 08:13 3.9M
Farnell-Conception-d..> 11-Mar-2014 07:49 2.4M
Farnell-Connectors-N..> 14-Jun-2014 18:12 2.1M
Farnell-Construction..> 14-Jun-2014 18:25 2.5M
Farnell-Controle-de-..> 11-Mar-2014 08:16 2.8M
Farnell-Cordless-dri..> 14-Jun-2014 18:13 2.0M
Farnell-Current-Tran..> 26-Mar-2014 17:58 2.7M
Farnell-Current-Tran..> 26-Mar-2014 17:58 2.7M
Farnell-Current-Tran..> 26-Mar-2014 17:59 2.7M
Farnell-Current-Tran..> 26-Mar-2014 17:59 2.7M
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Farnell-DC-Fan-type-..> 14-Jun-2014 09:51 1.8M
Farnell-Davum-TMC-PD..> 14-Jun-2014 18:27 2.4M
Farnell-De-la-puissa..> 29-Mar-2014 11:10 3.3M
Farnell-Directive-re..> 25-Mar-2014 08:16 3.0M
Farnell-Documentatio..> 14-Jun-2014 18:26 2.5M
Farnell-Download-dat..> 13-Jun-2014 18:40 1.8M
Farnell-ECO-Series-T..> 20-Mar-2014 08:14 2.5M
Farnell-ELMA-PDF.htm 29-Mar-2014 11:13 3.3M
Farnell-EMC1182-PDF.htm 25-Mar-2014 08:17 3.0M
Farnell-EPCOS-173438..> 04-Jul-2014 10:43 3.3M
Farnell-EPCOS-Sample..> 11-Mar-2014 07:53 2.2M
Farnell-ES2333-PDF.htm 11-Mar-2014 08:14 2.8M
Farnell-Ed.081002-DA..> 19-Mar-2014 18:02 2.5M
Farnell-F28069-Picco..> 14-Jun-2014 18:14 2.0M
Farnell-F42202-PDF.htm 19-Mar-2014 18:00 2.5M
Farnell-FDS-ITW-Spra..> 14-Jun-2014 18:22 3.3M
Farnell-FICHE-DE-DON..> 10-Mar-2014 16:17 1.6M
Farnell-Fastrack-Sup..> 23-Jun-2014 10:25 3.3M
Farnell-Ferric-Chlor..> 29-Mar-2014 11:14 2.8M
Farnell-Fiche-de-don..> 14-Jun-2014 09:47 2.5M
Farnell-Fiche-de-don..> 14-Jun-2014 18:26 2.5M
Farnell-Fluke-1730-E..> 14-Jun-2014 18:23 2.5M
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Farnell-GALVA-MAT-Re..> 26-Mar-2014 17:57 2.7M
Farnell-GN-RELAYS-AG..> 20-Mar-2014 08:11 2.6M
Farnell-HC49-4H-Crys..> 14-Jun-2014 18:20 3.3M
Farnell-HFE1600-Data..> 14-Jun-2014 18:22 3.3M
Farnell-HI-70300-Sol..> 14-Jun-2014 18:27 2.4M
Farnell-HUNTSMAN-Adv..> 10-Mar-2014 16:17 1.7M
Farnell-Haute-vitess..> 11-Mar-2014 08:17 2.4M
Farnell-IP4252CZ16-8..> 13-Jun-2014 18:41 1.7M
Farnell-Instructions..> 19-Mar-2014 18:01 2.5M
Farnell-KSZ8851SNL-S..> 23-Jun-2014 10:28 2.1M
Farnell-L-efficacite..> 11-Mar-2014 07:52 2.3M
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Farnell-LME49725-Pow..> 14-Jun-2014 09:49 2.5M
Farnell-LOCTITE-542-..> 25-Mar-2014 08:15 3.0M
Farnell-LOCTITE-3463..> 25-Mar-2014 08:19 3.0M
Farnell-LUXEON-Guide..> 11-Mar-2014 07:52 2.3M
Farnell-Leaded-Trans..> 23-Jun-2014 10:26 3.2M
Farnell-Les-derniers..> 11-Mar-2014 07:50 2.3M
Farnell-Loctite3455-..> 25-Mar-2014 08:16 3.0M
Farnell-Low-cost-Enc..> 13-Jun-2014 18:42 1.7M
Farnell-Lubrifiant-a..> 26-Mar-2014 18:00 2.7M
Farnell-MC3510-PDF.htm 25-Mar-2014 08:17 3.0M
Farnell-MC21605-PDF.htm 11-Mar-2014 08:14 2.8M
Farnell-MCF532x-7x-E..> 29-Mar-2014 11:14 2.8M
Farnell-MICREL-KSZ88..> 11-Mar-2014 07:54 2.2M
Farnell-MICROCHIP-PI..> 19-Mar-2014 18:02 2.5M
Farnell-MOLEX-39-00-..> 10-Mar-2014 17:19 1.9M
Farnell-MOLEX-43020-..> 10-Mar-2014 17:21 1.9M
Farnell-MOLEX-43160-..> 10-Mar-2014 17:21 1.9M
Farnell-MOLEX-87439-..> 10-Mar-2014 17:21 1.9M
Farnell-MPXV7002-Rev..> 20-Mar-2014 17:33 2.8M
Farnell-MX670-MX675-..> 14-Jun-2014 09:46 2.5M
Farnell-Microchip-MC..> 13-Jun-2014 18:27 1.8M
Farnell-Microship-PI..> 11-Mar-2014 07:53 2.2M
Farnell-Midas-Active..> 14-Jun-2014 18:17 3.4M
Farnell-Midas-MCCOG4..> 14-Jun-2014 18:11 2.1M
Farnell-Miniature-Ci..> 26-Mar-2014 17:55 2.8M
Farnell-Mistral-PDF.htm 14-Jun-2014 18:12 2.1M
Farnell-Molex-83421-..> 14-Jun-2014 18:17 3.4M
Farnell-Molex-COMMER..> 14-Jun-2014 18:16 3.4M
Farnell-Molex-Crimp-..> 10-Mar-2014 16:27 1.7M
Farnell-Multi-Functi..> 20-Mar-2014 17:38 3.0M
Farnell-NTE_SEMICOND..> 11-Mar-2014 07:52 2.3M
Farnell-NXP-74VHC126..> 10-Mar-2014 16:17 1.6M
Farnell-NXP-BT136-60..> 11-Mar-2014 07:52 2.3M
Farnell-NXP-PBSS9110..> 10-Mar-2014 17:21 1.9M
Farnell-NXP-PCA9555 ..> 11-Mar-2014 07:54 2.2M
Farnell-NXP-PMBFJ620..> 10-Mar-2014 16:16 1.7M
Farnell-NXP-PSMN1R7-..> 10-Mar-2014 16:17 1.6M
Farnell-NXP-PSMN7R0-..> 10-Mar-2014 17:19 2.1M
Farnell-NXP-TEA1703T..> 11-Mar-2014 08:15 2.8M
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Farnell-Novembre-201..> 20-Mar-2014 17:38 3.3M
Farnell-OMRON-Master..> 10-Mar-2014 16:26 1.8M
Farnell-OSLON-SSL-Ce..> 19-Mar-2014 18:03 2.1M
Farnell-OXPCIE958-FB..> 13-Jun-2014 18:40 1.8M
Farnell-PADO-semi-au..> 04-Jul-2014 10:41 3.7M
Farnell-PBSS5160T-60..> 19-Mar-2014 18:03 2.1M
Farnell-PDTA143X-ser..> 20-Mar-2014 08:12 2.6M
Farnell-PDTB123TT-NX..> 13-Jun-2014 18:43 1.5M
Farnell-PESD5V0F1BL-..> 13-Jun-2014 18:43 1.5M
Farnell-PESD9X5.0L-P..> 13-Jun-2014 18:43 1.6M
Farnell-PIC12F609-61..> 04-Jul-2014 10:41 3.7M
Farnell-PIC18F2455-2..> 23-Jun-2014 10:27 3.1M
Farnell-PIC24FJ256GB..> 14-Jun-2014 09:51 2.4M
Farnell-PMBT3906-PNP..> 13-Jun-2014 18:44 1.5M
Farnell-PMBT4403-PNP..> 23-Jun-2014 10:27 3.1M
Farnell-PMEG4002EL-N..> 14-Jun-2014 18:18 3.4M
Farnell-PMEG4010CEH-..> 13-Jun-2014 18:43 1.6M
Farnell-Panasonic-15..> 23-Jun-2014 10:29 2.1M
Farnell-Panasonic-EC..> 20-Mar-2014 17:36 2.6M
Farnell-Panasonic-EZ..> 20-Mar-2014 08:10 2.6M
Farnell-Panasonic-Id..> 20-Mar-2014 17:35 2.6M
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Sefram-SP270.pdf-PDF..> 29-Mar-2014 11:46 464K1 EIT Series FCC-B U Put Any Serial Device On the IP Network in Minutes U Bridge RS232/RS485 to TCP/IP U Auto-negotiating 10/100 Ethernet Half/ Full Duplex U Built-in Web Server U TCP, UDP, SNMP, SMTP, TFTP, ICMP, Telnet, DHCP, DNS, HTTP, and ARP U MODBUS® RTU to MODBUS TCP/IP Bridging U Email Notifications and SNMP Traps U 1 to 6 Programmable I/Os U Firmware Upgrade Over Ethernet U Custom Firmware/Private Labeling for OEMs U TCP Socket with Command Line Interface U Serial Speed Up to 460 Kb/s U Authentication and Access Restrictions U Small Enough to Fit Almost Anywhere U Free COM Port Redirector U Free Configuration Software iServer MicroServerTM for Serial-to-Ethernet Applications The 3rd Generation NEWPORT® connects any Serial Device (RS232, RS485) to an Ethernet network or the Internet in minutes, including Serial Modbus to ModbusTCP/IP over Ethernet. The iServer3G can send notifications by email, and has SNMP for remote management. Newport offers custom firmware and private-labeling for OEMs. EIT-D DIN rail for industrial applications, shown smaller than actual size. EIT-W Wall mount or benchtop for commercial applications, shown smaller than actual size. EIT-PCB Embedded PC board assembly for OEMs, shown smaller than actual size. Connect any serial device to Ethernet LAN and the Internet Quickly configured through a web browser 2 To Order Visit newportUS.com/eit for Pricing and Details Model No. Description EIT-W iServer MicroServer™ for Serial-to-Ethernet applications in commercial wall-mount case with universal AC power adaptor (100 to 240 Vac input, 5 Vdc output); full RS232 serial interface with 1 input pin EIT-W-485 Commercial wall-mount case; RS485 (full and half duplex) serial interface with 3 I/Os EIT-D Industrial DIN rail case with screw terminal serial ports; full RS232 serial interface without I/Os EIT-D-485 Industrial DIN rail case; RS485 (full and half duplex) serial interface with 3 I/Os EIT-PCB Printed circuit board for embedded applications; full RS232 serial interface with 3 I/Os EIT-PCB-485 Printed circuit board; RS485 (full and half duplex) serial interface with 6 I/Os Ordering Example: EIT-W, one full RS232 serial interface commercial wall-mount iServer MicroServer. * Volume discounts are available. Sensor Specifications Serial Interface Interface: RS232 or RS485 (2- and 4-wire) Connector: DB9 male DTE for RS232; 8 position terminal block plug for RS485 Serial Data Rates: 300 to 460.8 Kbps Characters: 5, 6, 7, or 8 data bits Parity: odd, even, or none Stop Bits: 1 or 2 Flow Control: Hardware (RTS/CTS) and Software (Xon/Xoff) Digital I/Os: 1 to 6 programmable input/output lines, depending on model. Network Interface Interface: Fixed or auto-negotiating 10/100BASE-T half/full duplex Ethernet with auto MDI/MDIX Connector: RJ45 Protocols: TCP, UDP, SNMP, SMTP, TFTP, ICMP, DHCP, DNS, HTTP, ARP, Modbus TCP/IP and Telnet Compliant to Standard: IEEE 802.3 Indicators (LEDs): 100BASE-T, Network Link/Activity, and Serial Transmit/Receive 32-Bit Microprocessor: CPU: ARM7, 72 MHz Memory: 512 Kbyte Flash, 32 Kbyte SRAM Embedded Web Server: Serves dynamic Web pages and Java applets Management: Web server, Telnet login, Serial login, iConnect General Power (for EIT-PCB): Input: 5 Vdc @ 200 mA max. Consumption: 1 W max. Power (for EIT-W): Input: 5 Vdc @ 200 mA max Consumption: 1 W max. Safety Qualified AC Power Adapter (included): Nominal Output: 5 Vdc @ 600 mA; Input: 100 to 240 Vac, 50/60Hz Operating Temperature: 0 to 40°C (32 to 104°F) Power (for EIT-D): Input: 10 to 32 Vdc Consumption: 2 W max. DC Power supply sold separately: iDRN-PS-1000 Packaging (for EIT-W): Material: ABS (ChiMei PA-757) with wall mount bracket Dimensions: 27.4H x 66.0W x 93.1D mm (1.08 x 2.60 x 3.67 in) Weight: 77g (0.17 lbs.) Packaging (for EIT-D): Material: Polycarbonate case with DIN Rail mount Dimensions: 90.2H x 25.1W x 115.0D mm (3.54 x .99 x 4.53 in) Weight: 113g (0.25 lbs.) Packaging (for EIT-PCB): Material: FR4 Board Surface area dimensions: Approximately 80 sq. mm (3 sq") Weight: 14g (0.03 lbs.) Environmental Operating Temperature: -40 to 85°C (-40 to 185°F) Storage Temperature: -40 to 100°C (-40 to 212°F) Software Firmware upgrade from Ethernet COM Port redirector (iPort); Configuration Software utility (iConnect) Compatible with Windows 9x/ME/NT/2000/XP software and related utilities 2.60 [66.0] 1.08 [ 27.4] 3.67 [93.1] 100BASE-T LINK/ACT TRANSMIT RECEIVE RS232 RS485 0.88 [ 22.4] COMMUNICATIONS ETHERNET DC POWER IN RECEIVE TRANSMIT LINK/ACT 100BASE-T RESET N/C 4.53 [115] 0.99 [25.1] 3.54 [90.2] EIT-D Material: Polycarbonate case with DIN rail mount Weight: 113 g (0.25 lbs) EIT-W Material: ABS (ChiMei PA-757) with wall mount Weight: 77 g (0.17 lbs) EIT-PCB Board Surface area: approximately 3 sq. inches [80 sq. mm] Weight: 14 g (0.03 lbs) EIT-W READINGS http://192.168.1.200 Overview Network Serial I/O Pins Management Security Device Query Device Setup Readings Terminal System Diagnostics READINGS 000 Auto Update 1 Boiler 1 92.4 Deg. C No De vice Name Reading Unit 92.4 Deg. C Dimensions: in (mm) ø = diameter Mechanical SB520-SB5100 2001 Fairchild Semiconductor Corporation SB520 - SB5100, Rev. C Features •Metal to silicon rectifier, majoritycarrier conduction. •For use in low voltage, highfrequency inverters freewheeling, and polarityprotection applications. • Low power loss, high efficiency. • High current capability, low VF. • High surge capacity. SB520 - SB5100 Schottky Rectifiers Absolute Maximum Ratings* TA = 25°C unless otherwise noted *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Electrical Characteristics TA = 25°C unless otherwise noted Symbol Parameter Value Units PD Power Dissipation 5.0 W RθJA Thermal Resistance, Junction to Ambient 25 °C/W Symbol Parameter Device Units 520 530 540 550 560 580 5100 VF Forward Voltage @ 5.0 A 0.55 0.67 0.85 V IR Reverse Current @ rated VR TA = 25°C 0.5 mA TA = 100°C 50 25 mA CT Total Capacitance VR = 4.0 V, f = 1.0 MHz 500 380 pF DO-201AD COLOR BAND DENOTES CATHODE Thermal Characteristics Symbol Parameter Value Units 520 530 540 550 560 580 5100 VRRM Maximum Repetitive Reverse Voltage 20 30 40 50 60 80 100 V IF(AV) Average Rectified Forward Current .375 " lead length @ TA = 75°C 5.0 A IFSM Non-repetitive Peak Forward Surge Current 8.3 ms Single Half-Sine-Wave 150 A Tstg Storage Temperature Range -50 to +150 °C TJ Operating Junction Temperature -50 to +150 °C • Glass passivated SB520-SB5100 2001 Fairchild Semiconductor Corporation SB520 - SB5100, Rev. C Schottky Rectifiers (continued) Typical Characteristics 1 2 5 102050100 0 30 60 90 120 150 Number of Cycles at 60Hz Peak Forward Surge Current, IFSM [A] 0.1110100 100 200 500 1000 2000 5000 Reverse Voltage, VR [V] Total Capacitance, CT [pF] SB520-SB540 SB550-SB5100 0.40.50.60.70.80.911.1 0.1 1 10 40 Forward Voltage, VF [V] Forward Current, IF [A] Pulse Width = 300μS 2% Duty Cycle T = 25 C A º SB520-SB540 SB550-SB560 SB580-SB5100 0 255075100125150175 0 1 2 3 4 5 Ambient Temperature [ºC] Average Rectified Forward Current, IF [A] SINGLE PHASE HALF WAVE 60HZ RESISTIVE OR INDUCTIVE LOAD .375" (9.00mm) LOAD LENGTHS SB520-SB540 SB550-SB5100 0 20406080100120140 0.001 0.01 0.1 1 10 20 Percent of Rated Peak Reverse Voltage [%] Reverse Current, IR [mA] T = 25 C A º T = 75 C A º T = 100 C A º SB520-SB540 SB550-SB5100 SB520-SB540 SB550-SB5100 Figure 1. Forward Current Derating Curve Figure 2. Non-Repetitive Surge Current Figure 3. Forward Voltage Characteristics Figure 4. Reverse Current vs Reverse Voltage Figure 5. Total Capacitance DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUME ANY LIABILITYARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEYANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production OPTOLOGIC™ OPTOPLANAR™ PACMAN™ POP™ Power247™ PowerTrench QFET™ QS™ QT Optoelectronics™ Quiet Series™ SILENT SWITCHER FAST FASTr™ FRFET™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ LittleFET™ MicroFET™ MicroPak™ MICROWIRE™ Rev. H4 â ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DenseTrench™ DOME™ EcoSPARK™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ SMART START™ STAR*POWER™ Stealth™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ TruTranslation™ UHC™ â UltraFET â â STAR*POWER is used under license VCX™ RaspiCam Documentation July 2013 This document describes the use of the three Raspberry Pi camera applications as of July 2013. There are three applications provided: raspistill, raspivid and raspistillyuv. Both raspistill and raspistillyuv are very similar and are intended for capturing images, while raspivid is for capturing video. All the applications are command-line driven, written to take advantage of the mmal API which runs over OpenMAX. The mmal API provides an easier to use system than that presented by OpenMAX. Note that mmal is a Broadcom specific API used only on Videocore 4 systems. The applications use up to four OpenMAX(mmal) components - camera, preview, encoder and null_sink. All applications use the camera component: raspistill uses the Image Encode component, raspivid uses the Video Encode component, and raspistillyuv does not use an encoder, and sends its YUV or RGB output direct from camera component to file. The preview display is optional, but can be used full screen or directed to a specific rectangular area on the display. If preview is disabled, the null_sink component is used to 'absorb' the preview frames. It is necessary for the camera to produce preview frames even if not required for display, as they are used for calculating exposure and white balance settings. In addition it is possible to omit the filename option, in which case the preview is displayed but no file is written, or to redirect all output to stdout. Command line help is available by typing just the application name in on the command line. Setting up the camera hardware Please note that camera modules are static-sensitive. Earth yourself prior to handling the PCB: a sink tap/faucet or similar should suffice if you don’t have an earthing strap. The camera board attaches to the Raspberry Pi via a 15-way ribbon cable. There are only two connections to make: the ribbon cable need to be attached to the camera PCB and the Raspberry Pi itself. You need to get it the right way round, or the camera will not work. On the camera PCB, the blue backing on the cable should be facing away from the PCB, and on the Raspberry Pi it should be facing towards the Ethernet connection (or where the Ethernet connector would be if you are using a model A). Although the connectors on the PCB and the Pi are different, they work in a similar way. On the Raspberry Pi, pull up the tabs on each end of the connector. It should slide up easily, and be able to pivot around slightly. Fully insert the ribbon cable into the slot, ensuring it is straight, then gently press down the tabs to clip it into place. The camera PCB itself also requires you to pull the tabs away from the board, gently insert the cable, then push the tabs back. The PCB connector is a little more awkward than the one on the Pi itself. You can watch a video showing you how to attach the connectors at www.raspberrypi.org/archives/3890 (scroll down for the video). Setting up the Camera software Execute the following instructions on the command line to download and install the latest kernel, GPU firmware and applications. You will need an internet connection for this to work correctly. sudo apt-get update sudo apt-get upgrade Now you need to enable camera support, using the raspiconfig program you will have used when you first set up your Raspberry Pi. sudo raspi-config Use the cursor keys to move to the camera option and select enable. On exiting raspi-config it will ask to reboot. The enable option will ensure that on reboot the correct GPU firmware will be running (with the camera driver and tuning), and the GPU memory split is sufficient to allow the camera to acquire enough memory to run correctly. To test that the system is installed and working, try the following command: raspistill -v -o test.jpg The display should show a 5-second preview from the camera and then take a picture, saved to the file test.jpg, while displaying various informational messages. Troubleshooting If the camera is not working correctly, there are number of things to try. • Are the ribbon connectors all firmly seated and the right way round? They must be straight in their sockets. • Is the camera module connector firmly attached to the camera PCB? This is the connection from the smaller black camera module itself to the camera PCB. Sometimes this connection can come loose. Using a fingernail, flip up the connector on the PCB, then reseat it with gentle pressure, it engages with a very slight click. • Have sudo apt-get update and sudo apt-get upgrade been run? • Has raspi-config been run and the camera enabled? If things are still not working, try the following: Error : raspistill/raspivid not found. This probably means your update/upgrade failed in some way. Try it again. Error : ENOMEM displayed. Camera is not starting up. Check all connections again. Error : ENOSPC displayed. Camera is probably running out of GPU memory. Check config.txt in the /boot/ folder. The gpu_mem option should be at least 128. If, after all the above, the camera is still not working, it may have a defect (most likely because it has suffered static shock). Try posting on the Raspberry Pi forum in the camera board section to see if there is any more help available there. Common Command line Options Preview Window --preview, -p Preview window settings <'x,y,w,h'> Allows the user to define the size and location on the screen that the preview window will be placed. Note this will be superimposed over the top of any other windows/graphics. --fullscreen, -f Fullscreen preview mode Forces the preview window to use the whole screen. Note that the aspect ratio of the incoming image will be retained, so there may be bars on some edges. --nopreview, -n, Do not display a preview window Disables the preview window completely. Note that even though the preview is disabled, the camera will still be producing frames, so will be using power. --opacity, -op Set preview window opacity Sets the opacity of the preview windows. 0 = invisible, 255 = fully opaque. Camera Control Options --sharpness, -sh Set image sharpness (-100 to 100) Set the sharpness of the image, 0 is the default. --contrast, -co Set image contrast (-100 to 100) Set the contrast of the image, 0 is the default --brightness, -br Set image brightness (0 to 100) Set the brightness of the image, 50 is the default. 0 is black, 100 is white. --saturation, -sa Set image saturation (-100 to 100) Set the colour saturation of the image. 0 is the default. --ISO, -ISO Set capture ISO Sets the ISO to be used for captures. Range is 100 to 800. --vstab, -vs Turn on video stabilization In video mode only, turn on video stabilization. --ev, -ev Set EV compensation Set the EV compensation of the image. Range is -10 to +10, default is 0. --exposure, -ex Set exposure mode Possible options are: off auto Use automatic exposure mode night Select setting for night shooting nightpreview backlight Select setting for back-lit subject spotlight sports Select setting for sports (fast shutter etc.) snow Select setting optimized for snowy scenery beach Select setting optimized for beach verylong Select setting for long exposures fixedfps Constrain fps to a fixed value antishake Antishake mode fireworks Select setting optimized for fireworks Note that not all of these settings may be implemented, depending on camera tuning. --awb, -awb Set automatic white balance (AWB) off Turn off white balance calculation auto Automatic mode (default) sun Sunny mode cloud shade Cloudy mode tungsten Tungsten lighting mode fluorescent Fluorescent lighting mode incandescent Incandescent lighting mode flash Flash mode horizon Horizon mode --imxfx, -ifx Set image effect none No effect negative Produces a negative image solarise Solarise the image whiteboard Whiteboard effect blackboard Blackboard effect sketch Sketch-style effect denoise Denoise the image emboss Embossed effect oilpaint Oil paint-style effect hatch Cross-hatch sketch style gpen Graphite sketch style pastel Pastel effect watercolour Watercolour effect film Grainy film effect blur Blur the image saturation Colour-saturate the image colourswap Not fully implemented washedout Not fully implemented posterise Not fully implemented colourpoint Not fully implemented colourbalance Not fully implemented cartoon Not fully implemented --colfx, -cfx Set colour effect The supplied U and V parameters (range 0 to 255) are applied to the U and Y channels of the image. For example, --colfx 128:128 should result in a monochrome image. --metering, -mm Set metering mode Specify the metering mode used for the preview and capture. average Average the whole frame for metering spot Spot metering backlit Assume a backlit image matrix Matrix metering --rotation, -rot Set image rotation (0-359) Sets the rotation of the image in viewfinder and resulting image. This can take any value from 0 upwards, but due to hardware constraints only 0, 90, 180 and 270-degree rotations are supported. --hflip, -hf Set horizontal flip Flips the preview and saved image horizontally. --vflip, -vf Set vertical flip Flips the preview and saved image vertically. --roi, -roi Set sensor region of interest Allows the specification of the area of the sensor to be used as the source for the preview and capture. This is defined as x,y for the top left corner, and a width and height, all values in normalised coordinates (0.0-1.0). So to set a ROI at half way across and down the sensor, and an width and height of a quarter of the sensor use : -roi 0.5,0.5,0.25,0.25 Application-‐specific settings raspistill --width, -w Set image width --height, -h Set image height --quality, -q Set jpeg quality <0 to 100> Quality 100 is almost completely uncompressed. 75 is a good allround value. --raw, -r Add raw Bayer data to jpeg metadata This option inserts the raw Bayer data from the camera in to the JPEG metadata. --output -o Output filename Specify the output filename. If not specified, no file is saved. If the filename is '-', then all output is sent to stdout. --verbose, -v Output verbose information during run Outputs debugging/information messages during the program run. --timeout, -t Time before capture and shut down The program will run for this length of time, then take the capture (if output is specified). If not specified, this is set to 5 seconds. --timelapse, -tl Timelapse mode. The specific value is the time between shots in milliseconds. Note you should specify %04d at the point in the filename where you want a frame count number to appear. For example: -t 30000 -tl 2000 -o image%04d.jpg will produce a capture every 2 seconds over a total period of 30s, named image1.jpg, image0002.jpg...image0015.jpg. Note that the %04d indicates a four-digit number with leading zeros added to pad to the required number of digits. So, for example, %08d would result in an eight-digit number. --thumb, -th Set thumbnail parameters (x:y:quality) Allows specification of the thumbnail image inserted in to the JPEG file. If not specified, defaults are a size of 64x48 at quality 35. --demo, -d Run a demo mode This options cycles through range of camera options, and no capture is done. The demo will end at the end of the timeout period, irrespective of whether all the options have been cycled. The time between cycles should be specified as a millisecond value. --encoding, -e Encoding to use as output file Valid options are jpg, bmp, gif and png. Note that unaccelerated image types (gif, png, bmp) will take much longer to save than jpg, which is hardware accelerated. Also note that the filename suffix is completely ignored when encoding a file. --exif, -x EXIF tag to apply to captures (format as 'key=value') Allows the insertion of specific EXIF tags into the JPEG image. You can have up to 32 EXIF tge entries. This is useful for things like adding GPS metadata. For example, to set the longitude: --exif GPS.GPSLongitude=5/1,10/1,15/100 would set the longitude to 5degs, 10 minutes, 15 seconds. See EXIF documentation for more details on the range of tags available; the supported tags are as follows: IFD0.< or IFD1.< ImageWidth, ImageLength, BitsPerSample, Compression, PhotometricInterpretation, ImageDescription, Make, Model, StripOffsets, Orientation, SamplesPerPixel, RowsPerString, StripByteCounts, Xresolution, Yresolution, PlanarConfiguration, ResolutionUnit, TransferFunction, Software, DateTime, Artist, WhitePoint, PrimaryChromaticities, JPEGInterchangeFormat, JPEGInterchangeFormatLength, YcbCrCoefficients, YcbCrSubSampling, YcbCrPositioning, ReferenceBlackWhite, Copyright> EXIF.< ExposureTime, FNumber, ExposureProgram, SpectralSensitivity, a ISOSpeedRatings, OECF, ExifVersion, DateTimeOriginal, DateTimeDigitized, ComponentsConfiguration, CompressedBitsPerPixel, ShutterSpeedValue, ApertureValue, BrightnessValue, ExposureBiasValue, MaxApertureValue, SubjectDistance, MeteringMode, LightSource, Flash, FocalLength, SubjectArea, MakerNote, UserComment, SubSecTime, SubSecTimeOriginal, SubSecTimeDigitized, FlashpixVersion, ColorSpace, PixelXDimension, PixelYDimension, RelatedSoundFile, FlashEnergy, SpacialFrequencyResponse, FocalPlaneXResolution, FocalPlaneYResolution, FocalPlaneResolutionUnit, SubjectLocation, ExposureIndex, SensingMethod, FileSource, SceneType, CFAPattern, CustomRendered, ExposureMode, WhiteBalance, DigitalZoomRatio, FocalLengthIn35mmFilm, SceneCaptureType, GainControl, Contrast, Saturation, Sharpness, DeviceSettingDescription, SubjectDistanceRange, ImageUniqueID> GPS.< GPSVersionID, GPSLatitudeRef, GPSLatitude, GPSLongitudeRef, GPSLongitude, GPSAltitudeRef, GPSAltitude, GPSTimeStamp, GPSSatellites, GPSStatus, GPSMeasureMode, GPSDOP, GPSSpeedRef, GPSSpeed, GPSTrackRef, GPSTrack, GPSImgDirectionRef, GPSImgDirection, GPSMapDatum, GPSDestLatitudeRef, GPSDestLatitude, GPSDestLongitudeRef, GPSDestLongitude, GPSDestBearingRef, GPSDestBearing, GPSDestDistanceRef, GPSDestDistance, GPSProcessingMethod, GPSAreaInformation, GPSDateStamp, GPSDifferential> EINT.< InteroperabilityIndex, InteroperabilityVersion, RelatedImageFileFormat, RelatedImageWidth, RelatedImageLength> Note that a small subset of these tags will be set automatically by the camera system, but will be overridden by any exif options on the command line. --fullpreview, -fp Full Preview mode This runs the preview windows using the full resolution capture mode. Maximum frames per second in this mode is 15fps and the preview will have the same field of view as the capture. Captures should happen more quickly as no mode change should be required. This feature is currently under development. raspistillyuv Many of the options for raspistillyuv are the same as those for raspistill. This section shows the differences. Unsupported Options: --exif, --encoding, --thumb, --raw, --quality Extra Options: --rgb, -rgb Save uncompressed data as RGB888 This option forces the image to be saved as RGB data with 8 bits per channel, rather than YUV420. Note that the image buffers saved in raspistillyuv are padded to a horizontal size divisible by 16 (so there may be unused bytes at the end of each line to made the width divisible by 16). Buffers are also padded vertically to be divisible by 16, and in the YUV mode, each plane of Y,U,V is padded in this way. raspivid --width, -w Set image width Width of resulting video. This should be between 64 and 1920. --height, -h Set image height Height of resulting video. This should be between 64 and 1080. --bitrate, -b Set bitrate Use bits per second, so 10MBits/s would be -b 10000000. For H264, 1080p a high quality bitrate would be 15Mbits/s or more. --output, -o Output filename . Specify the output filename. If not specified, no file is saved. If the filename is '-', then all output is sent to stdout. --verbose, -v Output verbose information during run Outputs debugging/information messages during the program run. --timeout, -t Time before capture and shut down The program will run for this length of time, then take the capture (if output is specified). If not specified, this is set to five seconds. Setting 0 will mean the application will run continuously until stopped with Ctrl-C. --demo, -d Run a demo mode This option cycles through range of camera options, no capture is done, the demo will end at the end of the timeout period, irrespective of whether all the options have been cycled. The time between cycles should be specified as a millisecond value. --framerate, -fps Specify the frames per second to record At present, the minimum frame rate allowed is 2fps, the maximum is 30fps. This is likely to change in the future. --penc, -e Display preview image after encoding Switch on an option to display the preview after compression. This will show any compression artefacts in the preview window. In normal operation, the preview will show the camera output prior to being compressed. This option is not guaranteed to work in future releases. --intra, -g Specify the intra refresh period (key frame rate/GoP) Sets the intra refresh period (GoP) rate for the recorded video. H.264 video uses a complete frame (I-frame) every intra refresh period from which subsequent frames are based. This options specifies the numbers of frames between each I-frame. Larger numbers here will reduce the size of the resulting video, smaller numbers make the stream more robust to error. Examples Still captures By default, captures are done at the highest resolution supported by the sensor. This can be changed using the -w and -h command line options. Taking a default capture after two seconds (note times are specified in milliseconds) on viewfinder, saving in image.jpg raspistill -t 2000 -o image.jpg Take a capture at a different resolution raspistill -t 2000 -o image.jpg -w 640 -h 480 Now reduce the quality considerably to reduce file size raspistill -t 2000 -o image.jpg -q 5 Force the preview to appear at coordinate 100,100, with width 300 and height 200 pixels. raspistill -t 2000 -o image.jpg -p 100,100,300,200 Disable preview entirely. raspistill -t 2000 -o image.jpg -n Save the image as a png file (lossless compression, but slower than JPEG). Note that the filename suffix is ignored when choosing the image encoding. raspistill -t 2000 -o image.png –e png Add some EXIF information to the JPEG. This sets the Artist tag name to Mooncake, and the GPS altitude to 123.5m. Note that if setting GPS tags you should set as a minimum GPSLatitude, GPSLatitudeRef, GPSLongitude, GPSLongitudeRef, GPSAltitude and GPSAltitudeRef. raspistill -t 2000 -o image.jpg -x IFDO.Artist=Mooncake -x GPS.GPSAltitude=1235/10 Set an emboss style image effect. raspistill -t 2000 -o image.jpg -ifx emboss Set the U and V channels of the YUV image to specific values (128:128 produces a greyscale image) raspistill -t 2000 -o image.jpg -cfx 128:128 Run preview ONLY for two seconds, no saved image. raspistill -t 2000 Take timelapse picture, one every 10 seconds for 10 minutes (10 minutes = 600000ms), named image_number_1_today.jpg, image_number_2_today.jpg onwards. raspistill -t 600000 -tl 10000 -o image_num_%d_today.jpg Take a picture and send image data to stdout raspistill -t 2000 -o - Take a picture and send image data to file raspistill -t 2000 -o - > my_file.jpg Video Captures Image size and preview settings are the same as for stills capture. Default size for video recording is 1080p (1920x1080) Record a 5s clip with default settings (1080p30) raspivid -t 5000 -o video.h264 Record a 5s clip at a specified bitrate (3.5MBits/s) raspivid -t 5000 -o video.h264 -b 3500000 Record a 5s clip at a specified framerate (5fps) raspivid -t 5000 -o video.h264 -f 5 Encode a 5s camera stream and send image data to stdout raspivid -t 5000 -o - Encode a 5s camera stream and send image data to file raspivid -t 5000 -o - > my_file.h264 L78S 2 A positive voltage regulator IC Datasheet - production data Features • Output current up to 2 A • Output voltages of 5; 7.5; 9; 10; 12; 15; 18; 24 V • Thermal protection • Short circuit protection • Output transition SOA protection Description The L78S series of three-terminal positive regulators is available in TO-220 package and several fixed output voltages, making it useful in a wide range of applications. These regulators can provide local on-card regulation, eliminating the distribution problems associated with single point regulation. Each type embeds internal current limiting, thermal shut-down and safe area protection, making it essentially indestructible. If adequate heat sinking is provided, they can deliver over 2 A output current. Although designed primarily as fixed voltage regulators, these devices can be used with external components to obtain adjustable voltages and currents. TO-220 Table 1. Device summary Part numbers TO-220 packages Output voltage Dual gauge Single gauge L78S05C L78S05CV-DG L78S05CV 5 V L78S75C L78S75CV-DG L78S75CV 7.5 V L78S09C L78S09CV-DG L78S09CV 9 V L78S10C L78S10CV-DG L78S10CV 10 V L78S12C L78S12CV-DG L78S12CV 12 V L78S15C L78S15CV-DG L78S15CV 15 V L78S18C L78S18CV 18 V L78S24C L78S24CV 24 V www.st.com Contents L78S 2/35 DocID2148 Rev 8 Contents 1 Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 8 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 DocID2148 Rev 8 3/35 L78S List of tables 35 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 3. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4. Electrical characteristics of L78S05C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 5. Electrical characteristics of L78S75C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 6. Electrical characteristics of L78S09C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 7. Electrical characteristics of L78S10C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 8. Electrical characteristics of L78S12C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 9. Electrical characteristics of L78S15C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 10. Electrical characteristics of L78S18C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 11. Electrical characteristics of L78S24C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 12. TO-220 (dual gauge) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 13. TO-220 SG (single gauge) mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 14. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 List of figures L78S 4/35 DocID2148 Rev 8 List of figures Figure 1. Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. Pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. Schematic diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4. Application circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 5. DC parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 6. Load regulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 7. Ripple rejection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 8. Dropout voltage vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 9. Peak output current vs. input/output differential voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 10. Output impedance vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 11. Output voltage vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 12. Supply voltage rejection vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 13. Quiescent current vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 14. Load transient response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 15. Line transient response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 16. Quiescent current vs. input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 17. Fixed output regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 18. Constant current regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 19. Circuit for increasing output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 20. Adjustable output regulator (7 to 30 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 21. 0.5 to 10 V regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 22. High current voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 23. High output current with short circuit protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 24. Tracking voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 25. Positive and negative regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 26. Negative output voltage circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 27. Switching regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 28. High input voltage circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 29. High input voltage circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 30. High output voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 31. High input and output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 32. Reducing power dissipation with dropping resistor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33. Remote shutdown. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 34. Power AM modulator (unity voltage gain, IO £ 1 A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 35. Adjustable output voltage with temperature compensation . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 36. Light controllers (VOmin = VXX + VBE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 37. Protection against input short-circuit with high capacitance loads . . . . . . . . . . . . . . . . . . . 27 Figure 38. TO-220 (dual gauge) drawing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 39. TO-220 SG (single gauge) drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 40. Tube for TO-220 (dual gauge) (mm.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 41. Tube for TO-220 (single gauge) (mm.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 DocID2148 Rev 8 5/35 L78S Diagram 35 1 Diagram Figure 1. Block diagram Pin configuration L78S 6/35 DocID2148 Rev 8 2 Pin configuration Figure 2. Pin connections (top view) Figure 3. Schematic diagram DocID2148 Rev 8 7/35 L78S Maximum ratings 35 3 Maximum ratings Note: Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under these condition is not implied. Table 2. Absolute maximum ratings Symbol Parameter Value Unit VI DC input voltage for VO= 5 to 18V 35 V for VO= 24V 40 IO Output current Internally limited PD Power dissipation Internally limited TSTG Storage temperature range -65 to 150 °C TOP Operating junction temperature range 0 to 150 °C Table 3. Thermal data Symbol Parameter TO-220 Unit RthJC Thermal resistance junction-case 5 °C/W RthJA Thermal resistance junction-ambient 50 °C/W Figure 4. Application circuits Test circuits L78S 8/35 DocID2148 Rev 8 4 Test circuits Figure 5. DC parameter Figure 6. Load regulation Figure 7. Ripple rejection DocID2148 Rev 8 9/35 L78S Electrical characteristics 35 5 Electrical characteristics Refer to the test circuits, TJ = 25 °C, VI = 10 V, IO = 500 mA, unless otherwise specified. Table 4. Electrical characteristics of L78S05C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 4.8 5 5.2 V VO Output voltage IO = 1 A, VI = 7 V 4.75 5 5.25 V ΔVO Line regulation VI = 7 to 25 V 100 mV VI = 8 to 25 V 50 ΔVO Load regulation IO = 20 mA to 1.5 A 100 mV IO = 2 A 80 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 7 to 25 V, IO = 20 mA 1.3 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1.1 mV/°C eN Output noise voltage B = 10 Hz to 100 kHz 40 μV SVR Supply voltage rejection f = 120 Hz 54(1) dB VI Operating input voltage IO ≤ 1 A 8 V RO Output resistance f = 1 kHz 17 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. Electrical characteristics L78S 10/35 DocID2148 Rev 8 Refer to the test circuits, TJ = 25 °C, VI = 12.5 V, IO = 500 mA, unless otherwise specified. Table 5. Electrical characteristics of L78S75C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 7.15 7.5 7.9 V VO Output voltage IO = 1 A, VI = 9.5 V 7.1 7.5 7.95 V ΔVO Line regulation VI = 9.5 to 25 V 120 mV VI = 10.5 to 20 V 60 ΔVO Load regulation IO = 20 mA to 1.5 A 140 mV IO = 2 A 100 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 9.5 to 25 V, IO = 20 mA 1.3 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -0.8 mV/°C eN Output noise voltage B = 10 Hz to 100 kHz 52 μV SVR Supply voltage rejection f = 120 Hz 48(1) dB VI Operating input voltage IO ≤ 1 A 10.5 V RO Output resistance f = 1 kHz 16 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. DocID2148 Rev 8 11/35 L78S Electrical characteristics 35 Refer to the test circuits, TJ = 25 °C, VI = 14 V, IO = 500 mA, unless otherwise specified. Table 6. Electrical characteristics of L78S09C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 8.65 9 9.35 V VO Output voltage IO = 1 A, VI = 11 V 8.6 9 9.4 V ΔVO Line regulation VI = 11 to 25 V 130 mV VI = 11 to 20 V 65 ΔVO Load regulation IO = 20 mA to 1.5 A 170 mV IO = 2 A 100 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 11 to 25 V, IO = 20 mA 1.3 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1 mV/°C eN Output noise voltage B = 10 Hz to 100 kHz 60 μV SVR Supply voltage rejection f = 120 Hz 47(1) dB VI Operating input voltage IO ≤ 1 A 12 V RO Output resistance f = 1 kHz 17 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. Electrical characteristics L78S 12/35 DocID2148 Rev 8 Refer to the test circuits, TJ = 25 °C, VI = 15 V, IO = 500 mA, unless otherwise specified. Table 7. Electrical characteristics of L78S10C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 9.5 10 10.5 V VO Output voltage IO = 1 A, VI = 12.5 V 9.4 10 10.6 V ΔVO Line regulation VI = 12.5 to 30 V 200 mV VI = 14 to 22 V 100 ΔVO Load regulation IO = 20 mA to 1.5 A 240 mV IO = 2 A 150 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 12.5 to 30 V, IO = 20 mA 1 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1 mV/°C eN Output noise voltage B = 10 Hz to 100 kHz 65 μV SVR Supply voltage rejection f = 120 Hz 47(1) dB VI Operating input voltage IO ≤ 1 A 13 V RO Output resistance f = 1 kHz 17 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. DocID2148 Rev 8 13/35 L78S Electrical characteristics 35 Refer to the test circuits, TJ = 25 °C, VI = 19 V, IO = 500 mA, unless otherwise specified. Table 8. Electrical characteristics of L78S12C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 11.5 12 12.5 V VO Output voltage IO = 1 A, VI = 14.5 V 11.4 12 12.6 V ΔVO Line regulation VI = 14.5 to 30 V 240 mV VI = 16 to 22 V 120 ΔVO Load regulation IO = 20 mA to 1.5 A 240 mV IO = 2 A 150 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 14.5 to 30 V, IO = 20 mA 1 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1 mV/°C eN Output noise voltage B =10 Hz to 100 kHz 75 μV SVR Supply voltage rejection f = 120 Hz 47(1) dB VI Operating input voltage IO ≤ 1 A 15 V RO Output resistance f = 1 kHz 18 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. Electrical characteristics L78S 14/35 DocID2148 Rev 8 Refer to the test circuits, TJ = 25 °C, VI = 23 V, IO = 500 mA, unless otherwise specified. Table 9. Electrical characteristics of L78S15C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 14.4 15 15.6 V VO Output voltage IO = 1 A, VI = 17.5 V 14.25 15 15.75 V ΔVO Line regulation VI = 17.5 to 30 V 300 mV VI = 20 to 26 V 150 ΔVO Load regulation IO = 20 mA to 1.5 A 300 mV IO = 2 A 150 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 17.5 to 30 V, IO = 20 mA 1 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1 mV/°C eN Output noise voltage B =10 Hz to 100 kHz 90 μV SVR Supply voltage rejection f = 120 Hz 46(1) dB VI Operating input voltage IO ≤ 1 A 18 V RO Output resistance f = 1 kHz 19 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. DocID2148 Rev 8 15/35 L78S Electrical characteristics 35 Refer to the test circuits, TJ = 25 °C, VI = 26 V, IO = 500 mA, unless otherwise specified. Table 10. Electrical characteristics of L78S18C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 17.1 18 18.9 V VO Output voltage IO = 1 A, VI = 20.5 V 17 18 19 V ΔVO Line regulation VI = 20.5 to 30 V 360 mV VI = 22 to 28 V 180 ΔVO Load regulation IO = 20 mA to 1.5 A 360 mV IO = 2 A 200 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 20.5 to 30 V, IO = 20 mA 1 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1 mV/°C eN Output noise voltage B =10 Hz to 100 kHz 110 μV SVR Supply voltage rejection f = 120 Hz 43(1) dB VI Operating input voltage IO ≤ 1 A 21 V RO Output resistance f = 1 kHz 22 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. Electrical characteristics L78S 16/35 DocID2148 Rev 8 Refer to the test circuits, TJ = 25 °C, VI = 33 V, IO = 500 mA, unless otherwise specified. Table 11. Electrical characteristics of L78S24C Symbol Parameter Test conditions Min. Typ. Max. Unit VO Output voltage 23 24 25 V VO Output voltage IO = 1 A, VI = 27 V 22.8 24 25.2 V ΔVO Line regulation VI = 27 to 38 V 480 mV VI = 30 to 36 V 240 ΔVO Load regulation IO = 20 mA to 1.5 A 480 mV IO = 2 A 300 IQ Quiescent current 8 mA ΔIQ Quiescent current change IO = 20 mA to 1 A 0.5 mA VI = 27 to 38 V, IO = 20 mA 1 ΔVO/ΔT Output voltage drift IO = 5 mA, TJ = 0 °C to 70 °C -1.5 mV/°C eN Output noise voltage B = 10 Hz to 100 kHz 170 μV SVR Supply voltage rejection f = 120 Hz 42(1) dB VI Operating input voltage IO ≤ 1 A 27 V RO Output resistance f = 1 kHz 28 mΩ Isc Short circuit current VI = 27 V 500 mA Iscp Short circuit peak current 3 A 1. Guaranteed by design. DocID2148 Rev 8 17/35 L78S Typical performance 35 6 Typical performance Figure 8. Dropout voltage vs. junction temperature Figure 9. Peak output current vs. input/output differential voltage Figure 10. Output impedance vs. frequency Figure 11. Output voltage vs. junction temperature Typical performance L78S 18/35 DocID2148 Rev 8 Figure 12. Supply voltage rejection vs. frequency Figure 13. Quiescent current vs. junction temperature Figure 14. Load transient response Figure 15. Line transient response Figure 16. Quiescent current vs. input voltage DocID2148 Rev 8 19/35 L78S Typical performance 35 1. Although no output capacitor is need for stability, it does improve transient response. 2. Required if regulator is located an appreciable distance from power supply filter. Figure 17. Fixed output regulator Figure 18. Constant current regulator Figure 19. Circuit for increasing output voltage Typical performance L78S 20/35 DocID2148 Rev 8 Figure 20. Adjustable output regulator (7 to 30 V) Figure 21. 0.5 to 10 V regulator VO=VXXR4/R1 DocID2148 Rev 8 21/35 L78S Typical performance 35 Figure 22. High current voltage regulator Figure 23. High output current with short circuit protection Typical performance L78S 22/35 DocID2148 Rev 8 Figure 24. Tracking voltage regulator Figure 25. Positive and negative regulator DocID2148 Rev 8 23/35 L78S Typical performance 35 Figure 26. Negative output voltage circuit Figure 27. Switching regulator Figure 28. High input voltage circuit Typical performance L78S 24/35 DocID2148 Rev 8 Figure 29. High input voltage circuit Figure 30. High output voltage regulator Figure 31. High input and output voltage DocID2148 Rev 8 25/35 L78S Typical performance 35 Figure 32. Reducing power dissipation with dropping resistor Figure 33. Remote shutdown Typical performance L78S 26/35 DocID2148 Rev 8 Note: The circuit performs well up to 100 kHz. Note: Q2 is connected as a diode in order to compensate the variation of the Q1 VBE with the temperature. C allows a slow rise time of the VO. Figure 34. Power AM modulator (unity voltage gain, IO ≤ 1 A) Figure 35. Adjustable output voltage with temperature compensation DocID2148 Rev 8 27/35 L78S Typical performance 35 1. Application with high capacitance loads and an output voltage greater than 6 volts need an external diode (see Figure 30 on page 24) to protect the device against input short circuit. In this case the input voltage falls rapidly while the output voltage decrease slowly. The capacitance discharges by means of the Base- Emitter junction of the series pass transistor in the regulator. If the energy is sufficiently high, the transistor may be destroyed. The external diode by-passes the current from the IC to ground. Figure 36. Light controllers (VOmin = VXX + VBE) Figure 37. Protection against input short-circuit with high capacitance loads Package mechanical data L78S 28/35 DocID2148 Rev 8 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. DocID2148 Rev 8 29/35 L78S Package mechanical data 35 Figure 38. TO-220 (dual gauge) drawing Package mechanical data L78S 30/35 DocID2148 Rev 8 Table 12. TO-220 (dual gauge) mechanical data Dim. mm Min. Typ. Max. A 4.40 4.60 b 0.61 0.88 b1 1.14 1.70 c 0.48 0.70 D 15.25 15.75 D1 1.27 E 10 10.40 e 2.40 2.70 e1 4.95 5.15 F 1.23 1.32 H1 6.20 6.60 J1 2.40 2.72 L 13 14 L1 3.50 3.93 L20 16.40 L30 28.90 ∅P 3.75 3.85 Q 2.65 2.95 DocID2148 Rev 8 31/35 L78S Package mechanical data 35 Figure 39. TO-220 SG (single gauge) drawing Package mechanical data L78S 32/35 DocID2148 Rev 8 Table 13. TO-220 SG (single gauge) mechanical data Dim. mm Min. Typ. Max. A 4.40 4.60 b 0.61 0.88 b1 1.14 1.70 c 0.48 0.70 D 15.25 15.75 E 10 10.40 e 2.40 2.70 e1 4.95 5.15 F 0.51 0.60 H1 6.20 6.60 J1 2.40 2.72 L 13 14 L1 3.50 3.93 L20 16.40 L30 28.90 ∅P 3.75 3.85 Q 2.65 2.95 DocID2148 Rev 8 33/35 L78S Packaging mechanical data 35 8 Packaging mechanical data Figure 40. Tube for TO-220 (dual gauge) (mm.) Figure 41. Tube for TO-220 (single gauge) (mm.) Revision history L78S 34/35 DocID2148 Rev 8 9 Revision history Table 14. Document revision history Date Revision Changes 07-Sep-2006 2 Order codes updated. 20-Mar-2008 3 Added: Table 1 on page 1. 22-Mar-2010 4 Added: Table 20 on page 32, Figure 38 on page 33, Figure 39 on page 34, Figure 40 and Figure 41 on page 33. 08-Feb-2012 5 Added: order codes L78S05CV-DG, L78S12CV-DG and L78S15CV-DG Table 13 on page 35. 09-Mar-2012 6 Added: order codes L78S09CV-DG Table 13 on page 35. 15-May-2012 7 Added: order codes L78S75CV-DG and L78S10CV-DG Table 13 on page 35. 10-Mar-2014 8 Part numbers L78Sxx and L78SxxC changed to L78S. Modified the title, the features and the description in cover page. Removed TO-3 package. Updated Table 1: Device summary, Section 2: Pin configuration, Section 3: Maximum ratings, Section 4: Test circuits, Section 5: Electrical characteristics,Section 6: Typical performance, Section 7: Package mechanical data, Section 9: Order codes. Added Section 8: Packaging mechanical data. Minor text changes. DocID2148 Rev 8 35/35 L78S 35 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com BD6xxx Complementary power Darlington transistors Features ■ Good hFE linearity ■ High fT frequency ■ Monolithic Darlington configuration with integrated antiparallel collector-emitter diode Applications ■ Linear and switching industrial equipment Description The devices are manufactured in planar base island technology with monolithic Darlington configuration. . Figure 1. Internal schematic diagram SOT-32 3 2 1 R1 typ.= 15 KΩ R2 typ.= 100 Ω Table 1. Device summary Order codes Marking Package Packaging BD677 BD677 SOT-32 Tube BD677A BD677A BD678 BD678 BD678A BD678A BD679 BD679 BD679A BD679A BD680 BD680 BD680A BD680A BD681 BD681 BD682 BD682 www.st.com Contents BD6xxx 2/12 Contents 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Typical characteristic (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 BD6xxx Absolute maximum ratings 3/12 1 Absolute maximum ratings Note: For PNP types voltage and current values are negative Table 2. Absolute maximum ratings Symbol Parameter Value Unit NPN BD677 BD677A BD679 BD679A BD681 PNP BD678 BD678A BD680 BD680A BD682 VCBO Collector-base voltage (IE = 0) 60 80 100 V VCEO Collector-emitter voltage (IB = 0) VEBO Emitte-base voltage (IC = 0) 5 V IC Collector current 4 A ICM Collector peak current 6 A IB Base current 0.1 A PTOT Total dissipation at Tcase = 25°C 40 W Tstg Storage temperature -65 to 150 °C TJ Max. operating junction temperature 150 °C Electrical characteristics BD6xxx 4/12 2 Electrical characteristics (Tcase = 25°C; unless otherwise specified) Table 3. Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit ICEO Collector cut-off current (IB = 0) VCE = half rated VCEO 0.5 mA ICBO Collector cut-off current (IE = 0) VCE = rated VCBO VCE = rated VCBO Tc = 100 °C 0.2 2 mA IEBO Emitter cut-off current (IC = 0) VEB = 5 V 2 mA VCEO(sus) (1) Collector-emitter sustaining voltage (IB = 0) for BD677, BD677A, BD678, BD678A IC = 50 mA 60 V for BD679, BD679A, BD680, BD680A IC = 50 mA 80 for BD681, BD682 IC = 50 mA 100 VCE(sat) (1) Collector-emitter saturation voltage for BD677, BD678, BD679, BD680, BD681, BD682 IC = 1.5 A IB = 30 mA 2.5 V for BD677A, BD678A, BD679A, BD680A IC = 2 A IB = 40 mA 2.8 VBE (1) Base-emitter voltage for BD677, BD678, BD679, BD680, BD681, BD682 IC = 1.5 A ___ VCE = 3 V 2.5 V for BD677A, BD678A, BD679A, BD680A IC = 2 A VCE = 3 V BD6xxx Electrical characteristics 5/12 Note: For PNP types voltage e current values are negative. hFE (1) DC current gain for BD677, BD678, BD679, BD680, BD681, BD682 IC = 1.5 A_ _ VCE = 3 V 750 for BD677A, BD678A, BD679A, BD680A IC = 2 A_ _ VCE = 3 V 1. Pulsed duration = 300 ms, duty cycle ≥1.5%. Table 3. Electrical characteristics (continued) Symbol Parameter Test conditions Min. Typ. Max. Unit Electrical characteristics BD6xxx 6/12 2.1 Typical characteristic (curves) Figure 2. DC current gain (NPN) Figure 3. DC current gain (PNP) Figure 4. DC current gain (NPN) Figure 5. DC current gain (PNP) Figure 6. Collector-emitter saturation voltage (NPN) Figure 7. Collector-emitter saturation voltage (PNP) BD6xxx Electrical characteristics 7/12 Figure 8. Base-emitter saturation voltage (NPN) Figure 9. Base-emitter saturation voltage (PNP) Figure 10. Base-emitter voltage (NPN) Figure 11. Base-emitter voltage (PNP) Figure 12. Resistive load switching time (NPN, on) Figure 13. Resistive load switching time (PNP, on) Electrical characteristics BD6xxx 8/12 2.2 Test circuit Note: For PNP types voltage e current values are negative. Figure 14. Resistive load switching time (NPN, off) Figure 15. Resistive load switching time (PNP, off) Figure 16. Resistive load switching test circuit 1) Fast electronic switch 2) Non-inductive resistor BD6xxx Package mechanical data 9/12 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com Package mechanical data BD6xxx 10/12 BD6xxx Revision history 11/12 4 Revision history Table 4. Document revision history Date Revision Changes 21-Jun-2004 4 14-Jan-2008 5 1. Technology change from epybase to planar. 2. Updated Section 2.1: Typical characteristic (curves) on page 6 3. Content reworked to improve readability. BD6xxx 12/12 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com This is information on a product in full production. August 2013 DocID13587 Rev 16 1/105 STM32F103x8 STM32F103xB Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces Datasheet - production data Features ARM 32-bit Cortex™-M3 CPU Core – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division Memories – 64 or 128 Kbytes of Flash memory – 20 Kbytes of SRAM Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC – PLL for CPU clock – 32 kHz oscillator for RTC with calibration Low power – Sleep, Stop and Standby modes – VBAT supply for RTC and backup registers 2 x 12-bit, 1 μs A/D converters (up to 16 channels) – Conversion range: 0 to 3.6 V – Dual-sample and hold capability – Temperature sensor DMA – 7-channel DMA controller – Peripherals supported: timers, ADC, SPIs, I2Cs and USARTs Up to 80 fast I/O ports – 26/37/51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode – Serial wire debug (SWD) & JTAG interfaces 7 timers – Three 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input – 16-bit, motor control PWM timer with deadtime generation and emergency stop – 2 watchdog timers (Independent and Window) – SysTick timer 24-bit downcounter Up to 9 communication interfaces – Up to 2 x I2C interfaces (SMBus/PMBus) – Up to 3 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) – Up to 2 SPIs (18 Mbit/s) – CAN interface (2.0B Active) – USB 2.0 full-speed interface CRC calculation unit, 96-bit unique ID Packages are ECOPACK® Table 1. Device summary Reference Part number STM32F103x8 STM32F103C8, STM32F103R8 STM32F103V8, STM32F103T8 STM32F103xB STM32F103RB STM32F103VB, STM32F103CB, STM32F103TB BGA100 10 × 10 mm UFBGA100 7 x 7 mm BGA64 5 × 5 mm VFQFPN36 6 × 6 mm LQFP100 14 × 14 mm LQFP64 10 × 10 mm LQFP48 7 × 7 mm UFQFPN48 7 × 7 mm www.st.com 2012-2013 Dremel Experts: US: 1 (800) 437-3635 Canada: 1 (888) 285-3476 www.dremel.com The M akers o f Scan this code with your phone for product information, videos, and more. Do you like to: REA D Visit Dremel.com and get tips and tricks on projects and products. Plus visit our message board or sign up for our monthly eblast for news on new product introductions. TALK Join the conversation on Facebook at facebook.com/Dremel. BE INSPIRE D Sign up for weekly project inspiration at DremelWeekends.com. SHARE Pin Dremel projects and ideas on Pinterest. STAY UP-TO-DATE Get the latest news from Dremel. Follow us on Twitter, username @Dremel. ROTARY TOOLS Corded.. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12 Cordless.. . . . . . . . . . . . . . . . . . . . . . . 13-20 At tachments.. . . . . . . . . . . . . . . . . 21-26 Accessories.. . . . . . . . . . . . . . . . . . 27-42 OSCILLATING TOOLS Mul t i-Max™ Corded.. . . . . . 43-48 Mul t i-Max™ Cordless.. . . . 49-50 Accessories.. . . . . . . . . . . . . . . . . . 51-54 At tachments.. . . . . . . . . . . . . . . . . . . . . 54 SPECIALTY TOOLS Saw-Max™ System. . . . . . . . 55-60 Trio™ System.. . . . . . . . . . . . . . . . 61-66 VersaTip™ and Accessories.. . . . . . . . . . . . . . . . . . . . . . 67 Engraver and Accessories.. . . . . . . . . . . . . . . . . . . . . . 67 V ersatile Tool Systems™ INDEX Customer Support A well-prepared staff of Dremel Experts is available to answer questions about our tools. With over 650 total years of combined work experience, the Dremel Experts are ready to serve you. Call: 1-800-4-DREMEL (1-800-437-3635) USA. 1-888-285-3476 CANADA. Cal l for Your Free Dremel DVD 1(800) 437-3635 1 The Makers of Versatile Tool Systems™ ROTARY TOOLS 2 What Is a Rotary Tool ? Rotary tools are hand held power tools that use high-speed and low torque to undertake a variety of useful tasks with control and precision. Since AJ Dremel invented the first rotary tool over 80 years ago, no other brand has worked harder to bring users a more complete and innovative system of rotary tools, accessories and attachments. Over the years Dremel rotary tools have become the gold standard in versatility, performance, and quality by which all other rotary tools are judged. 3 4200, 4000, 8220 3000, 8100 ROTARY TOOL OVERVIEW CORDED VERSATILITY METER Model 4200 4000 3000 200 SERIES 100 SERIES Amps 1.6 1.6 1.2 1.15 1.15 Speed Range [RPM] 5,000— 35,000 5,000— 35,000 5,000— 32,000 15,000 and 35,000 35,000 Versatility Level High High Intermediate Basic + Basic Electronic Feedback Control Yes Yes No No No Number of Speeds Variable Variable Variable 2 1 Soft Grip Yes Yes Yes No No Separate On/Off Speed Control Yes Yes No No No Accessory Change System EZ Change™ EZ Twist™ Nose Cap EZ Twist™ Nose Cap Wrench Wrench Weight [oz.] 25 22.5 20.0 18.0 18.0 Warranty 2 year 2 year 2 year 2 year 2 year High Intermediate Models: Models: Premium Rotary Tools, able t o perform the wide st range o f applications. High Performance Rotary Tools, able to tackle a wider r ange of applications. 4 200 SERIES, STYLUS, 7700 100 SERIES, 7300 ROTARY TOOL OVERVIEW CORDLESS Model 8220 8100 STYLUS™ 7700 7300 Voltage 12Vmax 8Vmax 7.2 7.2 4.8 Battery Type Lithium Ion Lithium Ion Lithium Ion Ni-Cd Ni-Cd Speed Range [RPM] 5,000— 30,000 5,000— 30,000 5,000— 25,000 10,000 and 20,000 6,500 and 13,000 Versatility Level High Intermediate Basic + Basic + Basic Electronic Feedback Control No No No No No Number of Speeds Variable Variable Variable 2 2 Soft Grip Yes Yes Yes No No Separate On/Off Speed Control Yes Yes Yes No No Accessory Change System EZ Twist™ Nose Cap EZ Twist™ Nose Cap Wrench Wrench Wrench Weight [oz.] 22.0 14.0 9.0 12.0 9.0 Warranty 2 year 2 year 2 year 2 year 2 year Basic + Basic Models: Models: Enhanced Level Rotary Tools, with improved control across multiple applications. Entry Level Rotary Tools, ideal for precision applications. 5 1 2 3 NEW! PULL INSERT SECURE Integrated EZ Change™ For the fastest and easiest accessory change. Patented pull lever system Means you'll never need to look for the wrench again. Variable Speed For maximum accessory versatility and precise tool control. Electronic Feedback Auto adjusts power and speed as needed. Can be used with all Dremel accessories and attachments except MS400 and PL400 attachments.* High-Performance Motor For maximum performance at all speeds. Separate On/Off Switch Retains speed setting for ease of use. Increased power and air flow For cooler operation. Limited Warranty CORDED ROTARY TOOLS Versatility * Attachment models 225, 575 and 670 are compatible with the 4200 when used with the 4200 Attachment Adapter found in your Dremel 4200 kit. 6 EZC480 EZC481 EZC482 EZC483 • 4200 High Performance Rotary Tool, Circle Cutter, Safety Shield, Cutting Guide, Lawn Mower Sharpener, Lawn Mower and Garden Tool Sharpener, Sanding/Grinding Guide, Detailers Grip • Storage Case, Accessory Case, Product Reference Sheet, Adapter/Drive Coupling 40 ASSORTED ACCESSORIES Carving/Engraving - 107, 191 Grinding/Sharpening - 932, 8193, 84922 Cutting - EZ409, EZ456, 561 Cleaning/Polishing - 403, 428 Sanding - EZ407, 408 (x6), EZ411 (x3) EZ412 (x3), EZ413 (x3), 432 (x6), 445 (x6) Miscellaneous - 150, EZ402 4200 KIT 4200 - 6/40 The following 4200-specific collets are available for purchase. Call 1-800-4-DREMEL for more information. 2615001034 – EZC480 2615001035 – EZC481 2615001036 – EZC482 2615001037 – EZC483 1/8" 3/32" 1/16" 1/32" 3,2 mm 2,4 mm 1,6 mm 0,8 mm 4200 COLLETS 7 Electronic Feedback Auto adjusts power and speed as needed. EZ Twist™ Nose Cap Wrench for fast accessory changes. Variable Speed For maximum accessory versatility and precise tool control. Can be used with all Dremel accessories and attachments. Does it All, Better.™ Limited Warranty Versatility CORDED ROTARY TOOLS High-Performance Motor For maximum performance at all speeds. Separate On/Off Switch Retains speed setting for ease of use. 360º Grip Zone With soft grip for comfort and control. Quick Collet Lock For fast accessory changes. Integrated nose cap wrench for fast accessory changes. 8 • 4000 High Performance Rotary Tool, Planer, Flex Shaft, Circle Cutter, Sanding/Grinding Guide, Cutting Guide, Detail Nose Piece, Lawn Mower and Garden Tool Sharpener • Storage Case, Accessory Case, Product Reference Sheet, Wrench, 1/8" Collet • 4000 High Performance Rotary Tool, Detailer’s Grip, Sanding/Grinding Guide, Cutting Guide, Circle Cutter • Storage Case, Accessory Case, Product Reference Sheet, Wrench, 1/8" Collet • 4000 High Performance Rotary Tool, Sanding/ Grinding Guide, Circle Cutter • Storage Case, Accessory Case, Product Reference Sheet, Wrench, 1/8" Collet Carving/Engraving - 107, 191, 194 Grinding/Sharpening - 541, 932, 8193, 84922 Cutting - 420 (x4), 540, 561, EZ409, EZ456 (x2), EZ476 (x2) Cleaning/Polishing - 405, 414 (x3), 421, 428, 429, 442, EZ423 Sanding - 407, 408 (x2), 411 (x2), 412 (x2), 413 (x2), 432 (x2), 445 (x2), EZ511, EZ512 Miscellaneous - 150, 401, 402, 481, EZ402 50 ASSORTED ACCESSORIES Carving/Engraving - 107, 191 Grinding/Sharpening - 932, 8193, 84922, 85602 Cutting - 420 (x2), 540, 561, EZ456 Cleaning/Polishing - 403, 414 (x3), 421, 428, 429 (x2), 802 Sanding - 407, 408, 411 (x2), 412, 413, 432 (x3), 445 (x2) Miscellaneous - 401, 402, 481, EZ402 34 ASSORTED ACCESSORIES Carving/Engraving - 191 Grinding/Sharpening - 541, 932, 84922 Cutting - 420 (x2), 426 (x2), 561 Cleaning/Polishing - 403, 414, 421, 428, 429 Sanding - 407, 408 (x3), 411 (x3), 412 (x2), 413 (x2), 432 (x2), 445 (x2) Miscellaneous - 401, 402 30 ASSORTED ACCESSORIES 4000 KIT 4000 - 6/50 4000 KIT 4000 - 4/34 4000 KIT 4000 - 2/30 9 Versatility Does it Better.™ CORDED ROTARY TOOLS Limited Warranty EZ Twist™ Nose Cap Wrench for fast accessory changes. Variable Speed For maximum accessory versatility and precise tool control. Sealed Ball Bearing Motor Runs cool for comfort and longer tool life. Can be used with all Dremel accessories and attachments except MS400 and PL400 attachments. Separate On/Off Switch Retains speed setting for ease of use. Double hull construction Eliminates direct heat transfer to hand. 10 • 3000 Series Variable Speed Rotary Tool, Sanding/Grinding Guide • Storage Case, Accessory Case, Product Reference Sheet • Wrench, 1/8" Collet • 3000 Series Variable Speed Rotary Tool, Cutting Guide • Storage Case, Accessory Case, Product Reference Sheet • Wrench, 1/8" Collet Carving/Engraving - 191 Grinding/Sharpening - 932, 952, 85422 Cutting - 426 (x2) Cleaning/Polishing - 403, 414 (x2), 421, 428, 429 Sanding - 407, 408, 430, 432 (x2), 438, 445 (x2), 446 Miscellaneous - 401, 402, 415 24 ASSORTED ACCESSORIES Carving/Engraving - 107, 191, 7144 Grinding/Sharpening - 932, 952, 953, 84922 Cutting - 426 (x2), 560, 561 Cleaning/Polishing - 403, 404, 405, 414 (x2), 421, 428, 429 (x2) Sanding - 407, 408 (x2), 432 (x2), 445 (x2) Miscellaneous - 150, 401, 402, 415 31 ASSORTED ACCESSORIES 3000 KIT 3000 - 1/24 3000 KIT 3000 - 1/31 11 Versatility Limited Warranty Two Speed control For application versatility and control. Sealed Ball Bearing Motor For cool running and longer tool life. • Two-Speed Rotary Tool, Lawn Mower and Garden Tool Sharpener • Corrugated Storage Case, Product Reference Sheet • Wrench, 1/8" Collet Carving/Engraving - 194 Grinding/Sharpening - 932, 8193, 83322 Cutting - 420, 426 Cleaning/Polishing - 421, 422, 425, 429 Sanding - 407, 408, 432 Miscellaneous - 401, 402 15 ASSORTED ACCESSORIES • Two-Speed Rotary Tool, Cutting Guide • Corrugated Storage Case, Product Reference Sheet • Wrench, 1/8" Collet CORDED ROTARY TOOLS 200 SERIES KIT 200 - 1/15 200 SERIES KIT 200 - 1/21 Carving/Engraving - 194 Grinding/Sharpening - 932, 8193, 83142, 84922 Cutting - 420, 426, 561 Cleaning/Polishing - 414 (x2), 421, 422, 425 (x2), 429 (x2) Sanding - 407, 432, 445 Miscellaneous - 401, 402, 415 21 ASSORTED ACCESSORIES 12 Single Speed control For fulltime 35,000 rpm operation. Sealed Ball Bearing Motor For cool running and longer tool life. Limited Warranty Ideal for sanding, carving and drilling. • Single-Speed Rotary Tool • Product Reference Sheet • Wrench, 1/8" Collet 100 SERIES KIT 100 - N/7 Versatility Grinding/Sharpening - 932, 84922 Cutting - 420 Sanding - 407, 432 Miscellaneous - 402, 415 7 ASSORTED ACCESSORIES 13 Limited Warranty CORDLESS ROTARY TOOLS Does it All, Unplugged.™ Next Generation 12V Max For maximum performance and run time. Removable Lithium-Ion Battery Always ready with no memory effects. EZ Twist™ Nose Cap Wrench for fast accessory changes. Variable Speed For maximum accessory versatility and precise tool control. Versatility High-Performance Motor For maximum performance at all speeds. Can be used with all Dremel accessories and attachments. Separate On/Off Switch Retains speed setting for ease of use. 360º Grip Zone With soft grip for comfort and control. NEW! NEW! LITHIUM-ION TECHNOLOGY • More power in a smaller size • Always ready – holds charge up to 2 years • No memory effects – charge any time * When compared to 8200 while cutting screws 14 B812-01 876 12VMAX Lithium-Ion Battery Pack 12VMAX 1-Hour Lithium-Ion Battery Charger • 8220 Cordless 12VMAX High Performance Rotary Tool, Cutting Guide • 1-Hour Battery Charger, 12VMAX Lithium-Ion Battery Pack (1) • Storage Case, Accessory Case, Product Reference Sheet • Wrench, 1/8" Collet Grinding/Sharpening - 541, 8193 Cutting - 426, 561 Cleaning/Polishing - 414 (X4), 421, 425 (X4), 429 (X4) Sanding - 407, 408 (X2), 432 (X3), 445 (X3) Miscellaneous - 401, 402, 28 ASSORTED ACCESSORIES • 8220 Cordless 12VMAX High Performance Rotary Tool, Shield, Cutting Guide • 1-Hour Battery Charger, 12VMAX Lithium-Ion Battery Packs (2) • Storage Case, Accessory Case, Product Reference Sheet • Wrench, 1/8" Collet Grinding/Sharpening - 541, 8193 Cutting - 561, 426, EZ456 Cleaning/Polishing - 414 (X3), 421, 425 (x4), 429 (x3) Sanding - 407, 408 (X2), 432 (X3), 445 (X3) Miscellaneous - 401, 402, EZ402 28 ASSORTED ACCESSORIES Includes 2 batteries 8220 KIT 8220 - 1/28 8220 KIT 8220 - 2/28 CORDLESS 12VMAX ROTARY TOOL ACCESSORIES 15 Limited Warranty Versatility CORDLESS ROTARY TOOLS NEW! EZ Twist™ Nose Cap Wrench for fast accessory changes. Variable Speed For maximum accessory versatility and precise tool control. 8V Max Lithium-ion For power in a smaller size, always ready and no memory effects. Can be used with all Dremel accessories and attachments except MS400 and PL400 attachments. Separate On/Off Switch Retains speed setting for ease of use. Small and Lightweight For easier handling and less fatigue. 16 B808-01 876 • 8100 Cordless 8VMAX Rotary Tool • 1-Hour Charger, 8VMAX Lithium-Ion Battery Pack (1) • Compact Storage Case • Wrench, 1/8" Collet Grinding/Sharpening - 84922, 932, 952 Cutting - 540 (x3) Cleaning/Polishing - 403, 414 (x2), 421 Sanding - 407, 408 (x3), 432 (x3), 445 (x2) Miscellaneous - 401, 402 21 ASSORTED ACCESSORIES 8100 KIT 8100-N/21 CORDLESS 8VMAX ROTARY TOOL ACCESSORIES 8VMAX Lithium-Ion Battery Pack 8VMAX 1-Hour Lithium-Ion Battery Charger 17 Limited Warranty Versatility Variable Speed For maximum accessory versatility and precise tool control. Rechargeable 7.2V Lithium-ion Battery holds a charge 2 years while in storage. Unique Contoured Grip Designed for superior precision, control, and comfort in your hand. Finger-Tip On/Off Switch For one-handed operation. Compact and Ultra-Lightweight Can be used with most Dremel accessories and no attachments. Docking Station Continually charges so the tool is always fully charged and ready to use. CORDLESS ROTARY TOOLS • Always Ready • Goes Everywhere Created to Fit Your Hand and Your Lifestyle™ 18 • Dremel Stylus Rotary Tool • Charging Base and Accessory Organizer • Accessory Case, Product Reference Sheet • Wrench, 1/8" Collet Carving/Engraving - 105, 107, 191, 194 Grinding/Sharpening - 932, 84922 Cleaning/Polishing - 403, 414 (X4), 421, 425, 429 (X3) Sanding - 430, 431, 438 (X2), 446, 521E Miscellaneous - 401, 402, 481 25 ASSORTED ACCESSORIES STYLUS KIT 1100 - N/25 19 757-01 758-01 Two Speeds For control and accuracy. Removable battery pack Continuous use to finish your projects. 7.2 Volts of Power . . . goes anywhere. Light and Compact Easy to handle and fun to use — anywhere! 3-Hour Charger Quick battery recharge with LED light. Light indicates battery is correctly placed into the charger for proper charging. Versatility Limited Warranty CORDLESS ROTARY TOOLS 3-Hour Battery Charger 7.2V Battery Pack 7700 ACCESSORIES • 7.2V Two-Speed Cordless Rotary Tool, Lawn Mower and Garden Tool Sharpener • Corrugated Storage Case, Accessory Organizer, Product Reference Sheet • 3-Hour Charger • Wrench, 1/8" Collet Carving/Engraving - 191 Grinding/Sharpening - 932, 8193, 83322 Cutting - 420, 426 Cleaning/Polishing - 421, 422, 425, 429 Sanding - 407, 408, 432 Miscellaneous - 401, 402 15 ASSORTED ACCESSORIES 7700 KIT 7700-02 20 755-01 756-01 Two Speeds For control and accuracy. Removable battery pack Continuous use to finish your projects. 4.8 Volts of Power For light duty precision jobs. Light and Compact Easy to handle and fun to use — anywhere! 3-Hour Charger Quick battery recharge with LED light. Light indicates battery is correctly placed into the charger for proper charging. Versatility Limited Warranty 4.8V Battery Pack 7300 ACCESSORIES • 4.8V Two-Speed MINIMITE® • 3-Hour Charger • Wrench, 1/8" Collet Grinding/Sharpening - 84922 Cleaning/Polishing - 414 Sanding - 407, 432 Miscellaneous - 401 5 ASSORTED ACCESSORIES 3-Hour Battery Charger 7300 KIT 750-02 21 220 225 231 335 565 566 568 575 A576 A577 670 675 678-01 1453 2500-01 A550 A679-02 4200 • * • • • • • • * • • * • • • • • 4000 • • • • • • • • • • • • • • • • • 400 • • • • • • • • • • • • • • • • • 3000 • • • • • • • • • • • • • • • • • 300 • • • • • • • • • • • • • • • • • 398 • • • • • • • • • • • • • • • • • 395 • • • • • • • • • • • • • • • • • 285 • • • • • • • • • • • • • • • • • 275 • • • • • • • • • • • • • • • • 200 • • • • • • • • • • • • • • • • • 100 • • • • • • • • • • • • • • • • 8220 • • • • • • • • • • • • • • • • • 8200 • • • • • • • • • • • • • • • • • 8100 • • • • • • • • • • • • • • • 800 • • • • • • • • • • • • • • • 770 • • • • • 750 1100 7300 ROTARY TOOL ATTACHMENT COMPATIBILITY KEY SHIELD KIT MODEL A550 Increased comfort from debris and sparks during cutting, grinding, sanding, and polishing applications. • Easy to Use – Spring friction design allows for quick adjustment and accessibility to accessory. • Compact for greater maneuverability. Use this chart to find out which attachments work with your tool. Adapters may be needed. * This attachment is compatible with the 4200 when used with the 4200 Attachment Adapter found in your Dremel 4200 kit. Grinding/Sharpening - 8193 Cutting - EZ456 4 ASSORTED ACCESSORIES ROTARY TOOL ATTACHMENTS CORDLESS CORDED ATTACHMENT MODEL NUMBER Cleaning/Polishing - 428 Miscellaneous - EZ402 TOOL MODEL NUMBER 22 107 481 Functions as an articulating drill press that rotates 90º, rotary tool holder, and flex-shaft tool stand. • Detents click the tool in place in 15º increments from vertical to horizontal. • “Crow’s Nest” provides on-board storage for Dremel accessories. • Durable, die-cast aluminum base. WORK STATION™ MODEL 220 - 01 Ideal for hard to reach places and fine detail work. • Quick connect attach system. • 36" long cable with new 5" bend radius provides more flexibility. • Comfort grip hand piece. • Integrated shaft lock button. • Holds up to 1/8" shank. • Works with collet system and Dremel chuck. FLEX SHAFT ATTACHMENT MODEL 225 - 01 TOOLS NOT INCLUDED WITH ATTACHMENTS Transfers the weight of the tool to the palm of your hand for improved tool balance and control. • Offers enhanced grip and comfort for detailed applications. • Provides optimal tool control when precision is required. • Attaches onto a rotary tool in place of its nose piece for quick and easy installation. • Includes 107 engraving cutter and tracing stencil. DETAILER'S GRIP MODEL A577 23 • Allows for sturdy controlled cuts with maximum visibility. • Easy depth adjustment. Set to the correct cutting depth for the material you are working on. • Includes cutting guide, 2 drywall cutting bits for cutting drywall for electrical boxes & air vents. • Includes 1 multipurpose cutting bit for making cuts in ceiling tile, wood, plastic, fiberglass, drywall, laminate and vinyl siding. MULTIPURPOSE CUTTING KIT MODEL 565 Converts your corded Rotary Tool into a bench mounted wood shaper. • Features an adjustable fence and large 8" x 6" worktable. • Slot, groove, sand and trim edges. SHAPER/ROUTER TABLE MODEL 231 Converts your corded Rotary Tool into a plunge router. • Clear base. • Two depth stops. • Includes edge guide and circle guide. • Rout circles, parallel to edge, signs and inlay work and decorative edges. PLUNGE ROUTER ATTACHMENT MODEL 335 - 01 Gets a Grip on Anything, Anywhere! • Portable vise holds work piece for projects such as woodworking, home projects, crafts and hobbies. • Clamps to any work surface up to 2-1/2" thick. • Rotates 360º and tilts 50º allowing user to lock the workpiece in any position. • Tool holder turns Dremel Rotary Tools into a stationary sander, grinder or polisher. • Removable clamping jaws creates a stand-alone bar clamp. MULTI-VISE™ MODEL 2500 - 01 24 569 570 • Allows for sturdy controlled cuts with maximum visibility. • Easy depth adjustment. Set to the correct cutting depth for the material you are working on. • Includes cutting guide and tile cutting bit. • Shape ceramic wall tile around fixtures or plumbing pipes. Not for use on ceramic floor tile. • Also available: Model 570 1/8" Grout Removal Bit (Not included with 568). For use on wall and floor grout! • Multiple slide depth adjustment. • 30° angle for controlled cutting. • Guides 180° apart to keep bit centered between tiles. • Easy screw-on mounting. • Excellent cutting visibility. • Includes 1/16" Grout Removal Bit – Model 569. Made of solid carbide, the bit will remove both wall and floor grout. TILE CUTTING KIT MODEL 566 GROUT REMOVAL ATTACHMENT MODEL 568 TOOLS NOT INCLUDED WITH ATTACHMENTS Enhances the versatility of your Dremel Rotary Tool by allowing you to get into hard-to-reach areas. • Quick connect system easily attaches to your rotary tool in place of the housing cap, no wrenches required. • Compact, durable design for those “hard-to-reach” places. RIGHT ANGLE ATTACHMENT MODEL 575 25 561 932 407 Works great on wood and all wood-like materials. • Make clean, straight perpendicular cuts up to 1/4" thick. • Quick connect system attaches to your rotary tool in seconds. • Includes blade. • Long-lasting steel blade. • 1-1/4" diameter, 48 teeth. • One blade per package. • For use with Mini Saw Attachment only. CIRCLE CUTTER AND STRAIGHT EDGE GUIDE MODEL 678 - 01 The simple way to cut circular holes in many types of materials. Convenient measurement guides in both inches and centimeters, so you can cut out the right-sized circle every time. • Makes circles from 3/4" -12" (1.9-30 cm). • Attaches quickly and easily without tools. • Depth adjustment allows easy setting of the correct cutting depth. • Straight Edge Guide allows routing or cutting in a straight line. • Includes 1/8" Multipurpose Cutting Bit – Model 561 (see p. 34). Stabilizes a handheld tool by providing an edge guide or serves as a work platform when the tool is mounted in a secure position. • Increased control during sanding and grinding applications. • Platform provides greater stability during edge sanding and sharpening. • Adjustable depth control for a precise finish. • Attaches onto a rotary tool in place of its nose piece for quick and easy installation. • Includes 407 1/2" 60 grit sanding drum, 932 aluminum oxide grinding stone and instructions. SANDING/GRINDING GUIDE™ MODEL A576 MINI SAW ATTACHMENT MODEL 670 RIP CROSSCUT BLADE MODEL 546 26 932 The Dremel chain saw sharpening attachment as well as the Dremel lawn mower and garden tool sharpening attachment are included together in one kit for your convenience. • Guide provides optimum sharpening angle. • Sharpens all rotary lawn mower blades. • Easily sharpen the dullest of chains. • Garden Tool Sharpening Attachment, Lawn Mower Sharpening Attachment, Chain Saw Sharpening Attachment • Wrench, Gauge • 2 Spacers • Instruction Manual • 4 Sharpening Stones Nos. 453, 454, 455, (see p. 30) and 932 (see p. 31) Easily sharpen the dullest of chains. • Sharpening Attachment • 3 Sharpening Stones Nos. 453, 454 and 455 (see p. 30) • Gauge • 2 Spacers • Wrench • Instruction Manual The fastest, easiest, safest way to sharpen your lawn mower blade and other garden tools. • Guide provides optimum sharpening angle. • Sharpens most rotary lawn mower blades. • Long-wearing ABS plastic material. • Includes grinding stone, #932 (see p.31). LAWN MOWER & GARDEN TOOL SHARPENER MODEL 675 LAWN MOWER, GARDEN TOOL, AND CHAIN SAW SHARPENING KIT MODEL A679 - 02 CHAIN SAW SHARPENING ATTACHMENT MODEL 1453 TOOLS NOT INCLUDED WITH ATTACHMENTS 27 9931 9933 9934 9935 9936 100 114 115 (x2) 116 117 (x2) 118 121 124 125 (x2) 134 144 190 191 192 (x2) 193 194 (x2) 196 (x2) 199 480 1/4" 5/16" 5/16" 5/16" 3/4" 6,4 mm 7,9 mm 7,9 mm 7,9 mm 19,1 mm 1/4" 5/16" 5/16" 1/4" 1/4" 1/8" 1/4" 5/16" 1/4" 6,4 mm 7,9 mm 7,9 mm 6,4 mm 6,4 mm 3,2 mm 6,4 mm 7,9 mm 6,4 5/16" 5/16" 3/32 1/8" 3/16" 5/64" 1/8" 7/32" 3/8" 7,9 mm 7,9 mm 2,4 mm 3,2 mm 4,8 mm 2,0 mm 3,2 mm 5,6 mm 9,5 mm HIGH SPEED CUTTERS High speed cutters can be used for shaping, hollowing, grooving, slotting, making tapered holes in soft metals, plastics and woods. # 199 cutter can be used to make small slits. STRUCTURED TOOTH TUNGSTEN CARBIDE CUTTERS Fast-cutting sharp teeth for greater material removal. Use on fiberglass, wood, plastic, epoxy, rubber, laminates, particle board and ceramic tile. CARVING/ENGRAVING NEW UNIVERSAL SHANK STANDARD ROTARY TOOL ACCESSORIES NO MORE HUNTING FOR THE RIGHT COLLET Over the next year, all Dremel rotary accessories are transitioning to a 1/8" shank standard. This means never having to search for the right collet again. Colet 480 will soon work for all rotary accessories. CARVING SOFT MATERIALS * As this conversion will take some time, please refer to accessory packaging to verify accessory shank size. 1/8" 28 7103 7105 7120 7122 7123 7134 7144 7150 9901 9902 9903 9904 9905 9906 9909 9910 9911 105 (x2) 106 (x2) 107 (x2) 108 109 110 111 113 7103 (x1) 7144 (x1) CARVING/ENGRAVING 5/64" 11/64" 17/64" 3/32" 3/16" 5/64" 3/32" 2,0 mm 4,4 mm 6,7 mm 2,4 mm 4,8 mm 2,0 mm 2,4 mm Dual Package 1/8" 3/32" 1/8" 3/32" 1/8" 1/8" 1/8" 1/8" 1/8" 3,2 mm 2,4 mm 3,2 mm 2,4 mm 3,2 mm 3,2 mm 3,2 mm 3,2 mm 3,2 mm ENGRAVING CUTTERS Quality cutters for detail engraving, carving, routing in wood, fiberglass, plastic and soft metals. DIAMOND WHEEL POINTS For fine detail work, engraving, carving, touch-up and finishing. Use on wood, jade, ceramic, glass, hardened steel, semi precious stones and other hard materials. Bits are covered with diamond particles. 1/32" 1/16" 3/32" 1/32" 1/16" 5/64" 1/32" 1/16" 0,8 mm 1,6 mm 2,4 mm 0,8 mm 1,6 mm 2,0 mm 0,8 mm 1,6 mm ENGRAVING ENGRAVING CARVING HARD MATERIALS SOFT MATERIALS HARD MATERIALS TUNGSTEN CARBIDE CUTTERS Use for shaping, smoothing and material removal. Use on hardened steel, stainless steel, cast iron, nonferrous metals, fired ceramics, plastics, hardwoods and other hard materials. Not for use with floor tile. 29 612 615 617 618 640 650 652 654 655 ROUTER BITS For routing, inlaying, and mortising in wood and other soft materials. Use with Dremel # 330 Router Attachment, # 335 Plunge Router Attachment, and # 231 Shaper/Router Table. Made of high speed steel. 3/32" 2,4 mm Piloted Beading 1/8" 3,2 mm Corner Rounding 1/4" 6,4 mm Core Box 1/2" 12,7 mm Chamfer 1/4" 6,4 mm V-Groove 1/8" 3,2 mm Straight 3/16" 4,8 mm Straight 1/4" 6,4 mm Straight 5/16" 7,9 mm Keyhole ROUTING ROTARY TOOL ACCESSORIES 30 453 (x2) 454 (x2) 455 (x2) 500 516 541 EZ541GR CHAIN SAW SHARPENING STONES – 453, 454, 455 Precision-ground for quick, easy sharpening of chain saw blades. Each package contains 2 stones. ALUMINUM OXIDE ABRASIVE WHEEL – 500 Perfect for cleaning, de-burring, removing rust, and polishing of most metals, including stainless steel. ALUMINUM OXIDE ABRASIVE POINT – 516 Abrasive point is great for finishing work and light de-burring. It can be used for paint and rust removal without removing any of the base material. ALUMINUM OXIDE GRINDING WHEEL – 541 Use for de-burring, rust removal and general purpose grinding. 2 Per Pack. Use 541 with Mandrel 402. EZ Lock™ 1-½" ALUMINUM OXIDE GRINDING WHEEL – EZ541GR For use with EZ Lock™ mandrel EZ402. 5/32" 3/16" 7/32" 4,0 mm 4,8 mm 5,6 mm 1" 25,4 mm 1/2" 12,7 mm 7/8" 22,2 mm 1-1/2" 38,1 mm GRINDING/SHARPENING FERROUS MATERIALS 31 971 997 8153 8175 8193 8215 911 932 941 945 952 953 (x2) 83142 83322 83702 84922 (x2) 85422 85602 85622 ALUMINIUM OXIDE GRINDING STONES (ORANGE/BROWN) Use on metals, castings, welded joints, rivets and rust. Ideal for sharpening, de-burring and general purpose grinding of most materials. 5/8" 1/8" 3/16" 3/8" 5/8" 1" 15,9 mm 3,2 mm 4,8 mm 9,5 mm 15,9 mm 25,4 mm 7/16" 3/8" 5/8" 3/16" 3/8" 1/4" 11,1 mm 9,5 mm 15,9 mm 4,8 mm 9,5 mm 6,4 mm SILICON CARBIDE GRINDING STONES (BLUE/GREEN) Designed to work well on stone, glass, ceramics, porcelain and non-ferrous metals. 9/32" 1/8" 1/8" 3/16" 25/32" 13/32" 1/2" 7,1 mm 3,2 mm 3,2 mm 4,8 mm 19,8 mm 10,3 mm 12,7 mm GRINDING/SHARPENING ROTARY TOOL ACCESSORIES FERROUS MATERIALS NON-FERROUS MATERIALS 32 EZ406 EZ409 EZ426CU EZ456 EZ456B EZ476 1 2 3 EZ L ock™ EZ Lock™ STARTER KIT – EZ406 Includes 1 EZ Lock™ mandrel and 5 reinforced cut-off wheels. EZ Lock™ 1-½" THIN REINFORCED CUT-OFF WHEEL – EZ409 For use with EZ Lock™. Reinforced cut-off wheels for cutting metal. 2X more cuts compared with 409. 5pc. EZ Lock™ 1-¼" REINFORCED CUT-OFF WHEEL – EZ426CU For use with EZ Lock™. Reinforced cut-off wheels for cutting metal. 2X more cuts compared with 420. 3pc. EZ Lock™ 1-½" REINFORCED CUT-OFF WHEEL – EZ456 For use with EZ Lock™. Reinforced cut-off wheels for cutting metal. 2X more cuts compared with 426. 5pc. EZ Lock™ 1-½" REINFORCED CUT-OFF WHEEL BULK PACK – EZ456B For use with EZ Lock™. Reinforced cut-off wheels for cutting metal. 12pc. Bulk pack. EZ Lock™ 1-½" REINFORCED CUT-OFF WHEEL – EZ476 For use with EZ Lock™. Reinforced cut-off wheel makes clean cuts in plastic. 5pc. Faster Accessory Changes – Easy As 1, 2, 3 Pul l – Twist – Release CUTTING 33 409 420 540 426 456 426B 543 EZ544 546 CUT-OFF WHEELS – 409, 420, 540 For slicing and cutting metal, wood and plastic. Cut-off wheels make it easy to cut or slot bolts, screws, sheet metal, thin wood and plastic. The cut-off wheel cuts only along its edge. Do not attempt to sand or cut curved holes with them. Use with mandrel 402. FIBERGLASS REINFORCED CUT-OFF WHEELS – 426, 456 Use with mandrel 402. 456 package includes a washer set only used with 456. Mandrel 402 is sold separately. CARBIDE CUTTING/SHAPING WHEEL – 543 For cutting and shaping on soft and hard woods, fiberglass, plastics and laminates. Do not use on metal. Mandrel included. Thickness .070" (1,8 mm). EZ Lock™ 1-½" CARBIDE CUTTING WHEEL – EZ544 For cutting and shaping on soft and hard woods, fiberglass, plastics and laminates. Do not use on metal. For use with EZ Lock™ mandrel. RIP/CROSSCUT BLADE – 546 For use with Mini Saw Attachment 670 only (page 25). Thickness .023" (0,6 mm). 1 - 1/4" 31,8 mm 1 - 1/2" 38,1 mm 15/16" 23,8 mm .025" thick 36 per pack 15/16" 23,8 mm .040" thick 20 per pack 1-1/4" 31,8 mm .0625" thick 5 per pack 1-1/4" 31,8 mm .045" thick 5 per pack 1-1/2" 38,1 mm .045" thick 10 per pack Cut-off wheel dispenser 20 per pack 1-1/4" 31,8 mm CUTTING ROTARY TOOL ACCESSORIES METAL (Limited use on wood and plastic) WOOD 34 545 EZ545 560 561 562 569 570 DIAMOND WHEEL – 545 Great for cutting, sawing and carving of hard materials such as marble, concrete, brick, porcelain, ceramics, hard epoxy, soft and hard wood. Mandrel 402 is included. Thickness .023" (0,6 mm). Do not run in excess of 20,000 RPM. EZ Lock™ 1-½" DIAMOND WHEEL – EZ545 For use with EZ Lock™. Diamond cutting wheel makes clean cuts in hard materials. 1 - 1/2" 38,1 mm 7/8" 22,2 mm 1/16" 1/8" 1,6 mm 3,2 mm CUTTING DRYWALL CUTTING BIT – 560* Gives you fast clean cuts in drywall. MULTIPURPOSE CUTTING BIT – 561* Cuts hardwood up to 3/8" and softwood up to 5/8". Also cuts plastic, fiberglass, drywall, laminate, aluminum & vinyl siding. TILE CUTTING BIT – 562* Cuts ceramic wall tile, cement board, and plaster. (Not for use on floor tile.) CARBIDE GROUT REMOVAL BITS – 569 AND 570† Ideal for replacing wall and floor grout or removing grout to replace broken tiles. * Use with cutting guide (page 23). † Use with grout removal guide (page 24). DRYWALL, MULTIPURPOSE, TILE AND GROUT HARD MATERIALS 35 414 422 429 423E 421 425 461 462 463 POLISHING ACCESSORIES – 414, 422, 429 Ideal for polishing metals and plastics. Using polishing compound # 421 with wheels produces a high luster. Use 414, 422 and 429 with Mandrel 401. POLISHING CLOTH – 423E Made to take a smooth finish and polish it to a high luster. Use with either EZ402, or with 402. Mandrels sold separately. POLISHING COMPOUND – 421 Use with felt or cloth accessories to polish metals and plastics. Compound will remove a dull oxidized film and/or light surface imperfections. A solid compound. EMERY IMPREGNATED POLISHING WHEEL – 425 Ideal for general polishing of most ferrous metal, stone, glass and ceramic. Use 425 with mandrel 402. RUBBER POLISHING POINTS – 461, 462, 463 Blue points for finishing and polishing all ferrous metals. Removes small burrs and scratch marks left by grinding and sanding, and cleans and defines grooves. Also effective on many stones and ceramics. Felt 1/2" dia. 6 per pack Felt 3/8" dia. Felt 1" dia. Cloth 1" dia. 1" 25,4 mm 1/4" 1/4" 1/4" 6,4 mm 6,4 mm 6,4 mm CLEANING/POLISHING ROTARY TOOL ACCESSORIES 36 520 538 403 404 405 428 442 443 530 531 532 535 536 537 POLISHING WHEEL – 520 Use for light stock removal and high luster polishing of metals and hard plastics. The wheel is impregnated with a silicon carbide abrasive and lubricant, eliminating the need for polishing compound. ABRASIVE BRUSH – 538 Dremel’s strongest and longest lasting brush. Extra-thick nylon bristles are coated with an abrasive grit for material removal on the toughest jobs. Use for de-burring metal or wood and for removing rust and paint. Do not run brush in excess of 20,000 RPM. BRISTLE BRUSHES – 403, 404, 405 Use for light de-burring, cleaning, polishing of silverware, jewelry and other precious metals; can use with polishing compound. CARBON STEEL BRUSHES – 428, 442, 443 Versatile brush for removing rust and corrosion, polish metal surfaces. De-burr and blend surface junctures, clean electrical components. STAINLESS STEEL BRUSHES – 530, 531, 532 Stainless steel brushes do not cause “after-rust” when used on corrosive-resistant materials like pewter, aluminum and stainless steel. BRASS BRUSHES – 535, 536, 537 Brass brushes are non-sparking and softer than steel. They will not scratch soft metals like gold, copper, brass. Do not run brushes in excess of 15,000 RPM. CLEANING/POLISHING 3/4" 1/2" 1/8" 19,1 mm 12,7 mm 3,2 mm 3/4" 1/2" 1/8" 19,1 mm 12,7 mm 3,2 mm 1" 25,4 mm 1/2" 12,7 mm 3/4" 1/2" 1/8" 19,1 mm 12,7 mm 3,2 mm 3/4" 1/2" 1/8" 19,1 mm 12,7 mm 3,2 mm 37 EZ471SA EZ472SA EZ473SA 502 503 504 505 801 511E 512E (x2) DETAIL ABRASIVE BRUSHES – EZ471SA, EZ472SA, EZ473SA Great for detail cleaning and light sanding. Use on metal, glass, wood, aluminum and plastics. Use with either EZ402, or 402. Mandrels sold separately. Not to be used in excess of 15,000 RPM. FINISHING ABRASIVE BUFFS – 511E, 512E Great for cleaning and light sanding. Use on metal, glass, wood, aluminum and plastics. The 512 fine-grit buff is particularly ideal for removing tarnish from brass. Use 511E and 512E with either EZ402, or 402. Mandrels sold separately. Not to be used in excess of 15,000 RPM. FLAPWHEELS – 502, 503, 504, 505 Flapwheels grind and polish flat or contoured surfaces. They are used most effectively as a finishing sander after heavier surface sanding and material removal is completed. CARBIDE SHAPING WHEEL – 801 A powerful shaping tool that quickly and efficiently removes material. Easily creates compound curves and works on a variety of materials including woods, fiberglass, laminates, plastic, and leather. Mandrel included. Not to be used for cutting. Grit: 36 120 220 Coarse Medium Fine Grit: 80 120 80 120 60 3/8" 3/8" 3/16" 3/16" 1-1/4" 9,5 mm 9,5 mm 4,8 mm 4,8 mm 31,8 mm SANDING ROTARY TOOL ACCESSORIES 180 280 Coarse Medium 320 Fine 38 430 431 (x6) 438 (x6) 446 (x6) 407 408 (x6) 432 (x6) 445 (x6) 411 412 413 EZ411SA (x5) EZ412SA (x5) EZ413SA (x5) EZ407SA SANDING BANDS – 407, 408, 430, 431, 432, 438, 445, 446 For rough shaping and smoothing wood and fiberglass; removing rust from metal surfaces; shaping rubber surfaces. Sander bands are easily replaceable on drums, and are available in packages of 6 each. EZ DRUM SANDING MANDREL – EZ407SA Resilient rubber sleeve forms around 4 tabs to keep accessory secure. Contoured collar holds entire assembly in place. Currently sold with one sanding band. More accessories to come! SANDING DISCS – 411, 412, 413, EZ411SA, EZ412SA, EZ413SA For rough shaping and smoothing wood and fiberglass; removing rust from metal surfaces; shaping rubber surfaces. Use 411, 412 and 413 with mandrel 402. 36 pieces per pack. Use EZ411SA, EZ412SA and EZ413SA only with the EZ402 mandrel. 5 pieces per pack. 1/4" diameter 1/2" diameter 3/4" diameter Grit: 60 120 240 60 120 240 Grit: 180 220 240 60 120 240 Coarse Medium Fine Coarse Medium Fine SANDING 39 401 402 EZ402 4486 4485 480 481 482 483 90930-04 90930-04 90931 90935 90826* 90827* 90828* 90936 90930* 90929* 90930* 90937 90940 MANDREL – 401 Use with 414, 422 and 429. MANDREL – 402 Use with 409, 411, 412, 413, 420, 423E, 425, 426, 429, 456, EZ471SA, EZ472SA, EZ473SA, 511E, 512E, 540, and 541. EZ Lock™ MANDREL – EZ402 Use with EZ407SA, EZ409, EZ426CU, EZ456, EZ411SA, EZ412SA, EZ413SA, EZ471SA, EZ472SA, EZ473SA, EZ476, 423E, 511E, 512E, EZ541GR, EZ544 and EZ545. DREMEL CHUCK – 4486 This chuck allows you to quickly and easily change accessories on Dremel Rotary Tools without changing collets. Accepts accessories with 1/32" - 1/8" shanks. Use with rotary tool models 100, 200, 275, 285, 300, 3000, 395, 398, 400, 4000, 750, 770, 780, 800 and 8200. Also use with Dremel attachments 212, 225, 575, and 961. QUICK CHANGE COLLET NUT SET – 4485 Includes Collet Nut and 4 Collets. For use with all Rotary Tools except models 1, 2 & 260, 270, 280 series 1 or earlier. Collets also available separately. 1/8" 3/32" 1/16" 1/32" 3,2 mm 2,4 mm 1,6 mm 0,8 mm MISCELLANEOUS * Available as service part only. ROTARY TOOL ACCESSORIES MANDRELS AND COLLETS CARBON MOTOR BRUSHES 100, 200, 275, 285, 4, 5, 300, 395, 595 & 3000 & 6 6000 1 & 2 398 732 Advantage 9000 400 XPR™ 4000 260 270, 280, 370 & 380 232 & 332 275, 285 & 395 1 & 2 275, 285, 300, 3, 4, 395 & 595 5 & 6 6000 1 & 2 BRUSH TOOLS TYPE BRUSH TOOLS TYPE 40 EZ495 90962 415 631-01 660 661 662DR 663DR 150 628 490 EZ TWIST NOSE CAP – EZ495 Loosen or tighten the collet and replace an accessory quickly and easily without the need for a wrench. WRENCH – 90962 For ease of changing bits. 3/8" x 1" DRESSING STONE – 415 Clean grinding wheels. Shape or reshape for desired applications. Available as service part only. COLLET FAN – 490 Blows dust away for greater visibility to work piece. Great for sanding, engraving, and carving. 1/8" DRILL BIT – 150 Available as service part only. DRILL BIT SET – 628 BRAD POINT DRILL BIT SET – 631-01 Titanium coated brad points stay on center and begin drilling immediately. For use on wood. 1/32" DRILL – 660 4 pc. per pack. *Use with 483 collet. 3/64" DRILL – 661 4 pc. per pack. *Use with 482 collet. GLASS DRILLING BITS – 662DR, 663DR Diamond tipped drill bits for use on glass and ceramic wall tile. Lubricant included. 1/8" 1/32" 3/64" 1/16" 5/64" 3/32" 7/64" 1/8" 3,2 mm 0,8 mm 1,2 mm 1,6 mm 2,0 mm 2,4 mm 2,8 mm 3,2 mm 1/8" 5/32" 3/16" 1/4" 1/32" 3/64" 1/8" 1/4" 3,2 mm 4,0 mm 4,8 mm 6,4 mm 0,8 mm 1,2 mm 3,2 mm 6,4 mm MISCELLANEOUS DRILL BITS OTHER NEW! NEW! use 482 use 483 41 MINI ACCESSORY KITS GENERAL PURPOSE KIT – 687-01 Everything you need to cut, carve, sand, grind, clean, and polish, plus a whole lot more! Carving/Engraving - 194 Grinding/Sharpening - 952, 85422 Cutting - 409 (x36), 426 Cleaning/Polishing - 414 (x2), 421, 428, 429 (x2) Sanding - 407, 408, 432 (x2) Miscellaneous - 401, 402 52 ASSORTED ACCESSORIES ROUTER BIT KIT – 692 For routing, inlaying and mortising in wood and other soft materials. Use with #330 Router Attachment, #335 Plunge Router Attachment, and #231 Shaper/Router Table. CUTTING KIT – 688-01 Reslot a screw, cut conduit, sheet metal, rusted hose clamps, plus a whole lot more! Cutting - 409 (x36), 420 (x24), 426 (x3), 540 (x5) Miscellaneous - 402 69 ASSORTED ACCESSORIES CARVING/ENGRAVING KIT – 689-01 Carve intricate details, etch glass, stoneware, terracotta, plus a whole lot more! Carving/Engraving - 105, 106, 107, 108, 7103, 7134 Grinding/Sharpening - 83142, 83322 , 83702, 84922 Miscellaneous - 481 11 ASSORTED ACCESSORIES SANDING/GRINDING KIT – 686-01 Sharpen lawn tools, remove rust, sand down a sticking door, and engrave on glass, plus a whole lot more! Grinding/Sharpening - 932, 8193, 84922, 85422 Cutting - 426 Sanding - 407, 408 (x4), 432 (x4), 412 (x15), 511 Miscellaneous - 402 18 ASSORTED ACCESSORIES CLEANING/POLISHING KIT – 684-01 Polish a variety of materials to a high luster, clean those tough-to-reach areas, plus a whole lot more! Cleaning/Polishing - 403, 404, 405, 414 (x6), 421, 422, 425 (x2), 428, 429 (x3), 520 Miscellaneous - 401, 402 20 ASSORTED ACCESSORIES Routing - 612, 615, 617, 618, 650, 654 6 ASSORTED ACCESSORIES 42 SUPER ACCESSORY KIT – 709-01 This versatile and re-usable accessory kit includes everything you need to cut, grind, sand, polish, drill, sharpen, clean and more. Carving/Engraving - 191 Grinding/Sharpening - 952, 953, 83142, 84922 Cutting - 409 (x12), 420 (x12), 426, 540 Cleaning/Polishing - 405, 414 (x4), 421, 422, 428, 429 (x4) Sanding - 407, 408 (x6), 432 (x6), 430, 431 (x6), 438 (x6), 411 (x12), 412 (x12), 413 (x12), 511E Miscellaneous - 401, 402, 415, 90962 110 ASSORTED ACCESSORIES ALL-PURPOSE ACCESSORY KIT – 710-05 This versatile and re-usable accessory kit includes everything you need to cut, grind, sand, polish, drill, sharpen, clean and more. Carving/Engraving - 191 Grinding/Sharpening - 8193, 83142 Cutting - EZ409, EZ456, EZ476, 540 Cleaning/Polishing - 414 (x5), 421, 423E, 428, 429 (x4) Sanding - 407, 408 (x15), 432 (x15), 430, 431 (x15), 438 (x15), 411 (x24), 412 (x24), 413 (x24), 511E, 512E Miscellaneous - 401 (x2), 402, EZ402, 90962 160 ASSORTED ACCESSORIES EZ LOCK™ CUTTING KIT – EZ688-01 Reslot a screw, cut conduit, sheet metal, rusted hose clamps, plus a whole lot more! Cutting - EZ409 (x3), EZ456 (x4), EZ476 (x3) Miscellaneous - EZ402 11 ASSORTED ACCESSORIES EZ LOCK™ SANDING/POLISHING KIT – EZ684-01 Polish a variety of materials to a high luster, clean those tough-to-reach areas, remove rust, plus a whole lot more! Cleaning/Polishing - 423E, 421 Sanding - EZ471SA, EZ472SA, 511E, 512E 7 ASSORTED ACCESSORIES EZ LOCK™ SANDING/GRINDING KIT – EZ686-01 Contains all of the sanding and grinding products a consumer needs. Grinding - 952, 84922, EZ541GR Cutting - 426 Sanding - EZ407SA, 408 (x3), 432 (x3), EZ411SA (x2), EZ412SA (x2), EZ413SA (x2) Miscellaneous - EZ402 18 ASSORTED ACCESSORIES 43 The Makers of Versatile Tool Systems™ OSCILLATING TOOLS 44 WHAT IS AN OSCILLATING TOOL? Multi-Max™ oscillating tools, like rotary tools, use a variety of accessories to accomplish a wide range of DIY tasks for repair, remodeling and restoration. However, rather than spinning like a rotary tool, Multi-Max™ oscillating tools use rapid side- to-side motion to cut, scrape, sand, remove grout, grind and more. You can rest assured that a Dremel Multi-Max™ oscillating tool will help you get the job done with superior versatility, durability, and control. 45 1 2 3 Repair. R emodel. R estore. Faster. ™ Limited Warranty CORDED OSCILLATING TOOLS For tool-less and secure accessory changes. Unlock – Inser t – Lock ACCESSORIES Quick Lock™ For tool-less and secure accessory changes. High-Performance 2.5 Amp Motor For the most demanding applications. Variable Speed For optimal performance and control in a variety of materials. Electronic Feedback Auto adjusts power and speed as needed. 65% More Power vs. the 6300 Separate On/Off Switch Retains speed setting for ease of use. Compact design Provides easy access to tight areas. Quick Fit™ Accessory Interface System For fast accessory changes without removing the clamping screw. 46 MULTI-MAX™ KIT MM40-01 • Dremel Multi-Max™ MM40 tool Cutting - MM480, MM482, MM450 Scraping - MM600 Sanding - MM14, MM70W (x10), MM70P (x5) Misc - Storage Case 21 ASSORTED PIECES 47 Repair. R emodel. R estore.™ Limited Warranty Separate On/Off Switch Retains speed setting for ease of use. Compact design Provides easy access to tight areas. CORDED OSCILLATING TOOLS ACCESSORIES Powerful 2.3 Amp Motor Easily tackles the toughest applications. Variable Speed For optimal performance and control in a variety of materials. Quick Fit™ For fast accessory changes without removing the clamping screw. 50% More Power vs. the 6300 Efficient Motor Runs cool and smooth under load. 48 • Dremel Multi-Max™ MM20 tool Cutting - MM450, MM480 Scraping - MM610 Sanding - MM11, MM70W (x8), MM70P (x3) Misc - Storage Case, Allen Wrench 17 ASSORTED PIECES MULTI-MAX™ KIT MM20-03 CORDED OSCILLATING TOOL OVERVIEW Model MM40 MM20 Amps 2.5 2.3 OPM 10,000–21,000 10,000–21,000 Electronic Feedback Control Yes No Number of Speeds Variable Variable Soft Grip Yes Yes Separate On/Off Yes Yes QuickFit™ Accessories Yes Yes Tool-less Accessory Change System Yes No Weight 2 lb. 15 oz. 2 lb. 7 oz. Warranty 2 year 2 year 49 Repair. R emodel. R estore. Unplugg ed.™ Limited Warranty Variable Speed For optimal performance and control in a variety of materials. High Performance Motor Cuts through a 1-1/4" oak door jamb. Quick Fit™ For fast accessory changes without removing the clamping screw. Compact design Provides easy access to tight areas. CORDLESS OSCILLATING TOOLS Separate On/Off Switch Retains speed setting for ease of use. Cordless For added convenience and versatility. ACCESSORIES 50 875 876 12VMAX 1-Hour Lithium-Ion Battery Charger 12VMAX 1-Hour Lithium-Ion Battery Pack • Cordless Dremel Multi-Max™ 8300 Tool • 1-Hour Battery Charger • 12VMAX Lithium-Ion Battery Packs (2) Cutting - MM440, MM450 Sanding - MM11, MM70W (x3) Misc - Storage Case, Allen Wrench 8 ASSORTED PIECES CORDLESS 12VMAX OSCILLATING TOOL ACCESSORIES CORDLESS MULTI-MAX™ KIT 8300-01 51 MM470 MM472 MM480 MM482 MM411 MM422 MM440 MM430 MM435 MM450 MM452 MM460 MM462 3" Wood & Drywall Saw Blade 3.5" Wood & Metal Saw Blade 3/4" Wood & Metal 1-1/4" Wood Flush Cut Blade 1-1/4" Wood & Metal Flush Cut Blade 3/8" Wood Flush Cut Blade Flush cut a baseboard to install new flooring or cut out drywall to install a new light switch. Choose from 13 blades to accomplish a variety of tough cuts. 3/4" Wood & Metal Flush Cut Blade 1-1/8” Wood Flush Cut Blade 3/4" Wood Flush Cut Blade Multi-Knife Drywall Jab Saw 3/4" Wood Flush Cut Blade 1-1/8" Wood & Metal Flush Cut Blade OSCILLATING TOOL ACCESSORIES CUTTING NEW! NEW! Dremel Multi-Max™ accessories undergo rigorous testing so you can feel assured that you are purchasing a product of proven value & performance. 52 MM720/MM725 MM723 MM422B (x3) MM440B (x3) MM450B (x3) MM472B (x3) MM491 MM721 (x3) MM722 (x3) MM900 MM920 Multi-Flex™ Spiral Blade Multi Flex™ Bracket MULTI-FLEX™ ACCESSORIES Multi-Flex™ Saw Blade Multi-Flex™ Carbide Blade 3-Pack Cutting Assortment (MM440, MM450, MM422) Bulk Packs - 3 per pack Carbide Rasp 60 Grit Diamond Paper Prepare surfaces for ceramic floor tile replacement. Use the diamond paper to remove cement, plaster, and thin-set mortar. Use the carbide rasp to grind and shape flat surfaces, cement, tile adhesives, stone and rasp wood. GRINDING 53 MM70P MM80P MM70W MM80W MM14 MM500 MM501 MM600 MM610 SCRAPING Rigid Scraper Blade Flexible Scraper Blade Use the rigid scraper blade for removing stuck vinyl flooring, carpeting and carpet pad, and the flexible scraper blade for projects such as removing old caulking around the tub or shower. 6 per pack: 80(2), 120(2), 240(2) Grit 6 per pack: 60(2), 120(2), 240(2) Grit 18 per pack: 80(6), 120(6), 240(6) Grit 18 per pack: 60(6), 120(6), 240(6) Grit Hook & Loop Pad Restore windows, make stuck doors work, and remove rust from metal. Available in assorted grit for sanding bare or painted wood and metal. Sanding Sheets - Paint Sanding Sheets - Wood SANDING Remove wall and floor grout to free a broken tile. Available in a 1/8" size and a 1/16" size. GROUT REMOVAL 1/16" Grout Removal Blade 1/8" Grout Removal Blade OSCILLATING TOOL ACCESSORIES 54 MM300 MM810 MM820 MM830 MM385-01 MM386 MM388 MM389 MULTI-MAX™ ATTACHMENTS 1-3/16" UNIVERSAL ADAPTER – MM300 Adapters allow use of Dremel accessories on most oscillating tools brands. Cutting Dept h Guide – MM810 Includes Depth Foot and Depth Stop. Dust Extraction COLLAR – MM830 NEW! NEW! ACCESSORY KITS NEW! NEW! ASSIST HANDLE – MM820 Only compatible on Multi-Max™ 6300. 5-Piece Multi-Max™ Cutting Kit MM422, MM440, MM450 (3) 6-Piece Multi-Max™ Cutting Kit MM300, MM462, MM470, MM450 (3) 14-Piece Multi-Max™ Accessory Kit MM300, MM482, MM610, MM450 (2), MM60W(9) 6-Piece Multi-Max™ Cutting Kit MM300, MM480, MM482, MM450 (3) 55 The Makers of Versatile Tool Systems™ SAW-MAX™ TOOL SYSTEM 56 WHAT IS A SAW-MAX™ TOOL? The new Dremel Saw-Max™ tool is reinventing cutting as we know it. This powerful tool performs smooth, precise cuts through a variety of materials including wood, metal, drywall, plastic, laminate flooring and floor and wall tile. Its compact design, adjustable foot and excellent line of sight make accurate one-handed operation simple. Offering two blade positions and a variety of unique attachments and accessories - this versatile tool system can help you make any straight, plunge, flush, angle or bevel cut. 57 Limited Warranty Versatile Cutting System Cuts wood, plastic, metal, tile, masonry & more. Two cutting wheel positions For straight, plunge and flush cuts. Powerful 6 Amp Motor For tough applications. Worm Drive Gearing For durability and power. Excellent line of sight For confident, precise cuts. Compact size and gripping zone For user friendly one handed operation. Adjustable Depth Guide And plunge action for precision and control. Dust Extraction Port For clean work environment. SAW-MAX™ TOOL SYSTEM • SAW-MAX™ SM20 Tool, 2 x 4 Guide, Dust Port Adapter • Storage Case Cutting - SM500, SM510, SM540, SM600 4 ASSORTED ACCESSORIES SAW-MAX™ KIT SM20-02 58 1 2 Interior Position For standard straight cuts. Exterior Position For flush cuts with SM600. Plunge Into Material For clean and precise cuts. One-handed Operation 2 CUTTING WHEEL POSITIONS 59 SM500 SM510 (x3) SM520 (x3) SM540 SM600 SAW-MAX™ ACCESSORIES Wood & Plastic Cutting Blade Metal Cutting Blade Masonry Cutting Blade Tile Cutting Blade Wood & Plastic Flush Cut Blade Dremel Saw-Max™ tool only uses Dremel Saw-Max™ accessories. CUTTING 60 SM842 TRSM810 TRSM800 SM840 SM844 1 2 3 4 SAW-MAX™ ATTACHMENTS Dust Port Adapter Miter Guide 2 x 4 Guide Straight Edge/ Circle Guide Angle cut to create miter joint (SM840) Bevel Cut for Corner Joint (SM840) Straight Cut to Butt Joint Trim at Door Jamb (SM840) Compound Miter Cuts for Crown Molding Joints (SM844) IDEAL FOR TRIMWORK NEW! Crown Moulding Guide 61 The Makers of Versatile Tool Systems™ TRIO™ TOOL SYSTEM 62 WHAT IS A TRIO™ TOOL? The Dremel Trio™ allows users to cut, sand, and rout using one multi-purpose tool. Featuring a system of accessories and attachments to increase versatility, Trio™ users can cut multiple materials including wood, plastic, drywall, sheet metal, wall tile and more without switching tools. The tool’s unique, 360-degree cutting technology and plunge-cut ability allows users to make quick and controlled cuts, while its unique, 90-degree pivoting handle facilitates added comfort, control, and accuracy. 63 Cut. Sand. Rout.™ Limited Warranty Variable Speed For maximum accessory versatility and precise tool control. 90º Pivoting Handle For superior comfort and control. Telescoping Foot For accurate depth control while cutting, sanding and routing. Lock-on Button For comfort during extended use. On Board Dust Extraction Port To maintain a clean workspace. Non-marring Base To protect delicate work pieces. Separate On/Off Switch Retains speed setting for ease of use. TRIO™ TOOL SYSTEM 64 TRSM800 TR820 • Dremel Trio™ Tool, Compact Depth Guide, Dust Port Adapter • Storage Case, Manual, Wrench Straight Edge/ Compact Depth Guide/Dust Port Adapter Circle Guide Cutting - TR563 Sanding - TR407, TR408 (x2), TR432 (x2), TR445 (x2) Routing - TR654 9 ASSORTED ACCESSORIES TRIO™ KIT 6800-02 TRIO™ ATTACHMENTS 65 TR560 TR561 TR562 TR563 TR407 TR408 (x6) TR432 (x6) TR445 (x6) TR451 Trio™ accessories are exclusive to the Dremel Trio™ tool system and not interchangeable with Dremel rotary tools. Dremel Trio™ tool only uses Dremel Trio™ 3/16" shaft accessories. PILOTED CUTTING BIT – TR560 Fast, clean cuts in drywall. MULTIPURPOSE CUTTING BIT (STEEL) – TR561 Softwood, plywood composites, drywall, acoustic tile, plastic and aluminum. WALL TILE CUTTING BIT – TR562 Wall tile, plaster, cement board and backer board. HARDWOOD/SHEET METAL BIT (CARBIDE) – TR563 Wood, plywood composites, laminate/engineered flooring and sheet metal. 1/2" SANDING BANDS – TR407, TR408, TR432, TR445 Shape wood and sand edges and curves. RANDOM ORBITAL SANDING KIT – TR451 Sand wood faces. TRIO™ TOOL ACCESSORIES TRIO™ CUTTING ACCESSORIES TRIO™ SANDING ACCESSORIES Grit: 60 120 240 NEW! 66 TR750 TR770 TR780 STRAIGHT ROUTER BIT KIT – TR750 STARTER ROUTER BIT KIT – TR770 SPECIALTY ROUTER BIT KIT – TR780 1/8" 3,2 mm Straight Router Bit 1/4" 6,4 mm Straight Router Bit 1/2" 12,7 mm Straight Router Bit 1/8" 3,2 mm Roman Ogee Router Bit 1/8" 3,2 mm Corner Rounding Router Bit 1/2" 12,7 mm V-Groove Router Bit 3/8" 9,5 mm Dovetail Router Bit 1/4" 6,4 mm Rabbet Router Bit 3/16" 4,8 mm Beading Router Bit 1/4" 6,4 mm Cove Router Bit 1/4" 6,4 mm Flush Trim Router Bit 1/4" 6,4 mm Chamfer Router Bit 1/4" 6,4 mm Roundnose Router Bit TRIO™ ROUTING ACCESSORIES 67 9924 9929 470 471 473 474 499 Multipurpose tool for wood burning, soldering, hot knife cutting of styrofoam and plastics, cutting and fusing rope. Max. Tip Temp: 1,050º F (565º C) | Volts: 110-120V, AC Watts: 30 | Tool Length: 7-3/8" (187,3 mm) Tool Weight: 2.5 oz. (71 g) • VersaTip™ Tool, Tool Stand, Handy Tip Storage Tube • 5 Tips (470, 471, 473, 474 & 499) VERSATIP™ KIT 1550 Limited Warranty VERSATIP™ MULTIPURPOSE TOOL Limited Warranty Identify and personalize your valuables. Use for decorative engraving. Engraves metal, glass, wood, plastic, and ceramics. Holding area allows for extended use. Soft grip adds extra comfort and control. Motor: 115V, AC/115V, 60Hz, .2 amps/0,2 A Strokes: 7,200/SPM | Tool Weight: 12 oz. (340 g) • Engraver Tool, Letter / Number Template • Carbide Point (9924) ENGRAVER KIT 290-01 Carbide Point – 9924 For most applications Diamond Point – 9929 For continuous use ENGRAVER ACCESSORIES Available only through Service Center. Soldering Tip – 470, General Purpose Tip – 471, Script Tip – 473, Fine Cutting Tip – 474, Hot Knife Tip – 499 VERSATIP™ ACCESSORIES ENGRAVER DP83846A DP83846A DsPHYTER - Single 10/100 Ethernet Transceiver Literature Number: SNLS063E DP83846A DsPHYTER — Single 10/100 Ethernet Transceiver ©2002 National Semiconductor Corporation www.national.com May 2002 DP83846A DsPHYTER — Single 10/100 Ethernet Transceiver General Description The DP83846A is a full feature single Physical Layer device with integrated PMD sublayers to support both 10BASE-T and 100BASE-TX Ethernet protocols over Category 3 (10 Mb/s) or Category 5 Unsheilded twisted pair cables. The DP83846A is designed for easy implementation of 10/100 Mb/s Ethernet home or office solutions. It interfaces to Twisted Pair media via an external transformer. This device interfaces directly to MAC devices through the IEEE 802.3u standard Media Independent Interface (MII) ensuring interoperability between products from different vendors. The DP83846A utilizes on chip Digital Signal Processing (DSP) technology and digital Phase Lock Loops (PLLs) for robust performance under all operating conditions, enhanced noise immunity, and lower external component count when compared to analog solutions. System Diagram Status 10BASE-T or MII 100BASE-TX 25 MHz Typical DsPHYTER application Ethernet MAC Magnetics RJ-45 Clock LEDs DP83846A 10/100 Mb/s DsPHYTER Features ■ IEEE 802.3 ENDEC, 10BASE-T transceivers and filters ■ IEEE 802.3u PCS, 100BASE-TX transceivers and filters ■ IEEE 802.3 compliant Auto-Negotiation ■ Output edge rate control eliminates external filtering for Transmit outputs ■ BaseLine Wander compensation ■ 5V/3.3V MAC interface ■ IEEE 802.3u MII (16 pins/port) ■ LED support (Link, Rx, Tx, Duplex, Speed, Collision) ■ Single register access for complete PHY status ■ 10/100 Mb/s packet loopback BIST (Built in Self Test) ■ Low-power 3.3V, 0.35um CMOS technology ■ Power consumption < 495mW (typical) ■ 5V tolerant I/Os ■ 80-pin LQFP package (12w) x (12l) x (1.4h) mm Applications ■ Network Interface Cards ■ PCMCIA Cards Obsolete 2 www.national.com DP83846A Figure 1. Block Diagram of the 10/100 DSP based core. SERIAL MANAGEMENT MII TX_CLK TXD[3:0] TX_ER TX_EN MDIO MDC COL CRS RX_ER RX_DV RXD[3:0] RX_CLK TRANSMIT CHANNELS & 100 Mb/s 10 Mb/s NRZ TO MANCHESTER ENCODER STATE MACHINES TRANSMIT FILTER LINK PULSE GENERATOR 4B/5B ENCODER PARALLEL TO SCRAMBLER NRZ TO NRZI ENCODER BINARY TO MLT-3 ENCODER 10/100 COMMON RECEIVE CHANNELS & 100 Mb/s 10 Mb/s MANCHESTER TO NRZ DECODER STATE MACHINES RECEIVE FILTER LINK PULSE DETECTOR 4B/5B DECODER DESCRAMBLER SERIAL TO PARALLEL NRZI TO NRZ DECODER MLT-3 TO 10/100 COMMON AUTO-NEGOTIATION STATE MACHINE REGISTERS AUTO 100BASE-TX 10BASE-T MII BASIC MODE PCS CONTROL PHY ADDRESS NEGOTIATION CLOCK CLOCK RECOVERY CLOCK RECOVERY CODE GROUP ALIGNMENT SMART SQUELCH RX_DATA RX_CLK RX_CLK RX_DATA TX_DATA TX_DATA TX_CLK SYSTEM CLOCK REFERENCE OUTPUT DRIVER TD± INPUT BUFFER BINARY DECODER ADAPTIVE RD± LED DRIVERS LEDS HARDWARE CONFIGURATION PINS GENERATION (AN_EN, AN0, AN1) CONTROL MII INTERFACE/CONTROL (PAUSE_EN) (LED_CFG, PHYAD) SERIAL BLW AND EQ COMP Obsolete 3 www.national.com DP83846A Table of Contents 1.0 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 MII Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.2 10 Mb/s and 100 Mb/s PMD Interface . . . . . . . . . . 6 1.3 Clock Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.4 Special Connections . . . . . . . . . . . . . . . . . . . . . . . 6 1.5 LED Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1.6 Strapping Options/Dual Purpose Pins . . . . . . . . . . 7 1.7 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.8 Power and Ground Pins . . . . . . . . . . . . . . . . . . . . . 9 1.9 Package Pin Assignments . . . . . . . . . . . . . . . . . . 10 2.0 Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.1 Auto-Negotiation . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.2 PHY Address and LEDs . . . . . . . . . . . . . . . . . . . 12 2.3 LED INTERFACES . . . . . . . . . . . . . . . . . . . . . . . 13 2.4 Half Duplex vs. Full Duplex . . . . . . . . . . . . . . . . . 13 2.5 MII Isolate Mode . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6 Loopback . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.7 BIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 802.3u MII . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 100BASE-TX TRANSMITTER . . . . . . . . . . . . . . . 16 3.3 100BASE-TX RECEIVER . . . . . . . . . . . . . . . . . . 20 3.4 10BASE-T TRANSCEIVER MODULE . . . . . . . . . 23 3.5 TPI Network Circuit . . . . . . . . . . . . . . . . . . . . . . . 24 3.6 ESD Protection . . . . . . . . . . . . . . . . . . . . . . . . . . 25 3.7 Crystal Oscillator Circuit . . . . . . . . . . . . . . . . . . . 26 4.0 Reset Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.1 Hardware Reset . . . . . . . . . . . . . . . . . . . . . . . . . . 26 4.2 Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . . 26 5.0 Register Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 5.1 Register Definition . . . . . . . . . . . . . . . . . . . . . . . . 29 5.2 Extended Registers . . . . . . . . . . . . . . . . . . . . . . . 37 6.0 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . 44 6.1 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 6.2 PGM Clock Timing . . . . . . . . . . . . . . . . . . . . . . . 47 6.3 MII Serial Management Timing . . . . . . . . . . . . . . 47 6.4 100 Mb/s Timing . . . . . . . . . . . . . . . . . . . . . . . . . 48 6.5 10 Mb/s Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 52 6.6 Loopback Timing . . . . . . . . . . . . . . . . . . . . . . . . . 57 6.7 Isolation Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 59 7.0 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Obsolete 4 www.national.com DP83846A Connection Diagram COL TXD_3 TXD_2 IO_VDD IO_GND TXD_1 TXD_0 IO_GND TX_EN TX_CLK TX_ER CORE_VDD CORE_GND RESERVED RX_ER/PAUSE_EN RX_CLK RX_DV IO_VDD IO_GND RXD_0 RESERVED ANA_GND RBIAS ANA_VDD RESERVED ANA_GND ANA_VDD RESERVED ANA_GND RDRD+ ANA_VDD ANA_GND ANA_VDD ANA_GND TD+ TDANA_ GND SUB_GND RESERVED DP83846A DSPHYTER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 CRS/LED_CFG RESET RESERVED IO_GND IO_VDD X2 X1 RESERVED RESERVED RESERVED RESERVED CORE_VDD CORE_GND RESERVED RESERVED SUB_GND RESERVED RESERVED SUB_GND RESERVED RXD_1 RXD_2 RXD_3 MDC MDIO IO_VDD IO_GND LED_DPLX/PHYAD0 LED_COL/PHYAD1 LED_GDLNK/PHYAD2 LED_TX/PHYAD3 LED_RX/PHYAD4 LED_SPEED AN_EN AN_1 AN_0 CORE_VDD CORE_GND RESERVED RESERVED Plastic Quad Flat Pack (LQFP) Order Number DP83846AVHG NS Package Number VHG-80A Obsolete 5 www.national.com DP83846A 1.0 Pin Descriptions The DP83846A pins are classified into the following interface categories (each interface is described in the sections that follow): — MII Interface — 10/100 Mb/s PMD Interface — Clock Interface — Special Connect Pins — LED Interface — Strapping Options/Dual Function pins — Reset — Power and Ground pins Note: Strapping pin option (BOLD) Please see Section 1.6 for strap definitions. Note: All DP83846A signal pins are I/O cells regardless of the particular use. Below definitions define the functionality of the I/O cells for each pin. 1.1 MII Interface Type: I Inputs Type: O Outputs Type: I/O Input/Output Type OD Open Drain Type: PD,PU Internal Pulldown/Pullup Type: S Strapping Pin (All strap pins except PHYAD[ 0:4] have internal pull-ups or pulldowns. If the default strap value is needed to be changed then an external 5 kΩ resistor should be used. Please see Table 1.6 on page 7 for details.) Signal Name Type LQFP Pin # Description MDC I 37 MANAGEMENT DATA CLOCK: Synchronous clock to the MDIO management data input/output serial interface which may be asynchronous to transmit and receive clocks. The maximum clock rate is 25 MHz with no minimum clock rate. MDIO I/O, OD 36 MANAGEMENT DATA I/O: Bi-directional management instruction/ data signal that may be sourced by the station management entity or the PHY. This pin requires a 1.5 kΩ pullup resistor. CRS/LED_CFG O, S 61 CARRIER SENSE: Asserted high to indicate the presence of carrier due to receive or transmit activity in 10BASE-T or 100BASE-TX Half Duplex Modes, while in full duplex mode carrier sense is asserted to indicate the presence of carrier due only to receive activity. COL O 60 COLLISION DETECT: Asserted high to indicate detection of a collision condition (simultaneous transmit and receive activity) in 10 Mb/s and 100 Mb/s Half Duplex Modes. While in 10BASE-T Half Duplex mode with Heartbeat enabled this pin are also asserted for a duration of approximately 1μs at the end of transmission to indicate heartbeat (SQE test). In Full Duplex Mode, for 10 Mb/s or 100 Mb/s operation, this signal is always logic 0. There is no heartbeat function during 10 Mb/s full duplex operation. TX_CLK O 51 TRANSMIT CLOCK: 25 MHz Transmit clock outputs in 100BASETX mode or 2.5 MHz in 10BASE-T mode derived from the 25 MHz reference clock. TXD[3] TXD[2] TXD[1] TXD[0]] I 59, 58, 55, 54 TRANSMIT DATA: Transmit data MII input pins that accept nibble data synchronous to the TX_CLK (2.5 MHz in 10BASE-T Mode or 25 MHz in 100BASE-TX mode. TX_EN I 52 TRANSMIT ENABLE: Active high input indicates the presence of valid nibble data on data inputs, TXD[3:0] for both 100 Mb/s or 10 Mb/s nibble mode. TX_ER I 50 TRANSMIT ERROR: In 100MB/s mode, when this signal is high and the corresponding TX_EN is active the HALT symbol is substituted for data. In 10 Mb/s this input is ignored. RX_CLK O, PU 45 RECEIVE CLOCK: Provides the 25 MHz recovered receive clocks for 100BASE-TX mode and 2.5 MHz for 10BASE-T nibble mode. Obsolete 6 www.national.com DP83846A 1.2 10 Mb/s and 100 Mb/s PMD Interface 1.3 Clock Interface 1.4 Special Connections RXD[3] RXD[2] RXD[1] RXD[0] O, PU/PD 38, 39, 40, 41 RECEIVE DATA: Nibble wide receive data (synchronous to corresponding RX_CLK, 25 MHz for 100BASE-TX mode, 2.5 MHz for 10BASE-T nibble mode). Data is driven on the falling edge of RX_CLK. RXD[2] has an internal pulldown resistor. The remaining RXD pins have pullups. RX_ER/PAUSE_EN S, O, PU 46 RECEIVE ERROR: Asserted high to indicate that an invalid symbol has been detected within a received packet in 100BASE-TX mode. RX_DV O 44 RECEIVE DATA VALID: Asserted high to indicate that valid data is present on the corresponding RXD[3:0] for nibble mode. Data is driven on the falling edge of the corresponding RX_CLK. Signal Name Type LQFP Pin # Description Signal Name Type LQFP Pin # Description TD+, TD- O 16, 17 Differential common driver transmit output. These differential outputs are configurable to either 10BASE-T or 100BASE-TX signaling. The DP83846A will automatically configure the common driver outputs for the proper signal type as a result of either forced configuration or Auto-Negotiation. RD-, RD+ I 10, 11 Differential receive input. These differential inputs can be configured to accept either 100BASE-TX or 10BASE-T signaling. The DP83846A will automatically configure the receive inputs to accept the proper signal type as a result of either forced configuration or Auto-Negotiation. Signal Name Type LQFP Pin # Description X1 I 67 REFERENCE CLOCK INPUT 25 MHz: This pin is the primary clock reference input for the DP83846A and must be connected to a 25 MHz 0.005% (±50 ppm) clock source. The DP83846A supports CMOS-level oscillator sources. X2 O 66 REFERENCE CLOCK OUTPUT 25 MHz: This pin is the primary clock reference output. Signal Name Type LQFP Pin # Description RBIAS I 3 Bias Resistor Connection. A 9.31 kΩ 1% resistor should be connected from RBIAS to ANA_GND. RESERVED I/O 1, 5, 8, 20, 21, 22, 47, 63, 68, 69, 70, 71, 74, 75, 77, 78, 80 RESERVED: These pins must be left unconnected. Obsolete 7 www.national.com DP83846A 1.5 LED Interface 1.6 Strapping Options/Dual Purpose Pins A 5 kΩ resistor should be used for pull-down or pull-up to change the default strap option. If the default option is required, then there is no need for external pull-up or pull down resistors, since the internal pull-up or pull down resistors will set the default value. Please note that the PHYAD[0:4] pins have no internal pull-ups or pull-downs and they must be strapped. Since these pins may have alternate functions after reset is deasserted, they should not be connected directly to Vcc or GND. Signal Name Type LQFP Pin # Description LED_DPLX/PHYAD0 S, O 33 FULL DUPLEX LED STATUS: Indicates Full-Duplex status. LED_COL/PHYAD1 S, O 32 COLLISION LED STATUS: Indicates Collision activity in Half Duplex mode. LED_GDLNK/PHYAD2 S, O 31 GOOD LINK LED STATUS: Indicates Good Link Status for 10BASET and 100BASE-TX. LED_TX/PHYAD3 S, O 30 TRANSMIT LED STATUS: Indicates transmit activity. LED is on for activity, off for no activity. LED_RX/PHYAD4 S, O 29 RECEIVE LED STATUS: Indicates receive activity. LED is on for activity, off for no activity. LED_SPEED O 28 SPEED LED STATUS: Indicates link speed; high for 100 Mb/s, low for 10 Mb/s. Signal Name Type LQFP Pin # Description LED_DPLX/PHYAD0 LED_COL/PHYAD1 LED_GDLNK/PHYAD2 LED_TX/PHYAD3 LED_RX/PHYAD4 S, O 33 32 31 30 29 PHY ADDRESS [4:0]: The DP83846A provides five PHY address pins, the state of which are latched into the PHYCTRL register at system Hardware-Reset. The DP83846A supports PHY Address strapping values 0 (<00000>) through 31 (<11111>). PHY Address 0 puts the part into the MII Isolate Mode. The MII isolate mode must be selected by strapping Phy Address 0; changing to Address 0 by register write will not put the Phy in the MII isolate mode. The status of these pins are latched into the PHY Control Register during Hardware-Reset. (Please note these pins have no internal pull-up or pull-down resistors and they must be strapped high or low using 5 kΩ resistors.) Obsolete 8 www.national.com DP83846A AN_EN AN_1 AN_0 S, O, PU 27 26 25 Auto-Negotiation Enable: When high enables Auto-Negotiation with the capability set by ANO and AN1 pins. When low, puts the part into Forced Mode with the capability set by AN0 and AN1 pins. AN0 / AN1: These input pins control the forced or advertised operating mode of the DP83846A according to the following table. The value on these pins is set by connecting the input pins to GND (0) or VCC (1) through 5 kΩ resistors. These pins should NEVER be connected directly to GND or VCC. The value set at this input is latched into the DP83846A at Hardware- Reset. The float/pull-down status of these pins are latched into the Basic Mode Control Register and the Auto_Negotiation Advertisement Register during Hardware-Reset. After reset is deasserted, these pins may switch to outputs so if pull-ups or pull-downs are implemented, they should be pulled through a 5kΩ resistor. The default is 111 since these pins have pull-ups. RX_ER/PAUSE_EN S, O, PU 46 PAUSE ENABLE: This strapping option allows advertisement of whether or not the DTE(MAC) has implemented both the optional MAC control sublayer and the pause function as specified in clause 31 and annex 31B of the IEEE 802.3x specification (Full Duplex Flow Control). When left floating the Auto-Negotiation Advertisement Register will be set to 0, indicating that Full Duplex Flow Control is not supported. When tied low through a 5 kΩ, the Auto-Negotiation Advertisement Register will be set to 1, indicating that Full Duplex Flow Control is supported. The float/pull-down status of this pin is latched into the Auto-Negotiation Advertisement Register during Hardware-Reset. CRS/LED_CFG S, O, PU 61 LED CONFIGURATION: This strapping option defines the polarity and function of the FDPLX LED pin. See Section 2.3 for further descriptions of this strapping option. Signal Name Type LQFP Pin # Description AN_EN AN1 AN0 Forced Mode 0 0 0 10BASE-T, Half-Duplex 0 0 1 10BASE-T, Full-Duplex 0 1 0 100BASE-TX, Half-Duplex 0 1 1 100BASE-TX, Full-Duplex AN_EN AN1 AN0 Advertised Mode 1 0 0 10BASE-T, Half/Full-Duplex 1 0 1 100BASE-TX, Half/Full-Duplex 1 1 0 10BASE-T Half-Duplex 100BASE-TX, Half-Duplex 1 1 1 10BASE-T, Half/Full-Duplex 100BASE-TX, Half/Full-Duplex Obsolete 9 www.national.com DP83846A 1.7 Reset 1.8 Power and Ground Pins Signal Name Type LQFP Pin # LLP Pin # Description RESET I 62 46 RESET: Active Low input that initializes or re-initializes the DP83846A. Asserting this pin low for at least 160 μs will force a reset process to occur which will result in all internal registers re-initializing to their default states as specified for each bit in the Register Block section and all strapping options are re-initialized. Signal Name LQFP Pin # Description TTL/CMOS INPUT/OUTPUT SUPPLY IO_VDD 35, 43, 57, 65 I/O Supply IO_GND 34, 42, 53, 56, 64 I/O Ground INTERNAL SUPPLY PAIRS CORE_VDD 24, 49, 72 Digital Core Supply CORE_GND 23, 48, 73 Digital Core Ground ANALOG SUPPLY PINS ANA_VDD 4, 7, 12, 14 Analog Supply ANA_GND 2, 6, 9, 13, 15, 18, Analog Ground SUBSTRATE GROUND SUB_GND 19, 76, 79 Bandgap Substrate connection Obsolete 10 www.national.com DP83846A 1.9 Package Pin Assignments LQFP Pin # Pin Name LQFP Pin # Pin Name 1 RESERVED 41 RXD_0 2 ANA_GND 42 IO_GND 3 RBIAS 43 IO_VDD 4 ANA_VDD 44 RX_DV 5 RESERVED 45 RX_CLK 6 ANA_GND 46 RX_ER/PAUSE_EN 7 ANA_VDD 47 RESERVED 8 RESERVED 48 CORE_GND 9 ANA_GND 49 CORE_VDD 10 RD- 50 TX_ER 11 RD+ 51 TX_CLK 12 ANA_VDD 52 TX_EN 13 ANA_GND 53 IO_GND 14 ANA_VDD 54 TXD_0 15 ANA_GND 55 TXD_1 16 TD+ 56 IO_GND 17 TD- 57 IO_VDD 18 ANA_GND 58 TXD_2 19 SUB_GND 59 TXD_3 20 RESERVED 60 COL 21 RESERVED 61 CRS/LED_CFG 22 RESERVED 62 RESET 23 CORE_GND 63 RESERVED 24 CORE_VDD 64 IO_GND 25 AN_0 65 IO_VDD 26 AN_1 66 X2 27 AN_EN 67 X1 28 LED_SPEED 68 RESERVED 29 LED_RX /PHYAD4 69 RESERVED 30 LED_TX /PHYAD3 70 RESERVED 31 LED_GDLNK/PHYAD2 71 RESERVED 32 LED_COL /PHYAD1 72 CORE_VDD 33 LED_FDPLX /PHYAD0 73 CORE_GND 34 IO_GND 74 RESERVED 35 IO_VDD 75 RESERVED 36 MDIO 76 SUB_GND 37 MDC 77 RESERVED 38 RXD_3 78 RESERVED 39 RXD_2 79 SUB_GND 40 RXD_1 80 RESERVED Obsolete 11 www.national.com DP83846A 2.0 Configuration This section includes information on the various configuration options available with the DP83846A. The configuration options described below include: — Device Configuration — Auto-Negotiation — PHY Address and LEDs — Half Duplex vs. Full Duplex — Isolate mode — Loopback mode — BIST 2.1 Auto-Negotiation The Auto-Negotiation function provides a mechanism for exchanging configuration information between two ends of a link segment and automatically selecting the highest performance mode of operation supported by both devices. Fast Link Pulse (FLP) Bursts provide the signalling used to communicate Auto-Negotiation abilities between two devices at each end of a link segment. For further detail regarding Auto-Negotiation, refer to Clause 28 of the IEEE 802.3u specification. The DP83846A supports four different Ethernet protocols (10 Mb/s Half Duplex, 10 Mb/s Full Duplex, 100 Mb/s Half Duplex, and 100 Mb/s Full Duplex), so the inclusion of Auto-Negotiation ensures that the highest performance protocol will be selected based on the advertised ability of the Link Partner. The Auto-Negotiation function within the DP83846A can be controlled either by internal register access or by the use of the AN_EN, AN1 and AN0 pins. 2.1.1 Auto-Negotiation Pin Control The state of AN_EN, AN0 and AN1 determines whether the DP83846A is forced into a specific mode or Auto-Negotiation will advertise a specific ability (or set of abilities) as given in Table 1. These pins allow configuration options to be selected without requiring internal register access. The state of AN_EN, AN0 and AN1, upon power-up/reset, determines the state of bits [8:5] of the ANAR register. The Auto-Negotiation function selected at power-up or reset can be changed at any time by writing to the Basic Mode Control Register (BMCR) at address 00h. 2.1.2 Auto-Negotiation Register Control When Auto-Negotiation is enabled, the DP83846A transmits the abilities programmed into the Auto-Negotiation Advertisement register (ANAR) at address 04h via FLP Bursts. Any combination of 10 Mb/s, 100 Mb/s, Half- Duplex, and Full Duplex modes may be selected. The BMCR provides software with a mechanism to control the operation of the DP83846A. The AN0 and AN1 pins do not affect the contents of the BMCR and cannot be used by software to obtain status of the mode selected. Bits 1 & 2 of the PHYSTS register are only valid if Auto-Negotiation is disabled or after Auto-Negotiation is complete. The Auto- Negotiation protocol compares the contents of the ANLPAR and ANAR registers and uses the results to automatically configure to the highest performance protocol between the local and far-end port. The results of Auto- Negotiation (Auto-Neg Complete, Duplex Status and Speed) may be accessed in the PHYSTS register. Auto-Negotiation Priority Resolution: — (1) 100BASE-TX Full Duplex (Highest Priority) — (2) 100BASE-TX Half Duplex — (3) 10BASE-T Full Duplex — (4) 10BASE-T Half Duplex (Lowest Priority) The Basic Mode Control Register (BMCR) at address 00h provides control for enabling, disabling, and restarting the Auto-Negotiation process. When Auto-Negotiation is disabled the Speed Selection bit in the BMCR controls switching between 10 Mb/s or 100 Mb/s operation, and the Duplex Mode bit controls switching between full duplex operation and half duplex operation. The Speed Selection and Duplex Mode bits have no effect on the mode of operation when the Auto-Negotiation Enable bit is set. The Basic Mode Status Register (BMSR) indicates the set of available abilities for technology types, Auto-Negotiation ability, and Extended Register Capability. These bits are permanently set to indicate the full functionality of the DP83846A (only the 100BASE-T4 bit is not set since the DP83846A does not support that function). Table 1. Auto-Negotiation Modes AN_EN AN1 AN0 Forced Mode 0 0 0 10BASE-T, Half-Duplex 0 0 1 10BASE-T, Full-Duplex 0 1 0 100BASE-TX, Half-Duplex 0 1 1 100BASE-TX, Full-Duplex AN_EN AN1 AN0 Advertised Mode 1 0 0 10BASE-T, Half/Full-Duplex 1 0 1 100BASE-TX, Half/Full-Duplex 1 1 0 10BASE-T Half-Duplex 100BASE-TX, Half-Duplex 1 1 1 10BASE-T, Half/Full-Duplex 100BASE-TX, Half/Full-Duplex Obsolete 12 www.national.com DP83846A The BMSR also provides status on: — Whether Auto-Negotiation is complete — Whether the Link Partner is advertising that a remote fault has occurred — Whether valid link has been established — Support for Management Frame Preamble suppression The Auto-Negotiation Advertisement Register (ANAR) indicates the Auto-Negotiation abilities to be advertised by the DP83846A. All available abilities are transmitted by default, but any ability can be suppressed by writing to the ANAR. Updating the ANAR to suppress an ability is one way for a management agent to change (force) the technology that is used. The Auto-Negotiation Link Partner Ability Register (ANLPAR) at address 05h is used to receive the base link code word as well as all next page code words during the negotiation. Furthermore, the ANLPAR will be updated to either 0081h or 0021h for parallel detection to either 100 Mb/s or 10 Mb/s respectively. The Auto-Negotiation Expansion Register (ANER) indicates additional Auto-Negotiation status. The ANER provides status on: — Whether a Parallel Detect Fault has occurred — Whether the Link Partner supports the Next Page function — Whether the DP83846A supports the Next Page function — Whether the current page being exchanged by Auto-Negotiation has been received — Whether the Link Partner supports Auto-Negotiation 2.1.3 Auto-Negotiation Parallel Detection The DP83846A supports the Parallel Detection function as defined in the IEEE 802.3u specification. Parallel Detection requires both the 10 Mb/s and 100 Mb/s receivers to monitor the receive signal and report link status to the Auto- Negotiation function. Auto-Negotiation uses this information to configure the correct technology in the event that the Link Partner does not support Auto-Negotiation but is transmitting link signals that the 100BASE-TX or 10BASET PMAs recognize as valid link signals. If the DP83846A completes Auto-Negotiation as a result of Parallel Detection, bits 5 and 7 within the ANLPAR register will be set to reflect the mode of operation present in the Link Partner. Note that bits 4:0 of the ANLPAR will also be set to 00001 based on a successful parallel detection to indicate a valid 802.3 selector field. Software may determine that negotiation completed via Parallel Detection by reading a zero in the Link Partner Auto-Negotiation Able bit once the Auto-Negotiation Complete bit is set. If configured for parallel detect mode and any condition other than a single good link occurs then the parallel detect fault bit will set. 2.1.4 Auto-Negotiation Restart Once Auto-Negotiation has completed, it may be restarted at any time by setting bit 9 (Restart Auto-Negotiation) of the BMCR to one. If the mode configured by a successful Auto- Negotiation loses a valid link, then the Auto-Negotiation process will resume and attempt to determine the configuration for the link. This function ensures that a valid configuration is maintained if the cable becomes disconnected. A renegotiation request from any entity, such as a management agent, will cause the DP83846A to halt any transmit data and link pulse activity until the break_link_timer expires (~1500 ms). Consequently, the Link Partner will go into link fail and normal Auto-Negotiation resumes. The DP83846A will resume Auto-Negotiation after the break_link_timer has expired by issuing FLP (Fast Link Pulse) bursts. 2.1.5 Enabling Auto-Negotiation via Software It is important to note that if the DP83846A has been initialized upon power-up as a non-auto-negotiating device (forced technology), and it is then required that Auto-Negotiation or re-Auto-Negotiation be initiated via software, bit 12 (Auto-Negotiation Enable) of the Basic Mode Control Register must first be cleared and then set for any Auto- Negotiation function to take effect. 2.1.6 Auto-Negotiation Complete Time Parallel detection and Auto-Negotiation take approximately 2-3 seconds to complete. In addition, Auto-Negotiation with next page should take approximately 2-3 seconds to complete, depending on the number of next pages sent. Refer to Clause 28 of the IEEE 802.3u standard for a full description of the individual timers related to Auto-Negotiation. 2.2 PHY Address and LEDs The 5 PHY address inputs pins are shared with the LED pins as shown below. The DP83846A can be set to respond to any of 32 possible PHY addresses. Each DP83846A or port sharing an MDIO bus in a system must have a unique physical address. Refer to Section 3.1.4, PHY Address Sensing section for more details. The state of each of the PHYAD inputs latched into the PHYCTRL register bits [4:0] at system power-up/reset depends on whether a pull-up or pull-down resistor has been installed for each pin. For further detail relating to the latch-in timing requirements of the PHY Address pins, as well as the other hardware configuration pins, refer to the Reset summary in Section 4.0. Since the PHYAD strap options share the LED output pins, the external components required for strapping and LED usage must be considered in order to avoid contention. Specifically, when the LED outputs are used to drive LEDs directly, the active state of each output driver is dependent on the logic level sampled by the corresponding PHYAD input upon power-up/reset. For example, if a given PHYAD input is resistively pulled low then the corresponding output will be configured as an active high driver. Conversely, if a given PHYAD input is resistively pulled high, then the corresponding output will be configured as an active low Table 2. PHY Address Mapping Pin # PHYAD Function LED Function 33 PHYAD0 Duplex 32 PHYAD1 COL 31 PHYAD2 Good Link 30 PHYAD3 TX Activity 29 PHYAD4 RX Activity 28 n/a Speed Obsolete 13 www.national.com DP83846A driver. Refer to Figure 2 for an example of a PHYAD connection to external components. In this example, the PHYAD strapping results in address 00011 (03h). The adaptive nature of the LED outputs helps to simplify potential implementation issues of these dual purpose pins. 2.3 LED INTERFACES The DP83846A has 6 Light Emitting Diode (LED) outputs, each capable to drive a maximum of 10 mA, to indicate the status of Link, Transmit, Receive, Collision, Speed, and Full/Half Duplex operation. The LED_CFG strap option is used to configure the LED_FDPLX output for use as an LED driver or more general purpose control pin. See the table below: The LED_FDPLX pin indicates the Half or Full Duplex configuration of the port in both 10 Mb/s and 100 Mb/s operation. Since this pin is also used as the PHY address strap option, the polarity of this indicator may be adjusted so that in the “active” (FULL DUPLEX selected) state it drives against the pullup/pulldown strap. In this configuration it is suitable for use as an LED. When LED_CFG is high this mode is selected and DsPHYTER automatically adjusts the polarity of the output. If LED_CFG is low, the output drives high to indicate the “active” state. In this configuration the output is suitable for use as a control pin. The LED_SPEED pin indicates 10 or 100 Mb/s data rate of the port. The standard CMOS driver goes high when operating in 100 Mb/s operation. Since this pin is not utilized as a strap option, it is not affected by polarity adjustment. The LED_GDLNK pin indicates the link status of the port. Since this pin is also used as the PHY address strap option, the polarity of this indicator is adjusted to be the inverse of the strap value. In 100BASE-T mode, link is established as a result of input receive amplitude compliant with TP-PMD specifications which will result in internal generation of signal detect. 10 Mb/s Link is established as a result of the reception of at least seven consecutive normal Link Pulses or the reception of a valid 10BASE-T packet. This will cause the assertion of GD_LINK. GD_LINK will deassert in accordance with the Link Loss Timer as specified in IEEE 802.3. The Collision LED indicates the presence of collision activity for 10 Mb/s or 100 Mb/s Half Duplex operation. This bit has no meaning in Full Duplex operation and will be deasserted when the port is operating in Full Duplex. Since this pin is also used as the PHY address strap option, the polarity of this indicator is adjusted to be the inverse of the strap value. In 10 Mb/s half duplex mode, the collision LED is based on the COL signal. When in this mode, the user should disable the Heartbeat (SQE) to avoid asserting the COL LED during transmission. See Section 3.4.2 for more information about the Heartbeat signal. The LED_RX and LED_TX pins indicate the presence of transmit and/or receive activity. Since these pins are also used in PHY address strap options, the polarity is adjusted to be the inverse of the respective strap values. 2.4 Half Duplex vs. Full Duplex The DP83846A supports both half and full duplex operation at both 10 Mb/s and 100 Mb/s speeds. Half-duplex is the standard, traditional mode of operation which relies on the CSMA/CD protocol to handle collisions and network access. In Half-Duplex mode, CRS responds to both transmit and receive activity in order to maintain compliance with IEEE 802.3 specification. Since the DP83846A is designed to support simultaneous transmit and receive activity it is capable of supporting fullduplex switched applications with a throughput of up to Figure 2. PHYAD Strapping and LED Loading Example LED_FDPLX LED_COL LED_GDLNK LED_TX LED_RX VCC 10kΩ 1kΩ 1kΩ 10kΩ 1kΩ 10kΩ 1kΩ 10kΩ 1kΩ PHYAD4= 0 PHYAD3 = 0 PHYAD2 = 0 PHYAD1 = 1 PHYAD0 = 1 10kΩ Table 3. LED Mode Select LED_CFG Mode Description 1 LED polarity adjusted 0 Duplex active-high Obsolete 14 www.national.com DP83846A 200 Mb/s per port when operating in 100BASE-TX mode. Because the CSMA/CD protocol does not apply to fullduplex operation, the DP83846A disables its own internal collision sensing and reporting functions and modifies the behavior of Carrier Sense (CRS) such that it indicates only receive activity. This allows a full-duplex capable MAC to operate properly. All modes of operation (100BASE-TX and 10BASE-T) can run either half-duplex or full-duplex. Additionally, other than CRS and Collision reporting, all remaining MII signaling remains the same regardless of the selected duplex mode. It is important to understand that while Auto-Negotiation with the use of Fast Link Pulse code words can interpret and configure to full-duplex operation, parallel detection can not recognize the difference between full and halfduplex from a fixed 10 Mb/s or 100 Mb/s link partner over twisted pair. As specified in 802.3u, if a far-end link partner is transmitting forced full duplex 100BASE-TX for example, the parallel detection state machine in the receiving station would be unable to detect the full duplex capability of the far-end link partner and would negotiate to a half duplex 100BASE-TX configuration (same scenario for 10 Mb/s). 2.5 MII Isolate Mode The DP83846A can be put into MII Isolate mode by writing to bit 10 of the BMCR register. In addition, the MII isolate mode can be selected by strapping in Physical Address 0. It should be noted that selecting Physical Address 0 via an MDIO write to PHYCTRL will not put the device in the MII isolate mode. When in the MII isolate mode, the DP83846A does not respond to packet data present at TXD[3:0], TX_EN, and TX_ER inputs and presents a high impedance on the TX_CLK, RX_CLK, RX_DV, RX_ER, RXD[3:0], COL, and CRS outputs. The DP83846A will continue to respond to all management transactions. While in Isolate mode, the TD± outputs will not transmit packet data but will continue to source 100BASE-TX scrambled idles or 10BASE-T normal link pulses. 2.6 Loopback The DP83846A includes a Loopback Test mode for facilitating system diagnostics. The Loopback mode is selected through bit 14 (Loopback) of the Basic Mode Control Register (BMCR). Writing 1 to this bit enables MII transmit data to be routed to the MII receive outputs. Loopback status may be checked in bit 3 of the PHY Status Register (PHYSTS). While in Loopback mode the data will not be transmitted onto the media in 100 Mb/s mode. To ensure that the desired operating mode is maintained, Auto-Negotiation should be disabled before selecting the Loopback mode. During 10BASE-T operation, in order to be standard compliant, the loopback mode loops MII transmit data to the MII receive data, however, Link Pulses are not looped back. In 100BASE-TX Loopback mode the data is routed through the PCS and PMA layers into the PMD sublayer before it is looped back. In addition to serving as a board diagnostic, this mode serves as a functional verification of the device. 2.7 BIST The DsPHYTER incorporates an internal Built-in Self Test (BIST) circuit to accommodate in-circuit testing or diagnostics. The BIST circuit can be utilized to test the integrity of the transmit and receive data paths. BIST testing can be performed with the part in the internal loopback mode or externally looped back using a loopback cable fixture. The BIST is implemented with independent transmit and receive paths, with the transmit block generating a continuous stream of a pseudo random sequence. The user can select a 9 bit or 15 bit pseudo random sequence from the PSR_15 bit in the PHY Control Register (PHYCTRL). The looped back data is compared to the data generated by the BIST Linear Feedback Shift Register (LFSR, which generates a pseudo random sequence) to determine the BIST pass/fail status. The pass/fail status of the BIST is stored in the BIST status bit in the PHYCTRL register. The status bit defaults to 0 (BIST fail) and will transition on a successful comparison. If an error (mis-compare) occurs, the status bit is latched and is cleared upon a subsequent write to the Start/Stop bit. Obsolete 15 www.national.com DP83846A 3.0 Functional Description 3.1 802.3u MII The DP83846A incorporates the Media Independent Interface (MII) as specified in Clause 22 of the IEEE 802.3u standard. This interface may be used to connect PHY devices to a MAC in 10/100 Mb/s systems. This section describes both the serial MII management interface as well as the nibble wide MII data interface. The serial management interface of the MII allows for the configuration and control of multiple PHY devices, gathering of status, error information, and the determination of the type and capabilities of the attached PHY(s). The nibble wide MII data interface consists of a receive bus and a transmit bus each with control signals to facilitate data transfer between the PHY and the upper layer (MAC). 3.1.1 Serial Management Register Access The serial management MII specification defines a set of thirty-two 16-bit status and control registers that are accessible through the management interface pins MDC and MDIO. The DP83846A implements all the required MII registers as well as several optional registers. These registers are fully described in Section 5. A description of the serial management access protocol follows. 3.1.2 Serial Management Access Protocol The serial control interface consists of two pins, Management Data Clock (MDC) and Management Data Input/Output (MDIO). MDC has a maximum clock rate of 25 MHz and no minimum rate. The MDIO line is bi-directional and may be shared by up to 32 devices. The MDIO frame format is shown below in Table 4: Typical MDIO Frame Format. The MDIO pin requires a pull-up resistor (1.5 kΩ) which, during IDLE and turnaround, will pull MDIO high. In order to initialize the MDIO interface, the station management entity sends a sequence of 32 contiguous logic ones on MDIO to provide the DP83846A with a sequence that can be used to establish synchronization. This preamble may be generated either by driving MDIO high for 32 consecutive MDC clock cycles, or by simply allowing the MDIO pull-up resistor to pull the MDIO pin high during which time 32 MDC clock cycles are provided. In addition 32 MDC clock cycles should be used to re-sync the device if an invalid start, opcode, or turnaround bit is detected. The DP83846A waits until it has received this preamble sequence before responding to any other transaction. Once the DP83846A serial management port has been initialized no further preamble sequencing is required until after a power-on/reset, invalid Start, invalid Opcode, or invalid turnaround bit has occurred. The Start code is indicated by a <01> pattern. This assures the MDIO line transitions from the default idle line state. Turnaround is defined as an idle bit time inserted between the Register Address field and the Data field. To avoid contention during a read transaction, no device shall actively drive the MDIO signal during the first bit of Turnaround. The addressed DP83846A drives the MDIO with a zero for the second bit of turnaround and follows this with the required data. Figure 3 shows the timing relationship between MDC and the MDIO as driven/received by the Station (STA) and the DP83846A (PHY) for a typical register read access. For write transactions, the station management entity writes data to the addressed DP83846A thus eliminating the requirement for MDIO Turnaround. The Turnaround time is filled by the management entity by inserting <10>. Figure 4 shows the timing relationship for a typical MII register write access. 3.1.3 Serial Management Preamble Suppression The DP83846A supports a Preamble Suppression mode as indicated by a one in bit 6 of the Basic Mode Status Register (BMSR, address 01h.) If the station management entity (i.e. MAC or other management controller) determines that all PHYs in the system support Preamble Sup- Table 4. Typical MDIO Frame Format MII Management Serial Protocol Read Operation <01><10> Write Operation <01><01><10> Figure 3. Typical MDC/MDIO Read Operation MDC MDIO 0 1 1 0 0 1 1 0 0 0 0 0 0 0 (STA) Idle Start Opcode (Read) PHY Address (PHYAD = 0Ch) Register Address (00h = BMCR) TA Register Data Z MDIO (PHY) Z Z Z 0 0 0 1 1 0 0 0 1 0 0 0 0 0 0 0 0 Z Idle Z Z Obsolete 16 www.national.com DP83846A pression by returning a one in this bit, then the station management entity need not generate preamble for each management transaction. The DP83846A requires a single initialization sequence of 32 bits of preamble following hardware/software reset. This requirement is generally met by the mandatory pull-up resistor on MDIO in conjunction with a continuous MDC, or the management access made to determine whether Preamble Suppression is supported. While the DP83846A requires an initial preamble sequence of 32 bits for management initialization, it does not require a full 32-bit sequence between each subsequent transaction. A minimum of one idle bit between management transactions is required as specified in IEEE 802.3u. 3.1.4 PHY Address Sensing The DP83846A provides five PHY address pins, the information is latched into the PHYCTRL register (address 19h, bits [4:0]) at device power-up/Hardware reset. The DP83846A supports PHY Address strapping values 0 (<00000>) through 31 (<11111>). Strapping PHY Address 0 puts the part into Isolate Mode. It should also be noted that selecting PHY Address 0 via an MDIO write to PHYCTRL will not put the device in Isolate Mode; Address 0 must be strapped in. 3.1.5 Nibble-wide MII Data Interface Clause 22 of the IEEE 802.3u specification defines the Media Independent Interface. This interface includes a dedicated receive bus and a dedicated transmit bus. These two data buses, along with various control and indicate signals, allow for the simultaneous exchange of data between the DP83846A and the upper layer agent (MAC). The receive interface consists of a nibble wide data bus RXD[3:0], a receive error signal RX_ER, a receive data valid flag RX_DV, and a receive clock RX_CLK for synchronous transfer of the data. The receive clock can operate at either 2.5 MHz to support 10 Mb/s operation modes or at 25 MHz to support 100 Mb/s operational modes. The transmit interface consists of a nibble wide data bus TXD[3:0], a transmit enable control signal TX_EN, and a transmit clock TX_CLK which runs at either 2.5 MHz or 25 MHz. Additionally, the MII includes the carrier sense signal CRS, as well as a collision detect signal COL. The CRS signal asserts to indicate the reception of data from the network or as a function of transmit data in Half Duplex mode. The COL signal asserts as an indication of a collision which can occur during half-duplex operation when both a transmit and receive operation occur simultaneously. 3.1.6 Collision Detect For Half Duplex, a 10BASE-T or 100BASE-TX collision is detected when the receive and transmit channels are active simultaneously. Collisions are reported by the COL signal on the MII. If the DP83846A is transmitting in 10 Mb/s mode when a collision is detected, the collision is not reported until seven bits have been received while in the collision state. This prevents a collision being reported incorrectly due to noise on the network. The COL signal remains set for the duration of the collision. If a collision occurs during a receive operation, it is immediately reported by the COL signal. When heartbeat is enabled (only applicable to 10 Mb/s operation), approximately 1μs after the transmission of each packet, a Signal Quality Error (SQE) signal of approximately 10 bit times is generated (internally) to indicate successful transmission. SQE is reported as a pulse on the COL signal of the MII. 3.1.7 Carrier Sense Carrier Sense (CRS) may be asserted due to receive activity, once valid data is detected via the squelch function during 10 Mb/s operation. During 100 Mb/s operation CRS is asserted when a valid link (SD) and two non-contiguous zeros are detected on the line. For 10 or 100 Mb/s Half Duplex operation, CRS is asserted during either packet transmission or reception. For 10 or 100 Mb/s Full Duplex operation, CRS is asserted only due to receive activity. CRS is deasserted following an end of packet. 3.2 100BASE-TX TRANSMITTER The 100BASE-TX transmitter consists of several functional blocks which convert synchronous 4-bit nibble data, as provided by the MII, to a scrambled MLT-3 125 Mb/s serial data stream. Because the 100BASE-TX TP-PMD is integrated, the differential output pins, TD±, can be directly routed to the magnetics. The block diagram in Figure 5 provides an overview of each functional block within the 100BASE-TX transmit section. The Transmitter section consists of the following functional blocks: — Code-group Encoder and Injection block (bypass option) — Scrambler block (bypass option) — NRZ to NRZI encoder block — Binary to MLT-3 converter / Common Driver Figure 4. Typical MDC/MDIO Write Operation MDC MDIO 0 1 0 1 0 1 1 0 0 0 0 0 0 0 (STA) Idle Start Opcode (Write) PHY Address (PHYAD = 0Ch) Register Address (00h = BMCR) TA Register Data Z 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Z Idle 1 00 0 Z Z Obsolete 17 www.national.com DP83846A The bypass option for the functional blocks within the 100BASE-TX transmitter provides flexibility for applications where data conversion is not always required. The DP83846A implements the 100BASE-TX transmit state machine diagram as specified in the IEEE 802.3u Standard, Clause 24. 3.2.1 Code-group Encoding and Injection The code-group encoder converts 4-bit (4B) nibble data generated by the MAC into 5-bit (5B) code-groups for transmission. This conversion is required to allow control data to be combined with packet data code-groups. Refer to Table 5: 4B5B Code-Group Encoding/Decoding for 4B to 5B code-group mapping details. The code-group encoder substitutes the first 8-bits of the MAC preamble with a J/K code-group pair (11000 10001) upon transmission. The code-group encoder continues to replace subsequent 4B preamble and data nibbles with corresponding 5B code-groups. At the end of the transmit packet, upon the deassertion of Transmit Enable signal from the MAC, the code-group encoder injects the T/R code-group pair (01101 00111) indicating the end of frame. After the T/R code-group pair, the code-group encoder continuously injects IDLEs into the transmit data stream until the next transmit packet is detected (reassertion of Transmit Enable). 3.2.2 Scrambler The scrambler is required to control the radiated emissions at the media connector and on the twisted pair cable (for 100BASE-TX applications). By scrambling the data, the total energy launched onto the cable is randomly distributed over a wide frequency range. Without the scrambler, energy levels at the PMD and on the cable could peak beyond FCC limitations at frequencies related to repeating 5B sequences (i.e., continuous transmission of IDLEs). The scrambler is configured as a closed loop linear feedback shift register (LFSR) with an 11-bit polynomial. The output of the closed loop LFSR is X-ORd with the serial Figure 5. 100BASE-TX Transmit Block Diagram 4B5B Code-group encoder & injector scrambler nrz to nrzi encoder 5B parallel to serial TD± TX_CLK TXD[3:0] / tx_er 100BASE-TX Loopback mux binary to mlt-3 / Common Driver FROM PGM BP_4B5B BP_SCR mux DIV BY 5 Obsolete 18 www.national.com DP83846A NRZ data from the code-group encoder. The result is a scrambled data stream with sufficient randomization to decrease radiated emissions at certain frequencies by as much as 20 dB. The DP83846A uses the PHY_ID (pins PHYAD [4:0]) to set a unique seed value. 3.2.3 NRZ to NRZI Encoder After the transmit data stream has been serialized and scrambled, the data must be NRZI encoded in order to comply with the TP-PMD standard for 100BASE-TX transmission over Category-5 Unsheilded twisted pair cable. 3.2.4 Binary to MLT-3 Convertor / Common Driver The Binary to MLT-3 conversion is accomplished by converting the serial binary data stream output from the NRZI encoder into two binary data streams with alternately phased logic one events. These two binary streams are then fed to the twisted pair output driver which converts the voltage to current and alternately drives either side of the transmit transformer primary winding, resulting in a minimal current (20 mA max) MLT-3 signal. Refer to Figure 6. Figure 6. Binary to MLT-3 conversion D Q Q binary_in binary_plus binary_minus binary_in binary_plus binary_minus COMMON DRIVER MLT-3 differential MLT-3 Obsolete 19 www.national.com DP83846A Table 5. 4B5B Code-Group Encoding/Decoding Name PCS 5B Code-group MII 4B Nibble Code DATA CODES 0 11110 0000 1 01001 0001 2 10100 0010 3 10101 0011 4 01010 0100 5 01011 0101 6 01110 0110 7 01111 0111 8 10010 1000 9 10011 1001 A 10110 1010 B 10111 1011 C 11010 1100 D 11011 1101 E 11100 1110 F 11101 1111 IDLE AND CONTROL CODES H 00100 HALT code-group - Error code I 11111 Inter-Packet IDLE - 0000 (Note 1) J 11000 First Start of Packet - 0101 (Note 1) K 10001 Second Start of Packet - 0101 (Note 1) T 01101 First End of Packet - 0000 (Note 1) R 00111 Second End of Packet - 0000 (Note 1) INVALID CODES V 00000 V 00001 V 00010 V 00011 V 00101 V 00110 V 01000 V 01100 V 10000 V 11001 Note 1: Control code-groups I, J, K, T and R in data fields will be mapped as invalid codes, together with RX_ER asserted. Obsolete 20 www.national.com DP83846A The 100BASE-TX MLT-3 signal sourced by the TD± common driver output pins is slew rate controlled. This should be considered when selecting AC coupling magnetics to ensure TP-PMD Standard compliant transition times (3 ns < Tr < 5 ns). The 100BASE-TX transmit TP-PMD function within the DP83846A is capable of sourcing only MLT-3 encoded data. Binary output from the TD± outputs is not possible in 100 Mb/s mode. 3.3 100BASE-TX RECEIVER The 100BASE-TX receiver consists of several functional blocks which convert the scrambled MLT-3 125 Mb/s serial data stream to synchronous 4-bit nibble data that is provided to the MII. Because the 100BASE-TX TP-PMD is integrated, the differential input pins, RD±, can be directly routed from the AC coupling magnetics. See Figure 8 for a block diagram of the 100BASE-TX receive function. This provides an overview of each functional block within the 100BASE-TX receive section. The Receive section consists of the following functional blocks: — ADC — Input and BLW Compensation — Signal Detect — Digital Adaptive Equalization — MLT-3 to Binary Decoder — Clock Recovery Module — NRZI to NRZ Decoder — Serial to Parallel — DESCRAMBLER (bypass option) — Code Group Alignment — 4B/5B Decoder (bypass option) — Link Integrity Monitor — Bad SSD Detection The bypass option for the functional blocks within the 100BASE-TX receiver provides flexibility for applications where data conversion is not always required. 3.3.1 Input and Base Line Wander Compensation Unlike the DP83223V Twister, the DP83846A requires no external attenuation circuitry at its receive inputs, RD±. It accepts TP-PMD compliant waveforms directly, requiring only a 100Ω termination plus a simple 1:1 transformer. The DP83846A is completely ANSI TP-PMD compliant and includes Base Line Wander (BLW) compensation. The BLW compensation block can successfully recover the TPPMD defined “killer” pattern and pass it to the digital adaptive equalization block. BLW can generally be defined as the change in the average DC content, over time, of an AC coupled digital transmission over a given transmission medium. (i.e., copper wire). BLW results from the interaction between the low frequency components of a transmitted bit stream and the frequency response of the AC coupling component(s) within the transmission system. If the low frequency content of the digital bit stream goes below the low frequency pole of the AC coupling transformers then the droop characteristics of the transformers will dominate resulting in potentially serious BLW. The digital oscilloscope plot provided in Figure 7 illustrates the severity of the BLW event that can theoretically be generated during 100BASE-TX packet transmission. This event consists of approximately 800 mV of DC offset for a Figure 7. 100BASE-TX BLW Event Obsolete 21 www.national.com DP83846A Figure 8. Receive Block Diagram 4b/5b Decoder DEscrambler Digital adaptive Equalization MLT-3 to Binary decoder rd± RX_CLK RXD[3:0] / RX_ER InPUT BLW Compensation BP_4B5B BP_SCR Signal Detect nrzi to nrz decoder Code group alignment Serial to parallel mux mux LINK STATUS Clock Recovery Module CLOCK LINK Monitor ÷5 ADC AGC Obsolete 22 www.national.com DP83846A period of 120 μs. Left uncompensated, events such as this can cause packet loss. 3.3.2 Signal Detect The signal detect function of the DP83846A is incorporated to meet the specifications mandated by the ANSI FDDI TPPMD Standard as well as the IEEE 802.3 100BASE-TX Standard for both voltage thresholds and timing parameters. Note that the reception of normal 10BASE-T link pulses and fast link pulses per IEEE 802.3u Auto-Negotiation by the 100BASE-TX receiver do not cause the DP83846A to assert signal detect. 3.3.3 Digital Adaptive Equalization When transmitting data at high speeds over copper twisted pair cable, frequency dependent attenuation becomes a concern. In high-speed twisted pair signalling, the frequency content of the transmitted signal can vary greatly during normal operation based primarily on the randomness of the scrambled data stream. This variation in signal attenuation caused by frequency variations must be compensated for to ensure the integrity of the transmission. In order to ensure quality transmission when employing MLT-3 encoding, the compensation must be able to adapt to various cable lengths and cable types depending on the installed environment. The selection of long cable lengths for a given implementation, requires significant compensation which will over-compensate for shorter, less attenuating lengths. Conversely, the selection of short or intermediate cable lengths requiring less compensation will cause serious under-compensation for longer length cables. The compensation or equalization must be adaptive to ensure proper conditioning of the received signal independent of the cable length. The DP83846A utilizes a extremely robust equalization scheme referred as ‘Digital Adaptive Equalization’. Traditional designs use a pseudo adaptive equalization scheme that determines the approximate cable length by monitoring signal attenuation at certain frequencies. This attenuation value was compared to the internal receive input reference voltage. This comparison would indicate the amount of equalization to use. Although this scheme is used successfully on the DP83223V twister, it is sensitive to transformer mismatch, resistor variation and process induced offset. The DP83223V also required an external attenuation network to help match the incoming signal amplitude to the internal reference. The Digital Equalizer removes ISI (inter symbol interference) from the receive data stream by continuously adapting to provide a filter with the inverse frequency response of the channel. When used in conjunction with a gain stage, this enables the receive 'eye pattern' to be opened sufficiently to allow very reliable data recovery. Traditionally 'adaptive' equalizers selected 1 of N filters in an attempt to match the cables characteristics. This approach will typically leave holes at certain cable lengths, where the performance of the equalizer is not optimized. The DP83846A equalizer is truly adaptive to any length of cable up to 150m. 3.3.4 Clock Recovery Module The Clock Recovery Module (CRM) accepts 125 Mb/s MLT3 data from the equalizer. The DPLL locks onto the 125 Mb/s data stream and extracts a 125 MHz recovered clock. The extracted and synchronized clock and data are used as required by the synchronous receive operations as generally depicted in Figure 8. The CRM is implemented using an advanced all digital Phase Locked Loop (PLL) architecture that replaces sensitive analog circuitry. Using digital PLL circuitry allows the DP83846A to be manufactured and specified to tighter tolerances. 3.3.5 NRZI to NRZ In a typical application, the NRZI to NRZ decoder is required in order to present NRZ formatted data to the descrambler (or to the code-group alignment block, if the descrambler is bypassed, or directly to the PCS, if the receiver is bypassed). 3.3.6 Serial to Parallel The 100BASE-TX receiver includes a Serial to Parallel converter which supplies 5-bit wide data symbols to the PCS Rx state machine. 3.3.7 Descrambler A serial descrambler is used to de-scramble the received NRZ data. The descrambler has to generate an identical data scrambling sequence (N) in order to recover the original unscrambled data (UD) from the scrambled data (SD) as represented in the equations: Synchronization of the descrambler to the original scrambling sequence (N) is achieved based on the knowledge that the incoming scrambled data stream consists of scrambled IDLE data. After the descrambler has recognized 12 consecutive IDLE code-groups, where an unscrambled IDLE code-group in 5B NRZ is equal to five consecutive ones (11111), it will synchronize to the receive data stream and generate unscrambled data in the form of unaligned 5B code-groups. In order to maintain synchronization, the descrambler must continuously monitor the validity of the unscrambled data that it generates. To ensure this, a line state monitor and a hold timer are used to constantly monitor the synchronization status. Upon synchronization of the descrambler the hold timer starts a 722 μs countdown. Upon detection of sufficient IDLE code-groups (58 bit times) within the 722 μs period, the hold timer will reset and begin a new countdown. This monitoring operation will continue indefinitely given a properly operating network connection with good signal integrity. If the line state monitor does not recognize sufficient unscrambled IDLE code-groups within the 722 μs period, the entire descrambler will be forced out of the current state of synchronization and reset in order to reacquire synchronization. 3.3.8 Code-group Alignment The code-group alignment module operates on unaligned 5-bit data from the descrambler (or, if the descrambler is bypassed, directly from the NRZI/NRZ decoder) and converts it into 5B code-group data (5 bits). Code-group alignment occurs after the J/K code-group pair is detected. Once the J/K code-group pair (11000 10001) is detected, subsequent data is aligned on a fixed boundary. UD= (SD ⊕ N) SD UD N ⊕ ( ) = Obsolete 23 www.national.com DP83846A 3.3.9 4B/5B Decoder The code-group decoder functions as a look up table that translates incoming 5B code-groups into 4B nibbles. The code-group decoder first detects the J/K code-group pair preceded by IDLE code-groups and replaces the J/K with MAC preamble. Specifically, the J/K 10-bit code-group pair is replaced by the nibble pair (0101 0101). All subsequent 5B code-groups are converted to the corresponding 4B nibbles for the duration of the entire packet. This conversion ceases upon the detection of the T/R code-group pair denoting the End of Stream Delimiter (ESD) or with the reception of a minimum of two IDLE code-groups. 3.3.10 100BASE-TX Link Integrity Monitor The 100 Base TX Link monitor ensures that a valid and stable link is established before enabling both the Transmit and Receive PCS layer. Signal detect must be valid for 395us to allow the link monitor to enter the 'Link Up' state, and enable the transmit and receive functions. 3.3.11 Bad SSD Detection A Bad Start of Stream Delimiter (Bad SSD) is any transition from consecutive idle code-groups to non-idle code-groups which is not prefixed by the code-group pair /J/K. If this condition is detected, the DP83846A will assert RX_ER and present RXD[3:0] = 1110 to the MII for the cycles that correspond to received 5B code-groups until at least two IDLE code groups are detected. In addition, the False Carrier Sense Counter register (FCSCR) will be incremented by one. Once at least two IDLE code groups are detected, RX_ER and CRS become de-asserted. 3.4 10BASE-T TRANSCEIVER MODULE The 10BASE-T Transceiver Module is IEEE 802.3 compliant. It includes the receiver, transmitter, collision, heartbeat, loopback, jabber, and link integrity functions, as defined in the standard. An external filter is not required on the 10BASE-T interface since this is integrated inside the DP83846A. This section focuses on the general 10BASE-T system level operation. 3.4.1 Operational Modes The DP83846A has two basic 10BASE-T operational modes: — Half Duplex mode — Full Duplex mode Half Duplex Mode In Half Duplex mode the DP83846A functions as a standard IEEE 802.3 10BASE-T transceiver supporting the CSMA/CD protocol. Full Duplex Mode In Full Duplex mode the DP83846A is capable of simultaneously transmitting and receiving without asserting the collision signal. The DP83846A's 10 Mb/s ENDEC is designed to encode and decode simultaneously. 3.4.2 Collision Detection and SQE When in Half Duplex, a 10BASE-T collision is detected when the receive and transmit channels are active simultaneously. Collisions are reported by the COL signal on the MII. Collisions are also reported when a jabber condition is detected. The COL signal remains set for the duration of the collision. If the ENDEC is receiving when a collision is detected it is reported immediately (through the COL pin). When heartbeat is enabled, approximately 1 μs after the transmission of each packet, a Signal Quality Error (SQE) signal of approximately 10-bit times is generated to indicate successful transmission. SQE is reported as a pulse on the COL signal of the MII. The SQE test is inhibited when the PHY is set in full duplex mode. SQE can also be inhibited by setting the HEARTBEAT_DIS bit in the 10BTSCR register. 3.4.3 Carrier Sense Carrier Sense (CRS) may be asserted due to receive activity once valid data is detected via the squelch function. For 10 Mb/s Half Duplex operation, CRS is asserted during either packet transmission or reception. For 10 Mb/s Full Duplex operation, CRS is asserted only during receive activity. CRS is deasserted following an end of packet. 3.4.4 Normal Link Pulse Detection/Generation The link pulse generator produces pulses as defined in the IEEE 802.3 10BASE-T standard. Each link pulse is nominally 100 ns in duration and transmitted every 16 ms in the absence of transmit data. Link pulses are used to check the integrity of the connection with the remote end. If valid link pulses are not received, the link detector disables the 10BASE-T twisted pair transmitter, receiver and collision detection functions. When the link integrity function is disabled (FORCE_LINK_10 of the 10BTSCR register), good link is forced and the 10BASE-T transceiver will operate regardless of the presence of link pulses. 3.4.5 Jabber Function The jabber function monitors the DP83846A's output and disables the transmitter if it attempts to transmit a packet of longer than legal size. A jabber timer monitors the transmitter and disables the transmission if the transmitter is active beyond the Jab time (20-150 ms). Once disabled by the Jabber function, the transmitter stays disabled for the entire time that the ENDEC module's internal transmit enable is asserted. This signal has to be deasserted for approximately 250-750 ms (the “unjab” time) before the Jabber function re-enables the transmit outputs. The Jabber function is only relevant in 10BASE-T mode. 3.4.6 Automatic Link Polarity Detection and Correction The DP83846A's 10BASE-T transceiver module incorporates an automatic link polarity detection circuit. When seven consecutive inverted link pulses are received, inverted polarity is reported. Obsolete 24 www.national.com DP83846A A polarity reversal can be caused by a wiring error at either end of the cable, usually at the Main Distribution Frame (MDF) or patch panel in the wiring closet. The inverse polarity condition is latched in the 10BTSCR register. The DP83846A's 10BASE-T transceiver module corrects for this error internally and will continue to decode received data correctly. This eliminates the need to correct the wiring error immediately. The user is cautioned that if Auto Polarity Detection and Correction is disabled and inverted Polarity is detected but not corrected, the DsPHYTER may falsely report Good Link status and allow Transmission and Reception of inverted data. It is recommended that Auto Polarity Detection and Correction not be disabled during normal operation. 3.4.7 Transmit and Receive Filtering External 10BASE-T filters are not required when using the DP83846A, as the required signal conditioning is integrated into the device. Only isolation/step-up transformers and impedance matching resistors are required for the 10BASE-T transmit and receive interface. The internal transmit filtering ensures that all the harmonics in the transmit signal are attenuated by at least 30 dB. 3.4.8 Transmitter The encoder begins operation when the Transmit Enable input (TX_EN) goes high and converts NRZ data to preemphasized Manchester data for the transceiver. For the duration of TX_EN, the serialized Transmit Data (TXD) is encoded for the transmit-driver pair (TD±). TXD must be valid on the rising edge of Transmit Clock (TX_CLK). Transmission ends when TX_EN deasserts. The last transition is always positive; it occurs at the center of the bit cell if the last bit is a one, or at the end of the bit cell if the last bit is a zero. 3.4.9 Receiver The decoder consists of a differential receiver and a PLL to separate a Manchester encoded data stream into internal clock signals and data. The differential input must be externally terminated with a differential 100Ω termination network to accommodate UTP cable. The impedance of RD± (typically 1.1KΩ) is in parallel with the two 54.9Ω resistors as is shown in Figure 9 below to approximate the 100Ω termination. The decoder detects the end of a frame when no additional mid-bit transitions are detected. Within one and a half bit times after the last bit, carrier sense is de-asserted. 3.5 TPI Network Circuit Figure 9 shows the recommended circuit for a 10/100 Mb/s twisted pair interface. Below is a partial list of recommended transformers. Is is important that the user realize that variations with PCB and component characteristics requires that the application be tested to ensure that the circuit meets the requirements of the intended application. Pulse H1012B, PE-68515L Halo TG22-S052ND Valor PT4171 BELFUSE S558-5999-K2 BELFUSE S558-5999-46 Figure 9. 10/100 Mb/s Twisted Pair Interface RJ45 RDRD+ TDTD+ RDRD+ TDTD+ 1:1 49.9Ω 49.9 Ω 0.1μF* T1 1:1 Common Mode Chokes may be required. 54.9Ω 54.9Ω 0.1μF 0.1μF* Vdd * Place capacitors close to the transformer center taps Obsolete 25 www.national.com DP83846A 3.6 ESD Protection Typically, ESD precautions are predominantly in effect when handling the devices or board before being installed in a system. In those cases, strict handling procedures can be implemented during the manufacturing process to greatly reduce the occurrences of catastrophic ESD events. After the system is assembled, internal components are usually relatively immune from ESD events. In the case of an installed Ethernet system however, the network interface pins are still susceptible to external ESD events. For example, a category 5 cable being dragged across a carpet has the potential of developing a charge well above the typical ESD rating of a semiconductor device. For applications where high reliability is required, it is recommended that additional ESD protection diodes be added as shown below. There are numerous dual series connected diode pairs that are available specifically for ESD protection. The level of protection will vary dependent upon the diode ratings. The primary parameter that affects the level of ESD protection is peak forward surge current. Typical specifications for diodes intended for ESD protection range from 500mA (Motorola BAV99LT1 single pair diodes) to 12A (STM DA108S1 Quad pair array). The user should also select diodes with low input capacitance to minimize the effect on system performance. Since performance is dependent upon components used, board impedance characteristics, and layout, the circuit should be completely tested to ensure performance to the required levels. Figure 10. Typical DP83846A Network Interface with additional ESD protection RJ-45 DP83846A 10/100 TX± RX± Vcc Pin 1 Pin 2 Pin 3 Pin 6 Diodes placed on the device side of the isolation transformer 3.3V Vcc Vcc Obsolete 26 www.national.com DP83846A 3.7 Crystal Oscillator Circuit The DsPHYTER supports an external CMOS level oscillator source or a crystal resonator device. If an external clock source is used, X1 should be tied to the clock source and X2 should be left floating. In either case, the clock source must be a 25 MHz 0.005% (50 PPM) CMOS oscillator, or a 25 MHz (50 PPM), parallel, 20 pF load crystal resonator. Figure 11 below shows a typical connection for a crystal resonator circuit. The load capacitor values will vary with the crystal vendors; check with the vendor for the recommended loads. The oscillator circuit was designed to drive a parallel resonance AT cut crystal with a maximum drive level of 500μW. If a crystal is specified for a lower drive level, a current limiting resistor should be placed in series between X2 and the crystal. As a starting point for evaluating an oscillator circuit, if the requirements for the crystal are not known, CL1 and CL2 should be set at 22 pF, and R1 should be set at 0Ω. 4.0 Reset Operation The DP83846A can be reset either by hardware or software. A hardware reset may be accomplished by asserting the RESET pin after powering up the device (this is required) or during normal operation when a reset is needed. A software reset is accomplished by setting the reset bit in the Basic Mode Control Register. While either the hardware or software reset can be implemented at any time after device initialization, a hardware reset, as described in Section 4.1 must be provided upon device power-up/initialization. Omitting the hardware reset operation during the device power-up/initialization sequence can result in improper device operation. 4.1 Hardware Reset A hardware reset is accomplished by applying a low pulse (TTL level), with a duration of at least 160 μs, to the RESET pin during normal operation. This will reset the device such that all registers will be reset to default values and the hardware configuration values will be re-latched into the device (similar to the power-up/reset operation). 4.2 Software Reset A software reset is accomplished by setting the reset bit (bit 15) of the Basic Mode Control Register (BMCR). The period from the point in time when the reset bit is set to the point in time when software reset has concluded is approximately 160 μs. The software reset will reset the device such that all registers will be reset to default values and the hardware configuration values will be re-latched into the device (similar to the power-up/reset operation). Software driver code should wait 500 μs following a software reset before allowing further serial MII operations with the DP83846A. Figure 11. Crystal Oscillator Circuit X1 X2 CL1 CL2 R1 Obsolete 27 www.national.com DP83846A 5.0 Register Block Table 6. Register Map Offset Access Tag Description Hex Decimal 00h 0 RW BMCR Basic Mode Control Register 01h 1 RO BMSR Basic Mode Status Register 02h 2 RO PHYIDR1 PHY Identifier Register #1 03h 3 RO PHYIDR2 PHY Identifier Register #2 04h 4 RW ANAR Auto-Negotiation Advertisement Register 05h 5 RW ANLPAR Auto-Negotiation Link Partner Ability Register (Base Page) 05h 5 RW ANLPARNP Auto-Negotiation Link Partner Ability Register (Next Page) 06h 6 RW ANER Auto-Negotiation Expansion Register 07h 7 RW ANNPTR Auto-Negotiation Next Page TX 08h-Fh 8-15 RESERVED RESERVED Extended Registers 10h 16 RO PHYSTS PHY Status Register 11h-13h 17-19 RESERVED RESERVED 14h 20 RW FCSCR False Carrier Sense Counter Register 15h 21 RW RECR Receive Error Counter Register 16h 22 RW PCSR PCS Sub-Layer Configuration and Status Register 17h 23 RW RESERVED RESERVED 18h 24 RW RESERVED RESERVED 19h 25 RW PHYCTRL PHY Control Register 1Ah 26 RW 10BTSCR 10Base-T Status/Control Register 1Bh 27 RW CDCTRL CD Test Control Register 1Ch-1Fh 28 RW RESERVED RESERVED Obsolete 28 www.national.com DP83846A Register Name Addr Tag Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Basic Mode Control Register 00h BMCR Reset Loopback Speed Select Auto-Neg Enable Power down Isolate Restart Auto-Neg Duplex Collision Test Reserved Reserved Reserved Reserved Reserved Reserved Reserved Basic Mode Status Register 01h BMSR 100Base- T4 100Base- TX FDX 100Base- TX HDX 10Base- T FDXx 10Base- T HDX Reserved Reserved Reserved Reserved MF Preamble Suppress Auto-Neg Complete Remote Fault Auto-Neg Ability Link Status Jabber Detect Extended Capability PHY Identifier Register 1 02h PHYIDR1 OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB OUI MSB PHY Identifier Register 2 03h PHYIDR2 OUI LSB OUI LSB OUI LSB OUI LSB OUI LSB OUI LSB VNDR_ MDL VNDR_ MDL VNDR_ MDL VNDR_ MDL VNDR_ MDL VNDR_ MDL MDL_ REV MDL_ REV MDL_ REV MDL_ REV Auto-Negotiation Advertisement Register 04h ANAR Next Page Ind Reserved Remote Fault Reserved Reserved PAUSE T4 TX_FD TX 10_FD 10 Protocol Selection Protocol Selection Protocol Selection Protocol Selection Protocol Selection Auto-Negotiation Link Partner Ability Register (Base Page) 05h ANLPAR Next Page Ind ACK Remote Fault Reserved Reserved Reserved T4 TX_FD TX 10_FD 10 Protocol Selection Protocol Selection Protocol Selection Protocol Selection Protocol Selection Auto-Negotiation Link Partner Ability Register Next Page 05h ANLPARNP Next Page Ind ACK Message Page ACK2 Toggle Code Code Code Code Code Code Code Code Code Code Code Auto-Negotiation Expansion Register 06h ANER Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved PDF LP_NP_ ABLE NP_ ABLE PAGE_ RX LP_AN_ ABLE Auto-Negotiation Next Page TX Register 07h ANNPTR Next Page Ind Reserved Message Page ACK2 TOG_TX CODE CODE CODE CODE CODE CODE CODE CODE CODE CODE CODE RESERVED 08-0fh Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved EXTENDED REGISTERS PHY Status Register 10h PHYSTS Reserved Reserved Rx Err Latch Polarity Status False Carrier Sense Signal Detect Descram Lock Page Receive Reserved Remote Fault Jabber Detect Auto-Neg Complete Loopback Status Duplex Status Speed Status Link Status RESERVED 11-13h Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved False Carrier Sense Counter Register 14h FCSCR Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved FCSCNT FCSCNT FCSCNT FCSCNT FCSCNT FCSCNT FCSCNT FCSCNT Receive Error Counter Register 15h RECR Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved RXERCNT RXERCNT RXERCNT RXERCNT RXERCNT RXERCNT RXERCNT RXERCNT PCS Sub-Layer Configuration and Status Register 16h PCSR Reserved Reserved Reserved BYP_ 4B5B FREE_ CLK TQ_EN SD_FOR CE_PMA SD_ OPTION Unused Reserved FORCE_ 100_OK Reserved Reserved NRZI_ BYPASS SCRAM_ BYPASS DE SCRAM_ BYPASS RESERVED 17-18h Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved PHY Control Register 19h PHYCTRL Unused Unused Unused Unused PSR_15 BIST_ STATUS BIST_ START BP_ STRETC H PAUSE_ STS LED_ CNFG LED_ CNFG PHY ADDR PHY ADDR PHY ADDR PHY ADDR PHY ADDR 10Base-T Status/Control Register 1Ah 10BTSCR Unused Unused Unused Unused Unused Unused Unused Loopback _10_dis LP_DIS Force_ Link_10 Force_ Pol_Cor Polarity Autopol _Dis Reserved Hrtbeat _Dis Jabber _Dis CD Test Control Register 1Bh CDCTRL CD_Enabl e DCD_ Comp FIL_TTL rise- Time[1] rise- Time[0] fallTime[1] fallTime[0] cdTestEn Reserved Reserved Reserved cdPattEn_ 10 cdPatEn_ 100 10meg_ patt_gap cdPatt- Sel[1] cdPatt- Sel[0] RESERVED 1C-1Fh Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Obsolete 29 www.national.com DP83846A 5.1 Register Definition In the register definitions under the ‘Default’ heading, the following definitions hold true: — RW=Read Write access — SC=Register sets on event occurrence and Self-Clears when event ends — RW/SC =Read Write access/Self Clearing bit — RO=Read Only access — COR = Clear on Read — RO/COR=Read Only, Clear on Read — RO/P=Read Only, Permanently set to a default value — LL=Latched Low and held until read, based upon the occurrence of the corresponding event — LH=Latched High and held until read, based upon the occurrence of the corresponding event Obsolete 30 www.national.com DP83846A Table 7. Basic Mode Control Register (BMCR), Address 0x00 Bit Bit Name Default Description 15 Reset 0, RW/SC Reset: 1 = Initiate software Reset / Reset in Process. 0 = Normal operation. This bit, which is self-clearing, returns a value of one until the reset process is complete. The configuration is re-strapped. 14 Loopback 0, RW Loopback: 1 = Loopback enabled. 0 = Normal operation. The loopback function enables MII transmit data to be routed to the MII receive data path. Setting this bit may cause the descrambler to lose synchronization and produce a 500 μs “dead time” before any valid data will appear at the MII receive outputs. 13 Speed Selection Strap, RW Speed Select: When auto-negotiation is disabled writing to this bit allows the port speed to be selected. 1 = 100 Mb/s. 0 = 10 Mb/s. 12 Auto-Negotiation Enable Strap, RW Auto-Negotiation Enable: Strap controls initial value at reset. 1 = Auto-Negotiation Enabled - bits 8 and 13 of this register are ignored when this bit is set. 0 = Auto-Negotiation Disabled - bits 8 and 13 determine the port speed and duplex mode. 11 Power Down 0, RW Power Down: 1 = Power down. 0 = Normal operation. Setting this bit powers down the PHY. Only the register block is enabled during a power down condition. 10 Isolate 0, RW Isolate: 1 = Isolates the Port from the MII with the exception of the serial management. 0 = Normal operation. 9 Restart Auto- Negotiation 0, RW/SC Restart Auto-Negotiation: 1 = Restart Auto-Negotiation. Re-initiates the Auto-Negotiation process. If Auto- Negotiation is disabled (bit 12 = 0), this bit is ignored. This bit is self-clearing and will return a value of 1 until Auto-Negotiation is initiated, whereupon it will selfclear. Operation of the Auto-Negotiation process is not affected by the management entity clearing this bit. 0 = Normal operation. 8 Duplex Mode Strap, RW Duplex Mode: When auto-negotiation is disabled writing to this bit allows the port Duplex capability to be selected. 1 = Full Duplex operation. 0 = Half Duplex operation. 7 Collision Test 0, RW Collision Test: 1 = Collision test enabled. 0 = Normal operation. When set, this bit will cause the COL signal to be asserted in response to the assertion of TX_EN within 512-bit times. The COL signal will be de-asserted within 4-bit times in response to the de-assertion of TX_EN. 6:0 RESERVED 0, RO RESERVED: Write ignored, read as 0. Obsolete 31 www.national.com DP83846A Table 8. Basic Mode Status Register (BMSR), address 0x01 Bit Bit Name Default Description 15 100BASE-T4 0, RO/P 100BASE-T4 Capable: 0 = Device not able to perform 100BASE-T4 mode. 14 100BASE-TX Full Duplex 1, RO/P 100BASE-TX Full Duplex Capable: 1 = Device able to perform 100BASE-TX in full duplex mode. 13 100BASE-TX Half Duplex 1, RO/P 100BASE-TX Half Duplex Capable: 1 = Device able to perform 100BASE-TX in half duplex mode. 12 10BASE-T Full Duplex 1, RO/P 10BASE-T Full Duplex Capable: 1 = Device able to perform 10BASE-T in full duplex mode. 11 10BASE-T Half Duplex 1, RO/P 10BASE-T Half Duplex Capable: 1 = Device able to perform 10BASE-T in half duplex mode. 10:7 RESERVED 0, RO RESERVED: Write as 0, read as 0. 6 MF P reamble Suppression 1, RO/P Preamble suppression Capable: 1 = Device able to perform management transaction with preamble suppressed, 32-bits of preamble needed only once after reset, invalid opcode or invalid turnaround. 0 = Normal management operation. 5 Auto-Negotiation Complete 0, RO Auto-Negotiation Complete: 1 = Auto-Negotiation process complete. 0 = Auto-Negotiation process not complete. 4 Remote Fault 0, RO/LH Remote Fault: 1 = Remote Fault condition detected (cleared on read or by reset). Fault criteria: Far End Fault Indication or notification from Link Partner of Remote Fault. 0 = No remote fault condition detected. 3 Auto-Negotiation Ability 1, RO/P Auto Negotiation Ability: 1 = Device is able to perform Auto-Negotiation. 0 = Device is not able to perform Auto-Negotiation. 2 Link Status 0, RO/LL Link Status: 1 = Valid link established (for either 10 or 100 Mb/s operation). 0 = Link not established. The criteria for link validity is implementation specific. The occurrence of a link failure condition will causes the Link Status bit to clear. Once cleared, this bit may only be set by establishing a good link condition and a read via the management interface. 1 Jabber Detect 0, RO/LH Jabber Detect: This bit only has meaning in 10 Mb/s mode. 1 = Jabber condition detected. 0 = No Jabber. This bit is implemented with a latching function, such that the occurrence of a jabber condition causes it to set until it is cleared by a read to this register by the management interface or by a reset. 0 Extended Capability 1, RO/P Extended Capability: 1 = Extended register capabilities. 0 = Basic register set capabilities only. Obsolete 32 www.national.com DP83846A The PHY Identifier Registers #1 and #2 together form a unique identifier for the DP83846A. The Identifier consists of a concatenation of the Organizationally Unique Identifier (OUI), the vendor's model number and the model revision number. A PHY may return a value of zero in each of the 32 bits of the PHY Identifier if desired. The PHY Identifier is intended to support network management. National's IEEE assigned OUI is 080017h. Table 9. PHY Identifier Register #1 (PHYIDR1), address 0x02 Bit Bit Name Default Description 15:0 OUI_MSB <0010 0000 0000 0000>, RO/P OUI Most Significant Bits: Bits 3 to 18 of the OUI (080017h) are stored in bits 15 to 0 of this register. The most significant two bits of the OUI are ignored (the IEEE standard refers to these as bits 1 and 2). Table 10. PHY Identifier Register #2 (PHYIDR2), address 0x03 Bit Bit Name Default Description 15:10 OUI_LSB <01 0111>, RO/P OUI Least Significant Bits: Bits 19 to 24 of the OUI (080017h) are mapped to bits 15 to 10 of this register respectively. 9:4 VNDR_MDL <00 0010>, RO/P Vendor Model Number: The six bits of vendor model number are mapped to bits 9 to 4 (most significant bit to bit 9). 3:0 MDL_REV <0011>, RO/P Model Revision Number: Four bits of the vendor model revision number are mapped to bits 3 to 0 (most significant bit to bit 3). This field will be incremented for all major device changes. Obsolete 33 www.national.com DP83846A This register contains the advertised abilities of this device as they will be transmitted to its link partner during Auto-Negotiation. Table 11. Auto-Negotiation Advertisement Register (ANAR), address 0x04 Bit Bit Name Default Description 15 NP 0, RW Next Page Indication: 0 = Next Page Transfer not desired. 1 = Next Page Transfer desired. 14 RESERVED 0, RO/P RESERVED by IEEE: Writes ignored, Read as 0. 13 RF 0, RW Remote Fault: 1 = Advertises that this device has detected a Remote Fault. 0 = No Remote Fault detected. 12:11 RESERVED 0, RW RESERVED for Future IEEE use: Write as 0, Read as 0 10 PAUSE Strap, RW PAUSE: The default is set by the strap option for PAUSE_EN pin. 1 = Advertise that the DTE (MAC) has implemented both the optional MAC control sublayer and the pause function as specified in clause 31 and annex 31B of 802.3u. 0= No MAC based full duplex flow control. 9 T4 0, RO/P 100BASE-T4 Support: 1= 100BASE-T4 is supported by the local device. 0 = 100BASE-T4 not supported. 8 TX_FD Strap, RW 100BASE-TX Full Duplex Support: 1 = 100BASE-TX Full Duplex is supported by the local device. 0 = 100BASE-TX Full Duplex not supported. 7 TX Strap, RW 100BASE-TX Support: 1 = 100BASE-TX is supported by the local device. 0 = 100BASE-TX not supported. 6 10_FD Strap, RW 10BASE-T Full Duplex Support: 1 = 10BASE-T Full Duplex is supported by the local device. 0 = 10BASE-T Full Duplex not supported. 5 10 Strap, RW 10BASE-T Support: 1 = 10BASE-T is supported by the local device. 0 = 10BASE-T not supported. 4:0 Selector <00001>, RW Protocol Selection Bits: These bits contain the binary encoded protocol selector supported by this port. <00001> indicates that this device supports IEEE 802.3u. Obsolete 34 www.national.com DP83846A This register contains the advertised abilities of the Link Partner as received during Auto-Negotiation. The content changes after the successful auto negotiation if Next-pages are supported. Table 12. Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page), address 0x05 Bit Bit Name Default Description 15 NP 0, RO Next Page Indication: 0 = Link Partner does not desire Next Page Transfer. 1 = Link Partner desires Next Page Transfer. 14 ACK 0, RO Acknowledge: 1 = Link Partner acknowledges reception of the ability data word. 0 = Not acknowledged. The Device's Auto-Negotiation state machine will automatically control the this bit based on the incoming FLP bursts. 13 RF 0, RO Remote Fault: 1 = Remote Fault indicated by Link Partner. 0 = No Remote Fault indicated by Link Partner. 12:10 RESERVED 0, RO RESERVED for Future IEEE use: Write as 0, read as 0. 9 T4 0, RO 100BASE-T4 Support: 1 = 100BASE-T4 is supported by the Link Partner. 0 = 100BASE-T4 not supported by the Link Partner. 8 TX_FD 0, RO 100BASE-TX Full Duplex Support: 1 = 100BASE-TX Full Duplex is supported by the Link Partner. 0 = 100BASE-TX Full Duplex not supported by the Link Partner. 7 TX 0, RO 100BASE-TX Support: 1 = 100BASE-TX is supported by the Link Partner. 0 = 100BASE-TX not supported by the Link Partner. 6 10_FD 0, RO 10BASE-T Full Duplex Support: 1 = 10BASE-T Full Duplex is supported by the Link Partner. 0 = 10BASE-T Full Duplex not supported by the Link Partner. 5 10 0, RO 10BASE-T Support: 1 = 10BASE-T is supported by the Link Partner. 0 = 10BASE-T not supported by the Link Partner. 4:0 Selector <0 0000>, RO Protocol Selection Bits: Link Partner’s binary encoded protocol selector. Obsolete 35 www.national.com DP83846A This register contains additional Local Device and Link Partner status information. Table 13. Auto-Negotiation Link Partner Ability Register (ANLPAR) Next Page, address 0x05 Bit Bit Name Default Description 15 NP 0, RO Next Page Indication: 1 = Link Partner desires Next Page Transfer. 0 = Link Partner does not desire Next Page Transfer. 14 ACK 0, RO Acknowledge: 1 = Link Partner acknowledges reception of the ability data word. 0 = Not acknowledged. The Device's Auto-Negotiation state machine will automatically control the this bit based on the incoming FLP bursts. Software should not attempt to write to this bit. 13 MP 0, RO Message Page: 1 = Message Page. 0 = Unformatted Page. 12 ACK2 0, RO Acknowledge 2: 1 = Link Partner does have the ability to comply to next page message. 0 = Link Partner does not have the ability to comply to next page message. 11 Toggle 0, RO Toggle: 1 = Previous value of the transmitted Link Code word equalled 0. 0 = Previous value of the transmitted Link Code word equalled 1. 10:0 CODE <000 0000 0000>, RO Code: This field represents the code field of the next page transmission. If the MP bit is set (bit 13 of this register), then the code shall be interpreted as a “Message Page”, as defined in annex 28C of Clause 28. Otherwise, the code shall be interpreted as an “Unformatted Page”, and the interpretation is application specific. Table 14. Auto-Negotiate Expansion Register (ANER), address 0x06 Bit Bit Name Default Description 15:5 RESERVED 0, RO RESERVED: Writes ignored, Read as 0. 4 PDF 0, RO/LH/COR Parallel Detection Fault: 1 = A fault has been detected via the Parallel Detection function. 0 = A fault has not been detected. 3 LP_NP_ABLE 0, RO Link Partner Next Page Able: 1 = Link Partner does support Next Page. 0 = Link Partner does not support Next Page. 2 NP_ABLE 1, RO/P Next Page Able: 1 = Indicates local device is able to send additional “Next Pages”. 1 PAGE_RX 0, RO/LH/COR Link Code Word Page Received: 1 = Link Code Word has been received, cleared on a read. 0 = Link Code Word has not been received. 0 LP_AN_ABLE 0, RO Link Partner Auto-Negotiation Able: 1 = indicates that the Link Partner supports Auto-Negotiation. 0 = indicates that the Link Partner does not support Auto-Negotiation. Obsolete 36 www.national.com DP83846A This register contains the next page information sent by this device to its Link Partner during Auto-Negotiation. Table 15. Auto-Negotiation Next Page Transmit Register (ANNPTR), address 0x07 Bit Bit Name Default Description 15 NP 0, RW Next Page Indication: 0 = No other Next Page Transfer desired. 1 = Another Next Page desired. 14 RESERVED 0, RO RESERVED: Writes ignored, read as 0. 13 MP 1, RW Message Page: 1 = Message Page. 0 = Unformatted Page. 12 ACK2 0, RW Acknowledge2: 1 = Will comply with message. 0 = Cannot comply with message. Acknowledge2 is used by the next page function to indicate that Local Device has the ability to comply with the message received. 11 TOG_TX 0, RO Toggle: 1 = Value of toggle bit in previously transmitted Link Code Word was 0. 0 = Value of toggle bit in previously transmitted Link Code Word was 1. Toggle is used by the Arbitration function within Auto-Negotiation to ensure synchronization with the Link Partner during Next Page exchange. This bit shall always take the opposite value of the Toggle bit in the previously exchanged Link Code Word. 10:0 CODE <000 0000 0001>, RW This field represents the code field of the next page transmission. If the MP bit is set (bit 13 of this register), then the code shall be interpreted as a "Message Page”, as defined in annex 28C of IEEE 802.3u. Otherwise, the code shall be interpreted as an "Unformatted Page”, and the interpretation is application specific. The default value of the CODE represents a Null Page as defined in Annex 28C of IEEE 802.3u. Obsolete 37 www.national.com DP83846A 5.2 Extended Registers This register provides a single location within the register set for quick access to commonly accessed information. Table 16. PHY Status Register (PHYSTS), address 0x10 Bit Bit Name Default Description 15:14 RESERVED 0, RO RESERVED: Write ignored, read as 0. 13 Receive Error Latch 0, RO/LH Receive Error Latch: This bit will be cleared upon a read of the RECR register. 1 = Receive error event has occurred since last read of RXERCNT (address 0x15, Page 0). 0 = No receive error event has occurred. 12 Polarity Status 0, RO Polarity Status: This bit is a duplication of bit 4 in the 10BTSCR register. This bit will be cleared upon a read of the 10BTSCR register, but not upon a read of the PHYSTS register. 1 = Inverted Polarity detected. 0 = Correct Polarity detected. 11 False Carrier Sense Latch 0, RO/LH False Carrier Sense Latch: This bit will be cleared upon a read of the FCSR register. 1 = False Carrier event has occurred since last read of FCSCR (address 0x14). 0 = No False Carrier event has occurred. 10 Signal Detect 0, RO/LL 100Base-TX unconditional Signal Detect from PMD. 9 Descrambler Lock 0, RO/LL 100Base-TX Descrambler Lock from PMD. 8 Page Received 0, RO Link Code Word Page Received: This is a duplicate of the Page Received bit in the ANER register, but this bit will not be cleared upon a read of the PHYSTS register. 1 = A new Link Code Word Page has been received. Cleared on read of the ANER (address 0x06, bit 1). 0 = Link Code Word Page has not been received. Obsolete 38 www.national.com DP83846A 7 RESERVED 0, RO RESERVED: Writes ignored, Read as 0. 6 Remote Fault 0, RO Remote Fault: 1 = Remote Fault condition detected (cleared on read of BMSR (address 01h) register or by reset). Fault criteria: notification from Link Partner of Remote Fault via Auto-Negotiation. 0 = No remote fault condition detected. 5 Jabber Detect 0, RO Jabber Detect: This bit only has meaning in 10 Mb/s mode This bit is a duplicate of the Jabber Detect bit in the BMSR register, except that it is not cleared upon a read of the PHYSTS register. 1 = Jabber condition detected. 0 = No Jabber. 4 Auto-Neg Complete 0, RO Auto-Negotiation Complete: 1 = Auto-Negotiation complete. 0 = Auto-Negotiation not complete. 3 Loopback Status 0, RO Loopback: 1 = Loopback enabled. 0 = Normal operation. 2 Duplex Status 0, RO Duplex: This bit indicates duplex status and is determined from Auto-Negotiation or Forced Modes. 1 = Full duplex mode. 0 = Half duplex mode. Note: This bit is only valid if Auto-Negotiation is enabled and complete and there is a valid link or if Auto-Negotiation is disabled and there is a valid link. 1 Speed Status 0, RO Speed10: This bit indicates the status of the speed and is determined from Auto-Negotiation or Forced Modes. 1 = 10 Mb/s mode. 0 = 100 Mb/s mode. Note: This bit is only valid if Auto-Negotiation is enabled and complete and there is a valid link or if Auto-Negotiation is disabled and there is a valid link. 0 Link Status 0, RO Link Status: This bit is a duplicate of the Link Status bit in the BMSR register, except that it will no be cleared upon a read of the PHYSTS register. 1 = Valid link established (for either 10 or 100 Mb/s operation). 0 = Link not established. Table 16. PHY Status Register (PHYSTS), address 0x10 (Continued) Bit Bit Name Default Description Obsolete 39 www.national.com DP83846A This counter provides information required to implement the “FalseCarriers” attribute within the MAU managed object class of Clause 30 of the IEEE 802.3u specification. This counter provides information required to implement the “SymbolErrorDuringCarrier” attribute within the PHY managed object class of Clause 30 of the IEEE 802.3u specification. Table 17. False Carrier Sense Counter Register (FCSCR), address 0x14 Bit Bit Name Default Description 15:8 RESERVED 0, RO RESERVED: Writes ignored, Read as 0. 7:0 FCSCNT[7:0] 0, RW / COR False Carrier Event Counter: This 8-bit counter increments on every false carrier event. This counter sticks when it reaches its max count (FFh). Table 18. Receiver Error Counter Register (RECR), address 0x15 Bit Bit Name Default Description 15:8 RESERVED 0, RO RESERVED: Writes ignored, Read as 0 7:0 RXERCNT[7:0] 0, RW / COR RX_ER Counter: This 8-bit counter increments for each receive error detected. When a valid carrier is present and there is at least one occurrence of an invalid data symbol. This event can increment only once per valid carrier event. If a collision is present, the attribute will not increment. The counter sticks when it reaches its max count. Table 19. 100 Mb/s PCS Configuration and Status Register (PCSR), address 0x16 Bit Bit Name Default Description 15:13 RESERVED <00>, RO RESERVED: Writes ignored, Read as 0. 12 BYP_4B5B 0, RW Bypass 4B/5B Encoding: 1 = 4B5B encoder functions bypassed. 0 = Normal 4B5B operation. 11 FREE_CLK 0, RW Receive Clock: 1 = RX_CK is free-running. 0 = RX_CK phase adjusted based on alignment. 10 TQ_EN 0, RW 100Mbs True Quiet Mode Enable: 1 = Transmit True Quiet Mode. 0 = Normal Transmit Mode. 9 SD FORCE PMA 0, RW Signal Detect Force PMA: 1 = Forces Signal Detection in PMA. 0 = Normal SD operation. 8 SD_OPTION 1, RW Signal Detect Option: 1 = Enhanced signal detect algorithm. 0 = Reduced signal detect algorithm. Obsolete 40 www.national.com DP83846A 7 Unused 0,RO 6 RESERVED 0 RESERVED: Must be zero. 5 FORCE_100_OK 0, RW Force 100Mb/s Good Link: 1 = Forces 100Mb/s Good Link. 0 = Normal 100Mb/s operation. 4 RESERVED 0 RESERVED: Must be zero. 3 RESERVED 0 RESERVED: Must be zero. 2 NRZI_BYPASS 0, RW NRZI Bypass Enable: 1 = NRZI Bypass Enabled. 0 = NRZI Bypass Disabled. 1 SCRAM_BYPASS 0, RW Scrambler Bypass Enable: 1 = Scrambler Bypass Enabled. 0 = Scrambler Bypass Disabled. 0 DESCRAM_BYPA SS 0, RW Descrambler Bypass Enable: 1 = Descrambler Bypass Enabled. 0 = Descrambler Bypass Disabled. Table 20. Reserved Registers, addresses 0x17, 0x18 Bit Bit Name Default Description 15:0 RESERVED none, RW RESERVED: Must not be written to during normal operation. Table 19. 100 Mb/s PCS Configuration and Status Register (PCSR), address 0x16 (Continued) Bit Bit Name Default Description Obsolete 41 www.national.com DP83846A Table 21. PHY Control Register (PHYCTRL), address 0x19 Bit Bit Name Default Description 15:12 Unused 0, RO 11 PSR_15 0, RW BIST Sequence select: 1 = PSR15 selected. 0 = PSR9 selected. 10 BIST_STATUS 0, RO/LL BIST Test Status: 1 = BIST pass. 0 = BIST fail. Latched, cleared by write to BIST_ START bit. 9 BIST_START 0, RW BIST Start: 1 = BIST start. 0 = BIST stop. 8 BP_STRETCH 0, RW Bypass LED Stretching: This will bypass the LED stretching for the Receive, Transmit and Collision LEDs. 1 = Bypass LED stretching. 0 = Normal operation. 7 PAUSE_STS 0, RO Pause Compare Status: 0 = Local Device and the Link Partner are not Pause capable. 1 = Local Device and the Link Partner are both Pause capable. 6 RESERVED 1, RO/P Reserved: Must be 1. 5 LED_CNFG Strap, RW This bit is used to bypass the selective inversion on the LED output for DPLX - this enables its use in non-LED applications. Mode Description 1 = Led polarity adjusted - DPLX selected. 0 = DPLX active HIGH. 4:0 PHYADDR[4:0] Strap, RW PHY Address: PHY address for port. Obsolete 42 www.national.com DP83846A Table 22. 10Base-T Status/Control Register (10BTSCR), Address 0x1A Bit Bit Name Default Description 15:9 Unused 0, RO 8 LOOPBACK_10_DIS 0, RW 10BASE-T Loopback Disable: If bit 14 (Loopback) in the BMCR is 0: 1 = 10 Mb/s Loopback is disabled. If bit 14 (Loopback) in the BMCR is 1: 1 = 10 Mb/s Loopback is enabled. 7 LP_DIS 0, RW Normal Link Pulse Disable: 1 = Transmission of NLPs is disabled. 0 = Transmission of NLPs is enabled. 6 FORCE_LINK_10 0, RW Force 10Mb Good Link: 1 = Forced Good 10Mb Link. 0 = Normal Link Status. 5 FORCE_POL_COR 0, RW Force 10Mb Polarity Correction: 1 = Force inverted polarity. 0 = Normal polarity. 4 POLARITY RO/LH 10Mb Polarity Status: This bit is a duplication of bit 12 in the PHYSTS register. Both bits will be cleared upon a read of 10BTSCR register, but not upon a read of the PHYSIS register. 1 = Inverted Polarity detected. 0 = Correct Polarity detected. 3 AUTOPOL_DIS 0, RW Auto Polarity Detection & Correction Disable: 1 = Polarity Sense & Correction disabled. 0 = Polarity Sense & Correction enabled. 2 RESERVED 1, RW RESERVED: Must be set to one. 1 HEARTBEAT_DIS 0, RW Heartbeat Disable: This bit only has influence in half-duplex 10Mb mode. 1 = Heartbeat function disabled. 0 = Heartbeat function enabled. When the device is operating at 100Mb or configured for full duplex operation, this bit will be ignored - the heartbeat function is disabled. 0 JABBER_DIS 0, RW Jabber Disable: Applicable only in 10BASE-T. 1 = Jabber function disabled. 0 = Jabber function enabled. Obsolete 43 www.national.com DP83846A Table 23. CD Test Register (CDCTRL), Address 0x1B Bit Bit Name Default Description 15 CD_ENABLE 1, RW CD Enable: 1 = CD Enabled - power-down mode, outputs high impedance. 0 = CD Disabled. 14 DCDCOMP 0, RW Duty Cycle Distortion Compensation: 1 = Increases the amount of DCD compensation. 13 FIL_TTL 0, RW Waveshaper Current Source Test: To check ability of waveshaper current sources to switch on/off. 1 = Test mode; waveshaping is done, but the output is a square wave. All sources are either on or off. 0 = Normal mode; sinusoidal. 12 RESERVED none, RW Reserved: This bit should be written with a 0 if write access is required on this register. 11 RISETIME Strap, RW CD Rise Time Control: 10 RESERVED none, RW Reserved: This bit should be written with a 0 if write access is required on this register. 9 FALLTIME Strap, RW CD Fall Time Control: 8 CDTESTEN 0, RW CD Test Mode Enable: 1 = Enable CD test mode - differs based on speed of operation (10/100Mb). 0 = Normal operation. 7:5 RESERVED[2:0] 000, RW RESERVED: Must be zero. 4 CDPATTEN_10 0, RW CD Pattern Enable for 10meg: 1 = Enabled. 0 = Disabled. 3 CDPATTEN_100 0, RW CD Pattern Enable for 100meg: 1 = Enabled. 0 = Disabled. 2 10MEG_PATT_GAP 0, RW Defines gap between data or NLP test sequences: 1 = 15 μs. 0 = 10 μs. 1:0 CDPATTSEL[1:0] 00, RW CD Pattern Select[1:0]: If CDPATTEN_100 = 1: 00 = All 0’s (True quiet) 01 = All 1’s 10 = 2 1’s, 2 0’s repeating pattern 11 = 14 1’s, 6 0’s repeating pattern If CDPATTEN_10 = 1: 00 = Data, EOP0 sequence 01 = Data, EOP1 sequence 10 = NLPs 11 = Constant Manchester 1s (10mhz sine wave) for harmonic distortion testing. Obsolete 44 www.national.com DP83846A 6.0 Electrical Specifications Absolute Maximum Ratings Recommended Operating Conditions Absolute maximum ratings are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. Note:0 DC Electrical Specification Supply Voltage (VCC) -0.5 V to 4.2 V DC Input Voltage (VIN) -0.5V to 5.5V DC Output Voltage (VOUT) -0.5V to 5.5V Storage Temperature (TSTG) -65oC to 150°C Lead Temp. (TL) (Soldering, 10 sec) 260°C ESD Rating (RZAP = 1.5k, CZAP = 120 pF) 1.0 kV Supply voltage (VCC) 3.3 Volts + 0.3V Ambient Temperature (TA) 0 to 70 °C Max. die temperature (Tj) 107°C Max case temp 96°C Thermal Characteristic Max Units Theta Junction to Case (Tjc) 15 °C / W Theta Junction to Ambient (Tja) degrees Celsius/Watt - No Airflow @ 1.0W 51 °C / W Theta Junction to Ambient (Tja) degrees Celsius/Watt - 225 LFPM Airflow @ 1.0W 42 °C / W Theta Junction to Ambient (Tja) degrees Celsius/Watt - 500 LFPM Airflow @ 1.0W 37 °C / W Theta Junction to Ambient (Tja) degrees Celsius/Watt - 900 LFPM Airflow @ 1.0W 33 °C / W Symbol Pin Types Parameter Conditions Min Typ Max Units VIH I I/O Input High Voltage Nominal VCC 2.0 V VIL I I/O Input Low Voltage 0.8 V IIH I I/O Input High Current VIN = VCC 10 μA IIL I I/O Input Low Current VIN = GND 10 μA VOL O, I/O Output Low Voltage IOL = 4 mA 0.4 V VOH O, I/O Output High Voltage IOH = -4 mA VCC - 0.5 V VledOL LED Output Low Voltage * IOL = 2.5 mA 0.4 V VledOH LED Output High Voltage IOH = -2.5 mA VCC - 0.5 V IOZH I/O, O TRI-STATE Leakage VOUT = VCC 10 μA I5IH I/O, O 5 Volt Tolerant MII Leakage VIN = 5.25 V 10 μA I5OZH I/O, O 5 Volt Tolerant MII Leakage VOUT = 5.25 V 10 μA RINdiff RD+/− Differential Input Resistance 1.1 kΩ VTPTD_100 TD+/− 100M Transmit Voltage .95 1 1.05 V Obsolete 45 www.national.com DP83846A Note: For Idd Measurements, outputs are not loaded. VTPTDsym TD+/− 100M Transmit Voltage Symmetry ±2 % VTPTD_10 TD+/− 10M Transmit Voltage 2.2 2.5 2.8 V CIN1 I CMOS Input Capacitance Parameter is not 100% tested 8 pF SDTHon RD+/− 100BASE-TX Signal detect turnon threshold 1000 mV diff pk-pk SDTHoff RD+/− 100BASE-TX Signal detect turnoff threshold 200 mV diff pk-pk VTH1 RD+/− 10BASE-T Receive Threshold 300 585 mV Idd100 Supply 100BASE-TX (Full Duplex) IOUT = 0 mA See Note 150 200 mA Idd10 Supply 10BASE-T (Full Duplex) IOUT = 0 mA See Note 100 130 mA Symbol Pin Types Parameter Conditions Min Typ Max Units Obsolete 46 www.national.com DP83846A 6.1 Reset Timing Note1: Software Reset should be initiated no sooner then 500 μs after power-up or the deassertion of hardware reset. Note2: It is important to choose pull-up and/or pull-down resistors for each of the hardware configuration pins that provide fast RC time constants in order to latch-in the proper value prior to the pin transitioning to an output driver. Parameter Description Notes Min Typ Max Units T1.0.1 Post RESET Stabilization time prior to MDC preamble for register accesses MDIO is pulled high for 32-bit serial management initialization 3 μs T1.0.2 Hardware Configuration Latch-in Time from the Deassertion of RESET (either soft or hard) Hardware Configuration Pins are described in the Pin Description section 3 μs T1.0.3 Hardware Configuration pins transition to output drivers 3.5 μs T1.0.4 RESET pulse width X1 Clock must be stable for a minimum of 160us during RESET pulse low time. 160 μs VCC HARDWARE RSTN MDC 32 CLOCKS Latch-In of Hardware Configuration Pins Dual Function Pins Become Enabled As Outputs INPUT OUTPUT T1.0.3 T1.0.2 T1.0.1 T1.0.4 X1 Clock Obsolete 47 www.national.com DP83846A 6.2 PGM Clock Timing 6.3 MII Serial Management Timing Parameter Description Notes Min Typ Max Units T2.0.1 TX_CLK Duty Cycle 35 65 % Parameter Description Notes Min Typ Max Units T3.0.1 MDC to MDIO (Output) Delay Time 0 300 ns T3.0.2 MDIO (Input) to MDC Setup Time 10 ns T3.0.3 MDIO (Input) to MDC Hold Time 10 ns T3.0.4 MDC Frequency 2.5 MHz TX_CLK X1 T2.0.1 MDC MDC MDIO (output) MDIO (input) Valid Data T3.0.1 T3.0.2 T3.0.3 T3.0.4 Obsolete 48 www.national.com DP83846A 6.4 100 Mb/s Timing 6.4.1 100 Mb/s MII Transmit Timing 6.4.2 100 Mb/s MII Receive Timing Parameter Description Notes Min Typ Max Units T4.1.1 TXD[3:0], TX_EN, TX_ER Data Setup to TX_CLK 10 ns T4.1.2 TXD[3:0], TX_EN, TX_ER Data Hold from TX_CLK 5 ns Parameter Description Notes Min Typ Max Units T4.2.1 RX_CLK Duty Cycle 35 65 % T4.2.2 RX_CLK to RXD[3:0], RX_DV, RX_ER Delay 10 30 ns TX_CLK TXD[3:0] TX_EN TX_ER Valid Data T4.1.1 T4.1.2 RX_CLK RXD[3:0] RX_DV RX_ER Valid Data T4.2.2 T4.2.1 Obsolete 49 www.national.com DP83846A 6.4.3 100BASE-TX Transmit Packet Latency Timing Note: Latency is determined by measuring the time from the first rising edge of TX_CLK occurring after the assertion of TX_EN to the first bit of the “J” code group as output from the TD± pins. 6.4.4 100BASE-TX Transmit Packet Deassertion Timing Note: Deassertion is determined by measuring the time from the first rising edge of TX_CLK occurring after the deassertion of TX_EN to the first bit of the “T” code group as output from the TD± pins. Parameter Description Notes Min Typ Max Units T4.3.1 TX_CLK to TD± Latency 6.0 bit times Parameter Description Notes Min Typ Max Units T4.4.1 TX_CLK to TD± Deassertion 6.0 bit times TX_CLK TX_EN TXD TD± IDLE (J/K) DATA T4.3.1 TX_CLK TXD TX_EN TD± DATA (T/R) IDLE T4.4.1 DATA (T/R) IDLE Obsolete 50 www.national.com DP83846A 6.4.5 100BASE-TX Transmit Timing (tR/F & Jitter) Note1: Normal Mismatch is the difference between the maximum and minimum of all rise and fall times. Note2: Rise and fall times taken at 10% and 90% of the +1 or -1 amplitude. Parameter Description Notes Min Typ Max Units T4.5.1 100 Mb/s TD± tR and tF 3 4 5 ns 100 Mb/s tR and tF Mismatch 500 ps T4.5.2 100 Mb/s TD± Transmit Jitter 1.4 ns TD± T4.5.1 T4.5.1 T4.5.1 T4.5.1 +1 rise +1 fall -1 fall -1 rise TD± eye pattern T4.5.2 T4.5.2 90% 10% 10% 90% Obsolete 51 www.national.com DP83846A 6.4.6 100BASE-TX Receive Packet Latency Timing Note: Carrier Sense On Delay is determined by measuring the time from the first bit of the “J” code group to the assertion of Carrier Sense. Note: RD± voltage amplitude is greater than the Signal Detect Turn-On Threshold Value. 6.4.7 100BASE-TX Receive Packet Deassertion Timing Note: Carrier Sense Off Delay is determined by measuring the time from the first bit of the “T” code group to the deassertion of Carrier Sense. Parameter Description Notes Min Typ Max Units T4.6.1 Carrier Sense ON Delay 17.5 bit times T4.6.2 Receive Data Latency 21 bit times Parameter Description Notes Min Typ Max Units T4.7.1 Carrier Sense OFF Delay 21.5 bit times CRS RXD[3:0] RD± RX_DV RX_ER/RXD[4] IDLE Data T4.6.1 T4.6.2 (J/K) CRS T4.7.1 RXD[3:0] RX_DV RX_ER/RXD[4] RD± DATA IDLE (T/R) Obsolete 52 www.national.com DP83846A 6.5 10 Mb/s Timing 6.5.1 10 Mb/s MII Transmit Timing 6.5.2 10 Mb/s MII Receive Timing Parameter Description Notes Min Typ Max Units T5.1.1 TXD[3:0], TX_EN Data Setup to TX_CLK 25 ns T5.1.2 TXD[3:0], TX_EN Data Hold from TX_CLK 5 ns Parameter Description Notes Min Typ Max Units T5.2.1 RX_CLK Duty Cycle 35 65 % T5.2.2 RX_CLK to RXD[3:0], RX_DV 190 210 ns TX_CLK TXD[3:0] TX_EN Valid Data T5.1.1 T5.1.2 RX_CLK RXD[3:0] Valid Data T5.2.2 T5.2.1 RX_DV Obsolete 53 www.national.com DP83846A 6.5.3 10BASE-T Transmit Timing (Start of Packet) 6.5.4 10BASE-T Transmit Timing (End of Packet) Parameter Description Notes Min Typ Max Units T5.3.1 Transmit Enable Setup Time from the Falling Edge of TX_CLK 25 ns T5.3.2 Transmit Data Setup Time from the Falling Edge of TX_CLK 25 ns T5.3.3 Transmit Data Hold Time from the Falling Edge of TX_CLK 5 ns T5.3.4 Transmit Output Delay from the Falling Edge of TX_CLK 6.8 bit times Parameter Description Notes Min Typ Max Units T5.4.1 Transmit Enable Hold Time from the Falling Edge of TX_CLK 5 ns T5.4.2 End of Packet High Time (with ‘0’ ending bit) 250 ns T5.4.3 End of Packet High Time (with ‘1’ ending bit) 250 ns TX_CLK TX_EN TXD[0] TPTD± T5.3.1 T5.3.2 T5.3.3 T5.3.4 TX_CLK TX_EN TPTD± 0 0 1 1 TPTD± T5.4.2 T5.4.3 T5.4.1 Obsolete 54 www.national.com DP83846A 6.5.5 10BASE-T Receive Timing (Start of Packet) Note: 10BASE-T receive Data Latency is measured from first bit of preamble on the wire to the assertion of RX_DV. 6.5.6 10BASE-T Receive Timing (End of Packet) Parameter Description Notes Min Typ Max Units T5.5.1 Carrier Sense Turn On Delay (TPRD± to CRS) 1 μs T5.5.2 Decoder Acquisition Time 3.6 μs T5.5.3 Receive Data Latency 17.3 bit times T5.5.4 SFD Propagation Delay 10 bit times Parameter Description Notes Min Typ Max Units T5.6.1 Carrier Sense Turn Off Delay 1.1 μs 1 0 1 TPRD± CRS RX_CLK RXD[0] 1st SFD bit decoded RX_DV T5.5.1 T5.5.2 T5.5.3 T5.5.4 1 0 1 TPRD± RX_CLK CRS IDLE T5.6.1 Obsolete 55 www.national.com DP83846A 6.5.7 10 Mb/s Heartbeat Timing 6.5.8 10 Mb/s Jabber Timing 6.5.9 10BASE-T Normal Link Pulse Timing Parameter Description Notes Min Typ Max Units T5.7.1 CD Heartbeat Delay 600 1600 ns T5.7.2 CD Heartbeat Duration 500 1500 ns Parameter Description Notes Min Typ Max Units T5.8.1 Jabber Activation Time 20 150 ms T5.8.2 Jabber Deactivation Time 250 750 ms Parameter Description Notes Min Typ Max Units T5.9.1 Pulse Width 100 ns T5.9.2 Pulse Period 8 16 24 ms TXC TXE COL T5.7.1 T5.7.2 TXE TPTD± COL T5.8.2 T5.8.1 T5.9.2 T5.9.1 Normal Link Pulse(s)Obsolete 56 www.national.com DP83846A 6.5.10 Auto-Negotiation Fast Link Pulse (FLP) Timing 6.5.11 100BASE-TX Signal Detect Timing Note: The signal amplitude at RD± is TP-PMD compliant. Parameter Description Notes Min Typ Max Units T5.10.1 Clock, Data Pulse Width 100 ns T5.10.2 Clock Pulse to Clock Pulse Period 111 125 139 μs T5.10.3 Clock Pulse to Data Pulse Period Data = 1 55.5 69.5 μs T5.10.4 Number of Pulses in a Burst 17 33 # T5.10.5 Burst Width 2 ms T5.10.6 FLP Burst to FLP Burst Period 8 24 ms Parameter Description Notes Min Typ Max Units T5.11.1 SD Internal Turn-on Time 1 ms T5.11.2 SD Internal Turn-off Time 300 μs clock pulse data pulse clock pulse FLP Burst FLP Burst Fast Link Pulse(s) T5.10.1 T5.10.1 T5.10.2 T5.10.3 T5.10.4 T5.10.5 T5.10.6 T5.11.1 SD+ internal T5.11.2 RD± Obsolete 57 www.national.com DP83846A 6.6 Loopback Timing 6.6.1 100 Mb/s Internal Loopback Mode Note1: Due to the nature of the descrambler function, all 100BASE-TX Loopback modes will cause an initial “dead-time” of up to 550 μs during which time no data will be present at the receive MII outputs. The 100BASE-TX timing specified is based on device delays after the initial 550μs “dead-time”. Note2: Measurement is made from the first rising edge of TX_CLK after assertion of TX_EN. Parameter Description Notes Min Typ Max Units T6.1.1 TX_EN to RX_DV Loopback 240 ns TX_CLK TX_EN TXD[3:0] CRS RX_CLK RXD[3:0] RX_DV T6.1.1 Obsolete 58 www.national.com DP83846A 6.6.2 10 Mb/s Internal Loopback Mode Note: Measurement is made from the first falling edge of TX_CLK after assertion of TX_EN. Parameter Description Notes Min Typ Max Units T6.2.1 TX_EN to RX_DV Loopback 2 μs TX_CLK TX_EN TXD[3:0] CRS RX_CLK RXD[3:0] RX_DV T6.2.1 Obsolete 59 www.national.com DP83846A 6.7 Isolation Timing Parameter Description Notes Min Typ Max Units T7.0.1 From software clear of bit 10 in the BMCR register to the transition from Isolate to Normal Mode 100 μs T7.0.2 From Deassertion of S/W or H/W Reset to transition from Isolate to Normal mode 500 μs Clear bit 10 of BMCR (return to normal operation from Isolate mode) H/W or S/W Reset (with PHYAD = 00000) MODE ISOLATE NORMAL T7.0.2 T7.0.1 Obsolete DP83846A DsPHYTER — Single 10/100 Ethernet Transceiver National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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Mar 9, 2013 1 Product data sheet Characteristics XPSAF5130 module XPSAF - Emergency stop - 24 V AC DC Main Range of product Preventa Safety automation Product or component type Preventa safety module Safety module name XPSAF Safety module application For emergency stop and switch monitoring Function of module Monitoring of a movable guard Emergency stop monitoring 1-channel wiring Emergency stop monitoring 2-channel wiring Safety level Can reach SILCL 3 conforming to EN/IEC 62061 Can reach PL e/category 4 conforming to EN/ISO 13849-1 Safety reliability data PFHd = 4.62E-9 1/h conforming to EN/IEC 62061 MTTFd = 243 years conforming to EN/ISO 13849-1 DC > 99 % conforming to EN/ISO 13849-1 Type of start Configurable Connections - terminals Captive screw clamp terminals (2 x 0.5...2 x 1.5 mm²)flexible cable with cable end, with double bezel Captive screw clamp terminals (2 x 0.25...2 x 1 mm²)flexible cable with cable end, with double bezel Captive screw clamp terminals (2 x 0.14...2 x 0.75 mm²)solid cable with cable end, with double bezel Captive screw clamp terminals (2 x 0.14...2 x 0.75 mm²)flexible cable with cable end, with double bezel Captive screw clamp terminals (1 x 0.25...1 x 2.5 mm²)flexible cable with cable end, with double bezel Captive screw clamp terminals (1 x 0.25...1 x 1.5 mm²)flexible cable with cable end, with double bezel Captive screw clamp terminals (1 x 0.14...1 x 2.5 mm²)solid cable with cable end, with double bezel Captive screw clamp terminals (1 x 0.14...1 x 2.5 mm²)flexible cable with cable end, with double bezel Output type Relay instantaneous opening 3 NO, volt-free Number of additional circuits 0 [Us] rated supply voltage 24 V DC (- 15...10 %) 24 V AC (- 15...10 %) Complementary Synchronisation time between inputs Unlimited Supply frequency 50/60 Hz Power consumption in VA <= 5 VA AC Input protection type Internal, electronic Control circuit voltage 24 V Line resistance 90 Ohm Breaking capacity C300: 1800 VA, AC-15 (inrush) for relay output C300: 180 VA, AC-15 (holding) for relay output Breaking capacity 1.5 A at 24 V (DC-13) time constant: 50 ms for relay output Output thermal current 6 A per relay for relay output [Ith] conventional free air thermal current 18 A Associated fuse rating 6 A fuse type fast blow for relay output conforming to EN/IEC 60947-5-1, DIN VDE 0660 part 200 4 A fuse type gG or gL for relay output conforming to EN/IEC 60947-5-1, DIN VDE 0660 part 200 Minimum output current 10 mA for relay output Minimum output voltage 17 V for relay output 2 Response time on input open <= 40 ms [Ui] rated insulation voltage 300 V (degree of pollution: 2) conforming to IEC 60647-5-1, DIN VDE 0110 part 1 [Uimp] rated impulse withstand voltage 4 kV overvoltage category III conforming to IEC 60647-5-1, DIN VDE 0110 part 1 Local signalling 3 LEDs Current consumption 30 mA at 24 V AC (on power supply) Mounting support 35 mm symmetrical DIN rail Product weight 0.25 kg Environment Standards EN 1088/ISO 14119 EN 60204-1 EN/IEC 60947-5-1 EN/ISO 13850 Product certifications CSA TÜV UL IP degree of protection IP40 (enclosure) conforming to EN/IEC 60529 IP20 (terminals) conforming to EN/IEC 60529 Ambient air temperature for operation -25...60 °C Ambient air temperature for storage -40...85 °C 3 Product data sheet Dimensions Drawings XPSAF5130 Dimensions 4 Product data sheet Connections and Schema XPSAF5130 Wiring Diagrams Refer to the Instruction Sheet To download the instruction sheet, follow below procedure: 1 Click on Download & Documents. 2 Click on Instruction sheet. General Description The MAX1365/MAX1367 low-power, 4.5- and 3.5-digit, panel meters feature an integrated sigma-delta analogto- digital converter (ADC), LED display drivers, voltage digital-to-analog converter (DAC), and a 4–20mA (or 0 to 16mA) current driver. The MAX1365/MAX1367’s analog input voltage range is programmable to either ±2V or ±200mV. The MAX1367 drives a 3.5-digit (±1999 count) display and the MAX1365 drives a 4.5-digit (±19,999 count) display. The ADC output directly drives the LED display as well as the voltage DAC, which in turn drives the 4–20mA (or 0 to 16mA) current-loop output. In normal operation, the 0 to 16mA/4–20mA currentloop output follows the ±2V or ±200mV analog input to drive remote panel-meter displays, data loggers, and other industrial controllers. For added flexibility, the MAX1365/MAX1367 allow direct access to the DAC output and the V/I converter input. The sigma-delta ADC does not require external precision integrating capacitors, autozero capacitors, crystal oscillators, charge pumps, or other circuitry commonly required in dual-slope ADC panel-meter circuits. Onchip analog input and reference buffers allow direct interface with high-impedance signal sources. Excellent common-mode rejection and digital filtering provide greater than 100dB rejection of simultaneous 50Hz and 60Hz line noise. Other features include data hold, peak detection, and overrange/underrange detection. The MAX1365/MAX1367 require a 2.7V to 5.25V supply, a 4.75V to 5.25V V/I supply, and a 7V to 30V loop supply. They are available in a space-saving (7mm x 7mm), 48-pin TQFP package and operate over the extended (-40°C to +85°C) temperature range. Applications Automated Test Equipment Data-Acquisition Systems Digital Multimeters Digital Panel Meters Digital Voltmeters Industrial Process Control Features ♦ Stand-Alone, Digital Panel Meter 20-Bit Sigma-Delta ADC 4.5-Digit Resolution (±19,999 Count, MAX1365) 3.5-Digit Resolution (±1999 Count, MAX1367) No Integrating/Autozeroing Capacitors 100MΩ Input Impedance ±200mV or ±2.000V Input Range ♦ LED Display Common-Cathode 7-Segment LED Driver Programmable LED Current (0 to 20mA) 2.5Hz Update Rate ♦ Output DAC and Current Driver ±15-Bit DAC with 14-Bit Linear V/I Converter Selectable 0 to 16mA or 4–20mA Current Output Unipolar/Bipolar Modes ±50μA Zero Scale, ±40ppmFS/°C (typ) ±0.5% Gain Error, ±25ppmFS/°C (typ) Separate 7V to 30V Supply for Current-Loop Output ♦ 2.7V to 5.25V ADC/DAC Supply ♦ 4.75V to 5.25V V/I Converter Supply ♦ Internal 2.048V Reference or External Reference ♦ 48-Pin, 7mm x 7mm TQFP Package MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ________________________________________________________________ Maxim Integrated Products 1 Selector Guide 19-3889; Rev 1; 1/06 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. PART TEMP RANGE PIN-PACKAGE MAX1365ECM -40°C to +85°C 48 TQFP MAX1367ECM -40°C to +85°C 48 TQFP Ordering Information PART RESOLUTION (DIGITS) PKG CODE MAX1365ECM 4.5 C48-6 MAX1367ECM 3.5 C48-6 Pin Configuration appears at end of datasheet. Typical Operating Circuits appear at end of datasheet. MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (AVDD = DVDD = DAC_VDD = +2.7V to +5.25V, GND = 0, VLEDV = +2.7V to +5.25V, LEDG = 0, VREF+ - VREF- = 2.048V (external reference), 4-20OUT = 7V, VREG_AMP = +5.0V, CREF+ = 0.1μF, REF- = GND, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. All specifications are at TA = TMIN to TMAX. Typical values are at TA = +25°C, unless otherwise noted.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. AVDD, DVDD ....................................................................-0.3V to +6.0V AIN+, AIN-, REF+, REF-.........................VNEGV to (AVDD + 0.3V) REG_FORCE, CMP, DAC_VDD, DACVOUT, CONV_IN, 4-20OUT.............................-0.3V to (AVDD + 0.3V) EN_BPM, EN_I, REFSELE, DACDATA_SEL, INTREF, RANGE, DPSET1, DPSET2, HOLD, PEAK, DPON, CS_DAC...............................................-0.3V to (DVDD + 0.3V) NEGV .......................................................-2.6V to (AVDD + 0.3V) LED_EN....................................................-0.3V to (DVDD + 0.3V) SET...........................................................-0.3V to (AVDD + 0.3V) REG_AMP, REG_VDD ...........................................-0.3V to +6.0V LEDV......................................................................-0.3V to +6.0V LEDG.....................................................................-0.3V to +0.3V GND_DAC .............................................................-0.3V to +0.3V GND_V/I.................................................................-0.3V to +0.3V SEG_ to LEDG.........................................-0.3V to (VLEDV + 0.3V) DIG_ to LEDG..........................................-0.3V to (VLEDV + 0.3V) REF_DAC .................................................-0.3V to (AVDD + 0.3V) DIG_ Sink Current .............................................................300mA DIG_ Source Current...........................................................50mA SEG_ Sink Current . ............................................................50mA SEG_ Source Current..........................................................50mA Maximum Current Input into Any Other Pin . ......................50mA Continuous Power Dissipation (TA = +70°C) 48-Pin TQFP (derate 22.7mW/°C above +70°C).....1818.2mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-60°C to +150°C Junction Temperature......................................................+150°C Lead Temperature (soldering, 10s) .................................+300°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ADC ACCURACY MAX1365 -19,999 +19,999 Noise-Free Resolution MAX1367 -1999 +1999 Counts 2.000V range ±1 Integral Nonlinearity (Note 1) INL 200mV range ±1 Counts Range Change Ratio (VAIN+ - VAIN- = 0.100V) on 200mV range; (VAIN+ - VAIN- = 0.100V) on 2.0V range 10:1 Ratio Rollover Error VAIN+ - VAIN- = full scale ±1 Counts Output Noise 10 μVP-P Offset Error (Zero Input Reading) VAIN+ - VAIN- = 0 (Note 2) -0 +0 Counts Gain Error (Note 3) -0.5 +0.5 %FSR Offset Drift (Zero Reading Drift) VAIN+ - VAIN- = 0 (Note 4) 0.1 μV/°C Gain Drift ±1 ppm/°C INPUT CONVERSION RATE Update Rate 5 Hz ANALOG INPUTS (AIN+, AIN-) (bypass to GND with 0.1μF or greater capacitors) RANGE = GND -2.0 +2.0 AIN Input Voltage Range (Note 5) RANGE = DVDD -0.2 +0.2 V AIN Absolute Input Voltage Range to GND -2.2 +2.2 V Normal-Mode 50Hz and 60Hz Rejection (Simultaneously) 50Hz and 60Hz ±2% 100 dB MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output _______________________________________________________________________________________ 3 PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Common-Mode 50Hz and 60Hz Rejection (Simultaneously) CMR For 50Hz and 60Hz ±2%, RSOURCE < 10kΩ 150 dB Common-Mode Rejection CMR At DC 100 dB Input Leakage Current 10 nA Input Capacitance 10 pF Average Dynamic Input Current -20 +20 nA INTERNAL REFERENCE (REF- = GND, INTREF = DVDD) REF Input Voltage VREF 2.007 2.048 2.089 V REF Output Short-Circuit Current 1 mA REF Output Temperature Coefficient TCVREF 40 ppm/°C Load Regulation ISOURCE = 0 to 300μA, ISINK = 0 to 30μA 6 μV/μA Line Regulation 50 μV/V 0.1Hz to 10Hz 25 Noise Voltage 10Hz to 10kHz 400 μVP-P EXTERNAL REFERENCE (INTREF = GND) REF Input Voltage Differential (VREF+ - VREF-) 2.048 V Absolute REF+, REF- Input Voltage to GND (VREF+ Must Be Greater Than VREF-) -2.2 +2.2 V Normal-Mode 50Hz and 60Hz Rejection (Simultaneously) 50Hz and 60Hz ±2% 100 dB Common-Mode 50Hz and 60Hz Rejection (Simultaneously) CMR For 50Hz and 60Hz ±2%, RSOURCE < 10kΩ 150 dB Common-Mode Rejection CMR At DC 100 dB Input Leakage Current 10 nA Input Capacitance 10 pF Average Dynamic Input Current (Note 6) -20 +20 nA CHARGE PUMP Output Voltage NEGV CNEGV = 0.1μF to GND -2.60 -2.42 -2.30 V DIGITAL INPUTS (INTREF, RANGE, PEAK, HOLD, DPSET1, DPSET2) Input Current IIN VIN = 0 or DVDD -10 +10 μA Input Low Voltage VINL 0.3 x DVDD V Input High Voltage VINH 0.7 x DVDD V Input Hysteresis VHYS DVDD = 3V 200 mV ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = DAC_VDD = +2.7V to +5.25V, GND = 0, VLEDV = +2.7V to +5.25V, LEDG = 0, VREF+ - VREF- = 2.048V (external reference), 4-20OUT = 7V, VREG_AMP = +5.0V, CREF+ = 0.1μF, REF- = GND, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. All specifications are at TA = TMIN to TMAX. Typical values are at TA = +25°C, unless otherwise noted.) MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 4 _______________________________________________________________________________________ ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = DAC_VDD = +2.7V to +5.25V, GND = 0, VLEDV = +2.7V to +5.25V, LEDG = 0, VREF+ - VREF- = 2.048V (external reference), 4-20OUT = 7V, VREG_AMP = +5.0V, CREF+ = 0.1μF, REF- = GND, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. All specifications are at TA = TMIN to TMAX. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ADC POWER SUPPLY (Note 7) AVDD Voltage AVDD 2.70 5.25 V DVDD Voltage DVDD 2.70 5.25 V Power-Supply Rejection AVDD PSRA (Note 8) 80 dB Power-Supply Rejection DVDD PSRD (Note 8) 100 dB 640 AVDD Current (Note 9) IAVDD Standby mode 305 μA DVDD = +5.25V 320 DVDD Current (Note 9) IDVDD DVDD = +3.3V 180 Standby mode 20 μA DAC POWER SUPPLY DAC Supply Voltage VDAC_VDD 2.70 5.25 V DAC Supply Current 0.10 0.21 mA LINEAR REGULATOR AND V/I CONVERTER POWER REQUIREMENTS REG_AMP Supply Voltage VREG_AMP 4.75 5.25 V REG_AMP Supply Current 0.19 0.30 mA REG_VDD Supply Voltage VREG_VDD 5.20 V REG_VDD Supply Current Includes 20mA programmed current 25.2 27.4 mA LED DRIVERS LED Supply Voltage VLEDV 2.70 5.25 V LED Shutdown Supply Current ISHDN 10 μA LED Supply Current ILEDV 176 180 mA MAX1365 512 Display Scan Rate fOSC MAX1367 640 Hz Segment Current Slew Rate ISEG/Δt 25 mA/μs DIG_ Voltage Low VDIG 0.178 0.300 V Segment-Drive Source-Current Matching ΔISEG 3 ±12 % Segment-Drive Source Current ISEG VLEDV - VSEG = 0.6V, RSET = 25kΩ 15.0 21.5 25.5 mA LED Drivers Bias Current From AVDD 120 μA Interdigit Blanking Time 4 μs MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output _______________________________________________________________________________________ 5 ELECTRICAL CHARACTERISTICS (continued) (AVDD = DVDD = DAC_VDD = +2.7V to +5.25V, GND = 0, VLEDV = +2.7V to +5.25V, LEDG = 0, VREF+ - VREF- = 2.048V (external reference), 4-20OUT = 7V, VREG_AMP = +5.0V, CREF+ = 0.1μF, REF- = GND, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. All specifications are at TA = TMIN to TMAX. Typical values are at TA = +25°C, unless otherwise noted.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DAC OUTPUT ACCURACY Zero-Scale Error 4–20mA or 0 to 16mA mode, TA = +25°C ±50 μA Zero-Scale Error Tempco ±40 p p mFS /° C Gain Error 4–20mA or 0 to 16mA mode, TA = +25°C ±0.5 %FS Gain-Error Tempco ±25 p p mFS /° C Span Linearity ±2 ±4 μA Power-Supply Rejection PSR VEXT = 7V to 30V 4 μA/V Signal Path Noise 10pF to GND on 4-20OUT 2.0 μARMS 4–20mA Current Limit Limited to 12.5 x VREF / 1.28kΩ 20 mA Note 1: Integral nonlinearity is the deviation of the analog value at any code from its theoretical value after nulling the gain error and offset error. Note 2: Offset calibrated. Note 3: Offset nulled. Note 4: Drift error is eliminated by recalibration at the new temperature. Note 5: The input voltage range for the analog inputs is given with respect to the voltage on the negative input of the differential pair. Note 6: VAIN+ or VAIN- = -2.2V to +2.2V. VREF+ or VREF- = -2.2V to +2.2V. All input structures are identical. Production tested on AIN+ and REF+ only. VREF+ must always be greater than VREF-. Note 7: Power-supply currents are measured with all digital inputs at either GND or DVDD. Note 8: Measured at DC by changing the power-supply voltage from 2.7V to 5.25V and measuring the effect on the conversion error with external reference. PSRR at 50Hz and 60Hz exceeds 120dB with filter notches at 50Hz and 60Hz (Figure 1). Note 9: LED drivers are disabled. MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 6 _______________________________________________________________________________________ 0 300 200 100 400 500 600 700 800 900 1000 2.7 3.2 3.7 4.2 4.7 5.2 SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX1365/67 toc01 SUPPLY VOLTAGE (V) SUPPLY CURRENT (μA) DAC_VDD AVDD DVDD 0 200 100 400 300 600 500 700 -40 -15 10 35 60 85 SUPPLY CURRENT vs. TEMPERATURE MAX1365/67 toc02 TEMPERATURE (°C) SUPPLY CURRENT (μA) AVDD DVDD DAC_VDD MAX1365 OFFSET ERROR vs. SUPPLY VOLTAGE MAX1365/67 toc03 SUPPLY VOLTAGE (V) OFFSET ERROR (LSB) 3.25 3.75 4.25 4.75 -0.11 -0.06 -0.01 0.04 0.09 0.14 0.19 -0.16 2.75 5.25 MAX1365 OFFSET ERROR vs. TEMPERATURE MAX1365/67 toc04 TEMPERATURE (°C) OFFSET ERROR (LSB) 10 20 30 40 50 60 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 -0.2 0 70 MAX1365 GAIN ERROR vs. SUPPLY VOLTAGE MAX1365/67 toc05 SUPPLY VOLTAGE (V) GAIN ERROR (% FULL SCALE) 3.25 3.75 4.25 4.75 -0.08 -0.04 -0.06 -0.02 0 0.02 0.04 0.06 0.08 -0.10 2.75 5.25 MAX1365 GAIN ERROR vs. TEMPERATURE MAX1365/67 toc06 TEMPERATURE (°C) GAIN ERROR (% FULL SCALE) 10 20 30 40 50 60 -0.09 -0.08 -0.07 -0.06 -0.05 -0.04 -0.03 -0.02 -0.01 0 -0.10 0 70 MAX1365 INL (±200mV INPUT RANGE) vs. OUTPUT CODE MAX1365/67 toc07 OUTPUT CODE INL (COUNTS) -10,000 0 10,000 -0.5 0 0.5 1.0 -1.0 -20,000 20,000 MAX1365 INL (±2V INPUT RANGE) vs. OUTPUT CODE MAX1365/67 toc08 OUTPUT CODE INL (COUNTS) -10,000 0 10,000 -0.5 0 0.5 1.0 -1.0 -20,000 20,000 NOISE DISTRIBUTION MAX1365/67 toc09 NOISE (LSB) PERCENTAGE OF UNITS (%) -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 5 10 15 20 25 0 -0.2 Typical Operating Characteristics (AVDD = DVDD = +5V, VDAC_VDD = +5.0V, GND = 0, LEDG = 0, VLEDV = +2.7V to +5.25V, VREF+ - VREF- = 2.048V (external reference), VEXT = 7V, CREF+ = CREF- = 0.1μF, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. TA = +25°C, unless otherwise noted.) MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output _______________________________________________________________________________________ 7 INTERNAL REFERENCE VOLTAGE vs. TEMPERATURE MAX1365/67 toc10 TEMPERATURE (°C) REFERENCE VOLTAGE (V) 10 20 30 40 50 60 2.046 2.045 2.047 2.049 2.048 2.051 2.050 2.053 2.052 2.054 2.044 0 70 INTERNAL REFERENCE VOLTAGE vs. ANALOG SUPPLY VOLTAGE MAX1365/67 toc11 SUPPLY VOLTAGE (V) REFERENCE VOLTAGE (V) 3.25 3.75 4.25 4.75 2.045 2.046 2.047 2.048 2.049 2.050 2.044 2.75 5.25 DATA OUTPUT RATE vs. TEMPERATURE MAX1365/67 toc12 TEMPERATURE (°C) DATA OUTPUT RATE (Hz) -15 10 35 60 4.92 4.98 4.96 4.94 5.00 5.02 5.04 5.06 5.08 5.10 4.90 -40 85 DATA OUTPUT RATE vs. SUPPLY VOLTAGE MAX1365/67 toc13 SUPPLY VOLTAGE (V) DATA OUTPUT RATE (Hz) 3.21 3.72 4.23 4.74 4.995 4.990 4.985 5.000 5.005 5.010 5.015 5.020 4.980 2.70 5.25 OFFSET ERROR vs. COMMON-MODE VOLTAGE MAX1365/67 toc14 COMMON-MODE VOLTAGE (V) OFFSET ERROR (LSB) -1.5 -1.0 -0.5 0 0.5 1.0 1.5 -0.15 -0.10 -0.05 0 0.05 0.10 0.15 0.20 -0.20 -2.0 2.0 VNEG STARTUP SCOPE SHOT MAX1365/67 toc15 20ms/div 2V/div 1V/div VDD VNEG CHARGE-PUMP OUTPUT VOLTAGE vs. ANALOG SUPPLY VOLTAGE MAX1365/67 toc16 SUPPLY VOLTAGE (V) VNEG VOLTAGE (V) 3.25 3.75 4.25 4.75 -2.48 -2.46 -2.44 -2.42 -2.40 -2.50 2.75 5.25 SEGMENT CURRENT vs. SUPPLY VOLTAGE MAX1365/67 toc17 SUPPLY VOLTAGE (V) SEGMENT CURRENT (μA) 3.21 3.72 4.23 4.74 5 10 15 20 25 30 0 2.70 5.25 RISET = 25kΩ -0.2 0 -0.1 0.2 0.1 0.3 0.4 -40 -15 10 35 60 85 DAC ZERO-CODE OFFSET ERROR vs. TEMPERATURE MAX1365/67 toc18 TEMPERATURE (°C) OFFSET ERROR (LSB) Typical Operating Characteristics (continued) (AVDD = DVDD = +5V, VDAC_VDD = +5.0V, GND = 0, LEDG = 0, VLEDV = +2.7V to +5.25V, VREF+ - VREF- = 2.048V (external reference), VEXT = 7V, CREF+ = CREF- = 0.1μF, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. TA = +25°C, unless otherwise noted.) Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 8 _______________________________________________________________________________________ Typical Operating Characteristics (continued) (AVDD = DVDD = +5V, VDAC_VDD = +5.0V, GND = 0, LEDG = 0, VLEDV = +2.7V to +5.25V, VREF+ - VREF- = 2.048V (external reference), VEXT = 7V, CREF+ = CREF- = 0.1μF, CNEGV = 0.1μF. Internal clock mode, unless otherwise noted. TA = +25°C, unless otherwise noted.) -0.30 -0.20 -0.25 -0.10 -0.15 -0.05 0 -40 -15 10 35 60 85 DAC GAIN ERROR vs. TEMPERATURE MAX1365/67 toc19 TEMPERATURE (°C) GAIN ERROR (LSB) 4–20OUT = 21.7mA CONV_IN = 1V 10mA/div 500mV/div STEP RESPONSE MAX1365/67 toc20 100μs/div -50 -20 -30 -40 0 -10 40 30 20 10 50 -40 -20 0 20 40 60 80 4–20OUT ZERO-SCALE ERROR vs. TEMPERATURE MAX1365/67 toc21 TEMPERATURE (°C) CURRENT OUTPUT (μA) EXTERNAL REFERENCE = 2.048V -50 -20 -30 -40 0 -10 40 30 20 10 50 -40 -20 0 20 40 60 80 4–20OUT GAIN ERROR vs. TEMPERATURE MAX1365/67 toc22 TEMPERATURE (°C) GAIN ERROR (%) EXTERNAL REFERENCE = 2.048V 4–20mA MODE 0 TO 16mA MODE -0.5 0 0.5 1.0 1.5 2.0 2.5 -20,000 -10,000 0 10,000 20,000 4–20OUT vs. DAC CODE (4–20OUT SPAN LINEARITY) MAX1365/67 toc24 DAC CODE (COUNTS) SPAN LINEARITY (μA) OFFSET ENABLED (EN_I = HIGH) -150 -100 -50 0 50 100 150 4 6 8 10 12 14 16 18 20 POWER-SUPPLY REJECTION vs. CURRENT OUTPUT (4-20OUT) MAX1365/67 toc23 4-20OUT OUTPUT CURRENT (mA) POWER-SUPPLY REJECTION (nA/V) MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output _______________________________________________________________________________________ 9 PIN NAME FUNCTION 1 AIN+ Positive Analog Input. Positive side of fully differential analog input. Bypass AIN+ to GND with a 0.1μF or greater capacitor. 2 AINNegative Analog Input. Negative side of fully differential analog input. Bypass AIN- to GND with a 0.1μF or greater capacitor. 3 GND Ground. Connect to star ground. 4 AVDD Analog Positive Supply Voltage. Connect AVDD to a +2.7V to +5.25V power supply. Bypass AVDD to GND with a 0.1μF capacitor. 5 DVDD Digital Positive Supply Voltage. Connect DVDD to a +2.7V to +5.25V power supply. Bypass DVDD to GND with a 0.1μF capacitor. 6 SET Segment Current Set. Connect to ground through a resistor to set the segment current. See Table 7 for segment-current selection. 7 REG_VDD V/I Converter Regulated Supply Output (5.2V typ) 8 REG_FORCE REG_VDD Control. Drives the gate of external depletion-mode FET. 9 REG_AMP Regulator/Reference Buffer Supply. Connect to a 4.75V to 5.25V power supply. 10 CMP Regulator Compensation Node. Connect a 0.1μF capacitor from CMP to REG_FORCE. 11 DAC_VDD DAC Analog Supply. Connect DAC_VDD to a +2.7V to +5.25V power supply. 12 DACVOUT DAC Voltage Output. DAC output impedance is typically 6.2kΩ. 13 CONV_IN V/I Converter Input 14 4-20OUT 4–20mA (0 to 16mA) Current-Loop Output. Referenced to GND. 15 GND_DAC DAC Analog Ground. Connect to star ground. 16 GND_V/I V/I Converter Analog Ground. Connect to star ground. 17 REF_DAC V-to-I Converter/DAC Reference Input. Connect a voltage source for external reference operation or leave floating for internal reference. Bypass REF_DAC with a 0.1μF capacitor to GND for either internal or external reference operation. 18 EN_BPM Acti ve- H i g h V /I- C onver ter Bi p ol ar - M od e E nab l e. S et hi g h for b i p ol ar m od e. S et l ow for uni p ol ar m od e. 19 EN_I Acti ve- H i g h V /I- C onver ter 4m A O ffset E nab l e. S et l ow for 0 to 16m A outp ut. S et hi g h for 4–20m A. 20 REFSELE DAC External Reference Selection. Set low for internal reference. Set high for external reference. Leave REF_DAC unconnected when REFSELE is low. 21 DACDATA_SEL DAC Data-Source Select. Connect to logic high for the MAX1365/MAX1367. 22 CS_DAC DAC Chip Select. Connect to logic high for the MAX1365/MAX1367. 23 INTREF ADC Reference Selection. Set INTREF high to select the internal ADC reference. Set INTREF low to select external ADC reference. 24 RANGE ADC Range Select. Set RANGE low for ±2V analog input voltage range. Set RANGE high for ±200mV analog input voltage range. 25 PEAK Peak Logic Input. Connect PEAK to DVDD to display the highest ADC value on the LED. Connect PEAK to GND to disable the PEAK function (see Table 1). Pin Description MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 10 ______________________________________________________________________________________ PIN NAME FUNCTION 26 HOLD Hold Logic Input. Connect HOLD to DVDD to hold the current ADC value on the LED. Connect HOLD to GND to update the LED at a rate of 2.5Hz and disable the hold function. Placing the device into hold mode initiates an offset mismatch calibration. Assert HOLD high for a minimum of 2s to ensure the completion of offset mismatch calibration (see Table 1). 27 DPSET2 Display Decimal-Point Logic-Input 2. Controls the decimal point of the LED. See the Decimal-Point Control section. 28 DPSET1 Display Decimal-Point Logic-Input 1. Controls the decimal point of the LED. See the Decimal-Point Control section. 29 LEDG LED Segment-Drivers Ground 30 DIG0 Digit 0 Driver Out (Connected to GLED for the MAX1367) 31 DIG1 Digit 1 Driver Out 32 DIG2 Digit 2 Driver Out 33 DIG3 Digit 3 Driver Out 34 DIG4 Digit 4 Driver Out 35 SEGA Segment A Driver 36 SEGB Segment B Driver 37 LEDV LED-Display Segment-Driver Supply. Connect to a +2.7V to +5.25V supply. Bypass with a 0.1μF capacitor to LEDG. 38 SEGC Segment C Driver 39 SEGD Segment D Driver 40 SEGE Segment E Driver 41 SEGF Segment F Driver 42 SEGG Segment G Driver 43 SEGDP Segment DP Driver 44 LED_EN Active-High LED Enable. The MAX1365/MAX1367 display driver turns off when LED_EN is low. The MAX1365/MAX1367 LED-display driver turns on when LED_EN is high. 45 NEGV -2.5V Charge-Pump Voltage Output. Connect a 0.1μF capacitor to GND. 46 DPON Decimal-Point Enable Input. Controls the decimal point of the LED. See the Decimal-Point Control section. Connect DPON to DVDD to enable the decimal point. 47 REFADC Negative Reference Voltage Input. For internal reference operation, connect REF- to GND. For external reference operation, bypass REF- to GND with a 0.1μF capacitor and set VREF- from -2.2V to +2.2V (VREF+ > VREF-). 48 REF+ ADC Positive Reference Voltage Input. For internal reference operation, connect a 4.7μF capacitor from REF+ to GND. For external reference operation, bypass REF+ to GND with a 0.1μF capacitor and set VREF+ from -2.2V to +2.2V (VREF+ > VREF-). Pin Description (continued) Detailed Description The MAX1365/MAX1367 low-power, highly integrated ADCs with LED drivers convert a ±2V differential input voltage (one count is equal to 100μV for the MAX1365 and 1mV for the MAX1367) with a sigma-delta ADC and output the result to an LED display. An additional ±200mV input range (one count is equal to 10μV for the MAX1365 and 100μV for the MAX1367) is available to measure small signals with finer resolution. In addition to displaying the results on an LED display, these devices feature a DAC and V-to-I converter for 4–20mA (or 0 to 16mA) current output that proportionally follows the ADC input. The MAX1365/MAX1367 use an external depletion-mode NMOS transistor to regulate 7V to 30V for the V/I converter. Use the 4–20mA (or 0 to 16mA) output to drive a remote display, data logger, PLC input, or other 4–20mA devices in a current loop. The MAX1365/MAX1367 include a 2.048V reference, internal charge pump, and a high-accuracy on-chip oscillator. The devices feature on-chip buffers for the differential input signal and external-reference inputs, allowing direct interface with high-impedance signal sources. In addition, they use continuous internal offsetcalibration and offer > 100dB of 50Hz and 60Hz linenoise rejection. Other features include data hold and peak detection and overrange/underrange detection. Analog Input Protection The MAX1365/MAX1367 provide internal protection diodes that limit the analog input range on AIN+, AIN-, REF+, and REF- from NEGV to (AVDD + 0.3V). If the analog input exceeds this range, limit the input current to 10mA. Internal Analog Input/Reference Buffers The MAX1365/MAX1367 analog input/reference buffers allow the use of high-impedance signal sources. The input buffers’ common-mode input range allows the analog inputs and the reference to range from -2.2V to +2.2V. Modulator The MAX1365/MAX1367 perform analog-to-digital conversions using a single-bit, 3rd-order, sigma-delta modulator. The sigma-delta modulator converts the input MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 11 LED DRIVER LEDG SEGA SEGG DIG0(1) DIG4(4) LED_EN MAX1365 MAX1367 ADC INPUT BUFFER -2.5V AIN+ AINREF+ REFNEGV +2.5V 2.048V BANDGAP REFERENCE LOGIC GND CHARGE PUMP -2.5V OUTPUT DAC DAC REF BUFFER AVDD DVDD INTREF RANGE 5V REGULATOR V/I CONVERTER CURRENT SUMMER AND AMPLIFIER OFFSET GENERATOR EN_BPM EN_I DACVOUT 4-20OUT REG_FORCE CS_DAC DACDATA_SEL SET REFSELE REF_DAC REG_AMP CONV_IN CMP REG_VDD DAC_VDD PEAK DPON DPSET1 DPSET 2 HOLD LEDV Functional Diagram MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 12 ______________________________________________________________________________________ signal into a digital pulse train whose average duty cycle represents the digitized signal information. The modulator quantizes the input signal at a much higher sample rate than the bandwidth of the input. The MAX1365/MAX1367 modulator provides 3rd-order frequency shaping of the quantization noise resulting from the single-bit quantizer. The modulator is fully differential for maximum signal-to-noise ratio and minimum susceptibility to power-supply noise. A single-bit data stream is then presented to the digital filter to remove the frequency-shaped quantization noise. Digital Filtering The MAX1365/MAX1367 contain an on-chip digital lowpass filter that processes the data stream from the modulator using a SINC4 response: The SINC4 filter has a settling time of four output data periods (4 x 200ms). The MAX1365/MAX1367 have 25% overrange capability built into the modulator and digital filter. The digital filter is optimized for the fCLK equal to 4.9152MHz. The frequency response of the SINC4 filter is calculated as follows: where N is the oversampling ratio, and fm = N x output data rate = 5Hz. Filter Characteristics Figure 1 shows the filter frequency response. The SINC4 characteristic -3dB cutoff frequency is 0.228 times the first notch frequency (5Hz). The oversampling ratio (OSR) for the MAX1367 is 128 and the OSR for the MAX1365 is 1024. The output data rate for the digital filter corresponds to the positioning of the first notch of the filter’s frequency response. The notches of the SINC4 filter are repeated at multiples of the first notch frequency. The SINC4 filter provides an attenuation of better than 100dB at these notches. For example, 50Hz is equal to 10 times the first notch frequency and 60Hz is equal to 12 times the first notch frequency. For large step changes at the input, allow a settling time of 800ms before valid data is read. Internal Clock The MAX1365/MAX1367 contain an internal oscillator. Using the internal oscillator saves board space by removing the need for an external clock source. The oscillator is optimized to give 50Hz and 60Hz powersupply and common-mode rejection. Charge Pump The MAX1365/MAX1367 contain an internal charge pump to provide the negative supply voltage for the internal analog input/reference buffers. The bipolar input range of the analog input/reference buffers allows this device to accept negative inputs with high source impedances. Connect a 0.1μF capacitor from NEGV to GND. LED Driver (Table 1) The MAX1365 has a 4.5-digit common-cathode display driver, and the MAX1367 has a 3.5-digit common-cathode display driver. In addition, the LED drivers of the MAX1365/MAX1367 feature peak-detection and datahold circuitry. Figures 2 and 3 show the connection schemes for a standard seven-segment LED display. The LED update rate is 2.5Hz. Figure 4 shows a typical common-cathode configuration for two digits. In common-cathode configuration, the cathodes of all LEDs in a digit are connected together. Each segment driver of the MAX1365/MAX1367 connects to its corresponding LED’s anodes. For example, segment driver SEGA connects to all LED segments designated as A. Similar configurations are used for other segment drivers. H z Z N H f N N f f f f N Z m m ( ) ( ) ( ) sin sin ( ) = − = − − − 11 1 1 4 4 1 π π sin(x) x 4 FREQUENCY (Hz) GAIN (dB) 10 20 30 40 50 -160 -120 -80 -40 0 -200 0 60 Figure 1. Frequency Response of the SINC4 Filter (Notch at 60Hz) The MAX1365/MAX1367 use a multiplexing scheme to drive one digit at a time. The scan rate is fast enough to make the digits appear to be lit. Figure 5 shows the data-timing diagram for the MAX1365/MAX1367 where T is the display scan period (typically around 1/512Hz or 1.9531ms). TON in Figure 5 denotes the amount of time each digit is on and is calculated as follows: Decimal-Point Control The MAX1365/MAX1367 allow for full decimal-point control and feature leading-zero suppression. Use the DPON, DPSET1, and DPSET2 bits in the control register to set the value of the decimal point (Tables 2 and 3). The MAX1365/MAX1367 overrange and underrange display is shown in Table 4. Leading-Zero Suppression The MAX1365/MAX1367 include a leading-zero suppression circuitry to turn off unnecessary zeros. For example, when DPSET1 and DPSET2 = [0,0], 0.0 is displayed instead of 000.0 (MAX1365). This feature saves a substantial amount of power by not lighting unnecessary LEDs. Interdigit Blanking The MAX1365/MAX1367 also include an interdigitblanking circuitry. Without this feature, it is possible to see a faint digit next to a digit that is completely on. The interdigit-blanking circuitry prevents ghosting over into the next digit for a short period of time. The typical interdigit blanking time is 4μs. T T ms ON = = = s 5 1 95312 5 390 60 . . μ MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 13 A B C A A A A D DIGIT 4 DIGIT 3 DIGIT 2 DIGIT 1 DIGIT 0 D D D D E G F E E E F G B F G B F G B F G B C C C C DP DP DP DP DP Figure 2. Segment Connection for the MAX1365 (4.5 Digits) A B A A A D DIGIT 4 DIGIT 3 DIGIT 2 DIGIT 1 D D D E G F E E F G B F G B F G B C C C DP DP DP DP C Figure 3. Segment Connection for the MAX1367 (3.5 Digits) HOLD PEAK DISPLAY VALUES FORM 1 X Hold value 0 1 Peak value 0 0 Latest ADC result Table 1. LED Priority Table X = Don’t care. DPON DPSET1 DPSET2 DISPLAY OUTPUT ZERO INPUT READING 1 0 0 1888. 0. 1 0 1 188.8 0.0 1 1 0 18.88 0.00 1 1 1 1.888 0.000 Table 3. Decimal-Point Control Table— MAX1367 CONDITION MAX1367 MAX1365 Overrange 1--- 1---- Underrange -1--- -1---- Table 4. LED During Overrange and Underrange Conditions DPON DPSET1 DPSET2 DISPLAY OUTPUT ZERO INPUT READING 0 0 0 18888 0 0 0 1 18888 0 0 1 0 18888 0 0 1 1 18888 0 1 0 0 1888.8 0.0 1 0 1 188.88 0.00 1 1 0 18.888 0.000 1 1 1 1.8888 0.0000 Table 2. Decimal-Point Control Table— MAX1365 Current Output The MAX1365/MAX1367 feature a 4–20mA (0 to 16mA) current output for driving remote panel meters, data loggers, and process controllers in industrial applications. The DAC output is proportional to the input of the ADC and LED display. In the simplest configuration, connect DAC_VOUT directly to CONV_IN to have the current output (4–20mA or 0 to 16mA) follow the analog inputs. Custom signal conditioning can be inserted between DAC_VOUT and CONV_IN, or CONV_IN can be driven independently by a voltage source if desired. See Figures 11–14 for the transfer functions of the DAC and V/I converter. Note: The MAX1365/MAX1367 expect a 6kΩ (typ) source impedance from the external voltage source driving CONV_IN. Current Offset Set EN_I high for a current span of 4–20mA. Set EN_I low for a current span of 0 to 16mA. See Table 5 for current output. Unipolar Mode Set EN_BPM low to engage unipolar operation. In unipolar mode, the current output at 4-20OUT (4–20mA or 0 to 16mA) maps the analog input voltage (0 to 2V or 0 to 200mV). Negative voltages at the analog input result in a 4mA or 0mA output, depending on the EN_I setting. See Table 5 for current output. See Figures 12 and 13. MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 14 ______________________________________________________________________________________ A A A DIGIT 1 DIGIT 2 SEGDP SEGG SEGF SEGE SEGD SEGC SEGB SEGA D D E E F G B F G B C C DP DP B C D E F G DP A B C D E F G DP Figure 4. 2-Digit Common-Cathode Configuration 4 3 2 1 0 4 3 2 1 0 4 T TON DIGIT 4 (MSD) DIGIT 3 INTERDIGIT BLANKING TIME DIGIT 2 DIGIT 1 DIGIT 0 (LSD) DATA MSD LSD Figure 5. LED Voltage Waveform Bipolar Mode Set EN_BPM high to engage bipolar operation. In bipolar mode, the current output at 4–20OUT (4–20mA or 0 to 16mA) maps the analog input voltage (±2V or ±200mV). In bipolar mode, a 0V analog input maps to midscale (12mA). See Table 5 for current output (see Figures 12 and 13). 5.2V Linear Regulator with Compensation The MAX1365/MAX1367 feature a 5.2V linear regulator. The 5.2V regulator consists of an op amp and connections to an external depletion-mode FET. The 5.2V regulator regulates the loop voltage that powers the voltage-to-current converter and the rest of the transmitter circuitry. The regulator output voltage is available at REG_VDD and is given by the equation: VREG_VDD = 2.54 x VREF+ The FET breakdown and saturation voltages determine the usable range of loop voltages (VEXT). The external FET parameters such as VGS (off), IDSS, and transconductance must be chosen so that the op amp output on the REG_FORCE pin can control the FET operating point while swinging in the range from VREG_AMP to REG_VDD. See the Selecting Depletion-Mode FET section in the Applications Information section. Connect a 0.1μF capacitor between CMP and REG_FORCE to ensure stable operation of the regulator. Applications Information Power-On Reset At power-on, the digital filter and modulator circuits reset. The MAX1365 allows 6s for the reference to stabilize before performing enhanced offset calibration. MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 15 CURRENT OUTPUT (mA) ANALOG INPUT UNIPOLAR MODE (EN_I = LOW) UNIPOLAR MODE (EN_I = HIGH) BIPOLAR MODE (EN_I = LOW) BIPOLAR MODE (EN_I = HIGH) Negative Full Scale 0 4 0 4 0V 0 4 8 12 Positive Full Scale 16 20 16 20 Table 5. Current Output Table MAX1365 MAX1367 AVDD DVDD 10μF 10μF 0.1μF 0.1μF 0.1μF 0.1μF ANALOG SUPPLY FERRITE BEAD RREF R R ACTIVE GAUGE DUMMY GAUGE REF+ REFNEGV AIN+ AIN- 4-20OUT 4–20mA/0 TO 16mA CURRENT-LOOP OUTPUT GND 0.1μF 0.1μF Figure 6. Strain-Gauge Application with the MAX1365/MAX1367 MAX1365/MAX1367 During these 6s, the MAX1365 displays 1.2V to 1.5V when a stable reference is detected. If a valid reference is not found, the MAX1365 times out after 6s and begins enhanced offset calibration. Enhanced offset calibration typically lasts 2s. The MAX1365 begins converting after enhanced offset calibration. Reference ADC Reference The MAX1365/MAX1367 reference sets the full-scale range of the ADC transfer function. With a nominal 2.048V reference, the ADC full-scale range is ±2V with RANGE = GND. With RANGE = DVDD, the full-scale range is ±200mV. A decreased reference voltage decreases full-scale range (see the Transfer Functions section). The ADC of the MAX1365/MAX1367 can accept either an external reference or an internal reference (INTREF). The INTREF logic selects the reference mode. For internal- reference operation, set INTREF to DVDD, connect REF- to GND, and bypass REF+ to GND with a 4.7μF capacitor. The internal reference provides a nominal 2.048V source between REF+ and GND. The internalreference temperature coefficient is typically 40ppm/°C. For external-reference operation, set INTREF to GND. REF+ and REF- are fully differential. For a valid external- reference input, VREF+ must be greater than VREF-. Bypass REF+ and REF- with a 0.1μF or greater capacitor to GND in external-reference mode. Figure 6 shows the MAX1365/MAX1367 operating with an external differential reference. In this figure, REF- is connected to the top of the strain gauge and REF+ is connected to the midpoint of the resistor-divider of the supply. DAC Reference The DAC of the MAX1365/MAX1367 accept either an external reference or an internal reference. The REFSELE enables or disables the internal reference. For externalreference operation, disable the DAC reference buffer by setting REFSELE to DVDD and connect a voltage source to REF_DAC. For internal-reference operation, enable the DAC reference buffer by setting REFSELE to GND. In this mode, leave REFDAC floating. In either internal or external reference operation, bypass REF_DAC with a 0.1μF capacitor to GND. Choose a reference with output impedance (load regulation equivalent) of 100mΩ or less, such as the MAX6126. For best performance, use an external reference source for the ADC and DAC. DAC Operation For the MAX1365/MAX1367, a voltage proportional to the ADC input is available at DACVOUT. Connect DACVOUT to CONV_IN for normal operation. See Figure 11 for the DAC transfer function. Offset Calibration The MAX1365/MAX1367 offer on-chip offset calibration. The device offset calibrates during every conversion cycle. Enhanced Offset Calibration Enhanced offset calibration is a more accurate calibration method that is needed in the case of the ±200mV range and 4.5-digit resolution. In addition to enhanced offset calibration at power-up, the MAX1365/MAX1367 perform enhanced calibration on demand by connecting HOLD to AVDD for > 2s. Peak The MAX1365/MAX1367 feature peak-detection circuitry. When activated, the devices display only the highest voltage measured to the LED. First, the current ADC result is displayed. The new ADC conversion result is compared to the current result. If the new value is larger than the previous peak value, the new value is displayed. If the new value is less than the previous peak value, the display remains unchanged. Connect PEAK to GND to clear the peak value and disable the peak function. See Table 1 for LED Display priority. Hold The MAX1365/MAX1367 feature data-hold circuitry. When activated, the device holds the current reading on the LED. Strain-Gauge Measurement Connect the differential inputs of the MAX1365/ MAX1367 to the bridge network of the strain gauge. In Figure 6, the analog supply voltage powers the bridge network and the MAX1365/MAX1367, along with the reference voltage. The MAX1365/MAX1367 handle an analog input voltage range of ±200mV and ±2V full scale. The analog/reference inputs of the parts allow the analog input range to have an absolute value of anywhere between -2.2V and +2.2V. Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 16 ______________________________________________________________________________________ Transfer Functions ADC Transfer Functions Figures 7–10 show the transfer functions of the MAX1365/MAX1367. The output data is stored in the ADC data register in two’s complement. The transfer function for the MAX1365 with AIN+ - AIN- ≥ 0 and RANGE = GND is: The transfer function for the MAX1365 with AIN+ - AIN- < 0 and RANGE = GND is: The transfer function for the MAX1367 with AIN+ - AIN- ≥ 0 and RANGE = GND is: (3) COUNT 1.024 2000 V V V V AIN AIN x REF REF = + − − + − − (2) COUNT 1.024 20,000 1 V V V V AIN AIN x REF REF = + − − + + − − (1) COUNT 1.024 20,000 V V V V AIN AIN x REF REF = + − − + − − MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 17 -2V 0 ANALOG INPUT VOLTAGE +2V LED 1 - - - - 19,999 2 1 0 - 0 - 1 - 2 -19,999 - 1 - - - - -100μV 100μV Figure 7. MAX1365 Transfer Function—±2V Range -200mV 0 ANALOG INPUT VOLTAGE +200mV LED 1 - - - - 19,999 2 1 0 - 0 - 1 - 2 -19,999 - 1 - - - - -10μV 10μV Figure 8. MAX1365 Transfer Function—±200mV Range -2V 0 ANALOG INPUT VOLTAGE +2V LED 1 - - - 1999 2 1 0 - 0 - 1 - 2 -1999 - 1 - - - -1mV 1mV Figure 10. MAX1367 Transfer Function—±2V Range -200mV 0 ANALOG INPUT VOLTAGE +200mV LED 1 - - - 1999 2 1 0 - 0 - 1 - 2 -1999 - 1 - - - -100μV 100μV Figure 9. MAX1367 Transfer Function—±200mV Range MAX1365/MAX1367 The transfer function for the MAX1367 with AIN+ - AIN- < 0 and RANGE = GND is: The transfer function for the MAX1365 with AIN+ - AIN- ≥ 0 and RANGE = DVDD is: The transfer function for the MAX1365 with AIN+ - AIN- < 0 and RANGE = DVDD is: (6) COUNT 1.024 20,000 10 1 V V V V AIN AIN x x REF REF = + − − + + − − (5) COUNT 1.024 20,000 10 V V V V AIN AIN x x REF REF = + − − + − − (4) COUNT 1.024 2000 1 V V V V AIN AIN x REF REF = + − − + + − − Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 18 ______________________________________________________________________________________ - FS + FS ADC OUTPUT CODE 0 DAC OUTPUT VOLTAGE (V) 0 1. 25 UNIPOLAR : BIPLOLAR : FS = FULL SCALE Figure 11. DAC Output Voltage vs. ADC Output Code UNIPOLAR : BIPLOLAR : ADC OUTPUT CODE 4-20OUT (mA) 20 FS = FULL SCALE 0 16 4 - FS 0 + FS CURRENT OFFSET ENABLED (EN_I = 1) 12 Figure 12. Output Current (4-20OUT) vs. ADC Output Code (Current Offset Enabled) OFFSET ENABLED : OFFSET DISABLED : V/I CONVERTER INPUT ( V ) 0 4-20OUT (mA) 20 0 16 4 1. 25 Figure 14. 4-20OUT Output Current vs. V/I Converter Input Voltage UNIPOLAR : BIPLOLAR : ADC OUTPUT CODE 4-20OUT (mA) 16 FS = FULL SCALE 0 - FS 0 + FS CURRENT OFFSET DISABLED (EN_I = 0) 8 Figure 13. Output Current (4-20OUT) vs. ADC Output Code (Current Offset Disabled) The transfer function for the MAX1367 with AIN+ - AIN- ≥ 0 and RANGE = DVDD is: The transfer function for the MAX1367 with AIN+ - AIN- < 0 and RANGE = DVDD is: DAC Transfer Functions Figure 11 shows the DAC transfer function for the MAX1365/MAX1367 in unipolar and bipolar modes. The transfer function for the DAC in the MAX1365/ MAX1367 unipolar mode is: where N = two’s complement ADC output code. In unipolar mode, VDACVOUT is equal to 0V for all two’s complement ADC codes less than zero (see Figure 12). The transfer function for the DAC in the MAX1365/ MAX1367 in bipolar mode is: where N = two’s complement ADC output. Voltage-to-Current Transfer Function Figures 12 and 13 show the MAX1365/MAX1367 transfer function of the output current (4-20OUT) versus the ADC input code. The transfer function for the MAX1365/MAX1367 with the current offset enabled (EN_I is high) is: The transfer function for the MAX1365/MAX1367 with the current offset disabled (EN_I is low) is: Supplies, Layout, and Bypassing Power up AVDD and DVDD before applying an analog input and external-reference voltage to the device. If this is not possible, limit the current into these inputs to 50mA. When the analog and digital supplies come from the same source, isolate the digital supply from the analog supply with a low-value resistor (10Ω) or ferrite bead. For best performance, ground the MAX1365/ MAX1367 to the analog ground plane of the circuit board. Avoid running digital lines under the device as this can couple noise onto the IC. Run the analog ground plane under the MAX1365/MAX1367 to minimize coupling of digital noise. Make the power-supply lines to the MAX1365/MAX1367 as wide as possible to provide low-impedance paths and reduce the effects of glitches on the power-supply line. Shield fast-switching signals, such as clocks, with digital ground to avoid radiating noise to other sections of the board. Avoid running clock signals near the analog inputs. Avoid crossover of digital and analog signals. Running traces that are on opposite sides of the board at right angles to each other reduces feedthrough effects. Good decoupling is important when using high-resolution ADCs. Decouple the supplies with 0.1μF ceramic capacitors to GND. Place these components as close to the device as possible to achieve the best decoupling. Selecting Segment Current A resistor from ISET to ground sets the current for each LED segment. See Table 6 for more detail. Use the following formula to set the segment current: RISET values below 25kΩ increase the ISEG. However, the internal current-limit circuit limits the ISEG to less than 30mA. At higher ISEG values, proper operation of the device is not guaranteed. In addition, the power dissipated may exceed the package power-dissipation limit. Choosing Supply Voltage to Minimize Power Dissipation The MAX1365/MAX1367 drive a peak current of 25.5mA into LEDs with a 2.2V forward voltage drop when operated from a supply voltage of at least 3.0V. Therefore, the minimum voltage drop across the internal LED drivers is 0.8V (3.0V - 2.2V = 0.8V). The MAX1365/MAX1367 sink when the outputs are operating and the LED segment drivers are at full current (8 x 25.5mA = 204mA). For a 3.3V supply, the MAX1365/MAX1367 dissipate 224.4mW ((3.3V - 2.2V) x 204 = 224.4mW). If a higher supply voltage is used, the driver absorbs a higher voltage, and the driver’s power dissipation increases accordingly. I V R SEG x ISET = 1 20 450 . IOUT mA ≅ x VCONV IN 16 1.25 _ IOUT mA ≅ x VCONV IN + mA 16 1 25 4 . _ V N DACVOUT = x VREF +19 999 65 536 , , V N DACVOUT = x VREF 32,768−1 (8) COUNT 1.024 2000 10 1 V V V V AIN AIN x x REF REF = + − − + + − − (7) COUNT 1.024 2000 10 V V V V AIN AIN x x REF REF = + − − + − − MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 19 Note: The input at VCONV_IN expects a source impedance of typically 6kΩ when driving VCONV_IN externally. MAX1365/MAX1367 However, if the LEDs used have a higher forward voltage drop than 2.2V, the supply voltage must be raised accordingly to ensure that the driver always has at least 0.8V headroom. For a LEDV supply voltage of 2.7V, the maximum LED forward voltage is 1.9V to ensure 0.8V driver headroom. The voltage drop across the drivers with a nominal +5V supply (5.0V - 2.2V = 2.8V) is almost three times the drop across the drivers with a nominal 3.3V supply (3.3V - 2.2V = 1.1V). Therefore, the driver’s power dissipation increases three times. The power dissipation in the part causes the junction temperature to rise accordingly. In the high ambient temperature case, the total junction temperature may be very high (> +125°C). At higher junction temperatures, the ADC performance degrades. To ensure the dissipation limit for the MAX1365/MAX1367 is not exceeded and the ADC performance is not degraded; a diode can be inserted between the power supply and LEDV. Selecting Depletion-Mode FET An external depletion-mode FET (DMOS) works in conjunction with the regulator circuit to supply the V/I converter with loop power. REG_FORCE regulates the gate of the DMOS so that the drain voltage is 5.2V (typ) and allows the 4–20mA (0 to 16mA) loop to be directly powered from a 7V to 30V supply. DMOS IDS consists of the current output at 4-20OUT, a 4mA offset current, and 1mA (typ) consumed by the V/I converter. For offset-enabled mode (EN_I = 1): IDS = I4-20OUT + 4mA + 1mA where IDS is the current in the DMOS. For offset-disabled mode (EN_I = 0): IDS = I4-20OUT + 1mA where IDS is the current in the DMOS. Table 7 provides the FET characteristics for selecting an external DMOS transistor. The DN25D FET transistor from Supertex meets all the requirements of Table 7. Other suitable transistors include ND2020L and ND2410L from Siliconix. Connect a 0.1μF capacitor between CMP and REG_FORCE to ensure stable regulator compensation. Definitions Integral Nonlinearity (INL) INL is the deviation of the values on an actual transfer function from a straight line. This straight line is either a best-straight-line fit or a line drawn between the end points of the transfer function, once offset and gain errors have been nullified. INL for the MAX1365/ MAX1367 is measured using the end-point method. Differential Nonlinearity (DNL) DNL is the difference between an actual step width and the ideal value of ±1 LSB. A DNL error specification of less than ±1 LSB guarantees no missing codes and a monotonic transfer function. Rollover Error Rollover error is defined as the absolute-value difference between a near positive full-scale reading and near negative full-scale reading. Rollover error is tested by applying a full-scale positive voltage, swapping AIN+ and AIN-, and adding the results. Zero-Input Reading Ideally, with AIN+ connected to AIN-, the MAX1365/ MAX1367 LED displays zero. Zero-input reading is the measured deviation from the ideal zero and the actual measured point. Gain Error Gain error is the amount of deviation between the measured full-scale transition point and the ideal full-scale transition point. Common-Mode Rejection (CMR) CMR is the ability of a device to reject a signal that is common to both input terminals. The common-mode signal can be either an AC or a DC signal or a combination of the two. CMR is often expressed in decibels. Normal-Mode 50Hz and 60Hz Rejection (Simultaneously) Normal-mode rejection is a measure of how much output changes when 50Hz and 60Hz signals are injected into only one of the differential inputs. The MAX1365/ MAX1367 sigma-delta converter uses its internal digital filter to provide normal-mode rejection to both 50Hz and 60Hz power-line frequencies simultaneously. Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 20 ______________________________________________________________________________________ Power-Supply Rejection (PSR)—ADC PSR is a measure of the data converter’s level of immunity to power-supply fluctuations. PSR assumes that the converter’s linearity is unaffected by changes in the power-supply voltage. Power-supply rejection ratio (PSRR) is the ratio of the input signal change to the change in the converter output. PSRR is typically measured in dB. Power-Supply Rejection—V/I Converter PSR is a measure of the data converter’s level of immunity to power-supply fluctuations. PSR assumes that the converter’s linearity is unaffected by changes in the power-supply voltage. Note: The V/I converter current output (4–20mA) power-supply rejection is with respect to the 7V to 30V loop supply. MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 21 RSET (kΩ) ISEG (mA) 25 21.6 50 10.8 100 5.4 500 1.1 > 2500 LED driver disabled Table 6. Segment-Current Selection FET TYPE N-CHANNEL DEPLETION MODE IDS 30mA BVDS (VEXT* - REG_VDD) min VPINCHOFF REG_VDD max Power dissipation 30mA x (VEXT - REG_VDD) min Table 7. FET Characteristics *VEXT is the 7V to 30V loop voltage. MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 22 ______________________________________________________________________________________ MAX1365 MAX6126 0.1μF 10μF 10μF 0.1μF 0.1μF 10μF 10μF LISO RL 2.7V TO 5.25V 4.75V TO 5.25V DEPLETIONMODE FET VEXT 7V TO 30V 4-20mA PLC INPUT ADC AIN+ IN DAC_VDD SUPPLY VOLTAGE 0.1μF AINLEDV 4-20mA/0 TO 16mA CURRENT-LOOP OUTPUT LED_EN DVDD AVDD DAC_VDD GND_DAC REF_DAC SET NEGV GND REF- REF+ LEDG GND_V/I DACVOUT OUTF OUTS CONV_IN EN_BPM EN_I TO DVDD DACDATA_SEL CS_DAC REFSELE INTREF RANGE PEAK HOLD DPON DPSET2 DPSET1 DIG0–DIG4 DIGIT CONNECTIONS SEGA–SEGDP SEGMENT CONNECTIONS VIN CMP GNDS GND REG_FORCE REG_VDD REG_AMP 4-20OUT 25kΩ 0.1μF 0.1μF MAX1365 Typical Operating Circuit MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output ______________________________________________________________________________________ 23 MAX1367 MAX6126 0.1μF 10μF 10μF 0.1μF 0.1μF 10μF 10μF LISO RL 2.7V TO 5.25V 4.75V TO 5.25V DEPLETIONMODE FET VEXT 7V TO 30V 4-20mA PLC INPUT ADC AIN+ IN DAC_VDD SUPPLY VOLTAGE 0.1μF AINLEDV 4-20mA/0 TO 16mA CURRENT-LOOP OUTPUT LED_EN DVDD AVDD DAC_VDD DIGO GND_DAC REF_DAC SET NEGV GND REF- REF+ LEDG GND_V/I DACVOUT OUTF OUTS CONV_IN EN_BPM EN_I TO DVDD DACDATA_SEL CS_DAC REFSELE INTREF RANGE PEAK HOLD DPON DPSET2 DPSET1 DIG1–DIG4 DIGIT CONNECTIONS SEGA–SEGDP SEGMENT CONNECTIONS VIN CMP GNDS GND REG_FORCE REG_VDD REG_AMP 4-20OUT 25kΩ 0.1μF 0.1μF MAX1367 Typical Operating Circuit MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output 24 ______________________________________________________________________________________ TOP VIEW MAX1365 MAX1367 TQFP 13 14 15 16 17 18 19 20 21 22 23 24 CONV_IN 4-200UT GDN_DAC GND_V/I REF_DAC EN_BPM EN_I REFSELE DACDATA_SEL CS_DAC INTREF RANGE 48 47 46 45 44 43 42 41 40 39 38 37 1 2 3 4 5 6 7 8 9 10 11 12 REF+ REFDPON NEGV LED_EN SEGDP SEGG SEGF SEGE SEGD SEGC LEDV DACVOUT DAC_VDD CMP REG_AMP REG_FORCE REG_VDD SET DVDD AVDD GND AINAIN+ 36 35 34 33 32 31 30 29 28 27 26 25 PEAK HOLD DPSET2 DPSET1 LEDG DIG0 DIG1 DIG2 DIG3 DIG4 SEGA SEGB Pin Configuration Chip Information TRANSISTOR COUNT: 83,463 PROCESS: CMOS MAX1365/MAX1367 Stand-Alone, 4.5-/3.5-Digit Panel Meters with 4–20mA Output Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 25 © 2006 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) 32L/48L,TQFP.EPS E 1 21-0054 2 PACKAGE OUTLINE, 32/48L TQFP, 7x7x1.4mm E 2 21-0054 2 PACKAGE OUTLINE, 32/48L TQFP, 7x7x1.4mm 1 623345fc LT6233/LT6233-10 LT6234/LT6235 Typical Application Features Description 60MHz, Rail-to-Rail Output, 1.9nV/√Hz, 1.2mA Op Amp Family Low Noise Low Power Instrumentation Amplifier Applications n Low Noise Voltage: 1.9nV/√Hz n Low Supply Current: 1.2mA/Amp Max n Low Offset Voltage: 350μV Max n Gain-Bandwidth Product: LT6233: 60MHz; AV ≥ 1 LT6233-10: 375MHz; AV ≥ 10 n Wide Supply Range: 3V to 12.6V n Output Swings Rail-to-Rail n Common Mode Rejection Ratio: 115dB Typ n Output Current: 30mA n Operating Temperature Range: –40°C to 85°C n LT6233 Shutdown to 10μA Maximum n LT6233/LT6233-10 in a Low Profile (1mm) ThinSOT™ Package n Dual LT6234 in 8-Pin SO and Tiny DFN Packages n LT6235 in a 16-Pin SSOP Package n Ultrasound Amplifiers n Low Noise, Low Power Signal Processing n Active Filters n Driving A/D Converters n Rail-to-Rail Buffer Amplifiers L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. ThinSOT is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Noise Voltage and Unbalanced Noise Current vs Frequency The LT®6233/LT6234/LT6235 are single/dual/quad low noise, rail-to-rail output unity-gain stable op amps that feature 1.9nV/√Hz noise voltage and draw only 1.2mA of supply current per amplifier. These amplifiers combine very low noise and supply current with a 60MHz gainbandwidth product, a 17V/μs slew rate and are optimized for low supply voltage signal conditioning systems. The LT6233-10 is a single amplifier optimized for higher gain applications resulting in higher gain bandwidth and slew rate. The LT6233 and LT6233-10 include an enable pin that can be used to reduce the supply current to less than 10μA. The amplifier family has an output that swings within 50mV of either supply rail to maximize the signal dynamic range in low supply applications and is specified on 3.3V, 5V and ±5V supplies. The en • √ISUPPLY product of 2.1 per amplifier is among the most noise efficient of any op amp. The LT6233/LT6233-10 are available in the 6-lead SOT‑23 package and the LT6234 dual is available in the 8-pin SO package with standard pinouts. For compact layouts, the dual is also available in a tiny dual fine pitch leadless package (DFN). The LT6235 is available in the 16-pin SSOP package. R6 499 VS + AV = 20 BW = 2.8MHz VS = ±1.5V to ±5V VOUT VS – IN+ IN– VS – VS + R7 499 R4 499 R2 475 R1 49.9 R3 475 R5 499 EN IS = 3mA EN = 8μVRMS INPUT REFERRED, MEASUREMENT BW = 4MHz 623345 TA01a – + LT6233 1/2 LT6234 1/2 LT6234 FREQUENCY (Hz) NOISE VOLTAGE (nV/ Hz) 6 5 4 3 2 1 0 10 1k 10k 100k 623345 TA01b 100 VS = ±2.5V TA = 25°C VCM = 0V NOISE VOLTAGE NOISE CURRENT UNBALANCED NOISE CURRENT (pA/ Hz) 6 5 4 3 2 1 0 LT6233/LT6233-10 LT6234/LT6235 2 623345fc Absolute Maximum Ratings Total Supply Voltage (V+ to V–)............................... 12.6V Input Current (Note 2).......................................... ±40mA Output Short-Circuit Duration (Note 3)............. Indefinite Operating Temperature Range (Note 4)....–40°C to 85°C Specified Temperature Range (Note 5).....–40°C to 85°C Junction Temperature............................................ 150°C (Note 1) 6 V+ 5 ENABLE 4 –IN OUT 1 TOP VIEW S6 PACKAGE 6-LEAD PLASTIC TSOT-23 V– 2 +IN 3 TJMAX = 150°C, θJA = 250°C/W TOP VIEW DD PACKAGE 8-LEAD (3mm × 3mm) PLASTIC DFN 5 6 7 8 4 3 2 OUT A 1 –IN A +IN A V– V+ OUT B –IN B +IN B + – + – TJMAX = 125°C, θJA = 160°C/W UNDERSIDE METAL CONNECTED TO V– (PCB CONNECTION OPTIONAL) TOP VIEW V+ OUT B –IN B +IN B OUT A –IN A +IN A V– S8 PACKAGE 8-LEAD PLASTIC SO 1 2 3 4 8 7 6 5 + – + – TJMAX = 150°C, θJA = 190°C/W TOP VIEW GN PACKAGE 16-LEAD NARROW PLASTIC SSOP 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 OUT A –IN A +IN A V+ +IN B –IN B OUT B NC OUT D –IN D +IN D V– +IN C –IN C OUT C NC + – + – + – + – A D B C TJMAX = 150°C, θJA = 135°C/W Pin Configuration Junction Temperature (DD Package)..................... 125°C Storage Temperature Range................... –65°C to 150°C Storage Temperature Range (DD Package)......................................... –65°C to 125°C Lead Temperature (Soldering, 10 sec)....................300°C 3 623345fc LT6233/LT6233-10 LT6234/LT6235 Electrical Characteristics TA = 25°C, VS = 5V, 0V; VS = 3.3V, 0V; VCM = VOUT = half supply, ENABLE = 0V, unless otherwise noted. Order Information LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION SPECIFIED TEMPERATURE RANGE LT6233CS6#PBF LT6233CS6#TRPBF LTAFL 6-Lead Plastic TS0T-23 0°C to 70°C LT6233IS6#PBF LT6233IS6#TRPBF LTAFL 6-Lead Plastic TS0T-23 –40°C to 85°C LT6233CS6-10#PBF LT6233CS6-10#TRPBF LTAFM 6-Lead Plastic TS0T-23 0°C to 70°C LT6233IS6-10#PBF LT6233IS6-10#TRPBF LTAFM 6-Lead Plastic TS0T-23 –40°C to 85°C LT6234CS8#PBF LT6234CS8#TRPBF 6234 8-Lead Plastic SO 0°C to 70°C LT6234IS8#PBF LT6234IS8#TRPBF 6234I 8-Lead Plastic SO –40°C to 85°C LT6234CDD#PBF LT6234CDD#TRPBF LAET 8-Lead (3mm × 3mm) Plastic DFN 0°C to 70°C LT6234IDD#PBF LT6234IDD#TRPBF LAET 8-Lead (3mm × 3mm) Plastic DFN –40°C to 85°C LT6235CGN#PBF LT6235CGN#TRPBF 6235 16-Lead Narrow Plastic SSOP 0°C to 70°C LT6235IGN#PBF LT6235IGN#TRPBF 6235I 16-Lead Narrow Plastic SSOP –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage LT6233S6, LT6233S6-10 LT6234S8, LT6235GN LT6234DD 100 50 75 500 350 450 μV μV μV Input Offset Voltage Match (Channel-to-Channel) (Note 6) 80 600 μV IB Input Bias Current 1.5 3 μA IB Match (Channel-to-Channel) (Note 6) 0.04 0.3 μA IOS Input Offset Current 0.04 0.3 μA Input Noise Voltage 0.1Hz to 10Hz 220 nVP-P en Input Noise Voltage Density f = 10kHz, VS = 5V 1.9 3 nV/√Hz in Input Noise Current Density, Balanced Source Input Noise Current Density, Unbalanced Source f = 10kHz, VS = 5V, RS = 10k f = 10kHz, VS = 5V, RS = 10k 0.43 0.78 pA/√Hz pA/√Hz Input Resistance Common Mode Differential Mode 22 25 MΩ kΩ CIN Input Capacitance Common Mode Differential Mode 2.5 4.2 pF pF AVOL Large-Signal Gain VS = 5V, VO = 0.5V to 4.5V, RL = 10k to VS/2 VS = 5V, VO = 0.5V to 4.5V, RL = 1k to VS/2 73 18 140 35 V/mV V/mV VS = 3.3V, VO = 0.65V to 2.65V, RL = 10k to VS/2 VS = 3.3V, VO = 0.65V to 2.65V, RL = 1k to VS/2 53 11 100 20 V/mV V/mV VCM Input Voltage Range Guaranteed by CMRR, VS = 5V, 0V Guaranteed by CMRR, VS = 3.3V, 0V 1.5 1.15 4 2.65 V V CMRR Common Mode Rejection Ratio VS = 5V, VCM = 1.5V to 4V VS = 3.3V, VCM = 1.15V to 2.65V 90 85 115 110 dB dB CMRR Match (Channel-to-Channel) (Note 6) VS = 5V, VCM = 1.5V to 4V 84 115 dB LT6233/LT6233-10 LT6234/LT6235 4 623345fc Electrical Characteristics TA = 25°C, VS = 5V, 0V; VS = 3.3V, 0V; VCM = VOUT = half supply, ENABLE = 0V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS PSRR Power Supply Rejection Ratio VS = 3V to 10V 90 115 dB PSRR Match (Channel-to-Channel) (Note 6) VS = 3V to 10V 84 115 dB Minimum Supply Voltage (Note 7) 3 V VOL Output Voltage Swing Low (Note 8) No Load ISINK = 5mA VS = 5V, ISINK = 15mA VS = 3.3V, ISINK = 10mA 4 75 165 125 40 180 320 240 mV mV mV mV VOH Output Voltage Swing High (Note 8) No Load ISOURCE = 5mA VS = 5V, ISOURCE = 15mA VS = 3.3V, ISOURCE = 10mA 5 85 220 165 50 195 410 310 mV mV mV mV ISC Short-Circuit Current VS = 5V VS = 3.3V ±40 ±35 ±55 ±50 mA mA IS Supply Current per Amplifier Disabled Supply Current per Amplifier ENABLE = V+ – 0.35V 1.05 0.2 1.2 10 mA μA IENABLE ENABLE Pin Current ENABLE = 0.3V –25 –75 μA VL ENABLE Pin Input Voltage Low 0.3 V VH ENABLE Pin Input Voltage High V+ – 0.35 V Output Leakage Current ENABLE = V+ – 0.35V, VO = 1.5V to 3.5V 0.2 10 μA tON Turn-On Time ENABLE = 5V to 0V, RL = 1k, VS = 5V 500 ns tOFF Turn-Off Time ENABLE = 0V to 5V, RL = 1k, VS = 5V 76 μs GBW Gain-Bandwidth Product Frequency = 1MHz, VS = 5V LT6233-10 55 320 MHz MHz SR Slew Rate VS = 5V, A V = –1, RL = 1k, VO = 1.5V to 3.5V 10 15 V/μs LT6233-10, VS = 5V, AV = –10, RL = 1k, VO = 1.5V to 3.5V 80 V/μs FPBW Full-Power Bandwidth VS = 5V, VOUT = 3VP-P (Note 9) 1.06 1.6 MHz LT6233-10, HD2 = HD3 ≤ 1% 2.2 MHz tS Settling Time (LT6233, LT6234, LT6235) 0.1%, VS = 5V, VSTEP = 2V, AV = –1, RL = 1k 175 ns 5 623345fc LT6233/LT6233-10 LT6234/LT6235 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT VOS Input Offset Voltage LT6233CS6, LT6233CS6-10 LT6234CS8, LT6235CGN LT6234CDD l l l 600 450 550 μV μV μV Input Offset Voltage Match (Channel-to-Channel) (Note 6) l 800 μV VOS TC Input Offset Voltage Drift (Note 10) VCM = Half Supply l 0.5 3.0 μV/°C IB Input Bias Current l 3.5 μA IB Match (Channel-to-Channel) (Note 6) l 0.4 μA IOS Input Offset Current l 0.4 μA AVOL Large-Signal Gain VS = 5V, VO = 0.5V to 4.5V, RL = 10k to VS/2 VS = 5V, VO = 0.5V to 4.5V, RL = 1k to VS/2 l l 47 12 V/mV V/mV VS = 3.3V, VO = 0.65V to 2.65V, RL = 10k to VS/2 VS = 3.3V, VO = 0.65V to 2.65V, RL = 1k to VS/2 l l 40 7.5 V/mV V/mV VCM Input Voltage Range Guaranteed by CMRR VS = 5V, 0V Vs = 3.3V, 0V l l 1.5 1.15 4 2.65 V V CMRR Common Mode Rejection Ratio VS = 5V, VCM = 1.5V to 4V VS = 3.3V, VCM = 1.15V to 2.65V l l 90 85 dB dB CMRR Match (Channel-to-Channel) (Note 6) VS = 5V, VCM = 1.5V to 4V l 84 dB PSRR Power Supply Rejection Ratio VS = 3V to 10V l 90 dB PSRR Match (Channel-to-Channel) (Note 6) VS = 3V to 10V l 84 dB Minimum Supply Voltage (Note 7) l 3 V VOL Output Voltage Swing Low (Note 8) No Load ISINK = 5mA VS = 5V, ISINK = 15mA VS = 3.3V, ISINK = 10mA l l l l 50 195 360 265 mV mV mV mV VOH Output Voltage Swing High (Note 8) No Load ISOURCE = 5mA VS = 5V, ISOURCE = 15mA VS = 3.3V, ISOURCE = 10mA l l l l 60 205 435 330 mV mV mV mV ISC Short-Circuit Current VS = 5V VS = 3.3V l l ±35 ±30 mA mA IS Supply Current per Amplifier Disabled Supply Current per Amplifier ENABLE = V+ – 0.25V l l 1 1.45 mA μA IENABLE ENABLE Pin Current ENABLE = 0.3V l –85 μA VL ENABLE Pin Input Voltage Low l 0.3 V VH ENABLE Pin Input Voltage High l V+ – 0.25 V Output Leakage Current ENABLE = V+ – 0.25V, VO = 1.5V to 3.5V l 1 μA tON Turn-On Time ENABLE = 5V to 0V, RL = 1k, VS = 5V l 500 ns tOFF Turn-Off Time ENABLE = 0V to 5V, RL = 1k, VS = 5V l 120 μs SR Slew Rate VS = 5V, AV = –1, RL = 1k, VO = 1.5V to 3.5V l 9 V/μs LT6233-10, AV = –10, RL = 1k, VO = 1.5V to 3.5V l 75 V/μs FPBW Full-Power Bandwidth (Note 9) VS = 5V, VOUT = 3VP-P; LT6233C, LT6234C, LT6235C l 955 kHz Electrical Characteristics The l denotes the specifications which apply over the 0°C < TA < 70°C temperature range. VS = 5V, 0V; VS = 3.3V, 0V; VCM = VOUT = half supply, ENABLE = 0V, unless otherwise noted. LT6233/LT6233-10 LT6234/LT6235 6 623345fc Electrical Characteristics The l denotes the specifications which apply over the –40°C < TA < 85°C temperature range. VS = 5V, 0V; VS = 3.3V, 0V; VCM = VOUT = half supply, ENABLE = 0V, unless otherwise noted. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage LT6233IS6, LT6233IS6-10 LT6234IS8, LT6235IGN LT6234IDD l l l 700 550 650 μV μV μV Input Offset Voltage Match (Channel-to-Channel) (Note 6) l 1000 μV VOS TC Input Offset Voltage Drift (Note 10) VCM = Half Supply l 0.5 3 μV/°C IB Input Bias Current l 4 μA IB Match (Channel-to-Channel) (Note 6) l 0.4 μA IOS Input Offset Current l 0.5 μA AVOL Large-Signal Gain VS = 5V, VO = 0.5V to 4.5V, RL = 10k to VS/2 VS = 5V, VO = 0.5V to 4.5V, RL = 1k to VS/2 l l 45 11 V/mV V/mV VS = 3.3V, VO = 0.65V to 2.65V, RL = 10k to VS/2 VS = 3.3V, VO = 0.65V to 2.65V, RL = 1k to VS/2 l l 38 7 V/mV V/mV VCM Input Voltage Range Guaranteed by CMRR VS = 5V, 0V VS = 3.3V, 0V l l 1.5 1.15 4 2.65 V V CMRR Common Mode Rejection Ratio VS = 5V, VCM = 1.5V to 4V VS = 3.3V, VCM = 1.15V to 2.65V l l 90 85 dB dB CMRR Match (Channel-to-Channel) (Note 6) VS = 5V, VCM = 1.5V to 4V l 84 dB PSRR Power Supply Rejection Ratio VS = 3V to 10V l 90 dB PSRR Match (Channel-to-Channel) (Note 6) VS = 3V to 10V l 84 dB Minimum Supply Voltage (Note 7) l 3 V VOL Output Voltage Swing Low (Note 8) No Load ISINK = 5mA VS = 5V, ISINK = 15mA VS = 3.3V, ISINK = 10mA l l l l 50 195 370 275 mV mV mV mV VOH Output Voltage Swing High (Note 6) No Load ISOURCE = 5mA VS = 5V, ISOURCE = 15mA VS = 3.3V, ISOURCE = 10mA l l l l 60 210 445 335 mV mV mV mV ISC Short-Circuit Current VS = 5V VS = 3.3V l l ±30 ±20 mA mA IS Supply Current per Amplifier Disabled Supply Current per Amplifier ENABLE = V+ – 0.2V l l 1 1.5 mA μA IENABLE ENABLE Pin Current ENABLE = 0.3V l –100 μA VL ENABLE Pin Input Voltage Low l 0.3 V VH ENABLE Pin Input Voltage High l V+ – 0.2 V Output Leakage Current ENABLE = V+ – 0.2V, VO = 1.5V to 3.5V l 1 μA tON Turn-On Time ENABLE = 5V to 0V, RL = 1k, VS = 5V l 500 ns tOFF Turn-Off Time ENABLE = 0V to 5V, RL = 1k, VS = 5V l 135 μs SR Slew Rate VS = 5V, AV = –1, RL = 1k, VO = 1.5V to 3.5V l 8 V/μs LT6233-10, AV = –10, RL = 1k, VO = 1.5V to 3.5V l 70 V/μs FPBW Full-Power Bandwidth (Note 9) VS = 5V, VOUT = 3VP-P; LT6233I, LT6234I, LT6235I l 848 kHz 7 623345fc LT6233/LT6233-10 LT6234/LT6235 Electrical Characteristics TA = 25°C, VS = ±5V, VCM = VOUT = 0V, ENABLE = 0V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage LT6233S6, LT6233S6-10 LT6234S8, LT6235GN LT6234DD 100 50 75 500 350 450 μV μV μV Input Offset Voltage Match (Channel-to-Channel) (Note 6) 100 600 μV IB Input Bias Current 1.5 3 μA IB Match (Channel-to-Channel) (Note 6) 0.04 0.3 μA IOS Input Offset Current 0.04 0.3 μA Input Noise Voltage 0.1Hz to 10Hz 220 nVP-P en Input Noise Voltage Density f = 10kHz 1.9 3.0 nV/√Hz in Input Noise Current Density, Balanced Source Input Noise Current Density, Unbalanced Source f = 10kHz, RS = 10k f = 10kHz, RS = 10k 0.43 0.78 pA/√Hz pA/√Hz Input Resistance Common Mode Differential Mode 22 25 MΩ kΩ CIN Input Capacitance Common Mode Differential Mode 2.1 3.7 pF pF AVOL Large-Signal Gain VO = ±4.5V, RL = 10k VO = ±4.5V, RL = 1k 97 28 180 55 V/mV V/mV VCM Input Voltage Range Guaranteed by CMRR –3 4 V CMRR Common Mode Rejection Ratio VCM = –3V to 4V 90 110 dB CMRR Match (Channel-to-Channel) (Note 6) VCM = –3V to 4V 84 120 dB PSRR Power Supply Rejection Ratio VS = ±1.5V to ±5V 90 115 dB PSRR Match (Channel-to-Channel) (Note 6) VS = ±1.5V to ±5V 84 115 dB VOL Output Voltage Swing Low (Note 8) No Load ISINK = 5mA ISINK = 15mA 4 75 165 40 180 320 mV mV mV VOH Output Voltage Swing High (Note 8) No Load ISOURCE = 5mA ISOURCE = 15mA 5 85 220 50 195 410 mV mV mV ISC Short-Circuit Current ±40 ±55 mA IS Supply Current per Amplifier Disabled Supply Current per Amplifier ENABLE = 4.65V 1.15 0.2 1.4 10 mA μA IENABLE ENABLE Pin Current ENABLE = 0.3V –35 –85 μA VL ENABLE Pin Input Voltage Low 0.3 V VH ENABLE Pin Input Voltage High 4.65 V Output Leakage Current ENABLE = 4.65V, VO = ±1V 0.2 10 μA tON Turn-On Time ENABLE = 5V to 0V, RL = 1k 900 ns tOFF Turn-Off Time ENABLE = 0V to 5V, RL = 1k 100 μs GBW Gain-Bandwidth Product Frequency = 1MHz LT6233-10 42 260 60 375 MHz MHz SR Slew Rate AV = –1, RL = 1k, VO = –2V to 2V 12 17 V/μs LT6233-10, AV = –10, RL = 1k, VO = –2V to 2V 115 V/μs FPBW Full-Power Bandwidth VOUT = 3VP-P (Note 9) 1.27 1.8 MHz LT6233-10, HD2 = HD3 ≤ 1% 2.2 MHz tS Settling Time (LT6233, LT6234, LT6235) 0.1%, VSTEP = 2V, AV = –1, RL = 1k 170 ns LT6233/LT6233-10 LT6234/LT6235 8 623345fc Electrical Characteristics The l denotes the specifications which apply over the 0°C < TA < 70°C temperature range. VS = ±5V, VCM = VOUT = 0V, ENABLE = 0V, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage LT6233CS6, LT6233CS6-10 LT6234CS8, LT6235CGN LT6234CDD l l l 600 450 550 μV μV μV Input Offset Voltage Match (Channel-to-Channel) (Note 6) l 800 μV VOS TC Input Offset Voltage Drift (Note 10) l 0.5 3 μV/°C IB Input Bias Current l 3.5 μA IB Match (Channel-to-Channel) (Note 6) l 0.4 μA IOS Input Offset Current l 0.4 μA AVOL Large-Signal Gain VO = ±4.5V, RL = 10k VO = ±4.5V, RL = 1k l l 75 22 V/mV V/mV VCM Input Voltage Range Guaranteed by CMRR l –3 4 V CMRR Common Mode Rejection Ratio VCM = –3V to 4V l 90 dB CMRR Match (Channel-to-Channel) (Note 6) VCM = –3V to 4V l 84 dB PSRR Power Supply Rejection Ratio VS = ±1.5V to ±5V l 90 dB PSRR Match (Channel-to-Channel) (Note 6) VS = ±1.5V to ±5V l 84 dB VOL Output Voltage Swing Low (Note 8) No Load ISINK = 5mA ISINK = 15mA l l l 50 195 360 mV mV mV VOH Output Voltage Swing High (Note 8) No Load ISOURCE = 5mA ISOURCE = 15mA l l l 60 205 435 mV mV mV ISC Short-Circuit Current l ±35 mA IS Supply Current per Amplifier Disabled Supply Current per Amplifier ENABLE = 4.75V l l 1 1.7 mA μA IENABLE ENABLE Pin Current ENABLE = 0.3V l –95 μA VL ENABLE Pin Input Voltage Low l 0.3 V VH ENABLE Pin Input Voltage High l 4.75 V Output Leakage Current ENABLE = 4.75V, VO = ±1V l 1 μA tON Turn-On Time ENABLE = 5V to 0V, RL = 1k l 900 ns tOFF Turn-Off Time ENABLE = 0V to 5V, RL = 1k l 150 μs SR Slew Rate AV = –1, RL = 1k, VO = –2V to 2V l 11 V/μs LT6233-10, AV = –10, RL = 1k, VO = –2V to 2V l 105 V/μs FPBW Full-Power Bandwidth (Note 9) VOUT = 3VP-P ; LT6233C, LT6234C, LT6235C l 1.16 MHz 9 623345fc LT6233/LT6233-10 LT6234/LT6235 Electrical Characteristics The l denotes the specifications which apply over the –40°C < TA < 85°C temperature range. VS = ±5V, VCM = VOUT = 0V, ENABLE = 0V, unless otherwise noted. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage LT6233IS6, LT6233IS6-10 LT6234IS8, LT6235IGN LT6234IDD l l l 700 550 650 μV μV μV Input Offset Voltage Match (Channel-to-Channel) (Note 6) l 1000 μV VOS TC Input Offset Voltage Drift (Note 10) l 0.5 3 μV/°C IB Input Bias Current l 4 μA IB Match (Channel-to-Channel) (Note 6) l 0.4 μA IOS Input Offset Current l 0.5 μA AVOL Large-Signal Gain VO = ±4.5V, RL = 10k VO = ±4.5V, RL = 1k l l 68 20 V/mV V/mV VCM Input Voltage Range Guaranteed by CMRR l –3 4 V CMRR Common Mode Rejection Ratio VCM = –3V to 4V l 90 dB CMRR Match (Channel-to-Channel) (Note 6) VCM = –3V to 4V l 84 dB PSRR Power Supply Rejection Ratio VS = ±1.5V to ±5V l 90 dB PSRR Match (Channel-to-Channel) (Note 6) VS = ±1.5V to ±5V l 84 dB VOL Output Voltage Swing Low (Note 8) No Load ISINK = 5mA ISINK = 15mA l l l 50 195 370 mV mV mV VOH Output Voltage Swing High (Note 8) No Load ISOURCE = 5mA ISOURCE = 15mA l l l 70 210 445 mV mV mV ISC Short-Circuit Current l ±30 mA IS Supply Current per Amplifier Disabled Supply Current per Amplifier ENABLE = 4.8V l l 1 1.75 mA μA IENABLE ENABLE Pin Current ENABLE = 0.3V l –110 μA VL ENABLE Pin Input Voltage Low l 0.3 V VH ENABLE Pin Input Voltage High l 4.8 V Output Leakage Current ENABLE = 4.8V, VO = ±1V l 1 μA tON Turn-On Time ENABLE = 5V to 0V, RL = 1k l 900 ns tOFF Turn-Off Time ENABLE = 0V to 5V, RL = 1k l 160 μs SR Slew Rate AV = –1, RL = 1k, VO = –2V to 2V l 10 V/μs LT6233-10, AV = –10, RL = 1k, VO = –2V to 2V l 95 V/μs FPBW Full-Power Bandwidth (Note 9) VOUT = 3VP-P; LT6233I, LT6234I, LT6235I l 1.06 MHz Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: Inputs are protected by back-to-back diodes. If the differential input voltage exceeds 0.7V, the input current must be limited to less than 40mA. Note 3: A heat sink may be required to keep the junction temperature below the absolute maximum rating when the output is shorted indefinitely. Note 4: The LT6233C/LT6233I the LT6234C/LT6234I, and LT6235C/LT6235I are guaranteed functional over the temperature range of –40°C to 85°C. Note 5: The LT6233C/LT6234C/LT6235C are guaranteed to meet specified performance from 0°C to 70°C. The LT6233C/LT6234C/LT6235C are designed, characterized and expected to meet specified performance from –40°C to 85°C, but are not tested or QA sampled at these temperatures. The LT6233I/LT6234I/LT6235I are guaranteed to meet specified performance from –40°C to 85°C. Note 6: Matching parameters are the difference between the two amplifiers A and D and between B and C of the LT6235; between the two amplifiers of the LT6234. CMRR and PSRR match are defined as follows: CMRR and PSRR are measured in μV/V on the matched amplifiers. The difference is calculated between the matching sides in μV/V. The result is converted to dB. LT6233/LT6233-10 LT6234/LT6235 10 623345fc Note 7: Minimum supply voltage is guaranteed by power supply rejection ratio test. Note 8: Output voltage swings are measured between the output and power supply rails. Electrical Characteristics Note 9: Full-power bandwidth is calculated from the slew rate: FPBW = SR/2πVP Note 10: This parameter is not 100% tested. Typical Performance Characteristics Input Bias Current vs Common Mode Voltage Input Bias Current vs Temperature Output Saturation Voltage vs Load Current (Output Low) VOS Distribution Supply Current vs Supply Voltage (Per Amplifier) Offset Voltage vs Input Common Mode Voltage (LT6233/LT6234/LT6235) INPUT OFFSET VOLTAGE (μV) –200 0 NUMBER OF UNITS 10 20 30 40 –100 0 100 200 623345 GO1 50 60 –150 –50 50 150 VS = 5V, 0V VCM = V+/2 S8 TOTAL SUPPLY VOLTAGE (V) 0 SUPPLY CURRENT (mA) 6 623345 GO2 2 4 8 2.0 1.5 1.0 0.5 0 10 12 14 TA = 125°C TA = 25°C TA = –55°C INPUT COMMON MODE VOLTAGE (V) 0 OFFSET VOLTAGE (μV) 1.5 623345 GO3 0.5 1 2 500 400 300 200 100 0 –100 –200 –300 –400 –500 2.5 3 3.5 4 4.5 5 TA = –55°C TA = 25°C TA = 125°C VS = 5V, 0V COMMON MODE VOLTAGE (V) –1 INPUT BIAS CURRENT (μA) 2 623345 GO4 0 1 3 6 5 4 3 2 1 0 –2 –1 4 5 6 TA = 125°C TA = –55°C TA = 25°C VS = 5V, 0V TEMPERATURE (°C) –50 INPUT BIAS CURRENT (μA) 25 623345 GO5 –25 0 50 6 5 4 3 2 1 0 –1 75 100 125 VCM = 4V VCM = 1.5V VS = 5V, 0V LOAD CURRENT (mA) 0.01 0.1 0.0001 OUTPUT SATURATION VOLTAGE (V) 0.01 10 1 10 100 623345 GO6 0.001 0.1 1 VS = 5V, 0V TA = –55°C TA = 125°C TA = 25°C 11 623345fc LT6233/LT6233-10 LT6234/LT6235 Typical Performance Characteristics Open-Loop Gain Open-Loop Gain Open-Loop Gain Offset Voltage vs Output Current Warm-Up Drift vs Time Total Noise vs Total Source Resistance Output Saturation Voltage vs Load Current (Output High) Minimum Supply Voltage Output Short-Circuit Current vs Power Supply Voltage (LT6233/LT6234/LT6235) LOAD CURRENT (mA) OUTPUT SATURATION VOLTAGE (V) 623345 G07 0.01 0.1 0.01 10 1 10 100 0.001 0.1 1 VS = 5V, 0V TA = –55°C TA = 125°C TA = 25°C TOTAL SUPPLY VOLTAGE (V) 0 OFFSET VOLTAGE (mV) 1.5 623345 G08 0.5 1 2 1.0 0.8 0.6 0.4 0.2 0 –0.2 –0.4 –0.6 –0.8 –1.0 2.5 3 3.5 4 4.5 5 TA = –55°C TA = 125°C TA = 25°C VCM = VS/2 POWER SUPPLY VOLTAGE (±V) 1.5 OUTPUT SHORT-CIRCUIT CURRENT (mA) 3.0 623345 GO9 2.0 2.5 3.5 80 60 40 20 0 –20 –40 –80 –60 4.0 4.5 5.0 TA = 125°C TA = –55°C TA = –55°C TA = 25°C SINKING SOURCING TA = 25°C TA = 125°C OUTPUT VOLTAGE (V) 0 INPUT VOLTAGE (mV) 1.5 623345 G10 0.5 1.0 2.0 2.5 2.0 1.5 1.0 0.5 0 –0.5 –1.0 –1.5 –2.0 –2.5 2.5 3.0 RL = 100 RL = 1k VS = 3V, 0V TA = 25°C OUTPUT VOLTAGE (V) 0 INPUT VOLTAGE (mV) 1.5 623345 G11 0.5 1 2 0 2.5 3 3.5 4 4.5 5 RL = 100 RL = 1k VS = 5V, 0V TA = 25°C 2.5 2.0 1.5 1.0 0.5 –0.5 –1.0 –1.5 –2.0 –2.5 OUTPUT VOLTAGE (V) –5 INPUT VOLTAGE (mV) –2 623345 G12 –4 –3 –1 0 0 1 2 3 4 5 RL = 100 RL = 1k VS = ±5V TA = 25°C 2.5 2.0 1.5 1.0 0.5 –0.5 –1.0 –1.5 –2.0 –2.5 OUTPUT CURRENT (mA) –90 OFFSET VOLTAGE (mV) 623345 G13 –60 –30 2.0 1.5 1.0 0.5 0 –0.5 –1.0 –1.5 –2.0 0 30 60 90 TA = –55°C TA = 125°C VS = ±5V TA = 25°C TIME AFTER POWER-UP (s) 0 CHANGE IN OFFSET VOLTAGE (μV) 20 623345 G14 10 30 40 35 30 25 20 15 10 0 40 50 TA = 25°C VS = ±5V VS = ±2.5V VS = ±1.5V TOTAL SOURCE RESISTANCE ( ) 1 TOTAL NOISE (nV/ Hz) 10 10 1k 10k 100k 623345 G15 0.1 100 100 VS = ±2.5V VCM = 0V f = 100kHz UNBALANCED SOURCE RESISTORS TOTAL NOISE RESISTOR NOISE AMPLIFIER NOISE VOLTAGE LT6233/LT6233-10 LT6234/LT6235 12 623345fc Typical Performance Characteristics Open-Loop Gain vs Frequency Gain Bandwidth and Phase Margin vs Supply Voltage Slew Rate vs Temperature Output Impedance vs Frequency Common Mode Rejection Ratio vs Frequency Channel Separation vs Frequency Noise Voltage and Unbalanced Noise Current vs Frequency 0.1Hz to 10Hz Output Voltage Noise Gain Bandwidth and Phase Margin vs Temperature (LT6233/LT6234/LT6235) FREQUENCY (Hz) NOISE VOLTAGE (nV/ Hz) 6 5 4 3 2 1 0 10 1k 10k 100k 623345 G16 100 VS = ±2.5V TA = 25°C VCM = 0V NOISE VOLTAGE NOISE CURRENT UNBALANCED NOISE CURRENT (pA/ Hz) 6 5 4 3 2 1 0 5s/DIV 623345 G17 100nV 100nV/DIV –100nV VS = ±2.5V TEMPERATURE (°C) –55 GAIN BANDWIDTH (MHz) 5 623345 G18 –25 35 90 80 70 60 40 50 PHASE MARGIN (DEG) 70 60 50 40 65 95 125 VS = ±5V VS = 3V, 0V VS = ±5V VS = 3V, 0V PHASE MARGIN GAIN BANDWIDTH CL = 5pF RL = 1k VCM = VS/2 FREQUENCY (Hz) GAIN (dB) 80 70 50 30 0 –10 60 40 10 20 –20 PHASE (DEG) 120 100 60 20 –60 80 40 –20 –40 0 –80 100k 10M 100M 1G 623345 G19 1M CL = 5pF RL = 1k VCM = VS/2 PHASE GAIN VS = ±5V VS = 3V, 0V V VS = ±5V S = 3V, 0V TOTAL SUPPLY VOLTAGE (V) 0 GAIN BANDWIDTH (MHz) 6 623345 G20 2 4 8 70 60 50 30 40 PHASE MARGIN (DEG) 80 70 60 50 40 10 12 14 PHASE MARGIN GAIN BANDWIDTH TA = 25°C CL = 5pF RL = 1k TEMPERATURE (°C) –55 SLEW RATE (V/μs) 5 623345 G21 –35 –15 45 20 22 24 26 18 16 14 10 12 25 65 85 105 125 VS = ±5V FALLING VS = ±2.5V RISING AV = –1 RF = RG = 1k VS = ±2.5V FALLING VS = ±5V RISING FREQUENCY (Hz) 1 OUTPUT IMPEDANCE ( ) 10 100k 10M 100M 623345 G22 0.1 1M 1k 100 VS = 5V, 0V AV = 10 AV = 1 AV = 2 FREQUENCY (Hz) 20 COMMON MODE REJECTION RATIO (dB) 40 60 80 120 100 10k 100k 10M 100M 1G 623345 G23 0 1M VS = 5V, 0V VCM = VS/2 FREQUENCY (Hz) 100k CHANNEL SEPARATION (dB) –40 –50 –60 –70 –80 –90 –100 –110 –120 –130 –140 1M 10M 100M 623345 G24 AV = 1 TA = 25°C VS = ±5V 13 623345fc LT6233/LT6233-10 LT6234/LT6235 Typical Performance Characteristics Settling Time vs Output Step (Noninverting) Settling Time vs Output Step (Inverting) Maximum Undistorted Output Signal vs Frequency Distortion vs Frequency Distortion vs Frequency Distortion vs Frequency Power Supply Rejection Ratio vs Frequency Series Output Resistance and Overshoot vs Capacitive Load Series Output Resistance and Overshoot vs Capacitive Load (LT6233/LT6234/LT6235) FREQUENCY (Hz) 20 POWER SUPPLY REJECTION RATIO (dB) 40 60 80 120 100 1k 10k 100k 10M 100M 623345 G25 0 1M VS = 5V, 0V TA = 25°C VCM = VS/2 NEGATIVE SUPPLY POSITIVE SUPPLY CAPACITIVE LOAD (pF) 10 OVERSHOOT (%) 50 45 40 35 30 25 20 15 10 5 0 100 1000 623345 G26 VS = 5V, 0V AV = 1 RS = 10 RS = 20 RS = 50 RL = 50 CAPACITIVE LOAD (pF) 10 OVERSHOOT (%) 50 45 40 35 30 25 20 15 10 5 0 100 1000 623345 G27 VS = 5V, 0V AV = 2 RS = 10 RS = 20 RS = 50 RL = 50 OUTPUT STEP (V) –4 SETTLING TIME (ns) 0 623345 G28 –3 –2 –1 1 300 400 350 250 200 150 50 100 2 3 4 1mV 10mV 1mV 10mV VS = ±5V TA = 25°C AV = 1 + – 500 VOUT VIN OUTPUT STEP (V) –4 SETTLING TIME (ns) 0 623345 G29 –3 –2 –1 1 300 400 350 250 200 150 50 100 2 3 4 1mV 10mV 1mV 10mV VS = ±5V TA = 25°C AV = –1 + – 500 500 VOUT VIN FREQUENCY (Hz) 10k OUTPUT VOLTAGE SWING (VP-P) 10 9 8 7 6 5 4 3 2 100k 1M 10M 623345 G30 VS = ±5V TA = 25°C HD2, HD3 < –40dBc AV = –1 AV = 2 FREQUENCY (Hz) 10k DISTORTION (dBc) –40 –50 –60 –70 –80 –90 –100 100k 1M 10M 623345 G31 VS = ±2.5V AV = 1 VOUT = 2VP-P RL = 100 , 3RD RL = 1k, 3RD RL = 1k, 2ND RL = 100 , 2ND FREQUENCY (Hz) 10k DISTORTION (dBc) – 40 –50 –60 –70 –80 –90 –100 100k 1M 10M 623345 G32 VS = ±5V AV = 1 VOUT = 2VP-P RL = 100 , 3RD RL = 1k, 3RD RL = 1k, 2ND RL = 100 , 2ND FREQUENCY (Hz) 10k DISTORTION (dBc) –30 –40 –50 –60 –70 –80 –90 –100 100k 1M 10M 623345 G33 VS = ±2.5V AV = 2 VOUT = 2VP-P RL = 100 , 3RD RL = 1k, 3RD RL = 1k, 2ND RL = 100 , 2ND LT6233/LT6233-10 LT6234/LT6235 14 623345fc Typical Performance Characteristics Distortion vs Frequency Large-Signal Response Small-Signal Response (LT6233/LT6234/LT6235) Large-Signal Response Output Overdrive Recovery (LT6233) ENABLE Characteristics Supply Current vs ENABLE Pin Voltage ENABLE Pin Current vs ENABLE Pin Voltage ENABLE Pin Response Time FREQUENCY (Hz) 10k DISTORTION (dBc) –30 –40 –50 –60 –70 –80 –90 –100 100k 1M 10M 623345 G34 VS = ±5V AV = 2 VOUT = 2VP-P RL = 100 , 3RD RL = 1k, 3RD RL = 1k, 2ND RL = 100 , 2ND 2V 0V –2V 200ns/DIV 623345 G35 VS = ±2.5V AV = –1 RL = 1k 1V/DIV 0V 200ns/DIV 623345 G36 VS = ±2.5V AV = 1 RL = 1k 50mV/DIV 0V 5V –5V 200ns/DIV 623345 G37 VS = ±5V AV = 1 RL = 1k 2V/DIV 0V 0V 200ns/DIV 623345 G38 VS = ±2.5V AV = 3 VIN 1V/DIV VOUT 2V/DIV PIN VOLTAGE (V) SUPPLY CURRENT (mA) –1.0 623345 G39 –2.0 0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 1.0 2.0 TA = 125°C VS = ±2.5V TA = 25°C TA = –55°C PIN VOLTAGE (V) ENABLE PIN CURRENT (μA) 623345 G40 35 30 25 20 15 10 5 0 TA = 125°C VS = ±2.5V AV = 1 TA = 25°C TA = –55°C –2.0 –1.0 0 1.0 2.0 0V 5V 0.5V 0V 200μs/DIV 623345 G41 VS = ±2.5V VIN = 0.5V AV = 1 RL = 1k VOUT ENABLE 15 623345fc LT6233/LT6233-10 LT6234/LT6235 Typical Performance Characteristics Open-Loop Gain and Phase vs Frequency Gain Bandwidth and Phase Margin vs Supply Voltage Gain Bandwidth vs Resistor Load Common Mode Rejection Ratio vs Frequency Maximum Undistorted Output vs Frequency 2nd and 3rd Harmonic Distortion vs Frequency Gain Bandwidth and Phase Margin vs Temperature Slew Rate vs Temperature Series Output Resistor and Overshoot vs Capacitive Load (LT6233-10) TEMPERATURE (°C) –50 GAIN BANDWIDTH (MHz) 25 623345 G42 –25 0 50 450 400 350 300 200 250 PHASE MARGIN (DEG) 70 60 50 40 75 100 125 VS = ±5V VS = 3V, 0V VS = ±5V VS = 3V, 0V PHASE MARGIN GAIN BANDWIDTH AV = 10 TEMPERATURE (°C) –55 SLEW RATE (V/μs) 5 623345 G43 –35 –15 45 140 160 180 200 120 100 60 0 20 80 40 25 65 85 105 125 VS = ±5V FALLING VS = ±2.5V RISING AV = –10 RF = 1k RG = 100 VS = ±2.5V FALLING VS = ±5V RISING CAPACITIVE LOAD (pF) 10 OVERSHOOT (%) 70 60 50 40 30 20 10 0 100 1000 10000 623345 G44 VS = 5V, 0V AV = 10 RS = 10 RS = 20 RS = 50 FREQUENCY (Hz) GAIN (dB) 80 70 60 50 40 30 20 10 0 –10 –20 PHASE (DEG) 120 100 80 60 40 20 0 –20 –40 –60 –80 100k 10M 100M 1G 623345 G45 1M AV = 10 CL = 5pF RL = 1k VCM = VS/2 VS = 3V, 0V VS = ±5V PHASE GAIN VS = ±5V VS = 3V, 0V TOTAL SUPPLY VOLTAGE (V) 0 GAIN BANDWIDTH (MHz) 6 623345 G46 2 4 8 450 375 300 225 PHASE MARGIN (DEG) 100 50 0 10 12 PHASE MARGIN GAIN BANDWIDTH TA = 25°C AV = 10 CL = 5pF RL = 1k TOTAL RESISTOR LOAD ( ) (INCLUDES FEEDBACK R) 0 GAIN BANDWIDTH (MHz) 600 623345 G47 200 400 800 400 350 300 200 150 100 50 0 250 1000 AVSV = 1±05V TA = 25°C RF = 1k RG = 100 FREQUENCY (Hz) 20 COMMON MODE REJECTION RATIO (dB) 40 60 80 120 100 10k 100k 10M 100M 1G 623345 G48 0 1M VS = 5V, 0V VCM = VS/2 FREQUENCY (Hz) 10k OUTPUT VOLTAGE SWING (VP-P) 10 9 8 7 6 5 4 3 2 1 0 100k 1M 10M 623345 G49 VS = ±5V TA = 25°C AV = 10 HD2, HD3 40dBc FREQUENCY (Hz) 10k DISTORTION (dBc) –30 –40 –50 –60 –70 –80 –90 –100 100k 1M 10M 623345 G50 VS = ±2.5V AV = 10 VOUT = 2VP-P RL = 100 , 3RD RL = 100 , 2ND RL = 1k, 3RD RL = 1k, 2ND LT6233/LT6233-10 LT6234/LT6235 16 623345fc Typical Performance Characteristics 2nd and 3rd Harmonic Distortion vs Frequency Large-Signal Response Output-Overload Recovery (LT6233-10) Small-Signal Response Input Referred High Frequency Noise Spectrum FREQUENCY (Hz) 10k DISTORTION (dBc) –30 –40 –50 –60 –70 –80 –90 –100 100k 1M 10M 623345 G51 VS = ±5V AV = 10 VOUT = 2VP-P RL = 100 , 3RD RL = 100 , 2ND RL = 1k, 3RD RL = 1k, 2ND 0V 100ns/DIV 623345 G52 VS = ±5V AV = 10 RF = 900 RG = 100 VOUT 2V/DIV 0V 100ns/DIV 623345 G53 VS = 5V, 0V AV = 10 RF = 900 RG = 100 VOUT 2V/DIV 0V VIN 0.5V/DIV 2.5V 100ns/DIV 623345 G54 VS = 5V, 0V AV = 10 RF = 900 RG = 100 VOUT 100mV/DIV 10 0 2MHz/DIV 623345 G55 100kHz 20MHz 1nV/ Hz/DIV 17 623345fc LT6233/LT6233-10 LT6234/LT6235 Applications Information Figure 1. Simplified Schematic Figure 2. VS = ±2.5V, AV = 1 with Large Overdrive ENABLE DESD6 DESD5 –V +V +VIN –VIN +V 623345 F01 BIAS DIFFERENTIAL DRIVE GENERATOR VOUT +V CM I1 –V DESD3 –V –V DESD4 +V DESD1 –V DESD2 +V D1 C1 D2 Q5 Q6 Q4 Q2 Q3 Q1 2.5V –2.5V 0V 500μs/DIV 623345 F02 1V/DIV Amplifier Characteristics Figure 1 is a simplified schematic of the LT6233/LT6234/ LT6235, which has a pair of low noise input transistors Q1 and Q2. A simple current mirror Q3/Q4 converts the differential signal to a single-ended output, and these transistors are degenerated to reduce their contribution to the overall noise. Capacitor C1 reduces the unity-cross frequency and improves the frequency stability without degrading the gain bandwidth of the amplifier. Capacitor CM sets the overall amplifier gain bandwidth. The differential drive generator supplies current to transistors Q5 and Q6 that swing the output from rail-to-rail. Input Protection There are back-to-back diodes, D1 and D2 across the + and – inputs of these amplifiers to limit the differential input voltage to ±0.7V. The inputs of the LT6233/LT6234/LT6235 do not have internal resistors in series with the input transistors. This technique is often used to protect the input devices from overvoltage that causes excessive current to flow. The addition of these resistors would significantly degrade the low noise voltage of these amplifiers. For instance, a 100Ω resistor in series with each input would generate 1.8nV/√Hz of noise, and the total amplifier noise voltage would rise from 1.9nV/√Hz to 2.6nV/√Hz. Once the input differential voltage exceeds ±0.7V, steady-state current conducted through the protection diodes should be limited to ±40mA. This implies 25Ω of protection resistance is necessary per volt of overdrive beyond ±0.7V. These input diodes are rugged enough to handle transient currents due to amplifier slew rate overdrive and clipping without protection resistors. The photo of Figure 2 shows the output response to an input overdrive with the amplifier connected as a voltage follower. With the input signal low, current source I1 saturates and the differential drive generator drives Q6 into saturation so the output voltage swings all the way to V–. The input can swing positive until transistor Q2 saturates into current mirror Q3/Q4. When saturation occurs, the output tries to phase invert, but diode D2 conducts current from the signal source to the output through the feedback connection. The output is clamped a diode drop below the input. In this photo, the input signal generator is limiting at about 20mA. LT6233/LT6233-10 LT6234/LT6235 18 623345fc Applications Information With the amplifier connected in a gain of AV ≥ 2, the output can invert with very heavy overdrive. To avoid this inversion, limit the input overdrive to 0.5V beyond the power supply rails. ESD The LT6233/LT6234/LT6235 have reverse-biased ESD protection diodes on all inputs and outputs as shown in Figure 1. If these pins are forced beyond either supply, unlimited current will flow through these diodes. If the current is transient and limited to one hundred milliamps or less, no damage to the device will occur. Noise The noise voltage of the LT6233/LT6234/LT6235 is equivalent to that of a 225Ω resistor, and for the lowest possible noise it is desirable to keep the source and feedback resistance at or below this value, i.e., RS + RG||RFB ≤ 225Ω. With RS + RG||RFB = 225Ω the total noise of the amplifier is: eN = √(1.9nV)2 + (1.9nV)2 = 2.69nV/√Hz Below this resistance value, the amplifier dominates the noise, but in the region between 225Ω and about 30k, the noise is dominated by the resistor thermal noise. As the total resistance is further increased beyond 30k, the amplifier noise current multiplied by the total resistance eventually dominates the noise. The product of eN • √ISUPPLY is an interesting way to gauge low noise amplifiers. Most low noise amplifiers with low eN have high ISUPPLY current. In applications that require low noise voltage with the lowest possible supply current, this product can prove to be enlightening. The LT6233/LT6234/LT6235 have an eN • √ISUPPLY product of only 2.1 per amplifier, yet it is common to see amplifiers with similar noise specifications to have eN • √ISUPPLY as high as 13.5. For a complete discussion of amplifier noise, see the LT1028 data sheet. Enable Pin The LT6233 and LT6233-10 include an ENABLE pin that shuts down the amplifier to 10μA maximum supply current. The ENABLE pin must be driven low to operate the amplifier with normal supply current. The ENABLE pin must be driven high to within 0.35V of V+ to shut down the supply current. This can be accomplished with simple gate logic; however care must be taken if the logic and the LT6233 operate from different supplies. If this is the case, then open-drain logic can be used with a pull-up resistor to ensure that the amplifier remains off. See Typical Performance Characteristics. The output leakage current when disabled is very low; however, current can flow into the input protection diodes D1 and D2 if the output voltage exceeds the input voltage by a diode drop. 19 623345fc LT6233/LT6233-10 LT6234/LT6235 Typical Applications Single Supply, Low Noise, Low Power, Bandpass Filter with Gain = 10 Frequency Response Plot of Bandpass Filter Low Power, Low Noise, Single Supply, Instrumentation Amplifier with Gain = 100 R2 732 R4 10k C3 0.1μF EN f0 = 1 = 1MHz C = C1,C2 R = R1 = R2 f0 = (732 )MHz, MAXIMUM f0 = 1MHz f–3dB = f0 AV = 20dB at f0 EN = 6μVRMS INPUT REFERRED IS = 1.5mA FOR V+ = 5V 623345 F03 0.1μF C2 47pF C1 1000pF R3 10k R1 732 VOUT V+ VIN 2πRC R 2.5 + – LT6233 FREQUENCY (Hz) 100k GAIN (dB) 23 3 –7 1M 10M 623345 F04 + – R14 2k EN U3 LT6233 VOUT = 100 (VIN2 – VIN1) GAIN = (R2 + 1) (R10) INPUT RESISTANCE = R5 = R6 f–3dB = 310Hz TO 2.5MHz EN = 10μVRMS INPUT REFERRED IS = 4.7mA FOR VS = 5V, 0V 623345 F05 C8 68pF C3 1μF R13 2k R10 511 R15 88.7 R16 88.7 R4 511 R3 30.9 R1 30.9 R2 511 VOUT VIN1 VIN2 V+ R1 R15 C9 68pF R12 511 + – EN U2 LT6233-10 V+ C1 1μF C2 2200pF + – EN U1 LT6233-10 V+ R5 511 R6 511 C4 10μF R1 = R3 R2 = R4 R10 = R12 R15 = R16 LT6233/LT6233-10 LT6234/LT6235 20 623345fc Package Description S6 Package 6-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1636) 1.50 – 1.75 (NOTE 4) 2.80 BSC 0.30 – 0.45 6 PLCS (NOTE 3) DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S6 TSOT-23 0302 2.90 BSC (NOTE 4) 0.95 BSC 1.90 BSC 0.80 – 0.90 1.00 MAX 0.01 – 0.10 0.20 BSC 0.30 – 0.50 REF PIN ONE ID NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3.85 MAX 0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 2.62 REF 1.4 MIN 1.22 REF 21 623345fc LT6233/LT6233-10 LT6234/LT6235 Package Description DD Package 8-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1698 Rev C) 3.00 ±0.10 (4 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ± 0.10 (2 SIDES) 0.75 ±0.05 R = 0.125 TYP 2.38 ±0.10 4 1 5 8 PIN 1 TOP MARK (NOTE 6) 0.200 REF 0.00 – 0.05 (DD8) DFN 0509 REV C 0.25 ± 0.05 2.38 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.65 ±0.05 2.10 ±0.05 (2 SIDES) 0.50 BSC 0.70 ±0.05 3.5 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC LT6233/LT6233-10 LT6234/LT6235 22 623345fc Package Description S8 Package 8-Lead Plastic Small Outline (Narrow .150 Inch) (Reference LTC DWG # 05-08-1610) .016 – .050 (0.406 – 1.270) .010 – .020 (0.254 – 0.508) × 45° 0°– 8° TYP .008 – .010 (0.203 – 0.254) SO8 0303 .053 – .069 (1.346 – 1.752) .014 – .019 (0.355 – 0.483) TYP .004 – .010 (0.101 – 0.254) .050 (1.270) BSC 1 2 3 4 .150 – .157 (3.810 – 3.988) NOTE 3 8 7 6 5 .189 – .197 (4.801 – 5.004) NOTE 3 .228 – .244 (5.791 – 6.197) .245 MIN .160 ±.005 RECOMMENDED SOLDER PAD LAYOUT .045 ±.005 .050 BSC .030 ±.005 TYP INCHES (MILLIMETERS) NOTE: 1. DIMENSIONS IN 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) GN Package 16-Lead Plastic SSOP (Narrow .150 Inch) (Reference LTC DWG # 05-08-1641) GN16 (SSOP) 0204 1 2 3 4 5 6 7 8 .229 – .244 (5.817 – 6.198) .150 – .157** (3.810 – 3.988) 16 15 14 13 .189 – .196* (4.801 – 4.978) 12 11 10 9 .016 – .050 (0.406 – 1.270) .015 ± .004 (0.38 ± 0.10) × 45° .007 – .0098 0° – 8° TYP (0.178 – 0.249) .0532 – .0688 (1.35 – 1.75) .008 – .012 (0.203 – 0.305) TYP .004 – .0098 (0.102 – 0.249) .0250 (0.635) BSC .009 (0.229) REF .254 MIN RECOMMENDED SOLDER PAD LAYOUT .150 – .165 .0165 ±.0015 .0250 BSC .045 ±.005 * DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE ** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE INCHES (MILLIMETERS) NOTE: 1. CONTROLLING DIMENSION: INCHES 2. DIMENSIONS ARE IN 3. DRAWING NOT TO SCALE 23 623345fc LT6233/LT6233-10 LT6234/LT6235 Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. Revision History REV DATE DESCRIPTION PAGE NUMBER C 1/11 Revised y-axis lable on curve G40 in Typical Performance Characteristics Updated ENABLE Pin section in Applications Information 14 18 (Revision history begins at Rev C) LT6233/LT6233-10 LT6234/LT6235 24 623345fc Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 2003 LT 0111 REV C • PRINTED IN USA Related Parts Typical Applications Low Power Avalanche Photodiode Transimpedance Amplifier IS = 1.2mA Photodiode Amplifier Time Domain Response PART NUMBER DESCRIPTION COMMENTS LT1028 Single, Ultralow Noise 50MHz Op Amp 0.85nV/√Hz LT1677 Single, Low Noise Rail-to-Rail Amplifier 3V Operation, 2.5mA, 4.5nV/√Hz, 60μV Max VOS LT1806/LT1807 Single/Dual, Low Noise 325MHz Rail-to-Rail Amplifier 2.5V Operation, 550μV Max VOS, 3.5nV/√Hz LT6200/LT6201 Single/Dual, Low Noise 165MHz 0.95nV√Hz, Rail-to-Rail Input and Output LT6202/LT6203/LT6204 Single/Dual/Quad, Low Noise, Rail-to-Rail Amplifier 1.9nV/√Hz, 3mA Max, 100MHz Gain Bandwidth The LT6233 is applied as a transimpedance amplifier with an I-to-V conversion gain of 10kΩ set by R1. The LT6233 is ideally suited to this application because of its low input offset voltage and current, and its low noise. This is because the 10k resistor has an inherent thermal noise of 13nV/√Hz or 1.3pA/√Hz at room temperature, while the LT6233 contributes only 2nV and 0.8pA/√Hz. So, with respect to both voltage and current noises, the LT6233 is actually quieter than the gain resistor. The circuit uses an avalanche photodiode with the cathode biased to approximately 200V. When light is incident on the photodiode, it induces a current IPD which flows into the amplifier circuit. The amplifier output falls negative to maintain balance at its inputs. The transfer function is therefore VOUT = –IPD • 10k. C1 ensures stability and good settling characteristics. Output offset was measured at better than 500μV, so low in part because R2 serves to cancel the DC effects of bias current. Output noise was measured at below 1mVP-P on a 20MHz measurement bandwidth, with C2 shunting R2’s thermal noise. As shown in the scope photo, the rise time is 45ns, indicating a signal bandwidth of 7.8MHz. + – R1 10k R2 10k C2 0.1μF 5V –5V ENABLE LT6233 200V BIAS ADVANCED PHOTONIX 012-70-62-541 WWW.ADVANCEDPHOTONIX.COM OUTPUT OFFSET = 500μV TYPICAL BANDWIDTH = 7.8MHz OUTPUT NOISE = 1mVP-P (20MHz MEASUREMENT BW) 623345 TA02a C1 2.7pF 100ns/DIV 623345 TA02b 50mV/DIV REV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. a AD8300 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999 FUNCTIONAL BLOCK DIAGRAM VDD VOUT GND CLR LD CS CLK SDI AD8300 12 12 12-BIT REF DAC DAC REGISTER EN SERIAL REGISTER +3 Volt, Serial Input Complete 12-Bit DAC FEATURES Complete 12-Bit DAC No External Components Single +3 Volt Operation 0.5 mV/Bit with 2.0475 V Full Scale 6 ms Output Voltage Settling Time Low Power: 3.6 mW Compact SO-8 1.5 mm Height Package APPLICATIONS Portable Communications Digitally Controlled Calibration Servo Controls PC Peripherals GENERAL DESCRIPTION The AD8300 is a complete 12-bit, voltage-output digital-toanalog converter designed to operate from a single +3 volt supply. Built using a CBCMOS process, this monolithic DAC offers the user low cost, and ease-of-use in single-supply +3 volt systems. Operation is guaranteed over the supply voltage range of +2.7 V to +5.5 V making this device ideal for battery operated applications. The 2.0475 V full-scale voltage output is laser trimmed to maintain accuracy over the operating temperature range of the device. The binary input data format provides an easy-to-use one-half-millivolt-per-bit software programmability. The voltage outputs are capable of sourcing 5 mA. A double buffered serial data interface offers high speed, threewire, DSP and microcontroller compatible inputs using data in (SDI), clock (CLK) and load strobe (LD) pins. A chip select (CS) pin simplifies connection of multiple DAC packages by enabling the clock input when active low. Additionally, a CLR input sets the output to zero scale at power on or upon user demand. The AD8300 is specified over the extended industrial (–40°C to +85°C) temperature range. AD8300s are available in plastic DIP, and low profile 1.5 mm height SO-8 surface mount packages. 3.0 2.8 2.0 0.01 0.1 1.0 10 2.6 2.4 2.2 OUTPUT LOAD CURRENT – mA MINIMUM SUPPLY VOLTAGE – Volts PROPER OPERATION WHEN VDD SUPPLY VOLTAGE ABOVE CURVE DVFS 1 LSB DATA = FFFH TA = +258C Figure 1. Minimum Supply Voltage vs. Load 1.00 0.75 –1.00 0 1024 2048 4096 0.50 3072 0.25 0.00 –0.25 –0.50 –0.75 DIGITAL INPUT CODE – Decimal INL LINEARITY ERROR – LSB VDD = +2.7V TA = –408C, +258C, +1258C = –408C = +258C = +1258C Figure 2. Linearity Error vs. Digital Code and Temperature –2– REV. A AD8300–SPECIFICATIONS +3 V OPERATION Parameter Symbol Condition Min Typ Max Units STATIC PERFORMANCE Resolution N [Note 1] 12 Bits Relative Accuracy INL –2 ±1/2 +2 LSB Differential Nonlinearity2 DNL Monotonic –1 ±1/2 +1 LSB Zero-Scale Error VZSE Data = 000H +1/2 +3 mV Full-Scale Voltage3 VFS Data = FFFH 2.039 2.0475 2.056 Volts Full-Scale Tempco TCVFS [Notes 3, 4] 16 ppm/°C ANALOG OUTPUT Output Current (Source) IOUT Data = 800H, DVOUT = 5 LSB 5 mA Output Current (Sink) IOUT Data = 800H, DVOUT = 5 LSB 2 mA Load Regulation LREG RL = 200 W to ¥, Data = 800H 1.5 5 LSB Output Resistance to GND ROUT Data = 000H 30 W Capacitive Load CL No Oscillation4 500 pF LOGIC INPUTS Logic Input Low Voltage VIL 0.6 V Logic Input High Voltage VIH 2.1 V Input Leakage Current IIL 10 mA Input Capacitance CIL 10 pF INTERFACE TIMING SPECIFICATIONS4, 5 Clock Width High tCH 40 ns Clock Width Low tCL 40 ns Load Pulsewidth tLDW 50 ns Data Setup tDS 15 ns Data Hold tDH 15 ns Clear Pulsewidth tCLRW 40 ns Load Setup tLD1 15 ns Load Hold tLD2 40 ns Select tCSS 40 ns Deselect tCSH 40 ns AC CHARACTERISTICS4 Voltage Output Settling Time tS To ±0.2% of Full Scale 7 ms To ±1 LSB of Final Value6 14 ms Output Slew Rate SR Data = 000H to FFFH to 000H 2.0 V/ms DAC Glitch 15 nV/s Digital Feedthrough 15 nV/s SUPPLY CHARACTERISTICS Power Supply Range VDD RANGE DNL < ±1 LSB 2.7 5.5 V Positive Supply Current IDD VDD = 3 V, VIL = 0 V, Data = 000H 1.2 1.7 mA VDD = 3.6 V, VIH = 2.3 V, Data = FFFH 1.9 3.0 mA Power Dissipation PDISS VDD = 3 V, VIL = 0 V, Data = 000H 3.6 5.1 mW Power Supply Sensitivity PSS DVDD = ±5% 0.001 0.005 %/% NOTES 1LSB = 0.5 mV for 0 V to +2.0475 V output range. 2The first two codes (000H, 001H) are excluded from the linearity error measurement. 3Includes internal voltage reference error. 4These parameters are guaranteed by design and not subject to production testing. 5All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of 1.6 V. 6The settling time specification does not apply for negative going transitions within the last 6 LSBs of ground. Some devices exhibit double the typical settling time in this 6 LSB region. Specifications subject to change without notice. (@ VDD = +5 V 6 10%, –408C £ TA £ +858C, unless otherwise noted) REV. A –3– AD8300 +5 V OPERATION Parameter Symbol Condition Min Typ Max Units STATIC PERFORMANCE Resolution N [Note 1] 12 Bits Relative Accuracy INL –2 ±1/2 +2 LSB Differential Nonlinearity2 DNL Monotonic –1 ±1/2 +1 LSB Zero-Scale Error VZSE Data = 000H +1/2 +3 mV Full-Scale Voltage3 VFS Data = FFFH 2.039 2.0475 2.056 Volts Full-Scale Tempco TCVFS [Notes 3, 4] 16 ppm/°C ANALOG OUTPUT Output Current (Source) IOUT Data = 800H, DVOUT = 5 LSB 5 mA Output Current (Sink) IOUT Data = 800H, DVOUT = 5 LSB 2 mA Load Regulation LREG RL = 200 W to ¥, Data = 800H 1.5 5 LSB Output Resistance to GND ROUT Data = 000H 30 W Capacitive Load CL No Oscillation4 500 pF LOGIC INPUTS Logic Input Low Voltage VIL 0.8 V Logic Input High Voltage VIH 2.4 V Input Leakage Current IIL 10 mA Input Capacitance CIL 10 pF INTERFACE TIMING SPECIFICATIONS4, 5 Clock Width High tCH 30 ns Clock Width Low tCL 30 ns Load Pulsewidth tLDW 30 ns Data Setup tDS 15 ns Data Hold tDH 15 ns Clear Pulsewidth tCLWR 30 ns Load Setup tLD1 15 ns Load Hold tLD2 30 ns Select tCSS 30 ns Deselect tCSH 30 ns AC CHARACTERISTICS4 Voltage Output Settling Time tS To ±0.2% of Full Scale 6 ms To ±1 LSB of Final Value6 13 ms Output Slew Rate SR Data = 000H to FFFH to 000H 2.2 V/ms DAC Glitch 15 nV/s Digital Feedthrough 15 nV/s SUPPLY CHARACTERISTICS Power Supply Range VDD RANGE DNL < ±1 LSB 2.7 5.5 V Positive Supply Current IDD VDD = 5 V, VIL = 0 V, Data = 000H 1.2 1.7 mA VDD = 5.5 V, VIH = 2.3 V, Data = FFFH 2.8 4.0 mA Power Dissipation PDISS VDD = 5 V, VIL = 0 V, Data = 000H 6 5.1 mW Power Supply Sensitivity PSS DVDD = ±10% 0.001 0.006 %/% NOTES 11 LSB = 0.5 mV for 0 V to +2.0475 V output range. 2The first two codes (000H, 001H) are excluded from the linearity error measurement. 3Includes internal voltage reference error. 4These parameters are guaranteed by design and not subject to production testing. 5All input control signals are specified with tR = tF = 2 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V. 6The settling time specification does not apply for negative going transitions within the last 6 LSBs of ground. Some devices exhibit double the typical settling time in this 6 LSB region. Specifications subject to change without notice. (@ VDD = +5 V 6 10%, –408C £ TA £ +858C, unless otherwise noted) REV. A AD8300 –4– CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8300 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ABSOLUTE MAXIMUM RATINGS* VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V Logic Inputs to GND . . . . . . . . . . . . . . . . . . . . . –0.3 V, +7 V VOUT to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . 50 mA Package Power Dissipation . . . . . . . . . . . . . (TJ Max – TA)/qJA Thermal Resistance qJA 8-Lead Plastic DIP Package (N-8) . . . . . . . . . . . . . 103°C/W 8-Lead SOIC Package (SO-8) . . . . . . . . . . . . . . . . 158°C/W Maximum Junction Temperature (TJ Max) . . . . . . . . . . 150°C Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . . +300°C *Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PIN CONFIGURATIONS SO-8 Plastic DIP 1 2 3 4 TOP VIEW (Not to Scale) 8 7 6 5 AD8300 VDD CS CLK SDI VOUT GND LD CLR 1 4 8 5 ORDERING GUIDE Package Package Model INL Temp Description Options AD8300AN ±2 XIND 8-Lead P-DIP N-8 AD8300AR ±2 XIND 8-Lead SOIC SO-8 NOTES XIND = –40°C to +85°C. The AD8300 contains 630 transistors. The die size measures 72 mil ´ 65 mil. PIN DESCRIPTIONS Pin # Name Function 1 VDD Positive power supply input. Specified range of operation +2.7 V to +5.5 V. 2 CS Chip Select, active low input. Disables shift register loading when high. Does not affect LD operation. 3 CLK Clock input, positive edge clocks data into shift register. 4 SDI Serial Data Input, input data loads directly into the shift register, MSB first. 5 LD Load DAC register strobes, active low. Transfers shift register data to DAC register. See Truth Table I for operation. Asynchronous active low input. 6 CLR Resets DAC register to zero condition. Asynchronous active low input. 7 GND Analog and Digital Ground. 8 VOUT DAC voltage output, 2.0475 V full scale with 0.5 mV per bit. An internal temperature stabilized reference maintains a fixed full-scale voltage independent of time, temperature and power supply variations. SDI D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 tCSS tLD1 tCSH tLD2 CLK CS LD SDI CLK CLR LD 61LSB ERROR BAND FS ZS tDS tDH tCL tCH tLDW tS tCLRW tS VOUT Figure 3. Timing Diagram REV. A AD8300 –5– 2.5 2.0 0 0 1 4 5 6 0.5 1.0 1.5 2 3 VDD SUPPLY VOLTAGE – Volts LOGIC THRESHOLD VOLTAGE TA = –40 TO +858C Figure 5. Logic Input Threshold Voltage vs. VDD 50 45 0 10 100 10k 100k 1M 40 35 30 25 20 15 10 5 1k FREQUENCY – Hz POWER SUPPLY REJECTION – dB VDD = +3V 610% VDD = +5V 610% TA = +258C DATA = FFFH Figure 8. Power Supply Rejection vs. Frequency CODE 800H TO 7FFH Figure 11. Midscale Transition Performance 80 40 –80 0 1 2 –40 0 60 20 –60 –20 OUTPUT VOLTAGE – Volts OUTPUT CURRENT – mA VDD = +3V VDD = +5V VDD = +3V POSITIVE VDD = +5V CURRENT LIMIT NEGATIVE CURRENT LIMIT DATA = 800H RL TIED TO +1.024V Figure 4. IOUT vs. VOUT TIME = 100ms/DIV BROADBAND NOISE – 200mV/DIV Figure 7. Broadband Noise 3.5 3.0 0 0 1 3 4 5 1.5 2.5 2.0 2 LOGIC VOLTAGE – Volts SUPPLY CURRENT – mA VDD = +5V VDD = +3V TA = +258C DATA = FFFH 1.0 0.5 Figure 10. Supply Current vs. Logic Input Voltage HORIZONTAL = 1ms/DIV Figure 6. Detail Settling Time HORIZONTAL = 20ms/DIV Figure 9. Large Signal Settling Time 0.5ms/DIV Figure 12. Digital Feedthrough vs. Time Typical Performance Characteristics– REV. A AD8300 –6– 1.5 1.0 –1.5 –55 –35 –15 5 25 45 65 85 105 125 0.5 0 –0.5 –1.0 VOUT DRIFT – mV TEMPERATURE – 8C VDD = +2.7V VDD = +5V NO LOAD ss = 300 UNITS NORMALIZED TO +258C Figure 14. Zero-Scale Voltage Drift vs. Temperature 10 1 0.01 1 10 100 1k 10k 100k 0.1 FREQUENCY – Hz NOISE DENSITY – mV/Hz VDD = +3V DATA = FFFH Figure 17. Output Voltage Noise Density vs. Frequency 2.4 2.0 0 0 100 200 300 500 600 0.8 1.2 1.6 0.4 400 HOURS OF OPERATION AT +1508C NOMINAL VOLTAGE CHANGE – mV FULL SCALE (DATA = FFFH) ZERO SCALE (DATA = 000H) VDD = +2.7V ss = 135 UNITS Figure 19. Long Term Drift Accelerated by Burn-In 60 50 0 10 30 40 20 –1 0 1 2 3 4 5 6 TOTAL UNADJUSTED ERROR – mV FREQUENCY TUE = SINL+ZS+FS ss = 300 UNITS VDD = +3V TA = +258C Figure 13. Total Unadjusted Error Histogram 1.5 1.0 –1.5 –55 –35 –15 5 25 45 65 85 105 125 0.5 0 –0.5 –1.0 VOUT DRIFT – mV TEMPERATURE – 8C VDD = +2.7V VDD = +5.5V NO LOAD ss = 300 UNITS NORMALIZED TO +258C Figure 16. Full-Scale Voltage Drift vs. Temperature 3.0 1.0 –60 –20 20 60 100 140 2.2 2.6 1.8 TEMPERATURE – 8C IDD SUPPLY CURRENT – mA DATA = FFFH VIH = +2.4V VIL = 0V VDD = +5.5V VDD = +5.0V 1.4 VDD = +4.5V VDD = +2.7, 3.0, 3.3V Figure 15. Supply Current vs. Temperature 70 60 0 –50 –40 –20 –10 40 50 –30 40 30 20 10 0 10 20 30 TEMPERATURE COEFFICIENT – ppm/8C FREQUENCY VDD = +3V DATA FFFH TA = –40 TO +858C Figure 18. Full-Scale Output Tempco Histogram REV. A AD8300 –7– Table I. Control Logic Truth Table CS CLK CLR LD Serial Shift Register Function DAC Register Function H X H H No Effect Latched L L H H No Effect Latched L H H H No Effect Latched L H H Shift-Register-Data Advanced One Bit Latched L H H No Effect Latched H X H ¯ No Effect Updated with Current Shift Register Contents H X H L No Effect Transparent H X L X No Effect Loaded with All Zeros H X H No Effect Latched All Zeros NOTES 1. = Positive Logic Transition; ¯ = Negative Logic Transition; X = Don’t Care. 2. Do not clock in serial data while LD is LOW. 3. Data loads MSB first. OPERATION The AD8300 is a complete ready to use 12-bit digital-to-analog converter. Only one +3 V power supply is necessary for operation. It contains a 12-bit laser-trimmed digital-to-analog converter, a curvature-corrected bandgap reference, rail-to-rail output op amp, serial-input register, and DAC register. The serial data interface consists of a serial-data-input (SDI) clock (CLK), and load strobe pins (LD) with an active low CS strobe. In addition an asynchronous CLR pin will set all DAC register bits to zero causing the VOUT to become zero volts. This function is useful for power on reset or system failure recovery to a known state. D/A CONVERTER SECTION The internal DAC is a 12-bit device with an output that swings from GND potential to 0.4 volt generated from the internal bandgap voltage, see Figure 20. It uses a laser-trimmed segmented R-2R ladder which is switched by N-channel MOSFETs. The output voltage of the DAC has a constant resistance independent of digital input code. The DAC output is internally connected to the rail-to-rail output op amp. AMPLIFIER SECTION The internal DAC’s output is buffered by a low power consumption precision amplifier. This low power amplifier contains a differential PNP pair input stage that provides low offset voltage and low noise, as well as the ability to amplify the zero-scale DAC output voltages. The rail-to-rail amplifier is configured with a gain of approximately five in order to set the 2.0475 volt full-scale output (0.5 mV/LSB). See Figure 20 for an equivalent circuit schematic of the analog section. 12-BIT DAC R1 R2 VOUT 2.047V FS 1.2V 0.4V 0.4V FS BANDGAP REF Figure 20. Equivalent AD8300 Schematic of Analog Portion The op amp has a 2 ms typical settling time to 0.4% of full scale. There are slight differences in settling time for negative slewing signals versus positive. Also negative transition settling time to within the last 6 LSB of zero volts has an extended settling time. See the oscilloscope photos in the typical performances section of this data sheet. OUTPUT SECTION The rail-to-rail output stage of this amplifier has been designed to provide precision performance while operating near either power supply. Figure 21 shows an equivalent output schematic of the rail-to-rail amplifier with its N-channel pull-down FETs that will pull an output load directly to GND. The output sourcing current is provided by a P-channel pull-up device that can source current to GND terminated loads. P-CH N-CH VDD VOUT AGND Figure 21. Equivalent Analog Output Circuit The rail-to-rail output stage achieves the minimum operating supply voltage capability shown in Figure 2. The N-channel output pull-down MOSFET shown in Figure 21 has a 35 W on resistance which sets the sink current capability near ground. In addition to resistive load driving capability, the amplifier has also been carefully designed and characterized for up to 500 pF capacitive load driving capability. REFERENCE SECTION The internal curvature-corrected bandgap voltage reference is laser trimmed for both initial accuracy and low temperature coefficient. Figure 18 provides a histogram of total output performance of full-scale vs. temperature which is dominated by the reference performance. POWER SUPPLY The very low power consumption of the AD8300 is a direct result of a circuit design optimizing use of a CBCMOS process. By using the low power characteristics of the CMOS for the logic, and the low noise, tight matching of the complementary bipolar transistors, good analog accuracy is achieved. For power-consumption sensitive applications it is important to note that the internal power consumption of the AD8300 is strongly dependent on the actual logic input voltage levels present on the SDI, CLK, CS, LD, and CLR pins. Since these inputs are standard CMOS logic structures, they contribute static power dissipation dependent on the actual driving logic REV. A AD8300 –8– PRINTED IN U.S.A. C1968a–0–5/99 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 8-Lead SOIC (SO-8) 8 5 1 4 0.1968 (5.00) 0.1890 (4.80) 0.2440 (6.20) 0.2284 (5.80) PIN 1 0.1574 (4.00) 0.1497 (3.80) 0.0500 (1.27) BSC 0.0688 (1.75) 0.0532 (1.35) SEATING PLANE 0.0098 (0.25) 0.0040 (0.10) 0.0192 (0.49) 0.0138 (0.35) 0.0098 (0.25) 0.0075 (0.19) 0.0500 (1.27) 0.0160 (0.41) 88 08 0.0196 (0.50) 0.0099 (0.25) 3 458 8-Lead Plastic DIP (N-8) SEATING PLANE 0.015 (0.381) 0.210 TYP (5.33) MAX 0.022 (0.558) 0.014 (0.356) 0.160 (4.06) 0.115 (2.93) 0.070 (1.77) 0.045 (1.15) 0.130 (3.30) MIN 8 1 4 5 PIN 1 0.280 (7.11) 0.240 (6.10) 0.100 (2.54) BSC 0.430 (10.92) 0.348 (8.84) 0.195 (4.95) 0.115 (2.93) 0.015 (0.381) 0.008 (0.204) 0.325 (8.25) 0.300 (7.62) 158 08 VOH and VOL voltage levels. Consequently, for optimum dissipation use of CMOS logic versus TTL provides minimal dissipation in the static state. A VINL = 0 V on the logic input pins provides the lowest standby dissipation of 1.2 mA with a +3.3 V power supply. As with any analog system, it is recommended that the AD8300 power supply be bypassed on the same PC card that contains the chip. Figure 8 shows the power supply rejection versus frequency performance. This should be taken into account when using higher frequency switched-mode power supplies with ripple frequencies of 100 kHz and higher. One advantage of the rail-to-rail output amplifiers used in the AD8300 is the wide range of usable supply voltage. The part is fully specified and tested over temperature for operation from +2.7 V to +5.5 V. If reduced linearity and source current capability near full scale can be tolerated, operation of the AD8300 is possible down to +2.1 volts. The minimum operating supply voltage versus load current plot in Figure 2 provides information for operation below VDD = +2.7 V. TIMING AND CONTROL The AD8300 has a separate serial-input register from the 12-bit DAC register that allows preloading of a new data value MSB first into the serial register without disturbing the present DAC output voltage value. Data can only be loaded when the CS pin is active low. After the new value is fully loaded in the serialinput register, it can be asynchronously transferred to the DAC register by strobing the LD pin. The DAC register uses a level sensitive LD strobe that should be returned high before any new data is loaded into the serial-input register. At any time the contents of the DAC resister can be reset to zero by strobing the CLR pin which causes the DAC output voltage to go to zero volts. All of the timing requirements are detailed in Figure 3 along with Table I. Control Logic Truth Table. All digital inputs are protected with a Zener type ESD protection structure (Figure 22) that allows logic input voltages to exceed the VDD supply voltage. This feature can be useful if the user is loading one or more of the digital inputs with a 5 V CMOS logic input voltage level while operating the AD8300 on a +3.3 V power supply. If this mode of interface is used, make sure that the VOL of the +5 V CMOS meets the VIL input requirement of the AD8300 operating at 3 V. See Figure 5 for the effect on digital logic input threshold versus operating VDD supply voltage. VDD LOGIC IN GND Figure 22. Equivalent Digital Input ESD Protection Unipolar Output Operation This is the basic mode of operation for the AD8300. The AD8300 has been designed to drive loads as low as 400 W in parallel with 500 pF. The code table for this operation is shown in Table II. APPLICATIONS INFORMATION See DAC8512 data sheet for additional application circuit ideas. Table II. Unipolar Code Table Hexadecimal Decimal Number in Number in Analog Output DAC Register DAC Register Voltage (V) FFF 4095 +2.0475 801 2049 +1.0245 800 2048 +1.0240 7FF 2047 +1.0235 000 0 +0.0000 DATA RDS 80 Microprocessor-Controlled Digital 80 Watt Soldering Station The digital soldering station ERSA RDS 80, offers the established and proven ERSA Res istr onic heating technology with a generous 80 watts of power. With this unique temperature control technology, the ceramic PTC heating element (Positive Temperature Coefficient) replaces the function of the thermocouple. This guarantees very fast preheating due to high initial power and fast heat recovery for a stable soldering process. The very high heating power and the largest range of soldering tips allow for great flexibility in handling all applications. The heating system with interior heated soldering tips has the highest thermal efficiency. The newly constructed ergonomic handle, the new design of the housing, and the big digital multi-function display leave nothing to be desired! Precise temperatures can be selected between 150°C and 450°C (302°F - 842°F), and with a touch of a button, 3 fixed temperatures or 2 fixed temperatures and one stand-by temperature can be programmed and selected. I n addition, the station offers a power bar graph display, a calibration capability, and an automatic power-off function. Finally, the potential equalization jack (with integraded 220 kΩ resistor) allows the system to be grounded to the desired resistance of the working environment. Power, Precision, Comfort and Safety- the ERSA RDS 80 offers the best Bang for your Buck! The digital power soldering station with microprocessor control and fantastic price/performance ratio ! Fig.: Microprocessor-controlled digital power soldering station Fig.: Microprocessor-controlled digital power soldering station ERSA product range Soldering tools • Soldering / desoldering stations • SMD equipment • Hand soldering tools • Gas soldering irons • Solder baths • Special tools • Accessories BGA/SMT Rework I R Rework Center • IR/PL 550 A • IR/PL 650 A Hybrid Tool HR 100 A Inspection Systems • ERSASCOPE • ImageDoc Software Soldering Systems Wave soldering • ETS series • EWS series • N-Wave series • POWERFLOW series Reflow soldering • HOTFLOW series Selective soldering • Versaflow ersaflow ersaflow series Process Software • EPOS • CAD Assistant Paste Printing • VERSAPRINT series Accessories • Solder bar & wire • Solder paste • Flux Other Services • Know-how seminars • In-house training • Test soldering • Installation and main- tenance assistance • Process support DATA RDS 80 49263-0507 • subject to changes • © by ERSA Microprocessor-Controlled Digital 80 Watt Soldering Station 832 BD 832 YD 832 CD 832 ED 832 VD 832 GD 832 LD 832 MD 842 BD 842 YD 842 CD 842 ED Technical data: Electronic station RDS 803 Supply voltage: 230 V / 50 Hz Secondary voltage: 24 V ~ Power: 80 VA C ontrol technology: Res istr onic temperature regulation Temperature range: 150°C - 459°C 302°F - 842°F Temperature accuracy: 0°C after calibration Display resolution: 1°C / 1°F C able: 2 m PVC Fuse: 0.63 A delayed action Station dimensions: 110 x 105 x 147 mm (W x H x D) Permissible ambient temperature: 0 - 40°C / 32 - 104°F Weight: approx. 2 kg Soldering iron RT 80 with soldering tip 842 CD Voltage: 24 V ~ Power: 80 W at 350°C (662°F) Preheating power: 290 W Preheating time: approx. 40 s (to 280°C / 536°F) C able: 1.5 m PVC, Weight: approx. 130 g Holder RH 80 Weight: approx. 400 g Fig.: Soldering iron RT 80 with optional soldering tips Excerpt of 832/842 soldering tip series actual size Europe (Headquarters): ERSA GmbH Leonhard-Karl-Str. 24 97877 Wertheim / Germany Phone: +49 (0) 9342 / 800-0 Fax: +49 (0) 9342 / 800-127 e-mail: info@ersa.de www.ersa.com General Description The DS3231 is a low-cost, extremely accurate I2C realtime clock (RTC) with an integrated temperaturecompensated crystal oscillator (TCXO) and crystal. The device incorporates a battery input, and maintains accurate timekeeping when main power to the device is interrupted. The integration of the crystal resonator enhances the long-term accuracy of the device as well as reduces the piece-part count in a manufacturing line. The DS3231 is available in commercial and industrial temperature ranges, and is offered in a 16-pin, 300-mil SO package. The RTC maintains seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. Two programmable time-ofday alarms and a programmable square-wave output are provided. Address and data are transferred serially through an I2C bidirectional bus. A precision temperature-compensated voltage reference and comparator circuit monitors the status of VCC to detect power failures, to provide a reset output, and to automatically switch to the backup supply when necessary. Additionally, the RST pin is monitored as a pushbutton input for generating a reset externally. Applications Servers Utility Power Meters Telematics GPS Features ♦ Accuracy ±2ppm from 0°C to +40°C ♦ Accuracy ±3.5ppm from -40°C to +85°C ♦ Battery Backup Input for Continuous Timekeeping ♦ Operating Temperature Ranges Commercial: 0°C to +70°C Industrial: -40°C to +85°C ♦ Low-Power Consumption ♦ Real-Time Clock Counts Seconds, Minutes, Hours, Day, Date, Month, and Year with Leap Year Compensation Valid Up to 2100 ♦ Two Time-of-Day Alarms ♦ Programmable Square-Wave Output ♦ Fast (400kHz) I2C Interface ♦ 3.3V Operation ♦ Digital Temp Sensor Output: ±3°C Accuracy ♦ Register for Aging Trim ♦ RST Output/Pushbutton Reset Debounce Input ♦ Underwriters Laboratories (UL) Recognized DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal ______________________________________________ Maxim Integrated Products 1 Rev 5; 4/08 Ordering Information PART TEMP RANGE PIN-PACKAGE TOP MARK DS3231S 0°C to +70°C 16 SO DS3231 DS3231SN -40°C to +85°C 16 SO DS3231N DS3231S# 0°C to +70°C 16 SO DS3231S DS3231SN# -40°C to +85°C 16 SO DS3231SN Pin Configuration appears at end of data sheet. DS3231 VCC SCL RPU RPU = tR/CB RPU INT/SQW 32kHz VBAT PUSHBUTTON RESET SDA RST N.C. N.C. N.C. N.C. VCC VCC GND VCC CPU N.C. N.C. N.C. N.C. Typical Operating Circuit # Denotes a RoHS-compliant device that may include lead that is exempt under RoHS requirements. The lead finish is JESD97 category e3, and is compatible with both lead-based and leadfree soldering processes. A "#" anywhere on the top mark denotes a RoHS-compliant device. For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 2 _____________________________________________________________________ ABSOLUTE MAXIMUM RATINGS RECOMMENDED DC OPERATING CONDITIONS (TA = TMIN to TMAX, unless otherwise noted.) (Notes 1, 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Voltage Range on VCC, VBAT, 32kHz, SCL, SDA, RST, INT/SQW Relative to Ground.............................-0.3V to +6.0V Operating Temperature Range (noncondensing) .............................................-40°C to +85°C Junction Temperature......................................................+125°C Storage Temperature Range ...............................-40°C to +85°C Lead Temperature (Soldering, 10s).....................................................+260°C/10s Soldering Temperature....................................See the Handling, PC Board Layout, and Assembly section. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS VCC 2.3 3.3 5.5 V Supply Voltage VBAT 2.3 3.0 5.5 V Logic 1 Input SDA, SCL VIH 0.7 x VCC VCC + 0.3 V Logic 0 Input SDA, SCL VIL -0.3 +0.3 x VCC V Pullup Voltage (SDA, SCL, 32kHz, INT/SQW) VPU VCC = 0V 5.5V V ELECTRICAL CHARACTERISTICS (VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC = 3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS VCC = 3.63V 200 Active Supply Current ICCA (Notes 3, 4) VCC = 5.5V 300 μA VCC = 3.63V 110 Standby Supply Current ICCS I2C bus inactive, 32kHz output on, SQW output off (Note 4) VCC = 5.5V 170 μA VCC = 3.63V 575 Temperature Conversion Current ICCSCONV I2C bus inactive, 32kHz output on, SQW output off VCC = 5.5V 650 μA Power-Fail Voltage VPF 2.45 2.575 2.70 V Logic 0 Output, 32kHz, INT/SQW, SDA VOL IOL = 3mA 0.4 V Logic 0 Output, RST VOL IOL = 1mA 0.4 V Output Leakage Current 32kHz, INT/SQW, SDA ILO Output high impedance -1 0 +1 μA Input Leakage SCL ILI -1 +1 μA RST Pin I/O Leakage IOL RST high impedance (Note 5) -200 +10 μA VBAT Leakage Current (VCC Active) IBATLKG 25 100 nA DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal _____________________________________________________________________ 3 ELECTRICAL CHARACTERISTICS (continued) (VCC = 2.3V to 5.5V, VCC = Active Supply (see Table 1), TA = TMIN to TMAX, unless otherwise noted.) (Typical values are at VCC = 3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 1, 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Output Frequency fOUT VCC = 3.3V or VBAT = 3.3V 32.768 kHz Frequency Stability vs. 0°C to +40°C ±2 Temperature (Commercial) f/fOUT VCC = 3.3V or VBAT = 3.3V, aging offset = 00h >40°C to +70°C ±3.5 ppm -40°C to <0°C ±3.5 0°C to +40°C ±2 Frequency Stability vs. Temperature (Industrial) f/fOUT VCC = 3.3V or VBAT = 3.3V, aging offset = 00h >40°C to +85°C ±3.5 ppm Frequency Stability vs. Voltage f/V 1 ppm/V -40°C 0.7 +25°C 0.1 +70°C 0.4 Trim Register Frequency Sensitivity per LSB f/LSB Specified at: +85°C 0.8 ppm Temperature Accuracy Temp VCC = 3.3V or VBAT = 3.3V -3 +3 °C First year ±1.0 Crystal Aging f/fO After reflow, not production tested 0–10 years ±5.0 ppm ELECTRICAL CHARACTERISTICS (VCC = 0V, VBAT = 2.3V to 5.5V, TA = TMIN to TMAX, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS VBAT = 3.63V 70 Active Battery Current IBATA EOSC = 0, BBSQW = 0, SCL = 400kHz (Note 4) VBAT = 5.5V 150 μA VBAT = 3.63V 0.84 3.0 Timekeeping Battery Current IBATT EOSC = 0, BBSQW = 0, EN32kHz = 1, SCL = SDA = 0V or SCL = SDA = VBAT (Note 4) VBAT = 5.5V 1.0 3.5 μA VBAT = 3.63V 575 Temperature Conversion Current IBATTC EOSC = 0, BBSQW = 0, SCL = SDA = 0V or SCL = SDA = VBAT VBAT = 5.5V 650 μA Data-Retention Current IBATTDR EOSC = 1, SCL = SDA = 0V, +25°C 100 nA DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 4 _____________________________________________________________________ AC ELECTRICAL CHARACTERISTICS (VCC = VCC(MIN) to VCC(MAX) or VBAT = VBAT(MIN) to VBAT(MAX), VBAT > VCC, TA = TMIN to TMAX, unless otherwise noted.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Fast mode 100 400 SCL Clock Frequency fSCL Standard mode 0 100 kHz Bus Free Time Between STOP Fast mode 1.3 and START Conditions tBUF Standard mode 4.7 μs Hold Time (Repeated) START Fast mode 0.6 Condition (Note 6) tHD:STA Standard mode 4.0 μs Fast mode 1.3 Low Period of SCL Clock tLOW Standard mode 4.7 μs Fast mode 0.6 High Period of SCL Clock tHIGH Standard mode 4.0 μs Fast mode 0 0.9 Data Hold Time (Notes 7, 8) tHD:DAT Standard mode 0 0.9 μs Fast mode 100 Data Setup Time (Note 9) tSU:DAT Standard mode 250 ns Fast mode 0.6 START Setup Time tSU:STA Standard mode 4.7 μs Rise Time of Both SDA and SCL Fast mode 300 Signals (Note 10) tR Standard mode 20 + 0.1CB 1000 ns Fall Time of Both SDA and SCL Fast mode 300 Signals (Note 10) tF Standard mode 20 + 0.1CB 300 ns Fast mode 0.6 Setup Time for STOP Condition tSU:STO Standard mode 4.7 μs Capacitive Load for Each Bus Line (Note 10) CB 400 pF Capacitance for SDA, SCL CI/O 10 pF Pulse Width of Spikes That Must Be Suppressed by the Input Filter tSP 30 ns Pushbutton Debounce PBDB 250 ms Reset Active Time tRST 250 ms Oscillator Stop Flag (OSF) Delay tOSF (Note 11) 100 ms Temperature Conversion Time tCONV 125 200 ms POWER-SWITCH CHARACTERISTICS (TA = TMIN to TMAX) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS VCC Fall Time; VPF(MAX) to VPF(MIN) tVCCF 300 μs VCC Rise Time; VPF(MIN) to VPF(MAX) tVCCR 0 μs Recovery at Power-Up tREC (Note 12) 250 300 ms DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal _____________________________________________________________________ 5 Pushbutton Reset Timing PBDB tRST RST Power-Switch Timing VCC tVCCF tVCCR tREC VPF(MAX) VPF VPF VPF(MIN) RST DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 6 _____________________________________________________________________ Data Transfer on I2C Serial Bus SDA SCL tHD:STA tLOW tHIGH tR tF tBUF tHD:DAT tSU:DAT REPEATED START tSU:STA tHD:STA tSU:STO tSP STOP START WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may cause loss of data. Note 1: Limits at -40°C are guaranteed by design and not production tested. Note 2: All voltages are referenced to ground. Note 3: ICCA—SCL clocking at max frequency = 400kHz. Note 4: Current is the averaged input current, which includes the temperature conversion current. Note 5: The RST pin has an internal 50kΩ (nominal) pullup resistor to VCC. Note 6: After this period, the first clock pulse is generated. Note 7: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the VIH(MIN) of the SCL signal) to bridge the undefined region of the falling edge of SCL. Note 8: The maximum tHD:DAT needs only to be met if the device does not stretch the low period (tLOW) of the SCL signal. Note 9: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT ≥ 250ns must then be met. This is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line tR(MAX) + tSU:DAT = 1000 + 250 = 1250ns before the SCL line is released. Note 10: CB—total capacitance of one bus line in pF. Note 11: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of 0.0V ≤ VCC ≤ VCC(MAX) and 2.3V ≤ VBAT ≤ 3.4V. Note 12: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, tREC is bypassed and RST immediately goes high. The state of RST does not affect the I2C interface, RTC, or TCXO. DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal _____________________________________________________________________ 7 Typical Operating Characteristics (VCC = +3.3V, TA = +25°C, unless otherwise noted.) STANDBY SUPPLY CURRENT vs. SUPPLY VOLTAGE DS3231 toc01 VCC (V) ICCS (μA) 2.5 3.0 3.5 4.0 4.5 5.0 25 50 75 100 125 150 0 2.0 5.5 RST ACTIVE BSY = 0, SCL = SDA = VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE DS3231 toc02 VBAT (V) IBAT (μA) 3.3 4.3 5.3 0.7 0.8 0.9 1.0 1.1 1.2 0.6 2.3 VCC = 0V, BSY = 0, SDA = SCL = VBAT OR VCC EN32kHz = 1 EN32kHz = 0 SUPPLY CURRENT vs. TEMPERATURE DS3231 toc03 TEMPERATURE (°C) IBAT (μA) -15 10 35 60 0.7 0.8 0.9 1.0 0.6 -40 85 VCC = 0, EN32kHz = 1, BSY = 0, SDA = SCL = VBAT OR GND FREQUENCY DEVIATION vs. TEMPERATURE vs. AGING VALUE DS3231 toc04 TEMPERATURE (°C) FREQUENCY DEVIATION (ppm) -15 10 35 60 -30 -20 -10 0 10 20 30 40 50 60 -40 -40 85 127 32 0 -33 8 DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 8 _____________________________________________________________________ Block Diagram N N N RST VCC 32kHz INT/SQW CLOCK AND CALENDAR REGISTERS USER BUFFER (7 BYTES) I2C INTERFACE AND ADDRESS REGISTER DECODE POWER CONTROL VCC VBAT GND SCL SDA TEMPERATURE SENSOR CONTROL LOGIC/ DIVIDER PUSHBUTTON RESET; SQUARE-WAVE BUFFER; INT/SQW CONTROL CONTROL AND STATUS REGISTERS OSCILLATOR AND CAPACITOR ARRAY X1 X2 DS3231 DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal _____________________________________________________________________ 9 Pin Description PIN NAME FUNCTION 1 32kHz 32kHz Output. This open-drain pin requires an external pullup resistor. When enabled, the output operates on either power supply. It may be left open if not used. 2 VCC DC Power Pin for Primary Power Supply. This pin should be decoupled using a 0.1μF to 1.0μF capacitor. If not used, connect to ground. 3 INT/SQW Active-Low Interrupt or Square-Wave Output. This open-drain pin requires an external pullup resistor connected to a supply at 5.5V or less. It may be left open if not used. This multifunction pin is determined by the state of the INTCN bit in the Control Register (0Eh). When INTCN is set to logic 0, this pin outputs a square wave and its frequency is determined by RS2 and RS1 bits. When INTCN is set to logic 1, then a match between the timekeeping registers and either of the alarm registers activates the INT/SQW pin (if the alarm is enabled). Because the INTCN bit is set to logic 1 when power is first applied, the pin defaults to an interrupt output with alarms disabled. 4 RST Active-Low Reset. This pin is an open-drain input/output. It indicates the status of VCC relative to the VPF specification. As VCC falls below VPF, the RST pin is driven low. When VCC exceeds VPF, for tRST, the RST pin is pulled high by the internal pullup resistor. The active-low, open-drain output is combined with a debounced pushbutton input function. This pin can be activated by a pushbutton reset request. It has an internal 50k nominal value pullup resistor to VCC. No external pullup resistors should be connected. If the oscillator is disabled, tREC is bypassed and RST immediately goes high. 5–12 N.C. No Connection. Must be connected to ground. 13 GND Ground 14 VBAT Backup Power-Supply Input. This pin should be decoupled using a 0.1μF to 1.0μF low-leakage capacitor. If the I2C interface is inactive whenever the device is powered by the VBAT input, the decoupling capacitor is not required. If VBAT is not used, connect to ground. UL recognized to ensure against reverse charging when used with a lithium battery. Go to www.maxim-ic.com/qa/info/ul. 15 SDA Serial Data Input/Output. This pin is the data input/output for the I2C serial interface. This open-drain pin requires an external pullup resistor. 16 SCL Serial Clock Input. This pin is the clock input for the I2C serial interface and is used to synchronize data movement on the serial interface. Detailed Description The DS3231 is a serial RTC driven by a temperaturecompensated 32kHz crystal oscillator. The TCXO provides a stable and accurate reference clock, and maintains the RTC to within ±2 minutes per year accuracy from -40°C to +85°C. The TCXO frequency output is available at the 32kHz pin. The RTC is a low-power clock/calendar with two programmable time-of-day alarms and a programmable square-wave output. The INT/SQW provides either an interrupt signal due to alarm conditions or a square-wave output. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The internal registers are accessible though an I2C bus interface. A temperature-compensated voltage reference and comparator circuit monitors the level of VCC to detect power failures and to automatically switch to the backup supply when necessary. The RST pin provides an external pushbutton function and acts as an indicator of a power-fail event. DS3231 Operation The block diagram shows the main elements of the DS3231. The eight blocks can be grouped into four functional groups: TCXO, power control, pushbutton function, and RTC. Their operations are described separately in the following sections. 32kHz TCXO The temperature sensor, oscillator, and control logic form the TCXO. The controller reads the output of the on-chip temperature sensor and uses a lookup table to determine the capacitance required, adds the aging correction in AGE register, and then sets the capacitance selection registers. New values, including changes to the AGE register, are loaded only when a change in the temperature value occurs, or when a user-initiated temperature conversion is completed. The temperature is read on initial application of VCC and once every 64 seconds afterwards. Power Control This function is provided by a temperature-compensated voltage reference and a comparator circuit that monitors the VCC level. When VCC is greater than VPF, the part is powered by VCC. When VCC is less than VPF but greater than VBAT, the DS3231 is powered by VCC. If VCC is less than VPF and is less than VBAT, the device is powered by VBAT. See Table 1. To preserve the battery, the first time VBAT is applied to the device, the oscillator will not start up until VCC exceeds VPF, or until a valid I2C address is written to the part. Typical oscillator startup time is less than one second. Approximately 2 seconds after VCC is applied, or a valid I2C address is written, the device makes a temperature measurement and applies the calculated correction to the oscillator. Once the oscillator is running, it continues to run as long as a valid power source is available (VCC or VBAT), and the device continues to measure the temperature and correct the oscillator frequency every 64 seconds. On the first application of power (VCC) or when a valid I2C address is written to the part (VBAT), the time and date registers are reset to 01/01/00 01 00:00:00 (MM/DD/YY DOW HH:MM:SS). Pushbutton Reset Function The DS3231 provides for a pushbutton switch to be connected to the RST output pin. When the DS3231 is not in a reset cycle, it continuously monitors the RST signal for a low going edge. If an edge transition is detected, the DS3231 debounces the switch by pulling the RST low. After the internal timer has expired (PBDB), the DS3231 continues to monitor the RST line. If the line is still low, the DS3231 continuously monitors the line looking for a rising edge. Upon detecting release, the DS3231 forces the RST pin low and holds it low for tRST. RST is also used to indicate a power-fail condition. When VCC is lower than VPF, an internal power-fail signal is generated, which forces the RST pin low. When VCC returns to a level above VPF, the RST pin is held low for approximately 250ms (tREC) to allow the power supply to stabilize. If the oscillator is not running (see the Power Control section) when VCC is applied, tREC is bypassed and RST immediately goes high. The state of RST does not affect the operation of the TCXO, I2C interface, or RTC functions. Real-Time Clock With the clock source from the TCXO, the RTC provides seconds, minutes, hours, day, date, month, and year information. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the 24-hour or 12-hour format with an AM/PM indicator. The clock provides two programmable time-of-day alarms and a programmable square-wave output. The INT/SQW pin either generates an interrupt due to alarm condition or outputs a square-wave signal and the selection is controlled by the bit INTCN. Address Map Figure 1 shows the address map for the DS3231 timekeeping registers. During a multibyte access, when the address pointer reaches the end of the register space (12h), it wraps around to location 00h. On an I2C START or address pointer incrementing to location 00h, the current time is transferred to a second set of registers. The time information is read from these secondary registers, while the clock may continue to run. This eliminates the need to reread the registers in case the main registers update during a read. I2C Interface The I2C interface is accessible whenever either VCC or VBAT is at a valid level. If a microcontroller connected to the DS3231 resets because of a loss of VCC or other event, it is possible that the microcontroller and DS3231 I2C communications could become unsynchronized, Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 10 ____________________________________________________________________ SUPPLY CONDITION ACTIVE SUPPLY VCC < VPF, VCC < VBAT VBAT VCC < VPF, VCC > VBAT VCC VCC > VPF, VCC < VBAT VCC VCC > VPF, VCC > VBAT VCC Table 1. Power Control e.g., the microcontroller resets while reading data from the DS3231. When the microcontroller resets, the DS3231 I2C interface may be placed into a known state by toggling SCL until SDA is observed to be at a high level. At that point the microcontroller should pull SDA low while SCL is high, generating a START condition. Clock and Calendar The time and calendar information is obtained by reading the appropriate register bytes. Figure 1 illustrates the RTC registers. The time and calendar data are set or initialized by writing the appropriate register bytes. The contents of the time and calendar registers are in the binary-coded decimal (BCD) format. The DS3231 can be run in either 12-hour or 24-hour mode. Bit 6 of the hours register is defined as the 12- or 24-hour mode select bit. When high, the 12-hour mode is selected. In the 12-hour mode, bit 5 is the AM/PM bit with logic-high being PM. In the 24-hour mode, bit 5 is the second 10-hour bit (20–23 hours). The century bit (bit 7 of the month register) is toggled when the years register overflows from 99 to 00. The day-of-week register increments at midnight. Values that correspond to the day of week are userdefined but must be sequential (i.e., if 1 equals Sunday, then 2 equals Monday, and so on). Illogical time and date entries result in undefined operation. When reading or writing the time and date registers, secondary (user) buffers are used to prevent errors when the internal registers update. When reading the time and date registers, the user buffers are synchronized to the internal registers on any START and when the register pointer rolls over to zero. The time information is read DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal ____________________________________________________________________ 11 Figure 1. Timekeeing Registers Note: Unless otherwise specified, the registers’ state is not defined when power is first applied. ADDRESS BIT 7 MSB BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 LSB FUNCTION RANGE 00h 0 10 Seconds Seconds Seconds 00–59 01h 0 10 Minutes Minutes Minutes 00–59 AM/PM 02h 0 12/24 10 Hour 10 Hour Hour Hours 1–12 + AM/PM 00–23 03h 0 0 0 0 0 Day Day 1–7 04h 0 0 10 Date Date Date 01–31 05h Century 0 0 10 Month Month Month/ Century 01–12 + Century 06h 10 Year Year Year 00–99 07h A1M1 10 Seconds Seconds Alarm 1 Seconds 00–59 08h A1M2 10 Minutes Minutes Alarm 1 Minutes 00–59 AM/PM 09h A1M3 12/24 10 Hour 10 Hour Hour Alarm 1 Hours 1–12 + AM/PM 00–23 Day Alarm 1 Day 1–7 0Ah A1M4 DY/DT 10 Date Date Alarm 1 Date 1–31 0Bh A2M2 10 Minutes Minutes Alarm 2 Minutes 00–59 AM/PM 0Ch A2M3 12/24 10 Hour 10 Hour Hour Alarm 2 Hours 1–12 + AM/PM 00–23 Day Alarm 2 Day 1–7 0Dh A2M4 DY/DT 10 Date Date Alarm 2 Date 1–31 0Eh EOSC BBSQW CONV RS2 RS1 INTCN A2IE A1IE Control — 0Fh OSF 0 0 0 EN32kHz BSY A2F A1F Control/Status — 10h SIGN DATA DATA DATA DATA DATA DATA DATA Aging Offset — 11h SIGN DATA DATA DATA DATA DATA DATA DATA MSB of Temp — 12h DATA DATA 0 0 0 0 0 0 LSB of Temp — DS3231 from these secondary registers, while the clock continues to run. This eliminates the need to reread the registers in case the main registers update during a read. The countdown chain is reset whenever the seconds register is written. Write transfers occur on the acknowledge from the DS3231. Once the countdown chain is reset, to avoid rollover issues the remaining time and date registers must be written within 1 second. The 1Hz square-wave output, if enabled, transitions high 500ms after the seconds data transfer, provided the oscillator is already running. Alarms The DS3231 contains two time-of-day/date alarms. Alarm 1 can be set by writing to registers 07h to 0Ah. Alarm 2 can be set by writing to registers 0Bh to 0Dh. The alarms can be programmed (by the alarm enable and INTCN bits of the control register) to activate the INT/SQW output on an alarm match condition. Bit 7 of each of the time-of-day/date alarm registers are mask bits (Table 2). When all the mask bits for each alarm are logic 0, an alarm only occurs when the values in the timekeeping registers match the corresponding values stored in the time-of-day/date alarm registers. The alarms can also be programmed to repeat every second, minute, hour, day, or date. Table 2 shows the possible settings. Configurations not listed in the table will result in illogical operation. The DY/DT bits (bit 6 of the alarm day/date registers) control whether the alarm value stored in bits 0 to 5 of that register reflects the day of the week or the date of the month. If DY/DT is written to logic 0, the alarm will be the result of a match with date of the month. If DY/DT is written to logic 1, the alarm will be the result of a match with day of the week. When the RTC register values match alarm register settings, the corresponding Alarm Flag ‘A1F’ or ‘A2F’ bit is set to logic 1. If the corresponding Alarm Interrupt Enable ‘A1IE’ or ‘A2IE’ is also set to logic 1 and the INTCN bit is set to logic 1, the alarm condition will activate the INT/SQW signal. The match is tested on the once-per-second update of the time and date registers. Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 12 ____________________________________________________________________ Table 2. Alarm Mask Bits ALARM 1 REGISTER MASK BITS (BIT 7) DY/DT A1M4 A1M3 A1M2 A1M1 ALARM RATE X 1 1 1 1 Alarm once per second X 1 1 1 0 Alarm when seconds match X 1 1 0 0 Alarm when minutes and seconds match X 1 0 0 0 Alarm when hours, minutes, and seconds match 0 0 0 0 0 Alarm when date, hours, minutes, and seconds match 1 0 0 0 0 Alarm when day, hours, minutes, and seconds match ALARM 2 REGISTER MASK BITS (BIT 7) DY/DT A2M4 A2M3 A2M2 ALARM RATE X 1 1 1 Alarm once per minute (00 seconds of every minute) X 1 1 0 Alarm when minutes match X 1 0 0 Alarm when hours and minutes match 0 0 0 0 Alarm when date, hours, and minutes match 1 0 0 0 Alarm when day, hours, and minutes match Special-Purpose Registers The DS3231 has two additional registers (control and status) that control the real-time clock, alarms, and square-wave output. Control Register (0Eh) Bit 7: Enable Oscillator (EOSC). When set to logic 0, the oscillator is started. When set to logic 1, the oscillator is stopped when the DS3231 switches to VBAT. This bit is clear (logic 0) when power is first applied. When the DS3231 is powered by VCC, the oscillator is always on regardless of the status of the EOSC bit. Bit 6: Battery-Backed Square-Wave Enable (BBSQW). When set to logic 1 and the DS3231 is being powered by the VBAT pin, this bit enables the squarewave or interrupt output when VCC is absent. When BBSQW is logic 0, the INT/SQW pin goes high impedance when VCC falls below the power-fail trip point. This bit is disabled (logic 0) when power is first applied. Bit 5: Convert Temperature (CONV). Setting this bit to 1 forces the temperature sensor to convert the temperature into digital code and execute the TCXO algorithm to update the capacitance array to the oscillator. This can only happen when a conversion is not already in progress. The user should check the status bit BSY before forcing the controller to start a new TCXO execution. A user-initiated temperature conversion does not affect the internal 64-second update cycle. A user-initiated temperature conversion does not affect the BSY bit for approximately 2ms. The CONV bit remains at a 1 from the time it is written until the conversion is finished, at which time both CONV and BSY go to 0. The CONV bit should be used when monitoring the status of a user-initiated conversion. Bits 4 and 3: Rate Select (RS2 and RS1). These bits control the frequency of the square-wave output when the square wave has been enabled. The following table shows the square-wave frequencies that can be selected with the RS bits. These bits are both set to logic 1 (8.192kHz) when power is first applied. Bit 2: Interrupt Control (INTCN). This bit controls the INT/SQW signal. When the INTCN bit is set to logic 0, a square wave is output on the INT/SQW pin. When the INTCN bit is set to logic 1, then a match between the timekeeping registers and either of the alarm registers activates the INT/SQW output (if the alarm is also enabled). The corresponding alarm flag is always set regardless of the state of the INTCN bit. The INTCN bit is set to logic 1 when power is first applied. Bit 1: Alarm 2 Interrupt Enable (A2IE). When set to logic 1, this bit permits the alarm 2 flag (A2F) bit in the status register to assert INT/SQW (when INTCN = 1). When the A2IE bit is set to logic 0 or INTCN is set to logic 0, the A2F bit does not initiate an interrupt signal. The A2IE bit is disabled (logic 0) when power is first applied. Bit 0: Alarm 1 Interrupt Enable (A1IE). When set to logic 1, this bit permits the alarm 1 flag (A1F) bit in the status register to assert INT/SQW (when INTCN = 1). When the A1IE bit is set to logic 0 or INTCN is set to logic 0, the A1F bit does not initiate the INT/SQW signal. The A1IE bit is disabled (logic 0) when power is first applied. DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal ____________________________________________________________________ 13 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 EOSC BBSQW CONV RS2 RS1 INTCN A2IE A1IE RS2 RS1 SQUARE-WAVE OUTPUT FREQUENCY 0 0 1Hz 0 1 1.024kHz 1 0 4.096kHz 1 1 8.192kHz SQUARE-WAVE OUTPUT FREQUENCY Control Register (0Eh) DS3231 Status Register (0Fh) Bit 7: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator either is stopped or was stopped for some period and may be used to judge the validity of the timekeeping data. This bit is set to logic 1 any time that the oscillator stops. The following are examples of conditions that can cause the OSF bit to be set: 1) The first time power is applied. 2) The voltages present on both VCC and VBAT are insufficient to support oscillation. 3) The EOSC bit is turned off in battery-backed mode. 4) External influences on the crystal (i.e., noise, leakage, etc.). This bit remains at logic 1 until written to logic 0. Bit 3: Enable 32kHz Output (EN32kHz). This bit controls the status of the 32kHz pin. When set to logic 1, the 32kHz pin is enabled and outputs a 32.768kHz square-wave signal. When set to logic 0, the 32kHz pin goes to a high-impedance state. The initial power-up state of this bit is logic 1, and a 32.768kHz square-wave signal appears at the 32kHz pin after a power source is applied to the DS3231 (if the oscillator is running). Bit 2: Busy (BSY). This bit indicates the device is busy executing TCXO functions. It goes to logic 1 when the conversion signal to the temperature sensor is asserted and then is cleared when the device is in the 1-minute idle state. Bit 1: Alarm 2 Flag (A2F). A logic 1 in the alarm 2 flag bit indicates that the time matched the alarm 2 registers. If the A2IE bit is logic 1 and the INTCN bit is set to logic 1, the INT/SQW pin is also asserted. A2F is cleared when written to logic 0. This bit can only be written to logic 0. Attempting to write to logic 1 leaves the value unchanged. Bit 0: Alarm 1 Flag (A1F). A logic 1 in the alarm 1 flag bit indicates that the time matched the alarm 1 registers. If the A1IE bit is logic 1 and the INTCN bit is set to logic 1, the INT/SQW pin is also asserted. A1F is cleared when written to logic 0. This bit can only be written to logic 0. Attempting to write to logic 1 leaves the value unchanged. Aging Offset The crystal aging offset register provides an 8-bit code to add to the codes in the capacitance array registers. The code is encoded in two’s complement. One LSB represents one small capacitor to be switched in or out of the capacitance array at the crystal pins. The offset register is added to the capacitance array register under the following conditions: during a normal temperature conversion, if the temperature changes from the previous conversion, or during a manual user conversion (setting the CONV bit). To see the effects of the aging register on the 32kHz output frequency immediately, a manual conversion should be started after each aging register change. Positive aging values add capacitance to the array, slowing the oscillator frequency. Negative values remove capacitance from the array, increasing the oscillator frequency. The change in ppm per LSB is different at different temperatures. The frequency vs. temperature curve is shifted by the values used in this register. At +25°C, one LSB typically provides about 0.1ppm change in frequency. Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 14 ____________________________________________________________________ BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Sign Data Data Data Data Data Data Data Aging Offset (10h) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 OSF 0 0 0 EN32kHz BSY A2F A1F Status Register (0Fh) Temperature Registers (11h–12h) Temperature is represented as a 10-bit code with a resolution of +0.25°C and is accessible at location 11h and 12h. The temperature is encoded in two’s complement format. The upper 8 bits are at location 11h and the lower 2 bits are in the upper nibble at location 12h. Upon power reset, the registers are set to a default temperature of 0°C and the controller starts a temperature conversion. New temperature readings are stored in this register. I2C Serial Data Bus The DS3231 supports a bidirectional I2C bus and data transmission protocol. A device that sends data onto the bus is defined as a transmitter and a device receiving data is defined as a receiver. The device that controls the message is called a master. The devices that are controlled by the master are slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions. The DS3231 operates as a slave on the I2C bus. Connections to the bus are made through the SCL input and open-drain SDA I/O lines. Within the bus specifications, a standard mode (100kHz maximum clock rate) and a fast mode (400kHz maximum clock rate) are defined. The DS3231 works in both modes. The following bus protocol has been defined (Figure 2): • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high are interpreted as control signals. Accordingly, the following bus conditions have been defined: Bus not busy: Both data and clock lines remain high. START data transfer: A change in the state of the data line from high to low, while the clock line is high, defines a START condition. STOP data transfer: A change in the state of the data line from low to high, while the clock line is high, defines a STOP condition. Data valid: The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the high period of the clock signal. The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data bytes transferred between the START and the STOP conditions is not limited, and is determined by the master device. The information is transferred byte-wise and each receiver acknowledges with a ninth bit. Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse, which is associated with this acknowledge bit. A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable low during the high period of the acknowledge-related clock pulse. Of course, setup and hold times must be taken into account. A master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the data line high to enable the master to generate the STOP condition. DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal ____________________________________________________________________ 15 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Sign Data Data Data Data Data Data Data Temperature Register (Upper Byte) (11h) BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Data Data 0 0 0 0 0 0 Temperature Register (Lower Byte) (12h) DS3231 Figures 3 and 4 detail how data transfer is accomplished on the I2C bus. Depending upon the state of the R/W bit, two types of data transfer are possible: Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the master is the slave address. Next follows a number of data bytes. The slave returns an acknowledge bit after each received byte. Data is transferred with the most significant bit (MSB) first. Data transfer from a slave transmitter to a master receiver. The first byte (the slave address) is transmitted by the master. The slave then returns an acknowledge bit. Next follows a number of data bytes transmitted by the slave to the master. The master returns an acknowledge bit after all received bytes other than the last byte. At the end of the last received byte, a not acknowledge is returned. The master device generates all the serial clock pulses and the START and STOP conditions. A transfer is ended with a STOP condition or with a repeated START condition. Since a repeated START condition is also the beginning of the next serial transfer, the bus will not be released. Data is transferred with the most significant bit (MSB) first. The DS3231 can operate in the following two modes: Slave receiver mode (DS3231 write mode): Serial data and clock are received through SDA and SCL. After each byte is received, an acknowledge bit is transmitted. START and STOP conditions are recognized as the beginning and end of a serial transfer. Address recognition is performed by hardware after reception of the slave address and direction bit. The slave address byte is the first byte received after the master generates the START condition. The slave address byte contains the 7-bit DS3231 address, which is 1101000, followed by the direction bit (R/W), which is 0 for a write. After receiving and decoding the slave address byte, the DS3231 outputs an Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 16 ____________________________________________________________________ STOP CONDITION OR REPEATED START CONDITION REPEATED IF MORE BYTES ARE TRANSFERED ACK START CONDITION ACK ACKNOWLEDGEMENT SIGNAL FROM RECEIVER ACKNOWLEDGEMENT SIGNAL FROM RECEIVER SLAVE ADDRESS MSB SCL SDA R/W DIRECTION BIT 1 2 6 7 8 9 1 2 3–7 8 9 Figure 2. I2C Data Transfer Overview S 1101000 0 A XXXXXXXX A XXXXXXXX A XXXXXXXX A XXXXXXXX A P S = START A = ACKNOWLEDGE P = STOP R/W = READ/WRITE OR DIRECTION BIT ADDRESS = D0h DATA TRANSFERRED (X + 1 BYTES + ACKNOWLEDGE) Figure 3. Slave Receiver Mode (Write Mode) S 1101000 1 A XXXXXXXX A XXXXXXXX A XXXXXXXX A XXXXXXXX A P S = START A = ACKNOWLEDGE P = STOP A = NOT ACKNOWLEDGE R/W = READ/WRITE OR DIRECTION BIT ADDRESS = D1h DATA TRANSFERRED (X + 1 BYTES + ACKNOWLEDGE) NOTE: LAST DATA BYTE IS FOLLOWED BY A NOT ACKNOWLEDGE (A) SIGNAL Figure 4. Slave Transmitter Mode (Read Mode) acknowledge on SDA. After the DS3231 acknowledges the slave address + write bit, the master transmits a word address to the DS3231. This sets the register pointer on the DS3231, with the DS3231 acknowledging the transfer. The master may then transmit zero or more bytes of data, with the DS3231 acknowledging each byte received. The register pointer increments after each data byte is transferred. The master generates a STOP condition to terminate the data write. Slave transmitter mode (DS3231 read mode): The first byte is received and handled as in the slave receiver mode. However, in this mode, the direction bit indicates that the transfer direction is reversed. Serial data is transmitted on SDA by the DS3231 while the serial clock is input on SCL. START and STOP conditions are recognized as the beginning and end of a serial transfer. Address recognition is performed by hardware after reception of the slave address and direction bit. The slave address byte is the first byte received after the master generates a START condition. The slave address byte contains the 7-bit DS3231 address, which is 1101000, followed by the direction bit (R/W), which is 1 for a read. After receiving and decoding the slave address byte, the DS3231 outputs an acknowledge on SDA. The DS3231 then begins to transmit data starting with the register address pointed to by the register pointer. If the register pointer is not written to before the initiation of a read mode, the first address that is read is the last one stored in the register pointer. The DS3231 must receive a not acknowledge to end a read. Handling, PC Board Layout, and Assembly The DS3231 package contains a quartz tuning-fork crystal. Pick-and-place equipment can be used, but precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent damage to the crystal. Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. All N.C. (no connect) pins must be connected to ground. Moisture-sensitive packages are shipped from the factory dry packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-sensitive device (MSD) classifications and reflow profiles. Exposure to reflow is limited to 2 times maximum. DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal ____________________________________________________________________ 17 DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal 18 ____________________________________________________________________ Chip Information TRANSISTOR COUNT: 33,000 SUBSTRATE CONNECTED TO GROUND PROCESS: CMOS Thermal Information Theta-JA: +73°C/W Theta-JC: +23°C/W 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 32kHz SCL SDA VBAT GND N.C. N.C. N.C. N.C. TOP VIEW SO VCC INT/SQW N.C. RST N.C. N.C. N.C. DS3231S Pin Configuration PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 16 SO — 56-G4009-001 Package Information For the latest package outline information, go to www.maxim-ic.com/DallasPackInfo. DS3231 Extremely Accurate I2C-Integrated RTC/TCXO/Crystal Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19 © 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. is a registered trademark of Dallas Semiconductor Corporation. Revision History REVISION NUMBER REVISION DATE DESCRIPTION PAGES CHANGED 0 1/05 Initial release. — Changed Digital Temp Sensor Output from ±2°C to ±3°C. 1, 3 Updated Typical Operating Circuit. 1 Changed TA = -40°C to +85°C to TA = TMIN to TMAX. 2, 3, 4 1 2/05 Updated Block Diagram. 8 Added “UL Recognized” to Features; added lead-free packages and removed S from top mark info in Ordering Information table; added ground connections to the N.C. pin in the Typical Operating Circuit. 1 Added “noncondensing” to operating temperature range; changed VPF MIN from 2.35V to 2.45V. 2 Added aging offset specification. 3 Relabeled TOC4. 7 Added arrow showing input on X1 in the Block Diagram. 8 Updated pin descriptions for VCC and VBAT. 9 Added the I2C Interface section. 10 Figure 1: Added sign bit to aging and temperature registers; added MSB and LSB. 11 Corrected title for rate select bits frequency table. 13 Added note that frequency stability over temperature spec is with aging offset register = 00h; changed bit 7 from Data to Sign (Crystal Aging Offset Register). 14 Changed bit 7 from Data to Sign (Temperature Register); correct pin definitions in I2C Serial Data Bus section. 15 2 6/05 Modified the Handing, PC Board Layout, and Assembly section to refer to J-STD-020 for reflow profiles for lead-free and leaded packages. 17 3 11/05 Changed lead-free packages to RoHS-compliant packages. 1 Changed RST and UL bullets in Features. 1 Changed EC condition “VCC > VBAT” to “VCC = Active Supply (see Table 1).” 2, 3 Modified Note 12 to correct tREC operation. 6 Added various conditions text to TOCs 1, 2, and 3. 7 Added text to pin descriptions for 32kHz, VCC, and RST. 9 Table 1: Changed column heading “Powered By” to “Active Supply”; changed “applied” to “exceeds VPF” in the Power Control section. 10 Indicated BBSQW applies to both SQW and interrupts; simplified temp convert description (bit 5); added “output” to INT\SQW (bit 2). 13 4 10/06 Changed the Crystal Aging section to the Aging Offset section; changed “this bit indicates” to “this bit controls” for the enable 32kHz output bit. 14 Added Warning note to EC table notes; updated Note 12. 6 Updated the Typical Operating Characteristics graphs. 7 In the Power Control section, added information about the POR state of the time and date registers; in the Real-Time Clock section, added to the description of the RST function. 10 5 4/08 In Figure 1, corrected the months date range for 04h from 00–31 to 01–31. 11 © 2007 Microchip Technology Inc. Preliminary DS39631B PIC18F2420/2520/4420/4520 Data Sheet Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology DS39631B-page ii Preliminary © 2007 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 1 PIC18F2420/2520/4420/4520 Power Managed Modes: • Run: CPU on, peripherals on • Idle: CPU off, peripherals on • Sleep: CPU off, peripherals off • Idle mode currents down to 5.8 μA typical • Sleep mode current down to 0.1 μA typical • Timer1 Oscillator: 1.8 μA, 32 kHz, 2V • Watchdog Timer: 2.1 μA • Two-Speed Oscillator Start-up Peripheral Highlights: • High-current sink/source 25 mA/25 mA • Three programmable external interrupts • Four input change interrupts • Up to 2 Capture/Compare/PWM (CCP) modules, one with Auto-Shutdown (28-pin devices) • Enhanced Capture/Compare/PWM (ECCP) module (40/44-pin devices only): - One, two or four PWM outputs - Selectable polarity - Programmable dead time - Auto-Shutdown and Auto-Restart • Master Synchronous Serial Port (MSSP) module supporting 3-wire SPI™ (all 4 modes) and I2C™ Master and Slave Modes • Enhanced Addressable USART module: - Supports RS-485, RS-232 and LIN 1.2 - RS-232 operation using internal oscillator block (no external crystal required) - Auto-Wake-up on Start bit - Auto-Baud Detect • 10-bit, up to 13-channel Analog-to-Digital Converter module (A/D): - Auto-acquisition capability - Conversion available during Sleep • Dual analog comparators with input multiplexing) Flexible Oscillator Structure: • Four Crystal modes, up to 40 MHz • 4X Phase Lock Loop (available for crystal and internal oscillators) • Two External RC modes, up to 4 MHz • Two External Clock modes, up to 40 MHz • Internal oscillator block: - 8 user selectable frequencies, from 31 kHz to 8 MHz - Provides a complete range of clock speeds from 31 kHz to 32 MHz when used with PLL - User tunable to compensate for frequency drift • Secondary oscillator using Timer1 @ 32 kHz • Fail-Safe Clock Monitor: - Allows for safe shutdown if peripheral clock stops Special Microcontroller Features: • C compiler optimized architecture: - Optional extended instruction set designed to optimize re-entrant code • 100,000 erase/write cycle Enhanced Flash program memory typical • 1,000,000 erase/write cycle Data EEPROM memory typical • Flash/Data EEPROM Retention: 100 years typical • Self-programmable under software control • Priority levels for interrupts • 8 x 8 Single-Cycle Hardware Multiplier • Extended Watchdog Timer (WDT): - Programmable period from 4 ms to 131s • Single-supply 5V In-Circuit Serial Programming™ (ICSP™) via two pins • In-Circuit Debug (ICD) via two pins • Wide operating voltage range: 2.0V to 5.5V • Programmable 16-level High/Low-Voltage Detection (HLVD) module: - Supports interrupt on High/Low-Voltage Detection • Programmable Brown-out Reset (BOR - With software enable option 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology PIC18F2420/2520/4420/4520 DS39631B-page 2 Preliminary © 2007 Microchip Technology Inc. - Device Program Memory Data Memory I/O 10-bit A/D (ch) CCP/ ECCP (PWM) MSSP EUSART Comp. Timers Flash 8/16-bit (bytes) # Single-Word Instructions SRAM (bytes) EEPROM (bytes) SPI Master I2C PIC18F2420 16K 8192 768 256 25 10 2/0 Y Y 1 2 1/3 PIC18F2520 32K 16384 1536 256 25 10 2/0 Y Y 1 2 1/3 PIC18F4420 16K 8192 768 256 36 13 1/1 Y Y 1 2 1/3 PIC18F4520 32K 16384 1536 256 36 13 1/1 Y Y 1 2 1/3 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 3 PIC18F2420/2520/4420/4520 Pin Diagrams RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 RB3/AN9/CCP2(1) RB2/INT2/AN8 RB1/INT1/AN10 RB0/INT0/FLT0/AN12 VDD VSS RD7/PSP7/P1D RD6/PSP6/P1C RD5/PSP5/P1B RD4/PSP4 RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT RE0/RD/AN5 RE1/WR/AN6 RE2/CS/AN7 VDD VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1/P1A RC3/SCK/SCL RD0/PSP0 RD1/PSP1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 PIC18F4520 PIC18F2520 10 11 2 3 4 5 6 1 8 7 9 12 13 14 15 16 17 18 19 20 23 24 25 26 27 28 22 21 MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL RB7/KBI3/PGD RB6//KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 RB3/AN9/CCP2(1) RB2/INT2/AN8 RB1/INT1/AN10 RB0/INT0/FLT0/AN12 VDD VSS RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA 40-pin PDIP 28-pin PDIP, SOIC PIC18F4420 PIC18F2420 Note 1: RB3 is the alternate pin for CCP2 multiplexing. 1011 2 3 6 1 18 19 20 21 22 12 13 14 15 8 7 16 17 2827 2625 2423 9 PIC18F2420 RC0/T1OSO/T13CKI 5 4 RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4KBI0/AN11 RB3/AN9/CCP2(1) RB2/INT2/AN8 RB1/INT1/AN10 RB0/INT0/FLT0/AN12 VDD VSS RC7/RX/DT RC6/TX/CK RC5/SDO RC4/SDI/SDA MCLR/VPP/RE3 RA0/AN0 RA1/AN1 RA2/AN2/VREF-/CVREF RA3/AN3/VREF+ RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT VSS OSC1/CLKI/RA7 OSC2/CLKO/RA6 RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL PIC18F2520 28-pin QFN PIC18F2420/2520/4420/4520 DS39631B-page 4 Preliminary © 2007 Microchip Technology Inc. Pin Diagrams (Cont.’d) Note 1: RB3 is the alternate pin for CCP2 multiplexing. 10 11 2 345 6 1 18 19 20 21 22 12 13 14 15 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 34 35 9 PIC18F4420 37 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 MCLR/VPP/RE3 RB3/AN9/CCP2(1) RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 RD1/PSP1 RD0/PSP0 RC3/SCK/SCL RC2/CCP1/P1A RC1/T1OSI/CCP2(1) RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI/RA7 VSS VSS VDD VDD RE2/CS/AN7 RE1/WR/AN6 RE0/RD/AN5 RA5/AN4/SS/HLVDIN/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D VSS VDD VDD RB0/INT0/FLT0/AN12 RB1/INT1/AN10 RB2/INT2/AN8 44-pin QFN PIC18F4520 10 11 2 345 6 1 18 19 20 21 22 12 13 14 15 38 8 7 44 43 42 41 40 39 16 17 29 30 31 32 33 23 24 25 26 27 28 36 34 35 9 PIC18F4420 37 RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 MCLR/VPP/RE3 NC RB7/KBI3/PGD RB6/KBI2/PGC RB5/KBI1/PGM RB4/KBI0/AN11 NC RC6/TX/CK RC5/SDO RC4/SDI/SDA RD3/PSP3 RD2/PSP2 RD1/PSP1 RD0/PSP0 RC3/SCK/SCL RC2/CCP1/P1A RC1/T1OSI/CCP2(1) NC NC RC0/T1OSO/T13CKI OSC2/CLKO/RA6 OSC1/CLKI/RA7 VSS VDD RE2/CS/AN7 RE1/WR/AN6 RE0/RD/AN5 RA5/AN4/SS/HLVDIN/C2OUT RA4/T0CKI/C1OUT RC7/RX/DT RD4/PSP4 RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D VSS VDD RB0/INT0/FLT0/AN12 RB1/INT1/AN10 RB2/INT2/AN8 RB3/AN9/CCP2(1) 44-pin TQFP PIC18F4520 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 5 PIC18F2420/2520/4420/4520 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 7 2.0 Oscillator Configurations ............................................................................................................................................................ 23 3.0 Power Managed Modes ............................................................................................................................................................. 33 4.0 Reset .......................................................................................................................................................................................... 41 5.0 Memory Organization................................................................................................................................................................. 53 6.0 Flash Program Memory.............................................................................................................................................................. 73 7.0 Data EEPROM Memory ............................................................................................................................................................. 83 8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 89 9.0 Interrupts .................................................................................................................................................................................... 91 10.0 I/O Ports ................................................................................................................................................................................... 105 11.0 Timer0 Module ......................................................................................................................................................................... 123 12.0 Timer1 Module ......................................................................................................................................................................... 127 13.0 Timer2 Module ......................................................................................................................................................................... 133 14.0 Timer3 Module ......................................................................................................................................................................... 135 15.0 Capture/Compare/Pwm (CCP) Modules .................................................................................................................................. 139 16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 147 17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 161 18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 201 19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 223 20.0 Comparator Module.................................................................................................................................................................. 233 21.0 Comparator Voltage Reference Module................................................................................................................................... 239 22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 243 23.0 Special Features of the CPU.................................................................................................................................................... 249 24.0 Instruction Set Summary .......................................................................................................................................................... 267 25.0 Development Support............................................................................................................................................................... 317 26.0 Electrical Characteristics .......................................................................................................................................................... 323 27.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 361 28.0 Packaging Information.............................................................................................................................................................. 363 Appendix A: Revision History............................................................................................................................................................. 371 Appendix B: Device Differences ........................................................................................................................................................ 371 Appendix C: Conversion Considerations ........................................................................................................................................... 372 Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 372 Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 373 Appendix F: Migration from High-End to Enhanced Devices............................................................................................................. 373 Index .................................................................................................................................................................................................. 375 On-Line Support................................................................................................................................................................................. 385 Systems Information and Upgrade Hot Line ...................................................................................................................................... 385 Reader Response .............................................................................................................................................................................. 386 PIC18F2420/2520/4420/4520 Product Identification System ............................................................................................................ 387 PIC18F2420/2520/4420/4520 DS39631B-page 6 Preliminary © 2007 Microchip Technology Inc. TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 7 PIC18F2420/2520/4420/4520 1.0 DEVICE OVERVIEW This document contains device specific information for the following devices: This family offers the advantages of all PIC18 microcontrollers – namely, high computational performance at an economical price – with the addition of highendurance, Enhanced Flash program memory. On top of these features, the PIC18F2420/2520/4420/4520 family introduces design enhancements that make these microcontrollers a logical choice for many highperformance, power sensitive applications. 1.1 New Core Features 1.1.1 nanoWatt TECHNOLOGY All of the devices in the PIC18F2420/2520/4420/4520 family incorporate a range of features that can significantly reduce power consumption during operation. Key items include: • Alternate Run Modes: By clocking the controller from the Timer1 source or the internal oscillator block, power consumption during code execution can be reduced by as much as 90%. • Multiple Idle Modes: The controller can also run with its CPU core disabled but the peripherals still active. In these states, power consumption can be reduced even further, to as little as 4% of normal operation requirements. • On-the-fly Mode Switching: The power managed modes are invoked by user code during operation, allowing the user to incorporate powersaving ideas into their application’s software design. • Low Consumption in Key Modules: The power requirements for both Timer1 and the Watchdog Timer are minimized. See Section 26.0 “Electrical Characteristics” for values. 1.1.2 MULTIPLE OSCILLATOR OPTIONS AND FEATURES All of the devices in the PIC18F2420/2520/4420/4520 family offer ten different oscillator options, allowing users a wide range of choices in developing application hardware. These include: • Four Crystal modes, using crystals or ceramic resonators • Two External Clock modes, offering the option of using two pins (oscillator input and a divide-by-4 clock output) or one pin (oscillator input, with the second pin reassigned as general I/O) • Two External RC Oscillator modes with the same pin options as the External Clock modes • An internal oscillator block which provides an 8 MHz clock and an INTRC source (approximately 31 kHz), as well as a range of 6 user selectable clock frequencies, between 125 kHz to 4 MHz, for a total of 8 clock frequencies. This option frees the two oscillator pins for use as additional general purpose I/O. • A Phase Lock Loop (PLL) frequency multiplier, available to both the high-speed crystal and internal oscillator modes, which allows clock speeds of up to 40 MHz. Used with the internal oscillator, the PLL gives users a complete selection of clock speeds, from 31 kHz to 32 MHz – all without using an external crystal or clock circuit. Besides its availability as a clock source, the internal oscillator block provides a stable reference source that gives the family additional features for robust operation: • Fail-Safe Clock Monitor: This option constantly monitors the main clock source against a reference signal provided by the internal oscillator. If a clock failure occurs, the controller is switched to the internal oscillator block, allowing for continued low-speed operation or a safe application shutdown. • Two-Speed Start-up: This option allows the internal oscillator to serve as the clock source from Power-on Reset, or wake-up from Sleep mode, until the primary clock source is available. • PIC18F2420 • PIC18LF2420 • PIC18F2520 • PIC18LF2520 • PIC18F4420 • PIC18LF4420 • PIC18F4520 • PIC18LF4520 PIC18F2420/2520/4420/4520 DS39631B-page 8 Preliminary © 2007 Microchip Technology Inc. 1.2 Other Special Features • Memory Endurance: The Enhanced Flash cells for both program memory and data EEPROM are rated to last for many thousands of erase/write cycles – up to 100,000 for program memory and 1,000,000 for EEPROM. Data retention without refresh is conservatively estimated to be greater than 40 years. • Self-programmability: These devices can write to their own program memory spaces under internal software control. By using a bootloader routine located in the protected Boot Block at the top of program memory, it becomes possible to create an application that can update itself in the field. • Extended Instruction Set: The PIC18F2420/ 2520/4420/4520 family introduces an optional extension to the PIC18 instruction set, which adds 8 new instructions and an Indexed Addressing mode. This extension, enabled as a device configuration option, has been specifically designed to optimize re-entrant application code originally developed in high-level languages, such as C. • Enhanced CCP module: In PWM mode, this module provides 1, 2 or 4 modulated outputs for controlling half-bridge and full-bridge drivers. Other features include Auto-Shutdown, for disabling PWM outputs on interrupt or other select conditions and Auto-Restart, to reactivate outputs once the condition has cleared. • Enhanced Addressable USART: This serial communication module is capable of standard RS-232 operation and provides support for the LIN bus protocol. Other enhancements include automatic baud rate detection and a 16-bit Baud Rate Generator for improved resolution. When the microcontroller is using the internal oscillator block, the USART provides stable operation for applications that talk to the outside world without using an external crystal (or its accompanying power requirement). • 10-bit A/D Converter: This module incorporates programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated without waiting for a sampling period and thus, reduce code overhead. • Extended Watchdog Timer (WDT): This enhanced version incorporates a 16-bit prescaler, allowing an extended time-out range that is stable across operating voltage and temperature. See Section 26.0 “Electrical Characteristics” for time-out periods. 1.3 Details on Individual Family Members Devices in the PIC18F2420/2520/4420/4520 family are available in 28-pin and 40/44-pin packages. Block diagrams for the two groups are shown in Figure 1-1 and Figure 1-2. The devices are differentiated from each other in five ways: 1. Flash program memory (16 Kbytes for PIC18F2420/4420 devices and 32 Kbytes for PIC18F2520/4520). 2. A/D channels (10 for 28-pin devices, 13 for 40/44-pin devices). 3. I/O ports (3 bidirectional ports on 28-pin devices, 5 bidirectional ports on 40/44-pin devices). 4. CCP and Enhanced CCP implementation (28-pin devices have 2 standard CCP modules, 40/44-pin devices have one standard CCP module and one ECCP module). 5. Parallel Slave Port (present only on 40/44-pin devices). All other features for devices in this family are identical. These are summarized in Table 1-1. The pinouts for all devices are listed in Table 1-2 and Table 1-3. Like all Microchip PIC18 devices, members of the PIC18F2420/2520/4420/4520 family are available as both standard and low-voltage devices. Standard devices with Enhanced Flash memory, designated with an “F” in the part number (such as PIC18F2420), accommodate an operating VDD range of 4.2V to 5.5V. Low-voltage parts, designated by “LF” (such as PIC18LF2420), function over an extended VDD range of 2.0V to 5.5V. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 9 PIC18F2420/2520/4420/4520 TABLE 1-1: DEVICE FEATURES Features PIC18F2420 PIC18F2520 PIC18F4420 PIC18F4520 Operating Frequency DC – 40 MHz DC – 40 MHz DC – 40 MHz DC – 40 MHz Program Memory (Bytes) 16384 32768 16384 32768 Program Memory (Instructions) 8192 16384 8192 16384 Data Memory (Bytes) 768 1536 768 1536 Data EEPROM Memory (Bytes) 256 256 256 256 Interrupt Sources 19 19 20 20 I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E Timers 4 4 4 4 Capture/Compare/PWM Modules 2 2 1 1 Enhanced Capture/Compare/PWM Modules 0 0 1 1 Serial Communications MSSP, Enhanced USART MSSP, Enhanced USART MSSP, Enhanced USART MSSP, Enhanced USART Parallel Communications (PSP) No No Yes Yes 10-bit Analog-to-Digital Module 10 Input Channels 10 Input Channels 13 Input Channels 13 Input Channels Resets (and Delays) POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT POR, BOR, RESET Instruction, Stack Full, Stack Underflow (PWRT, OST), MCLR (optional), WDT Programmable High/Low-Voltage Detect Yes Yes Yes Yes Programmable Brown-out Reset Yes Yes Yes Yes Instruction Set 75 Instructions; 83 with Extended Instruction Set enabled 75 Instructions; 83 with Extended Instruction Set enabled 75 Instructions; 83 with Extended Instruction Set enabled 75 Instructions; 83 with Extended Instruction Set enabled Packages 28-pin PDIP 28-pin SOIC 28-pin QFN 28-pin PDIP 28-pin SOIC 28-pin QFN 40-pin PDIP 44-pin QFN 44-pin TQFP 40-pin PDIP 44-pin QFN 44-pin TQFP PIC18F2420/2520/4420/4520 DS39631B-page 10 Preliminary © 2007 Microchip Technology Inc. FIGURE 1-1: PIC18F2420/2520 (28-PIN) BLOCK DIAGRAM Instruction Decode and Control PORTA PORTB PORTC RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT RB0/INT0/FLT0/AN12 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 RB1/INT1/AN10 Data Latch Data Memory ( 3.9 Kbytes ) Address Latch Data Address<12> 12 BSR FSR0 Access FSR1 FSR2 inc/dec logic Address 4 12 4 PCH PCL PCLATH 8 31 Level Stack Program Counter PRODH PRODL 8 x 8 Multiply 8 BITOP 8 8 ALU<8> Address Latch Program Memory (16/32 Kbytes) Data Latch 20 8 8 Table Pointer<21> inc/dec logic 21 8 Data Bus<8> Table Latch 8 IR 12 3 ROM Latch RB2/INT2/AN8 RB3/AN9/CCP2(1) PCLATU PCU OSC2/CLKO(3)/RA6 Note 1: CCP2 is multiplexed with RC1 when configuration bit CCP2MX is set, or RB3 when CCP2MX is not set. 2: RE3 is only available when MCLR functionality is disabled. 3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer to Section 2.0 “Oscillator Configurations” for additional information. RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD Comparator MSSP EUSART 10-bit ADC Timer0 Timer1 Timer2 Timer3 CCP2 HLVD CCP1 BOR Data EEPROM W Instruction Bus <16> STKPTR Bank 8 State machine control signals Decode 8 8 Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer OSC1(3) OSC2(3) VDD, Brown-out Reset Internal Oscillator Fail-Safe Clock Monitor Precision Reference Band Gap VSS MCLR(2) Block INTRC Oscillator 8 MHz Oscillator Single-Supply Programming In-Circuit Debugger T1OSO OSC1/CLKI(3)/RA7 T1OSI PORTE MCLR/VPP/RE3(2) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 11 PIC18F2420/2520/4420/4520 FIGURE 1-2: PIC18F4420/4520 (40/44-PIN) BLOCK DIAGRAM Instruction Decode and Control Data Latch Data Memory ( 3.9 Kbytes ) Address Latch Data Address<12> 12 BSR FSR0 Access FSR1 FSR2 inc/dec logic Address 4 12 4 PCH PCL PCLATH 8 31 Level Stack Program Counter PRODH PRODL 8 x 8 Multiply 8 BITOP 8 8 ALU<8> Address Latch Program Memory (16/32 Kbytes) Data Latch 20 8 8 Table Pointer<21> inc/dec logic 21 8 Data Bus<8> Table Latch 8 IR 12 3 ROM Latch PORTD RD0/PSP0 PCLATU PCU PORTE MCLR/VPP/RE3(2) RE2/CS/AN7 RE0/RD/AN5 RE1/WR/AN6 Note 1: CCP2 is multiplexed with RC1 when configuration bit CCP2MX is set, or RB3 when CCP2MX is not set. 2: RE3 is only available when MCLR functionality is disabled. 3: OSC1/CLKI and OSC2/CLKO are only available in select oscillator modes and when these pins are not being used as digital I/O. Refer to Section 2.0 “Oscillator Configurations” for additional information. :RD4/PSP4 Comparator MSSP EUSART 10-bit ADC Timer0 Timer1 Timer2 Timer3 CCP2 HLVD ECCP1 BOR Data EEPROM W Instruction Bus <16> STKPTR Bank 8 State machine control signals Decode 8 8 Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer OSC1(3) OSC2(3) VDD, Brown-out Reset Internal Oscillator Fail-Safe Clock Monitor Precision Reference Band Gap VSS MCLR(2) Block INTRC Oscillator 8 MHz Oscillator Single-Supply Programming In-Circuit Debugger T1OSI T1OSO RD5/PSP5/P1B RD6/PSP6/P1C RD7/PSP7/P1D PORTA PORTB PORTC RA4/T0CKI/C1OUT RA5/AN4/SS/HLVDIN/C2OUT RB0/INT0/FLT0/AN12 RC0/T1OSO/T13CKI RC1/T1OSI/CCP2(1) RC2/CCP1/P1A RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT RA3/AN3/VREF+ RA2/AN2/VREF-/CVREF RA1/AN1 RA0/AN0 RB1/INT1/AN10 RB2/INT2/AN8 RB3/AN9/CCP2(1) OSC2/CLKO(3)/RA6 RB4/KBI0/AN11 RB5/KBI1/PGM RB6/KBI2/PGC RB7/KBI3/PGD OSC1/CLKI(3)/RA7 PIC18F2420/2520/4420/4520 DS39631B-page 12 Preliminary © 2007 Microchip Technology Inc. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS Pin Name Pin Number Pin Type Buffer Type PDIP, Description SOIC QFN MCLR/VPP/RE3 MCLR VPP RE3 1 26 I P I ST ST Master Clear (input) or programming voltage (input). Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input. OSC1/CLKI/RA7 OSC1 CLKI RA7 9 6 I I I/O ST CMOS TTL Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode; CMOS otherwise. External clock source input. Always associated with pin function OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) General purpose I/O pin. OSC2/CLKO/RA6 OSC2 CLKO RA6 10 7 O O I/O — — TTL Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 13 PIC18F2420/2520/4420/4520 PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 2 27 I/O I TTL Analog Digital I/O. Analog input 0. RA1/AN1 RA1 AN1 3 28 I/O I TTL Analog Digital I/O. Analog input 1. RA2/AN2/VREF-/CVREF RA2 AN2 VREFCVREF 4 1 I/O I I O TTL Analog Analog Analog Digital I/O. Analog input 2. A/D reference voltage (low) input. Comparator reference voltage output. RA3/AN3/VREF+ RA3 AN3 VREF+ 5 2 I/O I I TTL Analog Analog Digital I/O. Analog input 3. A/D reference voltage (high) input. RA4/T0CKI/C1OUT RA4 T0CKI C1OUT 6 3 I/O I O ST ST — Digital I/O. Timer0 external clock input. Comparator 1 output. RA5/AN4/SS/HLVDIN/ C2OUT RA5 AN4 SS HLVDIN C2OUT 7 4 I/O I I I O TTL Analog TTL Analog — Digital I/O. Analog input 4. SPI™ slave select input. High/Low-Voltage Detect input. Comparator 2 output. RA6 See the OSC2/CLKO/RA6 pin. RA7 See the OSC1/CLKI/RA7 pin. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type PDIP, Description SOIC QFN Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. PIC18F2420/2520/4420/4520 DS39631B-page 14 Preliminary © 2007 Microchip Technology Inc. PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT0/FLT0/AN12 RB0 INT0 FLT0 AN12 21 18 I/O I I I TTL ST ST Analog Digital I/O. External interrupt 0. PWM Fault input for CCP1. Analog input 12. RB1/INT1/AN10 RB1 INT1 AN10 22 19 I/O I I TTL ST Analog Digital I/O. External interrupt 1. Analog input 10. RB2/INT2/AN8 RB2 INT2 AN8 23 20 I/O I I TTL ST Analog Digital I/O. External interrupt 2. Analog input 8. RB3/AN9/CCP2 RB3 AN9 CCP2(1) 24 21 I/O I I/O TTL Analog ST Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM 2 output. RB4/KBI0/AN11 RB4 KBI0 AN11 25 22 I/O I I TTL TTL Analog Digital I/O. Interrupt-on-change pin. Analog input 11. RB5/KBI1/PGM RB5 KBI1 PGM 26 23 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin. RB6/KBI2/PGC RB6 KBI2 PGC 27 24 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin. RB7/KBI3/PGD RB7 KBI3 PGD 28 25 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type PDIP, Description SOIC QFN Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 15 PIC18F2420/2520/4420/4520 PORTC is a bidirectional I/O port. RC0/T1OSO/T13CKI RC0 T1OSO T13CKI 11 8 I/O O I ST — ST Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input. RC1/T1OSI/CCP2 RC1 T1OSI CCP2(2) 12 9 I/O I I/O ST Analog ST Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM 2 output. RC2/CCP1 RC2 CCP1 13 10 I/O I/O ST ST Digital I/O. Capture 1 input/Compare 1 output/PWM 1 output. RC3/SCK/SCL RC3 SCK SCL 14 11 I/O I/O I/O ST ST ST Digital I/O. Synchronous serial clock input/output for SPI™ mode. Synchronous serial clock input/output for I2C™ mode. RC4/SDI/SDA RC4 SDI SDA 15 12 I/O I I/O ST ST ST Digital I/O. SPI data in. I2C data I/O. RC5/SDO RC5 SDO 16 13 I/O O ST — Digital I/O. SPI data out. RC6/TX/CK RC6 TX CK 17 14 I/O O I/O ST — ST Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see related RX/DT). RC7/RX/DT RC7 RX DT 18 15 I/O I I/O ST ST ST Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see related TX/CK). RE3 — — — — See MCLR/VPP/RE3 pin. VSS 8, 19 5, 16 P — Ground reference for logic and I/O pins. VDD 20 17 P — Positive supply for logic and I/O pins. TABLE 1-2: PIC18F2420/2520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type PDIP, Description SOIC QFN Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. PIC18F2420/2520/4420/4520 DS39631B-page 16 Preliminary © 2007 Microchip Technology Inc. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP MCLR/VPP/RE3 MCLR VPP RE3 1 18 18 I P I ST ST Master Clear (input) or programming voltage (input). Master Clear (Reset) input. This pin is an active-low Reset to the device. Programming voltage input. Digital input. OSC1/CLKI/RA7 OSC1 CLKI RA7 13 32 30 I I I/O ST CMOS TTL Oscillator crystal or external clock input. Oscillator crystal input or external clock source input. ST buffer when configured in RC mode; analog otherwise. External clock source input. Always associated with pin function OSC1. (See related OSC1/CLKI, OSC2/CLKO pins.) General purpose I/O pin. OSC2/CLKO/RA6 OSC2 CLKO RA6 14 33 31 O O I/O — — TTL Oscillator crystal or clock output. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKO which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. General purpose I/O pin. Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 17 PIC18F2420/2520/4420/4520 PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 2 19 19 I/O I TTL Analog Digital I/O. Analog input 0. RA1/AN1 RA1 AN1 3 20 20 I/O I TTL Analog Digital I/O. Analog input 1. RA2/AN2/VREF-/CVREF RA2 AN2 VREFCVREF 4 21 21 I/O I I O TTL Analog Analog Analog Digital I/O. Analog input 2. A/D reference voltage (low) input. Comparator reference voltage output. RA3/AN3/VREF+ RA3 AN3 VREF+ 5 22 22 I/O I I TTL Analog Analog Digital I/O. Analog input 3. A/D reference voltage (high) input. RA4/T0CKI/C1OUT RA4 T0CKI C1OUT 6 23 23 I/O I O ST ST — Digital I/O. Timer0 external clock input. Comparator 1 output. RA5/AN4/SS/HLVDIN/ C2OUT RA5 AN4 SS HLVDIN C2OUT 7 24 24 I/O I I I O TTL Analog TTL Analog — Digital I/O. Analog input 4. SPI slave select input. High/Low-Voltage Detect input. Comparator 2 output. RA6 See the OSC2/CLKO/RA6 pin. RA7 See the OSC1/CLKI/RA7 pin. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. PIC18F2420/2520/4420/4520 DS39631B-page 18 Preliminary © 2007 Microchip Technology Inc. PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT0/FLT0/AN12 RB0 INT0 FLT0 AN12 33 9 8 I/O I I I TTL ST ST Analog Digital I/O. External interrupt 0. PWM Fault input for Enhanced CCP1. Analog input 12. RB1/INT1/AN10 RB1 INT1 AN10 34 10 9 I/O I I TTL ST Analog Digital I/O. External interrupt 1. Analog input 10. RB2/INT2/AN8 RB2 INT2 AN8 35 11 10 I/O I I TTL ST Analog Digital I/O. External interrupt 2. Analog input 8. RB3/AN9/CCP2 RB3 AN9 CCP2(1) 36 12 11 I/O I I/O TTL Analog ST Digital I/O. Analog input 9. Capture 2 input/Compare 2 output/PWM 2 output. RB4/KBI0/AN11 RB4 KBI0 AN11 37 14 14 I/O I I TTL TTL Analog Digital I/O. Interrupt-on-change pin. Analog input 11. RB5/KBI1/PGM RB5 KBI1 PGM 38 15 15 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. Low-Voltage ICSP™ Programming enable pin. RB6/KBI2/PGC RB6 KBI2 PGC 39 16 16 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming clock pin. RB7/KBI3/PGD RB7 KBI3 PGD 40 17 17 I/O I I/O TTL TTL ST Digital I/O. Interrupt-on-change pin. In-Circuit Debugger and ICSP programming data pin. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 19 PIC18F2420/2520/4420/4520 PORTC is a bidirectional I/O port. RC0/T1OSO/T13CKI RC0 T1OSO T13CKI 15 34 32 I/O O I ST — ST Digital I/O. Timer1 oscillator output. Timer1/Timer3 external clock input. RC1/T1OSI/CCP2 RC1 T1OSI CCP2(2) 16 35 35 I/O I I/O ST CMOS ST Digital I/O. Timer1 oscillator input. Capture 2 input/Compare 2 output/PWM 2 output. RC2/CCP1/P1A RC2 CCP1 P1A 17 36 36 I/O I/O O ST ST — Digital I/O. Capture 1 input/Compare 1 output/PWM 1 output. Enhanced CCP1 output. RC3/SCK/SCL RC3 SCK SCL 18 37 37 I/O I/O I/O ST ST ST Digital I/O. Synchronous serial clock input/output for SPI™ mode. Synchronous serial clock input/output for I2C™ mode. RC4/SDI/SDA RC4 SDI SDA 23 42 42 I/O I I/O ST ST ST Digital I/O. SPI data in. I2C data I/O. RC5/SDO RC5 SDO 24 43 43 I/O O ST — Digital I/O. SPI data out. RC6/TX/CK RC6 TX CK 25 44 44 I/O O I/O ST — ST Digital I/O. EUSART asynchronous transmit. EUSART synchronous clock (see related RX/DT). RC7/RX/DT RC7 RX DT 26 1 1 I/O I I/O ST ST ST Digital I/O. EUSART asynchronous receive. EUSART synchronous data (see related TX/CK). TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. PIC18F2420/2520/4420/4520 DS39631B-page 20 Preliminary © 2007 Microchip Technology Inc. PORTD is a bidirectional I/O port or a Parallel Slave Port (PSP) for interfacing to a microprocessor port. These pins have TTL input buffers when PSP module is enabled. RD0/PSP0 RD0 PSP0 19 38 38 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD1/PSP1 RD1 PSP1 20 39 39 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD2/PSP2 RD2 PSP2 21 40 40 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD3/PSP3 RD3 PSP3 22 41 41 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD4/PSP4 RD4 PSP4 27 2 2 I/O I/O ST TTL Digital I/O. Parallel Slave Port data. RD5/PSP5/P1B RD5 PSP5 P1B 28 3 3 I/O I/O O ST TTL — Digital I/O. Parallel Slave Port data. Enhanced CCP1 output. RD6/PSP6/P1C RD6 PSP6 P1C 29 4 4 I/O I/O O ST TTL — Digital I/O. Parallel Slave Port data. Enhanced CCP1 output. RD7/PSP7/P1D RD7 PSP7 P1D 30 5 5 I/O I/O O ST TTL — Digital I/O. Parallel Slave Port data. Enhanced CCP1 output. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 21 PIC18F2420/2520/4420/4520 PORTE is a bidirectional I/O port. RE0/RD/AN5 RE0 RD AN5 8 25 25 I/O I I ST TTL Analog Digital I/O. Read control for Parallel Slave Port (see also WR and CS pins). Analog input 5. RE1/WR/AN6 RE1 WR AN6 9 26 26 I/O I I ST TTL Analog Digital I/O. Write control for Parallel Slave Port (see CS and RD pins). Analog input 6. RE2/CS/AN7 RE2 CS AN7 10 27 27 I/O I I ST TTL Analog Digital I/O. Chip Select control for Parallel Slave Port (see related RD and WR). Analog input 7. RE3 — — — — — See MCLR/VPP/RE3 pin. VSS 12, 31 6, 30, 31 6, 29 P — Ground reference for logic and I/O pins. VDD 11, 32 7, 8, 28, 29 7, 28 P — Positive supply for logic and I/O pins. NC — 13 12, 13, 33, 34 — — No connect. TABLE 1-3: PIC18F4420/4520 PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Name Pin Number Pin Type Buffer Type Description PDIP QFN TQFP Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels I = Input O = Output P = Power Note 1: Default assignment for CCP2 when configuration bit CCP2MX is set. 2: Alternate assignment for CCP2 when configuration bit CCP2MX is cleared. PIC18F2420/2520/4420/4520 DS39631B-page 22 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 23 PIC18F2420/2520/4420/4520 2.0 OSCILLATOR CONFIGURATIONS 2.1 Oscillator Types PIC18F2420/2520/4420/4520 devices can be operated in ten different oscillator modes. The user can program the configuration bits, FOSC3:FOSC0, in Configuration Register 1H to select one of these ten modes: 1. LP Low-Power Crystal 2. XT Crystal/Resonator 3. HS High-Speed Crystal/Resonator 4. HSPLL High-Speed Crystal/Resonator with PLL enabled 5. RC External Resistor/Capacitor with FOSC/4 output on RA6 6. RCIO External Resistor/Capacitor with I/O on RA6 7. INTIO1 Internal Oscillator with FOSC/4 output on RA6 and I/O on RA7 8. INTIO2 Internal Oscillator with I/O on RA6 and RA7 9. EC External Clock with FOSC/4 output 10. ECIO External Clock with I/O on RA6 2.2 Crystal Oscillator/Ceramic Resonators In XT, LP, HS or HSPLL Oscillator modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation. Figure 2-1 shows the pin connections. The oscillator design requires the use of a parallel cut crystal. FIGURE 2-1: CRYSTAL/CERAMIC RESONATOR OPERATION (XT, LP, HS OR HSPLL CONFIGURATION) TABLE 2-1: CAPACITOR SELECTION FOR CERAMIC RESONATORS Note: Use of a series cut crystal may give a frequency out of the crystal manufacturer’s specifications. Typical Capacitor Values Used: Mode Freq OSC1 OSC2 XT 3.58 MHz 4.19 MHz 4 MHz 4 MHz 15 pF 15 pF 30 pF 50 pF 15 pF 15 pF 30 pF 50 pF Capacitor values are for design guidance only. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. See the notes following Table 2-2 for additional information. Note: When using resonators with frequencies above 3.5 MHz, the use of HS mode, rather than XT mode, is recommended. HS mode may be used at any VDD for which the controller is rated. If HS is selected, it is possible that the gain of the oscillator will overdrive the resonator. Therefore, a series resistor should be placed between the OSC2 pin and the resonator. As a good starting point, the recommended value of RS is 330Ω. Note 1: See Table 2-1 and Table 2-2 for initial values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF varies with the oscillator mode chosen. C1(1) C2(1) XTAL OSC2 OSC1 RF(3) Sleep To Logic PIC18FXXXX RS(2) Internal PIC18F2420/2520/4420/4520 DS39631B-page 24 Preliminary © 2007 Microchip Technology Inc. TABLE 2-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR An external clock source may also be connected to the OSC1 pin in the HS mode, as shown in Figure 2-2. FIGURE 2-2: EXTERNAL CLOCK INPUT OPERATION (HS OSC CONFIGURATION) 2.3 External Clock Input The EC and ECIO Oscillator modes require an external clock source to be connected to the OSC1 pin. There is no oscillator start-up time required after a Power-on Reset or after an exit from Sleep mode. In the EC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 2-3 shows the pin connections for the EC Oscillator mode. FIGURE 2-3: EXTERNAL CLOCK INPUT OPERATION (EC CONFIGURATION) The ECIO Oscillator mode functions like the EC mode, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). Figure 2-4 shows the pin connections for the ECIO Oscillator mode. FIGURE 2-4: EXTERNAL CLOCK INPUT OPERATION (ECIO CONFIGURATION) Osc Type Crystal Freq Typical Capacitor Values Tested: C1 C2 LP 32 kHz 30 pF 30 pF XT 1 MHz 4 MHz 15 pF 15 pF 15 pF 15 pF HS 4 MHz 10 MHz 20 MHz 25 MHz 25 MHz 15 pF 15 pF 15 pF 0 pF 15 pF 15 pF 15 pF 15 pF 5 pF 15 pF Capacitor values are for design guidance only. These capacitors were tested with the crystals listed below for basic start-up and operation. These values are not optimized. Different capacitor values may be required to produce acceptable oscillator operation. The user should test the performance of the oscillator over the expected VDD and temperature range for the application. See the notes following this table for additional information. Crystals Used: 32 kHz 4 MHz 25 MHz 10 MHz 1 MHz 20 MHz Note 1: Higher capacitance increases the stability of the oscillator but also increases the start-up time. 2: When operating below 3V VDD, or when using certain ceramic resonators at any voltage, it may be necessary to use the HS mode or switch to a crystal oscillator. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Rs may be required to avoid overdriving crystals with low drive level specification. 5: Always verify oscillator performance over the VDD and temperature range that is expected for the application. OSC1 Open OSC2 Clock from Ext. System PIC18FXXXX (HS Mode) OSC1/CLKI FOSC/4 OSC2/CLKO Clock from Ext. System PIC18FXXXX OSC1/CLKI RA6 I/O (OSC2) Clock from Ext. System PIC18FXXXX © 2007 Microchip Technology Inc. Preliminary DS39631B-page 25 PIC18F2420/2520/4420/4520 2.4 RC Oscillator For timing insensitive applications, the “RC” and “RCIO” device options offer additional cost savings. The actual oscillator frequency is a function of several factors: • supply voltage • values of the external resistor (REXT) and capacitor (CEXT) • operating temperature Given the same device, operating voltage and temperature and component values, there will also be unit-to-unit frequency variations. These are due to factors such as: • normal manufacturing variation • difference in lead frame capacitance between package types (especially for low CEXT values) • variations within the tolerance of limits of REXT and CEXT In the RC Oscillator mode, the oscillator frequency divided by 4 is available on the OSC2 pin. This signal may be used for test purposes or to synchronize other logic. Figure 2-5 shows how the R/C combination is connected. FIGURE 2-5: RC OSCILLATOR MODE The RCIO Oscillator mode (Figure 2-6) functions like the RC mode, except that the OSC2 pin becomes an additional general purpose I/O pin. The I/O pin becomes bit 6 of PORTA (RA6). FIGURE 2-6: RCIO OSCILLATOR MODE 2.5 PLL Frequency Multiplier A Phase Locked Loop (PLL) circuit is provided as an option for users who wish to use a lower frequency oscillator circuit or to clock the device up to its highest rated frequency from a crystal oscillator. This may be useful for customers who are concerned with EMI due to high-frequency crystals or users who require higher clock speeds from an internal oscillator. 2.5.1 HSPLL OSCILLATOR MODE The HSPLL mode makes use of the HS mode oscillator for frequencies up to 10 MHz. A PLL then multiplies the oscillator output frequency by 4 to produce an internal clock frequency up to 40 MHz. The PLLEN bit is not available in this oscillator mode. The PLL is only available to the crystal oscillator when the FOSC3:FOSC0 configuration bits are programmed for HSPLL mode (= 0110). FIGURE 2-7: PLL BLOCK DIAGRAM (HS MODE) 2.5.2 PLL AND INTOSC The PLL is also available to the internal oscillator block in selected oscillator modes. In this configuration, the PLL is enabled in software and generates a clock output of up to 32 MHz. The operation of INTOSC with the PLL is described in Section 2.6.4 “PLL in INTOSC Modes”. OSC2/CLKO CEXT REXT PIC18FXXXX OSC1 FOSC/4 Internal Clock VDD VSS Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ CEXT > 20 pF CEXT REXT PIC18FXXXX OSC1 Internal Clock VDD VSS Recommended values: 3 kΩ ≤ REXT ≤ 100 kΩ CEXT > 20 pF RA6 I/O (OSC2) MUX VCO Loop Filter Crystal Osc OSC2 OSC1 PLL Enable FIN FOUT SYSCLK Phase Comparator HS Oscillator Enable ÷4 (from Configuration Register 1H) HS Mode PIC18F2420/2520/4420/4520 DS39631B-page 26 Preliminary © 2007 Microchip Technology Inc. 2.6 Internal Oscillator Block The PIC18F2420/2520/4420/4520 devices include an internal oscillator block which generates two different clock signals; either can be used as the microcontroller’s clock source. This may eliminate the need for external oscillator circuits on the OSC1 and/or OSC2 pins. The main output (INTOSC) is an 8 MHz clock source, which can be used to directly drive the device clock. It also drives a postscaler, which can provide a range of clock frequencies from 31 kHz to 4 MHz. The INTOSC output is enabled when a clock frequency from 125 kHz to 8 MHz is selected. The other clock source is the internal RC oscillator (INTRC), which provides a nominal 31 kHz output. INTRC is enabled if it is selected as the device clock source; it is also enabled automatically when any of the following are enabled: • Power-up Timer • Fail-Safe Clock Monitor • Watchdog Timer • Two-Speed Start-up These features are discussed in greater detail in Section 23.0 “Special Features of the CPU”. The clock source frequency (INTOSC direct, INTRC direct or INTOSC postscaler) is selected by configuring the IRCF bits of the OSCCON register (page 30). 2.6.1 INTIO MODES Using the internal oscillator as the clock source eliminates the need for up to two external oscillator pins, which can then be used for digital I/O. Two distinct configurations are available: • In INTIO1 mode, the OSC2 pin outputs FOSC/4, while OSC1 functions as RA7 for digital input and output. • In INTIO2 mode, OSC1 functions as RA7 and OSC2 functions as RA6, both for digital input and output. 2.6.2 INTOSC OUTPUT FREQUENCY The internal oscillator block is calibrated at the factory to produce an INTOSC output frequency of 8.0 MHz. The INTRC oscillator operates independently of the INTOSC source. Any changes in INTOSC across voltage and temperature are not necessarily reflected by changes in INTRC and vice versa. 2.6.3 OSCTUNE REGISTER The internal oscillator’s output has been calibrated at the factory but can be adjusted in the user’s application. This is done by writing to the OSCTUNE register (Register 2-1). When the OSCTUNE register is modified, the INTOSC frequency will begin shifting to the new frequency. The INTRC clock will reach the new frequency within 8 clock cycles (approximately 8 * 32 μs = 256 μs). The INTOSC clock will stabilize within 1 ms. Code execution continues during this shift. There is no indication that the shift has occurred. The OSCTUNE register also implements the INTSRC and PLLEN bits, which control certain features of the internal oscillator block. The INTSRC bit allows users to select which internal oscillator provides the clock source when the 31 kHz frequency option is selected. This is covered in greater detail in Section 2.7.1 “Oscillator Control Register”. The PLLEN bit controls the operation of the frequency multiplier, PLL, in internal oscillator modes. 2.6.4 PLL IN INTOSC MODES The 4x frequency multiplier can be used with the internal oscillator block to produce faster device clock speeds than are normally possible with an internal oscillator. When enabled, the PLL produces a clock speed of up to 32 MHz. Unlike HSPLL mode, the PLL is controlled through software. The control bit, PLLEN (OSCTUNE<6>), is used to enable or disable its operation. The PLL is available when the device is configured to use the internal oscillator block as its primary clock source (FOSC3:FOSC0 = 1001 or 1000). Additionally, the PLL will only function when the selected output frequency is either 4 MHz or 8 MHz (OSCCON<6:4> = 111 or 110). If both of these conditions are not met, the PLL is disabled. The PLLEN control bit is only functional in those internal oscillator modes where the PLL is available. In all other modes, it is forced to ‘0’ and is effectively unavailable. 2.6.5 INTOSC FREQUENCY DRIFT The factory calibrates the internal oscillator block output (INTOSC) for 8 MHz. However, this frequency may drift as VDD or temperature changes, which can affect the controller operation in a variety of ways. It is possible to adjust the INTOSC frequency by modifying the value in the OSCTUNE register. This has no effect on the INTRC clock source frequency. Tuning the INTOSC source requires knowing when to make the adjustment, in which direction it should be made and in some cases, how large a change is needed. Three compensation techniques are discussed in Section 2.6.5.1 “Compensating with the USART”, Section 2.6.5.2 “Compensating with the Timers” and Section 2.6.5.3 “Compensating with the CCP Module in Capture Mode”, but other techniques may be used. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 27 PIC18F2420/2520/4420/4520 REGISTER 2-1: OSCTUNE: OSCILLATOR TUNING REGISTER 2.6.5.1 Compensating with the USART An adjustment may be required when the USART begins to generate framing errors or receives data with errors while in Asynchronous mode. Framing errors indicate that the device clock frequency is too high; to adjust for this, decrement the value in OSCTUNE to reduce the clock frequency. On the other hand, errors in data may suggest that the clock speed is too low; to compensate, increment OSCTUNE to increase the clock frequency. 2.6.5.2 Compensating with the Timers This technique compares device clock speed to some reference clock. Two timers may be used; one timer is clocked by the peripheral clock, while the other is clocked by a fixed reference source, such as the Timer1 oscillator. Both timers are cleared, but the timer clocked by the reference generates interrupts. When an interrupt occurs, the internally clocked timer is read and both timers are cleared. If the internally clocked timer value is greater than expected, then the internal oscillator block is running too fast. To adjust for this, decrement the OSCTUNE register. 2.6.5.3 Compensating with the CCP Module in Capture Mode A CCP module can use free running Timer1 (or Timer3), clocked by the internal oscillator block and an external event with a known period (i.e., AC power frequency). The time of the first event is captured in the CCPRxH:CCPRxL registers and is recorded for use later. When the second event causes a capture, the time of the first event is subtracted from the time of the second event. Since the period of the external event is known, the time difference between events can be calculated. If the measured time is much greater than the calculated time, the internal oscillator block is running too fast; to compensate, decrement the OSCTUNE register. If the measured time is much less than the calculated time, the internal oscillator block is running too slow; to compensate, increment the OSCTUNE register. R/W-0 R/W-0(1) U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 INTSRC PLLEN(1) — TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit 1 = 31.25 kHz device clock derived from 8 MHz INTOSC source (divide-by-256 enabled) 0 = 31 kHz device clock derived directly from INTRC internal oscillator bit 6 PLLEN: Frequency Multiplier PLL for INTOSC Enable bit(1) 1 = PLL enabled for INTOSC (4 MHz and 8 MHz only) 0 = PLL disabled Note 1: Available only in certain oscillator configurations; otherwise, this bit is unavailable and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes” for details. bit 5 Unimplemented: Read as ‘0’ bit 4-0 TUN4:TUN0: Frequency Tuning bits 01111 = Maximum frequency • • • • 00001 00000 = Center frequency. Oscillator module is running at the calibrated frequency. 11111 • • • • 10000 = Minimum frequency Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 28 Preliminary © 2007 Microchip Technology Inc. 2.7 Clock Sources and Oscillator Switching Like previous PIC18 devices, the PIC18F2420/2520/ 4420/4520 family includes a feature that allows the device clock source to be switched from the main oscillator to an alternate low-frequency clock source. PIC18F2420/2520/4420/4520 devices offer two alternate clock sources. When an alternate clock source is enabled, the various power managed operating modes are available. Essentially, there are three clock sources for these devices: • Primary oscillators • Secondary oscillators • Internal oscillator block The primary oscillators include the External Crystal and Resonator modes, the External RC modes, the External Clock modes and the internal oscillator block. The particular mode is defined by the FOSC3:FOSC0 configuration bits. The details of these modes are covered earlier in this chapter. The secondary oscillators are those external sources not connected to the OSC1 or OSC2 pins. These sources may continue to operate even after the controller is placed in a power managed mode. PIC18F2420/2520/4420/4520 devices offer the Timer1 oscillator as a secondary oscillator. This oscillator, in all power managed modes, is often the time base for functions such as a real-time clock. Most often, a 32.768 kHz watch crystal is connected between the RC0/T1OSO/T13CKI and RC1/T1OSI pins. Like the LP mode oscillator circuit, loading capacitors are also connected from each pin to ground. The Timer1 oscillator is discussed in greater detail in Section 12.3 “Timer1 Oscillator”. In addition to being a primary clock source, the internal oscillator block is available as a power managed mode clock source. The INTRC source is also used as the clock source for several special features, such as the WDT and Fail-Safe Clock Monitor. The clock sources for the PIC18F2420/2520/4420/4520 devices are shown in Figure 2-8. See Section 23.0 “Special Features of the CPU” for Configuration register details. FIGURE 2-8: PIC18F2420/2520/4420/4520 CLOCK DIAGRAM PIC18F2420/2520/4420/4520 4 x PLL FOSC3:FOSC0 Secondary Oscillator T1OSCEN Enable Oscillator T1OSO T1OSI Clock Source Option for other Modules OSC1 OSC2 Sleep HSPLL, INTOSC/PLL LP, XT, HS, RC, EC T1OSC CPU Peripherals IDLEN Postscaler MUX MUX 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz 125 kHz 250 kHz OSCCON<6:4> 111 110 101 100 011 010 001 000 31 kHz INTRC Source Internal Oscillator Block WDT, PWRT, FSCM 8 MHz Internal Oscillator (INTOSC) OSCCON<6:4> Clock Control OSCCON<1:0> Source 8 MHz 31 kHz (INTRC) OSCTUNE<6> 0 1 OSCTUNE<7> and Two-Speed Start-up Primary Oscillator © 2007 Microchip Technology Inc. Preliminary DS39631B-page 29 PIC18F2420/2520/4420/4520 2.7.1 OSCILLATOR CONTROL REGISTER The OSCCON register (Register 2-2) controls several aspects of the device clock’s operation, both in full power operation and in power managed modes. The System Clock Select bits, SCS1:SCS0, select the clock source. The available clock sources are the primary clock (defined by the FOSC3:FOSC0 configuration bits), the secondary clock (Timer1 oscillator) and the internal oscillator block. The clock source changes immediately after one or more of the bits is written to, following a brief clock transition interval. The SCS bits are cleared on all forms of Reset. The Internal Oscillator Frequency Select bits (IRCF2:IRCF0) select the frequency output of the internal oscillator block to drive the device clock. The choices are the INTRC source, the INTOSC source (8 MHz) or one of the frequencies derived from the INTOSC postscaler (31.25 kHz to 4 MHz). If the internal oscillator block is supplying the device clock, changing the states of these bits will have an immediate change on the internal oscillator’s output. On device Resets, the default output frequency of the internal oscillator block is set at 1 MHz. When a nominal output frequency of 31 kHz is selected (IRCF2:IRCF0 = 000), users may choose which internal oscillator acts as the source. This is done with the INTSRC bit in the OSCTUNE register (OSCTUNE<7>). Setting this bit selects INTOSC as a 31.25 kHz clock source by enabling the divide-by-256 output of the INTOSC postscaler. Clearing INTSRC selects INTRC (nominally 31 kHz) as the clock source. This option allows users to select the tunable and more precise INTOSC as a clock source, while maintaining power savings with a very low clock speed. Regardless of the setting of INTSRC, INTRC always remains the clock source for features such as the Watchdog Timer and the Fail-Safe Clock Monitor. The OSTS, IOFS and T1RUN bits indicate which clock source is currently providing the device clock. The OSTS bit indicates that the Oscillator Start-up Timer has timed out and the primary clock is providing the device clock in primary clock modes. The IOFS bit indicates when the internal oscillator block has stabilized and is providing the device clock in RC Clock modes. The T1RUN bit (T1CON<6>) indicates when the Timer1 oscillator is providing the device clock in secondary clock modes. In power managed modes, only one of these three bits will be set at any time. If none of these bits are set, the INTRC is providing the clock or the internal oscillator block has just started and is not yet stable. The IDLEN bit determines if the device goes into Sleep mode or one of the Idle modes when the SLEEP instruction is executed. The use of the flag and control bits in the OSCCON register is discussed in more detail in Section 3.0 “Power Managed Modes”. 2.7.2 OSCILLATOR TRANSITIONS PIC18F2420/2520/4420/4520 devices contain circuitry to prevent clock “glitches” when switching between clock sources. A short pause in the device clock occurs during the clock switch. The length of this pause is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Clock transitions are discussed in greater detail in Section 3.1.2 “Entering Power Managed Modes”. Note 1: The Timer1 oscillator must be enabled to select the secondary clock source. The Timer1 oscillator is enabled by setting the T1OSCEN bit in the Timer1 Control register (T1CON<3>). If the Timer1 oscillator is not enabled, then any attempt to select a secondary clock source will be ignored. 2: It is recommended that the Timer1 oscillator be operating and stable before selecting the secondary clock source or a very long delay may occur while the Timer1 oscillator starts. PIC18F2420/2520/4420/4520 DS39631B-page 30 Preliminary © 2007 Microchip Technology Inc. REGISTER 2-2: OSCCON REGISTER R/W-0 R/W-1 R/W-0 R/W-0 R(1) R-0 R/W-0 R/W-0 IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 bit 7 bit 0 bit 7 IDLEN: Idle Enable bit 1 = Device enters Idle mode on SLEEP instruction 0 = Device enters Sleep mode on SLEEP instruction bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits 111 = 8 MHz (INTOSC drives clock directly) 110 = 4 MHz 101 = 2 MHz 100 = 1 MHz(3) 011 = 500 kHz 010 = 250 kHz 001 = 125 kHz 000 = 31 kHz (from either INTOSC/256 or INTRC directly)(2) bit 3 OSTS: Oscillator Start-up Time-out Status bit(1) 1 = Oscillator start-up time-out timer has expired; primary oscillator is running 0 = Oscillator start-up time-out timer is running; primary oscillator is not ready bit 2 IOFS: INTOSC Frequency Stable bit 1 = INTOSC frequency is stable 0 = INTOSC frequency is not stable bit 1-0 SCS1:SCS0: System Clock Select bits 1x = Internal oscillator block 01 = Secondary (Timer1) oscillator 00 = Primary oscillator Note 1: Reset state depends on state of the IESO configuration bit. 2: Source selected by the INTSRC bit (OSCTUNE<7>), see text. 3: Default output frequency of INTOSC on Reset. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 31 PIC18F2420/2520/4420/4520 2.8 Effects of Power Managed Modes on the Various Clock Sources When PRI_IDLE mode is selected, the designated primary oscillator continues to run without interruption. For all other power managed modes, the oscillator using the OSC1 pin is disabled. The OSC1 pin (and OSC2 pin, if used by the oscillator) will stop oscillating. In secondary clock modes (SEC_RUN and SEC_IDLE), the Timer1 oscillator is operating and providing the device clock. The Timer1 oscillator may also run in all power managed modes if required to clock Timer1 or Timer3. In internal oscillator modes (RC_RUN and RC_IDLE), the internal oscillator block provides the device clock source. The 31 kHz INTRC output can be used directly to provide the clock and may be enabled to support various special features, regardless of the power managed mode (see Section 23.2 “Watchdog Timer (WDT)”, Section 23.3 “Two-Speed Start-up” and Section 23.4 “Fail-Safe Clock Monitor” for more information on WDT, Fail-Safe Clock Monitor and Two- Speed Start-up). The INTOSC output at 8 MHz may be used directly to clock the device or may be divided down by the postscaler. The INTOSC output is disabled if the clock is provided directly from the INTRC output. If the Sleep mode is selected, all clock sources are stopped. Since all the transistor switching currents have been stopped, Sleep mode achieves the lowest current consumption of the device (only leakage currents). Enabling any on-chip feature that will operate during Sleep will increase the current consumed during Sleep. The INTRC is required to support WDT operation. The Timer1 oscillator may be operating to support a realtime clock. Other features may be operating that do not require a device clock source (i.e., SSP slave, PSP, INTn pins and others). Peripherals that may add significant current consumption are listed in Section 26.2 “DC Characteristics”. 2.9 Power-up Delays Power-up delays are controlled by two timers, so that no external Reset circuitry is required for most applications. The delays ensure that the device is kept in Reset until the device power supply is stable under normal circumstances and the primary clock is operating and stable. For additional information on power-up delays, see Section 4.5 “Device Reset Timers”. The first timer is the Power-up Timer (PWRT), which provides a fixed delay on power-up (parameter 33, Table 26-10). It is enabled by clearing (= 0) the PWRTEN configuration bit. The second timer is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable (LP, XT and HS modes). The OST does this by counting 1024 oscillator cycles before allowing the oscillator to clock the device. When the HSPLL Oscillator mode is selected, the device is kept in Reset for an additional 2 ms, following the HS mode OST delay, so the PLL can lock to the incoming clock frequency. There is a delay of interval TCSD (parameter 38, Table 26-10), following POR, while the controller becomes ready to execute instructions. This delay runs concurrently with any other delays. This may be the only delay that occurs when any of the EC, RC or INTIO modes are used as the primary clock source. TABLE 2-3: OSC1 AND OSC2 PIN STATES IN SLEEP MODE OSC Mode OSC1 Pin OSC2 Pin RC, INTIO1 Floating, external resistor should pull high At logic low (clock/4 output) RCIO Floating, external resistor should pull high Configured as PORTA, bit 6 INTIO2 Configured as PORTA, bit 7 Configured as PORTA, bit 6 ECIO Floating, pulled by external clock Configured as PORTA, bit 6 EC Floating, pulled by external clock At logic low (clock/4 output) LP, XT and HS Feedback inverter disabled at quiescent voltage level Feedback inverter disabled at quiescent voltage level Note: See Table 4-2 in Section 4.0 “Reset” for time-outs due to Sleep and MCLR Reset. PIC18F2420/2520/4420/4520 DS39631B-page 32 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS39631B-page 33 PIC18F2420/2520/4420/4520 3.0 POWER MANAGED MODES PIC18F2420/2520/4420/4520 devices offer a total of seven operating modes for more efficient power management. These modes provide a variety of options for selective power conservation in applications where resources may be limited (i.e., battery-powered devices). There are three categories of power managed modes: • Run modes • Idle modes • Sleep mode These categories define which portions of the device are clocked and sometimes, what speed. The Run and Idle modes may use any of the three available clock sources (primary, secondary or internal oscillator block); the Sleep mode does not use a clock source. The power managed modes include several powersaving features offered on previous PIC® devices. One is the clock switching feature, offered in other PIC18 devices, allowing the controller to use the Timer1 oscillator in place of the primary oscillator. Also included is the Sleep mode, offered by all PIC devices, where all device clocks are stopped. 3.1 Selecting Power Managed Modes Selecting a power managed mode requires two decisions: if the CPU is to be clocked or not and the selection of a clock source. The IDLEN bit (OSCCON<7>) controls CPU clocking, while the SCS1:SCS0 bits (OSCCON<1:0>) select the clock source. The individual modes, bit settings, clock sources and affected modules are summarized in Table 3-1. 3.1.1 CLOCK SOURCES The SCS1:SCS0 bits allow the selection of one of three clock sources for power managed modes. They are: • the primary clock, as defined by the FOSC3:FOSC0 configuration bits • the secondary clock (the Timer1 oscillator) • the internal oscillator block (for RC modes) 3.1.2 ENTERING POWER MANAGED MODES Switching from one power managed mode to another begins by loading the OSCCON register. The SCS1:SCS0 bits select the clock source and determine which Run or Idle mode is to be used. Changing these bits causes an immediate switch to the new clock source, assuming that it is running. The switch may also be subject to clock transition delays. These are discussed in Section 3.1.3 “Clock Transitions and Status Indicators” and subsequent sections. Entry to the Power Managed Idle or Sleep modes is triggered by the execution of a SLEEP instruction. The actual mode that results depends on the status of the IDLEN bit. Depending on the current mode and the mode being switched to, a change to a power managed mode does not always require setting all of these bits. Many transitions may be done by changing the oscillator select bits, or changing the IDLEN bit, prior to issuing a SLEEP instruction. If the IDLEN bit is already configured correctly, it may only be necessary to perform a SLEEP instruction to switch to the desired mode. TABLE 3-1: POWER MANAGED MODES Mode OSCCON Bits Module Clocking IDLEN(1) Available Clock and Oscillator Source <7> SCS1:SCS0 <1:0> CPU Peripherals Sleep 0 N/A Off Off None – All clocks are disabled PRI_RUN N/A 00 Clocked Clocked Primary – LP, XT, HS, HSPLL, RC, EC and Internal Oscillator Block(2). This is the normal full power execution mode. SEC_RUN N/A 01 Clocked Clocked Secondary – Timer1 Oscillator RC_RUN N/A 1x Clocked Clocked Internal Oscillator Block(2) PRI_IDLE 1 00 Off Clocked Primary – LP, XT, HS, HSPLL, RC, EC SEC_IDLE 1 01 Off Clocked Secondary – Timer1 Oscillator RC_IDLE 1 1x Off Clocked Internal Oscillator Block(2) Note 1: IDLEN reflects its value when the SLEEP instruction is executed. 2: Includes INTOSC and INTOSC postscaler, as well as the INTRC source. PIC18F2420/2520/4420/4520 DS39631B-page 34 © 2007 Microchip Technology Inc. 3.1.3 CLOCK TRANSITIONS AND STATUS INDICATORS The length of the transition between clock sources is the sum of two cycles of the old clock source and three to four cycles of the new clock source. This formula assumes that the new clock source is stable. Three bits indicate the current clock source and its status. They are: • OSTS (OSCCON<3>) • IOFS (OSCCON<2>) • T1RUN (T1CON<6>) In general, only one of these bits will be set while in a given power managed mode. When the OSTS bit is set, the primary clock is providing the device clock. When the IOFS bit is set, the INTOSC output is providing a stable 8 MHz clock source to a divider that actually drives the device clock. When the T1RUN bit is set, the Timer1 oscillator is providing the clock. If none of these bits are set, then either the INTRC clock source is clocking the device, or the INTOSC source is not yet stable. If the internal oscillator block is configured as the primary clock source by the FOSC3:FOSC0 configuration bits, then both the OSTS and IOFS bits may be set when in PRI_RUN or PRI_IDLE modes. This indicates that the primary clock (INTOSC output) is generating a stable 8 MHz output. Entering another RC Power Managed mode at the same frequency would clear the OSTS bit. 3.1.4 MULTIPLE SLEEP COMMANDS The power managed mode that is invoked with the SLEEP instruction is determined by the setting of the IDLEN bit at the time the instruction is executed. If another SLEEP instruction is executed, the device will enter the power managed mode specified by IDLEN at that time. If IDLEN has changed, the device will enter the new power managed mode specified by the new setting. 3.2 Run Modes In the Run modes, clocks to both the core and peripherals are active. The difference between these modes is the clock source. 3.2.1 PRI_RUN MODE The PRI_RUN mode is the normal, full power execution mode of the microcontroller. This is also the default mode upon a device Reset, unless Two-Speed Start-up is enabled (see Section 23.3 “Two-Speed Start-up” for details). In this mode, the OSTS bit is set. The IOFS bit may be set if the internal oscillator block is the primary clock source (see Section 2.7.1 “Oscillator Control Register”). 3.2.2 SEC_RUN MODE The SEC_RUN mode is the compatible mode to the “clock switching” feature offered in other PIC18 devices. In this mode, the CPU and peripherals are clocked from the Timer1 oscillator. This gives users the option of lower power consumption while still using a high accuracy clock source. SEC_RUN mode is entered by setting the SCS1:SCS0 bits to ‘01’. The device clock source is switched to the Timer1 oscillator (see Figure 3-1), the primary oscillator is shut down, the T1RUN bit (T1CON<6>) is set and the OSTS bit is cleared. On transitions from SEC_RUN mode to PRI_RUN, the peripherals and CPU continue to be clocked from the Timer1 oscillator while the primary clock is started. When the primary clock becomes ready, a clock switch back to the primary clock occurs (see Figure 3-2). When the clock switch is complete, the T1RUN bit is cleared, the OSTS bit is set and the primary clock is providing the clock. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run. Note 1: Caution should be used when modifying a single IRCF bit. If VDD is less than 3V, it is possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated. 2: Executing a SLEEP instruction does not necessarily place the device into Sleep mode. It acts as the trigger to place the controller into either the Sleep mode or one of the Idle modes, depending on the setting of the IDLEN bit. Note: The Timer1 oscillator should already be running prior to entering SEC_RUN mode. If the T1OSCEN bit is not set when the SCS1:SCS0 bits are set to ‘01’, entry to SEC_RUN mode will not occur. If the Timer1 oscillator is enabled, but not yet running, device clocks will be delayed until the oscillator has started; in such situations, initial oscillator operation is far from stable and unpredictable operation may result. © 2007 Microchip Technology Inc. DS39631B-page 35 PIC18F2420/2520/4420/4520 FIGURE 3-1: TRANSITION TIMING FOR ENTRY TO SEC_RUN MODE FIGURE 3-2: TRANSITION TIMING FROM SEC_RUN MODE TO PRI_RUN MODE (HSPLL) 3.2.3 RC_RUN MODE In RC_RUN mode, the CPU and peripherals are clocked from the internal oscillator block using the INTOSC multiplexer. In this mode, the primary clock is shut down. When using the INTRC source, this mode provides the best power conservation of all the Run modes, while still executing code. It works well for user applications which are not highly timing sensitive or do not require high-speed clocks at all times. If the primary clock source is the internal oscillator block (either INTRC or INTOSC), there are no distinguishable differences between PRI_RUN and RC_RUN modes during execution. However, a clock switch delay will occur during entry to and exit from RC_RUN mode. Therefore, if the primary clock source is the internal oscillator block, the use of RC_RUN mode is not recommended. This mode is entered by setting the SCS1 bit to ‘1’. Although it is ignored, it is recommended that the SCS0 bit also be cleared; this is to maintain software compatibility with future devices. When the clock source is switched to the INTOSC multiplexer (see Figure 3-3), the primary oscillator is shut down and the OSTS bit is cleared. The IRCF bits may be modified at any time to immediately change the clock speed. Q2 Q3 Q4 OSC1 Peripheral Program Q1 T1OSI Q1 Counter Clock CPU Clock PC PC + 2 1 2 3 n-1 n Clock Transition(1) Q2 Q3 Q4 Q1 Q2 Q3 PC + 4 Note 1: Clock transition typically occurs within 2-4 TOSC. Q1 Q3 Q4 OSC1 Peripheral Program PC T1OSI PLL Clock Q1 PC + 4 Q2 Output Q3 Q4 Q1 CPU Clock PC + 2 Clock Counter Q2 Q2 Q3 Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. 2: Clock transition typically occurs within 2-4 TOSC. SCS1:SCS0 bits changed TPLL(1) 1 2 n-1 n Clock OSTS bit set Transition(2) TOST(1) Note: Caution should be used when modifying a single IRCF bit. If VDD is less than 3V, it is possible to select a higher clock speed than is supported by the low VDD. Improper device operation may result if the VDD/FOSC specifications are violated. PIC18F2420/2520/4420/4520 DS39631B-page 36 © 2007 Microchip Technology Inc. If the IRCF bits and the INTSRC bit are all clear, the INTOSC output is not enabled and the IOFS bit will remain clear; there will be no indication of the current clock source. The INTRC source is providing the device clocks. If the IRCF bits are changed from all clear (thus, enabling the INTOSC output) or if INTSRC is set, the IOFS bit becomes set after the INTOSC output becomes stable. Clocks to the device continue while the INTOSC source stabilizes after an interval of TIOBST. If the IRCF bits were previously at a non-zero value, or if INTSRC was set before setting SCS1 and the INTOSC source was already stable, the IOFS bit will remain set. On transitions from RC_RUN mode to PRI_RUN mode, the device continues to be clocked from the INTOSC multiplexer while the primary clock is started. When the primary clock becomes ready, a clock switch to the primary clock occurs (see Figure 3-4). When the clock switch is complete, the IOFS bit is cleared, the OSTS bit is set and the primary clock is providing the device clock. The IDLEN and SCS bits are not affected by the switch. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. FIGURE 3-3: TRANSITION TIMING TO RC_RUN MODE FIGURE 3-4: TRANSITION TIMING FROM RC_RUN MODE TO PRI_RUN MODE Q2 Q3 Q4 OSC1 Peripheral Program Q1 INTRC Q1 Counter Clock CPU Clock PC PC + 2 1 2 3 n-1 n Clock Transition(1) Q2 Q3 Q4 Q1 Q2 Q3 PC + 4 Note 1: Clock transition typically occurs within 2-4 TOSC. Q1 Q3 Q4 OSC1 Peripheral Program PC INTOSC PLL Clock Q1 PC + 4 Q2 Output Q3 Q4 Q1 CPU Clock PC + 2 Clock Counter Q2 Q2 Q3 Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. 2: Clock transition typically occurs within 2-4 TOSC. SCS1:SCS0 bits changed TPLL(1) 1 2 n-1 n Clock OSTS bit set Transition(2) Multiplexer TOST(1) © 2007 Microchip Technology Inc. DS39631B-page 37 PIC18F2420/2520/4420/4520 3.3 Sleep Mode The Power Managed Sleep mode in the PIC18F2420/ 2520/4420/4520 devices is identical to the legacy Sleep mode offered in all other PIC devices. It is entered by clearing the IDLEN bit (the default state on device Reset) and executing the SLEEP instruction. This shuts down the selected oscillator (Figure 3-5). All clock source status bits are cleared. Entering the Sleep mode from any other mode does not require a clock switch. This is because no clocks are needed once the controller has entered Sleep. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. When a wake event occurs in Sleep mode (by interrupt, Reset or WDT time-out), the device will not be clocked until the clock source selected by the SCS1:SCS0 bits becomes ready (see Figure 3-6), or it will be clocked from the internal oscillator block if either the Two- Speed Start-up or the Fail-Safe Clock Monitor are enabled (see Section 23.0 “Special Features of the CPU”). In either case, the OSTS bit is set when the primary clock is providing the device clocks. The IDLEN and SCS bits are not affected by the wake-up. 3.4 Idle Modes The Idle modes allow the controller’s CPU to be selectively shut down while the peripherals continue to operate. Selecting a particular Idle mode allows users to further manage power consumption. If the IDLEN bit is set to a ‘1’ when a SLEEP instruction is executed, the peripherals will be clocked from the clock source selected using the SCS1:SCS0 bits; however, the CPU will not be clocked. The clock source status bits are not affected. Setting IDLEN and executing a SLEEP instruction provides a quick method of switching from a given Run mode to its corresponding Idle mode. If the WDT is selected, the INTRC source will continue to operate. If the Timer1 oscillator is enabled, it will also continue to run. Since the CPU is not executing instructions, the only exits from any of the Idle modes are by interrupt, WDT time-out or a Reset. When a wake event occurs, CPU execution is delayed by an interval of TCSD (parameter 38, Table 26-10) while it becomes ready to execute code. When the CPU begins executing code, it resumes with the same clock source for the current Idle mode. For example, when waking from RC_IDLE mode, the internal oscillator block will clock the CPU and peripherals (in other words, RC_RUN mode). The IDLEN and SCS bits are not affected by the wake-up. While in any Idle mode or the Sleep mode, a WDT time-out will result in a WDT wake-up to the Run mode currently specified by the SCS1:SCS0 bits. FIGURE 3-5: TRANSITION TIMING FOR ENTRY TO SLEEP MODE FIGURE 3-6: TRANSITION TIMING FOR WAKE FROM SLEEP (HSPLL) Q2 Q3 Q4 OSC1 Peripheral Sleep Program Q1 Q1 Counter Clock CPU Clock PC PC + 2 Q3 Q4 Q1 Q2 OSC1 Peripheral Program PC PLL Clock Q3 Q4 Output CPU Clock Q1 Q2 Q3 Q4 Q1 Q2 Clock Counter PC + 6 PC + 4 Q1 Q2 Q3 Q4 Wake Event Note1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. TOST(1) TPLL(1) OSTS bit set PC + 2 PIC18F2420/2520/4420/4520 DS39631B-page 38 © 2007 Microchip Technology Inc. 3.4.1 PRI_IDLE MODE This mode is unique among the three Low-Power Idle modes, in that it does not disable the primary device clock. For timing sensitive applications, this allows for the fastest resumption of device operation with its more accurate primary clock source, since the clock source does not have to “warm-up” or transition from another oscillator. PRI_IDLE mode is entered from PRI_RUN mode by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set IDLEN first, then clear the SCS bits and execute SLEEP. Although the CPU is disabled, the peripherals continue to be clocked from the primary clock source specified by the FOSC3:FOSC0 configuration bits. The OSTS bit remains set (see Figure 3-7). When a wake event occurs, the CPU is clocked from the primary clock source. A delay of interval TCSD is required between the wake event and when code execution starts. This is required to allow the CPU to become ready to execute instructions. After the wakeup, the OSTS bit remains set. The IDLEN and SCS bits are not affected by the wake-up (see Figure 3-8). 3.4.2 SEC_IDLE MODE In SEC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the Timer1 oscillator. This mode is entered from SEC_RUN by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, set the IDLEN bit first, then set the SCS1:SCS0 bits to ‘01’ and execute SLEEP. When the clock source is switched to the Timer1 oscillator, the primary oscillator is shut down, the OSTS bit is cleared and the T1RUN bit is set. When a wake event occurs, the peripherals continue to be clocked from the Timer1 oscillator. After an interval of TCSD following the wake event, the CPU begins executing code being clocked by the Timer1 oscillator. The IDLEN and SCS bits are not affected by the wake-up; the Timer1 oscillator continues to run (see Figure 3-8). FIGURE 3-7: TRANSITION TIMING FOR ENTRY TO IDLE MODE FIGURE 3-8: TRANSITION TIMING FOR WAKE FROM IDLE TO RUN MODE Note: The Timer1 oscillator should already be running prior to entering SEC_IDLE mode. If the T1OSCEN bit is not set when the SLEEP instruction is executed, the SLEEP instruction will be ignored and entry to SEC_IDLE mode will not occur. If the Timer1 oscillator is enabled but not yet running, peripheral clocks will be delayed until the oscillator has started. In such situations, initial oscillator operation is far from stable and unpredictable operation may result. Q1 Peripheral Program PC PC + 2 OSC1 Q3 Q4 Q1 CPU Clock Clock Counter Q2 OSC1 Peripheral Program PC CPU Clock Q1 Q3 Q4 Clock Counter Q2 Wake Event TCSD © 2007 Microchip Technology Inc. DS39631B-page 39 PIC18F2420/2520/4420/4520 3.4.3 RC_IDLE MODE In RC_IDLE mode, the CPU is disabled but the peripherals continue to be clocked from the internal oscillator block using the INTOSC multiplexer. This mode allows for controllable power conservation during Idle periods. From RC_RUN, this mode is entered by setting the IDLEN bit and executing a SLEEP instruction. If the device is in another Run mode, first set IDLEN, then set the SCS1 bit and execute SLEEP. Although its value is ignored, it is recommended that SCS0 also be cleared; this is to maintain software compatibility with future devices. The INTOSC multiplexer may be used to select a higher clock frequency by modifying the IRCF bits before executing the SLEEP instruction. When the clock source is switched to the INTOSC multiplexer, the primary oscillator is shut down and the OSTS bit is cleared. If the IRCF bits are set to any non-zero value, or the INTSRC bit is set, the INTOSC output is enabled. The IOFS bit becomes set, after the INTOSC output becomes stable, after an interval of TIOBST (parameter 39, Table 26-10). Clocks to the peripherals continue while the INTOSC source stabilizes. If the IRCF bits were previously at a non-zero value, or INTSRC was set before the SLEEP instruction was executed and the INTOSC source was already stable, the IOFS bit will remain set. If the IRCF bits and INTSRC are all clear, the INTOSC output will not be enabled, the IOFS bit will remain clear and there will be no indication of the current clock source. When a wake event occurs, the peripherals continue to be clocked from the INTOSC multiplexer. After a delay of TCSD following the wake event, the CPU begins executing code being clocked by the INTOSC multiplexer. The IDLEN and SCS bits are not affected by the wakeup. The INTRC source will continue to run if either the WDT or the Fail-Safe Clock Monitor is enabled. 3.5 Exiting Idle and Sleep Modes An exit from Sleep mode or any of the Idle modes is triggered by an interrupt, a Reset or a WDT time-out. This section discusses the triggers that cause exits from power managed modes. The clocking subsystem actions are discussed in each of the power managed modes (see Section 3.2 “Run Modes”, Section 3.3 “Sleep Mode” and Section 3.4 “Idle Modes”). 3.5.1 EXIT BY INTERRUPT Any of the available interrupt sources can cause the device to exit from an Idle mode or the Sleep mode to a Run mode. To enable this functionality, an interrupt source must be enabled by setting its enable bit in one of the INTCON or PIE registers. The exit sequence is initiated when the corresponding interrupt flag bit is set. On all exits from Idle or Sleep modes by interrupt, code execution branches to the interrupt vector if the GIE/ GIEH bit (INTCON<7>) is set. Otherwise, code execution continues or resumes without branching (see Section 9.0 “Interrupts”). A fixed delay of interval TCSD following the wake event is required when leaving Sleep and Idle modes. This delay is required for the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. 3.5.2 EXIT BY WDT TIME-OUT A WDT time-out will cause different actions depending on which power managed mode the device is in when the time-out occurs. If the device is not executing code (all Idle modes and Sleep mode), the time-out will result in an exit from the power managed mode (see Section 3.2 “Run Modes” and Section 3.3 “Sleep Mode”). If the device is executing code (all Run modes), the time-out will result in a WDT Reset (see Section 23.2 “Watchdog Timer (WDT)”). The WDT timer and postscaler are cleared by executing a SLEEP or CLRWDT instruction, the loss of a currently selected clock source (if the Fail-Safe Clock Monitor is enabled) and modifying the IRCF bits in the OSCCON register if the internal oscillator block is the device clock source. 3.5.3 EXIT BY RESET Normally, the device is held in Reset by the Oscillator Start-up Timer (OST) until the primary clock becomes ready. At that time, the OSTS bit is set and the device begins executing code. If the internal oscillator block is the new clock source, the IOFS bit is set instead. The exit delay time from Reset to the start of code execution depends on both the clock sources before and after the wake-up and the type of oscillator if the new clock source is the primary clock. Exit delays are summarized in Table 3-2. Code execution can begin before the primary clock becomes ready. If either the Two-Speed Start-up (see Section 23.3 “Two-Speed Start-up”) or Fail-Safe Clock Monitor (see Section 23.4 “Fail-Safe Clock Monitor”) is enabled, the device may begin execution as soon as the Reset source has cleared. Execution is clocked by the INTOSC multiplexer driven by the internal oscillator block. Execution is clocked by the internal oscillator block until either the primary clock becomes ready or a power managed mode is entered before the primary clock becomes ready; the primary clock is then shut down. PIC18F2420/2520/4420/4520 DS39631B-page 40 © 2007 Microchip Technology Inc. 3.5.4 EXIT WITHOUT AN OSCILLATOR START-UP DELAY Certain exits from power managed modes do not invoke the OST at all. There are two cases: • PRI_IDLE mode, where the primary clock source is not stopped and • the primary clock source is not any of the LP, XT, HS or HSPLL modes. In these instances, the primary clock source either does not require an oscillator start-up delay since it is already running (PRI_IDLE), or normally does not require an oscillator start-up delay (RC, EC and INTIO Oscillator modes). However, a fixed delay of interval TCSD following the wake event is still required when leaving Sleep and Idle modes to allow the CPU to prepare for execution. Instruction execution resumes on the first clock cycle following this delay. TABLE 3-2: EXIT DELAY ON WAKE-UP BY RESET FROM SLEEP MODE OR ANY IDLE MODE (BY CLOCK SOURCES) Clock Source before Wake-up Clock Source after Wake-up Exit Delay Clock Ready Status Bit (OSCCON) Primary Device Clock (PRI_IDLE mode) LP, XT, HS TCSD HSPLL (1) OSTS EC, RC INTOSC(2) IOFS T1OSC or INTRC(1) LP, XT, HS TOST(3) HSPLL TOST + trc OSTS (3) EC, RC TCSD(1) INTOSC(1) TIOBST(4) IOFS INTOSC(2) LP, XT, HS TOST(4) HSPLL TOST + trc OSTS (3) EC, RC TCSD(1) INTOSC(1) None IOFS None (Sleep mode) LP, XT, HS TOST(3) HSPLL TOST + trc OSTS (3) EC, RC TCSD(1) INTOSC(1) TIOBST(4) IOFS Note 1: TCSD (parameter 38) is a required delay when waking from Sleep and all Idle modes and runs concurrently with any other required delays (see Section 3.4 “Idle Modes”). On Reset, INTOSC defaults to 1 MHz. 2: Includes both the INTOSC 8 MHz source and postscaler derived frequencies. 3: TOST is the Oscillator Start-up Timer (parameter 32). trc is the PLL Lock-out Timer (parameter F12); it is also designated as TPLL. 4: Execution continues during TIOBST (parameter 39), the INTOSC stabilization period. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 41 PIC18F2420/2520/4420/4520 4.0 RESET The PIC18F2420/2520/4420/4520 devices differentiate between various kinds of Reset: a) Power-on Reset (POR) b) MCLR Reset during normal operation c) MCLR Reset during power managed modes d) Watchdog Timer (WDT) Reset (during execution) e) Programmable Brown-out Reset (BOR) f) RESET Instruction g) Stack Full Reset h) Stack Underflow Reset This section discusses Resets generated by MCLR, POR and BOR and covers the operation of the various start-up timers. Stack Reset events are covered in Section 5.1.2.4 “Stack Full and Underflow Resets”. WDT Resets are covered in Section 23.2 “Watchdog Timer (WDT)”. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 4-1. 4.1 RCON Register Device Reset events are tracked through the RCON register (Register 4-1). The lower five bits of the register indicate that a specific Reset event has occurred. In most cases, these bits can only be cleared by the event and must be set by the application after the event. The state of these flag bits, taken together, can be read to indicate the type of Reset that just occurred. This is described in more detail in Section 4.6 “Reset State of Registers”. The RCON register also has control bits for setting interrupt priority (IPEN) and software control of the BOR (SBOREN). Interrupt priority is discussed in Section 9.0 “Interrupts”. BOR is covered in Section 4.4 “Brown-out Reset (BOR)”. FIGURE 4-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR VDD OSC1 WDT Time-out VDD Rise Detect OST/PWRT INTRC(1) POR Pulse OST 10-bit Ripple Counter PWRT 11-bit Ripple Counter Enable OST(2) Enable PWRT Note 1: This is the INTRC source from the internal oscillator block and is separate from the RC oscillator of the CLKI pin. 2: See Table 4-2 for time-out situations. Brown-out Reset BOREN RESET Instruction Stack Pointer Stack Full/Underflow Reset Sleep ( )_IDLE 1024 Cycles 32 μs 65.5 ms MCLRE S R Q Chip_Reset PIC18F2420/2520/4420/4520 DS39631B-page 42 Preliminary © 2007 Microchip Technology Inc. REGISTER 4-1: RCON REGISTER R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(2) R/W-0 IPEN SBOREN — RI TO PD POR BOR bit 7 bit 0 bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16CXXX Compatibility mode) bit 6 SBOREN: BOR Software Enable bit(1) If BOREN1:BOREN0 = 01: 1 = BOR is enabled 0 = BOR is disabled If BOREN1:BOREN0 = 00, 10 or 11: Bit is disabled and read as ‘0’. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit 1 = The RESET instruction was not executed (set by firmware only) 0 = The RESET instruction was executed causing a device Reset (must be set in software after a Brown-out Reset occurs) bit 3 TO: Watchdog Time-out Flag bit 1 = Set by power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 2 PD: Power-down Detection Flag bit 1 = Set by power-up or by the CLRWDT instruction 0 = Set by execution of the SLEEP instruction bit 1 POR: Power-on Reset Status bit(2) 1 = A Power-on Reset has not occurred (set by firmware only) 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = A Brown-out Reset has not occurred (set by firmware only) 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) Note 1: If SBOREN is enabled, its Reset state is ‘1’; otherwise, it is ‘0’. 2: The actual Reset value of POR is determined by the type of device Reset. See the notes following this register and Section 4.6 “Reset State of Registers” for additional information. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note 1: It is recommended that the POR bit be set after a Power-on Reset has been detected so that subsequent Power-on Resets may be detected. 2: Brown-out Reset is said to have occurred when BOR is ‘0’ and POR is ‘1’ (assuming that POR was set to ‘1’ by software immediately after POR). © 2007 Microchip Technology Inc. Preliminary DS39631B-page 43 PIC18F2420/2520/4420/4520 4.2 Master Clear (MCLR) The MCLR pin provides a method for triggering an external Reset of the device. A Reset is generated by holding the pin low. These devices have a noise filter in the MCLR Reset path which detects and ignores small pulses. The MCLR pin is not driven low by any internal Resets, including the WDT. In PIC18F2420/2520/4420/4520 devices, the MCLR input can be disabled with the MCLRE configuration bit. When MCLR is disabled, the pin becomes a digital input. See Section 10.5 “PORTE, TRISE and LATE Registers” for more information. 4.3 Power-on Reset (POR) A Power-on Reset pulse is generated on-chip whenever VDD rises above a certain threshold. This allows the device to start in the initialized state when VDD is adequate for operation. To take advantage of the POR circuitry, tie the MCLR pin through a resistor (1 kΩ to 10 kΩ) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset delay. A minimum rise rate for VDD is specified (parameter D004). For a slow rise time, see Figure 4-2. When the device starts normal operation (i.e., exits the Reset condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. POR events are captured by the POR bit (RCON<1>). The state of the bit is set to ‘0’ whenever a POR occurs; it does not change for any other Reset event. POR is not reset to ‘1’ by any hardware event. To capture multiple events, the user manually resets the bit to ‘1’ in software following any POR. FIGURE 4-2: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) Note 1: External Power-on Reset circuit is required only if the VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: R < 40 kΩ is recommended to make sure that the voltage drop across R does not violate the device’s electrical specification. 3: R1 ≥ 1 kΩ will limit any current flowing into MCLR from external capacitor C, in the event of MCLR/VPP pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). C R1 D R VDD MCLR PIC18FXXXX VDD PIC18F2420/2520/4420/4520 DS39631B-page 44 Preliminary © 2007 Microchip Technology Inc. 4.4 Brown-out Reset (BOR) PIC18F2420/2520/4420/4520 devices implement a BOR circuit that provides the user with a number of configuration and power-saving options. The BOR is controlled by the BORV1:BORV0 and BOREN1:BOREN0 configuration bits. There are a total of four BOR configurations which are summarized in Table 4-1. The BOR threshold is set by the BORV1:BORV0 bits. If BOR is enabled (any values of BOREN1:BOREN0, except ‘00’), any drop of VDD below VBOR (parameter D005) for greater than TBOR (parameter 35) will reset the device. A Reset may or may not occur if VDD falls below VBOR for less than TBOR. The chip will remain in Brown-out Reset until VDD rises above VBOR. If the Power-up Timer is enabled, it will be invoked after VDD rises above VBOR; it then will keep the chip in Reset for an additional time delay, TPWRT (parameter 33). If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be initialized. Once VDD rises above VBOR, the Power-up Timer will execute the additional time delay. BOR and the Power-on Timer (PWRT) are independently configured. Enabling BOR Reset does not automatically enable the PWRT. 4.4.1 SOFTWARE ENABLED BOR When BOREN1:BOREN0 = 01, the BOR can be enabled or disabled by the user in software. This is done with the control bit, SBOREN (RCON<6>). Setting SBOREN enables the BOR to function as previously described. Clearing SBOREN disables the BOR entirely. The SBOREN bit operates only in this mode; otherwise it is read as ‘0’. Placing the BOR under software control gives the user the additional flexibility of tailoring the application to its environment without having to reprogram the device to change BOR configuration. It also allows the user to tailor device power consumption in software by eliminating the incremental current that the BOR consumes. While the BOR current is typically very small, it may have some impact in low-power applications. 4.4.2 DETECTING BOR When BOR is enabled, the BOR bit always resets to ‘0’ on any BOR or POR event. This makes it difficult to determine if a BOR event has occurred just by reading the state of BOR alone. A more reliable method is to simultaneously check the state of both POR and BOR. This assumes that the POR bit is reset to ‘1’ in software immediately after any POR event. If BOR is ‘0’ while POR is ‘1’, it can be reliably assumed that a BOR event has occurred. 4.4.3 DISABLING BOR IN SLEEP MODE When BOREN1:BOREN0 = 10, the BOR remains under hardware control and operates as previously described. Whenever the device enters Sleep mode, however, the BOR is automatically disabled. When the device returns to any other operating mode, BOR is automatically re-enabled. This mode allows for applications to recover from brown-out situations, while actively executing code, when the device requires BOR protection the most. At the same time, it saves additional power in Sleep mode by eliminating the small incremental BOR current. TABLE 4-1: BOR CONFIGURATIONS Note: Even when BOR is under software control, the BOR Reset voltage level is still set by the BORV1:BORV0 configuration bits. It cannot be changed in software. BOR Configuration Status of SBOREN (RCON<6>) BOR Operation BOREN1 BOREN0 0 0 Unavailable BOR disabled; must be enabled by reprogramming the configuration bits. 0 1 Available BOR enabled in software; operation controlled by SBOREN. 1 0 Unavailable BOR enabled in hardware in Run and Idle modes, disabled during Sleep mode. 1 1 Unavailable BOR enabled in hardware; must be disabled by reprogramming the configuration bits. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 45 PIC18F2420/2520/4420/4520 4.5 Device Reset Timers PIC18F2420/2520/4420/4520 devices incorporate three separate on-chip timers that help regulate the Power-on Reset process. Their main function is to ensure that the device clock is stable before code is executed. These timers are: • Power-up Timer (PWRT) • Oscillator Start-up Timer (OST) • PLL Lock Time-out 4.5.1 POWER-UP TIMER (PWRT) The Power-up Timer (PWRT) of PIC18F2420/2520/ 4420/4520 devices is an 11-bit counter which uses the INTRC source as the clock input. This yields an approximate time interval of 2048 x 32 μs = 65.6ms. While the PWRT is counting, the device is held in Reset. The power-up time delay depends on the INTRC clock and will vary from chip to chip due to temperature and process variation. See DC parameter 33 for details. The PWRT is enabled by clearing the PWRTEN configuration bit. 4.5.2 OSCILLATOR START-UP TIMER (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over (parameter 33). This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP, HS and HSPLL modes and only on Power-on Reset, or on exit from most power managed modes. 4.5.3 PLL LOCK TIME-OUT With the PLL enabled in its PLL mode, the time-out sequence following a Power-on Reset is slightly different from other oscillator modes. A separate timer is used to provide a fixed time-out that is sufficient for the PLL to lock to the main oscillator frequency. This PLL lock time-out (TPLL) is typically 2 ms and follows the oscillator start-up time-out. 4.5.4 TIME-OUT SEQUENCE On power-up, the time-out sequence is as follows: 1. After the POR pulse has cleared, PWRT time-out is invoked (if enabled). 2. Then, the OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. Figure 4-3, Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7 all depict time-out sequences on power-up, with the Power-up Timer enabled and the device operating in HS Oscillator mode. Figures 4-3 through 4-6 also apply to devices operating in XT or LP modes. For devices in RC mode and with the PWRT disabled, on the other hand, there will be no time-out at all. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, all time-outs will expire. Bringing MCLR high will begin execution immediately (Figure 4-5). This is useful for testing purposes or to synchronize more than one PIC18FXXXX device operating in parallel. TABLE 4-2: TIME-OUT IN VARIOUS SITUATIONS Oscillator Configuration Power-up(2) and Brown-out Exit from PWRTEN = 0 PWRTEN = 1 Power Managed Mode HSPLL 66 ms(1) + 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) 1024 TOSC + 2 ms(2) HS, XT, LP 66 ms(1) + 1024 TOSC 1024 TOSC 1024 TOSC EC, ECIO 66 ms(1) — — RC, RCIO 66 ms(1) — — INTIO1, INTIO2 66 ms(1) — — Note 1: 66 ms (65.5 ms) is the nominal Power-up Timer (PWRT) delay. 2: 2 ms is the nominal time required for the PLL to lock. PIC18F2420/2520/4420/4520 DS39631B-page 46 Preliminary © 2007 Microchip Technology Inc. FIGURE 4-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD, VDD RISE < TPWRT) FIGURE 4-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 FIGURE 4-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET TPWRT TOST © 2007 Microchip Technology Inc. Preliminary DS39631B-page 47 PIC18F2420/2520/4420/4520 FIGURE 4-6: SLOW RISE TIME (MCLR TIED TO VDD, VDD RISE > TPWRT) FIGURE 4-7: TIME-OUT SEQUENCE ON POR W/PLL ENABLED (MCLR TIED TO VDD) VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET 0V 5V TPWRT TOST TPWRT TOST VDD MCLR INTERNAL POR PWRT TIME-OUT OST TIME-OUT INTERNAL RESET PLL TIME-OUT TPLL Note: TOST = 1024 clock cycles. TPLL ≈ 2 ms max. First three stages of the PWRT timer. PIC18F2420/2520/4420/4520 DS39631B-page 48 Preliminary © 2007 Microchip Technology Inc. 4.6 Reset State of Registers Most registers are unaffected by a Reset. Their status is unknown on POR and unchanged by all other Resets. The other registers are forced to a “Reset state” depending on the type of Reset that occurred. Most registers are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. Status bits from the RCON register, RI, TO, PD, POR and BOR, are set or cleared differently in different Reset situations, as indicated in Table 4-3. These bits are used in software to determine the nature of the Reset. Table 4-4 describes the Reset states for all of the Special Function Registers. These are categorized by Power-on and Brown-out Resets, Master Clear and WDT Resets and WDT wake-ups. TABLE 4-3: STATUS BITS, THEIR SIGNIFICANCE AND THE INITIALIZATION CONDITION FOR RCON REGISTER Condition Program Counter RCON Register STKPTR Register SBOREN RI TO PD POR BOR STKFUL STKUNF Power-on Reset 0000h 1 1 1 1 0 0 0 0 RESET Instruction 0000h u(2) 0 u u u u u u Brown-out Reset 0000h u(2) 1 1 1 u 0 u u MCLR during Power Managed Run Modes 0000h u(2) u 1 u u u u u MCLR during Power Managed Idle Modes and Sleep Mode 0000h u(2) u 1 0 u u u u WDT Time-out during Full Power or Power Managed Run Mode 0000h u(2) u 0 u u u u u MCLR during Full Power Execution 0000h u(2) u u u u u u u Stack Full Reset (STVREN = 1) 0000h u(2) u u u u u 1 u Stack Underflow Reset (STVREN = 1) 0000h u(2) u u u u u u 1 Stack Underflow Error (not an actual Reset, STVREN = 0) 0000h u(2) u u u u u u 1 WDT Time-out during Power Managed Idle or Sleep Modes PC + 2 u(2) u 0 0 u u u u Interrupt Exit from Power Managed Modes PC + 2(1) u(2) u u 0 u u u u Legend: u = unchanged Note 1: When the wake-up is due to an interrupt and the GIEH or GIEL bits are set, the PC is loaded with the interrupt vector (008h or 0018h). 2: Reset state is ‘1’ for POR and unchanged for all other Resets when software BOR is enabled (BOREN1:BOREN0 configuration bits = 01 and SBOREN = 1). Otherwise, the Reset state is ‘0’. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 49 PIC18F2420/2520/4420/4520 TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt TOSU 2420 2520 4420 4520 ---0 0000 ---0 0000 ---0 uuuu(3) TOSH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu(3) TOSL 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu(3) STKPTR 2420 2520 4420 4520 00-0 0000 uu-0 0000 uu-u uuuu(3) PCLATU 2420 2520 4420 4520 ---0 0000 ---0 0000 ---u uuuu PCLATH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu PCL 2420 2520 4420 4520 0000 0000 0000 0000 PC + 2(2) TBLPTRU 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu TBLPTRH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TBLPTRL 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TABLAT 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu PRODH 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PRODL 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu INTCON 2420 2520 4420 4520 0000 000x 0000 000u uuuu uuuu(1) INTCON2 2420 2520 4420 4520 1111 -1-1 1111 -1-1 uuuu -u-u(1) INTCON3 2420 2520 4420 4520 11-0 0-00 11-0 0-00 uu-u u-uu(1) INDF0 2420 2520 4420 4520 N/A N/A N/A POSTINC0 2420 2520 4420 4520 N/A N/A N/A POSTDEC0 2420 2520 4420 4520 N/A N/A N/A PREINC0 2420 2520 4420 4520 N/A N/A N/A PLUSW0 2420 2520 4420 4520 N/A N/A N/A FSR0H 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu FSR0L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu WREG 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu INDF1 2420 2520 4420 4520 N/A N/A N/A POSTINC1 2420 2520 4420 4520 N/A N/A N/A POSTDEC1 2420 2520 4420 4520 N/A N/A N/A PREINC1 2420 2520 4420 4520 N/A N/A N/A PLUSW1 2420 2520 4420 4520 N/A N/A N/A Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 50 Preliminary © 2007 Microchip Technology Inc. FSR1H 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu FSR1L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu BSR 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu INDF2 2420 2520 4420 4520 N/A N/A N/A POSTINC2 2420 2520 4420 4520 N/A N/A N/A POSTDEC2 2420 2520 4420 4520 N/A N/A N/A PREINC2 2420 2520 4420 4520 N/A N/A N/A PLUSW2 2420 2520 4420 4520 N/A N/A N/A FSR2H 2420 2520 4420 4520 ---- 0000 ---- 0000 ---- uuuu FSR2L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu STATUS 2420 2520 4420 4520 ---x xxxx ---u uuuu ---u uuuu TMR0H 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TMR0L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu T0CON 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu OSCCON 2420 2520 4420 4520 0100 q000 0100 q000 uuuu uuqu HLVDCON 2420 2520 4420 4520 0-00 0101 0-00 0101 u-uu uuuu WDTCON 2420 2520 4420 4520 ---- ---0 ---- ---0 ---- ---u RCON(4) 2420 2520 4420 4520 0q-1 11q0 0q-q qquu uq-u qquu TMR1H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu TMR1L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu T1CON 2420 2520 4420 4520 0000 0000 u0uu uuuu uuuu uuuu TMR2 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu PR2 2420 2520 4420 4520 1111 1111 1111 1111 1111 1111 T2CON 2420 2520 4420 4520 -000 0000 -000 0000 -uuu uuuu SSPBUF 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu SSPADD 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SSPSTAT 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SSPCON1 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SSPCON2 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 51 PIC18F2420/2520/4420/4520 ADRESH 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu ADRESL 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu ADCON1 2420 2520 4420 4520 --00 0qqq --00 0qqq --uu uuuu ADCON2 2420 2520 4420 4520 0-00 0000 0-00 0000 u-uu uuuu CCPR1H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCPR1L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu CCPR2H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCPR2L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu CCP2CON 2420 2520 4420 4520 --00 0000 --00 0000 --uu uuuu BAUDCON 2420 2520 4420 4520 01-0 0-00 01-0 0-00 --uu uuuu PWM1CON 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu ECCP1AS 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu 2420 2520 4420 4520 0000 00-- 0000 00-- uuuu uu-- CVRCON 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu CMCON 2420 2520 4420 4520 0000 0111 0000 0111 uuuu uuuu TMR3H 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu TMR3L 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu T3CON 2420 2520 4420 4520 0000 0000 uuuu uuuu uuuu uuuu SPBRGH 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu SPBRG 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu RCREG 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TXREG 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu TXSTA 2420 2520 4420 4520 0000 0010 0000 0010 uuuu uuuu RCSTA 2420 2520 4420 4520 0000 000x 0000 000x uuuu uuuu EEADR 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu EEDATA 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu EECON2 2420 2520 4420 4520 0000 0000 0000 0000 0000 0000 EECON1 2420 2520 4420 4520 xx-0 x000 uu-0 u000 uu-0 u000 TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 52 Preliminary © 2007 Microchip Technology Inc. IPR2 2420 2520 4420 4520 11-1 1111 11-1 1111 uu-u uuuu PIR2 2420 2520 4420 4520 00-0 0000 00-0 0000 uu-u uuuu(1) PIE2 2420 2520 4420 4520 00-0 0000 00-0 0000 uu-u uuuu IPR1 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu 2420 2520 4420 4520 -111 1111 -111 1111 -uuu uuuu PIR1 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu(1) 2420 2520 4420 4520 -000 0000 -000 0000 -uuu uuuu(1) PIE1 2420 2520 4420 4520 0000 0000 0000 0000 uuuu uuuu 2420 2520 4420 4520 -000 0000 -000 0000 -uuu uuuu OSCTUNE 2420 2520 4420 4520 00-0 0000 00-0 0000 uu-u uuuu TRISE 2420 2520 4420 4520 0000 -111 0000 -111 uuuu -uuu TRISD 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu TRISC 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu TRISB 2420 2520 4420 4520 1111 1111 1111 1111 uuuu uuuu TRISA(5) 2420 2520 4420 4520 1111 1111(5) 1111 1111(5) uuuu uuuu(5) LATE 2420 2520 4420 4520 ---- -xxx ---- -uuu ---- -uuu LATD 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu LATC 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu LATB 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu LATA(5) 2420 2520 4420 4520 xxxx xxxx(5) uuuu uuuu(5) uuuu uuuu(5) PORTE 2420 2520 4420 4520 ---- xxxx ---- uuuu ---- uuuu PORTD 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PORTC 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PORTB 2420 2520 4420 4520 xxxx xxxx uuuu uuuu uuuu uuuu PORTA(5) 2420 2520 4420 4520 xx0x 0000(5) uu0u 0000(5) uuuu uuuu(5) TABLE 4-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS (CONTINUED) Register Applicable Devices Power-on Reset, Brown-out Reset MCLR Resets, WDT Reset, RESET Instruction, Stack Resets Wake-up via WDT or Interrupt Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition. Shaded cells indicate conditions do not apply for the designated device. Note 1: One or more bits in the INTCONx or PIRx registers will be affected (to cause wake-up). 2: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the PC is loaded with the interrupt vector (0008h or 0018h). 3: When the wake-up is due to an interrupt and the GIEL or GIEH bit is set, the TOSU, TOSH and TOSL are updated with the current value of the PC. The STKPTR is modified to point to the next location in the hardware stack. 4: See Table 4-3 for Reset value for specific condition. 5: Bits 6 and 7 of PORTA, LATA and TRISA are enabled, depending on the oscillator mode selected. When not enabled as PORTA pins, they are disabled and read ‘0’. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 53 PIC18F2420/2520/4420/4520 5.0 MEMORY ORGANIZATION There are three types of memory in PIC18 Enhanced microcontroller devices: • Program Memory • Data RAM • Data EEPROM As Harvard architecture devices, the data and program memories use separate busses; this allows for concurrent access of the two memory spaces. The data EEPROM, for practical purposes, can be regarded as a peripheral device, since it is addressed and accessed through a set of control registers. Additional detailed information on the operation of the Flash program memory is provided in Section 6.0 “Flash Program Memory”. Data EEPROM is discussed separately in Section 7.0 “Data EEPROM Memory”. 5.1 Program Memory Organization PIC18 microcontrollers implement a 21-bit program counter, which is capable of addressing a 2-Mbyte program memory space. Accessing a location between the upper boundary of the physically implemented memory and the 2-Mbyte address will return all ‘0’s (a NOP instruction). The PIC18F2420 and PIC18F4420 each have 16 Kbytes of Flash memory and can store up to 8,192 single-word instructions. The PIC18F2520 and PIC18F4520 each have 32 Kbytes of Flash memory and can store up to 16,384 single-word instructions. PIC18 devices have two interrupt vectors. The Reset vector address is at 0000h and the interrupt vector addresses are at 0008h and 0018h. The program memory map for PIC18F2420/2520/ 4420/4520 devices is shown in Figure 5-1. FIGURE 5-1: PROGRAM MEMORY MAP AND STACK FOR PIC18F2420/2520/4420/4520 DEVICES PC<20:0> Stack Level 1 • Stack Level 31 Reset Vector Low Priority Interrupt Vector •• CALL,RCALL,RETURN RETFIE,RETLW 21 0000h 0018h On-Chip Program Memory High Priority Interrupt Vector 0008h User Memory Space 1FFFFFh 4000h 3FFFh Read ‘0’ 200000h PIC18FX4X0 PIC18FX5X0 8000h 7FFFh On-Chip Program Memory Read ‘0’ PIC18F2420/2520/4420/4520 DS39631B-page 54 Preliminary © 2007 Microchip Technology Inc. 5.1.1 PROGRAM COUNTER The Program Counter (PC) specifies the address of the instruction to fetch for execution. The PC is 21 bits wide and is contained in three separate 8-bit registers. The low byte, known as the PCL register, is both readable and writable. The high byte, or PCH register, contains the PC<15:8> bits; it is not directly readable or writable. Updates to the PCH register are performed through the PCLATH register. The upper byte is called PCU. This register contains the PC<20:16> bits; it is also not directly readable or writable. Updates to the PCU register are performed through the PCLATU register. The contents of PCLATH and PCLATU are transferred to the program counter by any operation that writes PCL. Similarly, the upper two bytes of the program counter are transferred to PCLATH and PCLATU by an operation that reads PCL. This is useful for computed offsets to the PC (see Section 5.1.4.1 “Computed GOTO”). The PC addresses bytes in the program memory. To prevent the PC from becoming misaligned with word instructions, the Least Significant bit of PCL is fixed to a value of ‘0’. The PC increments by 2 to address sequential instructions in the program memory. The CALL, RCALL, GOTO and program branch instructions write to the program counter directly. For these instructions, the contents of PCLATH and PCLATU are not transferred to the program counter. 5.1.2 RETURN ADDRESS STACK The return address stack allows any combination of up to 31 program calls and interrupts to occur. The PC is pushed onto the stack when a CALL or RCALL instruction is executed or an interrupt is Acknowledged. The PC value is pulled off the stack on a RETURN, RETLW or a RETFIE instruction. PCLATU and PCLATH are not affected by any of the RETURN or CALL instructions. The stack operates as a 31-word by 21-bit RAM and a 5-bit stack pointer, STKPTR. The stack space is not part of either program or data space. The stack pointer is readable and writable and the address on the top of the stack is readable and writable through the top-ofstack Special File Registers. Data can also be pushed to, or popped from the stack, using these registers. A CALL type instruction causes a push onto the stack; the stack pointer is first incremented and the location pointed to by the stack pointer is written with the contents of the PC (already pointing to the instruction following the CALL). A RETURN type instruction causes a pop from the stack; the contents of the location pointed to by the STKPTR are transferred to the PC and then the stack pointer is decremented. The stack pointer is initialized to ‘00000’ after all Resets. There is no RAM associated with the location corresponding to a stack pointer value of ‘00000’; this is only a Reset value. Status bits indicate if the stack is full or has overflowed or has underflowed. 5.1.2.1 Top-of-Stack Access Only the top of the return address stack (TOS) is readable and writable. A set of three registers, TOSU:TOSH:TOSL, hold the contents of the stack location pointed to by the STKPTR register (Figure 5-2). This allows users to implement a software stack if necessary. After a CALL, RCALL or interrupt, the software can read the pushed value by reading the TOSU:TOSH:TOSL registers. These values can be placed on a user defined software stack. At return time, the software can return these values to TOSU:TOSH:TOSL and do a return. The user must disable the global interrupt enable bits while accessing the stack to prevent inadvertent stack corruption. FIGURE 5-2: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS 00011 001A34h 11111 11110 11101 00010 00001 00000 00010 Return Address Stack <20:0> Top-of-Stack 000D58h TOSU TOSH TOSL 00h 1Ah 34h STKPTR<4:0> Top-of-Stack Registers Stack Pointer © 2007 Microchip Technology Inc. Preliminary DS39631B-page 55 PIC18F2420/2520/4420/4520 5.1.2.2 Return Stack Pointer (STKPTR) The STKPTR register (Register 5-1) contains the stack pointer value, the STKFUL (stack full) status bit and the STKUNF (stack underflow) status bits. The value of the stack pointer can be 0 through 31. The stack pointer increments before values are pushed onto the stack and decrements after values are popped off the stack. On Reset, the stack pointer value will be zero. The user may read and write the stack pointer value. This feature can be used by a Real-Time Operating System (RTOS) for return stack maintenance. After the PC is pushed onto the stack 31 times (without popping any values off the stack), the STKFUL bit is set. The STKFUL bit is cleared by software or by a POR. The action that takes place when the stack becomes full depends on the state of the STVREN (Stack Overflow Reset Enable) configuration bit. (Refer to Section 23.1 “Configuration Bits” for a description of the device configuration bits.) If STVREN is set (default), the 31st push will push the (PC + 2) value onto the stack, set the STKFUL bit and reset the device. The STKFUL bit will remain set and the stack pointer will be set to zero. If STVREN is cleared, the STKFUL bit will be set on the 31st push and the stack pointer will increment to 31. Any additional pushes will not overwrite the 31st push and STKPTR will remain at 31. When the stack has been popped enough times to unload the stack, the next pop will return a value of zero to the PC and sets the STKUNF bit, while the stack pointer remains at zero. The STKUNF bit will remain set until cleared by software or until a POR occurs. 5.1.2.3 PUSH and POP Instructions Since the Top-of-Stack is readable and writable, the ability to push values onto the stack and pull values off the stack without disturbing normal program execution is a desirable feature. The PIC18 instruction set includes two instructions, PUSH and POP, that permit the TOS to be manipulated under software control. TOSU, TOSH and TOSL can be modified to place data or a return address on the stack. The PUSH instruction places the current PC value onto the stack. This increments the stack pointer and loads the current PC value onto the stack. The POP instruction discards the current TOS by decrementing the stack pointer. The previous value pushed onto the stack then becomes the TOS value. REGISTER 5-1: STKPTR REGISTER Note: Returning a value of zero to the PC on an underflow has the effect of vectoring the program to the Reset vector, where the stack conditions can be verified and appropriate actions can be taken. This is not the same as a Reset, as the contents of the SFRs are not affected. R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 STKFUL(1) STKUNF(1) — SP4 SP3 SP2 SP1 SP0 bit 7 bit 0 bit 7 STKFUL: Stack Full Flag bit(1) 1 = Stack became full or overflowed 0 = Stack has not become full or overflowed bit 6 STKUNF: Stack Underflow Flag bit(1) 1 = Stack underflow occurred 0 = Stack underflow did not occur bit 5 Unimplemented: Read as ‘0’ bit 4-0 SP4:SP0: Stack Pointer Location bits Note 1: Bit 7 and bit 6 are cleared by user software or by a POR. Legend: R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 56 Preliminary © 2007 Microchip Technology Inc. 5.1.2.4 Stack Full and Underflow Resets Device Resets on stack overflow and stack underflow conditions are enabled by setting the STVREN bit in Configuration Register 4L. When STVREN is set, a full or underflow will set the appropriate STKFUL or STKUNF bit and then cause a device Reset. When STVREN is cleared, a full or underflow condition will set the appropriate STKFUL or STKUNF bit but not cause a device Reset. The STKFUL or STKUNF bits are cleared by the user software or a Power-on Reset. 5.1.3 FAST REGISTER STACK A fast register stack is provided for the Status, WREG and BSR registers, to provide a “fast return” option for interrupts. The stack for each register is only one level deep and is neither readable nor writable. It is loaded with the current value of the corresponding register when the processor vectors for an interrupt. All interrupt sources will push values into the stack registers. The values in the registers are then loaded back into their associated registers if the RETFIE, FAST instruction is used to return from the interrupt. If both low and high priority interrupts are enabled, the stack registers cannot be used reliably to return from low priority interrupts. If a high priority interrupt occurs while servicing a low priority interrupt, the stack register values stored by the low priority interrupt will be overwritten. In these cases, users must save the key registers in software during a low priority interrupt. If interrupt priority is not used, all interrupts may use the fast register stack for returns from interrupt. If no interrupts are used, the fast register stack can be used to restore the Status, WREG and BSR registers at the end of a subroutine call. To use the fast register stack for a subroutine call, a CALL label, FAST instruction must be executed to save the Status, WREG and BSR registers to the fast register stack. A RETURN, FAST instruction is then executed to restore these registers from the fast register stack. Example 5-1 shows a source code example that uses the fast register stack during a subroutine call and return. EXAMPLE 5-1: FAST REGISTER STACK CODE EXAMPLE 5.1.4 LOOK-UP TABLES IN PROGRAM MEMORY There may be programming situations that require the creation of data structures, or look-up tables, in program memory. For PIC18 devices, look-up tables can be implemented in two ways: • Computed GOTO • Table Reads 5.1.4.1 Computed GOTO A computed GOTO is accomplished by adding an offset to the program counter. An example is shown in Example 5-2. A look-up table can be formed with an ADDWF PCL instruction and a group of RETLW nn instructions. The W register is loaded with an offset into the table before executing a call to that table. The first instruction of the called routine is the ADDWF PCL instruction. The next instruction executed will be one of the RETLW nn instructions that returns the value ‘nn’ to the calling function. The offset value (in WREG) specifies the number of bytes that the program counter should advance and should be multiples of 2 (LSb = 0). In this method, only one data byte may be stored in each instruction location and room on the return address stack is required. EXAMPLE 5-2: COMPUTED GOTO USING AN OFFSET VALUE 5.1.4.2 Table Reads and Table Writes A better method of storing data in program memory allows two bytes of data to be stored in each instruction location. Look-up table data may be stored two bytes per program word by using table reads and writes. The Table Pointer (TBLPTR) register specifies the byte address and the Table Latch (TABLAT) register contains the data that is read from or written to program memory. Data is transferred to or from program memory one byte at a time. Table read and table write operations are discussed further in Section 6.1 “Table Reads and Table Writes”. CALL SUB1, FAST ;STATUS, WREG, BSR ;SAVED IN FAST REGISTER ;STACK •• SUB1 •• RETURN, FAST ;RESTORE VALUES SAVED ;IN FAST REGISTER STACK MOVF OFFSET, W CALL TABLE ORG nn00h TABLE ADDWF PCL RETLW nnh RETLW nnh RETLW nnh . . . © 2007 Microchip Technology Inc. Preliminary DS39631B-page 57 PIC18F2420/2520/4420/4520 5.2 PIC18 Instruction Cycle 5.2.1 CLOCKING SCHEME The microcontroller clock input, whether from an internal or external source, is internally divided by four to generate four non-overlapping quadrature clocks (Q1, Q2, Q3 and Q4). Internally, the program counter is incremented on every Q1; the instruction is fetched from the program memory and latched into the instruction register during Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow are shown in Figure 5-3. 5.2.2 INSTRUCTION FLOW/PIPELINING An “Instruction Cycle” consists of four Q cycles: Q1 through Q4. The instruction fetch and execute are pipelined in such a manner that a fetch takes one instruction cycle, while the decode and execute take another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO), then two cycles are required to complete the instruction (Example 5-3). A fetch cycle begins with the Program Counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the Instruction Register (IR) in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 5-3: CLOCK/INSTRUCTION CYCLE EXAMPLE 5-3: INSTRUCTION PIPELINE FLOW Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Q3 Q4 PC OSC2/CLKO (RC mode) PC PC + 2 PC + 4 Fetch INST (PC) Execute INST (PC – 2) Fetch INST (PC + 2) Execute INST (PC) Fetch INST (PC + 4) Execute INST (PC + 2) Internal Phase Clock All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is “flushed” from the pipeline while the new instruction is being fetched and then executed. TCY0 TCY1 TCY2 TCY3 TCY4 TCY5 1. MOVLW 55h Fetch 1 Execute 1 2. MOVWF PORTB Fetch 2 Execute 2 3. BRA SUB_1 Fetch 3 Execute 3 4. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP) 5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1 PIC18F2420/2520/4420/4520 DS39631B-page 58 Preliminary © 2007 Microchip Technology Inc. 5.2.3 INSTRUCTIONS IN PROGRAM MEMORY The program memory is addressed in bytes. Instructions are stored as two bytes or four bytes in program memory. The Least Significant Byte of an instruction word is always stored in a program memory location with an even address (LSb = 0). To maintain alignment with instruction boundaries, the PC increments in steps of 2 and the LSb will always read ‘0’ (see Section 5.1.1 “Program Counter”). Figure 5-4 shows an example of how instruction words are stored in the program memory. The CALL and GOTO instructions have the absolute program memory address embedded into the instruction. Since instructions are always stored on word boundaries, the data contained in the instruction is a word address. The word address is written to PC<20:1>, which accesses the desired byte address in program memory. Instruction #2 in Figure 5-4 shows how the instruction GOTO 0006h is encoded in the program memory. Program branch instructions, which encode a relative address offset, operate in the same manner. The offset value stored in a branch instruction represents the number of single-word instructions that the PC will be offset by. Section 24.0 “Instruction Set Summary” provides further details of the instruction set. FIGURE 5-4: INSTRUCTIONS IN PROGRAM MEMORY 5.2.4 TWO-WORD INSTRUCTIONS The standard PIC18 instruction set has four two-word instructions: CALL, MOVFF, GOTO and LSFR. In all cases, the second word of the instructions always has ‘1111’ as its four Most Significant bits; the other 12 bits are literal data, usually a data memory address. The use of ‘1111’ in the 4 MSbs of an instruction specifies a special form of NOP. If the instruction is executed in proper sequence – immediately after the first word – the data in the second word is accessed and used by the instruction sequence. If the first word is skipped for some reason and the second word is executed by itself, a NOP is executed instead. This is necessary for cases when the two-word instruction is preceded by a conditional instruction that changes the PC. Example 5-4 shows how this works. EXAMPLE 5-4: TWO-WORD INSTRUCTIONS Word Address LSB = 1 LSB = 0 ↓ Program Memory Byte Locations → 000000h 000002h 000004h 000006h Instruction 1: MOVLW 055h 0Fh 55h 000008h Instruction 2: GOTO 0006h EFh 03h 00000Ah F0h 00h 00000Ch Instruction 3: MOVFF 123h, 456h C1h 23h 00000Eh F4h 56h 000010h 000012h 000014h Note: See Section 5.6 “PIC18 Instruction Execution and the Extended Instruction Set” for information on two-word instructions in the extended instruction set. CASE 1: Object Code Source Code 0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0? 1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word 1111 0100 0101 0110 ; Execute this word as a NOP 0010 0100 0000 0000 ADDWF REG3 ; continue code CASE 2: Object Code Source Code 0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0? 1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word 1111 0100 0101 0110 ; 2nd word of instruction 0010 0100 0000 0000 ADDWF REG3 ; continue code © 2007 Microchip Technology Inc. Preliminary DS39631B-page 59 PIC18F2420/2520/4420/4520 5.3 Data Memory Organization The data memory in PIC18 devices is implemented as static RAM. Each register in the data memory has a 12-bit address, allowing up to 4096 bytes of data memory. The memory space is divided into as many as 16 banks that contain 256 bytes each; PIC18F2420/ 2520/4420/4520 devices implement all 16 banks. Figure 5-5 shows the data memory organization for the PIC18F2420/2520/4420/4520 devices. The data memory contains Special Function Registers (SFRs) and General Purpose Registers (GPRs). The SFRs are used for control and status of the controller and peripheral functions, while GPRs are used for data storage and scratchpad operations in the user’s application. Any read of an unimplemented location will read as ‘0’s. The instruction set and architecture allow operations across all banks. The entire data memory may be accessed by Direct, Indirect or Indexed Addressing modes. Addressing modes are discussed later in this subsection. To ensure that commonly used registers (SFRs and select GPRs) can be accessed in a single cycle, PIC18 devices implement an Access Bank. This is a 256-byte memory space that provides fast access to SFRs and the lower portion of GPR Bank 0 without using the BSR. Section 5.3.2 “Access Bank” provides a detailed description of the Access RAM. 5.3.1 BANK SELECT REGISTER (BSR) Large areas of data memory require an efficient addressing scheme to make rapid access to any address possible. Ideally, this means that an entire address does not need to be provided for each read or write operation. For PIC18 devices, this is accomplished with a RAM banking scheme. This divides the memory space into 16 contiguous banks of 256 bytes. Depending on the instruction, each location can be addressed directly by its full 12-bit address, or an 8-bit low-order address and a 4-bit bank pointer. Most instructions in the PIC18 instruction set make use of the bank pointer, known as the Bank Select Register (BSR). This SFR holds the 4 Most Significant bits of a location’s address; the instruction itself includes the 8 Least Significant bits. Only the four lower bits of the BSR are implemented (BSR3:BSR0). The upper four bits are unused; they will always read ‘0’ and cannot be written to. The BSR can be loaded directly by using the MOVLB instruction. The value of the BSR indicates the bank in data memory; the 8 bits in the instruction show the location in the bank and can be thought of as an offset from the bank’s lower boundary. The relationship between the BSR’s value and the bank division in data memory is shown in Figure 5-7. Since up to 16 registers may share the same low-order address, the user must always be careful to ensure that the proper bank is selected before performing a data read or write. For example, writing what should be program data to an 8-bit address of F9h while the BSR is 0Fh will end up resetting the program counter. While any bank can be selected, only those banks that are actually implemented can be read or written to. Writes to unimplemented banks are ignored, while reads from unimplemented banks will return ‘0’s. Even so, the Status register will still be affected as if the operation was successful. The data memory map in Figure 5-5 indicates which banks are implemented. In the core PIC18 instruction set, only the MOVFF instruction fully specifies the 12-bit address of the source and target registers. This instruction ignores the BSR completely when it executes. All other instructions include only the low-order address as an operand and must use either the BSR or the Access Bank to locate their target registers. Note: The operation of some aspects of data memory are changed when the PIC18 extended instruction set is enabled. See Section 5.5 “Data Memory and the Extended Instruction Set” for more information. PIC18F2420/2520/4420/4520 DS39631B-page 60 Preliminary © 2007 Microchip Technology Inc. FIGURE 5-5: DATA MEMORY MAP FOR PIC18F2420/4420 DEVICES Bank 0 Bank 1 Bank 14 Bank 15 BSR<3:0> Data Memory Map = 0000 = 0001 = 1111 080h 07Fh F80h FFFh 00h 7Fh 80h FFh Access Bank When ‘a’ = 0: The BSR is ignored and the Access Bank is used. The first 128 bytes are general purpose RAM (from Bank 0). The second 128 bytes are Special Function Registers (from Bank 15). When ‘a’ = 1: The BSR specifies the Bank used by the instruction. F7Fh F00h EFFh 1FFh 100h 0FFh Access RAM 000h FFh 00h FFh 00h FFh 00h GPR GPR SFR Access RAM High Access RAM Low Bank 2 = 0110 = 0010 (SFRs) 2FFh 200h 3FFh 300h 4FFh 400h 5FFh 500h 6FFh 600h 7FFh 700h 8FFh 800h 9FFh 900h AFFh A00h BFFh B00h CFFh C00h DFFh D00h E00h Bank 3 Bank 4 Bank 5 Bank 6 Bank 7 Bank 8 Bank 9 Bank 10 Bank 11 Bank 12 Bank 13 FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h GPR FFh 00h = 0011 = 0100 = 0101 = 0111 = 1000 = 1001 = 1010 = 1011 = 1100 = 1101 = 1110 Unused Read 00h Unused © 2007 Microchip Technology Inc. Preliminary DS39631B-page 61 PIC18F2420/2520/4420/4520 FIGURE 5-6: DATA MEMORY MAP FOR PIC18F2520/4520 DEVICES Bank 0 Bank 1 Bank 14 Bank 15 BSR<3:0> Data Memory Map = 0000 = 0001 = 1111 080h 07Fh F80h FFFh 00h 7Fh 80h FFh Access Bank When ‘a’ = 0: The BSR is ignored and the Access Bank is used. The first 128 bytes are general purpose RAM (from Bank 0). The second 128 bytes are Special Function Registers (from Bank 15). When ‘a’ = 1: The BSR specifies the Bank used by the instruction. F7Fh F00h EFFh 1FFh 100h 0FFh Access RAM 000h FFh 00h FFh 00h FFh 00h GPR GPR SFR Access RAM High Access RAM Low Bank 2 = 0110 = 0010 (SFRs) 2FFh 200h 3FFh 300h 4FFh 400h 5FFh 500h 6FFh 600h 7FFh 700h 8FFh 800h 9FFh 900h AFFh A00h BFFh B00h CFFh C00h DFFh D00h E00h Bank 3 Bank 4 Bank 5 Bank 6 Bank 7 Bank 8 Bank 9 Bank 10 Bank 11 Bank 12 Bank 13 FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h GPR FFh 00h = 0011 = 0100 = 0101 = 0111 = 1000 = 1001 = 1010 = 1011 = 1100 = 1101 = 1110 Unused Read 00h Unused GPR GPR GPR PIC18F2420/2520/4420/4520 DS39631B-page 62 Preliminary © 2007 Microchip Technology Inc. FIGURE 5-7: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING) 5.3.2 ACCESS BANK While the use of the BSR with an embedded 8-bit address allows users to address the entire range of data memory, it also means that the user must always ensure that the correct bank is selected. Otherwise, data may be read from or written to the wrong location. This can be disastrous if a GPR is the intended target of an operation, but an SFR is written to instead. Verifying and/or changing the BSR for each read or write to data memory can become very inefficient. To streamline access for the most commonly used data memory locations, the data memory is configured with an Access Bank, which allows users to access a mapped block of memory without specifying a BSR. The Access Bank consists of the first 128 bytes of memory (00h-7Fh) in Bank 0 and the last 128 bytes of memory (80h-FFh) in Block 15. The lower half is known as the “Access RAM” and is composed of GPRs. This upper half is also where the device’s SFRs are mapped. These two areas are mapped contiguously in the Access Bank and can be addressed in a linear fashion by an 8-bit address (Figure 5-5). The Access Bank is used by core PIC18 instructions that include the Access RAM bit (the ‘a’ parameter in the instruction). When ‘a’ is equal to ‘1’, the instruction uses the BSR and the 8-bit address included in the opcode for the data memory address. When ‘a’ is ‘0’, however, the instruction is forced to use the Access Bank address map; the current value of the BSR is ignored entirely. Using this “forced” addressing allows the instruction to operate on a data address in a single cycle, without updating the BSR first. For 8-bit addresses of 80h and above, this means that users can evaluate and operate on SFRs more efficiently. The Access RAM below 80h is a good place for data values that the user might need to access rapidly, such as immediate computational results or common program variables. Access RAM also allows for faster and more code efficient context saving and switching of variables. The mapping of the Access Bank is slightly different when the extended instruction set is enabled (XINST configuration bit = 1). This is discussed in more detail in Section 5.5.3 “Mapping the Access Bank in Indexed Literal Offset Mode”. 5.3.3 GENERAL PURPOSE REGISTER FILE PIC18 devices may have banked memory in the GPR area. This is data RAM, which is available for use by all instructions. GPRs start at the bottom of Bank 0 (address 000h) and grow upwards towards the bottom of the SFR area. GPRs are not initialized by a Power-on Reset and are unchanged on all other Resets. Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR<3:0>) to the registers of the Access Bank. 2: The MOVFF instruction embeds the entire 12-bit address in the instruction. Data Memory Bank Select(2) 7 0 From Opcode(2) 0 0 0 0 000h 100h 200h 300h F00h E00h FFFh Bank 0 Bank 1 Bank 2 Bank 14 Bank 15 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh 00h FFh Bank 3 through Bank 13 0 0 1 1 1 1 1 1 1 1 1 1 7 0 BSR(1) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 63 PIC18F2420/2520/4420/4520 5.3.4 SPECIAL FUNCTION REGISTERS The Special Function Registers (SFRs) are registers used by the CPU and peripheral modules for controlling the desired operation of the device. These registers are implemented as static RAM. SFRs start at the top of data memory (FFFh) and extend downward to occupy the top half of Bank 15 (F80h to FFFh). A list of these registers is given in Table 5-1 and Table 5-2. The SFRs can be classified into two sets: those associated with the “core” device functionality (ALU, Resets and interrupts) and those related to the peripheral functions. The reset and interrupt registers are described in their respective chapters, while the ALU’s Status register is described later in this section. Registers related to the operation of a peripheral feature are described in the chapter for that peripheral. The SFRs are typically distributed among the peripherals whose functions they control. Unused SFR locations are unimplemented and read as ‘0’s. TABLE 5-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18F2420/2520/4420/4520 DEVICES Address Name Address Name Address Name Address Name FFFh TOSU FDFh INDF2(1) FBFh CCPR1H F9Fh IPR1 FFEh TOSH FDEh POSTINC2(1) FBEh CCPR1L F9Eh PIR1 FFDh TOSL FDDh POSTDEC2(1) FBDh CCP1CON F9Dh PIE1 FFCh STKPTR FDCh PREINC2(1) FBCh CCPR2H F9Ch —(2) FFBh PCLATU FDBh PLUSW2(1) FBBh CCPR2L F9Bh OSCTUNE FFAh PCLATH FDAh FSR2H FBAh CCP2CON F9Ah —(2) FF9h PCL FD9h FSR2L FB9h —(2) F99h —(2) FF8h TBLPTRU FD8h STATUS FB8h BAUDCON F98h —(2) FF7h TBLPTRH FD7h TMR0H FB7h PWM1CON(3) F97h —(2) FF6h TBLPTRL FD6h TMR0L FB6h ECCP1AS(3) F96h TRISE(3) FF5h TABLAT FD5h T0CON FB5h CVRCON F95h TRISD(3) FF4h PRODH FD4h —(2) FB4h CMCON F94h TRISC FF3h PRODL FD3h OSCCON FB3h TMR3H F93h TRISB FF2h INTCON FD2h HLVDCON FB2h TMR3L F92h TRISA FF1h INTCON2 FD1h WDTCON FB1h T3CON F91h —(2) FF0h INTCON3 FD0h RCON FB0h SPBRGH F90h —(2) FEFh INDF0(1) FCFh TMR1H FAFh SPBRG F8Fh —(2) FEEh POSTINC0(1) FCEh TMR1L FAEh RCREG F8Eh —(2) FEDh POSTDEC0(1) FCDh T1CON FADh TXREG F8Dh LATE(3) FECh PREINC0(1) FCCh TMR2 FACh TXSTA F8Ch LATD(3) FEBh PLUSW0(1) FCBh PR2 FABh RCSTA F8Bh LATC FEAh FSR0H FCAh T2CON FAAh —(2) F8Ah LATB FE9h FSR0L FC9h SSPBUF FA9h EEADR F89h LATA FE8h WREG FC8h SSPADD FA8h EEDATA F88h —(2) FE7h INDF1(1) FC7h SSPSTAT FA7h EECON2(1) F87h —(2) FE6h POSTINC1(1) FC6h SSPCON1 FA6h EECON1 F86h —(2) FE5h POSTDEC1(1) FC5h SSPCON2 FA5h —(2) F85h —(2) FE4h PREINC1(1) FC4h ADRESH FA4h —(2) F84h PORTE(3) FE3h PLUSW1(1) FC3h ADRESL FA3h —(2) F83h PORTD(3) FE2h FSR1H FC2h ADCON0 FA2h IPR2 F82h PORTC FE1h FSR1L FC1h ADCON1 FA1h PIR2 F81h PORTB FE0h BSR FC0h ADCON2 FA0h PIE2 F80h PORTA Note 1: This is not a physical register. 2: Unimplemented registers are read as ‘0’. 3: This register is not available on 28-pin devices. PIC18F2420/2520/4420/4520 DS39631B-page 64 Preliminary © 2007 Microchip Technology Inc. TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2420/2520/4420/4520) File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: TOSU — — — Top-of-Stack Upper Byte (TOS<20:16>) ---0 0000 49, 54 TOSH Top-of-Stack, High Byte (TOS<15:8>) 0000 0000 49, 54 TOSL Top-of-Stack, Low Byte (TOS<7:0>) 0000 0000 49, 54 STKPTR STKFUL STKUNF — SP4 SP3 SP2 SP1 SP0 00-0 0000 49, 55 PCLATU — — — Holding Register for PC<20:16> ---0 0000 49, 54 PCLATH Holding Register for PC<15:8> 0000 0000 49, 54 PCL PC, Low Byte (PC<7:0>) 0000 0000 49, 54 TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) --00 0000 49, 76 TBLPTRH Program Memory Table Pointer, High Byte (TBLPTR<15:8>) 0000 0000 49, 76 TBLPTRL Program Memory Table Pointer, Low Byte (TBLPTR<7:0>) 0000 0000 49, 76 TABLAT Program Memory Table Latch 0000 0000 49, 76 PRODH Product Register, High Byte xxxx xxxx 49, 89 PRODL Product Register, Low Byte xxxx xxxx 49, 89 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 0000 000x 49, 93 INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 1111 -1-1 49, 94 INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 11-0 0-00 49, 95 INDF0 Uses contents of FSR0 to address data memory – value of FSR0 not changed (not a physical register) N/A 49, 69 POSTINC0 Uses contents of FSR0 to address data memory – value of FSR0 post-incremented (not a physical register) N/A 49, 69 POSTDEC0 Uses contents of FSR0 to address data memory – value of FSR0 post-decremented (not a physical register) N/A 49, 69 PREINC0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) N/A 49, 69 PLUSW0 Uses contents of FSR0 to address data memory – value of FSR0 pre-incremented (not a physical register) – value of FSR0 offset by W N/A 49, 69 FSR0H — — — — Indirect Data Memory Address Pointer 0, High Byte ---- 0000 49, 69 FSR0L Indirect Data Memory Address Pointer 0, Low Byte xxxx xxxx 49, 69 WREG Working Register xxxx xxxx 49 INDF1 Uses contents of FSR1 to address data memory – value of FSR1 not changed (not a physical register) N/A 49, 69 POSTINC1 Uses contents of FSR1 to address data memory – value of FSR1 post-incremented (not a physical register) N/A 49, 69 POSTDEC1 Uses contents of FSR1 to address data memory – value of FSR1 post-decremented (not a physical register) N/A 49, 69 PREINC1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) N/A 49, 69 PLUSW1 Uses contents of FSR1 to address data memory – value of FSR1 pre-incremented (not a physical register) – value of FSR1 offset by W N/A 49, 69 FSR1H — — — — Indirect Data Memory Address Pointer 1, High Byte ---- 0000 50, 69 FSR1L Indirect Data Memory Address Pointer 1, Low Byte xxxx xxxx 50, 69 BSR — — — — Bank Select Register ---- 0000 50, 59 INDF2 Uses contents of FSR2 to address data memory – value of FSR2 not changed (not a physical register) N/A 50, 69 POSTINC2 Uses contents of FSR2 to address data memory – value of FSR2 post-incremented (not a physical register) N/A 50, 69 POSTDEC2 Uses contents of FSR2 to address data memory – value of FSR2 post-decremented (not a physical register) N/A 50, 69 PREINC2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) N/A 50, 69 PLUSW2 Uses contents of FSR2 to address data memory – value of FSR2 pre-incremented (not a physical register) – value of FSR2 offset by W N/A 50, 69 FSR2H — — — — Indirect Data Memory Address Pointer 2, High Byte ---- 0000 50, 69 FSR2L Indirect Data Memory Address Pointer 2, Low Byte xxxx xxxx 50, 69 STATUS — — — N OV Z DC C ---x xxxx 50, 67 Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 configuration bits = 01; otherwise it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; individual unimplemented bits should be interpreted as ‘-’. 3: The PLLEN bit is only available in specific oscillator configuration; otherwise it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes”. 4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE configuration bit = 0). Otherwise, RE3 reads as ‘0’. This bit is read-only. 5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 65 PIC18F2420/2520/4420/4520 TMR0H Timer0 Register, High Byte 0000 0000 50, 125 TMR0L Timer0 Register, Low Byte xxxx xxxx 50, 125 T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 1111 1111 50, 123 OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS IOFS SCS1 SCS0 0100 q000 30, 50 HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 0-00 0101 50, 245 WDTCON — — — — — — — SWDTEN --- ---0 50, 259 RCON IPEN SBOREN(1) — RI TO PD POR BOR 0q-1 11q0 42, 48, 102 TMR1H Timer1 Register, High Byte xxxx xxxx 50, 131 TMR1L Timer1 Register, Low Bytes xxxx xxxx 50, 131 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 50, 127 TMR2 Timer2 Register 0000 0000 50, 134 PR2 Timer2 Period Register 1111 1111 50, 134 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 50, 133 SSPBUF SSP Receive Buffer/Transmit Register xxxx xxxx 50, 169, 170 SSPADD SSP Address Register in I2C Slave Mode. SSP Baud Rate Reload Register in I2C Master Mode. 0000 0000 50, 170 SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 50, 162, 171 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 50, 163, 172 SSPCON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 50, 173 ADRESH A/D Result Register, High Byte xxxx xxxx 51, 232 ADRESL A/D Result Register, Low Byte xxxx xxxx 51, 232 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON --00 0000 51, 223 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 --00 0qqq 51, 224 ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 0-00 0000 51, 225 CCPR1H Capture/Compare/PWM Register 1, High Byte xxxx xxxx 51, 140 CCPR1L Capture/Compare/PWM Register 1, Low Byte xxxx xxxx 51, 140 CCP1CON P1M1(2) P1M0(2) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 0000 0000 51, 139, 147 CCPR2H Capture/Compare/PWM Register 2, High Byte xxxx xxxx 51, 140 CCPR2L Capture/Compare/PWM Register 2, Low Byte xxxx xxxx 51, 140 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 --00 0000 51, 139 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 01-0 0-00 51, 204 PWM1CON PRSEN PDC6(2) PDC5(2) PDC4(2) PDC3(2) PDC2(2) PDC1(2) PDC0(2) 0000 0000 51, 156 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(2) PSSBD0(2) 0000 0000 51, 157 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 0000 0000 51, 239 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 0000 0111 51, 233 TMR3H Timer3 Register, High Byte xxxx xxxx 51, 137 TMR3L Timer3 Register, Low Byte xxxx xxxx 51, 137 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 0000 0000 51, 135 TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2420/2520/4420/4520) (CONTINUED) File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 configuration bits = 01; otherwise it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; individual unimplemented bits should be interpreted as ‘-’. 3: The PLLEN bit is only available in specific oscillator configuration; otherwise it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes”. 4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE configuration bit = 0). Otherwise, RE3 reads as ‘0’. This bit is read-only. 5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 66 Preliminary © 2007 Microchip Technology Inc. SPBRGH EUSART Baud Rate Generator Register, High Byte 0000 0000 51, 206 SPBRG EUSART Baud Rate Generator Register, Low Byte 0000 0000 51, 206 RCREG EUSART Receive Register 0000 0000 51, 213 TXREG EUSART Transmit Register 0000 0000 51, 211 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 51, 202 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 51, 203 EEADR EEPROM Address Register 0000 0000 51, 74, 83 EEDATA EEPROM Data Register 0000 0000 51, 74, 83 EECON2 EEPROM Control Register 2 (not a physical register) 0000 0000 51, 74, 83 EECON1 EEPGD CFGS — FREE WRERR WREN WR RD xx-0 x000 51, 75, 84 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 11-1 1111 52, 101 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 00-0 0000 52, 97 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 00-0 0000 52, 99 IPR1 PSPIP(2) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 1111 1111 52, 100 PIR1 PSPIF(2) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 0000 0000 52, 96 PIE1 PSPIE(2) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 0000 0000 52, 98 OSCTUNE INTSRC PLLEN(3) — TUN4 TUN3 TUN2 TUN1 TUN0 0q-0 0000 27, 52 TRISE(2) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 0000 -111 52, 118 TRISD(2) PORTD Data Direction Control Register 1111 1111 52, 114 TRISC PORTC Data Direction Control Register 1111 1111 52, 111 TRISB PORTB Data Direction Control Register 1111 1111 52, 108 TRISA TRISA7(5) TRISA6(5) Data Direction Control Register for PORTA 1111 1111 52, 105 LATE(2) — — — — — PORTE Data Latch Register (Read and Write to Data Latch) ---- -xxx 52, 117 LATD(2) PORTD Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 114 LATC PORTC Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 111 LATB PORTB Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 108 LATA LATA7(5) LATA6(5) PORTA Data Latch Register (Read and Write to Data Latch) xxxx xxxx 52, 105 PORTE — — — — RE3(4) RE2(2) RE1(2) RE0(2) ---- xxxx 52, 117 PORTD(2) RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 xxxx xxxx 52, 114 PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 xxxx xxxx 52, 111 PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx 52, 108 PORTA RA7(5) RA6(5) RA5 RA4 RA3 RA2 RA1 RA0 xx0x 0000 52, 105 TABLE 5-2: REGISTER FILE SUMMARY (PIC18F2420/2520/4420/4520) (CONTINUED) File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Details on page: Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition Note 1: The SBOREN bit is only available when the BOREN1:BOREN0 configuration bits = 01; otherwise it is disabled and reads as ‘0’. See Section 4.4 “Brown-out Reset (BOR)”. 2: These registers and/or bits are not implemented on 28-pin devices and are read as ‘0’. Reset values are shown for 40/44-pin devices; individual unimplemented bits should be interpreted as ‘-’. 3: The PLLEN bit is only available in specific oscillator configuration; otherwise it is disabled and reads as ‘0’. See Section 2.6.4 “PLL in INTOSC Modes”. 4: The RE3 bit is only available when Master Clear Reset is disabled (MCLRE configuration bit = 0). Otherwise, RE3 reads as ‘0’. This bit is read-only. 5: RA6/RA7 and their associated latch and direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 67 PIC18F2420/2520/4420/4520 5.3.5 STATUS REGISTER The Status register, shown in Register 5-2, contains the arithmetic status of the ALU. As with any other SFR, it can be the operand for any instruction. If the Status register is the destination for an instruction that affects the Z, DC, C, OV or N bits, the results of the instruction are not written; instead, the Status register is updated according to the instruction performed. Therefore, the result of an instruction with the Status register as its destination may be different than intended. As an example, CLRF STATUS will set the Z bit and leave the remaining status bits unchanged (‘000u u1uu’). It is recommended that only BCF, BSF, SWAPF, MOVFF and MOVWF instructions are used to alter the Status register, because these instructions do not affect the Z, C, DC, OV or N bits in the Status register. For other instructions that do not affect Status bits, see the instruction set summaries in Table 24-2 and Table 24-3. REGISTER 5-2: STATUS REGISTER Note: The C and DC bits operate as the borrow and digit borrow bits, respectively, in subtraction. U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x — — — N OV Z DC C bit 7 bit 0 bit 7-5 Unimplemented: Read as ‘0’ bit 4 N: Negative bit This bit is used for signed arithmetic (2’s complement). It indicates whether the result was negative (ALU MSB = 1). 1 = Result was negative 0 = Result was positive bit 3 OV: Overflow bit This bit is used for signed arithmetic (2’s complement). It indicates an overflow of the 7-bit magnitude which causes the sign bit (bit 7 of the result) to change state. 1 = Overflow occurred for signed arithmetic (in this arithmetic operation) 0 = No overflow occurred bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/borrow bit For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result Note: For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either bit 4 or bit 3 of the source register. bit 0 C: Carry/borrow bit For ADDWF, ADDLW, SUBLW and SUBWF instructions: 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note: For borrow, the polarity is reversed. A subtraction is executed by adding the 2’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low-order bit of the source register. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 68 Preliminary © 2007 Microchip Technology Inc. 5.4 Data Addressing Modes While the program memory can be addressed in only one way – through the program counter – information in the data memory space can be addressed in several ways. For most instructions, the addressing mode is fixed. Other instructions may use up to three modes, depending on which operands are used and whether or not the extended instruction set is enabled. The addressing modes are: • Inherent • Literal • Direct • Indirect An additional addressing mode, Indexed Literal Offset, is available when the extended instruction set is enabled (XINST configuration bit = 1). Its operation is discussed in greater detail in Section 5.5.1 “Indexed Addressing with Literal Offset”. 5.4.1 INHERENT AND LITERAL ADDRESSING Many PIC18 control instructions do not need any argument at all; they either perform an operation that globally affects the device or they operate implicitly on one register. This addressing mode is known as Inherent Addressing. Examples include SLEEP, RESET and DAW. Other instructions work in a similar way but require an additional explicit argument in the opcode. This is known as Literal Addressing mode because they require some literal value as an argument. Examples include ADDLW and MOVLW, which respectively, add or move a literal value to the W register. Other examples include CALL and GOTO, which include a 20-bit program memory address. 5.4.2 DIRECT ADDRESSING Direct addressing specifies all or part of the source and/or destination address of the operation within the opcode itself. The options are specified by the arguments accompanying the instruction. In the core PIC18 instruction set, bit-oriented and byteoriented instructions use some version of direct addressing by default. All of these instructions include some 8-bit literal address as their Least Significant Byte. This address specifies either a register address in one of the banks of data RAM (Section 5.3.3 “General Purpose Register File”) or a location in the Access Bank (Section 5.3.2 “Access Bank”) as the data source for the instruction. The Access RAM bit ‘a’ determines how the address is interpreted. When ‘a’ is ‘1’, the contents of the BSR (Section 5.3.1 “Bank Select Register (BSR)”) are used with the address to determine the complete 12-bit address of the register. When ‘a’ is ‘0’, the address is interpreted as being a register in the Access Bank. Addressing that uses the Access RAM is sometimes also known as Direct Forced Addressing mode. A few instructions, such as MOVFF, include the entire 12-bit address (either source or destination) in their opcodes. In these cases, the BSR is ignored entirely. The destination of the operation’s results is determined by the destination bit ‘d’. When ‘d’ is ‘1’, the results are stored back in the source register, overwriting its original contents. When ‘d’ is ‘0’, the results are stored in the W register. Instructions without the ‘d’ argument have a destination that is implicit in the instruction; their destination is either the target register being operated on or the W register. 5.4.3 INDIRECT ADDRESSING Indirect addressing allows the user to access a location in data memory without giving a fixed address in the instruction. This is done by using File Select Registers (FSRs) as pointers to the locations to be read or written to. Since the FSRs are themselves located in RAM as Special File Registers, they can also be directly manipulated under program control. This makes FSRs very useful in implementing data structures, such as tables and arrays in data memory. The registers for indirect addressing are also implemented with Indirect File Operands (INDFs) that permit automatic manipulation of the pointer value with auto-incrementing, auto-decrementing or offsetting with another value. This allows for efficient code, using loops, such as the example of clearing an entire RAM bank in Example 5-5. EXAMPLE 5-5: HOW TO CLEAR RAM (BANK 1) USING INDIRECT ADDRESSING Note: The execution of some instructions in the core PIC18 instruction set are changed when the PIC18 extended instruction set is enabled. See Section 5.5 “Data Memory and the Extended Instruction Set” for more information. LFSR FSR0, 100h ; NEXT CLRF POSTINC0 ; Clear INDF ; register then ; inc pointer BTFSS FSR0H, 1 ; All done with ; Bank1? BRA NEXT ; NO, clear next CONTINUE ; YES, continue © 2007 Microchip Technology Inc. Preliminary DS39631B-page 69 PIC18F2420/2520/4420/4520 5.4.3.1 FSR Registers and the INDF Operand At the core of indirect addressing are three sets of registers: FSR0, FSR1 and FSR2. Each represents a pair of 8-bit registers, FSRnH and FSRnL. The four upper bits of the FSRnH register are not used so each FSR pair holds a 12-bit value. This represents a value that can address the entire range of the data memory in a linear fashion. The FSR register pairs, then, serve as pointers to data memory locations. Indirect addressing is accomplished with a set of Indirect File Operands, INDF0 through INDF2. These can be thought of as “virtual” registers: they are mapped in the SFR space but are not physically implemented. Reading or writing to a particular INDF register actually accesses its corresponding FSR register pair. A read from INDF1, for example, reads the data at the address indicated by FSR1H:FSR1L. Instructions that use the INDF registers as operands actually use the contents of their corresponding FSR as a pointer to the instruction’s target. The INDF operand is just a convenient way of using the pointer. Because indirect addressing uses a full 12-bit address, data RAM banking is not necessary. Thus, the current contents of the BSR and the Access RAM bit have no effect on determining the target address. 5.4.3.2 FSR Registers and POSTINC, POSTDEC, PREINC and PLUSW In addition to the INDF operand, each FSR register pair also has four additional indirect operands. Like INDF, these are “virtual” registers that cannot be indirectly read or written to. Accessing these registers actually accesses the associated FSR register pair, but also performs a specific action on it stored value. They are: • POSTDEC: accesses the FSR value, then automatically decrements it by 1 afterwards • POSTINC: accesses the FSR value, then automatically increments it by 1 afterwards • PREINC: increments the FSR value by 1, then uses it in the operation • PLUSW: adds the signed value of the W register (range of -127 to 128) to that of the FSR and uses the new value in the operation. In this context, accessing an INDF register uses the value in the FSR registers without changing them. Similarly, accessing a PLUSW register gives the FSR value offset by that in the W register; neither value is actually changed in the operation. Accessing the other virtual registers changes the value of the FSR registers. Operations on the FSRs with POSTDEC, POSTINC and PREINC affect the entire register pair; that is, rollovers of the FSRnL register from FFh to 00h carry over to the FSRnH register. On the other hand, results of these operations do not change the value of any flags in the Status register (e.g., Z, N, OV, etc.). FIGURE 5-8: INDIRECT ADDRESSING FSR1H:FSR1L 7 0 Data Memory 000h 100h 200h 300h F00h E00h FFFh Bank 0 Bank 1 Bank 2 Bank 14 Bank 15 Bank 3 through Bank 13 ADDWF, INDF1, 1 7 0 Using an instruction with one of the indirect addressing registers as the operand.... ...uses the 12-bit address stored in the FSR pair associated with that register.... ...to determine the data memory location to be used in that operation. In this case, the FSR1 pair contains ECCh. This means the contents of location ECCh will be added to that of the W register and stored back in ECCh. x x x x 1 1 1 0 1 1 0 0 1 1 0 0 PIC18F2420/2520/4420/4520 DS39631B-page 70 Preliminary © 2007 Microchip Technology Inc. The PLUSW register can be used to implement a form of indexed addressing in the data memory space. By manipulating the value in the W register, users can reach addresses that are fixed offsets from pointer addresses. In some applications, this can be used to implement some powerful program control structure, such as software stacks, inside of data memory. 5.4.3.3 Operations by FSRs on FSRs Indirect addressing operations that target other FSRs or virtual registers represent special cases. For example, using an FSR to point to one of the virtual registers will not result in successful operations. As a specific case, assume that FSR0H:FSR0L contains FE7h, the address of INDF1. Attempts to read the value of the INDF1 using INDF0 as an operand will return 00h. Attempts to write to INDF1 using INDF0 as the operand will result in a NOP. On the other hand, using the virtual registers to write to an FSR pair may not occur as planned. In these cases, the value will be written to the FSR pair but without any incrementing or decrementing. Thus, writing to INDF2 or POSTDEC2 will write the same value to the FSR2H:FSR2L. Since the FSRs are physical registers mapped in the SFR space, they can be manipulated through all direct operations. Users should proceed cautiously when working on these registers, particularly if their code uses indirect addressing. Similarly, operations by indirect addressing are generally permitted on all other SFRs. Users should exercise the appropriate caution that they do not inadvertently change settings that might affect the operation of the device. 5.5 Data Memory and the Extended Instruction Set Enabling the PIC18 extended instruction set (XINST configuration bit = 1) significantly changes certain aspects of data memory and its addressing. Specifically, the use of the Access Bank for many of the core PIC18 instructions is different; this is due to the introduction of a new addressing mode for the data memory space. What does not change is just as important. The size of the data memory space is unchanged, as well as its linear addressing. The SFR map remains the same. Core PIC18 instructions can still operate in both Direct and Indirect Addressing mode; inherent and literal instructions do not change at all. Indirect addressing with FSR0 and FSR1 also remain unchanged. 5.5.1 INDEXED ADDRESSING WITH LITERAL OFFSET Enabling the PIC18 extended instruction set changes the behavior of indirect addressing using the FSR2 register pair within Access RAM. Under the proper conditions, instructions that use the Access Bank – that is, most bit-oriented and byte-oriented instructions – can invoke a form of indexed addressing using an offset specified in the instruction. This special addressing mode is known as Indexed Addressing with Literal Offset, or Indexed Literal Offset mode. When using the extended instruction set, this addressing mode requires the following: • The use of the Access Bank is forced (‘a’ = 0) and • The file address argument is less than or equal to 5Fh. Under these conditions, the file address of the instruction is not interpreted as the lower byte of an address (used with the BSR in direct addressing), or as an 8-bit address in the Access Bank. Instead, the value is interpreted as an offset value to an address pointer, specified by FSR2. The offset and the contents of FSR2 are added to obtain the target address of the operation. 5.5.2 INSTRUCTIONS AFFECTED BY INDEXED LITERAL OFFSET MODE Any of the core PIC18 instructions that can use direct addressing are potentially affected by the Indexed Literal Offset Addressing mode. This includes all byte-oriented and bit-oriented instructions, or almost one-half of the standard PIC18 instruction set. Instructions that only use Inherent or Literal Addressing modes are unaffected. Additionally, byte-oriented and bit-oriented instructions are not affected if they do not use the Access Bank (Access RAM bit is ‘1’), or include a file address of 60h or above. Instructions meeting these criteria will continue to execute as before. A comparison of the different possible addressing modes when the extended instruction set is enabled in shown in Figure 5-9. Those who desire to use byte-oriented or bit-oriented instructions in the Indexed Literal Offset mode should note the changes to assembler syntax for this mode. This is described in more detail in Section 24.2.1 “Extended Instruction Syntax”. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 71 PIC18F2420/2520/4420/4520 FIGURE 5-9: COMPARING ADDRESSING OPTIONS FOR BIT-ORIENTED AND BYTE-ORIENTED INSTRUCTIONS (EXTENDED INSTRUCTION SET ENABLED) EXAMPLE INSTRUCTION: ADDWF, f, d, a (Opcode: 0010 01da ffff ffff) When ‘a’ = 0 and f ≥ 60h: The instruction executes in Direct Forced mode. ‘f’ is interpreted as a location in the Access RAM between 060h and 0FFh. This is the same as locations 060h to 07Fh (Bank 0) and F80h to FFFh (Bank 15) of data memory. Locations below 60h are not available in this addressing mode. When ‘a’ = 0 and f ≤ 5Fh: The instruction executes in Indexed Literal Offset mode. ‘f’ is interpreted as an offset to the address value in FSR2. The two are added together to obtain the address of the target register for the instruction. The address can be anywhere in the data memory space. Note that in this mode, the correct syntax is now: ADDWF [k], d where ‘k’ is the same as ‘f’. When ‘a’ = 1 (all values of f): The instruction executes in Direct mode (also known as Direct Long mode). ‘f’ is interpreted as a location in one of the 16 banks of the data memory space. The bank is designated by the Bank Select Register (BSR). The address can be in any implemented bank in the data memory space. 000h 060h 100h F00h F80h FFFh Valid range 00h 60h 80h FFh Data Memory Access RAM Bank 0 Bank 1 through Bank 14 Bank 15 SFRs 000h 080h 100h F00h F80h FFFh Data Memory Bank 0 Bank 1 through Bank 14 Bank 15 SFRs FSR2H FSR2L 001001da ffffffff 001001da ffffffff 000h 080h 100h F00h F80h FFFh Data Memory Bank 0 Bank 1 through Bank 14 Bank 15 SFRs for ‘f’ BSR 00000000 080h PIC18F2420/2520/4420/4520 DS39631B-page 72 Preliminary © 2007 Microchip Technology Inc. 5.5.3 MAPPING THE ACCESS BANK IN INDEXED LITERAL OFFSET MODE The use of Indexed Literal Offset Addressing mode effectively changes how the first 96 locations of Access RAM (00h to 5Fh) are mapped. Rather than containing just the contents of the bottom half of Bank 0, this mode maps the contents from Bank 0 and a user defined “window” that can be located anywhere in the data memory space. The value of FSR2 establishes the lower boundary of the addresses mapped into the window, while the upper boundary is defined by FSR2 plus 95 (5Fh). Addresses in the Access RAM above 5Fh are mapped as previously described (see Section 5.3.2 “Access Bank”). An example of Access Bank remapping in this addressing mode is shown in Figure 5-10. Remapping of the Access Bank applies only to operations using the Indexed Literal Offset mode. Operations that use the BSR (Access RAM bit is ‘1’) will continue to use direct addressing as before. 5.6 PIC18 Instruction Execution and the Extended Instruction Set Enabling the extended instruction set adds eight additional commands to the existing PIC18 instruction set. These instructions are executed as described in Section 24.2 “Extended Instruction Set”. FIGURE 5-10: REMAPPING THE ACCESS BANK WITH INDEXED LITERAL OFFSET ADDRESSING Data Memory 000h 100h 200h F80h F00h FFFh Bank 1 Bank 15 Bank 2 through Bank 14 SFRs 05Fh ADDWF f, d, a FSR2H:FSR2L = 120h Locations in the region from the FSR2 pointer (120h) to the pointer plus 05Fh (17Fh) are mapped to the bottom of the Access RAM (000h-05Fh). Locations in Bank 0 from 060h to 07Fh are mapped, as usual, to the middle half of the Access Bank. Special File Registers at F80h through FFFh are mapped to 80h through FFh, as usual. Bank 0 addresses below 5Fh can still be addressed by using the BSR. Access Bank 00h 80h FFh 7Fh Bank 0 SFRs Bank 1 “Window” Bank 0 Bank 0 Window Example Situation: 07Fh 120h 17Fh 5Fh Bank 1 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 73 PIC18F2420/2520/4420/4520 6.0 FLASH PROGRAM MEMORY The Flash program memory is readable, writable and erasable during normal operation over the entire VDD range. A read from program memory is executed on one byte at a time. A write to program memory is executed on blocks of 64 bytes at a time. Program memory is erased in blocks of 64 bytes at a time. A bulk erase operation may not be issued from user code. Writing or erasing program memory will cease instruction fetches until the operation is complete. The program memory cannot be accessed during the write or erase, therefore, code cannot execute. An internal programming timer terminates program memory writes and erases. A value written to program memory does not need to be a valid instruction. Executing a program memory location that forms an invalid instruction results in a NOP. 6.1 Table Reads and Table Writes In order to read and write program memory, there are two operations that allow the processor to move bytes between the program memory space and the data RAM: • Table Read (TBLRD) • Table Write (TBLWT) The program memory space is 16 bits wide, while the data RAM space is 8 bits wide. Table reads and table writes move data between these two memory spaces through an 8-bit register (TABLAT). Table read operations retrieve data from program memory and places it into the data RAM space. Figure 6-1 shows the operation of a table read with program memory and data RAM. Table write operations store data from the data memory space into holding registers in program memory. The procedure to write the contents of the holding registers into program memory is detailed in Section 6.5 “Writing to Flash Program Memory”. Figure 6-2 shows the operation of a table write with program memory and data RAM. Table operations work with byte entities. A table block containing data, rather than program instructions, is not required to be word aligned. Therefore, a table block can start and end at any byte address. If a table write is being used to write executable code into program memory, program instructions will need to be word aligned. FIGURE 6-1: TABLE READ OPERATION Table Pointer(1) Table Latch (8-bit) Program Memory TBLPTRH TBLPTRL TABLAT TBLPTRU Instruction: TBLRD* Note 1: Table Pointer register points to a byte in program memory. Program Memory (TBLPTR) PIC18F2420/2520/4420/4520 DS39631B-page 74 Preliminary © 2007 Microchip Technology Inc. FIGURE 6-2: TABLE WRITE OPERATION 6.2 Control Registers Several control registers are used in conjunction with the TBLRD and TBLWT instructions. These include the: • EECON1 register • EECON2 register • TABLAT register • TBLPTR registers 6.2.1 EECON1 AND EECON2 REGISTERS The EECON1 register (Register 6-1) is the control register for memory accesses. The EECON2 register is not a physical register; it is used exclusively in the memory write and erase sequences. Reading EECON2 will read all ‘0’s. The EEPGD control bit determines if the access will be a program or data EEPROM memory access. When clear, any subsequent operations will operate on the data EEPROM memory. When set, any subsequent operations will operate on the program memory. The CFGS control bit determines if the access will be to the configuration/calibration registers or to program memory/data EEPROM memory. When set, subsequent operations will operate on configuration registers regardless of EEPGD (see Section 23.0 “Special Features of the CPU”). When clear, memory selection access is determined by EEPGD. The FREE bit, when set, will allow a program memory erase operation. When FREE is set, the erase operation is initiated on the next WR command. When FREE is clear, only writes are enabled. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WR bit is set and cleared when the internal programming timer expires and the write operation is complete. The WR control bit initiates write operations. The bit cannot be cleared, only set, in software; it is cleared in hardware at the completion of the write operation. Table Pointer(1) Table Latch (8-bit) TBLPTRH TBLPTRL TABLAT Program Memory (TBLPTR) TBLPTRU Instruction: TBLWT* Note 1: Table Pointer actually points to one of 64 holding registers, the address of which is determined by TBLPTRL<5:0>. The process for physically writing data to the program memory array is discussed in Section 6.5 “Writing to Flash Program Memory”. Holding Registers Program Memory Note: During normal operation, the WRERR is read as ‘1’. This can indicate that a write operation was prematurely terminated by a Reset, or a write operation was attempted improperly. Note: The EEIF interrupt flag bit (PIR2<4>) is set when the write is complete. It must be cleared in software. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 75 PIC18F2420/2520/4420/4520 REGISTER 6-1: EECON1 REGISTER R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0 EEPGD CFGS — FREE WRERR WREN WR RD bit 7 bit 0 bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit 1 = Access Flash program memory 0 = Access data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Access Configuration registers 0 = Access Flash program or data EEPROM memory bit 5 Unimplemented: Read as ‘0’ bit 4 FREE: Flash Row Erase Enable bit 1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by completion of erase operation) 0 = Perform write only bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit 1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal operation, or an improper write attempt) 0 = The write operation completed Note: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error condition. bit 2 WREN: Flash Program/Data EEPROM Write Enable bit 1 = Allows write cycles to Flash program/data EEPROM 0 = Inhibits write cycles to Flash program/data EEPROM bit 1 WR: Write Control bit 1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle. (The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.) 0 = Does not initiate an EEPROM read Legend: R = Readable bit W = Writable bit S = Bit can be set by software, but not cleared U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 76 Preliminary © 2007 Microchip Technology Inc. 6.2.2 TABLAT – TABLE LATCH REGISTER The Table Latch (TABLAT) is an 8-bit register mapped into the SFR space. The Table Latch register is used to hold 8-bit data during data transfers between program memory and data RAM. 6.2.3 TBLPTR – TABLE POINTER REGISTER The Table Pointer (TBLPTR) register addresses a byte within the program memory. The TBLPTR is comprised of three SFR registers: Table Pointer Upper Byte, Table Pointer High Byte and Table Pointer Low Byte (TBLPTRU:TBLPTRH:TBLPTRL). These three registers join to form a 22-bit wide pointer. The low-order 21 bits allow the device to address up to 2 Mbytes of program memory space. The 22nd bit allows access to the device ID, the user ID and the configuration bits. The Table Pointer register, TBLPTR, is used by the TBLRD and TBLWT instructions. These instructions can update the TBLPTR in one of four ways based on the table operation. These operations are shown in Table 6-1. These operations on the TBLPTR only affect the low-order 21 bits. 6.2.4 TABLE POINTER BOUNDARIES TBLPTR is used in reads, writes and erases of the Flash program memory. When a TBLRD is executed, all 22 bits of the TBLPTR determine which byte is read from program memory into TABLAT. When a TBLWT is executed, the six LSbs of the Table Pointer register (TBLPTR<5:0>) determine which of the 64 program memory holding registers is written to. When the timed write to program memory begins (via the WR bit), the 16 MSbs of the TBLPTR (TBLPTR<21:6>) determine which program memory block of 64 bytes is written to. For more detail, see Section 6.5 “Writing to Flash Program Memory”. When an erase of program memory is executed, the 16 MSbs of the Table Pointer register (TBLPTR<21:6>) point to the 64-byte block that will be erased. The Least Significant bits (TBLPTR<5:0>) are ignored. Figure 6-3 describes the relevant boundaries of TBLPTR based on Flash program memory operations. TABLE 6-1: TABLE POINTER OPERATIONS WITH TBLRD AND TBLWT INSTRUCTIONS FIGURE 6-3: TABLE POINTER BOUNDARIES BASED ON OPERATION Example Operation on Table Pointer TBLRD* TBLWT* TBLPTR is not modified TBLRD*+ TBLWT*+ TBLPTR is incremented after the read/write TBLRD*- TBLWT*- TBLPTR is decremented after the read/write TBLRD+* TBLWT+* TBLPTR is incremented before the read/write 21 16 15 8 7 0 TABLE ERASE/WRITE TABLE WRITE TABLE READ – TBLPTR<21:0> TBLPTRU TBLPTRH TBLPTRL TBLPTR<21:6> TBLPTR<5:0> © 2007 Microchip Technology Inc. Preliminary DS39631B-page 77 PIC18F2420/2520/4420/4520 6.3 Reading the Flash Program Memory The TBLRD instruction is used to retrieve data from program memory and places it into data RAM. Table reads from program memory are performed one byte at a time. TBLPTR points to a byte address in program space. Executing TBLRD places the byte pointed to into TABLAT. In addition, TBLPTR can be modified automatically for the next table read operation. The internal program memory is typically organized by words. The Least Significant bit of the address selects between the high and low bytes of the word. Figure 6-4 shows the interface between the internal program memory and the TABLAT. FIGURE 6-4: READS FROM FLASH PROGRAM MEMORY EXAMPLE 6-1: READING A FLASH PROGRAM MEMORY WORD (Even Byte Address) Program Memory (Odd Byte Address) TBLRD TABLAT TBLPTR = xxxxx1 FETCH Instruction Register (IR) Read Register TBLPTR = xxxxx0 MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base MOVWF TBLPTRU ; address of the word MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL READ_WORD TBLRD*+ ; read into TABLAT and increment MOVF TABLAT, W ; get data MOVWF WORD_EVEN TBLRD*+ ; read into TABLAT and increment MOVFW TABLAT, W ; get data MOVF WORD_ODD PIC18F2420/2520/4420/4520 DS39631B-page 78 Preliminary © 2007 Microchip Technology Inc. 6.4 Erasing Flash Program Memory The minimum erase block is 32 words or 64 bytes. Only through the use of an external programmer, or through ICSP control, can larger blocks of program memory be bulk erased. Word erase in the Flash array is not supported. When initiating an erase sequence from the microcontroller itself, a block of 64 bytes of program memory is erased. The Most Significant 16 bits of the TBLPTR<21:6> point to the block being erased. TBLPTR<5:0> are ignored. The EECON1 register commands the erase operation. The EEPGD bit must be set to point to the Flash program memory. The WREN bit must be set to enable write operations. The FREE bit is set to select an erase operation. For protection, the write initiate sequence for EECON2 must be used. A long write is necessary for erasing the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer. 6.4.1 FLASH PROGRAM MEMORY ERASE SEQUENCE The sequence of events for erasing a block of internal program memory location is: 1. Load Table Pointer register with address of row being erased. 2. Set the EECON1 register for the erase operation: • set EEPGD bit to point to program memory; • clear the CFGS bit to access program memory; • set WREN bit to enable writes; • set FREE bit to enable the erase. 3. Disable interrupts. 4. Write 55h to EECON2. 5. Write 0AAh to EECON2. 6. Set the WR bit. This will begin the row erase cycle. 7. The CPU will stall for duration of the erase (about 2 ms using internal timer). 8. Re-enable interrupts. EXAMPLE 6-2: ERASING A FLASH PROGRAM MEMORY ROW MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL ERASE_ROW BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BSF EECON1, FREE ; enable Row Erase operation BCF INTCON, GIE ; disable interrupts Required MOVLW 55h Sequence MOVWF EECON2 ; write 55h MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start erase (CPU stall) BSF INTCON, GIE ; re-enable interrupts © 2007 Microchip Technology Inc. Preliminary DS39631B-page 79 PIC18F2420/2520/4420/4520 6.5 Writing to Flash Program Memory The minimum programming block is 32 words or 64 bytes. Word or byte programming is not supported. Table writes are used internally to load the holding registers needed to program the Flash memory. There are 64 holding registers used by the table writes for programming. Since the Table Latch (TABLAT) is only a single byte, the TBLWT instruction may need to be executed 64 times for each programming operation. All of the table write operations will essentially be short writes because only the holding registers are written. At the end of updating the 64 holding registers, the EECON1 register must be written to in order to start the programming operation with a long write. The long write is necessary for programming the internal Flash. Instruction execution is halted while in a long write cycle. The long write will be terminated by the internal programming timer. The EEPROM on-chip timer controls the write time. The write/erase voltages are generated by an on-chip charge pump, rated to operate over the voltage range of the device. FIGURE 6-5: TABLE WRITES TO FLASH PROGRAM MEMORY 6.5.1 FLASH PROGRAM MEMORY WRITE SEQUENCE The sequence of events for programming an internal program memory location should be: 1. Read 64 bytes into RAM. 2. Update data values in RAM as necessary. 3. Load Table Pointer register with address being erased. 4. Execute the row erase procedure. 5. Load Table Pointer register with address of first byte being written. 6. Write the 64 bytes into the holding registers with auto-increment. 7. Set the EECON1 register for the write operation: • set EEPGD bit to point to program memory; • clear the CFGS bit to access program memory; • set WREN to enable byte writes. 8. Disable interrupts. 9. Write 55h to EECON2. 10. Write 0AAh to EECON2. 11. Set the WR bit. This will begin the write cycle. 12. The CPU will stall for duration of the write (about 2 ms using internal timer). 13. Re-enable interrupts. 14. Verify the memory (table read). This procedure will require about 6 ms to update one row of 64 bytes of memory. An example of the required code is given in Example 6-3. Note: The default value of the holding registers on device Resets and after write operations is FFh. A write of FFh to a holding register does not modify that byte. This means that individual bytes of program memory may be modified, provided that the change does not attempt to change any bit from a ‘0’ to a ‘1’. When modifying individual bytes, it is not necessary to load all 64 holding registers before executing a write operation. TABLAT TBLPTR = xxxxx0 TBLPTR = xxxxx1 TBLPTR = xxxx3F Write Register TBLPTR = xxxxx2 Program Memory Holding Register Holding Register Holding Register Holding Register 8 8 8 8 Note: Before setting the WR bit, the Table Pointer address needs to be within the intended address range of the 64 bytes in the holding register. PIC18F2420/2520/4420/4520 DS39631B-page 80 Preliminary © 2007 Microchip Technology Inc. EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY MOVLW D'64 ; number of bytes in erase block MOVWF COUNTER MOVLW BUFFER_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW BUFFER_ADDR_LOW MOVWF FSR0L MOVLW CODE_ADDR_UPPER ; Load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL READ_BLOCK TBLRD*+ ; read into TABLAT, and inc MOVF TABLAT, W ; get data MOVWF POSTINC0 ; store data DECFSZ COUNTER ; done? BRA READ_BLOCK ; repeat MODIFY_WORD MOVLW DATA_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW DATA_ADDR_LOW MOVWF FSR0L MOVLW NEW_DATA_LOW ; update buffer word MOVWF POSTINC0 MOVLW NEW_DATA_HIGH MOVWF INDF0 ERASE_BLOCK MOVLW CODE_ADDR_UPPER ; load TBLPTR with the base MOVWF TBLPTRU ; address of the memory block MOVLW CODE_ADDR_HIGH MOVWF TBLPTRH MOVLW CODE_ADDR_LOW MOVWF TBLPTRL BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BSF EECON1, FREE ; enable Row Erase operation BCF INTCON, GIE ; disable interrupts MOVLW 55h Required MOVWF EECON2 ; write 55h Sequence MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start erase (CPU stall) BSF INTCON, GIE ; re-enable interrupts TBLRD*- ; dummy read decrement MOVLW BUFFER_ADDR_HIGH ; point to buffer MOVWF FSR0H MOVLW BUFFER_ADDR_LOW MOVWF FSR0L WRITE_BUFFER_BACK MOVLW D’64 ; number of bytes in holding register MOVWF COUNTER WRITE_BYTE_TO_HREGS MOVFF POSTINC0, WREG ; get low byte of buffer data MOVWF TABLAT ; present data to table latch TBLWT+* ; write data, perform a short write ; to internal TBLWT holding register. DECFSZ COUNTER ; loop until buffers are full BRA WRITE_WORD_TO_HREGS © 2007 Microchip Technology Inc. Preliminary DS39631B-page 81 PIC18F2420/2520/4420/4520 EXAMPLE 6-3: WRITING TO FLASH PROGRAM MEMORY (CONTINUED) 6.5.2 WRITE VERIFY Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. 6.5.3 UNEXPECTED TERMINATION OF WRITE OPERATION If a write is terminated by an unplanned event, such as loss of power or an unexpected Reset, the memory location just programmed should be verified and reprogrammed if needed. If the write operation is interrupted by a MCLR Reset or a WDT Time-out Reset during normal operation, the user can check the WRERR bit and rewrite the location(s) as needed. 6.5.4 PROTECTION AGAINST SPURIOUS WRITES To protect against spurious writes to Flash program memory, the write initiate sequence must also be followed. See Section 23.0 “Special Features of the CPU” for more detail. 6.6 Flash Program Operation During Code Protection See Section 23.5 “Program Verification and Code Protection” for details on code protection of Flash program memory. TABLE 6-2: REGISTERS ASSOCIATED WITH PROGRAM FLASH MEMORY PROGRAM_MEMORY BSF EECON1, EEPGD ; point to Flash program memory BCF EECON1, CFGS ; access Flash program memory BSF EECON1, WREN ; enable write to memory BCF INTCON, GIE ; disable interrupts MOVLW 55h Required MOVWF EECON2 ; write 55h Sequence MOVLW 0AAh MOVWF EECON2 ; write 0AAh BSF EECON1, WR ; start program (CPU stall) BSF INTCON, GIE ; re-enable interrupts BCF EECON1, WREN ; disable write to memory Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TBLPTRU — — bit 21 Program Memory Table Pointer Upper Byte (TBLPTR<20:16>) 49 TBPLTRH Program Memory Table Pointer High Byte (TBLPTR<15:8>) 49 TBLPTRL Program Memory Table Pointer Low Byte (TBLPTR<7:0>) 49 TABLAT Program Memory Table Latch 49 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 EECON2 EEPROM Control Register 2 (not a physical register) 51 EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 51 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access. PIC18F2420/2520/4420/4520 DS39631B-page 82 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 83 PIC18F2420/2520/4420/4520 7.0 DATA EEPROM MEMORY The data EEPROM is a nonvolatile memory array, separate from the data RAM and program memory, that is used for long-term storage of program data. It is not directly mapped in either the register file or program memory space but is indirectly addressed through the Special Function Registers (SFRs). The EEPROM is readable and writable during normal operation over the entire VDD range. Five SFRs are used to read and write to the data EEPROM as well as the program memory. They are: • EECON1 • EECON2 • EEDATA • EEADR The data EEPROM allows byte read and write. When interfacing to the data memory block, EEDATA holds the 8-bit data for read/write and the EEADR register holds the address of the EEPROM location being accessed. The EEPROM data memory is rated for high erase/write cycle endurance. A byte write automatically erases the location and writes the new data (erase-before-write). The write time is controlled by an on-chip timer; it will vary with voltage and temperature as well as from chip to chip. Please refer to parameter D122 (Table 26-1 in Section 26.0 “Electrical Characteristics”) for exact limits. 7.1 EEADR Register The EEADR register is used to address the data EEPROM for read and write operations. The 8-bit range of the register can address a memory range of 256 bytes (00h to FFh). 7.2 EECON1 and EECON2 Registers Access to the data EEPROM is controlled by two registers: EECON1 and EECON2. These are the same registers which control access to the program memory and are used in a similar manner for the data EEPROM. The EECON1 register (Register 7-1) is the control register for data and program memory access. Control bit EEPGD determines if the access will be to program or data EEPROM memory. When clear, operations will access the data EEPROM memory. When set, program memory is accessed. Control bit, CFGS, determines if the access will be to the configuration registers or to program memory/data EEPROM memory. When set, subsequent operations access configuration registers. When CFGS is clear, the EEPGD bit selects either program Flash or data EEPROM memory. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set in hardware when the WR bit is set and cleared when the internal programming timer expires and the write operation is complete. The WR control bit initiates write operations. The bit can be set but not cleared in software. It is only cleared in hardware at the completion of the write operation. Control bits, RD and WR, start read and erase/write operations, respectively. These bits are set by firmware and cleared by hardware at the completion of the operation. The RD bit cannot be set when accessing program memory (EEPGD = 1). Program memory is read using table read instructions. See Section 6.1 “Table Reads and Table Writes” regarding table reads. The EECON2 register is not a physical register. It is used exclusively in the memory write and erase sequences. Reading EECON2 will read all ‘0’s. Note: During normal operation, the WRERR may read as ‘1’. This can indicate that a write operation was prematurely terminated by a Reset, or a write operation was attempted improperly. Note: The EEIF interrupt flag bit (PIR2<4>) is set when the write is complete. It must be cleared in software. PIC18F2420/2520/4420/4520 DS39631B-page 84 Preliminary © 2007 Microchip Technology Inc. REGISTER 7-1: EECON1 REGISTER R/W-x R/W-x U-0 R/W-0 R/W-x R/W-0 R/S-0 R/S-0 EEPGD CFGS — FREE WRERR WREN WR RD bit 7 bit 0 bit 7 EEPGD: Flash Program or Data EEPROM Memory Select bit 1 = Access Flash program memory 0 = Access data EEPROM memory bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit 1 = Access configuration registers 0 = Access Flash program or data EEPROM memory bit 5 Unimplemented: Read as ‘0’ bit 4 FREE: Flash Row Erase Enable bit 1 = Erase the program memory row addressed by TBLPTR on the next WR command (cleared by completion of erase operation) 0 = Perform write only bit 3 WRERR: Flash Program/Data EEPROM Error Flag bit 1 = A write operation is prematurely terminated (any Reset during self-timed programming in normal operation, or an improper write attempt) 0 = The write operation completed Note: When a WRERR occurs, the EEPGD and CFGS bits are not cleared. This allows tracing of the error condition. bit 2 WREN: Flash Program/Data EEPROM Write Enable bit 1 = Allows write cycles to Flash program/data EEPROM 0 = Inhibits write cycles to Flash program/data EEPROM bit 1 WR: Write Control bit 1 = Initiates a data EEPROM erase/write cycle or a program memory erase cycle or write cycle (The operation is self-timed and the bit is cleared by hardware once write is complete. The WR bit can only be set (not cleared) in software.) 0 = Write cycle to the EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set (not cleared) in software. RD bit cannot be set when EEPGD = 1 or CFGS = 1.) 0 = Does not initiate an EEPROM read Legend: R = Readable bit W = Writable bit S = Bit can be set by software, but not cleared U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 85 PIC18F2420/2520/4420/4520 7.3 Reading the Data EEPROM Memory To read a data memory location, the user must write the address to the EEADR register, clear the EEPGD control bit (EECON1<7>) and then set control bit, RD (EECON1<0>). The data is available on the very next instruction cycle; therefore, the EEDATA register can be read by the next instruction. EEDATA will hold this value until another read operation, or until it is written to by the user (during a write operation). The basic process is shown in Example 7-1. 7.4 Writing to the Data EEPROM Memory To write an EEPROM data location, the address must first be written to the EEADR register and the data written to the EEDATA register. The sequence in Example 7-2 must be followed to initiate the write cycle. The write will not begin if this sequence is not exactly followed (write 55h to EECON2, write 0AAh to EECON2, then set WR bit) for each byte. It is strongly recommended that interrupts be disabled during this code segment. Additionally, the WREN bit in EECON1 must be set to enable writes. This mechanism prevents accidental writes to data EEPROM due to unexpected code execution (i.e., runaway programs). The WREN bit should be kept clear at all times, except when updating the EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, EECON1, EEADR and EEDATA cannot be modified. The WR bit will be inhibited from being set unless the WREN bit is set. Both WR and WREN cannot be set with the same instruction. At the completion of the write cycle, the WR bit is cleared in hardware and the EEPROM Interrupt Flag bit, EEIF, is set. The user may either enable this interrupt or poll this bit. EEIF must be cleared by software. 7.5 Write Verify Depending on the application, good programming practice may dictate that the value written to the memory should be verified against the original value. This should be used in applications where excessive writes can stress bits near the specification limit. EXAMPLE 7-1: DATA EEPROM READ EXAMPLE 7-2: DATA EEPROM WRITE MOVLW DATA_EE_ADDR ; MOVWF EEADR ; Data Memory Address to read BCF EECON1, EEPGD ; Point to DATA memory BCF EECON1, CFGS ; Access EEPROM BSF EECON1, RD ; EEPROM Read MOVF EEDATA, W ; W = EEDATA MOVLW DATA_EE_ADDR ; MOVWF EEADR ; Data Memory Address to write MOVLW DATA_EE_DATA ; MOVWF EEDATA ; Data Memory Value to write BCF EECON1, EEPGD ; Point to DATA memory BCF EECON1, CFGS ; Access EEPROM BSF EECON1, WREN ; Enable writes BCF INTCON, GIE ; Disable Interrupts MOVLW 55h ; Required MOVWF EECON2 ; Write 55h Sequence MOVLW 0AAh ; MOVWF EECON2 ; Write 0AAh BSF EECON1, WR ; Set WR bit to begin write BSF INTCON, GIE ; Enable Interrupts ; User code execution BCF EECON1, WREN ; Disable writes on write complete (EEIF set) PIC18F2420/2520/4420/4520 DS39631B-page 86 Preliminary © 2007 Microchip Technology Inc. 7.6 Operation During Code-Protect Data EEPROM memory has its own code-protect bits in configuration words. External read and write operations are disabled if code protection is enabled. The microcontroller itself can both read and write to the internal data EEPROM, regardless of the state of the code-protect configuration bit. Refer to Section 23.0 “Special Features of the CPU” for additional information. 7.7 Protection Against Spurious Write There are conditions when the user may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been implemented. On power-up, the WREN bit is cleared. In addition, writes to the EEPROM are blocked during the Power-up Timer period (TPWRT, parameter 33). The write initiate sequence and the WREN bit together help prevent an accidental write during brown-out, power glitch or software malfunction. 7.8 Using the Data EEPROM The data EEPROM is a high endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). Frequently changing values will typically be updated more often than specification D124. If this is not the case, an array refresh must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. A simple data EEPROM refresh routine is shown in Example 7-3. EXAMPLE 7-3: DATA EEPROM REFRESH ROUTINE Note: If data EEPROM is only used to store constants and/or data that changes rarely, an array refresh is likely not required. See specification D124. CLRF EEADR ; Start at address 0 BCF EECON1, CFGS ; Set for memory BCF EECON1, EEPGD ; Set for Data EEPROM BCF INTCON, GIE ; Disable interrupts BSF EECON1, WREN ; Enable writes Loop ; Loop to refresh array BSF EECON1, RD ; Read current address MOVLW 55h ; MOVWF EECON2 ; Write 55h MOVLW 0AAh ; MOVWF EECON2 ; Write 0AAh BSF EECON1, WR ; Set WR bit to begin write BTFSC EECON1, WR ; Wait for write to complete BRA $-2 INCFSZ EEADR, F ; Increment address BRA LOOP ; Not zero, do it again BCF EECON1, WREN ; Disable writes BSF INTCON, GIE ; Enable interrupts © 2007 Microchip Technology Inc. Preliminary DS39631B-page 87 PIC18F2420/2520/4420/4520 TABLE 7-1: REGISTERS ASSOCIATED WITH DATA EEPROM MEMORY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 EEADR EEPROM Address Register 51 EEDATA EEPROM Data Register 51 EECON2 EEPROM Control Register 2 (not a physical register) 51 EECON1 EEPGD CFGS — FREE WRERR WREN WR RD 51 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during Flash/EEPROM access. PIC18F2420/2520/4420/4520 DS39631B-page 88 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 89 PIC18F2420/2520/4420/4520 8.0 8 x 8 HARDWARE MULTIPLIER 8.1 Introduction All PIC18 devices include an 8 x 8 hardware multiplier as part of the ALU. The multiplier performs an unsigned operation and yields a 16-bit result that is stored in the product register pair, PRODH:PRODL. The multiplier’s operation does not affect any flags in the Status register. Making multiplication a hardware operation allows it to be completed in a single instruction cycle. This has the advantages of higher computational throughput and reduced code size for multiplication algorithms and allows the PIC18 devices to be used in many applications previously reserved for digital signal processors. A comparison of various hardware and software multiply operations, along with the savings in memory and execution time, is shown in Table 8-1. 8.2 Operation Example 8-1 shows the instruction sequence for an 8 x 8 unsigned multiplication. Only one instruction is required when one of the arguments is already loaded in the WREG register. Example 8-2 shows the sequence to do an 8 x 8 signed multiplication. To account for the sign bits of the arguments, each argument’s Most Significant bit (MSb) is tested and the appropriate subtractions are done. EXAMPLE 8-1: 8 x 8 UNSIGNED MULTIPLY ROUTINE EXAMPLE 8-2: 8 x 8 SIGNED MULTIPLY ROUTINE TABLE 8-1: PERFORMANCE COMPARISON FOR VARIOUS MULTIPLY OPERATIONS MOVF ARG1, W ; MULWF ARG2 ; ARG1 * ARG2 -> ; PRODH:PRODL MOVF ARG1, W MULWF ARG2 ; ARG1 * ARG2 -> ; PRODH:PRODL BTFSC ARG2, SB ; Test Sign Bit SUBWF PRODH, F ; PRODH = PRODH ; - ARG1 MOVF ARG2, W BTFSC ARG1, SB ; Test Sign Bit SUBWF PRODH, F ; PRODH = PRODH ; - ARG2 Routine Multiply Method Program Memory (Words) Cycles (Max) Time @ 40 MHz @ 10 MHz @ 4 MHz 8 x 8 unsigned Without hardware multiply 13 69 6.9 μs 27.6 μs 69 μs Hardware multiply 1 1 100 ns 400 ns 1 μs 8 x 8 signed Without hardware multiply 33 91 9.1 μs 36.4 μs 91 μs Hardware multiply 6 6 600 ns 2.4 μs 6 μs 16 x 16 unsigned Without hardware multiply 21 242 24.2 μs 96.8 μs 242 μs Hardware multiply 28 28 2.8 μs 11.2 μs 28 μs 16 x 16 signed Without hardware multiply 52 254 25.4 μs 102.6 μs 254 μs Hardware multiply 35 40 4.0 μs 16.0 μs 40 μs PIC18F2420/2520/4420/4520 DS39631B-page 90 Preliminary © 2007 Microchip Technology Inc. Example 8-3 shows the sequence to do a 16 x 16 unsigned multiplication. Equation 8-1 shows the algorithm that is used. The 32-bit result is stored in four registers (RES3:RES0). EQUATION 8-1: 16 x 16 UNSIGNED MULTIPLICATION ALGORITHM EXAMPLE 8-3: 16 x 16 UNSIGNED MULTIPLY ROUTINE Example 8-4 shows the sequence to do a 16 x 16 signed multiply. Equation 8-2 shows the algorithm used. The 32-bit result is stored in four registers (RES3:RES0). To account for the sign bits of the arguments, the MSb for each argument pair is tested and the appropriate subtractions are done. EQUATION 8-2: 16 x 16 SIGNED MULTIPLICATION ALGORITHM EXAMPLE 8-4: 16 x 16 SIGNED MULTIPLY ROUTINE RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L = (ARG1H • ARG2H • 216) + (ARG1H • ARG2L • 28) + (ARG1L • ARG2H • 28) + (ARG1L • ARG2L) MOVF ARG1L, W MULWF ARG2L ; ARG1L * ARG2L-> ; PRODH:PRODL MOVFF PRODH, RES1 ; MOVFF PRODL, RES0 ; ; MOVF ARG1H, W MULWF ARG2H ; ARG1H * ARG2H-> ; PRODH:PRODL MOVFF PRODH, RES3 ; MOVFF PRODL, RES2 ; ; MOVF ARG1L, W MULWF ARG2H ; ARG1L * ARG2H-> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; ; MOVF ARG1H, W ; MULWF ARG2L ; ARG1H * ARG2L-> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; RES3:RES0 = ARG1H:ARG1L • ARG2H:ARG2L = (ARG1H • ARG2H • 216) + (ARG1H • ARG2L • 28) + (ARG1L • ARG2H • 28) + (ARG1L • ARG2L) + (-1 • ARG2H<7> • ARG1H:ARG1L • 216) + (-1 • ARG1H<7> • ARG2H:ARG2L • 216) MOVF ARG1L, W MULWF ARG2L ; ARG1L * ARG2L -> ; PRODH:PRODL MOVFF PRODH, RES1 ; MOVFF PRODL, RES0 ; ; MOVF ARG1H, W MULWF ARG2H ; ARG1H * ARG2H -> ; PRODH:PRODL MOVFF PRODH, RES3 ; MOVFF PRODL, RES2 ; ; MOVF ARG1L, W MULWF ARG2H ; ARG1L * ARG2H -> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; ; MOVF ARG1H, W ; MULWF ARG2L ; ARG1H * ARG2L -> ; PRODH:PRODL MOVF PRODL, W ; ADDWF RES1, F ; Add cross MOVF PRODH, W ; products ADDWFC RES2, F ; CLRF WREG ; ADDWFC RES3, F ; ; BTFSS ARG2H, 7 ; ARG2H:ARG2L neg? BRA SIGN_ARG1 ; no, check ARG1 MOVF ARG1L, W ; SUBWF RES2 ; MOVF ARG1H, W ; SUBWFB RES3 ; SIGN_ARG1 BTFSS ARG1H, 7 ; ARG1H:ARG1L neg? BRA CONT_CODE ; no, done MOVF ARG2L, W ; SUBWF RES2 ; MOVF ARG2H, W ; SUBWFB RES3 ; CONT_CODE : © 2007 Microchip Technology Inc. Preliminary DS39631B-page 91 PIC18F2420/2520/4420/4520 9.0 INTERRUPTS The PIC18F2420/2520/4420/4520 devices have multiple interrupt sources and an interrupt priority feature that allows most interrupt sources to be assigned a high priority level or a low priority level. The high priority interrupt vector is at 0008h and the low priority interrupt vector is at 0018h. High priority interrupt events will interrupt any low priority interrupts that may be in progress. There are ten registers which are used to control interrupt operation. These registers are: • RCON • INTCON • INTCON2 • INTCON3 • PIR1, PIR2 • PIE1, PIE2 • IPR1, IPR2 It is recommended that the Microchip header files supplied with MPLAB® IDE be used for the symbolic bit names in these registers. This allows the assembler/ compiler to automatically take care of the placement of these bits within the specified register. In general, interrupt sources have three bits to control their operation. They are: • Flag bit to indicate that an interrupt event occurred • Enable bit that allows program execution to branch to the interrupt vector address when the flag bit is set • Priority bit to select high priority or low priority The interrupt priority feature is enabled by setting the IPEN bit (RCON<7>). When interrupt priority is enabled, there are two bits which enable interrupts globally. Setting the GIEH bit (INTCON<7>) enables all interrupts that have the priority bit set (high priority). Setting the GIEL bit (INTCON<6>) enables all interrupts that have the priority bit cleared (low priority). When the interrupt flag, enable bit and appropriate global interrupt enable bit are set, the interrupt will vector immediately to address 0008h or 0018h, depending on the priority bit setting. Individual interrupts can be disabled through their corresponding enable bits. When the IPEN bit is cleared (default state), the interrupt priority feature is disabled and interrupts are compatible with PIC® mid-range devices. In Compatibility mode, the interrupt priority bits for each source have no effect. INTCON<6> is the PEIE bit, which enables/disables all peripheral interrupt sources. INTCON<7> is the GIE bit, which enables/disables all interrupt sources. All interrupts branch to address 0008h in Compatibility mode. When an interrupt is responded to, the global interrupt enable bit is cleared to disable further interrupts. If the IPEN bit is cleared, this is the GIE bit. If interrupt priority levels are used, this will be either the GIEH or GIEL bit. High priority interrupt sources can interrupt a low priority interrupt. Low priority interrupts are not processed while high priority interrupts are in progress. The return address is pushed onto the stack and the PC is loaded with the interrupt vector address (0008h or 0018h). Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bits must be cleared in software before re-enabling interrupts to avoid recursive interrupts. The “return from interrupt” instruction, RETFIE, exits the interrupt routine and sets the GIE bit (GIEH or GIEL if priority levels are used), which re-enables interrupts. For external interrupt events, such as the INT pins or the PORTB input change interrupt, the interrupt latency will be three to four instruction cycles. The exact latency is the same for one or two-cycle instructions. Individual interrupt flag bits are set, regardless of the status of their corresponding enable bit or the GIE bit. Note: Do not use the MOVFF instruction to modify any of the interrupt control registers while any interrupt is enabled. Doing so may cause erratic microcontroller behavior. PIC18F2420/2520/4420/4520 DS39631B-page 92 Preliminary © 2007 Microchip Technology Inc. FIGURE 9-1: PIC18 INTERRUPT LOGIC TMR0IE GIEH/GIE GIEL/PEIE Wake-up if in Interrupt to CPU Vector to Location 0008h INT2IF INT2IE INT2IP INT1IF INT1IE INT1IP TMR0IF TMR0IE TMR0IP RBIF RBIE RBIP IPEN TMR0IF TMR0IP INT1IF INT1IE INT1IP INT2IF INT2IE INT2IP RBIF RBIE RBIP INT0IF INT0IE GIEL/PEIE Interrupt to CPU Vector to Location IPEN IPEN 0018h SSPIF SSPIE SSPIP SSPIF SSPIE SSPIP ADIF ADIE ADIP RCIF RCIE RCIP Additional Peripheral Interrupts ADIF ADIE ADIP High Priority Interrupt Generation Low Priority Interrupt Generation RCIF RCIE RCIP Additional Peripheral Interrupts Idle or Sleep modes GIEH/GIE © 2007 Microchip Technology Inc. Preliminary DS39631B-page 93 PIC18F2420/2520/4420/4520 9.1 INTCON Registers The INTCON registers are readable and writable registers, which contain various enable, priority and flag bits. REGISTER 9-1: INTCON REGISTER Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF bit 7 bit 0 bit 7 GIE/GIEH: Global Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked interrupts 0 = Disables all interrupts When IPEN = 1: 1 = Enables all high priority interrupts 0 = Disables all interrupts bit 6 PEIE/GIEL: Peripheral Interrupt Enable bit When IPEN = 0: 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts When IPEN = 1: 1 = Enables all low priority peripheral interrupts 0 = Disables all low priority peripheral interrupts bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 overflow interrupt 0 = Disables the TMR0 overflow interrupt bit 4 INT0IE: INT0 External Interrupt Enable bit 1 = Enables the INT0 external interrupt 0 = Disables the INT0 external interrupt bit 3 RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INT0IF: INT0 External Interrupt Flag bit 1 = The INT0 external interrupt occurred (must be cleared in software) 0 = The INT0 external interrupt did not occur bit 0 RBIF: RB Port Change Interrupt Flag bit 1 = At least one of the RB7:RB4 pins changed state (must be cleared in software) 0 = None of the RB7:RB4 pins have changed state Note: A mismatch condition will continue to set this bit. Reading PORTB will end the mismatch condition and allow the bit to be cleared. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 94 Preliminary © 2007 Microchip Technology Inc. REGISTER 9-2: INTCON2 REGISTER R/W-1 R/W-1 R/W-1 R/W-1 U-0 R/W-1 U-0 R/W-1 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP bit 7 bit 0 bit 7 RBPU: PORTB Pull-up Enable bit 1 = All PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6 INTEDG0: External Interrupt 0 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 5 INTEDG1: External Interrupt 1 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 4 INTEDG2: External Interrupt 2 Edge Select bit 1 = Interrupt on rising edge 0 = Interrupt on falling edge bit 3 Unimplemented: Read as ‘0’ bit 2 TMR0IP: TMR0 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 Unimplemented: Read as ‘0’ bit 0 RBIP: RB Port Change Interrupt Priority bit 1 = High priority 0 = Low priority Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 95 PIC18F2420/2520/4420/4520 REGISTER 9-3: INTCON3 REGISTER R/W-1 R/W-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF bit 7 bit 0 bit 7 INT2IP: INT2 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 INT1IP: INT1 External Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 Unimplemented: Read as ‘0’ bit 4 INT2IE: INT2 External Interrupt Enable bit 1 = Enables the INT2 external interrupt 0 = Disables the INT2 external interrupt bit 3 INT1IE: INT1 External Interrupt Enable bit 1 = Enables the INT1 external interrupt 0 = Disables the INT1 external interrupt bit 2 Unimplemented: Read as ‘0’ bit 1 INT2IF: INT2 External Interrupt Flag bit 1 = The INT2 external interrupt occurred (must be cleared in software) 0 = The INT2 external interrupt did not occur bit 0 INT1IF: INT1 External Interrupt Flag bit 1 = The INT1 external interrupt occurred (must be cleared in software) 0 = The INT1 external interrupt did not occur Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. This feature allows for software polling. PIC18F2420/2520/4420/4520 DS39631B-page 96 Preliminary © 2007 Microchip Technology Inc. 9.2 PIR Registers The PIR registers contain the individual flag bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are two Peripheral Interrupt Request Flag registers (PIR1 and PIR2). REGISTER 9-4: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1 Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the Global Interrupt Enable bit, GIE (INTCON<7>). 2: User software should ensure the appropriate interrupt flag bits are cleared prior to enabling an interrupt and after servicing that interrupt. R/W-0 R/W-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF bit 7 bit 0 bit 7 PSPIF: Parallel Slave Port Read/Write Interrupt Flag bit(1) 1 = A read or a write operation has taken place (must be cleared in software) 0 = No read or write has occurred Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’. bit 6 ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed (must be cleared in software) 0 = The A/D conversion is not complete bit 5 RCIF: EUSART Receive Interrupt Flag bit 1 = The EUSART receive buffer, RCREG, is full (cleared when RCREG is read) 0 = The EUSART receive buffer is empty bit 4 TXIF: EUSART Transmit Interrupt Flag bit 1 = The EUSART transmit buffer, TXREG, is empty (cleared when TXREG is written) 0 = The EUSART transmit buffer is full bit 3 SSPIF: Master Synchronous Serial Port Interrupt Flag bit 1 = The transmission/reception is complete (must be cleared in software) 0 = Waiting to transmit/receive bit 2 CCP1IF: CCP1 Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode. bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 97 PIC18F2420/2520/4420/4520 REGISTER 9-5: PIR2: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 2 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF bit 7 bit 0 bit 7 OSCFIF: Oscillator Fail Interrupt Flag bit 1 = Device oscillator failed, clock input has changed to INTOSC (must be cleared in software) 0 = Device clock operating bit 6 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed (must be cleared in software) 0 = Comparator input has not changed bit 5 Unimplemented: Read as ‘0’ bit 4 EEIF: Data EEPROM/Flash Write Operation Interrupt Flag bit 1 = The write operation is complete (must be cleared in software) 0 = The write operation is not complete or has not been started bit 3 BCLIF: Bus Collision Interrupt Flag bit 1 = A bus collision occurred (must be cleared in software) 0 = No bus collision occurred bit 2 HLVDIF: High/Low-Voltage Detect Interrupt Flag bit 1 = A high/low-voltage condition occurred (direction determined by VDIRMAG bit, HLVDCON<7>) 0 = A high/low-voltage condition has not occurred bit 1 TMR3IF: TMR3 Overflow Interrupt Flag bit 1 = TMR3 register overflowed (must be cleared in software) 0 = TMR3 register did not overflow bit 0 CCP2IF: CCPx Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 98 Preliminary © 2007 Microchip Technology Inc. 9.3 PIE Registers The PIE registers contain the individual enable bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are two Peripheral Interrupt Enable registers (PIE1 and PIE2). When IPEN = 0, the PEIE bit must be set to enable any of these peripheral interrupts. REGISTER 9-6: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE bit 7 bit 0 bit 7 PSPIE: Parallel Slave Port Read/Write Interrupt Enable bit(1) 1 = Enables the PSP read/write interrupt 0 = Disables the PSP read/write interrupt Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’. bit 6 ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt bit 5 RCIE: EUSART Receive Interrupt Enable bit 1 = Enables the EUSART receive interrupt 0 = Disables the EUSART receive interrupt bit 4 TXIE: EUSART Transmit Interrupt Enable bit 1 = Enables the EUSART transmit interrupt 0 = Disables the EUSART transmit interrupt bit 3 SSPIE: Master Synchronous Serial Port Interrupt Enable bit 1 = Enables the MSSP interrupt 0 = Disables the MSSP interrupt bit 2 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 99 PIC18F2420/2520/4420/4520 REGISTER 9-7: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE bit 7 bit 0 bit 7 OSCFIE: Oscillator Fail Interrupt Enable bit 1 = Enabled 0 = Disabled bit 6 CMIE: Comparator Interrupt Enable bit 1 = Enabled 0 = Disabled bit 5 Unimplemented: Read as ‘0’ bit 4 EEIE: Data EEPROM/Flash Write Operation Interrupt Enable bit 1 = Enabled 0 = Disabled bit 3 BCLIE: Bus Collision Interrupt Enable bit 1 = Enabled 0 = Disabled bit 2 HLVDIE: High/Low-Voltage Detect Interrupt Enable bit 1 = Enabled 0 = Disabled bit 1 TMR3IE: TMR3 Overflow Interrupt Enable bit 1 = Enabled 0 = Disabled bit 0 CCP2IE: CCP2 Interrupt Enable bit 1 = Enabled 0 = Disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 100 Preliminary © 2007 Microchip Technology Inc. 9.4 IPR Registers The IPR registers contain the individual priority bits for the peripheral interrupts. Due to the number of peripheral interrupt sources, there are two Peripheral Interrupt Priority registers (IPR1 and IPR2). Using the priority bits requires that the Interrupt Priority Enable (IPEN) bit be set. REGISTER 9-8: IPR1: PERIPHERAL INTERRUPT PRIORITY REGISTER 1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP bit 7 bit 0 bit 7 PSPIP: Parallel Slave Port Read/Write Interrupt Priority bit(1) 1 = High priority 0 = Low priority Note 1: This bit is unimplemented on 28-pin devices and will read as ‘0’. bit 6 ADIP: A/D Converter Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 RCIP: EUSART Receive Interrupt Priority bit 1 = High priority 0 = Low priority bit 4 TXIP: EUSART Transmit Interrupt Priority bit 1 = High priority 0 = Low priority bit 3 SSPIP: Master Synchronous Serial Port Interrupt Priority bit 1 = High priority 0 = Low priority bit 2 CCP1IP: CCP1 Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 TMR2IP: TMR2 to PR2 Match Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 TMR1IP: TMR1 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 101 PIC18F2420/2520/4420/4520 REGISTER 9-9: IPR2: PERIPHERAL INTERRUPT PRIORITY REGISTER 2 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP bit 7 bit 0 bit 7 OSCFIP: Oscillator Fail Interrupt Priority bit 1 = High priority 0 = Low priority bit 6 CMIP: Comparator Interrupt Priority bit 1 = High priority 0 = Low priority bit 5 Unimplemented: Read as ‘0’ bit 4 EEIP: Data EEPROM/Flash Write Operation Interrupt Priority bit 1 = High priority 0 = Low priority bit 3 BCLIP: Bus Collision Interrupt Priority bit 1 = High priority 0 = Low priority bit 2 HLVDIP: High/Low-Voltage Detect Interrupt Priority bit 1 = High priority 0 = Low priority bit 1 TMR3IP: TMR3 Overflow Interrupt Priority bit 1 = High priority 0 = Low priority bit 0 CCP2IP: CCP2 Interrupt Priority bit 1 = High priority 0 = Low priority Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 102 Preliminary © 2007 Microchip Technology Inc. 9.5 RCON Register The RCON register contains flag bits which are used to determine the cause of the last Reset or wake-up from Idle or Sleep modes. RCON also contains the IPEN bit which enables interrupt priorities. The operation of the SBOREN bit and the Reset flag bits is discussed in more detail in Section 4.1 “RCON Register”. REGISTER 9-10: RCON REGISTER R/W-0 R/W-1(1) U-0 R/W-1 R-1 R-1 R/W-0(1) R/W-0 IPEN SBOREN — RI TO PD POR BOR bit 7 bit 0 bit 7 IPEN: Interrupt Priority Enable bit 1 = Enable priority levels on interrupts 0 = Disable priority levels on interrupts (PIC16XXX Compatibility mode) bit 6 SBOREN: Software BOR Enable bit(1) For details of bit operation, see Register 4-1. Note 1: Actual Reset values are determined by device configuration and the nature of the device Reset. See Register 4-1 for additional information. bit 5 Unimplemented: Read as ‘0’ bit 4 RI: RESET Instruction Flag bit For details of bit operation, see Register 4-1. bit 3 TO: Watchdog Time-out Flag bit For details of bit operation, see Register 4-1. bit 2 PD: Power-down Detection Flag bit For details of bit operation, see Register 4-1. bit 1 POR: Power-on Reset Status bit For details of bit operation, see Register 4-1. bit 0 BOR: Brown-out Reset Status bit For details of bit operation, see Register 4-1. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 103 PIC18F2420/2520/4420/4520 9.6 INTn Pin Interrupts External interrupts on the RB0/INT0, RB1/INT1 and RB2/INT2 pins are edge-triggered. If the corresponding INTEDGx bit in the INTCON2 register is set (= 1), the interrupt is triggered by a rising edge; if the bit is clear, the trigger is on the falling edge. When a valid edge appears on the RBx/INTx pin, the corresponding flag bit, INTxF, is set. This interrupt can be disabled by clearing the corresponding enable bit, INTxE. Flag bit, INTxF, must be cleared in software in the Interrupt Service Routine before re-enabling the interrupt. All external interrupts (INT0, INT1 and INT2) can wakeup the processor from Idle or Sleep modes if bit INTxE was set prior to going into those modes. If the Global Interrupt Enable bit, GIE, is set, the processor will branch to the interrupt vector following wake-up. Interrupt priority for INT1 and INT2 is determined by the value contained in the interrupt priority bits, INT1IP (INTCON3<6>) and INT2IP (INTCON3<7>). There is no priority bit associated with INT0. It is always a high priority interrupt source. 9.7 TMR0 Interrupt In 8-bit mode (which is the default), an overflow in the TMR0 register (FFh → 00h) will set flag bit, TMR0IF. In 16-bit mode, an overflow in the TMR0H:TMR0L register pair (FFFFh → 0000h) will set TMR0IF. The interrupt can be enabled/disabled by setting/clearing enable bit, TMR0IE (INTCON<5>). Interrupt priority for Timer0 is determined by the value contained in the interrupt priority bit, TMR0IP (INTCON2<2>). See Section 11.0 “Timer0 Module” for further details on the Timer0 module. 9.8 PORTB Interrupt-on-Change An input change on PORTB<7:4> sets flag bit, RBIF (INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit, RBIE (INTCON<3>). Interrupt priority for PORTB interrupt-on-change is determined by the value contained in the interrupt priority bit, RBIP (INTCON2<0>). 9.9 Context Saving During Interrupts During interrupts, the return PC address is saved on the stack. Additionally, the WREG, Status and BSR registers are saved on the fast return stack. If a fast return from interrupt is not used (see Section 5.3 “Data Memory Organization”), the user may need to save the WREG, Status and BSR registers on entry to the Interrupt Service Routine. Depending on the user’s application, other registers may also need to be saved. Example 9-1 saves and restores the WREG, Status and BSR registers during an Interrupt Service Routine. EXAMPLE 9-1: SAVING STATUS, WREG AND BSR REGISTERS IN RAM MOVWF W_TEMP ; W_TEMP is in virtual bank MOVFF STATUS, STATUS_TEMP ; STATUS_TEMP located anywhere MOVFF BSR, BSR_TEMP ; BSR_TMEP located anywhere ; ; USER ISR CODE ; MOVFF BSR_TEMP, BSR ; Restore BSR MOVF W_TEMP, W ; Restore WREG MOVFF STATUS_TEMP, STATUS ; Restore STATUS PIC18F2420/2520/4420/4520 DS39631B-page 104 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 105 PIC18F2420/2520/4420/4520 10.0 I/O PORTS Depending on the device selected and features enabled, there are up to five ports available. Some pins of the I/O ports are multiplexed with an alternate function from the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Each port has three registers for its operation. These registers are: • TRIS register (data direction register) • PORT register (reads the levels on the pins of the device) • LAT register (output latch) The Data Latch (LAT register) is useful for read-modifywrite operations on the value that the I/O pins are driving. A simplified model of a generic I/O port, without the interfaces to other peripherals, is shown in Figure 10-1. FIGURE 10-1: GENERIC I/O PORT OPERATION 10.1 PORTA, TRISA and LATA Registers PORTA is a 8-bit wide, bidirectional port. The corresponding data direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output (i.e., put the contents of the output latch on the selected pin). Reading the PORTA register reads the status of the pins, whereas writing to it, will write to the port latch. The Data Latch (LATA) register is also memory mapped. Read-modify-write operations on the LATA register read and write the latched output value for PORTA. The RA4 pin is multiplexed with the Timer0 module clock input and one of the comparator outputs to become the RA4/T0CKI/C1OUT pin. Pins RA6 and RA7 are multiplexed with the main oscillator pins; they are enabled as oscillator or I/O pins by the selection of the main oscillator in the configuration register (see Section 23.1 “Configuration Bits” for details). When they are not used as port pins, RA6 and RA7 and their associated TRIS and LAT bits are read as ‘0’. The other PORTA pins are multiplexed with analog inputs, the analog VREF+ and VREF- inputs and the comparator voltage reference output. The operation of pins RA3:RA0 and RA5 as A/D converter inputs is selected by clearing or setting the control bits in the ADCON1 register (A/D Control Register 1). Pins RA0 through RA5 may also be used as comparator inputs or outputs by setting the appropriate bits in the CMCON register. To use RA3:RA0 as digital inputs, it is also necessary to turn off the comparators. The RA4/T0CKI/C1OUT pin is a Schmitt Trigger input. All other PORTA pins have TTL input levels and full CMOS output drivers. The TRISA register controls the direction of the PORTA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. EXAMPLE 10-1: INITIALIZING PORTA Data Bus WR LAT WR TRIS RD Port Data Latch TRIS Latch RD TRIS Input Buffer I/O pin(1) D Q CK D Q CK EN Q D EN RD LAT or Port Note 1: I/O pins have diode protection to VDD and VSS. Note: On a Power-on Reset, RA5 and RA3:RA0 are configured as analog inputs and read as ‘0’. RA4 is configured as a digital input. CLRF PORTA ; Initialize PORTA by ; clearing output ; data latches CLRF LATA ; Alternate method ; to clear output ; data latches MOVLW 07h ; Configure A/D MOVWF ADCON1 ; for digital inputs MOVWF 07h ; Configure comparators MOVWF CMCON ; for digital input MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISA ; Set RA<3:0> as inputs ; RA<5:4> as outputs PIC18F2420/2520/4420/4520 DS39631B-page 106 Preliminary © 2007 Microchip Technology Inc. TABLE 10-1: PORTA I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RA0/AN0 RA0 0 O DIG LATA<0> data output; not affected by analog input. 1 I TTL PORTA<0> data input; disabled when analog input enabled. AN0 1 I ANA A/D input channel 0 and Comparator C1- input. Default input configuration on POR; does not affect digital output. RA1/AN1 RA1 0 O DIG LATA<1> data output; not affected by analog input. 1 I TTL PORTA<1> data input; disabled when analog input enabled. AN1 1 I ANA A/D input channel 1 and Comparator C2- input. Default input configuration on POR; does not affect digital output. RA2/AN2/ VREF-/CVREF RA2 0 O DIG LATA<2> data output; not affected by analog input. Disabled when CVREF output enabled. 1 I TTL PORTA<2> data input. Disabled when analog functions enabled; disabled when CVREF output enabled. AN2 1 I ANA A/D input channel 2 and Comparator C2+ input. Default input configuration on POR; not affected by analog output. VREF- 1 I ANA A/D and comparator voltage reference low input. CVREF x O ANA Comparator voltage reference output. Enabling this feature disables digital I/O. RA3/AN3/VREF+ RA3 0 O DIG LATA<3> data output; not affected by analog input. 1 I TTL PORTA<3> data input; disabled when analog input enabled. AN3 1 I ANA A/D input channel 3 and Comparator C1+ input. Default input configuration on POR. VREF+ 1 I ANA A/D and comparator voltage reference high input. RA4/T0CKI/C1OUT RA4 0 O DIG LATA<4> data output. 1 I ST PORTA<4> data input; default configuration on POR. T0CKI 1 I ST Timer0 clock input. C1OUT 0 O DIG Comparator 1 output; takes priority over port data. RA5/AN4/SS/ HLVDIN/C2OUT RA5 0 O DIG LATA<5> data output; not affected by analog input. 1 I TTL PORTA<5> data input; disabled when analog input enabled. AN4 1 I ANA A/D input channel 4. Default configuration on POR. SS 1 I TTL Slave select input for SSP (MSSP module). HLVDIN 1 I ANA High/Low-Voltage Detect external trip point input. C2OUT 0 O DIG Comparator 2 output; takes priority over port data. OSC2/CLKO/RA6 RA6 0 O DIG LATA<6> data output. Enabled in RCIO, INTIO2 and ECIO modes only. 1 I TTL PORTA<6> data input. Enabled in RCIO, INTIO2 and ECIO modes only. OSC2 x O ANA Main oscillator feedback output connection (XT, HS and LP modes). CLKO x O DIG System cycle clock output (FOSC/4) in RC, INTIO1 and EC Oscillator modes. OSC1/CLKI/RA7 RA7 0 O DIG LATA<7> data output. Disabled in external oscillator modes. 1 I TTL PORTA<7> data input. Disabled in external oscillator modes. OSC1 x I ANA Main oscillator input connection. CLKI x I ANA Main clock input connection. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). © 2007 Microchip Technology Inc. Preliminary DS39631B-page 107 PIC18F2420/2520/4420/4520 TABLE 10-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 LATA LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch) 52 TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Control Register 52 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTA. Note 1: RA7:RA6 and their associated latch and data direction bits are enabled as I/O pins based on oscillator configuration; otherwise, they are read as ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 108 Preliminary © 2007 Microchip Technology Inc. 10.2 PORTB, TRISB and LATB Registers PORTB is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISB. Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output (i.e., put the contents of the output latch on the selected pin). The Data Latch register (LATB) is also memory mapped. Read-modify-write operations on the LATB register read and write the latched output value for PORTB. EXAMPLE 10-2: INITIALIZING PORTB Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit, RBPU (INTCON2<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. Four of the PORTB pins (RB7:RB4) have an interrupton- change feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB7:RB4 pin configured as an output is excluded from the interrupton- change comparison). The input pins (of RB7:RB4) are compared with the old value latched on the last read of PORTB. The “mismatch” outputs of RB7:RB4 are ORed together to generate the RB Port Change Interrupt with Flag bit, RBIF (INTCON<0>). This interrupt can wake the device from the Sleep mode, or any of the Idle modes. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of PORTB (except with the MOVFF (ANY), PORTB instruction). b) Clear flag bit, RBIF. A mismatch condition will continue to set flag bit, RBIF. Reading PORTB will end the mismatch condition and allow flag bit, RBIF, to be cleared. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. RB3 can be configured by the configuration bit, CCP2MX, as the alternate peripheral pin for the CCP2 module (CCP2MX = 0). Note: On a Power-on Reset, RB4:RB0 are configured as analog inputs by default and read as ‘0’; RB7:RB5 are configured as digital inputs. By programming the configuration bit, PBADEN, RB4:RB0 will alternatively be configured as digital inputs on POR. CLRF PORTB ; Initialize PORTB by ; clearing output ; data latches CLRF LATB ; Alternate method ; to clear output ; data latches MOVLW 0Fh ; Set RB<4:0> as MOVWF ADCON1 ; digital I/O pins ; (required if config bit ; PBADEN is set) MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISB ; Set RB<3:0> as inputs ; RB<5:4> as outputs ; RB<7:6> as inputs © 2007 Microchip Technology Inc. Preliminary DS39631B-page 109 PIC18F2420/2520/4420/4520 TABLE 10-3: PORTB I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RB0/INT0/FLT0/ AN12 RB0 0 O DIG LATB<0> data output; not affected by analog input. 1 I TTL PORTB<0> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) INT0 1 I ST External interrupt 0 input. FLT0 1 I ST Enhanced PWM Fault input (ECCP1 module); enabled in software. AN12 1 I ANA A/D input channel 12.(1) RB1/INT1/AN10 RB1 0 O DIG LATB<1> data output; not affected by analog input. 1 I TTL PORTB<1> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) INT1 1 I ST External Interrupt 1 input. AN10 1 I ANA A/D input channel 10.(1) RB2/INT2/AN8 RB2 0 O DIG LATB<2> data output; not affected by analog input. 1 I TTL PORTB<2> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) INT2 1 I ST External interrupt 2 input. AN8 1 I ANA A/D input channel 8.(1) RB3/AN9/CCP2 RB3 0 O DIG LATB<3> data output; not affected by analog input. 1 I TTL PORTB<3> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) AN9 1 I ANA A/D input channel 9.(1) CCP2(2) 0 O DIG CCP2 compare and PWM output. 1 I ST CCP2 capture input RB4/KBI0/AN11 RB4 0 O DIG LATB<4> data output; not affected by analog input. 1 I TTL PORTB<4> data input; weak pull-up when RBPU bit is cleared. Disabled when analog input enabled.(1) KBI0 1 I TTL Interrupt on pin change. AN11 1 I ANA A/D input channel 11.(1) RB5/KBI1/PGM RB5 0 O DIG LATB<5> data output. 1 I TTL PORTB<5> data input; weak pull-up when RBPU bit is cleared. KBI1 1 I TTL Interrupt on pin change. PGM x I ST Single-Supply Programming mode entry (ICSP™). Enabled by LVP configuration bit; all other pin functions disabled. RB6/KBI2/PGC RB6 0 O DIG LATB<6> data output. 1 I TTL PORTB<6> data input; weak pull-up when RBPU bit is cleared. KBI2 1 I TTL Interrupt on pin change. PGC x I ST Serial execution (ICSP) clock input for ICSP and ICD operation.(3) RB7/KBI3/PGD RB7 0 O DIG LATB<7> data output. 1 I TTL PORTB<7> data input; weak pull-up when RBPU bit is cleared. KBI3 1 I TTL Interrupt on pin change. PGD x O DIG Serial execution data output for ICSP and ICD operation.(3) x I ST Serial execution data input for ICSP and ICD operation.(3) Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Note 1: Configuration on POR is determined by the PBADEN configuration bit. Pins are configured as analog inputs by default when PBADEN is set and digital inputs when PBADEN is cleared. 2: Alternate assignment for CCP2 when the CCP2MX configuration bit is ‘0’. Default assignment is RC1. 3: All other pin functions are disabled when ICSP or ICD are enabled. PIC18F2420/2520/4420/4520 DS39631B-page 110 Preliminary © 2007 Microchip Technology Inc. TABLE 10-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52 LATB PORTB Data Latch Register (Read and Write to Data Latch) 52 TRISB PORTB Data Direction Control Register 52 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 INTCON2 RBPU INTEDG0 INTEDG1 INTEDG2 — TMR0IP — RBIP 49 INTCON3 INT2IP INT1IP — INT2IE INT1IE — INT2IF INT1IF 49 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTB. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 111 PIC18F2420/2520/4420/4520 10.3 PORTC, TRISC and LATC Registers PORTC is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISC. Setting a TRISC bit (= 1) will make the corresponding PORTC pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISC bit (= 0) will make the corresponding PORTC pin an output (i.e., put the contents of the output latch on the selected pin). The Data Latch register (LATC) is also memory mapped. Read-modify-write operations on the LATC register read and write the latched output value for PORTC. PORTC is multiplexed with several peripheral functions (Table 10-5). The pins have Schmitt Trigger input buffers. RC1 is normally configured by configuration bit, CCP2MX, as the default peripheral pin of the CCP2 module (default/erased state, CCP2MX = 1). When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTC pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. The user should refer to the corresponding peripheral section for additional information. The contents of the TRISC register are affected by peripheral overrides. Reading TRISC always returns the current contents, even though a peripheral device may be overriding one or more of the pins. EXAMPLE 10-3: INITIALIZING PORTC Note: On a Power-on Reset, these pins are configured as digital inputs. CLRF PORTC ; Initialize PORTC by ; clearing output ; data latches CLRF LATC ; Alternate method ; to clear output ; data latches MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISC ; Set RC<3:0> as inputs ; RC<5:4> as outputs ; RC<7:6> as inputs PIC18F2420/2520/4420/4520 DS39631B-page 112 Preliminary © 2007 Microchip Technology Inc. TABLE 10-5: PORTC I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RC0/T1OSO/ T13CKI RC0 0 O DIG LATC<0> data output. 1 I ST PORTC<0> data input. T1OSO x O ANA Timer1 oscillator output; enabled when Timer1 oscillator enabled. Disables digital I/O. T13CKI 1 I ST Timer1/Timer3 counter input. RC1/T1OSI/CCP2 RC1 0 O DIG LATC<1> data output. 1 I ST PORTC<1> data input. T1OSI x I ANA Timer1 oscillator input; enabled when Timer1 oscillator enabled. Disables digital I/O. CCP2(1) 0 O DIG CCP2 compare and PWM output; takes priority over port data. 1 I ST CCP2 capture input. RC2/CCP1/P1A RC2 0 O DIG LATC<2> data output. 1 I ST PORTC<2> data input. CCP1 0 O DIG ECCP1 compare or PWM output; takes priority over port data. 1 I ST ECCP1 capture input. P1A(2) 0 O DIG ECCP1 Enhanced PWM output, channel A. May be configured for tri-state during Enhanced PWM shutdown events. Takes priority over port data. RC3/SCK/SCL RC3 0 O DIG LATC<3> data output. 1 I ST PORTC<3> data input. SCK 0 O DIG SPI™ clock output (MSSP module); takes priority over port data. 1 I ST SPI clock input (MSSP module). SCL 0 O DIG I2 C™ clock output (MSSP module); takes priority over port data. 1 I I2C/SMB I2C clock input (MSSP module); input type depends on module setting. RC4/SDI/SDA RC4 0 O DIG LATC<4> data output. 1 I ST PORTC<4> data input. SDI 1 I ST SPI data input (MSSP module). SDA 1 O DIG I2 C data output (MSSP module); takes priority over port data. 1 I I2C/SMB I2C data input (MSSP module); input type depends on module setting. RC5/SDO RC5 0 O DIG LATC<5> data output. 1 I ST PORTC<5> data input. SDO 0 O DIG SPI data output (MSSP module); takes priority over port data. RC6/TX/CK RC6 0 O DIG LATC<6> data output. 1 I ST PORTC<6> data input. TX 1 O DIG Asynchronous serial transmit data output (USART module); takes priority over port data. User must configure as output. CK 1 O DIG Synchronous serial clock output (USART module); takes priority over port data. 1 I ST Synchronous serial clock input (USART module). RC7/RX/DT RC7 0 O DIG LATC<7> data output. 1 I ST PORTC<7> data input. RX 1 I ST Asynchronous serial receive data input (USART module). DT 1 O DIG Synchronous serial data output (USART module); takes priority over port data. 1 I ST Synchronous serial data input (USART module). User must configure as an input. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; I2C/SMB = I2C/SMBus input buffer; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Note 1: Default assignment for CCP2 when the CCP2MX configuration bit is set. Alternate assignment is RB3. 2: Enhanced PWM output is available only on PIC18F4520 devices. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 113 PIC18F2420/2520/4420/4520 TABLE 10-6: SUMMARY OF REGISTERS ASSOCIATED WITH PORTC Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTC RC7 RC6 RC5 RC4 RC3 RC2 RC1 RC0 52 LATC PORTC Data Latch Register (Read and Write to Data Latch) 52 TRISC PORTC Data Direction Control Register 52 PIC18F2420/2520/4420/4520 DS39631B-page 114 Preliminary © 2007 Microchip Technology Inc. 10.4 PORTD, TRISD and LATD Registers PORTD is an 8-bit wide, bidirectional port. The corresponding data direction register is TRISD. Setting a TRISD bit (= 1) will make the corresponding PORTD pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISD bit (= 0) will make the corresponding PORTD pin an output (i.e., put the contents of the output latch on the selected pin). The Data Latch register (LATD) is also memory mapped. Read-modify-write operations on the LATD register read and write the latched output value for PORTD. All pins on PORTD are implemented with Schmitt Trigger input buffers. Each pin is individually configurable as an input or output. Three of the PORTD pins are multiplexed with outputs P1B, P1C and P1D of the enhanced CCP module. The operation of these additional PWM output pins is covered in greater detail in Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”. PORTD can also be configured as an 8-bit wide microprocessor port (Parallel Slave Port) by setting control bit, PSPMODE (TRISE<4>). In this mode, the input buffers are TTL. See Section 10.6 “Parallel Slave Port” for additional information on the Parallel Slave Port (PSP). EXAMPLE 10-4: INITIALIZING PORTD Note: PORTD is only available on 40/44-pin devices. Note: On a Power-on Reset, these pins are configured as digital inputs. Note: When the enhanced PWM mode is used with either dual or quad outputs, the PSP functions of PORTD are automatically disabled. CLRF PORTD ; Initialize PORTD by ; clearing output ; data latches CLRF LATD ; Alternate method ; to clear output ; data latches MOVLW 0CFh ; Value used to ; initialize data ; direction MOVWF TRISD ; Set RD<3:0> as inputs ; RD<5:4> as outputs ; RD<7:6> as inputs © 2007 Microchip Technology Inc. Preliminary DS39631B-page 115 PIC18F2420/2520/4420/4520 TABLE 10-7: PORTD I/O SUMMARY Pin Function TRIS Setting I/O I/O Type Description RD0/PSP0 RD0 0 O DIG LATD<0> data output. 1 I ST PORTD<0> data input. PSP0 x O DIG PSP read data output (LATD<0>); takes priority over port data. x I TTL PSP write data input. RD1/PSP1 RD1 0 O DIG LATD<1> data output. 1 I ST PORTD<1> data input. PSP1 x O DIG PSP read data output (LATD<1>); takes priority over port data. x I TTL PSP write data input. RD2/PSP2 RD2 0 O DIG LATD<2> data output. 1 I ST PORTD<2> data input. PSP2 x O DIG PSP read data output (LATD<2>); takes priority over port data. x I TTL PSP write data input. RD3/PSP3 RD3 0 O DIG LATD<3> data output. 1 I ST PORTD<3> data input. PSP3 x O DIG PSP read data output (LATD<3>); takes priority over port data. x I TTL PSP write data input. RD4/PSP4 RD4 0 O DIG LATD<4> data output. 1 I ST PORTD<4> data input. PSP4 x O DIG PSP read data output (LATD<4>); takes priority over port data. x I TTL PSP write data input. RD5/PSP5/P1B RD5 0 O DIG LATD<5> data output. 1 I ST PORTD<5> data input. PSP5 x O DIG PSP read data output (LATD<5>); takes priority over port data. x I TTL PSP write data input. P1B 0 O DIG ECCP1 Enhanced PWM output, channel B; takes priority over port and PSP data. May be configured for tri-state during Enhanced PWM shutdown events. RD6/PSP6/P1C RD6 0 O DIG LATD<6> data output. 1 I ST PORTD<6> data input. PSP6 x O DIG PSP read data output (LATD<6>); takes priority over port data. x I TTL PSP write data input. P1C 0 O DIG ECCP1 Enhanced PWM output, channel C; takes priority over port and PSP data. May be configured for tri-state during Enhanced PWM shutdown events. RD7/PSP7/P1D RD7 0 O DIG LATD<7> data output. 1 I ST PORTD<7> data input. PSP7 x O DIG PSP read data output (LATD<7>); takes priority over port data. x I TTL PSP write data input. P1D 0 O DIG ECCP1 Enhanced PWM output, channel D; takes priority over port and PSP data. May be configured for tri-state during Enhanced PWM shutdown events. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). PIC18F2420/2520/4420/4520 DS39631B-page 116 Preliminary © 2007 Microchip Technology Inc. TABLE 10-8: SUMMARY OF REGISTERS ASSOCIATED WITH PORTD Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52 LATD PORTD Data Latch Register (Read and Write to Data Latch) 52 TRISD PORTD Data Direction Control Register 52 TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 CCP1CON P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTD. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 117 PIC18F2420/2520/4420/4520 10.5 PORTE, TRISE and LATE Registers Depending on the particular PIC18F2420/2520/4420/ 4520 device selected, PORTE is implemented in two different ways. For 40/44-pin devices, PORTE is a 4-bit wide port. Three pins (RE0/RD/AN5, RE1/WR/AN6 and RE2/CS/ AN7) are individually configurable as inputs or outputs. These pins have Schmitt Trigger input buffers. When selected as an analog input, these pins will read as ‘0’s. The corresponding data direction register is TRISE. Setting a TRISE bit (= 1) will make the corresponding PORTE pin an input (i.e., put the corresponding output driver in a high-impedance mode). Clearing a TRISE bit (= 0) will make the corresponding PORTE pin an output (i.e., put the contents of the output latch on the selected pin). TRISE controls the direction of the RE pins, even when they are being used as analog inputs. The user must make sure to keep the pins configured as inputs when using them as analog inputs. The upper four bits of the TRISE register also control the operation of the Parallel Slave Port. Their operation is explained in Register 10-1. The Data Latch register (LATE) is also memory mapped. Read-modify-write operations on the LATE register, read and write the latched output value for PORTE. The fourth pin of PORTE (MCLR/VPP/RE3) is an input only pin. Its operation is controlled by the MCLRE configuration bit. When selected as a port pin (MCLRE = 0), it functions as a digital input only pin; as such, it does not have TRIS or LAT bits associated with its operation. Otherwise, it functions as the device’s Master Clear input. In either configuration, RE3 also functions as the programming voltage input during programming. EXAMPLE 10-5: INITIALIZING PORTE 10.5.1 PORTE IN 28-PIN DEVICES For 28-pin devices, PORTE is only available when Master Clear functionality is disabled (MCLRE = 0). In these cases, PORTE is a single bit, input only port comprised of RE3 only. The pin operates as previously described. Note: On a Power-on Reset, RE2:RE0 are configured as analog inputs. Note: On a Power-on Reset, RE3 is enabled as a digital input only if Master Clear functionality is disabled. CLRF PORTE ; Initialize PORTE by ; clearing output ; data latches CLRF LATE ; Alternate method ; to clear output ; data latches MOVLW 0Ah ; Configure A/D MOVWF ADCON1 ; for digital inputs MOVLW 03h ; Value used to ; initialize data ; direction MOVWF TRISE ; Set RE<0> as inputs ; RE<1> as outputs ; RE<2> as inputs PIC18F2420/2520/4420/4520 DS39631B-page 118 Preliminary © 2007 Microchip Technology Inc. REGISTER 10-1: TRISE REGISTER (40/44-PIN DEVICES ONLY) R-0 R-0 R/W-0 R/W-0 U-0 R/W-1 R/W-1 R/W-1 IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 bit 7 bit 0 bit 7 IBF: Input Buffer Full Status bit 1 = A word has been received and waiting to be read by the CPU 0 = No word has been received bit 6 OBF: Output Buffer Full Status bit 1 = The output buffer still holds a previously written word 0 = The output buffer has been read bit 5 IBOV: Input Buffer Overflow Detect bit (in Microprocessor mode) 1 = A write occurred when a previously input word has not been read (must be cleared in software) 0 = No overflow occurred bit 4 PSPMODE: Parallel Slave Port Mode Select bit 1 = Parallel Slave Port mode 0 = General purpose I/O mode bit 3 Unimplemented: Read as ‘0’ bit 2 TRISE2: RE2 Direction Control bit 1 = Input 0 = Output bit 1 TRISE1: RE1 Direction Control bit 1 = Input 0 = Output bit 0 TRISE0: RE0 Direction Control bit 1 = Input 0 = Output Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 119 PIC18F2420/2520/4420/4520 TABLE 10-9: PORTE I/O SUMMARY TABLE 10-10: SUMMARY OF REGISTERS ASSOCIATED WITH PORTE Pin Function TRIS Setting I/O I/O Type Description RE0/RD/AN5 RE0 0 O DIG LATE<0> data output; not affected by analog input. 1 I ST PORTE<0> data input; disabled when analog input enabled. RD 1 I TTL PSP read enable input (PSP enabled). AN5 1 I ANA A/D input channel 5; default input configuration on POR. RE1/WR/AN6 RE1 0 O DIG LATE<1> data output; not affected by analog input. 1 I ST PORTE<1> data input; disabled when analog input enabled. WR 1 I TTL PSP write enable input (PSP enabled). AN6 1 I ANA A/D input channel 6; default input configuration on POR. RE2/CS/AN7 RE2 0 O DIG LATE<2> data output; not affected by analog input. 1 I ST PORTE<2> data input; disabled when analog input enabled. CS 1 I TTL PSP write enable input (PSP enabled). AN7 1 I ANA A/D input channel 7; default input configuration on POR. MCLR/VPP/RE3(1) MCLR — I ST External Master Clear input; enabled when MCLRE configuration bit is set. VPP — I ANA High-voltage detection; used for ICSP™ mode entry detection. Always available, regardless of pin mode. RE3 —(2) I ST PORTE<3> data input; enabled when MCLRE configuration bit is clear. Legend: DIG = Digital level output; TTL = TTL input buffer; ST = Schmitt Trigger input buffer; ANA = Analog level input/output; x = Don’t care (TRIS bit does not affect port direction or is overridden for this option). Note 1: RE3 is available on both 28-pin and 40/44-pin devices. All other PORTE pins are only implemented on 40/44-pin devices. 2: RE3 does not have a corresponding TRIS bit to control data direction. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTE — — — — RE3(1,2) RE2 RE1 RE0 52 LATE(2) — — — — — LATE Data Output Register 52 TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PORTE. Note 1: Implemented only when Master Clear functionality is disabled (MCLRE configuration bit = 0). 2: RE3 is the only PORTE bit implemented on both 28-pin and 40/44-pin devices. All other bits are implemented only when PORTE is implemented (i.e., 40/44-pin devices). PIC18F2420/2520/4420/4520 DS39631B-page 120 Preliminary © 2007 Microchip Technology Inc. 10.6 Parallel Slave Port In addition to its function as a general I/O port, PORTD can also operate as an 8-bit wide Parallel Slave Port (PSP) or microprocessor port. PSP operation is controlled by the 4 upper bits of the TRISE register (Register 10-1). Setting control bit, PSPMODE (TRISE<4>), enables PSP operation as long as the enhanced CCP module is not operating in dual output or quad output PWM mode. In Slave mode, the port is asynchronously readable and writable by the external world. The PSP can directly interface to an 8-bit microprocessor data bus. The external microprocessor can read or write the PORTD latch as an 8-bit latch. Setting the control bit, PSPMODE, enables the PORTE I/O pins to become control inputs for the microprocessor port. When set, port pin RE0 is the RD input, RE1 is the WR input and RE2 is the CS (Chip Select) input. For this functionality, the corresponding data direction bits of the TRISE register (TRISE<2:0>) must be configured as inputs (set). The A/D port configuration bits, PFCG3:PFCG0 (ADCON1<3:0>), must also be set to a value in the range of ‘1010’ through ‘1111’. A write to the PSP occurs when both the CS and WR lines are first detected low and ends when either are detected high. The PSPIF and IBF flag bits are both set when the write ends. A read from the PSP occurs when both the CS and RD lines are first detected low. The data in PORTD is read out and the OBF bit is clear. If the user writes new data to PORTD to set OBF, the data is immediately read out; however, the OBF bit is not set. When either the CS or RD lines are detected high, the PORTD pins return to the input state and the PSPIF bit is set. User applications should wait for PSPIF to be set before servicing the PSP; when this happens, the IBF and OBF bits can be polled and the appropriate action taken. The timing for the control signals in Write and Read modes is shown in Figure 10-3 and Figure 10-4, respectively. FIGURE 10-2: PORTD AND PORTE BLOCK DIAGRAM (PARALLEL SLAVE PORT) Note: The Parallel Slave Port is only available on 40/44-pin devices. Data Bus WR LATD RDx pin D Q CK EN Q D RD PORTD EN One bit of PORTD Set Interrupt Flag PSPIF (PIR1<7>) Read Chip Select Write RD CS WR TTL TTL TTL TTL or WR PORTD RD LATD Data Latch Note: I/O pins have diode protection to VDD and VSS. PORTE Pins © 2007 Microchip Technology Inc. Preliminary DS39631B-page 121 PIC18F2420/2520/4420/4520 FIGURE 10-3: PARALLEL SLAVE PORT WRITE WAVEFORMS FIGURE 10-4: PARALLEL SLAVE PORT READ WAVEFORMS TABLE 10-11: REGISTERS ASSOCIATED WITH PARALLEL SLAVE PORT Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page PORTD RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 52 LATD PORTD Data Latch Register (Read and Write to Data Latch) 52 TRISD PORTD Data Direction Control Register 52 PORTE — — — — RE3 RE2 RE1 RE0 52 LATE — — — — — LATE Data Output bits 52 TRISE IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 INTCON GIE/GIEH PEIE/GIEL TMR0IF INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Parallel Slave Port. Q1 Q2 Q3 Q4 CS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 WR RD IBF OBF PSPIF PORTD<7:0> Q1 Q2 Q3 Q4 CS Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 WR IBF PSPIF RD OBF PORTD<7:0> PIC18F2420/2520/4420/4520 DS39631B-page 122 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 123 PIC18F2420/2520/4420/4520 11.0 TIMER0 MODULE The Timer0 module incorporates the following features: • Software selectable operation as a timer or counter in both 8-bit or 16-bit modes • Readable and writable registers • Dedicated 8-bit, software programmable prescaler • Selectable clock source (internal or external) • Edge select for external clock • Interrupt-on-overflow The T0CON register (Register 11-1) controls all aspects of the module’s operation, including the prescale selection. It is both readable and writable. A simplified block diagram of the Timer0 module in 8-bit mode is shown in Figure 11-1. Figure 11-2 shows a simplified block diagram of the Timer0 module in 16-bit mode. REGISTER 11-1: T0CON: TIMER0 CONTROL REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 bit 7 bit 0 bit 7 TMR0ON: Timer0 On/Off Control bit 1 = Enables Timer0 0 = Stops Timer0 bit 6 T08BIT: Timer0 8-bit/16-bit Control bit 1 = Timer0 is configured as an 8-bit timer/counter 0 = Timer0 is configured as a 16-bit timer/counter bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (CLKO) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Timer0 Prescaler Assignment bit 1 = TImer0 prescaler is NOT assigned. Timer0 clock input bypasses prescaler. 0 = Timer0 prescaler is assigned. Timer0 clock input comes from prescaler output. bit 2-0 T0PS2:T0PS0: Timer0 Prescaler Select bits 111 = 1:256 prescale value 110 = 1:128 prescale value 101 = 1:64 prescale value 100 = 1:32 prescale value 011 = 1:16 prescale value 010 = 1:8 prescale value 001 = 1:4 prescale value 000 = 1:2 prescale value Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 124 Preliminary © 2007 Microchip Technology Inc. 11.1 Timer0 Operation Timer0 can operate as either a timer or a counter; the mode is selected with the T0CS bit (T0CON<5>). In Timer mode (T0CS = 0), the module increments on every clock by default unless a different prescaler value is selected (see Section 11.3 “Prescaler”). If the TMR0 register is written to, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. The Counter mode is selected by setting the T0CS bit (= 1). In this mode, Timer0 increments either on every rising or falling edge of pin RA4/T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit, T0SE (T0CON<4>); clearing this bit selects the rising edge. Restrictions on the external clock input are discussed below. An external clock source can be used to drive Timer0; however, it must meet certain requirements to ensure that the external clock can be synchronized with the internal phase clock (TOSC). There is a delay between synchronization and the onset of incrementing the timer/counter. 11.2 Timer0 Reads and Writes in 16-Bit Mode TMR0H is not the actual high byte of Timer0 in 16-bit mode; it is actually a buffered version of the real high byte of Timer0 which is not directly readable nor writable (refer to Figure 11-2). TMR0H is updated with the contents of the high byte of Timer0 during a read of TMR0L. This provides the ability to read all 16 bits of Timer0 without having to verify that the read of the high and low byte were valid, due to a rollover between successive reads of the high and low byte. Similarly, a write to the high byte of Timer0 must also take place through the TMR0H Buffer register. The high byte is updated with the contents of TMR0H when a write occurs to TMR0L. This allows all 16 bits of Timer0 to be updated at once. FIGURE 11-1: TIMER0 BLOCK DIAGRAM (8-BIT MODE) FIGURE 11-2: TIMER0 BLOCK DIAGRAM (16-BIT MODE) Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale. T0CKI pin T0SE 0 1 0 1 T0CS FOSC/4 Programmable Prescaler Sync with Internal Clocks TMR0L (2 TCY Delay) PSA Internal Data Bus T0PS2:T0PS0 Set TMR0IF on Overflow 3 8 8 Note: Upon Reset, Timer0 is enabled in 8-bit mode with clock input from T0CKI max. prescale. T0CKI pin T0SE 0 1 0 1 T0CS FOSC/4 Programmable Prescaler Sync with Internal Clocks TMR0L (2 TCY Delay) Internal Data Bus 8 PSA T0PS2:T0PS0 Set TMR0IF on Overflow 3 TMR0 TMR0H High Byte 8 8 8 Read TMR0L Write TMR0L 8 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 125 PIC18F2420/2520/4420/4520 11.3 Prescaler An 8-bit counter is available as a prescaler for the Timer0 module. The prescaler is not directly readable or writable; its value is set by the PSA and T0PS2:T0PS0 bits (T0CON<3:0>) which determine the prescaler assignment and prescale ratio. Clearing the PSA bit assigns the prescaler to the Timer0 module. When it is assigned, prescale values from 1:2 through 1:256 in power-of-2 increments are selectable. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF TMR0, MOVWF TMR0, BSF TMR0, etc.) clear the prescaler count. 11.3.1 SWITCHING PRESCALER ASSIGNMENT The prescaler assignment is fully under software control and can be changed “on-the-fly” during program execution. 11.4 Timer0 Interrupt The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h in 8-bit mode, or from FFFFh to 0000h in 16-bit mode. This overflow sets the TMR0IF flag bit. The interrupt can be masked by clearing the TMR0IE bit (INTCON<5>). Before re-enabling the interrupt, the TMR0IF bit must be cleared in software by the Interrupt Service Routine. Since Timer0 is shut down in Sleep mode, the TMR0 interrupt cannot awaken the processor from Sleep. TABLE 11-1: REGISTERS ASSOCIATED WITH TIMER0 Note: Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count but will not change the prescaler assignment. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TMR0L Timer0 Register, Low Byte 50 TMR0H Timer0 Register, High Byte 50 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 T0CON TMR0ON T08BIT T0CS T0SE PSA T0PS2 T0PS1 T0PS0 50 TRISA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 Legend: Shaded cells are not used by Timer0. Note 1: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 126 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 127 PIC18F2420/2520/4420/4520 12.0 TIMER1 MODULE The Timer1 timer/counter module incorporates these features: • Software selectable operation as a 16-bit timer or counter • Readable and writable 8-bit registers (TMR1H and TMR1L) • Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options • Interrupt-on-overflow • Reset on CCP Special Event Trigger • Device clock status flag (T1RUN) A simplified block diagram of the Timer1 module is shown in Figure 12-1. A block diagram of the module’s operation in Read/Write mode is shown in Figure 12-2. The module incorporates its own low-power oscillator to provide an additional clocking option. The Timer1 oscillator can also be used as a low-power clock source for the microcontroller in power managed operation. Timer1 can also be used to provide Real-Time Clock (RTC) functionality to applications with only a minimal addition of external components and code overhead. Timer1 is controlled through the T1CON Control register (Register 12-1). It also contains the Timer1 Oscillator Enable bit (T1OSCEN). Timer1 can be enabled or disabled by setting or clearing control bit, TMR1ON (T1CON<0>). REGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 bit 7 RD16: 16-bit Read/Write Mode Enable bit 1 = Enables register read/write of TImer1 in one 16-bit operation 0 = Enables register read/write of Timer1 in two 8-bit operations bit 6 T1RUN: Timer1 System Clock Status bit 1 = Device clock is derived from Timer1 oscillator 0 = Device clock is derived from another source bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3 T1OSCEN: Timer1 Oscillator Enable bit 1 = Timer1 oscillator is enabled 0 = Timer1 oscillator is shut off The oscillator inverter and feedback resistor are turned off to eliminate power drain. bit 2 T1SYNC: Timer1 External Clock Input Synchronization Select bit When TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0. bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from pin RC0/T1OSO/T13CKI (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 128 Preliminary © 2007 Microchip Technology Inc. 12.1 Timer1 Operation Timer1 can operate in one of these modes: • Timer • Synchronous Counter • Asynchronous Counter The operating mode is determined by the clock select bit, TMR1CS (T1CON<1>). When TMR3CS is cleared (= 0), Timer1 increments on every internal instruction cycle (Fosc/4). When the bit is set, Timer1 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. When Timer1 is enabled, the RC1/T1OSI and RC0/ T1OSO/T13CKI pins become inputs. This means the values of TRISC<1:0> are ignored and the pins are read as ‘0’. FIGURE 12-1: TIMER1 BLOCK DIAGRAM FIGURE 12-2: TIMER1 BLOCK DIAGRAM (16-BIT READ/WRITE MODE) T1SYNC TMR1CS T1CKPS1:T1CKPS0 Sleep Input T1OSCEN(1) FOSC/4 Internal Clock On/Off Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T1OSO/T13CKI T1OSI 1 0 TMR1ON TMR1L Set TMR1IF on Overflow TMR1 Clear TMR1 High Byte (CCP Special Event Trigger) Timer1 Oscillator Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. On/Off Timer1 Timer1 Clock Input T1SYNC TMR1CS T1CKPS1:T1CKPS0 Sleep Input T1OSCEN(1) FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T1OSO/T13CKI T1OSI Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. 1 0 TMR1L Internal Data Bus 8 Set TMR1IF on Overflow TMR1 TMR1H High Byte 8 8 8 Read TMR1L Write TMR1L 8 TMR1ON Clear TMR1 (CCP Special Event Trigger) Timer1 Oscillator On/Off Timer1 Timer1 Clock Input © 2007 Microchip Technology Inc. Preliminary DS39631B-page 129 PIC18F2420/2520/4420/4520 12.2 Timer1 16-Bit Read/Write Mode Timer1 can be configured for 16-bit reads and writes (see Figure 12-2). When the RD16 control bit (T1CON<7>) is set, the address for TMR1H is mapped to a buffer register for the high byte of Timer1. A read from TMR1L will load the contents of the high byte of Timer1 into the Timer1 high byte buffer. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. A write to the high byte of Timer1 must also take place through the TMR1H Buffer register. The Timer1 high byte is updated with the contents of TMR1H when a write occurs to TMR1L. This allows a user to write all 16 bits to both the high and low bytes of Timer1 at once. The high byte of Timer1 is not directly readable or writable in this mode. All reads and writes must take place through the Timer1 High Byte Buffer register. Writes to TMR1H do not clear the Timer1 prescaler. The prescaler is only cleared on writes to TMR1L. 12.3 Timer1 Oscillator An on-chip crystal oscillator circuit is incorporated between pins T1OSI (input) and T1OSO (amplifier output). It is enabled by setting the Timer1 Oscillator Enable bit, T1OSCEN (T1CON<3>). The oscillator is a lowpower circuit rated for 32 kHz crystals. It will continue to run during all power managed modes. The circuit for a typical LP oscillator is shown in Figure 12-3. Table 12-1 shows the capacitor selection for the Timer1 oscillator. The user must provide a software time delay to ensure proper start-up of the Timer1 oscillator. FIGURE 12-3: EXTERNAL COMPONENTS FOR THE TIMER1 LP OSCILLATOR TABLE 12-1: CAPACITOR SELECTION FOR THE TIMER OSCILLATOR 12.3.1 USING TIMER1 AS A CLOCK SOURCE The Timer1 oscillator is also available as a clock source in power managed modes. By setting the clock select bits, SCS1:SCS0 (OSCCON<1:0>), to ‘01’, the device switches to SEC_RUN mode; both the CPU and peripherals are clocked from the Timer1 oscillator. If the IDLEN bit (OSCCON<7>) is cleared and a SLEEP instruction is executed, the device enters SEC_IDLE mode. Additional details are available in Section 3.0 “Power Managed Modes”. Whenever the Timer1 oscillator is providing the clock source, the Timer1 system clock status flag, T1RUN (T1CON<6>), is set. This can be used to determine the controller’s current clocking mode. It can also indicate the clock source being currently used by the Fail-Safe Clock Monitor. If the Clock Monitor is enabled and the Timer1 oscillator fails while providing the clock, polling the T1RUN bit will indicate whether the clock is being provided by the Timer1 oscillator or another source. 12.3.2 LOW-POWER TIMER1 OPTION The Timer1 oscillator can operate at two distinct levels of power consumption based on device configuration. When the LPT1OSC configuration bit is set, the Timer1 oscillator operates in a low-power mode. When LPT1OSC is not set, Timer1 operates at a higher power level. Power consumption for a particular mode is relatively constant, regardless of the device’s operating mode. The default Timer1 configuration is the higher power mode. As the low-power Timer1 mode tends to be more sensitive to interference, high noise environments may cause some oscillator instability. The low-power option is, therefore, best suited for low noise applications where power conservation is an important design consideration. Note: See the Notes with Table 12-1 for additional information about capacitor selection. C1 C2 XTAL PIC18FXXXX T1OSI T1OSO 32.768 kHz 27 pF 27 pF Osc Type Freq C1 C2 LP 32 kHz 27 pF(1) 27 pF(1) Note 1: Microchip suggests these values as a starting point in validating the oscillator circuit. 2: Higher capacitance increases the stability of the oscillator but also increases the start-up time. 3: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. 4: Capacitor values are for design guidance only. PIC18F2420/2520/4420/4520 DS39631B-page 130 Preliminary © 2007 Microchip Technology Inc. 12.3.3 TIMER1 OSCILLATOR LAYOUT CONSIDERATIONS The Timer1 oscillator circuit draws very little power during operation. Due to the low-power nature of the oscillator, it may also be sensitive to rapidly changing signals in close proximity. The oscillator circuit, shown in Figure 12-3, should be located as close as possible to the microcontroller. There should be no circuits passing within the oscillator circuit boundaries other than VSS or VDD. If a high-speed circuit must be located near the oscillator (such as the CCP1 pin in Output Compare or PWM mode, or the primary oscillator using the OSC2 pin), a grounded guard ring around the oscillator circuit, as shown in Figure 12-4, may be helpful when used on a single-sided PCB or in addition to a ground plane. FIGURE 12-4: OSCILLATOR CIRCUIT WITH GROUNDED GUARD RING 12.4 Timer1 Interrupt The TMR1 register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The Timer1 interrupt, if enabled, is generated on overflow, which is latched in interrupt flag bit, TMR1IF (PIR1<0>). This interrupt can be enabled or disabled by setting or clearing the Timer1 Interrupt Enable bit, TMR1IE (PIE1<0>). 12.5 Resetting Timer1 Using the CCP Special Event Trigger If either of the CCP modules is configured to use Timer1 and generate a Special Event Trigger in Compare mode (CCP1M3:CCP1M0 or CCP2M3:CCP2M0 = 1011), this signal will reset Timer1. The trigger from CCP2 will also start an A/D conversion if the A/D module is enabled (see Section 15.3.4 “Special Event Trigger” for more information). The module must be configured as either a timer or a synchronous counter to take advantage of this feature. When used this way, the CCPRH:CCPRL register pair effectively becomes a period register for Timer1. If Timer1 is running in Asynchronous Counter mode, this Reset operation may not work. In the event that a write to Timer1 coincides with a special Event Trigger, the write operation will take precedence. 12.6 Using Timer1 as a Real-Time Clock Adding an external LP oscillator to Timer1 (such as the one described in Section 12.3 “Timer1 Oscillator” above) gives users the option to include RTC functionality to their applications. This is accomplished with an inexpensive watch crystal to provide an accurate time base and several lines of application code to calculate the time. When operating in Sleep mode and using a battery or supercapacitor as a power source, it can completely eliminate the need for a separate RTC device and battery backup. The application code routine, RTCisr, shown in Example 12-1, demonstrates a simple method to increment a counter at one-second intervals using an Interrupt Service Routine. Incrementing the TMR1 register pair to overflow triggers the interrupt and calls the routine, which increments the seconds counter by one; additional counters for minutes and hours are incremented as the previous counter overflow. Since the register pair is 16 bits wide, counting up to overflow the register directly from a 32.768 kHz clock would take 2 seconds. To force the overflow at the required one-second intervals, it is necessary to preload it; the simplest method is to set the MSb of TMR1H with a BSF instruction. Note that the TMR1L register is never preloaded or altered; doing so may introduce cumulative error over many cycles. For this method to be accurate, Timer1 must operate in Asynchronous mode and the Timer1 overflow interrupt must be enabled (PIE1<0> = 1), as shown in the routine, RTCinit. The Timer1 oscillator must also be enabled and running at all times. VDD OSC1 VSS OSC2 RC0 RC1 RC2 Note: Not drawn to scale. Note: The Special Event Triggers from the CCP2 module will not set the TMR1IF interrupt flag bit (PIR1<0>). © 2007 Microchip Technology Inc. Preliminary DS39631B-page 131 PIC18F2420/2520/4420/4520 EXAMPLE 12-1: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE TABLE 12-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER RTCinit MOVLW 80h ; Preload TMR1 register pair MOVWF TMR1H ; for 1 second overflow CLRF TMR1L MOVLW b’00001111’ ; Configure for external clock, MOVWF T1CON ; Asynchronous operation, external oscillator CLRF secs ; Initialize timekeeping registers CLRF mins ; MOVLW .12 MOVWF hours BSF PIE1, TMR1IE ; Enable Timer1 interrupt RETURN RTCisr BSF TMR1H, 7 ; Preload for 1 sec overflow BCF PIR1, TMR1IF ; Clear interrupt flag INCF secs, F ; Increment seconds MOVLW .59 ; 60 seconds elapsed? CPFSGT secs RETURN ; No, done CLRF secs ; Clear seconds INCF mins, F ; Increment minutes MOVLW .59 ; 60 minutes elapsed? CPFSGT mins RETURN ; No, done CLRF mins ; clear minutes INCF hours, F ; Increment hours MOVLW .23 ; 24 hours elapsed? CPFSGT hours RETURN ; No, done CLRF hours ; Reset hours RETURN ; Done Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TMR1L Timer1 Register, Low Byte 50 TMR1H Timer1 Register, High Byte 50 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 Legend: Shaded cells are not used by the Timer1 module. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. PIC18F2420/2520/4420/4520 DS39631B-page 132 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 133 PIC18F2420/2520/4420/4520 13.0 TIMER2 MODULE The Timer2 module timer incorporates the following features: • 8-bit timer and period registers (TMR2 and PR2, respectively) • Readable and writable (both registers) • Software programmable prescaler (1:1, 1:4 and 1:16) • Software programmable postscaler (1:1 through 1:16) • Interrupt on TMR2-to-PR2 match • Optional use as the shift clock for the MSSP module The module is controlled through the T2CON register (Register 13-1), which enables or disables the timer and configures the prescaler and postscaler. Timer2 can be shut off by clearing control bit, TMR2ON (T2CON<2>), to minimize power consumption. A simplified block diagram of the module is shown in Figure 13-1. 13.1 Timer2 Operation In normal operation, TMR2 is incremented from 00h on each clock (FOSC/4). A 4-bit counter/prescaler on the clock input gives direct input, divide-by-4 and divide-by- 16 prescale options; these are selected by the prescaler control bits, T2CKPS1:T2CKPS0 (T2CON<1:0>). The value of TMR2 is compared to that of the period register, PR2, on each clock cycle. When the two values match, the comparator generates a match signal as the timer output. This signal also resets the value of TMR2 to 00h on the next cycle and drives the output counter/ postscaler (see Section 13.2 “Timer2 Interrupt”). The TMR2 and PR2 registers are both directly readable and writable. The TMR2 register is cleared on any device Reset, while the PR2 register initializes at FFh. Both the prescaler and postscaler counters are cleared on the following events: • a write to the TMR2 register • a write to the T2CON register • any device Reset (Power-on Reset, MCLR Reset, Watchdog Timer Reset or Brown-out Reset) TMR2 is not cleared when T2CON is written. REGISTER 13-1: T2CON: TIMER2 CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6-3 T2OUTPS3:T2OUTPS0: Timer2 Output Postscale Select bits 0000 = 1:1 Postscale 0001 = 1:2 Postscale • • • 1111 = 1:16 Postscale bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 134 Preliminary © 2007 Microchip Technology Inc. 13.2 Timer2 Interrupt Timer2 also can generate an optional device interrupt. The Timer2 output signal (TMR2-to-PR2 match) provides the input for the 4-bit output counter/postscaler. This counter generates the TMR2 match interrupt flag which is latched in TMR2IF (PIR1<1>). The interrupt is enabled by setting the TMR2 Match Interrupt Enable bit, TMR2IE (PIE1<1>). A range of 16 postscale options (from 1:1 through 1:16 inclusive) can be selected with the postscaler control bits, T2OUTPS3:T2OUTPS0 (T2CON<6:3>). 13.3 Timer2 Output The unscaled output of TMR2 is available primarily to the CCP modules, where it is used as a time base for operations in PWM mode. Timer2 can be optionally used as the shift clock source for the MSSP module operating in SPI mode. Additional information is provided in Section 17.0 “Master Synchronous Serial Port (MSSP) Module”. FIGURE 13-1: TIMER2 BLOCK DIAGRAM TABLE 13-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TMR2 Timer2 Register 50 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50 PR2 Timer2 Period Register 50 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. Comparator TMR2 Output TMR2 Postscaler Prescaler PR2 2 FOSC/4 1:1 to 1:16 1:1, 1:4, 1:16 4 T2OUTPS3:T2OUTPS0 T2CKPS1:T2CKPS0 Set TMR2IF Internal Data Bus 8 Reset TMR2/PR2 8 8 (to PWM or MSSP) Match © 2007 Microchip Technology Inc. Preliminary DS39631B-page 135 PIC18F2420/2520/4420/4520 14.0 TIMER3 MODULE The Timer3 module timer/counter incorporates these features: • Software selectable operation as a 16-bit timer or counter • Readable and writable 8-bit registers (TMR3H and TMR3L) • Selectable clock source (internal or external) with device clock or Timer1 oscillator internal options • Interrupt-on-overflow • Module Reset on CCP Special Event Trigger A simplified block diagram of the Timer3 module is shown in Figure 14-1. A block diagram of the module’s operation in Read/Write mode is shown in Figure 14-2. The Timer3 module is controlled through the T3CON register (Register 14-1). It also selects the clock source options for the CCP modules (see Section 15.1.1 “CCP Modules and Timer Resources” for more information). REGISTER 14-1: T3CON: TIMER3 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON bit 7 bit 0 bit 7 RD16: 16-bit Read/Write Mode Enable bit 1 = Enables register read/write of Timer3 in one 16-bit operation 0 = Enables register read/write of Timer3 in two 8-bit operations bit 6,3 T3CCP2:T3CCP1: Timer3 and Timer1 to CCPx Enable bits 1x = Timer3 is the capture/compare clock source for the CCP modules 01 = Timer3 is the capture/compare clock source for CCP2; Timer1 is the capture/compare clock source for CCP1 00 = Timer1 is the capture/compare clock source for the CCP modules bit 5-4 T3CKPS1:T3CKPS0: Timer3 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 2 T3SYNC: Timer3 External Clock Input Synchronization Control bit (Not usable if the device clock comes from Timer1/Timer3.) When TMR3CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input When TMR3CS = 0: This bit is ignored. Timer3 uses the internal clock when TMR3CS = 0. bit 1 TMR3CS: Timer3 Clock Source Select bit 1 = External clock input from Timer1 oscillator or T13CKI (on the rising edge after the first falling edge) 0 = Internal clock (FOSC/4) bit 0 TMR3ON: Timer3 On bit 1 = Enables Timer3 0 = Stops Timer3 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 136 Preliminary © 2007 Microchip Technology Inc. 14.1 Timer3 Operation Timer3 can operate in one of three modes: • Timer • Synchronous Counter • Asynchronous Counter The operating mode is determined by the clock select bit, TMR3CS (T3CON<1>). When TMR3CS is cleared (= 0), Timer3 increments on every internal instruction cycle (FOSC/4). When the bit is set, Timer3 increments on every rising edge of the Timer1 external clock input or the Timer1 oscillator, if enabled. As with Timer1, the RC1/T1OSI and RC0/T1OSO/ T13CKI pins become inputs when the Timer1 oscillator is enabled. This means the values of TRISC<1:0> are ignored and the pins are read as ‘0’. FIGURE 14-1: TIMER3 BLOCK DIAGRAM FIGURE 14-2: TIMER3 BLOCK DIAGRAM (16-BIT READ/WRITE MODE) T3SYNC TMR3CS T3CKPS1:T3CKPS0 Sleep Input T1OSCEN(1) FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T1OSO/T13CKI T1OSI 1 0 TMR3ON TMR3L Set TMR3IF on Overflow TMR3 High Byte Timer1 Oscillator Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. On/Off Timer3 CCP1/CCP2 Special Event Trigger CCP1/CCP2 Select from T3CON<6,3> Clear TMR3 Timer1 Clock Input T3SYNC TMR3CS T3CKPS1:T3CKPS0 Sleep Input T1OSCEN(1) FOSC/4 Internal Clock Prescaler 1, 2, 4, 8 Synchronize Detect 1 0 2 T13CKI/T1OSO T1OSI Note 1: When enable bit, T1OSCEN, is cleared, the inverter and feedback resistor are turned off to eliminate power drain. 1 0 TMR3L Internal Data Bus 8 Set TMR3IF on Overflow TMR3 TMR3H High Byte 8 8 8 Read TMR1L Write TMR1L 8 TMR3ON CCP1/CCP2 Special Event Trigger Timer1 Oscillator On/Off Timer3 Timer1 Clock Input CCP1/CCP2 Select from T3CON<6,3> Clear TMR3 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 137 PIC18F2420/2520/4420/4520 14.2 Timer3 16-Bit Read/Write Mode Timer3 can be configured for 16-bit reads and writes (see Figure 14-2). When the RD16 control bit (T3CON<7>) is set, the address for TMR3H is mapped to a buffer register for the high byte of Timer3. A read from TMR3L will load the contents of the high byte of Timer3 into the Timer3 High Byte Buffer register. This provides the user with the ability to accurately read all 16 bits of Timer1 without having to determine whether a read of the high byte, followed by a read of the low byte, has become invalid due to a rollover between reads. A write to the high byte of Timer3 must also take place through the TMR3H Buffer register. The Timer3 high byte is updated with the contents of TMR3H when a write occurs to TMR3L. This allows a user to write all 16 bits to both the high and low bytes of Timer3 at once. The high byte of Timer3 is not directly readable or writable in this mode. All reads and writes must take place through the Timer3 High Byte Buffer register. Writes to TMR3H do not clear the Timer3 prescaler. The prescaler is only cleared on writes to TMR3L. 14.3 Using the Timer1 Oscillator as the Timer3 Clock Source The Timer1 internal oscillator may be used as the clock source for Timer3. The Timer1 oscillator is enabled by setting the T1OSCEN (T1CON<3>) bit. To use it as the Timer3 clock source, the TMR3CS bit must also be set. As previously noted, this also configures Timer3 to increment on every rising edge of the oscillator source. The Timer1 oscillator is described in Section 12.0 “Timer1 Module”. 14.4 Timer3 Interrupt The TMR3 register pair (TMR3H:TMR3L) increments from 0000h to FFFFh and overflows to 0000h. The Timer3 interrupt, if enabled, is generated on overflow and is latched in interrupt flag bit, TMR3IF (PIR2<1>). This interrupt can be enabled or disabled by setting or clearing the Timer3 Interrupt Enable bit, TMR3IE (PIE2<1>). 14.5 Resetting Timer3 Using the CCP Special Event Trigger If either of the CCP modules is configured to use Timer3 and to generate a Special Event Trigger in Compare mode (CCP1M3:CCP1M0 or CCP2M3:CCP2M0 = 1011), this signal will reset Timer3. It will also start an A/D conversion if the A/D module is enabled (see Section 15.3.4 “Special Event Trigger” for more information). The module must be configured as either a timer or synchronous counter to take advantage of this feature. When used this way, the CCPR2H:CCPR2L register pair effectively becomes a period register for Timer3. If Timer3 is running in Asynchronous Counter mode, the Reset operation may not work. In the event that a write to Timer3 coincides with a Special Event Trigger from a CCP module, the write will take precedence. TABLE 14-1: REGISTERS ASSOCIATED WITH TIMER3 AS A TIMER/COUNTER Note: The Special Event Triggers from the CCP2 module will not set the TMR3IF interrupt flag bit (PIR1<0>). Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 TMR3L Timer3 Register, Low Byte 51 TMR3H Timer3 Register, High Byte 51 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer3 module. PIC18F2420/2520/4420/4520 DS39631B-page 138 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 139 PIC18F2420/2520/4420/4520 15.0 CAPTURE/COMPARE/PWM (CCP) MODULES PIC18F2420/2520/4420/4520 devices all have two CCP (Capture/Compare/PWM) modules. Each module contains a 16-bit register which can operate as a 16-bit Capture register, a 16-bit Compare register or a PWM Master/Slave Duty Cycle register. In 28-pin devices, the two standard CCP modules (CCP1 and CCP2) operate as described in this chapter. In 40/ 44-pin devices, CCP1 is implemented as an enhanced CCP module with standard Capture and Compare modes and enhanced PWM modes. The ECCP implementation is discussed in Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”. The Capture and Compare operations described in this chapter apply to all standard and enhanced CCP modules. REGISTER 15-1: CCPXCON REGISTER (CCP2 MODULE, CCP1 MODULE IN 28-PIN DEVICES) Note: Throughout this section and Section 16.0 “Enhanced Capture/Compare/PWM (ECCP) Module”, references to the register and bit names for CCP modules are referred to generically by the use of ‘x’ or ‘y’ in place of the specific module number. Thus, “CCPxCON” might refer to the control register for CCP1, CCP2 or ECCP1. “CCPxCON” is used throughout these sections to refer to the module control register, regardless of whether the CCP module is a standard or enhanced implementation. U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — DCxB1 DCxB0 CCPxM3 CCPxM2 CCPxM1 CCPxM0 bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DCxB1:DCxB0: PWM Duty Cycle bit 1 and bit 0 for CCP Module x Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs (bit 1 and bit 0) of the 10-bit PWM duty cycle. The eight MSbs (DCx9:DCx2) of the duty cycle are found in CCPRxL. bit 3-0 CCPxM3:CCPxM0: CCP Module x Mode Select bits 0000 = Capture/Compare/PWM disabled (resets CCP module) 0001 = Reserved 0010 = Compare mode, toggle output on match (CCPxIF bit is set) 0011 = Reserved 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode: initialize CCP pin low; on compare match, force CCP pin high (CCPIF bit is set) 1001 = Compare mode: initialize CCP pin high; on compare match, force CCP pin low (CCPIF bit is set) 1010 = Compare mode: generate software interrupt on compare match (CCPxIF bit is set, CCP pin reflects I/O state) 1011 = Compare mode: trigger special event, reset timer, start A/D conversion on CCP2 match (CCPxIF bit is set) 11xx = PWM mode Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 140 Preliminary © 2007 Microchip Technology Inc. 15.1 CCP Module Configuration Each Capture/Compare/PWM module is associated with a control register (generically, CCPxCON) and a data register (CCPRx). The data register, in turn, is comprised of two 8-bit registers: CCPRxL (low byte) and CCPRxH (high byte). All registers are both readable and writable. 15.1.1 CCP MODULES AND TIMER RESOURCES The CCP modules utilize Timers 1, 2 or 3, depending on the mode selected. Timer1 and Timer3 are available to modules in Capture or Compare modes, while Timer2 is available for modules in PWM mode. TABLE 15-1: CCP MODE – TIMER RESOURCE The assignment of a particular timer to a module is determined by the Timer-to-CCP enable bits in the T3CON register (Register 14-1). Both modules may be active at any given time and may share the same timer resource if they are configured to operate in the same mode (Capture/Compare or PWM) at the same time. The interactions between the two modules are summarized in Figure 15-1 and Figure 15-2. In Timer1 in Asynchronous Counter mode, the capture operation will not work. 15.1.2 CCP2 PIN ASSIGNMENT The pin assignment for CCP2 (Capture input, Compare and PWM output) can change, based on device configuration. The CCP2MX configuration bit determines which pin CCP2 is multiplexed to. By default, it is assigned to RC1 (CCP2MX = 1). If the configuration bit is cleared, CCP2 is multiplexed with RB3. Changing the pin assignment of CCP2 does not automatically change any requirements for configuring the port pin. Users must always verify that the appropriate TRIS register is configured correctly for CCP2 operation, regardless of where it is located. TABLE 15-2: INTERACTIONS BETWEEN CCP1 AND CCP2 FOR TIMER RESOURCES CCP/ECCP Mode Timer Resource Capture Compare PWM Timer1 or Timer3 Timer1 or Timer3 Timer2 CCP1 Mode CCP2 Mode Interaction Capture Capture Each module can use TMR1 or TMR3 as the time base. The time base can be different for each CCP. Capture Compare CCP2 can be configured for the Special Event Trigger to reset TMR1 or TMR3 (depending upon which time base is used). Automatic A/D conversions on trigger event can also be done. Operation of CCP1 could be affected if it is using the same timer as a time base. Compare Capture CCP1 can be configured for the Special Event Trigger to reset TMR1 or TMR3 (depending upon which time base is used). Operation of CCP2 could be affected if it is using the same timer as a time base. Compare Compare Either module can be configured for the Special Event Trigger to reset the time base. Automatic A/D conversions on CCP2 trigger event can be done. Conflicts may occur if both modules are using the same time base. Capture PWM(1) None Compare PWM(1) None PWM(1) Capture None PWM(1) Compare None PWM(1) PWM Both PWMs will have the same frequency and update rate (TMR2 interrupt). Note 1: Includes standard and enhanced PWM operation. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 141 PIC18F2420/2520/4420/4520 15.2 Capture Mode In Capture mode, the CCPRxH:CCPRxL register pair captures the 16-bit value of the TMR1 or TMR3 registers when an event occurs on the corresponding CCPx pin. An event is defined as one of the following: • every falling edge • every rising edge • every 4th rising edge • every 16th rising edge The event is selected by the mode select bits, CCPxM3:CCPxM0 (CCPxCON<3:0>). When a capture is made, the interrupt request flag bit, CCPxIF, is set; it must be cleared in software. If another capture occurs before the value in register CCPRx is read, the old captured value is overwritten by the new captured value. 15.2.1 CCP PIN CONFIGURATION In Capture mode, the appropriate CCPx pin should be configured as an input by setting the corresponding TRIS direction bit. 15.2.2 TIMER1/TIMER3 MODE SELECTION The timers that are to be used with the capture feature (Timer1 and/or Timer3) must be running in Timer mode or Synchronized Counter mode. In Asynchronous Counter mode, the capture operation will not work. The timer to be used with each CCP module is selected in the T3CON register (see Section 15.1.1 “CCP Modules and Timer Resources”). 15.2.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCPxIE interrupt enable bit clear to avoid false interrupts. The interrupt flag bit, CCPxIF, should also be cleared following any such change in operating mode. 15.2.4 CCP PRESCALER There are four prescaler settings in Capture mode; they are specified as part of the operating mode selected by the mode select bits (CCPxM3:CCPxM0). Whenever the CCP module is turned off or Capture mode is disabled, the prescaler counter is cleared. This means that any Reset will clear the prescaler counter. Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared; therefore, the first capture may be from a non-zero prescaler. Example 15-1 shows the recommended method for switching between capture prescalers. This example also clears the prescaler counter and will not generate the “false” interrupt. EXAMPLE 15-1: CHANGING BETWEEN CAPTURE PRESCALERS (CCP2 SHOWN) FIGURE 15-1: CAPTURE MODE OPERATION BLOCK DIAGRAM Note: If RB3/CCP2 or RC1/CCP2 is configured as an output, a write to the port can cause a capture condition. CLRF CCP2CON ; Turn CCP module off MOVLW NEW_CAPT_PS ; Load WREG with the ; new prescaler mode ; value and CCP ON MOVWF CCP2CON ; Load CCP2CON with ; this value CCPR1H CCPR1L TMR1H TMR1L Set CCP1IF TMR3 Enable Q1:Q4 CCP1CON<3:0> CCP1 pin Prescaler ÷ 1, 4, 16 and Edge Detect TMR1 Enable T3CCP2 T3CCP2 CCPR2H CCPR2L TMR1H TMR1L Set CCP2IF TMR3 Enable CCP2CON<3:0> CCP2 pin Prescaler ÷ 1, 4, 16 TMR3H TMR3L TMR1 Enable T3CCP2 T3CCP1 T3CCP2 T3CCP1 TMR3H TMR3L and Edge Detect 4 4 4 PIC18F2420/2520/4420/4520 DS39631B-page 142 Preliminary © 2007 Microchip Technology Inc. 15.3 Compare Mode In Compare mode, the 16-bit CCPRx register value is constantly compared against either the TMR1 or TMR3 register pair value. When a match occurs, the CCPx pin can be: • driven high • driven low • toggled (high-to-low or low-to-high) • remain unchanged (that is, reflects the state of the I/O latch) The action on the pin is based on the value of the mode select bits (CCPxM3:CCPxM0). At the same time, the interrupt flag bit, CCPxIF, is set. 15.3.1 CCP PIN CONFIGURATION The user must configure the CCPx pin as an output by clearing the appropriate TRIS bit. 15.3.2 TIMER1/TIMER3 MODE SELECTION Timer1 and/or Timer3 must be running in Timer mode or Synchronized Counter mode if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work. 15.3.3 SOFTWARE INTERRUPT MODE When the Generate Software Interrupt mode is chosen (CCPxM3:CCPxM0 = 1010), the corresponding CCPx pin is not affected. Only a CCP interrupt is generated, if enabled and the CCPxIE bit is set. 15.3.4 SPECIAL EVENT TRIGGER Both CCP modules are equipped with a Special Event Trigger. This is an internal hardware signal generated in Compare mode to trigger actions by other modules. The Special Event Trigger is enabled by selecting the Compare Special Event Trigger mode (CCPxM3:CCPxM0 = 1011). For either CCP module, the Special Event Trigger resets the timer register pair for whichever timer resource is currently assigned as the module’s time base. This allows the CCPRx registers to serve as a programmable period register for either timer. The Special Event Trigger for CCP2 can also start an A/D conversion. In order to do this, the A/D converter must already be enabled. FIGURE 15-2: COMPARE MODE OPERATION BLOCK DIAGRAM Note: Clearing the CCP2CON register will force the RB3 or RC1 compare output latch (depending on device configuration) to the default low level. This is not the PORTB or PORTC I/O data latch. CCPR1H CCPR1L TMR1H TMR1L Comparator S Q R Output Logic Special Event Trigger Set CCP1IF CCP1 pin TRIS CCP1CON<3:0> Output Enable TMR3H TMR3L CCPR2H CCPR2L Comparator 1 0 T3CCP2 T3CCP1 Set CCP2IF 1 0 Compare 4 (Timer1/Timer3 Reset) S Q R Output Logic Special Event Trigger CCP2 pin TRIS CCP2CON<3:0> 4 Output Enable (Timer1/Timer3 Reset, A/D Trigger) Match Compare Match © 2007 Microchip Technology Inc. Preliminary DS39631B-page 143 PIC18F2420/2520/4420/4520 TABLE 15-3: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, TIMER1 AND TIMER3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 RCON IPEN SBOREN — RI TO PD POR BOR 48 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 TRISB PORTB Data Direction Control Register 52 TRISC PORTC Data Direction Control Register 52 TMR1L Timer1 Register, Low Byte 50 TMR1H Timer1 Register, High Byte 50 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 TMR3H Timer3 Register, High Byte 51 TMR3L Timer3 Register, Low Byte 51 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51 CCPR1L Capture/Compare/PWM Register 1, Low Byte 51 CCPR1H Capture/Compare/PWM Register 1, High Byte 51 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 CCPR2L Capture/Compare/PWM Register 2, Low Byte 51 CCPR2H Capture/Compare/PWM Register 2, High Byte 51 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Capture/Compare, Timer1 or Timer3. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. PIC18F2420/2520/4420/4520 DS39631B-page 144 Preliminary © 2007 Microchip Technology Inc. 15.4 PWM Mode In Pulse Width Modulation (PWM) mode, the CCPx pin produces up to a 10-bit resolution PWM output. Since the CCP2 pin is multiplexed with a PORTB or PORTC data latch, the appropriate TRIS bit must be cleared to make the CCP2 pin an output. Figure 15-3 shows a simplified block diagram of the CCP module in PWM mode. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 15.4.4 “Setup for PWM Operation”. FIGURE 15-3: SIMPLIFIED PWM BLOCK DIAGRAM A PWM output (Figure 15-4) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/period). FIGURE 15-4: PWM OUTPUT 15.4.1 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following formula: EQUATION 15-1: PWM frequency is defined as 1/[PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCPx pin is set (exception: if PWM duty cycle = 0%, the CCPx pin will not be set) • The PWM duty cycle is latched from CCPRxL into CCPRxH 15.4.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPRxL register and to the CCPxCON<5:4> bits. Up to 10-bit resolution is available. The CCPRxL contains the eight MSbs and the CCPxCON<5:4> contains the two LSbs. This 10-bit value is represented by CCPRxL:CCPxCON<5:4>. The following equation is used to calculate the PWM duty cycle in time: EQUATION 15-2: CCPRxL and CCPxCON<5:4> can be written to at any time, but the duty cycle value is not latched into CCPRxH until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPRxH is a read-only register. Note: Clearing the CCP2CON register will force the RB3 or RC1 output latch (depending on device configuration) to the default low level. This is not the PORTB or PORTC I/O data latch. CCPRxL CCPRxH (Slave) Comparator TMR2 Comparator PR2 (Note 1) R Q S Duty Cycle Registers CCPxCON<5:4> Clear Timer, CCP1 pin and latch D.C. Note 1: The 8-bit TMR2 value is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time base. CCPx Output Corresponding TRIS bit Period Duty Cycle TMR2 = PR2 TMR2 = Duty Cycle TMR2 = PR2 Note: The Timer2 postscalers (see Section 13.0 “Timer2 Module”) are not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. PWM Period = [(PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) PWM Duty Cycle = (CCPRXL:CCPXCON<5:4>) • TOSC • (TMR2 Prescale Value) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 145 PIC18F2420/2520/4420/4520 The CCPRxH register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitchless PWM operation. When the CCPRxH and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCPx pin is cleared. The maximum PWM resolution (bits) for a given PWM frequency is given by the equation: EQUATION 15-3: TABLE 15-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz 15.4.3 PWM AUTO-SHUTDOWN (CCP1 ONLY) The PWM auto-shutdown features of the enhanced CCP module are also available to CCP1 in 28-pin devices. The operation of this feature is discussed in detail in Section 16.4.7 “Enhanced PWM Auto-Shutdown”. Auto-shutdown features are not available for CCP2. 15.4.4 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for PWM operation: 1. Set the PWM period by writing to the PR2 register. 2. Set the PWM duty cycle by writing to the CCPRxL register and CCPxCON<5:4> bits. 3. Make the CCPx pin an output by clearing the appropriate TRIS bit. 4. Set the TMR2 prescale value, then enable Timer2 by writing to T2CON. 5. Configure the CCPx module for PWM operation. Note: If the PWM duty cycle value is longer than the PWM period, the CCP2 pin will not be cleared. FOSC FPWM ⎝---------------⎠ log⎛ ⎞ log(2) PWM Resolution (max) = -----------------------------bits PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz Timer Prescaler (1, 4, 16) 16 4 1 1 1 1 PR2 Value FFh FFh FFh 3Fh 1Fh 17h Maximum Resolution (bits) 10 10 10 8 7 6.58 PIC18F2420/2520/4420/4520 DS39631B-page 146 Preliminary © 2007 Microchip Technology Inc. TABLE 15-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 RCON IPEN SBOREN — RI TO PD POR BOR 48 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TRISB PORTB Data Direction Control Register 52 TRISC PORTC Data Direction Control Register 52 TMR2 Timer2 Register 50 PR2 Timer2 Period Register 50 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50 CCPR1L Capture/Compare/PWM Register 1, Low Byte 51 CCPR1H Capture/Compare/PWM Register 1, High Byte 51 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 CCPR2L Capture/Compare/PWM Register 2, Low Byte 51 CCPR2H Capture/Compare/PWM Register 2, High Byte 51 CCP2CON — — DC2B1 DC2B0 CCP2M3 CCP2M2 CCP2M1 CCP2M0 51 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) 51 PWM1CON PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by PWM or Timer2. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 147 PIC18F2420/2520/4420/4520 16.0 ENHANCED CAPTURE/ COMPARE/PWM (ECCP) MODULE In PIC18F4420/4520 devices, CCP1 is implemented as a standard CCP module with enhanced PWM capabilities. These include the provision for 2 or 4 output channels, user selectable polarity, dead-band control and automatic shutdown and restart. The enhanced features are discussed in detail in Section 16.4 “Enhanced PWM Mode”. Capture, Compare and single-output PWM functions of the ECCP module are the same as described for the standard CCP module. The control register for the enhanced CCP module is shown in Register 16-1. It differs from the CCPxCON registers in PIC18F2420/2520 devices in that the two Most Significant bits are implemented to control PWM functionality. REGISTER 16-1: CCP1CON REGISTER (ECCP1 MODULE, 40/44-PIN DEVICES) Note: The ECCP module is implemented only in 40/44-pin devices. R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 P1M1 P1M0 DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 bit 7 bit 0 bit 7-6 P1M1:P1M0: Enhanced PWM Output Configuration bits If CCP1M3:CCP1M2 = 00, 01, 10: xx = P1A assigned as Capture/Compare input/output; P1B, P1C, P1D assigned as port pins If CCP1M3:CCP1M2 = 11: 00 = Single output: P1A modulated; P1B, P1C, P1D assigned as port pins 01 = Full-bridge output forward: P1D modulated; P1A active; P1B, P1C inactive 10 = Half-bridge output: P1A, P1B modulated with dead-band control; P1C, P1D assigned as port pins 11 = Full-bridge output reverse: P1B modulated; P1C active; P1A, P1D inactive bit 5-4 DC1B1:DC1B0: PWM Duty Cycle bit 1 and bit 0 Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs of the 10-bit PWM duty cycle. The eight MSbs of the duty cycle are found in CCPR1L. bit 3-0 CCP1M3:CCP1M0: Enhanced CCP Mode Select bits 0000 = Capture/Compare/PWM off (resets ECCP module) 0001 = Reserved 0010 = Compare mode, toggle output on match 0011 = Capture mode 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, initialize CCP1 pin low, set output on compare match (set CCP1IF) 1001 = Compare mode, initialize CCP1 pin high, clear output on compare match (set CCP1IF) 1010 = Compare mode, generate software interrupt only, CCP1 pin reverts to I/O state 1011 = Compare mode, trigger special event (ECCP resets TMR1 or TMR3, sets CC1IF bit) 1100 = PWM mode; P1A, P1C active-high; P1B, P1D active-high 1101 = PWM mode; P1A, P1C active-high; P1B, P1D active-low 1110 = PWM mode; P1A, P1C active-low; P1B, P1D active-high 1111 = PWM mode; P1A, P1C active-low; P1B, P1D active-low Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 148 Preliminary © 2007 Microchip Technology Inc. In addition to the expanded range of modes available through the CCP1CON register and ECCP1AS register, the ECCP module has an additional register associated with Enhanced PWM operation and auto-shutdown features. It is: • PWM1CON (Dead-band delay) 16.1 ECCP Outputs and Configuration The enhanced CCP module may have up to four PWM outputs, depending on the selected operating mode. These outputs, designated P1A through P1D, are multiplexed with I/O pins on PORTC and PORTD. The outputs that are active depend on the CCP operating mode selected. The pin assignments are summarized in Table 16-1. To configure the I/O pins as PWM outputs, the proper PWM mode must be selected by setting the P1M1:P1M0 and CCP1M3:CCP1M0 bits. The appropriate TRISC and TRISD direction bits for the port pins must also be set as outputs. 16.1.1 ECCP MODULES AND TIMER RESOURCES Like the standard CCP modules, the ECCP module can utilize Timers 1, 2 or 3, depending on the mode selected. Timer1 and Timer3 are available for modules in Capture or Compare modes, while Timer2 is available for modules in PWM mode. Interactions between the standard and enhanced CCP modules are identical to those described for standard CCP modules. Additional details on timer resources are provided in Section 15.1.1 “CCP Modules and Timer Resources”. 16.2 Capture and Compare Modes Except for the operation of the Special Event Trigger discussed below, the Capture and Compare modes of the ECCP module are identical in operation to that of CCP2. These are discussed in detail in Section 15.2 “Capture Mode” and Section 15.3 “Compare Mode”. No changes are required when moving between 28-pin and 40/44-pin devices. 16.2.1 SPECIAL EVENT TRIGGER The Special Event Trigger output of ECCP1 resets the TMR1 or TMR3 register pair, depending on which timer resource is currently selected. This allows the CCPR1 register to effectively be a 16-bit programmable period register for Timer1 or Timer3. 16.3 Standard PWM Mode When configured in Single Output mode, the ECCP module functions identically to the standard CCP module in PWM mode, as described in Section 15.4 “PWM Mode”. This is also sometimes referred to as “Compatible CCP” mode, as in Table 16-1. TABLE 16-1: PIN ASSIGNMENTS FOR VARIOUS ECCP1 MODES Note: When setting up single output PWM operations, users are free to use either of the processes described in Section 15.4.4 “Setup for PWM Operation” or Section 16.4.9 “Setup for PWM Operation”. The latter is more generic and will work for either single or multi-output PWM. ECCP Mode CCP1CON Configuration RC2 RD5 RD6 RD7 All 40/44-pin devices: Compatible CCP 00xx 11xx CCP1 RD5/PSP5 RD6/PSP6 RD7/PSP7 Dual PWM 10xx 11xx P1A P1B RD6/PSP6 RD7/PSP7 Quad PWM x1xx 11xx P1A P1B P1C P1D Legend: x = Don’t care. Shaded cells indicate pin assignments not used by ECCP1 in a given mode. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 149 PIC18F2420/2520/4420/4520 16.4 Enhanced PWM Mode The Enhanced PWM mode provides additional PWM output options for a broader range of control applications. The module is a backward compatible version of the standard CCP module and offers up to four outputs, designated P1A through P1D. Users are also able to select the polarity of the signal (either active-high or active-low). The module’s output mode and polarity are configured by setting the P1M1:P1M0 and CCP1M3:CCP1M0 bits of the CCP1CON register. Figure 16-1 shows a simplified block diagram of PWM operation. All control registers are double-buffered and are loaded at the beginning of a new PWM cycle (the period boundary when Timer2 resets) in order to prevent glitches on any of the outputs. The exception is the PWM Delay register, PWM1CON, which is loaded at either the duty cycle boundary or the period boundary (whichever comes first). Because of the buffering, the module waits until the assigned timer resets, instead of starting immediately. This means that enhanced PWM waveforms do not exactly match the standard PWM waveforms, but are instead offset by one full instruction cycle (4 TOSC). As before, the user must manually configure the appropriate TRIS bits for output. 16.4.1 PWM PERIOD The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following equation. EQUATION 16-1: PWM frequency is defined as 1/[PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set (if PWM duty cycle = 0%, the CCP1 pin will not be set) • The PWM duty cycle is copied from CCPR1L into CCPR1H FIGURE 16-1: SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODULE Note: The Timer2 postscaler (see Section 13.0 “Timer2 Module”) is not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. PWM Period = [(PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) CCPR1L CCPR1H (Slave) Comparator TMR2 Comparator PR2 (Note 1) R Q S Duty Cycle Registers CCP1CON<5:4> Clear Timer, set CCP1 pin and latch D.C. Note: The 8-bit TMR2 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler, to create the 10-bit time base. TRISx CCP1/P1A TRISx P1B TRISx TRISx P1D Output Controller P1M1<1:0> 2 CCP1M<3:0> 4 PWM1CON CCP1/P1A P1B P1C P1D P1C PIC18F2420/2520/4420/4520 DS39631B-page 150 Preliminary © 2007 Microchip Technology Inc. 16.4.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPR1L register and to the CCP1CON<5:4> bits. Up to 10-bit resolution is available. The CCPR1L contains the eight MSbs and the CCP1CON<5:4> contains the two LSbs. This 10-bit value is represented by CCPR1L:CCP1CON<5:4>. The PWM duty cycle is calculated by the following equation. EQUATION 16-2: CCPR1L and CCP1CON<5:4> can be written to at any time, but the duty cycle value is not copied into CCPR1H until a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR1H is a read-only register. The CCPR1H register and a 2-bit internal latch are used to double-buffer the PWM duty cycle. This double-buffering is essential for glitchless PWM operation. When the CCPR1H and 2-bit latch match TMR2, concatenated with an internal 2-bit Q clock or two bits of the TMR2 prescaler, the CCP1 pin is cleared. The maximum PWM resolution (bits) for a given PWM frequency is given by the following equation. EQUATION 16-3: 16.4.3 PWM OUTPUT CONFIGURATIONS The P1M1:P1M0 bits in the CCP1CON register allow one of four configurations: • Single Output • Half-Bridge Output • Full-Bridge Output, Forward mode • Full-Bridge Output, Reverse mode The Single Output mode is the standard PWM mode discussed in Section 16.4 “Enhanced PWM Mode”. The Half-Bridge and Full-Bridge Output modes are covered in detail in the sections that follow. The general relationship of the outputs in all configurations is summarized in Figure 16-2. TABLE 16-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 40 MHz PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) • TOSC • (TMR2 Prescale Value) Note: If the PWM duty cycle value is longer than the PWM period, the CCP1 pin will not be cleared. ( ) PWM Resolution (max) = FOSC FPWM log log(2) bits PWM Frequency 2.44 kHz 9.77 kHz 39.06 kHz 156.25 kHz 312.50 kHz 416.67 kHz Timer Prescaler (1, 4, 16) 16 4 1 1 1 1 PR2 Value FFh FFh FFh 3Fh 1Fh 17h Maximum Resolution (bits) 10 10 10 8 7 6.58 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 151 PIC18F2420/2520/4420/4520 FIGURE 16-2: PWM OUTPUT RELATIONSHIPS (ACTIVE-HIGH STATE) FIGURE 16-3: PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE) 0 Period 00 10 01 11 SIGNAL PR2 + 1 CCP1CON <7:6> P1A Modulated P1A Modulated P1B Modulated P1A Active P1B Inactive P1C Inactive P1D Modulated P1A Inactive P1B Modulated P1C Active P1D Inactive Duty Cycle (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay(1) Delay(1) 0 Period 00 10 01 11 SIGNAL PR2 + 1 CCP1CON <7:6> P1A Modulated P1A Modulated P1B Modulated P1A Active P1B Inactive P1C Inactive P1D Modulated P1A Inactive P1B Modulated P1C Active P1D Inactive Duty Cycle (Single Output) (Half-Bridge) (Full-Bridge, Forward) (Full-Bridge, Reverse) Delay(1) Delay(1) Relationships: • Period = 4 * TOSC * (PR2 + 1) * (TMR2 Prescale Value) • Duty Cycle = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMR2 Prescale Value) • Delay = 4 * TOSC * (PWM1CON<6:0>) Note 1: Dead-band delay is programmed using the PWM1CON register (see Section 16.4.6 “Programmable Dead-Band Delay”). PIC18F2420/2520/4420/4520 DS39631B-page 152 Preliminary © 2007 Microchip Technology Inc. 16.4.4 HALF-BRIDGE MODE In the Half-Bridge Output mode, two pins are used as outputs to drive push-pull loads. The PWM output signal is output on the P1A pin, while the complementary PWM output signal is output on the P1B pin (Figure 16-4). This mode can be used for half-bridge applications, as shown in Figure 16-5, or for full-bridge applications where four power switches are being modulated with two PWM signals. In Half-Bridge Output mode, the programmable deadband delay can be used to prevent shoot-through current in half-bridge power devices. The value of bits, PDC6:PDC0, sets the number of instruction cycles before the output is driven active. If the value is greater than the duty cycle, the corresponding output remains inactive during the entire cycle. See Section 16.4.6 “Programmable Dead-Band Delay” for more details of the dead-band delay operations. Since the P1A and P1B outputs are multiplexed with the PORTC<2> and PORTD<5> data latches, the TRISC<2> and TRISD<5> bits must be cleared to configure P1A and P1B as outputs. FIGURE 16-4: HALF-BRIDGE PWM OUTPUT FIGURE 16-5: EXAMPLES OF HALF-BRIDGE OUTPUT MODE APPLICATIONS Period Duty Cycle td td (1) P1A(2) P1B(2) td = Dead-Band Delay Period (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. 2: Output signals are shown as active-high. PIC18F4X2X P1A P1B FET Driver FET Driver V+ VLoad + V- + VFET Driver FET Driver V+ VLoad FET Driver FET Driver PIC18F4X2X P1A P1B Standard Half-Bridge Circuit (“Push-Pull”) Half-Bridge Output Driving a Full-Bridge Circuit © 2007 Microchip Technology Inc. Preliminary DS39631B-page 153 PIC18F2420/2520/4420/4520 16.4.5 FULL-BRIDGE MODE In Full-Bridge Output mode, four pins are used as outputs; however, only two outputs are active at a time. In the Forward mode, pin P1A is continuously active and pin P1D is modulated. In the Reverse mode, pin P1C is continuously active and pin P1B is modulated. These are illustrated in Figure 16-6. P1A, P1B, P1C and P1D outputs are multiplexed with the PORTC<2> and PORTD<7:5> data latches. The TRISC<2> and TRISD<7:5> bits must be cleared to make the P1A, P1B, P1C and P1D pins outputs. FIGURE 16-6: FULL-BRIDGE PWM OUTPUT Period Duty Cycle P1A(2) P1B(2) P1C(2) P1D(2) Forward Mode (1) Period Duty Cycle P1A(2) P1C(2) P1D(2) P1B(2) Reverse Mode (1) (1) (1) Note 1: At this time, the TMR2 register is equal to the PR2 register. Note 2: Output signal is shown as active-high. PIC18F2420/2520/4420/4520 DS39631B-page 154 Preliminary © 2007 Microchip Technology Inc. FIGURE 16-7: EXAMPLE OF FULL-BRIDGE APPLICATION 16.4.5.1 Direction Change in Full-Bridge Mode In the Full-Bridge Output mode, the P1M1 bit in the CCP1CON register allows user to control the forward/ reverse direction. When the application firmware changes this direction control bit, the module will assume the new direction on the next PWM cycle. Just before the end of the current PWM period, the modulated outputs (P1B and P1D) are placed in their inactive state, while the unmodulated outputs (P1A and P1C) are switched to drive in the opposite direction. This occurs in a time interval of 4 TOSC * (Timer2 Prescale Value) before the next PWM period begins. The Timer2 prescaler will be either 1, 4 or 16, depending on the value of the T2CKPS1:T2CKPS0 bits (T2CON<1:0>). During the interval from the switch of the unmodulated outputs to the beginning of the next period, the modulated outputs (P1B and P1D) remain inactive. This relationship is shown in Figure 16-8. Note that in the Full-Bridge Output mode, the CCP1 module does not provide any dead-band delay. In general, since only one output is modulated at all times, dead-band delay is not required. However, there is a situation where a dead-band delay might be required. This situation occurs when both of the following conditions are true: 1. The direction of the PWM output changes when the duty cycle of the output is at or near 100%. 2. The turn-off time of the power switch, including the power device and driver circuit, is greater than the turn-on time. Figure 16-9 shows an example where the PWM direction changes from forward to reverse at a near 100% duty cycle. At time t1, the outputs P1A and P1D become inactive, while output P1C becomes active. In this example, since the turn-off time of the power devices is longer than the turn-on time, a shoot-through current may flow through power devices, QC and QD (see Figure 16-7), for the duration of ‘t’. The same phenomenon will occur to power devices, QA and QB, for PWM direction change from reverse to forward. If changing PWM direction at high duty cycle is required for an application, one of the following requirements must be met: 1. Reduce PWM for a PWM period before changing directions. 2. Use switch drivers that can drive the switches off faster than they can drive them on. Other options to prevent shoot-through current may exist. P1A P1C FET Driver FET Driver V+ VLoad FET Driver FET Driver P1B P1D QA QB QD PIC18F4X2X QC © 2007 Microchip Technology Inc. Preliminary DS39631B-page 155 PIC18F2420/2520/4420/4520 FIGURE 16-8: PWM DIRECTION CHANGE FIGURE 16-9: PWM DIRECTION CHANGE AT NEAR 100% DUTY CYCLE DC Period(1) SIGNAL Note 1: The direction bit in the CCP1 Control register (CCP1CON<7>) is written any time during the PWM cycle. 2: When changing directions, the P1A and P1C signals switch before the end of the current PWM cycle at intervals of 4 TOSC, 16 TOSC or 64 TOSC, depending on the Timer2 prescaler value. The modulated P1B and P1D signals are inactive at this time. Period (Note 2) P1A (Active-High) P1B (Active-High) P1C (Active-High) P1D (Active-High) DC Forward Period Reverse Period P1A(1) tON (2) tOFF (3) t = tOFF – tON (2,3) P1B(1) P1C(1) P1D(1) External Switch D(1) Potential Shoot-Through Current(1) Note 1: All signals are shown as active-high. 2: tON is the turn-on delay of power switch QC and its driver. 3: tOFF is the turn-off delay of power switch QD and its driver. External Switch C(1) t1 DC DC PIC18F2420/2520/4420/4520 DS39631B-page 156 Preliminary © 2007 Microchip Technology Inc. 16.4.6 PROGRAMMABLE DEAD-BAND DELAY In half-bridge applications where all power switches are modulated at the PWM frequency at all times, the power switches normally require more time to turn off than to turn on. If both the upper and lower power switches are switched at the same time (one turned on and the other turned off), both switches may be on for a short period of time until one switch completely turns off. During this brief interval, a very high current (shootthrough current) may flow through both power switches, shorting the bridge supply. To avoid this potentially destructive shoot-through current from flowing during switching, turning on either of the power switches is normally delayed to allow the other switch to completely turn off. In the Half-Bridge Output mode, a digitally programmable dead-band delay is available to avoid shoot-through current from destroying the bridge power switches. The delay occurs at the signal transition from the nonactive state to the active state. See Figure 16-4 for illustration. Bits PDC6:PDC0 of the PWM1CON register (Register 16-2) set the delay period in terms of microcontroller instruction cycles (TCY or 4 TOSC). These bits are not available on 28-pin devices as the standard CCP module does not support half-bridge operation. 16.4.7 ENHANCED PWM AUTO-SHUTDOWN When the CCP1 is programmed for any of the enhanced PWM modes, the active output pins may be configured for auto-shutdown. Auto-shutdown immediately places the enhanced PWM output pins into a defined shutdown state when a shutdown event occurs. A shutdown event can be caused by either of the comparator modules, a low level on the Fault input pin (FLT0) or any combination of these three sources. The comparators may be used to monitor a voltage input proportional to a current being monitored in the bridge circuit. If the voltage exceeds a threshold, the comparator switches state and triggers a shutdown. Alternatively, a low digital signal on FLT0 can also trigger a shutdown. The auto-shutdown feature can be disabled by not selecting any auto-shutdown sources. The autoshutdown sources to be used are selected using the ECCPAS2:ECCPAS0 bits (bits<6:4> of the ECCP1AS register). When a shutdown occurs, the output pins are asynchronously placed in their shutdown states, specified by the PSSAC1:PSSAC0 and PSSBD1:PSSBD0 bits (ECCPAS2:ECCPAS0). Each pin pair (P1A/P1C and P1B/P1D) may be set to drive high, drive low or be tristated (not driving). The ECCPASE bit (ECCP1AS<7>) is also set to hold the enhanced PWM outputs in their shutdown states. The ECCPASE bit is set by hardware when a shutdown event occurs. If automatic restarts are not enabled, the ECCPASE bit is cleared by firmware when the cause of the shutdown clears. If automatic restarts are enabled, the ECCPASE bit is automatically cleared when the cause of the auto-shutdown has cleared. If the ECCPASE bit is set when a PWM period begins, the PWM outputs remain in their shutdown state for that entire PWM period. When the ECCPASE bit is cleared, the PWM outputs will return to normal operation at the beginning of the next PWM period. REGISTER 16-2: PWM1CON: PWM CONFIGURATION REGISTER Note: Programmable dead-band delay is not implemented in 28-pin devices with standard CCP modules. Note: Writing to the ECCPASE bit is disabled while a shutdown condition is active. R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) bit 7 bit 0 bit 7 PRSEN: PWM Restart Enable bit 1 = Upon auto-shutdown, the ECCPASE bit clears automatically once the shutdown event goes away; the PWM restarts automatically 0 = Upon auto-shutdown, ECCPASE must be cleared in software to restart the PWM bit 6-0 PDC6:PDC0: PWM Delay Count bits(1) Delay time, in number of FOSC/4 (4 * TOSC) cycles, between the scheduled and actual time for a PWM signal to transition to active. Note 1: Reserved on 28-pin devices; maintain these bits clear. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 157 PIC18F2420/2520/4420/4520 REGISTER 16-3: ECCP1AS: ENHANCED CAPTURE/COMPARE/PWM AUTO-SHUTDOWN CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) bit 7 bit 0 bit 7 ECCPASE: ECCP Auto-Shutdown Event Status bit 1 = A shutdown event has occurred; ECCP outputs are in shutdown state 0 = ECCP outputs are operating bit 6-4 ECCPAS2:ECCPAS0: ECCP Auto-Shutdown Source Select bits 111 = FLT0 or Comparator 1 or Comparator 2 110 = FLT0 or Comparator 2 101 = FLT0 or Comparator 1 100 = FLT0 011 = Either Comparator 1 or 2 010 = Comparator 2 output 001 = Comparator 1 output 000 = Auto-shutdown is disabled bit 3-2 PSSAC1:PSSAC0: Pins A and C Shutdown State Control bits 1x = Pins A and C are tri-state (40/44-pin devices); PWM output is tri-state (28-pin devices) 01 = Drive Pins A and C to ‘1’ 00 = Drive Pins A and C to ‘0’ bit 1-0 PSSBD1:PSSBD0: Pins B and D Shutdown State Control bits(1) 1x = Pins B and D tri-state 01 = Drive Pins B and D to ‘1’ 00 = Drive Pins B and D to ‘0’ Note 1: Reserved on 28-pin devices; maintain these bits clear. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 158 Preliminary © 2007 Microchip Technology Inc. 16.4.7.1 Auto-Shutdown and Automatic Restart The auto-shutdown feature can be configured to allow automatic restarts of the module following a shutdown event. This is enabled by setting the PRSEN bit of the PWM1CON register (PWM1CON<7>). In Shutdown mode with PRSEN = 1 (Figure 16-10), the ECCPASE bit will remain set for as long as the cause of the shutdown continues. When the shutdown condition clears, the ECCP1ASE bit is cleared. If PRSEN = 0 (Figure 16-11), once a shutdown condition occurs, the ECCPASE bit will remain set until it is cleared by firmware. Once ECCPASE is cleared, the enhanced PWM will resume at the beginning of the next PWM period. Independent of the PRSEN bit setting, if the autoshutdown source is one of the comparators, the shutdown condition is a level. The ECCPASE bit cannot be cleared as long as the cause of the shutdown persists. The Auto-Shutdown mode can be forced by writing a ‘1’ to the ECCPASE bit. 16.4.8 START-UP CONSIDERATIONS When the ECCP module is used in the PWM mode, the application hardware must use the proper external pullup and/or pull-down resistors on the PWM output pins. When the microcontroller is released from Reset, all of the I/O pins are in the high-impedance state. The external circuits must keep the power switch devices in the off state until the microcontroller drives the I/O pins with the proper signal levels, or activates the PWM output(s). The CCP1M1:CCP1M0 bits (CCP1CON<1:0>) allow the user to choose whether the PWM output signals are active-high or active-low for each pair of PWM output pins (P1A/P1C and P1B/P1D). The PWM output polarities must be selected before the PWM pins are configured as outputs. Changing the polarity configuration while the PWM pins are configured as outputs is not recommended, since it may result in damage to the application circuits. The P1A, P1B, P1C and P1D output latches may not be in the proper states when the PWM module is initialized. Enabling the PWM pins for output at the same time as the ECCP module may cause damage to the application circuit. The ECCP module must be enabled in the proper output mode and complete a full PWM cycle before configuring the PWM pins as outputs. The completion of a full PWM cycle is indicated by the TMR2IF bit being set as the second PWM period begins. FIGURE 16-10: PWM AUTO-SHUTDOWN (PRSEN = 1, AUTO-RESTART ENABLED) FIGURE 16-11: PWM AUTO-SHUTDOWN (PRSEN = 0, AUTO-RESTART DISABLED) Note: Writing to the ECCPASE bit is disabled while a shutdown condition is active. Shutdown PWM ECCPASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes Normal PWM Start of PWM Period PWM Period Shutdown PWM ECCPASE bit Activity Event Shutdown Event Occurs Shutdown Event Clears PWM Resumes Normal PWM Start of PWM Period ECCPASE Cleared by Firmware PWM Period © 2007 Microchip Technology Inc. Preliminary DS39631B-page 159 PIC18F2420/2520/4420/4520 16.4.9 SETUP FOR PWM OPERATION The following steps should be taken when configuring the ECCP module for PWM operation: 1. Configure the PWM pins, P1A and P1B (and P1C and P1D, if used), as inputs by setting the corresponding TRIS bits. 2. Set the PWM period by loading the PR2 register. 3. If auto-shutdown is required: • Disable auto-shutdown (ECCP1AS = 0) • Configure source (FLT0, Comparator 1 or Comparator 2) • Wait for non-shutdown condition 4. Configure the ECCP module for the desired PWM mode and configuration by loading the CCP1CON register with the appropriate values: • Select one of the available output configurations and direction with the P1M1:P1M0 bits. • Select the polarities of the PWM output signals with the CCP1M3:CCP1M0 bits. 5. Set the PWM duty cycle by loading the CCPR1L register and CCP1CON<5:4> bits. 6. For Half-Bridge Output mode, set the deadband delay by loading PWM1CON<6:0> with the appropriate value. 7. If auto-shutdown operation is required, load the ECCP1AS register: • Select the auto-shutdown sources using the ECCPAS2:ECCPAS0 bits. • Select the shutdown states of the PWM output pins using the PSSAC1:PSSAC0 and PSSBD1:PSSBD0 bits. • Set the ECCPASE bit (ECCP1AS<7>). • Configure the comparators using the CMCON register. • Configure the comparator inputs as analog inputs. 8. If auto-restart operation is required, set the PRSEN bit (PWM1CON<7>). 9. Configure and start TMR2: • Clear the TMR2 interrupt flag bit by clearing the TMR2IF bit (PIR1<1>). • Set the TMR2 prescale value by loading the T2CKPS bits (T2CON<1:0>). • Enable Timer2 by setting the TMR2ON bit (T2CON<2>). 10. Enable PWM outputs after a new PWM cycle has started: • Wait until TMRn overflows (TMRnIF bit is set). • Enable the CCP1/P1A, P1B, P1C and/or P1D pin outputs by clearing the respective TRIS bits. • Clear the ECCPASE bit (ECCP1AS<7>). 16.4.10 OPERATION IN POWER MANAGED MODES In Sleep mode, all clock sources are disabled. Timer2 will not increment and the state of the module will not change. If the ECCP pin is driving a value, it will continue to drive that value. When the device wakes up, it will continue from this state. If Two-Speed Start-ups are enabled, the initial start-up frequency from INTOSC and the postscaler may not be stable immediately. In PRI_IDLE mode, the primary clock will continue to clock the ECCP module without change. In all other power managed modes, the selected power managed mode clock will clock Timer2. Other power managed mode clocks will most likely be different than the primary clock frequency. 16.4.10.1 Operation with Fail-Safe Clock Monitor If the Fail-Safe Clock Monitor is enabled, a clock failure will force the device into the RC_RUN Power Managed mode and the OSCFIF bit (PIR2<7>) will be set. The ECCP will then be clocked from the internal oscillator clock source, which may have a different clock frequency than the primary clock. See the previous section for additional details. 16.4.11 EFFECTS OF A RESET Both Power-on Reset and subsequent Resets will force all ports to Input mode and the CCP registers to their Reset states. This forces the enhanced CCP module to reset to a state compatible with the standard CCP module. PIC18F2420/2520/4420/4520 DS39631B-page 160 Preliminary © 2007 Microchip Technology Inc. TABLE 16-3: REGISTERS ASSOCIATED WITH ECCP1 MODULE AND TIMER1 TO TIMER3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 RCON IPEN SBOREN — RI TO PD POR BOR 48 PIR1 PSPIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 TRISB PORTB Data Direction Control Register 52 TRISC PORTC Data Direction Control Register 52 TRISD PORTD Data Direction Control Register 52 TMR1L Timer1 Register, Low Byte 50 TMR1H Timer1 Register, High Byte 50 T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 50 TMR2 Timer2 Register 50 T2CON — T2OUTPS3 T2OUTPS2 T2OUTPS1 T2OUTPS0 TMR2ON T2CKPS1 T2CKPS0 50 PR2 Timer2 Period Register 50 TMR3L Timer3 Register, Low Byte 51 TMR3H Timer3 Register, High Byte 51 T3CON RD16 T3CCP2 T3CKPS1 T3CKPS0 T3CCP1 T3SYNC TMR3CS TMR3ON 51 CCPR1L Capture/Compare/PWM Register 1, Low Byte 51 CCPR1H Capture/Compare/PWM Register 1, High Byte 51 CCP1CON P1M1(1) P1M0(1) DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 51 ECCP1AS ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1(1) PSSBD0(1) 51 PWM1CON PRSEN PDC6(1) PDC5(1) PDC4(1) PDC3(1) PDC2(1) PDC1(1) PDC0(1) 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used during ECCP operation. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 161 PIC18F2420/2520/4420/4520 17.0 MASTER SYNCHRONOUS SERIAL PORT (MSSP) MODULE 17.1 Master SSP (MSSP) Module Overview The Master Synchronous Serial Port (MSSP) module is a serial interface, useful for communicating with other peripheral or microcontroller devices. These peripheral devices may be serial EEPROMs, shift registers, display drivers, A/D converters, etc. The MSSP module can operate in one of two modes: • Serial Peripheral Interface (SPI) • Inter-Integrated Circuit (I2C) - Full Master mode - Slave mode (with general address call) The I2C interface supports the following modes in hardware: • Master mode • Multi-Master mode • Slave mode 17.2 Control Registers The MSSP module has three associated registers. These include a status register (SSPSTAT) and two control registers (SSPCON1 and SSPCON2). The use of these registers and their individual configuration bits differ significantly depending on whether the MSSP module is operated in SPI or I2C mode. Additional details are provided under the individual sections. 17.3 SPI Mode The SPI mode allows 8 bits of data to be synchronously transmitted and received simultaneously. All four modes of SPI are supported. To accomplish communication, typically three pins are used: • Serial Data Out (SDO) – RC5/SDO • Serial Data In (SDI) – RC4/SDI/SDA • Serial Clock (SCK) – RC3/SCK/SCL Additionally, a fourth pin may be used when in a Slave mode of operation: • Slave Select (SS) – RA5/SS Figure 17-1 shows the block diagram of the MSSP module when operating in SPI mode. FIGURE 17-1: MSSP BLOCK DIAGRAM (SPI MODE) ( ) Read Write Internal Data Bus SSPSR reg SSPM3:SSPM0 bit 0 Shift Clock SS Control Enable Edge Select Clock Select TMR2 Output Prescaler TOSC 4, 16, 64 2 Edge Select 2 4 Data to TX/RX in SSPSR TRIS bit 2 SMP:CKE RC5/SDO SSPBUF reg RC4/SDI/SDA RA5/AN4/SS/ RC3/SCK/ SCL HLVDIN/C2OUT PIC18F2420/2520/4420/4520 DS39631B-page 162 Preliminary © 2007 Microchip Technology Inc. 17.3.1 REGISTERS The MSSP module has four registers for SPI mode operation. These are: • MSSP Control Register 1 (SSPCON1) • MSSP Status Register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible SSPCON1 and SSPSTAT are the control and status registers in SPI mode operation. The SSPCON1 register is readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. REGISTER 17-1: SSPSTAT: MSSP STATUS REGISTER (SPI MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 bit 7 SMP: Sample bit SPI Master mode: 1 = Input data sampled at end of data output time 0 = Input data sampled at middle of data output time SPI Slave mode: SMP must be cleared when SPI is used in Slave mode. bit 6 CKE: SPI Clock Select bit 1 = Transmit occurs on transition from active to Idle clock state 0 = Transmit occurs on transition from Idle to active clock state Note: Polarity of clock state is set by the CKP bit (SSPCON1<4>). bit 5 D/A: Data/Address bit Used in I2C mode only. bit 4 P: Stop bit Used in I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared. bit 3 S: Start bit Used in I2C mode only. bit 2 R/W: Read/Write Information bit Used in I2C mode only. bit 1 UA: Update Address bit Used in I2C mode only. bit 0 BF: Buffer Full Status bit (Receive mode only) 1 = Receive complete, SSPBUF is full 0 = Receive not complete, SSPBUF is empty Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 163 PIC18F2420/2520/4420/4520 REGISTER 17-2: SSPCON1: MSSP CONTROL REGISTER 1 (SPI MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 bit 7 WCOL: Write Collision Detect bit (Transmit mode only) 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision bit 6 SSPOV: Receive Overflow Indicator bit SPI Slave mode: 1 = A new byte is received while the SSPBUF register is still holding the previous data. In case of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user must read the SSPBUF, even if only transmitting data, to avoid setting overflow (must be cleared in software). 0 = No overflow Note: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSPBUF register. bit 5 SSPEN: Synchronous Serial Port Enable bit 1 = Enables serial port and configures SCK, SDO, SDI and SS as serial port pins 0 = Disables serial port and configures these pins as I/O port pins Note: When enabled, these pins must be properly configured as input or output. bit 4 CKP: Clock Polarity Select bit 1 = Idle state for clock is a high level 0 = Idle state for clock is a low level bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits 0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin 0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled 0011 = SPI Master mode, clock = TMR2 output/2 0010 = SPI Master mode, clock = FOSC/64 0001 = SPI Master mode, clock = FOSC/16 0000 = SPI Master mode, clock = FOSC/4 Note: Bit combinations not specifically listed here are either reserved or implemented in I2C mode only. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 164 Preliminary © 2007 Microchip Technology Inc. 17.3.2 OPERATION When initializing the SPI, several options need to be specified. This is done by programming the appropriate control bits (SSPCON1<5:0> and SSPSTAT<7:6>). These control bits allow the following to be specified: • Master mode (SCK is the clock output) • Slave mode (SCK is the clock input) • Clock Polarity (Idle state of SCK) • Data Input Sample Phase (middle or end of data output time) • Clock Edge (output data on rising/falling edge of SCK) • Clock Rate (Master mode only) • Slave Select mode (Slave mode only) The MSSP consists of a transmit/receive shift register (SSPSR) and a buffer register (SSPBUF). The SSPSR shifts the data in and out of the device, MSb first. The SSPBUF holds the data that was written to the SSPSR until the received data is ready. Once the 8 bits of data have been received, that byte is moved to the SSPBUF register. Then, the Buffer Full detect bit, BF (SSPSTAT<0>) and the interrupt flag bit, SSPIF, are set. This double-buffering of the received data (SSPBUF) allows the next byte to start reception before reading the data that was just received. Any write to the SSPBUF register during transmission/reception of data will be ignored and the write collision detect bit, WCOL (SSPCON1<7>), will be set. User software must clear the WCOL bit so that it can be determined if the following write(s) to the SSPBUF register completed successfully. When the application software is expecting to receive valid data, the SSPBUF should be read before the next byte of data to transfer is written to the SSPBUF. The Buffer Full bit, BF (SSPSTAT<0>), indicates when SSPBUF has been loaded with the received data (transmission is complete). When the SSPBUF is read, the BF bit is cleared. This data may be irrelevant if the SPI is only a transmitter. Generally, the MSSP interrupt is used to determine when the transmission/reception has completed. The SSPBUF must be read and/or written. If the interrupt method is not going to be used, then software polling can be done to ensure that a write collision does not occur. Example 17-1 shows the loading of the SSPBUF (SSPSR) for data transmission. The SSPSR is not directly readable or writable and can only be accessed by addressing the SSPBUF register. Additionally, the MSSP status register (SSPSTAT) indicates the various status conditions. EXAMPLE 17-1: LOADING THE SSPBUF (SSPSR) REGISTER LOOP BTFSS SSPSTAT, BF ;Has data been received (transmit complete)? BRA LOOP ;No MOVF SSPBUF, W ;WREG reg = contents of SSPBUF MOVWF RXDATA ;Save in user RAM, if data is meaningful MOVF TXDATA, W ;W reg = contents of TXDATA MOVWF SSPBUF ;New data to xmit © 2007 Microchip Technology Inc. Preliminary DS39631B-page 165 PIC18F2420/2520/4420/4520 17.3.3 ENABLING SPI I/O To enable the serial port, SSP Enable bit, SSPEN (SSPCON1<5>), must be set. To reset or reconfigure SPI mode, clear the SSPEN bit, reinitialize the SSPCON registers and then set the SSPEN bit. This configures the SDI, SDO, SCK and SS pins as serial port pins. For the pins to behave as the serial port function, some must have their data direction bits (in the TRIS register) appropriately programmed as follows: • SDI is automatically controlled by the SPI module • SDO must have TRISC<5> bit cleared • SCK (Master mode) must have TRISC<3> bit cleared • SCK (Slave mode) must have TRISC<3> bit set • SS must have TRISA<5> bit set Any serial port function that is not desired may be overridden by programming the corresponding data direction (TRIS) register to the opposite value. 17.3.4 TYPICAL CONNECTION Figure 17-2 shows a typical connection between two microcontrollers. The master controller (Processor 1) initiates the data transfer by sending the SCK signal. Data is shifted out of both shift registers on their programmed clock edge and latched on the opposite edge of the clock. Both processors should be programmed to the same Clock Polarity (CKP), then both controllers would send and receive data at the same time. Whether the data is meaningful (or dummy data) depends on the application software. This leads to three scenarios for data transmission: • Master sends data – Slave sends dummy data • Master sends data – Slave sends data • Master sends dummy data – Slave sends data FIGURE 17-2: SPI MASTER/SLAVE CONNECTION Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDO SDI PROCESSOR 1 SCK SPI Master SSPM3:SSPM0 = 00xxb Serial Input Buffer (SSPBUF) Shift Register (SSPSR) MSb LSb SDI SDO PROCESSOR 2 SCK SPI Slave SSPM3:SSPM0 = 010xb Serial Clock PIC18F2420/2520/4420/4520 DS39631B-page 166 Preliminary © 2007 Microchip Technology Inc. 17.3.5 MASTER MODE The master can initiate the data transfer at any time because it controls the SCK. The master determines when the slave (Processor 2, Figure 17-2) is to broadcast data by the software protocol. In Master mode, the data is transmitted/received as soon as the SSPBUF register is written to. If the SPI is only going to receive, the SDO output could be disabled (programmed as an input). The SSPSR register will continue to shift in the signal present on the SDI pin at the programmed clock rate. As each byte is received, it will be loaded into the SSPBUF register as if a normal received byte (interrupts and status bits appropriately set). This could be useful in receiver applications as a “Line Activity Monitor” mode. The clock polarity is selected by appropriately programming the CKP bit (SSPCON1<4>). This then, would give waveforms for SPI communication as shown in Figure 17-3, Figure 17-5 and Figure 17-6, where the MSB is transmitted first. In Master mode, the SPI clock rate (bit rate) is user programmable to be one of the following: • FOSC/4 (or TCY) • FOSC/16 (or 4 • TCY) • FOSC/64 (or 16 • TCY) • Timer2 output/2 This allows a maximum data rate (at 40 MHz) of 10.00 Mbps. Figure 17-3 shows the waveforms for Master mode. When the CKE bit is set, the SDO data is valid before there is a clock edge on SCK. The change of the input sample is shown based on the state of the SMP bit. The time when the SSPBUF is loaded with the received data is shown. FIGURE 17-3: SPI MODE WAVEFORM (MASTER MODE) SCK (CKP = 0 SCK (CKP = 1 SCK (CKP = 0 SCK (CKP = 1 4 Clock Modes Input Sample Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 bit 7 SDI SSPIF (SMP = 1) (SMP = 0) (SMP = 1) CKE = 1) CKE = 0) CKE = 1) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 (CKE = 0) (CKE = 1) Next Q4 Cycle after Q2↓ bit 0 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 167 PIC18F2420/2520/4420/4520 17.3.6 SLAVE MODE In Slave mode, the data is transmitted and received as the external clock pulses appear on SCK. When the last bit is latched, the SSPIF interrupt flag bit is set. Before enabling the module in SPI Slave mode, the clock line must match the proper Idle state. The clock line can be observed by reading the SCK pin. The Idle state is determined by the CKP bit (SSPCON1<4>). While in Slave mode, the external clock is supplied by the external clock source on the SCK pin. This external clock must meet the minimum high and low times as specified in the electrical specifications. While in Sleep mode, the slave can transmit/receive data. When a byte is received, the device will wake-up from Sleep. 17.3.7 SLAVE SELECT SYNCHRONIZATION The SS pin allows a Synchronous Slave mode. The SPI must be in Slave mode with SS pin control enabled (SSPCON1<3:0> = 04h). The pin must not be driven low for the SS pin to function as an input. The data latch must be high. When the SS pin is low, transmission and reception are enabled and the SDO pin is driven. When the SS pin goes high, the SDO pin is no longer driven, even if in the middle of a transmitted byte and becomes a floating output. External pull-up/pull-down resistors may be desirable depending on the application. When the SPI module resets, the bit counter is forced to ‘0’. This can be done by either forcing the SS pin to a high level or clearing the SSPEN bit. To emulate two-wire communication, the SDO pin can be connected to the SDI pin. When the SPI needs to operate as a receiver, the SDO pin can be configured as an input. This disables transmissions from the SDO. The SDI can always be left as an input (SDI function) since it cannot create a bus conflict. FIGURE 17-4: SLAVE SYNCHRONIZATION WAVEFORM Note 1: When the SPI is in Slave mode with SS pin control enabled (SSPCON<3:0> = 0100), the SPI module will reset if the SS pin is set to VDD. 2: If the SPI is used in Slave mode with CKE set, then the SS pin control must be enabled. SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 7 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag bit 0 bit 7 bit 0 Next Q4 Cycle after Q2↓ PIC18F2420/2520/4420/4520 DS39631B-page 168 Preliminary © 2007 Microchip Technology Inc. FIGURE 17-5: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0) FIGURE 17-6: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1) SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 0) CKE = 0) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Optional Next Q4 Cycle after Q2↓ bit 0 SCK (CKP = 1 SCK (CKP = 0 Input Sample SDI bit 7 bit 0 SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 SSPIF Interrupt (SMP = 0) CKE = 1) CKE = 1) (SMP = 0) Write to SSPBUF SSPSR to SSPBUF SS Flag Not Optional Next Q4 Cycle after Q2↓ © 2007 Microchip Technology Inc. Preliminary DS39631B-page 169 PIC18F2420/2520/4420/4520 17.3.8 OPERATION IN POWER MANAGED MODES In SPI Master mode, module clocks may be operating at a different speed than when in full power mode; in the case of the Sleep mode, all clocks are halted. In most Idle modes, a clock is provided to the peripherals. That clock should be from the primary clock source, the secondary clock (Timer1 oscillator at 32.768 kHz) or the INTOSC source. See Section 2.7 “Clock Sources and Oscillator Switching” for additional information. In most cases, the speed that the master clocks SPI data is not important; however, this should be evaluated for each system. If MSSP interrupts are enabled, they can wake the controller from Sleep mode, or one of the Idle modes, when the master completes sending data. If an exit from Sleep or Idle mode is not desired, MSSP interrupts should be disabled. If the Sleep mode is selected, all module clocks are halted and the transmission/reception will remain in that state until the devices wakes. After the device returns to Run mode, the module will resume transmitting and receiving data. In SPI Slave mode, the SPI Transmit/Receive Shift register operates asynchronously to the device. This allows the device to be placed in any power managed mode and data to be shifted into the SPI Transmit/ Receive Shift register. When all 8 bits have been received, the MSSP interrupt flag bit will be set and if enabled, will wake the device. 17.3.9 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 17.3.10 BUS MODE COMPATIBILITY Table 17-1 shows the compatibility between the standard SPI modes and the states of the CKP and CKE control bits. TABLE 17-1: SPI BUS MODES There is also an SMP bit which controls when the data is sampled. TABLE 17-2: REGISTERS ASSOCIATED WITH SPI OPERATION Standard SPI Mode Terminology Control Bits State CKP CKE 0, 0 0 1 0, 1 0 0 1, 0 1 1 1, 1 1 0 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 TRISA TRISA7(2) TRISA6(2) PORTA Data Direction Control Register 52 TRISC PORTC Data Direction Control Register 52 SSPBUF SSP Receive Buffer/Transmit Register 50 SSPCON1 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 50 SSPSTAT SMP CKE D/A P S R/W UA BF 50 Legend: Shaded cells are not used by the MSSP in SPI mode. Note 1: These bits are unimplemented in 28-pin devices; always maintain these bits clear. 2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 170 Preliminary © 2007 Microchip Technology Inc. 17.4 I2C Mode The MSSP module in I2C mode fully implements all master and slave functions (including general call support) and provides interrupts on Start and Stop bits in hardware to determine a free bus (multi-master function). The MSSP module implements the standard mode specifications as well as 7-bit and 10-bit addressing. Two pins are used for data transfer: • Serial clock (SCL) – RC3/SCK/SCL • Serial data (SDA) – RC4/SDI/SDA The user must configure these pins as inputs or outputs through the TRISC<4:3> bits. FIGURE 17-7: MSSP BLOCK DIAGRAM (I2C MODE) 17.4.1 REGISTERS The MSSP module has six registers for I2C operation. These are: • MSSP Control Register 1 (SSPCON1) • MSSP Control Register 2 (SSPCON2) • MSSP Status Register (SSPSTAT) • Serial Receive/Transmit Buffer Register (SSPBUF) • MSSP Shift Register (SSPSR) – Not directly accessible • MSSP Address Register (SSPADD) SSPCON1, SSPCON2 and SSPSTAT are the control and status registers in I2C mode operation. The SSPCON1 and SSPCON2 registers are readable and writable. The lower 6 bits of the SSPSTAT are read-only. The upper two bits of the SSPSTAT are read/write. SSPSR is the shift register used for shifting data in or out. SSPBUF is the buffer register to which data bytes are written to or read from. SSPADD register holds the slave device address when the SSP is configured in I2C Slave mode. When the SSP is configured in Master mode, the lower seven bits of SSPADD act as the Baud Rate Generator reload value. In receive operations, SSPSR and SSPBUF together create a double-buffered receiver. When SSPSR receives a complete byte, it is transferred to SSPBUF and the SSPIF interrupt is set. During transmission, the SSPBUF is not doublebuffered. A write to SSPBUF will write to both SSPBUF and SSPSR. Read Write SSPSR reg Match Detect SSPADD reg Start and Stop bit Detect SSPBUF reg Internal Data Bus Addr Match Set, Reset S, P bits (SSPSTAT reg) RC3/SCK/SCL RC4/SDI/ Shift Clock MSb SDA LSb © 2007 Microchip Technology Inc. Preliminary DS39631B-page 171 PIC18F2420/2520/4420/4520 REGISTER 17-3: SSPSTAT: MSSP STATUS REGISTER (I2C MODE) R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0 SMP CKE D/A P S R/W UA BF bit 7 bit 0 bit 7 SMP: Slew Rate Control bit In Master or Slave mode: 1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz) 0 = Slew rate control enabled for high-speed mode (400 kHz) bit 6 CKE: SMBus Select bit In Master or Slave mode: 1 = Enable SMBus specific inputs 0 = Disable SMBus specific inputs bit 5 D/A: Data/Address bit In Master mode: Reserved. In Slave mode: 1 = Indicates that the last byte received or transmitted was data 0 = Indicates that the last byte received or transmitted was address bit 4 P: Stop bit 1 = Indicates that a Stop bit has been detected last 0 = Stop bit was not detected last Note: This bit is cleared on Reset and when SSPEN is cleared. bit 3 S: Start bit 1 = Indicates that a Start bit has been detected last 0 = Start bit was not detected last Note: This bit is cleared on Reset and when SSPEN is cleared. bit 2 R/W: Read/Write Information bit (I2C mode only) In Slave mode: 1 = Read 0 = Write Note: This bit holds the R/W bit information following the last address match. This bit is only valid from the address match to the next Start bit, Stop bit or not ACK bit. In Master mode: 1 = Transmit is in progress 0 = Transmit is not in progress Note: ORing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Active mode. bit 1 UA: Update Address bit (10-bit Slave mode only) 1 = Indicates that the user needs to update the address in the SSPADD register 0 = Address does not need to be updated bit 0 BF: Buffer Full Status bit In Transmit mode: 1 = SSPBUF is full 0 = SSPBUF is empty In Receive mode: 1 = SSPBUF is full (does not include the ACK and Stop bits) 0 = SSPBUF is empty (does not include the ACK and Stop bits) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 172 Preliminary © 2007 Microchip Technology Inc. REGISTER 17-4: SSPCON1: MSSP CONTROL REGISTER 1 (I2C MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 bit 7 bit 0 bit 7 WCOL: Write Collision Detect bit In Master Transmit mode: 1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a transmission to be started (must be cleared in software) 0 = No collision In Slave Transmit mode: 1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in software) 0 = No collision In Receive mode (Master or Slave modes): This is a “don’t care” bit. bit 6 SSPOV: Receive Overflow Indicator bit In Receive mode: 1 = A byte is received while the SSPBUF register is still holding the previous byte (must be cleared in software) 0 = No overflow In Transmit mode: This is a “don’t care” bit in Transmit mode. bit 5 SSPEN: Synchronous Serial Port Enable bit 1 = Enables the serial port and configures the SDA and SCL pins as the serial port pins 0 = Disables serial port and configures these pins as I/O port pins Note: When enabled, the SDA and SCL pins must be properly configured as input or output. bit 4 CKP: SCK Release Control bit In Slave mode: 1 = Release clock 0 = Holds clock low (clock stretch), used to ensure data setup time In Master mode: Unused in this mode. bit 3-0 SSPM3:SSPM0: Synchronous Serial Port Mode Select bits 1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled 1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled 1011 = I2C Firmware Controlled Master mode (Slave Idle) 1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD + 1)) 0111 = I2C Slave mode, 10-bit address 0110 = I2C Slave mode, 7-bit address Bit combinations not specifically listed here are either reserved or implemented in SPI mode only. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 173 PIC18F2420/2520/4420/4520 REGISTER 17-5: SSPCON2: MSSP CONTROL REGISTER 2 (I2C MODE) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GCEN ACKSTAT ACKDT ACKEN(1) RCEN(1) PEN(1) RSEN(1) SEN(1) bit 7 bit 0 bit 7 GCEN: General Call Enable bit (Slave mode only) 1 = Enable interrupt when a general call address (0000h) is received in the SSPSR 0 = General call address disabled bit 6 ACKSTAT: Acknowledge Status bit (Master Transmit mode only) 1 = Acknowledge was not received from slave 0 = Acknowledge was received from slave bit 5 ACKDT: Acknowledge Data bit (Master Receive mode only) 1 = Not Acknowledge 0 = Acknowledge Note: Value that will be transmitted when the user initiates an Acknowledge sequence at the end of a receive. bit 4 ACKEN: Acknowledge Sequence Enable bit (Master Receive mode only)(1) 1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically cleared by hardware. 0 = Acknowledge sequence Idle bit 3 RCEN: Receive Enable bit (Master mode only)(1) 1 = Enables Receive mode for I2C 0 = Receive Idle bit 2 PEN: Stop Condition Enable bit (Master mode only)(1) 1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Stop condition Idle bit 1 RSEN: Repeated Start Condition Enable bit (Master mode only)(1) 1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Repeated Start condition Idle bit 0 SEN: Start Condition Enable/Stretch Enable bit(1) In Master mode: 1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware. 0 = Start condition Idle In Slave mode: 1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled) 0 = Clock stretching is disabled Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, these bits may not be set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled). Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 174 Preliminary © 2007 Microchip Technology Inc. 17.4.2 OPERATION The MSSP module functions are enabled by setting MSSP Enable bit, SSPEN (SSPCON<5>). The SSPCON1 register allows control of the I2C operation. Four mode selection bits (SSPCON<3:0>) allow one of the following I2C modes to be selected: • I2C Master mode, clock = (FOSC/4) x (SSPADD + 1) • I2C Slave mode (7-bit address) • I2C Slave mode (10-bit address) • I2C Slave mode (7-bit address) with Start and Stop bit interrupts enabled • I2C Slave mode (10-bit address) with Start and Stop bit interrupts enabled • I2C Firmware Controlled Master mode, slave is Idle Selection of any I2C mode with the SSPEN bit set, forces the SCL and SDA pins to be open-drain, provided these pins are programmed to inputs by setting the appropriate TRISC bits. To ensure proper operation of the module, pull-up resistors must be provided externally to the SCL and SDA pins. 17.4.3 SLAVE MODE In Slave mode, the SCL and SDA pins must be configured as inputs (TRISC<4:3> set). The MSSP module will override the input state with the output data when required (slave-transmitter). The I2C Slave mode hardware will always generate an interrupt on an address match. Through the mode select bits, the user can also choose to interrupt on Start and Stop bits When an address is matched, or the data transfer after an address match is received, the hardware automatically will generate the Acknowledge (ACK) pulse and load the SSPBUF register with the received value currently in the SSPSR register. Any combination of the following conditions will cause the MSSP module not to give this ACK pulse: • The Buffer Full bit, BF (SSPSTAT<0>), was set before the transfer was received. • The overflow bit, SSPOV (SSPCON<6>), was set before the transfer was received. In this case, the SSPSR register value is not loaded into the SSPBUF, but bit SSPIF (PIR1<3>) is set. The BF bit is cleared by reading the SSPBUF register, while bit SSPOV is cleared through software. The SCL clock input must have a minimum high and low for proper operation. The high and low times of the I2C specification, as well as the requirement of the MSSP module, are shown in timing parameter 100 and parameter 101. 17.4.3.1 Addressing Once the MSSP module has been enabled, it waits for a Start condition to occur. Following the Start condition, the 8 bits are shifted into the SSPSR register. All incoming bits are sampled with the rising edge of the clock (SCL) line. The value of register SSPSR<7:1> is compared to the value of the SSPADD register. The address is compared on the falling edge of the eighth clock (SCL) pulse. If the addresses match and the BF and SSPOV bits are clear, the following events occur: 1. The SSPSR register value is loaded into the SSPBUF register. 2. The Buffer Full bit, BF, is set. 3. An ACK pulse is generated. 4. MSSP Interrupt Flag bit, SSPIF (PIR1<3>), is set (interrupt is generated, if enabled) on the falling edge of the ninth SCL pulse. In 10-bit Address mode, two address bytes need to be received by the slave. The five Most Significant bits (MSbs) of the first address byte specify if this is a 10-bit address. Bit R/W (SSPSTAT<2>) must specify a write so the slave device will receive the second address byte. For a 10-bit address, the first byte would equal ‘11110 A9 A8 0’, where ‘A9’ and ‘A8’ are the two MSbs of the address. The sequence of events for 10-bit address is as follows, with steps 7 through 9 for the slave-transmitter: 1. Receive first (high) byte of address (bits SSPIF, BF and UA (SSPSTAT<1>) are set). 2. Update the SSPADD register with second (low) byte of address (clears bit UA and releases the SCL line). 3. Read the SSPBUF register (clears bit BF) and clear flag bit, SSPIF. 4. Receive second (low) byte of address (bits SSPIF, BF and UA are set). 5. Update the SSPADD register with the first (high) byte of address. If match releases SCL line, this will clear bit UA. 6. Read the SSPBUF register (clears bit BF) and clear flag bit, SSPIF. 7. Receive Repeated Start condition. 8. Receive first (high) byte of address (bits SSPIF and BF are set). 9. Read the SSPBUF register (clears bit BF) and clear flag bit, SSPIF. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 175 PIC18F2420/2520/4420/4520 17.4.3.2 Reception When the R/W bit of the address byte is clear and an address match occurs, the R/W bit of the SSPSTAT register is cleared. The received address is loaded into the SSPBUF register and the SDA line is held low (ACK). When the address byte overflow condition exists, then the no Acknowledge (ACK) pulse is given. An overflow condition is defined as either bit BF (SSPSTAT<0>) is set, or bit SSPOV (SSPCON1<6>) is set. An MSSP interrupt is generated for each data transfer byte. Flag bit, SSPIF (PIR1<3>), must be cleared in software. The SSPSTAT register is used to determine the status of the byte. If SEN is enabled (SSPCON2<0> = 1), RC3/SCK/SCL will be held low (clock stretch) following each data transfer. The clock must be released by setting bit, CKP (SSPCON<4>). See Section 17.4.4 “Clock Stretching” for more detail. 17.4.3.3 Transmission When the R/W bit of the incoming address byte is set and an address match occurs, the R/W bit of the SSPSTAT register is set. The received address is loaded into the SSPBUF register. The ACK pulse will be sent on the ninth bit and pin RC3/SCK/SCL is held low regardless of SEN (see Section 17.4.4 “Clock Stretching” for more detail). By stretching the clock, the master will be unable to assert another clock pulse until the slave is done preparing the transmit data. The transmit data must be loaded into the SSPBUF register which also loads the SSPSR register. Then pin RC3/ SCK/SCL should be enabled by setting bit, CKP (SSPCON1<4>). The eight data bits are shifted out on the falling edge of the SCL input. This ensures that the SDA signal is valid during the SCL high time (Figure 17-9). The ACK pulse from the master-receiver is latched on the rising edge of the ninth SCL input pulse. If the SDA line is high (not ACK), then the data transfer is complete. In this case, when the ACK is latched by the slave, the slave logic is reset (resets SSPSTAT register) and the slave monitors for another occurrence of the Start bit. If the SDA line was low (ACK), the next transmit data must be loaded into the SSPBUF register. Again, pin RC3/SCK/SCL must be enabled by setting bit CKP. An MSSP interrupt is generated for each data transfer byte. The SSPIF bit must be cleared in software and the SSPSTAT register is used to determine the status of the byte. The SSPIF bit is set on the falling edge of the ninth clock pulse. PIC18F2420/2520/4420/4520 DS39631B-page 176 Preliminary © 2007 Microchip Technology Inc. FIGURE 17-8: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 7-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 R/W = 0 Receiving Data ACK Receiving Data ACK ACK Receiving Address Cleared in software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP (CKP does not reset to ‘0’ when SEN = 0) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 177 PIC18F2420/2520/4420/4520 FIGURE 17-9: I2C™ SLAVE MODE TIMING (TRANSMISSION, 7-BIT ADDRESS) SDA SCL SSPIF (PIR1<3>) BF (SSPSTAT<0>) A6 A5 A4 A3 A2 A1 D6 D5 D4 D3 D2 D1 D0 1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9 SSPBUF is written in software Cleared in software From SSPIF ISR Data in sampled S ACK R/W = 0 Transmitting Data ACK Receiving Address A7 D7 9 1 D6 D5 D4 D3 D2 D1 D0 2 3 4 5 6 7 8 9 SSPBUF is written in software Cleared in software From SSPIF ISR Transmitting Data D7 1 CKP P ACK CKP is set in software CKP is set in software SCL held low while CPU responds to SSPIF PIC18F2420/2520/4420/4520 DS39631B-page 178 Preliminary © 2007 Microchip Technology Inc. FIGURE 17-10: I2C™ SLAVE MODE TIMING WITH SEN = 0 (RECEPTION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared in software D2 6 (PIR1<3>) Cleared in software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP 1 2 3 4 5 7 8 9 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared in software Cleared in software SSPOV (SSPCON1<6>) SSPOV is set because SSPBUF is still full. ACK is not sent. (CKP does not reset to ‘0’ when SEN = 0) Clock is held low until update of SSPADD has taken place © 2007 Microchip Technology Inc. Preliminary DS39631B-page 179 PIC18F2420/2520/4420/4520 FIGURE 17-11: I2C™ SLAVE MODE TIMING (TRANSMISSION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 1 1 1 1 0 A8 R/W=1 ACK ACK R/W = 0 ACK Receive First Byte of Address Cleared in software Bus master terminates transfer A9 6 (PIR1<3>) Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address. SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag Receive First Byte of Address 1 2 3 4 5 7 8 9 D7 D6 D5 D4 D3 D1 ACK D2 6 Transmitting Data Byte D0 Dummy read of SSPBUF to clear BF flag Sr Cleared in software Write of SSPBUF initiates transmit Cleared in software Completion of clears BF flag CKP (SSPCON1<4>) CKP is set in software CKP is automatically cleared in hardware, holding SCL low Clock is held low until update of SSPADD has taken place data transmission Clock is held low until CKP is set to ‘1’ third address sequence BF flag is clear at the end of the PIC18F2420/2520/4420/4520 DS39631B-page 180 Preliminary © 2007 Microchip Technology Inc. 17.4.4 CLOCK STRETCHING Both 7-bit and 10-bit Slave modes implement automatic clock stretching during a transmit sequence. The SEN bit (SSPCON2<0>) allows clock stretching to be enabled during receives. Setting SEN will cause the SCL pin to be held low at the end of each data receive sequence. 17.4.4.1 Clock Stretching for 7-bit Slave Receive Mode (SEN = 1) In 7-bit Slave Receive mode, on the falling edge of the ninth clock at the end of the ACK sequence if the BF bit is set, the CKP bit in the SSPCON1 register is automatically cleared, forcing the SCL output to be held low. The CKP being cleared to ‘0’ will assert the SCL line low. The CKP bit must be set in the user’s ISR before reception is allowed to continue. By holding the SCL line low, the user has time to service the ISR and read the contents of the SSPBUF before the master device can initiate another receive sequence. This will prevent buffer overruns from occurring (see Figure 17-13). 17.4.4.2 Clock Stretching for 10-bit Slave Receive Mode (SEN = 1) In 10-bit Slave Receive mode during the address sequence, clock stretching automatically takes place but CKP is not cleared. During this time, if the UA bit is set after the ninth clock, clock stretching is initiated. The UA bit is set after receiving the upper byte of the 10-bit address and following the receive of the second byte of the 10-bit address with the R/W bit cleared to ‘0’. The release of the clock line occurs upon updating SSPADD. Clock stretching will occur on each data receive sequence as described in 7-bit mode. 17.4.4.3 Clock Stretching for 7-bit Slave Transmit Mode 7-bit Slave Transmit mode implements clock stretching by clearing the CKP bit after the falling edge of the ninth clock if the BF bit is clear. This occurs regardless of the state of the SEN bit. The user’s ISR must set the CKP bit before transmission is allowed to continue. By holding the SCL line low, the user has time to service the ISR and load the contents of the SSPBUF before the master device can initiate another transmit sequence (see Figure 17-9). 17.4.4.4 Clock Stretching for 10-bit Slave Transmit Mode In 10-bit Slave Transmit mode, clock stretching is controlled during the first two address sequences by the state of the UA bit, just as it is in 10-bit Slave Receive mode. The first two addresses are followed by a third address sequence which contains the high-order bits of the 10-bit address and the R/W bit set to ‘1’. After the third address sequence is performed, the UA bit is not set, the module is now configured in Transmit mode and clock stretching is controlled by the BF flag as in 7-bit Slave Transmit mode (see Figure 17-11). Note 1: If the user reads the contents of the SSPBUF before the falling edge of the ninth clock, thus clearing the BF bit, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. The user should be careful to clear the BF bit in the ISR before the next receive sequence in order to prevent an overflow condition. Note: If the user polls the UA bit and clears it by updating the SSPADD register before the falling edge of the ninth clock occurs and if the user hasn’t cleared the BF bit by reading the SSPBUF register before that time, then the CKP bit will still NOT be asserted low. Clock stretching on the basis of the state of the BF bit only occurs during a data sequence, not an address sequence. Note 1: If the user loads the contents of SSPBUF, setting the BF bit before the falling edge of the ninth clock, the CKP bit will not be cleared and clock stretching will not occur. 2: The CKP bit can be set in software regardless of the state of the BF bit. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 181 PIC18F2420/2520/4420/4520 17.4.4.5 Clock Synchronization and the CKP bit When the CKP bit is cleared, the SCL output is forced to ‘0’. However, clearing the CKP bit will not assert the SCL output low until the SCL output is already sampled low. Therefore, the CKP bit will not assert the SCL line until an external I2C master device has already asserted the SCL line. The SCL output will remain low until the CKP bit is set and all other devices on the I2C bus have deasserted SCL. This ensures that a write to the CKP bit will not violate the minimum high time requirement for SCL (see Figure 17-12). FIGURE 17-12: CLOCK SYNCHRONIZATION TIMING SDA SCL DX DX – 1 WR Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 SSPCON CKP Master device deasserts clock Master device asserts clock PIC18F2420/2520/4420/4520 DS39631B-page 182 Preliminary © 2007 Microchip Technology Inc. FIGURE 17-13: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 7-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 P A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D1 D0 R/W = 0 Receiving Data ACK Receiving Data ACK ACK Receiving Address Cleared in software SSPBUF is read Bus master terminates transfer SSPOV is set because SSPBUF is still full. ACK is not sent. D2 6 (PIR1<3>) CKP CKP written to ‘1’ in If BF is cleared prior to the falling edge of the 9th clock, CKP will not be reset to ‘0’ and no clock stretching will occur software Clock is held low until CKP is set to ‘1’ Clock is not held low because buffer full bit is clear prior to falling edge of 9th clock Clock is not held low because ACK = 1 BF is set after falling edge of the 9th clock, CKP is reset to ‘0’ and clock stretching occurs © 2007 Microchip Technology Inc. Preliminary DS39631B-page 183 PIC18F2420/2520/4420/4520 FIGURE 17-14: I2C™ SLAVE MODE TIMING WITH SEN = 1 (RECEPTION, 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) S 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 7 8 9 P 1 1 1 1 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte ACK R/W = 0 ACK Receive First Byte of Address Cleared in software D2 6 (PIR1<3>) Cleared in software Receive Second Byte of Address Cleared by hardware when SSPADD is updated with low byte of address after falling edge UA (SSPSTAT<1>) Clock is held low until update of SSPADD has taken place UA is set indicating that the SSPADD needs to be updated UA is set indicating that SSPADD needs to be updated Cleared by hardware when SSPADD is updated with high byte of address after falling edge SSPBUF is written with contents of SSPSR Dummy read of SSPBUF to clear BF flag ACK CKP 1 2 3 4 5 7 8 9 D7 D6 D5 D4 D3 D1 D0 Receive Data Byte Bus master terminates transfer D2 6 ACK Cleared in software Cleared in software SSPOV (SSPCON1<6>) CKP written to ‘1’ Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. Note: An update of the SSPADD register before the falling edge of the ninth clock will have no effect on UA and UA will remain set. in software Clock is held low until update of SSPADD has taken place of ninth clock of ninth clock SSPOV is set because SSPBUF is still full. ACK is not sent. Dummy read of SSPBUF to clear BF flag Clock is held low until CKP is set to ‘1’ Clock is not held low because ACK = 1 PIC18F2420/2520/4420/4520 DS39631B-page 184 Preliminary © 2007 Microchip Technology Inc. 17.4.5 GENERAL CALL ADDRESS SUPPORT The addressing procedure for the I2C bus is such that the first byte after the Start condition usually determines which device will be the slave addressed by the master. The exception is the general call address which can address all devices. When this address is used, all devices should, in theory, respond with an Acknowledge. The general call address is one of eight addresses reserved for specific purposes by the I2C protocol. It consists of all ‘0’s with R/W = 0. The general call address is recognized when the General Call Enable bit, GCEN, is enabled (SSPCON2<7> is set). Following a Start bit detect, 8 bits are shifted into the SSPSR and the address is compared against the SSPADD. It is also compared to the general call address and fixed in hardware. If the general call address matches, the SSPSR is transferred to the SSPBUF, the BF flag bit is set (eighth bit) and on the falling edge of the ninth bit (ACK bit), the SSPIF interrupt flag bit is set. When the interrupt is serviced, the source for the interrupt can be checked by reading the contents of the SSPBUF. The value can be used to determine if the address was device specific or a general call address. In 10-bit mode, the SSPADD is required to be updated for the second half of the address to match and the UA bit is set (SSPSTAT<1>). If the general call address is sampled when the GCEN bit is set, while the slave is configured in 10-bit Address mode, then the second half of the address is not necessary, the UA bit will not be set and the slave will begin receiving data after the Acknowledge (Figure 17-15). FIGURE 17-15: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE (7 OR 10-BIT ADDRESS MODE) SDA SCL S SSPIF BF (SSPSTAT<0>) SSPOV (SSPCON1<6>) Cleared in software SSPBUF is read R/W = 0 General Call Address ACK Address is compared to General Call Address GCEN (SSPCON2<7>) Receiving Data ACK 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 after ACK, set interrupt ‘0’ ‘1’ © 2007 Microchip Technology Inc. Preliminary DS39631B-page 185 PIC18F2420/2520/4420/4520 17.4.6 MASTER MODE Master mode is enabled by setting and clearing the appropriate SSPM bits in SSPCON1 and by setting the SSPEN bit. In Master mode, the SCL and SDA lines are manipulated by the MSSP hardware. Master mode of operation is supported by interrupt generation on the detection of the Start and Stop conditions. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit is set, or the bus is Idle, with both the S and P bits clear. In Firmware Controlled Master mode, user code conducts all I2C bus operations based on Start and Stop bit conditions. Once Master mode is enabled, the user has six options. 1. Assert a Start condition on SDA and SCL. 2. Assert a Repeated Start condition on SDA and SCL. 3. Write to the SSPBUF register initiating transmission of data/address. 4. Configure the I2C port to receive data. 5. Generate an Acknowledge condition at the end of a received byte of data. 6. Generate a Stop condition on SDA and SCL. The following events will cause the SSP Interrupt Flag bit, SSPIF, to be set (SSP interrupt, if enabled): • Start condition • Stop condition • Data transfer byte transmitted/received • Acknowledge transmit • Repeated Start FIGURE 17-16: MSSP BLOCK DIAGRAM (I2C MASTER MODE) Note: The MSSP module, when configured in I2C Master mode, does not allow queueing of events. For instance, the user is not allowed to initiate a Start condition and immediately write the SSPBUF register to initiate transmission before the Start condition is complete. In this case, the SSPBUF will not be written to and the WCOL bit will be set, indicating that a write to the SSPBUF did not occur. Read Write SSPSR Start bit, Stop bit, SSPBUF Internal Data Bus Set/Reset, S, P, WCOL (SSPSTAT) Shift Clock MSb LSb SDA Acknowledge Generate Stop bit Detect Write Collision Detect Clock Arbitration State Counter for end of XMIT/RCV SCL SCL In Bus Collision SDA In Receive Enable Clock Cntl Clock Arbitrate/WCOL Detect (hold off clock source) SSPADD<6:0> Baud Set SSPIF, BCLIF Reset ACKSTAT, PEN (SSPCON2) Rate Generator SSPM3:SSPM0 Start bit Detect PIC18F2420/2520/4420/4520 DS39631B-page 186 Preliminary © 2007 Microchip Technology Inc. 17.4.6.1 I2C Master Mode Operation The master device generates all of the serial clock pulses and the Start and Stop conditions. A transfer is ended with a Stop condition or with a Repeated Start condition. Since the Repeated Start condition is also the beginning of the next serial transfer, the I2C bus will not be released. In Master Transmitter mode, serial data is output through SDA, while SCL outputs the serial clock. The first byte transmitted contains the slave address of the receiving device (7 bits) and the Read/Write (R/W) bit. In this case, the R/W bit will be logic ‘0’. Serial data is transmitted 8 bits at a time. After each byte is transmitted, an Acknowledge bit is received. Start and Stop conditions are output to indicate the beginning and the end of a serial transfer. In Master Receive mode, the first byte transmitted contains the slave address of the transmitting device (7 bits) and the R/W bit. In this case, the R/W bit will be logic ‘1’. Thus, the first byte transmitted is a 7-bit slave address followed by a ‘1’ to indicate the receive bit. Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an Acknowledge bit is transmitted. Start and Stop conditions indicate the beginning and end of transmission. The Baud Rate Generator used for the SPI mode operation is used to set the SCL clock frequency for either 100 kHz, 400 kHz or 1 MHz I2C operation. See Section 17.4.7 “Baud Rate” for more detail. A typical transmit sequence would go as follows: 1. The user generates a Start condition by setting the Start Enable bit, SEN (SSPCON2<0>). 2. SSPIF is set. The MSSP module will wait the required start time before any other operation takes place. 3. The user loads the SSPBUF with the slave address to transmit. 4. Address is shifted out the SDA pin until all 8 bits are transmitted. 5. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 6. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 7. The user loads the SSPBUF with eight bits of data. 8. Data is shifted out the SDA pin until all 8 bits are transmitted. 9. The MSSP module shifts in the ACK bit from the slave device and writes its value into the SSPCON2 register (SSPCON2<6>). 10. The MSSP module generates an interrupt at the end of the ninth clock cycle by setting the SSPIF bit. 11. The user generates a Stop condition by setting the Stop Enable bit, PEN (SSPCON2<2>). 12. Interrupt is generated once the Stop condition is complete. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 187 PIC18F2420/2520/4420/4520 17.4.7 BAUD RATE In I2C Master mode, the Baud Rate Generator (BRG) reload value is placed in the lower 7 bits of the SSPADD register (Figure 17-17). When a write occurs to SSPBUF, the Baud Rate Generator will automatically begin counting. The BRG counts down to ‘0’ and stops until another reload has taken place. The BRG count is decremented twice per instruction cycle (TCY) on the Q2 and Q4 clocks. In I2C Master mode, the BRG is reloaded automatically. Once the given operation is complete (i.e., transmission of the last data bit is followed by ACK), the internal clock will automatically stop counting and the SCL pin will remain in its last state. Table 17-3 demonstrates clock rates based on instruction cycles and the BRG value loaded into SSPADD. FIGURE 17-17: BAUD RATE GENERATOR BLOCK DIAGRAM TABLE 17-3: I2C CLOCK RATE W/BRG SSPM3:SSPM0 CLKO BRG Down Counter FOSC/4 SSPADD<6:0> SSPM3:SSPM0 SCL Reload Control Reload FCY FCY*2 BRG Value FSCL (2 Rollovers of BRG) 10 MHz 20 MHz 18h 400 kHz(1) 10 MHz 20 MHz 1Fh 312.5 kHz 10 MHz 20 MHz 63h 100 kHz 4 MHz 8 MHz 09h 400 kHz(1) 4 MHz 8 MHz 0Ch 308 kHz 4 MHz 8 MHz 27h 100 kHz 1 MHz 2 MHz 02h 333 kHz(1) 1 MHz 2 MHz 09h 100 kHz 1 MHz 2 MHz 00h 1 MHz(1) Note 1: The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than 100 kHz) in all details, but may be used with care where higher rates are required by the application. PIC18F2420/2520/4420/4520 DS39631B-page 188 Preliminary © 2007 Microchip Technology Inc. 17.4.7.1 Clock Arbitration Clock arbitration occurs when the master, during any receive, transmit or Repeated Start/Stop condition, deasserts the SCL pin (SCL allowed to float high). When the SCL pin is allowed to float high, the Baud Rate Generator (BRG) is suspended from counting until the SCL pin is actually sampled high. When the SCL pin is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. This ensures that the SCL high time will always be at least one BRG rollover count in the event that the clock is held low by an external device (Figure 17-18). FIGURE 17-18: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION SDA SCL SCL deasserted but slave holds DX DX – 1 BRG SCL is sampled high, reload takes place and BRG starts its count 03h 02h 01h 00h (hold off) 03h 02h Reload BRG Value SCL low (clock arbitration) SCL allowed to transition high BRG decrements on Q2 and Q4 cycles © 2007 Microchip Technology Inc. Preliminary DS39631B-page 189 PIC18F2420/2520/4420/4520 17.4.8 I2C MASTER MODE START CONDITION TIMING To initiate a Start condition, the user sets the Start Enable bit, SEN (SSPCON2<0>). If the SDA and SCL pins are sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and starts its count. If SCL and SDA are both sampled high when the Baud Rate Generator times out (TBRG), the SDA pin is driven low. The action of the SDA being driven low while SCL is high is the Start condition and causes the S bit (SSPSTAT<3>) to be set. Following this, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and resumes its count. When the Baud Rate Generator times out (TBRG), the SEN bit (SSPCON2<0>) will be automatically cleared by hardware; the Baud Rate Generator is suspended, leaving the SDA line held low and the Start condition is complete. 17.4.8.1 WCOL Status Flag If the user writes the SSPBUF when a Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-19: FIRST START BIT TIMING Note: If at the beginning of the Start condition, the SDA and SCL pins are already sampled low, or if during the Start condition, the SCL line is sampled low before the SDA line is driven low, a bus collision occurs, the Bus Collision Interrupt Flag, BCLIF, is set, the Start condition is aborted and the I2C module is reset into its Idle state. Note: Because queueing of events is not allowed, writing to the lower 5 bits of SSPCON2 is disabled until the Start condition is complete. SDA SCL S TBRG 1st bit 2nd bit TBRG SDA = 1, SCL = At completion of Start bit, 1 TBRG Write to SSPBUF occurs here hardware clears SEN bit TBRG Write to SEN bit occurs here Set S bit (SSPSTAT<3>) and sets SSPIF bit PIC18F2420/2520/4420/4520 DS39631B-page 190 Preliminary © 2007 Microchip Technology Inc. 17.4.9 I2C MASTER MODE REPEATED START CONDITION TIMING A Repeated Start condition occurs when the RSEN bit (SSPCON2<1>) is programmed high and the I2C logic module is in the Idle state. When the RSEN bit is set, the SCL pin is asserted low. When the SCL pin is sampled low, the Baud Rate Generator is loaded with the contents of SSPADD<5:0> and begins counting. The SDA pin is released (brought high) for one Baud Rate Generator count (TBRG). When the Baud Rate Generator times out, if SDA is sampled high, the SCL pin will be deasserted (brought high). When SCL is sampled high, the Baud Rate Generator is reloaded with the contents of SSPADD<6:0> and begins counting. SDA and SCL must be sampled high for one TBRG. This action is then followed by assertion of the SDA pin (SDA = 0) for one TBRG while SCL is high. Following this, the RSEN bit (SSPCON2<1>) will be automatically cleared and the Baud Rate Generator will not be reloaded, leaving the SDA pin held low. As soon as a Start condition is detected on the SDA and SCL pins, the S bit (SSPSTAT<3>) will be set. The SSPIF bit will not be set until the Baud Rate Generator has timed out. Immediately following the SSPIF bit getting set, the user may write the SSPBUF with the 7-bit address in 7-bit mode or the default first address in 10-bit mode. After the first eight bits are transmitted and an ACK is received, the user may then transmit an additional eight bits of address (10-bit mode) or eight bits of data (7-bit mode). 17.4.9.1 WCOL Status Flag If the user writes the SSPBUF when a Repeated Start sequence is in progress, the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-20: REPEAT START CONDITION WAVEFORM Note 1: If RSEN is programmed while any other event is in progress, it will not take effect. 2: A bus collision during the Repeated Start condition occurs if: • SDA is sampled low when SCL goes from low-to-high. • SCL goes low before SDA is asserted low. This may indicate that another master is attempting to transmit a data ‘1’. Note: Because queueing of events is not allowed, writing of the lower 5 bits of SSPCON2 is disabled until the Repeated Start condition is complete. SDA SCL Sr = Repeated Start Write to SSPCON2 on falling edge of ninth clock, Write to SSPBUF occurs here end of Xmit At completion of Start bit, hardware clears RSEN bit 1st bit S bit set by hardware TBRG TBRG SDA = 1, SDA = 1, SCL (no change). SCL = 1 occurs here. TBRG TBRG TBRG and sets SSPIF RSEN bit set by hardware © 2007 Microchip Technology Inc. Preliminary DS39631B-page 191 PIC18F2420/2520/4420/4520 17.4.10 I2C MASTER MODE TRANSMISSION Transmission of a data byte, a 7-bit address or the other half of a 10-bit address is accomplished by simply writing a value to the SSPBUF register. This action will set the Buffer Full flag bit, BF and allow the Baud Rate Generator to begin counting and start the next transmission. Each bit of address/data will be shifted out onto the SDA pin after the falling edge of SCL is asserted (see data hold time specification parameter 106). SCL is held low for one Baud Rate Generator rollover count (TBRG). Data should be valid before SCL is released high (see data setup time specification parameter 107). When the SCL pin is released high, it is held that way for TBRG. The data on the SDA pin must remain stable for that duration and some hold time after the next falling edge of SCL. After the eighth bit is shifted out (the falling edge of the eighth clock), the BF flag is cleared and the master releases SDA. This allows the slave device being addressed to respond with an ACK bit during the ninth bit time if an address match occurred, or if data was received properly. The status of ACK is written into the ACKDT bit on the falling edge of the ninth clock. If the master receives an Acknowledge, the Acknowledge Status bit, ACKSTAT, is cleared. If not, the bit is set. After the ninth clock, the SSPIF bit is set and the master clock (Baud Rate Generator) is suspended until the next data byte is loaded into the SSPBUF, leaving SCL low and SDA unchanged (Figure 17-21). After the write to the SSPBUF, each bit of the address will be shifted out on the falling edge of SCL until all seven address bits and the R/W bit are completed. On the falling edge of the eighth clock, the master will deassert the SDA pin, allowing the slave to respond with an Acknowledge. On the falling edge of the ninth clock, the master will sample the SDA pin to see if the address was recognized by a slave. The status of the ACK bit is loaded into the ACKSTAT status bit (SSPCON2<6>). Following the falling edge of the ninth clock transmission of the address, the SSPIF is set, the BF flag is cleared and the Baud Rate Generator is turned off until another write to the SSPBUF takes place, holding SCL low and allowing SDA to float. 17.4.10.1 BF Status Flag In Transmit mode, the BF bit (SSPSTAT<0>) is set when the CPU writes to SSPBUF and is cleared when all 8 bits are shifted out. 17.4.10.2 WCOL Status Flag If the user writes the SSPBUF when a transmit is already in progress (i.e., SSPSR is still shifting out a data byte), the WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). WCOL must be cleared in software. 17.4.10.3 ACKSTAT Status Flag In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is cleared when the slave has sent an Acknowledge (ACK = 0) and is set when the slave does not Acknowledge (ACK = 1). A slave sends an Acknowledge when it has recognized its address (including a general call), or when the slave has properly received its data. 17.4.11 I2C MASTER MODE RECEPTION Master mode reception is enabled by programming the Receive Enable bit, RCEN (SSPCON2<3>). The Baud Rate Generator begins counting and on each rollover, the state of the SCL pin changes (high-to-low/ low-to-high) and data is shifted into the SSPSR. After the falling edge of the eighth clock, the receive enable flag is automatically cleared, the contents of the SSPSR are loaded into the SSPBUF, the BF flag bit is set, the SSPIF flag bit is set and the Baud Rate Generator is suspended from counting, holding SCL low. The MSSP is now in Idle state awaiting the next command. When the buffer is read by the CPU, the BF flag bit is automatically cleared. The user can then send an Acknowledge bit at the end of reception by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). 17.4.11.1 BF Status Flag In receive operation, the BF bit is set when an address or data byte is loaded into SSPBUF from SSPSR. It is cleared when the SSPBUF register is read. 17.4.11.2 SSPOV Status Flag In receive operation, the SSPOV bit is set when 8 bits are received into the SSPSR and the BF flag bit is already set from a previous reception. 17.4.11.3 WCOL Status Flag If the user writes the SSPBUF when a receive is already in progress (i.e., SSPSR is still shifting in a data byte), the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). Note: The MSSP module must be in an Idle state before the RCEN bit is set or the RCEN bit will be disregarded. PIC18F2420/2520/4420/4520 DS39631B-page 192 Preliminary © 2007 Microchip Technology Inc. FIGURE 17-21: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS) SDA SCL SSPIF BF (SSPSTAT<0>) SEN A7 A6 A5 A4 A3 A2 A1 ACK = ‘0’ D7 D6 D5 D4 D3 D2 D1 D0 ACK Transmitting Data or Second Half Transmit Address to Slave R/W = 0 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 P Cleared in software service routine SSPBUF is written in software from SSP interrupt After Start condition, SEN cleared by hardware S SSPBUF written with 7-bit address and R/W start transmit SCL held low while CPU responds to SSPIF SEN = 0 of 10-bit Address Write SSPCON2<0> SEN = 1 Start condition begins From slave, clear ACKSTAT bit SSPCON2<6> ACKSTAT in SSPCON2 = 1 Cleared in software SSPBUF written PEN R/W Cleared in software © 2007 Microchip Technology Inc. Preliminary DS39631B-page 193 PIC18F2420/2520/4420/4520 FIGURE 17-22: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS) P 5 6 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 S SDA A7 A6 A5 A4 A3 A2 A1 SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 Bus master terminates transfer ACK Receiving Data from Slave Receiving Data from Slave ACK D7 D6 D5 D4 D3 D2 D1 D0 Transmit Address to Slave R/W = 0 SSPIF BF ACK is not sent Write to SSPCON2<0> (SEN = 1), Write to SSPBUF occurs here, ACK from Slave Master configured as a receiver by programming SSPCON2<3> (RCEN = 1) PEN bit = 1 written here Data shifted in on falling edge of CLK Cleared in software start XMIT SEN = 0 SSPOV SDA = 0, SCL = 1 while CPU (SSPSTAT<0>) ACK Cleared in software Cleared in software Set SSPIF interrupt at end of receive Set P bit (SSPSTAT<4>) and SSPIF Cleared in software ACK from Master Set SSPIF at end Set SSPIF interrupt at end of Acknowledge sequence Set SSPIF interrupt at end of Acknowledge sequence of receive Set ACKEN, start Acknowledge sequence SSPOV is set because SSPBUF is still full SDA = ACKDT = 1 RCEN cleared automatically RCEN = 1, start next receive Write to SSPCON2<4> to start Acknowledge sequence SDA = ACKDT (SSPCON2<5>) = 0 RCEN cleared automatically responds to SSPIF ACKEN begin Start condition Cleared in software SDA = ACKDT = 0 Last bit is shifted into SSPSR and contents are unloaded into SSPBUF PIC18F2420/2520/4420/4520 DS39631B-page 194 Preliminary © 2007 Microchip Technology Inc. 17.4.12 ACKNOWLEDGE SEQUENCE TIMING An Acknowledge sequence is enabled by setting the Acknowledge Sequence Enable bit, ACKEN (SSPCON2<4>). When this bit is set, the SCL pin is pulled low and the contents of the Acknowledge data bit are presented on the SDA pin. If the user wishes to generate an Acknowledge, then the ACKDT bit should be cleared. If not, the user should set the ACKDT bit before starting an Acknowledge sequence. The Baud Rate Generator then counts for one rollover period (TBRG) and the SCL pin is deasserted (pulled high). When the SCL pin is sampled high (clock arbitration), the Baud Rate Generator counts for TBRG. The SCL pin is then pulled low. Following this, the ACKEN bit is automatically cleared, the Baud Rate Generator is turned off and the MSSP module then goes into Idle mode (Figure 17-23). 17.4.12.1 WCOL Status Flag If the user writes the SSPBUF when an Acknowledge sequence is in progress, then WCOL is set and the contents of the buffer are unchanged (the write doesn’t occur). 17.4.13 STOP CONDITION TIMING A Stop bit is asserted on the SDA pin at the end of a receive/transmit by setting the Stop Sequence Enable bit, PEN (SSPCON2<2>). At the end of a receive/ transmit, the SCL line is held low after the falling edge of the ninth clock. When the PEN bit is set, the master will assert the SDA line low. When the SDA line is sampled low, the Baud Rate Generator is reloaded and counts down to ‘0’. When the Baud Rate Generator times out, the SCL pin will be brought high and one TBRG (Baud Rate Generator rollover count) later, the SDA pin will be deasserted. When the SDA pin is sampled high while SCL is high, the P bit (SSPSTAT<4>) is set. A TBRG later, the PEN bit is cleared and the SSPIF bit is set (Figure 17-24). 17.4.13.1 WCOL Status Flag If the user writes the SSPBUF when a Stop sequence is in progress, then the WCOL bit is set and the contents of the buffer are unchanged (the write doesn’t occur). FIGURE 17-23: ACKNOWLEDGE SEQUENCE WAVEFORM FIGURE 17-24: STOP CONDITION RECEIVE OR TRANSMIT MODE Note: TBRG = one Baud Rate Generator period. SDA SCL SSPIF set at Acknowledge sequence starts here, write to SSPCON2 ACKEN automatically cleared Cleared in TBRG TBRG the end of receive 8 ACKEN = 1, ACKDT = 0 D0 9 SSPIF software SSPIF set at the end of Acknowledge sequence Cleared in software ACK SCL SDA SDA asserted low before rising edge of clock Write to SSPCON2, set PEN Falling edge of SCL = 1 for TBRG, followed by SDA = 1 for TBRG 9th clock SCL brought high after TBRG Note: TBRG = one Baud Rate Generator period. TBRG TBRG after SDA sampled high. P bit (SSPSTAT<4>) is set. TBRG to setup Stop condition ACK P TBRG PEN bit (SSPCON2<2>) is cleared by hardware and the SSPIF bit is set © 2007 Microchip Technology Inc. Preliminary DS39631B-page 195 PIC18F2420/2520/4420/4520 17.4.14 SLEEP OPERATION While in Sleep mode, the I2C module can receive addresses or data and when an address match or complete byte transfer occurs, wake the processor from Sleep (if the MSSP interrupt is enabled). 17.4.15 EFFECTS OF A RESET A Reset disables the MSSP module and terminates the current transfer. 17.4.16 MULTI-MASTER MODE In Multi-Master mode, the interrupt generation on the detection of the Start and Stop conditions allows the determination of when the bus is free. The Stop (P) and Start (S) bits are cleared from a Reset or when the MSSP module is disabled. Control of the I2C bus may be taken when the P bit (SSPSTAT<4>) is set, or the bus is Idle, with both the S and P bits clear. When the bus is busy, enabling the SSP interrupt will generate the interrupt when the Stop condition occurs. In multi-master operation, the SDA line must be monitored for arbitration to see if the signal level is the expected output level. This check is performed in hardware with the result placed in the BCLIF bit. The states where arbitration can be lost are: • Address Transfer • Data Transfer • A Start Condition • A Repeated Start Condition • An Acknowledge Condition 17.4.17 MULTI -MASTER COMMUNICATION, BUS COLLISION AND BUS ARBITRATION Multi-Master mode support is achieved by bus arbitration. When the master outputs address/data bits onto the SDA pin, arbitration takes place when the master outputs a ‘1’ on SDA, by letting SDA float high and another master asserts a ‘0’. When the SCL pin floats high, data should be stable. If the expected data on SDA is a ‘1’ and the data sampled on the SDA pin = 0, then a bus collision has taken place. The master will set the Bus Collision Interrupt Flag, BCLIF and reset the I2C port to its Idle state (Figure 17-25). If a transmit was in progress when the bus collision occurred, the transmission is halted, the BF flag is cleared, the SDA and SCL lines are deasserted and the SSPBUF can be written to. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. If a Start, Repeated Start, Stop or Acknowledge condition was in progress when the bus collision occurred, the condition is aborted, the SDA and SCL lines are deasserted and the respective control bits in the SSPCON2 register are cleared. When the user services the bus collision Interrupt Service Routine and if the I2C bus is free, the user can resume communication by asserting a Start condition. The master will continue to monitor the SDA and SCL pins. If a Stop condition occurs, the SSPIF bit will be set. A write to the SSPBUF will start the transmission of data at the first data bit, regardless of where the transmitter left off when the bus collision occurred. In Multi-Master mode, the interrupt generation on the detection of Start and Stop conditions allows the determination of when the bus is free. Control of the I2C bus can be taken when the P bit is set in the SSPSTAT register, or the bus is Idle and the S and P bits are cleared. FIGURE 17-25: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE SDA SCL BCLIF SDA released SDA line pulled low by another source Sample SDA. While SCL is high, data doesn’t match what is driven Bus collision has occurred. Set bus collision interrupt (BCLIF) by the master. by master Data changes while SCL = 0 PIC18F2420/2520/4420/4520 DS39631B-page 196 Preliminary © 2007 Microchip Technology Inc. 17.4.17.1 Bus Collision During a Start Condition During a Start condition, a bus collision occurs if: a) SDA or SCL are sampled low at the beginning of the Start condition (Figure 17-26). b) SCL is sampled low before SDA is asserted low (Figure 17-27). During a Start condition, both the SDA and the SCL pins are monitored. If the SDA pin is already low, or the SCL pin is already low, then all of the following occur: • the Start condition is aborted, • the BCLIF flag is set and • the MSSP module is reset to its Idle state (Figure 17-26). The Start condition begins with the SDA and SCL pins deasserted. When the SDA pin is sampled high, the Baud Rate Generator is loaded from SSPADD<6:0> and counts down to 0. If the SCL pin is sampled low while SDA is high, a bus collision occurs because it is assumed that another master is attempting to drive a data ‘1’ during the Start condition. If the SDA pin is sampled low during this count, the BRG is reset and the SDA line is asserted early (Figure 17-28). If, however, a ‘1’ is sampled on the SDA pin, the SDA pin is asserted low at the end of the BRG count. The Baud Rate Generator is then reloaded and counts down to 0; if the SCL pin is sampled as ‘0’ during this time, a bus collision does not occur. At the end of the BRG count, the SCL pin is asserted low. FIGURE 17-26: BUS COLLISION DURING START CONDITION (SDA ONLY) Note: The reason that bus collision is not a factor during a Start condition is that no two bus masters can assert a Start condition at the exact same time. Therefore, one master will always assert SDA before the other. This condition does not cause a bus collision because the two masters must be allowed to arbitrate the first address following the Start condition. If the address is the same, arbitration must be allowed to continue into the data portion, Repeated Start or Stop conditions. SDA SCL SEN SDA sampled low before SDA goes low before the SEN bit is set. S bit and SSPIF set because SSP module reset into Idle state. SEN cleared automatically because of bus collision. S bit and SSPIF set because Set SEN, enable Start condition if SDA = 1, SCL = 1 SDA = 0, SCL = 1. BCLIF S SSPIF SDA = 0, SCL = 1. SSPIF and BCLIF are cleared in software SSPIF and BCLIF are cleared in software Set BCLIF, Start condition. Set BCLIF. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 197 PIC18F2420/2520/4420/4520 FIGURE 17-27: BUS COLLISION DURING START CONDITION (SCL = 0) FIGURE 17-28: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION SDA SCL SEN bus collision occurs. Set BCLIF. SCL = 0 before SDA = 0, Set SEN, enable Start sequence if SDA = 1, SCL = 1 TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF Interrupt cleared in software bus collision occurs. Set BCLIF. SCL = 0 before BRG time-out, ‘0’ ‘0’ ‘0’ ‘0’ SDA SCL SEN Set S Less than TBRG TBRG SDA = 0, SCL = 1 BCLIF S SSPIF S Interrupts cleared set SSPIF in software SDA = 0, SCL = 1, SCL pulled low after BRG time-out Set SSPIF ‘0’ SDA pulled low by other master. Reset BRG and assert SDA. Set SEN, enable START sequence if SDA = 1, SCL = 1 PIC18F2420/2520/4420/4520 DS39631B-page 198 Preliminary © 2007 Microchip Technology Inc. 17.4.17.2 Bus Collision During a Repeated Start Condition During a Repeated Start condition, a bus collision occurs if: a) A low level is sampled on SDA when SCL goes from low level to high level. b) SCL goes low before SDA is asserted low, indicating that another master is attempting to transmit a data ‘1’. When the user deasserts SDA and the pin is allowed to float high, the BRG is loaded with SSPADD<6:0> and counts down to 0. The SCL pin is then deasserted and when sampled high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e., another master is attempting to transmit a data ‘0’, Figure 17-29). If SDA is sampled high, the BRG is reloaded and begins counting. If SDA goes from high-to-low before the BRG times out, no bus collision occurs because no two masters can assert SDA at exactly the same time. If SCL goes from high-to-low before the BRG times out and SDA has not already been asserted, a bus collision occurs. In this case, another master is attempting to transmit a data ‘1’ during the Repeated Start condition, see Figure 17-30. If, at the end of the BRG time-out, both SCL and SDA are still high, the SDA pin is driven low and the BRG is reloaded and begins counting. At the end of the count, regardless of the status of the SCL pin, the SCL pin is driven low and the Repeated Start condition is complete. FIGURE 17-29: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1) FIGURE 17-30: BUS COLLISION DURING REPEATED START CONDITION (CASE 2) SDA SCL RSEN BCLIF S SSPIF Sample SDA when SCL goes high. If SDA = 0, set BCLIF and release SDA and SCL. Cleared in software ‘0’ ‘0’ SDA SCL BCLIF RSEN S SSPIF Interrupt cleared in software SCL goes low before SDA, set BCLIF. Release SDA and SCL. TBRG TBRG ‘0’ © 2007 Microchip Technology Inc. Preliminary DS39631B-page 199 PIC18F2420/2520/4420/4520 17.4.17.3 Bus Collision During a Stop Condition Bus collision occurs during a Stop condition if: a) After the SDA pin has been deasserted and allowed to float high, SDA is sampled low after the BRG has timed out. b) After the SCL pin is deasserted, SCL is sampled low before SDA goes high. The Stop condition begins with SDA asserted low. When SDA is sampled low, the SCL pin is allowed to float. When the pin is sampled high (clock arbitration), the Baud Rate Generator is loaded with SSPADD<6:0> and counts down to 0. After the BRG times out, SDA is sampled. If SDA is sampled low, a bus collision has occurred. This is due to another master attempting to drive a data ‘0’ (Figure 17-31). If the SCL pin is sampled low before SDA is allowed to float high, a bus collision occurs. This is another case of another master attempting to drive a data ‘0’ (Figure 17-32). FIGURE 17-31: BUS COLLISION DURING A STOP CONDITION (CASE 1) FIGURE 17-32: BUS COLLISION DURING A STOP CONDITION (CASE 2) SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG SDA asserted low SDA sampled low after TBRG, set BCLIF ‘0’ ‘0’ SDA SCL BCLIF PEN P SSPIF TBRG TBRG TBRG Assert SDA SCL goes low before SDA goes high, set BCLIF ‘0’ ‘0’ PIC18F2420/2520/4420/4520 DS39631B-page 200 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 201 PIC18F2420/2520/4420/4520 18.0 ENHANCED UNIVERSAL SYNCHRONOUS RECEIVER TRANSMITTER (EUSART) The Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) module is one of the two serial I/O modules. (Generically, the USART is also known as a Serial Communications Interface or SCI.) The EUSART can be configured as a full-duplex asynchronous system that can communicate with peripheral devices, such as CRT terminals and personal computers. It can also be configured as a halfduplex synchronous system that can communicate with peripheral devices, such as A/D or D/A integrated circuits, serial EEPROMs, etc. The Enhanced USART module implements additional features, including automatic baud rate detection and calibration, automatic wake-up on Sync Break reception and 12-bit Break character transmit. These make it ideally suited for use in Local Interconnect Network bus (LIN bus) systems. The EUSART can be configured in the following modes: • Asynchronous (full duplex) with: - Auto-wake-up on character reception - Auto-baud calibration - 12-bit Break character transmission • Synchronous – Master (half duplex) with selectable clock polarity • Synchronous – Slave (half duplex) with selectable clock polarity The pins of the Enhanced USART are multiplexed with PORTC. In order to configure RC6/TX/CK and RC7/RX/DT as a USART: • bit SPEN (RCSTA<7>) must be set (= 1) • bit TRISC<7> must be set (= 1) • bit TRISC<6> must be set (= 1) The operation of the Enhanced USART module is controlled through three registers: • Transmit Status and Control (TXSTA) • Receive Status and Control (RCSTA) • Baud Rate Control (BAUDCON) These are detailed on the following pages in Register 18-1, Register 18-2 and Register 18-3, respectively. Note: The EUSART control will automatically reconfigure the pin from input to output as needed. PIC18F2420/2520/4420/4520 DS39631B-page 202 Preliminary © 2007 Microchip Technology Inc. REGISTER 18-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-1 R/W-0 CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D bit 7 bit 0 bit 7 CSRC: Clock Source Select bit Asynchronous mode: Don’t care. Synchronous mode: 1 = Master mode (clock generated internally from BRG) 0 = Slave mode (clock from external source) bit 6 TX9: 9-bit Transmit Enable bit 1 = Selects 9-bit transmission 0 = Selects 8-bit transmission bit 5 TXEN: Transmit Enable bit 1 = Transmit enabled 0 = Transmit disabled Note: SREN/CREN overrides TXEN in Sync mode. bit 4 SYNC: EUSART Mode Select bit 1 = Synchronous mode 0 = Asynchronous mode bit 3 SENDB: Send Break Character bit Asynchronous mode: 1 = Send Sync Break on next transmission (cleared by hardware upon completion) 0 = Sync Break transmission completed Synchronous mode: Don’t care. bit 2 BRGH: High Baud Rate Select bit Asynchronous mode: 1 = High speed 0 = Low speed Synchronous mode: Unused in this mode. bit 1 TRMT: Transmit Shift Register Status bit 1 = TSR empty 0 = TSR full bit 0 TX9D: 9th bit of Transmit Data Can be address/data bit or a parity bit. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 203 PIC18F2420/2520/4420/4520 REGISTER 18-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-x SPEN RX9 SREN CREN ADDEN FERR OERR RX9D bit 7 bit 0 bit 7 SPEN: Serial Port Enable bit 1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins) 0 = Serial port disabled (held in Reset) bit 6 RX9: 9-bit Receive Enable bit 1 = Selects 9-bit reception 0 = Selects 8-bit reception bit 5 SREN: Single Receive Enable bit Asynchronous mode: Don’t care. Synchronous mode – Master: 1 = Enables single receive 0 = Disables single receive This bit is cleared after reception is complete. Synchronous mode – Slave: Don’t care. bit 4 CREN: Continuous Receive Enable bit Asynchronous mode: 1 = Enables receiver 0 = Disables receiver Synchronous mode: 1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN) 0 = Disables continuous receive bit 3 ADDEN: Address Detect Enable bit Asynchronous mode 9-bit (RX9 = 1): 1 = Enables address detection, enables interrupt and loads the receive buffer when RSR<8> is set 0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit Asynchronous mode 9-bit (RX9 = 0): Don’t care. bit 2 FERR: Framing Error bit 1 = Framing error (can be updated by reading RCREG register and receiving next valid byte) 0 = No framing error bit 1 OERR: Overrun Error bit 1 = Overrun error (can be cleared by clearing bit CREN) 0 = No overrun error bit 0 RX9D: 9th bit of Received Data This can be address/data bit or a parity bit and must be calculated by user firmware. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 204 Preliminary © 2007 Microchip Technology Inc. REGISTER 18-3: BAUDCON: BAUD RATE CONTROL REGISTER R/W-0 R-1 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN bit 7 bit 0 bit 7 ABDOVF: Auto-Baud Acquisition Rollover Status bit 1 = A BRG rollover has occurred during Auto-Baud Rate Detect mode (must be cleared in software) 0 = No BRG rollover has occurred bit 6 RCIDL: Receive Operation Idle Status bit 1 = Receive operation is Idle 0 = Receive operation is active bit 5 Unimplemented: Read as ‘0’ bit 4 SCKP: Synchronous Clock Polarity Select bit Asynchronous mode: Unused in this mode. Synchronous mode: 1 = Idle state for clock (CK) is a high level 0 = Idle state for clock (CK) is a low level bit 3 BRG16: 16-bit Baud Rate Register Enable bit 1 = 16-bit Baud Rate Generator – SPBRGH and SPBRG 0 = 8-bit Baud Rate Generator – SPBRG only (Compatible mode), SPBRGH value ignored bit 2 Unimplemented: Read as ‘0’ bit 1 WUE: Wake-up Enable bit Asynchronous mode: 1 = EUSART will continue to sample the RX pin – interrupt generated on falling edge; bit cleared in hardware on following rising edge 0 = RX pin not monitored or rising edge detected Synchronous mode: Unused in this mode. bit 0 ABDEN: Auto-Baud Detect Enable bit Asynchronous mode: 1 = Enable baud rate measurement on the next character. Requires reception of a Sync field (55h); cleared in hardware upon completion 0 = Baud rate measurement disabled or completed Synchronous mode: Unused in this mode. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown © 2007 Microchip Technology Inc. Preliminary DS39631B-page 205 PIC18F2420/2520/4420/4520 18.1 Baud Rate Generator (BRG) The BRG is a dedicated 8-bit or 16-bit generator that supports both the Asynchronous and Synchronous modes of the EUSART. By default, the BRG operates in 8-bit mode; setting the BRG16 bit (BAUDCON<3>) selects 16-bit mode. The SPBRGH:SPBRG register pair controls the period of a free running timer. In Asynchronous mode, bits BRGH (TXSTA<2>) and BRG16 (BAUDCON<3>) also control the baud rate. In Synchronous mode, BRGH is ignored. Table 18-1 shows the formula for computation of the baud rate for different EUSART modes which only apply in Master mode (internally generated clock). Given the desired baud rate and FOSC, the nearest integer value for the SPBRGH:SPBRG registers can be calculated using the formulas in Table 18-1. From this, the error in baud rate can be determined. An example calculation is shown in Example 18-1. Typical baud rates and error values for the various Asynchronous modes are shown in Table 18-2. It may be advantageous to use the high baud rate (BRGH = 1) or the 16-bit BRG to reduce the baud rate error, or achieve a slow baud rate for a fast oscillator frequency. Writing a new value to the SPBRGH:SPBRG registers causes the BRG timer to be reset (or cleared). This ensures the BRG does not wait for a timer overflow before outputting the new baud rate. 18.1.1 OPERATION IN POWER MANAGED MODES The device clock is used to generate the desired baud rate. When one of the power managed modes is entered, the new clock source may be operating at a different frequency. This may require an adjustment to the value in the SPBRG register pair. 18.1.2 SAMPLING The data on the RX pin is sampled three times by a majority detect circuit to determine if a high or a low level is present at the RX pin. TABLE 18-1: BAUD RATE FORMULAS Configuration Bits BRG/EUSART Mode Baud Rate Formula SYNC BRG16 BRGH 0 0 0 8-bit/Asynchronous FOSC/[64 (n + 1)] 0 0 1 8-bit/Asynchronous FOSC/[16 (n + 1)] 0 1 0 16-bit/Asynchronous 0 1 1 16-bit/Asynchronous 1 0 x 8-bit/Synchronous FOSC/[4 (n + 1)] 1 1 x 16-bit/Synchronous Legend: x = Don’t care, n = value of SPBRGH:SPBRG register pair PIC18F2420/2520/4420/4520 DS39631B-page 206 Preliminary © 2007 Microchip Technology Inc. EXAMPLE 18-1: CALCULATING BAUD RATE ERROR TABLE 18-2: REGISTERS ASSOCIATED WITH BAUD RATE GENERATOR For a device with FOSC of 16 MHz, desired baud rate of 9600, Asynchronous mode, 8-bit BRG: Desired Baud Rate = FOSC/(64 ([SPBRGH:SPBRG] + 1)) Solving for SPBRGH:SPBRG: X = ((FOSC/Desired Baud Rate)/64) – 1 = ((16000000/9600)/64) – 1 = [25.042] = 25 Calculated Baud Rate = 16000000/(64 (25 + 1)) = 9615 Error = (Calculated Baud Rate – Desired Baud Rate)/Desired Baud Rate = (9615 – 9600)/9600 = 0.16% Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the BRG. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 207 PIC18F2420/2520/4420/4520 TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODES BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 — — — — — — — — — — — — 1.2 — — — 1.221 1.73 255 1.202 0.16 129 1201 -0.16 103 2.4 2.441 1.73 255 2.404 0.16 129 2.404 0.16 64 2403 -0.16 51 9.6 9.615 0.16 64 9.766 1.73 31 9.766 1.73 15 9615 -0.16 12 19.2 19.531 1.73 31 19.531 1.73 15 19.531 1.73 7 — — — 57.6 56.818 -1.36 10 62.500 8.51 4 52.083 -9.58 2 — — — 115.2 125.000 8.51 4 104.167 -9.58 2 78.125 -32.18 1 — — — BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 0 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 0.300 0.16 207 300 -0.16 103 300 -0.16 51 1.2 1.202 0.16 51 1201 -0.16 25 1201 -0.16 12 2.4 2.404 0.16 25 2403 -0.16 12 — — — 9.6 8.929 -6.99 6 — — — — — — 19.2 20.833 8.51 2 — — — — — — 57.6 62.500 8.51 0 — — — — — — 115.2 62.500 -45.75 0 — — — — — — BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 — — — — — — — — — — — — 1.2 — — — — — — — — — — — — 2.4 — — — — — — 2.441 1.73 255 2403 -0.16 207 9.6 9.766 1.73 255 9.615 0.16 129 9.615 0.16 64 9615 -0.16 51 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19230 -0.16 25 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 0 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 — — — — — — 300 -0.16 207 1.2 1.202 0.16 207 1201 -0.16 103 1201 -0.16 51 2.4 2.404 0.16 103 2403 -0.16 51 2403 -0.16 25 9.6 9.615 0.16 25 9615 -0.16 12 — — — 19.2 19.231 0.16 12 — — — — — — 57.6 62.500 8.51 3 — — — — — — 115.2 125.000 8.51 1 — — — — — — PIC18F2420/2520/4420/4520 DS39631B-page 208 Preliminary © 2007 Microchip Technology Inc. BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 0.300 0.00 8332 0.300 0.02 4165 0.300 0.02 2082 300 -0.04 1665 1.2 1.200 0.02 2082 1.200 -0.03 1041 1.200 -0.03 520 1201 -0.16 415 2.4 2.402 0.06 1040 2.399 -0.03 520 2.404 0.16 259 2403 -0.16 207 9.6 9.615 0.16 259 9.615 0.16 129 9.615 0.16 64 9615 -0.16 51 19.2 19.231 0.16 129 19.231 0.16 64 19.531 1.73 31 19230 -0.16 25 57.6 58.140 0.94 42 56.818 -1.36 21 56.818 -1.36 10 55555 3.55 8 115.2 113.636 -1.36 21 113.636 -1.36 10 125.000 8.51 4 — — — BAUD RATE (K) SYNC = 0, BRGH = 0, BRG16 = 1 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 0.300 0.04 832 300 -0.16 415 300 -0.16 207 1.2 1.202 0.16 207 1201 -0.16 103 1201 -0.16 51 2.4 2.404 0.16 103 2403 -0.16 51 2403 -0.16 25 9.6 9.615 0.16 25 9615 -0.16 12 — — — 19.2 19.231 0.16 12 — — — — — — 57.6 62.500 8.51 3 — — — — — — 115.2 125.000 8.51 1 — — — — — — BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 40.000 MHz FOSC = 20.000 MHz FOSC = 10.000 MHz FOSC = 8.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 0.300 0.00 33332 0.300 0.00 16665 0.300 0.00 8332 300 -0.01 6665 1.2 1.200 0.00 8332 1.200 0.02 4165 1.200 0.02 2082 1200 -0.04 1665 2.4 2.400 0.02 4165 2.400 0.02 2082 2.402 0.06 1040 2400 -0.04 832 9.6 9.606 0.06 1040 9.596 -0.03 520 9.615 0.16 259 9615 -0.16 207 19.2 19.193 -0.03 520 19.231 0.16 259 19.231 0.16 129 19230 -0.16 103 57.6 57.803 0.35 172 57.471 -0.22 86 58.140 0.94 42 57142 0.79 34 115.2 114.943 -0.22 86 116.279 0.94 42 113.636 -1.36 21 117647 -2.12 16 BAUD RATE (K) SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1 FOSC = 4.000 MHz FOSC = 2.000 MHz FOSC = 1.000 MHz Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) Actual Rate (K) % Error SPBRG value (decimal) 0.3 0.300 0.01 3332 300 -0.04 1665 300 -0.04 832 1.2 1.200 0.04 832 1201 -0.16 415 1201 -0.16 207 2.4 2.404 0.16 415 2403 -0.16 207 2403 -0.16 103 9.6 9.615 0.16 103 9615 -0.16 51 9615 -0.16 25 19.2 19.231 0.16 51 19230 -0.16 25 19230 -0.16 12 57.6 58.824 2.12 16 55555 3.55 8 — — — 115.2 111.111 -3.55 8 — — — — — — TABLE 18-3: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 209 PIC18F2420/2520/4420/4520 18.1.3 AUTO-BAUD RATE DETECT The enhanced USART module supports the automatic detection and calibration of baud rate. This feature is active only in Asynchronous mode and while the WUE bit is clear. The automatic baud rate measurement sequence (Figure 18-1) begins whenever a Start bit is received and the ABDEN bit is set. The calculation is self-averaging. In the Auto-Baud Rate Detect (ABD) mode, the clock to the BRG is reversed. Rather than the BRG clocking the incoming RX signal, the RX signal is timing the BRG. In ABD mode, the internal Baud Rate Generator is used as a counter to time the bit period of the incoming serial byte stream. Once the ABDEN bit is set, the state machine will clear the BRG and look for a Start bit. The Auto-Baud Rate Detect must receive a byte with the value 55h (ASCII “U”, which is also the LIN bus Sync character) in order to calculate the proper bit rate. The measurement is taken over both a low and a high bit time in order to minimize any effects caused by asymmetry of the incoming signal. After a Start bit, the SPBRG begins counting up, using the preselected clock source on the first rising edge of RX. After eight bits on the RX pin or the fifth rising edge, an accumulated value totalling the proper BRG period is left in the SPBRGH:SPBRG register pair. Once the 5th edge is seen (this should correspond to the Stop bit), the ABDEN bit is automatically cleared. If a rollover of the BRG occurs (an overflow from FFFFh to 0000h), the event is trapped by the ABDOVF status bit (BAUDCON<7>). It is set in hardware by BRG rollovers and can be set or cleared by the user in software. ABD mode remains active after rollover events and the ABDEN bit remains set (Figure 18-2). While calibrating the baud rate period, the BRG registers are clocked at 1/8th the preconfigured clock rate. Note that the BRG clock will be configured by the BRG16 and BRGH bits. Independent of the BRG16 bit setting, both the SPBRG and SPBRGH will be used as a 16-bit counter. This allows the user to verify that no carry occurred for 8-bit modes by checking for 00h in the SPBRGH register. Refer to Table 18-4 for counter clock rates to the BRG. While the ABD sequence takes place, the EUSART state machine is held in Idle. The RCIF interrupt is set once the fifth rising edge on RX is detected. The value in the RCREG needs to be read to clear the RCIF interrupt. The contents of RCREG should be discarded. TABLE 18-4: BRG COUNTER CLOCK RATES 18.1.3.1 ABD and EUSART Transmission Since the BRG clock is reversed during ABD acquisition, the EUSART transmitter cannot be used during ABD. This means that whenever the ABDEN bit is set, TXREG cannot be written to. Users should also ensure that ABDEN does not become set during a transmit sequence. Failing to do this may result in unpredictable EUSART operation. Note 1: If the WUE bit is set with the ABDEN bit, Auto-Baud Rate Detection will occur on the byte following the Break character. 2: It is up to the user to determine that the incoming character baud rate is within the range of the selected BRG clock source. Some combinations of oscillator frequency and EUSART baud rates are not possible due to bit error rates. Overall system timing and communication baud rates must be taken into consideration when using the Auto-Baud Rate Detection feature. BRG16 BRGH BRG Counter Clock 0 0 FOSC/512 0 1 FOSC/128 1 0 FOSC/128 1 1 FOSC/32 Note: During the ABD sequence, SPBRG and SPBRGH are both used as a 16-bit counter, independent of BRG16 setting. PIC18F2420/2520/4420/4520 DS39631B-page 210 Preliminary © 2007 Microchip Technology Inc. FIGURE 18-1: AUTOMATIC BAUD RATE CALCULATION FIGURE 18-2: BRG OVERFLOW SEQUENCE BRG Value RX pin ABDEN bit RCIF bit Bit 0 Bit 1 (Interrupt) Read RCREG BRG Clock Start Set by User Auto-Cleared XXXXh 0000h Edge #1 Bit 2 Bit 3 Edge #2 Bit 4 Bit 5 Edge #3 Bit 6 Bit 7 Edge #4 Stop Bit Edge #5 001Ch Note: The ABD sequence requires the EUSART module to be configured in Asynchronous mode and WUE = 0. SPBRG XXXXh 1Ch SPBRGH XXXXh 00h Start Bit 0 XXXXh 0000h 0000h FFFFh BRG Clock ABDEN bit RX pin ABDOVF bit BRG Value © 2007 Microchip Technology Inc. Preliminary DS39631B-page 211 PIC18F2420/2520/4420/4520 18.2 EUSART Asynchronous Mode The Asynchronous mode of operation is selected by clearing the SYNC bit (TXSTA<4>). In this mode, the EUSART uses standard Non-Return-to-Zero (NRZ) format (one Start bit, eight or nine data bits and one Stop bit). The most common data format is 8 bits. An on-chip dedicated 8-bit/16-bit Baud Rate Generator can be used to derive standard baud rate frequencies from the oscillator. The EUSART transmits and receives the LSb first. The EUSART’s transmitter and receiver are functionally independent but use the same data format and baud rate. The Baud Rate Generator produces a clock, either x16 or x64 of the bit shift rate depending on the BRGH and BRG16 bits (TXSTA<2> and BAUDCON<3>). Parity is not supported by the hardware but can be implemented in software and stored as the 9th data bit. When operating in Asynchronous mode, the EUSART module consists of the following important elements: • Baud Rate Generator • Sampling Circuit • Asynchronous Transmitter • Asynchronous Receiver • Auto-Wake-up on Sync Break Character • 12-bit Break Character Transmit • Auto-Baud Rate Detection 18.2.1 EUSART ASYNCHRONOUS TRANSMITTER The EUSART transmitter block diagram is shown in Figure 18-3. The heart of the transmitter is the Transmit (Serial) Shift Register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG. The TXREG register is loaded with data in software. The TSR register is not loaded until the Stop bit has been transmitted from the previous load. As soon as the Stop bit is transmitted, the TSR is loaded with new data from the TXREG register (if available). Once the TXREG register transfers the data to the TSR register (occurs in one TCY), the TXREG register is empty and the TXIF flag bit (PIR1<4>) is set. This interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TXIE (PIE1<4>). TXIF will be set regardless of the state of TXIE; it cannot be cleared in software. TXIF is also not cleared immediately upon loading TXREG, but becomes valid in the second instruction cycle following the load instruction. Polling TXIF immediately following a load of TXREG will return invalid results. While TXIF indicates the status of the TXREG register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR register is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. To set up an Asynchronous Transmission: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit SYNC and setting bit SPEN. 3. If interrupts are desired, set enable bit TXIE. 4. If 9-bit transmission is desired, set transmit bit TX9. Can be used as address/data bit. 5. Enable the transmission by setting bit TXEN which will also set bit TXIF. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit TX9D. 7. Load data to the TXREG register (starts transmission). 8. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. FIGURE 18-3: EUSART TRANSMIT BLOCK DIAGRAM Note 1: The TSR register is not mapped in data memory so it is not available to the user. 2: Flag bit TXIF is set when enable bit TXEN is set. TXIF TXIE Interrupt TXEN Baud Rate CLK SPBRG Baud Rate Generator TX9D MSb LSb Data Bus TXREG Register TSR Register (8) 0 TX9 TRMT SPEN TX pin Pin Buffer and Control 8 • • • BRG16 SPBRGH PIC18F2420/2520/4420/4520 DS39631B-page 212 Preliminary © 2007 Microchip Technology Inc. FIGURE 18-4: ASYNCHRONOUS TRANSMISSION FIGURE 18-5: ASYNCHRONOUS TRANSMISSION (BACK TO BACK) TABLE 18-5: REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION Word 1 Word 1 Transmit Shift Reg Start bit bit 0 bit 1 bit 7/8 Write to TXREG BRG Output (Shift Clock) TX (pin) TXIF bit (Transmit Buffer Reg. Empty Flag) TRMT bit (Transmit Shift Reg. Empty Flag) 1 TCY Stop bit Word 1 Transmit Shift Reg. Write to TXREG BRG Output (Shift Clock) TX (pin) TXIF bit (Interrupt Reg. Flag) TRMT bit (Transmit Shift Reg. Empty Flag) Word 1 Word 2 Word 1 Word 2 Stop bit Start bit Transmit Shift Reg. Word 1 Word 2 bit 0 bit 1 bit 7/8 bit 0 Note: This timing diagram shows two consecutive transmissions. 1 TCY 1 TCY Start bit Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 TXREG EUSART Transmit Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous transmission. Note 1: Reserved in 28-pin devices; always maintain these bits clear. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 213 PIC18F2420/2520/4420/4520 18.2.2 EUSART ASYNCHRONOUS RECEIVER The receiver block diagram is shown in Figure 18-6. The data is received on the RX pin and drives the data recovery block. The data recovery block is actually a high-speed shifter operating at x16 times the baud rate, whereas the main receive serial shifter operates at the bit rate or at FOSC. This mode would typically be used in RS-232 systems. To set up an Asynchronous Reception: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing bit SYNC and setting bit SPEN. 3. If interrupts are desired, set enable bit RCIE. 4. If 9-bit reception is desired, set bit RX9. 5. Enable the reception by setting bit CREN. 6. Flag bit, RCIF, will be set when reception is complete and an interrupt will be generated if enable bit, RCIE, was set. 7. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 8. Read the 8-bit received data by reading the RCREG register. 9. If any error occurred, clear the error by clearing enable bit CREN. 10. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. 18.2.3 SETTING UP 9-BIT MODE WITH ADDRESS DETECT This mode would typically be used in RS-485 systems. To set up an Asynchronous Reception with Address Detect Enable: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRGH and BRG16 bits, as required, to achieve the desired baud rate. 2. Enable the asynchronous serial port by clearing the SYNC bit and setting the SPEN bit. 3. If interrupts are required, set the RCEN bit and select the desired priority level with the RCIP bit. 4. Set the RX9 bit to enable 9-bit reception. 5. Set the ADDEN bit to enable address detect. 6. Enable reception by setting the CREN bit. 7. The RCIF bit will be set when reception is complete. The interrupt will be Acknowledged if the RCIE and GIE bits are set. 8. Read the RCSTA register to determine if any error occurred during reception, as well as read bit 9 of data (if applicable). 9. Read RCREG to determine if the device is being addressed. 10. If any error occurred, clear the CREN bit. 11. If the device has been addressed, clear the ADDEN bit to allow all received data into the receive buffer and interrupt the CPU. FIGURE 18-6: EUSART RECEIVE BLOCK DIAGRAM x64 Baud Rate CLK Baud Rate Generator RX Pin Buffer and Control SPEN Data Recovery CREN OERR FERR MSb RSR Register LSb RX9D RCREG Register FIFO Interrupt RCIF RCIE Data Bus 8 ÷ 64 ÷ 16 or Stop (8) 7 1 0 Start RX9 • • • BRG16 SPBRGH SPBRG or ÷ 4 PIC18F2420/2520/4420/4520 DS39631B-page 214 Preliminary © 2007 Microchip Technology Inc. FIGURE 18-7: ASYNCHRONOUS RECEPTION TABLE 18-6: REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION 18.2.4 AUTO-WAKE-UP ON SYNC BREAK CHARACTER During Sleep mode, all clocks to the EUSART are suspended. Because of this, the Baud Rate Generator is inactive and a proper byte reception cannot be performed. The auto-wake-up feature allows the controller to wake-up due to activity on the RX/DT line while the EUSART is operating in Asynchronous mode. The auto-wake-up feature is enabled by setting the WUE bit (BAUDCON<1>). Once set, the typical receive sequence on RX/DT is disabled and the EUSART remains in an Idle state, monitoring for a wake-up event independent of the CPU mode. A wake-up event consists of a high-to-low transition on the RX/DT line. (This coincides with the start of a Sync Break or a Wake-up Signal character for the LIN protocol.) Following a wake-up event, the module generates an RCIF interrupt. The interrupt is generated synchronously to the Q clocks in normal operating modes (Figure 18-8) and asynchronously, if the device is in Sleep mode (Figure 18-9). The interrupt condition is cleared by reading the RCREG register. The WUE bit is automatically cleared once a low-tohigh transition is observed on the RX line following the wake-up event. At this point, the EUSART module is in Idle mode and returns to normal operation. This signals to the user that the Sync Break event is over. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 RCREG EUSART Receive Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used for asynchronous reception. Note 1: Reserved in 28-pin devices; always maintain these bits clear. Start bit bit 0 bit 1 bit 7/8 Stop bit 0 bit 7/8 bit Start bit Start bit 7/8 Stop bit bit RX (pin) Rcv Buffer Reg Rcv Shift Reg Read Rcv Buffer Reg RCREG RCIF (Interrupt Flag) OERR bit CREN Word 1 RCREG Word 2 RCREG Stop bit Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word causing the OERR (overrun) bit to be set. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 215 PIC18F2420/2520/4420/4520 18.2.4.1 Special Considerations Using Auto-Wake-up Since auto-wake-up functions by sensing rising edge transitions on RX/DT, information with any state changes before the Stop bit may signal a false end-ofcharacter and cause data or framing errors. To work properly, therefore, the initial character in the transmission must be all ‘0’s. This can be 00h (8 bytes) for standard RS-232 devices or 000h (12 bits) for LIN bus. Oscillator start-up time must also be considered, especially in applications using oscillators with longer start-up intervals (i.e., XT or HS mode). The Sync Break (or Wake-up Signal) character must be of sufficient length and be followed by a sufficient interval to allow enough time for the selected oscillator to start and provide proper initialization of the EUSART. 18.2.4.2 Special Considerations Using the WUE Bit The timing of WUE and RCIF events may cause some confusion when it comes to determining the validity of received data. As noted, setting the WUE bit places the EUSART in an Idle mode. The wake-up event causes a receive interrupt by setting the RCIF bit. The WUE bit is cleared after this when a rising edge is seen on RX/DT. The interrupt condition is then cleared by reading the RCREG register. Ordinarily, the data in RCREG will be dummy data and should be discarded. The fact that the WUE bit has been cleared (or is still set) and the RCIF flag is set should not be used as an indicator of the integrity of the data in RCREG. Users should consider implementing a parallel method in firmware to verify received data integrity. To assure that no actual data is lost, check the RCIDL bit to verify that a receive operation is not in process. If a receive operation is not occurring, the WUE bit may then be set just prior to entering the Sleep mode. FIGURE 18-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING NORMAL OPERATION FIGURE 18-9: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 WUE bit(1) RX/DT Line RCIF Note 1: The EUSART remains in Idle while the WUE bit is set. Bit set by user Cleared due to user read of RCREG Auto-Cleared Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 WUE bit(2) RX/DT Line RCIF Bit set by user Cleared due to user read of RCREG Sleep Command Executed Note 1: If the wake-up event requires long oscillator warm-up time, the auto-clear of the WUE bit can occur before the oscillator is ready. This sequence should not depend on the presence of Q clocks. 2: The EUSART remains in Idle while the WUE bit is set. Sleep Ends Note 1 Auto-Cleared PIC18F2420/2520/4420/4520 DS39631B-page 216 Preliminary © 2007 Microchip Technology Inc. 18.2.5 BREAK CHARACTER SEQUENCE The EUSART module has the capability of sending the special Break character sequences that are required by the LIN bus standard. The Break character transmit consists of a Start bit, followed by twelve ‘0’ bits and a Stop bit. The frame Break character is sent whenever the SENDB and TXEN bits (TXSTA<3> and TXSTA<5>) are set while the Transmit Shift register is loaded with data. Note that the value of data written to TXREG will be ignored and all ‘0’s will be transmitted. The SENDB bit is automatically reset by hardware after the corresponding Stop bit is sent. This allows the user to preload the transmit FIFO with the next transmit byte following the Break character (typically, the Sync character in the LIN specification). Note that the data value written to the TXREG for the Break character is ignored. The write simply serves the purpose of initiating the proper sequence. The TRMT bit indicates when the transmit operation is active or Idle, just as it does during normal transmission. See Figure 18-10 for the timing of the Break character sequence. 18.2.5.1 Break and Sync Transmit Sequence The following sequence will send a message frame header made up of a Break, followed by an Auto-Baud Sync byte. This sequence is typical of a LIN bus master. 1. Configure the EUSART for the desired mode. 2. Set the TXEN and SENDB bits to set up the Break character. 3. Load the TXREG with a dummy character to initiate transmission (the value is ignored). 4. Write ‘55h’ to TXREG to load the Sync character into the transmit FIFO buffer. 5. After the Break has been sent, the SENDB bit is reset by hardware. The Sync character now transmits in the preconfigured mode. When the TXREG becomes empty, as indicated by the TXIF, the next data byte can be written to TXREG. 18.2.6 RECEIVING A BREAK CHARACTER The enhanced USART module can receive a Break character in two ways. The first method forces configuration of the baud rate at a frequency of 9/13 the typical speed. This allows for the Stop bit transition to be at the correct sampling location (13 bits for Break versus Start bit and 8 data bits for typical data). The second method uses the auto-wake-up feature described in Section 18.2.4 “Auto-Wake-up on Sync Break Character”. By enabling this feature, the EUSART will sample the next two transitions on RX/DT, cause an RCIF interrupt and receive the next data byte followed by another interrupt. Note that following a Break character, the user will typically want to enable the Auto-Baud Rate Detect feature. For both methods, the user can set the ABD bit once the TXIF interrupt is observed. FIGURE 18-10: SEND BREAK CHARACTER SEQUENCE Write to TXREG BRG Output (Shift Clock) Start Bit Bit 0 Bit 1 Bit 11 Stop Bit Break TXIF bit (Transmit Buffer Reg. Empty Flag) TX (pin) TRMT bit (Transmit Shift Reg. Empty Flag) SENDB (Transmit Shift Reg. Empty Flag) SENDB sampled here Auto-Cleared Dummy Write © 2007 Microchip Technology Inc. Preliminary DS39631B-page 217 PIC18F2420/2520/4420/4520 18.3 EUSART Synchronous Master Mode The Synchronous Master mode is entered by setting the CSRC bit (TXSTA<7>). In this mode, the data is transmitted in a half-duplex manner (i.e., transmission and reception do not occur at the same time). When transmitting data, the reception is inhibited and vice versa. Synchronous mode is entered by setting bit SYNC (TXSTA<4>). In addition, enable bit SPEN (RCSTA<7>) is set in order to configure the TX and RX pins to CK (clock) and DT (data) lines, respectively. The Master mode indicates that the processor transmits the master clock on the CK line. Clock polarity is selected with the SCKP bit (BAUDCON<4>); setting SCKP sets the Idle state on CK as high, while clearing the bit sets the Idle state as low. This option is provided to support Microwire devices with this module. 18.3.1 EUSART SYNCHRONOUS MASTER TRANSMISSION The EUSART transmitter block diagram is shown in Figure 18-3. The heart of the transmitter is the Transmit (Serial) Shift Register (TSR). The Shift register obtains its data from the Read/Write Transmit Buffer register, TXREG. The TXREG register is loaded with data in software. The TSR register is not loaded until the last bit has been transmitted from the previous load. As soon as the last bit is transmitted, the TSR is loaded with new data from the TXREG (if available). Once the TXREG register transfers the data to the TSR register (occurs in one TCY), the TXREG is empty and the TXIF flag bit (PIR1<4>) is set. The interrupt can be enabled or disabled by setting or clearing the interrupt enable bit, TXIE (PIE1<4>). TXIF is set regardless of the state of enable bit TXIE; it cannot be cleared in software. It will reset only when new data is loaded into the TXREG register. While flag bit TXIF indicates the status of the TXREG register, another bit, TRMT (TXSTA<1>), shows the status of the TSR register. TRMT is a read-only bit which is set when the TSR is empty. No interrupt logic is tied to this bit so the user has to poll this bit in order to determine if the TSR register is empty. The TSR is not mapped in data memory so it is not available to the user. To set up a Synchronous Master Transmission: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 3. If interrupts are desired, set enable bit TXIE. 4. If 9-bit transmission is desired, set bit TX9. 5. Enable the transmission by setting bit TXEN. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit TX9D. 7. Start transmission by loading data to the TXREG register. 8. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. FIGURE 18-11: SYNCHRONOUS TRANSMISSION bit 0 bit 1 bit 7 Word 1 Q1 Q2 Q3Q4 Q1 Q2 Q3Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4Q1 Q2 Q3 Q4 Q3Q4 Q1Q2 Q3Q4 Q1Q2 Q3Q4 Q1 Q2Q3Q4 Q1 Q2Q3 Q4Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 bit 2 bit 0 bit 1 bit 7 RC7/RX/DT RC6/TX/CK pin Write to TXREG Reg TXIF bit (Interrupt Flag) TXEN bit ‘1’ ‘1’ Word 2 TRMT bit Write Word 1 Write Word 2 Note: Sync Master mode, SPBRG = 0, continuous transmission of two 8-bit words. RC6/TX/CK pin (SCKP = 0) (SCKP = 1) PIC18F2420/2520/4420/4520 DS39631B-page 218 Preliminary © 2007 Microchip Technology Inc. FIGURE 18-12: SYNCHRONOUS TRANSMISSION (THROUGH TXEN) TABLE 18-7: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER TRANSMISSION RC7/RX/DT pin RC6/TX/CK pin Write to TXREG reg TXIF bit TRMT bit bit 0 bit 1 bit 2 bit 6 bit 7 TXEN bit Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 TXREG EUSART Transmit Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master transmission. Note 1: Reserved in 28-pin devices; always maintain these bits clear. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 219 PIC18F2420/2520/4420/4520 18.3.2 EUSART SYNCHRONOUS MASTER RECEPTION Once Synchronous mode is selected, reception is enabled by setting either the Single Receive Enable bit, SREN (RCSTA<5>), or the Continuous Receive Enable bit, CREN (RCSTA<4>). Data is sampled on the RX pin on the falling edge of the clock. If enable bit SREN is set, only a single word is received. If enable bit CREN is set, the reception is continuous until CREN is cleared. If both bits are set, then CREN takes precedence. To set up a Synchronous Master Reception: 1. Initialize the SPBRGH:SPBRG registers for the appropriate baud rate. Set or clear the BRG16 bit, as required, to achieve the desired baud rate. 2. Enable the synchronous master serial port by setting bits SYNC, SPEN and CSRC. 3. Ensure bits CREN and SREN are clear. 4. If interrupts are desired, set enable bit RCIE. 5. If 9-bit reception is desired, set bit RX9. 6. If a single reception is required, set bit SREN. For continuous reception, set bit CREN. 7. Interrupt flag bit, RCIF, will be set when reception is complete and an interrupt will be generated if the enable bit, RCIE, was set. 8. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 9. Read the 8-bit received data by reading the RCREG register. 10. If any error occurred, clear the error by clearing bit CREN. 11. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. FIGURE 18-13: SYNCHRONOUS RECEPTION (MASTER MODE, SREN) TABLE 18-8: REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 RCREG EUSART Receive Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous master reception. Note 1: Reserved in 28-pin devices; always maintain these bits clear. CREN bit RC7/RX/DT RC6/TX/CK pin Write to bit SREN SREN bit RCIF bit (Interrupt) Read RXREG Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2Q3 Q4 Q1 Q2 Q3 Q4 ‘0’ bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7 ‘0’ Q1 Q2 Q3 Q4 Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0. RC6/TX/CK pin pin (SCKP = 0) (SCKP = 1) PIC18F2420/2520/4420/4520 DS39631B-page 220 Preliminary © 2007 Microchip Technology Inc. 18.4 EUSART Synchronous Slave Mode Synchronous Slave mode is entered by clearing bit, CSRC (TXSTA<7>). This mode differs from the Synchronous Master mode in that the shift clock is supplied externally at the CK pin (instead of being supplied internally in Master mode). This allows the device to transfer or receive data while in any low-power mode. 18.4.1 EUSART SYNCHRONOUS SLAVE TRANSMISSION The operation of the Synchronous Master and Slave modes are identical, except in the case of the Sleep mode. If two words are written to the TXREG and then the SLEEP instruction is executed, the following will occur: a) The first word will immediately transfer to the TSR register and transmit. b) The second word will remain in the TXREG register. c) Flag bit, TXIF, will not be set. d) When the first word has been shifted out of TSR, the TXREG register will transfer the second word to the TSR and flag bit, TXIF, will now be set. e) If enable bit TXIE is set, the interrupt will wake the chip from Sleep. If the global interrupt is enabled, the program will branch to the interrupt vector. To set up a Synchronous Slave Transmission: 1. Enable the synchronous slave serial port by setting bits SYNC and SPEN and clearing bit CSRC. 2. Clear bits CREN and SREN. 3. If interrupts are desired, set enable bit TXIE. 4. If 9-bit transmission is desired, set bit TX9. 5. Enable the transmission by setting enable bit TXEN. 6. If 9-bit transmission is selected, the ninth bit should be loaded in bit TX9D. 7. Start transmission by loading data to the TXREGx register. 8. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. TABLE 18-9: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE TRANSMISSION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 TXREG EUSART Transmit Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave transmission. Note 1: Reserved in 28-pin devices; always maintain these bits clear. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 221 PIC18F2420/2520/4420/4520 18.4.2 EUSART SYNCHRONOUS SLAVE RECEPTION The operation of the Synchronous Master and Slave modes is identical, except in the case of Sleep, or any Idle mode and bit SREN, which is a “don’t care” in Slave mode. If receive is enabled by setting the CREN bit prior to entering Sleep or any Idle mode, then a word may be received while in this low-power mode. Once the word is received, the RSR register will transfer the data to the RCREG register; if the RCIE enable bit is set, the interrupt generated will wake the chip from the low-power mode. If the global interrupt is enabled, the program will branch to the interrupt vector. To set up a Synchronous Slave Reception: 1. Enable the synchronous master serial port by setting bits SYNC and SPEN and clearing bit CSRC. 2. If interrupts are desired, set enable bit RCIE. 3. If 9-bit reception is desired, set bit RX9. 4. To enable reception, set enable bit CREN. 5. Flag bit, RCIF, will be set when reception is complete. An interrupt will be generated if enable bit, RCIE, was set. 6. Read the RCSTA register to get the 9th bit (if enabled) and determine if any error occurred during reception. 7. Read the 8-bit received data by reading the RCREG register. 8. If any error occurred, clear the error by clearing bit CREN. 9. If using interrupts, ensure that the GIE and PEIE bits in the INTCON register (INTCON<7:6>) are set. TABLE 18-10: REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE RECEPTION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 51 RCREG EUSART Receive Register 51 TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 51 BAUDCON ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN 51 SPBRGH EUSART Baud Rate Generator Register, High Byte 51 SPBRG EUSART Baud Rate Generator Register, Low Byte 51 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for synchronous slave reception. Note 1: Reserved in 28-pin devices; always maintain these bits clear. PIC18F2420/2520/4420/4520 DS39631B-page 222 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 223 PIC18F2420/2520/4420/4520 19.0 10-BIT ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE The Analog-to-Digital (A/D) converter module has 10 inputs for the 28-pin devices and 13 for the 40/44-pin devices. This module allows conversion of an analog input signal to a corresponding 10-bit digital number. The module has five registers: • A/D Result High Register (ADRESH) • A/D Result Low Register (ADRESL) • A/D Control Register 0 (ADCON0) • A/D Control Register 1 (ADCON1) • A/D Control Register 2 (ADCON2) The ADCON0 register, shown in Register 19-1, controls the operation of the A/D module. The ADCON1 register, shown in Register 19-2, configures the functions of the port pins. The ADCON2 register, shown in Register 19-3, configures the A/D clock source, programmed acquisition time and justification. REGISTER 19-1: ADCON0 REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5-2 CHS3:CHS0: Analog Channel Select bits 0000 = Channel 0 (AN0) 0001 = Channel 1 (AN1) 0010 = Channel 2 (AN2) 0011 = Channel 3 (AN3) 0100 = Channel 4 (AN4) 0101 = Channel 5 (AN5)(1,2) 0110 = Channel 6 (AN6)(1,2) 0111 = Channel 7 (AN7)(1,2) 1000 = Channel 8 (AN8) 1001 = Channel 9 (AN9) 1010 = Channel 10 (AN10) 1011 = Channel 11 (AN11) 1100 = Channel 12 (AN12 1101 = Unimplemented(2) 1110 = Unimplemented(2) 1111 = Unimplemented(2) Note 1: These channels are not implemented on 28-pin devices. 2: Performing a conversion on unimplemented channels will return a floating input measurement. bit 1 GO/DONE: A/D Conversion Status bit When ADON = 1: 1 = A/D conversion in progress 0 = A/D Idle bit 0 ADON: A/D On bit 1 = A/D converter module is enabled 0 = A/D converter module is disabled Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 224 Preliminary © 2007 Microchip Technology Inc. REGISTER 19-2: ADCON1 REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0(1) R/W(1) R/W(1) R/W(1) — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 bit 7 bit 0 bit 7-6 Unimplemented: Read as ‘0’ bit 5 VCFG1: Voltage Reference Configuration bit (VREF- source) 1 = VREF- (AN2) 0 = VSS bit 4 VCFG0: Voltage Reference Configuration bit (VREF+ source) 1 = VREF+ (AN3) 0 = VDD bit 3-0 PCFG3:PCFG0: A/D Port Configuration Control bits: Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown A = Analog input D = Digital I/O Note 1: The POR value of the PCFG bits depends on the value of the PBADEN configuration bit. When PBADEN = 1, PCFG<3:0> = 0000; when PBADEN = 0, PCFG<3:0> = 0111. 2: AN5 through AN7 are available only on 40/44-pin devices. PCFG3: PCFG0 AN12 AN11 AN10 AN9 AN8 AN7(2) AN6(2) AN5(2) AN4 AN3 AN2 AN1 AN0 0000(1) A A A A A A A A A A A A A 0001 A A A A A A A A A A A A A 0010 A A A A A A A A A A A A A 0011 D A A A A A A A A A A A A 0100 D D A A A A A A A A A A A 0101 D D D A A A A A A A A A A 0110 D D D D A A A A A A A A A 0111(1) D D D D D A A A A A A A A 1000 D D D D D D A A A A A A A 1001 D D D D D D D A A A A A A 1010 D D D D D D D D A A A A A 1011 D D D D D D D D D A A A A 1100 D D D D D D D D D D A A A 1101 D D D D D D D D D D D A A 1110 D D D D D D D D D D D D A 1111 D D D D D D D D D D D D D © 2007 Microchip Technology Inc. Preliminary DS39631B-page 225 PIC18F2420/2520/4420/4520 REGISTER 19-3: ADCON2 REGISTER R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 bit 7 bit 0 bit 7 ADFM: A/D Result Format Select bit 1 = Right justified 0 = Left justified bit 6 Unimplemented: Read as ‘0’ bit 5-3 ACQT2:ACQT0: A/D Acquisition Time Select bits 111 = 20 TAD 110 = 16 TAD 101 = 12 TAD 100 = 8 TAD 011 = 6 TAD 010 = 4 TAD 001 = 2 TAD 000 = 0 TAD(1) bit 2-0 ADCS2:ADCS0: A/D Conversion Clock Select bits 111 = FRC (clock derived from A/D RC oscillator)(1) 110 = FOSC/64 101 = FOSC/16 100 = FOSC/4 011 = FRC (clock derived from A/D RC oscillator)(1) 010 = FOSC/32 001 = FOSC/8 000 = FOSC/2 Note 1: If the A/D FRC clock source is selected, a delay of one TCY (instruction cycle) is added before the A/D clock starts. This allows the SLEEP instruction to be executed before starting a conversion. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 226 Preliminary © 2007 Microchip Technology Inc. The analog reference voltage is software selectable to either the device’s positive and negative supply voltage (VDD and VSS), or the voltage level on the RA3/AN3/ VREF+ and RA2/AN2/VREF-/CVREF pins. The A/D converter has a unique feature of being able to operate while the device is in Sleep mode. To operate in Sleep, the A/D conversion clock must be derived from the A/D’s internal RC oscillator. The output of the sample and hold is the input into the converter, which generates the result via successive approximation. A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off and any conversion in progress is aborted. Each port pin associated with the A/D converter can be configured as an analog input, or as a digital I/O. The ADRESH and ADRESL registers contain the result of the A/D conversion. When the A/D conversion is complete, the result is loaded into the ADRESH:ADRESL register pair, the GO/DONE bit (ADCON0 register) is cleared and A/D Interrupt Flag bit, ADIF, is set. The block diagram of the A/D module is shown in Figure 19-1. FIGURE 19-1: A/D BLOCK DIAGRAM (Input Voltage) VAIN VREF+ Reference Voltage VDD VCFG1:VCFG0 CHS3:CHS0 AN7(1) AN6(1) AN5(1) AN4 AN3 AN2 AN1 AN0 0111 0110 0101 0100 0011 0010 0001 0000 10-Bit Converter VREFVSS A/D AN12 AN11 AN10 AN9 AN8 1100 1011 1010 1001 1000 Note 1: Channels AN5 through AN7 are not available on 28-pin devices. 2: I/O pins have diode protection to VDD and VSS. 0X 1X X1 X0 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 227 PIC18F2420/2520/4420/4520 The value in the ADRESH:ADRESL registers is not modified for a Power-on Reset. The ADRESH:ADRESL registers will contain unknown data after a Power-on Reset. After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as an input. To determine acquisition time, see Section 19.1 “A/D Acquisition Requirements”. After this acquisition time has elapsed, the A/D conversion can be started. An acquisition time can be programmed to occur between setting the GO/DONE bit and the actual start of the conversion. The following steps should be followed to perform an A/D conversion: 1. Configure the A/D module: • Configure analog pins, voltage reference and digital I/O (ADCON1) • Select A/D input channel (ADCON0) • Select A/D acquisition time (ADCON2) • Select A/D conversion clock (ADCON2) • Turn on A/D module (ADCON0) 2. Configure A/D interrupt (if desired): • Clear ADIF bit • Set ADIE bit • Set GIE bit 3. Wait the required acquisition time (if required). 4. Start conversion: • Set GO/DONE bit (ADCON0 register) 5. Wait for A/D conversion to complete, by either: • Polling for the GO/DONE bit to be cleared OR • Waiting for the A/D interrupt 6. Read A/D Result registers (ADRESH:ADRESL); clear bit ADIF, if required. 7. For next conversion, go to step 1 or step 2, as required. The A/D conversion time per bit is defined as TAD. A minimum wait of 2 TAD is required before the next acquisition starts. FIGURE 19-2: A/D TRANSFER FUNCTION FIGURE 19-3: ANALOG INPUT MODEL Digital Code Output 3FEh 003h 002h 001h 000h 0.5 LSB 1 LSB 1.5 LSB 2 LSB 2.5 LSB 1022 LSB 1022.5 LSB 3 LSB Analog Input Voltage 3FFh 1023 LSB 1023.5 LSB VAIN CPIN Rs ANx 5 pF VT = 0.6V VT = 0.6V ILEAKAGE RIC ≤ 1k Sampling Switch SS RSS CHOLD = 25 pF VSS VDD ± 100 nA Legend: CPIN VT ILEAKAGE RIC SS CHOLD = input capacitance = threshold voltage = leakage current at the pin due to = interconnect resistance = sampling switch = sample/hold capacitance (from DAC) various junctions RSS = sampling switch resistance VDD 6 V Sampling Switch 5 V 4 V 3 V 2 V 1 2 3 4 (kΩ) PIC18F2420/2520/4420/4520 DS39631B-page 228 Preliminary © 2007 Microchip Technology Inc. 19.1 A/D Acquisition Requirements For the A/D converter to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 19-3. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD). The source impedance affects the offset voltage at the analog input (due to pin leakage current). The maximum recommended impedance for analog sources is 2.5 kΩ. After the analog input channel is selected (changed), the channel must be sampled for at least the minimum acquisition time before starting a conversion. To calculate the minimum acquisition time, Equation 19-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified resolution. Example 19-3 shows the calculation of the minimum required acquisition time TACQ. This calculation is based on the following application system assumptions: CHOLD = 25 pF Rs = 2.5 kΩ Conversion Error ≤ 1/2 LSb VDD = 5V → Rss = 2 kΩ Temperature = 85°C (system max.) EQUATION 19-1: ACQUISITION TIME EQUATION 19-2: A/D MINIMUM CHARGING TIME EQUATION 19-3: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME Note: When the conversion is started, the holding capacitor is disconnected from the input pin. TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient = TAMP + TC + TCOFF VHOLD = (VREF – (VREF/2048)) • (1 – e(-TC/CHOLD(RIC + RSS + RS))) or TC = -(CHOLD)(RIC + RSS + RS) ln(1/2048) TACQ = TAMP + TC + TCOFF TAMP = 0.2 μs TCOFF = (Temp – 25°C)(0.02 μs/°C) (85°C – 25°C)(0.02 μs/°C) 1.2 μs Temperature coefficient is only required for temperatures > 25°C. Below 25°C, TCOFF = 0 ms. TC = -(CHOLD)(RIC + RSS + RS) ln(1/2047) μs -(25 pF) (1 kΩ + 2 kΩ + 2.5 kΩ) ln(0.0004883) μs 1.05 μs TACQ = 0.2 μs + 1 μs + 1.2 μs 2.4 μs © 2007 Microchip Technology Inc. Preliminary DS39631B-page 229 PIC18F2420/2520/4420/4520 19.2 Selecting and Configuring Acquisition Time The ADCON2 register allows the user to select an acquisition time that occurs each time the GO/DONE bit is set. It also gives users the option to use an automatically determined acquisition time. Acquisition time may be set with the ACQT2:ACQT0 bits (ADCON2<5:3>), which provides a range of 2 to 20 TAD. When the GO/DONE bit is set, the A/D module continues to sample the input for the selected acquisition time, then automatically begins a conversion. Since the acquisition time is programmed, there may be no need to wait for an acquisition time between selecting a channel and setting the GO/DONE bit. Manual acquisition is selected when ACQT2:ACQT0 = 000. When the GO/DONE bit is set, sampling is stopped and a conversion begins. The user is responsible for ensuring the required acquisition time has passed between selecting the desired input channel and setting the GO/DONE bit. This option is also the default Reset state of the ACQT2:ACQT0 bits and is compatible with devices that do not offer programmable acquisition times. In either case, when the conversion is completed, the GO/DONE bit is cleared, the ADIF flag is set and the A/D begins sampling the currently selected channel again. If an acquisition time is programmed, there is nothing to indicate if the acquisition time has ended or if the conversion has begun. 19.3 Selecting the A/D Conversion Clock The A/D conversion time per bit is defined as TAD. The A/D conversion requires 11 TAD per 10-bit conversion. The source of the A/D conversion clock is software selectable. There are seven possible options for TAD: • 2 TOSC • 4 TOSC • 8 TOSC • 16 TOSC • 32 TOSC • 64 TOSC • Internal RC Oscillator For correct A/D conversions, the A/D conversion clock (TAD) must be as short as possible, but greater than the minimum TAD (see parameter 130 for more information). Table 19-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected. TABLE 19-1: TAD vs. DEVICE OPERATING FREQUENCIES AD Clock Source (TAD) Maximum Device Frequency Operation ADCS2:ADCS0 PIC18F2X20/4X20 PIC18LF2X20/4X20(4) 2 TOSC 000 2.86 MHz 1.43 kHz 4 TOSC 100 5.71 MHz 2.86 MHz 8 TOSC 001 11.43 MHz 5.72 MHz 16 TOSC 101 22.86 MHz 11.43 MHz 32 TOSC 010 40.0 MHz 22.86 MHz 64 TOSC 110 40.0 MHz 22.86 MHz RC(3) x11 1.00 MHz(1) 1.00 MHz(2) Note 1: The RC source has a typical TAD time of 1.2 μs. 2: The RC source has a typical TAD time of 2.5 μs. 3: For device frequencies above 1 MHz, the device must be in Sleep for the entire conversion or the A/D accuracy may be out of specification. 4: Low-power (PIC18LFXXXX) devices only. PIC18F2420/2520/4420/4520 DS39631B-page 230 Preliminary © 2007 Microchip Technology Inc. 19.4 Operation in Power Managed Modes The selection of the automatic acquisition time and A/D conversion clock is determined in part by the clock source and frequency while in a power managed mode. If the A/D is expected to operate while the device is in a power managed mode, the ACQT2:ACQT0 and ADCS2:ADCS0 bits in ADCON2 should be updated in accordance with the clock source to be used in that mode. After entering the mode, an A/D acquisition or conversion may be started. Once started, the device should continue to be clocked by the same clock source until the conversion has been completed. If desired, the device may be placed into the corresponding Idle mode during the conversion. If the device clock frequency is less than 1 MHz, the A/D RC clock source should be selected. Operation in the Sleep mode requires the A/D FRC clock to be selected. If bits ACQT2:ACQT0 are set to ‘000’ and a conversion is started, the conversion will be delayed one instruction cycle to allow execution of the SLEEP instruction and entry to Sleep mode. The IDLEN bit (OSCCON<7>) must have already been cleared prior to starting the conversion. 19.5 Configuring Analog Port Pins The ADCON1, TRISA, TRISB and TRISE registers all configure the A/D port pins. The port pins needed as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the CHS3:CHS0 bits and the TRIS bits. Note 1: When reading the Port register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs will convert as analog inputs. Analog levels on a digitally configured input will be accurately converted. 2: Analog levels on any pin defined as a digital input may cause the digital input buffer to consume current out of the device’s specification limits. 3: The PBADEN bit in Configuration Register 3H configures PORTB pins to reset as analog or digital pins by controlling how the PCFG0 bits in ADCON1 are reset. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 231 PIC18F2420/2520/4420/4520 19.6 A/D Conversions Figure 19-4 shows the operation of the A/D converter after the GO bit has been set and the ACQT2:ACQT0 bits are cleared. A conversion is started after the following instruction to allow entry into Sleep mode before the conversion begins. Figure 19-5 shows the operation of the A/D converter after the GO bit has been set and the ACQT2:ACQT0 bits are set to ‘010’ and selecting a 4 TAD acquisition time before the conversion starts. Clearing the GO/DONE bit during a conversion will abort the current conversion. The A/D Result register pair will NOT be updated with the partially completed A/D conversion sample. This means the ADRESH:ADRESL registers will continue to contain the value of the last completed conversion (or the last value written to the ADRESH:ADRESL registers). After the A/D conversion is completed or aborted, a 2 TAD wait is required before the next acquisition can be started. After this wait, acquisition on the selected channel is automatically started. 19.7 Discharge The discharge phase is used to initialize the value of the capacitor array. The array is discharged before every sample. This feature helps to optimize the unitygain amplifier, as the circuit always needs to charge the capacitor array, rather than charge/discharge based on previous measure values. FIGURE 19-4: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 000, TACQ = 0) FIGURE 19-5: A/D CONVERSION TAD CYCLES (ACQT<2:0> = 010, TACQ = 4 TAD) Note: The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD11 Set GO bit Holding capacitor is disconnected from analog input (typically 100 ns) TCY - TAD TAD9 TAD10 ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. Conversion starts b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 On the following cycle: TAD1 Discharge 1 2 3 4 5 6 7 8 11 Set GO bit (Holding capacitor is disconnected) 9 10 Conversion starts 1 2 3 4 (Holding capacitor continues acquiring input) TACQT Cycles TAD Cycles Automatic Acquisition Time b9 b8 b7 b6 b5 b4 b3 b2 b1 b0 ADRESH:ADRESL is loaded, GO bit is cleared, ADIF bit is set, holding capacitor is connected to analog input. On the following cycle: TAD1 Discharge PIC18F2420/2520/4420/4520 DS39631B-page 232 Preliminary © 2007 Microchip Technology Inc. 19.8 Use of the CCP2 Trigger An A/D conversion can be started by the Special Event Trigger of the CCP2 module. This requires that the CCP2M3:CCP2M0 bits (CCP2CON<3:0>) be programmed as ‘1011’ and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the GO/DONE bit will be set, starting the A/D acquisition and conversion and the Timer1 (or Timer3) counter will be reset to zero. Timer1 (or Timer3) is reset to automatically repeat the A/D acquisition period with minimal software overhead (moving ADRESH:ADRESL to the desired location). The appropriate analog input channel must be selected and the minimum acquisition period is either timed by the user, or an appropriate TACQ time selected before the Special Event Trigger sets the GO/DONE bit (starts a conversion). If the A/D module is not enabled (ADON is cleared), the Special Event Trigger will be ignored by the A/D module, but will still reset the Timer1 (or Timer3) counter. TABLE 19-2: REGISTERS ASSOCIATED WITH A/D OPERATION Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR1 PSPIF(1) ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 52 PIE1 PSPIE(1) ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 52 IPR1 PSPIP(1) ADIP RCIP TXIP SSPIP CCP1IP TMR2IP TMR1IP 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 ADRESH A/D Result Register, High Byte 51 ADRESL A/D Result Register, Low Byte 51 ADCON0 — — CHS3 CHS2 CHS1 CHS0 GO/DONE ADON 51 ADCON1 — — VCFG1 VCFG0 PCFG3 PCFG2 PCFG1 PCFG0 51 ADCON2 ADFM — ACQT2 ACQT1 ACQT0 ADCS2 ADCS1 ADCS0 51 PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 TRISA TRISA7(2) TRISA6(2) PORTA Data Direction Control Register 52 PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 52 TRISB PORTB Data Direction Control Register 52 LATB PORTB Data Latch Register (Read and Write to Data Latch) 52 PORTE(4) — — — — RE3(3) RE2 RE1 RE0 52 TRISE(4) IBF OBF IBOV PSPMODE — TRISE2 TRISE1 TRISE0 52 LATE(4) — — — — — PORTE Data Latch Register 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion. Note 1: These bits are unimplemented on 28-pin devices; always maintain these bits clear. 2: PORTA<7:6> and their direction bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. 3: RE3 port bit is available only as an input pin when the MCLRE configuration bit is ‘0’. 4: These registers are not implemented on 28-pin devices. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 233 PIC18F2420/2520/4420/4520 20.0 COMPARATOR MODULE The analog comparator module contains two comparators that can be configured in a variety of ways. The inputs can be selected from the analog inputs multiplexed with pins RA0 through RA5, as well as the on-chip voltage reference (see Section 21.0 “Comparator Voltage Reference Module”). The digital outputs (normal or inverted) are available at the pin level and can also be read through the control register. The CMCON register (Register 20-1) selects the comparator input and output configuration. Block diagrams of the various comparator configurations are shown in Figure 20-1. REGISTER 20-1: CMCON REGISTER R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 bit 7 bit 0 bit 7 C2OUT: Comparator 2 Output bit When C2INV = 0: 1 = C2 VIN+ > C2 VIN- 0 = C2 VIN+ < C2 VINWhen C2INV = 1: 1 = C2 VIN+ < C2 VIN- 0 = C2 VIN+ > C2 VINbit 6 C1OUT: Comparator 1 Output bit When C1INV = 0: 1 = C1 VIN+ > C1 VIN- 0 = C1 VIN+ < C1 VINWhen C1INV = 1: 1 = C1 VIN+ < C1 VIN- 0 = C1 VIN+ > C1 VINbit 5 C2INV: Comparator 2 Output Inversion bit 1 = C2 output inverted 0 = C2 output not inverted bit 4 C1INV: Comparator 1 Output Inversion bit 1 = C1 output inverted 0 = C1 output not inverted bit 3 CIS: Comparator Input Switch bit When CM2:CM0 = 110: 1 = C1 VIN- connects to RA3/AN3/VREF+ C2 VIN- connects to RA2/AN2/VREF-/CVREF 0 = C1 VIN- connects to RA0/AN0 C2 VIN- connects to RA1/AN1 bit 2-0 CM2:CM0: Comparator Mode bits Figure 20-1 shows the Comparator modes and the CM2:CM0 bit settings. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 234 Preliminary © 2007 Microchip Technology Inc. 20.1 Comparator Configuration There are eight modes of operation for the comparators, shown in Figure 20-1. Bits CM2:CM0 of the CMCON register are used to select these modes. The TRISA register controls the data direction of the comparator pins for each mode. If the Comparator mode is changed, the comparator output level may not be valid for the specified mode change delay shown in Section 26.0 “Electrical Characteristics”. FIGURE 20-1: COMPARATOR I/O OPERATING MODES Note: Comparator interrupts should be disabled during a Comparator mode change; otherwise, a false interrupt may occur. C1 RA0/AN0 VINRA3/ AN3/ VIN+ Off (Read as ‘0’) Comparators Reset A A CM2:CM0 = 000 C2 RA1/AN1 VINRA2/ AN2/ VIN+ Off (Read as ‘0’) A A C1 VINVIN+ C1OUT Two Independent Comparators A A CM2:CM0 = 010 C2 VINVIN+ C2OUT A A C1 VINVIN+ C1OUT Two Common Reference Comparators A A CM2:CM0 = 100 C2 VINVIN+ C2OUT A D C2 VINVIN+ Off (Read as ‘0’) One Independent Comparator with Output D D CM2:CM0 = 001 C1 VINVIN+ C1OUT A A C1 VINVIN+ Off (Read as ‘0’) Comparators Off (POR Default Value) D D CM2:CM0 = 111 C2 VINVIN+ Off (Read as ‘0’) D D C1 VINVIN+ C1OUT Four Inputs Multiplexed to Two Comparators A A CM2:CM0 = 110 C2 VINVIN+ C2OUT A A From VREF Module CIS = 0 CIS = 1 CIS = 0 CIS = 1 C1 VINVIN+ C1OUT Two Common Reference Comparators with Outputs A A CM2:CM0 = 101 C2 VINVIN+ C2OUT A D A = Analog Input, port reads zeros always D = Digital Input CIS (CMCON<3>) is the Comparator Input Switch CVREF C1 VINVIN+ C1OUT Two Independent Comparators with Outputs A A CM2:CM0 = 011 C2 VINVIN+ C2OUT A A RA5/AN4/SS/HLVDIN/C2OUT* RA4/T0CKI/C1OUT* VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ RA1/AN1 RA2/AN2/ VREF+ VREF-/CVREF RA0/AN0 RA3/AN3/ VREF+ RA1/AN1 RA2/AN2/ VREF-/CVREF RA4/T0CKI/C1OUT* RA5/AN4/SS/HLVDIN/C2OUT* RA0/AN0 RA3/AN3/ VREF+ RA1/AN1 RA2/AN2/ VREF-/CVREF RA4/T0CKI/C1OUT* * Setting the TRISA<5:4> bits will disable the comparator outputs by configuring the pins as inputs. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 235 PIC18F2420/2520/4420/4520 20.2 Comparator Operation A single comparator is shown in Figure 20-2, along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 20-2 represent the uncertainty, due to input offsets and response time. 20.3 Comparator Reference Depending on the comparator operating mode, either an external or internal voltage reference may be used. The analog signal present at VIN- is compared to the signal at VIN+ and the digital output of the comparator is adjusted accordingly (Figure 20-2). FIGURE 20-2: SINGLE COMPARATOR 20.3.1 EXTERNAL REFERENCE SIGNAL When external voltage references are used, the comparator module can be configured to have the comparators operate from the same or different reference sources. However, threshold detector applications may require the same reference. The reference signal must be between VSS and VDD and can be applied to either pin of the comparator(s). 20.3.2 INTERNAL REFERENCE SIGNAL The comparator module also allows the selection of an internally generated voltage reference from the comparator voltage reference module. This module is described in more detail in Section 21.0 “Comparator Voltage Reference Module”. The internal reference is only available in the mode where four inputs are multiplexed to two comparators (CM2:CM0 = 110). In this mode, the internal voltage reference is applied to the VIN+ pin of both comparators. 20.4 Comparator Response Time Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output has a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise, the maximum delay of the comparators should be used (see Section 26.0 “Electrical Characteristics”). 20.5 Comparator Outputs The comparator outputs are read through the CMCON register. These bits are read-only. The comparator outputs may also be directly output to the RA4 and RA5 I/O pins. When enabled, multiplexors in the output path of the RA4 and RA5 pins will switch and the output of each pin will be the unsynchronized output of the comparator. The uncertainty of each of the comparators is related to the input offset voltage and the response time given in the specifications. Figure 20-3 shows the comparator output block diagram. The TRISA bits will still function as an output enable/ disable for the RA4 and RA5 pins while in this mode. The polarity of the comparator outputs can be changed using the C2INV and C1INV bits (CMCON<4:5>). – VIN+ + VINOutput Output VINVIN+ Note 1: When reading the Port register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert an analog input according to the Schmitt Trigger input specification. 2: Analog levels on any pin defined as a digital input may cause the input buffer to consume more current than is specified. PIC18F2420/2520/4420/4520 DS39631B-page 236 Preliminary © 2007 Microchip Technology Inc. FIGURE 20-3: COMPARATOR OUTPUT BLOCK DIAGRAM 20.6 Comparator Interrupts The comparator interrupt flag is set whenever there is a change in the output value of either comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<7:6>, to determine the actual change that occurred. The CMIF bit (PIR2<6>) is the Comparator Interrupt Flag. The CMIF bit must be reset by clearing it. Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. Both the CMIE bit (PIE2<6>) and the PEIE bit (INTCON<6>) must be set to enable the interrupt. In addition, the GIE bit (INTCON<7>) must also be set. If any of these bits are clear, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of CMCON will end the mismatch condition. b) Clear flag bit CMIF. A mismatch condition will continue to set flag bit CMIF. Reading CMCON will end the mismatch condition and allow flag bit CMIF to be cleared. 20.7 Comparator Operation During Sleep When a comparator is active and the device is placed in Sleep mode, the comparator remains active and the interrupt is functional if enabled. This interrupt will wake-up the device from Sleep mode, when enabled. Each operational comparator will consume additional current, as shown in the comparator specifications. To minimize power consumption while in Sleep mode, turn off the comparators (CM2:CM0 = 111) before entering Sleep. If the device wakes up from Sleep, the contents of the CMCON register are not affected. 20.8 Effects of a Reset A device Reset forces the CMCON register to its Reset state, causing the comparator modules to be turned off (CM2:CM0 = 111). However, the input pins (RA0 through RA3) are configured as analog inputs by default on device Reset. The I/O configuration for these pins is determined by the setting of the PCFG3:PCFG0 bits (ADCON1<3:0>). Therefore, device current is minimized when analog inputs are present at Reset time. D Q EN To RA4 or RA5 pin Bus Data Set MULTIPLEX CMIF bit - + Port pins Read CMCON Reset From other Comparator CxINV D Q EN CL Note: If a change in the CMCON register (C1OUT or C2OUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR registers) interrupt flag may not get set. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 237 PIC18F2420/2520/4420/4520 20.9 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 20-4. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up condition may occur. A maximum source impedance of 10 kΩ is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. FIGURE 20-4: COMPARATOR ANALOG INPUT MODEL TABLE 20-1: REGISTERS ASSOCIATED WITH COMPARATOR MODULE VA RS < 10k AIN CPIN 5 pF VDD VT = 0.6V VT = 0.6V RIC ILEAKAGE ±500 nA VSS Legend: CPIN = Input Capacitance VT = Threshold Voltage ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage Comparator Input Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51 CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 52 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OSCFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 PORTA RA7(1) RA6(1) RA5 RA4 RA3 RA2 RA1 RA0 52 LATA LATA7(1) LATA6(1) PORTA Data Latch Register (Read and Write to Data Latch) 52 TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Control Register 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module. Note 1: PORTA<7:6> and their direction and latch bits are individually configured as port pins based on various primary oscillator modes. When disabled, these bits read as ‘0’. PIC18F2420/2520/4420/4520 DS39631B-page 238 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 239 PIC18F2420/2520/4420/4520 21.0 COMPARATOR VOLTAGE REFERENCE MODULE The comparator voltage reference is a 16-tap resistor ladder network that provides a selectable reference voltage. Although its primary purpose is to provide a reference for the analog comparators, it may also be used independently of them. A block diagram of the module is shown in Figure 21-1. The resistor ladder is segmented to provide two ranges of CVREF values and has a power-down function to conserve power when the reference is not being used. The module’s supply reference can be provided from either device VDD/VSS or an external voltage reference. 21.1 Configuring the Comparator Voltage Reference The voltage reference module is controlled through the CVRCON register (Register 21-1). The comparator voltage reference provides two ranges of output voltage, each with 16 distinct levels. The range to be used is selected by the CVRR bit (CVRCON<5>). The primary difference between the ranges is the size of the steps selected by the CVREF Selection bits (CVR3:CVR0), with one range offering finer resolution. The equations used to calculate the output of the comparator voltage reference are as follows: If CVRR = 1: CVREF = ((CVR3:CVR0)/24) x CVRSRC If CVRR = 0: CVREF = (CVRSRC x 1/4) + (((CVR3:CVR0)/32) x CVRSRC) The comparator reference supply voltage can come from either VDD and VSS, or the external VREF+ and VREF- that are multiplexed with RA2 and RA3. The voltage source is selected by the CVRSS bit (CVRCON<4>). The settling time of the comparator voltage reference must be considered when changing the CVREF output (see Table 26-3 in Section 26.0 “Electrical Characteristics”). REGISTER 21-1: CVRCON REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 CVREN CVROE(1) CVRR CVRSS CVR3 CVR2 CVR1 CVR0 bit 7 bit 0 bit 7 CVREN: Comparator Voltage Reference Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down bit 6 CVROE: Comparator VREF Output Enable bit(1) 1 = CVREF voltage level is also output on the RA2/AN2/VREF-/CVREF pin 0 = CVREF voltage is disconnected from the RA2/AN2/VREF-/CVREF pin Note 1: CVROE overrides the TRISA<2> bit setting. bit 5 CVRR: Comparator VREF Range Selection bit 1 = 0 to 0.667 CVRSRC, with CVRSRC/24 step size (low range) 0 = 0.25 CVRSRC to 0.75 CVRSRC, with CVRSRC/32 step size (high range) bit 4 CVRSS: Comparator VREF Source Selection bit 1 = Comparator reference source, CVRSRC = (VREF+) – (VREF-) 0 = Comparator reference source, CVRSRC = VDD – VSS bit 3-0 CVR3:CVR0: Comparator VREF Value Selection bits (0 ≤ (CVR3:CVR0) ≤ 15) When CVRR = 1: CVREF = ((CVR3:CVR0)/24) • (CVRSRC) When CVRR = 0: CVREF = (CVRSRC/4) + ((CVR3:CVR0)/32) • (CVRSRC) Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 240 Preliminary © 2007 Microchip Technology Inc. FIGURE 21-1: VOLTAGE REFERENCE BLOCK DIAGRAM 21.2 Voltage Reference Accuracy/Error The full range of voltage reference cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 21-1) keep CVREF from approaching the reference source rails. The voltage reference is derived from the reference source; therefore, the CVREF output changes with fluctuations in that source. The tested absolute accuracy of the voltage reference can be found in Section 26.0 “Electrical Characteristics”. 21.3 Operation During Sleep When the device wakes up from Sleep through an interrupt or a Watchdog Timer time-out, the contents of the CVRCON register are not affected. To minimize current consumption in Sleep mode, the voltage reference should be disabled. 21.4 Effects of a Reset A device Reset disables the voltage reference by clearing bit, CVREN (CVRCON<7>). This Reset also disconnects the reference from the RA2 pin by clearing bit, CVROE (CVRCON<6>) and selects the high-voltage range by clearing bit, CVRR (CVRCON<5>). The CVR value select bits are also cleared. 21.5 Connection Considerations The voltage reference module operates independently of the comparator module. The output of the reference generator may be connected to the RA2 pin if the CVROE bit is set. Enabling the voltage reference output onto RA2 when it is configured as a digital input will increase current consumption. Connecting RA2 as a digital output with CVRSS enabled will also increase current consumption. The RA2 pin can be used as a simple D/A output with limited drive capability. Due to the limited current drive capability, a buffer must be used on the voltage reference output for external connections to VREF. Figure 21-2 shows an example buffering technique. 16-to-1 MUX CVR3:CVR0 8R CVREN R CVRSS = 0 VDD VREF+ CVRSS = 1 8R CVRSS = 0 VREFCVRSS = 1 R R R R R R 16 Steps CVRR CVREF © 2007 Microchip Technology Inc. Preliminary DS39631B-page 241 PIC18F2420/2520/4420/4520 FIGURE 21-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE TABLE 21-1: REGISTERS ASSOCIATED WITH COMPARATOR VOLTAGE REFERENCE CVREF Output + – CVREF Module Voltage Reference Output Impedance R(1) RA2 Note 1: R is dependent upon the voltage reference configuration bits, CVRCON<3:0> and CVRCON<5>. PIC18FXXXX Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page CVRCON CVREN CVROE CVRR CVRSS CVR3 CVR2 CVR1 CVR0 51 CMCON C2OUT C1OUT C2INV C1INV CIS CM2 CM1 CM0 51 TRISA TRISA7(1) TRISA6(1) PORTA Data Direction Control Register 52 Legend: Shaded cells are not used with the comparator voltage reference. Note 1: PORTA pins are enabled based on oscillator configuration. PIC18F2420/2520/4420/4520 DS39631B-page 242 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS39631B-page 243 PIC18F2420/2520/4420/4520 22.0 HIGH/LOW-VOLTAGE DETECT (HLVD) PIC18F2420/2520/4420/4520 devices have a High/Low-Voltage Detect module (HLVD). This is a programmable circuit that allows the user to specify both a device voltage trip point and the direction of change from that point. If the device experiences an excursion past the trip point in that direction, an interrupt flag is set. If the interrupt is enabled, the program execution will branch to the interrupt vector address and the software can then respond to the interrupt. The High/Low-Voltage Detect Control register (Register 22-1) completely controls the operation of the HLVD module. This allows the circuitry to be “turned off” by the user under software control, which minimizes the current consumption for the device. The block diagram for the HLVD module is shown in Figure 22-1. REGISTER 22-1: HLVDCON REGISTER (HIGH/LOW-VOLTAGE DETECT CONTROL) R/W-0 U-0 R-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-1 VDIRMAG — IRVST HLVDEN HLVDL3(1) HLVDL2(1) HLVDL1(1) HLVDL0(1) bit 7 bit 0 bit 7 VDIRMAG: Voltage Direction Magnitude Select bit 1 = Event occurs when voltage equals or exceeds trip point (HLVDL3:HLDVL0) 0 = Event occurs when voltage equals or falls below trip point (HLVDL3:HLVDL0) bit 6 Unimplemented: Read as ‘0’ bit 5 IRVST: Internal Reference Voltage Stable Flag bit 1 = Indicates that the voltage detect logic will generate the interrupt flag at the specified voltage range 0 = Indicates that the voltage detect logic will not generate the interrupt flag at the specified voltage range and the HLVD interrupt should not be enabled bit 4 HLVDEN: High/Low-Voltage Detect Power Enable bit 1 = HLVD enabled 0 = HLVD disabled bit 3-0 HLVDL3:HLVDL0: Voltage Detection Limit bits(1) 1111 = External analog input is used (input comes from the HLVDIN pin) 1110 = Maximum setting . . . 0000 = Minimum setting Note 1: See Table 26-4 for specifications. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown PIC18F2420/2520/4420/4520 DS39631B-page 244 © 2007 Microchip Technology Inc. The module is enabled by setting the HLVDEN bit. Each time that the HLVD module is enabled, the circuitry requires some time to stabilize. The IRVST bit is a read-only bit and is used to indicate when the circuit is stable. The module can only generate an interrupt after the circuit is stable and IRVST is set. The VDIRMAG bit determines the overall operation of the module. When VDIRMAG is cleared, the module monitors for drops in VDD below a predetermined set point. When the bit is set, the module monitors for rises in VDD above the set point. 22.1 Operation When the HLVD module is enabled, a comparator uses an internally generated reference voltage as the set point. The set point is compared with the trip point, where each node in the resistor divider represents a trip point voltage. The “trip point” voltage is the voltage level at which the device detects a high or low-voltage event, depending on the configuration of the module. When the supply voltage is equal to the trip point, the voltage tapped off of the resistor array is equal to the internal reference voltage generated by the voltage reference module. The comparator then generates an interrupt signal by setting the HLVDIF bit. The trip point voltage is software programmable to any one of 16 values. The trip point is selected by programming the HLVDL3:HLVDL0 bits (HLVDCON<3:0>). The HLVD module has an additional feature that allows the user to supply the trip voltage to the module from an external source. This mode is enabled when bits HLVDL3:HLVDL0 are set to ‘1111’. In this state, the comparator input is multiplexed from the external input pin, HLVDIN. This gives users flexibility because it allows them to configure the High/Low-Voltage Detect interrupt to occur at any voltage in the valid operating range. FIGURE 22-1: HLVD MODULE BLOCK DIAGRAM (WITH EXTERNAL INPUT) Set VDD 16 to 1 MUX HLVDEN HLVDCON HLVDIN HLVDL3:HLVDL0 Register HLVDIN VDD Externally Generated Trip Point HLVDIF HLVDEN BOREN Internal Voltage Reference VDIRMAG © 2007 Microchip Technology Inc. DS39631B-page 245 PIC18F2420/2520/4420/4520 22.2 HLVD Setup The following steps are needed to set up the HLVD module: 1. Write the value to the HLVDL3:HLVDL0 bits that selects the desired HLVD trip point. 2. Set the VDIRMAG bit to detect high voltage (VDIRMAG = 1) or low voltage (VDIRMAG = 0). 3. Enable the HLVD module by setting the HLVDEN bit. 4. Clear the HLVD interrupt flag (PIR2<2>), which may have been set from a previous interrupt. 5. Enable the HLVD interrupt if interrupts are desired by setting the HLVDIE and GIE bits (PIE2<2> and INTCON<7>). An interrupt will not be generated until the IRVST bit is set. 22.3 Current Consumption When the module is enabled, the HLVD comparator and voltage divider are enabled and will consume static current. The total current consumption, when enabled, is specified in electrical specification parameter D022B. Depending on the application, the HLVD module does not need to be operating constantly. To decrease the current requirements, the HLVD circuitry may only need to be enabled for short periods where the voltage is checked. After doing the check, the HLVD module may be disabled. 22.4 HLVD Start-up Time The internal reference voltage of the HLVD module, specified in electrical specification parameter D420, may be used by other internal circuitry, such as the Programmable Brown-out Reset. If the HLVD or other circuits using the voltage reference are disabled to lower the device’s current consumption, the reference voltage circuit will require time to become stable before a low or high-voltage condition can be reliably detected. This start-up time, TIRVST, is an interval that is independent of device clock speed. It is specified in electrical specification parameter 36. The HLVD interrupt flag is not enabled until TIRVST has expired and a stable reference voltage is reached. For this reason, brief excursions beyond the set point may not be detected during this interval. Refer to Figure 22-2 or Figure 22-3. FIGURE 22-2: LOW-VOLTAGE DETECT OPERATION (VDIRMAG = 0) VLVD VDD HLVDIF VLVD VDD Enable HLVD TIVRST HLVDIF may not be set Enable HLVD HLVDIF HLVDIF cleared in software HLVDIF cleared in software HLVDIF cleared in software, CASE 1: CASE 2: HLVDIF remains set since HLVD condition still exists TIVRST Internal Reference is stable Internal Reference is stable IRVST IRVST PIC18F2420/2520/4420/4520 DS39631B-page 246 © 2007 Microchip Technology Inc. FIGURE 22-3: HIGH-VOLTAGE DETECT OPERATION (VDIRMAG = 1) 22.5 Applications In many applications, the ability to detect a drop below or rise above a particular threshold is desirable. For example, the HLVD module could be periodically enabled to detect Universal Serial Bus (USB) attach or detach. This assumes the device is powered by a lower voltage source than the USB when detached. An attach would indicate a high-voltage detect from, for example, 3.3V to 5V (the voltage on USB) and vice versa for a detach. This feature could save a design a few extra components and an attach signal (input pin). For general battery applications, Figure 22-4 shows a possible voltage curve. Over time, the device voltage decreases. When the device voltage reaches voltage VA, the HLVD logic generates an interrupt at time TA. The interrupt could cause the execution of an ISR, which would allow the application to perform “housekeeping tasks” and perform a controlled shutdown before the device voltage exits the valid operating range at TB. The HLVD, thus, would give the application a time window, represented by the difference between TA and TB, to safely exit. FIGURE 22-4: TYPICAL LOW-VOLTAGE DETECT APPLICATION VLVD VDD HLVDIF VLVD VDD Enable HLVD TIVRST HLVDIF may not be set Enable HLVD HLVDIF HLVDIF cleared in software HLVDIF cleared in software HLVDIF cleared in software, CASE 1: CASE 2: HLVDIF remains set since HLVD condition still exists TIVRST IRVST Internal Reference is stable Internal Reference is stable IRVST Time Voltage VA VB TA TB VA = HLVD trip point VB = Minimum valid device operating voltage Legend: © 2007 Microchip Technology Inc. DS39631B-page 247 PIC18F2420/2520/4420/4520 22.6 Operation During Sleep When enabled, the HLVD circuitry continues to operate during Sleep. If the device voltage crosses the trip point, the HLVDIF bit will be set and the device will wake-up from Sleep. Device execution will continue from the interrupt vector address if interrupts have been globally enabled. 22.7 Effects of a Reset A device Reset forces all registers to their Reset state. This forces the HLVD module to be turned off. TABLE 22-1: REGISTERS ASSOCIATED WITH HIGH/LOW-VOLTAGE DETECT MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on Page HLVDCON VDIRMAG — IRVST HLVDEN HLVDL3 HLVDL2 HLVDL1 HLVDL0 50 INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RBIE TMR0IF INT0IF RBIF 49 PIR2 OSCFIF CMIF — EEIF BCLIF HLVDIF TMR3IF CCP2IF 52 PIE2 OCSFIE CMIE — EEIE BCLIE HLVDIE TMR3IE CCP2IE 52 IPR2 OSCFIP CMIP — EEIP BCLIP HLVDIP TMR3IP CCP2IP 52 Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the HLVD module. PIC18F2420/2520/4420/4520 DS39631B-page 248 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 249 PIC18F2420/2520/4420/4520 23.0 SPECIAL FEATURES OF THE CPU PIC18F2420/2520/4420/4520 devices include several features intended to maximize reliability and minimize cost through elimination of external components. These are: • Oscillator Selection • Resets: - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Fail-Safe Clock Monitor • Two-Speed Start-up • Code Protection • ID Locations • In-Circuit Serial Programming The oscillator can be configured for the application depending on frequency, power, accuracy and cost. All of the options are discussed in detail in Section 2.0 “Oscillator Configurations”. A complete discussion of device Resets and interrupts is available in previous sections of this data sheet. In addition to their Power-up and Oscillator Start-up Timers provided for Resets, PIC18F2420/2520/4420/ 4520 devices have a Watchdog Timer, which is either permanently enabled via the configuration bits or software controlled (if configured as disabled). The inclusion of an internal RC oscillator also provides the additional benefits of a Fail-Safe Clock Monitor (FSCM) and Two-Speed Start-up. FSCM provides for background monitoring of the peripheral clock and automatic switchover in the event of its failure. Two- Speed Start-up enables code to be executed almost immediately on start-up, while the primary clock source completes its start-up delays. All of these features are enabled and configured by setting the appropriate configuration register bits. 23.1 Configuration Bits The configuration bits can be programmed (read as ‘0’) or left unprogrammed (read as ‘1’) to select various device configurations. These bits are mapped starting at program memory location 300000h. The user will note that address 300000h is beyond the user program memory space. In fact, it belongs to the configuration memory space (300000h-3FFFFFh), which can only be accessed using table reads and table writes. Programming the configuration registers is done in a manner similar to programming the Flash memory. The WR bit in the EECON1 register starts a self-timed write to the configuration register. In normal operation mode, a TBLWT instruction with the TBLPTR pointing to the configuration register sets up the address and the data for the configuration register write. Setting the WR bit starts a long write to the configuration register. The configuration registers are written a byte at a time. To write or erase a configuration cell, a TBLWT instruction can write a ‘1’ or a ‘0’ into the cell. For additional details on Flash programming, refer to Section 6.5 “Writing to Flash Program Memory”. TABLE 23-1: CONFIGURATION BITS AND DEVICE IDs File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Default/ Unprogrammed Value 300001h CONFIG1H IESO FCMEN — — FOSC3 FOSC2 FOSC1 FOSC0 00-- 0111 300002h CONFIG2L — — — BORV1 BORV0 BOREN1 BOREN0 PWRTEN ---1 1111 300003h CONFIG2H — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN ---1 1111 300005h CONFIG3H MCLRE — — — — LPT1OSC PBADEN CCP2MX 1--- -011 300006h CONFIG4L DEBUG XINST — — — LVP — STVREN 10-- -1-1 300008h CONFIG5L — — — — CP3(1) CP2(1) CP1 CP0 ---- 1111 300009h CONFIG5H CPD CPB — — — — — — 11-- ---- 30000Ah CONFIG6L — — — — WRT3(1) WRT2(1) WRT1 WRT0 ---- 1111 30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 111- ---- 30000Ch CONFIG7L — — — — EBTR3(1) EBTR2(1) EBTR1 EBTR0 ---- 1111 30000Dh CONFIG7H — EBTRB — — — — — — -1-- ---- 3FFFFEh DEVID1(1) DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 xxxx xxxx(2) 3FFFFFh DEVID2(1) DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 0000 1100 Legend: x = unknown, u = unchanged, — = unimplemented, q = value depends on condition. Shaded cells are unimplemented, read as ‘0’. Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. 2: See Register 23-14 for DEVID1 values. DEVID registers are read-only and cannot be programmed by the user. PIC18F2420/2520/4420/4520 DS39631B-page 250 Preliminary © 2007 Microchip Technology Inc. REGISTER 23-1: CONFIG1H: CONFIGURATION REGISTER 1 HIGH (BYTE ADDRESS 300001h) R/P-0 R/P-0 U-0 U-0 R/P-0 R/P-1 R/P-1 R/P-1 IESO FCMEN — — FOSC3 FOSC2 FOSC1 FOSC0 bit 7 bit 0 bit 7 IESO: Internal/External Oscillator Switchover bit 1 = Oscillator Switchover mode enabled 0 = Oscillator Switchover mode disabled bit 6 FCMEN: Fail-Safe Clock Monitor Enable bit 1 = Fail-Safe Clock Monitor enabled 0 = Fail-Safe Clock Monitor disabled bit 5-4 Unimplemented: Read as ‘0’ bit 3-0 FOSC3:FOSC0: Oscillator Selection bits 11xx = External RC oscillator, CLKO function on RA6 101x = External RC oscillator, CLKO function on RA6 1001 = Internal oscillator block, CLKO function on RA6, port function on RA7 1000 = Internal oscillator block, port function on RA6 and RA7 0111 = External RC oscillator, port function on RA6 0110 = HS oscillator, PLL enabled (Clock Frequency = 4 x FOSC1) 0101 = EC oscillator, port function on RA6 0100 = EC oscillator, CLKO function on RA6 0011 = External RC oscillator, CLKO function on RA6 0010 = HS oscillator 0001 = XT oscillator 0000 = LP oscillator Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state © 2007 Microchip Technology Inc. Preliminary DS39631B-page 251 PIC18F2420/2520/4420/4520 REGISTER 23-2: CONFIG2L: CONFIGURATION REGISTER 2 LOW (BYTE ADDRESS 300002h) U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — BORV1(1) BORV0(1) BOREN1(2) BOREN0(2) PWRTEN(2) bit 7 bit 0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-3 BORV1:BORV0: Brown-out Reset Voltage bits(1) 11 = Maximum setting . . . 00 = Minimum setting bit 2-1 BOREN1:BOREN0: Brown-out Reset Enable bits(2) 11 = Brown-out Reset enabled in hardware only (SBOREN is disabled) 10 = Brown-out Reset enabled in hardware only and disabled in Sleep mode (SBOREN is disabled) 01 = Brown-out Reset enabled and controlled by software (SBOREN is enabled) 00 = Brown-out Reset disabled in hardware and software bit 0 PWRTEN: Power-up Timer Enable bit(2) 1 = PWRT disabled 0 = PWRT enabled Note 1: See Section 26.1 “DC Characteristics: Supply Voltage” for specifications. 2: The Power-up Timer is decoupled from Brown-out Reset, allowing these features to be independently controlled. Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state PIC18F2420/2520/4420/4520 DS39631B-page 252 Preliminary © 2007 Microchip Technology Inc. REGISTER 23-3: CONFIG2H: CONFIGURATION REGISTER 2 HIGH (BYTE ADDRESS 300003h) U-0 U-0 U-0 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 WDTEN bit 7 bit 0 bit 7-5 Unimplemented: Read as ‘0’ bit 4-1 WDTPS3:WDTPS0: Watchdog Timer Postscale Select bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 bit 0 WDTEN: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled (control is placed on the SWDTEN bit) Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state © 2007 Microchip Technology Inc. Preliminary DS39631B-page 253 PIC18F2420/2520/4420/4520 REGISTER 23-4: CONFIG3H: CONFIGURATION REGISTER 3 HIGH (BYTE ADDRESS 300005h) REGISTER 23-5: CONFIG4L: CONFIGURATION REGISTER 4 LOW (BYTE ADDRESS 300006h) R/P-1 U-0 U-0 U-0 U-0 R/P-0 R/P-1 R/P-1 MCLRE — — — — LPT1OSC PBADEN CCP2MX bit 7 bit 0 bit 7 MCLRE: MCLR Pin Enable bit 1 = MCLR pin enabled; RE3 input pin disabled 0 = RE3 input pin enabled; MCLR disabled bit 6-3 Unimplemented: Read as ‘0’ bit 2 LPT1OSC: Low-Power Timer1 Oscillator Enable bit 1 = Timer1 configured for low-power operation 0 = Timer1 configured for higher power operation bit 1 PBADEN: PORTB A/D Enable bit (Affects ADCON1 Reset state. ADCON1 controls PORTB<4:0> pin configuration.) 1 = PORTB<4:0> pins are configured as analog input channels on Reset 0 = PORTB<4:0> pins are configured as digital I/O on Reset bit 0 CCP2MX: CCP2 Mux bit 1 = CCP2 input/output is multiplexed with RC1 0 = CCP2 input/output is multiplexed with RB3 Legend: R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state R/P-1 R/P-0 U-0 U-0 U-0 R/P-1 U-0 R/P-1 DEBUG XINST — — — LVP — STVREN bit 7 bit 0 bit 7 DEBUG: Background Debugger Enable bit 1 = Background debugger disabled, RB6 and RB7 configured as general purpose I/O pins 0 = Background debugger enabled, RB6 and RB7 are dedicated to In-Circuit Debug bit 6 XINST: Extended Instruction Set Enable bit 1 = Instruction set extension and Indexed Addressing mode enabled 0 = Instruction set extension and Indexed Addressing mode disabled (Legacy mode) bit 5-3 Unimplemented: Read as ‘0’ bit 2 LVP: Single-Supply ICSP Enable bit 1 = Single-Supply ICSP enabled 0 = Single-Supply ICSP disabled bit 1 Unimplemented: Read as ‘0’ bit 0 STVREN: Stack Full/Underflow Reset Enable bit 1 = Stack full/underflow will cause Reset 0 = Stack full/underflow will not cause Reset Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state PIC18F2420/2520/4420/4520 DS39631B-page 254 Preliminary © 2007 Microchip Technology Inc. REGISTER 23-6: CONFIG5L: CONFIGURATION REGISTER 5 LOW (BYTE ADDRESS 300008h) REGISTER 23-7: CONFIG5H: CONFIGURATION REGISTER 5 HIGH (BYTE ADDRESS 300009h) U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1 — — — — CP3(1,2) CP2(1) CP1 CP0 bit 7 bit 0 bit 7-4 Unimplemented: Read as ‘0’ bit 3 CP3: Code Protection bit(1,2) 1 = Block 3 (006000-007FFFh) not code-protected 0 = Block 3 (006000-007FFFh) code-protected bit 2 CP2: Code Protection bit(1) 1 = Block 2 (004000-005FFFh) not code-protected 0 = Block 2 (004000-005FFFh) code-protected bit 1 CP1: Code Protection bit 1 = Block 1 (002000-003FFFh) not code-protected 0 = Block 1 (002000-003FFFh) code-protected bit 0 CP0: Code Protection bit 1 = Block 0 (000800-001FFFh) not code-protected 0 = Block 0 (000800-001FFFh) code-protected Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. 2: Unimplemented in PIC18F2425/4425 devices; maintain this bit set. Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state R/C-1 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0 CPD CPB — — — — — — bit 7 bit 0 bit 7 CPD: Data EEPROM Code Protection bit 1 = Data EEPROM not code-protected 0 = Data EEPROM code-protected bit 6 CPB: Boot Block Code Protection bit 1 = Boot block (000000-0007FFh) not code-protected 0 = Boot block (000000-0007FFh) code-protected bit 5-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state © 2007 Microchip Technology Inc. Preliminary DS39631B-page 255 PIC18F2420/2520/4420/4520 REGISTER 23-8: CONFIG6L: CONFIGURATION REGISTER 6 LOW (BYTE ADDRESS 30000Ah) REGISTER 23-9: CONFIG6H: CONFIGURATION REGISTER 6 HIGH (BYTE ADDRESS 30000Bh) U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1 — — — — WRT3(1,2) WRT2(1) WRT1 WRT0 bit 7 bit 0 bit 7-4 Unimplemented: Read as ‘0’ bit 3 WRT3: Write Protection bit(1,2) 1 = Block 3 (006000-007FFFh) not write-protected 0 = Block 3 (006000-007FFFh) write-protected bit 2 WRT2: Write Protection bit(1) 1 = Block 2 (004000-005FFFh) not write-protected 0 = Block 2 (004000-005FFFh) write-protected bit 1 WRT1: Write Protection bit 1 = Block 1 (002000-003FFFh) not write-protected 0 = Block 1 (002000-003FFFh) write-protected bit 0 WRT0: Write Protection bit 1 = Block 0 (000800-001FFFh) not write-protected 0 = Block 0 (000800-001FFFh) write-protected Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. 2: Unimplemented in PIC18F2425/4425 devices; maintain this bit set. Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state R/C-1 R/C-1 R-1 U-0 U-0 U-0 U-0 U-0 WRTD WRTB WRTC(1) — — — — — bit 7 bit 0 bit 7 WRTD: Data EEPROM Write Protection bit 1 = Data EEPROM not write-protected 0 = Data EEPROM write-protected bit 6 WRTB: Boot Block Write Protection bit 1 = Boot block (000000-0007FFh) not write-protected 0 = Boot block (000000-0007FFh) write-protected bit 5 WRTC: Configuration Register Write Protection bit(1) 1 = Configuration registers (300000-3000FFh) not write-protected 0 = Configuration registers (300000-3000FFh) write-protected Note 1: This bit is read-only in normal execution mode; it can be written only in Program mode. bit 4-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ - n = Value when device is unprogrammed u = Unchanged from programmed state PIC18F2420/2520/4420/4520 DS39631B-page 256 Preliminary © 2007 Microchip Technology Inc. REGISTER 23-10: CONFIG7L: CONFIGURATION REGISTER 7 LOW (BYTE ADDRESS 30000Ch) REGISTER 23-11: CONFIG7H: CONFIGURATION REGISTER 7 HIGH (BYTE ADDRESS 30000Dh) U-0 U-0 U-0 U-0 R/C-1 R/C-1 R/C-1 R/C-1 — — — — EBTR3(1,2) EBTR2(1) EBTR1 EBTR0 bit 7 bit 0 bit 7-4 Unimplemented: Read as ‘0’ bit 3 EBTR3: Table Read Protection bit(1,2) 1 = Block 3 (006000-007FFFh) not protected from table reads executed in other blocks 0 = Block 3 (006000-007FFFh) protected from table reads executed in other blocks bit 2 EBTR2: Table Read Protection bit(1) 1 = Block 2 (004000-005FFFh) not protected from table reads executed in other blocks 0 = Block 2 (004000-005FFFh) protected from table reads executed in other blocks bit 1 EBTR1: Table Read Protection bit 1 = Block 1 (002000-003FFFh) not protected from table reads executed in other blocks 0 = Block 1 (002000-003FFFh) protected from table reads executed in other blocks bit 0 EBTR0: Table Read Protection bit 1 = Block 0 (000800-001FFFh) not protected from table reads executed in other blocks 0 = Block 0 (000800-001FFFh) protected from table reads executed in other blocks Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. 2: Unimplemented in PIC18F2425/4425 devices; maintain this bit set. Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state U-0 R/C-1 U-0 U-0 U-0 U-0 U-0 U-0 — EBTRB — — — — — — bit 7 bit 0 bit 7 Unimplemented: Read as ‘0’ bit 6 EBTRB: Boot Block Table Read Protection bit 1 = Boot block (000000-0007FFh) not protected from table reads executed in other blocks 0 = Boot block (000000-0007FFh) protected from table reads executed in other blocks bit 5-0 Unimplemented: Read as ‘0’ Legend: R = Readable bit C = Clearable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state © 2007 Microchip Technology Inc. Preliminary DS39631B-page 257 PIC18F2420/2520/4420/4520 REGISTER 23-12: DEVID1: DEVICE ID REGISTER 1 FOR PIC18F2420/2520/4420/4520 REGISTER 23-13: DEVID2: DEVICE ID REGISTER 2 FOR PIC18F2420/2520/4420/4520 R R R R R R R R DEV2 DEV1 DEV0 REV4 REV3 REV2 REV1 REV0 bit 7 bit 0 bit 7-5 DEV2:DEV0: Device ID bits 000 = PIC18F4520 010 = PIC18F4420 100 = PIC18F2520 110 = PIC18F2420 bit 4-0 REV4:REV0: Revision ID bits These bits are used to indicate the device revision. Legend: R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state R R R R R R R R DEV10 DEV9 DEV8 DEV7 DEV6 DEV5 DEV4 DEV3 bit 7 bit 0 bit 7-0 DEV10:DEV3: Device ID bits These bits are used with the DEV2:DEV0 bits in the Device ID Register 1 to identify the part number. 0000 1100 = PIC18F2420/2520/4420/4520 devices Note: These values for DEV10:DEV3 may be shared with other devices. The specific device is always identified by using the entire DEV10:DEV0 bit sequence. Legend: R = Read-only bit P = Programmable bit U = Unimplemented bit, read as ‘0’ -n = Value when device is unprogrammed u = Unchanged from programmed state PIC18F2420/2520/4420/4520 DS39631B-page 258 Preliminary © 2007 Microchip Technology Inc. 23.2 Watchdog Timer (WDT) For PIC18F2420/2520/4420/4520 devices, the WDT is driven by the INTRC source. When the WDT is enabled, the clock source is also enabled. The nominal WDT period is 4 ms and has the same stability as the INTRC oscillator. The 4 ms period of the WDT is multiplied by a 16-bit postscaler. Any output of the WDT postscaler is selected by a multiplexer, controlled by bits in Configuration Register 2H. Available periods range from 4 ms to 131.072 seconds (2.18 minutes). The WDT and postscaler are cleared when any of the following events occur: a SLEEP or CLRWDT instruction is executed, the IRCF bits (OSCCON<6:4>) are changed or a clock failure has occurred. 23.2.1 CONTROL REGISTER Register 23-14 shows the WDTCON register. This is a readable and writable register which contains a control bit that allows software to override the WDT enable configuration bit, but only if the configuration bit has disabled the WDT. FIGURE 23-1: WDT BLOCK DIAGRAM Note 1: The CLRWDT and SLEEP instructions clear the WDT and postscaler counts when executed. 2: Changing the setting of the IRCF bits (OSCCON<6:4>) clears the WDT and postscaler counts. 3: When a CLRWDT instruction is executed, the postscaler count will be cleared. INTRC Source WDT Wake-up Reset WDT Counter Programmable Postscaler 1:1 to 1:32,768 Enable WDT WDTPS<3:0> SWDTEN WDTEN CLRWDT 4 from Power Reset All Device Resets Sleep ÷128 Change on IRCF bits Managed Modes © 2007 Microchip Technology Inc. Preliminary DS39631B-page 259 PIC18F2420/2520/4420/4520 REGISTER 23-14: WDTCON REGISTER TABLE 23-2: SUMMARY OF WATCHDOG TIMER REGISTERS U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 — — — — — — — SWDTEN(1) bit 7 bit 0 bit 7-1 Unimplemented: Read as ‘0’ bit 0 SWDTEN: Software Controlled Watchdog Timer Enable bit(1) 1 = Watchdog Timer is on 0 = Watchdog Timer is off Note 1: This bit has no effect if the configuration bit, WDTEN, is enabled. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset Values on page RCON IPEN SBOREN — RI TO PD POR BOR 48 WDTCON — — — — — — — SWDTEN 50 Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Watchdog Timer. PIC18F2420/2520/4420/4520 DS39631B-page 260 Preliminary © 2007 Microchip Technology Inc. 23.3 Two-Speed Start-up The Two-Speed Start-up feature helps to minimize the latency period from oscillator start-up to code execution by allowing the microcontroller to use the INTOSC oscillator as a clock source until the primary clock source is available. It is enabled by setting the IESO configuration bit. Two-Speed Start-up should be enabled only if the primary oscillator mode is LP, XT, HS or HSPLL (crystal-based modes). Other sources do not require an OST start-up delay; for these, Two-Speed Start-up should be disabled. When enabled, Resets and wake-ups from Sleep mode cause the device to configure itself to run from the internal oscillator block as the clock source, following the time-out of the Power-up Timer after a Power-on Reset is enabled. This allows almost immediate code execution while the primary oscillator starts and the OST is running. Once the OST times out, the device automatically switches to PRI_RUN mode. To use a higher clock speed on wake-up, the INTOSC or postscaler clock sources can be selected to provide a higher clock speed by setting bits IRCF2:IRCF0 immediately after Reset. For wake-ups from Sleep, the INTOSC or postscaler clock sources can be selected by setting the IRCF2:IRCF0 bits prior to entering Sleep mode. In all other power managed modes, Two-Speed Startup is not used. The device will be clocked by the currently selected clock source until the primary clock source becomes available. The setting of the IESO bit is ignored. 23.3.1 SPECIAL CONSIDERATIONS FOR USING TWO-SPEED START-UP While using the INTOSC oscillator in Two-Speed Startup, the device still obeys the normal command sequences for entering power managed modes, including multiple SLEEP instructions (refer to Section 3.1.4 “Multiple Sleep Commands”). In practice, this means that user code can change the SCS1:SCS0 bit settings or issue SLEEP instructions before the OST times out. This would allow an application to briefly wake-up, perform routine “housekeeping” tasks and return to Sleep before the device starts to operate from the primary oscillator. User code can also check if the primary clock source is currently providing the device clocking by checking the status of the OSTS bit (OSCCON<3>). If the bit is set, the primary oscillator is providing the clock. Otherwise, the internal oscillator block is providing the clock during wake-up from Reset or Sleep mode. FIGURE 23-2: TIMING TRANSITION FOR TWO-SPEED START-UP (INTOSC TO HSPLL) Q1 Q3 Q4 OSC1 Peripheral Program PC PC + 2 INTOSC PLL Clock Q1 PC + 6 Q2 Output Q3 Q4 Q1 CPU Clock PC + 4 Clock Counter Q2 Q2 Q3 Note 1: TOST = 1024 TOSC; TPLL = 2 ms (approx). These intervals are not shown to scale. 2: Clock transition typically occurs within 2-4 TOSC. Wake from Interrupt Event TPLL(1) 1 2 n-1 n Clock OSTS bit Set Transition(2) Multiplexer TOST(1) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 261 PIC18F2420/2520/4420/4520 23.4 Fail-Safe Clock Monitor The Fail-Safe Clock Monitor (FSCM) allows the microcontroller to continue operation in the event of an external oscillator failure by automatically switching the device clock to the internal oscillator block. The FSCM function is enabled by setting the FCMEN configuration bit. When FSCM is enabled, the INTRC oscillator runs at all times to monitor clocks to peripherals and provide a backup clock in the event of a clock failure. Clock monitoring (shown in Figure 23-3) is accomplished by creating a sample clock signal, which is the INTRC output divided by 64. This allows ample time between FSCM sample clocks for a peripheral clock edge to occur. The peripheral device clock and the sample clock are presented as inputs to the Clock Monitor latch (CM). The CM is set on the falling edge of the device clock source, but cleared on the rising edge of the sample clock. FIGURE 23-3: FSCM BLOCK DIAGRAM Clock failure is tested for on the falling edge of the sample clock. If a sample clock falling edge occurs while CM is still set, a clock failure has been detected (Figure 23-4). This causes the following: • the FSCM generates an oscillator fail interrupt by setting bit, OSCFIF (PIR2<7>); • the device clock source is switched to the internal oscillator block (OSCCON is not updated to show the current clock source – this is the fail-safe condition) and • the WDT is reset. During switchover, the postscaler frequency from the internal oscillator block may not be sufficiently stable for timing sensitive applications. In these cases, it may be desirable to select another clock configuration and enter an alternate power managed mode. This can be done to attempt a partial recovery or execute a controlled shutdown. See Section 3.1.4 “Multiple Sleep Commands” and Section 23.3.1 “Special Considerations for Using Two-Speed Start-up” for more details. To use a higher clock speed on wake-up, the INTOSC or postscaler clock sources can be selected to provide a higher clock speed by setting bits, IRCF2:IRCF0, immediately after Reset. For wake-ups from Sleep, the INTOSC or postscaler clock sources can be selected by setting the IRCF2:IRCF0 bits prior to entering Sleep mode. The FSCM will detect failures of the primary or secondary clock sources only. If the internal oscillator block fails, no failure would be detected, nor would any action be possible. 23.4.1 FSCM AND THE WATCHDOG TIMER Both the FSCM and the WDT are clocked by the INTRC oscillator. Since the WDT operates with a separate divider and counter, disabling the WDT has no effect on the operation of the INTRC oscillator when the FSCM is enabled. As already noted, the clock source is switched to the INTOSC clock when a clock failure is detected. Depending on the frequency selected by the IRCF2:IRCF0 bits, this may mean a substantial change in the speed of code execution. If the WDT is enabled with a small prescale value, a decrease in clock speed allows a WDT time-out to occur and a subsequent device Reset. For this reason, fail-safe clock events also reset the WDT and postscaler, allowing it to start timing from when execution speed was changed and decreasing the likelihood of an erroneous time-out. 23.4.2 EXITING FAIL-SAFE OPERATION The fail-safe condition is terminated by either a device Reset or by entering a power managed mode. On Reset, the controller starts the primary clock source specified in Configuration Register 1H (with any required start-up delays that are required for the oscillator mode, such as OST or PLL timer). The INTOSC multiplexer provides the device clock until the primary clock source becomes ready (similar to a Two-Speed Start-up). The clock source is then switched to the primary clock (indicated by the OSTS bit in the OSCCON register becoming set). The Fail-Safe Clock Monitor then resumes monitoring the peripheral clock. The primary clock source may never become ready during start-up. In this case, operation is clocked by the INTOSC multiplexer. The OSCCON register will remain in its Reset state until a power managed mode is entered. Peripheral INTRC ÷ 64 S C Q (32 μs) 488 Hz (2.048 ms) Clock Monitor Latch (CM) (edge-triggered) Clock Failure Detected Source Clock Q PIC18F2420/2520/4420/4520 DS39631B-page 262 Preliminary © 2007 Microchip Technology Inc. FIGURE 23-4: FSCM TIMING DIAGRAM 23.4.3 FSCM INTERRUPTS IN POWER MANAGED MODES By entering a power managed mode, the clock multiplexer selects the clock source selected by the OSCCON register. Fail-Safe Monitoring of the power managed clock source resumes in the power managed mode. If an oscillator failure occurs during power managed operation, the subsequent events depend on whether or not the oscillator failure interrupt is enabled. If enabled (OSCFIF = 1), code execution will be clocked by the INTOSC multiplexer. An automatic transition back to the failed clock source will not occur. If the interrupt is disabled, subsequent interrupts while in Idle mode will cause the CPU to begin executing instructions while being clocked by the INTOSC source. 23.4.4 POR OR WAKE FROM SLEEP The FSCM is designed to detect oscillator failure at any point after the device has exited Power-on Reset (POR) or low-power Sleep mode. When the primary device clock is EC, RC or INTRC modes, monitoring can begin immediately following these events. For oscillator modes involving a crystal or resonator (HS, HSPLL, LP or XT), the situation is somewhat different. Since the oscillator may require a start-up time considerably longer than the FCSM sample clock time, a false clock failure may be detected. To prevent this, the internal oscillator block is automatically configured as the device clock and functions until the primary clock is stable (the OST and PLL timers have timed out). This is identical to Two-Speed Start-up mode. Once the primary clock is stable, the INTRC returns to its role as the FSCM source. As noted in Section 23.3.1 “Special Considerations for Using Two-Speed Start-up”, it is also possible to select another clock configuration and enter an alternate power managed mode while waiting for the primary clock to become stable. When the new power managed mode is selected, the primary clock is disabled. OSCFIF CM Output Device Clock Output Sample Clock Failure Detected Oscillator Failure Note: The device clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity. (Q) CM Test CM Test CM Test Note: The same logic that prevents false oscillator failure interrupts on POR, or wake from Sleep, will also prevent the detection of the oscillator’s failure to start at all following these events. This can be avoided by monitoring the OSTS bit and using a timing routine to determine if the oscillator is taking too long to start. Even so, no oscillator failure interrupt will be flagged. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 263 PIC18F2420/2520/4420/4520 23.5 Program Verification and Code Protection The overall structure of the code protection on the PIC18 Flash devices differs significantly from other PIC® devices. The user program memory is divided into five blocks. One of these is a boot block of 2 Kbytes. The remainder of the memory is divided into four blocks on binary boundaries. Each of the five blocks has three code protection bits associated with them. They are: • Code-Protect bit (CPn) • Write-Protect bit (WRTn) • External Block Table Read bit (EBTRn) Figure 23-5 shows the program memory organization for 16 and 32-Kbyte devices and the specific code protection bit associated with each block. The actual locations of the bits are summarized in Table 23-3. FIGURE 23-5: CODE-PROTECTED PROGRAM MEMORY FOR PIC18F2420/2520/4420/4520 TABLE 23-3: SUMMARY OF CODE PROTECTION REGISTERS File Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 300008h CONFIG5L — — — — CP3(1,2) CP2(1) CP1 CP0 300009h CONFIG5H CPD CPB — — — — — — 30000Ah CONFIG6L — — — — WRT3(1,2) WRT2(1) WRT1 WRT0 30000Bh CONFIG6H WRTD WRTB WRTC — — — — — 30000Ch CONFIG7L — — — — EBTR3(1,2) EBTR2(1) EBTR1 EBTR0 30000Dh CONFIG7H — EBTRB — — — — — — Legend: Shaded cells are unimplemented. Note 1: Unimplemented in PIC18F2420/4420 devices; maintain this bit set. 2: Unimplemented in PIC18F2425/4425 devices; maintain this bit set. MEMORY SIZE/DEVICE Block Code Protection 16 Kbytes Controlled By: (PIC18F2420/4420) 32 Kbytes (PIC18F2520/4520) Address Range Boot Block Boot Block 000000h 0007FFh CPB, WRTB, EBTRB Block 0 Block 0 000800h 001FFFh CP0, WRT0, EBTR0 Block 1 Block 1 002000h 003FFFh CP1, WRT1, EBTR1 Unimplemented Read ‘0’s Block 2 004000h 005FFFh CP2, WRT2, EBTR2 Block 3 006000h 007FFFh CP3, WRT3, EBTR3 Unimplemented Read ‘0’s 1FFFFFh (Unimplemented Memory Space) PIC18F2420/2520/4420/4520 DS39631B-page 264 Preliminary © 2007 Microchip Technology Inc. 23.5.1 PROGRAM MEMORY CODE PROTECTION The program memory may be read to or written from any location using the table read and table write instructions. The device ID may be read with table reads. The configuration registers may be read and written with the table read and table write instructions. In normal execution mode, the CPn bits have no direct effect. CPn bits inhibit external reads and writes. A block of user memory may be protected from table writes if the WRTn configuration bit is ‘0’. The EBTRn bits control table reads. For a block of user memory with the EBTRn bit set to ‘0’, a table read instruction that executes from within that block is allowed to read. A table read instruction that executes from a location outside of that block is not allowed to read and will result in reading ‘0’s. Figures 23-6 through 23-8 illustrate table write and table read protection. FIGURE 23-6: TABLE WRITE (WRTn) DISALLOWED Note: Code protection bits may only be written to a ‘0’ from a ‘1’ state. It is not possible to write a ‘1’ to a bit in the ‘0’ state. Code protection bits are only set to ‘1’ by a full chip erase or block erase function. The full chip erase and block erase functions can only be initiated via ICSP or an external programmer. 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh WRTB, EBTRB = 11 WRT0, EBTR0 = 01 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLWT* TBLPTR = 0008FFh PC = 001FFEh PC = 005FFEh TBLWT* Register Values Program Memory Configuration Bit Settings Results: All table writes disabled to Blockn whenever WRTn = 0. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 265 PIC18F2420/2520/4420/4520 FIGURE 23-7: EXTERNAL BLOCK TABLE READ (EBTRn) DISALLOWED FIGURE 23-8: EXTERNAL BLOCK TABLE READ (EBTRn) ALLOWED WRTB, EBTRB = 11 WRT0, EBTR0 = 10 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLRD* TBLPTR = 0008FFh PC = 003FFEh Results: All table reads from external blocks to Blockn are disabled whenever EBTRn = 0. TABLAT register returns a value of ‘0’. Register Values Program Memory Configuration Bit Settings 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh WRTB, EBTRB = 11 WRT0, EBTR0 = 10 WRT1, EBTR1 = 11 WRT2, EBTR2 = 11 WRT3, EBTR3 = 11 TBLRD* TBLPTR = 0008FFh PC = 001FFEh Register Values Program Memory Configuration Bit Settings Results: Table reads permitted within Blockn, even when EBTRBn = 0. TABLAT register returns the value of the data at the location TBLPTR. 000000h 0007FFh 000800h 001FFFh 002000h 003FFFh 004000h 005FFFh 006000h 007FFFh PIC18F2420/2520/4420/4520 DS39631B-page 266 Preliminary © 2007 Microchip Technology Inc. 23.5.2 DATA EEPROM CODE PROTECTION The entire data EEPROM is protected from external reads and writes by two bits: CPD and WRTD. CPD inhibits external reads and writes of data EEPROM. WRTD inhibits internal and external writes to data EEPROM. The CPU can always read data EEPROM under normal operation, regardless of the protection bit settings. 23.5.3 CONFIGURATION REGISTER PROTECTION The configuration registers can be write-protected. The WRTC bit controls protection of the configuration registers. In normal execution mode, the WRTC bit is readable only. WRTC can only be written via ICSP or an external programmer. 23.6 ID Locations Eight memory locations (200000h-200007h) are designated as ID locations, where the user can store checksum or other code identification numbers. These locations are both readable and writable during normal execution through the TBLRD and TBLWT instructions or during program/verify. The ID locations can be read when the device is code-protected. 23.7 In-Circuit Serial Programming PIC18F2420/2520/4420/4520 devices can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. 23.8 In-Circuit Debugger When the DEBUG configuration bit is programmed to a ‘0’, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB® IDE. When the microcontroller has this feature enabled, some resources are not available for general use. Table 23-4 shows which resources are required by the background debugger. TABLE 23-4: DEBUGGER RESOURCES To use the In-Circuit Debugger function of the microcontroller, the design must implement In-Circuit Serial Programming connections to MCLR/VPP/RE3, VDD, VSS, RB7 and RB6. This will interface to the In-Circuit Debugger module available from Microchip or one of the third party development tool companies. 23.9 Single-Supply ICSP Programming The LVP configuration bit enables Single-Supply ICSP Programming (formerly known as Low-Voltage ICSP Programming or LVP). When Single-Supply Programming is enabled, the microcontroller can be programmed without requiring high voltage being applied to the MCLR/VPP/RE3 pin, but the RB5/KBI1/PGM pin is then dedicated to controlling Program mode entry and is not available as a general purpose I/O pin. While programming, using Single-Supply Programming mode, VDD is applied to the MCLR/VPP/RE3 pin as in normal execution mode. To enter Programming mode, VDD is applied to the PGM pin. If Single-Supply ICSP Programming mode will not be used, the LVP bit can be cleared. RB5/KBI1/PGM then becomes available as the digital I/O pin, RB5. The LVP bit may be set or cleared only when using standard high-voltage programming (VIHH applied to the MCLR/ VPP/RE3 pin). Once LVP has been disabled, only the standard high-voltage programming is available and must be used to program the device. Memory that is not code-protected can be erased using either a block erase, or erased row by row, then written at any specified VDD. If code-protected memory is to be erased, a block erase is required. If a block erase is to be performed when using Low-Voltage Programming, the device must be supplied with VDD of 4.5V to 5.5V. I/O pins: RB6, RB7 Stack: 2 levels Program Memory: 512 bytes Data Memory: 10 bytes Note 1: High-voltage programming is always available, regardless of the state of the LVP bit or the PGM pin, by applying VIHH to the MCLR pin. 2: By default, Single-Supply ICSP is enabled in unprogrammed devices (as supplied from Microchip) and erased devices. 3: When Single-Supply Programming is enabled, the RB5 pin can no longer be used as a general purpose I/O pin. 4: When LVP is enabled, externally pull the PGM pin to VSS to allow normal program execution. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 267 PIC18F2420/2520/4420/4520 24.0 INSTRUCTION SET SUMMARY PIC18F2420/2520/4420/4520 devices incorporate the standard set of 75 PIC18 core instructions, as well as an extended set of 8 new instructions, for the optimization of code that is recursive or that utilizes a software stack. The extended set is discussed later in this section. 24.1 Standard Instruction Set The standard PIC18 instruction set adds many enhancements to the previous PIC® instruction sets, while maintaining an easy migration from these PIC instruction sets. Most instructions are a single program memory word (16 bits), but there are four instructions that require two program memory locations. Each single-word instruction is a 16-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The instruction set is highly orthogonal and is grouped into four basic categories: • Byte-oriented operations • Bit-oriented operations • Literal operations • Control operations The PIC18 instruction set summary in Table 24-2 lists byte-oriented, bit-oriented, literal and control operations. Table 24-1 shows the opcode field descriptions. Most byte-oriented instructions have three operands: 1. The file register (specified by ‘f’) 2. The destination of the result (specified by ‘d’) 3. The accessed memory (specified by ‘a’) The file register designator ‘f’ specifies which file register is to be used by the instruction. The destination designator ‘d’ specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the WREG register. If ‘d’ is one, the result is placed in the file register specified in the instruction. All bit-oriented instructions have three operands: 1. The file register (specified by ‘f’) 2. The bit in the file register (specified by ‘b’) 3. The accessed memory (specified by ‘a’) The bit field designator ‘b’ selects the number of the bit affected by the operation, while the file register designator ‘f’ represents the number of the file in which the bit is located. The literal instructions may use some of the following operands: • A literal value to be loaded into a file register (specified by ‘k’) • The desired FSR register to load the literal value into (specified by ‘f’) • No operand required (specified by ‘—’) The control instructions may use some of the following operands: • A program memory address (specified by ‘n’) • The mode of the CALL or RETURN instructions (specified by ‘s’) • The mode of the table read and table write instructions (specified by ‘m’) • No operand required (specified by ‘—’) All instructions are a single word, except for four double-word instructions. These instructions were made double-word to contain the required information in 32 bits. In the second word, the 4 MSbs are ‘1’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. All single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruction. In these cases, the execution takes two instruction cycles, with the additional instruction cycle(s) executed as a NOP. The double-word instructions execute in two instruction cycles. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 μs. If a conditional test is true, or the program counter is changed as a result of an instruction, the instruction execution time is 2 μs. Two-word branch instructions (if true) would take 3 μs. Figure 24-1 shows the general formats that the instructions can have. All examples use the convention ‘nnh’ to represent a hexadecimal number. The Instruction Set Summary, shown in Table 24-2, lists the standard instructions recognized by the Microchip Assembler (MPASMTM). Section 24.1.1 “Standard Instruction Set” provides a description of each instruction. PIC18F2420/2520/4420/4520 DS39631B-page 268 Preliminary © 2007 Microchip Technology Inc. TABLE 24-1: OPCODE FIELD DESCRIPTIONS Field Description a RAM access bit a = 0: RAM location in Access RAM (BSR register is ignored) a = 1: RAM bank is specified by BSR register bbb Bit address within an 8-bit file register (0 to 7). BSR Bank Select Register. Used to select the current RAM bank. C, DC, Z, OV, N ALU Status bits: Carry, Digit Carry, Zero, Overflow, Negative. d Destination select bit d = 0: store result in WREG d = 1: store result in file register f dest Destination: either the WREG register or the specified register file location. f 8-bit Register file address (00h to FFh) or 2-bit FSR designator (0h to 3h). fs 12-bit Register file address (000h to FFFh). This is the source address. fd 12-bit Register file address (000h to FFFh). This is the destination address. GIE Global Interrupt Enable bit. k Literal field, constant data or label (may be either an 8-bit, 12-bit or a 20-bit value). label Label name. mm The mode of the TBLPTR register for the table read and table write instructions. Only used with table read and table write instructions: * No change to register (such as TBLPTR with table reads and writes) *+ Post-Increment register (such as TBLPTR with table reads and writes) *- Post-Decrement register (such as TBLPTR with table reads and writes) +* Pre-Increment register (such as TBLPTR with table reads and writes) n The relative address (2’s complement number) for relative branch instructions or the direct address for Call/Branch and Return instructions. PC Program Counter. PCL Program Counter Low Byte. PCH Program Counter High Byte. PCLATH Program Counter High Byte Latch. PCLATU Program Counter Upper Byte Latch. PD Power-down bit. PRODH Product of Multiply High Byte. PRODL Product of Multiply Low Byte. s Fast Call/Return mode select bit s = 0: do not update into/from shadow registers s = 1: certain registers loaded into/from shadow registers (Fast mode) TBLPTR 21-bit Table Pointer (points to a Program Memory location). TABLAT 8-bit Table Latch. TO Time-out bit. TOS Top-of-Stack. u Unused or unchanged. WDT Watchdog Timer. WREG Working register (accumulator). x Don’t care (‘0’ or ‘1’). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. zs 7-bit offset value for indirect addressing of register files (source). zd 7-bit offset value for indirect addressing of register files (destination). { } Optional argument. [text] Indicates an indexed address. (text) The contents of text. [expr] Specifies bit n of the register indicated by the pointer expr. → Assigned to. < > Register bit field. ∈ In the set of. italics User defined term (font is Courier). © 2007 Microchip Technology Inc. Preliminary DS39631B-page 269 PIC18F2420/2520/4420/4520 FIGURE 24-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 15 10 9 8 7 0 d = 0 for result destination to be WREG register OPCODE d a f (FILE #) d = 1 for result destination to be file register (f) a = 0 to force Access Bank Bit-oriented file register operations 15 12 11 9 8 7 0 OPCODE b (BIT #) a f (FILE #) b = 3-bit position of bit in file register (f) Literal operations 15 8 7 0 OPCODE k (literal) k = 8-bit immediate value Byte to Byte move operations (2-word) 15 12 11 0 OPCODE f (Source FILE #) CALL, GOTO and Branch operations 15 8 7 0 OPCODE n<7:0> (literal) n = 20-bit immediate value a = 1 for BSR to select bank f = 8-bit file register address a = 0 to force Access Bank a = 1 for BSR to select bank f = 8-bit file register address 15 12 11 0 1111 n<19:8> (literal) 15 12 11 0 1111 f (Destination FILE #) f = 12-bit file register address Control operations Example Instruction ADDWF MYREG, W, B MOVFF MYREG1, MYREG2 BSF MYREG, bit, B MOVLW 7Fh GOTO Label 15 8 7 0 OPCODE n<7:0> (literal) 15 12 11 0 1111 n<19:8> (literal) CALL MYFUNC 15 11 10 0 OPCODE n<10:0> (literal) S = Fast bit BRA MYFUNC 15 8 7 0 OPCODE n<7:0> (literal) BC MYFUNC S PIC18F2420/2520/4420/4520 DS39631B-page 270 Preliminary © 2007 Microchip Technology Inc. TABLE 24-2: PIC18FXXXX INSTRUCTION SET Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb BYTE-ORIENTED OPERATIONS ADDWF ADDWFC ANDWF CLRF COMF CPFSEQ CPFSGT CPFSLT DECF DECFSZ DCFSNZ INCF INCFSZ INFSNZ IORWF MOVF MOVFF MOVWF MULWF NEGF RLCF RLNCF RRCF RRNCF SETF SUBFWB SUBWF SUBWFB SWAPF TSTFSZ XORWF f, d, a f, d, a f, d, a f, a f, d, a f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a f, d, a fs, fd f, a f, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a f, d, a f, d, a f, d, a f, a f, d, a Add WREG and f Add WREG and CARRY bit to f AND WREG with f Clear f Complement f Compare f with WREG, skip = Compare f with WREG, skip > Compare f with WREG, skip < Decrement f Decrement f, Skip if 0 Decrement f, Skip if Not 0 Increment f Increment f, Skip if 0 Increment f, Skip if Not 0 Inclusive OR WREG with f Move f Move fs (source) to 1st word fd (destination) 2nd word Move WREG to f Multiply WREG with f Negate f Rotate Left f through Carry Rotate Left f (No Carry) Rotate Right f through Carry Rotate Right f (No Carry) Set f Subtract f from WREG with borrow Subtract WREG from f Subtract WREG from f with borrow Swap nibbles in f Test f, skip if 0 Exclusive OR WREG with f 1 1 1 1 1 1 (2 or 3) 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 (2 or 3) 1 (2 or 3) 1 1 2 1 1 1 1 1 1 1 1 1 1 1 1 1 (2 or 3) 1 0010 0010 0001 0110 0001 0110 0110 0110 0000 0010 0100 0010 0011 0100 0001 0101 1100 1111 0110 0000 0110 0011 0100 0011 0100 0110 0101 0101 0101 0011 0110 0001 01da0 0da 01da 101a 11da 001a 010a 000a 01da 11da 11da 10da 11da 10da 00da 00da ffff ffff 111a 001a 110a 01da 01da 00da 00da 100a 01da 11da 10da 10da 011a 10da ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff C, DC, Z, OV, N C, DC, Z, OV, N Z, N Z Z, N None None None C, DC, Z, OV, N None None C, DC, Z, OV, N None None Z, N Z, N None None None C, DC, Z, OV, N C, Z, N Z, N C, Z, N Z, N None C, DC, Z, OV, N C, DC, Z, OV, N C, DC, Z, OV, N None None Z, N 1, 2 1, 2 1,2 2 1, 2 4 4 1, 2 1, 2, 3, 4 1, 2, 3, 4 1, 2 1, 2, 3, 4 4 1, 2 1, 2 1 1, 2 1, 2 1, 2 1, 2 4 1, 2 Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 271 PIC18F2420/2520/4420/4520 BIT-ORIENTED OPERATIONS BCF BSF BTFSC BTFSS BTG f, b, a f, b, a f, b, a f, b, a f, d, a Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set Bit Toggle f 1 1 1 (2 or 3) 1 (2 or 3) 1 1001 1000 1011 1010 0111 bbba bbba bbba bbba bbba ffff ffff ffff ffff ffff ffff ffff ffff ffff ffff None None None None None 1, 2 1, 2 3, 4 3, 4 1, 2 CONTROL OPERATIONS BC BN BNC BNN BNOV BNZ BOV BRA BZ CALL CLRWDT DAW GOTO NOP NOP POP PUSH RCALL RESET RETFIE RETLW RETURN SLEEP n n n n n n n n n n, s — — n — — — — n s k s — Branch if Carry Branch if Negative Branch if Not Carry Branch if Not Negative Branch if Not Overflow Branch if Not Zero Branch if Overflow Branch Unconditionally Branch if Zero Call subroutine 1st word 2nd word Clear Watchdog Timer Decimal Adjust WREG Go to address 1st word 2nd word No Operation No Operation Pop top of return stack (TOS) Push top of return stack (TOS) Relative Call Software device Reset Return from interrupt enable Return with literal in WREG Return from Subroutine Go into Standby mode 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 1 (2) 2 1 (2) 2 1 1 2 1 1 1 1 2 1 2 2 2 1 1110 1110 1110 1110 1110 1110 1110 1101 1110 1110 1111 0000 0000 1110 1111 0000 1111 0000 0000 1101 0000 0000 0000 0000 0000 0010 0110 0011 0111 0101 0001 0100 0nnn 0000 110s kkkk 0000 0000 1111 kkkk 0000 xxxx 0000 0000 1nnn 0000 0000 1100 0000 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0000 0000 kkkk kkkk 0000 xxxx 0000 0000 nnnn 1111 0001 kkkk 0001 0000 nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn kkkk kkkk 0100 0111 kkkk kkkk 0000 xxxx 0110 0101 nnnn 1111 000s kkkk 001s 0011 None None None None None None None None None None TO, PD C None None None None None None All GIE/GIEH, PEIE/GIEL None None TO, PD 4 TABLE 24-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. PIC18F2420/2520/4420/4520 DS39631B-page 272 Preliminary © 2007 Microchip Technology Inc. LITERAL OPERATIONS ADDLW ANDLW IORLW LFSR MOVLB MOVLW MULLW RETLW SUBLW XORLW k k k f, k k k k k k k Add literal and WREG AND literal with WREG Inclusive OR literal with WREG Move literal (12-bit) 2nd word to FSR(f) 1st word Move literal to BSR<3:0> Move literal to WREG Multiply literal with WREG Return with literal in WREG Subtract WREG from literal Exclusive OR literal with WREG 1 1 1 2 1 1 1 2 1 1 0000 0000 0000 1110 1111 0000 0000 0000 0000 0000 0000 1111 1011 1001 1110 0000 0001 1110 1101 1100 1000 1010 kkkk kkkk kkkk 00ff kkkk 0000 kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk C, DC, Z, OV, N Z, N Z, N None None None None None C, DC, Z, OV, N Z, N DATA MEMORY ↔ PROGRAM MEMORY OPERATIONS TBLRD* TBLRD*+ TBLRD*- TBLRD+* TBLWT* TBLWT*+ TBLWT*- TBLWT+* Table Read Table Read with post-increment Table Read with post-decrement Table Read with pre-increment Table Write Table Write with post-increment Table Write with post-decrement Table Write with pre-increment 2 2 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 1000 1001 1010 1011 1100 1101 1110 1111 None None None None None None None None TABLE 24-2: PIC18FXXXX INSTRUCTION SET (CONTINUED) Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status Affected Notes MSb LSb Note 1: When a Port register is modified as a function of itself (e.g., MOVF PORTB, 1, 0), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, ‘d’ = 1), the prescaler will be cleared if assigned. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. 4: Some instructions are two-word instructions. The second word of these instructions will be executed as a NOP unless the first word of the instruction retrieves the information embedded in these 16 bits. This ensures that all program memory locations have a valid instruction. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 273 PIC18F2420/2520/4420/4520 24.1.1 STANDARD INSTRUCTION SET ADDLW ADD literal to W Syntax: ADDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) + k → W Status Affected: N, OV, C, DC, Z Encoding: 0000 1111 kkkk kkkk Description: The contents of W are added to the 8-bit literal ‘k’ and the result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ADDLW 15h Before Instruction W = 10h After Instruction W = 25h ADDWF ADD W to f Syntax: ADDWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) + (f) → dest Status Affected: N, OV, C, DC, Z Encoding: 0010 01da ffff ffff Description: Add W to register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWF REG, 0, 0 Before Instruction W = 17h REG = 0C2h After Instruction W = 0D9h REG = 0C2h Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction format then becomes: {label} instruction argument(s). PIC18F2420/2520/4420/4520 DS39631B-page 274 Preliminary © 2007 Microchip Technology Inc. ADDWFC ADD W and CARRY bit to f Syntax: ADDWFC f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) + (f) + (C) → dest Status Affected: N,OV, C, DC, Z Encoding: 0010 00da ffff ffff Description: Add W, the CARRY flag and data memory location ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ADDWFC REG, 0, 1 Before Instruction CARRY bit = 1 REG = 02h W = 4Dh After Instruction CARRY bit = 0 REG = 02h W = 50h ANDLW AND literal with W Syntax: ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .AND. k → W Status Affected: N, Z Encoding: 0000 1011 kkkk kkkk Description: The contents of W are AND’ed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: ANDLW 05Fh Before Instruction W = A3h After Instruction W = 03h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 275 PIC18F2420/2520/4420/4520 ANDWF AND W with f Syntax: ANDWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .AND. (f) → dest Status Affected: N, Z Encoding: 0001 01da ffff ffff Description: The contents of W are AND’ed with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: ANDWF REG, 0, 0 Before Instruction W = 17h REG = C2h After Instruction W = 02h REG = C2h BC Branch if Carry Syntax: BC n Operands: -128 ≤ n ≤ 127 Operation: if CARRY bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0010 nnnn nnnn Description: If the CARRY bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BC 5 Before Instruction PC = address (HERE) After Instruction If CARRY = 1; PC = address (HERE + 12) If CARRY = 0; PC = address (HERE + 2) PIC18F2420/2520/4420/4520 DS39631B-page 276 Preliminary © 2007 Microchip Technology Inc. BCF Bit Clear f Syntax: BCF f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: 0 → f Status Affected: None Encoding: 1001 bbba ffff ffff Description: Bit ‘b’ in register ‘f’ is cleared. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BCF FLAG_REG, 7, 0 Before Instruction FLAG_REG = C7h After Instruction FLAG_REG = 47h BN Branch if Negative Syntax: BN n Operands: -128 ≤ n ≤ 127 Operation: if NEGATIVE bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0110 nnnn nnnn Description: If the NEGATIVE bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BN Jump Before Instruction PC = address (HERE) After Instruction If NEGATIVE = 1; PC = address (Jump) If NEGATIVE = 0; PC = address (HERE + 2) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 277 PIC18F2420/2520/4420/4520 BNC Branch if Not Carry Syntax: BNC n Operands: -128 ≤ n ≤ 127 Operation: if CARRY bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0011 nnnn nnnn Description: If the CARRY bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNC Jump Before Instruction PC = address (HERE) After Instruction If CARRY = 0; PC = address (Jump) If CARRY = 1; PC = address (HERE + 2) BNN Branch if Not Negative Syntax: BNN n Operands: -128 ≤ n ≤ 127 Operation: if NEGATIVE bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0111 nnnn nnnn Description: If the NEGATIVE bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNN Jump Before Instruction PC = address (HERE) After Instruction If NEGATIVE = 0; PC = address (Jump) If NEGATIVE = 1; PC = address (HERE + 2) PIC18F2420/2520/4420/4520 DS39631B-page 278 Preliminary © 2007 Microchip Technology Inc. BNOV Branch if Not Overflow Syntax: BNOV n Operands: -128 ≤ n ≤ 127 Operation: if OVERFLOW bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0101 nnnn nnnn Description: If the OVERFLOW bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNOV Jump Before Instruction PC = address (HERE) After Instruction If OVERFLOW= 0; PC = address (Jump) If OVERFLOW= 1; PC = address (HERE + 2) BNZ Branch if Not Zero Syntax: BNZ n Operands: -128 ≤ n ≤ 127 Operation: if ZERO bit is ‘0’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0001 nnnn nnnn Description: If the ZERO bit is ‘0’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BNZ Jump Before Instruction PC = address (HERE) After Instruction If ZERO = 0; PC = address (Jump) If ZERO = 1; PC = address (HERE + 2) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 279 PIC18F2420/2520/4420/4520 BRA Unconditional Branch Syntax: BRA n Operands: -1024 ≤ n ≤ 1023 Operation: (PC) + 2 + 2n → PC Status Affected: None Encoding: 1101 0nnn nnnn nnnn Description: Add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation Example: HERE BRA Jump Before Instruction PC = address (HERE) After Instruction PC = address (Jump) BSF Bit Set f Syntax: BSF f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: 1 → f Status Affected: None Encoding: 1000 bbba ffff ffff Description: Bit ‘b’ in register ‘f’ is set. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BSF FLAG_REG, 7, 1 Before Instruction FLAG_REG = 0Ah After Instruction FLAG_REG = 8Ah PIC18F2420/2520/4420/4520 DS39631B-page 280 Preliminary © 2007 Microchip Technology Inc. BTFSC Bit Test File, Skip if Clear Syntax: BTFSC f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b ≤ 7 a ∈ [0,1] Operation: skip if (f) = 0 Status Affected: None Encoding: 1011 bbba ffff ffff Description: If bit ‘b’ in register ‘f’ is ‘0’, then the next instruction is skipped. If bit ‘b’ is ‘0’, then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE FALSE TRUE BTFSC : : FLAG, 1, 0 Before Instruction PC = address (HERE) After Instruction If FLAG<1> = 0; PC = address (TRUE) If FLAG<1> = 1; PC = address (FALSE) BTFSS Bit Test File, Skip if Set Syntax: BTFSS f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b < 7 a ∈ [0,1] Operation: skip if (f) = 1 Status Affected: None Encoding: 1010 bbba ffff ffff Description: If bit ‘b’ in register ‘f’ is ‘1’, then the next instruction is skipped. If bit ‘b’ is ‘1’, then the next instruction fetched during the current instruction execution is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE FALSE TRUE BTFSS : : FLAG, 1, 0 Before Instruction PC = address (HERE) After Instruction If FLAG<1> = 0; PC = address (FALSE) If FLAG<1> = 1; PC = address (TRUE) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 281 PIC18F2420/2520/4420/4520 BTG Bit Toggle f Syntax: BTG f, b {,a} Operands: 0 ≤ f ≤ 255 0 ≤ b < 7 a ∈ [0,1] Operation: (f) → f Status Affected: None Encoding: 0111 bbba ffff ffff Description: Bit ‘b’ in data memory location ‘f’ is inverted. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: BTG PORTC, 4, 0 Before Instruction: PORTC = 0111 0101 [75h] After Instruction: PORTC = 0110 0101 [65h] BOV Branch if Overflow Syntax: BOV n Operands: -128 ≤ n ≤ 127 Operation: if OVERFLOW bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0100 nnnn nnnn Description: If the OVERFLOW bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BOV Jump Before Instruction PC = address (HERE) After Instruction If OVERFLOW= 1; PC = address (Jump) If OVERFLOW= 0; PC = address (HERE + 2) PIC18F2420/2520/4420/4520 DS39631B-page 282 Preliminary © 2007 Microchip Technology Inc. BZ Branch if Zero Syntax: BZ n Operands: -128 ≤ n ≤ 127 Operation: if ZERO bit is ‘1’ (PC) + 2 + 2n → PC Status Affected: None Encoding: 1110 0000 nnnn nnnn Description: If the ZERO bit is ‘1’, then the program will branch. The 2’s complement number ‘2n’ is added to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is then a two-cycle instruction. Words: 1 Cycles: 1(2) Q Cycle Activity: If Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data Write to PC No operation No operation No operation No operation If No Jump: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ Process Data No operation Example: HERE BZ Jump Before Instruction PC = address (HERE) After Instruction If ZERO = 1; PC = address (Jump) If ZERO = 0; PC = address (HERE + 2) CALL Subroutine Call Syntax: CALL k {,s} Operands: 0 ≤ k ≤ 1048575 s ∈ [0,1] Operation: (PC) + 4 → TOS, k → PC<20:1>, if s = 1 (W) → WS, (Status) → STATUSS, (BSR) → BSRS Status Affected: None Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) 1110 1111 110s k19kkk k7kkk kkkk kkkk0 kkkk8 Description: Subroutine call of entire 2-Mbyte memory range. First, return address (PC + 4) is pushed onto the return stack. If ‘s’ = 1, the W, Status and BSR registers are also pushed into their respective shadow registers, WS, STATUSS and BSRS. If ‘s’ = 0, no update occurs (default). Then, the 20-bit value ‘k’ is loaded into PC<20:1>. CALL is a two-cycle instruction. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’<7:0>, PUSH PC to stack Read literal ‘k’<19:8>, Write to PC No operation No operation No operation No operation Example: HERE CALL THERE, 1 Before Instruction PC = address (HERE) After Instruction PC = address (THERE) TOS = address (HERE + 4) WS = W BSRS = BSR STATUSS= Status © 2007 Microchip Technology Inc. Preliminary DS39631B-page 283 PIC18F2420/2520/4420/4520 CLRF Clear f Syntax: CLRF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: 000h → f 1 → Z Status Affected: Z Encoding: 0110 101a ffff ffff Description: Clears the contents of the specified register. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: CLRF FLAG_REG, 1 Before Instruction FLAG_REG = 5Ah After Instruction FLAG_REG = 00h CLRWDT Clear Watchdog Timer Syntax: CLRWDT Operands: None Operation: 000h → WDT, 000h → WDT postscaler, 1 → TO, 1 → PD Status Affected: TO, PD Encoding: 0000 0000 0000 0100 Description: CLRWDT instruction resets the Watchdog Timer. It also resets the postscaler of the WDT. Status bits, TO and PD, are set. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data No operation Example: CLRWDT Before Instruction WDT Counter = ? After Instruction WDT Counter = 00h WDT Postscaler = 0 TO = 1 PD = 1 PIC18F2420/2520/4420/4520 DS39631B-page 284 Preliminary © 2007 Microchip Technology Inc. COMF Complement f Syntax: COMF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest Status Affected: N, Z Encoding: 0001 11da ffff ffff Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: COMF REG, 0, 0 Before Instruction REG = 13h After Instruction REG = 13h W = ECh CPFSEQ Compare f with W, skip if f = W Syntax: CPFSEQ f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) = (W) (unsigned comparison) Status Affected: None Encoding: 0110 001a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If ‘f’ = W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSEQ REG, 0 NEQUAL : EQUAL : Before Instruction PC Address = HERE W = ? REG = ? After Instruction If REG = W; PC = Address (EQUAL) If REG ≠ W; PC = Address (NEQUAL) © 2007 Microchip Technology Inc. Preliminary DS39631B-page 285 PIC18F2420/2520/4420/4520 CPFSGT Compare f with W, skip if f > W Syntax: CPFSGT f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) > (W) (unsigned comparison) Status Affected: None Encoding: 0110 010a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of the W by performing an unsigned subtraction. If the contents of ‘f’ are greater than the contents of WREG, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSGT REG, 0 NGREATER : GREATER : Before Instruction PC = Address (HERE) W = ? After Instruction If REG > W; PC = Address (GREATER) If REG ≤ W; PC = Address (NGREATER) CPFSLT Compare f with W, skip if f < W Syntax: CPFSLT f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (f) – (W), skip if (f) < (W) (unsigned comparison) Status Affected: None Encoding: 0110 000a ffff ffff Description: Compares the contents of data memory location ‘f’ to the contents of W by performing an unsigned subtraction. If the contents of ‘f’ are less than the contents of W, then the fetched instruction is discarded and a NOP is executed instead, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE CPFSLT REG, 1 NLESS : LESS : Before Instruction PC = Address (HERE) W = ? After Instruction If REG < W; PC = Address (LESS) If REG ≥ W; PC = Address (NLESS) PIC18F2420/2520/4420/4520 DS39631B-page 286 Preliminary © 2007 Microchip Technology Inc. DAW Decimal Adjust W Register Syntax: DAW Operands: None Operation: If [W<3:0> > 9] or [DC = 1] then (W<3:0>) + 6 → W<3:0>; else (W<3:0>) → W<3:0>; If [W<7:4> + DC > 9] or [C = 1] then (W<7:4>) + 6 + DC → W<7:4> ; else (W<7:4>) + DC → W<7:4> Status Affected: C Encoding: 0000 0000 0000 0111 Description: DAW adjusts the eight-bit value in W, resulting from the earlier addition of two variables (each in packed BCD format) and produces a correct packed BCD result. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register W Process Data Write W Example1: DAW Before Instruction W = A5h C = 0 DC = 0 After Instruction W = 05h C = 1 DC = 0 Example 2: Before Instruction W = CEh C = 0 DC = 0 After Instruction W = 34h C = 1 DC = 0 DECF Decrement f Syntax: DECF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest Status Affected: C, DC, N, OV, Z Encoding: 0000 01da ffff ffff Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: DECF CNT, 1, 0 Before Instruction CNT = 01h Z = 0 After Instruction CNT = 00h Z = 1 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 287 PIC18F2420/2520/4420/4520 DECFSZ Decrement f, skip if 0 Syntax: DECFSZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest, skip if result = 0 Status Affected: None Encoding: 0010 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE DECFSZ CNT, 1, 1 GOTO LOOP CONTINUE Before Instruction PC = Address (HERE) After Instruction CNT = CNT - 1 If CNT = 0; PC = Address (CONTINUE) If CNT ≠ 0; PC = Address (HERE + 2) DCFSNZ Decrement f, skip if not 0 Syntax: DCFSNZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – 1 → dest, skip if result ≠ 0 Status Affected: None Encoding: 0100 11da ffff ffff Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE DCFSNZ TEMP, 1, 0 ZERO : NZERO : Before Instruction TEMP = ? After Instruction TEMP = TEMP – 1, If TEMP = 0; PC = Address (ZERO) If TEMP ≠ 0; PC = Address (NZERO) PIC18F2420/2520/4420/4520 DS39631B-page 288 Preliminary © 2007 Microchip Technology Inc. GOTO Unconditional Branch Syntax: GOTO k Operands: 0 ≤ k ≤ 1048575 Operation: k → PC<20:1> Status Affected: None Encoding: 1st word (k<7:0>) 2nd word(k<19:8>) 1110 1111 1111 k19kkk k7kkk kkkk kkkk0 kkkk8 Description: GOTO allows an unconditional branch anywhere within entire 2-Mbyte memory range. The 20-bit value ‘k’ is loaded into PC<20:1>. GOTO is always a two-cycle instruction. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’<7:0>, No operation Read literal ‘k’<19:8>, Write to PC No operation No operation No operation No operation Example: GOTO THERE After Instruction PC = Address (THERE) INCF Increment f Syntax: INCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest Status Affected: C, DC, N, OV, Z Encoding: 0010 10da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: INCF CNT, 1, 0 Before Instruction CNT = FFh Z = 0 C = ? DC = ? After Instruction CNT = 00h Z = 1 C = 1 DC = 1 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 289 PIC18F2420/2520/4420/4520 INCFSZ Increment f, skip if 0 Syntax: INCFSZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest, skip if result = 0 Status Affected: None Encoding: 0011 11da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE INCFSZ CNT, 1, 0 NZERO : ZERO : Before Instruction PC = Address (HERE) After Instruction CNT = CNT + 1 If CNT = 0; PC = Address (ZERO) If CNT ≠ 0; PC = Address (NZERO) INFSNZ Increment f, skip if not 0 Syntax: INFSNZ f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) + 1 → dest, skip if result ≠ 0 Status Affected: None Encoding: 0100 10da ffff ffff Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If the result is not ‘0’, the next instruction, which is already fetched, is discarded and a NOP is executed instead, making it a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE INFSNZ REG, 1, 0 ZERO NZERO Before Instruction PC = Address (HERE) After Instruction REG = REG + 1 If REG ≠ 0; PC = Address (NZERO) If REG = 0; PC = Address (ZERO) PIC18F2420/2520/4420/4520 DS39631B-page 290 Preliminary © 2007 Microchip Technology Inc. IORLW Inclusive OR literal with W Syntax: IORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .OR. k → W Status Affected: N, Z Encoding: 0000 1001 kkkk kkkk Description: The contents of W are ORed with the eight-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: IORLW 35h Before Instruction W = 9Ah After Instruction W = BFh IORWF Inclusive OR W with f Syntax: IORWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .OR. (f) → dest Status Affected: N, Z Encoding: 0001 00da ffff ffff Description: Inclusive OR W with register ‘f’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: IORWF RESULT, 0, 1 Before Instruction RESULT = 13h W = 91h After Instruction RESULT = 13h W = 93h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 291 PIC18F2420/2520/4420/4520 LFSR Load FSR Syntax: LFSR f, k Operands: 0 ≤ f ≤ 2 0 ≤ k ≤ 4095 Operation: k → FSRf Status Affected: None Encoding: 1110 1111 1110 0000 00ff k7kkk k11kkk kkkk Description: The 12-bit literal ‘k’ is loaded into the File Select Register pointed to by ‘f’. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ MSB Process Data Write literal ‘k’ MSB to FSRfH Decode Read literal ‘k’ LSB Process Data Write literal ‘k’ to FSRfL Example: LFSR 2, 3ABh After Instruction FSR2H = 03h FSR2L = ABh MOVF Move f Syntax: MOVF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: f → dest Status Affected: N, Z Encoding: 0101 00da ffff ffff Description: The contents of register ‘f’ are moved to a destination dependent upon the status of ‘d’. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write W Example: MOVF REG, 0, 0 Before Instruction REG = 22h W = FFh After Instruction REG = 22h W = 22h PIC18F2420/2520/4420/4520 DS39631B-page 292 Preliminary © 2007 Microchip Technology Inc. MOVFF Move f to f Syntax: MOVFF fs,fd Operands: 0 ≤ fs ≤ 4095 0 ≤ fd ≤ 4095 Operation: (fs) → fd Status Affected: None Encoding: 1st word (source) 2nd word (destin.) 1100 1111 ffff ffff ffff ffff ffffs ffffd Description: The contents of source register ‘fs’ are moved to destination register ‘fd’. Location of source ‘fs’ can be anywhere in the 4096-byte data space (000h to FFFh) and location of destination ‘fd’ can also be anywhere from 000h to FFFh. Either source or destination can be W (a useful special situation). MOVFF is particularly useful for transferring a data memory location to a peripheral register (such as the transmit buffer or an I/O port). The MOVFF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. Words: 2 Cycles: 2 (3) Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ (src) Process Data No operation Decode No operation No dummy read No operation Write register ‘f’ (dest) Example: MOVFF REG1, REG2 Before Instruction REG1 = 33h REG2 = 11h After Instruction REG1 = 33h REG2 = 33h MOVLB Move literal to low nibble in BSR Syntax: MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → BSR Status Affected: None Encoding: 0000 0001 kkkk kkkk Description: The eight-bit literal ‘k’ is loaded into the Bank Select Register (BSR). The value of BSR<7:4> always remains ‘0’, regardless of the value of k7:k4. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write literal ‘k’ to BSR Example: MOVLB 5 Before Instruction BSR Register = 02h After Instruction BSR Register = 05h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 293 PIC18F2420/2520/4420/4520 MOVLW Move literal to W Syntax: MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → W Status Affected: None Encoding: 0000 1110 kkkk kkkk Description: The eight-bit literal ‘k’ is loaded into W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: MOVLW 5Ah After Instruction W = 5Ah MOVWF Move W to f Syntax: MOVWF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (W) → f Status Affected: None Encoding: 0110 111a ffff ffff Description: Move data from W to register ‘f’. Location ‘f’ can be anywhere in the 256-byte bank. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: MOVWF REG, 0 Before Instruction W = 4Fh REG = FFh After Instruction W = 4Fh REG = 4Fh PIC18F2420/2520/4420/4520 DS39631B-page 294 Preliminary © 2007 Microchip Technology Inc. MULLW Multiply literal with W Syntax: MULLW k Operands: 0 ≤ k ≤ 255 Operation: (W) x k → PRODH:PRODL Status Affected: None Encoding: 0000 1101 kkkk kkkk Description: An unsigned multiplication is carried out between the contents of W and the 8-bit literal ‘k’. The 16-bit result is placed in the PRODH:PRODL register pair. PRODH contains the high byte. W is unchanged. None of the Status flags are affected. Note that neither overflow nor carry is possible in this operation. A zero result is possible but not detected. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write registers PRODH: PRODL Example: MULLW 0C4h Before Instruction W = E2h PRODH = ? PRODL = ? After Instruction W = E2h PRODH = ADh PRODL = 08h MULWF Multiply W with f Syntax: MULWF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: (W) x (f) → PRODH:PRODL Status Affected: None Encoding: 0000 001a ffff ffff Description: An unsigned multiplication is carried out between the contents of W and the register file location ‘f’. The 16-bit result is stored in the PRODH:PRODL register pair. PRODH contains the high byte. Both W and ‘f’ are unchanged. None of the Status flags are affected. Note that neither overflow nor carry is possible in this operation. A zero result is possible but not detected. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write registers PRODH: PRODL Example: MULWF REG, 1 Before Instruction W = C4h REG = B5h PRODH = ? PRODL = ? After Instruction W = C4h REG = B5h PRODH = 8Ah PRODL = 94h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 295 PIC18F2420/2520/4420/4520 NEGF Negate f Syntax: NEGF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: ( f ) + 1 → f Status Affected: N, OV, C, DC, Z Encoding: 0110 110a ffff ffff Description: Location ‘f’ is negated using two’s complement. The result is placed in the data memory location ‘f’. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: NEGF REG, 1 Before Instruction REG = 0011 1010 [3Ah] After Instruction REG = 1100 0110 [C6h] NOP No Operation Syntax: NOP Operands: None Operation: No operation Status Affected: None Encoding: 0000 1111 0000 xxxx 0000 xxxx 0000 xxxx Description: No operation. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation Example: None. PIC18F2420/2520/4420/4520 DS39631B-page 296 Preliminary © 2007 Microchip Technology Inc. POP Pop Top of Return Stack Syntax: POP Operands: None Operation: (TOS) → bit bucket Status Affected: None Encoding: 0000 0000 0000 0110 Description: The TOS value is pulled off the return stack and is discarded. The TOS value then becomes the previous value that was pushed onto the return stack. This instruction is provided to enable the user to properly manage the return stack to incorporate a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation POP TOS value No operation Example: POP GOTO NEW Before Instruction TOS = 0031A2h Stack (1 level down) = 014332h After Instruction TOS = 014332h PC = NEW PUSH Push Top of Return Stack Syntax: PUSH Operands: None Operation: (PC + 2) → TOS Status Affected: None Encoding: 0000 0000 0000 0101 Description: The PC + 2 is pushed onto the top of the return stack. The previous TOS value is pushed down on the stack. This instruction allows implementing a software stack by modifying TOS and then pushing it onto the return stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode PUSH PC + 2 onto return stack No operation No operation Example: PUSH Before Instruction TOS = 345Ah PC = 0124h After Instruction PC = 0126h TOS = 0126h Stack (1 level down) = 345Ah © 2007 Microchip Technology Inc. Preliminary DS39631B-page 297 PIC18F2420/2520/4420/4520 RCALL Relative Call Syntax: RCALL n Operands: -1024 ≤ n ≤ 1023 Operation: (PC) + 2 → TOS, (PC) + 2 + 2n → PC Status Affected: None Encoding: 1101 1nnn nnnn nnnn Description: Subroutine call with a jump up to 1K from the current location. First, return address (PC + 2) is pushed onto the stack. Then, add the 2’s complement number ‘2n’ to the PC. Since the PC will have incremented to fetch the next instruction, the new address will be PC + 2 + 2n. This instruction is a two-cycle instruction. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘n’ PUSH PC to stack Process Data Write to PC No operation No operation No operation No operation Example: HERE RCALL Jump Before Instruction PC = Address (HERE) After Instruction PC = Address (Jump) TOS = Address (HERE + 2) RESET Reset Syntax: RESET Operands: None Operation: Reset all registers and flags that are affected by a MCLR Reset. Status Affected: All Encoding: 0000 0000 1111 1111 Description: This instruction provides a way to execute a MCLR Reset in software. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Start Reset No operation No operation Example: RESET After Instruction Registers = Reset Value Flags* = Reset Value PIC18F2420/2520/4420/4520 DS39631B-page 298 Preliminary © 2007 Microchip Technology Inc. RETFIE Return from Interrupt Syntax: RETFIE {s} Operands: s ∈ [0,1] Operation: (TOS) → PC, 1 → GIE/GIEH or PEIE/GIEL, if s = 1 (WS) → W, (STATUSS) → Status, (BSRS) → BSR, PCLATU, PCLATH are unchanged. Status Affected: GIE/GIEH, PEIE/GIEL. Encoding: 0000 0000 0001 000s Description: Return from interrupt. Stack is popped and Top-of-Stack (TOS) is loaded into the PC. Interrupts are enabled by setting either the high or low priority global interrupt enable bit. If ‘s’ = 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, Status and BSR. If ‘s’ = 0, no update of these registers occurs (default). Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation POP PC from stack Set GIEH or GIEL No operation No operation No operation No operation Example: RETFIE 1 After Interrupt PC = TOS W = WS BSR = BSRS Status = STATUSS GIE/GIEH, PEIE/GIEL = 1 RETLW Return literal to W Syntax: RETLW k Operands: 0 ≤ k ≤ 255 Operation: k → W, (TOS) → PC, PCLATU, PCLATH are unchanged Status Affected: None Encoding: 0000 1100 kkkk kkkk Description: W is loaded with the eight-bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). The high address latch (PCLATH) remains unchanged. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data POP PC from stack, Write to W No operation No operation No operation No operation Example: CALL TABLE ; W contains table ; offset value ; W now has ; table value : TABLE ADDWF PCL ; W = offset RETLW k0 ; Begin table RETLW k1 ; : : RETLW kn ; End of table Before Instruction W = 07h After Instruction W = value of kn © 2007 Microchip Technology Inc. Preliminary DS39631B-page 299 PIC18F2420/2520/4420/4520 RETURN Return from Subroutine Syntax: RETURN {s} Operands: s ∈ [0,1] Operation: (TOS) → PC, if s = 1 (WS) → W, (STATUSS) → Status, (BSRS) → BSR, PCLATU, PCLATH are unchanged Status Affected: None Encoding: 0000 0000 0001 001s Description: Return from subroutine. The stack is popped and the top of the stack (TOS) is loaded into the program counter. If ‘s’= 1, the contents of the shadow registers, WS, STATUSS and BSRS, are loaded into their corresponding registers, W, Status and BSR. If ‘s’ = 0, no update of these registers occurs (default). Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data POP PC from stack No operation No operation No operation No operation Example: RETURN After Instruction: PC = TOS RLCF Rotate Left f through Carry Syntax: RLCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<7>) → C, (C) → dest<0> Status Affected: C, N, Z Encoding: 0011 01da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the left through the CARRY flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RLCF REG, 0, 0 Before Instruction REG = 1110 0110 C = 0 After Instruction REG = 1110 0110 W = 1100 1100 C = 1 C register f PIC18F2420/2520/4420/4520 DS39631B-page 300 Preliminary © 2007 Microchip Technology Inc. RLNCF Rotate Left f (No Carry) Syntax: RLNCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<7>) → dest<0> Status Affected: N, Z Encoding: 0100 01da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the left. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RLNCF REG, 1, 0 Before Instruction REG = 1010 1011 After Instruction REG = 0101 0111 register f RRCF Rotate Right f through Carry Syntax: RRCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<0>) → C, (C) → dest<7> Status Affected: C, N, Z Encoding: 0011 00da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the right through the CARRY flag. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: RRCF REG, 0, 0 Before Instruction REG = 1110 0110 C = 0 After Instruction REG = 1110 0110 W = 0111 0011 C = 0 C register f © 2007 Microchip Technology Inc. Preliminary DS39631B-page 301 PIC18F2420/2520/4420/4520 RRNCF Rotate Right f (No Carry) Syntax: RRNCF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) → dest, (f<0>) → dest<7> Status Affected: N, Z Encoding: 0100 00da ffff ffff Description: The contents of register ‘f’ are rotated one bit to the right. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank will be selected, overriding the BSR value. If ‘a’ is ‘1’, then the bank will be selected as per the BSR value (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: RRNCF REG, 1, 0 Before Instruction REG = 1101 0111 After Instruction REG = 1110 1011 Example 2: RRNCF REG, 0, 0 Before Instruction W = ? REG = 1101 0111 After Instruction W = 1110 1011 REG = 1101 0111 register f SETF Set f Syntax: SETF f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: FFh → f Status Affected: None Encoding: 0110 100a ffff ffff Description: The contents of the specified register are set to FFh. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write register ‘f’ Example: SETF REG, 1 Before Instruction REG = 5Ah After Instruction REG = FFh PIC18F2420/2520/4420/4520 DS39631B-page 302 Preliminary © 2007 Microchip Technology Inc. SLEEP Enter Sleep mode Syntax: SLEEP Operands: None Operation: 00h → WDT, 0 → WDT postscaler, 1 → TO, 0 → PD Status Affected: TO, PD Encoding: 0000 0000 0000 0011 Description: The Power-down status bit (PD) is cleared. The Time-out status bit (TO) is set. Watchdog Timer and its postscaler are cleared. The processor is put into Sleep mode with the oscillator stopped. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation Process Data Go to Sleep Example: SLEEP Before Instruction TO = ? PD = ? After Instruction TO = 1 † PD = 0 † If WDT causes wake-up, this bit is cleared. SUBFWB Subtract f from W with borrow Syntax: SUBFWB f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) – (f) – (C) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 01da ffff ffff Description: Subtract register ‘f’ and CARRY flag (borrow) from W (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBFWB REG, 1, 0 Before Instruction REG = 3 W = 2 C = 1 After Instruction REG = FF W = 2 C = 0 Z = 0 N = 1 ; result is negative Example 2: SUBFWB REG, 0, 0 Before Instruction REG = 2 W = 5 C = 1 After Instruction REG = 2 W = 3 C = 1 Z = 0 N = 0 ; result is positive Example 3: SUBFWB REG, 1, 0 Before Instruction REG = 1 W = 2 C = 0 After Instruction REG = 0 W = 2 C = 1 Z = 1 ; result is zero N = 0 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 303 PIC18F2420/2520/4420/4520 SUBLW Subtract W from literal Syntax: SUBLW k Operands: 0 ≤ k ≤ 255 Operation: k – (W) → W Status Affected: N, OV, C, DC, Z Encoding: 0000 1000 kkkk kkkk Description W is subtracted from the eight-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example 1: SUBLW 02h Before Instruction W = 01h C = ? After Instruction W = 01h C = 1 ; result is positive Z = 0 N = 0 Example 2: SUBLW 02h Before Instruction W = 02h C = ? After Instruction W = 00h C = 1 ; result is zero Z = 1 N = 0 Example 3: SUBLW 02h Before Instruction W = 03h C = ? After Instruction W = FFh ; (2’s complement) C = 0 ; result is negative Z = 0 N = 1 SUBWF Subtract W from f Syntax: SUBWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – (W) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 11da ffff ffff Description: Subtract W from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBWF REG, 1, 0 Before Instruction REG = 3 W = 2 C = ? After Instruction REG = 1 W = 2 C = 1 ; result is positive Z = 0 N = 0 Example 2: SUBWF REG, 0, 0 Before Instruction REG = 2 W = 2 C = ? After Instruction REG = 2 W = 0 C = 1 ; result is zero Z = 1 N = 0 Example 3: SUBWF REG, 1, 0 Before Instruction REG = 1 W = 2 C = ? After Instruction REG = FFh ;(2’s complement) W = 2 C = 0 ; result is negative Z = 0 N = 1 PIC18F2420/2520/4420/4520 DS39631B-page 304 Preliminary © 2007 Microchip Technology Inc. SUBWFB Subtract W from f with Borrow Syntax: SUBWFB f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f) – (W) – (C) → dest Status Affected: N, OV, C, DC, Z Encoding: 0101 10da ffff ffff Description: Subtract W and the CARRY flag (borrow) from register ‘f’ (2’s complement method). If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example 1: SUBWFB REG, 1, 0 Before Instruction REG = 19h (0001 1001) W = 0Dh (0000 1101) C = 1 After Instruction REG = 0Ch (0000 1011) W = 0Dh (0000 1101) C = 1 Z = 0 N = 0 ; result is positive Example 2: SUBWFB REG, 0, 0 Before Instruction REG = 1Bh (0001 1011) W = 1Ah (0001 1010) C = 0 After Instruction REG = 1Bh (0001 1011) W = 00h C = 1 Z = 1 ; result is zero N = 0 Example 3: SUBWFB REG, 1, 0 Before Instruction REG = 03h (0000 0011) W = 0Eh (0000 1101) C = 1 After Instruction REG = F5h (1111 0100) ; [2’s comp] W = 0Eh (0000 1101) C = 0 Z = 0 N = 1 ; result is negative SWAPF Swap f Syntax: SWAPF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (f<3:0>) → dest<7:4>, (f<7:4>) → dest<3:0> Status Affected: None Encoding: 0011 10da ffff ffff Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in W. If ‘d’ is ‘1’, the result is placed in register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: SWAPF REG, 1, 0 Before Instruction REG = 53h After Instruction REG = 35h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 305 PIC18F2420/2520/4420/4520 TBLRD Table Read Syntax: TBLRD ( *; *+; *-; +*) Operands: None Operation: if TBLRD *, (Prog Mem (TBLPTR)) → TABLAT; TBLPTR – No Change; if TBLRD *+, (Prog Mem (TBLPTR)) → TABLAT; (TBLPTR) + 1 → TBLPTR; if TBLRD *-, (Prog Mem (TBLPTR)) → TABLAT; (TBLPTR) – 1 → TBLPTR; if TBLRD +*, (TBLPTR) + 1 → TBLPTR; (Prog Mem (TBLPTR)) → TABLAT; Status Affected: None Encoding: 0000 0000 0000 10nn nn=0 * =1 *+ =2 *- =3 +* Description: This instruction is used to read the contents of Program Memory (P.M.). To address the program memory, a pointer called Table Pointer (TBLPTR) is used. The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-Mbyte address range. TBLPTR[0] = 0: Least Significant Byte of Program Memory Word TBLPTR[0] = 1: Most Significant Byte of Program Memory Word The TBLRD instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read Program Memory) No operation No operation (Write TABLAT) TBLRD Table Read (Continued) Example1: TBLRD *+ ; Before Instruction TABLAT = 55h TBLPTR = 00A356h MEMORY (00A356h) = 34h After Instruction TABLAT = 34h TBLPTR = 00A357h Example2: TBLRD +* ; Before Instruction TABLAT = AAh TBLPTR = 01A357h MEMORY (01A357h) = 12h MEMORY (01A358h) = 34h After Instruction TABLAT = 34h TBLPTR = 01A358h PIC18F2420/2520/4420/4520 DS39631B-page 306 Preliminary © 2007 Microchip Technology Inc. TBLWT Table Write Syntax: TBLWT ( *; *+; *-; +*) Operands: None Operation: if TBLWT*, (TABLAT) → Holding Register; TBLPTR – No Change; if TBLWT*+, (TABLAT) → Holding Register; (TBLPTR) + 1 → TBLPTR; if TBLWT*-, (TABLAT) → Holding Register; (TBLPTR) – 1 → TBLPTR; if TBLWT+*, (TBLPTR) + 1 → TBLPTR; (TABLAT) → Holding Register; Status Affected: None Encoding: 0000 0000 0000 11nn nn=0 * =1 *+ =2 *- =3 +* Description: This instruction uses the 3 LSBs of TBLPTR to determine which of the 8 holding registers the TABLAT is written to. The holding registers are used to program the contents of Program Memory (P.M.). (Refer to Section 6.0 “Flash Program Memory” for additional details on programming Flash memory.) The TBLPTR (a 21-bit pointer) points to each byte in the program memory. TBLPTR has a 2-MByte address range. The LSb of the TBLPTR selects which byte of the program memory location to access. TBLPTR[0] = 0: Least Significant Byte of Program Memory Word TBLPTR[0] = 1: Most Significant Byte of Program Memory Word The TBLWT instruction can modify the value of TBLPTR as follows: • no change • post-increment • post-decrement • pre-increment Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode No operation No operation No operation No operation No operation (Read TABLAT) No operation No operation (Write to Holding Register ) TBLWT Table Write (Continued) Example1: TBLWT *+; Before Instruction TABLAT = 55h TBLPTR = 00A356h HOLDING REGISTER (00A356h) = FFh After Instructions (table write completion) TABLAT = 55h TBLPTR = 00A357h HOLDING REGISTER (00A356h) = 55h Example 2: TBLWT +*; Before Instruction TABLAT = 34h TBLPTR = 01389Ah HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = FFh After Instruction (table write completion) TABLAT = 34h TBLPTR = 01389Bh HOLDING REGISTER (01389Ah) = FFh HOLDING REGISTER (01389Bh) = 34h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 307 PIC18F2420/2520/4420/4520 TSTFSZ Test f, skip if 0 Syntax: TSTFSZ f {,a} Operands: 0 ≤ f ≤ 255 a ∈ [0,1] Operation: skip if f = 0 Status Affected: None Encoding: 0110 011a ffff ffff Description: If ‘f’ = 0, the next instruction fetched during the current instruction execution is discarded and a NOP is executed, making this a two-cycle instruction. If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1(2) Note: 3 cycles if skip and followed by a 2-word instruction. Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data No operation If skip: Q1 Q2 Q3 Q4 No operation No operation No operation No operation If skip and followed by 2-word instruction: Q1 Q2 Q3 Q4 No operation No operation No operation No operation No operation No operation No operation No operation Example: HERE TSTFSZ CNT, 1 NZERO : ZERO : Before Instruction PC = Address (HERE) After Instruction If CNT = 00h, PC = Address (ZERO) If CNT ≠ 00h, PC = Address (NZERO) XORLW Exclusive OR literal with W Syntax: XORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .XOR. k → W Status Affected: N, Z Encoding: 0000 1010 kkkk kkkk Description: The contents of W are XORed with the 8-bit literal ‘k’. The result is placed in W. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to W Example: XORLW 0AFh Before Instruction W = B5h After Instruction W = 1Ah PIC18F2420/2520/4420/4520 DS39631B-page 308 Preliminary © 2007 Microchip Technology Inc. XORWF Exclusive OR W with f Syntax: XORWF f {,d {,a}} Operands: 0 ≤ f ≤ 255 d ∈ [0,1] a ∈ [0,1] Operation: (W) .XOR. (f) → dest Status Affected: N, Z Encoding: 0001 10da ffff ffff Description: Exclusive OR the contents of W with register ‘f’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in the register ‘f’ (default). If ‘a’ is ‘0’, the Access Bank is selected. If ‘a’ is ‘1’, the BSR is used to select the GPR bank (default). If ‘a’ is ‘0’ and the extended instruction set is enabled, this instruction operates in Indexed Literal Offset Addressing mode whenever f ≤ 95 (5Fh). See Section 24.2.3 “Byte-Oriented and Bit-Oriented Instructions in Indexed Literal Offset Mode” for details. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: XORWF REG, 1, 0 Before Instruction REG = AFh W = B5h After Instruction REG = 1Ah W = B5h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 309 PIC18F2420/2520/4420/4520 24.2 Extended Instruction Set In addition to the standard 75 instructions of the PIC18 instruction set, PIC18F2420/2520/4420/4520 devices also provide an optional extension to the core CPU functionality. The added features include eight additional instructions that augment indirect and indexed addressing operations and the implementation of Indexed Literal Offset Addressing mode for many of the standard PIC18 instructions. The additional features of the extended instruction set are disabled by default. To enable them, users must set the XINST configuration bit. The instructions in the extended set can all be classified as literal operations, which either manipulate the File Select Registers, or use them for indexed addressing. Two of the instructions, ADDFSR and SUBFSR, each have an additional special instantiation for using FSR2. These versions (ADDULNK and SUBULNK) allow for automatic return after execution. The extended instructions are specifically implemented to optimize re-entrant program code (that is, code that is recursive or that uses a software stack) written in high-level languages, particularly C. Among other things, they allow users working in high-level languages to perform certain operations on data structures more efficiently. These include: • dynamic allocation and deallocation of software stack space when entering and leaving subroutines • function pointer invocation • software stack pointer manipulation • manipulation of variables located in a software stack A summary of the instructions in the extended instruction set is provided in Table 24-3. Detailed descriptions are provided in Section 24.2.2 “Extended Instruction Set”. The opcode field descriptions in Table 24-1 (page 268) apply to both the standard and extended PIC18 instruction sets. 24.2.1 EXTENDED INSTRUCTION SYNTAX Most of the extended instructions use indexed arguments, using one of the File Select Registers and some offset to specify a source or destination register. When an argument for an instruction serves as part of indexed addressing, it is enclosed in square brackets (“[ ]”). This is done to indicate that the argument is used as an index or offset. MPASM™ Assembler will flag an error if it determines that an index or offset value is not bracketed. When the extended instruction set is enabled, brackets are also used to indicate index arguments in byteoriented and bit-oriented instructions. This is in addition to other changes in their syntax. For more details, see Section 24.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”. TABLE 24-3: EXTENSIONS TO THE PIC18 INSTRUCTION SET Note: The instruction set extension and the Indexed Literal Offset Addressing mode were designed for optimizing applications written in C; the user may likely never use these instructions directly in assembler. The syntax for these commands is provided as a reference for users who may be reviewing code that has been generated by a compiler. Note: In the past, square brackets have been used to denote optional arguments in the PIC18 and earlier instruction sets. In this text and going forward, optional arguments are denoted by braces (“{ }”). Mnemonic, Operands Description Cycles 16-Bit Instruction Word Status MSb LSb Affected ADDFSR ADDULNK CALLW MOVSF MOVSS PUSHL SUBFSR SUBULNK f, k k zs, fd zs, zd k f, k k Add literal to FSR Add literal to FSR2 and return Call subroutine using WREG Move zs (source) to 1st word fd (destination) 2nd word Move zs (source) to 1st word zd (destination) 2nd word Store literal at FSR2, decrement FSR2 Subtract literal from FSR Subtract literal from FSR2 and return 1 2 2 2 2 1 1 2 1110 1110 0000 1110 1111 1110 1111 1110 1110 1110 1000 1000 0000 1011 ffff 1011 xxxx 1010 1001 1001 ffkk 11kk 0001 0zzz ffff 1zzz xzzz kkkk ffkk 11kk kkkk kkkk 0100 zzzz ffff zzzz zzzz kkkk kkkk kkkk None None None None None None None None PIC18F2420/2520/4420/4520 DS39631B-page 310 Preliminary © 2007 Microchip Technology Inc. 24.2.2 EXTENDED INSTRUCTION SET ADDFSR Add Literal to FSR Syntax: ADDFSR f, k Operands: 0 ≤ k ≤ 63 f ∈ [ 0, 1, 2 ] Operation: FSR(f) + k → FSR(f) Status Affected: None Encoding: 1110 1000 ffkk kkkk Description: The 6-bit literal ‘k’ is added to the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR Example: ADDFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 0422h ADDULNK Add Literal to FSR2 and Return Syntax: ADDULNK k Operands: 0 ≤ k ≤ 63 Operation: FSR2 + k → FSR2, (TOS) → PC Status Affected: None Encoding: 1110 1000 11kk kkkk Description: The 6-bit literal ‘k’ is added to the contents of FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the ADDFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read literal ‘k’ Process Data Write to FSR No Operation No Operation No Operation No Operation Example: ADDULNK 23h Before Instruction FSR2 = 03FFh PC = 0100h After Instruction FSR2 = 0422h PC = (TOS) Note: All PIC18 instructions may take an optional label argument preceding the instruction mnemonic for use in symbolic addressing. If a label is used, the instruction syntax then becomes: {label} instruction argument(s). © 2007 Microchip Technology Inc. Preliminary DS39631B-page 311 PIC18F2420/2520/4420/4520 CALLW Subroutine Call Using WREG Syntax: CALLW Operands: None Operation: (PC + 2) → TOS, (W) → PCL, (PCLATH) → PCH, (PCLATU) → PCU Status Affected: None Encoding: 0000 0000 0001 0100 Description First, the return address (PC + 2) is pushed onto the return stack. Next, the contents of W are written to PCL; the existing value is discarded. Then, the contents of PCLATH and PCLATU are latched into PCH and PCU, respectively. The second cycle is executed as a NOP instruction while the new next instruction is fetched. Unlike CALL, there is no option to update W, Status or BSR. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read WREG PUSH PC to stack No operation No operation No operation No operation No operation Example: HERE CALLW Before Instruction PC = address (HERE) PCLATH = 10h PCLATU = 00h W = 06h After Instruction PC = 001006h TOS = address (HERE + 2) PCLATH = 10h PCLATU = 00h W = 06h MOVSF Move Indexed to f Syntax: MOVSF [zs], fd Operands: 0 ≤ zs ≤ 127 0 ≤ fd ≤ 4095 Operation: ((FSR2) + zs) → fd Status Affected: None Encoding: 1st word (source) 2nd word (destin.) 1110 1111 1011 ffff 0zzz ffff zzzzs ffffd Description: The contents of the source register are moved to destination register ‘fd’. The actual address of the source register is determined by adding the 7-bit literal offset ‘zs’ in the first word to the value of FSR2. The address of the destination register is specified by the 12-bit literal ‘fd’ in the second word. Both addresses can be anywhere in the 4096-byte data space (000h to FFFh). The MOVSF instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Determine source addr Determine source addr Read source reg Decode No operation No dummy read No operation Write register ‘f’ (dest) Example: MOVSF [05h], REG2 Before Instruction FSR2 = 80h Contents of 85h = 33h REG2 = 11h After Instruction FSR2 = 80h Contents of 85h = 33h REG2 = 33h PIC18F2420/2520/4420/4520 DS39631B-page 312 Preliminary © 2007 Microchip Technology Inc. MOVSS Move Indexed to Indexed Syntax: MOVSS [zs], [zd] Operands: 0 ≤ zs ≤ 127 0 ≤ zd ≤ 127 Operation: ((FSR2) + zs) → ((FSR2) + zd) Status Affected: None Encoding: 1st word (source) 2nd word (dest.) 1110 1111 1011 xxxx 1zzz xzzz zzzzs zzzzd Description The contents of the source register are moved to the destination register. The addresses of the source and destination registers are determined by adding the 7-bit literal offsets ‘zs’ or ‘zd’, respectively, to the value of FSR2. Both registers can be located anywhere in the 4096-byte data memory space (000h to FFFh). The MOVSS instruction cannot use the PCL, TOSU, TOSH or TOSL as the destination register. If the resultant source address points to an indirect addressing register, the value returned will be 00h. If the resultant destination address points to an indirect addressing register, the instruction will execute as a NOP. Words: 2 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Determine source addr Determine source addr Read source reg Decode Determine dest addr Determine dest addr Write to dest reg Example: MOVSS [05h], [06h] Before Instruction FSR2 = 80h Contents of 85h = 33h Contents of 86h = 11h After Instruction FSR2 = 80h Contents of 85h = 33h Contents of 86h = 33h PUSHL Store Literal at FSR2, Decrement FSR2 Syntax: PUSHL k Operands: 0 ≤ k ≤ 255 Operation: k → (FSR2), FSR2 – 1 → FSR2 Status Affected: None Encoding: 1111 1010 kkkk kkkk Description: The 8-bit literal ‘k’ is written to the data memory address specified by FSR2. FSR2 is decremented by 1 after the operation. This instruction allows users to push values onto a software stack. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process data Write to destination Example: PUSHL 08h Before Instruction FSR2H:FSR2L = 01ECh Memory (01ECh) = 00h After Instruction FSR2H:FSR2L = 01EBh Memory (01ECh) = 08h © 2007 Microchip Technology Inc. Preliminary DS39631B-page 313 PIC18F2420/2520/4420/4520 SUBFSR Subtract Literal from FSR Syntax: SUBFSR f, k Operands: 0 ≤ k ≤ 63 f ∈ [ 0, 1, 2 ] Operation: FSR(f) – k → FSRf Status Affected: None Encoding: 1110 1001 ffkk kkkk Description: The 6-bit literal ‘k’ is subtracted from the contents of the FSR specified by ‘f’. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: SUBFSR 2, 23h Before Instruction FSR2 = 03FFh After Instruction FSR2 = 03DCh SUBULNK Subtract Literal from FSR2 and Return Syntax: SUBULNK k Operands: 0 ≤ k ≤ 63 Operation: FSR2 – k → FSR2 (TOS) → PC Status Affected: None Encoding: 1110 1001 11kk kkkk Description: The 6-bit literal ‘k’ is subtracted from the contents of the FSR2. A RETURN is then executed by loading the PC with the TOS. The instruction takes two cycles to execute; a NOP is performed during the second cycle. This may be thought of as a special case of the SUBFSR instruction, where f = 3 (binary ‘11’); it operates only on FSR2. Words: 1 Cycles: 2 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination No Operation No Operation No Operation No Operation Example: SUBULNK 23h Before Instruction FSR2 = 03FFh PC = 0100h After Instruction FSR2 = 03DCh PC = (TOS) PIC18F2420/2520/4420/4520 DS39631B-page 314 Preliminary © 2007 Microchip Technology Inc. 24.2.3 BYTE-ORIENTED AND BIT-ORIENTED INSTRUCTIONS IN INDEXED LITERAL OFFSET MODE In addition to eight new commands in the extended set, enabling the extended instruction set also enables Indexed Literal Offset Addressing mode (Section 5.5.1 “Indexed Addressing with Literal Offset”). This has a significant impact on the way that many commands of the standard PIC18 instruction set are interpreted. When the extended set is disabled, addresses embedded in opcodes are treated as literal memory locations: either as a location in the Access Bank (‘a’ = 0), or in a GPR bank designated by the BSR (‘a’ = 1). When the extended instruction set is enabled and ‘a’ = 0, however, a file register argument of 5Fh or less is interpreted as an offset from the pointer value in FSR2 and not as a literal address. For practical purposes, this means that all instructions that use the Access RAM bit as an argument – that is, all byte-oriented and bitoriented instructions, or almost half of the core PIC18 instructions – may behave differently when the extended instruction set is enabled. When the content of FSR2 is 00h, the boundaries of the Access RAM are essentially remapped to their original values. This may be useful in creating backward compatible code. If this technique is used, it may be necessary to save the value of FSR2 and restore it when moving back and forth between C and assembly routines in order to preserve the stack pointer. Users must also keep in mind the syntax requirements of the extended instruction set (see Section 24.2.3.1 “Extended Instruction Syntax with Standard PIC18 Commands”). Although the Indexed Literal Offset Addressing mode can be very useful for dynamic stack and pointer manipulation, it can also be very annoying if a simple arithmetic operation is carried out on the wrong register. Users who are accustomed to the PIC18 programming must keep in mind that, when the extended instruction set is enabled, register addresses of 5Fh or less are used for Indexed Literal Offset Addressing. Representative examples of typical byte-oriented and bit-oriented instructions in the Indexed Literal Offset Addressing mode are provided on the following page to show how execution is affected. The operand conditions shown in the examples are applicable to all instructions of these types. 24.2.3.1 Extended Instruction Syntax with Standard PIC18 Commands When the extended instruction set is enabled, the file register argument, ‘f’, in the standard byte-oriented and bit-oriented commands is replaced with the literal offset value, ‘k’. As already noted, this occurs only when ‘f’ is less than or equal to 5Fh. When an offset value is used, it must be indicated by square brackets (“[ ]”). As with the extended instructions, the use of brackets indicates to the compiler that the value is to be interpreted as an index or an offset. Omitting the brackets, or using a value greater than 5Fh within brackets, will generate an error in the MPASM Assembler. If the index argument is properly bracketed for Indexed Literal Offset Addressing, the Access RAM argument is never specified; it will automatically be assumed to be ‘0’. This is in contrast to standard operation (extended instruction set disabled) when ‘a’ is set on the basis of the target address. Declaring the Access RAM bit in this mode will also generate an error in the MPASM Assembler. The destination argument, ‘d’, functions as before. In the latest versions of the MPASM assembler, language support for the extended instruction set must be explicitly invoked. This is done with either the command line option, /y, or the PE directive in the source listing. 24.2.4 CONSIDERATIONS WHEN ENABLING THE EXTENDED INSTRUCTION SET It is important to note that the extensions to the instruction set may not be beneficial to all users. In particular, users who are not writing code that uses a software stack may not benefit from using the extensions to the instruction set. Additionally, the Indexed Literal Offset Addressing mode may create issues with legacy applications written to the PIC18 assembler. This is because instructions in the legacy code may attempt to address registers in the Access Bank below 5Fh. Since these addresses are interpreted as literal offsets to FSR2 when the instruction set extension is enabled, the application may read or write to the wrong data addresses. When porting an application to the PIC18F2420/2520/ 4420/4520, it is very important to consider the type of code. A large, re-entrant application that is written in ‘C’ and would benefit from efficient compilation will do well when using the instruction set extensions. Legacy applications that heavily use the Access Bank will most likely not benefit from using the extended instruction set. Note: Enabling the PIC18 instruction set extension may cause legacy applications to behave erratically or fail entirely. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 315 PIC18F2420/2520/4420/4520 ADDWF ADD W to Indexed (Indexed Literal Offset mode) Syntax: ADDWF [k] {,d} Operands: 0 ≤ k ≤ 95 d ∈ [0,1] Operation: (W) + ((FSR2) + k) → dest Status Affected: N, OV, C, DC, Z Encoding: 0010 01d0 kkkk kkkk Description: The contents of W are added to the contents of the register indicated by FSR2, offset by the value ‘k’. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’ (default). Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write to destination Example: ADDWF [OFST] , 0 Before Instruction W = 17h OFST = 2Ch FSR2 = 0A00h Contents of 0A2Ch = 20h After Instruction W = 37h Contents of 0A2Ch = 20h BSF Bit Set Indexed (Indexed Literal Offset mode) Syntax: BSF [k], b Operands: 0 ≤ f ≤ 95 0 ≤ b ≤ 7 Operation: 1 → ((FSR2) + k) Status Affected: None Encoding: 1000 bbb0 kkkk kkkk Description: Bit ‘b’ of the register indicated by FSR2, offset by the value ‘k’, is set. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read register ‘f’ Process Data Write to destination Example: BSF [FLAG_OFST], 7 Before Instruction FLAG_OFST = 0Ah FSR2 = 0A00h Contents of 0A0Ah = 55h After Instruction Contents of 0A0Ah = D5h SETF Set Indexed (Indexed Literal Offset mode) Syntax: SETF [k] Operands: 0 ≤ k ≤ 95 Operation: FFh → ((FSR2) + k) Status Affected: None Encoding: 0110 1000 kkkk kkkk Description: The contents of the register indicated by FSR2, offset by ‘k’, are set to FFh. Words: 1 Cycles: 1 Q Cycle Activity: Q1 Q2 Q3 Q4 Decode Read ‘k’ Process Data Write register Example: SETF [OFST] Before Instruction OFST = 2Ch FSR2 = 0A00h Contents of 0A2Ch = 00h After Instruction Contents of 0A2Ch = FFh PIC18F2420/2520/4420/4520 DS39631B-page 316 Preliminary © 2007 Microchip Technology Inc. 24.2.5 SPECIAL CONSIDERATIONS WITH MICROCHIP MPLAB® IDE TOOLS The latest versions of Microchip’s software tools have been designed to fully support the extended instruction set of the PIC18F2420/2520/4420/4520 family of devices. This includes the MPLAB C18 C compiler, MPASM assembly language and MPLAB Integrated Development Environment (IDE). When selecting a target device for software development, MPLAB IDE will automatically set default configuration bits for that device. The default setting for the XINST configuration bit is ‘0’, disabling the extended instruction set and Indexed Literal Offset Addressing mode. For proper execution of applications developed to take advantage of the extended instruction set, XINST must be set during programming. To develop software for the extended instruction set, the user must enable support for the instructions and the Indexed Addressing mode in their language tool(s). Depending on the environment being used, this may be done in several ways: • A menu option, or dialog box within the environment, that allows the user to configure the language tool and its settings for the project • A command line option • A directive in the source code These options vary between different compilers, assemblers and development environments. Users are encouraged to review the documentation accompanying their development systems for the appropriate information. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 317 PIC18F2420/2520/4420/4520 25.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PRO MATE® II Universal Device Programmer - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration Boards - PICDEMTM 1 Demonstration Board - PICDEM.netTM Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board • Evaluation Kits - KEELOQ® Evaluation and Programming Tools - PICDEM MSC - microID® Developer Kits - CAN - PowerSmart® Developer Kits - Analog 25.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® based application that contains: • An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) • A full-featured editor with color coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Mouse over variable inspection • Extensive on-line help The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC emulator and simulator tools (automatically updates all project information) • Debug using: - source files (assembly or C) - mixed assembly and C - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 25.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: • Integration into MPLAB IDE projects • User defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process PIC18F2420/2520/4420/4520 DS39631B-page 318 Preliminary © 2007 Microchip Technology Inc. 25.3 MPLAB C17 and MPLAB C18 C Compilers The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip’s PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 25.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 25.5 MPLAB C30 C Compiler The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many command line options and language extensions to take full advantage of the dsPIC30F device hardware capabilities and afford fine control of the compiler code generator. MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high-level source debugging with the MPLAB IDE. 25.6 MPLAB ASM30 Assembler, Linker and Librarian MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it’s object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire dsPIC30F instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility 25.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PIC series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 25.8 MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high-speed simulator is designed to debug, analyze and optimize time intensive DSP routines. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 319 PIC18F2420/2520/4420/4520 25.9 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 25.10 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PIC microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory and the ability to view variables in real-time. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 25.11 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC microcontrollers. The MPLAB ICD 2 utilizes the incircuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers cost effective in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, singlestepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 25.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. 25.13 MPLAB PM3 Device Programmer The MPLAB PM3 is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand- Alone mode, the MPLAB PM3 device programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. MPLAB PM3 connects to the host PC via an RS-232 or USB cable. MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. PIC18F2420/2520/4420/4520 DS39631B-page 320 Preliminary © 2007 Microchip Technology Inc. 25.14 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PIC devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. 25.15 PICDEM 1 PIC Demonstration Board The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. 25.16 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface and a 16 x 2 LCD display. Also included is the book and CD-ROM “TCP/IP Lean, Web Servers for Embedded Systems,” by Jeremy Bentham 25.17 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18, 28 and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs and sample PIC18F452 and PIC16F877 Flash microcontrollers. 25.18 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 25.19 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8, 14 and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low-power operation with the supercapacitor circuit and jumpers allow onboard hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2 x 16 liquid crystal display, PCB footprints for H-Bridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User’s Guide. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 321 PIC18F2420/2520/4420/4520 25.20 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board Flash memory. A generous prototype area is available for user hardware expansion. 25.21 PICDEM 18R PIC18C601/801 Demonstration Board The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/Demultiplexed and 16-bit Memory modes. The board includes 2 Mb external Flash memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. 25.22 PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PIC microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature onboard LIN transceivers. A PIC16F874 Flash microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 25.23 PICkitTM 1 Flash Starter Kit A complete “development system in a box”, the PICkit™ Flash Starter Kit includes a convenient multi-section board for programming, evaluation and development of 8/14-pin Flash PIC® microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the User’s Guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB® IDE (Integrated Development Environment) software, software and hardware “Tips 'n Tricks for 8-pin Flash PIC® Microcontrollers” Handbook and a USB interface cable. Supports all current 8/14-pin Flash PIC microcontrollers, as well as many future planned devices. 25.24 PICDEM USB PIC16C7X5 Demonstration Board The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. 25.25 Evaluation and Programming Tools In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. • KEELOQ evaluation and programming tools for Microchip’s HCS Secure Data Products • CAN developers kit for automotive network applications • Analog design boards and filter design software • PowerSmart battery charging evaluation/ calibration kits • IrDA® development kit • microID development and rfLabTM development software • SEEVAL® designer kit for memory evaluation and endurance calculations • PICDEM MSC demo boards for Switching mode power supply, high-power IR driver, delta sigma ADC and flow rate sensor Check the Microchip web page and the latest Product Selector Guide for the complete list of demonstration and evaluation kits. PIC18F2420/2520/4420/4520 DS39631B-page 322 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 323 PIC18F2420/2520/4420/4520 26.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) Ambient temperature under bias.............................................................................................................-40°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD, MCLR and RA4) .......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V Total power dissipation (Note 1) ...............................................................................................................................1.0W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD)...................................................................................................................... ±20 mA Output clamp current, IOK (VO < 0 or VO > VDD) .............................................................................................................. ±20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk by all ports .......................................................................................................................200 mA Maximum current sourced by all ports ..................................................................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD – Σ IOH} + Σ {(VDD – VOH) x IOH} + Σ(VOL x IOL) 2: Voltage spikes below VSS at the MCLR/VPP/RE3 pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP/ RE3 pin, rather than pulling this pin directly to VSS. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. PIC18F2420/2520/4420/4520 DS39631B-page 324 Preliminary © 2007 Microchip Technology Inc. FIGURE 26-1: PIC18F2420/2520/4420/4520 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) FIGURE 26-2: PIC18LF2X1X/4X1X VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL) Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 40 MHz 5.0V 3.5V 3.0V 2.5V PIC18FX42X/X52X 4.2V Frequency Voltage 6.0V 5.5V 4.5V 4.0V 2.0V 40 MHz 5.0V 3.5V 3.0V 2.5V PIC18LFX42X/X52X FMAX = (16.36 MHz/V) (VDDAPPMIN – 2.0V) + 4 MHz Note: VDDAPPMIN is the minimum voltage of the PIC® device in the application. 4 MHz 4.2V © 2007 Microchip Technology Inc. Preliminary DS39631B-page 325 PIC18F2420/2520/4420/4520 26.1 DC Characteristics:Supply Voltage PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Symbol Characteristic Min Typ Max Units Conditions D001 VDD Supply Voltage 2.0 — 5.5 V HS, XT, RC and LP Oscillator modes D002 VDR RAM Data Retention Voltage(1) 1.5 — — V D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — — 0.7 V See section on Power-on Reset for details D004 SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms See section on Power-on Reset for details D005 VBOR Brown-out Reset Voltage BORV1:BORV0 = 11 1.94 2.05 2.16 V BORV1:BORV0 = 10 2.65 2.79 2.93 V BORV1:BORV0 = 01 4.11 4.33 4.55 V BORV1:BORV0 = 00 4.36 4.59 4.82 V Legend: Shading of rows is to assist in readability of the table. Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data. PIC18F2420/2520/4420/4520 DS39631B-page 326 Preliminary © 2007 Microchip Technology Inc. 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Power-down Current (IPD)(1) PIC18LF2X1X/4X1X 20 950 nA -40°C VDD = 2.0V, (Sleep mode) 0.02 1.0 μA +25°C 0.6 1.1 μA +85°C PIC18LF2X1X/4X1X 0.03 1.4 μA -40°C VDD = 3.0V, (Sleep mode) 0.03 1.5 μA +25°C 0.8 1.6 μA +85°C All devices 0.04 1.9 μA -40°C VDD = 5.0V, (Sleep mode) 0.04 2.0 μA +25°C 1.7 2.1 μA +85°C Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 327 PIC18F2420/2520/4420/4520 Supply Current (IDD)(2,3) PIC18LF2X1X/4X1X 15 31.5 μA -40°C FOSC = 31 kHz (RC_RUN mode, INTRC source) 15 30 μA +25°C VDD = 2.0V 15 28.5 μA +85°C PIC18LF2X1X/4X1X 40 63 μA -40°C 35 60 μA +25°C VDD = 3.0V 30 57 μA +85°C All devices 105 168 μA -40°C 90 160 μA +25°C VDD = 5.0V 80 152 μA +85°C PIC18LF2X1X/4X1X 0.32 630 μA -40°C FOSC = 1 MHz (RC_RUN mode, INTOSC source) 0.33 600 μA +25°C VDD = 2.0V 0.33 570 μA +85°C PIC18LF2X1X/4X1X 0.6 1.3 mA -40°C 0.55 1.2 mA +25°C VDD = 3.0V 0.6 1.1 mA +85°C All devices 1.1 2.3 mA -40°C 1.1 2.2 mA +25°C VDD = 5.0V 1.0 2.1 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631B-page 328 Preliminary © 2007 Microchip Technology Inc. Supply Current (IDD)(2,3) PIC18LF2X1X/4X1X 0.8 2.1 μA -40°C FOSC = 4 MHz (RC_RUN mode, INTRC source) 0.8 2.0 μA +25°C VDD = 2.0V 0.8 1.9 μA +85°C PIC18LF2X1X/4X1X 1.3 2.7 mA -40°C 1.3 2.6 mA +25°C VDD = 3.0V 1.3 2.5 mA +85°C All devices 2.5 5.3 mA -40°C 2.5 5.0 mA +25°C VDD = 5.0V 2.5 4.8 mA +85°C PIC18LF2X1X/4X1X 2.9 6.5 μA -40°C FOSC = 31 kHz (RC_IDLE mode, INTRC source) 3.1 6.2 μA +25°C VDD = 2.0V 3.6 5.9 μA +85°C PIC18LF2X1X/4X1X 4.5 10.1 μA -40°C 4.8 9.6 μA +25°C VDD = 3.0V 5.8 9.1 μA +85°C All devices 9.2 15.8 μA -40°C 9.8 15 μA +25°C VDD = 5.0V 11.4 14.3 μA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 329 PIC18F2420/2520/4420/4520 Supply Current (IDD)(2,3) PIC18LF2X1X/4X1X 165 315 μA -40°C FOSC = 1 MHz (RC_IDLE mode, INTOSC source) 175 300 μA +25°C VDD = 2.0V 190 285 μA +85°C PIC18LF2X1X/4X1X 250 470 μA -40°C 270 450 μA +25°C VDD = 3.0V 290 430 μA +85°C All devices 500 840 μA -40°C 520 800 μA +25°C VDD = 5.0V 550 760 μA +85°C PIC18LF2X1X/4X1X 340 525 μA -40°C FOSC = 4 MHz (RC_IDLE mode, INTOSC source) 350 500 μA +25°C VDD = 2.0V 360 475 μA +85°C PIC18LF2X1X/4X1X 520 735 μA -40°C 540 700 μA +25°C VDD = 3.0V 580 665 μA +85°C All devices 1.0 1.6 mA -40°C 1.1 1.5 mA +25°C VDD = 5.0V 1.1 1.4 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631B-page 330 Preliminary © 2007 Microchip Technology Inc. Supply Current (IDD)(2,3) PIC18LF2X1X/4X1X 250 420 μA -40°C FOSC = 1 MHZ (PRI_RUN, EC oscillator) 260 400 μA +25°C VDD = 2.0V 250 380 μA +85°C PIC18LF2X1X/4X1X 550 740 μA -40°C 480 700 μA +25°C VDD = 3.0V 460 670 μA +85°C All devices 1.2 1.6 mA -40°C 1.1 1.5 mA +25°C VDD = 5.0V 1.0 1.4 mA +85°C PIC18LF2X1X/4X1X 0.72 1.6 mA -40°C FOSC = 4 MHz (PRI_RUN, EC oscillator) 0.74 1.5 mA +25°C VDD = 2.0V 0.74 1.4 mA +85°C PIC18LF2X1X/4X1X 1.3 2.6 mA -40°C 1.3 2.5 mA +25°C VDD = 3.0V 1.3 2.4 mA +85°C All devices 2.7 4.7 mA -40°C 2.6 4.5 mA +25°C VDD = 5.0V 2.5 4.3 mA +85°C All devices 15 26 mA -40°C FOSC = 40 MHZ (PRI_RUN, EC oscillator) 16 25 mA +25°C VDD = 4.2V 16 24 mA +85°C All devices 21 32 mA -40°C 21 30 mA +25°C VDD = 5.0V 21 28 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 331 PIC18F2420/2520/4420/4520 Supply Current (IDD)(2,3) All devices 7.5 16 mA -40°C VDD = 4.2V FOSC = 4 MHZ (PRI_RUN HS+PLL) 7.4 15 mA +25°C 7.3 14 mA +85°C All devices 10 21 mA -40°C VDD = 5.0V FOSC = 4 MHZ 10 20 mA +25°C (PRI_RUN HS+PLL) 9.7 19 mA +85°C All devices 17 35 mA -40°C VDD = 4.2V FOSC = 10 MHZ 17 34 mA +25°C (PRI_RUN HS+PLL) 17 33 mA +85°C All devices 23 46 mA -40°C VDD = 5.0V FOSC = 10 MHZ 23 45 mA +25°C (PRI_RUN HS+PLL) 23 43 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631B-page 332 Preliminary © 2007 Microchip Technology Inc. Supply Current (IDD)(2,3) PIC18LF2X1X/4X1X 65 130 μA -40°C FOSC = 1 MHz (PRI_IDLE mode, EC oscillator) 65 120 μA +25°C VDD = 2.0V 70 115 μA +85°C PIC18LF2X1X/4X1X 120 270 μA -40°C 120 250 μA +25°C VDD = 3.0V 130 240 μA +85°C All devices 300 480 μA -40°C 240 450 μA +25°C VDD = 5.0V 300 430 μA +85°C PIC18LF2X1X/4X1X 260 475 μA -40°C FOSC = 4 MHz (PRI_IDLE mode, EC oscillator) 255 450 μA +25°C VDD = 2.0V 270 430 μA +85°C PIC18LF2X1X/4X1X 420 900 μA -40°C 430 850 μA +25°C VDD = 3.0V 450 810 μA +85°C All devices 0.9 1.5 mA -40°C 0.9 1.4 mA +25°C VDD = 5.0V 0.9 1.3 mA +85°C All devices 6.0 9.5 mA -40°C FOSC = 40 MHz (PRI_IDLE mode, EC oscillator) 6.2 9.0 mA +25°C VDD = 4.2 V 6.6 8.6 mA +85°C All devices 8.1 12.6 mA -40°C 9.1 12.0 mA +25°C VDD = 5.0V 8.3 11.4 mA +85°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 333 PIC18F2420/2520/4420/4520 Supply Current (IDD)(2,3) PIC18LF2X1X/4X1X 14 31.5 μA -10°C FOSC = 32 kHz(4) (SEC_RUN mode, Timer1 as clock) 15 30 μA +25°C VDD = 2.0V 16 29 μA +70°C PIC18LF2X1X/4X1X 40 74 μA -10°C 35 70 μA +25°C VDD = 3.0V 31 67 μA +70°C All devices 99 126 μA -10°C 81 120 μA +25°C VDD = 5.0V 75 114 μA +70°C PIC18LF2X1X/4X1X 2.5 7.4 μA -10°C FOSC = 32 kHz(4) (SEC_IDLE mode, Timer1 as clock) 3.7 7.0 μA +25°C VDD = 2.0V 4.5 6.7 μA +70°C PIC18LF2X1X/4X1X 5.0 10.5 μA -10°C 5.4 10 μA +25°C VDD = 3.0V 6.3 9.5 μA +70°C All devices 8.5 17 μA -10°C 9.0 16 μA +25°C VDD = 5.0V 10.5 15 μA +70°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. PIC18F2420/2520/4420/4520 DS39631B-page 334 Preliminary © 2007 Microchip Technology Inc. Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD) D022 (ΔIWDT) Watchdog Timer 1.3 7.6 μA -40°C 1.4 8.0 μA +25°C VDD = 2.0V 2.0 8.4 μA +85°C 1.9 11.4 μA -40°C 2.0 12.0 μA +25°C VDD = 3.0V 2.8 12.6 μA +85°C 4.0 14.3 μA -40°C 5.5 15.0 μA +25°C VDD = 5.0V 5.6 15.8 μA +85°C D022A (ΔIBOR) Brown-out Reset(5) 35 52 μA -40°C to +85°C VDD = 3.0V 40 63 μA -40°C to +85°C VDD = 5.0V 40 63 μA -40°C to +85°C VDD = 5.0V Sleep mode, BOREN1:BOREN0 = 10 D022B (ΔILVD) High/Low-Voltage Detect(5) 22 47 μA -40°C to +85°C VDD = 2.0V 25 58 μA -40°C to +85°C VDD = 3.0V 29 69 μA -40°C to +85°C VDD = 5.0V D025 (ΔIOSCB) Timer1 Oscillator 0.01 4.8 μA -10°C 0.01 5.0 μA +25°C VDD = 2.0V 32 kHz on Timer1(4) 0.01 5.3 μA +70°C 0.01 7.6 μA -10°C 0.01 8.0 μA +25°C VDD = 3.0V 32 kHz on Timer1(4) 0.01 8.4 μA +70°C 0.01 9.5 μA -10°C 0.01 10.0 μA +25°C VDD = 5.0V 32 kHz on Timer1(4) 0.01 10.5 μA +70°C D026 (ΔIAD) A/D Converter 1.0 2.0 μA VDD = 2.0V 1.0 2.0 μA VDD = 3.0V A/D on, not converting 1.0 2.0 μA VDD = 5.0V 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial ParamNo. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT enabled/disabled as specified. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kΩ. 4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature crystals are available at a much higher cost. 5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 335 PIC18F2420/2520/4420/4520 26.3 DC Characteristics: PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Symbol Characteristic Min Max Units Conditions VIL Input Low Voltage I/O ports: D030 with TTL buffer VSS 0.15 VDD V VDD < 4.5V D030A — 0.8 V 4.5V ≤ VDD ≤ 5.5V D031 with Schmitt Trigger buffer RC3 and RC4 VSS VSS 0.2 VDD 0.3 VDD V V D032 MCLR VSS 0.2 VDD V D033 OSC1 VSS 0.3 VDD V HS, HSPLL modes D033A D033B D034 OSC1 OSC1 T13CKI VSS VSS VSS 0.2 VDD 0.3 VDD 0.3 VDD V V V RC, EC modes(1) XT, LP modes VIH Input High Voltage I/O ports: D040 with TTL buffer 0.25 VDD + 0.8V VDD V VDD < 4.5V D040A 2.0 VDD V 4.5V ≤ VDD ≤ 5.5V D041 with Schmitt Trigger buffer RC3 and RC4 0.8 VDD 0.7 VDD VDD VDD V V D042 MCLR 0.8 VDD VDD V D043 OSC1 0.7 VDD VDD V HS, HSPLL modes D043A D043B D043C D044 OSC1 OSC1 OSC1 T13CKI 0.8 VDD 0.9 VDD 1.6 1.6 VDD VDD VDD VDD V V V V EC mode RC mode(1) XT, LP modes IIL Input Leakage Current(2,3) D060 I/O ports — ±1 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance D061 MCLR — ±5 μA Vss ≤ VPIN ≤ VDD D063 OSC1 — ±5 μA Vss ≤ VPIN ≤ VDD IPU Weak Pull-up Current D070 IPURB PORTB weak pull-up current 50 400 μA VDD = 5V, VPIN = VSS Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC® device be driven with an external clock while in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. 4: Parameter is characterized but not tested. PIC18F2420/2520/4420/4520 DS39631B-page 336 Preliminary © 2007 Microchip Technology Inc. VOL Output Low Voltage D080 I/O ports — 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40°C to +85°C D083 OSC2/CLKO (RC, RCIO, EC, ECIO modes) — 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40°C to +85°C VOH Output High Voltage(3) D090 I/O ports VDD – 0.7 — V IOH = -3.0 mA, VDD = 4.5V, -40°C to +85°C D092 OSC2/CLKO (RC, RCIO, EC, ECIO modes) VDD – 0.7 — V IOH = -1.3 mA, VDD = 4.5V, -40°C to +85°C Capacitive Loading Specs on Output Pins D100(4) COSC2 OSC2 pin — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101 CIO All I/O pins and OSC2 (in RC mode) — 50 pF To meet the AC Timing Specifications D102 CB SCL, SDA — 400 pF I2C™ Specification 26.3 DC Characteristics: PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2X1X/4X1X (Industrial) (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Symbol Characteristic Min Max Units Conditions Note 1: In RC oscillator configuration, the OSC1/CLKI pin is a Schmitt Trigger input. It is not recommended that the PIC® device be driven with an external clock while in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. 4: Parameter is characterized but not tested. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 337 PIC18F2420/2520/4420/4520 TABLE 26-1: MEMORY PROGRAMMING REQUIREMENTS DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Sym Characteristic Min Typ† Max Units Conditions Internal Program Memory Programming Specifications(1) D110 VPP Voltage on MCLR/VPP/RE3 pin 9.00 — 13.25 V (Note 3) D113 IDDP Supply Current during Programming — — 10 mA Data EEPROM Memory D120 ED Byte Endurance 100K 1M — E/W -40°C to +85°C D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write VMIN = Minimum operating voltage D122 TDEW Erase/Write Cycle Time — 4 — ms D123 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated D124 TREF Number of Total Erase/Write Cycles before Refresh(2) 1M 10M — E/W -40°C to +85°C Program Flash Memory D130 EP Cell Endurance 10K 100K — E/W -40°C to +85°C D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating voltage D132 VIE VDD for Block Erase 4.5 — 5.5 V Using ICSP port D132A VIW VDD for Externally Timed Erase or Write 4.5 — 5.5 V Using ICSP port D132B VPEW VDD for Self-timed Write VMIN — 5.5 V VMIN = Minimum operating voltage D133 TIE ICSP Block Erase Cycle Time — 4 — ms VDD > 4.5V D133A TIW ICSP Erase or Write Cycle Time (externally timed) 1 — — ms VDD > 4.5V D133A TIW Self-timed Write Cycle Time — 2 — ms D134 TRETD Characteristic Retention 40 100 — Year Provided no other specifications are violated † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: These specifications are for programming the on-chip program memory through the use of table write instructions. 2: Refer to Section 7.8 “Using the Data EEPROM” for a more detailed discussion on data EEPROM endurance. 3: Required only if single-supply programming is disabled. PIC18F2420/2520/4420/4520 DS39631B-page 338 Preliminary © 2007 Microchip Technology Inc. TABLE 26-2: COMPARATOR SPECIFICATIONS TABLE 26-3: VOLTAGE REFERENCE SPECIFICATIONS Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated). Param No. Sym Characteristics Min Typ Max Units Comments D300 VIOFF Input Offset Voltage — ±5.0 ±10 mV D301 VICM Input Common Mode Voltage* 0 — VDD – 1.5 V D302 CMRR Common Mode Rejection Ratio* 55 — — dB 300 TRESP Response Time(1)* — 150 400 ns PIC18FXXXX 300A — 150 600 ns PIC18LFXXXX, VDD = 2.0V 301 TMC2OV Comparator Mode Change to Output Valid* — — 10 μs * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions from VSS to VDD. Operating Conditions: 3.0V < VDD < 5.5V, -40°C < TA < +85°C (unless otherwise stated). Param No. Sym Characteristics Min Typ Max Units Comments D310 VRES Resolution VDD/24 — VDD/32 LSb D311 VRAA Absolute Accuracy — — 1/2 LSb Low Range (CVRR = 1) D312 VRUR Unit Resistor Value (R)* — 2k — Ω 310 TSET Settling Time(1)* — — 10 μs * These parameters are characterized but not tested. Note 1: Settling time measured while CVRR = 1 and CVR3:CVR0 transitions from ‘0000’ to ‘1111’. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 339 PIC18F2420/2520/4420/4520 FIGURE 26-3: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS TABLE 26-4: HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS VLVD HLVDIF VDD (HLVDIF set by hardware) (HLVDIF can be cleared in software) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Symbol Characteristic Min Typ† Max Units Conditions D420 HLVD Voltage on VDD Transition High-to-Low LVV = 0000 2.12 2.17 2.22 V LVV = 0001 2.18 2.23 2.28 V LVV = 0010 2.31 2.36 2.42 V LVV = 0011 2.38 2.44 2.49 V LVV = 0100 2.54 2.60 2.66 V LVV = 0101 2.72 2.79 2.85 V LVV = 0110 2.82 2.89 2.95 V LVV = 0111 3.05 3.12 3.19 V LVV = 1000 3.31 3.39 3.47 V LVV = 1001 3.46 3.55 3.63 V LVV = 1010 3.63 3.71 3.80 V LVV = 1011 3.81 3.90 3.99 V LVV = 1100 4.01 4.11 4.20 V LVV = 1101 4.23 4.33 4.43 V LVV = 1110 4.48 4.59 4.69 V † Production tested at TAMB = 25°C. Specifications over temperature limits ensured by characterization. PIC18F2420/2520/4420/4520 DS39631B-page 340 Preliminary © 2007 Microchip Technology Inc. 26.4 AC (Timing) Characteristics 26.4.1 TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created using one of the following formats: 1. TppS2ppS 3. TCC:ST (I2C specifications only) 2. TppS 4. Ts (I2C specifications only) T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKO rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O port t1 T13CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance I2C only AA output access High High BUF Bus free Low Low TCC:ST (I2C specifications only) CC HD Hold SU Setup ST DAT DATA input hold STO Stop condition STA Start condition © 2007 Microchip Technology Inc. Preliminary DS39631B-page 341 PIC18F2420/2520/4420/4520 26.4.2 TIMING CONDITIONS The temperature and voltages specified in Table 26-5 apply to all timing specifications unless otherwise noted. Figure 26-4 specifies the load conditions for the timing specifications. TABLE 26-5: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC FIGURE 26-4: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Note: Because of space limitations, the generic terms “PIC18FXXXX” and “PIC18LFXXXX” are used throughout this section to refer to the PIC18F2420/2520/4420/4520 and PIC18LF2X1X/4X1X families of devices specifically and only those devices. AC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Operating voltage VDD range as described in DC spec Section 26.1 and Section 26.3. LF parts operate for industrial temperatures only. VDD/2 CL RL Pin Pin VSS VSS CL RL = 464Ω CL = 50 pF for all pins except OSC2/CLKO and including D and E outputs as ports Load Condition 1 Load Condition 2 PIC18F2420/2520/4420/4520 DS39631B-page 342 Preliminary © 2007 Microchip Technology Inc. 26.4.3 TIMING DIAGRAMS AND SPECIFICATIONS FIGURE 26-5: EXTERNAL CLOCK TIMING (ALL MODES EXCEPT PLL) TABLE 26-6: EXTERNAL CLOCK TIMING REQUIREMENTS OSC1 CLKO Q4 Q1 Q2 Q3 Q4 Q1 1 2 3 3 4 4 Param. No. Symbol Characteristic Min Max Units Conditions 1A FOSC External CLKI Frequency(1) DC 40 MHz EC, ECIO Oscillator mode Oscillator Frequency(1) DC 4 MHz RC Oscillator mode 0.1 4 MHz XT Oscillator mode 4 25 MHz HS Oscillator mode 4 10 MHz HS + PLL Oscillator mode 5 33 kHz LP Oscillator mode 1 TOSC External CLKI Period(1) 25 — ns EC, ECIO Oscillator mode Oscillator Period(1) 250 — ns RC Oscillator mode 250 10,000 ns XT Oscillator mode 40 100 250 250 ns ns HS Oscillator mode HS + PLL Oscillator mode 30 — μs LP Oscillator mode 2 TCY Instruction Cycle Time(1) 100 — ns TCY = 4/FOSC 3 TOSL, TOSH External Clock in (OSC1) High or Low Time 30 — ns XT Oscillator mode 2.5 — μs LP Oscillator mode 10 — ns HS Oscillator mode 4 TOSR, TOSF External Clock in (OSC1) Rise or Fall Time — 20 ns XT Oscillator mode — 50 ns LP Oscillator mode — 7.5 ns HS Oscillator mode Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period for all configurations except PLL. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the “max.” cycle time limit is “DC” (no clock) for all devices. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 343 PIC18F2420/2520/4420/4520 TABLE 26-7: PLL CLOCK TIMING SPECIFICATIONS (VDD = 4.2V TO 5.5V) TABLE 26-8: AC CHARACTERISTICS: INTERNAL RC ACCURACY PIC18F2420/2520/4420/4520 (INDUSTRIAL) PIC18LF2X1X/4X1X (INDUSTRIAL) Param No. Sym Characteristic Min Typ† Max Units Conditions F10 FOSC Oscillator Frequency Range 4 — 10 MHz HS mode only F11 FSYS On-Chip VCO System Frequency 16 — 40 MHz HS mode only F12 trc PLL Start-up Time (Lock Time) — — 2 ms F13 ΔCLK CLKO Stability (Jitter) -2 — +2 % † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. PIC18LF2X1X/4X1X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18FX42X/X52X (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Device Min Typ Max Units Conditions INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1) PIC18LF2X1X/4X1X -2 +/-1 2 % +25°C VDD = 2.7-3.3V -5 — 5 % -10°C to +85°C VDD = 2.7-3.3V -10 +/-1 10 % -40°C to +85°C VDD = 2.7-3.3V PIC18FX42X/X52X -2 +/-1 2 % +25°C VDD = 4.5-5.5V -5 — 5 % -10°C to +85°C VDD = 4.5-5.5V -10 +/-1 10 % -40°C to +85°C VDD = 4.5-5.5V INTRC Accuracy @ Freq = 31 kHz(2) PIC18LF2X1X/4X1X 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V PIC18FX42X/X52X 26.562 — 35.938 kHz -40°C to +85°C VDD = 4.5-5.5V Legend: Shading of rows is to assist in readability of the table. Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift. 2: INTRC frequency after calibration. 3: Change of INTRC frequency as VDD changes. PIC18F2420/2520/4420/4520 DS39631B-page 344 Preliminary © 2007 Microchip Technology Inc. FIGURE 26-6: CLKO AND I/O TIMING TABLE 26-9: CLKO AND I/O TIMING REQUIREMENTS Note: Refer to Figure 26-4 for load conditions. OSC1 CLKO I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 10 13 14 17 20, 21 19 18 15 11 12 16 Old Value New Value Param No. Symbol Characteristic Min Typ Max Units Conditions 10 TosH2ckL OSC1 ↑ to CLKO ↓ — 75 200 ns (Note 1) 11 TosH2ckH OSC1 ↑ to CLKO ↑ — 75 200 ns (Note 1) 12 TckR CLKO Rise Time — 35 100 ns (Note 1) 13 TckF CLKO Fall Time — 35 100 ns (Note 1) 14 TckL2ioV CLKO ↓ to Port Out Valid — — 0.5 TCY + 20 ns (Note 1) 15 TioV2ckH Port In Valid before CLKO ↑ 0.25 TCY + 25 — — ns (Note 1) 16 TckH2ioI Port In Hold after CLKO ↑ 0 — — ns (Note 1) 17 TosH2ioV OSC1 ↑ (Q1 cycle) to Port Out Valid — 50 150 ns 18 TosH2ioI OSC1 ↑ (Q2 cycle) to Port Input Invalid (I/O in hold time) PIC18FXXXX 100 — — ns 18A PIC18LFXXXX 200 — — ns VDD = 2.0V 19 TioV2osH Port Input Valid to OSC1 ↑ (I/O in setup time) 0 — — ns 20 TioR Port Output Rise Time PIC18FXXXX — 10 25 ns 20A PIC18LFXXXX — — 60 ns VDD = 2.0V 21 TioF Port Output Fall Time PIC18FXXXX — 10 25 ns 21A PIC18LFXXXX — — 60 ns VDD = 2.0V 22† TINP INT pin High or Low Time TCY — — ns 23† TRBP RB7:RB4 Change INT High or Low Time TCY — — ns 24† TRCP RC7:RC4 Change INT High or Low Time 20 ns † These parameters are asynchronous events not related to any internal clock edges. Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 345 PIC18F2420/2520/4420/4520 FIGURE 26-7: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING FIGURE 26-8: BROWN-OUT RESET TIMING TABLE 26-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET REQUIREMENTS Param. No. Symbol Characteristic Min Typ Max Units Conditions 30 TmcL MCLR Pulse Width (low) 2 — — μs 31 TWDT Watchdog Timer Time-out Period (no postscaler) — 4.00 TBD ms 32 TOST Oscillation Start-up Timer Period 1024 TOSC — 1024 TOSC — TOSC = OSC1 period 33 TPWRT Power-up Timer Period — 65.5 TBD ms 34 TIOZ I/O High-Impedance from MCLR Low or Watchdog Timer Reset — 2 — μs 35 TBOR Brown-out Reset Pulse Width 200 — — μs VDD ≤ BVDD (see D005) 36 TIVRST Time for Internal Reference Voltage to become Stable — 20 50 μs 37 TLVD High/Low-Voltage Detect Pulse Width 200 — — μs VDD ≤ VLVD 38 TCSD CPU Start-up Time 5 — 10 μs 39 TIOBST Time for INTOSC to Stabilize — 1 — ms Legend: TBD = To Be Determined VDD MCLR Internal POR PWRT Time-out OSC Time-out Internal Reset Watchdog Timer Reset 33 32 30 31 34 I/O pins 34 Note: Refer to Figure 26-4 for load conditions. VDD BVDD 35 VBGAP = 1.2V VIRVST Enable Internal Internal Reference 36 Reference Voltage Voltage Stable PIC18F2420/2520/4420/4520 DS39631B-page 346 Preliminary © 2007 Microchip Technology Inc. FIGURE 26-9: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS TABLE 26-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Note: Refer to Figure 26-4 for load conditions. 46 47 45 48 41 42 40 T0CKI T1OSO/T13CKI TMR0 or TMR1 Param No. Symbol Characteristic Min Max Units Conditions 40 Tt0H T0CKI High Pulse Width No prescaler 0.5 TCY + 20 — ns With prescaler 10 — ns 41 Tt0L T0CKI Low Pulse Width No prescaler 0.5 TCY + 20 — ns With prescaler 10 — ns 42 Tt0P T0CKI Period No prescaler TCY + 10 — ns With prescaler Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4,..., 256) 45 Tt1H T13CKI High Time Synchronous, no prescaler 0.5 TCY + 20 — ns Synchronous, with prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 25 — ns VDD = 2.0V Asynchronous PIC18FXXXX 30 — ns PIC18LFXXXX 50 — ns VDD = 2.0V 46 Tt1L T13CKI Low Time Synchronous, no prescaler 0.5 TCY + 5 — ns Synchronous, with prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 25 — ns VDD = 2.0V Asynchronous PIC18FXXXX 30 — ns PIC18LFXXXX 50 — ns VDD = 2.0V 47 Tt1P T13CKI Input Period Synchronous Greater of: 20 ns or (TCY + 40)/N — ns N = prescale value (1, 2, 4, 8) Asynchronous 60 — ns Ft1 T13CKI Oscillator Input Frequency Range DC 50 kHz 48 Tcke2tmrI Delay from External T13CKI Clock Edge to Timer Increment 2 TOSC 7 TOSC — © 2007 Microchip Technology Inc. Preliminary DS39631B-page 347 PIC18F2420/2520/4420/4520 FIGURE 26-10: CAPTURE/COMPARE/PWM TIMINGS (ALL CCP MODULES) TABLE 26-12: CAPTURE/COMPARE/PWM REQUIREMENTS (ALL CCP MODULES) Note: Refer to Figure 26-4 for load conditions. CCPx (Capture Mode) 50 51 52 CCPx 53 54 (Compare or PWM Mode) Param No. Symbol Characteristic Min Max Units Conditions 50 TccL CCPx Input Low Time No prescaler 0.5 TCY + 20 — ns With prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 20 — ns VDD = 2.0V 51 TccH CCPx Input High Time No prescaler 0.5 TCY + 20 — ns With prescaler PIC18FXXXX 10 — ns PIC18LFXXXX 20 — ns VDD = 2.0V 52 TccP CCPx Input Period 3 TCY + 40 N — ns N = prescale value (1, 4 or 16) 53 TccR CCPx Output Fall Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 54 TccF CCPx Output Fall Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V PIC18F2420/2520/4420/4520 DS39631B-page 348 Preliminary © 2007 Microchip Technology Inc. FIGURE 26-11: PARALLEL SLAVE PORT TIMING (PIC18F4420/4520) TABLE 26-13: PARALLEL SLAVE PORT REQUIREMENTS (PIC18F4420/4520) Note: Refer to Figure 26-4 for load conditions. RE2/CS RE0/RD RE1/WR RD7:RD0 62 63 64 65 Param. No. Symbol Characteristic Min Max Units Conditions 62 TdtV2wrH Data In Valid before WR ↑ or CS ↑ (setup time) 20 — ns 63 TwrH2dtI WR ↑ or CS ↑ to Data–In Invalid (hold time) PIC18FXXXX 20 — ns PIC18LFXXXX 35 — ns VDD = 2.0V 64 TrdL2dtV RD ↓ and CS ↓ to Data–Out Valid — 80 ns 65 TrdH2dtI RD ↑ or CS ↓ to Data–Out Invalid 10 30 ns 66 TibfINH Inhibit of the IBF Flag bit being Cleared from WR ↑ or CS ↑ — 3 TCY © 2007 Microchip Technology Inc. Preliminary DS39631B-page 349 PIC18F2420/2520/4420/4520 FIGURE 26-12: EXAMPLE SPI MASTER MODE TIMING (CKE = 0) TABLE 26-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 70 71 72 73 74 75, 76 79 78 80 78 79 MSb bit 6 - - - - - -1 LSb MSb In bit 6 - - - -1 LSb In Note: Refer to Figure 26-4 for load conditions. Param No. Symbol Characteristic Min Max Units Conditions 70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input TCY — ns 71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns 71A Single Byte 40 — ns (Note 1) 72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns 72A Single Byte 40 — ns (Note 1) 73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 100 — ns 73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 100 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 79 TscF SCK Output Fall Time (Master mode) — 25 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. PIC18F2420/2520/4420/4520 DS39631B-page 350 Preliminary © 2007 Microchip Technology Inc. FIGURE 26-13: EXAMPLE SPI MASTER MODE TIMING (CKE = 1) TABLE 26-15: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 1) SS SCK (CKP = 0) SCK (CKP = 1) SDO SDI 81 71 72 74 75, 76 78 80 MSb 79 73 MSb In bit 6 - - - - - -1 bit 6 - - - -1 LSb In LSb Note: Refer to Figure 26-4 for load conditions. Param. No. Symbol Characteristic Min Max Units Conditions 71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns 71A Single Byte 40 — ns (Note 1) 72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns 72A Single Byte 40 — ns (Note 1) 73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 100 — ns 73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 100 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns PIC18LFXXXX 45 ns VDD = 2.0V 79 TscF SCK Output Fall Time (Master mode) — 25 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX 100 ns VDD = 2.0V 81 TdoV2scH, TdoV2scL SDO Data Output Setup to SCK Edge TCY — ns Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 351 PIC18F2420/2520/4420/4520 FIGURE 26-14: EXAMPLE SPI SLAVE MODE TIMING (CKE = 0) TABLE 26-16: EXAMPLE SPI MODE REQUIREMENTS (SLAVE MODE TIMING, CKE = 0) Param No. Symbol Characteristic Min Max Units Conditions 70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input TCY — ns 71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns 71A Single Byte 40 — ns (Note 1) 72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns 72A Single Byte 40 — ns (Note 1) 73 TdiV2scH, TdiV2scL Setup Time of SDI Data Input to SCK Edge 100 — ns 73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 100 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 77 TssH2doZ SS↑ to SDO Output High-Impedance 10 50 ns 78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns PIC18LFXXXX 45 ns VDD = 2.0V 79 TscF SCK Output Fall Time (Master mode) — 25 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX 100 ns VDD = 2.0V 83 TscH2ssH, TscL2ssH SS ↑ after SCK edge 1.5 TCY + 40 — ns Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. SS SCK (CKP = 0) SCK (CKP = 1) SDO 70 71 72 73 74 75, 76 77 79 78 80 78 79 SDI MSb bit 6 - - - - - -1 LSb MSb In bit 6 - - - -1 LSb In 83 Note: Refer to Figure 26-4 for load conditions. PIC18F2420/2520/4420/4520 DS39631B-page 352 Preliminary © 2007 Microchip Technology Inc. FIGURE 26-15: EXAMPLE SPI SLAVE MODE TIMING (CKE = 1) TABLE 26-17: EXAMPLE SPI SLAVE MODE REQUIREMENTS (CKE = 1) Param No. Symbol Characteristic Min Max Units Conditions 70 TssL2scH, TssL2scL SS ↓ to SCK ↓ or SCK ↑ Input TCY — ns 71 TscH SCK Input High Time (Slave mode) Continuous 1.25 TCY + 30 — ns 71A Single Byte 40 — ns (Note 1) 72 TscL SCK Input Low Time (Slave mode) Continuous 1.25 TCY + 30 — ns 72A Single Byte 40 — ns (Note 1) 73A Tb2b Last Clock Edge of Byte 1 to the First Clock Edge of Byte 2 1.5 TCY + 40 — ns (Note 2) 74 TscH2diL, TscL2diL Hold Time of SDI Data Input to SCK Edge 100 — ns 75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns PIC18LFXXXX 45 ns VDD = 2.0V 76 TdoF SDO Data Output Fall Time — 25 ns 77 TssH2doZ SS↑ to SDO Output High-Impedance 10 50 ns 78 TscR SCK Output Rise Time (Master mode) PIC18FXXXX — 25 ns PIC18LFXXXX — 45 ns VDD = 2.0V 79 TscF SCK Output Fall Time (Master mode) — 25 ns 80 TscH2doV, TscL2doV SDO Data Output Valid after SCK Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V 82 TssL2doV SDO Data Output Valid after SS ↓ Edge PIC18FXXXX — 50 ns PIC18LFXXXX — 100 ns VDD = 2.0V 83 TscH2ssH, TscL2ssH SS ↑ after SCK Edge 1.5 TCY + 40 — ns Note 1: Requires the use of Parameter #73A. 2: Only if Parameter #71A and #72A are used. SS SCK (CKP = 0) SCK (CKP = 1) SDO 70 71 72 82 SDI 74 75, 76 MSb bit 6 - - - - - -1 LSb 77 MSb In bit 6 - - - -1 LSb In 80 83 Note: Refer to Figure 26-4 for load conditions. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 353 PIC18F2420/2520/4420/4520 FIGURE 26-16: I2C BUS START/STOP BITS TIMING TABLE 26-18: I2C BUS START/STOP BITS REQUIREMENTS (SLAVE MODE) FIGURE 26-17: I2C BUS DATA TIMING Note: Refer to Figure 26-4 for load conditions. 91 92 93 SCL SDA Start Condition Stop Condition 90 Param. No. Symbol Characteristic Min Max Units Conditions 90 TSU:STA Start Condition 100 kHz mode 4700 — ns Only relevant for Repeated Setup Time 400 kHz mode 600 — Start condition 91 THD:STA Start Condition 100 kHz mode 4000 — ns After this period, the first Hold Time 400 kHz mode 600 — clock pulse is generated 92 TSU:STO Stop Condition 100 kHz mode 4700 — ns Setup Time 400 kHz mode 600 — 93 THD:STO Stop Condition 100 kHz mode 4000 — ns Hold Time 400 kHz mode 600 — Note: Refer to Figure 26-4 for load conditions. 90 91 92 100 101 103 106 107 109 109 110 102 SCL SDA In SDA Out PIC18F2420/2520/4420/4520 DS39631B-page 354 Preliminary © 2007 Microchip Technology Inc. TABLE 26-19: I2C BUS DATA REQUIREMENTS (SLAVE MODE) Param. No. Symbol Characteristic Min Max Units Conditions 100 THIGH Clock High Time 100 kHz mode 4.0 — μs PIC18FXXXX must operate at a minimum of 1.5 MHz 400 kHz mode 0.6 — μs PIC18FXXXX must operate at a minimum of 10 MHz SSP Module 1.5 TCY — 101 TLOW Clock Low Time 100 kHz mode 4.7 — μs PIC18FXXXX must operate at a minimum of 1.5 MHz 400 kHz mode 1.3 — μs PIC18FXXXX must operate at a minimum of 10 MHz SSP Module 1.5 TCY — 102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF 103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns 400 kHz mode 20 + 0.1 CB 300 ns CB is specified to be from 10 to 400 pF 90 TSU:STA Start Condition Setup Time 100 kHz mode 4.7 — μs Only relevant for Repeated 400 kHz mode 0.6 — μs Start condition 91 THD:STA Start Condition Hold Time 100 kHz mode 4.0 — μs After this period, the first 400 kHz mode 0.6 — μs clock pulse is generated 106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 μs 107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns 92 TSU:STO Stop Condition Setup Time 100 kHz mode 4.7 — μs 400 kHz mode 0.6 — μs 109 TAA Output Valid from Clock 100 kHz mode — 3500 ns (Note 1) 400 kHz mode — — ns 110 TBUF Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — μs D102 CB Bus Capacitive Loading — 400 pF Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 2: A fast mode I2C bus device can be used in a standard mode I2C bus system but the requirement, TSU:DAT ≥ 250 ns, must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the standard mode I2C bus specification), before the SCL line is released. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 355 PIC18F2420/2520/4420/4520 FIGURE 26-18: MASTER SSP I2C BUS START/STOP BITS TIMING WAVEFORMS TABLE 26-20: MASTER SSP I2C BUS START/STOP BITS REQUIREMENTS FIGURE 26-19: MASTER SSP I2C BUS DATA TIMING Note: Refer to Figure 26-4 for load conditions. 91 93 SCL SDA Start Condition Stop Condition 90 92 Param. No. Symbol Characteristic Min Max Units Conditions 90 TSU:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Only relevant for Repeated Start condition Setup Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 91 THD:STA Start Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns After this period, the first clock pulse is generated Hold Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 92 TSU:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Setup Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — 93 THD:STO Stop Condition 100 kHz mode 2(TOSC)(BRG + 1) — ns Hold Time 400 kHz mode 2(TOSC)(BRG + 1) — 1 MHz mode(1) 2(TOSC)(BRG + 1) — Note 1: Maximum pin capacitance = 10 pF for all I2C pins. Note: Refer to Figure 26-4 for load conditions. 90 91 92 100 101 103 106 107 109 109 110 102 SCL SDA In SDA Out PIC18F2420/2520/4420/4520 DS39631B-page 356 Preliminary © 2007 Microchip Technology Inc. TABLE 26-21: MASTER SSP I2C BUS DATA REQUIREMENTS Param. No. Symbol Characteristic Min Max Units Conditions 100 THIGH Clock High Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 101 TLOW Clock Low Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 102 TR SDA and SCL Rise Time 100 kHz mode — 1000 ns CB is specified to be from 400 kHz mode 20 + 0.1 CB 300 ns 10 to 400 pF 1 MHz mode(1) — 300 ns 103 TF SDA and SCL Fall Time 100 kHz mode — 300 ns CB is specified to be from 400 kHz mode 20 + 0.1 CB 300 ns 10 to 400 pF 1 MHz mode(1) — 100 ns 90 TSU:STA Start Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms Only relevant for Repeated Start condition 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 91 THD:STA Start Condition Hold Time 100 kHz mode 2(TOSC)(BRG + 1) — ms After this period, the first 400 kHz mode 2(TOSC)(BRG + 1) — ms clock pulse is generated 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 106 THD:DAT Data Input Hold Time 100 kHz mode 0 — ns 400 kHz mode 0 0.9 ms 107 TSU:DAT Data Input Setup Time 100 kHz mode 250 — ns (Note 2) 400 kHz mode 100 — ns 92 TSU:STO Stop Condition Setup Time 100 kHz mode 2(TOSC)(BRG + 1) — ms 400 kHz mode 2(TOSC)(BRG + 1) — ms 1 MHz mode(1) 2(TOSC)(BRG + 1) — ms 109 TAA Output Valid from Clock 100 kHz mode — 3500 ns 400 kHz mode — 1000 ns 1 MHz mode(1) — — ns 110 TBUF Bus Free Time 100 kHz mode 4.7 — ms Time the bus must be free before a new transmission can start 400 kHz mode 1.3 — ms D102 CB Bus Capacitive Loading — 400 pF Note 1: Maximum pin capacitance = 10 pF for all I2C pins. 2: A fast mode I2C bus device can be used in a standard mode I2C bus system, but parameter 107 ≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line, parameter 102 + parameter 107 = 1000 + 250 = 1250 ns (for 100 kHz mode), before the SCL line is released. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 357 PIC18F2420/2520/4420/4520 FIGURE 26-20: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING TABLE 26-22: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS FIGURE 26-21: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING TABLE 26-23: USART SYNCHRONOUS RECEIVE REQUIREMENTS 121 121 120 122 RC6/TX/CK RC7/RX/DT pin pin Note: Refer to Figure 26-4 for load conditions. Param No. Symbol Characteristic Min Max Units Conditions 120 TckH2dtV SYNC XMIT (MASTER & SLAVE) Clock High to Data Out Valid PIC18FXXXX — 40 ns PIC18LFXXXX — 100 ns VDD = 2.0V 121 Tckrf Clock Out Rise Time and Fall Time (Master mode) PIC18FXXXX — 20 ns PIC18LFXXXX — 50 ns VDD = 2.0V 122 Tdtrf Data Out Rise Time and Fall Time PIC18FXXXX — 20 ns PIC18LFXXXX — 50 ns VDD = 2.0V 125 126 RC6/TX/CK RC7/RX/DT pin pin Note: Refer to Figure 26-4 for load conditions. Param. No. Symbol Characteristic Min Max Units Conditions 125 TdtV2ckl SYNC RCV (MASTER & SLAVE) Data Hold before CK ↓ (DT hold time) 10 — ns 126 TckL2dtl Data Hold after CK ↓ (DT hold time) 15 — ns PIC18F2420/2520/4420/4520 DS39631B-page 358 Preliminary © 2007 Microchip Technology Inc. TABLE 26-24: A/D CONVERTER CHARACTERISTICS: PIC18FX42X/X52X (INDUSTRIAL) PIC18LF2X1X/4X1X (INDUSTRIAL) Param No. Symbol Characteristic Min Typ Max Units Conditions A01 NR Resolution — — 10 bit ΔVREF ≥ 3.0V A03 EIL Integral Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V A04 EDL Differential Linearity Error — — <±1 LSb ΔVREF ≥ 3.0V A06 EOFF Offset Error — — <±1 LSb ΔVREF ≥ 3.0V A07 EGN Gain Error — — <±1 LSb ΔVREF ≥ 3.0V A10 — Monotonicity Guaranteed(1) — VSS ≤ VAIN ≤ VREF A20 ΔVREF Reference Voltage Range (VREFH – VREFL) 1.8 3 — — — — V V VDD < 3.0V VDD ≥ 3.0V A21 VREFH Reference Voltage High VSS — VREFH V A22 VREFL Reference Voltage Low VSS – 0.3V — VDD – 3.0V V A25 VAIN Analog Input Voltage VREFL — VREFH V A30 ZAIN Recommended Impedance of Analog Voltage Source — — 2.5 kΩ A50 IREF VREF Input Current(2) — — — — 5 150 μA μA During VAIN acquisition. During A/D conversion cycle. Note 1: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 2: VREFH current is from RA3/AN3/VREF+ pin or VDD, whichever is selected as the VREFH source. VREFL current is from RA2/AN2/VREF-/CVREF pin or VSS, whichever is selected as the VREFL source. © 2007 Microchip Technology Inc. Preliminary DS39631B-page 359 PIC18F2420/2520/4420/4520 FIGURE 26-22: A/D CONVERSION TIMING TABLE 26-25: A/D CONVERSION REQUIREMENTS 131 130 132 BSF ADCON0, GO Q4 A/D CLK A/D DATA ADRES ADIF GO SAMPLE OLD_DATA SAMPLING STOPPED DONE NEW_DATA (Note 2) 9 8 7 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 2: This is a minimal RC delay (typically 100 ns), which also disconnects the holding capacitor from the analog input. . . . . . . TCY Param No. Symbol Characteristic Min Max Units Conditions 130 TAD A/D Clock Period PIC18FXXXX 0.7 25.0(1) μs TOSC based, VREF ≥ 3.0V PIC18LFXXXX 1.4 25.0(1) μs VDD = 2.0V; TOSC based, VREF full range PIC18FXXXX TBD 1 μs A/D RC mode PIC18LFXXXX TBD 3 μs VDD = 2.0V; A/D RC mode 131 TCNV Conversion Time (not including acquisition time) (Note 2) 11 12 TAD 132 TACQ Acquisition Time (Note 3) 1.4 TBD — — μs μs -40°C to +85°C 0°C ≤ to ≤ +85°C 135 TSWC Switching Time from Convert → Sample — (Note 4) TBD TDIS Discharge Time 0.2 — μs Legend: TBD = To Be Determined Note 1: The time of the A/D clock period is dependent on the device frequency and the TAD clock divider. 2: ADRES register may be read on the following TCY cycle. 3: The time for the holding capacitor to acquire the “New” input voltage when the voltage changes full scale after the conversion (VDD to VSS or VSS to VDD). The source impedance (RS) on the input channels is 50Ω. 4: On the following cycle of the device clock. PIC18F2420/2520/4420/4520 DS39631B-page 360 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 361 PIC18F2420/2520/4420/4520 27.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES Graphs and tables are not available at this time. PIC18F2420/2520/4420/4520 DS39631B-page 362 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 363 PIC18F2420/2520/4420/4520 28.0 PACKAGING INFORMATION 28.1 Package Marking Information 28-Lead PDIP XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F2520-I/SP 0710017 28-Lead SOIC XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F2520-E/SO 0710017 40-Lead PDIP XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXXX YYWWNNN Example PIC18F4420-I/P 0710017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 e3 e3 e3 PIC18F2420/2520/4420/4520 DS39631B-page 364 Preliminary © 2007 Microchip Technology Inc. Package Marking Information (Continued) 44-Lead TQFP XXXXXXXXXX XXXXXXXXXX XXXXXXXXXX YYWWNNN Example PIC18F4420 -I/PT 0710017 XXXXXXXXXX 44-Lead QFN XXXXXXXXXX XXXXXXXXXX YYWWNNN PIC18F4520 Example -I/ML 0710017 28-Lead QFN XXXXXXXX XXXXXXXX YYWWNNN Example 18F2420 -I/ML 0710017 e3 e3 e3 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 365 PIC18F2420/2520/4420/4520 28.2 Package Details The following sections give the technical details of the packages. 28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 28 Pitch e .100 BSC Top to Seating Plane A – – .200 Molded Package Thickness A2 .120 .135 .150 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .290 .310 .335 Molded Package Width E1 .240 .285 .295 Overall Length D 1.345 1.365 1.400 Tip to Seating Plane L .110 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .050 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB – – .430 NOTE 1 N 1 2 D E1 eB c E L A2 b e A1 b1 A 3 Microchip Technology Drawing C04-070B PIC18F2420/2520/4420/4520 DS39631B-page 366 Preliminary © 2007 Microchip Technology Inc. 28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLMETERS Dimension Limits MIN NOM MAX Number of Pins N 28 Pitch e 1.27 BSC Overall Height A – – 2.65 Molded Package Thickness A2 2.05 – – Standoff § A1 0.10 – 0.30 Overall Width E 10.30 BSC Molded Package Width E1 7.50 BSC Overall Length D 17.90 BSC Chamfer (optional) h 0.25 – 0.75 Foot Length L 0.40 – 1.27 Footprint L1 1.40 REF Foot Angle Top φ 0° – 8° Lead Thickness c 0.18 – 0.33 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° c h h L L1 A2 A1 A NOTE 1 1 2 3 b e E E1 D φ β α N Microchip Technology Drawing C04-052B © 2007 Microchip Technology Inc. Preliminary DS39631B-page 367 PIC18F2420/2520/4420/4520 40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 40 Pitch e .100 BSC Top to Seating Plane A – – .250 Molded Package Thickness A2 .125 – .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .590 – .625 Molded Package Width E1 .485 – .580 Overall Length D 1.980 – 2.095 Tip to Seating Plane L .115 – .200 Lead Thickness c .008 – .015 Upper Lead Width b1 .030 – .070 Lower Lead Width b .014 – .023 Overall Row Spacing § eB – – .700 N NOTE 1 E1 D 1 2 3 A A1 b1 b e c eB E L A2 Microchip Technology Drawing C04-016B PIC18F2420/2520/4420/4520 DS39631B-page 368 Preliminary © 2007 Microchip Technology Inc. 28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Contact Length Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 28 Pitch e 0.65 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E 6.00 BSC Exposed Pad Width E2 3.65 3.70 4.20 Overall Length D 6.00 BSC Exposed Pad Length D2 3.65 3.70 4.20 Contact Width b 0.23 0.30 0.35 Contact Length L 0.50 0.55 0.70 Contact-to-Exposed Pad K 0.20 – – D EXPOSED D2 e b K E2 E L N NOTE 1 1 2 2 1 N A A3 A1 TOP VIEW BOTTOM VIEW PAD Microchip Technology Drawing C04-105B © 2007 Microchip Technology Inc. Preliminary DS39631B-page 369 PIC18F2420/2520/4420/4520 44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 44 Pitch e 0.65 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Width E 8.00 BSC Exposed Pad Width E2 6.30 6.45 6.80 Overall Length D 8.00 BSC Exposed Pad Length D2 6.30 6.45 6.80 Contact Width b 0.25 0.30 0.38 Contact Length L 0.30 0.40 0.50 Contact-to-Exposed Pad K 0.20 – – D EXPOSED PAD D2 e b K L E2 2 1 N NOTE 1 2 1 E N TOP VIEW BOTTOM VIEW A3 A1 A Microchip Technology Drawing C04-103B PIC18F2420/2520/4420/4520 DS39631B-page 370 Preliminary © 2007 Microchip Technology Inc. 44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Chamfers at corners are optional; size may vary. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Leads N 44 Lead Pitch e 0.80 BSC Overall Height A – – 1.20 Molded Package Thickness A2 0.95 1.00 1.05 Standoff A1 0.05 – 0.15 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ 0° 3.5° 7° Overall Width E 12.00 BSC Overall Length D 12.00 BSC Molded Package Width E1 10.00 BSC Molded Package Length D1 10.00 BSC Lead Thickness c 0.09 – 0.20 Lead Width b 0.30 0.37 0.45 Mold Draft Angle Top α 11° 12° 13° Mold Draft Angle Bottom β 11° 12° 13° A E E1 D D1 e b NOTE 1 NOTE 2 N 1 2 3 c A1 L A2 L1 α φ β Microchip Technology Drawing C04-076B © 2007 Microchip Technology Inc. Preliminary DS39631B-page 371 PIC18F2420/2520/4420/4520 APPENDIX A: REVISION HISTORY Revision A (June 2004) Original data sheet for PIC18F2420/2520/4420/4520 devices. Revision B (January 2007) This revision includes updates to the packaging diagrams. APPENDIX B: DEVICE DIFFERENCES The differences between the devices listed in this data sheet are shown in Table B-1. TABLE B-1: DEVICE DIFFERENCES Features PIC18F2420 PIC18F2520 PIC18F4420 PIC18F4520 Program Memory (Bytes) 16384 32768 16384 32768 Program Memory (Instructions) 8192 16384 8192 16384 Interrupt Sources 19 19 20 20 I/O Ports Ports A, B, C, (E) Ports A, B, C, (E) Ports A, B, C, D, E Ports A, B, C, D, E Capture/Compare/PWM Modules 2 2 1 1 Enhanced Capture/Compare/PWM Modules 0 0 1 1 Parallel Communications (PSP) No No Yes Yes 10-bit Analog-to-Digital Module 10 input channels 10 input channels 13 input channels 13 input channels Packages 28-pin PDIP 28-pin SOIC 28-pin QFN 28-pin PDIP 28-pin SOIC 28-pin QFN 40-pin PDIP 44-pin TQFP 44-pin QFN 40-pin PDIP 44-pin TQFP 44-pin QFN PIC18F2420/2520/4420/4520 DS39631B-page 372 Preliminary © 2007 Microchip Technology Inc. APPENDIX C: CONVERSION CONSIDERATIONS This appendix discusses the considerations for converting from previous versions of a device to the ones listed in this data sheet. Typically, these changes are due to the differences in the process technology used. An example of this type of conversion is from a PIC16C74A to a PIC16C74B. Not Applicable APPENDIX D: MIGRATION FROM BASELINE TO ENHANCED DEVICES This section discusses how to migrate from a Baseline device (i.e., PIC16C5X) to an Enhanced MCU device (i.e., PIC18FXXX). The following are the list of modifications over the PIC16C5X microcontroller family: Not Currently Available © 2007 Microchip Technology Inc. Preliminary DS39631B-page 373 PIC18F2420/2520/4420/4520 APPENDIX E: MIGRATION FROM MID-RANGE TO ENHANCED DEVICES A detailed discussion of the differences between the mid-range MCU devices (i.e., PIC16CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN716, “Migrating Designs from PIC16C74A/74B to PIC18C442”. The changes discussed, while device specific, are generally applicable to all mid-range to enhanced device migrations. This Application Note is available as Literature Number DS00716. APPENDIX F: MIGRATION FROM HIGH-END TO ENHANCED DEVICES A detailed discussion of the migration pathway and differences between the high-end MCU devices (i.e., PIC17CXXX) and the enhanced devices (i.e., PIC18FXXX) is provided in AN726, “PIC17CXXX to PIC18CXXX Migration”. This Application Note is available as Literature Number DS00726. PIC18F2420/2520/4420/4520 DS39631B-page 374 Preliminary © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. Preliminary DS39631B-page 375 PIC18F2420/2520/4420/4520 INDEX A A/D ................................................................................... 223 A/D Converter Interrupt, Configuring ....................... 227 Acquisition Requirements ........................................ 228 ADCON0 Register .................................................... 223 ADCON1 Register .................................................... 223 ADCON2 Register .................................................... 223 ADRESH Register ............................................ 223, 226 ADRESL Register .................................................... 223 Analog Port Pins, Configuring .................................. 230 Associated Registers ............................................... 232 Calculating the Minimum Required Acquisition Time .............................................. 228 Configuring the Module ............................................ 227 Conversion Clock (TAD) ........................................... 229 Conversion Status (GO/DONE Bit) .......................... 226 Conversions ............................................................. 231 Converter Characteristics ........................................ 358 Discharge ................................................................. 231 Operation in Power Managed Modes ...................... 230 Selecting and Configuring Acquisition Time ............ 229 Special Event Trigger (CCP) .................................... 232 Special Event Trigger (ECCP) ................................. 148 Use of the CCP2 Trigger .......................................... 232 Absolute Maximum Ratings ............................................. 323 AC (Timing) Characteristics ............................................. 340 Load Conditions for Device Timing Specifications ....................................... 341 Parameter Symbology ............................................. 340 Temperature and Voltage Specifications ................. 341 Timing Conditions .................................................... 341 AC Characteristics Internal RC Accuracy ............................................... 343 Access Bank Mapping with Indexed Literal Offset Mode ................. 72 ACKSTAT ........................................................................ 191 ACKSTAT Status Flag ..................................................... 191 ADCON0 Register ............................................................ 223 GO/DONE Bit ........................................................... 226 ADCON1 Register ............................................................ 223 ADCON2 Register ............................................................ 223 ADDFSR .......................................................................... 310 ADDLW ............................................................................ 273 ADDULNK ........................................................................ 310 ADDWF ............................................................................ 273 ADDWFC ......................................................................... 274 ADRESH Register ............................................................ 223 ADRESL Register .................................................... 223, 226 Analog-to-Digital Converter. See A/D. ANDLW ............................................................................ 274 ANDWF ............................................................................ 275 Assembler MPASM Assembler .................................................. 317 Auto-Wake-up on Sync Break Character ......................... 214 B Bank Select Register (BSR) ............................................... 59 Baud Rate Generator ....................................................... 187 BC .................................................................................... 275 BCF .................................................................................. 276 BF .................................................................................... 191 BF Status Flag ................................................................. 191 Block Diagrams A/D ........................................................................... 226 Analog Input Model .................................................. 227 Baud Rate Generator .............................................. 187 Capture Mode Operation ......................................... 141 Comparator Analog Input Model .............................. 237 Comparator I/O Operating Modes ........................... 234 Comparator Output .................................................. 236 Comparator Voltage Reference ............................... 240 Compare Mode Operation ....................................... 142 Device Clock .............................................................. 28 Enhanced PWM ....................................................... 149 EUSART Receive .................................................... 213 EUSART Transmit ................................................... 211 External Power-on Reset Circuit (Slow VDD Power-up) ........................................ 43 Fail-Safe Clock Monitor (FSCM) .............................. 261 Generic I/O Port ....................................................... 105 High/Low-Voltage Detect with External Input .......... 244 Interrupt Logic ............................................................ 92 MSSP (I2C Master Mode) ........................................ 185 MSSP (I2C Mode) .................................................... 170 MSSP (SPI Mode) ................................................... 161 On-Chip Reset Circuit ................................................ 41 PIC18F2420/2520 ..................................................... 10 PIC18F4420/4520 ..................................................... 11 PLL (HS Mode) .......................................................... 25 PORTD and PORTE (Parallel Slave Port) ............... 120 PWM Operation (Simplified) .................................... 144 Reads from Flash Program Memory ......................... 77 Single Comparator ................................................... 235 Table Read Operation ............................................... 73 Table Write Operation ............................................... 74 Table Writes to Flash Program Memory .................... 79 Timer0 in 16-Bit Mode ............................................. 124 Timer0 in 8-Bit Mode ............................................... 124 Timer1 ..................................................................... 128 Timer1 (16-Bit Read/Write Mode) ............................ 128 Timer2 ..................................................................... 134 Timer3 ..................................................................... 136 Timer3 (16-Bit Read/Write Mode) ............................ 136 Voltage Reference Output Buffer Example ............. 241 Watchdog Timer ...................................................... 258 BN .................................................................................... 276 BNC ................................................................................. 277 BNN ................................................................................. 277 BNOV .............................................................................. 278 BNZ ................................................................................. 278 BOR. See Brown-out Reset. BOV ................................................................................. 281 BRA ................................................................................. 279 Break Character (12-Bit) Transmit and Receive .............. 216 BRG. See Baud Rate Generator. Brown-out Reset (BOR) ..................................................... 44 Detecting ................................................................... 44 Disabling in Sleep Mode ............................................ 44 Software Enabled ...................................................... 44 BSF .................................................................................. 279 BTFSC ............................................................................. 280 BTFSS ............................................................................. 280 BTG ................................................................................. 281 BZ .................................................................................... 282 PIC18F2420/2520/4420/4520 DS39631B-page 376 Preliminary © 2007 Microchip Technology Inc. C C Compilers MPLAB C17 ............................................................. 318 MPLAB C18 ............................................................. 318 MPLAB C30 ............................................................. 318 CALL ................................................................................ 282 CALLW ............................................................................. 311 Capture (CCP Module) ..................................................... 141 Associated Registers ...............................................143 CCP Pin Configuration ............................................. 141 CCPRxH:CCPRxL Registers ................................... 141 Prescaler .................................................................. 141 Software Interrupt .................................................... 141 Timer1/Timer3 Mode Selection ................................ 141 Capture (ECCP Module) .................................................. 148 Capture/Compare/PWM (CCP) ........................................ 139 Capture Mode. See Capture. CCP Mode and Timer Resources ............................140 CCPRxH Register .................................................... 140 CCPRxL Register ..................................................... 140 Compare Mode. See Compare. Interaction of Two CCP Modules ............................. 140 Module Configuration ...............................................140 Clock Sources .................................................................... 28 Selecting the 31 kHz Source ...................................... 29 Selection Using OSCCON Register ........................... 29 CLRF ................................................................................ 283 CLRWDT .......................................................................... 283 Code Examples 16 x 16 Signed Multiply Routine ................................90 16 x 16 Unsigned Multiply Routine ............................90 8 x 8 Signed Multiply Routine .................................... 89 8 x 8 Unsigned Multiply Routine ................................89 Changing Between Capture Prescalers ................... 141 Computed GOTO Using an Offset Value ................... 56 Data EEPROM Read .................................................85 Data EEPROM Refresh Routine ................................86 Data EEPROM Write .................................................85 Erasing a Flash Program Memory Row ..................... 78 Fast Register Stack .................................................... 56 How to Clear RAM (Bank 1) Using Indirect Addressing ............................................ 68 Implementing a Real-Time Clock Using a Timer1 Interrupt Service ............................... 131 Initializing PORTA .................................................... 105 Initializing PORTB .................................................... 108 Initializing PORTC .................................................... 111 Initializing PORTD .................................................... 114 Initializing PORTE .................................................... 117 Loading the SSPBUF (SSPSR) Register ................. 164 Reading a Flash Program Memory Word .................. 77 Saving Status, WREG and BSR Registers in RAM ..................................... 103 Writing to Flash Program Memory ....................... 80–81 Code Protection ............................................................... 249 COMF ............................................................................... 284 Comparator ......................................................................233 Analog Input Connection Considerations ................. 237 Associated Registers ...............................................237 Configuration ............................................................ 234 Effects of a Reset ..................................................... 236 Interrupts .................................................................. 236 Operation ................................................................. 235 Operation During Sleep ........................................... 236 Outputs ....................................................................235 Reference ................................................................ 235 External Signal ................................................ 235 Internal Signal .................................................. 235 Response Time ........................................................ 235 Comparator Specifications ............................................... 338 Comparator Voltage Reference ....................................... 239 Accuracy and Error .................................................. 240 Associated Registers ............................................... 241 Configuring .............................................................. 239 Connection Considerations ...................................... 240 Effects of a Reset .................................................... 240 Operation During Sleep ........................................... 240 Compare (CCP Module) .................................................. 142 Associated Registers ............................................... 143 CCPRx Register ...................................................... 142 Pin Configuration ..................................................... 142 Software Interrupt .................................................... 142 Special Event Trigger .............................. 137, 142, 232 Timer1/Timer3 Mode Selection ................................ 142 Compare (ECCP Module) ................................................ 148 Special Event Trigger .............................................. 148 Computed GOTO ............................................................... 56 Configuration Bits ............................................................ 249 Configuration Register Protection .................................... 266 Context Saving During Interrupts ..................................... 103 Conversion Considerations .............................................. 372 CPFSEQ .......................................................................... 284 CPFSGT .......................................................................... 285 CPFSLT ........................................................................... 285 Crystal Oscillator/Ceramic Resonator ................................ 23 D Data Addressing Modes .................................................... 68 Comparing Addressing Modes with the Extended Instruction Set Enabled ..................... 71 Direct ......................................................................... 68 Indexed Literal Offset ................................................ 70 Instructions Affected .......................................... 70 Indirect ....................................................................... 68 Inherent and Literal .................................................... 68 Data EEPROM Code Protection ....................................................... 266 Data EEPROM Memory ..................................................... 83 Associated Registers ................................................. 87 EEADR Register ........................................................ 83 EECON1 and EECON2 Registers ............................. 83 Operation During Code-Protect ................................. 86 Protection Against Spurious Write ............................. 86 Reading ..................................................................... 85 Using ......................................................................... 86 Write Verify ................................................................ 85 Writing ....................................................................... 85 Data Memory ..................................................................... 59 Access Bank .............................................................. 62 and the Extended Instruction Set .............................. 70 Bank Select Register (BSR) ...................................... 59 General Purpose Registers ....................................... 62 Map for PIC18F2420/4420 ........................................ 60 Map for PIC18F2520/4520 ........................................ 61 Special Function Registers ........................................ 63 DAW ................................................................................ 286 DC and AC Characteristics Graphs and Tables .................................................. 361 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 377 PIC18F2420/2520/4420/4520 DC Characteristics ........................................................... 335 Power-Down and Supply Current ............................ 326 Supply Voltage ......................................................... 325 DCFSNZ .......................................................................... 287 DECF ............................................................................... 286 DECFSZ ........................................................................... 287 Demonstration Boards PICDEM 1 ................................................................ 320 PICDEM 17 .............................................................. 321 PICDEM 18R ........................................................... 321 PICDEM 2 Plus ........................................................ 320 PICDEM 3 ................................................................ 320 PICDEM 4 ................................................................ 320 PICDEM LIN ............................................................ 321 PICDEM USB ........................................................... 321 PICDEM.net Internet/Ethernet ................................. 320 Development Support ...................................................... 317 Device Differences ........................................................... 371 Device Overview .................................................................. 7 Details on Individual Family Members ......................... 8 Features (table) ............................................................ 9 New Core Features ...................................................... 7 Other Special Features ................................................ 8 Device Reset Timers .......................................................... 45 Oscillator Start-up Timer (OST) ................................. 45 PLL Lock Time-out ..................................................... 45 Power-up Timer (PWRT) ........................................... 45 Time-out Sequence .................................................... 45 Direct Addressing ............................................................... 69 E Effect on Standard PIC Instructions ................................. 314 Effects of Power Managed Modes on Various Clock Sources ............................................... 31 Electrical Characteristics .................................................. 323 Enhanced Capture/Compare/PWM (ECCP) .................... 147 Associated Registers ............................................... 160 Capture and Compare Modes .................................. 148 Capture Mode. See Capture (ECCP Module). Outputs and Configuration ....................................... 148 Pin Configurations for ECCP1 ................................. 148 PWM Mode. See PWM (ECCP Module). Standard PWM Mode ............................................... 148 Timer Resources ...................................................... 148 Enhanced PWM Mode. See PWM (ECCP Module). Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART). See EUSART. Equations A/D Acquisition Time ................................................ 228 A/D Minimum Charging Time ................................... 228 Errata ................................................................................... 6 EUSART Asynchronous Mode ................................................ 211 12-Bit Break Transmit and Receive ................. 216 Associated Registers, Receive ........................ 214 Associated Registers, Transmit ....................... 212 Auto-Wake-up on Sync Break ......................... 214 Receiver ........................................................... 213 Setting up 9-Bit Mode with Address Detect ........................................ 213 Transmitter ....................................................... 211 Baud Rate Generator Operation in Power Managed Mode ................ 205 Baud Rate Generator (BRG) ................................... 205 Associated Registers ....................................... 206 Auto-Baud Rate Detect .................................... 209 Baud Rate Error, Calculating ........................... 206 Baud Rates, Asynchronous Modes ................. 207 High Baud Rate Select (BRGH Bit) ................. 205 Sampling ......................................................... 205 Synchronous Master Mode ...................................... 217 Associated Registers, Receive ........................ 219 Associated Registers, Transmit ....................... 218 Reception ........................................................ 219 Transmission ................................................... 217 Synchronous Slave Mode ........................................ 220 Associated Registers, Receive ........................ 221 Associated Registers, Transmit ....................... 220 Reception ........................................................ 221 Transmission ................................................... 220 Evaluation and Programming Tools ................................. 321 Extended Instruction Set ADDFSR .................................................................. 310 ADDULNK ............................................................... 310 and Using MPLAB Tools ......................................... 316 CALLW .................................................................... 311 Considerations for Use ............................................ 314 MOVSF .................................................................... 311 MOVSS .................................................................... 312 PUSHL ..................................................................... 312 SUBFSR .................................................................. 313 SUBULNK ................................................................ 313 Syntax ...................................................................... 309 External Clock Input ........................................................... 24 F Fail-Safe Clock Monitor ........................................... 249, 261 Exiting Operation ..................................................... 261 Interrupts in Power Managed Modes ....................... 262 POR or Wake from Sleep ........................................ 262 WDT During Oscillator Failure ................................. 261 Fast Register Stack ........................................................... 56 Firmware Instructions ...................................................... 267 Flash Program Memory ..................................................... 73 Associated Registers ................................................. 81 Control Registers ....................................................... 74 EECON1 and EECON2 ..................................... 74 TABLAT (Table Latch) Register ........................ 76 TBLPTR (Table Pointer) Register ...................... 76 Erase Sequence ........................................................ 78 Erasing ...................................................................... 78 Operation During Code-Protect ................................. 81 Reading ..................................................................... 77 Table Pointer Boundaries Based on Operation ....................... 76 Table Pointer Boundaries .......................................... 76 Table Reads and Table Writes .................................. 73 Write Sequence ......................................................... 79 Writing To .................................................................. 79 Protection Against Spurious Writes ................... 81 Unexpected Termination ................................... 81 Write Verify ........................................................ 81 FSCM. See Fail-Safe Clock Monitor. G General Call Address Support ......................................... 184 GOTO .............................................................................. 288 PIC18F2420/2520/4420/4520 DS39631B-page 378 Preliminary © 2007 Microchip Technology Inc. H Hardware Multiplier ............................................................ 89 Introduction ................................................................ 89 Operation ................................................................... 89 Performance Comparison .......................................... 89 High/Low-Voltage Detect .................................................243 Applications .............................................................. 246 Associated Registers ...............................................247 Characteristics ......................................................... 339 Current Consumption ...............................................245 Effects of a Reset ..................................................... 247 Operation ................................................................. 244 During Sleep .................................................... 247 Setup ........................................................................245 Start-up Time ........................................................... 245 Typical Application ...................................................246 HLVD. See High/Low-Voltage Detect. I I/O Ports ........................................................................... 105 I2C Mode (MSSP) Acknowledge Sequence Timing ............................... 194 Baud Rate Generator ...............................................187 Bus Collision During a Repeated Start Condition .................. 198 During a Stop Condition ................................... 199 Clock Arbitration ....................................................... 188 Clock Stretching ....................................................... 180 10-Bit Slave Receive Mode (SEN = 1) ............. 180 10-Bit Slave Transmit Mode ............................. 180 7-Bit Slave Receive Mode (SEN = 1) ............... 180 7-Bit Slave Transmit Mode ............................... 180 Clock Synchronization and the CKP Bit (SEN = 1) .. 181 Effects of a Reset ..................................................... 195 General Call Address Support ................................. 184 I2C Clock Rate w/BRG ............................................. 187 Master Mode ............................................................ 185 Operation ......................................................... 186 Reception ......................................................... 191 Repeated Start Condition Timing ..................... 190 Start Condition Timing ..................................... 189 Transmission .................................................... 191 Multi-Master Communication, Bus Collision and Arbitration .................................................. 195 Multi-Master Mode ...................................................195 Operation ................................................................. 174 Read/Write Bit Information (R/W Bit) ............... 174, 175 Registers .................................................................. 170 Serial Clock (RC3/SCK/SCL) ................................... 175 Slave Mode .............................................................. 174 Addressing ....................................................... 174 Reception ......................................................... 175 Transmission .................................................... 175 Sleep Operation ....................................................... 195 Stop Condition Timing .............................................. 194 ID Locations ............................................................. 249, 266 INCF ................................................................................. 288 INCFSZ ............................................................................ 289 In-Circuit Debugger .......................................................... 266 In-Circuit Serial Programming (ICSP) ...................... 249, 266 Indexed Literal Offset Addressing and Standard PIC18 Instructions ............................. 314 Indexed Literal Offset Mode ............................................. 314 Indirect Addressing ............................................................ 69 INFSNZ ............................................................................ 289 Initialization Conditions for all Registers ...................... 49–52 Instruction Cycle ................................................................ 57 Clocking Scheme ....................................................... 57 Instruction Flow/Pipelining ................................................. 57 Instruction Set .................................................................. 267 ADDLW .................................................................... 273 ADDWF .................................................................... 273 ADDWF (Indexed Literal Offset Mode) .................... 315 ADDWFC ................................................................. 274 ANDLW .................................................................... 274 ANDWF .................................................................... 275 BC ............................................................................ 275 BCF ......................................................................... 276 BN ............................................................................ 276 BNC ......................................................................... 277 BNN ......................................................................... 277 BNOV ...................................................................... 278 BNZ ......................................................................... 278 BOV ......................................................................... 281 BRA ......................................................................... 279 BSF .......................................................................... 279 BSF (Indexed Literal Offset Mode) .......................... 315 BTFSC ..................................................................... 280 BTFSS ..................................................................... 280 BTG ......................................................................... 281 BZ ............................................................................ 282 CALL ........................................................................ 282 CLRF ....................................................................... 283 CLRWDT ................................................................. 283 COMF ...................................................................... 284 CPFSEQ .................................................................. 284 CPFSGT .................................................................. 285 CPFSLT ................................................................... 285 DAW ........................................................................ 286 DCFSNZ .................................................................. 287 DECF ....................................................................... 286 DECFSZ .................................................................. 287 Extended Instruction Set ......................................... 309 General Format ........................................................ 269 GOTO ...................................................................... 288 INCF ........................................................................ 288 INCFSZ .................................................................... 289 INFSNZ .................................................................... 289 IORLW ..................................................................... 290 IORWF ..................................................................... 290 LFSR ....................................................................... 291 MOVF ...................................................................... 291 MOVFF .................................................................... 292 MOVLB .................................................................... 292 MOVLW ................................................................... 293 MOVWF ................................................................... 293 MULLW .................................................................... 294 MULWF .................................................................... 294 NEGF ....................................................................... 295 NOP ......................................................................... 295 Opcode Field Descriptions ....................................... 268 POP ......................................................................... 296 PUSH ....................................................................... 296 RCALL ..................................................................... 297 RESET ..................................................................... 297 RETFIE .................................................................... 298 RETLW .................................................................... 298 RETURN .................................................................. 299 RLCF ....................................................................... 299 RLNCF ..................................................................... 300 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 379 PIC18F2420/2520/4420/4520 RRCF ....................................................................... 300 RRNCF .................................................................... 301 SETF ........................................................................ 301 SETF (Indexed Literal Offset Mode) ........................ 315 SLEEP ..................................................................... 302 SUBFWB .................................................................. 302 SUBLW .................................................................... 303 SUBWF .................................................................... 303 SUBWFB .................................................................. 304 SWAPF .................................................................... 304 TBLRD ..................................................................... 305 TBLWT ..................................................................... 306 TSTFSZ ................................................................... 307 XORLW .................................................................... 307 XORWF .................................................................... 308 INTCON Registers ....................................................... 93–95 Inter-Integrated Circuit. See I2C. Internal Oscillator Block ..................................................... 26 Adjustment ................................................................. 26 INTIO Modes .............................................................. 26 INTOSC Frequency Drift ............................................ 26 INTOSC Output Frequency ........................................ 26 OSCTUNE Register ................................................... 26 PLL in INTOSC Modes .............................................. 26 Internal RC Oscillator Use with WDT .......................................................... 258 Interrupt Sources ............................................................. 249 A/D Conversion Complete ....................................... 227 Capture Complete (CCP) ......................................... 141 Compare Complete (CCP) ....................................... 142 Interrupt-on-Change (RB7:RB4) .............................. 108 INTn Pin ................................................................... 103 PORTB, Interrupt-on-Change .................................. 103 TMR0 ....................................................................... 103 TMR0 Overflow ........................................................ 125 TMR1 Overflow ........................................................ 127 TMR2 to PR2 Match (PWM) ............................ 144, 149 TMR3 Overflow ................................................ 135, 137 Interrupts ............................................................................ 91 Interrupts, Flag Bits Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit) ......................................................... 108 INTOSC, INTRC. See Internal Oscillator Block. IORLW ............................................................................. 290 IORWF ............................................................................. 290 IPR Registers ................................................................... 100 L LFSR ................................................................................ 291 Low-Voltage ICSP Programming. See Single-Supply ICSP Programming M Master Clear (MCLR) ......................................................... 43 Master Synchronous Serial Port (MSSP). See MSSP. Memory Organization ......................................................... 53 Data Memory ............................................................. 59 Program Memory ....................................................... 53 Memory Programming Requirements .............................. 337 Migration from Baseline to Enhanced Devices ................ 372 Migration from High-End to Enhanced Devices ............... 373 Migration from Mid-Range to Enhanced Devices ............ 373 MOVF ............................................................................... 291 MOVFF ............................................................................ 292 MOVLB ............................................................................ 292 MOVLW ........................................................................... 293 MOVSF ............................................................................ 311 MOVSS ............................................................................ 312 MOVWF ........................................................................... 293 MPLAB ASM30 Assembler, Linker, Librarian .................. 318 MPLAB ICD 2 In-Circuit Debugger .................................. 319 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator ................................... 319 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator ................................... 319 MPLAB Integrated Development Environment Software ............................................. 317 MPLAB PM3 Device Programmer ................................... 319 MPLINK Object Linker/MPLIB Object Librarian ............... 318 MSSP ACK Pulse ....................................................... 174, 175 Control Registers (general) ..................................... 161 I2C Mode. See I2C Mode. Module Overview ..................................................... 161 SPI Master/Slave Connection .................................. 165 SPI Mode. See SPI Mode. SSPBUF Register .................................................... 166 SSPSR Register ...................................................... 166 MULLW ............................................................................ 294 MULWF ............................................................................ 294 N NEGF ............................................................................... 295 NOP ................................................................................. 295 O Oscillator Configuration ..................................................... 23 EC .............................................................................. 23 ECIO .......................................................................... 23 HS .............................................................................. 23 HSPLL ....................................................................... 23 Internal Oscillator Block ............................................. 26 INTIO1 ....................................................................... 23 INTIO2 ....................................................................... 23 LP .............................................................................. 23 RC ............................................................................. 23 RCIO .......................................................................... 23 XT .............................................................................. 23 Oscillator Selection .......................................................... 249 Oscillator Start-up Timer (OST) ................................... 31, 45 Oscillator Switching ........................................................... 28 Oscillator Transitions ......................................................... 29 Oscillator, Timer1 ..................................................... 127, 137 Oscillator, Timer3 ............................................................. 135 P Packaging Information ..................................................... 363 Marking .................................................................... 363 Parallel Slave Port (PSP) ......................................... 114, 120 Associated Registers ............................................... 121 CS (Chip Select) ...................................................... 120 PORTD .................................................................... 120 RD (Read Input) ...................................................... 120 Select (PSPMODE Bit) .................................... 114, 120 WR (Write Input) ...................................................... 120 PICkit 1 Flash Starter Kit ................................................. 321 PICSTART Plus Development Programmer .................... 320 PIE Registers ..................................................................... 98 PIC18F2420/2520/4420/4520 DS39631B-page 380 Preliminary © 2007 Microchip Technology Inc. Pin Functions MCLR/VPP/RE3 .................................................... 12, 16 OSC1/CLKI/RA7 .................................................. 12, 16 OSC2/CLKO/RA6 ................................................ 12, 16 RA0/AN0 .............................................................. 13, 17 RA1/AN1 .............................................................. 13, 17 RA2/AN2/VREF-/CVREF ........................................ 13, 17 RA3/AN3/VREF+ ................................................... 13, 17 RA4/T0CKI/C1OUT .............................................. 13, 17 RA5/AN4/SS/HLVDIN/C2OUT ............................. 13, 17 RB0/INT0/FLT0/AN12 .......................................... 14, 18 RB1/INT1/AN10 ................................................... 14, 18 RB2/INT2/AN8 ..................................................... 14, 18 RB3/AN9/CCP2 ................................................... 14, 18 RB4/KBI0/AN11 ................................................... 14, 18 RB5/KBI1/PGM .................................................... 14, 18 RB6/KBI2/PGC .................................................... 14, 18 RB7/KBI3/PGD .................................................... 14, 18 RC0/T1OSO/T13CKI ........................................... 15, 19 RC1/T1OSI/CCP2 ................................................ 15, 19 RC2/CCP1 ................................................................. 15 RC2/CCP1/P1A ......................................................... 19 RC3/SCK/SCL ..................................................... 15, 19 RC4/SDI/SDA ...................................................... 15, 19 RC5/SDO ............................................................. 15, 19 RC6/TX/CK .......................................................... 15, 19 RC7/RX/DT .......................................................... 15, 19 RD0/PSP0 .................................................................. 20 RD1/PSP1 .................................................................. 20 RD2/PSP2 .................................................................. 20 RD3/PSP3 .................................................................. 20 RD4/PSP4 .................................................................. 20 RD5/PSP5/P1B .......................................................... 20 RD6/PSP6/P1C .......................................................... 20 RD7/PSP7/P1D .......................................................... 20 RE0/RD/AN5 .............................................................. 21 RE1/WR/AN6 ............................................................. 21 RE2/CS/AN7 .............................................................. 21 VDD ....................................................................... 15, 21 VSS ....................................................................... 15, 21 Pinout I/O Descriptions PIC18F2420/2520 ...................................................... 12 PIC18F4420/4520 ...................................................... 16 PIR Registers ..................................................................... 96 PLL Frequency Multiplier ...................................................25 HSPLL Oscillator Mode .............................................. 25 Use with INTOSC ....................................................... 25 POP .................................................................................. 296 POR. See Power-on Reset. PORTA Associated Registers ...............................................107 LATA Register .......................................................... 105 PORTA Register ...................................................... 105 TRISA Register ........................................................ 105 PORTB Associated Registers ...............................................110 LATB Register .......................................................... 108 PORTB Register ...................................................... 108 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit) ......................................................... 108 TRISB Register ........................................................ 108 PORTC Associated Registers ............................................... 113 LATC Register ......................................................... 111 PORTC Register ...................................................... 111 RC3/SCK/SCL Pin ................................................... 175 TRISC Register ........................................................ 111 PORTD Associated Registers ............................................... 116 LATD Register ......................................................... 114 Parallel Slave Port (PSP) Function .......................... 114 PORTD Register ...................................................... 114 TRISD Register ........................................................ 114 PORTE Associated Registers ............................................... 119 LATE Register ......................................................... 117 PORTE Register ...................................................... 117 PSP Mode Select (PSPMODE Bit) .......................... 114 TRISE Register ........................................................ 117 Power Managed Modes ..................................................... 33 and A/D Operation ................................................... 230 and EUSART Operation .......................................... 205 and Multiple Sleep Commands .................................. 34 and PWM Operation ................................................ 159 and SPI Operation ................................................... 169 Clock Transitions and Status Indicators .................... 34 Effects on Clock Sources ........................................... 31 Entering ..................................................................... 33 Exiting Idle and Sleep Modes .................................... 39 by Interrupt ........................................................ 39 by Reset ............................................................ 39 by WDT Time-out .............................................. 39 Without a Start-up Delay ................................... 40 Idle Modes ................................................................. 37 PRI_IDLE ........................................................... 38 RC_IDLE ........................................................... 39 SEC_IDLE ......................................................... 38 Run Modes ................................................................ 34 PRI_RUN ........................................................... 34 RC_RUN ............................................................ 35 SEC_RUN ......................................................... 34 Selecting .................................................................... 33 Sleep Mode ............................................................... 37 Summary (table) ........................................................ 33 Power-on Reset (POR) ...................................................... 43 Power-up Timer (PWRT) ........................................... 45 Time-out Sequence ................................................... 45 Power-up Delays ............................................................... 31 Power-up Timer (PWRT) ................................................... 31 Prescaler Timer2 ..................................................................... 150 Prescaler, Timer0 ............................................................ 125 Prescaler, Timer2 ............................................................ 145 PRI_IDLE Mode ................................................................. 38 PRI_RUN Mode ................................................................. 34 PRO MATE II Universal Device Programmer .................. 319 Program Counter ............................................................... 54 PCL, PCH and PCU Registers .................................. 54 PCLATH and PCLATU Registers .............................. 54 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 381 PIC18F2420/2520/4420/4520 Program Memory and Extended Instruction Set ..................................... 72 Code Protection ....................................................... 264 Instructions ................................................................. 58 Two-Word .......................................................... 58 Interrupt Vector .......................................................... 53 Look-up Tables .......................................................... 56 Map and Stack (diagram) ........................................... 53 Reset Vector .............................................................. 53 Program Verification and Code Protection ....................... 263 Associated Registers ............................................... 263 Programming, Device Instructions ................................... 267 PSP. See Parallel Slave Port. Pulse-Width Modulation. See PWM (CCP Module) and PWM (ECCP Module). PUSH ............................................................................... 296 PUSH and POP Instructions .............................................. 55 PUSHL ............................................................................. 312 PWM (CCP Module) Associated Registers ............................................... 146 Auto-Shutdown (CCP1 only) .................................... 145 CCPR1H:CCPR1L Registers ................................... 149 Duty Cycle ........................................................ 144, 150 Example Frequencies/Resolutions .................. 145, 150 Period ............................................................... 144, 149 Setup for PWM Operation ........................................ 145 TMR2 to PR2 Match ........................................ 144, 149 PWM (ECCP Module) ...................................................... 149 Direction Change in Full-Bridge Output Mode .................................................... 154 Effects of a Reset ..................................................... 159 Enhanced PWM Auto-Shutdown ............................. 156 Full-Bridge Application Example .............................. 154 Full-Bridge Mode ...................................................... 153 Half-Bridge Mode ..................................................... 152 Half-Bridge Output Mode Applications Example ...................................... 152 Operation in Power Managed Modes ...................... 159 Operation with Fail-Safe Clock Monitor ................... 159 Output Configurations .............................................. 150 Output Relationships (Active-High) .......................... 151 Output Relationships (Active-Low) ........................... 151 Programmable Dead-Band Delay ............................ 156 Setup for PWM Operation ........................................ 159 Start-up Considerations ........................................... 158 Q Q Clock .................................................................... 145, 150 R RAM. See Data Memory. RBIF Bit ............................................................................ 108 RC Oscillator ...................................................................... 25 RCIO Oscillator Mode ................................................ 25 RC_IDLE Mode .................................................................. 39 RC_RUN Mode .................................................................. 35 RCALL ............................................................................. 297 RCON Register Bit Status During Initialization .................................... 48 Register File ....................................................................... 62 Register File Summary ................................................ 64–66 Registers ADCON0 (A/D Control 0) ......................................... 223 ADCON1 (A/D Control 1) ......................................... 224 ADCON2 (A/D Control 2) ......................................... 225 BAUDCON (Baud Rate Control) .............................. 204 CCP1CON (Enhanced Capture/Compare/PWM Control 1) ................. 147 CCPxCON (Standard Capture/Compare/PWM Control) .................... 139 CMCON (Comparator Control) ................................ 233 CONFIG1H (Configuration 1 High) .......................... 250 CONFIG2H (Configuration 2 High) .......................... 252 CONFIG2L (Configuration 2 Low) ........................... 251 CONFIG3H (Configuration 3 High) .......................... 253 CONFIG4L (Configuration 4 Low) ........................... 253 CONFIG5H (Configuration 5 High) .......................... 254 CONFIG5L (Configuration 5 Low) ........................... 254 CONFIG6H (Configuration 6 High) .......................... 255 CONFIG6L (Configuration 6 Low) ........................... 255 CONFIG7H (Configuration 7 High) .......................... 256 CONFIG7L (Configuration 7 Low) ........................... 256 CVRCON (Comparator Voltage Reference Control) .......................................... 239 DEVID1 (Device ID 1) .............................................. 257 DEVID2 (Device ID 2) .............................................. 257 ECCP1AS (ECCP Auto-Shutdown Control) ............ 157 EECON1 (Data EEPROM Control 1) ................... 75, 84 HLVDCON (High/Low-Voltage Detect Control) ....... 243 INTCON (Interrupt Control) ....................................... 93 INTCON2 (Interrupt Control 2) .................................. 94 INTCON3 (Interrupt Control 3) .................................. 95 IPR1 (Peripheral Interrupt Priority 1) ....................... 100 IPR2 (Peripheral Interrupt Priority 2) ....................... 101 OSCCON (Oscillator Control) .................................... 30 OSCTUNE (Oscillator Tuning) ................................... 27 PIE1 (Peripheral Interrupt Enable 1) ......................... 98 PIE2 (Peripheral Interrupt Enable 2) ......................... 99 PIR1 (Peripheral Interrupt Request (Flag) 1) ............. 96 PIR2 (Peripheral Interrupt Request (Flag) 2) ............. 97 PWM1CON (PWM Configuration) ........................... 156 RCON (Reset Control) ....................................... 42, 102 RCSTA (Receive Status and Control) ..................... 203 SSPCON1 (MSSP Control 1, I2C Mode) ................. 172 SSPCON1 (MSSP Control 1, SPI Mode) ................ 163 SSPCON2 (MSSP Control 2, I2C Mode) ................. 173 SSPSTAT (MSSP Status, I2C Mode) ...................... 171 SSPSTAT (MSSP Status, SPI Mode) ...................... 162 Status ........................................................................ 67 STKPTR (Stack Pointer) ............................................ 55 T0CON (Timer0 Control) ......................................... 123 T1CON (Timer1 Control) ......................................... 127 T2CON (Timer2 Control) ......................................... 133 T3CON (Timer3 Control) ......................................... 135 TRISE (PORTE/PSP Control) ................................. 118 TXSTA (Transmit Status and Control) ..................... 202 WDTCON (Watchdog Timer Control) ...................... 259 RESET ............................................................................. 297 Reset State of Registers .................................................... 48 Resets ....................................................................... 41, 249 Brown-out Reset (BOR) ........................................... 249 Oscillator Start-up Timer (OST) ............................... 249 Power-on Reset (POR) ............................................ 249 Power-up Timer (PWRT) ......................................... 249 PIC18F2420/2520/4420/4520 DS39631B-page 382 Preliminary © 2007 Microchip Technology Inc. RETFIE ............................................................................ 298 RETLW ............................................................................. 298 RETURN .......................................................................... 299 Return Address Stack ........................................................ 54 Return Stack Pointer (STKPTR) ........................................ 55 Revision History ............................................................... 371 RLCF ................................................................................ 299 RLNCF ............................................................................. 300 RRCF ............................................................................... 300 RRNCF ............................................................................. 301 S SCK .................................................................................. 161 SDI ................................................................................... 161 SDO ................................................................................. 161 SEC_IDLE Mode ................................................................ 38 SEC_RUN Mode ................................................................ 34 Serial Clock, SCK ............................................................. 161 Serial Data In (SDI) .......................................................... 161 Serial Data Out (SDO) ..................................................... 161 Serial Peripheral Interface. See SPI Mode. SETF ................................................................................ 301 Single-Supply ICSP Programming. Slave Select (SS) ............................................................. 161 Slave Select Synchronization ........................................... 167 SLEEP .............................................................................. 302 Sleep OSC1 and OSC2 Pin States ...................................... 31 Sleep Mode ........................................................................37 Software Simulator (MPLAB SIM) .................................... 318 Software Simulator (MPLAB SIM30) ................................ 318 Special Event Trigger. See Compare (ECCP Mode). Special Event Trigger. See Compare (ECCP Module). Special Features of the CPU ............................................ 249 Special Function Registers ................................................ 63 Map ............................................................................ 63 SPI Mode (MSSP) Associated Registers ...............................................169 Bus Mode Compatibility ........................................... 169 Effects of a Reset ..................................................... 169 Enabling SPI I/O ...................................................... 165 Master Mode ............................................................ 166 Master/Slave Connection ......................................... 165 Operation ................................................................. 164 Operation in Power Managed Modes ...................... 169 Serial Clock .............................................................. 161 Serial Data In ........................................................... 161 Serial Data Out ........................................................ 161 Slave Mode .............................................................. 167 Slave Select ............................................................. 161 Slave Select Synchronization .................................. 167 SPI Clock ................................................................. 166 Typical Connection .................................................. 165 SS .................................................................................... 161 SSPOV ............................................................................. 191 SSPOV Status Flag .......................................................... 191 SSPSTAT Register R/W Bit ............................................................. 174, 175 Stack Full/Underflow Resets .............................................. 56 Standard Instructions ....................................................... 267 SUBFSR ........................................................................... 313 SUBFWB .......................................................................... 302 SUBLW ............................................................................ 303 SUBULNK ........................................................................ 313 SUBWF ............................................................................ 303 SUBWFB ......................................................................... 304 SWAPF ............................................................................ 304 T Table Pointer Operations (table) ........................................ 76 Table Reads/Table Writes ................................................. 56 TBLRD ............................................................................. 305 TBLWT ............................................................................. 306 Time-out in Various Situations (table) ................................ 45 Timer0 .............................................................................. 123 Associated Registers ............................................... 125 Operation ................................................................. 124 Overflow Interrupt .................................................... 125 Prescaler ................................................................. 125 Prescaler Assignment (PSA Bit) .............................. 125 Prescaler Select (T0PS2:T0PS0 Bits) ..................... 125 Prescaler. See Prescaler, Timer0. Reads and Writes in 16-Bit Mode ............................ 124 Source Edge Select (T0SE Bit) ............................... 124 Source Select (T0CS Bit) ......................................... 124 Switching Prescaler Assignment ............................. 125 Timer1 .............................................................................. 127 16-Bit Read/Write Mode .......................................... 129 Associated Registers ............................................... 131 Interrupt ................................................................... 130 Operation ................................................................. 128 Oscillator .......................................................... 127, 129 Oscillator Layout Considerations ............................. 130 Overflow Interrupt .................................................... 127 Resetting, Using the CCP Special Event Trigger ...................................... 130 Special Event Trigger (ECCP) ................................. 148 TMR1H Register ...................................................... 127 TMR1L Register ....................................................... 127 Use as a Real-Time Clock ....................................... 130 Timer2 .............................................................................. 133 Associated Registers ............................................... 134 Interrupt ................................................................... 134 Operation ................................................................. 133 Output ...................................................................... 134 PR2 Register ................................................... 144, 149 TMR2 to PR2 Match Interrupt .......................... 144, 149 Timer3 .............................................................................. 135 16-Bit Read/Write Mode .......................................... 137 Associated Registers ............................................... 137 Operation ................................................................. 136 Oscillator .......................................................... 135, 137 Overflow Interrupt ............................................ 135, 137 Special Event Trigger (CCP) ................................... 137 TMR3H Register ...................................................... 135 TMR3L Register ....................................................... 135 Timing Diagrams A/D Conversion ........................................................ 359 Acknowledge Sequence .......................................... 194 Asynchronous Reception ......................................... 214 Asynchronous Transmission .................................... 212 Asynchronous Transmission (Back to Back) ........... 212 Automatic Baud Rate Calculation ............................ 210 Auto-Wake-up Bit (WUE) During Normal Operation ............................................ 215 Auto-Wake-up Bit (WUE) During Sleep ................... 215 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 383 PIC18F2420/2520/4420/4520 Baud Rate Generator with Clock Arbitration ............ 188 BRG Overflow Sequence ......................................... 210 BRG Reset Due to SDA Arbitration During Start Condition ..................................... 197 Brown-out Reset (BOR) ........................................... 345 Bus Collision During a Repeated Start Condition (Case 1) .................................. 198 Bus Collision During a Repeated Start Condition (Case 2) .................................. 198 Bus Collision During a Start Condition (SCL = 0) ......................................................... 197 Bus Collision During a Stop Condition (Case 1) ........................................................... 199 Bus Collision During a Stop Condition (Case 2) ........................................................... 199 Bus Collision During Start Condition (SDA only) ....................................................... 196 Bus Collision for Transmit and Acknowledge ........... 195 Capture/Compare/PWM (CCP) ................................ 347 CLKO and I/O .......................................................... 344 Clock Synchronization ............................................. 181 Clock/Instruction Cycle .............................................. 57 Example SPI Master Mode (CKE = 0) ..................... 349 Example SPI Master Mode (CKE = 1) ..................... 350 Example SPI Slave Mode (CKE = 0) ....................... 351 Example SPI Slave Mode (CKE = 1) ....................... 352 External Clock (All Modes except PLL) .................... 342 Fail-Safe Clock Monitor (FSCM) .............................. 262 First Start Bit Timing ................................................ 189 Full-Bridge PWM Output .......................................... 153 Half-Bridge PWM Output ......................................... 152 High/Low-Voltage Detect Characteristics ................ 339 High/Low-Voltage Detect Operation (VDIRMAG = 0) ................................................ 245 High/Low-Voltage Detect Operation (VDIRMAG = 1) ................................................ 246 I2C Bus Data ............................................................ 353 I2C Bus Start/Stop Bits ............................................. 353 I2C Master Mode (7 or 10-Bit Transmission) ........... 192 I2C Master Mode (7-Bit Reception) .......................... 193 I2C Slave Mode (10-Bit Reception, SEN = 0) .......... 178 I2C Slave Mode (10-Bit Reception, SEN = 1) .......... 183 I2C Slave Mode (10-Bit Transmission) ..................... 179 I2C Slave Mode (7-bit Reception, SEN = 0) ............. 176 I2C Slave Mode (7-Bit Reception, SEN = 1) ............ 182 I2C Slave Mode (7-Bit Transmission) ....................... 177 I2C Slave Mode General Call Address Sequence (7 or 10-Bit Address Mode) ............ 184 I2C Stop Condition Receive or Transmit Mode ................................................. 194 Master SSP I2C Bus Data ........................................ 355 Master SSP I2C Bus Start/Stop Bits ........................ 355 Parallel Slave Port (PIC18F4420/4520) ................... 348 Parallel Slave Port (PSP) Read ............................... 121 Parallel Slave Port (PSP) Write ............................... 121 PWM Auto-Shutdown (PRSEN = 0, Auto-Restart Disabled) .................................... 158 PWM Auto-Shutdown (PRSEN = 1, Auto-Restart Enabled) ..................................... 158 PWM Direction Change ........................................... 155 PWM Direction Change at Near 100% Duty Cycle ............................................. 155 PWM Output ............................................................ 144 Repeat Start Condition ............................................ 190 Reset, Watchdog Timer (WDT), Oscillator Start-up Timer (OST), Power-up Timer (PWRT) ................................. 345 Send Break Character Sequence ............................ 216 Slave Synchronization ............................................. 167 Slow Rise Time (MCLR Tied to VDD, VDD Rise > TPWRT) ............................................ 47 SPI Mode (Master Mode) ........................................ 166 SPI Mode (Slave Mode, CKE = 0) ........................... 168 SPI Mode (Slave Mode, CKE = 1) ........................... 168 Synchronous Reception (Master Mode, SREN) ..................................... 219 Synchronous Transmission ..................................... 217 Synchronous Transmission (Through TXEN) .......... 218 Time-out Sequence on POR w/PLL Enabled (MCLR Tied to VDD) .......................................... 47 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 1) ...................... 46 Time-out Sequence on Power-up (MCLR Not Tied to VDD, Case 2) ...................... 46 Time-out Sequence on Power-up (MCLR Tied to VDD, VDD Rise < TPWRT) ........... 46 Timer0 and Timer1 External Clock .......................... 346 Transition for Entry to SEC_RUN Mode .................... 35 Transition for Entry to Sleep Mode ............................ 37 Transition for Two-Speed Start-up (INTOSC to HSPLL) ........................................ 260 Transition for Wake from Sleep (HSPLL) .................. 37 Transition from RC_RUN Mode to PRI_RUN Mode ................................................. 36 Transition from SEC_RUN Mode to PRI_RUN Mode (HSPLL) .................................. 35 Transition Timing for Entry to Idle Mode .................... 38 Transition Timing for Wake from Idle to Run Mode ............................................... 38 Transition to RC_RUN Mode ..................................... 36 USART Synchronous Receive (Master/Slave) ................................................. 357 USART Synchronous Transmission (Master/Slave) ................................................. 357 Timing Diagrams and Specifications ............................... 342 A/D Conversion Requirements ................................ 359 Capture/Compare/PWM Requirements ................... 347 CLKO and I/O Requirements ................................... 344 Example SPI Mode Requirements (Master Mode, CKE = 0) .................................. 349 Example SPI Mode Requirements (Master Mode, CKE = 1) .................................. 350 Example SPI Mode Requirements (Slave Mode, CKE = 0) .................................... 351 Example SPI Mode Requirements (Slave Mode, CKE = 1) .................................... 352 External Clock Requirements .................................. 342 I2C Bus Data Requirements (Slave Mode) .............. 354 I2C Bus Start/Stop Bits Requirements (Slave Mode) ................................................... 353 Master SSP I2C Bus Data Requirements ................ 356 Master SSP I2C Bus Start/Stop Bits Requirements .................................................. 355 Parallel Slave Port Requirements (PIC18F4420/4520) ......................................... 348 PIC18F2420/2520/4420/4520 DS39631B-page 384 Preliminary © 2007 Microchip Technology Inc. PLL Clock ................................................................. 343 Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements ...................................................345 Timer0 and Timer1 External Clock Requirements ......................................... 346 USART Synchronous Receive Requirements .........357 USART Synchronous Transmission Requirements ...................................................357 Top-of-Stack Access .......................................................... 54 TRISE Register PSPMODE Bit .......................................................... 114 TSTFSZ ............................................................................ 307 Two-Speed Start-up ................................................. 249, 260 Two-Word Instructions Example Cases .......................................................... 58 TXSTA Register BRGH Bit ................................................................. 205 V Voltage Reference Specifications .................................... 338 W Watchdog Timer (WDT) ........................................... 249, 258 Associated Registers ............................................... 259 Control Register ....................................................... 258 During Oscillator Failure .......................................... 261 Programming Considerations .................................. 258 WCOL ...................................................... 189, 190, 191, 194 WCOL Status Flag ................................... 189, 190, 191, 194 WWW, On-Line Support ...................................................... 6 X XORLW ............................................................................ 307 XORWF ........................................................................... 308 © 2007 Microchip Technology Inc. Preliminary DS39631B-page 385 PIC18F2420/2520/4420/4520 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com PIC18F2420/2520/4420/4520 DS39631B-page 386 Preliminary © 2007 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC18F2420/2520/4420/4520 DS39631B 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? © 2007 Microchip Technology Inc. Preliminary DS39631B-page 387 PIC18F2420/2520/4420/4520 PIC18F2420/2520/4420/4520 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Temperature Package Pattern Range Device Device PIC18F2420/2520(1), PIC18F4420/4520(1), PIC18F2420/2520T(2), PIC18F4420/4520T(2); VDD range 4.2V to 5.5V PIC18LF2420/2520(1), PIC18LF4420/4520(1), PIC18LF2420/2520T(2), PIC18LF4420/4520T(2); VDD range 2.0V to 5.5V Temperature Range I = -40°C to +85°C (Industrial) E = -40°C to +125°C (Extended) Package PT = TQFP (Thin Quad Flatpack) SO = SOIC SP = Skinny Plastic DIP P = PDIP ML = QFN Pattern QTP, SQTP, Code or Special Requirements (blank otherwise) Examples: a) PIC18LF4520-I/P 301 = Industrial temp., PDIP package, Extended VDD limits, QTP pattern #301. b) PIC18LF2420-I/SO = Industrial temp., SOIC package, Extended VDD limits. c) PIC18F4420-I/P = Industrial temp., PDIP package, normal VDD limits. Note 1: F = Standard Voltage Range LF = Wide Voltage Range 2: T = in tape and reel TQFP packages only. DS39631B-page 388 © 2007 Microchip Technology Inc. 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A high efficiency 1.5A, 0.2Ω switch is included on the die together with all the control circuitry required to complete a high frequency, current-mode switching regulator. Current-mode control provides fast transient response and excellent loop stability. New design techniques achieve high efficiency at high switching frequencies over a wide operating voltage range. A low dropout internal regulator maintains consistent performance over a wide range of inputs from 24V systems to Li-Ion batteries. An operating supply current of 1mA maintains high efficiency, especially at lower output currents. Shutdown reduces quiescent current to 6μA. Maximum switch current remains constant at all duty cycles. Synchronization allows an external logic level signal to increase the internal oscillator from 1.5MHz to 2MHz. The LT1961 is available in an exposed pad, 8-pin MSOP package. Full cycle-by-cycle switch current limit protection and thermal shutdown are provided. High frequency operation allows the reduction of input and output filtering components and permits the use of chip inductors. ■ DSL Modems ■ Portable Computers ■ Battery-Powered Systems ■ Distributed Power Efficiency vs Load Current 5V to 12V Boost Converter LT1961 VIN VOUT 12V 0.5A* VIN 5V 1961 TA01 6800pF 100pF 6.8k 10k 1% 90.9k UPS120 10μF CERAMIC 2.2μF CERAMIC VSW SHDN FB OPEN OR HIGH = ON SYNC GND VC *MAXIMUM OUTPUT CURRENT IS SUBJECT TO THERMAL DERATING. 6.8μH 2 6 8 3,4 7 5 1 LOAD CURRENT (mA) 0 EFFICIENCY (%) 90 85 80 75 70 65 60 100 200 300 400 1961 TA01a 500 VIN = 5V VOUT = 12V , LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. *Patent Pending 2 LT1961 1961fa ABSOLUTE MAXIMUM RATINGS W W W U Input Voltage .......................................................... 25V Switch Voltage ......................................................... 35V SHDN Pin ............................................................... 25V FB Pin Current ....................................................... 1mA SYNC Pin Current .................................................. 1mA Operating Junction Temperature Range (Note 2) LT1961E, LT1961I ........................... – 40°C to 125°C Storage Temperature Range ................ – 65°C to 150°C Lead Temperature (Soldering, 10 sec)................. 300°C (Note 1) TJMAX = 125°C, θJA = 50°C/W GROUND PAD CONNECTED TO LARGE COPPER AREA 1234 VIN SW GND GND 8765 SYNC VC FB SHDN TOP VIEW MS8E PACKAGE 8-LEAD PLASTIC MSOP PI CO FIGURATIOU U U PARAMETER CONDITION MIN TYP MAX UNITS Recommended Operating Voltage ● 3 25 V Maximum Switch Current Limit ● 1.5 2 3 A Oscillator Frequency 3.3V < VIN < 25V ● 1 1.5 MHz Switch On Voltage Drop ISW = 1.5A ● 310 500 mV VIN Undervoltage Lockout (Note 3) ● 2.47 2.6 2.73 V VIN Supply Current ISW = 0A ● 0.9 1.3 mA VIN Supply Current/ISW ISW = 1.5A 27 mA/A Shutdown Supply Current VSHDN = 0V, VIN = 25V, VSW = 25V 6 20 μA ● 45 μA Feedback Voltage 3V < VIN < 25V, 0.4V < VC < 0.9V 1.182 1.2 1.218 V ● 1.176 1.224 V ELECTRICAL CHARACTERISTICS The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 15V, VC = 0.8V, SHDN, SYNC and switch open unless otherwise noted. LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT1961EMS8E#PBF LT1961EMS8E#TRPBF LTQY 8-Lead Plastic MSOP –40°C to 125°C LT1961IMS8E#PBF LT1961IMS8E#TRPBF LTQY 8-Lead Plastic MSOP –40°C to 125°C LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT1961EMS8E LT1961EMS8E#TR LTQY 8-Lead Plastic MSOP –40°C to 125°C LT1961IMS8E LT1961IMS8E#TR LTQY 8-Lead Plastic MSOP –40°C to 125°C ORDER IUFORWATIOU Consult LTC Marketing for parts specified with wider operating temperature ranges. *Temperature grades are identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 3 LT1961 1961fa ELECTRICAL CHARACTERISTICS PARAMETER CONDITION MIN TYP MAX UNITS FB Input Current ● 0 –0.2 –0.4 μA FB to VC Voltage Gain 0.4V < VC < 0.9V 150 350 FB to VC Transconductance ΔIVC = ±10μA ● 500 850 1300 μMho VC Pin Source Current VFB = 1V ● – 85 –120 –165 μA VC Pin Sink Current VFB = 1.4V ● 70 110 165 μA VC Pin to Switch Current Transconductance 2.4 A/V VC Pin Minimum Switching Threshold Duty Cycle = 0% 0.3 V VC Pin 1.5A ISW Threshold 0.9 V Maximum Switch Duty Cycle VC = 1.2V, ISW = 100mA ● 80 90 % VC = 1.2V, ISW = 1A, 25°C ≤ TA ≤ 125°C 75 80 % VC = 1.2V, ISW = 1A, TA ≤ 25°C 70 75 % SHDN Threshold Voltage ● 1.28 1.35 1.42 V SHDN Input Current (Shutting Down) SHDN = 60mV Above Threshold ● –7 –10 –13 μA SHDN Threshold Current Hysteresis SHDN = 100mV Below Threshold 4 7 10 μA SYNC Threshold Voltage 1.5 2.2 V SYNC Input Frequency 1.5 2 MHz SYNC Pin Resistance ISYNC = 1mA 20 kΩ The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 15V, VC = 0.8V, SHDN, SYNC and switch open unless otherwise noted. Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT1961E is guaranteed to meet performance specifications from 0°C to 125°C junction temperature. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LT1961I is guaranteed over the – 40ºC to 125ºC operating junction temperature range. Note 3: Minimum input voltage is defined as the voltage where the internal regulator enters lockout. Actual minimum input voltage to maintain a regulated output will depend on output voltage and load current. See Applications Information. 4 LT1961 1961fa TYPICAL PERFORMANCE CHARACTERISTICS U W FB vs Temperature Switch On Voltage Drop Oscillator Frequency SHDN Threshold vs Temperature SHDN Supply Current vs VIN SHDN IP Current vs Temperature TEMPERATURE (°C) –50 –25 0 25 50 75 100 125 FB VOLTAGE (V) 1961 G01 1.22 1.21 1.20 1.19 1.18 SWITCH CURRENT (A) 0 0.5 1 1.5 SWITCH VOLTAGE (mV) 1961 G02 400 350 300 250 200 150 100 50 0 125°C 25°C –40°C TEMPERATURE (°C) –50 –25 0 25 50 75 100 125 FREQUENCY (MHz) 1961 G03 1.5 1.4 1.3 1.2 1.1 TA = 25°C TEMPERATURE (°C) –50 –25 0 25 50 75 100 125 SHDN THRESHOLD (V) 1961 G04 1.40 1.38 1.36 1.34 1.32 1.30 VIN (V) 0 5 10 15 20 25 30 VIN CURRENT (μA) 1961 G05 7 6 5 4 3 2 1 0 TA = 25°C SHDN = 0V TEMPERATURE (°C) –50 –25 0 25 50 75 100 125 SHDN INPUT (μA) 1961G06 –12 –10 –8 –6 –4 –2 0 STARTING UP SHUTTING DOWN SHDN Supply Current Input Supply Current Current Limit Foldback SHUTDOWN VOLTAGE (V) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VIN CURRENT (μA) 1961 G07 300 250 200 150 100 50 0 TA = 25°C VIN = 15V INPUT VOLTAGE (V) 0 5 10 15 20 25 30 VIN CURRENT (μA) 1961 G08 1200 1000 800 600 400 200 0 MINIMUM INPUT VOLTAGE TA = 25°C FEEDBACK VOLTAGE (V) 0 0.2 0.4 0.6 0.8 1 1.2 SWITCH PEAK CURRENT (A) 1961 G09 2.0 1.5 1.0 0.5 0 FB INPUT CURRENT (μA) 40 30 20 10 0 FB CURRENT SWITCH CURRENT TA = 25°C 5 LT1961 1961fa FB: The feedback pin is used to set output voltage using an external voltage divider that generates 1.2V at the pin with the desired output voltage. If required, the current limit can be reduced during start up when the FB pin is below 0.5V (see the Current Limit Foldback graph in the Typical Performance Characteristics section). An impedance of less than 5kΩ at the FB pin is needed for this feature to operate. VIN: This pin powers the internal circuitry and internal regulator. Keep the external bypass capacitor close to this pin. GND: Short GND pins 3 and 4 and the exposed pad on the PCB. The GND is the reference for the regulated output, so load regulation will suffer if the “ground” end of the load is not at the same voltage as the GND of the IC. This condition occurs when the load current flows through the metal path between the GND pins and the load ground point. Keep the ground path short between the GND pins and the load and use a ground plane when possible. Keep the path between the input bypass and the GND pins short. The exposed pad should be attached to a large copper area to improve thermal resistance. VSW: The switch pin is the collector of the on-chip power NPN switch and has large currents flowing through it. Keep the traces to the switching components as short as possible to minimize radiation and voltage spikes. SYNC: The sync pin is used to synchronize the internal oscillator to an external signal. It is directly logic compatible and can be driven with any signal between 20% and 80% duty cycle. The synchronizing range is equal to initial operating frequency, up to 2MHz. See Synchronization section in Applications Information for details. When not in use, this pin should be grounded. SHDN: The shutdown pin is used to turn off the regulator and to reduce input drain current to a few microamperes. The 1.35V threshold can function as an accurate undervoltage lockout (UVLO), preventing the regulator from operating until the input voltage has reached a predetermined level. Float or pull high to put the regulator in the operating mode. VC: The VC pin is the output of the error amplifier and the input of the peak switch current comparator. It is normally used for frequency compensation, but can do double duty as a current clamp or control loop override. This pin sits at about 0.3V for very light loads and 0.9V at maximum load. PIN FUNCTIONSU U U 6 LT1961 1961fa amplifier commands current to be delivered to the output rather than voltage. A voltage fed system will have low phase shift up to the resonant frequency of the inductor and output capacitor, then an abrupt 180° shift will occur. The current fed system will have 90° phase shift at a much lower frequency, but will not have the additional 90° shift until well beyond the LC resonant frequency. This makes it much easier to frequency compensate the feedback loop and also gives much quicker transient response. A comparator connected to the shutdown pin disables the internal regulator, reducing supply current. The LT1961 is a constant frequency, current-mode boost converter. This means that there is an internal clock and two feedback loops that control the duty cycle of the power switch. In addition to the normal error amplifier, there is a current sense amplifier that monitors switch current on a cycle-by-cycle basis. A switch cycle starts with an oscillator pulse which sets the RS flip-flop to turn the switch on. When switch current reaches a level set by the inverting input of the comparator, the flip-flop is reset and the switch turns off. Output voltage control is obtained by using the output of the error amplifier to set the switch current trip point. This technique means that the error Figure 1. Block Diagram BLOCK DIAGRAMW – + – + Σ VIN 2.5V BIAS REGULATOR 1.25MHz OSCILLATOR SW FB VC GND GND 1767 F01 SLOPE COMP 0.01Ω INTERNAL VCC CURRENT SENSE AMPLIFIER VOLTAGE GAIN = 40 SYNC SHDN SHUTDOWN COMPARATOR CURRENT COMPARATOR ERROR AMPLIFIER gm = 850μMho RS FLIP-FLOP DRIVER CIRCUITRY S R 0.3V Q1 POWER SWITCH 1.2V – + + – 1.35V 3μA 7μA 1 8 5 7 6 3 4 2 7 LT1961 1961fa APPLICATIONS INFORMATION W U U U FB RESISTOR NETWORK The suggested resistance (R2) from FB to ground is 10k 1%. This reduces the contribution of FB input bias current to output voltage to less than 0.2%. The formula for the resistor (R1) from VOUT to FB is: R R V R A OUT 1 2 12 1 2 2 0 2 = ( − ) − μ . . (. ) defines the pole frequency of the output stage, an X7R or X5R type ceramic, which have good temperature stability, is recommended. Tantalum capacitors are usually chosen for their bulk capacitance properties, useful in high transient load applications. ESR rather than absolute value defines output ripple at 1.25MHz. Values in the 22μF to 100μF range are generally needed to minimize ESR and meet ripple current ratings. Care should be taken to ensure the ripple ratings are not exceeded. Table 1. Surface Mount Solid Tantalum Capacitor ESR and Ripple Current E Case Size ESR (Max, Ω) Ripple Current (A) AVX TPS, Sprague 593D 0.1 to 0.3 0.7 to 1.1 AVX TAJ 0.7 to 0.9 0.4 D Case Size AVX TPS, Sprague 593D 0.1 to 0.3 0.7 to 1.1 C Case Size AVX TPS 0.2 (typ) 0.5 (typ) INPUT CAPACITOR Unlike the output capacitor, RMS ripple current in the input capacitor is normally low enough that ripple current rating is not an issue. The current waveform is triangular, with an RMS value given by: I V V V L f V RIPPLE RMS IN OUT IN OUT ( )= ( )( − ) ( )( )( ) 0.29 At higher switching frequency, the energy storage requirement of the input capacitor is reduced so values in the range of 1μF to 4.7μF are suitable for most applications. Y5V or similar type ceramics can be used since the absolute value of capacitance is less important and has no significant effect on loop stability. If operation is required close to the minimum input voltage required by either the output or the LT1961, a larger value may be necessary. This is to prevent excessive ripple causing dips below the minimum operating voltage resulting in erratic operation. Figure 2. Feedback Network OUTPUT CAPACITOR Step-up regulators supply current to the output in pulses. The rise and fall times of these pulses are very fast. The output capacitor is required to reduce the voltage ripple this causes. The RMS ripple current can be calculated from: IRIPPLE(RMS) =IOUT (VOUT − VIN) / VIN The LT1961 will operate with both ceramic and tantalum output capacitors. Ceramic capacitors are generally chosen for their small size, very low ESR (effective series resistance), and good high frequency operation, reducing output ripple voltage. Their low ESR removes a useful zero in the loop frequency response, common to tantalum capacitors. To compensate for this, the VC loop compensation pole frequency must typically be reduced by a factor of 10. Typical ceramic output capacitors are in the 1μF to 10μF range. Since the absolute value of capacitance – + 1.2V VSW VC GND 1961 F02 R1 R2 10k OUTPUT ERROR AMPLIFIER FB LT1961 + 8 LT1961 1961fa APPLICATIONS INFORMATION W U U U INDUCTOR CHOICE AND MAXIMUM OUTPUT CURRENT When choosing an inductor, there are 2 conditions that limit the minimum inductance; required output current, and avoidance of subharmonic oscillation. The maximum output current for the LT1961 in a standard boost converter configuration with an infinitely large inductor is: I A V V OUT MAX IN OUT ( ) . • = 1 5 η Where η = converter efficiency (typically 0.87 at high current). As the value of inductance is reduced, ripple current increases and IOUT(MAX) is reduced. The minimum inductance for a required output current is given by: L V V V V f V I V MIN IN OUT IN OUT OUT OUT IN = ⎛ ⎝ ⎜ ⎞ ⎠ ⎟ ( – ) ( ) . – ( )( ) • 2 15 η The second condition, avoidance of subharmonic oscillation, must be met if the operating duty cycle is greater than 50%. The slope compensation circuit within the LT1961 prevents subharmonic oscillation for inductor ripple currents of up to 0.7AP-P, defining the minimum inductor value to be: L V V V V f MIN IN OUT IN OUT = ( – ) 0.7 ( ) These conditions define the absolute minimum inductance. However, it is generally recommended that to prevent excessive output noise, and difficulty in obtaining stability, the ripple current is no more than 40% of the average inductor current. Since inductor ripple is: I V V V V L f P P RIPPLE IN OUT IN OUT − = ( – ) ( )( ) The recommended minimum inductance is: L V V V V I f MIN IN OUT IN OUT OUT = ( ) ( – ) . ( ) ( )( ) 2 0 4 2 The inductor value may need further adjustment for other factors such as output voltage ripple and filtering requirements. Remember also, inductance can drop significantly with DC current and manufacturing tolerance. The inductor must have a rating greater than its peak operating current to prevent saturation resulting in efficiency loss. Peak inductor current is given by: I V I V V V V V L f LPEAK OUT OUT IN IN OUT IN OUT = ( )( ) + − • ( ) η 2 ( )( ) Also, consideration should be given to the DC resistance of the inductor. Inductor resistance contributes directly to the efficiency losses in the overall converter. Suitable inductors are available from Coilcraft, Coiltronics, Dale, Sumida, Toko, Murata, Panasonic and other manufactures. Table 2 PART NUMBER VALUE (uH) ISAT(DC) (Amps) DCR (Ω) HEIGHT (mm) Coiltronics TP1-2R2 2.2 1.3 0.188 1.8 TP2-2R2 2.2 1.5 0.111 2.2 TP3-4R7 4.7 1.5 0.181 2.2 TP4- 100 10 1.5 0.146 3.0 Murata LQH1C1R0M04 1.0 0.51 0.28 1.8 LQH3C1R0M24 1.0 1.0 0.06 2.0 LQH3C2R2M24 2.2 0.79 0.1 2.0 LQH4C1R5M04 1.5 1 0.09 2.6 Sumida CD73- 100 10 1.44 0.080 3.5 CDRH4D18-2R2 2.2 1.32 0.058 1.8 CDRH5D18-6R2 6.2 1.4 0.071 1.8 CDRH5D28-100 10 1.3 0.048 2.8 Coilcraft 1008PS-272M 2.7 1.3 0.14 2.7 LPO1704-222M 2.2 1.6 0.12 1.0 LPO1704-332M 3.3 1.3 0.16 1.0 9 LT1961 1961fa APPLICATIONS INFORMATION W U U U shutdown pin can be used. The threshold voltage of the shutdown pin comparator is 1.35V. A 3μA internal current source defaults the open pin condition to be operating (see Typical Performance Graphs). Current hysteresis is added above the SHDN threshold. This can be used to set voltage hysteresis of the UVLO using the following: R V V A R V V V R A H L H 1 7 2 1 35 1 35 1 3 = − μ = ( − ) + μ . . VH – Turn-on threshold VL – Turn-off threshold Example: switching should not start until the input is above 4.75V and is to stop if the input falls below 3.75V. VH = 4.75V VL = 3.75V R V V A k R V V V k A k 1 4 75 3 75 7 143 2 1 35 4 75 1 35 143 3 50 4 = − μ = = ( − ) + μ = . . . . . . Keep the connections from the resistors to the SHDN pin short and make sure that the interplane or surface capacitance to the switching nodes are minimized. If high resistor values are used, the SHDN pin should be bypassed with a 1nF capacitor to prevent coupling problems from the switch node. CATCH DIODE The suggested catch diode (D1) is a UPS120 or 1N5818 Schottky. It is rated at 1A average forward current and 20V/30V reverse voltage. Typical forward voltage is 0.5V at 1A. The diode conducts current only during switch off time. Peak reverse voltage is equal to regulator output voltage. Average forward current in normal operation is equal to output current. SHUTDOWN AND UNDERVOLTAGE LOCKOUT Figure 4 shows how to add undervoltage lockout (UVLO) to the LT1961. Typically, UVLO is used in situations where the input supply is current limited, or has a relatively high source resistance. A switching regulator draws constant power from the source, so source current increases as source voltage drops. This looks like a negative resistance load to the source and can cause the source to current limit or latch low under low source voltage conditions. UVLO prevents the regulator from operating at source voltages where these problems might occur. Figure 4. Undervoltage Lockout 1.35V GND INPUT R1 1961 F04 SHDN VCC IN LT1961 3μA C1 R2 7μA An internal comparator will force the part into shutdown below the minimum VIN of 2.6V. This feature can be used to prevent excessive discharge of battery-operated systems. If an adjustable UVLO threshold is required, the 10 LT1961 1961fa SYNCHRONIZATION The SYNC pin, is used to synchronize the internal oscillator to an external signal. The SYNC input must pass from a logic level low, through the maximum synchronization threshold with a duty cycle between 20% and 80%. The input can be driven directly from a logic level output. The synchronizing range is equal to initial operating frequency up to 2MHz. This means that minimum practical sync frequency is equal to the worst-case high self-oscillating frequency (1.5MHz), not the typical operating frequency of 1.25MHz. Caution should be used when synchronizing above 1.7MHz because at higher sync frequencies the amplitude of the internal slope compensation used to prevent subharmonic switching is reduced. Higher inductor values will tend to eliminate this problem. See Frequency Compensation section for a discussion of an entirely different cause of subharmonic switching before assuming that the cause is insufficient slope compensation. Application Note 19 has more details on the theory of slope compensation. LAYOUT CONSIDERATIONS As with all high frequency switchers, when considering layout, care must be taken to achieve optimal electrical, thermal and noise performance. For maximum efficiency, switch rise and fall times are typically in the nanosecond range. To prevent noise both radiated and conducted, the APPLICATIONS INFORMATION W U U U high speed switching current path, shown in Figure 5, must be kept as short as possible. This is implemented in the suggested layout of Figure 6. Shortening this path will also reduce the parasitic trace inductance of approximately 25nH/inch. At switch off, this parasitic inductance produces a flyback spike across the LT1961 switch. When operating at higher currents and output voltages, with poor layout, this spike can generate voltages across the LT1961 that may exceed its absolute maximum rating. A ground plane should always be used under the switcher circuitry to prevent interplane coupling and overall noise. The VC and FB components should be kept as far away as possible from the switch node. The LT1961 pinout has been designed to aid in this. The ground for these components should be separated from the switch current path. Failure to do so will result in poor stability or subharmonic like oscillation. Board layout also has a significant effect on thermal resistance. The exposed pad is the copper plate that runs under the LT1961 die. This is the best thermal path for heat out of the package. Soldering the pad onto the board will reduce die temperature and increase the power capability of the LT1961. Provide as much copper area as possible around this pad. Adding multiple solder filled feedthroughs under and around the pad to the ground plane will also help. Similar treatment to the catch diode and inductor terminations will reduce any additional heating effects. 1961 F05 VOUT L1 SW GND LT1961 D1 C1 C3 VIN HIGH FREQUENCY SWITCHING PATH LOAD Figure 5. High Speed Switching Path 11 LT1961 1961fa Figure 6. Typical Application and Suggested Layout (Topside Only Shown) LT1961 VIN OUTPUT 12V 0.5A* INPUT 5V C2 6800pF C4 R3 100pF 6.8k R2 10k 1% R1 90.9k D1 UPS120 C1 10μF CERAMIC C3 2.2μF CERAMIC VSW SHDN FB OPEN OR HIGH = ON SYNC GND VC *MAXIMUM OUTPUT CURRENT IS SUBJECT TO THERMAL DERATING. L1 6.8μH VOUT INPUT GND C3 C1 R2 R1 L1 D1 KELVIN SENSE VOUT MINIMIZE LT1961, C1, D1 LOOP KEEP FB AND VC COMPONENTS AWAY FROM HIGH FREQUENCY, HIGH INPUT COMPONENTS PLACE FEEDTHROUGHS AROUND GROUND PIN FOR GOOD THERMAL CONDUCTIVITY LT1961EMS8E GND C4 U1 SOLDER EXPOSED GROUND PAD TO BOARD R3 C2 APPLICATIONS INFORMATION W U U U 12 LT1961 1961fa APPLICATIONS INFORMATION W U U U THERMAL CALCULATIONS Power dissipation in the LT1961 chip comes from four sources: switch DC loss, switch AC loss, drive current, and input quiescent current. The following formulas show how to calculate each of these losses. These formulas assume continuous mode operation, so they should not be used for calculating efficiency at light load currents. DC duty cycle V V V I V I V OUT IN OUT SW OUT OUT IN , ( ) ( )( ) = − = Switch loss: PSW = (DC)(ISW)2(RSW)+ 17n(ISW)(VOUT )(f) VIN loss: P V I DC VIN mA V IN SW = + IN ( )( )( ) ( ) 50 1 RSW = Switch resistance (≈ 0.27Ω hot) Example: VIN = 5V, VOUT = 12V and IOUT = 0.5A Total power dissipation = 0.23 + 0.31 + 0.07 + 0.005 = 0.62W Thermal resistance for LT1961 package is influenced by the presence of internal or backside planes. With a full plane under the package, thermal resistance will be about 50°C/W. To calculate die temperature, use the appropriate thermal resistance number and add in worst-case ambient temperature: TJ = TA + θJA (PTOT) If a true die temperature is required, a measurement of the SYNC to GND pin resistance can be used. The SYNC pin resistance across temperature must first be calibrated, with no device power, in an oven. The same measurement can then be used in operation to indicate the die temperature. FREQUENCY COMPENSATION Loop frequency compensation is performed on the output of the error amplifier (VC pin) with a series RC network. The main pole is formed by the series capacitor and the output impedance (≈500kΩ) of the error amplifier. The pole falls in the range of 2Hz to 20Hz. The series resistor creates a “zero” at 1kHz to 5kHz, which improves loop stability and transient response. A second capacitor, typically one-tenth the size of the main compensation capacitor, is sometimes used to reduce the switching frequency ripple on the VC pin. VC pin ripple is caused by output voltage ripple attenuated by the output divider and multiplied by the error amplifier. Without the second capacitor, VC pin ripple is: VC Pin Ripple = VRIPPLE = Output ripple (VP–P) gm = Error amplifier transconductance (≈850μmho) RC = Series resistor on VC pin VOUT = DC output voltage 1.2(VRIPPLE)(gm)(RC) (VOUT) To prevent irregular switching, VC pin ripple should be kept below 50mVP–P. Worst-case VC pin ripple occurs at maximum output load current and will also be increased if poor quality (high ESR) output capacitors are used. The addition of a 47pF capacitor on the VC pin reduces switching frequency ripple to only a few millivolts. A low value for RC will also reduce VC pin ripple, but loop phase margin may be inadequate. 13 LT1961 1961fa LT1961 FB VIN VC VIN 5V TO 10V *DALE LPE-4841-100MB GND LT1961 • TA02 S/S VSW P6KE-20A 1N4148 UPS140 UPS140 C1 4.7μF R2 10k 1% R1 115k 1% C2 2.2nF C3 100pF R3 10k –VOUT –15V VOUT 15V C4 47μF C5 47μF ON OFF 2, 3 8, 9 7 T1* 4 10 1 • • • + + + Dual Output Flyback Converter TYPICAL APPLICATIO SU LT1961 VIN GND VIN** 4V TO 9V VC FB LT1961 • TA03 S/S VSW C1 4.7μF 20V C4 2.2nF C5 100pF R1 10k R3 10k 1% R2 31.6k 1% VOUT † 5V C3 47μF 10V ON OFF L1A* 10μH • • L1B* 10μH C2 4.7μF BH ELECTRONICS 511-1012 INPUT VOLTAGE MAY BE GREATER OR LESS THAN OUTPUT VOLTAGE D1 UPS120 VIN 4V 5V 6V 7V 9V IOUT 0.59A 0.65A 0.70A 0.74A 0.80A †MAX IOUT * ** + + 4V-9VIN to 5VOUT SEPIC Converter** 14 LT1961 1961fa LT1961 VIN GND VC FB LT1961 • TA04 S/S VSW L1 4.7μH C1 10μF SINGLE Li-Ion CELL C4 47μF 10V C2 2.2nF C3 100pF R3 10k R2 10k 1% R1 31.6k 1% VOUT 5V D1 UPS120 ON OFF + + + VIN 2.7V 3.3V 3.6V IOUT 0.75A 0.93A 1.0A Single Li-Ion Cell to 5V TYPICAL APPLICATIO SU 15 LT1961 1961fa PACKAGE DESCRIPTIONU Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. MSOP (MS8E) 0307 REV D 0.53 ± 0.152 (.021 ± .006) SEATING PLANE NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.18 (.007) 0.254 (.010) 1.10 (.043) MAX 0.22 – 0.38 (.009 – .015) TYP 0.86 (.034) REF 0.65 (.0256) BSC 0° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 1 2 3 4 4.90 ± 0.152 (.193 ± .006) 8 8 1 BOTTOM VIEW OF EXPOSED PAD OPTION 7 6 5 3.00 ± 0.102 (.118 ± .004) (NOTE 3) 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 0.52 (.0205) REF 1.83 ± 0.102 (.072 ± .004) 2.06 ± 0.102 (.081 ± .004) 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 2.083 ± 0.102 (.082 ± .004) 2.794 ± 0.102 (.110 ± .004) 0.889 ± 0.127 (.035 ± .005) RECOMMENDED SOLDER PAD LAYOUT 0.42 ± 0.038 (.0165 ± .0015) TYP 0.65 (.0256) BSC 0.1016 ± 0.0508 (.004 ± .002) MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1662 Rev D) 16 LT1961 1961fa PART NUMBER DESCRIPTION COMMENTS LT1308A 600kHz, 2A, Step-Up Regulator 30V Switch, VIN = 1V to 6V, Low Battery Comparator, S8 Package LT1310 4.5MHz, 1.5A Step-Up with Phase Lock Loop 34V Switch, VIN = 2.75V to 18V, VOUT up to 35V, MS10E Package LT1370 High Efficiency DC/DC Converter 42V Switch, 6A, 500kHz Switch, DD-Pak, TO-220 Package LT1371 High Efficiency DC/DC Converter 35V Switch, 3A, 500kHz Switch, DD-Pak, TO-220 Package LT1372/LT1377 500kHz and 1MHz High Efficiency 1.5A Switching Regulators Boost Topology, VIN(MIN) = 2.7V, S8 Package LT1946/LT1946A 1.2MHz/2.7MHz, 1.5A, Monolithic Step-Up Regulator VIN = 2.6V to 16V, VOUT up to 34V, Integrated SS, MS8 Package LTC3400/ 1.2MHz, 600mA, Synchronous Step-Up VIN = 0.85V to 5V, VOUT to 5.5V, Up to 95% Efficiency, LTC3400B ThinSOT Package LTC3401 Single Cell, High Current (1A), Micropower, Synchronous 3MHz VIN = 0.85V to 5V, VOUT to 5.5V, Up to 97% Efficiency Step-Up DC/DC Converter Synchronizable, Oscillator from 100kHz to 3MHz, MS10 Package LTC3402 Single Cell, High Current (2A), Micropower, Synchronous 3MHz VIN = 0.85V to 5V, VOUT to 5.5V, Up to 95% Efficiency Step-Up DC/DC Converter Synchronizable, Oscillator from 100kHz to 3MHz, MS10 Package LTC3405/ 1.5MHz High Efficiency, IOUT = 300mA, Monolithic Synchronous VIN = 2.5V to 5.5V, VOUT to 0.8V, Up to 95% Efficiency, 100% LTC3405A Step-Down Regulator Duty Cycle, IQ = 20μA, ThinSOT Package ThinSOT is a trademark of Linear Technology Corporation. LT 0707 REV A • PRINTED IN USA © LINEAR TECHNOLOGY CORPORATION 2001 RELATED PARTS Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LASER 190Ω 1% 1N4002 0.1μF (ALL) 10k VIN 10μF VC VIN FB GND 2.2μF VIN 12V TO 25V 150Ω MUR405 L2 10μH LT1961 L1 5 4 1 3 2 11 8 HV DIODES 1800pF 10kV 0.01μF 5kV 1800pF 10kV 47k 5W 2.2μF 0.47μF L1 = Q1, Q2 = 0.47μF = HV DIODES = LASER = COILTRONICS CTX02-11128 ZETEX ZTX849 WIMA 3X 0.15μF TYPE MKP-20 SEMTECH-FM-50 HUGHES 3121H-P 10k LT1961 • TA05 VSW Q1 Q2 + + + COILTRONICS (407) 241-7876 U TYPICAL APPLICATIO High Voltage Laser Power Supply LT3757/LT3757A 1 3757afd n Wide Input Voltage Range: 2.9V to 40V n Positive or Negative Output Voltage Programming with a Single Feedback Pin n Current Mode Control Provides Excellent Transient Response n Programmable Operating Frequency (100kHz to 1MHz) with One External Resistor n Synchronizable to an External Clock n Low Shutdown Current < 1μA n Internal 7.2V Low Dropout Voltage Regulator n Programmable Input Undervoltage Lockout with Hysteresis n Programmable Soft-Start n Small 10-Lead DFN (3mm × 3mm) and Thermally Enhanced 10-Pin MSOP Packages Typical Application Description Boost, Flyback, SEPIC and Inverting Controller The LT®3757/LT3757A are wide input range, current mode, DC/DC controllers which are capable of generating either positive or negative output voltages. They can be configured as either a boost, flyback, SEPIC or inverting converter. The LT3757/LT3757A drive a low side external N-channel power MOSFET from an internal regulated 7.2V supply. The fixed frequency, current-mode architecture results in stable operation over a wide range of supply and output voltages. The operating frequency of LT3757/LT3757A can be set with an external resistor over a 100kHz to 1MHz range, and can be synchronized to an external clock using the SYNC pin. A low minimum operating supply voltage of 2.9V, and a low shutdown quiescent current of less than 1μA, make the LT3757/LT3757A ideally suited for batteryoperated systems. The LT3757/LT3757A feature soft-start and frequency foldback functions to limit inductor current during start-up and output short-circuit. The LT3757A has improved load transient performance compared to the LT3757. High Efficiency Boost Converter Features Applications n Automotive and Industrial Boost, Flyback, SEPIC and Inverting Converters n Telecom Power Supplies n Portable Electronic Equipment Efficiency SENSE LT3757 VIN VIN 8V TO 16V 10μF 25V X5R VOUT 24V 2A 0.01 41.2k 300kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS VC 200k 43.2k 0.1μF 22k 6.8nF 10μH 3757 TA01a 226k 16.2k 4.7μF 10V X5R 10μF 25V X5R 47μF 35V ×2 + OUTPUT CURRENT (A) 0.001 EFFICIENCY (%) 30 50 40 60 70 80 90 100 0.01 0.1 1 3757 TA01b 10 VIN = 8V VIN = 16V L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks and No RSENSE and ThinSOT are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. LT3757/LT3757A 2 3757afd Pin Configuration Absolute Maximum Ratings VIN, SHDN/UVLO (Note 6)..........................................40V INTVCC.....................................................VIN + 0.3V, 20V GATE......................................................... INTVCC + 0.3V SYNC...........................................................................8V VC, SS..........................................................................3V RT.............................................................................1.5V SENSE.....................................................................±0.3V FBX.................................................................. –6V to 6V (Note 1) TOP VIEW DD PACKAGE 10-LEAD (3mm × 3mm) PLASTIC DFN 10 9 6 7 8 4 5 3 11 2 1 VIN SHDN/UVLO INTVCC GATE SENSE VC FBX SS RT SYNC TJMAX = 125°C, θJA = 43°C/W EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB 12345 VC FBX SS RT SYNC 10 9876 VIN SHDN/UVLO INTVCC GATE SENSE TOP VIEW MSE PACKAGE 10-LEAD PLASTIC MSOP 11 TJMAX = 150°C, θJA = 40°C/W EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB Order Information LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT3757EDD#PBF LT3757EDD#TRPBF LDYW 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3757IDD#PBF LT3757IDD#TRPBF LDYW 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3757EMSE#PBF LT3757EMSE#TRPBF LTDYX 10-Lead (3mm × 3mm) Plastic MSOP –40°C to 125°C LT3757IMSE#PBF LT3757IMSE#TRPBF LTDYX 10-Lead (3mm × 3mm) Plastic MSOP –40°C to 125°C LT3757HMSE#PBF LT3757HMSE#TRPBF LTDYX 10-Lead (3mm × 3mm) Plastic MSOP –40°C to 150°C LT3757MPMSE#PBF LT3757MPMSE#TRPBF LTDYX 10-Lead (3mm × 3mm) Plastic MSOP –55°C to 150°C LT3757AEDD#PBF LT3757AEDD#TRPBF LGGR 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3757AIDD#PBF LT3757AIDD#TRPBF LGGR 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C LT3757AEMSE#PBF LT3757AEMSE#TRPBF LTGGM 10-Lead (3mm × 3mm) Plastic MSOP –40°C to 125°C LT3757AIMSE#PBF LT3757AIMSE#TRPBF LTGGM 10-Lead (3mm × 3mm) Plastic MSOP –40°C to 125°C LT3757AHMSE#PBF LT3757AHMSE#TRPBF LTGGM 10-Lead (3mm × 3mm) Plastic MSOP –40°C to 150°C LT3757AMPMSE#PBF LT3757AMPMSE#TRPBF LTGGM 10-Lead (3mm × 3mm) Plastic MSOP –55°C to 150°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ Operating Temperature Range (Notes 2, 8) LT3757E/LT3757AE............................ –40°C to 125°C LT3757I/LT3757AI.............................. –40°C to 125°C LT3757H/LT3757AH............................ –40°C to 150°C LT3757MP/LT3757AMP...................... –55°C to 150°C Storage Temperature Range DFN..................................................... –65°C to 125°C MSOP................................................. –65°C to 150°C Lead Temperature (Soldering, 10 sec) MSOP................................................................300°C LT3757/LT3757A 3 3757afd E lectrical Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 24V, SHDN/UVLO = 24V, SENSE = 0V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS VIN Operating Range 2.9 40 V VIN Shutdown IQ SHDN/UVLO = 0V SHDN/UVLO = 1.15V 0.1 1 6 μA μA VIN Operating IQ VC = 0.3V, RT = 41.2k 1.6 2.2 mA VIN Operating IQ with Internal LDO Disabled VC = 0.3V, RT = 41.2k, INTVCC = 7.5V 280 400 μA SENSE Current Limit Threshold l 100 110 120 mV SENSE Input Bias Current Current Out of Pin –65 μA Error Amplifier FBX Regulation Voltage (VFBX(REG)) VFBX > 0V (Note 3) VFBX < 0V (Note 3) l l 1.569 –0.816 1.6 –0.80 1.631 –0.784 V V FBX Overvoltage Lockout VFBX > 0V (Note 4) VFBX < 0V (Note 4) 6 7 8 11 10 14 % % FBX Pin Input Current VFBX = 1.6V (Note 3) VFBX = –0.8V (Note 3) –10 70 100 10 nA nA Transconductance gm (ΔIVC/ΔVFBX) (Note 3) 230 μS VC Output Impedance (Note 3) 5 MΩ VFBX Line Regulation [ΔVFBX /(ΔVIN • VFBX(REG))] VFBX > 0V, 2.9V < VIN < 40V (Notes 3, 7) VFBX < 0V, 2.9V < VIN < 40V (Notes 3, 7) 0.002 0.0025 0.056 0.05 %/V %/V VC Current Mode Gain (ΔVVC /ΔVSENSE) 5.5 V/V VC Source Current VFBX = 0V, VC = 1.5V –15 μA VC Sink Current VFBX = 1.7V VFBX = –0.85V 12 11 μA μA Oscillator Switching Frequency RT = 41.2k to GND, VFBX = 1.6V RT = 140k to GND, VFBX = 1.6V RT = 10.5k to GND, VFBX = 1.6V 270 300 100 1000 330 kHz kHz kHz RT Voltage VFBX = 1.6V 1.2 V Minimum Off-Time 220 ns Minimum On-Time 220 ns SYNC Input Low 0.4 V SYNC Input High 1.5 V SS Pull-Up Current SS = 0V, Current Out of Pin –10 μA Low Dropout Regulator INTVCC Regulation Voltage l 7 7.2 7.4 V INTVCC Undervoltage Lockout Threshold Falling INTVCC UVLO Hysteresis 2.6 2.7 0.1 2.8 V V INTVCC Overvoltage Lockout Threshold 16 17.5 V INTVCC Current Limit VIN = 40V VIN = 15V 30 40 95 55 mA mA INTVCC Load Regulation (ΔVINTVCC/ VINTVCC) 0 < IINTVCC < 20mA, VIN = 8V –0.9 –0.5 % INTVCC Line Regulation ΔVINTVCC/(VINTVCC • ΔVIN) 8V < VIN < 40V 0.008 0.03 %/V Dropout Voltage (VIN – VINTVCC) VIN = 6V, IINTVCC = 20mA 400 mV INTVCC Current in Shutdown SHDN/UVLO = 0V, INTVCC = 8V 16 μA LT3757/LT3757A 4 3757afd TEMPERATURE (°C) –75 –50 1580 1585 REGULATED FEEDBACK VOLTAGE (mV) 1590 1605 1600 0 50 75 1595 –25 25 100 125 150 3757 G01 VIN = 40V VIN = 24V VIN = 8V VIN = INTVCC = 2.9V SHDN/UVLO = 1.33V TEMPERATURE (°C) REGULATED FEEDBACK VOLTAGE (mV) –802 –800 –798 –788 –790 –792 –794 –804 –796 3757 G02 –75 –50 –25 0 25 50 75 100 125 150 VIN = 40V VIN = 24V VIN = 8V VIN = INTVCC = 2.9V SHDN/UVLO = 1.33V Typical Performance Characteristics Positive Feedback Voltage vs Temperature, VIN Negative Feedback Voltage vs Temperature, VIN Quiescent Current vs Temperature, VIN TA = 25°C, unless otherwise noted. E lectrical Characteristics The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN = 24V, SHDN/UVLO = 24V, SENSE = 0V, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS INTVCC Voltage to Bypass Internal LDO 7.5 V Logic Inputs SHDN/UVLO Threshold Voltage Falling VIN = INTVCC = 8V l 1.17 1.22 1.27 V SHDN/UVLO Input Low Voltage I(VIN) Drops Below 1μA 0.4 V SHDN/UVLO Pin Bias Current Low SHDN/UVLO = 1.15V 1.7 2 2.5 μA SHDN/UVLO Pin Bias Current High SHDN/UVLO = 1.30V 10 100 nA Gate Driver tr Gate Driver Output Rise Time CL = 3300pF (Note 5), INTVCC = 7.5V 22 ns tf Gate Driver Output Fall Time CL = 3300pF (Note 5), INTVCC = 7.5V 20 ns Gate VOL 0.05 V Gate VOH INTVCC –0.05 V Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT3757E/LT3757AE are guaranteed to meet performance specifications from the 0°C to 125°C junction temperature. Specifications over the –40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LT3757I/LT3757AI are guaranteed over the full –40°C to 125°C operating junction temperature range. The LT3757H/LT3757AH are guaranteed over the full –40°C to 150°C operating junction temperature range. High junction temperatures degrade operating lifetimes. Operating lifetime is derated at junction temperatures greater than 125°C. The LT3757MP/LT3757AMP are 100% tested and guaranteed over the full –55°C to 150°C operating junction temperature range. Note 3: The LT3757/LT3757A are tested in a feedback loop which servos VFBX to the reference voltages (1.6V and –0.8V) with the VC pin forced to 1.3V. Note 4: FBX overvoltage lockout is measured at VFBX(OVERVOLTAGE) relative to regulated VFBX(REG). Note 5: Rise and fall times are measured at 10% and 90% levels. Note 6: For VIN below 6V, the SHDN/UVLO pin must not exceed VIN. Note 7: SHDN/UVLO = 1.33V when VIN = 2.9V. Note 8: The LT3757/LT3757A include overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed the maximum operating junction temperature when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. –75 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) 1.4 QUIESCENT CURRENT (mA) 1.6 1.8 1.5 1.7 3757 G03 VIN = 40V VIN = 24V VIN = INTVCC = 2.9V LT3757/LT3757A 5 3757afd Typical Performance Characteristics Switching Frequency vs Temperature SENSE Current Limit Threshold vs Temperature SENSE Current Limit Threshold vs Duty Cycle SHDN/UVLO Threshold vs Temperature SHDN/UVLO Current vs Voltage SHDN/UVLO Hysteresis Current vs Temperature Dynamic Quiescent Current vs Switching Frequency RT vs Switching Frequency Normalized Switching Frequency vs FBX TA = 25°C, unless otherwise noted. FBX VOLTAGE (V) –0.8 0 NORMALIZED FREQUENCY (%) 20 40 60 80 120 –0.4 0 0.4 0.8 3757 G06 1.2 1.6 100 –75 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) 100 SENSE THRESHOLD (mV) 105 110 115 120 3757 G08 DUTY CYCLE (%) 0 95 SENSE THRESHOLD (mV) 105 20 40 60 80 115 100 110 100 3757 G09 SHDN/UVLO VOLTAGE (V) 0 0 SHDN/UVLO CURRENT (μA) 20 10 20 30 40 10 30 40 3757 G11 –75 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) 1.6 ISHDN/UVLO (μA) 1.8 2.0 2.2 2.4 3757 G12 SWITCHING FREQUENCY (KHz) 0 0 IQ(mA) 15 20 35 300 500 600 700 10 5 25 30 100 200 400 800 900 1000 3757 G04 CL = 3300pF SWITCHING FREQUENCY (KHz) 0 10 RT (k ) 100 1000 100 200 300 400 500 600 700 800 900 1000 3757 G05 –75 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) 270 SWITCHING FREQUENCY (kHz) 280 290 300 310 330 3757 G07 320 RT = 41.2K –75 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) 1.18 SHDN/UVLO VOLTAGE (V) 1.22 1.24 1.26 1.28 1.20 3757 G10 SHDN/UVLO FALLING SHDN/UVLO RISING LT3757/LT3757A 6 3757afd Typical Performance Characteristics INTVCC Line Regulation INTVCC Dropout Voltage vs Current, Temperature Gate Drive Rise and Fall Time vs INTVCC Typical Start-Up Waveforms INTVCC vs Temperature INTVCC Minimum Output Current vs VIN INTVCC Load Regulation TA = 25°C, unless otherwise noted. Gate Drive Rise and Fall Time vs CL FBX Frequency Foldback Waveforms During Overcurrent –75 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) 7.0 INTVCC (V) 7.1 7.2 7.3 7.4 3757 G13 VIN (V) 0 INTVCC VOLTAGE (V) 35 7.25 7.20 5 10 15 20 25 30 40 7.15 7.10 7.30 3757 G16 CL (nF) 0 TIME (ns) 60 70 80 50 40 5 10 15 20 25 30 10 0 30 90 20 3757 G18 RISE TIME INTVCC = 7.2V FALL TIME INTVCC (V) 3 TIME (ns) 20 25 15 10 6 9 12 15 5 0 30 3757 G19 CL = 3300pF RISE TIME FALL TIME 2ms/DIV VOUT 5V/DIV IL1A + IL1B 5A/DIV 3757 G20 VIN = 12V PAGE 31 CIRCUIT 50μs/DIV PAGE 31 CIRCUIT VOUT 10V/DIV VSW 20V/DIV IL1A + IL1B 5A/DIV 3757 G21 VIN = 12V INTVCC LOAD (mA) 0 6.8 7 7.1 7.2 7.3 20 40 50 60 6.9 10 30 70 3757 G15 INTVCC VOLTAGE (V) VIN = 8V INTVCC LOAD (mA) 0 DROPOUT VOLTAGE (mV) 500 600 300 400 200 5 10 15 20 100 0 700 3757 G17 150°C 125°C 25°C 0°C –55°C 75°C VIN = 6V VIN (V) 0 INTVCC CURRENT (mA) 50 60 70 40 3757 G14 40 30 0 10 5 10 15 20 25 30 35 20 90 80 TJ = 150°C INTVCC = 6V INTVCC = 4.5V LT3757/LT3757A 7 3757afd Pin Functions VC (Pin 1): Error Amplifier Compensation Pin. Used to stabilize the voltage loop with an external RC network. FBX (Pin 2): Positive and Negative Feedback Pin. Receives the feedback voltage from the external resistor divider across the output. Also modulates the frequency during start-up and fault conditions when FBX is close to GND. SS (Pin 3): Soft-Start Pin. This pin modulates compensation pin voltage (VC) clamp. The soft-start interval is set with an external capacitor. The pin has a 10μA (typical) pull-up current source to an internal 2.5V rail. The soft-start pin is reset to GND by an undervoltage condition at SHDN/ UVLO, an INTVCC undervoltage or overvoltage condition or an internal thermal lockout. RT (Pin 4): Switching Frequency Adjustment Pin. Set the frequency using a resistor to GND. Do not leave this pin open. SYNC (Pin 5): Frequency Synchronization Pin. Used to synchronize the switching frequency to an outside clock. If this feature is used, an RT resistor should be chosen to program a switching frequency 20% slower than the SYNC pulse frequency. Tie the SYNC pin to GND if this feature is not used. SYNC is ignored when FBX is close to GND. SENSE (Pin 6): The Current Sense Input for the Control Loop. Kelvin connect this pin to the positive terminal of the switch current sense resistor in the source of the N-channel MOSFET. The negative terminal of the current sense resistor should be connected to GND plane close to the IC. GATE (Pin 7): N-Channel MOSFET Gate Driver Output. Switches between INTVCC and GND. Driven to GND when IC is shut down, during thermal lockout or when INTVCC is above or below the OV or UV thresholds, respectively. INTVCC (Pin 8): Regulated Supply for Internal Loads and Gate Driver. Supplied from VIN and regulated to 7.2V (typical). INTVCC must be bypassed with a minimum of 4.7μF capacitor placed close to pin. INTVCC can be connected directly to VIN, if VIN is less than 17.5V. INTVCC can also be connected to a power supply whose voltage is higher than 7.5V, and lower than VIN, provided that supply does not exceed 17.5V. SHDN/UVLO (Pin 9): Shutdown and Undervoltage Detect Pin. An accurate 1.22V (nominal) falling threshold with externally programmable hysteresis detects when power is okay to enable switching. Rising hysteresis is generated by the external resistor divider and an accurate internal 2μA pull-down current. An undervoltage condition resets sort-start. Tie to 0.4V, or less, to disable the device and reduce VIN quiescent current below 1μA. VIN (Pin 10): Input Supply Pin. Must be locally bypassed with a 0.22μF, or larger, capacitor placed close to the pin. Exposed Pad (Pin 11): Ground. This pin also serves as the negative terminal of the current sense resistor. The Exposed Pad must be soldered directly to the local ground plane. LT3757/LT3757A 8 3757afd Block Diagram Figure 1. LT3757 Block Diagram Working as a SEPIC Converter L1 R1 R4 R3 M1 L2 R2 FBX 1.22V 2.5V CDC D1 CIN VOUT COUT2 COUT1 CVCC INTVCC VIN RSENSE VISENSE • + + VIN IS1 2μA 10 8 7 1 9 SHDN/UVLO INTERNAL REGULATOR AND UVLO TSD 165°C A10 Q3 VC VC 17.5V 2.7V UP 2.6V DOWN A8 UVLO IS2 10μA IS3 CC1 CC2 RC DRIVER SLOPE SENSE GND GATE 108mV SR1 + – + – CURRENT LIMIT RAMP GENERATOR 7.2V LDO • + – + – R O S 2.5V G1 RT RT SS CSS SYNC 1.25V 1.25V FBX FBX 1.6V –0.8V + – + – + – 2 3 5 4 + – + – 6 11 RAMP PWM COMPARATOR FREQUENCY FOLDBACK 100kHz-1MHz OSCILLATOR FREQ FOLDBACK FREQ PROG 3757 F01 – ++ Q1 A1 A2 1.72V –0.88V + – + – A11 A12 A3 A4 A5 A6 G5 G2 G6 A7 A9 Q2 D2 R5 8k D3 G4 G3 LT3757/LT3757A 9 3757afd Applications Information Main Control Loop The LT3757 uses a fixed frequency, current mode control scheme to provide excellent line and load regulation. Operation can be best understood by referring to the Block Diagram in Figure 1. The start of each oscillator cycle sets the SR latch (SR1) and turns on the external power MOSFET switch M1 through driver G2. The switch current flows through the external current sensing resistor RSENSE and generates a voltage proportional to the switch current. This current sense voltage VISENSE (amplified by A5) is added to a stabilizing slope compensation ramp and the resulting sum (SLOPE) is fed into the positive terminal of the PWM comparator A7. When SLOPE exceeds the level at the negative input of A7 (VC pin), SR1 is reset, turning off the power switch. The level at the negative input of A7 is set by the error amplifier A1 (or A2) and is an amplified version of the difference between the feedback voltage (FBX pin) and the reference voltage (1.6V or –0.8V, depending on the configuration). In this manner, the error amplifier sets the correct peak switch current level to keep the output in regulation. The LT3757 has a switch current limit function. The current sense voltage is input to the current limit comparator A6. If the SENSE pin voltage is higher than the sense current limit threshold VSENSE(MAX) (110mV, typical), A6 will reset SR1 and turn off M1 immediately. The LT3757 is capable of generating either positive or negative output voltage with a single FBX pin. It can be configured as a boost, flyback or SEPIC converter to generate positive output voltage, or as an inverting converter to generate negative output voltage. When configured as a SEPIC converter, as shown in Figure 1, the FBX pin is pulled up to the internal bias voltage of 1.6V by a voltage divider (R1 and R2) connected from VOUT to GND. Comparator A2 becomes inactive and comparator A1 performs the inverting amplification from FBX to VC. When the LT3757 is in an inverting configuration, the FBX pin is pulled down to –0.8V by a voltage divider connected from VOUT to GND. Comparator A1 becomes inactive and comparator A2 performs the noninverting amplification from FBX to VC. The LT3757 has overvoltage protection functions to protect the converter from excessive output voltage overshoot during start-up or recovery from a short-circuit condition. An overvoltage comparator A11 (with 20mV hysteresis) senses when the FBX pin voltage exceeds the positive regulated voltage (1.6V) by 8% and provides a reset pulse. Similarly, an overvoltage comparator A12 (with 10mV hysteresis) senses when the FBX pin voltage exceeds the negative regulated voltage (–0.8V) by 11% and provides a reset pulse. Both reset pulses are sent to the main RS latch (SR1) through G6 and G5. The power MOSFET switch M1 is actively held off for the duration of an output overvoltage condition. Programming Turn-On and Turn-Off Thresholds with the SHDN/UVLO Pin The SHDN/UVLO pin controls whether the LT3757 is enabled or is in shutdown state. A micropower 1.22V reference, a comparator A10 and a controllable current source IS1 allow the user to accurately program the supply voltage at which the IC turns on and off. The falling value can be accurately set by the resistor dividers R3 and R4. When SHDN/UVLO is above 0.7V, and below the 1.22V threshold, the small pull-down current source IS1 (typical 2μA) is active. The purpose of this current is to allow the user to program the rising hysteresis. The Block Diagram of the comparator and the external resistors is shown in Figure 1. The typical falling threshold voltage and rising threshold voltage can be calculated by the following equations: VVIN,FALLING = 1.22 • (R3 +R4) R4 VVIN,RISING = 2μA •R3+ VIN,FALLING For applications where the SHDN/UVLO pin is only used as a logic input, the SHDN/UVLO pin can be connected directly to the input voltage VIN for always-on operation. LT3757/LT3757A 10 3757afd Applications Information INTVCC Regulator Bypassing and Operation An internal, low dropout (LDO) voltage regulator produces the 7.2V INTVCC supply which powers the gate driver, as shown in Figure 1. If a low input voltage operation is expected (e.g., supplying power from a lithium-ion battery or a 3.3V logic supply), low threshold MOSFETs should be used. The LT3757 contains an undervoltage lockout comparator A8 and an overvoltage lockout comparator A9 for the INTVCC supply. The INTVCC undervoltage (UV) threshold is 2.7V (typical), with 100mV hysteresis, to ensure that the MOSFETs have sufficient gate drive voltage before turning on. The logic circuitry within the LT3757 is also powered from the internal INTVCC supply. The INTVCC overvoltage (OV) threshold is set to be 17.5V (typical) to protect the gate of the power MOSFET. When INTVCC is below the UV threshold, or above the OV threshold, the GATE pin will be forced to GND and the soft-start operation will be triggered. The INTVCC regulator must be bypassed to ground immediately adjacent to the IC pins with a minimum of 4.7μF ceramic capacitor. Good bypassing is necessary to supply the high transient currents required by the MOSFET gate driver. In an actual application, most of the IC supply current is used to drive the gate capacitance of the power MOSFET. The on-chip power dissipation can be a significant concern when a large power MOSFET is being driven at a high frequency and the VIN voltage is high. It is important to limit the power dissipation through selection of MOSFET and/ or operating frequency so the LT3757 does not exceed its maximum junction temperature rating. The junction temperature TJ can be estimated using the following equations: TJ = TA + PIC • θJA TA = ambient temperature θJA = junction-to-ambient thermal resistance PIC = IC power consumption = VIN • (IQ + IDRIVE) IQ = VIN operation IQ = 1.6mA IDRIVE = average gate drive current = f • QG f = switching frequency QG = power MOSFET total gate charge The LT3757 uses packages with an Exposed Pad for enhanced thermal conduction. With proper soldering to the Exposed Pad on the underside of the package and a full copper plane underneath the device, thermal resistance (θJA) will be about 43°C/W for the DD package and 40°C/W for the MSE package. For an ambient board temperature of TA = 70°C and maximum junction temperature of 125°C, the maximum IDRIVE (IDRIVE(MAX)) of the DD package can be calculated as: IDRIVE(MAX) = (TJ − TA) (θJA • VIN) −IQ = 1.28W VIN − 1.6mA The LT3757 has an internal INTVCC IDRIVE current limit function to protect the IC from excessive on-chip power dissipation. The IDRIVE current limit decreases as the VIN increases (see the INTVCC Minimum Output Current vs VIN graph in the Typical Performance Characteristics section). If IDRIVE reaches the current limit, INTVCC voltage will fall and may trigger the soft-start. Based on the preceding equation and the INTVCC Minimum Output Current vs VIN graph, the user can calculate the maximum MOSFET gate charge the LT3757 can drive at a given VIN and switch frequency. A plot of the maximum QG vs VIN at different frequencies to guarantee a minimum 4.5V INTVCC is shown in Figure 2. As illustrated in Figure 2, a trade-off between the operating frequency and the size of the power MOSFET may be needed in order to maintain a reliable IC junction temperature. Figure 2. Recommended Maximum QG vs VIN at Different Frequencies to Ensure INTVCC Higher Than 4.5V VIN (V) 0 QG (nC) 200 250 150 100 5 10 15 20 25 30 35 40 50 0 300 3757 F02 300kHz 1MHz LT3757/LT3757A 11 3757afd Applications Information Prior to lowering the operating frequency, however, be sure to check with power MOSFET manufacturers for their most recent low QG, low RDS(ON) devices. Power MOSFET manufacturing technologies are continually improving, with newer and better performance devices being introduced almost yearly. An effective approach to reduce the power consumption of the internal LDO for gate drive is to tie the INTVCC pin to an external voltage source high enough to turn off the internal LDO regulator. If the input voltage VIN does not exceed the absolute maximum rating of both the power MOSFET gate-source voltage (VGS) and the INTVCC overvoltage lockout threshold voltage (17.5V), the INTVCC pin can be shorted directly to the VIN pin. In this condition, the internal LDO will be turned off and the gate driver will be powered directly from the input voltage, VIN. With the INTVCC pin shorted to VIN, however, a small current (around 16μA) will load the INTVCC in shutdown mode. For applications that require the lowest shutdown mode input supply current, do not connect the INTVCC pin to VIN. In SEPIC or flyback applications, the INTVCC pin can be connected to the output voltage VOUT through a blocking diode, as shown in Figure 3, if VOUT meets the following conditions: 1. VOUT < VIN (pin voltage) 2. VOUT < 17.5V 3. VOUT < maximum VGS rating of power MOSFET A resistor RVCC can be connected, as shown in Figure 3, to limit the inrush current from VOUT. Regardless of whether or not the INTVCC pin is connected to an external voltage source, it is always necessary to have the driver circuitry bypassed with a 4.7μF low ESR ceramic capacitor to ground immediately adjacent to the INTVCC and GND pins. Figure 3. Connecting INTVCC to VOUT CVCC 4.7μF VOUT 3757 F03 INTVCC GND LT3757 RVCC DVCC Operating Frequency and Synchronization The choice of operating frequency may be determined by on-chip power dissipation, otherwise it is a trade-off between efficiency and component size. Low frequency operation improves efficiency by reducing gate drive current and MOSFET and diode switching losses. However, lower frequency operation requires a physically larger inductor. Switching frequency also has implications for loop compensation. The LT3757 uses a constant-frequency architecture that can be programmed over a 100kHz to 1000kHz range with a single external resistor from the RT pin to ground, as shown in Figure 1. The RT pin must have an external resistor to GND for proper operation of the LT3757. A table for selecting the value of RT for a given operating frequency is shown in Table 1. Table 1. Timing Resistor (RT) Value OSCILLATOR FREQUENCY (kHz) RT (kΩ) 100 140 200 63.4 300 41.2 400 30.9 500 24.3 600 19.6 700 16.5 800 14 900 12.1 1000 10.5 The operating frequency of the LT3757 can be synchronized to an external clock source. By providing a digital clock signal into the SYNC pin, the LT3757 will operate at the SYNC clock frequency. If this feature is used, an RT resistor should be chosen to program a switching frequency 20% slower than SYNC pulse frequency. The SYNC pulse should have a minimum pulse width of 200ns. Tie the SYNC pin to GND if this feature is not used. LT3757/LT3757A 12 3757afd Applications Information Duty Cycle Consideration Switching duty cycle is a key variable defining converter operation. As such, its limits must be considered. Minimum on-time is the smallest time duration that the LT3757 is capable of turning on the power MOSFET. This time is generally about 220ns (typical) (see Minimum On-Time in the Electrical Characteristics table). In each switching cycle, the LT3757 keeps the power switch off for at least 220ns (typical) (see Minimum Off-Time in the Electrical Characteristics table). The minimum on-time and minimum off-time and the switching frequency define the minimum and maximum switching duty cycles a converter is able to generate: Minimum duty cycle = minimum on-time • frequency Maximum duty cycle = 1 – (minimum off-time • frequency) Programming the Output Voltage The output voltage (VOUT) is set by a resistor divider, as shown in Figure 1. The positive and negative VOUT are set by the following equations: VOUT,POSITIVE = 1.6V • 1+ R2 R1 VOUT,NEGATIVE = –0.8V • 1+ R2 R1 The resistors R1 and R2 are typically chosen so that the error caused by the current flowing into the FBX pin during normal operation is less than 1% (this translates to a maximum value of R1 at about 158k). In the applications where VOUT is pulled up by an external positive power supply, the FBX pin is also pulled up through the R2 and R1 network. Make sure the FBX does not exceed its absolute maximum rating (6V). The R5, D2, and D3 in Figure 1 provide a resistive clamp in the positive direction. To ensure FBX is lower than 6V, choose sufficiently large R1 and R2 to meet the following condition: 6V • 1+ R2 R1 + 3.5V • R2 8kΩ > VOUT(MAX) where VOUT(MAX) is the maximum VOUT that is pulled up by an external power supply. Soft-Start The LT3757 contains several features to limit peak switch currents and output voltage (VOUT) overshoot during start-up or recovery from a fault condition. The primary purpose of these features is to prevent damage to external components or the load. High peak switch currents during start-up may occur in switching regulators. Since VOUT is far from its final value, the feedback loop is saturated and the regulator tries to charge the output capacitor as quickly as possible, resulting in large peak currents. A large surge current may cause inductor saturation or power switch failure. The LT3757 addresses this mechanism with the SS pin. As shown in Figure 1, the SS pin reduces the power MOSFET current by pulling down the VC pin through Q2. In this way the SS allows the output capacitor to charge gradually toward its final value while limiting the start-up peak currents. The typical start-up waveforms are shown in the Typical Performance Characteristics section. The inductor current IL slewing rate is limited by the soft-start function. Besides start-up, soft-start can also be triggered by the following faults: 1. INTVCC > 17.5V 2. INTVCC < 2.6V 3. Thermal lockout Any of these three faults will cause the LT3757 to stop switching immediately. The SS pin will be discharged by Q3. When all faults are cleared and the SS pin has been discharged below 0.2V, a 10μA current source IS2 starts charging the SS pin, initiating a soft-start operation. The soft-start interval is set by the soft-start capacitor selection according to the equation: TSS =CSS • 1.25V 10μA LT3757/LT3757A 13 3757afd Applications Information FBX Frequency Foldback When VOUT is very low during start-up or a short-circuit fault on the output, the switching regulator must operate at low duty cycles to maintain the power switch current within the current limit range, since the inductor current decay rate is very low during switch off time. The minimum on-time limitation may prevent the switcher from attaining a sufficiently low duty cycle at the programmed switching frequency. So, the switch current will keep increasing through each switch cycle, exceeding the programmed current limit. To prevent the switch peak currents from exceeding the programmed value, the LT3757 contains a frequency foldback function to reduce the switching frequency when the FBX voltage is low (see the Normalized Switching Frequency vs FBX graph in the Typical Performance Characteristics section). The typical frequency foldback waveforms are shown in the Typical Performance Characteristics section. The frequency foldback function prevents IL from exceeding the programmed limits because of the minimum on-time. During frequency foldback, external clock synchronization is disabled to prevent interference with frequency reducing operation. Thermal Lockout If LT3757 die temperature reaches 165°C (typical), the part will go into thermal lockout. The power switch will be turned off. A soft-start operation will be triggered. The part will be enabled again when the die temperature has dropped by 5°C (nominal). Loop Compensation Loop compensation determines the stability and transient performance. The LT3757/LT3757A use current mode control to regulate the output which simplifies loop compensation. The LT3757A improves the no-load to heavy load transient response, when compared to the LT3757. New internal circuits ensure that the transient from not switching to switching at high current can be made in a few cycles. The optimum values depend on the converter topology, the component values and the operating conditions (including the input voltage, load current, etc.). To compensate the feedback loop of the LT3757/LT3757A, a series resistorcapacitor network is usually connected from the VC pin to GND. Figure 1 shows the typical VC compensation network. For most applications, the capacitor should be in the range of 470pF to 22nF, and the resistor should be in the range of 5k to 50k. A small capacitor is often connected in parallel with the RC compensation network to attenuate the VC voltage ripple induced from the output voltage ripple through the internal error amplifier. The parallel capacitor usually ranges in value from 10pF to 100pF. A practical approach to design the compensation network is to start with one of the circuits in this data sheet that is similar to your application, and tune the compensation network to optimize the performance. Stability should then be checked across all operating conditions, including load current, input voltage and temperature. SENSE Pin Programming For control and protection, the LT3757 measures the power MOSFET current by using a sense resistor (RSENSE) between GND and the MOSFET source. Figure 4 shows a typical waveform of the sense voltage (VSENSE) across the sense resistor. It is important to use Kelvin traces between the SENSE pin and RSENSE, and to place the IC GND as close as possible to the GND terminal of the RSENSE for proper operation. Figure 4. The Sense Voltage During a Switching Cycle 3757 F04 VSENSE(PEAK) ΔVSENSE = χ • VSENSE(MAX) VSENSE DT t S VSENSE(MAX) TS LT3757/LT3757A 14 3757afd Applications Information Due to the current limit function of the SENSE pin, RSENSE should be selected to guarantee that the peak current sense voltage VSENSE(PEAK) during steady state normal operation is lower than the SENSE current limit threshold (see the Electrical Characteristics table). Given a 20% margin, VSENSE(PEAK) is set to be 80mV. Then, the maximum switch ripple current percentage can be calculated using the following equation: c = ΔVSENSE 80mV − 0.5 • ΔVSENSE c is used in subsequent design examples to calculate inductor value. ΔVSENSE is the ripple voltage across RSENSE. The LT3757 switching controller incorporates 100ns timing interval to blank the ringing on the current sense signal immediately after M1 is turned on. This ringing is caused by the parasitic inductance and capacitance of the PCB trace, the sense resistor, the diode, and the MOSFET. The 100ns timing interval is adequate for most of the LT3757 applications. In the applications that have very large and long ringing on the current sense signal, a small RC filter can be added to filter out the excess ringing. Figure 5 shows the RC filter on SENSE pin. It is usually sufficient to choose 22Ω for RFLT and 2.2nF to 10nF for CFLT. Keep RFLT’s resistance low. Remember that there is 65μA (typical) flowing out of the SENSE pin. Adding RFLT will affect the SENSE current limit threshold: VSENSE_ILIM = 108mV – 65μA • RFLT Application Circuits The LT3757 can be configured as different topologies. The first topology to be analyzed will be the boost converter, followed by the flyback, SEPIC and inverting converters. Boost Converter: Switch Duty Cycle and Frequency The LT3757 can be configured as a boost converter for the applications where the converter output voltage is higher than the input voltage. Remember that boost converters are not short-circuit protected. Under a shorted output condition, the inductor current is limited only by the input supply capability. For applications requiring a step-up converter that is short-circuit protected, please refer to the Applications Information section covering SEPIC converters. The conversion ratio as a function of duty cycle is VOUT VIN = 1 1−D in continuous conduction mode (CCM). For a boost converter operating in CCM, the duty cycle of the main switch can be calculated based on the output voltage (VOUT) and the input voltage (VIN). The maximum duty cycle (DMAX) occurs when the converter has the minimum input voltage: DMAX = VOUT − VIN(MIN) VOUT Discontinuous conduction mode (DCM) provides higher conversion ratios at a given frequency at the cost of reduced efficiencies and higher switching currents. Figure 5. The RC Filter on SENSE Pin CFLT 3757 F05 LT3757 RFLT RSENSE M1 SENSE GATE GND LT3757/LT3757A 15 3757afd Applications Information Boost Converter: Inductor and Sense Resistor Selection For the boost topology, the maximum average inductor current is: IL(MAX) =IO(MAX) • 1 1−DMAX Then, the ripple current can be calculated by: ΔIL = c •IL(MAX) = c •IO(MAX) • 1 1−DMAX The constant c in the preceding equation represents the percentage peak-to-peak ripple current in the inductor, relative to IL(MAX). The inductor ripple current has a direct effect on the choice of the inductor value. Choosing smaller values of ΔIL requires large inductances and reduces the current loop gain (the converter will approach voltage mode). Accepting larger values of ΔIL provides fast transient response and allows the use of low inductances, but results in higher input current ripple and greater core losses. It is recommended that c fall within the range of 0.2 to 0.6. Given an operating input voltage range, and having chosen the operating frequency and ripple current in the inductor, the inductor value of the boost converter can be determined using the following equation: L = VIN(MIN) ΔIL • f •DMAX The peak and RMS inductor current are: IL(PEAK) =IL(MAX) • 1+ c 2 IL(RMS) =IL(MAX) • 1+ c2 12 Based on these equations, the user should choose the inductors having sufficient saturation and RMS current ratings. Set the sense voltage at IL(PEAK) to be the minimum of the SENSE current limit threshold with a 20% margin. The sense resistor value can then be calculated to be: RSENSE = 80mV IL(PEAK) Boost Converter: Power MOSFET Selection Important parameters for the power MOSFET include the drain-source voltage rating (VDS), the threshold voltage (VGS(TH)), the on-resistance (RDS(ON)), the gate to source and gate to drain charges (QGS and QGD), the maximum drain current (ID(MAX)) and the MOSFET’s thermal resistances (RθJC and RθJA). The power MOSFET will see full output voltage, plus a diode forward voltage, and any additional ringing across its drain-to-source during its off-time. It is recommended to choose a MOSFET whose BVDSS is higher than VOUT by a safety margin (a 10V safety margin is usually sufficient). The power dissipated by the MOSFET in a boost converter is: PFET = I2 L(MAX) • RDS(ON) • DMAX + 2 • V2 OUT • IL(MAX) • CRSS • f /1A The first term in the preceding equation represents the conduction losses in the device, and the second term, the switching loss. CRSS is the reverse transfer capacitance, which is usually specified in the MOSFET characteristics. For maximum efficiency, RDS(ON) and CRSS should be minimized. From a known power dissipated in the power MOSFET, its junction temperature can be obtained using the following equation: TJ = TA + PFET • θJA = TA + PFET • (θJC + θCA) TJ must not exceed the MOSFET maximum junction temperature rating. It is recommended to measure the MOSFET temperature in steady state to ensure that absolute maximum ratings are not exceeded. LT3757/LT3757A 16 3757afd Applications Information Figure 6. The Output Ripple Waveform of a Boost Converter VOUT (AC) tON ΔVESR RINGING DUE TO TOTAL INDUCTANCE (BOARD + CAP) ΔVCOUT 3757 F05 tOFF Boost Converter: Output Diode Selection To maximize efficiency, a fast switching diode with low forward drop and low reverse leakage is desirable. The peak reverse voltage that the diode must withstand is equal to the regulator output voltage plus any additional ringing across its anode-to-cathode during the on-time. The average forward current in normal operation is equal to the output current, and the peak current is equal to: ID(PEAK) =IL(PEAK) = 1+ c 2 •IL(MAX) It is recommended that the peak repetitive reverse voltage rating VRRM is higher than VOUT by a safety margin (a 10V safety margin is usually sufficient). The power dissipated by the diode is: PD = IO(MAX) • VD and the diode junction temperature is: TJ = TA + PD • RθJA The RθJA to be used in this equation normally includes the RθJC for the device plus the thermal resistance from the board to the ambient temperature in the enclosure. TJ must not exceed the diode maximum junction temperature rating. Boost Converter: Output Capacitor Selection Contributions of ESR (equivalent series resistance), ESL (equivalent series inductance) and the bulk capacitance must be considered when choosing the correct output capacitors for a given output ripple voltage. The effect of The choice of component(s) begins with the maximum acceptable ripple voltage (expressed as a percentage of the output voltage), and how this ripple should be divided between the ESR step ΔVESR and the charging/discharging ΔVCOUT. For the purpose of simplicity, we will choose 2% for the maximum output ripple, to be divided equally between ΔVESR and ΔVCOUT. This percentage ripple will change, depending on the requirements of the application, and the following equations can easily be modified. For a 1% contribution to the total ripple voltage, the ESR of the output capacitor can be determined using the following equation: ESRCOUT ≤ 0.01• VOUT ID(PEAK) these three parameters (ESR, ESL and bulk C) on the output voltage ripple waveform for a typical boost converter is illustrated in Figure 6. LT3757/LT3757A 17 3757afd Applications Information For the bulk C component, which also contributes 1% to the total ripple: COUT ≥ IO(MAX) 0.01• VOUT • f The output capacitor in a boost regulator experiences high RMS ripple currents, as shown in Figure 6. The RMS ripple current rating of the output capacitor can be determined using the following equation: IRMS(COUT) ≥IO(MAX) • DMAX 1−DMAX Multiple capacitors are often paralleled to meet ESR requirements. Typically, once the ESR requirement is satisfied, the capacitance is adequate for filtering and has the required RMS current rating. Additional ceramic capacitors in parallel are commonly used to reduce the effect of parasitic inductance in the output capacitor, which reduces high frequency switching noise on the converter output. Boost Converter: Input Capacitor Selection The input capacitor of a boost converter is less critical than the output capacitor, due to the fact that the inductor is in series with the input, and the input current waveform is continuous. The input voltage source impedance determines the size of the input capacitor, which is typically in the range of 10μF to 100μF. A low ESR capacitor is recommended, although it is not as critical as for the output capacitor. The RMS input capacitor ripple current for a boost converter is: IRMS(CIN) = 0.3 • ΔIL Flyback Converter Applications The LT3757 can be configured as a flyback converter for the applications where the converters have multiple outputs, high output voltages or isolated outputs. Figure 7 shows a simplified flyback converter. The flyback converter has a very low parts count for multiple outputs, and with prudent selection of turns ratio, can have high output/input voltage conversion ratios with a desirable duty cycle. However, it has low efficiency due to the high peak currents, high peak voltages and consequent power loss. The flyback converter is commonly used for an output power of less than 50W. The flyback converter can be designed to operate either in continuous or discontinuous mode. Compared to continuous mode, discontinuous mode has the advantage of smaller transformer inductances and easy loop compensation, and the disadvantage of higher peak-to-average current and lower efficiency. In the high output voltage applications, the flyback converters can be designed to operate in discontinuous mode to avoid using large transformers. Figure 7. A Simplified Flyback Converter RSENSE NP:NS VIN CIN CSN VSN LP D SUGGESTED RCD SNUBBER ID ISW VDS 3757 F06 GATE GND LT3757 SENSE LS M + – + – RSN DSN – + + COUT + LT3757/LT3757A 18 3757afd Applications Information Flyback Converter: Switch Duty Cycle and Turns Ratio The flyback converter conversion ratio in the continuous mode operation is: VOUT VIN = NS NP • D 1−D where NS/NP is the second to primary turns ratio. Figure 8 shows the waveforms of the flyback converter in discontinuous mode operation. During each switching period TS, three subintervals occur: DTS, D2TS, D3TS. During DTS, M is on, and D is reverse-biased. During D2TS, M is off, and LS is conducting current. Both LP and LS currents are zero during D3TS. The flyback converter conversion ratio in the discontinuous mode operation is: VOUT VIN = NS NP • D D2 According to the preceding equations, the user has relative freedom in selecting the switch duty cycle or turns ratio to suit a given application. The selections of the duty cycle and the turns ratio are somewhat iterative processes, due to the number of variables involved. The user can choose either a duty cycle or a turns ratio as the start point. The following trade-offs should be considered when selecting the switch duty cycle or turns ratio, to optimize the converter performance. A higher duty cycle affects the flyback converter in the following aspects: • Lower MOSFET RMS current ISW(RMS), but higher MOSFET VDS peak voltage • Lower diode peak reverse voltage, but higher diode RMS current ID(RMS) • Higher transformer turns ratio (NP/NS) The choice, D D+D2 = 1 3 (for discontinuous mode operation with a given D3) gives the power MOSFET the lowest power stress (the product of RMS current and peak voltage). However, in the high output voltage applications, a higher duty cycle may be adopted to limit the large peak reverse voltage of the diode. The choice, D D+D2 = 2 3 (for discontinuous mode operation with a given D3) gives the diode the lowest power stress (the product of RMS current and peak voltage). An extreme high or low duty cycle results in high power stress on the MOSFET or diode, and reduces efficiency. It is recommended to choose a duty cycle, D, between 20% and 80%. Figure 8. Waveforms of the Flyback Converter in Discontinuous Mode Operation 3757 F07 ISW VDS ID DTS D2TS D3TS t ISW(MAX) ID(MAX) TS LT3757/LT3757A 19 3757afd Applications Information Flyback Converter: Transformer Design for Discontinuous Mode Operation The transformer design for discontinuous mode of operation is chosen as presented here. According to Figure 8, the minimum D3 (D3MIN) occurs when the converter has the minimum VIN and the maximum output power (POUT). Choose D3MIN to be equal to or higher than 10% to guarantee the converter is always in discontinuous mode operation (choosing higher D3 allows the use of low inductances, but results in a higher switch peak current). The user can choose a DMAX as the start point. Then, the maximum average primary currents can be calculated by the following equation: ILP(MAX) =ISW(MAX) = POUT(MAX) DMAX • VIN(MIN) • h where h is the converter efficiency. If the flyback converter has multiple outputs, POUT(MAX) is the sum of all the output power. The maximum average secondary current is: ILS(MAX) =ID(MAX) = IOUT(MAX) D2 where: D2 = 1 – DMAX – D3 the primary and secondary RMS currents are: ILP(RMS) = 2 •ILP(MAX) • DMAX 3 ILS(RMS) = 2 •ILS(MAX) • D2 3 According to Figure 8, the primary and secondary peak currents are: ILP(PEAK) = ISW(PEAK) = 2 • ILP(MAX) ILS(PEAK) = ID(PEAK) = 2 • ILS(MAX) The primary and second inductor values of the flyback converter transformer can be determined using the following equations: LP = D2 MAX • V2 IN(MIN) • h 2 • POUT(MAX) • f LS = D22 • (VOUT + VD) 2 • IOUT(MAX) • f The primary to second turns ratio is: NP NS = LP LS Flyback Converter: Snubber Design Transformer leakage inductance (on either the primary or secondary) causes a voltage spike to occur after the MOSFET turn-off. This is increasingly prominent at higher load currents, where more stored energy must be dissipated. In some cases a snubber circuit will be required to avoid overvoltage breakdown at the MOSFET’s drain node. There are different snubber circuits, and Application Note 19 is a good reference on snubber design. An RCD snubber is shown in Figure 7. The snubber resistor value (RSN) can be calculated by the following equation: RSN = 2 • V2 SN − VSN • VOUT • NP NS I2 SW(PEAK) •LLK • f LT3757/LT3757A 20 3757afd Applications Information where VSN is the snubber capacitor voltage. A smaller VSN results in a larger snubber loss. A reasonable VSN is 2 to 2.5 times of: VOUT •NP NS LLK is the leakage inductance of the primary winding, which is usually specified in the transformer characteristics. LLK can be obtained by measuring the primary inductance with the secondary windings shorted. The snubber capacitor value (CCN) can be determined using the following equation: CCN = VSN ΔVSN •RCN • f where ΔVSN is the voltage ripple across CCN. A reasonable ΔVSN is 5% to 10% of VSN. The reverse voltage rating of DSN should be higher than the sum of VSN and VIN(MAX). Flyback Converter: Sense Resistor Selection In a flyback converter, when the power switch is turned on, the current flowing through the sense resistor (ISENSE) is: ISENSE = ILP Set the sense voltage at ILP(PEAK) to be the minimum of the SENSE current limit threshold with a 20% margin. The sense resistor value can then be calculated to be: RSENSE = 80mV ILP(PEAK) Flyback Converter: Power MOSFET Selection For the flyback configuration, the MOSFET is selected with a VDC rating high enough to handle the maximum VIN, the reflected secondary voltage and the voltage spike due to the leakage inductance. Approximate the required MOSFET VDC rating using: BVDSS > VDS(PEAK) where: VDS(PEAK) = VIN(MAX) + VSN The power dissipated by the MOSFET in a flyback converter is: PFET = I2 M(RMS) • RDS(ON) + 2 • V2 DS(PEAK) • IL(MAX) • CRSS • f /1A The first term in this equation represents the conduction losses in the device, and the second term, the switching loss. CRSS is the reverse transfer capacitance, which is usually specified in the MOSFET characteristics. From a known power dissipated in the power MOSFET, its junction temperature can be obtained using the following equation: TJ = TA + PFET • θJA = TA + PFET • (θJC + θCA) TJ must not exceed the MOSFET maximum junction temperature rating. It is recommended to measure the MOSFET temperature in steady state to ensure that absolute maximum ratings are not exceeded. LT3757/LT3757A 21 3757afd Applications Information Flyback Converter: Output Diode Selection The output diode in a flyback converter is subject to large RMS current and peak reverse voltage stresses. A fast switching diode with a low forward drop and a low reverse leakage is desired. Schottky diodes are recommended if the output voltage is below 100V. Approximate the required peak repetitive reverse voltage rating VRRM using: VRRM > NS NP • VIN(MAX) + VOUT The power dissipated by the diode is: PD = IO(MAX) • VD and the diode junction temperature is: TJ = TA + PD • RθJA The RθJA to be used in this equation normally includes the RθJC for the device, plus the thermal resistance from the board to the ambient temperature in the enclosure. TJ must not exceed the diode maximum junction temperature rating. Flyback Converter: Output Capacitor Selection The output capacitor of the flyback converter has a similar operation condition as that of the boost converter. Refer to the Boost Converter: Output Capacitor Selection section for the calculation of COUT and ESRCOUT. The RMS ripple current rating of the output capacitors in discontinuous operation can be determined using the following equation: IRMS(COUT),DISCONTINUOUS ≥ IO(MAX) • 4 − (3 •D2) 3 •D2 Flyback Converter: Input Capacitor Selection The input capacitor in a flyback converter is subject to a large RMS current due to the discontinuous primary current. To prevent large voltage transients, use a low ESR input capacitor sized for the maximum RMS current. The RMS ripple current rating of the input capacitors in discontinuous operation can be determined using the following equation: IRMS(CIN),DISCONTINUOUS ≥ POUT(MAX) VIN(MIN) • h • 4 − (3 •DMAX ) 3 •DMAX SEPIC Converter Applications The LT3757 can be configured as a SEPIC (single-ended primary inductance converter), as shown in Figure 1. This topology allows for the input to be higher, equal, or lower than the desired output voltage. The conversion ratio as a function of duty cycle is: VOUT + VD VIN = D 1−D in continuous conduction mode (CCM). In a SEPIC converter, no DC path exists between the input and output. This is an advantage over the boost converter for applications requiring the output to be disconnected from the input source when the circuit is in shutdown. Compared to the flyback converter, the SEPIC converter has the advantage that both the power MOSFET and the output diode voltages are clamped by the capacitors (CIN, CDC and COUT), therefore, there is less voltage ringing across the power MOSFET and the output diodes. The SEPIC converter requires much smaller input capacitors than those of the flyback converter. This is due to the fact that, in the SEPIC converter, the inductor L1 is in series with the input, and the ripple current flowing through the input capacitor is continuous. LT3757/LT3757A 22 3757afd Applications Information Figure 9. The Switch Current Waveform of the SEPIC Converter 3757 F08 ΔISW = χ • ISW(MAX) ISW DT t S ISW(MAX) TS SEPIC Converter: Switch Duty Cycle and Frequency For a SEPIC converter operating in CCM, the duty cycle of the main switch can be calculated based on the output voltage (VOUT), the input voltage (VIN) and the diode forward voltage (VD). The maximum duty cycle (DMAX) occurs when the converter has the minimum input voltage: DMAX = VOUT + VD VIN(MIN) + VOUT + VD SEPIC Converter: Inductor and Sense Resistor Selection As shown in Figure 1, the SEPIC converter contains two inductors: L1 and L2. L1 and L2 can be independent, but can also be wound on the same core, since identical voltages are applied to L1 and L2 throughout the switching cycle. For the SEPIC topology, the current through L1 is the converter input current. Based on the fact that, ideally, the output power is equal to the input power, the maximum average inductor currents of L1 and L2 are: IL1(MAX) = IIN(MAX) = IO(MAX) • DMAX 1− DMAX IL2(MAX) = IO(MAX) In a SEPIC converter, the switch current is equal to IL1 + IL2 when the power switch is on, therefore, the maximum average switch current is defined as: ISW(MAX) =IL1(MAX) +IL2(MAX) =IO(MAX) • 1 1−DMAX and the peak switch current is: ISW(PEAK) = 1+ c 2 •IO(MAX) • 1 1−DMAX The constant c in the preceding equations represents the percentage peak-to-peak ripple current in the switch, relative to ISW(MAX), as shown in Figure 9. Then, the switch ripple current ΔISW can be calculated by: ΔISW = c • ISW(MAX) The inductor ripple currents ΔIL1 and ΔIL2 are identical: ΔIL1 = ΔIL2 = 0.5 • ΔISW The inductor ripple current has a direct effect on the choice of the inductor value. Choosing smaller values of ΔIL requires large inductances and reduces the current loop gain (the converter will approach voltage mode). Accepting larger values of ΔIL allows the use of low inductances, but results in higher input current ripple and greater core losses. It is recommended that c falls in the range of 0.2 to 0.4. LT3757/LT3757A 23 3757afd Given an operating input voltage range, and having chosen the operating frequency and ripple current in the inductor, the inductor value (L1 and L2 are independent) of the SEPIC converter can be determined using the following equation: L1=L2 = VIN(MIN) 0.5 • ΔISW • f •DMAX For most SEPIC applications, the equal inductor values will fall in the range of 1μH to 100μH. By making L1 = L2, and winding them on the same core, the value of inductance in the preceding equation is replaced by 2L, due to mutual inductance: L = VIN(MIN) ΔISW • f •DMAX This maintains the same ripple current and energy storage in the inductors. The peak inductor currents are: IL1(PEAK) = IL1(MAX) + 0.5 • ΔIL1 IL2(PEAK) = IL2(MAX) + 0.5 • ΔIL2 The RMS inductor currents are: IL1(RMS) =IL1(MAX) • 1+ c2 L1 12 where: cL1 = ΔIL1 IL1(MAX) IL2(RMS) =IL2(MAX) • 1+ c2 L2 12 where: cL2 = ΔIL2 IL2 (MAX) Based on the preceding equations, the user should choose the inductors having sufficient saturation and RMS current ratings. In a SEPIC converter, when the power switch is turned on, the current flowing through the sense resistor (ISENSE) is the switch current. Set the sense voltage at ISENSE(PEAK) to be the minimum of the SENSE current limit threshold with a 20% margin. The sense resistor value can then be calculated to be: RSENSE = 80mV ISW(PEAK) SEPIC Converter: Power MOSFET Selection For the SEPIC configuration, choose a MOSFET with a VDC rating higher than the sum of the output voltage and input voltage by a safety margin (a 10V safety margin is usually sufficient). The power dissipated by the MOSFET in a SEPIC converter is: PFET = I2 SW(MAX) • RDS(ON) • DMAX + 2 • (VIN(MIN) + VOUT)2 • IL(MAX) • CRSS • f /1A The first term in this equation represents the conduction losses in the device, and the second term, the switching loss. CRSS is the reverse transfer capacitance, which is usually specified in the MOSFET characteristics. For maximum efficiency, RDS(ON) and CRSS should be minimized. From a known power dissipated in the power MOSFET, its junction temperature can be obtained using the following equation: TJ = TA + PFET • θJA = TA + PFET • (θJC + θCA) TJ must not exceed the MOSFET maximum junction temperature rating. It is recommended to measure the MOSFET temperature in steady state to ensure that absolute maximum ratings are not exceeded. Applications Information LT3757/LT3757A 24 3757afd Applications Information Figure 10. A Simplified Inverting Converter RSENSE CDC VIN CIN L1 D1 COUT VOUT 3757 F09 GATE + GND LT3757 SENSE L2 M1 + – + – + SEPIC Converter: Output Diode Selection To maximize efficiency, a fast switching diode with a low forward drop and low reverse leakage is desirable. The average forward current in normal operation is equal to the output current, and the peak current is equal to: ID(PEAK) = 1+ c 2 •IO(MAX) • 1 1−DMAX It is recommended that the peak repetitive reverse voltage rating VRRM is higher than VOUT + VIN(MAX) by a safety margin (a 10V safety margin is usually sufficient). The power dissipated by the diode is: PD = IO(MAX) • VD and the diode junction temperature is: TJ = TA + PD • RθJA The RθJA used in this equation normally includes the RθJC for the device, plus the thermal resistance from the board, to the ambient temperature in the enclosure. TJ must not exceed the diode maximum junction temperature rating. SEPIC Converter: Output and Input Capacitor Selection The selections of the output and input capacitors of the SEPIC converter are similar to those of the boost converter. Please refer to the Boost Converter, Output Capacitor Selection and Boost Converter, Input Capacitor Selection sections. SEPIC Converter: Selecting the DC Coupling Capacitor The DC voltage rating of the DC coupling capacitor (CDC, as shown in Figure 1) should be larger than the maximum input voltage: VCDC > VIN(MAX) CDC has nearly a rectangular current waveform. During the switch off-time, the current through CDC is IIN, while approximately –IO flows during the on-time. The RMS rating of the coupling capacitor is determined by the following equation: IRMS(CDC) > IO(MAX) • VOUT + VD VIN(MIN) A low ESR and ESL, X5R or X7R ceramic capacitor works well for CDC. Inverting Converter Applications The LT3757 can be configured as a dual-inductor inverting topology, as shown in Figure 10. The VOUT to VIN ratio is: VOUT − VD VIN = − D 1−D in continuous conduction mode (CCM). LT3757/LT3757A 25 3757afd Inverting Converter: Switch Duty Cycle and Frequency For an inverting converter operating in CCM, the duty cycle of the main switch can be calculated based on the negative output voltage (VOUT) and the input voltage (VIN). The maximum duty cycle (DMAX) occurs when the converter has the minimum input voltage: DMAX = VOUT − VD VOUT − VD − VIN(MIN) Inverting Converter: Inductor, Sense Resistor, Power MOSFET, Output Diode and Input Capacitor Selections The selections of the inductor, sense resistor, power MOSFET, output diode and input capacitor of an inverting converter are similar to those of the SEPIC converter. Please refer to the corresponding SEPIC converter sections. Inverting Converter: Output Capacitor Selection The inverting converter requires much smaller output capacitors than those of the boost, flyback and SEPIC converters for similar output ripples. This is due to the fact that, in the inverting converter, the inductor L2 is in series with the output, and the ripple current flowing through the output capacitors are continuous. The output ripple voltage is produced by the ripple current of L2 flowing through the ESR and bulk capacitance of the output capacitor: ΔVOUT(P–P) = ΔIL2 • ESRCOUT + 1 8 • f •COUT After specifying the maximum output ripple, the user can select the output capacitors according to the preceding equation. The ESR can be minimized by using high quality X5R or X7R dielectric ceramic capacitors. In many applications, ceramic capacitors are sufficient to limit the output voltage ripple. The RMS ripple current rating of the output capacitor needs to be greater than: IRMS(COUT) > 0.3 • ΔIL2 Inverting Converter: Selecting the DC Coupling Capacitor The DC voltage rating of the DC coupling capacitor (CDC, as shown in Figure 10) should be larger than the maximum input voltage minus the output voltage (negative voltage): VCDC > VIN(MAX) – VOUT CDC has nearly a rectangular current waveform. During the switch off-time, the current through CDC is IIN, while approximately –IO flows during the on-time. The RMS rating of the coupling capacitor is determined by the following equation: IRMS(CDC) >IO(MAX) • DMAX 1−DMAX A low ESR and ESL, X5R or X7R ceramic capacitor works well for CDC. Applications Information LT3757/LT3757A 26 3757afd Applications Information Figure 11. 8V to 16V Input, 24V/2A Output Boost Converter Suggested Layout VIN 3757 F10 VOUT L1 VIAS TO GROUND PLANE C D1 COUT2 OUT1 1 2 8 7 3 4 6 5 M1 CIN R4 RC R1 R2 RSS RT R3 CVCC CC1 CC2 LT3757 1 2 3 4 5 9 10 6 7 8 RS Board Layout The high speed operation of the LT3757 demands careful attention to board layout and component placement. The Exposed Pad of the package is the only GND terminal of the IC, and is important for thermal management of the IC. Therefore, it is crucial to achieve a good electrical and thermal contact between the Exposed Pad and the ground plane of the board. For the LT3757 to deliver its full output power, it is imperative that a good thermal path be provided to dissipate the heat generated within the package. It is recommended that multiple vias in the printed circuit board be used to conduct heat away from the IC and into a copper plane with as much area as possible. To prevent radiation and high frequency resonance problems, proper layout of the components connected to the IC is essential, especially the power paths with higher di/ dt. The following high di/dt loops of different topologies should be kept as tight as possible to reduce inductive ringing: • In boost configuration, the high di/dt loop contains the output capacitor, the sensing resistor, the power MOSFET and the Schottky diode. • In flyback configuration, the high di/dt primary loop contains the input capacitor, the primary winding, the power MOSFET and the sensing resistor. The high di/ dt secondary loop contains the output capacitor, the secondary winding and the output diode. • In SEPIC configuration, the high di/dt loop contains the power MOSFET, sense resistor, output capacitor, Schottky diode and the coupling capacitor. • In inverting configuration, the high di/dt loop contains power MOSFET, sense resistor, Schottky diode and the coupling capacitor. LT3757/LT3757A 27 3757afd Table 2. Recommended Component Manufacturers VENDOR COMPONENTS WEB ADDRESS AVX Capacitors avx.com BH Electronics Inductors, Transformers bhelectronics.com Coilcraft Inductors coilcraft.com Cooper Bussmann Inductors bussmann.com Diodes, Inc Diodes diodes.com Fairchild MOSFETs fairchildsemi.com General Semiconductor Diodes generalsemiconductor.com International Rectifier MOSFETs, Diodes irf.com IRC Sense Resistors irctt.com Kemet Capacitors kemet.com Magnetics Inc Toroid Cores mag-inc.com Microsemi Diodes microsemi.com Murata-Erie Inductors, Capacitors murata.co.jp Nichicon Capacitors nichicon.com On Semiconductor Diodes onsemi.com Panasonic Capacitors panasonic.com Sanyo Capacitors sanyo.co.jp Sumida Inductors sumida.com Taiyo Yuden Capacitors t-yuden.com TDK Capacitors, Inductors component.tdk.com Thermalloy Heat Sinks aavidthermalloy.com Tokin Capacitors nec-tokinamerica.com Toko Inductors tokoam.com United Chemi-Con Capacitors chemi-con.com Vishay/Dale Resistors vishay.com Vishay/Siliconix MOSFETs vishay.com Vishay/Sprague Capacitors vishay.com Würth Elektronik Inductors we-online.com Zetex Small-Signal Discretes zetex.com Applications Information Check the stress on the power MOSFET by measuring its drain-to-source voltage directly across the device terminals (reference the ground of a single scope probe directly to the source pad on the PC board). Beware of inductive ringing, which can exceed the maximum specified voltage rating of the MOSFET. If this ringing cannot be avoided, and exceeds the maximum rating of the device, either choose a higher voltage device or specify an avalancherated power MOSFET. The small-signal components should be placed away from high frequency switching nodes. For optimum load regulation and true remote sensing, the top of the output voltage sensing resistor divider should connect independently to the top of the output capacitor (Kelvin connection), staying away from any high dV/dt traces. Place the divider resistors near the LT3757 in order to keep the high impedance FBX node short. Figure 11 shows the suggested layout of the 8V to 16V Input, 24V/2A Output Boost Converter. Recommended Component Manufacturers Some of the recommended component manufacturers are listed in Table 2. LT3757/LT3757A 28 3757afd Typical Applications 3.3V Input, 5V/10A Output Boost Converter Boost Preregulator for Automotive Stop-Start/Idle Efficiency vs Output Current Transient VIN and VOUT Waveforms SENSE LT3757 VIN VIN 3.3V CIN 22μF 6.3V ×2 VOUT 5V 10A 0.004 1W M1 41.2k 300kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS VC 49.9k 34k 0.1μF 6.8k 22nF 2.2nF 22 L1 0.5μH D1 3757 TA02a 34k 1% 15.8k 1% COUT1 150μF 6.3V ×4 COUT2 22μF 6.3V X5R ×4 + CVCC 4.7μF 10V X5R CIN: TAIYO YUDEN JMK325BJ226MM COUT1: PANASONIC EEFUEOJ151R COUT2: TAIYO YUDEN JMK325BJ226MM D1: MBRB2515L L1: VISHAY SILICONIX IHLP-5050FD-01 M1: VISHAY SILICONIX SI4448DY OUTPUT CURRENT (A) EFFICIENCY (%) 3757 TA02b 0.001 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 SENSE LT3757A VIN VIN 3V TO 36V 10μF 50V X5R ×2 VOUT 9VMIN 2A 41.2k 300kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS VC 1M 698k 0.1μF 10k 10nF 4.7μF L1 3.3μH D1 3757 TA03a M1 75k 8m 16.2k C1 10μF 50V ×4 + 10μF 50V X5R L1: COILTRONIX DR127-3R3 M1: VISHAY SILICONIX Si7848BDP D1: VISHAY SILICONIX 50SQ04FN C1: KEMET T495X106K050A 10ms/DIV VOUT 5V/DIV VIN 5V/DIV 0V 3757 TA03b OUTPUT POWER = 10W LT3757/LT3757A 29 3757afd Typical Applications 8V to 16V Input, 24V/2A Output Boost Converter Efficiency vs Output Current Load Step Response at VIN = 12V SENSE LT3757 VIN VIN 8V TO 16V CIN 10μF 25V X5R CVCC 4.7μF 10V X5R VOUT 24V 2A RS 0.01 1W M1 RT 41.2k 300kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS VC R3 200k R4 43.2k CSS 0.1μF CC2 100pF RC 22k CC1 6.8nF L1 10μH D1 3757 TA04a R2 226k 1% R1 16.2k 1% COUT1 47μF 35V ×4 COUT2 10μF 25V X5R + CIN, COUT2: MURATA GRM31CR61E106KA12 COUT1: KEMET T495X476K035AS D1: ON SEMI MBRS340T3G L1: VISHAY SILICONIX IHLP-5050FD-01 10μH M1: VISHAY SILICONIX Si4840BDP OUTPUT CURRENT (A) 0.001 EFFICIENCY (%) 30 50 40 60 70 80 90 100 0.01 0.1 1 3757 TA04b 10 VIN = 8V VIN = 16V 500μs/DIV VOUT 500mV/DIV (AC) 1.6A 0.4A IOUT 1A/DIV 3757 TA04c LT3757/LT3757A 30 3757afd 2ms/DIV VOUT 100V/DIV 3757 TA05b 5μs/DIV VOUT 5V/DIV (AC) VSW 20V/DIV 3757 TA05c Typical Applications High Voltage Flyback Power Supply Start-Up Waveforms Switching Waveforms SENSE LT3757 VIN VSW VIN 5V TO 12V CIN 47μF 16V ×4 INTVCC COUT 68nF ×2 VOUT 350V 10mA 0.02 22 M1 140k 100kHz GATE GND FBX SHDN/UVLO DANGER! HIGH VOLTAGE OPERATION BY HIGH VOLTAGE TRAINED PERSONNEL ONLY SYNC RT SS VC • 105k • 46.4k 0.1μF 220pF 100pF 6.8k 22nF T1 1:10 D1 CIN: MURATA GRM32ER61C476K COUT: TDK C3225X7R2J683K D1: VISHAY SILICONIX GSD2004S DUAL DIODE CONNECTED IN SERIES M1: VISHAY SILICONIX Si7850DP T1: TDK DCT15EFD-U44S003 3757 TA05a 1M 1% 1M 1% 1.50M 1% 16.2k 1% 10nF CVCC 47μF 25V X5R 22 LT3757/LT3757A 31 3757afd Typical Applications 5.5V to 36V Input, 12V/2A Output SEPIC Converter Efficiency vs Output Current Load Step Waveforms Start-Up Waveforms Frequency Foldback Waveforms When Output Short-Circuits SENSE LT3757A VIN VIN 5.5V TO 36V CIN1 4.7μF 50V ×2 CDC 4.7μF 50V, X5R, ×2 4.7μF 10V X5R VOUT 12V 2A 0.01 1W M1 41.2k 300kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS CIN2 4.7μF 50V ×2 • • 105k 46.4k 0.1μF 6.8nF 10k L1A IL1B L1B D1 CIN1, CDC: TAIYO YUDEN UMK316BJ475KL CIN2: KEMET T495X475K050AS COUT1: KEMET T495X476K020AS COUT2: TAIYO YUDEN TMK432BJ106MM D1: ON SEMI MBRS360T3G L1A, L1B: COILTRONICS DRQ127-4R7 (*COUPLED INDUCTORS) M1: VISHAY SILICONIX Si7460DP 3757 TA06a 105k 1% 15.8k 1% COUT1 47μF 20V ×4 COUT2 10μF 25V X5R + VSW IL1A VC + 2ms/DIV VOUT 5V/DIV IL1A + IL1B 5A/DIV 3757 TA06d VIN = 12V 50μs/DIV VOUT 10V/DIV VSW 20V/DIV IL1A + IL1B 5A/DIV 3757 TA06e VIN = 12V OUTPUT CURRENT (A) 0.001 20 EFFICIENCY (%) 30 40 50 60 70 80 90 100 0.01 0.1 1 3757 TA06b 10 VIN = 16V VIN = 8V 500μs/DIV VOUT 2V/DIV AC-COUPLED IOUT 2A/DIV 0A 2A 3757 TA06c VIN = 12V LT3757/LT3757A 32 3757afd Typical Applications 5V to 12V Input, ±12V/0.4A Output SEPIC Converter Nonisolated Inverting SLIC Supply SENSE LT3757 VIN VIN 5V TO 12V CIN1 1μF 16V, X5R CIN2 47μF 16V CDC1 4.7μF 16V, X5R CDC2 4.7μF 16V X5R COUT2 4.7μF 16V, X5R ×3 VOUT1 12V 0.4A VOUT2 –12V 0.4A COUT2 4.7μF 16V, X5R ×3 CVCC 4.7μF 10V X5R 0.02 M1 30.9k 400kHz D1, D2: MBRS140T3 T1: COILTRONICS VP1-0076 (*PRIMARY = 4 WINDINGS IN PARALLEL) M1: SILICONIX/VISHAY Si4840BDY GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS + 105k • 46.4k 0.1μF 100pF 22k 6.8nF T1 1,2,3,4 D1 GND 1.05k 1% 158 1% D2 5 6 • • 3757 TA07 VC SENSE LT3757 VIN VIN 5V TO 16V CIN 22μF 25V, X5R ×2 C2 10μF 50V X5R D1 DFLS160 CVCC 4.7μF 10V, X5R C3 22μF 25V X5R C4 22μF 25V X5R COUT 3.3μF 100V GND C5 22μF 25V X5R VOUT1 –24V 200mA VOUT1 –72V 200mA 0.012 0.5W M1 Si7850DP 63.4k 200kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS • • • R2 • 105k R1 46.4k 0.1μF 100pF 15.8k 464k 9.1k 10nF T1 1,2,3 4 D2 DFLS160 5 D3 DFLS160 6 VP5-0155 (PRIMARY = 3 WINDINGS IN PARALLEL) 3757 TA08 VC LT3757/LT3757A 33 3757afd Package Description 3.00 ±0.10 (4 SIDES) NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.40 ± 0.10 BOTTOM VIEW—EXPOSED PAD 1.65 ± 0.10 (2 SIDES) 0.75 ±0.05 R = 0.125 TYP 2.38 ±0.10 (2 SIDES) 5 1 6 10 PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DD) DFN REV C 0310 0.25 ± 0.05 2.38 ±0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 1.65 ±0.05 2.15 ±0.05 (2 SIDES) 0.50 BSC 0.70 ±0.05 3.55 ±0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC DD Package 10-Lead Plastic DFN (3mm × 3mm) (Reference LTC DWG # 05-08-1699 Rev C) PIN 1 NOTCH R = 0.20 OR 0.35 × 45° CHAMFER LT3757/LT3757A 34 3757afd Package Description MSOP (MSE) 0911 REV H 0.53 ±0.152 (.021 ±.006) SEATING PLANE 0.18 (.007) 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.86 (.034) REF 0.50 (.0197) BSC 1 2 3 4 5 4.90 ±0.152 (.193 ±.006) 0.497 ±0.076 (.0196 ±.003) REF 10 9 8 10 1 7 6 3.00 ±0.102 (.118 ±.004) (NOTE 3) 3.00 ±0.102 (.118 ±.004) (NOTE 4) NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 0.254 (.010) 0° – 6° TYP DETAIL “A” DETAIL “A” GAUGE PLANE 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 0.889 ±0.127 (.035 ±.005) RECOMMENDED SOLDER PAD LAYOUT 1.68 ±0.102 (.066 ±.004) 1.88 ±0.102 (.074 ±.004) 0.50 (.0197) BSC 0.305 ± 0.038 (.0120 ±.0015) TYP BOTTOM VIEW OF EXPOSED PAD OPTION 1.68 (.066) 1.88 (.074) 0.1016 ±0.0508 (.004 ±.002) DETAIL “B” DETAIL “B” CORNER TAIL IS PART OF THE LEADFRAME FEATURE. FOR REFERENCE ONLY NO MEASUREMENT PURPOSE 0.05 REF 0.29 REF MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev H) LT3757/LT3757A 35 3757afd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. Revision History REV DATE DESCRIPTION PAGE NUMBER B 3/10 Deleted Bullet from Features and Last Line of Description Updated Entire Page to Add H-Grade and Military Grade Updated Electrical Characteristics Notes and Typical Performance Characteristics for H-Grade and Military Grade Revised TA04a and Replaced TA04c in Typical Applications Updated Related Parts 1 2 4 to 6 30 36 C 5/11 Revised MP-grade temperature range in Absolute Maximum Ratings and Order Information sections Revised Note 2 Revised formula in Applications Information Updated Typical Application drawing TA04a values Revised Typical Application title TA06 2 4 19 30 32 D 07/12 Added LT3757A version Throughout Updated Block Diagram 8 Updated Programming the Output Voltage section 12 Updated Loop Compensation section 13 Added an application circuit in the Typical Applications section 28 Updated the schematic and Load Step Waveforms in the Typical Applications section 31 (Revision history begins at Rev B) LT3757/LT3757A 36 3757afd Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 2008 LT 0712 REV D • PRINTED IN USA Related Parts Typical Application PART NUMBER DESCRIPTION COMMENTS LT3758A Boost, Flyback, SEPIC and Inverting Controller 5.5V ≤ VIN ≤ 100V, Current Mode Control, 100kHz to 1MHz Programmable Operation Frequency, 3mm × 3mm DFN-10 and MSOP-10E Packages LT3759 Boost, SEPIC and Inverting Controller 1.6V ≤ VIN ≤ 42V, Current Mode Control, 100kHz to 1MHz Programmable Operation Frequency, MSOP-12E Packages LT3957A Boost, Flyback, SEPIC and Inverting Controller with 5A, 40V Switch 3V ≤ VIN ≤ 40V, Current Mode Control, 100kHz to 1MHz Programmable Operation Frequency, 5mm × 6mm QFN Package LT3958 Boost, Flyback, SEPIC and Inverting Controller with 3.3A, 84V Switch 5V ≤ VIN ≤ 80V, Current Mode Control, 100kHz to 1MHz Programmable Operation Frequency, 5mm × 6mm QFN Package LT3573/LT3574/ LT3575 40V Isolated Flyback Converters Monolithic No-Opto Flybacks with Integrated 1.25A/0.65A/2.5A Switch LT3511/LT3512 100V Isolated Flyback Converters Monolithic No-Opto Flybacks with Integrated 240mA/420mA Switch LT3798 Offline Isolated No Opto-Coupler Flyback Controller with Active PFC VIN and VOUT Limited Only by External Components, MSOP-16 Package LT3799/LT3799-1 Offline Isolated Flyback LED Controllers with Active PFC VIN and VOUT Limited Only by External Components, MSOP-16 Package High Efficiency Inverting Power Supply Efficiency vs Output Current OUTPUT CURRENT (A) 0.001 10 EFFICIENCY (%) 20 30 40 50 60 70 80 90 100 0.01 0.1 1 3757 TA09b 10 VIN = 16V VIN = 5V SENSE LT3757 VIN VIN 5V TO 15V CIN 47μF 16V X5R CDC 47μF 25V, X5R VOUT –5V 3A to 5A 0.006 1W M1 Si7848BDP 41.2k 300kHz GATE FBX GND INTVCC SHDN/UVLO SYNC RT SS • R2 • 105k R1 46.4k 0.1μF 9.1k 10nF L1 L2 D1 MBRD835L L1, L2: COILTRONICS DRQ127-3R3 (*COUPLED INDUCTORS) 3757 TA09a 84.5k CVCC 16k 4.7μF 10V X5R COUT 100μF 6.3V, X5R ×2 VC Photoelectric proximity switches HGA Photoelectric proximity switches ener. Photoelectric proximity switches V Photoelectric reflex switches T W 9-2: A Versatile, Complete and Compact Series D A T A S H E E T The W 9-2 series is as versatile as the tasks in automation. The standardized, compact housing model makes it possible to use high-performance sensors that operate reliably even in cramped mounting conditions. All W 9-2 models have red light transmitters as a standard feature. The sensor can be aligned on the object quickly and precisely using the visible light spot. In the models with Teach-In function, the sensor optimizes its sensitivity automatically to the given operating conditions at the push of a button. Depending on the job, the most suitable sensor can be selected from the W 9-2 series. Overview of the sensors: WT 9-2, with adjustable background suppression, max. scanning distance 250 mm, WT 9-2, energetic, max. scanning distance 450 mm, WT 9-2, V model, max. scanning distance 20 mm, WL 9-2, basic model, max. scanning range 4 m, WL 9-2, Teach-In model, max. scanning range 4 m, WL 9-2, focus, max. scanning range 0.4 m. There are multifaceted applications in the targeted main branches thanks to this great variety of products: Storage and handling engineering Packaging industry Electronics industry Elevator construction. 2 SENSICK WT 9-2 Photoelectric Proximity Switch with Background Suppression Setting options Dimension illustration LED light source, visible red light Background suppression Scanning distance adjustable Switching frequency 1500/s Outputs short-circuit protected Scanning distance 30 ... 250 mm 12 22 40 20 3 3 1.5 1 3 2 3 18.5 10.5 11 4 5 7 Axis of the sender optics Axis of the receiver optics Mounting hole Ø 3.2 mm LED signal strength indicator Plug M 12 or M 8, 4 pin, 2 m connection cable or 120 mm cable with plug M 12, 4 pin Scanning distance adjuster Standard direction of the material to be scanned 1 2 3 4 5 Photoelectric proximity switch 6 7 WT 9-2P130 WT 9-2P430 WT 9-2N130 WT 9-2N430 4 6 Cable receptacles Adapter plate Mounting bracket Accessories Connection type L+ Q Q M brn wht blu blk 4 pin, M 12 WT 9-2P330 WT 9-2P630 WT 9-2P430 WT 9-2N430 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 8 1 L+ Q Q 4 2 3 M brn wht blu blk 4 x 0,14 mm2 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 12 with 120 mm cable WT 9-2P330 WT 9-2P130 WT 9-2N130 WT 9-2P630 Scanning distance adjustable 1) 30 ... 250 mm Scanning range 5 ... 250 mm Supply voltage VS 2) DC 10 ... 30 V Ripple 3) ≤ 5 VPP Current consumption 4) ≤ 40 mA Light source LED, visible red light 5) Light spot diameter 15 x 15 mm at a distance of 200 mm Switching outputs Q and Q– PNP NPN Signal voltage HIGH VS – 2.9 V VS Signal voltage LOW 6) Approx. 0 V ≤ 1.5 V Output current IA max. ≤ 100 mA Response time 7) ≤ 333 μs Switching frequency max. 8) 1500/s Connection technology Connection cable, 2 m Cable, 120 mm, with plug M 12, 4 pin Plug M 12, 4 pin Plug M 8, 4 pin VDE protection class M 12 9) VDE protection class M 8 9) III Protection type IP 67 Protection circuits 10) A, B, C Ambient temperature 11) Operation –40 ... +60 °C Storage –40 ... +75 °C Weight with connection cable 2 m/120 mm Approx. 80 g with equipment plug M 12/M 8, 4 pin Approx. 20 g SENSICK 3 WT 9-2 Scanning distance Ordering information Technical data WT 9-2 P130 P430 N130 N430 P330 P630 1) Object with 90% reflectance (referred to standard white DIN 5033) 2) Limit values 3) Must be within VS tolerances 4) Without load 5) Average service life at room temperature 100,000 h 6) At TU = +25 °C and 100 mA output current 7) With resistive load 8) With light/dark ratio 1:1 9) Withstand voltage 50 V 10) A = supply connections reverse polarity protected B = outputs short-circuit protected C = interference suppression 11) Do not distort cable below 0 °C Type WT 9-2P130 WT 9-2P430 WT 9-2N130 WT 9-2N430 WT 9-2P330 WT 9-2P630 Order no. 1 018 293 1 018 295 1 018 294 1 018 296 1 019 026 1 019 272 (mm) 50 100 150 200 250 30 15 20 25 10 0 5 % of scanning distance 1 3 2 WT 9-2 HGA 90%/90% 18%/90% 6%/90% Scanning range on gray, white background, Black = 6% reflectance 1 Scanning range on black ), white background, 2 White = 90% reflectance Scanning range on white, white background, Gray = 18% reflectance 3 0(mm) 50 100 150 200 250 3 1 2 Operating distance 30 150 30 220 30 250 4 SENSICK WT 9-2 Photoelectric Proximity Switch, Energetic, Teach-In Setting options Dimension illustration Red-light emitter LED as alignment aid Scanning distance adjustable Switching frequency 800/s Outputs short-circuit protected Teach-In Scanning distance 18 ... 450 mm 12 22 40 20 3 3 1.5 1 3 2 3 25.55 6.5 11 4 5 Axis of the receiver optics Axis of the sender optics Mounting hole Ø 3.2 mm LED signal strength indicator Plug M 12 or M 8, 4 pin, 2 m connection cable or 120 mm cable with plug M 12, 4 pin Scanning distance adjuster, teachable 1 2 3 4 5 Photoelectric proximity switch 6 WT 9-2P151 WT 9-2P451 WT 9-2N151 WT 9-2N451 4 6 Cable receptacles Adapter plate Mounting bracket Accessories Connection type L+ Q Q M brn wht blu blk 4 pin, M 12 WT 9-2P351 WT 9-2P651 WT 9-2P451 WT 9-2N451 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 8 1 L+ Q Q 4 2 3 M brn wht blu blk 4 x 0,14 mm2 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 12 with 120 mm cable WT 9-2P351 WT 9-2P151 WT 9-2N151 WT 9-2P651 SENSICK 5 Scanning distance adjustable 1) 10 ... 450 mm Supply voltage VS 2) DC 10 ... 30 V Ripple 3) ≤ 5 VPP Current consumption 4) ≤ 30 mA Light source LED, visible red light 5) Light spot diameter 80 x 80 mm at a distance of 500 mm Switching outputs Q and Q– PNP NPN Signal voltage HIGH VS – 2.9 V VS Signal voltage LOW6) Approx. 0 V ≤ 2.9 V Output current IA max. ≤ 100 mA Response time 7) ≤ 625 μs Switching frequency max. 8) 800/s Connection technology Connection cable, 2 m Cable, 120 mm, with plug M 12, 4 pin Plug M 12, 4 pin Plug M 8, 4 pin VDE protection class M 12 9) VDE protection class M 8 9) III Protection type IP 67 Protection circuits 10) A, B, C Ambient temperature 11) Operation –40 ... +60 °C Storage –40 ... +75 °C Weight with connection cable 2 m/120 mm Approx. 80 g with equipment plug M 12/M 8, 4 pin Approx. 20 g WT 9-2 Scanning distance Ordering information Technical data WT 9-2 P151 P451 N151 N451 P351 P651 1) Object with 90% reflectance (referred to standard white DIN 5033) 2) Limit values 3) Must be within VS tolerances 4) Without load 5) Average service life at room temperature 50,000 h 6) At TU = +25 °C and 100 mA output current 7) With resistive load 8) With light/dark ratio 1:1 9) Withstand voltage 50 V 10) A = supply connections reverse polarity protected B = outputs short-circuit protected C = interference suppression 11) Do not distort cable below 0 °C Type WT 9-2P151 WT 9-2P451 WT 9-2N151 WT 9-2N451 WT 9-2P351 WT 9-2P651 Order no. 1 018 297 1 018 299 1 018 298 1 018 300 1 019 027 1 019 273 (mm) 100 200 1000 10 100 1 300 400 500 Function reserve Operating distance Limiting scanning distance WT 9-2 energetic 3 90% 2 18% 1 6% Programming via Teach-In button. Simple programming: Position object in the beam and push the button: finished; LED confirms the Teach-In procedure. Teach-In values can be stored. Teach-In function Two operating modes: Default setting: short Teach-In time (< 8 s); for standard applications; approx. double reserve via switching threshold; LED lights continuously. Precise setting: long Teach-In time (> 8 s); for precise applications; small switching hysteresis; LED blinks. Scanning range on white, 90 % reflectance Scanning range on gray, 18% reflectance 1 Scanning range on black, 6% reflectance 2 3 0(mm) 100 200 300 400 500 1 2 3 Operating distance Limiting scanning distance 10 180 220 10/100 130 10 350 450 6 SENSICK WT 9-2 Photoelectric Proximity Switch, V-type, Teach-In Setting options Dimension illustration Red-light emitter LED as alignment aid Scanning distance adjustable Switching frequency 800/s Outputs short-circuit protected Teach-In Scanning distance 10 ... 20 mm 12 22 40 20 3 3 1.5 1 3 2 3 26.45 4.7 11 4 5 Axis of the receiver optics Axis of the receiver optics Mounting hole Ø 3.2 mm LED signal strength indicator Plug M 12 or M 8, 4 pin, 2 m connection cable or 120 mm cable with plug M 12, 4 pin Scanning distance adjuster, teachable 1 2 3 4 5 Photoelectric proximity switch 6 WT 9-2P141 WT 9-2P441 WT 9-2N141 WT 9-2N441 4 6 Cable receptacles Adapter plate Mounting bracket Accessories Connection type L+ Q Q M brn wht blu blk 4 pin, M 12 WT 9-2P341 WT 9-2P641 WT 9-2P441 WT 9-2N441 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 8 1 L+ Q Q 4 2 3 M brn wht blu blk 4 x 0,14 mm2 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 12 with 120 mm cable WT 9-2P341 WT 9-2P141 WT 9-2N141 WT 9-2P641 SENSICK 7 Scanning distance adjustable 1) 10 ... 20 mm Supply voltage VS 2) DC 10 ... 30 V Ripple 3) ≤ 5 VPP Current consumption 4) ≤ 30 mA Light source LED, visible red light 5) Light spot diameter 3 mm at a distance of 20 mm Switching outputs Q and Q– PNP NPN Signal voltage HIGH VS – 2.9 V VS Signal voltage LOW6) Approx. 0 V ≤ 2.9 V Output current IA max. ≤ 100 mA Response time 7) ≤ 625 μs Switching frequency max. 8) 800/s Connection technology Connection cable, 2 m Cable, 120 mm, with plug M 12, 4 pin Plug M 12, 4 pin Plug M 8, 4 pin VDE protection class M 12 9) VDE protection class M 8 9) III Protection type IP 67 Protection circuits 10) A, B, C Ambient temperature 11) Operation –40 ... +60 °C Storage –40 ... +75 °C Weight with connection cable 2 m/120 mm Approx. 80 g with equipment plug M 12/M 8, 4 pin Approx. 20 g WT 9-2 Scanning distance Ordering information Technical data WT 9-2 P141 P441 N141 N441 P341 P641 1) Object with 90% reflectance (referred to standard white DIN 5033) 2) Limit values 3) Must be within VS tolerances 4) Without load 5) Average service life at room temperature 100,000 h 6) At TU = +25 °C and 100 mA output current 7) With resistive load 8) With light/dark ratio 1:1 9) Withstand voltage 50 V 10) A = supply connections reverse polarity protected B = outputs short-circuit protected C = interference suppression 11) Do not distort cable below 0 °C Type WT 9-2P141 WT 9-2P441 WT 9-2N141 WT 9-2N441 WT 9-2P341 WT 9-2P641 Order no. 1 018 301 1 018 303 1 018 302 1 018 304 1 019 274 1 019 275 Programming via Teach-In button. Simple programming: Position object in the beam and push the button: finished; LED confirms the Teach-In procedure. Teach-In values can be stored. Teach-In function Two operating modes: Default setting: short Teach-In time (< 8 s); for standard applications; approx. double reserve via switching threshold; LED lights continuously. Precise setting: long Teach-In time (> 8 s); for precise applications; small switching hysteresis; LED blinks. (mm) 4 1 10 100 8 12 16 20 24 28 Function reserve 1 3 2 6% 18% 90% Operating distance WT 9-2 0(mm) 10 20 30 1 2 3 Scanning distance 10 22 10 20 10 24 Scanning range on white, 90 % reflectance Scanning range on gray, 18% reflectance 1 Scanning range on black, 6% reflectance 2 3 8 SENSICK WL 9-2 Photoelectric Reflex Switch, Standard Without setting options Dimension illustration Red-light emitter LED as alignment aid Switching frequency 800/s Outputs short-circuit protected Scanning range 0 ... 4 m 12 22 40 20 3 3 1.5 1 2 2 29.5 11 3 4 Middle of optic axis Mounting hole Ø 3.2 mm LED signal strength indicator Plug M 12 or M 8, 4 pin, 2 m connection cable or 120 mm cable with plug M 12, 4 pin 1 2 3 4 Photoelectric reflex switch WL 9-2P130 WL 9-2P430 WL 9-2N130 WL 9-2N430 3 Cable receptacles Adapter plate Mounting bracket Reflectors Accessories Connection type L+ Q Q M brn wht blu blk 4 pin, M 12 WT 9-2P330 WT 9-2P630 WT 9-2P430 WT 9-2N430 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 8 1 L+ Q Q 4 2 3 M brn wht blu blk 4 x 0,14 mm2 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 12 with 120 mm cable WT 9-2P330 WT 9-2P130 WT 9-2N130 WT 9-2P630 SENSICK 9 Scanning range typ. max./on reflector 4 m/PL 80 A Supply voltage VS 1) DC 10 ... 30 V Ripple 2) ≤ 5 VPP Current consumption 3) ≤ 30 mA Light source LED, visible red light 4) Angle of dispersion 2.5° Light spot diameter 120 x 120 mm at a distance of 3 m Switching outputs Q and Q– PNP NPN Signal voltage HIGH VS – 2.9 V VS Signal voltage LOW5) Approx. 0 V ≤ 2.9 V Output current IA max. ≤ 100 mA Response time 6) ≤ 625 μs Max. switching frequency 7) 800/s Connection technology Connection cable, 2 m Cable, 120 mm, with plug M 12, 4 pin Plug M 12, 4 pin Plug M 8, 4 pin VDE protection class M 12 8) VDE protection class M 8 8) III Protection type IP 67 Protection circuits 9) A, B, C Ambient temperature 10) Operation –40 ... +60 °C Storage –40 ... +75 °C Weight with connection cable 2 m/120 mm Approx. 80 g with equipment plug M 12/M 8, 4 pin Approx. 20 g WL 9-2 Scanning range Ordering information Technical data WL 9-2 P130 P430 N130 N430 P330 P630 1) Limit values 2) Must be within VS tolerances 3) Without load 4) Average service life at room temperature 100,000 h 5) At TU = +25 °C and 100 mA output current 6) With resistive load 7) With light/dark ratio 1:1 8) Withstand voltage 50 V 19) A = supply connections reverse polarity protected B = outputs short-circuit protected C = interference suppression 10) Do not distort cable below 0 °C Type WL 9-2P130 WL 9-2P430 WL 9-2N130 WL 9-2N430 WL 9-2P330 WL 9-2P630 Order no. 1 018 281 1 018 283 1 018 282 1 018 284 1 019 024 1 019 268 (m) 1 2 3 4 5 100 10 1 Function reserve 1 3 2 Operating range WL 9-2 Limiting scanning range 0(m) 1 2 3 4 5 1 2 3 Operating range Scanning range typ. max. 0 3.0 4.0 0 2.0 3.0 0 0.6/1.0 Reflective tape 0 ... 0.6 m Diamond Grade* 3 2 PL 40 A 0 ... 2 m 1 PL 80 A 0 ... 3 m Reflector type Operating range * 100 x 100 mm2 10 SENSICK WL 9-2 Photoelectric Reflex Switch, Standard, Teach-In Setting options Dimension illustration Red-light emitter LED as alignment aid Switching frequency 800/s Outputs short-circuit protected Teach-In Scanning range 0 ... 4 m 12 22 40 20 3 3 1.5 1 2 2 29.5 11 3 4 Middle of optic axis Mounting hole Ø 3.2 mm LED signal strength indicator Plug M 12 or M 8, 4 pin, 2 m connection cable or 120 mm cable with plug M 12, 4 pin Sensitivity control, teachable 1 2 3 4 5 Photoelectric reflex switch WL 9-2P131 WL 9-2P431 WL 9-2N131 WL 9-2N431 3 5 Cable receptacles Adapter plate Mounting bracket Reflectors Accessories Connection type L+ Q Q M brn wht blu blk 4 pin, M 12 WT 9-2P331 WT 9-2P631 WT 9-2P431 WT 9-2N431 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 8 1 L+ Q Q 4 2 3 M brn wht blu blk 4 x 0,14 mm2 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 12 with 120 mm cable WT 9-2P331 WT 9-2P131 WT 9-2N131 WT 9-2P631 SENSICK 11 Scanning range typ. max./on reflector 4 m/PL 80 A Supply voltage VS 1) DC 10 ... 30 V Ripple 2) ≤ 5 VPP Current consumption 3) ≤ 30 mA Light source LED, visible red light 4) Angle of dispersion 2.5° Light spot diameter 120 x 120 mm at a distance of 3 m Switching outputs Q and Q– PNP NPN Signal voltage HIGH VS – 2.9 V VS Signal voltage LOW5) Approx. 0 V ≤ 2.9 V Output current IA max. ≤ 100 mA Response time 6) ≤ 625 μs Max. switching frequency 7) 800/s Connection technology Connection cable, 2 m Cable, 120 mm, with plug M 12, 4 pin Plug M 12, 4 pin Plug M 8, 4 pin VDE protection class M 12 8) VDE protection class M 8 8) III Protection type IP 67 Protection circuits 9) A, B, C Ambient temperature 10) Operation –40 ... +60 °C Storage –40 ... +75 °C Weight with connection cable 2 m/120 mm Approx. 80 g with equipment plug M 12/M 8, 4 pin Approx. 20 g WL 9-2 Scanning range Ordering information Technical data WL 9-2 P131 P431 N131 N431 P331 P631 1) Limit values 2) Must be within VS tolerances 3) Without load 4) Average service life at room temperature 100,000 h 5) At TU = +25 °C and 100 mA output current 6) With resistive load 7) With light/dark ratio 1:1 8) Withstand voltage 50 V 19) A = supply connections reverse polarity protected B = outputs short-circuit protected C = interference suppreasion 10) Do not distort cable below 0 °C Type WL 9-2P131 WL 9-2P431 WL 9-2N131 WL 9-2N431 WL 9-2P331 WL 9-2P631 Order no. 1 018 285 1 018 287 1 018 286 1 018 288 1 019 025 1 019 269 Programming via Teach-In button. Simple programming: Position reflector in the beam and push the button: finished; LED confirms the Teach-In procedure. Teach-In values can be stored. Teach-In function Two operating modes: Default setting: short Teach-In time (< 8 s); for standard applications; approx. double reserve via switching threshold; LED lights continuously. Precise setting: long Teach-In time (> 8 s); for precise applications; small switching hysteresis; LED blinks. (m) 1 2 3 4 5 100 10 1 Function reserve 1 3 2 Operating range WL 9-2 Limiting scanning range 0(m) 1 2 3 4 5 1 2 3 Operating range Scanning range typ. max. 0 3.0 4.0 0 2.0 3.0 0 0.6/1.0 Reflective tape 0 ... 0.6 m Diamond Grade* 3 2 PL 40 A 0 ... 2 m 1 PL 80 A 0 ... 3 m Reflector type Operating range * 100 x 100 mm2 12 SENSICK WL 9-2 Photoelectric Reflex Switch, Focus 35 mm, Teach-In Setting options Dimension illustration LED light source, visible red light Sensitivity adjustment using the Teach-In method Switching frequency 800/s Outputs short-circuit protected Scanning range 0 ... 0.4 m 12 22 40 20 3 3 1.5 1 2 2 29.5 11 3 4 Middle of optic axis Mounting hole Ø 3.2 mm LED signal strength indicator Plug M 12 or M 8, 4 pin, 2 m connection cable or 120 mm cable with plug M 12, 4 pin Sensitivity control, teachable 1 2 3 4 5 Photoelectric reflex switch WL 9-2P121 WL 9-2P421 WL 9-2N121 WL 9-2N421 3 5 Cable receptacles Adapter plate Mounting bracket Reflectors Accessories Connection type L+ Q Q M brn wht blu blk 4 pin, M 12 WT 9-2P321 WT 9-2P621 WT 9-2P421 WT 9-2N421 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 8 1 L+ Q Q 4 2 3 M brn wht blu blk 4 x 0,14 mm2 1 L+ Q Q 4 2 3 M brn wht blu blk 4 pin, M 12 with 120 mm cable WT 9-2P321 WT 9-2P121 WT 9-2N121 WT 9-2P621 SENSICK 13 Scanning range typ. max./on reflector 0.4 m/PL 80 A Supply voltage VS 1) DC 10 ... 30 V Ripple 2) ≤ 5 VPP Current consumption 3) ≤ 30 mA Light source LED, visible red light 4) Light spot diameter 1.5 x 1.5 mm at a distance of 35 mm Switching outputs Q and Q– PNP NPN Signal voltage HIGH VS – 2.9 V VS Signal voltage LOW5) Approx. 0 V ≤ 2.9 V Output current IA max. ≤ 100 mA Response time 6) ≤ 625 μs Max. switching frequency 7) 800/s Connection technology Connection cable, 2 m Cable, 120 mm, with plug M 12, 4 pin Plug M 12, 4 pin Plug M 8, 4 pin VDE protection class M 12 8) VDE protection class M 8 8) III Protection type IP 67 Protection circuits 9) A, B, C Ambient temperature 10) Operation –40 ... +60 °C Storage –40 ... +75 °C Weight with connection cable 2 m/120 mm Approx. 80 g with equipment plug M 12/M 8, 4 pin Approx. 20 g WL 9-2 Scanning range Ordering information Technical data WL 9-2 P121 P421 N121 N421 P321 P621 1) Limit values 2) Must be within VS tolerances 3) Without load 4) Average service life at room temperature 100,000 h 5) At TU = +25 °C and 100 mA output current 6) With resistive load 7) With light/dark ratio 1:1 8) Withstand voltage 50 V 19) A = supply connections reverse polarity protected B = outputs short-circuit protected C = interference suppression 10) Do not distort cable below 0 °C Type WL 9-2P121 WL 9-2P421 WL 9-2N121 WL 9-2N421 WL 9-2P321 WL 9-2P621 Order no. 1 018 289 1 018 291 1 018 290 1 018 292 1 019 270 1 019 271 Programming via Teach-In button. Simple programming: Position reflector in the beam and push the button: finished; LED confirms the Teach-In procedure. Teach-In values can be stored. Teach-In function Two operating modes: Default setting: short Teach-In time (< 8 s); for standard applications; approx. double reserve via switching threshold; LED lights continuously. Precise setting: long Teach-In time (> 8 s); for precise applications; small switching hysteresis; LED blinks. (m) 0.1 0.2 0.3 0.4 0.5 0.6 100 10 1 Function reserve Limiting scanning range Operating range WL 9-2 2 1 3 0(m) 0.1 0.2 0.3 0.4 0.5 1 2 3 Operating range Limiting scanning range 0 0.3 0.4 0 0.2 0.3 0 0,.1 0.2 Reflective tape 0 ... 0.25 m Diamond Grade* 3 2 PL 40 A 0 ... 0.3 m 1 PL 80 A 0 ... 0.5 m Reflector type Operating range * 100 x 100 mm2 14 Accessoires SENSICK Dimension illustrations of reflectors Reflector 20 x 40 mm Order no. 1 012 719 Type PL 20 A Reflector 30 x 50 mm Order no. 1 002 314 Type PL 30 A 15 18 38 ø8 ø4.6 50 60 4.2 7.3 3.4 ø4.5 ø8 71 82 29.8 7.2 Reflector 40 x 60 mm Order no. 1 012 720 Type PL 40 A Reflector hexagonal, SW 48 mm Order no. 1 000 132 Type PL 50 A 34 38 7.8 40.2 52 56.6 59.8 ø8.5 ø4.5 8 78 68 59 Reflector 80 x 80 mm Order no. 1 003 865 Type PL 80 A Reflector ø 83 mm, center hole mounting Order no. 5 304 549 Type C 110 84 68 71 84 4.5 8 8.5 2.5 ø4.8 83 9 Also available as heatable model: Continuous heating: PL 50HK, Order no. 1 001 545 Regulated heating: PL 50HS, Order no. 1 009 871 Reflective tape fabricated sheet 749 x 914 mm Order no. 4 019 634 5 304 334 Type REF-DG-K REF-DG Dimension illustrations and ordering information 15 Accessoires SENSICK Contact assignments according to EN 50044 DC coding Dimension illustrations of cable receptacles Cable receptacles M 12, 4 pin, straight Order no. 6 007 302 Cable lengths – 5 ø18 M12x1 54 5 ø10.5 ø8.8 1.5 12 M12x1 14.5 27 25.5 42 Rmin 571) Rmin 571) 38.3 12 45° M12x1 26.5 14.5 12 1.5 ø8.8 ø10.5 Pin assignments Pin 1 = brown Pin 2 = white Pin 3 = blue Pin 4 = black 3 2 4 1 Pins 4 Type DOS-1204-G Cable receptacles M 12, 4 pin, angled Order no. 6 007 303 Cable lengths – 36 25 5 14.8 M12x1 ø18 36 5 20.5 Pins 4 Type DOS-1204-W Cable receptacles M 12, 4 pin, straight Pins 4 4 4 Type DOS-1204-G02M DOS-1204-G05M DOS-1204-G10M Order no. 6 009 382 6 009 866 6 010 543 Cable lengths 2 m 5 m 10 m Cable receptacles M 12, 4 pin, angled Pins 4 4 4 Type DOS-1204-W02M DOS-1204-W05M DOS-1204-W10M Order no. 6 009 383 6 009 867 6 010 541 Cable lengths 2 m 5 m 10 m Can be self-made for cables Ø 4.5 to 6.5 mm 1) Minimum bending radius with dynamic use Can be self-made for cables Ø 4.5 to 6.5 mm 1) Minimum bending radius with dynamic use Dimension illustrations and ordering information 16 Accessoires SENSICK Dimension illustrations and ordering information ø 11.6 M 8x1 38.4 Cable diameter max. 5.0 mm 28.0 ø 11.6 M 8x1 12.5 Cable diameter max. 5.0 mm SENSICK circular screwing system, M 8 plug, 4 pin, enclosure rating IP 67 M 8 cable receptacle, 4 pin, straight Type DOS-0804-G Order no. 6 009 974 M 8 cable receptacles, 4 pin, angled Type DOS-0804-W Order no. 6 009 975 2/wht 1/brn 4/blk 3/blu ø 10 30.5 Rmin1) M 8x1 3/blu 6 26 M 8x1 16.5 ø 10 Rmin1) 1/brn 4/blk 2/wht M 8 cable receptacle, 4 pin, straight M 8 cable receptacles, 4 pin, angled Cable diameter 5 mm, 4 x 0.25 mm2, PVC coating Cable diameter 5 mm, 4 x 0.25 mm2, PVC coating Cable length 2 m 5 m 10 m Type DOL-0804-G02M DOL-0804-G05M DOL-0804-G10M Order no. 6 009 870 6 009 872 6 010 754 Cable length 2 m 5 m 10 m Type DOL-0804-W02M DOL-0804-W05M DOL-0804-W10M Order no. 6 009 871 6 009 873 6 010 755 1) Minimum bending radius with dynamic use Rmin= 20x cable diameter SENSICK 17 Dimension illustration adapter plate Adapter plate Order no. 4 033 145 Type BEF-AP-W9 22 63.25 1 8.25 5 3.25 20 3 M 3 ø 3.2 Dimension illustration mounting bracket Mounting bracket Order no. 4 033 146 Type BEF-WN-W9-2 44 1 4 4 3.5 5 6 14.8 12 6.4 8 14.8 16 17 17 Accessoires Dimension illustrations and ordering information 8 008 988.0700 HJS • SM • Printed in Germany • We reserve the right to make changes Contact: Au s t r a l i a Phone +61 3 94 97 41 00 0 08 33 48 02 – toll free Fax +61 3 94 97 11 87 Au s t r i a Phone +43 2 23 66 22 88-0 Fax +43 2 23 66 22 88-5 Bel g i u m / Luxembourg Phone +32 24 66 55 66 Fax +32 24 63 35 07 Br a z i l Phone +55 11 55 61 26 83 Fax +55 11 5 35 41 53 C h i n a / Ho n g Kong Phone +8 52 27 63 69 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SICK AG • Industrial Sensors • Sebastian-Kneipp-Straße 1 • D-79183 Waldkirch Phone +49/76 81/2 02-0 • Fax +49/76 81/2 02-36 09 • www.sick.de 1. Product profile 1.1 General description The BGA7124 MMIC is a one-stage amplifier, available in a low-cost leadless surface-mount package. It delivers 25 dBm output power at 1 dB gain compression and superior performance up to 2700 MHz. Its power saving features include easy quiescent current adjustment enabling class-AB operation and logic-level shutdown control to reduce the supply current to 4 μA. 1.2 Features and benefits 400 MHz to 2700 MHz frequency operating range 16 dB small signal gain at 2 GHz 25 dBm output power at 1 dB gain compression Integrated active biasing External matching allows broad application optimization of the electrical performance 3.3 V or 5 V single supply operation All pins ESD protected 1.3 Applications 1.4 Quick reference data [1] The supply current is adjustable; see Section 8.1 “Supply current adjustment”. [2] Operation outside this range is possible but not guaranteed. [3] PL = 11 dBm per tone; spacing = 1 MHz. BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 3 — 9 September 2010 Product data sheet Wireless infrastructure (base station, repeater, backhaul systems) E-metering Broadband CPE/MoCA Satellite Master Antenna TV (SMATV) Industrial applications WLAN/ISM/RFID Table 1. Quick reference data Input and output impedances matched to 50 Ω, SHDN = HIGH (shutdown disabled). Typical values at VCC = 5 V; ICC = 130 mA; Tcase = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICC supply current VCC = 5.0 V [1] 50 - 170 mA f frequency [2] 400 - 2700 MHz Gp power gain f = 2140 MHz 14.5 16 17.5 dB PL(1dB) output power at 1 dB gain compression f = 2140 MHz 23.5 24.5 - dBm IP3O output third-order intercept point f = 2140 MHz [3] 34.5 37.5 - dBm BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 2 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 2. Pinning information 2.1 Pinning 2.2 Pin description [1] This pin is DC-coupled and requires an external DC-blocking capacitor. [2] RF decoupled. [3] The center metal base of the SOT908-1 also functions as heatsink for the power amplifier. 3. Ordering information Fig 1. HVSON8 package pin configuration 014aab046 VCC(BIAS) VCC(RF) SHDN VCC(RF) RF_IN ICQ_ADJ GND PAD n.c. Transparent top view 4 5 3 6 2 7 1 8 terminal 1 index area BGA7124 n.c. Table 2. Pin description Symbol Pin Description n.c. 1, 4 not connected VCC(RF) 2, 3 RF output for the power amplifier and DC supply input for the RF transistor collector [1] VCC(BIAS) 5 bias supply voltage [2] SHDN 6 shutdown control function enabled/disabled RF_IN 7 RF input for the power amplifier [1] ICQ_ADJ 8 quiescent collector current adjustment controlled by an external resistor GND GND pad RF and DC ground[3] Table 3. Ordering information Type number Package Name Description Version BGA7124 HVSON8 plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 × 3 × 0.85 mm SOT908-1 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 3 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 4. Functional diagram 5. Shutdown control Fig 2. Functional diagram BANDGAP INPUT MATCH OUTPUT MATCH BIAS ENABLE V/I CONVERTER RF_OUT GND R1 R2 RF_IN SHDN VCC ICQ_ADJ 6 7 5 8 2, 3 014aab047 VCC(BIAS) VCC(RF) Table 4. Shutdown control settings Mode Mode description Function description Pin SHDN Vctrl(sd) (V) Ictrl(sd) (μA) Min Max Min Max Idle medium power MMIC fully off; minimal supply current shutdown control enabled 0 0 0.7 - 2 TX medium power MMIC transmit mode shutdown control disabled 1 2.5 VCC(BIAS)- 9 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 4 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 6. Limiting values [1] See Figure 3 for safe operating area. [2] The supply current is adjustable; see Section 8.1 “Supply current adjustment”. [3] If Vctrl(sd) exceeds VCC(BIAS), the internal ESD circuit can be damaged. To prevent this, it is recommended that the Ictrl(sd) is limited to 20 mA. If the SHDN function is not used, the SHDN pin should be connected to the VCC(BIAS) pin. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC(RF) RF supply voltage [1]- 6.0 V VCC(BIAS) bias supply voltage [1]- 6.0 V ICC supply current [1][2] 50 200 mA Vctrl(sd) shutdown control voltage [3] 0.0 VCC(BIAS) V Pi(RF) RF input power - 20 dBm Tcase case temperature −40 +85 °C Tj junction temperature - 150 °C VESD electrostatic discharge voltage Human Body Model (HBM); According JEDEC standard 22-A114E - 2000 V Charged Device Model (CDM); According JEDEC standard 22-C101B - 500 V Exceeding the safe operating area limits may cause serious damage to the product. The impact on ICC due to the spread of the external ICQ resistor (R2) should be taken into account. The product-spread on ICC should be taken into account (see Section 8 “Static characteristics”). Fig 3. BGA7124 DC safe operating area VCC(RF) (V) 2 3 4 5 6 7 014aab048 150 100 200 250 ICC (mA) 50 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 5 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 7. Thermal characteristics [1] defined as thermal resistance from junction to GND paddle. 8. Static characteristics [1] The supply current is adjustable; see Section 8.1 “Supply current adjustment”. [2] See Section 12 “Application information”. 8.1 Supply current adjustment The supply current can be adjusted by changing the value of external ICQ resistor (R2); (see Figure 4). Table 6. Thermal characteristics Symbol Parameter Conditions Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base Tcase = 85 °C; VCC = 5 V; ICC = 130 mA [1] 32 - K/W Table 7. Characteristics Input and output impedances matched to 50 Ω, pin SHDN = HIGH (shutdown disabled). Typical values at VCC = 3.3 V or VCC = 5 V; Tcase = 25°C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICC supply current VCC = 3.3 V [1] 50 - 200 mA R1 = 0 Ω; R2 = 1330 Ω [2] 115 130 145 mA R1 = 2.2 Ω; R2 = 1070 Ω [2] 135 160 185 mA VCC = 5.0 V [1] 50 - 170 mA R1 = 0 Ω; R2 = 1960 Ω [2] 110 130 150 mA R1 = 2.2 Ω; R2 = 1650 Ω [2] 125 150 175 mA during shutdown; pin SHDN = LOW (shutdown enabled) - 4 6 μA BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 6 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 9. Dynamic characteristics a. 5 V supply voltage. b. 3.3 V supply voltage Fig 4. Supply current as a function of the value of R2 VCC = 5 V; R1 = 0 R2 (kΩ) 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 014aab049 90 130 170 ICC (mA) 50 VCC = 3.3 V; R1 = 0 R2 (kΩ) 0.9 1.4 1.9 2.4 2.9 3.4 014aab050 110 140 80 170 200 ICC (mA) 50 Table 8. Characteristics at VCC = 5 V Input and output impedances matched to 50 Ω, pin SHDN = HIGH (shutdown disabled). Typical values at VCC = 5 V; ICC = 130 mA; Tcase = 25°C; see Section 12 “Application information”; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit f frequency [1] 400 - 2700 MHz Gp power gain for small signals f = 940 MHz - 22.7 - dB f = 1960 MHz - 16.4 - dB f = 2140 MHz 14.5 16.0 17.5 dB f = 2445 MHz [2] - 14.2 - dB PL(1dB) output power at 1 dB gain compression f = 940 MHz - 25.0 - dBm f = 1960 MHz - 24.5 - dBm f = 2140 MHz 23.5 24.5 - dBm f = 2445 MHz [2] - 23.5 - dBm IP3O output third-order intercept point f = 940 MHz [3] - 38.5 - dBm f = 1960 MHz [3] - 38.0 - dBm f = 2140 MHz [3] 34.5 37.5 - dBm f = 2445 MHz [2][3] - 36.0 - dBm NF noise figure f = 940 MHz [4]- 5.2 - dB f = 1960 MHz [4]- 4.6 - dB f = 2140 MHz [4]- 4.8 6.5 dB f = 2445 MHz [2][4]- 5.4 - dB BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 7 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] Operation outside this range is possible but not guaranteed. [2] ICC = 150 mA; see Section 12 “Application information”. [3] PL = 11 dBm per tone; spacing = 1 MHz. [4] Defined at Pi = −40 dBm; small signal conditions. RLin input return loss f = 940 MHz - −15 - dB f = 1960 MHz - −11 - dB f = 2140 MHz - −17 - dB f = 2445 MHz [2] - −13 - dB RLout output return loss f = 940 MHz - −8 - dB f = 1960 MHz - −12 - dB f = 2140 MHz - −15 - dB f = 2445 MHz [2] - −25 - dB Table 8. Characteristics at VCC = 5 V …continued Input and output impedances matched to 50 Ω, pin SHDN = HIGH (shutdown disabled). Typical values at VCC = 5 V; ICC = 130 mA; Tcase = 25°C; see Section 12 “Application information”; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 8 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] Operation outside this range is possible but not guaranteed. [2] ICC = 160 mA; see Section 12 “Application information”. [3] PL= 11 dBm per tone; spacing = 1 MHz. [4] Defined at Pi = −40 dBm; small signal conditions. Table 9. Characteristics at VCC = 3.3 V Input and output impedances matched to 50 Ω, pin SHDN = HIGH (shutdown disabled). Typical values at VCC = 3.3 V; ICC = 130 mA; Tcase = 25°C, see Section 12 “Application information”; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit f frequency [1] 400 - 2700 MHz Gp power gain for small signals f = 940 MHz - 22.5 - dB f = 2445 MHz [2]- 13.8 - dB PL(1dB) output power at 1 dB gain compression f = 940 MHz - 23.5 - dBm f = 2445 MHz [2]- 22.0 - dBm IP3O output third-order intercept point f = 940 MHz [3]- 36.4 - dBm f = 2445 MHz [2][3]- 35.2 - dBm NF noise figure f = 940 MHz [4]- 5.5 - dB f = 2445 MHz [2][4]- 5.5 - dB RLin input return loss f = 940 MHz - −15 - dB f = 2445 MHz [2] - −10 - dB RLout output return loss f = 940 MHz - −9 - dB f = 2445 MHz [2] - −25 - dB BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 9 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 9.1 Scattering parameters Table 10. Scattering parameters at 5 V, MMIC only VCC = 5 V; ICC = 130mA; Tcase = 25°C. f (MHz) s11 s21 s12 s22 Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) 400 0.85 161.56 22.94 82.35 0.01 17.02 0.46 −156.50 500 0.90 159.44 11.82 82.58 0.01 27.08 0.63 176.13 600 0.90 152.15 9.98 73.86 0.01 24.10 0.64 169.61 700 0.89 145.75 8.59 66.00 0.01 21.41 0.64 164.34 800 0.88 139.33 7.55 58.86 0.02 18.47 0.65 159.29 900 0.87 133.19 6.74 51.66 0.02 14.00 0.65 154.44 1000 0.87 127.07 6.14 45.11 0.02 11.25 0.65 149.58 1100 0.87 120.67 5.61 38.20 0.02 7.99 0.65 144.25 1200 0.87 114.18 5.19 31.60 0.02 4.20 0.64 139.60 1300 0.86 107.68 4.82 25.08 0.02 0.31 0.64 134.85 1400 0.86 100.86 4.51 18.49 0.02 −4.01 0.63 130.13 1500 0.86 94.14 4.23 11.74 0.02 −8.65 0.63 125.02 1600 0.86 87.48 3.99 5.25 0.03 −13.15 0.63 120.13 1700 0.86 80.83 3.77 −1.50 0.03 −18.16 0.62 114.98 1800 0.86 74.14 3.56 −8.13 0.03 −23.28 0.62 109.78 1900 0.86 67.39 3.37 −14.94 0.03 −28.54 0.62 104.46 2000 0.86 60.70 3.19 −21.68 0.03 −33.68 0.63 99.01 2100 0.86 53.97 3.02 −28.68 0.03 −39.37 0.63 93.58 2200 0.86 47.78 2.85 −35.14 0.03 −44.84 0.63 88.17 2300 0.86 41.57 2.69 −41.70 0.03 −50.27 0.64 83.06 2400 0.86 35.43 2.54 −48.11 0.03 −55.62 0.64 78.10 2500 0.86 29.74 2.39 −54.19 0.04 −60.71 0.65 73.31 2600 0.86 24.79 2.27 −60.06 0.04 −65.48 0.65 68.64 2700 0.85 19.58 2.15 −66.14 0.04 −70.66 0.66 64.16 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 10 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 10. Reliability information 11. Moisture sensitivity Table 11. Scattering parameters at 3.3 V, MMIC only VCC = 3.3 V; ICC = 130mA; Tcase = 25°C. f (MHz) s11 s21 s12 s22 Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) Magnitude (ratio) Angle (degree) 400 0.84 161.94 21.25 73.81 0.01 17.66 0.57 −154.41 500 0.91 159.25 11.56 79.01 0.01 28.15 0.65 178.05 600 0.90 151.98 9.67 70.71 0.01 24.80 0.66 171.32 700 0.90 145.57 8.29 63.37 0.01 21.89 0.66 165.59 800 0.89 139.18 7.26 56.54 0.02 19.04 0.66 160.37 900 0.88 132.87 6.48 49.74 0.02 15.35 0.66 155.28 1000 0.88 126.78 5.90 43.30 0.02 11.89 0.66 150.23 1100 0.87 120.46 5.39 36.53 0.02 8.33 0.66 144.88 1200 0.87 113.94 4.97 30.05 0.02 4.50 0.65 140.03 1300 0.87 107.48 4.62 23.62 0.02 0.35 0.65 135.35 1400 0.87 100.69 4.32 17.15 0.02 −3.92 0.64 130.48 1500 0.86 93.93 4.05 10.48 0.02 −8.62 0.64 125.46 1600 0.86 87.28 3.81 4.05 0.03 −13.28 0.64 120.31 1700 0.86 80.71 3.61 −2.66 0.03 −18.26 0.64 115.13 1800 0.86 74.00 3.40 −9.21 0.03 −23.51 0.64 109.99 1900 0.86 67.27 3.22 −15.97 0.03 −28.87 0.63 104.66 2000 0.86 60.64 3.05 −22.71 0.03 −34.22 0.64 99.36 2100 0.86 53.84 2.89 −29.68 0.03 −39.95 0.64 93.93 2200 0.86 47.60 2.72 −36.12 0.03 −45.44 0.64 88.55 2300 0.86 41.43 2.57 −42.66 0.03 −51.06 0.65 83.38 2400 0.86 35.35 2.42 −49.01 0.04 −56.53 0.65 78.44 2500 0.85 29.64 2.28 −55.12 0.04 −61.72 0.66 73.56 2600 0.85 24.72 2.16 −60.91 0.04 −66.76 0.66 68.80 2700 0.85 19.59 2.04 −66.91 0.04 −71.84 0.67 64.30 Table 12. Reliability Life test Conditions Intrinsic failure rate HTOL According JESD85; confidence level 60 %; Tj = 55 °C; activation energy = 0.7 eV; acceleration factor determined according Arrhenius 4 Table 13. Moisture sensitivity level Test methodology Class JESD-22-A113 1 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 11 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 12. Application information 12.1 5 V applications 12.1.1 920 MHz to 960 MHz See Table 14 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 5. 5 V/130 mA application schematic; 920 MHz to 960 MHz C3 C10 C4 C6 C8 C9 C7 R1 R2 ICQ_ADJ SHDN enable L1 L2 C2 MSL1 C1 MSL2 MSL3 MSL5 MSL6 MSL7 MSL8 RF_IN J1 J3 J2 RF_OUT BGA7124 50 Ω 50 Ω VCC C5 014aab051 V MSL4 CC(RF) VCC(BIAS) (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 6. Output power at 1 dB gain compression as a function of frequency Fig 7. Power gain as a function of frequency f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab052 24 26 22 28 30 PL(1dB) (dBm) 20 (1) (2) (3) f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab053 22 24 20 26 28 Gp (dB) 18 (1) (2) (3) BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 12 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Tcase = 25 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 8. Input return loss, output return loss and isolation as a function of frequency Fig 9. Output third-order intercept point as a function of frequency RLout RLin ISL f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab054 −20 −10 0 RLin, RLout, ISL (dB) −30 f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab055 38 40 42 IP3O (dBm) 36 (1) (3) (2) See Table 14 for a list of components. Fig 10. 5 V/130 mA application reference board; 920 MHz to 960 MHz J3 GND VCC GND n.c. enable GND C9 C10 C8 C6 C4 C5 L2 C1 C3 R2 C2 L1 C7 R1 MSL6 MSL7 MSL4 MSL5 MSL1 MSL3 MSL8 MSL2 J1 J I HG F E D C B A 1 2 3 4 5 6 7 8 910 11 12 13 RF in J2 RF out 014aab056 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 13 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] MSL1 to MSL8 dimensions specified as Width (W), Spacing (S) and Length (L). Table 14. 5 V/130 mA application list of components; 920 MHz to 960 MHz See Figure 5 and Figure 10 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks C1, C6 capacitor 68 pF DC blocking Murata GRM1885C1H680JA01D C2, C3 capacitor 3.3 pF input match Murata GRM1885C1H3R3CZ01D C4 capacitor 3.9 pF output match Murata GRM1885C1H3R9CZ01D C5 capacitor 1.0 pF output match Murata GRM1885C1H1R0CZ01D C7 capacitor 68 pF RF decoupling Murata GRM1885C1H680JA01D C8 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A C9 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A C10 capacitor 12 pF noise decoupling Murata GRM1555C1H120JZ01D J1, J2 RF connector SMA Emerson Network Power 142-0701-841 J3 DC connector 6-pins MOLEX L1 inductor 2.2 nH output match Tyco electronics 36501J2N2JTDG L2 inductor 22 nH DC feed Tyco electronics 36501J022JTDG MSL1[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match MSL2[1] micro stripline 1.14 mm × 0.8 mm × 2.95 mm input match MSL3[1] micro stripline 1.14 mm × 0.8 mm × 7.75 mm input match MSL4[1] micro stripline 1.14 mm × 0.8 mm × 23.4 mm output match MSL5[1] micro stripline 1.14 mm × 0.8 mm × 2.2 mm output match MSL6[1] micro stripline 1.14 mm × 0.8 mm × 3.15 mm output match MSL7[1] micro stripline 1.14 mm × 0.8 mm × 2.3 mm output match MSL8[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match R1 resistor 0 Ω Multicomp MC 0.063W 0603 0R R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 14 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 12.1.2 1930 MHz to 1990 MHz See Table 15 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 11. 5 V/130 mA application schematic; 1930 MHz to 1990 MHz C3 C4 C6 C7 C5 R1 R2 ICQ_ADJ SHDN enable L1 C2 MSL1 C1 MSL2 MSL4 MSL5 MSL6 RF_IN RF_OUT BGA7124 50 Ω 50 Ω VCC 014aab057 MSL3 VCC(BIAS) VCC(RF) J1 J3 J2 (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 12. Output power at 1 dB gain compression as a function of frequency Fig 13. Power gain as a function of frequency 014aab058 f (GHz) 1.93 1.95 1.97 1.99 24 26 22 28 30 PL(1dB) (dBm) 20 (1) (2) (3) 014aab059 f (GHz) 1.93 1.95 1.97 1.99 14 16 12 18 20 Gp (dB) 10 (1) (2) (3) BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 15 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Tcase = 25 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 14. Input return loss, output return loss and isolation as a function of frequency Fig 15. Output third-order intercept point as a function of frequency RLout RLin ISL f (GHz) 1.93 1.95 1.97 1.99 014aab060 −20 −10 0 RLin, RLout, ISL (dB) −30 f (GHz) 1.93 1.95 1.97 1.99 014aab061 36 38 40 34 IP3O (dBm) (2) (1) (3) See Table 15 for a list of components. Fig 16. 5 V/130 mA application reference board; 1930 MHz to 1990 MHz J3 GND VCC GND n.c. enable GND C7 C6 C4 C2 C3 C1 R2 L1 C5 R1 MSL6 MSL4 MSL5 MSL1 MSL2 MSL3 J1 J I HG F E D C B A 1 2 3 4 5 6 7 8 910 11 12 13 RF in J2 RF out 014aab062 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 16 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] MSL1 to MSL6 dimensions specified as Width (W), Spacing (S) and Length (L). 12.1.3 2110 MHz to 2170 MHz Table 15. 5 V/130 mA application list of components; 1930 MHz to 1990 MHz See Figure 11 and Figure 16 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D C2 capacitor 2.2 pF input match Murata GRM1885C1H2R2CZ01D C3 capacitor 1.2 pF output match Murata GRM1885C1H1R2CZ01D C5 capacitor 15 pF RF decoupling Murata GRM1885C1H150JA01D C6 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A C7 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A J1, J2 RF connector SMA Emerson Network Power 142-0701-841 J3 DC connector 6-pins MOLEX L1 inductor 22 nH DC feed Tyco electronics 36501J022JTDG MSL1[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match MSL2[1] micro stripline 1.14 mm × 0.8 mm × 10.8 mm input match MSL3[1] micro stripline 1.14 mm × 0.8 mm × 5.8 mm output match MSL4[1] micro stripline 1.14 mm × 0.8 mm × 2.2 mm output match MSL5[1] micro stripline 1.14 mm × 0.8 mm × 3.7 mm output match MSL6[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match R1 resistor 0 Ω Multicomp MC 0.063W 0603 0R R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E See Table 16 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 17. 5 V/130 mA application schematic; 2110 MHz to 2170 MHz RF_OUT C3 C4 C6 C7 C5 R1 R2 ICQ_ADJ SHDN enable L1 C2 MSL1 C1 MSL2 MSL4 MSL5 MSL6 RF_IN BGA7124 50 Ω 50 Ω VCC 014aab063 MSL3 VCC(BIAS) VCC(RF) J1 J3 J2 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 17 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 18. Output power at 1 dB gain compression as a function of frequency Fig 19. Power gain as a function of frequency 014aab064 f (GHz) 2.11 2.13 2.15 2.17 24 26 22 28 30 PL(1dB) (dBm) 20 (1) (2) (3) 014aab065 f (GHz) 2.11 2.13 2.15 2.17 14 16 12 18 20 Gp (dB) 10 (1) (2) (3) Tcase = 25 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 20. Input return loss, output return loss and isolation as a function of frequency Fig 21. Output third-order intercept point as a function of frequency RLout RLin ISL f (GHz) 2.11 2.13 2.15 2.17 014aab066 −20 −10 0 RLin, RLout, ISL (dB) −30 (3) (2) (1) f (GHz) 2.11 2.13 2.15 2.17 014aab067 36 38 40 IP3O (dBm) 34 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 18 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier See Table 16 for a list of components. Fig 22. 5 V/130 mA application reference board; 2110 MHz to 2170 MHz J3 GND VCC GND n.c. enable GND C7 C6 C4 C2 C3 C1 R2 L1 C5 R1 MSL6 MSL4 MSL5 MSL1 MSL2 MSL3 J1 J I HG F E D C B A 1 2 3 4 5 6 7 8 910 11 12 13 RF in J2 RF out 014aab068 Table 16. 5 V/130 mA application list of components; 2110 MHz to 2170 MHz See Figure 17 and Figure 22 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks C1, C4 capacitor 15 pF DC blocking Murata GRM1885C1H150JA01D C2 capacitor 2.7 pF input match Murata GRM1885C1H2R7CZ01D C3 capacitor 1.5 pF output match Murata GRM1885C1H1R5CZ01D C5 capacitor 15 pF RF decoupling Murata GRM1885C1H150JA01D C6 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A C7 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A J1, J2 RF connector SMA Emerson Network Power 142-0701-841 J3 DC connector 6-pins MOLEX L1 inductor 22 nH DC feed Tyco electronics 36501J022JTDG MSL1[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match MSL2[1] micro stripline 1.14 mm × 0.8 mm × 10.8 mm input match MSL3[1] micro stripline 1.14 mm × 0.8 mm × 5.8 mm output match MSL4[1] micro stripline 1.14 mm × 0.8 mm × 2.5 mm output match MSL5[1] micro stripline 1.14 mm × 0.8 mm × 3.5 mm output match BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 19 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] MSL1 to MSL6 dimensions specified as Width (W), Spacing (S) and Length (L). 12.1.4 2405 MHz to 2485 MHz MSL6[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match R1 resistor 0 Ω Multicomp MC 0.063W 0603 0R R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E Table 16. 5 V/130 mA application list of components; 2110 MHz to 2170 MHz …continued See Figure 17 and Figure 22 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks See Table 17 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 23. 5 V/130 mA application schematic; 2405 MHz to 2485 MHz C3 C4 C5 C7 C8 C6 R1 R2 ICQ_ADJ SHDN enable L1 C2 MSL1 C1 MSL2 MSL3 MSL4 MSL5 RF_IN RF_OUT BGA7124 50 Ω 50 Ω VCC 014aab069 VCC(BIAS) VCC(RF) J1 J3 J2 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 20 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 24. Output power at 1 dB gain compression as a function of frequency Fig 25. Power gain as a function of frequency (3) (2) (1) f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab070 20 22 18 24 26 PL(1dB) (dBm) 16 (3) (2) (1) f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab071 14 16 12 18 20 Gp (dB) 10 Tcase = 25 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 26. Input return loss, output return loss and isolation as a function of frequency Fig 27. Output third-order intercept point as a function of frequency RLout RLin ISL f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab072 −20 −10 0 RLin, RLout, ISL (dB) −30 f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab073 34 36 38 32 IP3O (dBm) (1) (2) (3) BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 21 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier See Table 17 for a list of components. Fig 28. 5 V/130 mA application reference board; 2405 MHz to 2485 MHz J3 GND VCC GND n.c. enable GND C8 C7 C5 C2 C3 C4 C1 R2 L1 C6 R1 MSL1 MSL2 MSL3 MSL4 MSL5 J1 J I HG F E D C B A 1 2 3 4 5 6 7 8 910 11 12 13 RF in J2 RF out 014aab074 Table 17. 5 V/130 mA application list of components; 2405 MHz to 2485 MHz See Figure 23 and Figure 28 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks C1, C5 capacitor 12 pF DC blocking Murata GRM1885C1H120JA01D C2 capacitor 2.2 pF input match Murata GRM1885C1H2R2CZ01D C3 capacitor 0.82 pF output match Murata GRM1885C1HR82CZ01D C4 capacitor 0.68 pF output match Murata GRM1885C1HR68CZ01D C6 capacitor 12 pF RF decoupling Murata GRM1885C1H120JA01D C7 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A C8 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A J1, J2 RF connector SMA Emerson Network Power 142-0701-841 J3 DC connector 6-pins MOLEX L1 inductor 22 nH DC feed Tyco electronics 36501J022JTDG MSL1[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match MSL2[1] micro stripline 1.14 mm × 0.8 mm × 10.8 mm input match MSL3[1] micro stripline 1.14 mm × 0.8 mm × 7.3 mm output match MSL4[1] micro stripline 1.14 mm × 0.8 mm × 4.3 mm output match BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 22 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] MSL1 to MSL5 dimensions specified as Width (W), Spacing (S) and Length (L). 12.2 3.3 V applications 12.2.1 920 MHz to 960 MHz MSL5[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match R1 resistor 2.2 Ω Multicomp MC 0.063W 0603 2R2 R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E Table 17. 5 V/130 mA application list of components; 2405 MHz to 2485 MHz …continued See Figure 23 and Figure 28 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks See Table 18 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm. Fig 29. 3.3 V/130 mA application schematic; 920 MHz to 960 MHz C3 C4 C6 C8 C9 C7 R1 R2 ICQ_ADJ SHDN enable L1 L2 C2 MSL1 C1 MSL2 MSL3 RF_IN MSL4 MSL5 MSL6 MSL7 MSL8 RF_OUT BGA7124 50 Ω 50 Ω VCC C5 014aab075 VCC(BIAS) VCC(RF) J1 J3 J2 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 23 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 30. Output power at 1 dB gain compression as a function of frequency Fig 31. Power gain as a function of frequency f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab076 24 26 22 28 30 PL(1dB) (dBm) 20 (1) (2) (3) f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab077 22 24 20 26 28 Gp (dB) 18 (1) (2) (3) Tcase = 25 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 32. Input return loss, output return loss and isolation as a function of frequency Fig 33. Output third-order intercept point as a function of frequency RLout RLin ISL f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab078 −20 −10 0 RLin, RLout, ISL (dB) −30 f (GHz) 0.92 0.93 0.94 0.95 0.96 014aab079 36 38 40 IP3O (dBm) 34 (1) (3) (2) BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 24 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier See Table 18 for a list of components. Fig 34. 3.3 V/130 mA application reference board; 920 MHz to 960 MHz J3 GND VCC GND n.c. enable GND C9 C8 C6 C2 C3 C4 C5 C1 R2 L2 L1 C7 R1 MSL1 MSL3 MSL8 MSL2 MSL4 MSL6 MSL7 MSL5 J1 J I HG F E D C B A 1 2 3 4 5 6 7 8 910 11 12 13 RF in J2 RF out 014aab080 Table 18. 3.3 V/130 mA application list of components; 920 MHz to 960 MHz See Figure 29 and Figure 34 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks C1, C6 capacitor 68 pF DC blocking Murata GRM1885C1H680JA01D C2, C3 capacitor 3.3 pF input match Murata GRM1885C1H3R3CZ01D C4 capacitor 3.9 pF output match Murata GRM1885C1H3R9CZ01D C5 capacitor 1.0 pF output match Murata GRM1885C1H1R0CZ01D C7 capacitor 68 pF RF decoupling Murata GRM1885C1H680JA01D C8 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A C9 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A J1, J2 RF connector SMA Emerson Network Power 142-0701-841 J3 DC connector 6-pins MOLEX L1 inductor 2.2 nH output match Tyco electronics 36501J2N2JTDG L2 inductor 22 nH DC feed Tyco electronics 36501J022JTDG MSL1[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match MSL2[1] micro stripline 1.14 mm × 0.8 mm × 2.95 mm input match MSL3[1] micro stripline 1.14 mm × 0.8 mm × 7.75 mm input match MSL4[1] micro stripline 1.14 mm × 0.8 mm × 23.4 mm output match MSL5[1] micro stripline 1.14 mm × 0.8 mm × 2.2 mm output match BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 25 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] MSL1 to MSL8 dimensions specified as Width (W), Spacing (S) and Length (L). 12.2.2 2405 MHz to 2485 MHz MSL6[1] micro stripline 1.14 mm × 0.8 mm × 2.4 mm output match MSL7[1] micro stripline 1.14 mm × 0.8 mm × 2.3 mm output match MSL8[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match R1 resistor 0 Ω Multicomp MC 0.063W 0603 0R R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E Table 18. 3.3 V/130 mA application list of components; 920 MHz to 960 MHz …continued See Figure 29 and Figure 34 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks See Table 19 for a list of components. PCB board specification: Rogers RO4003C; Height = 0.508 mm; εr = 3.38; Copper thickness = 35 μm Fig 35. 3.3 V/130 mA application schematic; 2405 MHz to 2485 MHz RF_OUT C3 C5 C7 C8 C6 R1 R2 ICQ_ADJ SHDN enable L1 C2 MSL1 C1 MSL2 MSL3 MSL4 MSL5 RF_IN BGA7124 50 Ω 50 Ω VCC C4 014aab081 VCC(BIAS) VCC(RF) J1 J3 J2 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 26 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 36. Output power at 1 dB gain compression as a function of frequency Fig 37. Power gain as a function of frequency f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab082 20 22 18 24 26 PL(1dB) (dBm) 16 (3) (1) (2) f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab083 14 16 12 18 20 Gp (dB) 10 (1) (2) (3) Tcase = 25 °C. (1) Tcase = −40 °C. (2) Tcase = 25 °C. (3) Tcase = 85 °C. Fig 38. Input return loss, output return loss and isolation as a function of frequency Fig 39. Output third-order intercept point as a function of frequency RLout RLin ISL f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab084 −20 −10 0 RLin, RLout, ISL (dB) −30 (2) (1) (3) f (GHz) 2.405 2.425 2.445 2.465 2.485 014aab085 34 36 38 IP3O (dBm) 32 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 27 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier See Table 19 for a list of components. Fig 40. 3.3 V/130 mA application reference board; 2405 MHz to 2485 MHz J3 GND VCC GND n.c. enable GND C8 C7 C5 C2 C3 C4 C1 R2 L1 C6 R1 MSL1 MSL2 MSL3 MSL4 MSL5 J1 J I HG F E D C B A 1 2 3 4 5 6 7 8 910 11 12 13 RF in J2 RF out 014aab086 Table 19. 3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz See Figure 35 and Figure 40 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks C1, C5 capacitor 12 pF DC blocking Murata GRM1885C1H120JA01D C2 capacitor 2.2 pF input match Murata GRM1885C1H2R2CZ01D C3 capacitor 0.82 pF output match Murata GRM1885C1HR82CZ01D C4 capacitor 0.68 pF output match Murata GRM1885C1HR68CZ01D C6 capacitor 12 pF RF decoupling Murata GRM1885C1H120JA01D C7 capacitor 100 nF DC decoupling AVX 0603YC104KAT2A C8 capacitor 10 μF DC decoupling AVX 1206ZG106ZAT2A J1, J2 RF connector SMA Emerson Network Power 142-0701-841 J3 DC connector 6-pins MOLEX L1 inductor 22 nH DC feed Tyco electronics 36501J022JTDG MSL1[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm input match MSL2[1] micro stripline 1.14 mm × 0.8 mm × 10.8 mm input match MSL3[1] micro stripline 1.14 mm × 0.8 mm × 7.3 mm output match MSL4[1] micro stripline 1.14 mm × 0.8 mm × 4.3 mm output match BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 28 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier [1] MSL1 to MSL5 dimensions specified as Width (W), Spacing (S) and Length (L). 12.3 PCB stack MSL5[1] micro stripline 1.14 mm × 0.8 mm × 10.95 mm output match R1 resistor 2.2 Ω Multicomp MC 0.063W 0603 2R2 R2 resistor (trimmer) 2 kΩ bias adjustment Bourns 3214W-1-202E Table 19. 3.3 V/130 mA application list of components; 2405 MHz to 2485 MHz …continued See Figure 35 and Figure 40 for component layout. Printed-Circuit Board (PCB): Rogers RO4003C stack; height = 0.508 mm; copper plating thickness = 35 μm. Component Description Value Function Remarks (1) Pre-pregnated RO4003Cdielectric constant εr = 3.38 Fig 41. PCB stack through via RF and analog ground RF and analog routing analog routing RF and analog ground 35 μm (1 oz.) copper + 0.3 μm gold plating RO4003C, 0.51 mm (20 mil) 35 μm (1 oz.) copper (1) 0.2 mm (8 mil) FR4, 0.15 mm (6 mil) 35 μm (1 oz.) copper 35 μm (1 oz.) copper 014aab087 BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 29 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 13. Package outline Fig 42. Package outline SOT908-1 (HVSON8) 1 0.2 0.5 0.05 0.00 UNIT A1 b D(1) Eh e y 1.5 e1 OUTLINE REFERENCES VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.1 2.9 c Dh 1.65 1.35 y1 3.1 2.9 2.25 1.95 0.3 0.2 0.05 0.1 DIMENSIONS (mm are the original dimensions) SOT908-1 MO-229 E(1) 0.5 0.3 L 0.1 v 0.05 w SOT908-1 HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm A(1) max. 05-09-26 05-10-05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. X terminal 1 index area D B A E detail X A A1 c C y1 C y exposed tie bar (4×) exposed tie bar (4×) b terminal 1 index area e1 e v M C A B w M C Eh Dh L 1 4 8 5 0 1 2 mm scale BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 30 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 14. Abbreviations 15. Revision history Table 20. Abbreviations Acronym Description CPE Customer-Premises Equipment DC Direct Current ESD ElectroStatic Discharge HTOL High Temperature Operating Life ISM Industrial, Scientific and Medical MMIC Monolithic Microwave Integrated Circuit MoCA Multimedia over Coax Alliance RFID Radio Frequency IDentification SMA SubMiniature version A TX Transmit WLAN Wireless Local Area Network Table 21. Revision history Document ID Release date Data sheet status Change notice Supersedes BGA7124 v.3 20100909 Product data sheet - BGA7124 v.2 Modifications: • Figure 5 on page 11: MSL symbols have been corrected. • Figure 11 on page 14: MSL symbols have been corrected. • Figure 17 on page 16: MSL symbols have been corrected. • Figure 23 on page 19: MSL symbols have been corrected. • Figure 29 on page 22: MSL symbols have been corrected. • Figure 35 on page 25: MSL symbols have been corrected. BGA7124 v.2 20100623 Product data sheet - BGA7124 v.1 BGA7124 v.1 20100421 Product data sheet - - BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 31 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier 16. Legal information 16.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 16.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 16.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. BGA7124 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 3 — 9 September 2010 32 of 33 NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors BGA7124 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 September 2010 Document identifier: BGA7124 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 Shutdown control . . . . . . . . . . . . . . . . . . . . . . . 3 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 8.1 Supply current adjustment . . . . . . . . . . . . . . . . 5 9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 9.1 Scattering parameters . . . . . . . . . . . . . . . . . . . 9 10 Reliability information . . . . . . . . . . . . . . . . . . . 10 11 Moisture sensitivity . . . . . . . . . . . . . . . . . . . . . 10 12 Application information. . . . . . . . . . . . . . . . . . 11 12.1 5 V applications . . . . . . . . . . . . . . . . . . . . . . . 11 12.1.1 920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . 11 12.1.2 1930 MHz to 1990 MHz . . . . . . . . . . . . . . . . . 14 12.1.3 2110 MHz to 2170 MHz . . . . . . . . . . . . . . . . . 16 12.1.4 2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 19 12.2 3.3 V applications . . . . . . . . . . . . . . . . . . . . . . 22 12.2.1 920 MHz to 960 MHz . . . . . . . . . . . . . . . . . . . 22 12.2.2 2405 MHz to 2485 MHz . . . . . . . . . . . . . . . . . 25 12.3 PCB stack. . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 29 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 30 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 30 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 31 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 32 17 Contact information. . . . . . . . . . . . . . . . . . . . . 32 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 REV. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. a 12-Bit Serial Daisy-Chain CMOS D/A Converter DAC8143 FUNCTIONAL BLOCK DIAGRAM INPUT 12-BIT SHIFT REGISTER DAC REGISTER 12-BIT D/A CONVERTER DAC8143 LOAD IN OUT CLK VDD RFB IOUT1 IOUT2 AGND SRO DGND SRI STB2 STB3 STB4 STB1 LD2 LD1 VREF CLR ADDRESS BUS ADDRESS DECODER STROBE LOAD SRI SRO DAC8143 STROBE LOAD SRI SRO DAC8143 STROBE LOAD SRI SRO DAC8143 STROBE LOAD SRI SRO DAC8143 WR DBX mP Figure 1. Multiple DAC8143s with Three-Wire Interface FEATURES Fast, Flexible, Microprocessor Interfacing in Serially Controlled Systems Buffered Digital Output Pin for Daisy-Chaining Multiple DACs Minimizes Address-Decoding in Multiple DAC Systems—Three-Wire Interface for Any Number of DACs One Data Line One CLK Line One Load Line Improved Resistance to ESD –408C to +858C for the Extended Industrial Temperature Range APPLICATIONS Multiple-Channel Data Acquisition Systems Process Control and Industrial Automation Test Equipment Remote Microprocessor-Controlled Systems GENERAL INFORMATION The DAC8143 is a 12-bit serial-input daisy-chain CMOS D/A converter that features serial data input and buffered serial data output. It was designed for multiple serial DAC systems, where serially daisy-chaining one DAC after another is greatly simplified. The DAC8143 also minimizes address decoding lines enabling simpler logic interfacing. It allows three-wire interface for any number of DACs: one data line, one CLK line and one load line. Serial data in the input register (MSB first) is sequentially clocked out to the SRO pin as the new data word (MSB first) is simultaneously clocked in from the SRI pin. The strobe inputs are used to clock in/out data on the rising or falling (user selected) strobe edges (STB1, STB2, STB3, STB4). When the shift register’s data has been updated, the new data word is transferred to the DAC register with use of LD1 and LD2 inputs. Separate LOAD control inputs allow simultaneous output updating of multiple DACs. An asynchronous CLEAR input resets the DAC register without altering data in the input register. Improved linearity and gain error performance permits reduced circuit parts count through the elimination of trimming components. Fast interface timing reduces timing design considerations while minimizing microprocessor wait states. The DAC8143 is available in plastic packages that are compatible with autoinsertion equipment. Plastic packaged devices come in the extended industrial temperature range of –40°C to +85°C. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999 ELECTRICAL CHARACTERISTICS Parameter Symbol Conditions Min Typ Max Units STATIC ACCURACY Resolution N 12 Bits Nonlinearity INL ±1 LSB Differential Nonlinearity1 DNL ±1 LSB Gain Error2 GFSE ±2 LSB Gain Tempco (DGain/DTemp)3 TCGFS ±5 ppm/°C Power Supply Rejection Ratio (DGain/DVDD) PSRR DVDD = ±5% ±0.0006 ±0.002 %/% Output Leakage Current4 ILKG TA = +25°C ±5 nA TA = Full Temperature Range ±25 nA Zero Scale Error5, 6 IZSE TA = +25°C ±0.002 ±0.03 LSB TA = Full Temperature Range ±0.01 ±0.15 LSB Input Resistance7 RIN VREF Pin 7 11 15 kW AC PERFORMANCE Output Current Settling Time3, 8 tS 0.380 1 ms AC Feedthrough Error (VREF to IOUT1)3, 9 FT VREF = 20 V p-p @ f = 10 kHz, TA = +25°C 2.0 mV p-p Digital-to-Analog Glitch Energy3, 10 Q VREF = 0 V, IOUT Load = 100 W, CEXT = 13 pF 20 nVs Total Harmonic Distortion3 THD VREF = 6 V rms @ 1 kHz DAC Register Loaded with All 1s –92 dB Output Noise Voltage Density3, 11 en 10 Hz to 100 kHz Between RFB and IOUT 13 nV/ÖHz DIGITAL INPUTS/OUTPUT Digital Input HIGH VIH 2.4 V Digital Input LOW VIL 0.8 V Input Leakage Current12 IIN VIN = 0 V to +5 V ±1 mA Input Capacitance CIN VIN = 0 V 8 pF Digital Output High VOH IOH = –200 mA 4 V Digital Output Low VOL IOL = 1.6 mA 0.4 V ANALOG OUTPUTS Output Capacitance3 COUT1 Digital Inputs = All 1s 90 pF COUT2 Digital Inputs = All 0s 90 pF Output Capacitance3 COUT1 Digital Inputs = All 0s 60 pF COUT2 Digital Inputs = All 1s 60 pF TIMING CHARACTERISTICS3 Serial Input to Strobe Setup Times tDS1 STB1 Used as the Strobe 50 ns (tSTB = 80 ns) tDS2 STB2 Used as the Strobe 20 ns tDS3 STB3 Used as the Strobe TA = +25°C 10 ns TA = Full Temperature Range 20 ns tDS4 STB4 Used as the Strobe 20 ns tDH1 STB1 Used as the Strobe TA = +25°C 40 ns TA = Full Temperature Range 50 ns tDH2 STB2 Used as the Strobe TA = +25°C 50 ns TA = Full Temperature Range 60 ns Serial Input to Strobe Hold Times (tSTB = 80 ns) tDH3 STB3 Used as the Strobe 80 ns tDH4 STB4 Used as the Strobe 80 ns –2– REV. C (@ VDD = +5 V; VREF = +10 V; VOUT1 = VOUT2 = VAGND = VDGND = 0 V; TA = Full Temperature Range specified under Absolute Maximum Ratings, unless otherwise noted.) DAC8143–SPECIFICATIONS ELECTRICAL CHARACTERISTICS DAC8143 Parameter Symbol Conditions Min Typ Max Units STB to SRO Propagation Delay13 tPD TA = +25°C 220 ns TA = Full Temperature Range 300 ns SRI Data Pulsewidth tSRI 100 ns STB1 Pulsewidth (STB1 = 80 ns)14 tSTB1 80 ns STB2 Pulsewidth (STB2 = 100 ns)14 tSTB2 80 ns STB3 Pulsewidth (STB3 = 80 ns)14 tSTB3 80 ns STB4 Pulsewidth (STB4 = 80 ns)14 tSTB4 80 ns Load Pulsewidth tLD1, tLD2 TA = +25°C 140 ns TA = Full Temperature Range 180 ns LSB Strobe into Input Register to Load DAC Register Time tASB 0 ns CLR Pulsewidth tCLR 80 ns POWER SUPPLY Supply Voltage VDD 4.75 5 5.25 V Supply Current IDD All Digital Inputs = VIH or VIL 2 mA All Digital Inputs = 0 V or VDD 0.1 mA Power Dissipation PD Digital Inputs = 0 V or VDD 0.5 mW 5 V ´ 0.1 mA Digital Inputs = VIH or VIL 10 mW 5 V ´ 2 mA NOTES 11All grades are monotonic to 12 bits over temperature. 12Using internal feedback resistor. 13Guaranteed by design and not tested. 14Applies to IOUT1; all digital inputs = VIL, VREF = +10 V; specification also applies for IOUT2 when all digital inputs = VIH. 15VREF = +10 V, all digital inputs = 0 V. 16Calculated from worst case RREF: IZSE (in LSBs) = (RREF ´ ILKG ´ 4096) /VREF. 17Absolute temperature coefficient is less than +300 ppm/°C. 18IOUT, Load = 100 W. CEXT = 13 pF, digital input = 0 V to VDD or VDD to 0 V. Extrapolated to 1/2 LSB: tS = propagation delay (tPD) +9 t, where t equals measured time constant of the final RC decay. 19All digital inputs = 0 V. 10VREF = 0 V, all digital inputs = 0 V to VDD or VDD to 0 V. 11Calculations from en = Ö4K TRB where: K = Boltzmann constant, J/KR = resistance W T = resistor temperature, K B = bandwidth, Hz 12Digital inputs are CMOS gates; IIN typically 1 nA at +25°C. 13Measured from active strobe edge (STB) to new data output at SRO; CL = 50 pF. 14Minimum low time pulsewidth for STB1, STB2, and STB4, and minimum high time pulsewidth for STB3. Specifications subject to change without notice. (@ VDD = +5 V; VREF = +10 V; VOUT1 = V0UT2 = VAGND = VDGND = 0 V; TA = Full Temperature Range specified under Absolute Maximum Ratings, unless otherwise noted.) DAC8143 REV. C –3– DAC8143 –4– REV. C PIN CONNECTIONS 16-Lead Epoxy Plastic DIP 16-Lead SOIC TOP VIEW (Not to Scale) 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 IOUT1 RFB DAC8143 IOUT2 VREF AGND VDD STB1 CLR LD1 DGND SRO STB4 SRI STB3 STB2 LD2 ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise noted.) VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V VREF to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V VRFB to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 V Digital Input Voltage Range . . . . . . . . . . . . . . . –0.3 V to VDD Output Voltage (Pin 1, Pin 2) . . . . . . . . . . . . . . –0.3 V to VDD Operating Temperature Range FP/FS Versions . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . .+300°C Package Type uJA* uJC Units 16-Lead Plastic DIP 76 33 °C/W 16-Lead SOIC 92 27 °C/W *qJA is specified for worst case mounting conditions, i.e., qJA is specified for device in socket for P-DIP package; qJA is specified for device soldered to printed circuit board for SOIC package. CAUTION 1. Do not apply voltage higher than VDD or less than DGND potential on any terminal except VREF (Pin 15) and RFB (Pin 16). 2. The digital control inputs are Zener-protected; however, permanent damage may occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam at all times until ready to use. 3. Use proper antistatic handling procedures. 4. Absolute Maximum Ratings apply to packaged devices. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. ORDERING GUIDE Gain Temperature Package Package Model Nonlinearity Error Range Descriptions Options DAC8143FP ±1 LSB ±2 LSB –40°C to +85°C 16-Lead Plastic DIP N-16 DAC8143FS ±1 LSB ±2 LSB –40°C to +85°C 16-Lead SOIC R-16W Die Size: 99 ´ 107 mil, 10,543 sq. mils. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the DAC8143 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE DAC8143 REV. C –5– 10 FREQUENCY – Hz THD – dB –90 0.032 THD – % 0.010 –85 –80 –75 –70 –95 0.018 0.0056 0.0032 0.0018 100 1k 10k 100k VIN = 5V rms OUTPUT OP AMP: OP-42 Figure 3. Multiplying Mode Total Harmonic Distortion vs. Frequency Typical Performance Characteristics– ALL BITS ON 100 FREQUENCY – Hz B10 0 ATTENUATION – dB (MSB) B11 B9 B8 B7 B6 B5 B4 B3 B2 B1 (LSB) B0 DATA BITS "ON" (ALL OTHER DATA BITS "OFF") 1k 10k 100k 1M 10M 12 24 36 48 60 72 84 96 108 Figure 2. Multiplying Mode Frequency Response vs. Digital Code 3 0 VIN – Volts IDD – mA 2 1 0 1 2 3 4 5 Figure 4. Supply Current vs. Logic Input Voltage 4 1 VDD – Volts THRESHOLD VOLTAGE – Volts 3 2 0 1 2.4 –0.8 3 5 7 9 11 13 15 17 Figure 7. Logic Threshold Voltage vs. Supply Voltage 0.5 0 DIGITAL INPUT CODE – Decimal LINEARITY ERROR – LSB 0.4 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 512 1024 1536 2048 2560 3072 3584 4095 Figure 5. Linearity Error vs. Digital Code 0.5 2 VREF – Volts DNL – LSB 4 6 8 10 0.25 0 –0.25 –0.5 Figure 8. DNL Error vs. Reference Voltage 0.5 2 VREF – Volts INL – LSB 4 6 8 10 0.25 0 –0.25 –0.5 Figure 6. Linearity Error vs. Reference Voltage 40 0 SRO – VOLTAGE OUT – Volts SINK 30 20 10 0 –10 –20 –30 –40 1 2 3 4 5 SOURCE OUTPUT CURRENT – mA TA = +258C LOGIC 1 LOGIC 0 Figure 9. Digital Output Voltage vs. Output Current DAC8143 –6– REV. C DEFINITION OF SPECIFICATIONS RESOLUTION The resolution of a DAC is the number of states (2n) into which the full-scale range (FSR) is divided (or resolved), where “n” is equal to the number of bits. SETTLING TIME Time required for the analog output of the DAC to settle to within 1/2 LSB of its final value for a given digital input stimulus; i.e., zero to full-scale. GAIN Ratio of the DAC’s external operational amplifier output voltage to the VREF input voltage when all digital inputs are HIGH. FEEDTHROUGH ERROR Error caused by capacitive coupling from VREF to output. Feedthrough error limits are specified with all switches off. OUTPUT CAPACITANCE Capacitance from IOUT1 to ground. OUTPUT LEAKAGE CURRENT Current appearing at IOUT1 when all digital inputs are LOW, or at IOUT2 terminal when all inputs are HIGH. GENERAL CIRCUIT INFORMATION The DAC8143 is a 12-bit serial-input, buffered serial-output, multiplying CMOS D/A converter. It has an R-2R resistor ladder network, a 12-bit input shift register, 12-bit DAC register, control logic circuitry, and a buffered digital output stage. The control logic forms an interface in which serial data is loaded, under microprocessor control, into the input shift register and then transferred, in parallel, to the DAC register. In addition, buffered serial output data is present at the SRO pin when input data is loaded into the input register. This buffered data follows the digital input data (SRI) by 12 clock cycles and is available for daisy-chaining additional DACs. An asynchronous CLEAR function allows resetting the DAC register to a zero code (0000 0000 0000) without altering data stored in the registers. A simplified circuit of the DAC8143 is shown in Figure 10. An inversed R-2R ladder network consisting of silicon-chrome, thin-film resistors, and twelve pairs of NMOS current-steering switches. These switches steer binarily weighted currents into either IOUT1 or IOUT2. Switching current to IOUT1 or IOUT2 yields a constant current in each ladder leg, regardless of digital input code. This constant current results in a constant input resistance at VREF equal to R (typically 11 kW). The VREF input may be driven by any reference voltage or current, ac or dc, that is within the limits stated in the Absolute Maximum Ratings chart. The twelve output current-steering switches are in series with the R-2R resistor ladder, and therefore, can introduce bit errors. It was essential to design these switches such that the switch “ON” resistance be binarily scaled so that the voltage drop across each switch remains constant. If, for example, Switch 1 of Figure 10 was designed with an “ON” resistance of 10 W, Switch 2 for 20 W, etc., a constant 5 mV drop would then be maintained across each switch. To further ensure accuracy across the full temperature range, permanently “ON” MOS switches were included in series with the feedback resistor and the R-2R ladder’s terminating resistor. The Simplified DAC Circuit, Figure 10, shows the location of these switches. These series switches are equivalently scaled to two times Switch 1 (MSB) and top Switch 12 (LSB) to maintain constant relative voltage drops with varying temperature. During any testing of the resistor ladder or RFEEDBACK (such as incoming inspection), VDD must be present to turn “ON” these series switches. VREF RFEEDBACK IOUT2 IOUT1 10kV 10kV 10kV 20kV 20kV 20kV 20kV 20kV S1 S2 S3 S12 10kV BIT 1 (MSB) BIT 2 BIT 3 BIT 12 (LSB) DIGITAL INPUTS (SWITCHES SHOWN FOR DIGITAL INPUTS "HIGH") * * *THESE SWITCHES PERMANENTLY "ON" Figure 10. Simplified DAC Circuit DAC8143 REV. C –7– ESD PROTECTION The DAC8143 digital inputs have been designed with ESD resistance incorporated through careful layout and the inclusion of input protection circuitry. Figure 11 shows the input protection diodes. High voltage static charges applied to the digital inputs are shunted to the supply and ground rails through forward biased diodes. These protection diodes were designed to clamp the inputs well below dangerous levels during static discharge conditions. VDD DTL/TTL/CMOS INPUTS Figure 11. Digital Input Protection EQUIVALENT CIRCUIT ANALYSIS Figures 12 and 13 show equivalent circuits for the DAC8143’s internal DAC with all bits LOW and HIGH, respectively. The reference current is switched to IOUT2 when all data bits are LOW, and to IOUT1 when all bits are HIGH. The ILEAKAGE current source is the combination of surface and junction leakages to the substrate. The 1/4096 current source represents the constant 1-bit current drain through the ladder’s terminating resistor. Output capacitance is dependent upon the digital input code. This is because the capacitance of a MOS transistor changes with applied gate voltage. This output capacitance varies between the low and high values. RFEEDBACK IOUT1 IOUT2 R = 10kV ILEAKAGE 60pF 1/4096 ILEAKAGE 90pF R = 10kV IREF VREF Figure 12. Equivalent Circuit (All Inputs LOW) IOUT2 ILEAKAGE 60pF RFEEDBACK IOUT1 R = 10kV 1/4096 ILEAKAGE 90pF R = 10kV IREF VREF Figure 13. Equivalent Circuit (All Inputs HIGH) DYNAMIC PERFORMANCE ANALOG OUTPUT IMPEDANCE The output resistance, as in the case of the output capacitance, varies with the digital input code. This resistance, looking back into the IOUT1 terminal, varies between 11 kW (the feedback resistor alone when all digital input are LOW) and 7.5 kW (the feedback resistor in parallel with approximately 30 kW of the R-2R ladder network resistance when any single bit logic is HIGH). Static accuracy and dynamic performance will be affected by these variations. The gain and phase stability of the output amplifier, board layout, and power supply decoupling will all affect the dynamic performance of the DAC8143. The use of a small compensation capacitor may be required when high speed operational amplifiers are used. It may be connected across the amplifier’s feedback resistor to provide the necessary phase compensation to critically damp the output. The considerations when using high speed amplifiers are: 1. Phase compensation (see Figures 16 and 17). 2. Power supply decoupling at the device socket and use of proper grounding techniques. OUTPUT AMPLIFIER CONSIDERATIONS When using high speed op amps, a small feedback capacitor (typically 5 pF–30 pF) should be used across the amplifiers to minimize overshoot and ringing. For low speed or static applications, ac specifications of the amplifier are not very critical. In high speed applications, slew rate, settling time, openloop gain and gain/phase margin specifications of the amplifier should be selected for the desired performance. It has already been noted that an offset can be caused by including the usual bias current compensation resistor in the amplifier’s noninverting input terminal. This resistor should not be used. Instead, the amplifier should have a bias current that is low over the temperature range of interest. Static accuracy is affected by the variation in the DAC’s output resistance. This variation is best illustrated by using the circuit of Figure 14 and the equation: VERROR = VOS 1+RFB RO æ è ç ö ø ÷ VOS VREF R R R ETC RFB R2 R2 R2 OP-77 Figure 14. Simplified Circuit DAC8143 –8– REV. C Where RO is a function of the digital code, and: RO = 10 kW for more than four bits of Logic 1, RO = 30 kW for any single bit of Logic 1. Therefore, the offset gain varies as follows: at code 0011 1111 1111, VERROR1 = VOS 1+10 kW 10 kW æ è ç ö ø ÷ = 2 VOS at code 0100 0000 0000, VERROR2 = VOS 1+10 kW 30 kW æ è ç ö ø ÷ = 4/3 VOS The error difference is 2/3 VOS. Since one LSB has a weight (for VREF = +10 V) of 2.4 mV for the DAC8143, it is clearly important that VOS be minimized, using either the amplifier’s pulling pins, an external pulling network, or by selection of an amplifier with inherently low VOS. Amplifiers with sufficiently low VOS include OP77, OP97, OP07, OP27, and OP42. INTERFACE LOGIC OPERATION The microprocessor interface of the DAC8143 has been designed with multiple STROBE and LOAD inputs to maximize interfacing options. Control signals decoding may be done on chip or with the use of external decoding circuitry (see Figure 21). Serial data is clocked into the input register and buffered output stage with STB1, STB2, or STB4. The strobe inputs are active on the rising edge. STB3 may be used with a falling edge clock data. WORD N –1 WORD N WORD N –2 WORD N –1 WORD N BIT 2 BIT 11 BIT 12 LSB BIT 1 MSB BIT 12 LSB BIT 1 BIT 2 SRI MSB BIT 1 BIT 2 MSB BIT 1 MSB BIT 2 BIT 12 LSB BIT 1 LSB tDS1, tDS2, tDS3, tDS4 SRO tDH1, tDH2, tDH3, tDH4 tPD tSTB1 tSTB2 tSTB3 tSTB4 tSTB1 tSTB2 tSTB3 tSTB4 * STROBE (STB1, STB2, STB4) 1 2 12 1 2 tLD1 tLD2 tSR1 11 12 tASB LD1 AND LD2 LOAD NEW 12-BIT WORD INTO INPUT REGISTER AND SHIFT OUT PREVIOUS WORD LOAD INPUT REGISTER'S DATA INTO DAC REGISTER NOTES: * STROBE WAVEFORM IS INVERTED IF STB3 IS USED TO STROBE SERIAL DATA BITS INTO INPUT REGISTER. ** DATA IS STROBED INTO AND OUT OF THE INPUT SHIFT REGISTER MSB FIRST. Figure 15. Timing Diagram Serial data output (SRO) follows the serial data input (SRI) by 12 clocked bits. Holding any STROBE input at its selected state (i.e., STB1, STB2 or STB4 at logic HIGH or STB3 at logic LOW) will act to prevent any further data input. When a new data word has been entered into the input register, it is transferred to the DAC register by asserting both LOAD inputs. The CLR input allows asynchronous resetting of the DAC register to 0000 0000 0000. This reset does not affect data held in the input registers. While in unipolar mode, a CLEAR will result in the analog output going to 0 V. In bipolar mode, the output will go to –VREF. INTERFACE INPUT DESCRIPTION STB1 (Pin 4), STB2 (Pin 8), STB4 (Pin 11)—Input Register and Buffered Output Strobe. Inputs Active on Rising Edge. Selected to load serial data into input register and buffered output stage. See Table I for details. STB3 (Pin 10)—Input Register and Buffered Output Strobe Input. Active on Falling Edge. Selected to load serial data into input register and buffered output stage. See Table I for details. LD1 (Pin 5), LD2 (Pin 9)—Load DAC Register Inputs. Active Low. Selected together to load contents of input register into DAC register. CLR (Pin 13)—Clear Input. Active Low. Asynchronous. When LOW, 12-bit DAC register is forced to a zero code (0000 0000 0000) regardless of other interface inputs. DAC8143 REV. C –9– Table I. Truth Table DAC8143 Logic Inputs Input Register/ Digital Output Control Inputs DAC Register Control Inputs STB4 STB3 STB2 STB1 CLR LD2 LD1 DAC8143 Operation Notes 0 1 0 g X X X 0 1 g 0 X X X Serial Data Bit Loaded from SRI 0 f 0 0 X X X into Input Register and Digital Output 2, 3 g 1 0 0 X X X (SRO Pin) after 12 Clocked Bits. 1 X X X X 0 X X No Operation (Input Register and SRO) 3 X X 1 X X X X 1 Reset DAC Register to Zero Code 0 X X (Code: 0000 0000 0000) 1, 3 (Asynchronous Operation) 1 1 X No Operation (DAC Register and SRO) 3 1 X 1 1 0 0 Load DAC Register with the Contents 3 of Input Register NOTES 1CLR = 0 asynchronously resets DAC Register to 0000 0000 0000, but has no effect on Input Register. 2Serial data is loaded into Input Register MSB first, on edges shown. g is positive edge, f is negative edge. 30 = Logic LOW, 1 = Logic HIGH, X = Don’t Care. APPLICATIONS INFORMATION UNIPOLAR OPERATION (2-QUADRANT) The circuit shown in Figures 16 and 17 may be used with an ac or dc reference voltage. The circuit’s output will range between 0 V and +10(4095/4096) V depending upon the digital input code. The relationship between the digital input and the analog output is shown in Table II. The VREF voltage range is the maximum input voltage range of the op amp or ±25 V, whichever is lowest. Table II. Unipolar Code Table Digital Input Nominal Analog Output (VOUT as Shown MSB LSB in Figures 16 and 17) 1 1 1 1 1 1 1 1 1 1 1 1 –VREF 4095 4096 æ è ç ö ø ÷ 1 0 0 0 0 0 0 0 0 0 0 1 –VREF 2049 4096 æèöø 1 0 0 0 0 0 0 0 0 0 0 0 –VREF 2048 4096 æè öø = – VREF 2 0 1 1 1 1 1 1 1 1 1 1 1 –VREF 2047 4096 æè öø 0 0 0 0 0 0 0 0 0 0 0 1 –VREF 1 4096 æè öø 0 0 0 0 0 0 0 0 0 0 0 0 –VREF 0 4096 æè öø = 0 NOTES 1Nominal full scale for the circuits of Figures 16 and 17 is given by FS = –VREF 4095 4096 æ è ç ö ø ÷ . 2Nominal LSB magnitude for the circuits of Figures 16 and 17 is given by LSB = VREF 1 4096 æ è ç ö ø ÷ or VREF(2–n). OP-77 +5V VREF VDD RFEEDBACK IOUT1 IOUT2 AGND DGND SRO (BUFFERED DIGITAL DATA OUT) 15pF +15V –15V VOUT 7 6 4 3 2 15 14 13 4, 5 8–11 7 1 2 3 6 12 CONTROL DAC8143 INPUTS SRI (SERIAL DATA IN) VREF –10V CLR Figure 16. Unipolar Operation with High Accuracy Op Amp (2-Quadrant) OP-42 +5V VREF VDD RFEEDBACK IOUT1 IOUT2 AGND DGND SRO (BUFFERED DIGITAL DATA OUT) 15pF +15V –15V VOUT 7 6 4 3 2 15 14 13 4, 5 8–11 7 1 2 3 6 12 CONTROL DAC8143 INPUTS SRI (SERIAL DATA IN) VREF –10V R2 50V R1 100V CLR Figure 17. Unipolar Operation with Fast Op Amp and Gain Error Trimming (2-Quadrant) DAC8143 –10– REV. C In many applications, the DAC8143’s zero scale error and low gain error, permit the elimination of external trimming components without adverse effects on circuit performance. For applications requiring a tighter gain error than 0.024% at 25°C for the top grade part, or 0.048% for the lower grade part, the circuit in Figure 17 may be used. Gain error may be trimmed by adjusting R1. The DAC register must first be loaded with all 1s. R1 is then adjusted until VOUT = –VREF (4095/4096). In the case of an adjustable VREF, R1 and RFEEDBACK may be omitted, with VREF adjusted to yield the desired full-scale output. BIPOLAR OPERATION (4-QUADRANT) Figure 18 details a suggested circuit for bipolar, or offset binary, operation. Table III shows the digital input-to-analog output relationship. The circuit uses offset binary coding. Twos complement code can be converted to offset binary by software inversion of the MSB or by the addition of an external inverter to the MSB input. Resistor R3, R4 and R5 must be selected to match within 0.01% and must all be of the same (preferably metal foil) type to assure temperature coefficient match. Mismatching between R3 and R4 causes offset and full-scale error. Calibration is performed by loading the DAC register with 1000 0000 0000 and adjusting R1 until VOUT = 0 V. R1 and R2 may be omitted by adjusting the ratio of R3 to R4 to yield VOUT = 0 V. Full scale can be adjusted by loading the DAC register with 1111 1111 1111 and adjusting either the amplitude of VREF or the value of R5 until the desired VOUT is achieved. Table III. Bipolar (Offset Binary) Code Table Digital Input Nominal Analog Output MSB LSB (VOUT as Shown in Figure 18) 1 1 1 1 1 1 1 1 1 1 1 1 +VREF 2047 2048 æè öø 1 0 0 0 0 0 0 0 0 0 0 1 +VREF 1 2048 æè öø 1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 –VREF 1 2048 æè öø 0 0 0 0 0 0 0 0 0 0 0 1 –VREF 2047 2048 æè öø 0 0 0 0 0 0 0 0 0 0 0 0 –VREF 2048 2048 æè öø NOTES 1Nominal full scale for the circuits of Figure 18 is given by FS = VREF 2047 2048 æè öø . 2Nominal LSB magnitude for the circuits of Figure 18 is given by LSB = VREF 1 2048 æè öø . DAISY-CHAINING DAC8143s Many applications use multiple serial input DACs that use numerous interconnecting lines for address decoding and data lines. In addition, they use some type of buffering to reduce loading on the bus. The DAC8143 is ideal for just such an application. It not only reduces the number of interconnecting lines, but also reduces bus loading. The DAC8143 can be daisychained with only three lines: one data line, one CLK line and one load line, see Figure 19. VOUT 1/2 OP200 +5V R2 50V 12 15 7 R1 100V SERIAL DATA INPUT
