50A, High Power System SourceMeter® SMU Instrument - PDF - Farnell Element 14 - Revenir à l'accueil
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50A, High Power System SourceMeter® SMU Instrument • Source or sink: ––2,000W of pulsed power (±40V, ±50A) ––200W of DC power (±10V@±20A, ±20V@±10A, ±40V@±5A) • Easily connect two units (in series or parallel) to create solutions up to ±100A or ±80V • 1pA resolution enables precise measurement of very low leakage currents • 1μs per point (1MHz), 18-bit sampling, accurately characterizes transient behavior • 1% to 100% pulse duty cycle for pulse width modulated (PWM) drive schemes and devicespecific drive stimulus • Combines a precision power supply, current source, DMM, arbitrary waveform generator, V or I pulse generator with measurement, electronic load, and trigger controller—all in one instrument • Includes TSP® Express I-V characterization software, LabVIEW® driver, and Keithley’s Test Script Builder software development environment APPLICATIONS • Power semiconductor, HBL ED, and optical device characterization and testing • Solar cell characterization and testing • Characterization of GaN, SiC, and other compound materials and devices • Semiconductor junction temperature characterization • High speed, high precision digitization • Electromigration studies • High current, high power device testing High power System SourceMeter SMU instrument High power System SourceMeter SMU instrument SMU INSTRUMENTS www.keithley.com 1.888.KEITHLEY (U.S. only) A Greater Measure of Confidence 2651A 50A, High Power System SourceMeter® SMU Instrument Two A/D converters are used with each measurement mode (one for current and the other for voltage), which run simultaneously for accurate source readback that does not sacrifice test throughput. 7 6 5 4 3 2 1 0 0 25 50 75 100 125 150 175 200 Voltage (V) Current (A) Time (μs) Volts Current 60 50 40 30 20 10 0 The dual digitizing A/D converters sample at up to 1μs/point, enabling full simultaneous characterization of both current and voltage waveforms. High Speed Pulsing The Model 2651A minimizes the unwanted effects of self heating during tests by accurately sourcing and measuring pulses as short as 100μs. Additional control flexibility enables you to program the pulse width from 100μs to DC and the duty cycle from 1% to 100%. A single unit can pulse up to 50A; combine two units to pulse up to 100A. Expansion Capabilities Through TSP-Link Technology technology, multiple Model 2651As and selected Series 2600B SMU instruments can be combined to form a larger integrated system with up to 64 channels. Precision timing and tight channel synchronization are guaranteed with built-in 500ns trigger controllers. True SMU instrument-per-pin testing is assured with the fully isolated, independent channels of the SourceMeter SMU instruments. 26xxB 2651A 2651A Up to 100A TSP-Link LXI or GPIB to PC Controller Keithley’s TSP and TSP-Link Technologies enable true SMU-per-pin testing without the power and/or channel limitations of a mainframe-based system. Also, when two Model 2651As are connected in parallel with TSP-Link Technology, the current range is expanded from 50A to 100A. When two units are connected in series, the voltage range is expanded from 40V to 80V. Built-in intelligence simplifies testing by enabling the units to be addressed as a single instrument, thus creating an industry-best dynamic range (100A to 1pA). This capability enables you to test a much wider range of power semiconductors and other devices. 60 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Vgs = 2.01V Vgs = 2.25V Vgs = 2.50V Vgs = 2.75V Vgs = 3.00V Vgs = 3.25V Vgs = 3.51V Vds (V) Id (A) Precision measurements to 50A (100A with two units) enable a more complete and accurate characterization. Standard Capabilities of Series 2600B SMU Instruments Each Model 2651A includes all the features and capabilities provided in most Series 2600B SMU instruments, such as: • Ability to be used as either a bench-top I-V characterization tool or as a building block component of multiple-channel I-V test systems • TSP Express software to quickly and easily perform common I-V tests without programming or installing software • ACS Basic Edition software for semiconductor component characterization (optional). ACS Basic now features a Trace mode for generating a suite of characteristic curves. • Keithley’s Test Script Processor (TSP®) Technology, which enables creation of custom user test scripts to further automate testing, and also supports the creation of programming sequences that allow the instrument to operate asynchronously without direct PC control. • Parallel test execution and precision timing when multiple SMU instruments are connected together in a system • LXI compliance • 14 digital I/O lines for direct interaction with probe stations, component handlers, or other automation tools • USB port for extra data and test program storage via USB memory device Ordering Information 2651A High Power System SourceMeter® SMU Instrument Accessories Supplied 2651A-KIT-1A: Low Impedance Cable Assembly (1m) CS-1592-2: High Current Phoenix Connector (male) CS-1626-2: High Current Phoenix Connector (female) CA-557-1: Sense Line Cable Assembly (1m) 7709-308A: Digital I/O Connector CA-180-3A: TSP-Link/Ethernet Cable Documentation CD Software Tools and Drivers CD 0.020 0.018 0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 Vgs (V) Rds (ohms) Id = 10A Id = 20A Id = 30A Id = 40A Id = 50A 1μV measurement resolution and current sourcing up to 50A (100A with two units) enable low-level Rds measurements to support next-generation devices. Acce ssorie s Av ailable 2600-KIT Screw Terminal Connector Kit ACS-BASIC Component Charaterization Software 4299-6 Rack Mount Kit 8011 Test Socket Kit High power System SourceMeter SMU instrument High power System SourceMeter SMU instrument SMU INSTRUMENTS A Greater Measure of Confidence www.keithley.com 1.888.KEITHLEY (U.S. only) 2651A 50A, High Power System SourceMeter® SMU Instrument Specification Conditions This document contains specifications and supplemental information for the Model 2651A High Power System SourceMeter SMU instrument. Specifications are the standards against which the Model 2651A is tested. Upon leaving the factory, the Model 2651A meets these specifications. Supplemental and typical values are non-warranted, apply at 23°C, and are provided solely as useful information. Accuracy specifications are applicable for both normal and high-capacitance modes. Source and measurement accuracies are specified at the Model 2651A terminals under these conditions: • 23° ±5°C, <70 percent relative humidity • After two-hour warm-up • Speed normal (1 NPLC) • A/D autozero enabled • Remote sense operation or properly zeroed local operation • Calibration period: One year VOL TAGE ACCURA CY SPECIFICATIONS 1, 2 SOUR CE MEASUR E Range Programming Resolution Accuracy ±(% reading + volts) Noise (Vpp) (typical) 0.1 Hz to 10 Hz Default Display Resolution Integrating ADC Accuracy 3 ±(% reading + volts) High-Speed ADC Accuracy 4 ±(% reading + volts) 100.000 mV 5 μV 0.02% + 500 μ V 100 μV 1 μV 0.02% + 300 μ V 0.05% + 600 μ V 1.00000 V 50 μV 0.02% + 500 μ V 500 μV 10 μV 0.02% + 300 μ V 0.05% + 600 μ V 10.0000 V 500 μV 0.02% + 5 mV 1 mV 100 μV 0.02% + 3 mV 0.05% + 8 mV 20.0000 V 500 μV 0.02% + 5 mV 1 mV 100 μV 0.02% + 5 mV 0.05% + 8 mV 40.0000 V 500 μV 0.02% + 12 mV 2 mV 100 μV 0.02% + 12 mV 0.05% + 15 mV CURR ENT ACCURA CY SPECIFICATIONS 5 SOUR CE MEASUR E Range Programming Resolution Accuracy ±(% reading + amps) Noise (Ipp) (typical) 0.1Hz to 10Hz Default Display Resolution Integrating ADC Accuracy 3 ±(% reading + amps) High-Speed ADC Accuracy 4 ±(% reading + amps) 100.000 nA 2 pA 0.1 % + 500 pA 50 pA 1 pA 0.08% + 500 pA 0.08% + 800 pA 1.00000 μ A 20 pA 0.1 % + 2 nA 250 pA 10 pA 0.08% + 2 nA 0.08% + 4 nA 10.0000 μ A 200 pA 0.1 % + 10 nA 500 pA 100 pA 0.08% + 8 nA 0.08% + 10 nA 100.000 μ A 2 nA 0.03% + 60 nA 5 nA 1 nA 0.02% + 25 nA 0.05% + 60 nA 1.00000 mA 20 nA 0.03% + 300 nA 10 nA 10 nA 0.02% + 200 nA 0.05% + 500 nA 10.0000 mA 200 nA 0.03% + 8 μ A 500 nA 100 nA 0.02% + 2.5 μA 0.05% + 10 μA 100.000 mA 2 μA 0.03% + 30 μ A 1 μA 1 μA 0.02% + 20 μA 0.05% + 50 μA 1.00000 A 200 μA 0.08% + 3.5 mA 300 μA 10 μA 0.05% + 3 mA 0.05% + 5 mA 5.00000 A 200 μA 0.08% + 3.5 mA 300 μA 10 μA 0.05% + 3 mA 0.05% + 5 mA 10.0000 A 500 μA 0.15% + 6 mA 500 μA 100 μA 0.12% + 6 mA 0.12% + 12 mA 20.0000 A 500 μA 0.15% + 8 mA 500 μA 100 μA 0.08% + 8 mA 0.08% + 15 mA 50.0000 A 6 2 mA 0.15% + 80 mA N/A 100 μA 0.05% + 50 mA 7 0.05% + 90 mA 8 NOTES 1. Add 50μV to source accuracy specifications per volt of HI lead drop. 2. For temperatures 0° to 18°C and 28° to 50°C, accuracy is degraded by ±(0.15 × accuracy specification)/°C. High-capacitance mode accuracy is applicable at 23° ±5°C only. 3. Derate accuracy specification for NPLC setting <1 by increasing error term. Add appropriate typical percent of range term for resistive loads using the table below. NPLC Setting 100mV Range 1V to 40V Ranges 100nA Range 1μA to 100mA Ranges 1A to 20A Ranges 0.1 0.01% 0.01% 0.01% 0.01% 0.01% 0.01 0.08% 0.07% 0.1 % 0.05% 0.1 % 0.001 0.8 % 0.6 % 1 % 0.5 % 1.8 % 4. 18-bit ADC. Average of 1000 samples taken at 1μs intervals. 5. At temperatures 0° to 18°C and 28° to 50°C; 100nA to 10μA accuracy is degraded by ±(0.35 × accuracy specification)/°C. 100μA to 50A accuracy is degraded by ±(0.15 × accuracy specification)/°C. High-capacitance mode accuracy is applicable at 23° ±5°C only. 6. 50A range accessible only in pulse mode. 7. 50A range accuracy measurements are taken at 0.008 NPLC. 8. Average of 100 samples taken at 1μs intervals. Model 2651A specifications Model 2651A specifications SMU INSTRUMENTS www.keithley.com 1.888.KEITHLEY (U.S. only) A Greater Measure of Confidence 2651A 50A, High Power System SourceMeter® SMU Instrument DC POWER SPECIFICATIONS Maximum output power : 202W maximum. Source /Sink Limits 1: Voltage: ±10.1V at ±20.0A, ±20.2V at ±10.0A, ±40.4V at ±5.0A 2. Four-quadrant source or sink operation. Current: ±5.05A at ±40V 2, ±10.1A at ±20V, ±20.2A at ±10V Four-quadrant source or sink operation. CAUTION: Carefully consider and configure the appropriate output-off state and source and compliance levels before connecting the Model 2651A to a device that can deliver energy. Failure to consider the output-off state and source and compliance levels may result in damage to the instrument or to the device under test. Pulse SPECIFICATIONS Minimum programmable pulse width 3: 100μs. Note: Minimum pulse width for settled source at a given I/V output and load can be longer than 100μs. Pulse width programming resolution : 1μs. Pulse width programming accurac y 3: ±5μs. Pulse width jitter : 2μs (typical). Pulse Rise Time (typical ): Current Range Rload Rise Time (typical) 50 A 0.05 W 26 μs 50 A 0.2 W 57 μs 50 A 0.4 W 85 μs 20 A 0.5 W 95 μs 50 A 0.8 W 130 μs 20 A 1 W 180 μs 10 A 2 W 330 μs 5 A 8.2 W 400 μs +20A +30A +50A –50A –10A +10A +5A –5A –20A –30A –20V –10V 0V +10V +20V 0A –40V +40V Pulse DC 3 4 7 5 6 2 1 Region Region Maximums Maximum Pulse Width 3 Maximum Duty Cycle 4 1 5 A at 40 V DC, no limit 100% 1 10 A at 20 V DC, no limit 100% 1 20 A at 10 V DC, no limit 100% 2 30 A at 10 V 1 ms 50% 3 20 A at 20 V 1.5 ms 40% 4 10 A at 40 V 1.5 ms 40% 5 50 A at 10 V 1 ms 35% 6 50 A at 20 V 330 μs 10% 7 50 A at 40 V 300 μs 1% NOTES 1. Full power source operation regardless of load to 30°C ambient. Above 30°C or power sink operation, refer to “Operating Boundaries” in the Model 2651A Reference manual for additional power derating information. 2. Quadrants 2 and 4 power envelope is trimmed at 36V and 4.5A. 3. Times measured from the start of pulse to the start off-time; see figure below. Pulse Level Bias Level Start ton Start toff 90% 10% ton toff 10% 4. Thermally limited in sink mode (quadrants 2 and 4) and ambient temperatures above 30°C. See power equations in the Model 2651A Reference Manual for more information. Model 2651A specifications Model 2651A specifications The Model 2651A supports GPIB, LXI, Digital I/O, and Keithley’s TSP-Link Technology for multi-channel synchronization. SMU INSTRUMENTS A Greater Measure of Confidence www.keithley.com 1.888.KEITHLEY (U.S. only) 2651A 50A, High Power System SourceMeter® SMU Instrument ADDITIONAL SOUR CE SPECIFICATIONS Noise (10Hz to 20MHz): <100mV peak-peak (typical), <30mV RMS (typical), 10V range with a 20A limit. Overshoot : Voltage: <±(0.1% + 10mV) (typical). Step size = 10% to 90% of range, resistive load, maximum current limit/compliance. Current: <±(0.1% + 10mV) (typical). Step Size = 10% to 90% of range, resistive load. See Current Source Output Settling Time specifications for additional test conditions. Range change overshoot : Voltage: <300mV + 0.1% of larger range (for <20V ranges) (typical). <400mV + 0.1% of larger range (for ≥20V ranges) (typical). Overshoot into a 100kW load, 20MHz bandwidth. Current: <5% of larger range + 360mV/Rload (for >10μA ranges) (typical). Iout × Rload = 1V. Voltage source output settling time : Time required to reach within 0.1% of final value after source level command is processed on a fixed range. 1 Range Settling Time (typical) 1 V < 70 μs 10 V <160 μs 20 V <190 μs 40 V <175 μs Current source output settling time : Time required to reach within 0.1% of final value after source level command is processed on a fixed range. Values below for Iout × Rload. Current Range Rload Settling time (typical) 20 A 0.5 W <195 μs 10 A 1.5 W <540 μs 5 A 5 W <560 μs 1 A 1 W < 80 μs 100 mA 10 W < 80 μs 10 mA 100 W <210 μs 1 mA 1 kW <300 μ s 100 μA 10 kW <500 μ s 10 μA 100 kW < 15 ms 1 μA 1 MW < 35 ms 100 nA 10 MW <110 ms Transient response time : 10V and 20V Ranges: <70μs for the output to recover to within 0.1% for a 10% to 90% step change in load. 40V Range: <110μs for the output to recover to within 0.1% for a 10% to 90% step change in load. Guard offset voltage : <4mV, current <10mA. Remote sense operating range 2: Maximum Voltage between HI and SENSE HI: 3V. Maximum Voltage between LO and SENSE LO: 3V. Maximum impedance per source lead : Maximum impedance limited by 3V drop by remote sense operating range. Maximum resistance = 3V/source current value (amperes) (maximum of 1W per source lead). 3V = L di/dt. Voltage output headroom : 5A Range: Maximum output voltage = 48.5V – (Total voltage drop across source leads). 10A Range: Maximum output voltage = 24.5V – (Total voltage drop across source leads). 20A Range: Maximum output voltage = 15.9V – (Total voltage drop across source leads). Overtemperature protection : Internally sensed temperature overload puts unit in standby mode. Limit /compliance : Bipolar limit (compliance) set with single value. Voltage 3: Minimum value is 10mV; accuracy is the same as voltage source. Current 4: Minimum value is 10nA; accuracy is the same as current source. NOTES 1. With measure and compliance set to the maximum current for the specified voltage range. 2. Add 50μV to source accuracy specifications per volt of HI lead drop. 3. For sink mode operation (quadrants II and IV), add 0.6% of limit range to the corresponding voltage source accuracy specifications. For 100mV range add an additional 60mV of uncertainty. Specifications apply with sink mode enabled. 4. For sink mode operation (quadrants II and IV), add 0.6% of limit range to the corresponding current limit accuracy specifications. Specifications apply with sink mode enabled. Model 2651A specifications Model 2651A specifications Additi onal Measurement speci fic ati ons Cont act Check 1 Speed Maximum Measurement Time to Memory for 60Hz (50Hz) Accuracy (1 Year) 23° ±5°C ±(% reading + ohms) Fast 1.1 ms (1.2 ms) 5% + 15 W Medium 4.1 ms (5 ms) 5% + 5 W Slow 36 ms (42 ms) 5% + 3 W NOTES 1. Includes measurement of SENSE HI to HI and SENSE LO to LO contact resistances. Additi onal mete r speci fic ati ons Maximum load impedance : Normal Mode: 10nF (typical), 3μH (typical). High-Capacitance Mode: 50μF (typical), 3μH (typical). Common mode voltage : 250V DC. Common mode isolation : >1GW, <4500pF. Measure input impedance : >10GW. Sense high input impedance : >10GW. Maximum sense lead resistance : 1kW for rated accuracy. Overrange : 101% of source range, 102% of measure range. HIGH-CAPACITANCE mO DE 1,2 Accurac y specifications 3: Accuracy specifications are applicable in both normal and highcapacitance modes. Voltage Source Output Settling Time : Time required to reach within 0.1 % of final value after source level command is processed on a fixed range. 4 Voltage Source Range Settling Time with Cload = 4.7μF (typical) 1 V 75 μs 10 V 170 μs 20 V 200 μs 40 V 180 μs Mode change dela y: 100μA Current Range and Above: Delay into High-Capacitance Mode: 11ms. Delay out of High-Capacitance Mode: 11ms. 1μA and 10μA Current Ranges: Delay into High-Capacitance Mode: 250ms. Delay out of High-Capacitance Mode: 11ms. Measure input impedance : >10GW in parallel with 25nF. Voltage source range change overshoot : <400mV + 0.1% of larger range (typical). Overshoot into a 100kW load, 20MHz bandwidth. NOTES 1. High-capacitance mode specifications are for DC measurements only and use locked ranges. Autorange is disabled. 2. 100nA range is not available in high-capacitance mode. 3. Add an additional 2nA to the source current accuracy and measure current accuracy offset for the 1μA range. 4. With measure and compliance set to the maximum current for the specified voltage range. SMU INSTRUMENTS www.keithley.com 1.888.KEITHLEY (U.S. only) A Greater Measure of Confidence 2651A 50A, High Power System SourceMeter® SMU Instrument Measurement Speed Speci fic ati ons 1, 2 Maxim um SWEEP OPERA TION RA TES (operations per second) FOR 60Hz (50Hz): A/D Converter Speed Trigger Origin Measure To Memory Using User Scripts Measure To Gpi b Using User Scripts Source Measure To Memory Using User Scripts Source Measure To Gpi b Using User Scripts Source Measure To Memory Using Sweep API Source Measure To Gpi b Using Sweep API 0.001 NPLC Internal 20000 (20000) 9800 (9800) 7000 (7000) 6200 (6200) 12000 (12000) 5900 (5900) 0.001 NPLC Digital I/O 8100 (8100) 7100 (7100) 5500 (5500) 5100 (5100) 11200 (11200) 5700 (5700) 0.01 NPLC Internal 4900 (4000) 3900 (3400) 3400 (3000) 3200 (2900) 4200 (3700) 4000 (3500) 0.01 NPLC Digital I/O 3500 (3100) 3400 (3000) 3000 (2700) 2900 (2600) 4150 (3650) 3800 (3400) 0.1 NPLC Internal 580 (480) 560 (470) 550 (465) 550 (460) 560 (470) 545 (460) 0.1 NPLC Digital I/O 550 (460) 550 (460) 540 (450) 540 (450) 560 (470) 545 (460) 1.0 NPLC Internal 59 (49) 59 (49) 59 (49) 59 (49) 59 (49) 59 (49) 1.0 NPLC Digital I/O 58 (48) 58 (49) 59 (49) 59 (49) 59 (49) 59 (49) HS ADC Internal 38500 (38500) 18000 (18000) 10000 (10000) 9500 (9500) 14300 (14300) 6300 (6300) HS ADC Digital I/O 12500 (12500) 11500 (11500) 7500 (7500) 7000 (7000) 13200 (13200) 6000 (6000) High Speed ADC Burst MEASUR EMENT RA TES 3 Burst Length (readings) Readings per Second Bursts per Second 100 1,000,000 400 500 1,000,000 80 1000 1,000,000 40 2500 1,000,000 16 5000 1,000,000 8 Maxim um SINGLE MEASUR EMENT RA TES (operations per second) FOR 60Hz (50Hz) A/D Converter Speed Trigger Origin Measure To Gpi b Source Measure To Gpi b Source Measure Pass/Fail To Gpi b 0.001 NPLC Internal 1900 (1800) 1400 (1400) 1400 (1400) 0.01 NPLC Internal 1450 (1400) 1200 (1100) 1100 (1100) 0.1 NPLC Internal 450 (390) 425 (370) 425 (375) 1.0 NPLC Internal 58 (48) 57 (48) 57 (48) Maximum Measurement RANGE CHANGE RATE: >4000 per second for >10μA (typical). Maximum SOURCE Range CHANGE RATE: >325 per second for >10μA, typical. When changing to or from a range ≥1A, maximum rate is >250 per second, typical. COMMAND PROCESSING TIME: Maximum time required for the output to begin to change following the receipt of the smua.source.levelv or smua.source.leveli command. <1ms typical. NOTES 1. Tests performed with a Model 2651A on channel A using the following equipment: Computer hardware (Intel® Pentium® 4 2.4GHz, 2GB RAM, National Instruments™ PCI-GPIB). Driver (NI-488.2 Version 2.2 PCI-GPIB). Software (Microsoft® Windows® XP, Microsoft Visual Studio® 2010, VISA™ version 4.1). 2. Exclude current measurement ranges less than 1mA. 3. smua.measure.adc has to be enabled and the smua.measure.count set to the burst length. TRIGGERING AND SYNCHRO NIZATION SPECIFICATIONS Triggering : Trigger In to Trigger Out: 0.5μs (typical). Trigger In to Source Change 1: 10μs (typical). Trigger Timer Accuracy: ±2μs (typical). Source Change 1 After LXI Trigger: 280μs (typical). Synchroni zation : Single-Node Synchronized Source Change 1: <0.5μs (typical). Multi-Node Synchronized Source Change 1: <0.5μs (typical). NOTES 1. Fixed source range with no polarity change. Model 2651A specifications Model 2651A specifications SMU INSTRUMENTS A Greater Measure of Confidence www.keithley.com 1.888.KEITHLEY (U.S. only) 2651A 50A, High Power System SourceMeter® SMU Instrument SU PPLEMENTAL INFOR MATION FRONT PANEL INTERFACE: Two-line vacuum fluorescent display (VFD) with keypad and navigation wheel. Displa y: Show error messages and user defined messages. Display source and limit settings. Show current and voltage measurements (6½-digit to 4½-digit). View measurements stored in dedicated reading buffers. Keypad Operations : Change host interface settings. Save and restore instrument setups. Load and run factory and user defined test scripts that prompt for input and send results to the display. Store measurements into dedicated reading buffers. PROGRAMMING: Embedded Test Script Processor (TSP®) scripting engine is accessible from any host interface. Responds to individual instrument control commands. Responds to high speed test scripts comprised of instrument control commands and Test Script Language (TSL) statements (for example, branching, looping, and math). Able to execute high speed test scripts stored in memory without host intervention. Minimum User Memor y Available : 16MB (approximately 250,000 lines of TSP code). Test Script Builder : Integrated development environment for building, running, and managing TSP scripts. Includes an instrument console for communicating with any TSP enabled instrument in an interactive manner. Requires: VISA (NI-VISA included on CD), Microsoft® .NET Framework (included on CD), Keithley I/O Layer (included on CD), Intel® Pentium III 800MHz or faster personal computer, Microsoft Windows® 2000, XP, Vista®, or 7. TSP Express (embedded): Tool that allows users to quickly and easily perform common I-V tests without programming or installing software. To run TSP Express, you need: Java™ Platform, Standard Edition 6, Microsoft Internet Explorer®, Mozilla® Firefox®, or another Java-compatible web browser. Software Interface : TSP Express (embedded), direct GPIB/VISA, read/write with Microsoft Visual Basic®, Visual C/C++®, Visual C#®, LabVIEW™, CEC TestPoint™ Data Acquisition Software Package, NI LabWindows™/CVI, etc. READING BUFFERS: Nonvolatile memory uses dedicated storage areas reserved for measurement data. Reading buffers are arrays of measurement elements. Each element can hold the following items: Measurement Measurement status Timestamp Source setting (at the time the measurement was taken) Range information Two reading buffers are reserved for each Model 2651A channel. Reading buffers can be filled using the front panel STORE key and retrieved using the RECALL key or host interface. Buffer Size, with timestamp and source setting: >60,000 samples. Buffer Size, without timestamp and source setting: >140,000 samples. SYSTEM EXPANSION: The TSP-Link expansion interface allows TSP-enabled instruments to trigger and communicate with each other. See figure below. To Additional Nodes Node 1 Node 2 To Host Computer Each Model 2651A has two TSP-Link connectors to make it easier to connect instruments together in sequence. Once source-measure instruments are interconnected through the TSP-Link expansion interface, a computer can access all the resources of each source-measure instrument through the host interface of any Model 2651A. A maximum of 32 TSP-Link nodes can be interconnected. Each source-measure instrument consumes one TSP-Link node. TIMER: Free-running 47-bit counter with 1MHz clock input. Resets each time instrument power is turned on. If the instrument is not turned off, the timer is reset to zero every 4 years. Timestamp: TIMER value is automatically saved when each measurement is triggered. Resolution: 1μs. Timestamp Accuracy: ±100ppm. Model 2651A specifications Model 2651A specifications GENERAL Digital I/O Interface : +5VDC 5.1kW 100W 600mA Solid State Fuse Read by firmware Written by firmware +5V Pin (on DIGITAL I/O connector) Digital I/O Pin (on DIGITAL I/O connector) GND Pin (on DIGITAL I/O connector) Rear Panel Connector: 25-pin female D. Input/Output Pins: 14 open drain I/O bits. Absolute Maximum Input Voltage: 5.25V. Absolute Minimum Input Voltage: –0.25V. Maximum Logic Low Input Voltage: 0.7V, +850μA max. Minimum Logic High Input Voltage: 2.1V, +570μA. Maximum Source Current (flowing out of digital I/O bit): +960μA. Maximum Sink Current At Maximum Logic Low Voltage (0.7): –5.0mA. Absolute Maximum Sink Current (flowing into digital I/O pin): –11mA. 5V Power Supply Pin: Limited to 250mA, solid-state fuse protected. Output Enable Pin: Active high input pulled down internally to ground with a 10kW resistor; when the output enable input function has been activated, the Model 2651A channel will not turn on unless the output enable pin is driven to >2.1V (nominal current = 2.1V/10kW = 210μA). IEEE-488: IEEE-488.1 compliant. Supports IEEE-488.2 common commands and status model topology. RS-232: Baud rates from 300bps to 115200bps. Programmable number of data bits, parity type, and flow control (RTS/CTS hardware or none). When not programmed as the active host interface, the Model 2651A can use the RS-232 interface to control other instrumentation. Ethernet : RJ-45 connector, LXI, 10/100BT, Auto MDIX. LXI compliance : LXI Class C 1.2. Total Output Trigger Response Time: 245μs minimum, 280μs (typical), (not specified) maximum. Receive Lan[0-7] Event Delay: Unknown. Generate Lan[0-7] Event Delay: Unknown. Expansion interface : The TSP-Link Technology expansion interface allows TSP-enabled instruments to trigger and communicate with each other. Cable Type: Category 5e or higher LAN crossover cable. 3 meters maximum between each TSP-enabled instrument. USB: USB 2.0 host controller. Power suppl y: 100V to 250V AC, 50Hz to 60Hz (autosensing), 550VA maximum. Cooling : Forced air; side and top intake and rear exhaust. Warrant y: 1 year. EMC: Conforms to European Union EMC Directive. Safet y: UL listed to UL61010-1:2004. Conforms to European Union Low Voltage Directive. Dimensions : 89mm high × 435mm wide × 549mm deep (3.5 in. × 17.1 in. × 21.6 in.). Bench Configuration (with handle and feet): 104mm high × 483mm wide × 620mm deep (4.1 in. × 19 in. × 24.4 in.). Weight : 9.98kg (22 lbs). Environment : For indoor use only. Altitude : Maximum 2000 meters above sea level. Operatin g: 0° to 50°C, 70% relative humidity up to 35°C. Derate 3% relative humidity/°C, 35° to 50°C. Storage : –25° to 65°C. Product family data sheet Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. CLD-DS57 Rev 2B Cree® XLamp® XQ-B LED PRODUCT DESCRIPTION Cree XLamp XQ-B LEDs revolutionize mid-power LEDs by delivering lighting-class reliability and a wider spread of light than typical plastic packages. The XQ-B’s innovative wide light emission enables a smooth look in replacement tubes and panel lights while reducing system cost by using fewer LEDs. Using Cree’s newest generation of silicon carbide-based LED chips, XQ-B is optimized to dramatically lower system cost in non-directional and outdoor area lighting applications. FEATURES • Cree’s smallest lighting class LED: 1.6 X 1.6 X 1.6 mm • Available in white, 80-minimum CRI white and 70-minimum CRI cool white • 300 mA maximum drive current • Low thermal resistance: 17 °C/W • Wide viewing angle: 140° • Reflow solderable - JEDEC J-STD-020C compatible • Unlimited floor life at ≤ 30 °C/85% RH • RoHS- and REACh‑compliant • UL-recognized component (E349212) www.cree.com/Xlamp Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Table of Contents Characteristics.......................... 2 Flux Characteristics.................... 2 Relative Spectral Power Distribution.............................. 3 Relative Flux vs. Junction Temperature............................. 3 Electrical Characteristics............. 4 Relative Flux vs. Current............ 4 Typical Spatial Distribution.......... 5 Thermal Design......................... 5 Reflow Soldering Characteristics.. 6 Notes....................................... 7 Mechanical Dimensions.............. 8 Tape and Reel........................... 9 Packaging............................... 10 Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 2 xlamp xQ-B led Characteristics Characteristics Unit Minimum Typical Maximum Thermal resistance, junction to solder point °C/W 17 Viewing angle (FWHM) degrees 140 Temperature coefficient of voltage mV/°C -2.0 ESD classification (HBM per Mil-Std-883D) Class 1 DC forward current mA 80 300 Reverse voltage V -5 Forward voltage (@ 80 mA, 25 °C) V 3.0 3.4 LED junction temperature °C 150 Flux Characteristics (TJ = 25 °C) The following table provides several base order codes for XLamp XQ-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XQ-B Binning and Labeling document. Color CCT Range Base Order Codes Minimum Luminous Flux @ 80 mA Calculated Minimum Luminous Flux (lm)* Order Code Min. Max. Group Flux (lm) 150 mA Cool White 5000 K 8300 K K2 30.6 52.5 XQBAWT-00-0000-00000L051 Neutral White 3700 K 5000 K K2 30.6 52.5 XQBAWT-00-0000-00000H0E5 J3 26.8 46 XQBAWT-00-0000-00000HXE5 Warm White 2600 K 3700 K J3 26.8 46 XQBAWT-00-0000-00000HXE7 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Typical CRI for Neutral White, 3700 K - 5000 K CCT is 75. • Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. • Minimum CRI for 70 CRI Minimum Cool White is 70. • Minimum CRI for 80 CRI Minimum White is 80. * Calculated flux values at 150 mA are for reference only. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 3 xlamp xQ-B led Relative Spectral Power Distribution Relative Flux vs. Junction Temperature (IF = 80 mA) Relative Spectral Power 0 20 40 60 80 100 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm) Cool White Neutral White Warm White Relative Flux Output vs. Junction Temperature 0 10 20 30 40 50 60 70 80 90 100 25 50 75 100 125 150 Relative Luminous Flux (%) Junction Temperature (ºC) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 4 xlamp xQ-B led Electrical Characteristics (TJ = 25 °C) Relative Flux vs. Current (TJ = 25 °C) Electrical Characteristics (Tj = 25°C) parallel 0 50 100 150 200 250 300 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 Forward Current (mA) Forward Voltage (V) Relative Intensity vs. Current (Tj = 25°C) parallel 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Relative Luminous Flux (%) Forward Current (mA) Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 5 xlamp xQ-B led Typical Spatial Distribution Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Typical Spatial Radiation Pattern 0 10 20 30 40 50 60 70 80 90 100 110 -90 -70 -50 -30 -10 10 30 50 70 90 Relative Luminous Intensity (%) Angle (º) Thermal Design parallel 0 50 100 150 200 250 300 350 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 20°C/W Rj-a = 25°C/W Rj-a = 30°C/W Rj-a = 35°C/W Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 6 xlamp xQ-B led Reflow Soldering Characteristics In testing, Cree has found XLamp XQ-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 °C 217 °C Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds Peak/Classification Temperature (Tp) 215 °C 260 °C Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 °C/second max. 6 °C/second max. Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. TP TL Temperature Time t 25˚C to Peak Preheat ts tS tP 25 Ramp-down Ramp-up Critical Zone TL to TP Tsmax Tsmin Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 7 xlamp xQ-B led Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp XQ-B LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REACh Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. UL Recognized Component Level 1 enclosure consideration. The LED package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See the LED Eye Safety application note at www.cree.com/xlamp_app_notes/led_eye_safety. Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 8 xlamp xQ-B led Mechanical Dimensions All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm Measurement tolerance: .xx = .13 mm 1.60 0.30 0.50 1.60 0.65 0.50 RECOMMENDED PC BOARD SOLDER PAD XQ PCB SOLDER PAD DWG. NO. REV A SIZE TITLE: 5 4 3 2 1 Goleta, CA 93117 340 Storke Rd Fax (805) 968-9811 Phone (805) 968-9460 XQ_PCBSolderPad 50:1 SHEET 1 OF 1 SCALE M.Youmans TOLERANCE UNLESS SPECIFIED: MILLIMETERS & BEFORE FINISH. DIMENSIONS ARE IN UNLESS OTHERWISE SPECIFIED X° ± 1° .XX ± .13 FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 X° ± 2° .X ± 0.3 DRAWN BY APPROVED MATERIAL FINAL PROTECTIVE FINISH CHECK DATE DATE DATE NOTICE CONFIDENTIAL. THIS PLOT AND THE INFORMATION WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT THIRD ANGLE PROJECTION 8/7/2013 Santa Barbara Technology Center 0.30 1.32 1.32 0.51 RECOMMENDED STENCIL OPENING XQ STENCIL OPENING DWG. NO. REV A SIZE TITLE: 5 4 3 2 1 Goleta, CA 93117 340 Storke Rd Fax (805) 968-9811 Phone (805) 968-9460 XQ_StencilOpening 50:1 SHEET 1 OF SCALE M.Youmans TOLERANCE UNLESS SPECIFIED: MILLIMETERS & BEFORE FINISH. DIMENSIONS ARE IN UNLESS OTHERWISE SPECIFIED X° ± 1° .XX ± .13 FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 X° ± 2° .X ± 0.3 DRAWN BY APPROVED MATERIAL FINAL PROTECTIVE FINISH CHECK DATE DATE DATE NOTICE OF CREE INC. CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT THIRD ANGLE PROJECTION 8/7/2013 Santa Barbara Technology Center Recommended PCB solder pad Recommended stencil opening 0.30 5.00 5.00 SOLDER PAD REFERENCE RECOMMENDED TRACE LAYOUT: MCPCB RECOMMENDED TRACE LAYOUT: MCPCB DWG. NO. REV A SIZE TITLE: Goleta, CA 93117 340 Storke Rd Fax (805) 968-9811 Phone (805) 968-9460 XQ_TraceLayout-MCPCB 20:1 SHEET 1 OF 1 SCALE M.Youmans TOLERANCE UNLESS SPECIFIED: MILLIMETERS & BEFORE FINISH. DIMENSIONS ARE IN UNLESS OTHERWISE SPECIFIED X° ± 1° .XX ± .13 FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 X° ± 2° .X ± 0.3 DRAWN BY APPROVED MATERIAL FINAL PROTECTIVE FINISH CHECK DATE DATE DATE AND THE INFORMATION PROPRIETARY AND CREE, INC. THIS PLOT REPRODUCED OR DISCLOSED TO ANY THE WRITTEN CONSENT THIRD ANGLE PROJECTION 8/7/2013 Santa Barbara Technology Center 0.30 10.00 10.00 4.85 SOLDER PAD REFERENCE RECOMMENDED TRACE LAYOUT: FR4 RECOMMENDED TRACE LAYOUT: FR4 DWG. NO. REV A SIZE TITLE: Goleta, CA 93117 340 Storke Rd Fax (805) 968-9811 Phone (805) 968-9460 XQ_TraceLayout-FR4 10:1 SHEET 1 OF 1 SCALE M.Youmans TOLERANCE UNLESS SPECIFIED: MILLIMETERS & BEFORE FINISH. DIMENSIONS ARE IN UNLESS OTHERWISE SPECIFIED X° ± 1° .XX ± .13 FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 X° ± 2° .X ± 0.3 DRAWN BY APPROVED MATERIAL FINAL PROTECTIVE FINISH CHECK DATE DATE DATE NOTICE OF CREE INC. CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT THIRD ANGLE PROJECTION 8/7/2013 Santa Barbara Technology Center Recommended trace layout: MCPCB Recommended trace layout: FR4 SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.60 1.60 1.41 .600 .600 .300 1.500 1.60± .05 .30 1.60 .65 1.60 .300 1.500 3.300 3.300 45.000 1 /1 2610-00026 A XQx OUTLINE -- -- -- -- -- -- D. CRONIN 5/23/12 REVISONS REV DESCRIPTION BY DATE APP'D RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED TRACE LAYOUT SOLDER PAD REFERENCE NOTCH IS ON CATHODE (-) SIDE SIZE TITLE OF SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 6 5 4 3 2 1 6 5 4 3 2 1 Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.60 1.60 1.41 .600 .600 .300 1.500 1.60± .05 .30 1.60 .65 1.60 .300 1.500 3.300 3.300 45.000 2610-00026 XQx OUTLINE -- -- -- -- -- -- D. CRONIN 5/23/12 REVISONS REV DESCRIPTION BY DATE APP'D RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED TRACE LAYOUT SOLDER PAD REFERENCE NOTCH IS ON CATHODE (-) SIDE SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE C D 6 5 4 3 2 1 6 5 4 3 2 1 Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.60 1.60 1.41 .600 .600 .300 1.500 1.60± .05 .30 1.60 .65 1.60 .300 1.500 3.300 3.300 45.000 2610-00026 XQx OUTLINE -- -- -- -- -- -- D. CRONIN 5/23/12 REVISONS REV DESCRIPTION BY DATE APP'D RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED TRACE LAYOUT SOLDER PAD REFERENCE NOTCH IS ON CATHODE (-) SIDE Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 9 xlamp xQ-B led Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. Measurement tolerances unless indicated otherwise: .xx = .25 mm, .xxx = .125 mm SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 WRITTEN CONSENT DISCLOSED TO ANY INC. THIS PLOT PROPRIETARY AND INFORMATION X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 A A 3.50 ±.10 .30 ± .10 1.85 1.65 1.750 8.000 NOMINAL 8.30 MAX 1.000 +.10 -.00 1.500 4.000 2.000 REV DESCRIPTION BY DATE APP'D 4.000 1 /1 2402-00023 A Carrier Tape, 1.7X1.7 XPQ D. CRONIN 5/31/12 cumulative tolerance ± 0.2mm REFERENCE VENDOR PART NUMBER 021142 CATHODE SIDE ANODE SIDE Loaded Pockets (2,000 Lamps) Leader 400 mm (min) of empty pockets with at least 100 mm sealed by tape (50 empty pockets min.) Trailer 160 mm (min) of empty pockets sealed with tape (20 pockets min.) END START Cathode Side Anode Side (denoted by + and circle) 2.5 ±.1 1.5 ±.1 8.0 ±.1 4.0 ±.1 1.75 ±.10 12.0 .0 +.3 13mm 7" Cover Tape Pocket Tape User Feed Direction User Feed Direction Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 10 xlamp xQ-B led Packaging The diagrams below show the packaging and labels Cree uses to ship XLamp XQ-B LEDs. XLamp XQ-B LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Patent Label (on bottom of box) Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Code, Qty, Reel ID Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Unpackaged Reel Packaged Reel Boxed Reel CREE Bin Code & Barcode Label Vacuum-Sealed Moisture Barrier Bag Label with Customer P/N, Qty, Lot #, PO # Label with Cree Bin Code, Qty, Lot # Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Patent Label Label with Customer Order Code, Qty, Reel ID, PO # CLD-DS36 Rev 7A Product family data sheet/ bINNING AND lABELING dOCUMENT Cree® XLamp® MT-G EasyWhite® LEDs WWW.CREE.COM/XLAMP Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Product Description The XLamp MT-G EasyWhite LED maximizes lumen density, eliminates chromaticity binning, and enables luminaire and bulb manufacturers to deliver consistent color and high efficacy light output in a new, compact, multi-die package. XLamp MT-G EasyWhite LEDs can reduce LED-to-LED color variation to within a 2‑step MacAdam ellipse, 94% smaller than the total area of the corresponding ANSI C78.377 color region. The XLamp MT-G EasyWhite LED is the perfect choice for lighting applications where high luminous flux output is required from a single, small point source. Example applications include: LED retrofit bulbs, commercial/retail display spotlights, and other indoor general illumination applications. FEATURES • Cree EasyWhite color temperatures from 2700 K to 5000 K CCT • Wide range of operating power - up to 25 W • 85 °C binning and characterization • Two voltage options: 6 V, 36 V • Low effective thermal resistance: 1.5 °C/W • High lumen density • Wide viewing angle: 120° • 80-minimum CRI at 2700 K and 3000 K CCT • 85- and 90-minimum CRI available in 2700 K and 3000 K CCT • Electrically neutral thermal path • RoHS- and REACh-compliant • UL-recognized component (E349212) Applications • MR, PAR and other directional retrofit bulbs • Commercial/residential directional lighting • General illumination www.cree.com/xlamp Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Table of contents Characteristics........................... 2 Flux Characteristics, Standard Order Codes, Bins....................... 3 Relative Spectral Power Distribution............................... 6 Relative Luminous Flux vs. Junction Temperature.................. 6 Electrical Characteristics.............. 7 Relative Luminous Flux vs Current .8 Typical Spatial Distribution........... 9 Performance Groups – Brightness.9 Performance Groups – Chromaticity.............................10 Cree EasyWhite Color Temperatures Plotted on the 1931 CIE Curve....11 Bin and Order Code Format.........11 Standard Order Codes and Bins .12 Reflow Soldering Characteristics..13 Notes.......................................14 Mechanical Dimensions..............15 Tape and Reel...........................16 Packaging.................................17 xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 2 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Characteristics Characteristics Unit Minimum Typical Maximum Viewing angle (FWHM) degrees 120 ESD withstand voltage (HBM per Mil-Std-883D) V 8000 Effective thermal resistance, junction to solder point °C/W 1.5 LED junction temperature °C 150 DC forward current (6 V) mA 1100 4000 DC forward current (36 V) mA 185 700 Forward voltage (6 V, 1100 mA, 85 °C) V 5.6 6.7 Forward voltage (36 V, 185 mA, 85 °C) V 33.5 40.2 Temperature coefficient of voltage (6 V) mV/°C -4.5 Temperature coefficient of voltage (36 V) mV/°C -27 Reverse voltage (6 V) V -5 Reverse current (6V, 36 V) mA 0.1 xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 3 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Flux Characteristics, Standard Order Codes, Bins, 6 VolT MT-G (1100 mA, Tj = 85 °C) The following table provides several base order codes for 6 Volt XLamp MT-G EasyWhite LEDs. For a complete description of the order-code nomenclature, please reference page 11 of this document. Color CCT Range Base Order Codes Min. Luminous Flux @ 1100 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region Standard CRI EasyWhite 5000 K H0 560 642 50H MTGEZW-00-0000-0B00H050H 50F MTGEZW-00-0000-0B00H050F J0 600 688 MTGEZW-00-0000-0B00J050H MTGEZW-00-0000-0B00J050F K0 650 745 MTGEZW-00-0000-0B00K050H MTGEZW-00-0000-0B00K050F 4000 K G0 520 596 40H MTGEZW-00-0000-0B00G040H 40F MTGEZW-00-0000-0B00G040F H0 560 642 MTGEZW-00-0000-0B00H040H MTGEZW-00-0000-0B00H040F J0 600 688 MTGEZW-00-0000-0B00J040H MTGEZW-00-0000-0B00J040F 3500 K F0 480 550 35H MTGEZW-00-0000-0B00F035H 35F MTGEZW-00-0000-0B00F035F G0 520 596 MTGEZW-00-0000-0B00G035H MTGEZW-00-0000-0B00G035F H0 560 642 MTGEZW-00-0000-0B00H035H MTGEZW-00-0000-0B00H035F 3000 K F0 480 550 30H MTGEZW-00-0000-0B00F030H 30F MTGEZW-00-0000-0B00F030F G0 520 596 MTGEZW-00-0000-0B00G030H MTGEZW-00-0000-0B00G030F H0 560 642 MTGEZW-00-0000-0B00H030H MTGEZW-00-0000-0B00H030F 2700 K E0 440 504 27H MTGEZW-00-0000-0B00E027H 27F MTGEZW-00-0000-0B00E027F F0 480 550 MTGEZW-00-0000-0B00F027H MTGEZW-00-0000-0B00F027F G0 520 596 MTGEZW-00-0000-0B00G027H MTGEZW-00-0000-0B00G027F Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Minimum CRI for EasyWhite color temperatures 27F, 27H, 30F, 30H is 80. • Minimum CRI for EasyWhite color temperatures 35F, 35H, 40F, 40H is 77. • Typical CRI for EasyWhite color temperatures 35F, 35H, 40F, 40H is 80. • Minimum CRI for EasyWhite color temperature 50F, 50H is 75. * Flux values @ 25 °C are calculated and for reference only. xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Flux Characteristics, Standard Order Codes, Bins, 36 VolT MT-G (185 mA, Tj = 85 °C) The following table provides several base order codes for 36 Volt XLamp MT-G EasyWhite LEDs. For a complete description of the order-code nomenclature, please reference page 11 of this document. Color CCT Range Base Order Codes Min. Luminous Flux @ 185 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region Standard CRI EasyWhite 5000 K H0 560 647 50H MTGEZW-00-0000-0N00H050H 50F MTGEZW-00-0000-0N00H050F J0 600 693 MTGEZW-00-0000-0N00J050H MTGEZW-00-0000-0N00J050F K0 650 751 MTGEZW-00-0000-0N00K050H MTGEZW-00-0000-0N00K050F 4000 K G0 520 601 40H MTGEZW-00-0000-0N00G040H 40F MTGEZW-00-0000-0N00G040F H0 560 647 MTGEZW-00-0000-0N00H040H MTGEZW-00-0000-0N00H040F J0 600 693 MTGEZW-00-0000-0N00J040H MTGEZW-00-0000-0N00J040F 3500 K F0 480 555 35H MTGEZW-00-0000-0N00F035H 35F MTGEZW-00-0000-0N00F035F G0 520 601 MTGEZW-00-0000-0N00G035H MTGEZW-00-0000-0N00G035F H0 560 647 MTGEZW-00-0000-0N00H035H MTGEZW-00-0000-0N00H035F 3000 K F0 480 555 30H MTGEZW-00-0000-0N00F030H 30F MTGEZW-00-0000-0N00F030F G0 520 601 MTGEZW-00-0000-0N00G030H MTGEZW-00-0000-0N00G030F H0 560 647 MTGEZW-00-0000-0N00H030H MTGEZW-00-0000-0N00H030F 2700 K E0 440 508 27H MTGEZW-00-0000-0N00E027H 27F MTGEZW-00-0000-0N00E027F F0 480 555 MTGEZW-00-0000-0N00F027H MTGEZW-00-0000-0N00F027F G0 520 601 MTGEZW-00-0000-0N00G027H MTGEZW-00-0000-0N00G027F Flux Characteristics, Standard Order Codes, Bins, 85 cri, 6 VolT MT-G (1100 mA, Tj = 85 °C) Color CCT Range Base Order Codes Min. Luminous Flux @ 1100 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region 85 CRI EasyWhite 3000 K D0 400 458 30H MTGEZW-00-0000-0B0PD030H 30F MTGEZW-00-0000-0B0PD030F E0 440 504 MTGEZW-00-0000-0B0PE030H MTGEZW-00-0000-0B0PE030F F0 480 550 MTGEZW-00-0000-0B0PF030H MTGEZW-00-0000-0B0PF030F 2700 K D0 400 458 27H MTGEZW-00-0000-0B0PD027H 27F MTGEZW-00-0000-0B0PD027F E0 440 504 MTGEZW-00-0000-0B0PE027H MTGEZW-00-0000-0B0PE027F Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Minimum CRI for EasyWhite color temperatures 27F, 27H, 30F, 30H is 80. • Minimum CRI for EasyWhite color temperatures 35F, 35H, 40F, 40H is 77. • Typical CRI for EasyWhite color temperatures 35F, 35H, 40F, 40H is 80. • Minimum CRI for EasyWhite color temperature 50F, 50H is 75. * Flux values @ 25 °C are calculated and for reference only. xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 5 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Flux Characteristics, Standard Order Codes, Bins, 85 cri, 36 VolT MT-G (185 mA, Tj = 85 °C) Color CCT Range Base Order Codes Min. Luminous Flux @ 185 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region 85 CRI EasyWhite 3000 K D0 400 462 30H MTGEZW-00-0000-0N0PD030H 30F MTGEZW-00-0000-0N0PD030F E0 440 508 MTGEZW-00-0000-0N0PE030H MTGEZW-00-0000-0N0PE030F F0 480 555 MTGEZW-00-0000-0N0PF030H MTGEZW-00-0000-0N0PF030F 2700 K D0 400 462 27H MTGEZW-00-0000-0N0PD027H 27F MTGEZW-00-0000-0N0PD027F E0 440 508 MTGEZW-00-0000-0N0PE027H MTGEZW-00-0000-0N0PE027F Flux Characteristics, Standard Order Codes, Bins, 90 cri, 6 VolT MT-G (1100 mA, Tj = 85 °C) Color CCT Range Base Order Codes Min. Luminous Flux @ 1100 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region 90 CRI EasyWhite 3000 K C0 370 424 30H MTGEZW-00-0000-0B0UC030H 30F MTGEZW-00-0000-0B0UC030F D0 400 458 MTGEZW-00-0000-0B0UD030H MTGEZW-00-0000-0B0UD030F E0 440 504 MTGEZW-00-0000-0B0UE030H MTGEZW-00-0000-0B0UE030F 2700 K B0 340 390 27H MTGEZW-00-0000-0B0UB027H 27F MTGEZW-00-0000-0B0UB027F C0 370 424 MTGEZW-00-0000-0B0UC027H MTGEZW-00-0000-0B0UC027F D0 400 458 MTGEZW-00-0000-0B0UD027H MTGEZW-00-0000-0B0UD027F Flux Characteristics, Standard Order Codes, Bins, 90 cri, 36 VolT MT-G (185 mA, Tj = 85 °C) Color CCT Range Base Order Codes Min. Luminous Flux @ 185 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region 90 CRI EasyWhite 3000 K C0 370 428 30H MTGEZW-00-0000-0N0UC030H 30F MTGEZW-00-0000-0N0UC030F D0 400 462 MTGEZW-00-0000-0N0UD030H MTGEZW-00-0000-0N0UD030F E0 440 508 MTGEZW-00-0000-0N0UE030H MTGEZW-00-0000-0N0UE030F 2700 K B0 340 393 27H MTGEZW-00-0000-0N0UB027H 27F MTGEZW-00-0000-0N0UB027F C0 370 428 MTGEZW-00-0000-0N0UC027H MTGEZW-00-0000-0N0UC027F D0 400 462 MTGEZW-00-0000-0N0UD027H MTGEZW-00-0000-0N0UD027F Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. * Flux values @ 25 °C are calculated and for reference only. xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 6 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Relative Spectral Power Distribution (6 V, 1100 mA; 36 V, 185 mA; TJ= 85 °C) The following graph represents typical spectral output of the XLamp MT-G EasyWhite LED. Relative Luminous Flux vs. Junction Temperature (6 V, 1100 ma; 36 V, 185 mA) The following graph represents typical performance of the XLamp MT-G EasyWhite LED. Relative Spectral Power Distribution White The following graph represents typical spectral output of each die of the MT-G 0 20 40 60 80 100 400 450 500 550 600 650 700 750 Relative Spectral Power (%) Wavelength (nm) Warm White Cool White Relative Flux Output vs. Junction Temperature (If = 1100 mA, or 183.33 if @ 36V) The following graph represents typical performance of each LED die in the XLamp MT-G 0% 20% 40% 60% 80% 100% 120% 20 40 60 80 100 120 140 Relative Luminous Flux Junction Temperature ( º C) xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 7 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Electrical Characteristics (TJ = 85 °C) Electrical Characteristics (Tsp = 85ºC) 6V 0 500 1000 1500 2000 2500 3000 3500 4000 5 5.25 5.5 5.75 6 6.25 Current (mA) Forward Voltage V MT-G 6V 36V 0 100 200 300 400 500 600 700 31.00 32.00 33.00 34.00 35.00 36.00 37.00 38.00 Current (mA) Forward Voltage V MT-G 36V xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Relative Luminous Flux vs Current (TJ = 85 °C) Relative Intensity vs. Current (Tsp = 85ºC) 0% 50% 100% 150% 200% 250% 300% 0 500 1000 1500 2000 2500 3000 3500 4000 Relative Luminous Flux (%) Forward Current, Pulsed (mA) MT-G 6V @ 36V) 0% 50% 100% 150% 200% 250% 300% 0 100 200 300 400 500 600 700 Relative Luminous Flux (%) Forward Current, Pulsed (mA) MT-G 36V xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 9 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Typical Spatial Distribution The following graph represents typical performance of the XLamp MT-G EasyWhite LED. Performance Groups – Brightness (TJ = 85 °C) XLamp MT-G EasyWhite LEDs are tested for luminosity and placed into one of the following bins. Group Code Min. Luminous Flux @ 1100 mA, 6 V; @185 mA, 36 V Max. Luminous Flux @ 1100 mA, 6 V; @185 mA, 36 V A0 310 340 B0 340 370 C0 370 400 D0 400 440 E0 440 480 F0 480 520 G0 520 560 H0 560 600 J0 600 650 K0 650 700 Spatial Distribution 0 20 40 60 80 100 -90 -60 -30 0 30 60 90 Relative Luminous Intensity (%) Angle (º) xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Performance Groups – Chromaticity (TJ = 85 °C) XLamp MT-G EasyWhite LEDs are tested for chromaticity and placed into one of the regions defined by the following bounding coordinates. EasyWhite Color Temperatures – 4-Step Code CCT x y 50F 5000K 0.3407 0.3459 0.3415 0.3586 0.3499 0.3654 0.3484 0.3521 40F 4000K 0.3744 0.3685 0.3782 0.3837 0.3912 0.3917 0.3863 0.3758 35F 3500K 0.3981 0.3800 0.4040 0.3966 0.4186 0.4037 0.4116 0.3865 30F 3000K 0.4242 0.3919 0.4322 0.4096 0.4449 0.4141 0.4359 0.3960 27F 2700K 0.4475 0.3994 0.4573 0.4178 0.4695 0.4207 0.4589 0.4021 EasyWhite Color Temperatures – 2-Step Code CCT x y 50H 5000K 0.3429 0.3507 0.3434 0.3571 0.3475 0.3604 0.3469 0.3539 40H 4000K 0.3784 0.3741 0.3804 0.3818 0.3867 0.3857 0.3844 0.3778 35H 3500K 0.4030 0.3857 0.4061 0.3941 0.4132 0.3976 0.4099 0.3890 30H 3000K 0.4291 0.3973 0.4333 0.4062 0.4395 0.4084 0.4351 0.3994 27H 2700K 0.4528 0.4046 0.4578 0.4138 0.4638 0.4152 0.4586 0.4060 xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 11 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Cree EasyWhite Color Temperatures Plotted on the 1931 CIE Curve (TJ = 85 °C) Bin and Order Code Format Bin codes and order codes are configured as follows: Order Code B in Code 2700K 3000K 3500K 4000K 4500K 5000K 5700K 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 0.49 CCy CCx ANSI C78.377 Quadrangle EasyWhite 4-step EasyWhite 2-step SSSCCC-BB-HHHH-NNNRNNNNN Series MTG = MT-G Internal code Internal code CRI Specification U = 90 min CRI P = 85 min CRI 0 = standard CRI Kit code Vf class: B0 = 6-V class N0 = 36-V class Reel size 0 = 500 (standard) 1 = 100 (nonstandard) Color EZW = EasyWhite SSSCCC-BB-WWW-FF-NNRAAAA Series MTG = MT-G Internal code Flux bin CRI Specification U = 90 min CRI P = 85 min CRI H = 80 min CRI E = 77 min CRI D = 75 min CRI Internal Code Vf class: B0 = 6-V class N0 = 36-V class Chromaticity bin Color EZW = EasyWhite xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Standard Order Codes and Bins (XLamp MT-G EasyWhite) XLamp MT-G EasyWhite LED Standard Order Codes Min. Luminous Flux (lm) @ Tj=85 °C, 6 V, 1100 mA @ Tj=85 °C, 36 V, 185 mA Chromaticity Regions 6V Order Code 36V Order Code Group Flux (lm) EasyWhite D0 400 27F MTGEZW-00-0000-0B00D027F MTGEZW-00-0000-0N00D027F 27H MTGEZW-00-0000-0B00D027H MTGEZW-00-0000-0N00D027H E0 440 27F MTGEZW-00-0000-0B00E027F MTGEZW-00-0000-0N00E027F 27H MTGEZW-00-0000-0B00E027H MTGEZW-00-0000-0N00E027H 30F MTGEZW-00-0000-0B00E030F MTGEZW-00-0000-0N00E030F 30H MTGEZW-00-0000-0B00E030H MTGEZW-00-0000-0N00E030H 35F MTGEZW-00-0000-0B00E035F MTGEZW-00-0000-0N00E035F 35H MTGEZW-00-0000-0B00E035H MTGEZW-00-0000-0N00E035H F0 480 27F MTGEZW-00-0000-0B00F027F MTGEZW-00-0000-0N00F027F 27H MTGEZW-00-0000-0B00F027H MTGEZW-00-0000-0N00F027H 30F MTGEZW-00-0000-0B00F030F MTGEZW-00-0000-0N00F030F 30H MTGEZW-00-0000-0B00F030H MTGEZW-00-0000-0N00F030H 35F MTGEZW-00-0000-0B00F035F MTGEZW-00-0000-0N00F035F 35H MTGEZW-00-0000-0B00F035H MTGEZW-00-0000-0N00F035H 40F MTGEZW-00-0000-0B00F040F MTGEZW-00-0000-0N00F040F 40H MTGEZW-00-0000-0B00F040H MTGEZW-00-0000-0N00F040H G0 520 27F MTGEZW-00-0000-0B00G027F MTGEZW-00-0000-0N00G027F 27H MTGEZW-00-0000-0B00G027H MTGEZW-00-0000-0N00G027H 30F MTGEZW-00-0000-0B00G030F MTGEZW-00-0000-0N00G030F 30H MTGEZW-00-0000-0B00G030H MTGEZW-00-0000-0N00G030H 35F MTGEZW-00-0000-0B00G035F MTGEZW-00-0000-0N00G035F 35H MTGEZW-00-0000-0B00G035H MTGEZW-00-0000-0N00G035H 40F MTGEZW-00-0000-0B00G040F MTGEZW-00-0000-0N00G040F 40H MTGEZW-00-0000-0B00G040H MTGEZW-00-0000-0N00G040H H0 560 30F MTGEZW-00-0000-0B00H030F MTGEZW-00-0000-0N00H030F 30H MTGEZW-00-0000-0B00H030H MTGEZW-00-0000-0N00H030H 35F MTGEZW-00-0000-0B00H035F MTGEZW-00-0000-0N00H035F 35H MTGEZW-00-0000-0B00H035H MTGEZW-00-0000-0N00H035H 40F MTGEZW-00-0000-0B00H040F MTGEZW-00-0000-0N00H040F 40H MTGEZW-00-0000-0B00H040H MTGEZW-00-0000-0N00H040H 50F MTGEZW-00-0000-0B00H050F MTGEZW-00-0000-0N00H050F 50H MTGEZW-00-0000-0B00H050H MTGEZW-00-0000-0N00H050H J0 600 40F MTGEZW-00-0000-0B00J040F MTGEZW-00-0000-0N00J040F 40H MTGEZW-00-0000-0B00J040H MTGEZW-00-0000-0N00J040H 50F MTGEZW-00-0000-0B00J050F MTGEZW-00-0000-0N00J050F 50H MTGEZW-00-0000-0B00J050H MTGEZW-00-0000-0N00J050H K0 650 50F MTGEZW-00-0000-0B00K050F MTGEZW-00-0000-0N00K050F 50H MTGEZW-00-0000-0B00K050H MTGEZW-00-0000-0N00K040H xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 13 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Reflow Soldering Characteristics In testing, Cree has found XLamp MT-G EasyWhite LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 °C 217 °C Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds Peak/Classification Temperature (Tp) 215 °C 260 °C Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 °C/second max. 6 °C/second max. Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to the topside of the package, measured on the package body surface. xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 14 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Moisture Sensitivity In testing, Cree has found XLamp MT-G EasyWhite LEDs to have unlimited floor life in conditions ≤ 30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Ecology section of www.cree.com. REAC h Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notices of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh Declaration. Historical REACh banned substance information (substances restricted or banned in the EU prior to 2010) is also available upon request. UL Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the Cree LED Eye Safety Application Note (www.cree.com/xlamp_app_notes/led_eye_safety). xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 15 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Mechanical Dimensions All measurements are ±.13 mm unless otherwise indicated. SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 5 4 3 2 1 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 WITHOUT THE WRITTEN CONSENT REPRODUCED OR DISCLOSED TO ANY INFORMATION OF CREE, INC. THIS PLOT THE PROPRIETARY AND THIS PLOT AND THE INFORMATION NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 9.113 9.113 .650 4.85 ±.25 R4.100 8.90 .950 .500 6.000 8.90 8.900 8.900 6.000 .950 .500 6.198 .889 1.090 1.905 1.072 1.905 8.839 .889 .937 .937 1.722 3.175 3.175 1.090 8.072 9.000 1 /1 2610-00011 C TIGER 9191 OUTLINE D. CRONIN 10/8/10 REVISONS REV DESCRIPTION BY DATE APP'D A INITIAL RELEASE DC 10/8/10 B CHANGED SOLDER PAD VIEW DC 1/11/11 C ADDED STENCIL VIEW DC 2/18/11 RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PATTERN THIRD ANGLE PROJECTION A B C D 6 5 4 3 6 5 4 3 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° .XXX .XX .X FOR SHEET METAL .XX .XXX X° UNLESS OTHERWISE DIMENSIONS MILLIMETERS AND TOLERANCE UNLESS SURFACE FINISH: 9.113 9.113 .650 4.85 ±.25 R4.100 8.900 8.900 6.000 .950 .950 .500 .500 6.198 .889 1.090 1.905 1.072 1.905 8.839 .889 .937 .937 1.722 3.175 3.175 1.090 8.072 RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PATTERN SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 8.90 8.90 .650 4.85 ±.25 R4.100 8.90 .950 .500 6.000 8.90 8.900 8.900 6.000 .950 .500 6.198 .889 1.090 1.905 1.072 1.905 8.839 .889 .937 .937 1.722 3.175 3.175 1.090 8.072 9.000 1 /1 2610-00011 D TIGER 9191 OUTLINE D. CRONIN 10/8/10 REVISONS REV DESCRIPTION BY DATE APP'D A INITIAL RELEASE DC 10/8/10 B CHANGED SOLDER PAD VIEW DC 1/11/11 C ADDED STENCIL VIEW DC 2/18/11 D CHANGED OVERALL DIM TO MATCH CUT LENGTH AND WIDTH DC 3/25/11 RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PATTERN SIZE TITLE C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 6 5 4 3 2 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 8.900 8.900 6.000 .950 .500 6.198 .889 1.090 1.905 1.072 1.905 8.839 .889 .937 .937 1.722 3.175 3.175 1.090 8.072 8.90 8.90 4.85 ±.25 R4.100 .650 8.90 8.90 .950 .500 6.000 9.000 2610-36V MT-G D. CRONIN 10/8/10 REVISONS REV DESCRIPTION A INITIAL RELEASE RECOMMENDED PC BOARD SOLDER PAD RECOMMENDED STENCIL PATTERN MT-G 6V MT-G36V ANODE ANODE xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 16 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION X° ± .5 ° .XXX ± .010 .XX ± .03 .X ± .06 FOR SHEET METAL PARTS ONLY .XX ± .01 .XXX ± .005 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SCALE A B C D 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTANED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE SURFACE FINISH: 63 330 +.25 -.75 12.4 +1.0 -.5 MEASURED AT EDGE 16.4 +0.2 .0 MEASURED AT HUB 12.4 +.2 .0 MEASURED AT HUB 13.1 ±.2 1.9±.4 21±.4 60° 60° 0.500 1 /1 2400-00009 A REEL, 13" X 12MM, 3 PIECE SNAP - ANTI-STATIC HIPS -- -- -- -- D. CRONIN 09/29/09 2400-00009 INDEX QTY ITEM COMMENTS 1 1 2400-00009-CORE 2 2 2400-00009-REEL REVISONS REV DESCRIPTION BY DATE APP'D SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 Trailer 160mm (min) of empty pockets sealed with tape (15 pockets min.) Loaded Pockets (500 Lamps) 12±.1 5.25 16 +.3 -.0 1.75 ±.10 4±.10 Leader 400mm (min) of empty pockets sealed with tape (35 pockets min.) 9.4 3.000 1 /1 2402-00016 B MTG LOADING SPEC -- -- -- -- -- -- D. CRONIN 1/28/11 REVISONS REV DESCRIPTION BY DATE APP'D A Initial Release DC 1/28/11 B Added missing sprocket holes DDS 10/17/11 END START User Feed Direction CATHODE SIDE ANODE SIDE 1.5± .1 xlamp MT-G EasyWhite LEDs 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 17 Copyright © 2011-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. Packaging Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Dessicant (inside bag) Humidity Indicator Card (inside bag) Patent Label Label with Customer Code, Qty, Reel ID, Patent Label Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Code, Qty, Reel ID Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Unpackaged Reel Packaged Reel Boxed Reel CLD-DS60 Rev 5A Product family data sheet Cree® XLamp® MK-R LEDs WWW.CREE.COM/XLAMP Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Product Description Built on Cree’s revolutionary SC³ Technology™ platform, the XLamp MK‑R LED brings new levels of price and performance to directional LED arrays, enabling lighting manufacturers to create the next generation of high-lumen indoor and outdoor LED lighting systems. In single-LED systems, the XLamp MK‑R, with EasyWhite® color binning, provides the LED industry’s tightest unit-to-unit color consistency. For systems using multiple LEDs, the MK-R enables manufacturers to use fewer LEDs while maintaining light output and color consistency, which translates to lower system cost. The XLamp MK‑R is optimized for directional lighting applications and is a welcome addition to applications requiring high lumen output, a compact optical source and a broad palette of color temperature and CRI values. FEATURES • Available in ANSI white bins as well as 4-step and 2-step EasyWhite bins at 2700 K, 3000 K, 3500 K, 4000 K, 4500 K and 5000 K CCT • Two voltage options: 6 V & 12 V • Low thermal resistance: 1.7 °C/W • Maximum junction temperature: 150 °C • Binned at 85 °C • Viewing angle: 120° • Available in cool white, 70-, 80- and 90‑CRI minimums • Unlimited floor life at ≤ 30 ºC/85% RH • Reflow solderable - JEDEC J‑STD‑020C • Electrically neutral thermal path • RoHS‑ and REACh‑compliant • UL-recognized component (E349212) Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Table of Contents Characteristics....................................2 Flux Characteristics, Standard Order Codes and Bins - 6 V............................3 Flux Characteristics, ANSI White Order Codes and Bins - 6 V............................4 Flux Characteristics, Standard Order Codes and Bins -12 V...........................5 Flux Characteristics, ANSI White Order Codes and Bins - 12 V..........................6 Relative Spectral Power Distribution.......7 Relative Flux vs. Junction Temperature...7 Electrical Characteristics.......................8 Relative Flux vs. Current......................9 Relative Chromaticity vs. Current - Warm White......................................10 Relative Chromaticity vs. Temperature - Warm White......................................11 Typical Spatial Distribution..................11 Thermal Design.................................12 Performance Groups - Brightness.........13 Performance Groups - Chromaticity......14 Cree EasyWhite Bins Plotted on the 1931 CIE Color Space........................17 Cree ANSI White Bins Plotted on the 1931 CIE Color Space........................18 Bin and Order Code Formats...............19 Reflow Soldering Characteristics..........20 Notes...............................................21 Mechanical Dimensions......................22 Tape and Reel...................................23 Packaging.........................................24 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 2 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Characteristics Characteristics Unit Minimum Typical Maximum Thermal resistance, junction to solder point °C/W 1.7 Viewing angle - full width half maximum (FWHM) degrees 120 Temperature coefficient of voltage (6 V, 1400 mA, 85 °C) mV/°C -4 Temperature coefficient of voltage (12 V, 700 mA, 85 °C) mV/°C -8 ESD withstand voltage (HBM per Mil-Std-883D) V 8000 DC forward current (6 V, 1400 mA, 85 °C) mA 2500 DC forward current (12 V, 700 mA, 85 °C) mA 1250 Reverse voltage V -5 Forward voltage (6 V, 1400 mA, 85 °C) V 5.85 7 Forward voltage (12 V, 700 mA, 85 °C) V 11.7 14 LED junction temperature °C 150 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 3 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Flux Characteristics, Standard Order Codes and Bins - 6 V (If = 1400 mA, TJ = 85 °C) The following tables provide order codes for XLamp MK‑R EasyWhite LEDs. For a complete description of the order code nomenclature, please reference Bin and Order Code Formats (page 19). Color CCT Range Base Order Codes Min. Luminous Flux @ 1400 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region 80-CRI EasyWhite 5000 K H2 900 1044 50H MKRAWT-00-0000-0B0HH250H 50F MKRAWT-00-0000-0B0HH250F G4 840 974 MKRAWT-00-0000-0B0HG450H MKRAWT-00-0000-0B0HG450F 4500 K H2 900 1044 45H MKRAWT-00-0000-0B0HH245H 45F MKRAWT-00-0000-0B0HH245F G4 840 974 MKRAWT-00-0000-0B0HG445H MKRAWT-00-0000-0B0HG445F 4000 K H2 900 1044 40H MKRAWT-00-0000-0B0HH240H 40F MKRAWT-00-0000-0B0HH240F G4 840 974 MKRAWT-00-0000-0B0HG440H MKRAWT-00-0000-0B0HG440F 3500 K G4 840 974 35H MKRAWT-00-0000-0B0HG435H 35F MKRAWT-00-0000-0B0HG435F G2 780 905 MKRAWT-00-0000-0B0HG235H MKRAWT-00-0000-0B0HG235F 3000 K G4 840 974 30H MKRAWT-00-0000-0B0HG430H 30F MKRAWT-00-0000-0B0HG430F G2 780 905 MKRAWT-00-0000-0B0HG230H MKRAWT-00-0000-0B0HG230F 2700 K G2 780 905 27H MKRAWT-00-0000-0B0HG227H 27F MKRAWT-00-0000-0B0HG227F F4 730 847 MKRAWT-00-0000-0B0HF427H MKRAWT-00-0000-0B0HF427F 90-CRI EasyWhite 3000 K E4 635 737 30H MKRAWT-00-0000-0B0UE430H 30F MKRAWT-00-0000-0B0UE430F E2 590 684 MKRAWT-00-0000-0B0UE230H MKRAWT-00-0000-0B0UE230F 2700 K E2 590 684 27H MKRAWT-00-0000-0B0UE227H 27F MKRAWT-00-0000-0B0UE227F D4 550 638 MKRAWT-00-0000-0B0UD427H MKRAWT-00-0000-0B0UD427F Notes: • Cree maintains a tolerance of ± 7% on flux and power measurements, ± 0.005 on chromaticity (CCx, CCy) measurements and ± 2 on CRI measurements. • Minimum CRI for 80-CRI White is 80. • Minimum CRI for 90-CRI White is 90. * Flux values @ 25 °C are calculated and for reference only. xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Flux Characteristics, ANSI White Order Codes and Bins - 6 V (If = 1400 mA, TJ = 85 °C) XLamp MK-R Standard ANSI Kit Codes Chromaticity Minimum Luminous Flux (lm) @ 1400 mA** Order Codes Kit CCT Code Flux (lm)@ 85 °C Flux (lm) @ 25 °C* 65 CRI Typical 70 CRI Minimum 80 CRI Minimum 90 CRI Minimum ANSI White (2700 K - 8300 K) 51 6200 K J2 1040 1206 MKRAWT-00-0000-0B00J2051 H4 970 1125 MKRAWT-00-0000-0B00H4051 MKRAWT-00-0000-0B0BH4051 H2 900 1044 MKRAWT-00-0000-0B0BH2051 E1 6500 K J2 1040 1206 MKRAWT-00-0000-0B00J20E1 H4 970 1125 MKRAWT-00-0000-0B00H40E1 MKRAWT-00-0000-0B0BH40E1 H2 900 1044 MKRAWT-00-0000-0B0BH20E1 E2 5700 K H4 970 1125 MKRAWT-00-0000-0B00H40E2 MKRAWT-00-0000-0B0BH40E2 H2 900 1044 MKRAWT-00-0000-0B0BH20E2 E3 5000 K H4 970 1125 MKRAWT-00-0000-0B00H40E3 MKRAWT-00-0000-0B0BH40E3 H2 900 1044 MKRAWT-00-0000-0B00H20E3 MKRAWT-00-0000-0B0BH20E3 MKRAWT-00-0000-0B0HH20E3 G4 840 974 MKRAWT-00-0000-0B0HG40E3 E4 4500 K H4 970 1125 MKRAWT-00-0000-0B00H40E4 MKRAWT-00-0000-0B0BH40E4 H2 900 1044 MKRAWT-00-0000-0B00H20E4 MKRAWT-00-0000-0B0BH20E4 MKRAWT-00-0000-0B0HH20E4 G4 840 974 MKRAWT-00-0000-0B0HG40E4 E5 4000 K H2 900 1044 MKRAWT-00-0000-0B00H20E5 MKRAWT-00-0000-0B0BH20E5 MKRAWT-00-0000-0B0HH20E5 G4 840 974 MKRAWT-00-0000-0B00G40E5 MKRAWT-00-0000-0B0BG40E5 MKRAWT-00-0000-0B0HG40E5 E6 3500 K H2 900 1044 MKRAWT-00-0000-0B0BH20E6 G4 840 974 MKRAWT-00-0000-0B0BG40E6 MKRAWT-00-0000-0B0HG40E6 G2 780 905 MKRAWT-00-0000-0B0HG20E6 E7 3000 K G4 840 974 MKRAWT-00-0000-0B0HG40E7 G2 780 905 MKRAWT-00-0000-0B0HG20E7 F4 730 847 F2 680 789 E4 635 737 MKRAWT-00-0000-0B0UE40E7 E2 590 684 MKRAWT-00-0000-0B0UE20E7 E8 2700 K G2 780 905 MKRAWT-00-0000-0B0HG20E8 F4 730 847 MKRAWT-00-0000-0B0HF40E8 F2 680 789 E4 635 737 E2 590 684 MKRAWT-00-0000-0B0UE20E8 D4 550 638 MKRAWT-00-0000-0B0UD40E8 ** Cree XLamp MK‑R order codes specify only a minimum flux bin and not a maximum. Cree may ship reels in flux bins higher than the minimum specified by the order code without advance notice. Shipments will always adhere to the chromaticity restrictions specified by the order code. * Flux values @ 25 °C are calculated and for reference only. • For information on chromaticity bins contained in the kits listed above, please reference the Performance Groups - Chromaticity section starting on page 13. • Minimum CRI for 70-CRI White is 70. xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 5 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Flux Characteristics, Standard Order Codes and Bins -12 V (If = 700 mA, TJ = 85 °C) The following tables provide order codes for XLamp MK‑R EasyWhite LEDs. For a complete description of the order code nomenclature, please reference Bin and Order Code Formats (page 19). Color CCT Range Base Order Codes Min. Luminous Flux @ 700 mA 2-Step Order Code 4-Step Order Code Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* Chromaticity Region Chromaticity Region 80-CRI EasyWhite 5000 K H2 900 1044 50H MKRAWT-00-0000-0D0HH250H 50F MKRAWT-00-0000-0D0HH250F G4 840 974 MKRAWT-00-0000-0D0HG450H MKRAWT-00-0000-0D0HG450F 4500 K H2 900 1044 45H MKRAWT-00-0000-0D0HH245H 45F MKRAWT-00-0000-0D0HH245F G4 840 974 MKRAWT-00-0000-0D0HG445H MKRAWT-00-0000-0D0HG445F 4000 K H2 900 1044 40H MKRAWT-00-0000-0D0HH240H 40F MKRAWT-00-0000-0D0HH240F G4 840 974 MKRAWT-00-0000-0D0HG440H MKRAWT-00-0000-0D0HG440F 3500 K G4 840 974 35H MKRAWT-00-0000-0D0HG435H 35F MKRAWT-00-0000-0D0HG435F G2 780 905 MKRAWT-00-0000-0D0HG235H MKRAWT-00-0000-0D0HG235F 3000 K G4 840 974 30H MKRAWT-00-0000-0D0HG430H 30F MKRAWT-00-0000-0D0HG430F G2 780 905 MKRAWT-00-0000-0D0HG230H MKRAWT-00-0000-0D0HG230F 2700 K G2 780 905 27H MKRAWT-00-0000-0D0HG227H 27F MKRAWT-00-0000-0D0HG227F F4 730 847 MKRAWT-00-0000-0D0HF427H MKRAWT-00-0000-0D0HF427F 90-CRI EasyWhite 3000 K E4 635 737 30H MKRAWT-00-0000-0D0UE430H 30F MKRAWT-00-0000-0D0UE430F E2 590 684 MKRAWT-00-0000-0D0UE230H MKRAWT-00-0000-0D0UE230F 2700 K E2 590 684 27H MKRAWT-00-0000-0D0UE227H 27F MKRAWT-00-0000-0D0UE227F D4 550 638 MKRAWT-00-0000-0D0UD427H MKRAWT-00-0000-0D0UD427F Notes: • Cree maintains a tolerance of ± 7% on flux and power measurements, ± 0.005 on chromaticity (CCx, CCy) measurements and ± 2 on CRI measurements. • Minimum CRI for 80-CRI White is 80. • Minimum CRI for 90-CRI White is 90. * Flux values @ 25 °C are calculated and for reference only. xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 6 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Flux Characteristics, ANSI White Order Codes and Bins - 12 V (If = 700 mA, TJ = 85 °C) XLamp MK-R Standard ANSI Kit Codes Chromaticity Minimum Luminous Flux (lm) @ 700 mA** Order Codes Kit CCT Code Flux (lm)@ 85 °C Flux (lm) @ 25 °C* 65 CRI Typical 70 CRI Minimum 80 CRI Minimum 90 CRI Minimum ANSI White (2700 K - 8300 K) 51 6200 K J2 1040 1206 MKRAWT-00-0000-0D00J2051 H4 970 1125 MKRAWT-00-0000-0D00H4051 MKRAWT-00-0000-0D0BH4051 H2 900 1044 MKRAWT-00-0000-0D0BH2051 E1 6500 K J2 1040 1206 MKRAWT-00-0000-0D00J20E1 H4 970 1125 MKRAWT-00-0000-0D00H40E1 MKRAWT-00-0000-0D0BH40E1 H2 900 1044 MKRAWT-00-0000-0D0BH20E1 E2 5700 K H4 970 1125 MKRAWT-00-0000-0D00H40E2 MKRAWT-00-0000-0D0BH40E2 H2 900 1044 MKRAWT-00-0000-0D0BH20E2 E3 5000 K H4 970 1125 MKRAWT-00-0000-0D00H40E3 MKRAWT-00-0000-0D0BH40E3 H2 900 1044 MKRAWT-00-0000-0D00H20E3 MKRAWT-00-0000-0D0BH20E3 MKRAWT-00-0000-0D0HH20E3 G4 840 974 MKRAWT-00-0000-0D0HG40E3 E4 4500 K H4 970 1125 MKRAWT-00-0000-0D00H40E4 MKRAWT-00-0000-0D0BH40E4 H2 900 1044 MKRAWT-00-0000-0D00H20E4 MKRAWT-00-0000-0D0BH20E4 MKRAWT-00-0000-0D0HH20E4 G4 840 974 MKRAWT-00-0000-0D0HG40E4 E5 4000 K H2 900 1044 MKRAWT-00-0000-0D00H20E5 MKRAWT-00-0000-0D0BH20E5 MKRAWT-00-0000-0D0HH20E5 G4 840 974 MKRAWT-00-0000-0D00G40E5 MKRAWT-00-0000-0D0BG40E5 MKRAWT-00-0000-0D0HG40E5 E6 3500 K H2 900 1044 MKRAWT-00-0000-0D0BH20E6 G4 840 974 MKRAWT-00-0000-0D0BG40E6 MKRAWT-00-0000-0D0HG40E6 G2 780 905 MKRAWT-00-0000-0D0HG20E6 E7 3000 K G4 840 974 MKRAWT-00-0000-0D0HG40E7 G2 780 905 MKRAWT-00-0000-0D0HG20E7 F4 730 847 F2 680 789 E4 635 737 MKRAWT-00-0000-0D0UE40E7 E2 590 684 MKRAWT-00-0000-0D0UE20E7 E8 2700 K G2 780 905 MKRAWT-00-0000-0D0HG20E8 F4 730 847 MKRAWT-00-0000-0D0HF40E8 F2 680 789 E4 635 737 E2 590 684 MKRAWT-00-0000-0D0UE20E8 D4 550 638 MKRAWT-00-0000-0D0UD40E8 ** Cree XLamp MK‑R order codes specify only a minimum flux bin and not a maximum. Cree may ship reels in flux bins higher than the minimum specified by the order code without advance notice. Shipments will always adhere to the chromaticity restrictions specified by the order code. * Flux values @ 25 °C are calculated and for reference only. • For information on chromaticity bins contained in the kits listed above, please reference the Performance Groups - Chromaticity section starting on page 13. • Minimum CRI for 70-CRI White is 70. xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 7 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Relative Spectral Power Distribution (6 V, 1400 mA; 12 V, 700 mA; TJ= 85 °C) Relative Flux vs. Junction Temperature (6 V, IF = 1400 mA; 12 V, IF = 700 mA) Relative Spectral Power 0 20 40 60 80 100 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm) Cool White Neutral White Warm White Relative Flux Output vs. Junction Temperature 0 20 40 60 80 100 120 25 50 75 100 125 150 Relative Luminous Flux (%) Junction Temperature (ºC) xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Electrical Characteristics (TJ = 85 °C) Electrical Characteristics (Tj = 85ºC) 0 500 1000 1500 2000 2500 5.25 5.50 5.75 6.00 6.25 Forward Current (mA) Forward Voltage (V) 6 V Electrical Characteristics (Tj = 85ºC) 0 250 500 750 1000 1250 10.5 11.0 11.5 12.0 12.5 Forward Current (mA) Forward Voltage (V) 12 V xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 9 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Relative Flux vs. Current (TJ = 85 °C) Relative Intensity vs. Current (Tj = 85ºC) 0 30 60 90 120 150 180 0 500 1000 1500 2000 2500 Relative Luminous Flux (%) Forward Current (mA) 6 V Relative Intensity vs. Current (Tj = 85ºC) 0 30 60 90 120 150 180 0 250 500 750 1000 1250 Relative Luminous Flux (%) Forward Current (mA) 12 V xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Relative Chromaticity vs. Current - Warm White (TJ = 85 °C) -0.006 -0.004 -0.002 0.000 0.002 0.004 0.006 0 500 1000 1500 2000 2500 Current (mA) ΔCCx ΔCCy 6 V Relative Chromaticity Vs. Current - Warm White -0.006 -0.004 -0.002 0.000 0.002 0.004 0.006 0 250 500 750 1000 1250 Current (mA) ΔCCx ΔCCy 12 V xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 11 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Relative Chromaticity vs. Temperature - Warm White (6 V, IF = 1400 mA; 12 V, IF = 700 mA) Typical Spatial Distribution Relative Chromaticity Vs. Temperature - Warm White ΔCCx -0.006 -0.004 -0.002 0.000 0.002 0.004 0.006 0 25 50 75 100 125 150 Tsp (°C) ΔCCx ΔCCy Typical Spatial Radiation Pattern 0 20 40 60 80 100 -100 -80 -60 -40 -20 0 20 40 60 80 100 Relative Luminous Intensity (%) Angle (º) xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 0 500 1000 1500 2000 2500 3000 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 2°C/W Rj-a = 4°C/W Rj-a = 6°C/W Rj-a = 8°C/W 6 V Thermal Design 0 200 400 600 800 1000 1200 1400 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 2°C/W Rj-a = 4°C/W Rj-a = 6°C/W Rj-a = 8°C/W 12 V xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 13 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Performance Groups - Brightness (Tj = 85 °C) XLamp MK-R LEDs are tested for luminous flux and placed into one of the following bins. Group Code Min. Luminous Flux Max. Luminous Flux D2 510 550 D4 550 590 E2 590 635 E4 635 680 F2 680 730 F4 730 780 G2 780 840 G4 840 900 H2 900 970 H4 970 1040 J2 1040 1120 J4 1120 1200 K2 1200 1290 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 14 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Performance Groups - Chromaticity (Tj = 85 °C) XLamp MK‑R LEDs are tested for chromaticity and placed into one of the regions defined by the following bounding coordinates. EasyWhite Color Temperatures – 4-Step Code CCT x y 50F 5000 K 0.3407 0.3459 0.3415 0.3586 0.3499 0.3654 0.3484 0.3521 45F 4500 K 0.3674 0.3772 0.3582 0.3710 0.3562 0.3573 0.3642 0.3625 40F 4000 K 0.3744 0.3685 0.3782 0.3837 0.3912 0.3917 0.3863 0.3758 35F 3500 K 0.3981 0.3800 0.4040 0.3966 0.4186 0.4037 0.4116 0.3865 30F 3000 K 0.4242 0.3919 0.4322 0.4096 0.4449 0.4141 0.4359 0.3960 27F 2700 K 0.4475 0.3994 0.4573 0.4178 0.4695 0.4207 0.4589 0.4021 EasyWhite Color Temperatures – 2-Step Code CCT x y 50H 5000 K 0.3429 0.3507 0.3434 0.3571 0.3475 0.3604 0.3469 0.3539 45H 4500 K 0.3643 0.3720 0.3597 0.3689 0.3587 0.3620 0.3628 0.3647 40H 4000 K 0.3784 0.3741 0.3804 0.3818 0.3867 0.3857 0.3844 0.3778 35H 3500 K 0.4030 0.3857 0.4061 0.3941 0.4132 0.3976 0.4099 0.3890 30H 3000 K 0.4291 0.3973 0.4333 0.4062 0.4395 0.4084 0.4351 0.3994 27H 2700 K 0.4528 0.4046 0.4578 0.4138 0.4638 0.4152 0.4586 0.4060 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 15 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Performance Groups - Chromaticity (Tj = 85 °C) - cONTINUED ANSI White Bins Code CCT Bin Code x y Bin Code x y Bin Code x y Bin Code x y 051 6200 K 0A0 0.2920 0.3060 0R0 0.2950 0.2970 1A0 0.3048 0.3207 1R0 0.3068 0.3113 0.2984 0.3133 0.3009 0.3042 0.3130 0.3290 0.3144 0.3186 0.3009 0.3042 0.3037 0.2937 0.3144 0.3186 0.3161 0.3059 0.2950 0.2970 0.2980 0.2880 0.3068 0.3113 0.3093 0.2993 0B0 0.2895 0.3135 0S0 0.2870 0.3210 1B0 0.3028 0.3304 1S0 0.3005 0.3415 0.2962 0.3220 0.2937 0.3312 0.3115 0.3391 0.3099 0.3509 0.2984 0.3133 0.2962 0.3220 0.3130 0.3290 0.3115 0.3391 0.2920 0.3060 0.2895 0.3135 0.3048 0.3207 0.3028 0.3304 0C0 0.2962 0.3220 0T0 0.2937 0.3312 1C0 0.3115 0.3391 1T0 0.3099 0.3509 0.3028 0.3304 0.3005 0.3415 0.3205 0.3481 0.3196 0.3602 0.3048 0.3207 0.3028 0.3304 0.3213 0.3373 0.3205 0.3481 0.2984 0.3133 0.2962 0.3220 0.3130 0.3290 0.3115 0.3391 0D0 0.2984 0.3133 0U0 0.3009 0.3042 1D0 0.3130 0.3290 1U0 0.3144 0.3186 0.3048 0.3207 0.3068 0.3113 0.3213 0.3373 0.3221 0.3261 0.3068 0.3113 0.3093 0.2993 0.3221 0.3261 0.3231 0.3120 0.3009 0.3042 0.3037 0.2937 0.3144 0.3186 0.3161 0.3059 ANSI White Bins Code CCT Bin Code x y Bin Code x y Bin Code x y 051 6200 K 2A0 0.3215 0.3350 2R0 0.3222 0.3243 3A0 .3371 .3490 0.3290 0.3417 0.3290 0.3300 .3451 .3554 0.3290 0.3300 0.3290 0.3180 .3440 .3427 0.3222 0.3243 0.3231 0.3120 .3366 .3369 2B0 0.3207 0.3462 2S0 0.3196 0.3602 3B0 .3376 .3616 0.3290 0.3538 0.3290 0.3690 .3463 .3687 0.3290 0.3417 0.3290 0.3538 .3451 .3554 0.3215 0.3350 0.3207 0.3462 .3371 .3490 2C0 0.3290 0.3538 2T0 0.3290 0.3690 3C0 .3463 .3687 0.3376 0.3616 0.3381 0.3762 .3551 .3760 0.3371 0.3490 0.3376 0.3616 .3533 .3620 0.3290 0.3417 0.3290 0.3538 .3451 .3554 2D0 0.3290 0.3417 2U0 0.3290 0.3300 3D0 .3451 .3554 0.3371 0.3490 0.3366 0.3369 .3533 .3620 0.3366 0.3369 0.3361 0.3245 .3515 .3487 0.3290 0.3300 0.3290 0.3180 .3440 .3427 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 16 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Performance Groups - Chromaticity (Tj = 85 °C) - cONTINUED ANSI White Bins Code CCT Bin Code x y 0E3 5000 K 3A0 .3371 .3490 .3451 .3554 .3440 .3427 .3366 .3369 3B0 .3376 .3616 .3463 .3687 .3451 .3554 .3371 .3490 3C0 .3463 .3687 .3551 .3760 .3533 .3620 .3451 .3554 3D0 .3451 .3554 .3533 .3620 .3515 .3487 .3440 .3427 ANSI White Bins Code CCT Bin Code x y 0E2 5700 K 2A0 0.3215 0.3350 0.3290 0.3417 0.3290 0.3300 0.3222 0.3243 2B0 0.3207 0.3462 0.3290 0.3538 0.3290 0.3417 0.3215 0.3350 2C0 0.3290 0.3538 0.3376 0.3616 0.3371 0.3490 0.3290 0.3417 2D0 0.3290 0.3417 0.3371 0.3490 0.3366 0.3369 0.3290 0.3300 ANSI White Bins Code CCT Bin Code x y 0E1 6500 K 1A0 0.3048 0.3207 0.3130 0.3290 0.3144 0.3186 0.3068 0.3113 1B0 0.3028 0.3304 0.3115 0.3391 0.3130 0.3290 0.3048 0.3207 1C0 0.3115 0.3391 0.3205 0.3481 0.3213 0.3373 0.3130 0.3290 1D0 0.3130 0.3290 0.3213 0.3373 0.3221 0.3261 0.3144 0.3186 ANSI White Bins Code CCT Bin Code x y 0E5 4000 K 5A0 .3670 .3578 .3702 .3722 .3825 .3798 .3783 .3646 5B0 .3702 .3722 .3736 .3874 .3869 .3958 .3825 .3798 5C0 .3825 .3798 .3869 .3958 .4006 .4044 .3950 .3875 5D0 .3783 .3646 .3825 .3798 .3950 .3875 .3898 .3716 ANSI White Bins Code CCT Bin Code x y 0E6 3500 K 6A0 .3889 .3690 .3941 .3848 .4080 .3916 .4017 .3751 6B0 .3941 .3848 .3996 .4015 .4146 .4089 .4080 .3916 6C0 .4080 .3916 .4146 .4089 .4299 .4165 .4221 .3984 6D0 .4017 .3751 .4080 .3916 .4221 .3984 .4147 .3814 ANSI White Bins Code CCT Bin Code x y 0E4 4500 K 4A0 .3530 .3597 .3615 .3659 .3590 .3521 .3512 .3465 4B0 .3548 .3736 .3641 .3804 .3615 .3659 .3530 .3597 4C0 .3641 .3804 .3736 .3874 .3702 .3722 .3615 .3659 4D0 .3668 .3957 .3771 .4034 .3736 .3874 .3641 .3804 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 17 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Performance Groups - Chromaticity (Tj = 85 °C) - cONTINUED Cree EasyWhite Bins Plotted on the 1931 CIE Color Space (Tj = 85 °C) ANSI White Bins Code CCT Bin Code x y 0E7 3000 K 7A0 .4147 .3814 .4221 .3984 .4342 .4028 .4259 .3853 7B0 .4221 .3984 .4299 .4165 .4430 .4212 .4342 .4028 7C0 .4342 .4028 .4430 .4212 .4562 .4260 .4465 .4071 7D0 .4259 .3853 .4342 .4028 .4465 .4071 .4373 .3893 ANSI White Bins Code CCT Bin Code x y 0E8 2700 K 8A0 .4373 .3893 .4465 .4071 .4582 .4099 .4483 .3919 8B0 .4465 .4071 .4562 .4260 .4687 .4289 .4582 .4099 8C0 .4582 .4099 .4687 .4289 .4813 .4319 .4700 .4126 8D0 .4483 .3919 .4582 .4099 .4700 .4126 .4593 .3944 2700K 3000K 3500K 4000K 4500K 5000K 5700K 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 0.49 CCy CCx ANSI C78.377 Quadrangle EasyWhite 4-step EasyWhite 2-step xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 18 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Cree ANSI White Bins Plotted on the 1931 CIE Color Space (Tj = 85 °C) 2600K 2900K 2700K 3000K 3200K 3500K 3700K 4000K 4300K 4500K 4750K 5000K 5300K 3A 3B 3C 3D 4A 4B 4C 4D 5A 5B 5C 5D 6A 6B 6C 6D 7A 7B 7C 7D 8A 8B 8C 8D 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.41 0.42 0.43 0.44 0.45 0.46 0.47 0.48 0.49 CCy CCx ANSI C78.377A 5000K 5700K 6500K 8000K 0A 0B 0C 0D 0R 0S 0T 0U 1A 1B 1C 1D 2A 2B 2C 2D 3A 3B 1R 1S 1T 1U 2R 2S 2T 2U 3R 3S 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37 0.38 0.39 0.40 0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 CCy CCx ANSI C78.377A xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 19 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Bin and Order Code Formats Bin codes and order codes are configured as follows. Order Code B in Code SSSCCC-HH-HHHH-GHKLNNNNN Series = MKR Internal code Forward voltage class B = 6 V D = 12 V CRI specification B = 70-CRI minimum H = 80-CRI minimum U = 90-CRI minimum 0 = No minimum Kit code Internal code Color AWT = White SSSCCC-E-DDD-MM-HK-L-PP Series = MKR Internal code Luminous flux group Internal code CRI specification B = 70-CRI minimum H = 80-CRI minimum U = 90-CRI minimum 0 = No minimum Forward voltage class B = 6 V D = 12 V Chromaticity bin Color AWT = White xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 20 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Reflow Soldering Characteristics In testing, Cree has found XLamp MK-R LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 °C 217 °C Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds Peak/Classification Temperature (Tp) 215 °C 260 °C Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 °C/second max. 6 °C/second max. Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to the topside of the package, measured on the package body surface. xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 21 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM‑80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp MK‑R LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REAC h Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. UL Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See the Eye Safety application note at www. cree.com/xlamp_app_notes/led_eye_safety. xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 22 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Mechanical Dimensions All measurements are ±.13 mm unless otherwise indicated. CHECK FINAL PROTECTIVE MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION A B C D 6 5 4 3 6 5 4 3 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 7.000 7.000 .73 4.08 R3.250 6.76 .70 6.70 .70 3.90 6.55 5.27 .55 3.00 1.23 6.70 6.70 .70 .70 3.90 D. CRONIN REV B RECOMMENDED STENCIL PATTERN SHADED AREA IS OPEN RECOMMENDED PCB SOLDER PAD Top View Side View Bottom View Recommended PCB Solder Pad Recommended Stencil Pattern (Shaded Area Is Open) Anode SIZE TITLE SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 6 5 4 3 2 Phone Fax 4600 Durham, PERSON WITHOUT THE WRITTEN CONSENT COPIED, REPRODUCED OR DISCLOSED TO ANY INFORMATION OF CREE, INC. THIS PLOT WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 7.000 7.000 .73 4.08 R3.250 6.76 .70 .70 6.70 .70 3.90 6.55 5.27 .55 3.00 1.23 6.70 .70 .70 3.90 11.000 2610-00031 MKR Marketing Spec D. CRONIN 11/7/12 REVISONS REV DESCRIPTION BY B VIEWS SHOW LATEST REVISION DC RECOMMENDED STENCIL PATTERN SHADED AREA IS OPEN RECOMMENDED PCB SOLDER PAD SIZE TITLE SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 1 6 5 4 3 2 1 Phone (Fax (919) 4600 Silicon Durham, PERSON WITHOUT THE WRITTEN CONSENT REPRODUCED OR DISCLOSED TO ANY INFORMATION OF CREE, INC. THIS PLOT ARE THE PROPRIETARY AND THIS PLOT AND THE INFORMATION NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 7.000 7.000 .73 4.08 R3.250 6.76 .70 .70 6.70 .70 3.90 6.55 5.27 .55 3.00 1.23 6.70 .70 .70 3.90 11.000 2610-00031 MKR Marketing Spec D. CRONIN 11/7/12 REVISONS REV DESCRIPTION BY DATE B VIEWS SHOW LATEST REVISION DC 8/RECOMMENDED STENCIL PATTERN SHADED AREA IS OPEN RECOMMENDED PCB SOLDER PAD xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 23 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION X° ± .5 ° .XXX ± .010 .XX ± .03 .X ± .06 FOR SHEET METAL PARTS ONLY .XX ± .01 .XXX ± .005 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SCALE A B C D 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTANED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE SURFACE FINISH: 63 330 +.25 -.75 12.4 +1.0 -.5 MEASURED AT EDGE 16.4 +0.2 .0 MEASURED AT HUB 12.4 +.2 .0 MEASURED AT HUB 13.1 ±.2 1.9±.4 21±.4 60° 60° 0.500 1 /1 2400-00009 A REEL, 13" X 12MM, 3 PIECE SNAP - ANTI-STATIC HIPS -- -- -- -- D. CRONIN 09/29/09 2400-00009 INDEX QTY ITEM COMMENTS 1 1 2400-00009-CORE 2 2 2400-00009-REEL REVISONS REV DESCRIPTION BY DATE APP'D SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 Trailer 180mm (min) of empty pockets sealed with tape (15 pockets min.) Loaded Pockets (1000 Lamps) 12±.1 4.31 16 +.3 -.0 1.75 4±.10 ±.10 Leader 420mm (min) of empty pockets sealed with tape (35 pockets min.) 7.4 0.36 13" 13mm 3.000 1 /1 2402-00025 A MKR LOADING SPEC -- -- -- -- -- -- D. CRONIN 12/7/12 REVISONS REV DESCRIPTION BY DATE APP'D A Initial Release DC 12/7/12 END START User Feed Direction CATHODE SIDE ANODE SIDE User Feed Direction 1.5± .1 xlamp MK-R leds 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 24 Copyright © 2012-2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks and SC3 Technology™ is a trademark of Cree, Inc. Packaging Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Dessicant (inside bag) Humidity Indicator Card (inside bag) Patent Label Label with Customer Code, Qty, Reel Patent Label Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Code, Qty, Reel ID Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Unpackaged Reel Packaged Reel Boxed Reel Precision Instrumentation Amplifier AD524 Rev. F Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved. FEATURES Low noise: 0.3 μV p-p at 0.1 Hz to 10 Hz Low nonlinearity: 0.003% (G = 1) High CMRR: 120 dB (G = 1000) Low offset voltage: 50 μV Low offset voltage drift: 0.5 μV/°C Gain bandwidth product: 25 MHz Pin programmable gains of 1, 10, 100, 1000 Input protection, power-on/power-off No external components required Internally compensated MIL-STD-883B and chips available 16-lead ceramic DIP and SOIC packages and 20-terminal leadless chip carrier available Available in tape and reel in accordance with EIA-481A standard Standard military drawing also available FUNCTIONAL BLOCK DIAGRAM AD524 20kΩ – INPUT G = 10 + INPUT G = 100 G = 1000 4.44kΩ 404Ω 40Ω PROTECTION 20kΩ 20kΩ 20kΩ 20kΩ 20kΩ SENSE REFERENCE PROTECTION RG1 RG2 1 13 12 11 16 3 2 Vb OUTPUT 00500-001 Figure 1. GENERAL DESCRIPTION The AD524 is a precision monolithic instrumentation amplifier designed for data acquisition applications requiring high accu- racy under worst-case operating conditions. An outstanding combination of high linearity, high common-mode rejection, low offset voltage drift, and low noise makes the AD524 suitable for use in many data acquisition systems. The AD524 has an output offset voltage drift of less than 25 μV/°C, input offset voltage drift of less than 0.5 μV/°C, CMR above 90 dB at unity gain (120 dB at G = 1000), and maximum nonlinearity of 0.003% at G = 1. In addition to the outstanding dc specifications, the AD524 also has a 25 kHz bandwidth (G = 1000). To make it suitable for high speed data acquisition systems, the AD524 has an output slew rate of 5 V/μs and settles in 15 μs to 0.01% for gains of 1 to 100. As a complete amplifier, the AD524 does not require any exter- nal components for fixed gains of 1, 10, 100 and 1000. For other gain settings between 1 and 1000, only a single resistor is required. The AD524 input is fully protected for both power-on and power-off fault conditions. The AD524 IC instrumentation amplifier is available in four different versions of accuracy and operating temperature range. The economical A grade, the low drift B grade, and lower drift, higher linearity C grade are specified from −25°C to +85°C. The S grade guarantees performance to specification over the extended temperature range −55°C to +125°C. The AD524 is available in a 16-lead ceramic DIP, 16-lead SBDIP, 16-lead SOIC wide packages, and 20-terminal leadless chip carrier. PRODUCT HIGHLIGHTS 1. The AD524 has guaranteed low offset voltage, offset voltage drift, and low noise for precision high gain applications. 2. The AD524 is functionally complete with pin program- mable gains of 1, 10, 100, and 1000, and single resistor programmable for any gain. 3. Input and output offset nulling terminals are provided for very high precision applications and to minimize offset voltage changes in gain ranging applications. 4. The AD524 is input protected for both power-on and power-off fault conditions. 5. The AD524 offers superior dynamic performance with a gain bandwidth product of 25 MHz, full power response of 75 kHz and a settling time of 15 μs to 0.01% of a 20 V step (G = 100). MPXV7002 Rev 2, 1/2009 Freescale Semiconductor © Freescale Semiconductor, Inc., 2005, 2009. All rights reserved. Pressure + Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features • 2.5% Typical Error over +10°C to +60°C with Auto Zero • 6.25% Maximum Error over +10°C to +60°C without Auto Zero • Ideally Suited for Microprocessor or Microcontroller-Based Systems • Thermoplastic (PPS) Surface Mount Package • Temperature Compensated over +10° to +60°C • Patented Silicon Shear Stress Strain Gauge • Available in Differential and Gauge Configurations ORDERING INFORMATION Device Name Package Options Case No. # of Ports Pressure Type Device None Single Dual Gauge Differential Absolute Marking Small Outline Package (MPXV7002 Series) MPXV7002GC6U Rails 482A • • MPXV7002G MPXV7002GC6T1 Tape & Reel 482A • • MPXV7002G MPXV7002GP Trays 1369 • • MPXV7002G MPXV7002DP Trays 1351 • • MPXV7002DP MPXV7002 Series -2 to 2 kPa (-0.3 to 0.3 psi) 0.5 to 4.5 V Output SMALL OUTLINE PACKAGE MPXV7002GC6U/C6T1 CASE 482A-01 MPXV7002DP CASE 1351-01 MPXV7002GP CASE 1369-01 Application Examples • Hospital Beds • HVAC • Respiratory Systems • Process Control MPXV7002 Sensors 2 Freescale Semiconductor Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. POP –2.0 — 2.0 kPa Supply Voltage(2) 2. Device is ratiometric within this specified excitation range. VS 4.75 5.0 5.25 Vdc Supply Current Io — — 10 mAdc Pressure Offset(3) (10 to 60°C) @ VS = 5.0 Volts 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. Voff 2.25 2.5 2.75 Vdc Full Scale Output(4) (10 to 60°C) @ VS = 5.0 Volts 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. VFSO 4.25 4.5 4.75 Vdc Full Scale Span(5) (10 to 60°C) @ VS = 5.0 Volts 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. VFSS 3.5 4.0 4.5 V Vdc Accuracy(6) (10 to 60°C) 6. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. — — ±2.5(7) 7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between auto zero and measurement. ±6.25 %VFSS Sensitivity V/P — 1.0 —- V/kPa Response Time(8) 8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. tR — 1.0 —- ms Output Source Current at Full Scale Output IO+ — 0.1 —- mAdc Warm-Up Time(9) 9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. — — 20 —- ms MPXV7002 Sensors Freescale Semiconductor 3 Pressure Maximum Ratings Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Integrated Pressure Sensor Schematic Table 2. Maximum Ratings(1) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg –30 to +100 °C Operating Temperature TA 10 to 60 °C Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry VS Vout GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device 2 4 3 MPXV7002 Sensors 4 Freescale Semiconductor Pressure ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. Figure 2. Cross-Sectional Diagram SOP (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Fluoro Silicone Gel Die Coat Wire Bond Die P1 Stainless Steel Cap Thermoplastic Case Differential Sensing Die Bond Element P2 Lead Frame +5 V 1.0 μF 0.01 μF GND 470 pF Vs Vout IPS OUTPUT MPXV7002 Sensors Freescale Semiconductor 5 Pressure Figure 4. Output versus Pressure Differential PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which protects the die from harsh media. The Pressure (P1) side may be identified by using the following table: MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. Figure 5. Small Outline Package Footprint Differential Pressure (kPa) Output Voltage (V) 5.0 4.0 3.0 2.0 1.0 0 0 2 TYPICAL MIN -2 -1 1 Transfer Function: Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS VS = 5.0 Vdc TA = 10 to 60°C MAX Part Number Case Type Pressure (P1) Side Identifier MPXV7002GC6U/GC6T1 482A-01 Side with Port Attached MPXV7002GP 1369-01 Side with Port Attached MPXV7002DP 1351-01 Side with Part Marking 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 inch mm SCALE 2:1 MPXV7002 Sensors 6 Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE PIN 1 IDENTIFIER H SEATING PLANE -TW C M J K V DIM MIN MAX MIN MAX INCHES MILLIMETERS A 0.415 0.425 10.54 10.79 B 0.415 0.425 10.54 10.79 C 0.500 0.520 12.70 13.21 D 0.038 0.042 0.96 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0° 7° 0° 7° N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5° TYPICAL DRAFT. S D 8 PL G 4 5 8 1 0.25 (0.010) M T B S A -A- N -BS MPXV7002 Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7002 Sensors 8 Freescale Semiconductor Pressure PACKAGE DIMENSIONS MPXV7002 Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 Sensors 10 Freescale Semiconductor Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE MPXV7002 Rev. 2 1/2009 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. Product family data sheet Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 CLD-DS51 Rev 8A Cree® XLamp® XP-G2 LEDs Product Description The XLamp XP-G2 LED builds on the unprecedented performance of the original XP-G by increasing lumen output up to 20% while providing a single die LED point source for precise optical control. The XP-G2 LED shares the same footprint as the original XP-G, providing a seamless upgrade path and shortening the design cycle. XLamp XP-G2 LEDs are the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LED light bulbs, outdoor lighting, portable lighting, indoor lighting and solar-powered lighting. FEATURES • Available in white, outdoor white and 80-, 85- and 90-CRI white • ANSI-compatible chromaticity bins • Binned at 85 °C • Maximum drive current: 1500 mA • Low thermal resistance: 4 °C/W • Wide viewing angle: 115° • Unlimited floor life at ≤ 30 ºC/85% RH • Reflow solderable - JEDEC J‑STD‑020C • Electrically neutral thermal path • RoHS- and REACh‑ compliant • UL-recognized component (E349212) www.cree.com/Xlamp Table of Contents Characteristics........................... 2 Flux Characteristics..................... 3 Relative Spectral Power Distribution............................... 4 Relative Flux vs. Junction Temperature.............................. 4 Electrical Characteristics.............. 5 Relative Flux vs. Current............. 5 Relative Chromaticity vs Current and Temperature........................ 6 Typical Spatial Distribution........... 7 Thermal Design.......................... 7 Reflow Soldering Characteristics... 8 Notes........................................ 9 Mechanical Dimensions..............10 Tape and Reel...........................11 Packaging.................................12 Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 2 XLamp xp-g2 leds Characteristics Characteristics Unit Minimum Typical Maximum Thermal resistance, junction to solder point °C/W 4 Viewing angle (FWHM) degrees 115 Temperature coefficient of voltage mV/°C -1.8 ESD withstand voltage (HBM per Mil-Std-883D) V 8000 DC forward current mA 1500 Reverse voltage V 5 Forward voltage (@ 350 mA, 85 °C) V 2.8 3.15 Forward voltage (@ 700 mA, 85 °C) V 2.9 Forward voltage (@ 1000 mA, 85 °C) V 3.0 Forward voltage (@ 1500 mA, 85 °C) V 3.1 LED junction temperature °C 150 Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 3 XLamp xp-g2 leds Flux Characteristics (TJ = 85 °C) The following table provides several base order codes for XLamp XP-G2 LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. Color CCT Range Base Order Codes Min. Luminous Flux @ 350 mA Calculated Minimum Luminous Flux (lm)** @ 85 °C Order Code Min. Max. Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* 700 mA 1.0 A 1.5 A Cool White 5000 K 8300 K R3 122 138 223 297 402 XPGBWT-L1-0000-00F51 R4 130 147 237 316 429 XPGBWT-L1-0000-00G51 R5 139 158 254 338 458 XPGBWT-L1-0000-00H51 Outdoor White 3200 K 5300 K R2 114 129 208 277 376 XPGBWT-01-0000-00EC2 R3 122 138 223 297 402 XPGBWT-01-0000-00FC2 R4 130 147 237 316 429 XPGBWT-01-0000-00GC2 Neutral White 3700 K 5300 K Q5 107 121 195 260 353 XPGBWT-L1-0000-00DE4 R2 114 129 208 277 376 XPGBWT-L1-0000-00EE4 R3 122 138 223 297 402 XPGBWT-L1-0000-00FE4 80-CRI White 2600 K 4300 K Q4 100 113 182 243 330 XPGBWT-H1-0000-00CE7 Q5 107 121 195 260 353 XPGBWT-H1-0000-00DE7 R2 114 129 208 277 376 XPGBWT-H1-0000-00EE7 R3 122 138 223 297 402 XPGBWT-H1-0000-00FE7 Warm White 2600 K 3700 K Q4 100 113 182 243 330 XPGBWT-L1-0000-00CE7 Q5 107 121 195 260 353 XPGBWT-L1-0000-00DE7 R2 114 129 208 277 376 XPGBWT-L1-0000-00EE7 R3 122 138 223 297 402 XPGBWT-L1-0000-00FE7 R4 130 147 237 316 429 XPGBWT-L1-0000-00GE7 85-CRI White 2600 K 3200 K P3 73.9 83.8 135 180 244 XPGBWT-P1-0000-008E7 P4 80.6 91.4 147 196 266 XPGBWT-P1-0000-009E7 Q2 87.4 99.1 160 213 288 XPGBWT-P1-0000-00AE7 Q3 93.9 106 172 228 310 XPGBWT-P1-0000-00BE7 90-CRI White 2600 K 3200 K P3 73.9 83.8 135 180 244 XPGBWT-U1-0000-008E7 P4 80.6 91.4 147 196 266 XPGBWT-U1-0000-009E7 Q2 87.4 99.1 160 213 288 XPGBWT-U1-0000-00AE7 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Typical CRI for Cool White (5000 K - 8300 K CCT) is 70. • Typical CRI for Neutral White (3700 K - 5300 K CCT) is 75. • Typical CRI for Outdoor White (4000 K - 5300 K CCT) is 70. • Typical CRI for Warm White (2600 K - 3700 K CCT) is 80. • Minimum CRI for 80-CRI White is 80. • Minimum CRI for 85-CRI White is 85. • Minimum CRI for 90-CRI White is 90. • Flux values @ 25 °C are calculated and for reference only. ** Calculated flux values at 700 mA, 1 A and 1.5 A are for reference only. Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 4 XLamp xp-g2 leds Relative Spectral Power Distribution Relative Flux vs. Junction Temperature (IF = 350 mA) Relative Spectral Power 0% 20% 40% 60% 80% 100% 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm) 5000K - 8300K CCT 3700K - 5000K CCT 2600K - 3700K CCT Relative Flux Output vs. Junction Temperature 0% 20% 40% 60% 80% 100% 120% 25 50 75 100 125 150 Relative Luminous Flux Junction Temperature (ºC) Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 5 XLamp xp-g2 leds Electrical Characteristics (TJ = 85 °C) Relative Flux vs. Current (TJ = 85 °C) Electrical Characteristics (Tj = 25ºC) 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 2.50 2.75 3.00 3.25 Forward Current (mA) Forward Voltage (V) Relative Intensity vs. Current (Tj = 25ºC) 0% 50% 100% 150% 200% 250% 300% 350% 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 Relative Luminous Flux (%) Forward Current (mA) Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 6 XLamp xp-g2 leds Relative Chromaticity vs Current and Temperature (Warm White*) * Warm White XLamp XP-G2 LEDs have a typical CRI of 80. Delta CCT vs. Current -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 100 300 500 700 900 1100 1300 1500 Current (mA) ΔCCx ΔCCy Delta CCT vs Temp -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 25 50 75 100 125 150 Tsp (°C) ΔCCx ΔCCy Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 7 XLamp xp-g2 leds Typical Spatial Distribution Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Typical Spatial Radiation Pattern 0% 20% 40% 60% 80% 100% -100 -80 -60 -40 -20 0 20 40 60 80 100 Relative Luminous Intensity (%) Angle (º) Thermal Design Cool White 0 200 400 600 800 1000 1200 1400 1600 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 8 XLamp xp-g2 leds Reflow Soldering Characteristics In testing, Cree has found XLamp XP-G2 LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 °C 217 °C Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds Peak/Classification Temperature (Tp) 215 °C 260 °C Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 °C/second max. 6 °C/second max. Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. TP TL Temperature Time t 25˚C to Peak Preheat ts tS tP 25 Ramp-down Ramp-up Critical Zone TL to TP Tsmax Tsmin Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 9 XLamp xp-g2 leds Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp XP-G2 LEDs to have unlimited floor life in conditions ≤ 30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REAC h Compliance REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh Declaration. REACh banned substance information (REACh Article 67) is also available upon request. UL Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See LED Eye Safety at www.cree.com/ xlamp_app_notes/led_eye_safety. Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 10 XLamp xp-g2 leds Mechanical Dimensions (TA = 25 °C) All measurements are ±.13 mm unless otherwise indicated. .60 1.65 1.60 .65 3.45 2.00 3.45 .40 .60 3.20 1.20 .40 .40 3.20 (HATCHED AREA IS OPENING) RECOMMENDED STENCIL PATTERN RECOMMENDED PCB SOLDER PAD 3.30 3.30 .50 1.30 .50 .50 .40 2.30 3.30 .50 1.30 .50 .73 2.6 Top View Side View Bottom View All Measurements are .13mm unless otherwise indicated Anode THIRD ANGLE PROJECTION A B C D 6 5 4 3 6 5 4 3 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS .XX ± .25 .XXX ± .125 X° ± .5 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE MILLIMETERS AND AFTER TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 .83 .65 R1.53 3.30 2.30 .50 1.30 2.36 RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 3 2 1 A B C Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.20 .60 3.20 1.60 3.20 .40 .65 3.30 1.30 22.000 1 /1 2610-00024 A OUTLINE DRAWING XPG G2 D. CRONIN 05/09/12 RECOMMENDED STENCIL PATTERN AREA IS OPENING) SIZE TITLE DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 6 5 4 3 2 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 .83 .65 R1.53 3.30 3.30 2.30 .50 1.30 2.36 D. CRONIN 05/09/12 REV DESCRIPTION RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE C DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 6 5 4 3 2 6 5 4 3 2 PERSON WITHOUT THE WRITTEN CONSENT COPIED, REPRODUCED OR DISCLOSED TO ANY INFORMATION OF CREE, INC. THIS PLOT ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 .83 .65 R1.53 3.30 3.30 2.30 .50 1.30 2.36 22.000 OUTLINE D. CRONIN 05/09/12 REVISONS REV DESCRIPTION RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 5 4 3 2 5 4 3 2 WITHOUT THE WRITTEN CONSENT REPRODUCED OR DISCLOSED TO ANY CREE, INC. THIS PLOT PROPRIETARY AND AND THE INFORMATION X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.30 3.30 3.30 1.15 1.65 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 .83 .65 R1.53 3.30 3.30 2.30 .50 1.30 2.36 22.000 2610-OUTLINE DRAWING D. CRONIN 05/09/12 REVISONS REV DESCRIPTION RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) Anode Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 11 XLamp xp-g2 leds Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 6 5 4 3 2 1 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) Loaded Pockets (1000 Lamps) Leader 400mm (min.) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) 12.0 +.3 -.0 1.75 ±.10 4±.1 8±.1 2.5±.1 3.000 1 /1 2402-00014 B XP HEW LOADING SPEC -- -- -- -- -- -- D. CRONIN 11/29/10 REVISONS REV DESCRIPTION BY DATE APP'D B ADDED CATHODE AND ANODE NOTE REORIENTED DEVICE DC 2/26/12 END START User Feed Direction CATHODE SIDE ANODE SIDE User Feed Direction 7" 1.5± .1 13mm Pocket Tape Carrier Tape 13 61 12.40 0 +2.00 MEASURED AT HUB 12.40 MEASURED AT INSIDE EDGE 16.40 2400-00005 SIZE TITLE REV. C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION .X ± 0.3 .XX ± .10 .X ± .25 FOR SHEET METAL PARTS ONLY .XX ± .13 X° ± 1° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: A B C D 6 5 4 3 2 1 A B C D Phone (919) 361-4770 4600 Silicon Drive Durham, N.C 27703 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. Reel, 7" x 12mm Wide B LIUDEZHI 2012/5/25 +/-0.5 PS 190 ½öÓÃÓÚÆÀ¹À¡£ °æȨËùÓÐ (c) by Foxit Software Company, 2004 ÓÉ Foxit PDF Editor ±à¼- OD 7.5'' 13 61 12.40 0 +2.00 MEASURED AT HUB 12.40 MEASURED AT INSIDE EDGE 16.40 B C D 6 5 4 3 2 1 B C D NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. +/-0.5 190 ½öÓÃÓÚÆÀ¹À¡£ °æȨËùÓÐ (c) by Foxit Software Company, 2004 ÓÉ Foxit PDF Editor ±à¼- OD 7.5'' Y X X REF 0.59 F(III) D1 P1 1.5 MIN. Bo Ao R0.2 TYPICAL REF 4.375 Ko (IV) Other material available. (III) (II) (I) hole to centerline of pocket. Measured from centerline of sprocket holes is ± 0.20. Cumulative tolerance of 10 sprocket to centerline of pocket. Measured from centerline of sprocket hole SECTION Y-Y SECTION X-X REF R 2.24 Ko 2.40 +0.0/-0.1 3.70 1 W F P +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 Ao 3.70 +/- 0.1 Bo +/- 0.1 Y Y X X REF 0.59 W F(III) D1 P1 1.5 MIN. Bo Ao R0.2 TYPICAL REF 4.375 Ko (IV) Other material available. (III) (II) (I) hole to centerline of pocket. Measured from centerline of sprocket holes is ± 0.20. Cumulative tolerance of 10 sprocket to centerline of pocket. Measured from centerline of sprocket hole SECTION Y-Y SECTION X-X 2.0 ±0.05 (I) P2 1.55 ±0.05 Do 4.0 ±0.1 (II) Po 1.75 ±0.1 E1 T 0.30 ±0.05 REF R 2.24 Ko 2.40 +0.0/-0.1 3.70 1 W F P +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 Ao 3.70 +/- 0.1 Bo +/- 0.1 Y D1 1.5 MIN. Bo R0.2 TYPICAL REF 4.375 Ko SECTION Y-Y REF Ko 2.40 +0.0/-0.1 3.70 1 W F P +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 Ao 3.70 +/- 0.1 Bo +/- 0.1 CATHODE SIDE ANODE SIDE Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 12 XLamp xp-g2 leds Packaging Patent Label (on bottom of box) Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Code, Qty, Reel ID Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Unpackaged Reel Packaged Reel Boxed Reel CREE Bin Code & Barcode Label Vacuum-Sealed Moisture Barrier Bag Label with Customer P/N, Qty, Lot #, PO # Label with Cree Bin Code, Qty, Lot # Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Patent Label Label with Customer Order Code, Qty, Reel ID, PO # SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc. SHARC Processors ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com SUMMARY High performance 32-bit/40-bit floating point processor optimized for high performance audio processing Single-instruction, multiple-data (SIMD) computational architecture On-chip memory—3M bits of on-chip SRAM Code compatible with all other members of the SHARC family The ADSP-2136x processors are available with up to 333 MHz core instruction rate with unique audiocentric peripherals such as the digital applications interface, S/PDIF transceiver, DTCP (digital transmission content protection protocol), serial ports, precision clock generators, and more. For complete ordering information, see Ordering Guide on Page 56. DEDICATED AUDIO COMPONENTS S/PDIF-compatible digital audio receiver/transmitter 8 channels of asynchronous sample rate converters (SRC) 16 PWM outputs configured as four groups of four outputs ROM-based security features include: JTAG access to memory permitted with a 64-bit key Protected memory regions that can be assigned to limit access under program control to sensitive code PLL has a wide variety of software and hardware multiplier/ divider ratios Available in 136-ball CSP_BGA and 144-lead LQFP_EP packages Figure 1. Functional Block Diagram Internal Memory I/F Block 0 RAM/ROM B0D 64-BIT Instruction Cache 5 stage Sequencer PEx PEy PMD 64-BIT Core Bus Cross Bar Block 1 RAM/ROM Block 2 RAM Block 3 RAM DAG1/2 Timer IOD BUS MTM/ DTCP PERIPHERAL BUS 32-BIT Internal Memory DMD 64-BIT PERIPHERAL BUS B1D 64-BIT B2D 64-BIT B3D 64-BIT DAI Peripherals Peripherals SIMD Core S Core SPI Flags PWM 3-0 PP PP Pin MUX PDAP/ IDP7-0 ASRC 3-0 TIMER 2-0 CORE FLAGS S/PDIF Tx/Rx PCG A-B SPI B SPORT 5-0 DAI Routing/Pins IOD 32-BIT FLAGx/IRQx/ TMREXP JTAG PMD 64-BIT DMD 64-BIT Rev. J | Page 2 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 TABLE OF CONTENTS Summary ............................................................... 1 Dedicated Audio Components .................................... 1 General Description ................................................. 3 SHARC Family Core Architecture ............................ 4 Family Peripheral Architecture ................................ 6 I/O Processor Features ........................................... 8 System Design ...................................................... 8 Development Tools ............................................... 9 Additional Information ........................................ 10 Related Signal Chains .......................................... 10 Pin Function Descriptions ....................................... 11 Specifications ........................................................ 14 Operating Conditions .......................................... 14 Electrical Characteristics ....................................... 15 Package Information ........................................... 16 ESD Caution ...................................................... 16 Maximum Power Dissipation ................................. 16 Absolute Maximum Ratings ................................... 16 Timing Specifications ........................................... 16 Output Drive Currents ......................................... 46 Test Conditions .................................................. 46 Capacitive Loading .............................................. 46 Thermal Characteristics ........................................ 47 144-Lead LQFP_EP Pin Configurations ....................... 48 136-Ball BGA Pin Configurations ............................... 50 Package Dimensions ............................................... 53 Surface-Mount Design .......................................... 54 Automotive Products .............................................. 55 Ordering Guide ..................................................... 56 REVISION HISTORY 7/13—Revision I to Revision J Updated Development Tools .......................................9 Added Nominal Value column in Operating Conditions .. 14 Changed Max values in Table 30 in Pulse-Width Modulation Generators ............................................................ 35 Updated Ordering Guide .......................................... 56 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 3 of 60 | July 2013 GENERAL DESCRIPTION The ADSP-2136x SHARC® processor is a member of the SIMD SHARC family of DSPs that feature Analog Devices, Inc., Super Harvard Architecture. The processor is source code-compatible with the ADSP-2126x and ADSP-2116x DSPs, as well as with first generation ADSP-2106x SHARC processors in SISD (single-instruction, single-data) mode. The ADSP-2136x are 32-/40-bit floating-point processors optimized for high performance automotive audio applications. They contain a large on-chip SRAM and ROM, multiple internal buses to eliminate I/O bottlenecks, and an innovative digital audio interface (DAI). As shown in the functional block diagram on Page 1, the ADSP-2136x uses two computational units to deliver a significant performance increase over the previous SHARC processors on a range of signal processing algorithms. With its SIMD computational hardware, the ADSP-2136x can perform two GFLOPS running at 333 MHz. Table 1 shows performance benchmarks for these devices. Table 2 shows the features of the individual product offerings. The diagram on Page 1 shows the two clock domains that make up the ADSP-2136x processors. The core clock domain contains the following features: • Two processing elements, each of which comprises an ALU, multiplier, shifter, and data register file • Data address generators (DAG1, DAG2) • Program sequencer with instruction cache • PM and DM buses capable of supporting four 32-bit data transfers between memory and the core at every core processor cycle • One periodic interval timer with pinout • On-chip SRAM (3M bit) • On-chip mask-programmable ROM (4M bit) • JTAG test access port for emulation and boundary scan. The JTAG provides software debug through user breakpoints, which allow flexible exception handling. The diagram on Page 1 also shows the following architectural features: • I/O processor that handles 32-bit DMA for the peripherals • Six full duplex serial ports • Two SPI-compatible interface ports—primary on dedicated pins, secondary on DAI pins • 8-bit or 16-bit parallel port that supports interfaces to offchip memory peripherals • Digital audio interface that includes two precision clock generators (PCG), an input data port with eight serial interfaces (IDP), an S/PDIF receiver/transmitter, 8-channel asynchronous sample rate converter (ASRC), DTCP cipher, six serial ports, a 20-bit parallel input data port (PDAP), 10 interrupts, six flag outputs, six flag inputs, three timers, and a flexible signal routing unit (SRU) Table 1. Benchmarks (at 333 MHz) Benchmark Algorithm Speed (at 333 MHz) 1024 Point Complex FFT (Radix 4, with reversal) 27.9 μs FIR Filter (per tap)1 1Assumes two files in multichannel SIMD mode. 1.5 ns IIR Filter (per biquad)1 6.0 ns Matrix Multiply (pipelined) [3×3] × [3×1] [4×4] × [4×1] 13.5 ns 23.9 ns Divide (y/x) 10.5 ns Inverse Square Root 16.3 ns Table 2. ADSP-2136x Family Features Feature ADSP-21362 ADSP-21363 ADSP-21364 ADSP-21365 ADSP-21366 RAM ROM 3M bit 4M bit 3M bit 4M bit 3M bit 4M bit 3M bit 4M bit 3M bit 4M bit Audio Decoders in ROM1 No No No Yes Yes Pulse-Width Modulation Yes Yes Yes Yes Yes S/PDIF Yes No Yes Yes Yes DTCP2 Yes No No Yes No SRC SNR Performance –128 dB No SRC –140 dB –128 dB –128 dB 1 Audio decoding algorithms include PCM, Dolby Digital EX, Dolby Pro Logic IIx, DTS 96/24, Neo:6, DTS ES, MPEG-2 AAC, MP3, and functions like bass management, delay, speaker equalization, graphic equalization, and more. Decoder/post-processor algorithm combination support varies depending upon the chip version and the system configurations. Please visit www.analog.com for complete information. 2The ADSP-21362 and ADSP-21365 processors provide the Digital Transmission Content Protection protocol, a proprietary security protocol. Contact your Analog Devices sales office for more information. Rev. J | Page 4 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 SHARC FAMILY CORE ARCHITECTURE The ADSP-2136x is code-compatible at the assembly level with the ADSP-2126x, ADSP-21160, and ADSP-21161, and with the first generation ADSP-2106x SHARC processors. The ADSP-2136x shares architectural features with the ADSP-2126x and ADSP-2116x SIMD SHARC processors, as shown in Figure 2 and detailed in the following sections. SIMD Computational Engine The processor contains two computational processing elements that operate as a single-instruction, multiple-data (SIMD) engine. The processing elements are referred to as PEX and PEY and each contains an ALU, multiplier, shifter, and register file. PEX is always active, and PEY can be enabled by setting the PEYEN mode bit in the MODE1 register. When this mode is enabled, the same instruction is executed in both processing elements, but each processing element operates on different data. This architecture is efficient at executing math intensive signal processing algorithms. Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in SIMD mode, twice the data bandwidth is required to sustain computational operation in the processing elements. Because of this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When using the DAGs to transfer data in SIMD mode, two data values are transferred with each access of memory or the register file. Independent, Parallel Computation Units Within each processing element is a set of computational units. The computational units consist of an arithmetic/logic unit (ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing element are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. In SIMD mode, the parallel ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit, single-precision floating-point, 40-bit extended-precision floating-point, and 32-bit fixed-point data formats. Figure 2. SHARC Core Block Diagram S SIMD Core INTERRUPT CACHE 5 STAGE PROGRAM SEQUENCER PM ADDRESS 32 DM ADDRESS 32 DM DATA 64 PM DATA 64 DAG1 16x32 MRF 80-BIT MULTIPLIER SHIFTER ALU RF Rx/Fx PEx 16x40-BIT JTAG DMD/PMD 64 PM DATA 48 ASTATx STYKx ASTATy STYKy TIMER RF Sx/SFx PEy 16x40-BIT MRB 80-BIT MSB 80-BIT MSF 80-BIT FLAG SYSTEM I/F USTAT 4x32-BIT PX 64-BIT DAG2 16x32 ALU SHIFTER MULTIPLIER DATA SWAP PM ADDRESS 24 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 5 of 60 | July 2013 Data Register File Each processing element contains a general-purpose data register file. The register files transfer data between the computation units and the data buses, and store intermediate results. These 10-port, 32-register (16 primary, 16 secondary) files, combined with the ADSP-2136x enhanced Harvard architecture, allow unconstrained data flow between computation units and internal memory. The registers in PEX are referred to as R0–R15 and in PEY as S0–S15. Context Switch Many of the processor’s registers have secondary registers that can be activated during interrupt servicing for a fast context switch. The data registers in the register file, the DAG registers, and the multiplier result register all have secondary registers. The primary registers are active at reset, while the secondary registers are activated by control bits in a mode control register. Universal Registers The universal registers are general purpose registers. The USTAT (4) registers allow easy bit manipulations (Set, Clear, Toggle, Test, XOR) for all system registers (control/status) of the core. The data bus exchange register (PX) permits data to be passed between the 64-bit PM data bus and the 64-bit DM data bus, or between the 40-bit register file and the PM/DM data bus. These registers contain hardware to handle the data width difference. Timer A core timer that can generate periodic software interrupts. The core timer can be configured to use FLAG3 as a timer expired signal. Single-Cycle Fetch of Instruction and Four Operands The processor features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data (see Figure 2). With the its separate program and data memory buses and on-chip instruction cache, the processor can simultaneously fetch four operands (two over each data bus) and one instruction (from the cache), all in a single cycle. Instruction Cache The processor includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and four data values. The cache is selective—only the instructions whose fetches conflict with PM bus data accesses are cached. This cache allows full-speed execution of core looped operations such as digital filter multiply-accumulates, and FFT butterfly processing. Data Address Generators with Zero-Overhead Hardware Circular Buffer Support The processor’s two data address generators (DAGs) are used for indirect addressing and implementing circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The two DAGs contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation. Circular buffers can start and end at any memory location. Flexible Instruction Set The 48-bit instruction word accommodates a variety of parallel operations for concise programming. For example, the processor can conditionally execute a multiply, an add, and a subtract in both processing elements while branching and fetching up to four 32-bit values from memory—all in a single instruction. On-Chip Memory The processor contains 3M bits of internal SRAM and 4M bits of internal ROM. Each block can be configured for different combinations of code and data storage (see Table 3). Each memory block supports single-cycle, independent accesses by the core processor and I/O processor. The processor’s memory architecture, in combination with its separate on-chip buses, allows two data transfers from the core and one from the I/O processor, in a single cycle. The SRAM can be configured as a maximum of 96K words of 32-bit data, 192K words of 16-bit data, 64K words of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to 3M bits. All of the memory can be accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles the amount of data that can be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data using the DM bus for transfers, and the other block stores instructions and data using the PM bus for transfers. Using the DM bus and PM buses, with one bus dedicated to each memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. On-Chip Memory Bandwidth The internal memory architecture allows three accesses at the same time to any of the four blocks, assuming no block conflicts. The total bandwidth is gained with DMD and PMD buses (2 × 64-bits, core CLK) and the IOD bus (32-bit, PCLK). ROM-Based Security The processor has a ROM security feature that provides hardware support for securing user software code by preventing unauthorized reading from the internal code. When using this feature, the processor does not boot-load any external code, executing exclusively from internal ROM. Additionally, the processor is not freely accessible via the JTAG port. Instead, a unique 64-bit key, which must be scanned in through the JTAG Rev. J | Page 6 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 or test access port, is assigned to each customer. The device ignores a wrong key. Emulation features and external boot modes are only available after the correct key is scanned. FAMILY PERIPHERAL ARCHITECTURE The ADSP-2136x family contains a rich set of peripherals that support a wide variety of applications, including high quality audio, medical imaging, communications, military, test equipment, 3D graphics, speech recognition, monitor control, imaging, and other applications. Parallel Port The parallel port provides interfaces to SRAM and peripheral devices. The multiplexed address and data pins (AD15–0) can access 8-bit devices with up to 24 bits of address, or 16-bit devices with up to 16 bits of address. In either mode, 8-bit or 16-bit, the maximum data transfer rate is fPCLK/4. DMA transfers are used to move data to and from internal memory. Access to the core is also facilitated through the parallel port register read/write functions. The RD, WR, and ALE (address latch enable) pins are the control pins for the parallel port. Serial Peripheral (Compatible) Interface The processors contain two serial peripheral interface ports (SPIs). The SPI is an industry-standard synchronous serial link, enabling the processor’s SPI-compatible port to communicate with other SPI-compatible devices. The SPI consists of two data pins, one device select pin, and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes and can operate at a maximum baud rate of fPCLK/4. The SPI port can operate in a multimaster environment by interfacing with up to four other SPI-compatible devices, either acting as a master or slave device. The ADSP-2136x SPIcompatible peripheral implementation also features programmable baud rate, clock phase, and polarities. The SPIcompatible port uses open drain drivers to support a multimaster configuration and to avoid data contention. Pulse-Width Modulation The entire PWM module has four groups of four PWM outputs each. Therefore, this module generates 16 PWM outputs in total. Each PWM group produces two pairs of PWM signals on the four PWM outputs. The PWM module is a flexible, programmable, PWM waveform generator that can be programmed to generate the required switching patterns for various applications related to motor and engine control or audio power control. The PWM generator can Table 3. ADSP-2136x Internal Memory Space IOP Registers 0x0000 0000–0003 FFFF Long Word (64 Bits) Extended Precision Normal or Instruction Word (48 Bits) Normal Word (32 Bits) Short Word (16 Bits) Block 0 ROM 0x0004 0000–0x0004 7FFF Block 0 ROM 0x0008 0000–0x0008 AAA9 Block 0 ROM 0x0008 0000–0x0008 FFFF Block 0 ROM 0x0010 0000–0x0011 FFFF Reserved 0x0004 8000–0x0004 BFFF Reserved 0x0009 0000–0x0009 7FFF Reserved 0x0012 0000–0x0012 FFFF Block 0 SRAM 0x0004 C000–0x0004 FFFF Block 0 SRAM 0x0009 0000–0x0009 5554 Block 0 SRAM 0x0009 8000–0x0009 FFFF Block 0 SRAM 0x0013 0000–0x0013 FFFF Block 1 ROM 0x0005 0000–0x0005 7FFF Block 1 ROM 0x000A 0000–0x000A AAA9 Block 1 ROM 0x000A 0000–0x000A FFFF Block 1 ROM 0x0014 0000–0x0015 FFFF Reserved 0x0005 8000–0x0005 BFFF Reserved 0x000B 0000–0x000B 7FFF Reserved 0x0016 0000–0x0016 FFFF Block 1 SRAM 0x0005 C000–0x0005 FFFF Block 1 SRAM 0x000B 0000–0x000B 5554 Block 1 SRAM 0x000B 8000–0x000B FFFF Block 1 SRAM 0x0017 0000–0x0017 FFFF Block 2 SRAM 0x0006 0000–0x0006 1FFF Block 2 SRAM 0x000C 0000–0x000C 2AA9 Block 2 SRAM 0x000C 0000–0x000C 3FFF Block 2 SRAM 0x0018 0000–0x0018 7FFF Reserved 0x0006 2000–0x0006 FFFF Reserved 0x000C 4000–0x000D FFFF Reserved 0x0018 8000–0x001B FFFF Block 3 SRAM 0x0007 0000–0x0007 1FFF Block 3 SRAM 0x000E 0000–0x000E 2AA9 Block 3 SRAM 0x000E 0000–0x000E 3FFF Block 3 SRAM 0x001C 0000–0x001C 7FFF Reserved 0x0007 2000–0x0007 FFFF Reserved 0x000E 4000–0x000F FFFF Reserved 0x001C 8000–0x001F FFFF Reserved 0x0020 0000–0xFFFF FFFF ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 7 of 60 | July 2013 generate either center-aligned or edge-aligned PWM waveforms. In addition, it can generate complementary signals on two outputs in paired mode or independent signals in nonpaired mode (applicable to a single group of four PWM waveforms). The PWM generator is capable of operating in two distinct modes while generating center-aligned PWM waveforms: single update mode or double update mode. In single update mode, the duty cycle values are programmable only once per PWM period. This results in PWM patterns that are symmetrical about the midpoint of the PWM period. In double update mode, a second updating of the PWM registers is implemented at the midpoint of the PWM period. In this mode, it is possible to produce asymmetrical PWM patterns that produce lower harmonic distortion in 3-phase PWM inverters. Digital Audio Interface (DAI) The digital audio interface (DAI) provides the ability to connect various peripherals to any of the DSP’s DAI pins (DAI_P20–1). Programs make these connections using the signal routing unit (SRU, shown in Figure 1). The SRU is a matrix routing unit (or group of multiplexers) that enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI-associated peripherals for a wider variety of applications by using a larger set of algorithms than is possible with nonconfigurable signal paths. The DAI includes six serial ports, an S/PDIF receiver/transmitter, a DTCP cipher, a precision clock generator (PCG), eight channels of asynchronous sample rate converters, an input data port (IDP), an SPI port, six flag outputs and six flag inputs, and three timers. The IDP provides an additional input path to the ADSP-2136x core, configurable as either eight channels of I2S serial data or as seven channels plus a single 20-bit wide synchronous parallel data acquisition port. Each data channel has its own DMA channel that is independent from the processor’s serial ports. Serial Ports The processor features six synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixedsignal peripheral devices such as Analog Devices’ AD183x family of audio codecs, ADCs, and DACs. The serial ports are made up of two data lines, a clock, and a frame sync and they can operate at maximum fPCLK/4. The data lines can be programmed to either transmit or receive and each data line has a dedicated DMA channel. Serial ports are enabled via 12 programmable and simultaneous receive or transmit pins that support up to 24 transmit or 24 receive channels of audio data when all six SPORTs are enabled, or six full duplex TDM streams of 128 channels per frame. Serial port data can be automatically transferred to and from on-chip memory via dedicated DMA channels. Each of the serial ports can work in conjunction with another serial port to provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals. The frame sync and clock are shared. Serial ports operate in four modes: • Standard DSP serial mode • Multichannel (TDM) mode • I2S mode • Left-justified sample pair mode S/PDIF-Compatible Digital Audio Receiver/Transmitter The S/PDIF transmitter has no separate DMA channels. It receives audio data in serial format and converts it into a biphase encoded signal. The serial data input to the transmitter can be formatted as left-justified, I2S, or right-justified with word widths of 16, 18, 20, or 24 bits. The serial data, clock, and frame sync inputs to the S/PDIF transmitter are routed through the signal routing unit (SRU). They can come from a variety of sources such as the SPORTs, external pins, the precision clock generators (PCGs), or the sample rate converters (SRC) and are controlled by the SRU control registers. Digital Transmission Content Protection (DTCP) The DTCP specification defines a cryptographic protocol for protecting audio entertainment content from illegal copying, intercepting, and tampering as it traverses high performance digital buses, such as the IEEE 1394 standard. Only legitimate entertainment content delivered to a source device via another approved copy protection system (such as the DVD content scrambling system) is protected by this copy protection system. This feature is available on the ADSP-21362 and ADSP-21365 processors only. Licensing through DTLA is required for these products. Visit www.dtcp.com for more information. Memory-to-Memory (MTM) If the DTCP module is not used, the memory-to-memory DMA module allows internal memory copies for a standard DMA. Synchronous/Asynchronous Sample Rate Converter (SRC) The sample rate converter (SRC) contains four SRC blocks and is the same core as that used in the AD1896 192 kHz stereo asynchronous sample rate converter and provides up to 140 dB SNR. The SRC block is used to perform synchronous or asynchronous sample rate conversion across independent stereo channels, without using internal processor resources. The four SRC blocks can also be configured to operate together to convert multichannel audio data without phase mismatches. Finally, the SRC is used to clean up audio data from jittery clock sources such as the S/PDIF receiver. The S/PDIF and SRC are not available on the ADSP-21363 models. Input Data Port (IDP) The IDP provides up to eight serial input channels—each with its own clock, frame sync, and data inputs. The eight channels are automatically multiplexed into a single 32-bit by eight-deep FIFO. Data is always formatted as a 64-bit frame and divided into two 32-bit words. The serial protocol is designed to receive Rev. J | Page 8 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 audio channels in I2S, left-justified sample pair, or right-justified mode. One frame sync cycle indicates one 64-bit left/right pair, but data is sent to the FIFO as 32-bit words (that is, onehalf of a frame at a time). The processor supports 24- and 32-bit I2S, 24- and 32-bit left-justified, and 24-, 20-, 18- and 16-bit right-justified formats. Precision Clock Generator (PCG) The precision clock generators (PCG) consist of two units, each of which generates a pair of signals (clock and frame sync) derived from a clock input signal. The units, A and B, are identical in functionality and operate independently of each other. The two signals generated by each unit are normally used as a serial bit clock/frame sync pair. Peripheral Timers The following three general-purpose timers can generate periodic interrupts and be independently set to operate in one of three modes: • Pulse waveform generation mode • Pulse width count/capture mode • External event watchdog mode Each general-purpose timer has one bidirectional pin and four registers that implement its mode of operation: a 6-bit configuration register, a 32-bit count register, a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables all three general-purpose timers independently. I/O PROCESSOR FEATURES The processor’s I/O provides many channels of DMA and controls the extensive set of peripherals described in the previous sections. DMA Controller The processor’s on-chip DMA controllers allow data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the processor’s internal memory and its serial ports, the SPI-compatible (serial peripheral interface) ports, the IDP (input data port), the parallel data acquisition port (PDAP), or the parallel port (PP). See Table 4. SYSTEM DESIGN The following sections provide an introduction to system design options and power supply issues. Program Booting The internal memory of the processor boots at system power-up from an 8-bit EPROM via the parallel port, an SPI master, an SPI slave, or an internal boot. Booting is determined by the boot configuration (BOOT_CFG1–0) pins in Table 5. Selection of the boot source is controlled via the SPI as either a master or slave device, or it can immediately begin executing from ROM. Phase-Locked Loop The processors use an on-chip phase-locked loop (PLL) to generate the internal clock for the core. On power-up, the CLK_CFG1–0 pins are used to select ratios of 32:1, 16:1, and 6:1. After booting, numerous other ratios can be selected via software control. The ratios are made up of software configurable numerator values from 1 to 64 and software configurable divisor values of 1, 2, 4, and 8. Power Supplies The processor has a separate power supply connection for the internal (VDDINT), external (VDDEXT), and analog (AVDD/AVSS) power supplies. The internal and analog supplies must meet the 1.2 V requirement for K, B, and Y grade models, and the 1.0 V requirement for Y models. (For information on the temperature ranges offered for this product, see Operating Conditions on Page 14, Package Information on Page 16, and Ordering Guide on Page 56.) The external supply must meet the 3.3 V requirement. All external supply pins must be connected to the same power supply. Note that the analog supply pin (AVDD) powers the processor’s internal clock generator PLL. To produce a stable clock, it is recommended that PCB designs use an external filter circuit for the AVDD pin. Place the filter components as close as possible to the AVDD/AVSS pins. For an example circuit, see Figure 3. (A recommended ferrite chip is the muRata BLM18AG102SN1D.) To reduce noise coupling, the PCB should use a parallel pair of power and ground planes for VDDINT and GND. Use wide traces to connect the bypass capacitors to the analog power (AVDD) and ground (AVSS) pins. Note that the AVDD and AVSS pins specified in Figure 3 are inputs to the processor and not the analog ground plane on the board—the AVSS pin should connect directly to digital ground (GND) at the chip. Table 4. DMA Channels Peripheral ADSP-2136x SPORTs 12 IDP/PDAP 8 SPI 2 MTM/DTCP 2 Parallel Port 1 Total DMA Channels 25 Table 5. Boot Mode Selection BOOT_CFG1–0 Booting Mode 00 SPI Slave Boot 01 SPI Master Boot 10 Parallel Port Boot via EPROM 11 No booting occurs. Processor executes from internal ROM after reset. ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 9 of 60 | July 2013 Target Board JTAG Emulator Connector Analog Devices’ DSP Tools product line of JTAG emulators uses the IEEE 1149.1 JTAG test access port of the processor to monitor and control the target board processor during emulation. Analog Devices’ DSP Tools product line of JTAG emulators provides emulation at full processor speed, allowing inspection and modification of memory, registers, and processor stacks. The processor’s JTAG interface ensures that the emulator does not affect target system loading or timing. For complete information on Analog Devices’ SHARC DSP Tools product line of JTAG emulator operation, refer to the appropriate emulator user’s guide. DEVELOPMENT TOOLS Analog Devices supports its processors with a complete line of software and hardware development tools, including integrated development environments (which include CrossCore® Embedded Studio and/or VisualDSP++®), evaluation products, emulators, and a wide variety of software add-ins. Integrated Development Environments (IDEs) For C/C++ software writing and editing, code generation, and debug support, Analog Devices offers two IDEs. The newest IDE, CrossCore Embedded Studio, is based on the EclipseTM framework. Supporting most Analog Devices processor families, it is the IDE of choice for future processors, including multicore devices. CrossCore Embedded Studio seamlessly integrates available software add-ins to support real time operating systems, file systems, TCP/IP stacks, USB stacks, algorithmic software modules, and evaluation hardware board support packages. For more information visit www.analog.com/cces. The other Analog Devices IDE, VisualDSP++, supports processor families introduced prior to the release of CrossCore Embedded Studio. This IDE includes the Analog Devices VDK real time operating system and an open source TCP/IP stack. For more information visit www.analog.com/visualdsp. Note that VisualDSP++ will not support future Analog Devices processors. EZ-KIT Lite Evaluation Board For processor evaluation, Analog Devices provides wide range of EZ-KIT Lite® evaluation boards. Including the processor and key peripherals, the evaluation board also supports on-chip emulation capabilities and other evaluation and development features. Also available are various EZ-Extenders®, which are daughter cards delivering additional specialized functionality, including audio and video processing. For more information visit www.analog.com and search on “ezkit” or “ezextender”. EZ-KIT Lite Evaluation Kits For a cost-effective way to learn more about developing with Analog Devices processors, Analog Devices offer a range of EZKIT Lite evaluation kits. Each evaluation kit includes an EZ-KIT Lite evaluation board, directions for downloading an evaluation version of the available IDE(s), a USB cable, and a power supply. The USB controller on the EZ-KIT Lite board connects to the USB port of the user’s PC, enabling the chosen IDE evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also supports in-circuit programming of the on-board Flash device to store user-specific boot code, enabling standalone operation. With the full version of Cross- Core Embedded Studio or VisualDSP++ installed (sold separately), engineers can develop software for supported EZKITs or any custom system utilizing supported Analog Devices processors. Software Add-Ins for CrossCore Embedded Studio Analog Devices offers software add-ins which seamlessly integrate with CrossCore Embedded Studio to extend its capabilities and reduce development time. Add-ins include board support packages for evaluation hardware, various middleware packages, and algorithmic modules. Documentation, help, configuration dialogs, and coding examples present in these add-ins are viewable through the CrossCore Embedded Studio IDE once the add-in is installed. Board Support Packages for Evaluation Hardware Software support for the EZ-KIT Lite evaluation boards and EZExtender daughter cards is provided by software add-ins called Board Support Packages (BSPs). The BSPs contain the required drivers, pertinent release notes, and select example code for the given evaluation hardware. A download link for a specific BSP is located on the web page for the associated EZ-KIT or EZExtender product. The link is found in the Product Download area of the product web page. Middleware Packages Analog Devices separately offers middleware add-ins such as real time operating systems, file systems, USB stacks, and TCP/IP stacks. For more information see the following web pages: • www.analog.com/ucos3 • www.analog.com/ucfs • www.analog.com/ucusbd • www.analog.com/lwip Algorithmic Modules To speed development, Analog Devices offers add-ins that perform popular audio and video processing algorithms. These are available for use with both CrossCore Embedded Studio and Figure 3. Analog Power (AVDD) Filter Circuit HIGH-Z FERRITE BEAD CHIP LOCATE ALL COMPONENTS CLOSE TO AVDD AND AVSS PINS AVDD AVSS 100nF 10nF 1nF ADSP-213xx VDDINT Rev. J | Page 10 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 VisualDSP++. For more information visit www.analog.com and search on “Blackfin software modules” or “SHARC software modules”. Designing an Emulator-Compatible DSP Board (Target) For embedded system test and debug, Analog Devices provides a family of emulators. On each JTAG DSP, Analog Devices supplies an IEEE 1149.1 JTAG Test Access Port (TAP). In-circuit emulation is facilitated by use of this JTAG interface. The emulator accesses the processor’s internal features via the processor’s TAP, allowing the developer to load code, set breakpoints, and view variables, memory, and registers. The processor must be halted to send data and commands, but once an operation is completed by the emulator, the DSP system is set to run at full speed with no impact on system timing. The emulators require the target board to include a header that supports connection of the DSP’s JTAG port to the emulator. For details on target board design issues including mechanical layout, single processor connections, signal buffering, signal termination, and emulator pod logic, see the Engineer-to-Engineer Note “Analog Devices JTAG Emulation Technical Reference” (EE-68) on the Analog Devices website (www.analog.com)—use site search on “EE-68.” This document is updated regularly to keep pace with improvements to emulator support. ADDITIONAL INFORMATION This data sheet provides a general overview of the processor’s architecture and functionality. For detailed information on the ADSP-2136x family core architecture and instruction set, refer to the ADSP-2136x SHARC Processor Hardware Reference and the ADSP-2136x SHARC Processor Programming Reference. RELATED SIGNAL CHAINS A signal chain is a series of signal-conditioning electronic components that receive input (data acquired from sampling either real-time phenomena or from stored data) in tandem, with the output of one portion of the chain supplying input to the next. Signal chains are often used in signal processing applications to gather and process data or to apply system controls based on analysis of real-time phenomena. For more information about this term and related topics, see the “signal chain” entry in the Glossary of EE Terms on the Analog Devices website. Analog Devices eases signal processing system development by providing signal processing components that are designed to work together well. A tool for viewing relationships between specific applications and related components is available on the www.analog.com website. The Circuits from the LabTM site (http://www.analog.com/signalchains) provides: • Graphical circuit block diagram presentation of signal chains for a variety of circuit types and applications • Drill down links for components in each chain to selection guides and application information • Reference designs applying best practice design techniques ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 11 of 60 | July 2013 PIN FUNCTION DESCRIPTIONS The processor’s pin definitions are listed below. Inputs identified as synchronous (S) must meet timing requirements with respect to CLKIN (or with respect to TCK for TMS and TDI). Inputs identified as asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST). Tie or pull unused inputs to VDDEXT or GND, except for the following: DAI_Px, SPICLK, MISO, MOSI, EMU, TMS, TRST, TDI, and AD15–0. Note: These pins have pull-up resistors. Table 6. Pin Descriptions Pin Type State During and After Reset Function AD15–0 I/O/T (pu) Three-state with pull-up enabled Parallel Port Address/Data. The ADSP-2136x parallel port and its corresponding DMA unit output addresses and data for peripherals on these multiplexed pins. The multiplex state is determined by the ALE pin. The parallel port can operate in either 8-bit or 16-bit mode. Each AD pin has a 22.5 kΩ internal pull-up resistor. For details about the AD pin operation, refer to the ADSP-2136x SHARC Processor Hardware Reference. For 8-bit mode: ALE is automatically asserted whenever a change occurs in the upper 16 external address bits, ADDR23–8; ALE is used in conjunction with an external latch to retain the values of the ADDR23–8. For detailed information on I/O operations and pin multiplexing, refer to the ADSP-2136x SHARC Processor Hardware Reference. RD O (pu) Three-state, driven high1 Parallel Port Read Enable. RD is asserted low whenever the processor reads 8-bit or 16- bit data from an external memory device. When AD15–0 are flags, this pin remains deasserted. RD has a 22.5 kΩ internal pull-up resistor. WR O (pu) Three-state, driven high1 Parallel Port Write Enable. WR is asserted low whenever the processor writes 8-bit or 16-bit data to an external memory device. When AD15–0 are flags, this pin remains deasserted. WR has a 22.5 kΩ internal pull-up resistor. ALE O (pd) Three-state, driven low1 Parallel Port Address Latch Enable. ALE is asserted whenever the processor drives a new address on the parallel port address pins. On reset, ALE is active high. However, it can be reconfigured using software to be active low. When AD15–0 are flags, this pin remains deasserted. ALE has a 20 kΩ internal pull-down resistor. FLAG[0]/IRQ0/SPI FLG[0] I/O FLAG[0] INPUT FLAG0/Interrupt Request0/SPI0 Slave Select. FLAG[1]/IRQ1/SPI FLG[1] I/O FLAG[1] INPUT FLAG1/Interrupt Request1/SPI1 Slave Select. FLAG[2]/IRQ2/SPI FLG[2] I/O FLAG[2] INPUT FLAG2/Interrupt Request 2/SPI2 Slave Select. FLAG[3]/TMREXP/ SPIFLG[3] I/O FLAG[3] INPUT FLAG3/Timer Expired/SPI3 Slave Select. DAI_P20–1 I/O/T (pu) Three-state with programmable pull-up Digital Audio Interface Pins. These pins provide the physical interface to the SRU. The SRU configuration registers define the combination of on-chip peripheral inputs or outputs connected to the pin and to the pin’s output enable. The configuration registers of these peripherals then determine the exact behavior of the pin. Any input or output signal present in the SRU can be routed to any of these pins. The SRU provides the connection from the serial ports, input data port, precision clock generators and timers, sample rate converters and SPI to the DAI_P20–1 pins. These pins have internal 22.5 kΩ pull-up resistors that are enabled on reset. These pull-ups can be disabled using the DAI_PIN_PULLUP register. The following symbols appear in the Type column of Table 6: A = asynchronous, G = ground, I = input, O = output, P = power supply, S = synchronous, (A/D) = active drive, (O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor. Rev. J | Page 12 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 SPICLK I/O (pu) Three-state with pull-up enabled, driven high in SPImaster boot mode Serial Peripheral Interface Clock Signal. Driven by the master, this signal controls the rate at which data is transferred. The master can transmit data at a variety of baud rates. SPICLK cycles once for each bit transmitted. SPICLK is a gated clock active during data transfers, only for the length of the transferred word. Slave devices ignore the serial clock if the slave select input is driven inactive (high). SPICLK is used to shift out and shift in the data driven on the MISO and MOSI lines. The data is always shifted out on one clock edge and sampled on the opposite edge of the clock. Clock polarity and clock phase relative to data are programmable into the SPICTL control register and define the transfer format. SPICLK has a 22.5 kΩ internal pull-up resistor. SPIDS I Input only Serial Peripheral Interface Slave Device Select. An active low signal used to select the processor as an SPI slave device. This input signal behaves like a chip select, and is provided by the master device for the slave devices. In multimaster mode the processor’s SPIDS signal can be driven by a slave device to signal to the processor (as SPI master) that an error has occurred, as some other device is also trying to be the master device. If asserted low when the device is in master mode, it is considered a multimaster error. For a single-master, multiple-slave configuration where flag pins are used, this pin must be tied or pulled high to VDDEXT on the master device. For processor to processor SPI interaction, any of the master processor’s flag pins can be used to drive the SPIDS signal on the SPI slave device. MOSI I/O (O/D) (pu) Three-state with pull-up enabled, driven low in SPImaster boot mode SPI Master Out Slave In. If the ADSP-2136x is configured as a master, the MOSI pin becomes a data transmit (output) pin, transmitting output data. If the processor is configured as a slave, the MOSI pin becomes a data receive (input) pin, receiving input data. In an SPI interconnection, the data is shifted out from the MOSI output pin of the master and shifted into the MOSI input(s) of the slave(s). MOSI has a 22.5 kΩ internal pullup resistor. MISO I/O (O/D) (pu) Three-state with pull-up enabled SPI Master In Slave Out. If the ADSP-2136x is configured as a master, the MISO pin becomes a data receive (input) pin, receiving input data. If the processor is configured as a slave, the MISO pin becomes a data transmit (output) pin, transmitting output data. In an SPI interconnection, the data is shifted out from the MISO output pin of the slave and shifted into the MISO input pin of the master. MISO has a 22.5 kΩ internal pull-up resistor. MISO can be configured as O/D by setting the OPD bit in the SPICTL register. Note: Only one slave is allowed to transmit data at any given time. To enable broadcast transmission to multiple SPI slaves, the processor’s MISO pin can be disabled by setting Bit 5 (DMISO) of the SPICTL register equal to 1. CLKIN I Input only Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-2136x clock input. It configures the ADSP-2136x to use either its internal clock generator or an external clock source. Connecting the necessary components to CLKIN and XTAL enables the internal clock generator. Connecting the external clock to CLKIN while leaving XTAL unconnected configures the processors to use the external clock source such as an external clock oscillator. The core is clocked either by the PLL output or this clock input depending on the CLK_CFG1–0 pin settings. CLKIN should not be halted, changed, or operated below the specified frequency. XTAL O Output only2 Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external crystal. CLK_CFG1–0 I Input only Core to CLKIN Ratio Control. These pins set the start up clock frequency. Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset. The allowed values are: 00 = 6:1 01 = 32:1 10 = 16:1 11 = reserved. Table 6. Pin Descriptions (Continued) Pin Type State During and After Reset Function The following symbols appear in the Type column of Table 6: A = asynchronous, G = ground, I = input, O = output, P = power supply, S = synchronous, (A/D) = active drive, (O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor. ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 13 of 60 | July 2013 BOOT_CFG1–0 I Input only Boot Configuration Select. This pin is used to select the boot mode for the processor. The BOOT_CFG pins must be valid before reset is asserted. For a description of the boot mode, refer to Table 5, Boot Mode Selection. RESETOUT O Output only Reset Out. Drives out the core reset signal to an external device. RESET I/A Input only Processor Reset. Resets the ADSP-2136x to a known state. Upon deassertion, there is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program execution from the hardware reset vector address. The RESET input must be asserted (low) at power-up. TCK I Input only3 Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted (pulsed low) after power-up or held low for proper operation of the processors. TMS I/S (pu) Three-state with pull-up enabled Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 kΩ internal pull-up resistor. TDI I/S (pu) Three-state with pull-up enabled Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a 22.5 kΩ internal pull-up resistor. TDO O Three-state4 Test Data Output (JTAG). Serial scan output of the boundary scan path. TRST I/A (pu) Three-state with pull-up enabled Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-up or held low for proper operation of the ADSP-2136x. TRST has a 22.5 kΩ internal pull-up resistor. EMU O (O/D) (pu) Three-state with pull-up enabled Emulation Status. Must be connected to the processor’s JTAG emulators target board connector only. EMU has a 22.5 kΩ internal pull-up resistor. VDDINT P Core Power Supply. Supplies the processor’s core. VDDEXT P I/O Power Supply. AVDD P Analog Power Supply. Supplies the processor’s internal PLL (clock generator). This pin has the same specifications as VDDINT, except that added filtering circuitry is required. For more information, see Power Supplies on Page 8. AVSS G Analog Power Supply Return. GND G Power Supply Return. 1RD, WR, and ALE are three-stated (and not driven) only when RESET is active. 2Output only is a three-state driver with its output path always enabled. 3 Input only is a three-state driver with both output path and pull-up disabled. 4Three-state is a three-state driver with pull-up disabled. Table 6. Pin Descriptions (Continued) Pin Type State During and After Reset Function The following symbols appear in the Type column of Table 6: A = asynchronous, G = ground, I = input, O = output, P = power supply, S = synchronous, (A/D) = active drive, (O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor. Rev. J | Page 14 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 SPECIFICATIONS Specifications are subject to change without notice. OPERATING CONDITIONS K Grade B Grade Y Grade Parameter Description Min Nom Max Min Nom Max Min Nom Max Unit VDDINT Internal (Core) Supply Voltage 1.14 1.2 1.26 1.14 1.2 1.26 0.95 1.0 1.05 V AVDD Analog (PLL) Supply Voltage 1.14 1.2 1.26 1.14 1.2 1.26 0.95 1.0 1.05 V VDDEXT External (I/O) Supply Voltage 3.13 3.3 3.47 3.13 3.3 3.47 3.13 3.3 3.47 V VIH 1 1 Applies to input and bidirectional pins: AD15–0, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOT_CFGx, CLK_CFGx, RESET, TCK, TMS, TDI, and TRST. High Level Input Voltage @ VDDEXT = Max 2.0 VDDEXT + 0.5 2.0 VDDEXT + 0.5 2.0 VDDEXT + 0.5 V VIL 1 Low Level Input Voltage @ VDDEXT = Min –0.5 +0.8 –0.5 +0.8 –0.5 +0.8 V VIH_CLKIN 2 2 Applies to input pin CLKIN. High Level Input Voltage @ VDDEXT = Max 1.74 VDDEXT + 0.5 1.74 VDDEXT + 0.5 1.74 VDDEXT + 0.5 V VIL_CLKIN Low Level Input Voltage @ VDDEXT = Min –0.5 +1.19 –0.5 +1.19 –0.5 +1.19 V TJ 3, 4 3 See Thermal Characteristics on Page 47 for information on thermal specifications. 4 See the Engineer-to-Engineer Note “Estimating Power for the ADSP-21362 SHARC Processors” (EE-277) for further information. Junction Temperature 136-Ball CSP_BGA 0 +110 –40 +125 –40 +125 °C TJ 3, 4 Junction Temperature 144-Lead LQFP_EP 0 +110 –40 +125 –40 +125 °C ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 15 of 60 | July 2013 ELECTRICAL CHARACTERISTICS Parameter Description Test Conditions Min Max Unit VOH 1 High Level Output Voltage @ VDDEXT = Min, IOH = –1.0 mA2 2.4 V VOL 1 Low Level Output Voltage @ VDDEXT = Min, IOL = 1.0 mA2 0.4 V IIH 3, 4 High Level Input Current @ VDDEXT = Max, VIN = VDDEXT Max 10 μA IIL 3 Low Level Input Current @ VDDEXT = Max, VIN = 0 V 10 μA IILPU 4 Low Level Input Current Pull-Up @ VDDEXT = Max, VIN = 0 V 200 μA IOZH 5, 6 Three-State Leakage Current @ VDDEXT = Max, VIN = VDDEXT Max 10 μA IOZL 5 Three-State Leakage Current @ VDDEXT = Max, VIN = 0 V 10 μA IOZLPU 6 Three-State Leakage Current Pull-Up @ VDDEXT = Max, VIN = 0 V 200 μA IDD-INTYP 7, 8 Supply Current (Internal) tCCLK = Min, VDDINT = Nom 800 mA IAVDD 9 Supply Current (Analog) AVDD = Max 10 mA CIN 10, 11 Input Capacitance fIN = 1 MHz, TCASE = 25°C, VIN = 1.2 V 4.7 pF 1 Applies to output and bidirectional pins: AD15–0, RD, WR, ALE, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, and XTAL. 2 See Output Drive Currents on Page 46 for typical drive current capabilities. 3 Applies to input pins: SPIDS, BOOT_CFGx, CLK_CFGx, TCK, RESET, and CLKIN. 4 Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI. 5 Applies to three-stateable pins: FLAG3–0. 6 Applies to three-stateable pins with 22.5 kΩ pull-ups: AD15–0, DAI_Px, SPICLK, EMU, MISO, and MOSI. 7Typical internal current data reflects nominal operating conditions. 8 See the Engineer-to-Engineer Note “Estimating Power for the ADSP-21362 SHARC Processors” (EE-277) for further information. 9Characterized, but not tested. 10Applies to all signal pins. 11Guaranteed, but not tested. Rev. J | Page 16 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 PACKAGE INFORMATION The information presented in Figure 4 provides details about the package branding for the ADSP-2136x processor. For a complete listing of product availability, see Ordering Guide on Page 56. ESD CAUTION MAXIMUM POWER DISSIPATION See the Engineer-to-Engineer Note “Estimating Power for the ADSP-21362 SHARC Processors” (EE-277) for detailed thermal and power information regarding maximum power dissipation. For information on package thermal specifications, see Thermal Characteristics on Page 47. ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed in Table 8 may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TIMING SPECIFICATIONS Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, it is not meaningful to add parameters to derive longer times. For voltage reference levels, see Figure 39 on Page 46 under Test Conditions. Switching Characteristics specify how the processor changes its signals. Circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given circumstance. Use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied. Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the processor operates correctly with other devices. Core Clock Requirements The processor’s internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor core, and serial ports. During reset, program the ratio between the processor’s internal clock frequency and external (CLKIN) clock frequency with the CLK_CFG1–0 pins. The processor’s internal clock switches at higher frequencies than the system input clock (CLKIN). To generate the internal clock, the processor uses an internal phase-locked loop (PLL, see Figure 5). This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the processor’s internal clock. Voltage Controlled Oscillator In application designs, the PLL multiplier value should be selected in such a way that the VCO frequency never exceeds fVCO specified in Table 11. Figure 4. Typical Package Brand Table 7. Package Brand Information Brand Key Field Description t Temperature Range pp Package Type Z RoHS Compliant Designation cc See Ordering Guide vvvvvv.x Assembly Lot Code n.n Silicon Revision # RoHS Compliant Designation yyww Date Code tppZ-cc S ADSP-2136x a #yyww country_of_origin vvvvvv.x n.n ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Table 8. Absolute Maximum Ratings Parameter Rating Internal (Core) Supply Voltage (VDDINT) –0.3 V to +1.5 V Analog (PLL) Supply Voltage (AVDD) –0.3 V to +1.5 V External (I/O) Supply Voltage (VDDEXT) –0.3 V to +4.6 V Input Voltage –0.5 V to +3.8 V Output Voltage Swing –0.5 V to VDDEXT + 0.5 V Load Capacitance 200 pF Storage Temperature Range –65°C to +150°C Junction Temperature While Biased 125°C ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 17 of 60 | July 2013 • The product of CLKIN and PLLM must never exceed 1/2 fVCO (max) in Table 11 if the input divider is not enabled (INDIV = 0). • The product of CLKIN and PLLM must never exceed fVCO (max) in Table 11 if the input divider is enabled (INDIV = 1). The VCO frequency is calculated as follows: fVCO = 2 × PLLM × fINPUT fCCLK = (2 × PLLM × fINPUT) ÷ (2 × PLLN) where: fVCO = VCO output PLLM = Multiplier value programmed in the PMCTL register. During reset, the PLLM value is derived from the ratio selected using the CLK_CFG pins in hardware. PLLN = 1, 2, 4, 8 based on the PLLD value programmed on the PMCTL register. During reset this value is 1. fINPUT = Input frequency to the PLL. fINPUT = CLKIN when the input divider is disabled or fINPUT = CLKIN ÷ 2 when the input divider is enabled Note the definitions of the clock periods that are a function of CLKIN and the appropriate ratio control shown in Table 9. All of the timing specifications for the ADSP-2136x peripherals are defined in relation to tPCLK. Refer to the peripheral specific section for each peripheral’s timing information. Figure 5 shows core to CLKIN relationships with external oscillator or crystal. The shaded divider/multiplier blocks denote where clock ratios can be set through hardware or software using the power management control register (PMCTL). For more information, refer to the ADSP-2136x SHARC Processor Hardware Reference. Table 9. Clock Periods Timing Requirements Description tCK CLKIN Clock Period tCCLK Processor Core Clock Period tPCLK Peripheral Clock Period = 2 × tCCLK Figure 5. Core Clock and System Clock Relationship to CLKIN CLKOUT (TEST ONLY)* LOOP FILTER PLL fVCO ÷ (2 × PLLM) VCO PLL DIVIDER PMCTL (2 × PLLN) fVCO fCCLK CLK_CFGx/ PMCTL (2 × PLLM) CLKIN PCLK XTAL CLKIN DIVIDER RESETOUT DELAY OF 4096 CLKIN CYCLES RESET BUF BUF PMCTL (INDIV) PMCTL (PLLBP) BYPASS MUX PIN MUX DIVIDE BY 2 RESETOUT PMCTL (CLKOUTEN) CCLK CORERST *CLKOUT (TEST ONLY) FREQUENCY IS THE SAME AS fINPUT. THIS SIGNAL IS NOT SPECIFIED OR SUPPORTED FOR ANY DESIGN. fINPUT Rev. J | Page 18 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Power-Up Sequencing The timing requirements for processor startup are given in Table 10. Note that during power-up, when the VDDINT power supply comes up after VDDEXT, a leakage current of the order of three-state leakage current pull-up, pull-down, may be observed on any pin, even if that is an input only (for example the RESET pin) until the VDDINT rail has powered up. Table 10. Power-Up Sequencing Timing Requirements (Processor Startup) Parameter Min Max Unit Timing Requirements tRSTVDD RESET Low Before VDDINT/VDDEXT On 0 ns tIVDDEVDD VDDINT On Before VDDEXT –50 +200 ms tCLKVDD 1 CLKIN Valid After VDDINT/VDDEXT Valid 0 200 ms tCLKRST CLKIN Valid Before RESET Deasserted 102 μs tPLLRST PLL Control Setup Before RESET Deasserted 20 μs Switching Characteristic tCORERST Core Reset Deasserted After RESET Deasserted 4096tCK + 2 tCCLK 3, 4 1Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 V rails and 3.3 V rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds, depending on the design of the power supply subsystem. 2Assumes a stable CLKIN signal, after meeting worst-case start-up timing of crystal oscillators. Refer to your crystal oscillator manufacturer’s data sheet for start-up time. Assume a 25 ms maximum oscillator start-up time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal. 3 Applies after the power-up sequence is complete. Subsequent resets require a minimum of 4 CLKIN cycles for RESET to be held low to properly initialize and propagate default states at all I/O pins. 4The 4096 cycle count depends on tSRST specification in Table 12. If setup time is not met, 1 additional CLKIN cycle can be added to the core reset time, resulting in 4097 cycles maximum. Figure 6. Power-Up Sequencing tRSTVDD tCLKVDD tCLKRST tPLLRST tCORERST VDDEXT VDDINT CLKIN CLK_CFG1–0 RESET RESETOUT tIVDDEVDD ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 19 of 60 | July 2013 Clock Input Clock Signals The processor can use an external clock or a crystal. Refer to the CLKIN pin description in Table 6 on Page 11. The user application program can configure the processor to use its internal clock generator by connecting the necessary components to the CLKIN and XTAL pins. Figure 8 shows the component connections used for a fundamental frequency crystal operating in parallel mode. Note that the clock rate is achieved using a 16.67 MHz crystal and a PLL multiplier ratio 16:1. (CCLK:CLKIN achieves a clock speed of 266.72 MHz.) To achieve the full core clock rate, programs need to configure the multiplier bits in the PMCTL register. Table 11. Clock Input Parameter 200 MHz1 1 Applies to all 200 MHz models. See Ordering Guide on Page 56. 333 MHz2 2 Applies to all 333 MHz models. See Ordering Guide on Page 56. Min Max Min Max Unit Timing Requirements tCK CLKIN Period 303 3 Applies only for CLK_CFG1–0 = 00 and default values for PLL control bits in the PMCTL register. 100 18 100 ns tCKL CLKIN Width Low 12.5 7.5 ns tCKH CLKIN Width High 12.5 7.5 ns tCKRF CLKIN Rise/Fall (0.4 V to 2.0 V) 3 3 ns tCCLK 4 4 Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK. CCLK Period 5.0 10 3.0 10 ns tVCO 5 5 See Figure 5 on Page 17 for VCO diagram. VCO Frequency 200 600 200 800 MHz tCKJ 6, 7 6 Actual input jitter should be combined with AC specifications for accurate timing analysis. 7 Jitter specification is maximum peak-to-peak time interval error (TIE) jitter. CLKIN Jitter Tolerance –250 +250 –250 +250 ps Figure 7. Clock Input CLKIN tCK tCKH tCKL tCKJ Figure 8. Recommended Circuit for Fundamental Mode Crystal Operation C1 22pF Y1 R1 1M * CLKIN XTAL C2 22pF 24.576MHz R2 * ADSP-2136x R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL DRIVE POWER. REFER TO CRYSTAL MANUFACTURER’S SPECIFICATIONS. *TYPICAL VALUES 47Ω Ω Rev. J | Page 20 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Reset Interrupts The following timing specification applies to the FLAG0, FLAG1, and FLAG2 pins when they are configured as IRQ0, IRQ1, and IRQ2 interrupts. Table 12. Reset Parameter Min Unit Timing Requirements tWRST 1 RESET Pulse Width Low 4 × tCK ns tSRST RESET Setup Before CLKIN Low 8 ns 1 Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 μs while RESET is low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator). Figure 9. Reset CLKIN RESET tWRST tSRST Table 13. Interrupts Parameter Min Unit Timing Requirement tIPW IRQx Pulse Width 2 × tPCLK +2 ns Figure 10. Interrupts INTERRUPT INPUTS tIPW ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 21 of 60 | July 2013 Core Timer The following timing specification applies to FLAG3 when it is configured as the core timer (TMREXP pin). Timer PWM_OUT Cycle Timing The following timing specification applies to Timer0, Timer1, and Timer2 in PWM_OUT (pulse-width modulation) mode. Timer signals are routed to the DAI_P20–1 pins through the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins. Table 14. Core Timer Parameter Min Unit Switching Characteristic tWCTIM TMREXP Pulse Width 2 × tPCLK – 1 ns Figure 11. Core Timer FLAG3 (TMREXP) tWCTIM Table 15. Timer PWM_OUT Timing Parameter Min Max Unit Switching Characteristic tPWMO Timer Pulse Width Output 2 × tPCLK – 1 2 × (231 – 1) × tPCLK ns Figure 12. Timer PWM_OUT Timing PWM OUTPUTS tPWMO Rev. J | Page 22 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Timer WDTH_CAP Timing The following timing specification applies to Timer0, Timer1, and Timer2 in WDTH_CAP (pulse width count and capture) mode. Timer signals are routed to the DAI_P20–1 pins through the SRU. Therefore, the timing specification provided below are valid at the DAI_P20–1 pins. DAI Pin to Pin Direct Routing For direct pin connections only (for example, DAI_PB01_I to DAI_PB02_O). Table 16. Timer Width Capture Timing Parameter Min Max Unit Timing Requirement tPWI Timer Pulse Width 2 × tPCLK 2 × (231– 1) × tPCLK ns Figure 13. Timer Width Capture Timing TIMER CAPTURE INPUTS tPWI Table 17. DAI Pin to Pin Routing Parameter Min Max Unit Timing Requirement tDPIO Delay DAI Pin Input Valid to DAI Output Valid 1.5 10 ns Figure 14. DAI Pin to Pin Direct Routing DAI_Pn DAI_Pm tDPIO ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 23 of 60 | July 2013 Precision Clock Generator (Direct Pin Routing) This timing is only valid when the SRU is configured such that the precision clock generator (PCG) takes its inputs directly from the DAI pins (via pin buffers) and sends its outputs directly to the DAI pins. For the other cases, where the PCG’s inputs and outputs are not directly routed to/from DAI pins (via pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins (DAI_P01 through DAI_P20). Table 18. Precision Clock Generator (Direct Pin Routing) K and B Grade Y Grade Parameter Min Max Max Unit Timing Requirements tPCGIP Input Clock Period tPCLK × 4 ns tSTRIG PCG Trigger Setup Before Falling Edge of PCG Input Clock 4.5 ns tHTRIG PCG Trigger Hold After Falling Edge of PCG Input Clock 3 ns Switching Characteristics tDPCGIO PCG Output Clock and Frame Sync Active Edge Delay After PCG Input Clock 2.5 10 10 ns tDTRIGCLK PCG Output Clock Delay After PCG Trigger 2.5 + (2.5 × tPCGIP) 10 + (2.5 × tPCGIP) 12 + (2.5 × tPCGIP) ns tDTRIGFS PCG Frame Sync Delay After PCG Trigger 2.5 + ((2.5 + D – PH) × tPCGIP) 10 + ((2.5 + D – PH) × tPCGIP) 12 + ((2.5 + D – PH) × tPCGIP) ns tPCGOP 1 Output Clock Period 2 × tPCGIP – 1 ns D = FSxDIV, PH = FSxPHASE. For more information, refer to the ADSP-2136x SHARC Processor Hardware Reference, “Precision Clock Generators” chapter. 1 In normal mode, tPCGOP (min) = 2 × tPCGIP. Figure 15. Precision Clock Generator (Direct Pin Routing) DAI_Pn PCG_TRIGx_I DAI_Pm PCG_EXTx_I (CLKIN) DAI_Py PCG_CLKx_O DAI_Pz PCG_FSx_O tDTRIGFS tDTRIGCLK tDPCGIO tSTRIG tHTRIG tDPCGIO tPCGOP tPCGIP Rev. J | Page 24 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Flags The timing specifications provided below apply to the FLAG3–0 and DAI_P20–1 pins, the parallel port, and the serial peripheral interface (SPI). See Table 6 on Page 11 for more information on flag use. Table 19. Flags Parameter Min Unit Timing Requirement tFIPW FLAG3–0 IN Pulse Width 2 × tPCLK + 3 ns Switching Characteristic tFOPW FLAG3–0 OUT Pulse Width 2 × tPCLK – 1 ns Figure 16. Flags FLAG INPUTS FLAG OUTPUTS tFOPW tFIPW ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 25 of 60 | July 2013 Memory Read—Parallel Port Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) when the processor is accessing external memory space. Table 20. 8-Bit Memory Read Cycle Parameter K and B Grade Y Grade Min Max Min Max Unit Timing Requirements tDRS AD7–0 Data Setup Before RD High 3.3 4.5 ns tDRH AD7–0 Data Hold After RD High 0 0 ns tDAD AD15–8 Address to AD7–0 Data Valid D + tPCLK – 5.0 D + tPCLK – 5.0 ns Switching Characteristics tALEW ALE Pulse Width 2 × tPCLK – 2.0 2 × tPCLK – 2.0 ns tADAS 1 AD15–0 Address Setup Before ALE Deasserted tPCLK – 2.5 tPCLK – 2.5 ns tRRH Delay Between RD Rising Edge to Next Falling Edge H + tPCLK – 1.4 H + tPCLK – 1.4 ns tALERW ALE Deasserted to Read Asserted 2 × tPCLK – 3.8 2 × tPCLK – 3.8 ns tRWALE Read Deasserted to ALE Asserted F + H + 0.5 F + H + 0.5 ns tADAH 1 AD15–0 Address Hold After ALE Deasserted tPCLK – 2.3 tPCLK – 2.3 ns tALEHZ 1 ALE Deasserted to AD7–0 Address in High-Z tPCLK tPCLK + 3.0 tPCLK tPCLK + 3.8 ns tRW RD Pulse Width D – 2.0 D – 2.0 ns tRDDRV AD7–0 ALE Address Drive After Read High F + H + tPCLK – 2.3 F + H + tPCLK – 2.3 ns tADRH AD15–8 Address Hold After RD High H H ns tDAWH AD15–8 Address to RD High D + tPCLK – 4.0 D + tPCLK – 4.0 ns D = (The value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK H = tPCLK (if a hold cycle is specified, else H = 0) F = 7 × tPCLK (if FLASH_MODE is set, else F = 0) 1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low. Figure 17. Read Cycle for 8-Bit Memory Timing ALE RD WR AD15–8 AD7–0 tALEW tALERW tRWALE tRW tRRH tRDDRV tDAWH tADAS tADAH VALID ADDRESS VALID ADDRESS VALID ADDRESS VALID ADDRESS VALID ADDRESS VALID ADDRESS VALID DATA VALID DATA tADRH tDAD tDRS tDRH tALEHZ NOTE: MEMORY READS ALWAYS OCCUR IN GROUPS OF FOUR BETWEEN ALE CYCLES. THIS FIGURE SHOWS ONLY TWO MEMORY READS TO PROVIDE THE NECESSARY TIMING INFORMATION. Rev. J | Page 26 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Table 21. 16-Bit Memory Read Cycle Parameter K and B Grade Y Grade Min Max Min Max Unit Timing Requirements tDRS AD15–0 Data Setup Before RD High 3.3 4.5 ns tDRH AD15–0 Data Hold After RD High 0 0 ns Switching Characteristics tALEW ALE Pulse Width 2 × tPCLK – 2.0 2 × tPCLK – 2.0 ns tADAS 1 AD15–0 Address Setup Before ALE Deasserted tPCLK – 2.5 tPCLK – 2.5 ns tALERW ALE Deasserted to Read Asserted 2 × tPCLK – 3.8 2 × tPCLK – 3.8 ns tRRH 2 Delay Between RD Rising Edge to Next Falling Edge H + tPCLK – 1.4 H + tPCLK – 1.4 ns tRWALE Read Deasserted to ALE Asserted F + H + 0.5 F + H + 0.5 ns tRDDRV ALE Address Drive After Read High F + H + tPCLK – 2.3 F + H + tPCLK – 2.3 ns tADAH 1 AD15–0 Address Hold After ALE Deasserted tPCLK – 2.3 tPCLK – 2.3 ns tALEHZ1 ALE Deasserted to Address/Data15–0 in High-Z tPCLK tPCLK + 3.0 tPCLK tPCLK + 3.8 ns tRW RD Pulse Width D – 2.0 D – 2.0 ns D = (The value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK H = tPCLK (if a hold cycle is specified, else H = 0) F = 7 × tPCLK (if FLASH_MODE is set, else F = 0) 1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low. 2This parameter is only available when in EMPP = 0 mode. Figure 18. Read Cycle for 16-Bit Memory Timing tRWALE tRDDRV VALID VALID ADDRESS VALID DATA VALID DATA ADDRESS ALE RD WR AD15–0 tADAS tADAH tALEHZ tDRS tDRH tALEW tALERW tRW tRRH NOTE: FOR 16-BIT MEMORY READS, WHEN EMPP 0, ONLY ONE RD PULSE OCCURS BETWEEN ALE CYCLES. WHEN EMPP = 0, MULTIPLE RD PULSES OCCUR BETWEEN ALE CYCLES. FOR COMPLETE INFORMATION, SEE THE ADSP-2136x SHARC PROCESSOR HARDWARE REFERENCE. ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 27 of 60 | July 2013 Memory Write—Parallel Port Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) when the processor is accessing external memory space. Table 22. 8-Bit Memory Write Cycle Parameter K and B Grade Y Grade Min Min Unit Switching Characteristics tALEW ALE Pulse Width 2 × tPCLK – 2.0 2 × tPCLK – 2.0 ns tADAS 1 AD15–0 Address Setup Before ALE Deasserted tPCLK – 2.8 tPCLK – 2.8 ns tALERW ALE Deasserted to Write Asserted 2 × tPCLK – 3.8 2 × tPCLK – 3.8 ns tRWALE Write Deasserted to ALE Asserted H + 0.5 H + 0.5 ns tWRH Delay Between WR Rising Edge to Next WR Falling Edge F + H + tPCLK – 2.3 F + H + tPCLK – 2.3 ns tADAH 1 AD15–0 Address Hold After ALE Deasserted tPCLK – 0.5 tPCLK – 0.5 ns tWW WR Pulse Width D – F – 2.0 D – F – 2.0 ns tADWL AD15–8 Address to WR Low tPCLK – 2.8 tPCLK – 3.5 ns tADWH AD15–8 Address Hold After WR High H H ns tDWS AD7–0 Data Setup Before WR High D – F + tPCLK – 4.0 D – F + tPCLK – 4.0 ns tDWH AD7–0 Data Hold After WR High H H ns tDAWH AD15–8 Address to WR High D – F + tPCLK – 4.0 D – F + tPCLK – 4.0 ns D = (The value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK. H = tPCLK (if a hold cycle is specified, else H = 0) F = 7 × tPCLK (if FLASH_MODE is set, else F = 0). If FLASH_MODE is set, D must be 9 × tPCLK. 1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low. Figure 19. Write Cycle for 8-Bit Memory Timing AD15-8 VALID ADDRESS VALID ADDRESS tADAS AD7-0 ALE RD WR tADAH tADWH tADWL VALID DATA tDAWH tWRH tRWALE VALID ADDRESS VALID DATA tALEW tALERW tWW tDWS tDWH VALID ADDRESS NOTE: MEMORY WRITES ALWAYS OCCUR IN GROUPS OF FOUR BETWEEN ALE CYCLES. THIS FIGURE SHOWS ONLY TWO MEMORY WRITES TO PROVIDE THE NECESSARY TIMING INFORMATION. Rev. J | Page 28 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Table 23. 16-Bit Memory Write Cycle Parameter K and B Grade Y Grade Min Min Unit Switching Characteristics tALEW ALE Pulse Width 2 × tPCLK – 2.0 2 × tPCLK – 2.0 ns tADAS 1 AD15–0 Address Setup Before ALE Deasserted tPCLK – 2.5 tPCLK – 2.5 ns tALERW ALE Deasserted to Write Asserted 2 × tPCLK – 3.8 2 × tPCLK – 3.8 ns tRWALE Write Deasserted to ALE Asserted H + 0.5 H + 0.5 ns tWRH 2 Delay Between WR Rising Edge to Next WR Falling Edge F + H + tPCLK – 2.3 F + H + tPCLK – 2.3 ns tADAH 1 AD15–0 Address Hold After ALE Deasserted tPCLK – 2.3 tPCLK – 2.3 ns tWW WR Pulse Width D – F – 2.0 D – F – 2.0 ns tDWS AD15–0 Data Setup Before WR High D – F + tPCLK – 4.0 D – F + tPCLK – 4.0 ns tDWH AD15–0 Data Hold After WR High H H ns D = (the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK. H = tPCLK (if a hold cycle is specified, else H = 0) F = 7 × tPCLK (if FLASH_MODE is set, else F = 0). If FLASH_MODE is set, D must be 9 × tPCLK. tPCLK = (peripheral) clock period = 2 × tCCLK 1 On reset, ALE is an active high cycle. However, it can be configured by software to be active low. 2This parameter is only available when in EMPP = 0 mode. Figure 20. Write Cycle for 16-Bit Memory Timing AD15-0 VALID ADDRESS VALID DATA tADAS ALE RD WR tADAH tWRH tRWALE tALEW tALERW tWW tDWS tDWH VALID DATA VALID ADDRESS NOTE: FOR 16-BIT MEMORY WRITES, WHEN EMPP 0, ONLY ONE WR PULSE OCCURS BETWEEN ALE CYCLES. WHEN EMPP = 0, MULTIPLE WR PULSES OCCUR BETWEEN ALE CYCLES. FOR COMPLETE INFORMATION, SEE THE ADSP-2136x SHARC PROCESSOR HARDWARE REFERENCE. ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 29 of 60 | July 2013 Serial Ports To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync (FS) delay and frame sync setup and hold, 2) data delay and data setup and hold, and 3) serial clock (SCLK) width. Serial port signals are routed to the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins. Table 24. Serial Ports—External Clock K and B Grade Y Grade Parameter Min Max Max Unit Timing Requirements tSFSE 1 Frame Sync Setup Before SCLK (Externally Generated Frame Sync in Either Transmit or Receive Mode) 2.5 ns tHFSE 1 Frame Sync Hold After SCLK (Externally Generated Frame Sync in Either Transmit or Receive Mode) 2.5 ns tSDRE 1 Receive Data Setup Before Receive SCLK 2.5 ns tHDRE 1 Receive Data Hold After SCLK 2.5 ns tSCLKW SCLK Width (tPCLK × 4) ÷ 2 – 2 ns tSCLK SCLK Period tPCLK × 4 ns Switching Characteristics tDFSE 2 Frame Sync Delay After SCLK (Internally Generated Frame Sync in Either Transmit or Receive Mode) 9.5 11 ns tHOFSE 2 Frame Sync Hold After SCLK (Internally Generated Frame Sync in Either Transmit or Receive Mode) 2 ns tDDTE 2 Transmit Data Delay After Transmit SCLK 9.5 11 ns tHDTE 2 Transmit Data Hold After Transmit SCLK 2 ns 1 Referenced to sample edge. 2 Referenced to drive edge. Table 25. Serial Ports—Internal Clock K and B Grade Y Grade Parameter Min Max Max Unit Timing Requirements tSFSI 1 Frame Sync Setup Before SCLK (Externally Generated Frame Sync in Either Transmit or Receive Mode) 7 ns tHFSI 1 Frame Sync Hold After SCLK (Externally Generated Frame Sync in Either Transmit or Receive Mode) 2.5 ns tSDRI 1 Receive Data Setup Before SCLK 7 ns tHDRI 1 Receive Data Hold After SCLK 2.5 ns Switching Characteristics tDFSI 2 Frame Sync Delay After SCLK (Internally Generated Frame Sync in Transmit Mode) 3 3.5 ns tHOFSI 2 Frame Sync Hold After SCLK (Internally Generated Frame Sync in Transmit Mode) –1.0 ns tDFSIR 2 Frame Sync Delay After SCLK (Internally Generated Frame Sync in Receive Mode) 8 9.5 ns tHOFSIR 2 Frame Sync Hold After SCLK (Internally Generated Frame Sync in Receive Mode) –1.0 ns tDDTI 2 Transmit Data Delay After SCLK 3 4.0 ns tHDTI 2 Transmit Data Hold After SCLK –1.0 ns tSCLKIW Transmit or Receive SCLK Width 2 × tPCLK – 2 2 × tPCLK + 2 2 × tPCLK + 2 ns 1 Referenced to the sample edge. 2 Referenced to drive edge. Rev. J | Page 30 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Figure 21. Serial Ports DRIVE EDGE SAMPLE EDGE DAI_P20–1 (DATA CHANNEL A/B) DAI_P20–1 (FS) DAI_P20–1 (SCLK) tHOFSI tHFSI tHDRI DATA RECEIVE—INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DAI_P20–1 (DATA CHANNEL A/B) DAI_P20–1 (FS) DAI_P20–1 (SCLK) tHFSI tDDTI DATA TRANSMIT—INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DAI_P20–1 (DATA CHANNEL A/B) DAI_P20–1 (FS) DAI_P20–1 (SCLK) tHOFSI tHOFSE tHDTI tHFSE tHDTE tDDTE DATA TRANSMIT—EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE DAI_P20–1 (DATA CHANNEL A/B) DAI_P20–1 (FS) DAI_P20–1 (SCLK) tHOFSE tHFSE tHDRE DATA RECEIVE—EXTERNAL CLOCK tSCLKIW tDFSI tSFSI tSDRI tSCLKW tDFSE tSFSE tSDRE tDFSE tSFSI tSFSE tDFSI tSCLKIW tSCLKW ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 31 of 60 | July 2013 Table 26. Serial Ports—External Late Frame Sync K and B Grade Y Grade Parameter Min Max Max Unit Switching Characteristics tDDTLFSE 1 Data Delay from Late External Transmit Frame Sync or External Receive FS with MCE = 1, MFD = 0 9 10.5 ns tDDTENFS 1 Data Enable for MCE = 1, MFD = 0 0.5 ns 1The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair as well as serial mode, and MCE = 1, MFD = 0. Figure 22. External Late Frame Sync DRIVE SAMPLE EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0 2ND BIT DAI_P20–1 (SCLK) DAI_P20–1 (FS) DAI_P20–1 (DATA CHANNEL A/B) 1ST BIT DRIVE tDDTE/I tHDTE/I tDDTLFSE tDDTENFS tSFSE/I DRIVE SAMPLE LATE EXTERNAL TRANSMIT FS 2ND BIT DAI_P20–1 (SCLK) DAI_P20–1 (FS) DAI_P20–1 (DATA CHANNEL A/B) 1ST BIT DRIVE tDDTE/I tHDTE/I tDDTLFSE tDDTENFS tSFSE/I tHFSE/I tHFSE/I Rev. J | Page 32 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Table 27. Serial Ports—Enable and Three-State K and B Grade Y Grade Parameter Min Max Max Unit Switching Characteristics tDDTEN 1 Data Enable from External Transmit SCLK 2 ns tDDTTE 1 Data Disable from External Transmit SCLK 7 8.5 ns tDDTIN 1 Data Enable from Internal Transmit SCLK –1 ns 1 Referenced to drive edge. Figure 23. Enable and Three-State DRIVE EDGE DRIVE EDGE DRIVE EDGE tDDTIN tDDTEN tDDTTE DAI_P20–1 (SCLK, INT) DAI_P20–1 (DATA CHANNEL A/B) DAI_P20–1 (SCLK, EXT) DAI_P20–1 (DATA CHANNEL A/B) ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 33 of 60 | July 2013 Input Data Port (IDP) The timing requirements for the IDP are given in Table 28. IDP signals are routed to the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins. Table 28. IDP Parameter Min Unit Timing Requirements tSISFS 1 Frame Sync Setup Before Clock Rising Edge 3 ns tSIHFS 1 Frame Sync Hold After Clock Rising Edge 3 ns tSISD 1 Data Setup Before Clock Rising Edge 3 ns tSIHD 1 Data Hold After Clock Rising Edge 3 ns tIDPCLKW Clock Width (tPCLK × 4) ÷ 2 – 1 ns tIDPCLK Clock Period tPCLK × 4 ns 1 The data, clock, and frame sync signals can come from any of the DAI pins. Clock and frame sync can also come via the PCGs or SPORTs. The PCG’s input can be either CLKIN or any of the DAI pins. Figure 24. IDP Master Timing DAI_P20–1 (SCLK) SAMPLE EDGE DAI_P20–1 (FS) DAI_P20–1 (SDATA) tIDPCLK tIDPCLKW tSISFS tSIHFS tSIHD tSISD Rev. J | Page 34 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Parallel Data Acquisition Port (PDAP) The timing requirements for the PDAP are provided in Table 29. PDAP is the parallel mode operation of Channel 0 of the IDP. For details on the operation of the IDP, refer to the ADSP-2136x SHARC Processor Hardware Reference, “Input Data Port” chapter. Note that the most significant 16 bits of external 20-bit PDAP data can be provided through either the parallel port AD15–0 pins or the DAI_P20–5 pins. The remaining 4 bits can only be sourced through DAI_P4–1. The timing below is valid at the DAI_P20–1 pins or at the AD15–0 pins. Table 29. Parallel Data Acquisition Port (PDAP) Parameter Min Unit Timing Requirements tSPCLKEN 1 PDAP_CLKEN Setup Before PDAP_CLK Sample Edge 2.5 ns tHPCLKEN 1 PDAP_CLKEN Hold After PDAP_CLK Sample Edge 2.5 ns tPDSD 1 PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge 3.0 ns tPDHD 1 PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge 2.5 ns tPDCLKW Clock Width (tPCLK × 4) ÷ 2 – 3 ns tPDCLK Clock Period tPCLK × 4 ns Switching Characteristics tPDHLDD Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word 2 × tPCLK – 1 ns tPDSTRB PDAP Strobe Pulse Width 2 × tPCLK – 1.5 ns 1Data source pins are AD15–0 and DAI_P4–1, or DAI pins. Source pins for serial clock and frame sync are DAI pins. Figure 25. PDAP Timing DAI_P20–1 (PDAP_CLK) SAMPLE EDGE DAI_P20–1 (PDAP_HOLD) DAI_P20–1 (PDAP_STROBE) tPDHLDD tPDSTRB tPDSD tPDHD tSPHOLD tHPHOLD tPDCLK tPDCLKW DAI_P20–1/ ADDR23–4 (PDAP_DATA) ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 35 of 60 | July 2013 Pulse-Width Modulation Generators Sample Rate Converter—Serial Input Port The SRC input signals are routed from the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided in Table 31 are valid at the DAI_P20–1 pins. This feature is not available on the ADSP-21363 models. Table 30. PWM Timing1 Parameter Min Max Unit Switching Characteristics tPWMW PWM Output Pulse Width tPCLK – 2 (216 – 2) × tPCLK ns tPWMP PWM Output Period 2 × tPCLK – 1.5 (216 – 1) × tPCLK ns 1Note that the PWM output signals are shared on the parallel port bus (AD15-0 pins). Figure 26. PWM Timing PWM OUTPUTS tPWMW tPWMP Table 31. SRC, Serial Input Port Parameter Min Unit Timing Requirements tSRCSFS 1 Frame Sync Setup Before Serial Clock Rising Edge 3 ns tSRCHFS 1 Frame Sync Hold After Serial Clock Rising Edge 3 ns tSRCSD 1 SDATA Setup Before Serial Clock Rising Edge 3 ns tSRCHD 1 SDATA Hold After Serial Clock Rising Edge 3 ns tSRCCLKW Clock Width 36 ns tSRCCLK Clock Period 80 ns 1 The data, serial clock, and frame sync signals can come from any of the DAI pins. The serial clock and frame sync signals can also come via the PCGs or SPORTs. The PCG’s input can be either CLKIN or any of the DAI pins. Rev. J | Page 36 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Figure 27. SRC Serial Input Port Timing DAI_P20–1 (SCLK) SAMPLE EDGE DAI_P20–1 (FS) DAI_P20–1 (SDATA) tSRCCLK tSRCCLKW tSRCSFS tSRCHFS tSRCSD tSRCHD ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 37 of 60 | July 2013 Sample Rate Converter—Serial Output Port For the serial output port, the frame-sync is an input and should meet setup and hold times with regard to the serial clock on the output port. The serial data output has a hold time and delay specification with regard to serial clock. Note that the serial clock rising edge is the sampling edge and the falling edge is the drive edge. Table 32. SRC, Serial Output Port K and B Grade Y Grade Parameter Min Max Max Unit Timing Requirements tSRCSFS 1 Frame Sync Setup Before Serial Clock Rising Edge 3 ns tSRCHFS 1 Frame Sync Hold After Serial Clock Rising Edge 3 ns Switching Characteristics tSRCTDD 1 Transmit Data Delay After Serial Clock Falling Edge 10.5 12.5 ns tSRCTDH 1 Transmit Data Hold After Serial Clock Falling Edge 2 ns 1 The data, serial clock, and frame sync signals can come from any of the DAI pins. The serial clock and frame sync can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins. Figure 28. SRC Serial Output Port Timing DAI_P20–1 (SCLK) SAMPLE EDGE DAI_P20–1 (FS) DAI_P20–1 (SDATA) tSRCCLK tSRCCLKW tSRCSFS tSRCHFS tSRCTDD tSRCTDH Rev. J | Page 38 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 S/PDIF Transmitter Serial data input to the S/PDIF transmitter can be formatted as left justified, I2S, or right justified with word widths of 16-, 18-, 20-, or 24-bits. The following sections provide timing for the transmitter. S/PDIF Transmitter-Serial Input Waveforms Figure 29 shows the right-justified mode. Frame sync is high for the left channel and low for the right channel. Data is valid on the rising edge of serial clock. The MSB is delayed the minimum in 24-bit output mode or the maximum in 16-bit output mode from a frame sync transition, so that when there are 64 serial clock periods per frame sync period, the LSB of the data is rightjustified to the next frame sync transition. Table 33. S/PDIF Transmitter Right-Justified Mode Parameter Nominal Unit Timing Requirement tRJD FS to MSB Delay in Right-Justified Mode 16-Bit Word Mode 18-Bit Word Mode 20-Bit Word Mode 24-Bit Word Mode 16 14 12 8 SCLK SCLK SCLK SCLK Figure 29. Right-Justified Mode MSB LEFT/RIGHT CHANNEL LSB MSB–1 MSB–2 LSB+2 LSB+1 LSB DAI_P20–1 FS DAI_P20–1 SCLK DAI_P20–1 SDATA tRJD ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 39 of 60 | July 2013 Figure 30 shows the default I2S-justified mode. The frame sync is low for the left channel and high for the right channel. Data is valid on the rising edge of serial clock. The MSB is left-justified to the frame sync transition but with a delay. Figure 31 shows the left-justified mode. The frame sync is high for the left channel and low for the right channel. Data is valid on the rising edge of serial clock. The MSB is left-justified to the frame sync transition with no delay. Table 34. S/PDIF Transmitter I2S Mode Parameter Nominal Unit Timing Requirement tI2SD FS to MSB Delay in I2S Mode 1 SCLK Figure 30. I2S-Justified Mode MSB LEFT/RIGHT CHANNEL MSB–1 MSB–2 LSB+2 LSB+1 LSB DAI_P20–1 FS DAI_P20–1 SCLK DAI_P20–1 SDATA tI2SD Table 35. S/PDIF Transmitter Left-Justified Mode Parameter Nominal Unit Timing Requirement tLJD FS to MSB Delay in Left-Justified Mode 0 SCLK Figure 31. Left-Justified Mode MSB LEFT/RIGHT CHANNEL MSB–1 MSB–2 LSB+2 LSB+1 LSB DAI_P20–1 FS DAI_P20–1 SCLK DAI_P20–1 SDATA tLJD Rev. J | Page 40 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 S/PDIF Transmitter Input Data Timing The timing requirements for the S/PDIF transmitter are given in Table 36. Input signals are routed to the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins. Oversampling Clock (TxCLK) Switching Characteristics The S/PDIF transmitter requires an oversampling clock input. This high frequency clock (TxCLK) input is divided down to generate the internal biphase clock. Table 36. S/PDIF Transmitter Input Data Timing K Grade Y Grade Parameter Min Max Min Max Unit Timing Requirements tSISFS 1 Frame Sync Setup Before Serial Clock Rising Edge 3 3 ns tSIHFS 1 Frame Sync Hold After Serial Clock Rising Edge 3 3 ns tSISD 1 Data Setup Before Serial Clock Rising Edge 3 3 ns tSIHD 1 Data Hold After Serial Clock Rising Edge 3 3 ns tSITXCLKW Transmit Clock Width 9 9.5 ns tSITXCLK Transmit Clock Period 20 20 ns tSISCLKW Clock Width 36 36 ns tSISCLK Clock Period 80 80 ns 1 The serial clock, data and frame sync signals can come from any of the DAI pins.The serial clock and frame sync signals can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins. Figure 32. S/PDIF Transmitter Input Timing SAMPLE EDGE DAI_P20–1 (TxCLK) DAI_P20–1 (SCLK) DAI_P20–1 (FS) DAI_P20–1 (SDATA) tSITXCLKW tSITXCLK tSISCLKW tSISCLK tSISFS tSIHFS tSISD tSIHD Table 37. Oversampling Clock (TxCLK) Switching Characteristics Parameter Max Unit Frequency for TxCLK = 384 × Frame Sync Oversampling Ratio × Frame Sync <= 1/tSITXCLK MHz Frequency for TxCLK = 256 × Frame Sync 49.2 MHz Frame Rate (FS) 192.0 kHz ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 41 of 60 | July 2013 S/PDIF Receiver The following section describes timing as it relates to the S/PDIF receiver. This feature is not available on the ADSP-21363 processors. Internal Digital PLL Mode In the internal digital phase-locked loop mode the internal PLL (digital PLL) generates the 512 × FS clock. Table 38. S/PDIF Receiver Output Timing (Internal Digital PLL Mode) Parameter Min Max Unit Switching Characteristics tDFSI Frame Sync Delay After Serial Clock 5 ns tHOFSI Frame Sync Hold After Serial Clock –2 ns tDDTI Transmit Data Delay After Serial Clock 5 ns tHDTI Transmit Data Hold After Serial Clock –2 ns tSCLKIW 1 Transmit Serial Clock Width 38 ns 1 Serial clock frequency is 64 ×FS where FS = the frequency of frame sync. Figure 33. S/PDIF Receiver Internal Digital PLL Mode Timing DAI_P20–1 (SCLK) SAMPLE EDGE DAI_P20–1 (FS) DAI_P20–1 (DATA CHANNEL A/B) DRIVE EDGE tSCLKIW tDFSI tHOFSI tDDTI tHDTI Rev. J | Page 42 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 SPI Interface—Master The processor contains two SPI ports. The primary has dedicated pins and the secondary is available through the DAI. The timing provided in Table 39 and Table 40 applies to both ports. Table 39. SPI Interface Protocol—Master Switching and Timing Specifications Parameter K and B Grade Y Grade Min Max Min Max Unit Timing Requirements tSSPIDM Data Input Valid to SPICLK Edge (Data Input Setup Time) 5.2 6.2 ns tSSPIDM Data Input Valid to SPICLK Edge (Data Input Setup Time) (SPI2) 8.2 9.5 ns tHSPIDM SPICLK Last Sampling Edge to Data Input Not Valid 2 2 ns Switching Characteristics tSPICLKM Serial Clock Cycle 8 × tPCLK – 2 8 × tPCLK – 2 ns tSPICHM Serial Clock High Period 4 × tPCLK – 2 4 × tPCLK – 2 ns tSPICLM Serial Clock Low Period 4 × tPCLK – 2 4 × tPCLK – 2 ns tDDSPIDM SPICLK Edge to Data Out Valid (Data Out Delay Time) 3.0 3.0 ns tDDSPIDM SPICLK Edge to Data Out Valid (Data Out Delay Time) (SPI2) 8.0 9.5 ns tHDSPIDM SPICLK Edge to Data Out Not Valid (Data Out Hold Time) 4 × tPCLK – 2 4 × tPCLK – 2 ns tSDSCIM FLAG3–0IN (SPI Device Select) Low to First SPICLK Edge 4 × tPCLK – 2.5 4 × tPCLK – 3.0 ns tSDSCIM FLAG3–0IN (SPI Device Select) Low to First SPICLK Edge (SPI2) 4 × tPCLK – 2.5 4 × tPCLK – 3.0 ns tHDSM Last SPICLK Edge to FLAG3–0IN High 4 × tPCLK – 2 4 × tPCLK – 2 ns tSPITDM Sequential Transfer Delay 4 × tPCLK – 1 4 × tPCLK – 1 ns Figure 34. SPI Master Timing tSDSCIM tSPICHM tSPICLM tSPICLKM tHDSM tSPITDM tDDSPIDM tSSPIDM tHSPIDM DPI (OUTPUT) MOSI (OUTPUT) MISO (INPUT) MOSI (OUTPUT) MISO (INPUT) CPHASE = 1 CPHASE = 0 tHDSPIDM tHSPIDM tHSPIDM tSSPIDM tSSPIDM tDDSPIDM tHDSPIDM SPICLK (CP = 0, CP = 1) (OUTPUT) ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 43 of 60 | July 2013 SPI Interface—Slave Table 40. SPI Interface Protocol—Slave Switching and Timing Specifications K and B Grade Y Grade Parameter Min Max Max Unit Timing Requirements tSPICLKS Serial Clock Cycle 4 × tPCLK – 2 ns tSPICHS Serial Clock High Period 2 × tPCLK – 2 ns tSPICLS Serial Clock Low Period 2 × tPCLK – 2 ns tSDSCO SPIDS Assertion to First SPICLK Edge CPHASE = 0 CPHASE = 1 2 × tPCLK 2 × tPCLK ns ns tHDS Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0 2 × tPCLK ns tSSPIDS Data Input Valid to SPICLK Edge (Data Input Setup Time) 2 ns tHSPIDS SPICLK Last Sampling Edge to Data Input Not Valid 2 ns tSDPPW SPIDS Deassertion Pulse Width (CPHASE = 0) 2 × tPCLK ns Switching Characteristics tDSOE SPIDS Assertion to Data Out Active 0 5 5 ns tDSOE 1 SPIDS Assertion to Data Out Active (SPI2) 0 8 9 ns tDSDHI SPIDS Deassertion to Data High Impedance 0 5 5.5 ns tDSDHI 1 SPIDS Deassertion to Data High Impedance (SPI2) 0 8.6 10 ns tDDSPIDS SPICLK Edge to Data Out Valid (Data Out Delay Time) 9.5 11.0 ns tHDSPIDS SPICLK Edge to Data Out Not Valid (Data Out Hold Time) 2 × tPCLK ns tDSOV SPIDS Assertion to Data Out Valid (CPHASE = 0) 5 × tPCLK 5 × tPCLK ns 1The timing for these parameters applies when the SPI is routed through the signal routing unit. For more information, refer to the ADSP-2136x SHARC Processor Hardware Reference, “Serial Peripheral Interface Port” chapter. Rev. J | Page 44 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Figure 35. SPI Slave Timing tSPICHS tSPICLS tSPICLKS tHDS tSDPPW tSDSCO tDSOE tDDSPIDS tDDSPIDS tDSDHI tHDSPIDS tSSPIDS tHSPIDS tDSDHI tDSOV tHSPIDS tHDSPIDS SPIDS (INPUT) MISO (OUTPUT) MOSI (INPUT) MISO (OUTPUT) MOSI (INPUT) CPHASE = 1 CPHASE = 0 SPICLK (CP = 0, CP = 1) (INPUT) tSSPIDS ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 45 of 60 | July 2013 JTAG Test Access Port and Emulation Table 41. JTAG Test Access Port and Emulation Parameter Min Max Unit Timing Requirements tTCK TCK Period tCK ns tSTAP TDI, TMS Setup Before TCK High 5 ns tHTAP TDI, TMS Hold After TCK High 6 ns tSSYS 1 System Inputs Setup Before TCK High 7 ns tHSYS 1 System Inputs Hold After TCK High 18 ns tTRSTW TRST Pulse Width 4 × tCK ns Switching Characteristics tDTDO TDO Delay from TCK Low 7 ns tDSYS 2 System Outputs Delay After TCK Low tCK ÷ 2 + 7 ns 1 System Inputs = ADDR15–0, SPIDS, CLK_CFG1–0, RESET, BOOT_CFG1–0, MISO, MOSI, SPICLK, DAI_Px, and FLAG3–0. 2 System Outputs = MISO, MOSI, SPICLK, DAI_Px, ADDR15–0, RD, WR, FLAG3–0, EMU, and ALE. Figure 36. IEEE 1149.1 JTAG Test Access Port TCK TMS TDI TDO SYSTEM INPUTS SYSTEM OUTPUTS tTCK tSTAP tHTAP tDTDO tSSYS tHSYS tDSYS Rev. J | Page 46 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 OUTPUT DRIVE CURRENTS Figure 37 shows typical I-V characteristics for the output drivers of the processor. The curves represent the current drive capability of the output drivers as a function of output voltage. TEST CONDITIONS The ac signal specifications (timing parameters) appear in Table 12 on Page 20 through Table 41 on Page 45. These include output disable time, output enable time, and capacitive loading. The timing specifications for the SHARC apply for the voltage reference levels in Figure 38. Timing is measured on signals when they cross the 1.5 V level as described in Figure 39. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and the point that the second signal reaches 1.5 V. CAPACITIVE LOADING Output delays and holds are based on standard capacitive loads: 30 pF on all pins (see Figure 38). Figure 42 shows graphically how output delays and holds vary with load capacitance. The graphs of Figure 40, Figure 41, and Figure 42 may not be linear outside the ranges shown for Typical Output Delay versus Load Capacitance and Typical Output Rise Time (20% to 80%, V = Min) versus Load Capacitance. Figure 37. ADSP-2136x Typical Drive Figure 38. Equivalent Device Loading for AC Measurements (Includes All Fixtures) Figure 39. Voltage Reference Levels for AC Measurements SWEEP (VDDEXT) VOLTAGE (V) -20 0 0.5 1.5 2.5 3.5 0 -40 -30 20 40 -10 SOURCE (VDDEXT) CURRENT (mA) VOL 3.11V, +125°C 3.3V, +25°C 3.47V, -45°C 30 VOH 10 3.11V, +125°C 3.3V, +25°C 3.47V, -45°C 1.0 2.0 3.0 TO OUTPUT PIN VLOAD 30pF INPUT 1.5V OR OUTPUT 1.5V Figure 40. Typical Output Rise/Fall Time (20% to 80%, VDDEXT = Max) Figure 41. Typical Output Rise/Fall Time (20% to 80%, VDDEXT = Min) LOAD CAPACITANCE (pF) 8 0 0 100 250 12 4 2 10 6 RISE AND FALL TIMES (ns) 50 150 200 FALL y = 0.0467x + 1.6323 y = 0.045x + 1.524 RISE LOAD CAPACITANCE (pF) 12 0 50 100 150 200 250 10 8 6 4 RISE AND FALL TIMES (ns) 2 0 RISE y = 0.049x + 1.5105 FALL y = 0.0482x + 1.4604 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 47 of 60 | July 2013 THERMAL CHARACTERISTICS The processor is rated for performance over the temperature range specified in Operating Conditions on Page 14. Table 42 through Table 44 airflow measurements comply with JEDEC standards JESD51-2 and JESD51-6 and the junction-toboard measurement complies with JESD51-8. Test board and thermal via design comply with JEDEC standards JESD51-9 (BGA) and JESD51-5 (LQFP_EP). The junction-to-case measurement complies with MIL-STD-883. All measurements use a 2S2P JEDEC test board. Industrial applications using the BGA package require thermal vias, to an embedded ground plane, in the PCB. Refer to JEDEC standard JESD51-9 for printed circuit board thermal ball land and thermal via design information. Industrial applications using the LQFP_EP package require thermal trace squares and thermal vias, to an embedded ground plane, in the PCB. Refer to JEDEC standard JESD51-5 for more information. To determine the junction temperature of the device while on the application PCB, use: where: TJ = junction temperature (°C) TT = case temperature (°C) measured at the top center of the package ΨJT = junction-to-top (of package) characterization parameter is the typical value from Table 42 through Table 44. PD = power dissipation. See the Engineer-to-Engineer Note “Estimating Power for the ADSP-21362 SHARC Processors” (EE-277) for more information. Values of θJA are provided for package comparison and PCB design considerations. Values of θJC are provided for package comparison and PCB design considerations when an exposed pad is required. Note that the thermal characteristics values provided in Table 42 through Table 44 are modeled values. Figure 42. Typical Output Delay or Hold versus Load Capacitance (at Ambient Temperature) LOAD CAPACITANCE (pF) 0 50 100 150 200 10 8 OUTPUT DELAY OR HOLD (ns) 6 0 4 2 -2 y = 0.0488x - 1.5923 -4 TJ TT JT PD = + Table 42. Thermal Characteristics for BGA (No Thermal vias in PCB) Parameter Condition Typical Unit θJA Airflow = 0 m/s 25.40 °C/W θJMA Airflow = 1 m/s 21.90 °C/W θJMA Airflow = 2 m/s 20.90 °C/W θJC 5.07 °C/W ΨJT Airflow = 0 m/s 0.140 °C/W ΨJMT Airflow = 1 m/s 0.330 °C/W ΨJMT Airflow = 2 m/s 0.410 °C/W Table 43. Thermal Characteristics for BGA (Thermal vias in PCB) Parameter Condition Typical Unit θJA Airflow = 0 m/s 23.40 °C/W θJMA Airflow = 1 m/s 20.00 °C/W θJMA Airflow = 2 m/s 19.20 °C/W θJC 5.00 °C/W ΨJT Airflow = 0 m/s 0.130 °C/W ΨJMT Airflow = 1 m/s 0.300 °C/W ΨJMT Airflow = 2 m/s 0.360 °C/W Table 44. Thermal Characteristics for LQFP_EP (with Exposed Pad Soldered to PCB) Parameter Condition Typical Unit θJA Airflow = 0 m/s 16.80 °C/W θJMA Airflow = 1 m/s 14.20 °C/W θJMA Airflow = 2 m/s 13.50 °C/W θJC 7.25 °C/W ΨJT Airflow = 0 m/s 0.51 °C/W ΨJMT Airflow = 1 m/s 0.72 °C/W ΨJMT Airflow = 2 m/s 0.80 °C/W Rev. J | Page 48 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 144-LEAD LQFP_EP PIN CONFIGURATIONS The following table shows the processor’s pin names and, when applicable, their default function after reset in parentheses. Table 45. LQFP_EP Pin Assignments Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. Pin Name Pin No. VDDINT 1 VDDINT 37 VDDEXT 73 GND 109 CLK_CFG0 2 GND 38 GND 74 VDDINT 110 CLK_CFG1 3 RD 39 VDDINT 75 GND 111 BOOT_CFG0 4 ALE 40 GND 76 VDDINT 112 BOOT_CFG1 5 AD15 41 DAI_P10 (SD2B) 77 GND 113 GND 6 AD14 42 DAI_P11 (SD3A) 78 VDDINT 114 VDDEXT 7 AD13 43 DAI_P12 (SD3B) 79 GND 115 GND 8 GND 44 DAI_P13 (SCLK3) 80 VDDEXT 116 VDDINT 9 VDDEXT 45 DAI_P14 (SFS3) 81 GND 117 GND 10 AD12 46 DAI_P15 (SD4A) 82 VDDINT 118 VDDINT 11 VDDINT 47 VDDINT 83 GND 119 GND 12 GND 48 GND 84 VDDINT 120 VDDINT 13 AD11 49 GND 85 RESET 121 GND 14 AD10 50 DAI_P16 (SD4B) 86 SPIDS 122 FLAG0 15 AD9 51 DAI_P17 (SD5A) 87 GND 123 FLAG1 16 AD8 52 DAI_P18 (SD5B) 88 VDDINT 124 AD7 17 DAI_P1 (SD0A) 53 DAI_P19 (SCLK5) 89 SPICLK 125 GND 18 VDDINT 54 VDDINT 90 MISO 126 VDDINT 19 GND 55 GND 91 MOSI 127 GND 20 DAI_P2 (SD0B) 56 GND 92 GND 128 VDDEXT 21 DAI_P3 (SCLK0) 57 VDDEXT 93 VDDINT 129 GND 22 GND 58 DAI_P20 (SFS5) 94 VDDEXT 130 VDDINT 23 VDDEXT 59 GND 95 Avdd 131 AD6 24 VDDINT 60 VDDINT 96 Avss 132 AD5 25 GND 61 FLAG2 97 GND 133 AD4 26 DAI_P4 (SFS0) 62 FLAG3 98 RESETOUT 134 VDDINT 27 DAI_P5 (SD1A) 63 VDDINT 99 EMU 135 GND 28 DAI_P6 (SD1B) 64 GND 100 TDO 136 AD3 29 DAI_P7 (SCLK1) 65 VDDINT 101 TDI 137 AD2 30 VDDINT 66 GND 102 TRST 138 VDDEXT 31 GND 67 VDDINT 103 TCK 139 GND 32 VDDINT 68 GND 104 TMS 140 AD1 33 GND 69 VDDINT 105 GND 141 AD0 34 DAI_P8 (SFS1) 70 GND 106 CLKIN 142 WR 35 DAI_P9 (SD2A) 71 VDDINT 107 XTAL 143 VDDINT 36 VDDINT 72 VDDINT 108 VDDEXT 144 GND 145* *The ePAD is electrically connected to GND inside the chip (see Figure 43 and Figure 44), therefore connecting the pad to GND is optional. For better thermal performance the ePAD should be soldered to the board and thermally connected to the GND plane with vias. ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 49 of 60 | July 2013 Figure 43 shows the top view of the 144-lead LQFP_EP pin configuration. Figure 44 shows the bottom view of the 144-lead LQFP_EP lead configuration. Figure 43. 144-Lead LQFP_EP Lead Configuration (Top View) Figure 44. 144-Lead LQFP_EP Lead Configuration (Bottom View) LEAD 1 LEAD 36 LEAD 108 LEAD 73 LEAD 144 LEAD 109 LEAD 37 LEAD 72 LEAD 1 INDICATOR ADSP-2136x 144-LEAD LQFP_EP TOP VIEW LEAD 108 LEAD 73 LEAD 1 LEAD 36 LEAD 109 LEAD 144 LEAD 72 LEAD 37 LEAD 1 INDICATOR GND PAD (LEAD 145) ADSP-2136x 144-LEAD LQFP_EP BOTTOM VIEW Rev. J | Page 50 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 136-BALL BGA PIN CONFIGURATIONS The following table shows the processor’s ball names and, when applicable, their default function after reset in parentheses. Table 46. BGA Pin Assignments Ball Name Ball No. Ball Name Ball No. Ball Name Ball No. Ball Name Ball No. CLK_CFG0 A01 CLK_CFG1 B01 BOOT_CFG1 C01 VDDINT D01 XTAL A02 GND B02 BOOT_CFG0 C02 GND D02 TMS A03 VDDEXT B03 GND C03 GND D04 TCK A04 CLKIN B04 GND C12 GND D05 TDI A05 TRST B05 GND C13 GND D06 RESETOUT A06 AVSS B06 VDDINT C14 GND D09 TDO A07 AVDD B07 GND D10 EMU A08 VDDEXT B08 GND D11 MOSI A09 SPICLK B09 GND D13 MISO A10 RESET B10 VDDINT D14 SPIDS A11 VDDINT B11 VDDINT A12 GND B12 GND A13 GND B13 GND A14 GND B14 VDDINT E01 FLAG1 F01 AD7 G01 AD6 H01 GND E02 FLAG0 F02 VDDINT G02 VDDEXT H02 GND E04 GND F04 VDDEXT G13 DAI_P18 (SD5B) H13 GND E05 GND F05 DAI_P19 (SCLK5) G14 DAI_P17 (SD5A) H14 GND E06 GND F06 GND E09 GND F09 GND E10 GND F10 GND E11 GND F11 GND E13 FLAG2 F13 FLAG3 E14 DAI_P20 (SFS5) F14 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 51 of 60 | July 2013 Figure 45 and Figure 46 show BGA pin assignments from the bottom and top, respectively. Note: Use the center block of ground pins to provide thermal pathways to your printed circuit board’s ground plane. AD5 J01 AD3 K01 AD2 L01 AD0 M01 AD4 J02 VDDINT K02 AD1 L02 WR M02 GND J04 GND K04 GND L04 GND M03 GND J05 GND K05 GND L05 GND M12 GND J06 GND K06 GND L06 DAI_P12 (SD3B) M13 GND J09 GND K09 GND L09 DAI_P13 (SCLK3) M14 GND J10 GND K10 GND L10 GND J11 GND K11 GND L11 VDDINT J13 GND K13 GND L13 DAI_P16 (SD4B) J14 DAI_P15 (SD4A) K14 DAI_P14 (SFS3) L14 AD15 N01 AD14 P01 ALE N02 AD13 P02 RD N03 AD12 P03 VDDINT N04 AD11 P04 VDDEXT N05 AD10 P05 AD8 N06 AD9 P06 VDDINT N07 DAI_P1 (SD0A) P07 DAI_P2 (SD0B) N08 DAI_P3 (SCLK0) P08 VDDEXT N09 DAI_P5 (SD1A) P09 DAI_P4 (SFS0) N10 DAI_P6 (SD1B) P10 VDDINT N11 DAI_P7 (SCLK1) P11 VDDINT N12 DAI_P8 (SFS1) P12 GND N13 DAI_P9 (SD2A) P13 DAI_P10 (SD2B) N14 DAI_P11 (SD3A) P14 Table 46. BGA Pin Assignments (Continued) Ball Name Ball No. Ball Name Ball No. Ball Name Ball No. Ball Name Ball No. Rev. J | Page 52 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Figure 45. BGA Pin Assignments (Bottom View, Summary) AVSS VDDINT VDDEXT I/O SIGNALS GND AVDD KEY 14 13 12 11 10 9 8 7 6 5 4 3 2 1 P N M L K J H G F E D C B A Figure 46. BGA Pin Assignments (Top View, Summary) AVSS VDDINT VDDEXT I/O SIGNALS GND AVDD KEY 1 2 3 4 5 6 7 8 9 10 11 12 13 14 P N M L K J H G F E D C B A ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 53 of 60 | July 2013 PACKAGE DIMENSIONS The processor is available in 136-ball BGA and 144-lead exposed pad (LQFP_EP) packages. Figure 47. 144-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP1] (SW-144-1) Dimensions shown in millimeters 1For information relating to the exposed pad on the SW-144-1 package, see the table endnote on Page 48. COMPLIANT TO JEDEC STANDARDS MS-026-BFB-HD 0.27 0.22 0.17 0.75 0.60 0.45 0.50 BSC LEAD PITCH 20.20 20.00 SQ 19.80 22.20 22.00 SQ 21.80 EXPOSED* PAD 1 36 1 36 37 73 72 72 37 108 73 108 144 109 109 144 PIN 1 1.60 MAX SEATING PLANE *EXPOSED PAD IS COINCIDENT WITH BOTTOM SURFACE AND DOES NOT PROTRUDE BEYOND IT. EXPOSED PAD IS CENTERED. 8.80 SQ 0.15 0.10 0.05 0.08 COPLANARITY 0.20 0.15 0.09 1.45 1.40 1.35 7° 3.5° 0° VIEW A ROTATED 90° CCW TOP VIEW (PINS DOWN) BOTTOM VIEW (PINS UP) VIEW A Rev. J | Page 54 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 SURFACE-MOUNT DESIGN Table 47 is provided as an aid to PCB design. For industry standard design recommendations, refer to IPC-7351, Generic Requirements for Surface-Mount Design and Land Pattern Standard. Figure 48. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA] (BC-136-1) Dimensions shown in millimeters 0.25 MIN *0.50 0.45 0.40 1.31 1.21 1.70 MAX 1.10 A B C D EF G J H KL M 14 13 12 11 10 9 8 7 6 5 4 3 2 1 NP 12.10 12.00 SQ 11.90 10.40 BSC SQ *COMPLIANT WITH JEDEC STANDARDS MO-275-GGAA-1 WITH EXCEPTION TO BALL DIAMETER. COPLANARITY 0.12 BALL DIAMETER 0.80 BSC DETAIL A A1 BALL A1 BALL CORNER CORNER DETAIL A TOP VIEW BOTTOM VIEW SEATING PLANE Table 47. BGA Data for Use with Surface-Mount Design Package Package Ball Attach Type Package Solder Mask Opening Package Ball Pad Size 136-Ball CSP_BGA (BC-136-1) Solder Mask Defined 0.40 mm diameter 0.53 mm diameter ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 55 of 60 | July 2013 AUTOMOTIVE PRODUCTS Some ADSP-2136x models are available for automotive applications with controlled manufacturing. Note that these special models may have specifications that differ from the general release models. The automotive grade products shown in Table 48 are available for use in automotive applications. Contact your local ADI account representative or authorized ADI product distributor for specific product ordering information. Note that all automotive products are RoHS compliant. Table 48. Automotive Products Model Notes Temperature Range1 Instruction Rate On-Chip SRAM ROM Package Description Package Option AD21362WBBCZ1xx 2 –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 AD21362WBSWZ1xx 2 –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21362WYSWZ2xx 2 –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21363WBBCZ1xx –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 AD21363WBSWZ1xx –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21363WYSWZ2xx –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21364WBBCZ1xx –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 AD21364WBSWZ1xx –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21364WYSWZ2xx –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21365WBSWZ1xxA 2, 3, 4 –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21365WBSWZ1xxF 2, 3, 4 –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21365WYSWZ2xxA 2, 3, 4 –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21366WBBCZ1xxA 3, 4 –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 AD21366WBSWZ1xxA 3, 4 –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 AD21366WYSWZ2xxA 3, 4 –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 1 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 14 for junction temperature (TJ) specification which is the only temperature specification. 2 License from DTLA required for these products. 3Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at www.analog.com/sharc. 4 License from Dolby Laboratories, Inc., and Digital Theater Systems (DTS) required for these products. Rev. J | Page 56 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 ORDERING GUIDE Model1 1 Z = RoHS compliant part. Notes Temperature Range2 2 Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 14 for junction temperature (TJ) specification which is the only temperature specification. Instruction Rate On-Chip SRAM ROM Package Description Package Option ADSP-21363KBC-1AA 0°C to +70°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21363KBCZ-1AA 0°C to +70°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21363KSWZ-1AA 0°C to +70°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21363BBC-1AA –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21363BBCZ-1AA –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21363BSWZ-1AA –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21363YSWZ-2AA 3 3 License from Dolby Laboratories, Inc., and Digital Theater Systems (DTS) required for these products. –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21364KBCZ-1AA 0°C to +70°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21364KSWZ-1AA 0°C to +70°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21364BBCZ-1AA –40°C to +85°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21364BSWZ-1AA –40°C to +85°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21364YSWZ-2AA –40°C to +105°C 200 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21366KBCZ-1AR 3, 4, 5 4Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at www.analog.com/sharc. 5 R = Tape and reel. 0°C to +70°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21366KBCZ-1AA 3, 4 0°C to +70°C 333 MHz 3M Bit 4M Bit 136-Ball CSP_BGA BC-136-1 ADSP-21366KSWZ-1AA 3, 4 0°C to +70°C 333 MHz 3M Bit 4M Bit 144-Lead LQFP_EP SW-144-1 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 57 of 60 | July 2013 Rev. J | Page 58 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 Rev. J | Page 59 of 60 | July 2013 Rev. J | Page 60 of 60 | July 2013 ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366 ©2013 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06359-0-7/13(J) Product family data sheet Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. CLD-DS56 Rev 4 Cree® XLamp® XP-E2 LEDs Product Description The XLamp XP-E2 LED builds on the unprecedented performance of the original XP-E by increasing lumen output up to 20% while providing a single die LED point source for precise optical control. The XP‑E2 LED shares the same footprint as the original XP‑E, providing a seamless upgrade path to more lumens and/or greater efficiency while shortening the design cycle for existing XP customers. XLamp XP-E2 LEDs are the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LED retrofit lamps, outdoor, portable, indoor directional, emergency vehicle or architectural. FEATURES • Available in white, outdoor white, 80-CRI, 85-CRI, 90-CRI white, royal blue, blue, green, amber, red-orange & red • ANSI-compatible chromaticity bins • White binned at 85 °C • Maximum drive current: 1 A • Low thermal resistance: as low as 5 °C/W • Wide viewing angle: 110°-135° • Unlimited floor life at ≤ 30 °C/85% RH • Reflow solderable - JEDEC J-STD-020C compatible • Electrically neutral thermal path • UL-recognized component (E349212) www.cree.com/Xlamp Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Table of Contents Characteristics........................... 2 Flux Characteristics - White......... 3 Flux Characteristics - Color.......... 4 Relative Spectral Power Distribution............................... 6 Relative Flux vs. Junction Temperature.............................. 7 Electrical Characteristics.............. 8 Relative Flux vs. Current............. 9 Relative Chromaticity vs. Current and Temperature.......................10 Typical Spatial Distribution..........11 Thermal Design.........................12 Reflow Soldering Characteristics..13 Notes.......................................14 Mechanical Dimensions..............15 Tape and Reel...........................16 Packaging.................................17 Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 2 xlamp xp-e2 leds Characteristics Characteristics Unit Minimum Typical Maximum Thermal resistance, junction to solder point - white, royal blue, blue °C/W 9 Thermal resistance, junction to solder point - green °C/W 15 Thermal resistance, junction to solder point - amber °C/W 7 Thermal resistance, junction to solder point - red-orange, red °C/W 5 Viewing angle (FWHM) - white degrees 110 Viewing angle (FWHM) - royal blue, blue, green degrees 135 Viewing angle (FWHM) - amber, red-orange, red degrees 130 Temperature coefficient of voltage - white mV/°C -2.3 Temperature coefficient of voltage - royal blue, blue mV/°C -3.3 Temperature coefficient of voltage - green mV/°C -3.8 Temperature coefficient of voltage - amber, red-orange, red mV/°C -1.8 ESD withstand voltage (HBM per Mil-Std-883D)- white, royal blue, blue, green V 8000 ESD classification (HBM per Mil-Std-883D) - amber, red-orange, red Class 2 DC forward current mA 1000 Reverse voltage V 5 Forward voltage (@ 350 mA, 85 °C) - white V 2.9 3.25 Forward voltage (@ 700 mA, 85 °C) - white 3.05 Forward voltage (@ 1000 mA, 85 °C) - white 3.15 Forward voltage (@ 350 mA, 25 °C) - royal blue, blue V 3.1 3.5 Forward voltage (@ 350 mA, 25 °C) - green V 3.2 3.6 Forward voltage (@ 350 mA, 25 °C) - amber, red-orange, red V 2.2 2.6 Forward voltage (@ 1000 mA, 25 °C) - royal blue, blue V 3.4 Forward voltage (@ 1000 mA, 25 °C) - green V 3.7 Forward voltage (@ 1000 mA, 25 °C) - amber, red-orange, red V 2.65 LED junction temperature °C 150 Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 3 xlamp xp-e2 leds Flux Characteristics (TJ = 85 °C) - White The following table provides several base order codes for XLamp XP-E2 LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XP Family Binning and Labeling document. Color CCT Range Base Order Codes Min. Luminous Flux (lm) @ 350 mA Calculated Minimum Luminous Flux (lm)** @ 85 °C Order Code Min. Max. Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* 700 mA 1.0 A Cool White 5000 K 10,000 K Q4 100 116 171 218 XPEBWT-L1-0000-00C51 Q5 107 124 183 233 XPEBWT-L1-0000-00D51 R2 114 132 195 249 XPEBWT-L1-0000-00E51 R3 122 142 209 266 XPEBWT-L1-0000-00F51 Outdoor White 4000 K 5300 K Q4 100 116 171 218 XPEBWT-01-0000-00CC2 Q5 107 124 183 233 XPEBWT-01-0000-00DC2 R2 114 132 195 249 XPEBWT-01-0000-00EC2 R3 122 142 209 266 XPEBWT-01-0000-00FC2 Neutral White 3700 K 5300 K Q4 100 116 171 218 XPEBWT-L1-0000-00CE4 Q5 107 124 183 233 XPEBWT-L1-0000-00DE4 R2 114 132 195 249 XPEBWT-L1-0000-00EE4 80-CRI White 2200 K 4300 K Q2 87.4 101 150 191 XPEBWT-H1-0000-00AE7 Q3 93.9 109 161 205 XPEBWT-H1-0000-00BE7 Warm White 2200 K 3700 K Q2 87.4 101 150 191 XPEBWT-L1-0000-00AE7 Q3 93.9 109 161 205 XPEBWT-L1-0000-00BE7 Q4 100 116 171 218 XPEBWT-L1-0000-00CE7 85-CRI White 2600 K 3200 K P2 67.2 78.0 115 147 XPEBWT-P1-0000-007E7 P3 73.9 85.7 127 161 XPEBWT-P1-0000-008E7 P4 80.6 93.5 138 176 XPEBWT-P1-0000-009E7 Q2 87.4 101 150 191 XPEBWT-P1-0000-00AE7 90-CRI White 2600 K 3200 K P2 67.2 78.0 115 147 XPEBWT-U1-0000-007E7 P3 73.9 85.7 127 161 XPEBWT-U1-0000-008E7 P4 80.6 93.5 138 176 XPEBWT-U1-0000-009E7 Notes: • Cree maintains a tolerance of ± 7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. • Typical CRI for Cool White (5000 K – 10,000 K CCT) is 70. • Typical CRI for Neutral White (3700 K – 5300 K CCT) is 75. • Typical CRI for Outdoor White (4000 K - 5300 K CCT) is 70. • Typical CRI for Warm White (2200 K – 3700 K CCT) is 80. • Minimum CRI for 80-CRI White is 80. • Minimum CRI for 85-CRI White is 85. • Minimum CRI for 90-CRI White is 90. * Flux values @ 25 °C are calculated and for reference only. ** Calculated flux values at 700 mA and 1 A are for reference only. Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 4 xlamp xp-e2 leds Flux Characteristics (TJ = 25 °C) - Color The following table provides several base order codes for XLamp XP-E2 color LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XP Family Binning and Labeling document. Color Minimum Radiant Flux @ 350 mA Dominant Wavelength Range Order Codes, Group Flux (mW) Min. Max. Group DWL (nm) Group DWL (nm) Royal Blue 30 450 D3 450 D5 465 XPEBRY-L1-0000-00J01 31 475 D3 450 D5 465 XPEBRY-L1-0000-00K01 32 500 D3 450 D5 465 XPEBRY-L1-0000-00L01 33 525 D3 450 D5 465 XPEBRY-L1-0000-00M01 34 550 D3 450 D5 465 XPEBRY-L1-0000-00N01 35 575 D3 450 D5 465 XPEBRY-L1-0000-00P01 Color Dominant Wavelength Range Base Order Codes Min. Luminous Flux Min. Max. (lm) @ 350 mA Order Code Group DWL (nm) Group DWL (nm) Group Flux (lm) Blue B3 465 B6 485 K2 30.6 XPEBBL-L1-0000-00Y01 K3 35.2 XPEBBL-L1-0000-00Z01 M2 39.8 XPEBBL-L1-0000-00201 M3 45.7 XPEBBL-L1-0000-00301 Color Dominant Wavelength Range Base Order Codes Min. Luminous Flux Min. Max. (lm) @ 350 mA Order Code Group DWL (nm) Group DWL (nm) Group Flux (lm) Green G2 520 G4 535 Q2 87.4 XPEBGR-L1-0000-00A01 Q3 93.9 XPEBGR-L1-0000-00B01 Q4 100 XPEBGR-L1-0000-00C01 Q5 107 XPEBGR-L1-0000-00D01 R2 114 XPEBGR-L1-0000-00E01 R3 122 XPEBGR-L1-0000-00F01 Note: Cree maintains a tolerance of ± 7% on flux and power measurements and ± 1 nm on dominant wavelength measurements. Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 5 xlamp xp-e2 leds Color Dominant Wavelength Range Base Order Codes Min. Luminous Flux Min. Max. (lm) @ 350 mA Order Code Group DWL (nm) Group DWL (nm) Group Flux (lm) Amber A2 585 A3 595 N4 62.0 XPEBAM-L1-0000-00601 P2 67.2 XPEBAM-L1-0000-00701 P3 73.9 XPEBAM-L1-0000-00801 P4 80.6 XPEBAM-L1-0000-00901 Color Dominant Wavelength Range Base Order Codes Min. Luminous Flux Min. Max. (lm) @ 350 mA Order Code Group DWL (nm) Group DWL (nm) Group Flux (lm) Red- Orange O3 610 O4 620 P2 67.2 XPEBRO-L1-0000-00701 P3 73.9 XPEBRO-L1-0000-00801 P4 80.6 XPEBRO-L1-0000-00901 Q2 87.4 XPEBRO-L1-0000-00A01 Q3 93.9 XPEBRO-L1-0000-00B01 Color Dominant Wavelength Range Base Order Codes Min. Luminous Flux Min. Max. (lm) @ 350 mA Order Code Group DWL (nm) Group DWL (nm) Group Flux (lm) Red R2 620 R3 630 N3 56.8 XPEBRD-L1-0000-00501 N4 62.0 XPEBRD-L1-0000-00601 P2 67.2 XPEBRD-L1-0000-00701 P3 73.9 XPEBRD-L1-0000-00801 Note: Cree maintains a tolerance of ± 7% on flux and power measurements and ± 1 nm on dominant wavelength measurements. Flux Characteristics (TJ = 25 °C) - Color (Continued) Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 6 xlamp xp-e2 leds Relative Spectral Power Distribution Relative Spectral Power 0 10 20 30 40 50 60 70 80 90 100 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm) Cool White Warm White Relative Spectral Power 0 20 40 60 80 100 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm) Royal Blue Blue Green Amber Red-Orange Red Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 7 xlamp xp-e2 leds Relative Flux vs. Junction Temperature (IF = 350 mA) Relative Flux Output vs. Junction Temperature 0 20 40 60 80 100 120 25 50 75 100 125 150 Relative Luminous Flux (%) Junction Temperature (ºC) White Relative Flux Output vs. Junction Temperature 0 10 20 30 40 50 60 70 80 90 100 25 50 75 100 125 150 Relative Radiant Flux (%) Junction Temperature (ºC) Royal Blue Relative Flux Output vs. Junction Temperature 0 10 20 30 40 50 60 70 80 90 100 25 50 75 100 125 150 Relative Luminous Flux (%) Junction Temperature (ºC) Blue Green Amber Red-Orange, Red Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 8 xlamp xp-e2 leds Electrical Characteristics (TJ = 85 °C) Electrical Characteristics (TJ = 25 °C) Electrical Characteristics (Tj = 25ºC) 0 100 200 300 400 500 600 700 800 900 1000 2.7 2.8 2.9 3.0 3.1 3.2 Forward Current (mA) Forward Voltage (V) White Electrical Characteristics (Tj = 85ºC) 0 100 200 300 400 500 600 700 800 900 1000 2.00 2.25 2.50 2.75 3.00 3.25 3.50 3.75 4.00 Forward Current (mA) Forward Voltage (V) Royal Blue, Blue Green Amber, Red-Orange, Red Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 9 xlamp xp-e2 leds Relative Flux vs. Current (TJ = 85 °C) Relative Flux vs. Current (TJ = 25 °C) Relative Intensity vs. Current (Tj = 85ºC) 0 50 100 150 200 250 0 100 200 300 400 500 600 700 800 900 1000 Relative Luminous Flux (%) Forward Current (mA) White Relative Intensity vs. Current (Tj = 85ºC) 0 50 100 150 200 250 0 100 200 300 400 500 600 700 800 900 1000 Relative Radiant Flux (%) Forward Current (mA) Royal Blue Relative Intensity vs. Current (Tj = 85ºC) 0 50 100 150 200 250 300 0 100 200 300 400 500 600 700 800 900 1000 Relative Luminous Flux (%) Forward Current (mA) Blue Green Amber Red-Orange, Red Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 10 xlamp xp-e2 leds Relative Chromaticity vs. Current and Temperature - Warm White* * Warm White XLamp XP-E2 LEDs have a typical CRI of 80. Relative Chromaticity Vs. Current, WW -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 0 100 200 300 400 500 600 700 800 900 1000 Current (mA) ΔCCx ΔCCy T J = 85 °C Relative Chromaticity Vs. Temperature WW -0.020 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 0.020 0 20 40 60 80 100 120 140 160 Tsp (°C) ΔCCx ΔCCy I F = 350 mA Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 11 xlamp xp-e2 leds Typical Spatial Distribution Typical Spatial Radiation Pattern 0 20 40 60 80 100 -90 -70 -50 -30 -10 10 30 50 70 90 Relative Luminous Intensity (%) Angle (°) White Typical Spatial Radiation Pattern 0 20 40 60 80 100 -90 -70 -50 -30 -10 10 30 50 70 90 Relative Luminous Intensity (%) Angle (º) Royal Blue, Blue, Green Amber, Red-Orange, Red Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 12 xlamp xp-e2 leds Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. White R oyal Blue, Blue Green A mber, Red-Orange, Red 0 200 400 600 800 1000 1200 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W Thermal Design - royal blue - same as blue 0 200 400 600 800 1000 1200 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W Thermal Design - amber, red-orange, red 0 200 400 600 800 1000 1200 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W Thermal Design - green 0 200 400 600 800 1000 1200 0 20 40 60 80 100 120 140 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 20°C/W Rj-a = 25°C/W Rj-a = 30°C/W Rj-a = 35°C/W Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 13 xlamp xp-e2 leds Reflow Soldering Characteristics In testing, Cree has found XLamp XP-E2 LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Tsmax to Tp) 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C Preheat: Time (tsmin to tsmax) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 °C 217 °C Time Maintained Above: Time (tL) 60-150 seconds 60-150 seconds Peak/Classification Temperature (Tp) 215 °C 260 °C Time Within 5 °C of Actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-Down Rate 6 °C/second max. 6 °C/second max. Time 25 °C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 14 xlamp xp-e2 leds Notes Lumen Maintenance Projections Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document at www.cree.com/xlamp_app_notes/LM80_results. Please read the XLamp Long-Term Lumen Maintenance application note at www.cree.com/xlamp_app_notes/lumen_ maintenance for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note at www.cree.com/xlamp_app_notes/thermal_management for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp XP-E2 LEDs to have unlimited floor life in conditions ≤ 30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDS to the resealable moisture-barrier bag and closing the bag immediately after use. UL Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See LED Eye Safety at www.cree.com/ xlamp_app_notes/led_eye_safety. Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 15 xlamp xp-e2 leds Mechanical Dimensions All measurements are ±.13 mm unless otherwise indicated. Anode Anode THIRD ANGLE PROJECTION A B C D 6 5 4 3 6 5 4 3 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS .XX ± .25 .XXX ± .125 X° ± .5 UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 R1.53 .65 .83 2.36 RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE C DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION 6 5 4 3 2 PERSON WITHOUT THE WRITTEN CONSENT COPIED, REPRODUCED OR DISCLOSED TO ANY INFORMATION OF CREE, INC. THIS PLOT WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL. THIS PLOT AND THE INFORMATION NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .50 .50 .40 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 R1.53 .65 .83 3.30 .50 2.30 3.30 1.30 2.36 OUTLINE D. CRONIN 07/19/12 REVISONS REV DESCRIPTION RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE C DRAWING DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION 6 5 4 3 2 PERSON WITHOUT THE WRITTEN CONSENT REPRODUCED OR DISCLOSED TO ANY INFORMATION OF CREE, INC. THIS PLOT ARE THE PROPRIETARY AND THIS PLOT AND THE INFORMATION NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .50 1.30 3.30 3.30 1.15 .65 1.65 .50 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 R1.53 .65 .83 3.30 .50 2.30 3.30 1.30 2.36 OUTLINE D. CRONIN 07/19/12 REVISONS REV DESCRIPTION RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION 5 4 3 2 WITHOUT THE WRITTEN CONSENT REPRODUCED OR DISCLOSED TO ANY OF CREE, INC. THIS PLOT PROPRIETARY AND PLOT AND THE INFORMATION X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .50 1.30 3.30 3.30 1.15 .65 1.65 1.20 .60 .60 3.20 1.60 3.20 .40 .40 .40 3.45 3.45 R1.53 .65 .83 3.30 .50 2.30 3.30 1.30 2.36 2610-OUTLINE DRAWING D. CRONIN 07/19/12 REVISONS REV DESCRIPTION RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE 3 2 1 A B C Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon Drive Durham, N.C 27703 X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.20 .60 3.20 1.60 3.20 .40 .65 1.30 22.000 1 /1 2610-00029 A OUTLINE DRAWING XPE G2 D. CRONIN 07/19/12 RECOMMENDED STENCIL PATTERN AREA IS OPENING) Top View Side View Bottom View Recommended PCB Solder Pad Recommended Stencil Pattern Hatched Area is Opening Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 16 xlamp xp-e2 leds Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) END START Cathode Side Anode Side (denoted by + and circle) 2.5±.1 1.5±.1 8.0±.1 4.0±.1 1.75±.10 12.0 .0 +.3 DETAIL B SCALE 2 : 1 13mm 7" Cover Tape Pocket Tape User Feed Direction User Feed Direction 13 61 12.40 0 +2.00 MEASURED AT HUB 12.40 MEASURED AT INSIDE EDGE 16.40 TITLE DATE DATE DATE CHECK MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION .X ± 0.3 .XX ± .13 X° ± 1° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: A B C D 6 5 4 3 2 1 A B C D Phone (919) 361-4770 4600 Silicon Drive Durham, N.C 27703 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. Reel, 7" x 12mm Wide LIUDEZHI 2012/5/25 +/-0.5 190 ½öÓÃÓÚÆÀ¹À¡£ °æȨËùÓÐ (c) by Foxit Software Company, 2004 ÓÉ Foxit PDF Editor ±à¼- OD 7.5'' 13 61 12.40 0 +2.00 MEASURED AT HUB 12.40 16.40 B C D 6 5 4 3 2 1 B C D NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. +/-0.5 190 ½öÓÃÓÚÆÀ¹À¡£ °æȨËùÓÐ (c) by Foxit Software Company, 2004 ÓÉ Foxit PDF Editor ±à¼- OD 7.5'' Y Y X X REF 0.59 F(III) D1 P1 1.5 MIN. Bo Ao R0.2 TYPICAL REF 4.375 Ko (IV) Other material available. (III) (II) (I) hole to centerline of pocket. Measured from centerline of sprocket holes is ± 0.20. Cumulative tolerance of 10 sprocket to centerline of pocket. Measured from centerline of sprocket hole SECTION Y-Y SECTION X-X ±0.05 Do 1.75 E1 REF R 2.24 Ko 2.40 +0.0/-0.1 3.70 1 W F P +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 Ao 3.70 +/- 0.1 Bo +/- 0.1 Y Y X X REF 0.59 W F(III) D1 P1 1.5 MIN. Bo Ao R0.2 TYPICAL REF 4.375 Ko (IV) Other material available. (III) (II) (I) hole to centerline of pocket. Measured from centerline of sprocket holes is ± 0.20. Cumulative tolerance of 10 sprocket to centerline of pocket. Measured from centerline of sprocket hole SECTION Y-Y SECTION X-X 2.0 ±0.05 (I) P2 1.55 ±0.05 Do 4.0 ±0.1 (II) Po 1.75 ±0.1 E1 T 0.30 ±0.05 REF R 2.24 Ko 2.40 +0.0/-0.1 3.70 1 W F P +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 Ao 3.70 +/- 0.1 Bo +/- 0.1 Y Y D1 1.5 MIN. Bo R0.2 TYPICAL REF 4.375 Ko SECTION Y-Y 0.05 REF Ko 2.40 +0.0/-0.1 3.70 1 W F P +/- 0.05 +/- 0.1 +0.3/-0.1 5.50 8.00 12.00 Ao 3.70 +/- 0.1 Bo +/- 0.1 CATHODE SIDE ANODE SIDE Copyright © 2012-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. 17 xlamp xp-e2 leds Packaging Patent Label (on bottom of box) Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Code, Qty, Reel ID Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Unpackaged Reel Packaged Reel Boxed Reel CREE Bin Code & Barcode Label Vacuum-Sealed Moisture Barrier Bag Label with Customer P/N, Qty, Lot #, PO # Label with Cree Bin Code, Qty, Lot # Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Patent Label Label with Customer Order Code, Qty, Reel ID, PO # Ideal for power supply 1a/1c/2a/2c/5A/10A power relays JW RELAYS VDE RoHS compliant FEATURES • Miniature package with universal terminal footprint • High dielectric withstanding for transient protection: 10,000 V surge in μs between coil and contact • Sealed construction • Class B coil insulation types available • TV rated (TV-5) types available (only for 1 Form A type) • VDE, TÜV, SEMKO, SEV, FIMKO, TV-5 also approved • Sockets are available. TYPICAL APPLICATIONS 1. Home appliances TV sets, VCR, Microwave ovens 2. Office machines Photocopiers, Vending machines 3. Industrial equipment NC machines, Robots, Temperature controllers Contact arrangement 1: 1a: 2: 2a: 1 Form C 1 Form A 2 Form C 2 Form A Contact capacity Nil: F: Standard (5 A) High capacity (10 A)* JW N Protective construction S: H: Sealed type Flux-resistant type Coil insulation class Nil: B: Class E insulation Class B insulation Pick-up voltage N: 70% of nominal voltage Nominal coil voltage DC5V, DC6V, DC9V, DC12V, DC24V, DC48V Contact material F: AgSnO2 type (1a) Nil: AgNi type (1c, 2a, 2c) *Only for 1 Form A and 1 Form C type Certified by UL, CSA, VDE, SEMKO, FIMKO and SEV Note: When ordering TV rated (TV-5) types, add suffix-TV (available only for 1 Form A type). Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ JW ASCTB190E 201210-T TYPES * For sockets, see page 140. RATING 1. Coil data Nominal coil voltage Pick-up voltage (at 20°C 68°F) Drop-out voltage (at 20°C 68°F) Nominal operating current [±10%] (at 20°C 68°F) Coil resistance [±10%] (at 20°C 68°F) Nominal operating power Max. applied voltage (at 20°C 68°F) 5V DC 70%V or less of nominal voltage (Initial) 10%V or more of nominal voltage (Initial) 106mA 47Ω 530mW 130%V of nominal voltage (at 60°C 140°F) 120%V of nominal voltage (at 85°C 185°F)*4 6V DC 88mA 68Ω 9V DC 58mA 155Ω 12V DC 44mA 270Ω 24V DC 22mA 1,100Ω 48V DC 11mA 4,400Ω 1) 1 Form A Standard (5A) type Standard packing: Carton 100 pcs. Case 500 pcs. 2) 1 Form A High capacity (10 A) type Standard packing: Carton 100 pcs. Case 500 pcs. Nominal coil voltage Sealed type Flux-resistant type Part No. Part No. 5V DC JW1aSN-DC5V-F JW1aHN-DC5V-F 6V DC JW1aSN-DC6V-F JW1aHN-DC6V-F 9V DC JW1aSN-DC9V-F JW1aHN-DC9V-F 12V DC JW1aSN-DC12V-F JW1aHN-DC12V-F 24V DC JW1aSN-DC24V-F JW1aHN-DC24V-F 48V DC JW1aSN-DC48V-F JW1aHN-DC48V-F Nominal coil voltage Sealed type Flux-resistant type Part No. Part No. 5V DC JW1aFSN-DC5V-F JW1aFHN-DC5V-F 6V DC JW1aFSN-DC6V-F JW1aFHN-DC6V-F 9V DC JW1aFSN-DC9V-F JW1aFHN-DC9V-F 12V DC JW1aFSN-DC12V-F JW1aFHN-DC12V-F 24V DC JW1aFSN-DC24V-F JW1aFHN-DC24V-F 48V DC JW1aFSN-DC48V-F JW1aFHN-DC48V-F 3) 1 Form C Standard (5A) type Standard packing: Carton 100 pcs. Case 500 pcs. 4) 1 Form C High capacity (10 A) type Standard packing: Carton 100 pcs. Case 500 pcs. Nominal coil voltage Sealed type Flux-resistant type Part No. Part No. 5V DC JW1SN-DC5V JW1HN-DC5V 6V DC JW1SN-DC6V JW1HN-DC6V 9V DC JW1SN-DC9V JW1HN-DC9V 12V DC JW1SN-DC12V JW1HN-DC12V 24V DC JW1SN-DC24V JW1HN-DC24V 48V DC JW1SN-DC48V JW1HN-DC48V Nominal coil voltage Sealed type Flux-resistant type Part No. Part No. 5V DC JW1FSN-DC5V JW1FHN-DC5V 6V DC JW1FSN-DC6V JW1FHN-DC6V 9V DC JW1FSN-DC9V JW1FHN-DC9V 12V DC JW1FSN-DC12V JW1FHN-DC12V 24V DC JW1FSN-DC24V JW1FHN-DC24V 48V DC JW1FSN-DC48V JW1FHN-DC48V 5) 2 Form A Standard (5A) type Standard packing: Carton 100 pcs. Case 500 pcs. 6) 2 Form C Standard (5A) type Standard packing: Carton 100 pcs. Case 500 pcs. Note: Class B coil insulation type is available. Ex) JW1aSN-B-DC12V-F Nominal coil voltage Sealed type Flux-resistant type Part No. Part No. 5V DC JW2aSN-DC5V JW2aHN-DC5V 6V DC JW2aSN-DC6V JW2aHN-DC6V 9V DC JW2aSN-DC9V JW2aHN-DC9V 12V DC JW2aSN-DC12V JW2aHN-DC12V 24V DC JW2aSN-DC24V JW2aHN-DC24V 48V DC JW2aSN-DC48V JW2aHN-DC48V Nominal coil voltage Sealed type Flux-resistant type Part No. Part No. 5V DC JW2SN-DC5V JW2HN-DC5V 6V DC JW2SN-DC6V JW2HN-DC6V 9V DC JW2SN-DC9V JW2HN-DC9V 12V DC JW2SN-DC12V JW2HN-DC12V 24V DC JW2SN-DC24V JW2HN-DC24V 48V DC JW2SN-DC48V JW2HN-DC48V Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ JW ASCTB190E 201210-T 2. Specifications * Specifications will vary with foreign standards certification ratings. Notes: *1. This value can change due to the switching frequency, environmental conditions, and desired reliability level, therefore it is recommended to check this with the actual load. *2. Wave is standard shock voltage of ±1.2×50μs according to JEC-212-1981 *3. The upper limit of the ambient temperature is the maximum temperature that can satisfy the coil temperature rise value. Refer to Usage, transport and storage conditions in NOTES. *4. The pick-up and drop out voltages rise approximately 0.4% for every 1°C 33.8°F given a standard ambient temperature of 20°C 68°F. Therefore, when using relays where the ambient temperature is high, please take into consideration the rise in pick-up and drop out voltages and keep the coil applied voltage within the maximum applied voltage. REFERENCE DATA Characteristics Item Specifications Standard type High capacity type Contact Contact material 1 Form A: AgSnO2 type 1 Form C, 2 Form A and 2 Form C: AgNi type Arrangement 1 Form A, 1 Form C, 2 Form A and 2 Form C 1 Form A and 1 Form C Contact resistance (Initial) Max. 100 mΩ (By voltage drop 6 V DC 1A) Rating Nominal switching capacity (resistive load) 5A 250V AC, 5A 30V DC 10A 250V AC, 10A 30V DC Max. switching power (resistive load) 1,250VA, 150W 2,500VA, 300W Max. switching voltage 250V AC, 30V DC Max. switching current 5A 10A Min. switching capacity (reference value)*1 100mA, 5V DC Electrical characteristics Insulation resistance (Initial) Min. 1,000MΩ (at 500V DC) Measurement at same location as “Breakdown voltage” section. Breakdown voltage (Initial) Between open contacts 1,000 Vrms for 1 min. (Detection current: 10 mA) Between contact and coil 5,000 Vrms for 1 min. (Detection current: 10 mA) Between contact sets 3,000 Vrms for 1 min. (2 Form A, 2 Form C) (Detection current: 10 mA) Temperature rise (coil) 1 Form A: Max. 45°C 113°F, 1 Form C, 2 Form A and 2 Form C: Max. 55°C 131°F (resistive method, with nominal coil voltage and at nominal switching capacity, at 20°C 68°F) 1 Form A: Max. 45°C 113°F, 1 Form C: Max. 55°C 131°F (resistive method, with nominal coil voltage and at nominal switching capacity, at 20°C 68°F) Surge breakdown voltage*2 (Between contact and coil) (Initial) 10,000 V Operate time (at nominal voltage) (at 20°C 68°F) Max. 15 ms (excluding contact bounce time.) Release time (at nominal voltage) (at 20°C 68°F) Max. 5 ms (excluding contact bounce time) (Without diode) Mechanical characteristics Shock resistance Functional 98 m/s2 (Half-wave pulse of sine wave: 11 ms; detection time: 10μs.) Destructive 980 m/s2 (Half-wave pulse of sine wave: 6 ms.) Vibration resistance Functional 10 to 55 Hz at double amplitude of 1.6 mm (Detection time: 10μs.) Destructive 10 to 55 Hz at double amplitude of 2.0 mm Expected life Mechanical (at 180 times/min.) Min. 5×106 Electrical (at 6 times/min.) Min. 105 (at resistive load) Conditions Conditions for operation, transport and storage*3 Ambient temperature*4: –40°C to +60°C –40°F to 140°F (Class E), (Class B: –40°C to +85°C –40°F to 185°F) Humidity: 5 to 85% R.H. (Not freezing and condensing at low temperature) Max. operating speed (at nominal switching capacity) Flux-resistant type: 20 times/min., Sealed type: 6 times/min. Unit weight Approx. 13 g .46 oz JW 1 Form A Standard (5A) type 1. Maximum operating power 2. Operate/release time Sample: JW1aSN-DC12V-F, 10 pcs. Ambient temperature: 20°C 68°F 3. Life curve 1 Form A Standard (5 A) type 10 100 10 100 1,000 1 Contact voltage, V AC resistive load DC resistive load Contact current, A 80 90 100 110 120 5 0 10 Min. Max. Min. x - x - Max. Coil applied voltage, %V Operate/release time, ms Operate time Release time 100 10 5 10 15 Contact current, A Life, ×104 250 V AC resistive load 30 V DC resistive load Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ JW ASCTB190E 201210-T JW 1 Form A High Capacity (10 A) type 1. Maximum operating power 2. Operate/release time Sample: JW1aFSN-DC12V, 10 pcs. Ambient temperature: 20°C 68°F 3. Life curve 10 100 10 100 1,000 1 Contact voltage, V AC resistive load DC resistive load Contact current, A 80 90 100 110 120 5 0 10 Min. Max. Min. x - x - Max. Coil applied voltage, %V Operate/release time, ms Operate time Release time 100 10 1 0 2 4 6 8 10 12 Contact current, A Life, ×104 250 V AC resistive load 30 V DC resistive load 4-(1). Coil temperature rise (Contact carrying current: 5A) Sample JW1aFSN-DC12V-F, 6 pcs. Point measured: Inside the coil 4-(2). Coil temperature rise (Contact carrying current: 10 A) Sample: JW1aFSN-DC12V-F, 6 pcs. Point measured: Inside the coil 100 120 140 160 10 20 30 40 50 60 70 0 Coil applied voltage, %V Temperature rise, °C 85°C 60°C 25°C 100 120 140 160 10 20 30 40 50 60 70 0 Coil applied voltage, %V Temperature rise, °C 85°C 60°C 25°C JW 1 Form C Standard (5 A) type 1-(3). Maximum operating power 2. Operate/release time Sample: JW1SN-DC12V-F, 6 pcs. Ambient temperature: 20°C 68°F JW 1 Form C High Capacity (10 A) type 1. Maximum operating power 10 10 100 1,000 1 0 Contact voltage, V AC resistive load (cosϕ = 1.0) Contact current, A Max. Min. 13 12 11 10 9 6 4 100 8 7 3 2 1 5 80 90 110 120 130 Max. Min. x - x - Coil applied voltage, %V Operate/release time, ms 10 10 100 1,000 1 0 Contact voltage, V AC resistive load (cosϕ = 1.0) Contact current, A JW 2 Form A Standard (5 A) type 1. Maximum operating power 2. Operate/release time Sample: JW2aSN-DC24V-F, 6 pcs. Ambient temperature: 20°C 68°F 10 10 100 1,000 1 0 Contact voltage, V AC resistive load (cosϕ = 1.0) Contact current, A 14 13 12 10 8 6 4 2 80 90 100 110 120 Min. x - x - Coil applied voltage, %V Operate/release time, ms Operate time Release time Max. Max. Min. Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ JW ASCTB190E 201210-T DIMENSIONS (mm inch) JW 2 Form C Standard (5 A) type 1. Maximum operating power 2. Operate/release time Sample: JW2SN-DC12V-F, 6 pcs. Ambient temperature: 20°C 68°F 10 10 100 1,000 1 0 Contact voltage, V Contact current, A AC resistive load (cosϕ = 1.0) 9 8 7 6 5 4 3 2 1 0 80 90 100 110 120 130 Max. Coil applied voltage, %V Operate/release time, ms Operate time Release time Min. Min. Max. x - x - The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/ JW 1 Form A External dimensions 0.3 0.3 0.5 0.4 12.8 7.6 1.1 2.4 3.5 0.9 28.6 20 20 3.6 .012 .012 .020 .016 .504 .299 .043 .094 .138 .035 1.126 .787 .787 .142 Wiring diagram (Bottom view) Note: Terminal numbers are not indicated on the relay. PC board pattern (Bottom view) Tolerance: ±0.1 ±.004 COM N.O. Coil 4 6 1 8 Relay outline 12.8 .504 7.6 .299 20.0 .787 2.4 .094 4-1.5 dia. 4-.059 dia. 3.5 .138 CAD Data Dimension: Less than 1mm .039inch: Min. 1mm .039inch less than 3mm .118 inch: Min. 3mm .118 inch: General tolerance ±0.1 ±.004 ±0.2 ±.008 ±0.3 ±.012 JW 1 Form C External dimensions 20 .787 0.4 .016 3.6 .142 0.5 .020 0.3 0.5 .012 .020 0.3 .012 1.1 .043 2.4 .094 3.5 .138 3.5 .138 16.5 .650 28.6 1.128 0.8 .031 7.6 .299 12.8 .504 Wiring diagram (Bottom view) Note: Terminal numbers are not indicated on the relay. PC board pattern (Bottom view) Tolerance: ±0.1 ±.004 COM N.C. N.O. Coil 4 2 6 1 8 Relay outline 5-1.5 dia. 5-.059 dia. 16.5 .650 3.5 .138 3.5 .138 2.4 .094 7.6 .299 CAD Data Dimension: Less than 1mm .039inch: Min. 1mm .039inch less than 3mm .118 inch: Min. 3mm .118 inch: General tolerance ±0.1 ±.004 ±0.2 ±.008 ±0.3 ±.012 Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ JW ASCTB190E 201210-T SAFETY STANDARDS Item UL/C-UL (Recognized) CSA (Certified) VDE (Certified) TV rating (UL/CSA) TÜV (Certified) SEMKO (Certified) FIMKO SEV File No. Contact rating File No. Contact rating File No. Contact rating File No. Rating File No. Rating File No. Contact rating File No. Contact rating File No. Contact rating Standard type 1 Form A E43028 5A 277V AC 5A 30V DC 1/8HP 125V AC 1/8HP 250V AC LR26550 etc. 5A 277V AC 5A 30V DC 1/8HP 125V AC 1/8HP 250V AC B300 40013854 5A 250V AC (cosφ =1.0) 3A 250V AC (cosφ =0.4) Standard type 5A 30V DC (0ms) UL E43028 CSA LR26550 etc. 1a➝TV-5 B 11 05 13461 305 5A 250V AC (cosφ =1.0) 3A 250V AC (cosφ =0.4) 5A 30V DC (0ms) 817817 5A 250V AC (cosφ =1.0) 5A 30V DC (0ms) 24965 5A 250V AC (cosφ =1.0) 5A 30V DC (0ms) 11. 0262 5A 250V AC (cosφ =1.0) Standard type 1 Form C E43028 5A 277V AC 5A 30V DC 1/8HP 125V AC 1/8HP 250V AC LR26550 etc. 5A 277V AC 5A 30V DC 1/8HP 125V AC 1/8HP 250V AC B300 40013854 5A 250V AC (cosφ =1.0) 3A 250V AC (cosφ =0.4) Standard type 5A 30V DC (0ms) — — B 11 05 13461 305 5A 250V AC (cosφ =1.0) 3A 250V AC (cosφ =0.4) 5A 30V DC (0ms) 817817 5A 250V AC (cosφ =1.0) 5A 30V DC (0ms) 24965 5A 250V AC (cosφ =1.0) 5A 30V DC (0ms) 11. 0262 5A 250V AC (cosφ =1.0) Standard type 2 Form A E43028 5A 277V AC 5A 30V DC 1/8HP 125V AC 1/8HP 250V AC B300 LR26550 etc. 5A 277V AC 5A 30V DC 1/8HP 125V AC 1/8HP 250V AC B300 40013854 5A 250V AC (cosφ =1.0) 3A 250V AC (cosφ =0.4) Standard type 5A 30V DC (0ms) — — B 11 05 13461 305 5A 250V AC (cosφ =1.0) 3A 250V AC (cosφ =0.4) 5A 30V DC (0ms) Tantalum-Polymer Solid Capacitors New Capacitors Panasonic New Product Introduction Stable Capacitance at High Frequency and Temperature, with Low ESR/ESL Panasonic, a worldwide leader in Capacitor Products, introduces POSCAP Tantalum-Polymer Solid Capacitors to their Capacitor product line. The POSCAP product line spans several series of Solid Electrolyte Chip Capacitors which include the TPE, TQC, TPF, TPSF, TPB, TPC, TPG, and TPU Series. These capacitors utilize a sintered tantalum anode and a proprietary high conductivity polymer for a cathode. Panasonic’s innovative construction and processing yields the lowest ESR level in polymer tantalum technology, and exhibits excellent performance in high frequency applications. Offering a high volumetric efficiency for capacitance, POSCAP Capacitors is available in various, compact package sizes for a small PCB footprint. Additionally, POSCAP parts demonstrate a high reliability and high heat resistance, making them the ideal Chip Capacitor for digital, high-frequency devices and more. • Low Profile Package Size: 0.9mm Height (TPU) • Very Low ESR (Down to 5mΩ) • Large Capacitance (Up to 1500μF) • High Temp Reflow Solder Capable (up to 260°C) • RoHS Compliant • High Volumetric Efficiency for Capacitance • Safe Alternative to Generic Tantalum Capacitors • Variety of Low Profile Packages Opens up PCB Space • Wide Application Coverage • Consumer Electronics • Industrial Electronics • Telecommunications • Appliances • PC/Server • Set Top Box • Audio/Video Equipment • FPGA Power Delivery • Router/Switch/Base Station • Test and Measurement Website: www.panasonic.com/industrial industrial@us.panasonic.com 1-800-344-2112 Copyright © 2013 Panasonic Corporation of North America. All Rights Reserved. Specifications are subject to change without notice. POSCAP NPI, FY13-038-XXX Features Benefits Industries Applications Part Number Information Additional Information For detailed specification information on the POSCAP Line of Tantalum Solid Capacitors, visit our website at: www.panasonic.com/industrial/electronic-components/capacitive-products/ RoHS COMPLIANT Series Information TPE, TQC, TPF, TPSF, TPB, TPC, TPG, TPU Series 2 R 5 Rated Voltage Series Rated Capacitance Cap. Tol. T P E 3 3 0 M Special Code A Z B Series Voltage Capacitance ESR TPE 2-10 VDC 47-1500 μF 7-35 mΩ TQC 16-35 VDC 3.9-150 μF 40-400 mΩ TPF 2-10 VDC 150-1000 μF 5-15 mΩ TPSF 2 VDC 270 μF 6-9 mΩ TPB 4-10 VDC 33-470 μF 35-70 mΩ TPC 6.3-12.5 VDC 10-330 μF 40-80 mΩ TPG 2.5-12.5 VDC 33-220 μF 30-70 mΩ TPU 2.5-10 VDC 4.7-150 μF 100-300 mΩ Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-63 – 0d±0.05 010 Sleeve L 14 min. 3 min. (0815, 01615, 01815 : L±1.5) Pressure relief 06.3 But exclude 7 mm height L16 : L±1.0 L20 : L±2.0 + – 04 to 08 0D±0.5 F±0.5 0D±0.5 ■ Features ● Endurance : 105 °C 1000 h to 5000 h ● Low impedance ● RoHS directive compliant Radial Lead Type Series: FC Type: A ■ Specifi cations Category Temp. Range –55 °C to +105 °C Rated W.V. Range 6.3 V.DC to 100 V.DC Nominal Cap. Range 2.2 μF to 15000 μF Capacitance Tolerance ±20 % (120 Hz/+20 °C) DC Leakage Cur rent I < 0.01 CV or 3 (μA) After 2 minutes (Whichever is greater) tan d W.V. (V) 6.3 10 16 25 35 50 63 100 (120 Hz/+20 °C) tan d 0.22 0.19 0.16 0.14 0.12 0.10 0.08 0.07 For capacitance value > 1000 μF, add 0.02 per every 1000 μF. Endurance After following life test with DC voltage and +105 °C±2 °C ripple current value applied (The sum of DC and ripple peak voltage shall not exceed the rated working voltage) when the capacitors are restored to 20 °C, the capacitors shall meet the limits specifi ed bellow. Duration : 04 to 06.3: 1000 hours, 08: 2000 hours , 010: 3000 hours , 012.5 to 018: 5000 hours Capacitance change ±20 % of initial measured value tan d < 200 % of initial specifi ed value DC leakage current < initial specifi ed value Shelf Life After storage for 1000 hours at +105 °C±2 °C with no voltage applied and then being stabilized at +20 °C, capacitors shall meet the limits specifi ed in Endurance. (With voltage treatment) W.V.(V.DC) Cap (μF) Frequency (Hz) 60 120 1 k 10 k 100 k 6.3 to 100 2.2 to 330 0.55 0.65 0.85 0.90 1.00 390 to 1000 0.70 0.75 0.90 0.95 1.00 1200 to 2200 0.75 0.80 0.90 0.95 1.00 2700 to 15000 0.80 0.85 0.95 1.00 1.00 ■ Frequency correction factor for ripple current L>11 L=7 Body Dia. 0D 4 5 6.3 8 10 12.5 16 18 4 5 6.3 Body Length L 15 to 25 30 to 40 Lead Dia. 0d 0.45 0.5 0.5 0.6 0.6 0.6 0.8 0.8 0.8 0.45 0.45 0.45 Lead space F 1.5 2.0 2.5 3.5 5.0 5.0 5.0 7.5 7.5 1.5 2.0 2.5 ■ Di men sions in mm (not to scale) (Unit : mm) 02 Dec. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-64 – ■ Case size/ Impedance/ Ripple Current W.V(V.DC) 6.3 V to 35 V 50 V 63 V 100 V Case size (0D×L) Imped ance (Ω)/(100 kHz) Ripple Current (mA r.m.s) /(100 kHz) Imped ance (Ω)/(100 kHz) Ripple Current (mA r.m.s) /(100 kHz) Imped ance (Ω)/(100 kHz) Ripple Current (mA r.m.s) /(100 kHz) Imped ance (Ω)/(100 kHz) Ripple Current (mA r.m.s) 20 °C –10 °C 20 °C –10 °C 20 °C –10 °C 20 °C –10 °C /(100 kHz) 4 × 7 2.00 5.00 65 5 × 7 0.950 2.40 120 6.3 × 7 0.450 1.20 200 4 × 11 1.30 2.60 120 2.50 5.00 90 3.50 7.00 80 5 × 11 0.800 1.60 175 ✽ ✽ ✽ 2.00 4.00 145 4.10 8.20 80 5 × 15 0.500 1.00 235 0.900 1.80 215 1.30 2.60 200 2.80 5.60 90 6.3 × 11.2 0.350 0.700 290 0.600 1.20 260 1.00 2.00 240 1.80 3.60 114 6.3 × 15 0.250 0.500 400 0.400 0.800 360 0.700 1.40 330 1.10 2.20 155 8 × 11.5 0.117 0.234 555 0.234 0.468 485 0.342 0.684 405 0.680 1.36 260 8 × 15 0.085 0.170 730 0.155 0.310 635 0.230 0.460 535 0.450 0.900 340 8 × 20 0.065 0.130 995 0.120 0.240 860 0.178 0.356 690 0.330 0.660 455 10 × 12.5 0.090 0.180 755 0.162 0.324 615 0.256 0.512 535 0.530 1.06 306 10 × 16 0.068 0.136 1050 0.119 0.238 850 0.194 0.388 600 0.360 0.720 400 10 × 20 0.052 0.104 1220 0.090 0.180 1030 0.147 0.294 885 0.240 0.480 463 10 × 25 0.045 0.090 1440 0.082 0.164 1200 0.130 0.260 1050 0.210 0.420 599 10 × 30 0.035 0.070 1815 0.060 0.120 1610 0.090 0.180 1300 0.150 0.300 698 12.5 × 15 0.065 0.130 1205 0.110 0.220 1150 0.150 0.300 1020 0.230 0.460 511 12.5 × 20 0.038 0.076 1655 0.063 0.126 1480 0.085 0.170 1285 0.180 0.360 671 12.5 × 25 0.030 0.060 1945 0.050 0.100 1832 0.070 0.140 1720 0.110 0.220 807 12.5 × 30 0.025 0.050 2310 0.040 0.080 2215 0.055 0.110 2090 0.098 0.196 937 12.5 × 35 0.022 0.044 2510 0.034 0.068 2285 0.047 0.094 2265 0.087 0.174 1040 12.5 × 40 0.018 0.036 2655 0.030 0.060 2590 0.042 0.084 2560 0.072 0.144 1130 16 × 15 0.043 0.086 1690 0.080 0.160 1610 0.090 0.180 1410 0.140 0.280 793 16 × 20 0.029 0.058 2205 0.048 0.096 1835 0.059 0.118 1765 0.110 0.220 995 16 × 25 0.022 0.044 2555 0.034 0.068 2235 0.050 0.100 2160 0.089 0.178 1170 16 × 31.5 0.018 0.036 3010 0.028 0.056 2700 0.043 0.086 2670 0.062 0.124 1520 16 × 35.5 0.016 0.032 3150 0.025 0.050 2790 0.036 0.072 2770 0.053 0.106 1730 16 × 40 0.015 0.030 3360 0.023 0.046 2845 0.030 0.060 2825 0.047 0.094 1920 18 × 15 0.038 0.076 2000 0.068 0.136 1900 0.086 0.172 1690 0.120 0.240 917 18 × 20 0.028 0.056 2490 0.042 0.084 2420 0.055 0.110 2290 0.080 0.160 1230 18 × 25 0.020 0.040 2740 0.029 0.058 2610 0.043 0.086 2585 0.070 0.140 1420 18 × 31.5 0.016 0.032 3635 0.025 0.050 3000 0.032 0.064 2950 0.062 0.124 1600 18 × 35.5 0.015 0.030 3680 0.023 0.046 3100 0.030 0.060 3095 0.041 0.082 1770 18 × 40 0.014 0.028 3735 – – – 0.025 0.050 3205 0.036 0.072 2300 ✽ Case size (0D×L) Capacitance (μF) Imped ance (Ω)/(100 kHz) Ripple Current 20 °C –10 °C (mA r.m.s)(100 kHz) 5 × 11 1.0 2.40 4.80 20 2.2 1.80 3.60 45 3.3 1.30 2.60 65 4.7 1.30 2.60 95 10 1.30 2.60 125 12 1.30 2.60 135 15 1.30 2.60 145 18 1.30 2.60 155 22 1.30 2.60 155 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-65 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) () (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 6.3 27 4 7 65 2.000 1000 0.45 1.5 5.0 2.5 EEAFC0J270( ) 200 2000 56 5 7 120 0.950 1000 0.45 2.0 5.0 2.5 EEAFC0J560( ) 200 2000 68 4 11 120 1.300 1000 0.45 1.5 5.0 2.5 EEUFC0J680( ) 200 2000 100 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC0J101( ) 200 2000 120 6.3 7 200 0.450 1000 0.45 2.5 5.0 2.5 EEAFC0J121( ) 200 2000 150 5 15 235 0.500 1000 0.50 2.0 5.0 2.5 EEUFC0J151( ) 200 2000 220 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC0J221( ) 200 2000 270 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC0J271( ) 200 2000 330 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC0J331S( ) 200 2000 6.3 15 400 0.250 1000 0.50 2.5 5.0 2.5 EEUFC0J331( ) 200 2000 390 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC0J391( ) 200 1000 470 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC0J471( ) 200 1000 560 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC0J561( ) 200 1000 820 8 15 730 0.085 2000 0.60 3.5 5.0 EEUFC0J821L( ) 200 1000 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC0J821( ) 200 500 1000 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC0J102( ) 200 500 1200 8 20 995 0.065 2000 0.60 3.5 5.0 EEUFC0J122L( ) 200 1000 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC0J122( ) 200 500 1500 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC0J152( ) 200 500 12.5 15 1205 0.065 5000 0.60 5.0 5.0 EEUFC0J152S( ) 200 500 1800 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC0J182( ) 200 500 2200 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC0J222( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC0J222S( ) 100 250 2700 10 30 1815 0.035 3000 0.60 5.0 EEUFC0J272L 100 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC0J272( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC0J272S( ) 100 250 3300 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC0J332( ) 200 500 18 15 2000 0.038 5000 0.80 7.5 7.5 EEUFC0J332S( ) 100 250 3900 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC0J392( ) 200 500 4700 12.5 30 2310 0.025 5000 0.80 5.0 EEUFC0J472 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC0J472S( ) 100 250 5600 12.5 35 2510 0.022 5000 0.80 5.0 EEUFC0J562L 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC0J562( ) 100 250 6800 12.5 40 2655 0.018 5000 0.80 5.0 EEUFC0J682L 100 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC0J682( ) 100 250 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC0J682S( ) 100 250 8200 16 31.5 3010 0.018 5000 0.80 7.5 EEUFC0J822 100 10000 16 35.5 3150 0.016 5000 0.80 7.5 EEUFC0J103 100 18 25 2740 0.020 5000 0.80 7.5 7.5 EEUFC0J103S( ) 100 250 12000 16 40 3360 0.015 5000 0.80 7.5 EEUFC0J123L 100 18 31.5 3635 0.016 5000 0.80 7.5 EEUFC0J123 50 15000 18 35.5 3680 0.015 5000 0.80 7.5 EEUFC0J153 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C φ4 to φ6.3=1000 h, φ8=2000 h, φ10=3000 h, φ12.5 to φ18=5000 h 00 Nov. 2012 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-66 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) () (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 10 22 4 7 65 2.000 1000 0.45 1.5 5.0 2.5 EEAFC1A220( ) 200 2000 39 5 7 120 0.950 1000 0.45 2.0 5.0 2.5 EEAFC1A390( ) 200 2000 47 4 11 120 1.300 1000 0.45 1.5 5.0 2.5 EEUFC1A470( ) 200 2000 82 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1A820( ) 200 2000 6.3 7 200 0.450 1000 0.45 2.5 5.0 2.5 EEAFC1A820( ) 200 2000 100 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1A101S( ) 200 2000 5 15 235 0.500 1000 0.50 2.0 5.0 2.5 EEUFC1A101( ) 200 2000 150 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1A151( ) 200 2000 180 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1A181( ) 200 2000 220 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1A221S( ) 200 2000 6.3 15 400 0.250 1000 0.50 2.5 5.0 2.5 EEUFC1A221( ) 200 2000 330 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1A331( ) 200 1000 390 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1A391( ) 200 1000 470 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1A471( ) 200 1000 560 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1A561( ) 200 500 680 8 15 730 0.085 2000 0.60 3.5 5.0 EEUFC1A681L( ) 200 1000 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1A681( ) 200 500 820 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1A821( ) 200 500 1000 8 20 995 0.065 2000 0.60 3.5 5.0 EEUFC1A102L( ) 200 1000 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1A102( ) 200 500 1200 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1A122( ) 200 500 12.5 15 1205 0.065 5000 0.60 5.0 5.0 EEUFC1A122S( ) 200 500 1500 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC1A152( ) 200 500 1800 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1A182( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC1A182S( ) 100 250 2200 10 30 1815 0.035 3000 0.60 5.0 EEUFC1A222L 100 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1A222( ) 200 500 2700 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1A272( ) 200 500 18 15 2000 0.038 5000 0.80 7.5 7.5 EEUFC1A272S( ) 100 250 3300 12.5 30 2310 0.025 5000 0.80 5.0 EEUFC1A332 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1A332S( ) 100 250 3900 12.5 35 2510 0.022 5000 0.80 5.0 EEUFC1A392L 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1A392( ) 100 250 4700 12.5 40 2655 0.018 5000 0.80 5.0 EEUFC1A472L 100 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC1A472( ) 100 250 5600 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC1A562( ) 100 250 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC1A562S( ) 100 250 6800 16 31.5 3010 0.018 5000 0.80 7.5 EEUFC1A682 100 18 25 2740 0.020 5000 0.80 7.5 7.5 EEUFC1A682S( ) 100 250 8200 16 35.5 3150 0.016 5000 0.80 7.5 EEUFC1A822L 100 18 31.5 3635 0.016 5000 0.80 7.5 EEUFC1A822 50 10000 18 35.5 3680 0.015 5000 0.80 7.5 EEUFC1A103 50 12000 18 40 3735 0.014 5000 0.80 7.5 EEUFC1A123 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C φ4 to φ6.3=1000 h, φ8=2000 h, φ10=3000 h, φ12.5 to φ18=5000 h 00 Nov. 2012 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-67 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) () (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 16 15 4 7 65 2.000 1000 0.45 1.5 5.0 2.5 EEAFC1C150( ) 200 2000 27 5 7 120 0.950 1000 0.45 2.0 5.0 2.5 EEAFC1C270( ) 200 2000 39 4 11 120 1.30 1000 0.45 1.5 5.0 2.5 EEUFC1C390( ) 200 2000 47 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1C470( ) 200 2000 56 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1C560( ) 200 2000 6.3 7 200 0.450 1000 0.45 2.5 5.0 2.5 EEAFC1C560( ) 200 2000 68 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1C680( ) 200 2000 82 5 15 235 0.500 1000 0.50 2.0 5.0 2.5 EEUFC1C820( ) 200 2000 100 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1C101( ) 200 2000 120 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1C121( ) 200 2000 180 6.3 15 400 0.250 1000 0.50 2.5 5.0 2.5 EEUFC1C181( ) 200 2000 220 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1C221( ) 200 1000 270 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1C271( ) 200 1000 330 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1C331( ) 200 1000 390 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1C391( ) 200 500 470 8 15 730 0.085 2000 0.60 3.5 5.0 EEUFC1C471L( ) 200 1000 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1C471( ) 200 500 560 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1C561( ) 200 500 680 8 20 995 0.065 2000 0.60 3.5 5.0 EEUFC1C681L( ) 200 1000 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1C681( ) 200 500 820 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1C821( ) 200 500 12.5 15 1205 0.065 5000 0.60 5.0 5.0 EEUFC1C821S( ) 200 500 1000 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1C102S( ) 200 500 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC1C102( ) 200 500 1200 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC1C122( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC1C122S( ) 100 250 1500 10 30 1815 0.035 3000 0.60 5.0 EEUFC1C152L 100 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1C152( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC1C152S( ) 100 250 1800 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1C182( ) 200 500 18 15 2000 0.038 5000 0.80 7.5 7.5 EEUFC1C182S( ) 100 250 2200 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1C222( ) 200 500 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1C222S( ) 100 250 2700 12.5 30 2310 0.025 5000 0.80 5.0 EEUFC1C272L 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1C272( ) 100 250 3300 12.5 35 2510 0.022 5000 0.80 5.0 EEUFC1C332 100 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC1C332S( ) 100 250 3900 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC1C392( ) 100 250 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC1C392S( ) 100 250 4700 16 31.5 3010 0.018 5000 0.80 7.5 EEUFC1C472 100 18 25 2740 0.020 5000 0.80 7.5 7.5 EEUFC1C472S( ) 100 250 5600 16 35.5 3150 0.016 5000 0.80 7.5 EEUFC1C562L 100 18 31.5 3635 0.016 5000 0.80 7.5 EEUFC1C562 50 6800 16 40 3360 0.015 5000 0.80 7.5 EEUFC1C682 100 8200 18 35.5 3680 0.015 5000 0.80 7.5 EEUFC1C822 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C φ4 to φ6.3=1000 h, φ8=2000 h, φ10=3000 h, φ12.5 to φ18=5000 h 00 Nov. 2012 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-68 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) () (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 25 10 4 7 65 2.000 1000 0.45 1.5 5.0 2.5 EEAFC1E100( ) 200 2000 22 5 7 120 0.950 1000 0.45 2.0 5.0 2.5 EEAFC1E220( ) 200 2000 27 4 11 120 1.30 1000 0.45 1.5 5.0 2.5 EEUFC1E270( ) 200 2000 39 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1E390( ) 200 2000 6.3 7 200 0.450 1000 0.45 2.5 5.0 2.5 EEAFC1E390( ) 200 2000 47 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1E470( ) 200 2000 56 5 15 235 0.500 1000 0.50 2.0 5.0 2.5 EEUFC1E560( ) 200 2000 82 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1E820( ) 200 2000 100 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1E101S( ) 200 2000 120 6.3 15 400 0.250 1000 0.50 2.5 5.0 2.5 EEUFC1E121( ) 200 2000 180 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1E181( ) 200 1000 220 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1E221( ) 200 1000 270 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1E271( ) 200 500 330 8 15 730 0.085 2000 0.60 3.5 5.0 EEUFC1E331L( ) 200 1000 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1E331( ) 200 500 390 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1E391( ) 200 500 470 8 20 995 0.065 2000 0.60 3.5 5.0 EEUFC1E471L( ) 200 1000 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1E471( ) 200 500 560 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1E561( ) 200 500 12.5 15 1205 0.065 5000 0.60 5.0 5.0 EEUFC1E561S( ) 200 500 680 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1E681( ) 200 500 820 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC1E821( ) 200 500 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1E821S( ) 200 500 1000 10 30 1815 0.035 3000 0.60 5.0 EEUFC1E102L 100 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1E102( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC1E102S( ) 100 250 1200 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1E122( ) 200 500 18 15 2000 0.038 5000 0.80 7.5 7.5 EEUFC1E122S( ) 100 250 1500 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1E152( ) 200 500 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1E152S( ) 100 250 1800 12.5 30 2310 0.025 5000 0.80 5.0 EEUFC1E182L 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1E182( ) 100 250 2200 12.5 35 2510 0.022 5000 0.80 5.0 EEUFC1E222 100 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC1E222S( ) 100 250 2700 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC1E272( ) 100 250 3300 16 31.5 3010 0.018 5000 0.80 7.5 EEUFC1E332 100 18 25 2740 0.020 5000 0.80 7.5 7.5 EEUFC1E332S( ) 100 250 3900 16 35.5 3150 0.016 5000 0.80 7.5 EEUFC1E392L 100 18 31.5 3635 0.016 5000 0.80 7.5 EEUFC1E392 50 4700 18 35.5 3680 0.015 5000 0.80 7.5 EEUFC1E472 50 5600 18 40 3735 0.014 5000 0.80 7.5 EEUFC1E562 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C φ4 to φ6.3=1000 h, φ8=2000 h, φ10=3000 h, φ12.5 to φ18=5000 h 00 Nov. 2012 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-69 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) () (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 35 6.8 4 7 65 2.000 1000 0.45 1.5 5.0 2.5 EEAFC1V6R8( ) 200 2000 12 5 7 120 0.950 1000 0.45 2.0 5.0 2.5 EEAFC1V120( ) 200 2000 18 4 11 120 1.300 1000 0.45 1.5 5.0 2.5 EEUFC1V180( ) 200 2000 22 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1V220( ) 200 2000 27 5 11 175 0.800 1000 0.50 2.0 5.0 2.5 EEUFC1V270( ) 200 2000 6.3 7 200 0.450 1000 0.45 2.5 5.0 2.5 EEAFC1V270( ) 200 2000 33 5 11 175 0.080 1000 0.50 2.0 5.0 2.5 EEUFC1V330( ) 200 2000 39 5 15 235 0.500 1000 0.50 2.0 5.0 2.5 EEUFC1V390( ) 200 2000 47 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1V470( ) 200 2000 56 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1V560( ) 200 2000 68 6.3 11.2 290 0.350 1000 0.50 2.5 5.0 2.5 EEUFC1V680( ) 200 2000 82 6.3 15 400 0.250 1000 0.50 2.5 5.0 2.5 EEUFC1V820( ) 200 2000 100 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1V101( ) 200 1000 120 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1V121( ) 200 1000 150 8 11.5 555 0.117 2000 0.60 3.5 5.0 EEUFC1V151( ) 200 1000 180 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1V181( ) 200 500 220 8 15 730 0.085 2000 0.60 3.5 5.0 EEUFC1V221L( ) 200 1000 10 12.5 755 0.090 3000 0.60 5.0 5.0 EEUFC1V221( ) 200 500 270 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1V271( ) 200 500 330 8 20 995 0.065 2000 0.60 3.5 5.0 EEUFC1V331L( ) 200 1000 10 16 1050 0.068 3000 0.60 5.0 5.0 EEUFC1V331( ) 200 500 390 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1V391( ) 200 500 12.5 15 1205 0.065 5000 0.60 5.0 5.0 EEUFC1V391S( ) 200 500 470 10 20 1220 0.052 3000 0.60 5.0 5.0 EEUFC1V471( ) 200 500 560 10 25 1440 0.045 3000 0.60 5.0 5.0 EEUFC1V561( ) 200 500 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1V561S( ) 200 500 680 10 30 1815 0.035 3000 0.60 5.0 EEUFC1V681L 100 12.5 20 1655 0.038 5000 0.60 5.0 5.0 EEUFC1V681( ) 200 500 16 15 1690 0.043 5000 0.80 7.5 7.5 EEUFC1V681S( ) 100 250 820 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1V821L( ) 200 500 18 15 2000 0.038 5000 0.80 7.5 7.5 EEUFC1V821( ) 100 250 1000 12.5 25 1945 0.030 5000 0.60 5.0 5.0 EEUFC1V102( ) 200 500 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1V102S( ) 100 250 1200 12.5 30 2310 0.025 5000 0.80 5.0 EEUFC1V122L 100 16 20 2205 0.029 5000 0.80 7.5 7.5 EEUFC1V122( ) 100 250 1500 12.5 35 2510 0.022 5000 0.80 5.0 EEUFC1V152L 100 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC1V152( ) 100 250 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC1V152S( ) 100 250 1800 12.5 40 2655 0.018 5000 0.80 5.0 EEUFC1V182L 100 16 25 2555 0.022 5000 0.80 7.5 7.5 EEUFC1V182( ) 100 250 18 20 2490 0.028 5000 0.80 7.5 7.5 EEUFC1V182S( ) 100 250 2200 16 31.5 3010 0.018 5000 0.80 7.5 EEUFC1V222 100 18 25 2740 0.020 5000 0.80 7.5 7.5 EEUFC1V222S( ) 100 250 2700 16 35.5 3150 0.016 5000 0.80 7.5 EEUFC1V272L 100 18 31.5 3635 0.016 5000 0.80 7.5 EEUFC1V272 50 3300 18 35.5 3680 0.015 5000 0.80 7.5 EEUFC1V332 50 3900 18 40 3735 0.014 5000 0.80 7.5 EEUFC1V392 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C φ4 to φ6.3=1000 h, φ8=2000 h, φ10=3000 h, φ12.5 to φ18=5000 h 00 Nov. 2012 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-70 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 50 1.0 5 11 20 2.400 1000 0.50 2.0 5.0 2.5 EEUFC1H1R0( )✽✽✽ 200 2000 2.2 5 11 45 1.800 1000 0.50 2.0 5.0 2.5 EEUFC1H2R2( ) 200 2000 3.3 5 11 65 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H3R3( ) 200 2000 4.7 5 11 95 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H4R7( ) 200 2000 10 4 11 90 2.500 1000 0.45 1.5 5.0 2.5 EEUFC1H100( ) 200 2000 5 11 125 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H100L( ) 200 2000 12 5 11 135 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H120( ) 200 2000 15 5 11 145 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H150( ) 200 2000 18 5 11 155 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H180( ) 200 2000 22 5 11 155 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1H220( ) 200 2000 27 5 15 215 0.900 1000 0.50 2.0 5.0 2.5 EEUFC1H270( ) 200 2000 33 6.3 11.2 260 0.600 1000 0.50 2.5 5.0 2.5 EEUFC1H330( ) 200 2000 39 6.3 11.2 260 0.600 1000 0.50 2.5 5.0 2.5 EEUFC1H390( ) 200 2000 47 6.3 11.2 260 0.600 1000 0.50 2.5 5.0 2.5 EEUFC1H470( ) 200 2000 56 6.3 15 360 0.400 1000 0.50 2.5 5.0 2.5 EEUFC1H560( ) 200 2000 68 8 11.5 485 0.234 2000 0.60 3.5 5.0 EEUFC1H680( ) 200 1000 82 8 11.5 485 0.234 2000 0.60 3.5 5.0 EEUFC1H820( ) 200 1000 100 10 12.5 615 0.162 3000 0.60 5.0 5.0 EEUFC1H101( ) 200 500 120 8 15 635 0.155 2000 0.60 3.5 5.0 EEUFC1H121L( ) 200 1000 10 12.5 615 0.162 3000 0.60 5.0 5.0 EEUFC1H121( ) 200 500 150 10 16 850 0.119 3000 0.60 5.0 5.0 EEUFC1H151( ) 200 500 180 8 20 860 0.120 2000 0.60 3.5 5.0 EEUFC1H181L( ) 200 1000 10 16 850 0.119 3000 0.60 5.0 5.0 EEUFC1H181( ) 200 500 220 10 20 1030 0.090 3000 0.60 5.0 5.0 EEUFC1H221( ) 200 500 12.5 15 1150 0.110 5000 0.60 5.0 5.0 EEUFC1H221S( ) 200 500 270 10 25 1200 0.082 3000 0.60 5.0 5.0 EEUFC1H271( ) 200 500 330 10 30 1610 0.060 3000 0.60 5.0 EEUFC1H331L 100 12.5 20 1480 0.063 5000 0.60 5.0 5.0 EEUFC1H331( ) 200 500 390 12.5 20 1480 0.063 5000 0.60 5.0 5.0 EEUFC1H391( ) 200 500 16 15 1610 0.080 5000 0.80 7.5 7.5 EEUFC1H391S( ) 100 250 470 10 30 1610 0.060 3000 0.60 5.0 EEUFC1H471L 100 12.5 25 1832 0.050 5000 0.60 5.0 5.0 EEUFC1H471( ) 200 500 560 12.5 25 1832 0.050 5000 0.60 5.0 5.0 EEUFC1H561( ) 200 500 18 15 1900 0.068 5000 0.80 7.5 7.5 EEUFC1H561S( ) 100 250 680 12.5 30 2215 0.040 5000 0.80 5.0 EEUFC1H681L 100 16 20 1835 0.048 5000 0.80 7.5 7.5 EEUFC1H681( ) 100 250 820 12.5 35 2285 0.034 5000 0.80 5.0 EEUFC1H821L 100 18 20 2420 0.042 5000 0.80 7.5 7.5 EEUFC1H821( ) 100 250 1000 12.5 40 2590 0.030 5000 0.80 5.0 EEUFC1H102L 100 16 25 2235 0.034 5000 0.80 7.5 7.5 EEUFC1H102( ) 100 250 1200 16 31.5 2700 0.028 5000 0.80 7.5 EEUFC1H122 100 18 25 2610 0.029 5000 0.80 7.5 7.5 EEUFC1H122S( ) 100 250 1500 16 35.5 2790 0.025 5000 0.80 7.5 EEUFC1H152L 100 1800 16 40 2845 0.023 5000 0.80 7.5 EEUFC1H182L 100 18 31.5 3000 0.025 5000 0.80 7.5 EEUFC1H182 50 2200 18 35.5 3100 0.023 5000 0.80 7.5 EEUFC1H222 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. ✽✽✽ Please kindly accept last shipment : 31/Mar/2015 Endurance : 105 °C 04 to 06.3=1000 h, 08=2000 h, 010=3000 h, 012.5 to 018=5000 h 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-71 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 63 6.8 4 11 80 3.500 1000 0.45 1.5 5.0 2.5 EEUFC1J6R8( ) 200 2000 12 5 11 145 2.000 1000 0.50 2.0 5.0 2.5 EEUFC1J120( ) 200 2000 18 5 15 200 1.300 1000 0.50 2.0 5.0 2.5 EEUFC1J180( ) 200 2000 22 6.3 11.2 240 1.000 1000 0.50 2.5 5.0 2.5 EEUFC1J220( ) 200 2000 33 6.3 11.2 240 1.000 1000 0.50 2.5 5.0 2.5 EEUFC1J330( ) 200 2000 39 6.3 15 330 0.700 1000 0.50 2.5 5.0 2.5 EEUFC1J390( ) 200 2000 47 8 11.5 405 0.342 2000 0.60 3.5 5.0 EEUFC1J470( ) 200 1000 56 8 11.5 405 0.342 2000 0.60 3.5 5.0 EEUFC1J560( ) 200 1000 68 8 11.5 405 0.342 2000 0.60 3.5 5.0 EEUFC1J680( ) 200 1000 82 10 12.5 535 0.256 3000 0.60 5.0 5.0 EEUFC1J820( ) 200 500 100 8 15 535 0.230 2000 0.60 3.5 5.0 EEUFC1J101L( ) 200 1000 10 12.5 535 0.256 3000 0.60 5.0 5.0 EEUFC1J101( ) 200 500 120 10 16 600 0.194 3000 0.60 5.0 5.0 EEUFC1J121( ) 200 500 150 8 20 690 0.178 2000 0.60 3.5 5.0 EEUFC1J151( ) 200 1000 180 10 20 885 0.147 3000 0.60 5.0 5.0 EEUFC1J181( ) 200 500 12.5 15 1020 0.150 5000 0.60 5.0 5.0 EEUFC1J181S( ) 200 500 220 10 20 885 0.147 3000 0.60 5.0 5.0 EEUFC1J221X( ) 200 500 10 25 1050 0.130 3000 0.60 5.0 5.0 EEUFC1J221( ) 200 500 12.5 20 1285 0.085 5000 0.60 5.0 5.0 EEUFC1J221S( ) 200 500 270 16 15 1410 0.090 5000 0.80 7.5 7.5 EEUFC1J271( ) 100 250 330 10 30 1300 0.090 3000 0.60 5.0 EEUFC1J331L 100 12.5 20 1285 0.085 5000 0.60 5.0 5.0 EEUFC1J331( ) 200 500 390 12.5 25 1720 0.070 5000 0.60 5.0 5.0 EEUFC1J391( ) 200 500 18 15 1690 0.086 5000 0.80 7.5 7.5 EEUFC1J391S( ) 100 250 470 12.5 30 2090 0.055 5000 0.80 5.0 EEUFC1J471L 100 16 20 1765 0.059 5000 0.80 7.5 7.5 EEUFC1J471( ) 100 250 560 16 25 2160 0.050 5000 0.80 7.5 7.5 EEUFC1J561( ) 100 250 680 12.5 35 2265 0.047 5000 0.80 5.0 EEUFC1J681L 100 16 25 2160 0.050 5000 0.80 7.5 7.5 EEUFC1J681( ) 100 250 18 20 2290 0.055 5000 0.80 7.5 7.5 EEUFC1J681S( ) 100 250 820 12.5 40 2560 0.042 5000 0.80 5.0 EEUFC1J821L 100 16 31.5 2670 0.043 5000 0.80 7.5 EEUFC1J821 100 18 25 2585 0.043 5000 0.80 7.5 7.5 EEUFC1J821S( ) 100 250 1000 16 31.5 2670 0.043 5000 0.80 7.5 EEUFC1J102U 100 16 35.5 2770 0.036 5000 0.80 7.5 EEUFC1J102 100 1200 16 40 2825 0.030 5000 0.80 7.5 EEUFC1J122L 100 18 31.5 2950 0.032 5000 0.80 7.5 EEUFC1J122 50 1500 18 35.5 3095 0.030 5000 0.80 7.5 EEUFC1J152 50 1800 18 40 3205 0.025 5000 0.80 7.5 EEUFC1J182 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C 04 to 06.3=1000 h, 08=2000 h, 010=3000 h, 012.5 to 018=5000 h 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ FC – EEE-72 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (100 kHz) (+105 °C) Impedance (100 kHz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽H (V) (μF) (mm) (mm) (mA r.m.s.) (Ω) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 100 5.6 5 11 80 4.10 1000 0.5 2.0 5.0 2.5 EEUFC2A5R6( ) 200 2000 8.2 5 15 90 2.80 1000 0.5 2.0 5.0 2.5 EEUFC2A8R2( ) 200 2000 12 6.3 11.2 114 1.80 1000 0.5 2.5 5.0 2.5 EEUFC2A120( ) 200 2000 18 6.3 15 155 1.10 1000 0.5 2.5 5.0 2.5 EEUFC2A180( ) 200 2000 22 8 11.5 260 0.680 2000 0.6 3.5 5.0 EEUFC2A220( ) 200 1000 33 8 15 340 0.450 2000 0.6 3.5 5.0 EEUFC2A330L( ) 200 1000 10 12.5 306 0.530 3000 0.6 5.0 5.0 EEUFC2A330( ) 200 500 39 8 20 455 0.330 2000 0.6 5.0 5.0 EEUFC2A390L( ) 200 1000 10 16 400 0.360 3000 0.6 5.0 5.0 EEUFC2A390( ) 200 500 56 10 20 463 0.240 3000 0.6 5.0 5.0 EEUFC2A560( ) 200 500 68 10 25 599 0.210 3000 0.6 5.0 5.0 EEUFC2A680L( ) 200 500 12.5 15 511 0.230 5000 0.6 5.0 5.0 EEUFC2A680( ) 200 500 100 10 30 698 0.150 3000 0.6 5.0 EEUFC2A101L 100 12.5 20 671 0.180 5000 0.6 5.0 5.0 EEUFC2A101( ) 200 500 120 16 15 793 0.140 5000 0.8 7.5 7.5 EEUFC2A121S( ) 100 250 150 12.5 25 807 0.110 5000 0.6 5.0 5.0 EEUFC2A151( ) 200 500 18 15 917 0.120 5000 0.8 7.5 7.5 EEUFC2A151S( ) 100 250 180 12.5 30 937 0.098 5000 0.8 5.0 EEUFC2A181L 100 16 20 995 0.110 5000 0.8 7.5 7.5 EEUFC2A181( ) 100 250 220 12.5 35 1040 0.087 5000 0.8 5.0 EEUFC2A221L 100 16 25 1170 0.089 5000 0.8 7.5 7.5 EEUFC2A221( ) 100 250 270 12.5 40 1130 0.072 5000 0.8 5.0 EEUFC2A271L 100 18 20 1230 0.080 5000 0.8 7.5 7.5 EEUFC2A271S( ) 100 250 330 16 31.5 1520 0.062 5000 0.8 7.5 EEUFC2A331 100 18 25 1420 0.070 5000 0.8 7.5 7.5 EEUFC2A331S( ) 100 250 390 16 35.5 1730 0.053 5000 0.8 7.5 EEUFC2A391L 100 18 31.5 1600 0.062 5000 0.8 7.5 EEUFC2A391 50 470 16 40 1920 0.047 5000 0.8 7.5 EEUFC2A471 100 560 18 35.5 1770 0.041 5000 0.8 7.5 EEUFC2A561 50 680 18 40 2300 0.036 5000 0.8 7.5 EEUFC2A681 50 · When requesting taped product, please put the letter "B" or "H" be tween the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, H=2.5 mm. · Please refer to the page of “Taping Dimensions”. Endurance : 105 °C 04 to 06.3=1000 h, 08=2000 h, 010=3000 h, 012.5 to 018=5000 h 01 Oct. 2013 Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Plastic Film Capacitors Metallized Polypropylene Film Capacitors Type: EZPE Series ■Features •High safety, Self-healing and Self-protecting function built-in •Long product life, High reliability •Low loss, Low ESR •Flame retardant (Case and sealing resin) •RoHS directive compliant ■Recommended Applications For DC filtering, DC link circuit •Solar inverters •Wind power generation •Industrial power supplies •Inverter circuit in appliances (Air Conditioners etc.) ■Construction •Dielectric : Polypropylene film •Electrodes : Metallized dielectric with segmented pattern •Plastic case : UL94 V-0 •Sealing : UL94 V-0 •Terminals : Tinned wires,2-pin and 4-pin versions ■Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 11 12 E Z P E Product code Dielectric & construction Rated voltage Capacitance T Pin type Suffix A Suffix 50 500 VDC 80 800 VDC 1B 1100 VDC 1D 1300 VDC L 2-pin type M 4-pin type ■Specifications Category temperature range (TC) (*1) Rated voltage(VR) (*2) Rated capacitance (CR) Capacitance tolerance Withstanding DC voltage Insulation resistance (CR) –40 °C to +85 °C 500 VDC, 800 VDC, 1100 VDC, 1300 VDC (Derating of rated voltage by more than 70 °C (*3)) 500 VDC 800 VDC 1100 VDC 1300 VDC 10 μF to 110 μF 10 μF to 60 μF 10 μF to 40 μF 10 μF to 25 μF ±10 % Between terminals:Rated voltage. (VDC)✕150 % 10 s Terminal to case:2110 VAC 10 s CR>=10000 Ω · F (20 °C, 500 VDC, 60 s) *1:The temperature of capacitor surface (case) *2:Use for DC voltage only *3:Refer to the page of “ DC voltage derating ” Metallized Film Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Plastic Film Capacitors ■Dimensions in mm (not to scale) ■Rating, Dimensions & Quantity / Ammo Box ●Type EZPE Rated voltage : 500 VDC at 70 ( 450VDC at 85 ) EZPE50106LTA 10 20 42 41.5 37.5 - 1.2 21 210 5.0 22.0 0.28 45 EZPE50156LTA 15 20 42 41.5 37.5 - 1.2 21 315 7.5 14.8 0.28 45 EZPE50206LTA 20 20 42 41.5 37.5 - 1.2 21 420 9.5 11.0 0.28 44 EZPE50256LTA 25 20 42 41.5 37.5 - 1.2 21 525 11.0 8.8 0.28 43 EZPE50306MTA 30 20 42 41.5 37.5 10.2 1.2 21 630 12.5 7.0 0.28 43 EZPE50356MTA 35 30 51 41.5 37.5 10.2 1.2 21 735 13.5 6.2 0.28 83 EZPE50406MTA 40 30 51 41.5 37.5 10.2 1.2 21 840 14.5 5.4 0.28 82 EZPE50456MTA 45 30 51 41.5 37.5 10.2 1.2 21 945 15.2 4.9 0.28 81 EZPE50506MTA 50 30 51 41.5 37.5 20.3 1.2 21 1050 16.0 4.4 0.28 80 EZPE50556MTA 55 30 51 41.5 37.5 20.3 1.2 21 1155 16.3 4.1 0.28 79 EZPE50606MTA 60 30 51 41.5 37.5 20.3 1.2 21 1260 16.5 3.9 0.28 77 EZPE50656MTA 65 30 51 57.5 52.5 10.2 1.2 14 910 15.0 6.8 0.44 111 EZPE50706MTA 70 30 51 57.5 52.5 10.2 1.2 14 980 15.5 6.5 0.44 109 EZPE50756MTA 75 30 51 57.5 52.5 20.3 1.2 14 1050 16.0 6.0 0.44 108 EZPE50806MTA 80 30 51 57.5 52.5 20.3 1.2 14 1120 16.5 5.7 0.44 106 EZPE50856MTA 85 35 56 57.5 52.5 20.3 1.2 14 1190 16.7 5.4 0.44 142 EZPE50906MTA 90 35 56 57.5 52.5 20.3 1.2 14 1260 17.0 5.1 0.44 141 EZPE50956MTA 95 35 56 57.5 52.5 20.3 1.2 14 1330 17.5 4.9 0.44 140 EZPE50107MTA 100 35 56 57.5 52.5 20.3 1.2 14 1400 18.0 4.7 0.44 139 EZPE50117MTA 110 35 56 57.5 52.5 20.3 1.2 14 1540 18.5 4.4 0.44 138 Part No. Dimensions (mm) Permissible current W H L P1 P2 600 400 200 ESRtyp [m] (*3) tan [%] (*4) Mass [] MOQ [pcs] (*5) dv/dt [V/μs] Peak Current [Ao-p] (*1) RMS Current [Arms] (*2) CR. (μF) *1:When rising temperature of capacitor surface by continuous peak current (included pulse current), use within limit specified for temperature of capacitor surface and self heating temperature rise. *2:Maximum RMS current @ 70 , 10 kHz Use within limit for self heating temperature rise at capacitor surface. *3:Typical values @ 20, 10 kHz ESR : less than 2.5 ESRtyp *4:Maximum dissipation factor @20, 1 kHz *5:Minimum order quantity consists of 4 packing units. Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. Plastic Film Capacitors ■Rating, Dimensions & Quantity / Ammo Box ●Type EZPE Rated voltage : 800 VDC at 70 ( 700VDC at 85 ) EZPE80106LTA 10 20 42 41.5 37.5 - 1.2 22 220 7.0 15.8 0.22 44 EZPE80156MTA 15 20 42 41.5 37.5 10.2 1.2 22 330 9.0 10.5 0.22 43 EZPE80206MTA 20 30 51 41.5 37.5 10.2 1.2 22 440 11.0 7.7 0.22 82 EZPE80256MTA 25 30 51 41.5 37.5 10.2 1.2 22 550 13.0 6.4 0.22 80 EZPE80306MTA 30 30 51 41.5 37.5 20.3 1.2 22 660 15.0 5.3 0.22 78 EZPE80356MTA 35 30 51 57.5 52.5 10.2 1.2 15 525 12.0 9.7 0.33 110 EZPE80406MTA 40 30 51 57.5 52.5 20.3 1.2 15 600 13.0 8.3 0.33 107 EZPE80456MTA 45 30 51 57.5 52.5 20.3 1.2 15 675 14.0 7.0 0.33 104 EZPE80506MTA 50 35 56 57.5 52.5 20.3 1.2 15 750 15.0 6.3 0.33 140 EZPE80556MTA 55 35 56 57.5 52.5 20.3 1.2 15 825 16.0 5.9 0.33 138 EZPE80606MTA 60 35 56 57.5 52.5 20.3 1.2 15 900 17.0 5.6 0.33 136 Part No. Dimensions (mm) Permissible current W H L P1 P2 600 400 200 ESRtyp [m] (*3) tan [%] (*4) Mass [] MOQ [pcs] (*5) dv/dt [V/μs] Peak Current [Ao-p] (*1) RMS Current [Arms] (*2) CR. (μF) ●Type EZPE Rated voltage : 1100 VDC at 70 ( 920VDC at 85 ) EZPE1B106MTA 10 20 42 41.5 37.5 10.2 1.2 54 540 7.0 12.3 0.20 43 EZPE1B156MTA 15 30 51 41.5 37.5 10.2 1.2 54 810 8.5 8.2 0.20 80 EZPE1B206MTA 20 30 51 41.5 37.5 20.3 1.2 54 1080 10.0 6.3 0.20 76 EZPE1B256MTA 25 30 51 57.5 52.5 10.2 1.2 35 875 8.0 10.7 0.28 107 EZPE1B306MTA 30 30 51 57.5 52.5 20.3 1.2 35 1050 9.0 8.5 0.28 103 EZPE1B356MTA 35 35 56 57.5 52.5 20.3 1.2 35 1225 10.0 7.2 0.28 137 EZPE1B406MTA 40 35 56 57.5 52.5 20.3 1.2 35 1400 11.0 6.5 0.28 134 Part No. Dimensions (mm) Permissible current W H L P1 P2 600 400 200 ESRtyp [m] (*3) tan [%] (*4) Mass [] MOQ [pcs] (*5) dv/dt [V/μs] Peak Current [Ao-p] (*1) RMS Current [Arms] (*2) CR. (μF) ●Type EZPE Rated voltage : 1300 VDC at 70 ( 1100VDC at 85 ) EZPE1D106MTA 10 30 51 41.5 37.5 10.2 1.2 73 730 12.0 10.0 0.17 80 EZPE1D156MTA 15 30 51 57.5 52.5 10.2 1.2 50 750 10.0 14.5 0.22 109 EZPE1D206MTA 20 30 51 57.5 52.5 20.3 1.2 50 1000 14.0 11.1 0.22 103 EZPE1D256MTA 25 35 56 57.5 52.5 20.3 1.2 50 1250 17.0 8.5 0.22 136 Part No. Dimensions (mm) Permissible current W H L P1 P2 400 200 ESRtyp [m] (*3) tan [%] (*4) Mass [] MOQ [pcs] (*5) dv/dt [V/μs] Peak Current [Ao-p] (*1) RMS Current [Arms] (*2) CR. (μF) *1:When rising temperature of capacitor surface by continuous peak current (included pulse current), use within limit specified for temperature of capacitor surface and self heating temperature rise. *2:Maximum RMS current @ 70 , 10 kHz Use within limit for self heating temperature rise at capacitor surface. *3:Typical values @ 20, 10 kHz ESR : less than 2.5 ESRtyp *4:Maximum dissipation factor @20, 1 kHz *5:Minimum order quantity consists of 4 packing units. Metallized Film Plastic Film Capacitors Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. ■Permissible Conditions ●Permissible Voltage ・These capacitors are designed only for DC voltage, so should not be used for AC line. ・Use the peak voltage (Vo-p) within the rated voltage. ・Use the peak to peak voltage (Vp-p) within 0.2 x VR . ●DC Voltage, Peak current and RMS current derating Derating of voltage (Vo-p), RMS current (Arms), and peak current (Ao-p) according to the following diagram when the temperature of the capacitor surface exceeds 70 ℃. ●Permissible self heating temperature rise ●Total cycles applied peak current 60 65 70 75 80 85 90 95 100 Voltage ① Voltage ② Permissible voltage (Vo-p) Temperature of capacitor surface TC (℃) DC Voltage derating Percentage to the permissible current (%) Current derating Temperature of capacitor surface TC (℃) Total cycles applied peak current (Ao-p) (including pulse current) are within following diagram. Permissible self heating temperature rise is within following diagram when the temperature of the capacitor surface exceeds 70 ℃. Please consult Panasonic if your condition exceeds the above spec. Vp-p = 0.2 × VR VR ≧ Vo-p Vo 0% 20% 40% 60% 80% 100% 120% 60 65 70 75 80 85 90 95 100 Part Number Voltage ① Voltage ② EZPE50 □□□□ TA DC500V DC450V EZPE80 □□□□ TA DC800V DC700V EZPE1B □□□□ TA DC1100V DC920V EZPE1D □□□□ TA DC1300V DC1100V Total cycles Percentage to the permissible peak current (%) Permissible self temp. rise（℃） Temperature of capacitor surface TC (℃) 0% 20% 40% 60% 80% 100% 120% 60 65 70 75 80 85 90 95 100 0% 20% 40% 60% 80% 100% 10 100 1000 10000 100000 Part Number 100% at70℃ 36% at85℃ EZPE50 □□□□ TA 12 ℃ 4.3 ℃ EZPE80 □□□□ TA 10 ℃ 3.6 ℃ EZPE1B □□□□ TA 5 ℃ 1.8 ℃ EZPE1D □□□□ TA 9 ℃ 3.2 ℃ Plastic Film Capacitors Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. ■Characteristics ＜Reference＞ ●Type EZPE Rated voltage : 500 VDC at 70 ℃ ( 450VDC at 85 ℃ ) ●Temperature Characteristics ●Frequency Characteristics ●Lifetime expectancy -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 120 ⊿C/C (%) Temperature (℃) Capacitance (typical curve) at 1kHz 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -60 -40 -20 0 20 40 60 80 100 120 60uF 20uF 110uF 100uF Dissipation factor (typical curve) tanδ (%) Temperature (℃) at 1kHz 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 -60 -40 -20 0 20 40 60 80 100 120 C･R (Ω･F) Temperature (℃) at 500VDC Insulation resistance (typical curve) Impedance vs. Frequency (typical curve) Impedance (Ω) Frequency (kHz) Permissible voltage (Vo-p) Lifetime expectancy (h) Lifetime expectancy (Reference) * Life time : Reach ⊿C/C = - 10 % , Judgement of Panasonic * 105℃ : Not guarantee voltage 0.001 0.01 0.1 1 10 100 1 10 100 1000 10000 20uF 60uF 110uF 200 250 300 350 400 450 500 550 1000 10000 100000 1000000 Tc=85℃ Tc=105℃ (I=0Arms) Tc=70℃ Unpredictable life time area Plastic Film Capacitors Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. ■Characteristics ＜Reference＞ ●Type EZPE Rated voltage : 800 VDC at 70 ℃ ( 700VDC at 85 ℃ ) ●Temperature Characteristics ●Frequency Characteristics ●Lifetime expectancy -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 120 ⊿C/C (%) Temperature (℃) Capacitance (typical curve) at 1kHz 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -60 -40 -20 0 20 40 60 80 100 120 30uF 10uF 60uF 45uF Dissipation factor (typical curve) tanδ (%) Temperature (℃) at 1kHz 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 -60 -40 -20 0 20 40 60 80 100 120 C･R (Ω･F) Temperature (℃) at 500VDC Insulation resistance (typical curve) 0.001 0.01 0.1 1 10 100 1 10 100 1000 10000 30uF 10uF 45uF 60uF Impedance vs. Frequency (typical curve) Impedance (Ω) Frequency (kHz) 300 400 500 600 700 800 900 1000 10000 100000 1000000 Tc=85℃ Tc=105℃ (I=0Arms) Tc=70℃ Unpredictable life time area Permissible voltage (Vo-p) Lifetime expectancy (h) Lifetime expectancy (Reference) * Life time : Reach ⊿C/C = - 10 % , Judgement of Panasonic * 105℃ : Not guarantee voltage Plastic Film Capacitors Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. ■Characteristics ＜Reference＞ ●Type EZPE Rated voltage : 1100 VDC at 70 ℃ ( 920VDC at 85 ℃ ) ●Temperature Characteristics ●Frequency Characteristics ●Lifetime expectancy at 1kHz 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -60 -40 -20 0 20 40 60 80 100 120 20uF 10uF 40uF Dissipation factor (typical curve) tanδ (%) Temperature (℃) -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 120 ⊿C/C (%) Temperature (℃) Capacitance (typical curve) at 1kHz 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 -60 -40 -20 0 20 40 60 80 100 120 C･R (Ω･F) Temperature (℃) at 500VDC Insulation resistance (typical curve) 0.001 0.01 0.1 1 10 100 1 10 100 1000 10000 20uF 10uF 40uF Impedance vs. Frequency (typical curve) Impedance (Ω) Frequency (kHz) 400 500 600 700 800 900 1000 1100 1200 1000 10000 100000 1000000 Unpredictable life time area Tc=85℃ Tc=105℃ ( I = 0Arms) Tc=70℃ Permissible voltage (Vo-p) Lifetime expectancy (h) Lifetime expectancy (Reference) * Life time : Reach ⊿C/C = - 10 % , Judgement of Panasonic * 105℃ : Not guarantee voltage Plastic Film Capacitors Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail. ■Characteristics ＜Reference＞ ●Type EZPE Rated voltage : 1300 VDC at 70 ℃ ( 1100VDC at 85 ℃ ) ●Temperature Characteristics ●Frequency Characteristics ●Lifetime expectancy -10 -5 0 5 10 -60 -40 -20 0 20 40 60 80 100 120 ⊿C/C (%) Temperature (℃) Capacitance (typical curve) at 1kHz Dissipation factor (typical curve) tanδ (%) Temperature (℃) at 1kHz 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 -60 -40 -20 0 20 40 60 80 100 120 C･R (Ω･F) Temperature (℃) at 500VDC Insulation resistance (typical curve) Impedance vs. Frequency (typical curve) Impedance (Ω) Frequency (kHz) Permissible voltage (Vo-p) Lifetime expectancy (h) 500 600 700 800 900 1000 1100 1200 1300 1400 1000 10000 100000 1000000 Unpredictable life time area Tc=85℃ Tc=105℃ (I=0Arms) Tc=70℃ 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -60 -40 -20 0 20 40 60 80 100 120 25uF 15uF 10uF 0.001 0.01 0.1 1 10 100 1 10 100 1000 10000 10uF 15uF 25uF Lifetime expectancy (Reference) * Life time : Reach ⊿C/C = - 10 % , Judgement of Panasonic * 105℃ : Not guarantee voltage Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AYF33 ACCTB47E 201303-T ORDERING INFORMATION For FPC Y3B/Y3BW Series FPC connectors (0.3mm pitch) Back lock Y3BW is added. FEATURES 1. Slim and low profile design (Pitch: 0.3 mm) Back lock type and the slim body with a 3.15 mm depth (with the lever). 2. Mechanical design freedom is achieved with double top and bottom contacts Top and bottom double contacts eliminate the need of using different connectors (with either top or bottom contacts) depending on the FPC wiring conditions. 3. Easy-to-handle back lock structure 4. Man-hours of assembly time can be reduced by delivering the connectors with their levers opened. 5. Wiring patterns can be placed underneath the connector. 6. Ni barrier with high resistance to solder creepage 7. Y3BW features advanced functionality, including a structure to temporarily hold the FPC and a higher holding force. The FPC holding contacts located on both ends of the connector facilitate positioning of FPC and further enhance the FPC holding force. (1) The inserted FPC can be temporarily held until the lever is closed. (2) When the lever is closed, the holding contacts lock the FPC by its notches, enhancing the FPC holding force. APPLICATIONS Mobile devices, such as cellular phones, smartphones, digital still cameras and digital video cameras. Y3B Y3BW RoHS compliant Unit: mm 0.9 3.15 Structure to lock notches on both ends of the FPC with holding contacts Applicable FPC shapes New 33: FPC Connector 0.3 mm pitch (Back lock) AYF 3 3 5 Number of pins (2 digits) Contact direction 3: Top and bottom double contacts (Y3B) 6: Top and bottom double contacts, lock holding type (Y3BW) Surface treatment (Contact portion / Terminal portion) 5: Au plating/Au plating (Ni barrier) Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/ GN (AGN) ASCTB13E 201209-T ORDERING INFORMATION High Sensitivity, with 100mW nominal operating power, in a compact and space saving case GN RELAYS (AGN) RoHS compliant FEATURES 1. Compact slim body saves space Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the packaging density can be increased to allow for much smaller designs. 2. High sensitivity single side stable type (Nominal operating power: 100mW) is available 3. Outstanding surge resistance. Surge breakdown voltage between contacts and coil: 2,500 V 2×10 μs (Telcordia) Surge breakdown voltage between open contacts: 1,500 V 10×160 μs (FCC part 68) 4. The use of twin crossbar contacts ensures high contact reliability. AgPd contact is used because of its good sulfide resistance. Adopting lowgas molding material. Coil assembly molding technology which avoids generating volatile gas from coil. 5. Increased packaging density Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before. 6. Nominal operating power: 140 mW 7. Outstanding vibration and shock resistance. Functional shock resistance: 750 m/s2 Destructive shock resistance: 1,000 m/s2 Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch) Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch) 8. Sealed construction allows automatic washing. TYPICAL APPLICATIONS 1. Telephonic equipment 2. Telecommunications equipment 3. Security equipment 4. Test and Measurement equipment 5. Electronic Consumer and Audio Visual equipment Nominal coil voltage (DC) 1H: 1.5V 03: 3V 4H: 4.5V 06: 6V 09: 9V 12: 12V 24: 24V Contact arrangement 2: 2 Form C Type of operation 0: Standard type (B.B.M.) AGN 2 0 Operating function 0: Single side stable 1: 1 coil latching 6: High sensitivity single side stable type Terminal shape Nil: A: S: Standard PC board terminal Surface-mount terminal A type Surface-mount terminal S type Packing style Nil: X: Z: Tube packing Tape and reel packing (picked from 1/2/3/4 pin side) Tape and reel packing (picked from 5/6/7/8 pin side) Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ NHG – EEE-99 – 05 to 08 0D±0.5 0d±0.05 F±0.5 Sleeve L 14 min. 3 min. L16 : L±1.0 L20 : L±2.0 Pressure relief 06.3 + – 010 0D±0.5 ■ Features ● Endurance : 105 °C 1000 h to 2000 h ● RoHS directive compliant Radial Lead Type Series: NHG Type: A ■ Specifi cations Category Temp. Range –55 °C to +105 °C –25 °C to +105 °C Rated W.V. Range 6.3 V.DC to 100 V.DC 160 V.DC to 450 V.DC Nominal Cap. Range 2.2 μF to 22000 μF 1 μF to 330 μF Capacitance Tolerance ±20 % (120 Hz/+20 °C) DC Leakage Cur rent I < 0.01 CV or 3 (μA) After 2 minutes (Which is greater) I < 0.06 CV +10 (μA) After 2 minutes tan d Please see the attached standard products list Endurance After following life test with DC voltage and +105 °C±2 °C ripple current value applied (The sum of DC and ripple peak voltage shall not exceed the rated working voltage), When the capacitors are restored to 20 °C, the capacitors shall meet the limits specifi ed below. Duration : 6.3 V.DC to 100 V.DC : (05 to 08)=1000 hours, (010 to 018)=2000 hours 160 V.DC to 450 V.DC : 2000 hours Capacitance change ±20 % of initial measured value tan d < 200 % of initial specifi ed value DC leakage current < initial specifi ed value Shelf Life After storage for 1000 hours at +105 °C±2 °C with no voltage applied and then being stabilized at +20 °C, capacitors shall meet the limits specifi ed in Endurance. (With voltage treatment) ■ Di men sions in mm (not to scale) W.V.(V.DC) Cap. (μF) Frequency (Hz) 60 120 1 k 10 k 100 k 6.3 to 100 2.2 to 33 0.75 1.00 1.55 1.80 2.00 47 to 470 0.80 1.00 1.35 1.50 1.50 1000 to 22000 0.85 1.00 1.10 1.15 1.15 160 to 450 1 to 330 0.80 1.00 1.35 1.50 1.50 ■ Frequency correction factor for ripple current Body Dia. 0D 5 6.3 8 10 12.5 16 18 Lead Dia. 0d 0.5 0.5 0.6 0.6 0.6 0.8 0.8 Lead space F 2.0 2.5 3.5 5.0 5.0 7.5 7.5 (Unit : mm) 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ NHG – EEE-100 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (120 Hz) (+105 °C) tan d (120 Hz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽i (V) (μF) (mm) (mm) (mA r.m.s.) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 6.3 220 5 11 140 0.28 1000 0.5 2.0 5.0 2.5 ECA0JHG221( ) 200 2000 470 6.3 11.2 230 0.28 1000 0.5 2.5 5.0 2.5 ECA0JHG471( ) 200 2000 1000 8 11.5 380 0.28 1000 0.6 3.5 5.0 ECA0JHG102( ) 200 1000 2200 10 16 710 0.30 2000 0.6 5.0 5.0 ECA0JHG222( ) 200 500 3300 10 20 840 0.32 2000 0.6 5.0 5.0 ECA0JHG332( ) 200 500 4700 12.5 20 1090 0.34 2000 0.6 5.0 5.0 ECA0JHG472( ) 200 500 6800 12.5 25 1350 0.38 2000 0.6 5.0 5.0 ECA0JHG682( ) 200 500 10000 16 25 1650 0.46 2000 0.8 7.5 7.5 ECA0JHG103( ) 100 250 15000 16 31.5 2010 0.56 2000 0.8 7.5 ECA0JHG153 100 22000 18 35.5 2350 0.70 2000 0.8 7.5 ECA0JHG223 50 10 330 6.3 11.2 200 0.24 1000 0.5 2.5 5.0 2.5 ECA1AHG331( ) 200 2000 470 8 11.5 250 0.24 1000 0.6 3.5 5.0 ECA1AHG471( ) 200 1000 1000 10 12.5 460 0.24 2000 0.6 5.0 5.0 ECA1AHG102( ) 200 500 2200 10 20 760 0.26 2000 0.6 5.0 5.0 ECA1AHG222( ) 200 500 3300 12.5 20 1000 0.28 2000 0.6 5.0 5.0 ECA1AHG332( ) 200 500 4700 12.5 25 1260 0.30 2000 0.6 5.0 5.0 ECA1AHG472( ) 200 500 6800 16 25 1570 0.34 2000 0.8 7.5 7.5 ECA1AHG682( ) 100 250 10000 16 31.5 1890 0.42 2000 0.8 7.5 ECA1AHG103 100 15000 18 35.5 2180 0.52 2000 0.8 7.5 ECA1AHG153 50 16 100 5 11 110 0.20 1000 0.5 2.0 5.0 2.5 ECA1CHG101( ) 200 2000 220 6.3 11.2 180 0.20 1000 0.5 2.5 5.0 2.5 ECA1CHG221( ) 200 2000 330 8 11.5 260 0.20 1000 0.6 3.5 5.0 ECA1CHG331( ) 200 1000 470 8 11.5 310 0.20 1000 0.6 3.5 5.0 ECA1CHG471( ) 200 1000 1000 10 16 560 0.20 2000 0.6 5.0 5.0 ECA1CHG102( ) 200 500 2200 12.5 20 920 0.22 2000 0.6 5.0 5.0 ECA1CHG222( ) 200 500 3300 12.5 25 1170 0.24 2000 0.6 5.0 5.0 ECA1CHG332( ) 200 500 4700 16 25 1480 0.26 2000 0.8 7.5 7.5 ECA1CHG472( ) 100 250 6800 16 31.5 1780 0.30 2000 0.8 7.5 ECA1CHG682 100 10000 18 35.5 2060 0.38 2000 0.8 7.5 ECA1CHG103 50 25 47 5 11 91 0.16 1000 0.5 2.0 5.0 2.5 ECA1EHG470( ) 200 2000 100 6.3 11.2 130 0.16 1000 0.5 2.5 5.0 2.5 ECA1EHG101( ) 200 2000 220 8 11.5 230 0.16 1000 0.6 3.5 5.0 ECA1EHG221( ) 200 1000 330 8 11.5 310 0.16 1000 0.6 3.5 5.0 ECA1EHG331( ) 200 1000 470 10 12.5 380 0.16 2000 0.6 5.0 5.0 ECA1EHG471( ) 200 500 1000 10 20 680 0.16 2000 0.6 5.0 5.0 ECA1EHG102( ) 200 500 2200 12.5 25 1090 0.18 2000 0.6 5.0 5.0 ECA1EHG222( ) 200 500 3300 16 25 1400 0.20 2000 0.8 7.5 7.5 ECA1EHG332( ) 100 250 4700 16 31.5 1750 0.22 2000 0.8 7.5 ECA1EHG472 100 6800 18 35.5 2040 0.26 2000 0.8 7.5 ECA1EHG682 50 35 47 5 11 90 0.14 1000 0.5 2.0 5.0 2.5 ECA1VHG470( ) 200 2000 100 6.3 11.2 150 0.14 1000 0.5 2.5 5.0 2.5 ECA1VHG101( ) 200 2000 220 8 11.5 270 0.14 1000 0.6 3.5 5.0 ECA1VHG221( ) 200 1000 330 10 12.5 350 0.14 2000 0.6 5.0 5.0 ECA1VHG331( ) 200 500 470 10 16 460 0.14 2000 0.6 5.0 5.0 ECA1VHG471( ) 200 500 1000 12.5 20 810 0.14 2000 0.6 5.0 5.0 ECA1VHG102( ) 200 500 2200 16 25 1260 0.16 2000 0.8 7.5 7.5 ECA1VHG222( ) 100 250 3300 16 31.5 1610 0.18 2000 0.8 7.5 ECA1VHG332 100 4700 18 35.5 1910 0.20 2000 0.8 7.5 ECA1VHG472 50 · When requesting taped product, please put the letter "B" or "i" between the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, i=2.5 mm. · Please refer to the page of “Taping Dimensions”. 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ NHG – EEE-101 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (120 Hz) (+105 °C) tan d (120 Hz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽i (V) (μF) (mm) (mm) (mA r.m.s.) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 50 0.1 5 11 1.1 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG0R1( )✽✽✽ 200 2000 0.22 5 11 2.3 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHGR22( )✽✽✽ 200 2000 0.33 5 11 3.5 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHGR33( )✽✽✽ 200 2000 0.47 5 11 5 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHGR47( )✽✽✽ 200 2000 1 5 11 10 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG010( )✽✽✽ 200 2000 2.2 5 11 18 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG2R2( ) 200 2000 3.3 5 11 22 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG3R3( ) 200 2000 4.7 5 11 26 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG4R7( ) 200 2000 10 5 11 39 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG100( ) 200 2000 22 5 11 65 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG220( ) 200 2000 33 5 11 90 0.12 1000 0.5 2.0 5.0 2.5 ECA1HHG330( ) 200 2000 47 6.3 11.2 110 0.12 1000 0.5 2.5 5.0 2.5 ECA1HHG470( ) 200 2000 100 8 11.5 180 0.12 1000 0.6 3.5 5.0 ECA1HHG101( ) 200 1000 220 10 12.5 300 0.12 2000 0.6 5.0 5.0 ECA1HHG221( ) 200 500 330 10 16 410 0.12 2000 0.6 5.0 5.0 ECA1HHG331( ) 200 500 470 10 20 530 0.12 2000 0.6 5.0 5.0 ECA1HHG471( ) 200 500 1000 12.5 25 950 0.12 2000 0.6 5.0 5.0 ECA1HHG102( ) 200 500 2200 16 31.5 1470 0.14 2000 0.8 7.5 ECA1HHG222 100 3300 18 35.5 1770 0.16 2000 0.8 7.5 ECA1HHG332 50 63 10 5 11 46 0.10 1000 0.5 2.0 5.0 2.5 ECA1JHG100( ) 200 2000 22 5 11 71 0.10 1000 0.5 2.0 5.0 2.5 ECA1JHG220( ) 200 2000 33 6.3 11.2 100 0.10 1000 0.5 2.5 5.0 2.5 ECA1JHG330( ) 200 2000 47 6.3 11.2 120 0.10 1000 0.5 2.5 5.0 2.5 ECA1JHG470( ) 200 2000 100 10 12.5 215 0.10 2000 0.6 5.0 5.0 ECA1JHG101( ) 200 500 220 10 16 335 0.10 2000 0.6 5.0 5.0 ECA1JHG221( ) 200 500 330 10 20 510 0.10 2000 0.6 5.0 5.0 ECA1JHG331( ) 200 500 470 12.5 20 640 0.10 2000 0.6 5.0 5.0 ECA1JHG471( ) 200 500 1000 16 25 930 0.10 2000 0.8 7.5 7.5 ECA1JHG102( ) 100 250 2200 18 35.5 1610 0.12 2000 0.8 7.5 ECA1JHG222 50 100 0.47 5 11 9 0.08 1000 0.5 2.0 5.0 2.5 ECA2AHGR47( )✽✽✽ 200 2000 1 5 11 14 0.08 1000 0.5 2.0 5.0 2.5 ECA2AHG010( )✽✽✽ 200 2000 2.2 5 11 21 0.08 1000 0.5 2.0 5.0 2.5 ECA2AHG2R2( ) 200 2000 3.3 5 11 31 0.08 1000 0.5 2.0 5.0 2.5 ECA2AHG3R3( ) 200 2000 4.7 5 11 38 0.08 1000 0.5 2.0 5.0 2.5 ECA2AHG4R7( ) 200 2000 10 6.3 11.2 54 0.08 1000 0.5 2.5 5.0 2.5 ECA2AHG100( ) 200 2000 22 6.3 11.2 93 0.08 1000 0.5 2.5 5.0 2.5 ECA2AHG220( ) 200 2000 · When requesting taped product, please put the letter "B" or "i" between the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, i=2.5 mm. · Please refer to the page of “Taping Dimensions”. ✽✽✽ Please kindly accept last shipment : 31/Mar/2015 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ NHG – EEE-102 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (120 Hz) (+105 °C) tan d (120 Hz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽i (V) (μF) (mm) (mm) (mA r.m.s.) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 100 33 8 11.5 130 0.08 1000 0.6 3.5 5.0 ECA2AHG330( ) 200 1000 47 10 12.5 165 0.08 2000 0.6 5.0 5.0 ECA2AHG470( ) 200 500 100 10 20 265 0.08 2000 0.6 5.0 5.0 ECA2AHG101( ) 200 500 220 12.5 25 440 0.08 2000 0.6 5.0 5.0 ECA2AHG221( ) 200 500 330 16 25 540 0.08 2000 0.8 7.5 7.5 ECA2AHG331( ) 100 250 470 16 25 715 0.08 2000 0.8 7.5 7.5 ECA2AHG471( ) 100 250 1000 18 35.5 985 0.08 2000 0.8 7.5 ECA2AHG102 50 160 1 6.3 11.2 17 0.15 2000 0.5 2.5 5.0 2.5 ECA2CHG010( ) 200 2000 2.2 6.3 11.2 25 0.15 2000 0.5 2.5 5.0 2.5 ECA2CHG2R2( ) 200 2000 3.3 6.3 11.2 36 0.15 2000 0.5 2.5 5.0 2.5 ECA2CHG3R3( ) 200 2000 4.7 6.3 11.2 43 0.15 2000 0.5 2.5 5.0 2.5 ECA2CHG4R7( ) 200 2000 10 10 12.5 70 0.15 2000 0.6 5.0 5.0 ECA2CHG100( ) 200 500 22 10 20 130 0.15 2000 0.6 5.0 5.0 ECA2CHG220( ) 200 500 33 10 20 180 0.15 2000 0.6 5.0 5.0 ECA2CHG330( ) 200 500 47 12.5 20 220 0.15 2000 0.6 5.0 5.0 ECA2CHG470( ) 200 500 100 16 25 335 0.15 2000 0.8 7.5 7.5 ECA2CHG101( ) 100 250 220 16 31.5 540 0.15 2000 0.8 7.5 ECA2CHG221 100 330 18 31.5 705 0.15 2000 0.8 7.5 ECA2CHG331 50 200 1 6.3 11.2 17 0.15 2000 0.5 2.5 5.0 2.5 ECA2DHG010( ) 200 2000 2.2 6.3 11.2 25 0.15 2000 0.5 2.5 5.0 2.5 ECA2DHG2R2( ) 200 2000 3.3 6.3 11.2 36 0.15 2000 0.5 2.5 5.0 2.5 ECA2DHG3R3( ) 200 2000 4.7 8 11.5 50 0.15 2000 0.6 3.5 5.0 ECA2DHG4R7( ) 200 1000 10 10 16 80 0.15 2000 0.6 5.0 5.0 ECA2DHG100( ) 200 500 22 10 20 140 0.15 2000 0.6 5.0 5.0 ECA2DHG220( ) 200 500 33 12.5 20 190 0.15 2000 0.6 5.0 5.0 ECA2DHG330( ) 200 500 47 12.5 20 220 0.15 2000 0.6 5.0 5.0 ECA2DHG470( ) 200 500 100 16 25 335 0.15 2000 0.8 7.5 7.5 2.5 ECA2DHG101( ) 100 250 220 18 31.5 575 0.15 2000 0.8 7.5 ECA2DHG221 50 250 1 6.3 11.2 17 0.15 2000 0.5 2.5 5.0 2.5 ECA2EHG010( ) 200 2000 2.2 6.3 11.2 29 0.15 2000 0.5 2.5 5.0 2.5 ECA2EHG2R2( ) 200 2000 3.3 8 11.5 42 0.15 2000 0.6 3.5 5.0 ECA2EHG3R3 200 1000 4.7 8 11.5 50 0.15 2000 0.6 3.5 5.0 ECA2EHG4R7( ) 200 1000 10 10 16 88 0.15 2000 0.6 5.0 5.0 ECA2EHG100( ) 200 500 22 12.5 20 155 0.15 2000 0.6 5.0 5.0 ECA2EHG220( ) 200 500 33 12.5 20 190 0.15 2000 0.6 5.0 5.0 ECA2EHG330( ) 200 500 47 12.5 25 230 0.15 2000 0.6 5.0 5.0 ECA2EHG470( ) 200 500 100 16 31.5 365 0.15 2000 0.8 7.5 ECA2EHG101 100 350 1 6.3 11.2 18 0.20 2000 0.5 2.5 5.0 2.5 ECA2VHG010( ) 200 2000 2.2 8 11.5 31 0.20 2000 0.6 3.5 5.0 ECA2VHG2R2( ) 200 1000 3.3 10 12.5 38 0.20 2000 0.6 5.0 5.0 ECA2VHG3R3( ) 200 500 4.7 10 16 50 0.20 2000 0.6 5.0 5.0 ECA2VHG4R7( ) 200 500 10 10 20 82 0.20 2000 0.6 5.0 5.0 ECA2VHG100( ) 200 500 22 12.5 20 130 0.20 2000 0.6 5.0 5.0 ECA2VHG220( ) 200 500 33 16 25 195 0.20 2000 0.8 7.5 7.5 ECA2VHG330( ) 100 250 47 16 25 230 0.20 2000 0.8 7.5 7.5 ECA2VHG470( ) 100 250 100 18 31.5 375 0.20 2000 0.8 7.5 ECA2VHG101 50 · When requesting taped product, please put the letter "B" or "i" between the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, i=2.5 mm. · Please refer to the page of “Taping Dimensions”. 01 Oct. 2013 Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Aluminum Electrolytic Capacitors/ NHG – EEE-103 – ■ Standard Prod ucts W.V. Cap. (±20 %) Case size Specifi cation Lead Length Part No. Min. Packaging Q'ty Dia. Length Ripple Current (120 Hz) (+105 °C) tan d (120 Hz) (+20 °C) Endurance Lead Dia. Lead Space Straight Leads Taping Straight Taping ✽B Taping ✽i (V) (μF) (mm) (mm) (mA r.m.s.) (hours) (mm) (mm) (mm) (mm) (pcs) (pcs) 400 1 6.3 11.2 18 0.24 2000 0.5 2.5 5.0 2.5 ECA2GHG010( ) 200 2000 2.2 8 11.5 30 0.24 2000 0.6 3.5 5.0 ECA2GHG2R2( ) 200 1000 3.3 10 12.5 40 0.24 2000 0.6 5.0 5.0 ECA2GHG3R3( ) 200 500 4.7 10 16 50 0.24 2000 0.6 5.0 5.0 ECA2GHG4R7( ) 200 500 10 10 20 80 0.24 2000 0.6 5.0 5.0 ECA2GHG100( ) 200 500 22 12.5 25 145 0.24 2000 0.6 5.0 5.0 ECA2GHG220( ) 200 500 33 16 25 195 0.24 2000 0.8 7.5 7.5 ECA2GHG330( ) 100 250 47 16 31.5 250 0.24 2000 0.8 7.5 ECA2GHG470 100 450 1 8 11.5 18 0.24 2000 0.6 3.5 5.0 ECA2WHG010( ) 200 1000 2.2 10 12.5 29 0.24 2000 0.6 5.0 5.0 ECA2WHG2R2( ) 200 500 3.3 10 16 41 0.24 2000 0.6 5.0 5.0 ECA2WHG3R3( ) 200 500 4.7 10 20 49 0.24 2000 0.6 5.0 5.0 ECA2WHG4R7( ) 200 500 10 12.5 20 75 0.24 2000 0.6 5.0 5.0 ECA2WHG100( ) 200 500 22 16 25 115 0.24 2000 0.8 7.5 7.5 ECA2WHG220( ) 100 250 33 16 31.5 155 0.24 2000 0.8 7.5 ECA2WHG330 100 · When requesting taped product, please put the letter "B" or "i" between the "( )". Lead wire pitch ✽B=5 mm, 7.5 mm, i=2.5 mm. · Please refer to the page of “Taping Dimensions”. 01 Oct. 2013 Highest ripple current capability for demanding inverter applications 2 and 3 pin versions available 3000 hour life at 105ºC Part Number System Voltage Capacitance Code Code 2 3 4.0mm 4.0mm H P J Q K R L S TS-ED Standard Ratings (part numbers shown with 6.3mm length terminal and top vinyl plate) Cap. Panasonic Cap. Panasonic (μF) 120Hz 10kHz~ 120Hz 20kHz Part Number (μF) 120Hz 10kHz~ 120Hz 20kHz Part Number 270 22 x 25 1.42 2.03 0.553 0.249 EETED2D271BA 390 22 x 40 1.72 2.45 0.383 0.172 EETED2E391BA 330 22 x 30 1.56 2.23 0.452 0.203 EETED2D331BA 25 x 30 1.71 2.44 0.383 0.172 EETED2E391CA 390 22 x 30 1.71 2.44 0.383 0.172 EETED2D391BA 30 x 25 1.71 2.44 0.383 0.172 EETED2E391DA 25 x 25 1.71 2.44 0.383 0.172 EETED2D391CA 470 22 x 45 1.85 2.64 0.317 0.143 EETED2E471BA 470 22 x 35 1.85 2.64 0.317 0.143 EETED2D471BA 25 x 35 1.85 2.64 0.317 0.143 EETED2E471CA 25 x 30 1.85 2.64 0.317 0.143 EETED2D471CA 30 x 30 1.85 2.64 0.317 0.143 EETED2E471DA 560 22 x 40 2.14 3.05 0.266 0.120 EETED2D561BA 560 25 x 40 2.14 3.05 0.266 0.120 EETED2E561CA 25 x 30 2.14 3.05 0.266 0.120 EETED2D561CA 30 x 30 2.14 3.05 0.266 0.120 EETED2E561DA 30 x 25 2.14 3.05 0.266 0.120 EETED2D561DA 35 x 25 2.14 3.05 0.266 0.133 EETED2E561EA 680 22 x 45 2.42 3.45 0.219 0.099 EETED2D681BA 680 25 x 45 2.42 3.45 0.219 0.099 EETED2E681CA 25 x 35 2.42 3.45 0.219 0.099 EETED2D681CA 30 x 35 2.42 3.45 0.219 0.099 EETED2E681DA 30 x 30 2.42 3.45 0.219 0.099 EETED2D681DA 35 x 30 2.42 3.45 0.219 0.110 EETED2E681EA 820 22 x 50 2.63 3.76 0.182 0.082 EETED2D821BA 820 30 x 40 2.63 3.76 0.182 0.082 EETED2E821DA 25 x 40 2.63 3.76 0.182 0.082 EETED2D821CA 35 x 35 2.63 3.76 0.182 0.091 EETED2E821EA 30 x 30 2.63 3.76 0.182 0.082 EETED2D821DA 1000 30 x 50 2.84 4.06 0.149 0.067 EETED2E102DA 35 x 25 2.63 3.76 0.182 0.091 EETED2D821EA 35 x 40 2.84 4.06 0.149 0.067 EETED2E102EA 1000 25 x 45 2.84 4.06 0.149 0.067 EETED2D102CA 1200 35 x 45 3.13 4.47 0.124 0.062 EETED2E122EA 30 x 35 2.84 4.06 0.149 0.067 EETED2D102DA 1500 35 x 50 3.56 5.08 0.099 0.050 EETED2E152EA 35 x 30 2.84 4.06 0.149 0.067 EETED2D102EA 1200 30 x 40 3.13 4.47 0.124 0.062 EETED2D122DA 82 22 x 25 0.80 1.14 1.617 0.728 EETED2G820BA 35 x 35 3.13 4.47 0.124 0.062 EETED2D122EA 100 22 x 30 0.91 1.30 1.326 0.597 EETED2G101BA 1500 30 x 50 3.56 5.08 0.099 0.050 EETED2D152DA 25 x 25 0.91 1.30 1.326 0.597 EETED2G101CA 35 x 40 3.56 5.08 0.099 0.050 EETED2D152EA 120 22 x 35 1.02 1.46 1.105 0.497 EETED2G121BA 1800 35 x 45 3.84 5.48 0.083 0.041 EETED2D182EA 25 x 30 1.02 1.46 1.105 0.497 EETED2G121CA 2200 35 x 50 4.12 5.89 0.068 0.033 EETED2D222EA 150 22 x 40 1.07 1.53 0.884 0.398 EETED2G151BA 25 x 30 1.07 1.53 0.884 0.398 EETED2G151CA 220 22 x 30 1.28 1.83 0.678 0.305 EETED2E221BA 30 x 25 1.07 1.53 0.884 0.398 EETED2G151DA 270 22 x 30 1.42 2.03 0.553 0.249 EETED2E271BA 180 22 x 45 1.12 1.60 0.737 0.332 EETED2G181BA 25 x 25 1.42 2.03 0.553 0.249 EETED2E271CA 25 x 35 1.12 1.60 0.737 0.332 EETED2G181CA 330 22 x 35 1.64 2.34 0.452 0.203 EETED2E331BA 30 x 30 1.12 1.60 0.737 0.332 EETED2G181DA 25 x 30 1.56 2.23 0.452 0.203 EETED2E331CA 220 22 x 50 1.42 2.03 0.603 0.271 EETED2G221BA 56 ~ 560μF Common Code Endurance: 3000 hours at +105°C with maximum specified ripple current (see page 6) Capacitance Tolerance: Dissipation Factor (120Hz, 20°C): 15% maximum (120Hz, +20°C) 220~2200 μF *Use of temperature ripple current multipliers may limit life to the hours specified for the maximum operating temperature. Rated Working Voltage: Leakage Current: Ripple Current Multipliers: 2 3√CV (μA) max. after 5 minutes; C = Capacitance in μF, V = WV PVC without top plate Operating Temperature: -40 ~ +105°C -25 ~ +105°C Max 105°C R.C. (Arms) 20°C ESR (Ω, max.) D x L Max 105°C R.C. (Arms) 20°C ESR (Ω, max.) Size (mm) 250 VDC Working, 300 VDC Surge (continued) (no suffix) 250 VDC Working, 300 VDC Surge D E B 400 VDC Working, 450 VDC Surge D x L (Please see page 10 for details) Diameter J PET sleeve without plate Size (mm) TS-ED Series 105°C, 3000 hours 200 VDC Working, 250 VDC Surge Nominal Capacitance: Series Insulation Options 6.3mm 200 ~ 250 VDC 400 ~ 450 VDC Code ± 20% 35mm 30mm 25mm 22mm C Diameter / Terminal Code A PVC with top plate # of pins: pin length: E E T E D Ripple Current Frequency Factors Frequency(Hz): Multiplier: 50 0.71 60 0.78 100~120 1.0 1.2 1k 1.25 10k~ 1.4 Ripple Current Ambient Temperature Factors* ≤45°C 2.35 Ambient Temperature: 85°C 70°C 60°C Multiplier: 1.0 2.0 2.2 500 105°C 1.7 Design and specifi cations are subject to change without notice. Ask factory for technical specifi cations before purchase and/or use. Whenever a doubt about safety arises from this product, please contact us immediately for technical consultation. Large Can Aluminum Electrolytic Capacitors TS-ED Standard Ratings (continued) Cap. Panasonic (μF) 120Hz 10kHz~ 120Hz 20kHz Part Number 220 25 x 40 1.42 2.03 0.603 0.271 EETED2G221CA 30 x 30 1.42 2.03 0.603 0.271 EETED2G221DA 35 x 25 1.42 2.03 0.603 0.271 EETED2G221EA 270 25 x 45 1.56 2.23 0.491 0.221 EETED2G271CA 30 x 35 1.56 2.23 0.491 0.221 EETED2G271DA 35 x 30 1.56 2.23 0.491 0.221 EETED2G271EA 330 30 x 40 1.71 2.44 0.402 0.181 EETED2G331DA 35 x 30 1.71 2.44 0.402 0.181 EETED2G331EA 390 30 x 45 1.85 2.64 0.340 0.153 EETED2G391DA 35 x 35 1.85 2.64 0.340 0.153 EETED2G391EA 470 35 x 40 2.01 2.87 0.282 0.127 EETED2G471EA 560 35 x 45 2.35 3.36 0.237 0.107 EETED2G561EA 68 22 x 25 1.08 0.95 1.950 0.878 EETED2S680BA 82 22 x 30 1.14 1.08 1.617 0.728 EETED2S820BA 25 x 25 1.14 1.08 1.617 0.728 EETED2S820CA 100 22 x 30 1.30 1.14 1.326 0.597 EETED2S101BA 25 x 25 1.30 1.14 1.326 0.597 EETED2S101CA 120 22 x 35 1.46 1.30 1.105 0.497 EETED2S121BA 25 x 30 1.46 1.30 1.105 0.497 EETED2S121CA 150 22 x 40 1.53 1.46 0.884 0.398 EETED2S151BA 25 x 35 1.53 1.46 0.884 0.398 EETED2S151CA 30 x 25 1.53 1.46 0.884 0.398 EETED2S151DA 180 22 x 45 1.60 1.53 0.737 0.332 EETED2S181BA 25 x 40 1.60 1.53 0.737 0.332 EETED2S181CA 30 x 30 1.60 1.53 0.737 0.332 EETED2S181DA 35 x 25 1.60 1.53 0.737 0.332 EETED2S181EA 220 25 x 45 2.03 1.60 0.603 0.271 EETED2S221CA 30 x 35 2.03 1.60 0.603 0.271 EETED2S221DA 35 x 30 2.03 1.60 0.603 0.271 EETED2S221EA 270 25 x 50 2.40 2.03 0.491 0.221 EETED2S271CA 30 x 40 2.40 2.03 0.491 0.221 EETED2S271DA 35 x 30 2.40 2.03 0.491 0.221 EETED2S271EA 330 30 x 45 2.54 2.45 0.402 0.181 EETED2S331DA 35 x 35 2.54 2.45 0.402 0.181 EETED2S331EA 390 30 x 50 2.73 2.64 0.340 0.153 EETED2S391DA 35 x 40 2.73 2.64 0.340 0.153 EETED2S391EA 470 35 x 45 3.18 2.82 0.282 0.127 EETED2S471EA 56 22 x 25 0.67 0.95 2.368 1.066 EETED2W560BA 68 22 x 30 0.76 1.08 1.950 0.878 EETED2W680BA 25 x 25 0.76 1.08 1.950 0.878 EETED2W680CA 82 22 x 30 0.80 1.14 1.617 0.728 EETED2W820BA 25 x 25 0.80 1.14 1.617 0.728 EETED2W820CA 100 22 x 35 0.91 1.30 1.326 0.597 EETED2W101BA 25 x 30 0.91 1.30 1.326 0.597 EETED2W101CA 120 22 x 40 1.02 1.46 1.105 0.497 EETED2W121BA 25 x 35 1.02 1.46 1.105 0.497 EETED2W121CA 30 x 25 1.02 1.46 1.105 0.497 EETED2W121DA 150 22 x 45 1.07 1.53 0.884 0.398 EETED2W151BA 25 x 40 1.07 1.53 0.884 0.398 EETED2W151CA 30 x 30 1.07 1.53 0.884 0.398 EETED2W151DA 35 x 25 1.07 1.53 0.884 0.398 EETED2W151EA 180 22 x 50 1.12 1.60 0.737 0.332 EETED2W181BA 25 x 40 1.12 1.60 0.737 0.332 EETED2W181CA 30 x 30 1.12 1.60 0.737 0.332 EETED2W181DA 35 x 25 1.12 1.60 0.737 0.332 EETED2W181EA 220 25 x 45 1.42 2.03 0.603 0.271 EETED2W221CA 30 x 35 1.42 2.03 0.603 0.271 EETED2W221DA 35 x 30 1.42 2.03 0.603 0.271 EETED2W221EA 270 30 x 40 1.72 2.45 0.491 0.221 EETED2W271DA 35 x 35 1.72 2.45 0.491 0.221 EETED2W271EA 330 30 x 50 1.85 2.64 0.402 0.181 EETED2W331DA 35 x 40 1.85 2.64 0.402 0.181 EETED2W331EA 390 35 x 40 1.97 2.82 0.340 0.153 EETED2W391EA 470 35 x 50 2.47 3.53 0.282 0.127 EETED2W471EA D x L Size (mm) Max 105°C R.C. (Arms) 20°C ESR (Ω, max.) 400 VDC Working, 450 VDC Surge (continued) 420 VDC Working, 470 VDC Surge 450 VDC Working, 500 VDC Surge Design and specifi cations are subject to change without notice. Ask factory for technical specifi cations before purchase and/or use. Whenever a doubt about safety arises from this product, please contact us immediately for technical consultation. Large Can Aluminum Electrolytic Capacitors 1. Product profile 1.1 General description PNP Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD) plastic packages. 1.2 Features and benefits 1.3 Applications 1.4 Quick reference data PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k Rev. 5 — 9 December 2011 Product data sheet Table 1. Product overview Type number Package NPN complement Package NXP JEITA JEDEC configuration PDTA143XE SOT416 SC-75 - PDTC143XE ultra small PDTA143XM SOT883 SC-101 - PDTC143XM leadless ultra small PDTA143XT SOT23 - TO-236AB PDTC143XT small PDTA143XU SOT323 SC-70 - PDTC143XU very small 100 mA output current capability Reduces component count Built-in bias resistors Reduces pick and place costs Simplifies circuit design AEC-Q101 qualified Digital applications in automotive and industrial segments Cost-saving alternative for BC847/857 series in digital applications Control of IC inputs Switching loads Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 50 V IO output current - - 100 mA R1 bias resistor 1 (input) 3.3 4.7 6.1 k R2/R1 bias resistor ratio 1.7 2.1 2.6 PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 2 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 2. Pinning information 3. Ordering information 4. Marking [1] * = placeholder for manufacturing site code Table 3. Pinning Pin Description Simplified outline Graphic symbol SOT23; SOT323; SOT416 1 input (base) 2 GND (emitter) 3 output (collector) SOT883 1 input (base) 2 GND (emitter) 3 output (collector) 006aaa144 1 2 3 sym003 3 2 1 R1 R2 3 1 2 Transparent top view sym003 3 2 1 R1 R2 Table 4. Ordering information Type number Package Name Description Version PDTA143XE SC-75 plastic surface-mounted package; 3 leads SOT416 PDTA143XM SC-101 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm SOT883 PDTA143XT - plastic surface-mounted package; 3 leads SOT23 PDTA143XU SC-70 plastic surface-mounted package; 3 leads SOT323 Table 5. Marking codes Type number Marking code[1] PDTA143XE 35 PDTA143XM DN PDTA143XT *31 PDTA143XU *46 PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 3 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 5. Limiting values [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 50 V VEBO emitter-base voltage open collector - 7 V VI input voltage positive - +7 V negative - 20 V IO output current - 100 mA ICM peak collector current single pulse; tp 1 ms - 100 mA Ptot total power dissipation Tamb 25 C PDTA143XE (SOT416) [1][2]- 150 mW PDTA143XM (SOT883) [2][3]- 250 mW PDTA143XT (SOT23) [1]- 250 mW PDTA143XU (SOT323) [1]- 200 mW Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 4 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint. (1) SOT23; FR4 PCB, standard footprint SOT883; FR4 PCB with 70 m copper strip line, standard footprint (2) SOT323; FR4 PCB, standard footprint (3) SOT416; FR4 PCB, standard footprint Fig 1. Power derating curves Tamb (°C) -75 -25 25 75 125 175 006aac778 100 200 300 Ptot (mW) 0 (1) (2) (3) Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air PDTA143XE (SOT416) [1][2]- - 830 K/W PDTA143XM (SOT883) [2][3]- - 500 K/W PDTA143XT (SOT23) [1]- - 500 K/W PDTA143XU (SOT323) [1]- - 625 K/W PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 5 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for PDTA143XE (SOT416); typical values FR4 PCB, 70 m copper strip line Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for PDTA143XM (SOT883); typical values 006aac781 10-5 10-4 10-2 10-1 10 102 tp (s) 10-3 1 103 102 10 103 Zth(j-a) (K/W) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 006aac782 10-5 10-4 10-2 10-1 10 102 tp (s) 10-3 1 103 102 10 103 Zth(j-a) (K/W) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 6 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for PDTA143XT (SOT23); typical values FR4 PCB, standard footprint Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for PDTA143XU (SOT323); typical values 006aac779 10-5 10-4 10-2 10-1 10 102 tp (s) 10-3 1 103 102 10 103 Zth(j-a) (K/W) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 006aac780 10-5 10-4 10-2 10-1 10 102 tp (s) 10-3 1 103 102 10 103 Zth(j-a) (K/W) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 7 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 7. Characteristics [1] Characteristics of built-in transistor Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 50 V; IE = 0 A - - 100 nA ICEO collector-emitter cut-off current VCE = 30 V; IB = 0 A - - 1 A VCE = 30 V; IB = 0 A; Tj = 150 C - - 5 A IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 600 A hFE DC current gain VCE = 5 V; IC = 10 mA 50 - - VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - - 100 mV VI(off) off-state input voltage VCE = 5 V; IC = 100 A - 0.9 0.3 V VI(on) on-state input voltage VCE = 0.3 V; IC = 20 mA 2.5 1.5 - V R1 bias resistor 1 (input) 3.3 4.7 6.1 k R2/R1 bias resistor ratio 1.7 2.1 2.6 Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - - 3 pF fT transition frequency VCE = 5 V; IC = 10 mA; f = 100 MHz [1]- 180 - MHz PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 8 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 6. DC current gain as a function of collector current; typical values Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values VCE = 0.3 V (1) Tamb = 40 C (2) Tamb = 25 C (3) Tamb = 100 C VCE = 5 V (1) Tamb = 40 C (2) Tamb = 25 C (3) Tamb = 100 C Fig 8. On-state input voltage as a function of collector current; typical values Fig 9. Off-state input voltage as a function of collector current; typical values IC (mA) -10-1 -1 -10 -102 006aac846 102 10 103 hFE 1 (1) (2) (3) IC (mA) -1 -10 -102 006aac847 -10-1 -1 VCEsat (V) -10-2 (1) (2) (3) 006aac848 IC (mA) -10-1 -1 -10 -102 -1 -10 VI(on) (V) -10-1 (1) (2) (3) IC (mA) -10-1 -1 -10 006aac849 -1 -10 VI(off) (V) -10-1 (1) (2) (3) PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 9 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. f = 1 MHz; Tamb = 25 C VCE = 5 V; Tamb = 25 C Fig 10. Collector capacitance as a function of collector-base voltage; typical values Fig 11. Transition frequency as a function of collector current; typical values of built-in transistor VCB (V) 0 -10 -20 -30 -40 -50 006aac850 4 2 6 8 Cc (pF) 0 006aac763 IC (mA) -10-1 -1 -10 -102 102 103 fT (MHz) 10 PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 10 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 14. Fig 12. Package outline PDTA143XE (SOT416/SC-75) Fig 13. Package outline PDTA143XM (SOT883/SC-101) Fig 14. Package outline PDTA143XT (SOT23) Fig 15. Package outline PDTA143XU (SOT323/SC-70) Dimensions in mm 04-11-04 0.95 0.60 1.8 1.4 1.75 1.45 0.9 0.7 0.25 0.10 1 0.30 0.15 1 2 3 0.45 0.15 Dimensions in mm 03-04-03 0.62 0.55 0.55 0.47 0.50 0.46 0.65 0.20 0.12 3 2 1 0.30 0.22 0.30 0.22 1.02 0.95 0.35 Dimensions in mm 04-11-04 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 1 2 3 Dimensions in mm 04-11-04 0.45 0.15 1.1 0.8 2.2 1.8 2.2 2.0 1.35 1.15 1.3 0.4 0.3 0.25 0.10 1 2 3 Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 5000 10000 PDTA143XE SOT416 4 mm pitch, 8 mm tape and reel -115 - -135 PDTA143XM SOT883 2 mm pitch, 8 mm tape and reel - - -315 PDTA143XT SOT23 4 mm pitch, 8 mm tape and reel -215 - -235 PDTA143XU SOT323 4 mm pitch, 8 mm tape and reel -115 - -135 PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 11 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 11. Soldering Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint PDTA143XE (SOT416/SC-75) Reflow soldering is the only recommended soldering method. Fig 17. Reflow soldering footprint PDTA143XM (SOT883/SC-101) solder lands solder resist occupied area solder paste sot416_fr 0.85 1.7 2.2 2 0.5 (3×) 0.6 (3×) 1 1.3 Dimensions in mm solder lands solder resist occupied area solder paste sot883_fr 1.3 0.3 0.6 0.7 0.4 0.9 0.3 (2×) 0.4 (2×) 0.25 (2×) 0.7 R0.05 (12×) Dimensions in mm PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 12 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k Fig 18. Reflow soldering footprint PDTA143XT (SOT23) Fig 19. Wave soldering footprint PDTA143XT (SOT23) solder lands solder resist occupied area solder paste sot023_fr 0.5 (3×) 0.6 (3×) 0.6 (3×) 0.7 (3×) 3 1 3.3 2.9 1.7 1.9 2 Dimensions in mm solder lands solder resist occupied area preferred transport direction during soldering sot023_fw 2.8 4.5 1.4 4.6 1.4 (2×) 1.2 (2×) 2.2 2.6 Dimensions in mm PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 13 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k Fig 20. Reflow soldering footprint PDTA143XU (SOT323/SC-70) Fig 21. Wave soldering footprint PDTA143XU (SOT323/SC-70) solder lands solder resist occupied area solder paste sot323_fr 2.65 2.35 0.6 (3×) 0.5 (3×) 0.55 (3×) 1.325 1.85 1.3 3 2 1 Dimensions in mm sot323_fw 3.65 2.1 1.425 (3×) 4.6 09 (2×) 2.575 1.8 solder lands solder resist occupied area preferred transport direction during soldering Dimensions in mm PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 14 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PDTA143X_SER v.5 20111209 Product data sheet - PDTA143X_SERIES v.4 Modifications: • Type numbers PDTA143XK and PDTA143XS removed. • Section 1 “Product profile”: updated • Section 4 “Marking”: updated • Figure 1 to 5, 10 and 11: added • Section 6 “Thermal characteristics”: updated • Figure 6 to 9: updated • Table 8 “Characteristics”: ICEO updated, fT added • Section 8 “Test information”: added • Section 11 “Soldering”: added • Section 13 “Legal information”: updated PDTA143X_SERIES v.4 20070416 Product data sheet - PDTA143X_SERIES v.3 PDTA143X_SERIES v.3 20040804 Product specification - PDTA143X_SERIES v.2 PDTA143X_SERIES v.2 20030410 Product specification - - PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 15 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k 13. Legal information 13.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. PDTA143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 5 — 9 December 2011 16 of 17 NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com NXP Semiconductors PDTA143X series PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 9 December 2011 Document identifier: PDTA143X_SER Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7 8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information . . . . . . . . . . . . . . . . . . . . 10 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14 Contact information. . . . . . . . . . . . . . . . . . . . . 16 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Circuit Imprimé Français - Tools ECO Series TECHNO LABORATORY DRILLS TECHNO 003 MR TECHNO 003 R Model TECHNO 003 MR TECHNO 003 R TECHNO 003 MRE Adjustable rotation speed 11000 à 37000 rpm 11000 à 37000 rpm 11000 à 37000 rpm Capacity Ø 0.2 à 3.2 mm Ø 0.2 à 3.2 mm 0,2 à 3,2 mm Swan neck 120 mm 170 mm 120 mm Work table 250 x 150 mm 380 x 295 mm 250 x 150 mm Spindle travel 6 mm 6 mm 6 mm Low voltage lighting Yes Yes No Dust removal connection Yes Yes No External dimensions 250 x 150 x 260 mm 380 x 295 x 260 mm 250 x 150 x 260 mm Weight 4 kg 5 kg 3,8 kg Spindle output 115 W 115 W 115 W Electrical connection 220 /240 V - 50/60 Hz 220/240 - 50/60 Hz 220/240 V - 50/60 Hz Code DP 593 EP 503 DP 595 TECHNO 001 TECHNO 002 http://www.cif.fr/uk/ukp40.shtml (1 of 2) [04/08/03 11:08:09] Circuit Imprimé Français - Tools Model TECHNO 001 TECHNO 002 Adjustable rotation speed 8000 à 20000 rpm 20000 rpm Capacity Ø 0.2 à 3.2 mm Ø 0.2 à 3.2 mm Swan neck 175 mm 150 mm Work table 285 x 245 mm 300 x 245 mm Spindle travel 25 mm 15 mm Automatic clamping chuck Ø 0.2 à 3.2 mm Ø 0.2 à 3.2 mm Low voltage lighting Yes Yes Dust removal connection Yes Yes External dimensions 395 x 245 x 230 mm 395 x 245 x 250 mm Weight 8,5 kg 5 kg Spindle output 130 W 24 V/30 W Electrical connection 220/240 V - 50/60 Hz 220/240 V - 50/60 Hz Code EP 501 EP 502 © Circuit Imprimé Français - Technical conception : France Cybermedia - http://www.cif.fr/uk/ukp40.shtml (2 of 2) [04/08/03 11:08:09] DEUTSCH – ENGLISH - FRANCAIS D Bedienungsanleitung ANSMANN Starlight-Serie Starlight 200 (UK) und Starlight 400 (UK) (Starlight 300 – nicht mehr lieferbar) Seite 1 HINWEIS Dieses Gerät muss vor dem Erstgebrauch unbedingt 24 Stunden geladen werden. Der Akku- Handscheinwerfer ist für Dauerladung ausgelegt, d.h. der Steckertrafo verbleibt in der Steckdose und der Arbeitsscheinwerfer im Wandhalter (9). BEFESTIGIGUNG DER WANDHALTERUNG (9) Bohren Sie 2 Löcher im waagrechten Abstand von 87 mm in die Wand. Achten Sie darauf, dass die Wandhalterung in der Nähe einer Steckdose montiert wird, wobei das Netzversorgungskabel in der Mauer nicht beschädigt werden darf. Fixieren Sie die Wandhalterung nun mittels zweier Schrauben in der Wand. AUFLADUNG DES AKKU-ARBEITSSCHEINWERFERS Laden Sie den Akku-Arbeitscheinwerfer vor dem ersten Gebrauch mindestens 24 Stunden auf. Die Aufladung erfolgt in der Wandhalterung (9). Das Ladenetzteil kann dauernd in der Steckdose verbleiben. Der Arbeitsscheinwerfer wird also, sofern Sie Ihn nicht benutzen, in der Wandhalterung dauernd aufgeladen (Dauerladung). Die Aufladung wird durch das Leuchten der Ladekontroll-Leuchte (7) angezeigt. LEUCHTDAUER Die Leuchtdauer des Arbeitsscheinwerfers entnehmen Sie bitte der Tabelle (H – Seite 3). ANWENDUNG Bei Bedarf nehmen Sie bitte den Arbeitsscheinwerfer aus der Wandhalterung (9). Der Handgriff ist um 180 Grad schwenkbar und kann in vier Raststufen hochgeklappt werden. Während des Hoch- oder Zurückklappens muss der Klappmechanismus durch Drücken der Entriegelungstaste entriegelt werden. Mit dem Schiebeschalter (1) schalten Sie den Scheinwerfer ein. Starlight 300 und 400 haben zwei Schaltstufen. 1. Stufe Krypton-Lampe; 2. Stufe Halogen-Lampe. D Bedienungsanleitung ANSMANN Starlight-Serie Starlight 200 (UK) und Starlight 400 (UK) (Starlight 300 – nicht mehr lieferbar) Seite 2 FOKUSSIERUNG Den Brennpunkt des Lichtstrahls können Sie durch Drehen der Fokussierung (4) einstellen. Durch Drehen bis zum rechten Anschlag wird bei Starlight 400 die Blinkelektronik eingeschaltet. Es blinkt die Glühlampe, welche mit dem Schiebeschalter (1) geschaltet ist. AUSWECHSELN DER GLÜHBIRNE Drücken Sie den Gummiring des Reflektors an den beiden Druckpunkten (10) zusammen. Der Reflektor lässt sich nun aus dem Scheinwerfergehäuse herausnehmen und die Glühlampen können gewechselt werden. ZUBEHÖR Starlight 300 und Starlight 400 sind mit Trageriemen (T) ausgestattet. Dieser wird an den beiden Ösen seitlich am Gehäuse befestigt. Starlight 400 ist mit 2 Filterscheiben (F) (rot u. grün) ausgestattet (im Gehäuse des Akkupacks ist Platz für zwei Filterscheiben vorgesehen). NETZAUSFALL-ELEKTRONIK Starlight 400 ist mit einer Netzausfall-Elektronik (N) ausgestattet. Der Handscheinwerfer wird im eingeschalteten Zustand in die Ladestation eingesteckt. Bei Stromausfall schaltet sich der Handscheinwerfer automatisch ein und dient somit als Notbeleuchtung. Nach Ende der Netzunterbrechung schaltet sich der Scheinwerfer wieder automatisch aus und der Akkupack wird wieder geladen. AUSWECHSELN DES AKKUS Nach gleichzeitigem Drücken der beiden Entriegelungspunkte (6) lässt sich der Akkupack herausziehen. D Bedienungsanleitung ANSMANN Starlight-Serie Starlight 200 (UK) und Starlight 400 (UK) (Starlight 300 – nicht mehr lieferbar) Seite 3 UMWELTHINWEIS Akkus gehören nicht in den Hausmüll. Geben Sie verbrauchte Akkus bei Ihrem Händler bzw. der Batteriesammelstelle ab. HINWEIS Das Gerät bitte nicht Nässe und extremen Temperaturen aussetzen. Wartungs- und Reinigungsarbeiten nur bei gezogenem Netzteil durchführen. Den Handscheinwerfer nur mit einem feuchten Tuch reinigen. TABELLE H Technische Daten Typ Nummer Leuchtmittel* Zubehör** Akkupack Leuchtweite Leuchtdauer Starlight 200 UK 5502046 4 W H 4,8V 800m 120 min Starlight 400 UK 5502056 10W H/4W KR T/N/F/B 6V 1200m 60(200)min Starlight 200 5102062 4 W H 4,8V 800m 120 min Starlight 400 5102082 10W H/4W KR T/N/F/B 6V 1200m 60(200)min Zubehör Leuchtmittel ** T = Tragegurt * H = Halogen ** N = Netzausfall-Elektronik * KR = Krypton ** F = Filterscheibe rot und grün ** B = Blink-Elektronik Weitere aktuelle Informationen ANSMANN ENERGY GMBH Industriestraße 10, 97959 Assamstadt Tel.: 06294-4204-0 Fax: 06294-4204-43 info@ansmann.de www.ansmann.de GB Operating Instructions ANSMANN Starlight Series Starlight 200 (UK) and Starlight 400 (UK) (Starlight 300 – no longer available) Page 1 CAUTION ! This appliance has to be charged for 24 hours before using it for the first time. The lamp can be charged continuously, i.e. the charging adaptor can remain permanently in the mains socket and the appliance in the wall bracket (9). MOUNTING OF THE WALL BRACKET (9) Drill two holes 110 mm apart vertically where you wish to fix the wall holder. We recommend that you fit the wall holder to the wall near a mains socket checking that the holes to be drilled are well away from the mains supply cable to the electrical socket. Fit the wall plugs into the holes, position the wall holder against the wall, insert screws and screw up tightly. CHARGING THE LAMP Before using the appliance for the first time charge it for at least 24 hours in the wall bracket (9). The charging unit can remain in the mains socket. This means that the lamp is constantly charged in the wall bracket. The LED (7) indicates that the appliance is being charged. When fully charged the lamp provide its full power. OPERATING TIME For appropriate operating time of your STARLIGHT model please refer to the table H (page 3). USING THE LAMP Before using the lamp take it out of the wall bracket (9). All Starlight lamps have a handle that can be moved by 180 degrees and be folded back in four different positions. The angle can be adjusted by moving the handle forward or backwards whilst pressing the release key (5). With the slide switch (1) you can switch on the lamp. The Starlight 300 and 400 have two switch positions. First step: Krypton; second step: Halogen GB Operating Instructions ANSMANN Starlight Series Starlight 200 (UK) and Starlight 400 (UK) (Starlight 300 – no longer available) Page 2 FOCUS You can adjust the focus by turning the zoom grip (4). Turning the zoom grip fully clockwise will cause the bulb selected by (1) to flash on and off. REPLACING THE BULB Press the rubber ring of the reflector at the two tabs (10). The reflector/lens can now be taken out of the lamp case and the bulbs can be replaced. ACCESSORIES Starlight 300 and 400 are supplied with a shoulder strap. It can be fastened to the two fixings on the upper sides of the case. Starlight 400 is supplied with two coloured filter slides (red and green). The power pack case provides storage for the two slides. MAINS-FAILURE DETECTION Starlight 400 has a mains-failure detection option. This means that the lamp will automatically switch on if it detects that there is a mains failure, to provide a safety light. When the lamp is placed into the wall bracket for charging with the light on, the bulb extinguishes. If it detects a mains failure, the bulb will light until the mains power is restored and the power pack is being charged again. REMOVAL OF THE RECHARGEABLE BATTERY PACK (8) Depress the two release positions (6) at the same time to remove the power pack. Operating Instructions ANSMANN Starlight Series Starlight 200 (UK) and Starlight 400 (UK) (Starlight 300 – no longer available) Page 3 ENVIRONMENTAL REFERENCE Rechargeable batteries must not be disposed of in domestic waste. Return used batteries to your dealer or to an authorised battery collecting point. TIP Keep the appliance in a dry place. Do not carry out any cleaning or maintenance work if the charger is plugged in. Only use a moist cloth to clean the lamp or the wall bracket. TABLE H Technical Data Type Number Bulb* Accessories**Battery Pack Beam Operating Time Starlight 200 UK 5502046 4 W H 4.8V 800m 120 min Starlight 400 UK 5502056 10W H/4W KR T/N/F/B 6V 1200m 60(200)min Starlight 200 5102062 4 W H 4.8V 800m 120 min Starlight 400 5102082 10W H/4W KR T/N/F/B 6V 1200m 60(200)min Accessories BULB ** T= Belt * H= Halogen ** N= Mains-failure electronics *KR= Krypton ** F= Colour-filter red and green ** B= Electronic Indicator For further information please contact ANSMANN ENERGY GMBH Industriestraße 10; D-97959 Assamstadt Fon.: +49 (0) 6294-4204-0 Fax: +49 (0) 6294- 4204-43 info@ansmann.de www.ansmann.de Instructions d’utilisation ANSMANN de la série Starlight F Starlight 200 et Starlight 400 (Starlight 300 – plus disponible) Page 1 REMARQUE Le projecteur doit absolument être chargé 24 heures avant la première utilisation. Le projecteur manuel à accu est conçu pour une charge longue, c’est à dire que la fiche du transformateur reste dans la prise de courant, et le projecteur dans le support mural (9). FIXATION DU SUPPORT MURAL Percer 2 trous écartés de 87 mm à l’horizontale. Vérifier que le support soit à côté d’une prise de courant, en faisant attention à ne pas endommager le câble d’alimentation électrique dans le mur. Fixer le support mural à l’aide de deux vis. CHARGE DU PROJECTEUR Charger le projecteur au moins 24 heures avant la première utilisation. La charge s’effectue dans le support mural (9). Le chargeur peut rester branché longtemps. Le projecteur peut également rester sur son support s’il n’est pas utilisé. La période de charge est signalée par LED (7) DURÉE D’ÉCLAIRAGE Pour la durée d’éclairage, voir le tableau (H – page 3). Instructions d’utilisation ANSMANN de la série Starlight F Starlight 200 et Starlight 400 (Starlight 300 – plus disponible) Page 2 UTILISATION Prendre le projecteur sur le support mural (9). La poignée peut pivoter de 180° et peut être repliée avec 4 crans intermédiaires. Pour abaisser ou remonter la poignée, appuyer sur le bouton de déverrouillage (5). Allumer le projecteur avec l’interrupteur (1). Les projecteurs Starlight 300 & 400 ont deux positions : 1. Position: lampe Krypton ; 2. Position: lampe Halogène. FOCUS Modifier l’intensité du rayon lumineux en tournant le focus (4). En tournant à fond vers la droite pour le Starlight 400, l’ampoule sélectionnée clignote (1). REMPLACEMENT DE L’AMPOULE Appuyer sur le joint caoutchouc du réflecteur aux deux points de serrage (10). Le réflecteur se détache du projecteur et l’ampoule peut être remplacée. ACCESSOIRES Les Starlight 300 & Starlight 400 sont livrés avec une bandoulière (T) fixée de chaque côté de la lampe. Le Starlight 400 est livré avec 2 filtres (F) (rouge & vert). Un espace est prévu pour les deux filtres dans le boîtier de l’accu. COUPURE DU RÉSEAU Le Starlight 400 gère les coupures d’électricité du réseau (N). Lorsque le projecteur est remis sur son support en position allumé, il s’allume s’il y a une coupure de courant, et sert ainsi d’éclairage de sécurité. Le projecteur s’éteint automatiquement au retour du courant et l’accu se recharge. Instructions d’utilisation ANSMANN de la série Starlight F Starlight 200 et Starlight 400 (Starlight 300 – plus disponible) Page 3 REMPLACEMENT DE L’ACCU Appuyer sur les deux points de déverrouillage en même temps (6) pour que l’accu se détache. PROTECTION DE L’ENVIRONNEMENT Les accus ne doivent pas être jetés dans les poubelles domestiques. Renvoyer les au distributeur ou à un centre de collecte autorisé. PRÉCAUTIONS Ne pas laisser le projecteur à l’humidité et ne pas exposer à des températures extrèmes. Les travaux de nettoyage et de maintenance doivent être effectués uniquement par les distributeurs autorisés. Le projecteur doit être nettoyé uniquement avec un chiffon humide. TABLEAU H Données Techniques Type L'article Ampoule * Accessoires** Battery Pack Largeur d'éclat Durée d'éclat Starlight 200 UK*** 5502046 4 W H 4,8V 800m 120 min Starlight 400 UK*** 5502056 10W H/4W KR T/N/F/B 6V 1200m 60(200)min Starlight 200 5102062 4 W H 4,8V 800m 120 min Starlight 400 5102082 10W H/4W KR T/N/F/B 6V 1200m 60(200)min *** Série pour GB Accessories** Ampoule* ** T = Courroie de civière * H = Halogène ** N = Panne de courant électronique * KR = Krypton ** F = Glace de filtre rouge et vert ** B = Se enflammer électronique Pour de plus amples renseignements, contactez ANSMANN ENERGY GMBH Industriestrasse 10, D-97959 Assamstadt Tél.: +49 (0) 6294-4204-0 Fax: +49 (0) 6294-4204-43 info@ansmann.de www.ansmann.de OSCILLOSCOPES USB HAUTE précisio n www.picotech.com Série PicoScope® 4000 Fourni avec un kit de développement logiciel (SDK) complet, y compris des exemples de programmes • Logiciel compatible avec Windows XP, Windows Vista et Windows 7• Assistance technique gratuite Mémoire tampon 32 MS Résolution 12 bits Taux d'échantillonnage 80-250 MS/s Bande passante 20-100 MHz Jusqu'à 4 voies Mode 2 voies IEPE Alimentation USB YE AR Vitesse, précision et capture détaillée IEPE 32 MS TAMPON 12-bit MODÈLE PicoScope 4424 PicoScope 4224 PicoScope 4224 IEPE Entrées Mode sonde passive Mode d'interface IEPE Nombre de voies 4 entrées BNC 2 entrées BNC 2 entrées BNC 2 entrées BNC Bande passante analogique 20 MHz (10 MHz sur une plage de ± 50 mV) CC à 20 MHz 1,6 Hz à 20 MHz (10 MHz sur une plage de ± 50 mV) Plages de tensions De ± 50 mV à ± 100 V De ± 50 mV à ± 20 V Sensibilité 10 mV/div à 20 V/div 10 mV/div à 4 V/div Résolution verticale 12 bits (jusqu’à 16 bits avec l’amélioration de la résolution) 12 bits (jusqu’à 16 bits avec l’amélioration de la résolution) Couplage d'entrée CA ou CC, sous contrôle logiciel CA ou CC, sous contrôle logiciel Impédance d'entrée 1 MΩ || 22 pF 1 MΩ || 22 pF 1 MΩ || 1 nF Protection contre les surtensions ± 200 V ± 100 V Échan till onna ge Bases de temps 100 ns/div à 200 s/div 100 ns/div à 200 s/div Taux d'échantillonnage maximum (temps réel) 1/2 voies : 80 MS/s 3/4 voies : 20 MS/s 80 MS/s 80 MS/s Taille de la mémoire tampon 32 M échantillons partagés entre les voies actives 32 M échantillons partagés entre les voies actives Décl enc hement Sources Toute voie d'entrée Type de déclencheurs voie A, voie B Front avec hystérésis, largeur d'impulsion, impulsion transitoire, perte de niveau, fenêtre Types de déclencheurs EXT Front montant, front descendant Performanc e Précision de la base de temps 50 ppm Précision CC 1 % de déviation maximale Résolution de déclenchement 1 LSB (voie A, voie B) Temps de réarmement du déclenchement 2,5 μs (base de temps la plus rapide) Env ironn ement Plage de températures Fonctionnement : 0 °C à 45 °C Pour la précision mentionnée : 20 °C à 30 °C Entreposage : –20 °C à 60 °C Plage d'humidité Fonctionnement : HR de 5 à 80 %, sans condensation Entreposage : HR de 5 à 95 %, sans condensation Connexion PC USB 2.0. Compatible avec USB 1.1 Système d'exploitation du PC Windows XP, Windows Vista ou Windows 7 Alimentation 5 V à 500 mA max. provenant du port USB Dimensions 200 mm x 140 mm x 38 mm (connecteurs inclus) Poids < 500 g Conformité Normes européennes CEM et LVD RoHS et DEEE , règles FCC Partie 15 Classe A MODÈLE PicoScope 4226 PicoScope 4227 Entrées Nombre de voies 2 entrées BNC Bande passante analogique 50 MHz 100 MHz Plages de tensions De ± 50 mV à ± 20 V Sensibilité 10 mV/div à 4 V/div Résolution verticale 12 bits Couplage d'entrée CA ou CC, sélection logicielle Impédance d'entrée 1 MΩ || 16 pF Protection contre les surtensions ± 100 V Échan till onna ge Bases de temps 100 ns/div à 200 s/div 50 ns/div à 200 s/div Taux d'échantillonnage maximum (temps réel) 1 voie en cours d'utilisation 125 MS/s 1 voie en cours d'utilisation 250 MS/s 2 voies en cours d'utilisation 125 MS/s 2 voies en cours d'utilisation 125 MS/s Fréquence d'échantillonnage maximale (ET S) 10 G S/s Taille de la mémoire tampon 32 MS partagées entre les voies actives Décl enc hement Sources Voie A, voie B, Ext Type de déclencheurs voie A, voie B Front, fenêtre, impulsion, intervalle, perte, transitoire, retardé Types de déclencheurs EXT Front montant/descendant En trée de décl enc hement EXT Connecteur BNC Bande passante 100 MHz Impédance 1 MΩ || 20 pF Plage de tension ± 20 V Plage de seuil De ± 150 mV à ± 20 V Couplage CC Protection contre les surtensions ± 100 V Géné rateur de fonc tions /géné rateur de formes d'ond es arbitraires Connecteur BNC Plage de fréquences du générateur de fonction CC à 100 kHz Formes d'onde du générateur de fonctions Sinusoïdale, carrée, triangulaire, rampante, (sin x)/x gaussienne, demi-sinusoïdale, bruit blanc, niveau CC Taille de la mémoire tampon 8 192 échantillons Fréquence de mise à jour DAC 20 MS/s Résolution du convertisseur numérique-analogique 12 bits Bande passante 100 kHz Précision CC 1 % Plage de sortie De ± 250 mV à ± 2 V Plage de décalage de sortie ± 1 V Max. sortie combinée ± 2.5 V Résistance de sortie 600 Ω Protection contre les surtensions ± 10 V Performanc e Précision de la base de temps 50 ppm Précision CC 1 % de déviation maximale Résolution de déclenchement 1 LSB (voie A, voie B) Temps de réarmement du déclenchement 1 μs (base de temps la plus rapide, déclenchement rapide) Env ironn ement Plage de températures Fonctionnement : 0 °C à 45 °C Pour la précision mentionnée : 20 °C à 30 °C Entreposage : –20 °C à 60 °C Plage d'humidité Fonctionnement : HR de 5 à 80 %, sans condensation Entreposage : HR de 5 à 95 %, sans condensation Connexion PC USB 2.0. Compatible avec USB 1.1 Système d'exploitation du PC Windows XP, Windows Vista ou Windows 7 Alimentation 5 V à 500 mA max. provenant du port USB Dimensions 200 mm x 140 mm x 38 mm (connecteurs inclus) Poids < 500 g Conformité Normes européennes CEM et LVD RoHS et DEEE , règles FCC Partie 15 Classe A Caractéristiques supplémentaires • Tests de limite de masque avec alarmes • Décodage de données série (CAN, I2C etc....) • Filtre passe-bas pour chaque voie • Voies mathématiques • Formes d'ondes de référence • Tampon de formes d'ondes avec 10 000 segments max. et navigateur visuel • Modes de persistance Couleur numérique et Intensité analogique • Mode XY Entrée déclenchement Entrée B Entrée A Générateur de fonctions et de formes d'ondes arbitraires Pico Technology, James House, Colmworth Business Park, St. Neots, Cambridgeshire, PE19 8YP, Royaume-Uni T : +44 (0) 1480 396 395 F : +44 (0) 1480 396 296 E : sales@picotech.com *Prix en vigueur au moment de la publication. Avant de passer commande, veuillez contacter Pico Technology pour connaître les tout derniers tarifs. Sauf erreur ou omission. Copyright © 2011 Pico Technology Ltd. Tous droits réservés. MM002.fr-5 CODE DE COMMANDE DESCRIPTION DE L'ARTICLE Livre sterling USD* EUR* PP493 PicoScope 4424 799 1319 967 PP492 PicoScope 4224 499 824 604 PP695 PicoScope 4224 IEPE 599 989 725 PP671 Kit PicoScope 4226 699 1154 846 PP672 Kit PicoScope 4227 899 1484 1088 Informations concernant la commande www.picotech.com Instruments tout-en-un Les oscilloscopes PC PicoScope série 4000 sont extrêmement polyvalents, et chaque modèle est équipé d'un oscilloscope et d'un analyseur de spectre. PicoScope 4224 IEPE La version IE PE à 2 voies est compatible avec les accéléromètres et microphones IE PE standard, ce qui la rend idéale pour tout type d'applications de mesure, y compris l'analyse du bruit et des vibrations. Confort et rapidité Les oscilloscopes PicoScope série 4000 sont alimentés par l'interface USB 2.0 ; nul besoin de source d'alimentation externe. Le port USB offre également un transfert de données haute vitesse vers votre PC, permettant d'obtenir un affichage haute résolution et réactif. Grâce à des plages d'échantillonnage allant de 80 à 250 MS/s, les oscilloscopes de la série 4000 sont les plus rapides de leur catégorie (avec alimentation par USB et résolution 12 bits). Grande mémoire La mémoire tampon de 32 Méchantillons est "toujours active". Comme le PicoScope série 4000 optimise simultanément la taille de la mémoire tampon et la fréquence de mise à jour de la forme d'onde, il n'y a pas de compromis à faire. Il est désormais possible de capturer chaque forme d'onde en détail sans avoir à s'en soucier. Logiciel avancé Les oscilloscopes sont fournis avec la dernière version de PicoScope pour Windows. PicoScope est simple d'utilisation et permet d'exporter des données sous divers formats graphiques, texte et binaires. Sont également inclus les pilotes Windows et des programmes d'exemple. Générateur de formes d'ondes arbitraires Les PicoScope 4226 et 4227 sont fournis avec un générateur de fonctions/formes d'ondes arbitraires. Grâce à une plage de fréquences de 100 kHz, une résolution de 12 bits et un tampon de 8 192 échantillons, ces deux oscilloscopes complètent notre gamme de la série 4000. Oscilloscope Analyseur de spectre Zoom sur la vue d'oscilloscope Générateur de formes d'ondes arbitraires Datasheets en Français FARNELL Ed.081002 DATASHEETS EN FRANCAIS BB2PROD Kit produits pour machine à graver modèle, GRAV’CI2 • 1 perchlorure de fer pour machine à mousse, jerrycan 5 litres • 1 kit de neutralisation perchlorure de fer • 1 détachant perchlorure de fer, pot 100 g • 2 cuvettes en plastique, 220 x 330 x 50 mm • 1 pince plastique pour films et circuits imprimés • 1 sachet de 100 gants jetables en polyéthylène • 1 stylo CIF pour gravure directe, noir BB4PROD Kit produits pour machine à graver modèles BB48 • 1 perchlorure de fer surractivé, jerrycan 5 litres • 1 kit de neutralisation perchlorure de fer • 1 détachant perchlorure de fer, pot de 100 g • 2 cuvettes en plastique, 220 x 330 x 50 mm • 1 pince plastique pour films et circuits imprimés • 1 sachet de 100 gants jetables en polyéthylène • 1 CIF pen for direct etching, black • 1 stylo CIF pour gravure directe, noir U800005 Kit produits pour châssis d’insolation CIP1840 & MI 10-16 • 10 films auto-positifs Posireflex 210 x 297 mm • 1 révélateur-fixateur, dose pour 1 litre • 20 epoxy présensibilisé positif 16/10e, 35 μ, 1F, 200 x 300 mm • révélateur pour plaque, dose pour 1 litre • 2 cuvettes en plastique 230 x 330 x 50 mm • 1 stylo CIF pour gravure directe, noir U800006 Kit produits pour châssis d’insolation modèles DFE 2340 & DFT 3040 • 10 films auto-positifs Posireflex 210 x 297 mm • 1 révélateur-fixateur, dose pour 1 litre • 20 epoxy présensibilisé positif 16/10e, 35 μ, 2F, 200 x 300 mm • 1 stylo CIF pour gravure directe, noir • révélateur pour plaque, dose pour 1 litre • 2 cuvettes en plastique 230 x 330 x 50 mm • 1 cutter avec 1 lame Datasheets en Français FARNELL Ed.081002 V700043 / CIF852 Température air chaud : 100 to 480°C Capteur de température : automatique Elément chauffant : oui Affichage digital de la température : oui Affichage du débit d’air : oui Masse nette du fer : 0.12 kg Débit pompe : 1 à 23 L/mn Puissance totale : 500 W Dimensions (L x l x H) : 188 x 244 x 127 mm Raccordement électrique: 230 V – 50/60Hz EP116 Contre-plaque de perçage Configuration basique Process Référence Qty Contre-plaque de perçage, par 10 perçage EP116 1 © 2007 Microchip Technology Inc. DS41211D PIC12F683 Data Sheet 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology DS41211D-page ii © 2007 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. DS41211D-page 1 PIC12F683 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers with nanoWatt Technology High-Performance RISC CPU: • Only 35 instructions to learn: - All single-cycle instructions except branches • Operating speed: - DC – 20 MHz oscillator/clock input - DC – 200 ns instruction cycle • Interrupt capability • 8-level deep hardware stack • Direct, Indirect and Relative Addressing modes Special Microcontroller Features: • Precision Internal Oscillator: - Factory calibrated to ±1%, typical - Software selectable frequency range of 8 MHz to 125 kHz - Software tunable - Two-Speed Start-up mode - Crystal fail detect for critical applications - Clock mode switching during operation for power savings • Power-Saving Sleep mode • Wide operating voltage range (2.0V-5.5V) • Industrial and Extended temperature range • Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Brown-out Reset (BOR) with software control option • Enhanced Low-Current Watchdog Timer (WDT) with on-chip oscillator (software selectable nominal 268 seconds with full prescaler) with software enable • Multiplexed Master Clear with pull-up/input pin • Programmable code protection • High Endurance Flash/EEPROM cell: - 100,000 write Flash endurance - 1,000,000 write EEPROM endurance - Flash/Data EEPROM Retention: > 40 years Low-Power Features: • Standby Current: - 50 nA @ 2.0V, typical • Operating Current: - 11μA @ 32 kHz, 2.0V, typical - 220μA @ 4 MHz, 2.0V, typical • Watchdog Timer Current: - 1μA @ 2.0V, typical Peripheral Features: • 6 I/O pins with individual direction control: - High current source/sink for direct LED drive - Interrupt-on-pin change - Individually programmable weak pull-ups - Ultra Low-Power Wake-up on GP0 • Analog Comparator module with: - One analog comparator - Programmable on-chip voltage reference (CVREF) module (% of VDD) - Comparator inputs and output externally accessible • A/D Converter: - 10-bit resolution and 4 channels • Timer0: 8-bit timer/counter with 8-bit programmable prescaler • Enhanced Timer1: - 16-bit timer/counter with prescaler - External Timer1 Gate (count enable) - Option to use OSC1 and OSC2 in LP mode as Timer1 oscillator if INTOSC mode selected • Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler • Capture, Compare, PWM module: - 16-bit Capture, max resolution 12.5 ns - Compare, max resolution 200 ns - 10-bit PWM, max frequency 20 kHz • In-Circuit Serial Programming™ (ICSP™) via two pins Device Program Memory Data Memory I/O 10-bit A/D (ch) Comparators Timers Flash (words) SRAM (bytes) EEPROM (bytes) 8/16-bit PIC12F683 2048 128 256 6 4 1 2/1 PIC12F683 DS41211D-page 2 © 2007 Microchip Technology Inc. 8-Pin Diagram (PDIP, SOIC) 8-Pin Diagram (DFN) 8-Pin Diagram (DFN-S) TABLE 1: 8-PIN SUMMARY I/O Pin Analog Comparators Timer CCP Interrupts Pull-ups Basic GP0 7 AN0 CIN+ — — IOC Y ICSPDAT/ULPWU GP1 6 AN1/VREF CIN- — — IOC Y ICSPCLK GP2 5 AN2 COUT T0CKI CCP1 INT/IOC Y — GP3(1) 4 — — — — IOC Y(2) MCLR/VPP GP4 3 AN3 — T1G — IOC Y OSC2/CLKOUT GP5 2 — — T1CKI — IOC Y OSC1/CLKIN — 1 — — — — — — VDD — 8 — — — — — — VSS Note 1: Input only. 2: Only when pin is configured for external MCLR. VDD GP5/T1CKI/OSC1/CLKIN GP4/AN3/T1G/OSC2/CLKOUT GP3/MCLR/VPP VSS GP0/AN0/CIN+/ICSPDAT/ULPWU GP1/AN1/CIN-/VREF/ICSPCLK GP2/AN2/T0CKI/INT/COUT/CCP1 PIC12F683 1 2 3 4 8 7 6 5 1 2 3 4 5 6 7 8 PIC12F683 VSS GP0/AN0/CIN+/ICSPDAT/ULPWU GP1/AN1/CIN-/VREF/ICSPCLK GP2/AN2/T0CKI/INT/COUT/CCP1 VDD GP5/TICKI/OSC1/CLKIN GP4/AN3/TIG/OSC2/CLKOUT GP3/MCLR/VPP 1 2 3 4 5 6 7 8 PIC12F683 VSS GP0/AN0/CIN+/ICSPDAT/ULPWU GP1/AN1/CIN-/VREF/ICSPCLK GP2/AN2/T0CKI/INT/COUT/CCP1 VDD GP5/TICKI/OSC1/CLKIN GP4/AN3/TIG/OSC2/CLKOUT GP3/MCLR/VPP © 2007 Microchip Technology Inc. DS41211D-page 3 PIC12F683 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 Memory Organization................................................................................................................................................................... 7 3.0 Oscillator Module (With Fail-Safe Clock Monitor)....................................................................................................................... 19 4.0 GPIO Port................................................................................................................................................................................... 31 5.0 Timer0 Module ........................................................................................................................................................................... 41 6.0 Timer1 Module with Gate Control............................................................................................................................................... 44 7.0 Timer2 Module ........................................................................................................................................................................... 49 8.0 Comparator Module.................................................................................................................................................................... 51 9.0 Analog-to-Digital Converter (ADC) Module ................................................................................................................................ 61 10.0 Data EEPROM Memory ............................................................................................................................................................. 71 11.0 Capture/Compare/PWM (CCP) Module ..................................................................................................................................... 75 12.0 Special Features of the CPU...................................................................................................................................................... 83 13.0 Instruction Set Summary .......................................................................................................................................................... 101 14.0 Development Support............................................................................................................................................................... 111 15.0 Electrical Specifications............................................................................................................................................................ 115 16.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 137 17.0 Packaging Information.............................................................................................................................................................. 159 Appendix A: Data Sheet Revision History.......................................................................................................................................... 165 Appendix B: Migrating From Other PIC® Devices ............................................................................................................................. 165 The Microchip Web Site ..................................................................................................................................................................... 171 Customer Change Notification Service .............................................................................................................................................. 171 Customer Support.............................................................................................................................................................................. 171 Reader Response .............................................................................................................................................................................. 172 Product Identification System ............................................................................................................................................................ 173 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. PIC12F683 DS41211D-page 4 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 5 PIC12F683 1.0 DEVICE OVERVIEW The PIC12F683 is covered by this data sheet. It is available in 8-pin PDIP, SOIC and DFN-S packages. Figure 1-1 shows a block diagram of the PIC12F683 device. Table 1-1 shows the pinout description. FIGURE 1-1: PIC12F683 BLOCK DIAGRAM Flash Program Memory 13 Data Bus 8 Program 14 Bus Instruction Reg Program Counter RAM File Registers Direct Addr 7 RAM Addr 9 Addr MUX Indirect Addr FSR Reg STATUS Reg MUX ALU W Reg Instruction Decode & Control Timing OSC1/CLKIN Generation OSC2/CLKOUT 8 8 8 3 8-Level Stack 128 bytes 2k x 14 (13-bit) Power-up Timer Oscillator Start-up Timer Power-on Reset Watchdog Timer MCLR VSS Brown-out Reset 1 Analog Comparator Timer0 Timer1 Data EEPROM 256 bytes EEDATA EEADDR GP0 GP1 GP2 GP3 GP4 GP5 AN0 AN1 AN2 AN3 CIN- CIN+ COUT T0CKI INT T1CKI Configuration Internal Oscillator VREF T1G VDD 8 Timer2 CCP Block CCP1 CVREF Analog-to-Digital Converter PIC12F683 DS41211D-page 6 © 2007 Microchip Technology Inc. TABLE 1-1: PIC12F683 PINOUT DESCRIPTION Name Function Input Type Output Type Description VDD VDD Power — Positive supply GP5/T1CKI/OSC1/CLKIN GP5 TTL CMOS GPIO I/O with prog. pull-up and interrupt-on-change T1CKI ST — Timer1 clock OSC1 XTAL — Crystal/Resonator CLKIN ST — External clock input/RC oscillator connection GP4/AN3/T1G/OSC2/CLKOUT GP4 TTL CMOS GPIO I/O with prog. pull-up and interrupt-on-change AN3 AN — A/D Channel 3 input T1G ST — Timer1 gate OSC2 — XTAL Crystal/Resonator CLKOUT — CMOS FOSC/4 output GP3/MCLR/VPP GP3 TTL — GPIO input with interrupt-on-change MCLR ST — Master Clear with internal pull-up VPP HV — Programming voltage GP2/AN2/T0CKI/INT/COUT/CCP1 GP2 ST CMOS GPIO I/O with prog. pull-up and interrupt-on-change AN2 AN — A/D Channel 2 input T0CKI ST — Timer0 clock input INT ST — External Interrupt COUT — CMOS Comparator 1 output CCP1 ST CMOS Capture input/Compare output/PWM output GP1/AN1/CIN-/VREF/ICSPCLK GP1 TTL CMOS GPIO I/O with prog. pull-up and interrupt-on-change AN1 AN — A/D Channel 1 input CIN- AN — Comparator 1 input VREF AN — External Voltage Reference for A/D ICSPCLK ST — Serial Programming Clock GP0/AN0/CIN+/ICSPDAT/ULPWU GP0 TTL CMOS GPIO I/O with prog. pull-up and interrupt-on-change AN0 AN — A/D Channel 0 input CIN+ AN — Comparator 1 input ICSPDAT ST CMOS Serial Programming Data I/O ULPWU AN — Ultra Low-Power Wake-up input VSS VSS Power — Ground reference Legend: AN = Analog input or output CMOS = CMOS compatible input or output TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels HV = High Voltage XTAL = Crystal © 2007 Microchip Technology Inc. DS41211D-page 7 PIC12F683 2.0 MEMORY ORGANIZATION 2.1 Program Memory Organization The PIC12F683 has a 13-bit program counter capable of addressing an 8k x 14 program memory space. Only the first 2k x 14 (0000h-07FFh) for the PIC12F683 is physically implemented. Accessing a location above these boundaries will cause a wraparound within the first 2K x 14 space. The Reset vector is at 0000h and the interrupt vector is at 0004h (see Figure 2-1). FIGURE 2-1: PROGRAM MEMORY MAP AND STACK FOR THE PIC12F683 2.2 Data Memory Organization The data memory (see Figure 2-2) is partitioned into two banks, which contain the General Purpose Registers (GPR) and the Special Function Registers (SFR). The Special Function Registers are located in the first 32 locations of each bank. Register locations 20h-7Fh in Bank 0 and A0h-BFh in Bank 1 are General Purpose Registers, implemented as static RAM. Register locations F0h-FFh in Bank 1 point to addresses 70h-7Fh in Bank 0. All other RAM is unimplemented and returns ‘0’ when read. RP0 of the STATUS register is the bank select bit. RP0 0 → Bank 0 is selected PC<12:0> 1 → Bank 1 is selected 13 0000h 0004h 0005h 07FFh 0800h 1FFFh Stack Level 1 Stack Level 8 Reset Vector Interrupt Vector On-chip Program Memory CALL, RETURN RETFIE, RETLW Stack Level 2 Wraps to 0000h-07FFh Note: The IRP and RP1 bits of the STATUS register are reserved and should always be maintained as ‘0’s. PIC12F683 DS41211D-page 8 © 2007 Microchip Technology Inc. 2.2.1 GENERAL PURPOSE REGISTER FILE The register file is organized as 128 x 8 in the PIC12F683. Each register is accessed, either directly or indirectly, through the File Select Register FSR (see Section 2.4 “Indirect Addressing, INDF and FSR Registers”). 2.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers are registers used by the CPU and peripheral functions for controlling the desired operation of the device (see Table 2-1). These registers are static RAM. The special registers can be classified into two sets: core and peripheral. The Special Function Registers associated with the “core” are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. FIGURE 2-2: DATA MEMORY MAP OF THE PIC12F683 Indirect addr.(1) TMR0 PCL STATUS FSR GPIO PCLATH INTCON PIR1 TMR1L TMR1H T1CON 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h 7Fh BANK 0 Unimplemented data memory locations, read as ‘0’. Note 1: Not a physical register. CMCON0 VRCON General Purpose Registers 96 Bytes EEDAT EEADR EECON2(1) File Address File Address WPU IOC Indirect addr.(1) OPTION_REG PCL STATUS FSR TRISIO PCLATH INTCON PIE1 PCON 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h FFh BANK 1 ADRESH ADCON0 EECON1 ADRESL ANSEL BFh General Purpose Registers 32 Bytes Accesses 70h-7Fh F0h TMR2 T2CON CCPR1L CCPR1H CCP1CON WDTCON CMCON1 OSCCON OSCTUNE PR2 C0h EFh © 2007 Microchip Technology Inc. DS41211D-page 9 PIC12F683 TABLE 2-1: PIC12F683 SPECIAL REGISTERS SUMMARY BANK 0 Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 17, 90 01h TMR0 Timer0 Module Register xxxx xxxx 41, 90 02h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 17, 90 03h STATUS IRP(1) RP1(1) RP0 TO PD Z DC C 0001 1xxx 11, 90 04h FSR Indirect Data Memory Address Pointer xxxx xxxx 17, 90 05h GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx 31, 90 06h — Unimplemented — — 07h — Unimplemented — — 08h — Unimplemented — — 09h — Unimplemented — — 0Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 17, 90 0Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 13, 90 0Ch PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 15, 90 0Dh — Unimplemented — — 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 xxxx xxxx 44, 90 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 xxxx xxxx 44, 90 10h T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 47, 90 11h TMR2 Timer2 Module Register 0000 0000 49, 90 12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 50, 90 13h CCPR1L Capture/Compare/PWM Register 1 Low Byte xxxx xxxx 76, 90 14h CCPR1H Capture/Compare/PWM Register 1 High Byte xxxx xxxx 76, 90 15h CCP1CON — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 75, 90 16h — Unimplemented — — 17h — Unimplemented — — 18h WDTCON — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN ---0 1000 97, 90 19h CMCON0 — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 56, 90 1Ah CMCON1 — — — — — — T1GSS CMSYNC ---- --10 57, 90 1Bh — Unimplemented — — 1Ch — Unimplemented — — 1Dh — Unimplemented — — 1Eh ADRESH Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx 61,90 1Fh ADCON0 ADFM VCFG — — CHS1 CHS0 GO/DONE ADON 00-- 0000 65,90 Legend: – = unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: IRP and RP1 bits are reserved, always maintain these bits clear. PIC12F683 DS41211D-page 10 © 2007 Microchip Technology Inc. TABLE 2-2: PIC12F683 SPECIAL FUNCTION REGISTERS SUMMARY BANK 1 Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Page Bank 1 80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx 17, 90 81h OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 12, 90 82h PCL Program Counter’s (PC) Least Significant Byte 0000 0000 17, 90 83h STATUS IRP(1) RP1(1) RP0 TO PD Z DC C 0001 1xxx 11, 90 84h FSR Indirect Data Memory Address Pointer xxxx xxxx 17, 90 85h TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 32, 90 86h — Unimplemented — — 87h — Unimplemented — — 88h — Unimplemented — — 89h — Unimplemented — — 8Ah PCLATH — — — Write Buffer for upper 5 bits of Program Counter ---0 0000 17, 90 8Bh INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 13, 90 8Ch PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 14, 90 8Dh — Unimplemented — — 8Eh PCON — — ULPWUE SBOREN — — POR BOR --01 --qq 16, 90 8Fh OSCCON — IRCF2 IRCF1 IRCF0 OSTS(2) HTS LTS SCS -110 x000 20, 90 90h OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 24, 90 91h — Unimplemented — — 92h PR2 Timer2 Module Period Register 1111 1111 49, 90 93h — Unimplemented — — 94h — Unimplemented — — 95h WPU(3) — — WPU5 WPU4 — WPU2 WPU1 WPU0 --11 -111 34, 90 96h IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 34, 90 97h — Unimplemented — — 98h — Unimplemented — — 99h VRCON VREN — VRR — VR3 VR2 VR1 VR0 0-0- 0000 58, 90 9Ah EEDAT EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 0000 0000 71, 90 9Bh EEADR EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 0000 0000 71, 90 9Ch EECON1 — — — — WRERR WREN WR RD ---- x000 72, 91 9Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- 72, 91 9Eh ADRESL Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result xxxx xxxx 66, 91 9Fh ANSEL — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 33, 91 Legend: – = unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: IRP and RP1 bits are reserved, always maintain these bits clear. 2: OSTS bit of the OSCCON register reset to ‘0’ with Dual Speed Start-up and LP, HS or XT selected as the oscillator. 3: GP3 pull-up is enabled when MCLRE is ‘1’ in the Configuration Word register. © 2007 Microchip Technology Inc. DS41211D-page 11 PIC12F683 2.2.2.1 STATUS Register The STATUS register, shown in Register 2-1, contains: • Arithmetic status of the ALU • Reset status • Bank select bits for data memory (SRAM) The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. For example, CLRF STATUS, will clear the upper three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any Status bits. For other instructions not affecting any Status bits, see the “Instruction Set Summary”. Note 1: Bits IRP and RP1 of the STATUS register are not used by the PIC12F683 and should be maintained as clear. Use of these bits is not recommended, since this may affect upward compatibility with future products. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. REGISTER 2-1: STATUS: STATUS REGISTER Reserved Reserved R/W-0 R-1 R-1 R/W-x R/W-x R/W-x IRP RP1 RP0 TO PD Z DC C bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 IRP: This bit is reserved and should be maintained as ‘0’ bit 6 RP1: This bit is reserved and should be maintained as ‘0’ bit 5 RP0: Register Bank Select bit (used for direct addressing) 1 = Bank 1 (80h – FFh) 0 = Bank 0 (00h – 7Fh) bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit Carry/Borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is reversed. 1 = A carry-out from the 4th low-order bit of the result occurred 0 = No carry-out from the 4th low-order bit of the result bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register. PIC12F683 DS41211D-page 12 © 2007 Microchip Technology Inc. 2.2.2.2 OPTION Register The OPTION register is a readable and writable register, which contains various control bits to configure: • TMR0/WDT prescaler • External GP2/INT interrupt • TMR0 • Weak pull-ups on GPIO Note: To achieve a 1:1 prescaler assignment for Timer0, assign the prescaler to the WDT by setting PSA bit of the OPTION register to ‘1’ See Section 5.1.3 “Software Programmable Prescaler”. REGISTER 2-2: OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual PORT latch values in WPU register bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: A dedicated 16-bit WDT postscaler is available. See Section 12.6 “Watchdog Timer (WDT)” for more information. 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 BIT VALUE TIMER0 RATE WDT RATE © 2007 Microchip Technology Inc. DS41211D-page 13 PIC12F683 2.2.2.3 INTCON Register The INTCON register is a readable and writable register, which contains the various enable and flag bits for TMR0 register overflow, GPIO change and external GP2/INT pin interrupts. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 GIE PEIE T0IE INTE GPIE T0IF INTF GPIF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: Timer0 Overflow Interrupt Enable bit 1 = Enables the Timer0 interrupt 0 = Disables the Timer0 interrupt bit 4 INTE: GP2/INT External Interrupt Enable bit 1 = Enables the GP2/INT external interrupt 0 = Disables the GP2/INT external interrupt bit 3 GPIE: GPIO Change Interrupt Enable bit(1) 1 = Enables the GPIO change interrupt 0 = Disables the GPIO change interrupt bit 2 T0IF: Timer0 Overflow Interrupt Flag bit(2) 1 = Timer0 register has overflowed (must be cleared in software) 0 = Timer0 register did not overflow bit 1 INTF: GP2/INT External Interrupt Flag bit 1 = The GP2/INT external interrupt occurred (must be cleared in software) 0 = The GP2/INT external interrupt did not occur bit 0 GPIF: GPIO Change Interrupt Flag bit 1 = When at least one of the GPIO <5:0> pins changed state (must be cleared in software) 0 = None of the GPIO <5:0> pins have changed state Note 1: IOC register must also be enabled. 2: T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before clearing T0IF bit. PIC12F683 DS41211D-page 14 © 2007 Microchip Technology Inc. 2.2.2.4 PIE1 Register The PIE1 register contains the interrupt enable bits, as shown in Register 2-4. Note: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt. REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EEIE: EE Write Complete Interrupt Enable bit 1 = Enables the EE write complete interrupt 0 = Disables the EE write complete interrupt bit 6 ADIE: A/D Converter (ADC) Interrupt Enable bit 1 = Enables the ADC interrupt 0 = Disables the ADC interrupt bit 5 CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 4 Unimplemented: Read as ‘0’ bit 3 CMIE: Comparator Interrupt Enable bit 1 = Enables the Comparator 1 interrupt 0 = Disables the Comparator 1 interrupt bit 2 OSFIE: Oscillator Fail Interrupt Enable bit 1 = Enables the oscillator fail interrupt 0 = Disables the oscillator fail interrupt bit 1 TMR2IE: Timer2 to PR2 Match Interrupt Enable bit 1 = Enables the Timer2 to PR2 match interrupt 0 = Disables the Timer2 to PR2 match interrupt bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit 1 = Enables the Timer1 overflow interrupt 0 = Disables the Timer1 overflow interrupt © 2007 Microchip Technology Inc. DS41211D-page 15 PIC12F683 2.2.2.5 PIR1 Register The PIR1 register contains the interrupt flag bits, as shown in Register 2-5. Note: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE of the INTCON register. User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 2-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 EEIF: EEPROM Write Operation Interrupt Flag bit 1 = The write operation completed (must be cleared in software) 0 = The write operation has not completed or has not been started bit 6 ADIF: A/D Interrupt Flag bit 1 = A/D conversion complete 0 = A/D conversion has not completed or has not been started bit 5 CCP1IF: CCP1 Interrupt Flag bit Capture mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM mode: Unused in this mode bit 4 Unimplemented: Read as ‘0’ bit 3 CMIF: Comparator Interrupt Flag bit 1 = Comparator 1 output has changed (must be cleared in software) 0 = Comparator 1 output has not changed bit 2 OSFIF: Oscillator Fail Interrupt Flag bit 1 = System oscillator failed, clock input has changed to INTOSC (must be cleared in software) 0 = System clock operating bit 1 TMR2IF: Timer2 to PR2 Match Interrupt Flag bit 1 = Timer2 to PR2 match occurred (must be cleared in software) 0 = Timer2 to PR2 match has not occurred bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit 1 = Timer1 register overflowed (must be cleared in software) 0 = Timer1 has not overflowed PIC12F683 DS41211D-page 16 © 2007 Microchip Technology Inc. 2.2.2.6 PCON Register The Power Control (PCON) register contains flag bits (see Table 12-2) to differentiate between a: • Power-on Reset (POR) • Brown-out Reset (BOR) • Watchdog Timer Reset (WDT) • External MCLR Reset The PCON register also controls the Ultra Low-Power Wake-up and software enable of the BOR. The PCON register bits are shown in Register 2-6. REGISTER 2-6: PCON: POWER CONTROL REGISTER U-0 U-0 R/W-0 R/W-1 U-0 U-0 R/W-0 R/W-x — — ULPWUE SBOREN — — POR BOR bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5 ULPWUE: Ultra Low-Power Wake-Up Enable bit 1 = Ultra Low-Power Wake-up enabled 0 = Ultra Low-Power Wake-up disabled bit 4 SBOREN: Software BOR Enable bit(1) 1 = BOR enabled 0 = BOR disabled bit 3-2 Unimplemented: Read as ‘0’ bit 1 POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset occurs) Note 1: Set BOREN<1:0> = 01 in the Configuration Word register for this bit to control the BOR. © 2007 Microchip Technology Inc. DS41211D-page 17 PIC12F683 2.3 PCL and PCLATH The Program Counter (PC) is 13 bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any Reset, the PC is cleared. Figure 2-3 shows the two situations for the loading of the PC. The upper example in Figure 2-3 shows how the PC is loaded on a write to PCL (PCLATH<4:0> → PCH). The lower example in Figure 2-3 shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> → PCH). FIGURE 2-3: LOADING OF PC IN DIFFERENT SITUATIONS 2.3.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When performing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256-byte block). Refer to the Application Note AN556, “Implementing a Table Read” (DS00556). 2.3.2 STACK The PIC12F683 family has an 8-level x 13-bit wide hardware stack (see Figure 2-1). The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). 2.4 Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register indirectly results in a no operation (although Status bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit of the STATUS register, as shown in Figure 2-4. A simple program to clear RAM location 20h-2Fh using indirect addressing is shown in Example 2-1. EXAMPLE 2-1: INDIRECT ADDRESSING PC 12 8 7 0 5 PCLATH<4:0> PCLATH Instruction with ALU Result GOTO, CALL OPCODE<10:0> 8 PC 12 11 10 0 PCLATH<4:3> 11 PCH PCL 8 7 2 PCLATH PCH PCL PCL as Destination Note 1: There are no Status bits to indicate stack overflow or stack underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions or the vectoring to an interrupt address. MOVLW 0x20 ;initialize pointer MOVWF FSR ;to RAM NEXT CLRF INDF ;clear INDF register INCF FSR ;inc pointer BTFSS FSR,4 ;all done? GOTO NEXT ;no clear next CONTINUE ;yes continue PIC12F683 DS41211D-page 18 © 2007 Microchip Technology Inc. FIGURE 2-4: DIRECT/INDIRECT ADDRESSING PIC12F683 For memory map detail, see Figure 2-2. Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear. Data Memory Direct Addressing Indirect Addressing Bank Select Location Select RP1(1) RP0 6 From Opcode 0 IRP(1) 7 File Select Register 0 Bank Select Location Select 00 01 10 11 180h 1FFh 00h 7Fh Bank 0 Bank 1 Bank 2 Bank 3 Not Used © 2007 Microchip Technology Inc. DS41211D-page 19 PIC12F683 3.0 OSCILLATOR MODULE (WITH FAIL-SAFE CLOCK MONITOR) 3.1 Overview The Oscillator module has a wide variety of clock sources and selection features that allow it to be used in a wide range of applications while maximizing performance and minimizing power consumption. Figure 3-1 illustrates a block diagram of the Oscillator module. Clock sources can be configured from external oscillators, quartz crystal resonators, ceramic resonators and Resistor-Capacitor (RC) circuits. In addition, the system clock source can be configured from one of two internal oscillators, with a choice of speeds selectable via software. Additional clock features include: • Selectable system clock source between external or internal via software. • Two-Speed Start-up mode, which minimizes latency between external oscillator start-up and code execution. • Fail-Safe Clock Monitor (FSCM) designed to detect a failure of the external clock source (LP, XT, HS, EC or RC modes) and switch automatically to the internal oscillator. The Oscillator module can be configured in one of eight clock modes. 1. EC – External clock with I/O on OSC2/CLKOUT. 2. LP – 32 kHz Low-Power Crystal mode. 3. XT – Medium Gain Crystal or Ceramic Resonator Oscillator mode. 4. HS – High Gain Crystal or Ceramic Resonator mode. 5. RC – External Resistor-Capacitor (RC) with FOSC/4 output on OSC2/CLKOUT. 6. RCIO – External Resistor-Capacitor (RC) with I/O on OSC2/CLKOUT. 7. INTOSC – Internal oscillator with FOSC/4 output on OSC2 and I/O on OSC1/CLKIN. 8. INTOSCIO – Internal oscillator with I/O on OSC1/CLKIN and OSC2/CLKOUT. Clock Source modes are configured by the FOSC<2:0> bits in the Configuration Word register (CONFIG). The internal clock can be generated from two internal oscillators. The HFINTOSC is a calibrated high-frequency oscillator. The LFINTOSC is an uncalibrated low-frequency oscillator. FIGURE 3-1: PIC® MCU CLOCK SOURCE BLOCK DIAGRAM (CPU and Peripherals) OSC1 OSC2 Sleep External Oscillator LP, XT, HS, RC, RCIO, EC System Clock Postscaler MUX MUX 8 MHz 4 MHz 2 MHz 1 MHz 500 kHz 125 kHz 250 kHz IRCF<2:0> 111 110 101 100 011 010 001 000 31 kHz Power-up Timer (PWRT) FOSC<2:0> (Configuration Word Register) SCS<0> (OSCCON Register) Internal Oscillator (OSCCON Register) Watchdog Timer (WDT) Fail-Safe Clock Monitor (FSCM) HFINTOSC 8 MHz LFINTOSC 31 kHz INTOSC PIC12F683 DS41211D-page 20 © 2007 Microchip Technology Inc. 3.2 Oscillator Control The Oscillator Control (OSCCON) register (Figure 3-1) controls the system clock and frequency selection options. The OSCCON register contains the following bits: • Frequency selection bits (IRCF) • Frequency Status bits (HTS, LTS) • System clock control bits (OSTS, SCS) REGISTER 3-1: OSCCON: OSCILLATOR CONTROL REGISTER U-0 R/W-1 R/W-1 R/W-0 R-1 R-0 R-0 R/W-0 — IRCF2 IRCF1 IRCF0 OSTS(1) HTS LTS SCS bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-4 IRCF<2:0>: Internal Oscillator Frequency Select bits 111 = 8MHz 110 = 4 MHz (default) 101 = 2MHz 100 = 1MHz 011 = 500kHz 010 = 250kHz 001 = 125kHz 000 = 31 kHz (LFINTOSC) bit 3 OSTS: Oscillator Start-up Time-out Status bit(1) 1 = Device is running from the external clock defined by FOSC<2:0> of the Configuration Word register 0 = Device is running from the internal oscillator (HFINTOSC or LFINTOSC) bit 2 HTS: HFINTOSC Status bit (High Frequency – 8 MHz to 125 kHz) 1 = HFINTOSC is stable 0 = HFINTOSC is not stable bit 1 LTS: LFINTOSC Stable bit (Low Frequency – 31 kHz) 1 = LFINTOSC is stable 0 = LFINTOSC is not stable bit 0 SCS: System Clock Select bit 1 = Internal oscillator is used for system clock 0 = Clock source defined by FOSC<2:0> of the Configuration Word register Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe mode is enabled. © 2007 Microchip Technology Inc. DS41211D-page 21 PIC12F683 3.3 Clock Source Modes Clock Source modes can be classified as external or internal. • External Clock modes rely on external circuitry for the clock source. Examples are: Oscillator modules (EC mode), quartz crystal resonators or ceramic resonators (LP, XT and HS modes) and Resistor-Capacitor (RC) mode circuits. • Internal clock sources are contained internally within the Oscillator module. The Oscillator module has two internal oscillators: the 8 MHz High-Frequency Internal Oscillator (HFINTOSC) and the 31 kHz Low-Frequency Internal Oscillator (LFINTOSC). The system clock can be selected between external or internal clock sources via the System Clock Select (SCS) bit of the OSCCON register. See Section 3.6 “Clock Switching” for additional information. 3.4 External Clock Modes 3.4.1 OSCILLATOR START-UP TIMER (OST) If the Oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) counts 1024 oscillations from OSC1. This occurs following a Power-on Reset (POR) and when the Power-up Timer (PWRT) has expired (if configured), or a wake-up from Sleep. During this time, the program counter does not increment and program execution is suspended. The OST ensures that the oscillator circuit, using a quartz crystal resonator or ceramic resonator, has started and is providing a stable system clock to the Oscillator module. When switching between clock sources, a delay is required to allow the new clock to stabilize. These oscillator delays are shown in Table 3-1. In order to minimize latency between external oscillator start-up and code execution, the Two-Speed Clock Start-up mode can be selected (see Section 3.7 “Two-Speed Clock Start-up Mode”). TABLE 3-1: OSCILLATOR DELAY EXAMPLES 3.4.2 EC MODE The External Clock (EC) mode allows an externally generated logic level as the system clock source. When operating in this mode, an external clock source is connected to the OSC1 input and the OSC2 is available for general purpose I/O. Figure 3-2 shows the pin connections for EC mode. The Oscillator Start-up Timer (OST) is disabled when EC mode is selected. Therefore, there is no delay in operation after a Power-on Reset (POR) or wake-up from Sleep. Because the PIC® MCU design is fully static, stopping the external clock input will have the effect of halting the device while leaving all data intact. Upon restarting the external clock, the device will resume operation as if no time had elapsed. FIGURE 3-2: EXTERNAL CLOCK (EC) MODE OPERATION Switch From Switch To Frequency Oscillator Delay Sleep/POR LFINTOSC HFINTOSC 31 kHz 125 kHz to 8 MHz Oscillator Warm-Up Delay (TWARM) Sleep/POR EC, RC DC – 20 MHz 2 instruction cycles LFINTOSC (31 kHz) EC, RC DC – 20 MHz 1 cycle of each Sleep/POR LP, XT, HS 32 kHz to 20 MHz 1024 Clock Cycles (OST) LFINTOSC (31 kHz) HFINTOSC 125 kHz to 8 MHz 1 μs (approx.) OSC1/CLKIN I/O OSC2/CLKOUT(1) Clock from Ext. System PIC® MCU Note 1: Alternate pin functions are listed in the Device Overview. PIC12F683 DS41211D-page 22 © 2007 Microchip Technology Inc. 3.4.3 LP, XT, HS MODES The LP, XT and HS modes support the use of quartz crystal resonators or ceramic resonators connected to OSC1 and OSC2 (Figure 3-3). The mode selects a low, medium or high gain setting of the internal inverter-amplifier to support various resonator types and speed. LP Oscillator mode selects the lowest gain setting of the internal inverter-amplifier. LP mode current consumption is the least of the three modes. This mode is designed to drive only 32.768 kHz tuning-fork type crystals (watch crystals). XT Oscillator mode selects the intermediate gain setting of the internal inverter-amplifier. XT mode current consumption is the medium of the three modes. This mode is best suited to drive resonators with a medium drive level specification. HS Oscillator mode selects the highest gain setting of the internal inverter-amplifier. HS mode current consumption is the highest of the three modes. This mode is best suited for resonators that require a high drive setting. Figure 3-3 and Figure 3-4 show typical circuits for quartz crystal and ceramic resonators, respectively. FIGURE 3-3: QUARTZ CRYSTAL OPERATION (LP, XT OR HS MODE) FIGURE 3-4: CERAMIC RESONATOR OPERATION (XT OR HS MODE) Note 1: A series resistor (RS) may be required for quartz crystals with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 MΩ to 10 MΩ). C1 C2 Quartz RS(1) OSC1/CLKIN RF(2) Sleep To Internal Logic PIC® MCU Crystal OSC2/CLKOUT Note 1: Quartz crystal characteristics vary according to type, package and manufacturer. The user should consult the manufacturer data sheets for specifications and recommended application. 2: Always verify oscillator performance over the VDD and temperature range that is expected for the application. 3: For oscillator design assistance, reference the following Microchip Applications Notes: • AN826, “Crystal Oscillator Basics and Crystal Selection for rfPIC® and PIC® Devices” (DS00826) • AN849, “Basic PIC® Oscillator Design” (DS00849) • AN943, “Practical PIC® Oscillator Analysis and Design” (DS00943) • AN949, “Making Your Oscillator Work” (DS00949) Note 1: A series resistor (RS) may be required for ceramic resonators with low drive level. 2: The value of RF varies with the Oscillator mode selected (typically between 2 MΩ to 10 MΩ). 3: An additional parallel feedback resistor (RP) may be required for proper ceramic resonator operation. C1 C2 Ceramic RS(1) OSC1/CLKIN RF(2) Sleep To Internal Logic PIC® MCU RP(3) Resonator OSC2/CLKOUT © 2007 Microchip Technology Inc. DS41211D-page 23 PIC12F683 3.4.4 EXTERNAL RC MODES The external Resistor-Capacitor (RC) modes support the use of an external RC circuit. This allows the designer maximum flexibility in frequency choice while keeping costs to a minimum when clock accuracy is not required. There are two modes: RC and RCIO. In RC mode, the RC circuit connects to OSC1. OSC2/CLKOUT outputs the RC oscillator frequency divided by 4. This signal may be used to provide a clock for external circuitry, synchronization, calibration, test or other application requirements. Figure 3-5 shows the external RC mode connections. FIGURE 3-5: EXTERNAL RC MODES In RCIO mode, the RC circuit is connected to OSC1. OSC2 becomes an additional general purpose I/O pin. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. Other factors affecting the oscillator frequency are: • threshold voltage variation • component tolerances • packaging variations in capacitance The user also needs to take into account variation due to tolerance of external RC components used. 3.5 Internal Clock Modes The Oscillator module has two independent, internal oscillators that can be configured or selected as the system clock source. 1. The HFINTOSC (High-Frequency Internal Oscillator) is factory calibrated and operates at 8 MHz. The frequency of the HFINTOSC can be user-adjusted via software using the OSCTUNE register (Register 3-2). 2. The LFINTOSC (Low-Frequency Internal Oscillator) is uncalibrated and operates at 31 kHz. The system clock speed can be selected via software using the Internal Oscillator Frequency Select bits IRCF<2:0> of the OSCCON register. The system clock can be selected between external or internal clock sources via the System Clock Selection (SCS) bit of the OSCCON register. See Section 3.6 “Clock Switching” for more information. 3.5.1 INTOSC AND INTOSCIO MODES The INTOSC and INTOSCIO modes configure the internal oscillators as the system clock source when the device is programmed using the oscillator selection or the FOSC<2:0> bits in the Configuration Word register (CONFIG). See Section 12.0 “Special Features of the CPU” for more information. In INTOSC mode, OSC1/CLKIN is available for general purpose I/O. OSC2/CLKOUT outputs the selected internal oscillator frequency divided by 4. The CLKOUT signal may be used to provide a clock for external circuitry, synchronization, calibration, test or other application requirements. In INTOSCIO mode, OSC1/CLKIN and OSC2/CLKOUT are available for general purpose I/O. 3.5.2 HFINTOSC The High-Frequency Internal Oscillator (HFINTOSC) is a factory calibrated 8 MHz internal clock source. The frequency of the HFINTOSC can be altered via software using the OSCTUNE register (Register 3-2). The output of the HFINTOSC connects to a postscaler and multiplexer (see Figure 3-1). One of seven frequencies can be selected via software using the IRCF<2:0> bits of the OSCCON register. See Section 3.5.4 “Frequency Select Bits (IRCF)” for more information. The HFINTOSC is enabled by selecting any frequency between 8 MHz and 125 kHz by setting the IRCF<2:0> bits of the OSCCON register ≠ 000. Then, set the System Clock Source (SCS) bit of the OSCCON register to ‘1’ or enable Two-Speed Start-up by setting the IESO bit in the Configuration Word register (CONFIG) to ‘1’. The HF Internal Oscillator (HTS) bit of the OSCCON register indicates whether the HFINTOSC is stable or not. OSC2/CLKOUT(1) CEXT REXT PIC® MCU OSC1/CLKIN FOSC/4 or Internal Clock VDD VSS Recommended values: 10 kΩ ≤ REXT ≤ 100 kΩ, <3V 3 kΩ ≤ REXT ≤ 100 kΩ, 3-5V CEXT > 20 pF, 2-5V Note 1: Alternate pin functions are listed in the Device Overview. 2: Output depends upon RC or RCIO clock mode. I/O(2) PIC12F683 DS41211D-page 24 © 2007 Microchip Technology Inc. 3.5.2.1 OSCTUNE Register The HFINTOSC is factory calibrated but can be adjusted in software by writing to the OSCTUNE register (Register 3-2). The default value of the OSCTUNE register is ‘0’. The value is a 5-bit two’s complement number. When the OSCTUNE register is modified, the HFINTOSC frequency will begin shifting to the new frequency. Code execution continues during this shift. There is no indication that the shift has occurred. OSCTUNE does not affect the LFINTOSC frequency. Operation of features that depend on the LFINTOSC clock source frequency, such as the Power-up Timer (PWRT), Watchdog Timer (WDT), Fail-Safe Clock Monitor (FSCM) and peripherals, are not affected by the change in frequency. REGISTER 3-2: OSCTUNE: OSCILLATOR TUNING REGISTER U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — — TUN4 TUN3 TUN2 TUN1 TUN0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-0 TUN<4:0>: Frequency Tuning bits 01111 = Maximum frequency 01110 = • • • 00001 = 00000 = Oscillator module is running at the calibrated frequency. 11111 = • • • 10000 = Minimum frequency © 2007 Microchip Technology Inc. DS41211D-page 25 PIC12F683 3.5.3 LFINTOSC The Low-Frequency Internal Oscillator (LFINTOSC) is an uncalibrated 31 kHz internal clock source. The output of the LFINTOSC connects to a postscaler and multiplexer (see Figure 3-1). Select 31 kHz, via software, using the IRCF<2:0> bits of the OSCCON register. See Section 3.5.4 “Frequency Select Bits (IRCF)” for more information. The LFINTOSC is also the frequency for the Power-up Timer (PWRT), Watchdog Timer (WDT) and Fail-Safe Clock Monitor (FSCM). The LFINTOSC is enabled by selecting 31 kHz (IRCF<2:0> bits of the OSCCON register = 000) as the system clock source (SCS bit of the OSCCON register = 1), or when any of the following are enabled: • Two-Speed Start-up IESO bit of the Configuration Word register = 1 and IRCF<2:0> bits of the OSCCON register = 000 • Power-up Timer (PWRT) • Watchdog Timer (WDT) • Fail-Safe Clock Monitor (FSCM) The LF Internal Oscillator (LTS) bit of the OSCCON register indicates whether the LFINTOSC is stable or not. 3.5.4 FREQUENCY SELECT BITS (IRCF) The output of the 8 MHz HFINTOSC and 31 kHz LFINTOSC connects to a postscaler and multiplexer (see Figure 3-1). The Internal Oscillator Frequency Select bits IRCF<2:0> of the OSCCON register select the frequency output of the internal oscillators. One of eight frequencies can be selected via software: • 8 MHz • 4 MHz (Default after Reset) • 2 MHz • 1 MHz • 500 kHz • 250 kHz • 125 kHz • 31 kHz (LFINTOSC) 3.5.5 HF AND LF INTOSC CLOCK SWITCH TIMING When switching between the LFINTOSC and the HFINTOSC, the new oscillator may already be shut down to save power (see Figure 3-6). If this is the case, there is a delay after the IRCF<2:0> bits of the OSCCON register are modified before the frequency selection takes place. The LTS and HTS bits of the OSCCON register will reflect the current active status of the LFINTOSC and HFINTOSC oscillators. The timing of a frequency selection is as follows: 1. IRCF<2:0> bits of the OSCCON register are modified. 2. If the new clock is shut down, a clock start-up delay is started. 3. Clock switch circuitry waits for a falling edge of the current clock. 4. CLKOUT is held low and the clock switch circuitry waits for a rising edge in the new clock. 5. CLKOUT is now connected with the new clock. LTS and HTS bits of the OSCCON register are updated as required. 6. Clock switch is complete. See Figure 3-1 for more details. If the internal oscillator speed selected is between 8 MHz and 125 kHz, there is no start-up delay before the new frequency is selected. This is because the old and new frequencies are derived from the HFINTOSC via the postscaler and multiplexer. Start-up delay specifications are located in the Electrical Specifications Chapter of this data sheet, under AC Specifications (Oscillator Module). Note: Following any Reset, the IRCF<2:0> bits of the OSCCON register are set to ‘110’ and the frequency selection is set to 4 MHz. The user can modify the IRCF bits to select a different frequency. PIC12F683 DS41211D-page 26 © 2007 Microchip Technology Inc. FIGURE 3-6: INTERNAL OSCILLATOR SWITCH TIMING HFINTOSC LFINTOSC IRCF <2:0> System Clock HFINTOSC LFINTOSC IRCF <2:0> System Clock HF LF(1) ≠ 0 = 0 ≠ 0 = 0 Start-up Time 2-cycle Sync Running 2-cycle Sync Running HFINTOSC LFINTOSC (FSCM and WDT disabled) Note 1: When going from LF to HF. HFINTOSC LFINTOSC (Either FSCM or WDT enabled) LFINTOSC HFINTOSC IRCF <2:0> System Clock = 0 ≠ 0 Start-up Time 2-cycle Sync Running LFINTOSC HFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled © 2007 Microchip Technology Inc. DS41211D-page 27 PIC12F683 3.6 Clock Switching The system clock source can be switched between external and internal clock sources via software using the System Clock Select (SCS) bit of the OSCCON register. 3.6.1 SYSTEM CLOCK SELECT (SCS) BIT The System Clock Select (SCS) bit of the OSCCON register selects the system clock source that is used for the CPU and peripherals. • When the SCS bit of the OSCCON register = 0, the system clock source is determined by configuration of the FOSC<2:0> bits in the Configuration Word register (CONFIG). • When the SCS bit of the OSCCON register = 1, the system clock source is chosen by the internal oscillator frequency selected by the IRCF<2:0> bits of the OSCCON register. After a Reset, the SCS bit of the OSCCON register is always cleared. 3.6.2 OSCILLATOR START-UP TIME-OUT STATUS (OSTS) BIT The Oscillator Start-up Time-out Status (OSTS) bit of the OSCCON register indicates whether the system clock is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Word register (CONFIG), or from the internal clock source. In particular, OSTS indicates that the Oscillator Start-up Timer (OST) has timed out for LP, XT or HS modes. 3.7 Two-Speed Clock Start-up Mode Two-Speed Start-up mode provides additional power savings by minimizing the latency between external oscillator start-up and code execution. In applications that make heavy use of the Sleep mode, Two-Speed Start-up will remove the external oscillator start-up time from the time spent awake and can reduce the overall power consumption of the device. This mode allows the application to wake-up from Sleep, perform a few instructions using the INTOSC as the clock source and go back to Sleep without waiting for the primary oscillator to become stable. When the Oscillator module is configured for LP, XT or HS modes, the Oscillator Start-up Timer (OST) is enabled (see Section 3.4.1 “Oscillator Start-up Timer (OST)”). The OST will suspend program execution until 1024 oscillations are counted. Two-Speed Start-up mode minimizes the delay in code execution by operating from the internal oscillator as the OST is counting. When the OST count reaches 1024 and the OSTS bit of the OSCCON register is set, program execution switches to the external oscillator. 3.7.1 TWO-SPEED START-UP MODE CONFIGURATION Two-Speed Start-up mode is configured by the following settings: • IESO (of the Configuration Word register) = 1; Internal/External Switchover bit (Two-Speed Start-up mode enabled). • SCS (of the OSCCON register) = 0. • FOSC<2:0> bits in the Configuration Word register (CONFIG) configured for LP, XT or HS mode. Two-Speed Start-up mode is entered after: • Power-on Reset (POR) and, if enabled, after Power-up Timer (PWRT) has expired, or • Wake-up from Sleep. If the external clock oscillator is configured to be anything other than LP, XT or HS mode, then Two-Speed Start-up is disabled. This is because the external clock oscillator does not require any stabilization time after POR or an exit from Sleep. 3.7.2 TWO-SPEED START-UP SEQUENCE 1. Wake-up from Power-on Reset or Sleep. 2. Instructions begin execution by the internal oscillator at the frequency set in the IRCF<2:0> bits of the OSCCON register. 3. OST enabled to count 1024 clock cycles. 4. OST timed out, wait for falling edge of the internal oscillator. 5. OSTS is set. 6. System clock held low until the next falling edge of new clock (LP, XT or HS mode). 7. System clock is switched to external clock source. Note: Any automatic clock switch, which may occur from Two-Speed Start-up or Fail-Safe Clock Monitor, does not update the SCS bit of the OSCCON register. The user can monitor the OSTS bit of the OSCCON register to determine the current system clock source. Note: Executing a SLEEP instruction will abort the oscillator start-up time and will cause the OSTS bit of the OSCCON register to remain clear. PIC12F683 DS41211D-page 28 © 2007 Microchip Technology Inc. 3.7.3 CHECKING TWO-SPEED CLOCK STATUS Checking the state of the OSTS bit of the OSCCON register will confirm if the microcontroller is running from the external clock source, as defined by the FOSC<2:0> bits in the Configuration Word register (CONFIG), or the internal oscillator. FIGURE 3-7: TWO-SPEED START-UP 0 1 1022 1023 PC + 1 TOST HFINTOSC OSC1 OSC2 Program Counter System Clock PC - N PC © 2007 Microchip Technology Inc. DS41211D-page 29 PIC12F683 3.8 Fail-Safe Clock Monitor The Fail-Safe Clock Monitor (FSCM) allows the device to continue operating should the external oscillator fail. The FSCM can detect oscillator failure any time after the Oscillator Start-up Timer (OST) has expired. The FSCM is enabled by setting the FCMEN bit in the Configuration Word register (CONFIG). The FSCM is applicable to all external oscillator modes (LP, XT, HS, EC, RC and RCIO). FIGURE 3-8: FSCM BLOCK DIAGRAM 3.8.1 FAIL-SAFE DETECTION The FSCM module detects a failed oscillator by comparing the external oscillator to the FSCM sample clock. The sample clock is generated by dividing the LFINTOSC by 64. See Figure 3-8. Inside the fail detector block is a latch. The external clock sets the latch on each falling edge of the external clock. The sample clock clears the latch on each rising edge of the sample clock. A failure is detected when an entire half-cycle of the sample clock elapses before the primary clock goes low. 3.8.2 FAIL-SAFE OPERATION When the external clock fails, the FSCM switches the device clock to an internal clock source and sets the bit flag OSFIF of the PIR1 register. Setting this flag will generate an interrupt if the OSFIE bit of the PIE1 register is also set. The device firmware can then take steps to mitigate the problems that may arise from a failed clock. The system clock will continue to be sourced from the internal clock source until the device firmware successfully restarts the external oscillator and switches back to external operation. The internal clock source chosen by the FSCM is determined by the IRCF<2:0> bits of the OSCCON register. This allows the internal oscillator to be configured before a failure occurs. 3.8.3 FAIL-SAFE CONDITION CLEARING The Fail-Safe condition is cleared after a Reset, executing a SLEEP instruction or toggling the SCS bit of the OSCCON register. When the SCS bit is toggled, the OST is restarted. While the OST is running, the device continues to operate from the INTOSC selected in OSCCON. When the OST times out, the Fail-Safe condition is cleared and the device will be operating from the external clock source. The Fail-Safe condition must be cleared before the OSFIF flag can be cleared. 3.8.4 RESET OR WAKE-UP FROM SLEEP The FSCM is designed to detect an oscillator failure after the Oscillator Start-up Timer (OST) has expired. The OST is used after waking up from Sleep and after any type of Reset. The OST is not used with the EC or RC Clock modes so that the FSCM will be active as soon as the Reset or wake-up has completed. When the FSCM is enabled, the Two-Speed Start-up is also enabled. Therefore, the device will always be executing code while the OST is operating. External LFINTOSC ÷ 64 S R Q 31 kHz (~32 μs) 488 Hz (~2 ms) Clock Monitor Latch Clock Failure Detected Oscillator Clock Q Sample Clock Note: Due to the wide range of oscillator start-up times, the Fail-Safe circuit is not active during oscillator start-up (i.e., after exiting Reset or Sleep). After an appropriate amount of time, the user should check the OSTS bit of the OSCCON register to verify the oscillator start-up and that the system clock switchover has successfully completed. PIC12F683 DS41211D-page 30 © 2007 Microchip Technology Inc. FIGURE 3-9: FSCM TIMING DIAGRAM TABLE 3-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets(1) CONFIG(2) CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — — INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x OSCCON — IRCF2 IRCF1 IRCF0 OSTS HTS LTS SCS -110 x000 -110 x000 OSCTUNE — — — TUN4 TUN3 TUN2 TUN1 TUN0 ---0 0000 ---u uuuu PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 000- 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by oscillators. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. 2: See Configuration Word register (Register 12-1) for operation of all register bits. OSCFIF System Clock Output Sample Clock Failure Detected Oscillator Failure Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in this example have been chosen for clarity. (Q) Test Test Test Clock Monitor Output © 2007 Microchip Technology Inc. DS41211D-page 31 PIC12F683 4.0 GPIO PORT There are as many as six general purpose I/O pins available. Depending on which peripherals are enabled, some or all of the pins may not be available as general purpose I/O. In general, when a peripheral is enabled, the associated pin may not be used as a general purpose I/O pin. 4.1 GPIO and the TRISIO Registers GPIO is a 6-bit wide, bidirectional port. The corresponding data direction register is TRISIO. Setting a TRISIO bit (= 1) will make the corresponding GPIO pin an input (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISIO bit (= 0) will make the corresponding GPIO pin an output (i.e., put the contents of the output latch on the selected pin). An exception is GP3, which is input only and its TRISIO bit will always read as ‘1’. Example 4-1 shows how to initialize GPIO. Reading the GPIO register reads the status of the pins, whereas writing to it will write to the PORT latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, this value is modified and then written to the PORT data latch. GP3 reads ‘0’ when MCLRE = 1. The TRISIO register controls the direction of the GPIO pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISIO register are maintained set when using them as analog inputs. I/O pins configured as analog input always read ‘0’. EXAMPLE 4-1: INITIALIZING GPIO Note: The ANSEL and CMCON0 registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’. BANKSEL GPIO ; CLRF GPIO ;Init GPIO MOVLW 07h ;Set GP<2:0> to MOVWF CMCON0 ;digital I/O BANKSEL ANSEL ; CLRF ANSEL ;digital I/O MOVLW 0Ch ;Set GP<3:2> as inputs MOVWF TRISIO ;and set GP<5:4,1:0> ;as outputs REGISTER 4-1: GPIO: GENERAL PURPOSE I/O REGISTER U-0 U-0 R/W-x R/W-0 R-x R/W-0 R/W-0 R/W-0 — — GP5 GP4 GP3 GP2 GP1 GP0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 GP<5:0>: GPIO I/O Pin bit 1 = Port pin is > VIH 0 = Port pin is < VIL PIC12F683 DS41211D-page 32 © 2007 Microchip Technology Inc. 4.2 Additional Pin Functions Every GPIO pin on the PIC12F683 has an interrupt-on-change option and a weak pull-up option. GP0 has an Ultra Low-Power Wake-up option. The next three sections describe these functions. 4.2.1 ANSEL REGISTER The ANSEL register is used to configure the Input mode of an I/O pin to analog. Setting the appropriate ANSEL bit high will cause all digital reads on the pin to be read as ‘0’ and allow analog functions on the pin to operate correctly. The state of the ANSEL bits has no affect on digital output functions. A pin with TRIS clear and ANSEL set will still operate as a digital output, but the Input mode will be analog. This can cause unexpected behavior when executing read-modify-write instructions on the affected port. 4.2.2 WEAK PULL-UPS Each of the GPIO pins, except GP3, has an individually configurable internal weak pull-up. Control bits WPUx enable or disable each pull-up. Refer to Register 4-4. Each weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset by the GPPU bit of the OPTION register). A weak pull-up is automatically enabled for GP3 when configured as MCLR and disabled when GP3 is an I/O. There is no software control of the MCLR pull-up. 4.2.3 INTERRUPT-ON-CHANGE Each of the GPIO pins is individually configurable as an interrupt-on-change pin. Control bits IOCx enable or disable the interrupt function for each pin. Refer to Register 4-5. The interrupt-on-change is disabled on a Power-on Reset. For enabled interrupt-on-change pins, the values are compared with the old value latched on the last read of GPIO. The ‘mismatch’ outputs of the last read are OR’d together to set the GPIO Change Interrupt Flag bit (GPIF) in the INTCON register (Register 2-3). This interrupt can wake the device from Sleep. The user, in the Interrupt Service Routine, clears the interrupt by: a) Any read or write of GPIO. This will end the mismatch condition, then, b) Clear the flag bit GPIF. A mismatch condition will continue to set flag bit GPIF. Reading GPIO will end the mismatch condition and allow flag bit GPIF to be cleared. The latch holding the last read value is not affected by a MCLR nor Brown-out Reset. After these resets, the GPIF flag will continue to be set if a mismatch is present. REGISTER 4-2: TRISIO GPIO TRI-STATE REGISTER U-0 U-0 R/W-1 R/W-1 R-1 R/W-1 R/W-1 R/W-1 — — TRISIO5(2,3) TRISIO4(2) TRISIO3(1) TRISIO2 TRISIO1 TRISIO0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5:4 TRISIO<5:4>: GPIO Tri-State Control bit 1 = GPIO pin configured as an input (tri-stated) 0 = GPIO pin configured as an output bit 3 TRISIO<3>: GPIO Tri-State Control bit Input only bit 2:0 TRISIO<2:0>: GPIO Tri-State Control bit 1 = GPIO pin configured as an input (tri-stated) 0 = GPIO pin configured as an output Note 1: TRISIO<3> always reads ‘1’. 2: TRISIO<5:4> always reads ‘1’ in XT, HS and LP OSC modes. 3: TRISIO<5> always reads ‘1’ in RC and RCIO and EC modes. Note: If a change on the I/O pin should occur when any GPIO operation is being executed, then the GPIF interrupt flag may not get set. © 2007 Microchip Technology Inc. DS41211D-page 33 PIC12F683 REGISTER 4-3: ANSEL: ANALOG SELECT REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-1 R/W-1 — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-4 ADCS<2:0>: A/D Conversion Clock Select bits 000 = FOSC/2 001 = FOSC/8 010 = FOSC/32 x11 = FRC (clock derived from a dedicated internal oscillator = 500 kHz max) 100 = FOSC/4 101 = FOSC/16 110 = FOSC/64 bit 3-0 ANS<3:0>: Analog Select bits Analog select between analog or digital function on pins AN<3:0>, respectively. 1 = Analog input. Pin is assigned as analog input(1). 0 = Digital I/O. Pin is assigned to port or special function. Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and interrupt-on-change, if available. The corresponding TRIS bit must be set to Input mode in order to allow external control of the voltage on the pin. PIC12F683 DS41211D-page 34 © 2007 Microchip Technology Inc. REGISTER 4-4: WPU: WEAK PULL-UP REGISTER U-0 U-0 R/W-1 R/W-1 U-0 R/W-1 R/W-1 R/W-1 — — WPU5 WPU4 — WPU2 WPU1 WPU0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 WPU<5:4>: Weak Pull-up Control bits 1 = Pull-up enabled 0 = Pull-up disabled bit 3 Unimplemented: Read as ‘0’ bit 2-0 WPU<2:0>: Weak Pull-up Control bits 1 = Pull-up enabled 0 = Pull-up disabled Note 1: Global GPPU must be enabled for individual pull-ups to be enabled. 2: The weak pull-up device is automatically disabled if the pin is in Output mode (TRISIO = 0). 3: The GP3 pull-up is enabled when configured as MCLR and disabled as an I/O in the Configuration Word. 4: WPU<5:4> always reads ‘1’ in XT, HS and LP OSC modes. REGISTER 4-5: IOC: INTERRUPT-ON-CHANGE GPIO REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-0 IOC<5:0>: Interrupt-on-change GPIO Control bits 1 = Interrupt-on-change enabled 0 = Interrupt-on-change disabled Note 1: Global Interrupt Enable (GIE) must be enabled for individual interrupts to be recognized. 2: IOC<5:4> always reads ‘0’ in XT, HS and LP OSC modes. © 2007 Microchip Technology Inc. DS41211D-page 35 PIC12F683 4.2.4 ULTRA LOW-POWER WAKE-UP The Ultra Low-Power Wake-up (ULPWU) on GP0 allows a slow falling voltage to generate an interrupt- on-change on GP0 without excess current consumption. The mode is selected by setting the ULPWUE bit of the PCON register. This enables a small current sink which can be used to discharge a capacitor on GP0. To use this feature, the GP0 pin is configured to output ‘1’ to charge the capacitor, interrupt-on-change for GP0 is enabled and GP0 is configured as an input. The ULPWUE bit is set to begin the discharge and a SLEEP instruction is performed. When the voltage on GP0 drops below VIL, an interrupt will be generated which will cause the device to wake-up. Depending on the state of the GIE bit of the INTCON register, the device will either jump to the interrupt vector (0004h) or execute the next instruction when the interrupt event occurs. See Section 4.2.3 “Interrupt-on-Change” and Section 12.4.3 “GPIO Interrupt” for more information. This feature provides a low-power technique for periodically waking up the device from Sleep. The time-out is dependent on the discharge time of the RC circuit on GP0. See Example 4-2 for initializing the Ultra Low-Power Wake-up module. The series resistor provides overcurrent protection for the GP0 pin and can allow for software calibration of the time-out (see Figure 4-1). A timer can be used to measure the charge time and discharge time of the capacitor. The charge time can then be adjusted to provide the desired interrupt delay. This technique will compensate for the affects of temperature, voltage and component accuracy. The Ultra Low-Power Wake-up peripheral can also be configured as a simple Programmable Low-Voltage Detect or temperature sensor. EXAMPLE 4-2: ULTRA LOW-POWER WAKE-UP INITIALIZATION Note: For more information, refer to the Application Note AN879, “Using the Microchip Ultra Low-Power Wake-up Module” (DS00879). BANKSEL CMCON0 ; MOVLW H’7’ ;Turn off MOVWF CMCON0 ;comparators BANKSEL ANSEL ; BCF ANSEL,0 ;RA0 to digital I/O BCF TRISA,0 ;Output high to BANKSEL PORTA ; BSF PORTA,0 ;charge capacitor CALL CapDelay ; BANKSEL PCON ; BSF PCON,ULPWUE ;Enable ULP Wake-up BSF IOCA,0 ;Select RA0 IOC BSF TRISA,0 ;RA0 to input MOVLW B’10001000’ ;Enable interrupt MOVWF INTCON ; and clear flag SLEEP ;Wait for IOC NOP ; PIC12F683 DS41211D-page 36 © 2007 Microchip Technology Inc. 4.2.5 PIN DESCRIPTIONS AND DIAGRAMS Each GPIO pin is multiplexed with other functions. The pins and their combined functions are briefly described here. For specific information about individual functions such as the comparator or the ADC, refer to the appropriate section in this data sheet. 4.2.5.1 GP0/AN0/CIN+/ICSPDAT/ULPWU Figure 4-1 shows the diagram for this pin. The GP0 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the ADC • an analog input to the comparator • In-Circuit Serial Programming™ data • an analog input to the Ultra Low-Power Wake-up FIGURE 4-1: BLOCK DIAGRAM OF GP0 I/O pin VDD VSS D CK Q Q D CK Q Q D CK Q Q D CK Q Q VDD D EN Q D EN Q Weak RD GPIO RD WR WR RD WR IOC RD IOC Interrupt-on- To Comparator Analog Input Mode(1) GPPU Analog Input Mode(1) Change Q3 WR RD 0 1 IULP WPU Data Bus WPU GPIO TRISIO TRISIO GPIO Note 1: Comparator mode and ANSEL determines Analog Input mode. VT ULPWUE -+ VSS To A/D Converter © 2007 Microchip Technology Inc. DS41211D-page 37 PIC12F683 4.2.5.2 GP1/AN1/CIN-/VREF/ICSPCLK Figure 4-2 shows the diagram for this pin. The GP1 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the ADC • a analog input to the comparator • a voltage reference input for the ADC • In-Circuit Serial Programming clock FIGURE 4-2: BLOCK DIAGRAM OF GP1 4.2.5.3 GP2/AN2/T0CKI/INT/COUT/CCP1 Figure 4-3 shows the diagram for this pin. The GP2 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the ADC • the clock input for Timer0 • an external edge triggered interrupt • a digital output from the Comparator • a digital input/output for the CCP (refer to Section 11.0 “Capture/Compare/PWM (CCP) Module”). FIGURE 4-3: BLOCK DIAGRAM OF GP2 I/O pin VDD VSS D CK Q Q D CK Q Q D CK Q Q D CK Q Q VDD D EN Q D EN Q Weak Data WR WPU RD WPU RD GPIO RD GPIO WR GPIO WR TRISIO RD TRISIO WR IOC RD IOC Interrupt-on- To Comparator Analog Input Mode(1) GPPU Analog Input Mode(1) change Bus Note 1: Comparator mode and ANSEL determines Analog Input mode. Q3 To A/D Converter I/O pin VDD VSS D CK Q Q D CK Q Q D CK Q Q D CK Q Q VDD D EN Q D EN Q Weak Analog Input Mode Data WR WPU RD WPU RD GPIO WR GPIO WR TRISIO RD TRISIO WR IOC RD IOC To A/D Converter 0 COUT 1 COUT Enable To INT To Timer0 Analog Input Mode GPPU RD GPIO Analog Input Mode Interrupt-onchange Bus Q3 Note 1: Comparator mode and ANSEL determines Analog Input mode. PIC12F683 DS41211D-page 38 © 2007 Microchip Technology Inc. 4.2.5.4 GP3/MCLR/VPP Figure 4-4 shows the diagram for this pin. The GP3 pin is configurable to function as one of the following: • a general purpose input • as Master Clear Reset with weak pull-up FIGURE 4-4: BLOCK DIAGRAM OF GP3 4.2.5.5 GP4/AN3/T1G/OSC2/CLKOUT Figure 4-5 shows the diagram for this pin. The GP4 pin is configurable to function as one of the following: • a general purpose I/O • an analog input for the ADC • a Timer1 gate input • a crystal/resonator connection • a clock output FIGURE 4-5: BLOCK DIAGRAM OF GP4 Input VSS D CK Q Q D EN Q Data RD GPIO RD WR IOC RD Reset MCLRE RD VSS D EN Q MCLRE VDD MCLRE Weak Interrupt-onchange pin GPIO IOC Bus TRISIO Q3 I/O pin VDD VSS D CK Q Q D CK Q Q D CK Q Q D CK Q Q VDD D EN Q D EN Q Weak Analog Input Mode Data WR WPU RD WPU RD GPIO WR GPIO WR TRISIO RD TRISIO WR IOC RD IOC FOSC/4 To A/D Converter Oscillator Circuit OSC1 CLKOUT 0 1 CLKOUT Enable Enable Analog Input Mode GPPU RD GPIO To T1G INTOSC/ RC/EC(2) CLK(1) Modes CLKOUT Enable Note 1: CLK modes are XT, HS, LP, optional LP oscillator and CLKOUT Enable. 2: With CLKOUT option. Interrupt-onchange Bus Q3 © 2007 Microchip Technology Inc. DS41211D-page 39 PIC12F683 4.2.5.6 GP5/T1CKI/OSC1/CLKIN Figure 4-6 shows the diagram for this pin. The GP5 pin is configurable to function as one of the following: • a general purpose I/O • a Timer1 clock input • a crystal/resonator connection • a clock input FIGURE 4-6: BLOCK DIAGRAM OF GP5 TABLE 4-1: SUMMARY OF REGISTERS ASSOCIATED WITH GPIO I/O pin VDD VSS D CK Q Q D CK Q Q D CK Q Q D CK Q Q VDD D EN Q D EN Q Weak Data WR WPU RD WPU RD GPIO WR GPIO WR TRISIO RD TRISIO WR IOC RD IOC To Timer1 or CLKGEN INTOSC Mode RD GPIO INTOSC Mode GPPU OSC2 (1) Note 1: Timer1 LP oscillator enabled. 2: When using Timer1 with LP oscillator, the Schmitt Trigger is bypassed. TMR1LPEN(1) Interrupt-onchange Oscillator Circuit Bus Q3 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets ANSEL — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 -000 1111 CCP1CON — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 CMCON0 — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 PCON — — ULPWUE SBOREN — — POR BOR --01 --qq --0u --uu INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000 OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --x0 x000 T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 0000 0000 TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 WPU — — WPU5 WPU4 — WPU2 WPU1 WPU0 --11 -111 --11 -111 Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by GPIO. PIC12F683 DS41211D-page 40 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 41 PIC12F683 5.0 TIMER0 MODULE The Timer0 module is an 8-bit timer/counter with the following features: • 8-bit timer/counter register (TMR0) • 8-bit prescaler (shared with Watchdog Timer) • Programmable internal or external clock source • Programmable external clock edge selection • Interrupt on overflow Figure 5-1 is a block diagram of the Timer0 module. 5.1 Timer0 Operation When used as a timer, the Timer0 module can be used as either an 8-bit timer or an 8-bit counter. 5.1.1 8-BIT TIMER MODE When used as a timer, the Timer0 module will increment every instruction cycle (without prescaler). Timer mode is selected by clearing the T0CS bit of the OPTION register to ‘0’. When TMR0 is written, the increment is inhibited for two instruction cycles immediately following the write. 5.1.2 8-BIT COUNTER MODE When used as a counter, the Timer0 module will increment on every rising or falling edge of the T0CKI pin. The incrementing edge is determined by the T0SE bit of the OPTION register. Counter mode is selected by setting the T0CS bit of the OPTION register to ‘1’. FIGURE 5-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER Note: The value written to the TMR0 register can be adjusted, in order to account for the two instruction cycle delay when TMR0 is written. T0CKI T0SE pin TMR0 Watchdog Timer WDT Time-out PS<2:0> WDTE Data Bus Set Flag bit T0IF on Overflow T0CS Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register. 2: SWDTEN and WDTPS<3:0> are bits in the WDTCON register. 3: WDTE bit is in the Configuration Word register. 0 1 0 1 0 1 8 8 8-bit Prescaler 0 1 FOSC/4 PSA PSA PSA 16-bit Prescaler 16 WDTPS<3:0> 31 kHz INTOSC SWDTEN Sync 2 Tcy PIC12F683 DS41211D-page 42 © 2007 Microchip Technology Inc. 5.1.3 SOFTWARE PROGRAMMABLE PRESCALER A single software programmable prescaler is available for use with either Timer0 or the Watchdog Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the OPTION register. To assign the prescaler to Timer0, the PSA bit must be cleared to a ‘0’. There are 8 prescaler options for the Timer0 module ranging from 1:2 to 1:256. The prescale values are selectable via the PS<2:0> bits of the OPTION register. In order to have a 1:1 prescaler value for the Timer0 module, the prescaler must be assigned to the WDT module. The prescaler is not readable or writable. When assigned to the Timer0 module, all instructions writing to the TMR0 register will clear the prescaler. When the prescaler is assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. 5.1.3.1 Switching Prescaler Between Timer0 and WDT Modules As a result of having the prescaler assigned to either Timer0 or the WDT, it is possible to generate an unintended device Reset when switching prescaler values. When changing the prescaler assignment from Timer0 to the WDT module, the instruction sequence shown in Example 5-1, must be executed. EXAMPLE 5-1: CHANGING PRESCALER (TIMER0 → WDT) When changing the prescaler assignment from the WDT to the Timer0 module, the following instruction sequence must be executed (see Example 5-2). EXAMPLE 5-2: CHANGING PRESCALER (WDT → TIMER0) 5.1.4 TIMER0 INTERRUPT Timer0 will generate an interrupt when the TMR0 register overflows from FFh to 00h. The T0IF interrupt flag bit of the INTCON register is set every time the TMR0 register overflows, regardless of whether or not the Timer0 interrupt is enabled. The T0IF bit must be cleared in software. The Timer0 interrupt enable is the T0IE bit of the INTCON register. 5.1.5 USING TIMER0 WITH AN EXTERNAL CLOCK When Timer0 is in Counter mode, the synchronization of the T0CKI input and the Timer0 register is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks. Therefore, the high and low periods of the external clock source must meet the timing requirements as shown in the Section 15.0 “Electrical Specifications”. BANKSEL TMR0 ; CLRWDT ;Clear WDT CLRF TMR0 ;Clear TMR0 and ;prescaler BANKSEL OPTION_REG ; BSF OPTION_REG,PSA ;Select WDT CLRWDT ; ; MOVLW b’11111000’ ;Mask prescaler ANDWF OPTION_REG,W ;bits IORLW b’00000101’ ;Set WDT prescaler MOVWF OPTION_REG ;to 1:32 Note: The Timer0 interrupt cannot wake the processor from Sleep since the timer is frozen during Sleep. CLRWDT ;Clear WDT and ;prescaler BANKSEL OPTION_REG ; MOVLW b’11110000’ ;Mask TMR0 select and ANDWF OPTION_REG,W ;prescaler bits IORLW b’00000011’ ;Set prescale to 1:16 MOVWF OPTION_REG ; © 2007 Microchip Technology Inc. DS41211D-page 43 PIC12F683 TABLE 5-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0 REGISTER 5-1: OPTION_REG: OPTION REGISTER R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 GPPU: GPIO Pull-up Enable bit 1 = GPIO pull-ups are disabled 0 = GPIO pull-ups are enabled by individual PORT latch values in WPU register bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of INT pin 0 = Interrupt on falling edge of INT pin bit 5 T0CS: Timer0 Clock Source Select bit 1 = Transition on T0CKI pin 0 = Internal instruction cycle clock (FOSC/4) bit 4 T0SE: Timer0 Source Edge Select bit 1 = Increment on high-to-low transition on T0CKI pin 0 = Increment on low-to-high transition on T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Note 1: A dedicated 16-bit WDT postscaler is available. See Section 12.6 “Watchdog Timer (WDT)” for more information. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Timer0 module. 000 001 010 011 100 101 110 111 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 1 : 1 1 : 2 1 : 4 1 : 8 1 : 16 1 : 32 1 : 64 1 : 128 BIT VALUE TIMER0 RATE WDT RATE PIC12F683 DS41211D-page 44 © 2007 Microchip Technology Inc. 6.0 TIMER1 MODULE WITH GATE CONTROL The Timer1 module is a 16-bit timer/counter with the following features: • 16-bit timer/counter register pair (TMR1H:TMR1L) • Programmable internal or external clock source • 3-bit prescaler • Optional LP oscillator • Synchronous or asynchronous operation • Timer1 gate (count enable) via comparator or T1G pin • Interrupt on overflow • Wake-up on overflow (external clock, Asynchronous mode only) • Special Event Trigger (with CCP) • Comparator output synchronization to Timer1 clock Figure 6-1 is a block diagram of the Timer1 module. 6.1 Timer1 Operation The Timer1 module is a 16-bit incrementing counter which is accessed through the TMR1H:TMR1L register pair. Writes to TMR1H or TMR1L directly update the counter. When used with an internal clock source, the module is a timer. When used with an external clock source, the module can be used as either a timer or counter. 6.2 Clock Source Selection The TMR1CS bit of the T1CON register is used to select the clock source. When TMR1CS = 0, the clock source is FOSC/4. When TMR1CS = 1, the clock source is supplied externally. FIGURE 6-1: TIMER1 BLOCK DIAGRAM Clock Source TMR1CS FOSC/4 0 T1CKI pin 1 TMR1H TMR1L Oscillator T1SYNC T1CKPS<1:0> Prescaler 1, 2, 4, 8 Synchronize(3) det 1 0 0 1 Synchronized clock input 2 Set flag bit TMR1IF on Overflow TMR1(2) TMR1GE TMR1ON T1OSCEN 1 COUT 0 T1GSS T1GINV To Comparator Module Timer1 Clock TMR1CS OSC2/T1G OSC1/T1CKI Note 1: ST Buffer is low power type when using LP oscillator, or high speed type when using T1CKI. 2: Timer1 register increments on rising edge. 3: Synchronize does not operate while in Sleep. (1) EN INTOSC Without CLKOUT FOSC/4 Internal Clock © 2007 Microchip Technology Inc. DS41211D-page 45 PIC12F683 6.2.1 INTERNAL CLOCK SOURCE When the internal clock source is selected the TMR1H:TMR1L register pair will increment on multiples of TCY as determined by the Timer1 prescaler. 6.2.2 EXTERNAL CLOCK SOURCE When the external clock source is selected, the Timer1 module may work as a timer or a counter. When counting, Timer1 is incremented on the rising edge of the external clock input T1CKI. In addition, the Counter mode clock can be synchronized to the microcontroller system clock or run asynchronously. If an external clock oscillator is needed (and the microcontroller is using the INTOSC without CLKOUT), Timer1 can use the LP oscillator as a clock source. 6.3 Timer1 Prescaler Timer1 has four prescaler options allowing 1, 2, 4 or 8 divisions of the clock input. The T1CKPS bits of the T1CON register control the prescale counter. The prescale counter is not directly readable or writable; however, the prescaler counter is cleared upon a write to TMR1H or TMR1L. 6.4 Timer1 Oscillator A low-power 32.768 kHz crystal oscillator is built-in between pins OSC1 (input) and OSC2 (amplifier output). The oscillator is enabled by setting the T1OSCEN control bit of the T1CON register. The oscillator will continue to run during Sleep. The Timer1 oscillator is shared with the system LP oscillator. Thus, Timer1 can use this mode only when the primary system clock is derived from the internal oscillator or when in LP oscillator mode. The user must provide a software time delay to ensure proper oscillator start-up. TRISIO<5:4> bits are set when the Timer1 oscillator is enabled. GP5 and GP4 bits read as ‘0’ and TRISIO5 and TRISIO4 bits read as ‘1’. 6.5 Timer1 Operation in Asynchronous Counter Mode If control bit T1SYNC of the T1CON register is set, the external clock input is not synchronized. The timer continues to increment asynchronous to the internal phase clocks. The timer will continue to run during Sleep and can generate an interrupt on overflow, which will wake-up the processor. However, special precautions in software are needed to read/write the timer (see Section 6.5.1 “Reading and Writing Timer1 in Asynchronous Counter Mode”). 6.5.1 READING AND WRITING TIMER1 IN ASYNCHRONOUS COUNTER MODE Reading TMR1H or TMR1L while the timer is running from an external asynchronous clock will ensure a valid read (taken care of in hardware). However, the user should keep in mind that reading the 16-bit timer in two 8-bit values itself, poses certain problems, since the timer may overflow between the reads. For writes, it is recommended that the user simply stop the timer and write the desired values. A write contention may occur by writing to the timer registers, while the register is incrementing. This may produce an unpredictable value in the TMR1H:TTMR1L register pair. 6.6 Timer1 Gate Timer1 gate source is software configurable to be the T1G pin or the output of the Comparator. This allows the device to directly time external events using T1G or analog events using Comparator 2. See the CMCON1 register (Register 8-2) for selecting the Timer1 gate source. This feature can simplify the software for a Delta-Sigma A/D converter and many other applications. For more information on Delta-Sigma A/D converters, see the Microchip web site (www.microchip.com). Timer1 gate can be inverted using the T1GINV bit of the T1CON register, whether it originates from the T1G pin or Comparator 2 output. This configures Timer1 to measure either the active-high or active-low time between events. Note: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge. Note: The oscillator requires a start-up and stabilization time before use. Thus, T1OSCEN should be set and a suitable delay observed prior to enabling Timer1. Note: When switching from synchronous to asynchronous operation, it is possible to skip an increment. When switching from asynchronous to synchronous operation, it is possible to produce a single spurious increment. Note: TMR1GE bit of the T1CON register must be set to use either T1G or COUT as the Timer1 gate source. See Register 8-2 for more information on selecting the Timer1 gate source. PIC12F683 DS41211D-page 46 © 2007 Microchip Technology Inc. 6.7 Timer1 Interrupt The Timer1 register pair (TMR1H:TMR1L) increments to FFFFh and rolls over to 0000h. When Timer1 rolls over, the Timer1 interrupt flag bit of the PIR1 register is set. To enable the interrupt on rollover, you must set these bits: • Timer1 interrupt enable bit of the PIE1 register • PEIE bit of the INTCON register • GIE bit of the INTCON register The interrupt is cleared by clearing the TMR1IF bit in the Interrupt Service Routine. 6.8 Timer1 Operation During Sleep Timer1 can only operate during Sleep when setup in Asynchronous Counter mode. In this mode, an external crystal or clock source can be used to increment the counter. To set up the timer to wake the device: • TMR1ON bit of the T1CON register must be set • TMR1IE bit of the PIE1 register must be set • PEIE bit of the INTCON register must be set The device will wake-up on an overflow and execute the next instruction. If the GIE bit of the INTCON register is set, the device will call the Interrupt Service Routine (0004h). 6.9 CCP Special Event Trigger If a CCP is configured to trigger a special event, the trigger will clear the TMR1H:TMR1L register pair. This special event does not cause a Timer1 interrupt. The CCP module may still be configured to generate a CCP interrupt. In this mode of operation, the CCPR1H:CCPR1L register pair effectively becomes the period register for Timer1. Timer1 should be synchronized to the FOSC to utilize the Special Event Trigger. Asynchronous operation of Timer1 can cause a Special Event Trigger to be missed. In the event that a write to TMR1H or TMR1L coincides with a Special Event Trigger from the CCP, the write will take precedence. For more information, see Section on CCP. 6.10 Comparator Synchronization The same clock used to increment Timer1 can also be used to synchronize the comparator output. This feature is enabled in the Comparator module. When using the comparator for Timer1 gate, the comparator output should be synchronized to Timer1. This ensures Timer1 does not miss an increment if the comparator changes. For more information, see Section 8.0 “Comparator Module”. FIGURE 6-2: TIMER1 INCREMENTING EDGE Note: The TMR1H:TTMR1L register pair and the TMR1IF bit should be cleared before enabling interrupts. T1CKI = 1 when TMR1 Enabled T1CKI = 0 when TMR1 Enabled Note 1: Arrows indicate counter increments. 2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock. © 2007 Microchip Technology Inc. DS41211D-page 47 PIC12F683 6.11 Timer1 Control Register The Timer1 Control register (T1CON), shown in Register 6-1, is used to control Timer1 and select the various features of the Timer1 module. REGISTER 6-1: T1CON: TIMER1 CONTROL REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 T1GINV(1) TMR1GE(2) T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 T1GINV: Timer1 Gate Invert bit(1) 1 = Timer1 gate is active-high (Timer1 counts when gate is high) 0 = Timer1 gate is active-low (Timer1 counts when gate is low) bit 6 TMR1GE: Timer1 Gate Enable bit(2) If TMR1ON = 0: This bit is ignored If TMR1ON = 1: 1 = Timer1 is on if Timer1 gate is not active 0 = Timer1 is on bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale Value 10 = 1:4 Prescale Value 01 = 1:2 Prescale Value 00 = 1:1 Prescale Value bit 3 T1OSCEN: LP Oscillator Enable Control bit If INTOSC without CLKOUT oscillator is active: 1 = LP oscillator is enabled for Timer1 clock 0 = LP oscillator is off Else: This bit is ignored. LP oscillator is disabled. bit 2 T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1: 1 = Do not synchronize external clock input 0 = Synchronize external clock input TMR1CS = 0: This bit is ignored. Timer1 uses the internal clock bit 1 TMR1CS: Timer1 Clock Source Select bit 1 = External clock from T1CKI pin (on the rising edge) 0 = Internal clock (FOSC/4) bit 0 TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 Note 1: T1GINV bit inverts the Timer1 gate logic, regardless of source. 2: TMR1GE bit must be set to use either T1G pin or COUT, as selected by the T1GSS bit of the CMCON1 register, as a Timer1 gate source. PIC12F683 DS41211D-page 48 © 2007 Microchip Technology Inc. TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CONFIG(1) CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — — CMCON1 — — — — — — T1GSS CMSYNC ---- --10 ---- --10 INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 000- 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 uuuu uuuu Legend: x = unknown, u = unchanged, – = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module. Note 1: See Configuration Word register (Register 12-1) for operation of all register bits. © 2007 Microchip Technology Inc. DS41211D-page 49 PIC12F683 7.0 TIMER2 MODULE The Timer2 module is an 8-bit timer with the following features: • 8-bit timer register (TMR2) • 8-bit period register (PR2) • Interrupt on TMR2 match with PR2 • Software programmable prescaler (1:1, 1:4, 1:16) • Software programmable postscaler (1:1 to 1:16) See Figure 7-1 for a block diagram of Timer2. 7.1 Timer2 Operation The clock input to the Timer2 module is the system instruction clock (FOSC/4). The clock is fed into the Timer2 prescaler, which has prescale options of 1:1, 1:4 or 1:16. The output of the prescaler is then used to increment the TMR2 register. The values of TMR2 and PR2 are constantly compared to determine when they match. TMR2 will increment from 00h until it matches the value in PR2. When a match occurs, two things happen: • TMR2 is reset to 00h on the next increment cycle. • The Timer2 postscaler is incremented The match output of the Timer2/PR2 comparator is then fed into the Timer2 postscaler. The postscaler has postscale options of 1:1 to 1:16 inclusive. The output of the Timer2 postscaler is used to set the TMR2IF interrupt flag bit in the PIR1 register. The TMR2 and PR2 registers are both fully readable and writable. On any Reset, the TMR2 register is set to 00h and the PR2 register is set to FFh. Timer2 is turned on by setting the TMR2ON bit in the T2CON register to a ‘1’. Timer2 is turned off by clearing the TMR2ON bit to a ‘0’. The Timer2 prescaler is controlled by the T2CKPS bits in the T2CON register. The Timer2 postscaler is controlled by the TOUTPS bits in the T2CON register. The prescaler and postscaler counters are cleared when: • A write to TMR2 occurs. • A write to T2CON occurs. • Any device Reset occurs (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset). FIGURE 7-1: TIMER2 BLOCK DIAGRAM Note: TMR2 is not cleared when T2CON is written. Comparator TMR2 Sets Flag TMR2 Output Reset Postscaler Prescaler PR2 2 FOSC/4 1:1 to 1:16 1:1, 1:4, 1:16 EQ 4 bit TMR2IF TOUTPS<3:0> T2CKPS<1:0> PIC12F683 DS41211D-page 50 © 2007 Microchip Technology Inc. TABLE 7-1: SUMMARY OF ASSOCIATED TIMER2 REGISTERS REGISTER 7-1: T2CON: TIMER 2 CONTROL REGISTER U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6-3 TOUTPS<3:0>: Timer2 Output Postscaler Select bits 0000 = 1:1 Postscaler 0001 = 1:2 Postscaler 0010 = 1:3 Postscaler 0011 = 1:4 Postscaler 0100 = 1:5 Postscaler 0101 = 1:6 Postscaler 0110 = 1:7 Postscaler 0111 = 1:8 Postscaler 1000 = 1:9 Postscaler 1001 = 1:10 Postscaler 1010 = 1:11 Postscaler 1011 = 1:12 Postscaler 1100 = 1:13 Postscaler 1101 = 1:14 Postscaler 1110 = 1:15 Postscaler 1111 = 1:16 Postscaler bit 2 TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 000- 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 PR2 Timer2 Module Period Register 1111 1111 1111 1111 TMR2 Holding Register for the 8-bit TMR2 Register 0000 0000 0000 0000 T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 Legend: x = unknown, u = unchanged, - = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module. © 2007 Microchip Technology Inc. DS41211D-page 51 PIC12F683 8.0 COMPARATOR MODULE Comparators are used to interface analog circuits to a digital circuit by comparing two analog voltages and providing a digital indication of their relative magnitudes. The comparators are very useful mixed signal building blocks because they provide analog functionality independent of the program execution. The analog comparator module includes the following features: • Multiple comparator configurations • Comparator output is available internally/externally • Programmable output polarity • Interrupt-on-change • Wake-up from Sleep • Timer1 gate (count enable) • Output synchronization to Timer1 clock input • Programmable voltage reference 8.1 Comparator Overview The comparator is shown in Figure 8-1 along with the relationship between the analog input levels and the digital output. When the analog voltage at VIN+ is less than the analog voltage at VIN-, the output of the comparator is a digital low level. When the analog voltage at VIN+ is greater than the analog voltage at VIN-, the output of the comparator is a digital high level. FIGURE 8-1: SINGLE COMPARATOR FIGURE 8-2: COMPARATOR OUTPUT BLOCK DIAGRAM – VIN+ + VINOutput Output VIN+ VINNote: The black areas of the output of the comparator represents the uncertainty due to input offsets and response time. CMSYNC D Q EN To COUT pin RD CMCON0 Set CMIF bit MULTIPLEX Port Pins Q3*RD CMCON0 Reset To Data Bus CINV Timer1 clock source(1) 0 1 To Timer1 Gate Note 1: Comparator output is latched on falling edge of Timer1 clock source. 2: Q1 and Q3 are phases of the four-phase system clock (FOSC). 3: Q1 is held high during Sleep mode. D Q D Q EN CL Q1 PIC12F683 DS41211D-page 52 © 2007 Microchip Technology Inc. 8.2 Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 8-3. Since the analog input pins share their connection with a digital input, they have reverse biased ESD protection diodes to VDD and VSS. The analog input, therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latch-up may occur. A maximum source impedance of 10 kΩ is recommended for the analog sources. Also, any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current to minimize inaccuracies introduced. FIGURE 8-3: ANALOG INPUT MODEL Note 1: When reading a PORT register, all pins configured as analog inputs will read as a ‘0’. Pins configured as digital inputs will convert as an analog input, according to the input specification. 2: Analog levels on any pin defined as a digital input, may cause the input buffer to consume more current than is specified. VA Rs < 10K CPIN 5 pF VDD VT ≈ 0.6V VT ≈ 0.6V RIC ILEAKAGE ±500 nA Vss AIN Legend: CPIN = Input Capacitance ILEAKAGE = Leakage Current at the pin due to various junctions RIC = Interconnect Resistance RS = Source Impedance VA = Analog Voltage VT = Threshold Voltage To ADC Input © 2007 Microchip Technology Inc. DS41211D-page 53 PIC12F683 8.3 Comparator Configuration There are eight modes of operation for the comparator. The CM<2:0> bits of the CMCON0 register are used to select these modes as shown in Figure 8-4. • Analog function (A): digital input buffer is disabled • Digital function (D): comparator digital output, overrides port function • Normal port function (I/O): independent of comparator The port pins denoted as “A” will read as a ‘0’ regardless of the state of the I/O pin or the I/O control TRIS bit. Pins used as analog inputs should also have the corresponding TRIS bit set to ‘1’ to disable the digital output driver. Pins denoted as “D” should have the corresponding TRIS bit set to ‘0’ to enable the digital output driver. FIGURE 8-4: COMPARATOR I/O OPERATING MODES Note: Comparator interrupts should be disabled during a Comparator mode change to prevent unintended interrupts. Comparator Reset (POR Default Value – low power) Comparator w/o Output and with Internal Reference CM<2:0> = 000 CM<2:0> = 100 Comparator with Output Multiplexed Input with Internal Reference and Output CM<2:0> = 001 CM<2:0> = 101 Comparator without Output Multiplexed Input with Internal Reference CM<2:0> = 010 CM<2:0> = 110 Comparator with Output and Internal Reference Comparator Off (Lowest power) CM<2:0> = 011 CM<2:0> = 111 Legend: A = Analog Input, ports always reads ‘0’ CIS = Comparator Input Switch (CMCON0<3>) I/O = Normal port I/O D = Comparator Digital Output Note 1: Reads as ‘0’, unless CINV = 1. CINCIN+ Off(1) A A COUT (pin) I/O CINCIN+ COUT A I/O COUT (pin) I/O From CVREF Module CINCIN+ COUT A A COUT (pin) D CINCIN+ COUT A A COUT (pin) D From CVREF Module CIS = 0 CIS = 1 CINCIN+ COUT A A COUT (pin) I/O CINCIN+ COUT A A COUT (pin) I/O From CVREF Module CIS = 0 CIS = 1 CINCIN+ COUT A I/O COUT (pin) D From CVREF Module CINCIN+ Off(1) I/O I/O COUT (pin) I/O PIC12F683 DS41211D-page 54 © 2007 Microchip Technology Inc. 8.4 Comparator Control The CMCON0 register (Register 8-1) provides access to the following comparator features: • Mode selection • Output state • Output polarity • Input switch 8.4.1 COMPARATOR OUTPUT STATE The Comparator state can always be read internally via the COUT bit of the CMCON0 register. The comparator state may also be directed to the COUT pin in the following modes: • CM<2:0> = 001 • CM<2:0> = 011 • CM<2:0> = 101 When one of the above modes is selected, the associated TRIS bit of the COUT pin must be cleared. 8.4.2 COMPARATOR OUTPUT POLARITY Inverting the output of the comparator is functionally equivalent to swapping the comparator inputs. The polarity of the comparator output can be inverted by setting the CINV bit of the CMCON0 register. Clearing CINV results in a non-inverted output. A complete table showing the output state versus input conditions and the polarity bit is shown in Table 8-1. TABLE 8-1: OUTPUT STATE VS. INPUT CONDITIONS 8.4.3 COMPARATOR INPUT SWITCH The inverting input of the comparator may be switched between two analog pins in the following modes: • CM<2:0> = 101 • CM<2:0> = 110 In the above modes, both pins remain in analog mode regardless of which pin is selected as the input. The CIS bit of the CMCON0 register controls the comparator input switch. 8.5 Comparator Response Time The comparator output is indeterminate for a period of time after the change of an input source or the selection of a new reference voltage. This period is referred to as the response time. The response time of the comparator differs from the settling time of the voltage reference. Therefore, both of these times must be considered when determining the total response time to a comparator input change. See the Comparator and Voltage Reference Specifications in Section 15.0 “Electrical Specifications” for more details. Input Conditions CINV COUT VIN- > VIN+ 0 0 VIN- < VIN+ 0 1 VIN- > VIN+ 1 1 VIN- < VIN+ 1 0 Note: COUT refers to both the register bit and output pin. © 2007 Microchip Technology Inc. DS41211D-page 55 PIC12F683 8.6 Comparator Interrupt Operation The comparator interrupt flag is set whenever there is a change in the output value of the comparator. Changes are recognized by means of a mismatch circuit which consists of two latches and an exclusive-or gate (see Figure 8.2). One latch is updated with the comparator output level when the CMCON0 register is read. This latch retains the value until the next read of the CMCON0 register or the occurrence of a Reset. The other latch of the mismatch circuit is updated on every Q1 system clock. A mismatch condition will occur when a comparator output change is clocked through the second latch on the Q1 clock cycle. The mismatch condition will persist, holding the CMIF bit of the PIR1 register true, until either the CMCON0 register is read or the comparator output returns to the previous state. Software will need to maintain information about the status of the comparator output to determine the actual change that has occurred. The CMIF bit of the PIR1 register, is the comparator interrupt flag. This bit must be reset in software by clearing it to ‘0’. Since it is also possible to write a ‘1’ to this register, a simulated interrupt may be initiated. The CMIE bit of the PIE1 register and the PEIE and GIE bits of the INTCON register must all be set to enable comparator interrupts. If any of these bits are cleared, the interrupt is not enabled, although the CMIF bit of the PIR1 register will still be set if an interrupt condition occurs. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: a) Any read or write of CMCON0. This will end the mismatch condition. b) Clear the CMIF interrupt flag. A persistent mismatch condition will preclude clearing the CMIF interrupt flag. Reading CMCON0 will end the mismatch condition and allow the CMIF bit to be cleared. FIGURE 8-5: COMPARATOR INTERRUPT TIMING W/O CMCON0 READ FIGURE 8-6: COMPARATOR INTERRUPT TIMING WITH CMCON0 READ Note: A write operation to the CMCON0 register will also clear the mismatch condition because all writes include a read operation at the beginning of the write cycle. Note: If a change in the CMCON0 register (COUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF interrupt flag may not get set. Note 1: If a change in the CMCON0 register (COUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF of the PIR1 register interrupt flag may not get set. 2: When either comparator is first enabled, bias circuitry in the Comparator module may cause an invalid output from the comparator until the bias circuitry is stable. Allow about 1 μs for bias settling then clear the mismatch condition and interrupt flags before enabling comparator interrupts. Q1 Q3 CIN+ COUT Set CMIF (level) CMIF TRT reset by software Q1 Q3 CIN+ COUT Set CMIF (level) CMIF TRT cleared by CMCON0 read reset by software PIC12F683 DS41211D-page 56 © 2007 Microchip Technology Inc. 8.7 Operation During Sleep The comparator, if enabled before entering Sleep mode, remains active during Sleep. The additional current consumed by the comparator is shown separately in Section 15.0 “Electrical Specifications”. If the comparator is not used to wake the device, power consumption can be minimized while in Sleep mode by turning off the comparator. The comparator is turned off by selecting mode CM<2:0> = 000 or CM<2:0> = 111 of the CMCON0 register. A change to the comparator output can wake-up the device from Sleep. To enable the comparator to wake the device from Sleep, the CMIE bit of the PIE1 register and the PEIE bit of the INTCON register must be set. The instruction following the Sleep instruction always executes following a wake from Sleep. If the GIE bit of the INTCON register is also set, the device will then execute the Interrupt Service Routine. 8.8 Effects of a Reset A device Reset forces the CMCON0 and CMCON1 registers to their Reset states. This forces the Comparator module to be in the Comparator Reset mode (CM<2:0> = 000). Thus, all comparator inputs are analog inputs with the comparator disabled to consume the smallest current possible. REGISTER 8-1: CMCON0: COMPARATOR CONFIGURATION REGISTER U-0 R-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — COUT — CINV CIS CM2 CM1 CM0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 Unimplemented: Read as ‘0’ bit 6 COUT: Comparator Output bit When CINV = 0: 1 = VIN+ > VIN- 0 = VIN+ < VINWhen CINV = 1: 1 = VIN+ < VIN- 0 = VIN+ > VINbit 5 Unimplemented: Read as ‘0’ bit 4 CINV: Comparator Output Inversion bit 1 = Output inverted 0 = Output not inverted bit 3 CIS: Comparator Input Switch bit When CM<2:0> = 110 or 101: 1 = CIN+ connects to VIN- 0 = CIN- connects to VINWhen CM<2:0> = 0xx or 100 or 111: CIS has no effect. bit 2-0 CM<2:0>: Comparator Mode bits (See Figure 8-5) 000 = CIN pins are configured as analog, COUT pin configured as I/O, Comparator output turned off 001 = CIN pins are configured as analog, COUT pin configured as Comparator output 010 = CIN pins are configured as analog, COUT pin configured as I/O, Comparator output available internally 011 = CIN- pin is configured as analog, CIN+ pin is configured as I/O, COUT pin configured as Comparator output, CVREF is non-inverting input 100 = CIN- pin is configured as analog, CIN+ pin is configured as I/O, COUT pin is configured as I/O, Comparator output available internally, CVREF is non-inverting input 101 = CIN pins are configured as analog and multiplexed, COUT pin is configured as Comparator output, CVREF is non-inverting input 110 = CIN pins are configured as analog and multiplexed, COUT pin is configured as I/O, Comparator output available internally, CVREF is non-inverting input 111 = CIN pins are configured as I/O, COUT pin is configured as I/O, Comparator output disabled, Comparator off. © 2007 Microchip Technology Inc. DS41211D-page 57 PIC12F683 8.9 Comparator Gating Timer1 This feature can be used to time the duration or interval of analog events. Clearing the T1GSS bit of the CMCON1 register will enable Timer1 to increment based on the output of the comparator. This requires that Timer1 is on and gating is enabled. See Section 6.0 “Timer1 Module with Gate Control” for details. It is recommended to synchronize the comparator with Timer1 by setting the CMSYNC bit when the comparator is used as the Timer1 gate source. This ensures Timer1 does not miss an increment if the comparator changes during an increment. 8.10 Synchronizing Comparator Output to Timer1 The comparator output can be synchronized with Timer1 by setting the CMSYNC bit of the CMCON1 register. When enabled, the comparator output is latched on the falling edge of the Timer1 clock source. If a prescaler is used with Timer1, the comparator output is latched after the prescaling function. To prevent a race condition, the comparator output is latched on the falling edge of the Timer1 clock source and Timer1 increments on the rising edge of its clock source. See the Comparator Block Diagram (Figure 8- 2) and the Timer1 Block Diagram (Figure 6-1) for more information. REGISTER 8-2: CMCON1: COMPARATOR CONFIGURATION REGISTER U-0 U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 — — — — — — T1GSS CMSYNC bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Unimplemented: Read as ‘0’ bit 1 T1GSS: Timer1 Gate Source Select bit(1) 1 = Timer 1 Gate Source is T1G pin (pin should be configured as digital input) 0 = Timer 1 Gate Source is comparator output bit 0 CMSYNC: Comparator Output Synchronization bit(2) 1 = Output is synchronized with falling edge of Timer1 clock 0 = Output is asynchronous Note 1: Refer to Section 6.6 “Timer1 Gate”. 2: Refer to Figure 8-2. PIC12F683 DS41211D-page 58 © 2007 Microchip Technology Inc. 8.11 Comparator Voltage Reference The Comparator Voltage Reference module provides an internally generated voltage reference for the comparators. The following features are available: • Independent from Comparator operation • Two 16-level voltage ranges • Output clamped to VSS • Ratiometric with VDD The VRCON register (Register 8-3) controls the Voltage Reference module shown in Figure 8-7. 8.11.1 INDEPENDENT OPERATION The comparator voltage reference is independent of the comparator configuration. Setting the VREN bit of the VRCON register will enable the voltage reference. 8.11.2 OUTPUT VOLTAGE SELECTION The CVREF voltage reference has 2 ranges with 16 voltage levels in each range. Range selection is controlled by the VRR bit of the VRCON register. The 16 levels are set with the VR<3:0> bits of the VRCON register. The CVREF output voltage is determined by the following equations: EQUATION 8-1: CVREF OUTPUT VOLTAGE The full range of VSS to VDD cannot be realized due to the construction of the module. See Figure 8-1. 8.11.3 OUTPUT CLAMPED TO VSS The CVREF output voltage can be set to Vss with no power consumption by configuring VRCON as follows: • VREN=0 • VRR=1 • VR<3:0>=0000 This allows the comparator to detect a zero-crossing while not consuming additional CVREF module current. 8.11.4 OUTPUT RATIOMETRIC TO VDD The comparator voltage reference is VDD derived and therefore, the CVREF output changes with fluctuations in VDD. The tested absolute accuracy of the Comparator Voltage Reference can be found in Section 15.0 “Electrical Specifications”. VRR = 1 (low range): VRR = 0 (high range): CVREF = (VDD/4) + CVREF = (VR<3:0>/24) × VDD (VR<3:0> × VDD/32) REGISTER 8-3: VRCON: VOLTAGE REFERENCE CONTROL REGISTER R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN — VRR — VR3 VR2 VR1 VR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 VREN: CVREF Enable bit 1 = CVREF circuit powered on 0 = CVREF circuit powered down, no IDD drain and CVREF = VSS. bit 6 Unimplemented: Read as ‘0’ bit 5 VRR: CVREF Range Selection bit 1 = Low range 0 = High range bit 4 Unimplemented: Read as ‘0’ bit 3-0 VR<3:0>: CVREF Value Selection 0 ≤ VR<3:0> ≤ 15 When VRR = 1: CVREF = (VR<3:0>/24) * VDD When VRR = 0: CVREF = VDD/4 + (VR<3:0>/32) * VDD © 2007 Microchip Technology Inc. DS41211D-page 59 PIC12F683 FIGURE 8-7: COMPARATOR VOLTAGE REFERENCE BLOCK DIAGRAM TABLE 8-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE COMPARATOR AND VOLTAGE REFERENCE MODULES Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets ANSEL — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 -000 1111 CMCON0 — COUT — CINV CIS CM2 CM1 CM0 -0-0 0000 -0-0 0000 CMCON1 — — — — — — T1GSS CMSYNC ---- --10 ---- --10 INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 0000 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 VRCON VREN — VRR — VR3 VR2 VR1 VR0 0-0- 0000 -0-0 0000 Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used for comparator. 8R VRR VR<3:0>(1) 16-1 Analog 8R R R R R CVREF to 16 Stages Comparator Input VREN VDD MUX VR<3:0> = 0000 VREN VRR 0 1 2 14 15 Note 1: Care should be taken to ensure VREF remains within the comparator Common mode input range. See Section 15.0 “Electrical Specifications” for more detail. PIC12F683 DS41211D-page 60 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 61 PIC12F683 9.0 ANALOG-TO-DIGITAL CONVERTER (ADC) MODULE The Analog-to-Digital Converter (ADC) allows conversion of an analog input signal to a 10-bit binary representation of that signal. This device uses analog inputs, which are multiplexed into a single sample and hold circuit. The output of the sample and hold is connected to the input of the converter. The converter generates a 10-bit binary result via successive approximation and stores the conversion result into the ADC result registers (ADRESL and ADRESH). The ADC voltage reference is software selectable to either VDD or a voltage applied to the external reference pins. The ADC can generate an interrupt upon completion of a conversion. This interrupt can be used to wake-up the device from Sleep. Figure 9-1 shows the block diagram of the ADC. FIGURE 9-1: ADC BLOCK DIAGRAM 9.1 ADC Configuration When configuring and using the ADC the following functions must be considered: • GPIO configuration • Channel selection • ADC voltage reference selection • ADC conversion clock source • Interrupt control • Results formatting 9.1.1 GPIO CONFIGURATION The ADC can be used to convert both analog and digital signals. When converting analog signals, the I/O pin should be configured for analog by setting the associated TRIS and ANSEL bits. See the corresponding GPIO section for more information. 9.1.2 CHANNEL SELECTION The CHS bits of the ADCON0 register determine which channel is connected to the sample and hold circuit. When changing channels, a delay is required before starting the next conversion. Refer to Section 9.2 “ADC Operation” for more information. GP0/AN0 A/D GP1/AN1/VREF GP2/AN2 VDD VREF ADON GO/DONE VCFG = 1 VCFG = 0 CHS ADRESH ADRESL 10 10 ADFM GP4/AN3 0 = Left Justify 1 = Right Justify Note: Analog voltages on any pin that is defined as a digital input may cause the input buffer to conduct excess current. PIC12F683 DS41211D-page 62 © 2007 Microchip Technology Inc. 9.1.3 ADC VOLTAGE REFERENCE The VCFG bit of the ADCON0 register provides control of the positive voltage reference. The positive voltage reference can be either VDD or an external voltage source. The negative voltage reference is always connected to the ground reference. 9.1.4 CONVERSION CLOCK The source of the conversion clock is software selectable via the ADCS bits of the ANSEL register. There are seven possible clock options: • FOSC/2 • FOSC/4 • FOSC/8 • FOSC/16 • FOSC/32 • FOSC/64 • FRC (dedicated internal oscillator) The time to complete one bit conversion is defined as TAD. One full 10-bit conversion requires 11 TAD periods as shown in Figure 9-2. For correct conversion, the appropriate TAD specification must be met. See A/D conversion requirements in Section 15.0 “Electrical Specifications” for more information. Table 9-1 gives examples of appropriate ADC clock selections. TABLE 9-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V) FIGURE 9-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES Note: Unless using the FRC, any changes in the system clock frequency will change the ADC clock frequency, which may adversely affect the ADC result. ADC Clock Period (TAD) Device Frequency (FOSC) ADC Clock Source ADCS<2:0> 20 MHz 8 MHz 4 MHz 1 MHz FOSC/2 000 100 ns(2) 250 ns(2) 500 ns(2) 2.0 μs FOSC/4 100 200 ns(2) 500 ns(2) 1.0 μs(2) 4.0 μs FOSC/8 001 400 ns(2) 1.0 μs(2) 2.0 μs 8.0 μs(3) FOSC/16 101 800 ns(2) 2.0 μs 4.0 μs 16.0 μs(3) FOSC/32 010 1.6 μs 4.0 μs 8.0 μs(3) 32.0 μs(3) FOSC/64 110 3.2 μs 8.0 μs(3) 16.0 μs(3) 64.0 μs(3) FRC x11 2-6 μs(1,4) 2-6 μs(1,4) 2-6 μs(1,4) 2-6 μs(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The FRC source has a typical TAD time of 4 μs for VDD > 3.0V. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: When the device frequency is greater than 1 MHz, the FRC clock source is only recommended if the conversion will be performed during Sleep. TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 Set GO/DONE bit Holding Capacitor is Disconnected from Analog Input (typically 100 ns) b9 b8 b7 b6 b5 b4 b3 b2 TAD10 TAD11 b1 b0 TCY to TAD Conversion Starts ADRESH and ADRESL registers are loaded, GO bit is cleared, ADIF bit is set, Holding capacitor is connected to analog input © 2007 Microchip Technology Inc. DS41211D-page 63 PIC12F683 9.1.5 INTERRUPTS The ADC module allows for the ability to generate an interrupt upon completion of an Analog-to-Digital conversion. The ADC interrupt flag is the ADIF bit in the PIR1 register. The ADC interrupt enable is the ADIE bit in the PIE1 register. The ADIF bit must be cleared in software. This interrupt can be generated while the device is operating or while in Sleep. If the device is in Sleep, the interrupt will wake-up the device. Upon waking from Sleep, the next instruction following the SLEEP instruction is always executed. If the user is attempting to wake-up from Sleep and resume in-line code execution, the global interrupt must be disabled. If the global interrupt is enabled, execution will switch to the interrupt service routine. Please see Section 12.4 “Interrupts” for more information. 9.1.6 RESULT FORMATTING The 10-bit A/D conversion result can be supplied in two formats, left justified or right justified. The ADFM bit of the ADCON0 register controls the output format. Figure 9-3 shows the two output formats. FIGURE 9-3: 10-BIT A/D CONVERSION RESULT FORMAT 9.2 ADC Operation 9.2.1 STARTING A CONVERSION To enable the ADC module, the ADON bit of the ADCON0 register must be set to a ‘1’. Setting the GO/DONE bit of the ADCON0 register to a ‘1’ will start the Analog-to-Digital conversion. 9.2.2 COMPLETION OF A CONVERSION When the conversion is complete, the ADC module will: • Clear the GO/DONE bit • Set the ADIF flag bit • Update the ADRESH:ADRESL registers with new conversion result 9.2.3 TERMINATING A CONVERSION If a conversion must be terminated before completion, the GO/DONE bit can be cleared in software. The ADRESH:ADRESL registers will not be updated with the partially complete Analog-to-Digital conversion sample. Instead, the ADRESH:ADRESL register pair will retain the value of the previous conversion. Additionally, a 2 TAD delay is required before another acquisition can be initiated. Following this delay, an input acquisition is automatically started on the selected channel. Note: The ADIF bit is set at the completion of every conversion, regardless of whether or not the ADC interrupt is enabled. ADRESH ADRESL (ADFM = 0) MSB LSB bit 7 bit 0 bit 7 bit 0 10-bit A/D Result Unimplemented: Read as ‘0’ (ADFM = 1) MSB LSB bit 7 bit 0 bit 7 bit 0 Unimplemented: Read as ‘0’ 10-bit A/D Result Note: The GO/DONE bit should not be set in the same instruction that turns on the ADC. Refer to Section 9.2.6 “A/D Conversion Procedure”. Note: A device Reset forces all registers to their Reset state. Thus, the ADC module is turned off and any pending conversion is terminated. PIC12F683 DS41211D-page 64 © 2007 Microchip Technology Inc. 9.2.4 ADC OPERATION DURING SLEEP The ADC module can operate during Sleep. This requires the ADC clock source to be set to the FRC option. When the FRC clock source is selected, the ADC waits one additional instruction before starting the conversion. This allows the SLEEP instruction to be executed, which can reduce system noise during the conversion. If the ADC interrupt is enabled, the device will wake-up from Sleep when the conversion completes. If the ADC interrupt is disabled, the ADC module is turned off after the conversion completes, although the ADON bit remains set. When the ADC clock source is something other than FRC, a SLEEP instruction causes the present conversion to be aborted and the ADC module is turned off, although the ADON bit remains set. 9.2.5 SPECIAL EVENT TRIGGER The CCP Special Event Trigger allows periodic ADC measurements without software intervention. When this trigger occurs, the GO/DONE bit is set by hardware and the Timer1 counter resets to zero. Using the Special Event Trigger does not assure proper ADC timing. It is the user’s responsibility to ensure that the ADC timing requirements are met. See Section 11.0 “Capture/Compare/PWM (CCP) Module” for more information. 9.2.6 A/D CONVERSION PROCEDURE This is an example procedure for using the ADC to perform an Analog-to-Digital conversion: 1. Configure GPIO Port: • Disable pin output driver (See TRIS register) • Configure pin as analog 2. Configure the ADC module: • Select ADC conversion clock • Configure voltage reference • Select ADC input channel • Select result format • Turn on ADC module 3. Configure ADC interrupt (optional): • Clear ADC interrupt flag • Enable ADC interrupt • Enable peripheral interrupt • Enable global interrupt(1) 4. Wait the required acquisition time(2). 5. Start conversion by setting the GO/DONE bit. 6. Wait for ADC conversion to complete by one of the following: • Polling the GO/DONE bit • Waiting for the ADC interrupt (interrupts enabled) 7. Read ADC Result 8. Clear the ADC interrupt flag (required if interrupt is enabled). EXAMPLE 9-1: A/D CONVERSION 9.2.7 ADC REGISTER DEFINITIONS The following registers are used to control the operation of the ADC. Note 1: The global interrupt can be disabled if the user is attempting to wake-up from Sleep and resume in-line code execution. 2: See Section 9.3 “A/D Acquisition Requirements”. ;This code block configures the ADC ;for polling, Vdd reference, Frc clock ;and GP0 input. ; ;Conversion start & polling for completion ; are included. ; BANKSEL TRISIO ; BSF TRISIO,0 ;Set GP0 to input BANKSEL ANSEL ; MOVLW B’01110001’ ;ADC Frc clock, IORWF ANSEL ; and GP0 as analog BANKSEL ADCON0 ; MOVLW B’10000001’ ;Right justify, MOVWF ADCON0 ;Vdd Vref, AN0, On CALL SampleTime ;Acquisiton delay BSF ADCON0,GO ;Start conversion BTFSC ADCON0,GO ;Is conversion done? GOTO $-1 ;No, test again BANKSEL ADRESH ; MOVF ADRESH,W ;Read upper 2 bits MOVWF RESULTHI ;Store in GPR space BANKSEL ADRESL ; MOVF ADRESL,W ;Read lower 8 bits MOVWF RESULTLO ;Store in GPR space © 2007 Microchip Technology Inc. DS41211D-page 65 PIC12F683 REGISTER 9-1: ADCON0: A/D CONTROL REGISTER 0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 ADFM VCFG — — CHS1 CHS0 GO/DONE ADON bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7 ADFM: A/D Conversion Result Format Select bit 1 = Right justified 0 = Left justified bit 6 VCFG: Voltage Reference bit 1 = VREF pin 0 = VDD bit 5-4 Unimplemented: Read as ‘0’ bit 3-2 CHS<1:0>: Analog Channel Select bits 00 = AN0 01 = AN1 10 = AN2 11 = AN3 bit 1 GO/DONE: A/D Conversion Status bit 1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle. This bit is automatically cleared by hardware when the A/D conversion has completed. 0 = A/D conversion completed/not in progress bit 0 ADON: ADC Enable bit 1 = ADC is enabled 0 = ADC is disabled and consumes no operating current PIC12F683 DS41211D-page 66 © 2007 Microchip Technology Inc. REGISTER 9-2: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x ADRES9 ADRES8 ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 ADRES<9:2>: ADC Result Register bits Upper 8 bits of 10-bit conversion result REGISTER 9-3: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x ADRES1 ADRES0 — — — — — — bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 ADRES<1:0>: ADC Result Register bits Lower 2 bits of 10-bit conversion result bit 5-0 Reserved: Do not use. REGISTER 9-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x — — — — — — ADRES9 ADRES8 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-2 Reserved: Do not use. bit 1-0 ADRES<9:8>: ADC Result Register bits Upper 2 bits of 10-bit conversion result REGISTER 9-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x ADRES7 ADRES6 ADRES5 ADRES4 ADRES3 ADRES2 ADRES1 ADRES0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 ADRES<7:0>: ADC Result Register bits Lower 8 bits of 10-bit conversion result © 2007 Microchip Technology Inc. DS41211D-page 67 PIC12F683 9.3 A/D Acquisition Requirements For the ADC to meet its specified accuracy, the charge holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The Analog Input model is shown in Figure 9-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD), see Figure 9-4. The maximum recommended impedance for analog sources is 10 kΩ. As the source impedance is decreased, the acquisition time may be decreased. After the analog input channel is selected (or changed), an A/D acquisition must be done before the conversion can be started. To calculate the minimum acquisition time, Equation 9-1 may be used. This equation assumes that 1/2 LSb error is used (1024 steps for the ADC). The 1/2 LSb error is the maximum error allowed for the ADC to meet its specified resolution. EQUATION 9-1: ACQUISITION TIME EXAMPLE TACQ Amplifier Settling Time Hold Capacitor Charging = + Time + Temperature Coefficient = TAMP + TC + TCOFF = 2μs + TC + [(Temperature - 25°C)(0.05μs/°C)] TC = –CHOLD(RIC + RSS + RS) ln(1/2047) = –10pF(1kΩ + 7kΩ + 10kΩ) ln(0.0004885) = 1.37μs TACQ = 2μS + 1.37μS + [(50°C- 25°C)(0.05μS/°C)] = 4.67μS VAPPLIED 1 e –Tc RC --------- – ⎝ ⎠ ⎜ ⎟ ⎛ ⎞ VAPPLIED 1 1 2047 ⎝ – -----------⎠ = ⎛ ⎞ VAPPLIED 1 1 2047 ⎝ – -----------⎠ ⎛ ⎞ = VCHOLD VAPPLIED 1 e –TC RC --------- – ⎝ ⎠ ⎜ ⎟ ⎛ ⎞ = VCHOLD ;[1] VCHOLD charged to within 1/2 lsb ;[2] VCHOLD charge response to VAPPLIED ;combining [1] and [2] The value for TC can be approximated with the following equations: Solving for TC: Therefore: Assumptions: Temperature = 50°C and external impedance of 10kΩ 5.0V VDD Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out. 2: The charge holding capacitor (CHOLD) is not discharged after each conversion. 3: The maximum recommended impedance for analog sources is 10 kΩ. This is required to meet the pin leakage specification. PIC12F683 DS41211D-page 68 © 2007 Microchip Technology Inc. FIGURE 9-4: ANALOG INPUT MODEL FIGURE 9-5: ADC TRANSFER FUNCTION VA CPIN Rs ANx 5 pF VDD VT = 0.6V VT = 0.6V I LEAKAGE RIC ≤ 1k Sampling Switch SS Rss CHOLD = 10 pF VSS/VREF- 6V Sampling Switch 5V 4V 3V 2V 5 6 7 8 91011 (kΩ) VDD ± 500 nA Legend: CPIN VT I LEAKAGE RIC SS CHOLD = Input Capacitance = Threshold Voltage = Leakage current at the pin due to = Interconnect Resistance = Sampling Switch = Sample/Hold Capacitance various junctions RSS 3FFh 3FEh ADC Output Code 3FDh 3FCh 004h 003h 002h 001h 000h Full-Scale 3FBh 1 LSB ideal VSS/VREF- Zero-Scale Transition VDD/VREF+ Transition 1 LSB ideal Full-Scale Range Analog Input Voltage © 2007 Microchip Technology Inc. DS41211D-page 69 PIC12F683 TABLE 9-2: SUMMARY OF ASSOCIATED ADC REGISTERS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets ADCON0 ADFM VCFG — — CHS1 CHS0 GO/DONE ADON 00-- 0000 0000 0000 ANSEL — ADCS2 ADCS1 ADCS0 ANS3 ANS2 ANS1 ANS0 -000 1111 -000 1111 ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 0000 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 GPIO — — GP5 GP4 GP3 GP2 GP1 GP0 --xx xxxx --uu uuuu TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for ADC module. PIC12F683 DS41211D-page 70 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 71 PIC12F683 10.0 DATA EEPROM MEMORY The EEPROM data memory is readable and writable during normal operation (full VDD range). This memory is not directly mapped in the register file space. Instead, it is indirectly addressed through the Special Function Registers. There are four SFRs used to read and write this memory: • EECON1 • EECON2 (not a physically implemented register) • EEDAT • EEADR EEDAT holds the 8-bit data for read/write, and EEADR holds the address of the EEPROM location being accessed. PIC12F683 has 256 bytes of data EEPROM with an address range from 0h to FFh. The EEPROM data memory allows byte read and write. A byte write automatically erases the location and writes the new data (erase before write). The EEPROM data memory is rated for high erase/write cycles. The write time is controlled by an on-chip timer. The write time will vary with voltage and temperature as well as from chip-to-chip. Please refer to AC Specifications in Section 15.0 “Electrical Specifications” for exact limits. When the data memory is code-protected, the CPU may continue to read and write the data EEPROM memory. The device programmer can no longer access the data EEPROM data and will read zeroes. REGISTER 10-1: EEDAT: EEPROM DATA REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 EEDATn: Byte Value to Write To or Read From Data EEPROM bits REGISTER 10-2: EEADR: EEPROM ADDRESS REGISTER R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-0 EEADR: Specifies One of 256 Locations for EEPROM Read/Write Operation bits PIC12F683 DS41211D-page 72 © 2007 Microchip Technology Inc. 10.1 EECON1 and EECON2 Registers EECON1 is the control register with four low-order bits physically implemented. The upper four bits are nonimplemented and read as ‘0’s. Control bits RD and WR initiate read and write, respectively. These bits cannot be cleared, only set in software. They are cleared in hardware at completion of the read or write operation. The inability to clear the WR bit in software prevents the accidental, premature termination of a write operation. The WREN bit, when set, will allow a write operation. On power-up, the WREN bit is clear. The WRERR bit is set when a write operation is interrupted by a MCLR Reset, or a WDT Time-out Reset during normal operation. In these situations, following Reset, the user can check the WRERR bit, clear it and rewrite the location. The data and address will be cleared. Therefore, the EEDAT and EEADR registers will need to be re-initialized. Interrupt flag, EEIF bit of the PIR1 register, is set when write is complete. This bit must be cleared in software. EECON2 is not a physical register. Reading EECON2 will read all ‘0’s. The EECON2 register is used exclusively in the data EEPROM write sequence. Note: The EECON1, EEDAT and EEADR registers should not be modified during a data EEPROM write (WR bit = 1). REGISTER 10-3: EECON1: EEPROM CONTROL REGISTER U-0 U-0 U-0 U-0 R/W-x R/W-0 R/S-0 R/S-0 — — — — WRERR WREN WR RD bit 7 bit 0 Legend: S = Bit can only be set R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-4 Unimplemented: Read as ‘0’ bit 3 WRERR: EEPROM Error Flag bit 1 = A write operation is prematurely terminated (any MCLR Reset, any WDT Reset during normal operation or BOR Reset) 0 = The write operation completed bit 2 WREN: EEPROM Write Enable bit 1 = Allows write cycles 0 = Inhibits write to the data EEPROM bit 1 WR: Write Control bit 1 = Initiates a write cycle (The bit is cleared by hardware once write is complete. The WR bit can only be set, not cleared, in software.) 0 = Write cycle to the data EEPROM is complete bit 0 RD: Read Control bit 1 = Initiates an EEPROM read (Read takes one cycle. RD is cleared in hardware. The RD bit can only be set, not cleared, in software.) 0 = Does not initiate an EEPROM read © 2007 Microchip Technology Inc. DS41211D-page 73 PIC12F683 10.2 Reading the EEPROM Data Memory To read a data memory location, the user must write the address to the EEADR register and then set control bit RD of the EECON1 register, as shown in Example 10-1. The data is available, at the very next cycle, in the EEDAT register. Therefore, it can be read in the next instruction. EEDAT holds this value until another read, or until it is written to by the user (during a write operation). EXAMPLE 10-1: DATA EEPROM READ 10.3 Writing to the EEPROM Data Memory To write an EEPROM data location, the user must first write the address to the EEADR register and the data to the EEDAT register. Then the user must follow a specific sequence to initiate the write for each byte, as shown in Example 10-2. EXAMPLE 10-2: DATA EEPROM WRITE The write will not initiate if the above sequence is not exactly followed (write 55h to EECON2, write AAh to EECON2, then set WR bit) for each byte. We strongly recommend that interrupts be disabled during this code segment. A cycle count is executed during the required sequence. Any number that is not equal to the required cycles to execute the required sequence will prevent the data from being written into the EEPROM. Additionally, the WREN bit in EECON1 must be set to enable write. This mechanism prevents accidental writes to data EEPROM due to errant (unexpected) code execution (i.e., lost programs). The user should keep the WREN bit clear at all times, except when updating EEPROM. The WREN bit is not cleared by hardware. After a write sequence has been initiated, clearing the WREN bit will not affect this write cycle. The WR bit will be inhibited from being set unless the WREN bit is set. At the completion of the write cycle, the WR bit is cleared in hardware and the EE Write Complete Interrupt Flag bit (EEIF) is set. The user can either enable this interrupt or poll this bit. The EEIF bit of the PIR1 register must be cleared by software. 10.4 Write Verify Depending on the application, good programming practice may dictate that the value written to the data EEPROM should be verified (see Example 10-3) to the desired value to be written. EXAMPLE 10-3: WRITE VERIFY 10.4.1 USING THE DATA EEPROM The data EEPROM is a high-endurance, byte addressable array that has been optimized for the storage of frequently changing information (e.g., program variables or other data that are updated often). When variables in one section change frequently, while variables in another section do not change, it is possible to exceed the total number of write cycles to the EEPROM (specification D124) without exceeding the total number of write cycles to a single byte (specifications D120 and D120A). If this is the case, then a refresh of the array must be performed. For this reason, variables that change infrequently (such as constants, IDs, calibration, etc.) should be stored in Flash program memory. BANKSEL EEADR ; MOVLW CONFIG_ADDR ; MOVWF EEADR ;Address to read BSF EECON1,RD ;EE Read MOVF EEDAT,W ;Move data to W BANKSEL EECON1 ; BSF EECON1,WREN ;Enable write BCF INTCON,GIE ;Disable INTs BTFSC INTCON,GIE ;See AN576 GOTO $-2 ; MOVLW 55h ;Unlock write MOVWF EECON2 ; MOVLW AAh ; MOVWF EECON2 ; BSF EECON1,WR ;Start the write BSF INTCON,GIE ;Enable INTS Required Sequence BANKSELEEDAT ; MOVF EEDAT,W ;EEDAT not changed ;from previous write BSF EECON1,RD ;YES, Read the ;value written XORWF EEDAT,W BTFSS STATUS,Z ;Is data the same GOTO WRITE_ERR ;No, handle error : ;Yes, continue PIC12F683 DS41211D-page 74 © 2007 Microchip Technology Inc. 10.5 Protection Against Spurious Write There are conditions when the user may not want to write to the data EEPROM memory. To protect against spurious EEPROM writes, various mechanisms have been built in. On power-up, WREN is cleared. Also, the Power-up Timer (64 ms duration) prevents EEPROM write. The write initiate sequence and the WREN bit together help prevent an accidental write during: • Brown-out • Power Glitch • Software Malfunction 10.6 Data EEPROM Operation During Code-Protect Data memory can be code-protected by programming the CPD bit in the Configuration Word register (Register 12-1) to ‘0’. When the data memory is code-protected, the CPU is able to read and write data to the data EEPROM. It is recommended to code-protect the program memory when code-protecting data memory. This prevents anyone from programming zeroes over the existing code (which will execute as NOPs) to reach an added routine, programmed in unused program memory, which outputs the contents of data memory. Programming unused locations in program memory to ‘0’ will also help prevent data memory code protection from becoming breached. TABLE 10-1: SUMMARY OF ASSOCIATED DATA EEPROM REGISTERS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 000- 0000 EEDAT EEDAT7 EEDAT6 EEDAT5 EEDAT4 EEDAT3 EEDAT2 EEDAT1 EEDAT0 0000 0000 0000 0000 EEADR EEADR7 EEADR6 EEADR5 EEADR4 EEADR3 EEADR2 EEADR1 EEADR0 0000 0000 0000 0000 EECON1 — — — — WRERR WREN WR RD ---- x000 ---- q000 EECON2(1) EEPROM Control Register 2 ---- ---- ---- ---- Legend: x = unknown, u = unchanged, – = unimplemented read as ‘0’, q = value depends upon condition. Shaded cells are not used by the Data EEPROM module. Note 1: EECON2 is not a physical register. © 2007 Microchip Technology Inc. DS41211D-page 75 PIC12F683 11.0 CAPTURE/COMPARE/PWM (CCP) MODULE The Capture/Compare/PWM module is a peripheral which allows the user to time and control different events. In Capture mode, the peripheral allows the timing of the duration of an event.The Compare mode allows the user to trigger an external event when a predetermined amount of time has expired. The PWM mode can generate a Pulse-Width Modulated signal of varying frequency and duty cycle. The timer resources used by the module are shown in Table 11-1 Additional information on CCP modules is available in the Application Note AN594, “Using the CCP Modules” (DS00594). TABLE 11-1: CCP MODE – TIMER RESOURCES REQUIRED CCP Mode Timer Resource Capture Timer1 Compare Timer1 PWM Timer2 REGISTER 11-1: CCP1CON: CCP1 CONTROL REGISTER U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-6 Unimplemented: Read as ‘0’ bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits Capture mode: Unused. Compare mode: Unused. PWM mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L. bit 3-0 CCP1M<3:0>: CCP Mode Select bits 0000 = Capture/Compare/PWM off (resets CCP module) 0001 = Unused (reserved) 0010 = Unused (reserved) 0011 = Unused (reserved) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CCP1IF bit is set) 1001 = Compare mode, clear output on match (CCP1IF bit is set) 1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected) 1011 = Compare mode, trigger special event (CCP1IF bit is set, TMR1 is reset and A/D conversion is started if the ADC module is enabled. CCP1 pin is unaffected.) 110x = PWM mode active-high 111x = PWM mode active-low PIC12F683 DS41211D-page 76 © 2007 Microchip Technology Inc. 11.1 Capture Mode In Capture mode, CCPR1H:CCPR1L captures the 16-bit value of the TMR1 register when an event occurs on pin CCP1. An event is defined as one of the following and is configured by the CCP1M<3:0> bits of the CCP1CON register: • Every falling edge • Every rising edge • Every 4th rising edge • Every 16th rising edge When a capture is made, the Interrupt Request Flag bit CCP1IF of the PIR1 register is set. The interrupt flag must be cleared in software. If another capture occurs before the value in the CCPR1H, CCPR1L register pair is read, the old captured value is overwritten by the new captured value (see Figure 11-1). 11.1.1 CCP1 PIN CONFIGURATION In Capture mode, the CCP1 pin should be configured as an input by setting the associated TRIS control bit. FIGURE 11-1: CAPTURE MODE OPERATION BLOCK DIAGRAM 11.1.2 TIMER1 MODE SELECTION Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. 11.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep the CCP1IE interrupt enable bit of the PIE1 register clear to avoid false interrupts. Additionally, the user should clear the CCP1IF interrupt flag bit of the PIR1 register following any change in operating mode. 11.1.4 CCP PRESCALER There are four prescaler settings specified by the CCP1M<3:0> bits of the CCP1CON register. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. Any Reset will clear the prescaler counter. Switching from one capture prescaler to another does not clear the prescaler and may generate a false interrupt. To avoid this unexpected operation, turn the module off by clearing the CCP1CON register before changing the prescaler (see Example 11-1). EXAMPLE 11-1: CHANGING BETWEEN CAPTURE PRESCALERS Note: If the CCP1 pin is configured as an output, a write to the GPIO port can cause a capture condition. CCPR1H CCPR1L TMR1H TMR1L Set Flag bit CCP1IF (PIR1 register) Capture Enable CCP1CON<3:0> Prescaler ÷ 1, 4, 16 and Edge Detect pin CCP1 System Clock (FOSC) BANKSEL CCP1CON ;Set Bank bits to point ;to CCP1CON CLRF CCP1CON ;Turn CCP module off MOVLW NEW_CAPT_PS ;Load the W reg with ; the new prescaler ; move value and CCP ON MOVWF CCP1CON ;Load CCP1CON with this ; value © 2007 Microchip Technology Inc. DS41211D-page 77 PIC12F683 11.2 Compare Mode In Compare mode, the 16-bit CCPR1 register value is constantly compared against the TMR1 register pair value. When a match occurs, the CCP1 module may: • Toggle the CCP1 output. • Set the CCP1 output. • Clear the CCP1 output. • Generate a Special Event Trigger. • Generate a Software Interrupt. The action on the pin is based on the value of the CCP1M<3:0> control bits of the CCP1CON register. All Compare modes can generate an interrupt. FIGURE 11-2: COMPARE MODE OPERATION BLOCK DIAGRAM 11.2.1 CCP1 PIN CONFIGURATION The user must configure the CCP1 pin as an output by clearing the associated TRIS bit. 11.2.2 TIMER1 MODE SELECTION In Compare mode, Timer1 must be running in either Timer mode or Synchronized Counter mode. The compare operation may not work in Asynchronous Counter mode. 11.2.3 SOFTWARE INTERRUPT MODE When Generate Software Interrupt mode is chosen (CCP1M<3:0> = 1010), the CCP1 module does not assert control of the CCP1 pin (see the CCP1CON register). 11.2.4 SPECIAL EVENT TRIGGER When Special Event Trigger mode is chosen (CCP1M<3:0> = 1011), the CCP1 module does the following: • Resets Timer1 • Starts an ADC conversion if ADC is enabled The CCP1 module does not assert control of the CCP1 pin in this mode (see the CCP1CON register). The Special Event Trigger output of the CCP occurs immediately upon a match between the TMR1H, TMR1L register pair and the CCPR1H, CCPR1L register pair. The TMR1H, TMR1L register pair is not reset until the next rising edge of the Timer1 clock. This allows the CCPR1H, CCPR1L register pair to effectively provide a 16-bit programmable period register for Timer1. Note: Clearing the CCP1CON register will force the CCP1 compare output latch to the default low level. This is not the GPIO I/O data latch. CCPR1H CCPR1L TMR1H TMR1L Comparator Q S R Output Logic Special Event Trigger Set CCP1IF Interrupt Flag (PIR1) Match TRIS CCP1CON<3:0> Mode Select Output Enable Pin Special Event Trigger will: • Clear TMR1H and TMR1L registers. • NOT set interrupt flag bit TMR1IF of the PIR1 register. • Set the GO/DONE bit to start the ADC conversion. CCP1 4 Note 1: The Special Event Trigger from the CCP module does not set interrupt flag bit TMRxIF of the PIR1 register. 2: Removing the match condition by changing the contents of the CCPR1H and CCPR1L register pair, between the clock edge that generates the Special Event Trigger and the clock edge that generates the Timer1 Reset, will preclude the Reset from occurring. PIC12F683 DS41211D-page 78 © 2007 Microchip Technology Inc. 11.3 PWM Mode The PWM mode generates a Pulse-Width Modulated signal on the CCP1 pin. The duty cycle, period and resolution are determined by the following registers: • PR2 • T2CON • CCPR1L • CCP1CON In Pulse-Width Modulation (PWM) mode, the CCP module produces up to a 10-bit resolution PWM output on the CCP1 pin. Since the CCP1 pin is multiplexed with the PORT data latch, the TRIS for that pin must be cleared to enable the CCP1 pin output driver. Figure 11-1 shows a simplified block diagram of PWM operation. Figure 11-4 shows a typical waveform of the PWM signal. For a step-by-step procedure on how to set up the CCP module for PWM operation, see Section 11.3.7 “Setup for PWM Operation”. FIGURE 11-3: SIMPLIFIED PWM BLOCK DIAGRAM The PWM output (Figure 11-4) has a time base (period) and a time that the output stays high (duty cycle). FIGURE 11-4: CCP PWM OUTPUT Note: Clearing the CCP1CON register will relinquish CCP1 control of the CCP1 pin. CCPR1L CCPR1H(2) (Slave) Comparator TMR2 PR2 (1) R Q S Duty Cycle Registers CCP1CON<5:4> Clear Timer2, toggle CCP1 pin and latch duty cycle Note 1: The 8-bit timer TMR2 register is concatenated with the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. 2: In PWM mode, CCPR1H is a read-only register. TRIS CCP1 Pin Comparator Period Pulse Width TMR2 = 0 TMR2 = CCPR1L:CCP1CON<5:4> TMR2 = PR2 © 2007 Microchip Technology Inc. DS41211D-page 79 PIC12F683 11.3.1 PWM PERIOD The PWM period is specified by the PR2 register of Timer2. The PWM period can be calculated using the formula of Equation 11-1. EQUATION 11-1: PWM PERIOD When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set. (Exception: If the PWM duty cycle = 0%, the pin will not be set.) • The PWM duty cycle is latched from CCPR1L into CCPR1H. 11.3.2 PWM DUTY CYCLE The PWM duty cycle is specified by writing a 10-bit value to multiple registers: CCPR1L register and DC1B<1:0> bits of the CCP1CON register. The CCPR1L contains the eight MSbs and the CCP1<1:0> bits of the CCP1CON register contain the two LSbs. CCPR1L and DC1B<1:0> bits of the CCP1CON register can be written to at any time. The duty cycle value is not latched into CCPR1H until after the period completes (i.e., a match between PR2 and TMR2 registers occurs). While using the PWM, the CCPR1H register is read-only. Equation 11-2 is used to calculate the PWM pulse width. Equation 11-3 is used to calculate the PWM duty cycle ratio. EQUATION 11-2: PULSE WIDTH EQUATION 11-3: DUTY CYCLE RATIO The CCPR1H register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. The 8-bit timer TMR2 register is concatenated with either the 2-bit internal system clock (FOSC), or 2 bits of the prescaler, to create the 10-bit time base. The system clock is used if the Timer2 prescaler is set to 1:1. When the 10-bit time base matches the CCPR1H and 2- bit latch, then the CCP1 pin is cleared (see Figure 11-1). 11.3.3 PWM RESOLUTION The resolution determines the number of available duty cycles for a given period. For example, a 10-bit resolution will result in 1024 discrete duty cycles, whereas an 8-bit resolution will result in 256 discrete duty cycles. The maximum PWM resolution is 10 bits when PR2 is 255. The resolution is a function of the PR2 register value as shown by Equation 11-4. EQUATION 11-4: PWM RESOLUTION TABLE 11-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz) TABLE 11-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz) Note: The Timer2 postscaler (see Section 7.0 “Timer2 Module”) is not used in the determination of the PWM frequency. PWM Period = [(PR2) + 1] • 4 • TOSC • (TMR2 Prescale Value) Note: If the pulse width value is greater than the period the assigned PWM pin(s) will remain unchanged. Pulse Width = (CCPR1L:CCP1CON<5:4>) • TOSC • (TMR2 Prescale Value) Duty Cycle Ratio (CCPR1L:CCP1CON<5:4>) 4(PR2 + 1) = ----------------------------------------------------------------------- Resolution log[4(PR2 + 1)] log(2) = ------------------------------------------ bits PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz Timer Prescale (1, 4, 16) 16 4 1 1 1 1 PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17 Maximum Resolution (bits) 10 10 10 8 7 6.6 PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz Timer Prescale (1, 4, 16) 16 4 1 1 1 1 PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09 Maximum Resolution (bits) 8 8 8 6 5 5 PIC12F683 DS41211D-page 80 © 2007 Microchip Technology Inc. 11.3.4 OPERATION IN SLEEP MODE In Sleep mode, the TMR2 register will not increment and the state of the module will not change. If the CCP1 pin is driving a value, it will continue to drive that value. When the device wakes up, TMR2 will continue from its previous state. 11.3.5 CHANGES IN SYSTEM CLOCK FREQUENCY The PWM frequency is derived from the system clock frequency. Any changes in the system clock frequency will result in changes to the PWM frequency. See Section 3.0 “Oscillator Module (With Fail-Safe Clock Monitor)” for additional details. 11.3.6 EFFECTS OF RESET Any Reset will force all ports to Input mode and the CCP registers to their Reset states. 11.3.7 SETUP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for PWM operation: 1. Disable the PWM pin (CCP1) output drivers by setting the associated TRIS bit. 2. Set the PWM period by loading the PR2 register. 3. Configure the CCP module for the PWM mode by loading the CCP1CON register with the appropriate values. 4. Set the PWM duty cycle by loading the CCPR1L register and DC1B bits of the CCP1CON register. 5. Configure and start Timer2: • Clear the TMR2IF interrupt flag bit of the PIR1 register. • Set the Timer2 prescale value by loading the T2CKPS bits of the T2CON register. • Enable Timer2 by setting the TMR2ON bit of the T2CON register. 6. Enable PWM output after a new PWM cycle has started: • Wait until Timer2 overflows (TMR2IF bit of the PIR1 register is set). • Enable the CCP1 pin output driver by clearing the associated TRIS bit. © 2007 Microchip Technology Inc. DS41211D-page 81 PIC12F683 TABLE 11-4: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE AND TIMER1 TABLE 11-5: REGISTERS ASSOCIATED WITH PWM AND TIMER2 Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CCP1CON — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) xxxx xxxx xxxx xxxx CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) xxxx xxxx xxxx xxxx CMCON1 — — — — — — T1GSS CMSYNC ---- --10 ---- --10 INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 000- 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 T1CON T1GINV TMR1GE T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 0000 0000 0000 0000 TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx xxxx xxxx TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the Capture and Compare. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets CCP1CON — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) xxxx xxxx xxxx xxxx CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) xxxx xxxx xxxx xxxx INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 000x PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 -000 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 -000 0000 PR2 Timer2 Period Register 1111 1111 1111 1111 T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 TMR2 Timer2 Module Register 0000 0000 0000 0000 TRISIO — — TRISIO5 TRISIO4 TRISIO3 TRISIO2 TRISIO1 TRISIO0 --11 1111 --11 1111 Legend: – = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM. PIC12F683 DS41211D-page 82 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 83 PIC12F683 12.0 SPECIAL FEATURES OF THE CPU The PIC12F683 has a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving features and offer code protection. These features are: • Reset - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Oscillator Selection • Sleep • Code Protection • ID Locations • In-Circuit Serial Programming™ The PIC12F683 has two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 64 ms (nominal) on power-up only, designed to keep the part in Reset while the power supply stabilizes. There is also circuitry to reset the device if a brown-out occurs, which can use the Power-up Timer to provide at least a 64 ms Reset. With these three functions on-chip, most applications need no external Reset circuitry. The Sleep mode is designed to offer a very low-current Power-down mode. The user can wake-up from Sleep through: • External Reset • Watchdog Timer Wake-up • An interrupt Several oscillator options are also made available to allow the part to fit the application. The INTOSC option saves system cost while the LP crystal option saves power. A set of Configuration bits are used to select various options (see Register 12-1). 12.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’), or left unprogrammed (read as ‘1’) to select various device configurations as shown in Register 12-1. These bits are mapped in program memory location 2007h. Note: Address 2007h is beyond the user program memory space. It belongs to the special configuration memory space (2000h-3FFFh), which can be accessed only during programming. See “PIC12F6XX/16F6XX Memory Programming Specification” (DS41204) for more information. PIC12F683 DS41211D-page 84 © 2007 Microchip Technology Inc. REGISTER 12-1: CONFIG: CONFIGURATION WORD REGISTER — — — — FCMEN IESO BOREN1 BOREN0 bit 15 bit 8 CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 bit 7 bit 0 Legend: R = Readable bit W = Writable bit P = Programmable’ U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 15-12 Unimplemented: Read as ‘1’ bit 11 FCMEN: Fail-Safe Clock Monitor Enabled bit 1 = Fail-Safe Clock Monitor is enabled 0 = Fail-Safe Clock Monitor is disabled bit 10 IESO: Internal External Switchover bit 1 = Internal External Switchover mode is enabled 0 = Internal External Switchover mode is disabled bit 9-8 BOREN<1:0>: Brown-out Reset Selection bits(1) 11 = BOR enabled 10 = BOR enabled during operation and disabled in Sleep 01 = BOR controlled by SBOREN bit of the PCON register 00 = BOR disabled bit 7 CPD: Data Code Protection bit(2) 1 = Data memory code protection is disabled 0 = Data memory code protection is enabled bit 6 CP: Code Protection bit(3) 1 = Program memory code protection is disabled 0 = Program memory code protection is enabled bit 5 MCLRE: GP3/MCLR pin function select bit(4) 1 = GP3/MCLR pin function is MCLR 0 = GP3/MCLR pin function is digital input, MCLR internally tied to VDD bit 4 PWRTE: Power-up Timer Enable bit 1 = PWRT disabled 0 = PWRT enabled bit 3 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled and can be enabled by SWDTEN bit of the WDTCON register bit 2-0 FOSC<2:0>: Oscillator Selection bits 111 = RC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 110 = RCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, RC on GP5/OSC1/CLKIN 101 = INTOSC oscillator: CLKOUT function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 100 = INTOSCIO oscillator: I/O function on GP4/OSC2/CLKOUT pin, I/O function on GP5/OSC1/CLKIN 011 = EC: I/O function on GP4/OSC2/CLKOUT pin, CLKIN on GP5/OSC1/CLKIN 010 = HS oscillator: High-speed crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 001 = XT oscillator: Crystal/resonator on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN 000 = LP oscillator: Low-power crystal on GP4/OSC2/CLKOUT and GP5/OSC1/CLKIN Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer. 2: The entire data EEPROM will be erased when the code protection is turned off. 3: The entire program memory will be erased when the code protection is turned off. 4: When MCLR is asserted in INTOSC or RC mode, the internal clock oscillator is disabled. © 2007 Microchip Technology Inc. DS41211D-page 85 PIC12F683 12.2 Calibration Bits Brown-out Reset (BOR), Power-on Reset (POR) and 8 MHz internal oscillator (HFINTOSC) are factory calibrated. These calibration values are stored in fuses located in the Calibration Word (2009h). The Calibration Word is not erased when using the specified bulk erase sequence in the “PIC12F6XX/16F6XX Memory Programming Specification” (DS41244) and thus, does not require reprogramming. 12.3 Reset The PIC12F683 differentiates between various kinds of Reset: a) Power-on Reset (POR) b) WDT Reset during normal operation c) WDT Reset during Sleep d) MCLR Reset during normal operation e) MCLR Reset during Sleep f) Brown-out Reset (BOR) Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on: • Power-on Reset • MCLR Reset • MCLR Reset during Sleep • WDT Reset • Brown-out Reset (BOR) WDT wake-up does not cause register resets in the same manner as a WDT Reset since wake-up is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different Reset situations, as indicated in Table 12-2. Software can use these bits to determine the nature of the Reset. See Table 12-4 for a full description of Reset states of all registers. A simplified block diagram of the On-Chip Reset Circuit is shown in Figure 12-1. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Section 15.0 “Electrical Specifications” for pulse-width specifications. FIGURE 12-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT Note 1: Refer to the Configuration Word register (Register 12-1). S R Q External Reset MCLR/VPP pin VDD OSC1/ WDT Module VDD Rise Detect OST/PWRT LFINTOSC WDT Time-out Power-on Reset OST 10-bit Ripple Counter PWRT Chip_Reset 11-bit Ripple Counter Reset Enable OST Enable PWRT SLEEP Brown-out(1) Reset SBOREN BOREN CLKI pin PIC12F683 DS41211D-page 86 © 2007 Microchip Technology Inc. 12.3.1 POWER-ON RESET The on-chip POR circuit holds the chip in Reset until VDD has reached a high enough level for proper operation. To take advantage of the POR, simply connect the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. A maximum rise time for VDD is required. See Section 15.0 “Electrical Specifications” for details. If the BOR is enabled, the maximum rise time specification does not apply. The BOR circuitry will keep the device in Reset until VDD reaches VBOD (see Section 12.3.4 “Brown-Out Reset (BOR)”). When the device starts normal operation (exits the Reset condition), device operating parameters (i.e., voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. For additional information, refer to the Application Note AN607, “Power-up Trouble Shooting” (DS00607). 12.3.2 MCLR PIC12F683 has a noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. Voltages applied to the MCLR pin that exceed its specification can result in both MCLR Resets and excessive current beyond the device specification during the ESD event. For this reason, Microchip recommends that the MCLR pin no longer be tied directly to VDD. The use of an RC network, as shown in Figure 12-2, is suggested. An internal MCLR option is enabled by clearing the MCLRE bit in the Configuration Word register. When MCLRE = 0, the Reset signal to the chip is generated internally. When the MCLRE = 1, the GP3/MCLR pin becomes an external Reset input. In this mode, the GP3/MCLR pin has a weak pull-up to VDD. FIGURE 12-2: RECOMMENDED MCLR CIRCUIT 12.3.3 POWER-UP TIMER (PWRT) The Power-up Timer provides a fixed 64 ms (nominal) time-out on power-up only, from POR or Brown-out Reset. The Power-up Timer operates from the 31 kHz LFINTOSC oscillator. For more information, see Section 3.5 “Internal Clock Modes”. The chip is kept in Reset as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A Configuration bit, PWRTE, can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer should be enabled when Brown-out Reset is enabled, although it is not required. The Power-up Timer delay will vary from chip-to-chip due to: • VDD variation • Temperature variation • Process variation See DC parameters for details (Section 15.0 “Electrical Specifications”). Note: The POR circuit does not produce an internal Reset when VDD declines. To re-enable the POR, VDD must reach Vss for a minimum of 100 μs. Note: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 Ω should be used when applying a “low” level to the MCLR pin, rather than pulling this pin directly to VSS. VDD PIC® MCLR R1 1 kΩ (or greater) C1 0.1 μF (optional, not critical) R2 100 Ω SW1 (needed with capacitor) (optional) MCU © 2007 Microchip Technology Inc. DS41211D-page 87 PIC12F683 12.3.4 BROWN-OUT RESET (BOR) The BOREN0 and BOREN1 bits in the Configuration Word register select one of four BOR modes. Two modes have been added to allow software or hardware control of the BOR enable. When BOREN<1:0> = 01, the SBOREN bit of the PCON register enables/disables the BOR, allowing it to be controlled in software. By selecting BOREN<1:0> = 10, the BOR is automatically disabled in Sleep to conserve power and enabled on wake-up. In this mode, the SBOREN bit is disabled. See Register 12-1 for the Configuration Word definition. A brown-out occurs when VDD falls below VBOR for greater than parameter TBOR (see Section 15.0 “Electrical Specifications”). The brown-out condition will reset the device. This will occur regardless of VDD slew rate. A Brown-out Reset may not occur if VDD falls below VBOR for less than parameter TBOR. On any Reset (Power-on, Brown-out Reset, Watchdog Timer, etc.), the chip will remain in Reset until VDD rises above VBOR (see Figure 12-3). If enabled, the Power-up Timer will be invoked by the Reset and keep the chip in Reset an additional 64 ms. If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be re-initialized. Once VDD rises above VBOR, the Power-up Timer will execute a 64 ms Reset. 12.3.5 BOR CALIBRATION The PIC12F683 stores the BOR calibration values in fuses located in the Calibration Word register (2008h). The Calibration Word register is not erased when using the specified bulk erase sequence in the “PIC12F6XX/16F6XX Memory Programming Specification” (DS41204) and thus, does not require reprogramming. FIGURE 12-3: BROWN-OUT SITUATIONS Note: The Power-up Timer is enabled by the PWRTE bit in the Configuration Word register. Note: Address 2008h is beyond the user program memory space. It belongs to the special configuration memory space (2000h-3FFFh), which can be accessed only during programming. See “PIC12F6XX/16F6XX Memory Programming Specification” (DS41204) for more information. 64 ms(1) VBOR VDD Internal Reset VBOR VDD Internal Reset 64 ms(1) < 64 ms 64 ms(1) VBOR VDD Internal Reset Note 1: 64 ms delay only if PWRTE bit is programmed to ‘0’. PIC12F683 DS41211D-page 88 © 2007 Microchip Technology Inc. 12.3.6 TIME-OUT SEQUENCE On power-up, the time-out sequence is as follows: • PWRT time-out is invoked after POR has expired. • OST is activated after the PWRT time-out has expired. The total time-out will vary based on oscillator configuration and PWRTE bit status. For example, in EC mode with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figure 12-4, Figure 12-5 and Figure 12-6 depict time-out sequences. The device can execute code from the INTOSC while OST is active by enabling Two-Speed Start-up or Fail-Safe Monitor (see Section 3.7.2 “Two-Speed Start-up Sequence” and Section 3.8 “Fail-Safe Clock Monitor”). Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then, bringing MCLR high will begin execution immediately (see Figure 12-5). This is useful for testing purposes or to synchronize more than one PIC12F683 device operating in parallel. Table 12-5 shows the Reset conditions for some special registers, while Table 12-4 shows the Reset conditions for all the registers. 12.3.7 POWER CONTROL (PCON) REGISTER The Power Control register PCON (address 8Eh) has two Status bits to indicate what type of Reset occurred last. Bit 0 is BOR (Brown-out). BOR is unknown on Power-on Reset. It must then be set by the user and checked on subsequent Resets to see if BOR = 0, indicating that a Brown-out has occurred. The BOR Status bit is a “don’t care” and is not necessarily predictable if the brown-out circuit is disabled (BOREN<1:0> = 00 in the Configuration Word register). Bit 1 is POR (Power-on Reset). It is a ‘0’ on Power-on Reset and unaffected otherwise. The user must write a ‘1’ to this bit following a Power-on Reset. On a subsequent Reset, if POR is ‘0’, it will indicate that a Power-on Reset has occurred (i.e., VDD may have gone too low). For more information, see Section 4.2.4 “Ultra Low-Power Wake-up” and Section 12.3.4 “Brown-Out Reset (BOR)”. TABLE 12-1: TIME-OUT IN VARIOUS SITUATIONS TABLE 12-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE TABLE 12-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT RESET Oscillator Configuration Power-up Brown-out Reset Wake-up from PWRTE = 0 PWRTE = 1 PWRTE = 0 PWRTE = 1 Sleep XT, HS, LP TPWRT + 1024 • TOSC 1024 • TOSC TPWRT + 1024 • TOSC 1024 • TOSC 1024 • TOSC RC, EC, INTOSC TPWRT — TPWRT — — POR BOR TO PD Condition 0 x 1 1 Power-on Reset u 0 1 1 Brown-out Reset u u 0 u WDT Reset u u 0 0 WDT Wake-up u u u u MCLR Reset during normal operation u u 1 0 MCLR Reset during Sleep Legend: u = unchanged, x = unknown Name Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets(1) CONFIG(2) BOREN1 BOREN0 CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — — PCON — — ULPWUE SBOREN — — POR BOR --01 --qq --0u --uu STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition. Shaded cells are not used by BOR. Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation. 2: See Configuration Word register (Register 12-1) for operation of all register bits. © 2007 Microchip Technology Inc. DS41211D-page 89 PIC12F683 FIGURE 12-4: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR) FIGURE 12-5: TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR) FIGURE 12-6: TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD) TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset TPWRT TOST TPWRT TOST VDD MCLR Internal POR PWRT Time-out OST Time-out Internal Reset PIC12F683 DS41211D-page 90 © 2007 Microchip Technology Inc. TABLE 12-4: INITIALIZATION CONDITION FOR REGISTERS Register Address Power-on Reset MCLR Reset WDT Reset Brown-out Reset(1) Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out W — xxxx xxxx uuuu uuuu uuuu uuuu INDF 00h/80h xxxx xxxx xxxx xxxx uuuu uuuu TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h/82h 0000 0000 0000 0000 PC + 1(3) STATUS 03h/83h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h/84h xxxx xxxx uuuu uuuu uuuu uuuu GPIO 05h --x0 x000 --x0 x000 --uu uuuu PCLATH 0Ah/8Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh/8Bh 0000 0000 0000 0000 uuuu uuuu(2) PIR1 0Ch 0000 0000 0000 0000 uuuu uuuu(2) TMR1L 0Eh xxxx xxxx uuuu uuuu uuuu uuuu TMR1H 0Fh xxxx xxxx uuuu uuuu uuuu uuuu T1CON 10h 0000 0000 uuuu uuuu -uuu uuuu TMR2 11h 0000 0000 0000 0000 uuuu uuuu T2CON 12h -000 0000 -000 0000 -uuu uuuu CCPR1L 13h xxxx xxxx uuuu uuuu uuuu uuuu CCPR1H 14h xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON 15h --00 0000 --00 0000 --uu uuuu WDTCON 18h ---0 1000 ---0 1000 ---u uuuu CMCON0 19h 0000 0000 0000 0000 uuuu uuuu CMCON1 20h ---- --10 ---- --10 ---- --uu ADRESH 1Eh xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 1Fh 00-- 0000 00-- 0000 uu-- uuuu OPTION_REG 81h 1111 1111 1111 1111 uuuu uuuu TRISIO 85h --11 1111 --11 1111 --uu uuuu PIE1 8Ch 0000 0000 0000 0000 uuuu uuuu PCON 8Eh --01 --0x --0u --uu(1,5) --uu --uu OSCCON 8Fh -110 q000 -110 q000 -uuu uuuu OSCTUNE 90h ---0 0000 ---u uuuu ---u uuuu PR2 92h 1111 1111 1111 1111 1111 1111 WPU 95h --11 -111 --11 -111 uuuu uuuu IOC 96h --00 0000 --00 0000 --uu uuuu VRCON 99h 0-0- 0000 0-0- 0000 u-u- uuuu EEDAT 9Ah 0000 0000 0000 0000 uuuu uuuu EEADR 9Bh 0000 0000 0000 0000 uuuu uuuu Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition. Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. 2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 4: See Table 12-5 for Reset value for specific condition. 5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u. © 2007 Microchip Technology Inc. DS41211D-page 91 PIC12F683 TABLE 12-5: INITIALIZATION CONDITION FOR SPECIAL REGISTERS EECON1 9Ch ---- x000 ---- q000 ---- uuuu EECON2 9Dh ---- ---- ---- ---- ---- ---- ADRESL 9Eh xxxx xxxx uuuu uuuu uuuu uuuu ANSEL 9Fh -000 1111 -000 1111 -uuu uuuu TABLE 12-4: INITIALIZATION CONDITION FOR REGISTERS (CONTINUED) Register Address Power-on Reset MCLR Reset WDT Reset Brown-out Reset(1) Wake-up from Sleep through Interrupt Wake-up from Sleep through WDT Time-out Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’, q = value depends on condition. Note 1: If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. 2: One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). 3: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). 4: See Table 12-5 for Reset value for specific condition. 5: If Reset was due to brown-out, then bit 0 = 0. All other Resets will cause bit 0 = u. Condition Program Counter Status Register PCON Register Power-on Reset 000h 0001 1xxx --01 --0x MCLR Reset during Normal Operation 000h 000u uuuu --0u --uu MCLR Reset during Sleep 000h 0001 0uuu --0u --uu WDT Reset 000h 0000 uuuu --0u --uu WDT Wake-up PC + 1 uuu0 0uuu --uu --uu Brown-out Reset 000h 0001 1uuu --01 --10 Interrupt Wake-up from Sleep PC + 1(1) uuu1 0uuu --uu --uu Legend: u = unchanged, x = unknown, – = unimplemented bit, reads as ‘0’. Note 1: When the wake-up is due to an interrupt and Global Interrupt Enable bit, GIE, is set, the PC is loaded with the interrupt vector (0004h) after execution of PC + 1. PIC12F683 DS41211D-page 92 © 2007 Microchip Technology Inc. 12.4 Interrupts The PIC12F683 has multiple interrupt sources: • External Interrupt GP2/INT • Timer0 Overflow Interrupt • GPIO Change Interrupts • Comparator Interrupt • A/D Interrupt • Timer1 Overflow Interrupt • Timer2 Match Interrupt • EEPROM Data Write Interrupt • Fail-Safe Clock Monitor Interrupt • CCP Interrupt The Interrupt Control register (INTCON) and Peripheral Interrupt Request Register 1 (PIR1) record individual interrupt requests in flag bits. The INTCON register also has individual and global interrupt enable bits. The Global Interrupt Enable bit, GIE of the INTCON register, enables (if set) all unmasked interrupts, or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in the INTCON register and PIE1 register. GIE is cleared on Reset. When an interrupt is serviced, the following actions occur automatically: • The GIE is cleared to disable any further interrupt. • The return address is pushed onto the stack. • The PC is loaded with 0004h. The Return from Interrupt instruction, RETFIE, exits the interrupt routine, as well as sets the GIE bit, which re-enables unmasked interrupts. The following interrupt flags are contained in the INTCON register: • INT Pin Interrupt • GPIO Change Interrupt • Timer0 Overflow Interrupt The peripheral interrupt flags are contained in the PIR1 register. The corresponding interrupt enable bit is contained in the PIE1 register. The following interrupt flags are contained in the PIR1 register: • EEPROM Data Write Interrupt • A/D Interrupt • Comparator Interrupt • Timer1 Overflow Interrupt • Timer2 Match Interrupt • Fail-Safe Clock Monitor Interrupt • CCP Interrupt For external interrupt events, such as the INT pin or GPIO change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends upon when the interrupt event occurs (see Figure 12-8). The latency is the same for one or two-cycle instructions. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid multiple interrupt requests. For additional information on Timer1, Timer2, comparators, ADC, data EEPROM or Enhanced CCP modules, refer to the respective peripheral section. 12.4.1 GP2/INT INTERRUPT The external interrupt on the GP2/INT pin is edge-triggered; either on the rising edge if the INTEDG bit of the OPTION register is set, or the falling edge, if the INTEDG bit is clear. When a valid edge appears on the GP2/INT pin, the INTF bit of the INTCON register is set. This interrupt can be disabled by clearing the INTE control bit of the INTCON register. The INTF bit must be cleared by software in the Interrupt Service Routine before re-enabling this interrupt. The GP2/INT interrupt can wake-up the processor from Sleep, if the INTE bit was set prior to going into Sleep. See Section 12.7 “Power-Down Mode (Sleep)” for details on Sleep and Figure 12-10 for timing of wake-up from Sleep through GP2/INT interrupt. Note 1: Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The interrupts, which were ignored, are still pending to be serviced when the GIE bit is set again. Note: The ANSEL and CMCON0 registers must be initialized to configure an analog channel as a digital input. Pins configured as analog inputs will read ‘0’ and cannot generate an interrupt. © 2007 Microchip Technology Inc. DS41211D-page 93 PIC12F683 12.4.2 TIMER0 INTERRUPT An overflow (FFh → 00h) in the TMR0 register will set the T0IF (INTCON<2>) bit. The interrupt can be enabled/disabled by setting/clearing the T0IE bit of the INTCON register. See Section 5.0 “Timer0 Module” for operation of the Timer0 module. 12.4.3 GPIO INTERRUPT An input change on GPIO change sets the GPIF bit of the INTCON register. The interrupt can be enabled/disabled by setting/clearing the GPIE bit of the INTCON register. Plus, individual pins can be configured through the IOC register. FIGURE 12-7: INTERRUPT LOGIC Note: If a change on the I/O pin should occur when any GPIO operation is being executed, then the GPIF interrupt flag may not get set. TMR1IF TMR1IE CMIF CMIE T0IF T0IE INTF INTE GPIF GPIE GIE PEIE Wake-up (If in Sleep mode) Interrupt to CPU EEIE EEIF ADIF ADIE IOC-GP0 IOC0 IOC-GP1 IOC1 IOC-GP2 IOC2 IOC-GP3 IOC3 IOC-GP4 IOC4 IOC-GP5 IOC5 TMR2IF TMR2IE CCP1IF CCP1IE OSFIF OSFIE PIC12F683 DS41211D-page 94 © 2007 Microchip Technology Inc. FIGURE 12-8: INT PIN INTERRUPT TIMING TABLE 12-6: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets INTCON GIE PEIE T0IE INTE GPIE T0IF INTF GPIF 0000 0000 0000 0000 IOC — — IOC5 IOC4 IOC3 IOC2 IOC1 IOC0 --00 0000 --00 0000 PIR1 EEIF ADIF CCP1IF — CMIF OSFIF TMR2IF TMR1IF 000- 0000 000- 0000 PIE1 EEIE ADIE CCP1IE — CMIE OSFIE TMR2IE TMR1IE 000- 0000 000- 0000 Legend: x = unknown, u = unchanged, – = unimplemented read as ‘0’, q = value depends upon condition. Shaded cells are not used by the interrupt module. Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT INT pin INTF flag (INTCON reg.) GIE bit (INTCON reg.) INSTRUCTION FLOW PC Instruction Fetched Instruction Executed Interrupt Latency PC PC + 1 PC + 1 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (PC) Inst (PC + 1) Inst (PC – 1) Inst (PC) Dummy Cycle Inst (0004h) — Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction. 3: CLKOUT is available only in INTOSC and RC Oscillator modes. 4: For minimum width of INT pulse, refer to AC specifications in Section 15.0 “Electrical Specifications”. 5: INTF is enabled to be set any time during the Q4-Q1 cycles. (1) (2) (3) (4) (5) (1) © 2007 Microchip Technology Inc. DS41211D-page 95 PIC12F683 12.5 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W and STATUS registers). This must be implemented in software. Since the lower 16 bytes of all banks are common in the PIC12F683 (see Figure 2-2), temporary holding registers, W_TEMP and STATUS_TEMP, should be placed in here. These 16 locations do not require banking and therefore, makes it easier to context save and restore. The same code shown in Example 12-1 can be used to: • Store the W register. • Store the STATUS register. • Execute the ISR code. • Restore the Status (and Bank Select Bit register). • Restore the W register. EXAMPLE 12-1: SAVING STATUS AND W REGISTERS IN RAM Note: The PIC12F683 normally does not require saving the PCLATH. However, if computed GOTO’s are used in the ISR and the main code, the PCLATH must be saved and restored in the ISR. MOVWF W_TEMP ;Copy W to TEMP register SWAPF STATUS,W ;Swap status to be saved into W ;Swaps are used because they do not affect the status bits MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register : :(ISR) ;Insert user code here : SWAPF STATUS_TEMP,W ;Swap STATUS_TEMP register into W ;(sets bank to original state) MOVWF STATUS ;Move W into STATUS register SWAPF W_TEMP,F ;Swap W_TEMP SWAPF W_TEMP,W ;Swap W_TEMP into W PIC12F683 DS41211D-page 96 © 2007 Microchip Technology Inc. 12.6 Watchdog Timer (WDT) The WDT has the following features: • Operates from the LFINTOSC (31 kHz) • Contains a 16-bit prescaler • Shares an 8-bit prescaler with Timer0 • Time-out period is from 1 ms to 268 seconds • Configuration bit and software controlled WDT is cleared under certain conditions described in Table 12-7. 12.6.1 WDT OSCILLATOR The WDT derives its time base from the 31 kHz LFINTOSC. The LTS bit of the OSCCON register does not reflect that the LFINTOSC is enabled. The value of WDTCON is ‘---0 1000’ on all Resets. This gives a nominal time base of 17 ms. 12.6.2 WDT CONTROL The WDTE bit is located in the Configuration Word register. When set, the WDT runs continuously. When the WDTE bit in the Configuration Word register is set, the SWDTEN bit of the WDTCON register has no effect. If WDTE is clear, then the SWDTEN bit can be used to enable and disable the WDT. Setting the bit will enable it and clearing the bit will disable it. The PSA and PS<2:0> bits of the OPTION register have the same function as in previous versions of the PIC12F683 Family of microcontrollers. See Section 5.0 “Timer0 Module” for more information. FIGURE 12-9: WATCHDOG TIMER BLOCK DIAGRAM TABLE 12-7: WDT STATUS Note: When the Oscillator Start-up Timer (OST) is invoked, the WDT is held in Reset, because the WDT Ripple Counter is used by the OST to perform the oscillator delay count. When the OST count has expired, the WDT will begin counting (if enabled). Conditions WDT WDTE = 0 Cleared CLRWDT Command Oscillator Fail Detected Exit Sleep + System Clock = T1OSC, EXTRC, INTRC, EXTCLK Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST 31 kHz PSA 16-bit WDT Prescaler From Timer0 Clock Source Prescaler(1) 8 PS<2:0> PSA WDT Time-out WDTPS<3:0> To Timer0 WDTE from Configuration Word register 1 0 1 0 SWDTEN from WDTCON LFINTOSC Clock Note 1: This is the shared Timer0/WDT prescaler. See Section 5.0 “Timer0 Module” for more information. © 2007 Microchip Technology Inc. DS41211D-page 97 PIC12F683 TABLE 12-8: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER REGISTER 12-2: WDTCON: WATCHDOG TIMER CONTROL REGISTER U-0 U-0 U-0 R/W-0 R/W-1 R/W-0 R/W-0 R/W-0 — — — WDTPS3 WDTPS2 WDTPS1 WDTPS0 SWDTEN bit 7 bit 0 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown bit 7-5 Unimplemented: Read as ‘0’ bit 4-1 WDTPS<3:0>: Watchdog Timer Period Select bits Bit Value = Prescale Rate 0000 = 1:32 0001 = 1:64 0010 = 1:128 0011 = 1:256 0100 = 1:512 (Reset value) 0101 = 1:1024 0110 = 1:2048 0111 = 1:4096 1000 = 1:8192 1001 = 1:16384 1010 = 1:32768 1011 = 1:65536 1100 = Reserved 1101 = Reserved 1110 = Reserved 1111 = Reserved bit 0 SWDTEN: Software Enable or Disable the Watchdog Timer(1) 1 = WDT is turned on 0 = WDT is turned off (Reset value) Note 1: If WDTE Configuration bit = 1, then WDT is always enabled, irrespective of this control bit. If WDTE Configuration bit = 0, then it is possible to turn WDT on/off with this control bit. Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets WDTCON — — — WDTPS3 WDTPS2 WSTPS1 WDTPS0 SWDTEN ---0 1000 ---0 1000 OPTION_REG GPPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 CONFIG CPD CP MCLRE PWRTE WDTE FOSC2 FOSC1 FOSC0 — — Legend: Shaded cells are not used by the Watchdog Timer. Note 1: See Register 12-1 for operation of all Configuration Word register bits. PIC12F683 DS41211D-page 98 © 2007 Microchip Technology Inc. 12.7 Power-Down Mode (Sleep) The Power-down mode is entered by executing a SLEEP instruction. If the Watchdog Timer is enabled: • WDT will be cleared but keeps running. • PD bit in the STATUS register is cleared. • TO bit is set. • Oscillator driver is turned off. • I/O ports maintain the status they had before SLEEP was executed (driving high, low or high-impedance). For lowest current consumption in this mode, all I/O pins should be either at VDD or VSS, with no external circuitry drawing current from the I/O pin and the comparators and CVREF should be disabled. I/O pins that are high-impedance inputs should be pulled high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on GPIO should be considered. The MCLR pin must be at a logic high level. 12.7.1 WAKE-UP FROM SLEEP The device can wake-up from Sleep through one of the following events: 1. External Reset input on MCLR pin. 2. Watchdog Timer wake-up (if WDT was enabled). 3. Interrupt from GP2/INT pin, GPIO change or a peripheral interrupt. The first event will cause a device Reset. The two latter events are considered a continuation of program execution. The TO and PD bits in the STATUS register can be used to determine the cause of a device Reset. The PD bit, which is set on power-up, is cleared when Sleep is invoked. TO bit is cleared if WDT wake-up occurred. The following peripheral interrupts can wake the device from Sleep: 1. Timer1 interrupt. Timer1 must be operating as an asynchronous counter. 2. ECCP Capture mode interrupt. 3. A/D conversion (when A/D clock source is FRC). 4. EEPROM write operation completion. 5. Comparator output changes state. 6. Interrupt-on-change. 7. External Interrupt from INT pin. Other peripherals cannot generate interrupts since during Sleep, no on-chip clocks are present. When the SLEEP instruction is being executed, the next instruction (PC + 1) is prefetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up occurs regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction, then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. The WDT is cleared when the device wakes up from Sleep, regardless of the source of wake-up. 12.7.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction, the SLEEP instruction will complete as a NOP. Therefore, the WDT and WDT prescaler and postscaler (if enabled) will not be cleared, the TO bit will not be set and the PD bit will not be cleared. • If the interrupt occurs during or after the execution of a SLEEP instruction, the device will Immediately wake-up from Sleep. The SLEEP instruction is executed. Therefore, the WDT and WDT prescaler and postscaler (if enabled) will be cleared, the TO bit will be set and the PD bit will be cleared. Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. To ensure that the WDT is cleared, a CLRWDT instruction should be executed before a SLEEP instruction. See Figure 12-10 for more details. Note: It should be noted that a Reset generated by a WDT time-out does not drive MCLR pin low. Note: If the global interrupts are disabled (GIE is cleared) and any interrupt source has both its interrupt enable bit and the corresponding interrupt flag bits set, the device will immediately wake-up from Sleep. © 2007 Microchip Technology Inc. DS41211D-page 99 PIC12F683 FIGURE 12-10: WAKE-UP FROM SLEEP THROUGH INTERRUPT 12.8 Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out using ICSP™ for verification purposes. 12.9 ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution, but are readable and writable during Program/Verify mode. Only the Least Significant 7 bits of the ID locations are used. Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT(4) INT pin INTF flag (INTCON<1>) GIE bit (INTCON<7>) Instruction Flow PC Instruction Fetched Instruction Executed PC PC + 1 PC + 2 Inst(PC) = Sleep Inst(PC – 1) Inst(PC + 1) Sleep Processor in Sleep Interrupt Latency(3) Inst(PC + 2) Inst(PC + 1) Inst(0004h) Inst(0005h) Dummy Cycle Inst(0004h) PC + 2 0004h 0005h Dummy Cycle TOST(2) PC + 2 Note 1: XT, HS or LP Oscillator mode assumed. 2: TOST = 1024 TOSC (drawing not to scale). This delay does not apply to EC and RCIO Oscillator modes. 3: GIE = 1 assumed. In this case after wake-up, the processor jumps to 0004h. If GIE = 0, execution will continue in-line. 4: CLKOUT is not available in XT, HS, LP or EC Oscillator modes, but shown here for timing reference. Note: The entire data EEPROM and Flash program memory will be erased when the code protection is turned off. See the “PIC12F6XX/16F6XX Memory Programming Specification” (DS41204) for more information. PIC12F683 DS41211D-page 100 © 2007 Microchip Technology Inc. 12.10 In-Circuit Serial Programming™ The PIC12F683 microcontrollers can be serially programmed while in the end application circuit. This is simply done with five connections for: • clock • data • power • ground • programming voltage This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a Program/Verify mode by holding the GP0 and GP1 pins low, while raising the MCLR (VPP) pin from VIL to VIHH. See the “PIC12F6XX/16F6XX Memory Programming Specification” (DS41204) for more information. GP0 becomes the programming data and GP1 becomes the programming clock. Both GP0 and GP1 are Schmitt Trigger inputs in Program/Verify mode. A typical In-Circuit Serial Programming connection is shown in Figure 12-11. FIGURE 12-11: TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION 12.11 In-Circuit Debugger Since in-circuit debugging requires access to three pins, MPLAB® ICD 2 development with a 14-pin device is not practical. A special 14-pin PIC12F683 ICD device is used with MPLAB ICD 2 to provide separate clock, data and MCLR pins and frees all normally available pins to the user. A special debugging adapter allows the ICD device to be used in place of a PIC12F683 device. The debugging adapter is the only source of the ICD device. When the ICD pin on the PIC12F683 ICD device is held low, the In-Circuit Debugger functionality is enabled. This function allows simple debugging functions when used with MPLAB ICD 2. When the microcontroller has this feature enabled, some of the resources are not available for general use. Table 12-9 shows which features are consumed by the background debugger. TABLE 12-9: DEBUGGER RESOURCES For more information, see “MPLAB® ICD 2 In-Circuit Debugger User’s Guide” (DS51331), available on Microchip’s web site (www.microchip.com). FIGURE 12-12: 14-PIN ICD PINOUT External Connector Signals To Normal Connections To Normal Connections PIC12F683 VDD VSS MCLR/VPP/GP3 GP1 GP0 +5V 0V VPP CLK Data I/O * * * * * Isolation devices (as required) Resource Description Stack 1 level Program Memory Address 0h must be NOP 700h-7FFh 14-Pin PDIP PIC12F683-ICD In-Circuit Debug Device NC ICDMCLR VDD GP5 GP4 GP3 ICD ICDCLK ICDDATA GND GP0 GP1 GP2 NC 1 2 3 4 5 6 7 14 13 12 9 11 10 8 © 2007 Microchip Technology Inc. DS41211D-page 101 PIC12F683 13.0 INSTRUCTION SET SUMMARY The PIC12F683 instruction set is highly orthogonal and is comprised of three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations Each PIC16 instruction is a 14-bit word divided into an opcode, which specifies the instruction type and one or more operands, which further specify the operation of the instruction. The formats for each of the categories is presented in Figure 13-1, while the various opcode fields are summarized in Table 13-1. Table 13-2 lists the instructions recognized by the MPASMTM assembler. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, ‘b’ represents a bit field designator, which selects the bit affected by the operation, while ‘f’ represents the address of the file in which the bit is located. For literal and control operations, ‘k’ represents an 8-bit or 11-bit constant, or literal value. One instruction cycle consists of four oscillator periods; for an oscillator frequency of 4 MHz, this gives a nominal instruction execution time of 1 μs. All instructions are executed within a single instruction cycle, unless a conditional test is true, or the program counter is changed as a result of an instruction. When this occurs, the execution takes two instruction cycles, with the second cycle executed as a NOP. All instruction examples use the format ‘0xhh’ to represent a hexadecimal number, where ‘h’ signifies a hexadecimal digit. 13.1 Read-Modify-Write Operations Any instruction that specifies a file register as part of the instruction performs a Read-Modify-Write (R-M-W) operation. The register is read, the data is modified, and the result is stored according to either the instruction, or the destination designator ‘d’. A read operation is performed on a register even if the instruction writes to that register. For example, a CLRF PORTA instruction will read PORTA, clear all the data bits, then write the result back to PORTA. This example would have the unintended consequence of clearing the condition that set the RAIF flag. TABLE 13-1: OPCODE FIELD DESCRIPTIONS FIGURE 13-1: GENERAL FORMAT FOR INSTRUCTIONS Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1). The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1. PC Program Counter TO Time-out bit C Carry bit DC Digit carry bit Z Zero bit PD Power-down bit Byte-oriented file register operations 13 8 7 6 0 d = 0 for destination W OPCODE d f (FILE #) d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 0 OPCODE b (BIT #) f (FILE #) b = 3-bit bit address f = 7-bit file register address Literal and control operations 13 8 7 0 OPCODE k (literal) k = 8-bit immediate value 13 11 10 0 OPCODE k (literal) k = 11-bit immediate value General CALL and GOTO instructions only PIC12F683 DS41211D-page 102 © 2007 Microchip Technology Inc. TABLE 13-2: PIC12F683 INSTRUCTION SET Mnemonic, Operands Description Cycles 14-Bit Opcode Status Affected Notes MSb LSb BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f – f, d f, d f, d f, d f, d f, d f, d f – f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0xxx dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff xxxx ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff C, DC, Z Z Z Z Z Z Z Z Z C C C, DC, Z Z 1, 2 1, 2 2 1, 2 1, 2 1, 2, 3 1, 2 1, 2, 3 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 1, 2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 1, 2 1, 2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k – k k k – k – – k k Add literal and W AND literal with W Call Subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk C, DC, Z Z TO, PD Z TO, PD C, DC, Z Z Note 1: When an I/O register is modified as a function of itself (e.g., MOVF GPIO, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 module. 3: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. © 2007 Microchip Technology Inc. DS41211D-page 103 PIC12F683 13.2 Instruction Descriptions ADDLW Add literal and W Syntax: [ label ] ADDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) + k → (W) Status Affected: C, DC, Z Description: The contents of the W register are added to the eight-bit literal ‘k’ and the result is placed in the W register. ADDWF Add W and f Syntax: [ label ] ADDWF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (W) + (f) → (destination) Status Affected: C, DC, Z Description: Add the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. ANDLW AND literal with W Syntax: [ label ] ANDLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .AND. (k) → (W) Status Affected: Z Description: The contents of W register are AND’ed with the eight-bit literal ‘k’. The result is placed in the W register. ANDWF AND W with f Syntax: [ label ] ANDWF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (W) .AND. (f) → (destination) Status Affected: Z Description: AND the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. BCF Bit Clear f Syntax: [ label ] BCF f,b Operands: 0 ≤ f ≤ 127 0 ≤ b ≤ 7 Operation: 0 → (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is cleared. BSF Bit Set f Syntax: [ label ] BSF f,b Operands: 0 ≤ f ≤ 127 0 ≤ b ≤ 7 Operation: 1 → (f) Status Affected: None Description: Bit ‘b’ in register ‘f’ is set. BTFSC Bit Test f, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0 ≤ f ≤ 127 0 ≤ b ≤ 7 Operation: skip if (f) = 0 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘1’, the next instruction is executed. If bit ‘b’, in register ‘f’, is ‘0’, the next instruction is discarded, and a NOP is executed instead, making this a 2-cycle instruction. PIC12F683 DS41211D-page 104 © 2007 Microchip Technology Inc. BTFSS Bit Test f, Skip if Set Syntax: [ label ] BTFSS f,b Operands: 0 ≤ f ≤ 127 0 ≤ b < 7 Operation: skip if (f) = 1 Status Affected: None Description: If bit ‘b’ in register ‘f’ is ‘0’, the next instruction is executed. If bit ‘b’ is ‘1’, then the next instruction is discarded and a NOP is executed instead, making this a 2-cycle instruction. CALL Call Subroutine Syntax: [ label ] CALL k Operands: 0 ≤ k ≤ 2047 Operation: (PC)+ 1→ TOS, k → PC<10:0>, (PCLATH<4:3>) → PC<12:11> Status Affected: None Description: Call Subroutine. First, return address (PC + 1) is pushed onto the stack. The eleven-bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. CLRF Clear f Syntax: [ label ] CLRF f Operands: 0 ≤ f ≤ 127 Operation: 00h → (f) 1 → Z Status Affected: Z Description: The contents of register ‘f’ are cleared and the Z bit is set. CLRW Clear W Syntax: [ label ] CLRW Operands: None Operation: 00h → (W) 1 → Z Status Affected: Z Description: W register is cleared. Zero bit (Z) is set. CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h → WDT 0 → WDT prescaler, 1 → TO 1 → PD Status Affected: TO, PD Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. Status bits TO and PD are set. COMF Complement f Syntax: [ label ] COMF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) → (destination) Status Affected: Z Description: The contents of register ‘f’ are complemented. If ‘d’ is ‘0’, the result is stored in W. If ‘d’ is ‘1’, the result is stored back in register ‘f’. DECF Decrement f Syntax: [ label ] DECF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) - 1 → (destination) Status Affected: Z Description: Decrement register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. © 2007 Microchip Technology Inc. DS41211D-page 105 PIC12F683 DECFSZ Decrement f, Skip if 0 Syntax: [ label ] DECFSZ f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) - 1 → (destination); skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are decremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, then a NOP is executed instead, making it a 2-cycle instruction. GOTO Unconditional Branch Syntax: [ label ] GOTO k Operands: 0 ≤ k ≤ 2047 Operation: k → PC<10:0> PCLATH<4:3> → PC<12:11> Status Affected: None Description: GOTO is an unconditional branch. The eleven-bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a two-cycle instruction. INCF Increment f Syntax: [ label ] INCF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) + 1 → (destination) Status Affected: Z Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. INCFSZ Increment f, Skip if 0 Syntax: [ label ] INCFSZ f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) + 1 → (destination), skip if result = 0 Status Affected: None Description: The contents of register ‘f’ are incremented. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. If the result is ‘1’, the next instruction is executed. If the result is ‘0’, a NOP is executed instead, making it a 2-cycle instruction. IORLW Inclusive OR literal with W Syntax: [ label ] IORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .OR. k → (W) Status Affected: Z Description: The contents of the W register are OR’ed with the eight-bit literal ‘k’. The result is placed in the W register. IORWF Inclusive OR W with f Syntax: [ label ] IORWF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (W) .OR. (f) → (destination) Status Affected: Z Description: Inclusive OR the W register with register ‘f’. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. PIC12F683 DS41211D-page 106 © 2007 Microchip Technology Inc. MOVF Move f Syntax: [ label ] MOVF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) → (dest) Status Affected: Z Description: The contents of register f is moved to a destination dependent upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: 1 Cycles: 1 Example: MOVF FSR, 0 After Instruction W = value in FSR register Z = 1 MOVLW Move literal to W Syntax: [ label ] MOVLW k Operands: 0 ≤ k ≤ 255 Operation: k → (W) Status Affected: None Description: The eight-bit literal ‘k’ is loaded into W register. The “don’t cares” will assemble as ‘0’s. Words: 1 Cycles: 1 Example: MOVLW 0x5A After Instruction W = 0x5A MOVWF Move W to f Syntax: [ label ] MOVWF f Operands: 0 ≤ f ≤ 127 Operation: (W) → (f) Status Affected: None Description: Move data from W register to register ‘f’. Words: 1 Cycles: 1 Example: MOVW F OPTION Before Instruction OPTION = 0xFF W = 0x4F After Instruction OPTION = 0x4F W = 0x4F NOP No Operation Syntax: [ label ] NOP Operands: None Operation: No operation Status Affected: None Description: No operation. Words: 1 Cycles: 1 Example: NOP © 2007 Microchip Technology Inc. DS41211D-page 107 PIC12F683 RETFIE Return from Interrupt Syntax: [ label ] RETFIE Operands: None Operation: TOS → PC, 1 → GIE Status Affected: None Description: Return from Interrupt. Stack is POPed and Top-of-Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: RETFIE After Interrupt PC = TOS GIE = 1 RETLW Return with literal in W Syntax: [ label ] RETLW k Operands: 0 ≤ k ≤ 255 Operation: k → (W); TOS → PC Status Affected: None Description: The W register is loaded with the eight bit literal ‘k’. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Example: TABLE CALL TABLE;W contains table ;offset value • ;W now has table value • • ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; • • • RETLW kn ; End of table Before Instruction W = 0x07 After Instruction W = value of k8 RETURN Return from Subroutine Syntax: [ label ] RETURN Operands: None Operation: TOS → PC Status Affected: None Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. PIC12F683 DS41211D-page 108 © 2007 Microchip Technology Inc. RLF Rotate Left f through Carry Syntax: [ label ] RLF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the left through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. Words: 1 Cycles: 1 Example: RLF REG1,0 Before Instruction REG1 = 1110 0110 C = 0 After Instruction REG1 = 1110 0110 W = 1100 1100 C = 1 RRF Rotate Right f through Carry Syntax: [ label ] RRF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: See description below Status Affected: C Description: The contents of register ‘f’ are rotated one bit to the right through the Carry flag. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed back in register ‘f’. C Register f C Register f SLEEP Enter Sleep mode Syntax: [ label ] SLEEP Operands: None Operation: 00h → WDT, 0 → WDT prescaler, 1 → TO, 0 → PD Status Affected: TO, PD Description: The power-down Status bit, PD is cleared. Time-out Status bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into Sleep mode with the oscillator stopped. SUBLW Subtract W from literal Syntax: [ label ] SUBLW k Operands: 0 ≤ k ≤ 255 Operation: k - (W) → (W) Status Affected: C, DC, Z Description: The W register is subtracted (2’s complement method) from the eight-bit literal ‘k’. The result is placed in the W register. C = 0 W > k C = 1 W ≤ k DC = 0 W<3:0> > k<3:0> DC = 1 W<3:0> ≤ k<3:0> © 2007 Microchip Technology Inc. DS41211D-page 109 PIC12F683 SUBWF Subtract W from f Syntax: [ label ] SUBWF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f) - (W) → (destination) Status Affected: C, DC, Z Description: Subtract (2’s complement method) W register from register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f. SWAPF Swap Nibbles in f Syntax: [ label ] SWAPF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (f<3:0>) → (destination<7:4>), (f<7:4>) → (destination<3:0>) Status Affected: None Description: The upper and lower nibbles of register ‘f’ are exchanged. If ‘d’ is ‘0’, the result is placed in the W register. If ‘d’ is ‘1’, the result is placed in register ‘f’. C = 0 W > f C = 1 W ≤ f DC = 0 W<3:0> > f<3:0> DC = 1 W<3:0> ≤ f<3:0> XORLW Exclusive OR literal with W Syntax: [ label ] XORLW k Operands: 0 ≤ k ≤ 255 Operation: (W) .XOR. k → (W) Status Affected: Z Description: The contents of the W register are XOR’ed with the eight-bit literal ‘k’. The result is placed in the W register. XORWF Exclusive OR W with f Syntax: [ label ] XORWF f,d Operands: 0 ≤ f ≤ 127 d ∈ [0,1] Operation: (W) .XOR. (f) → (destination) Status Affected: Z Description: Exclusive OR the contents of the W register with register ‘f’. If ‘d’ is ‘0’, the result is stored in the W register. If ‘d’ is ‘1’, the result is stored back in register ‘f’. PIC12F683 DS41211D-page 110 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 111 PIC12F683 14.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB REAL ICE™ In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 14.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. PIC12F683 DS41211D-page 112 © 2007 Microchip Technology Inc. 14.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 14.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 and PIC24 families of microcontrollers and the dsPIC30 and dsPIC33 family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 14.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction 14.5 MPLAB ASM30 Assembler, Linker and Librarian MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • Support for the entire dsPIC30F instruction set • Support for fixed-point and floating-point data • Command line interface • Rich directive set • Flexible macro language • MPLAB IDE compatibility 14.6 MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, most peripherals and internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the hardware laboratory environment, making it an excellent, economical software development tool. © 2007 Microchip Technology Inc. DS41211D-page 113 PIC12F683 14.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 14.8 MPLAB REAL ICE In-Circuit Emulator System MPLAB REAL ICE In-Circuit Emulator System is Microchip’s next generation high-speed emulator for Microchip Flash DSC® and MCU devices. It debugs and programs PIC® and dsPIC® Flash microcontrollers with the easy-to-use, powerful graphical user interface of the MPLAB Integrated Development Environment (IDE), included with each kit. The MPLAB REAL ICE probe is connected to the design engineer’s PC using a high-speed USB 2.0 interface and is connected to the target with either a connector compatible with the popular MPLAB ICD 2 system (RJ11) or with the new high speed, noise tolerant, lowvoltage differential signal (LVDS) interconnection (CAT5). MPLAB REAL ICE is field upgradeable through future firmware downloads in MPLAB IDE. In upcoming releases of MPLAB IDE, new devices will be supported, and new features will be added, such as software breakpoints and assembly code trace. MPLAB REAL ICE offers significant advantages over competitive emulators including low-cost, full-speed emulation, real-time variable watches, trace analysis, complex breakpoints, a ruggedized probe interface and long (up to three meters) interconnection cables. 14.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 14.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. PIC12F683 DS41211D-page 114 © 2007 Microchip Technology Inc. 14.11 PICSTART Plus Development Programmer The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. 14.12 PICkit 2 Development Programmer The PICkit™ 2 Development Programmer is a low-cost programmer and selected Flash device debugger with an easy-to-use interface for programming many of Microchip’s baseline, mid-range and PIC18F families of Flash memory microcontrollers. The PICkit 2 Starter Kit includes a prototyping development board, twelve sequential lessons, software and HI-TECH’s PICC™ Lite C compiler, and is designed to help get up to speed quickly using PIC® microcontrollers. The kit provides everything needed to program, evaluate and develop applications using Microchip’s powerful, mid-range Flash memory family of microcontrollers. 14.13 Demonstration, Development and Evaluation Boards A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/ development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart® battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) and the latest “Product Selector Guide” (DS00148) for the complete list of demonstration, development and evaluation kits. © 2007 Microchip Technology Inc. DS41211D-page 115 PIC12F683 15.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings(†) Ambient temperature under bias..........................................................................................................-40° to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +6.5V Voltage on MCLR with respect to Vss ............................................................................................... -0.3V to +13.5V Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V) Total power dissipation(1) ............................................................................................................................... 800 mW Maximum current out of VSS pin ...................................................................................................................... 95 mA Maximum current into VDD pin ......................................................................................................................... 95 mA Input clamp current, IIK (VI < 0 or VI > VDD)...............................................................................................................± 20 mA Output clamp current, IOK (Vo < 0 or Vo >VDD).........................................................................................................± 20 mA Maximum output current sunk by any I/O pin.................................................................................................... 25 mA Maximum output current sourced by any I/O pin .............................................................................................. 25 mA Maximum current sunk by GPIO...................................................................................................................... 90 mA Maximum current sourced GPIO...................................................................................................................... 90 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – Σ IOH} + Σ {(VDD – VOH) x IOH} + Σ(VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability. PIC12F683 DS41211D-page 116 © 2007 Microchip Technology Inc. FIGURE 15-1: PIC12F683 VOLTAGE-FREQUENCY GRAPH, -40°C ≤ TA ≤ +125°C FIGURE 15-2: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE 5.5 2.0 3.5 2.5 0 3.0 4.0 4.5 5.0 Frequency (MHz) VDD (V) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 8 10 20 125 25 2.0 0 60 85 VDD (V) 4.0 4.5 5.0 Temperature (°C) 2.5 3.0 3.5 5.5 ± 1% ± 2% ± 5% © 2007 Microchip Technology Inc. DS41211D-page 117 PIC12F683 15.1 DC Characteristics: PIC12F683-I (Industrial) PIC12F683-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions D001 D001C D001D VDD Supply Voltage 2.0 2.0 3.0 4.5 — — — — 5.5 5.5 5.5 5.5 V V V V FOSC < = 8 MHz: HFINTOSC, EC FOSC < = 4 MHz FOSC < = 10 MHz FOSC < = 20 MHz D002* VDR RAM Data Retention Voltage(1) 1.5 — — V Device in Sleep mode D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V See Section 12.3.1 “Power-on Reset” for details. D004* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms See Section 12.3.1 “Power-on Reset” for details. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. PIC12F683 DS41211D-page 118 © 2007 Microchip Technology Inc. 15.2 DC Characteristics: PIC12F683-I (Industrial) PIC12F683-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D010 Supply Current (IDD)(1, 2) — 11 16 μA 2.0 FOSC = 32 kHz — 18 28 μA 3.0 LP Oscillator mode — 35 54 μA 5.0 D011* — 140 240 μA 2.0 FOSC = 1 MHz — 220 380 μA 3.0 XT Oscillator mode — 380 550 μA 5.0 D012 — 260 360 μA 2.0 FOSC = 4 MHz — 420 650 μA 3.0 XT Oscillator mode — 0.8 1.1 mA 5.0 D013* — 130 220 μA 2.0 FOSC = 1 MHz — 215 360 μA 3.0 EC Oscillator mode — 360 520 μA 5.0 D014 — 220 340 μA 2.0 FOSC = 4 MHz — 375 550 μA 3.0 EC Oscillator mode — 0.65 1.0 mA 5.0 D015 — 8 20 μA 2.0 FOSC = 31 kHz — 16 40 μA 3.0 LFINTOSC mode — 31 65 μA 5.0 D016* — 340 450 μA 2.0 FOSC = 4 MHz — 500 700 μA 3.0 HFINTOSC mode — 0.8 1.2 mA 5.0 D017 — 410 650 μA 2.0 FOSC = 8 MHz — 700 950 μA 3.0 HFINTOSC mode — 1.30 1.65 mA 5.0 D018 — 230 400 μA 2.0 FOSC = 4 MHz EXTRC mode(3) — 400 680 μA 3.0 — 0.63 1.1 mA 5.0 D019 — 2.6 3.25 mA 4.5 FOSC = 20 MHz — 2.8 3.35 mA 5.0 HS Oscillator mode * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current consumption. 3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended by the formula IR = VDD/2REXT (mA) with REXT in kΩ. © 2007 Microchip Technology Inc. DS41211D-page 119 PIC12F683 15.3 DC Characteristics: PIC12F683-I (Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D020 Power-down Base Current(IPD)(2) — 0.05 1.2 μA 2.0 WDT, BOR, Comparators, VREF and — 0.15 1.5 μA 3.0 T1OSC disabled — 0.35 1.8 μA 5.0 — 150 500 nA 3.0 -40°C ≤ TA ≤ +25°C D021 — 1.0 2.2 μA 2.0 WDT Current(1) — 2.0 4.0 μA 3.0 — 3.0 7.0 μA 5.0 D022 — 42 60 μA 3.0 BOR Current(1) — 85 122 μA 5.0 D023 — 32 45 μA 2.0 Comparator Current(1), both — 60 78 μA 3.0 comparators enabled — 120 160 μA 5.0 D024 — 30 36 μA 2.0 CVREF Current(1) (high range) — 45 55 μA 3.0 — 75 95 μA 5.0 D025* — 39 47 μA 2.0 CVREF Current(1) (low range) — 59 72 μA 3.0 — 98 124 μA 5.0 D026 — 4.5 7.0 μA 2.0 T1OSC Current(1), 32.768 kHz — 5.0 8.0 μA 3.0 — 6.0 12 μA 5.0 D027 — 0.30 1.6 μA 3.0 A/D Current(1), no conversion in — 0.36 1.9 μA 5.0 progress * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral Δ current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. PIC12F683 DS41211D-page 120 © 2007 Microchip Technology Inc. 15.4 DC Characteristics: PIC12F683-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C for extended Param No. Device Characteristics Min Typ† Max Units Conditions VDD Note D020E Power-down Base Current (IPD)(2) — 0.05 9 μA 2.0 WDT, BOR, Comparators, VREF and — 0.15 11 μA 3.0 T1OSC disabled — 0.35 15 μA 5.0 D021E — 1 17.5 μA 2.0 WDT Current(1) — 2 19 μA 3.0 — 3 22 μA 5.0 D022E — 42 65 μA 3.0 BOR Current(1) — 85 127 μA 5.0 D023E — 32 45 μA 2.0 Comparator Current(1), both — 60 78 μA 3.0 comparators enabled — 120 160 μA 5.0 D024E — 30 70 μA 2.0 CVREF Current(1) (high range) — 45 90 μA 3.0 — 75 120 μA 5.0 D025E* — 39 91 μA 2.0 CVREF Current(1) (low range) — 59 117 μA 3.0 — 98 156 μA 5.0 D026E — 4.5 25 μA 2.0 T1OSC Current(1), 32.768 kHz — 5 30 μA 3.0 — 6 40 μA 5.0 D027E — 0.30 12 μA 3.0 A/D Current(1), no conversion in — 0.36 16 μA 5.0 progress * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is enabled. The peripheral Δ current can be determined by subtracting the base IDD or IPD current from this limit. Max values should be used when calculating total current consumption. 2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD. © 2007 Microchip Technology Inc. DS41211D-page 121 PIC12F683 15.5 DC Characteristics: PIC12F683-I (Industrial) PIC12F683-E (Extended) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions VIL Input Low Voltage I/O Port: D030 with TTL buffer Vss — 0.8 V 4.5V ≤ VDD ≤ 5.5V D030A Vss — 0.15 VDD V 2.0V ≤ VDD ≤ 4.5V D031 with Schmitt Trigger buffer Vss — 0.2 VDD V 2.0V ≤ VDD ≤ 5.5V D032 MCLR, OSC1 (RC mode)(1) VSS — 0.2 VDD V D033 OSC1 (XT and LP modes) VSS — 0.3 V D033A OSC1 (HS mode) VSS — 0.3 VDD V VIH Input High Voltage I/O ports: — D040 with TTL buffer 2.0 — VDD V 4.5V ≤ VDD ≤ 5.5V D040A 0.25 VDD + 0.8 — VDD V 2.0V ≤ VDD ≤ 4.5V D041 with Schmitt Trigger buffer 0.8 VDD — VDD V 2.0V ≤ VDD ≤ 5.5V D042 MCLR 0.8 VDD — VDD V D043 OSC1 (XT and LP modes) 1.6 — VDD V D043A OSC1 (HS mode) 0.7 VDD — VDD V D043B OSC1 (RC mode) 0.9 VDD — VDD V (Note 1) IIL Input Leakage Current(2) D060 I/O ports — ± 0.1 ± 1 μA VSS ≤ VPIN ≤ VDD, Pin at high-impedance D061 MCLR(3) — ± 0.1 ± 5 μA VSS ≤ VPIN ≤ VDD D063 OSC1 — ± 0.1 ± 5 μA VSS ≤ VPIN ≤ VDD, XT, HS and LP oscillator configuration D070* IPUR GPIO Weak Pull-up Current 50 250 400 μA VDD = 5.0V, VPIN = VSS VOL Output Low Voltage(5) D080 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V (Ind.) VOH Output High Voltage(5) D090 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V (Ind.) * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: See Section 10.4.1 “Using the Data EEPROM” for additional information. 5: Including OSC2 in CLKOUT mode. PIC12F683 DS41211D-page 122 © 2007 Microchip Technology Inc. D100 IULP Ultra Low-Power Wake-Up Current — 200 — nA See Application Note AN879, “Using the Microchip Ultra Low-Power Wake-up Module” (DS00879) Capacitive Loading Specs on Output Pins D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when external clock is used to drive OSC1 D101A* CIO All I/O pins — — 50 pF Data EEPROM Memory D120 ED Byte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C D120A ED Byte Endurance 10K 100K — E/W +85°C ≤ TA ≤ +125°C D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON1 to read/write VMIN = Minimum operating voltage D122 TDEW Erase/Write Cycle Time — 5 6 ms D123 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated D124 TREF Number of Total Erase/Write Cycles before Refresh(4) 1M 10M — E/W -40°C ≤ TA ≤ +85°C Program Flash Memory D130 EP Cell Endurance 10K 100K — E/W -40°C ≤ TA ≤ +85°C D130A ED Cell Endurance 1K 10K — E/W +85°C ≤ TA ≤ +125°C D131 VPR VDD for Read VMIN — 5.5 V VMIN = Minimum operating voltage D132 VPEW VDD for Erase/Write 4.5 — 5.5 V D133 TPEW Erase/Write cycle time — 2 2.5 ms D134 TRETD Characteristic Retention 40 — — Year Provided no other specifications are violated 15.5 DC Characteristics: PIC12F683-I (Industrial) PIC12F683-E (Extended) (Continued) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Sym Characteristic Min Typ† Max Units Conditions * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external clock in RC mode. 2: Negative current is defined as current sourced by the pin. 3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 4: See Section 10.4.1 “Using the Data EEPROM” for additional information. 5: Including OSC2 in CLKOUT mode. © 2007 Microchip Technology Inc. DS41211D-page 123 PIC12F683 15.6 Thermal Considerations Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Typ Units Conditions TH01 θJA Thermal Resistance Junction to Ambient 84.6 °C/W 8-pin PDIP package 163.0 °C/W 8-pin SOIC package 52.4 °C/W 8-pin DFN-S 4x4x0.9 mm package 46.3 °C/W 8-pin DFN-S 6x5 mm package TH02 θJC Thermal Resistance Junction to Case 41.2 °C/W 8-pin PDIP package 38.8 °C/W 8-pin SOIC package 3.0 °C/W 8-pin DFN-S 4x4x0.9 mm package 2.6 °C/W 8-pin DFN-S 6x5 mm package TH03 TJ Junction Temperature 150 °C For derated power calculations TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD (NOTE 1) TH06 PI/O I/O Power Dissipation — W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH)) TH07 PDER Derated Power — W PDER = (TJ - TA)/θJA (NOTE 2, 3) Note 1: IDD is current to run the chip alone without driving any load on the output pins. 2: TA = Ambient Temperature. 3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power dissipation or derated power (PDER). PIC12F683 DS41211D-page 124 © 2007 Microchip Technology Inc. 15.7 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: FIGURE 15-3: LOAD CONDITIONS 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase letters (pp) and their meanings: pp cc CCP1 osc OSC1 ck CLKOUT rd RD cs CS rw RD or WR di SDI sc SCK do SDO ss SS dt Data in t0 T0CKI io I/O PORT t1 T1CKI mc MCLR wr WR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (High-impedance) V Valid L Low Z High-impedance VSS CL Legend: CL = 50 pF for all pins 15 pF for OSC2 output Load Condition Pin © 2007 Microchip Technology Inc. DS41211D-page 125 PIC12F683 15.8 AC Characteristics: PIC12F683 (Industrial, Extended) FIGURE 15-4: CLOCK TIMING TABLE 15-1: CLOCK OSCILLATOR TIMING REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions OS01 FOSC External CLKIN Frequency(1) DC — 37 kHz LP Oscillator mode DC — 4 MHz XT Oscillator mode DC — 20 MHz HS Oscillator mode DC — 20 MHz EC Oscillator mode Oscillator Frequency(1) — 32.768 — kHz LP Oscillator mode 0.1 — 4 MHz XT Oscillator mode 1 — 20 MHz HS Oscillator mode DC — 4 MHz RC Oscillator mode OS02 TOSC External CLKIN Period(1) 27 — • μs LP Oscillator mode 250 — • ns XT Oscillator mode 50 — • ns HS Oscillator mode 50 — • ns EC Oscillator mode Oscillator Period(1) — 30.5 — μs LP Oscillator mode 250 — 10,000 ns XT Oscillator mode 50 — 1,000 ns HS Oscillator mode 250 — — ns RC Oscillator mode OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC OS04* TosH, TosL External CLKIN High, External CLKIN Low 2 — — μs LP oscillator 100 — — ns XT oscillator 20 — — ns HS oscillator OS05* TosR, TosF External CLKIN Rise, External CLKIN Fall 0 — • ns LP oscillator 0 — • ns XT oscillator 0 — • ns HS oscillator * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. OSC1/CLKIN OSC2/CLKOUT Q4 Q1 Q2 Q3 Q4 Q1 OS02 OS03 OS04 OS04 OSC2/CLKOUT (LP,XT,HS Modes) (CLKOUT Mode) PIC12F683 DS41211D-page 126 © 2007 Microchip Technology Inc. TABLE 15-2: OSCILLATOR PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Freq. Tolerance Min Typ† Max Units Conditions OS06 TWARM Internal Oscillator Switch when running(3) — — — 2 TOSC Slowest clock OS07 TSC Fail-Safe Sample Clock Period(1) — — 21 — ms LFINTOSC/64 OS08 HFOSC Internal Calibrated HFINTOSC Frequency(2) ±1% 7.92 8.0 8.08 MHz VDD = 3.5V, 25°C ±2% 7.84 8.0 8.16 MHz 2.5V ≤ VDD ≤ 5.5V, 0°C ≤ TA ≤ +85°C ±5% 7.60 8.0 8.40 MHz 2.0V ≤ VDD ≤ 5.5V, -40°C ≤ TA ≤ +85°C (Ind.), -40°C ≤ TA ≤ +125°C (Ext.) OS09* LFOSC Internal Uncalibrated LFINTOSC Frequency — 15 31 45 kHz OS10* TIOSC ST HFINTOSC Oscillator Wake-up from Sleep Start-up Time — 5.5 12 24 μs VDD = 2.0V, -40°C to +85°C — 3.5 7 14 μs VDD = 3.0V, -40°C to +85°C — 3 6 11 μs VDD = 5.0V, -40°C to +85°C * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended. 3: By design. © 2007 Microchip Technology Inc. DS41211D-page 127 PIC12F683 FIGURE 15-5: CLKOUT AND I/O TIMING Fosc CLKOUT I/O pin (Input) I/O pin (Output) Q4 Q1 Q2 Q3 OS11 OS19 OS13 OS15 OS18, OS19 OS20 OS21 OS17 OS16 OS14 OS12 OS18 Old Value New Value Cycle Write Fetch Read Execute TABLE 15-3: CLKOUT AND I/O TIMING PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions OS11 TOSH2CKL FOSC↑ to CLKOUT↓ (1) — — 70 ns VDD = 5.0V OS12 TOSH2CKH FOSC↑ to CLKOUT↑ (1) — — 72 ns VDD = 5.0V OS13 TCKL2IOV CLKOUT↓ to Port out valid(1) — — 20 ns OS14 TIOV2CKH Port input valid before CLKOUT↑(1) TOSC + 200 ns — — ns OS15* TOSH2IOV FOSC↑ (Q1 cycle) to Port out valid — 50 70 ns VDD = 5.0V OS16 TOSH2IOI FOSC↑ (Q2 cycle) to Port input invalid (I/O in hold time) 50 — — ns VDD = 5.0V OS17 TIOV2OSH Port input valid to FOSC↑ (Q2 cycle) (I/O in setup time) 20 — — ns OS18 TIOR Port output rise time(2) — — 15 40 72 32 ns VDD = 2.0V VDD = 5.0V OS19 TIOF Port output fall time(2) — — 28 15 55 30 ns VDD = 2.0V VDD = 5.0V OS20* TINP INT pin input high or low time 25 — — ns OS21* TGPP GPIO interrupt-on-change new input level time TCY — — ns * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. 2: Includes OSC2 in CLKOUT mode. PIC12F683 DS41211D-page 128 © 2007 Microchip Technology Inc. FIGURE 15-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING FIGURE 15-7: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD MCLR Internal POR PWRT Time-out OSC Start-Up Time Internal Reset(1) Watchdog Timer 33 32 30 31 34 I/O pins 34 Note 1: Asserted low. Reset(1) VBOR VDD (Device in Brown-out Reset) (Device not in Brown-out Reset) 33* 37 * 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’. Reset (due to BOR) VBOR + VHYST © 2007 Microchip Technology Inc. DS41211D-page 129 PIC12F683 TABLE 15-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions 30 TMCL MCLR Pulse Width (low) 2 5 — — — — μs μs VDD = 5V, -40°C to +85°C VDD = 5V 31 TWDT Watchdog Timer Time-out Period (No Prescaler) 10 10 16 16 29 31 ms ms VDD = 5V, -40°C to +85°C VDD = 5V 32 TOST Oscillation Start-up Timer Period(1, 2) — 1024 — TOSC (NOTE 3) 33* TPWRT Power-up Timer Period 40 65 140 ms 34* TIOZ I/O High-impedance from MCLR Low or Watchdog Timer Reset — — 2.0 μs 35 VBOR Brown-out Reset Voltage 2.0 — 2.2 V (NOTE 4) 36* VHYST Brown-out Reset Hysteresis — 50 — mV 37* TBOR Brown-out Reset Minimum Detection Period 100 — — μs VDD ≤ VBOR * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices. 2: By design. 3: Period of the slower clock. 4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as possible. 0.1 μF and 0.01 μF values in parallel are recommended. PIC12F683 DS41211D-page 130 © 2007 Microchip Technology Inc. FIGURE 15-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS TABLE 15-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions 40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns With Prescaler 10 — — ns 42* TT0P T0CKI Period Greater of: 20 or TCY + 40 N — — ns N = prescale value (2, 4, ..., 256) 45* TT1H T1CKI High Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 46* TT1L T1CKI Low Time Synchronous, No Prescaler 0.5 TCY + 20 — — ns Synchronous, with Prescaler 15 — — ns Asynchronous 30 — — ns 47* TT1P T1CKI Input Period Synchronous Greater of: 30 or TCY + 40 N — — ns N = prescale value (1, 2, 4, 8) Asynchronous 60 — — ns 48 FT1 Timer1 Oscillator Input Frequency Range (oscillator enabled by setting bit T1OSCEN) — 32.768 — kHz 49* TCKEZTMR1 Delay from External Clock Edge to Timer Increment 2 TOSC — 7 TOSC — Timers in Sync mode * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. T0CKI T1CKI 40 41 42 45 46 47 49 TMR0 or TMR1 © 2007 Microchip Technology Inc. DS41211D-page 131 PIC12F683 FIGURE 15-9: CAPTURE/COMPARE/PWM TIMINGS (ECCP) TABLE 15-6: CAPTURE/COMPARE/PWM REQUIREMENTS (ECCP) Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions CC01* TccL CCP1 Input Low Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC02* TccH CCP1 Input High Time No Prescaler 0.5TCY + 20 — — ns With Prescaler 20 — — ns CC03* TccP CCP1 Input Period 3TCY + 40 N — — ns N = prescale value (1, 4 or 16) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note: Refer to Figure 15-3 for load conditions. (Capture mode) CC01 CC02 CC03 CCP1 PIC12F683 DS41211D-page 132 © 2007 Microchip Technology Inc. TABLE 15-7: COMPARATOR SPECIFICATIONS TABLE 15-8: COMPARATOR VOLTAGE REFERENCE (CVREF) SPECIFICATIONS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristics Min Typ† Max Units Comments CM01 VOS Input Offset Voltage — ± 5.0 ± 10 mV (VDD - 1.5)/2 CM02 VCM Input Common Mode Voltage 0 — VDD – 1.5 V CM03* CMRR Common Mode Rejection Ratio +55 — — dB CM04* TRT Response Time Falling — 150 600 ns (NOTE 1) Rising — 200 1000 ns CM05* TMC2COV Comparator Mode Change to Output Valid — — 10 μs * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Response time is measured with one comparator input at (VDD - 1.5)/2 - 100 mV to (VDD - 1.5)/2 + 20 mV. Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristics Min Typ† Max Units Comments CV01* CLSB Step Size(2) — — VDD/24 VDD/32 — — V V Low Range (VRR = 1) High Range (VRR = 0) CV02* CACC Absolute Accuracy — — — — ± 1/2 ± 1/2 LSb LSb Low Range (VRR = 1) High Range (VRR = 0) CV03* CR Unit Resistor Value (R) — 2k — Ω CV04* CST Settling Time(1) — — 10 μs * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from ‘0000’ to ‘1111’. 2: See Section 8.11 “Comparator Voltage Reference” for more information. © 2007 Microchip Technology Inc. DS41211D-page 133 PIC12F683 TABLE 15-9: PIC12F683 A/D CONVERTER (ADC) CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions AD01 NR Resolution — — 10 bits bit AD02 EIL Integral Error — — ±1 LSb VREF = 5.12V AD03 EDL Differential Error — — ±1 LSb No missing codes to 10 bits VREF = 5.12V AD04 EOFF Offset Error — — ±1 LSb VREF = 5.12V AD07 EGN Gain Error — — ±1 LSb VREF = 5.12V AD06 AD06A VREF Reference Voltage(3) 2.2 2.7 — — VDD V Absolute minimum to ensure 1 LSb accuracy AD07 VAIN Full-Scale Range VSS — VREF V AD08 ZAIN Recommended Impedance of Analog Voltage Source — — 10 kΩ AD09* IREF VREF Input Current(3) 10 — 1000 μA During VAIN acquisition. Based on differential of VHOLD to VAIN. — — 50 μA During A/D conversion cycle. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Total Absolute Error includes integral, differential, offset and gain errors. 2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes. 3: ADC VREF is from external VREF or VDD pin, whichever is selected as reference input. 4: When ADC is off, it will not consume any current other than leakage current. The power-down current specification includes any such leakage from the ADC module. PIC12F683 DS41211D-page 134 © 2007 Microchip Technology Inc. TABLE 15-10: PIC12F683 A/D CONVERSION REQUIREMENTS Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +125°C Param No. Sym Characteristic Min Typ† Max Units Conditions AD130* TAD A/D Clock Period 1.6 — 9.0 μs TOSC-based, VREF ≥ 3.0V 3.0 — 9.0 μs TOSC-based, VREF full range A/D Internal RC Oscillator Period 3.0 6.0 9.0 μs ADCS<1:0> = 11 (ADRC mode) At VDD = 2.5V 1.6 4.0 6.0 μs At VDD = 5.0V AD131 TCNV Conversion Time (not including Acquisition Time)(1) — 11 — TAD Set GO/DONE bit to new data in A/D Result register. AD132* TACQ Acquisition Time 11.5 — μs AD133* TAMP Amplifier Settling Time — — 5 μs AD134 TGO Q4 to A/D Clock Start — — TOSC/2 TOSC/2 + TCY — — — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. * These parameters are characterized but not tested. † Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle. 2: See Section 9.3 “A/D Acquisition Requirements” for minimum conditions. © 2007 Microchip Technology Inc. DS41211D-page 135 PIC12F683 FIGURE 15-10: PIC12F683 A/D CONVERSION TIMING (NORMAL MODE) FIGURE 15-11: PIC12F683 A/D CONVERSION TIMING (SLEEP MODE) AD131 AD130 BSF ADCON0, GO Q4 A/D CLK A/D Data ADRES ADIF GO Sample OLD_DATA Sampling Stopped DONE NEW_DATA 9 8 7 3 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1 TCY 6 AD134 (TOSC/2(1)) 1 TCY AD132 AD132 AD131 AD130 BSF ADCON0, GO Q4 A/D CLK A/D Data ADRES ADIF GO Sample OLD_DATA Sampling Stopped DONE NEW_DATA 9 7 3 2 1 0 Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. AD134 8 6 (TOSC/2 + TCY(1)) 1 TCY 1 TCY PIC12F683 DS41211D-page 136 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 137 PIC12F683 16.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD range). This is for information only and devices are ensured to operate properly only within the specified range. “Typical” represents the mean of the distribution at 25°C. “Maximum” or “minimum” represents (mean + 3σ) or (mean - 3σ) respectively, where σ is a standard deviation, over each temperature range. FIGURE 16-1: TYPICAL IDD vs. FOSC OVER VDD (EC MODE) Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. 3.0V 4.0V 5.0V 5.5V 2.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz FOSC IDD (mA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 138 © 2007 Microchip Technology Inc. FIGURE 16-2: MAXIMUM IDD vs. FOSC OVER VDD (EC MODE) FIGURE 16-3: TYPICAL IDD vs. FOSC OVER VDD (HS MODE) EC Mode 3.0V 4.0V 5.0V 2.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1 MHz 2 MHz 4 MHz 6 MHz 8 MHz 10 MHz 12 MHz 14 MHz 16 MHz 18 MHz 20 MHz FOSC IDD (mA) 5.5V Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Typical IDD vs. FOSC Over Vdd HS Mode 3.0V 3.5V 4.0V 4.5V 5.0V 5.5V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4 MHz 10 MHz 16 MHz 20 MHz FOSC IDD (mA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) © 2007 Microchip Technology Inc. DS41211D-page 139 PIC12F683 FIGURE 16-4: MAXIMUM IDD vs. FOSC OVER VDD (HS MODE) FIGURE 16-5: TYPICAL IDD vs. VDD OVER FOSC (XT MODE) Maximum IDD vs. FOSC Over Vdd HS Mode 3.5V 4.0V 4.5V 5.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4 MHz 10 MHz 16 MHz 20 MHz FOSC IDD (mA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 3.0V 5.5V XT Mode 0 100 200 300 400 500 600 700 800 900 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 4 MHz 1 MHz PIC12F683 DS41211D-page 140 © 2007 Microchip Technology Inc. FIGURE 16-6: MAXIMUM IDD vs. VDD OVER FOSC (XT MODE) FIGURE 16-7: TYPICAL IDD vs. VDD OVER FOSC (EXTRC MODE) XT Mode 0 200 400 600 800 1,000 1,200 1,400 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 4 MHz 1 MHz EXTRC Mode 0 100 200 300 400 500 600 700 800 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (μA) 1 MHz Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 4 MHz © 2007 Microchip Technology Inc. DS41211D-page 141 PIC12F683 FIGURE 16-8: MAXIMUM IDD vs. VDD (EXTRC MODE) FIGURE 16-9: IDD vs. VDD OVER FOSC (LFINTOSC MODE, 31 kHz) EXTRC Mode 0 200 400 600 800 1,000 1,200 1,400 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 4 MHz 1 MHz LFINTOSC Mode, 31KHZ Typical Maximum 0 10 20 30 40 50 60 70 80 VDD (V) IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 PIC12F683 DS41211D-page 142 © 2007 Microchip Technology Inc. FIGURE 16-10: IDD vs. VDD (LP MODE) FIGURE 16-11: TYPICAL IDD vs. FOSC OVER VDD (HFINTOSC MODE) LP Mode 0 10 20 30 40 50 60 70 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 32 kHz Maximum 32 kHz Typical HFINTOSC 2.0V 3.0V 4.0V 5.0V 5.5V 0 200 400 600 800 1,000 1,200 1,400 1,600 125 kHz 250 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz FOSC IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) © 2007 Microchip Technology Inc. DS41211D-page 143 PIC12F683 FIGURE 16-12: MAXIMUM IDD vs. FOSC OVER VDD (HFINTOSC MODE) FIGURE 16-13: TYPICAL IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) HFINTOSC 2.0V 3.0V 4.0V 5.0V 5.5V 0 200 400 600 800 1,000 1,200 1,400 1,600 1,800 2,000 125 kHz 250 kHz 500 kHz 1 MHz 2 MHz 4 MHz 8 MHz FOSC IDD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Typical (Sleep Mode all Peripherals Disabled) 0.0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 144 © 2007 Microchip Technology Inc. FIGURE 16-14: MAXIMUM IPD vs. VDD (SLEEP MODE, ALL PERIPHERALS DISABLED) FIGURE 16-15: COMPARATOR IPD vs. VDD (BOTH COMPARATORS ENABLED) Maximum (Sleep Mode all Peripherals Disabled) Max. 125°C Max. 85°C 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Maximum: Mean + 3σ Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 0 20 40 60 80 100 120 140 160 180 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Maximum Typical Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) © 2007 Microchip Technology Inc. DS41211D-page 145 PIC12F683 FIGURE 16-16: BOR IPD vs. VDD OVER TEMPERATURE FIGURE 16-17: TYPICAL WDT IPD vs. VDD OVER TEMPERATURE 0 20 40 60 80 100 120 140 160 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Maximum Typical Typical 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) TTyyppicicaal:l: SSttaattisistticicaal l MMeeaann @@2255°°CC Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 146 © 2007 Microchip Technology Inc. FIGURE 16-18: MAXIMUM WDT IPD vs. VDD OVER TEMPERATURE FIGURE 16-19: WDT PERIOD vs. VDD OVER TEMPERATURE Maximum Max. 125°C Max. 85°C 0.0 5.0 10.0 15.0 20.0 25.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Minimum Typical 10 12 14 16 18 20 22 24 26 28 30 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Time (ms) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Max. (125°C) Max. (85°C) © 2007 Microchip Technology Inc. DS41211D-page 147 PIC12F683 FIGURE 16-20: WDT PERIOD vs. TEMPERATURE OVER VDD (5.0V) FIGURE 16-21: CVREF IPD vs. VDD OVER TEMPERATURE (HIGH RANGE) Vdd = 5V 10 12 14 16 18 20 22 24 26 28 30 -40°C 25°C 85°C 125°C Temperature (°C) Time (ms) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Maximum Typical Minimum High Range Typical Max. 85°C 0 20 40 60 80 100 120 140 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Max. 125°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 148 © 2007 Microchip Technology Inc. FIGURE 16-22: CVREF IPD vs. VDD OVER TEMPERATURE (LOW RANGE) FIGURE 16-23: VOL vs. IOL OVER TEMPERATURE (VDD = 3.0V) Typical Max. 85°C 0 20 40 60 80 100 120 140 160 180 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (μA) Max. 125°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) (VDD = 3V, -40×C TO 125×C) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) VOL (V) Max. 85°C Max. 125°C Typical 25°C Min. -40°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) © 2007 Microchip Technology Inc. DS41211D-page 149 PIC12F683 FIGURE 16-24: VOL vs. IOL OVER TEMPERATURE (VDD = 5.0V) FIGURE 16-25: VOH vs. IOH OVER TEMPERATURE (VDD = 3.0V) 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 IOL (mA) VOL (V) Typical: Statistical Mean @25×C Maximum: Mea n(s-4 +0 ×3C to 125×C) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Max. 85°C Typ. 25°C Min. -40°C Max. 125°C 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 IOH (mA) VOH (V) Typ. 25°C Max. -40°C Min. 125°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 150 © 2007 Microchip Technology Inc. FIGURE 16-26: VOH vs. IOH OVER TEMPERATURE (VDD = 5.0V) FIGURE 16-27: TTL INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE (VDD = 5V, -40×C TO 125×C) 3.0 3.5 4.0 4.5 5.0 5.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 IOH (mA) VOH (V) Max. -40°C Typ. 25°C Min. 125°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) (TTL Input, -40×C TO 125×C) 0.5 0.7 0.9 1.1 1.3 1.5 1.7 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) Typ. 25°C Max. -40°C Min. 125°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) © 2007 Microchip Technology Inc. DS41211D-page 151 PIC12F683 FIGURE 16-28: SCHMITT TRIGGER INPUT THRESHOLD VIN vs. VDD OVER TEMPERATURE FIGURE 16-29: T1OSC IPD vs. VDD OVER TEMPERATURE (32 kHz) (ST Input, -40×C TO 125×C) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) VIN (V) VIH Max. 125°C VIH Min. -40°C VIL Min. 125°C VIL Max. -40°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) Typ. 25°C Max. 85°C Max. 125°C 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) IPD (mA) Maximum: Mea n(- 4+0 3×C to 125×C) Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 152 © 2007 Microchip Technology Inc. FIGURE 16-30: COMPARATOR RESPONSE TIME (RISING EDGE) FIGURE 16-31: COMPARATOR RESPONSE TIME (FALLING EDGE) 531 806 0 100 200 300 400 500 600 700 800 900 1000 2.0 2.5 4.0 5.5 VDD (V) Response Time (nS) Max. 85°C Typ. 25°C Min. -40°C Max. 125°C Note: V- input = Transition from VCM + 100MV to VCM - 20MV V+ input = VCM VCM = VDD - 1.5V)/2 0 100 200 300 400 500 600 700 800 900 1000 2.0 2.5 4.0 5.5 VDD (V) Response Time (nS) Max. 85°C Typ. 25°C Min. -40°C Max. 125°C Note: V- input = Transition from VCM - 100MV to VCM + 20MV V+ input = VCM VCM = VDD - 1.5V)/2 © 2007 Microchip Technology Inc. DS41211D-page 153 PIC12F683 FIGURE 16-32: LFINTOSC FREQUENCY vs. VDD OVER TEMPERATURE (31 kHz) FIGURE 16-33: ADC CLOCK PERIOD vs. VDD OVER TEMPERATURE LFINTOSC 31Khz 0 5,000 10,000 15,000 20,000 25,000 30,000 35,000 40,000 45,000 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Frequency (Hz) Max. -40°C Typ. 25°C Min. 85°C Min. 125°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) 0 2 4 6 8 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Time (μs) 25°C 85°C 125°C -40°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) PIC12F683 DS41211D-page 154 © 2007 Microchip Technology Inc. FIGURE 16-34: TYPICAL HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE FIGURE 16-35: MAXIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE 0 2 4 6 8 10 12 14 16 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Time (μs) 85°C 25°C -40°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) -40C to +85C 0 5 10 15 20 25 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Time (μs) -40°C 85°C 25°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) © 2007 Microchip Technology Inc. DS41211D-page 155 PIC12F683 FIGURE 16-36: MINIMUM HFINTOSC START-UP TIMES vs. VDD OVER TEMPERATURE FIGURE 16-37: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (25°C) -40C to +85C 0 1 2 3 4 5 6 7 8 9 10 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Time (μs) -40°C 25°C 85°C Typical: Statistical Mean @25°C Maximum: Mean (Worst-case Temp) + 3σ (-40°C to 125°C) -5 -4 -3 -2 -1 0 1 2 3 4 5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Change from Calibration (%) PIC12F683 DS41211D-page 156 © 2007 Microchip Technology Inc. FIGURE 16-38: TYPICAL HFINTOSC FREQUENCY CHANGE OVER DEVICE VDD (85°C) FIGURE 16-39: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (125°C) -5 -4 -3 -2 -1 0 1 2 3 4 5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Change from Calibration (%) -5 -4 -3 -2 -1 0 1 2 3 4 5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Change from Calibration (%) © 2007 Microchip Technology Inc. DS41211D-page 157 PIC12F683 FIGURE 16-40: TYPICAL HFINTOSC FREQUENCY CHANGE vs. VDD (-40°C) -5 -4 -3 -2 -1 0 1 2 3 4 5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VDD (V) Change from Calibration (%) PIC12F683 DS41211D-page 158 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 159 PIC12F683 17.0 PACKAGING INFORMATION 17.1 Package Marking Information * Standard PIC® device marking consists of Microchip part number, year code, week code and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. XXXXXNNN 8-Lead PDIP XXXXXXXX YYWW I/P 017 Example 12F683 0415 8-Lead SOIC (3.90 mm) XXXXXXXX XXXXYYWW NNN Example 12F683 I/SN0415 017 Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. e3 e3 XXXXXX 8-Lead DFN (4x4x0.9 mm) XXXXXX YYWW NNN 12F683 Example I/MD 0415 017 XXXXXXX 8-Lead DFN-S (6x5 mm) XXXXXXX XXYYWW NNN 12F683 Example I/MF 0415 017 e3 e3 e3 e3 PIC12F683 DS41211D-page 160 © 2007 Microchip Technology Inc. 17.2 Package Details The following sections give the technical details of the packages. 8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP] Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units INCHES Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A – – .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – – Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB – – .430 N E1 NOTE 1 D 1 2 3 A A1 A2 L b1 b e E eB c Microchip Technology Drawing C04-018B © 2007 Microchip Technology Inc. DS41211D-page 161 PIC12F683 8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 1.27 BSC Overall Height A – – 1.75 Molded Package Thickness A2 1.25 – – Standoff § A1 0.10 – 0.25 Overall Width E 6.00 BSC Molded Package Width E1 3.90 BSC Overall Length D 4.90 BSC Chamfer (optional) h 0.25 – 0.50 Foot Length L 0.40 – 1.27 Footprint L1 1.04 REF Foot Angle φ 0° – 8° Lead Thickness c 0.17 – 0.25 Lead Width b 0.31 – 0.51 Mold Draft Angle Top α 5° – 15° Mold Draft Angle Bottom β 5° – 15° D N e E E1 NOTE 1 1 2 3 b A A1 A2 L L1 c h h φ β α Microchip Technology Drawing C04-057B PIC12F683 DS41211D-page 162 © 2007 Microchip Technology Inc. 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.80 BSC Overall Height A 0.80 0.90 1.00 Standoff A1 0.00 0.02 0.05 Contact Thickness A3 0.20 REF Overall Length D 4.00 BSC Exposed Pad Width E2 0.00 2.20 2.80 Overall Width E 4.00 BSC Exposed Pad Length D2 0.00 3.00 3.60 Contact Width b 0.25 0.30 0.35 Contact Length L 0.30 0.55 0.65 Contact-to-Exposed Pad K 0.20 – – D N E NOTE 1 1 2 A3 A A1 NOTE 2 NOTE 1 D2 2 1 E2 L N e b K EXPOSED PAD TOP VIEW BOTTOM VIEW Microchip Technology Drawing C04-131C © 2007 Microchip Technology Inc. DS41211D-page 163 PIC12F683 8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S] PUNCH SINGULATED Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 1.27 BSC Overall Height A – 0.85 1.00 Molded Package Thickness A2 – 0.65 0.80 Standoff A1 0.00 0.01 0.05 Base Thickness A3 0.20 REF Overall Length D 4.92 BSC Molded Package Length D1 4.67 BSC Exposed Pad Length D2 3.85 4.00 4.15 Overall Width E 5.99 BSC Molded Package Width E1 5.74 BSC Exposed Pad Width E2 2.16 2.31 2.46 Contact Width b 0.35 0.40 0.47 Contact Length L 0.50 0.60 0.75 Contact-to-Exposed Pad K 0.20 – – Model Draft Angle Top φ – – 12° φ NOTE 2 A3 A2 A1 A NOTE 1 NOTE 1 EXPOSED PAD BOTTOM VIEW 1 2 D2 2 1 E2 K L N e b E E1 D D1 N TOP VIEW Microchip Technology Drawing C04-113B PIC12F683 DS41211D-page 164 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 165 PIC12F683 APPENDIX A: DATA SHEET REVISION HISTORY Revision A This is a new data sheet. Revision B Rewrites of the Oscillator and Special Features of the CPU sections. General corrections to Figures and formatting. Revision C Revisions throughout document. Incorporated Golden Chapters. Revision D Replaced Package Drawings; Revised Product ID Section (SN package to 3.90 mm); Replaced PICmicro with PIC; Replaced Dev Tool Section. APPENDIX B: MIGRATING FROM OTHER PIC® DEVICES This discusses some of the issues in migrating from other PIC devices to the PIC12F683 device. B.1 PIC16F676 to PIC12F683 TABLE B-1: FEATURE COMPARISON Feature PIC16F676 PIC12F683 Max Operating Speed 20 MHz 20 MHz Max Program Memory (Words) 1024 2048 SRAM (bytes) 64 128 A/D Resolution 10-bit 10-bit Data EEPROM (Bytes) 128 256 Timers (8/16-bit) 1/1 2/1 Oscillator Modes 8 8 Brown-out Reset Y Y Internal Pull-ups RA0/1/2/4/5 GP0/1/2/4/5, MCLR Interrupt-on-change RA0/1/2/3/4/5 GP0/1/2/3/4/5 Comparator 1 1 ECCP N N Ultra Low-Power Wake-Up N Y Extended WDT N Y Software Control Option of WDT/BOR N Y INTOSC Frequencies 4 MHz 32 kHz- 8 MHz Clock Switching N Y Note: This device has been designed to perform to the parameters of its data sheet. It has been tested to an electrical specification designed to determine its conformance with these parameters. Due to process differences in the manufacture of this device, this device may have different performance characteristics than its earlier version. These differences may cause this device to perform differently in your application than the earlier version of this device. PIC12F683 DS41211D-page 166 © 2007 Microchip Technology Inc. NOTES: © 2007 Microchip Technology Inc. DS41211D-page 167 PIC12F683 INDEX A A/D Specifications.................................................... 133, 134 Absolute Maximum Ratings .............................................. 115 AC Characteristics Industrial and Extended ............................................ 125 Load Conditions ........................................................ 124 ADC .................................................................................... 61 Acquisition Requirements ........................................... 67 Associated registers.................................................... 69 Block Diagram............................................................. 61 Calculating Acquisition Time....................................... 67 Channel Selection....................................................... 61 Configuration............................................................... 61 Configuring Interrupt ................................................... 64 Conversion Clock........................................................ 62 Conversion Procedure ................................................ 64 GPIO Configuration..................................................... 61 Internal Sampling Switch (RSS) IMPEDANCE ................ 67 Interrupts..................................................................... 63 Operation .................................................................... 63 Operation During Sleep .............................................. 64 Reference Voltage (VREF)........................................... 62 Result Formatting........................................................ 63 Source Impedance...................................................... 67 Special Event Trigger.................................................. 64 Starting an A/D Conversion ........................................ 63 ADCON0 Register............................................................... 65 ADRESH Register (ADFM = 0) ........................................... 66 ADRESH Register (ADFM = 1) ........................................... 66 ADRESL Register (ADFM = 0)............................................ 66 ADRESL Register (ADFM = 1)............................................ 66 Analog Input Connection Considerations............................ 52 Analog-to-Digital Converter. See ADC ANSEL Register .................................................................. 33 Assembler MPASM Assembler................................................... 112 B Block Diagrams (CCP) Capture Mode Operation ................................. 76 ADC ............................................................................ 61 ADC Transfer Function ............................................... 68 Analog Input Model ............................................... 52, 68 CCP PWM................................................................... 78 Clock Source............................................................... 19 Comparator ................................................................. 51 Compare ..................................................................... 77 Crystal Operation........................................................ 22 External RC Mode....................................................... 23 Fail-Safe Clock Monitor (FSCM) ................................. 29 GP1 Pin....................................................................... 37 GP2 Pin....................................................................... 37 GP3 Pin....................................................................... 38 GP4 Pin....................................................................... 38 GP5 Pin....................................................................... 39 In-Circuit Serial Programming Connections.............. 100 Interrupt Logic ............................................................. 93 MCLR Circuit............................................................... 86 On-Chip Reset Circuit ................................................. 85 PIC12F683.................................................................... 5 Resonator Operation................................................... 22 Timer1......................................................................... 44 Timer2 ........................................................................ 49 TMR0/WDT Prescaler ................................................ 41 Watchdog Timer (WDT).............................................. 96 Brown-out Reset (BOR)...................................................... 87 Associated.................................................................. 88 Calibration .................................................................. 87 Specifications ........................................................... 129 Timing and Characteristics ....................................... 128 C C Compilers MPLAB C18.............................................................. 112 MPLAB C30.............................................................. 112 Calibration Bits.................................................................... 85 Capture Module. See Capture/Compare/PWM (CCP) Capture/Compare/PWM (CCP) .......................................... 75 Associated registers w/ Capture, Compare and Timer1 ......................................................... 81 Associated registers w/ PWM and Timer2.................. 81 Capture Mode............................................................. 76 CCPx Pin Configuration.............................................. 76 Compare Mode........................................................... 77 CCPx Pin Configuration...................................... 77 Software Interrupt Mode............................... 76, 77 Special Event Trigger ......................................... 77 Timer1 Mode Selection................................. 76, 77 Prescaler .................................................................... 76 PWM Mode................................................................. 78 Duty Cycle .......................................................... 79 Effects of Reset .................................................. 80 Example PWM Frequencies and Resolutions, 20 MHZ.................................. 79 Example PWM Frequencies and Resolutions, 8 MHz .................................... 79 Operation in Sleep Mode.................................... 80 Setup for Operation ............................................ 80 System Clock Frequency Changes .................... 80 PWM Period ............................................................... 79 Setup for PWM Operation .......................................... 80 Timer Resources ........................................................ 75 CCP. See Capture/Compare/PWM (CCP) CCP1CON Register............................................................ 75 Clock Sources External Modes........................................................... 21 EC ...................................................................... 21 HS ...................................................................... 22 LP....................................................................... 22 OST .................................................................... 21 RC ...................................................................... 23 XT....................................................................... 22 Internal Modes............................................................ 23 Frequency Selection........................................... 25 HFINTOSC ......................................................... 23 INTOSC.............................................................. 23 INTOSCIO.......................................................... 23 LFINTOSC.......................................................... 25 Clock Switching .................................................................. 27 Code Examples A/D Conversion .......................................................... 64 Assigning Prescaler to Timer0.................................... 42 Assigning Prescaler to WDT....................................... 42 Changing Between Capture Prescalers ..................... 76 Data EEPROM Read.................................................. 73 Data EEPROM Write.................................................. 73 PIC12F683 DS41211D-page 168 © 2007 Microchip Technology Inc. Indirect Addressing .....................................................18 Initializing GPIO .......................................................... 31 Saving STATUS and W Registers in RAM ................. 95 Ultra Low-Power Wake-up Initialization ...................... 35 Write Verify ................................................................. 73 Code Protection .................................................................. 99 Comparator ......................................................................... 51 C2OUT as T1 Gate .....................................................57 Configurations............................................................. 53 I/O Operating Modes...................................................53 Interrupts..................................................................... 55 Operation .............................................................. 51, 54 Operation During Sleep .............................................. 56 Response Time........................................................... 54 Synchronizing COUT w/Timer1 .................................. 57 Comparator Module Associated registers.................................................... 59 Comparator Voltage Reference (CVREF) Response Time........................................................... 54 Comparator Voltage Reference (CVREF) ............................58 Effects of a Reset........................................................ 56 Specifications............................................................ 132 Comparators C2OUT as T1 Gate .....................................................45 Effects of a Reset........................................................ 56 Specifications............................................................ 132 Compare Module. See Capture/Compare/PWM (CCP) CONFIG Register................................................................ 84 Configuration Bits................................................................ 83 CPU Features ..................................................................... 83 Customer Change Notification Service ............................. 171 Customer Notification Service........................................... 171 Customer Support ............................................................. 171 D Data EEPROM Memory Associated Registers .................................................. 74 Code Protection .................................................... 71, 74 Data Memory Organization ...................................................7 Map of the PIC12F683.................................................. 8 DC and AC Characteristics Graphs and Tables ...................................................137 DC Characteristics Extended and Industrial ............................................ 121 Industrial and Extended ............................................ 117 Development Support ....................................................... 111 Device Overview ................................................................... 5 E EEADR Register ................................................................. 71 EECON1 Register ............................................................... 72 EECON2 Register ............................................................... 72 EEDAT Register.................................................................. 71 EEPROM Data Memory Avoiding Spurious Write.............................................. 74 Reading....................................................................... 73 Write Verify ................................................................. 73 Writing......................................................................... 73 Effects of Reset PWM mode ................................................................. 80 Electrical Specifications .................................................... 115 Enhanced Capture/Compare/PWM (ECCP) Specifications............................................................ 131 Errata .................................................................................... 3 F Fail-Safe Clock Monitor ...................................................... 29 Fail-Safe Condition Clearing....................................... 29 Fail-Safe Detection ..................................................... 29 Fail-Safe Operation..................................................... 29 Reset or Wake-up from Sleep .................................... 29 Firmware Instructions ....................................................... 101 Fuses. See Configuration Bits G General Purpose Register File ............................................. 8 GPIO................................................................................... 31 Additional Pin Functions ............................................. 32 ANSEL Register ................................................. 32 Interrupt-on-Change ........................................... 32 Ultra Low-Power Wake-up............................ 32, 35 Weak Pull-up ...................................................... 32 Associated Registers.................................................. 39 GP0 ............................................................................ 36 GP1 ............................................................................ 37 GP2 ............................................................................ 37 GP3 ............................................................................ 38 GP4 ............................................................................ 38 GP5 ............................................................................ 39 Pin Descriptions and Diagrams .................................. 36 Specifications ........................................................... 127 GPIO Register .................................................................... 31 I ID Locations........................................................................ 99 In-Circuit Debugger........................................................... 100 In-Circuit Serial Programming (ICSP)............................... 100 Indirect Addressing, INDF and FSR Registers ................... 18 Instruction Format............................................................. 101 Instruction Set................................................................... 101 ADDLW..................................................................... 103 ADDWF..................................................................... 103 ANDLW..................................................................... 103 ANDWF..................................................................... 103 BCF .......................................................................... 103 BSF........................................................................... 103 BTFSC...................................................................... 103 BTFSS ...................................................................... 104 CALL......................................................................... 104 CLRF ........................................................................ 104 CLRW....................................................................... 104 CLRWDT .................................................................. 104 COMF ....................................................................... 104 DECF........................................................................ 104 DECFSZ ................................................................... 105 GOTO....................................................................... 105 INCF ......................................................................... 105 INCFSZ..................................................................... 105 IORLW...................................................................... 105 IORWF...................................................................... 105 MOVF ....................................................................... 106 MOVLW.................................................................... 106 MOVWF.................................................................... 106 NOP.......................................................................... 106 RETFIE..................................................................... 107 RETLW..................................................................... 107 RETURN................................................................... 107 RLF........................................................................... 108 RRF .......................................................................... 108 SLEEP ...................................................................... 108 © 2007 Microchip Technology Inc. DS41211D-page 169 PIC12F683 SUBLW..................................................................... 108 SUBWF..................................................................... 109 SWAPF ..................................................................... 109 XORLW..................................................................... 109 XORWF..................................................................... 109 INTCON Register ................................................................ 14 Internal Oscillator Block INTOSC Specifications............................................ 126, 127 Internal Sampling Switch (RSS) IMPEDANCE ........................ 67 Internet Address................................................................ 171 Interrupts............................................................................. 92 ADC ............................................................................ 64 Associated Registers .................................................. 94 Comparator ................................................................. 55 Context Saving............................................................ 95 Data EEPROM Memory Write .................................... 72 GP2/INT...................................................................... 92 GPIO Interrupt-on-change .......................................... 93 Interrupt-on-Change.................................................... 32 Timer0......................................................................... 93 TMR1 .......................................................................... 46 INTOSC Specifications ............................................. 126, 127 IOC Register ....................................................................... 34 L Load Conditions ................................................................ 124 M MCLR.................................................................................. 86 Internal ........................................................................ 86 Memory Organization Data EEPROM Memory.............................................. 71 Microchip Internet Web Site.............................................. 171 Migrating from other PIC Devices ..................................... 165 MPLAB ASM30 Assembler, Linker, Librarian ................... 112 MPLAB ICD 2 In-Circuit Debugger ................................... 113 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator .................................................... 113 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator .................................................... 113 MPLAB Integrated Development Environment Software .. 111 MPLAB PM3 Device Programmer .................................... 113 MPLINK Object Linker/MPLIB Object Librarian ................ 112 O OPCODE Field Descriptions............................................. 101 OPTION Register .......................................................... 13, 43 OSCCON Register .............................................................. 20 Oscillator Associated registers.............................................. 30, 48 Oscillator Module ................................................................ 19 EC............................................................................... 19 HFINTOSC.................................................................. 19 HS............................................................................... 19 INTOSC ...................................................................... 19 INTOSCIO................................................................... 19 LFINTOSC .................................................................. 19 LP................................................................................ 19 RC............................................................................... 19 RCIO........................................................................... 19 XT ............................................................................... 19 Oscillator Parameters ....................................................... 126 Oscillator Specifications.................................................... 125 Oscillator Start-up Timer (OST) Specifications............................................................ 129 Oscillator Switching Fail-Safe Clock Monitor .............................................. 29 Two-Speed Clock Start-up ......................................... 27 OSCTUNE Register............................................................ 24 P Packaging......................................................................... 159 Details....................................................................... 160 Marking..................................................................... 159 PCL and PCLATH............................................................... 18 Computed GOTO ....................................................... 18 Stack........................................................................... 18 PCON Register ............................................................. 17, 88 PICSTART Plus Development Programmer..................... 114 PIE1 Register ..................................................................... 15 Pin Diagram.......................................................................... 2 Pinout Descriptions PIC12F683 ................................................................... 6 PIR1 Register ..................................................................... 16 Power-Down Mode (Sleep)................................................. 98 Power-On Reset (POR) ...................................................... 86 Power-up Timer (PWRT) .................................................... 86 Specifications ........................................................... 129 Precision Internal Oscillator Parameters .......................... 127 Prescaler Shared WDT/Timer0................................................... 42 Switching Prescaler Assignment ................................ 42 Program Memory Organization............................................. 7 Map and Stack for the PIC12F683 ............................... 7 Programming, Device Instructions.................................... 101 R Reader Response............................................................. 172 Read-Modify-Write Operations ......................................... 101 Registers ADCON0 (ADC Control 0) .......................................... 65 ADRESH (ADC Result High) with ADFM = 0) ............ 66 ADRESH (ADC Result High) with ADFM = 1) ............ 66 ADRESL (ADC Result Low) with ADFM = 0).............. 66 ADRESL (ADC Result Low) with ADFM = 1).............. 66 ANSEL (Analog Select) .............................................. 33 CCP1CON (CCP1 Control) ........................................ 75 CMCON0 (Comparator Control) Register................... 56 CMCON1 (Comparator Control) Register................... 57 CONFIG (Configuration Word) ................................... 84 EEADR (EEPROM Address) ...................................... 71 EECON1 (EEPROM Control 1) .................................. 72 EECON2 (EEPROM Control 2) .................................. 72 EEDAT (EEPROM Data) ............................................ 71 GPIO........................................................................... 31 INTCON (Interrupt Control) ........................................ 14 IOC (Interrupt-on-Change GPIO) ............................... 34 OPTION_REG (OPTION)..................................... 13, 43 OSCCON (Oscillator Control)..................................... 20 OSCTUNE (Oscillator Tuning).................................... 24 PCON (Power Control Register)................................. 17 PCON (Power Control) ............................................... 88 PIE1 (Peripheral Interrupt Enable 1) .......................... 15 PIR1 (Peripheral Interrupt Register 1) ........................ 16 Reset Values .............................................................. 90 Reset Values (Special Registers)............................... 91 STATUS ..................................................................... 12 T1CON ....................................................................... 47 T2CON ....................................................................... 50 TRISIO (Tri-State GPIO) ............................................ 32 VRCON (Voltage Reference Control) ......................... 58 PIC12F683 DS41211D-page 170 © 2007 Microchip Technology Inc. WDTCON (Watchdog Timer Control).......................... 97 WPU (Weak Pull-Up GPIO) ........................................ 34 Resets ................................................................................. 85 Brown-out Reset (BOR) .............................................. 85 MCLR Reset, Normal Operation ................................. 85 MCLR Reset, Sleep .................................................... 85 Power-on Reset (POR) ............................................... 85 WDT Reset, Normal Operation ................................... 85 WDT Reset, Sleep ...................................................... 85 Revision History ................................................................ 165 S Sleep Power-Down Mode .....................................................98 Wake-up......................................................................98 Wake-up Using Interrupts ........................................... 98 Software Simulator (MPLAB SIM)..................................... 112 Special Event Trigger.......................................................... 64 Special Function Registers ...................................................8 STATUS Register................................................................ 12 T T1CON Register.................................................................. 47 T2CON Register.................................................................. 50 Thermal Considerations .................................................... 123 Time-out Sequence............................................................. 88 Timer0................................................................................. 41 Associated Registers .................................................. 43 External Clock............................................................. 42 Interrupt................................................................. 13, 43 Operation .............................................................. 41, 44 Specifications............................................................ 130 T0CKI ..........................................................................42 Timer1................................................................................. 44 Associated registers.................................................... 48 Asynchronous Counter Mode ..................................... 45 Reading and Writing ........................................... 45 Interrupt....................................................................... 46 Modes of Operation .................................................... 44 Operation During Sleep .............................................. 46 Oscillator ..................................................................... 45 Prescaler ..................................................................... 45 Specifications............................................................ 130 Timer1 Gate Inverting Gate .....................................................45 Selecting Source........................................... 45, 57 Synchronizing COUT w/Timer1 .......................... 57 TMR1H Register ......................................................... 44 TMR1L Register .......................................................... 44 Timer2 Associated registers.................................................... 50 Timers Timer1 T1CON................................................................ 47 Timer2 T2CON................................................................ 50 Timing Diagrams A/D Conversion......................................................... 135 A/D Conversion (Sleep Mode) .................................. 135 Brown-out Reset (BOR) ............................................ 128 Brown-out Reset Situations ........................................ 87 CLKOUT and I/O....................................................... 127 Clock Timing ............................................................. 125 Comparator Output .....................................................51 Enhanced Capture/Compare/PWM (ECCP) ............. 131 Fail-Safe Clock Monitor (FSCM) ................................. 30 INT Pin Interrupt ......................................................... 94 Internal Oscillator Switch Timing ................................ 26 Reset, WDT, OST and Power-up Timer ................... 128 Time-out Sequence on Power-up (Delayed MCLR) ... 89 Time-out Sequence on Power-up (MCLR with VDD) .. 89 Timer0 and Timer1 External Clock ........................... 130 Timer1 Incrementing Edge ......................................... 46 Two Speed Start-up.................................................... 28 Wake-up from Sleep Through Interrupt ...................... 99 Timing Parameter Symbology .......................................... 124 TRISIO Register ................................................................. 32 Two-Speed Clock Start-up Mode........................................ 27 U Ultra Low-Power Wake-up............................................ 32, 35 V Voltage Reference. See Comparator Voltage Reference (CVREF) Voltage References Associated registers ................................................... 59 VREF. SEE ADC Reference Voltage W Wake-up Using Interrupts ................................................... 98 Watchdog Timer (WDT)...................................................... 96 Associated Registers.................................................. 97 Clock Source .............................................................. 96 Modes......................................................................... 96 Period ......................................................................... 96 Specifications ........................................................... 129 WDTCON Register ............................................................. 97 WPU Register ..................................................................... 34 WWW Address ................................................................. 171 WWW, On-Line Support ....................................................... 3 © 2007 Microchip Technology Inc. DS41211D-page 171 PIC12F683 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • Local Sales Office • Field Application Engineer (FAE) • Technical Support • Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com PIC12F683 DS41211D-page 172 © 2007 Microchip Technology Inc. READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: Questions: FAX: (______) _________ - _________ PIC12F683 DS41211D 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? © 2007 Microchip Technology Inc. DS41211D-page 173 PIC12F683 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX XXX Temperature Package Pattern Range Device Device: PIC12F683(1), PIC12F683T(2) VDD range 2.0V to 5.5V Temperature Range: I = -40°C to +85°C(Industrial) E = -40°C to +125°C (Extended) Package: P = Plastic DIP MD = Dual-Flat, No Leads (DFN-S, 4x4x0.9 mm) MF = Dual-Flat, No Leads (DFN-S, 6x5 mm) SN = 8-lead Small Outline (3.90 mm) Pattern: 3-digit Pattern Code for QTP (blank otherwise) Examples: a) PIC12F683-E/P 301 = Extended Temp., PDIP package, 20 MHz, QTP pattern #301 b) PIC12F683-I/SN = Industrial Temp., SOIC package, 20 MHz Note 1: F = Standard Voltage Range LF = Wide Voltage Range 2: T = in tape and reel PLCC, and TQFP packages only. DS41211D-page 174 © 2007 Microchip Technology Inc. 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Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 WORLDWIDE SALES AND SERVICE 12/08/06 8285ES–AVR–02/2013 Features • High performance, low power Atmel® AVR® 8-Bit Microcontroller • Advanced RISC architecture – 130 powerful instructions – most single clock cycle execution – 32 × 8 general purpose working registers – Fully static operation – Up to 16MIPS throughput at 16MHz (Atmel ATmega165PA/645P) – Up to 20MIPS throughput at 20MHz (Atmel ATmega165A/325A/325PA/645A/3250A/3250PA/6450A/6450P) – On-chip 2-cycle multiplier • High endurance non-volatile memory segments – In-system self-programmable flash program memory • 16KBytes (ATmega165A/ATmega165PA) • 32KBytes (ATmega325A/ATmega325PA/ATmega3250A/ATmega3250PA) • 64KBytes (ATmega645A/ATmega645P/ATmega6450A/ATmega6450P) – EEPROM • 512Bytes (ATmega165A/ATmega165PA) • 1Kbytes (ATmega325A/ATmega325PA/ATmega3250A/ATmega3250PA) • 2Kbytes (ATmega645A/ATmega645P/ATmega6450A/ATmega6450P) – Internal SRAM • 1KBytes (ATmega165A/ATmega165PA) • 2KBytes (ATmega325A/ATmega325PA/ATmega3250A/ATmega3250PA) • 4KBytes (ATmega645A/ATmega645P/ATmega6450A/ATmega6450P) – Write/erase cycles: 10,000 flash/100,000 EEPROM – Data retention: 20 years at 85°C/100 years at 25C (1) – Optional Boot Code Section with Independent Lock Bits • In-System Programming by On-chip Boot Program • True read-while-write operation – Programming lock for software security • Atmel QTouch® library support – Capacitive touch buttons, sliders and wheels – Atmel QTouch and QMatrix acquisition – Up to 64 sense channels • JTAG (IEEE std. 1149.1 compliant) interface – Boundary-scan capabilities according to the JTAG standard – Extensive on-chip debug support – Programming of Flash, EEPROM, Fuses, and Lock Bits through the JTAG Interface • Peripheral Features – Two 8-bit Timer/Counters with Separate Prescaler and Compare Mode – One 16-bit Timer/Counter with Separate Prescaler, Compare Mode, and Capture Mode – Real time counter with separate oscillator – Four PWM channels – 8-channel, 10-bit ADC – Programmable serial USART – Master/Slave SPI Serial Interface – Universal Serial Interface with Start Condition detector – Programmable Watchdog Timer with separate on-chip oscillator – On-chip Analog Comparator – Interrupt and Wake-up on pin change • Special microcontroller features – Power-on reset and programmable Brown-out detection – Internal calibrated oscillator – External and internal interrupt sources – Five sleep modes: Idle, ADC Noise Reduction, Power-save, Power-down and Standby • I/O and packages – 54/69 programmable I/O lines – 64/100-lead TQFP, 64-pad QFN/MLF and 64-pad DRQFN • Speed grade: – ATmega 165A/165PA/645A/645P: 0 - 16MHz @ 1.8 - 5.5V – ATmega325A/325PA/3250A/3250PA/6450A/6450P: 0 - 20MHz @ 1.8 - 5.5V • Temperature range: – -40°C to 85C industrial • Ultra-low power consumption (picoPower® devices) – Active mode: • 1MHz, 1.8V: 215μA • 32kHz, 1.8V: 8μA (including oscillator) – Power-down mode: 0.1μA at 1.8V – Power-save mode: 0.6μA at 1.8V (Including 32kHz RTC) Note: 1. Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. Atmel ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P 8-bit Atmel Microcontroller with 16/32/64KB In-System Programmable Flash SUMMARY ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 2 8285ES–AVR–02/2013 1. Pin configurations 1.1 Pinout - TQFP and QFN/MLF Figure 1-1. 64A (TQFP)and 64M1 (QFN/MLF) pinout Atmel ATmega165A/ATmega165PA/ATmega325A/ATmega325PA/ATmega645A/ATmega645P. Note: The large center pad underneath the QFN/MLF packages is made of metal and internally connected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 64 63 62 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 17 61 60 18 59 20 58 19 21 57 22 56 23 55 24 54 25 53 26 52 27 51 29 28 50 32 49 31 30 PC0 VCC GND PF0 (ADC0) PF7 (ADC7/TDI) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) AREF GND AVCC (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 DNC (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SS/PCINT8) PB0 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC2A/PCINT15) PB7 (T1) PG3 (OC1B/PCINT14) PB6 (T0) PG4 (OC1A/PCINT13) PB5 PC1 PG0 PD7 PC2 PC3 PC4 PC5 PC6 PC7 PA7 PG2 PA6 PA5 PA4 PA3 PA0 PA1 PA2 PG1 PD6 PD5 PD4 PD3 PD2 (INT0) PD1 (ICP1) PD0 (TOSC1) XTAL1 (TOSC2) XTAL2 RESET/PG5 GND VCC INDEX CORNER ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 3 8285ES–AVR–02/2013 1.2 Pinout - 100A (TQFP) Figure 1-2. Pinout Atmel ATmega3250A/ATmega3250PA/ATmega6450A/ATmega6450P. (OC2A/PCINT15) PB7 DNC (T1) PG3 (T0) PG4 RESET/PG5 VCC GND (TOSC2) XTAL2 (TOSC1) XTAL1 DNC DNC (PCINT26) PJ2 (PCINT27) PJ3 (PCINT28) PJ4 (PCINT29) PJ5 (PCINT30) PJ6 DNC (ICP1) PD0 (INT0) PD1 PD2 PD3 PD4 PD5 PD6 PD7 AVCC AGND AREF PF0 (ADC0) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) PF7 (ADC7/TDI) DNC DNC PH7 (PCINT23) PH6 (PCINT22) PH5 (PCINT21) PH4 (PCINT20) DNC DNC GND VCC DNC PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PG2 PC7 PC6 DNC PH3 (PCINT19) PH2 (PCINT18) PH1 (PCINT17) PH0 (PCINT16) DNC DNC DNC DNC PC5 PC4 PC3 PC2 PC1 PC0 PG1 PG0 INDEX CORNER 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 DNC (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 VCC GND DNC (PCINT24) PJ0 (PCINT25) PJ1 DNC DNC DNC DNC (SS/PCINT8) PB0 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC1A/PCINT13) PB5 (OC1B/PCINT14) PB6 TQFP ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 4 8285ES–AVR–02/2013 2. Overview The Atmel ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, this microcontroller achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block diagram Figure 2-1. Block diagram. The AVR core combines a rich instruction set with 32 general purpose working registers. All the 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. PROGRAM COUNTER INTERNAL OSCILLATOR WATCHDOG TIMER STACK POINTER PROGRAM FLASH MCU CONTROL REGISTER SRAM GENERAL PURPOSE REGISTERS INSTRUCTION REGISTER TIMER/ COUNTERS INSTRUCTION DECODER DATA DIR. REG. PORTB DATA DIR. REG. PORTE DATA DIR. REG. PORTA DATA DIR. REG. PORTD DATA REGISTER PORTB DATA REGISTER PORTE DATA REGISTER PORTA DATA REGISTER PORTD TIMING AND CONTROL OSCILLATOR INTERRUPT UNIT EEPROM USART SPI STATUS REGISTER Z Y X ALU PORTE DRIVERS PORTB DRIVERS PORTF DRIVERS PORTA DRIVERS PORTD DRIVERS PORTC DRIVERS PE0 - PE7 PB0 - PB7 PF0 - PF7 PA0 - PA7 GND VCC XTAL1 XTAL2 CONTROL LINES + - ANALOG COMPARATOR PC0 - PC7 8-BIT DATA BUS RESET CALIB. OSC DATA DIR. REG. PORTC DATA REGISTER PORTC ON-CHIP DEBUG JTAG TAP PROGRAMMING LOGIC BOUNDARYSCAN DATA DIR. REG. PORTF DATA REGISTER PORTF ADC PD0 - PD7 DATA DIR. REG. PORTG DATA REG. PORTG PORTG DRIVERS PG0 - PG4 AGND AREF AVCC UNIVERSAL SERIAL INTERFACE AVR CPU PORTH DRIVERS PH0 - PH7 DATA DIR. REG. PORTH DATA REGISTER PORTH PORTJ DRIVERS PJ0 - PJ6 DATA DIR. REG. PORTJ DATA REGISTER PORTJ ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 5 8285ES–AVR–02/2013 The Atmel ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P provides the following features: 16K/32K/64K bytes of In-System Programmable Flash with Read-While-Write capabilities, 512/1K/2K bytes EEPROM, 1K/2K/4K byte SRAM, 54/69 general purpose I/O lines, 32 general purpose working registers, a JTAG interface for Boundary-scan, On-chip Debugging support and programming, three flexible Timer/Counters with compare modes, internal and external interrupts, a serial programmable USART, Universal Serial Interface with Start Condition Detector, an 8-channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, an SPI serial port, and five software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counters, SPI port, and interrupt system to continue functioning. The Power-down mode saves the register contents but freezes the Oscillator, disabling all other chip functions until the next interrupt or hardware reset. In Power-save mode, the asynchronous timer continues to run, allowing the user to maintain a timer base while the rest of the device is sleeping. The ADC Noise Reduction mode stops the CPU and all I/O modules except asynchronous timer and ADC, to minimize switching noise during ADC conversions. In Standby mode, the XTAL/resonator Oscillator is running while the rest of the device is sleeping. This allows very fast start-up combined with low-power consumption. Atmel offers the QTouch® library for embedding capacitive touch buttons, sliders and wheels functionality into AVR microcontrollers. The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys and includes Adjacent Key Suppression® (AKS®) technology for unambiguous detection of key events. The easy-to-use QTouch Suite toolchain allows you to explore, develop and debug your own touch applications. The device is manufactured using Atmel’s high density non-volatile memory technology. The On-chip ISP Flash allows the program memory to be reprogrammed In-System through an SPI serial interface, by a conventional nonvolatile memory programmer, or by an On-chip Boot program running on the AVR core. The Boot program can use any interface to download the application program in the Application Flash memory. Software in the Boot Flash section will continue to run while the Application Flash section is updated, providing true Read-While-Write operation. By combining an 8-bit RISC CPU with In-System Self-Programmable Flash on a monolithic chip, the Atmel devise is a powerful microcontroller that provides a highly flexible and cost effective solution to many embedded control applications. The ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/ Simulators, In-Circuit Emulators, and Evaluation kits. ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 6 8285ES–AVR–02/2013 2.2 Comparison between Atmel ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P 2.3 Pin descriptions 2.3.1 VCC Digital supply voltage. 2.3.2 GND Ground. 2.3.3 Port A (PA7:PA0) Port A is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port A output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port A pins that are externally pulled low will source current if the pull-up resistors are activated. The Port A pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port A also serves the functions of various special features of the ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P as listed on ”Alternate functions of Port B” on page 68. 2.3.4 Port B (PB7:PB0) Port B is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B has better driving capabilities than the other ports. Port B also serves the functions of various special features of the ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P as listed on ”Alternate functions of Port B” on page 68. 2.3.5 Port C (PC7:PC0) Port C is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port C output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port C pins that are Table 2-1. Differences between: ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P. Device Flash EEPROM RAM MHz ATmega165A 16Kbyte 512Bytes 1Kbyte 16 ATmega165PA 16Kbyte 512Bytes 1Kbyte 16 ATmega325A 32Kbyte 1Kbyte 2Kbyte 20 ATmega325PA 32Kbyte 1Kbyte 2Kbyte 20 ATmega3250A 32Kbytes 1Kbyte 2Kbyte 20 ATmega3250PA 32Kbyte 1Kbyte 2Kbyte 20 ATmega645A 64Kbyte 2Kbyte 4Kbyte 16 ATmega645P 64Kbyte 2Kbyte 4Kbyte 16 ATmega6450A 64Kbyte 2Kbyte 4Kbyte 20 ATmega6450P 64Kbyte 2Kbyte 4Kbyte 20 ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 7 8285ES–AVR–02/2013 externally pulled low will source current if the pull-up resistors are activated. The Port C pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port C also serves the functions of special features of the Atmel ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P as listed on ”Alternate functions of Port D” on page 70. 2.3.6 Port D (PD7:PD0) Port D is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port D output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port D pins that are externally pulled low will source current if the pull-up resistors are activated. The Port D pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port D also serves the functions of various special features of the ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P as listed on ”Alternate functions of Port D” on page 70. 2.3.7 Port E (PE7:PE0) Port E is an 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port E output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port E pins that are externally pulled low will source current if the pull-up resistors are activated. The Port E pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port E also serves the functions of various special features of the ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P as listed on ”Alternate functions of Port E” on page 71. 2.3.8 Port F (PF7:PF0) Port F serves as the analog inputs to the A/D Converter. Port F also serves as an 8-bit bi-directional I/O port, if the A/D Converter is not used. Port pins can provide internal pull-up resistors (selected for each bit). The Port F output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port F pins that are externally pulled low will source current if the pull-up resistors are activated. The Port F pins are tri-stated when a reset condition becomes active, even if the clock is not running. If the JTAG interface is enabled, the pull-up resistors on pins PF7(TDI), PF5(TMS), and PF4(TCK) will be activated even if a reset occurs. Port F also serves the functions of the JTAG interface, see ”Alternate functions of Port F” on page 73. 2.3.9 Port G (PG5:PG0) Port G is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port G output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port G pins that are externally pulled low will source current if the pull-up resistors are activated. The Port G pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port G also serves the functions of various special features of the ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P as listed on page 75. 2.3.10 Port H (PH7:PH0) Port H is a 8-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port H output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port H pins that are externally pulled low will source current if the pull-up resistors are activated. The Port H pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port H also serves the functions of various special features of the ATmega3250A/3250PA/6450A/6450P as listed on page 76. ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 8 8285ES–AVR–02/2013 2.3.11 Port J (PJ6:PJ0) Port J is a 7-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port J output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port J pins that are externally pulled low will source current if the pull-up resistors are activated. The Port J pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port J also serves the functions of various special features of the Atmel ATmega3250A/3250PA/6450A/6450P as listed on page 78. 2.3.12 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running. The minimum pulse length is given in Table 28-13 on page 297. Shorter pulses are not guaranteed to generate a reset. 2.3.13 XTAL1 Input to the inverting Oscillator amplifier and input to the internal clock operating circuit. 2.3.14 XTAL2 Output from the inverting Oscillator amplifier. 2.3.15 AVCC AVCC is the supply voltage pin for Port F and the A/D Converter. It should be externally connected to VCC, even if the ADC is not used. If the ADC is used, it should be connected to VCC through a low-pass filter. 2.3.16 AREF This is the analog reference pin for the A/D Converter. ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 9 8285ES–AVR–02/2013 3. Ordering Information 3.1 ATmega165A Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel 5. See characterization specifications at 105°C. Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 16 1.8 - 5.5V ATmega165A-AU ATmega165A-AUR(4) ATmega165A-MU ATmega165A-MUR(4) ATmega165A-MCH ATmega165A-MCHR(4) 64A 64A 64M1 64M1 64MC 64MC Industrial (-40C to 85C) ATmega165A-AN ATmega165A-ANR(4) ATmega165A-MN ATmega165A-MNR(4) 64A 64A 64M1 64M1 Extended (-40C to 105C)(5) Package Type 64A 64-Lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 64MC 64-lead (2-row Staggered), 7 x 7 x 1.0 mm body, 4.0 x 4.0mm Exposed Pad, Quad Flat No-Lead Package (QFN) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 10 8285ES–AVR–02/2013 3.2 ATmega165PA Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel. 5. See characterization specifications at 105°C. Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 16 1.8 - 5.5V ATmega165PA-AU ATmega165PA-AUR(4) ATmega165PA-MU ATmega165PA-MUR(4) ATmega165PA-MCH ATmega165PA-MCHR(4) 64A 64A 64M1 64M1 64MC 64MC Industrial (-40C to 85C) ATmega165PA-AN ATmega165PA-ANR(4) ATmega165PA-MN ATmega165PA-MNR(4) 64A 64A 64M1 64M1 Extended (-40C to 105C)(5) Package Type 64A 64-Lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 64MC 64-lead (2-row Staggered), 7 x 7 x 1.0mm body, 4.0 x 4.0 mm Exposed Pad, Quad Flat No-Lead Package (QFN) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 11 8285ES–AVR–02/2013 3.3 ATmega325A Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel 5. See characterizations specifications at 105°C. Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega325A-AU ATmega325A-AUR(4) ATmega325A-MU ATmega325A-MUR(4) 64A 64A 64M1 64M1 Industrial (-40C to 85C) ATmega325A-AN ATmega325A-ANR(4) ATmega325A-MN ATmega325A-MNR(4) 64A 64A 64M1 64M1 Extended (-40C to 105C)(5) Package Type 64A 64-Lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 12 8285ES–AVR–02/2013 3.4 ATmega325PA Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel 5. See characterization specifications at 105°C. Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega325PA-AU ATmega325PA-AUR(4) ATmega325PA-MU ATmega325PA-MUR(4) 64A 64A 64M1 64M1 Industrial (-40C to 85C) ATmega325PA-AN ATmega325PA-ANR(4) ATmega325PA-MN ATmega325PA-MNR(4) 64A 64A 64M1 64M1 Extended (-40C to 105C)(5) Package Type 64A 64-Lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 13 8285ES–AVR–02/2013 3.5 ATmega3250A Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel 5. See characterization specifications at 105°C. Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega3250A-AU ATmega3250A-AUR(4) 100A 100A Industrial (-40C to 85C) ATmega3250A-AN ATmega3250A-ANR(4) 100A 100A Extended (-40C to 105C)(5) Package Type 100A 100-lead, 14 x 14 x 1.0mm, 0.5mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 14 8285ES–AVR–02/2013 3.6 ATmega3250PA Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel 5. See characterization specifications at 105°C. Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega3250PA-AU ATmega3250PA-AUR(4) 100A 100A Industrial (-40C to 85C) ATmega3250PA-AN ATmega3250PA-ANR(4) 100A 100A Extended (-40C to 105C)(5) Package Type 100A 100-lead, 14 x 14 x 1.0mm, 0.5mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 15 8285ES–AVR–02/2013 3.7 ATmega645A Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega645A-AU ATmega645A-AUR(4) ATmega645A-MU ATmega645A-MUR(4) 64A 64A 64M1 64M1 Industrial (-40C to 85C) Package Type 64A 64-Lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 16 8285ES–AVR–02/2013 3.8 ATmega645P Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega645P-AU ATmega645P-AUR(4) ATmega645P-MU ATmega645P-MUR(4) 64A 64A 64M1 64M1 Industrial (-40C to 85C) Package Type 64A 64-Lead, Thin (1.0mm) Plastic Gull Wing Quad Flat Package (TQFP) 64M1 64-pad, 9 x 9 x 1.0mm body, lead pitch 0.50mm, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 17 8285ES–AVR–02/2013 3.9 ATmega6450A Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega6450A-AU ATmega6450A-AUR(4) 100A 100A Industrial (-40C to 85C) Package Type 100A 100-lead, 14 x 14 x 1.0mm, 0.5mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 18 8285ES–AVR–02/2013 3.10 ATmega6450P Notes: 1. This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green. 3. For Speed vs. VCC, see Figure 28-1 on page 295. 4. Tape & Reel Speed (MHz)(3) Power Supply Ordering Code(2) Package(1) Operation Range 20 1.8 - 5.5V ATmega6450P-AU ATmega6450P-AUR(4) 100A 100A Industrial (-40C to 85C) Package Type 100A 100-lead, 14 x 14 x 1.0mm, 0.5mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 19 8285ES–AVR–02/2013 4. Packaging Information 4.1 64A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. REV. 64A, 64-lead, 14 x 14mm Body Size, 1.0mm Body Thickness, 0.8mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 64A C 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B COMMON DIMENSIONS (Unit of measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. REV. 64A, 64-lead, 14 x 14mm Body Size, 1.0mm Body Thickness, 0.8mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 64A C 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A2 A D1 D e E1 E B COMMON DIMENSIONS (Unit of measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1.This package conforms to JEDEC reference MS-026, Variation AEB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.30 – 0.45 C 0.09 – 0.20 L 0.45 – 0.75 e 0.80 TYP ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 20 8285ES–AVR–02/2013 4.2 64M1 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, H 64M1 2010-10-19 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 – 0.02 0.05 b 0.18 0.25 0.30 D D2 5.20 5.40 5.60 8.90 9.00 9.10 E 8.9 0 9.00 9.10 E2 5.20 5.40 5.60 e 0.50 BSC L 0.35 0.40 0.45 Notes: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD. 2. Dimension and tolerance conform to ASMEY14.5M-1994. TOP VIEW SIDE VIEW BOTTOM VIEW D E Marked Pin# 1 ID SEATING PLANE A1 C A 0.08 C 1 2 3 K 1.25 1.40 1.55 E2 D2 b e Pin #1 Corner L Pin #1 Triangle Pin #1 Chamfer (C 0.30) Option A Option B Pin #1 Notch (0.20 R) Option C K K 2325 Orchard Parkway 5.40 mm Exposed Pad, Micro Lead Frame Package (MLF) San Jose, CA 95131 TITLE DRAWING NO. R REV. 64M1, 64-pad, 9 x 9 x 1.0 mm Body, Lead Pitch 0.50 mm, H 64M1 2010-10-19 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 – 0.02 0.05 b 0.18 0.25 0.30 D D2 5.20 5.40 5.60 8.90 9.00 9.10 E 8.9 0 9.00 9.10 E2 5.20 5.40 5.60 e 0.50 BSC L 0.35 0.40 0.45 Notes: 1. JEDEC Standard MO-220, (SAW Singulation) Fig. 1, VMMD. 2. Dimension and tolerance conform to ASMEY14.5M-1994. TOP VIEW SIDE VIEW BOTTOM VIEW D E Marked Pin# 1 ID SEATING PLANE A1 C A 0.08 C 1 2 3 K 1.25 1.40 1.55 E2 D2 b e Pin #1 Corner L Pin #1 Triangle Pin #1 Chamfer (C 0.30) Option B Pin #1 Notch (0.20 R) Option C K K 5.40 mm Exposed Pad, Micro Lead Frame Package (MLF) ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 21 8285ES–AVR–02/2013 4.3 64MC TITLE GPC DRAWING NO. REV. Package Drawing Contact: packagedrawings@atmel.com ZXC 64MC A 64MC, 64QFN (2-Row Staggered), 7 x 7 x 1.00 mm Body, 4.0 x 4.0 mm Exposed Pad, Quad Flat No Lead Package 10/3/07 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A 0.80 0.90 1.00 A1 0.00 0.02 0.05 b 0.18 0.23 0.28 C 0.20 REF D 6.90 7.00 7.10 D2 3.95 4.00 4.05 E 6.90 7.00 7.10 E2 3.95 4.00 4.05 eT – 0.65 – eR – 0.65 – K 0.20 – – (REF) L 0.35 0.40 0.45 y 0.00 – 0.075 SIDE VIEW TOP VIEW BOTTOM VIEW Note: 1. The terminal #1 ID is a Laser-marked Feature. Pin 1 ID D E A1 A y C eT/2 R0.20 0.40 B1 A1 B30 A34 b A8 B7 eT D2 B16 A18 B22 A25 E2 K (0.1) REF B8 A9 (0.18) REF L B15 A17 L eR A26 B23 eT ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 22 8285ES–AVR–02/2013 4.4 100A 2325 Orchard Parkway San Jose, CA 95131 TITLE DRAWING NO. R REV. 100A, 100-lead, 14 x 14mm Body Size, 1.0mm Body Thickness, 0.5mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) 100A D 2010-10-20 PIN 1 IDENTIFIER 0°~7° PIN 1 L C A1 A2 A D1 D e E1 E B A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 15.75 16.00 16.25 D1 13.90 14.00 14.10 Note 2 E 15.75 16.00 16.25 E1 13.90 14.00 14.10 Note 2 B 0.17 – 0.27 C 0.09 – 0.20 L 0.45 – 0.75 e 0.50 TYP Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.08mm maximum. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE ATmega165A/PA/325A/PA/3250A/PA/645A/P/6450A/P [SUMMARY] 23 8285ES–AVR–02/2013 5. Errata 5.1 ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P Rev. G No known errata. 5.2 ATmega165A/165PA/325A/325PA/3250A/3250PA/645A/645P/6450A/6450P Rev. A to F Not sampled. Atmel Corporation 1600 Technology Drive San Jose, CA 95110 USA Tel: (+1) (408) 441-0311 Fax: (+1) (408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Roa Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan G.K. 16F Shin-Osaki Kangyo Bldg 1-6-4 Osaki, Shinagawa-ku Tokyo 141-0032 JAPAN Tel: (+81) (3) 6417-0300 Fax: (+81) (3) 6417-0370 © 2013 Atmel Corporation. All rights reserved. / Rev.: 8285ES–AVR–02/2013 Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 1. Product profile 1.1 General description PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. NPN complement: PBSS4160T. 1.2 Features Low collector-emitter saturation voltage VCEsat High collector current capability IC and ICM High efficiency due to less heat generation Reduces Printed-Circuit Board (PCB) area required Cost-effective replacement for medium power transistors BCP52 and BCX52 1.3 Applications Major application segments: Automotive Telecom infrastructure Industrial Power management: DC-to-DC conversion Supply line switching Peripheral driver: Driver in low supply voltage applications (e.g. lamps and LEDs) Inductive load drivers (e.g. relays, buzzers and motors) 1.4 Quick reference data [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor Rev. 04 — 15 January 2010 Product data sheet Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - −60 V IC collector current - - −1 A ICM peak collector current t = 1 ms or limited by Tj(max) - - −2 A RCEsat collector-emitter saturation resistance IC = −1 A; IB = −100 mA [1] - 220 330 mΩ PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 2 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor 2. Pinning information 3. Ordering information 4. Marking [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 2. Pinning Pin Description Simplified outline Graphic symbol 1 base 2 emitter 3 collector 1 2 3 006aab259 2 1 3 Table 3. Ordering information Type number Package Name Description Version PBSS5160T - plastic surface-mounted package; 3 leads SOT23 Table 4. Marking codes Type number Marking code[1] PBSS5160T *U6 Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - −80 V VCEO collector-emitter voltage open base - −60 V VEBO emitter-base voltage open collector - −5 V IC collector current [1] - −0.9 A [2] - −1 A ICM peak collector current t = 1 ms or limited by Tj(max) - −2 A IB base current - −300 mA IBM peak base current tp ≤ 300 μs; δ ≤ 0.02 - −1 A PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 3 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Operated under pulse conditions: duty cycle δ ≤ 20 %, pulse width tp ≤ 10 ms. Ptot total power dissipation Tamb ≤ 25 °C [1] - 270 mW [2] - 400 mW [1][3] - 1.25 W Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C (1) FR4 PCB, mounting pad for collector 1 cm2 (2) FR4 PCB, standard footprint Fig 1. Power derating curves Table 5. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit 0 40 80 160 Ptot (mW) (1) (2) 500 0 400 120 300 200 100 mle128 Tamb (°C) PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 4 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Operated under pulse conditions: duty cycle δ ≤ 20 %, pulse width tp ≤ 10 ms. Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1]- - 465 K/W [2]- - 312 K/W [1][3]- - 100 K/W FR4 PCB, standard footprint Fig 2. Transient thermal impedance as a function of pulse duration; typical values mle127 103 102 10 1 10−5 10−4 10−3 10−2 10−1 1 Zth (K/W) tp 10 10 (s) 2 103 δ = 1 0.75 0.33 0.05 0.02 0.01 0 0.5 0.2 0.1 PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 5 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor 7. Characteristics [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. Table 7. Characteristics Tamb = 25°C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = −60 V; IE = 0 A - - −100 nA VCB = −60 V; IE = 0 A; Tj = 150 °C - - −50 μA ICES collector-emitter cut-off current VCE = −60 V; VBE = 0 V - - −100 nA IEBO emitter-base cut-off current VEB = −5 V; IC = 0 A - - −100 nA hFE DC current gain VCE = −5 V IC = −1 mA 200 350 - IC = −500 mA [1] 150 250 - IC = −1 A [1] 100 160 - VCEsat collector-emitter saturation voltage IC = −100 mA; IB = −1 mA - −110 −160 mV IC = −500 mA; IB = −50 mA - −120 −175 mV IC = −1 A; IB = −100 mA [1] - −220 −330 mV RCEsat collector-emitter saturation resistance IC = −1 A; IB = −100 mA [1] - 220 330 mΩ VBEsat base-emitter saturation voltage IC = −1 A; IB = −50 mA - −0.95 −1.1 V VBEon base-emitter turn-on voltage VCE = −5 V; IC = −1 A - −0.82 −0.9 V fT transition frequency VCE = −10 V; IC = −50 mA; f = 100 MHz 150 220 - MHz Cc collector capacitance VCB = −10 V; IE = ie = 0 A; f = 1 MHz - 9 15 pF PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 6 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor VCE = −5 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Tamb = 25 °C Fig 3. DC current gain as a function of collector current; typical values Fig 4. Collector current as a function of collector-emitter voltage; typical values VCE = −5 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C IC/IB = 20 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig 5. Base-emitter voltage as a function of collector current; typical values Fig 6. Base-emitter saturation voltage as a function of collector current; typical values mle124 0 600 200 400 −10−1 −1 −10 IC (mA) hFE −102 −103 −104 (1) (2) (3) mle125 0 −5 −2 0 −0.4 −0.8 −1.2 −1.6 −1 VCE (V) IC (A) −2 −3 −4 −24 −28 −32 −36 −40 −12 −8 −16 −4 IB (mA) = − 20 mle122 0 −1.2 −0.4 −0.8 −10−1 −1 −10 IC (mA) VBE (V) −102 −103 −104 (1) (3) (2) −0.2 −1.2 −0.4 −0.6 −0.8 −1 mle123 −10−1 −1 (1) −10 IC (mA) VBEsat (V) −102 −103 −104 (3) (2) PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 7 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C IC/IB = 10 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values Tamb = 25 °C (1) IC/IB = 100 (2) IC/IB = 50 IC/IB = 20 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values Fig 10. Collector-emitter saturation resistance as a function of collector current; typical values mle126 −10 −1 −10−1 −10−2 −10−1 −1 −10 IC (mA) VCEsat (V) −102 −103 −104 (3) (2) (1) mle119 −1 −10−1 −10−2 −10−3 −10−1 −1 −10 IC (mA) VCEsat (V) −102 −103 −104 (3) (2) (1) mle120 −10 −1 −10−1 −10−2 −10−1 −1 −10 IC (mA) VCEsat (V) −102 −103 −104 (1) (2) mle121 103 102 1 10−1 10 −10−1 −1 RCEsat (Ω) IC (mA) −10 −102 −103 −104 (3) (1) (2) PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 8 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor 8. Package outline 9. Packing information [1] For further information and the availability of packing methods, see Section 12. Fig 11. Package outline SOT23 (TO-236AB) Dimensions in mm 04-11-04 0.45 0.15 1.9 1.1 0.9 3.0 2.8 2.5 2.1 1.4 1.2 0.48 0.38 0.15 0.09 1 2 3 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 3000 10000 PBSS5160T SOT23 4 mm pitch, 8 mm tape and reel -215 -235 PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 9 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PBSS5160T_4 20100115 Product data sheet - PBSS5160T_N_3 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Table 1 “Quick reference data”: amended • Section 4 “Marking”: amended • Figure 4: updated • Figure 11: superseded by minimized package outline drawing • Section 9 “Packing information”: added • Section 11 “Legal information”: updated PBSS5160T_N_3 20080718 Product data sheet - PBSS5160T_2 PBSS5160T_2 20040527 Product specification - PBSS5160T_1 PBSS5160T_1 20030623 Product specification - - PBSS5160T_4 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 04 — 15 January 2010 10 of 11 NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor 11. Legal information 11.1 Data sheet status [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 11.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. NXP Semiconductors PBSS5160T 60 V, 1 A PNP low VCEsat (BISS) transistor © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 January 2010 Document identifier: PBSS5160T_4 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Packing information . . . . . . . . . . . . . . . . . . . . . 8 10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 11.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Contact information. . . . . . . . . . . . . . . . . . . . . 10 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 OSLON SSL Ceramic package - 80° radiation pattern Lead (Pb) Free Product - RoHS Compliant Released 2011-12-23 1 Besondere Merkmale •Gehäusetyp: SMT-Keramikgehäuse mit Silikonverguss und Linse •Typischer Lichtstrom: 108 lm bei 350 mA und bis zu 185 lm bei 700 mA (4500 K) •Besonderheit des Bauteils: Kompakte Lichtquelle für platzsparende Designs •Farbtemperatur: 4000 K bis 5000 K •Farbwiedergabeindex: 70 (typ.) •Abstrahlwinkel: 80° •Typischer optischer Wirkungsgrad: 96 lm/W bei 350 mA (4500 K) •Gruppierungsparameter: Lichtstrom, Farbort, Durchlassspannung •Lötmethode: Reflow-Löten •Vorbehandlung: nach JEDEC Level 2 •Gurtung: 12-mm Gurt mit 600/Rolle, ø180 mm •ESD-Festigkeit: ESD-sicher bis 8 kV nach JESD22-A114-D •Erweiterte Korrosionsfestigkeit: Details siehe Seite 14 •Testergebnis zur Lichtstromerhaltung nach IESNA-LM-80 verfügbar Anwendungen •Industriebeleuchtung •Lampen- und Leuchten-Retrofits •Akzentbeleuchtung Features •package: SMT ceramic package with silicon resin with lens •typical Luminous Flux: 108 lm at 350 mA and up to 185 lm at 700 mA (4500 K) •feature of the device: small size high-flux LED for slim designs •typ. color temperature: 4000 K to 5000 K •color reproduction index: 70 (typ.) •viewing angle: 80° •typical optical efficiency: 96 lm/W at 350 mA (4500 K) •grouping parameter: luminous flux, color coordinates, forward voltage •soldering methods: reflow soldering •preconditioning: acc. to JEDEC Level 2 •taping: 12-mm tape with 600/reel, ø180 mm •ESD-withstand voltage: up to 8 kV acc. to JESD22-A114-D •Superior Corrosion Robustness: details see page 14 •Lumen maintanance test report according to IESNA LM-80 available • Applications •Industrial Lighting •LED retrofits & fixtures •Accent lights 2011-12-23 2 Released LCW CQ7P.PC Bestellinformation Ordering Information Typ Type Farb- temperatur color temperature Lichtstrom 1) Seite 21 Luminous Flux1) page 21 IF = 350 mA ΦV(lm) Lichtstärke 2) Seite 21 Luminous Intensity2) page 21 IF = 350 mA IV (cd) Bestellnummer Ordering Code LCW CQ7P.PC-KTLP-5L7N-1 LCW CQ7P.PC-KULQ-5L7N-1 4000 K )97.0... 121.0 104.2... 130.0 61.0 (typ.) 66.0 (typ.)) Q65111A1483 Q65111A1484 LCW CQ7P.PC-KTLP-5J7K-1 LCW CQ7P.PC-KULQ-5J7K-1 4500 K 97.0... 121.0 104.2... 130.0 61.0 (typ.) 66.0 (typ.) Q65111A1482 Q65111A1462 LCW CQ7P.PC-KTLP-5H7I-1 LCW CQ7P.PC-KULQ-5H7I-1 5000 K 97.0... 121.0 104.2... 130.0 61.0 (typ.) 66.0 (typ.) Q65111A1481 Q65111A1484 Released LCW CQ7P.PC 2011-12-23 3 Anm.:Die oben genannten Typbezeichnungen umfassen die bestellbaren Selektionen. Diese bestehen aus wenigen Helligkeitsgruppen (siehe Seite 9 für nähere Informationen). Es wird nur eine einzige Helligkeitsgruppe pro Gurt geliefert. Z.B.: LCW CQ7P.PC-KTLP-5L7N-1 bedeutet, dass auf dem Gurt nur eine der Helligkeitsgruppen KT, KU oder LP enthalten ist. Um die Liefersicherheit zu gewährleisten, können einzelne Helligkeitsgruppen nicht bestellt werden. Gleiches gilt für die Farben, bei denen Farbortgruppen gemessen und gruppiert werden. Pro Gurt wird nur eine Farbortgruppe geliefert. Z.B.: LCW CQ7P.PC-KTLP-5L7N-1 bedeutet, dass auf dem Gurt nur eine der Farbortgruppen -5L bis -7N enthalten ist (siehe Seite 6 für nähere Information). Um die Liefersicherheit zu gewährleisten, können einzelne Farbortgruppen nicht bestellt werden. Gleiches gilt für die LEDs, bei denen die Durchlassspannungsgruppen gemessen und gruppiert werden. Pro Gurt wird nur eine Durchlassspannungsgruppe geliefert. Z.B.: LCW CQ7P.PC-KTLP-5L7N-1 bedeutet, dass nach Durchlassspannung gruppiert wird. Auf einem Gurt ist nur eine der Durchlasspannungsgruppen -3, -4 oder -5 enthalten (siehe Seite 9 für nähere Information). Um die Liefersicherheit zu gewährleisten, können einzelne Durchlassspannungsgruppen nicht direkt bestellt werden. Note:The above Type Numbers represent the order groups which include only a few brightness groups (see page 9for explanation). Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). E.g.LCW CQ7P.PC-KTLP-5L7N-1 means that only one group KT, KU or LP will be shippable for any one reel. In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where chromaticity coordinate groups are measured and binned, single chromaticity coordinate groups will be shipped on any one reel. E.g. LCW CQ7P.PC-KTLP-5L7N-1 means that only 1 chromaticity coordinate group -5L to -7N will be shippable (see page 6 for explanation). In order to ensure availability, single chromaticity coordinate groups will not be orderable. In a similar manner for LED, where forward voltage groups are measured and binned, single forward voltage groups will be shipped on any one reel. E.g. LCW CQ7P.PC-KTLP-5L7N-1 means that only 1 forward voltage group -3, -4 or -5 will be shippable. In order to ensure availability, single forward voltage groups will not be orderable(see page 9 for explanation). 2011-12-23 4 Released LCW CQ7P.PC Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebstemperatur Operating temperature range Top – 40 … + 120 °C Lagertemperatur Storage temperature range Tstg – 40 … + 120 °C Sperrschichttemperatur Junction temperature Tj 135 °C Durchlassstrom(min.) Forward current(max.) (TS=25°C) IF IF 100800 mA mA Stoßstrom Surge current t ≤ 50 ms, D = 0.016, TS=25°C IFM 2000 mA Reverse Current* Sperrstrom*(max.) IR 200 mA * A minimum of 10 h of reverse operation is permissable in total. Eine Gesamtbetriebszeit von wenigstens 10 h in Sperrrichtung ist gewährleistet. Released LCW CQ7P.PC 2011-12-23 5 Kennwerte Characteristics (TS = 25 °C) Bezeichnung Parameter Symbol Symbol WertValue Einheit Unit Farbtemperatur 2) Seite 21)(min.) Color temperature 2) page 21 IF = 350mA (max.) T T 40005000 K K Abstrahlwinkel bei 50 % ΙV (Vollwinkel)(typ.) Viewing angle at 50 % ΙV 2ϕ 80 Grad deg. Durchlassspannung 4) Seite 21)(min.) Forward voltage4) page 21(typ.) IF = 350mA (max.) VF VF VF 2.753.23.5 V V V Reverse Voltage3) page 21) Sperrspannung 3) Seite 23 IR = 20 mA(max.) VR 1.2 V Wärmewiderstand Thermal resistance Sperrschicht/Lötpad(typ.) Junction/solder point(max.) Rth el JS Rth el JS 79.4* K/W K/W *Rth(max) basiert auf statistischen Werten Rth(max) is based on statistic values 2011-12-23 6 Released LCW CQ7P.PC Farbortgruppen3) Seite 21 Chromaticity Coordinate Groups3) page 21 OHA04564520530540550560570580590600610620630000.10.20.30.40.50.60.70.80.90.10.20.30.40.50.60.70.80.9510500490450CxCyCxE4804604700.330.340.350.360.370.380.390.400.410.290.300.310.320.330.340.350.360.370.380.390.400.410.420.430.444H5678IJKLMN456785000 K4500 K4000 KCy Released LCW CQ7P.PC 2011-12-23 7 Color temperature 4000 K Farbtemperatur 4000 K Gruppe Group Cx Cy Gruppe Group Cx Cy Gruppe Group Cx Cy 4L 0.365 0.348 4M 0.372 0.352 4N 0.379 0.356 0.367 0.358 0.375 0.362 0.382 0.367 0.375 0.362 0.382 0.367 0.390 0.372 0.372 0.352 0.379 0.356 0.386 0.361 5L 0.367 0.358 5M 0.375 0.362 5N 0.382 0.367 0.369 0.368 0.377 0.373 0.385 0.376 0.377 0.373 0.385 0.378 0.393 0.383 0.375 0.362 0.382 0.367 0.390 0.372 6L 0.369 0.368 6M 0.377 0.373 6N 0.385 0.378 0.371 0.378 0.380 0.383 0.388 0.388 0.380 0.383 0.388 0.388 0.397 0.393 0.377 0.373 0.385 0.376 0.393 0.383 7L 0.371 0.378 7M 0.380 0.383 7N 0.388 0.388 0.374 0.387 0.383 0.393 0.392 0.399 0.383 0.393 0.392 0.399 0.401 0.404 0.380 0.383 0.388 0.388 0.397 0.393 8L 0.374 0.387 8M 0.383 0.393 8N 0.392 0.399 0.376 0.397 0.385 0.403 0.395 0.409 0.385 0.403 0.395 0.409 0.404 0.415 0.383 0.393 0.392 0.399 0.401 0.404 Color temperature 4500 K Farbtemperatur 4500 K Gruppe Group Cx Cy Gruppe Group Cx Cy Gruppe Group Cx Cy 4J 0.350 0.337 8J 0.355 0.374 7K 0.363 0.371 0.351 0.347 0.356 0.383 0.364 0.381 0.359 0.352 0.366 0.390 0.374 0.387 0.357 0.343 0.364 0.381 0.371 0.378 5J 0.351 0.347 4K 0.357 0.343 8K 0.364 0.381 0.352 0.356 0.359 0.352 0.366 0.390 0.361 0.362 0.367 0.358 0.376 0.397 0.359 0.352 0.365 0.348 0.374 0.387 6J 0.352 0.356 5K 0.359 0.352 0.354 0.365 0.361 0.362 0.363 0.371 0.369 0.368 0.361 0.362 0.367 0.358 7J 0.354 0.365 6K 0.361 0.362 0.355 0.374 0.363 0.371 0.364 0.381 0.371 0.378 0.363 0.371 0.369 0.368 2011-12-23 8 Released LCW CQ7P.PC Color temperature 5000 K Farbtemperatur 5000 K Gruppe Group Cx Cy Gruppe Group Cx Cy Gruppe Group Cx Cy 4H 0.336 0.329 8H 0.338 0.362 7I 0.346 0.360 0.337 0.337 0.338 0.370 0.346 0.369 0.344 0.343 0.347 0.378 0.355 0.376 0.343 0.334 0.346 0.369 0.354 0.367 5H 0.337 0.337 4I 0.343 0.334 8I 0.346 0.369 0.337 0.345 0.344 0.343 0.347 0.378 0.345 0.352 0.352 0.349 0.356 0.385 0.344 0.343 0.350 0.340 0.355 0.376 6H 0.337 0.345 5I 0.344 0.343 0.337 0.353 0.345 0.352 0.346 0.360 0.353 0.358 0.345 0.352 0.352 0.349 7H 0.337 0.353 6I 0.345 0.352 0.338 0.362 0.346 0.360 0.346 0.369 0.354 0.367 0.346 0.360 0.353 0.358 Released LCW CQ7P.PC 2011-12-23 9 Durchlaßspannungsgruppen6) Seite 21 Forward Voltage Groups6) page 21 Gruppe Group DurchlaßspannungForward voltage Einheit Unit min. max. 3 2.75 3.0 V 4 3.0 3.25 V 5 3.25 3.5 V Helligkeits-Gruppierungsschema Brightness Groups Helligkeitsgruppe Brightness Group Lichtstrom1) Seite 21 Luminous Flux1) page 21 ΦV (lm) Lichtstärke2) Seite 21 Luminous Intensity2) page 21 IV (cd) KS KT KU LP LQ 89.2 ...97.0 97.0 ...104.2 104.2 ...112.0 112.0 ...121.0 121.0 ...130.0 52.0 (typ.) 56.0 (typ.) 61.0 (typ.) 66.0 (typ.) 70.0 (typ.) Anm.:Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Diese besteht aus nur wenigen Helligkeitsgruppen. Einzelne Helligkeitsgruppen sind nicht bestellbar. Note:The standard shipping format for serial types includes a family group of only a few individual brightness groups. Individual brightness groups cannot be ordered. Gruppenbezeichnung auf Etikett Group Name on Label Beispiel: KT-5L-3 Example: KT-5L-3 Helligkeitsgruppe Brightness Group Farbortgruppe Chromaticity Coordinate Group Durchlassspannung Forward Voltage KT 5L 3 Anm.:In einer Verpackungseinheit / Gurt ist immer nur eine Helligkeitsgruppe enthalten. Note:No packing unit / tape ever contains more than one brightness group. 2011-12-23 10 Released LCW CQ7P.PC Relative spektrale Emission2) Seite 21 Relative Spectral Emission2) page 21 V(λ) = spektrale Augenempfindlichkeit / Standard eye response curve Φrel = f (λ); TS = 25 °C; IF = 350 mA Abstrahlcharakteristik2) Seite 21 Radiation Characteristic2) page 21 Ιrel = f (ϕ); TS = 25 °C 04004020500600%8060relΦ100700nmλ800OHL04583λV OHL043250°20°40°60°80°100°120°0.40.60.81.0100°90°80°70°60°50°0°10°20°30°40°00.20.40.60.81.0ϕ Released LCW CQ7P.PC 2011-12-23 11 Durchlassstrom2) Seite 21 Forward Current2) page 21 IF = f (VF); TS = 25 °C Farbortverschiebung2) Seite 21 Chromaticity Coordinate Shift2) page 21 x, y = f (IF); TS = 25 °C Relative Lichtstrom2) Seite 21 Relative Luminous Flux2) page 21 ΦV/ΦV(350 mA) = f (IF); TS = 25 °C OHL04578FIVmA2.8FV3.03.23.43.63.8200400600800 -0.008OHL04579Cx, CyFICxCymA200400600800-0.006-0.004-0.00200.0020.006 OHL04581IFΦ(350 mA)VVΦ0mA2004006008000.51.01.52.0 Released LCW CQ7P.PC 2011-12-23 12 Relative Vorwärtsspannung2) Seite 21 Relative Forward Voltage2) page 21 ΔVF = VF - VF(25 °C) = f (Tj); IF = 350 mA Farbortverschiebung2) Seite 21 Chromaticity Coordinate Shift2) page 21 x, y = f (Tj); IF = 350 mA Relative Lichtstrom2) Seite 21 Relative Luminous Flux2) page 21 ΦV/ΦV(25 °C) = f (Tj); IF = 350 mA -40-0.3°CTjOHL04428VFVΔ-20020406080120-0.2-0.100.10.20.3 OHL04580Cx, Cy-40°CjT-200204060801200.30CyCx0.320.340.360.380.40 OHL04582-40°CjT-200204060801200VV(25 °C)ΦΦ0.20.40.60.81.2 Released LCW CQ7P.PC 2011-12-23 13 Maximal zulässiger Durchlassstrom Max. Permissible Forward Current IF = f (TS) Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TS = 25 °C Zulässige Impulsbelastbarkeit IF = f (tp) Permissible Pulse Handling Capability Duty cycle D = parameter, TS = 85 °C 020406080100120140TS [°C]0100200300400500600700800ΙF [mA]Do not use current below 100 mA 10100-2-3-4-5101010FIAPt=DT210-110tp10s10OHL04611TtPIF0.050.20.10.510.020.01D0.20.40.60.81.01.21.41.61.82.20.005= 10100-2-3-4-5101010FIAPt=DT210-110tp10s10OHL04611TtPIF0.050.20.10.510.020.01D0.20.40.60.81.01.21.41.61.82.20.005= 2011-12-23 14 Released LCW CQ7P.PC Maßzeichnung5) Seite 21 Package Outlines5) page 21 Anm.:Die LED enthält ein ESD-Bauteil, das parallel zum Chip geschalten ist. Note:LED is protected by ESD device which is connected in parallel to LED-Chip. Anm.:Das Gehäuse ist für Ultraschallreinigung nicht geeignet Note:Package not suitable for ultra sonic cleaning Kathodenkennung:Markierung Cathode mark:mark Gewicht / Approx. weight:2.5 mg Korrosionsfestigkeit besser als EN 60068-2-60 (method 4): mit erweitertem Korrosionstest: 40°C / 90%rh / 15ppm H2S / 336h Corrosion robustness better than EN 60068-2-60 (method 4): with enhanced corrosion test: 40°C / 90%rh / 15ppm H2S / 336h Released LCW CQ7P.PC 2011-12-23 15 Gurtung / Polarität und Lage5) Seite 21Verpackungseinheit 600/Rolle, ø180 mm Method of Taping / Polarity and Orientation5) page 21Packing unit 600/reel, ø180 mm 2011-12-23 16 Released LCW CQ7P.PC Empfohlenes Lötpaddesign5) Seite 21 Reflow Löten Recommended Solder Pad5) page 21 Reflow Soldering Anm.:Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- stickstoffatmosphäre zu löten. Weitere Informationen finden Sie in der Applikationsschrift „Handling and Processing Details for Ceramic LEDs“ Note:For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. For further information please refer to our Application Note „Handling and Processing Details for Ceramic LEDs“ Released LCW CQ7P.PC 2011-12-23 17 LötbedingungenVorbehandlung nach JEDEC Level 2 Soldering ConditionsPreconditioning acc. to JEDEC Level 2 Reflow Lötprofil für bleifreies Löten(nach J-STD-020D.01) Reflow Soldering Profile for lead free soldering(acc. to J-STD-020D.01) Profile Feature Pb-Free (SnAgCu) Assembly Recommendation Max. Ratings Ramp-up Rate to Preheat*) 25°C to 150°C 2 K / s 3 K/ s Time ts from TSmin to TSmax (150°C to 200°C 100 s min. 60 s max. 120 s Ramp-up Rate to Peak*) 180°C to TP 2 K / s 3 K / s Liquidus Temperature TL 217°C Time tL above TL 80 s max. 100 s Peak Temperature TP 245 °C max. 260 °C Time tP within 5°C of the specified peak temperature TP - 5K 20 s min. 10 s max. 30 s Ramp-down Rate* TP to 100°C 3 K / s 6 K / s maximum Time 25°C to Peak temperature max. 8 min. All temperatures refer to the center of the package, measured on the top of the component * slope calculation ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range 00sOHA045255010015020025030050100150200250300tT°CSttPtTp240 °C217 °C245 °C25 °CL 2011-12-23 18 Released LCW CQ7P.PC Barcode-Produkt-Etikett (BPL) Barcode-Product-Label (BPL) Gurtverpackung Tape and Reel Tape dimensions in mm (inch) W P0 P1 P2 D0 E F 4 ± 0.1 (0.157 ± 0.004) 8 ± 0.1 (0.315 ± 0.004) 2 ± 0.05 (0.079 ± 0.002) 1.5 + 0.1 (0.059 + 0.004) 1.75 ± 0.1 (0.069 ± 0.004) 5.5 ± 0.05 (0.217 ± 0.002) Reel dimensions in mm (inch) A W Nmin W1 W2 max 180 (7) 12 (0.472) 60 (2.362) 12.4 + 2 (0.488 + 0.079) 18.4 (0.724) OHA04563(G) GROUP:1234567890(1T) LOT NO:(9D) D/C:1234(X) PROD NO:123456789(6P) BATCH NO:1234567890LX XXXXRoHS CompliantBIN1: XX-XX-X-XXX-XML2Temp ST260 °C RPack: R18DEMY 022B_R999_1880.1642 R9999(Q)QTY:SemiconductorsOSRAM OptoXX-XX-X-X D02PP01PWFEDirection of unreelingNW12WAOHAY0324LabelGurtvorlauf:Leader:Trailer:Gurtende:13.0Direction of unreeling±0.25160 mm160 mm400 mm400 mm 12+ 0.3– 0.1 Released LCW CQ7P.PC 2011-12-23 19 Trockenverpackung und Materialien Dry Packing Process and Materials Anm.:Feuchteempfindliche Produkte sind verpackt in einem Trockenbeutel zusammen mit einem Trockenmittel und einer Feuchteindikatorkarte Bezüglich Trockenverpackung finden Sie weitere Hinweise im Internet und in unserem Short Form Catalog im Kapitel “Gurtung und Verpackung” unter dem Punkt “Trockenverpackung”. Hier sind Normenbezüge, unter anderem ein Auszug der JEDEC-Norm, enthalten. Note:Moisture-sensitve product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet and in the Short Form Catalog in chapter “Tape and Reel” under the topic “Dry Pack”. Here you will also find the normative references like JEDEC. Kartonverpackung und Materialien Transportation Packing and Materials Dimensions of transportation box in mm (inch) Breite / Width Länge / length Höhe / height 200 ±5 (7,874 ±0,1968) 200 ±5 (7,874 ±0,1968) 30 ±5 (1,1811 ±0,1968) OHA00539OSRAMMoisture-sensitive label or printBarcode labelDesiccantHumidity indicatorBarcode labelOSRAMPlease check the HIC immidiately afterbag opening.Discard if circles overrun.Avoid metal contact.WETDo not eat.Comparatorcheck dotparts still adequately dry.examine units, if necessaryexamine units, if necessary5%15%10%bake unitsbake unitsIf wet,change desiccantIf wet,Humidity IndicatorMIL-I-8835If wet,Moisture Level 3Floor time 168 HoursMoisture Level6Floor time 6 Hoursa) Humidity Indicator Card is > 10% when read at 23 °C ± 5 °C,orreflow, vapor-phasereflow, or equivalent processing (peak package2. After this bag is opened,devicesthat will be subjected to infrared1. Shelflife in sealed bag: 24 months at < 40 °C and < 90% relative humidity (RH).Moisture Level 5aat factory conditions of(if blank, sealdate isidentical with date code).a)Mounted withinb) Stored atbody temp.3.Devicesrequire baking, before mounting, if:BagsealdateMoisture Level1MoistureLevel2Moisture Level 2a4. If bakingis required, b) 2aor2b isnot met.Date and time opened:reference IPC/JEDEC J-STD-033 for bake procedure.Floortime see belowIfblank, see bar code labelFloor time > 1 YearFloor time 1 YearFloortime 4 Weeks10% RH._
This Molex product is manufactured from material that has the following ratings, tested by independent agencies:. a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with the requirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire.
The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s).
If it is determined during
the customer’s evaluation of suitability, that higher
performance is required, please contact Molex for
possible product options."
Overview Sabre™ Power Connector
Product Literature Order No 987650-5662
Product Name Sabre™
UPC 800754378185
Physical
Breakaway No
Circuits (Loaded) 2
Circuits (maximum) 2
Color - Resin Black
Durability (mating cycles max) 25
First Mate / Last Break No
Flammability 94V-0
Glow-Wire Compliant Yes
Guide to Mating Part No
Keying to Mating Part Yes
Series
image - Reference only
EU RoHS China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Low-Halogen Status
Not Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
43160Series
Mates With
44441-2002 Sabre™ Receptacle Housing
Lock to Mating Part Yes
Material - Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin High Temperature Thermoplastic
Net Weight 3.331/g
Number of Rows 1
Orientation Right Angle
PC Tail Length 3.81mm
PCB Locator Yes
PCB Retention Yes
PCB Thickness - Recommended 1.60mm
Packaging Type Tray
Pitch - Mating Interface 7.50mm
Pitch - Termination Interface 7.50mm
Plating min - Mating 0.889μm
Plating min - Termination 0.889μm
Polarized to Mating Part Yes
Polarized to PCB Yes
Shrouded Fully
Stackable No
Surface Mount Compatible (SMC) No
Temperature Range - Operating -40°C to +75°C
Termination Interface: Style Through Hole
Electrical
Current - Maximum per Contact 18A
Voltage - Maximum 600V
Solder Process Data
Duration at Max. Process Temperature (seconds) 5
Lead-free Process Capability Wave Capable (TH only)
Max. Cycles at Max. Process Temperature 1
Process Temperature max. C 235
Material Info
Reference - Drawing Numbers
Product Specification PSX-44441-9999
Sales Drawing SDA-43160-****
This document was generated on 01/08/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
This document was generated on 01/06/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number: 39-00-0038
Status: Active
Overview: Mini-Fit Jr.™ Power Connectors
Description: Mini-Fit® Female Crimp Terminal, Tin (Sn) over Copper (Cu) Plated Brass, 18-24
AWG, Reel
Documents:
Drawing (PDF) Product Specification PS-52034-003 (PDF)
Product Specification PS-51010-005 (PDF) Product Specification PS-52034-004 (PDF)
Product Specification PS-51010-006 (PDF) Product Specification PS-5556-001 (PDF)
Product Specification PS-51045-001 (PDF) Product Specification PS-5556-002 (PDF)
Product Specification PS-51045-002 (PDF) Packaging Specification PK-5556-001 (PDF)
Product Specification PS-51045-004 (PDF) Test Summary TS-5556-002 (PDF)
Product Specification PS-51096-001 (PDF) RoHS Certificate of Compliance (PDF)
General
Product Family Crimp Terminals
Series 5556
Application Power
Crimp Quality Equipment Yes
Overview Mini-Fit Jr.™ Power Connectors
Packaging Alternative 39-00-0039 (Loose)
Product Name Mini-Fit®
UPC 800753585010
Physical
Durability (mating cycles max) 30
Gender Receptacle
Material - Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Net Weight 0.130/g
Packaging Type Reel
Plating min - Mating 0.889μm
Plating min - Termination 0.889μm
Termination Interface: Style Crimp or Compression
Wire Insulation Diameter 1.30-3.10mm
Wire Size AWG 18, 20, 22, 24
Wire Size mm² N/A
Electrical
Current - Maximum per Contact 9A
Voltage - Maximum 600V
Material Info
Old Part Number 5556T
Reference - Drawing Numbers
Packaging Specification PK-5556-001
Product Specification PS-51010-005, PS-51010-006, PS-51045-001,
PS-51045-002, PS-51045-004, PS-51096-001,
PS-52034-003, PS-52034-004, PS-5556-001,
PS-5556-002, RPS-30067-001, RPS-30067-002,
RPS-42474-001, RPS-51045-001, RPS-5557-008,
RPS-5557-024, RPS-5557-031, RPS-5557-036,
RPS-5557-037, RPS-5557-045, RPS-5557-046,
RPS-5566-002
Series
image - Reference only
EU RoHS China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Low-Halogen Status
Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
5556Series
Mates With
5558 Mini-Fit® Crimp Male Terminals. Mini-
Fit Jr.™ Header, Dual Row, 5566 , 5569
Use With
5557 Mini-Fit Jr.™ Receptacle Housing,
30067 Mini-Fit® TPA, 42474 Mini-Fit®
BMI Panel Mount, 5559 Mini-Fit Jr.™ Plug
Housing, Dual Row
Application Tooling | FAQ
Tooling specifications and manuals are
found by selecting the products below.
Crimp Height Specifications are then
contained in the Application Tooling
Specification document.
Global
Description Product #
FineAdjust™
Applicator for
Insulation OD
0639023900
Sales Drawing SD-5556****
Test Summary TS-5556-002
1.40-1.70mm - 18-24
AWG
Extraction Tool 0011030044
Hand Crimp Tool for
Male and Female
Crimp Terminals,
16-24 AWG Wire
0638190900
FineAdjust™
Applicator for
Insulation OD
2.50-2.95mm - 18-24
AWG
0639002600
FineAdjust™
Applicator for
Insulation OD
1.65-2.05mm - 18-24
AWG
0639002900
FineAdjust™
Applicator for
Insulation OD
1.90-2.30mm - 18-24
AWG
0639015600
FineAdjust™
Applicator for
Insulation OD
2.50-2.95mm
Optimized for 18
AWG Only
0639024800
FineAdjust™
Applicator for
Insulation OD
2.30-2.60mm - 18-24
AWG
0639024900
T2 Terminator™
for insulation OD
2.50-2.95mm - 18-24
AWG
0639102600
T2 Terminator™ for
insulation OD 1.65
– 2.05mm – 18 – 24
AWG
0639102900
T2 Terminator™
for insulation OD
1.90-2.30mm - 18-24
AWG
0639115600
T2 Terminator™
for insulation OD
1.40-1.70mm - 18-24
AWG
0639123900
T2 Terminator™
for insulation OD
2.50-2.95mm
optimized for 18
AWG only
0639124800
T2 Terminator™
for insulation OD
2.30-2.60mm - 18-24
AWG
0639124900
Japan
Description Product #
Applicator for M211A
Bench Press, 18-24
AWG Wire
0570223000
Side-Feed Applicator
For Full-Auto
Machine
0570223200
Hand Extraction Tool 0570316000
This document was generated on 01/06/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
For more complete information on any product, please visit our web site: www.aimtti.com
Measurably better value manual & bus programmable - Laboratory Power Supplies
Mixed-mode Regulation
Mixed-mode regulation with linear output stage
4 digit voltage and current meters on each output *
Constant voltage or constant current operation
Variable auxiliary output (1.5-5V@5A) on triple model
Switched remote sensing (not EX355P or EX752M)
Silent fan-free cooling **
DC output switches
Compact bench power supplies
Single, dual or triple outputs
Mixed-mode regulation
Power from 175W to 420W
Switched remote sense terminals
RS-232 interface model available
EX-R series
Model Outputs Voltage / Current Power Interfaces
EX355R One 0 to 35V / 0 to 5A 175W -
EX355P One 0 to 35V / 0 to 5A 175W RS232
EX355P-USB One 0 to 35V / 0 to 5A 175W USB
EX1810R One 0 to 18V / 0 to 10A 180W -
EX2020R One 0 to 20V / 0 to 20A 400W -
EX4210R One 0 to 42V / 0 to 10A 420W -
EX354RD Two 2 x (0 to 35V / 0 to 4A) 280W -
EX354RT Three 2 x (0 to 35V / 0 to 4A)
plus 1.5 to 5.0V @ 5A
305W
EX752M Two 2 x (0 to 75V / 0 to 2A)
or 0 to 75V / 0 to 4A
or 0 to 150V / 0 to 2A
300W
Brief specifications for main outputs:
Line & load regulation: <0.01%. Output noise: < 2mV rms.
Meter accuracies: voltage - 0.3% ± 1digit, current - 0.6% ± 1digit.
Sizes: singles - 140 x 160 x 295mm; dual/triple - 260 x 160 x 295mm (WxHxD)
The EX752M is a dual output 300
watt PSU with Multi-Mode capability.
This enables it to operate as a dual
power supply with two independent and
isolated outputs, or as a single power
supply of double the power.
As a dual, each output provides 0 to
75V at 0 to 2A (mode A). As a single,
the output can be selected as either 0
to 75V at 0 to 4A (mode B) or 0 to 150V
at 0 to 2A (mode C). In single modes,
the unused half of the unit becomes
completely inoperative and its displays
are blanked.
For those requiring a basic bus
controllable power supply, versions with
an RS-232 interface (EL302P) or a USB
interface (EL302P-USB) are available.
The EX series is the value-for-money
PSU for users who require higher power
levels. Mixed-mode regulation gives
excellent performance combined with
compact size and low weight.
Dual output and triple output models
are available in a similar casing style.
The EX354RT triple (illustrated) has a
variable voltage auxiliary output which
can be set using the digital displays.
** Note that the EX2020R and
EX4210R use fan assisted cooling.
All-linear regulation becomes impractical at higher
power levels, so Aim-TTi have developed a technology
that combines HF switch-mode pre-regulation with
linear final regulation.
This technique combines exceptional efficiency with
noise levels that are close to that of pure linears.
Mixed-mode regulation is used in the EX-R and TSX
series.
* Note that 3 digit current meters
are used on the EX355P and
EX752M and that voltmeter resolution
on the EX752M is 0.1V.
* Note that a 3 digit current
meters is used on the EL302P
& EL302P-USB, and that these
models do not have remote
sense terminals.
http://www.farnell.com/datasheets/1796748.pdf
SS-331
LCD Desoldering Station
User’s Manual
1st Edition,
©2014 Copyright by Prokit’s Industries Co., Ltd.
1
Description
SS‐331 designed for lead free desoldering especially. The quick heating and strong power are for convenient and clear soldering / desoldering all types of DIP components.
Reasonable structure, single hand operation and strong absorbing power can be easy removal of the residual solder from the one‐sided or two sided of the PCB.
This tool is used in the fields of electronic research, teaching and production, especially in the repairing and desoldering on the electronic appliances and communication equipments.
1.
Control Unit
The desoldering iron gun is controlled automatically by the micro‐processor. The digital control electronics and high‐quality sensor and heat exchange system guarantee precise temperature control at the soldering tip. The highest degree of temperature precision and optimal dynamic thermal behavior under load conditions is obtained by the quick and accurate recording of the measured values in a closed control circuit, and this design is especially for the lead‐free production techniques.
2.
Desoldering Iron gun
Desoldering iron gun with a power of 60W（Heat up rating 130W）and a wide spectrum of soldering tips can be used anywhere in the electronics field.
The high power and gun type design make this iron gun suitable for fine desoldering work. The heating element is made of ceramic and the sensor on the desoldering tip can control the desoldering temperature quickly and accurately.
2
Technical Specification
Voltage
220~240V AC
Power Consumption
140W
Temperature
160°C ~ 480°C
Vacuum Pressure
600mm Hg
Heating Element
Ceramic Heater
Accessories
Spare tip x 3 ( 0.8(on the gun)1.0/ 1.3mm) Cleaning tool x 3 (0.7/0.9/ 1.2mm) Filter sponge x 4 (φ20.8x1 +φ16.8x3)
Certificate
CE, GS, RoHS
Station Size (mm)
225 x 160 x 130
Weight (kgs)
2.5
Operating Instruction
Caution：Make sure that the four screws which are used to fasten the Diaphragm pump are removed from the control system before use. Otherwise serious damages may be caused to the user and the system.
1.
Place the desoldering iron gun in the holder separately. Then connect the plug to the receptacle on the station and turn clockwise to tighten the plug nut. Check that the power supply is corresponding to the specification on the type plate and the power switch is on the “OFF” position. Connect the control unit to the power supply and switch on the power. Then a self‐test is carried out in which all display elements are switched on briefly. The electronic system then switches on automatically to the set temperature and displays this value.
2.
The display and temperature setting
①.
Shows the actual temperature of the desoldering tip.
②.
Shows the setting temperature: Pressing the “UP” or “DOWN” button can switch the digital display to the set point display. The set‐point can be changed for ±1℃ by tapping the “UP” or “DOWN” button. Pressing the button will change the set‐point quickly. The digital display will return automatically to the actual value and the iron will reach to the setting temperature quickly.
③.
℃/℉ display: Switching the temperature display from ℃ to ℉ by pressing the “℃/℉”button and then the electronic system will display the actual temperature① and setting temperature② in ℉, and vice versa.
④.
When the actual temperature on the soldering tip is less than the set‐point, “HEAT ON” will display and make the desoldering tip heating up.
⑤.
When the absolute offset is more than ±10℃ between the actual temperature and the set‐point on the soldering tip or the nozzle, “WAIT” will display. It means that the temperature electronic control system is not in the stable situation, we should wait a moment to let the “WAIT” disappear.
⑥.
When “ERROR” display, there may be a trouble on the 3
4
Safety Instruction
1.
The manufacturer assumes no liability for uses other than those described in the operating instructions or for unauthorized alterations.
2.
The operating instructions and cautions should be read carefully and kept in an easily visible location in the vicinity of the control system. Non‐observance of the cautions will result in accidents, injury or risks to health.
Caution
1.
The power cord only can be inserted in approved power sockets or adapters.
2.
High Temperature
The temperature of the soldering tip will reach as high as around 400℃（752℉） when the power switch is on. Since mishandling may lead to burns and fire, be sure to comply with the following precautions:
①.
Do not touch metallic parts near the soldering tip/ nozzle.
②.
Do not use this system near the flammable items.
③.
Advise other people in the work area that the unit can reach a very high temperature and should be considered potentially dangerous.
④.
Turn off the power switch while taking breaks and when finishing using.
⑤.
Before replacing parts or storing the system, turn off the power and let it cool down to the room temperature.
⑥.
Warning: this tool must be placed on its stand when not in use.
5
⑦.
A fire may result if the appliance is not used with care, therefore:
1)
Be careful when using the appliance in places where there is combustible material.
2)
Do not apply to the same place for a long time.
3)
Do not use in presence of an explosive atmosphere.
4)
Be aware heat may be conducted to combustible materials that out of sight.
5)
Place the appliance on its stand after use and allow it to cool down before storage.
6)
Do not leave the appliance unattended when it is switched on.
3.
Take care of your tools
Do not use the tools for any applications other than soldering or desoldering.
Do not rap the iron against the work bench or otherwise subject the iron to severe shocks.
Do not file the soldering tip to remove the oxide, please wipe the tip on the cleaning sponge.
Use only accessories or attachments which are listed in the operation manual. Use of other tools and other accessories can lead to a danger of injury.
Please turn off the power before connecting or disconnecting the soldering iron.
4.
Maintenance
Before further use, safety devices or slightly damaged parts must be carefully checked for error‐free and intended operation. Inspect moving parts for error‐free operation and that they don’t bind, or whether any parts are damaged. Damaged safety devices and parts must be repaired or replaced by a qualified technician, so long as nothing else is indicated in the operation manual. Use only accessories or
6
attachments which are listed in the operation manual. Use of other tools and other accessories can lead to a danger of injury.
5.
Keep children at a distance
Warning: this appliance is not intended for use by young children and infirm persons unless they have been adequately supervised by a responsible person to ensure that they can use the appliance safely.
Warning: Young children should be supervised to ensure that they do not play with the appliance.
Unused soldering tools should be stored in a dry location which is out of the reach of children. Switch off all unused soldering tools.
6.
Protect yourself against electrical shocks
Avoid touching grounded parts with your body, e.g. pipes, heating radiators and so on. The grip of antistatic designed soldering tool is conductive.
7.
Work environment
Do not use the soldering tool in a moist or wet environment. The soldering iron should be placed on the holder after finished using.
8.
Observe the valid safety regulations at your work place.
SS-331數顯吸焊台
概述
SS-331 特別為無鉛吸焊而設計。快速升溫和大功率的特點使其可以方便快速的焊接/拆焊所有類型的DIP元器件。
合理的結構，單手操作和強大的吸焊功率能夠輕鬆的從PCB一面或兩面除去殘餘錫渣。
目前已廣泛的應用於電子科研，教學以及生產等單位，特別是家電維修和通訊器材維修人員所不可缺少的首選專用工具。
1.
控制單元
吸焊槍由微處理器自動控制。數位控制裝置和高品質的感測器及加熱交換系統保證對烙鐵頭的溫度進行精確的控制。通過快速準確的記錄閉和控制回路測量可以獲得作高的溫度精度和帶負載狀況下最佳熱量轉遞性能，特別適合用於無鉛制程工藝。
2.
吸焊槍 (5SS-331-DG)
吸焊槍的功率為 60W（額定加熱功率 130W），可以配各種尺寸的烙鐵頭（U系列），廣泛應用於電子領域。
大功率和細長外形設計使這個電烙鐵適合做精密的焊接操作，發熱芯採用陶瓷發熱材料製作，頂端溫度感測器設計其特點在於能夠快速並準確的控制焊接溫度。
7
技術規範.
電壓
220~240V AC
消耗功率
140W
溫度
160°C ~ 480°C
真空吸力
600mm Hg
發熱原件
陶磁發熱芯
配件
吸嘴 x 3(0.8(裝在吸槍上)1.0/ 1.3mm) 通針 x 3( 0.7/ 0.9/ 1.2mm) 過濾棉 x 4 ( 20.8mm x1 + 16.8mm x3)
認證
CE, GS, RoHS
尺寸(mm)
225 x 160 x 130
重量(kgs )
2.5
操作說明：
1
將吸焊槍放置在支架上。然後將插頭插入插座順時針方向鎖緊螺母。檢查供電電源符合本產品的規格並確認總電源開關處於OFF的位置。接通控制系統的電源並打開電源開關。系統進行自檢，所有的液晶顯示都暫時被點亮。電子系統自動打開並迅速達到設定的溫度值。
2
顯示幕和溫度設置：
數位顯示說明：
①
. 顯示吸焊烙鐵頭的實際溫度。
8
9
②
. 顯示的是設定溫度，通過按“UP＂或“DOWN＂鍵來改變設定值。輕壓單下“UP＂或“DOWN＂鍵設定值將以±1℃變化，持續按下“UP＂或“DOWN＂鍵設定值將會快速改變。改變設定值後，電子系統自動工作，顯示溫度會迅速到達設定值。
③
. ℃或℉溫度，通過按“℃/℉＂按鈕切換攝氏或華氏溫度，切換後電子系統會自動顯示的攝氏或華氏實際溫度①和設定溫度②數值。
④
. 當烙鐵頭實際溫度小於設定溫度時顯示“HEAT ON＂表示電子系統對烙鐵正在加熱。
⑤
. 當烙鐵頭實際溫度與設定溫度的絕對偏差大於±10℃時顯示“WAIT＂，表示電子控溫系統還沒到達穩定狀態，請稍做等待，待“WAIT＂不顯示時即可正常使用了。
⑥
. 顯示“---＂則表示系統有故障，或者是電烙鐵沒有正確連接到控制系統。
3
安全操作說明
3.1
製造商對於超出操作說明中所到的其他使用或未經授權的更改，不負任何責任。
3.2
應仔細閱讀操作說明及警告並將其放置在控制系統附近，如不遵守這些警告，將有可能發生意外事故，人體傷害或健康傷害。
4
警告及注意事項
4.1
電源線只能插入經認證過的電源插座或適配器中。
4.2
小心高溫:在開機狀態下，烙鐵頭或熱風槍焊嘴的溫度可以達到大約400℃（752℉）左右，由於不正確的操作可能會造成燒傷或引起火災，故應確保遵守以下預防措施：
不要讓金屬部件接觸到焊嘴和烙鐵頭；
不要在易燃物品附近使用該系統；
告知工作區域中的其他人員此設備會達到非常高的溫度應注意識別其潛在的危險性；
在休息及使用完後應關閉總電源
在更換零件或儲存前，應關閉總電源並讓其冷卻到
10
室溫
警告：不用時一定要將此工具放置在特定的支架上。
如使用不當可能會引起火災，因此
在有易燃物品的場所使用該設備一定要小心；
不要長時間在同一位置使用該設備；
不要在有爆炸性氣體的場所使用；
要知道熱量有可能會引燃不在視線範圍內的可燃物質；
使用完畢後要將器具放置在特定的支架上，且要在冷卻後方可收藏起來;
離開時必須要關閉電源開關。
4.3
愛護工具
不要將此設備用於焊接或脫焊以外的其他操作。
不要在工作臺上敲打電烙鐵或熱風筒或其他嚴重的撞擊。
不要銼烙鐵頭上的氧化層，請使用浸水的清潔棉擦除氧化層。
確保使用操作說明上列明的附件或配件，使用其他的工具或其他配件使本系統損壞或會有受傷的危險。
在接通或斷開錫槍前應先關閉電源。
4.4
工具保養 在使用前，應仔細檢查安全裝置或有輕微損害的零件無故障及在指定操作狀態。檢查活動的零件無故障操作，並且沒有繞線及零件損壞。已損壞的安全設備及零件都應由有資格的專業人員進行維修或更換。只使用操作說明中列出的配件。如果使用其他工具或配件有可能對操作人員造成傷害。
4.5
放置在兒童接觸不到的地方 警告：老人和兒童必須在監護人在場確保可安全使用的情況下方可使用該設備。警告：應確保兒童在沒有監護的情況下無法接觸到該設
備。
4.6
不用的焊接工具應存放在乾燥的，兒童接觸不到的地方。而且應該關閉所有未在使用狀態下的焊接工具的電源。
4.7
避免遭受電擊 避免用身體接觸接地零件，如：烙鐵管，散熱器等。抗靜電設計的焊接工具的把手是導電的。
4.8
工作環境 不要在潮濕的環境中使用焊接工具。電烙鐵及熱風槍用完後要放回到支架上。
4.9
遵守工作場所中的安全操作規定。
寶工實業股份有限公司
PROKIT’S INDUSTRIES CO., LTD.
http://www.prokits.com.tw
E-mail:pk@mail.prokits.com.tw
©2014 Prokit’s Industries Co., LTD. All rights reserved 2014001(C)
Connections to a Wider Range of Slaves Ensured by Upgraded Models
Master Conventional
models
New models
C200HW-SRM21
CQM1-SRM21
SRM1-C01
SRM1-C02
SRM1-C01-V1
SRM1-C02-V1
3G8B3-SRM00
3G8B3-SRM01
C200PC-ISA02-SRM
C200PC-ISA12-SRM
C200HW-SRM21-V1
CQM1-SRM21-V1
SRM1-C01-V2
SRM1-C02-V2
NKE-made Uniwire
C B /SS d
Communications mode
Slave
ade U e
CompoBus/S Send
Unit SDD-CS1
High-speed
communications
mode
Long-distance
communications
mode
SRT1 Series
FND-X-SRT
Yes
Yes
Yes
Yes
No
No
Products
from other
companies
SMC Solenoid valve
for SI manifold
use
VQ Series
SX Series
SY Series
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
CKD Solenoid valve
for saving wiring
effort
4TB1 and 4TB2 Series
4TB3 and 4TB4 Series
4G Series
MN4SO Series
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
No
Koganei Valve for saving
wiring effort
YS1A1, A2
YS2A1, A2
Yes
Yes
Yes
Yes
No
No
New product SRT2-AD02
SRT2-DA02
No
No
Yes
Yes
Yes
Yes
SRT2-VID08S(-1)
SRT2-VOD08S(-1)
SRT2-VID16ML(-1)
SRT2-VOD16ML(-1)
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
SRT2-ID16(-1)
SRT2-OD16(-1)
SRT2-ID08(-1)
SRT2-OD08(-1)
SRT2-ROC16
SRT2-ROF16
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
CPM1A-SRT21 Yes Yes Yes
Products to be released soon SRT2-ID04(-1)
SRT2-OD04(-1)
SRT2-ID16T(-1)
SRT2-OD16T(-1)
SRT2-MD16T(-1)
SRT2-ROC08
SRT2-ROF08
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Note: 1. In high-speed communications mode, the maximum transmission distance is 100 m at a baud rate of 750 kbps. In long-distance
communications mode (i.e., a newly available mode), the maximum transmission distance is 500 m at a baud rate of 93.75 kbps.
2. The SRT2-AD04 and SRT2-DA02 are available for 16-bit synchronous communications.
11
Master Control Unit SRM1-C01-V2/C02-V2
Subminiature, Stand-alone Model with
CompoBus/S Master and SYSMAC
Controller Functions
Maximum number of Remote I/O points per Master:
256
Maximum number of Slaves per Master: 32
Communications cycle time: 0.5 ms max. (at baud
rate 750 kbps).
Communications distance: Extended to 500 m
max. (at baud rate 93.75 kbps).
Additional instructions (PID, SCL, NEG, ZCP)
ensure analog compatibility.
RS-232C port incorporated (SRM1-C02-V2).
RC
Ordering Information
Specifications Model
Buuilt-in sstaandd-aaloonee ccoontroolleer fuuncctioonss Without RS-232C SRM1-C01-V2
With RS-232C SRM1-C02-V2
Specifications
Master Specifications
Number of I/O points 256 points (128 inputs/128 outputs)
128 points (64 inputs/64 outputs)
Selectable by DM setting. The default setting is 256 points.
Max. number of Slaves per Master 256 points: 32
128 points: 16
I/O words Input words: 000 to 007
Output words: 010 to 017
Programming language Ladder diagram
Types of instruction 14 basic and 72 special instructions (123 instructions in total)
Execution time LD instruction: 0.97 ms
MOV instruction: 9.1 ms
Program capacity 4,096 words
Data memory 2,048 + 512 (read-only) words
Timers/Counters 128 timers/counters
Work bits 640 bits
Memory backup Flash memory (without battery): User programs
Super capacitor: Data memory (backed up for 20 days at an ambient temperature of 25°C)
Peripheral port 1 point
RS-232C port 1 point (SRM1-C02-V1 only)
Host Link, NT Link, 1:1 Link, or no protocol
Programming tool Programming Consoles: CQM1-PRO01-E, C200H-PRO27-E
SYSMAC-CPT: WS01-CPTB1-E (CD-ROM/FD)
SYSMAC Support Software (MS-DOS version): C500-ZL3AT1-E
Note: PID, SCL, NEG, and ZCP instructions are not supported by the SYSMAC-CPT.
SRM1-C01-V2/C02-V2 SRM1-C01-V2/C02-V2
12
Communications Specifications
Communications method CompoBus/S protocol
Coding method Manchester coding method
Connection method Multi-drop method and T-branch method (see note 1)
Communications baud rate 750,000 bps/93,750 bps (see note 2)
Communications
cycle time
High-speed
comm nications
0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs
communications
mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs
Long-distance
comm nications
4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs
communications
mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs
Communications cable 2-conductor VCTF cable (0.75 x 20)
Dedicated flat cable
Communications
distance
High-speed
communications
mode
VCTF cable:
Main line length: 100 m max.
Branch line length: 3 m max.
Total branch line length: 50 m max.
Flat cable:
Main line length: 30 m max.
Branch line length: 3 m max.
Total branch line length: 30 m max.
(When flat cable is used to connect fewer than 16 Slaves, the main line can be up to
100 m long and the total branch line length can be up to 50 m.)
Long-distance
communications
mode
VCTF cable:
Main line length: 500 m max.
Branch line length: 6 m max.
Total branch line length: 120 m max.
Max. number of connecting nodes 32
Error control checks Manchester code check, frame length check, and parity check
Note: 1. A terminator must be connected to the point in the system farthest from the Master.
2. The communications baud rate is switched using DM settings (default setting is 750,000 bps).
General Specifications
Supply voltage 24 VDC
Allowable supply voltage 20.4 to 26.4 VDC
Power consumption 3.5 W max.
Inrush current 12.0 A max.
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 57 Hz, 0.075-mm amplitude, 57 to 150 Hz, acceleration: 9.8 m/s2 in X, Y, and Z
directions for 80 minutes each
(Time coefficient; 8 minutes × coefficient factor 10 = total time 80 minutes)
Shock resistance 147 m/s2 three times each in X, Y, and Z directions
Ambient temperature Operating: 0°C to 55°C
Storage: –20°C to 75°C
Humidity 10% to 90% (with no condensation)
Atmosphere Must be free from corrosive gas.
Terminal screw size M3
Power interrupt time DC type: 2 ms min.
Weight 150 g max.
SRM1-C01-V2/C02-V2 SRM1-C01-V2/C02-V2
13
Nomenclature
SRM1-C01-V2 SRM1-C02-V2
CPU Unit status indicator
CompoBus/S
communications status indicator
Indicates the status of the Compo-
Bus/S in operation and in communication
with Slaves.
Peripheral port
communications status indicator
Flashes when the peripheral port or
RS-232C port is in communication.
Connector cover
Peripheral port
Connect this port to programming
tools through dedicated cables.
Terminal block
Connector cover
RS-232C port
Connect this port to the
RS-232C interfaces of personal
computers and Programmable
Terminals.
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRM1-C01/C02-V2
The above dimensions apply to the SRM1-C02-V2. The SRM-C01-V2 has no RS-232C port.
14
Master Unit C200HW-SRM21-V1
Master Unit for CS1, C200HX, C200HG,
C200HE, and C200HS
A maximum of 256 I/O points available.
Connects to a maximum of 32 Slaves.
Communications cycle time: 0.5 ms max. (at baud
rate 750 kbps).
Communications distance: Extended to 500 m
max. (at baud rate 93.75 kbps).
Connection to Analog Terminals now supported.
RC
Ordering Information
PC Max. number of I/O points Model
C200HX (-Z), C200HG (-Z), C200HE (-Z),
C200HS, CS1
256 points (128 inputs/128 outputs) C200HW-SRM21-V1
Specifications
Communications Specifications
Communications method CompoBus/S protocol
Coding method Manchester coding method
Connection method Multi-drop method and T-branch method (see note 1)
Communications baud rate 750,000 bps, 93,750 bps (see note 2)
Communications
cycle time
High-speed
comm nications
0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs
communications
mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs
Long-distance
comm nications
4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs
communications
mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs
Communications cable 2-conductor VCTF cable (0.75 x 20)
Dedicated flat cable
Communications
distance
High-speed
communications
mode
VCTF cable:
Main line length: 100 m max.
Branch line length: 3 m max.
Total branch line length: 50 m max.
Flat cable:
Main line length: 30 m max.
Branch line length: 3 m max.
Total branch line length: 30 m max.
(When flat cable is used to connect fewer than 16 Slaves, the main line can be up to
100 m long and the total branch line length can be up to 50 m.)
Long-distance
communications
mode
VCTF cable:
Main line length: 500 m max.
Branch line length: 6 m max.
Total branch line length: 120 m max.
Max. number of connecting nodes 32
Error control checks Manchester code check, frame length check, and parity check
Note: 1. A terminator must be connected to the point in the system farthest from the Master.
2. The communications baud rate is switched with the DIP switch.
C200HW-SRM21-V1 C200HW-SRM21-V1
15
Unit Specifications
Current consumption 150 mA max. at 5 VDC
Number of I/O points 256 points (128 inputs/128 outputs), 128 points (64 inputs/64 outputs) (switchable)
Number of occupied words 256 points: 20 words (8 input words/8 output words, 4 status data)
128 points: 10 words (4 input words/4 output words, 2 status data)
PC CS1, C200HX (-ZE), C200HG (-ZE), C200HE (-ZE), C200HS
Number of points per node number 8 points
Max. number of Slaves per Master 32
Status data Communications Error Flag and Active Slave Node (see note)
Weight 200 g max.
Approved standards UL 508 (E95399), CSA C22.2 No. 142 (LR51460)
Note: These flags use the AR area.
Ratings
The ratings of the Unit are the same as those of the CS1, C200HX, C200HG, C200HE, and C200HS.
Nomenclature
Indicators
Indicates the operating status of the Master Unit and
the status of communications with the Slaves.
Rotary Switch
This switch sets the Master’s one-digit hexadecimal
unit number.
DIP Switch
These pins have the following functions:
Pin 1: Max. number of Slaves setting
Pin 2: Baud rate setting
Pins 3 to 4: Reserved (Always OFF.)
Communications Terminals
Connect the Slaves’ transmission cable to
these terminals.
C200HW-SRM21-V1 C200HW-SRM21-V1
16
Dimensions
Note: All units are in millimeters unless otherwise indicated.
C200HW-SRM21-V1
Note: Refer to the C200HX, C200HG, C200HE, C200HS, or CS1 Operation Manual for
details on the dimensions when the Master Unit is installed in the PC’s Backplane.
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
17
Master Unit CQM1-SRM21-V1
Master Unit for CQM1
A maximum of 128 I/O points available (Possible to
set 32, 64, or 128 I/O points).
Connects to a maximum of 16/32 Slaves.
Communications cycle time: 0.5 ms max. (at baud
rate 750 kbps).
Communications distance: Extended to 500 m
max. (at baud rate 93.75 kbps).
Connection to Analog Terminals now supported.
RC
Ordering Information
PC Max. number of I/O points Model
CQM1-series PC 128 points (64 inputs/64 outputs) CQM1-SRM21-V1
Specifications
Communications Specifications
Communications method CompoBus/S protocol
Coding method Manchester coding method
Connection method Multi-drop method and T-branch method (see note 1)
Communications baud rate 750,000 bps, 93,750 bps (see note 2)
Communications
cycle time
High-speed
comm nications
0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs
communications
mode 0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs
Long-distance
comm nications
4.0 ms with 8 Slaves for inputs and 8 Slaves for outputs
communications
mode 6.0 ms with 16 Slaves for inputs and 16 Slaves for outputs
Communications cable 2-conductor VCTF cable (0.75 x 20)
Dedicated flat cable
Communications
distance
High-speed
communications
mode
VCTF cable:
Main line length: 100 m max.
Branch line length: 3 m max.
Total branch line length: 50 m max.
Flat cable:
Main line length: 30 m max.
Branch line length: 3 m max.
Total branch line length: 30 m max.
(When flat cable is used to connect fewer than 16 Slaves, the main line can be up to
100 m long and the total branch line length can be up to 50 m.)
Long-distance
communications
mode
VCTF cable::
Main line length: 500 m max.
Branch line length: 6 m max.
Total branch line length: 120 m max.
Max. number of connecting nodes 32
Error control checks Manchester code check, frame length check, and parity check
Note: 1. A terminator must be connected to the point in the system farthest from the Master.
2. The communications baud rate is switched with the DIP switch.
CQM1-SRM21-V1 CQM1-SRM21-V1
18
Unit Specifications
Current consumption 180 mA max. at 5 VDC
Number of I/O points 128 points (64 inputs/64 outputs), 64 points (32 inputs/32 outputs),
32 points (16 inputs/16 outputs) (switchable)
Number of occupied words 128 points: 4 input words/4 output words
64 points: 2 input words/2 output words
32 points: 1 input word/1 output word
PC 128 points: CQM1-CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1
64 points: CQM1-CPU11-E/CPU21-E/CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1
32 points: CQM1-CPU11-E/CPU21-E/CPU41-EV1/CPU42-EV1/CPU43-EV1/CPU44-EV1
Number of points per node number 4/8 points (switchable)
Max. number of Slaves per Master 32 (4 points per node number)
Status data Alarm terminal output
Weight 200 g max.
Approved standards UL 508 (E95399), CSA C22.2 No. 142 (LR51460)
Alarm Output Specifications
Maximum switching capacity 2 A at 24 VDC
Minimum switching capacity 10 mA at 5 VDC
Relay G6D-1A
Minimum ON time 100 ms
Circuit configuration
2 A at 24 VDC max.
Internal
circuit
CQM1-SRM21-V1
Ratings
The ratings of the Unit are the same as those for the CQM1.
Nomenclature
Indicators
Indicates the operating status of the Master Unit and
the status of communications with the Slaves.
DIP Switch
These pins have the following functions:
Pins 1 and 2: PC word allocation setting
Pin 3: Number of points setting
Pin 4: Baud rate setting
Pins 5 to 6: Reserved (Always OFF.)
Alarm Output Terminals
These terminals are shorted when an error occurs.
Connect to a warning device.
Communications Terminals
Connect the Slaves’ transmission cable to these
terminals.
Terminal block screws
These screws attach the terminal
block. The terminal block can be
removed when these screws are
loosened.
CQM1-SRM21-V1 CQM1-SRM21-V1
19
Dimensions
Note: All units are in millimeters unless otherwise indicated.
CQM1-SRM21-V1
Note: Refer to the CQM1 Operation Manual for details on the dimensions when
the Master Unit is installed in the PC’s Backplane.
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
20
SYSMAC Board C200PC-ISA2-SRM
SYSMAC C200HX/HG/HE and
CompoBus/S Master Functions
Integrated into a Single PCB
Operates as a Programmable Controller to be built
into personal computers.
Programming is possible through Programming
Devices like the programming on C200HX/HG.
An optional Expansion Board is available for serial
communications.
Dedicated library in C is available for control.
Driver for Windows use is available.
Connects to a maximum of three Expansion I/O
Racks.
CompoBus/S Slave data is automatically read.
Ordering Information
PC Max. number of I/O points Model
C200HG-CPU43 256 points ( 128 inputs/128 outputs) C200PC-ISA02-SRM
C200HX-CPU64
56 o s 8 u s/ 8 ou u s)
C200PC-ISA12-SRM
Specifications
Communications Specifications
Communications method CompoBus/S protocol
Coding method Manchester coding method
Connection method Multi-drop method and T-branch method (see note)
Communications baud rate 750,000 bps
Communications cycle time 0.5 ms with 8 Slaves for inputs and 8 Slaves for outputs
0.8 ms with 16 Slaves for inputs and 16 Slaves for outputs
Communications cable 2-conductor VCTF cable (0.75 x 20)
Dedicated flat cable
Communications distance VCTF cable:
Main line length: 100 m max.
Branch line length: 3 m max.
Total branch line length: 50 m max.
Flat cable:
Main line length: 30 m max.
Branch line length: 3 m max.
Total branch line length: 30 m max.
(When flat cable is used to connect fewer than 16 Slaves, the main line can be up to
100 m long and the total branch line length can be up to 50 m.)
Max. number of connecting nodes 32
Error control checks Manchester code check, frame length check, and parity check
Note: A terminator must be connected to the point in the system farthest from the Master.
C200PC-ISA2-SRM C200PC-ISA2-SRM
21
Unit Specifications
Power supply voltage 4.875 to 5.25 VDC
Current consumption 0.5 A max. (see note 1)
Number of I/O points 256 points (128 inputs/128 outputs), 128 points (64 inputs/64 outputs), (switchable)
Number of occupied words 256 points: 20 words (8 input words, 8 output words, and 4 status data words) (see note 2)
128 points: 10 words (4 input words, 4 output words, and 2 status data words)
Number of points per node number 8 points
Max. number of Slaves per Master 32
Status data Communications Error Flag and Active Slave Node (see note 2)
Weight 200 g max.
Note: 1. The current consumption will be 0.8 A max. if the Programming Console is connected through the optional Expansion Board.
2. The occupied words are in the IR area.
22
I/O Link Unit CPM1A-SRT21
I/O Link Unit for CPM2A/CPM1A
Operates as a Slave of the CompoBus/S Master
Unit.
Exchanges eight inputs and eight outputs with the
Master.
Approved by UL and CSA standards, and bears the
CE marking.
RC
Ordering Information
CPU Units
I/O configuration Power supply Output method Input Output Model
30-point I/O model AC Relay 18 12
CPM1A-30CDR-A*
DC Relay
CPM1A-30CDR-D*
Transistor (sink) CPM1A-30CDT-D
Transistor (source) CPM1A-30CDT1-D
AC Relay CPM2A-30CDR-A
DC Relay CPM2A-30CDR-D
Transistor (sink) CPM2A-30CDT-D
Transistor (source) CPM2A-30CDT1-D
40-point I/O model AC Relay 24 16
CPM1A-40CDR-A*
DC Relay
CPM1A-40CDR-D*
Transistor (sink) CPM1A-40CDT-D
Transistor (source) CPM1A-40CDT1-D
AC Relay CPM2A-40CDR-A
DC Relay CPM2A-40CDR-D
Transistor (sink) CPM2A-40CDT-D
Transistor (source) CPM2A-40CDT1-D
60-point I/O model AC Relay 36 24
CPM2A-60CDR-A
DC Relay
CPM2A-60CDR-D
Transistor (sink) CPM2A-60CDT-D
Transistor (source) CPM2A-60CDT1-D
Note: Models marked with asterisks do not bear CE markings.
Expansion Units
Product Number of connectable
Units per CPU Unit
Output method Input Output Model
Expansion I/O Units 3 max. (see note) Relay 12 8
CPM1A-20EDR1
Transistor (sink)
CPM1A-20EDT
Transistor (source) CPM1A-20EDT1
--- 8 --- CPM1A-8ED
Relay --- 8 CPM1A-8ER
Transistor (sink) --- 8
CPM1A-8ET
Transistor (source)
CPM1A-8ET1
Analog I/O Unit 3 max. (see note) Analog 2 1 CPM1A-MAD01
CompoBus/S I/O Link Unit 3 max. (see note) --- 8 I/O link points 8 I/O link points CPM1A-SRT21
Note: Only a single Unit will be connectable if the NT-AL001 is connected to the RS-232C port.
CPM1A-SRT21 CPM1A-SRT21
23
Specifications
Slave CompoBus/S Slave
Number of I/O points 8 inputs and 8 outputs
Number of occupied I/O memory
words of CPM2A
1 input word and 1 output word (same as other Expansion Units in allocation)
Node address setting DIP switch
Dimensions
Note: All units are in millimeters unless otherwise indicated.
CPM1A-SRT21
Installation
Connection Examples
CompoBus/S Master Unit or
SRM1 CompoBus/S Master
Control Unit CPM1A or CPM2A CPU Unit
CPM1A-SRT21 CompoBus/S
I/O Link Unit
CS1
C200H
CQM1
SRM1
Dedicated flat cable or VCTF cable Connectable to 16 Units max.
(Eight CQM1-SRM21 Units max.)
Note: A single CompoBus/S I/O Link Unit together with a maximum of two other Expansion I/O Units can be connected to the CPM1A or
CPM2A CPU Unit.
24
Transistor Remote Terminal SRT-ID/OD
Long-distance Communications
Supported by SRT2 Models
(Long-distance/High-speed
Communications Selection)
SRT1 models support high-speed communications
only.
SRT2 models support long-distance communications
and high-speed communications.
Ultra-compact at 80 x 48 x 50 (W x H x D) mm for
4-point and 8-point terminals and 105 x 48 x 50 (W x
H x D) mm for 16-point terminals.
Two independent power supplies can be used
because the I/O terminals are insulated from the
internal circuits.
DIN track mounting and screw mounting are both
supported.
RC
Ordering Information
I/O classification Internal I/O circuit
common
I/O points Rated voltage I/O rated voltage Model
Input NPN (+ common) 4 24 VDC 24 VDC SRT1-ID04
PNP (– common)
C C
SRT1-ID04-1
Output NPN (– common) SRT1-OD04
PNP (+ common) SRT1-OD04-1
Input NPN (+ common) 8
SRT2-ID08
PNP (– common)
SRT2-ID08-1
Output NPN (– common) SRT2-OD08
PNP (+ common) SRT2-OD08-1
Input NPN (+ common) 16 SRT2-ID16
PNP (– common)
6
SRT2-ID16-1
Output NPN (– common) SRT2-OD16
PNP (+ common) SRT2-OD16-1
Note: For more details about connections supported by the Master Unit, refer to page 10.
Specifications
Ratings
Inputs
Input current 6 mA max./point
ON delay time 1.5 ms max.
OFF delay time 1.5 ms max.
ON voltage 15 VDC min. between each input terminal and V
OFF voltage 5 VDC max. between each input terminal and V
OFF current 1 mA max.
Insulation method Photocoupler
Input indicators LED (yellow)
SRT-ID/OD SRT-ID/OD
25
Outputs
Rated output current 0.3 A/point
Residual voltage 0.6 V max.
Leakage current 0.1 mA max.
Insulation method Photocoupler
Output indicators LED (yellow)
Characteristics
Communications power supply
voltage
14 to 26.4 VDC
I/O power supply voltage 24 VDC +10%/–15%
I/O power supply current 1 A max.
Current consumption (see note) 50 mA max. at 24 VDC
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Connecting Units 4-point and 8-point Terminals: 16 Input Terminals and 16 Output Terminals per Master
16-point Terminals: 8 Input Terminals and 8 Output Terminals per Master
Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits)
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance Malfunction: 200 m/s2
Destruction: 300 m/s2
Mounting strength No damage when 50 N pull load was applied for 10 s in all directions
Terminal strength No damage when 50 N pull load was applied for 10 s
Screw tightening torque 0.6 to 1.18 N m
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight 4-point and 8-point Terminals: 80 g max.
16-point Terminals: 110 g max.
Approved standards (4/8 points) UL 508, CSA C22.2 No. 14
Note: The above current consumption is the value with all 4 and 8 and 16 points turned ON excluding the current consumption of the external
sensor connected to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal.
SRT-ID/OD SRT-ID/OD
26
Nomenclature
I/O Terminals
I/O Power Supply Terminals
Connect 24-VDC power supply
Communications Power Supply Terminals
Connect 14- to 26.4-VDC power supply.
CompoBus/S Terminal
Connect the CompoBus/S
DIP Switch communications cable.
Used for node number setting and holding or clearing outputs for communications error.
Refer to the Compobus/S Operation Manual (W266) for details on DIP switch settings.
Baud rate setting
0 to 7
ERR
COMM
PWR
Node Number Settings
Output HOLD/CLEAR settings (Output Terminals only)
Screw mounting hole
Indicators
Indicator Display Color Meaning
PWR Lit Green The communications power supply is ON.
Not lit The communications power supply is OFF.
COMM Lit Yellow Normal communications
Not lit A communications error has occurred or the Unit is in standby status.
ERR Lit Red A communications error has occurred.
Not lit Normal communications or the Unit is in standby status.
0 to 7 Lit Yellow The corresponding I/O signal is ON.
Not lit The corresponding I/O signal is OFF.
Output HOLD/CLEAR Mode
Mode Pin 1 Setting
HOLD ON Output status is maintained.
CLEAR OFF Output status is cleared when a communications error occurs.
Note: 1. Pin 1 is factory-set to OFF.
2. This function is available to Output Terminals only.
SRT-ID/OD SRT-ID/OD
27
Node Number Settings
Node number Pin 3 Pin 4 Pin 5 Pin 6
8 4 2 1
0 OFF OFF OFF OFF
1 OFF OFF OFF ON
2 OFF OFF ON OFF
3 OFF OFF ON ON
4 OFF ON OFF OFF
5 OFF ON OFF ON
6 OFF ON ON OFF
7 OFF ON ON ON
8 ON OFF OFF OFF
9 ON OFF OFF ON
10 ON OFF ON OFF
11 ON OFF ON ON
12 ON ON OFF OFF
13 ON ON OFF ON
14 ON ON ON OFF
15 ON ON ON ON
Note: 1. The node number is factory-set to 0.
2. For node number settings, refer to the CompoBus/S Operation Manual (W266).
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT1-ID04 (-1)
SRT1-OD04 (-1)
SRT2-ID08 (-1)
SRT2-OD08 (-1)
(54)
27
80
48
65
Two, 4.2 dia. or M4
Sixteen, M3
Mounting Holes
(20.5)
(11)
SRT-ID/OD SRT-ID/OD
28
SRT2-ID16 (-1)
SRT2-OD16 (-1)
48
Two, 4.2 dia. or M4
(50)
(28)
Mounting Holes
(54)
27
50
(20.5)
(11)
105
22–M3
Installation
Internal Circuit Configuration
SRT1-ID04 SRT1-ID04-1
Photocoupler
Photocoupler
Internal
circuit
Internal
circuit
24 VDC(+)
Photocoupler
Photocoupler
(–)
SRT1-OD04
Internal
circuit
24 VDC
Photocoupler
Photocoupler
Voltage
stepdown
SRT1-OD04-1
Internal
circuit
Photocoupler
Photocoupler
24 VDC (P)
(P)
24 VDC (P)
(P)
Voltage
stepdown
V
V
V
1
G
0
2
G
G
V
V
V
1
V
0
2
G
SRT-ID/OD SRT-ID/OD
29
SRT2-OD08-1
Internal
circuit
Photocoupler
Photocoupler
SRT2-ID08 SRT2-ID08-1
Photocoupler
Photocoupler
Internal
circuit
24 VDC(+)
Internal
circuit
Photocoupler
Photocoupler
(–)
SRT2-OD08
Internal
circuit
24 VDC
Photocoupler
Photocoupler
Voltage
stepdown
SRT2-ID16
Photocoupler
Internal Photocoupler
circuit
SRT2-ID16-1
Internal
circuit
Photocoupler
Photocoupler
Internal
circuit
SRT2-OD16
Photocoupler
Photocoupler
Voltage
stepdown
SRT2-OD16-1
Internal
circuit
Photocoupler
Photocoupler
Voltage
stepdown
24 VDC (P)
24 VDC (P)
(P)
Voltage
stepdown
(P)
24 VDC (P)
(P)
24 VDC (P)
(P)
V
V
1
0
2
G
G
V
V
1
0
2
G
V
V
1
0
2
G
SRT-ID/OD SRT-ID/OD
30
External Connections (NPN Models)
Input
Sensor 1
Blue
Brown
Black
Sensor 2
Blue
Brown
Black
Sensor 1
Blue
Brown
Black
Sensor 2
Blue
Brown
Black
Three-wired Sensors
SRT1-ID04 with NPN Output SRT2-ID08 and SRT2-ID16 with NPN Output
Two-wired Sensors
SRT1-ID04 SRT2-ID08 and SRT2-ID16
Sensor 1
Blue
Brown
Sensor 2
Blue
Brown
Sensor 1
Blue
Brown
Sensor 2
Blue
Brown
Output
SRT1-OD04 SRT2-OD08 and SRT2-ID16
L 1 L 2 L 1 L 2
Terminal Arrangement and I/O Device Connection Example (PNP Models)
Note: The connections examples shown are for PNP models.
Input
SRT1-ID04 SRT2-ID08
Output
SRT1-OD04 SRT2-OD08
Blue
Brown
Blue
Brown
Blue
Brown
Brown
Blue
Communications
path
Communications
power
supply
power
supply
power
supply
Communications
path
Communications
power
supply
Communications
path
Communications
power
supply
power
supply
Photoelectric sensor or
proximity sensor (threewired
sensor with a builtin-
amplifier)
Limit switch
(two-wired
sensor)
Solenoid, valve Solenoid
I/O Communications
path
Communications
power
supply
Photoelectric sensor or
proximity sensor (threewired
sensor with a builtin-
amplifier)
Limit switch
(two-wired
sensor)
Black
Black
SRT2-ID16
SRT2-OD16
Communications
path
Communications
power
supply
I/O
power
supply
Photoelectric sensor or
proximity sensor (threewired
sensor with a builtin-
amplifier)
Limit switch
(two-wired
sensor)
I/O
power
supply
Communications
path
Communications
power
supply Solenoid Valve Valve
power
supply
I/O
Blue
Brown
Blue
Brown
Black
I/O I/O
SRT-ID/OD SRT-ID/OD
31
External Connections (PNP Models)
Input
Three-wired Sensors
SRT1-ID04-1 with NPN Output SRT2-ID08-1 and SRT2-ID16-1 with NPN Output
Two-wired Sensors
SRT1-ID04-1 SRT2-ID08-1 and SRT2-ID16-1
Sensor 1
Blue
Brown
Black
Sensor 2
Blue
Brown
Black
Sensor 1
Blue
Brown
Black
Sensor 2
Blue
Brown
Black
Sensor 1
Blue
Brown
Sensor 2
Blue
Brown
Sensor 1
Blue
Brown
Sensor 2
Blue
Brown
Output
SRT1-OD04-1 SRT2-OD08-1 and SRT2-ID16-1
L 1 L 2 L 1 L 2
Terminal Arrangement and I/O Device Connection Example (PNP Models)
Note: The connections examples shown are for NPN models.
Input
SRT1-ID04-1 SRT2-ID08-1
Output
SRT1-OD04-1 SRT2-OD08-1
Blue
Brown
Blue
Brown
Blue
Brown
Brown
Blue
Communications
path
Communications
power
supply
power
supply
power
supply
Communications
path
Communications
power
supply
Communications
path
Communications
power
supply
power
supply
Photoelectric sensor or proximity
sensor (three-wired sensor
with a built-in-amplifier)
Limit switch
(two-wired sensor)
Solenoid, valve Solenoid
I/O Communications
path
Communications
power
supply
Photoelectric sensor or proximity
sensor (three-wired sensor
with a built-in-amplifier)
Limit switch
(two-wired sensor)
Black
Black
SRT2-ID16-1
SRT2-OD16-1
Communications
path
Communications
power
supply
I/O
power
supply
Photoelectric sensor or proximity
sensor (three-wired sensor
with a built-in-amplifier)
Limit switch
(two-wired sensor)
I/O
power
supply
Communications
path
Communications
power
Valve supply Solenoid Valve
power
supply
I/O
Blue
Brown
Blue
Brown
Black
I/O I/O
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
For general precautions refer to page 80.
32
Remote I/O Terminal SRT1-D16T(-1)
Models with 3-tier Terminals (16 Points)
are Added to the Remote I/O Terminal
Series.
Six Models are Available Depending on
the NPN or PNP Configuration, Input
Points, I/O Points, or Output Points.
Incorporates easy-to-wire terminals each connecting
to a single wire.
Reduces designing and wiring effort.
Incorporates a removable circuit block of cassette
construction.
Ordering Information
I/O classification Internal I/O circuit
common
I/O points I/O connection method Model
Digital input NPN (+ common) 16 M3 terminal block SRT1-ID16T
PNP (– common)
6 3 e a boc
SRT1-ID16T-1
Digital I/O NPN (+ common) SRT1-MD16T
PNP (– common) SRT1-MD16T-1
Digital output NPN (– common) SRT1-OD16T
PNP (+ common) SRT1-OD16T-1
Specifications
Ratings
Inputs
Input current 6 mA max./point at 24 V and 3 mA min./point at 17 V
ON delay time 1.5 ms max.
OFF delay time 1.5 ms max.
ON voltage NPN: 15 VDC min. between V terminals and each input terminal
PNP: 15 VDC min. between G terminals and each input terminal
OFF voltage NPN: 5 VDC max. between V terminals and each input terminal
PNP: 5 VDC max. between G terminals and each input terminal
OFF current 1 mA max.
Insulation method Photocoupler
Outputs
Rated output current 0.5 A max./point
Residual voltage 1.2 V max.
ON delay time 0.5 ms max.
OFF delay time 1.0 ms max.
Leakage current 0.1 mA max.
Insulation method Photocoupler
SRT1-D16T(-1) SRT1-D16T(-1)
33
Characteristics
Communications power supply
voltage
14 to 26.4 VDC
I/O power supply voltage 24 VDC +10%/–15%
I/O power supply current 4 A max./common
Current consumption (see note) 50 mA max. at 24 VDC
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Dielectric strength 500 VAC between insulated circuits
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2
Shock resistance 200 m/s2
Mounting strength No damage with 100 N pull load applied in all directions.
Terminal strength No damage with 100 N pull load applied
Screw tightening torque 0.3 to 0.5 N m
Ambient temperature Operating: –10°C to 55°C
Storage: –25°C to 65°C
Ambient humidity Operating: 25% to 85% (with no condensation)
Weight 300 g max.
Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected
to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal.
Nomenclature
ERR Indicator: Indicates communications errors.
COMM Indicator: ON while the Unit is in data communication.
Power Indicator
HOLD/CLR DIP Switch
The DIP switch is on the
left-hand side under the cover
on the upper part of the Remote
I/O Terminal.
Holding or clearing output when a
communications error occurs.
Address Setting Switch
Set the rotary switch to the node
address by referring to the
following table.
I/O Indicators
M4 Mounting Screw
Terminal Cover
The Unit stops operating with the
cover opened.
I/O and I/O Device Power Supply Terminals 8 to 15
These terminals will be used as output terminals 0
through 7 if the connected device handles both input
and output signals.
I/O and I/O Device Power Supply Terminals 0 to 7
These terminals will be used as input terminals if the
connected device handles both input and output
signals.
I/O Power Supply Terminals
Connect 24-VDC I/O power supply
Fixture Track
Used for DIN track mounting.
CompoBus/S Internal Power Supply
Terminals (BS+ and BS–)
CompoBus/S Communications Cable
Terminals (BDH and BDL)
Address Setting Switch
Node address Setting (Hex)
0 0
1 1
2 2
3 3
4 4
5 5
6 6
7 7
Node address Setting (Hex)
8 8
9 9
10 A
11 B
12 C
13 D
14 E
15 F
SRT1-D16T(-1) SRT1-D16T(-1)
34
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT1-ID16T (-1)
SRT1-MD16T (-1)
SRT1-OD16T (-1)
Mounting Holes
Two, 4.2 dia. or M4
Two, 4.2 dia. or M4
Installation
Internal Circuit Configuration
SRT1-ID16T SRT1-MD16T
SRT1-ID16T-1 SRT1-MD16T-1
SRT1-OD16T
SRT1-OD16T-1
DC-DC converter
(isolated type)
Photocoupler
Photocoupler
Inputs
(0 to 7)
Inputs
(8 to 15)
DC-DC converter
(isolated type)
Photocoupler
Photocoupler
Inputs
(0 to 7)
Inputs
(0 to 7)
DC-DC converter
(isolated type)
Photocoupler
Photocoupler
Inputs
(0 to 7)
Inputs
(8 to 15)
DC-DC converter
(isolated type)
Photocoupler
Photocoupler
Inputs
(0 to 7)
Inputs
(8 to 15)
DC-DC converter
(isolated type)
Photocoupler
Photocoupler
Inputs
(0 to 7)
Outputs
(0 to 7)
DC-DC converter
(isolated type)
Photocoupler
Photocoupler
Outputs
(0 to 7)
Outputs
(8 to 15)
I/O
power
supply
I/O
power
supply
I/O
power
supply
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Voltage
drop
Voltage
drop
Voltage
drop
Voltage
drop
Voltage
drop
Voltage
drop
SRT1-D16T(-1) SRT1-D16T(-1)
35
External Connections
Input (NPN Models)
SRT1-ID16T
SRT1-MD16T
Output (NPN Models)
SRT1-OD16T
SRT1-MD16T
Input (PNP Models)
SRT1-ID16T-1
SRT1-MD16T-1
Output (PNP Models)
SRT1-OD16T-1
SRT1-MD16T-1
Two-wired sensor Three-wired sensor Three-wired sensor
Solenoid, valve, etc. Solenoid, valve, etc.
Blue (Black)
Brown (White)
Blue (Black)
Brown (Red)
Black (White)
Black (Black)
Blue (Red)
Brown (White)
36
Relay-mounted Remote Terminal SRT-R
Ultra-miniature 8-point and 16-point
Relay-mounted Terminals
Ultra-compact
(8-point models: 101 x 51 x 51 mm (W x H x D);
16-point models: 156 x 51 x 51 mm (W x H x D))
Power MOS FET Relay and Relay models.
DIN track mounting and screw mounting are
available.
RC
Ordering Information
Classification I/O points Rated voltage Relay coil rating Model Applicable relay
Relay output 8 points 24 VDC 24 VDC SRT1-ROC08 G6D-1A
16 points SRT2-ROC16
Power MOS FET
l t t
o e OS 8 points SRT1-ROF08 G3DZ-2R6PL
relay output 16 points SRT2-ROF16
Note: For details about connections to the Master Unit, refer to page 10.
Specifications
Ratings
Relay Output
Item SRT1-ROC08, SRT2-ROC16
Applicable relay G6D-1A (one for each output point)
Rated load 3 A at 250 VAC, 3 A at 30 VDC (resistive load)
Rated carry current 3 A (see note 1)
Max. contact voltage 250 VAC, 30 VDC
Max. contact current 3 A
Max. switching capacity 730 VA (AC), 90 W (DC)
Min. permissible load (see note 2) 10 mA at 5 VDC
Life expectancy Electrical: 100,000 operations min. (rated load, at 1,800 operations/h)
Mechanical: 20,000,000 operations min. (at 18,000 operations/h)
Note: 1. The maximum permissible current of COM0 to COM7 is 3 A.
2. This value fulfills the P reference value of opening/closing at a rate of 120 times per min (ambient operating environment and determination
criteria according to JIS C5442).
Power MOS FET Relay Output
Item SRT1-ROF08, SRT2-ROF16
Applicable relay G3DZ-2R6PL (one for each output point)
Load voltage 3 to 264 VAC, 3 to 125 VDC
Load current 100 mA to 0.3 A
Inrush current 6 A (10 ms)
SRT-R SRT-R
37
Characteristics
Power supply voltage 24 VDC +10%/–15%
Current consumption (see note) 350 mA max. at 24 VDC
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Connecting Units 8-point Units: 16 per Master
16-point Units: 8 per Master
Dielectric strength 2,000 VAC for 1 min (1-mA sensing current) between all output terminals and power supply,
between communication terminals, and between contacts of different polarities
500 VAC for 1 min (1-mA sensing current) between all output terminals and power supply,
between communication terminals, and between all power supply terminals and
communications terminals
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 55 Hz, 0.75-mm double amplitude
Shock resistance Malfunction: 100 m/s2
Destruction: 300 m/s2
Mounting strength No damage when 50 N pull load was applied for 10 s in all directions
Terminal strength No damage when 50 N pull load was applied for 10 s
Screw tightening torque 0.6 to 1.18 N m
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight 8-point models: 145 g max., 16-point models: 240 g max.
Approved standards UL 508, CSA C22.2 No. 14
Note: The above current consumption is a value with all the points turned ON including the current consumption of the G6D coil for the
Remote Output Terminal.
SRT-R SRT-R
38
Nomenclature
SRT2-ROC16
SRT2-ROF16
SRT1-ROC08
SRT1-ROF08
Mounting Holes
Output Terminals
I/O Power Supply Terminals
Connect 24-VDC power supply
Communications Power Supply Terminals
Connect 24-VDC power supply.
CompoBus/S Terminals
Connect the CompoBus/S communications cable.
Mounting Holes
DIP Switch
Used for node number setting and holding or
clearing outputs for communications error.
Note: Always turn off the Unit before changing DIP switch settings.
Mounting Holes
Output Terminals
I/O Power Supply Terminals
Connect 24-VDC power supply
Communications Power Supply Terminals
Connect 24-VDC power supply.
CompoBus/S Terminals
Connect the CompoBus/S communications cable.
Mounting Holes
DIP Switch
Used for node number setting and holding or clearing outputs for communications error.
0 to 15
ERR
COMM
PWR
Output HOLD/CLEAR setting (Output model only)
Baud rate setting
Node address setting
Indicators
Indicator Display Color Meaning
PWR Lit Green The communications power supply is ON.
Not lit The communications power supply is OFF.
COMM Lit Yellow Normal communications
Not lit A communications error has occurred or
the Unit is in standby status.
ERR Lit Red A communications error has occurred.
Not lit Normal communications or the Unit is in
standby status.
0 to 15
(see
note)
Lit Yellow The corresponding I/O signal is ON.
Not lit The corresponding I/O signal is OFF.
Note: The SRT1-RO08 does not have indicators 8 to 15.
SRT-R SRT-R
39
Output HOLD/CLEAR Mode
Mode Pin 1 Setting
HOLD ON Output status is maintained when a communications error occurs.
CLEAR OFF Output status is cleared when a communications error occurs.
Note: 1. Pin 1 is factory-set to OFF.
2. This function is available to the Output Terminal only.
Node Number Settings
Node number Pin 3 Pin 4 Pin 5 Pin 6
8 4 2 1
0 OFF OFF OFF OFF
1 OFF OFF OFF ON
2 OFF OFF ON OFF
3 OFF OFF ON ON
4 OFF ON OFF OFF
5 OFF ON OFF ON
6 OFF ON ON OFF
7 OFF ON ON ON
8 ON OFF OFF OFF
9 ON OFF OFF ON
10 ON OFF ON OFF
11 ON OFF ON ON
12 ON ON OFF OFF
13 ON ON OFF ON
14 ON ON ON OFF
15 ON ON ON ON
Note: 1. The node number is factory-set to 0.
2. For node number setting, refer to the CompoBus/S Operation Manual (W266).
SRT-R SRT-R
40
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT1-ROC08
SRT1-ROF08
Mounting Holes
SRT2-ROC16
SRT2-ROF16
Mounting Holes
100
50
Two, 4.2 dia. or M4
Two, 4.2 dia. or M4
50
50
155
Thirty two, M3
Sixteen, M3
50 50
50
80
40
135
40
SRT-R SRT-R
41
Installation
Internal Circuit Configuration
SRT1-ROC08
SRT2-ROC16
Note: The G3DZ-2R6PL Power MOS FET Relay is inserted into
this portion of the SRT1-ROF08 and SRT2-ROF16.
Relay driver
circuit
Internal
circuit
Later
blocks
(See
note)
*
Relay driver
circuit
Relay driver
circuit
Relay driver
circuit
External Connections
Lamp
Lamp
Lamp
Lamp
Load
power
supply
Terminal Arrangement and I/O Device Connection Example
Output
SRT2-ROC16
SRT2-ROF16
Note: 1. Dotted lines indicate internal connections.
SRT1-ROC08 and SRT1-ROF08 have the 0 to 7 and COM0 to COM3 terminals only.
2. The above is a connection example of the SRT2-ROC16 with G6D Relays mounted.
G3DZ Power MOS FET Relays are mounted to the SRT1-ROF08 and SRT2-ROF16.
24-VDC
power supply
Communications
path
Load
Power
supply
Load
Power
supply
Load
Load
Load
Power
supply
Load
Power
supply
Load
Load
Load
Power
supply
Load
Power
supply
Load
Load
Load
Power
supply
Load
Power
supply
Load
Load
*(see note 2)
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
Refer to page 80 for details.
42
Connector Terminal SRT2-VID/VOD
Compact Connector Terminals Save
Wiring Effort and Enable Long-distance
Communications
Long-distance or high-speed communications
mode is selectable.
Incorporates I/O connectors making it possible to
minimize the size.
I/O connectors save wiring effort.
Flexible DIN track mounting is possible through a
DIN track attachment.
Eight-point sensor connector models and 16-point
MIL connector models are the same size.
Features
Vertical or horizontal DIN track mounting according to the available space is possible.
Saves space and easily connects to other devices without wiring effort.
Standard mounting
(Sensor connector model)
Mounting with DIN
track attachment
Standard mounting
(MIL connector model)
Communications and
power supply connector DIN track
G7TC
Sensor connector
Indicators
Setting switch
DIN track mounting hook
MIL connector
Ordering Information
I/O classification Internal I/O circuit
common
I/O points I/O connection method Model
Digital input NPN (+ common) 8 Sensor connector SRT2-VID08S
PNP (– common)
Se so co ec o
SRT2-VID08S-1
Digital output NPN (– common) SRT2-VOD08S
PNP (+ common) SRT2-VOD08S-1
Digital input NPN (+ common) 16 MIL connector SRT2-VID16ML
PNP (– common)
6 co ec o
SRT2-VID16ML-1
Digital output NPN (– common) SRT2-VOD16ML
PNP (+ common) SRT2-VOD16ML-1
Mounting hook A SRT2-ATT01
Mounting hook B SRT2-ATT02
Note: For details about connecting the SRT2-VID or SRT2-VOD to the Master Unit, refer to page 10.
SRT2-VID/VOD SRT2-VID/VOD
43
Specifications
Ratings
Inputs
Item SRT2-VID08S
SRT2-VID08S-1
SRT2-VID16ML
SRT2-VID16ML-1
Input current 6 mA max./point at 24 V, 3 mA max./point at 17 V
ON delay time 1.5 ms max.
OFF delay time 1.5 ms max.
ON voltage 15 VDC min. (Between each input terminal and V: NPN. Between each input and G: PNP.)
OFF voltage 5 VDC max. (Between each input terminal and V: NPN. Between each input and G: PNP.)
OFF current 1 mA max.
Insulation method Photocoupler
Maximum number of inputs 8 12
Number of circuits 8 points/common, 1 circuit 16 points/common, 1 circuit
Outputs
Item SRT2-VID08S
SRT2-VID08S-1
SRT2-VID16ML
SRT2-VID16ML-1
Rated output current 0.3 A/point 0.3 A/point (2-A common) (See note.)
Residual voltage 1.2 V max.
ON delay time 0.5 ms max.
OFF delay time 1.5 ms max.
Leakage current 0.1 mA max.
Insulation method Photocoupler
Number of circuits 8 points/common, 1 circuit 16 points/common, 1 circuit
Note: When using V/G terminals in an MIL connector, ensure that the current per terminal for the V/G terminals does not exceed 1 A.
Characteristics
Communications power supply
voltage
14 to 26.4 VDC
I/O power supply voltage 20.4 to 26.4 VDC (24 VDC +10%/–15%)
I/O power supply current Sensor connector: 2.4 A max., MIL connector: 2.0 A max.
Current consumption (see note) 50 mA max. at 24 VDC
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2 (50 m/s2 for SRT2-ATT02)
Shock resistance 200 m/s2
Dielectric strength 500 VAC (between insulated circuits)
Ambient temperature Operating: –10°C to 55°C (with no icing or condensation)
Storage: –25°C to 65°C
Ambient humidity Operating: 25% to 85% (with no condensation)
Storage: 25% to 85%
Mounting strength No damage when 100 N pull load was applied in all directions (40 N load for SRT2-ATT02)
Terminal strength No damage when the following loads were applied:
Communications connector: 100 N
Sensor connector: 40 N
MIL connector: 100 N
Screw tightening torque Communications connector: 0.25 N m
Node address setting Settings made at DIP switch (set before supplying power for Slave communications)
Weight Approx. 75 g max.
Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected
to the input Remote Terminal and the current consumption of the load connected to the output Remote Terminal.
SRT2-VID/VOD SRT2-VID/VOD
44
Nomenclature
SRT2-VID08S/SRT2-VID08S-1
SRT2-VOD08S/SRT2-VOD08S-1
(Sensor Connector Models)
SRT2-VID16ML/SRT2-VID16ML-1
SRT2-VOD16ML/SRT2-VOD16ML-1
(MIL Connector Models)
Communications
Connectors
I/O Connectors Indicators
DIP Switch
Communications
Connectors
I/O Connectors
Output HOLD/CLEAR Mode Setting
Communications Mode Setting
Node Address Setting
Reserved for System Use (Always OFF)
Indicators
Indicator Color Display Meaning
PWR Green Lit The communications power
supply is ON.
Not lit The communications power
supply is OFF.
COMM Yellow Lit Normal communications
Not lit A communications error has
occurred or the Unit is in
standby status.
ERR Red Lit A communications error
has occurred.
Not lit Normal communications or
the Unit is in standby status.
0 to 7
(for
8-point
I/O)
0 to 15
(for
16-point
I/O)
Yellow Lit The corresponding I/O
signal is ON.
Not lit The corresponding I/O
signal is OFF.
Name
Power
Communications
Communications
error
Input
(output)
Output HOLD/CLEAR Mode
SW8 (HOLD) Setting
OFF Output status is cleared.
ON Output status is maintained.
Communications Mode
SW7 (HOLD) Setting
OFF High-speed communications mode
ON Long-distance communications mode
Node Number Settings
Node number Pin 4 Pin 3 Pin 2 Pin 1
8 4 2 1
0 OFF OFF OFF OFF
1 OFF OFF OFF ON
2 OFF OFF ON OFF
3 OFF OFF ON ON
4 OFF ON OFF OFF
5 OFF ON OFF ON
6 OFF ON ON OFF
7 OFF ON ON ON
8 ON OFF OFF OFF
9 ON OFF OFF ON
10 ON OFF ON OFF
11 ON OFF ON ON
12 ON ON OFF OFF
13 ON ON OFF OFF
14 ON ON ON OFF
15 ON ON ON ON
Note: Be sure to perform settings with the Slave
power supply OFF.
SRT2-VID/VOD SRT2-VID/VOD
45
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT2-VID08S
SRT2-VID08S-1
SRT2-VOD08S
SRT2-VOD08S-1
SRT2-VID16ML
SRT2-VID16ML-1
SRT2-VOD16ML
SRT2-VOD16ML-1
SRT2-ATT01
SRT2-ATT02
Dimensions when Unit is mounted.
SRT2-VID/VOD SRT2-VID/VOD
46
Installation
Internal Circuit Configuration
SRT2-VOD08S-1
SRT2-VID08S SRT2-VID08S-1
SRT2-VOD08S
SRT2-VID16ML SRT2-VID16ML-1
SRT2-VOD16ML SRT2-VOD16ML-1
Photocoupler
Photocoupler Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Photocoupler
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Internal circuit
Voltage
drop
Voltage
drop
Voltage
drop
Voltage
drop
SRT2-VID/VOD SRT2-VID/VOD
47
Terminal Arrangement and I/O Device Connection Examples
SRT2-VID08S SRT2-VID08S-1
SRT2-VID16ML SRT2-VID16ML-1
SRT2-VOD08S
SRT2-VOD16ML
SRT2-VOD08S-1
SRT2-VOD16ML-1
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications
CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
CompoBus/S
communications CompoBus/S
communications
power supply
I/O power
supply
Pin numbers
Sensor
Brown (Red)
Black (White)
Blue (Black)
Three-wired sensor
Sensor
Brown (White)
Blue (Black)
Two-wired sensor
Sensor
Three-wired sensor
Sensor
Two-wired sensor
Sensor
Three-wired sensor
Sensor
Two-wired sensor
Sensor
Three-wired sensor
Sensor
Two-wired sensor
Output
device
Solenoid etc.
Output
device
Valve etc.
Output
device
Solenoid etc.
Output
device
Valve etc.
Output
device
Solenoid etc.
Output
device
Valve etc.
Output
device
Solenoid etc.
Output
device
Valve etc.
Brown (Red)
Black (White)
Blue (Black)
Brown (White)
Blue (Black)
Brown (Red)
Black (White)
Blue (Black)
Brown (White)
Blue (Black)
Brown (Red)
Black (White)
Blue (Black)
Brown (White)
Blue (Black)
Note: 1. V terminals and G terminals are respectively connected internally.
When supplying power for I/O from communications connectors, power can be supplied to the sensor output devices from V and G
terminals.
2. When using an inductive load (solenoid, valve etc.), either use one with an internal reverse electromotive force absorption diode or
attach a diode externally.
SRT2-VID/VOD SRT2-VID/VOD
48
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
Refer to page 80 for common precautions.
Communications Connector Pin Arrangement
24-VDC
communications
power supply
24-VDC I/O
power supply
CompoBus/S communications
The following solderless terminals are recommended.
• Manufacturer: Weidmuller
Sleeve (Part No. 046290)
Solderless
terminal
Cable
Two-wire insertion (Part No. 901851)
Solderless
terminal
Cable
The following product is a dedicated tool.
• Manufacturer: Weidmuller
PZ1.5 Crimper (Part No. 900599)
Sensor Connector Pin Arrangement
SRT2-VID08S/VID08S-1
SRT2-VOD08S/VOD08S-1
Model Cable conductor size
XS8A-0441 0.3 to 0.5 mm2
XS8A-0442 0.14 to 0.2 mm2
Note: The XS8A-0441 or XS8A-0442 Connector is not provided
with the SRT-VID or SRT2-VOD. Place an order for the connector
separately.
Calculate the cable conductor size as follows.
The following information is given on each sensor cable:
Cable dia. (Number of conductors/Conductor dia.)
Conductor size (mm2) =
(Conductor dia./2)2 x p x Number of conductors
Example: E3S-A
4 dia. (18/0.12)
Conductor size (mm2) = (0.12/2)2 x 3.14 x 18 0.20
The conductor size is 0.2 mm2. Therefore, use the XS8A-0442.
MIL Connector Pin Arrangement
SRT2-VID16ML/VID16ML-1
Function Pin No.
Pin No.
OUT0
IN0
OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
IN7
G
G
V
V
20
20
18
18
16
16
14
14
12
12
10
10
8
8
6
6
4
4
2
2
Function
Function
Pin No.
Pin No.
OUT8
IN8
OUT9
IN9
OUT10
IN10
OUT11
IN11
OUT12
IN12
OUT13
IN13
OUT14
IN14
OUT15
IN15
G
G
V
V
19
19
17
17
15
15
13
13
11
11
9
9
7
7
5
5
3
3
1
1
SRT2-VOD16ML/VOD16ML-1
Function
Note: 1. No cable connector is provided. Order the connector
separately.
• Applicable Connector
XG4M-2030-T
• Applicable Connector Cables
G79-O50C
G79-O25C
G79-I50C
G79-I25C
2. Refer to the following table for ordering information on
the applicable Cables.
SRT2-VID/VOD SRT2-VID/VOD
49
Applicable Cables
Connectable product Model Applicable Cable
I/O Block G7TC-OC16
G7TC-OC08
G7TC-ID16-5
G7TC-IA16-5
G79-O50C (L = 500 mm)
G7TC IA16 G7VC Series
G70A Series
G70D Series
e G79-O25C (L = 250 mm)
Connector-Terminal Conversion Unit XW2B Series
Digital Display Unit M7F
I/O Block G7TC-ID16
G7TC-IA16
e
G79-I50C (L = 500 mm)
G7TC-OC16-1
G79-I25C (L = 250 mm)
50
Sensor Terminal SRT1-D08S
Connector Connection Models that
Allows Easy Connection to Sensors and
Output Devices
Sensors with easy-to-wire connectors are easily
attached or detached.
Connects to 2-wired sensors.
Remote teaching of the Sensor Terminal is possible
with the PC by using output signals of the Sensor
Terminal.
DIN track mounting and screw mounting are
available.
Ordering Information
Classification Internal I/O circuit common I/O points Model
For input NPN (– common) 8 input points SRT1-ID08S
For I/O NPN (– common) 4 input/4 output points SRT1-ND08S
For output NPN (– common) 8 output points SRT1-OD08S
Specifications
Ratings
Input
Item SRT1-ID08S/-ND08S
Input current 10 mA max./point
ON delay time 1 ms max.
OFF delay time 1.5 ms max.
ON voltage 12 VDC min. between each input terminal and VCC, the external sensor power supply
OFF voltage 4 VDC max. between each input terminal and VCC, the external sensor power supply
OFF current 1 mA max.
Insulation method Photocoupler
Input indicator LED (yellow)
Output
Item SRT1-ND08S SRT1-OD08S
Rated output current 20 mA/point 30 mA/point
Residual voltage 1 V max. 0.6 V max.
ON delay time 1 ms max. ---
OFF delay time 1.5 ms max. ---
Leakage current 0.1 mA max.
Insulation method Photocoupler
Output indicator LED (yellow)
SRT1-D08S SRT1-D08S
51
Characteristics
Communications power supply
voltage (see note 1)
14 to 26.4 VDC
Current consumption (see note 2) 50 mA max. at 24 VDC
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits)
Noise immunity Power supply normal: ±600 V for 10 minutes with a pulse width of 100 ns to 1 ms
Power supply common: ±1,500 V for 10 minutes with a pulse width of 100 ns to 1 ms
Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance Malfunction: 200 m/s2
Destruction: 300 m/s2
Mounting method M4 screw mounting or 35-mm DIN track mounting
Mounting strength No damage when 50 N pull load was applied for 10 s in all directions (except the DIN track
directions and a pulling force of 10 N
Terminal strength No damage when 50 N pull load was applied for 10 s in all directions
Tighten each screw to a torque of 0.6 to 1.18 N m
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight SRT1-ID08S/OD08S: 100 g max., SRT1-ND08S: 80 g max.
Note: 1. The communications power supply voltage must be 20.4 to 26.4 VDC if the Unit is connected to 2-wired proximity sensors.
2. The above current consumption is a value with all the points turned OFF excluding the current consumption of the sensor connected
to the Sensor Terminal.
External Sensor Power Supply
Power supply voltage 13.5 to 26.4 VDC
Current consumption 500 mA max. in total
Nomenclature
SRT1-ID08S
SRT1-ND08S
CompoBus/S Terminals
Connect the CompoBus/S communications
cable.
Sensor Terminal
I/O Connectors
Connect the
cables from the
sensors here.
I/O Indicators
Indicate the status of each point.
(Lit when the input or output is ON.)
The SRT1-ID08S has 8 input indicators
and the SRT1-ND08S has 4
input indicators and 4 output indicators.
DIP Switch
The DIP switch’s pins have the
following functions:
Pins 1 to 4: Node number setting
Pin 5: Reserved (Always OFF.)
Pin 6: Hold/clear outputs for communications
error
DIN Track Mounting Hook
Used when mounting the Unit
to a DIN track.
CompoBus/S Indicators
Indicate the operating status of the Slave and the status
of communications.
Mounting Screw Holes
Used when screwing the Unit to
a control panel.
Indicators
PWR
COMM
ERR
IN0 to 3
IN0 to 7
OUT0 to 3
Communications Power
Supply Terminals
Connect the communications
power supply.
SRT1-D08S SRT1-D08S
52
Indicators
Indicator Name Display Color Meaning
PWR Power supply Lit Green The communications power supply is ON.
Not lit The communications power supply is OFF.
COMM Communication Lit Yellow Normal communications
Not lit A communications error has occurred or the Unit is in standby status.
ERR Communication Lit Red A communications error has occurred.
error Not lit Normal communications or the Unit is in standby status.
0 to 3
(4 inputs/outputs)
Input Lit Yellow The corresponding input is ON.
0 to 7 (8 inputs) Not lit The corresponding input is OFF or the Unit is in standby status.
0 to 3
(4i t / t t )
o Output Lit Yellow The corresponding output is ON.
4 inputs/outputs) Not lit The corresponding output is OFF or the Unit is in standby status.
Switch Setting
All pins are factory-set to OFF.
Hold/Clear outputs for
Node number communications error
settings
Reserved (OFF)
Pin 5 (Reserved)
Always set pin 5 to OFF.
Output HOLD/CLEAR Mode (SRT-ND16S)
HOLD Function
OFF Output status is cleared when a
communications error occurs.
ON Output status is maintained when a
communications error occurs.
Node Number Settings
Node number 1 2 4 8
0 OFF OFF OFF OFF
1 ON OFF OFF OFF
2 OFF ON OFF OFF
3 ON ON OFF OFF
4 OFF OFF ON OFF
5 ON OFF ON OFF
6 OFF ON ON OFF
7 ON ON ON OFF
8 OFF OFF OFF ON
9 ON OFF OFF ON
10 OFF ON OFF ON
11 ON ON OFF ON
12 OFF OFF ON ON
13 ON OFF ON ON
14 OFF ON ON ON
15 ON ON ON ON
SRT1-D08S SRT1-D08S
53
SRT1-OD08S
DIP Switch
Mounting Screw Holes
Used when screwing the Unit to a control panel.
CompoBus/S Indicators
Indicate the operating status of the Slave and the status of communications.
Output Indicators
Indicate the output status
of each channel.
Communications Terminals
Communications Power
Supply Terminals
Connect the communications
cable.
DIN Track
Mounting Hook
Used when mounting the Unit
to a DIN track.
Output Connectors
Connect the cables from
the output device.
Switch Setting
All pins are factory-set to OFF.
Hold/Clear outputs for
Node number communications error
settings
Reserved (OFF)
Pin 5 (Reserved)
Always set pin 5 to OFF.
Output HOLD/CLEAR Mode (SRT-ND16S)
HOLD Function
OFF Output status is cleared when a
communications error occurs.
ON Output status is maintained when a
communications error occurs.
Node Number Settings
Node number 4 3 2 1
0 OFF OFF OFF OFF
1 OFF OFF OFF ON
2 OFF OFF ON OFF
3 OFF OFF ON ON
4 OFF ON OFF OFF
5 OFF ON OFF ON
6 OFF ON ON OFF
7 OFF ON ON ON
8 ON OFF OFF OFF
9 ON OFF OFF ON
10 ON OFF ON OFF
11 ON OFF ON ON
12 ON ON OFF OFF
13 ON ON OFF ON
14 ON ON ON OFF
15 ON ON ON ON
SRT1-D08S SRT1-D08S
54
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT1-ID08S
Mounting Holes
SRT1-ND08S
Mounting Holes
100
Cover opening and
closing directions
Two, 4.2 dia or M4
Four, M3
50
50
70 max.
Four, M3
Cover opening and
closing directions
Two, 4.2 dia or M4
(75)
(75)
SRT1-D08S SRT1-D08S
55
SRT1-OD08S
100
Cover opening and
closing directions
(75)
2.8
37
Two, 4.2 dia. or M4
7 Four, M3
50
40
92
40±0.2
92±0.2
Mounting Holes
4
6
Cable Connector for SRT1-OD08S
Applicable conductor size (mm2) Model
0.3 to 0.5 XS8A-0441
0.14 to 0.2 XS8A-0442
0.3 to 0.5 XS8B-0443
XS8B-0443
(Relay Socket )
XS8A-044
(Cable Connector)
Plug
connector
Cover
Model number
Pin number
Check window
Calculate the cable conductor size as explained below.
The following information is given on each sensor cable:
Cable dia. (Number of conductors/Conductor dia.)
Conductor size (mm2) = (Conductor dia./2)2 x p x Number of conductors
Example: E3S-A
4 dia. (18/0.12)
Conductor size (mm2) = (0.12/2)2 x 3.14 x 18 0.20
The conductor size is 0.2 mm2. Therefore, use the XS8A-0442.
SRT1-D08S SRT1-D08S
56
Installation
Internal Circuit Configuration
SRT1-ID08S SRT1-ND08S
Internal
circuit
Photocoupler
Internal
circuit
Photocoupler
Photocoupler
SRT1-OD08S
Internal
circuit
For one output
External Connections
SRT1-ID08S SRT1-ND08S
Three-wired Sensor Two-wired Sensor Sensor with Teaching Function
Sensor with External Diagnostic function
Sensor with Bank-switching Function
Three-wired Sensor
Brown
Black
Blue
Sensor
Brown
Blue
Sensor
Brown
Black
Pink
Blue
Sensor
Brown
Black
Blue
Sensor
Two-wired Sensor
Brown
Blue
Sensor
SRT1-D08S SRT1-D08S
57
Terminal Arrangement and I/O Device Connection Example
Input
SRT1-ID08S
I/O
SRT1-ND08S
Photoelectric Sensor
Proximity Sensor
(Sensor with Teaching Function, Sensor with External Diagnostic
function, Sensor with Bank-switching Function)
24 VDC
Communications
power supply
CompoBus/S
communications
CompoBus/S
communications
Communications
power supply
Blue
Brown
Blue
Black
Brown
Photoelectric Sensor
Proximity Sensor
(3-wired Sensor)
Proximity Sensor
(2-wired Sensor)
CompoBus/S
communications
Communications
power supply
CompoBus/S
communications
Communications
power supply
Brown
Brown
Blue
24 VDC
Orange
CompoBus/S
CompoBus/S
Output
SRT1-OD08S CompoBus/S
SOURCE
24 VDC
BDL BDH – +
CompoBus/S
communications
Communications
power supply
Output connector
Pin number
Solenoid, etc. Valve, etc.
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
General Safety Precautions
Installation Environment
Do not install the Unit in the following places.
• Places with water, oil, or chemical sprayed on the Unit.
• Places with rapid temperature changes.
• Places with high humidity resulting in condensation.
• Places with intense electric and magnetic fields.
• Places with excessive vibration or shock.
Wiring
To prevent inductive noise, do not wire power lines or high-tension
lines along with or near the cables.
Make sure that the polarity of each terminal is correct.
Make sure that the communications path and power line are connected
correctly.
Secure the cables properly. Do not pull the cables with strong force,
otherwise the cables may be disconnected from the terminals or
connectors of the Unit.
Do not touch the Unit when the Unit is used in places with high ambient
temperatures because the surface temperature of the Unit may
be high.
Do not use paint thinner to clean the surface of the Unit, otherwise
the surface will be damaged or discolored.
SRT1-D08S SRT1-D08S
58
Correct Use
Use the Unit under its rated conditions.
Mount the Unit with M4 screws or to DIN tracks securely.
Typical Causes of Communications Errors
• The cables are not connected correctly.
• The node number setting is incorrect.
• The baud rate setting is incorrect.
• There is a strong noise source, such as an inverter motor, near
the Unit. Install the Unit as far as possible from the noise source
or shield the noise source.
Others
Use OMRON’s XS8A-0441 or XS8A-0442 Connectors with the
Unit.
Insert each connector into the Unit until the connector snaps in
place. Make sure that terminal number 1 of the connector is on the
lock lever side when inserting the connector.
Refer to the CompoBus/S Operation Manual (W266) for wiring the
Unit.
59
Sensor Amplifier Terminal SRT1-D04S
Snap On to Connect and
Save Wiring Effort
The 4-channel fiber photoelectric amplifiers in
Terminals with connectors offer a low cost and
space savings.
The product lineup included Terminal Block Units
for easy connection to sensors with amplifiers, limit
switches, etc.
Connect to up to eight channels of sensors by using
Expansion Blocks.
Features
Low Cost and Space Savings with
Four-channel Fiber Connectors
Just Snap On to Connect
Connector Units
Fiber connector (1 channel)
Fiber connector (4 channels)
Terminal Block Unit
Photoelectric sensor
Various input units
can be connected.
Proximity sensor
Basic switch and limit switch
SRT1-D04S SRT1-D04S
60
Ordering Information
CompoBus/S Sensor Amplifier Terminals
Classification I/O points Model
Communications 4 SRT1-TID04S
SRT1-TKD04S
Expansion SRT1-XID04S
SRT1-XKD04S
Connector Units
Classification Specifications Model
E3X-N Connector Type General-purpose, 1 channel E3X-NT16
Multi-functional, 1 channel E3X-NT26
Long distance, high accuracy, 1 channel E3X-NH16
Multi-functional, 4 channels E3X-NM16
Terminal Block Unit One input point E39-JID01
SRT1-D04S SRT1-D04S
61
Specifications
Characteristics
CompoBus/S Sensor Amplifier Terminals
Item Communication Terminals Expansion Terminals
Model SRT1-TID04S SRT1-TKD04S SRT1-XID04S SRT1-XKD04S
Communications power
supply voltage
14 to 26.4 VDC (See note 1) --- ---
I/O points 4 input points
Connected sensors Total of four E3X-NT6
or E39-JID01
(See note 2)
One E3X-NM16
(See note 2)
Total of four E3X-NT6
or E39-JID01
One E3X-NM16
Current consumption 60 mA max. (See note 3) 10 mA max. (See note 3)
Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits)
Noise immunity Power supply normal: ±600 V for 10 minutes with a pulse width of 100 ns to 1 ms
Power supply common: ±1,500 V for 10 minutes with a pulse width of 100 ns to 1 ms
Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance Malfunction: 200 m/s2
Destruction: 300 m/s2
Mounting method M4 screw mounting or 35-mm DIN track mounting
Mounting strength No damage when 50 N pull load was applied for 10 s in all directions
(except the DIN track directions and a pulling force of 10 N
Terminal strength No damage when 49 N pull load was applied for 10 s in all directions.
Tighten each screw to a torque of 0.6 to 1.18 N m.
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight 70 g max. 65 g max. 45 g max. 35 g max.
Note: 1. The communications power supply voltage must be 20.4 to 26.4 VDC if the Terminal is connected to 2-wired proximity sensors.
2. When adding Connector Units, use SRT1-XID04S or SRT1-XKD04S.
3. The value doesn’t include the current consumption of Connector Units.
With E3X-N Connectors
Model E3X-NH16 E3X-NT16 E3X-NT26 E3X-NM16
Current consumption 75 mA max. 50 mA max. 150 mA
Response time 1 ms max. (4.0 ms max.
when connected to the
SRM1-D04S)
500 mS max. (2.0 ms max. when connected to the SRT1-D04S)
Timer function Not available OFF-delay timer (fixed to 40 ms)
Remote teaching input Not available Available (Remote teaching disabled)
Indicator Orange LED: Lit during output operation
Green LED: Lit with stable light reception or no light
Teaching confirmation
function
Indicators (red/green LED) and buzzer
Output Light ON and Dark ON switch selectable
Ambient illumination Sunlight: 10,000 lux max.; incandescent lamp: 3,000 lux max.
Insulation resistance 20 MW max. (at 500 VDC)
Dielectric strength 1,000 VAC at 50/60 Hz for 1 min
Vibration resistance Destruction:10 to 55 Hz, 1.5-mm double amplitude
Shock resistance Destruction:500 m/s2
Mounting method Connector connection to the SRT1-D04S
Mounting strength No damage when 49 N pull load was applied for 10 s in all directions
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight 30 g max. 30 g max. 30 g max. 60 g max.
SRT1-D04S SRT1-D04S
62
Terminal Block Units
Model E39-JID01
Input current 10 mA max.
ON voltage 12 VDC min. between input terminal and external sensor power supply
OFF voltage 4 VDC max. between input terminal and external sensor power supply
OFF current 1 mA max.
ON delay time 1 ms max. (connected to SRT1-D04S)
OFF delay time 1.5 ms max. (connected to SRT1-D04S)
Input indicators LED (Orange)
External sensor current capacity 50 mA max.
Vibration resistance 10 to 55 Hz, 1.5-mm double amplitude
Shock resistance Malfunction: 200 m/s2
Destruction: 300 m/s2
Mounting method M4 screws or 35-mm DIN track mounting
Mounting strength No damage when 50 N pull load was applied for 10 s in all directions
(except the DIN track directions and a pulling force of 10 N
Terminal strength No damage when 49 N pull load was applied for 10 s in all directions.
Tighten each screw to a torque of 0.6 to 1.18 N m.
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight 25 g max.
SRT1-D04S SRT1-D04S
63
Nomenclature
SRT1-TID04S
SRT1-TKD04S
Mounting Screw Holes
Communications
Terminals
Communications Power Supply
Terminals
Contact 0
Contact 1
Contact 2
Contact 3
DIN Track Mounting Hook
Node Number Settings
Refer to the CompoBus/S Operation Manual (W266)
for details on DIP switch settings.
Mounting Screw Holes
DIN Track Mounting Hook
Contacts 0 to 3
Communications Power Supply
Terminals
Connect a 24-VDC power supply.
Communications
Terminals
Connect a communications
cable.
DIP Switch
Indicators
Indicator Name Display Color Meaning
PWR Power supply Lit Green The communications power supply is ON.
Not lit
G ee
The communications power supply is OFF.
COMM Communications Lit Yellow Normal communications.
Not lit
e o
A communications error has occurred or the Unit is in standby status.
ERR Communications Lit Red A communications error has occurred.
error Not lit
ed
Normal communications or the Unit is in standby status.
SRT1-D04S SRT1-D04S
64
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT1-TID04
Two, 4.2 dia. or M4
Two, 4.5 dia.
Mounting Holes
(75)
3.4
Two, 4.2 dia. or M4
Two, 4.5 dia. SRT1-XID04S
Mounting Holes
(75)
3.4
SRT1-D04S SRT1-D04S
65
SRT1-TKD04S
Two, 4.2 dia. or M4
Two, 4.5 dia.
Mounting Holes
(75)
3.4
SRT1-XKD04S
Two, 4.2 dia. or M4
Two, 4.5 dia.
Mounting Holes
(75)
3.4
SRT1-D04S SRT1-D04S
66
E3X-NM16
Output indicator Stability indicator
Eight, 2.4 dia.
E3X-NT6
Output indicator Stability indicator
Two, 2.4 dia.
SRT1-D04S SRT1-D04S
67
E3X-NH16
Light level indicators
Threshold indicators
Output indicator
Two, 2.4 dia.
E39-JID01 Output indicator
Installation
Internal Circuit Configuration
E39-JID01
Internal
circuit
SRT1-D04S SRT1-D04S
68
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Terminal.
Refer to page 80 for precautions common to all SRT1 Terminals.
General Safety Precautions
Connector Units
Use only the Connector Units listed in this data sheet for the Sensor
Amplifier Units.
E39-JID01 Terminal Block Unit
Do not apply any voltage to the Terminal Block Unit.
Correct Use
Expanding Sensor Amplifier Terminals
1. Remove the cover from the side of the SRT1-TD04S. (See
Figure 1.)
2. When the cover is removed, you can see the expansion
connector inside.
3. Connect this expansion connector to the connector located
on the side of the SRT1-XD04S. (See Figure 2.)
Figure 1
Cover
Figure 2
Connector
Attaching and Removing Connector Units
(SRT1-TID04S, SRT1-XID04S, E3X-NT6, E39-JID01)
Attaching Connector Units
1. Hook Section A of the Connector Unit onto Section B of the
Sensor Amplifier Terminal.
2. Push in the Connector Unit until Section C locks inside
Section D of the Sensor Amplifier Terminal.
Section C
Section D
Section A
Section B
Bottom View
Section A
Removing Connector Units
1. While pushing Section D, pull the Connector Unit in direction
E.
2. When Section D releases from the lock, the Connector Unit
can be removed.
Push here
Section D
SRT1-D04S SRT1-D04S
69
Attaching or Removing Connector Unit
(SRT1-TKD04S, SRT1-XKD04S, E3X-NM16)
Attaching Connector Unit
1. Hook Section A of the Connector Unit onto Section B of the
Sensor Amplifier Terminal.
2. Push in the Connector Unit until Section C locks inside
Section D of the Sensor Amplifier Terminal.
Bottom View
Section A
Section C
Section D
Section A
Section B
Removing Connector Unit
1. While pushing Section D, pull the Connector Unit in direction
E.
2. When Section D releases from the lock, the Connector Unit
can be removed.
Push here
Section D
Channel Numbers
Channel numbers 1 to 4 of the E3X-NM16 correspond to contact
numbers 0 to 3 of the SRT1-TKD04S, and to contact numbers 4 to 7
of the SRT1-XKD04S.
70
Analog Input Terminal SRT2-AD04
Compact Analog Input Model is the
Same Shape as 16-point Remote I/O
Terminals
Allows flexible input point settings up to a maximum
of four points.
Resolution: 1/6,000
Takes only 1 ms to exchange each input point.
Wide input ranges available.
105 x 48 x 50 (W x H x D)
Ordering Information
Classification I/O points Model
Analog Input Terminal 1 to 4 (selectable with DIP switch) SRT2-AD04
Note: For details about connecting the SRT2-AD04 to the Master Unit. Refer to page 10.
Specifications
Ratings
Input
Item Voltage input Current input
Max. signal input ±15 V ±30 mA
Input impedance 1 MW max. Approx. 250 W
Resolution 1/6,000 (FS)
Total 25°C ±0.3% FS ±0.4% FS
accuracy –10 to 55°C ±0.6% FS ±0.8% FS
Conversion time 4 ms/4 points, 3 ms/3 points, 2 ms/2 points, and 1 ms/1 point
Dielectric strength 500 VAC for 1 min between communications power supply, analog input, and communications terminals (see note)
Note: There is no insulation between analog inputs.
Characteristics
Communications power supply voltage 14 to 26.4 VDC (possible to provide through dedicated flat cable)
Current consumption 100 mA max.
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Dielectric strength 500 VAC (between insulated circuits)
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2
Shock resistance 200 m/s2
Mounting strength No damage with 100 N pull load applied in all directions.
Terminal strength No damage with 100 N pull load applied
Screw tightening torque 0.3 to 0.5 N m
Ambient temperature Operating: –10°C to 55°C
Storage: –25°C to 65°C
Ambient humidity Operating: 25% to 85% (with no condensation)
Weight Approx. 120 g
SRT2-AD04 SRT2-AD04
71
Nomenclature
SRT2-AD04
Mounting Screw Holes
DIN Track Mounting Hook
Terminal Block
Indicators
Indicators
Indicator Name Color Display Meaning
PWR Power supply Green Lit The communications power supply is ON.
Not lit The communications power supply is OFF.
COMM Communication Yellow Lit Normal communications
Not lit A communications error has occurred or the Unit is in standby status.
ERR Communication Red Lit A communications error has occurred.
error Not lit Normal communications or the Unit is in standby status.
U.ERR Unit error Red Lit An error has occurred in the Unit.
Not lit Normal communications or the Unit is in standby status.
DIP Switch (SW101)
(Open cover to access.)
Pin 1 Pin 2 Input points
OFF OFF 4 points (default setting)
OFF ON 3 points (inputs 0 to 2 enabled)
ON OFF 2 points (inputs 0 and 2 enabled)
ON ON 1 point (input 0 enabled)
Pin 3 Communications mode
OFF High-speed communications (default setting)
ON Long-distance communications
Pin 4 Be sure to turn OFF.
Pin No. Node address
Pin 5 23
Pin 6 22
Pin 7 21
Pin 8 20
The default setting is for all of these pins to be OFF.
DIP Switch (SW102)
(Open cover to access.)
Pin 1 Pin 2 Pin 3 Range for inputs 0, 1
Pin 4 Pin 5 Pin 6 Range for inputs 2, 3
OFF OFF OFF 0 to 5 (V) (default setting)
ON OFF OFF 1 to 5 (V)
OFF ON OFF 0 to 10 (V)
ON ON OFF –10 to 10 (V)
OFF OFF ON 4 to 20 (mA)
ON OFF ON 0 to 20 (mA)
Do not make any settings other than the ones listed above.
Pin 7 Mean value processing
OFF Without mean value processing (default setting)
ON With mean value processing (mean for 8 operations)
Pin 8 Be sure to turn OFF.
SRT2-AD04 SRT2-AD04
72
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT2-AD04
Mounting Holes
Two, 4.2 dia. or M4
Installation
Internal Circuit Configuration
SRT2-AD04
Isolation
DC-DC static
converter
Internal circuit
Input 0
Input 1
Input 2
Input 3
Analog ground
Terminal Arrangement
SRT2-AD04
Note: When the input is current input, short-circuit the “V+” terminals
and the “I+” terminals. When short-circuiting, use the
short-circuiting tool provided as an accessory.
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
For details about general precautions, refer to page 80.
Connections to the Master Unit
Connections cannot be made to the following Master Units. If the following
Master Units are connected, incorrect data may be transferred.
C200HW-SRM21 (-V1 and later versions supported)
CQM1-SRM21 (-V1 and later versions supported)
SRM1-C0, SRM1-C0-V1 (-V2 and later versions supported)
C200PC-ISA2-SRM
3G8B3-SRM0
SDD-CS1 (made by NKE Ltd.)
73
Analog Output Terminal SRT2-DA02
Compact Analog Output Model is the
Same Shape as 16-point Remote I/O
Terminals
Two output points or 1 output point is selectable.
Resolution: 1/6,000
105 x 48 x 50 (W x H x D)
Ordering Information
Classification I/O points Model
Analog Output Terminal 1 or 2 (selectable with DIP switch) SRT2-DA02
Note: For details about connecting the SRT2-DA02 to the Master Unit, refer to page 10.
Specifications
Ratings
Output
Item Voltage output Current output
External output permissible
load resistance
5 kW min. 600 W max.
Output impedance 0.5 W max. ---
Resolution 1/6,000 (FS)
Total 25°C ±0.4% FS
accuracy –10 to 55°C ±0.8% FS
Conversion time 2 ms/2 points and 2 ms/1 point
Dielectric strength 500 VAC for 1 min between communications power supply, analog output, and communications terminals (see note)
Note: There is no insulation between analog outputs.
Characteristics
Communications power supply voltage 14 to 26.4 VDC (power supply possible from dedicated flat cable)
Current consumption (see note) 170 mA max.
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Dielectric strength 500 VAC (between insulated circuits)
Noise immunity Conforms to IEC61000-4-4, 2 kV (power lines)
Vibration resistance 10 to 150 Hz, 1.0-mm double amplitude or 70 m/s2
Shock resistance 200 m/s2
Mounting strength No damage when 100 N pull load was applied in all directions
Terminal strength No damage when 100 N pull load was applied
Screw tightening torque 0.3 to 0.5 N m
Ambient temperature Operating: –10°C to 55°C
Storage: –25°C to 65°C
Ambient humidity Operating: 25% to 85% (with no condensation)
Weight Approx. 100 g
Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external load.
SRT2-DA02 SRT2-DA02
74
Nomenclature
SRT2-DA02
Mounting Screw Holes
DIN Track Mounting Hook
Terminal Block
Indicators
Indicators
Indicator Name Color Display Meaning
PWR Power supply Green Lit The communications power supply is ON.
Not lit The communications power supply is OFF.
COMM Communication Yellow Lit Normal communications
Not lit A communications error has occurred or the Unit is in standby status.
ERR Communication Red Lit A communications error has occurred.
error Not lit Normal communications or the Unit is in standby status.
U.ERR Unit error Red Lit An error has occurred in the Unit.
Not lit A communications error has occurred or the Unit is in standby status.
DIP Switch (SW101)
(Open cover to access.)
Pin 1 Be sure to turn OFF.
Pin 2 Output points
OFF 2 points (default setting)
ON 1 point (output 0 enabled)
Pin 3 Communications mode
OFF High-speed communications (default setting)
ON Long-distance communications
Pin 4 Be sure to turn OFF.
Pin No. Node addresses
Pin 5 23
Pin 6 22
Pin 7 21
Pin 8 20
The default setting is for all of these switches to be OFF.
DIP Switch (SW102)
(Open cover to access.)
Pin 1 Pin 2 Pin 3 Range for output 0
Pin 4 Pin 5 Pin 6 Range for output 1
OFF OFF OFF 0 to 5 (V) (default setting)
ON OFF OFF 1 to 5 (V)
OFF ON OFF 0 to 10 (V)
ON ON OFF –10 to 10 (V)
OFF OFF ON 4 to 20 (mA)
Do not make any settings other than the ones listed above.
Pin 7 Pin 8 Output during communications error
OFF OFF Clear at the output lower limit when
communications error occurs. (default
setting)
OFF ON Clear at the output upper limit when
communications error occurs.
ON OFF Clear at the output lower limit when
communications error occurs (however, if
the range is –10 to 10 V, the output will be
0).
ON ON Output held when communications error
occurs.
SRT2-DA02 SRT2-DA02
75
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT2-DA02
Mounting Holes
Two, 4.2 dia. or M4
Installation
Internal Circuit Configuration
SRT2-DA02
Isolation
DC-DC
static
converter
Internal circuit
Output 0
Output 1
Analog ground
Terminal Arrangement
SRT2-DA02
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
For details about general precautions, refer to page 80.
Connections to the Master Unit
Connections cannot be made to the following Master Units. If the following
Master Units are connected, incorrect data may be transferred.
C200HW-SRM21 (-V1 and later versions supported)
CQM1-SRM21 (-V1 and later versions supported)
SRM1-C0, SRM1-C0-V1 (-V2 and later versions supported)
C200PC-ISA2-SRM
3G8B3-SRM0
SDD-CS1 (made by NKE Ltd.)
76
Remote I/O Module SRT1-IDP/ODP
Module Type that Allows PCB Mounting
Compact size at 60 x 16 x 35 (W x H x D)
Lineup now includes the 16-point input model and
16-point output model.
Ordering Information
I/O classification Internal I/O circuit
common
I/O points Rated voltage I/O rated voltage Model
Input NPN (+ common) 16 24 VDC 24 VDC SRT1-ID16P
Output NPN (– common) SRT1-OD16P
Specifications
Ratings
Input (SRT1-ID16P)
Input current 2 mA max./point
ON delay time 1.5 ms max.
OFF delay time 1.5 ms max.
ON voltage 15 VDC min. between each input terminal and BS+ terminal
OFF voltage 5 VDC max. between each input terminal and BS + terminal
Output (SRT1-OD16P)
Rated output current 0.2 A/point, 0.6 A/common
Residual voltage 0.6 V max. between each output terminal and G terminal at 0.2 A
Leakage current 0.1 mA max. between each output terminal and G terminal at 24 VDC
SRT1-IDP/ODP SRT1-IDP/ODP
77
Characteristics
Communications power supply
voltage
20.4 to 26.4 VDC
I/O power supply voltage 24 VDC +10%/–15%
Current consumption (see note) 60 mA max.
Connection method Multi-drop method and T-branch method
Secondary branches cannot be connected to T-branch lines.
Connecting Units 8 Input Terminals and 8 Output Terminals per Master
Dielectric strength 500 VAC for 1 min (1-mA sensing current between insulated circuits)
5-V output current 20 mA max. (5 V 0.5 V)
LED drive current (COMM, ERR) 10 mA max. (5 VDC)
SW carry current
(ADR0 to 3, HOLD)
1 mA max.
Ambient temperature Operating: 0°C to 55°C (with no icing or condensation)
Storage: –20°C to 65°C (with no icing or condensation)
Ambient humidity Operating: 35% to 85%
Weight 35 g max.
Note: The above current consumption is the value with all points turned ON excluding the current consumption of the external sensor connected
to the input model and the current consumption of the load connected to the output model.
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SRT1-ID16P
SRT1-OD16P
Incorrect insertion
prevention pin
PCB dimensions (top view)
No cumulative tolerance allowed
16
2.54x15=38.1
27.94±0.1
2.54±0.1
2.54x15=38.1 8.95±0.1
1.53±0.1
0.63
27.94±0.1
1.6
1.6 dia.
0.63
3.5
2.54
35
60
2.2 dia. +0.1
0
32-0.9 dia. +0.1
0
SRT1-IDP/ODP SRT1-IDP/ODP
78
Installation
Internal Circuit Configuration
SRT1-ID16P SRT1-OD16P
Internal circuit
Internal circuit
External Connections
Communications
Two-wired
proximity
sensor
BS– or G
Input Module (SRT1-ID16P) Output Module (SRT1-OD16P)
Communications
Relay
Internal circuit
Internal circuit
D1: Reverse voltage prevention diode
Note: NC in parentheses is for the Input Modules.
Node Number Settings and
Output HOLD/CLEAR Mode
Internal circuit
BS– or G
Note: Refer to the CompoBus/S Operation Manual (W266) for
details on the switch.
Indicators
R: LED current limiting resistor
LED1: LED for COMM
LED2: LED for ERR
The maximum current for LED1 and 2 is 10 mA.
Internal circuit
The 5-V Output Terminals have positive power supplies (maximum
output current of 20 mA) for the ERR and COMM LEDs. Recommended
LED colors are red for ERR and yellow for COMM.
SRT1-IDP/ODP SRT1-IDP/ODP
79
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
Refer to page 80 for precautions common to all SRT1 Terminals.
Correct Use
Noise Protection Circuit
Add the following protection circuit if noise is generated from the
power supply, input section, or output section.
Power Supply Noise Protection Circuit
L: Coil for the common mode
Install the coil near the SRT1.
50 V
100 mF
50 V
0.1 mF
BS
L
V
BS
Input Section Noise Protection Circuit
C: 0.1 mF min.
R: Resistor for limiting current to PC
PC: Photocoupler
Input device
0 to 15
V
R
G
PC
C
Output Section Noise Protection Circuit
V1 and V2: Power supply.
R: Resistor for limiting current to PC
PC: Photocoupler
0 to 15 Load
G
V2
PC
R
V1
5-V Output Terminals
The 5-V Output Terminals have positive power supplies (maximum
output current of 20 mA) for the ERR and COMM LED. Use them as
shown below. Recommended LED colors are red for ERR and yellow
for COMM.
Wiring Method
R: LED current limiting resistor
LED1: LED for COMM
LED2: LED for ERR
The maximum current for the LED1 and 2 is 10 mA.
LED1
R R
5 VOUT
COMM
ERR
LED2
SRT SRT
80
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Terminal.
The following precautions are the same for all SRT1 Terminals.
Refer also to the precautions specified for individual Terminals.
General Safety Precautions
Wiring
Turn OFF the Unit before wiring the Unit and do not remove the terminal
block cover or touch the terminal block while the Unit is turned
ON, otherwise an electric shock may occur.
Do not impose any voltage other than the rated voltage on the input
terminal. Doing so may result in damage to the Unit or cause the Unit
to malfunction.
Relay I/O Type
SRT1-ROC08 and SRT2-ROC16
Do not connect the Unit to loads operating at any voltage or consuming
a total current exceeding the permissible switching voltage
or current of the Unit. Doing so may result in the faulty insulation,
contact weld, or faulty contact of the relays, or damage to the relays,
or cause the relays to malfunction or burn.
The life of a relay varies with the switching condition. Test the relays
under the actual operating conditions before using the relays within
the permissible switching frequency. The use of deteriorated relays
may result in the faulty insulation of the relays or cause the relays to
burn.
Do not use the Unit in places with inflammable gas. Doing so may
result in a fire or explosion due to the heat of the relays or a spark
from the relays when they are switched.
Transistor, Power MOS FET, and SSR I/O Types
SRT1-OD04, SRT2-OD08, SRT2-OD16, SRT1-OD16P,
SRT1-ROF08, and SRT2-ROF16
Do not connect the Unit to loads consuming a total current exceeding
the rated output current of the Unit. Doing so may damage the
output element and a short or open-circuit malfunction may result.
If the Unit is connected to a DC inductive load, connect a diode to the
Unit to protect the Unit from counter-electromotive voltage, otherwise
the counter-electromotive voltage may damage the output element
and a short or open-circuit malfunction may result.
Correct Use
Replacing Relays
Use the relay removal tool to the left of the screw terminals to
replace relays.
Turn OFF the Unit to replace relays, otherwise an electric shock
may occur or the Unit may malfunction.
Installation Environment
Do not install the Unit in the following places. Doing so may result in
damage to the Unit or cause the Unit to malfunction.
• Places with direct sunlight.
• Places with ambient temperature ranges not within 0°C to 55°C.
• Places with rapid temperature changes resulting in condensation
or relative humidity ranges not within 10% to 90%.
• Places with corrosive or inflammable gas.
• Places with excessive dust, salinity, or metal powder.
• Places with vibration or shock affecting the Unit.
• Places with water, oil, or chemical sprayed on the Unit.
Screw Tightening Torques
Tighten all screws of the Unit properly, otherwise the Unit may malfunction.
• Tighten each terminal screw to a torque of 0.6 to 1.18 N m (6.2
to 12.0 kgf cm).
• Tighten each mounting screw to a torque of 0.6 to 0.98 N m (6.2
to 10.0 kgf cm).
Terminal screws
Mounting screws
Cleaning
Use alcohol or benzine to clean the surface of the Unit. Do not use
paint thinner to clean the surface, otherwise the surface will be damaged
or discolored.
Handling
Do not drop the Unit or shock or vibrate the Unit excessively. Doing
so may result in damage to the Unit or cause the Unit to malfunction.
Disassembling, Repairing, and Modifying
Do not disassemble, repair, or modify the Unit, otherwise an electric
shock may occur or the Unit may malfunction.
81
Position Driver FND-X-SRT
Advanced Servodrivers with Positioner
Functions
DIO and CompoBus/S Models are Newly
Added
Servodriver and positioner are combined into one
Unit.
Conventional U-series, U-series UE type, H-series,
and M-series AC Servomotors can be used.
Feeder control/DTP control and single operation/
automatic incremental/continuous operation are
available.
Easy to set, operate, and adjust.
Ordering Information
Specifications Model
CCoompooBuuss//SS mooddeelss For 200-VAC input 6 A FND-X06H-SRT
12 A FND-X12H-SRT
25 A FND-X25H-SRT
50 A FND-X50H-SRT
For 100-VAC input 6 A FND-X06L-SRT
12 A FND-X12L-SRT
Note: For details, refer to OMNUC FND-X-series User’s Manual (I524).
Specifications
General Specifications
Ambient temperature Operating: 0°C to 55°C
Storage: –10°C to 70°C
Ambient humidity Operating: 35% to 90% (with no icing)
Storage: 35% to 90% (with no icing)
Operating atmosphere No corrosive gases
Dielectric strength 1,500 VACRMS for 1 min at 50/60 Hz
Insulation resistance 5 MW min. (at 500 VDC) between power input terminals and between the power terminal and
the case
Vibration resistance 10 to 150 Hz in X, Y, and Z directions with 0.10-mm single amplitude; acceleration: 9.8 m/s2
max.; time coefficient: 8 min; 4 sweeps
Shock resistance 98 m/s2 max., three times each in X, Y, and Z directions
Degree of protection Built into panel (IP00)
FND-X-SRT FND-X-SRT
82
Performance Specifications
Model (see note 1)
Item
FND-X06H-SRT FND-X12H-SRT FND-X25H-SRT FND-X06L-SRT FND-X12L-SRT
Continuous output current (0-P) 2.0 A 4.8 A 8.0 A 2.0 A 3.0 A
Momentary maximum output
current (0-P)
6.0 A 12 A 25 A 6.0 A 12 A
Input power supply Single-phase 200/240 VAC (170 to 264 V) 50/60 Hz Single-phase 100/115 VAC (85 to
127 V) 50/60 Hz
Position/speed
f db k
os o /U Series (INC) Optical Incremental encoder, 2,048 pulses/revolution
feedback U Series (ABS) Optical Absolute encoder, 1,024 pulses/revolution
U-UE Series Optical Incremental encoder, 1,024 pulses/revolution
H Series Magnetic Incremental encoder, 2,000 pulses/revolution
M Series Resolver, absolute accuracy 0.18° max.; ambient temperature 25°
Applicable load
inertia
U Series (INC) Maximum of 30 times motor’s rotor
inertia
Maximum of 20
times motor’s
rotor inertia
Maximum of 30 times motor’s rotor
inertia
U Series (ABS) Maximum of 20 times motor’s rotor
inertia
Maximum of 18
times motor’s
rotor inertia
Maximum of 20 times motor’s rotor
inertia
U-UE Series Maximum of 30 times motor’s rotor
inertia
Maximum of 20
times motor’s
rotor inertia
Maximum of 30 times motor’s rotor
inertia
H Series Maximum of 10 times motor’s rotor inertia
M Series Maximum of 10 times motor’s rotor inertia
Inverter method PWM method based on IGBT
PWM frequency 10 kHz
Weight Approx. 1.5 kg Approx. 2.5 kg Approx. 1.5 kg
Frequency response (speed
control)
100 Hz (at a load inertia equivalent to motor’s rotor inertia)
Position loop gain 1 to 200 (rad/s)
Feed forward 0% to 200% of speed reference
Pulse rate 1/32,767 (pulse rate 1 / pulse rate 2) 32,767/1
Positioning completion width 1 to 32,767 (pulses)
U Series (INC): 8,192 pulses/revolution; U Series (ABS): 4,096 pulses/revolution;
M Series 24,000 pulses/revolution
Acceleration/Deceleration time 0 to 9,999 (ms); acceleration and deceleration times set separately. Two types can be set for
each. S-curve acceleration/deceleration function available (filter time constant: 0.00 to 32.76 s).
Sequence input 19 pts. (limit inputs, origin proximity, RUN command, START, alarm reset, origin search, JOG
operation, teaching, point selection, position data, deceleration stop)
Photocoupler input: 24 VDC, 8 mA
External power supply: 24 VDC ±1 V, 150 mA min.
Sequence output 15 pts. (brake output, READY, origin search completion, origin, teaching, motor running,
positioning completion, alarm, point output, position selection, speed selection)
Open collector output: 24 VDC, 40 mA
Monitor output
(S t 2 )
o o ou pu Speed monitor 3 V/motor’s rated speed (output accuracy: approx. ±10%)
See note 2.) Current monitor 3 V/motor’s maximum current (output accuracy: approx. ±10%)
Regenerative absorption capacity 13 W + 17 J 24 W + 17 J 37 W + 22 J 13 W + 17 J 17 W + 17 J
Protective functions Overcurrent, overvoltage, voltage drop, resolver disconnection, power status error, clock
stopped, overcurrent (soft), speed amp saturation, motor overload, temporary overload,
resolver error, speed over, error counter over, parameter setting error, software limit over,
coordinate counter over, overrun, encoder disconnection, encoder communications error,
absolute encoder backup error, absolute encoder checksum error, absolute encoder absolute
error, absolute encoder over speed, encoder data not transmitted, BCD data error, present
value undetermined, PTP data not set
Note: 1. When using the 100-VAC-input Position Drivers in combination with the U-series or U-series UE type models, use 200-VAC Servomotors
(-HA, -TA , or -H models).
2. For the monitor output, the monitor items and voltage polarity can be set by parameter UP-25 (monitor output selection).
FND-X-SRT FND-X-SRT
83
Dimensions
Note: All units are in millimeters unless otherwise indicated.
200-VAC FND-X06H-SRT/-X12H-SRT
100-VAC FND-X06L-SRT/-X12L-SRT
200-VAC FND-X25H-SRT
80
68 150
158
170
Three, 6 dia.
158
68
Three, M5
Mounting Holes
Mounting Holes
119
150 107
158
170
Three, 6 dia.
158
Three, M5
107
Position Drivers
Item Model Continuous
output current
(0-P)
Momentary
maximum output
current (0-P)
Input power
supply
Inverter
method
PWM
frequency
Weight
200-VAC input FND-X06H-SRT 2.0 A 6.0 A Single-phase
200/240 VAC
PWM method
b d
10
kH
Approx.
1 5 k
00 C u
FND-X12H-SRT 4.8 A 12 A
S g e ase
(170 to 264 V)
e od
based on
IGBT
0
kHz
o
1.5 kg
FND-X25H-SRT 8.0 A 25 A
50/60 Hz
Approx.
2.5 kg
100-VAC input FND-X06L-SRT 2.0 A 6.0 A Single-phase
100/115 VAC (85
Approx.
1.5 kg
FND-X12L-SRT 3.0 A 12 A
to 127 V)
50/60 Hz
84
Peripheral Devices
Connectors, Cables, and
Terminal-block Terminator
Dedicated Flat Cable Allows
Communication Path Extension and
T-branching with Ease
Ordering Information
Product Appearance Model Specification
Branch Connector SCN1-TH4 ---
Extension Connector SCN1-TH4E ---
Connector Terminator SCN1-TH4T ---
Communications Cable SCA1-4F10 Flat cable, 100 m, 4 conductors
(0.75 mm2 each)
Terminal-block Terminator SRS1-T ---
Note: Branch Connectors and Extension Connectors are sold in blocks of 10 Units.
Peripheral Devices Peripheral Devices
85
Specifications
Ratings/Characteristics
Rated current 4 A
Contact resistance 20 mW max.
Insulation resistance 1,000 MW min. (at 500 VDC)
Withstand voltage 1,000 VAC for 1 min, leakage current: 1 mA max.
Cable pulling strength 50 N (5.1 kgf) min.
Operating temperature –20°C to 70°C
Materials
Housing PA66 resin (UL94V-2)
Branching and extension: Gray
Cover
Terminator: Black
Contact Phosphor bronze and nickel base, tin plated
Dimensions
Note: All units are in millimeters unless otherwise indicated.
SCN1-TH4 Branch Connector
SCN1-TH4E Extension Connector
SCN1-TH4T Connector Terminator
Peripheral Devices Peripheral Devices
86
SRS1-T Terminal-block Terminator
40
Two, 4.4 dia.
30±0.2
Two, 4.2 dia. or M4
20
20
Mounting Holes
Precautions
Refer to the CompoBus/S Operation Manual (W266) before using
the Unit.
Correct Use
The SCN1-TH4, SCN1-TH4E, and SCN1-TH4T are dedicated connectors
for CompoBus/S. Always use dedicated CompoBus/S
cables with these connectors.
Do not locate the cables in places where excessive force may be
imposed on the connectors of the cables such as an area where
cables may entangle feet.
These connectors cannot be reused once they have been attached
to cables. Use new connectors if they were not attached to cables
properly.
Refer to the CompoBus/S Operation Manual (W266) to assemble
the connectors.
CompoBus/S CompoBus/S
87
Ordering Information
Note: Abbreviations for standards: U: UL, C: CSA, CE: EC Directive
Product Appearance Model Specifications Standards
Master Control Units SRM1-C01-V2 Stand-alone model with built-in
controller functions (without
RS-232C)
UL
CSA
CE
(see
SRM1-C02-V2 Stand-alone model with built-in
controller functions and RS-232C
note 2)
Master Units C200HW-SRM21-V1 For C200HX (-ZE), C200HG (-ZE),
C200HE (-ZE), and C200HS
CQM1-SRM21-V1 For CQM1
SYSMAC Boards C200PC-ISA02-SRM
C200PC-ISA12-SRM
For C200HX/HG/HE ---
I/O Link Unit CPM1A-SRT21 8 inputs
8 outputs
UL
CSA
CE
(see
note 2)
Remote Terminals
(Transistor Models)
SRT1-ID04
SRT1-ID04-1
SRT2-ID08
SRT2-ID08-1
SRT2-ID16
SRT2-ID16-1
SRT1-OD04
SRT1-OD04-1
SRT2-OD08
SRT2-OD08-1
SRT2-OD16
SRT2-OD16-1
4 transistor input (NPN)
4 transistor inputs (PNP)
8 transistor inputs (NPN)
8 transistor inputs (PNP)
16 transistor inputs (NPN)
16 transistor inputs (PNP)
4 transistor outputs (NPN)
4 transistor outputs (PNP)
8 transistor outputs (NPN)
8 transistor outputs (PNP)
16 transistor outputs (NPN)
16 transistor outputs (PNP)
Remote Terminals
(M3 Terminal Block Models)
SRT1-ID16T
SRT1-ID16T-1
SRT2-MD16T
SRT2-MD16T-1
SRT2-OD16T
SRT2-OD16T-1
16 transistor inputs (NPN)
16 transistor inputs (PNP)
16 transistor I/O points (NPN)
16 transistor I/O points (PNP)
16 transistor outputs (NPN)
16 transistor outputs (PNP)
CE
(see
note 2)
Remote Terminals
(Relay-mounted Models)
SRT2-ROC08
SRT2-ROC16
SRT2-ROF08
SRT2-ROF16
8 relay outputs
16 relay outputs
8 power MOS FET relay outputs
16 power MOS FET relay outputs
UL
CSA
CE
(see
note 2)
Connector Terminals SRT2-VID08S
SRT2-VID08S-1
SRT2-VOD08S
SRT2-VOD08S-1
SRT2-VID16ML
SRT2-VID16ML-1
SRT2-VOD16ML
SRT2-VOD16ML-1
SRT2-ATT01
SRT2-ATT02
8 transistor input (NPN)
8 transistor inputs (PNP)
8 transistor outputs (NPN)
8 transistor outputs (PNP)
16 transistor inputs (NPN)
16 transistor inputs (PNP)
16 transistor outputs (NPN)
16 transistor outputs (PNP)
Mounting hook A
Mounting hook B
CE
(see
note 2)
Sensor Terminals SRT1-ID08S
SRT1-ND08S
SRT1-OD08S
8 inputs (NPN)
4 automatic teaching points (NPN)
8 outputs
---
CompoBus/S CompoBus/S
88
Product Standards
Appearance Model Specifications
Sensor Amplifier Terminals
for CompoBus/S
SRT1-TID04S
SRT1-TKD04S
SRT1-XID04S
SRT1-XKD04S
--- ---
E3X-N Connector Type E3X-NH16
E3X-NT16
E3X-NT26
Long-distance, high-precision, 1
channel
General-purpose, 1 channel
Multi-functional, 1 channel
E3X-NM16 Multi-functional, 4 channels
Terminal Block Unit E39-JID01 One input point
Analog Input Terminal SRT2-AD04 1 to 4 inputs (set with DIP switch) CE
(see
note 2)
Analog Output Terminal SRT2-DA02 1 or 2 outputs (set with DIP switch)
Remote I/O Modules SRT1-ID16P
SRT1-OD16P
--- ---
Position Drivers FND-X06H-SRT 200-VAC input, momentary maximum
output current: 6.0 A
FND-X12H-SRT 200-VAC input, momentary maximum
output current: 12 A
FND-X25H-SRT 200-VAC input, momentary maximum
output current: 25 A
FND-X06L-SRT 100-VAC input, momentary maximum
output current: 6.0 A
FND-X12L-SRT 100-VAC input, momentary maximum
output current: 12 A
Branch Connector
Extension Connector
Connector Terminator
SCN1-TH4
SCN1-TH4E
SCN1-TH4T
---
Flat Cable SCA1-4F10 100 m
Terminal-block Terminator SRS1-T ---
Note: 1. Refer to the C200HS Catalog (P32).
Refer to the C200HX/C200HG/C200HE (-ZE) Catalog
2. Information on EC Directives
Individual OMRON products that comply with EC Directives conform to the common emission standards of EMC Directives. However,
the emission characteristics of these products installed on customers’ equipment may vary depending on the configuration,
wiring, layout, and other conditions of the control panel used. For this reason, customers are requested to check whether the emission
characteristics of the entire machine or equipment comply with the EMC Directives.
CompoBus/S CompoBus/S
89
Model Number Legend
SRT-
2 3 4 5 6 7
-1
1
1. Communications Mode
1: High-speed communications mode
2: High-speed/Long-distance communications mode
2. I/O Module Replacement
None: Impossible
R: Possible (Relays and power MOS FET relays)
3. I/O Specifications
I: Input
O: Output
N: Input and output (with remote teaching)
AD: Analog input
DA: Analog output
4. I/O Voltage Specifications
D: DC
C: AC/DC (contact type)
F: AC/DC (power MOS FET type)
5. I/O Points
04: 4 points
08: 8 points
16: 16 points
6. I/O Connection Method
None: Screw terminals
S: Connector
P: PCB terminals
7.
None: NPN
-1: PNP
CompoBus/S CompoBus/S
90
Notes:
Cat. No. Q103-E1-6 Note: Specifications subject to change without notice. Printed in Japan
0200-8C (0796) a
Authorized Distributor:
OMRON Corporation
Systems Components Division
66 Matsumoto
Mishima-city, Shizuoka 411-8511
Japan
Tel: (81)559-77-9633/Fax: (81)559-77-9097
Regional Headquarters
OMRON EUROPE B.V.
Wegalaan 67-69, NL-2132 JD Hoofddorp
The Netherlands
Tel: (31)2356-81-300/Fax: (31)2356-81-388
OMRON ELECTRONICS, INC.
1 East Commerce Drive, Schaumburg, IL 60173
U.S.A.
Tel: (1)847-843-7900/Fax: (1)847-843-8568
OMRON ASIA PACIFIC PTE. LTD.
83 Clemenceau Avenue,
#11-01, UE Square,
Singapore 239920
Tel: (65)835-3011/Fax: (65)835-2711
The essential guide
Harmony
Control and Signalling units
2013
Control and
signalling units
Harmony, simple and innovative solutions
for your applications
World leader in control and signalling components, Schneider Electric continues
its policy of innovation within the Harmony ranges in order to perfect the efficiency
of your dialogue solutions.
Invest with complete
peace of mind!
The right solution for your application
An offer unrivalled in content and
complementarity
Optimised cost saving solutions due
to increased flexibility of the offers,
enabling multiple combinations and
full compatibility
Quality you can rely on
Robust products that comply to the
highest quality standards
Valuable time that you save
Simple selection and quick installation
for all Harmony components
This document is a selection
of the top selling products.
For more information:
http://www.schneider-electric.com
Contents
Pushbuttons, switches, pilot lights and control stations
Ø 16, plastic bezel, Harmony XB6 .......................................................................................... 2 to 4
Ø 8 and 12, pilot lights, Harmony XVL .......................................................................................... 5
Ø 22, metal bezel, Harmony XB4 / Control stations Harmony XAP ...................................... 6 to 9
Ø 22, plastic bezel, Harmony XB5 / Control stations Harmony XAL ................................. 10 to 13
Ø 22, plastic bezel, wireless and batteryless, Harmony XB5R ........................................... 14 to 15
Ø 22, plastic bezel - Monolithic, Harmony XB7 .................................................................. 16 to 17
Ø 30, metal and plastic bezel, Harmony 9001K, 9001SK .................................................. 18 to 20
Cam switches
Harmony K series ............................................................................................................... 21 to 22
Signalling solutions
Ø 40, 60, 100 mm monolithic tower lights, Harmony XVC ........................................................... 23
Ø 45 mm monolithic beacons and tower lights, accessories, Harmony XVDLS / XVC ............... 24
Ø 70 mm modular tower lights (IP 66), Harmony XVB ................................................................ 25
Ø 70 mm modular tower lights (up to IP 54), Harmony XVE ....................................................... 26
Ø 45, 50 mm modular tower lights (up to IP 54), Harmony XVM / XVP ...................................... 27
Modular tower lights accessories, Harmony XV .......................................................................... 28
Ø 84, 106, 120, 130 mm rotating mirror beacons, Harmony XVR ............................................... 29
Accessories for rotating mirror beacons, Harmony XVR ............................................................. 30
Electronic alarms and multisound sirens, Harmony XVS ............................................................ 30
Components for hoisting applications
Pendant control stations, Harmony XAC ............................................................................ 31 to 32
Illuminated pushbuttons
Type of head Flush push
Shape of head rectangular (2)
Degree of protection IP 65 / Nema 4, 4X, 13 / Class II
Mounting (mm) panel cut-out Ø 16.2
mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head
Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head
Connection (3) Tags for 2.8 x 0.5 Faston connectors or for soldering
Type of push Spring return
Complete products
12 … 24 V AC/DC
Products for user assembly
References white NO XB6DW1B1B ZB6Ep1B (1) ZB6Z1B ZB6DW1
NO + NC XB6DW1B5B ZB6Ep1B (1) ZB6Z5B ZB6DW1
green NO XB6DW3B1B ZB6Ep3B (1) ZB6Z1B ZB6DW3
NO + NC XB6DW3B5B ZB6Ep3B (1) ZB6Z5B ZB6DW3
red NC XB6DW4B2B ZB6Ep4B (1) ZB6Z2B ZB6DW4
NO + NC XB6DW4B5B ZB6Ep4B (1) ZB6Z5B ZB6DW4
yellow NO – ZB6Ep5B (1) ZB6Z1B ZB6DW5
NO + NC XB6DW5B5B ZB6Ep5B (1) ZB6Z5B ZB6DW5
Type of push Latching
References white NO – ZB6Ep1B (1) ZB6Z1B ZB6DF1
NO + NC XB6DF1B5B ZB6Ep1B (1) ZB6Z5B ZB6DF1
green NO XB6DF3B1B ZB6Ep3B (1) ZB6Z1B ZB6DF3
NO + NC XB6DF3B5B ZB6Ep3B (1) ZB6Z5B ZB6DF3
red NC XB6DF4B2B ZB6Ep4B (1) ZB6Z2B ZB6DF4
NO + NC XB6DF4B5B ZB6Ep4B (1) ZB6Z5B ZB6DF4
yellow NO – ZB6Ep5B (1) ZB6Z1B ZB6DF5
NO + NC – ZB6Ep5B (1) ZB6Z5B ZB6DF5
Pilot lights
Type of head Smooth lens cap
Shape of head rectangular (2)
Complete products Products for user assembly
12 … 24 V AC/DC
References white XB6DV1BB ZB6Ep1B (1) ZB6DV1
green XB6DV3BB ZB6Ep3B (1) ZB6DV3
red XB6DV4BB ZB6Ep4B (1) ZB6DV4
yellow XB6DV5BB ZB6Ep5B (1) ZB6DV5
blue – ZB6Ep6B (1) ZB6DV6
(1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above.
(2) For products with a square head, replace the letter D in the reference by the letter C (XB6DW1B1B becomes XB6CW1B1B).
For products with a circular head, replace the letter D in the reference by the letter A (XB6DW1B1B becomes XB6AW1B1B).
(3) Alternative connection: 1 x 0.5 pins for printed circuit boards.
Pushbuttons, switches and pilot lights Ø 16
with plastic bezel
Contact functions and light functions
with integral LED
(1):
Voltage Letter (p)
12…24 V AC/DC (15 mA) B
48…120 V AC (25 mA) G
230…240 V AC (25 mA) M
+ 0.2
0
Harmony
XB6
= + +
= +
Pushbuttons
Type of head Flush push
Shape of head rectangular (1)
Degree of protection IP 65 / Nema 4, 4X, 13 / Class II
Mounting (mm) panel cut-out Ø 16.2
mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head
Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head
Connection (2) Tags for 2.8 x 0.5 Faston connectors or for soldering
Type of push Spring return
Complete products Products for user assembly
References white NO XB6DA11B ZB6Z1B ZB6DA1
NO + NC XB6DA15B ZB6Z5B ZB6DA1
black NO – ZB6Z1B ZB6DA2
NO + NC XB6DA25B ZB6Z5B ZB6DA2
green NO XB6DA31B ZB6Z2B ZB6DA3
NO + NC XB6DA35B ZB6Z5B ZB6DA3
red NO – ZB6Z1B ZB6DA4
NO + NC XB6DA45B ZB6Z5B ZB6DA4
(1) For products with a square head, replace the letter D in the reference by the letter C (XB6DA11B becomes XB6CA11B).
For products with a circular head, replace the letter D in the reference by the letter A (XB6DA11B becomes XB6AA11B).
(2) Alternative connection: 1 x 0.5 pins for printed circuit boards.
Ø 30 mushroom head Emergency stop pushbuttons (3)
Type of head Trigger action (EN/ISO 13850)
Shape of head cylindrical
Type of push Turn to release
Complete products Products for user assembly
References red 2 NC + 1 NO XB6AS8349B ZB6E2B ZB6Z5B ZB6AS834
Type of push Key release, 200
References red 2 NC + 1 NO XB6AS9349B ZB6E2B ZB6Z5B ZB6AS934
(3) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard
EN/IEC 60947-5-5.
+ 0.2
0
Contact functions
= +
= + +
Selector switches and key switches
Type of head Black handle
Shape of head rectangular (2)
Degree of protection IP 66 / Nema 4, 4X, 13 / Class II
Mounting (mm) panel cut-out Ø 16.2
mounting centres 24 x 18 with rectangular head, 18 x 18 with square or circular head
Dimensions (mm) W x H x D (below head) 24 x 18 x 50 with rectangular head, 18 x 18 x 50 with square or circular head
Connection (3) Tags for 2.8 x 0.5 Faston connectors or for soldering
Type of operator Black handle
Complete products Products for user assembly
Number and type of positions 2 positions 2 positions 2 positions
stay put stay put spring return to centre
References NO XB6DD221B ZB6Z1B ZB6DD22 ZB6Z1B ZB6DD24
NO + NC XB6DD225B ZB6Z5B ZB6DD22 ZB6Z5B ZB6DD24
Number and type of positions 3 positions 3 positions 3 positions
stay put stay put spring return to centre
References NO XB6DD235B ZB6Z5B ZB6DD23 ZB6Z5B ZB6DD25
Type of operator Key, n° 200
Complete products Products for user assembly
Number and type of positions 2 positions 2 positions 2 positions
stay put stay put spring return to centre
References NO + NC XB6DGC5B ZB6Z5B ZB6DGC ZB6Z5B ZB6DGB
Number and type of positions 3 positions 3 positions 3 positions
stay put stay put spring return to centre
References NO + NC XB6DGH5B ZB6Z5B ZB6DGH ZB6Z5B ZB6DGS
Illuminated selector switches
Type of operator Coloured handle
Products for user assembly
Number and type of positions 2 positions 3 positions
stay put stay put
References white NO + NC ZB6Ep1B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK1
green NO + NC ZB6Ep3B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK3
red NO + NC ZB6Ep4B (1) ZB6Z5B ZB6DD02 ZB6DD03 ZB6YK4
(1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above.
(2) For products with a square head, replace the letter D in the reference by the letter C (XB6DD221B becomes XB6CD221B).
For products with a circular head, replace the letter D in the reference by the letter A (XB6DD221B becomes XB6AD221B).
(3) Alternative connection: 1 x 0.5 pins for printed circuit boards.
(1):
Voltage Letter (p)
12…24 V AC/DC (15 mA) B
48…120 V AC (25 mA) G
230…240 V AC (25 mA) M
+ 0.2
0
Harmony
XB6
60° 60° 45°
60° 60° 60° 60° 45° 45°
70° 70° 45°
70° 70° 70° 70° 45° 45°
60° 60° 60°
Pushbuttons, switches and pilot lights Ø 16
with plastic bezel
Contact functions and light functions
with integral LED
= +
= +
= + +
LED pilot lights With black bezel With integral lens cap
Type of head Protruding LED, Ø 8 mm Covered LED, Ø 8 mm Covered LED, Ø 12 mm
Degree of protection IP 40, IP 65 with seal (2)
Mounting (mm) panel cut-out Ø 8.2 mm Ø 8.2 mm Ø 12.2 mm
mounting centres 12.5 x 12.5 mm 10.5 x 10.5 mm 16.5 x 16.5 mm
Dimensions (mm) Ø x Depth (below head) Ø 12 x 32 Ø 10 x 34 Ø 16 x 45
Connection Tags (3) Tags (3) Threaded connectors
References (1) green XVLA1p3 XVLA2p3 XVLA3p3
red XVLA1p4 XVLA2p4 XVLA3p4
yellow XVLA1p5 XVLA2p5 XVLA3p5
Tightening key For Ø 8 mm pilot lights For Ø 12 mm pilot lights
References XVLX08 XVLX12
(1) Basic reference, to be completed by the number 1, 2, 3 or 4 indicating the required voltage. See voltage table above.
(2) For an IP 65 degree of protection, include the seals: XVLZ911 for pilot lights XVLA1pp and XVLA2pp; XVLZ912 for pilot lights XVLA3pp.
(3) Tags for 2.8 x 0.5 Faston connectors or for soldering.
Sub-assemblies & accessories for Ø 16
plastic bezel control and signalling units
Sub-assemblies Bodies for pushbuttons and
selector switches
Bodies for pilot lights
Rated operational characteristics, AC-15: Ue = 240 V and Ie = 1.5 A or Ue = 120 V and Ie = 3 A Consumption
Positive operation of contacts conforming to IEC/EN 60947-5-1: NC contacts with positive opening operation, 15 mA 12…24 V AC/DC
positive opening force 20 N 25 mA 48…120 V AC
25 mA 230…240 V AC
Type of Fixing collar Contacts Pilot light 12 … 24 V 48 … 120 V 230 … 240 V
contact + contacts bodies
References NO ZB6Z1B ZB6E1B White ZB6EB1B ZB6EG1B ZB6EM1B
NC ZB6Z2B ZB6E2B Green ZB6EB3B ZB6EG3B ZB6EM3B
2 NO ZB6Z3B – Red ZB6EB4B ZB6EG4B ZB6EM4B
2 NC ZB6Z4B – Yellow ZB6EB5B ZB6EG5B ZB6EM5B
NO + NC ZB6Z5B – Blue ZB6EB6B ZB6EG6B ZB6EM6B
LED pilot lights Ø 8 and 12
(1):
Voltage Number (p)
5 V (25 mA) 1
12 V (18 mA) 2
24 V (18 mA) 3
48 V (10 mA) 4
Accessories
Legend holders 24 x 28 mm (8 x 21 mm legend) 24 x 36 mm (16 x 21 mm legend)
Blank legend Background colour without legend yellow or white black or red without legend yellow or white black or red
References (10)* ZB6YD20 ZB6YD21 ZB6YD22 ZB6YD30 ZB6YD31 ZB6YD32
Blank legends for legend holders 8 x 21 mm (24 x 28 mm legend holder) 16 x 21 mm (24 x 36 mm legend holder)
Background colour – yellow or white black or red – yellow or white black or red
References (20)* – ZB6Y1001 ZB6Y2001 – ZB6Y4001 ZB6Y3001
Ø 45 mm yellow legend for mushroom head Emergency stop pushbutton
Marking Blank, for engraving EMERGENCY STOP ARRET D’URGENCE
References ZB6Y7001 ZB6Y7330 ZB6Y7130
Body/fixing collar Plate Tightening tool Dismantling tool
anti-rotation and slackening, for fixing nut for removal of contact blocks
References ZB6Y009 (10)* ZB6Y003 (10)* ZB6Y905 (2)* ZB6Y018 (5)*
Protective shutter for pushbuttons and switches Connector Blanking plug
for rectangular heads for circular and square heads Faston, female IP 65
References ZB6YD001 ZB6YA001 ZB6Y004 (100)* ZB6Y005 (10)*
* sold in lots of
Harmony
XVL
Pushbuttons, spring return
Type of head Chromium plated circular bezel
Degree of protection IP 66 / Nema 4X, 13 / Class I
Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended)
mounting centres 30 (horizontal) x 40 (vertical)
Depth (mm) below head 43
Connection (1) Screw clamp terminals
Type of push Flush Flush, booted
Unmarked Products Complete For user assembly Complete For user assembly
References black NO XB4BA21 ZB4BZ101 ZB4BA2 XB4BP21 ZB4BZ101 ZB4BP2
green NO XB4BA31 ZB4BZ101 ZB4BA3 XB4BP31 ZB4BZ101 ZB4BP3
red NC XB4BA42 ZB4BZ102 ZB4BA4 XB4BP42 ZB4BZ102 ZB4BP4
yellow NO XB4BA51 ZB4BZ101 ZB4BA5 XB4BP51 ZB4BZ101 ZB4BP5
blue NO XB4BA61 ZB4BZ101 ZB4BA6 XB4BP61 ZB4BZ101 ZB4BP6
Type of push Flush
With international marking Products Complete For user assembly
References green NO XB4BA3311 ZB4BZ101 ZB4BA331 – – –
red NC XB4BA4322 ZB4BZ102 ZB4BA432 – – –
white NO XB4BA3341 ZB4BZ101 ZB4BA334 – – –
black NO XB4BA3351 ZB4BZ101 ZB4BA335 _ _ _
Type of push Projecting Mushroom head, Ø 40 mm
Unmarked Products Complete For user assembly Complete For user assembly
References black NO – – – XB4BC21 ZB4BZ101 ZB4BC2
red NC XB4BL42 ZB4BZ102 ZB4BL4 – – –
Type of push Double-headed pushbuttons Triple-headed pushbuttons
Degree of protection IP 66 - IP 69K IP 66 - IP 69K
With international marking Products Complete For user assembly Complete For user assembly
(A) (B)
References (A) NO + NC XB4BL73415 ZB4BZ105 ZB4BL7341 – – –
(B) NO + NC + NO – – – XB4BA711237 ZB4BZ103 +
ZBE102
ZB4BA71123
(1) Alternative connections: plug-in connector,
Faston connectors (6.35 and 2 x 2.8).
Ø 40 mm mushroom head Emergency stop pushbuttons (2)
Trigger action (EN/ISO 13850)
Type of push Push-pull NO + NC
Unmarked Products Complete For user assembly
References red NO + NC XB4BT845 ZB4BZ105 ZB4BT84
Type of push Turn to release NO + NC
References red NO + NC XB4BS8445 ZB4BZ105 ZB4BS844
Type of push Key release NO + NC
References red NO + NC XB4BS9445 ZB4BZ105 ZB4BS944
(2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to standard
EN/IEC 60947-5-5.
Harmony
XB4
+ 0.4
0
Pushbuttons, switches and pilot lights Ø 22
with metal bezel
Contact functions
+
= +
= +
Contact functions
Selector switches and key switches
Type of head Chromium plated circular bezel
Degree of protection IP 66 / Nema 4X, 13 / Class I
Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended)
mounting centres 30 (horizontal) x 40 (vertical)
Depth (mm) below head 43
Connection (1) Screw clamp terminals
Type of operator Key, n° 455
Products Complete For user assembly Complete For user assembly
Number and type of positions (2) 2 positions 2 positions 2 positions 2 positions
stay put stay put stay put stay put
References black NO XB4BG21 ZB4BZ101 ZB4BG2 XB4BG41 ZB4BZ101 ZB4BG4
Number and type of positions 2 positions 2 positions 3 positions 3 positions
spring return to left spring return to left stay put stay put
References
black NO XB4BG61 ZB4BZ101 ZB4BG6 – – –
black NO + NO – – – XB4BG33 ZB4BZ103 ZB4BG3
+ 0.4
0
Type of operator Handle
Products Complete For user assembly Complete For user assembly
Number and type of positions 2 positions 2 positions 2 positions 2 positions
stay put stay put spring return to left spring return to left
References black NO XB4BD21 ZB4BZ101 ZB4BD2 XB4BD41 ZB4BZ101 ZB4BD4
Number and type of positions 3 positions 3 positions 3 positions 3 positions
stay put stay put spring return to centre spring return to centre
References black NO + NO XB4BD33 ZB4BZ103 ZB4BD3 XB4BD53 ZB4BZ103 ZB4BD5
= +
= +
Type Double-headed pushbuttons with LED pilot light Illuminated selector switches
(1 flush green push, 1 projecting red push) (2 position stay put)
Degree of protection IP 66 - IP 69K IP 66
Light source Integral LED Integral LED
Products Complete Complete
Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 24 V AC/DC 110…120 V AC 230…240 V AC
References green NO + NC – – – XB4BK123B5 XB4BK123G5 XB4BK123M5
red NO + NC – – – XB4BK124B5 XB4BK124G5 XB4BK124M5
orange NO + NC – – – XB4BK125B5 XB4BK125G5 XB4BK125M5
White NO + NC XB4BW73731B5 XB4BW73731G5 XB4BW73731M5 – – –
(1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal.
Harmony
XB4
Pushbuttons, switches and pilot lights Ø 22
with metal bezel
Light functions
Pilot lights
Type of head Circular bezel
Smooth lens cap
Degree of protection IP 66 / Nema 4X, 13 / Class I
Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended)
mounting centres 30 (horizontal) x 40 (vertical)
Depth below head 43
Connection (1) Screw clamp terminals
Light source Integral LED Direct supply for BA 9s bulb (not included)
Products Complete Complete For user assembly
Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max.
References white XB4BVB1 XB4BVG1 XB4BVM1 XB4BV61 ZB4BV6 ZB4BV01
green XB4BVB3 XB4BVG3 XB4BVM3 XB4BV63 ZB4BV6 ZB4BV03
red XB4BVB4 XB4BVG4 XB4BVM4 XB4BV64 ZB4BV6 ZB4BV04
yellow XB4BVB5 XB4BVG5 XB4BVM5 XB4BV65 ZB4BV6 ZB4BV05
blue XB4BVB6 XB4BVG6 XB4BVM6 – – –
+ 0.4
0
Illuminated pushbuttons and selector switches
Type Flush push, spring return, illuminated pushbuttons
Light source Integral LED Direct supply for BA 9s bulb (not included)
Products Complete Complete For user assembly
Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max.
References white NO + NC XB4BW31B5 XB4BW31G5 XB4BW31M5 XB4BW3165 ZB4BW065 ZB4BW31
green NO + NC XB4BW33B5 XB4BW33G5 XB4BW33M5 XB4BW3365 ZB4BW065 ZB4BW33
red NO + NC XB4BW34B5 XB4BW34G5 XB4BW34M5 XB4BW3465 ZB4BW065 ZB4BW34
orange NO + NC XB4BW35B5 XB4BW35G5 XB4BW35M5 XB4BW3565 ZB4BW065 ZB4BW35
blue NO + NC XB4BW36B5 XB4BW36G5 XB4BW36M5 – – –
= +
= +
Separate components and accessories
Electrical blocks (1) (2)
Single contact blocks Light blocks with integral LED Light block, direct supply
Rated operational characteristics
AC-15, 240 V - 3 A Consumption
18 mA 24 V AC/DC
Positive operation of contacts NC contacts with positive
opening operation
14 mA 120 V AC
conforming to IEC/EN 60947-5-1 14 mA 240 V AC
Screw clamp
terminal
Spring clamp
terminal
To combine with heads for integral LED For BA 9s bulb (not included)
24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max.
References (5)* NC ZBE101 ZBE1015 white ZBVB1 ZBVG1 ZBVM1 ZBV6
NO ZBE102 ZBE1025 green ZBVB3 ZBVG3 ZBVM3 Colour provided by lens
red ZBVB4 ZBVG4 ZBVM4
orange ZBVB5 ZBVG5 ZBVM5
blue ZBVB6 ZBVG6 ZBVM6
Diecast metal enclosures
(Zinc alloy, usable depth 49 mm) 1 vertical row 2 vertical rows
Number of cut-outs Front face dimensions 1 2 3 4 2 4 6
References 80 x 80 mm XAPM1201 – – – XAPM1202 – –
80 x 130 mm – XAPM2202 XAPM2203 – – XAPM2204 –
80 x 175 mm – – XAPM3203 XAPM3204 – – XAPM3206
Accessories (2)
Legend holders, 30 x 40 mm, for 8 x 27 mm legends
Marking Background colour: black or red white or yellow
References (10)* Blank ZBY2101 ZBY4101
International 0 (red background) ZBY2931 I ZBY2147 AUTO ZBY2115 STOP ZBY2304 –
English OFF ZBY2312 ON ZBY2311 START ZBY2303 – –
French ARRET (red b/grnd) ZBY2104 ARRET-MARCHE ZBY2166 MARCHE ZBY2103 – –
German AUS ZBY2204 AUS-EIN ZBY2266 EIN ZBY2203 – –
Spanish PARADA (red b/grnd) ZBY2404 PARADA-MARCHA ZBY2466 MARCHA ZBY2403 – –
Legend holders, 30 x 50 mm, for 18 x 27 mm legends
Background colour black or red white or yellow
References (10)* Blank ZBY6101 ZBY6102
Ø 60 mm legend for mushroom head Emergency stop pushbutton
Background colour yellow
Marking Blank EMERGENCY STOP ARRET D’URGENCE NOT HALT PARADA DE EMERGENCIA
References ZBY9140 ZBY9330 ZBY9130 ZBY9230 ZBY9430
(1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal.
(2) Electrical blocks and accessories also for use with Harmony XB5 plastic range
* sold in lots of
Type of push Double-headed pushbuttons Triple-headed pushbuttons
Degree of protection IP 66 - IP 69K IP 66 - IP 69K
With international marking Products Complete
(A)
For user assembly Complete
(B)
For user assembly
References (A) NO + NC XB5AL73415 ZB5AZ105 ZB5AL7341 – – –
(B) NO + NC + NO – – – XB5AA711237 ZB5AZ103 +
ZBE102
ZB5AA71123
(1) Alternative connections: plug-in connector,
Faston connectors (6.35 and 2 x 2.8).
Harmony
XB5
Pushbuttons, switches and pilot lights Ø 22
with plastic bezel
Contact functions
Pushbuttons, spring return
Type of head Circular bezel
Degree of protection IP 66 / Nema 4X, 13 / Class II
Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended)
mounting centres 30 (horizontal) x 40 (vertical)
Depth (mm) below head 43
Connection (1) Screw clamp terminals
+ 0.4
0
Type of push Flush Flush, booted
Unmarked Products Complete For user assembly Complete For user assembly
References black NO XB5AA21 ZB5AZ101 ZB5AA2 XB5AP21 ZB5AZ101 ZB5AP2
green NO XB5AA31 ZB5AZ101 ZB5AA3 XB5AP31 ZB5AZ101 ZB5AP3
red NC XB5AA42 ZB5AZ102 ZB5AA4 XB5AP42 ZB5AZ102 ZB5AP4
yellow NO XB5AA51 ZB5AZ101 ZB5AA5 XB5AP51 ZB5AZ101 ZB5AP5
blue NO XB5AA61 ZB5AZ101 ZB5AA6 XB5AP61 ZB5AZ101 ZB5AP6
Type of push Flush
With international marking Products Complete For user assembly Complete For user assembly
References green NO XB5AA3311 ZB5AZ101 ZB5AA331 – – –
red NC XB5AA4322 ZB5AZ102 ZB5AA432 – – –
white NO XB5AA3341 ZB5AZ101 ZB5AA334 – – –
black NO XB5AA3351 ZB5AZ101 ZB5AA335 – – –
Type of push Projecting Mushroom head, Ø 40 mm
Unmarked Products Complete For user assembly Complete For user assembly
References black NO – – – XB5AC21 ZB5AZ101 ZB5AC2
red NC XB5AL42 ZB5AZ102 ZB5AL4 – – –
Ø 40 mm mushroom head Emergency stop pushbuttons (2)
Trigger action (EN/ISO 13850)
Type of push Push-pull NO + NC
Unmarked Products Complete For user assembly
References red NO + NC XB5AT845 ZB5AZ105 ZB5AT84
Type of push Turn to release NO + NC
References red NO + NC XB5AS8445 ZB5AZ105 ZB5AS844
Type of push Key release NO + NC
References red NO + NC XB5AS9445 ZB5AZ105 ZB5AS944
(2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850: to Machinery Directive 2006/42/EC and to
standard EN/IEC 60947-5-5.
+
= +
= +
10
Contact functions
Selector switches and key switches
Type of head Circular bezel
Degree of protection IP 66 / Nema 4X, 13 / Class II
Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended)
mounting centres 30 (horizontal) x 40 (vertical)
Depth (mm) below head 43
Connection (1) Screw clamp terminals
Type of operator Handle
Products Complete For user assembly Complete For user assembly
Number and type of positions 2 positions 2 positions 2 positions 2 positions
stay put stay put spring return to left spring return to left
References black NO XB5AD21 ZB5AZ101 ZB5AD2 XB5AD41 ZB5AZ101 ZB5AD4
Number and type of positions 3 positions 3 positions 3 positions 3 positions
stay put stay put spring return to centre spring return to centre
References black NO + NO XB5AD33 ZB5AZ103 ZB5AD3 XB5AD53 ZB5AZ103 ZB5AD5
Type of operator Key, n° 455
Number and type of positions (2) 2 positions 2 positions 2 positions 2 positions
stay put stay put stay put stay put
References black NO XB5AG21 ZB5AZ101 ZB5AG2 XB5AG41 ZB5AZ101 ZB5AG4
(2) The symbol indicates key withdrawal position.
+ 0.4
0
= +
11
Harmony
XB5
Pushbuttons, switches and pilot lights Ø 22
with plastic bezel
Light functions
Pilot lights
Type of head Circular bezel
Smooth lens cap
Degree of protection IP 66 / Nema 4X, 13 / Class II
Mounting (mm) panel cut-out Ø 22.5 (22.4 recommended)
mounting centres 30 (horizontal) x 40 (vertical)
Depth below head 43
Connection (1) Screw clamp terminals
Light source Integral LED Direct supply for BA 9s bulb (not included)
Products Complete Complete For user assembly
Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max.
References white XB5AVB1 XB5AVG1 XB5AVM1 XB5AV61 ZB5AV6 ZB5AV01
green XB5AVB3 XB5AVG3 XB5AVM3 XB5AV63 ZB5AV6 ZB5AV03
red XB5AVB4 XB5AVG4 XB5AVM4 XB5AV64 ZB5AV6 ZB5AV04
orange XB5AVB5 XB5AVG5 XB5AVM5 XB5AV65 ZB5AV6 ZB5AV05
blue XB5AVB6 XB5AVG6 XB5AVM6 – – –
Illuminated pushbuttons and selector switches
Type Flush push, spring return, illuminated pushbuttons
Light source Integral LED Direct supply for BA 9s bulb (not included)
Products Complete Complete For user assembly
Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 250 V max., 2.4 W max.
References white NO + NC XB5AW31B5 XB5AW31G5 XB5AW31M5 XB5AW3165 ZB5AW065 ZB5AW31
green NO + NC XB5AW33B5 XB5AW33G5 XB5AW33M5 XB5AW3365 ZB5AW065 ZB5AW33
red NO + NC XB5AW34B5 XB5AW34G5 XB5AW34M5 XB5AW3465 ZB5AW065 ZB5AW34
orange NO + NC XB5AW35B5 XB5AW35G5 XB5AW35M5 XB5AW3565 ZB5AW065 ZB5AW35
blue NO + NC XB5AW36B5 XB5AW36G5 XB5AW36M5 – – –
Type Double-headed pushbuttons with LED pilot light Illuminated selector switches
(1 flush green push, 1 projecting red push) (2 position stay put)
Degree of protection IP 66 - IP 69K IP 66
Light source Integral LED Integral LED
Products Complete Complete
Supply voltage 24 V AC/DC 110…120 V AC 230…240 V AC 24 V AC/DC 110…120 V AC 230…240 V AC
References green NO + NC – – – XB5AK123B5 XB5AK123G5 XB5AK123M5
red NO + NC – – – XB5AK124B5 XB5AK124G5 XB5AK124M5
orange NO + NC – – – XB5AK125B5 XB5AK125G5 XB5AK125M5
white NO + NC XB5AW73731B5 XB5AW73731G5 XB5AW73731M5 – – –
(1) Alternative connections: plug-in connector, Faston connectors (6.35 and 2 x 2.8), spring clamp terminal.
+ 0.4
0
= +
= +
12
Separate components and accessories: see page 9.
Control stations
For XB5 pushbuttons, switches and pilot lights
Ø 22 with plastic bezel
Harmony
XAL
(1) Empty enclosures:
Basic reference: XALK0p, replace the p
by the number of cut-outs required (see
cut-out table above)
(1):
Number of cut-outs Number (p)
1 1
2 2
3 3
4 4
5 5
Complete stations with 1 pushbutton, selector switch or key switch
(light grey RAL 7035 base with dark grey RAL 7016 lid)
Degree of protection IP 65 / Nema 4X and 13 / Class II
Dimensions (mm) W x H x D 68 x 68 x 113 max. (with key release Ø 40 mushroom head pushbutton)
Fixing (mm) 2 x Ø 4.3 on 54 mm centres
Function 1 Start or Stop function 1 Start-Stop function
Marking On spring return push On legend holder and legend below head
Number and type of pushbutton/selector switch/key switch 1 flush green p/b 1 flush red p/b 1 projecting red p/b 1 2 position stay put selector switch or key switch
Black handle Key n° 455 (key withdrawal LH pos.)
References NO I XALD102 – – – –
Start XALD103 – – – –
O - I – – – XALD134 XALD144
O – XALD112 XALD115 – –
Function Emergency stop (2) (light grey RAL 7035 base with yellow RAL 1012 lid)
Number and type of mushroom head pushbutton 1 red Ø 40 head, turn to release 1 red Ø 40 head, key release
Latching mechanism Trigger action (EN/ISO 13850) Trigger action (EN/ISO 13850)
References NC XALK178 XALK188
NC + NC XALK178F XALK188F
NO + NC XALK178E XALK188E
NC + NC + NO XALK178G XALK188G
(2) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to
standard EN/IEC 60947-5-5.
(1) Empty enclosures:
Basic reference: XALD0p, replace the p
by the number of cut-outs required (see
cut-out table above)
Complete stations with 2 and 3 pushbuttons or 2 pushbuttons + 1 pilot light
(light grey RAL 7035 base with dark grey RAL 7016 lid)
Dimensions (mm) W x H x D 2-way control stations: 68 x 106 x 62; 3-way control stations: 68 x 136 x 87
Fixing (mm) 2-way control stations: 2 x Ø 4.3 on 54 x 68 centres; 3-way control stations: 2 x Ø 4.3 on 54 x 98 centres
Function Start-Stop functions 2 functions 3 functions
Marking On spring return push
Number and type of pushbutton/pilot light 1 flush green p/b 1 flush green pushbutton 1 flush white p/b 1 flush white p/b 1 flush white p/b
1 flush red p/b 1 flush red pushbutton 1 flush black p/b 1 flush red p/b 1 Ø 30 red mush-
1 red pilot light with integral LED 1 flush black p/b room head p/b
1 flush black p/b
24 V AC/DC 230 V AC
References NO + NC I - O XALD213 XALD363B XALD363M – – –
Start - Stop XALD215 – – – – –
NO + NO – – – XALD222 – –
NO + NC + NO – – – – XALD324 XALD328
Accessories Standard contact blocks Light blocks with integral LED, colour red
Description NO contact NC contact 24 V AC/DC 230 V AC
References ZENL1111 ZENL1121 ZALVB4 ZALVM4
13
Harmony
XB5R
Wireless and batteryless pushbuttons
Packages and components
Ready to use packs Panel mounting Mobile application
Wireless and batteryless 22mm pushbutton assembled on fixing collar Plastic head Metal head Plastic head Metal head Plastic head in handy box
Caps 1 black cap 1 set of 10 different
coloured caps
1 black cap 1 set of 10 different
coloured caps
Receiver Non configurable Configurable functions:
monostable, bistable,
stop/start
Non configurable Configurable functions:
monostable, bistable,
stop/start
Relay output 1relay output type RT 3A 2 relays output type RT 3A 1relay output type RT 3A 2 relays output type RT 3A
Voltage receiver 24 VDC 24….240 AC/DC 24 VDC 24….240 AC/DC
References XB5RFB01 XB4RFB01 XB5RFA02 XB4RFA02 XB5RMB03 XB5RMA04
The pushbutton and receiver are factory paired
Transmitter components for wireless and
batteryless pushbuttons
Plastic mushroom head Plastic head Metal head
Wireless and batteryless pushbuttons including - a transmitter fitted with fixing collar
- a spring return pushbutton head with clipped-in cap
Reference Cap colour White – ZB5RTA1 ZB4RTA1
Black – ZB5RTA2 ZB4RTA2
Green – ZB5RTA3 ZB4RTA3
White I on green background – ZB5RTA331 ZB4RTA331
Red – ZB5RTA4 ZB4RTA4
White O on red background – ZB5RTA432 ZB4RTA432
Yellow – ZB5RTA5 ZB4RTA5
Blue – ZB5RTA6 ZB4RTA6
Black ZB5RTC2 – –
Transmitter components for wireless and
batteryless rope pull switch
Rope pull switch with wireless and batteryless transmitter
Reference ZBRP1
14
Components and accessories
Configurable receivers
Description - 2 buttons (learn, parameter setting)
- 6 indicating LEDs (power ON, outputs, signal strenght)
Output function Monostable Monostable, bistable Monostable, bistable, stop/start
Output type 4 PNP outputs 200 mA / 24V 2 relay outputs type RT 3A
Receiver voltage 24 VDC 24….240 AC/DC
References ZBRRC ZBRRD ZBRRA
Configurable access point (1)
Description - 7-segment display
- jog dial
- 8 indicating LEDs (power ON, functions mode, communication status, signal strength)
- external antenna connector and protective plug
Output function Monostable
Output type 2 RS485 for Modbus RS485 serial line 1 slot for communication module ZBRCETH
Receiver voltage 24….240 AC/DC
References ZBRN2 ZBRN1
(1) Available 1st quarter 2013.
Complementary accessories Relay antennas Communication
module
Plastic empty boxes
Description 1 power-ON LED
2 LEDs reception /
transmission
1 RF connector
Modbus/TCP protocol
2 RJ45 connectors
Handy,
1 cut-out 1 cut-out 2 cut-outs
Cable lenght 5m 2m
Voltage 24….240 AC/DC
Reference ZBRA1 ZBRA2 (1) ZBRCETH (1) ZBRM01 XALD01 XALD02
(1) Available 1st quarter 2013.
15
Pushbuttons
Type of head Flush or projecting push
circular
Degree of protection IP 65, class II, NEMA type 3 and 12
Mounting (mm) panel cut-out Ø 22.4 (0 +0.1)
mounting centres 30 (horizontal) x 40 (vertical)
Dimensions (mm) Ø x Depth (below head) Ø 29 x 41.5 (Ø 40 x 41.5 for Emergency stop)
Connection Screw clamp terminals, 1 x 0.34 mm2 to 1 x 1.5 mm2
Type of push Flush, spring return Flush, push and latching
References (10)* white NO XB7NA11 –
NO + NC XB7NA15 –
black NO XB7NA21 XB7NH21
NO + NC XB7NA25 XB7NH25
green NO XB7NA31 XB7NH31
NO + NC XB7NA35 XB7NH35
red NC XB7NA42 –
NO + NC XB7NA45 –
yellow NO XB7NA81 –
Type of push Flush, spring return Projecting, spring return
References green NO XB7NA3131 –
red NC – XB7NL4232
white NO XB7NA11341 –
black NO XB7NA21341 –
NO + NC XB7NA25341 –
Selector switches and key switches
Type of operator Black handle Key, n° 455
Number and
type of positions
2 positions 3 positions 2 positions 3 positions
stay put stay put stay put stay put
References (10*) NO XB7ND21 – XB7NG21 –
NO + NC XB7ND25 – – –
2 NO – XB7ND33 – XB7NG33
Ø 40mm Emmergency Stop trigger action and mechanical latching pushbuttons (EN/ISO 13850, UL) (1)
Type of push Turn to release Push, Pull Key release (n° 455)
References* red NC XB7 NS8442 XB7 NT842 -
red NO + NC XB7 NS8445 XB7 NT845 XB7 NS9445
red 2NC XB7 NS8444 XB7 NT844 XB7 NS9444
(1) Emergency stop trigger action and mechanical latching pushbuttons conform to standards EN/IEC 60204-1 and EN/ISO 13850, to Machinery Directive 2006/42/EC and to
standard EN/IEC 60947-5-5. Please consult your Customer Care Centre for a full explanation of these standards and directives.
* Sold in lots of 10.
Harmony
XB7
Pushbuttons, switches and pilot lights Ø 22
with plastic bezel - Monolithic
Contact functions
16
Illuminated pushbuttons
Type of head Projecting push
circular
Degree of protection IP 65, class II, NEMA type 12
Mounting (mm) panel cut-out Ø 22.4 (0 +0.1)
mounting centres 30 (horizontal) x 40 (vertical)
Dimensions (mm) Ø x Depth (below head) Ø 29 x 41.5, (Ø 40 x 41.5 for Emergency stop)
Connection Screw clamp terminals, 1 x 0.34 mm2 to 1 x 1.5 mm2
Light source Integral LED BA 9s base fitting Incandescent bulb
direct supply (bulb not included)
Type of push Spring return
References (10)* green NO XB7NW33p1 (1) XB7NW3361
red NO XB7NW34p1 (1) XB7NW3461
NC XB7NW34p2 (1) _
orange NO XB7NW35p1 (1) –
blue NO XB7NW36p1 (1) –
clear NO XB7NW37p1 (1) –
yellow NO XB7NW38p1 (1) XB7NW3561
Type of push Push and latching
References (10)* green NO XB7NH03p1 (1) XB7NH0361
red NO XB7NH04p1 (1) XB7NH0461
NC XB7NH04p2 (1) –
yellow NO XB7NH08p1 (1) XB7NH0861
Pilot lights (2)
Light source Integral LED Ba 9s base fitting incandescent bulb Incandescent bulb
direct supply direct through resistor
(bulb not included) (bulb included)
Supply voltage 24VAC/DC or 120VAC or 230…240VAC 6 or 24 V DC, or 130 V AC 230 V AC
References (10)* clear XB7EV07pP (1) XB7EV67P XB7EV77P
green XB7EV03pP (1) XB7EV63P XB7EV73P
red XB7EV04pP (1) XB7EV64P XB7EV74P
yellow XB7EV05pP (1) XB7EV65P XB7EV75P
blue XB7EV06pP (1) XB7EV66P XB7EV76P
orange XB7EV08pP (1) XB7EV68P XB7EV78P
Incandescent bulbs, long life
BA 9s base fitting, Ø 11 mm max., length 28 mm max.
6 V (1.2 W) 24 V (2 W) 130 V (2.4 W)
References DL1CB006 DL1CE024 DL1CE130
(1) Basic reference, to be completed by the letter B, G or M indicating the required voltage. See voltage table above.
(2) Alternative connection: 1 x 6.35 and 2 x 2.8 mm Faston connectors.
* sold in lots of 10
Contact functions and light functions
(1):
Supply voltage for integral LED light source only Letter (p)
24 V AC/DC B
120 V AC G
230 V AC M
17
Pushbuttons, spring return
Type of push Flush Projecting Projecting (high guard)
Colour of push Multi-colour (set of 7 clip-in coloured caps)
Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II
Mounting (mm) panel cut-out Ø 31
mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp)
Depth below head (mm) 42
Connection Screw clamp terminals
References CO 9001KR1UH13 9001KR3UH13 9001KR2UH13
NO 9001KR1UH5 9001KR3UH5 9001KR2UH5
Mushroom head pushbuttons, latching (1) Emergency switching off Emergency stop
Type of push Push-pull Turn-to-Release, trigger action
Ø 41 mushroom head Ø 35 mushroom head Ø 40 red mushroom head
Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class III
Mounting (mm) panel cut-out Ø 31
mounting centres 57.2 x 44.5 (with legend 9001KN2pp),
57.2 x 50.8 (with legend 9001KN3pp)
57,2 x 44,5 (without legend plate),
100 x 100 ((with legend plate 9001KN8330) (2)
Depth below head (mm) 42 60
Connection Screw clamp terminals
References – – – 9001KR16
CO 9001KR9R94H13 9001KR9R20H13 –
NC 9001KR9RH6 9001KR9R20H6 –
2NO + 2NC – – 9001KR16H2
NO – – 9001KR16H13
(1) Mushroom head switching off mechanical latching pushbuttons conform to standard IEC 60364-5-53 and EN/IEC 60947-5-5. Mushroom head Emergency stop trigger action and
mechanical latching pushbuttons conforming to standard EN/IEC 60204‑1 and EN/ISO 13850, to Machinery directive 2006/42/EC and standard EN/IEC 60947-5-5.
Selector switches and key switches
Type of operator Long black handle Key, n° 455
positions (2) 3 - spring return 2 - stay put 2 - spring return 3 - stay put 2 - stay put
Number and type
of positions
Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II
Mounting (mm) panel cut-out Ø 31
mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp)
Depth below head (mm) 42
Connection Screw clamp terminals
References NO – 9001KS11FBH5 9001KS34FBH5 – –
CO 9001KS53FBH1 – – 9001KS43FBH1 9001KS11K1RH1
(2) The symbol indicates key withdrawal position.
Harmony
9001K/SK
Pushbuttons, switches and pilot lights Ø 30
with metal bezel
Contact functions
18
(2) For yellow circular Emergency Stop legend plates: see page 9
Pilot lights
Type of head Smooth lens cap
Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II
Mounting (mm) panel cut-out Ø 31
mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp)
Depth below head (mm) 42
Connection Screw clamp terminals
Type of light block With high luminosity LED (included) Incandescent BA 9s bulb
(included)
24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC
References green 9001KP35LGG9 9001KP36LGG9 9001KP38LGG9 9001KP7G9
red 9001KP35LRR9 9001KP36LRR9 9001KP38LRR9 9001KP7R9
yellow 9001KP35LYA9 9001KP36LYA9 9001KP38LYA9 9001KP7A9
Illuminated pushbuttons, spring return
Type of head Spring return flush push
Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II
Mounting (mm) panel cut-out Ø 31
mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp)
Depth below head (mm) 42
Connection Screw clamp terminals
Type of light block With high luminosity LED (included) Incandescent BA 9s bulb
(included)
24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC
References green CO 9001K3L35LGGH13 9001K3L36LGGH13 9001K3L38LGGH13 9001K2L7RH13
red CO 9001K3L35LRRH13 9001K3L36LRRH13 9001K3L38LRRH13 9001K2L7GH13
yellow CO 9001K3L35LYAH13 9001K3L36LYAH13 9001K3L38LYAH13 9001K2L7AH13
Illuminated Ø 41 mushroom head pushbuttons, latching, high luminosity LED
Degree of protection IP 66 / Nema 1, 2, 3, 3R, 4, 6, 12 and 13 / Class II
Mounting (mm) panel cut-out Ø 31
mounting centres 57.2 x 44.5 (with legend 9001KN2pp), 57.2 x 50.8 (with legend 9001KN3pp)
Depth below head (mm) 42
Connection Screw clamp terminals
Type of light block With high luminosity LED (included) Incandescent BA 9s bulb
(included)
24 V AC/DC 48 V AC/DC 120 V AC/DC 230 V AC/DC
Type of head 2 position, push-pull
References red CO 9001KR9P35RH13 9001KR9P36RH13 9001KR9P38RH13 9001KR9P7RH13
Type of head 3 position, push-pull (pull: spring return, centre: stay put, push: spring return)
References red NC + NC
late break
9001KR8P35RH25 9001KR8P36RH25 9001KR8P38RH25 9001KR8P7RH25
Light functions
19
Contact blocks with protected terminals
Type of contact Single contact blocks
Connection Screw clamp terminals
References CO 9001KA1
NO 9001KA2
NC 9001KA3
CO, late break 9001KA4
NC, late break 9001KA5
NO, early make 9001KA6
Enclosures
Type Number of Ø 30 mm cut-outs NEMA ratings Reference
Aluminium 1 1, 3, 4, 6, 12, 13 9001KY1
2 1, 3, 4, 6, 12, 13 9001KY2
3 1, 3, 4, 6, 12, 13 9001KY3
4 1, 3, 4, 6, 12, 13 9001KY4
Stainless steel 1 1, 3, 4, 4X, 13 9001KYSS1
2 1, 3, 4, 4X, 13 9001KYSS2
3 1, 3, 4, 4X, 13 9001KYSS3
Legends
44 x 43 mm 57 x 57 mm Ø 60 Ø 90
Type Aluminium Plastic Plastic
Colour of legend black background white background Yellow background
Marking Blank 9001KN200 9001KN100WP 9001KN9100 9001KN8100
START 9001KN201 9001KN101WP – –
STOP (red background) 9001KN202 9001KN102RP – –
FORWARD 9001KN206 9001KN106WP – –
REVERSE 9001KN207 9001KN107WP – –
RESET 9001KN223 9001KN123WP –
PULL TO START/ 9001KN379 9001KN179WP – –
PUSH TO STOP
EMERGENCY STOP – – 9001KN9330 9001KN8330
ARRET D’URGENCE – – 9001KN9330F 9001KN8330F
PARADA DE EMERGENCIA – – 9001KN9330S 9001KN8330S
Harmony
9001K/SK
Pushbuttons, switches and pilot lights Ø 30
with metal bezel
Accessories
20
Cam switches
12 and 20 A ratings
Harmony
K series
positions (°)
Cam switches, K1 / K2 series
Function Switches ON-OFF switches Stepping switches
45° switching angle 90° switching angle with “0” position
Degree of protection front face IP 65 (1) IP 65 (1) IP 65 (1)
Conventional thermal current (Ith) 12 A 20 A 12 A 20 A 12 A 20 A
Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V
Number of positions 2 2 2 + “0” position
Number of poles 2 2 2
Dimensions of front plate (mm) 45 x 45 45 x 45 45 x 45
Front mounting method Multifixing plate, 45 x 45 mm K1B002ALH K2B 002ALH K1B1002HLH K2B 1002HLH K1D012QLH K2D012QLH
Plastic mounting plate for Ø 22 mm hole K1B002ACH K2B 002ACH K1B1002HCH K2B 1002HCH K1D012QCH K2D012QCH
positions (°)
Cam switches, K1 / K2 series
Function Changeover switches Ammeter switches Voltmeter switches
Degree of protection front face IP 65 (1) IP 65 (1) IP 65 (1)
Conventional thermal current (Ith) 12 A 20 A 12 A 20 A 12 A 20 A
Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V
Number of positions 2 + “0” position 3 + “0” position 6 + “0” position (measurements
(3 circuits + “0” position) between 3 phases & N + “0” pos.)
Number of poles 2 4 7
Dimensions of front plate (mm) 45 x 45 45 x 45 45 x 45
Front mounting method Multifixing plate, 45 x 45 mm K1D002ULH K2D002ULH K1F003MLH to be compiled * K1F027MLH to be compiled *
Plastic mounting plate for Ø 22 mm hole K1D002UCH K2D002UCH K1F003MCH to be compiled * K1F027MCH to be compiled *
(1) With seal KZ73 for switch with Multifixing plate, with seal KZ65 for Ø 22 mm hole mounting switches. Seal to be ordered separately.
(*) Please consult your Schneider Electric agency.
positions (°)
Cam switches with key operated lock, K1 series
Function Stepping switches Run switches Changeover switches + “0” pos.
Degree of protection front face IP 65 IP 65 IP 65
Conventional thermal current (Ith) 12 A 12 A 12 A
Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V
Number of positions 2 + “0” position 3 + “0” position 2 + “0” position
Number of poles 3 2 2
Dimensions of front plate (mm) 55 x 100 55 x 100 55 x 100
Colour of handle red black red black red black
Front mounting method Ø 22 mm hole + Ø 43.5 mm hole K1F022QZ2 K1F022QZ4 K1G043RZ2 K1G043RZ4 K1D002UZ2 K1D002UZ4
12
0 45
34
1-pole
2-pole
12
0 90
34
2-pole
90
1
0 45
2345678
135 180 225
2-pole
45
1
315 0
2345678
1-pole
2-pole
180
1
234
0 90 270
56789
10
11
12
0
1
234
270 315
5678
225
9
10
45 90
11
12
135
0
1
23456789
10
11
12
60 120
123456789
10
11
12
13
14
0 60 120 180
300
1
2345678
0 60
21
positions (°)
Cam switches, K10 series
Function Switches Changeover switches Ammeter Voltmeter
60° switching angle with “0” position switches switches
Degree of protection front face IP 65 IP 65 IP 65 IP 65
Conventional thermal current (Ith) 10 A 10 A 10 A 10 A
Rated insulation voltage (Ui) conforming to IEC60947-1 440 V 440 V 440 V 440 V
Number of positions 2 2 + “0” position 3 + “0” pos. (1) 6 + “0” pos. (2)
Number of poles 1 2 3 2 3 3 3
Dimensions of front plate (mm) 30 x 30 30 x 30 30 x 30 30 x 30
Front mounting method By Ø 16 mm or 22 mm hole K10A001ACH K10B002ACH K10C003ACH K10D002UCH K10F003UCH K10F003MCH K10F027MCH
(1) (3 circuits + “0” position).
(2) (Measurements between 3 phases and N + “0” position).
positions (°)
Cam switches, K30 series
Function Switches Switches Changeover Starting Starting Reversing
ON-OFF with “0” position star-delta 2-speed
Degree of protection front face IP 40 IP 40 IP 40 IP 40 IP 40 IP 40
Conventional thermal current (Ith) 32 A 32 A 32 A 32 A 32 A 32 A
Rated insulation voltage (Ui) conforming to IEC60947-1 690 V 690 V 690 V 690 V 690 V 690 V
Number of positions 2 2 3 3 3 3
Number of poles 3 3 4 4 3 3 3
Dimensions of front plate (mm) 64 x 64 64 x 64 64 x 64 64 x 64 64 x 64 64 x 64
Front mounting method Multifixing K30C003AP(3) K30C003HP(3) K30D004HP(3) K30H004UP(3) K30H001YP(3) K30H004PP(3) K30E003WP(3)
(3) To order switches with other thermal current ratings (50, 63, 115, 150 A): replace the number 30 in the reference by 50, 63, 115 or 150 respectively.
Example: a switch with a 32 A current rating, for example K30C003AP, becomes K50 C003AP for a current rating of 50 A.
Accessories for cam switches K1/K2
Rubber seals
for IP 65 degree of protection
For use with heads with 45 x 45 mm front plate with 60 x 60 mm front plate with 45 x 45 mm front plate
Ø 22 mm hole or 4 hole front mtg. Ø 22 mm hole or 4 hole front mtg. multifixing
References* KZ65 KZ66 KZ73
* Sold in lots of 5.
Cam switches
10 to 150 A ratings
Harmony
K series
0
1
23456
60
1-pole
2-pole
3-pole
0
1
2
60
34
300
56789
10
11
12
1-pole
2-pole
3-pole
90
1
2
180
34
0 270
56789
10
11
12
300
1
2
330
34
270 0 30 60 90
56789
10
11
12
0
1
23456
60
1-pole
2-pole
3-pole
0
1
2345678
90
1-pole
2-pole
0
12
60
34
1234
300
56789
10
11
12
13
14
15
16
1-pole
2-pole
3-pole
4-pole
0
12
60
34
1234
300
56789
10
11
12
13
14
15
16
0
1260
34 1234 300
56789
10
11
12
13
14
15
16
0
12
60
34
1234
300
56789
10
11
12
22
Monolithic tower lights
Ø 40, Ø 60, Ø 100 mm, complete, pre-wired
tower lights
Harmony
XVC
Ø 40 mm / Up to IP54
Complete, pre-wired tower lights Steady light Steady / Flashing light (1)
Light source (included) LEDs LEDs
Base mount Base mounting Support tube mounting, 17 mm Support tube mounting, 17 mm
Buzzer Without buzzer With buzzer + flashing light
Degree of protection up to IP54 up to IP54
Voltage 24V AC/DC 24V AC/DC 100-240V AC 24V AC/DC 100 - 240V AC
References (2) Red XVC4B1K XVC4B1 XVC4M1 (4) XVC4B15S XVC4M15S (4)
Red / orange XVC4B2K XVC4B2 XVC4M2 XVC4B25S XVC4M25S
Red / Orange / green XVC4B3K XVC4B3 XVC4M3 XVC4B35S XVC4M35S
red / orange / green / blue XVC4B4K XVC4B4 XVC4M4 XVC4B45S XVC4M45S
red / orange / green / blue / Clear XVC4B5K XVC4B5 XVC4M5 XVC4B55S XVC4M55S
Ø 60 mm / Up to IP54
Complete, pre-wired tower lights Steady light Steady / Flashing light (1)
Light source (included) LEDs LEDs
Base mount Base mounting Support tube mounting, 22 mm Support tube mounting, 22 mm Base mounting
Buzzer Without buzzer With buzzer + flashing light
Degree of protection up to IP54 up to IP54
Voltage 24V AC/DC 24V AC/DC 100-240 V AC (4) 24V AC/DC 100-240 V AC (4)
References (2) Red XVC6B1K XVC6B1 XVC6M1 (3) XVC6B15S (3) XVC6M15S XVC6M15SK
Red / orange XVC6B2K XVC6B2 XVC6M2 (3) XVC6B25S (3) XVC6M25S XVC6M25SK
Red / Orange / green XVC6B3K XVC6B3 XVC6M3 (3) XVC6B35S (3) XVC6M35S XVC6M35SK
red / orange / green / blue XVC6B4K XVC6B4 XVC6M4 (3) XVC6B45S (3) XVC6M45S XVC6M45SK
red / orange / green / blue / Clear XVC6B5K XVC6B5 XVC6M5 (3) XVC6B55S (3) XVC6M55S XVC6M55SK
Ø 100 mm / Up to IP54
Complete, pre-wired tower lights Steady / Flashing light (1)
Light source (included) LEDs
Base mount Base mounting
Buzzer Without buzzer With buzzer + flashing light
Degree of protection up to IP54 up to IP54
Voltage 24V DC (4) 100-240V AC (4) 24VDC (4) 100-240V AC (4) 24VDC (4) 100-240V AC (4)
References (2) Red XVC1B1K XVC1M1K XVC1B1SK XVC1M1SK XVC1B1HK XVC1M1HK
Red / orange XVC1B2K XVC1M2K XVC1B2SK XVC1M2SK XVC1B2HK XVC1M2HK
Red / Orange / green XVC1B3K XVC1M3K XVC1B3SK XVC1M3SK XVC1B3HK XVC1M3HK
red / orange / green / blue XVC1B4K XVC1M4K XVC1B4SK XVC1M4SK - -
red / orange / green / blue / Clear XVC1B5K XVC1M5K XVC1B5SK XVC1M5SK - -
(1) Flashing function can be simply selected/programmed by wiring
(2) The colours are listed in the same order as the mounting order of the illuminated units (from top to bottom)
(3) To order products for base mounting, add the letter K to the end of the reference (ex. XVC6M1K)
(4) NPN only
23
Monolithic tower lights and accessories
Ø 45 mm, complete illuminated beacons
Harmony
XVDLS / XVC
Ø 45 mm / IP40
Illuminated beacons XVDLS Steady light Flashing light
Light source Incandescent BA 15d bulb, 5 W max. (not included) “Flash” discharge tube, 0.5 J
Degree of protection IP 40
References (1) 24…230 V AC/DC XVDLS3p –
24 V AC/DC – XVDLS6Bp
120 V AC – XVDLS6Gp
230 V AC – XVDLS6Mp
(1) To obtain the complete reference, replace the p by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow.
Accessories
XVDLS
Incandescent bulbs, with BA 15d base Beacons XVDLS
Description 24 V, 4 W 120 V, 5 W 230 V, 5 W
References DL1BEBS DL1BEGS DL1BEMS
XVC4 / XVC6
Mounting accessories Tower lights Ø 40 mm, XVC4 Tower lights Ø 60 mm, XVC6
Description Support tube mounting Support tube
mounting
Base mounting Support tube
mounting
Diameter (mm) Ø 90 Ø 84 – Ø 100 Ø 84 –
For use with – – – XVC6ppand
XVC6pp5S
XVC6ppK and
XVC6pp5SK
XVC6Bpand
XVC6Bpp5S,
XVC6Mpand
XVC6Mp5S
Height to be added (mm) 32 24,5 82 30 21,6 82
References Metal fixing plate XVCZ11 – – XVCZ02 XVCZ12 –
Plastic fixing plate – XVCZ01 – – – –
Wall mounting bracket – – XVCZ31 – – XVCZ32
XVC1
Mounting accessories Tower lights Ø 100 mm, XVC1
Description Vertical support
Diameter (mm) Ø 140 Ø 140 – –
For use with XVC1ppK
and
XVC1ppSK
XVC1ppHK (with siren) XVC1ppK and XVC1ppSK XVC1ppHK
(with siren)
Height to be added (mm) 300 306 – –
References Metal fixing plate (2) XVCZ13 XVCZ14 – –
Metal fixing bracket – – XVCZ23 XVCZ24
(2) Chromium plated-steel extension tube
24
Modular tower lights
Ø 70 mm, for customer assembly
Harmony
XVB
Ø 70 mm / Up to IP66
Illuminated beacons XVBL Steady light Flashing light
Light source Incandescent BA 15d bulb, Protected BA 15d LED Protected BA 15d LED “Flash” discharge tube
10 W max. (not included) (included) (included) 5 J (2)
Degree of protection IP 66
References (1) 12…250 V AC/DC XVBL3p – – –
24 V AC/DC – XVBL0Bp XVBL1Bp XVBL6Bp
120 V AC – XVBL0Gp XVBL1Gp XVBL6Gp
230 V AC – XVBL0Mp XVBL1Mp XVBL6Mp
Ø 70 mm / Up to IP66
Tower lights XVBC
comprising 2 to 5 signalling units (3)
Base units Steady light Flashing
light
“Flash”
light
Audible
units (90 db
at 1 m)
Light source – Incandescent Integral Integral “Flash” –
BA 15d bulb, 10 W protected LED protected LED discharge tube
max. (not included) 5 J (2)
Degree of protection IP 66
Base unit references with cover XVBC21 (4) – – – – –
without cover XVBC07 (5) – – – – –
References (2) 12… 230 V AC/DC – XVBC3p – – – –
24 V AC/DC – – XVBC2Bp XVBC5Bp XVBC6Bp –
120 V AC – – XVBC2Gp XVBC5Gp XVBC6Gp –
230 V AC – – XVBC2Mp XVBC5Mp XVBC6Mp –
Audible unit references 12…48 V AC/DC – – – – – XVBC9B
unidirectional 120…230 V AC – – – – – XVBC9M
(1) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow.
(2) To order a lens unit with a 10 J discharge tube, replace the number 6 by 8 in the reference (example: XVBL6Bp becomes XVBL8Bp).
(3) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum.
(4) For connection on AS-Interface, order base unit XVBC21A (side cable entry) or XVBC21B (bottom cable entry with M12 connector on flying lead).
(5) For indicator banks with “flash” discharge tube unit.
25
Modular tower lights
Ø 70 mm, for customer assembly
Harmony
XVE
Ø 70 mm / Up to IP54
Illuminated beacons XVEL Steady light Flashing light
Light source Incandescent Integral “Flash” discharge tube, 1 J
BA 15d bulb, 5 W max. LED
(not included)
Degree of protection IP 42/IP 54 (with sealing kit)
References (1) 24… 240 V AC/DC XVEL3p –
24 V AC/DC – XVEL2Bp XVEL6Bp
120 V AC – XVEL2Gp XVEL6Gp
230 V AC – XVEL2Mp XVEL6Mp
Ø 70 mm / Up to IP54
Indicator banks XVEC
comprising 2 to 5 signalling units (2)
Base units Steady light Flashing
light
“Flash”
light
Audible
units (85 db
at 1 m)
Light source – Incandescent Integral Integral “Flash” –
BA 15d bulb, 5 W LED LED discharge tube
max. (not included) 1 J
Degree of protection IP 42/IP 54 (with sealing kit)
Base unit references IP 42 XVEC21 – – – – –
IP 54 XVEC21P – – – – –
Lens unit references (1) 24…230 V AC/DC – XVEC3p –
24 V AC/DC – – XVEC2Bp XVEC5Bp XVEC6Bp XVEC9B
120 V AC – – XVEC2Gp XVEC5Gp XVEC6Gp XVEC9G
230 V AC – – XVEC2Mp XVEC5Mp XVEC6Mp XVEC9M
(1) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow.
(2) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum.
26
Modular tower lights
Ø 45, Ø 50 mm, complete or
for customer assembly
Harmony
XVM / XVP
Ø 45 mm / IP42
Complete, pre-wired tower light XVM (1) 2 sig. units + integral buzzer (2)
Steady light
3 signalling units + integral buzzer (2)
Steady light Steady light + “flash” (3)
Light source (included) Incandescent BA 15d Incandescent BA 15d Incandescent BA 15d
BA 15d bulb, 5 W “Super bright”
LED
BA 15d bulb, 5 W “Super bright”
LED
BA 15d bulb, 5 W “Super bright”
max. max. max. LED
Degree of protection IP 54
Signalling colours Red - Green Red - Orange - Green
References 24 V AC/DC XVMB1RGS XVMB2RGSSB XVMB1RAGS XVMB2RAGSSB XVMB1R6AGS XVMB2R6AGSSB
120 V AC/DC (bulb) - 120 V AC (LED) XVMG1RGS XVMG2RGSSB XVMG1RAGS XVMG2RAGSSB XVMG1R6AGS XVMG2R6AGSSB
230 V AC/DC (bulb) - 230 V AC (LED) XVMM1RGS XVMM2RGSSB XVMM1RAGS XVMM2RAGSSB XVMM1RA6GS XVMM2R6AGSSB
(1) Tower lights XVM are also available as separate components for customised assembly by the user: please refer to www.schneider-electric.com.
(2) To order products without an integral buzzer, delete the letter S at the end of the reference (example: XVMB2RGS becomes XVMB2RG, XVMB2RGSSB becomes XVMB2RGSB).
(3) Flash signalling colour: red - 0.8 J.
Ø 50 mm / IP65
Tower lights XVP
comprising 2 to 5 signalling units (4),
black clamping ring (5)
Base unit Steady or
flashing light
signalling
“Flash” light signalling Audible units
(55…85 dB
at 1 m)
Light source – Incandescent “Flash” “Flash” –
BA 15d bulb, 7 W discharge tube discharge tube
max. (not included) 0.3 J 0.6 J
Degree of protection IP 65
Base unit with cover XVPC21 – – – –
References (6) 250 V max. – XVPC3p – – –
24 V AC/DC (flash) - 24 V DC (buzzer) – – XVPC6Bp – XVPC09B
120 V AC – – – XVPC6Gp XVPC09G
230 V AC – – – XVPC6Mp XVPC09M
(4) A tower light comprises: 1 base unit + 1 to 5 signalling units maximum.
(5) To order products with a cream clamping ring, add the letter W to the end of the reference (example: base unit + green lens unit: XVPC21W + XVPC33W etc.).
(6) To obtain the complete reference, replace thep by the number designating the colour as follow: 3 = green , 4 = red , 5 = orange, 6 = blue, 7 = clear, 8 = yellow.
27
Bulbs Beacons and tower lights
XVB / XVP (1)
Type of light source Incandescent Incandescent LED (2) Flashing
BA 15d base BA 15d base BA 15d base LED (2)
7 W 10 W (not XVP) BA 15d base
References 12 V DL1BEJ DL1BLJ – –
24 V DL1BEB DL1BLB DL1BDBp DL1BKBp
48 V DL1BEE DL1BLE – –
120 V DL1BEG DL1BLG DL1BDGp DL1BKGp
230 V DL1BEM DL1BLM DL1BDMp DL1BKMp
(1) Tower lights XVP can be fitted with 5 W incandescent bulbs: see beacons XVDLS / XVE.
(2) To obtain the complete reference, replace the p by the number designating the colour as follow: 1 = white, 3 = green , 4 = red , 5 = orange, 6 = blue, 8 = yellow.
Bulbs Tower lights
XVM
Type of light source Incandescent LED (3) Flashing “Flash” discharge
BA 15d base BA 15d base LED (3) tube, 0.8 Joule
5 W BA 15d base BA 15d base
References 24 V DL1EDBS DL2EDBpSB DL1EKBpSB DL6BB
120 V DL1EDGS DL2EDGpSB DL1EKGpSB DL6BG
230 V DL1EDMS DL2EDMpSB DL1EKMpSB DL6BM
(3) To obtain the complete reference, replace the p by the number designating the colour as follows: 1 = white, 3 = green , 4 = red , 6 = blue, 8 = orange.
Mounting accessories Beacons and
tower lights
XVB / XVE
Tower lights Tower lights
XVP XVM
Description Aluminium tube Plastic tube Aluminium tube Aluminium tube Aluminium tube Aluminium tube
with integral black with integral black with integral black with steel fixing with integral cream with steel fixing
plastic fixing base plastic fixing base plastic fixing base bracket plastic fixing base bracket
Diameter (mm) Ø 25 Ø 25 Ø 20 Ø 20 Ø 20 Ø 20
Support tubes 60 mm XVEZ13 – – – – –
100 mm – – – XVPC02T XVMZ02 XVMZ02T
112 mm – – XVPC02 (4) – – –
120 mm XVBZ02 – – – – –
140 mm – XVDC02 – – – –
250 mm – – – XVPC03T XVMZ03 XVMZ03T
260 mm – – XVPC03 (4) – – –
400 mm – – – XVPC04T XVMZ04 XVMZ04T
410 mm – – XVPC04 (4) – – –
420 mm XVBZ03 – – – – –
820 mm XVBZ04 – – – – –
Fixing plates, for vertical support XVBC12 XVPC12 (4) –
for horizontal support XVBZ01 – XVMZ06
(4) To order an aluminium support tube with integral cream fixing base, add the letter W to the end of the reference (example: XVPC02W).
Modular tower lights accessories
For XVB, XVP, XVE, XVM
Harmony
XV
28
Rotating beacons
Ø 84, 106, 120, 130 mm rotating beacons
Harmony
XVR
Ø 84 / 106 mm
Complete, pre-wired rotating beacons Ø 84 mm Ø 106 mm
Light source (included) “ Super bright “ LEDs
Base mount 3 x Ø 05
Buzzer Without buzzer
Degree of protection IP23 (IP 65 with accessories) IP23 (IP 55 with accessories)
Voltage 12V AC/DC 24V AC/DC 12V AC/DC 24V AC/DC
References Red XVR08J04 XVR08B04 XVR10J04 XVR10B04
Orange XVR08J05 XVR08B05 XVR10J05 XVR10B05
Green XVR08J03 XVR08B03 XVR10J03 XVR10B03
Blue XVR08J06 XVR08B06 XVR10J06 XVR10B06
Ø 120 mm
Complete, pre-wired rotating beacons Ø 120 mm
Light source (included) “ Super bright “ LEDs
Base mount 3 x M5
Buzzer Without buzzer With buzzer
Degree of protection IP23
Voltage 12V AC/DC 24V AC/DC 12V AC/DC 24V AC/DC
References Red XVR12J04 XVR12B04 XVR12J04S XVR12B04S
Orange XVR12J05 XVR12B05 XVR12J05S XVR12B05S
Green XVR12J03 XVR12B03 XVR12J03S XVR12B03S
Blue XVR12J06 XVR12B06 XVR12J06S XVR12B06S
Ø 130 mm
Complete, pre-wired rotating beacons Ø 130 mm
Light source (included) “ Super bright “ LEDs
Base mount 3 x Ø 09
Buzzer Without buzzer
Degree of protection IP66 - Resistant to vibration IP66 and IP67
Voltage 12V DC 24V DC 24V AC/DC 120V AC 230V AC
References Red XVR13J04 XVR13B04 XVR13B04L XVR13G04L XVR13M04L
Orange XVR13J05 XVR13B05 XVR13B05L XVR13G05L XVR13M05L
29
Accesories for rotating mirrors Reflecting prism Rubber base Metal angle
bracket
Metal fixing plate
To be used for/with – Increasing the IP degree Horizontal support Horizontal support
Height (mm) – – – 300
References Ø 84 mm XVRZR1 XVRZ081 XVCZ23 –
Ø 106 mm XVRZR2 XVRZ082 XVCZ23 XVCZ13
Ø 120 mm XVRZR3 – XVCZ23 XVCZ13
Ø 130 mm XVRZR3 – XVR012L –
Electronic alarms and multisound sirens
Sirens and electronic alarms Sirens Multisound
sirens
pre-wired
Electronic alarms
Panel Mount DIN72
Electronic alarms
Panel Mount DIN96
Sound level 106 dB 105 dB 90 dB 96 dB
Tones 2 43 16 16
Channels – 8 4 4
Degree of protection IP 53 IP53 IP 54 IP 54
Colors White White Black White Black White
References 12/24V AC/DC XVS10BMW – XVS72BMBp (1) XVS72BMWp (1) XVS96BMBp (1) XVS96BMWp (1)
12/24V DC – XVS14BMW – – – –
120V AC XVS10GMW XVS14GMW – – – –
230V AC XVS10MMW XVS14MMW – – – –
(1) To obtain a complete reference, replace the p by the letter as follow: P = PNP, N = NPN (ex. XVS72BMBP)
Rotating beacons accessories
and sound solutions
Accessories for rotating beacons
Harmony
XVR / XVS
30
Type XACA “Pistol grip”
Degree of protection IP 65 / Nema 4, 4X / Class II
Rated operational characteristics AC 15 (240 V 3 A), DC 13
Conventional thermal current Ithe 10 A
Connection Screw clamp terminals, 1 x 2.5 mm2 or 2 x 1.5 mm2
For control of single-speed motors 2-speed motors
Dimensions (mm) W x H x D 52 x 295 x 71 (x 85 with ZA2BS834) 52 x 295 x 71 (x 85 with ZA2BS834)
Number of operators mechanically interlocked 2 2
Emergency stop without ZA2BS834 without ZA2BS834
References XACA201 XACA2014 XACA207 XACA2074
Type XACA
For control of single-speed motors
Dimensions (mm) W x H x D 80 x 314 x 70 (x 90 with ZA2BS834) 80 x 440 x 70 (x 90 with ZA2BS844)
Number of operators mechanically interlocked between pairs 2 4
Emergency stop without ZA2BS834 without ZA2BS844
References XACA271 XACA2714 XACA471 XACA4714
For control of single-speed motors + I / O
Dimensions (mm) W x H x D 80 x 500 x 70 (x 90 with ZA2BS844) 80 x 560 x 70
Number of operators mechanically interlocked between pairs 6 8
Emergency stop without ZA2BS844 without
References XACA671 XACA6714 XACA871
Empty enclosures type XACA
Number of ways 2 3 4 5 6 8 12
References XACA02 XACA03 XACA04 XACA05 XACA06 XACA08 XACA12
Pendant control stations
for control circuits
Ready to use
Harmony
XAC
31
(1) Trigger action mechanically latching Emergency stop pushbuttons conform to standards EN/IEC 60204-32, EN/ISO 13850, Machinery directive 2006/42/EC and standard
EN/IEC 60947-5-5.
Legends, 30 x 40 mm With symbols conforming to NF E 52-124 With text
References ZB2BY4901 ZB2BY4903 ZB2BY4907 ZB2BY4909 ZB2BY4913 ZB2BY4915 ZB2BY4930 ZB2BY2303 ZB2BY2304
References ZB2BY2904 ZB2BY2906 ZB2BY2910 ZB2BY2912 ZB2BY2916 ZB2BY2918 ZB2BY2931 ZB2BY1W140
blank
white or yellow
background
Separate components (for mounting in enclosures XACA)
Booted operators
white XACA9411
black XACA9412
Mushroom head, latching, trigger action (1)
turn to release Ø 40 ZA2BS844
Ø 30 ZA2BS834
Mushroom head, latching, trigger action (1)
key release Ø 40 ZA2BS944
Ø 30 ZA2BS934
Selector switch
2 pos. stay put ZA2BD2
3 pos. stay put ZA2BD3
Key switch
key n° 455 2 pos. stay put ZA2BG4
3 pos. stay put ZA2BG5
Blanking plug
with seal and ZB2SZ3
fixing nut
Pilot light heads
white ZA2BV01
green ZA2BV03
red ZA2BV04
yellow ZA2BV05
Pilot light bodies
direct supply ZB2BV006
direct supply, through resistor ZB2BV007
Protective guard (for base mounted units)
For selector switch XACA982/983
For emergency stop pushbutton XACA984
Contact blocks
Single-speed NO ZB2BE101
Single-speed NC ZB2BE102
Contacts blocks for XACA941p
Single-speed NC+NO XENG1491
2-speed NC+NO+NO XENG1191
Contact blocks (for mounting in enclosure base)
NO XACS101
NC+NO XACS105
Isolating switch, slow break, for front mounting
Emergency stop NC+NC+NC
with positive opening operation
XENT1192
Double blocks latching, slow break
Single-speed NO+NO XENG3781
Single-speed NO+NC XENG3791
32
Notes
33
ART. 097419 01/2013 - V10.0
DIA4ED2040408EN
Head Office
35, rue Joseph Monier - CS 30323
F92500 Rueil-Malmaison Cedex
France
www.schneider-electric.com
The information provided in this documentation contains general descriptions and/or technical
characteristics of the performance of the products contained herein. This documentation is not
intended as a substitute for and is not to be used for determining suitability or reliability of these
products for specific user applications. It is the duty of any such user or integrator to perform the
appropriate and complete risk analysis, evaluation and testing of the products with respect to the
relevant specific application or use thereof. Neither Schneider Electric nor any of its affiliates or
subsidiaries shall be responsible or liable for misuse of the information contained herein.
Design : IGS-CP
Photos : Schneider Electric
Print :
http://www.farnell.com/datasheets/1761538.pdf
This document was generated on 01/06/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number: 39-01-2020
Status: Active
Overview: Mini-Fit Jr.™ Power Connectors
Description: Mini-Fit Jr.™ Receptacle Housing, Dual Row, UL 94V-2, 2 Circuits
Documents:
3D Model Product Specification PS-5556-001 (PDF)
Drawing (PDF) Test Summary TS-5556-002 (PDF)
Product Specification PS-45750-001 (PDF) RoHS Certificate of Compliance (PDF)
Agency Certification
CSA LR19980
UL E29179
General
Product Family Crimp Housings
Series 5557
Application Power, Wire-to-Wire
Comments Current = 13A max. per circuit when header is mated
to a receptacle loaded with 45750 series terminals
crimped to 16 AWG wire. . See Molex product
specification PS-45750-001 for additional current
derating information.. Glow Wire Equivalent Part.
MolexKits Yes
Overview Mini-Fit Jr.™ Power Connectors
Product Name Mini-Fit Jr.™
UPC 800753584259
Physical
Breakaway No
Circuits (maximum) 2
Color - Resin Natural
Flammability 94V-2
Gender Female
Glow-Wire Compliant No
Material - Resin Nylon
Net Weight 0.657/g
Number of Rows 2
Packaging Type Bag
Panel Mount No
Pitch - Mating Interface 4.20mm
Pitch - Termination Interface 4.20mm
Polarized to Mating Part Yes
Stackable No
Temperature Range - Operating -40°C to +105°C
Electrical
Current - Maximum per Contact 13A
Material Info
Old Part Number 5557-02R
Reference - Drawing Numbers
Product Specification PS-45750-001, PS-5556-001, RPS-5557-046
Sales Drawing SD-5557-003
Test Summary TS-5556-002
Series
image - Reference only
EU RoHS China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Low-Halogen Status
Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
5557Series
Mates With
5559 Dual Row, 5566 Vertical with Pegs,
5566 Vertical without Pegs, 5569 Right
Angle Dual Row with Flanges, 5569 Right
Angle Dual Row with Pegs, 43810 , 44068 ,
44281 , 87427 , 42404 , 42440
Use With
5556 Mini-Fit® Female Crimp Terminals,
45750 Mini-Fit® Plus HCS Crimp TerminalThis document was generated on 01/06/2014
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
This document was generated on 10/10/2013
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number: 87439-0400
Status: Active
Overview: Pico-Spox™ Wire-to-Board Connector System
Description: 1.50mm Pitch Pico-SPOX™ Wire-to-Board Housing, 4 Circuits, Off-White Housing
Documents:
3D Model RoHS Certificate of Compliance (PDF)
Drawing (PDF) Product Literature (PDF)
Product Specification PS-87437 (PDF)
Agency Certification
CSA LR19980
UL E29179
General
Product Family Crimp Housings
Series 87439
Application Signal, Wire-to-Board
MolexKits Yes
Overview Pico-Spox™ Wire-to-Board Connector System
Product Literature Order No USA-235
Product Name Pico-SPOX™
UPC 800753537224
Physical
Circuits (maximum) 4
Color - Resin Natural
Flammability 94V-0
Gender Female
Glow-Wire Compliant No
Lock to Mating Part Yes
Material - Resin Nylon
Net Weight 55.000/mg
Number of Rows 1
Packaging Type Bag
Panel Mount No
Pitch - Mating Interface 1.50mm
Polarized to Mating Part Yes
Stackable No
Temperature Range - Operating -55°C to +105°C
Electrical
Current - Maximum per Contact 2.5A
Material Info
Reference - Drawing Numbers
Product Specification PS-87437, RPS-87437, RPS-87437-001,
RPS-87437-200, RPS-87438-002
Sales Drawing SD-87439-**00
Series
image - Reference only
EU RoHS China RoHS
ELV and RoHS
Compliant
REACH SVHC
Contains SVHC: No
Low-Halogen Status
Low-Halogen
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Search Parts in this Series
87439Series
Mates With
Pico-SPOX™ Wire-to-Board Header 87437 ,
87438
Use With
87421 Pico-SPOX™ Crimp Terminal
This document was generated on 10/10/2013
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
PMBFJ620
Dual N-channel field-effect transistor
Rev. 2 — 15 September 2011 Product data sheet
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per FET
VDS drain-source voltage - - 25 V
VGSoff gate-source cut-off
voltage
VDS = 10 V; ID = 1 A 2 - 6.5 V
IDSS drain current VGS = 0 V; VDS = 10 V 24 - 60 mA
Ptot total power
dissipation
Ts 90 C - - 190 mW
yfs forward transfer
admittance
VDS = 10 V;
ID = 10mA
10 - - mS
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 2 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
2. Pinning information
3. Ordering information
4. Marking
[1] * = p: made in Hong Kong.
* = t: made in Malaysia.
* = W: made in China.
Table 2. Discrete pinning information
Pin Description Simplified outline Symbol
1 source (1)
2 source (2)
3 gate (2)
4 drain (2)
5 drain (1)
6 gate (1)
1 2 3
6 5 4
sym034
6
3 2
4
1
5
Table 3. Ordering information
Type number Package
Name Description Version
PMBFJ620 - plastic surface mounted package; 6 leads SOT363
Table 4. Marking
Type number Marking code[1]
PMBFJ620 A8*
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 3 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
5. Limiting values
6. Thermal characteristics
[1] Ts is the temperature at the soldering point of the gate pins, see Figure 1.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per FET
VDS drain-source voltage - 25 V
VGSO gate-source voltage open drain - 25 V
VGDO drain-gate voltage open source - 25 V
IG forward gate current (DC) - 50 mA
Ptot total power dissipation Ts 90 C - 190 mW
Tstg storage temperature 65 +150 C
Tj junction temperature - 150 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-s) thermal resistance from junction
to soldering points
single loaded [1] 315 K/W
double loaded [1] 160 K/W
(1) Double loaded.
(2) Single loaded.
Fig 1. Power derating curve.
Ts (°C)
0 50 100 150 200
001aaa742
200
100
300
400
Ptot
(mW)
0
(1)
(2)
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 4 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
7. Static characteristics
8. Dynamic characteristics
Table 7. Characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per FET
V(BR)GSS gate-source breakdown
voltage
IG = 1 A; VDS = 0 V 25 - - V
VGSoff gate-source cut-off voltage ID = 1 A; VDS = 10 V 2 - 6.5 V
VGSS gate-source forward voltage IG = 1 mA; VDS = 0 V - - 1 V
IDSS drain-source leakage current VDS = 10 V; VGS = 0 V 24 - 60 mA
IGSS gate-source leakage current VGS = 15 V; VDS = 0 V - - 1 nA
RDSon drain-source on-state
resistance
VGS = 0 V; VDS = 100mV - 50 -
yfs common source forward
transfer admittance
ID = 10 mA; VDS = 10 V 10 - - mS
yos common source output
admittance
ID = 10 mA; VDS = 10 V - - 250 S
Table 8. Characteristics
Tj = 25 C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per FET
Ciss input capacitance VDS = 10 V; VGS = 10 V; f =1 MHz - 3 5 pF
VDS = 10 V; VGS = 0 V; Tamb = 25 C - 6 - pF
Crss reverse transfer capacitance VDS = 0 V; VGS = 10 V; f = 1 MHz - 1.3 2.5 pF
gis common source input
conductance
VDS = 10 V; ID = 10 mA; f = 100 MHz - 200 - S
VDS = 10 V; ID = 10 mA; f = 450 MHz - 3 - mS
gfs common source transfer
conductance
VDS = 10 V; ID = 10 mA; f = 100 MHz - 13 - mS
VDS = 10 V; ID = 10 mA; f = 450 MHz - 12 - mS
grs common source reverse
conductance
VDS = 10 V; ID = 10 mA; f = 100 MHz - 30 - S
VDS = 10 V; ID = 10 mA; f = 450 MHz - 450 - S
gos common source output
conductance
VDS = 10 V; ID = 10 mA; f = 100 MHz - 150 - S
VDS = 10 V; ID = 10 mA; f = 450 MHz - 400 - S
Vn equivalent input noise voltage VDS = 10 V; ID = 10 mA; f = 100 Hz - 6 - nV/Hz
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 5 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
VDS = 10 V; Tj = 25 C. VDS = 10 V; ID = 10 mA; Tj = 25 C.
Fig 2. Drain current as a function of gate-source
cut-off voltage; typical values.
Fig 3. Common source forward transfer admittance
as a function of gate-source cut-off voltage;
typical values.
VDS = 10 V; ID = 10 mA; Tj = 25 C. VDS = 100 mV; VGS = 0 V; Tj = 25 C.
Fig 4. Common-source output conductance as a
function of gate-source cut-off voltage; typical
values.
Fig 5. Drain-source on-state resistance as a function
of gate-source cut-off voltage; typical values.
VGSoff (V)
0 −1 −2 −3 −4
mcd220
20
30
10
40
50
IDSS
(mA)
0
0 −2 −4 −8
mcd219
−6
20
0
16
12
8
yfs
(mS)
4
VGSoff (V)
0
150
100
50
0
−1 −2 −4
mcd221
−3
gos
(μS)
VGSoff (V)
0 −1 −2 −4
80
60
20
0
40
mcd222
−3
RDSon
(Ω)
VGSoff (V)
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 6 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
Tj = 25 C. VDS = 10 V; Tj = 25 C.
Fig 6. Typical output characteristics. Fig 7. Typical transfer characteristics.
VDS = 10 V; Tj = 25 C. VDS = 10 V; Tj = 25 C.
Fig 8. Reverse transfer capacitance as a function of
gate-source voltage; typical values.
Fig 9. Input capacitance as a function of gate-source
voltage; typical values.
VDS (V)
0 4 8 12 16
mcd217
20
10
30
40
ID
(mA)
0
(2)
(4)
(1)
(5)
(6)
(3)
−4 −3 −2 0
40
30
10
0
20
mcd214
−1
ID
(mA)
VGS (V)
−10 −4 0
4
3
1
0
2
mcd224
−8 −6 −2
Crs
(pF)
VGS (V)
−10 0
10
0
mcd223
−8 −6 −4 −2
8
6
4
2
Cis
(pF)
VGS (V)
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 7 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
VDS = 10 V; Tj = 25 C.
Fig 10. Drain current as a function of gate-source voltage; typical values.
Tj = 25 C.
Fig 11. Gate current as a function of drain-gate voltage; typical values.
mcd229
1
10−2
10−1
102
10
103
ID
(μA)
10−3
VGS (V)
−2.5 −2.0 −1.5 −1.0 −0.5 0
mcd230
−10
−1
−103
−102
−104
IGSS
(pA)
−10−1
VDG (V)
0 4 8 12 16
(1)
(2)
(3)
(4)
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 8 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
Fig 12. Gate current as a function of junction temperature; typical values.
mcd231
10
1
103
102
104
IGSS
(pA)
10−1
Tj (°C)
−25 25 75 125 175
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 9 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
VDS = 10 V; ID = 10 mA; Tamb = 25 C. VDS = 10 V; ID = 10 mA; Tamb = 25 C.
Fig 13. Input admittance as a function of frequency;
typical values.
Fig 14. Forward transfer admittance as a function of
frequency; typical values.
VDS = 10 V; ID = 10 mA; Tamb = 25 C. VDS = 10 V; ID = 10 mA; Tamb = 25 C.
Fig 15. Reverse transfer admittance as a function of
frequency; typical values.
Fig 16. Output admittance as a function of frequency;
typical values.
mcd228
10
1
gis, bis
(mS)
10−1
102
f (MHz)
10 102 103
bis
gis
f (MHz)
10 102 103
mcd227
10
102
gfs,−bfs
(mS)
1
gfs
−bfs
mcd226
f (MHz)
10 102 103
−10−1
−1
−10
−102
brs, grs
(mS)
−10−2
brs
grs
mcd225
10
1
bos, gos
(mS)
10−1
102
f (MHz)
10 102 103
bos
gos
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 10 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
9. Package outline
Fig 17. Package outline.
OUTLINE REFERENCES
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT363 SC-88
bp w M B
D
e1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
v M A
B A
y
0 1 2 mm
scale
c
X
1 2 3
6 5 4
Plastic surface-mounted package; 6 leads SOT363
UNIT
A1
max
bp c D E e1 HE Lp Q v w y
mm 0.1
0.30
0.20
2.2
1.8
0.25
0.10
1.35
1.15
0.65
e
1.3 2.2
2.0
0.2 0.2 0.1
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.25
0.15
A
1.1
0.8
04-11-08
06-03-16
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 11 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
10. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PMBFJ620 v.2 20110915 Product data sheet - PMBFJ620 v.1
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Package outline drawings have been updated to the latest version.
PMBFJ620 v.1
(9397 750 13006)
20040511 Product data sheet - -
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 12 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
11. Legal information
11.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
PMBFJ620 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 15 September 2011 13 of 14
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PMBFJ620
Dual N-channel field-effect transistor
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 September 2011
Document identifier: PMBFJ620
Advanced Materials
Araldite® 2014-1
Structural Adhesives
TECHNICAL DATA SHEET
Araldite® 2014-1
Two component epoxy paste adhesive
Key properties Grey paste
High temperature and chemical resistance
Low shrinkage
Very resistant to water and a variety of chemicals
Gap filling, non sagging up to 5mm thickness
Description Araldite 2014-1 is a two component, room temperature curing, thixotropic paste adhesive of high strength with good
environmental and excellent chemical resistance.
Used for bonding of metals, electronic components, GRP structures and many other items where a higher than
normal temperature or more aggressive environment is to be encountered in service. The low out gassing makes this
product suitable for specialist electronic telecommunication and aerospace applications.
Product data
Property 2014-1/A 2014-1/B 2014-1 (mixed)
Colour (visual) beige paste grey paste grey paste
Specific gravity ca. 1.6 ca. 1.6 ca. 1.6
Viscosity at 25°C (Pas) ca. 100 thixotropic thixotropic
Pot Life (100 gm at 25 C) - - 60 minutes
Shelf life (2-40 C) 3 years 3 years -
Processing Pretreatment
The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded.
At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone or other proprietary
degreasing agents in order to remove all traces of oil, grease and dirt.
Low grade alcohol, gasoline (petrol) or paint thinners should never be used.
The strongest and most durable joints are obtained by either mechanically abrading or chemically etching ( pickling )
the degreased surfaces. Abrading should be followed by a second degreasing treatment.
Mix ratio Parts by weight Parts by volume
Araldite 2014-1/A 100 100
Araldite 2014-1/B 50 50
Araldite 2014-1 is available in cartridges incorporating mixers and can be applied as ready to use adhesive with the
aid of the tool recommended by Huntsman Advanced Materials.
April 2007 Araldite® 2014-1 2/6
Application of adhesive
The resin/hardener mix may be applied manually or robotically to the pretreated and dry joint surfaces. Huntsman's
technical support group can assist the user in the selection of an suitable application method as well as suggest a
variety of reputable companies that manufacture and service adhesive dispensing equipment.
A layer of adhesive 0.05 to 0.10 mm thick will normally impart the greatest lap shear strength to the joint. Huntsman
stresses that proper adhesive joint design is also critical for a durable bond. The joint components should be
assembled and secured in a fixed position as soon as the adhesive has been applied.
For more detailed explanations regarding surface preparation and pretreatment, adhesive joint design, and the dual
syringe dispensing system, visit www.araldite2000plus.com.
Equipment maintenance
All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of
cured residues is a difficult and time-consuming operation.
If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition,
avoid skin and eye contact.
Times to minimum shear strength
Temperature C 10 15 23 40 60 100
Cure time to reach hours 14 8 3 - - -
LSS > 1MPa minutes - - - 60 15 3
Cure time to reach hours 20 11 5 - - -
LSS > 10MPa minutes - - - 80 20 4
LSS = Lap shear strength.
Typical cured
properties
Unless otherwise stated, the figures given below were all determined by testing standard specimens made by lapjointing
114 x 25 x 1.6 mm strips of aluminium alloy. The joint area was 12.5 x 25 mm in each case.
The figures were determined with typical production batches using standard testing methods. They are provided
solely as technical information and do not constitute a product specification.
Average lap shear strengths of typical metal-to-metal joints (ISO 4587)
Cured for 16 hours at 40°C and tested at 23 C
Pretreatment - Sand blasting
0 5 10 15 20 25
Aluminium
Steel 37/11
Stainless steel V4A
Galvanised steel
Copper
Brass
MPa
April 2007 Araldite® 2014-1 3/6
Average lap shear strengths of typical plastic-to-plastic joints (ISO 4587)
Cured for 16 hours at 40 C and tested at 23 C. Pretreatment - Lightly abrade and alcohol degrease.
0 2 4 6 8 10 12 14
GRP
CFRP
SMC
ABS
PVC
PMMA
Polycarbonate
Polyamides
MPa
Lap shear strength versus temperature (ISO 4587) (typical average values)
Cure: (a) = 7 days /23 C; (b) = 24 hours/23 C + 30 minutes/80 C
0
5
10
15
20
25
30
°C -40 -20 0 20 40 60 80 100 120 140
MPa
a
b
Roller peel test (ISO 4578)
Cured: 16 hours/40 C 3.0 N/mm
Glass transition temperature (DSC)
Cure: 24 hours at 23 C plus 1 hour at 80 C: ca. 85 C
Shear modulus (DIN 53445) Cure: 16 hours/40 C
50 C - 1.2 GPa
75 C - 400 MPa
100 C - 180 Mpa
125 C - 20 Mpa
E - modulus (ISO R527) at 23 C 4 GPa
April 2007 Araldite® 2014-1 4/6
Flexural Properties (ISO 178) Cure 16 hours/ 40ºC Cure 1 day/ 23°C +30mins/ 80°C tested at 23°C
Flexural Strength 61 MPa
Flexural Modulus 4355 MPa
Tensile strength (ISO R527) at 23 C 26 MPa
Elongation at break 0,7%
Lap shear strength versus immersion in various media (typical average values)
Unless otherwise stated, L.S.S. was determined after immersion for 90 days at 23 C
0 5 10 15 20 25 30
As-made value
IMS
Gasoline (petrol)
Ethyl acetate
Acetic acid, 10%
Xylene
Lubricating oil
Paraffin
Water at 23°C
Water at 60°C
Water at 90°C
30 days 60 days 90 days
MPa
Cure: 16 hour/40°C
Lap shear strength versus tropical weathering
(40/92, DIN 50015; typical average values)
Cure: 16 hours/40C Test: at 23 C
0 5 10 15 20 25
As made value
After 30 days
After 60 days
After 90 days
MPa
April 2007 Araldite® 2014-1 5/6
Lap shear strength versus heat ageing
Cure: 16 hours/40 C
0 5 10 15 20 25
As-made value
30 days/ 70°C
60 days/ 70°C
90 days/ 70°C
MPa
April 2007 Araldite® 2014-1 6/6
Huntsman
Advanced
Materials
All recommendations for the use of our products, whether given by us in writing, verbally, or to be implied from the
results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such
recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are
suitable for his intended process or purpose. Since we cannot control the application, use or processing of the
products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will
not infringe any third party s intellectual property rights. We warrant that our products are free from defects in
accordance with and subject to our general conditions of supply.
Storage Araldite 2014-1A and Araldite 2014-1/B may be stored for up to 3 years at room temperature provided the
components are stored in sealed containers. The expiry date is indicated on the label.
Handling
precautions
Caution
Our products are generally quite harmless to handle provided that certain precautions normally taken when handling
chemicals are observed. The uncured materials must not, for instance, be allowed to come into contact with
foodstuffs or food utensils, and measures should be taken to prevent the uncured materials from coming in contact
with the skin, since people with particularly sensitive skin may be affected. The wearing of impervious rubber or
plastic gloves will normally be necessary; likewise the use of eye protection. The skin should be thoroughly cleansed
at the end of each working period by washing with soap and warm water. The use of solvents is to be avoided.
Disposable paper - not cloth towels - should be used to dry the skin. Adequate ventilation of the working area is
recommended. These precautions are described in greater detail in the Material Safety Data sheets for the individual
products and should be referred to for fuller information.
Huntsman Advanced Materials
(Switzerland) GmbH
Klybeckstrasse 200
4057 Basel
Switzerland
Tel: +41 (0)61 966 33 33
Fax: +41 (0)61 966 35 19
www.huntsman.com/advanced_materials
Huntsman Advanced Materials warrants only that its products meet the specifications agreed with the buyer. Typical properties,
where stated, are to be considered as representative of current production and should not be treated as specifications.
The manufacture of materials is the subject of granted patents and patent applications; freedom to operate patented processes is
not implied by this publication.
While all the information and recommendations in this publication are, to the best of our knowledge, information and belief,
accurate at the date of publication, NOTHING HEREIN IS TO BE CONSTRUED AS A WARRANTY, EXPRESS OR
OTHERWISE.
IN ALL CASES, IT IS THE RESPONSIBILITY OF THE USER TO DETERMINE THE APPLICABILITY OF SUCH INFORMATION
AND RECOMMENDATIONS AND THE SUITABILITY OF ANY PRODUCT FOR ITS OWN PARTICULAR PURPOSE.
The behaviour of the products referred to in this publication in manufacturing processes and their suitability in any given end-use
environment are dependent upon various conditions such as chemical compatibility, temperature, and other variables, which are
not known to Huntsman Advanced Materials. It is the responsibility of the user to evaluate the manufacturing circumstances and
the final product under actual end-use requirements and to adequately advise and warn purchasers and users thereof.
Products may be toxic and require special precautions in handling. The user should obtain Safety Data Sheets from Huntsman
Advanced Materials containing detailed information on toxicity, together with proper shipping, handling and storage procedures,
and should comply with all applicable safety and environmental standards.
Hazards, toxicity and behaviour of the products may differ when used with other materials and are dependent on manufacturing
circumstances or other processes. Such hazards, toxicity and behaviour should be determined by the user and made known to
handlers, processors and end users.
Except where explicitly agreed otherwise, the sale of products referred to in this publication is subject to the general terms and
conditions of sale of Huntsman Advanced Materials LLC or of its affiliated companies including without limitation, Huntsman
Advanced Materials (Europe) BVBA, Huntsman Advanced Materials Americas Inc., and Huntsman Advanced Materials (Hong
Kong) Ltd.
Huntsman Advanced Materials is an international business unit of Huntsman Corporation. Huntsman Advanced Materials trades
through Huntsman affiliated companies in different countries including but not limited to Huntsman Advanced Materials LLC in the
USA and Huntsman Advanced Materials (Europe) BVBA in Europe.
[Araldite® 2014-1] is a registered trademark of Huntsman Corporation or an affiliate thereof.
Copyright © 2007 Huntsman Corporation or an affiliate thereof. All rights reserved.
Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France
:
1.1 Identifiant du produit
1.3 Renseignements concernant le fournisseur de la fiche de données de sécurité
Adresse email de la
personne responsable
pour cette FDS
: Global_Product_EHS_AdMat@huntsman.com
Description du produit : Non disponible.
1.2 Utilisations identifiées pertinentes de la substance ou du mélange et utilisations déconseillées
SECTION 1: Identification de la substance/du mélange et de la
société/l’entreprise
Code du produit : 00057058
1.4 Numéro d’appel d’urgence
Organisme de conseil/centre antipoison national
Fournisseur
Numéro de téléphone : EUROPE: +32 35 75 1234
France ORFILA: +33(0)145425959
ASIA: +65 6336-6011
China: +86 20 39377888
Australia: 1800 786 152
New Zealand: 0800 767 437
USA: +1/800/424.9300
Système Utilisation du produit : adhésif bi-composants
Fournisseur : Huntsman Advanced Materials (Europe)BVBA
Everslaan 45
3078 Everberg / Belgium
Tel.: +41 61 299 20 41
Fax: +41 61 299 20 40
France : ORFILA 01.45.42.59.59 - Hors de France : +33.(0)1.45.42.59.59
Classification Xi; R41, R38
R43
N; R51/53
:
Dangers pour la santé :
humaine
Risque de lésions oculaires graves. Irritant pour la peau. Peut entraîner une
sensibilisation par contact avec la peau.
Dangers pour :
l’environnement
Toxique pour les organismes aquatiques, peut entraîner des effets néfastes à long
terme pour l'environnement aquatique.
Pour plus de détails sur les conséquences en termes de santé et les symptômes, reportez-vous à la section 11.
SECTION 2: Identification des dangers
2.1 Classification de la substance ou du mélange
Définition du produit : Working pack (preparation)
Voir section 16 pour le texte intégral des phrases R et mentions H déclarées ci-dessus.
Classification selon la directive 1999/45/CE [DPD]
Le produit est classé dangereux selon la directive 1999/45/CE et ses amendements.
2.2 Éléments d’étiquetage
Date d'édition / Date de révision : 3 Août 2011 1/19
ARALDITE 2014-1
Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France
Date d'impression :
Date d'édition :
3 Août 2011
3 Août 2011
N° de FDS.
Version :
: 00057058
1
2/19
SECTION 2: Identification des dangers
Autres dangers qui ne :
donnent pas lieu à une
classification
Non disponible.
Récipients devant être
pourvus d'une fermeture
de sécurité pour les
enfants
Non applicable.
Avertissement tactile de
danger
Non applicable.
:
:
Exigences d‘emballages spéciaux
Symbole(s) de danger
Conseils de prudence S26- En cas de contact avec les yeux, laver immédiatement et abondamment avec
de l'eau et consulter un spécialiste.
S39- Porter un appareil de protection des yeux/du visage.
S61- Éviter le rejet dans l'environnement. Consulter les instructions spéciales/la fiche
de données de sécurité.
R41- Risque de lésions oculaires graves.
R38- Irritant pour la peau.
R43- Peut entraîner une sensibilisation par contact avec la peau.
R51/53- Toxique pour les organismes aquatiques, peut entraîner des effets néfastes
à long terme pour l'environnement aquatique.
Phrases de risque
Ingrédients dangereux
:
:
:
:
Irritant, Dangereux pour l'environnement
produit de réaction: bisphénol-A-épichlorhydrine; résines époxydiques (poids
moléculaire moyen < 700)
résine époxidique à base de bisphénol F
éther diglycidique du 1,4-butanediol
N(3-diméthylaminopropyl)-1,3-propylènediamine
Indication de danger :
2.3 Autres dangers
Éléments d’étiquetage
supplémentaires
: Contient des composés époxydiques. Voir les informations transmises par le
fabricant.
Substance/préparation : Working pack (preparation)
Nom du Identifiants 67/548/CEE
produit/composant
SECTION 3: Composition/informations sur les composants
% Règlement (CE) Type
n° 1272/2008 [CLP]
Classification
produit de réaction:
bisphénol-Aépichlorhydrine;
résines époxydiques
(poids moléculaire
moyen < 700)
REACH #: 01-
2119456619-26
CAS: 25068-38-6
13 - 30 Xi; R36/38
R43
N; R51/53
Skin Irrit. 2, H315
Eye Irrit. 2, H319
Skin Sens. 1, H317
Aquatic Chronic 2, H411
[1]
résine époxidique à
base de bisphénol F
REACH #: 01-
2119454392-40
CAS: 9003-36-5
3 - 7 Xi; R36/38
R43
N; R51/53
Skin Irrit. 2, H315
Eye Irrit. 2, H319
Skin Sens. 1, H317
Aquatic Chronic 2, H411
[1]
éther diglycidique du
1,4-butanediol
REACH #: 01-
2119494060-45
CAS: 2425-79-8
1 - 3 Xn; R20/21
Xi; R36/38
Acute Tox. 4, H312
Acute Tox. 4, H332
[1]
Date d'édition / Date de révision : 3 Août 2011 2/19
ARALDITE 2014-1
Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France
Date d'impression :
Date d'édition :
3 Août 2011
3 Août 2011
N° de FDS.
Version :
: 00057058
1
3/19
SECTION 3: Composition/informations sur les composants
Les limites d'exposition professionnelle, quand elles sont disponibles, sont énumérées à la section 8.
Dans l'état actuel des connaissances du fournisseur et dans les concentrations d'application, aucun autre ingrédient
présent n'est classé comme dangereux pour la santé ou l'environnement, et donc nécessiterait de figurer dans cette
section.
Voir section 16 pour
le texte intégral des
phrases R
mentionnées cidessus
Voir section 16 pour le
texte intégral des
mentions H déclarées
ci-dessus.
R43
R52/53
Skin Irrit. 2, H315
Eye Irrit. 2, H319
Skin Sens. 1, H317
N(3-
diméthylaminopropyl)-
1,3-propylènediamine
CAS: 10563-29-8 1 - 3 Xn; R21/22
C; R34
R43
Acute Tox. 4, H302
Acute Tox. 4, H312
Skin Corr. 1B, H314
Eye Dam. 1, H318
Skin Sens. 1, H317
[1]
diglycidylester de
l'acide téréphthalique
CAS: 7195-44-0 0.1 - 1 Xi; R36/38
R43
N; R51/53
Skin Irrit. 2, H315
Eye Irrit. 2, H319
Skin Sens. 1, H317
Aquatic Chronic 2, H411
[1]
triglycidylester de
l'acide trimellitique
CAS: 7237-83-4 0.1 - 1 Xi; R36/38
R43
N; R51/53
Skin Irrit. 2, H315
Eye Irrit. 2, H319
Skin Sens. 1, H317
Aquatic Chronic 2, H411
[1]
[1] Substance classée avec un danger pour la santé ou l'environnement
[2] Substance avec une limite d'exposition au poste de travail
[3] La substance remplit les critères des PTB selon le Règlement (CE) n° 1907/2006, Annexe XIII
[4] La substance remplit les critères des tPtB selon le Règlement (CE) n° 1907/2006, Annexe XIII
Type
Contact avec la peau
Consulter un médecin immédiatement. Rincer immédiatement les yeux à grande
eau, en soulevant de temps en temps les paupières supérieures et inférieures.
Vérifier si la victime porte des verres de contact et dans ce cas, les lui enlever.
Continuez de rincer pendant 10 minutes au moins. Les brûlures chimiques doivent
être traitées sans tarder par un médecin.
Rincer la peau contaminée à grande eau. Retirer les vêtements et les chaussures
contaminés. Laver abondamment à l'eau les vêtements contaminés avant de les
retirer, ou porter des gants. Continuez de rincer pendant 10 minutes au moins.
Consulter un médecin. En cas d'affections ou de symptômes, évitez d'exposer plus
longuement. Laver les vêtements avant de les réutiliser. Laver les chaussures à
fond avant de les remettre.
4.1 Description des premiers secours
Transporter la victime à l'extérieur et la maintenir au repos dans une position où elle
peut confortablement respirer. S'il ne respire pas, en cas de respiration irrégulière
ou d'arrêt respiratoire, que le personnel qualifié pratique la respiration artificielle ou
administre de l'oxygène. Il peut être dangereux pour la personne assistant une
victime de pratiquer le bouche à bouche. Appelez un médecin en cas de
persistance ou d'aggravation des effets néfastes sur la santé. En cas
d'évanouissement, placez la personne en position latérale de sécurité et appelez un
médecin immédiatement. Assurez-vous d'une bonne circulation d'air. Détacher tout
ce qui pourrait être serré, comme un col, une cravate, une ceinture ou un ceinturon.
En cas d’inhalation de produits de décomposition lors d’un incendie, les symptômes
peuvent être différés. La personne exposée peut avoir besoin de rester sous
surveillance médicale pendant 48 heures.
Inhalation
Contact avec les yeux
:
:
:
SECTION 4: Premiers secours
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SECTION 4: Premiers secours
Rincez la bouche avec de l'eau. Enlever les prothèses dentaires s'il y a lieu.
Transporter la victime à l'extérieur et la maintenir au repos dans une position où elle
peut confortablement respirer. Si une personne a avalé de ce produit et est
consciente, lui faire boire de petites quantités d’eau. Si la personne est indisposée,
cesser de la faire boire car des vomissements pourraient entraîner un risque
supplémentaire. Ne pas faire vomir sauf indication contraire émanant du personnel
médical. En cas de vomissement, maintenez la tête vers le bas pour empêcher le
passage des vomissures dans les poumons. Appelez un médecin en cas de
persistance ou d'aggravation des effets néfastes sur la santé. Ne rien faire ingérer à
une personne inconsciente. En cas d'évanouissement, placez la personne en
position latérale de sécurité et appelez un médecin immédiatement. Assurez-vous
d'une bonne circulation d'air. Détacher tout ce qui pourrait être serré, comme un col,
une cravate, une ceinture ou un ceinturon.
Note au médecin traitant En cas d’inhalation de produits de décomposition lors d’un incendie, les symptômes
peuvent être différés. La personne exposée peut avoir besoin de rester sous
surveillance médicale pendant 48 heures.
Ingestion :
:
Traitements spécifiques
Protection des sauveteurs : Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence
de formation appropriée. Il peut être dangereux pour la personne assistant une
victime de pratiquer le bouche à bouche. Laver abondamment à l'eau les vêtements
contaminés avant de les retirer, ou porter des gants.
4.2 Effets et symptômes les plus importants, aigus ou différés
Effets aigus potentiels sur la santé
Inhalation : L'exposition aux produits de décomposition peut présenter des risques pour la santé.
Les effets graves d’une exposition peuvent être différés.
Irritant pour la bouche, Ingestion : la gorge et l'estomac.
Contact avec la peau : Irritant pour la peau. Peut entraîner une sensibilisation par contact avec la peau.
Contact avec les yeux : Gravement irritant pour les yeux. Risque de lésions oculaires graves.
Signes/symptômes de surexposition
Contact avec la peau
Ingestion
Inhalation Aucune donnée spécifique.
Aucune donnée spécifique.
Les symptômes néfastes peuvent éventuellement comprendre ce qui suit:
irritation
rougeur
:
:
:
Contact avec les yeux : Les symptômes néfastes peuvent éventuellement comprendre ce qui suit:
douleur ou irritation
larmoiement
rougeur
4.3 Indication quant à la nécessité d’une prise en charge médicale immédiate ou d’un traitement spécial
: Traitement symptomatique et thérapie de soutien comme indiqué. Après une
exposition sévère le patient doit être gardé sous contrôle médical pendant au moins
48 heures.
Utiliser un agent extincteur approprié pour étouffer l'incendie avoisinant.
5.1 Moyens d’extinction
Aucun connu.
Moyens d’extinction
appropriés
:
Moyens d’extinction
inappropriés
:
SECTION 5: Mesures de lutte contre l’incendie
5.2 Dangers particuliers résultant de la substance ou du mélange
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SECTION 5: Mesures de lutte contre l’incendie
En présence d'incendie, circonscrire rapidement le site en évacuant toute personne
se trouvant près des lieux de l'accident. Aucune initiative ne doit être prise qui
implique un risque individuel ou en l’absence de formation appropriée. Ce produit
est toxique pour les organismes aquatiques. L'eau du réseau d'extinction d'incendie
qui a été contaminée par ce produit doit être conservée en milieu fermé et ne doit
être déversée ni dans le milieu aquatique, ni aucun égout ou conduit d'évacuation.
Risque lié aux produits de
décomposition thermique
Dangers dus à la
substance ou au mélange
Les produits de décomposition peuvent éventuellement comprendre les substances
suivantes:
dioxyde de carbone
monoxyde de carbone
oxydes d'azote
oxydes de soufre
oxyde/oxydes de métal
L’augmentation de pression résultant d’un incendie ou d’une exposition à des
températures élevées peut provoquer l’explosion du conteneur.
Les pompiers devront porter un équipement de protection approprié ainsi qu'un
appareil de protection respiratoire autonome avec masque intégral fonctionnant en
mode pression positive. Les vêtements pour sapeurs-pompiers (y compris casques,
bottes de protection et gants) conformes à la Norme européenne EN 469 procurent
un niveau de protection de base contre les accidents chimiques.
Équipement de protection
spécial pour le personnel
préposé à la lutte contre
l'incendie
:
:
:
5.3 Conseils aux pompiers
Précautions spéciales pour
les pompiers
:
6.2 Précautions pour la
protection de
l’environnement
Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone
de déversement accidentel. S'approcher des émanations dans la même direction
que le vent. Bloquer toute pénétration possible dans les égouts, les cours d’eau, les
caves ou les zones confinées. Laver le produit répandu dans une installation de
traitement des effluents ou procéder comme suit. Contenir les fuites et les ramasser
à l'aide de matières absorbantes non combustibles telles que le sable, la terre, la
vermiculite, la terre à diatomées. Les placer ensuite dans un récipient pour
élimination conformément à la réglementation locale. Élimination par une entreprise
Évitez la dispersion des matériaux déversés, ainsi que leur écoulement et tout
contact avec le sol, les cours d'eau, les égouts et conduits d'évacuation. Informez
les autorités compétentes en cas de pollution de l'environnement (égouts, voies
d'eau, sol et air) par le produit. Matière propre à polluer l’eau. Peut-être nocif pour
l'environnement en cas de déversement de grandes quantités.
Grand déversement
accidentel
:
Arrêter la fuite si cela ne présente aucun risque. Écarter les conteneurs de la zone
de déversement accidentel. Diluer avec de l'eau et éponger si la matière est soluble
dans l'eau. Sinon, ou si la matière est insoluble dans l'eau, absorber avec un
matériau sec inerte et placer dans un conteneur à déchets approprié. Élimination
par une entreprise autorisée de collecte des déchets.
Petit déversement
accidentel
:
6.3 Méthodes et matériel de confinement et de nettoyage
SECTION 6: Mesures à prendre en cas de dispersion accidentelle
6.1 Précautions individuelles, équipement de protection et procédures d’urgence
Pour le personnel autre
que le personnel
d’intervention
:
Pour les agents
d'intervention
:
Aucune initiative ne doit être prise qui implique un risque individuel ou en l’absence
de formation appropriée. Évacuer les environs. Empêcher l'accès aux personnes
non requises et ne portant pas de vêtements de protection. NE PAS TOUCHER ni
marcher dans le produit répandu. Éviter de respirer les vapeurs ou le brouillard.
Assurer une ventilation adéquate. Porter un appareil de protection respiratoire
approprié lorsque le système de ventilation est inadéquat. Porter un équipement de
protection individuelle adapté.
Si des vêtements spécifiques sont nécessaires pour traiter le déversement,
consulter la section 8 pour les matériaux appropriés et inappropriés. Voir également
la section 8 pour plus d'informations sur les mesures d'hygiène.
:
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Conforme au règlement (CE) n° 1907/2006 (REACH), Annexe II - France
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SECTION 6: Mesures à prendre en cas de dispersion accidentelle
autorisée de collecte des déchets. Les matériaux absorbants contaminés peuvent
présenter les mêmes risques que le produit répandu.
6.4 Référence à d’autres
sections
Voir section 1 pour les coordonnées d'urgence.
Voir la section 8 pour toute information sur les équipements de protection
individuelle adaptés.
Voir la section 13 pour toute information supplémentaire sur le traitement des
déchets.
:
Stocker entre les températures suivantes: 2 à 40°C (35.6 à 104°F). Stocker
conformément à la réglementation locale. Stocker dans le récipient d'origine à l'abri
de la lumière directe du soleil dans un endroit sec, frais et bien ventilé à l'écart des
matériaux incompatibles (cf. la section 10). Garder le récipient hermétiquement
fermé lorsque le produit n'est pas utilisé. Les récipients ayant été ouverts doivent
être refermés avec soin et maintenus en position verticale afin d'éviter les fuites. Ne
pas stocker dans des conteneurs non étiquetés. Utiliser un récipient approprié pour
éviter toute contamination du milieu ambiant.
SECTION 7: Manipulation et stockage
Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations
Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition.
7.1 Précautions à prendre pour une manipulation sans danger
Mesures de protection :
Conseils sur l'hygiène
professionnelle en général
:
7.2 Conditions d’un
stockage sûr, y compris
d’éventuelles
incompatibilités
7.3 Utilisations finales spécifiques
Recommandations :
Solutions spécifiques au :
secteur industriel
Non disponible.
Non disponible.
Revêtir un équipement de protection individuelle approprié (voir Section 8). Les
personnes ayant des antécédents de sensibilisation cutanée ne doivent pas
intervenir dans les processus utilisant ce produit. Ne pas mettre en contact avec les
yeux, la peau ou les vêtements. Ne pas ingérer. Éviter de respirer les vapeurs ou le
brouillard. Éviter le rejet dans l'environnement. Consulter les instructions
spéciales/la fiche de données de sécurité. Garder dans le conteneur d'origine ou
dans un autre conteneur de substitution homologué fabriqué à partir d'un matériau
compatible et tenu hermétiquement clos lorsqu'il n'est pas utilisé. Les conteneurs
vides retiennent des résidus de produit et peuvent présenter un danger. Ne pas
réutiliser ce conteneur.
Il est interdit de manger, boire ou fumer dans les endroits où ce produit est
manipulé, entreposé ou mis en oeuvre. Il est recommandé au personnel de se laver
les mains et la figure avant de manger, boire ou fumer. Retirer les vêtements
contaminés et les équipements de protection avant d'entrer dans un lieu de
restauration. Voir également la section 8 pour plus d'informations sur les mesures
d'hygiène.
:
Classe de danger de
stockage Huntsman
Advanced Materials
: Classe de stockage 10, Liquide nocif pour l'ambience
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Procédures de surveillance
recommandées
Limites d'exposition professionnelle
Si ce produit contient des ingrédients présentant des limites d'exposition, il peut
s'avérer nécessaire d'effectuer un examen suivi des personnes, de l'atmosphère sur
le lieu de travail ou des organismes vivants pour déterminer l'efficacité de la
ventilation ou d'autres mesures de contrôle ou évaluer le besoin d'utiliser du matériel
de protection des voies respiratoires. Il importe de vous reporter à la norme
européenne EN 689 concernant les méthodes pour évaluer l'exposition par
inhalation aux agents chimiques et aux documents de politique générale nationaux
relatifs aux méthodes pour déterminer les substances dangereuses.
Protection des mains Le port de gants imperméables et résistants aux produits chimiques conformes à
une norme approuvée, est obligatoire en tout temps lors de la manutention de
produits chimiques si une évaluation des risques le préconise.
Utiliser une protection oculaire conforme à une norme approuvée dès lors qu'une
évaluation du risque indique qu'il est nécessaire d'éviter l'exposition aux projections
de liquides, aux fines particules pulvérisées ou aux poussières.
Protection oculaire/faciale
Aucune valeur de limite d'exposition connue.
:
:
:
Protection de la peau
Contrôles d’ingénierie
appropriés
: Aucune ventilation particulière requise. Une bonne ventilation générale devrait être
suffisante pour contrôler l'exposition du technicien aux contaminants en suspension
dans l'air. Si ce produit contient des composants pour lesquels des contraintes
liées à l'exposition existent, utiliser des enceintes de protection, une ventilation
locale par aspiration, ou d'autres moyens de contrôle automatiques intégrés afin de
maintenir le seuil d'exposition du technicien inférieur aux limites recommandées ou
légales.
Se laver abondamment les mains, les avant-bras et le visage après avoir manipulé
des produits chimiques, avant de manger, de fumer et d'aller aux toilettes ainsi qu'à
la fin de la journée de travail. Il est recommandé d'utiliser les techniques
appropriées pour retirer les vêtements potentiellement contaminés. Les vêtements
de travail contaminés ne devraient pas sortir du lieu de travail. Laver les vêtements
contaminés avant de les réutiliser. S'assurer que les dispositifs rince-oeil
automatiques et les douches de sécurité se trouvent à proximité de l'emplacement
des postes de travail.
8.2 Contrôles de l’exposition
Mesures d'hygiène :
Aucune DEL disponible.
Concentrations prédites avec effet
Aucune PEC disponible.
SECTION 8: Contrôles de l’exposition/protection individuelle
Les informations de cette section contiennent des directives et des conseils généraux. Consulter la liste des Utilisations
Identifiées de la section 1 pour toute information spécifique aux usages disponible dans le(s) scénario(s) d'exposition.
8.1 Paramètres de contrôle
Doses dérivées avec effet
Mesures de protection individuelles
Les limites d'exposition sur la place de travail doivent être dans les normes (poussière totale, poussière de quartz
potentiellement inhalable). Si les limites sont dépassées, portez un masque à poussière approprié.
A T T E N T I O N ! Ce produit contient du quartz, classé par l'IARC parmi les substances carcinogènes pour
l'homme (Groupe 1), pouvant causer une silicose ou un cancer des poumons par inhalation des poussières. Il est
donc important d'éviter de s'exposer à toute inhalation lors des opérations mécaniques effectuées avec le produit fini
(mouture, décapage, coupe...).
QUARTZ (CAS RN 14808-60-7):
France: TWA: 0.1 mg/m³ 8 hour(s). Form: respirable aerosol
Suisse: TWA: 0.15 mg/m³ 8 hour(s). Form: respirable dust
Belgique: TWA: 0.1 mg/m³ 8 hour(s). Form: respirable dust
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SECTION 8: Contrôles de l’exposition/protection individuelle
Lorsque la ventilation du local est insuffisante, porter un équipement de protection
respiratoire. Le choix de l'appareil de protection respiratoire doit être fondé sur les
niveaux d'expositions prévus ou connus, les dangers du produit et les limites
d'utilisation sans danger de l'appareil de protection respiratoire retenu.
Protection respiratoire :
L'équipement de protection personnel pour le corps devra être choisi en fonction de
la tâche à réaliser ainsi que des risques encourus, et il est recommandé de le faire
valider par un spécialiste avant de procéder à la manipulation du produit.
:
Contrôle de l'exposition
de l'environnement
: Il importe de tester les émissions provenant des systèmes de ventilation ou du
matériel de fabrication pour vous assurer qu'elles sont conformes aux exigences de
la législation sur la protection de l'environnement. Dans certains cas, il sera
nécessaire d'équiper le matériel de fabrication d'un épurateur de gaz ou d'un filtre
ou de le modifier techniquement afin de réduire les émissions à des niveaux
acceptables.
Protection corporelle :
Autre protection cutanée Des chaussures adéquates et toutes mesures de protection corporelle devraient
être déterminées en fonction de l'opération effectuée et des risques impliqués, et
devraient être approuvées par un spécialiste avant toute manipulation de ce produit.
Alcool éthylvinylique laminé (EVAL), caoutchouc butyle
néoprène, Matériaux pour gants caoutchouc nitrile
pour utilisation à court
terme/projection (10
min
